TW202137597A - Led display module and led display - Google Patents

Led display module and led display Download PDF

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TW202137597A
TW202137597A TW109110507A TW109110507A TW202137597A TW 202137597 A TW202137597 A TW 202137597A TW 109110507 A TW109110507 A TW 109110507A TW 109110507 A TW109110507 A TW 109110507A TW 202137597 A TW202137597 A TW 202137597A
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substrate
led display
circuit pattern
display module
wiring
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TW109110507A
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TWI804720B (en
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宋根浩
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南韓商太特思股份有限公司
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Abstract

The present invention relates to an LED display module, and more specifically, to an LED display module, in which a conductive metal thin film layer formed by deposition is used to allocate the side wiring, so as to connect the upper circuit pattern and the lower circuit pattern of a substrate, thereby removing the frame. Therefore, even when plural modules are spliced to obtain the required display size, the dividing line or the frame line cannot be seen, thereby ensuring the display quality.

Description

LED顯示模組LED display module

本發明涉及一種發光二極體（LED）顯示模組，並且更具體地，涉及一種LED顯示模組，其中透過沉積形成的導電金屬薄膜層用於配置側面佈線，以連接基板的上部電路圖案和下部電路圖案，從而去除邊框並保證顯示品質，且因此，即使當複數個模組進行拼接以獲得所需的顯示尺寸時也看不到分割線或邊框線。The present invention relates to a light emitting diode (LED) display module, and more specifically, to an LED display module, in which a conductive metal thin film layer formed by deposition is used to configure side wiring to connect the upper circuit pattern of a substrate and The lower circuit pattern removes the frame and guarantees the display quality. Therefore, even when a plurality of modules are spliced to obtain the required display size, the dividing line or the frame line cannot be seen.

微型發光二極體（LED）是指超小型LED，其結構類似於傳統LED的結構，但晶片的微觀尺寸為10~100μm，並且可用於顯示產品的像素。與傳統LED相比，微型LED（micro LED）具有高對比度，在反應速度和視角方面有優勢，並且具有優異的亮度和極限解析度。此外，與有機發光二極體（OLED）相比，微型LED在化學和機械穩定性方面優異、壽命長、並且消耗更少的功率。Miniature light-emitting diodes (LEDs) refer to ultra-small LEDs whose structure is similar to that of traditional LEDs, but the microscopic size of the chip is 10-100μm, and it can be used for pixels of display products. Compared with traditional LEDs, micro LEDs (micro LEDs) have high contrast, advantages in response speed and viewing angle, and have excellent brightness and extreme resolution. In addition, compared with organic light emitting diodes (OLED), micro LEDs are excellent in chemical and mechanical stability, have a long life, and consume less power.

傳統的LED顯示器具有基於迷你LED（具有間隔為0.3mm~5mm間距的X-Y矩陣的LED器件）或微型LED（具有間隔為50~300μm的LED器件）的結構。通常，傳統的LED顯示器具有如第1圖所示的結構。Conventional LED displays have a structure based on mini LEDs (LED devices with an X-Y matrix with a pitch of 0.3 mm to 5 mm) or micro LEDs (LED devices with a pitch of 50 to 300 μm). Generally, a conventional LED display has a structure as shown in Figure 1.

參照第1圖，傳統的LED顯示器通常包括：基板30、排列在基板30上的複數個LED顯示裝置50、用於複數個LED顯示裝置 50的上部電路圖案60和下部電路圖案80、用於控制複數個顯示裝置等的訊號的控制器裝置70，並且控制器裝置70透過供電佈線85接收電力。Referring to Figure 1, a conventional LED display usually includes: a substrate 30, a plurality of LED display devices 50 arranged on the substrate 30, an upper circuit pattern 60 and a lower circuit pattern 80 for the plurality of LED display devices 50, for control A plurality of display devices and other signal controller devices 70, and the controller device 70 receives power through the power supply wiring 85.

在第1圖中，（a）示出了設置邊框B的區域以將控制器裝置70安裝到基板30的頂側上，並且形成可撓性印刷電路板（FPCB）作為供電佈線85，以透過基板30的底側和頂側向安裝的控制器裝置70提供電力及/或訊號。In Figure 1, (a) shows the area where the frame B is provided to mount the controller device 70 on the top side of the substrate 30, and a flexible printed circuit board (FPCB) is formed as the power supply wiring 85 to pass through The bottom side and the top side of the substrate 30 provide power and/or signals to the mounted controller device 70.

此外，第1圖中的（b）示出了控制器裝置70安裝到沒有邊框B的區域的基板30的底側，顯示裝置50和控制器裝置70透過形成在基板30中的通孔經由下部電路圖案80連接，並且供電佈線85用於向安裝在基板30的底側的控制器裝置70提供電力及/或訊號。In addition, (b) in Figure 1 shows that the controller device 70 is mounted on the bottom side of the substrate 30 in the area without the frame B. The display device 50 and the controller device 70 pass through the through hole formed in the substrate 30 through the lower part. The circuit patterns 80 are connected, and the power supply wiring 85 is used to provide power and/or signals to the controller device 70 mounted on the bottom side of the substrate 30.

另外，第1圖中的（c）示出了控制器裝置70安裝到基板30的底側，邊框B的區域提供以透過與FPCB對應的側面佈線90連接上部電路圖案60和控制器裝置70，並且供電佈線85用於向安裝在基板30底側的控制器裝置70提供電力及/或訊號。In addition, (c) in Figure 1 shows that the controller device 70 is mounted on the bottom side of the substrate 30, and the area of the frame B is provided to connect the upper circuit pattern 60 and the controller device 70 through the side wiring 90 corresponding to the FPCB. In addition, the power supply wiring 85 is used to provide power and/or signals to the controller device 70 mounted on the bottom side of the substrate 30.

第1圖中的（b）所示的LED顯示器具有以下缺點：機械強度太低以至於當基板由玻璃製成時基板可能破裂，並且需要形成通孔，因此在製造中需要相當多的時間、精力和成本。The LED display shown in (b) in Figure 1 has the following disadvantages: the mechanical strength is so low that the substrate may be broken when the substrate is made of glass, and through holes need to be formed, so it takes a considerable amount of time in manufacturing, Energy and cost.

此外，第1圖中的（a）和第1圖中的（c）所示的LED顯示器具有形成了邊框B的缺點，因此在螢幕上看到邊框線。特別地，即使如第1圖中的（c）所示應用側面佈線90，由於傳統的FPCB已用於側面佈線90以提供訊號和功率，因此存在看到螢幕劃分線（即邊框）的缺點。In addition, the LED displays shown in (a) in Figure 1 and (c) in Figure 1 have the disadvantage of forming a frame B, so the frame line is seen on the screen. In particular, even if the side wiring 90 is applied as shown in (c) in Figure 1, since the conventional FPCB has been used for the side wiring 90 to provide signals and power, there is a disadvantage of seeing the screen dividing line (ie, the frame).

因此，為了使LED顯示屏在功耗、螢幕亮度、對比度等方面有效，具有迷你LED或微型LED的螢幕需要配置為沒有邊框B。最終，電路配置必須採用基板的側面部分。然而，迄今為止還沒有提出一種LED顯示結構，其中螢幕配置成沒有邊框並且用於提供電力及/或訊號的佈線形成在基板的側面部分上。Therefore, in order for the LED display to be effective in terms of power consumption, screen brightness, contrast, etc., a screen with mini LEDs or micro LEDs needs to be configured without frame B. Ultimately, the circuit configuration must adopt the side part of the substrate. However, no LED display structure has been proposed so far, in which the screen is configured without a frame and wiring for supplying power and/or signals is formed on the side part of the substrate.

本發明係提供一種發光二極體（LED）顯示模組以解決前述問題，其中，透過沉積形成的導電金屬薄膜層用於配置側面佈線，以連接基板的上部電路圖案和下部電路圖案，從而去除邊框並保證顯示品質，且因此，即使在對複數個模組進行拼接以獲得所需的顯示尺寸時也看不到分割線或邊框線。The present invention provides a light emitting diode (LED) display module to solve the aforementioned problems, wherein a conductive metal thin film layer formed by deposition is used to configure side wiring to connect the upper circuit pattern and the lower circuit pattern of the substrate, thereby removing The frame also guarantees the display quality, and therefore, even when a plurality of modules are spliced to obtain the required display size, the dividing line or the frame line cannot be seen.

進一步來說，本發明的提供一種LED顯示模組，其中，複數個顯示裝置分成至少兩個分類組，並且側面佈線部分包括分別與至少兩個分類組對應堆疊的至少兩個導電金屬薄膜層，因此，具有應對在使用微型LED來製造大尺寸高解析度顯示器時所導致的窄且長的佈線的大幅增加的效果。Furthermore, the present invention provides an LED display module, wherein the plurality of display devices are divided into at least two classification groups, and the side wiring part includes at least two conductive metal film layers stacked corresponding to the at least two classification groups, Therefore, it has the effect of coping with the large increase in the narrow and long wiring caused when the micro LED is used to manufacture a large-scale high-resolution display.

根據本發明的實施例，提供了一種LED顯示模組，其包括：基板；複數個顯示裝置，該複數個顯示裝置安裝在基板的頂側；上部電路圖案，該上部電路圖案形成在基板頂側；控制器裝置，該控制器裝置安裝在基板的頂側或底側；下部電路圖案，該下部電路圖案形成在基板的底側；以及側面佈線，該側面佈線電性連接上部電路圖案和下部電路圖案；顯示裝置包括微型LED，側面佈線包括透過沉積形成的導電金屬薄膜層，並且LED顯示模組進一步包括沉積在側面佈線上的保護層。According to an embodiment of the present invention, there is provided an LED display module, which includes: a substrate; a plurality of display devices mounted on the top side of the substrate; an upper circuit pattern formed on the top side of the substrate The controller device, the controller device is installed on the top or bottom side of the substrate; the lower circuit pattern, the lower circuit pattern is formed on the bottom side of the substrate; and the side wiring, the side wiring electrically connects the upper circuit pattern and the lower circuit Pattern; The display device includes a micro LED, the side wiring includes a conductive metal film layer formed by deposition, and the LED display module further includes a protective layer deposited on the side wiring.

此外，LED顯示模組可以排列成在水平方向和垂直方向中的至少一個方向上連接以配置LED顯示器，相連接的、彼此相鄰的LED顯示模組的保護層可以彼此表面接觸，並且保護層可以包括平滑化的邊緣部分。In addition, the LED display modules may be arranged to be connected in at least one of the horizontal direction and the vertical direction to configure the LED display, and the protective layers of the connected and adjacent LED display modules may be in surface contact with each other, and the protective layer May include smoothed edge portions.

此外，複數個顯示裝置可以分為至少兩個分類組，並且側面佈線可以包括分別與至少兩個分類組對應堆疊的至少兩個導電金屬薄膜層，以及***在相鄰的導電金屬薄膜層之間的絕緣層。In addition, the plurality of display devices may be divided into at least two classification groups, and the side wiring may include at least two conductive metal film layers stacked corresponding to the at least two classification groups, and inserted between adjacent conductive metal film layers The insulation layer.

第2圖是根據本發明的實施例的發光二極體（LED）顯示模組的示意性截面圖。Figure 2 is a schematic cross-sectional view of a light emitting diode (LED) display module according to an embodiment of the present invention.

如第2圖所示，根據本發明的實施例的LED顯示模組100包括：基板30，安裝在基板30的頂側的複數個顯示裝置50，形成在基板30的頂側上的上部電路圖案60，安裝在基板30的頂側或底側的控制器裝置70，形成在基板30的底側上的下部電路圖案80，以及電性連接上部電路圖案60和下部電路圖案80的側面佈線90。As shown in Figure 2, the LED display module 100 according to the embodiment of the present invention includes a substrate 30, a plurality of display devices 50 mounted on the top side of the substrate 30, and an upper circuit pattern formed on the top side of the substrate 30 60. The controller device 70 mounted on the top or bottom side of the substrate 30, the lower circuit pattern 80 formed on the bottom side of the substrate 30, and the side wiring 90 electrically connecting the upper circuit pattern 60 and the lower circuit pattern 80.

基板30可以包括形成電路圖案所需的並且透過側面部分連接電路圖案所需的任意基板。也就是說，根據本發明的基板30可以包括玻璃、印刷電路板（PCB）、可撓性印刷電路板（FPCB）、塑膠、薄膜和其類似基板中的任意一種，其上形成有電路圖案並且佈線可以位於側面部分上以用於與電路圖案電性連接。具體地，根據本發明的基板30可以在其頂部和底部安裝有各種裝置，並且在其頂部和底部分別形成有電路圖案。The substrate 30 may include any substrate required for forming a circuit pattern and connecting the circuit pattern through a side portion. That is, the substrate 30 according to the present invention may include any one of glass, printed circuit board (PCB), flexible printed circuit board (FPCB), plastic, film, and the like, on which circuit patterns are formed and The wiring may be located on the side part for electrical connection with the circuit pattern. Specifically, the substrate 30 according to the present invention may have various devices mounted on the top and bottom thereof, and circuit patterns may be formed on the top and bottom thereof, respectively.

安裝在基板30的頂側上的複數個顯示裝置50可以包括LED，特別地，可以包括微型LED。因此，複數個顯示裝置50（即，複數個微型LED）安裝在基板30的頂側，從而形成顯示裝置矩陣。The plurality of display devices 50 mounted on the top side of the substrate 30 may include LEDs, and in particular, may include micro LEDs. Therefore, a plurality of display devices 50 (ie, a plurality of micro LEDs) are mounted on the top side of the substrate 30, thereby forming a matrix of display devices.

在基板30的頂側形成佈線，即用於顯示裝置50的上部電路圖案60。也就是說，上部電路圖案60形成在基板30的頂側上，並且向複數個顯示裝置50傳送電力及/或訊號。上部電路圖案60透過側面佈線90從基板30的下側向複數個顯示裝置50傳送電力及/或訊號。A wiring is formed on the top side of the substrate 30, that is, the upper circuit pattern 60 for the display device 50. That is, the upper circuit pattern 60 is formed on the top side of the substrate 30, and transmits power and/or signals to the plurality of display devices 50. The upper circuit pattern 60 transmits power and/or signals from the lower side of the substrate 30 to the plurality of display devices 50 through the side wiring 90.

為了控制複數個顯示裝置50的訊號，控制器裝置70安裝到基板30的頂側或底側。然而，根據本發明的LED顯示模組100採用不具有邊框的結構，因此控制器裝置70可以安裝到基板30的底側。除了控制器裝置70之外，其他必要裝置可以單獨安裝到基板30的底側。與此類似的是，控制器裝置70和用於控制複數個顯示裝置50和收發電訊號的各種相關裝置可以安裝到基板30的底側。In order to control the signals of the plurality of display devices 50, the controller device 70 is installed on the top side or the bottom side of the substrate 30. However, the LED display module 100 according to the present invention adopts a structure without a frame, so the controller device 70 can be mounted on the bottom side of the substrate 30. In addition to the controller device 70, other necessary devices may be separately mounted to the bottom side of the substrate 30. Similarly, the controller device 70 and various related devices for controlling a plurality of display devices 50 and transmitting and receiving electrical signals can be installed on the bottom side of the substrate 30.

下部電路圖案80形成在基板的底側。也就是說，佈線（即，用於控制器裝置70的下部電路圖案80等）形成在基板30的底側。因此，如第2圖所示，用於電性連接上部電路圖案60和下部電路圖案80的側面佈線90形成在基板側面部分10上。The lower circuit pattern 80 is formed on the bottom side of the substrate. That is, wiring (ie, the lower circuit pattern 80 for the controller device 70 and the like) is formed on the bottom side of the substrate 30. Therefore, as shown in FIG. 2, the side wiring 90 for electrically connecting the upper circuit pattern 60 and the lower circuit pattern 80 is formed on the side surface portion 10 of the substrate.

側面佈線90形成在基板側面部分10上。具體地，如第3圖所示，根據本發明的基板側面部分10包括基板30的側面11和鄰近基板30的側面11的基板30的頂部（即，側面相鄰頂部13）和底部（即，側面相鄰底部15），以及形成在基板側面部分10上的側面佈線90，側面佈線90用於電性連接形成在基板30的頂部上的上部電路圖案60和形成在基板30的底部上的下部電路圖案80。The side wiring 90 is formed on the side surface portion 10 of the substrate. Specifically, as shown in FIG. 3, the substrate side portion 10 according to the present invention includes the side surface 11 of the substrate 30 and the top (ie, the side adjacent to the top 13) and the bottom (ie, The side is adjacent to the bottom 15), and the side wiring 90 formed on the side portion 10 of the substrate. The side wiring 90 is used to electrically connect the upper circuit pattern 60 formed on the top of the substrate 30 and the lower portion formed on the bottom of the substrate 30 Circuit pattern 80.

形成在基板側面部分10上的側面佈線90具有如第2圖所示的ㄷ字形的截面，以電性連接上部電路圖案60和下部電路圖案80。如第3圖所示，因為側面佈線90具有用於上部電路圖案60和下部電路圖案80之間的電性連接的ㄷ字形，因此形成有側面佈線90的基板側面部分10與包括基板30的側面11對應，並且與包括側面相鄰頂部13和側面相鄰底部15的部分對應。The side wiring 90 formed on the side surface portion 10 of the substrate has a U-shaped cross section as shown in FIG. 2 to electrically connect the upper circuit pattern 60 and the lower circuit pattern 80. As shown in Figure 3, because the side wiring 90 has a U shape for electrical connection between the upper circuit pattern 60 and the lower circuit pattern 80, the side surface portion 10 of the substrate where the side wiring 90 is formed and the side surface including the substrate 30 11 corresponds to, and corresponds to a portion including a side-adjacent top 13 and a side-adjacent bottom 15.

與使用FPCB的傳統方法相反的是，根據本發明的形成在基板側面部分10上的側面佈線90透過電漿沉積方法等形成。也就是說，根據本發明的側面佈線90可以包括透過沉積形成的導電金屬薄膜層。Contrary to the conventional method using FPCB, the side wiring 90 formed on the side surface portion 10 of the substrate according to the present invention is formed through a plasma deposition method or the like. That is, the side wiring 90 according to the present invention may include a conductive metal thin film layer formed by deposition.

與此類似的是，採用透過沉積形成的導電金屬薄膜層作為根據本發明的側面佈線90。因此，當根據本發明的LED顯示模組100連接並組成LED顯示器時，在顯示器螢幕上看不到邊框線。特別地，當形成厚度為2~10μm的導電金屬薄膜層作為橫向的側面佈線90時，在顯示器螢幕上看不到邊框線。Similar to this, a conductive metal thin film layer formed by deposition is used as the side wiring 90 according to the present invention. Therefore, when the LED display module 100 according to the present invention is connected to form an LED display, the bezel line cannot be seen on the display screen. In particular, when a conductive metal thin film layer with a thickness of 2-10 μm is formed as the lateral side wiring 90, the frame line cannot be seen on the display screen.

同時，側面佈線90透過在真空腔室中的沉積製程形成。具體地，接收未形成側面佈線90的模組基板30（即，未形成有側面佈線90，且形成有上部電路圖案60、下部電路圖案80等的基板30），並且在真空腔室中對模組基板30執行沉積側面佈線90的製程以連接上部電路圖案60和下部電路圖案80。為此，連接端子層20分別設置在基板30的頂側和底側。At the same time, the side wiring 90 is formed through a deposition process in a vacuum chamber. Specifically, the module substrate 30 on which the side wiring 90 is not formed (that is, the substrate 30 on which the side wiring 90 is not formed and the upper circuit pattern 60, the lower circuit pattern 80, etc. are formed) is received, and the mold is aligned in a vacuum chamber The assembly substrate 30 performs a process of depositing the side wiring 90 to connect the upper circuit pattern 60 and the lower circuit pattern 80. To this end, the connection terminal layers 20 are provided on the top side and the bottom side of the substrate 30, respectively.

連接端子層20係用於透過側面佈線90電性連接上部電路圖案60和下部電路圖案80的電路圖案。形成在上部電路圖案60上的連接端子層20電性連接上部電路圖案60與沉積在基板30且在側面相鄰頂部13上的側面佈線90，並且形成在下部電路圖案80上的連接端子層20電性連接下部電路圖案80與沉積在基板30且在側面相鄰底部15上的側面佈線90。The connection terminal layer 20 is a circuit pattern for electrically connecting the upper circuit pattern 60 and the lower circuit pattern 80 through the side wiring 90. The connection terminal layer 20 formed on the upper circuit pattern 60 electrically connects the upper circuit pattern 60 and the side wiring 90 deposited on the substrate 30 and adjacent to the top 13 on the side surface, and the connection terminal layer 20 formed on the lower circuit pattern 80 The lower circuit pattern 80 is electrically connected to the side wiring 90 deposited on the substrate 30 and adjacent to the bottom 15 on the side.

側面佈線90是指透過如上所述的沉積形成的導電金屬薄膜層，並且因為側面佈線90用作電性連接上部電路圖案60和下部電路圖案80的電路圖案，所以需要保護其免受外部影響。為此，側面佈線90可以塗佈有環氧樹脂等以形成保護層40。因為側面佈線90透過沉積形成，所以根據本發明的保護層40也可以透過沉積形成，以提高製程效率並執行如第4圖所繪示的連續製程。The side wiring 90 refers to a conductive metal thin film layer formed by deposition as described above, and because the side wiring 90 serves as a circuit pattern that electrically connects the upper circuit pattern 60 and the lower circuit pattern 80, it needs to be protected from external influences. To this end, the side wiring 90 may be coated with epoxy resin or the like to form the protective layer 40. Because the side wiring 90 is formed by deposition, the protective layer 40 according to the present invention can also be formed by deposition to improve the process efficiency and perform the continuous process as shown in FIG. 4.

換句話說，如第4圖所示，根據本發明的LED顯示模組100可以進一步包括沉積在側面佈線90上的保護層40。保護層40可以在真空腔室中連續形成在側面佈線90上。In other words, as shown in FIG. 4, the LED display module 100 according to the present invention may further include a protective layer 40 deposited on the side wiring 90. The protective layer 40 may be continuously formed on the side wiring 90 in the vacuum chamber.

同時，如第6圖所示，根據本發明的基於沉積形成的保護層40可以沉積在側面佈線90上，以便於當根據本發明的LED顯示模組100透過表面接觸以組成單個大尺寸LED顯示器時，可以保護側面佈線90並使其電絕緣。At the same time, as shown in Figure 6, the protective layer 40 formed based on deposition according to the present invention can be deposited on the side wiring 90, so that when the LED display module 100 according to the present invention contacts through the surface to form a single large-size LED display At this time, the side wiring 90 can be protected and electrically insulated.

與此類似的是，如第7圖所示，根據本發明的LED顯示模組100可以排列為在水平方向和垂直方向中的至少一個方向上連接，以製作單一個大尺寸LED顯示器，並且，如第6圖所示，彼此相鄰的連接的LED顯示模組100的保護層40在表面彼此接觸，並且保護層40的各邊緣部分41平滑化。Similar to this, as shown in Fig. 7, the LED display module 100 according to the present invention can be arranged to be connected in at least one of the horizontal direction and the vertical direction to make a single large-size LED display, and, As shown in FIG. 6, the protective layers 40 of the LED display modules 100 connected adjacent to each other are in contact with each other on the surface, and each edge portion 41 of the protective layer 40 is smoothed.

第7圖示出了六個LED顯示模組100水平且垂直相鄰，以形成單個大尺寸LED顯示器。在這種情況下，LED顯示模組100基於其保護層40之間的表面接觸與相鄰的LED顯示模組100連接。為了防止在透過表面接觸連接LED顯示模組100時發生LED顯示模組100的損壞或破損或使LED顯示模組100的損壞或破損最小化，要平滑化（rounded）進行表面接觸的保護層40的邊緣部分41（見第4圖）。同時，保護層40沉積在側面佈線90上並且連續形成在側面佈線90上，因此側面佈線90也可以具有彎曲（curved）的邊緣部分95（見第2圖）。Figure 7 shows that six LED display modules 100 are horizontally and vertically adjacent to each other to form a single large-size LED display. In this case, the LED display module 100 is connected to the adjacent LED display module 100 based on the surface contact between the protective layers 40 thereof. In order to prevent damage or breakage of the LED display module 100 when the LED display module 100 is connected through surface contact, or to minimize the damage or damage of the LED display module 100, the protective layer 40 for surface contact should be rounded. The edge part 41 (see Figure 4). At the same time, the protective layer 40 is deposited on the side wiring 90 and continuously formed on the side wiring 90, so the side wiring 90 may also have a curved edge portion 95 (see FIG. 2).

根據本發明的LED顯示模組100可以包括微型LED顯示模組並配置高解析度和大尺寸的微型LED顯示器。結果是，複數個顯示裝置50（微型LED）的數量增加，因此上部電路圖案60等的佈線也大大增加。因此，可能出現的問題是，單層導電金屬薄膜層對側面佈線90來說是不夠的，從而使微型LED和與連接到下部電路圖案80的微型LED連接的複數個上部電路圖案60等的佈線的數量大大增加。The LED display module 100 according to the present invention may include a micro LED display module and be configured with a high-resolution and large-size micro LED display. As a result, the number of the plurality of display devices 50 (micro LEDs) increases, and therefore the wiring of the upper circuit pattern 60 and the like also greatly increases. Therefore, there may be a problem that a single conductive metal film layer is not enough for the side wiring 90, so that the wiring of the micro LED and the plurality of upper circuit patterns 60 connected to the micro LED connected to the lower circuit pattern 80, etc. The number has greatly increased.

為了解決這樣的問題，LED顯示模組100包括分成複數個分類組的複數個顯示裝置50，以與複數個導電金屬薄膜層對應電性連接，並且側面佈線90包括複數個導電金屬薄膜層91（見第5圖中的元件符號91），以與複數個分類組對應電性連接。在複數個導電金屬薄膜層91中，彼此相鄰的導電金屬薄膜層91可以透過絕緣層93彼此電隔離。In order to solve such problems, the LED display module 100 includes a plurality of display devices 50 divided into a plurality of classification groups to be electrically connected to the plurality of conductive metal film layers, and the side wiring 90 includes a plurality of conductive metal film layers 91 ( See component symbol 91) in Figure 5 to be electrically connected to a plurality of classification groups. Among the plurality of conductive metal thin film layers 91, the conductive metal thin film layers 91 adjacent to each other can be electrically isolated from each other through the insulating layer 93.

與此類似的是，根據本發明的複數個顯示裝置50可以分成至少兩個分類組，並且，如第5圖所示，側面佈線90可以包括分別與至少兩個分類組對應堆疊的至少兩個導電金屬薄膜層91，以及形成在相鄰的導電金屬薄膜層91之間的絕緣層93。Similar to this, the plurality of display devices 50 according to the present invention can be divided into at least two classification groups, and, as shown in FIG. 5, the side wiring 90 can include at least two that are respectively stacked corresponding to the at least two classification groups. A conductive metal thin film layer 91, and an insulating layer 93 formed between adjacent conductive metal thin film layers 91.

根據本發明的側面佈線90可以透過如上所述的沉積形成。在下文中，將示意性地說明應用於本發明的側面佈線90的沉積形成製程。The side wiring 90 according to the present invention can be formed by deposition as described above. Hereinafter, the deposition forming process of the side wiring 90 applied to the present invention will be schematically explained.

首先，對要形成佈線的基板側面部分10設置掩模。也就是說，用於沉積的掩模附接到基板，從而對將要形成佈線的基板側面部分10進行掩模處理。基板側面部分的掩模製程包括將用於沉積的掩模附接到基板30的操作，使得佈線可以在真空腔室中沉積在基板側面部分10上。用於沉積的掩模形成為具有ㄈ字形形狀，並因此附接到基板的頂部和底部以及基板30的基板側面部分10。First, a mask is provided on the side surface portion 10 of the substrate where wiring is to be formed. That is, a mask for deposition is attached to the substrate, thereby masking the side portion 10 of the substrate where wiring is to be formed. The masking process of the side portion of the substrate includes an operation of attaching a mask for deposition to the substrate 30 so that wiring can be deposited on the side portion 10 of the substrate in a vacuum chamber. The mask for deposition is formed to have a U-shaped shape, and thus is attached to the top and bottom of the substrate and the substrate side portion 10 of the substrate 30.

用於沉積的掩模可以透過膜、金屬和油墨印刷形成。特別地，用於沉積的掩模可以以聚醯亞胺（PI）膜的形式提供。當PI膜作為用於沉積的掩模時，用於沉積的掩模緊密地附接到包括基板側面部分10的基板30，且其之間具有各種黏合劑。The mask used for deposition can be formed through film, metal and ink printing. In particular, the mask for deposition may be provided in the form of a polyimide (PI) film. When the PI film is used as a mask for deposition, the mask for deposition is closely attached to the substrate 30 including the substrate side portion 10 with various adhesives therebetween.

在PI膜掩模和基板30之間***黏合劑，首先對PI膜掩模進行臨時接合處理，以便在預定的處理條件下臨時附接到基板30上，然後執行確定的黏合過程，以便在預定的處理條件下黏合到基板30上。Insert an adhesive between the PI film mask and the substrate 30, first perform a temporary bonding process on the PI film mask to temporarily attach it to the substrate 30 under predetermined processing conditions, and then perform a definite bonding process in order to Bonded to the substrate 30 under the processing conditions of the same.

當完成將用於沉積的掩模黏合到包括將在其上形成佈線的基板側面部分10的基板30上的掩模操作時，對掩模基板30執行沉積製程。也就是說，將掩模基板30引入真空腔室，然後透過濺射在基板側面部分10上形成佈線。When the masking operation of bonding the mask for deposition to the substrate 30 including the substrate side portion 10 on which the wiring is to be formed is completed, a deposition process is performed on the mask substrate 30. That is, the mask substrate 30 is introduced into the vacuum chamber, and then wiring is formed on the substrate side portion 10 by sputtering.

同時，真空腔室中的沉積製程用於形成側面佈線90，因此與形成在基板側面部分10上的側面佈線90對應的導電金屬薄膜層在真空腔室內沉積。為了形成高品質的佈線，可以在形成導電金屬薄膜層之前在基板側面部分10上形成與晶種層對應的黏合金屬層。換句話說，根據本發明，與晶種層對應的黏合金屬層、與側面佈線90對應的導電金屬薄膜層和保護層依次沉積在基板側面部分10上。At the same time, the deposition process in the vacuum chamber is used to form the side wiring 90, so the conductive metal thin film layer corresponding to the side wiring 90 formed on the side portion 10 of the substrate is deposited in the vacuum chamber. In order to form high-quality wiring, a bonding metal layer corresponding to the seed layer may be formed on the side surface portion 10 of the substrate before forming the conductive metal thin film layer. In other words, according to the present invention, the bonding metal layer corresponding to the seed layer, the conductive metal thin film layer corresponding to the side wiring 90 and the protective layer are sequentially deposited on the side portion 10 of the substrate.

黏合金屬層可包含導電材料，例如，金屬材料。金屬材料可包括鎳（Ni）和鉻（Cr）、鈦（Ti）、鉬（Mo）、不銹鋼（SUS）或其合金中的一種作為單層或多層。The bonding metal layer may include a conductive material, for example, a metal material. The metal material may include one of nickel (Ni) and chromium (Cr), titanium (Ti), molybdenum (Mo), stainless steel (SUS), or alloys thereof as a single layer or multiple layers.

例如，黏合金屬層可以包含鎳和鉻的合金。包括鎳和鉻的黏合金屬層中鎳與鉻的重量比可以在8：2至9.5：0.5的範圍內選擇。鉻可以改善、增強基板（特別是塑膠基板）和導電金屬薄膜層之間的黏合力。由鎳鉻合金製成的黏合金屬層可以使基板和導電金屬薄膜層之間的黏合力比僅包含鎳的黏合金屬層的黏合力增強約1.5倍。For example, the bonding metal layer may include an alloy of nickel and chromium. The weight ratio of nickel to chromium in the bonding metal layer including nickel and chromium can be selected in the range of 8:2 to 9.5:0.5. Chromium can improve and enhance the adhesion between the substrate (especially the plastic substrate) and the conductive metal film layer. The bonding metal layer made of nickel-chromium alloy can increase the bonding force between the substrate and the conductive metal film layer by about 1.5 times than that of the bonding metal layer containing only nickel.

當黏合金屬層包含鎳和鉻的合金時，與僅包含鎳的黏合金屬層相比，沉積製程的薄膜形成效率得到改善。僅使用具有磁性的鎳進行的濺射以執行的沉積，可能降低黏合金屬層的薄膜厚度均勻性或其品質。然而，根據本發明的實施例，使用鎳鉻合金進行的濺射改善了所形成的薄膜的品質，並且如上所述增強了基板和導電金屬薄膜層之間的黏合力。When the bonding metal layer contains an alloy of nickel and chromium, the film formation efficiency of the deposition process is improved compared with the bonding metal layer containing only nickel. The deposition performed by sputtering using only magnetic nickel may reduce the film thickness uniformity or quality of the bonding metal layer. However, according to an embodiment of the present invention, sputtering using a nickel-chromium alloy improves the quality of the formed film, and enhances the adhesion between the substrate and the conductive metal film layer as described above.

在透過沉積在基板側面部分10上形成黏合金屬層之後，在黏合金屬層上形成與側面佈線90對應的導電金屬薄膜層。可以形成包括各種金屬或合金的導電金屬薄膜層。例如，導電金屬薄膜層可以包含銅，或者可以設置為包含高於約85wt％的錫（Sn）的錫（Sn）基無鉛金屬層。除了錫（Sn）之外，導電金屬薄膜層可以包含銀（Ag）、銅（Cu）、鉍（Bi）、鋅（Zn）和銦（In）中的至少一種。在導電金屬薄膜層包含銀（Ag）和銅（Cu）的情況下，導電金屬薄膜層可以包含比銅（Cu）更多的銀（Ag）以具有更低的熔點。After the bonding metal layer is formed on the side surface portion 10 of the substrate by deposition, a conductive metal thin film layer corresponding to the side wiring 90 is formed on the bonding metal layer. A conductive metal thin film layer including various metals or alloys can be formed. For example, the conductive metal thin film layer may include copper, or may be provided as a tin (Sn)-based lead-free metal layer including tin (Sn) higher than about 85% by weight. In addition to tin (Sn), the conductive metal thin film layer may contain at least one of silver (Ag), copper (Cu), bismuth (Bi), zinc (Zn), and indium (In). In the case where the conductive metal thin film layer contains silver (Ag) and copper (Cu), the conductive metal thin film layer may contain more silver (Ag) than copper (Cu) to have a lower melting point.

在如上所述的透過濺射將導電金屬薄膜層沉積在黏合金屬層上之後，在相同的腔室內透過濺射將保護層40沉積在導電金屬薄膜層上。After the conductive metal thin film layer is deposited on the bonding metal layer by sputtering as described above, the protective layer 40 is deposited on the conductive metal thin film layer by sputtering in the same chamber.

保護層40可包含金屬材料。例如，如黏合金屬層一樣，保護金屬材料可以包括鎳（Ni）和鉻（Cr）、鈦（Ti）、鉬（Mo）、不銹鋼（SUS）或它們的合金中的一種。較佳地，保護層由與相同腔室內的黏合金屬層相同的材料製成。與此類似，黏合金屬層和保護層由一個腔室內的相同材料製成，從而簡化了整個過程，從而使製造基板的時間、精力和成本最小化。保護層保護導電金屬薄膜層在製造、分配等過程中免受腐蝕和污染。The protective layer 40 may include a metal material. For example, like the bonding metal layer, the protective metal material may include one of nickel (Ni) and chromium (Cr), titanium (Ti), molybdenum (Mo), stainless steel (SUS), or their alloys. Preferably, the protective layer is made of the same material as the bonding metal layer in the same cavity. Similarly, the bonding metal layer and the protective layer are made of the same material in one chamber, which simplifies the entire process, thereby minimizing the time, effort, and cost of manufacturing the substrate. The protective layer protects the conductive metal thin film layer from corrosion and pollution during manufacturing and distribution.

同時，如上所述，形成在基板側面部分10上的佈線透過在同一腔室內濺射依次堆疊黏合金屬層、與側面佈線90對應的導電金屬薄膜層和保護層而形成，並且因此，各金屬層都可以進行離子束處理。換句話說，用於本發明的真空腔室可以使用如上所述的離子束處理，因此在形成各金屬層之前執行離子束處理，從而增強基板和黏合金屬層之間以及金屬層之間的附接、黏合和緊密接觸。Meanwhile, as described above, the wiring formed on the side surface portion 10 of the substrate is formed by sequentially stacking the bonding metal layer, the conductive metal thin film layer corresponding to the side wiring 90, and the protective layer in the same chamber by sputtering, and therefore, each metal layer Both can be processed by ion beam. In other words, the vacuum chamber used in the present invention can use the ion beam treatment as described above, so the ion beam treatment is performed before the formation of each metal layer, thereby enhancing the adhesion between the substrate and the bonding metal layer and between the metal layers. Bonding, bonding and close contact.

具體地，在一個真空腔室內，首先對基板側面部分10進行離子束處理，然後透過濺射將黏合金屬層沉積在基板側面部分10上。接下來，對黏合金屬層進行離子束處理，然後透過濺射將與側面佈線90對應的導電金屬薄膜層沉積在黏合金屬層上。接下來，對導電金屬薄膜層進行離子束處理，然後透過濺射將保護層沉積在導電金屬薄膜層上。與此類似，在形成金屬層之前，在一個真空腔室中進行離子束處理，從而透過簡化的製程和簡化的設備結構，以增強基板和金屬層之間以及金屬層之間的緊密接觸，從而提高製造基板的效率。Specifically, in a vacuum chamber, the side surface portion 10 of the substrate is first subjected to ion beam treatment, and then the bonding metal layer is deposited on the side portion 10 of the substrate through sputtering. Next, ion beam processing is performed on the bonding metal layer, and then a conductive metal thin film layer corresponding to the side wiring 90 is deposited on the bonding metal layer by sputtering. Next, ion beam treatment is performed on the conductive metal thin film layer, and then the protective layer is deposited on the conductive metal thin film layer by sputtering. Similarly, before the metal layer is formed, ion beam treatment is performed in a vacuum chamber to enhance the close contact between the substrate and the metal layer and between the metal layer through simplified manufacturing process and simplified device structure. Improve the efficiency of manufacturing substrates.

針對技術問題和技術解決方案使用根據本發明的LED顯示模組，透過沉積形成的導電金屬薄膜層用於配置側面佈線，以連接基板的上部電路圖案和下部電路圖案，從而去除邊框，且因此，即使當複數個模組經過拼接以獲得所需的顯示尺寸時也看不到分割線或邊框線，從而保證顯示品質。For technical problems and technical solutions, the LED display module according to the present invention is used, and the conductive metal thin film layer formed by deposition is used to configure side wiring to connect the upper circuit pattern and the lower circuit pattern of the substrate, thereby removing the frame, and therefore, Even when a plurality of modules are spliced to obtain the required display size, the dividing line or the border line cannot be seen, thereby ensuring the display quality.

此外，根據本發明，複數個顯示裝置分成至少兩個分類組，並且側面佈線包括分別與至少兩個分類組對應堆疊的至少兩個導電金屬薄膜層，因此，當使用微型LED來製造大尺寸高解析度顯示器時，可以處理窄佈線和長佈線的大幅增加而產生影響。In addition, according to the present invention, a plurality of display devices are divided into at least two classification groups, and the side wiring includes at least two conductive metal thin film layers stacked corresponding to the at least two classification groups. In the case of a high-resolution display, it is possible to deal with a large increase in narrow wiring and long wiring and have an impact.

儘管已經繪示出並說明了本發明的一些示例性實施例，然而，這些實施例僅用於說明目的，並且本領域具有通常知識者將理解，在不脫離本發明的原理和精神的情況下，可以對這些實施例進行改變，本發明的範圍由所附申請專利範圍及其等同物限定。Although some exemplary embodiments of the present invention have been illustrated and described, these embodiments are for illustrative purposes only, and those with ordinary knowledge in the art will understand that without departing from the principle and spirit of the present invention Changes may be made to these embodiments, and the scope of the present invention is defined by the scope of the attached patent application and its equivalents.

10:基板側面部分 11:側面 13:側面相鄰頂部 15:側面相鄰底部 20:連接端子層 30:基板 40:保護層 41,95:邊緣部分 50:顯示裝置 60:上部電路圖案 70:控制器裝置 80:下部電路圖案 85:供電佈線 90:側面佈線 91:導電金屬薄膜層 93:絕緣層 100:LED顯示模組10: Side part of the substrate 11: side 13: Side adjacent to the top 15: The side is adjacent to the bottom 20: Connect the terminal layer 30: substrate 40: protective layer 41, 95: edge part 50: display device 60: upper circuit pattern 70: Controller device 80: lower circuit pattern 85: power supply wiring 90: Side wiring 91: conductive metal film layer 93: Insulation layer 100: LED display module

從以下結合附圖對示例性實施例的說明，本發明的上述及/或其他態樣將變得顯而易見並且更容易理解。 第1圖是傳統發光二極體（LED）顯示模組的示意性截面圖； 第2圖是根據本發明的實施例的LED顯示模組的示意性截面圖，並且第3圖是根據本發明的實施例的LED顯示模組中的基板側面部分的示意性截面圖； 第4圖是根據本發明的另一實施例的LED顯示模組的示意性截面圖； 第5圖是根據本發明的實施例的LED顯示模組中的側面佈線的示意性截面圖； 第6圖是根據本發明的實施例的LED顯示模組的連接狀態的截面圖；以及 第7圖繪示出了根據本發明的實施例的透過連接複數個LED顯示模組而完成的顯示器。From the following description of the exemplary embodiments in conjunction with the accompanying drawings, the above and/or other aspects of the present invention will become obvious and easier to understand. Figure 1 is a schematic cross-sectional view of a traditional light emitting diode (LED) display module; Figure 2 is a schematic cross-sectional view of an LED display module according to an embodiment of the present invention, and Figure 3 is a schematic cross-sectional view of a side part of a substrate in the LED display module according to an embodiment of the present invention; Figure 4 is a schematic cross-sectional view of an LED display module according to another embodiment of the present invention; Figure 5 is a schematic cross-sectional view of the side wiring in the LED display module according to the embodiment of the present invention; FIG. 6 is a cross-sectional view of the connection state of the LED display module according to the embodiment of the present invention; and FIG. 7 illustrates a display completed by connecting a plurality of LED display modules according to an embodiment of the present invention.

20:連接端子層20: Connect the terminal layer

30:基板30: substrate

50:顯示裝置50: display device

60:上部電路圖案60: upper circuit pattern

70:控制器裝置70: Controller device

80:下部電路圖案80: lower circuit pattern

90:側面佈線90: Side wiring

95:邊緣部分95: edge part

100:LED顯示模組100: LED display module

Claims (3)

一種發光二極體LED顯示模組，該LED顯示模組包括： 一基板；複數個顯示裝置，該複數個顯示裝置安裝在該基板的一頂側；一上部電路圖案，該上部電路圖案形成在該基板的該頂側；一控制器裝置，該控制器裝置安裝在該基板的該頂側或一底側；一下部電路圖案，該下部電路圖案形成在該基板的該底側；以及一側面佈線，該側面佈線電性連接該上部電路圖案和該下部電路圖案， 該顯示裝置包括一微型LED， 該側面佈線包括透過沉積形成的一導電金屬薄膜層，並且 該LED顯示模組進一步包括沉積在該側面佈線上的一保護層。A light-emitting diode LED display module, the LED display module includes: A substrate; a plurality of display devices, the plurality of display devices are mounted on a top side of the substrate; an upper circuit pattern, the upper circuit pattern is formed on the top side of the substrate; a controller device, the controller device is mounted On the top side or a bottom side of the substrate; a lower circuit pattern, the lower circuit pattern is formed on the bottom side of the substrate; and a side wiring, the side wiring electrically connects the upper circuit pattern and the lower circuit pattern , The display device includes a micro LED, The side wiring includes a conductive metal thin film layer formed by deposition, and The LED display module further includes a protective layer deposited on the side wiring. 根據請求項1所述的LED顯示模組，其中， 該LED顯示模組係佈置為在水平方向和垂直方向中的至少一個方向上連接以配置一LED顯示器， 彼此相鄰的連接的該LED顯示模組的該保護層在表面彼此接觸，並且 該保護層包括一圓角形邊緣部分。The LED display module according to claim 1, wherein: The LED display module is arranged to be connected in at least one of the horizontal direction and the vertical direction to configure an LED display, The protective layers of the LED display modules connected adjacent to each other are in contact with each other on the surface, and The protective layer includes a rounded edge portion. 根據請求項1所述的LED顯示模組，其中， 該複數個顯示裝置分為至少兩個一分類組， 該側面佈線包括分別與至少兩個該分類組對應堆疊的至少兩個該導電金屬薄膜層，以及***在相鄰的該導電金屬薄膜層之間的一絕緣層。The LED display module according to claim 1, wherein: The plurality of display devices are divided into at least two classification groups, The side wiring includes at least two of the conductive metal film layers stacked corresponding to at least two of the classification groups, and an insulating layer inserted between the adjacent conductive metal film layers.
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