TW202143323A - Cutting device capable of reliably replacing a cutting blade to prevent the occurrence of processing defects - Google Patents

Cutting device capable of reliably replacing a cutting blade to prevent the occurrence of processing defects Download PDF

Info

Publication number
TW202143323A
TW202143323A TW110114196A TW110114196A TW202143323A TW 202143323 A TW202143323 A TW 202143323A TW 110114196 A TW110114196 A TW 110114196A TW 110114196 A TW110114196 A TW 110114196A TW 202143323 A TW202143323 A TW 202143323A
Authority
TW
Taiwan
Prior art keywords
cutting
blade
assembly
unit
display
Prior art date
Application number
TW110114196A
Other languages
Chinese (zh)
Inventor
宮田諭
木佐貫誠
齋藤孝廣
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202143323A publication Critical patent/TW202143323A/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/065—Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0064—Devices for the automatic drive or the program control of the machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • B28D5/0094—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work the supporting or holding device being of the vacuum type
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/029—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a plurality of cutting blades
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Dicing (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

The object of the present invention is to provide a cutting device capable of reliably replacing a cutting blade to prevent the occurrence of processing defects. A cutting device includes a cutting assembly that is rotatably provided with a cutting blade for cutting a workpiece, a detection assembly that detects a tip position of the cutting blade, and a display assembly. The display assembly is configured to display a blade replacement screen. The blade replacement screen includes a first display part, a second display part and an end key. The first display part displays an outer diameter and a tip stickout of an unused cutting blade that can be replaced with the cutting blade. The second display part displays a wear amount of the tip of the cutting blade. The end key is configured to end the cutting blade replacement process. When the end key is selected, the tip position of the cutting blade is detected by the detection assembly.

Description

切削裝置Cutting device

本發明是有關於一種切削晶圓等被加工物之切削裝置。The present invention relates to a cutting device for cutting processed objects such as wafers.

可對在被格子狀地配置排列之複數條分割預定線(切割道)所區劃出的區域中各自形成有IC(積體電路，Integrated Circuit)、LSI(大型積體電路，Large Scale Integration)等之器件的晶圓進行分割，藉此製造各自具備器件的複數個器件晶片。此器件晶片可搭載於行動電話、個人電腦等各種電氣機器。It is possible to form IC (Integrated Circuit), LSI (Large Scale Integration), etc., respectively in the area divided by a plurality of planned dividing lines (cutting lanes) arranged in a grid pattern. The device wafers of the devices are divided, thereby manufacturing a plurality of device wafers each equipped with devices. This device chip can be mounted on various electrical equipment such as mobile phones and personal computers.

在晶圓的分割上可使用例如切削裝置。切削裝置具備保持被加工物的保持組件(保持工作台)、及裝設有切削被加工物之環狀的切削刀片的切削組件。可藉由使切削刀片旋轉，並切入被保持組件所保持之被加工物，而切削、分割被加工物。For the division of the wafer, for example, a cutting device can be used. The cutting device is provided with a holding unit (holding table) for holding a workpiece, and a cutting unit equipped with a ring-shaped cutting blade for cutting the workpiece. It is possible to cut and divide the workpiece by rotating the cutting blade and cutting into the workpiece held by the holding component.

又，切削裝置具備有顯示組件與操作面板，前述顯示組件顯示有關於切削加工的各種資訊，前述操作面板用於讓操作人員將預定的資訊輸入切削裝置。例如在專利文獻1中，揭示有一種在操作人員進行操作的位置設置有顯示組件與操作面板之切削裝置。操作人員可藉由一邊參照顯示於顯示組件的資訊一邊操作操作面板，來將加工條件等的資訊輸入切削裝置。 先前技術文獻 專利文獻In addition, the cutting device is provided with a display unit and an operation panel. The display unit displays various information about the cutting process. The operation panel is used for the operator to input predetermined information into the cutting device. For example, Patent Document 1 discloses a cutting device in which a display unit and an operation panel are installed at a position operated by an operator. The operator can input information such as processing conditions into the cutting device by operating the operation panel while referring to the information displayed on the display unit. Prior art literature Patent literature

專利文獻1：日本特開2006-156809號公報Patent Document 1: Japanese Patent Application Publication No. 2006-156809

發明欲解決之課題The problem to be solved by the invention

若持續進行藉由切削刀片所進行之被加工物的切削，在切削刀片的前端部(刀尖)會產生摩耗或缺損。因此，在將切削刀片使用一定期間後，會進行將使用完畢之切削刀片更換為未使用之切削刀片(更換用之切削刀片)的刀片更換作業。If the workpiece is continuously cut by the cutting insert, abrasion or chipping may occur at the tip (tip) of the cutting insert. Therefore, after the cutting insert is used for a certain period of time, an insert replacement operation of replacing the used cutting insert with an unused cutting insert (replacement cutting insert) is performed.

在更換切削刀片時，操作人員一面讓用於進行刀片更換作業的畫面(刀片更換畫面)顯示於顯示組件，一面使用操作面板來輸入未使用之切削刀片的資訊。又，使用完畢之切削刀片的取下與未使用之切削刀片的裝設以手動或自動方式來進行。之後，操作人員藉由選擇包含於刀片更換畫面的結束鍵(確定鍵)，而確定切削刀片的更換處理。When replacing the cutting blade, the operator displays a screen for blade replacement (blade replacement screen) on the display unit, and uses the operation panel to input the information of the unused cutting blade. In addition, the removal of the used cutting blade and the installation of the unused cutting blade are performed manually or automatically. After that, the operator selects the end key (confirm key) included in the blade replacement screen to confirm the cutting blade replacement process.

然而，會有以下情形：在切削裝置的操作中，因各種原因而導致操作人員誤選擇刀片更換畫面的結束鍵。例如，在顯示組件剛使刀片更換畫面顯示於顯示組件後即產生有緊急事態的情況下，會有以下疑慮：操作人員急忙離開該現場來應對處理緊急事態後，在忘記要更換切削刀片的狀態下直接選擇刀片更換畫面的結束鍵。又，會有以下情形：因操作失誤等而無意間將刀片更換畫面顯示於顯示組件的情況下，操作人員為了將刀片更換畫面關閉而錯誤選擇結束鍵。However, there are situations in which the operator mistakenly selects the end button of the blade replacement screen due to various reasons during the operation of the cutting device. For example, if an emergency situation occurs just after the display unit displays the blade replacement screen on the display unit, there will be the following doubts: the operator has hurriedly left the scene to deal with the emergency situation, and forgot to replace the cutting blade. Directly select the end button of the blade replacement screen. In addition, there may be cases where the blade replacement screen is unintentionally displayed on the display unit due to an operation error, etc., and the operator incorrectly selects the end key in order to close the blade replacement screen.

若在未進行切削刀片的更換的狀態下直接選擇結束鍵時，儘管處於切削組件中仍照樣裝設有使用完畢之切削刀片的狀態，切削裝置仍然會以裝設有沒有磨耗或缺損之未使用之切削刀片為前提，來開始被加工物的加工。其結果，恐有以下疑慮：產生切削刀片對被加工物的切入量不足等未如預期地加工被加工物之事態，並發生加工不良。If the end button is directly selected without replacing the cutting insert, even though the cutting assembly is still installed with the used cutting insert, the cutting device will still be installed without wear or defect. The cutting insert is the premise to start the processing of the workpiece. As a result, there may be suspicions that the workpiece may not be processed as expected, such as insufficient cutting amount of the cutting insert into the workpiece, and processing defects may occur.

本發明是有鑒於所述的問題而作成的發明，其目的在於提供一種切削裝置，其可確實地實施切削刀片的更換而防止加工不良的發生。 用以解決課題之手段The present invention was made in view of the above-mentioned problems, and its object is to provide a cutting device that can reliably replace cutting inserts and prevent machining defects from occurring. Means to solve the problem

根據本發明之一態樣，可提供一種切削裝置，前述切削裝置包含以下而構成：保特組件，保持被加工物；切削組件，可旋轉地設置有對藉由該保持組件所保持之該被加工物進行切削之切削刀片；加工進給組件，使該保持組件與該切削組件沿著加工進給方向相對地移動；切入進給組件，使該切削組件沿著切入方向移動；檢測組件，檢測該切削刀片的前端位置；罩蓋，開閉自如且可將配設有該切削組件之加工區域封閉；及顯示組件， 該切削組件包含旋轉軸、可旋轉地支撐該旋轉軸之殼體、及配設於該旋轉軸的前端部且可裝卸自如地裝設該切削刀片之凸緣， 該顯示組件會顯示刀片更換畫面， 該刀片更換畫面包含第一顯示部、第二顯示部及結束鍵，前述第一顯示部顯示可和該切削刀片更換之未使用之切削刀片的外徑及刀尖伸出量，前述第二顯示部顯示該切削刀片的刀尖的消耗量，前述結束鍵使該切削刀片的更換處理結束， 當選擇該結束鍵時，即藉由該檢測組件檢測該切削刀片的前端位置，在已裝設於該切削組件之該切削刀片的外徑對應於顯示在該第一顯示部之該未使用之切削刀片的外徑的情況下，允許該切削刀片的更換；在已裝設於該切削組件之該切削刀片的外徑未對應於顯示在該第一顯示部之該未使用之切削刀片的外徑的情況下，不允許該切削刀片的更換並發出警告。According to one aspect of the present invention, a cutting device can be provided. The cutting device includes the following: a protective component for holding a workpiece; The cutting blade for cutting the workpiece; the processing feed assembly, the holding assembly and the cutting assembly move relatively along the processing feed direction; the cutting-in feed assembly, the cutting assembly moves along the cutting-in direction; the inspection assembly, detection The front end position of the cutting blade; the cover, which can be opened and closed freely and can close the processing area equipped with the cutting assembly; and the display assembly, The cutting assembly includes a rotating shaft, a housing rotatably supporting the rotating shaft, and a flange arranged on the front end of the rotating shaft and detachably installing the cutting blade, The display unit will display the blade replacement screen, The blade replacement screen includes a first display part, a second display part and an end key. The aforementioned first display part displays the outer diameter and tip extension of the unused cutting blade that can be replaced with the cutting blade. The aforementioned second display The section displays the consumption of the cutting tip of the cutting insert, and the aforementioned end key ends the replacement process of the cutting insert. When the end key is selected, the front end position of the cutting insert is detected by the detection assembly, and the outer diameter of the cutting insert installed in the cutting assembly corresponds to the unused one displayed on the first display part. In the case of the outer diameter of the cutting insert, the replacement of the cutting insert is permitted; when the outer diameter of the cutting insert installed in the cutting assembly does not correspond to the outer diameter of the unused cutting insert displayed on the first display part In the case of diameter, the cutting insert is not allowed to be replaced and a warning is issued.

再者，較佳的是，在該第二顯示部所顯示之該消耗量已被備份，該切削裝置即使在已選擇該結束鍵的情況下，仍然可以在該第二顯示部還原該消耗量。又，較佳的是，當在該顯示組件顯示該刀片更換畫面時，即變得可進行該罩蓋的開閉，該切削裝置若不存在該罩蓋曾被打開的資訊而依然選擇該結束鍵時，在藉由該檢測組件檢測該切削刀片的前端位置之前，不允許該切削刀片的更換並發出警告。Furthermore, it is preferable that the consumption amount displayed on the second display part has been backed up, and the cutting device can still restore the consumption amount on the second display part even when the end key has been selected. . Furthermore, it is preferable that when the blade replacement screen is displayed on the display assembly, the cover can be opened and closed, and the cutting device still selects the end button if there is no information that the cover has been opened. When the detection component detects the front end position of the cutting insert, the cutting insert is not allowed to be replaced and a warning is issued.

又，依據本發明的其他的一個態樣，可提供一種切削裝置，前述切削裝置包含以下而構成：保持組件，保持被加工物；切削組件，可旋轉地設置有對藉由該保持組件所保持之該被加工物進行切削之切削刀片；加工進給組件，使該保持組件與該切削組件沿著加工進給方向相對地移動；切入進給組件，使該切削組件沿著切入方向移動；罩蓋，開閉自如且可將配設有該切削組件之加工區域封閉；及顯示組件， 該切削組件包含旋轉軸、可旋轉地支撐該旋轉軸之殼體、及配設在該旋轉軸的前端部且可裝卸自如地裝設切削刀片之凸緣， 該顯示組件會顯示刀片更換畫面， 該刀片更換畫面包含第一顯示部、第二顯示部及結束鍵，前述第一顯示部顯示可和該切削刀片更換之未使用之切削刀片的外徑及刀尖伸出量，前述第二顯示部顯示該切削刀片的刀尖的消耗量，前述結束鍵使該切削刀片的更換處理結束， 當在該顯示組件顯示該刀片更換畫面時，即變得可進行該罩蓋的開閉，若不存在該罩蓋曾被打開之資訊而依然選擇該結束鍵時，不允許該切削刀片的更換並發出警告。 發明效果In addition, according to another aspect of the present invention, a cutting device can be provided. The cutting device includes the following: a holding assembly that holds the workpiece; and the cutting assembly is rotatably provided with a pair held by the holding assembly The cutting blade for cutting the workpiece; the processing feed assembly, which makes the holding assembly and the cutting assembly move relatively along the processing feed direction; the cutting feed assembly, which makes the cutting assembly move along the cutting direction; cover The cover can be opened and closed freely and can close the processing area equipped with the cutting assembly; and the display assembly, The cutting assembly includes a rotating shaft, a housing rotatably supporting the rotating shaft, and a flange arranged at the front end of the rotating shaft and detachably installed with a cutting blade, The display unit will display the blade replacement screen, The blade replacement screen includes a first display part, a second display part and an end key. The aforementioned first display part displays the outer diameter and tip extension of the unused cutting blade that can be replaced with the cutting blade. The aforementioned second display The section displays the consumption of the cutting tip of the cutting insert, and the aforementioned end key ends the replacement process of the cutting insert. When the blade replacement screen is displayed on the display assembly, the cover can be opened and closed. If there is no information that the cover has been opened and the end button is still selected, the cutting blade replacement is not allowed and warning. Invention effect

在本發明之一態樣的切削裝置中，在已裝設於切削組件之切削刀片的外徑未對應於未使用之切削刀片的外徑的情況下、或者不存在將切削組件封閉之罩蓋曾被打開之資訊的情況下，即使選擇刀片更換畫面的結束鍵，也不會允許切削刀片的更換，並會發出警告。因此，可防止無意間以使用完畢之切削刀片來加工被加工物之情形，並且可以讓操作人員容易地辨識未正確地進行切削刀片的更換之意旨。藉此，變得可確實地實施切削刀片的更換，而防止加工不良的發生。In the cutting device of one aspect of the present invention, when the outer diameter of the cutting insert installed in the cutting assembly does not correspond to the outer diameter of the unused cutting insert, or there is no cover to close the cutting assembly In the case of the information that has been opened, even if the end button of the blade replacement screen is selected, the replacement of the cutting blade will not be allowed, and a warning will be issued. Therefore, it is possible to prevent the inadvertent use of the used cutting insert to process the workpiece, and it is possible for the operator to easily recognize the intention of incorrectly replacing the cutting insert. Thereby, it becomes possible to reliably perform the replacement of the cutting insert, and to prevent the occurrence of processing defects.

用以實施發明之形態The form used to implement the invention

以下，參照附加圖式來說明本發明的一態樣的實施形態。首先，說明本實施形態之切削裝置的構成例。圖1是顯示切削裝置2的立體圖。Hereinafter, an embodiment of the present invention will be described with reference to the attached drawings. First, a configuration example of the cutting device of this embodiment will be described. FIG. 1 is a perspective view showing the cutting device 2.

切削裝置2具備基台4，前述基台4支撐構成切削裝置2之各構成要素。在基台4的前方的角部形成有開口4a，在此開口4a設置有藉由升降機構(未圖示)而沿著Z軸方向(切入方向、鉛直方向、上下方向)移動之片匣支撐台6。在此片匣支撐台6上搭載有片匣8，前述片匣8可容置可被切削裝置2施行切削加工的複數個被加工物11。再者，在圖1中是以虛線表示片匣8的輪廓。The cutting device 2 includes a base 4, and the aforementioned base 4 supports each component constituting the cutting device 2. An opening 4a is formed in the front corner of the base 4, and the opening 4a is provided with a cassette support that moves along the Z-axis direction (cutting direction, vertical direction, vertical direction) by a lifting mechanism (not shown) Table 6. A cassette 8 is mounted on the cassette support 6, and the cassette 8 can accommodate a plurality of workpieces 11 that can be cut by the cutting device 2. Furthermore, in FIG. 1, the outline of the cassette 8 is shown by a broken line.

例如被加工物11具備以矽等所構成之圓盤狀的晶圓13。晶圓13被格子狀地配置排列成互相交叉之複數條分割預定線(切割道)區劃成複數個區域。又，在此複數個區域的正面側分別形成有IC、LSI等器件。當藉由切削裝置2沿著分割預定線來切削並分割晶圓13時，可得到各自具備器件的複數個器件晶片。For example, the workpiece 11 includes a disc-shaped wafer 13 made of silicon or the like. The wafer 13 is divided into a plurality of regions by a plurality of planned dividing lines (dicing lanes) arranged in a grid pattern that intersect each other. In addition, devices such as ICs and LSIs are formed on the front side of the plurality of regions, respectively. When the wafer 13 is cut and divided along the planned dividing line by the cutting device 2, a plurality of device wafers each equipped with a device can be obtained.

於晶圓13的背面側貼附有圓形的膠帶(切割膠帶)15，前述圓形的膠帶15是以樹脂等所構成且直徑比晶圓13更大。又，在膠帶15的外周部貼附有環狀的框架17，前述環狀的框架17是以金屬等所構成，且於中央部具備直徑比晶圓13更大的圓形的開口。藉此，可透過膠帶15而藉由框架17來支撐晶圓13。亦即，圖1所示之被加工物11是包含晶圓13、膠帶15及框架17之框架單元。A circular tape (dicing tape) 15 is attached to the back side of the wafer 13. The circular tape 15 is made of resin or the like and has a larger diameter than the wafer 13. In addition, a ring-shaped frame 17 is attached to the outer periphery of the tape 15. The ring-shaped frame 17 is made of metal or the like and has a circular opening with a larger diameter than the wafer 13 in the center. Thereby, the wafer 13 can be supported by the frame 17 through the tape 15. That is, the to-be-processed object 11 shown in FIG. 1 is a frame unit including the wafer 13, the tape 15 and the frame 17.

但是，對要被切削裝置2所加工之被加工物11的種類、材質、形狀、構造、大小等並無限制。例如被加工物11亦可具備以矽以外的半導體(砷化鎵(GaAs)、磷化銦(InP)、氮化鎵(GaN)、碳化矽(SiC)等)、玻璃、陶瓷、樹脂、金屬等所構成的晶圓13。又，對形成於晶圓13之器件的種類、數量、形狀、構造、大小、配置等也沒有限制，且在晶圓13上亦可未形成有器件。However, there are no restrictions on the type, material, shape, structure, size, etc. of the workpiece 11 to be processed by the cutting device 2. For example, the workpiece 11 may be equipped with semiconductors other than silicon (gallium arsenide (GaAs), indium phosphide (InP), gallium nitride (GaN), silicon carbide (SiC), etc.), glass, ceramics, resin, metal Etc. constituted by the wafer 13. In addition, there are no restrictions on the type, number, shape, structure, size, arrangement, etc. of the devices formed on the wafer 13, and the devices may not be formed on the wafer 13.

又，被加工物11亦可具備有未受到框架17支撐的晶圓13、或是未貼附有膠帶15的晶圓13。此外，被加工物11亦可為CSP(晶片尺寸封裝，Chip Size Package)基板、QFN(方形扁平無引線封裝，Quad Flat Non-leaded package)基板等的封裝基板。In addition, the workpiece 11 may include a wafer 13 that is not supported by the frame 17 or a wafer 13 to which the tape 15 is not attached. In addition, the processed object 11 may also be a package substrate such as a CSP (Chip Size Package) substrate, a QFN (Quad Flat Non-leaded package) substrate, or the like.

在開口4a的後方，設置有進行被加工物11之從片匣8的搬出、及被加工物11之往片匣8的搬入之搬送組件(搬送單元)10。搬送組件10藉由可沿著Y軸方向(分度進給方向、前後方向)移動的搬送機構所構成。又，搬送組件10之位於開口4a側(片匣8側)的端部設置有把持被加工物11(例如框架17)的端部之把持部10a。Behind the opening 4a, there is provided a transport unit (transport unit) 10 for carrying out the workpiece 11 from the cassette 8 and carrying the workpiece 11 into the cassette 8. The conveying unit 10 is constituted by a conveying mechanism that can move in the Y-axis direction (the indexing feed direction, the front-rear direction). In addition, the end portion of the conveying unit 10 on the side of the opening 4a (the cassette 8 side) is provided with a gripping portion 10a that grips the end portion of the workpiece 11 (for example, the frame 17).

在開口4a與搬送組件10之間，設置有暫置區域12，前述暫置區域12可供已從片匣8搬出之被加工物11或要搬入片匣8之被加工物11暫置。在此暫置區域12設置有沿著Y軸方向互相大致平行地配置的一對導軌14。一對導軌14以沿著X軸方向(加工進給方向、左右方向)互相接近及遠離的方式移動，而將被加工物11夾入並進行被加工物11的對位。A temporary storage area 12 is provided between the opening 4 a and the conveying assembly 10. The temporary storage area 12 can be used for temporarily storing the processed objects 11 that have been transported out of the cassette 8 or the processed objects 11 that are to be transported into the cassette 8. The temporary area 12 is provided with a pair of guide rails 14 arranged substantially parallel to each other along the Y-axis direction. The pair of guide rails 14 move so as to approach and move away from each other along the X-axis direction (processing feed direction, left-right direction), sandwich the workpiece 11 and align the workpiece 11.

暫置區域12的附近，設置有搬送被加工物11的搬送組件(搬送單元)16。例如可藉由具備有吸引保持被加工物11的上表面側(例如框架17的上表面側)之吸引墊的搬送機構來構成搬送組件16。In the vicinity of the temporary storage area 12, a transport unit (transport unit) 16 that transports the workpiece 11 is provided. For example, the conveying unit 16 can be constituted by a conveying mechanism provided with a suction pad that sucks and holds the upper surface side of the workpiece 11 (for example, the upper surface side of the frame 17).

於開口4a的側邊，形成有長邊方向沿著X軸方向之矩形狀的開口4b。在此開口4b的內部，設置有加工進給組件(第1移動單元)18、及覆蓋加工進給組件18的一部分之防塵防滴罩蓋20。加工進給組件18是以例如滾珠螺桿式的移動機構所構成，且具備有上表面從防塵防滴罩蓋20露出之移動工作台18a。On the side of the opening 4a, a rectangular opening 4b whose longitudinal direction is along the X-axis direction is formed. Inside the opening 4b, a processing feed assembly (first moving unit) 18 and a dust-proof and drip-proof cover 20 covering a part of the processing feed assembly 18 are provided. The processing feed assembly 18 is composed of, for example, a ball screw type moving mechanism, and is provided with a moving table 18a whose upper surface is exposed from the dust-proof and drip-proof cover 20.

在移動工作台18a設置有保持被加工物11之保持組件(保持工作台)22。保持組件22的上表面構成有保持被加工物11之保持面22a。保持面22a透過已形成在保持組件22的內部的吸引路(未圖示)而連接到噴射器(ejector)等的吸引源(未圖示)。又，在保持組件22的周圍設置有把持並固定被加工物11的端部(例如框架17)的複數個夾具24。The moving table 18a is provided with a holding unit (holding table) 22 that holds the object 11 to be processed. The upper surface of the holding unit 22 constitutes a holding surface 22 a for holding the workpiece 11. The holding surface 22a is connected to a suction source (not shown) such as an ejector through a suction path (not shown) formed in the inside of the holding unit 22. In addition, a plurality of clamps 24 for holding and fixing the end (for example, frame 17) of the workpiece 11 are provided around the holding unit 22.

加工進給組件18使保持組件22與移動工作台18a一起沿著X軸方向移動。並且，保持組件22可藉由加工進給組件18而定位到進行被加工物11的搬送之搬送區域A、及進行被加工物11的加工之加工區域B。又，在保持組件22連接有馬達等的旋轉驅動源(未圖示)，此旋轉驅動源使保持組件22以繞著大致平行於Z軸方向的旋轉軸的方式旋轉。The machining feed unit 18 moves the holding unit 22 along the X-axis direction together with the moving table 18a. In addition, the holding unit 22 can be positioned by the processing feed unit 18 in the conveying area A where the workpiece 11 is transported and the processing area B where the processing of the workpiece 11 is performed. Furthermore, a rotational drive source (not shown) such as a motor is connected to the holding assembly 22, and this rotational drive source rotates the holding assembly 22 around a rotation axis substantially parallel to the Z-axis direction.

在加工區域B設置有切削藉由保持組件22所保持之被加工物11的切削組件(切削單元)26。切削組件26可旋轉地設置切削被加工物11之環狀的切削刀片40。又，於切削組件26連接有使切削組件26沿著Y軸方向及Z軸方向移動之切入進給組件(第2移動單元)28。例如可藉由滾珠螺桿式的移動機構來構成切入進給組件28，前述滾珠螺桿式的移動機構具備有沿著Y軸方向的Y軸滾珠螺桿、及沿著Z軸方向的Z軸滾珠螺桿。A cutting unit (cutting unit) 26 for cutting the workpiece 11 held by the holding unit 22 is provided in the processing area B. The cutting assembly 26 is rotatably provided with a ring-shaped cutting blade 40 for cutting the workpiece 11. Moreover, the cutting unit 26 is connected with the cutting-in feed unit (2nd moving unit) 28 which moves the cutting unit 26 along the Y-axis direction and the Z-axis direction. For example, the cutting feed assembly 28 may be constituted by a ball screw type moving mechanism including a Y-axis ball screw along the Y-axis direction and a Z-axis ball screw along the Z-axis direction.

圖2(A)是顯示切削組件26的立體圖。切削組件26具備圓筒狀的殼體30，在此殼體30容置有圓筒狀的旋轉軸(主軸)32。旋轉軸32藉由殼體30而可旋轉地被支撐，且旋轉軸32的前端部(一端側)露出於殼體30的外部。FIG. 2(A) is a perspective view showing the cutting assembly 26. The cutting unit 26 includes a cylindrical housing 30 in which a cylindrical rotating shaft (spindle) 32 is accommodated. The rotating shaft 32 is rotatably supported by the housing 30, and the front end (one end side) of the rotating shaft 32 is exposed to the outside of the housing 30.

於旋轉軸32的前端部配設有支撐切削刀片40的凸緣(安裝座)34。又，在旋轉軸32的基端部(另一端側)連結有使旋轉軸32旋轉的馬達等的旋轉驅動源(未圖示)。A flange (mounting seat) 34 that supports the cutting insert 40 is arranged at the front end of the rotating shaft 32. In addition, a rotation drive source (not shown) such as a motor that rotates the rotation shaft 32 is connected to the base end portion (the other end side) of the rotation shaft 32.

凸緣34具備圓盤狀的凸緣部36、與從凸緣部36的正面36a的中央部突出之圓筒狀的支撐軸38。於凸緣部36的外周部的正面36a側設置有從正面36a突出之環狀的凸部36b。再者，凸部36b的前端面形成為與正面36a大致平行。又，在支撐軸38的外周面形成有螺絲部38a。The flange 34 includes a disk-shaped flange portion 36 and a cylindrical support shaft 38 protruding from the center portion of the front surface 36 a of the flange portion 36. An annular convex portion 36b protruding from the front surface 36a is provided on the front surface 36a side of the outer peripheral portion of the flange portion 36. Moreover, the front end surface of the convex part 36b is formed so that it may become substantially parallel to the front surface 36a. In addition, a screw portion 38 a is formed on the outer peripheral surface of the support shaft 38.

在凸緣34裝卸自如地裝設有對被加工物11進行切削之環狀的切削刀片40。切削刀片40具備以金屬等所構成之環狀的基台42、及沿著基台42的外緣部而形成之環狀的切刃44。在基台42的中央部設置有在厚度方向上貫通基台42之圓形的開口42a。又，在基台42的開口42a的周圍，形成有朝基台42的厚度方向突出之環狀的把持部42b。例如，操作人員會握持把持部42b來將切削刀片40裝設於凸緣34。A ring-shaped cutting insert 40 for cutting the workpiece 11 is detachably attached to the flange 34. The cutting insert 40 includes an annular base 42 made of metal or the like, and an annular cutting edge 44 formed along the outer edge of the base 42. A circular opening 42a penetrating the base 42 in the thickness direction is provided in the center of the base 42. In addition, around the opening 42 a of the base 42, an annular gripping portion 42 b protruding in the thickness direction of the base 42 is formed. For example, the operator will hold the gripping portion 42b to install the cutting insert 40 on the flange 34.

切刃44形成為從基台42的外周緣朝向基台42的半徑方向外側突出。自基台42的外周緣起之切刃44的突出量(刀尖伸出量)可因應於切削刀片40的規格而適當調整。例如切刃44可藉由以鎳鍍敷等的結合材來固定以鑽石等所構成之磨粒而形成。The cutting edge 44 is formed to protrude from the outer peripheral edge of the base 42 toward the radially outer side of the base 42. The protruding amount of the cutting edge 44 from the outer periphery of the base 42 (the protruding amount of the cutting edge) can be appropriately adjusted according to the specifications of the cutting insert 40. For example, the cutting edge 44 can be formed by fixing abrasive grains made of diamonds or the like with a bonding material such as nickel plating.

但是，對切刃44的磨粒及結合材的材質並無限制，可因應於被加工物11的材質或加工內容等來適當選擇。又，在圖2(A)中，雖然所顯示的是基台42及切刃44成為一體而構成之輪轂型的切削刀片40，但是亦可使用由將磨粒藉由金屬、陶瓷、樹脂等所構成之結合材來固定之環狀的切刃所構成之墊圈型的切削刀片。However, the material of the abrasive grains and bonding material of the cutting blade 44 is not limited, and can be appropriately selected in accordance with the material of the workpiece 11 or the processing content. In addition, in FIG. 2(A), although the hub-shaped cutting insert 40 is shown in which the base 42 and the cutting edge 44 are integrated, it is also possible to use abrasive particles made of metal, ceramic, resin, etc. It is a washer-type cutting insert composed of a ring-shaped cutting edge fixed by a bonding material.

於支撐軸38的螺絲部38a可供用於固定切削刀片40之環狀的固定螺帽46緊固。在固定螺帽46的中央部形成有對應於支撐軸38的直徑之圓形的開口46a，且在此開口46a形成有對應於支撐軸38的螺絲部38a之螺紋溝。The screw portion 38a of the supporting shaft 38 can be used for fastening the annular fixing nut 46 for fixing the cutting insert 40. A circular opening 46a corresponding to the diameter of the support shaft 38 is formed in the center of the fixing nut 46, and a thread groove corresponding to the screw portion 38a of the support shaft 38 is formed in the opening 46a.

可將切削刀片40以對基台42的開口42a***支撐軸38的方式來裝設於凸緣34。當在此狀態下將固定螺帽46螺合並鎖緊於支撐軸38的螺絲部38a時，即可藉由凸緣部36的凸部36b的前端面與固定螺帽46來夾持切削刀片40。再者，藉由將已鎖緊於支撐軸38之固定螺帽46取下，而變得可將已裝設於凸緣部36的切削刀片40取下。像這樣，可將切削刀片40裝卸自如地裝設在旋轉軸32的前端部(凸緣34)。The cutting insert 40 may be installed on the flange 34 by inserting the support shaft 38 into the opening 42 a of the base 42. When the fixing nut 46 is screwed and locked to the screw portion 38a of the support shaft 38 in this state, the cutting insert 40 can be clamped by the front end surface of the convex portion 36b of the flange portion 36 and the fixing nut 46 . Furthermore, by removing the fixing nut 46 that has been locked to the support shaft 38, the cutting insert 40 installed on the flange portion 36 can be removed. In this way, the cutting insert 40 can be detachably attached to the front end portion (the flange 34) of the rotating shaft 32.

圖2(B)是顯示裝設有刀片罩蓋48的切削組件26的立體圖。如圖2(B)所示，於殼體30的前端部固定有形成為長方體形之刀片罩蓋48，且已裝設於切削組件26的切削刀片40會被刀片罩蓋48所覆蓋。FIG. 2(B) is a perspective view showing the cutting assembly 26 with the blade cover 48 installed. As shown in FIG. 2(B), a rectangular parallelepiped blade cover 48 is fixed to the front end of the housing 30, and the cutting blade 40 installed in the cutting assembly 26 is covered by the blade cover 48.

刀片罩蓋48具備供給切削液的管件50、及連接於管件50且朝向切削刀片40的背面側開口之噴嘴52。又，可在刀片罩蓋48之前表面側裝設裝卸罩蓋54，並在刀片罩蓋48的上表面側裝設裝卸罩蓋62。可藉由刀片罩蓋48及裝卸罩蓋54、62，覆蓋切削刀片40的上部。The blade cover 48 includes a tube 50 for supplying cutting fluid, and a nozzle 52 connected to the tube 50 and opened toward the back side of the cutting blade 40. In addition, a removable cover 54 can be attached to the front surface side of the blade cover 48, and a removable cover 62 can be mounted on the upper surface side of the blade cover 48. The upper part of the cutting blade 40 can be covered by the blade cover 48 and the attachment and detachment covers 54 and 62.

裝卸罩蓋54具備供給切削液之管件56、及連接於管件56之噴嘴58。噴嘴58設置成在將裝卸罩蓋54裝設於刀片罩蓋48時，朝向切削刀片40的正面側開口。可藉由將螺絲60***形成於裝卸罩蓋54的圓孔54a並螺入到形成於刀片罩蓋48的螺孔48a，來將裝卸罩蓋54固定於刀片罩蓋48。The attachment and detachment cover 54 includes a pipe 56 for supplying cutting fluid and a nozzle 58 connected to the pipe 56. The nozzle 58 is provided so as to open toward the front side of the cutting insert 40 when the attachment and detachment cover 54 is attached to the blade cover 48. The attachment and detachment cover 54 can be fixed to the blade cover 48 by inserting the screw 60 into the round hole 54 a formed in the attachment and detachment cover 54 and screwed into the screw hole 48 a formed in the blade cover 48.

又，可藉由將螺絲64***形成於裝卸罩蓋62的圓孔62a並螺入到形成於刀片罩蓋48的螺孔48b，來將裝卸罩蓋62固定於刀片罩蓋48。再者，在裝卸罩蓋62的內側亦可設置有照射用於修整切削刀片40的雷射光束之雷射照射組件(雷射照射單元)。In addition, the attachment and detachment cover 62 can be fixed to the blade cover 48 by inserting the screw 64 into the circular hole 62 a formed in the attachment and detachment cover 62 and screwed into the screw hole 48 b formed in the blade cover 48. Furthermore, a laser irradiation assembly (laser irradiation unit) for irradiating a laser beam for trimming the cutting blade 40 may also be provided on the inner side of the attaching and detaching cover 62.

在藉由切削組件26切削被加工物11時，可將純水等的切削液供給到管件50、56。此切削液可透過噴嘴52、58而供給至切削刀片40的正、背面側。藉此，可將被加工物11及切削刀片40冷卻，並且將因切削所產生之雜屑(切削屑)沖洗掉。When the workpiece 11 is cut by the cutting unit 26, cutting fluid such as pure water can be supplied to the pipes 50 and 56. This cutting fluid can be supplied to the front and back sides of the cutting insert 40 through the nozzles 52 and 58. Thereby, the workpiece 11 and the cutting insert 40 can be cooled, and the debris (cutting chips) generated by the cutting can be washed away.

如圖1所示，在和保持組件22之移動路徑(搬送區域A與加工區域B之間)重疊的位置上，設置有拍攝組件(拍攝單元)66。拍攝組件66藉由相機等所構成，並對被保持組件22所保持之被加工物11進行拍攝。可依據藉由拍攝組件66所取得的圖像，來進行被加工物11與切削組件26的對位等。As shown in FIG. 1, an imaging unit (imaging unit) 66 is provided at a position overlapping with the movement path of the holding unit 22 (between the conveying area A and the processing area B). The imaging unit 66 is constituted by a camera or the like, and takes an image of the workpiece 11 held by the holding unit 22. Based on the image obtained by the imaging unit 66, the workpiece 11 and the cutting unit 26 can be aligned.

又，在切削組件26的附近(例如移動工作台18a上)設置有檢測已裝設於切削組件26之切削刀片40的前端位置的檢測組件(檢測單元)68。可以依據藉由檢測組件68所檢測出的切削刀片40的前端位置，來特定切削刀片40的外徑。In addition, a detection module (detection unit) 68 for detecting the position of the tip of the cutting insert 40 installed in the cutting module 26 is provided in the vicinity of the cutting module 26 (for example, on the moving table 18a). The outer diameter of the cutting insert 40 can be specified based on the position of the front end of the cutting insert 40 detected by the detection unit 68.

圖3是顯示檢測組件68的側面圖。例如檢測組件68具備在上表面側形成有凹部70a之長方體形的基台70。在此凹部70a設置有互相相向之投光部72a與受光部72b。FIG. 3 is a side view showing the detection assembly 68. As shown in FIG. For example, the detection unit 68 includes a rectangular parallelepiped base 70 in which a recess 70a is formed on the upper surface side. The recessed portion 70a is provided with a light projecting portion 72a and a light receiving portion 72b facing each other.

例如投光部72a可透過光纖等而連接於LED(發光二極體，Light Emitting Diode)等之光源(未圖示)，且朝向受光部72b照射光。並且，從投光部72a所照射之光可被受光部72b接收。例如受光部72b透過光纖等而連接於包含光電轉換元件而構成之光電轉換部(未圖示)。並且，可將對應於受光部72b的受光量之電氣訊號(電壓)藉由光電轉換部來生成，並輸入後述之控制部88(參照圖1)。For example, the light projecting part 72a can be connected to a light source (not shown) such as an LED (Light Emitting Diode) through an optical fiber or the like, and emit light toward the light receiving part 72b. In addition, the light irradiated from the light projecting part 72a can be received by the light receiving part 72b. For example, the light receiving unit 72b is connected to a photoelectric conversion unit (not shown) including a photoelectric conversion element through an optical fiber or the like. In addition, an electrical signal (voltage) corresponding to the amount of light received by the light receiving unit 72b can be generated by the photoelectric conversion unit and input to the control unit 88 (refer to FIG. 1) described later.

在移動工作台18a(參照圖1)上設置有檢測組件68的情況下，可藉由加工進給組件18來控制檢測組件68的X軸方向上的位置。並且，在將切削組件26與檢測組件68配置成切削刀片40的切刃44和投光部72a與受光部72b之間的區域重疊的狀態下，若藉由切入進給組件28使切削組件26下降，即可將切削刀片40的前端部(刀尖)***投光部72a與受光部72b之間。When the detection unit 68 is provided on the moving table 18a (refer to FIG. 1), the position of the detection unit 68 in the X-axis direction can be controlled by the processing feed unit 18. In addition, in a state where the cutting unit 26 and the detection unit 68 are arranged so that the cutting edge 44 of the cutting insert 40 and the area between the light emitting portion 72a and the light receiving portion 72b overlap, if the cutting unit 26 is moved by the cutting feed unit 28 By lowering, the tip portion (tip) of the cutting insert 40 can be inserted between the light projecting portion 72a and the light receiving portion 72b.

當切削組件26下降到預定的高度位置時，從投光部72a朝向受光部72b之光會被切削刀片40的前端部所擋住，而使受光部72b的受光量減少。並且，受光量已減少時之切削組件26的高度位置，會因應於切削刀片40的外徑(切刃44的外徑)而不同。因此，可以藉由一面使切削組件26下降一面監控受光部72b的受光量與切削組件26的高度位置，來特定切削刀片40的外徑。When the cutting assembly 26 is lowered to a predetermined height position, the light from the light projecting portion 72a to the light receiving portion 72b is blocked by the tip of the cutting insert 40, and the amount of light received by the light receiving portion 72b is reduced. In addition, the height position of the cutting assembly 26 when the amount of received light has been reduced varies according to the outer diameter of the cutting insert 40 (the outer diameter of the cutting edge 44). Therefore, the outer diameter of the cutting insert 40 can be specified by lowering the cutting assembly 26 and monitoring the light receiving amount of the light receiving portion 72b and the height position of the cutting assembly 26.

如圖1所示，在保持組件22的後方，設置有洗淨被加工物11之洗淨組件(洗淨單元)74。例如洗淨組件74具備保持被加工物11的旋轉工作台、及朝向被旋轉工作台所保持之被加工物11供給純水等的洗淨液之噴嘴。又，在洗淨組件74的上方設置有在保持組件22與洗淨組件74之間搬送被加工物11之搬送組件(搬送單元)76。例如可藉由具備有吸引保持被加工物11的上表面側(例如框架17的上表面側)之吸引墊的搬送機構來構成搬送組件76。As shown in Fig. 1, behind the holding unit 22, a washing unit (washing unit) 74 for washing the workpiece 11 is provided. For example, the cleaning unit 74 includes a rotating table that holds the workpiece 11, and a nozzle that supplies a cleaning solution such as pure water to the workpiece 11 held by the rotating table. In addition, above the washing unit 74, a conveying unit (conveying unit) 76 for conveying the workpiece 11 between the holding unit 22 and the washing unit 74 is provided. For example, the conveying unit 76 can be constituted by a conveying mechanism provided with a suction pad that sucks and holds the upper surface side of the workpiece 11 (for example, the upper surface side of the frame 17).

又，在設置於加工區域B的後方之支撐台78上設置有顯示組件(顯示部、顯示單元)80，前述顯示組件80會顯示有關於藉由切削裝置2所進行之切削加工的各種資訊(加工條件等)、或藉由拍攝組件66所取得的圖像等。此外，於基台4的前表面側設置有用於讓操作人員將各種資訊(加工條件等)輸入到切削裝置2之輸入組件(輸入部、輸入單元)82。In addition, a display unit (display unit, display unit) 80 is installed on the support table 78 arranged at the rear of the processing area B. The aforementioned display unit 80 displays various information about the cutting process performed by the cutting device 2 ( Processing conditions, etc.), or images obtained by the imaging device 66, etc. In addition, an input unit (input unit, input unit) 82 for allowing the operator to input various information (processing conditions, etc.) into the cutting device 2 is provided on the front surface side of the base 4.

例如，可使用各種顯示器來作為顯示組件80，可使用具備複數個操作鍵之操作面板來作為輸入組件82。但是，切削裝置2亦可具備有成為使用者介面之觸控面板。在此情況下，觸控面板作為顯示組件80及輸入組件82而發揮功能，且操作人員可以藉由觸控面板的觸控操作來輸入資訊。For example, various displays can be used as the display unit 80, and an operation panel provided with a plurality of operation keys can be used as the input unit 82. However, the cutting device 2 may also be provided with a touch panel as a user interface. In this case, the touch panel functions as the display component 80 and the input component 82, and the operator can input information through the touch operation of the touch panel.

又，在基台4上設置有覆蓋基台4的上表面側的框體84。並且，於支撐台78或框體84安裝有覆蓋切削裝置2的構成要素之開閉自如的罩蓋。In addition, a frame 84 covering the upper surface side of the base 4 is provided on the base 4. In addition, a cover that can be opened and closed to cover the constituent elements of the cutting device 2 is attached to the support 78 or the frame 84.

例如，可在支撐台78或框體84固定罩蓋86a、罩蓋86b及罩蓋86c，前述罩蓋86a將已載置在片匣支撐台6之片匣8封閉，前述罩蓋86b將搬送區域A封閉，前述罩蓋86c將配設有切削組件26之加工區域B封閉。在圖1中，是以二點鏈線表示罩蓋86a、86b、86c之輪廓。被加工物11的加工中，罩蓋86a、86b、86c各自以關閉的狀態被鎖定，並且可因應於需要而藉由操作人員來開閉。For example, the cover 86a, the cover 86b, and the cover 86c can be fixed to the support 78 or the frame 84. The cover 86a closes the cassette 8 placed on the cassette support 6, and the cover 86b will transport The area A is closed, and the aforementioned cover 86c closes the processing area B where the cutting assembly 26 is provided. In Fig. 1, the outlines of the covers 86a, 86b, and 86c are shown by a two-dot chain line. During the processing of the workpiece 11, the covers 86a, 86b, and 86c are each locked in a closed state, and can be opened and closed by an operator according to needs.

可將構成切削裝置2之各構成要素(片匣支撐台6、搬送組件10、導軌14、搬送組件16、加工進給組件18、保持組件22、夾具24、切削組件26、切入進給組件28、拍攝組件66、檢測組件68、洗淨組件74、搬送組件76、顯示組件80、輸入組件82等)連接到控制部(控制組件、控制單元)88。控制部88會控制切削裝置2的各構成要素的動作。The various components that constitute the cutting device 2 (the cassette support 6, the conveying unit 10, the guide rail 14, the conveying unit 16, the processing feed unit 18, the holding unit 22, the clamp 24, the cutting unit 26, the cutting feed unit 28 , The imaging unit 66, the detection unit 68, the washing unit 74, the conveying unit 76, the display unit 80, the input unit 82, etc.) are connected to the control unit (control unit, control unit) 88. The control unit 88 controls the operation of each component of the cutting device 2.

例如控制部88藉由電腦所構成。具體而言，控制部88具備處理部與記憶部，前述處理部進行在切削裝置2的運轉上必要的運算等的處理，前述記憶部可記憶使用於由處理部所進行之處理的各種資訊(資料、程式等)。處理部包含例如CPU(中央處理單元，Central Processing Unit)等的處理器而構成。又，記憶部藉由ROM(唯讀記憶體，Read Only Memory)、RAM(隨機存取記憶體，Random Access Memory)等之記憶體而構成。處理部與記憶部透過匯流排而互相連接。再者，控制部88的構成及功能的詳細內容，容後敘述。For example, the control unit 88 is constituted by a computer. Specifically, the control unit 88 includes a processing unit and a storage unit. The processing unit performs processing such as calculations necessary for the operation of the cutting device 2, and the storage unit can store various information used in the processing performed by the processing unit ( Data, programs, etc.). The processing unit includes, for example, a processor such as a CPU (Central Processing Unit). In addition, the memory unit is constituted by memories such as ROM (Read Only Memory), RAM (Random Access Memory), and the like. The processing part and the memory part are connected to each other through a bus. In addition, the detailed content of the structure and function of the control part 88 is mentioned later.

在加工被加工物11時，首先是以搬送組件10的把持部10a把持已容置於片匣8的一個被加工物11的端部(例如框架17)。若在此狀態下使搬送組件10沿著Y軸方向朝後方移動，即可將被加工物11從片匣8拉出，並配置到一對導軌14上。When processing the workpiece 11, first, the end portion (for example, the frame 17) of the workpiece 11 accommodated in the cassette 8 is held by the gripping portion 10a of the transport assembly 10. In this state, if the conveying unit 10 is moved backward along the Y-axis direction, the workpiece 11 can be pulled out of the cassette 8 and arranged on the pair of guide rails 14.

一對導軌14在從下側支撐有被加工物11(例如框架17)的狀態下，以互相接近的方式沿著X軸方向移動。藉此，被加工物11被一對導軌14所夾住，而可進行被加工物11的對位。之後，被加工物11被搬送組件16所吸引保持，且搬送至保持組件22上。The pair of guide rails 14 move in the X-axis direction so as to approach each other in a state where the workpiece 11 (for example, the frame 17) is supported from the lower side. Thereby, the workpiece 11 is clamped by the pair of guide rails 14, and the workpiece 11 can be aligned. After that, the workpiece 11 is sucked and held by the conveying unit 16 and conveyed to the holding unit 22.

例如，在對具備晶圓13、膠帶15及框架17之被加工物11進行加工的情況下，是將晶圓13隔著膠帶15來配置於保持組件22上，並且藉由夾具24來固定框架17。在此狀態下，若使吸引源的負壓作用於保持面22a，即可隔著膠帶15且藉由保持組件22來吸引保持晶圓13。For example, in the case of processing the workpiece 11 provided with the wafer 13, the tape 15 and the frame 17, the wafer 13 is placed on the holding assembly 22 with the tape 15 interposed therebetween, and the frame is fixed by the jig 24 17. In this state, if the negative pressure of the suction source is applied to the holding surface 22 a, the wafer 13 can be sucked and held by the holding member 22 with the tape 15 interposed therebetween.

之後，使已裝設在切削組件26之切削刀片40旋轉，並使其切入被保持組件22所保持之晶圓13。例如，在已將切削刀片40的下端定位在比被加工物11的上表面更下方的狀態下，藉由加工進給組件18使保持組件22移動。藉此，保持組件22與切削組件26沿著加工進給方向相對地移動，而以線狀的形式切削晶圓13。After that, the cutting blade 40 installed in the cutting assembly 26 is rotated and cut into the wafer 13 held by the holding assembly 22. For example, in a state where the lower end of the cutting insert 40 has been positioned below the upper surface of the workpiece 11, the holding unit 22 is moved by the machining feed unit 18. Thereby, the holding assembly 22 and the cutting assembly 26 move relatively along the processing feed direction to cut the wafer 13 in a linear fashion.

再者，可藉由以已連接於切削組件26之切入進給組件28使切削組件26在Y軸方向上移動，來進行分度進給。又，可藉由以切入進給組件28使切削組件26在Z軸方向上移動，來調整切削刀片40對被加工物11的切入量。並且，晶圓13的加工中，可對晶圓13及切削刀片40供給純水等的切削液。Furthermore, the indexing feed can be performed by moving the cutting assembly 26 in the Y-axis direction with the cutting and feeding assembly 28 connected to the cutting assembly 26. In addition, by moving the cutting unit 26 in the Z-axis direction with the cutting feed unit 28, the cutting amount of the cutting insert 40 into the workpiece 11 can be adjusted. In addition, during the processing of the wafer 13, cutting fluid such as pure water can be supplied to the wafer 13 and the cutting blade 40.

若完成被加工物11的加工時，被加工物11即被搬送組件76從保持組件22上搬送到洗淨組件74，且被洗淨組件74洗淨。並且，洗淨後之被加工物11可在藉由搬送組件16搬送至一對導軌14上之後，被搬送組件10的把持部10a把持來容置到片匣8。When the processing of the to-be-processed object 11 is completed, the to-be-processed object 11 is conveyed from the holding unit 22 to the washing unit 74 by the conveying unit 76, and is washed by the washing unit 74. In addition, the processed object 11 after washing can be transported to the pair of guide rails 14 by the transport unit 16, and then can be held by the gripping portion 10 a of the transport unit 10 to be accommodated in the cassette 8.

在此，當藉由切削刀片40切削被加工物11時，會磨耗切削刀片40的切刃44，而使從基台42的外周緣突出之切刃44的突出量(刀尖伸出量)逐漸地減少。因此，在將切削刀片40使用一定期間後，會進行將使用完畢之切削刀片40更換為未使用之切削刀片的刀片更換作業。此時，操作人員會操作輸入組件82，來讓用於進行切削刀片40的更換作業之畫面(刀片更換畫面)顯示於顯示組件80。Here, when the workpiece 11 is cut by the cutting insert 40, the cutting edge 44 of the cutting insert 40 is abraded, and the protrusion amount (the tip protrusion amount) of the cutting edge 44 protruding from the outer periphery of the base 42 Decrease gradually. Therefore, after the cutting insert 40 is used for a certain period of time, an insert replacement operation of replacing the used cutting insert 40 with an unused cutting insert is performed. At this time, the operator operates the input unit 82 to display a screen (blade replacement screen) for performing the replacement operation of the cutting insert 40 on the display unit 80.

圖4是顯示用以顯示刀片更換畫面100之顯示組件80的正面圖。刀片更換畫面100包含：第一顯示部(未使用刀片資訊顯示部)102，顯示有關於未使用之切削刀片(更換用之切削刀片)之資訊；第二顯示部(刀片使用資訊顯示部)104，顯示有關於已裝設於切削組件26之切削刀片40的使用狀況之資訊；及結束鍵(確定鍵)106，使切削刀片40的更換處理結束。FIG. 4 is a front view showing the display assembly 80 for displaying the blade replacement screen 100. As shown in FIG. The blade replacement screen 100 includes: a first display part (unused blade information display part) 102, which displays information about an unused cutting blade (replacement cutting blade); a second display part (blade use information display part) 104 , Displaying information about the usage status of the cutting insert 40 installed in the cutting assembly 26; and an end key (OK key) 106 to end the replacement process of the cutting insert 40.

在第一顯示部102會顯示有關於可和已裝設於切削組件26之切削刀片40更換之未使用之切削刀片的各種資訊。例如第一顯示部102包含以下欄：顯示欄102a，顯示未使用之切削刀片的ID(名稱等)；顯示欄102b，顯示未使用之切削刀片的種類(材質等)；顯示欄102c，顯示附在未使用之切削刀片的條碼所表示之ID(文字、數字、記號等)；顯示欄102d，顯示將切削刀片40更換為未使用之切削刀片的理由。The first display portion 102 will display various information about the unused cutting inserts that can be replaced with the cutting inserts 40 installed in the cutting assembly 26. For example, the first display section 102 includes the following columns: a display column 102a, which displays the ID (name, etc.) of the unused cutting insert; a display column 102b, which displays the type of unused cutting insert (material, etc.); a display column 102c, which displays the additional The ID (text, number, symbol, etc.) indicated by the bar code of the unused cutting insert; the display column 102d shows the reason for replacing the cutting insert 40 with the unused cutting insert.

此外，第一顯示部102包含以下欄：顯示欄102e，顯示未使用之切削刀片的外徑(切刃的外徑)；顯示欄102f，顯示未使用之切削刀片的切刃的厚度；顯示欄102g，顯示未使用之切削刀片的型式(例如輪轂型或墊圈型)；顯示欄102h，顯示未使用之切削刀片的刀尖伸出量。In addition, the first display portion 102 includes the following columns: a display column 102e, which displays the outer diameter of an unused cutting insert (outer diameter of the cutting edge); a display column 102f, which displays the thickness of the cutting edge of an unused cutting insert; a display column 102g, showing the type of the unused cutting blade (for example, hub type or washer type); the display column 102h, showing the tip protrusion of the unused cutting blade.

例如，可藉由讀取已附在未使用之切削刀片的條碼，而以自動方式輸入對應於顯示欄102a~102h之資訊，並顯示在顯示欄102a~102h。但是，也可以藉由操作人員操作輸入組件82，而以手動方式輸入顯示在顯示欄102a~102h之資訊。For example, by reading the barcode attached to the unused cutting blade, the information corresponding to the display columns 102a to 102h can be automatically input and displayed in the display columns 102a to 102h. However, it is also possible to manually input the information displayed in the display columns 102a to 102h by operating the input component 82 by the operator.

在第二顯示部104會顯示裝設於切削組件26的切削刀片40(成為更換的對象之切削刀片)的使用狀況。例如第二顯示部104包含以下欄：顯示欄104a，顯示已藉由切削刀片40加工之線的條數(分割預定線的條數等)；顯示欄104b，顯示已藉由切削刀片40加工之區域的距離；顯示欄104c，顯示切削刀片40的消耗量；顯示欄104d，顯示切削刀片40加工被加工物11時之旋轉軸32(參照圖2(A))的最大的旋轉數。再者，切削刀片40的消耗量相當於對被加工物11進行加工前之切削刀片40的外徑(刀尖伸出量)、與切削刀片40的現在的外徑(刀尖伸出量)之差。The second display portion 104 displays the usage status of the cutting insert 40 (the cutting insert to be replaced) installed in the cutting assembly 26. For example, the second display 104 includes the following columns: a display column 104a, which displays the number of lines processed by the cutting insert 40 (the number of planned dividing lines, etc.); a display column 104b, which displays the number of lines processed by the cutting insert 40 The distance of the area; the display column 104c displays the consumption of the cutting insert 40; the display column 104d displays the maximum number of rotations of the rotating shaft 32 (refer to FIG. 2(A)) when the cutting insert 40 processes the workpiece 11. Furthermore, the consumption of the cutting insert 40 corresponds to the outer diameter (the nose protrusion) of the cutting insert 40 before processing the workpiece 11 and the current outer diameter (the nose protrusion) of the cutting insert 40 Difference.

在已將有關於未使用之切削刀片的各種資訊輸入切削裝置2並顯示於第一顯示部102的狀態下，若利用輸入組件82選擇結束鍵106，刀片更換畫面100會被關閉。此時，會確定顯示於第一顯示部102之資訊，並且將顯示於第二顯示部104之有關於使用完畢之切削刀片40的使用狀況之資訊重設(reset)。In the state where various information about the unused cutting insert has been input into the cutting device 2 and displayed on the first display portion 102, if the end key 106 is selected by the input unit 82, the insert replacement screen 100 will be closed. At this time, the information displayed on the first display portion 102 is confirmed, and the information on the usage status of the used cutting insert 40 displayed on the second display portion 104 is reset.

再者，在顯示組件80及輸入組件82藉由觸控面板所構成之情況下，操作人員可以藉由顯示有刀片更換畫面100的觸控面板的觸控操作來輸入資訊。例如，藉由點擊顯示有顯示欄102a~102h、顯示欄104a~104d之區域來選擇預定的顯示欄，而成為可在所選擇的顯示欄輸入文字或數值之狀態。又，可藉由點擊顯示有結束鍵106之區域來選擇結束鍵106。Furthermore, in the case where the display unit 80 and the input unit 82 are constituted by a touch panel, the operator can input information through the touch operation of the touch panel on which the blade replacement screen 100 is displayed. For example, by clicking an area where the display columns 102a to 102h and the display columns 104a to 104d are displayed to select a predetermined display column, it becomes a state where text or numerical value can be input in the selected display column. In addition, the end key 106 can be selected by clicking the area where the end key 106 is displayed.

在進行切削刀片的更換時，是在顯示組件80顯示刀片更換畫面100，並輸入有關於未使用之切削刀片的資訊。又，將已裝設於切削組件26之切削刀片40取下，並且將未使用之切削刀片裝設到切削組件26。之後，若在已將所輸入之資訊顯示於第一顯示部102的狀態下選擇結束鍵106，切削刀片的更換作業即完成，且可重新開始被加工物11的加工。When the cutting blade is replaced, the blade replacement screen 100 is displayed on the display unit 80, and information about the unused cutting blade is input. Furthermore, the cutting insert 40 installed in the cutting assembly 26 is removed, and the unused cutting insert is installed in the cutting assembly 26. After that, if the end key 106 is selected in a state where the input information is displayed on the first display unit 102, the cutting insert replacement operation is completed and the processing of the workpiece 11 can be restarted.

在此，在本實施形態之切削裝置2中，在選擇了結束鍵106時，可確認是否已實際進行切削刀片的裝卸。並且，在經判斷為並未進行切削刀片的裝卸的情況下，切削裝置2會不允許切削刀片的更換處理並發出警告。藉此，可以防止弄錯而藉由已消耗之切削刀片來加工被加工物11之情形，且可防止加工不良的發生。Here, in the cutting device 2 of the present embodiment, when the end key 106 is selected, it can be confirmed whether or not the cutting insert has actually been attached and detached. In addition, if it is determined that the cutting insert has not been attached or detached, the cutting device 2 does not permit the replacement of the cutting insert and issues a warning. In this way, it is possible to prevent the workpiece 11 from being mistakenly processed by the consumed cutting insert, and to prevent the occurrence of processing defects.

圖5是顯示切削裝置2的動作的流程圖。以下，參照圖1及圖5，說明切削裝置2的動作之具體例。切削刀片的更換作業時之切削裝置2的各構成要素的動作是被控制部88(參照圖1)所控制。FIG. 5 is a flowchart showing the operation of the cutting device 2. Hereinafter, a specific example of the operation of the cutting device 2 will be described with reference to FIGS. 1 and 5. The operation of each component of the cutting device 2 during the replacement operation of the cutting insert is controlled by the control unit 88 (refer to FIG. 1).

於圖1中以方塊圖顯示有控制部88的功能上的構成。控制部88具備外徑計算部90與刀片判定部92，前述外徑計算部90計算已裝設於切削組件26之切削刀片的外徑，前述刀片判定部92依據由外徑計算部90所計算出的外徑來判定已裝設於切削組件26之切削刀片是否為未使用之切削刀片。又，控制部88具備罩蓋開閉判定部94，前述罩蓋開閉判定部94會判定封閉加工區域B之罩蓋86c是否已被開閉。The functional configuration of the control unit 88 is shown as a block diagram in FIG. 1. The control unit 88 includes an outer diameter calculating unit 90 and an insert determining unit 92. The outer diameter calculating unit 90 calculates the outer diameter of the cutting insert installed in the cutting assembly 26, and the insert determining unit 92 is based on the calculation by the outer diameter calculating unit 90 The output outer diameter is used to determine whether the cutting insert installed in the cutting assembly 26 is an unused cutting insert. In addition, the control unit 88 includes a cover opening/closing determination unit 94 that determines whether the cover 86c that closes the processing area B has been opened and closed.

可將由刀片判定部92所進行之判定結果、與由罩蓋開閉判定部94所進行之判定結果分別輸入驅動部96。然後，驅動部96依據所輸入之判定結果來驅動切削裝置2的各構成要素。再者，可將外徑計算部90、刀片判定部92、罩蓋開閉判定部94分別連接於記憶部98，並且參照已記憶於記憶部98之資訊來進行處理。The determination result made by the blade determination unit 92 and the determination result made by the cover opening/closing determination unit 94 can be input to the drive unit 96 separately. Then, the drive unit 96 drives each component of the cutting device 2 based on the input determination result. Furthermore, the outer diameter calculation unit 90, the blade determination unit 92, and the cover opening/closing determination unit 94 can be connected to the storage unit 98, respectively, and the processing can be performed with reference to the information stored in the storage unit 98.

如圖5所示，首先，操作人員操作輸入組件82而於顯示組件80顯示刀片更換畫面100(參照圖3)(步驟S1)。並且，操作人員藉由操作輸入組件82而輸入有關於未使用之切削刀片(更換用之切削刀片)的資訊。其結果，可將已輸入之各種資訊顯示在刀片更換畫面100的第一顯示部102(顯示欄102a~102h)。As shown in FIG. 5, first, the operator operates the input unit 82 to display the blade replacement screen 100 (refer to FIG. 3) on the display unit 80 (step S1). In addition, the operator inputs information about unused cutting inserts (replacement cutting inserts) by operating the input component 82. As a result, the input various information can be displayed on the first display portion 102 (display columns 102a to 102h) of the blade replacement screen 100.

又，當將刀片更換畫面100顯示於顯示組件80時，可藉由控制部88解除覆蓋加工區域B之罩蓋86c的鎖定，而變得可進行罩蓋86c的開閉。並且，操作人員打開罩蓋86c而將已裝設於切削組件26之使用完畢之切削刀片40更換為未使用之切削刀片後，關閉罩蓋86c。之後，操作人員操作輸入組件82並選擇刀片更換畫面100的結束鍵106，而給出完成切削刀片的更換處理之指示。In addition, when the blade replacement screen 100 is displayed on the display unit 80, the cover 86c covering the processing area B can be unlocked by the control unit 88, and the cover 86c can be opened and closed. In addition, the operator opens the cover 86c and replaces the used cutting insert 40 installed in the cutting assembly 26 with an unused cutting insert, and then closes the cover 86c. After that, the operator operates the input unit 82 and selects the end key 106 of the blade replacement screen 100, and gives an instruction to complete the replacement process of the cutting blade.

當選擇結束鍵106時(在步驟S2中為「是」)，控制部88會將顯示於刀片更換畫面100的第二顯示部104(顯示欄104a~104d)之資訊記憶於記憶部98。藉此，可將使用完畢之切削刀片40的使用狀況(加工線數量、加工距離、切削刀片40的消耗量、旋轉軸32的最大旋轉數)備份。但是，實施切削刀片40的使用狀況的備份之時間點並無限制。When the end key 106 is selected ("Yes" in step S2), the control unit 88 stores the information displayed on the second display unit 104 (display columns 104a to 104d) of the blade replacement screen 100 in the memory unit 98. Thereby, the usage status of the used cutting insert 40 (the number of processing lines, the processing distance, the consumption of the cutting insert 40, the maximum number of rotations of the rotating shaft 32) can be backed up. However, there is no limit to the point in time when the usage status of the cutting insert 40 is backed up.

並且，控制部88在前次之切削刀片的更換作業之後，會確認是否有進行覆蓋切削組件26之罩蓋86c的開閉(步驟S3)。例如在切削裝置2中，設置有可在進行罩蓋86c的開閉時***作人員按壓之按鈕式的開關(安全按鈕)。又，亦可將檢測罩蓋86c的開閉之感測器設置於罩蓋86c的附近。In addition, the control unit 88 confirms whether or not the cover 86c covering the cutting assembly 26 has been opened and closed after the previous cutting insert replacement operation (step S3). For example, the cutting device 2 is provided with a button type switch (safety button) that can be pressed by the operator when opening and closing the cover 86c. In addition, a sensor that detects the opening and closing of the cover 86c may be installed in the vicinity of the cover 86c.

是否已按壓安全按鈕之資訊、或由感測器所進行之罩蓋86c的開閉之檢測結果，可記憶於記憶部98。並且，當選擇結束鍵106時，罩蓋開閉判定部94會存取記憶部98，並參照已記憶於記憶部98之資訊來判定是否有進行罩蓋86c的開閉。The information of whether the safety button has been pressed, or the detection result of the opening and closing of the cover 86c performed by the sensor can be stored in the memory unit 98. In addition, when the end key 106 is selected, the cover opening/closing determination unit 94 accesses the memory unit 98, and refers to the information stored in the memory unit 98 to determine whether the cover 86c is opened or closed.

在此，在實際上並未實施切削刀片的裝卸作業的情況下，在記憶部98不會記憶有罩蓋86c曾被打開之資訊(已按壓安全按鈕之資訊、已藉由感測器檢測到的罩蓋86c的開閉的資訊等)。在此情況下，罩蓋開閉判定部94會判定為罩蓋86c未被開閉(在步驟S4中為「否」)，而不允許切削刀片的更換(步驟S5)。此時，控制部88不會實施關閉刀片更換畫面100之處理、及確定顯示於刀片更換畫面100的第一顯示部102的資訊之處理。Here, in the case that the cutting insert is not actually loaded and unloaded, the memory 98 will not store the information that the cover 86c has been opened (the information that the safety button has been pressed, the information that has been detected by the sensor The opening and closing information of the cover 86c, etc.). In this case, the cover opening/closing determination unit 94 determines that the cover 86c is not opened and closed ("No" in step S4), and does not permit the replacement of the cutting insert (step S5). At this time, the control unit 88 does not perform the process of closing the blade replacement screen 100 and the process of determining the information displayed on the first display portion 102 of the blade replacement screen 100.

又，可將由罩蓋開閉判定部94所進行之判定的結果(沒有罩蓋86c的開閉)輸入到驅動部96。然後，已被輸入該判定結果之驅動部96會驅動切削裝置2的預定的構成要素(顯示組件80等)，並發送通知尚未進行切削刀片的裝卸之意旨的警告(步驟S6)。In addition, the result of the determination performed by the cover opening/closing determination unit 94 (there is no opening and closing of the cover 86c) can be input to the driving unit 96. Then, the drive unit 96 to which the determination result has been input drives the predetermined component (display unit 80, etc.) of the cutting device 2 and sends a warning notifying that the cutting insert has not been detached (step S6).

再者，警告的發送方法並沒有限制。例如驅動部96於顯示組件80顯示尚未進行切削刀片的更換之意旨的資訊。又，切削裝置2亦可具備有警告燈，且驅動部96亦可使此警告燈亮燈或閃爍。此外，切削裝置2亦可具備有揚聲器，且驅動部96亦可使揚聲器發出警告音、或通知警告內容之聲音。Furthermore, there are no restrictions on how the warning can be sent. For example, the driving part 96 displays information indicating that the cutting insert has not been replaced on the display assembly 80. In addition, the cutting device 2 may be provided with a warning lamp, and the driving unit 96 may light or flash the warning lamp. In addition, the cutting device 2 may be provided with a speaker, and the driving unit 96 may cause the speaker to emit a warning sound or a sound to notify the warning content.

此外，控制部88會讀取已在記憶部98備份之有關於切削刀片40的使用狀況之資訊，並使其還原(再顯示)於刀片更換畫面100的第二顯示部104(顯示欄104a~104d)(步驟S7)。藉此，第二顯示部104返回到在顯示組件80顯示有刀片更換畫面100時(步驟S1)的狀態。In addition, the control unit 88 reads the information about the usage status of the cutting blade 40 that has been backed up in the memory unit 98, and restores (redisplays) it on the second display unit 104 (display column 104a~) of the blade replacement screen 100. 104d) (Step S7). Thereby, the second display unit 104 returns to the state when the blade replacement screen 100 is displayed on the display unit 80 (step S1).

另一方面，在已藉由罩蓋開閉判定部94判定為已將罩蓋86c開閉的情況下(在步驟S4中為「是」)，該判定結果會被輸入到驅動部96。然後，驅動部96會控制檢測組件68及切入進給組件28，並使檢測組件68檢測切削刀片40的前端位置(下端位置)(步驟S8)。並且，從檢測組件68將檢測結果輸入到外徑計算部90，並且從切入進給組件28將檢測中的切削組件26的高度位置之資訊輸入到外徑計算部90。On the other hand, when the cover opening/closing determination unit 94 determines that the cover 86c has been opened and closed (YES in step S4), the determination result is input to the drive unit 96. Then, the driving unit 96 controls the detection unit 68 and the cutting feed unit 28, and causes the detection unit 68 to detect the front end position (lower end position) of the cutting blade 40 (step S8). In addition, the detection result is input from the detection unit 68 to the outer diameter calculation unit 90, and the information on the height position of the cutting unit 26 under detection is input to the outer diameter calculation unit 90 from the cutting feed unit 28.

外徑計算部90依據從檢測組件68及切入進給組件28所輸入之訊號，來計算已裝設於切削組件26之切削刀片的外徑。例如可於記憶部98事先記憶有表示以下內容之資訊：從檢測組件68的投光部72a朝受光部72b照射之光(參照圖3)被切削刀片擋住時之切削組件26的高度位置與該切削刀片的外徑之關係。並且，外徑計算部90參照記憶部98所記憶之資訊，來特定已裝設在切削組件26之切削刀片的外徑。The outer diameter calculation unit 90 calculates the outer diameter of the cutting insert installed in the cutting assembly 26 based on the signals input from the detection assembly 68 and the cutting and feeding assembly 28. For example, information indicating the following content may be stored in the storage unit 98 in advance: the height position of the cutting unit 26 when the light irradiated from the light-emitting portion 72a of the detection unit 68 to the light-receiving portion 72b (refer to FIG. 3) is blocked by the cutting blade and the The relationship between the outer diameter of the cutting insert. In addition, the outer diameter calculation unit 90 refers to the information stored in the memory unit 98 to specify the outer diameter of the cutting insert installed in the cutting assembly 26.

可將藉由外徑計算部90所計算出的外徑之值輸入到刀片判定部92。並且，刀片判定部92依據從外徑計算部90所輸入之外徑，來判定已裝設在切削組件26之切削刀片是否為未使用之切削刀片。具體而言，在記憶部98事先記憶有用來和使用完畢之切削刀片40進行更換之未使用之切削刀片的外徑之值(基準外徑值)。此基準外徑值相當於顯示在刀片更換畫面100的第一顯示部102(顯示欄102e)的未使用之切削刀片的外徑之值。The value of the outer diameter calculated by the outer diameter calculation unit 90 can be input to the blade determination unit 92. In addition, the blade determining unit 92 determines whether the cutting blade installed in the cutting assembly 26 is an unused cutting blade based on the outer diameter input from the outer diameter calculating unit 90. Specifically, the memory portion 98 stores in advance the value of the outer diameter of the unused cutting insert (reference outer diameter) that is used to replace the used cutting insert 40. This reference outer diameter value is equivalent to the value of the outer diameter of the unused cutting insert displayed on the first display portion 102 (display column 102e) of the insert replacement screen 100.

並且，刀片判定部92會比較從外徑計算部90所輸入之外徑之值與基準外徑值。在此，在切削組件26正確地裝設有未使用之切削刀片的情況下，藉由外徑計算部90所算出的外徑之值與基準外徑值會一致、或其差會落在預定的誤差範圍內(例如±10μm)。在此情況下，刀片判定部92會判斷為已裝設在切削組件26之切削刀片的外徑對應於更換用之刀片的外徑(在步驟S9中為「是」)，而允許切削刀片的更換(步驟S10)。In addition, the blade determination unit 92 compares the value of the outer diameter input from the outer diameter calculation unit 90 with the reference outer diameter value. Here, when the cutting assembly 26 is correctly equipped with an unused cutting insert, the value of the outer diameter calculated by the outer diameter calculating unit 90 will be consistent with the reference outer diameter value, or the difference will fall within the predetermined value. Within the error range (e.g. ±10μm). In this case, the insert judging unit 92 will determine that the outer diameter of the cutting insert installed in the cutting assembly 26 corresponds to the outer diameter of the replacement insert ("Yes" in step S9), and allow the cutting insert Replace (step S10).

若允許切削刀片的更換後，會將已顯示於刀片更換畫面100的第一顯示部102之資訊確定並記憶於記憶部98，並且將已顯示於第二顯示部104之資訊重設。藉此，即完成切削刀片的更換作業。If the replacement of the cutting blade is allowed, the information that has been displayed on the first display part 102 of the blade replacement screen 100 is determined and memorized in the memory 98, and the information that has been displayed on the second display 104 is reset. In this way, the replacement of the cutting insert is completed.

另一方面，在未進行切削刀片的裝卸，而成為直接將使用完畢之切削刀片40裝設於切削組件26的狀態的情況下，藉由外徑計算部90所計算出的外徑之值會變得比基準外徑值更小。並且，刀片判定部92在從外徑計算部90所輸入之外徑之值與基準外徑值不同、或其差超出預定的誤差範圍的情況下，會判斷為已裝設於切削組件26的切削刀片的外徑並未對應於更換用的刀片的外徑(在步驟S9中為「否」)，而不允許刀片的更換(步驟S5)。並且，和未確認到罩蓋86c的開閉的情況同樣，會進行警告的發送(步驟S6)及第二顯示部104的顯示之還原(步驟S7)。On the other hand, in the case where the cutting insert 40 is directly mounted on the cutting assembly 26 without the attachment and detachment of the cutting insert, the value of the outer diameter calculated by the outer diameter calculating unit 90 will be It becomes smaller than the reference outer diameter value. In addition, the blade judging unit 92 will judge that the value of the outer diameter input from the outer diameter calculating unit 90 is different from the reference outer diameter value, or the difference exceeds a predetermined error range, as a The outer diameter of the cutting blade does not correspond to the outer diameter of the replacement blade (No in step S9), and replacement of the blade is not allowed (step S5). And, similarly to the case where the opening and closing of the cover 86c is not confirmed, a warning is sent (step S6) and the display of the second display unit 104 is restored (step S7).

在切削裝置2發出警告時，操作人員會在已將未使用之切削刀片正確地裝設到切削組件26之後，再次選擇刀片更換畫面100的結束鍵106。藉此，即完成切削刀片的更換作業，而成為可開始進行使用了未使用之切削刀片的被加工物11的加工之狀態。When the cutting device 2 issues a warning, the operator will select the end key 106 of the blade replacement screen 100 again after the unused cutting blade has been correctly installed in the cutting assembly 26. Thereby, the replacement of the cutting insert is completed, and the processing of the workpiece 11 using the unused cutting insert can be started.

上述之切削裝置2的動作被控制部88所控制。具體而言，在記憶部98記憶有描述圖5所示之一系列的動作之程式，且控制部88從記憶部98將該程式讀出並執行。藉此，可生成控制切削裝置2的各構成要素的動作之控制訊號，且可實現切削刀片的更換處理。The operation of the above-mentioned cutting device 2 is controlled by the control unit 88. Specifically, a program describing a series of actions shown in FIG. 5 is stored in the storage unit 98, and the control unit 88 reads and executes the program from the storage unit 98. Thereby, it is possible to generate a control signal for controlling the operation of each constituent element of the cutting device 2, and it is possible to realize the replacement process of the cutting insert.

如以上所述，在本實施形態之切削裝置2中，在已裝設於切削組件26之切削刀片的外徑未對應於未使用之切削刀片的外徑的情況下、或者不存在將切削組件26封閉之罩蓋86c曾被打開之資訊的情況下，即使選擇刀片更換畫面100的結束鍵106，也不會允許切削刀片的更換，並會發出警告。因此，可防止無意間以使用完畢之切削刀片來加工被加工物11之情形，並且可以讓操作人員容易地辨識未正確地進行切削刀片的更換之意旨。藉此，變得可確實地實施切削刀片的更換，而防止加工不良的發生。As described above, in the cutting device 2 of this embodiment, when the outer diameter of the cutting insert installed in the cutting assembly 26 does not correspond to the outer diameter of the unused cutting insert, or there is no cutting assembly In the case of the information that the closed cover 86c has been opened, even if the end key 106 of the blade replacement screen 100 is selected, the replacement of the cutting blade will not be allowed, and a warning will be issued. Therefore, it is possible to prevent inadvertent machining of the workpiece 11 with the used cutting insert, and it is possible for the operator to easily recognize the intention of incorrectly replacing the cutting insert. Thereby, it becomes possible to reliably perform the replacement of the cutting insert, and to prevent the occurrence of processing defects.

再者，在本實施形態中，已針對以下的例子來說明：依據罩蓋86c之開閉的有無(步驟S4)、及切削刀片的外徑的對應關係(步驟S9)，來判定已裝設於切削組件26之切削刀片是否為使用完畢或未使用。但是，切削裝置2亦可僅依據罩蓋86c之開閉的有無與切削刀片的外徑的對應關係的其中一者，來判定切削刀片是否為使用完畢或未使用。Furthermore, in the present embodiment, the following example has been described: it is determined based on whether the cover 86c is opened and closed (step S4) and the corresponding relationship between the outer diameter of the cutting insert (step S9). Whether the cutting blade of the cutting assembly 26 is used or not. However, the cutting device 2 may determine whether the cutting insert is used or not based on only one of the correspondence between the opening and closing of the cover 86c and the outer diameter of the cutting insert.

另外，上述實施形態之構成、方法等，只要在不脫離本發明之目的之範圍內，均可適當變更而實施。In addition, the structure, method, etc. of the above-mentioned embodiment can be suitably changed and implemented as long as it does not deviate from the purpose of the present invention.

2:切削裝置 4,42,70:基台 4a,4b,42a,46a:開口 6:片匣支撐台 8:片匣 10,16,76:搬送組件(搬送單元) 10a:把持部 11:被加工物 12:暫置區域 13:晶圓 14:導軌 15:膠帶(切割膠帶) 17:框架 18:加工進給組件(第1移動單元) 18a:移動工作台 20:防塵防滴罩蓋 22:保持組件(保持工作台) 22a:保持面 24:夾具 26:切削組件(切削單元) 28:切入進給組件(第2移動單元) 30:殼體 32:旋轉軸(主軸) 34:凸緣(安裝座) 36:凸緣部 36a:正面 36b:凸部 38:支撐軸 38a:螺絲部 40:切削刀片 42b:把持部 44:切刃 46:固定螺帽 48:刀片罩蓋 48a,48b:螺孔 50,56:管件 52,58:噴嘴 54,62:裝卸罩蓋 54a,62a:圓孔 60,64:螺絲 66:拍攝組件(拍攝單元) 68:檢測組件(檢測單元) 70a:凹部 72a:投光部 72b:受光部 74:洗淨組件(洗淨單元) 78:支撐台 80:顯示組件(顯示部、顯示單元) 82:輸入組件(輸入部、輸入單元) 84:框體 86a,86b,86c:罩蓋 88:控制部(控制組件、控制單元) 90:外徑計算部 92:刀片判定部 94:罩蓋開閉判定部 96:驅動部 98:記憶部 100:刀片更換畫面 102:第一顯示部(未使用刀片資訊顯示部) 102a,102b,102c,102d,102e,102f,102g,102h:顯示欄 104:第二顯示部(刀片使用資訊顯示部) 104a,104b,104c,104d:顯示欄 106:結束鍵(確定鍵) A:搬送區域 B:加工區域 X,Y,Z:方向 S1~S10:步驟2: Cutting device 4, 42, 70: Abutment 4a, 4b, 42a, 46a: opening 6: Cassette support table 8: film cassette 10, 16, 76: transport unit (transport unit) 10a: Control Department 11: processed objects 12: Temporary area 13: Wafer 14: Rail 15: Tape (cutting tape) 17: Frame 18: Processing feed assembly (1st moving unit) 18a: mobile workbench 20: Dust-proof and drip-proof cover 22: Keep components (hold workbench) 22a: Keep the face 24: Fixture 26: Cutting assembly (cutting unit) 28: Cut-in feed assembly (2nd moving unit) 30: shell 32: Rotation axis (spindle) 34: Flange (mounting seat) 36: Flange 36a: front 36b: Convex 38: Support shaft 38a: Screw part 40: cutting blade 42b: Control Department 44: Cutting Edge 46: fixed nut 48: Blade cover 48a, 48b: screw hole 50, 56: pipe fittings 52, 58: nozzle 54,62: loading and unloading cover 54a, 62a: round hole 60, 64: Screw 66: Shooting component (shooting unit) 68: Detection component (detection unit) 70a: recess 72a: Projection Department 72b: Light receiving part 74: Washing component (washing unit) 78: support table 80: Display components (display unit, display unit) 82: Input components (input section, input unit) 84: Frame 86a, 86b, 86c: cover 88: Control section (control component, control unit) 90: Outer diameter calculation department 92: Blade Judgment Department 94: Cover opening/closing determination section 96: Drive 98: Memory Department 100: Blade replacement screen 102: The first display part (the blade information display part is not used) 102a, 102b, 102c, 102d, 102e, 102f, 102g, 102h: display bar 104: The second display part (blade use information display part) 104a, 104b, 104c, 104d: display bar 106: End key (OK key) A: Transport area B: Processing area X, Y, Z: direction S1~S10: steps

圖1是顯示切削裝置的立體圖。 圖2(A)是顯示切削組件的立體圖，圖2(B)是顯示裝設有刀片罩蓋之切削組件的立體圖。 圖3是顯示檢測組件的側面圖。 圖4是顯示用以顯示刀片更換畫面之顯示組件的正面圖。 圖5是顯示切削裝置的動作的流程圖。Fig. 1 is a perspective view showing a cutting device. Fig. 2(A) is a perspective view showing the cutting assembly, and Fig. 2(B) is a perspective view showing the cutting assembly equipped with a blade cover. Fig. 3 is a side view showing the detection assembly. Fig. 4 is a front view showing a display assembly for displaying a blade replacement screen. Fig. 5 is a flowchart showing the operation of the cutting device.

2:切削裝置2: Cutting device

4:基台4: Abutment

4a,4b:開口4a, 4b: opening

6:片匣支撐台6: Cassette support table

8:片匣8: film cassette

10,16,76:搬送組件(搬送單元)10, 16, 76: transport unit (transport unit)

10a:把持部10a: Control Department

11:被加工物11: processed objects

12:暫置區域12: Temporary area

13:晶圓13: Wafer

14:導軌14: Rail

15:膠帶(切割膠帶)15: Tape (cutting tape)

17:框架17: Frame

18:加工進給組件(第1移動單元)18: Processing feed assembly (1st moving unit)

18a:移動工作台18a: mobile workbench

20:防塵防滴罩蓋20: Dust-proof and drip-proof cover

22:保持組件(保持工作台)22: Keep components (hold workbench)

22a:保持面22a: Keep the face

24:夾具24: Fixture

26:切削組件(切削單元)26: Cutting assembly (cutting unit)

28:切入進給組件(第2移動單元)28: Cut-in feed assembly (2nd moving unit)

40:切削刀片40: cutting blade

66:拍攝組件(拍攝單元)66: Shooting component (shooting unit)

68:檢測組件(檢測單元)68: Detection component (detection unit)

74:洗淨組件(洗淨單元)74: Washing component (washing unit)

78:支撐台78: support table

80:顯示組件(顯示部、顯示單元)80: Display components (display unit, display unit)

82:輸入組件(輸入部、輸入單元)82: Input components (input section, input unit)

84:框體84: Frame

86a,86b,86c:罩蓋86a, 86b, 86c: cover

88:控制部(控制組件、控制單元)88: Control section (control component, control unit)

90:外徑計算部90: Outer diameter calculation department

92:刀片判定部92: Blade Judgment Department

94:罩蓋開閉判定部94: Cover opening/closing determination section

96:驅動部96: Drive

98:記憶部98: Memory Department

A:搬送區域A: Transport area

B:加工區域B: Processing area

X,Y,Z:方向X, Y, Z: direction

Claims (4)

一種切削裝置，包含以下而構成： 保持組件，保持被加工物； 切削組件，可旋轉地設置有對藉由該保持組件所保持之該被加工物進行切削之切削刀片； 加工進給組件，使該保持組件與該切削組件沿著加工進給方向相對地移動； 切入進給組件，使該切削組件沿著切入方向移動； 檢測組件，檢測該切削刀片的前端位置； 罩蓋，開閉自如且可將配設有該切削組件之加工區域封閉；及 顯示組件， 該切削裝置的特徵在於： 該切削組件包含旋轉軸、可旋轉地支撐該旋轉軸之殼體、及配設於該旋轉軸的前端部且可裝卸自如地裝設該切削刀片之凸緣， 該顯示組件會顯示刀片更換畫面， 該刀片更換畫面包含第一顯示部、第二顯示部及結束鍵，前述第一顯示部顯示可和該切削刀片更換之未使用之切削刀片的外徑及刀尖伸出量，前述第二顯示部顯示該切削刀片的刀尖的消耗量，前述結束鍵使該切削刀片的更換處理結束， 當選擇該結束鍵時，即藉由該檢測組件檢測該切削刀片的前端位置， 在已裝設於該切削組件之該切削刀片的外徑對應於顯示在該第一顯示部之該未使用之切削刀片的外徑的情況下，允許該切削刀片的更換；在已裝設於該切削組件之該切削刀片的外徑未對應於顯示在該第一顯示部之該未使用之切削刀片的外徑的情況下，不允許該切削刀片的更換並發出警告。A cutting device including the following: Keep the components, keep the processed objects; The cutting assembly is rotatably provided with a cutting blade for cutting the workpiece held by the holding assembly; Machining the feed assembly, so that the holding assembly and the cutting assembly move relatively along the machining feed direction; Cut into the feed assembly, so that the cutting assembly moves along the cutting direction; Detection component to detect the front end position of the cutting blade; The cover can be opened and closed freely and can close the processing area equipped with the cutting component; and Display components, The cutting device is characterized by: The cutting assembly includes a rotating shaft, a housing rotatably supporting the rotating shaft, and a flange arranged on the front end of the rotating shaft and detachably installing the cutting blade, The display unit will display the blade replacement screen, The blade replacement screen includes a first display part, a second display part, and an end key. The first display part displays the outer diameter and the tip extension of the unused cutting blade that can be replaced with the cutting blade. The second display is The section displays the consumption of the cutting tip of the cutting insert, and the aforementioned end key ends the replacement process of the cutting insert. When the end key is selected, the front end position of the cutting insert is detected by the detection component, In the case where the outer diameter of the cutting blade installed in the cutting assembly corresponds to the outer diameter of the unused cutting blade displayed on the first display part, the replacement of the cutting blade is allowed; In the case that the outer diameter of the cutting blade of the cutting assembly does not correspond to the outer diameter of the unused cutting blade displayed on the first display part, the replacement of the cutting blade is not allowed and a warning is issued. 如請求項1之切削裝置，其中顯示於該第二顯示部之該消耗量已被備份，即使在已選擇該結束鍵的情況下，仍然可以在該第二顯示部還原該消耗量。For example, the cutting device of claim 1, in which the consumption amount displayed on the second display part has been backed up, even if the end key has been selected, the consumption amount can still be restored on the second display part. 如請求項1或2之切削裝置，其中當在該顯示組件顯示該刀片更換畫面時，即變得可進行該罩蓋的開閉， 若不存在該罩蓋曾被打開的資訊而依然選擇該結束鍵時，在藉由該檢測組件檢測該切削刀片的前端位置之前，不允許該切削刀片的更換並發出警告。For example, the cutting device of claim 1 or 2, wherein when the blade replacement screen is displayed on the display assembly, the cover can be opened and closed, If there is no information that the cover has been opened and the end key is still selected, the cutting blade is not allowed to be replaced and a warning is issued before the detection component detects the front end position of the cutting blade. 一種切削裝置，包含以下而構成： 保持組件，保持被加工物； 切削組件，可旋轉地設置有對藉由該保持組件所保持之該被加工物進行切削之切削刀片； 加工進給組件，使該保持組件與該切削組件沿著加工進給方向相對地移動； 切入進給組件，使該切削組件沿著切入方向移動； 罩蓋，開閉自如且可將配設有該切削組件之加工區域封閉；及 顯示組件， 該切削裝置的特徵在於： 該切削組件包含旋轉軸、可旋轉地支撐該旋轉軸之殼體、及配設在該旋轉軸的前端部且可裝卸自如地裝設切削刀片之凸緣， 該顯示組件會顯示刀片更換畫面， 該刀片更換畫面包含第一顯示部、第二顯示部及結束鍵，前述第一顯示部顯示可和該切削刀片更換之未使用之切削刀片的外徑及刀尖伸出量，前述第二顯示部顯示該切削刀片的刀尖的消耗量，前述結束鍵使該切削刀片的更換處理結束， 當在該顯示組件顯示該刀片更換畫面時，即變得可進行該罩蓋的開閉， 若不存在該罩蓋曾被打開之資訊而依然選擇該結束鍵時，不允許切削刀片的更換並發出警告。A cutting device including the following: Keep the components, keep the processed objects; The cutting assembly is rotatably provided with a cutting blade for cutting the workpiece held by the holding assembly; Machining the feed assembly, so that the holding assembly and the cutting assembly move relatively along the machining feed direction; Cut into the feed assembly, so that the cutting assembly moves along the cutting direction; The cover can be opened and closed freely and can close the processing area equipped with the cutting component; and Display components, The cutting device is characterized by: The cutting assembly includes a rotating shaft, a housing that rotatably supports the rotating shaft, and a flange arranged on the front end of the rotating shaft and detachably installed with a cutting blade, The display unit will display the blade replacement screen, The blade replacement screen includes a first display part, a second display part, and an end key. The first display part displays the outer diameter and the tip extension of the unused cutting blade that can be replaced with the cutting blade. The second display is The section displays the consumption of the cutting tip of the cutting insert, and the aforementioned end key ends the replacement process of the cutting insert. When the blade replacement screen is displayed on the display unit, the cover can be opened and closed. If there is no information that the cover has been opened and the end button is still selected, the cutting insert is not allowed to be replaced and a warning is issued.
TW110114196A 2020-05-11 2021-04-20 Cutting device capable of reliably replacing a cutting blade to prevent the occurrence of processing defects TW202143323A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2020-082987 2020-05-11
JP2020082987A JP7446683B2 (en) 2020-05-11 2020-05-11 cutting equipment

Publications (1)

Publication Number Publication Date
TW202143323A true TW202143323A (en) 2021-11-16

Family

ID=78415770

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110114196A TW202143323A (en) 2020-05-11 2021-04-20 Cutting device capable of reliably replacing a cutting blade to prevent the occurrence of processing defects

Country Status (4)

Country Link
JP (1) JP7446683B2 (en)
KR (1) KR20210137903A (en)
CN (1) CN113635463A (en)
TW (1) TW202143323A (en)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4571851B2 (en) 2004-11-30 2010-10-27 株式会社ディスコ Cutting equipment
JP2009241177A (en) 2008-03-28 2009-10-22 Disco Abrasive Syst Ltd Blade changing tool
JP5415917B2 (en) 2009-11-27 2014-02-12 株式会社ディスコ Cutting equipment
JP6949565B2 (en) 2017-06-08 2021-10-13 株式会社ディスコ Cutting equipment

Also Published As

Publication number Publication date
JP7446683B2 (en) 2024-03-11
JP2021178367A (en) 2021-11-18
KR20210137903A (en) 2021-11-18
CN113635463A (en) 2021-11-12

Similar Documents

Publication Publication Date Title
JP6108999B2 (en) Cutting equipment
TWI672193B (en) Cutting device
JP7165510B2 (en) Transfer jig and replacement method
CN110600395B (en) Processing device
JP6847512B2 (en) Cutting equipment and cutting method
JP2008300556A (en) Frame clamp
JP7408306B2 (en) cutting equipment
TW202143323A (en) Cutting device capable of reliably replacing a cutting blade to prevent the occurrence of processing defects
KR102551970B1 (en) Setup method of cutting apparatus
JP2018187694A (en) Cutting device
JP6808292B2 (en) Diagnosis method of processing equipment
JP7098239B2 (en) Nozzle height inspection method and cutting equipment
JP2020142342A (en) Cutting device
JP7523859B2 (en) Processing Equipment
JP2021170598A (en) Processing device
JP7423158B2 (en) processing equipment
KR20220033015A (en) Apparatus using high pressure air
JP2021117655A (en) Processing device
TW202407780A (en) Processing device
TW202215572A (en) Processing device and using method of the processing device Capable of preventing input errors of information
CN112992724A (en) Processing device
CN116803610A (en) Cutting method for workpiece
JP2023109276A (en) Processing device and abnormality detection method for proximity sensor
JP2024097681A (en) How to process the workpiece
JP2023182041A (en) Processing device