TW202129803A - Method of cleaning grinding chamber capable of reducing the usage amount of the grinding water in comparison with a grinding wheel of a wheel base having a through hole that penetrates in a substantially lateral direction - Google Patents

Method of cleaning grinding chamber capable of reducing the usage amount of the grinding water in comparison with a grinding wheel of a wheel base having a through hole that penetrates in a substantially lateral direction Download PDF

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TW202129803A
TW202129803A TW109144258A TW109144258A TW202129803A TW 202129803 A TW202129803 A TW 202129803A TW 109144258 A TW109144258 A TW 109144258A TW 109144258 A TW109144258 A TW 109144258A TW 202129803 A TW202129803 A TW 202129803A
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grinding
wheel
water
rotation speed
chamber
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TW109144258A
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Chinese (zh)
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山中聡
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日商迪思科股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/007—Cleaning of grinding wheels
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0023—Other grinding machines or devices grinding machines with a plurality of working posts
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/20—Drives or gearings; Equipment therefor relating to feed movement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Auxiliary Devices For Machine Tools (AREA)

Abstract

An object of the invention is to provide a method of cleaning a grinding chamber, which is capable of reducing the usage amount of the grinding water in comparison with a grinding wheel of a wheel base having a through hole that penetrates in a substantially lateral direction. To achieve the object, there is provided a method of cleaning a grinding chamber, which includes a scattering step for supplying the grinding water from a grinding water supply source to the grinding stone part of a grinding unit through the inside of the wheel base and rotating a spindle to scatter the grinding water supplied to the grinding stone part to an inner wall of the grinding chamber that accommodates the grinding wheel by the centrifugal force, in which the grinding unit includes the grinding wheel and the spindle, the grinding wheel has a ring-shaped wheel base and an annular grindstone part disposed on one side of the wheel base, and the spindle is mounted with a grinding wheel; and a splash-down height changing step for using a moving unit capable of moving the grinding unit in an up-down direction to move the grinding wheel in the grinding chamber in at least one of the up and down directions, thereby changing the height of the grinding water splashing onto the inner wall of the grinding chamber.

Description

研削室之洗淨方法How to clean the grinding room

本發明關於研削室之洗淨方法，其洗淨研削裝置中容納有研削輪之研削室。The present invention relates to a method for cleaning a grinding chamber. The cleaning and grinding device contains a grinding chamber containing a grinding wheel.

研削半導體晶圓等被加工物之研削裝置具備用於研削被加工物之研削單元。研削單元具備：與垂直方向大致平行配置之主軸、以及固定於主軸下端之輪安裝件，在輪安裝件的下表面裝設有圓環狀的研削輪。The grinding device for grinding semiconductor wafers and other workpieces is equipped with a grinding unit for grinding the workpiece. The grinding unit is equipped with a spindle arranged substantially parallel to the vertical direction, and a wheel mount fixed to the lower end of the spindle, and an annular grinding wheel is mounted on the lower surface of the wheel mount.

研削輪具備：圓環狀的輪基台；以及多個研削磨石，其等在輪基台之底面側沿著輪基台的周方向而離散地裝設。研削裝置中，連接有儲存純水等研削水的研削水供給源。The grinding wheel includes a ring-shaped wheel base, and a plurality of grinding grindstones, which are discretely installed along the circumferential direction of the wheel base on the bottom surface side of the wheel base. The grinding device is connected to a grinding water supply source that stores grinding water such as pure water.

又，在主軸、輪安裝件及研削輪中，形成有用於使研削水通過之流路。在研削被加工物之情形，研削水係由研削水供給源經過形成於研削輪之流路的開口而被供往被加工物。In addition, in the main shaft, the wheel mount, and the grinding wheel, a flow path for passing the grinding water is formed. In the case of grinding the workpiece, the grinding water system is supplied to the workpiece from the grinding water supply source through the opening formed in the flow path of the grinding wheel.

研削裝置進一步具備：保持台，其吸引保持被加工物；以及研削室，其容納保持台及研削輪。研削室的空間係藉由板狀的蓋構件所規定。在蓋構件的頂板形成有用以使主軸貫通之開口，並藉由蓋構件的頂板及側板而覆蓋研削輪的上方及側邊。The grinding device further includes: a holding table that sucks and holds the workpiece; and a grinding room that houses the holding table and the grinding wheel. The space of the grinding room is defined by a plate-shaped cover member. The top plate of the cover member is formed with an opening for allowing the main shaft to pass through, and the top plate and the side plate of the cover member cover the upper and the sides of the grinding wheel.

在以研削裝置研削被加工物時，首先以保持台保持被加工物之一面側。接著，在使保持台與研削輪在相同方向旋轉之狀態下，一邊將研削水供給至研削輪，一邊將研削單元沿著垂直方向往下方加工進給。When grinding the workpiece with the grinding device, firstly, one side of the workpiece is held by the holding table. Next, while the holding table and the grinding wheel are rotated in the same direction, grinding water is supplied to the grinding wheel while the grinding unit is processed and fed downward in the vertical direction.

伴隨著被加工物的研削，包含研削屑（加工屑）的研削水會往周圍飛散。飛散的結果，包含研削屑的研削水會有附著於蓋構件的內壁之情形、或成為霧狀而漂浮於研削室之情形。With the grinding of the workpiece, grinding water including grinding chips (machining chips) will scatter around. As a result of the scattering, the grinding water containing grinding chips may adhere to the inner wall of the cover member, or may become mist and float in the grinding chamber.

例如，包含研削屑的研削水會附著於研削室的內壁。若研削室的內壁被包含研削屑的水滴弄髒，則此髒污有可能會影響被加工物的研削，因此需要定期地清掃研削室的內壁。For example, grinding water containing grinding chips may adhere to the inner wall of the grinding chamber. If the inner wall of the grinding chamber is soiled by water droplets containing grinding debris, this dirt may affect the grinding of the workpiece, so it is necessary to clean the inner wall of the grinding chamber regularly.

為了降低清掃研削室時的作業時間，已知有一種特殊輪基台，其在研削時可進行研削室的洗淨（例如，參考專利文獻1）。在此輪基台中，沿著輪基台的周方向而離散地形成多個貫通孔，所述多個貫通孔係分別從內側面起在大致橫方向貫通至外側面為止。 [習知技術文獻] [專利文獻]In order to reduce the working time when cleaning the grinding chamber, a special wheel base is known that can clean the grinding chamber during grinding (for example, refer to Patent Document 1). In this wheel base, a plurality of through holes are formed discretely along the circumferential direction of the wheel base, and the plurality of through holes respectively penetrate from the inner surface to the outer surface in a substantially horizontal direction. [Literature Technical Literature] [Patent Literature]

[專利文獻1]日本特開2015-199146號公報[Patent Document 1] Japanese Patent Application Publication No. 2015-199146

[發明所欲解決的課題] 若使用附有此貫通孔的輪基台，則研削被加工物時使純水等研削水從貫通孔往外側飛散，藉此可洗淨研削室的內壁。但是，附有貫通孔的輪基台需要在一般的輪基台形成多個貫通孔之特殊加工，製造費工。[The problem to be solved by the invention] If a wheel base with this through hole is used, grinding water such as pure water is scattered from the through hole to the outside when grinding the workpiece, thereby cleaning the inner wall of the grinding chamber. However, the wheel base with through-holes requires special processing to form a plurality of through-holes in the general wheel base, and the manufacturing is labor-intensive.

再者，在使用附有貫通孔的輪基台之情形，供給至研削輪的研削水會被分為洗淨用之第一研削水與加工用之第二研削水。第一研削水係不經由研削磨石而由貫通孔直接往外側飛散，第二研削水係供給至被加工物與研削磨石的接觸區域（亦即加工區域）。Furthermore, in the case of using a wheel base with a through hole, the grinding water supplied to the grinding wheel is divided into the first grinding water for washing and the second grinding water for processing. The first grinding water system directly scatters outward from the through hole without passing through the grinding grindstone, and the second grinding water system is supplied to the contact area (that is, the processing area) between the workpiece and the grinding grindstone.

因此，在研削被加工物時，除了加工用之第二研削水，還時常需要洗淨用之第一研削水，相較於使用一般輪基台之情形，有研削時的研削水的使用量增加之問題。Therefore, when grinding the workpiece, in addition to the second grinding water for processing, the first grinding water for washing is often required. Compared with the general wheel base, the amount of grinding water used during grinding is The problem of increase.

本發明係鑑於此問題點而完成者，其目的在於提供一種研削室之洗淨方法，其相較於具備形成有從內側面起在大致橫方向貫通至外側面為止的貫通孔之輪基台的研削輪，能降低研削水的使用量。The present invention was made in view of this problem, and its object is to provide a method for cleaning a grinding chamber, which is compared to a wheel base with a through hole formed from the inner surface in a substantially horizontal direction to the outer surface The grinding wheel can reduce the consumption of grinding water.

[解決課題的技術手段] 根據本發明之一態樣，提供一種研削室之洗淨方法，其係研削裝置的研削室之洗淨方法，且具備：飛散步驟，其由研削水供給源通過輪基台的內部而對研削單元的磨石部供給研削水，且使主軸旋轉，藉此使供給至該磨石部的該研削水藉由離心力飛散至容納有研削輪之研削室的內壁，其中，該研削單元具備該研削輪與該主軸，該研削輪具有：圓環狀的該輪基台、及於該輪基台之一面側配置成環狀的該磨石部，該主軸裝設有該研削輪；以及濺落高度變更步驟，其利用使該研削單元於上下方向移動的移動單元，使該研削輪於該研削室內在上方向及下方向的至少一方向移動，藉此變更該研削水濺落至該研削室的內壁的高度。[Technical means to solve the problem] According to one aspect of the present invention, there is provided a method for cleaning a grinding chamber, which is a method for cleaning the grinding chamber of a grinding device, and includes: a scattering step in which a grinding water supply source passes through the interior of the wheel base to perform grinding The grinding stone part of the unit is supplied with grinding water and the spindle is rotated, whereby the grinding water supplied to the grinding stone part is scattered by centrifugal force to the inner wall of the grinding chamber containing the grinding wheel, wherein the grinding unit is provided with the grinding wheel With the spindle, the grinding wheel has: the ring-shaped wheel base, and the grindstone portion arranged in a ring shape on one surface side of the wheel base, the spindle is equipped with the grinding wheel; and a splash height changing step , Which utilizes the moving unit that moves the grinding unit in the up and down direction to move the grinding wheel in the grinding chamber in at least one of the upper and lower directions, thereby changing the degree of splashing of the grinding water on the inner wall of the grinding chamber high.

較佳為，一邊進行該飛散步驟一邊進行該濺落高度變更步驟。Preferably, the splash height changing step is performed while performing the scattering step.

又，較佳為，研削室之洗淨方法進一步具備：旋轉速度變更步驟，其變更該主軸的旋轉速度。Furthermore, it is preferable that the cleaning method of the grinding chamber further includes a rotation speed changing step of changing the rotation speed of the spindle.

又，較佳為，研削室之洗淨方法進一步具備：流量變更步驟，其變更由該研削水供給源供給至該磨石部之研削水的流量。Furthermore, it is preferable that the cleaning method of the grinding chamber further includes a flow rate changing step of changing the flow rate of the grinding water supplied from the grinding water supply source to the grindstone part.

[發明功效] 在本發明的一態樣之研削室之洗淨方法的飛散步驟中，使供給至磨石部的研削水藉由離心力飛散至研削室的內壁，藉此洗淨研削室。如此，因研削水不用分成洗淨用與加工用，故相較於將研削水分開的情形，可降低研削時的研削水的使用量。[Efficacy of invention] In the scattering step of the method for cleaning the grinding chamber of one aspect of the present invention, the grinding water supplied to the grindstone portion is scattered to the inner wall of the grinding chamber by centrifugal force, thereby washing the grinding chamber. In this way, since the grinding water does not need to be divided into washing and processing purposes, compared to the case where the grinding water is separated, the amount of grinding water used during grinding can be reduced.

再者，在濺落高度變更步驟中，利用移動單元使研削單元沿著上下方向移動，藉此可變更研削水濺落至研削室的內壁的高度。因此，即使在使用一般的研削輪之情形，亦可大範圍地洗淨研削室的內壁。Furthermore, in the step of changing the splash height, the moving unit is used to move the grinding unit in the vertical direction, whereby the height at which the grinding water splashes onto the inner wall of the grinding chamber can be changed. Therefore, even in the case of using a general grinding wheel, the inner wall of the grinding chamber can be cleaned in a wide range.

參考隨附圖式，說明本發明的一態樣之實施方式。圖1為研削裝置2的立體圖。研削裝置2具備大致長方體形狀的基台4。此外，在圖1中，以功能方塊表示研削裝置2的部分構成要素。又，X軸方向、Y軸方向、及Z軸方向（上下方向、垂直方向、加工進給方向）係互相正交。With reference to the accompanying drawings, one aspect of the implementation of the present invention will be described. FIG. 1 is a perspective view of the grinding device 2. The grinding device 2 includes a base 4 having a substantially rectangular parallelepiped shape. In addition, in FIG. 1, some constituent elements of the grinding device 2 are shown as functional blocks. In addition, the X-axis direction, the Y-axis direction, and the Z-axis direction (up and down direction, vertical direction, and machining feed direction) are orthogonal to each other.

在基台4的前方（Y軸方向的一側）形成有凹部4a，在此凹部4a中設置有搬送機器人6。在凹部4a的X軸方向的一側有卡匣載置區域8a，在凹部4a的X軸方向的另一側有卡匣載置區域8b。A recessed portion 4 a is formed in the front of the base 4 (one side in the Y-axis direction), and a transport robot 6 is provided in the recessed portion 4 a. There is a cassette placement area 8a on one side of the recessed portion 4a in the X-axis direction, and a cassette placement area 8b on the other side of the recessed portion 4a in the X-axis direction.

在卡匣載置區域8a上載置有卡匣10a，所述卡匣10a容納有加工前之一個以上的被加工物（未圖示）。又，在卡匣載置區域8b上載置有卡匣10b，所述卡匣10b容納加工後之一個以上的被加工物。A cassette 10a is placed on the cassette placement area 8a, and the cassette 10a contains one or more to-be-processed objects (not shown) before processing. In addition, a cassette 10b is placed on the cassette placement area 8b, and the cassette 10b accommodates one or more to-be-processed objects after processing.

在卡匣載置區域8a的後方（Y軸方向的另一側）設置有定位台12，所述定位台12決定被搬送機器人6搬出之被加工物的位置。在定位台12的X軸方向的另一側設置有裝載臂14。A positioning table 12 is provided behind the cassette placement area 8 a (the other side in the Y-axis direction), and the positioning table 12 determines the position of the workpiece carried out by the transport robot 6. A loading arm 14 is provided on the other side of the positioning table 12 in the X-axis direction.

在裝載臂14的後方設置有能在XY平面上旋轉之圓盤狀的旋轉台16。在旋轉台16的上表面側係以於圓周方向大致分開120度的態樣設置有3個保持台（卡盤台）18。A disk-shaped turntable 16 capable of rotating on the XY plane is provided behind the loading arm 14. On the upper surface side of the rotating table 16, three holding tables (chuck tables) 18 are provided so as to be substantially separated by 120 degrees in the circumferential direction.

在與裝載臂14最靠近的搬入搬出區域A、及在俯視下從搬入搬出區域A以逆時針大致前進120度的粗研削區域B，分別各配置一個保持台18。又，在俯視下從搬入搬出區域A以順時針大致前進120度的精研削區域C，亦配置一個保持台18。In the carry-in/out area A closest to the loading arm 14 and the rough grinding area B that moves approximately 120 degrees counterclockwise from the carry-in/out area A in a plan view, one holding table 18 is respectively arranged. In addition, in the finishing area C, which advances approximately 120 degrees clockwise from the carry-in and carry-out area A in a plan view, one holding table 18 is also arranged.

各保持台18具有由陶瓷等所形成之圓盤狀的框體。在框體的上表面側形成有圓盤狀的凹部，此凹部中固定有由多孔材料所形成之大致圓盤狀的多孔板。Each holding stand 18 has a disk-shaped frame formed of ceramics or the like. A disc-shaped recess is formed on the upper surface side of the frame, and a substantially disc-shaped porous plate made of a porous material is fixed to the recess.

多孔板的下表面側與形成於框體內之流路（未圖示）的一端連接，此流路的另一端與噴射器等吸取源（未圖示）連接。若使吸取源運作則會於多孔板的上表面（保持面18a（參考圖3））產生負壓。The lower surface side of the perforated plate is connected to one end of a flow path (not shown) formed in the housing, and the other end of the flow path is connected to a suction source (not shown) such as an ejector. If the suction source is operated, negative pressure will be generated on the upper surface (holding surface 18a (refer to FIG. 3)) of the perforated plate.

在保持台18的下方（Z軸方向的一側）設置有具有馬達等之旋轉驅動源20（參考圖3）。旋轉驅動源20具有與保持台18的下部連結之旋轉軸20a。若使旋轉驅動源20運作，則保持台18會以旋轉軸20a為中心進行旋轉。Below the holding table 18 (one side in the Z-axis direction), a rotary drive source 20 having a motor and the like is provided (refer to FIG. 3). The rotation drive source 20 has a rotation shaft 20 a connected to the lower part of the holding table 18. If the rotation drive source 20 is operated, the holding table 18 rotates around the rotation shaft 20a.

在旋轉台16的後方，以從基台4的上表面突出之態樣設置有四角柱狀的支撐構造22a。在支撐構造22a的前表面側設置有研削進給單元（移動單元）24。At the rear of the turntable 16, a quadrangular pillar-shaped support structure 22 a is provided in a state of protruding from the upper surface of the base 4. A grinding feed unit (moving unit) 24 is provided on the front surface side of the support structure 22a.

研削進給單元24具有一對Z軸導軌26，所述一對Z軸導軌26被固定於支撐構造22a的前表面，且與Z軸方向大致平行。在一對Z軸導軌26上，可滑動地裝設有Z軸移動板28。The grinding and feeding unit 24 has a pair of Z-axis guide rails 26 that are fixed to the front surface of the support structure 22a and are substantially parallel to the Z-axis direction. On a pair of Z-axis guide rails 26, a Z-axis moving plate 28 is slidably installed.

在Z軸移動板28的後方（背面）側設置有螺帽部30（參考圖3）。螺帽部30係以可旋轉之態樣與Z軸滾珠螺桿32連結。Z軸滾珠螺桿32係在一對Z軸導軌26之間沿著Z軸方向設置。A nut portion 30 is provided on the rear (back) side of the Z-axis moving plate 28 (refer to FIG. 3 ). The nut portion 30 is connected to the Z-axis ball screw 32 in a rotatable manner. The Z-axis ball screw 32 is arranged between a pair of Z-axis guide rails 26 along the Z-axis direction.

Z軸滾珠螺桿32的上端部係與Z軸脈衝馬達34連結。若以Z軸脈衝馬達34使Z軸滾珠螺桿32旋轉，則Z軸移動板28會沿著Z軸導軌26而在Z軸方向移動。The upper end of the Z-axis ball screw 32 is connected to the Z-axis pulse motor 34. When the Z-axis ball screw 32 is rotated by the Z-axis pulse motor 34, the Z-axis moving plate 28 moves in the Z-axis direction along the Z-axis guide 26.

在Z軸導軌26的附近，沿著Z軸設置有線性尺規（linear scale）（參考圖3）。又，在Z軸移動板28的背面側設置有攝影機等讀取單元（未圖示）。In the vicinity of the Z-axis guide 26, a linear scale is provided along the Z-axis (refer to FIG. 3). In addition, a reading unit (not shown) such as a camera is provided on the back side of the Z-axis moving plate 28.

在Z軸移動板28的前表面固定有粗研削單元36a。粗研削單元36a具有固定於Z軸移動板28之圓筒狀的保持構件38。在保持構件38的內部設置有圓筒狀的主軸外殼40，其與Z軸方向大致平行地配置（參考圖3）。A rough grinding unit 36a is fixed to the front surface of the Z-axis moving plate 28. The rough grinding unit 36 a has a cylindrical holding member 38 fixed to the Z-axis moving plate 28. A cylindrical spindle housing 40 is provided inside the holding member 38 and is arranged substantially parallel to the Z-axis direction (refer to FIG. 3 ).

在主軸外殼40內，以可旋轉之狀態下容納與Z軸方向大致平行配置之圓柱狀的主軸42（參考圖3）的一部分。主軸42的上端部係與主軸馬達44連結。In the spindle housing 40, a part of the cylindrical spindle 42 (refer to FIG. 3) arranged substantially parallel to the Z-axis direction is housed in a rotatable state. The upper end of the main shaft 42 is connected to a main shaft motor 44.

如圖3所示的情況，在主軸42內形成有用以供給研削水46a的第一流路42a。第一流路42a係與研削水供給源46連接。研削水供給源46具有儲存純水等的儲存槽（未圖示）、以及用以將純水從儲存槽供往第一流路42a的泵（未圖示）等。As shown in FIG. 3, a first flow path 42a for supplying grinding water 46a is formed in the main shaft 42. The first flow path 42a is connected to a grinding water supply source 46. The grinding water supply source 46 has a storage tank (not shown) for storing pure water and the like, a pump (not shown) for supplying pure water from the storage tank to the first flow path 42a, and the like.

主軸42的下端部係突出至比主軸外殼40及保持構件38的下端部更下方，在主軸42的下端部固定有圓盤狀的輪安裝件48。從輪安裝件48的上表面的大致中央起，沿著輪安裝件48的厚度方向到預定深度為止，形成有中央流路。The lower end of the main shaft 42 protrudes below the lower end of the main shaft housing 40 and the holding member 38, and a disc-shaped wheel mount 48 is fixed to the lower end of the main shaft 42. From the substantially center of the upper surface of the wheel mounting member 48, a central flow path is formed along the thickness direction of the wheel mounting member 48 to a predetermined depth.

中央流路係在輪安裝件48的上表面側與第一流路42a連接。中央流路的下端與多個第二流路48a連接。各第二流路48a係形成於輪安裝件48內之預定深度，並從輪安裝件48的中心沿著徑方向放射狀地延伸。The central flow path is connected to the first flow path 42a on the upper surface side of the wheel mount 48. The lower end of the central flow path is connected to the plurality of second flow paths 48a. Each second flow path 48a is formed at a predetermined depth in the wheel mounting member 48, and extends radially from the center of the wheel mounting member 48 in the radial direction.

再者，從第二流路48a之外周側的端部起，沿著輪安裝件48的厚度方向到輪安裝件48的下表面為止，形成有多個外側流路。各外側流路的上端於輪安裝件48的內部與第二流路48a連接，各外側流路的下端到達輪安裝件48的下表面。Furthermore, from the end on the outer peripheral side of the second flow path 48a, a plurality of outer flow paths are formed along the thickness direction of the wheel attachment 48 to the lower surface of the wheel attachment 48. The upper end of each outer flow path is connected to the second flow path 48 a inside the wheel mount 48, and the lower end of each outer flow path reaches the lower surface of the wheel mount 48.

在輪安裝件48的下表面，藉由螺絲等固定構件（未圖示）而裝設有圓環狀的粗研削輪50a。亦即，粗研削輪50a係透過輪安裝件48而裝設於主軸42的下端部。On the lower surface of the wheel attachment 48, an annular rough grinding wheel 50a is attached by a fixing member (not shown) such as a screw. In other words, the rough grinding wheel 50 a is installed at the lower end of the main shaft 42 through the wheel mounting member 48.

粗研削輪50a的正下方係與上述粗研削區域B（參考圖1）對應。粗研削輪50a具有：圓環狀的輪基台52a，其由不鏽鋼等金屬材料所形成；以及多個粗研削磨石54a（磨石部），其等裝設於輪基台52a的下表面（一面）側。Just below the rough grinding wheel 50a corresponds to the above-mentioned rough grinding area B (refer to FIG. 1). The rough grinding wheel 50a has: an annular wheel base 52a, which is formed of a metal material such as stainless steel; One side) side.

本實施方式之輪基台52a具有厚度從外側往內側階段性變薄的形狀。輪基台52a包含：第一圓環部，其裝設有粗研削磨石54a；以及第二圓環部，其位於比第一圓環部更內側且厚度比第一圓環部薄。The wheel base 52a of the present embodiment has a shape in which the thickness gradually becomes thinner from the outside to the inside. The wheel base 52a includes: a first ring portion, which is equipped with a rough grinding grindstone 54a; and a second ring portion, which is located more inside than the first ring portion and has a thickness thinner than the first ring portion.

第一圓環部與第二圓環部的上表面成為同一平面，而第一圓環部的下表面與第二圓環部的下表面係以環狀的傾斜面連接。在第二圓環部，沿著第二圓環部的周方向而離散地形成多個貫通孔52c，多個貫通孔52c係分別從第二圓環部的上表面起貫通至下表面為止。The upper surfaces of the first annular portion and the second annular portion become the same plane, and the lower surface of the first annular portion and the lower surface of the second annular portion are connected by an annular inclined surface. In the second annular portion, a plurality of through holes 52c are formed discretely along the circumferential direction of the second annular portion, and the plurality of through holes 52c respectively penetrate from the upper surface to the lower surface of the second annular portion.

各貫通孔52c係於第二圓環部的上表面與輪安裝件48的外側流路連接。若從研削水供給源46供給研削水46a，則研削水46a會通過第一流路42a、中央流路、第二流路48a、外側流路及貫通孔52c，再通過第二圓環部的下表面、環狀的傾斜面及第一圓環部的下表面，而被供往多個粗研削磨石54a。Each through hole 52c is connected to the outer flow path of the wheel mounting member 48 on the upper surface of the second annular portion. If the grinding water 46a is supplied from the grinding water supply source 46, the grinding water 46a will pass through the first flow path 42a, the central flow path, the second flow path 48a, the outer flow path and the through hole 52c, and then pass through the lower part of the second annular portion. The surface, the annular inclined surface, and the lower surface of the first annular portion are supplied to a plurality of rough grinding grindstones 54a.

多個粗研削磨石54a係沿著輪基台52a的下表面的圓周而以在相鄰的粗研削磨石54a彼此之間設有間隙之態樣被排列成環狀。粗研削磨石54a係例如在金屬、陶瓷、樹脂等結合材料中混合金剛石、cBN（cubic boron nitride，立方氮化硼）等磨粒而形成。此外，結合材料及磨粒的材料並無特別限制，可因應粗研削磨石54a的規格而適當選擇。The plurality of rough grinding grindstones 54a are arranged in a ring shape along the circumference of the lower surface of the wheel base 52a with a gap between adjacent rough grinding grindstones 54a. The rough grinding grindstone 54a is formed by mixing abrasive grains such as diamond or cBN (cubic boron nitride) with bonding materials such as metals, ceramics, and resins. In addition, the material of the bonding material and the abrasive grains is not particularly limited, and can be appropriately selected according to the specifications of the rough grinding grindstone 54a.

於此，返回圖1。在支撐構造22a的X軸方向的另一側設有四角柱狀的支撐構造22b。在支撐構造22b的前方係與支撐構造22a同樣地設有研削進給單元24。支撐構造22b的研削進給單元24係與精研削單元36b連結。Here, return to Figure 1. On the other side of the supporting structure 22a in the X-axis direction, a supporting structure 22b having a quadrangular prism shape is provided. A grinding and feeding unit 24 is provided in front of the support structure 22b in the same manner as the support structure 22a. The grinding and feeding unit 24 of the support structure 22b is connected to the fine grinding unit 36b.

精研削單元36b亦與粗研削單元36a同樣地具有保持構件38、主軸外殼40、主軸42、主軸馬達44及輪安裝件48。但是，在主軸42上，透過輪安裝件48而裝設有圓環狀的精研削輪50b。The fine grinding unit 36b also has a holding member 38, a spindle housing 40, a spindle 42, a spindle motor 44, and a wheel mount 48 similarly to the rough grinding unit 36a. However, the main shaft 42 is provided with a ring-shaped grinding wheel 50b through the wheel mounting member 48.

精研削輪50b的正下方係與上述精研削區域C對應。精研削輪50b具備：輪基台52b，其具有與輪基台52a相同的構造；以及多個精研削磨石54b，其等裝設於輪基台52b的下表面側。Just below the lapping wheel 50b corresponds to the above-mentioned lapping area C. The lapping wheel 50b includes a wheel base 52b having the same structure as the wheel base 52a, and a plurality of lapping grindstones 54b, which are installed on the lower surface side of the wheel base 52b.

多個精研削磨石54b係沿著輪基台52b的下表面的圓周而以在相鄰的精研削磨石54b彼此之間設有間隙之態樣被排列成環狀。精研削磨石54b的磨粒的平均粒徑小於粗研削磨石54a的磨粒。但是，精研削磨石54b的結合材料及磨粒的材料並無特別限制，可因應精研削磨石54b的規格而適當選擇。The plurality of lapping grindstones 54b are arranged in a ring shape along the circumference of the lower surface of the wheel base 52b with a gap between adjacent lapping grindstones 54b. The average particle size of the abrasive grains of the fine grinding grindstone 54b is smaller than the abrasive grains of the rough grinding grindstone 54a. However, the bonding material of the grinding stone 54b and the material of the abrasive grains are not particularly limited, and can be appropriately selected according to the specifications of the grinding stone 54b.

在支撐構造22b的前方且裝載臂14的X軸方向的另一側，設有卸載臂56。在卸載臂56的後方，設有用以洗淨及乾燥研削後的被加工物之旋轉洗淨單元58。An unloading arm 56 is provided in front of the supporting structure 22b and on the other side of the loading arm 14 in the X-axis direction. Behind the unloading arm 56, there is provided a rotary cleaning unit 58 for cleaning and drying the workpiece after grinding.

研削裝置2具備控制部60，所述控制部60控制：定位台12、裝載臂14、旋轉台16、保持台18、粗研削單元36a、精研削單元36b、卸載臂56、旋轉洗淨單元58等。The grinding device 2 includes a control unit 60 that controls: positioning table 12, loading arm 14, rotating table 16, holding table 18, rough grinding unit 36a, fine grinding unit 36b, unloading arm 56, and rotating cleaning unit 58 Wait.

控制部60例如係藉由電腦而構成，所述電腦包含：CPU（Central Processing Unit，中央處理單元）等處理裝置；DRAM（Dynamic Random Access Memory，動態隨機存取記憶體）等主記憶裝置；以及快閃記憶體、硬碟等補助記憶裝置。依據記憶於補助記憶裝置的軟體而使處理裝置等運作，藉此實現控制部60的功能。The control unit 60 is constituted by, for example, a computer. The computer includes: a CPU (Central Processing Unit, central processing unit) and other processing devices; DRAM (Dynamic Random Access Memory, dynamic random access memory) and other main memory devices; and Flash memory, hard disk and other auxiliary memory devices. The processing device and the like are operated based on the software stored in the auxiliary memory device, thereby realizing the function of the control unit 60.

接著，參考圖2及圖3，說明研削裝置2的研削室。圖2為研削裝置2的局部放大圖。研削裝置2具備容納粗研削輪50a的第一研削室62a。圖3為第一研削室62a等的局部剖面側視圖。此外，圖3亦以功能方塊表示部分構成要素。Next, referring to FIGS. 2 and 3, the grinding chamber of the grinding device 2 will be described. FIG. 2 is a partial enlarged view of the grinding device 2. The grinding apparatus 2 is equipped with the 1st grinding chamber 62a which accommodates the rough grinding wheel 50a. FIG. 3 is a partial cross-sectional side view of the first grinding chamber 62a and the like. In addition, FIG. 3 also shows some constituent elements in functional blocks.

第一研削室62a係由金屬製的蓋構件所形成。蓋構件包含：頂板64a，其具有主軸42貫通的開口；後方側板64b，其位於支撐構造22a側；以及前方側板64c，其位於比後方側板64b更前方。The first grinding chamber 62a is formed by a metal cover member. The cover member includes: a top plate 64a having an opening through which the main shaft 42 passes; a rear side plate 64b located on the support structure 22a side; and a front side plate 64c located forward of the rear side plate 64b.

在頂板64a、後方側板64b及前方側板64c的X軸方向的一側的端部，設有第一側板64d。再者，在搬入搬出區域A與粗研削區域B之間設有第二側板64e，在粗研削區域B與精研削區域C之間設有第三側板64f。A first side plate 64d is provided at the ends of the top plate 64a, the rear side plate 64b, and the front side plate 64c on one side in the X-axis direction. In addition, a second side plate 64e is provided between the carry-in/out area A and the rough grinding area B, and a third side plate 64f is provided between the rough grinding area B and the fine grinding area C.

在第二研削室62b中容納有精研削輪50b。第二研削室62b的形狀除了相對於與Y軸平行的直線係與第一研削室62a大致線對稱以外，其他與第一研削室62a大致相同，因此省略說明。The fine grinding wheel 50b is accommodated in the second grinding chamber 62b. The shape of the second grinding chamber 62b is substantially the same as that of the first grinding chamber 62a except that the shape of the second grinding chamber 62b is approximately line-symmetrical with respect to the linear system parallel to the Y-axis. Therefore, the description is omitted.

接著，說明第一實施方式之研削裝置2的研削室（第一研削室62a、第二研削室62b）之洗淨方法。此外，以下雖說明洗淨第一研削室62a之情形，但第二研削室62b亦可用相同手法洗淨，因此省略說明第二研削室62b之洗淨。Next, the cleaning method of the grinding chamber (the first grinding chamber 62a, the second grinding chamber 62b) of the grinding apparatus 2 of the first embodiment will be described. In addition, although the cleaning of the first grinding chamber 62a is described below, the second grinding chamber 62b can also be cleaned by the same method, so the description of the cleaning of the second grinding chamber 62b is omitted.

在研削被加工物前，在不以保持面18a保持被加工物之狀態下，進行研削裝置2的暖機（亦即空轉，亦稱為暖機運轉），例如進行30分鐘。Before grinding the workpiece, the grinding device 2 is warmed up (that is, idling, also referred to as warm-up operation), for example, for 30 minutes without holding the workpiece on the holding surface 18a.

在暖機時，由研削水供給源46例如以2（l/min）以上且5（l/min）以下之預定流量供給研削水46a，並且以主軸馬達44使主軸42旋轉。At the time of warming up, the grinding water supply source 46 supplies grinding water 46 a at a predetermined flow rate of, for example, 2 (l/min) or more and 5 (l/min) or less, and the spindle 42 is rotated by the spindle motor 44.

又，在暖機時，例如以與研削被加工物時相同的旋轉速度使主軸42旋轉。粗研削輪50a的直徑為200mm之情形，以研削時所使用的旋轉速度（在一例中，為2500rpm至5000rpm之預定值）使主軸42旋轉。In addition, at the time of warming up, for example, the main shaft 42 is rotated at the same rotation speed as that at the time of grinding the workpiece. When the diameter of the rough grinding wheel 50a is 200 mm, the spindle 42 is rotated at the rotation speed used during grinding (in one example, a predetermined value from 2500 rpm to 5000 rpm).

粗研削輪50a的直徑為300mm之情形，以研削時所使用的旋轉速度（在一例中，為1400rpm至3000rpm之預定值）使主軸42旋轉。When the diameter of the rough grinding wheel 50a is 300 mm, the spindle 42 is rotated at the rotation speed used during grinding (in one example, a predetermined value from 1400 rpm to 3000 rpm).

若以預定的旋轉速度使主軸42旋轉，則供給至多個粗研削磨石54a的研削水46a會藉由離心力而往第一研削室62a的內壁飛散（飛散步驟）。如此，可在暖機時洗淨第一研削室62a的內壁，因此可降低定期地清掃第一研削室62a的內壁時之洗淨作業時間。When the main shaft 42 is rotated at a predetermined rotation speed, the grinding water 46a supplied to the plurality of rough grinding grindstones 54a is scattered to the inner wall of the first grinding chamber 62a by centrifugal force (scattering step). In this way, the inner wall of the first grinding chamber 62a can be cleaned when the machine is warmed up, and therefore the cleaning operation time when the inner wall of the first grinding chamber 62a is regularly cleaned can be reduced.

此外，在使用形成有從輪基台之內側面起在大致橫方向貫通至外側面為止的貫通孔之特殊輪基台的情形，在暖機時及研削被加工物時，研削水46a皆會被分為洗淨用之第一研削水與加工用之第二研削水。In addition, in the case of using a special wheel base with a through hole formed from the inner surface of the wheel base in a substantially horizontal direction to the outer surface, the grinding water 46a will be affected during warm-up and grinding of the workpiece. It is divided into the first grinding water for washing and the second grinding water for processing.

相對於此，在本實施方式之飛散步驟中，研削水46a不會被分為洗淨用之第一研削水與加工用之第二研削水。因此，相較於使用上述特殊的輪基台之情形，可降低研削時的研削水46a的使用量。In contrast, in the scattering step of the present embodiment, the grinding water 46a is not divided into the first grinding water for washing and the second grinding water for processing. Therefore, compared with the use of the above-mentioned special wheel base, the amount of grinding water 46a used during grinding can be reduced.

在本實施方式中，一邊進行飛散步驟，一邊利用研削進給單元24使粗研削單元36a沿著上下方向移動，藉此變更研削水46a濺落至第一研削室62a的內壁之高度（濺落高度變更步驟）。In this embodiment, while performing the scattering step, the grinding feed unit 24 is used to move the rough grinding unit 36a in the vertical direction, thereby changing the height (splash height) at which the grinding water 46a splashes onto the inner wall of the first grinding chamber 62a. Change steps).

如此，藉由利用研削進給單元24使粗研削單元36a沿著上下方向移動，而不使用上述特殊的輪基台亦可變更濺落高度。亦即，即使是在使用一般的輪基台52a之情形，亦可大範圍地洗淨第一研削室62a的內壁。In this way, by using the grinding and feeding unit 24 to move the rough grinding unit 36a in the vertical direction, the splash height can be changed without using the above-mentioned special wheel base. That is, even when a general wheel base 52a is used, the inner wall of the first grinding chamber 62a can be cleaned in a wide range.

在濺落高度變更步驟中，使粗研削輪50a沿著上下方向移動。例如，使粗研削輪50a在以下二個位置之間移動：位於保持面18a的附近且為開始研削被加工物時粗研削輪50a被定位的下方位置、位於頂板64a的附近且為研削輪50a的最大上升位置（上方位置）。In the splash height changing step, the rough grinding wheel 50a is moved in the vertical direction. For example, the rough grinding wheel 50a is moved between the following two positions: it is located near the holding surface 18a and is the lower position where the rough grinding wheel 50a is positioned when starting to grind the workpiece, is located near the top plate 64a and is the grinding wheel 50a The maximum ascent position (upper position).

從下方位置起至上方位置為止的距離，例如為從40mm起至150mm為止的預定值。此外，粗研削輪50a在Z軸方向的位置係以讀取單元檢測Z軸導軌26附近的線性尺規的刻度，藉此被控制部60掌握。The distance from the lower position to the upper position is, for example, a predetermined value from 40 mm to 150 mm. In addition, the position of the rough grinding wheel 50 a in the Z-axis direction is determined by the control unit 60 by detecting the scale of the linear ruler near the Z-axis guide 26 by the reading unit.

在濺落高度變更步驟中，例如使粗研削輪50a從下方位置起至上方位置為止往上方向移動（亦即上升）。圖4（A）係表示使粗研削輪50a上升的情形的圖。In the splash height change step, for example, the rough grinding wheel 50a is moved upward from the lower position to the upper position (that is, ascends). FIG. 4(A) is a diagram showing how the rough grinding wheel 50a is raised.

作為替代，也可使粗研削輪50a從上方位置起至下方位置為止往下方向移動（亦即下降）。圖4（B）係表示使粗研削輪50a下降的情形的圖。As an alternative, the rough grinding wheel 50a may be moved downward from the upper position to the lower position (that is, lowered). Fig. 4(B) is a diagram showing a state where the rough grinding wheel 50a is lowered.

在使粗研削輪50a下降之情形，暖機結束時可將粗研削輪50a配置於加工開始位置，因此在被加工物配置於粗研削區域B後，可迅速地開始研削。因此，相較於使粗研削輪50a上升且最終將其配置於上方位置之情形，可縮短暖機與研削被加工物的總作業時間。In the case of lowering the rough grinding wheel 50a, the rough grinding wheel 50a can be arranged at the machining start position when the warm-up is completed. Therefore, after the workpiece is arranged in the rough grinding area B, grinding can be started quickly. Therefore, compared with the case where the rough grinding wheel 50a is raised and finally arranged at the upper position, the total work time for warming up and grinding the workpiece can be shortened.

此外，也可使粗研削輪50a在上方位置與下方位置之間上升及下降。例如，也可使粗研削輪50a從下方位置起上升至上方位置為止後，從上方位置起下降至下方位置為止。In addition, the rough grinding wheel 50a may be raised and lowered between the upper position and the lower position. For example, after the rough grinding wheel 50a is raised from the lower position to the upper position, it may be lowered from the upper position to the lower position.

暖機之後，進行被加工物的研削等。具體而言，首先，搬送機器人6將一個被加工物從卡匣10a搬送往定位台12。在定位台12調整位置後，裝載臂14將被加工物從定位台12搬送往定位於搬入搬出區域A的保持台18。After the machine is warmed up, grinding of the workpiece is carried out. Specifically, first, the transport robot 6 transports one workpiece from the cassette 10 a to the positioning table 12. After the positioning table 12 has adjusted its position, the loading arm 14 transports the workpiece from the positioning table 12 to the holding table 18 positioned in the carry-in/out area A.

其後，保持有被加工物的保持台18會往粗研削區域B移動。以粗研削單元36a將被加工物僅粗研削至預定厚度後，保持有經粗研削的被加工物之保持台18會往精研削區域C移動。Thereafter, the holding table 18 holding the to-be-processed object moves to the rough grinding area B. After rough grinding the workpiece to a predetermined thickness by the rough grinding unit 36a, the holding table 18 holding the rough ground workpiece moves to the fine grinding area C.

被加工物被精研削後，保持有經精研削的被加工物之保持台18會往搬入搬出區域A移動。接著，卸載臂56將被加工物從搬入搬出區域A搬送往旋轉洗淨單元58，旋轉洗淨單元58將被加工物進行洗淨及乾燥。其後，搬送機器人6將被加工物從旋轉洗淨單元58搬入卡匣10b。After the workpiece is finely ground, the holding table 18 holding the finely ground workpiece moves to the carry-in/out area A. Next, the unloading arm 56 transports the workpiece from the carry-in/out area A to the rotary washing unit 58, and the rotary washing unit 58 washes and dries the workpiece. After that, the transport robot 6 transports the object to be processed from the rotary cleaning unit 58 into the cassette 10b.

在第一實施方式中，在研削前的暖機時，供給至多個粗研削磨石54a的研削水46a藉由離心力飛散至第一研削室62a的內壁，藉此洗淨第一研削室62a。因此，相較於將研削水46a分為洗淨用之第一研削水與加工用之第二研削水之情形，可降低研削水46a的使用量。In the first embodiment, when the machine is warmed up before grinding, the grinding water 46a supplied to the plurality of rough grinding grindstones 54a is scattered to the inner wall of the first grinding chamber 62a by centrifugal force, thereby washing the first grinding chamber 62a . Therefore, compared to the case where the grinding water 46a is divided into the first grinding water for washing and the second grinding water for processing, the usage amount of the grinding water 46a can be reduced.

再者，藉由利用研削進給單元24使粗研削單元36a沿著上下方向移動，可變更研削水46a濺落至第一研削室62a的內壁的高度。因此，即使是使用一般的輪基台52a之情形，亦可大範圍地洗淨第一研削室62a的內壁。Furthermore, by using the grinding feed unit 24 to move the rough grinding unit 36a in the vertical direction, it is possible to change the height of the grinding water 46a splashing onto the inner wall of the first grinding chamber 62a. Therefore, even when a general wheel base 52a is used, the inner wall of the first grinding chamber 62a can be cleaned in a wide range.

接著，說明第二實施方式。在第二實施方式中，進一步具備：旋轉速度變更步驟，其在暖機時變更主軸42的旋轉速度。圖5（A）係表示將粗研削輪50a固定於預定高度且以第一旋轉速度E1使主軸42旋轉的情形的圖。Next, the second embodiment will be described. The second embodiment further includes a rotation speed changing step of changing the rotation speed of the main shaft 42 when the engine is warmed up. FIG. 5(A) is a diagram showing a state where the rough grinding wheel 50 a is fixed to a predetermined height and the main shaft 42 is rotated at the first rotation speed E1.

相對於此，圖5（B）係表示將粗研削輪50a固定於預定高度且以比第一旋轉速度E1更快的第二旋轉速度E2使主軸42旋轉的情形的圖。旋轉速度愈快則離心力愈高，因此在第二旋轉速度E2之情形，相較於第一旋轉速度E1，可使研削水46a飛散至內壁的更上方。In contrast, FIG. 5(B) is a diagram showing a state where the rough grinding wheel 50 a is fixed at a predetermined height and the main shaft 42 is rotated at a second rotation speed E2 faster than the first rotation speed E1. The faster the rotation speed, the higher the centrifugal force. Therefore, in the case of the second rotation speed E2, compared to the first rotation speed E1, the grinding water 46a can be scattered to the upper side of the inner wall.

作為一例，係一邊進行飛散步驟一邊使粗研削輪50a沿著上下方向移動（濺落高度變更步驟），且因應粗研削輪50a的高度而使主軸42的旋轉速度改變（旋轉速度變更步驟）。圖6係表示因應粗研削輪50a的高度而使主軸42的旋轉速度改變之一例的圖。As an example, the rough grinding wheel 50a is moved in the vertical direction while performing the scattering step (splash height changing step), and the rotation speed of the main shaft 42 is changed in accordance with the height of the rough grinding wheel 50a (rotation speed changing step). FIG. 6 is a diagram showing an example of changing the rotation speed of the main shaft 42 in accordance with the height of the rough grinding wheel 50a.

在圖6所示的例子中，一邊以預定流量使研削水46a飛散，一邊使粗研削輪50a的下端（例如，粗研削磨石54a的下表面）從上方位置Da經過上方中間位置Db及下方中間位置Dc而下降至下方位置Dd為止。In the example shown in FIG. 6, while the grinding water 46a is scattered at a predetermined flow rate, the lower end of the rough grinding wheel 50a (for example, the lower surface of the rough grinding stone 54a) passes from the upper position Da to the upper middle position Db and the lower The intermediate position Dc descends to the lower position Dd.

例如，耗費10分鐘使粗研削輪50a從上方位置Da起下降至上方中間位置Db為止。其間，將主軸42的旋轉速度設為在暖機時最高的第三旋轉速度E3。For example, it takes 10 minutes to lower the rough grinding wheel 50a from the upper position Da to the upper middle position Db. Meanwhile, the rotation speed of the main shaft 42 is set to the highest third rotation speed E3 at the time of warming up.

之後，例如耗費10分鐘使粗研削輪50a從上方中間位置Db起下降至下方中間位置Dc為止。其間，將主軸42的旋轉速度設為比第三旋轉速度E3低的第二旋轉速度E2。After that, it takes, for example, 10 minutes to lower the rough grinding wheel 50a from the upper middle position Db to the lower middle position Dc. Meanwhile, the rotation speed of the main shaft 42 is set to a second rotation speed E2 lower than the third rotation speed E3.

再之後，例如耗費10分鐘使粗研削輪50a從下方中間位置Dc起下降至下方位置Dd為止。其間，將主軸42的旋轉速度設為比第二旋轉速度E2低的第一旋轉速度E1。After that, it takes, for example, 10 minutes to lower the rough grinding wheel 50a from the lower intermediate position Dc to the lower position Dd. Meanwhile, the rotation speed of the main shaft 42 is set to a first rotation speed E1 lower than the second rotation speed E2.

在圖6所示的例子中，在粗研削輪50a從上方位置Da起下降至上方中間位置Db為止的期間，相較於將主軸42的旋轉速度固定為第一旋轉速度E1之情形，研削水46a會往更上方飛散。因此，可洗淨更廣範圍的內壁。In the example shown in FIG. 6, during the period when the rough grinding wheel 50a descends from the upper position Da to the upper intermediate position Db, compared to the case where the rotation speed of the main shaft 42 is fixed to the first rotation speed E1, the grinding water 46a will fly further upwards. Therefore, a wider range of inner walls can be cleaned.

此外，在暖機結束時可將粗研削輪50a配置於加工開始位置。又，若將第一旋轉速度E1設為與研削被加工物時相同的旋轉速度，則在粗研削輪50a位於下方位置Dd附近的時間帶，可以與研削時相同的條件進行暖機。In addition, the rough grinding wheel 50a can be arranged at the processing start position at the end of the warm-up. Moreover, if the first rotation speed E1 is set to the same rotation speed as when the workpiece is being ground, the time zone when the rough grinding wheel 50a is located near the lower position Dd can be warmed up under the same conditions as when grinding.

此外，在第一旋轉速度E1為研削時所使用的旋轉速度之情形，藉由以第二旋轉速度E2及第三旋轉速度E3進行暖機，而相較於僅以第一旋轉速度E1進行暖機之情形，可縮短暖機所需時間。In addition, when the first rotation speed E1 is the rotation speed used during grinding, the second rotation speed E2 and the third rotation speed E3 are used for warming up, compared to only the first rotation speed E1 for warming up. In the case of the engine, the time required to warm up the engine can be shortened.

接著，說明第三實施方式。在第三實施方式中，進一步具備：流量變更步驟，其在暖機時使研削水46a的流量改變。圖7（A）係表示以第一流量F1供給研削水46a的情形的圖。Next, the third embodiment will be described. The third embodiment further includes a flow rate changing step that changes the flow rate of the grinding water 46a when the engine is warmed up. FIG. 7(A) is a diagram showing a state where the grinding water 46a is supplied at the first flow rate F1.

相對於此，圖7（B）係表示將粗研削輪50a的高度及旋轉速度設為與圖7（A）所示的例子相同，且以比第一流量F1多的第二流量F2供給研削水46a的情形的圖。流量愈多則可將愈多的研削水46a供給至內壁，可提高洗淨效果。In contrast, FIG. 7(B) shows that the height and rotation speed of the rough grinding wheel 50a are set to be the same as those in the example shown in FIG. Diagram of the situation of water 46a. The more the flow rate, the more grinding water 46a can be supplied to the inner wall, and the cleaning effect can be improved.

作為一例，係一邊進行飛散步驟一邊使粗研削輪50a沿著上下方向移動（濺落高度變更步驟），且使研削水46a的流量改變（流量變更步驟）。圖8（A）係表示因應粗研削輪50a的高度而使研削水46a的流量改變之一例的圖。As an example, while performing the scattering step, the rough grinding wheel 50a is moved in the vertical direction (splash height changing step), and the flow rate of the grinding water 46a is changed (flow rate changing step). FIG. 8(A) is a diagram showing an example of the change in the flow rate of the grinding water 46a in accordance with the height of the rough grinding wheel 50a.

在圖8（A）所示的例子中，例如耗費10分鐘使粗研削輪50a從上方位置Da起下降至上方中間位置Db為止。此時，將研削水46a的流量設為第三流量F3。之後，例如耗費10分鐘使粗研削輪50a從上方中間位置Db起下降至下方中間位置Dc為止。此時，將研削水46a的流量設為比第三流量F3低的第二流量F2。In the example shown in FIG. 8(A), for example, it takes 10 minutes to lower the rough grinding wheel 50a from the upper position Da to the upper middle position Db. At this time, the flow rate of the grinding water 46a is set to the third flow rate F3. After that, it takes, for example, 10 minutes to lower the rough grinding wheel 50a from the upper middle position Db to the lower middle position Dc. At this time, the flow rate of the grinding water 46a is set to the second flow rate F2 which is lower than the third flow rate F3.

再之後，例如耗費10分鐘使粗研削輪50a從下方中間位置Dc起下降至下方位置Dd為止。此時，將研削水46a的流量設為比第二流量F2低的第一流量F1。此外，主軸42的旋轉速度在暖機中為固定（第一旋轉速度E1）。After that, it takes, for example, 10 minutes to lower the rough grinding wheel 50a from the lower intermediate position Dc to the lower position Dd. At this time, the flow rate of the grinding water 46a is set to the first flow rate F1 which is lower than the second flow rate F2. In addition, the rotation speed of the main shaft 42 is constant during warm-up (first rotation speed E1).

在圖8（A）所示的例子中，在粗研削輪50a從上方位置Da起下降至下方位置Dd為止的期間，相較於將研削水46a的流量固定為第一流量F1之情形，可提高上方的內壁的洗淨效果。In the example shown in FIG. 8(A), during the period when the rough grinding wheel 50a descends from the upper position Da to the lower position Dd, compared to the case where the flow rate of the grinding water 46a is fixed to the first flow rate F1, Improve the cleaning effect of the upper inner wall.

圖8（B）係表示因應粗研削輪50a的高度而使研削水46a的流量改變之另一例的圖。在圖8（B）所示的例子中，因應粗研削輪50a的高度位置而使主軸42的旋轉速度與研削水46a的流量改變。FIG. 8(B) is a diagram showing another example of changing the flow rate of the grinding water 46a in accordance with the height of the rough grinding wheel 50a. In the example shown in FIG. 8(B), the rotation speed of the main shaft 42 and the flow rate of the grinding water 46a are changed in accordance with the height position of the rough grinding wheel 50a.

在圖8（B）所示的例子中，一邊進行飛散步驟一邊進行濺落高度變更步驟，並且亦進行旋轉速度變更步驟及流量變更步驟。In the example shown in FIG. 8(B), the splash height change step is performed while the scattering step is performed, and the rotation speed change step and the flow rate change step are also performed.

在圖8（B）所示的例子中，例如耗費10分鐘使粗研削輪50a從上方位置Da起下降至上方中間位置Db為止。此時，將主軸42的旋轉速度設為第三旋轉速度E3，將研削水46a的流量設為第三流量F3。In the example shown in FIG. 8(B), for example, it takes 10 minutes to lower the rough grinding wheel 50a from the upper position Da to the upper middle position Db. At this time, the rotation speed of the main shaft 42 is set to the third rotation speed E3, and the flow rate of the grinding water 46a is set to the third flow rate F3.

之後，例如耗費10分鐘使粗研削輪50a從上方中間位置Db起下降至下方中間位置Dc為止。此時，將主軸42的旋轉速度設為比第三旋轉速度E3低的第二旋轉速度E2，將研削水46a的流量設為比第三流量F3低的第二流量F2。After that, it takes, for example, 10 minutes to lower the rough grinding wheel 50a from the upper middle position Db to the lower middle position Dc. At this time, the rotation speed of the main shaft 42 is set to the second rotation speed E2 lower than the third rotation speed E3, and the flow rate of the grinding water 46a is set to the second flow rate F2 lower than the third flow rate F3.

再之後，例如耗費10分鐘使粗研削輪50a從下方中間位置Dc起下降至下方位置Dd為止。此時，將主軸42的旋轉速度設為比第二旋轉速度E2低的第一旋轉速度E1，將研削水46a的流量設為比第二流量F2低的第一流量F1。After that, it takes, for example, 10 minutes to lower the rough grinding wheel 50a from the lower intermediate position Dc to the lower position Dd. At this time, the rotation speed of the main shaft 42 is set to the first rotation speed E1 lower than the second rotation speed E2, and the flow rate of the grinding water 46a is set to the first flow rate F1 lower than the second flow rate F2.

在圖8（B）所示的例子中，在粗研削輪50a從上方位置Da起下降至下方位置Dd為止的期間，相較於將主軸42的旋轉速度固定為第一旋轉速度E1之情形，可更加提高上方的內壁的洗淨效果。In the example shown in FIG. 8(B), during the period when the rough grinding wheel 50a descends from the upper position Da to the lower position Dd, compared to the case where the rotation speed of the main shaft 42 is fixed to the first rotation speed E1, The cleaning effect of the upper inner wall can be further improved.

此外，上述實施方式的構造、方法等，可在不超出本發明目的之範圍內適當地變更並實施。在上述各實施方式中係一邊進行飛散步驟一邊進行濺落高度變更步驟。In addition, the structure, method, etc. of the above-mentioned embodiment can be appropriately changed and implemented without departing from the scope of the object of the present invention. In each of the above-mentioned embodiments, the splash height changing step is performed while performing the scattering step.

但是，亦可在將飛散步驟進行第一預定時間後，暫時停止供給研削水46a，並耗費第二預定時間進行濺落高度變更步驟。亦即，可交互地進行飛散步驟與濺落高度變更步驟，使粗研削輪50a在上方位置Da與下方位置Dd之間移動。However, after the scattering step is performed for the first predetermined time, the supply of the grinding water 46a may be temporarily stopped, and the splash height changing step may be performed for the second predetermined time. That is, the scattering step and the splash height changing step can be performed alternately, and the rough grinding wheel 50a can be moved between the upper position Da and the lower position Dd.

此外，在第二及第三實施方式中，也可交互地進行飛散步驟與濺落高度變更步驟。又，研削室的洗淨可在不以保持面18a保持被加工物之狀態下進行，也可在以保持面18a保持被加工物之狀態下進行。In addition, in the second and third embodiments, the scattering step and the splash height changing step may be performed alternately. In addition, the cleaning of the grinding chamber may be performed in a state where the workpiece is not held by the holding surface 18a, or may be performed in a state where the workpiece is held by the holding surface 18a.

2:研削裝置 4:基台 4a:凹部 6:搬送機器人 8a,8b:卡匣載置區域 10a,10b:卡匣 12:定位台 14:裝載臂 16:旋轉台 18:保持台（卡盤台） 18a:保持面 20:旋轉驅動源 20a:旋轉軸 22a,22b:支撐構造 24:研削進給單元（移動單元） 26:Z軸導軌 28:Z軸移動板 30:螺帽部 32:Z軸滾珠螺桿 34:Z軸脈衝馬達 36a:粗研削單元 36b:精研削單元 38:保持構件 40:主軸外殼 42:主軸 42a:第一流路 44:主軸馬達 46:研削水供給源 46a:研削水 48:輪安裝件 48a:第二流路 50a:粗研削輪 50b:精研削輪 52a,52b:輪基台 52c:貫通孔 54a:粗研削磨石 54b:精研削磨石 56:卸載臂 58:旋轉洗淨單元 60:控制部 62a:第一研削室 62b:第二研削室 64a:頂板 64b:後方側板 64c:前方側板 64d:第一側板 64e:第二側板 64f:第三側板 A:搬入搬出區域 B:粗研削區域 C:精研削區域 Da:上方位置 Db:上方中間位置 Dc:下方中間位置 Dd:下方位置 E1:第一旋轉速度 E2:第二旋轉速度 E3:第三旋轉速度 F1:第一流量 F2:第二流量 F3:第三流量2: Grinding device 4: Abutment 4a: recess 6: Transport robot 8a, 8b: cassette loading area 10a, 10b: cassette 12: positioning table 14: Loading arm 16: Rotating table 18: Holding table (chuck table) 18a: Keep the face 20: Rotary drive source 20a: Rotation axis 22a, 22b: Support structure 24: Grinding feed unit (moving unit) 26: Z axis guide 28: Z-axis moving plate 30: Nut part 32: Z axis ball screw 34: Z-axis pulse motor 36a: Rough grinding unit 36b: Fine grinding and cutting unit 38: Holding member 40: Spindle housing 42: Spindle 42a: The first flow path 44: Spindle motor 46: Researching water supply source 46a: Grinding water 48: Wheel mounting 48a: second flow path 50a: Rough grinding wheel 50b: Fine grinding wheel 52a, 52b: Wheel abutment 52c: Through hole 54a: Coarse grinding stone 54b: Lapping grinding stone 56: Unloading arm 58: Rotary washing unit 60: Control Department 62a: The first grinding room 62b: The second grinding room 64a: top plate 64b: Rear side panel 64c: front side panel 64d: first side panel 64e: second side panel 64f: third side panel A: Moving in and out of the area B: Rough grinding area C: Fine grinding area Da: upper position Db: upper middle position Dc: lower middle position Dd: lower position E1: first rotation speed E2: second rotation speed E3: Third rotation speed F1: First flow F2: second flow F3: third flow

圖1係研削裝置的立體圖。 圖2係研削裝置的局部放大圖。 圖3係第一研削室等的局部剖面側視圖。 圖4（A）係表示使研削輪上升的情形的圖，圖4（B）係表示使研削輪下降的情形的圖。 圖5（A）係表示以第一旋轉速度使主軸旋轉的情形的圖，圖5（B）係表示以第二旋轉速度使主軸旋轉的情形的圖。 圖6係表示因應粗研削輪的高度而使主軸的旋轉速度改變之一例的圖。 圖7（A）係表示以第一流量供給研削水的情形的圖，圖7（B）係表示以第二流量供給研削水的情形的圖。 圖8（A）係表示因應粗研削輪的高度而使研削水的流量改變之一例的圖，圖8（B）係表示因應粗研削輪的高度而使研削水流量的改變之另一例的圖。Figure 1 is a perspective view of the grinding device. Figure 2 is a partial enlarged view of the grinding device. Fig. 3 is a partial cross-sectional side view of the first grinding chamber and the like. FIG. 4(A) is a diagram showing a situation in which the grinding wheel is raised, and FIG. 4(B) is a diagram showing a situation in which the grinding wheel is lowered. FIG. 5(A) is a diagram showing a state where the main shaft is rotated at a first rotation speed, and FIG. 5(B) is a diagram showing a state where the main shaft is rotated at a second rotation speed. Fig. 6 is a diagram showing an example of changing the rotation speed of the spindle according to the height of the rough grinding wheel. FIG. 7(A) is a diagram showing a situation where grinding water is supplied at a first flow rate, and FIG. 7(B) is a diagram showing a situation where grinding water is supplied at a second flow rate. Fig. 8(A) is a diagram showing an example of the change in the flow rate of grinding water according to the height of the rough grinding wheel, and Fig. 8(B) is a diagram showing another example of the change in the flow rate of grinding water according to the height of the rough grinding wheel .

18:保持台(卡盤台)18: Holding table (chuck table)

42:主軸42: Spindle

46a:研削水46a: Grinding water

48:輪安裝件48: Wheel mounting

48a:第二流路48a: second flow path

50a:粗研削輪50a: Rough grinding wheel

52a:輪基台52a: Wheel abutment

62a:第一研削室62a: The first grinding room

Claims (5)

一種研削室之洗淨方法，其係研削裝置的研削室之洗淨方法，其特徵在於，具備： 飛散步驟，其由研削水供給源通過輪基台的內部而對研削單元的磨石部供給研削水，且使主軸旋轉，藉此使供給至該磨石部的該研削水藉由離心力飛散至容納有研削輪之研削室的內壁，其中，該研削單元具備該研削輪與該主軸，該研削輪具有圓環狀的該輪基台、及於該輪基台之一面側配置成環狀的該磨石部，該主軸裝設有該研削輪；以及 濺落高度變更步驟，其利用使該研削單元於上下方向移動的移動單元，使該研削輪於該研削室內在上方向及下方向的至少一方向移動，藉此變更該研削水濺落至該研削室的內壁的高度。A cleaning method for a grinding room, which is a cleaning method for the grinding room of a grinding device, characterized in that it has: In the scattering step, the grinding water supply source supplies grinding water to the grinding stone part of the grinding unit through the inside of the wheel base, and rotates the spindle, whereby the grinding water supplied to the grinding stone part is scattered by centrifugal force to the accommodating The inner wall of the grinding chamber of the grinding wheel, wherein the grinding unit is provided with the grinding wheel and the spindle, the grinding wheel has the ring-shaped wheel base and the ring-shaped disposed on one side of the wheel base Grinding part, the spindle is equipped with the grinding wheel; and The step of changing the height of splashing, which utilizes the moving unit that moves the grinding unit in the up and down direction to move the grinding wheel in the grinding chamber in at least one of the up and down directions, thereby changing the splashing of the grinding water to the grinding chamber The height of the inner wall. 如請求項1之研削室之洗淨方法，其中，一邊進行該飛散步驟一邊進行該濺落高度變更步驟。According to the cleaning method of the grinding room of claim 1, wherein the splash height changing step is performed while the scattering step is performed. 如請求項1或2之研削室之洗淨方法，其進一步具備：旋轉速度變更步驟，其變更該主軸的旋轉速度。For example, the cleaning method of the grinding room of claim 1 or 2, further comprising: a rotation speed changing step, which changes the rotation speed of the spindle. 如請求項1或2之研削室之洗淨方法，其進一步具備： 流量變更步驟，其變更由該研削水供給源供給至該磨石部之研削水的流量。If the cleaning method of the research room in claim 1 or 2, it further has: The flow rate changing step is to change the flow rate of the grinding water supplied from the grinding water supply source to the grindstone part. 如請求項3之研削室之洗淨方法，其進一步具備： 流量變更步驟，其變更由該研削水供給源供給至該磨石部之研削水的流量。Such as the cleaning method of the research room in claim 3, which further has: The flow rate changing step is to change the flow rate of the grinding water supplied from the grinding water supply source to the grindstone part.
TW109144258A 2019-12-19 2020-12-15 Method of cleaning grinding chamber capable of reducing the usage amount of the grinding water in comparison with a grinding wheel of a wheel base having a through hole that penetrates in a substantially lateral direction TW202129803A (en)

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