TW202106537A

TW202106537A - Miniaturized light-projecting device

Info

Publication number: TW202106537A
Application number: TW108128270A
Authority: TW
Inventors: 王正
Original assignee: 誠益光電科技股份有限公司
Priority date: 2019-08-08
Filing date: 2019-08-08
Publication date: 2021-02-16
Also published as: TWI694934B

Abstract

A miniaturized light-projecting device includes a heat-dissipating base, a circuit board, a low-beam module, a high-beam module, a light-distributing lens and an optical structure. The circuit board is connected to the heat-dissipating base and has a first installation surface and a second installation surface opposite to the first installation surface. The low-beam module corresponds in position to the high-beam module. The low-beam module includes a first light-emitting unit disposed on the first installation surface and the high-beam module includes a second light-emitting unit disposed on the second installation surface. The light-distributing lens corresponds in position to the low-beam module and the high-beam module and the optical structure is arranged between the heat-dissipating base and the light-distributing lens. Therefore, the device can meet the design requirements of miniaturization and high illumination efficiency.

Description

微型化光線投射裝置Miniaturized light projection device

本發明涉及一種光線投射裝置，特別是涉及一種應用於車燈照明的微型化光線投射裝置。The invention relates to a light projection device, in particular to a miniaturized light projection device applied to vehicle lamp lighting.

車燈相當於動力車輛(如機車或汽車)的眼睛，對行車安全來說十分重要。常見的車燈光源包括鹵素燈、鹵鎢燈及HID燈(高強度氣體放電燈，High Intensity Discharge Lamp)等。另外，發光二極體(light emitting diode，LED)具備體積小、發光效率高、低耗能及環保等優點，並且其能發出的光遍及可見光和不可見光，發光亮度亦可達到相當程度，因此使用發光二極體(LED)來取代鹵素燈、鹵鎢燈或HID燈作為車燈光源的技術越來越普遍。Car lights are equivalent to the eyes of powered vehicles (such as locomotives or automobiles) and are very important for driving safety. Common car light sources include halogen lamps, tungsten halogen lamps and HID lamps (High Intensity Discharge Lamp) and so on. In addition, the light emitting diode (LED) has the advantages of small size, high luminous efficiency, low energy consumption and environmental protection, and the light that it can emit covers visible and invisible light, and the luminous brightness can reach a considerable degree, so The use of light-emitting diodes (LED) to replace halogen lamps, halogen tungsten lamps or HID lamps as automotive light sources is becoming more and more common.

舉例來說，第TW M539600號專利案及第TW M536321號專利案均揭露一種燈芯裝置，其可以直接安裝在動力車輛的車燈上。第M539600號專利案所揭露的燈芯裝置是將一LED發光單元配置成直接朝向透鏡出光，以產生近光燈光型，並另外將一LED發光單元與車燈上的反射結構配合，以產生向外投射的光線，進而產生遠光燈光型，其中反射結構具有一類似拋物面的曲面。另外，第TWM536321號專利案所揭露的燈芯裝置包括兩個LED發光單元(即第一LED發光單元與第二LED發光單元)及一反射結構，第一LED發光單元所發出的光線可被反射結構反射而投射到透鏡上，以產生近光燈光型，第二LED發光單元所發出的光線可被反射結構反射而向外投射，以產生遠光燈光型，其中反射結構具有一類似拋物面的曲面。然而，上述裝置的光學設計無法充分利用LED發光單元所產生的光線，以致近光燈與遠光燈的光照強度有不足的疑慮。雖然可以通過增加LED發光單元的數量來提高光照強度，但是此種方式無法滿足微型化的設計要求。For example, Patent No. TW M539600 and Patent No. TW M536321 both disclose a wick device that can be directly installed on the headlight of a powered vehicle. In the wick device disclosed in Patent No. M539600, an LED light-emitting unit is configured to emit light directly toward the lens to produce a low-beam light type. In addition, an LED light-emitting unit is matched with a reflective structure on the car light to produce outward The projected light then produces a high beam light pattern, in which the reflective structure has a parabolic-like curved surface. In addition, the wick device disclosed in Patent No. TWM536321 includes two LED light-emitting units (ie, a first LED light-emitting unit and a second LED light-emitting unit) and a reflection structure. The light emitted by the first LED light-emitting unit can be reflected by the structure. It is reflected and projected onto the lens to produce a low beam light type. The light emitted by the second LED light-emitting unit can be reflected by the reflective structure and projected outward to produce a high beam light type, wherein the reflective structure has a parabolic-like curved surface. However, the optical design of the above-mentioned device cannot make full use of the light generated by the LED light-emitting unit, so that the light intensity of the low-beam and high-beam lamps is insufficient. Although the light intensity can be increased by increasing the number of LED light-emitting units, this method cannot meet the design requirements of miniaturization.

參見本案申請人所擁有的第TW I619624號專利案及第TW I650512號專利案，也有一些燈芯裝置是通過驅動機構來改變導光結構的位置，以切換近光燈和遠光燈。然而，這類裝置由於會使用到動件，整體結構較為複雜，不僅無法進一步縮小體積，裝置的成本亦會增加；此外，動件的使用會伴隨著一定的熱量產生，影響裝置的散熱效率。Refer to Patent No. TW I619624 and Patent No. TW I650512 owned by the applicant in this case. There are also some wick devices that use a driving mechanism to change the position of the light guide structure to switch between the low beam and the high beam. However, due to the use of moving parts in such devices, the overall structure is relatively complicated, which not only cannot further reduce the volume, but also increases the cost of the device; in addition, the use of moving parts will generate certain heat, which affects the heat dissipation efficiency of the device.

本發明所要解決的技術問題在於，針對現有技術的不足提供一種可提供高效率車燈照明的微型化光線投射裝置。The technical problem to be solved by the present invention is to provide a miniaturized light projection device that can provide high-efficiency vehicle lighting for the deficiencies of the prior art.

為了解決上述的技術問題，本發明所採用的其中一技術方案是，提供一種微型化光線投射裝置，其包括：一散熱基座、一電路基板、一近光燈模組、一遠光燈模組、一配光透鏡以及一光學結構。所述電路基板連接於所述散熱基座，且具有一第一安裝面以及一相對於所述第一安裝面的第二安裝面；所述近光燈模組包括一設置於所述第一安裝面上的第一發光單元以及一第一反射單元用以反射所述第一發光單元所發出的光線；所述遠光燈模組包括一設置於所述第二安裝面上的第二發光單元以及一第二反射單元用以反射所述第二發光單元所發出的光線，其中所述第二發光單元與所述第一發光單元的位置彼此錯開；所述配光透鏡的位置對應所述近光燈模組與所述遠光燈模組；所述光學結構設置於所述散熱基座與所述配光透鏡之間，用以使被所述第一反射單元與所述第二反射單元反射的光線投向所述配光透鏡。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide a miniaturized light projection device, which includes: a heat dissipation base, a circuit board, a low beam module, and a high beam module Group, a light distribution lens and an optical structure. The circuit board is connected to the heat dissipation base and has a first mounting surface and a second mounting surface opposite to the first mounting surface; the low beam module includes a The first light-emitting unit and a first reflecting unit on the mounting surface are used to reflect the light emitted by the first light-emitting unit; the high beam module includes a second light-emitting unit disposed on the second mounting surface Unit and a second reflecting unit for reflecting the light emitted by the second light-emitting unit, wherein the positions of the second light-emitting unit and the first light-emitting unit are staggered with each other; the position of the light distribution lens corresponds to the The low beam module and the high beam module; the optical structure is disposed between the heat dissipation base and the light distribution lens, so as to be reflected by the first reflecting unit and the second The light reflected by the unit is directed to the light distribution lens.

本發明的其中一有益效果在於，本發明所提供的微型化光線投射裝置，其能通過“電路基板具有一第一安裝面以及一相對於第一安裝面的第二安裝面，近光燈模組包括一設置於第一安裝面上的第一發光單元，遠光燈模組包括一設置於第二安裝面上的第二發光單元，配光透鏡的位置對應近光燈模組與遠光燈模組，光學結構設置於散熱基座與配光透鏡之間”的技術方案，以在完全不影響光照強度的情況下大幅縮減裝置的尺寸。One of the beneficial effects of the present invention is that the miniaturized light projection device provided by the present invention can pass through "the circuit board has a first mounting surface and a second mounting surface opposite to the first mounting surface, The group includes a first light-emitting unit arranged on the first mounting surface, the high beam module includes a second light-emitting unit arranged on the second mounting surface, and the position of the light distribution lens corresponds to the low beam module and the high beam The technical solution of "lamp module, optical structure arranged between the heat dissipation base and the light distribution lens" can greatly reduce the size of the device without affecting the light intensity at all.

為使能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與圖式，然而所提供的圖式僅用於提供參考與說明，並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.

以下是通過特定的具體實施例來說明本發明所公開有關“微型化光線投射裝置”的實施方式，本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用，本說明書中的各項細節也可基於不同觀點與應用，在不悖離本發明的構思下進行各種修改與變更。另外，本發明的附圖僅為簡單示意說明，並非依實際尺寸的描繪，事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容，但所公開的內容並非用以限制本發明的保護範圍。The following are specific examples to illustrate the implementation of the "miniature light projection device" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual size, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

應當可以理解的是，雖然本文中可能會使用到“第一”、“第二”、“第三”等術語來描述各種元件或者信號，但這些元件或者信號不應受這些術語的限制。這些術語主要是用以區分一元件與另一元件，或者一信號與另一信號。另外，本文中所使用的術語“或”，應視實際情況可能包括相關聯的列出項目中的任一個或者多個的組合。It should be understood that although terms such as "first", "second", and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are mainly used to distinguish one element from another, or one signal from another signal. In addition, the term "or" used in this document may include any one or a combination of more of the associated listed items depending on the actual situation.

參閱圖1至圖6所示，本發明一實施例提供一種微型化光線投射裝置U，其主要包括：一散熱基座1、一電路基板2、一近光燈模組3、一遠光燈模組4、一配光透鏡5及一光學結構6。本發明的微型化光線投射裝置U可應用於車燈照明，以提供符合歐洲車輛法規(ECE regulation)所規範的近光燈和遠光燈光型，但本發明不限於此。1 to 6, an embodiment of the present invention provides a miniaturized light projection device U, which mainly includes: a heat dissipation base 1, a circuit board 2, a low beam module 3, a high beam Module 4, a light distribution lens 5 and an optical structure 6. The miniaturized light projection device U of the present invention can be applied to vehicle lighting to provide low-beam and high-beam light types that comply with the ECE regulation, but the present invention is not limited to this.

下面將會先描述散熱基座1、電路基板2、近光燈模組3、遠光燈模組4、配光透鏡5與光學結構6等構成要件的相對關係，再進一步描述各個構成要件的實現方式，以及本發明的光學設計。The following will first describe the relative relationship of the components such as the heat dissipation base 1, the circuit board 2, the low beam module 3, the high beam module 4, the light distribution lens 5 and the optical structure 6, and then further describe the components of each component. Implementation, and optical design of the present invention.

電路基板2連接於散熱基座1，且具有一第一安裝面21及一相對於第一安裝面21的第二安裝面22；近光燈模組3與遠光燈模組4的位置相對應，其中近光燈模組3包括一設置於第一安裝面21上的第一發光單元31，遠光燈模組4包括一設置於第二安裝面22上的第二發光單元41，配光透鏡5的位置對應近光燈模組3與遠光燈模組4；光學結構6設置於散熱基座1與配光透鏡5之間。The circuit board 2 is connected to the heat dissipation base 1, and has a first mounting surface 21 and a second mounting surface 22 opposite to the first mounting surface 21; the low beam module 3 and the high beam module 4 are located at the same position Correspondingly, the low beam headlight module 3 includes a first light-emitting unit 31 disposed on the first mounting surface 21, and the high beam headlight module 4 includes a second light-emitting unit 41 disposed on the second mounting surface 22. The position of the optical lens 5 corresponds to the low beam module 3 and the high beam module 4; the optical structure 6 is arranged between the heat dissipation base 1 and the light distribution lens 5.

在本實施例中，第一發光單元31與第二發光單元41的位置彼此錯開，而其以分散熱源的方式達到較佳的熱傳效果；第一發光單元31的出光方向不同於第二發光單元41的出光方向；例如，第一發光單元31的出光方向與第二發光單元41的出光方向相反。當近光燈模組3、配光透鏡5與光學結構6相互配合時，可以產生近光燈光型；當遠光燈模組4、配光透鏡5與光學結構6相互配合時，可以產生遠光燈光型。然而，這些細節只是本實施例所提供可行的實施方式，而並非用以限定本發明。In this embodiment, the positions of the first light-emitting unit 31 and the second light-emitting unit 41 are staggered, and they achieve a better heat transfer effect by dispersing the heat source; the light-emitting direction of the first light-emitting unit 31 is different from that of the second light-emitting unit. The light-emitting direction of the unit 41; for example, the light-emitting direction of the first light-emitting unit 31 is opposite to the light-emitting direction of the second light-emitting unit 41. When the low beam module 3, the light distribution lens 5 and the optical structure 6 cooperate with each other, a low beam light type can be produced; when the high beam module 4, the light distribution lens 5 and the optical structure 6 cooperate with each other, it can produce a far distance Light type. However, these details are only feasible implementation manners provided by this embodiment, and are not intended to limit the present invention.

值得注意的是，本發明的微型化光線投射裝置U將第一發光單元31與第二發光單元41配置於同一塊電路基板2的不同面上，並配合一些特殊光學設計來充分利用第一發光單元31與第二發光單元41所發出的光線，可以在完全不影響光照強度的情況下大幅縮減裝置的尺寸。It is worth noting that, in the miniaturized light projection device U of the present invention, the first light-emitting unit 31 and the second light-emitting unit 41 are arranged on different surfaces of the same circuit substrate 2, and cooperate with some special optical designs to make full use of the first light emission. The light emitted by the unit 31 and the second light-emitting unit 41 can greatly reduce the size of the device without affecting the light intensity at all.

如圖7至圖9所示，近光燈模組3或遠光燈模組4所投射出的光線，可通過光學結構6的反射、折射等光學作用以傳遞到配光透鏡5上，再通過配光透鏡5向外投射而產生近光燈光型或遠光燈光型。進一步而言，光學結構6包括一第一導光部61及一第二導光部62，第一導光部61為不透光材質且設置於電路基板2與配光透鏡5之間，第二導光部62為可透光材質且其位置對應遠光燈模組4；配光透鏡5具有一透鏡光軸51及一位於透鏡光軸51上的透鏡焦點52。值得注意的是，第一導光部61與第二導光部62至少部分地接觸，且第一導光部61的上表面610與第二導光部62的上表面620都位於配光透鏡5的光軸的附近。在一些實施例中，第一導光部61的上表面610與第二導光部62與上表面620的垂直投影相互重合。As shown in Figures 7 to 9, the light projected by the low beam module 3 or the high beam module 4 can be transmitted to the light distribution lens 5 through the reflection and refraction of the optical structure 6, and then The low-beam light type or the high-beam light type is generated by projecting the light distribution lens 5 outward. Furthermore, the optical structure 6 includes a first light guide portion 61 and a second light guide portion 62. The first light guide portion 61 is made of opaque material and is disposed between the circuit substrate 2 and the light distributing lens 5. The second light guide portion 62 is made of light-transmissive material and its position corresponds to the high beam module 4; the light distributing lens 5 has a lens optical axis 51 and a lens focal point 52 located on the lens optical axis 51. It is worth noting that the first light guide portion 61 and the second light guide portion 62 are at least partially in contact, and the upper surface 610 of the first light guide portion 61 and the upper surface 620 of the second light guide portion 62 are both located on the light distribution lens Near the optical axis of 5. In some embodiments, the upper surface 610 of the first light guide portion 61 and the vertical projections of the second light guide portion 62 and the upper surface 620 overlap each other.

參閱圖3至圖7所示，散熱基座1作為整個裝置的基礎，且具有良好的導熱和散熱能力。散熱基座1包括一導熱部11、一定位部12及多個散熱結構13，其中定位部12從導熱部11的一端(如前端)延伸成型，散熱結構13從導熱部11的外壁延伸成型。電路基板2具有一主要區域2a及一位於主要區域2a的一側的周邊區域2b，其中主要區域2a外露於定位部12，且第一發光單元31與第二發光單元41都配置於主要區域2a內，周邊區域2b則固定連接於定位部12。根據實際需要，散熱基座1具有一貫穿導熱部11與定位部12的走線通道(未標號)。在一未繪示的實施例中，可在散熱基座1上加裝散熱風扇(未繪示)，如此可通過強制對流的方式來達到更好的散熱效果。Referring to Figures 3 to 7, the heat dissipation base 1 serves as the basis of the entire device and has good heat conduction and heat dissipation capabilities. The heat dissipating base 1 includes a heat conducting part 11, a positioning part 12, and a plurality of heat dissipating structures 13. The positioning part 12 extends from one end (such as the front end) of the heat conducting part 11 and the heat dissipating structure 13 extends from the outer wall of the heat conducting part 11. The circuit substrate 2 has a main area 2a and a peripheral area 2b located on one side of the main area 2a, wherein the main area 2a is exposed to the positioning portion 12, and the first light-emitting unit 31 and the second light-emitting unit 41 are both arranged in the main area 2a Inside, the peripheral area 2b is fixedly connected to the positioning portion 12. According to actual needs, the heat dissipation base 1 has a wiring channel (not labeled) penetrating the heat conducting portion 11 and the positioning portion 12. In an embodiment not shown, a heat dissipation fan (not shown) can be added to the heat dissipation base 1, so that a better heat dissipation effect can be achieved by forced convection.

藉此，散熱基座1能有效移除第一發光單元31與第二發光單元41所產生的熱，從而提高第一發光單元31與第二發光單元41的可靠性和使用壽命。進一步而言，第一發光單元31與第二發光單元41所產生的熱，可先通過電路基板2傳遞到定位部12，再經由導熱部11傳遞到散熱結構13，然後從散熱結構13快速逸散出去。Thereby, the heat dissipation base 1 can effectively remove the heat generated by the first light-emitting unit 31 and the second light-emitting unit 41, thereby improving the reliability and service life of the first light-emitting unit 31 and the second light-emitting unit 41. Furthermore, the heat generated by the first light-emitting unit 31 and the second light-emitting unit 41 can be first transferred to the positioning portion 12 through the circuit substrate 2, and then transferred to the heat dissipation structure 13 via the heat conduction portion 11, and then quickly escape from the heat dissipation structure 13 Get out.

在本實施例中，散熱基座1的材質可為高導熱金屬(如鋁)，其中定位部12可為一定位凸塊，且電路基板2的周邊區域2b固定連接於定位部12的上表面(未標號)；導熱部11可呈圓筒狀，但不限於此；多個散熱結構13可呈片狀且在導熱部11的外壁上間隔排列。然而，散熱結構13的數量、形狀和排列方式可以根據散熱需要而改變，本發明對其沒有特別的限制。在一些實施例中，導熱部11與散熱結構13可為不同的材質，使導熱部11的導熱性比散熱結構13更好。In this embodiment, the material of the heat dissipation base 1 may be a metal with high thermal conductivity (such as aluminum), the positioning portion 12 may be a positioning bump, and the peripheral area 2b of the circuit substrate 2 is fixedly connected to the upper surface of the positioning portion 12 (Not numbered); the heat-conducting part 11 may be cylindrical, but not limited to this; a plurality of heat-dissipating structures 13 may be sheet-shaped and arranged on the outer wall of the heat-conducting part 11 at intervals. However, the number, shape and arrangement of the heat dissipation structure 13 can be changed according to the heat dissipation requirement, and the present invention has no particular limitation on it. In some embodiments, the heat conducting portion 11 and the heat dissipation structure 13 may be made of different materials, so that the heat conductivity of the heat conducting portion 11 is better than that of the heat dissipation structure 13.

電路基板2為一金屬基印刷電路板(MCPCB)，且具有多個線路層(未顯示)；其中上層線路層可作為第一發光單元31的驅動控制電路，下層線路層可作為第二發光單元41的驅動控制電路，中間線路層可作為內部互連線路；又中間線路層也可提供熱傳導路徑，且中間線路層的厚度可大於上層和下層線路層的厚度。在一些實施例中，中間線路層可為具有一定後度的一金屬層。然而，這些細節只是本實施例所提供可行的實施方式，而並非用以限定本發明。The circuit substrate 2 is a metal-based printed circuit board (MCPCB) and has multiple circuit layers (not shown); the upper circuit layer can be used as the driving control circuit of the first light-emitting unit 31, and the lower circuit layer can be used as the second light-emitting unit In the driving control circuit of 41, the middle circuit layer can be used as an internal interconnection circuit; and the middle circuit layer can also provide a heat conduction path, and the thickness of the middle circuit layer can be greater than the thickness of the upper and lower circuit layers. In some embodiments, the intermediate circuit layer may be a metal layer with a certain degree of back-end. However, these details are only feasible implementation manners provided by this embodiment, and are not intended to limit the present invention.

考慮到製造成本與電性傳導路徑，本發明的微型化光線投射裝置U還包括一轉接板7，其也固定連接於散熱基座1的定位部12，且與電路基板2電性連接，用以提供電路基板2向外的電性傳導路徑。在本實施例中，轉接板7為一FR4印刷電路板，且轉接板7與電路基板2通過鎖固方式被一起固定在定位部12的上表面上。然而，這些細節只是本實施例所提供可行的實施方式，而並非用以限定本發明。在一未繪示的實施例中，轉接板7的功能可以被整合到電路基板2上，如此裝置的體積可以更小，而成本也可以更低。Considering the manufacturing cost and the electrical conduction path, the miniaturized light projection device U of the present invention further includes an adapter plate 7, which is also fixedly connected to the positioning portion 12 of the heat dissipation base 1, and is electrically connected to the circuit board 2. It is used to provide an electrical conduction path from the circuit substrate 2 to the outside. In this embodiment, the adapter board 7 is an FR4 printed circuit board, and the adapter board 7 and the circuit substrate 2 are fixed together on the upper surface of the positioning portion 12 by a locking method. However, these details are only feasible implementation manners provided by this embodiment, and are not intended to limit the present invention. In an embodiment not shown, the function of the adapter plate 7 can be integrated on the circuit substrate 2, so that the volume of the device can be smaller and the cost can be lower.

參閱圖3至圖7所示，近光燈模組3還包括一第一反射單元32，其位置對應第一發光單元31，用以反射第一發光單元31所發出的光線。進一步而言，第一反射單元32為一反射罩且具有一反射面，反射面為一多曲率複合曲面，在本實施例中被例示為橢球面。Referring to FIGS. 3 to 7, the low beam headlamp module 3 further includes a first reflecting unit 32 whose position corresponds to the first light-emitting unit 31 for reflecting the light emitted by the first light-emitting unit 31. Furthermore, the first reflecting unit 32 is a reflecting cover and has a reflecting surface. The reflecting surface is a multi-curvature compound curved surface, which is exemplified as an ellipsoidal surface in this embodiment.

在本實施例中，第一反射單元32具有一第一焦點32a及一第二焦點32b，第一焦點32a位於第一反射單元32的覆蓋區域內且第二焦點32b位於第一反射單元32的覆蓋區域外，但本發明不以此為限。又第二焦點32b的位置對應光學結構6；例如，第二焦點32b位於第二導光部62的上表面620上，如圖7所示。此外，第二焦點32b位於透鏡光軸51上且與透鏡焦點52重合。然而，這些細節只是本實施例所提供可行的實施方式，而並非用以限定本發明。在一未繪示的實施例中，第一反射單元32的第二焦點32b可位於第二導光部62的上表面620附近，且可偏離透鏡光軸51而不與透鏡焦點52重合。In this embodiment, the first reflection unit 32 has a first focus 32a and a second focus 32b. The first focus 32a is located within the coverage area of the first reflection unit 32 and the second focus 32b is located at the area of the first reflection unit 32. Outside the coverage area, but the present invention is not limited to this. The position of the second focus 32b corresponds to the optical structure 6; for example, the second focus 32b is located on the upper surface 620 of the second light guide portion 62, as shown in FIG. 7. In addition, the second focal point 32 b is located on the lens optical axis 51 and coincides with the lens focal point 52. However, these details are only feasible implementation manners provided by this embodiment, and are not intended to limit the present invention. In an embodiment not shown, the second focal point 32b of the first reflecting unit 32 may be located near the upper surface 620 of the second light guide portion 62 and may deviate from the lens optical axis 51 without overlapping with the lens focal point 52.

近光燈模組3的第一發光單元31可為一發光二極體(LED)或發光二極體封裝結構(LED package structure)；第一發光單元31可通過表面貼裝技術(SMT)安裝在電路基板2的第一安裝面21上，且第一發光單元31可配置於第一反射單元32的第一焦點32a上或第一焦點32a的附近。在本實施例中，第一發光單元31為一發光二極體封裝結構且包括至少一個發光二極體晶片(未標號)，在圖3中例示為三個。然而，這些細節只是本實施例所提供可行的實施方式，而並非用以限定本發明。The first light emitting unit 31 of the low beam module 3 can be a light emitting diode (LED) or a light emitting diode package structure (LED package structure); the first light emitting unit 31 can be mounted by surface mount technology (SMT) On the first mounting surface 21 of the circuit substrate 2, the first light-emitting unit 31 can be arranged on or near the first focal point 32 a of the first reflecting unit 32. In this embodiment, the first light-emitting unit 31 is a light-emitting diode package structure and includes at least one light-emitting diode chip (not labeled), as illustrated in FIG. 3 as three. However, these details are only feasible implementation manners provided by this embodiment, and are not intended to limit the present invention.

遠光燈模組4還包括一第二反射單元42，其位置對應第二發光單元41，用以反射第二發光單元41所發出的光線。進一步而言，第二反射單元42為一反射罩且具有一反射面；值得注意的是，第二反射單元42的反射面為一多曲率複雜曲面，其可利用光學模擬設計而產生。在一些實施例中，第二反射單元42的反射面可定義出兩條參考軸線對應於通過第一焦點42a及透鏡焦點52的連線，兩條參考軸線可分別位於第一焦點42a及透鏡焦點52的連線的兩側，且可彼此平行或交錯；兩條參考軸線可定義出第二反射單元42的光軸，用以控制第二反射單元42的光型，但本發明不以此為限。在一些實施例中，第二反射單元42的反射面可以只定義出一條參考軸線，其可位於第一焦點42a及透鏡焦點52的連線的一側，或與第一焦點42a及透鏡焦點52的連線重合。The high beam module 4 further includes a second reflecting unit 42 corresponding to the second light-emitting unit 41 for reflecting the light emitted by the second light-emitting unit 41. Furthermore, the second reflecting unit 42 is a reflecting cover and has a reflecting surface; it is worth noting that the reflecting surface of the second reflecting unit 42 is a curved surface with multiple curvatures, which can be produced by optical simulation design. In some embodiments, the reflecting surface of the second reflecting unit 42 may define two reference axes corresponding to the line passing through the first focal point 42a and the lens focal point 52, and the two reference axes may be respectively located at the first focal point 42a and the lens focal point. The two sides of the line 52 can be parallel or staggered with each other; the two reference axes can define the optical axis of the second reflecting unit 42 to control the light type of the second reflecting unit 42, but the present invention does not take this as limit. In some embodiments, the reflecting surface of the second reflecting unit 42 may define only one reference axis, which may be located on the side of the line connecting the first focal point 42a and the lens focal point 52, or may be connected to the first focal point 42a and the lens focal point 52. The lines overlap.

在本實施例中，第二反射單元42具有一第一焦點42a，且可定義出一光聚集區域42b，第一焦點42a位於第二反射單元42的覆蓋區域內且光聚集區域42b位於第二反射單元42的覆蓋區域外，本發明不以此為限。又光聚集區域42b的位置對應光學結構6；例如，光聚集區域42b位於第二導光部62的上表面620上，如圖7所示。此外，透鏡光軸51通過光聚集區域42b，且透鏡焦點52位於光聚集區域42b內。然而，這些細節只是本實施例所提供可行的實施方式，而並非用以限定本發明。在一未繪示的實施例中，第二反射單元42的光聚集區域42b可位於第二導光部62的上表面620附近，或略微偏下的區域，透鏡光軸51可偏離光聚集區域42b，且透鏡焦點52可位於光聚集區域42b附近。在本實施例中，配光透鏡5具有一介於20 mm至40 mm之間的透鏡口徑，透鏡焦點52與第二反射單元42的第一焦點42a之間的距離大於12 mm，較佳為15 mm至35 mm，且更最佳為18 mm至22 mm。In this embodiment, the second reflecting unit 42 has a first focal point 42a, and a light focusing area 42b can be defined. The first focal point 42a is located in the coverage area of the second reflecting unit 42 and the light focusing area 42b is located at the second focal point. Outside the coverage area of the reflecting unit 42, the present invention is not limited to this. In addition, the position of the light concentrating area 42b corresponds to the optical structure 6; for example, the light concentrating area 42b is located on the upper surface 620 of the second light guide portion 62, as shown in FIG. 7. In addition, the lens optical axis 51 passes through the light focusing area 42b, and the lens focal point 52 is located in the light focusing area 42b. However, these details are only feasible implementation manners provided by this embodiment, and are not intended to limit the present invention. In an embodiment that is not shown, the light collecting area 42b of the second reflecting unit 42 may be located near the upper surface 620 of the second light guide portion 62, or a slightly lower area, and the lens optical axis 51 may deviate from the light collecting area 42b, and the lens focal point 52 may be located near the light focusing area 42b. In this embodiment, the light distributing lens 5 has a lens aperture between 20 mm and 40 mm, and the distance between the lens focal point 52 and the first focal point 42a of the second reflecting unit 42 is greater than 12 mm, preferably 15 mm. mm to 35 mm, and more preferably 18 mm to 22 mm.

參閱圖7及圖10所示，為了要提高光線利用率，透鏡光軸51可位於電路基板2的上方，如圖7所示，但不限於此。此外，第二反射單元42可略呈向上傾斜設置，如圖10所示，以充分利用第二發光單元41所發出的光線；進一步而言，第二反射單元42具有一底部開口420，第二反射單元42的第一焦點42a與透鏡焦點52的連線位於第二底部開口420的附近，且第二反射單元42的第一焦點42a與透鏡焦點52的連線與透鏡光軸51夾一預定角度θ4為0度至15度。Referring to FIGS. 7 and 10, in order to improve the utilization of light, the lens optical axis 51 may be located above the circuit substrate 2, as shown in FIG. 7, but is not limited to this. In addition, the second reflecting unit 42 can be slightly inclined upward, as shown in FIG. 10, to make full use of the light emitted by the second light emitting unit 41; furthermore, the second reflecting unit 42 has a bottom opening 420, and the second reflecting unit 42 has a bottom opening 420. The line connecting the first focal point 42a of the reflecting unit 42 and the lens focal point 52 is located near the second bottom opening 420, and the connecting line between the first focal point 42a of the second reflecting unit 42 and the lens focal point 52 and the lens optical axis 51 are predetermined The angle θ4 is 0 degrees to 15 degrees.

參閱圖11所示，根據配光需要，第二反射單元42的反射面可包括一第一反射曲面421、一第二反射曲面422及一連接於第一反射曲面421與第二反射曲面422之間的連接面423，其中第一反射曲面421與一第二反射曲面422各為一多曲率複雜曲面。用語“多曲率複雜曲面”的主要特徵在於，其垂直基礎線或水平基礎線至少有一段不滿足橢圓曲線的要求，即a2-b2不等於c2，其中a表示橢球的1/2長軸，b表示橢球的1/2短軸，c表示橢球的中心點至焦點的距離。在本實施例中，連接面423為前寬後窄狀弧面（以透鏡方向為前），連接面423的存在使得第二反射單元42的擴光效果更佳，使遠光燈模式有更好的表現；然而本發明不以連接面423為前寬後窄狀弧面為限。Referring to FIG. 11, according to the light distribution requirements, the reflective surface of the second reflective unit 42 may include a first reflective curved surface 421, a second reflective curved surface 422, and a connection between the first reflective curved surface 421 and the second reflective curved surface 422. In the connecting surface 423, the first reflective curved surface 421 and the second reflective curved surface 422 are each a complex curved surface with multiple curvatures. The main feature of the term "multi-curvature complex surface" is that at least one of its vertical or horizontal base lines does not meet the requirements of an elliptic curve, that is, a2-b2 is not equal to c2, where a represents the 1/2 major axis of the ellipsoid, b represents the 1/2 minor axis of the ellipsoid, and c represents the distance from the center point of the ellipsoid to the focal point. In this embodiment, the connecting surface 423 is a front wide and rear narrow arc surface (with the lens direction as the front). The existence of the connecting surface 423 makes the second reflecting unit 42 have a better light expansion effect and makes the high beam mode more effective. Good performance; however, the present invention is not limited to the connecting surface 423 as a front wide and narrow arc surface.

遠光燈模組4的第二發光單元41可為一發光二極體(LED)或發光二極體封裝結構(LED package structure)；第二發光單元41可通過表面貼裝技術(SMT)安裝在電路基板2的第二安裝面22上，且第二發光單元41可配置於第二反射單元42的第一焦點32a上或第一焦點32a的附近。在本實施例中，第二發光單元41為一發光二極體封裝結構且包括至少一個發光二極體晶片，在圖4中例示為一個。然而，這些細節只是本實施例所提供可行的實施方式，而並非用以限定本發明。The second light emitting unit 41 of the high beam module 4 can be a light emitting diode (LED) or a light emitting diode package structure (LED package structure); the second light emitting unit 41 can be mounted by surface mount technology (SMT) On the second mounting surface 22 of the circuit substrate 2, the second light emitting unit 41 can be arranged on the first focal point 32 a of the second reflecting unit 42 or near the first focal point 32 a. In this embodiment, the second light-emitting unit 41 is a light-emitting diode package structure and includes at least one light-emitting diode chip, which is illustrated as one in FIG. 4. However, these details are only feasible implementation manners provided by this embodiment, and are not intended to limit the present invention.

參閱圖3至圖7，並配合圖12至圖14所示，光學結構6的第一導光部61大致呈水平狀態且第二導光部62呈站立狀態，例如垂直站立狀態或傾斜站立狀態，其中第一導光部61的上表面610的垂直投影與第二導光部62的上表面620部分地重疊。在本實施例中，根據實際需要，第一導光部61的上表面610可具有反光或消光特性。第一導光部61與第二導光部62絕大部分位於第一反射單元32的覆蓋區域內，且第一發光單元31的位置比第二發光單元41更接近第一導光部61，但不限於此；其中第一導光部61為一反光板，其緊鄰於電路基板2且朝接近配光透鏡5的方向延伸，第一導光部61並具有一缺口614，在圖12中例示為弧形缺口。另外，第二導光部62為一透明導光體，其設置於第一導光部61的缺口614處；第二導光部62的材質可為聚甲基丙烯酸甲酯(PMMA)或矽氧橡膠(silicone rubber)，但不限於此。Referring to FIGS. 3 to 7 and in conjunction with FIGS. 12 to 14, the first light guide portion 61 of the optical structure 6 is approximately in a horizontal state and the second light guide portion 62 is in a standing state, such as a vertical standing state or an inclined standing state , Wherein the vertical projection of the upper surface 610 of the first light guide portion 61 partially overlaps with the upper surface 620 of the second light guide portion 62. In this embodiment, according to actual needs, the upper surface 610 of the first light guide portion 61 may have reflective or extinction characteristics. Most of the first light guide portion 61 and the second light guide portion 62 are located within the coverage area of the first reflective unit 32, and the position of the first light-emitting unit 31 is closer to the first light guide portion 61 than the second light-emitting unit 41, But it is not limited to this; wherein the first light guide portion 61 is a light reflector, which is adjacent to the circuit substrate 2 and extends in the direction close to the light distribution lens 5, and the first light guide portion 61 has a notch 614, as shown in FIG. 12 Illustrated as a curved gap. In addition, the second light guide portion 62 is a transparent light guide body, which is disposed at the notch 614 of the first light guide portion 61; the material of the second light guide portion 62 can be polymethylmethacrylate (PMMA) or silicon Oxygen rubber (silicone rubber), but not limited to this.

值得注意的是，為了要提高光線利用率，透鏡光軸51通過第一導光部61，且第一導光部61的一垂直投影區域涵蓋第二導光部62的絕大部分，如圖6所示，但不限於此。在一未繪示的實施例中，第一導光部61可位於透鏡光軸51下方。又第二導光部62的上表面620相對於透鏡光軸51稍微傾斜一預定角度θ2為大於0度且小於10度，較佳為接近0.5度至7.5度，如圖13所示。此外，根據配光需要，可在第二導光部62的上表面620覆蓋一反光層63，如圖14所示；反光層63可由高反射率材料(如鋁、銀等)形成，但不限於此。藉此，可防止近光燈模組3所投射出的光線從上表面620穿透第二導光部62。It is worth noting that, in order to improve the utilization of light, the lens optical axis 51 passes through the first light guide portion 61, and a vertical projection area of the first light guide portion 61 covers most of the second light guide portion 62, as shown in FIG. 6 shown, but not limited to this. In an embodiment not shown, the first light guide portion 61 may be located below the optical axis 51 of the lens. The upper surface 620 of the second light guide portion 62 is slightly inclined with respect to the lens optical axis 51 by a predetermined angle θ2 greater than 0 degrees and less than 10 degrees, preferably close to 0.5 degrees to 7.5 degrees, as shown in FIG. 13. In addition, according to the needs of light distribution, a reflective layer 63 can be covered on the upper surface 620 of the second light guide portion 62, as shown in FIG. 14; the reflective layer 63 can be formed of a material with high reflectivity (such as aluminum, silver, etc.), but not Limited to this. In this way, the light projected by the low beam module 3 can be prevented from penetrating the second light guide portion 62 from the upper surface 620.

進一步而言，第一導光部61具有一接近電路基板2的內側邊緣(未顯示)及一遠離電路基板2的外側邊緣61a，第二導光部62也具有一接近電路基板2的內側邊緣(未標號)及一遠離電路基板2的外側邊緣62a，其中第一導光部61的外側邊緣61a鄰近於第二導光部62的上表面620，且第一導光部61的外側邊緣61a與第二導光部62的外側邊緣62a之間的最短水平距離為0.2 mm至5 mm，如圖12所示。在本實施例中，第一導光部61的外側邊緣61a可以接觸到第二導光部62的上表面620，如圖13及圖14所示，但不限於此。在一未繪示的實施例中，第一導光部61的外側邊緣61a可以不接觸到第二導光部62的上表面620。Furthermore, the first light guide portion 61 has an inner edge (not shown) close to the circuit board 2 and an outer edge 61a away from the circuit board 2, and the second light guide portion 62 also has an inner edge close to the circuit board 2. (Not numbered) and an outer edge 62a away from the circuit board 2, wherein the outer edge 61a of the first light guide portion 61 is adjacent to the upper surface 620 of the second light guide portion 62, and the outer edge 61a of the first light guide portion 61 The shortest horizontal distance from the outer edge 62a of the second light guide portion 62 is 0.2 mm to 5 mm, as shown in FIG. 12. In this embodiment, the outer edge 61a of the first light guide portion 61 may contact the upper surface 620 of the second light guide portion 62, as shown in FIGS. 13 and 14, but is not limited thereto. In an embodiment not shown, the outer edge 61 a of the first light guide portion 61 may not touch the upper surface 620 of the second light guide portion 62.

參閱圖12，並配合15所示，第一導光部61可為一薄鋁片衝壓而成，且厚度為大於等於0.1 mm且小於1 mm，較佳為0.2 mm。由於第一導光部61的質地較軟而容易發生形變，第二導光部62的上表面620上一體成型有兩個支撐柱626；每一個支撐柱626具有一平台部6261及定位部6262，其中平台部6261具有一支撐平面用(未標號)以支撐第一導光部61，定位部6262穿過並固定於第一導光部61。藉此，第一導光部61可以被第二導光部62穩固地承托住，而處於預定的位置上。值得一提的是，藉由第二導光部62的支撐柱626，可以確保第一導光部61的形變量維持在一較小的程度，並將第一導光部61準確定位，確保第一導光部61的外側邊緣61a與第二導光部62的外側邊緣62a之間的水平距離不變。然而，這些細節只是本實施例所提供可行的實施方式，而並非用以限定本發明。在一未繪示的實施例中，可通過黏著的方式使第一導光部61與第二導光部62固定在一起。Referring to FIG. 12 and shown in conjunction with 15, the first light guide portion 61 may be stamped from a thin aluminum sheet, and the thickness is greater than or equal to 0.1 mm and less than 1 mm, preferably 0.2 mm. Since the texture of the first light guide portion 61 is soft and is prone to deformation, the upper surface 620 of the second light guide portion 62 is integrally formed with two support posts 626; each support post 626 has a platform portion 6261 and a positioning portion 6262 , The platform portion 6261 has a supporting plane (not numbered) to support the first light guide portion 61, and the positioning portion 6262 passes through and is fixed to the first light guide portion 61. Thereby, the first light guide portion 61 can be stably supported by the second light guide portion 62, and is at a predetermined position. It is worth mentioning that by the support post 626 of the second light guide portion 62, the deformation amount of the first light guide portion 61 can be maintained to a small degree, and the first light guide portion 61 can be accurately positioned to ensure The horizontal distance between the outer edge 61a of the first light guide portion 61 and the outer edge 62a of the second light guide portion 62 does not change. However, these details are only feasible implementation manners provided by this embodiment, and are not intended to limit the present invention. In an embodiment not shown, the first light guide portion 61 and the second light guide portion 62 can be fixed together by means of adhesion.

複參閱圖12所示，下面將描述光學結構6的第一導光部61與第二導光部62的光學設計。第一導光部61的上表面610與第二導光部62的上表面620可共同定義出近光燈照明所需的光型和明暗截止線，從而本發明的微型化光線投射裝置U可以產生符合車輛法規的近光燈光型，其具有清晰的明暗截止線。進一步而言，第一導光部61具有兩個外側反射區域(未標號)及一位於兩個外側反射區域之間的中央反射區域(未標號)；並且，第一導光部61的上表面610包括一第一反射平面611、一第二反射平面612及一連接於第一反射平面611與第二反射平面612之間的反射斜面613，其中第一反射平面611與第二反射平面612分別位於兩個外側反射區域內，且第一反射平面611的位置高於第二反射平面612，反射斜面613則位於中央反射區域內。藉此，本發明的微型化光線投射裝置U可以產生非對稱式光型。在一未繪示的實施例中，為了產生對稱式光型，第一導光部61的上表面610可以只包括相互齊平的第一反射平面611及第二反射平面612。Referring again to FIG. 12, the optical design of the first light guide portion 61 and the second light guide portion 62 of the optical structure 6 will be described below. The upper surface 610 of the first light guide portion 61 and the upper surface 620 of the second light guide portion 62 can jointly define the light type and cut-off line required for low beam lighting, so that the miniaturized light projection device U of the present invention can Produce a low-beam light type that complies with vehicle regulations and has a clear cut-off line of light and dark. Furthermore, the first light guide portion 61 has two outer reflective areas (not numbered) and a central reflective area (not numbered) located between the two outer reflective areas; and, the upper surface of the first light guide portion 61 610 includes a first reflective plane 611, a second reflective plane 612, and a reflective inclined plane 613 connected between the first reflective plane 611 and the second reflective plane 612, wherein the first reflective plane 611 and the second reflective plane 612 are respectively It is located in the two outer reflective areas, and the position of the first reflective plane 611 is higher than the second reflective plane 612, and the reflective inclined surface 613 is located in the central reflective area. Thereby, the miniaturized light projection device U of the present invention can generate an asymmetric light pattern. In an unillustrated embodiment, in order to generate a symmetrical light pattern, the upper surface 610 of the first light guide portion 61 may only include a first reflection plane 611 and a second reflection plane 612 that are flush with each other.

另外，第二導光部62也具有兩個外側光學區域(未標號)及一位於兩個外側光學區域之間的中央光學區域(未標號)；並且，第二導光部62的上表面620包括一第一光學平面621、一第二光學平面622及一連接於第一光學平面621與第二光學平面622之間的光學斜面623，其中第一光學平面621與第二光學平面622分別位於兩個外側光學區域內，且第一光學平面621的位置高於第二光學平面622，光學斜面623則位於中央光學區域內。藉此，本發明的微型化光線投射裝置U可以產生非對稱式光型。在一未繪示的實施例中，為了產生對稱式光型，第二導光部62的上表面620可以只包括相互齊平的第一光學平面621及第二光學平面622。In addition, the second light guide portion 62 also has two outer optical regions (not numbered) and a central optical region (not numbered) located between the two outer optical regions; and, the upper surface 620 of the second light guide portion 62 It includes a first optical plane 621, a second optical plane 622, and an optical inclined plane 623 connected between the first optical plane 621 and the second optical plane 622, wherein the first optical plane 621 and the second optical plane 622 are respectively located In the two outer optical regions, the position of the first optical plane 621 is higher than the second optical plane 622, and the optical inclined surface 623 is located in the central optical region. Thereby, the miniaturized light projection device U of the present invention can generate an asymmetric light pattern. In an embodiment not shown, in order to generate a symmetrical light pattern, the upper surface 620 of the second light guide portion 62 may only include the first optical plane 621 and the second optical plane 622 that are flush with each other.

複參閱圖3至圖7所示，配光透鏡5通過一透鏡架8與散熱基座1固定在一起，而第一反射單元32、第二反射單元42與光學結構6也固定在透鏡架8上。進一步而言，本發明的微型化光線投射裝置U還包括一安裝單元9，其設置於透鏡架8與散熱基座1之間，而微型化光線投射裝置U可藉由安裝單元9被安裝到車燈的燈座結構(未顯示)上；關於安裝單元9的構造，可參考相同申請人的第106137400號台灣專利，在此不加以贅述。Referring again to FIGS. 3 to 7, the light distribution lens 5 is fixed to the heat dissipation base 1 through a lens frame 8, and the first reflecting unit 32, the second reflecting unit 42 and the optical structure 6 are also fixed to the lens frame 8. on. Furthermore, the miniaturized light projection device U of the present invention further includes a mounting unit 9 disposed between the lens holder 8 and the heat dissipation base 1, and the miniaturized light projection device U can be mounted to On the lamp holder structure (not shown) of the vehicle lamp; for the structure of the mounting unit 9, please refer to the Taiwan Patent No. 106137400 of the same applicant, which will not be repeated here.

進一步而言，透鏡架8包括一框體81、一連接結構82及兩個支撐臂83，其中框體81用以承載配光透鏡5，連接結構82與安裝單元9的主體部(未標號)相連接，兩個支撐臂83連接於框體81與連接結構82之間。在本實施例中，框體81、連接結構82與支撐臂83一體成型，配光透鏡5通過卡合方式固定在框體81上，且第一反射單元32、第二反射單元42與光學結構6通過機構結合的方式固定在支撐臂83上。此外，散熱基座1的定位部12穿過安裝單元9，並以前端與連接結構82固定在一起；其中連接結構82可為一片體且具有一開口820，如圖5、圖7所示，且電路基板2從定位部12延伸穿過開口820，從而第一發光單元31的位置可對應第一反射單元32，且第二反射單元42的位置可對應第二反射單元42。Furthermore, the lens holder 8 includes a frame body 81, a connecting structure 82 and two supporting arms 83, wherein the frame body 81 is used to carry the light distribution lens 5, the connecting structure 82 and the main body portion of the mounting unit 9 (not numbered) In connection, the two support arms 83 are connected between the frame body 81 and the connecting structure 82. In this embodiment, the frame body 81, the connecting structure 82 and the support arm 83 are integrally formed, the light distribution lens 5 is fixed on the frame body 81 by means of engagement, and the first reflecting unit 32, the second reflecting unit 42 and the optical structure 6 is fixed on the support arm 83 by means of a mechanism combination. In addition, the positioning portion 12 of the heat dissipation base 1 passes through the mounting unit 9 and is fixed together with the connecting structure 82 at the front end; wherein the connecting structure 82 can be a single piece and has an opening 820, as shown in FIGS. 5 and 7, In addition, the circuit substrate 2 extends from the positioning portion 12 through the opening 820, so that the position of the first light emitting unit 31 can correspond to the first reflecting unit 32, and the position of the second reflecting unit 42 can correspond to the second reflecting unit 42.

複參閱圖7至圖9所示，使用時，第一發光單元31所發出的其中一光線L1，可被第一反射單元32反射以產生一次反射光線L11投射至第一導光部61的上表面610，而一次反射光線L11可再被第一導光部61的上表面610反射以產生二次反射光線L12從透鏡光軸51的上方投射至配光透鏡5，最後形成近光燈光型的至少一部分。另外，第一發光單元31所發出的另外一光線L2，可被第一反射單元23反射以產生一次反射光線L21投射至第二導光部62的上表面620，而至少一部分的一次反射光線L21可再被第二導光部62的上表面620反射以產生二次反射光線L22從透鏡光軸51的上方投射至配光透鏡5，最後形成近光燈光型的至少一部分；而其他部分的一次反射光線L21可以從上表面620進入到第二導光部62內部並發生多次全反射，直至光能損失殆盡，以滿足近光燈光型的暗區要求。另外，第一發光單元31所發出的另外再一光線L3，可被第一反射單元32反射，以產生一次反射光線L31通過第二導光部62與配光透鏡5之間的中空區域，而從透鏡光軸51的下方投射至配光透鏡5，最後形成近光燈光型的至少一部分。Referring again to FIGS. 7-9, when in use, one of the light rays L1 emitted by the first light-emitting unit 31 can be reflected by the first reflecting unit 32 to generate a reflected light L11 that is projected onto the first light guide portion 61 Surface 610, and the primary reflected light L11 can be reflected by the upper surface 610 of the first light guide 61 to produce secondary reflected light L12 from above the lens optical axis 51 to the light distribution lens 5, and finally form a low-beam light type At least part of it. In addition, another light L2 emitted by the first light-emitting unit 31 can be reflected by the first reflecting unit 23 to generate a primary reflected light L21 and project to the upper surface 620 of the second light guide portion 62, and at least a part of the primary reflected light L21 It can be reflected by the upper surface 620 of the second light guide portion 62 to generate a secondary reflected light L22 projected from above the lens optical axis 51 to the light distributing lens 5, and finally form at least a part of the low-beam light type; The reflected light L21 can enter the second light guide portion 62 from the upper surface 620 and undergo multiple total reflections until the light energy is lost, so as to meet the dark area requirements of the low-beam lamp type. In addition, another light L3 emitted by the first light emitting unit 31 can be reflected by the first reflecting unit 32 to generate a reflected light L31 to pass through the hollow area between the second light guide portion 62 and the light distributing lens 5, and It is projected from below the lens optical axis 51 to the light distributing lens 5, and finally forms at least a part of the low-beam lamp type.

使用時，第二發光單元41所發出的其中一光線L4，可被第二反射單元42反射以產生一次反射光線L41投射至第二導光部62的入光面624，而一次反射光線L41可通過第二導光部62的入光面624產生一次折射光線L42投射至第二導光部62的上表面620；然後，一次折射光線L42可通過第二導光部62的上表面620產生二次折射光線L43從透鏡光軸51的上方投射至配光透鏡5，最後形成遠光燈光型的至少一部分。另外，第二發光單元41所發出的另外一光線L5，可被第二反射單元42反射以產生一次反射光線L51投射至第二導光部62的入光面624，而一次反射光線L51可通過第二導光部62的入光面624產生一次折射光線L52投射至第二導光部62的上表面620；然後，一次折射光線L52可再被第二導光部62的上表面620反射以產生二次反射光線L53從透鏡光軸51的下方投射至配光透鏡5，最後形成遠光燈光型的至少一部分。另外，第二發光單元41所發出的另外一光線L6，可被第二反射單元42反射以產生一次反射光線L61投射至第二導光部62的入光面624，而一次反射光線L61可通過第二導光部62的入光面624產生一次折射光線L62投射至第二導光部62的出光面625；然後，一次折射光線L62可通過第二導光部62的出光面625產生二次折射光線L63從透鏡光軸51的上方投射至配光透鏡5，最後形成遠光燈光型的至少一部分。When in use, one of the light rays L4 emitted by the second light-emitting unit 41 can be reflected by the second reflecting unit 42 to generate a reflected light L41 that is projected to the light incident surface 624 of the second light guide portion 62, and the once reflected light L41 can be The primary refracted light L42 generated by the light incident surface 624 of the second light guide portion 62 is projected to the upper surface 620 of the second light guide portion 62; then, the primary refraction light L42 can pass through the upper surface 620 of the second light guide portion 62 to produce two The secondary refracted light L43 is projected to the light distribution lens 5 from above the lens optical axis 51, and finally forms at least a part of the high beam light type. In addition, another light L5 emitted by the second light-emitting unit 41 can be reflected by the second reflecting unit 42 to generate a reflected light L51 that is projected to the light incident surface 624 of the second light guide portion 62, and the first reflected light L51 can pass The light incident surface 624 of the second light guide portion 62 generates a refracted light ray L52 and is projected to the upper surface 620 of the second light guide portion 62; then, the once refracted light ray L52 can be reflected by the upper surface 620 of the second light guide portion 62 again. The generated secondary reflected light L53 is projected to the light distribution lens 5 from below the lens optical axis 51, and finally forms at least a part of the high beam light type. In addition, another light L6 emitted by the second light-emitting unit 41 can be reflected by the second reflecting unit 42 to generate a reflected light L61 that is projected to the light incident surface 624 of the second light guide portion 62, and the first reflected light L61 can pass The light incident surface 624 of the second light guide portion 62 generates a primary refracted light L62 and is projected to the light exit surface 625 of the second light guide portion 62; then, the primary refracted light L62 can pass through the light exit surface 625 of the second light guide portion 62 to produce a secondary The refracted light L63 is projected to the light distributing lens 5 from above the lens optical axis 51, and finally forms at least a part of the high beam light type.

第二導光部62的入光面624與出光面625之間的垂直距離為第二導光部62的厚度，此厚度介於1 mm至12 mm之間，其中以3 mm至7 mm為佳。The vertical distance between the light incident surface 624 and the light exit surface 625 of the second light guide portion 62 is the thickness of the second light guide portion 62, which is between 1 mm and 12 mm, where 3 mm to 7 mm is used as good.

[實施例的有益效果][Beneficial effects of the embodiment]

以上所公開的內容僅為本發明的優選可行實施例，並非因此侷限本發明的申請專利範圍，所以凡是運用本發明說明書及圖式內容所做的等效技術變化，均包含於本發明的申請專利範圍內。The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.

U:微型化光線投射裝置 1:散熱基座 11:導熱部 12:定位部 13:散熱結構 2:電路基板 2a:主要區域 2b:周邊區域 21:第一安裝面 22:第二安裝面 3:近光燈模組 31:第一發光單元 32:第一反射單元 32a:第一焦點 32b:第二焦點 4:遠光燈模組 41:第二發光單元 42:第二反射單元 42a:第一焦點 42b:光聚集區域 420:底部開口 421:第一反射曲面 422:第二反射曲面 423:連接面 5:配光透鏡 51:透鏡光軸 52:透鏡焦點 6:光學結構 61:第一導光部 61a:外側邊緣 610:上表面 611:第一反射平面 612:第二反射平面 613:反射斜面 614:缺口 62:第二導光部 62a:外側邊緣 620:上表面 621:第一光學平面 622:第二光學平面 623:光學斜面 624:入光面 625:出光面 626:支撐柱 6261:平台部 6262:定位部 63:反光層 7:轉接板 8:透鏡架 81:框體 82:連接結構 820:開口 83:支撐臂 9:安裝單元 θ1、θ2:預定角度 L1、L2、L3、L4、L5、L6:光線 L11、L21、L31、L41、L51、L61:一次反射光線 L42、L52、L62:一次折射光線 L12、L22、L53:二次反射光線 L43、L63:二次折射光線U: Miniaturized light projection device 1: cooling base 11: Heat conduction part 12: Positioning department 13: Heat dissipation structure 2: Circuit board 2a: main area 2b: Surrounding area 21: The first mounting surface 22: The second mounting surface 3: Low beam module 31: The first light-emitting unit 32: The first reflection unit 32a: the first focus 32b: second focus 4: High beam module 41: The second light-emitting unit 42: second reflection unit 42a: The first focus 42b: Light gathering area 420: bottom opening 421: First reflective surface 422: Second reflective surface 423: connection surface 5: Light distribution lens 51: lens optical axis 52: lens focus 6: Optical structure 61: The first light guide 61a: Outer edge 610: upper surface 611: first reflection plane 612: second reflection plane 613: reflective slope 614: Gap 62: second light guide 62a: outer edge 620: upper surface 621: first optical plane 622: second optical plane 623: Optical Bevel 624: Glossy Surface 625: Glossy Surface 626: support column 6261: Platform Department 6262: Positioning Department 63: reflective layer 7: Adapter board 8: lens holder 81: Frame 82: Connection structure 820: open 83: support arm 9: Installation unit θ1, θ2: predetermined angle L1, L2, L3, L4, L5, L6: light L11, L21, L31, L41, L51, L61: once reflected light L42, L52, L62: once refracted light L12, L22, L53: secondary reflected light L43, L63: Double refraction of light

圖1為本發明的微型化光線投射裝置的其中一立體組合示意圖。FIG. 1 is a schematic diagram of one of the three-dimensional assembly of the miniaturized light projection device of the present invention.

圖2為本發明的微型化光線投射裝置的另外一立體組合示意圖。FIG. 2 is another three-dimensional assembly schematic diagram of the miniaturized light projection device of the present invention.

圖3為本發明的微型化光線投射裝置的其中一立體分解示意圖。FIG. 3 is a three-dimensional exploded schematic diagram of the miniaturized light projection device of the present invention.

圖4為本發明的微型化光線投射裝置的另外一立體分解示意圖。4 is another three-dimensional exploded schematic view of the miniaturized light projection device of the present invention.

圖5為本發明的微型化光線投射裝置的其中一立體剖面示意圖。FIG. 5 is a schematic three-dimensional cross-sectional view of the miniaturized light projection device of the present invention.

圖6為本發明的微型化光線投射裝置的另外一立體剖面示意圖。FIG. 6 is another three-dimensional cross-sectional schematic diagram of the miniaturized light projection device of the present invention.

圖7為本發明的微型化光線投射裝置的平面示意圖。FIG. 7 is a schematic plan view of the miniaturized light projection device of the present invention.

圖8為本發明的微型化光線投射裝置的其中一光線投射示意圖。FIG. 8 is a schematic diagram of one of the light projections of the miniaturized light projection device of the present invention.

圖9為本發明的微型化光線投射裝置的另外一光線投射示意圖。FIG. 9 is another schematic diagram of light projection of the miniaturized light projection device of the present invention.

圖10為本發明的微型化光線投射裝置的局部平面示意圖。Fig. 10 is a schematic partial plan view of the miniaturized light projection device of the present invention.

圖11為本發明的微型化光線投射裝置中遠光燈模組的第二反射單元的立體示意圖。11 is a three-dimensional schematic diagram of the second reflecting unit of the high-beam lamp module in the miniaturized light projection device of the present invention.

圖12為本發明的微型化光線投射裝置的光學結構的立體示意圖。FIG. 12 is a three-dimensional schematic diagram of the optical structure of the miniaturized light projection device of the present invention.

圖13為圖7中XIII部分的局部放大圖。Fig. 13 is a partial enlarged view of part XIII in Fig. 7.

圖14顯示圖13所示光學結構的另一種實施方式。FIG. 14 shows another embodiment of the optical structure shown in FIG. 13.

圖15為本發明的微型化光線投射裝置的光學結構的平面示意圖。15 is a schematic plan view of the optical structure of the miniaturized light projection device of the present invention.

U:微型化光線投射裝置 U: Miniaturized light projection device

1:散熱基座 1: cooling base

3:近光燈模組 3: Low beam module

5:配光透鏡 5: Light distribution lens

8:透鏡架 8: lens holder

9:安裝單元 9: Installation unit

Claims

一種微型化光線投射裝置，其包括：一散熱基座；一電路基板，其連接於所述散熱基座，且具有一第一安裝面以及一相對於所述第一安裝面的第二安裝面；一近光燈模組，其包括一設置於所述第一安裝面上的第一發光單元以及一第一反射單元用以反射所述第一發光單元所發出的光線；一遠光燈模組，其包括一設置於所述第二安裝面上的第二發光單元以及一第二反射單元用以反射所述第二發光單元所發出的光線，其中所述第二發光單元與所述第一發光單元的位置彼此錯開；一配光透鏡，其位置對應所述近光燈模組與所述遠光燈模組；以及一光學結構，其設置於所述散熱基座與所述配光透鏡之間，用以使被所述第一反射單元與所述第二反射單元反射的光線投向所述配光透鏡。A miniaturized light projection device, which includes: A heat dissipation base; A circuit board connected to the heat dissipation base and having a first mounting surface and a second mounting surface opposite to the first mounting surface; A low beam module, which includes a first light emitting unit and a first reflecting unit arranged on the first mounting surface to reflect the light emitted by the first light emitting unit; A high beam module, which includes a second light emitting unit disposed on the second mounting surface and a second reflecting unit for reflecting the light emitted by the second light emitting unit, wherein the second light emitting unit The positions of the unit and the first light-emitting unit are staggered from each other; A light distribution lens whose position corresponds to the low beam module and the high beam module; and An optical structure is arranged between the heat dissipation base and the light distribution lens, and is used for making the light reflected by the first reflection unit and the second reflection unit project toward the light distribution lens.

如申請專利範圍第1項所述的微型化光線投射裝置，其中，所述光學結構包括一第一導光部以及一第二導光部，所述第一導光部為不透光材質，且設置於所述電路基板與所述配光透鏡之間，所述第二導光部為可透光材質，且位置對應所述遠光燈模組，其中，所述配光透鏡具有一透鏡光軸，所述第一導光部的一上表面與所述第二導光部的一上表面都位於所述透鏡光軸的附近，且所述第一導光部的所述上表面的垂直投影與所述第二導光部的所述上表面部分地重疊。The miniaturized light projection device according to the first item of the scope of patent application, wherein the optical structure includes a first light guide portion and a second light guide portion, and the first light guide portion is made of opaque material, And is disposed between the circuit substrate and the light distribution lens, the second light guide portion is made of a light-transmissive material, and the position corresponds to the high beam module, wherein the light distribution lens has a lens Optical axis, an upper surface of the first light guide portion and an upper surface of the second light guide portion are both located near the optical axis of the lens, and the upper surface of the first light guide portion The vertical projection partially overlaps the upper surface of the second light guide part.

如申請專利範圍第1項所述的微型化光線投射裝置，其中所述配光透鏡具有一介於20 mm至40 mm之間的透鏡口徑。The miniaturized light projection device according to the first item of the scope of patent application, wherein the light distribution lens has a lens aperture between 20 mm and 40 mm.

如申請專利範圍第1項所述的微型化光線投射裝置，其中所述配光透鏡的一透鏡焦點與所述第二反射單元的一第一焦點之間的距離大於12 mm且小於35 mm。The miniaturized light projection device according to the first item of the scope of patent application, wherein the distance between a lens focal point of the light distribution lens and a first focal point of the second reflecting unit is greater than 12 mm and less than 35 mm.

如申請專利範圍第2項所述的微型化光線投射裝置，其中，所述第一發光單元的位置比所述第二發光單元更接近所述第一導光部。The miniaturized light projection device according to the second item of the scope of patent application, wherein the position of the first light-emitting unit is closer to the first light guide portion than the second light-emitting unit.

如申請專利範圍第2項所述的微型化光線投射裝置，其中，所述第一導光部緊鄰於所述電路基板且朝接近所述配光透鏡的方向延伸，所述第一導光部並具有一缺口，所述第二導光部的位置對應所述缺口。The miniaturized light projection device according to claim 2, wherein the first light guide portion is adjacent to the circuit board and extends in a direction approaching the light distributing lens, and the first light guide portion And there is a notch, and the position of the second light guide part corresponds to the notch.

如申請專利範圍第2項所述的微型化光線投射裝置，其中，所述第一導光部具有一接近所述電路基板的內側邊緣以及一遠離所述電路基板的外側邊緣，且所述第一導光部的所述外側邊緣鄰近於所述第二導光部的所述上表面。The miniaturized light projection device according to claim 2, wherein the first light guide portion has an inner edge close to the circuit board and an outer edge far away from the circuit board, and the first light guide portion The outer edge of a light guide part is adjacent to the upper surface of the second light guide part.

如申請專利範圍第2項所述的微型化光線投射裝置，其中，所述第二導光部具有相互平行的一入光面以及一出光面，所述入光面與所述出光面之間的距離介於1 mm至12 mm之間。The miniaturized light projection device according to the second item of the scope of patent application, wherein the second light guide portion has a light incident surface and a light output surface parallel to each other, and the light incident surface and the light output surface are between the The distance is between 1 mm and 12 mm.

如申請專利範圍第2項所述的微型化光線投射裝置，其中所述第二導光部的所述上表面上設有至少一支撐柱，用以支撐並定位所述第一導光部。The miniaturized light projection device according to the second item of the scope of patent application, wherein the upper surface of the second light guide portion is provided with at least one support post for supporting and positioning the first light guide portion.

如申請專利範圍第2項所述的微型化光線投射裝置，其中所述第一導光部為一厚度小於1 mm的薄鋁片所形成。In the miniaturized light projection device described in item 2 of the scope of patent application, the first light guide portion is formed by a thin aluminum sheet with a thickness of less than 1 mm.

如申請專利範圍第2項所述的微型化光線投射裝置，其中，所述第二導光部的所述上表面相對於所述透鏡光軸傾斜一預定角度為0.5度至7.5度之間。The miniaturized light projection device according to the second item of the scope of patent application, wherein the upper surface of the second light guide portion is inclined at a predetermined angle between 0.5 degrees and 7.5 degrees with respect to the optical axis of the lens.

如申請專利範圍第11項所述的微型化光線投射裝置，其中，所述第二導光部具有一接近所述電路基板的內側邊緣以及一遠離所述電路基板的外側邊緣，所述第二導光部的所述外側邊緣與所述第一導光部的所述外側邊緣之間的最短水平距離為0.2 mm至 5 mm。The miniaturized light projection device according to claim 11, wherein the second light guide portion has an inner edge close to the circuit board and an outer edge far away from the circuit board, the second The shortest horizontal distance between the outer edge of the light guide part and the outer edge of the first light guide part is 0.2 mm to 5 mm.

如申請專利範圍第11項所述的微型化光線投射裝置，其中，所述第二導光部的所述上表面具有一反光層。The miniaturized light projection device according to the 11th item of the scope of patent application, wherein the upper surface of the second light guide portion has a light reflecting layer.

如申請專利範圍第11項所述的微型化光線投射裝置，其中，且所述透鏡光軸通過所述第一導光部。The miniaturized light projection device according to claim 11, wherein the optical axis of the lens passes through the first light guide portion.

如申請專利範圍第1項所述的微型化光線投射裝置，其中，所述散熱基座包括一定位部，所述電路基板具有一主要區域以及一位於所述主要區域的一側的周邊區域，所述周邊區域固定連接於所述定位部，且所述主要區域外露於所述定位部，其中，所述第一發光單元與所述第二發光單元都配置於所述主要區域內。The miniaturized light projection device according to the first item of the scope of patent application, wherein the heat dissipation base includes a positioning portion, the circuit substrate has a main area and a peripheral area located on one side of the main area, The peripheral area is fixedly connected to the positioning portion, and the main area is exposed outside the positioning portion, wherein the first light-emitting unit and the second light-emitting unit are both arranged in the main area.

如申請專利範圍第15項所述的微型化光線投射裝置，其中，所述散熱基座還包括一導熱部以及多個散熱結構，所述定位部從所述導熱部的一端延伸成型，所述散熱結構從所述導熱部的外壁延伸成型。The miniaturized light projection device according to the 15th patent application, wherein the heat dissipation base further includes a heat conduction part and a plurality of heat dissipation structures, the positioning part extends from one end of the heat conduction part, and the The heat dissipation structure extends from the outer wall of the heat conducting part to form.

如申請專利範圍第15項所述的微型化光線投射裝置，其還包括一轉接板，其固定連接於所述定位部，且與所述電路基板電性連接。The miniaturized light projection device described in item 15 of the scope of patent application further includes an adapter plate fixedly connected to the positioning portion and electrically connected to the circuit board.

如申請專利範圍第17項所述的微型化光線投射裝置，其中所述轉接板與所述電路基板被一起固定在所述定位部的一上表面上。The miniaturized light projection device according to the 17th patent application, wherein the adapter board and the circuit board are fixed together on an upper surface of the positioning portion.

如申請專利範圍第1項所述的微型化光線投射裝置，其中，所述第二反射單元為一反射罩且具有一底部開口，所述第二反射單元具有一第一焦點，其中，所述第二反射單元的所述第一焦點與所述配光透鏡的一透鏡焦點的連線位於所述第二底部開口的附近，且與所述透鏡光軸夾一預定角度為大於0度且小於15度。The miniaturized light projection device according to the first item of the patent application, wherein the second reflection unit is a reflection cover and has a bottom opening, the second reflection unit has a first focus, wherein the The line connecting the first focal point of the second reflecting unit and a lens focal point of the light distributing lens is located near the second bottom opening, and a predetermined angle with the optical axis of the lens is greater than 0 degrees and less than 15 degrees.

如申請專利範圍第2項所述的微型化光線投射裝置，其中，所述配光透鏡具有一透鏡焦點，其位置對應所述第二導光部的所述上表面，所述第二反射單元具有一反射面，且所述第二反射單元的所述反射面具有一第一焦點，且定義出兩條位置對應通過所述第一焦點與所述透鏡焦點的一連線的參考軸線，其中，兩條所述參考軸線定義出所述第二反射單元的一光軸。The miniaturized light projection device according to the second item of the scope of patent application, wherein the light distribution lens has a lens focal point whose position corresponds to the upper surface of the second light guide portion, and the second reflection unit It has a reflecting surface, and the reflecting mask of the second reflecting unit has a first focal point, and defines two reference axes corresponding to a line passing through the first focal point and the lens focal point, wherein , The two reference axes define an optical axis of the second reflecting unit.

如申請專利範圍第20項所述的微型化光線投射裝置，其中，所述反射面包括一第一反射曲面、一第二反射曲面以及一連接於所述第一反射曲面與所述第二反射曲面之間的連接面，且所述第一反射曲面的曲率半徑不同於所述第二反射曲面的曲率半徑。The miniaturized light projection device according to item 20 of the scope of patent application, wherein the reflective surface includes a first reflective curved surface, a second reflective curved surface, and a connection between the first reflective curved surface and the second reflective surface. The connecting surface between the curved surfaces, and the radius of curvature of the first reflective curved surface is different from the radius of curvature of the second reflective curved surface.

如申請專利範圍第2項所述的微型化光線投射裝置，其中，所述第一導光部具有兩個外側反射區域及一位於兩個所述外側反射區域之間的中央反射區域，所述第一導光部的所述上表面包括一第一反射平面、一第二反射平面及一連接於所述第一反射平面與所述第二反射平面之間的反射斜面，所述第一反射平面與所述第二反射平面分別位於兩個所述外側反射區域內，且所述第一反射平面的位置高於所述第二反射平面，所述反射斜面位於所述中央反射區域內。The miniaturized light projection device according to the second item of the scope of patent application, wherein the first light guide portion has two outer reflective regions and a central reflective region located between the two outer reflective regions, and The upper surface of the first light guide portion includes a first reflecting plane, a second reflecting plane, and a reflecting inclined plane connected between the first reflecting plane and the second reflecting plane. The first reflecting plane The plane and the second reflection plane are respectively located in the two outer reflection areas, and the position of the first reflection plane is higher than the second reflection plane, and the reflection slope is located in the central reflection area.

如申請專利範圍第22項所述的微型化光線投射裝置，其中，所述第二導光部具有兩個外側光學區域及一位於兩個所述外側光學區域之間的中央光學區域，所述第二導光部的所述上表面包括一第一光學平面、一第二光學平面及一連接於所述第一光學平面與所述第二光學平面之間的光學斜面，所述第一光學平面與所述第二光學平面分別位於兩個所述外側光學區域內，且所述第一光學平面的位置高於所述第二光學平面，所述光學斜面位於所述中央光學區域內。The miniaturized light projection device according to item 22 of the scope of patent application, wherein the second light guide portion has two outer optical regions and a central optical region located between the two outer optical regions, and The upper surface of the second light guide portion includes a first optical plane, a second optical plane, and an optical inclined plane connected between the first optical plane and the second optical plane. The plane and the second optical plane are respectively located in the two outer optical regions, and the position of the first optical plane is higher than the second optical plane, and the optical inclined plane is located in the central optical region.