TW202031606A - Method for manufacturing at least one of chip and frame body capable of preventing cracks from being generated in a region corresponding to at least one of a chip and a frame body - Google Patents
Method for manufacturing at least one of chip and frame body capable of preventing cracks from being generated in a region corresponding to at least one of a chip and a frame body Download PDFInfo
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- TW202031606A TW202031606A TW109105012A TW109105012A TW202031606A TW 202031606 A TW202031606 A TW 202031606A TW 109105012 A TW109105012 A TW 109105012A TW 109105012 A TW109105012 A TW 109105012A TW 202031606 A TW202031606 A TW 202031606A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 22
- 239000007788 liquid Substances 0.000 claims abstract description 41
- 239000011148 porous material Substances 0.000 claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims description 14
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 55
- 238000010586 diagram Methods 0.000 description 8
- 239000012790 adhesive layer Substances 0.000 description 7
- 238000005530 etching Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 210000000707 wrist Anatomy 0.000 description 7
- 239000002313 adhesive film Substances 0.000 description 6
- 238000003860 storage Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000006059 cover glass Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 4
- 239000010410 layer Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000010980 sapphire Substances 0.000 description 4
- 229910052594 sapphire Inorganic materials 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 239000005368 silicate glass Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/346—Working by laser beam, e.g. welding, cutting or boring in combination with welding or cutting covered by groups B23K5/00 - B23K25/00, e.g. in combination with resistance welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
- H01L21/3043—Making grooves, e.g. cutting
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
- Liquid Crystal (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
Abstract
Description
本發明係關於一種加工板狀的被加工物,而製造預定形狀的晶片,與從被加工物分割出晶片後的框體中至少任一者之方法。The present invention relates to a method of processing a plate-shaped workpiece to produce at least any one of a wafer of a predetermined shape and a frame after the wafer is divided from the workpiece.
在智慧型手機、平板型PC等可攜式設備中搭載有攝影機,且為了保護接物鏡,而在比攝影機的接物鏡更外側(亦即被拍攝體側)裝設有由石英玻璃、藍寶石等所形成之圓盤狀的蓋玻璃。Portable devices such as smartphones and tablet PCs are equipped with cameras, and in order to protect the objective lens, quartz glass, sapphire, etc. are installed on the outside of the camera objective lens (that is, the side of the subject) The formed disc-shaped cover glass.
蓋玻璃例如是藉由後述方式製造:在石英玻璃製的基板上形成由光阻材料所構成的預定圖案,之後使用氟酸等蝕刻液,藉由蝕刻去除未被光阻材料覆蓋的區域(例如參照專利文獻1)。然而,蝕刻處理有所謂耗時、生產性不佳的問題。The cover glass is, for example, manufactured by the method described below: a predetermined pattern composed of a photoresist material is formed on a quartz glass substrate, and then an etching solution such as hydrofluoric acid is used to remove areas not covered by the photoresist material by etching (for example, Refer to Patent Document 1). However, the etching process has the so-called time-consuming and poor productivity.
於是,已有人提出一種方法,其對由石英玻璃、藍寶石等所形成的基板照射雷射光束,藉此形成具有細孔與包圍細孔的變質區域之被稱為潛盾通道的改質區域(例如參照專利文獻2)。此方法中,在沿著基板的分割預定線而形成多個潛盾通道之後,使用超音波賦予墊或超音波振盪器而對基板施加超音波,藉此沿著分割預定線分割基板。Therefore, a method has been proposed in which a laser beam is irradiated on a substrate formed of quartz glass, sapphire, etc., thereby forming a modified region called a shield channel with pores and a modified region surrounding the pores ( For example, refer to Patent Document 2). In this method, after a plurality of shield channels are formed along the predetermined dividing line of the substrate, ultrasonic waves are applied to the substrate using an ultrasonic application pad or an ultrasonic oscillator, thereby dividing the substrate along the predetermined dividing line.
專利文獻2所記載的手法中,因係藉由施加超音波而破壞潛盾通道,故相較於為化學反應程序的蝕刻處理,能以短時間加工基板。然而,在施加超音波時,因係使超音波賦予墊接觸被加工物的一面,或使超音波振盪器隔著保護膠膜接觸被加工物的另一面,故在潛盾通道以外的區域(例如,對應如蓋玻璃般預定形狀的小片物體(亦即晶片)的區域)有產生裂痕的情況。
[習知技術文獻]
[專利文獻]In the method described in
[專利文獻1]日本特開2012-148955號公報。 [專利文獻2]日本特開2015-226924號公報。[Patent Document 1] JP 2012-148955 A. [Patent Document 2] JP 2015-226924 A.
[發明所欲解決的課題] 本發明為有鑑於此問題點而完成者,其目的在於,在加工被加工物而製造預定形狀的晶片與從被加工物分割出該晶片後的框體中至少任一者時,抑制在對應晶片及框體中至少任一者的區域產生裂痕。[The problem to be solved by the invention] The present invention was made in view of this problem, and its object is to suppress the correspondence when processing a workpiece to manufacture at least one of a wafer of a predetermined shape and a frame after the wafer is divided from the workpiece. Cracks occur in at least one of the wafer and the frame.
[解決課題的技術手段] 若根據本發明的一態樣,係提供一種製造晶片及框體中至少任一者之方法,其係加工板狀的被加工物而製造預定形狀的晶片與從該被加工物分割出該晶片後的框體中至少任一者,該方法具備以下步驟:潛盾通道形成步驟,其以將波長對被加工物具有穿透性之脈衝狀的雷射光束的聚光區域定位在被加工物的內部的方式,將雷射光束從被加工物的正面側沿著被加工物的分割預定線進行照射,藉此沿著該分割預定線形成個別具有細孔與圍繞細孔的變質區域之多個潛盾通道;以及分割步驟,其在潛盾通道形成步驟之後,隔著液體對被加工物施加超音波,藉此破壞沿著分割預定線而形成的多個潛盾通道,以從被加工物分割出晶片。[Technical means to solve the problem] According to an aspect of the present invention, there is provided a method of manufacturing at least any one of a wafer and a frame, which is to process a plate-shaped workpiece to produce a wafer of a predetermined shape and to separate the wafer from the workpiece At least any one of the rear frame bodies, the method includes the following steps: a shield channel forming step, which positions the condensing area of a pulsed laser beam with a wavelength penetrating the workpiece on the workpiece In the internal method, the laser beam is irradiated from the front side of the workpiece along the planned dividing line of the workpiece, thereby forming as many degraded areas with individual pores and surrounding pores along the planned dividing line A shield channel; and a dividing step, which, after the shield channel forming step, applies ultrasonic waves to the object to be processed through the liquid, thereby destroying the plurality of shield channels formed along the predetermined dividing line, so as to be processed The object is divided into wafers.
較佳地,該分割預定線係以不到達該被加工物的外周端部的方式被設定在比該外周端部更內側的區域,且該潛盾通道形成步驟中,沿著位在比該外周端部更內側的該分割預定線而形成該多個潛盾通道。又,較佳地,該液體為水。Preferably, the planned dividing line is set in a region more inside than the outer peripheral end of the workpiece so as not to reach the outer peripheral end of the workpiece, and in the step of forming the shield channel, it is positioned along the The predetermined dividing line on the inner side of the outer peripheral end forms the multiple shield passages. Also, preferably, the liquid is water.
[發明功效] 本發明的一態樣之製造晶片及框體中至少任一者之方法中,在潛盾通道形成步驟中沿著被加工物的分割預定線而形成多個潛盾通道之後,隔著液體對被加工物施加超音波,藉此破壞多個潛盾通道而從被加工物分割出晶片。[Invention Effect] In the method of manufacturing at least any one of a wafer and a frame body of one aspect of the present invention, after forming a plurality of shield channels along the predetermined dividing line of the workpiece in the shield channel forming step, the pair Ultrasonic waves are applied to the workpiece, thereby breaking a plurality of shield channels and dividing the wafer from the workpiece.
如此,在本發明的分割步驟中,因不使超音波賦予墊等接觸被加工物,故可抑制在對應預定形狀的晶片及框體中至少任一者的區域產生裂痕。再者,因係藉由對被加工物賦予超音波而破壞潛盾通道,故相較於蝕刻處理,能以短時間加工被加工物。In this way, in the dividing step of the present invention, since the ultrasonic wave application pad or the like is not brought into contact with the workpiece, it is possible to suppress the occurrence of cracks in the region corresponding to at least one of the predetermined shape of the wafer and the frame. Furthermore, since the shield channel is destroyed by applying ultrasonic waves to the workpiece, the workpiece can be processed in a shorter time than the etching process.
參照附加圖式,針對本發明的一態樣之實施方式進行說明。圖1(A)係被加工物11的立體圖。被加工物11係正面11a及背面11b為圓形,且具有200μm至700μm左右的預定厚度的板狀(亦即圓盤狀)的基板。With reference to the attached drawings, an embodiment of the present invention will be described. FIG. 1(A) is a perspective view of the
被加工物11例如是由藍寶石、各種玻璃等所形成。此外,各種玻璃例如包含石英玻璃、硼矽酸玻璃、矽酸鋁玻璃、鈉石灰玻璃、無鹼玻璃。The
如圖1(A)中以虛線所示,在被加工物11設定有多條分割預定線13。各分割預定線13係以不到達被加工物11的外周端部11c的方式被設定在比外周端部11c更內側的區域。As shown by a broken line in FIG. 1(A), a plurality of planned dividing
各分割預定線13為環狀,且以彼此不接觸的方式被分離地配置,但亦可彼此接觸。此外,分割預定線13的形狀並不受限於環狀。分割預定線13的形狀亦可為三角形等多角形或其他所要的形狀。The respective planned dividing
被加工物11例如係以透過切割膠膜15而被固定在金屬製的環狀框架17的開口部之狀態(亦即被加工物單元19的狀態)被加工。圖1(B)係被加工物單元19的立體圖。The to-
切割膠膜15為樹脂製的薄膜。切割膠膜15具有具黏著性的黏著層(未圖示)與不具黏著性的基材層(未圖示)之層積構造。黏著層例如係紫外線硬化型的樹脂層,並被設置在樹脂製的基材層的其中一面的整面。若對黏著層照射紫外線,則黏著層的黏著力會降低,保護膠膜變得容易從被加工物11剝離。The
環狀框架17具有直徑比被加工物11的直徑更大的開口。在將被加工物11配置在此開口的狀態,藉由將切割膠膜15的黏著層側貼附在被加工物11的背面11b側與環狀框架17的其中一面,而形成被加工物單元19。The
此外,在加工被加工物11的情況中,不需要一定要形成被加工物單元19。亦即,亦可不使用切割膠膜15及環狀框架17地加工被加工物11。In addition, in the case of processing the to-
本實施方式中,使用雷射加工裝置2加工被加工物11。圖2係雷射加工裝置2的立體圖。雷射加工裝置2具備支撐各構造的基台4。基台4包含:長方體狀的基部6;以及壁部8,其在基部6的Y軸方向的一側(例如-Y方向)的端部往上方(例如+Z方向)突出。In this embodiment, the
在基部6的上方配置有卡盤台10。在卡盤台10的外周側面固定有多個夾持單元。例如,在俯視卡盤台10的情況中,在時鐘的0點鐘、3點鐘、6點鐘以及9點鐘的各位置設置有一個夾持單元。A chuck table 10 is arranged above the
在卡盤台10的下方(例如-Z方向)設置有使卡盤台10在Y軸方向移動的Y軸移動單元16。Y軸移動單元16具備固定在基部6的上表面且平行於Y軸方向的一對Y軸導軌18。A Y-
在Y軸導軌18可滑動地設置有Y軸移動台20。在Y軸移動台20的背面側(下表面側)設置有螺帽部(未圖示),而在此螺帽部係以可旋轉的態樣結合平行於Y軸導軌18配置的Y軸滾珠螺桿22。A Y-axis moving table 20 is slidably provided on the Y-
在Y軸滾珠螺桿22的一端連結有Y軸脈衝馬達24。若以Y軸脈衝馬達24使Y軸滾珠螺桿22旋轉,則Y軸移動台20會沿著Y軸導軌18在Y軸方向移動。A Y-
在Y軸移動台20的正面側(上表面側)設置有使卡盤台10在垂直於Y軸方向的X軸方向移動的X軸移動單元26。X軸移動單元26具備固定在Y軸移動台20的上表面且平行於X軸方向的一對X軸導軌28。An
在X軸導軌28可滑動地設置有X軸移動台30。在X軸移動台30的背面側(下表面側)設置有螺帽部(未圖示),在此螺帽部以可旋轉的態樣結合平行於X軸導軌28配置的X軸滾珠螺桿32。An X-axis moving table 30 is slidably provided on the
在X軸滾珠螺桿32的一端連結有X軸脈衝馬達34。若以X軸脈衝馬達34使X軸滾珠螺桿32旋轉,則X軸移動台30會沿著X軸導軌28在X軸方向移動。An
在X軸移動台30的正面側(上表面側)設置有支撐台36。在支撐台36的上部配置有略圓盤狀的卡盤台10。卡盤台10係與設置在下方的旋轉驅動源(未圖示)連結,並構成為可藉由此旋轉驅動源進行旋轉。A
在卡盤台10的表面側設置有由多孔陶瓷等所形成之圓盤狀的多孔材質板。多孔材質板係經由設置在卡盤台10內部的流路(未圖示)而連接噴射器等吸引源(未圖示)。藉由吸引源所產生的負壓,在多孔材質板的表面(亦即保持面10a)會產生吸引力。A disc-shaped porous material plate made of porous ceramics or the like is provided on the surface side of the chuck table 10. The porous plate is connected to a suction source (not shown) such as an ejector via a flow path (not shown) provided inside the chuck table 10. The negative pressure generated by the suction source generates suction on the surface of the porous plate (that is, the
在卡盤台10的上方設置有雷射光束照射單元12。雷射光束照射單元12的一端係固定在壁部8的上部的Y軸方向的另一側(例如+Y方向)的面。A laser
在雷射光束照射單元12的另一端設置有加工頭12a。脈衝狀的雷射光束係從加工頭12a朝向保持面10a約略垂直地照射。A
在雷射光束照射單元12的X軸方向的一方向(-X方向)側設置有攝像單元12b。攝像單元12b具有供來自被拍攝體的反射光射入的接物鏡(未圖示)。來自被拍攝體的反射光係透過接物鏡等而被導往攝像單元12b的攝像元件(未圖示)。An
接著,使用圖3、圖4(A)、圖4(B)、圖5(A)、圖5(B)、圖5(C)、圖6(A)、圖6(B)及圖7,針對加工被加工物11而形成預定形狀的晶片與框體的晶片及框體之製造方法進行說明。圖7係表示第一實施方式之晶片及框體之製造方法的流程圖。Next, use Figure 3, Figure 4 (A), Figure 4 (B), Figure 5 (A), Figure 5 (B), Figure 5 (C), Figure 6 (A), Figure 6 (B) and Figure 7 A description will be given of a method for manufacturing a wafer and a frame in which the
在第一實施方式之晶片及框體之製造方法中,首先,使用雷射加工裝置2在被加工物11形成潛盾通道(潛盾通道形成步驟(S10))。圖3係表示潛盾通道形成步驟(S10)的立體圖。In the manufacturing method of the wafer and the frame body of the first embodiment, first, a shield channel is formed in the
在潛盾通道形成步驟(S10)中,首先,以被加工物11的正面11a朝上的態樣,將被加工物單元19載置於保持面10a上。在此狀態中,啟動吸引源而使負壓作用在保持面10a。更進一步,以夾持單元固定環狀框架17。藉此,被加工物11的背面11b側會隔著切割膠膜15而被卡盤台10所保持。In the shield passage forming step (S10), first, the
接著,從加工頭12a對被加工物11的正面11a照射波長對被加工物11具有穿透性之脈衝狀的雷射光束L。此時,雷射光束L的聚光區域會定位在被加工物11的內部。Next, the
在從被加工物11的正面11a側照射的雷射光束L的聚光區域被定位在被加工物11的內部的狀態下,啟動Y軸移動單元16及X軸移動單元26,而使卡盤台10在Y軸方向及X軸方向移動。In the state where the condensed area of the laser beam L irradiated from the
藉此,一邊使加工頭12a相對於卡盤台10相對地移動,一邊沿著分割預定線13照射雷射光束L。此外,在本說明書中,將X-Y平面方向中的加工頭12a與卡盤台10的相對移動速度稱為加工速度。Thereby, the laser beam L is irradiated along the
例如,將加工條件設定為如下述而加工被加工物11。
雷射光束L的波長:1064nm
脈衝能量:50μJ
脈衝的反覆頻率:1kHz
X-Y平面方向的加工速度:20mm/s
行程數(number of passes):3For example, the processing condition is set as follows to process the
此外,所謂脈衝能量,意指一個脈衝單位的能量。又,所謂行程數,意指在將聚光區域定位在被加工物11內部的狀態下沿著一條分割預定線13照射雷射光束L的次數。In addition, the so-called pulse energy means the energy of one pulse unit. In addition, the number of strokes means the number of times the laser beam L is irradiated along a
例如,在被加工物11的厚度為300μn的情況,首先,將聚光區域定位在自背面11b的距離達100μm的第一深度位置,並沿著全部的分割預定線13加工被加工物11(第一行程)。For example, in the case where the thickness of the
接著,將聚光區域定位在自背面11b的距離達100μm到200μm的第二深度位置,並沿著全部的分割預定線13加工被加工物11(第二行程)。Next, the condensing area is positioned at a second depth position with a distance of 100 μm to 200 μm from the
之後,將聚光區域定位在自背面11b的距離達200μm到300μm(亦即正面11a)的第三深度位置,並沿著全部的分割預定線13加工被加工物11(第三行程)。藉此,從背面11b至正面11a形成沿著全部的分割預定線13的多個潛盾通道。此外,行程數不受限於3。在適當調節脈衝能量等的前提下,亦可將行程數設為1或2。After that, the light-concentrating area is positioned at a third depth position with a distance of 200 μm to 300 μm from the
但是,若X-Y平面方向的加工速度超過50mm/s,則會變得難以沿著分割預定線13形成潛盾通道。這被認為是受各式各樣的原因所導致,例如是因為潛盾通道相對於分割預定線13形成為蛇行的樣子。因此,X-Y平面方向的加工速度較佳為50mm/s以下。However, if the processing speed in the X-Y plane direction exceeds 50 mm/s, it becomes difficult to form a shield channel along the
圖4(A)係表示一個潛盾通道11d的構造的立體圖。此外,在圖4(A)中,省略被加工物11在厚度方向(例如,從正面11a朝向背面11b的方向)的局部。各潛盾通道11d具有沿著被加工物11的厚度方向而形成的細孔11e。細孔11e係直徑為約1μm的略圓柱狀的細長空間。Fig. 4(A) is a perspective view showing the structure of a
潛盾通道11d還具有以包圍細孔11e的側面的方式而形成的變質區域11f。變質區域11f例如是具有約5μm至約20μm的直徑的略圓柱狀的區域,並以涵蓋此圓柱的高度方向且通過圓柱的底面之圓的中心的方式形成上述細孔11e。The
變質區域11f為被加工物11的局部接受到來自雷射光束L的能量,藉此相較於未被雷射光束L照射的部分,構造、密度等產生變化的區域。例如,在被加工物11是由藍寶石等單晶材料所形成的情況,變質區域11f會成為非晶質區域或多晶區域。The altered
多個潛盾通道11d係沿著分割預定線13而形成。圖4(B)係表示沿著分割預定線13而形成的多個潛盾通道11d之被加工物11的局部剖面圖。The plurality of
在圖4(B)中,沿著分割預定線13而相鄰的二個潛盾通道11d的變質區域11f的側部會連接,但二個變質區域11f的側部亦可沿著分割預定線13而彼此分離。此外,在圖4(B)中,省略被加工物11的厚度方向的一部分。In FIG. 4(B), the side portions of the
在潛盾通道形成步驟(S10)之後,使用超音波施加裝置38隔著水(例如純水)等液體40而對被加工物11施加超音波以破壞潛盾通道11d(分割步驟(S20))。圖5(A)係超音波施加裝置38的局部剖面側視圖。After the shield channel forming step (S10), the ultrasonic
超音波施加裝置38具有容器42。在容器42中,液體40係注滿至預定的高度位置。在容器42的內側配置有可在容器42的高度方向伸縮的多個腳部44,此腳部44的底部被固定在容器42的內側的底部。此外,在圖5(A)中,表示伸長至最大限度狀態的各腳部44。The ultrasonic
在各腳部44的上端固定有環狀的支撐部46。在此支撐部46的上表面載置上述被加工物單元19的環狀框架17。在支撐部46的外周側面設置有多個夾持單元48。An
各夾持單元48係離散地配置在支撐部46的圓周方向中相異的位置。例如,在俯視支撐部46的情況中,二個夾持單元48係設置在時鐘的0點鐘及6點鐘的位置。又,例如,在俯視支撐部46的情況中,四個夾持單元48係設置在時鐘的0點鐘、3點鐘、6點鐘及9點鐘的位置。The clamping
在容器42的內側的底部固定有超音波產生單元50。超音波產生單元50例如是具有使用鋯鈦酸鉛(PZT)等壓電材料所形成的壓電元件(未圖示)。An
藉由對壓電元件施加預定的交流電壓,壓電元件會振動。藉此,超音波產生單元50會產生超過20kHz的預定頻率(例如20kHz至100kHz的頻率)的超音波。By applying a predetermined AC voltage to the piezoelectric element, the piezoelectric element vibrates. In this way, the
在分割步驟(S20)中,首先,如圖5(A)所示將被加工物單元19載置於支撐部46上。然後,以各夾持單元48壓住環狀框架17的上方。藉此,被加工物單元19被夾持單元48與支撐部46固定。In the dividing step (S20 ), first, as shown in FIG. 5(A), the
之後,以被加工物11定位在低於液體40的水位且高於超音波產生單元50的位置的方式,使腳部44縮短成預定的長度。藉此,被加工物單元19的整體被浸泡在液體40。藉由將腳部44保持在預定的長度,能使正面11a(或背面11b)與超音波產生單元50的距離固定。After that, the
此外,亦可將被加工物11的高度位置調整成超音波容易傳導的預定位置。例如,在將液體40中產生的超音波的駐波波長設為λ的情況中,亦可將被加工物11定位在從超音波產生單元50的上端距離{(2n-1)λ}/4的位置(其中,n為1以上的自然數)。In addition, the height position of the
在將被加工物11定位在適當的高度位置之後,對超音波產生單元50施加預定的交流電壓而產生超音波。超音波係以疏密波(亦即縱波)的方式在液體40中傳導。圖5(B)係表示隔著液體40對被加工物11施加超音波的情況的圖。After the
潛盾通道11d的變質區域11f因相較於被加工物11的其他區域變得脆弱,故能被超音波的振動破壞。藉此,相較於使超音波賦予墊接觸被加工物11的情況,能抑制在分割預定線13以外的區域產生裂痕,且相較於蝕刻處理能以短時間加工被加工物11。The
此外,藉由在被加工物11與超音波產生單元50之間設置液體40,相較於在被加工物11與超音波產生單元50之間僅存在空氣等氣體的情況,能降低超音波傳導至被加工物11時的聲波阻抗。亦即,液體40發揮作為相較於空氣更加提升超音波的傳導效率之聲波匹配層的功能。In addition, by disposing the liquid 40 between the workpiece 11 and the
又,因液體40會進入細孔11e,故超音波也能在細孔11e內傳導。因此,相較於在細孔11e沒有存在液體40的狀態(例如被加工物11被曝露在大氣壓環境的狀態)下對被加工物11施加超音波的情況,能更有效率地破壞變質區域11f。In addition, since the liquid 40 enters the
又,藉由不使用藥品、藥液等而使用水作為液體40,相較於蝕刻處理,廢水處理會變得容易。再者,無需對於腳部44、支撐部46及容器42進行賦予耐酸性等耐化學性的處理,此點亦有利。In addition, by using water as the liquid 40 without using chemicals, chemical liquids, etc., compared with etching treatment, wastewater treatment becomes easier. Furthermore, it is also advantageous that it is not necessary to perform processing to impart chemical resistance such as acid resistance to the
但是,在本實施方式中,各分割預定線13被設定在比被加工物11的外周端部11c更內側的區域。因此,即使如分割預定線13縱橫跨越被加工物11的正面11a而到達外周端部11c的情形下,使切割膠膜15擴張(擴片),亦無法分割被加工物11。However, in the present embodiment, each
是以,在各分割預定線13被設定在比被加工物11的外周端部11c更內側的區域的情況中,隔著液體40對被加工物11施加超音波一事在分割被加工物11時為有用。Therefore, in the case where each
此外,在本實施方式中雖以被加工物單元19的狀態加工被加工物11,但亦可不使用切割膠膜15及環狀框架17地加工被加工物11。在此情況中,例如是將網狀構件或板狀構件設置在環狀的支撐部46的上表面,並將被加工物11放置在此構件上。在此狀態下,隔著液體40對被加工物11施加超音波而分割被加工物11。In addition, although the
在分割步驟(S20)之後,拾取從被加工物11分割出的多個晶片21等(拾取步驟(S30))。圖5(C)係表示拾取晶片21的情況的圖。After the dividing step (S20), a plurality of
在拾取步驟(S30)中,為了降低切割膠膜15的黏著層的黏著力,而使用對切割膠膜15照射紫外線的紫外線照射裝置(未圖示)。又,為了搬送晶片21,而使用配置在超音波施加裝置38上方的搬送裝置54。In the pick-up step (S30), in order to reduce the adhesive force of the adhesive layer of the dicing
搬送裝置54具有腕部54a。此腕部54a例如可在X軸(或Y軸)方向及Z軸方向移動。在腕部54a的下端固定有圓盤狀的頭部54b的上表面。在頭部54b的下表面設置有多個吸附墊54c。各吸附墊54c被配置在對應晶片21位置的位置。The conveying
各吸附墊54c具有連接噴射器等吸引源(未圖示)的流路(未圖示)。此流路的一端(亦即開口)在吸附墊54c的下方露出。藉由吸引源所產生的負壓,在吸附墊54c的開口會產生吸引力。Each
在拾取步驟(S30)中,首先,伸長腳部44並將被加工物單元19定位在比液體40的水位更上方。然後,將紫外線照射裝置配置在被加工物單元19的底部與液體40的水位之間,並對切割膠膜15照射紫外線。藉此,黏著層的黏著力會降低。In the pick-up step (S30 ), first, the
接著,使腕部54a在X軸方向移動並定位在被加工物11的正上方。之後,使腕部54a在Z軸方向移動,在使吸附墊54c接觸晶片21後,啟動吸引源而以吸附墊54c吸附晶片21。Next, the
接著,使腕部54a在Z軸方向移動並從切割膠膜15剝離晶片21,之後,使其在X軸方向移動,將各晶片21搬送至容納晶片21的容納托盤(未圖示)。更進一步,藉由其他搬送裝置(未圖示)或搬送裝置54,將取出各晶片21後的被加工物11的剩餘部分(亦即框體23)搬送至其他容納托盤(未圖示)。Next, the
如此,被加工物11被分離成各個圓盤狀的多個晶片21與從被加工物11分割出全部晶片21後的框體23。圖6(A)係一個晶片21的立體圖。晶片21例如被利用作為保護攝影機的接物鏡的蓋玻璃。In this way, the
圖6(B)係一個框體23的立體圖。框體23例如被利用作為具有對應晶片21大小的開口的篩件。如此,在本實施方式中,能從一個被加工物11製造出多個晶片21與一個框體23。FIG. 6(B) is a perspective view of a
但是,在本實施方式中雖製造多個晶片21與框體23兩者,但本實施方式的製造方法亦可視為製造多個晶片21與框體23中任一者之方法。例如,只要以從被加工物11製造出晶片21為目的而加工被加工物11,則本實施方式的製造方法能視為晶片21的製造方法。However, although both the plurality of
又,例如,只要以從被加工物11製造出框體23為目的而加工被加工物11,則本實施方式的製造方法能視為框體23的製造方法。因此,本實施方式的製造方法亦為製造晶片21及框體23中至少任一者之方法。Moreover, for example, as long as the
此外,為了照射紫外線,亦可不將紫外線照射裝置配置在被加工物單元19的底部與液體40的水位之間。例如,在伸長腳部44並將被加工物單元19定位在比液體40的水位更上方之後,解除夾持單元48,並將被加工物單元19搬送至其他紫外線照射裝置(未圖示)。In addition, in order to irradiate ultraviolet rays, the ultraviolet irradiation device may not be arranged between the bottom of the
然後,使用其他紫外線照射裝置對切割膠膜15照射紫外線。之後,使用搬送裝置54將各晶片21搬送至容納托盤,並使用其他搬送裝置(未圖示)或搬送裝置54將框體23搬送至其他容納托盤(未圖示)。Then, another ultraviolet irradiation device is used to irradiate the dicing
接著,針對第二實施方式進行說明。此外,在第二實施方式中,不使用切割膠膜15及環狀框架17地加工被加工物11。首先,說明在第二實施方式所使用的超音波施加裝置58。Next, the second embodiment will be described. In addition, in the second embodiment, the
圖8(A)係表示隔著液體40對被加工物11施加超音波的情況的圖。超音波施加裝置58具有容器62。在容器62的側部設置有排液口62a。在容器62的內側的底部固定有支撐台64。FIG. 8(A) is a diagram showing a state in which ultrasonic waves are applied to the
支撐台64的上部被配置在比排液口62a的位置更高且比容器62的上端緣的位置更低的高度位置。支撐台64的上表面為平坦,且發揮作為載置被加工物11的支撐面64a的功能。在支撐面64a亦可設置有將被加工物11固定在支撐面64a的固定機構(未圖示)。The upper part of the
在支撐台64上設置有超音波喇叭(ultrasonic horn)60。超音波喇叭60例如可在X軸(或Y軸)方向及Z軸方向移動。在超音波喇叭60的一端設置有產生超音波振動的振盪器(未圖示)。由振盪器所產生的超音波在超音波喇叭60進行共振,並傳達至位在該一端之相反側的超音波喇叭60的前端部60a。An
在超音波喇叭60的附近設置有排出水等液體40的噴嘴70。噴嘴70係經由流路(未圖示)而連接液體供給源(未圖示),並將液體40供給至載置於支撐面64a的被加工物11。A
接著,說明第二實施方式之晶片21及框體23的製造方法。首先,與第一實施方式的潛盾通道形成步驟(S10)同樣地進行,沿著被加工物11的分割預定線13而形成多個潛盾通道11d。在潛盾通道形成步驟(S10)之後,以被加工物11的正面11a朝上的態樣,將被加工物11載置於支撐面64a上。Next, a method of manufacturing the
之後,從噴嘴70朝向正面11a供給液體40。液體40例如是以能充分覆蓋正面11a整體的流量供給。一邊從噴嘴70對正面11a供給液體40,一邊使超音波喇叭60的前端部60a靠近正面11a。例如,將前端部60a靠近正面11a到前端部60a與正面11a之間能以液體40填滿的程度。但是,前端部60a並未接觸正面11a。此外,亦可以在前端部60a已靠近正面11a的狀態下供給液體40。After that, the liquid 40 is supplied from the
然後,在以液體40填滿前端部60a與正面11a之間的狀態,一邊對被加工物11施加超音波,一邊使超音波喇叭60橫跨整個正面11a進行移動。藉此,對全部分割預定線13施加超音波而破壞潛盾通道11d(分割步驟(S20))。Then, in a state in which the liquid 40 fills the space between the
在第二實施方式中,一邊從排液口62a排出使用後的液體40一邊施加超音波。因此,從噴嘴70供給至容器62的液體40的水位不會超過被加工物11及前端部60a的底部的高度位置。是以,浮力等不會作用在被加工物11。因此,能使被加工物11與前端部60a的距離固定。In the second embodiment, ultrasonic waves are applied while draining the used liquid 40 from the
在分割步驟(S20)之後,拾取從被加工物11分割出的多個晶片21及框體23(拾取步驟(S30))。圖8(B)係表示拾取晶片21的情況的圖。在拾取步驟(S30)中,使用配置在超音波施加裝置58的上方的搬送裝置74等。After the dividing step (S20), the plurality of
搬送裝置74的構造與搬送裝置54相同。腕部54a對應於腕部74a,頭部54b對應於頭部74b,吸附墊54c對應於吸附墊74c,因此省略重複說明。The structure of the conveying
在拾取步驟(S30)中,使腕部74a在X軸方向移動並定位在被加工物11的正上方。之後,使腕部74a在Z軸方向移動,在使吸附墊74c接觸晶片21後,啟動吸引源而以吸附墊74c吸附晶片21。In the pickup step (S30 ), the
接著,使腕部74a在Z軸方向移動並從切割膠膜15剝離晶片21,之後,使其在X軸方向移動,而將各晶片21搬送至容納晶片21的容納托盤(未圖示)。更進一步,藉由其他搬送裝置(未圖示)或搬送裝置74,將框體23搬送至其他容納托盤(未圖示)。此外,本實施方式的製造方法亦能如上述般視為製造晶片21及框體23中至少任一者之方法。Next, the
除此之外,上述實施方式之構造、方法等只要在不脫離本發明目的之範圍內便能適當變更並實施。例如,在上述實施方式中,從被加工物11製造出20個晶片21與1個框體23,但晶片21的數量不受限於20個。從被加工物11製造出的晶片21的數量可為1個,亦可為2個以上任意的數。In addition, the structure, method, etc. of the above-mentioned embodiment can be appropriately changed and implemented as long as it does not depart from the purpose of the present invention. For example, in the above-mentioned embodiment, 20
2:雷射加工裝置
4:基台
6:基部
8:壁部
10:卡盤台
10a:保持面
11:被加工物
11a:正面
11b:背面
11c:外周端部
11d:潛盾通道
11e:細孔
11f:變質區域
12:雷射光束照射單元
12a:加工頭
12b:攝像單元
13:分割預定線
15:切割膠膜
16:Y軸移動單元
17:環狀框架
18:Y軸導軌
19:被加工物單元
20:Y軸移動台
21:晶片
22:Y軸滾珠螺桿
23:框體
24:Y軸脈衝馬達
26:X軸移動單元
28:X軸導軌
30:X軸移動台
32:X軸滾珠螺桿
34:X軸脈衝馬達
36:支撐台
38:超音波施加裝置
40:液體
42:容器
44:腳部
46:支撐部
48:夾持單元
50:超音波產生單元
54:搬送裝置
54a:腕部
54b:頭部
54c:吸附墊
58:超音波施加裝置
60:超音波喇叭
60a:前端部
62:容器
62a:排液口
64:支撐台
64a:支撐面
70:噴嘴
74:搬送裝置
74a:腕部
74b:頭部
74c:吸附墊
L:雷射光束2: Laser processing device
4: Abutment
6: Base
8: Wall
10: Chuck table
10a: Keep the face
11: processed
圖1(A)係被加工物的立體圖,圖1(B)係被加工物單元的立體圖。 圖2係雷射加工裝置的立體圖。 圖3係表示潛盾通道形成步驟的立體圖。 圖4(A)係表示一個潛盾通道的構造的立體圖,圖4(B)係表示沿著分割預定線而形成的多個潛盾通道之被加工物的局部剖面圖。 圖5(A)係超音波施加裝置的局部剖面側視圖,圖5(B)係表示隔著液體對被加工物施加超音波之情況的圖,圖5(C)係表示拾取晶片之情況的圖。 圖6(A)係一個晶片的立體圖,圖6(B)係一個框體的立體圖。 圖7係表示第一實施方式之晶片及框體的製造方法的流程圖。 圖8(A)係表示隔著液體對被加工物施加超音波之情況的圖,圖8(B)係表示拾取晶片之情況的圖。Fig. 1(A) is a perspective view of the workpiece, and Fig. 1(B) is a perspective view of the workpiece unit. Figure 2 is a perspective view of the laser processing device. Fig. 3 is a perspective view showing the steps of forming a shield channel. Fig. 4(A) is a perspective view showing the structure of one shield passage, and Fig. 4(B) is a partial cross-sectional view showing a processed object of a plurality of shield passages formed along a predetermined dividing line. Fig. 5(A) is a partial cross-sectional side view of the ultrasonic application device, Fig. 5(B) is a diagram showing the state of applying ultrasonic waves to the workpiece through a liquid, and Fig. 5(C) is a diagram showing the state of picking up a wafer Figure. Fig. 6(A) is a perspective view of a wafer, and Fig. 6(B) is a perspective view of a frame. FIG. 7 is a flowchart showing the manufacturing method of the wafer and the frame of the first embodiment. FIG. 8(A) is a diagram showing a state in which ultrasonic waves are applied to a workpiece through a liquid, and FIG. 8(B) is a diagram showing a state in which a wafer is picked up.
11:被加工物 11: processed objects
11a:正面 11a: front
11d:潛盾通道 11d: Shield channel
15:切割膠膜 15: cutting film
17:環狀框架 17: Ring frame
19:被加工物單元 19: Unit to be processed
21:晶片 21: chip
38:超音波施加裝置 38: Ultrasonic wave application device
40:液體 40: liquid
42:容器 42: container
44:腳部 44: feet
46:支撐部 46: Support
48:夾持單元 48: clamping unit
50:超音波產生單元 50: Ultrasonic generating unit
54:搬送裝置 54: Conveying device
54a:腕部 54a: wrist
54b:頭部 54b: head
54c:吸附墊 54c: Adsorption pad
S20:分割步驟 S20: Segmentation step
S30:拾取步驟 S30: Picking step
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JP2019028595A JP7218056B2 (en) | 2019-02-20 | 2019-02-20 | Method for manufacturing at least one of chip and frame |
JP2019-028595 | 2019-02-20 |
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TW202031606A true TW202031606A (en) | 2020-09-01 |
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TW109105012A TW202031606A (en) | 2019-02-20 | 2020-02-17 | Method for manufacturing at least one of chip and frame body capable of preventing cracks from being generated in a region corresponding to at least one of a chip and a frame body |
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JP (1) | JP7218056B2 (en) |
KR (1) | KR20200101841A (en) |
CN (1) | CN111590222A (en) |
TW (1) | TW202031606A (en) |
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CN114571540B (en) * | 2022-03-08 | 2024-03-19 | 海目星激光科技集团股份有限公司 | Ultrasonic splitting method |
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US5265508A (en) * | 1990-10-31 | 1993-11-30 | General Tire, Inc. | Ultrasonic cutting system for stock material |
JP2007242787A (en) * | 2006-03-07 | 2007-09-20 | Disco Abrasive Syst Ltd | Splitting method of wafer |
CN101571611B (en) * | 2009-06-05 | 2011-05-18 | 阮双琛 | All-fiber coupling implementation device and method of photonic crystal fiber |
US9434644B2 (en) | 2010-09-30 | 2016-09-06 | Avanstrate Inc. | Cover glass and method for producing cover glass |
JP6301203B2 (en) * | 2014-06-02 | 2018-03-28 | 株式会社ディスコ | Chip manufacturing method |
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JP6906845B2 (en) * | 2017-06-22 | 2021-07-21 | 株式会社ディスコ | Processing method of work piece |
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KR20200101841A (en) | 2020-08-28 |
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