TW202106445A - Retaining ring - Google Patents
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- TW202106445A TW202106445A TW108128172A TW108128172A TW202106445A TW 202106445 A TW202106445 A TW 202106445A TW 108128172 A TW108128172 A TW 108128172A TW 108128172 A TW108128172 A TW 108128172A TW 202106445 A TW202106445 A TW 202106445A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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Abstract
Description
本發明是有關於一種固定環，且特別是有關於一種用於化學機械研磨製程的固定環。The present invention relates to a fixed ring, and particularly relates to a fixed ring used in a chemical mechanical polishing process.
在產業的元件製造過程中，研磨製程是現今較常使用來使待研磨的物件表面達到平坦化的一種技術。在研磨製程中，物件是藉由其本身與研磨墊彼此進行相對運動，而使其表面逐漸平坦，來達到平坦化的目的。此外，亦可選擇於研磨過程中，供應具有化學品混合物之研磨漿料（polishing slurry）於研磨墊上，例如化學機械研磨（chemical mechanical polishing，CMP）製程，在機械效應與化學效應共同作用下，達成平坦化研磨物件表面。In the industrial device manufacturing process, the polishing process is a technology that is commonly used today to flatten the surface of the object to be polished. In the polishing process, the object itself and the polishing pad move relative to each other to gradually flatten the surface to achieve the goal of flattening. In addition, you can also choose to supply a polishing slurry with a chemical mixture on the polishing pad during the polishing process, such as a chemical mechanical polishing (CMP) process, under the combined action of mechanical and chemical effects, Achieve flattening the surface of the grinding object.
然而，研磨漿料中的磨料（abrasive）若未清洗乾淨的話，其可能會附著在研磨機台的各個難以清洗的角落，因而產生顆粒較大的結晶，當其掉落並殘留在研磨墊上時，則會造成欲研磨之物件的表面產生微刮痕（micro-scratch）的現象。However, if the abrasive in the polishing slurry is not cleaned, it may adhere to the difficult-to-clean corners of the polishing machine, resulting in crystals with larger particles. When it falls and remains on the polishing pad , It will cause the phenomenon of micro-scratch on the surface of the object to be polished.
本發明提供一種用於化學機械研磨製程的固定環，其可降低欲研磨之物件表面產生微刮痕（micro-scratch）的現象。The present invention provides a fixing ring used in a chemical mechanical polishing process, which can reduce the phenomenon of micro-scratch on the surface of an object to be polished.
本發明的用於化學機械研磨製程的固定環包括第一部分及第二部分。第二部分設置於第一部分上，且第二部分具有彼此相對的第一表面和第二表面，其中第二部分的第一表面具有多個第一溝槽，第二部分的第二表面鄰近第一部分，且相鄰的兩個第一溝槽之間的凸塊設置有孔。The fixed ring used in the chemical mechanical polishing process of the present invention includes a first part and a second part. The second part is disposed on the first part, and the second part has a first surface and a second surface opposite to each other, wherein the first surface of the second part has a plurality of first grooves, and the second surface of the second part is adjacent to the first surface. A part of the bump between two adjacent first grooves is provided with a hole.
在本發明的一實施例中，在上述的固定環中，第一溝槽從第二部分的內徑延伸至第二部分的外徑。In an embodiment of the present invention, in the above-mentioned fixing ring, the first groove extends from the inner diameter of the second part to the outer diameter of the second part.
在本發明的一實施例中，在上述的固定環中，第一溝槽的底面為斜面。In an embodiment of the present invention, in the above-mentioned fixing ring, the bottom surface of the first groove is an inclined surface.
在本發明的一實施例中，在上述的固定環中，在第二部分的外徑朝第二部分的內徑的方向上，第一溝槽的深度逐漸增加。In an embodiment of the present invention, in the above-mentioned fixing ring, the depth of the first groove gradually increases in the direction of the outer diameter of the second part toward the inner diameter of the second part.
在本發明的一實施例中，在上述的固定環中，第一溝槽的底面與第二部分的內壁構成的夾角大於90度且小於等於95度。In an embodiment of the present invention, in the above-mentioned fixing ring, the included angle formed by the bottom surface of the first groove and the inner wall of the second part is greater than 90 degrees and less than or equal to 95 degrees.
在本發明的一實施例中，在上述的固定環中，在第二部分的外徑朝第二部分的內徑的方向上，第一溝槽的寬度逐漸降低。In an embodiment of the present invention, in the above-mentioned fixing ring, the width of the first groove gradually decreases in the direction of the outer diameter of the second part toward the inner diameter of the second part.
在本發明的一實施例中，在上述的固定環中，第一部分與第二部分為一體化連接（integrated connection）。In an embodiment of the present invention, in the above-mentioned fixing ring, the first part and the second part are an integrated connection.
在本發明的一實施例中，在上述的固定環中，第一部分鄰近用於化學機械研磨製程的研磨墊。In an embodiment of the present invention, in the above-mentioned fixing ring, the first part is adjacent to the polishing pad used for the chemical mechanical polishing process.
在本發明的一實施例中，在上述的固定環中，第一部分的鄰近研磨墊的表面具有第二溝槽。In an embodiment of the present invention, in the above-mentioned fixing ring, the surface of the first part adjacent to the polishing pad has a second groove.
在本發明的一實施例中，在上述的固定環中，第二溝槽是從第一部分的內徑延伸至第一部分的外徑。In an embodiment of the present invention, in the above-mentioned fixing ring, the second groove extends from the inner diameter of the first part to the outer diameter of the first part.
基於上述，在本發明一實施例的固定環中，由於第二部分的第一表面具有多個第一溝槽，因此在對固定環進行清洗時，清洗液體可從第一溝槽進入到固定環的內緣，藉此改善磨料附著並結晶在固定環的內緣，進而避免微刮痕（micro-scratch）的現象產生。Based on the above, in the fixing ring of an embodiment of the present invention, since the first surface of the second part has a plurality of first grooves, when cleaning the fixing ring, the cleaning liquid can enter the fixing ring from the first grooves. The inner edge of the ring improves the adhesion and crystallization of the abrasive on the inner edge of the fixed ring, thereby avoiding the phenomenon of micro-scratch.
為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
參照本實施例之圖式以更全面地闡述本發明。然而，本發明亦可以各種不同的形式體現，而不應限於本文中所述之實施例。圖式中的層與區域的厚度會為了清楚起見而放大。相同或相似之參考號碼表示相同或相似之元件，以下段落將不再一一贅述。The present invention will be explained more fully with reference to the drawings of this embodiment. However, the present invention can also be embodied in various different forms and should not be limited to the embodiments described herein. The thickness of the layers and regions in the drawing will be exaggerated for clarity. The same or similar reference numbers indicate the same or similar elements, and the following paragraphs will not repeat them one by one.
應當理解，當諸如元件被稱為在另一元件「上」或「連接到」另一元件時，其可以直接在另一元件上或與另一元件連接，或者也可存在中間元件。若當元件被稱為「直接在另一元件上」或「直接連接到」另一元件時，則不存在中間元件。如本文所使用的，「連接」可以指物理及/或電性連接，而「電性連接」或「耦合」可為二元件間存在其它元件。It should be understood that when an element is referred to as being "on" or "connected to" another element, it can be directly on or connected to the other element, or intervening elements may also be present. If an element is said to be "directly on" or "directly connected to" another element, there are no intermediate elements. As used herein, "connection" can refer to physical and/or electrical connection, and "electrical connection" or "coupling" can mean that there are other elements between two elements.
本文使用的「約」、「近似」或「實質上」包括所提到的值和在所屬技術領域中具有通常知識者能夠確定之特定值的可接受的偏差範圍內的平均值，考慮到所討論的測量和與測量相關的誤差的特定數量（即，測量系統的限制）。例如，「約」可以表示在所述值的一個或多個標準偏差內，或±30％、±20％、±10％、±5％內。再者，本文使用的「約」、「近似」或「實質上」可依光學性質、蝕刻性質或其它性質，來選擇較可接受的偏差範圍或標準偏差，而可不用一個標準偏差適用全部性質。As used herein, "about", "approximately" or "substantially" includes the mentioned value and the average value within the acceptable deviation range of the specific value that can be determined by a person with ordinary knowledge in the technical field. The measurement in question and the specific number of errors associated with the measurement (ie, the limitations of the measurement system). For example, "about" can mean within one or more standard deviations of the stated value, or within ±30%, ±20%, ±10%, ±5%. Furthermore, the "about", "approximate" or "substantially" used herein can select a more acceptable deviation range or standard deviation based on optical properties, etching properties or other properties, and not one standard deviation can be applied to all properties .
使用本文中所使用的用語僅為闡述例示性實施例，而非限制本揭露。在此種情形中，除非在上下文中另有解釋，否則單數形式包括多數形式。The terms used herein are only used to illustrate exemplary embodiments, but not to limit the present disclosure. In this case, unless otherwise explained in the context, the singular form includes the majority form.
圖1A是依照本發明一實施例的固定環的俯視示意圖。圖1B是沿圖1A的剖線A-A’的剖面示意圖。圖2是將本發明一實施例的固定環用於化學機械研磨機台的剖面示意圖。FIG. 1A is a schematic top view of a fixing ring according to an embodiment of the present invention. Fig. 1B is a schematic cross-sectional view taken along the section line A-A' of Fig. 1A. Fig. 2 is a schematic cross-sectional view of applying a fixing ring according to an embodiment of the present invention to a chemical mechanical polishing machine table.
請同時參照圖1A、圖1B和圖2，用於化學機械研磨製程的固定環RR包括第一部分LR和第二部分UR。在本實施例中，固定環RR包括環狀的內壁IW和環狀的外壁OW，而欲研磨之物件（例如圖2所示之晶圓W）可固定在晶圓承載台WC上並設置在內壁IW所定義之開口中以避免滑動。1A, 1B and 2 at the same time, the fixed ring RR used in the chemical mechanical polishing process includes a first part LR and a second part UR. In this embodiment, the fixing ring RR includes a ring-shaped inner wall IW and a ring-shaped outer wall OW, and the object to be polished (for example, the wafer W shown in FIG. 2) can be fixed on the wafer carrier WC and set Avoid sliding in the opening defined by the inner wall IW.
在本實施例中，可藉由以下方法來對物件進行平坦化製程：對晶圓W及研磨墊PP提供相對運動，以利用研磨墊PP對晶圓W進行化學機械研磨製程，而達到平坦化的目的。在本實施例中，對晶圓W及研磨墊PP提供相對運動的方法例如是：透過承載台PT進行旋轉來帶動固定於承載台PT上的研磨墊PP旋轉。In this embodiment, the object can be planarized by the following method: provide relative motion to the wafer W and the polishing pad PP, so that the polishing pad PP is used to perform a chemical mechanical polishing process on the wafer W to achieve planarization. the goal of. In this embodiment, the method of providing relative movement to the wafer W and the polishing pad PP is, for example, rotating the carrying table PT to drive the polishing pad PP fixed on the carrying table PT to rotate.
第二部分UR設置於第一部分LR上，且第二部分UR具有彼此相對的第一表面S1和第二表面S2，其中第二部分UR的第二表面S2鄰近第一部分LR。在本實施例中，固定環RR的第一部分LR較第二部分UR鄰近研磨墊PP，也就是說，相對於研磨墊PP來說，第一部分LR可為固定環RR的下部分，而設置於第一部分LR上的第二部分UR可為固定環RR的上部分。在本實施例中，第二部分UR與第一部分LR可為一體化連接（integral connection）。換句話說，固定環RR的第一部分LR與第二部分UR直接接觸（第二部分UR的第二表面S2與第一部分LR直接接觸）。The second part UR is disposed on the first part LR, and the second part UR has a first surface S1 and a second surface S2 opposite to each other, wherein the second surface S2 of the second part UR is adjacent to the first part LR. In this embodiment, the first part LR of the fixing ring RR is closer to the polishing pad PP than the second part UR. That is to say, relative to the polishing pad PP, the first part LR can be the lower part of the fixing ring RR, and is arranged at The second part UR on the first part LR may be the upper part of the fixed ring RR. In this embodiment, the second part UR and the first part LR may be an integral connection. In other words, the first part LR of the fixed ring RR is in direct contact with the second part UR (the second surface S2 of the second part UR is in direct contact with the first part LR).
在本實施例中，可藉由清洗裝置（未繪示）來對固定環RR進行清洗。清洗裝置（例如噴水裝置）可整合於化學機械研磨的機台中，並朝向固定環RR的外壁OW進行噴水，如此可再不卸除固定環RR的情況下對其進行清洗以節省製程時間。In this embodiment, the fixed ring RR can be cleaned by a cleaning device (not shown). The cleaning device (such as a water spray device) can be integrated in the chemical mechanical polishing machine and spray water toward the outer wall OW of the fixed ring RR, so that the fixed ring RR can be cleaned without removing the fixed ring RR to save process time.
第二部分UR的第一表面S1具有多個第一溝槽T1，如此在對固定環RR進行清洗時，清洗液體F（例如水）可從第一溝槽T1進入到固定環RR的內緣（例如內壁IW），藉此改善磨料附著並結晶在固定環RR的內緣，進而避免因磨料結晶掉落所產生之微刮痕的現象。在本實施例中，第一溝槽T1可從第二部分UR的內徑延伸至第二部分UR的外徑。換句話說，第一溝槽T1可貫穿第二部分UR的內壁和外壁。在本實施例中，第一溝槽T1可朝固定環RR的中心延伸，但本發明不以此為限。在本實施例中，第一溝槽T1的深度D可介於0 mm~10 mm之間，但本發明不以此為限，只要第一溝槽T1的深度D小於第二部分UR的厚度即可。The first surface S1 of the second part UR has a plurality of first grooves T1, so when cleaning the fixed ring RR, the cleaning liquid F (for example, water) can enter the inner edge of the fixed ring RR from the first groove T1 (Such as the inner wall IW) to improve the adhesion and crystallization of the abrasive on the inner edge of the fixed ring RR, thereby avoiding the phenomenon of micro-scratches caused by the falling of the abrasive crystal. In this embodiment, the first groove T1 may extend from the inner diameter of the second portion UR to the outer diameter of the second portion UR. In other words, the first groove T1 may penetrate the inner wall and the outer wall of the second portion UR. In this embodiment, the first groove T1 may extend toward the center of the fixed ring RR, but the invention is not limited to this. In this embodiment, the depth D of the first trench T1 may be between 0 mm and 10 mm, but the present invention is not limited to this, as long as the depth D of the first trench T1 is less than the thickness of the second portion UR That's it.
在本實施例中，第一溝槽T1的底面可為斜面，舉例來說，在第二部分UR的外徑朝第二部分UR的內徑的方向上，第一溝槽T1的深度D可逐漸增加，亦即，第一溝槽T1的底面與第二部分UR的內壁（例如固定環RR的內壁IW）構成的夾角θ可大於90度。如此一來，清洗液體F能夠經由斜面而更容易地進入到固定環RR的內緣，故可進一步提升清洗固定環RR內緣的效率。在本實施例中，第一溝槽T1的底面與第二部分UR的內壁構成的夾角θ大於90度且小於等於95度。In this embodiment, the bottom surface of the first trench T1 may be a slope. For example, in the direction of the outer diameter of the second portion UR toward the inner diameter of the second portion UR, the depth D of the first trench T1 may be Gradually increase, that is, the included angle θ formed by the bottom surface of the first groove T1 and the inner wall of the second portion UR (for example, the inner wall IW of the fixing ring RR) may be greater than 90 degrees. In this way, the cleaning liquid F can more easily enter the inner edge of the fixed ring RR through the inclined surface, so the efficiency of cleaning the inner edge of the fixed ring RR can be further improved. In this embodiment, the included angle θ formed by the bottom surface of the first trench T1 and the inner wall of the second portion UR is greater than 90 degrees and less than or equal to 95 degrees.
在本實施例中，在第二部分UR的外徑朝第二部分UR的內徑的方向上，第一溝槽T1的寬度W可逐漸降低，例如第一溝槽T1於第二部分UR外緣處的寬度W1可大於第一溝槽T1於第二部分UR內緣處的寬度W2。如此一來，清洗液體F於固定環RR內緣的流速可大於清洗液體F於固定環RR外緣的流速（在相同流量的情況下），故能夠進一步提升清洗固定環RR內緣的效率。In this embodiment, the width W of the first groove T1 may gradually decrease in the direction of the outer diameter of the second portion UR toward the inner diameter of the second portion UR, for example, the first groove T1 is outside the second portion UR The width W1 at the edge may be greater than the width W2 of the first trench T1 at the inner edge of the second portion UR. In this way, the flow rate of the cleaning liquid F at the inner edge of the fixed ring RR can be greater than the flow rate of the cleaning liquid F at the outer edge of the fixed ring RR (under the same flow rate), so the efficiency of cleaning the inner edge of the fixed ring RR can be further improved.
在本實施例中，第二部分UR的相鄰的兩個第一溝槽T1之間的凸塊BP設置有孔H，其中孔H可具有螺紋鞘以接收如插栓、螺絲或其他固定構件，藉此將固定環RR固定至研磨頭PD上。孔H可以均等間隔的方式環繞分佈在第二部分UR中。In this embodiment, the protrusion BP between the two adjacent first grooves T1 of the second part UR is provided with a hole H, wherein the hole H may have a threaded sheath to receive a plug, screw or other fixing member. , Thereby fixing the fixing ring RR to the polishing head PD. The holes H can be distributed around the second part UR in an evenly spaced manner.
在本實施例中，第一部分LR的鄰近研磨墊PP的表面具有第二溝槽T2，其中第二溝槽T2是從第一部分LR的內徑延伸至第一部分LR的外徑。換句話說，第二溝槽T2可貫穿第一部分LR的內壁和外壁。In this embodiment, the surface of the first portion LR adjacent to the polishing pad PP has a second groove T2, wherein the second groove T2 extends from the inner diameter of the first portion LR to the outer diameter of the first portion LR. In other words, the second groove T2 may penetrate the inner wall and the outer wall of the first portion LR.
綜上所述，在上述實施例中的固定環中，由於第二部分的第一表面具有多個第一溝槽，因此在對固定環進行清洗時，清洗液體可從第一溝槽進入到固定環的內緣，藉此改善磨料附著並結晶在固定環的內緣，進而避免因磨料結晶掉落至研磨墊所產生之微刮痕的現象。In summary, in the fixing ring in the above embodiment, since the first surface of the second part has multiple first grooves, when cleaning the fixing ring, the cleaning liquid can enter from the first grooves. The inner edge of the fixed ring can improve the adhesion and crystallization of the abrasive on the inner edge of the fixed ring, thereby avoiding the phenomenon of micro-scratches caused by the abrasive crystal falling to the polishing pad.
雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.
RR:固定環 LR:第一部分 UR:第二部分 IW:內壁 OW:外壁 W:晶圓 PD:研磨頭 PP:研磨墊 PT:承載台 WC:晶圓承載台 S1:第一表面 S2:第二表面 T1:第一溝槽 T2:第二溝槽 F:清洗液體 D:深度 θ:夾角 W、W1、W2:寬度 BP:凸塊 H:孔 A-A’:剖線RR: fixed ring LR: Part One UR: part two IW: inner wall OW: Outer wall W: Wafer PD: Grinding head PP: polishing pad PT: bearing platform WC: Wafer Carrier S1: First surface S2: second surface T1: The first groove T2: second groove F: Cleaning liquid D: depth θ: included angle W, W1, W2: width BP: bump H: Hole A-A’: Sectional line
圖1A是依照本發明一實施例的固定環的俯視示意圖。 圖1B是沿圖1A的剖線A-A’的剖面示意圖。 圖2是將本發明一實施例的固定環用於化學機械研磨機台的剖面示意圖。FIG. 1A is a schematic top view of a fixing ring according to an embodiment of the present invention. Fig. 1B is a schematic cross-sectional view taken along the section line A-A' of Fig. 1A. Fig. 2 is a schematic cross-sectional view of applying a fixing ring according to an embodiment of the present invention to a chemical mechanical polishing machine.
RR:固定環 RR: fixed ring
LR:第一部分 LR: Part One
UR:第二部分 UR: part two
IW:內壁 IW: inner wall
OW:外壁 OW: Outer wall
S1:第一表面 S1: First surface
S2:第二表面 S2: second surface
T1:第一溝槽 T1: The first groove
T2:第二溝槽 T2: second groove
W1、W2:寬度 W1, W2: width
BP:凸塊 BP: bump
H:孔 H: Hole
A-A’:剖線 A-A’: Sectional line
Claims (10)
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108128172A TW202106445A (en) | 2019-08-08 | 2019-08-08 | Retaining ring |
| CN201910821982.3A CN112338796A (en) | 2019-08-08 | 2019-09-02 | Fixing ring |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW108128172A TW202106445A (en) | 2019-08-08 | 2019-08-08 | Retaining ring |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202106445A true TW202106445A (en) | 2021-02-16 |
Family
ID=74367847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108128172A TW202106445A (en) | 2019-08-08 | 2019-08-08 | Retaining ring |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112338796A (en) |
| TW (1) | TW202106445A (en) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7186171B2 (en) * | 2005-04-22 | 2007-03-06 | Applied Materials, Inc. | Composite retaining ring |
| CN201249404Y (en) * | 2008-07-25 | 2009-06-03 | 孙建忠 | Grinding positioning ring |
| CN201346740Y (en) * | 2008-11-10 | 2009-11-18 | 孙建忠 | Wafer grinding positioning ring |
| US20150050870A1 (en) * | 2013-08-13 | 2015-02-19 | Cnus Co., Ltd. | Retainer ring structure for chemical-mechanical polishing machine |
| TW201524680A (en) * | 2013-12-30 | 2015-07-01 | Interbest Global Inc | Retaining ring with side holes for applying to chemical mechanical polishing |
| WO2017146719A1 (en) * | 2016-02-26 | 2017-08-31 | Intel Corporation | Wafer retainer rings for chemical mechanical polishing |
-
2019
- 2019-08-08 TW TW108128172A patent/TW202106445A/en unknown
- 2019-09-02 CN CN201910821982.3A patent/CN112338796A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN112338796A (en) | 2021-02-09 |
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