TW202123683A - Image capture device and method for correcting pixel signal in image capture device - Google Patents
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- 238000000034 method Methods 0.000 title claims description 22
- 238000012546 transfer Methods 0.000 claims abstract description 34
- 238000012545 processing Methods 0.000 claims description 132
- 238000003384 imaging method Methods 0.000 claims description 107
- 230000035945 sensitivity Effects 0.000 claims description 106
- 238000012937 correction Methods 0.000 claims description 102
- 229920006395 saturated elastomer Polymers 0.000 claims description 20
- 238000009825 accumulation Methods 0.000 claims description 16
- 238000003672 processing method Methods 0.000 claims description 7
- 230000008569 process Effects 0.000 claims description 4
- 238000005516 engineering process Methods 0.000 description 45
- 238000001514 detection method Methods 0.000 description 26
- 230000000875 corresponding effect Effects 0.000 description 23
- 230000006870 function Effects 0.000 description 23
- 238000004891 communication Methods 0.000 description 21
- 238000010586 diagram Methods 0.000 description 20
- 239000004065 semiconductor Substances 0.000 description 20
- 230000007246 mechanism Effects 0.000 description 18
- 238000006243 chemical reaction Methods 0.000 description 17
- 230000005540 biological transmission Effects 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 12
- 238000002674 endoscopic surgery Methods 0.000 description 11
- 230000006866 deterioration Effects 0.000 description 9
- 230000009471 action Effects 0.000 description 8
- 210000001519 tissue Anatomy 0.000 description 8
- 238000009792 diffusion process Methods 0.000 description 7
- 238000007667 floating Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 208000005646 Pneumoperitoneum Diseases 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 230000005284 excitation Effects 0.000 description 4
- 238000001356 surgical procedure Methods 0.000 description 4
- 230000015556 catabolic process Effects 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 238000010336 energy treatment Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 230000008520 organization Effects 0.000 description 3
- 210000004204 blood vessel Anatomy 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- MOFVSTNWEDAEEK-UHFFFAOYSA-M indocyanine green Chemical compound [Na+].[O-]S(=O)(=O)CCCCN1C2=CC=C3C=CC=CC3=C2C(C)(C)C1=CC=CC=CC=CC1=[N+](CCCCS([O-])(=O)=O)C2=CC=C(C=CC=C3)C3=C2C1(C)C MOFVSTNWEDAEEK-UHFFFAOYSA-M 0.000 description 2
- 229960004657 indocyanine green Drugs 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 240000004050 Pentaglottis sempervirens Species 0.000 description 1
- 235000004522 Pentaglottis sempervirens Nutrition 0.000 description 1
- 208000004350 Strabismus Diseases 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000002596 correlated effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 230000012447 hatching Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 230000003137 locomotive effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 210000004877 mucosa Anatomy 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
- H04N25/62—Detection or reduction of noise due to excess charges produced by the exposure, e.g. smear, blooming, ghost image, crosstalk or leakage between pixels
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/10—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths
- H04N23/12—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from different wavelengths with one sensor only
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
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- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
本技術係關於一種攝像裝置及攝像裝置上之像素信號之補正處理方法。This technology relates to an imaging device and a correction processing method for pixel signals on the imaging device.
近年，使用CCD(Charge Coupled Device：電荷耦合裝置)或CMOS(Complementary Metal Oxide Semiconductor：互補金屬氧化物半導體)之攝像裝置之像素之高密度化、微細化有所進展。對應於此，謀求像素之每單位面積之飽和電荷量之提高，以不使像素之特性劣化。一般而言，為提高像素之飽和電荷量，而以更多電荷累積於像素之電荷累積區域之方式進行電位井之深化。In recent years, high-density and miniaturization of pixels in imaging devices using CCD (Charge Coupled Device) or CMOS (Complementary Metal Oxide Semiconductor) have progressed. Corresponding to this, the saturation charge amount per unit area of the pixel is improved so as not to deteriorate the characteristics of the pixel. Generally speaking, in order to increase the saturation charge of the pixel, the potential well is deepened in a way that more charge is accumulated in the charge accumulation area of the pixel.
然而，若進行電位井之深化，則產生電荷溢出至周圍像素之輝散等問題，致使電荷之傳送效率降低。即，因電位井之深化，電荷傳送效率降低，故而飽和電荷量與電荷傳送效率呈取捨關係。傳送效率之降低尤其於低照度區域中，使入射至像素之光能之大小與像素輸出之電荷量之間之線性惡化。因線性惡化，低照度區域上之白平衡被破壞，產生特定顏色成分(例如綠色成分)浮現之所謂之著色等。因此，提案有數種用以防止此種線性惡化引起之畫質降低的技法。However, if the potential well is deepened, problems such as the spread of electric charges overflowing to surrounding pixels will occur, and the transfer efficiency of electric charges will decrease. That is, due to the deepening of the potential well, the charge transfer efficiency is reduced, so the saturation charge amount and the charge transfer efficiency are in a trade-off relationship. The reduction in transmission efficiency, especially in low-illuminance areas, deteriorates the linearity between the amount of light energy incident on the pixel and the amount of charge output by the pixel. Due to linear deterioration, the white balance in the low-illuminance area is disrupted, resulting in the so-called coloration in which specific color components (such as green components) emerge. Therefore, several techniques have been proposed to prevent the degradation of image quality caused by such linear deterioration.
例如，下述專利文獻1揭示一種減少不完全傳送引起之色再現性之惡化，尤其高感度之色再現性之惡化的技術。具體而言，專利文獻1揭示一種攝像裝置，其對於可設定之各攝影感度，將使用對應於不同曝光量且自攝像機構輸出之攝像信號所含之不同顏色之輸出信號產生的各顏色之色比補正係數，記憶於記憶機構，且控制使用所記憶之色比補正係數補正自攝像機構輸出之攝像信號的補正機構，將被攝體之攝影中與設定之攝影感度對應之色比補正係數自記憶機構取得，並使用取得之色比補正係數中對應之顏色之色比補正係數，補正自攝像機構輸出之被攝體之攝像信號所含之不同顏色之輸出信號。For example, the following
又，下述專利文獻2揭示一種使自攝像裝置具有之攝像元件輸出之像素信號之精度提升的技術。具體而言，專利文獻2揭示一種裝置，其具備：記憶機構，其對於複數個像素之各者，將自電荷累積部向電荷保持部傳送電荷時與殘存於電荷累積部之不完全傳送電荷量相應之不完全傳送電荷量資訊，按每個對應於電荷累積部之像素預先記憶；及補正機構，其對於藉由信號輸出部輸出之像素信號，進行基於藉由記憶機構記憶之不完全傳送電荷量資訊的補正。 [先前技術文獻] [專利文獻]In addition, the following Patent Document 2 discloses a technique for improving the accuracy of pixel signals output from an imaging element included in an imaging device. Specifically, Patent Document 2 discloses a device including: a memory mechanism for each of a plurality of pixels, when the charge is transferred from the charge accumulation portion to the charge retention portion, and the amount of incomplete transfer of the charge remaining in the charge accumulation portion The corresponding incomplete transfer charge amount information is memorized in advance for each pixel corresponding to the charge accumulation part; and a correction mechanism, which performs the incomplete transfer charge based on the memory by the memory mechanism for the pixel signal output by the signal output part Correction of volume information. [Prior Technical Literature] [Patent Literature]
[專利文獻1]日本專利特開2013-150051號公報 [專利文獻2]日本專利特開2012-231421號公報[Patent Document 1] Japanese Patent Laid-Open No. 2013-150051 [Patent Document 2] Japanese Patent Laid-Open No. 2012-231421
[發明所欲解決之問題][The problem to be solved by the invention]
如上述文獻所揭示之技術為補正電荷之不完全傳送或傳送效率降低引起之像素特性之線性惡化，需預先取得對各像素之補正係數或資料並記憶於記憶機構。又，為對應於使用溫度或曝光時間之變化，而有預先取得並記憶之補正資料之量變得巨大之問題。The technique disclosed in the above-mentioned documents is to compensate the linear deterioration of the pixel characteristics caused by the incomplete transfer of the charge or the decrease in the transfer efficiency. The correction coefficient or data for each pixel needs to be obtained in advance and stored in the memory mechanism. In addition, in response to changes in use temperature or exposure time, there is a problem that the amount of correction data acquired and memorized in advance becomes huge.
因此，本技術之目的在於提供一種可不使電荷傳送效率降低而確保像素特性之線性之攝像裝置及攝像裝置上之像素信號之補正處理方法。 [解決問題之技術手段]Therefore, the purpose of the present technology is to provide an imaging device that can ensure the linearity of pixel characteristics without reducing the charge transfer efficiency and a method for correcting pixel signals on the imaging device. [Technical means to solve the problem]
用以解決上述問題之本技術包含以下所示之發明特定事項或技術性特徵而構成。The present technology for solving the above-mentioned problems includes the invention specific matters or technical features shown below.
依據某觀點之本技術為具備可累積根據入射之光量而產生之電荷之複數個像素的攝像裝置。上述攝像裝置之上述複數個像素包含：第1像素，其形成為具有第1飽和電荷量；及第2像素，其形成為具有較上述第1飽和電荷量更小之第2飽和電荷量。The present technology based on a certain point of view is an imaging device provided with a plurality of pixels that can accumulate charges generated according to the amount of incident light. The plurality of pixels of the imaging device include: a first pixel formed to have a first saturated charge amount; and a second pixel formed to have a second saturated charge amount smaller than the first saturated charge amount.
又，依據其他觀點之本技術為攝像裝置之像素信號之補正處理方法。上述補正處理方法包含如下步驟：自累積根據入射之光量而產生之電荷的複數個像素讀取上述電荷；及補正基於自上述複數個像素讀取之上述電荷之量的信號。此處，上述複數個像素包含：第1像素，其形成為具有第1飽和電荷量；及第2像素，其形成為具有較上述第1飽和電荷量更小之第2飽和電荷量。又，上述補正係根據基於自上述第1像素傳送之電荷量的感度比、與基於自上述第2像素傳送之電荷量的感度比，而補正基於自上述複數個像素之任一者傳送之電荷量的信號。In addition, the present technology based on other viewpoints is a correction processing method of the pixel signal of the imaging device. The correction processing method includes the steps of: reading the charge from a plurality of pixels accumulating charges generated according to the amount of incident light; and correcting a signal based on the amount of the charge read from the plurality of pixels. Here, the plurality of pixels include: a first pixel formed to have a first saturated charge amount; and a second pixel formed to have a second saturated charge amount smaller than the first saturated charge amount. In addition, the correction is based on the sensitivity ratio based on the amount of charge transferred from the first pixel to the sensitivity ratio based on the amount of charge transferred from the second pixel, and the correction is based on the charge transferred from any one of the plurality of pixels. The amount of signal.
另，於本說明書等中，機構並非簡單意指物理性機構者，亦包含藉由軟體實現該機構具有之功能的情形。又，可利用2個以上物理性機構實現1個機構具有之功能，或可利用1個物理性機構實現2個以上機構之功能。In addition, in this specification, the organization does not simply mean a physical organization, but also includes the situation where the function of the organization is realized by software. In addition, two or more physical mechanisms can be used to realize the functions of one mechanism, or one physical mechanism can be used to realize the functions of two or more mechanisms.
又，「系統」意指將複數個裝置(或實現特定功能之功能模組)邏輯性集合者，對各裝置或功能模組是否位於單一框體內未特別限定。In addition, "system" refers to a logical collection of a plurality of devices (or functional modules that implement specific functions), and there is no particular limitation on whether each device or functional module is located in a single frame.
本技術之其他技術性特徵、目的、及作用效果或優點由參照附加圖式說明之以下實施形態而明確。又，本說明書記載之效果僅為例示而非限定者，亦可有其他效果。Other technical features, purposes, effects, or advantages of this technology are clarified by the following embodiments described with reference to the attached drawings. In addition, the effects described in this specification are merely illustrative and not limiting, and other effects are possible.
以下，參照圖式說明本技術之實施形態。但，以下說明之實施形態僅為例示，並未意欲排除以下未明示之各種變化或技術之應用。本技術可於未脫離其主旨之範圍內各種變化(例如使各實施形態組合等)而實施。又，以下圖式之記載中，同一或類似部分附註有同一或類似之符號加以表示。圖式為模式性者，未必與實際尺寸或比例等一致。有圖式彼此間亦包含有彼此尺寸之關係或比例不同之部分的情況。Hereinafter, embodiments of the present technology will be described with reference to the drawings. However, the embodiments described below are only examples, and are not intended to exclude various changes or applications of technologies that are not explicitly shown below. This technique can be implemented in various changes (for example, combining various embodiments, etc.) without departing from the spirit thereof. In addition, in the description of the following drawings, the same or similar parts are indicated by the same or similar symbols. If the drawing is a model, it may not be consistent with the actual size or ratio. There are cases where the diagrams also include parts with different dimensions or ratios.
[第1實施形態]
圖1係顯示本技術之一實施形態之攝像裝置之構成之一例之圖。如同圖所示，攝像裝置1例如包含控制部10、像素陣列部20、垂直驅動部30、水平驅動部40、及行處理部50而構成。又，攝像裝置1可包含信號處理部60、及圖像記憶體70。攝像裝置1可構成為例如晶片上系統(SOC：System on Chip)，但未限定於此。[First Embodiment]
Fig. 1 is a diagram showing an example of the configuration of an imaging device according to an embodiment of the present technology. As shown in the figure, the
控制部10為統括性地控制攝像裝置1之電路。控制部10可包含產生各種時序信號之時序產生器(未圖示)。控制部10例如依據基於自外部供給之時脈信號而由時序產生器產生之各種時序信號，控制垂直驅動部30、水平驅動部40及行處理部50之動作。The
像素陣列部20包含產生並累積與入射之光之強度相應之電荷之配置為陣列狀之光電轉換元件群而構成。嵌入光電二極體為光電轉換元件222(參照圖4A)之一態樣。複數個光電轉換元件222之各者或數者可構成1個像素。各像素典型而言構成為包含彩色濾光片(參照圖4A)且接收與彩色濾光片對應之顏色成分之光。作為像素之排列，例如已知有四邊形(Quad)排列或拜爾(Bayer)排列，但未限定於此。同圖中，將像素陣列部20之上下方向稱為行方向或垂直方向，且將左右方向定義為列方向或水平方向。另，對像素陣列部20中之像素之構成之細節予以後述。The
垂直驅動部30包含位移暫存器或位址解碼器(未圖示)等構成。垂直驅動部30於控制部10之控制下，例如以列單位依序沿垂直方向驅動像素陣列部20之像素群。於本揭示中，垂直驅動部30可包含：讀取掃描電路32，其進行信號讀取用之掃描；及釋放掃描電路34，其進行自光電轉換元件222(參照圖4A)釋放(重設)無用電荷之掃描。The
讀取掃描電路32為自各像素讀取基於電荷之信號，而以列單位依序選擇掃描像素陣列部20之像素群。The reading and
釋放掃描電路34對於藉由讀取掃描電路32進行讀取動作之讀取列，較該讀取動作提前電子快門之動作速度之時間量，進行釋放掃描。藉由利用釋放掃描電路34對無用電荷之釋放(重設)，而進行所謂之電子快門動作。電子快門動作意指釋放光電轉換元件222之電荷，且重新開始曝光(電荷之累積)之動作。The
以藉由利用讀取掃描電路32之讀取動作讀取之電荷為基礎之信號，與上一個讀取動作或電子快門動作以後入射之光能之大小對應。且，自上一個讀取動作之讀取時序或電子快門動作之釋放動作時序，至本次之讀取動作之讀取時序之期間，成為像素上之電荷之累積時間。The signal based on the charge read by the reading operation of the
水平驅動部40包含位移暫存器或位址解碼器(未圖示)等構成。水平驅動部40於控制部10之控制下，例如以行單位依序沿水平方向驅動像素陣列部20之像素群。藉由利用垂直驅動部30及水平驅動部40之像素之選擇性驅動，而對行處理部50輸出以累積於所選擇之像素之電荷為基礎的信號。The
行處理部50對自像素陣列部20之選擇之列上之像素群之各者輸出之信號，進行例如CDS(Correlated Double Sampling；相關雙重取樣)處理之特定處理。具體而言，行處理部50接收自所選擇之列上之像素群之各者輸出之差量信號，求得該差量信號顯示之位準(電位)差，藉此取得1列量之像素各者之信號。又，行處理部50可對取得之信號去除固定圖案雜訊。行處理部50將實施此種特定處理之信號藉由A/D(Analog/Digital：類比/數位)轉換部(未圖示)轉換為數位信號，並將其作為像素信號輸出。The
信號處理部60係至少具有運算處理功能，且對於自行處理部50輸出之像素信號進行運算處理等多種信號處理的電路。數位信號處理器(DSP：Digital Signal Processor)為信號處理部60之一態樣。圖像記憶體70於以信號處理部60進行信號處理時，暫時儲存該處理所需之資料。本揭示之信號處理部60如後所述，進行基於來自通常像素及/或補正像素之像素信號，補正通常像素及/或補正像素的處理。另，信號處理部60亦可構成為進行行處理部50上之如上述之運算處理之全部或一部分。The
圖2係用以說明本技術之一實施形態之像素陣列部20之像素排列之一例之圖。於像素陣列部20中，複數個像素之各者包含彩色濾光片而構成，與彩色濾光片對應之各色成分之像素依據特定排列圖案而配置。彩色濾光片例如包含紅、綠及藍之3種濾光片，但未限定於此。於本揭示中，複數個像素中之一部分之像素形成為作為補正像素而發揮功能。於同圖中，藉由陰影線顯示之像素顯示為補正像素。補正像素係如後所述，以與通常像素比較，飽和電荷量較小且確保電荷傳送能力之方式形成的像素。藉由使用基於此種補正像素之信號進行補正處理，可防止低照度區域中空間解析度降低。FIG. 2 is a diagram for explaining an example of the pixel arrangement of the
圖2(a)及(b)顯示有依據拜爾排列之各色成分之像素排列之一例。於拜爾排列中，紅像素R、綠像素G及藍像素B以1：2：1之比例排列。關於綠像素G，有時根據例如水平方向上相鄰之像素，分別稱為綠像素Gb及Gr。典型而言，紅像素R、綠像素Gb及Gr以及藍像素B之4個像素形成1個像素區塊，且該像素區塊群排列為陣列狀，藉此形成拜爾排列。於同圖(a)所示之例中，相鄰之4個像素群中之綠像素G之1者(即綠像素Gr)作為補正綠像素Gr’形成。或，雖未圖示，但綠像素Gb亦可作為補正綠像素Gb’形成。Fig. 2 (a) and (b) show an example of the pixel arrangement of each color component according to the Bayer arrangement. In the Bayer arrangement, the red pixel R, the green pixel G, and the blue pixel B are arranged in a ratio of 1:2:1. The green pixels G are sometimes referred to as green pixels Gb and Gr based on pixels adjacent to each other in the horizontal direction, for example. Typically, 4 pixels of the red pixel R, the green pixels Gb and Gr, and the blue pixel B form a pixel block, and the pixel block group is arranged in an array, thereby forming a Bayer arrangement. In the example shown in (a) of the same figure, one of the green pixels G (i.e., the green pixel Gr) in the adjacent four pixel groups is formed as the corrected green pixel Gr'. Or, although not shown, the green pixel Gb may be formed as a corrected green pixel Gb'.
又，同圖(b)顯示有以補正像素間之間隔大於同色成分之像素間之間隔之方式配置補正像素之例。即，如同圖(b)所示之補正綠像素Gr’與同圖(a)比較，擴間隔而配置。於本例中，綠像素Gr每隔1個作為補正綠像素Gr’形成，但該間隔可適當設定。作為其他例，補正像素(未限定為綠像素)亦可於像素陣列部20之複數個像素排列中隨機配置。In addition, the same figure (b) shows an example of arranging the correction pixels such that the interval between the correction pixels is greater than the interval between the pixels of the same color component. That is, the corrected green pixel Gr' shown in (b) is compared with (a) in the same figure, and the intervals are expanded. In this example, every other green pixel Gr is formed as the corrected green pixel Gr', but the interval can be appropriately set. As another example, the correction pixels (not limited to green pixels) may also be randomly arranged in a plurality of pixel arrangements of the
圖3A及圖3B係用以說明本技術之一實施形態之像素陣列部20之像素排列之一例之圖。具體而言，圖3A及3B顯示有各色成分之像素依據四邊形排列而配置之像素排列之一例。四邊形排列係相鄰之4個像素為同色成分之排列。如同圖所示，若將相鄰之同色成分之4個像素視為1個像素區域，則各色成分之像素區塊群呈拜爾排列。換言之，四邊形排列為形成各色成分相關包含2×2像素之像素區塊，且依據拜爾排列而排列該像素區塊者。於該意義而言，如同圖所示之像素排列亦有稱為四邊形、拜爾排列之情況。3A and 3B are diagrams for explaining an example of the pixel arrangement of the
於同圖A(a)所示之例中，相鄰之同色成分之4個像素中之1個像素(例如圖中像素區塊上之左下之像素)形成為補正像素。In the example shown in A(a) of the same figure, one of the four adjacent pixels of the same color component (for example, the lower left pixel on the pixel block in the figure) is formed as a correction pixel.
又，例如圖3A(b)所示，相鄰之同色成分之4個像素中之2個像素(例如圖中，即像素區塊上位於對角上之像素)亦可作為補正像素形成。藉此，因補正像素之數量增加，故可防止低照度區域中空間解析度下降。Furthermore, for example, as shown in FIG. 3A(b), two of the adjacent four pixels of the same color component (for example, the pixels on the opposite corners of the pixel block in the figure) can also be formed as correction pixels. As a result, as the number of correction pixels increases, it is possible to prevent a decrease in spatial resolution in a low-illuminance area.
又，例如圖3B(c)所示，4個紅像素群R及4個藍像素群B之各者之一部分亦可作為補正像素形成。於本例中，未於綠像素G包含補正像素。因此，藉由例如於轉換為不同之像素排列用之重編馬賽克處理中有效使用自綠像素G讀取之信號，可高效進行重編馬賽克處理。Moreover, for example, as shown in FIG. 3B(c), a part of each of the four red pixel groups R and the four blue pixel groups B may also be formed as correction pixels. In this example, no correction pixel is included in the green pixel G. Therefore, by effectively using the signal read from the green pixel G in, for example, the re-mosaic processing for conversion to a different pixel arrangement, the re-mosaic processing can be efficiently performed.
又，例如圖3B(d)所示，於水平方向上，與紅像素R相鄰之綠像素G之一部分像素亦可作為補正像素形成。藉此，可減少補正像素之數量，且減輕補正處理所耗費之運算負荷。Moreover, for example, as shown in FIG. 3B(d), in the horizontal direction, a part of the pixels of the green pixel G adjacent to the red pixel R may also be formed as correction pixels. Thereby, the number of correction pixels can be reduced, and the computational load consumed by the correction processing can be reduced.
圖4A係顯示本技術之一實施形態之像素陣列部上之像素之概略性構造之一例之部分縱剖視圖。於同圖中，顯示有相鄰之通常像素200a及補正像素200b。4A is a partial longitudinal cross-sectional view showing an example of a schematic structure of a pixel on a pixel array portion of an embodiment of the present technology. In the same figure, adjacent
如同圖所示，像素陣列部20上之像素200例如包含微透鏡201、濾光層210、半導體基板220、及配線層230，且按序積層該等而構成。即，本揭示之攝像裝置1(參照圖1)為於與光所照射之半導體基板220之面相反側之面設置有配線層230之背面照射型攝像裝置。As shown in the figure, the pixel 200 on the
微透鏡201形成於像素200之正面，且將入射之光經由濾光層210聚光於半導體基板220之照射面。於本例中，相對於1個像素200形成有1個微透鏡201，但未限定於此，亦可相對於複數個(例如2個或4個)像素200，形成有1個微透鏡201。The
濾光層210以各像素200接收特定顏色成分之光之方式包含彩色濾光片而構成。彩色濾光片例如包含紅、綠及藍之濾光片，但未限定於此。如上所述，於本揭示中，彩色濾光片構成為依據四邊形排列或拜爾排列。The
半導體基板220包含接收入射之光且累積電荷之光電轉換元件222而構成。光電轉換元件222為例如包含P型半導體區域224及N型半導體區域226之嵌入光電二極體。本例之N型半導體區域226為可累積電荷之電荷累積區域。於本例中，作為補正像素200b發揮功能之光電轉換元件222之N型半導體區域226形成為較作為通常像素200a發揮功能之光電轉換元件222之N型半導體區域226更小(即，飽和電荷量變少)。通常像素200a及補正像素200b例如於半導體製造步驟中，藉由於磊晶成長層上塗佈用以形成N型半導體區域226之抗蝕劑進行植入(雜質注入)而形成。補正像素200b減小例如抗蝕劑之開口部之面積，以使雜質之注入量變少，藉此而形成。The
配線層230包含傳送閘極電極232及金屬配線234而構成。傳送閘極電極232電性連接於光電轉換元件222。對於傳送閘極電極232，於控制部10之控制下施加閘極電壓。藉由於攝像裝置1之動作中控制施加至傳送閘極電極232之閘極電壓，而將電荷累積區域所累積之電荷傳送至浮動擴散236(參照圖5)。The
通常像素200a與補正像素200b，其構造基本相同，但如上所述，補正像素200b於半導體基板220上之光電轉換元件222較通常像素200a形成得更小之點上，與通常像素200a不同。如此，藉由使補正像素200b之光電轉換元件222形成得較通常像素200a之光電轉換元件222更小，補正像素200b之飽和電荷量較通常像素200a之飽和電荷量更小，另一方面，補正像素200b之電荷傳送效率提高。Generally, the structure of the
圖5係用以說明本技術之像素陣列部上之像素之電極之部分剖視俯視圖。同圖顯示有依據四邊形排列之像素區塊。於本例中，形成有同色相鄰之4個像素200中之1者作為補正像素200b。FIG. 5 is a partial cross-sectional top view for explaining the electrode of the pixel on the pixel array portion of the present technology. The same figure shows the pixel blocks arranged according to a quadrilateral. In this example, one of four adjacent pixels 200 of the same color is formed as the
如同圖所示，於相鄰之4個像素200之中央部形成有浮動擴散236。又，各像素200之傳送閘極電極232配置為包圍浮動擴散236。即，相鄰之4個像素200共用1個浮動擴散236。於本例中，補正像素200b之傳送閘極電極232形成為其面積較通常像素200a之傳送閘極電極232更大。藉此，自通常像素200a之電荷累積區域向浮動擴散236傳送電荷進行得更高效。As shown in the figure, a floating
於各像素200之周邊，配置有例如放大電晶體238或選擇電晶體239等。基於經由傳送閘極電極232傳送至浮動擴散236之電荷的信號由放大電晶體238放大，並經由選擇電晶體239作為像素信號輸出。At the periphery of each pixel 200, for example, an
另，上述之補正像素200b之傳送閘極電極232足夠大之情形等，且電荷傳送特性之情形，例如圖4B所示，補正像素200b之電荷累積區域(於本例中為N型半導體區域226)亦可形成為與通常像素200a之電荷累積區域相同或稍小。又，於補正像素200b之電荷累積區域足夠小之情形，且電荷傳送特性良好之情形，如圖4C所示，補正像素200b之傳送閘極電極232之面積亦可形成為與通常像素200a之傳送閘極電極232之者相同或稍大。In addition, the above-mentioned case where the
圖6係用以說明本技術之一實施形態之攝像裝置上之像素信號之補正處理之一例之流程圖。該補正處理藉由信號處理部60執行。另，以下，以對於自圖3A所示之四邊形排列之像素陣列部20輸出之像素信號的補正處理為例加以說明。FIG. 6 is a flowchart for explaining an example of pixel signal correction processing on the imaging device of an embodiment of the present technology. This correction process is executed by the
如同圖所示，信號處理部60接收自行處理部50以列單位輸出之像素信號(S601)。接收之像素信號為補正處理等而暫時保持於圖像記憶體70。As shown in the figure, the
繼而，信號處理部60基於接收之像素信號，關於特定顏色成分之像素，算出通常像素之感度比及補正像素之感度比(S602)。具體而言，於本例中，信號處理部60分別算出通常紅像素R之感度比及補正紅像素R’之感度比，且分別算出通常藍像素B之感度比及補正藍像素B’之感度比。通常紅像素R之感度比意指例如通常紅像素R之電荷量相對於通常綠像素Gr之電荷量之比，補正紅像素R’之感度比意指例如補正紅像素R’之電荷量相對於補正綠像素Gr’之電荷量之比。又，通常藍像素B之感度比意指例如通常藍像素B之電荷量相對於通常綠像素Gb之電荷量之比，補正藍像素B’之感度比意指例如補正藍像素B’之電荷量相對於補正綠像素Gb’之電荷量之比。Then, the
信號處理部60繼而對上述特定顏色成分之像素，算出已算出之補正像素之感度比與通常像素之感度比之間之差(S603)。即，信號處理部60算出已算出之補正紅像素R’之感度比與通常紅像素R之感度比之差之絕對值|Δs_R|，且算出補正藍像素B’之感度比與通常藍像素B之感度比之間之差之絕對值|Δs_B|。The
接著，信號處理部60判定算出之補正紅像素R’之感度比與通常紅像素R之感度比之差之絕對值|Δs_R|是否小於畫質參數基準值ref_R(S604)。畫質參數基準值ref_R係針對紅像素之畫質預先予以調整而設定之數值(例如0.1)。即，差之絕對值|Δs_R|小於畫質參數基準值ref_R之情形，意指通常紅像素R之電荷量與補正紅像素R’之電荷量相比之下為充分之量，因而通常紅像素R之電荷傳送無問題。信號處理部60當判定為補正紅像素R’之感度比與通常紅像素R之感度比之差之絕對值|Δs_R|小於畫質參數基準值ref_R時(S604之是(Yes))，繼而判定算出之補正藍像素B’之感度比與通常藍像素B之感度比之差之絕對值|Δs_B|是否小於畫質參數基準值ref_B(S605)。畫質參數基準值ref_B係針對藍像素之畫質預先予以調整而設定之數值(例如0.1)。即，差之絕對值|Δs_B|小於畫質參數基準值ref_B之情形，意指通常藍像素B之電荷量與補正藍像素B’之電荷量相比之下為充分，因而通常藍像素B之電荷傳送無問題。Next, the
信號處理部60於判定補正紅像素R’之感度比與通常紅像素R之感度比之差之絕對值|Δs_R|小於畫質參數基準值ref_R(S604之是(Yes))且判定補正藍像素B’之感度比與通常藍像素B之感度比之差之絕對值|Δs_B|小於畫質參數基準值ref_B之情形(S605之是(Yes))，信號處理部60將補正像素200b之信號補正(S606)。即，來自像素之電荷之輸出量為OF(Over Flow：溢流)位準(即，最大)之情形，信號處理部60將補正像素200b之信號補正。具體而言，如圖7(a)所示，信號處理部60將基於來自補正像素200b之電荷的信號，以基於來自同一像素區塊上相鄰之同色成分之3個通常像素200a之電荷的信號為基礎加以補正。此時，信號處理部60亦可例如算出來自與補正像素200b相鄰之同色成分之通常像素200a之電荷之平均，且配合基於該電荷之平均的信號，補正基於來自補正像素200b之電荷的信號。另，於本例中，信號處理部60不對基於通常像素200a之電荷的信號補正而直接輸出。The
信號處理部60若將補正像素200b之信號補正，則將信號發送至後段(S611)，且結束該像素信號相關之處理。When the
又，信號處理部60於判定補正紅像素R’之感度比與通常紅像素R之感度比之差之絕對值|Δs_R|小於畫質參數基準值ref_R(S604之是(Yes))且判定補正藍像素B’之感度比與通常藍像素B之感度比之差之絕對值|Δs_B|不小於畫質參數基準值ref_B之情形(S605之否(No))，信號處理部60補正通常藍像素B及通常綠像素Gb之信號(S607)。即，於來自藍像素之電荷之輸出量為中間(高位準(高照度區域)與低位準(低照度區域)之間)之情形，補正通常藍像素B及通常綠像素Gb之信號。具體而言，如圖7(b)所示，信號處理部60將基於通常藍像素B及通常綠像素Gb之電荷的信號，分別以基於來自同一像素區塊之補正藍像素B’及補正綠像素Gb’之電荷的信號為基礎加以補正。此時，信號處理部60亦可構成為僅補正通常藍像素B之信號。In addition, the
信號處理部60若補正通常藍像素B及通常綠像素Gb之信號，則將信號發送至後段(S611)，並結束該像素信號相關之處理。If the
另一方面，信號處理部60於判定補正紅像素R’之感度比與通常紅像素R之感度比之差不小於畫質參數基準值ref_R之情形(S604之否(No))，判定算出之補正藍像素B’之感度比與通常藍像素B之感度比之差之絕對值|Δs_B|是否小於畫質參數基準值ref_B(S608)。信號處理部60於判定補正紅像素R’之感度比與通常紅像素R之感度比之差之絕對值|Δs_R|不小於畫質參數基準值ref_R(S604之否(No))且判定補正藍像素B’之感度比與通常藍像素B之感度比之差之絕對值|Δs_B|小於畫質參數基準值ref_B之情形(S608之是(Yes))，信號處理部60將通常紅像素R及通常綠像素Gr之信號補正(S609)。即，於本例中，於來自紅像素之電荷之輸出量位於高位準與低位準之間之情形，補正通常紅像素R及通常綠像素Gr之信號。具體而言，如圖7(c)所示，信號處理部60將基於通常紅像素R及通常綠像素Gr之電荷的信號，分別以基於來自同一像素區塊之補正紅像素R’及補正綠像素Gr’之電荷的信號為基礎加以補正。此時，信號處理部60亦可僅補正通常紅像素R之信號。On the other hand, the
信號處理部60若補正通常紅像素R及通常綠像素Gr之信號，則將信號發送至後段(S611)，結束該像素信號相關之處理。When the
又，信號處理部60於判定補正紅像素R’之感度比與通常紅像素R之感度比之差之絕對值|Δs_R|不小於畫質參數基準值ref_R(S604之否(No))，且判定補正藍像素B’之感度比與通常藍像素B之感度比之差之絕對值|Δs_B|小於畫質參數基準值ref_B之情形(S608之否(No))，信號處理部60將通常像素200a之信號補正(S610)。即，於電荷之輸出量為極低位準之情形，補正通常像素200a。具體而言，如圖7(d)所示，信號處理部60將基於3個通常像素200a之電荷的信號，以基於來自同一像素區塊內相鄰之補正像素200b之電荷的信號為基礎加以補正。In addition, the
信號處理部60若補正通常像素200a之信號，則將信號發送至後段(S611)，結束該像素信號相關之處理。When the
如此，於四邊形排列之像素排列時，信號處理部60可於高照度區域上將補正像素200b補正，且可於低照度區域上將通常像素200a補正。藉此，可防止像素特性之線性惡化。又，信號處理部60可按各顏色成分補正像素200。In this way, when the pixels are arranged in a quadrangular arrangement, the
圖8係用以說明本技術之一實施形態之攝像裝置上之像素信號之補正處理之一例之流程圖。該補正處理藉由信號處理部60執行。另，以下，以對於自圖2所示之拜爾排列之像素陣列部20輸出之像素信號的補正處理為例進行說明。又，於本例中，將綠像素Gr作為補正像素。FIG. 8 is a flowchart for explaining an example of pixel signal correction processing on the imaging device of an embodiment of the present technology. This correction process is executed by the
如同圖所示，信號處理部60接收自行處理部50以列單位輸出之像素信號(S801)。接收之像素信號為補正處理等而暫時保持於圖像記憶體70。As shown in the figure, the
繼而，信號處理部60基於接收之像素信號，關於特定顏色成分之像素，算出通常像素之感度比及補正像素之感度比(S802)。具體而言，信號處理部60分別算出通常綠像素Gb之感度比及補正綠像素Gr’之感度比。通常綠像素Gb之感度比意指例如通常綠像素Gb之電荷量相對於通常紅像素R之電荷量之比，補正綠像素Gr’之感度比意指例如補正綠像素Gr’之電荷量相對於通常紅像素R之電荷量之比。Then, the
信號處理部60繼而關於特定顏色成分之像素，將算出之補正像素之感度比與通常像素之感度比之間之差算出(S803)。即，信號處理部60將算出之通常綠像素Gb之感度比與補正綠像素Gr’之感度比之差之絕對值|Δs_G|算出。The
接著，信號處理部60判定算出之通常綠像素Gb之感度比與補正綠像素Gr’之感度比之差之絕對值|Δs_G|是否小於畫質參數基準值ref_G(S804)。畫質參數基準值ref_G為例如預先調整設定之數值(例如0.1)。即，差之絕對值|Δs_G|小於畫質參數基準值ref_G之情形，意指通常綠像素Gb之電荷量與補正綠像素Gr’之電荷量比較時足夠，即，通常綠像素Gb之電荷傳送無問題。Next, the
信號處理部60若判定補正綠像素Gr’之感度比與通常綠像素Gb之感度比之差之絕對值|Δs_G|小於畫質參數基準值ref_G(S804之是(Yes))，則將補正綠像素Gr’之信號補正(S805)。具體而言，如圖9(a)所示，信號處理部60將基於來自補正綠像素Gr’之電荷的信號，以基於來自同色成分之通常綠像素Gb之電荷的信號為基礎加以補正。同色成分之通常綠像素Gb為配置於補正綠像素Gr’之周圍的像素。此時，信號處理部60例如亦可配合來自與補正像素200b相鄰之異色成分之通常像素200a之電荷之輸出量，將基於來自補正像素200b之電荷的信號補正。信號處理部60若將補正綠像素Gr’之信號補正，則將信號發送至後段(S806)，且結束該像素信號相關之處理。If the
另一方面，信號處理部60若判定補正綠像素Gr’之感度比與通常綠像素Gb之感度比之差不小於畫質參數基準值ref_G(S804之否(No))，則將通常綠像素Gb之信號補正(S806)。具體而言，如圖9(b)所示，信號處理部60將基於來自通常綠像素Gb之電荷的信號，以基於來自同一像素區塊上之同色成分之補正綠像素Gr’之電荷的信號為基礎加以補正。信號處理部60若將通常綠像素Gb之信號補正，則將信號發送至後段(S806)，且結束該像素信號相關之處理。On the other hand, if the
如此，於拜爾排列之像素排列之情形，信號處理部60可於高照度區域上將補正像素200b補正，且可於低照度區域上將通常像素200a補正。藉此，可防止像素特性之線性惡化。In this way, in the case of the pixel arrangement of the Bayer arrangement, the
＜對電子機器之應用例＞
上述之攝像裝置1可應用於例如數位靜態相機或數位攝影機等攝像裝置、具備攝像功能之行動電話、或具備攝像功能之其他機器等各種電子機器。＜Examples of application to electronic devices＞
The above-mentioned
圖10係顯示作為應用本技術之電子機器之攝像裝置之構成之一例之方塊圖。如同圖所示，攝像裝置100可具備光學系統12、快門裝置14、攝像裝置1、控制部10、信號處理部60、圖像記憶體70、及監視器80。FIG. 10 is a block diagram showing an example of the configuration of an imaging device of an electronic device to which this technology is applied. As shown in the figure, the
光學系統12可由1片或複數片透鏡構成。光學系統12將來自被攝體之光引導至攝像裝置1，且使之成像於攝像裝置1之像素陣列部20。又，光學系統12依據控制部10之控制而進行透鏡之焦點調節或驅動控制。The
快門裝置14如上所述，藉由利用攝像裝置1之釋放掃描電路34對無用電荷之釋放(重設)，而進行電子快門動作。快門裝置14依據控制部10之控制，控制對攝像裝置1之光照射期間及受光期間。As described above, the
監視器80顯示藉由信號處理部60實施信號處理而獲得之圖像資料。攝像裝置之使用者(例如攝影者)可經由目鏡(未圖示)自監視器80觀察圖像資料。The
上述各實施形態係用於說明本技術之例示，主旨並非為將本技術僅限定於該等實施形態。本技術可於未脫離其主旨之範圍內以各種形態實施。The above-mentioned respective embodiments are examples for explaining the present technology, and the main point is not to limit the present technology to only these embodiments. This technology can be implemented in various forms without departing from the scope of the gist.
例如，於本說明書所揭示之方法中，只要其結果未產生矛盾，則亦可使步驟、動作或功能並行或按不同順序實施。說明之步驟、動作及功能僅作為例子提供，亦可於不脫離發明之主旨之範圍內省略步驟、動作及功能中之數者，又可藉由使彼此結合而設為一者，又，亦可追加其他步驟、動作或功能。For example, in the method disclosed in this specification, as long as there is no contradiction in the results, the steps, actions, or functions can also be implemented in parallel or in a different order. The described steps, actions, and functions are provided as examples only, and some of the steps, actions, and functions may be omitted within the scope of the spirit of the invention, and they may be combined with each other to be one, and also, Other steps, actions or functions can be added.
又，於本說明書中，揭示有各種實施形態，但可將一實施形態中之特定特徵(技術性事項)適當改良，且追加至其他實施形態或與該其他實施形態中之特定特徵置換，此種形態亦包含於本技術之主旨。In addition, in this specification, various embodiments are disclosed, but the specific features (technical matters) in one embodiment can be appropriately improved and added to or replaced with specific features in other embodiments. This form is also included in the subject of this technology.
＜對移動體之應用例＞ 本揭示之技術(本技術)可應用於各種製品。例如，本揭示之技術亦可作為搭載於汽車、電動汽車、油電混合汽車、機車、腳踏車、個人移動載具、飛機、無人機、船舶、機器人等任一種類之移動體之裝置而實現。＜Examples of application to moving objects＞ The technique of the present disclosure (this technique) can be applied to various products. For example, the technology of the present disclosure can also be implemented as a device mounted on any type of mobile body such as automobiles, electric vehicles, hybrid vehicles, locomotives, bicycles, personal mobile vehicles, airplanes, drones, ships, and robots.
圖11係顯示可應用本揭示之技術之移動體控制系統之一例即車輛控制系統之概略構成例的方塊圖。FIG. 11 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile body control system to which the technology of the present disclosure can be applied.
車輛控制系統12000具備經由通信網路12001連接之複數個電子控制單元。於圖11所示之例中，車輛控制系統12000具備驅動系統控制單元12010、車身系統控制單元12020、車外資訊檢測單元12030、車內資訊檢測單元12040及綜合控制單元12050。又，作為綜合控制單元12050之功能構成，圖示微電腦12051、聲音圖像輸出部12052、及車載網路I/F(interface：介面)12053。The
驅動系統控制單元12010根據各種程式控制與車輛之驅動系統關聯之裝置之動作。例如，驅動系統控制單元12010作為內燃機或驅動用馬達等用以產生車輛之驅動力之驅動力產生裝置、用以將驅動力傳遞至車輪之驅動力傳遞機構、調節車輛舵角之轉向機構、及產生車輛之制動力之控制裝置等控制裝置發揮功能。The drive
車身系統控制單元12020根據各種程式控制車身所裝備之各種裝置之動作。例如，車身系統控制單元12020作為無鑰匙門禁系統、智慧型鑰匙系統、電動窗裝置、或頭燈、尾燈、剎車燈、方向燈或霧燈等各種燈之控制裝置發揮功能。於該情形時，可對車身系統控制單元12020輸入自代替鑰匙之可攜帶式機器發送之電波或各種開關之信號。車身系統控制單元12020受理該等電波或信號之輸入，並控制車輛之門鎖裝置、電動窗裝置、燈等。The body
車外資訊檢測單元12030檢測搭載有車輛控制系統12000之車輛的外部資訊。例如，於車外資訊檢測單元12030連接有攝像部12031。車外資訊檢測單元12030使攝像部12031拍攝車外之圖像，且接收所拍攝之圖像。車外資訊檢測單元12030亦可基於接收到之圖像，進行人、車、障礙物、標識或路面上之文字等物體檢測處理或距離檢測處理。The exterior
攝像部12031係接收光並輸出對應於該光之受光量之電性信號的光感測器。攝像部12031可將電性信號作為圖像輸出，亦可作為測距之資訊輸出。又，攝像部12031接收之光可為可見光，亦可為紅外線等非可見光。The
車內資訊檢測單元12040檢測車內之資訊。於車內資訊檢測單元12040連接有例如檢測駕駛者之狀態之駕駛者狀態檢測部12041。駕駛者狀態檢測部12041包含例如拍攝駕駛者之相機，車內資訊檢測單元12040可基於自駕駛者狀態檢測部12041輸入之檢測資訊，算出駕駛者之疲勞程度或注意力集中程度，亦可判斷駕駛者是否正在打瞌睡。The in-vehicle
微電腦12051可基於由車外資訊檢測單元12030或車內資訊檢測單元12040取得之車內外之資訊，運算驅動力產生裝置、轉向機構或制動裝置之控制目標值，對驅動系統控制單元12010輸出控制指令。例如，微電腦12051可進行以實現包含避免車輛碰撞或緩和衝擊、基於車輛距離之追隨行駛、車速維持行駛、車輛之碰撞警告或車輛之車道偏離警告等之ADAS(Advanced Driver Assistance System：先進駕駛輔助系統)之功能為目的之協調控制。The
又，微電腦12051可藉由基於由車外資訊檢測單元12030或車內資訊檢測單元12040取得之車輛周圍之資訊，控制驅動力產生裝置、轉向機構或制動裝置等，而進行以不拘於駕駛者之操作而自動行駛之自動駕駛為目的之協調控制。In addition, the
又，微電腦12051可基於由車外資訊檢測單元12030取得之車外之資訊，對車身系統控制單元12020輸出控制指令。例如，微電腦12051可根據由車外資訊檢測單元12030檢測出之前方車或對向車之位置控制頭燈，進行以將遠光切換成近光等謀求防眩為目的之協調控制。In addition, the
聲音圖像輸出部12052將聲音及圖像中之至少一者之輸出信號發送至可對車輛之搭乘者或車外通知視覺性或聽覺性資訊之輸出裝置。於圖11之例中，作為輸出裝置，例示有音頻揚聲器12061、顯示部12062及儀表板12063。顯示部12062亦可包含例如車載顯示器及抬頭顯示器之至少一者。The audio and
圖12係顯示攝像部12031之設置位置之例之圖。FIG. 12 is a diagram showing an example of the installation position of the
於圖12中，車輛12100具有作為攝像部12031之攝像部12101、12102、12103、12104、12105。In FIG. 12, a
攝像部12101、12102、12103、12104、12105設置於例如車輛12100之前鼻、側視鏡、後保險桿、後門及車廂內之擋風玻璃之上部等位置。前鼻所具備之攝像部12101及車廂內之擋風玻璃之上部所具備之攝像部12105主要取得車輛12100前方之圖像。側視鏡所具備之攝像部12102、12103主要取得車輛12100側方之圖像。後保險桿或後門所具備之攝像部12104主要取得車輛12100後方之圖像。以攝像部12101及12105取得之前方圖像主要用於前方車輛或行人、障礙物、號誌機、交通標識或車道線等之檢測。The
另，於圖12顯示攝像部12101至12104之攝像範圍之一例。攝像範圍12111顯示設置於前鼻之攝像部12101之攝像範圍，攝像範圍12112、12113分別顯示設置於側視鏡之攝像部12102、12103之攝像範圍，攝像範圍12114顯示設置於後保險桿或後門之攝像部12104之攝像範圍。例如，藉由使攝像部12101至12104所拍攝之圖像資料重疊，而獲得自上方觀察車輛12100之俯瞰圖像。In addition, an example of the imaging range of the
攝像部12101至12104之至少一者亦可具有取得距離資訊之功能。例如，攝像部12101至12104之至少一者可為包含複數個攝像元件之攝影機，亦可為具有相位差檢測用像素之攝像元件。At least one of the
例如，微電腦12051基於自攝像部12101至12104取得之距離資訊，求得攝像範圍12111至12114內之至各立體物之距離、及該距離之時間變化(相對於車輛12100之相對速度)，藉此可擷取尤其於車輛12100之行進路上某最近之立體物且在與車輛12100大致相同之方向以特定速度(例如為0 km/h以上)行駛之立體物，作為前方車。進而，微電腦12051可設定前方車之近前應預先確保之車間距離，進行自動剎車控制(亦包含追隨停止控制)或自動加速控制(亦包含追隨起動控制)等。可如此地進行以不拘於駕駛者之操作而自動行駛之自動駕駛等為目的之協調控制。For example, the
例如，微電腦12051基於自攝像部12101至12104獲得之距離資訊，將立體物相關之立體物資訊分類成二輪車、普通車輛、大型車輛、行人、電線桿等其他立體物並擷取，用於障礙物之自動避開。例如，微電腦12051可將車輛12100周邊之障礙物辨識為車輛12100之駕駛員可視認之障礙物與難以視認之障礙物。且，微電腦12051判斷表示與各障礙物碰撞之危險度之碰撞危險性，碰撞危險性為設定值以上，有可能碰撞之狀況時，經由音頻揚聲器12061或顯示部12062對駕駛員輸出警報，或經由驅動系統控制單元12010進行強制減速或避開轉向，藉此可進行用以避免碰撞之駕駛支援。For example, based on the distance information obtained from the
攝像部12101至12104之至少一者亦可為檢測紅外線之紅外線相機。例如，微電腦12051可藉由判斷攝像部12101至12104之攝像圖像中是否存在行人而辨識行人。該行人之辨識係根據例如擷取作為紅外線相機之攝像部12101至12104之攝像圖像之特徵點之順序、及對表示物體輪廓之一連串特徵點進行圖案匹配處理而判別是否為行人之順序進行。若微電腦12051判斷攝像部12101至12104之攝像圖像中存在行人且辨識為行人，則聲音圖像輸出部12052以對該經辨識出之行人重疊顯示用以強調之方形輪廓線之方式，控制顯示部12062。又，聲音圖像輸出部12052亦可以將表示行人之圖標等顯示於期望之位置之方式控制顯示部12062。At least one of the
以上，對可應用本揭示之技術的車輛控制系統之一例進行說明。本揭示之技術於以上說明之構成中，可應用於攝像部12301。具體而言，攝像部12301之像素陣列部上之複數個像素中之一部分像素可形成為作為補正像素發揮功能。藉由於攝像部12301應用本揭示之技術，可進行補正像素或通常像素之補正處理，防止像素特性之線性惡化引起之畫質降低。Above, an example of a vehicle control system to which the technology of the present disclosure can be applied has been described. The technology of the present disclosure can be applied to the imaging unit 12301 in the configuration described above. Specifically, some of the pixels on the pixel array section of the imaging section 12301 may be formed to function as correction pixels. By applying the technology of the present disclosure to the imaging unit 12301, it is possible to perform correction processing of the corrected pixels or normal pixels, and prevent the degradation of the image quality caused by the linear deterioration of the pixel characteristics.
＜對內視鏡手術系統之應用例＞ 本揭示之技術(本技術)可應用於各種製品。例如，本揭示之技術亦可應用於內視鏡手術系統。＜Application examples of endoscopic surgery system＞ The technique of the present disclosure (this technique) can be applied to various products. For example, the technology of the present disclosure can also be applied to endoscopic surgery systems.
圖13係顯示可應用本揭示之技術(本技術)之內視鏡手術系統之概略構成之一例的圖。FIG. 13 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technique of the present disclosure (this technique) can be applied.
於圖13中，圖示施術者(醫師)11131使用內視鏡手術系統11000，對病床11133上之患者11132進行手術之狀況。如圖所示，內視鏡手術系統11000由內視鏡11100、氣腹管11111或能量處置器具11112等之其他手術器械11110、支持內視鏡11100之支持臂裝置11120、及搭載有用於內視鏡下手術之各種裝置之台車11200構成。In FIG. 13, the operator (doctor) 11131 uses the
內視鏡11100由將距前端特定長度之區域***至患者11132之體腔內之鏡筒11101、與連接於鏡筒11101之基端之相機頭11102構成。於圖示之例中，圖示作為具有硬性鏡筒11101之所謂硬性鏡構成之內視鏡11100，但內視鏡11100亦可作為具有軟性鏡筒之所謂軟性鏡構成。The
於鏡筒11101之前端，設置嵌入有對物透鏡之開口部。於內視鏡11100連接有光源裝置11203，由該光源裝置11203產生之光藉由於鏡筒11101內部延設之導光件而被導光至該鏡筒之前端，並經由對物透鏡向患者11132體腔內之觀察對象照射。另，內視鏡11100可為直視鏡，亦可為斜視鏡或側視鏡。At the front end of the
於相機頭11102之內部設置有光學系統及攝像元件，來自觀察對象之反射光(觀察光)藉由該光學系統而聚光於該攝像元件。藉由該攝像元件將觀察光進行光電轉換，產生對應於觀察光之電性信號，即對應於觀察圖像之圖像信號。該圖像信號作為RAW資料而發送至相機控制單元(CCU：Camera Control Unit)11201。An optical system and an imaging element are arranged inside the
CCU11201由CPU(Central Processing Unit：中央處理單元)或GPU (Graphics Processing Unit：圖形處理單元)等構成，且統籌性地控制內視鏡11100及顯示裝置11202之動作。再者，CCU11201自相機頭11102接收圖像信號，對該圖像信號實施例如顯影處理(去馬賽克處理)等、用以顯示基於該圖像信號之圖像的各種圖像處理。The
顯示裝置11202根據來自CCU11201之控制，顯示基於由該CCU11201實施圖像處理後之圖像信號的圖像。The
光源裝置11203由例如LED(Light Emitting Diode：發光二極體)等光源構成，將拍攝手術部位等時之照射光供給至內視鏡11100。The
輸入裝置11204為針對內視鏡手術系統11000之輸入介面。使用者可經由輸入裝置11204，對內視鏡手術系統11000進行各種資訊之輸入或指示輸入。例如，使用者輸入旨在變更內視鏡11100之攝像條件(照射光之種類、倍率及焦點距離等)的指示等。The
處置器具控制裝置11205控制用於燒灼組織、切開或封合血管等之能量處置器具11112之驅動。氣腹裝置11206基於確保內視鏡11100之視野及確保施術者之作業空間之目的，為了使患者11132之體腔鼓起，而經由氣腹管11111對該體腔內送入氣體。記錄器11207係可記錄手術相關之各種資訊之裝置。印表機11208係可以文字、圖像或圖形等各種形式列印手術相關之各種資訊之裝置。The treatment instrument control device 11205 controls the driving of the
另，對內視鏡11100供給拍攝手術部位時之照射光的光源裝置11203，例如可由LED、雷射光源或將該等組合而構成之白色光源構成。於藉由RGB雷射光源之組合構成白色光源之情形時，由於可高精度地控制各色(各波長)之輸出強度及輸出時序，故光源裝置11203中可進行攝像圖像之白平衡之調整。又，於該情形時，亦可藉由分時對觀察對象照射來自RGB雷射光源各者之雷射光，與該照射時序同步控制相機頭11102之攝像元件之驅動，而分時拍攝對應於RGB各者之圖像。根據該方法，即便不於該攝像元件設置彩色濾光片，亦可獲得彩色圖像。In addition, the
又，光源裝置11203亦可以每隔特定時間變更要輸出之光的強度之方式控制其驅動。與該光之強度之變更時序同步，控制相機頭11102之攝像元件之驅動，分時取得圖像，並合成該圖像，藉此可產生不存在所謂欠曝及過曝之高動態範圍之圖像。In addition, the
又，光源裝置11203亦可構成為能夠供給對應於特殊光觀察之特定波長頻帶之光。於特殊光觀察中，例如進行所謂窄頻帶光觀察(Narrow Band Imaging)，即，利用身體組織之光吸收之波長依存性，照射與通常觀察時之照射光(即白色光)相比更窄頻帶之光，藉此以高對比度拍攝黏膜表層之血管等特定組織。或，於特殊光觀察中，亦可進行藉由因照射激發光產生之螢光獲得圖像之螢光觀察。於螢光觀察中，可進行對身體組織照射激發光，觀察來自該身體組織之螢光(自螢光觀察)，或將吲哚青綠(ICG)等試劑局部注射於身體組織，且對該身體組織照射對應於該試劑之螢光波長之激發光，獲得螢光像等。光源裝置11203可構成為能供給對應於如此之特殊光觀察之窄頻帶光及/或激發光。In addition, the
圖14係顯示圖13所示之相機頭11102及CCU11201之功能構成之一例之方塊圖。FIG. 14 is a block diagram showing an example of the functional configuration of the
相機頭11102具有透鏡單元11401、攝像部11402、驅動部11403、通信部11404及相機頭控制部11405。CCU11201具有通信部11411、圖像處理部11412及控制部11413。相機頭11102與CCU11201藉由傳輸纜線11400可相互通信地連接。The
透鏡單元11401係設置於與鏡筒11101之連接部之光學系統。將自鏡筒11101之前端擷取之觀察光導光至相機頭11102，並入射至該透鏡單元11401。透鏡單元11401係組合包含變焦透鏡及聚焦透鏡之複數個透鏡而構成。The
攝像部11402以攝像元件構成。構成攝像部11402之攝像元件可為1個(所謂單板式)，亦可為複數個(所謂多板式)。於攝像部11402以多板式構成之情形時，例如亦可藉由各攝像元件產生對應於RGB各者之圖像信號，並將其等合成，藉此可獲得彩色圖像。或，攝像部11402亦可構成為具有用以分別取得對應於3D(Dimensional：維)顯示之右眼用及左眼用圖像信號之1對攝像元件。藉由進行3D顯示，施術者11131可更準確地掌握手術部位之身體組織之深度。另，於攝像部11402以多板式構成之情形時，亦可對應於各攝像元件，設置複數個透鏡單元11401。The
又，攝像部11402亦可不設置於相機頭11102。例如，攝像部11402亦可於鏡筒11101之內部設置於對物透鏡之正後方。In addition, the
驅動部11403由致動器構成，且根據來自相機頭控制部11405之控制，使透鏡單元11401之變焦透鏡及聚焦透鏡沿光軸移動特定距離。藉此，可適當調整攝像部11402之攝像圖像之倍率及焦點。The driving
通信部11404由用以與CCU11201之間收發各種資訊之通信裝置構成。通信部11404將自攝像部11402獲得之圖像信號作為RAW資料經由傳輸纜線11400發送至CCU11201。The
又，通信部11404自CCU11201接收用以控制相機頭11102之驅動的控制信號，並供給至相機頭控制部11405。該控制信號中包含例如指定攝像圖像之訊框率之主旨之資訊、指定攝像時之曝光值之主旨之資訊、及/或指定攝像圖像之倍率及焦點之主旨之資訊等攝像條件相關之資訊。In addition, the
另，上述訊框率或曝光值、倍率、焦點等攝像條件可由使用者適當設定，亦可基於取得之圖像信號由CCU11201之控制部11413自動設定。於後者之情形時，將所謂之AE(Auto Exposure：自動曝光)功能、AF(Auto Focus：自動聚焦)功能及AWB(Auto White Balance：自動白平衡)功能搭載於內視鏡11100。In addition, the aforementioned imaging conditions such as the frame rate, exposure value, magnification, and focus can be appropriately set by the user, or can be automatically set by the
相機頭控制部11405基於經由通信部11404接收之來自CCU11201之控制信號，控制相機頭11102之驅動。The camera
通信部11411由用以於與相機頭11102之間收發各種資訊之通信裝置構成。通信部11411自相機頭11102接收經由傳輸纜線11400發送之圖像信號。The
又，通信部11411對相機頭11102發送用以控制相機頭11102之驅動的控制信號。圖像信號或控制信號可藉由電性通信或光通信等發送。In addition, the
圖像處理部11412對自相機頭11102發送之RAW資料即圖像信號實施各種圖像處理。The
控制部11413進行利用內視鏡11100之手術部位等之拍攝、及藉由拍攝手術部位等獲得之攝像圖像之顯示相關之各種控制。例如，控制部11413產生用以控制相機頭11102之驅動之控制信號。The
又，控制部11413基於由圖像處理部11412實施圖像處理之圖像信號，使顯示裝置11202顯示手術部位等映射之攝像圖像。此時，控制部11413亦可使用各種圖像辨識技術辨識攝像圖像內之各種物體。例如，控制部11413可藉由檢測攝像圖像所含之物體之邊緣形狀或顏色等，而辨識鉗子等手術器械、特定之身體部位、出血、使用能量處置器具11112時之霧等。控制部11413於使顯示裝置11202顯示攝像圖像時，亦可使用該辨識結果，使各種手術支援資訊與該手術部位之圖像重疊顯示。可藉由重疊顯示手術支援資訊，對施術者11131提示，而減輕施術者11131之負擔，施術者11131可確實進行手術。In addition, the
連接相機頭11102及CCU11201之傳輸纜線11400為對應於電性信號通信之電性信號纜線、對應於光通信之光纜或其等之複合纜線。The
此處，於圖示之例中，使用傳輸纜線11400以有線進行通信，但亦可以無線進行相機頭11102與CCU11201之間的通信。Here, in the example shown in the figure, the
以上，對可應用本揭示之技術的內視鏡手術系統之一例進行說明。本揭示之技術於以上說明之構成中，可應用於相機頭11102之攝像部11402。具體而言，攝像部11402之像素陣列部上之複數個像素中之一部分像素可形成為作為補正像素發揮功能。藉由於攝像部11402應用本揭示之技術，可進行補正像素或通常像素之補正處理，防止像素特定之線性惡化引起之畫質降低。Above, an example of an endoscopic surgery system to which the technology of the present disclosure can be applied has been described. The technology of the present disclosure can be applied to the
另，此處，作為一例，已對內視鏡手術系統進行說明，但本揭示之技術亦可應用於其他之例如顯微鏡手術系統等。In addition, here, as an example, the endoscopic surgery system has been described, but the technique of the present disclosure can also be applied to other microscope surgery systems, for example.
又，本技術亦可包含如以下之技術性事項而構成。
(1)
一種攝像裝置，其係具備可累積根據入射之光量而產生之電荷的複數個像素者，且
上述複數個像素包含：
第1像素，其形成為具有第1飽和電荷量；及
第2像素，其形成為具有較上述第1飽和電荷量更小之第2飽和電荷量。
(2)
如上述(1)記載之攝像裝置，其中
上述複數個像素包含：像素區塊之排列，其包含複數個上述第1像素與至少1個上述第2像素。
(3)
如上述(1)或(2)記載之攝像裝置，其中
各上述像素區塊包含同色成分之相鄰之4個像素，且上述像素區塊之排列構成拜爾排列。
(4)
如上述(3)記載之攝像裝置，其中
上述像素區塊上之上述複數個第1像素各自以與特定顏色成分中之任一顏色成分對應之方式設置；
上述像素區塊上之上述至少1個第2像素以與上述任一顏色成分對應之方式設置。
(5)
如上述(1)或(4)記載之攝像裝置，其中
上述至少1個第2像素設置為與綠色成分對應。
(6)
如上述(1)或(4)記載之攝像裝置，其中
上述至少1個第2像素設置為與綠色成分以外之顏色成分對應。
(7)
如上述(2)記載之攝像裝置，其中
上述第2像素於上述像素區塊中彼此配置於對角位置。
(8)
如上述(2)或(7)記載之攝像裝置，其中
複數個上述第2像素配置為該第2像素間之間隔較上述像素區塊之大小更大。
(9)
如上述(1)記載之攝像裝置，其中
上述複數個像素各自以依據拜爾排列且與特定顏色成分中之任一顏色成分對應之方式設置。
(10)
如上述(9)記載之攝像裝置，其中
複數個上述第2像素設置為對應於與上述拜爾排列之一方向上之藍色成分相鄰之綠色成分、或與紅色成分相鄰之綠色成分之任一者。
(11)
如上述(9)或(10)記載之攝像裝置，其中
上述複數個第2像素配置為該第2像素間之間隔較上述任一顏色成分間之間隔更大。
(12)
如上述(1)至(11)中任一項記載之攝像裝置，其中
用以自上述第2像素中之累積電荷之區域傳送該電荷的傳送閘極電極之面積，大於用以自上述第1像素中之累積電荷之區域傳送該電荷的傳送閘極電極之面積。
(13)
如上述(1)至(12)中任一項記載之攝像裝置，其中
上述第2像素中之累積電荷之電荷累積區域，小於上述第1像素中之累積電荷之電荷累積區域。
(14)
如請求項(1)至(13)中任一項記載之攝像裝置，其進而具備：
信號處理電路，其處理基於自上述複數個像素傳送之電荷量之信號；且
上述信號處理電路基於自上述第1像素傳送之電荷量與自上述第2像素傳送之電荷量，而補正基於自上述複數個像素之任一者傳送之電荷量之信號。
(15)
如上述(14)記載之攝像裝置，其中
上述信號處理電路根據基於自上述複數個第1像素各者傳送之電荷量的第1感度比、與基於自上述第2像素傳送之電荷量的第2感度比，
補正基於自上述複數個像素之任一者傳送之電荷量的信號。
(16)
如上述(14)或(15)記載之攝像裝置，其中
上述信號處理電路算出上述第1感度比與上述第2感度比之差，基於算出之上述差與特定基準值，而補正基於自上述複數個像素之任一者傳送之電荷量的信號。
(17)
如上述(16)記載之攝像裝置，其中
上述信號處理電路當紅色成分相關之上述第1感度比與上述第2感度比之差小於上述特定基準值，且藍色成分相關之上述第1感度比與上述第2感度比之差小於上述特定基準值之情形時，補正基於自上述第2像素傳送之電荷量的信號。
(18)
如上述(16)或(17)記載之攝像裝置，其中
上述信號處理電路當紅色成分相關之上述第1感度比與上述第2感度比之差小於上述特定基準值，且藍色成分相關之上述第1感度比與上述第2感度比之差不小於上述特定基準值之情形時，根據基於自上述第2像素傳送之電荷量的信號，而至少補正基於自藍色成分之上述第1像素傳送之電荷量的信號，或者，當紅色成分相關之上述第1感度比與上述第2感度比之差不小於上述特定基準值，且藍色成分相關之上述第1感度比與上述第2感度比之差小於上述特定基準值之情形時，根據基於自上述第2像素傳送之電荷量的信號，而至少補正基於自紅色成分之上述第1像素傳送之電荷量的信號。
(19)
如上述(16)至(18)中任一項記載之攝像裝置，其中
上述信號處理電路當紅色成分相關之上述第1感度比與上述第2感度比之差不小於上述特定基準值，且藍色成分相關之上述第1感度比與上述第2感度比之差不小於上述特定基準值之情形時，根據基於自上述第2像素傳送之電荷量的信號，而補正基於同色成分中自上述第1像素傳送之電荷量的信號。
(20)
一種補正處理方法，其係攝像裝置之信號之補正處理方法，且包含如下步驟：
自累積根據入射之光量而產生之電荷的複數個像素讀取上述電荷；及
補正基於自上述複數個像素讀取之上述電荷之量的信號；且
上述複數個像素包含：第1像素，其形成為具有第1飽和電荷量；及第2像素，其形成為具有較上述第1飽和電荷量更小之第2飽和電荷量；且
上述補正係根據基於自上述第1像素傳送之電荷量的感度比、與基於自上述第2像素傳送之電荷量的感度比，而補正基於自上述複數個像素之任一者傳送之電荷量的信號。In addition, the present technology may also be constituted by including the following technical matters.
(1)
An imaging device having a plurality of pixels that can accumulate charges generated according to the amount of incident light, and
The above plural pixels include:
The first pixel is formed to have a first saturated charge amount; and
The second pixel is formed to have a second saturated charge amount smaller than the above-mentioned first saturated charge amount.
(2)
The camera device described in (1) above, wherein
The plurality of pixels includes: an arrangement of pixel blocks, which includes a plurality of the first pixels and at least one of the second pixels.
(3)
The camera device described in (1) or (2) above, wherein
Each of the above-mentioned pixel blocks includes 4 adjacent pixels of the same color component, and the arrangement of the above-mentioned pixel blocks constitutes a Bayer arrangement.
(4)
The camera device described in (3) above, wherein
The plurality of first pixels on the pixel block are each arranged in a manner corresponding to any one of the specific color components;
The at least one second pixel on the pixel block is arranged in a manner corresponding to any one of the color components.
(5)
The camera device described in (1) or (4) above, wherein
The above-mentioned at least one second pixel is provided to correspond to the green component.
(6)
The camera device described in (1) or (4) above, wherein
The above-mentioned at least one second pixel is provided to correspond to a color component other than the green component.
(7)
The camera device described in (2) above, wherein
The second pixels are arranged at diagonal positions in the pixel block.
(8)
The camera device described in (2) or (7) above, wherein
The plurality of the second pixels are arranged such that the interval between the second pixels is larger than the size of the pixel block.
(9)
The camera device described in (1) above, wherein
Each of the plurality of pixels is arranged in a Bayer arrangement and corresponding to any one of the specific color components.
(10)
The imaging device described in (9) above, wherein
The plurality of the second pixels are arranged to correspond to either the green component adjacent to the blue component in one direction of the Bayer arrangement or the green component adjacent to the red component.
(11)
The imaging device described in (9) or (10) above, wherein
The plurality of second pixels are arranged such that the interval between the second pixels is larger than the interval between any of the above-mentioned color components.
(12)
The imaging device described in any one of (1) to (11) above, wherein
The area of the transfer gate electrode used to transfer the charge from the area where the charge is accumulated in the second pixel is larger than the area of the transfer gate electrode used to transfer the charge from the area where the charge is accumulated in the first pixel.
(13)
The imaging device described in any one of (1) to (12) above, wherein
The charge accumulation area for accumulating charges in the second pixel is smaller than the charge accumulation area for accumulating charges in the first pixel.
(14)
For example, the camera device described in any one of claims (1) to (13), which further includes:
A signal processing circuit that processes signals based on the amount of charge transferred from the plurality of pixels; and
The signal processing circuit corrects a signal based on the amount of charge transferred from any one of the plurality of pixels based on the amount of charge transferred from the first pixel and the amount of charge transferred from the second pixel.
(15)
The imaging device described in (14) above, wherein
The signal processing circuit is based on a first sensitivity ratio based on the amount of charge transferred from each of the plurality of first pixels and a second sensitivity ratio based on the amount of charge transferred from the second pixel,
The correction is based on a signal based on the amount of charge transferred from any one of the above-mentioned plural pixels.
(16)
The camera device described in (14) or (15) above, wherein
The signal processing circuit calculates the difference between the first sensitivity ratio and the second sensitivity ratio, and corrects a signal based on the amount of charge transferred from any one of the plurality of pixels based on the calculated difference and a specific reference value.
(17)
The camera device described in (16) above, wherein
In the signal processing circuit, when the difference between the first sensitivity ratio and the second sensitivity ratio related to the red component is less than the specific reference value, and the difference between the first sensitivity ratio and the second sensitivity ratio related to the blue component is less than the specific In the case of the reference value, the signal based on the amount of charge transferred from the second pixel is corrected.
(18)
The camera device described in (16) or (17) above, wherein
In the signal processing circuit, when the difference between the first sensitivity ratio and the second sensitivity ratio related to the red component is less than the specific reference value, and the difference between the first sensitivity ratio and the second sensitivity ratio related to the blue component is not less than the above In the case of a specific reference value, based on the signal based on the amount of charge transferred from the second pixel, at least the signal based on the amount of charge transferred from the first pixel of the blue component is corrected, or when the red component is related to the above-mentioned
1:攝像裝置 10:控制部 12:光學系統 14:快門裝置 20:像素陣列部 30:垂直驅動部 32:讀取掃描電路 34:釋放掃描電路 40:水平驅動部 50:行處理部 60:信號處理部 70:圖像記憶體 80:監視器 100:攝像裝置 200:像素 200a:通常像素 200b:補正像素 201:微透鏡 210:濾光層 220:半導體基板 222:光電轉換元件 224:P型半導體區域 226:N型半導體區域 230:配線層 232:傳送閘極電極 234:金屬配線 236:浮動擴散 238:放大電晶體 239:選擇電晶體 11000:內視鏡手術系統 11100:內視鏡 11101:鏡筒 11102:相機頭 11110:其他手術器械 11111:氣腹管 11112:能量處置器具 11120:支持臂裝置 11131:施術者(醫師) 11132:患者 11133:病床 11200:推車 11201:CCU 11202:顯示裝置 11203:光源裝置 11204:輸入裝置 11205:處置器具控制裝置 11206:氣腹裝置 11207:記錄器 11208:印表機 11400:傳輸纜線 11401:透鏡單元 11402:攝像部 11403:驅動部 11404:通信部 11405:相機頭控制部 11411:通信部 11412:圖像處理部 11413:控制部 12000:車輛控制系統 12001:通信網路 12010:驅動系統控制單元 12020:車身系統控制單元 12030:車外資訊檢測單元 12031:攝像部 12040:車內資訊檢測單元 12041:駕駛者狀態檢測部 12050:綜合控制單元 12051:微電腦 12052:聲音圖像輸出部 12053:車載網路I/F 12061:音頻揚聲器 12062:顯示部 12063:儀表板 12100:車輛 12101,12102,12103,12104,12105:攝像部 12111,12112,12113,12114:攝像範圍 B:通常藍像素 B’:補正藍像素 G:綠像素 Gb:通常綠像素 Gb’:補正綠像素 Gr:通常綠像素 Gr’:補正綠像素 R:通常紅像素 R’:補正紅像素 ref_B:畫質參數基準值 ref_G:畫質參數基準值 ref_R:畫質參數基準值 S601～S611:步驟 S801～S807:步驟 |Δs_B|:絕對值 |Δs_R|:絕對值1: camera device 10: Control Department 12: Optical system 14: Shutter device 20: Pixel array section 30: Vertical drive 32: read scan circuit 34: Release the scanning circuit 40: Horizontal drive section 50: Line Processing Department 60: Signal Processing Department 70: Image memory 80: monitor 100: camera device 200: pixels 200a: Normal pixels 200b: Corrected pixels 201: Micro lens 210: filter layer 220: Semiconductor substrate 222: photoelectric conversion element 224: P-type semiconductor area 226: N-type semiconductor area 230: Wiring layer 232: Transmission gate electrode 234: Metal Wiring 236: Floating Diffusion 238: Amplified Transistor 239: Select Transistor 11000: Endoscopic surgery system 11100: Endoscope 11101: lens barrel 11102: camera head 11110: other surgical instruments 11111: Pneumoperitoneum 11112: energy disposal equipment 11120: Support arm device 11131: Surgeon (Physician) 11132: patient 11133: hospital bed 11200: cart 11201: CCU 11202: display device 11203: light source device 11204: input device 11205: Disposal equipment control device 11206: Pneumoperitoneum device 11207: Logger 11208: Printer 11400: Transmission cable 11401: lens unit 11402: Camera Department 11403: Drive 11404: Ministry of Communications 11405: Camera head control unit 11411: Ministry of Communications 11412: Image Processing Department 11413: Control Department 12000: Vehicle control system 12001: Communication network 12010: Drive system control unit 12020: Body system control unit 12030: Out-of-car information detection unit 12031: Camera Department 12040: In-car information detection unit 12041: Driver State Detection Department 12050: Integrated control unit 12051: Microcomputer 12052: Sound and image output section 12053: In-vehicle network I/F 12061: Audio speaker 12062: Display 12063: Dashboard 12100: Vehicle 12101, 12102, 12103, 12104, 12105: Camera department 12111, 12112, 12113, 12114: camera range B: usually blue pixels B’: Correction of blue pixels G: Green pixel Gb: usually green pixels Gb’: Correction of green pixels Gr: usually green pixels Gr’: Correction of green pixels R: usually red pixel R’: Correction of red pixels ref_B: Picture quality parameter reference value ref_G: Picture quality parameter reference value ref_R: reference value of image quality parameters S601～S611: steps S801～S807: steps |Δs_B|: Absolute value |Δs_R|: Absolute value
圖1係顯示本技術之一實施形態之攝像裝置之構成之一例之圖。 圖2(a)、(b)係說明本技術之一實施形態之像素陣列部上之像素排列之一例之圖。 圖3A(a)、(b)係說明本技術之一實施形態之像素陣列部上之像素排列之一例之圖。 圖3B(c)、(d)係說明本技術之一實施形態之像素陣列部上之像素排列之一例之圖。 圖4A係顯示本技術之一實施形態之像素陣列部上之像素之概略性構造之一例之部分縱剖視圖。 圖4B係顯示本技術之一實施形態之像素陣列部上之像素之概略性構造之一例之部分縱剖視圖。 圖4C係顯示本技術之一實施形態之像素陣列部上之像素之概略性構造之一例之部分縱剖視圖。 圖5係用以說明本技術之一實施形態之像素陣列部上之像素之電極之部分剖視俯視圖。 圖6係用以說明本技術之一實施形態之攝像裝置上之像素信號之補正處理之一例之流程圖。 圖7(a)～(d)係說明本技術之一實施形態之攝像裝置上之像素信號之補正處理之一例之圖。 圖8係用以說明本技術之一實施形態之攝像裝置上之像素信號之補正處理之一例之流程圖。 圖9(a)、(b)係說明本技術之一實施形態之攝像裝置上之像素信號之補正處理之一例之圖。 圖10係顯示作為應用本揭示之技術之電子機器之攝像裝置之構成之一例之方塊圖。 圖11係顯示可應用本揭示之技術之移動體控制系統之一例即車輛控制系統之概略性構成例之方塊圖。 圖12係顯示攝像部之設置位置之例之圖。 圖13係顯示可應用本揭示之技術(本技術)之內視鏡手術系統之概略性構成之一例之圖。 圖14係顯示圖13所示之相機頭及CCU之功能構成之一例之方塊圖。Fig. 1 is a diagram showing an example of the configuration of an imaging device according to an embodiment of the present technology. 2(a) and (b) are diagrams illustrating an example of the pixel arrangement on the pixel array portion of an embodiment of the present technology. 3A(a) and (b) are diagrams illustrating an example of the pixel arrangement on the pixel array portion of an embodiment of the present technology. 3B(c) and (d) are diagrams illustrating an example of the pixel arrangement on the pixel array portion of an embodiment of the present technology. 4A is a partial longitudinal cross-sectional view showing an example of a schematic structure of a pixel on a pixel array portion of an embodiment of the present technology. 4B is a partial longitudinal cross-sectional view showing an example of a schematic structure of a pixel on a pixel array portion of an embodiment of the present technology. 4C is a partial longitudinal cross-sectional view showing an example of a schematic structure of a pixel on a pixel array portion of an embodiment of the present technology. FIG. 5 is a partial cross-sectional plan view for explaining an electrode of a pixel on a pixel array portion of an embodiment of the present technology. FIG. 6 is a flowchart for explaining an example of pixel signal correction processing on the imaging device of an embodiment of the present technology. Figures 7(a) to (d) are diagrams illustrating an example of pixel signal correction processing on an imaging device according to an embodiment of the present technology. FIG. 8 is a flowchart for explaining an example of pixel signal correction processing on the imaging device of an embodiment of the present technology. Figures 9(a) and (b) are diagrams illustrating an example of pixel signal correction processing on an imaging device according to an embodiment of the present technology. FIG. 10 is a block diagram showing an example of the configuration of an imaging device of an electronic device that applies the technology of the present disclosure. FIG. 11 is a block diagram showing a schematic configuration example of a vehicle control system, which is an example of a mobile body control system to which the technology of the present disclosure can be applied. Fig. 12 is a diagram showing an example of the installation position of the imaging unit. FIG. 13 is a diagram showing an example of a schematic configuration of an endoscopic surgery system to which the technique of the present disclosure (this technique) can be applied. FIG. 14 is a block diagram showing an example of the functional configuration of the camera head and CCU shown in FIG. 13.
20:像素陣列部 20: Pixel array section
200a:通常像素 200a: Normal pixels
200b:補正像素 200b: Corrected pixels
201:微透鏡 201: Micro lens
210:濾光層 210: filter layer
220:半導體基板 220: Semiconductor substrate
222:光電轉換元件 222: photoelectric conversion element
224:P型半導體區域 224: P-type semiconductor area
226:N型半導體區域 226: N-type semiconductor area
230:配線層 230: Wiring layer
232:傳送閘極電極 232: Transmission gate electrode
234:金屬配線 234: Metal Wiring
Claims (20)
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| JP2009303043A (en) * | 2008-06-16 | 2009-12-24 | Panasonic Corp | Solid-state imaging device and signal processing method thereof |
| CN104641276B (en) * | 2012-09-12 | 2016-08-24 | 富士胶片株式会社 | Camera head and signal processing method |
| JP2015153975A (en) * | 2014-02-18 | 2015-08-24 | ソニー株式会社 | Solid state image sensor, manufacturing method of the same, and electronic apparatus |
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