TW202113484A - Photosensitive transfer material, method for producing resin pattern, method for producing wiring line, and method for producing touch panel - Google Patents

Photosensitive transfer material, method for producing resin pattern, method for producing wiring line, and method for producing touch panel Download PDF

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TW202113484A
TW202113484A TW109132995A TW109132995A TW202113484A TW 202113484 A TW202113484 A TW 202113484A TW 109132995 A TW109132995 A TW 109132995A TW 109132995 A TW109132995 A TW 109132995A TW 202113484 A TW202113484 A TW 202113484A
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resin layer
transfer member
photosensitive
thermoplastic resin
photosensitive transfer
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TW109132995A
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Chinese (zh)
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佐藤守正
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日商富士軟片股份有限公司
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/11—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having cover layers or intermediate layers, e.g. subbing layers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/115—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers having supports or layers with means for obtaining a screen effect or for obtaining better contact in vacuum printing
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/38—Treatment before imagewise removal, e.g. prebaking
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Human Computer Interaction (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)

Abstract

The present invention addresses the problem of providing: a photosensitive transfer member having excellent laminating properties and being capable of suppressing the occurrence of blocking when a temporary support body and a thermoplastic resin layer are peeled off; a method for producing a resin pattern; a method for producing circuit wiring; and a method for producing a touch panel. A photosensitive transfer member according to the present invention includes a temporary support body, a thermoplastic resin layer, a photosensitive resin layer, and a cover film, in the stated order, wherein: the thermoplastic resin layer has a Vicat softening point of 50 DEG C to 120 DEG C and a tensile modulus of 10 to 200 MPa; and the peeling strength between the temporary support body and the thermoplastic resin layer is greater than the peeling strength between the thermoplastic resin layer and the photosensitive resin layer.

Description

感光性轉印構件、樹脂圖案的製造方法、電路配線的製造方法及觸控面板的製造方法Photosensitive transfer member, resin pattern manufacturing method, circuit wiring manufacturing method, and touch panel manufacturing method

本發明係有關一種感光性轉印構件、樹脂圖案的製造方法、電路配線的製造方法及觸控面板的製造方法。The present invention relates to a photosensitive transfer member, a method of manufacturing a resin pattern, a method of manufacturing a circuit wiring, and a method of manufacturing a touch panel.

在靜電電容型輸入裝置等具備觸控面板之顯示裝置（有機電致發光（EL）顯示裝置及液晶顯示裝置等）中，對應於視覺辨認部的感測器之電極圖案、邊緣配線部分及取出配線部分的配線等的導電層圖案被設置於觸控面板內部。 通常在形成經圖案化之層時，用於獲得所需之圖案形狀之製程數少，因此對使用感光性轉印構件而在任意基板上設置之感光性樹脂組成物的層，隔著具有所希望的圖案之遮罩進行曝光之後進行顯影之方法被廣泛使用。 例如，專利文獻1中記載有在支撐體上依序具有包含熱塑性樹脂之緩衝層和感光層之圖案形成材料（【請求項1]【請求項5]），作為使用該圖案形成材料之圖案形成方法，記載有在剝離支撐體之後對感光層進行曝光之方法（【請求項15]）。In display devices (organic electroluminescence (EL) display devices, liquid crystal display devices, etc.) equipped with touch panels such as capacitive input devices, the electrode patterns, edge wiring portions, and removal of the sensor corresponding to the visual recognition unit Conductive layer patterns such as wiring of the wiring part are provided inside the touch panel. Generally, when the patterned layer is formed, the number of processes for obtaining the desired pattern shape is small. Therefore, the layer of the photosensitive resin composition provided on any substrate using the photosensitive transfer member has the The method of developing the mask of the desired pattern after exposure is widely used. For example, Patent Document 1 describes a pattern forming material having a cushion layer containing a thermoplastic resin and a photosensitive layer in this order on a support ([claim 1] [claim 5]) as a pattern forming using the pattern forming material The method describes a method of exposing the photosensitive layer after peeling off the support ([Request 15]).

[專利文獻1]日本特開2007-178459號公報[Patent Document 1] JP 2007-178459 A

本發明人對使用專利文獻1中所記載之圖案形成材料（感光性轉印構件）之圖案形成方法進行研究之結果，明確了存在如下問題：雖然層壓性良好，但從生產率（例如，顯影性等）之觀點考慮，在實施顯影處理之前，採用了與支撐體（偽支撐體）一同剝離緩衝層（熱塑性樹脂層）之方法之結果，當利用卷對卷方式捲繞偽支撐體和由熱塑性樹脂層構成之積層體來進行回收時，發生黏連而變得無法輸送。The inventors of the present invention conducted research on a pattern forming method using the pattern forming material (photosensitive transfer member) described in Patent Document 1, and as a result, it became clear that there was a problem in that although the lamination property was good, the productivity (e.g., development) From the viewpoint of performance, etc.), before the development process, the buffer layer (thermoplastic resin layer) is peeled off together with the support (pseudo support). When using the roll-to-roll method to wind the pseudo-support and the When a laminate composed of a thermoplastic resin layer is recycled, it is blocked and cannot be transported.

因此，本發明的課題在於提供一種層壓性優異且能夠抑制在剝離偽支撐體和熱塑性樹脂層時發生黏連之感光性轉印構件、樹脂圖案的製造方法、電路配線的製造方法及觸控面板的製造方法。Therefore, the subject of the present invention is to provide a photosensitive transfer member, a method for manufacturing a resin pattern, a method for manufacturing a circuit wiring, and a touch control device that are excellent in laminating properties and can prevent blocking when peeling off the pseudo support and the thermoplastic resin layer. The manufacturing method of the panel.

本發明人為了實現上述課題而進行了深入研究之結果，發現在依序具有偽支撐體、熱塑性樹脂層、感光性樹脂層及覆蓋膜之感光性轉印構件中，將熱塑性樹脂層的菲卡軟化點及拉伸彈性模數調整成特定的範圍，並且將偽支撐體與熱塑性樹脂層之間的剝離強度設成大於熱塑性樹脂層與感光性樹脂層之間的剝離強度，從而層壓性優異並且能夠抑制在剝離偽支撐體和熱塑性樹脂層時發生黏連，並且完成了本發明。 亦即，本發明人發現，藉由以下構成能夠實現上述課題。The inventors of the present invention have conducted intensive studies in order to achieve the above-mentioned problems, and found that in a photosensitive transfer member having a pseudo support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order, the phyca of the thermoplastic resin layer The softening point and the tensile modulus of elasticity are adjusted to a specific range, and the peel strength between the pseudo support and the thermoplastic resin layer is set to be greater than the peel strength between the thermoplastic resin layer and the photosensitive resin layer, resulting in excellent lamination In addition, it is possible to suppress the occurrence of blocking when peeling the pseudo support and the thermoplastic resin layer, and the present invention has been completed. That is, the inventors of the present invention found that the above-mentioned problem can be achieved by the following configuration.

[1]一種感光性轉印構件，其係依序具有偽支撐體、熱塑性樹脂層、感光性樹脂層及覆蓋膜，前述感光性轉印構件中， 熱塑性樹脂層的菲卡軟化點為50～120℃，並且拉伸彈性模數為10～200Mpa， 偽支撐體與熱塑性樹脂層之間的剝離強度大於熱塑性樹脂層與感光性樹脂層之間的剝離強度。 [2]如[1]所述之感光性轉印構件，其中，熱塑性樹脂層的厚度大於2μm且小於20μm。 [3]如[1]或[2]所述之感光性轉印構件，其中，偽支撐體的厚度為6～50μm。 [4]如[1]至[3]之任一項所述之感光性轉印構件，其中，偽支撐體的霧度為0.5%以下。 [5]如[1]至[4]之任一項所述之感光性轉印構件，其中，偽支撐體與熱塑性樹脂層的積層體的霧度為0.9%以下。 [6]如[1]至[5]之任一項所述之感光性轉印構件，其中，熱塑性樹脂層的拉伸彈性模數為50～200MPa。 [7]如[1]至[6]之任一項所述之感光性轉印構件，其中，偽支撐體、熱塑性樹脂層、感光性樹脂層及覆蓋膜的各層之間的剝離強度中，偽支撐體與熱塑性樹脂層之間的剝離強度最強，感光性樹脂層與覆蓋膜之間的剝離強度最弱。[1] A photosensitive transfer member having a pseudo support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order. In the aforementioned photosensitive transfer member, The Ficat softening point of the thermoplastic resin layer is 50-120°C, and the tensile modulus of elasticity is 10-200Mpa, The peel strength between the pseudo support and the thermoplastic resin layer is greater than the peel strength between the thermoplastic resin layer and the photosensitive resin layer. [2] The photosensitive transfer member according to [1], wherein the thickness of the thermoplastic resin layer is greater than 2 μm and less than 20 μm. [3] The photosensitive transfer member according to [1] or [2], wherein the thickness of the dummy support is 6 to 50 μm. [4] The photosensitive transfer member according to any one of [1] to [3], wherein the haze of the pseudo support is 0.5% or less. [5] The photosensitive transfer member according to any one of [1] to [4], wherein the haze of the laminate of the pseudo support and the thermoplastic resin layer is 0.9% or less. [6] The photosensitive transfer member according to any one of [1] to [5], wherein the tensile modulus of elasticity of the thermoplastic resin layer is 50 to 200 MPa. [7] The photosensitive transfer member according to any one of [1] to [6], wherein among the peel strengths between the respective layers of the pseudo support, the thermoplastic resin layer, the photosensitive resin layer, and the cover film, The peel strength between the dummy support and the thermoplastic resin layer is the strongest, and the peel strength between the photosensitive resin layer and the cover film is the weakest.

[8]一種樹脂圖案的製造方法，其係使用[1]至[7]之任一項所述之感光性轉印構件並以卷對卷方式製作樹脂圖案，前述樹脂圖案的製造方法依序具備： 剝離製程，其係從感光性轉印構件剝離覆蓋膜； 貼合製程，其係使剝離了覆蓋膜之感光性轉印構件中的感光性樹脂層與具有導電層之基板接觸以進行貼合； 曝光製程，其係對感光性樹脂層進行圖案曝光；及 顯影製程，其係對經曝光之感光性樹脂層進行顯影而形成樹脂圖案， 貼合製程與曝光製程之間，或者曝光製程與顯影製程之間，具備從感光性轉印構件同時剝離偽支撐體和熱塑性樹脂層之製程。[8] A method for producing a resin pattern, which uses the photosensitive transfer member described in any one of [1] to [7] to produce a resin pattern in a roll-to-roll manner, and the above-mentioned resin pattern production methods are sequentially have: The peeling process, which is to peel the cover film from the photosensitive transfer member; The laminating process involves contacting the photosensitive resin layer in the photosensitive transfer member with the cover film peeled off and the substrate with the conductive layer for bonding; Exposure process, which is pattern exposure of the photosensitive resin layer; and The development process is to develop the exposed photosensitive resin layer to form a resin pattern. Between the bonding process and the exposure process, or between the exposure process and the development process, there is a process for simultaneously peeling the dummy support and the thermoplastic resin layer from the photosensitive transfer member.

[9]一種電路配線的製造方法，其係使用[1]至[7]之任一項所述之感光性轉印構件並以卷對卷方式製作電路配線，前述電路配線的製造方法依序具備： 剝離製程，其係從感光性轉印構件剝離覆蓋膜； 貼合製程，其係使剝離了覆蓋膜之感光性轉印構件中的感光性樹脂層與具有導電層之基板接觸以進行貼合； 曝光製程，其係對感光性樹脂層進行圖案曝光； 顯影製程，其係對經曝光之感光性樹脂層進行顯影而形成樹脂圖案；及 對位於未配置有樹脂圖案之區域的導電層進行蝕刻處理之製程， 貼合製程與曝光製程之間，或者曝光製程與顯影製程之間，具備從感光性轉印構件同時剝離偽支撐體和熱塑性樹脂層之製程。[9] A method of manufacturing circuit wiring, which uses the photosensitive transfer member described in any one of [1] to [7] to manufacture circuit wiring in a roll-to-roll manner, and the above-mentioned circuit wiring manufacturing method is in order have: The peeling process, which is to peel the cover film from the photosensitive transfer member; The laminating process involves contacting the photosensitive resin layer in the photosensitive transfer member with the cover film peeled off and the substrate with the conductive layer for bonding; Exposure process, which is pattern exposure of the photosensitive resin layer; The development process, which develops the exposed photosensitive resin layer to form a resin pattern; and The process of etching the conductive layer in the area where the resin pattern is not configured, Between the bonding process and the exposure process, or between the exposure process and the development process, there is a process for simultaneously peeling the dummy support and the thermoplastic resin layer from the photosensitive transfer member.

[10]一種觸控面板的製造方法，其係使用[1]至[7]之任一項所述之感光性轉印構件並以卷對卷方式製作觸控面板，前述觸控面板的製造方法依序具備： 剝離製程，其係從感光性轉印構件剝離覆蓋膜； 貼合製程，其係使剝離了覆蓋膜之感光性轉印構件中的感光性樹脂層與具有導電層之基板接觸以進行貼合； 曝光製程，其係對感光性樹脂層進行圖案曝光； 顯影製程，其係對經曝光之感光性樹脂層進行顯影而形成樹脂圖案；及 對位於未配置有樹脂圖案之區域的導電層進行蝕刻處理之製程， 貼合製程與曝光製程之間，或者曝光製程與顯影製程之間，具備從感光性轉印構件同時剝離偽支撐體和熱塑性樹脂層之製程。 [發明效果][10] A method of manufacturing a touch panel, which uses the photosensitive transfer member described in any one of [1] to [7] to manufacture a touch panel in a roll-to-roll manner, and the manufacture of the aforementioned touch panel The method has in order: The peeling process, which is to peel the cover film from the photosensitive transfer member; The laminating process involves contacting the photosensitive resin layer in the photosensitive transfer member with the cover film peeled off and the substrate with the conductive layer for bonding; Exposure process, which is pattern exposure of the photosensitive resin layer; The development process, which develops the exposed photosensitive resin layer to form a resin pattern; and The process of etching the conductive layer in the area where the resin pattern is not configured, Between the bonding process and the exposure process, or between the exposure process and the development process, there is a process for simultaneously peeling the dummy support and the thermoplastic resin layer from the photosensitive transfer member. [Effects of the invention]

依本發明，能夠提供一種層壓性優異且能夠抑制在剝離偽支撐體和熱塑性樹脂層時發生黏連之感光性轉印構件、樹脂圖案的製造方法、電路配線的製造方法及觸控面板的製造方法。According to the present invention, it is possible to provide a photosensitive transfer member, a method for manufacturing a resin pattern, a method for manufacturing a circuit wiring, and a touch panel with excellent lamination properties and capable of suppressing blocking when peeling off the pseudo support and the thermoplastic resin layer Production method.

以下，對本發明進行詳細說明。 關於以下所記載之構成要件的說明，有時基於本發明的代表性實施態樣來進行，但是本發明並不限定於該種實施態樣。 另外，本說明書中，使用“～”表示之數值範圍係指包含記載於“～”的前後之數值作為下限值及上限值之範圍。 又，本說明書中，各成分可以單獨使用1種，亦可以併用2種以上的相當於各成分之物質。其中，各成分在併用2種以上的物質之情況下，只要沒有特別說明，則其成分的含量係指，所併用之物質的總含量。 又，本說明書中，“（甲基）丙烯酸”表示丙烯酸及甲基丙烯酸中的任一者或兩者，“（甲基）丙烯酸酯”表示丙烯酸酯及甲基丙烯酸酯中的任一者或兩者。 又，關於本說明書中的“曝光”，只要沒有特別指定，則不僅包括使用光之曝光，亦包括使用電子束、離子束等粒子束之描繪。作為用於曝光之光，通常可以舉出水銀燈的明線光譜、準分子雷射為代表之遠紫外線、極紫外線（EUV光）、X射線、電子束等光化射線（活性能量射線）。Hereinafter, the present invention will be described in detail. The description of the constitutional requirements described below may be performed based on a representative embodiment of the present invention, but the present invention is not limited to this embodiment. In addition, in this specification, the numerical range represented by "-" means the range which includes the numerical value described before and after "-" as the lower limit and the upper limit. In addition, in this specification, each component may be used individually by 1 type, and may use together 2 or more types of substances corresponding to each component. However, when two or more substances are used in combination for each component, unless otherwise specified, the content of the component refers to the total content of the substances used in combination. In addition, in this specification, "(meth)acrylic acid" means either or both of acrylic acid and methacrylic acid, and "(meth)acrylate" means either acrylate or methacrylate or Both. In addition, as for "exposure" in this specification, unless otherwise specified, it includes not only exposure using light, but also drawing using particle beams such as electron beams and ion beams. The light used for exposure usually includes actinic rays (active energy rays) such as the bright line spectrum of a mercury lamp, and extreme ultraviolet rays represented by excimer lasers, extreme ultraviolet rays (EUV light), X-rays, and electron beams.

[感光性轉印構件] 本發明的感光性轉印構件係依序具有偽支撐體、熱塑性樹脂層、感光性樹脂層及覆蓋膜之感光性轉印構件。 又，在本發明的感光性轉印構件中，熱塑性樹脂層的菲卡軟化點為50～120℃，並且拉伸彈性模數為10～200MPa。 此外，在本發明的感光性轉印構件中，偽支撐體與熱塑性樹脂層之間的剝離強度大於熱塑性樹脂層與感光性樹脂層之間的剝離強度。[Photosensitive transfer member] The photosensitive transfer member of the present invention is a photosensitive transfer member having a pseudo support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order. Furthermore, in the photosensitive transfer member of the present invention, the Ficat softening point of the thermoplastic resin layer is 50 to 120°C, and the tensile modulus of elasticity is 10 to 200 MPa. Furthermore, in the photosensitive transfer member of the present invention, the peel strength between the dummy support and the thermoplastic resin layer is greater than the peel strength between the thermoplastic resin layer and the photosensitive resin layer.

其中，“偽支撐體與熱塑性樹脂層之間的剝離強度大於熱塑性樹脂層與感光性樹脂層之間的剝離強度”表示在使用了本發明的感光性轉印材料之樹脂圖案的製造方法等中，在顯影製程之前剝離偽支撐體時，還與偽支撐體一起剝離熱塑性樹脂層之規定。 又，剝離強度的大小關係能夠藉由在從感光性轉印材料切出之試驗片（5cm寬×10cm長）的兩面上黏貼黏著膠帶，並將非偽支撐體側（覆蓋膜側）固定於水平的底座上，沿水平方向剝離偽支撐體側之後，用光學顯微鏡等觀察剝離界面來確認。Wherein, "the peeling strength between the pseudo support and the thermoplastic resin layer is greater than the peeling strength between the thermoplastic resin layer and the photosensitive resin layer" means that in the method of manufacturing a resin pattern using the photosensitive transfer material of the present invention, etc. , When peeling off the dummy support before the development process, the thermoplastic resin layer is also peeled off together with the dummy support. In addition, the relationship between the size of the peel strength can be achieved by sticking an adhesive tape on both sides of a test piece (5cm wide×10cm long) cut from the photosensitive transfer material, and fixing the non-pseudo support side (covering film side) to On a horizontal base, after peeling off the side of the pseudo support in the horizontal direction, observe the peeled interface with an optical microscope or the like to confirm.

具有該種結構之本發明的感光性轉印構件的層壓性優異且能夠抑制在剝離偽支撐體和熱塑性樹脂層時發生黏連。 雖然其詳細原因尚不明確，但本發明人推測為如下。 亦即，認為藉由熱塑性樹脂層的菲卡軟化點為50～120℃，從而在將感光性轉印構件層壓於基板時，由於與熱塑性樹脂層相鄰之感光性樹脂層能夠追隨基板的凹凸，因此層壓性變得良好。 又，認為藉由偽支撐體與熱塑性樹脂層之間的剝離強度大於熱塑性樹脂層與感光性樹脂層之間的剝離強度，並且熱塑性樹脂層的拉伸彈性模數為10～200MPa，從而在同時剝離偽支撐體和熱塑性樹脂層時，熱塑性樹脂層的獨立性得到提高，因此能夠抑制發生與偽支撐體的黏連。The photosensitive transfer member of the present invention having such a structure has excellent laminating properties and can suppress the occurrence of blocking when the pseudo support and the thermoplastic resin layer are peeled off. Although the detailed reason is not clear, the inventors speculate as follows. That is, it is considered that the Ficatin softening point of the thermoplastic resin layer is 50 to 120°C, so that when the photosensitive transfer member is laminated on the substrate, the photosensitive resin layer adjacent to the thermoplastic resin layer can follow the substrate Concave and convex, so the lamination becomes good. In addition, it is considered that the peel strength between the pseudo support and the thermoplastic resin layer is greater than the peel strength between the thermoplastic resin layer and the photosensitive resin layer, and the tensile elastic modulus of the thermoplastic resin layer is 10 to 200 MPa, thereby simultaneously When the pseudo support and the thermoplastic resin layer are peeled off, the independence of the thermoplastic resin layer is improved, and therefore, the occurrence of adhesion with the pseudo support can be suppressed.

〔偽支撐體〕 本發明的感光性轉印構件所具有之偽支撐體係支撐感光性樹脂層或包含感光性樹脂層之積層體且能夠剝離之支撐體。〔Pseudo-support〕 The pseudo support system of the photosensitive transfer member of the present invention supports a photosensitive resin layer or a laminate including the photosensitive resin layer and is a peelable support.

從在對感光性樹脂層進行圖案曝光時，能夠進行隔著偽支撐體之感光性樹脂層的曝光之觀點考慮，偽支撐體具有透光性為較佳。 其中，“具有透光性”表示使用於圖案曝光之波長的光的透射率為50%以上。 又，關於偽支撐體，從提高感光性樹脂層的曝光靈敏度之觀點考慮，在使用於圖案曝光之波長（較佳為波長365nm）的光的透射率為60%以上為較佳，70%以上為更佳。 又，作為透射率的測量方法，可以舉出使用Otsuka Electronics Co.,Ltd.製造之MCPD Series測量之方法。From the viewpoint of enabling exposure of the photosensitive resin layer via the dummy support when the photosensitive resin layer is pattern-exposed, it is preferable that the dummy support has translucency. Among them, "transmitting" means that the light transmittance of the wavelength used for pattern exposure is 50% or more. Also, regarding the pseudo support, from the viewpoint of improving the exposure sensitivity of the photosensitive resin layer, the light transmittance of the wavelength used for pattern exposure (preferably with a wavelength of 365 nm) is preferably 60% or more, and 70% or more For better. In addition, as a method of measuring transmittance, a method of measuring using MCPD Series manufactured by Otsuka Electronics Co., Ltd. can be cited.

作為偽支撐體，例如，可以舉出樹脂薄膜及紙等，從強度及撓性等觀點考慮，樹脂薄膜為較佳。 作為樹脂薄膜，具體而言，例如，可以舉出聚對酞酸乙二酯（PET）薄膜、三乙酸纖維素薄膜、聚苯乙烯薄膜、聚碳酸酯薄膜、聚乙烯薄膜、聚丙烯薄膜、聚醯亞胺薄膜等。其中，2軸延伸聚對酞酸乙二酯薄膜為特佳。 又，樹脂薄膜可以係單層，亦可以係2層以上的積層體。As the pseudo support, for example, a resin film, paper, etc. can be cited, and from the viewpoint of strength, flexibility, etc., a resin film is preferred. As the resin film, specifically, for example, polyethylene terephthalate (PET) film, cellulose triacetate film, polystyrene film, polycarbonate film, polyethylene film, polypropylene film, poly Imide film, etc. Among them, a biaxially stretched polyethylene terephthalate film is particularly preferred. In addition, the resin film may be a single layer or a laminate of two or more layers.

偽支撐體的厚度沒有特別限制，作為支撐體的強度、貼合電路配線形成用基板時所需要之撓性及在起始曝光製程中所要求之透光性之觀點考慮，只要依據材質進行選擇即可。 偽支撐體的厚度為5～300μm為較佳，從容易處理性優異之原因考慮，6～50μm為更佳。 其中，關於偽支撐體的厚度，在沿偽支撐體的厚度方向的剖面觀察圖像中，求出在隨機選擇之10處測量之偽支撐體的厚度的算術平均值，並將所獲得之值作為偽支撐體的厚度。沿偽支撐體的厚度方向的剖面觀察圖像能夠使用掃描式電子顯微鏡（SEM）獲得。另外，關於後述之熱塑性樹脂層及感光性樹脂層的厚度，亦能夠利用與上述相同的方法來測量。The thickness of the dummy support is not particularly limited. The strength of the support, the flexibility required when bonding circuit wiring formation substrates, and the light transmittance required in the initial exposure process are considered, as long as the selection is based on the material. That's it. The thickness of the pseudo support is preferably 5 to 300 μm, and in view of its excellent ease of handling, it is more preferably 6 to 50 μm. Among them, regarding the thickness of the pseudo support, in the cross-sectional observation image along the thickness direction of the pseudo support, find the arithmetic average of the thickness of the pseudo support measured at 10 randomly selected locations, and use the obtained value As the thickness of the pseudo support. The cross-sectional observation image along the thickness direction of the pseudo support can be obtained using a scanning electron microscope (SEM). In addition, the thickness of the thermoplastic resin layer and the photosensitive resin layer described later can also be measured by the same method as described above.

從感光性轉印構件的解析性良好之原因考慮，偽支撐體的霧度為0.5%以下為較佳，0.4以下為更佳。 又，從製造偽支撐體時的輸送性之觀點考慮，偽支撐體的霧度為0.05%以上為較佳，0.1%以上為更佳。 其中，霧度係依據JIS K 7136：2000之總光線霧度（%），能夠使用霧度計（裝置名稱：HZ-2，Suga Test Instruments Co., Ltd.製造）作為總光霧度來測量。Considering that the resolution of the photosensitive transfer member is good, the haze of the dummy support is preferably 0.5% or less, and more preferably 0.4 or less. In addition, from the viewpoint of transportability at the time of manufacturing the pseudo support, the haze of the pseudo support is preferably 0.05% or more, and more preferably 0.1% or more. Among them, the haze is based on the total light haze (%) of JIS K 7136: 2000, which can be measured using a haze meter (device name: HZ-2, manufactured by Suga Test Instruments Co., Ltd.) as the total light haze .

本發明中，從提高與後述之熱塑性樹脂層的密接力之觀點考慮，可以在偽支撐體的表面上實施例如，輝光放電處理、電暈處理、紫外線照射處理等表面處理；聚偏二氯乙烯樹脂、苯乙烯丁二烯橡膠、明膠等底塗處理。 另外，本發明中，使用實施了表面處理或底塗處理之偽支撐體之情況下，剝離強度、厚度、霧度等規定以處理後的偽支撐體作為對象。In the present invention, from the viewpoint of improving the adhesion with the thermoplastic resin layer described later, surface treatments such as glow discharge treatment, corona treatment, and ultraviolet irradiation treatment may be performed on the surface of the pseudo support; polyvinylidene chloride Resin, styrene butadiene rubber, gelatin and other primer treatments. In addition, in the present invention, in the case of using a pseudo support subjected to a surface treatment or a primer treatment, the peel strength, thickness, haze, and the like are specified for the treated pseudo support.

又，用作偽支撐體之薄膜中不存在褶皺等變形、劃痕等為較佳。 從隔著偽支撐體進行圖案曝光時的圖案形成性及偽支撐體的透明性之觀點考慮，偽支撐體中所包含之微粒、異物、缺陷的數少為較佳。直徑為1μm以上的微粒、異物、缺陷的數為50個/10mm2 以下為較佳，10個/10mm2 以下為更佳，3個/10mm2 以下為進一步較佳，0個/10mm2 為特佳。In addition, it is preferable that the film used as the pseudo support does not have deformations such as wrinkles, scratches, and the like. From the viewpoints of the patterning property at the time of pattern exposure through the dummy support and the transparency of the dummy support, it is preferable that the number of particles, foreign substances, and defects contained in the dummy support be small. The number of particles, foreign bodies, and defects with a diameter of 1μm or more is preferably 50 pieces/10mm 2 or less, 10 pieces/10mm 2 or less is more preferable, 3 pieces/10mm 2 or less is more preferably, 0 pieces/10mm 2 is Especially good.

作為偽支撐體的較佳態樣，例如，記載於日本特開2014-085643號公報的0017段～0018段、日本特開2016-027363號公報的0019～0026段、國際公開第2012/081680號公報的0041～0057段、國際公開第2018/179370號公報的0029～0040段中，該等公報的內容被編入到本說明書中。As a preferable aspect of the pseudo support, for example, it is described in Japanese Patent Application Publication No. 2014-085643, paragraphs 0017 to 0018, Japanese Patent Application Publication No. 2016-027363, paragraphs 0019 to 0026, and International Publication No. 2012/081680 In paragraphs 0041 to 0057 of the bulletin and paragraphs 0029 to 0040 of International Publication No. 2018/179370, the contents of these bulletins are incorporated into this specification.

〔熱塑性樹脂層〕 本發明的感光性轉印構件所具有之熱塑性樹脂層係菲卡軟化點為50～120℃，並且拉伸彈性模數為10～200MPa之熱塑性樹脂層。〔Thermoplastic resin layer〕 The thermoplastic resin layer possessed by the photosensitive transfer member of the present invention is a thermoplastic resin layer having a Ficat softening point of 50 to 120°C and a tensile elastic modulus of 10 to 200 MPa.

其中，菲卡軟化點係指，按以下順序測量而得之值。 （1）試驗片 在厚度為10～100μm的PET薄膜上，使用形成有厚度為3～4mm的熱塑性樹脂層之試驗片。另外，關於在試驗片上的熱塑性樹脂層的形成，可以係塗佈法、熔融擠出法及藉由對薄膜進行複數次熱層壓而成為厚膜之方式中的任一種。 （2）測量 利用依據Viker Vicat法（基於美國材料試驗法ASTMD1525之聚合物軟化點測量法）的方法進行測量。Among them, the Fica softening point refers to the value measured in the following order. (1) Test piece On a PET film having a thickness of 10 to 100 μm, a test piece in which a thermoplastic resin layer having a thickness of 3 to 4 mm is formed is used. In addition, the formation of the thermoplastic resin layer on the test piece may be any of a coating method, a melt extrusion method, and a method of forming a thick film by thermally laminating the film several times. (2) Measurement Use the method based on the Viker Vicat method (based on the American Material Testing Method ASTMD1525 polymer softening point measurement method) for measurement.

又，拉伸彈性模數係指，按以下順序測量而得之值。 （1）試驗片 在厚度為10～100μm的PET薄膜上，使用形成有厚度為3～4mm的熱塑性樹脂層之試驗片。另外，關於在試驗片上的熱塑性樹脂層的形成，可以係塗佈法、熔融擠出法及藉由對薄膜進行複數次熱層壓而成為厚膜之方式中的任一種。 （2）測量 利用依據基於美國材料試驗法ASTMD882之拉伸試驗的方法進行測量。In addition, the tensile modulus of elasticity refers to the value measured in the following procedure. (1) Test piece On a PET film having a thickness of 10 to 100 μm, a test piece in which a thermoplastic resin layer having a thickness of 3 to 4 mm is formed is used. In addition, the formation of the thermoplastic resin layer on the test piece may be any of a coating method, a melt extrusion method, and a method of forming a thick film by thermally laminating the film several times. (2) Measurement The measurement is carried out by a method based on the tensile test based on the American Material Testing Method ASTM D882.

本發明中，從層壓性變得更加良好之原因考慮，熱塑性樹脂層的菲卡軟化點為70～100℃為較佳。In the present invention, it is preferable that the Ficatin softening point of the thermoplastic resin layer is 70 to 100°C in view of the reason that the lamination property becomes better.

又，本發明中，從能夠進一步抑制在剝離偽支撐體和熱塑性樹脂層時發生黏連之原因考慮，熱塑性樹脂層的拉伸彈性模數為50～200MPa為較佳。Furthermore, in the present invention, in view of being able to further suppress the occurrence of blocking when peeling the pseudo support and the thermoplastic resin layer, the tensile modulus of the thermoplastic resin layer is preferably 50 to 200 MPa.

＜熱塑性樹脂＞ 熱塑性樹脂層具有熱塑性樹脂為較佳。 作為該種熱塑性樹脂，具體而言，例如，可以舉出： 聚乙烯及聚丙烯等聚烯烴； 乙烯與乙酸乙烯酯的共聚物及其皂化物等烯共聚物； 乙烯與丙烯酸酯的共聚物及其皂化物、聚氯乙烯、以及氯乙烯基與乙酸乙烯酯的共聚物及其皂化物等氯乙烯基共聚物； 聚偏二氯乙烯、偏二氯乙烯共聚物、聚苯乙烯、以及苯乙烯與（甲基）丙烯酸酯的共聚物及其皂化物等苯乙烯共聚物； 聚乙烯基甲苯以及乙烯基甲苯與（甲基）丙烯酸酯的共聚物及其皂化物等乙烯基甲苯共聚物； 聚（甲基）丙烯酸酯及（甲基）丙烯酸丁酯與乙酸乙烯酯的共聚物等（甲基）丙烯酸酯共聚物； 乙酸乙烯酯共聚物尼龍、共聚尼龍、N-烷氧基甲基化尼龍、N-二甲胺基化尼龍等聚醯胺樹脂；等。 在該等中，聚烯烴、烯共聚物或氯乙烯基共聚物為較佳。＜Thermoplastic resin＞ The thermoplastic resin layer preferably has a thermoplastic resin. As this kind of thermoplastic resin, specifically, for example, one can cite: Polyolefins such as polyethylene and polypropylene; Copolymers of ethylene and vinyl acetate and their saponified olefin copolymers; Vinyl chloride copolymers such as copolymers of ethylene and acrylic acid esters and their saponified products, polyvinyl chloride, and copolymers of vinyl chloride and vinyl acetate and their saponified products; Polyvinylidene chloride, vinylidene chloride copolymers, polystyrene, and styrene and (meth)acrylate copolymers and saponified styrene copolymers; Vinyl toluene, copolymers of vinyl toluene and (meth)acrylate and their saponified vinyl toluene copolymers; (Meth)acrylate copolymers such as poly(meth)acrylate and copolymer of butyl (meth)acrylate and vinyl acetate; Polyamide resins such as vinyl acetate copolymer nylon, copolymer nylon, N-alkoxymethylated nylon, and N-dimethylaminated nylon; etc. Among them, polyolefins, olefin copolymers or vinyl chloride copolymers are preferred.

本發明中，可以使上述熱塑性樹脂的溶解特性與後述之感光性樹脂層的溶解特性充分地一致，亦可以具有在後述之感光性樹脂層完全不溶解之溶劑中溶解之溶解特性。In the present invention, the dissolution characteristics of the thermoplastic resin can be sufficiently matched with the dissolution characteristics of the photosensitive resin layer described later, or it may have dissolution characteristics that dissolve in a solvent in which the photosensitive resin layer described later is completely insoluble.

熱塑性樹脂層可以單獨含有1種熱塑性樹脂，亦可以含有2種以上。 從層壓性變得更加良好之觀點考慮，熱塑性樹脂的含量相對於熱塑性樹脂層的總質量為10質量%以上且99質量%以下為較佳，20質量%以上且90質量%以下為更佳，30質量%以上且80質量%以下為進一步較佳。The thermoplastic resin layer may contain one type of thermoplastic resin alone, or two or more types. From the viewpoint of better laminating properties, the content of the thermoplastic resin relative to the total mass of the thermoplastic resin layer is preferably 10% by mass or more and 99% by mass or less, and more preferably 20% by mass or more and 90% by mass or less , 30% by mass or more and 80% by mass or less are more preferable.

＜塑化劑＞ 從調整菲卡軟化點之觀點考慮，熱塑性樹脂層可以含有與上述熱塑性樹脂具有相容性之塑化劑。例如，即使使用了菲卡軟化點為120℃以上的熱塑性樹脂之情況下，亦能夠藉由添加與熱塑性樹脂具有相容性之塑化劑而將熱塑性樹脂層的菲卡軟化點調整成50℃～120℃。 塑化劑只要係與熱塑性樹脂相容而顯現可塑性之化合物，則並無特別限定，但從賦予可塑性之觀點考慮，塑化劑在分子中具有伸烷氧基為較佳，為聚伸烷基二醇化合物為更佳。塑化劑中所包含之伸烷氧基為聚乙烯氧基結構或聚丙烯氧基結構為更佳。＜Plasticizer＞ From the viewpoint of adjusting the softening point of Ficat, the thermoplastic resin layer may contain a plasticizer that is compatible with the above-mentioned thermoplastic resin. For example, even in the case of using a thermoplastic resin with a Philippine softening point of 120°C or higher, the Philippine softening point of the thermoplastic resin layer can be adjusted to 50°C by adding a plasticizer compatible with the thermoplastic resin. ～120℃. The plasticizer is not particularly limited as long as it is a compound that is compatible with the thermoplastic resin and exhibits plasticity. However, from the viewpoint of imparting plasticity, the plasticizer preferably has an alkylene group in the molecule, and it is a polyalkylene group. Diol compounds are more preferable. It is more preferable that the alkoxyl group contained in the plasticizer has a polyvinyloxy structure or a polypropyleneoxy structure.

熱塑性樹脂層可以單獨包含1種塑化劑，亦可以包含2種以上。 熱塑性樹脂層含有塑化劑之情況下，從感光性轉印構件在高速下的層壓性更加優異之觀點考慮，塑化劑的含量相對於熱塑性樹脂層的總質量為1質量%～70質量%為較佳，5質量%～50質量%為更佳。The thermoplastic resin layer may contain one type of plasticizer alone or two or more types. When the thermoplastic resin layer contains a plasticizer, the content of the plasticizer is 1% to 70% by mass relative to the total mass of the thermoplastic resin layer from the viewpoint that the photosensitive transfer member has better laminating properties at high speeds % Is more preferable, and 5% to 50% by mass is more preferable.

＜其他成分＞ 從調節與上述偽支撐體的接著力之觀點考慮，熱塑性樹脂層能夠在實際軟化點不超過80℃之範圍內加入各種聚合物或過冷物質、密接改善劑及脫模劑。 又，從進一步防止與上述偽支撐體發生黏連之觀點考慮，還能夠添加有機填充劑或無機填充劑。 此外，還可以具有酸反應性色素或鹼反應性色素（以下，略稱為“色素B”。）、光酸產生劑或光鹼產生劑、界面活性劑、敏化劑等其他成分。＜Other ingredients＞ From the viewpoint of adjusting the adhesion to the pseudo support, the thermoplastic resin layer can be added with various polymers or supercooling substances, adhesion improvers, and mold release agents within the range of the actual softening point not exceeding 80°C. In addition, from the viewpoint of further preventing the occurrence of adhesion with the pseudo support, an organic filler or an inorganic filler can also be added. In addition, it may also have other components such as an acid-reactive dye or an alkali-reactive dye (hereinafter referred to as "dye B"), a photoacid generator or a photobase generator, a surfactant, and a sensitizer.

（色素B） 熱塑性樹脂層具有酸反應性色素或鹼反應性色素（色素B）為較佳。色素B表示最大吸收波長藉由酸或鹼而變化之色素。色素B在顯色時的波長範圍400nm～780nm下的最大吸收波長為450nm以上為較佳。 其中，色素“藉由酸或鹼而最大吸收波長變化”亦可以表示如下者：顯色狀態下的色素藉由酸或鹼而脫色之態樣、脫色狀態下的色素藉由酸或鹼而顯色之態樣及顯色狀態下的色素藉由酸或鹼而改變成其他色相的顯色狀態之態樣中的任意態樣。 從曝光部及非曝光部的可見性、以及解析性之觀點考慮，色素B為最大吸收波長藉由酸而改變之色素為較佳，色素B係最大吸收波長藉由酸而改變之色素，並且併用後述之光酸產生劑之態樣為特佳。(Pigment B) The thermoplastic resin layer preferably has an acid-reactive dye or an alkali-reactive dye (dye B). Pigment B represents a pigment whose maximum absorption wavelength is changed by acid or alkali. It is preferable that the maximum absorption wavelength of the dye B in the wavelength range of 400 nm to 780 nm at the time of color development is 450 nm or more. Among them, the pigment "changes in the maximum absorption wavelength by acid or alkali" can also mean the following: the state in which the pigment in the colored state is decolorized by acid or alkali, and the state in which the pigment in the decolorized state is displayed by acid or alkali. The state of color and the pigment in the state of color development are changed to any of the states of the state of color development of other hues by acid or alkali. From the viewpoint of visibility and resolution of the exposed and non-exposed parts, it is preferable that the pigment B is a pigment whose maximum absorption wavelength is changed by acid, and the pigment B is a pigment whose maximum absorption wavelength is changed by acid, and It is particularly preferable to use the photoacid generator described later in combination.

作為本發明中的色素B的顯色機構的例子，可以舉出向熱塑性樹脂層中添加光酸產生劑或光鹼產生劑，並藉由在曝光之後從上述光酸產生劑等中產生之酸或鹼而酸反應性色素或鹼反應性色素（例如，無色色素）顯色之態樣等。As an example of the color-developing mechanism of the dye B in the present invention, a photoacid generator or a photobase generator is added to the thermoplastic resin layer, and the acid generated from the photoacid generator or the like is used after exposure. Or alkali-acid-reactive pigments or alkali-reactive pigments (for example, colorless pigments).

極大吸收波長的測量方法設為如下：在大氣氣氛下，且在25℃下使用分光光度計（裝置名稱：UV3100，SHIMADZU CORPORATION製造），在400nm～780nm的範圍下測量透射光譜，並測量光強度最小之波長（極大吸收波長）。The measurement method of the maximum absorption wavelength is set as follows: in an atmospheric atmosphere, using a spectrophotometer (device name: UV3100, manufactured by SHIMADZU CORPORATION) at 25°C, measuring the transmission spectrum in the range of 400nm～780nm, and measuring the light intensity The smallest wavelength (maximum absorption wavelength).

作為色素B，例如，可以舉出無色化合物、二芳基甲烷系色素、㗁口井系色素、口山口星（xanthene）系色素、亞胺基萘醌系色素、偶氮次甲基系色素、蒽醌系色素等，從曝光部及非曝光部的可見性之觀點考慮，無色化合物為較佳。 關於色素B的較佳態樣，可以舉出與國際公開第2019/022089號公報的0023段～0039段中記載之特定潛在色素相同者。 作為色素B的具體例，可以舉出亮綠、乙基紫、甲基綠、水晶紫、鹼性品紅、甲基紫2B、喹吶啶紅、孟加拉紅、間胺黃、瑞香草酚藍、茬酚藍、甲基橙、對甲基紅、剛果紅、苯紅紫4B、α-萘基紅、尼羅藍2B、尼羅藍A、甲基紫、孔雀綠、副品紅、維多利亞純藍-萘磺酸鹽、維多利亞純藍BOH（Hodogaya Chemical Co.,Ltd.製造）、油藍#603（ORIENT CHEMICAL INDUSTRIES CO.,LTD.製造）、油粉#312（ORIENT CHEMICAL INDUSTRIES CO.,LTD.製造）、油紅5B（ORIENT CHEMICAL INDUSTRIES CO.,LTD.製造）、油深紅#308（ORIENT CHEMICAL INDUSTRIES CO.,LTD.製造）、油紅OG（ORIENT CHEMICAL INDUSTRIES CO.,LTD.製造）、油紅RR（ORIENT CHEMICAL INDUSTRIES CO.,LTD.製造）、油綠#502（ORIENT CHEMICAL INDUSTRIES CO.,LTD.製造）、Spiron Red BEHS pecial（Hodogaya Chemical Co.,Ltd.製造）、間甲酚紫、甲酚紅、玫瑰紅B、玫瑰紅6G、磺胺B、金黃胺、4-對二乙胺基苯基亞胺基萘醌、2-羧基苯胺基-4-對二乙胺基苯基亞胺基萘醌、2-羧基硬脂基胺基-4-對-N,N-雙（羥乙基）胺基-苯基亞胺基萘醌、1-苯基-3-甲基-4-對二乙基胺基苯基亞胺基-5-吡唑酮、1-β-萘-4-對二乙基胺基苯基亞胺基-5-吡唑酮等染料或p,p’,p”-六甲基三胺基三苯基甲烷（無色水晶紫）、Pergascript Blue SRB（Ciba Geigy公司製造）等無色化合物。As the pigment B, for example, colorless compounds, diarylmethane-based pigments, Oguchi-based pigments, xanthene-based pigments, iminonaphthoquinone-based pigments, azomethine-based pigments, For the anthraquinone-based dyes, a colorless compound is preferred from the viewpoint of visibility of the exposed part and the non-exposed part. As for the preferred aspect of the pigment B, the same as the specific latent pigment described in paragraphs 0023 to 0039 of International Publication No. 2019/022089 can be cited. Specific examples of pigment B include brilliant green, ethyl violet, methyl green, crystal violet, basic fuchsin, methyl violet 2B, quinaldine red, bengal red, meta-amine yellow, and revanol blue , Phenol blue, methyl orange, p-methyl red, Congo red, benzene red violet 4B, α-naphthyl red, Nile blue 2B, Nile blue A, methyl violet, malachite green, para-magenta, Victoria pure Blue-naphthalene sulfonate, Victoria Pure Blue BOH (manufactured by Hodogaya Chemical Co., Ltd.), oil blue #603 (manufactured by ORIENT CHEMICAL INDUSTRIES CO., LTD.), oil powder #312 (ORIENT CHEMICAL INDUSTRIES CO., LTD. .Manufacturing), Oil Red 5B (manufactured by ORIENT CHEMICAL INDUSTRIES CO.,LTD.), Oil Crimson #308 (manufactured by ORIENT CHEMICAL INDUSTRIES CO.,LTD.), Oil Red OG (manufactured by ORIENT CHEMICAL INDUSTRIES CO.,LTD.), Oil Red RR (manufactured by ORIENT CHEMICAL INDUSTRIES CO.,LTD.), Oil Green #502 (manufactured by ORIENT CHEMICAL INDUSTRIES CO.,LTD.), Spiron Red BEHS pecial (manufactured by Hodogaya Chemical Co., Ltd.), m-cresol purple, Cresol Red, Rose Red B, Rose Red 6G, Sulfonamide B, Chrysene, 4-p-diethylaminophenylimino naphthoquinone, 2-carboxyanilino-4-p-diethylaminophenylimine Naphthoquinone, 2-carboxystearylamino-4-p-N,N-bis(hydroxyethyl)amino-phenyliminonaphthoquinone, 1-phenyl-3-methyl-4- Dyes such as p-diethylaminophenylimino-5-pyrazolone, 1-β-naphthalene-4-p-diethylaminophenylimino-5-pyrazolone or p,p' ,p"-hexamethyltriaminotriphenylmethane (colorless crystal violet), Pergascript Blue SRB (manufactured by Ciba Geigy) and other colorless compounds.

色素B可以單獨使用1種，亦可以使用2種以上。 熱塑性樹脂層含有色素B之情況下，從曝光部及非曝光部的可見性之觀點考慮，色素B的含量相對於熱塑性樹脂層的總質量為0.01質量%以上為較佳，0.02質量%～6質量%為更佳。Dye B may be used individually by 1 type, and may use 2 or more types. When the thermoplastic resin layer contains the pigment B, from the viewpoint of visibility of the exposed part and the non-exposed part, the content of the pigment B relative to the total mass of the thermoplastic resin layer is preferably 0.01% by mass or more, 0.02% by mass to 6 The quality% is better.

（光酸產生劑或光鹼產生劑） 從提高曝光部與非曝光部的可見性之原因考慮，熱塑性樹脂層與色素B併用且包含光酸產生劑或光鹼產生劑為較佳。更佳態樣係包含酸反應性色素和光酸產生劑之態樣。(Photoacid generator or photobase generator) From the viewpoint of improving the visibility of the exposed part and the non-exposed part, it is preferable that the thermoplastic resin layer and the dye B are used together and contain a photoacid generator or a photobase generator. A more preferable aspect includes an acid-reactive pigment and a photoacid generator.

作為本發明中所使用之光酸產生劑或光鹼產生劑係能夠藉由照射紫外線、遠紫外線、X射線、電子束等光化射線而產生酸或鹼之化合物。 作為本發明中所使用之光酸產生劑或光鹼產生劑為與波長300nm以上，較佳為波長300nm～450nm的光化射線感應而產生酸或鹼之化合物為較佳，其化學結構不受限制。又，對於不直接與波長300nm以上的光化射線感應之光酸產生劑或光鹼產生劑，只要藉由與敏化劑併用而與波長300nm以上的光化射線感應並產生酸或鹼之化合物，則亦能夠與敏化劑組合以較佳地使用。The photoacid generator or photobase generator used in the present invention is a compound capable of generating an acid or a base by irradiating actinic rays such as ultraviolet rays, extreme ultraviolet rays, X-rays, and electron beams. The photoacid generator or photobase generator used in the present invention is preferably a compound that generates an acid or a base in response to actinic rays with a wavelength of 300nm or more, preferably a wavelength of 300nm to 450nm, and its chemical structure is not affected by the limit. In addition, for photoacid generators or photobase generators that are not directly sensitive to actinic rays with a wavelength of 300nm or more, as long as they are used in combination with a sensitizer, they can react to actinic rays with a wavelength of 300nm or more and generate acid or base compounds. , It can also be combined with a sensitizer for better use.

作為光酸產生劑，能夠舉出離子性光酸產生劑及非離子性光酸產生劑。 作為離子性光酸產生劑的例子，能夠舉出二芳基錪鹽類及三芳基鋶鹽類等鎓鹽化合物、四級銨鹽類等。在該等中，鎓鹽化合物為較佳，三芳基鋶鹽類及二芳基錪鹽類為特佳。 作為離子性光酸產生劑，還能夠較佳地使用日本特開2014-085643號公報的0114段～0133段中記載之離子性光酸產生劑。 作為非離子性光酸產生劑的例子，能夠舉出三氯甲基均三口井類、重氮甲烷化合物、醯亞胺磺酸鹽化合物及肟磺酸鹽化合物等。作為三氯甲基均三口井類、重氮甲烷化合物及醯亞胺磺酸鹽化合物的具體例，能夠例示出日本特開2011-221494號公報的0083段～0088段中記載之化合物。 在該等中，從靈敏度、解析性及密接性之觀點考慮，光酸產生劑為肟磺酸鹽化合物為較佳。Examples of the photoacid generator include ionic photoacid generators and nonionic photoacid generators. Examples of ionic photoacid generators include onium salt compounds such as diaryl iodonium salts and triaryl sulfonium salts, quaternary ammonium salts, and the like. Among them, onium salt compounds are preferred, and triarylsulfonium salts and diaryl iodonium salts are particularly preferred. As the ionic photo-acid generator, the ionic photo-acid generator described in paragraphs 0114 to 0133 of JP 2014-085643 A can also be preferably used. Examples of nonionic photoacid generators include trichloromethyl mesitylene, diazomethane compounds, imidate sulfonate compounds, and oxime sulfonate compounds. As specific examples of trichloromethyl mesitylene, a diazomethane compound, and an imine sulfonate compound, the compounds described in paragraphs 0083 to 0088 of JP 2011-221494 A can be exemplified. Among them, from the viewpoints of sensitivity, resolution, and adhesion, the photoacid generator is preferably an oxime sulfonate compound.

作為肟磺酸鹽化合物，能夠較佳地使用國際公開第2018/179640號公報的0084段～0088段中所記載者。As the oxime sulfonate compound, those described in paragraphs 084 to 0088 of International Publication No. 2018/179640 can be preferably used.

熱塑性樹脂層可以單獨使用1種光酸產生劑或光鹼產生劑，亦可以使用2種以上。For the thermoplastic resin layer, one type of photoacid generator or photobase generator may be used alone, or two or more types may be used.

（界面活性劑） 從厚度均勻性之觀點考慮，熱塑性樹脂層含有界面活性劑為較佳。 作為界面活性劑，例如，可以舉出陰離子性、陽離子性、非離子性（非離子性）及兩性界面活性劑。較佳界面活性劑為非離子性界面活性劑。 作為非離子性界面活性劑的例子，能夠舉出聚氧乙烯高級烷基醚類、聚氧乙烯高級烷基苯基醚類、聚氧乙烯乙二醇的高級脂肪酸二酯類、矽酮系界面活性劑、氟系界面活性劑，能夠較佳地使用氟系界面活性劑。(Interface active agent) From the viewpoint of thickness uniformity, the thermoplastic resin layer preferably contains a surfactant. Examples of the surfactant include anionic, cationic, nonionic (nonionic) and amphoteric surfactants. Preferably the surfactant is a nonionic surfactant. Examples of nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkyl phenyl ethers, higher fatty acid diesters of polyoxyethylene glycol, and silicone interface As the active agent and the fluorine-based surfactant, a fluorine-based surfactant can be preferably used.

作為界面活性劑，例如，能夠使用國際公開第2018/179640號公報的0120段～0125段、日本專利第4502784號公報的0017段及日本特開2009-237362號公報的0060段～0071段中記載之界面活性劑。 又，作為界面活性劑的市售品，例如，能夠使用Megaface F-552或F-554（以上，DIC CORPORATION製造）。 又，作為界面活性劑的一態樣，從環境適應性之觀點考慮，利用使用了PFOA（全氟辛酸）或PFOS（全氟辛烷磺酸）的替代材料之界面活性劑來代替具有碳數為7以上的直鏈狀全氟烷基之化合物亦較佳。 熱塑性樹脂層含有界面活性劑之情況下，界面活性劑的含量相對於熱塑性樹脂層的總質量為0.001質量%～10質量%為較佳，0.01質量%～3質量%為更佳。 熱塑性樹脂層可以單獨使用1種界面活性劑，亦可以使用2種以上。As the surfactant, for example, paragraphs 0120 to 0125 of International Publication No. 2018/179640, paragraphs 0017 of Japanese Patent No. 4502784, and paragraphs 0060 to paragraph 0071 of Japanese Patent Application Publication No. 2009-237362 can be used. The surface active agent. In addition, as a commercially available product of the surfactant, for example, Megaface F-552 or F-554 (above, manufactured by DIC CORPORATION) can be used. In addition, as a surface active agent, from the point of view of environmental compatibility, the use of PFOA (perfluorooctanoic acid) or PFOS (perfluorooctane sulfonic acid) alternative materials instead of surfactants with a carbon number of 7 The above linear perfluoroalkyl compounds are also preferred. When the thermoplastic resin layer contains a surfactant, the content of the surfactant relative to the total mass of the thermoplastic resin layer is preferably 0.001% to 10% by mass, more preferably 0.01% to 3% by mass. For the thermoplastic resin layer, one type of surfactant may be used alone, or two or more types may be used.

又，熱塑性樹脂層還可以含有除了上述以外的其他添加劑。作為其他添加劑，並無特別限制，能夠使用公知的添加劑。 此外，關於熱塑性樹脂層的較佳態樣，還能夠參閱日本特開2014-085643號公報的0189段～0193段。In addition, the thermoplastic resin layer may contain other additives in addition to the above. There are no particular limitations on other additives, and known additives can be used. In addition, regarding the preferred aspect of the thermoplastic resin layer, reference can also be made to paragraphs 0189 to 0193 of Japanese Patent Application Laid-Open No. 2014-085643.

從層壓性變得更加良好之原因考慮，熱塑性樹脂層的厚度為1μm以上為較佳。又，關於上限，在性能上並無特別限制，但從製造適應性考慮，100μm以下為較佳，50μm以下為更佳。 本發明中，從層壓性變得更加良好之原因和/或圖案解析力變得更加良好之原因考慮，熱塑性樹脂層的厚度大於2μm且小於20μm為較佳。In view of the fact that the lamination property becomes better, the thickness of the thermoplastic resin layer is preferably 1 μm or more. In addition, the upper limit is not particularly limited in terms of performance, but from the viewpoint of manufacturing suitability, 100 μm or less is preferable, and 50 μm or less is more preferable. In the present invention, the thickness of the thermoplastic resin layer is preferably greater than 2 μm and less than 20 μm in view of the reason why the laminating property becomes better and/or the reason why the pattern resolution becomes better.

本發明中，希望熱塑性樹脂層係光學透明的。 又，從即使在隔著上述偽支撐體和熱塑性樹脂層進行曝光之情況下，亦能夠形成高解析的圖像之原因考慮，在上述偽支撐體與熱塑性樹脂層的積層體的狀態下測量之霧度為0.9%以下為較佳，0.8%以下為更佳。 其中，霧度係依據JIS K 7136：2000之總光線霧度（%），能夠使用霧度計（裝置名稱：HZ-2，Suga Test Instruments Co., Ltd.製造）作為總光霧度來測量。In the present invention, it is desirable that the thermoplastic resin layer is optically transparent. In addition, considering the reason that a high-resolution image can be formed even when exposed via the pseudo support and the thermoplastic resin layer, the measurement is performed in the state of the laminate of the pseudo support and the thermoplastic resin layer. The haze is preferably 0.9% or less, and more preferably 0.8% or less. Among them, the haze is based on the total light haze (%) of JIS K 7136: 2000, which can be measured using a haze meter (device name: HZ-2, manufactured by Suga Test Instruments Co., Ltd.) as the total light haze .

〔感光性樹脂層〕 本發明的感光性轉印構件具有感光性樹脂層。 本發明中，感光性樹脂層被設置成與上述熱塑性樹脂層直接接觸為較佳。亦即，本發明的感光性轉印構件在本發明的熱塑性樹脂層與感光性樹脂層之間不具有其他層（例如，水溶性樹脂層等）為較佳。〔Photosensitive resin layer〕 The photosensitive transfer member of the present invention has a photosensitive resin layer. In the present invention, the photosensitive resin layer is preferably provided in direct contact with the above-mentioned thermoplastic resin layer. That is, it is preferable that the photosensitive transfer member of the present invention does not have another layer (for example, a water-soluble resin layer, etc.) between the thermoplastic resin layer and the photosensitive resin layer of the present invention.

感光性樹脂層並無特別限制，能夠使用公知的感光性樹脂層，從在高速下的層壓性更加優異之觀點考慮，負型感光性樹脂層為較佳。 其中，負型感光性樹脂層係指，藉由曝光而在顯影液中的溶解性降低之感光性樹脂層。The photosensitive resin layer is not particularly limited, and a known photosensitive resin layer can be used. From the viewpoint of more excellent laminating properties at high speeds, a negative photosensitive resin layer is preferred. Here, the negative photosensitive resin layer refers to a photosensitive resin layer whose solubility in a developing solution is reduced by exposure.

從圖案形成性之觀點考慮，感光性樹脂層具有聚合性化合物、具有酸基之聚合物及光聚合起始劑為較佳。 作為感光性樹脂層，例如，可以使用日本特開2016-224162號公報中記載之感光性樹脂層。From the viewpoint of pattern formation, it is preferable that the photosensitive resin layer has a polymerizable compound, a polymer having an acid group, and a photopolymerization initiator. As the photosensitive resin layer, for example, the photosensitive resin layer described in JP 2016-224162 A can be used.

＜聚合性化合物＞ 感光性樹脂層含有聚合性化合物為較佳。 聚合性化合物係有助於負型感光性樹脂層的感光性（亦即，光硬化性）及硬化膜的強度之成分。 作為聚合性化合物，乙烯性不飽和化合物為較佳，2官能以上的乙烯性不飽和化合物為更佳。 其中，乙烯性不飽和化合物表示具有1個以上的乙烯性不飽和基之化合物，2官能以上的乙烯性不飽和化合物表示在1個分子中具有2個以上的乙烯性不飽和基之化合物。 作為乙烯性不飽和基，（甲基）丙烯醯基為更佳。 作為乙烯性不飽和化合物，（甲基）丙烯酸酯化合物為較佳。＜Polymerizable compound＞ The photosensitive resin layer preferably contains a polymerizable compound. The polymerizable compound is a component that contributes to the photosensitivity (that is, photocurability) of the negative photosensitive resin layer and the strength of the cured film. As the polymerizable compound, an ethylenically unsaturated compound is preferable, and an ethylenically unsaturated compound having a bifunctional or higher function is more preferable. Here, an ethylenically unsaturated compound means a compound having one or more ethylenically unsaturated groups, and a bifunctional or more ethylenic unsaturated compound means a compound having two or more ethylenically unsaturated groups in one molecule. As an ethylenically unsaturated group, a (meth)acryloyl group is more preferable. As the ethylenically unsaturated compound, a (meth)acrylate compound is preferred.

作為2官能乙烯性不飽和化合物，並無特別限制，能夠從公知的化合物中適當地選擇。具體而言，可以舉出三環癸二甲醇二丙烯酸酯（A-DCP，Shin Nakamura Chemical Industry Co.,LTD.製造）、三環癸二甲醇二甲基丙烯酸酯（DCP，Shin Nakamura Chemical Industry Co.,LTD.製造）、1,9-壬二醇二丙烯酸酯（A-NOD-N，Shin Nakamura Chemical Industry Co.,LTD.製造）、1,6-己二醇二丙烯酸酯（A-HD-N，Shin Nakamura Chemical Industry Co.,LTD.製造）等。 又，作為2官能乙烯性不飽和化合物，還可以適當使用具有雙酚結構之2官能乙烯性不飽和化合物。 作為具有雙酚結構之2官能乙烯性不飽和化合物，可以舉出日本特開2016-224162號公報的0072段～0080段中記載之化合物。 具體而言，可以舉出環氧烷改質雙酚A二（甲基）丙烯酸酯等，可以較佳地舉出2,2-雙（4-（甲基丙烯醯氧基二乙氧基）苯基）丙烷、2,2-雙（4-（甲基丙烯醯氧基乙氧基丙氧基）苯基）丙烷、在雙酚A的兩端上分別加成平均5莫耳的環氧乙烷而得之聚乙二醇的二甲基丙烯酸酯（BPE-500，Shin Nakamura Chemical Industry Co.,LTD.製造）等。As a bifunctional ethylenically unsaturated compound, there is no restriction|limiting in particular, It can select suitably from a well-known compound. Specifically, tricyclodecane dimethanol diacrylate (A-DCP, manufactured by Shin Nakamura Chemical Industry Co., LTD.), tricyclodecane dimethanol dimethacrylate (DCP, Shin Nakamura Chemical Industry Co. ., LTD.), 1,9-nonanediol diacrylate (A-NOD-N, manufactured by Shin Nakamura Chemical Industry Co., LTD.), 1,6-hexanediol diacrylate (A-HD -N, manufactured by Shin Nakamura Chemical Industry Co., LTD.), etc. In addition, as the bifunctional ethylenically unsaturated compound, a bifunctional ethylenically unsaturated compound having a bisphenol structure can also be suitably used. Examples of the bifunctional ethylenically unsaturated compound having a bisphenol structure include the compounds described in paragraphs 0072 to 0080 of JP 2016-224162 A. Specifically, alkylene oxide modified bisphenol A di(meth)acrylate and the like can be mentioned, preferably 2,2-bis(4-(methacryloxydiethoxy) Phenyl)propane, 2,2-bis(4-(methacryloxyethoxypropoxy)phenyl)propane, an average of 5 mol of epoxy is added to both ends of bisphenol A Dimethacrylate (BPE-500, manufactured by Shin Nakamura Chemical Industry Co., LTD.) of polyethylene glycol derived from ethane, etc.

作為3官能以上的乙烯性不飽和化合物，並無特別限制，能夠從公知的化合物中適當地選擇。例如，可以舉出二新戊四醇（三/四/五/六）（甲基）丙烯酸酯、新戊四醇（三/四）（甲基）丙烯酸酯、三羥甲基丙烷三（甲基）丙烯酸酯、二三羥甲基丙烷四（甲基）丙烯酸酯、異三聚氰酸（甲基）丙烯酸酯、甘油三（甲基）丙烯酸酯骨架的（甲基）丙烯酸酯化合物等。There are no particular limitations on the trifunctional or higher ethylenically unsaturated compound, and it can be appropriately selected from known compounds. For example, dineopentaerythritol (tris/tetra/five/six) (meth)acrylate, neopentaerythritol (tris/tetra) (meth)acrylate, trimethylolpropane tris (meth)acrylate, Base) acrylate, ditrimethylolpropane tetra(meth)acrylate, isocyanuric acid (meth)acrylate, glycerol tri(meth)acrylate skeleton (meth)acrylate compound, etc.

其中，“（三/四/五/六）（甲基）丙烯酸酯”係包含三（甲基）丙烯酸酯、四（甲基）丙烯酸酯、五（甲基）丙烯酸酯及六（甲基）丙烯酸酯之概念，“（三/四）（甲基）丙烯酸酯”係包含三（甲基）丙烯酸酯及四（甲基）丙烯酸酯之概念。Among them, "(three/four/five/six) (meth)acrylate" series include tri(meth)acrylate, tetra(meth)acrylate, penta(meth)acrylate and hexa(meth)acrylate The concept of acrylate, "(tri/tetra)(meth)acrylate" includes the concepts of tri(meth)acrylate and tetra(meth)acrylate.

作為乙烯性不飽和化合物，可以舉出己內酯改質（甲基）丙烯酸酯化合物（Nippon Kayaku Co.,Ltd.製造之KAYARAD（註冊商標）DPCA-20、Shin Nakamura Chemical Industry Co.,LTD.製造之A-9300-1CL等）、環氧烷改質（甲基）丙烯酸酯化合物（Nippon Kayaku Co.,Ltd.製造之KAYARAD RP-1040、Shin Nakamura Chemical Industry Co.,LTD.製造之ATM-35E、A-9300、DAICEL-ALLNEX LTD.製造之EBECRYL（註冊商標）135等）、乙氧基化甘油三丙烯酸酯（Shin Nakamura Chemical Industry Co.,LTD.製造之A-GLY-9E等）、ARONIX（註冊商標）TO-2349（TOAGOSEI CO.,LTD.製造）、ARONIXM-520（TOAGOSEI CO.,LTD.製造）、ARONIXM-270（TOAGOSEI CO.,LTD.製造）或ARONIXM-510（TOAGOSEI CO.,LTD.製造）等。 作為乙烯性不飽和化合物，還能夠使用胺基甲酸酯（甲基）丙烯酸酯化合物（較佳為3官能以上的胺基甲酸酯（甲基）丙烯酸酯化合物），例如，可以舉出8UX-015A（TAISEI FINE CHEMICAL CO,.LTD.製造）、UA-32P（Shin Nakamura Chemical Industry Co.,LTD.製造）、UA-1100H（Shin Nakamura Chemical Industry Co.,LTD.製造）等。 又，作為乙烯性不飽和化合物，還可以使用日本特開2004-239942號公報的0025段～0030段中記載之具有酸基之聚合性化合物。Examples of ethylenically unsaturated compounds include caprolactone-modified (meth)acrylate compounds (KAYARAD (registered trademark) DPCA-20 manufactured by Nippon Kayaku Co., Ltd., Shin Nakamura Chemical Industry Co., LTD. Manufactured A-9300-1CL, etc.), alkylene oxide modified (meth)acrylate compound (KAYARAD RP-1040 manufactured by Nippon Kayaku Co., Ltd., ATM- manufactured by Shin Nakamura Chemical Industry Co., LTD.) 35E, A-9300, EBECRYL (registered trademark) 135 manufactured by DAICEL-ALLNEX LTD.), ethoxylated glycerol triacrylate (A-GLY-9E manufactured by Shin Nakamura Chemical Industry Co., LTD., etc.), ARONIX (registered trademark) TO-2349 (manufactured by TOAGOSEI CO., LTD.), ARONIXM-520 (manufactured by TOAGOSEI CO., LTD.), ARONIXM-270 (manufactured by TOAGOSEI CO., LTD.) or ARONIXM-510 (manufactured by TOAGOSEI CO. ., LTD.) etc. As the ethylenically unsaturated compound, a urethane (meth)acrylate compound (preferably a trifunctional or higher urethane (meth)acrylate compound) can also be used, for example, 8UX -015A (manufactured by TAISEI FINE CHEMICAL CO,. LTD.), UA-32P (manufactured by Shin Nakamura Chemical Industry Co., LTD.), UA-1100H (manufactured by Shin Nakamura Chemical Industry Co., LTD.), etc. In addition, as the ethylenically unsaturated compound, polymerizable compounds having acid groups described in paragraphs 0025 to 0030 of JP 2004-239942 A can also be used.

作為本發明中所使用之聚合性化合物的重量平均分子量（Mw），200～3,000為較佳，280～2,200為更佳，300～2,200為進一步較佳。The weight average molecular weight (Mw) of the polymerizable compound used in the present invention is preferably 200 to 3,000, more preferably 280 to 2,200, and more preferably 300 to 2,200.

聚合性化合物可以單獨使用1種，亦可以併用2種以上。 感光性樹脂層含有聚合性化合物之情況下，聚合性化合物的含量相對於感光性樹脂層的總質量為10質量%～70質量%為較佳，20質量%～60質量%為更佳，20質量%～50質量%為進一步較佳。A polymerizable compound may be used individually by 1 type, and may use 2 or more types together. When the photosensitive resin layer contains a polymerizable compound, the content of the polymerizable compound relative to the total mass of the photosensitive resin layer is preferably 10% to 70% by mass, more preferably 20% to 60% by mass, 20 The mass %-50 mass% is more preferable.

＜具有酸基之聚合物＞ 感光性樹脂層含有具有酸基之聚合物為較佳。 感光性樹脂層中所包含之具有酸基之聚合物的較佳形態可以舉出，作為上述熱塑性樹脂層所具有之熱塑性樹脂而例示之與具有酸基之聚合物相同者。＜Polymer with acid group＞ The photosensitive resin layer preferably contains a polymer having an acid group. A preferable form of the polymer having an acid group contained in the photosensitive resin layer can be exemplified. As the thermoplastic resin contained in the above-mentioned thermoplastic resin layer, the same as the polymer having an acid group is exemplified.

感光性樹脂層可以單獨包含1種具有酸基之聚合物，亦可以包含2種以上。 感光性樹脂層含有具有酸基之聚合物之情況下，從感光性之觀點考慮，具有酸基之聚合物的含量相對於感光性樹脂層的總質量為10質量%以上且90質量%以下為較佳，20質量%以上且80質量%以下為更佳，30質量%以上且70質量%以下為進一步較佳。The photosensitive resin layer may contain 1 type of polymer which has an acid group individually, and may contain 2 or more types. When the photosensitive resin layer contains a polymer having an acid group, from the viewpoint of photosensitivity, the content of the polymer having an acid group relative to the total mass of the photosensitive resin layer is 10% by mass or more and 90% by mass or less Preferably, 20% by mass or more and 80% by mass or less are more preferable, and 30% by mass or more and 70% by mass or less are still more preferable.

＜光聚合起始劑＞ 感光性樹脂層包含光聚合起始劑為較佳。 光聚合起始劑藉由接收紫外線、可見光等光化射線來引發聚合性化合物的聚合。 作為光聚合起始劑，並無特別限制，能夠使用公知的光聚合起始劑。 作為光聚合起始劑，可以舉出光自由基聚合起始劑及光陽離子聚合起始劑，光自由基聚合起始劑為較佳。 此外，作為感光性樹脂層中的光聚合起始劑，從感光性及解析性之觀點考慮，包含選自包括2,4,5-三芳基咪唑二聚體及其衍生物之群組中的至少1種為較佳。＜Photopolymerization initiator＞ The photosensitive resin layer preferably contains a photopolymerization initiator. The photopolymerization initiator receives actinic rays such as ultraviolet rays and visible light to initiate polymerization of the polymerizable compound. The photopolymerization initiator is not particularly limited, and a known photopolymerization initiator can be used. Examples of the photopolymerization initiator include photoradical polymerization initiators and photocationic polymerization initiators, and photoradical polymerization initiators are preferred. In addition, as the photopolymerization initiator in the photosensitive resin layer, from the viewpoints of photosensitivity and resolution, it includes one selected from the group consisting of 2,4,5-triarylimidazole dimer and its derivatives. At least one is preferred.

又，作為光聚合起始劑，例如，可以使用日本特開2011-095716號公報的0031～0042段及日本特開2015-014783號公報的0064～0081段中所記載之聚合起始劑。In addition, as the photopolymerization initiator, for example, the polymerization initiators described in paragraphs 0031 to 0042 of JP-A-2011-095716 and paragraphs 0064 to 0081 of JP-A-2015-014783 can be used.

作為光聚合起始劑的市售品，可以舉出1-[4-（苯硫基）]-1,2-辛二酮-2-（鄰苯甲醯基肟）〔產品名稱：IRGACURE（註冊商標） OXE-01，BASF公司製造〕、1-[9-乙基-6-（2-甲基苯甲醯基）-9H-咔唑-3-基]乙酮-1-（鄰乙醯肟）〔產品名稱：IRGACURE（註冊商標） OXE-02、BASF公司製造〕、IRGACURE（註冊商標） OXE-03（BASF公司製造）、2-（二甲胺基）-2-[（4-甲基苯基）甲基]-1-[4-（4-嗎啉基）苯基]-1-丁酮〔產品名稱：IRGACURE（註冊商標） 379EG，BASF公司製造〕、2-甲基-1-（4-甲基硫代苯基）-2-嗎啉代丙烷-1-酮〔產品名稱：IRGACURE（註冊商標）907，BASF公司製造〕、2-羥基-1-{4-[4-（2-羥基-2-甲基丙醯基）芐基]苯基}-2-甲基丙-1-酮〔產品名稱：IRGACURE（註冊商標） 127，BASF公司製造〕、2-芐基-2-二甲胺基-1-（4-嗎啉代苯基）丁酮-1〔產品名稱：IRGACURE（註冊商標） 369，BASF公司製造〕、2-羥基-2-甲基-1-苯基丙烷-1-酮〔產品名稱：IRGACURE（註冊商標） 1173，BASF公司製造〕、1-羥基環己基苯基甲酮〔產品名稱：IRGACURE（註冊商標） 184，BASF公司製造〕、2,2-二甲氧基-1,2-二苯乙烷-1-酮〔產品名稱：IRGACURE 651，BASF公司製造〕等、肟酯系〔產品名稱：Lunar（註冊商標） 6，DKSH Japan K.K.製造〕等。 又，作為光聚合起始劑，還能夠使用2,4-雙（三氯甲基）-6-（N,N-二乙氧基羰基甲胺基）-3-溴苯基]均三口井等。As a commercially available product of the photopolymerization initiator, 1-[4-(phenylthio)]-1,2-octanedione-2-(phthaloyl oxime) [product name: IRGACURE ( Registered trademark) OXE-01, manufactured by BASF Corporation], 1-[9-ethyl-6-(2-methylbenzyl)-9H-carbazol-3-yl]ethanone-1-(o-ethyl Oxime) [product name: IRGACURE (registered trademark) OXE-02, manufactured by BASF Corporation], IRGACURE (registered trademark) OXE-03 (manufactured by BASF Corporation), 2-(dimethylamino)-2-[(4- Methylphenyl)methyl]-1-[4-(4-morpholinyl)phenyl]-1-butanone [product name: IRGACURE (registered trademark) 379EG, manufactured by BASF Corporation], 2-methyl- 1-(4-Methylthiophenyl)-2-morpholinopropane-1-one [product name: IRGACURE (registered trademark) 907, manufactured by BASF Corporation], 2-hydroxy-1-{4-[4 -(2-Hydroxy-2-methylpropanyl)benzyl]phenyl}-2-methylpropan-1-one [product name: IRGACURE (registered trademark) 127, manufactured by BASF Corporation], 2-benzyl -2-Dimethylamino-1-(4-morpholinophenyl)butanone-1 [product name: IRGACURE (registered trademark) 369, manufactured by BASF Corporation], 2-hydroxy-2-methyl-1- Phenylpropane-1-one [product name: IRGACURE (registered trademark) 1173, manufactured by BASF Corporation], 1-hydroxycyclohexyl phenyl ketone [product name: IRGACURE (registered trademark) 184, manufactured by BASF Corporation], 2, 2-Dimethoxy-1,2-diphenylethane-1-one [product name: IRGACURE 651, manufactured by BASF Corporation] etc., oxime ester series [product name: Lunar (registered trademark) 6, manufactured by DKSH Japan KK 〕Wait. In addition, as a photopolymerization initiator, 2,4-bis(trichloromethyl)-6-(N,N-diethoxycarbonylmethylamino)-3-bromophenyl] Kizumi Wait.

感光性樹脂層可以單獨包含1種光聚合起始劑，亦可以包含2種以上。 感光性樹脂層含有光聚合起始劑之情況下，光聚合起始劑的含量並無特別限制，相對於感光性樹脂層的總質量為0.1質量%以上為較佳，0.5質量%以上為更佳，1.0質量%以上為進一步較佳。 又，光聚合起始劑的含量相對於感光性樹脂層的總質量為10質量%以下為較佳，5質量%以下為更佳。The photosensitive resin layer may contain one type of photopolymerization initiator singly, or may contain two or more types. When the photosensitive resin layer contains a photopolymerization initiator, the content of the photopolymerization initiator is not particularly limited. It is preferably 0.1% by mass or more with respect to the total mass of the photosensitive resin layer, and more preferably 0.5% by mass or more. Preferably, it is more preferably 1.0% by mass or more. In addition, the content of the photopolymerization initiator is preferably 10% by mass or less with respect to the total mass of the photosensitive resin layer, and more preferably 5% by mass or less.

＜其他添加劑＞ 感光性樹脂層除了上述成分以外還能夠根據需要包含公知的添加劑。 作為其他添加劑，還能夠使用公知者，例如，可以舉出聚合抑制劑、塑化劑、敏化劑、氫供體、雜環狀化合物、發色劑、脫色劑、溶劑等。 作為聚合抑制劑，例如，能夠使用日本專利第4502784號公報的0018段中所記載之熱聚合抑制劑。其中，能夠較佳地使用啡噻口井、吩㗁口井或4-甲氧基苯酚。 感光性樹脂層含有聚合抑制劑之情況下，聚合抑制劑的含量相對於感光性樹脂層的總質量為0.01～3質量%為較佳，0.01～1質量%為更佳，0.01～0.8質量%為進一步較佳。 作為敏化劑，可以舉出公知的敏化劑、染料或顏料等。 作為塑化劑及雜環狀化合物，可以舉出國際公開第2018/179640號公報的0097段～0103段及0111段～0118段中所記載者。 作為發色劑，例如，能夠使用日本特開2007-178459號公報的0417段中所記載之發色劑，可以更佳地使用無色水晶紫、水晶紫內酯、維多利亞純藍-萘磺酸鹽等。 感光性樹脂層含有發色劑之情況下，從曝光部和非曝光部的可見性及解析性之觀點考慮，發色劑的含量相對於感光性樹脂層的總質量為0.1～10質量%為較佳，0.1～5質量%為更佳，0.1～1質量%為特佳。＜Other additives＞ The photosensitive resin layer can contain well-known additives as needed in addition to the above-mentioned components. As other additives, known ones can also be used, and examples thereof include polymerization inhibitors, plasticizers, sensitizers, hydrogen donors, heterocyclic compounds, color formers, decolorants, solvents, and the like. As the polymerization inhibitor, for example, the thermal polymerization inhibitor described in paragraph 0018 of Japanese Patent No. 4502784 can be used. Among them, phenanthrene, phenanthrene, or 4-methoxyphenol can be preferably used. When the photosensitive resin layer contains a polymerization inhibitor, the content of the polymerization inhibitor relative to the total mass of the photosensitive resin layer is preferably 0.01 to 3% by mass, more preferably 0.01 to 1% by mass, and 0.01 to 0.8% by mass To be further preferred. As a sensitizer, a well-known sensitizer, dye, a pigment, etc. can be mentioned. Examples of the plasticizer and heterocyclic compound include those described in paragraphs 0097 to 0103 and paragraphs 0111 to 0118 of International Publication No. 2018/179640. As the coloring agent, for example, the coloring agent described in paragraph 0417 of JP 2007-178459 A can be used, and colorless crystal violet, crystal violet lactone, and Victoria pure blue naphthalene sulfonate can be used more preferably. Wait. When the photosensitive resin layer contains a color-developing agent, from the viewpoint of visibility and resolution of the exposed and non-exposed portions, the content of the color-developing agent is 0.1-10% by mass relative to the total mass of the photosensitive resin layer. Preferably, 0.1 to 5% by mass is more preferable, and 0.1 to 1% by mass is particularly preferable.

又，感光性樹脂層中能夠進一步加入金屬氧化物粒子、抗氧化劑、分散劑、酸增殖劑、顯影促進劑、導電性纖維、著色劑、熱自由基聚合起始劑、熱酸產生劑、紫外線吸收劑、增稠劑、交聯劑及有機或無機的沉澱防止劑等公知的添加劑。 關於其他成分的較佳態樣，在日本特開2014-085643號公報的0165段～0184段中有分別記載，該公報的內容被編入到本說明書中。In addition, the photosensitive resin layer can further add metal oxide particles, antioxidants, dispersants, acid multipliers, development accelerators, conductive fibers, colorants, thermal radical polymerization initiators, thermal acid generators, and ultraviolet rays. Known additives such as absorbents, thickeners, crosslinking agents, and organic or inorganic precipitation inhibitors. The preferred aspects of other components are separately described in paragraphs 0165 to 0184 of JP 2014-085643 A, and the contents of the publication are incorporated into this specification.

從圖案解析力之觀點考慮，感光性樹脂層的厚度為0.5～20μm為較佳，0.8～15μm為更佳，1.0～10μm為進一步較佳。From the viewpoint of pattern resolution, the thickness of the photosensitive resin layer is preferably 0.5-20 μm, more preferably 0.8-15 μm, and still more preferably 1.0-10 μm.

〔覆蓋膜〕 本發明的感光性轉印構件具有覆蓋膜。 作為覆蓋膜，可以舉出樹脂薄膜、紙等，從強度及撓性等之觀點考慮，樹脂薄膜為特佳。作為樹脂薄膜，可以舉出聚乙烯薄膜、聚丙烯薄膜、聚對酞酸乙二酯薄膜、三乙酸纖維素薄膜、聚苯乙烯薄膜、聚碳酸酯薄膜等。其中，聚乙烯薄膜、聚丙烯薄膜、聚對酞酸乙二酯薄膜為較佳。〔Cover film〕 The photosensitive transfer member of the present invention has a cover film. As the cover film, a resin film, paper, etc. can be cited, and from the viewpoint of strength, flexibility, etc., a resin film is particularly preferred. Examples of the resin film include polyethylene film, polypropylene film, polyethylene terephthalate film, cellulose triacetate film, polystyrene film, polycarbonate film, and the like. Among them, polyethylene film, polypropylene film, and polyethylene terephthalate film are preferred.

覆蓋膜的厚度並無特別限定，例如，可以較佳地舉出1μm～2mm者。The thickness of the cover film is not particularly limited, and for example, preferably 1 μm to 2 mm.

〔其他層〕 本發明之感光性轉印構件可以具有除了上述以外的層（以下，簡稱為“其他層”。）。作為其他層，能夠舉出對比度增強層、易剝離層、BARC層等。 關於對比度增強層的較佳態樣，在國際公開第2018/179640號公報的0134段中有記載，其內容被編入到本說明書中。[Other layers] The photosensitive transfer member of the present invention may have layers other than those described above (hereinafter, simply referred to as "other layers"). Examples of other layers include a contrast enhancement layer, an easily peelable layer, and a BARC layer. The preferred aspect of the contrast enhancement layer is described in paragraph 0134 of International Publication No. 2018/179640, the content of which is incorporated into this specification.

其中，參閱圖1，示意性地示出本發明的感光性轉印構件的層結構的一例。 圖1中示出之感光性轉印構件100依序積層有偽支撐體10、熱塑性樹脂層12、感光性樹脂層14及覆蓋膜16。Among them, referring to FIG. 1, an example of the layer structure of the photosensitive transfer member of the present invention is schematically shown. In the photosensitive transfer member 100 shown in FIG. 1, a dummy support 10, a thermoplastic resin layer 12, a photosensitive resin layer 14 and a cover film 16 are laminated in this order.

本發明中，在使用了本發明的感光性轉印材料之樹脂圖案的製造方法等中，在顯影製程之前剝離偽支撐體時，從更加容易與偽支撐體一起剝離熱塑性樹脂層之原因考慮，上述偽支撐體、熱塑性樹脂層、感光性樹脂層及覆蓋膜的各層之間的剝離強度中，偽支撐體與熱塑性樹脂層之間的剝離強度最強，且感光性樹脂層與覆蓋膜之間的剝離強度最弱為較佳。In the present invention, in the method of manufacturing a resin pattern using the photosensitive transfer material of the present invention, when the dummy support is peeled off before the development process, it is considered that it is easier to peel the thermoplastic resin layer together with the dummy support. Among the peel strengths between the pseudo support, thermoplastic resin layer, photosensitive resin layer, and cover film, the peel strength between the pseudo support and the thermoplastic resin layer is the strongest, and the gap between the photosensitive resin layer and the cover film The weakest peel strength is better.

[感光性轉印構件的製造方法] 本發明的感光性轉印構件的製造方法並無特別限制，能夠使用公知的製造方法。 具體而言，能夠藉由將上述各層的構成成分和溶劑進行混合來製備熱塑性樹脂組成物等組成物，並在偽支撐體或覆蓋膜上塗佈上述組成物，從而獲得依序具有偽支撐體、熱塑性樹脂層、感光性樹脂層及覆蓋膜之感光性轉印構件。 具體而言，作為感光性轉印構件的製造方法，可以舉出具備如下製程之方法：在偽支撐體上塗佈和乾燥熱塑性樹脂組成物而形成熱塑性樹脂層之製程；在熱塑性樹脂層上塗佈和乾燥感光性樹脂組成物而形成感光性樹脂層之製程；及在上述感光性樹脂層上設置覆蓋膜之製程。[Manufacturing method of photosensitive transfer member] The manufacturing method of the photosensitive transfer member of this invention is not specifically limited, A well-known manufacturing method can be used. Specifically, it is possible to prepare a composition such as a thermoplastic resin composition by mixing the constituent components of the above-mentioned layers and a solvent, and coat the above-mentioned composition on a pseudo support or a cover film to obtain a pseudo support in sequence. , Thermoplastic resin layer, photosensitive resin layer and photosensitive transfer member for cover film. Specifically, as a method of manufacturing the photosensitive transfer member, a method having the following processes: a process of coating and drying a thermoplastic resin composition on a pseudo support to form a thermoplastic resin layer; and coating on a thermoplastic resin layer The process of forming a photosensitive resin layer by cloth and drying the photosensitive resin composition; and the process of providing a cover film on the photosensitive resin layer.

作為感光性轉印構件的製造方法的其他方法，可以舉出具備如下製程之方法：在偽支撐體上塗佈和乾燥熱塑性樹脂組成物而形成熱塑性樹脂層之製程；在覆蓋膜上塗佈和乾燥感光性樹脂組成物而形成感光性樹脂層之製程；及使在兩個製程中製作之積層體亦即附熱塑性樹脂層之偽支撐體和附感光性樹脂層之覆蓋膜以熱塑性樹脂層與感光性樹脂層接觸之方式貼合之製程。As another method of manufacturing the photosensitive transfer member, a method including the following processes: a process of coating and drying a thermoplastic resin composition on a pseudo support to form a thermoplastic resin layer; a process of coating and drying a thermoplastic resin layer on a cover film; The process of drying the photosensitive resin composition to form the photosensitive resin layer; and making the laminate produced in the two processes, namely the pseudo support with the thermoplastic resin layer and the cover film with the photosensitive resin layer, with the thermoplastic resin layer and The process of bonding the photosensitive resin layer in contact with each other.

又，本發明中，在形成熱塑性樹脂層時，從降低對環境的負荷之觀點考慮，不基於先前的使用了有機溶劑之塗佈乾燥之方式而是在偽支撐體上藉由熔融擠出方式進行設置為較佳。In addition, in the present invention, when forming the thermoplastic resin layer, from the viewpoint of reducing the load on the environment, it is not based on the conventional coating and drying method using an organic solvent but a melt extrusion method on the pseudo support. It is better to make settings.

[樹脂圖案的製造方法] 本發明的樹脂圖案的製造方法，其係使用上述本發明的感光性轉印構件，並以卷對卷方式製作樹脂圖案，前述樹脂圖案的製造方法依序具備：從感光性轉印構件剝離覆蓋膜之剝離製程（以下，亦稱為“覆蓋膜剝離製程”。）；貼合製程，其係使剝離了覆蓋膜之感光性轉印構件中的感光性樹脂層與具有導電層之基板接觸以進行貼合；曝光製程，其係對感光性樹脂層進行圖案曝光；及顯影製程，其係對經曝光之感光性樹脂層進行顯影而形成樹脂圖案，在貼合製程與曝光製程之間，或者曝光製程與顯影製程之間，具備從感光性轉印構件同時剝離偽支撐體和熱塑性樹脂層之製程（以下，亦稱為“同時剝離製程”。）。[Manufacturing method of resin pattern] The method for producing a resin pattern of the present invention uses the above-mentioned photosensitive transfer member of the present invention to produce a resin pattern in a roll-to-roll manner. The method for producing the resin pattern includes in order: peeling the cover from the photosensitive transfer member Film peeling process (hereinafter, also referred to as "cover film peeling process".); lamination process, which is to contact the photosensitive resin layer in the photosensitive transfer member from which the cover film is peeled off and the substrate with the conductive layer to Lamination; exposure process, which is pattern exposure of the photosensitive resin layer; and development process, which is to develop the exposed photosensitive resin layer to form a resin pattern, between the lamination process and the exposure process, or Between the exposure process and the development process, there is a process of simultaneously peeling the dummy support and the thermoplastic resin layer from the photosensitive transfer member (hereinafter, also referred to as the "simultaneous peeling process").

[電路配線的製造方法] 本發明的電路配線的製造方法，其係使用上述本發明的感光性轉印構件，並以卷對卷方式製作電路配線，前述電路配線的製造方法依序具備：從感光性轉印構件剝離覆蓋膜之剝離製程（覆蓋膜剝離製程）；貼合製程，其係使剝離了覆蓋膜之感光性轉印構件中的感光性樹脂層與具有導電層之基板接觸以進行貼合；曝光製程，其係對感光性樹脂層進行圖案曝光；顯影製程，其係對經曝光之感光性樹脂層進行顯影而形成樹脂圖案；及對位於未配置有樹脂圖案之區域的導電層進行蝕刻處理之製程，在貼合製程與曝光製程之間，或者曝光製程與顯影製程之間，具備從感光性轉印構件同時剝離偽支撐體和熱塑性樹脂層之製程（同時剝離製程）。[Method of manufacturing circuit wiring] The method of manufacturing circuit wiring of the present invention uses the above-mentioned photosensitive transfer member of the present invention to manufacture circuit wiring in a roll-to-roll manner. The method of manufacturing circuit wiring includes in order: peeling and covering from the photosensitive transfer member Film peeling process (covering film peeling process); bonding process, which is to make the photosensitive resin layer in the photosensitive transfer member from which the cover film is peeled come into contact with the substrate with the conductive layer for bonding; exposure process, which The photosensitive resin layer is patterned; the development process is to develop the exposed photosensitive resin layer to form a resin pattern; and the conductive layer in the area where the resin pattern is not arranged is etched. In Between the lamination process and the exposure process, or between the exposure process and the development process, there is a process (simultaneous peeling process) for simultaneously peeling the dummy support and the thermoplastic resin layer from the photosensitive transfer member.

以下，對包括樹脂圖案的製造方法及電路配線的製造方法之各製程進行說明，最先對卷對卷方式進行說明。 卷對卷方式係指，作為基板使用能夠捲繞和解繞之基板，並且在樹脂圖案的製造方法或電路配線的製造方法中所包括之任一製程之前，包括將基板或包含基板之結構體進行解繞之製程（亦稱為“解繞製程”。）及在任一製程之後，將基材或包含基板之結構體進行捲繞之製程（亦稱為“捲繞製程”。），並且一邊輸送基材或包含基板之結構體，一邊進行至少任一製程（較佳為所有製程）之方式。 作為解繞製程中的解繞方法及捲繞製程中的捲繞方法，並無特別限制，只要在應用卷對卷方式之製造方法中，使用公知的方法即可。Hereinafter, each process including the manufacturing method of the resin pattern and the manufacturing method of the circuit wiring will be described, and the roll-to-roll method will be described first. The roll-to-roll method refers to the use of a substrate that can be wound and unwound as a substrate, and before any process included in the manufacturing method of the resin pattern or the manufacturing method of the circuit wiring, the substrate or the structure containing the substrate is processed The process of unwinding (also called "unwinding process") and after any process, the process of winding the base material or the structure containing the substrate (also called the "winding process") and transporting it The substrate or the structure containing the substrate is carried out by at least any process (preferably all processes). The unwinding method in the unwinding process and the winding method in the winding process are not particularly limited, as long as a known method is used in the manufacturing method using the roll-to-roll method.

〔覆蓋膜剝離製程〕 本發明的樹脂圖案的製造方法及電路配線的製造方法所具備之剝離製程係從感光性轉印構件剝離覆蓋膜之製程。 作為剝離方法，並無特別限制，只要利用公知的方法進行剝離即可。例如，能夠使用日本特開2010-072589號公報的[0161]～[0162]段中所記載之覆蓋膜剝離機構等。〔Cover film peeling process〕 The peeling process included in the method of manufacturing a resin pattern and the method of manufacturing a circuit wiring of the present invention is a process of peeling the cover film from the photosensitive transfer member. There are no particular limitations on the peeling method, as long as the peeling is performed by a known method. For example, the cover film peeling mechanism described in paragraphs [0161] to [0162] of JP 2010-072589 A can be used.

〔貼合製程〕 本發明的樹脂圖案的製造方法及電路配線的製造方法所具備之貼合製程係使剝離了覆蓋膜之感光性轉印構件中的感光性樹脂層與具有導電層之基板接觸以進行貼合之製程。 在上述貼合製程中，使上述導電層與上述感光性轉印構件所具有之感光性樹脂層的熱塑性樹脂層相反一側的表面接觸之方式壓接為較佳。若為上述態樣，則能夠將曝光和顯影後的形成圖案之感光性樹脂層較佳地用作蝕刻導電層時之蝕刻抗蝕劑。 作為對上述基板和上述感光性轉印構件進行壓接之方法，並無特別限制，能夠使用公知的轉印方法及層壓方法。 感光性轉印構件與基板的貼合係藉由將與感光性轉印構件所具有之感光性樹脂層的中間層相反一側的表面與基板重疊，並基於輥等的加壓及加熱來進行為較佳。在貼合時能夠使用層壓機、真空層壓機及能夠更加提高生產率之自動切割層壓機等公知的層壓機。〔Lamination process〕 The method of manufacturing a resin pattern and the method of manufacturing a circuit wiring of the present invention have a bonding process in which the photosensitive resin layer in the photosensitive transfer member from which the cover film is peeled is brought into contact with the substrate having the conductive layer for bonding Process. In the above-mentioned bonding process, it is preferable to press-bond the conductive layer and the surface of the photosensitive resin layer on the opposite side of the thermoplastic resin layer of the photosensitive resin layer of the photosensitive transfer member. In the above aspect, the patterned photosensitive resin layer after exposure and development can be preferably used as an etching resist when etching the conductive layer. There are no particular limitations on the method of pressure-bonding the substrate and the photosensitive transfer member, and a known transfer method and lamination method can be used. The bonding of the photosensitive transfer member and the substrate is performed by superimposing the surface on the side opposite to the intermediate layer of the photosensitive resin layer of the photosensitive transfer member with the substrate, and pressing and heating by a roller etc. For better. It is possible to use well-known laminators such as laminators, vacuum laminators, and automatic cutting laminators that can further increase productivity.

具有導電層之基板在玻璃、矽、薄膜等基材上具有導電層，依據需要可以形成有任意的層。 作為基板的較佳態樣，例如，在國際公開第2018/155193號公報的0140段中有記載，該內容被編入到本說明書中。The substrate with a conductive layer has a conductive layer on a substrate such as glass, silicon, and a film, and any layer can be formed as needed. As a preferred aspect of the substrate, for example, it is described in paragraph 0140 of International Publication No. 2018/155193, and this content is incorporated into this specification.

從以卷對卷方式製造之觀點考慮，作為基板的基材為薄膜基材為較佳。又，藉由卷對卷方式製造觸控面板用電路配線之情況下，基材為片狀樹脂組成物為較佳。From the viewpoint of manufacturing in a roll-to-roll method, the substrate as the substrate is preferably a film substrate. Moreover, when manufacturing circuit wiring for a touch panel by a roll-to-roll method, it is preferable that the base material is a sheet-like resin composition.

從導電性及細線形成性之觀點考慮，作為基板所具有之導電層為選自包括金屬層、導電性金屬氧化物層、石墨烯層、碳奈米管層及導電聚合物層之群組中的至少1種層為較佳，金屬層為更佳，銅層或銀層為特佳。 又，基材上可以具有1層導電層，亦可以具有2層以上。導電層為2層以上之情況下，具有不同材質的導電層為較佳。 作為導電層的較佳態樣，例如，在國際公開第2018/155193號公報的0141段中有記載，該內容被編入到本說明書中。From the viewpoint of conductivity and fine line formation, the conductive layer provided as a substrate is selected from the group consisting of a metal layer, a conductive metal oxide layer, a graphene layer, a carbon nanotube layer, and a conductive polymer layer At least one layer of is preferable, a metal layer is more preferable, and a copper layer or a silver layer is particularly preferable. In addition, the base material may have one conductive layer or two or more layers. When there are two or more conductive layers, conductive layers with different materials are preferable. As a preferable aspect of the conductive layer, for example, it is described in paragraph 0141 of International Publication No. 2018/155193, and this content is incorporated into this specification.

〔曝光製程〕 本發明的樹脂圖案的製造方法及電路配線的製造方法所具備之曝光製程係對感光性樹脂層進行圖案曝光之製程。〔Exposure process〕 The exposure process included in the method of manufacturing a resin pattern and the method of manufacturing a circuit wiring of the present invention is a process of patterning the photosensitive resin layer.

圖案曝光時的圖案的詳細配置及具體尺寸並無特別限制。為了提高具備具有藉由電路配線的製造方法製造之電路配線之輸入裝置之顯示裝置（例如，觸控面板）的顯示質量，並且減小取出配線所佔的面積，圖案中的至少一部分（較佳為觸控面板的電極圖案和/或取出配線的部分）包含寬度為20μm以下的細線為較佳，包含寬度為10μm以下的細線為更佳。The detailed arrangement and specific dimensions of the pattern at the time of pattern exposure are not particularly limited. In order to improve the display quality of a display device (such as a touch panel) having an input device with circuit wiring manufactured by a circuit wiring manufacturing method, and to reduce the area occupied by the wiring, at least a part of the pattern (preferably It is preferable that the electrode pattern of the touch panel and/or the portion where the wiring is taken out) include fine lines with a width of 20 μm or less, and more preferably include fine lines with a width of 10 μm or less.

作為使用於曝光之光源、曝光量及曝光方法的較佳態樣，例如，在國際公開第2018/155193號公報的0146～0147段中有記載，該等內容被編入到本說明書中。As a preferable aspect of the light source, exposure amount, and exposure method used for exposure, for example, it is described in paragraphs 0146-0147 of International Publication No. 2018/155193, and these contents are incorporated into this specification.

〔顯影製程〕 本發明的樹脂圖案的製造方法及電路配線的製造方法所具備之顯影製程係藉由對經曝光之感光性樹脂層進行顯影而形成樹脂圖案之製程。〔Development process〕 The development process included in the manufacturing method of the resin pattern and the manufacturing method of the circuit wiring of the present invention is a process of forming a resin pattern by developing the exposed photosensitive resin layer.

上述顯影製程中的經曝光之上述感光性樹脂層的顯影能夠使用顯影液來進行。 作為顯影液及顯影方式，只要能夠去除感光性樹脂層的非圖像部，則並無特別限制，能夠使用公知的顯影液及顯影方式。作為本發明中可較佳地使用之顯影液，例如，可以舉出國際公開第2015/093271號公報的0194段中記載之顯影液，作為可較佳地使用之顯影方式，例如，可以舉出國際公開第2015/093271號公報的0195段中記載之顯影方式。The development of the exposed photosensitive resin layer in the development process can be performed using a developer. There are no particular limitations on the developer and the development method as long as the non-image portion of the photosensitive resin layer can be removed, and a known developer and development method can be used. As a developer that can be preferably used in the present invention, for example, the developer described in paragraph 0194 of International Publication No. 2015/093271 can be cited. As a development method that can be preferably used, for example, The development method described in paragraph 0195 of International Publication No. 2015/093271.

〔同時剝離製程〕 本發明的樹脂圖案的製造方法及電路配線的製造方法所具備之同時剝離製程係在貼合製程與曝光製程之間，或在曝光製程與顯影製程之間，從感光性轉印構件同時剝離偽支撐體和熱塑性樹脂層之製程。 作為剝離方法，以積層體的形態將偽支撐體和熱塑性樹脂層捲繞於捲繞軸並進行回收之方法為較佳，例如，能夠使用與日本特開2010-072589號公報的[0161]～[0162]段中所記載之覆蓋膜剝離機構相同的機構等。〔Simultaneous stripping process〕 The method of manufacturing the resin pattern and the method of manufacturing circuit wiring of the present invention have a simultaneous peeling process that is between the bonding process and the exposure process, or between the exposure process and the development process, and simultaneously peels off the dummy from the photosensitive transfer member. The manufacturing process of the support and the thermoplastic resin layer. As the peeling method, a method in which the dummy support and the thermoplastic resin layer are wound on a winding shaft in the form of a laminate and recovered is preferable. For example, [0161] to Japanese Patent Application Laid-Open No. 2010-072589 can be used. [0162] The same mechanism as the cover film peeling mechanism described in the paragraph.

〔後曝光及後烘烤〕 本發明的樹脂圖案的製造方法及電路配線的製造方法可以具備將藉由上述顯影製程而獲得之樹脂圖案進行曝光（以下，亦稱為“後曝光”。）和/或加熱處理（以下，亦稱為“後烘烤”。）之製程。 在包括進行後曝光之製程及進行後烘烤之製程這兩者之情況下，在後曝光之後實施後烘烤為較佳。〔Post-exposure and post-baking〕 The method of manufacturing a resin pattern and the method of manufacturing a circuit wiring of the present invention may include exposing the resin pattern obtained by the above-mentioned development process (hereinafter, also referred to as "post-exposure") and/or heating treatment (hereinafter, also It is called "post-baking".) The process. In the case of including both the process of performing post-exposure and the process of performing post-baking, it is better to perform post-baking after post-exposure.

〔蝕刻製程〕 本發明的電路配線的製造方法所具有之蝕刻製程係對位於未配置有樹脂圖案之區域之導電層進行蝕刻處理之製程。〔Etching process〕 The etching process of the manufacturing method of the circuit wiring of the present invention is a process of etching the conductive layer in the area where the resin pattern is not arranged.

在上述蝕刻製程中，將藉由上述顯影製程而由上述感光性樹脂層形成之圖案用作蝕刻抗蝕劑，並進行上述導電層的蝕刻處理。 作為蝕刻處理的方法，能夠應用日本特開2017-120435號公報的0209段～0210段中記載之方法、日本特開2010-152155號公報的0048段～0054段等中記載之方法、公知的電漿蝕刻等基於乾式蝕刻之方法等、公知的方法。In the above-mentioned etching process, the pattern formed by the above-mentioned photosensitive resin layer by the above-mentioned development process is used as an etching resist, and the etching process of the above-mentioned conductive layer is performed. As the etching method, the method described in paragraphs 0209 to 0210 of JP 2017-120435, the method described in paragraphs 0048 to 0054 of JP 2010-152155, etc., and well-known electrical methods can be applied. A method based on dry etching, such as slurry etching, etc., is a well-known method.

〔去除製程〕 本發明的電路配線的製造方法進行去除樹脂圖案之製程（以下，簡稱為“去除製程”。）為較佳。 去除製程並無特別限制，能夠根據需要進行，在蝕刻製程之後進行為較佳。 作為去除殘留感光性樹脂層之方法，並無特別限制，能夠舉出藉由藥品處理去除之方法，能夠特佳地舉出使用去除液。 作為感光性樹脂層的去除方法，可以舉出在較佳為30℃～80℃、更佳為50℃～80℃下，向攪拌過程中之去除液中浸漬1分鐘～30分鐘具有感光性樹脂層等之基板之方法。〔Removal process〕 The manufacturing method of the circuit wiring of the present invention preferably performs a process of removing the resin pattern (hereinafter, simply referred to as "removal process"). The removal process is not particularly limited, and can be performed as needed, and it is preferable to perform it after the etching process. The method of removing the remaining photosensitive resin layer is not particularly limited, and a method of removing by chemical treatment can be mentioned, and the use of a removing liquid can be particularly mentioned. As a method of removing the photosensitive resin layer, immersion in the removal solution during stirring for 1 minute to 30 minutes at preferably 30°C to 80°C, more preferably 50°C to 80°C, has a photosensitive resin Layer and other substrate methods.

作為去除液，例如，可以舉出將氫氧化鈉、氫氧化鉀等無機鹼成分或第一級胺化合物、第二級胺化合物、第三級胺化合物、第四級銨鹽化合物等有機鹼成分溶解於水、二甲基亞碸、N-甲基吡咯啶酮或者該等混合溶液而得之去除液。 又，亦可以使用去除液並利用噴塗法、噴淋法、覆液法等進行去除。As the removal liquid, for example, inorganic alkali components such as sodium hydroxide and potassium hydroxide, or organic alkali components such as primary amine compounds, secondary amine compounds, tertiary amine compounds, and fourth-level ammonium salt compounds can be used. Dissolved in water, dimethyl sulfide, N-methylpyrrolidone or these mixed solutions and get the removal liquid. In addition, it is also possible to use a removing liquid to remove by spraying method, spraying method, liquid coating method, or the like.

〔其他製程〕 本發明的電路配線的製造方法可以包括除了上述以外之任意製程（其他製程）。例如，可以舉出國際公開第2019/022089號公報的0172段中記載之降低可見光反射率之製程、國際公開第2019/022089號公報的0172段中記載之在絕緣膜上形成新的導電層之製程等，但該等製程不受限制。 又，作為本發明中的曝光製程、顯影製程及其他製程的例子，在本發明中還能夠較佳地使用日本特開2006-023696號公報的0035段～0051段中記載之方法。〔Other processes〕 The manufacturing method of the circuit wiring of the present invention may include any process (other processes) other than the above. For example, the process of reducing visible light reflectance described in paragraph 0172 of International Publication No. 2019/022089, and the process of forming a new conductive layer on an insulating film described in paragraph 0172 of International Publication No. 2019/022089 Processes, etc., but these processes are not restricted. Furthermore, as examples of the exposure process, the development process, and other processes in the present invention, the method described in paragraphs 0035 to 0051 of JP 2006-023696 can also be preferably used in the present invention.

藉由本發明的電路配線的製造方法製造之電路配線能夠較佳地使用於各種裝置中。作為具備藉由本發明之電路配線的製造方法製造之電路配線之裝置，例如，可以舉出輸入裝置等，觸控面板為較佳，電容型觸控面板為更佳。又，上述輸入裝置能夠應用於有機EL顯示裝置、液晶顯示裝置等顯示裝置中。The circuit wiring manufactured by the circuit wiring manufacturing method of the present invention can be preferably used in various devices. As a device equipped with the circuit wiring manufactured by the manufacturing method of the circuit wiring of this invention, an input device etc. are mentioned, for example, a touch panel is preferable, and a capacitive touch panel is more preferable. In addition, the aforementioned input device can be applied to display devices such as organic EL display devices and liquid crystal display devices.

[觸控面板的製造方法] 本發明的觸控面板的製造方法，其係使用上述本發明的感光性轉印構件，並以卷對卷方式製作觸控面板，前述觸控面板的製造方法依序具備：從感光性轉印構件剝離覆蓋膜之剝離製程（覆蓋膜剝離製程）；貼合製程，其係使剝離了覆蓋膜之感光性轉印構件中的感光性樹脂層與具有導電層之基板接觸以進行貼合；曝光製程，其係對感光性樹脂層進行圖案曝光；顯影製程，其係對經曝光之感光性樹脂層進行顯影而形成樹脂圖案；及對位於未配置有樹脂圖案之區域的導電層進行蝕刻處理之製程，在貼合製程與曝光製程之間，或者曝光製程與顯影製程之間，具備從感光性轉印構件同時剝離偽支撐體和熱塑性樹脂層之製程（同時剝離製程）。[Manufacturing method of touch panel] The manufacturing method of the touch panel of the present invention uses the above-mentioned photosensitive transfer member of the present invention to manufacture a touch panel in a roll-to-roll manner. The manufacturing method of the touch panel includes: The peeling process of the component peeling the cover film (covering film peeling process); the laminating process, which makes the photosensitive resin layer in the photosensitive transfer member from which the cover film is peeled contact with the substrate with the conductive layer for bonding; exposure The process is to expose the photosensitive resin layer to patterns; the development process is to develop the exposed photosensitive resin layer to form a resin pattern; and to etch the conductive layer in the area where the resin pattern is not arranged In the process, between the bonding process and the exposure process, or between the exposure process and the development process, there is a process of simultaneously peeling the dummy support and the thermoplastic resin layer from the photosensitive transfer member (simultaneous peeling process).

關於本發明的觸控面板的製造方法中的各製程的具體態樣及進行各製程之順序等的實施形態，如上述“電路配線的製造方法”的項中的說明，較佳態樣亦相同。 本發明的觸控面板的製造方法除了上述以外，還能夠參閱公知的觸控面板的製造方法。 又，本發明的觸控面板的製造方法可以包括除了上述以外的任意製程（其他製程）。Regarding the specific aspects of each process in the manufacturing method of the touch panel of the present invention and the order of performing each process, the preferred aspects are also the same as described in the item of "Method of Manufacturing Circuit Wiring". . The manufacturing method of the touch panel of this invention can refer to the manufacturing method of a well-known touch panel in addition to the above. In addition, the manufacturing method of the touch panel of the present invention may include any process (other processes) other than the above.

將本發明的觸控面板的製造方法中所使用之遮罩的圖案的一例示於圖2及圖3中。 在圖2中示出之圖案A及圖3中示出之圖案B中，SL及G係圖像部（開口部），DL係虛擬地示出校準框者。在本發明之觸控面板的製造方法中，例如，能夠藉由隔著具有圖2中示出之圖案A之遮罩對感光性樹脂層進行曝光來製造形成有具有對應於SL及G的圖案A之電路配線之觸控面板。An example of the pattern of the mask used in the manufacturing method of the touch panel of the present invention is shown in FIGS. 2 and 3. In the pattern A shown in FIG. 2 and the pattern B shown in FIG. 3, SL and G are image portions (opening portions), and DL is a virtual display of the calibration frame. In the manufacturing method of the touch panel of the present invention, for example, the photosensitive resin layer can be formed by exposing the photosensitive resin layer through a mask having the pattern A shown in FIG. 2 to have patterns corresponding to SL and G. A touch panel for circuit wiring.

本發明之觸控面板係至少具有藉由本發明的電路配線的製造方法製造之電路配線之觸控面板。 又，本發明之觸控面板至少具有透明基板、電極、絕緣層或保護層為較佳。 又，作為本發明之觸控面板中的檢測方法，可以為電阻膜方式、靜電容方式、超音波方式、電磁感應方式及光學方式等公知方式中的任一種。其中，靜電容方式為較佳。 作為觸控面板型，能夠舉出所謂的內嵌型（例如，日本特表2012-517051號公報的圖5、圖6、圖7、圖8中記載者）、所謂的上嵌型（例如，日本特開2013-168125號公報的圖19中記載者，日本特開2012-089102號公報的圖1或圖5中記載者）、OGS（One Glass Solution）型、TOL（Touch-on-Lens）型（例如，日本特開2013-054727號公報的圖2中記載者）、其他結構（例如，日本特開2013-164871號公報的圖6中記載者）、各種外嵌型（所謂的GG、G1/G2、GFF、GF2、GF1、G1F等）等。 作為本發明之觸控面板，例如，可以舉出日本特開2017-120345號公報的0229段中記載者。 [實施例]The touch panel of the present invention is a touch panel having at least the circuit wiring manufactured by the method of manufacturing the circuit wiring of the present invention. Furthermore, the touch panel of the present invention preferably has at least a transparent substrate, an electrode, an insulating layer or a protective layer. In addition, as the detection method in the touch panel of the present invention, any of known methods such as a resistive film method, an electrostatic capacitance method, an ultrasonic method, an electromagnetic induction method, and an optical method may be used. Among them, the electrostatic capacitance method is preferred. As the touch panel type, a so-called in-cell type (for example, those described in Figures 5, 6, 7, and 8 of JP 2012-517051 A), and a so-called on-cell type (for example, It is described in Figure 19 of JP 2013-168125 A, and is described in Figure 1 or Figure 5 of JP 2012-089102 A), OGS (One Glass Solution) type, TOL (Touch-on-Lens) Type (for example, the one described in Figure 2 of JP 2013-054727 A), other structures (for example, the one described in Figure 6 of JP 2013-164871 A), various external embedded types (so-called GG, G1/G2, GFF, GF2, GF1, G1F, etc.) etc. As the touch panel of the present invention, for example, the one described in paragraph 0229 of JP 2017-120345 A can be cited. [Example]

以下，舉出實施例對本發明進行進一步詳細的說明。以下實施例中所示之材料、使用量、比例、處理內容、處理順序等只要不脫離本發明的宗旨，則能夠適當地進行變更。因此，本發明的範圍不應藉由以下所示之實施例進行限定性解釋。 另外，以下，只要沒有特別說明，則“%”及“份”為質量基準。Hereinafter, the present invention will be described in further detail with examples. The materials, usage amount, ratio, processing content, processing sequence, etc. shown in the following examples can be appropriately changed as long as they do not deviate from the spirit of the present invention. Therefore, the scope of the present invention should not be limitedly interpreted by the examples shown below. In addition, in the following, unless otherwise specified, "%" and "parts" are mass standards.

〔聚合物A-1的合成〕 向三口燒瓶中加入PGMEA（116.5份），並在氮氣氛下升溫至90℃。將加入了St（52.0份）、MMA（19.0份）、MAA（29.0份）、V-601（4.0份）及PGMEA（116.5份）之溶液經2小時滴加到維持在90℃±2℃之三口燒瓶溶液中。結束滴加之後，藉由在90℃±2℃下攪拌2小時而獲得了聚合物A-1（固體成分濃度30.0%）。 另外，上述合成例中的縮寫分別表示以下化合物。 St：苯乙烯（FUJIFILM Wako Pure Chemical Corporation製造） MAA：甲基丙烯酸（FUJIFILM Wako Pure Chemical Corporation製造） MMA：甲基丙烯酸甲酯（FUJIFILM Wako Pure Chemical Corporation製造） PGMEA：丙二醇單甲醚乙酸酯（SHOWA DENKO K.K.製造） MEK：甲乙酮（SANKYO CHEMICAL Co., Ltd.製造） V-601：二甲基-2,2’-偶氮雙（2-甲基丙酸酯）（FUJIFILM Wako Pure Chemical Corporation製造）[Synthesis of polymer A-1] PGMEA (116.5 parts) was added to the three-necked flask, and the temperature was raised to 90°C in a nitrogen atmosphere. The solution containing St (52.0 parts), MMA (19.0 parts), MAA (29.0 parts), V-601 (4.0 parts) and PGMEA (116.5 parts) was added dropwise over 2 hours until the temperature was maintained at 90℃±2℃. Three-necked flask solution. After the dripping was completed, the polymer A-1 (solid content concentration 30.0%) was obtained by stirring at 90°C±2°C for 2 hours. In addition, the abbreviations in the above synthesis examples indicate the following compounds, respectively. St: Styrene (manufactured by FUJIFILM Wako Pure Chemical Corporation) MAA: Methacrylic acid (manufactured by FUJIFILM Wako Pure Chemical Corporation) MMA: Methyl methacrylate (manufactured by FUJIFILM Wako Pure Chemical Corporation) PGMEA: Propylene glycol monomethyl ether acetate (manufactured by SHOWA DENKO K.K.) MEK: Methyl ethyl ketone (manufactured by SANKYO CHEMICAL Co., Ltd.) V-601: Dimethyl-2,2'-azobis(2-methylpropionate) (manufactured by FUJIFILM Wako Pure Chemical Corporation)

〔感光性樹脂組成物1的製備〕 混合以下成分並製備了感光性樹脂組成物1。另外，各成分的量的單位為質量份。 聚合物A-1（固體成分濃度30.0%）：21.87份 D-2（ARONIXM270（TOAGOSEI CO.,LTD.製造））：0.51份 D-1（NK EsterBPE-500（Shin Nakamura Chemical Industry Co.,LTD.製造））：4.85份 C-2（B-CIM，Hampford Research Inc.製造）：0.89份 C-3（光自由基聚合起始劑（敏化劑），4,4’-雙（二乙胺基）二苯甲酮，Tokyo Chemical Industry Co., Ltd.製造）：0.05份 啡噻口井（FUJIFILM Wako Pure Chemical Corporation製造）：0.025份 1-苯基-3-吡唑烷酮（FUJIFILM Wako Pure Chemical Corporation製造）：0.001份 B-2（LCV，無色水晶紫，YAMADA CHEMICAL CO., LTD.製造）：0.053份 E-1（Megaface F552（DIC CORPORATION製造））：0.02份 甲乙酮（MEK，SANKYO CHEMICAL Co., Ltd.製造）：30.87份 丙二醇單甲醚乙酸酯（PGMEA，SHOWA DENKO K.K.製造）：33.92份 四氫呋喃（THF，Mitsubishi Chemical Corporation製造）：6.93份[Preparation of photosensitive resin composition 1] The following components were mixed and photosensitive resin composition 1 was prepared. In addition, the unit of the amount of each component is part by mass. Polymer A-1 (solid content 30.0%): 21.87 parts D-2 (ARONIXM270 (manufactured by TOAGOSEI CO., LTD.)): 0.51 part D-1 (NK EsterBPE-500 (manufactured by Shin Nakamura Chemical Industry Co., LTD.)): 4.85 parts C-2 (B-CIM, manufactured by Hampford Research Inc.): 0.89 parts C-3 (Photo-radical polymerization initiator (sensitizer), 4,4'-bis(diethylamino)benzophenone, manufactured by Tokyo Chemical Industry Co., Ltd.): 0.05 part Phantasy Koujing (manufactured by FUJIFILM Wako Pure Chemical Corporation): 0.025 parts 1-Phenyl-3-pyrazolidinone (manufactured by FUJIFILM Wako Pure Chemical Corporation): 0.001 parts B-2 (LCV, colorless crystal purple, manufactured by YAMADA CHEMICAL CO., LTD.): 0.053 copies E-1 (Megaface F552 (manufactured by DIC CORPORATION)): 0.02 parts Methyl ethyl ketone (MEK, manufactured by SANKYO CHEMICAL Co., Ltd.): 30.87 parts Propylene glycol monomethyl ether acetate (PGMEA, manufactured by SHOWA DENKO K.K.): 33.92 parts Tetrahydrofuran (THF, manufactured by Mitsubishi Chemical Corporation): 6.93 parts

[實施例1] 將厚度為16μm的PET薄膜（16KS40，TORAY INDUSTRIES, INC.製造）用作偽支撐體，在該偽支撐體上塗佈由下述配方H1構成之塗佈液，並使其乾燥，並設為乾燥膜厚為5μm的熱塑性樹脂層。 接著，在上述熱塑性樹脂層上，使用狹縫狀噴嘴來塗佈感光性樹脂組成物1，並使其經40秒鐘通過80℃的乾燥區域，形成了厚度為3μm的感光性樹脂層。 接著，在上述感光性樹脂層上，作為覆蓋膜而層壓厚度為16μm的PET薄膜（16KS40，TORAY INDUSTRIES, INC.製造）以製作感光性轉印構件，進行捲繞使其成為輥形態。 ＜配方H1＞ 乙烯醋酸乙烯酯共聚合物（Evaflex P1007，DOW-MITSUI POLYCHEMICALS CO.,LTD.製造）：70g 甲苯：1000g[Example 1] A PET film (16KS40, manufactured by TORAY INDUSTRIES, INC.) with a thickness of 16μm was used as a pseudo support, and a coating solution composed of the following formula H1 was coated on the pseudo support, dried, and set to dry A thermoplastic resin layer with a film thickness of 5 μm. Next, on the thermoplastic resin layer, the photosensitive resin composition 1 was applied using a slit nozzle and passed through a drying zone at 80° C. for 40 seconds to form a photosensitive resin layer with a thickness of 3 μm. Next, a PET film (16KS40, manufactured by TORAY INDUSTRIES, INC.) with a thickness of 16 μm was laminated as a cover film on the above-mentioned photosensitive resin layer to produce a photosensitive transfer member, which was wound into a roll form. ＜Formulation H1＞ Ethylene vinyl acetate copolymer (Evaflex P1007, manufactured by DOW-MITSUI POLYCHEMICALS CO.,LTD.): 70g Toluene: 1000g

[實施例2] 使用高頻振盪器，在100%的輸出電壓且250W的輸出下，用直徑為1.2mm的絲電極以電極長度為240mm、工作電極間距為1.5mm的條件對厚度為16μm的PET薄膜（16KS40、TORAY INDUSTRIES, INC.製造）進行3秒鐘的電暈放電處理，並進行表面改質，將其用作偽支撐體。 在偽支撐體上，藉由熔融擠出法形成了由乙烯醋酸乙烯酯共聚合物（Evaflex P1007，DOW-MITSUI POLYCHEMICALS CO.,LTD.製造）構成之厚度為5μm的熱塑性樹脂層。 接著，關於感光性樹脂層及覆蓋膜的形成，以與實施例1相同的方法進行，製作感光性轉印構件，進行捲繞使其成為輥形態。[Example 2] Using a high-frequency oscillator, at 100% output voltage and 250W output, using a wire electrode with a diameter of 1.2mm, an electrode length of 240mm and a working electrode spacing of 1.5mm were used to apply a PET film with a thickness of 16μm (16KS40, 16KS40, TORAY INDUSTRIES, INC.) is subjected to corona discharge treatment for 3 seconds, and the surface is modified to use it as a pseudo support. On the pseudo support, a thermoplastic resin layer with a thickness of 5 μm composed of ethylene vinyl acetate copolymer (Evaflex P1007, manufactured by DOW-MITSUI POLYCHEMICALS CO., LTD.) was formed by melt extrusion. Next, the formation of the photosensitive resin layer and the cover film was carried out in the same manner as in Example 1, and a photosensitive transfer member was produced, which was wound into a roll form.

[實施例3] 將厚度為16μm的PET薄膜（16KS40，TORAY INDUSTRIES, INC.製作）用作偽支撐體，在該偽支撐體上，藉由熔融擠出法設置了由甲基丙烯酸乙烯酯共聚物（Nukurel 4214C，DOW-MITSUI POLYCHEMICALS CO.,LTD.製造）構成之厚度為5μm的熱塑性樹脂層。 接著，關於感光性樹脂層及覆蓋膜的形成，以與實施例1相同的方法進行，製作感光性轉印構件，進行捲繞使其成為輥形態。[Example 3] A PET film with a thickness of 16μm (16KS40, manufactured by TORAY INDUSTRIES, INC.) was used as a pseudo support. On the pseudo support, a vinyl methacrylate copolymer (Nukurel 4214C, DOW -Made by Mitsui Polychemicals Co., Ltd.) composed of a thermoplastic resin layer with a thickness of 5μm. Next, the formation of the photosensitive resin layer and the cover film was carried out in the same manner as in Example 1, and a photosensitive transfer member was produced, which was wound into a roll form.

[實施例4] 在實施了與實施例2相同之表面處理之偽支撐體上，藉由熔融擠出法，設置了由聚乙烯系化合物（Kernel KF380，Japan polyethylene Corporation製造）構成之厚度為5μm的熱塑性樹脂層。 接著，關於感光性樹脂層及覆蓋膜的形成，以與實施例1相同的方法進行，製作感光性轉印構件，進行捲繞使其成為輥形態。[Example 4] On the pseudo support body subjected to the same surface treatment as in Example 2, a thermoplastic resin layer composed of a polyethylene compound (Kernel KF380, manufactured by Japan Polyethylene Corporation) and having a thickness of 5 μm was provided by a melt extrusion method. Next, the formation of the photosensitive resin layer and the cover film was carried out in the same manner as in Example 1, and a photosensitive transfer member was produced, which was wound into a roll form.

[實施例5] 除了將熱塑性樹脂層的厚度設為2μm以外，以與實施例1相同的方法製作感光性轉印構件，進行捲繞使其成為輥形態。[Example 5] Except that the thickness of the thermoplastic resin layer was set to 2 μm, a photosensitive transfer member was produced in the same manner as in Example 1, and was wound into a roll form.

[實施例6] 除了將熱塑性樹脂層的厚度設為10μm以外，以與實施例2相同的方法製作了感光性轉印構件，進行捲繞使其成為輥形態。[Example 6] Except that the thickness of the thermoplastic resin layer was 10 μm, a photosensitive transfer member was produced in the same manner as in Example 2, and was wound into a roll form.

[實施例7] 除了將熱塑性樹脂層的厚度設為20μm以外，以與實施例2相同的方法製作感光性轉印構件，進行捲繞使其成為輥形態。[Example 7] Except that the thickness of the thermoplastic resin layer was set to 20 μm, a photosensitive transfer member was produced in the same manner as in Example 2, and was wound into a roll form.

[實施例8] 在實施了與實施例2相同的表面處理之偽支撐體上，藉由熔融擠出法設置了由乙烯醋酸乙烯酯共聚合物（Evaflex EV550，DOW-MITSUI POLYCHEMICALS CO.,LTD.製造）構成之厚度為5μm的熱塑性樹脂層。 接著，關於感光性樹脂層及覆蓋膜的形成，以與實施例1相同的方法進行，製作感光性轉印構件，進行捲繞使其成為輥形態。[Example 8] On the pseudo support body subjected to the same surface treatment as in Example 2, an ethylene vinyl acetate copolymer (Evaflex EV550, manufactured by DOW-MITSUI POLYCHEMICALS CO., LTD.) was placed by melt extrusion. A thermoplastic resin layer with a thickness of 5 μm. Next, the formation of the photosensitive resin layer and the cover film was carried out in the same manner as in Example 1, and a photosensitive transfer member was produced, which was wound into a roll form.

[實施例9] 在實施了與實施例2相同的表面處理之偽支撐體上，藉由熔融擠出法設置了由乙烯醋酸乙烯酯共聚合物（Evaflex EV450，DOW-MITSUI POLYCHEMICALS CO.,LTD.製造）構成之厚度為5μm的熱塑性樹脂層。 接著，關於感光性樹脂層及覆蓋膜的形成，以與實施例1相同的方法進行，製作感光性轉印構件，進行捲繞使其成為輥形態。[Example 9] On the pseudo support body subjected to the same surface treatment as in Example 2, an ethylene vinyl acetate copolymer (Evaflex EV450, manufactured by DOW-MITSUI POLYCHEMICALS CO., LTD.) was placed by the melt extrusion method. A thermoplastic resin layer with a thickness of 5 μm. Next, the formation of the photosensitive resin layer and the cover film was carried out in the same manner as in Example 1, and a photosensitive transfer member was produced, which was wound into a roll form.

[實施例10] 將厚度為16μm的PET薄膜（16KS40，TORAY INDUSTRIES, INC.製造）用作覆蓋膜，在該覆蓋膜上，使用狹縫狀噴嘴塗佈感光性樹脂組成物1，並使其經40秒鐘通過80℃的乾燥區域，形成厚度為3μm的感光性樹脂層，並製作了附感光性樹脂層之覆蓋膜。 接著，以與實施例2相同的方法，在實施了表面處理之偽支撐體上，藉由熔融擠出法形成由乙烯醋酸乙烯酯共聚合物（Evaflex P1007，DOW-MITSUI POLYCHEMICALS CO.,LTD.製造）構成之厚度為5μm的熱塑性樹脂層，並製作了附熱塑性樹脂層之偽支撐體。 接著，藉由以感光性樹脂層與熱塑性樹脂層接觸之方式層壓附感光性樹脂層之覆蓋膜和附熱塑性樹脂層之偽支撐體，從而製作感光性轉印構件，進行捲繞使其成為輥形態。[Example 10] A PET film (16KS40, manufactured by TORAY INDUSTRIES, INC.) with a thickness of 16 μm was used as a cover film. On the cover film, the photosensitive resin composition 1 was applied using a slit nozzle and passed through it for 40 seconds In a drying area at 80°C, a photosensitive resin layer with a thickness of 3 μm was formed, and a cover film with a photosensitive resin layer was produced. Next, in the same manner as in Example 2, on the pseudo support that has been surface-treated, an ethylene vinyl acetate copolymer (Evaflex P1007, DOW-MITSUI POLYCHEMICALS CO., LTD.) is formed by a melt extrusion method. Manufacture) a thermoplastic resin layer with a thickness of 5μm, and a pseudo support with a thermoplastic resin layer was manufactured. Next, by laminating the cover film with the photosensitive resin layer and the pseudo support with the thermoplastic resin layer in such a way that the photosensitive resin layer and the thermoplastic resin layer are in contact with each other, a photosensitive transfer member is produced, and it is wound into Roll form.

[實施例11] 使用高頻振盪器，在100%的輸出電壓且250W的輸出下，用直徑為1.2mm的絲電極以電極長度為240mm、工作電極間距為1.5mm的條件對厚度為16μm的PET薄膜（霧度：0.20%，FUJIFILM Corporation製造）進行3秒鐘的電暈放電處理，並進行表面改質，將其用作偽支撐體。 除了使用上述偽支撐體以外，以與實施例2相同之方法製作感光性轉印構件，進行捲繞使其成為輥形態。[Example 11] Using a high-frequency oscillator, at 100% output voltage and 250W output, a wire electrode with a diameter of 1.2mm is used for a PET film with a thickness of 16μm (haze) under the conditions of an electrode length of 240mm and a working electrode spacing of 1.5mm. : 0.20%, manufactured by FUJIFILM Corporation) After corona discharge treatment for 3 seconds and surface modification, it is used as a pseudo support. Except for using the above-mentioned dummy support, a photosensitive transfer member was produced in the same manner as in Example 2, and was wound into a roll form.

[實施例12] 除了將熱塑性樹脂層的厚度設為0.8μm以外，以與實施例1相同的方法製作感光性轉印構件，進行捲繞使其成為輥形態。[Example 12] Except that the thickness of the thermoplastic resin layer was 0.8 μm, a photosensitive transfer member was produced in the same manner as in Example 1, and wound into a roll form.

[實施例13] 使用高頻振盪器，在100%的輸出電壓且250W的輸出下，用直徑為1.2mm的絲電極以電極長度為240mm、工作電極間距為1.5mm的條件對厚度為16μm的PET薄膜（霧度：0.80%，FUJIFILM Corporation製造）進行3秒鐘的電暈放電處理，並進行表面改質，將其用作偽支撐體。 除了使用上述偽支撐體以外，以與實施例2相同之方法製作感光性轉印構件，進行捲繞使其成為輥形態。[Example 13] Using a high-frequency oscillator, at 100% output voltage and 250W output, a wire electrode with a diameter of 1.2mm is used for a PET film with a thickness of 16μm (haze) under the conditions of an electrode length of 240mm and a working electrode spacing of 1.5mm. : 0.80%, manufactured by FUJIFILM Corporation) After corona discharge treatment for 3 seconds and surface modification, it is used as a pseudo support. Except for using the above-mentioned dummy support, a photosensitive transfer member was produced in the same manner as in Example 2, and was wound into a roll form.

[比較例1] 在實施了與實施例2相同的表面處理之偽支撐體上，藉由熔融擠出法設置了由聚丙烯系聚合物（Wintech WFX4M，Japan Polypropylene Corporation製造）構成之厚度為5μm的熱塑性樹脂層。 接著，關於感光性樹脂層及覆蓋膜的形成，以與實施例1相同的方法進行，製作感光性轉印構件，進行捲繞使其成為輥形態。[Comparative Example 1] On the pseudo support having the same surface treatment as in Example 2, a thermoplastic resin layer composed of a polypropylene polymer (Wintech WFX4M, manufactured by Japan Polypropylene Corporation) and having a thickness of 5 μm was provided by a melt extrusion method. Next, the formation of the photosensitive resin layer and the cover film was carried out in the same manner as in Example 1, and a photosensitive transfer member was produced, which was wound into a roll form.

[比較例2] 在實施了與實施例2相同的表面處理之偽支撐體上，藉由熔融擠出法設置了由乙烯醋酸乙烯酯共聚合物（Evaflex EV150，DOW-MITSUI POLYCHEMICALS CO.,LTD.製造）構成之厚度為5μm的熱塑性樹脂層。 接著，關於感光性樹脂層及覆蓋膜的形成，以與實施例1相同的方法進行，製作感光性轉印構件，進行捲繞使其成為輥形態。[Comparative Example 2] On the pseudo support body subjected to the same surface treatment as in Example 2, an ethylene vinyl acetate copolymer (Evaflex EV150, manufactured by DOW-MITSUI POLYCHEMICALS CO., LTD.) was placed by the melt extrusion method. A thermoplastic resin layer with a thickness of 5 μm. Next, the formation of the photosensitive resin layer and the cover film was carried out in the same manner as in Example 1, and a photosensitive transfer member was produced, which was wound into a roll form.

[比較例3] 除了未設置熱塑性樹脂層以外，以與實施例1相同的方法製作感光性轉印構件，進行捲繞使其成為輥形態。[Comparative Example 3] Except that the thermoplastic resin layer was not provided, a photosensitive transfer member was produced in the same manner as in Example 1, and wound into a roll form.

〔剝離強度〕 對於在實施例1～13及比較例1～2中製作之感光性轉印構件，測量了偽支撐體、熱塑性樹脂層、感光性樹脂層及覆蓋膜的各層之間的剝離強度之結果，在實施例1～13及比較例1～2中均能夠確認到偽支撐體與熱塑性樹脂層之間的剝離強度最強，且感光性樹脂層與覆蓋膜之間的剝離強度最弱。 又，對於在未設置有熱塑性樹脂層之比較例3中製作之感光性轉印構件，測量偽支撐體、感光性樹脂層及覆蓋膜的各層之間的剝離強度之結果，能夠確認到偽支撐體與感光性樹脂層之間的剝離強度最強，感光性樹脂層與覆蓋膜之間的剝離強度最弱。〔Peel strength〕 For the photosensitive transfer members produced in Examples 1 to 13 and Comparative Examples 1 to 2, the peel strength between the pseudo support, the thermoplastic resin layer, the photosensitive resin layer, and the cover film was measured. The results showed that In all of Examples 1 to 13 and Comparative Examples 1 to 2, it was confirmed that the peel strength between the dummy support and the thermoplastic resin layer was the strongest, and the peel strength between the photosensitive resin layer and the cover film was the weakest. In addition, for the photosensitive transfer member produced in Comparative Example 3 not provided with a thermoplastic resin layer, the results of measuring the peeling strength between each layer of the pseudo support, the photosensitive resin layer, and the cover film, the pseudo support can be confirmed The peel strength between the body and the photosensitive resin layer is the strongest, and the peel strength between the photosensitive resin layer and the cover film is the weakest.

〔菲卡軟化點及拉伸彈性模數〕 關於所製作之感光性轉印構件所具有之熱塑性樹脂層，以上述方法測量了菲卡軟化點及拉伸彈性模數。將該等結果示於下述表1中。〔Fikka softening point and tensile elastic modulus〕 Regarding the thermoplastic resin layer of the produced photosensitive transfer member, the Ficat softening point and tensile modulus of elasticity were measured by the above-mentioned method. These results are shown in Table 1 below.

〔霧度〕 對於所製作之感光性轉印構件及對於偽支撐體及在偽支撐體上設置有熱塑性樹脂層之積層體，以上述方法測量了霧度。將結果示於下述表1中。〔Haze〕 With respect to the produced photosensitive transfer member, the dummy support and the laminate with the thermoplastic resin layer provided on the dummy support, the haze was measured by the above-mentioned method. The results are shown in Table 1 below.

〔層壓性〕 在解繞所製作之感光性轉印構件並剝離了覆蓋膜之後，在厚度為0.7mm的玻璃基板上，以感光性樹脂層接觸之方式以2m/min的速度且0.8Mpa的壓力對溫度為100℃的熱輥之間進行熱壓接。 接著，用光學顯微鏡觀察在玻璃基板與感光性樹脂層之間是否殘留氣泡，並由以下基準進行了評價。將結果示於下述表1中。 A：100mm2 面積內的氣泡數為0個 B：100mm2 面積內的氣泡數為1個以上且5個以下 C：100mm2 面積內的氣泡數為6個以上且10個以下 D：100mm2 面積內的氣泡數為11個以上且50個以下 E：100mm2 面積內的氣泡數為51個以上[Laminating] After unwinding the produced photosensitive transfer member and peeling off the cover film, on a glass substrate with a thickness of 0.7mm, the photosensitive resin layer is in contact with the photosensitive resin layer at a speed of 2m/min and 0.8Mpa The pressure of the temperature is 100 ℃ for thermo-compression bonding between the hot rollers. Next, whether or not air bubbles remained between the glass substrate and the photosensitive resin layer was observed with an optical microscope, and it was evaluated based on the following criteria. The results are shown in Table 1 below. A: The number of bubbles in an area of 100mm 2 is 0 B: The number of bubbles in an area of 100mm 2 is 1 or more and 5 or less C: The number of bubbles in an area of 100mm 2 is 6 or more and 10 or less D: 100mm 2 The number of bubbles in the area is 11 or more and 50 or less E: The number of bubbles in the area of 100mm 2 is 51 or more

〔黏連〕 在解繞所製作之感光性轉印構件並剝離了覆蓋膜之後，對厚度為100μm、寬度為500mm的PET基底以相對於支撐體以卷對卷方式在溫度為100℃的熱輥之間以2m/min的速度且0.8Mpa的壓力連續進行熱壓接，並在支撐體上，以積層於感光性樹脂層、熱塑性樹脂層及偽支撐體之形態捲繞成輥狀。 然後，一邊同時剝離偽支撐體和熱塑性樹脂層，一邊以2m/min的速度進行了輸送。此時，以25N的捲繞張力將經剝離之偽支撐體和由熱塑性樹脂層構成之積層體捲繞成輥狀。在捲繞了100m之時刻的輥形態觀察是否黏連，並由以下基準進行了評價。將結果示於下述表1中。另外，發生黏連之情況下，發生褶皺、角捲邊等外觀異常。 A：外觀沒有任何問題 B：雖然觀察到程度上可允許之褶皺、角捲邊，但不影響輸送 C：發生褶皺、角捲邊且不能夠穩定地輸送〔Glue〕 After unwinding the produced photosensitive transfer member and peeling off the cover film, a PET substrate with a thickness of 100 μm and a width of 500 mm was applied to the support in a roll-to-roll manner between heated rollers at a temperature of 100°C. The thermocompression bonding is continuously performed at a speed of 2m/min and a pressure of 0.8Mpa, and the support is wound into a roll in the form of being laminated on the photosensitive resin layer, the thermoplastic resin layer and the pseudo support. Then, the dummy support and the thermoplastic resin layer were simultaneously peeled off while conveying at a speed of 2 m/min. At this time, the peeled dummy support and the laminate composed of the thermoplastic resin layer were wound into a roll with a winding tension of 25N. The roll shape at the time of winding for 100 m was observed for stickiness and evaluated based on the following criteria. The results are shown in Table 1 below. In addition, when adhesion occurs, appearance abnormalities such as wrinkles and corner curls may occur. A: There is no problem with the appearance B: Although permissible wrinkles and corner curling are observed to a certain extent, it does not affect the conveying C: Wrinkles, corner curling and inability to transport stably

〔圖案解析力〕 在厚度為0.7mm的玻璃板上，藉由蒸鍍法設置厚度為500nm的銅層，並準備了附銅層之玻璃基板。 解繞所製作之感光性轉印構件並剝離覆蓋膜之後，在輥溫度為100℃、線壓為0.8MPa、線速度為2.0m/min的層壓條件下，以銅層與感光性樹脂層接觸之方式積層於上述附銅層之玻璃基板上。 接著，使用具有線/空間=1/1的各種線寬圖案（2～20μm）之光罩，並藉由PET面進行80mJ/cm2 的曝光，然後，同時剝離去除偽支撐體和熱塑性樹脂層。 接著，使用液體溫度為25℃的1%碳酸鈉水溶液進行噴淋顯影，並實施水洗，在銅上形成了既定的圖案。 然後，用光學顯微鏡評價了空間開啟之最小線寬（使用遮罩尺寸數值）。將結果示於下述表1中。另外，關於比較例1及3，由於層壓性差且存在複數個氣泡，因此無法評價圖案解析力，在下述表1中，標記為“-”。[Pattern Resolution] On a glass plate with a thickness of 0.7 mm, a copper layer with a thickness of 500 nm was deposited by an evaporation method, and a glass substrate with a copper layer was prepared. After unwinding the produced photosensitive transfer member and peeling off the cover film, under the lamination conditions of a roll temperature of 100°C, a line pressure of 0.8 MPa, and a line speed of 2.0 m/min, the copper layer and the photosensitive resin layer The contact method is laminated on the above-mentioned glass substrate with copper layer. Next, use a mask with various line width patterns (2-20μm) with line/space = 1/1, and expose 80mJ/cm 2 through the PET surface, and then peel off the pseudo support and the thermoplastic resin layer at the same time . Next, a 1% sodium carbonate aqueous solution with a liquid temperature of 25° C. was used for spray development and washed with water to form a predetermined pattern on the copper. Then, an optical microscope was used to evaluate the minimum line width for space opening (using the mask size value). The results are shown in Table 1 below. In addition, in Comparative Examples 1 and 3, the pattern resolution cannot be evaluated due to poor laminating properties and the presence of a plurality of bubbles. In Table 1 below, they are marked as "-".

[表1]   偽支撐體 熱塑性樹脂層 霧度(%) 評價 膜厚 (μm) 樹脂 產品編號 菲卡 軟化點(℃) 拉伸 彈性模數(MPa) 膜厚(μm) 偽支撐體 積層體※ 層壓性 黏連 影像 解析度(μm) 實施例1 16 P1007 71 42 5 0.40 0.45 A B 4 實施例2 16 P1007 71 42 5 0.40 0.48 A B 4 實施例3 16 4214C 92 90 5 0.40 0.43 A A 4 實施例4 16 KF380 99 150 5 0.40 0.42 A A 4 實施例5 16 P1007 71 42 2 0.40 0.41 B B 3 實施例6 16 P1007 71 42 10 0.40 0.65 A B 8 實施例7 16 P1007 71 42 20 0.40 0.75 A B 15 實施例8 16 EV550 62 24 5 0.40 0.48 A B 4 實施例9 16 EV450 52 15 5 0.40 0.48 A B 4 實施例10 16 P1007 71 42 5 0.40 0.43 A B 4 實施例11 16 P1007 71 42 5 0.20 0.25 A B 3 實施例12 16 P1007 71 42 0.8 0.40 0.42 C B 3 實施例13 16 P1007 71 42 5 0.80 0.85 A B 9 比較例1 16 WFX4M 110 800 5 0.40 0.48 E A - 比較例2 16 EV150 32 5 5 0.40 0.43 A C 4 比較例3 16 - - - 無 0.40 - E A - ※積層體：由偽支撐體及熱塑性樹脂層構成之積層體[Table 1] Pseudo support Thermoplastic resin layer Haze (%) Evaluation Film thickness (μm) Resin product number Fica softening point (℃) Tensile modulus of elasticity (MPa) Film thickness (μm) Pseudo support Laminated body※ Lamination Adhesion Image resolution (μm) Example 1 16 P1007 71 42 5 0.40 0.45 A B 4 Example 2 16 P1007 71 42 5 0.40 0.48 A B 4 Example 3 16 4214C 92 90 5 0.40 0.43 A A 4 Example 4 16 KF380 99 150 5 0.40 0.42 A A 4 Example 5 16 P1007 71 42 2 0.40 0.41 B B 3 Example 6 16 P1007 71 42 10 0.40 0.65 A B 8 Example 7 16 P1007 71 42 20 0.40 0.75 A B 15 Example 8 16 EV550 62 twenty four 5 0.40 0.48 A B 4 Example 9 16 EV450 52 15 5 0.40 0.48 A B 4 Example 10 16 P1007 71 42 5 0.40 0.43 A B 4 Example 11 16 P1007 71 42 5 0.20 0.25 A B 3 Example 12 16 P1007 71 42 0.8 0.40 0.42 C B 3 Example 13 16 P1007 71 42 5 0.80 0.85 A B 9 Comparative example 1 16 WFX4M 110 800 5 0.40 0.48 E A - Comparative example 2 16 EV150 32 5 5 0.40 0.43 A C 4 Comparative example 3 16 - - - no 0.40 - E A - ※Laminated body: a laminated body composed of a pseudo support and a thermoplastic resin layer

從上述表1中示出之結果可知，在熱塑性樹脂層的拉伸彈性模數大於200Mpa之情況下，層壓性差（比較例1）。 又，可知在熱塑性樹脂層的拉伸彈性模數小於10Mpa之情況下，在剝離偽支撐體和熱塑性樹脂層時，發生黏連（比較例2）。 又，可知在未設置熱塑性樹脂層之情況下，層壓性差（比較例3）。From the results shown in Table 1 above, it can be seen that when the tensile elastic modulus of the thermoplastic resin layer is greater than 200 MPa, the laminate properties are poor (Comparative Example 1). It was also found that when the tensile elastic modulus of the thermoplastic resin layer was less than 10 MPa, blocking occurred when the pseudo support and the thermoplastic resin layer were peeled off (Comparative Example 2). In addition, it can be seen that when the thermoplastic resin layer is not provided, the laminate properties are poor (Comparative Example 3).

相對於此，可知當熱塑性樹脂層的菲卡軟化點為50～120℃，並且拉伸彈性模數為10～200Mpa時，層壓性優異且能夠抑制在剝離偽支撐體和熱塑性樹脂層時發生黏連（實施例1～13）。 尤其，從實施例1～4的對比可知，當熱塑性樹脂層的拉伸彈性模數為50～200Mpa時，能夠進一步抑制在剝離偽支撐體和熱塑性樹脂層時發生黏連。 又，從實施例1、2、5～7及12的對比可知，當熱塑性樹脂層的厚度大於2μm且小於20μm時，能夠兼顧較佳的層壓性及較佳的圖案解析力。In contrast, it can be seen that when the Ficatin softening point of the thermoplastic resin layer is 50 to 120°C and the tensile modulus of elasticity is 10 to 200Mpa, the laminating property is excellent and the occurrence of peeling of the pseudo support and the thermoplastic resin layer can be suppressed. Adhesion (Examples 1-13). In particular, it can be seen from the comparison of Examples 1 to 4 that when the tensile elastic modulus of the thermoplastic resin layer is 50 to 200 MPa, it is possible to further suppress the occurrence of blocking when the pseudo support and the thermoplastic resin layer are peeled off. In addition, from the comparison of Examples 1, 2, 5-7, and 12, it can be seen that when the thickness of the thermoplastic resin layer is greater than 2 μm and less than 20 μm, better lamination and better pattern resolution can be achieved.

（實施例101） 在100μm厚的PET基材上，藉由濺射ITO使其形成為150nm厚的膜以作為第2導電層，在其上利用真空蒸鍍法使銅形成為200nm厚的膜以作為第1導電層，並製作了電路形成用基板，進行捲繞使其成為輥形態。 接著，在解繞實施例3中製作之感光性轉印構件並剝離了覆蓋膜之後，在經解繞之電路形成用基板的銅層上，進行層壓以與感光性樹脂層接觸，暫且捲繞成輥狀。另外，在線壓0.6MPa、線速度3.6m/min及輥溫度100℃的條件下進行了層壓。 接著，在不剝離偽支撐體之情況下，使用設置有具有在一個方向上連結有導電層墊之結構之圖2中示出之圖案A之光罩進行接觸圖案曝光（第1曝光製程）並捲繞成輥狀。另外，關於圖2中示出之圖案A，如上所述，SL及G係開口部，DL係虛擬地示出校準框者。又，實線部設為70μm以下的細線。 然後，一邊同時剝離偽支撐體和熱塑性樹脂層，一邊進行使用了四甲基氫氧化銨（TMAH）水溶液2.38%之顯影（第1顯影製程），然後，進行水洗形成了具有第1圖案（圖案A的開口部區域的形狀的圖案）形狀之抗蝕劑圖像。最終將附抗蝕劑圖像之薄膜及剝離之附熱塑性樹脂之偽支撐體捲繞成輥狀。 接著，使用銅蝕刻液（Cu-02，KANTO CHEMICAL CO.,INC.製造）對銅層（第1導電層）進行蝕刻之後，使用ITO蝕刻液（ITO-02，KANTO CHEMICAL CO.,INC.製造）對ITO層（第2導電層）進行蝕刻，從而獲得了銅層（第1導電層）和ITO層（第2導電層）一同被第1圖案（圖案A的開口部區域的形狀的圖案）描繪之基板（第1蝕刻製程）。進一步使用剝離液（Kanto Chemical Co., Inc.製造之KP-301）剝離了殘留的抗蝕劑圖像。最終捲繞成輥狀。 接著，在解繞實施例3中製作之感光性轉印構件並剝離了覆蓋膜之後，進行了層壓。另外，在線壓0.6MPa、線速度3.6m/min及輥溫度100℃的條件下進行了層壓。 接著，在不剝離偽支撐體之情況下，以校準狀態使用設置有圖3中示出之圖案B之光罩進行接觸圖案曝光（第2曝光製程）並捲繞成輥狀。另外，關於圖3中示出之圖案B，如上所述，G係開口部，DL係虛擬地示出校準框者。 接著，同時剝離偽支撐體和熱塑性樹脂，並進行了使用了TMAH水溶液2.38%之顯影（第2顯影製程），然後，進行水洗而獲得了具有第2圖案（圖案A的開口部和圖案B的開口部重疊之部分的圖案）形狀之抗蝕劑圖像。 然後，使用Cu-02蝕刻銅層，並使用剝離液（KP-301，KANTO CHEMICAL CO.,INC.製造）剝離殘餘之抗蝕劑圖像，獲得了捲繞成輥狀之電路配線基板。 使用顯微鏡觀察所獲得之電路配線基板的電路之結果，並沒有剝離或缺失等且係高畫質的清晰圖案。(Example 101) On a 100μm thick PET substrate, a 150nm thick film was formed by sputtering ITO as the second conductive layer, and a 200nm thick film of copper was formed on it by vacuum evaporation as the first conductive layer Layer, and a circuit-forming board was produced, and it was wound into a roll shape. Next, the photosensitive transfer member produced in Example 3 was unwound and the cover film was peeled off, and then laminated on the copper layer of the unwound circuit-forming substrate so as to be in contact with the photosensitive resin layer, and temporarily rolled Wound into a roll. In addition, lamination was performed under the conditions of a line pressure of 0.6 MPa, a line speed of 3.6 m/min, and a roll temperature of 100°C. Next, without peeling off the dummy support, a photomask provided with the pattern A shown in FIG. 2 having a structure with a conductive layer pad connected in one direction was used to perform contact pattern exposure (first exposure process) and Wind up into a roll. Regarding the pattern A shown in FIG. 2, as described above, the SL and G are the openings, and the DL is the one that virtually shows the calibration frame. In addition, the solid line portion is a thin line of 70 μm or less. Then, while peeling off the dummy support and the thermoplastic resin layer at the same time, development using 2.38% tetramethylammonium hydroxide (TMAH) aqueous solution (first development process) was carried out, and then washed with water to form a first pattern (pattern Pattern of the shape of the opening area of A) Resist image of the shape. Finally, the film with the resist image and the peeled pseudo support with the thermoplastic resin are wound into a roll shape. Next, the copper layer (first conductive layer) was etched using a copper etching solution (Cu-02, manufactured by KANTO CHEMICAL CO., INC.), and then an ITO etching solution (ITO-02, manufactured by KANTO CHEMICAL CO., INC.) was used. ) The ITO layer (the second conductive layer) is etched to obtain the copper layer (the first conductive layer) and the ITO layer (the second conductive layer) together with the first pattern (the pattern of the shape of the opening area of the pattern A) The substrate for drawing (the first etching process). Furthermore, the residual resist image was peeled off using a stripping solution (KP-301 manufactured by Kanto Chemical Co., Inc.). Finally, it is wound into a roll. Next, after unwinding the photosensitive transfer member produced in Example 3 and peeling off the cover film, lamination was performed. In addition, lamination was performed under the conditions of a line pressure of 0.6 MPa, a line speed of 3.6 m/min, and a roll temperature of 100°C. Then, without peeling off the dummy support, the photomask provided with the pattern B shown in FIG. 3 was used in a calibrated state to perform contact pattern exposure (the second exposure process) and wound into a roll shape. In addition, with regard to the pattern B shown in FIG. 3, as described above, G is an opening portion, and DL is a virtual display of the calibration frame. Next, the dummy support and the thermoplastic resin were peeled off at the same time, and the 2.38% TMAH aqueous solution was used for development (the second development process), and then washed with water to obtain a second pattern (opening of pattern A and pattern B). Resist image in the shape of the pattern of the overlapped part of the opening. Then, the copper layer was etched with Cu-02, and the remaining resist image was peeled off with a stripping solution (KP-301, manufactured by KANTO CHEMICAL CO., INC.) to obtain a circuit wiring board wound in a roll shape. As a result of observing the circuit of the obtained circuit wiring board with a microscope, there was no peeling or missing, and it was a clear pattern with high image quality.

（保護膜圖案的形成1） 以下述方法在上述中獲得之電路配線基板上形成了保護膜。 首先，對於感光性樹脂層，使用由下述配方構成之感光性樹脂組成物，除了將膜厚設為8μm以外，以與實施例3相同的方法製作了感光性轉印構件。 接著，解繞所製作之感光性轉印構件並剝離覆蓋膜之後，以感光性樹脂層與電路圖案接觸之方式進行了層壓。另外，在線壓0.6MPa、線速度3.6m/min及輥溫度100℃的條件下進行了層壓。 接著，在不剝離偽支撐體之情況下，使用設置有局部未曝光部分（接觸孔）之光罩進行了接觸圖案曝光。 然後，同時剝離偽支撐體和熱塑性樹脂層，並進行使用了液體溫度為30℃的碳酸鈉水溶液1.0%之顯影，然後，進行水洗而獲得了保護膜圖案圖像。 然後，在140℃下實施60分鐘的熱處理，並使其熱硬化，在電路基板上形成了保護膜。 ＜感光性樹脂組成物＞ ·甲基丙烯酸/環己基丙烯酸酯/甲基丙烯酸甲酯共聚物（單體質量比=20/25/55，質量平均分子量8万）的41質量%乙基溶纖劑溶液：51.0質量份 ·二季戊四醇六丙烯酸酯：10.0質量份 ·氟系界面活性劑F176PF（DIC Corporation製造）：0.25質量份 ·維多利亞純藍BOH（HODOGAYA CHEMICAL CO.,LTD.製造）：0.225質量份 ·2,4-雙（三氯甲基）-6-（N,N-二乙氧基羰基甲胺基）-3-溴苯基]均三口井：0.45質量份 ·甲乙酮：13.0質量份(Formation of protective film pattern 1) A protective film was formed on the circuit wiring board obtained above in the following method. First, for the photosensitive resin layer, a photosensitive resin composition composed of the following formulation was used, and a photosensitive transfer member was produced in the same manner as in Example 3 except that the film thickness was set to 8 μm. Next, after unwinding the produced photosensitive transfer member and peeling off the cover film, it laminated so that the photosensitive resin layer contacted the circuit pattern. In addition, lamination was performed under the conditions of a line pressure of 0.6 MPa, a line speed of 3.6 m/min, and a roll temperature of 100°C. Next, without peeling off the dummy support, a photomask provided with a partially unexposed portion (contact hole) was used to perform contact pattern exposure. Then, the dummy support and the thermoplastic resin layer were peeled off at the same time, and development was performed using a 1.0% sodium carbonate aqueous solution with a liquid temperature of 30° C., and then washed with water to obtain a protective film pattern image. Then, heat treatment was performed at 140°C for 60 minutes and thermally cured to form a protective film on the circuit board. ＜Photosensitive resin composition＞ ·41% by mass ethyl cellosolve solution of methacrylic acid/cyclohexyl acrylate/methyl methacrylate copolymer (monomer mass ratio=20/25/55, mass average molecular weight 80,000): 51.0 parts by mass ·Dipentaerythritol hexaacrylate: 10.0 parts by mass ·Fluorine-based surfactant F176PF (manufactured by DIC Corporation): 0.25 parts by mass ·Victoria Pure Blue BOH (manufactured by HODOGAYA CHEMICAL CO.,LTD.): 0.225 parts by mass ·2,4-Bis(trichloromethyl)-6-(N,N-diethoxycarbonylmethylamino)-3-bromophenyl]Jianming three wells: 0.45 parts by mass ·Methyl ethyl ketone: 13.0 parts by mass

（保護膜圖案的形成2） 以下述方法在上述中獲得之電路配線基板上形成了保護膜。 首先，對於感光性樹脂層，使用由下述配方構成之非感光性樹脂組成物，除了將膜厚設為8μm以外，以與實施例3相同的方法製作了感光性轉印構件。 進一步切除不希望設置非感光性樹脂層之部分。 然後，以非感光性樹脂層與電路圖案接觸之方式實施對位，並進行了層壓。另外，在線壓0.6MPa、線速度3.6m/min及輥溫度100℃的條件下進行了層壓。 接著，同時剝離偽支撐體和熱塑性樹脂，獲得了保護膜圖案圖像。 進一步在140℃下，實施60分鐘的熱處理，並使其熱硬化，在電路基板上形成了保護膜。 ＜非感光性樹脂組成物＞ ·甲基丙烯酸/環己基丙烯酸酯/甲基丙烯酸甲酯共聚物（單體質量比=20/25/55，質量平均分子量8万）的41質量%乙基溶纖劑溶液：51.0質量份 ·二季戊四醇六丙烯酸酯：10.0質量份 ·氟系界面活性劑F176PF（DIC Corporation製造）：0.25質量份 ·維多利亞純藍BOH（HODOGAYA CHEMICAL CO.,LTD.製造）：0.225質量份 ·甲乙酮：13.0質量份(Formation of protective film pattern 2) A protective film was formed on the circuit wiring board obtained above in the following method. First, for the photosensitive resin layer, using a non-photosensitive resin composition composed of the following formulation, a photosensitive transfer member was produced in the same manner as in Example 3 except that the film thickness was set to 8 μm. Furthermore, the part where the non-photosensitive resin layer is not desired to be provided is cut off. Then, positioning was performed so that the non-photosensitive resin layer was in contact with the circuit pattern, and lamination was performed. In addition, lamination was performed under the conditions of a line pressure of 0.6 MPa, a line speed of 3.6 m/min, and a roll temperature of 100°C. Next, the dummy support and the thermoplastic resin were peeled off at the same time, and a protective film pattern image was obtained. Further, heat treatment was performed at 140°C for 60 minutes and thermally cured to form a protective film on the circuit board. ＜Non-photosensitive resin composition＞ ·41% by mass ethyl cellosolve solution of methacrylic acid/cyclohexyl acrylate/methyl methacrylate copolymer (monomer mass ratio=20/25/55, mass average molecular weight 80,000): 51.0 parts by mass ·Dipentaerythritol hexaacrylate: 10.0 parts by mass ·Fluorine-based surfactant F176PF (manufactured by DIC Corporation): 0.25 parts by mass ·Victoria Pure Blue BOH (manufactured by HODOGAYA CHEMICAL CO.,LTD.): 0.225 parts by mass ·Methyl ethyl ketone: 13.0 parts by mass

（圖像顯示裝置（觸控面板）的製作） 在以日本特開2009-047936號公報中記載之方法製造之液晶顯示元件上，貼合上述附保護膜之電路配線基板，並以公知的方法製作了作為構成要件而具備靜電電容型輸入裝置之圖像顯示裝置。(Production of image display device (touch panel)) On a liquid crystal display element manufactured by the method described in Japanese Patent Application Publication No. 2009-047936, the above-mentioned circuit wiring board with a protective film was attached to it, and a known method was used to fabricate a device with an electrostatic capacitance type input device as a constituent element. Image display device.

10:偽支撐體 12:熱塑性樹脂層 14:感光性樹脂層 16:覆蓋膜 100:感光性轉印構件 SL:非圖像部（曝光部） G:非圖像部（曝光部） DL:校準框10: Pseudo support 12: Thermoplastic resin layer 14: Photosensitive resin layer 16: Cover film 100: Photosensitive transfer member SL: Non-image part (exposure part) G: Non-image part (exposure part) DL: Calibration frame

圖1係示意地表示本發明的感光性轉印構件的實施形態的一例之剖面圖。 圖2係表示圖案A之概要圖。 圖3係表示圖案B之概要圖。Fig. 1 is a cross-sectional view schematically showing an example of the embodiment of the photosensitive transfer member of the present invention. Fig. 2 is a schematic diagram showing pattern A. Fig. 3 is a schematic diagram showing pattern B.

10:偽支撐體 10: Pseudo support

12:熱塑性樹脂層 12: Thermoplastic resin layer

14:感光性樹脂層 14: Photosensitive resin layer

16:覆蓋膜 16: Cover film

100:感光性轉印構件 100: Photosensitive transfer member

Claims (10)

一種感光性轉印構件，其係依序具有偽支撐體、熱塑性樹脂層、感光性樹脂層及覆蓋膜，前述感光性轉印構件中 前述熱塑性樹脂層的菲卡軟化點為50～120℃，並且拉伸彈性模數為10～200Mpa， 前述偽支撐體與前述熱塑性樹脂層之間的剝離強度大於前述熱塑性樹脂層與前述感光性樹脂層之間的剝離強度。A photosensitive transfer member, which has a pseudo support, a thermoplastic resin layer, a photosensitive resin layer, and a cover film in this order. The aforementioned photosensitive transfer member The Ficat softening point of the aforementioned thermoplastic resin layer is 50-120°C, and the tensile modulus of elasticity is 10-200Mpa, The peel strength between the pseudo support and the thermoplastic resin layer is greater than the peel strength between the thermoplastic resin layer and the photosensitive resin layer. 如請求項1所述之感光性轉印構件，其中 前述熱塑性樹脂層的厚度大於2μm且小於20μm。The photosensitive transfer member according to claim 1, wherein The thickness of the aforementioned thermoplastic resin layer is greater than 2 μm and less than 20 μm. 如請求項1或請求項2所述之感光性轉印構件，其中 前述偽支撐體的厚度為6～50μm。The photosensitive transfer member according to claim 1 or 2, wherein The thickness of the aforementioned pseudo support is 6-50 μm. 如請求項1或請求項2所述之感光性轉印構件，其中 前述偽支撐體的霧度為0.5%以下。The photosensitive transfer member according to claim 1 or 2, wherein The haze of the aforementioned pseudo support is 0.5% or less. 如請求項1或請求項2所述之感光性轉印構件，其中 前述偽支撐體與前述熱塑性樹脂層之間的積層體的霧度為0.9%以下。The photosensitive transfer member according to claim 1 or 2, wherein The haze of the laminate between the pseudo support and the thermoplastic resin layer is 0.9% or less. 如請求項1或請求項2所述之感光性轉印構件，其中 前述熱塑性樹脂層的拉伸彈性模數為50～200MPa。The photosensitive transfer member according to claim 1 or 2, wherein The tensile modulus of elasticity of the aforementioned thermoplastic resin layer is 50 to 200 MPa. 如請求項1或請求項2所述之感光性轉印構件，其中 前述偽支撐體、前述熱塑性樹脂層、前述感光性樹脂層及前述覆蓋膜的各層之間的剝離強度中，前述偽支撐體與前述熱塑性樹脂層之間的剝離強度最強，前述感光性樹脂層與前述覆蓋膜之間的剝離強度最弱。The photosensitive transfer member according to claim 1 or 2, wherein Among the peel strengths between the pseudo support, the thermoplastic resin layer, the photosensitive resin layer, and the cover film, the peel strength between the pseudo support and the thermoplastic resin layer is the strongest, and the photosensitive resin layer is The peel strength between the aforementioned cover films is the weakest. 一種樹脂圖案的製造方法，其係使用請求項1至請求項7之任一項所述之感光性轉印構件並以卷對卷方式製作樹脂圖案，前述樹脂圖案的製造方法依序具備： 剝離製程，其係從前述感光性轉印構件剝離覆蓋膜； 貼合製程，其係使剝離了覆蓋膜之感光性轉印構件中的感光性樹脂層與具有導電層之基板接觸以進行貼合； 曝光製程，其係對前述感光性樹脂層進行圖案曝光；及 顯影製程，其係對經曝光之前述感光性樹脂層進行顯影而形成樹脂圖案， 前述貼合製程與前述曝光製程之間，或者前述曝光製程與前述顯影製程之間，具備從感光性轉印構件同時剝離偽支撐體和熱塑性樹脂層之製程。A method for manufacturing a resin pattern, which uses the photosensitive transfer member described in any one of claim 1 to claim 7 to manufacture a resin pattern in a roll-to-roll manner, and the foregoing resin pattern manufacturing method sequentially includes: The peeling process, which is to peel the cover film from the aforementioned photosensitive transfer member; The laminating process involves contacting the photosensitive resin layer in the photosensitive transfer member with the cover film peeled off and the substrate with the conductive layer for bonding; Exposure process, which is pattern exposure of the aforementioned photosensitive resin layer; and The development process is to develop the exposed photosensitive resin layer to form a resin pattern, Between the bonding process and the exposure process, or between the exposure process and the development process, there is a process for simultaneously peeling the dummy support and the thermoplastic resin layer from the photosensitive transfer member. 一種電路配線的製造方法，其係使用請求項1至請求項7之任一項所述之感光性轉印構件並以卷對卷方式製作電路配線，前述電路配線的製造方法依序具備： 剝離製程，其係從前述感光性轉印構件剝離覆蓋膜； 貼合製程，其係使剝離了覆蓋膜之感光性轉印構件中的感光性樹脂層與具有導電層之基板接觸以進行貼合； 曝光製程，其係對前述感光性樹脂層進行圖案曝光； 顯影製程，其係對經曝光之前述感光性樹脂層進行顯影而形成樹脂圖案；及 對位於未配置有前述樹脂圖案之區域的前述導電層進行蝕刻處理之製程， 前述貼合製程與前述曝光製程之間，或者前述曝光製程與前述顯影製程之間，具備從感光性轉印構件同時剝離偽支撐體和熱塑性樹脂層之製程。A method of manufacturing circuit wiring, which uses the photosensitive transfer member described in any one of Claims 1 to 7 to manufacture circuit wiring in a roll-to-roll manner, and the above-mentioned circuit wiring manufacturing method sequentially includes: The peeling process, which is to peel the cover film from the aforementioned photosensitive transfer member; The laminating process involves contacting the photosensitive resin layer in the photosensitive transfer member with the cover film peeled off and the substrate with the conductive layer for bonding; The exposure process involves pattern exposure of the aforementioned photosensitive resin layer; A developing process, which develops the exposed photosensitive resin layer to form a resin pattern; and The process of etching the conductive layer in the area where the resin pattern is not arranged, Between the bonding process and the exposure process, or between the exposure process and the development process, there is a process for simultaneously peeling the dummy support and the thermoplastic resin layer from the photosensitive transfer member. 一種觸控面板的製造方法，其係使用請求項1至請求項7之任一項所述之感光性轉印構件並以卷對卷方式製作觸控面板，前述觸控面板的製造方法依序具備： 剝離製程，其係從前述感光性轉印構件剝離覆蓋膜； 貼合製程，其係使剝離了覆蓋膜之感光性轉印構件中的感光性樹脂層與具有導電層之基板接觸以進行貼合； 曝光製程，其係對前述感光性樹脂層進行圖案曝光； 顯影製程，其係對經曝光之前述感光性樹脂層進行顯影而形成樹脂圖案；及 對位於未配置有前述樹脂圖案之區域的前述導電層進行蝕刻處理之製程， 前述貼合製程與前述曝光製程之間，或者前述曝光製程與前述顯影製程之間，具備從感光性轉印構件同時剝離偽支撐體和熱塑性樹脂層之製程。A method for manufacturing a touch panel, which uses the photosensitive transfer member described in any one of claim 1 to claim 7 to manufacture a touch panel in a roll-to-roll manner, and the manufacturing method of the aforementioned touch panel is in order have: The peeling process, which is to peel the cover film from the aforementioned photosensitive transfer member; The laminating process involves contacting the photosensitive resin layer in the photosensitive transfer member with the cover film peeled off and the substrate with the conductive layer for bonding; The exposure process involves pattern exposure of the aforementioned photosensitive resin layer; A developing process, which develops the exposed photosensitive resin layer to form a resin pattern; and The process of etching the conductive layer in the area where the resin pattern is not arranged, Between the bonding process and the exposure process, or between the exposure process and the development process, there is a process for simultaneously peeling the dummy support and the thermoplastic resin layer from the photosensitive transfer member.
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