TW202028133A - Apparatus for removing edged material - Google Patents
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- TW202028133A TW202028133A TW108145096A TW108145096A TW202028133A TW 202028133 A TW202028133 A TW 202028133A TW 108145096 A TW108145096 A TW 108145096A TW 108145096 A TW108145096 A TW 108145096A TW 202028133 A TW202028133 A TW 202028133A
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/1303—Apparatus specially adapted to the manufacture of LCDs
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Abstract
Description
本發明係關於一種端材去除裝置，更詳細而言，本發明係關於一種可藉由具備用以把持端材之板狀之下部把持部而將端材穩定地去除之端材去除裝置。The present invention relates to an end material removal device. More specifically, the present invention relates to an end material removal device that can stably remove end materials by having a plate-shaped lower part gripping portion for holding the end material.
通常，所謂顯示器，係電子機器與人之介面，為將自各種電子機器輸出之電資訊訊號轉換為光資訊訊號，而可供人經由視覺識別之資訊顯示裝置。Generally, the so-called display is an interface between electronic machines and humans. It is an information display device that converts electrical information signals output from various electronic machines into optical information signals that can be visually recognized by humans.
最近，半導體產業中，電子顯示器產業迅速發展，同時平面顯示器開始出現，作為其種類，有LCD（Liquid Crystal Display，液晶顯示器）、PDP（Plasma Display Panel，電漿顯示面板）、FED（Field Emission Display，場發射顯示裝置）、OLED（Organic Light Emitting Diode，有機LED）等。Recently, in the semiconductor industry, the electronic display industry has developed rapidly, and flat-panel displays have begun to appear. As their types, there are LCD (Liquid Crystal Display), PDP (Plasma Display Panel), and FED (Field Emission Display). , Field emission display device), OLED (Organic Light Emitting Diode, organic LED), etc.
該等用作平面顯示器之面板之PDP、LCD、FED、OLED等可藉由將如玻璃之脆性之母基板（mother substrate）切斷為既定之大小而獲得，因此基板之製造步驟會伴隨將大面積之母基板切斷為數個至數十個單位基板之切斷步驟。The PDP, LCD, FED, OLED, etc. used as panels for flat-panel displays can be obtained by cutting a brittle mother substrate such as glass into a predetermined size. Therefore, the manufacturing steps of the substrate will be accompanied by a large The area of the mother substrate is cut into several to tens of unit substrates.
母基板之切斷步驟包括：劃線步驟，其使用由硬度高於母基板之金剛石等構成之工具（劃線輪）於母基板之表面形成劃線槽；及裂斷步驟，其對於母基板之表面形成之劃線槽進行加壓而施加彎曲力矩，或對劃線槽之裂縫周圍進行加熱或冷卻而將其切斷。The cutting step of the mother substrate includes: a scribing step, which uses a tool (scribing wheel) composed of diamond with a hardness higher than that of the mother substrate to form a scribing groove on the surface of the mother substrate; and a breaking step, which is for the mother substrate The scribe groove formed on the surface of the scribe groove is pressurized to apply a bending moment, or the crack around the scribe groove is heated or cooled to cut it.
於裂斷步驟中，將經由劃線步驟而形成有劃線槽之母基板切斷為複數個單位基板，但此時單位基板上附著有使用時不需要之端材，而需要將其去除之端材去除步驟。 [先前技術文獻]In the cleaving step, the mother substrate with the scribe groove formed through the scribing step is cut into a plurality of unit substrates, but at this time, there are end materials that are not required for use attached to the unit substrates, and they need to be removed. End material removal step. [Prior Technical Literature]
（專利文獻1）韓國公開專利公報第2008-0064408號(Patent Document 1) Korean Patent Publication No. 2008-0064408
[發明所欲解決之問題][The problem to be solved by the invention]
然而，於現有之切斷步驟中，未另外具備用以去除安裝於單位基板之端材之裝置，主要僅可藉由手工作業去除端材，因此存在步驟之效率顯著低下之問題點。又，如專利文獻1所揭示之端材去除裝置般，於對端材之端部加壓而去除端材之情形時，於用以去除端材之構件無法準確地位於所指定之位置之情形時，存在對單位基板加壓而非對端材加壓，而對單位基板造成損傷之問題點。However, in the existing cutting step, there is no additional device for removing the end material installed on the unit substrate, and the end material can only be removed manually, so there is a problem that the efficiency of the step is significantly lower. Also, like the end material removal device disclosed in
又，於為使用夾板單元分別把持端材之上表面與下表面之其他形態的端材去除裝置之情形時，存在端材與夾板單元抵接之面積不足而把持力較弱，導致基板產生下垂之問題點。對此，以下參照圖式進行詳細說明。In addition, when the splint unit is used to hold the upper surface and the lower surface of the end material in other forms of the end material removal device, the area where the end material and the splint unit abut is insufficient and the holding force is weak, causing the substrate to sag The problem point. This will be described in detail below with reference to the drawings.
圖7係表示現有之端材去除裝置之夾板單元之側面的圖。Fig. 7 is a view showing a side view of a splint unit of a conventional end material removing device.
如圖7所示，現有之端材去除裝置之夾板單元包含與端材之上表面抵接之上夾板及與端材之下表面抵接之下夾板，上夾板與下夾板經由各自之鉸鏈軸與夾板單元本體結合。As shown in Figure 7, the splint unit of the existing end material removal device includes an upper splint that abuts against the upper surface of the end material and a lower splint that abuts against the lower surface of the end material. The upper splint and the lower splint go through their respective hinge shafts. Combined with the splint unit body.
首先，當自母基板分離之單位基板經由移送裝置移送，裝載至載台上時，上夾板以既定之角度向上方旋轉，下夾板以既定之角度向下方旋轉，從而單位基板之端材以可位於上夾板與下夾板之間之狀態待機（圖7（a））。First, when the unit substrate separated from the mother substrate is transferred by the transfer device and loaded on the stage, the upper clamping plate rotates upward at a predetermined angle, and the lower clamping plate rotates downward at a predetermined angle, so that the end material of the unit substrate can be It is in the standby state between the upper and lower splints (Figure 7(a)).
其次，夾板單元向預先設定之位置移動，端材位於上夾板與下夾板之間後，上夾板與下夾板以各自之鉸鏈軸為中心旋轉而把持端材（圖7（b））。Secondly, the splint unit moves to a preset position. After the end material is located between the upper splint and the lower splint, the upper splint and the lower splint rotate around their respective hinge shafts to hold the end material (Figure 7(b)).
然而，由於端材為具有厚度之構件，故而上夾板及下夾板之支持面與端材之邊緣部分地接觸，而非與端材之上表面及下表面整體抵接。對此，參照圖8進一步詳細說明。However, since the end material is a member with a thickness, the supporting surfaces of the upper and lower splints partially contact the edges of the end material instead of abutting the upper and lower surfaces of the end material as a whole. This will be described in further detail with reference to FIG. 8.
圖8係將使用現有之端材去除裝置把持端材之情況進一步放大顯示之放大圖。Fig. 8 is an enlarged view showing the situation of using the existing end material removal device to hold the end material in a further enlargement.
如上文所述，現有之端材去除裝置之夾板單元並非上夾板及下夾板與端材之上表面及下表面分別垂直地抵接，而為以各自之鉸鏈軸為中心旋轉並且與端材抵接。因此，如圖8所示，上夾板之支持面與端材之上表面之邊緣接觸，下夾板之支持面與端材之下表面之邊緣接觸，因此端材與夾板單元之接觸面積變小，夾板單元之把持力變弱。As mentioned above, the splint unit of the existing end material removal device does not abut the upper splint and the lower splint vertically with the upper and lower surfaces of the end material respectively, but instead rotates around the respective hinge axis and abuts against the end material. Pick up. Therefore, as shown in Figure 8, the support surface of the upper splint is in contact with the edge of the upper surface of the end material, and the support surface of the lower splint is in contact with the edge of the lower surface of the end material, so the contact area between the end material and the splint unit becomes smaller. The holding force of the splint unit becomes weak.
因此，於將端材自單位基板去除時，無法將力自端材去除裝置完全傳遞至端材，因此未將端材穩定地去除，去除端材之單位基板之端面變得不均勻，基板之品質變差。Therefore, when the end material is removed from the unit substrate, the force cannot be completely transmitted from the end material removal device to the end material. Therefore, the end material is not stably removed, and the end surface of the unit substrate from which the end material is removed becomes uneven. The quality deteriorates.
又，現有之端材去除裝置之夾板單元係具有既定寬度之上夾板及下夾板成套地把持端材之一部分。即，為部分地把持端材，而非整體把持端材之上表面或下表面，因此對於夾板單元未把持之部分，不僅端材去除能力差，而且端材自身之荷重導致如圖9所示般端材向下方下垂。In addition, the splint unit of the existing end material removal device has a predetermined width upper splint and lower splint to hold a part of the end material in a complete set. That is, to partially hold the end material, rather than the entire upper or lower surface of the end material. Therefore, for the part that is not held by the splint unit, not only the removal ability of the end material is poor, but also the load of the end material itself causes the result as shown in Figure 9 The general end material sags downward.
如上所述，於端材向下方下垂之情形時，於端材去除時裂縫變得不均勻，端材之切斷品質變差。尤其是最近需求劇增之8K以上之高解像度基板於側面之刮痕處非常脆弱，於基板向下方下垂之情形時，存在於去除端材之同時單位基板之側端面產生刮痕之情況，而存在藉由現有之端材去除裝置無法獲得高品質之高解像度基板之問題點。As described above, when the end material sags downward, the crack becomes uneven when the end material is removed, and the cutting quality of the end material deteriorates. In particular, high-resolution substrates with a resolution of 8K or higher, which have recently been rapidly increasing in demand, are very fragile at the side scratches. When the substrate sags downward, there may be scratches on the side surface of the unit substrate while removing the end material. There is a problem that a high-quality, high-resolution substrate cannot be obtained with the existing end material removal device.
又，基板之面積越大，基板之下垂越進一步嚴重，視情形，基板之自重使得裂縫過度生長，導致於夾板單元為了去除端材而施加力之前，已發生僅把持端材即導致端材先脫落之情形。於該情形時，由於未將端材徹底去除，單位基板之截面變得不均勻，故而基板之品質變差。In addition, the larger the area of the substrate, the more severe the sagging of the substrate will be. Depending on the situation, the weight of the substrate may cause excessive cracks to grow. As a result, before the clamping unit applies force to remove the end material, it has occurred that only holding the end material will cause the end material to advance. The situation of falling off. In this case, since the end material is not completely removed, the cross section of the unit substrate becomes uneven, and the quality of the substrate deteriorates.
又，由於夾板單元之上夾板與下夾板以各自之鉸鏈點為基準旋轉並把持端材，故而難以設定成為端材去除作業之基準之物理原點。因此，難以為了將基板自身設定於假想之原點實施端材去除作業而以較高之精度設定原點，於實際之步驟中，上夾板與下夾板之間可能發生微細之偏離。In addition, since the upper and lower clamping plates of the clamping plate unit rotate and hold the end material based on their respective hinge points, it is difficult to set the physical origin as a reference for the end material removal operation. Therefore, it is difficult to set the origin with high accuracy in order to set the substrate itself at the imaginary origin to perform the end material removal operation. In actual steps, slight deviations may occur between the upper clamp and the lower clamp.
又，不僅上夾板與下夾板，包含上夾板與下夾板之複數個夾板單元亦分別單獨動作，因此於去除端材之實際之步驟中，難以將上夾板及下夾板與準確之位置在時間上同步。In addition, not only the upper and lower splints, but also the plural splint units including the upper and lower splints also act separately. Therefore, in the actual step of removing the end material, it is difficult to set the upper and lower splints and their precise positions in time. Synchronize.
因此，本發明係為了解決如上述之問題點而提出者，其目的在於提供一種可將端材穩定且容易地去除並且提高基板之切斷品質之端材去除裝置。 [解決問題之手段]Therefore, the present invention was proposed in order to solve the above-mentioned problems, and its purpose is to provide an end material removal device that can stably and easily remove the end material and improve the cutting quality of the substrate. [Means to Solve the Problem]
為了達成上述本發明之目的，本發明之一實施形態之端材去除裝置包含把持安裝於複數個單位基板之端材之把持部、以把持上述端材之方式使上述把持部移動之驅動部及將上述驅動部與上述把持部連結之連結部，上述把持部包含框架、設置於上述框架且與上述端材之上表面抵接之上部把持部、及設置於上述框架且與上述端材之下表面抵接之下部把持部，上述驅動部包含使上述把持部向上述端材之長度方向即第1方向移動之第1驅動部，上述下部把持部為板狀。In order to achieve the above-mentioned object of the present invention, an end material removing device according to an embodiment of the present invention includes a gripping portion for gripping end materials mounted on a plurality of unit substrates, a driving portion for moving the gripping portion by gripping the end materials, and The connecting portion that connects the driving portion and the gripping portion, the gripping portion includes a frame, an upper gripping portion provided on the frame and abutting on the upper surface of the end material, and an upper gripping portion provided on the frame and under the end material The surface abuts the lower gripping portion, the driving portion includes a first driving portion that moves the gripping portion in a first direction that is the longitudinal direction of the end member, and the lower gripping portion has a plate shape.
又，上述驅動部可進而包含使上述把持部向與上述第1方向交叉之第2方向移動之第2驅動部。Moreover, the said drive part may further include the 2nd drive part which moves the said holding part in the 2nd direction which intersects with the said 1st direction.
又，上述連結部可包含將上述第1驅動部與上述第2驅動部連結之第1連結部、及將上述第2驅動部與上述把持部連結之第2連結部。In addition, the connection portion may include a first connection portion that connects the first drive portion and the second drive portion, and a second connection portion that connects the second drive portion and the grip portion.
又，上述框架之兩端分別可旋轉地與上述第1連結部連結，上述驅動部可進而包含形成於上述框架之一側且使上述框架旋轉之旋轉驅動部。In addition, both ends of the frame are rotatably connected to the first connecting portion, respectively, and the driving portion may further include a rotation driving portion formed on one side of the frame and rotating the frame.
又，上述第1連結部可進而包含加強肋。Moreover, the said 1st connection part may further include a reinforcement rib.
又，上述上部把持部可沿與上述第1方向交叉之第2方向移動。In addition, the upper grip portion is movable in a second direction that intersects the first direction.
又，上述下部把持部可以上述下部把持部之支持面與上述端材之下表面抵接之方式固定。In addition, the lower grip portion may be fixed in such a manner that the supporting surface of the lower grip portion abuts the lower surface of the end member.
又，上述驅動部可進而包含使上述上部把持部向與上述第1方向交叉之第3方向移動之第3驅動部。 [發明之效果]Moreover, the said drive part may further include the 3rd drive part which moves the said upper holding part in the 3rd direction which cross|intersects the said 1st direction. [Effects of Invention]
根據本發明，藉由增大把持部把持端材之面積，可增大端材去除裝置對端材之把持力，因此可更細密且穩定地去除端材。According to the present invention, by increasing the area of the end material held by the gripping portion, the holding force of the end material removal device to the end material can be increased, so the end material can be removed more finely and stably.
以下，參照相關圖式對本發明之實施例進行詳細說明。 圖1係表示本發明之一實施形態之端材去除裝置之主要構成的立體圖。Hereinafter, the embodiments of the present invention will be described in detail with reference to related drawings. Fig. 1 is a perspective view showing the main structure of an end material removing device according to an embodiment of the present invention.
端材去除裝置（1）包含驅動部（100）、連結部（200）、及把持部（300）。The end material removing device (1) includes a driving part (100), a connecting part (200), and a holding part (300).
驅動部（100）係為了把持裝載於載台（未圖示）上之端材（3）而將端材去除裝置（1）之把持部（300）移動至適當之位置之構件，其包含第1驅動部（110）及第2驅動部（120）。The driving part (100) is a member that moves the grip part (300) of the end material removal device (1) to an appropriate position in order to hold the end material (3) loaded on the stage (not shown), and it includes the first 1 driving unit (110) and second driving unit (120).
第1驅動部（110）係沿基板之長度方向即第1方向（例如，圖1中為X軸方向）較長地延長形成之一對樑狀之構件，其包含以可沿第1方向移動之方式與第1驅動部（110）之上表面結合之第1滑動構件（111）。第1驅動部（110）之兩側面沿第1方向切缺一部分，第1滑動構件（111）之兩側之邊緣以嵌合於切缺之部分之方式突出。藉此，若第1驅動部（110）作動，則第1滑動構件（111）沿第1方向於第1驅動部（110）之上表面上移動，而使把持部（300）向第1方向移動。The first driving part (110) is a pair of beam-shaped members elongated along the length direction of the substrate, that is, the first direction (for example, the X axis direction in FIG. In this way, the first sliding member (111) is combined with the upper surface of the first driving part (110). Part of the two side surfaces of the first driving part (110) is cut along the first direction, and the edges on both sides of the first sliding member (111) protrude in a manner of fitting into the cut part. Thereby, when the first driving part (110) is actuated, the first sliding member (111) moves on the upper surface of the first driving part (110) in the first direction, and the grip part (300) is moved in the first direction mobile.
第2驅動部（120）係沿與第1方向交叉之方向即第2方向（例如，圖1中為Y軸方向）較長地延長形成之一對樑狀之構件，其包含以可沿第2方向移動之方式與第2驅動部（120）之一面結合之第2滑動構件（121）。第2驅動部（120）之兩側面沿第2方向切缺一部分，第2滑動構件（121）之兩側之邊緣以嵌合於切缺之部分之方式突出。藉此，若第2驅動部（120）作動，則第2滑動構件（121）沿第2方向於第2驅動部（120）之一面上移動，而使把持部（300）向第2方向移動。The second driving portion (120) is a pair of beam-shaped members elongated in a direction intersecting the first direction, that is, a second direction (for example, the Y-axis direction in FIG. 1). The second sliding member (121) is combined with one surface of the second driving part (120) in a two-way movement. Part of the two side surfaces of the second driving part (120) is cut in the second direction, and the edges on both sides of the second sliding member (121) protrude in a manner of fitting into the cut part. Thereby, when the second driving part (120) is actuated, the second sliding member (121) moves in the second direction on one surface of the second driving part (120), and the grip part (300) is moved in the second direction .
連結部（200）係用以將端材去除裝置（1）之各構件互相牢固地連結而使各構件順利地移動之構件，其包含第1連結部（210）及第2連結部（220）。The connecting portion (200) is a member used to firmly connect the components of the end material removal device (1) to each other so that the components move smoothly, and it includes a first connecting portion (210) and a second connecting portion (220) .
第1連結部（210）係將第1驅動部（110）與第2驅動部（120）連結之構件，以可根據第1驅動部（110）之作動而沿第1方向滑動之方式，第1連結部（210）之一面與第1滑動構件（111）之上表面連結作動。The first connecting portion (210) is a member that connects the first driving portion (110) and the second driving portion (120), and is slid in the first direction according to the action of the first driving portion (110). 1 One surface of the connecting portion (210) is connected and operated with the upper surface of the first sliding member (111).
又，第1連結部（210）之另一面與第2驅動部（120）之前表面連結，但不同於與第1驅動部（110）之連結，為以不根據第2驅動部（120）之作動而動作之方式固定。結合方式可為螺栓-螺母結合或焊接等，只要可將第1連結部（210）與第2驅動部（120）牢固地結合即可，其結合方式並無特別限定。In addition, the other surface of the first connecting portion (210) is connected to the front surface of the second driving portion (120), but different from the connection with the first driving portion (110), it is not based on the second driving portion (120). The way of action is fixed. The coupling method may be bolt-nut coupling or welding, as long as the first coupling portion (210) and the second driving portion (120) can be firmly coupled, and the coupling manner is not particularly limited.
因此，若第1連結部（210）根據第1驅動部（110）之作動而沿第1方向移動，則固定於第1連結部（210）之第2驅動部（120）亦同樣地沿第1方向移動。Therefore, if the first connecting portion (210) moves in the first direction according to the action of the first driving portion (110), the second driving portion (120) fixed to the first connecting portion (210) also moves along the first direction. Move in 1 direction.
又，第1連結部（210）可進而包含用以提高裝置之耐久性之加強肋（211）。加強肋（211）係形成於第1連結部（210）中與第1驅動部（110）結合之一面及與第2驅動部（120）結合之一面之間。端材去除裝置（1）藉由包含加強肋（211），可防止作業時之振動等導致之端材去除裝置（1）之搖動，尤其可防止把持部（300）之自重導致第2驅動部（120）向第1方向彎曲而破損。In addition, the first connecting portion (210) may further include a reinforcing rib (211) for improving the durability of the device. The reinforcing rib (211) is formed between a surface of the first connecting portion (210) connected to the first driving portion (110) and a surface connected to the second driving portion (120). The end material removal device (1) includes the reinforcement ribs (211), which can prevent the end material removal device (1) from shaking due to vibration during operation, and especially prevents the second drive part from being caused by the weight of the holding part (300) (120) Bending in the first direction and breaking.
繼而，第2連結部（220）係用以將第2驅動部（120）與把持部（300）連結之構件，其以可藉由第2驅動部（120）之作動而沿第2方向移動之方式與第2滑動構件（121）連結作動，其包含連結區塊（221）、連結樑（222）、及連結支架（223）。參照圖2進一步對其進行詳細說明。Then, the second connecting portion (220) is a member for connecting the second driving portion (120) and the holding portion (300), which can be moved in the second direction by the action of the second driving portion (120) The method is connected to the second sliding member (121), which includes a connecting block (221), a connecting beam (222), and a connecting bracket (223). This will be described in further detail with reference to FIG. 2.
圖2係表示本發明之一實施形態之端材去除裝置（1）之主要構成的前視圖。Fig. 2 is a front view showing the main structure of an end material removing device (1) according to an embodiment of the present invention.
連結區塊（221）係以根據第2滑動構件（121）之移動而沿第2方向移動之方式與一對第2滑動構件（121）之一面分別連結之一對區塊狀之構件。又，連結樑（222）係沿與第1方向交叉之第3方向（例如，圖2中為Z軸方向）延長形成之樑狀之構件，與一對連結區塊（221）各自之上表面結合。又，連結支架（223）係設置於連結樑（222）之左右側之上端，其將下文所述之框架（310）之左右側之兩端與連結樑（222）連結。The connecting block (221) is a pair of block-shaped members respectively connected to one surface of the pair of second sliding members (121) in a manner of moving in the second direction according to the movement of the second sliding member (121). In addition, the connecting beam (222) is a beam-like member formed by extending along the third direction (for example, the Z-axis direction in FIG. 2) intersecting the first direction, and the upper surface of each of the pair of connecting blocks (221) Combine. In addition, the connecting bracket (223) is arranged at the upper end of the left and right sides of the connecting beam (222), which connects the two ends of the frame (310) described below with the connecting beam (222).
因此，若第2滑動構件（121）根據第2驅動部（120）之作動而沿第2方向移動，則第2連結部（220）亦沿第2方向移動，藉此，連結於連結支架（223）之框架（310）亦沿第2方向移動。Therefore, if the second sliding member (121) moves in the second direction in accordance with the action of the second driving portion (120), the second connecting portion (220) also moves in the second direction, thereby connecting to the connecting bracket ( The frame (310) of 223) also moves in the second direction.
繼而，本發明之一實施形態之虛設去除裝置（1）之把持部（300）包含框架（310）、上部把持部（320）、及下部把持部（330）。對此，參照圖3進一步詳細說明。Then, the holding part (300) of the dummy removing device (1) according to an embodiment of the present invention includes a frame (310), an upper holding part (320), and a lower holding part (330). This will be described in further detail with reference to FIG. 3.
圖3係表示沿圖1所示之線A-A'切斷把持部而得之截面之截面圖。Fig. 3 is a cross-sectional view showing a cross section obtained by cutting the grip portion along the line AA' shown in Fig. 1.
框架（310）係形成把持部（300）之骨架而設置上部把持部（320）與下部把持部（330）之構件，以上部把持部（320）之一部分向框架（310）之外部突出之方式切缺前後表面之一部分。框架（310）之左側與右側之兩端部分別與連結支架（223）結合。The frame (310) forms the skeleton of the gripping portion (300) and is provided with an upper gripping portion (320) and a lower gripping portion (330). A part of the upper gripping portion (320) protrudes to the outside of the frame (310) Cut off part of the front and back surfaces. The left and right ends of the frame (310) are respectively combined with the connecting bracket (223).
本發明之一實施形態之框架（310）以可將上部把持部（320）收容至內部之方式具有內部為空之長方體形狀，但只要可設置上部把持部（320）與下部把持部（330）而把持端材（3）即可，並不限定其形狀與大小。The frame (310) of one embodiment of the present invention has a rectangular parallelepiped shape with an empty interior so that the upper grip portion (320) can be housed inside, but as long as the upper grip portion (320) and the lower grip portion (330) can be provided It is sufficient to hold the end material (3), and its shape and size are not limited.
上部把持部（320）係直接把持端材（3）之上表面之構件，本發明之一實施形態之上部把持部（320）係收容至框架（310）之內部，但只要設置於可把持端材（3）之適當之位置即可，未必收容至框架（310）之內部。The upper gripping portion (320) is a member that directly grips the upper surface of the end material (3). The upper gripping portion (320) is housed in the frame (310) in one embodiment of the present invention, but it only needs to be set at the gripable end The proper position of the material (3) is sufficient, and it may not be contained in the frame (310).
上部把持部（320）包含上部把持部本體（321）、缸體（cylinder）（322）、及把持臂（323）。結合於上部把持部本體（321）之上表面之缸體（322）經由使用者之操作或預先設定之程式，依照控制部（未圖示）之命令沿第2方向移動，藉此，結合於缸體（322）之上表面之把持臂（323）亦同樣地沿第2方向移動，把持臂（323）之支持面與端材（3）之上表面抵接。The upper grip part (320) includes an upper grip body (321), a cylinder (322), and a grip arm (323). The cylinder (322) connected to the upper surface of the upper grip body (321) moves in the second direction according to the command of the control unit (not shown) through the user's operation or a preset program, thereby being combined with The holding arm (323) on the upper surface of the cylinder (322) also moves in the second direction, and the supporting surface of the holding arm (323) abuts against the upper surface of the end material (3).
因此，於現有之端材去除裝置之情形時，由於上夾板以鉸鏈軸為中心轉動並且把持端材之上表面，故而上夾板之支持面無法與端材之上表面完全抵接，而與端材之邊緣抵接，把持面積較小。與此相反，本發明之一實施形態之上部把持部（320）與第2驅動部（120）之作動不同，上部把持部（320）之把持臂（323）自身經由缸體（322）而沿端材（3）之厚度方向即第2方向移動，因此可與端材（3）之上表面完全抵接，而可確保較大之把持面積。Therefore, in the case of the existing end material removal device, since the upper splint rotates around the hinge shaft and holds the upper surface of the end material, the supporting surface of the upper splint cannot completely abut against the upper surface of the end material, and is The edge of the material abuts, and the holding area is small. In contrast to this, in one embodiment of the present invention, the upper gripping portion (320) and the second driving portion (120) operate differently. The gripping arm (323) of the upper gripping portion (320) itself runs along the cylinder (322). The thickness direction of the end material (3) moves in the second direction, so it can completely abut on the upper surface of the end material (3), and a larger holding area can be ensured.
繼而，下部把持部（330）係沿與第1方向及第2方向交叉之第3方向延長而具有既定寬度之板狀之構件。下部把持部（330）係設置於框架（310）之側面，其可隔開既定之間隔而設置複數個板，或者以一個板設置，均具有與端材（3）之寬度相對應之寬度。因此，可以較大寬度把持端材（3）之下表面，與現有之端材去除裝置相比，可確保更大之把持面積。參照圖4對其進一步詳細說明。Then, the lower holding portion (330) is a plate-shaped member having a predetermined width extending in a third direction intersecting the first direction and the second direction. The lower holding portion (330) is arranged on the side surface of the frame (310), which can be arranged with a plurality of plates separated by a predetermined interval, or arranged by one plate, all having a width corresponding to the width of the end material (3). Therefore, the lower surface of the end material (3) can be grasped with a larger width, and compared with the existing end material removing device, a larger grasping area can be ensured. This will be described in further detail with reference to FIG. 4.
圖4係概略性地表示使用本發明之一實施形態之端材去除裝置（1）把持端材（3）之情況之概略圖。Fig. 4 is a schematic diagram showing a situation in which an end material removal device (1) according to an embodiment of the present invention is used to grip an end material (3).
即，於現有之端材去除裝置中，如圖9所示，下夾板以鉸鏈軸為中心轉動，導致下夾板之支持面無法與端材之下表面完全抵接，而與端材之邊緣抵接。又，由於下夾板僅把持與下夾板之支持面相對應之部分，而非把持端材之寬度方向整體，因此把持面積較小，下夾板不把持之端材部分會向下方下垂。That is, in the existing end material removal device, as shown in Figure 9, the lower splint rotates around the hinge axis, resulting in that the supporting surface of the lower splint cannot completely abut against the lower surface of the end material, but is against the edge of the end material. Pick up. In addition, since the lower splint only holds the part corresponding to the supporting surface of the lower splint, and not the entire width direction of the end material, the gripping area is small, and the end material part not held by the lower splint will sag downward.
與其相反，本發明之一實施形態之下部把持部（330）係具有與端材（3）之寬度相對應之寬度之板狀之構件，如圖4所示，下部把持部（330）可以較大寬度把持端材（3）之下表面。因此，不僅可防止端材（3）向下方下垂，而且可確保遠遠大於現有之端材去除裝置之把持面積，而可更穩定地去除端材（3）。On the contrary, the lower gripping portion (330) of one embodiment of the present invention is a plate-shaped member having a width corresponding to the width of the end material (3). As shown in FIG. 4, the lower gripping portion (330) can be relatively The large width holds the lower surface of the end material (3). Therefore, not only can the end material (3) be prevented from sagging downward, but also the holding area of the existing end material removal device can be ensured, and the end material (3) can be removed more stably.
又，與可沿第2方向移動之上部把持部（320）不同，本發明之一實施形態之下部把持部（330）係以其支持面與端材（3）之下表面抵接之方式固定於框架（310）之側面而設置。Also, unlike the upper gripping portion (320) that can move in the second direction, the lower gripping portion (330) of one embodiment of the present invention is fixed in such a way that its supporting surface abuts against the lower surface of the end material (3) Set on the side of the frame (310).
於現有之端材去除裝置中，由於上夾板與下夾板之兩者以各自之鉸鏈軸為基準轉動，故而難以設定成為端材去除作業之基準之物理原點。因此，為了將基板之一面設定於假想之原點而實施端材去除作業，會產生上夾板與下夾板無法於準確之位置咬合之情形。又，由於現有之端材去除裝置係上夾板與下夾板分開動作，故而存在如下問題：不僅難以將一個夾板單元之上夾板與下夾板之作動準確地同步化，而且難以將複數個夾板單元之作動同步化而同時把持端材。In the existing end material removal device, since both the upper splint and the lower splint rotate based on their respective hinge axes, it is difficult to set the physical origin as the reference for the end material removal operation. Therefore, in order to set one surface of the substrate at the imaginary origin and perform the end material removal operation, the upper splint and the lower splint cannot be engaged in an accurate position. In addition, because the existing end material removal device separates the upper and lower splints, there are the following problems: it is not only difficult to accurately synchronize the actions of the upper and lower splints of one splint unit, but also difficult to synchronize the movement of the upper and lower splints of a splint unit. Actuate synchronization while holding the end material.
與其相反，由於本發明之一實施形態之下部把持部（330）被固定，故而可將下部把持部（330）之支持面設定於成為用以把持端材（3）之基準之物理原點，無需另行操作下部把持部（330），藉由僅操作上部把持部（320）即可把持端材（3），因此可非常容易地同步把持部（300）。On the contrary, since the lower gripping portion (330) of one embodiment of the present invention is fixed, the supporting surface of the lower gripping portion (330) can be set at the physical origin that becomes the reference for holding the end material (3), There is no need to separately operate the lower grip (330), and the end material (3) can be gripped by operating only the upper grip (320), so the grip (300) can be synchronized very easily.
圖5係表示本發明之另一其他實施形態之端材去除裝置（1）之主要構成的前視圖。作為參考，省略對與上文所述之實施形態中之圖式符號相同之圖式符號之說明。Fig. 5 is a front view showing the main structure of an end material removing device (1) according to another embodiment of the present invention. For reference, the description of the drawing symbols that are the same as those in the above-mentioned embodiment is omitted.
參照圖5，本發明之另一其他實施形態之端材去除裝置（1）之驅動部（100）可進而包含使複數個上部把持部（320）個別地沿第3方向移動之第3驅動部（130）。5, the driving part (100) of the end material removal device (1) of another embodiment of the present invention may further include a third driving part that moves a plurality of upper gripping parts (320) individually in a third direction (130).
第3驅動部（130）係安裝於框架（310）之下表面，與設置於框架（310）之內部之上部把持部（320）連結。藉此，可藉由使用者之操作或預先設定之程式之指示，使各上部把持部（320）沿第3方向移動。The third driving part (130) is installed on the lower surface of the frame (310), and is connected with the upper gripping part (320) provided inside the frame (310). In this way, the upper grips (320) can be moved in the third direction by the user's operation or the instructions of the preset program.
又，以使各上部把持部（320）可根據第3驅動部（130）之作動而沿第3方向移動之方式，於框架（310）形成有開放槽（340）作動。開放槽（340）係以上部把持部（320）於向框架（310）之外部突出之狀態下可沿第3方向移動之方式將框架（310）之前表面及/或後表面切缺一部分而形成。In addition, an open groove (340) is formed in the frame (310) to operate in such a manner that each upper gripping portion (320) can move in the third direction in accordance with the operation of the third driving portion (130). The open groove (340) is formed by cutting a part of the front surface and/or back surface of the frame (310) in a state where the upper gripping portion (320) can move in the third direction while protruding to the outside of the frame (310) .
圖6係表示本發明之另一其他實施形態之端材去除裝置之主要構成的立體圖。Fig. 6 is a perspective view showing the main structure of an end material removing device according to another embodiment of the present invention.
參照圖6，本發明之另一其他實施形態之端材去除裝置（1）之驅動部（100）可進而包含使把持部（300）旋轉之旋轉驅動部（140）。6, the driving part (100) of the end material removal device (1) of another embodiment of the present invention may further include a rotation driving part (140) for rotating the grip part (300).
框架（310）之兩端係分別可旋轉地連結於第2連結部（220）之連結支架（223），旋轉驅動部（140）係設置於框架（310）之一側。藉此，框架（310）根據旋轉驅動部（140）之作動而旋轉，上部把持部（320）與下部把持部（330）之指向角度變得不同。Both ends of the frame (310) are respectively rotatably connected to the connecting bracket (223) of the second connecting portion (220), and the rotation driving portion (140) is arranged on one side of the frame (310). Thereby, the frame (310) rotates according to the action of the rotation driving part (140), and the pointing angles of the upper grip part (320) and the lower grip part (330) become different.
因此，本發明之上述實施形態之端材去除裝置（1）藉由具備旋轉驅動部（140），把持端材（3）之把持部（300）之移動軌跡不僅可為直線，而且可一面描繪曲線一面移動，因此與現有之端材去除裝置相比，可進行更細密且穩定之作業。Therefore, the end material removal device (1) of the above-mentioned embodiment of the present invention is provided with a rotation driving part (140), and the movement track of the grip part (300) holding the end material (3) can be not only a straight line, but also can be drawn on one side. The curve moves on one side, so compared with the existing end material removal device, it can perform more detailed and stable operations.
又，於本發明之一實施形態之端材去除裝置（1）中，僅將第1驅動部（110）、第2驅動部（120）、第3驅動部（130）、及旋轉驅動部（140）之組合例中之一部分作為實施例進行了說明，但於實際之步驟中，可根據各情況將第1驅動部（110）、第2驅動部（120）、第3驅動部（130）、及旋轉驅動部（140）中之任一者以上以不同方式組合而應用。例如，藉由全部具備第1驅動部（110）、第2驅動部（120）、及第3驅動部（130），可實現正交座標系中向3軸方向之全部驅動。又，藉由除此以外進而具備旋轉驅動部（140），亦可利用第1至第3驅動部（110、120、130）之作動，於把持部（300）以適當之位置把持端材（3）之狀態下，旋轉驅動部（140）使把持部（300）旋轉，而進行更細密且穩定之端材去除作業。In addition, in the end material removal device (1) of one embodiment of the present invention, only the first drive unit (110), the second drive unit (120), the third drive unit (130), and the rotation drive unit ( A part of the combination example of 140) is described as an embodiment, but in actual steps, the first drive unit (110), the second drive unit (120), and the third drive unit (130) can be combined according to each situation. Any one or more of the, and the rotation drive unit (140) are combined and applied in different ways. For example, by providing all of the first drive unit (110), the second drive unit (120), and the third drive unit (130), all driving in the three-axis direction in the orthogonal coordinate system can be realized. In addition, by having a rotation driving part (140) in addition to this, the first to third driving parts (110, 120, 130) can also be used to hold the end material (300) at an appropriate position in the gripping part (300). In the state of 3), the rotating drive part (140) rotates the grip part (300) to perform a more detailed and stable end material removal operation.
又，於本發明之一實施形態之端材去除裝置（1）中，係說明了上部把持部（320）之把持臂（323）沿第1方向向兩側延長形成且於框架（310）之前表面與後表面之兩面全部形成有下部把持部（330）者，但不限定於此，上部把持部（322）與下部把持部（330）亦可僅形成於框架之一側。In addition, in the end material removal device (1) of one embodiment of the present invention, it is explained that the gripping arms (323) of the upper gripping portion (320) are extended to both sides in the first direction and are formed in front of the frame (310) The lower gripping portion (330) is formed on both surfaces of the surface and the rear surface, but it is not limited to this. The upper gripping portion (322) and the lower gripping portion (330) can also be formed only on one side of the frame.
又，於本說明書中，係說明了使第1方向、第2方向、第3方向分別對應於端材之長度方向、端材之厚度方向、端材之寬度方向者，但第1方向、第2方向、第3方向只要為互相交叉之方向即可，未必限定於此。例如，第2驅動部作動之第2方向亦可以與基板之厚度方向錯開之方式構成。In addition, in this specification, it is explained that the first direction, the second direction, and the third direction correspond to the length direction of the end material, the thickness direction of the end material, and the width direction of the end material, respectively, but the first direction, the second direction The second direction and the third direction are not necessarily limited to these as long as they intersect each other. For example, the second direction in which the second driving portion is actuated may also be configured to be offset from the thickness direction of the substrate.
1:端材去除裝置 2:基板 3:端材 100:驅動部 110:第1驅動部 111:第1滑動構件 120:第2驅動部 121:第2滑動構件 130:第3驅動部 140:旋轉驅動部 200:連結部 210:第1連結部 211:加強肋 220:第2連結部 221:連結區塊 222:連結樑 223:連結支架 300:把持部 310:框架 320:上部把持部 321:上部把持部本體 322:缸體 323:把持臂 330:下部把持部 340:開放槽1: End material removal device 2: substrate 3: end material 100: Drive 110: The first drive unit 111: The first sliding member 120: 2nd drive unit 121: 2nd sliding member 130: 3rd drive part 140: Rotary drive unit 200: Connection 210: First connection 211: Reinforced ribs 220: The second connection part 221: Link Block 222: connecting beam 223: Link Bracket 300: Control Department 310: Frame 320: Upper grip 321: Upper grip body 322: cylinder 323: Holding Arm 330: Lower grip 340: open slot
[圖1]係表示本發明之一實施形態之端材去除裝置之主要構成的立體圖。 [圖2]係表示本發明之一實施形態之端材去除裝置之主要構成的前視圖。 [圖3]係表示沿圖1所示之線A-A'切斷把持部而得之截面之截面圖。 [圖4]係概略性地表示本發明之一實施形態之端材去除裝置把持端材之情況之概略圖。 [圖5]係表示本發明之其他實施形態之端材去除裝置之主要構成的前視圖。 [圖6]係表示本發明之另一其他實施形態之端材去除裝置之主要構成的圖。 [圖7]係表示現有之端材去除裝置之夾板單元之側面的圖。 [圖8]係將現有之端材去除裝置把持端材之狀態進一步放大顯示之放大圖。 [圖9]係概略性地表示現有之端材去除裝置把持端材之情況之概略圖。[Fig. 1] is a perspective view showing the main structure of an end material removing device according to an embodiment of the present invention. [Fig. 2] is a front view showing the main structure of an end material removing device according to an embodiment of the present invention. [Fig. 3] is a cross-sectional view showing a cross section obtained by cutting the grip portion along the line AA' shown in Fig. 1. [Fig. [Fig. 4] is a schematic diagram schematically showing the state in which the end material removing device of one embodiment of the present invention grips the end material. Fig. 5 is a front view showing the main structure of an end material removing device according to another embodiment of the present invention. [Fig. 6] A diagram showing the main configuration of an end material removing device according to another embodiment of the present invention. [Fig. 7] is a view showing the side surface of the splint unit of the conventional end material removing device. [Fig. 8] is an enlarged view showing the state of the existing end material removal device holding the end material further. [Fig. 9] is a schematic diagram schematically showing the state of the existing end material removing device gripping the end material.
1:端材去除裝置 1: End material removal device
2:基板 2: substrate
3:端材 3: end material
100:驅動部 100: Drive
110:第1驅動部 110: The first drive unit
111:第1滑動構件 111: The first sliding member
120:第2驅動部 120: 2nd drive unit
121:第2滑動構件 121: 2nd sliding member
200:連結部 200: Connection
210:第1連結部 210: First connection
211:加強肋 211: Reinforced ribs
220:第2連結部 220: The second connection part
221:連結區塊 221: Link Block
222:連結樑 222: connecting beam
223:連結支架 223: Link Bracket
300:把持部 300: Control Department
310:框架 310: Frame
320:上部把持部 320: Upper grip
330:下部把持部 330: Lower grip
Claims (8)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0002785 | 2019-01-09 | ||
| KR1020190002785A KR102122427B1 (en) | 2019-01-09 | 2019-01-09 | Apparatus for removing edged material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW202028133A true TW202028133A (en) | 2020-08-01 |
Family
ID=71088263
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW108145096A TW202028133A (en) | 2019-01-09 | 2019-12-10 | Apparatus for removing edged material |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2020111047A (en) |
| KR (1) | KR102122427B1 (en) |
| CN (1) | CN111421676B (en) |
| TW (1) | TW202028133A (en) |
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| US20090050610A1 (en) * | 2004-10-13 | 2009-02-26 | Mitsuboshi Diamond Industrial Co., Ltd. | Method and apparatus for scribing brittle material board and system for breaking brittle material board |
| KR20080064408A (en) | 2007-01-05 | 2008-07-09 | 주식회사 탑 엔지니어링 | Apparatus for removing dummy glass of panel |
| JP4392766B2 (en) * | 2007-08-21 | 2010-01-06 | 株式会社日立ハイテクノロジーズ | ACF pasting device |
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| JP2011178054A (en) * | 2010-03-02 | 2011-09-15 | Ihi Corp | Brittle material cutting device and cutting method |
| JP5583478B2 (en) * | 2010-05-25 | 2014-09-03 | 株式会社シライテック | Panel splitting device |
| JP2012024983A (en) * | 2010-07-21 | 2012-02-09 | Shibuya Kogyo Co Ltd | Method and device for chamfering brittle material |
| JP5194076B2 (en) * | 2010-08-27 | 2013-05-08 | 三星ダイヤモンド工業株式会社 | Laser cleaving device |
| KR102078050B1 (en) * | 2011-05-13 | 2020-02-17 | 니폰 덴키 가라스 가부시키가이샤 | Laminate, method for cutting laminate, method for processing laminate, and device and method for cutting brittle plate-like object |
| JP5447992B2 (en) * | 2011-06-01 | 2014-03-19 | 三星ダイヤモンド工業株式会社 | Substrate cutting device |
| JP5374545B2 (en) * | 2011-06-01 | 2013-12-25 | 三星ダイヤモンド工業株式会社 | Substrate cutting device |
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| JP2014214053A (en) * | 2013-04-25 | 2014-11-17 | 三星ダイヤモンド工業株式会社 | Laminated substrate processing device |
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2019
- 2019-01-09 KR KR1020190002785A patent/KR102122427B1/en active IP Right Grant
- 2019-12-10 TW TW108145096A patent/TW202028133A/en unknown
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2020
- 2020-01-08 JP JP2020001228A patent/JP2020111047A/en active Pending
- 2020-01-09 CN CN202010021202.XA patent/CN111421676B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111421676A (en) | 2020-07-17 |
| JP2020111047A (en) | 2020-07-27 |
| CN111421676B (en) | 2024-04-19 |
| KR102122427B1 (en) | 2020-06-12 |
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