TW202046528A - Bonding device, bonding method, and display device production method - Google Patents
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Abstract
Description
本發明係關於貼合裝置、貼合方法及顯示裝置之製造方法。The present invention relates to a bonding device, a bonding method, and a manufacturing method of a display device.
專利文獻1中,揭示一種元件轉印裝置,其具有:基板保持部,其以使轉印基板及暫時保持基板對向之狀態進行支持;攝影機,其拍攝轉印基板之對準標記,並且通過轉印基板拍攝暫時保持基板之對準標記;位置對準手段,其使轉印基板及暫時保持基板之位置對準;及加壓手段,其於暫時保持基板向轉印基板側成為凸起之彎曲狀態之方向對暫時保持基板進行加壓。
[現有技術文獻]
[專利文獻]
[專利文獻1]日本特開2009-295853號公報[Patent Document 1] JP 2009-295853 A
[發明所欲解決之問題][The problem to be solved by the invention]
於專利文獻1所記載之發明中,由於在向轉印基板側成為凸起之彎曲狀態之方向對暫時保持基板進行加壓,因此轉印基板亦成為彎曲狀態。因此,於進行將形成有LED之晶圓及電路基板貼合之步驟時,若使用專利文獻1所記載之發明,則無法大致均勻地對表面整體進行加壓,有產生破壞LED、LED之不均勻之點亮或晶圓裂開之虞。In the invention described in
本發明係鑒於此種事情而完成者,目的在於提供於以較高精度進行位置對準之狀態下,能夠大致均勻地對表面整體進行加壓之貼合裝置、貼合方法及顯示裝置之製造方法。 [解決問題之手段]The present invention was made in view of such matters, and its purpose is to provide a bonding device, a bonding method, and a display device that can substantially uniformly pressurize the entire surface while aligning with high accuracy. method. [Means to Solve the Problem]
為了解決上述課題,本發明之貼合裝置例如係將大致板狀之第1構件及透明的大致板狀之第2構件貼合之貼合裝置,其特徵在於具備:大致板狀之第1吸附部,其吸附上述第1構件;大致板狀之第2吸附部,其設於上述第1吸附部之鉛直方向上側,且吸附上述第2構件;第1移動部,其使上述第1吸附部或上述第2吸附部於上下方向移動;第2移動部,其使上述第1吸附部於水平方向移動;及攝影部,其設於上述第2吸附部之鉛直方向上側;且上述第2吸附部為兩端被覆蓋之大致筒狀之構件,設有吸引空氣之吸引口,上述第2吸附部之上側之面係至少一部分由透明構件形成,上述第2吸附部之下側之面為形成有貫通厚度方向之孔之透明的吸附墊,上述攝影部透過上述透明構件及上述吸附墊拍攝上述第1構件及/或上述第2構件。In order to solve the above-mentioned problems, the laminating device of the present invention is, for example, a laminating device for laminating a substantially plate-shaped first member and a transparent substantially plate-shaped second member, and is characterized by having: a substantially plate-shaped first suction Section, which adsorbs the first member; a substantially plate-shaped second suction section, which is provided on the upper side of the vertical direction of the first suction section, and adsorbs the second member; the first moving section, which makes the first suction section Or the second suction part moves in the vertical direction; the second moving part moves the first suction part in the horizontal direction; and the photographing part is provided on the upper side of the vertical direction of the second suction part; and the second suction part The part is a substantially cylindrical member covered at both ends and is provided with a suction port for sucking air. At least a part of the upper surface of the second suction part is formed of a transparent member, and the lower surface of the second suction part is formed A transparent suction pad having a hole penetrating through the thickness direction, and the imaging section photographs the first member and/or the second member through the transparent member and the suction pad.
根據本發明之貼合裝置,大致板狀之第1吸附部吸附大致板狀之第1構件,設於第1吸附部之鉛直方向上側之大致板狀之第2吸附部吸附透明的大致板狀之第2構件,而將該等貼合。第2吸附部為兩端被覆蓋之大致筒狀之構件,第2吸附部之下側之面為形成有貫通厚度方向之孔之透明的吸附墊,藉由自吸引口吸引空氣而將第2構件吸附於吸附墊。第2吸附部之上側之面係至少一部分由透明構件形成,設於第2吸附部之鉛直方向上側之攝影部透過透明構件、吸附墊拍攝第1構件及/或第2構件。藉由攝影部直接觀察第1構件或第2構件,能夠以較高精度進行位置對準。又,藉由以大致板狀之第1吸附部及第2吸附部夾住第1構件及第2構件,能夠大致均勻地對表面整體進行加壓。According to the laminating device of the present invention, the substantially plate-shaped first suction portion suctions the substantially plate-shaped first member, and the substantially plate-shaped second suction portion provided on the upper side of the vertical direction of the first suction portion suctions the transparent substantially plate-shaped The second member is attached to these. The second suction part is a substantially cylindrical member covered at both ends, and the surface below the second suction part is a transparent suction pad with holes penetrating the thickness direction. The component is adsorbed on the adsorption pad. At least a part of the upper surface of the second suction part is formed of a transparent member, and the imaging part provided on the vertical upper side of the second suction part photographs the first member and/or the second member through the transparent member and the suction pad. By directly observing the first member or the second member by the imaging unit, position alignment can be performed with high accuracy. In addition, by sandwiching the first member and the second member with the substantially plate-shaped first suction portion and the second suction portion, it is possible to substantially uniformly pressurize the entire surface.
此處,上述第1構件及上述第2構件於一者形成有複數個LED,於另一者形成有連接圖案,具備連接於電源之複數個探針,上述探針可於抵接於上述連接圖案之位置與未抵接之位置之間於上下方向移動。藉此,可利用貼合裝置進行LED之點亮確認。Here, the first member and the second member have a plurality of LEDs formed on one of them, and a connection pattern is formed on the other, and are provided with a plurality of probes connected to a power source. The probes can abut against the connection Move between the position of the pattern and the non-contact position in the up and down direction. In this way, the bonding device can be used to confirm the lighting of the LED.
此處,具備使上述第2吸附部於水平方向移動之第3移動部,上述第3移動部為大致筒狀之構件,設於上述第2吸附部之鉛直方向上側亦可。藉此,攝影部可透過第3移動部、透明構件及吸附墊拍攝第1構件及/或第2構件。Here, a third moving part that moves the second suction part in a horizontal direction is provided. The third moving part is a substantially cylindrical member and may be provided on the upper side of the second suction part in the vertical direction. Thereby, the photographing part can photograph the first member and/or the second member through the third moving part, the transparent member, and the suction pad.
此處,亦可具備:大致柱狀之安裝部,其保持上述攝影部及上述第2吸附部;光照射部,其以高度位於上述攝影部與上述第2吸附部之間之方式設於上述安裝部;及反射鏡,其以可於與上述攝影部之光路重疊之位置與未重疊之位置之間於水平方向移動之方式設置。藉此,可使用光硬化性樹脂連接第1構件及第2構件。Here, it may also be provided with: a substantially columnar mounting portion that holds the imaging portion and the second suction portion; and a light irradiating portion that is provided on the above-mentioned section so that the height is located between the imaging portion and the second suction portion The mounting part; and the reflecting mirror, which is arranged in a way that can be moved in the horizontal direction between the position where the light path of the above-mentioned photographing part overlaps and the position where the light path is not overlapped. Thereby, the first member and the second member can be connected using the photocurable resin.
此處,亦可具備:第1控制部,其一面利用上述攝影部透過上述第2吸附部及上述第2構件拍攝上述第1構件進行觀察,一面控制上述第2移動部使上述第1吸附部移動。藉此,可以較高精度進行位置對準。Here, it may also be provided with: a first control section, one side of which is observed by imaging the first member through the second suction section and the second member by the imaging section, and controlling the second moving section so that the first suction section mobile. As a result, position alignment can be performed with higher accuracy.
此處,亦可具備:第4移動部,其使上述探針於上下方向移動;及第2控制部,其控制上述第1移動部對上述第1構件及上述第2構件進行加壓,於該加壓之狀態下控制上述第4移動部使上述探針抵接於上述連接圖案。如此,藉由於連接第1構件及第2構件前確認LED之點亮,可於LED未被點亮之情形時將第1構件及第2構件分離,並修正故障。因此,能夠提高製造時之良率。Here, it may also be provided with: a fourth moving part which moves the probe in the vertical direction; and a second control part which controls the first moving part to press the first member and the second member, In this pressurized state, the fourth moving part is controlled so that the probe abuts against the connection pattern. In this way, by confirming the lighting of the LED before connecting the first member and the second member, the first member and the second member can be separated when the LED is not turned on, and the malfunction can be corrected. Therefore, the yield during manufacturing can be improved.
為了解決上述課題,本發明之貼合方法之特徵在於例如具有:於大致板狀之第1吸附部載置板狀之第1構件,於設於上述第1吸附部之鉛直方向上側之透明的大致板狀之第2吸附部吸附透明的板狀之第2構件,將上述第1構件及上述第2構件配置為大致平行之步驟;一面利用設於上述第2吸附部之鉛直方向上側之攝影部透過上述第2吸附部及上述第2構件拍攝上述第1構件進行觀察,一面使上述第1構件於水平方向移動,進行上述第1構件與上述第2構件之位置對準之步驟;及對上述第1構件及上述第2構件進行加壓之步驟。藉此,於以較高精度進行位置對準之狀態下,能夠大致均勻地對表面整體進行加壓。In order to solve the above-mentioned problems, the bonding method of the present invention is characterized by, for example, placing a plate-shaped first member on a substantially plate-shaped first suction part, and a transparent transparent material provided on the vertical upper side of the first suction part. The step of arranging the first member and the second member to be substantially parallel to the substantially plate-shaped second suction part sucking the transparent plate-shaped second member; one side utilizes the photography provided on the upper side of the vertical direction of the second suction part The section photographs the first member through the second suction section and the second member for observation, while moving the first member in the horizontal direction to perform the step of aligning the first member and the second member; and The step of applying pressure to the first member and the second member. Thereby, the entire surface can be pressurized substantially uniformly in a state where the position alignment is performed with higher accuracy.
此處,上述第1構件及上述第2構件於一者形成有複數個LED,於另一者形成有連接圖案,於上述第1構件及/或上述第2構件塗佈接著劑,具有:於對上述第1構件及上述第2構件進行加壓之狀態下移動探針,將上述探針抵接於上述連接圖案而點亮上述LED之步驟;利用上述攝影部拍攝上述第1構件及上述第2構件,以該拍攝之圖像確認上述LED之點亮之步驟;及於上述LED全部點亮之情形時,使上述接著劑硬化之步驟亦可。如此,藉由於連接第1構件及第2構件前確認LED之點亮,可於LED未被點亮之情形時將第1構件及第2構件分離,並修正故障。因此,能夠提高製造時之良率。Here, the first member and the second member have a plurality of LEDs formed on one of them, a connection pattern is formed on the other, and an adhesive is applied to the first member and/or the second member, and has: The step of moving the probe while pressing the first member and the second member, and contacting the probe with the connection pattern to light up the LED; and photographing the first member and the first member by the
此處,亦可利用如下步驟將上述第1構件及上述第2構件配置為大致平行:於上述第1吸附部載置上述第2構件之步驟;一面利用上述攝影部透過上述第2吸附部拍攝上述第2構件進行觀察,一面使上述第1吸附部於水平方向移動之步驟;以上述第2吸附部吸附上述第2構件之步驟;及於上述第1吸附部載置上述第1構件之步驟。藉此,可一面利用1個攝影部直接觀察第1構件或第2構件一面進行對準。其結果,可以較高精度進行位置對準。Here, the first member and the second member can also be arranged substantially in parallel by the following steps: the step of placing the second member on the first suction part; while using the photographing part to shoot through the second suction part Observing the second member, the step of moving the first suction part in the horizontal direction; the step of sucking the second member by the second suction part; and the step of placing the first member on the first suction part . Thereby, it is possible to perform alignment while directly observing the first member or the second member with one imaging section. As a result, position alignment can be performed with higher accuracy.
為了解決上述課題,本發明之顯示裝置之製造方法例如係包括將於一者形成有複數個LED,於另一者形成有連接圖案之大致板狀之第1構件及透明的大致板狀之第2構件貼合之貼合步驟之顯示裝置之製造方法,其特徵在於:上述貼合步驟具有如下步驟:於大致板狀之第1吸附部載置上述第1構件,於設於上述第1吸附部之鉛直方向上側之透明的大致板狀之第2吸附部吸附上述第2構件,將上述第1構件及上述第2構件配置為大致平行之步驟;一面利用設於上述第2吸附部之鉛直方向上側之攝影部透過上述第2吸附部及上述第2構件拍攝上述第1構件進行觀察,一面使上述第1構件於水平方向移動,進行上述第1構件與上述第2構件之位置對準之步驟;及對上述第1構件及上述第2構件進行加壓之步驟。In order to solve the above-mentioned problems, the manufacturing method of the display device of the present invention includes, for example, forming a substantially plate-shaped first member having a plurality of LEDs on one side and a connection pattern on the other and a transparent substantially plate-shaped first member. A method of manufacturing a display device with a bonding step of 2 member bonding, characterized in that: the bonding step has the following steps: the first member is placed on a substantially plate-shaped first suction part, and the first member is placed on the first suction part. The step of arranging the first member and the second member to be substantially parallel to the transparent substantially plate-shaped second suction portion on the upper side of the vertical direction of the portion; one side uses the vertical provided on the second suction portion The photographing section on the upper side of the direction photographs the first member through the second suction section and the second member for observation. While moving the first member in the horizontal direction, the first member and the second member are aligned. Step; and the step of applying pressure to the first member and the second member.
此處,於上述第1構件及/或上述第2構件塗佈接著劑,上述貼合步驟具有:於對上述第1構件及上述第2構件進行加壓之狀態下移動探針,將上述探針抵接於上述連接圖案而點亮上述LED之步驟;利用上述攝影部拍攝上述第1構件及上述第2構件,以該拍攝之圖像確認上述LED之點亮之步驟;及於上述LED全部點亮之情形時,使上述接著劑硬化之步驟亦可。Here, an adhesive is applied to the first member and/or the second member, and the bonding step includes: moving the probe in a state where the first member and the second member are pressurized, and the probe The step of illuminating the LED by the needle abutting the connection pattern; the step of photographing the first member and the second member by the photographing unit, and confirming the lighting of the LED with the captured image; and the step of all the LEDs In the case of lighting, the step of hardening the above-mentioned adhesive is also acceptable.
此處,亦可利用如下步驟將上述第1構件及上述第2構件配置為大致平行:於上述第1吸附部載置上述第2構件之步驟;一面利用上述攝影部透過上述第2吸附部拍攝上述第2構件進行觀察,一面使上述第1吸附部於水平方向移動之步驟;以上述第2吸附部吸附上述第2構件之步驟;及於上述第1吸附部載置上述第1構件之步驟。 [發明之效果]Here, the first member and the second member can also be arranged substantially in parallel by the following steps: the step of placing the second member on the first suction part; while using the photographing part to shoot through the second suction part Observing the second member, the step of moving the first suction part in the horizontal direction; the step of sucking the second member by the second suction part; and the step of placing the first member on the first suction part . [Effects of Invention]
根據本發明,於以較高精度進行位置對準之狀態下,能夠大致均勻地對表面整體進行加壓。According to the present invention, the entire surface can be pressurized substantially uniformly in a state in which position alignment is performed with high accuracy.
以下,參照圖式對本發明之實施形態詳細地進行說明。Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.
<第1實施形態>
圖1係表示使用本發明之製造裝置或製造方法而製造之顯示裝置1之概略之圖。顯示裝置1為複數個微型LED配置為矩陣狀之全彩LED顯示面板,以彩色顯示映像。<The first embodiment>
FIG. 1 is a diagram showing the outline of a
圖1係表示顯示裝置1之概略之俯視圖。顯示裝置1於大致板狀之電路基板亦即電路基板10配置有複數個LED 20。LED 20為大致50 μm×大致50 μm以下大小之超小型LED,例如發射紫外光(波長為385 nm)。由於LED 20之構造已為公知,因此省略詳細說明。FIG. 1 is a plan view showing the outline of the
LED 20於縱向、橫向連續排列。於LED 20之上側,設有具有紅色螢光發光層30R、綠色螢光發光層30G及藍色螢光發光層30B之螢光發光層30。The
圖2係表示顯示裝置1之概略之局部剖視圖。電路基板10為透光基板,例如使用藍寶石玻璃形成。於電路基板10,設有具有連接LED 20之連接圖案12(參照圖3)之配線圖案11。於配線圖案11接著LED 20,配線圖案11上之連接圖案12與LED 20之p電極22及n電極23電性連接。FIG. 2 is a partial cross-sectional view showing the outline of the
以覆蓋LED 20之方式設有平坦化膜32,於平坦化膜32之上側,設有螢光發光層30、及隔開螢光發光層30之間隔壁31。於間隔壁31之表面設有防止混色之金屬膜(省略圖示)。A
各LED 20成為子像素,R、G、B之3色子像素構成1像素。於本實施形態中,子像素為條狀排列(參照圖1),但子像素之排列亦可為馬賽克排列、三角排列等。Each
於配線圖案11電性連接有驅動電路40。驅動電路40將驅動訊號供給至各LED 20,對各LED 20分別進行接通/斷開驅動而使其點亮/熄滅。The driving
圖3、4係示意性表示顯示裝置1之製造方法之圖。
<步驟1>如圖3(A)所示,製作形成有配線圖案11或連接圖案12(省略圖示)之電路基板10。電路基板10為大致板狀之構件。電路基板10可透明,亦可不透明。3 and 4 are diagrams schematically showing the manufacturing method of the
<步驟2>如圖3(B)所示,於用於連接配線圖案11或LED 20之連接圖案12之上塗佈接著劑41。接著劑41可塗佈於配線圖案11及連接圖案12,亦可塗佈於配線圖案11或連接圖案12之任一者。較理想為於接著劑41使用具有導電性之樹脂,例如混合碳或金屬(例如銀)之樹脂。塗佈該接著劑之步驟具有:使用塗佈機等於配線圖案11上塗佈接著劑之步驟;以大致90℃加熱2分鐘左右使溶液蒸發之預烘烤步驟;於電路基板10之上載置遮罩101進行對準之步驟;於常溫下曝光而利用光使接著劑硬化(暫時硬化),將遮罩101之圖案轉印至接著劑之曝光步驟;及去除未硬化之接著劑之顯影步驟。<
<步驟3>如圖3(C)所示,將形成有複數個LED 20之透明的大致板狀之晶圓25、及塗佈有接著劑之電路基板10貼合,將LED 20固定於連接圖案上。關於該貼合步驟,於後文詳細說明。<
<步驟4>於電路基板10固定LED 20後,如圖3(D)所示,以覆蓋LED 20之方式形成平坦化膜32。該平坦化膜形成步驟具有:使用塗佈機等於配線圖案11上塗佈平坦化膜32之材料之步驟;進行加熱使溶液蒸發之預烘烤步驟;於電路基板10之上載置遮罩102進行對準之步驟;於常溫下曝光而使平坦化膜32硬化之曝光步驟;去除未硬化之平坦化膜之材料之顯影步驟;及去除水分等之後烘烤步驟。<Step 4> After fixing the
<步驟5>如圖3(E)所示,於平坦化膜32之上側形成間隔壁31。該間隔壁形成步驟具有:使用塗佈機等於配線圖案11上塗佈間隔壁31之材料之步驟;進行加熱使溶液蒸發之預烘烤步驟;於電路基板10之上載置遮罩103進行對準之步驟;於常溫下曝光而使間隔壁31硬化之曝光步驟;去除未硬化之間隔壁之材料之顯影步驟;及去除水分之後烘烤步驟等。<Step 5> As shown in FIG. 3(E), a
<步驟6>如圖3(F)所示,對步驟5中形成之間隔壁31進行鍍覆處理,於間隔壁31及平坦化膜32之表面形成金屬膜33。鍍覆處理例如可採用無電解鍍Ni處理等。<Step 6> As shown in FIG. 3(F), the
<步驟7>如圖3(G)所示,去除步驟6中形成之金屬膜33中之形成於平坦化膜32之表面之金屬膜33。於本實施形態中,利用雷射加工去除金屬膜。<
<步驟8>如圖4(A)所示,於間隔壁31之間填充含有紅色螢光色素(顏料或染料)之螢光發光抗蝕劑並使其硬化,形成紅色螢光發光層30R。紅色螢光發光層30R形成步驟具有:使用刮刀將螢光發光抗蝕劑填充於間隔壁31之間之步驟;進行加熱使溶液蒸發之預烘烤步驟;於電路基板10之上載置遮罩104進行對準之步驟;於常溫下曝光而使紅色螢光發光層30R硬化之曝光步驟;去除未硬化之螢光發光抗蝕劑之顯影步驟;及去除水分等之後烘烤步驟。<Step 8> As shown in FIG. 4(A), a fluorescent light-emitting resist containing a red fluorescent pigment (pigment or dye) is filled between the
<步驟9>如圖4(B)所示,於間隔壁31之間填充含有綠色螢光色素之螢光發光抗蝕劑並使其硬化,形成綠色螢光發光層30G。綠色螢光發光層30G形成步驟於使用遮罩105一點以外,與紅色螢光發光層30R形成步驟大致相同,因此省略說明。<Step 9> As shown in FIG. 4(B), a fluorescent light-emitting resist containing a green fluorescent dye is filled between the
<步驟10>如圖4(C)所示,於間隔壁31之間填充含有藍色螢光色素之螢光發光抗蝕劑並使其硬化,形成藍色螢光發光層30B。藍色螢光發光層30B形成步驟於使用遮罩106一點以外,與紅色螢光發光層30R形成步驟大致相同,因此省略說明。<Step 10> As shown in FIG. 4(C), a fluorescent light-emitting resist containing a blue fluorescent dye is filled between the
<步驟11>如圖4(D)所示,於配線圖案11安裝硬質軟性基板43。再者,亦可將硬質軟性基板以外之基板安裝於配線圖案11。<Step 11> As shown in FIG. 4(D), a rigid
<步驟12>如圖4(E)所示,於硬質軟性基板43連接驅動電路40。藉此,來自驅動電路40之驅動訊號透過配線圖案11傳達至LED 20,而作為顯示裝置1發揮功能。<Step 12> As shown in FIG. 4(E), the
其次,對將晶圓25及電路基板10貼合,將LED 20及配線圖案11電性連接之貼合步驟(步驟3)中所使用之貼合裝置進行說明。圖5係表示貼合裝置2之概略之圖。於圖5中,將鉛直方向設為Z方向,將與Z方向大致正交之方向設為X方向及Y方向。X方向及Y方向大致正交。Next, the bonding apparatus used in the bonding step (step 3) of bonding the
貼合裝置2主要具有載台50、吸附載台60、攝影部71、探針81及支持框架90。The
支持框架90為覆蓋貼合裝置2外側之大致箱狀之殼體。於支持框架90之內部,設有載台50、吸附載台60、檢查部80等。The supporting
載台50主要具有加熱載台51(相當於第1吸附部)、傾斜載台52、θ載台53、XY載台54及Z移動部55。The
加熱載台51為大致板狀(此處為大致厚板狀)之構件,於上表面51a載置電路基板10。於加熱載台51形成有於上表面51a開口之孔(省略圖示),藉由利用與該孔連接之空氣吸引裝置91(參照圖9)吸引空氣,於上表面51a吸附電路基板10並固定。再者,於加熱載台51亦可使用多孔質材料。The
又,加熱載台51具有加熱部(省略圖示)。加熱部將加熱載台51整體維持為固定溫度(例如大概120度或大概200度以上)。Moreover, the
傾斜載台52、θ載台53及XY載台54設於加熱載台51與Z移動部55之間。傾斜載台52使加熱載台51繞X軸、Y軸旋動(使加熱載台51傾斜)。θ載台53使加熱載台51繞z軸旋動。XY載台54使加熱載台51於X方向、Y方向平行移動。Z移動部55使加熱載台51、傾斜載台52、θ載台53及XY載台54於z軸平行移動。由於傾斜載台52、θ載台53、XY載台54及Z移動部55可使用已為公知之技術,因此省略說明。The
吸附載台60設於載台50之鉛直方向上側(+Z側)。吸附載台60主要具有圓筒形托架61、吸附墊62、覆蓋玻璃63、傾斜載台64及θ載台65。The
圓筒形托架61、吸附墊62及覆蓋玻璃63為吸附晶圓25之吸附部69(相當於第2吸附部),為兩端被覆蓋之大致筒狀之構件。再者,於本發明中,所謂大致筒狀為中空之棒材,為包括大致圓筒形狀、大致多邊形筒狀等之概念。又,大致筒狀亦包括於側面有突起部或凹陷部者。大致筒狀之構件亦包括於側面與上表面或側面與底面之邊界帶有弧度而無法明確區別者。又,大致筒狀之構件亦包括於中空部具有肋部或柱材等補強材者。The
圖6係表示吸附部69之概略之圖,(A)為側視圖,(B)為仰視圖。於圖6(A)中,將一部分剖面顯示。FIG. 6 is a diagram showing the outline of the
圓筒形托架61為了保持較高強度,由鋁、鐵等金屬形成。圓筒形托架61為大致筒狀,吸附墊62及覆蓋玻璃63覆蓋圓筒形托架61之兩端。In order to maintain high strength, the
吸附墊62為透明的大致板狀之構件,覆蓋圓筒形托架61之下側之端部。於吸附墊62形成有貫通厚度方向(Z方向)之孔62a。該吸附用之孔62a可為1個,亦可為複數個。The
作為吸附墊62之材質之例,可列舉玻璃或樹脂。吸附墊62較佳為整體透明,亦可有一部分不透明的部分。例如,吸附墊62可為組合玻璃及橡膠等複數個材料而得者。又,吸附墊62可不一定整體為透明,只要攝影部71拍攝對準標記或者對準所需之電路基板10或晶圓25之一部分所需之部分為透明即可。As an example of the material of the
覆蓋玻璃63為覆蓋圓筒形托架61之上側之面之透明構件。覆蓋玻璃63之材質可為透明的樹脂,但較佳為玻璃。藉由於圓筒形托架61之上端側形成有凹部61a,於凹部61a之內部安裝有覆蓋玻璃63,從而覆蓋玻璃63覆蓋圓筒形托架61之上端面。換言之,吸附部69之上側之面係至少一部分由透明構件形成。The
於圓筒形托架61之側面設有與空氣吸引裝置92(參照圖9)連接之真空吸附用接頭68。由於圓筒形托架61之兩端面由吸附墊62及覆蓋玻璃63覆蓋,因此藉由空氣吸引裝置92透過真空吸附用接頭68吸引吸附部69內部之空氣,如圖7所示,於吸附墊62之底面62b吸附有晶圓25。A vacuum suction joint 68 connected to an air suction device 92 (refer to FIG. 9) is provided on the side of the
返回圖5之說明。傾斜載台64及θ載台65設於吸附部69之鉛直方向上側,使吸附部69於水平方向移動。具體而言,傾斜載台64使吸附部69繞X軸、Y軸旋動(使吸附部69傾斜)。又,θ載台65使吸附部69繞z軸旋動。由於傾斜載台64及θ載台65可使用已為公知之技術,因此省略說明。再者,本發明中之水平方向之移動不僅為平行移動,包括傾斜動作、旋動動作。Return to the description of Figure 5. The
攝影部71係拍攝用於使電路基板10與晶圓25之位置對準之圖像之攝影機。攝影部71為了能夠放大觀察而設有變焦光學系統,可變更倍率。攝影部71由於可使用通常的攝影機,因此省略說明。攝影部71利用大致柱狀之安裝部72而設於吸附部69之鉛直方向上側。The photographing
圖8係表示攝影部71及安裝部72之概略之圖,(A)為前視圖,(B)為側視圖。於圖8(A)、(B)中,將一部分剖面顯示。FIG. 8 is a diagram showing the outline of the photographing
安裝部72將攝影部71保持為可於X方向、Y方向及Z方向上移動(參照圖8中空箭頭)。藉此,攝影部71可觀察吸附於吸附墊62之晶圓25之全部區域。The mounting
又,安裝部72於攝影部71之鉛直方向下側(-Z側)保持吸附載台60。In addition, the mounting
傾斜載台64及θ載台65為大致筒狀。又,吸附部69之上下表面(吸附墊62及覆蓋玻璃63)為透明。故而,攝影部71可透過吸附墊62、覆蓋玻璃63、傾斜載台64及θ載台65拍攝晶圓25。又,由於晶圓25為透明,因此攝影部71可透過晶圓25拍攝電路基板10(參照圖5)。The
於安裝部72設有照射紫外線之光照射部73。光照射部73以高度位於攝影部71與吸附載台60之間之方式設於安裝部72。光照射部73於水平方向(-Y方向)照射光。The mounting
如圖8(B)所示,反射鏡74(圖8(A)中省略圖示)為反射由光照射部73照射之紫外光之光學零件,將光路彎曲大致90度。反射鏡74以可於與攝影部71之光路重疊之位置(參照圖8(B)虛線)、與未與攝影部71之光路重疊之位置(參照圖8(B)實線)之間於水平方向移動之方式設置(參照圖8(B)箭頭)。於反射鏡74配置於與攝影部71之光路重疊之位置之狀態下,由光照射部73照射之紫外光由反射鏡74反射,照射至電路基板10及晶圓25。As shown in FIG. 8(B), the reflecting mirror 74 (not shown in FIG. 8(A)) is an optical component that reflects the ultraviolet light irradiated by the
返回圖5之說明。檢查部80主要具有複數個探針81、及移動部82。複數個探針81分別連接於電源85(參照圖9)。又,探針81設於移動部82。移動部82可使探針81於抵接於設於電路基板10之配線圖案11之位置、及與未抵接於配線圖案11之位置之間於上下方向移動。於本實施形態中,配線圖案11具有點亮檢查用之電源墊(省略圖示),將探針81抵接於該電源墊。Return to the description of Figure 5. The
再者,於本實施形態中,檢查部80安裝於支持框架90,其位置為吸附載台60附近,但檢查部80之位置及配設形態並不限定於此。探針81設置為可於上下方向移動即可,例如移動部82可設於XY載台54。In addition, in this embodiment, the
圖9係表示貼合裝置2之電性構成之方塊圖。貼合裝置2具有CPU(Central Processing Unit)151、RAM(Random Access Memory)152、ROM(Read Only Memory)153、輸入輸出介面(I/F)154、通訊介面(I/F)155、及媒體介面(I/F)156,該等與載台50、吸附載台60、攝影部71、檢查部80、電源85、空氣吸引裝置91、92等相互連接。FIG. 9 is a block diagram showing the electrical configuration of the
RAM 152為揮發性記憶體。ROM 153為記憶有各種控制程式等之非揮發性記憶體。CPU 151基於儲存於RAM 152、ROM 153之程式動作,進行各部分之控制。The
CPU 151具有控制貼合裝置2之各部分之控制部151a之功能。控制部151a藉由執行CPU 151所讀取之既定之程式而構築。The
控制部151a主要具有進行對準之功能部、進行加壓之功能部、及進行檢查之功能部。於進行對準之功能部中,一面利用攝影部71透過吸附載台60及晶圓25拍攝電路基板10進行觀察,一面控制傾斜載台52、θ載台53及XY載台54使加熱載台51於水平方向移動。又,於進行加壓之功能部中,控制Z移動部55使加熱載台51往鉛直方向上方向(+Z方向)移動而對電路基板10及晶圓25進行加壓。此時,藉由利用測力計(省略圖示)檢測加壓壓力,控制部151a控制為最佳之設定壓力。又,於進行檢查之功能部中,於對電路基板10及晶圓25進行加壓之狀態下控制移動部82,使探針81抵接於配線圖案11。關於控制部151a所進行之處理,於後文詳細說明。The
CPU 151透過輸入輸出介面154控制鍵盤或滑鼠等輸入輸出裝置161。通訊介面155透過網路162自其他機器接收資料並發送至CPU 151,並且將CPU 151所生成之資料透過網路162發送至其他機器。The
媒體介面156讀取儲存於記憶媒體163之程式或資料,將其儲存至RAM 152。再者,記憶媒體163例如為IC卡、SD卡、DVD等。再者,實現各功能之程式係例如自記憶媒體163讀出,透過RAM 152安裝於貼合裝置2,由CPU 151執行。The
圖9所示之貼合裝置2之構成係於說明本實施形態之特徵時說明了主要構成,並非排除例如通常之資訊處理裝置所具備之構成。貼合裝置2之構成要素可根據處理內容進而分類為多個構成要素,亦可為1個構成要素執行複數個構成要素之處理。The structure of the
其次,對使用貼合裝置2將電路基板10及晶圓25貼合之處理(步驟3)進行說明。該貼合步驟主要藉由控制部151a進行。於貼合步驟中,將形成有複數個LED 20之晶圓25及電路基板10貼合,將LED 20固定於連接圖案上。Next, the process (step 3) of bonding the
圖10係表示貼合步驟之處理流程之流程圖。圖11係示意性表示貼合步驟之圖。圖12係示意性表示貼合步驟中之探針81之位置之圖。Fig. 10 is a flowchart showing the processing flow of the bonding step. Fig. 11 is a diagram schematically showing the bonding step. FIG. 12 is a diagram schematically showing the position of the
1.對準步驟(步驟S100~S106)
<步驟S100>
首先,如圖11(A)所示,以LED 20(圖11中省略圖示)朝下之方式,將晶圓25載置於載台50(此處為加熱載台51)之上表面51a。此時,控制部151a利用空氣吸引裝置91吸引空氣,將晶圓25吸附並固定於上表面51a。1. Alignment steps (steps S100~S106)
<Step S100>
First, as shown in FIG. 11(A), the
其次,如圖11(B)所示,控制部151a控制Z移動部55使加熱載台51往上方向(+Z方向)移動,使晶圓25靠近吸附載台60。然後,控制部151a一面利用攝影部71透過吸附載台60拍攝晶圓25進行觀察,一面控制傾斜載台52、θ載台53及XY載台54使加熱載台51(亦即晶圓25)於水平方向移動。此時,控制部151a以使形成於晶圓25之對準標記與攝影部71之中央(光軸)一致之方式,使晶圓25於水平方向移動。Next, as shown in FIG. 11(B), the
<步驟S102>
控制部151a使形成於晶圓25之對準標記與攝影部71之光軸一致後,切斷利用空氣吸引裝置91所進行之空氣之吸引,解除向上表面51a之晶圓25之吸附。又,控制部151a利用空氣吸引裝置92透過真空吸附用接頭68吸引吸附部69內部之空氣,將晶圓25吸附於吸附墊62。藉此,以LED 20朝下之方式,晶圓25固定於吸附墊62。<Step S102>
After the
<步驟S104>
其次,如圖11(C)所示,控制部151a控制Z移動部55使加熱載台51往下方向(-Z方向)移動,以配線圖案11朝上之方式將電路基板10載置於載台50(此處為加熱載台51)之上表面51a,利用空氣吸引裝置91吸引空氣,將電路基板10吸附並固定於上表面51a。<Step S104>
Next, as shown in FIG. 11(C), the
<步驟S106>
如圖11(D)所示,控制部151a控制Z移動部55使加熱載台51往+Z方向移動,使電路基板10靠近晶圓25。但是,電路基板10與晶圓25未抵接。然後,控制部151a一面利用攝影部71透過吸附載台60及晶圓25拍攝電路基板10進行觀察,一面控制傾斜載台52、θ載台53及XY載台54使加熱載台51(亦即電路基板10)於水平方向移動。再者,由於晶圓25為透明,因此可透過晶圓25拍攝電路基板10。<Step S106>
As shown in FIG. 11(D), the
此時,控制部151a以使形成於電路基板10之對準標記與攝影部71之中央(光軸)一致之方式,使電路基板10於水平方向移動。控制部151a使形成於電路基板10之對準標記與攝影部71之光軸一致後,結束對準步驟。藉此,電路基板10及晶圓25於被定位之狀態下配置為大致平行。At this time, the
2.貼合步驟
<步驟S108>
如圖11(E)所示,控制部151a藉由控制Z移動部55使加熱載台51往+Z方向移動,利用加熱載台51及吸附墊62夾住電路基板10及晶圓25且自電路基板10及晶圓25之兩側施加壓力。藉此,電路基板10及晶圓25被加壓。再者,於加壓時,如圖12(A)所示,探針81未抵接於配線圖案11(圖12中省略圖示)。2. Fitting steps
<Step S108>
As shown in FIG. 11(E), the
於本實施形態中,由於利用加熱載台51及吸附墊62夾住電路基板10及晶圓25,因此於加壓時,電路基板10及晶圓25不彎曲,而對晶圓25之表面整體大致均勻地進行加壓,可一次將形成於晶圓25之複數個LED 20固定於電路基板10。又,例如,若電路基板10或晶圓25彎曲,則有對位於電路基板10與晶圓25之距離較近之部分之LED 20施加過度之力,導致破壞LED 20或晶圓25裂開之虞。相對於此,於本實施形態中,由於對晶圓25之表面整體均勻地進行加壓,因此可防止破壞LED 20、LED 20之不均勻之點亮或晶圓25裂開。In this embodiment, since the
4.檢查步驟(步驟S110~S118)
<步驟S110>
如圖11(F)及圖12(B)所示,控制部151a於自晶圓25及電路基板10之兩側施加了壓力之狀態下,使探針81往-Z方向移動而將探針81抵接於配線圖案11(省略圖示)。4. Inspection steps (steps S110~S118)
<Step S110>
As shown in Figures 11(F) and 12(B), the
<步驟S112>
控制部151a由電源85透過探針81對配線圖案11施加電流。藉此,LED 20被點亮。<Step S112>
The
<步驟S114>
控制部151a基於攝影部71所拍攝之圖像確認LED 20是否全部點亮。於貼合步驟中未產生問題之情形時,如圖12(C)所示,所有LED 20被點亮。<Step S114>
The
<步驟S116>
於所有LED 20並未都點亮之情形時(步驟S114中為NO),即謂於只要存在1個未被點亮之LED 20之情形時,控制部151a控制Z移動部55使加熱載台51往-Z方向移動,將電路基板10與晶圓25分開。<Step S116>
When all the
<步驟S118>
然後,控制部151a利用未圖示之鼓風機等吹散塵埃等來修正故障。於本實施形態中,由於於連接電路基板10及晶圓25之前(接著劑硬化前)進行檢查,因此可將電路基板10與晶圓25分開,藉此可修正故障。其後,控制部151a使處理返回至步驟S106。<Step S118>
Then, the
3.硬化步驟
<步驟S200>
於所有LED已點亮之情形時(步驟S114中為YES),如圖12(D)所示,控制部151a控制移動部82使探針81離開配線圖案11。然後,控制部151a於自電路基板10及晶圓25之兩側施加了壓力之狀態下,藉由利用未圖示之加熱部對加熱載台51整體進行加熱,對電路基板10及晶圓25進行加熱而使接著劑41硬化。藉此,LED 20固定於電路基板10。3. Hardening step
<Step S200>
When all the LEDs are turned on (YES in step S114), as shown in FIG. 12(D), the
再者,接著劑並不限定於熱硬化性樹脂,可使用紫外線硬化樹脂。於使用紫外線硬化樹脂之情形時,將反射鏡74移動至與攝影部71之光路重疊之位置,由光照射部73照射紫外線。藉此,紫外線照射至電路基板10及晶圓25,而接著劑硬化。In addition, the adhesive is not limited to thermosetting resin, and ultraviolet curing resin can be used. In the case of using ultraviolet curable resin, the
5.加壓開放步驟
<步驟S202>
控制部151a停止利用空氣吸引裝置92所進行之空氣之吸引而將空氣返回至吸附部69內部,使晶圓25離開吸附墊62。5. Pressurized opening steps
<Step S202>
The
<步驟S204>
如圖11(G)所示,控制部151a控制Z移動部55使加熱載台51往-Z方向移動,使於電路基板10連接有晶圓25者與加熱載台51一起往-Z方向移動。<Step S204>
As shown in FIG. 11(G), the
<步驟S206>
最後,控制部151a停止利用空氣吸引裝置91所進行之空氣之吸引,使電路基板10離開上表面51a。然後,自上表面51a取出電路基板10。以上為貼合步驟之處理流程。<Step S206>
Finally, the
根據本實施形態,藉由使用透明的吸附墊62及覆蓋玻璃63、及筒狀之傾斜載台64及θ載台65,可利用攝影部71直接觀察電路基板10及晶圓25。而且,由於一面利用攝影部71直接觀察電路基板10及晶圓25一面進行對準,因此可以較高之精度進行位置對準。又,由於於大致板狀之加熱載台51及吸附墊62夾住電路基板10及晶圓25並加壓,因此可大致均勻地對表面整體進行加壓。According to this embodiment, by using the
又,根據本實施形態,藉由將探針81設為可移動,於檢查時將探針81與配線圖案11抵接,於接著劑硬化時使探針81離開配線圖案11,可利用貼合裝置2進行LED之點亮確認。又,由於在使接著劑41硬化而連接電路基板10及晶圓25之前確認LED 20之點亮,因此可於存在未被點亮之LED 20之情形時將電路基板10與晶圓25分離,並修正故障。因此,可提高顯示裝置1之製造時之良率。In addition, according to this embodiment, by making the
再者,於本實施形態中,載台50具有Z移動部55,Z移動部55使加熱載台51往+Z方向或-Z方向移動,但往+Z方向或-Z方向移動者並不限定於加熱載台51。例如,吸附載台60具有Z移動部,該Z移動部使吸附部69往+Z方向或-Z方向移動亦可。Furthermore, in the present embodiment, the
又,於本實施形態中,載台50具有加熱載台51,但加熱載台51並非必須。於使用光硬化性樹脂作為接著劑之情形時,貼合裝置2具有光照射部73及反射鏡74即可。又,光照射部73及反射鏡74並非必須,於使用熱硬化性樹脂作為接著劑之情形時,貼合裝置2具有加熱載台51即可。In addition, in this embodiment, the
又,於本實施形態中,藉由使形成於電路基板10或晶圓25之對準標記分別與攝影部71之中央(光軸)一致而進行了對準,但對準標記並非必須。例如,以攝影部71拍攝電路基板10及晶圓25,且設於晶圓25之LED 20之位置與電路基板10之配線圖案11之位置一致之方式使加熱載台51於水平方向移動而進行對準亦可。於本實施形態中,由於攝影部71能夠直接觀察電路基板10或晶圓25,因此即使無對準標記亦可進行電路基板10與晶圓25之位置對準。尤其是由於攝影部71具有變焦光學系統,且攝影部71設為可於X方向及Y方向上移動,因此藉由將電路基板10及晶圓25之一部分放大而拍攝,可進行正確之對準。In addition, in this embodiment, alignment is performed by aligning the alignment marks formed on the
又,於本實施形態中,對準標記設於晶圓25之中心,但設置對準標記之位置並不限定於中心。又,對準標記可為1個,亦可為複數個。藉由設置複數個對準標記,不僅高度,傾斜偏移或旋轉偏移亦可以高精度進行對準。尤其,較佳為設置3個以上對準標記。Moreover, in this embodiment, the alignment mark is provided at the center of the
<第2實施形態>
本發明之第2實施形態為攝影部71以外之攝影部亦用於對準之形態。以下,對第2實施形態之貼合裝置3進行說明。關於與第1實施形態相同之部分,標註相同之符號並省略說明。又,由於使用貼合裝置3製造之顯示裝置1與第1實施形態相同,顯示裝置1之製造方法亦相同,因此省略說明。<The second embodiment>
The second embodiment of the present invention is a mode in which the imaging unit other than the
圖13係表示貼合裝置3之概略之圖。貼合裝置3係將晶圓25及電路基板10貼合,將LED 20與配線圖案11電性連接之貼合步驟(步驟3)中所使用之貼合裝置,主要具有載台50、吸附載台60、攝影部71、76、77、檢查部80、及支持框架90。FIG. 13 is a diagram showing the outline of the
攝影部77為拍攝電路基板10之圖像之攝影機,設於支持框架90之上表面。攝影部76為拍攝晶圓25之圖像之攝影機,設於XY載台54。攝影部76、77由於可使用通常之攝影機,因此省略說明。The photographing
圖14係表示貼合步驟之處理流程之流程圖。圖15係示意性表示貼合步驟之圖。再者,與第1實施形態與第2實施形態之差異僅為對準步驟及貼合步驟,因此關於對準步驟及貼合步驟以外之步驟則省略詳細之說明。Fig. 14 is a flowchart showing the processing flow of the bonding step. Fig. 15 is a diagram schematically showing the bonding step. In addition, the difference from the first embodiment and the second embodiment is only the alignment step and the bonding step, and therefore the detailed description of the steps other than the alignment step and the bonding step will be omitted.
1.對準步驟(步驟S102~S107)
<步驟S102>
首先,如圖15(A)所示,利用空氣吸引裝置92透過真空吸附用接頭68吸引吸附部69內部之空氣,於吸附墊62以LED 20(圖15中省略圖示)朝下之方式吸附晶圓25。1. Alignment steps (steps S102~S107)
<Step S102>
First, as shown in FIG. 15(A), the air inside the
<步驟S103>
其次,控制部151a一面利用攝影部76拍攝晶圓25進行觀察,一面調整晶圓25之傾斜、旋轉偏移。即謂控制部151a以控制傾斜載台64及θ載台65,且使形成於晶圓25之對準標記與攝影部71之中央(光軸)一致之方式,使晶圓25於水平方向移動。<Step S103>
Next, the
<步驟S104>
其次,控制部151a以配線圖案11朝上之方式將電路基板10固定於載台50(此處為加熱載台51)之上表面51a。<Step S104>
Next, the
<步驟S105>
而且,控制部151a一面利用攝影部77拍攝電路基板10進行觀察,一面調整電路基板10之傾斜、旋轉偏移。即謂控制傾斜載台52、θ載台53及XY載台54來使加熱載台51(亦即電路基板10)於水平方向移動。此時,控制部151a以使形成於電路基板10之對準標記與攝影部77之中央(光軸)一致之方式使電路基板10於水平方向移動。<Step S105>
In addition, the
<步驟S107>
如圖15(B)所示,控制部151a以控制XY載台54,且使形成於電路基板10之對準標記之位置與步驟S103中之攝影部76之光軸之位置大致一致之方式,使加熱載台51(即電路基板10)於水平方向移動。藉此,電路基板10及晶圓25於被定位之狀態下配置為大致平行。<Step S107>
As shown in FIG. 15(B), the
2.貼合步驟
<步驟S109>
如圖15(C)所示,控制部151a控制Z移動部55使加熱載台51往+Z方向移動。又,控制部151a利用攝影部71拍攝電路基板10及晶圓25,於存在電路基板10與晶圓25之位置偏移之情形時,控制θ載台53及XY載台54使加熱載台51(即電路基板10)於水平方向移動,使電路基板10之對準標記與晶圓25之對準標記一致。此時,電路基板10與晶圓25未抵接。2. Fitting steps
<Step S109>
As shown in FIG. 15(C), the
電路基板10之對準標記與晶圓25之對準標記一致後,如圖15(D)所示,利用加熱載台51及吸附墊62夾住電路基板10及晶圓25且自電路基板10及晶圓25之兩側施加壓力。After the alignment mark of the
藉此,電路基板10及晶圓25被加壓。由於利用加熱載台51及吸附墊62夾住電路基板10及晶圓25,因此於加壓時,電路基板10及晶圓25不彎曲,而對晶圓25之表面整體大致均勻地進行加壓,可一次將形成於晶圓25之複數個LED 20固定於電路基板10,並且可防止破壞LED 20、LED 20之不均勻之點亮或晶圓25裂開。Thereby, the
4.檢查步驟(步驟S110~S118)
<步驟S110、S112>
如圖15(E)所示,控制部151a於自晶圓25及電路基板10之兩側施加了壓力之狀態下,使探針81往-Z方向移動而將探針81抵接於配線圖案11,透過探針81自電源85對配線圖案11施加電流。4. Inspection steps (steps S110~S118)
<Steps S110, S112>
As shown in FIG. 15(E), the
<步驟S114~S118>
控制部151a基於攝影部71所拍攝之圖像確認LED 20是否全部點亮。於所有LED 20並未都點亮之情形(只要存在1個未被點亮之LED 20之情形)時,控制部151a控制Z移動部55使加熱載台51往-Z方向移動,將電路基板10與晶圓25分開,並修正故障。其後,控制部151a使處理返回至步驟S106。<Steps S114~S118>
The
3.硬化步驟
<步驟S200>
於所有LED 20已點亮之情形時,控制部151a利用移動部82使探針81離開配線圖案11,於自電路基板10及晶圓25之兩側施加了壓力之狀態下,藉由利用未圖示之加熱部對加熱載台51整體進行加熱,對電路基板10及晶圓25進行加熱而使接著劑41硬化。藉此,LED 20固定於電路基板10。3. Hardening step
<Step S200>
When all the
5.加壓開放步驟
<步驟S202~S206>
控制部151a停止利用空氣吸引裝置92所進行之空氣之吸引,使晶圓25離開吸附墊62。然後,如圖15(F)所示,控制部151a控制Z移動部55使加熱載台51往-Z方向移動,使於電路基板10連接有晶圓25者與加熱載台51一起往-Z方向移動。最後,控制部151a停止利用空氣吸引裝置91所進行之空氣之吸引,使電路基板10離開上表面51a。然後,自上表面51a取出電路基板10。5. Pressurized opening steps
<Steps S202~S206>
The
根據本實施形態,由於使用攝影部76、77,因此可簡潔地進行對準處理。According to this embodiment, since the
再者,於本實施形態中,使用了攝影部76、77,但攝影部76並非必須。於未使用攝影部76之情形時,按照步驟S100(參照圖10)、S102(參照圖10)、S104(參照圖14)、S105(參照圖14)之順序進行處理即可。In addition, in this embodiment, the
以上,參照圖式對本發明之實施形態進行了詳細說明,但具體之構成並不限定於該實施形態,亦包含不脫離本發明之主旨之範圍之設計變更等。又,可採用將作為上述各實施形態或變形例而進行了說明之構成適當組合而得之構成。Above, the embodiment of the present invention has been described in detail with reference to the drawings, but the specific configuration is not limited to the embodiment, and includes design changes that do not depart from the scope of the spirit of the present invention. In addition, it is possible to adopt a configuration obtained by appropriately combining the configurations described as the respective embodiments or modification examples.
尤其是於上述實施形態中,對將電路基板10及晶圓25貼合之貼合裝置2、3進行了說明,但貼合裝置2、3所貼合之對象(相當於第1構件、第2構件)並不限定於電路基板10及晶圓25,可對大致板狀之各種構件彼此之貼合使用貼合裝置2、3。又,於上述實施形態中,於加熱載台51固定了電路基板10,於吸附墊62固定了晶圓25,但亦可於加熱載台51固定晶圓25,於吸附墊62固定電路基板10。Particularly in the above-mentioned embodiment, the
又,於本發明中,所謂「大致」,係不僅包括嚴格相同之情形,亦包括不失去同一性之程度之誤差或變形之概念。例如,大致平行並不限定於嚴格平行之情形。又,例如於僅表現平行、正交等之情形時,設為不僅包括嚴格平行、正交等情形,亦包括大致平行、大致正交等情形。In addition, in the present invention, the term "approximately" not only includes strictly identical conditions, but also includes the concept of errors or deformations that do not lose identity. For example, substantially parallel is not limited to strictly parallel. In addition, for example, when only parallel, orthogonal, etc. are expressed, it is assumed to include not only strictly parallel, orthogonal, etc., but also substantially parallel, substantially orthogonal, and the like.
1:顯示裝置 2、3:貼合裝置 10:電路基板 11:配線圖案 12:連接圖案 20:LED 22:P電極 23:n電極 25:晶圓 30:螢光發光層 30B:藍色螢光發光層 30G:綠色螢光發光層 30R:紅色螢光發光層 31:間隔壁 32:平坦化膜 33:金屬膜 40:驅動電路 41:接著劑 43:硬質軟性基板 50:載台 51:加熱載台 51a:上表面 52:傾斜載台 53:θ載台 54:XY載台 55:Z移動部 60:吸附載台 61:圓筒形托架 61a:凹部 62:吸附墊 62a:孔 62b:底面 63:覆蓋玻璃 64:傾斜載台 65:θ載台 68:真空吸附用接頭 69:吸附部 71、76、77:攝影部 72:安裝部 73:光照射部 74:反射鏡 80:檢查部 81:探針 82:移動部 85:電源 90:支持框架 91、92:空氣吸引裝置 101、102、103、104、105、106:遮罩 151:CPU 151a:控制部 152:RAM 153:ROM 154:輸入輸出介面 155:通訊介面 156:媒體介面 161:輸入輸出裝置 162:網路 163:記憶媒體1: display device 2, 3: Fitting device 10: Circuit board 11: Wiring pattern 12: Connection pattern 20: LED 22: P electrode 23: n electrode 25: Wafer 30: Fluorescent layer 30B: blue fluorescent light-emitting layer 30G: Green fluorescent light emitting layer 30R: Red fluorescent light-emitting layer 31: next door 32: Flattening film 33: Metal film 40: drive circuit 41: Adhesive 43: hard and flexible substrate 50: Stage 51: Heating stage 51a: upper surface 52: Tilt stage 53: Theta stage 54: XY stage 55: Z mobile department 60: Adsorption stage 61: Cylindrical bracket 61a: recess 62: Adsorption pad 62a: hole 62b: bottom surface 63: Cover glass 64: Tilt stage 65: Theta stage 68: Joint for vacuum adsorption 69: Adsorption part 71, 76, 77: Photography Department 72: Installation Department 73: Light Irradiation Department 74: mirror 80: Inspection Department 81: Probe 82: Mobile Department 85: power supply 90: Support frame 91, 92: Air suction device 101, 102, 103, 104, 105, 106: mask 151: CPU 151a: Control Department 152: RAM 153: ROM 154: Input and output interface 155: Communication interface 156: Media Interface 161: input and output devices 162: Network 163: Memory Media
[圖1]係表示使用本發明之製造裝置或製造方法而製造之顯示裝置1之概略之圖。
[圖2]係表示顯示裝置1之概略之局部剖視圖。
[圖3]係示意性表示顯示裝置1之製造方法之圖。
[圖4]係示意性表示顯示裝置1之製造方法之圖。
[圖5]係表示貼合裝置2之概略之圖。
[圖6]係表示吸附部69之概略之圖,(A)為側視圖,(B)為仰視圖。
[圖7]係示意性表示於吸附墊62吸附有晶圓25之情形之圖。
[圖8]係表示攝影部71及安裝部72之概略之圖,(A)為前視圖,(B)為側視圖。
[圖9]係表示貼合裝置2之電性構成之方塊圖。
[圖10]係表示貼合步驟之處理流程之流程圖。
[圖11]係示意性表示貼合步驟之圖。
[圖12]係示意性表示貼合步驟中之探針81之位置之圖。
[圖13]係表示貼合裝置3之概略之圖。
[圖14]係表示貼合步驟之處理流程之流程圖。
[圖15]係示意性表示貼合步驟之圖。Fig. 1 is a diagram showing the outline of a
10:電路基板 10: Circuit board
25:晶圓 25: Wafer
50:載台 50: Stage
51:加熱載台 51: Heating stage
51a:上表面 51a: upper surface
52:傾斜載台 52: Tilt stage
53:θ載台 53: Theta stage
54:XY載台 54: XY stage
55:Z移動部 55: Z mobile department
60:吸附載台 60: Adsorption stage
61:圓筒形托架 61: Cylindrical bracket
62:吸附墊 62: Adsorption pad
63:覆蓋玻璃 63: Cover glass
64:傾斜載台 64: Tilt stage
65:θ載台 65: Theta stage
69:吸附部 69: Adsorption part
71:攝影部 71: Photography Department
72:安裝部 72: Installation Department
80:檢查部 80: Inspection Department
81:探針 81: Probe
82:移動部 82: Mobile Department
90:支持框架 90: Support frame
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JP2019107225A JP7343891B2 (en) | 2019-06-07 | 2019-06-07 | Bonding device, bonding method, and display device manufacturing method |
JPJP2019-107225 | 2019-06-07 |
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