TW202046528A - Bonding device, bonding method, and display device production method - Google Patents

Bonding device, bonding method, and display device production method Download PDF

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TW202046528A
TW202046528A TW109118438A TW109118438A TW202046528A TW 202046528 A TW202046528 A TW 202046528A TW 109118438 A TW109118438 A TW 109118438A TW 109118438 A TW109118438 A TW 109118438A TW 202046528 A TW202046528 A TW 202046528A
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suction
photographing
suction part
stage
wafer
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TW109118438A
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TWI844683B (en
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柳川良勝
平野貴文
大倉直也
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日商Ｖ科技股份有限公司
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    • H01—ELECTRIC ELEMENTS
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    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
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  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
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Abstract

The present invention can pressurize an entire surface substantially uniformly, in a highly precisely positioned state. A substantially planar first suction section suctions a substantially planar first member thereto, a substantially planar second suction section provided on the upper side, in the vertical direction, of the first suction section suctions a transparent and substantially planar second member thereto, and the two members are bonded together. The second suction section is a substantially tubular member having both ends thereof covered. The lower surface of the second suction section is a transparent suction pad having a throughhole formed therein that penetrates in the thickness direction. The second member is suctioned to the suction pad by air being drawn into the throughhole through a suction port. The surface on the upper side of the second suction section has at least part thereof formed from a transparent member. An imaging unit provided on the upper side of the second suction section in the vertical direction captures an image of the first member and/or the second member via the transparent member and the suction pad.

Description

貼合裝置、貼合方法及顯示裝置之製造方法Laminating device, laminating method and manufacturing method of display device

本發明係關於貼合裝置、貼合方法及顯示裝置之製造方法。The present invention relates to a bonding device, a bonding method, and a manufacturing method of a display device.

專利文獻1中，揭示一種元件轉印裝置，其具有：基板保持部，其以使轉印基板及暫時保持基板對向之狀態進行支持；攝影機，其拍攝轉印基板之對準標記，並且通過轉印基板拍攝暫時保持基板之對準標記；位置對準手段，其使轉印基板及暫時保持基板之位置對準；及加壓手段，其於暫時保持基板向轉印基板側成為凸起之彎曲狀態之方向對暫時保持基板進行加壓。 [現有技術文獻] [專利文獻]Patent Document 1 discloses a device transfer device, which has a substrate holding portion that supports the transfer substrate and temporarily holding the substrate in a state of opposing; a camera that photographs the alignment mark of the transfer substrate and passes The transfer substrate photographs the alignment mark of the temporary holding substrate; the positioning means, which aligns the position of the transfer substrate and the temporary holding substrate; and the pressure means, which becomes a convex when the temporary holding substrate faces the transfer substrate The direction of the bent state pressurizes the temporarily held substrate. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本特開2009-295853號公報[Patent Document 1] JP 2009-295853 A

[發明所欲解決之問題][The problem to be solved by the invention]

於專利文獻1所記載之發明中，由於在向轉印基板側成為凸起之彎曲狀態之方向對暫時保持基板進行加壓，因此轉印基板亦成為彎曲狀態。因此，於進行將形成有LED之晶圓及電路基板貼合之步驟時，若使用專利文獻1所記載之發明，則無法大致均勻地對表面整體進行加壓，有產生破壞LED、LED之不均勻之點亮或晶圓裂開之虞。In the invention described in Patent Document 1, since the temporarily holding substrate is pressed in a direction that becomes a convex curved state toward the transfer substrate side, the transfer substrate also becomes a curved state. Therefore, if the invention described in Patent Document 1 is used in the step of bonding a wafer on which LEDs are formed and a circuit board, the entire surface cannot be pressurized substantially uniformly, which may cause damage to the LEDs and LEDs. There is a risk of uniform lighting or wafer cracking.

本發明係鑒於此種事情而完成者，目的在於提供於以較高精度進行位置對準之狀態下，能夠大致均勻地對表面整體進行加壓之貼合裝置、貼合方法及顯示裝置之製造方法。 [解決問題之手段]The present invention was made in view of such matters, and its purpose is to provide a bonding device, a bonding method, and a display device that can substantially uniformly pressurize the entire surface while aligning with high accuracy. method. [Means to Solve the Problem]

為了解決上述課題，本發明之貼合裝置例如係將大致板狀之第1構件及透明的大致板狀之第2構件貼合之貼合裝置，其特徵在於具備：大致板狀之第1吸附部，其吸附上述第1構件；大致板狀之第2吸附部，其設於上述第1吸附部之鉛直方向上側，且吸附上述第2構件；第1移動部，其使上述第1吸附部或上述第2吸附部於上下方向移動；第2移動部，其使上述第1吸附部於水平方向移動；及攝影部，其設於上述第2吸附部之鉛直方向上側；且上述第2吸附部為兩端被覆蓋之大致筒狀之構件，設有吸引空氣之吸引口，上述第2吸附部之上側之面係至少一部分由透明構件形成，上述第2吸附部之下側之面為形成有貫通厚度方向之孔之透明的吸附墊，上述攝影部透過上述透明構件及上述吸附墊拍攝上述第1構件及/或上述第2構件。In order to solve the above-mentioned problems, the laminating device of the present invention is, for example, a laminating device for laminating a substantially plate-shaped first member and a transparent substantially plate-shaped second member, and is characterized by having: a substantially plate-shaped first suction Section, which adsorbs the first member; a substantially plate-shaped second suction section, which is provided on the upper side of the vertical direction of the first suction section, and adsorbs the second member; the first moving section, which makes the first suction section Or the second suction part moves in the vertical direction; the second moving part moves the first suction part in the horizontal direction; and the photographing part is provided on the upper side of the vertical direction of the second suction part; and the second suction part The part is a substantially cylindrical member covered at both ends and is provided with a suction port for sucking air. At least a part of the upper surface of the second suction part is formed of a transparent member, and the lower surface of the second suction part is formed A transparent suction pad having a hole penetrating through the thickness direction, and the imaging section photographs the first member and/or the second member through the transparent member and the suction pad.

根據本發明之貼合裝置，大致板狀之第1吸附部吸附大致板狀之第1構件，設於第1吸附部之鉛直方向上側之大致板狀之第2吸附部吸附透明的大致板狀之第2構件，而將該等貼合。第2吸附部為兩端被覆蓋之大致筒狀之構件，第2吸附部之下側之面為形成有貫通厚度方向之孔之透明的吸附墊，藉由自吸引口吸引空氣而將第2構件吸附於吸附墊。第2吸附部之上側之面係至少一部分由透明構件形成，設於第2吸附部之鉛直方向上側之攝影部透過透明構件、吸附墊拍攝第1構件及/或第2構件。藉由攝影部直接觀察第1構件或第2構件，能夠以較高精度進行位置對準。又，藉由以大致板狀之第1吸附部及第2吸附部夾住第1構件及第2構件，能夠大致均勻地對表面整體進行加壓。According to the laminating device of the present invention, the substantially plate-shaped first suction portion suctions the substantially plate-shaped first member, and the substantially plate-shaped second suction portion provided on the upper side of the vertical direction of the first suction portion suctions the transparent substantially plate-shaped The second member is attached to these. The second suction part is a substantially cylindrical member covered at both ends, and the surface below the second suction part is a transparent suction pad with holes penetrating the thickness direction. The component is adsorbed on the adsorption pad. At least a part of the upper surface of the second suction part is formed of a transparent member, and the imaging part provided on the vertical upper side of the second suction part photographs the first member and/or the second member through the transparent member and the suction pad. By directly observing the first member or the second member by the imaging unit, position alignment can be performed with high accuracy. In addition, by sandwiching the first member and the second member with the substantially plate-shaped first suction portion and the second suction portion, it is possible to substantially uniformly pressurize the entire surface.

此處，上述第1構件及上述第2構件於一者形成有複數個LED，於另一者形成有連接圖案，具備連接於電源之複數個探針，上述探針可於抵接於上述連接圖案之位置與未抵接之位置之間於上下方向移動。藉此，可利用貼合裝置進行LED之點亮確認。Here, the first member and the second member have a plurality of LEDs formed on one of them, and a connection pattern is formed on the other, and are provided with a plurality of probes connected to a power source. The probes can abut against the connection Move between the position of the pattern and the non-contact position in the up and down direction. In this way, the bonding device can be used to confirm the lighting of the LED.

此處，具備使上述第2吸附部於水平方向移動之第3移動部，上述第3移動部為大致筒狀之構件，設於上述第2吸附部之鉛直方向上側亦可。藉此，攝影部可透過第3移動部、透明構件及吸附墊拍攝第1構件及/或第2構件。Here, a third moving part that moves the second suction part in a horizontal direction is provided. The third moving part is a substantially cylindrical member and may be provided on the upper side of the second suction part in the vertical direction. Thereby, the photographing part can photograph the first member and/or the second member through the third moving part, the transparent member, and the suction pad.

此處，亦可具備：大致柱狀之安裝部，其保持上述攝影部及上述第2吸附部；光照射部，其以高度位於上述攝影部與上述第2吸附部之間之方式設於上述安裝部；及反射鏡，其以可於與上述攝影部之光路重疊之位置與未重疊之位置之間於水平方向移動之方式設置。藉此，可使用光硬化性樹脂連接第1構件及第2構件。Here, it may also be provided with: a substantially columnar mounting portion that holds the imaging portion and the second suction portion; and a light irradiating portion that is provided on the above-mentioned section so that the height is located between the imaging portion and the second suction portion The mounting part; and the reflecting mirror, which is arranged in a way that can be moved in the horizontal direction between the position where the light path of the above-mentioned photographing part overlaps and the position where the light path is not overlapped. Thereby, the first member and the second member can be connected using the photocurable resin.

此處，亦可具備：第1控制部，其一面利用上述攝影部透過上述第2吸附部及上述第2構件拍攝上述第1構件進行觀察，一面控制上述第2移動部使上述第1吸附部移動。藉此，可以較高精度進行位置對準。Here, it may also be provided with: a first control section, one side of which is observed by imaging the first member through the second suction section and the second member by the imaging section, and controlling the second moving section so that the first suction section mobile. As a result, position alignment can be performed with higher accuracy.

此處，亦可具備：第4移動部，其使上述探針於上下方向移動；及第2控制部，其控制上述第1移動部對上述第1構件及上述第2構件進行加壓，於該加壓之狀態下控制上述第4移動部使上述探針抵接於上述連接圖案。如此，藉由於連接第1構件及第2構件前確認LED之點亮，可於LED未被點亮之情形時將第1構件及第2構件分離，並修正故障。因此，能夠提高製造時之良率。Here, it may also be provided with: a fourth moving part which moves the probe in the vertical direction; and a second control part which controls the first moving part to press the first member and the second member, In this pressurized state, the fourth moving part is controlled so that the probe abuts against the connection pattern. In this way, by confirming the lighting of the LED before connecting the first member and the second member, the first member and the second member can be separated when the LED is not turned on, and the malfunction can be corrected. Therefore, the yield during manufacturing can be improved.

為了解決上述課題，本發明之貼合方法之特徵在於例如具有：於大致板狀之第1吸附部載置板狀之第1構件，於設於上述第1吸附部之鉛直方向上側之透明的大致板狀之第2吸附部吸附透明的板狀之第2構件，將上述第1構件及上述第2構件配置為大致平行之步驟；一面利用設於上述第2吸附部之鉛直方向上側之攝影部透過上述第2吸附部及上述第2構件拍攝上述第1構件進行觀察，一面使上述第1構件於水平方向移動，進行上述第1構件與上述第2構件之位置對準之步驟；及對上述第1構件及上述第2構件進行加壓之步驟。藉此，於以較高精度進行位置對準之狀態下，能夠大致均勻地對表面整體進行加壓。In order to solve the above-mentioned problems, the bonding method of the present invention is characterized by, for example, placing a plate-shaped first member on a substantially plate-shaped first suction part, and a transparent transparent material provided on the vertical upper side of the first suction part. The step of arranging the first member and the second member to be substantially parallel to the substantially plate-shaped second suction part sucking the transparent plate-shaped second member; one side utilizes the photography provided on the upper side of the vertical direction of the second suction part The section photographs the first member through the second suction section and the second member for observation, while moving the first member in the horizontal direction to perform the step of aligning the first member and the second member; and The step of applying pressure to the first member and the second member. Thereby, the entire surface can be pressurized substantially uniformly in a state where the position alignment is performed with higher accuracy.

此處，上述第1構件及上述第2構件於一者形成有複數個LED，於另一者形成有連接圖案，於上述第1構件及/或上述第2構件塗佈接著劑，具有：於對上述第1構件及上述第2構件進行加壓之狀態下移動探針，將上述探針抵接於上述連接圖案而點亮上述LED之步驟；利用上述攝影部拍攝上述第1構件及上述第2構件，以該拍攝之圖像確認上述LED之點亮之步驟；及於上述LED全部點亮之情形時，使上述接著劑硬化之步驟亦可。如此，藉由於連接第1構件及第2構件前確認LED之點亮，可於LED未被點亮之情形時將第1構件及第2構件分離，並修正故障。因此，能夠提高製造時之良率。Here, the first member and the second member have a plurality of LEDs formed on one of them, a connection pattern is formed on the other, and an adhesive is applied to the first member and/or the second member, and has: The step of moving the probe while pressing the first member and the second member, and contacting the probe with the connection pattern to light up the LED; and photographing the first member and the first member by the imaging unit 2 components, the step of confirming the lighting of the above-mentioned LED with the captured image; and the step of curing the above-mentioned adhesive when all the above-mentioned LEDs are turned on. In this way, by confirming the lighting of the LED before connecting the first member and the second member, the first member and the second member can be separated when the LED is not turned on, and the malfunction can be corrected. Therefore, the yield during manufacturing can be improved.

此處，亦可利用如下步驟將上述第1構件及上述第2構件配置為大致平行：於上述第1吸附部載置上述第2構件之步驟；一面利用上述攝影部透過上述第2吸附部拍攝上述第2構件進行觀察，一面使上述第1吸附部於水平方向移動之步驟；以上述第2吸附部吸附上述第2構件之步驟；及於上述第1吸附部載置上述第1構件之步驟。藉此，可一面利用1個攝影部直接觀察第1構件或第2構件一面進行對準。其結果，可以較高精度進行位置對準。Here, the first member and the second member can also be arranged substantially in parallel by the following steps: the step of placing the second member on the first suction part; while using the photographing part to shoot through the second suction part Observing the second member, the step of moving the first suction part in the horizontal direction; the step of sucking the second member by the second suction part; and the step of placing the first member on the first suction part . Thereby, it is possible to perform alignment while directly observing the first member or the second member with one imaging section. As a result, position alignment can be performed with higher accuracy.

為了解決上述課題，本發明之顯示裝置之製造方法例如係包括將於一者形成有複數個LED，於另一者形成有連接圖案之大致板狀之第1構件及透明的大致板狀之第2構件貼合之貼合步驟之顯示裝置之製造方法，其特徵在於：上述貼合步驟具有如下步驟：於大致板狀之第1吸附部載置上述第1構件，於設於上述第1吸附部之鉛直方向上側之透明的大致板狀之第2吸附部吸附上述第2構件，將上述第1構件及上述第2構件配置為大致平行之步驟；一面利用設於上述第2吸附部之鉛直方向上側之攝影部透過上述第2吸附部及上述第2構件拍攝上述第1構件進行觀察，一面使上述第1構件於水平方向移動，進行上述第1構件與上述第2構件之位置對準之步驟；及對上述第1構件及上述第2構件進行加壓之步驟。In order to solve the above-mentioned problems, the manufacturing method of the display device of the present invention includes, for example, forming a substantially plate-shaped first member having a plurality of LEDs on one side and a connection pattern on the other and a transparent substantially plate-shaped first member. A method of manufacturing a display device with a bonding step of 2 member bonding, characterized in that: the bonding step has the following steps: the first member is placed on a substantially plate-shaped first suction part, and the first member is placed on the first suction part. The step of arranging the first member and the second member to be substantially parallel to the transparent substantially plate-shaped second suction portion on the upper side of the vertical direction of the portion; one side uses the vertical provided on the second suction portion The photographing section on the upper side of the direction photographs the first member through the second suction section and the second member for observation. While moving the first member in the horizontal direction, the first member and the second member are aligned. Step; and the step of applying pressure to the first member and the second member.

此處，於上述第1構件及/或上述第2構件塗佈接著劑，上述貼合步驟具有：於對上述第1構件及上述第2構件進行加壓之狀態下移動探針，將上述探針抵接於上述連接圖案而點亮上述LED之步驟；利用上述攝影部拍攝上述第1構件及上述第2構件，以該拍攝之圖像確認上述LED之點亮之步驟；及於上述LED全部點亮之情形時，使上述接著劑硬化之步驟亦可。Here, an adhesive is applied to the first member and/or the second member, and the bonding step includes: moving the probe in a state where the first member and the second member are pressurized, and the probe The step of illuminating the LED by the needle abutting the connection pattern; the step of photographing the first member and the second member by the photographing unit, and confirming the lighting of the LED with the captured image; and the step of all the LEDs In the case of lighting, the step of hardening the above-mentioned adhesive is also acceptable.

此處，亦可利用如下步驟將上述第1構件及上述第2構件配置為大致平行：於上述第1吸附部載置上述第2構件之步驟；一面利用上述攝影部透過上述第2吸附部拍攝上述第2構件進行觀察，一面使上述第1吸附部於水平方向移動之步驟；以上述第2吸附部吸附上述第2構件之步驟；及於上述第1吸附部載置上述第1構件之步驟。 [發明之效果]Here, the first member and the second member can also be arranged substantially in parallel by the following steps: the step of placing the second member on the first suction part; while using the photographing part to shoot through the second suction part Observing the second member, the step of moving the first suction part in the horizontal direction; the step of sucking the second member by the second suction part; and the step of placing the first member on the first suction part . [Effects of Invention]

根據本發明，於以較高精度進行位置對準之狀態下，能夠大致均勻地對表面整體進行加壓。According to the present invention, the entire surface can be pressurized substantially uniformly in a state in which position alignment is performed with high accuracy.

以下，參照圖式對本發明之實施形態詳細地進行說明。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

＜第1實施形態＞ 圖1係表示使用本發明之製造裝置或製造方法而製造之顯示裝置1之概略之圖。顯示裝置1為複數個微型LED配置為矩陣狀之全彩LED顯示面板，以彩色顯示映像。<The first embodiment> FIG. 1 is a diagram showing the outline of a display device 1 manufactured using the manufacturing apparatus or manufacturing method of the present invention. The display device 1 is a full-color LED display panel in which a plurality of micro LEDs are arranged in a matrix to display images in color.

圖1係表示顯示裝置1之概略之俯視圖。顯示裝置1於大致板狀之電路基板亦即電路基板10配置有複數個LED 20。LED 20為大致50 μm×大致50 μm以下大小之超小型LED，例如發射紫外光（波長為385 nm）。由於LED 20之構造已為公知，因此省略詳細說明。FIG. 1 is a plan view showing the outline of the display device 1. In the display device 1, a plurality of LEDs 20 are arranged on a circuit substrate 10 that is substantially plate-shaped. The LED 20 is an ultra-small LED with a size of approximately 50 μm × approximately 50 μm, for example, emitting ultraviolet light (wavelength is 385 nm). Since the structure of the LED 20 is already well-known, a detailed description is omitted.

LED 20於縱向、橫向連續排列。於LED 20之上側，設有具有紅色螢光發光層30R、綠色螢光發光層30G及藍色螢光發光層30B之螢光發光層30。The LED 20 is arranged continuously in the vertical and horizontal directions. On the upper side of the LED 20, a fluorescent light emitting layer 30 having a red fluorescent light emitting layer 30R, a green fluorescent light emitting layer 30G, and a blue fluorescent light emitting layer 30B is provided.

圖2係表示顯示裝置1之概略之局部剖視圖。電路基板10為透光基板，例如使用藍寶石玻璃形成。於電路基板10，設有具有連接LED 20之連接圖案12（參照圖3）之配線圖案11。於配線圖案11接著LED 20，配線圖案11上之連接圖案12與LED 20之p電極22及n電極23電性連接。FIG. 2 is a partial cross-sectional view showing the outline of the display device 1. The circuit substrate 10 is a light-transmitting substrate, and is formed of, for example, sapphire glass. The circuit board 10 is provided with a wiring pattern 11 having a connection pattern 12 (see FIG. 3) for connecting the LED 20. The LED 20 is connected to the wiring pattern 11, and the connection pattern 12 on the wiring pattern 11 is electrically connected to the p-electrode 22 and the n-electrode 23 of the LED 20.

以覆蓋LED 20之方式設有平坦化膜32，於平坦化膜32之上側，設有螢光發光層30、及隔開螢光發光層30之間隔壁31。於間隔壁31之表面設有防止混色之金屬膜（省略圖示）。A planarizing film 32 is provided to cover the LED 20, and on the upper side of the planarizing film 32, a fluorescent light-emitting layer 30 and a partition wall 31 separating the fluorescent light-emitting layer 30 are provided. A metal film (not shown) is provided on the surface of the partition wall 31 to prevent color mixing.

各LED 20成為子像素，R、G、B之3色子像素構成1像素。於本實施形態中，子像素為條狀排列（參照圖1），但子像素之排列亦可為馬賽克排列、三角排列等。Each LED 20 becomes a sub-pixel, and the three-color sub-pixels of R, G, and B constitute one pixel. In this embodiment, the sub-pixels are arranged in stripes (refer to FIG. 1), but the arrangement of the sub-pixels may also be a mosaic arrangement, a triangular arrangement, and the like.

於配線圖案11電性連接有驅動電路40。驅動電路40將驅動訊號供給至各LED 20，對各LED 20分別進行接通/斷開驅動而使其點亮/熄滅。The driving circuit 40 is electrically connected to the wiring pattern 11. The drive circuit 40 supplies a drive signal to each LED 20, and drives each LED 20 on/off to turn on/off.

圖3、4係示意性表示顯示裝置1之製造方法之圖。 ＜步驟1＞如圖3（A）所示，製作形成有配線圖案11或連接圖案12（省略圖示）之電路基板10。電路基板10為大致板狀之構件。電路基板10可透明，亦可不透明。3 and 4 are diagrams schematically showing the manufacturing method of the display device 1. <Step 1> As shown in FIG. 3(A), a circuit board 10 on which a wiring pattern 11 or a connection pattern 12 (not shown) is formed is produced. The circuit board 10 is a substantially plate-shaped member. The circuit substrate 10 may be transparent or opaque.

＜步驟2＞如圖3（B）所示，於用於連接配線圖案11或LED 20之連接圖案12之上塗佈接著劑41。接著劑41可塗佈於配線圖案11及連接圖案12，亦可塗佈於配線圖案11或連接圖案12之任一者。較理想為於接著劑41使用具有導電性之樹脂，例如混合碳或金屬（例如銀）之樹脂。塗佈該接著劑之步驟具有：使用塗佈機等於配線圖案11上塗佈接著劑之步驟；以大致90℃加熱2分鐘左右使溶液蒸發之預烘烤步驟；於電路基板10之上載置遮罩101進行對準之步驟；於常溫下曝光而利用光使接著劑硬化（暫時硬化），將遮罩101之圖案轉印至接著劑之曝光步驟；及去除未硬化之接著劑之顯影步驟。<Step 2> As shown in FIG. 3(B), an adhesive 41 is applied on the connection pattern 12 for connecting the wiring pattern 11 or the LED 20. The adhesive 41 may be applied to the wiring pattern 11 and the connection pattern 12, or may be applied to any one of the wiring pattern 11 or the connection pattern 12. It is preferable to use a conductive resin for the adhesive 41, such as a resin mixed with carbon or metal (such as silver). The step of applying the adhesive includes: using a coater equal to the step of applying the adhesive on the wiring pattern 11; a pre-baking step of heating at approximately 90°C for about 2 minutes to evaporate the solution; placing a mask on the circuit substrate 10 The mask 101 performs an alignment step; exposes at room temperature and uses light to harden the adhesive (temporarily hardened), an exposure step to transfer the pattern of the mask 101 to the adhesive; and a development step to remove the uncured adhesive.

＜步驟3＞如圖3（C）所示，將形成有複數個LED 20之透明的大致板狀之晶圓25、及塗佈有接著劑之電路基板10貼合，將LED 20固定於連接圖案上。關於該貼合步驟，於後文詳細說明。<Step 3> As shown in FIG. 3(C), a transparent substantially plate-shaped wafer 25 formed with a plurality of LEDs 20 and a circuit board 10 coated with an adhesive are bonded together, and the LED 20 is fixed to the connection Pattern on. This bonding step will be described in detail later.

＜步驟4＞於電路基板10固定LED 20後，如圖3（D）所示，以覆蓋LED 20之方式形成平坦化膜32。該平坦化膜形成步驟具有：使用塗佈機等於配線圖案11上塗佈平坦化膜32之材料之步驟；進行加熱使溶液蒸發之預烘烤步驟；於電路基板10之上載置遮罩102進行對準之步驟；於常溫下曝光而使平坦化膜32硬化之曝光步驟；去除未硬化之平坦化膜之材料之顯影步驟；及去除水分等之後烘烤步驟。<Step 4> After fixing the LED 20 to the circuit board 10, as shown in FIG. 3(D), a planarization film 32 is formed so as to cover the LED 20. The step of forming a flattening film includes: using a coater to coat the material of the flattening film 32 on the wiring pattern 11; performing a pre-baking step of heating to evaporate the solution; placing a mask 102 on the circuit substrate 10 The step of alignment; the step of exposing at room temperature to harden the planarization film 32; the step of developing to remove the material of the uncured planarization film; and the step of baking after removing moisture.

＜步驟5＞如圖3（E）所示，於平坦化膜32之上側形成間隔壁31。該間隔壁形成步驟具有：使用塗佈機等於配線圖案11上塗佈間隔壁31之材料之步驟；進行加熱使溶液蒸發之預烘烤步驟；於電路基板10之上載置遮罩103進行對準之步驟；於常溫下曝光而使間隔壁31硬化之曝光步驟；去除未硬化之間隔壁之材料之顯影步驟；及去除水分之後烘烤步驟等。<Step 5> As shown in FIG. 3(E), a partition wall 31 is formed on the upper side of the planarizing film 32. The step of forming the partition wall includes: using a coater to coat the material of the partition wall 31 on the wiring pattern 11; performing a pre-baking step of heating to evaporate the solution; placing a mask 103 on the circuit substrate 10 for alignment The steps of: exposure at room temperature to harden the partition wall 31; the development step of removing the material of the uncured partition wall; and the baking step after removing moisture.

＜步驟6＞如圖3（F）所示，對步驟5中形成之間隔壁31進行鍍覆處理，於間隔壁31及平坦化膜32之表面形成金屬膜33。鍍覆處理例如可採用無電解鍍Ni處理等。<Step 6> As shown in FIG. 3(F), the partition wall 31 formed in step 5 is plated, and a metal film 33 is formed on the surface of the partition wall 31 and the planarization film 32. For the plating treatment, for example, electroless Ni plating treatment or the like can be adopted.

＜步驟7＞如圖3（G）所示，去除步驟6中形成之金屬膜33中之形成於平坦化膜32之表面之金屬膜33。於本實施形態中，利用雷射加工去除金屬膜。<Step 7> As shown in FIG. 3(G), the metal film 33 formed on the surface of the planarization film 32 among the metal films 33 formed in the step 6 is removed. In this embodiment, the metal film is removed by laser processing.

＜步驟8＞如圖4（A）所示，於間隔壁31之間填充含有紅色螢光色素（顏料或染料）之螢光發光抗蝕劑並使其硬化，形成紅色螢光發光層30R。紅色螢光發光層30R形成步驟具有：使用刮刀將螢光發光抗蝕劑填充於間隔壁31之間之步驟；進行加熱使溶液蒸發之預烘烤步驟；於電路基板10之上載置遮罩104進行對準之步驟；於常溫下曝光而使紅色螢光發光層30R硬化之曝光步驟；去除未硬化之螢光發光抗蝕劑之顯影步驟；及去除水分等之後烘烤步驟。<Step 8> As shown in FIG. 4(A), a fluorescent light-emitting resist containing a red fluorescent pigment (pigment or dye) is filled between the partition walls 31 and cured to form a red fluorescent light-emitting layer 30R. The step of forming the red fluorescent light-emitting layer 30R includes: using a doctor blade to fill the fluorescent light-emitting resist between the partition walls 31; performing a pre-baking step of heating to evaporate the solution; and placing a mask 104 on the circuit substrate 10 Perform the alignment step; the exposure step of exposing at room temperature to harden the red fluorescent light-emitting layer 30R; the development step of removing the uncured fluorescent light-emitting resist; and the baking step after removing moisture.

＜步驟9＞如圖4（B）所示，於間隔壁31之間填充含有綠色螢光色素之螢光發光抗蝕劑並使其硬化，形成綠色螢光發光層30G。綠色螢光發光層30G形成步驟於使用遮罩105一點以外，與紅色螢光發光層30R形成步驟大致相同，因此省略說明。<Step 9> As shown in FIG. 4(B), a fluorescent light-emitting resist containing a green fluorescent dye is filled between the partition walls 31 and cured to form a green fluorescent light-emitting layer 30G. The steps of forming the green fluorescent light-emitting layer 30G are substantially the same as the steps of forming the red fluorescent light-emitting layer 30R except for one point using the mask 105, so the description is omitted.

＜步驟10＞如圖4（C）所示，於間隔壁31之間填充含有藍色螢光色素之螢光發光抗蝕劑並使其硬化，形成藍色螢光發光層30B。藍色螢光發光層30B形成步驟於使用遮罩106一點以外，與紅色螢光發光層30R形成步驟大致相同，因此省略說明。<Step 10> As shown in FIG. 4(C), a fluorescent light-emitting resist containing a blue fluorescent dye is filled between the partition walls 31 and cured to form a blue fluorescent light-emitting layer 30B. The steps of forming the blue fluorescent light-emitting layer 30B are substantially the same as the steps of forming the red fluorescent light-emitting layer 30R except for one point where the mask 106 is used, so the description is omitted.

＜步驟11＞如圖4（D）所示，於配線圖案11安裝硬質軟性基板43。再者，亦可將硬質軟性基板以外之基板安裝於配線圖案11。<Step 11> As shown in FIG. 4(D), a rigid flexible substrate 43 is mounted on the wiring pattern 11. Furthermore, a substrate other than a rigid flexible substrate may be mounted on the wiring pattern 11.

＜步驟12＞如圖4（E）所示，於硬質軟性基板43連接驅動電路40。藉此，來自驅動電路40之驅動訊號透過配線圖案11傳達至LED 20，而作為顯示裝置1發揮功能。<Step 12> As shown in FIG. 4(E), the drive circuit 40 is connected to the hard flexible substrate 43. Thereby, the driving signal from the driving circuit 40 is transmitted to the LED 20 through the wiring pattern 11, and functions as the display device 1.

其次，對將晶圓25及電路基板10貼合，將LED 20及配線圖案11電性連接之貼合步驟（步驟3）中所使用之貼合裝置進行說明。圖5係表示貼合裝置2之概略之圖。於圖5中，將鉛直方向設為Z方向，將與Z方向大致正交之方向設為X方向及Y方向。X方向及Y方向大致正交。Next, the bonding apparatus used in the bonding step (step 3) of bonding the wafer 25 and the circuit board 10 to electrically connect the LED 20 and the wiring pattern 11 will be described. FIG. 5 is a diagram showing the outline of the bonding device 2. In FIG. 5, the vertical direction is the Z direction, and the direction substantially orthogonal to the Z direction is the X direction and the Y direction. The X direction and the Y direction are approximately orthogonal.

貼合裝置2主要具有載台50、吸附載台60、攝影部71、探針81及支持框架90。The bonding apparatus 2 mainly includes a stage 50, a suction stage 60, an imaging section 71, a probe 81, and a support frame 90.

支持框架90為覆蓋貼合裝置2外側之大致箱狀之殼體。於支持框架90之內部，設有載台50、吸附載台60、檢查部80等。The supporting frame 90 is a substantially box-shaped shell covering the outside of the laminating device 2. Inside the support frame 90, a stage 50, a suction stage 60, an inspection part 80, etc. are provided.

載台50主要具有加熱載台51（相當於第1吸附部）、傾斜載台52、θ載台53、XY載台54及Z移動部55。The stage 50 mainly includes a heating stage 51 (corresponding to a first suction part), an inclined stage 52, a θ stage 53, an XY stage 54 and a Z moving part 55.

加熱載台51為大致板狀（此處為大致厚板狀）之構件，於上表面51a載置電路基板10。於加熱載台51形成有於上表面51a開口之孔（省略圖示），藉由利用與該孔連接之空氣吸引裝置91（參照圖9）吸引空氣，於上表面51a吸附電路基板10並固定。再者，於加熱載台51亦可使用多孔質材料。The heating stage 51 is a substantially plate-shaped (here, substantially thick plate-shaped) member, and the circuit board 10 is placed on the upper surface 51a. The heating stage 51 is formed with a hole (not shown) that opens on the upper surface 51a. The air suction device 91 (refer to FIG. 9) connected to the hole sucks air, and the circuit board 10 is adsorbed on the upper surface 51a and fixed . Furthermore, a porous material can also be used for the heating stage 51.

又，加熱載台51具有加熱部（省略圖示）。加熱部將加熱載台51整體維持為固定溫度（例如大概120度或大概200度以上）。Moreover, the heating stage 51 has a heating part (illustration omitted). The heating unit maintains the entire heating stage 51 at a constant temperature (for example, approximately 120 degrees or more than approximately 200 degrees).

傾斜載台52、θ載台53及XY載台54設於加熱載台51與Z移動部55之間。傾斜載台52使加熱載台51繞X軸、Y軸旋動（使加熱載台51傾斜）。θ載台53使加熱載台51繞z軸旋動。XY載台54使加熱載台51於X方向、Y方向平行移動。Z移動部55使加熱載台51、傾斜載台52、θ載台53及XY載台54於z軸平行移動。由於傾斜載台52、θ載台53、XY載台54及Z移動部55可使用已為公知之技術，因此省略說明。The tilt stage 52, the θ stage 53 and the XY stage 54 are provided between the heating stage 51 and the Z moving part 55. The tilt stage 52 rotates the heating stage 51 around the X axis and the Y axis (inclines the heating stage 51). The θ stage 53 rotates the heating stage 51 around the z axis. The XY stage 54 moves the heating stage 51 in the X direction and the Y direction in parallel. The Z moving part 55 moves the heating stage 51, the inclined stage 52, the θ stage 53, and the XY stage 54 in parallel on the z axis. Since the tilt stage 52, the θ stage 53, the XY stage 54, and the Z moving part 55 can use known technologies, the description is omitted.

吸附載台60設於載台50之鉛直方向上側（+Z側）。吸附載台60主要具有圓筒形托架61、吸附墊62、覆蓋玻璃63、傾斜載台64及θ載台65。The suction stage 60 is provided on the upper side (+Z side) of the stage 50 in the vertical direction. The suction stage 60 mainly includes a cylindrical bracket 61, a suction pad 62, a cover glass 63, an inclined stage 64, and a θ stage 65.

圓筒形托架61、吸附墊62及覆蓋玻璃63為吸附晶圓25之吸附部69（相當於第2吸附部），為兩端被覆蓋之大致筒狀之構件。再者，於本發明中，所謂大致筒狀為中空之棒材，為包括大致圓筒形狀、大致多邊形筒狀等之概念。又，大致筒狀亦包括於側面有突起部或凹陷部者。大致筒狀之構件亦包括於側面與上表面或側面與底面之邊界帶有弧度而無法明確區別者。又，大致筒狀之構件亦包括於中空部具有肋部或柱材等補強材者。The cylindrical bracket 61, the suction pad 62, and the cover glass 63 are the suction part 69 (corresponding to the second suction part) for sucking the wafer 25, and are a substantially cylindrical member with both ends covered. Furthermore, in the present invention, the so-called substantially cylindrical shape as a hollow rod is a concept including a substantially cylindrical shape, a substantially polygonal cylindrical shape, and the like. In addition, the substantially cylindrical shape also includes those having protrusions or depressions on the side surface. The substantially cylindrical member also includes those with a curvature on the boundary between the side surface and the upper surface or the side surface and the bottom surface, which cannot be clearly distinguished. In addition, a substantially cylindrical member also includes a hollow part having reinforcing materials such as ribs or pillars.

圖6係表示吸附部69之概略之圖，（A）為側視圖，（B）為仰視圖。於圖6（A）中，將一部分剖面顯示。FIG. 6 is a diagram showing the outline of the suction part 69, (A) is a side view, and (B) is a bottom view. In Figure 6(A), a partial cross-section is shown.

圓筒形托架61為了保持較高強度，由鋁、鐵等金屬形成。圓筒形托架61為大致筒狀，吸附墊62及覆蓋玻璃63覆蓋圓筒形托架61之兩端。In order to maintain high strength, the cylindrical bracket 61 is formed of metal such as aluminum or iron. The cylindrical bracket 61 is substantially cylindrical, and the suction pad 62 and the cover glass 63 cover both ends of the cylindrical bracket 61.

吸附墊62為透明的大致板狀之構件，覆蓋圓筒形托架61之下側之端部。於吸附墊62形成有貫通厚度方向（Z方向）之孔62a。該吸附用之孔62a可為1個，亦可為複數個。The suction pad 62 is a transparent substantially plate-shaped member covering the end of the cylindrical bracket 61 on the lower side. A hole 62a penetrating the thickness direction (Z direction) is formed in the suction pad 62. The number of holes 62a for adsorption may be one or plural.

作為吸附墊62之材質之例，可列舉玻璃或樹脂。吸附墊62較佳為整體透明，亦可有一部分不透明的部分。例如，吸附墊62可為組合玻璃及橡膠等複數個材料而得者。又，吸附墊62可不一定整體為透明，只要攝影部71拍攝對準標記或者對準所需之電路基板10或晶圓25之一部分所需之部分為透明即可。As an example of the material of the adsorption pad 62, glass or resin can be cited. The adsorption pad 62 is preferably transparent as a whole, or may have a part of opaque part. For example, the adsorption pad 62 may be obtained by combining multiple materials such as glass and rubber. In addition, the adsorption pad 62 may not necessarily be transparent as a whole, as long as the part required by the photographing part 71 to photograph the alignment mark or to align a part of the circuit substrate 10 or the wafer 25 required for alignment is transparent.

覆蓋玻璃63為覆蓋圓筒形托架61之上側之面之透明構件。覆蓋玻璃63之材質可為透明的樹脂，但較佳為玻璃。藉由於圓筒形托架61之上端側形成有凹部61a，於凹部61a之內部安裝有覆蓋玻璃63，從而覆蓋玻璃63覆蓋圓筒形托架61之上端面。換言之，吸附部69之上側之面係至少一部分由透明構件形成。The cover glass 63 is a transparent member covering the upper surface of the cylindrical bracket 61. The material of the cover glass 63 may be transparent resin, but is preferably glass. Since the concave portion 61 a is formed on the upper end side of the cylindrical bracket 61, a cover glass 63 is installed inside the concave portion 61 a so that the cover glass 63 covers the upper end surface of the cylindrical bracket 61. In other words, at least a part of the upper surface of the suction portion 69 is formed of a transparent member.

於圓筒形托架61之側面設有與空氣吸引裝置92（參照圖9）連接之真空吸附用接頭68。由於圓筒形托架61之兩端面由吸附墊62及覆蓋玻璃63覆蓋，因此藉由空氣吸引裝置92透過真空吸附用接頭68吸引吸附部69內部之空氣，如圖7所示，於吸附墊62之底面62b吸附有晶圓25。A vacuum suction joint 68 connected to an air suction device 92 (refer to FIG. 9) is provided on the side of the cylindrical bracket 61. Since both ends of the cylindrical bracket 61 are covered by the suction pad 62 and the cover glass 63, the air inside the suction portion 69 is sucked by the air suction device 92 through the vacuum suction joint 68, as shown in FIG. 7, on the suction pad The bottom surface 62b of 62 has the wafer 25 adsorbed.

返回圖5之說明。傾斜載台64及θ載台65設於吸附部69之鉛直方向上側，使吸附部69於水平方向移動。具體而言，傾斜載台64使吸附部69繞X軸、Y軸旋動（使吸附部69傾斜）。又，θ載台65使吸附部69繞z軸旋動。由於傾斜載台64及θ載台65可使用已為公知之技術，因此省略說明。再者，本發明中之水平方向之移動不僅為平行移動，包括傾斜動作、旋動動作。Return to the description of Figure 5. The inclined stage 64 and the θ stage 65 are provided on the upper side of the suction part 69 in the vertical direction, and the suction part 69 is moved in the horizontal direction. Specifically, the inclined stage 64 rotates the suction part 69 around the X axis and the Y axis (inclines the suction part 69). In addition, the θ stage 65 rotates the suction unit 69 around the z axis. Since the inclined stage 64 and the θ stage 65 can use well-known technologies, the description is omitted. Furthermore, the movement in the horizontal direction in the present invention is not only parallel movement, but also includes tilting action and rotating action.

攝影部71係拍攝用於使電路基板10與晶圓25之位置對準之圖像之攝影機。攝影部71為了能夠放大觀察而設有變焦光學系統，可變更倍率。攝影部71由於可使用通常的攝影機，因此省略說明。攝影部71利用大致柱狀之安裝部72而設於吸附部69之鉛直方向上側。The photographing unit 71 is a camera that photographs an image for aligning the positions of the circuit board 10 and the wafer 25. The imaging unit 71 is provided with a zoom optical system to enable magnification and observation, and the magnification can be changed. Since the imaging unit 71 can use a normal camera, the description is omitted. The imaging unit 71 is provided on the upper side of the suction unit 69 in the vertical direction by the substantially columnar mounting unit 72.

圖8係表示攝影部71及安裝部72之概略之圖，（A）為前視圖，（B）為側視圖。於圖8（A）、（B）中，將一部分剖面顯示。FIG. 8 is a diagram showing the outline of the photographing unit 71 and the mounting unit 72, (A) is a front view, and (B) is a side view. In Figure 8 (A) and (B), a partial cross-section is shown.

安裝部72將攝影部71保持為可於X方向、Y方向及Z方向上移動（參照圖8中空箭頭）。藉此，攝影部71可觀察吸附於吸附墊62之晶圓25之全部區域。The mounting part 72 holds the imaging part 71 so as to be movable in the X direction, the Y direction, and the Z direction (refer to the hollow arrow in FIG. 8). Thereby, the photographing unit 71 can observe the entire area of the wafer 25 adsorbed on the suction pad 62.

又，安裝部72於攝影部71之鉛直方向下側（-Z側）保持吸附載台60。In addition, the mounting part 72 holds the suction stage 60 on the lower side (−Z side) of the imaging part 71 in the vertical direction.

傾斜載台64及θ載台65為大致筒狀。又，吸附部69之上下表面（吸附墊62及覆蓋玻璃63）為透明。故而，攝影部71可透過吸附墊62、覆蓋玻璃63、傾斜載台64及θ載台65拍攝晶圓25。又，由於晶圓25為透明，因此攝影部71可透過晶圓25拍攝電路基板10（參照圖5）。The inclined stage 64 and the θ stage 65 are substantially cylindrical. In addition, the upper and lower surfaces of the suction portion 69 (the suction pad 62 and the cover glass 63) are transparent. Therefore, the photographing unit 71 can photograph the wafer 25 through the suction pad 62, the cover glass 63, the inclined stage 64, and the θ stage 65. In addition, since the wafer 25 is transparent, the imaging unit 71 can image the circuit board 10 through the wafer 25 (see FIG. 5 ).

於安裝部72設有照射紫外線之光照射部73。光照射部73以高度位於攝影部71與吸附載台60之間之方式設於安裝部72。光照射部73於水平方向（-Y方向）照射光。The mounting part 72 is provided with a light irradiation part 73 for irradiating ultraviolet rays. The light irradiating part 73 is provided on the mounting part 72 such that the height is located between the imaging part 71 and the suction stage 60. The light irradiation section 73 irradiates light in the horizontal direction (-Y direction).

如圖8（B）所示，反射鏡74（圖8（A）中省略圖示）為反射由光照射部73照射之紫外光之光學零件，將光路彎曲大致90度。反射鏡74以可於與攝影部71之光路重疊之位置（參照圖8（B）虛線）、與未與攝影部71之光路重疊之位置（參照圖8（B）實線）之間於水平方向移動之方式設置（參照圖8（B）箭頭）。於反射鏡74配置於與攝影部71之光路重疊之位置之狀態下，由光照射部73照射之紫外光由反射鏡74反射，照射至電路基板10及晶圓25。As shown in FIG. 8(B), the reflecting mirror 74 (not shown in FIG. 8(A)) is an optical component that reflects the ultraviolet light irradiated by the light irradiating part 73, and bends the optical path by approximately 90 degrees. The reflector 74 can be positioned horizontally between a position that overlaps the optical path of the imaging unit 71 (refer to the dotted line in FIG. 8(B)) and a position that does not overlap the optical path of the imaging unit 71 (refer to the solid line in FIG. 8(B)). Set the direction of movement (refer to the arrow in Figure 8 (B)). In a state where the reflecting mirror 74 is arranged at a position overlapping with the light path of the imaging unit 71, the ultraviolet light irradiated by the light irradiation unit 73 is reflected by the reflecting mirror 74 and irradiated to the circuit board 10 and the wafer 25.

返回圖5之說明。檢查部80主要具有複數個探針81、及移動部82。複數個探針81分別連接於電源85（參照圖9）。又，探針81設於移動部82。移動部82可使探針81於抵接於設於電路基板10之配線圖案11之位置、及與未抵接於配線圖案11之位置之間於上下方向移動。於本實施形態中，配線圖案11具有點亮檢查用之電源墊（省略圖示），將探針81抵接於該電源墊。Return to the description of Figure 5. The inspection unit 80 mainly includes a plurality of probes 81 and a moving unit 82. The plural probes 81 are respectively connected to the power supply 85 (refer to FIG. 9). In addition, the probe 81 is provided in the moving part 82. The moving part 82 can move the probe 81 in the vertical direction between a position abutting on the wiring pattern 11 provided on the circuit board 10 and a position not abutting on the wiring pattern 11. In this embodiment, the wiring pattern 11 has a power supply pad (not shown) for lighting inspection, and the probe 81 abuts the power supply pad.

再者，於本實施形態中，檢查部80安裝於支持框架90，其位置為吸附載台60附近，但檢查部80之位置及配設形態並不限定於此。探針81設置為可於上下方向移動即可，例如移動部82可設於XY載台54。In addition, in this embodiment, the inspection part 80 is attached to the support frame 90 and its position is near the suction stage 60, but the position and arrangement form of the inspection part 80 are not limited to this. The probe 81 may be provided to be movable in the vertical direction, for example, the moving part 82 may be provided on the XY stage 54.

圖9係表示貼合裝置2之電性構成之方塊圖。貼合裝置2具有CPU（Central Processing Unit）151、RAM（Random Access Memory）152、ROM（Read Only Memory）153、輸入輸出介面（I/F）154、通訊介面（I/F）155、及媒體介面（I/F）156，該等與載台50、吸附載台60、攝影部71、檢查部80、電源85、空氣吸引裝置91、92等相互連接。FIG. 9 is a block diagram showing the electrical configuration of the bonding device 2. The laminating device 2 has a CPU (Central Processing Unit) 151, a RAM (Random Access Memory) 152, a ROM (Read Only Memory) 153, an input/output interface (I/F) 154, a communication interface (I/F) 155, and media The interface (I/F) 156 is connected to the stage 50, the suction stage 60, the imaging unit 71, the inspection unit 80, the power supply 85, the air suction devices 91, 92, and the like.

RAM 152為揮發性記憶體。ROM 153為記憶有各種控制程式等之非揮發性記憶體。CPU 151基於儲存於RAM 152、ROM 153之程式動作，進行各部分之控制。The RAM 152 is a volatile memory. The ROM 153 is a non-volatile memory storing various control programs and the like. The CPU 151 operates based on the programs stored in the RAM 152 and the ROM 153 to control each part.

CPU 151具有控制貼合裝置2之各部分之控制部151a之功能。控制部151a藉由執行CPU 151所讀取之既定之程式而構築。The CPU 151 has a function of controlling the control unit 151a of each part of the laminating device 2. The control unit 151a is constructed by executing a predetermined program read by the CPU 151.

控制部151a主要具有進行對準之功能部、進行加壓之功能部、及進行檢查之功能部。於進行對準之功能部中，一面利用攝影部71透過吸附載台60及晶圓25拍攝電路基板10進行觀察，一面控制傾斜載台52、θ載台53及XY載台54使加熱載台51於水平方向移動。又，於進行加壓之功能部中，控制Z移動部55使加熱載台51往鉛直方向上方向（+Z方向）移動而對電路基板10及晶圓25進行加壓。此時，藉由利用測力計（省略圖示）檢測加壓壓力，控制部151a控制為最佳之設定壓力。又，於進行檢查之功能部中，於對電路基板10及晶圓25進行加壓之狀態下控制移動部82，使探針81抵接於配線圖案11。關於控制部151a所進行之處理，於後文詳細說明。The control unit 151a mainly has a functional unit for alignment, a functional unit for pressurization, and a functional unit for inspection. In the functional part for alignment, the photographing part 71 is used to photograph the circuit board 10 through the suction stage 60 and the wafer 25 for observation, while the tilt stage 52, the θ stage 53 and the XY stage 54 are controlled to heat the stage 51 moves in the horizontal direction. In addition, in the function unit for applying pressure, the Z moving unit 55 is controlled to move the heating stage 51 in the vertical direction (+Z direction) to press the circuit board 10 and the wafer 25. At this time, by detecting the pressurizing pressure with a dynamometer (not shown), the control unit 151a controls the optimal set pressure. In addition, in the functional part for inspection, the moving part 82 is controlled in a state where the circuit board 10 and the wafer 25 are pressurized so that the probe 81 abuts the wiring pattern 11. The processing performed by the control unit 151a will be described in detail later.

CPU 151透過輸入輸出介面154控制鍵盤或滑鼠等輸入輸出裝置161。通訊介面155透過網路162自其他機器接收資料並發送至CPU 151，並且將CPU 151所生成之資料透過網路162發送至其他機器。The CPU 151 controls an input and output device 161 such as a keyboard or a mouse through the input and output interface 154. The communication interface 155 receives data from other machines through the network 162 and sends it to the CPU 151, and sends the data generated by the CPU 151 to other machines through the network 162.

媒體介面156讀取儲存於記憶媒體163之程式或資料，將其儲存至RAM 152。再者，記憶媒體163例如為IC卡、SD卡、DVD等。再者，實現各功能之程式係例如自記憶媒體163讀出，透過RAM 152安裝於貼合裝置2，由CPU 151執行。The media interface 156 reads the program or data stored in the storage medium 163 and stores it in the RAM 152. Furthermore, the storage medium 163 is, for example, an IC card, SD card, DVD, or the like. Furthermore, the program for realizing each function is read from the storage medium 163, installed in the laminating device 2 through the RAM 152, and executed by the CPU 151, for example.

圖9所示之貼合裝置2之構成係於說明本實施形態之特徵時說明了主要構成，並非排除例如通常之資訊處理裝置所具備之構成。貼合裝置2之構成要素可根據處理內容進而分類為多個構成要素，亦可為1個構成要素執行複數個構成要素之處理。The structure of the laminating device 2 shown in FIG. 9 explains the main structure when describing the characteristics of the present embodiment, and does not exclude, for example, the structure of a general information processing device. The components of the laminating device 2 may be further classified into a plurality of components according to the processing content, and the processing of a plurality of components may be performed for one component.

其次，對使用貼合裝置2將電路基板10及晶圓25貼合之處理（步驟3）進行說明。該貼合步驟主要藉由控制部151a進行。於貼合步驟中，將形成有複數個LED 20之晶圓25及電路基板10貼合，將LED 20固定於連接圖案上。Next, the process (step 3) of bonding the circuit board 10 and the wafer 25 using the bonding apparatus 2 will be described. This bonding step is mainly performed by the control part 151a. In the bonding step, the wafer 25 formed with a plurality of LEDs 20 and the circuit board 10 are bonded together, and the LED 20 is fixed on the connection pattern.

圖10係表示貼合步驟之處理流程之流程圖。圖11係示意性表示貼合步驟之圖。圖12係示意性表示貼合步驟中之探針81之位置之圖。Fig. 10 is a flowchart showing the processing flow of the bonding step. Fig. 11 is a diagram schematically showing the bonding step. FIG. 12 is a diagram schematically showing the position of the probe 81 in the bonding step.

1.對準步驟（步驟S100～S106） ＜步驟S100＞ 首先，如圖11（A）所示，以LED 20（圖11中省略圖示）朝下之方式，將晶圓25載置於載台50（此處為加熱載台51）之上表面51a。此時，控制部151a利用空氣吸引裝置91吸引空氣，將晶圓25吸附並固定於上表面51a。1. Alignment steps (steps S100～S106) <Step S100> First, as shown in FIG. 11(A), the wafer 25 is placed on the upper surface 51a of the stage 50 (here, the heating stage 51) with the LED 20 (not shown in FIG. 11) facing downward. . At this time, the control unit 151a sucks air by the air suction device 91, and sucks and fixes the wafer 25 to the upper surface 51a.

其次，如圖11（B）所示，控制部151a控制Z移動部55使加熱載台51往上方向（+Z方向）移動，使晶圓25靠近吸附載台60。然後，控制部151a一面利用攝影部71透過吸附載台60拍攝晶圓25進行觀察，一面控制傾斜載台52、θ載台53及XY載台54使加熱載台51（亦即晶圓25）於水平方向移動。此時，控制部151a以使形成於晶圓25之對準標記與攝影部71之中央（光軸）一致之方式，使晶圓25於水平方向移動。Next, as shown in FIG. 11(B), the control unit 151 a controls the Z moving unit 55 to move the heating stage 51 in the upward direction (+Z direction) to bring the wafer 25 closer to the suction stage 60. Then, the control unit 151a uses the imaging unit 71 to photograph the wafer 25 through the suction stage 60 for observation, and controls the tilt stage 52, the θ stage 53, and the XY stage 54 to heat the stage 51 (that is, the wafer 25) Move in the horizontal direction. At this time, the control unit 151a moves the wafer 25 in the horizontal direction so that the alignment mark formed on the wafer 25 coincides with the center (optical axis) of the imaging unit 71.

＜步驟S102＞ 控制部151a使形成於晶圓25之對準標記與攝影部71之光軸一致後，切斷利用空氣吸引裝置91所進行之空氣之吸引，解除向上表面51a之晶圓25之吸附。又，控制部151a利用空氣吸引裝置92透過真空吸附用接頭68吸引吸附部69內部之空氣，將晶圓25吸附於吸附墊62。藉此，以LED 20朝下之方式，晶圓25固定於吸附墊62。<Step S102> After the control unit 151a aligns the alignment mark formed on the wafer 25 with the optical axis of the imaging unit 71, it cuts off the suction of the air by the air suction device 91 and releases the suction of the wafer 25 on the upper surface 51a. In addition, the control unit 151 a uses the air suction device 92 to suck the air inside the suction unit 69 through the vacuum suction joint 68 to suction the wafer 25 to the suction pad 62. In this way, the wafer 25 is fixed to the suction pad 62 with the LED 20 facing downward.

＜步驟S104＞ 其次，如圖11（C）所示，控制部151a控制Z移動部55使加熱載台51往下方向（-Z方向）移動，以配線圖案11朝上之方式將電路基板10載置於載台50（此處為加熱載台51）之上表面51a，利用空氣吸引裝置91吸引空氣，將電路基板10吸附並固定於上表面51a。<Step S104> Next, as shown in FIG. 11(C), the control unit 151a controls the Z moving unit 55 to move the heating stage 51 in the downward direction (-Z direction), and the circuit board 10 is placed on the mount with the wiring pattern 11 facing upward. The upper surface 51a of the stage 50 (here, the heating stage 51) sucks air by the air suction device 91, and sucks and fixes the circuit board 10 to the upper surface 51a.

＜步驟S106＞ 如圖11（D）所示，控制部151a控制Z移動部55使加熱載台51往+Z方向移動，使電路基板10靠近晶圓25。但是，電路基板10與晶圓25未抵接。然後，控制部151a一面利用攝影部71透過吸附載台60及晶圓25拍攝電路基板10進行觀察，一面控制傾斜載台52、θ載台53及XY載台54使加熱載台51（亦即電路基板10）於水平方向移動。再者，由於晶圓25為透明，因此可透過晶圓25拍攝電路基板10。<Step S106> As shown in FIG. 11(D), the control unit 151 a controls the Z moving unit 55 to move the heating stage 51 in the +Z direction so that the circuit board 10 approaches the wafer 25. However, the circuit board 10 and the wafer 25 are not in contact with each other. Then, the control unit 151a uses the imaging unit 71 to photograph the circuit board 10 through the suction stage 60 and the wafer 25 for observation, and controls the tilt stage 52, the θ stage 53, and the XY stage 54 to heat the stage 51 (that is, The circuit board 10) moves in the horizontal direction. Furthermore, since the wafer 25 is transparent, the circuit board 10 can be imaged through the wafer 25.

此時，控制部151a以使形成於電路基板10之對準標記與攝影部71之中央（光軸）一致之方式，使電路基板10於水平方向移動。控制部151a使形成於電路基板10之對準標記與攝影部71之光軸一致後，結束對準步驟。藉此，電路基板10及晶圓25於被定位之狀態下配置為大致平行。At this time, the control unit 151a moves the circuit board 10 in the horizontal direction so that the alignment mark formed on the circuit board 10 coincides with the center (optical axis) of the imaging unit 71. After the control section 151a aligns the alignment mark formed on the circuit board 10 with the optical axis of the imaging section 71, the alignment step is ended. Thereby, the circuit board 10 and the wafer 25 are arranged substantially parallel in the state of being positioned.

2.貼合步驟 ＜步驟S108＞ 如圖11（E）所示，控制部151a藉由控制Z移動部55使加熱載台51往+Z方向移動，利用加熱載台51及吸附墊62夾住電路基板10及晶圓25且自電路基板10及晶圓25之兩側施加壓力。藉此，電路基板10及晶圓25被加壓。再者，於加壓時，如圖12（A）所示，探針81未抵接於配線圖案11（圖12中省略圖示）。2. Fitting steps <Step S108> As shown in FIG. 11(E), the control unit 151a controls the Z moving unit 55 to move the heating stage 51 in the +Z direction, and uses the heating stage 51 and the suction pad 62 to sandwich the circuit board 10 and the wafer 25 and automatically Pressure is applied to both sides of the circuit board 10 and the wafer 25. Thereby, the circuit board 10 and the wafer 25 are pressurized. In addition, at the time of pressurization, as shown in FIG. 12(A), the probe 81 is not in contact with the wiring pattern 11 (illustration omitted in FIG. 12).

於本實施形態中，由於利用加熱載台51及吸附墊62夾住電路基板10及晶圓25，因此於加壓時，電路基板10及晶圓25不彎曲，而對晶圓25之表面整體大致均勻地進行加壓，可一次將形成於晶圓25之複數個LED 20固定於電路基板10。又，例如，若電路基板10或晶圓25彎曲，則有對位於電路基板10與晶圓25之距離較近之部分之LED 20施加過度之力，導致破壞LED 20或晶圓25裂開之虞。相對於此，於本實施形態中，由於對晶圓25之表面整體均勻地進行加壓，因此可防止破壞LED 20、LED 20之不均勻之點亮或晶圓25裂開。In this embodiment, since the circuit board 10 and the wafer 25 are clamped by the heating stage 51 and the suction pad 62, the circuit board 10 and the wafer 25 do not bend when pressure is applied, but the entire surface of the wafer 25 The pressure is applied substantially uniformly, and a plurality of LEDs 20 formed on the wafer 25 can be fixed to the circuit board 10 at a time. In addition, for example, if the circuit board 10 or the wafer 25 is bent, excessive force is applied to the LED 20 located at the part of the circuit board 10 and the wafer 25 that is closer to each other, resulting in damage to the LED 20 or the wafer 25 cracking. Yu. In contrast, in this embodiment, since the entire surface of the wafer 25 is uniformly pressurized, it is possible to prevent damage to the LED 20, the uneven lighting of the LED 20, or the wafer 25 from cracking.

4.檢查步驟（步驟S110～S118） ＜步驟S110＞ 如圖11（F）及圖12（B）所示，控制部151a於自晶圓25及電路基板10之兩側施加了壓力之狀態下，使探針81往-Z方向移動而將探針81抵接於配線圖案11（省略圖示）。4. Inspection steps (steps S110～S118) <Step S110> As shown in Figures 11(F) and 12(B), the control unit 151a moves the probe 81 in the -Z direction while applying pressure from both sides of the wafer 25 and the circuit board 10 to move the probe 81 abuts on the wiring pattern 11 (not shown).

＜步驟S112＞ 控制部151a由電源85透過探針81對配線圖案11施加電流。藉此，LED 20被點亮。<Step S112> The control unit 151 a applies a current to the wiring pattern 11 through the probe 81 from the power supply 85. Thereby, the LED 20 is lit.

＜步驟S114＞ 控制部151a基於攝影部71所拍攝之圖像確認LED 20是否全部點亮。於貼合步驟中未產生問題之情形時，如圖12（C）所示，所有LED 20被點亮。<Step S114> The control unit 151a confirms whether all the LEDs 20 are turned on based on the image taken by the imaging unit 71. When there is no problem in the bonding step, as shown in FIG. 12(C), all the LEDs 20 are lit.

＜步驟S116＞ 於所有LED 20並未都點亮之情形時（步驟S114中為NO），即謂於只要存在1個未被點亮之LED 20之情形時，控制部151a控制Z移動部55使加熱載台51往-Z方向移動，將電路基板10與晶圓25分開。<Step S116> When all the LEDs 20 are not lit (NO in step S114), that is, when there is only one LED 20 that is not lit, the control unit 151a controls the Z moving unit 55 to heat the stage 51 moves in the -Z direction to separate the circuit board 10 from the wafer 25.

＜步驟S118＞ 然後，控制部151a利用未圖示之鼓風機等吹散塵埃等來修正故障。於本實施形態中，由於於連接電路基板10及晶圓25之前（接著劑硬化前）進行檢查，因此可將電路基板10與晶圓25分開，藉此可修正故障。其後，控制部151a使處理返回至步驟S106。<Step S118> Then, the control unit 151a uses a blower (not shown) or the like to blow off dust or the like to correct the malfunction. In the present embodiment, since the inspection is performed before the circuit board 10 and the wafer 25 are connected (before the adhesive is cured), the circuit board 10 and the wafer 25 can be separated to correct the failure. After that, the control unit 151a returns the process to step S106.

3.硬化步驟 ＜步驟S200＞ 於所有LED已點亮之情形時（步驟S114中為YES），如圖12（D）所示，控制部151a控制移動部82使探針81離開配線圖案11。然後，控制部151a於自電路基板10及晶圓25之兩側施加了壓力之狀態下，藉由利用未圖示之加熱部對加熱載台51整體進行加熱，對電路基板10及晶圓25進行加熱而使接著劑41硬化。藉此，LED 20固定於電路基板10。3. Hardening step <Step S200> When all the LEDs are turned on (YES in step S114), as shown in FIG. 12(D), the control unit 151a controls the moving unit 82 to move the probe 81 away from the wiring pattern 11. Then, the control unit 151a heats the entire heating stage 51 with a heating unit (not shown) in a state where pressure is applied from both sides of the circuit board 10 and the wafer 25 to heat the circuit board 10 and the wafer 25 Heating is performed to harden the adhesive 41. Thereby, the LED 20 is fixed to the circuit board 10.

再者，接著劑並不限定於熱硬化性樹脂，可使用紫外線硬化樹脂。於使用紫外線硬化樹脂之情形時，將反射鏡74移動至與攝影部71之光路重疊之位置，由光照射部73照射紫外線。藉此，紫外線照射至電路基板10及晶圓25，而接著劑硬化。In addition, the adhesive is not limited to thermosetting resin, and ultraviolet curing resin can be used. In the case of using ultraviolet curable resin, the reflector 74 is moved to a position overlapping with the optical path of the imaging section 71, and the light irradiation section 73 irradiates ultraviolet rays. Thereby, ultraviolet rays are irradiated to the circuit board 10 and the wafer 25, and the adhesive is cured.

5.加壓開放步驟 ＜步驟S202＞ 控制部151a停止利用空氣吸引裝置92所進行之空氣之吸引而將空氣返回至吸附部69內部，使晶圓25離開吸附墊62。5. Pressurized opening steps <Step S202> The control unit 151 a stops the suction of air by the air suction device 92 and returns the air to the inside of the suction unit 69 to make the wafer 25 leave the suction pad 62.

＜步驟S204＞ 如圖11（G）所示，控制部151a控制Z移動部55使加熱載台51往-Z方向移動，使於電路基板10連接有晶圓25者與加熱載台51一起往-Z方向移動。<Step S204> As shown in FIG. 11(G), the control unit 151a controls the Z moving unit 55 to move the heating stage 51 in the -Z direction, so that the wafer 25 connected to the circuit board 10 moves in the -Z direction together with the heating stage 51 .

＜步驟S206＞ 最後，控制部151a停止利用空氣吸引裝置91所進行之空氣之吸引，使電路基板10離開上表面51a。然後，自上表面51a取出電路基板10。以上為貼合步驟之處理流程。<Step S206> Finally, the control unit 151a stops the air suction by the air suction device 91, and moves the circuit board 10 away from the upper surface 51a. Then, the circuit board 10 is taken out from the upper surface 51a. The above is the processing flow of the bonding step.

根據本實施形態，藉由使用透明的吸附墊62及覆蓋玻璃63、及筒狀之傾斜載台64及θ載台65，可利用攝影部71直接觀察電路基板10及晶圓25。而且，由於一面利用攝影部71直接觀察電路基板10及晶圓25一面進行對準，因此可以較高之精度進行位置對準。又，由於於大致板狀之加熱載台51及吸附墊62夾住電路基板10及晶圓25並加壓，因此可大致均勻地對表面整體進行加壓。According to this embodiment, by using the transparent suction pad 62 and the cover glass 63, and the cylindrical inclined stage 64 and the θ stage 65, the circuit board 10 and the wafer 25 can be directly observed by the imaging unit 71. Furthermore, since the alignment is performed while directly observing the circuit board 10 and the wafer 25 by the imaging unit 71, the position alignment can be performed with higher accuracy. In addition, since the circuit board 10 and the wafer 25 are sandwiched between the substantially plate-shaped heating stage 51 and the suction pad 62 and pressed, the entire surface can be pressed substantially uniformly.

又，根據本實施形態，藉由將探針81設為可移動，於檢查時將探針81與配線圖案11抵接，於接著劑硬化時使探針81離開配線圖案11，可利用貼合裝置2進行LED之點亮確認。又，由於在使接著劑41硬化而連接電路基板10及晶圓25之前確認LED 20之點亮，因此可於存在未被點亮之LED 20之情形時將電路基板10與晶圓25分離，並修正故障。因此，可提高顯示裝置1之製造時之良率。In addition, according to this embodiment, by making the probe 81 movable, the probe 81 is brought into contact with the wiring pattern 11 during inspection, and the probe 81 is moved away from the wiring pattern 11 when the adhesive is cured. Device 2 confirms the lighting of the LED. In addition, since the lighting of the LED 20 is confirmed before the adhesive 41 is cured to connect the circuit board 10 and the wafer 25, the circuit board 10 can be separated from the wafer 25 when there is an unlit LED 20. And correct the fault. Therefore, the yield rate during the manufacture of the display device 1 can be improved.

再者，於本實施形態中，載台50具有Z移動部55，Z移動部55使加熱載台51往+Z方向或-Z方向移動，但往+Z方向或-Z方向移動者並不限定於加熱載台51。例如，吸附載台60具有Z移動部，該Z移動部使吸附部69往+Z方向或-Z方向移動亦可。Furthermore, in the present embodiment, the stage 50 has a Z moving part 55, and the Z moving part 55 moves the heating stage 51 in the +Z direction or -Z direction, but it does not move in the +Z direction or -Z direction. Limited to the heating stage 51. For example, the suction stage 60 may have a Z moving part, and the Z moving part may move the suction part 69 in the +Z direction or the -Z direction.

又，於本實施形態中，載台50具有加熱載台51，但加熱載台51並非必須。於使用光硬化性樹脂作為接著劑之情形時，貼合裝置2具有光照射部73及反射鏡74即可。又，光照射部73及反射鏡74並非必須，於使用熱硬化性樹脂作為接著劑之情形時，貼合裝置2具有加熱載台51即可。In addition, in this embodiment, the stage 50 has the heating stage 51, but the heating stage 51 is not essential. In the case of using a photocurable resin as an adhesive, the bonding apparatus 2 may include the light irradiation section 73 and the reflecting mirror 74. In addition, the light irradiating part 73 and the reflecting mirror 74 are not essential. When a thermosetting resin is used as an adhesive, the bonding apparatus 2 may have a heating stage 51.

又，於本實施形態中，藉由使形成於電路基板10或晶圓25之對準標記分別與攝影部71之中央（光軸）一致而進行了對準，但對準標記並非必須。例如，以攝影部71拍攝電路基板10及晶圓25，且設於晶圓25之LED 20之位置與電路基板10之配線圖案11之位置一致之方式使加熱載台51於水平方向移動而進行對準亦可。於本實施形態中，由於攝影部71能夠直接觀察電路基板10或晶圓25，因此即使無對準標記亦可進行電路基板10與晶圓25之位置對準。尤其是由於攝影部71具有變焦光學系統，且攝影部71設為可於X方向及Y方向上移動，因此藉由將電路基板10及晶圓25之一部分放大而拍攝，可進行正確之對準。In addition, in this embodiment, alignment is performed by aligning the alignment marks formed on the circuit board 10 or the wafer 25 with the center (optical axis) of the imaging section 71, but the alignment marks are not essential. For example, the photographing section 71 photographs the circuit board 10 and the wafer 25, and the position of the LED 20 provided on the wafer 25 coincides with the position of the wiring pattern 11 of the circuit board 10 by moving the heating stage 51 in the horizontal direction. Alignment is also possible. In this embodiment, since the imaging unit 71 can directly observe the circuit board 10 or the wafer 25, the circuit board 10 and the wafer 25 can be aligned even without an alignment mark. In particular, since the photographing section 71 has a zoom optical system, and the photographing section 71 is configured to be movable in the X direction and the Y direction, by enlarging a part of the circuit board 10 and the wafer 25 for photographing, correct alignment can be performed .

又，於本實施形態中，對準標記設於晶圓25之中心，但設置對準標記之位置並不限定於中心。又，對準標記可為1個，亦可為複數個。藉由設置複數個對準標記，不僅高度，傾斜偏移或旋轉偏移亦可以高精度進行對準。尤其，較佳為設置3個以上對準標記。Moreover, in this embodiment, the alignment mark is provided at the center of the wafer 25, but the position where the alignment mark is provided is not limited to the center. In addition, the number of alignment marks may be one or plural. By setting a plurality of alignment marks, not only height, tilt offset or rotation offset can also be aligned with high accuracy. In particular, it is preferable to provide three or more alignment marks.

＜第2實施形態＞ 本發明之第2實施形態為攝影部71以外之攝影部亦用於對準之形態。以下，對第2實施形態之貼合裝置3進行說明。關於與第1實施形態相同之部分，標註相同之符號並省略說明。又，由於使用貼合裝置3製造之顯示裝置1與第1實施形態相同，顯示裝置1之製造方法亦相同，因此省略說明。<The second embodiment> The second embodiment of the present invention is a mode in which the imaging unit other than the imaging unit 71 is also used for alignment. Hereinafter, the bonding apparatus 3 of the second embodiment will be described. The same parts as those in the first embodiment are designated by the same reference numerals and their description is omitted. In addition, since the display device 1 manufactured using the bonding device 3 is the same as the first embodiment, and the manufacturing method of the display device 1 is also the same, the description is omitted.

圖13係表示貼合裝置3之概略之圖。貼合裝置3係將晶圓25及電路基板10貼合，將LED 20與配線圖案11電性連接之貼合步驟（步驟3）中所使用之貼合裝置，主要具有載台50、吸附載台60、攝影部71、76、77、檢查部80、及支持框架90。FIG. 13 is a diagram showing the outline of the bonding device 3. The bonding device 3 is a bonding device used in the bonding step (step 3) of bonding the wafer 25 and the circuit board 10 to electrically connect the LED 20 and the wiring pattern 11, and mainly includes a stage 50, a suction carrier The stage 60, the photographing sections 71, 76, 77, the inspection section 80, and the support frame 90.

攝影部77為拍攝電路基板10之圖像之攝影機，設於支持框架90之上表面。攝影部76為拍攝晶圓25之圖像之攝影機，設於XY載台54。攝影部76、77由於可使用通常之攝影機，因此省略說明。The photographing unit 77 is a camera for photographing an image of the circuit board 10 and is provided on the upper surface of the support frame 90. The photographing unit 76 is a camera that photographs an image of the wafer 25 and is provided on the XY stage 54. Since the photographing units 76 and 77 can use normal cameras, the description is omitted.

圖14係表示貼合步驟之處理流程之流程圖。圖15係示意性表示貼合步驟之圖。再者，與第1實施形態與第2實施形態之差異僅為對準步驟及貼合步驟，因此關於對準步驟及貼合步驟以外之步驟則省略詳細之說明。Fig. 14 is a flowchart showing the processing flow of the bonding step. Fig. 15 is a diagram schematically showing the bonding step. In addition, the difference from the first embodiment and the second embodiment is only the alignment step and the bonding step, and therefore the detailed description of the steps other than the alignment step and the bonding step will be omitted.

1.對準步驟（步驟S102～S107） ＜步驟S102＞ 首先，如圖15（A）所示，利用空氣吸引裝置92透過真空吸附用接頭68吸引吸附部69內部之空氣，於吸附墊62以LED 20（圖15中省略圖示）朝下之方式吸附晶圓25。1. Alignment steps (steps S102～S107) <Step S102> First, as shown in FIG. 15(A), the air inside the suction part 69 is sucked by the air suction device 92 through the vacuum suction joint 68, and the suction pad 62 is sucked downward with the LED 20 (not shown in FIG. 15) Wafer 25.

＜步驟S103＞ 其次，控制部151a一面利用攝影部76拍攝晶圓25進行觀察，一面調整晶圓25之傾斜、旋轉偏移。即謂控制部151a以控制傾斜載台64及θ載台65，且使形成於晶圓25之對準標記與攝影部71之中央（光軸）一致之方式，使晶圓25於水平方向移動。<Step S103> Next, the control unit 151a uses the imaging unit 76 to photograph the wafer 25 for observation, and adjust the tilt and rotational displacement of the wafer 25. That is, the control section 151a controls the tilt stage 64 and the θ stage 65, and moves the wafer 25 in the horizontal direction in such a way that the alignment mark formed on the wafer 25 is aligned with the center (optical axis) of the imaging section 71 .

＜步驟S104＞ 其次，控制部151a以配線圖案11朝上之方式將電路基板10固定於載台50（此處為加熱載台51）之上表面51a。<Step S104> Next, the control unit 151a fixes the circuit board 10 to the upper surface 51a of the stage 50 (here, the heating stage 51) with the wiring pattern 11 facing upward.

＜步驟S105＞ 而且，控制部151a一面利用攝影部77拍攝電路基板10進行觀察，一面調整電路基板10之傾斜、旋轉偏移。即謂控制傾斜載台52、θ載台53及XY載台54來使加熱載台51（亦即電路基板10）於水平方向移動。此時，控制部151a以使形成於電路基板10之對準標記與攝影部77之中央（光軸）一致之方式使電路基板10於水平方向移動。<Step S105> In addition, the control unit 151a uses the imaging unit 77 to photograph the circuit board 10 for observation, and adjust the tilt and rotational displacement of the circuit board 10. That is, the tilt stage 52, the θ stage 53, and the XY stage 54 are controlled to move the heating stage 51 (that is, the circuit board 10) in the horizontal direction. At this time, the control unit 151a moves the circuit board 10 in the horizontal direction so that the alignment mark formed on the circuit board 10 coincides with the center (optical axis) of the imaging unit 77.

＜步驟S107＞ 如圖15（B）所示，控制部151a以控制XY載台54，且使形成於電路基板10之對準標記之位置與步驟S103中之攝影部76之光軸之位置大致一致之方式，使加熱載台51（即電路基板10）於水平方向移動。藉此，電路基板10及晶圓25於被定位之狀態下配置為大致平行。<Step S107> As shown in FIG. 15(B), the control section 151a controls the XY stage 54 and makes the position of the alignment mark formed on the circuit board 10 substantially coincide with the position of the optical axis of the imaging section 76 in step S103. The heating stage 51 (that is, the circuit board 10) is moved in the horizontal direction. Thereby, the circuit board 10 and the wafer 25 are arranged substantially parallel in the state of being positioned.

2.貼合步驟 ＜步驟S109＞ 如圖15（C）所示，控制部151a控制Z移動部55使加熱載台51往+Z方向移動。又，控制部151a利用攝影部71拍攝電路基板10及晶圓25，於存在電路基板10與晶圓25之位置偏移之情形時，控制θ載台53及XY載台54使加熱載台51（即電路基板10）於水平方向移動，使電路基板10之對準標記與晶圓25之對準標記一致。此時，電路基板10與晶圓25未抵接。2. Fitting steps <Step S109> As shown in FIG. 15(C), the control unit 151a controls the Z moving unit 55 to move the heating stage 51 in the +Z direction. In addition, the control unit 151a uses the imaging unit 71 to image the circuit board 10 and the wafer 25. When there is a positional deviation between the circuit board 10 and the wafer 25, it controls the θ stage 53 and the XY stage 54 to heat the stage 51 (Ie, the circuit board 10) is moved in the horizontal direction to make the alignment mark of the circuit board 10 coincide with the alignment mark of the wafer 25. At this time, the circuit board 10 and the wafer 25 are not in contact with each other.

電路基板10之對準標記與晶圓25之對準標記一致後，如圖15（D）所示，利用加熱載台51及吸附墊62夾住電路基板10及晶圓25且自電路基板10及晶圓25之兩側施加壓力。After the alignment mark of the circuit board 10 is consistent with the alignment mark of the wafer 25, as shown in FIG. 15(D), the circuit board 10 and the wafer 25 are clamped by the heating stage 51 and the suction pad 62 and separated from the circuit board 10. And apply pressure on both sides of the wafer 25.

藉此，電路基板10及晶圓25被加壓。由於利用加熱載台51及吸附墊62夾住電路基板10及晶圓25，因此於加壓時，電路基板10及晶圓25不彎曲，而對晶圓25之表面整體大致均勻地進行加壓，可一次將形成於晶圓25之複數個LED 20固定於電路基板10，並且可防止破壞LED 20、LED 20之不均勻之點亮或晶圓25裂開。Thereby, the circuit board 10 and the wafer 25 are pressurized. Since the circuit board 10 and the wafer 25 are clamped by the heating stage 51 and the suction pad 62, the circuit board 10 and the wafer 25 are not bent when pressing, and the entire surface of the wafer 25 is substantially uniformly pressed , A plurality of LEDs 20 formed on the wafer 25 can be fixed to the circuit substrate 10 at a time, and it can prevent damage to the LED 20, the uneven lighting of the LED 20, or the wafer 25 from cracking.

4.檢查步驟（步驟S110～S118） ＜步驟S110、S112＞ 如圖15（E）所示，控制部151a於自晶圓25及電路基板10之兩側施加了壓力之狀態下，使探針81往-Z方向移動而將探針81抵接於配線圖案11，透過探針81自電源85對配線圖案11施加電流。4. Inspection steps (steps S110～S118) <Steps S110, S112> As shown in FIG. 15(E), the control unit 151a moves the probe 81 in the -Z direction while applying pressure from both sides of the wafer 25 and the circuit board 10 to abut the probe 81 against the wiring pattern 11. Apply current from the power supply 85 to the wiring pattern 11 through the probe 81.

＜步驟S114～S118＞ 控制部151a基於攝影部71所拍攝之圖像確認LED 20是否全部點亮。於所有LED 20並未都點亮之情形（只要存在1個未被點亮之LED 20之情形）時，控制部151a控制Z移動部55使加熱載台51往-Z方向移動，將電路基板10與晶圓25分開，並修正故障。其後，控制部151a使處理返回至步驟S106。<Steps S114～S118> The control unit 151a confirms whether all the LEDs 20 are turned on based on the image taken by the imaging unit 71. When all the LEDs 20 are not all lit (as long as there is one LED 20 that is not lit), the control unit 151a controls the Z moving unit 55 to move the heating stage 51 in the -Z direction to move the circuit board 10 is separated from wafer 25 and the fault is corrected. After that, the control unit 151a returns the process to step S106.

3.硬化步驟 ＜步驟S200＞ 於所有LED 20已點亮之情形時，控制部151a利用移動部82使探針81離開配線圖案11，於自電路基板10及晶圓25之兩側施加了壓力之狀態下，藉由利用未圖示之加熱部對加熱載台51整體進行加熱，對電路基板10及晶圓25進行加熱而使接著劑41硬化。藉此，LED 20固定於電路基板10。3. Hardening step <Step S200> When all the LEDs 20 have been lit, the control section 151a uses the moving section 82 to move the probe 81 away from the wiring pattern 11, and in a state where pressure is applied from both sides of the circuit board 10 and the wafer 25, by using the The heating part shown in the figure heats the entire heating stage 51 and heats the circuit board 10 and the wafer 25 to harden the adhesive 41. Thereby, the LED 20 is fixed to the circuit board 10.

5.加壓開放步驟 ＜步驟S202～S206＞ 控制部151a停止利用空氣吸引裝置92所進行之空氣之吸引，使晶圓25離開吸附墊62。然後，如圖15（F）所示，控制部151a控制Z移動部55使加熱載台51往-Z方向移動，使於電路基板10連接有晶圓25者與加熱載台51一起往-Z方向移動。最後，控制部151a停止利用空氣吸引裝置91所進行之空氣之吸引，使電路基板10離開上表面51a。然後，自上表面51a取出電路基板10。5. Pressurized opening steps <Steps S202～S206> The control unit 151 a stops the suction of air by the air suction device 92 and moves the wafer 25 away from the suction pad 62. Then, as shown in FIG. 15(F), the control unit 151a controls the Z moving unit 55 to move the heating stage 51 in the -Z direction, so that the wafer 25 connected to the circuit board 10 moves to -Z together with the heating stage 51 Move in direction. Finally, the control unit 151a stops the air suction by the air suction device 91, and moves the circuit board 10 away from the upper surface 51a. Then, the circuit board 10 is taken out from the upper surface 51a.

根據本實施形態，由於使用攝影部76、77，因此可簡潔地進行對準處理。According to this embodiment, since the imaging units 76 and 77 are used, the alignment process can be performed simply.

再者，於本實施形態中，使用了攝影部76、77，但攝影部76並非必須。於未使用攝影部76之情形時，按照步驟S100（參照圖10）、S102（參照圖10）、S104（參照圖14）、S105（參照圖14）之順序進行處理即可。In addition, in this embodiment, the imaging units 76 and 77 are used, but the imaging unit 76 is not essential. When the photographing unit 76 is not used, the processing may be performed in the order of steps S100 (refer to FIG. 10), S102 (refer to FIG. 10), S104 (refer to FIG. 14), and S105 (refer to FIG. 14).

以上，參照圖式對本發明之實施形態進行了詳細說明，但具體之構成並不限定於該實施形態，亦包含不脫離本發明之主旨之範圍之設計變更等。又，可採用將作為上述各實施形態或變形例而進行了說明之構成適當組合而得之構成。Above, the embodiment of the present invention has been described in detail with reference to the drawings, but the specific configuration is not limited to the embodiment, and includes design changes that do not depart from the scope of the spirit of the present invention. In addition, it is possible to adopt a configuration obtained by appropriately combining the configurations described as the respective embodiments or modification examples.

尤其是於上述實施形態中，對將電路基板10及晶圓25貼合之貼合裝置2、3進行了說明，但貼合裝置2、3所貼合之對象（相當於第1構件、第2構件）並不限定於電路基板10及晶圓25，可對大致板狀之各種構件彼此之貼合使用貼合裝置2、3。又，於上述實施形態中，於加熱載台51固定了電路基板10，於吸附墊62固定了晶圓25，但亦可於加熱載台51固定晶圓25，於吸附墊62固定電路基板10。Particularly in the above-mentioned embodiment, the bonding apparatuses 2 and 3 for bonding the circuit board 10 and the wafer 25 have been described, but the bonding apparatuses 2 and 3 are bonded objects (corresponding to the first member, the second 2) It is not limited to the circuit board 10 and the wafer 25, and the bonding apparatuses 2 and 3 can be used for bonding various substantially plate-shaped members. In the above embodiment, the circuit board 10 is fixed to the heating stage 51 and the wafer 25 is fixed to the suction pad 62. However, the wafer 25 may be fixed to the heating stage 51 and the circuit board 10 to the suction pad 62 .

又，於本發明中，所謂「大致」，係不僅包括嚴格相同之情形，亦包括不失去同一性之程度之誤差或變形之概念。例如，大致平行並不限定於嚴格平行之情形。又，例如於僅表現平行、正交等之情形時，設為不僅包括嚴格平行、正交等情形，亦包括大致平行、大致正交等情形。In addition, in the present invention, the term "approximately" not only includes strictly identical conditions, but also includes the concept of errors or deformations that do not lose identity. For example, substantially parallel is not limited to strictly parallel. In addition, for example, when only parallel, orthogonal, etc. are expressed, it is assumed to include not only strictly parallel, orthogonal, etc., but also substantially parallel, substantially orthogonal, and the like.

1:顯示裝置 2、3:貼合裝置 10:電路基板 11:配線圖案 12:連接圖案 20:LED 22:P電極 23:n電極 25:晶圓 30:螢光發光層 30B:藍色螢光發光層 30G:綠色螢光發光層 30R:紅色螢光發光層 31:間隔壁 32:平坦化膜 33:金屬膜 40:驅動電路 41:接著劑 43:硬質軟性基板 50:載台 51:加熱載台 51a:上表面 52:傾斜載台 53:θ載台 54:XY載台 55:Z移動部 60:吸附載台 61:圓筒形托架 61a:凹部 62:吸附墊 62a:孔 62b:底面 63:覆蓋玻璃 64:傾斜載台 65:θ載台 68:真空吸附用接頭 69:吸附部 71、76、77:攝影部 72:安裝部 73:光照射部 74:反射鏡 80:檢查部 81:探針 82:移動部 85:電源 90:支持框架 91、92:空氣吸引裝置 101、102、103、104、105、106:遮罩 151:CPU 151a:控制部 152:RAM 153:ROM 154:輸入輸出介面 155:通訊介面 156:媒體介面 161:輸入輸出裝置 162:網路 163:記憶媒體1: display device 2, 3: Fitting device 10: Circuit board 11: Wiring pattern 12: Connection pattern 20: LED 22: P electrode 23: n electrode 25: Wafer 30: Fluorescent layer 30B: blue fluorescent light-emitting layer 30G: Green fluorescent light emitting layer 30R: Red fluorescent light-emitting layer 31: next door 32: Flattening film 33: Metal film 40: drive circuit 41: Adhesive 43: hard and flexible substrate 50: Stage 51: Heating stage 51a: upper surface 52: Tilt stage 53: Theta stage 54: XY stage 55: Z mobile department 60: Adsorption stage 61: Cylindrical bracket 61a: recess 62: Adsorption pad 62a: hole 62b: bottom surface 63: Cover glass 64: Tilt stage 65: Theta stage 68: Joint for vacuum adsorption 69: Adsorption part 71, 76, 77: Photography Department 72: Installation Department 73: Light Irradiation Department 74: mirror 80: Inspection Department 81: Probe 82: Mobile Department 85: power supply 90: Support frame 91, 92: Air suction device 101, 102, 103, 104, 105, 106: mask 151: CPU 151a: Control Department 152: RAM 153: ROM 154: Input and output interface 155: Communication interface 156: Media Interface 161: input and output devices 162: Network 163: Memory Media

[圖1]係表示使用本發明之製造裝置或製造方法而製造之顯示裝置1之概略之圖。 [圖2]係表示顯示裝置1之概略之局部剖視圖。 [圖3]係示意性表示顯示裝置1之製造方法之圖。 [圖4]係示意性表示顯示裝置1之製造方法之圖。 [圖5]係表示貼合裝置2之概略之圖。 [圖6]係表示吸附部69之概略之圖，（A）為側視圖，（B）為仰視圖。 [圖7]係示意性表示於吸附墊62吸附有晶圓25之情形之圖。 [圖8]係表示攝影部71及安裝部72之概略之圖，（A）為前視圖，（B）為側視圖。 [圖9]係表示貼合裝置2之電性構成之方塊圖。 [圖10]係表示貼合步驟之處理流程之流程圖。 [圖11]係示意性表示貼合步驟之圖。 [圖12]係示意性表示貼合步驟中之探針81之位置之圖。 [圖13]係表示貼合裝置3之概略之圖。 [圖14]係表示貼合步驟之處理流程之流程圖。 [圖15]係示意性表示貼合步驟之圖。Fig. 1 is a diagram showing the outline of a display device 1 manufactured using the manufacturing apparatus or manufacturing method of the present invention. [FIG. 2] A partial cross-sectional view showing the outline of the display device 1. [Fig. 3] A diagram schematically showing a manufacturing method of the display device 1. [Fig. [Fig. 4] A diagram schematically showing a manufacturing method of the display device 1. [Fig. [Fig. 5] A diagram showing the outline of the bonding device 2. [Fig. [Fig. 6] is a diagram showing the outline of the suction part 69, (A) is a side view, and (B) is a bottom view. [FIG. 7] A diagram schematically showing a state where the wafer 25 is adsorbed on the adsorption pad 62. [Fig. 8] is a diagram showing the outline of the photographing unit 71 and the mounting unit 72, (A) is a front view, and (B) is a side view. [Figure 9] is a block diagram showing the electrical configuration of the laminating device 2. [Figure 10] is a flowchart showing the processing flow of the bonding step. [Fig. 11] is a diagram schematically showing the bonding step. [Fig. 12] A diagram schematically showing the position of the probe 81 in the bonding step. [Fig. 13] A diagram showing the outline of the bonding device 3. [Figure 14] is a flowchart showing the processing flow of the bonding step. [Fig. 15] A diagram schematically showing the bonding step.

10:電路基板 10: Circuit board

25:晶圓 25: Wafer

50:載台 50: Stage

51:加熱載台 51: Heating stage

51a:上表面 51a: upper surface

52:傾斜載台 52: Tilt stage

53:θ載台 53: Theta stage

54:XY載台 54: XY stage

55:Z移動部 55: Z mobile department

60:吸附載台 60: Adsorption stage

61:圓筒形托架 61: Cylindrical bracket

62:吸附墊 62: Adsorption pad

63:覆蓋玻璃 63: Cover glass

64:傾斜載台 64: Tilt stage

65:θ載台 65: Theta stage

69:吸附部 69: Adsorption part

71:攝影部 71: Photography Department

72:安裝部 72: Installation Department

80:檢查部 80: Inspection Department

81:探針 81: Probe

82:移動部 82: Mobile Department

90:支持框架 90: Support frame

Claims (12)

一種貼合裝置，其將大致板狀之第1構件及透明的大致板狀之第2構件貼合，其特徵在於具備： 大致板狀之第1吸附部，其吸附上述第1構件； 大致板狀之第2吸附部，其設於上述第1吸附部之鉛直方向上側，且吸附上述第2構件； 第1移動部，其使上述第1吸附部或上述第2吸附部於上下方向移動； 第2移動部，其使上述第1吸附部於水平方向移動；及 攝影部，其設於上述第2吸附部之鉛直方向上側；且 上述第2吸附部為兩端被覆蓋之大致筒狀之構件，設有吸引空氣之吸引口， 上述第2吸附部之上側之面係至少一部分由透明構件形成， 上述第2吸附部之下側之面為形成有貫通厚度方向之孔之透明的吸附墊， 上述攝影部透過上述透明構件及上述吸附墊拍攝上述第1構件及/或上述第2構件。A bonding device for bonding a substantially plate-shaped first member and a transparent substantially plate-shaped second member, and is characterized in that it includes: A substantially plate-shaped first adsorbing portion, which adsorbs the first member; A substantially plate-shaped second adsorption part, which is provided on the upper side of the vertical direction of the first adsorption part and adsorbs the second member; A first moving part that moves the first suction part or the second suction part in the vertical direction; A second moving part that moves the first suction part in a horizontal direction; and The photographing section is provided on the upper side of the vertical direction of the second adsorption section; and The second suction part is a roughly cylindrical member covered at both ends, and is provided with suction ports for sucking air. At least a part of the upper surface of the second suction portion is formed of a transparent member, The surface below the second suction part is a transparent suction pad with holes penetrating through the thickness direction. The photographing unit photographs the first member and/or the second member through the transparent member and the suction pad. 如請求項1之貼合裝置，其中， 上述第1構件及上述第2構件於一者形成有複數個LED，於另一者形成有連接圖案， 具備連接於電源之複數個探針， 上述探針可於抵接於上述連接圖案之位置與未抵接之位置之間於上下方向移動。Such as the fitting device of claim 1, in which, A plurality of LEDs are formed on one of the first member and the second member, and a connection pattern is formed on the other, With multiple probes connected to the power supply, The probe can move up and down between a position abutting on the connection pattern and a position not abutting. 如請求項1或2之貼合裝置， 其具備使上述第2吸附部於水平方向移動之第3移動部， 上述第3移動部為大致筒狀之構件，設於上述第2吸附部之鉛直方向上側。Such as the fitting device of claim 1 or 2, It is provided with a third moving part that moves the second suction part in a horizontal direction, The said 3rd moving part is a substantially cylindrical member, and is provided in the vertical upper side of the said 2nd adsorption part. 如請求項1至3中任一項之貼合裝置，其具備： 大致柱狀之安裝部，其保持上述攝影部及上述第2吸附部； 光照射部，其以高度位於上述攝影部與上述第2吸附部之間之方式設於上述安裝部；及 反射鏡，其以可於與上述攝影部之光路重疊之位置與未重疊之位置之間於水平方向移動之方式設置。Such as the laminating device of any one of claims 1 to 3, which has: A roughly columnar mounting part that holds the photographing part and the second suction part; A light irradiating part is provided on the mounting part in such a way that the height is between the photographing part and the second suction part; and The reflecting mirror is arranged in such a way that it can be moved in a horizontal direction between a position overlapping with the light path of the above-mentioned photographing unit and a position not overlapping. 如請求項1至4中任一項之貼合裝置，其具備： 第1控制部，其一面利用上述攝影部透過上述第2吸附部及上述第2構件拍攝上述第1構件進行觀察，一面控制上述第2移動部使上述第1吸附部移動。Such as the lamination device of any one of claims 1 to 4, which has: The first control unit controls the second moving unit to move the first suction unit while imaging the first member through the second suction unit and the second member by the imaging unit for observation. 如請求項2之貼合裝置，其具備： 第4移動部，其使上述探針於上下方向移動；及 第2控制部，其控制上述第1移動部對上述第1構件及上述第2構件進行加壓，於該加壓之狀態下控制上述第4移動部使上述探針抵接於上述連接圖案。Such as the laminating device of claim 2, which has: The fourth moving part, which moves the probe in the vertical direction; and The second control unit controls the first moving unit to pressurize the first member and the second member, and in the pressurized state, controls the fourth moving unit to make the probe abut on the connection pattern. 一種貼合方法，其特徵在於具有： 於大致板狀之第1吸附部載置板狀之第1構件，於設於上述第1吸附部之鉛直方向上側之透明的大致板狀之第2吸附部吸附透明的板狀之第2構件，將上述第1構件及上述第2構件配置為大致平行之步驟； 一面利用設於上述第2吸附部之鉛直方向上側之攝影部透過上述第2吸附部及上述第2構件拍攝上述第1構件進行觀察，一面使上述第1構件於水平方向移動，進行上述第1構件與上述第2構件之位置對準之步驟；及 對上述第1構件及上述第2構件進行加壓之步驟。A fitting method characterized by: Place the plate-shaped first member on the substantially plate-shaped first suction part, and suction the transparent plate-shaped second member on the transparent substantially plate-shaped second suction part provided on the vertical upper side of the above-mentioned first suction part , The step of arranging the first member and the second member to be substantially parallel; While using the imaging unit provided on the upper side of the vertical direction of the second suction portion to photograph the first member through the second suction portion and the second member for observation, the first member is moved in the horizontal direction to perform the first The step of aligning the position of the component with the second component; and The step of applying pressure to the first member and the second member. 如請求項7之貼合方法，其中， 上述第1構件及上述第2構件於一者形成有複數個LED，於另一者形成有連接圖案， 於上述第1構件及/或上述第2構件塗佈接著劑， 且具有： 於對上述第1構件及上述第2構件進行加壓之狀態下移動探針，將上述探針抵接於上述連接圖案而點亮上述LED之步驟； 利用上述攝影部拍攝上述第1構件及上述第2構件，以該攝影部拍攝之圖像確認上述LED之點亮之步驟；及 於上述LED全部點亮之情形時，使上述接著劑硬化之步驟。Such as the fitting method of claim 7, in which, A plurality of LEDs are formed on one of the first member and the second member, and a connection pattern is formed on the other, Apply an adhesive to the first member and/or the second member, And has: A step of moving the probe while pressing the first member and the second member, and abutting the probe against the connection pattern to light up the LED; The step of photographing the first member and the second member by the photographing section, and confirming the lighting of the LED with the image photographed by the photographing section; and When all the LEDs are lit, the step of curing the adhesive. 如請求項7或8之貼合方法， 其利用如下步驟將上述第1構件及上述第2構件配置為大致平行： 於上述第1吸附部載置上述第2構件之步驟； 一面利用上述攝影部透過上述第2吸附部拍攝上述第2構件進行觀察，一面使上述第1吸附部於水平方向移動之步驟； 以上述第2吸附部吸附上述第2構件之步驟；及 於上述第1吸附部載置上述第1構件之步驟。Such as the fitting method of claim 7 or 8, It uses the following steps to arrange the first member and the second member to be substantially parallel: The step of placing the second member on the first suction part; The step of photographing and observing the second member through the second suction part by the photographing part, and moving the first suction part in a horizontal direction; The step of adsorbing the second member with the second suction part; and The step of placing the first member on the first suction part. 一種顯示裝置之製造方法，其包括將於一者形成有複數個LED，於另一者形成有連接圖案之大致板狀之第1構件及透明的大致板狀之第2構件貼合之貼合步驟，其特徵在於： 上述貼合步驟具有步驟： 於大致板狀之第1吸附部載置上述第1構件，於設於上述第1吸附部之鉛直方向上側之透明的大致板狀之第2吸附部吸附上述第2構件，將上述第1構件及上述第2構件配置為大致平行之步驟； 一面利用設於上述第2吸附部之鉛直方向上側之攝影部透過上述第2吸附部及上述第2構件拍攝上述第1構件進行觀察，一面使上述第1構件於水平方向移動，進行上述第1構件與上述第2構件之位置對準之步驟；及 對上述第1構件及上述第2構件進行加壓之步驟。A method for manufacturing a display device, which includes bonding a substantially plate-shaped first member and a transparent substantially plate-shaped second member with a plurality of LEDs formed on one side and a connection pattern formed on the other side The steps are characterized by: The above bonding step has steps: The first member is placed on the substantially plate-shaped first suction part, and the second member is adsorbed on the transparent substantially plate-shaped second suction part provided on the upper side of the vertical direction of the first suction part, and the first member And the above-mentioned second member is arranged in substantially parallel steps; While using the imaging unit provided on the upper side of the vertical direction of the second suction portion to photograph the first member through the second suction portion and the second member for observation, the first member is moved in the horizontal direction to perform the first The step of aligning the position of the component with the second component; and The step of applying pressure to the first member and the second member. 如請求項10之顯示裝置之製造方法，其中， 於上述第1構件及/或上述第2構件塗佈接著劑， 上述貼合步驟具有： 於對上述第1構件及上述第2構件進行加壓之狀態下移動探針，將上述探針抵接於上述連接圖案而點亮上述LED之步驟； 利用上述攝影部拍攝上述第1構件及上述第2構件，以拍攝之圖像確認上述LED之點亮之步驟；及 於上述LED全部點亮之情形時，使上述接著劑硬化之步驟。Such as the manufacturing method of the display device of claim 10, wherein: Apply an adhesive to the first member and/or the second member, The above bonding steps have: A step of moving the probe while pressing the first member and the second member, and abutting the probe against the connection pattern to light up the LED; The step of photographing the first member and the second member by the photographing unit, and confirming the lighting of the LED with the photographed image; and When all the LEDs are lit, the step of curing the adhesive. 如請求項10或11之顯示裝置之製造方法， 其利用如下步驟將上述第1構件及上述第2構件配置為大致平行： 於上述第1吸附部載置上述第2構件之步驟； 一面利用上述攝影部透過上述第2吸附部拍攝上述第2構件進行觀察，一面使上述第1吸附部於水平方向移動之步驟； 以上述第2吸附部吸附上述第2構件之步驟；及 於上述第1吸附部載置上述第1構件之步驟。Such as the manufacturing method of the display device of claim 10 or 11, It uses the following steps to arrange the first member and the second member to be substantially parallel: The step of placing the second member on the first suction part; The step of photographing and observing the second member through the second suction part by the photographing part, and moving the first suction part in a horizontal direction; The step of adsorbing the second member with the second suction part; and The step of placing the first member on the first suction part.
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TWI815447B (en) * 2021-05-19 2023-09-11 日商日本顯示器股份有限公司 Manufacturing method and holding substrate of display device

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI815447B (en) * 2021-05-19 2023-09-11 日商日本顯示器股份有限公司 Manufacturing method and holding substrate of display device

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