TW202018015A

TW202018015A - Electronic paste with two metal powder mixing together with different melting points

Info

Publication number: TW202018015A
Application number: TW107138561A
Authority: TW
Inventors: 陳振賢
Original assignee: 廣州力及熱管理科技有限公司
Priority date: 2018-10-31
Filing date: 2018-10-31
Publication date: 2020-05-16

Abstract

An electronic paste with two metal powder mixing together with different melting points includes a first metal alloy powder with a first melting point, a second metal powder with a second melting point, and a flux for uniformly mixing the first metal alloy powder and the second metal powder. Wherein, the temperature of the first melting point is lower than the temperature of the second melting point. The electronic paste with two metal powder mixing together with different melting point of the present invention is a novel slurry composition, it can be applied to make the wick structure in production of flatten micro heat pipe, so as to control the thickness of wick structure, increase the efficiency of mass production. Moreover, and the problem of requiring a large amount of heat energy and electric power can be solved.

Description

混合兩種不同熔點金屬粉末之電子漿料 Electronic paste mixing two metal powders with different melting points

本發明係關於一種電子漿料；並且特別地，關於一種混合兩種不同熔點金屬粉末之電子漿料。 The present invention relates to an electronic paste; and in particular, to an electronic paste mixing two kinds of metal powders with different melting points.

電子漿料是一種集冶金、化工、電子技術於一體的電子功能材料。除此之外，在航空、印刷、建築及軍事等工業領域也有廣泛的運用。電子漿料是一種由固體粉末和有機溶劑經過三輥軋製混合均勻的膏狀物。依照不用的用途，電子漿料可大致分為電阻漿料、介質漿料、絕緣漿料、包裝漿料以及導體漿料。在一般的製程中，先將混合均勻成膏狀的電子漿料塗佈在基板(如：陶瓷基板、聚合物基板或金屬絕緣基板等)上。經由所需的燒結溫度烘烤並形成一具功能性的厚膜材料。 Electronic paste is a kind of electronic functional material integrating metallurgy, chemical industry and electronic technology. In addition, it is also widely used in aviation, printing, construction and military industries. Electronic paste is a paste made of solid powder and organic solvent after three-roll rolling and mixing. According to different uses, electronic paste can be roughly divided into resistance paste, dielectric paste, insulating paste, packaging paste and conductor paste. In the general manufacturing process, the electronic paste mixed uniformly into a paste form is first coated on a substrate (such as a ceramic substrate, a polymer substrate or a metal insulating substrate, etc.). Bake through the required sintering temperature and form a functional thick film material.

由於電子漿料可經由有機溶劑或其他添加劑調整其流變性、分散性和黏性，因此電子漿料具有良好的粉末均勻分佈性，而且能滿足印刷和小孔填充等工藝要求。在習知技術中，如圖1所示，習知做為焊接用途之電子漿料3的組成是一種功能性粉末31(焊錫合金粉末)和助焊劑32經過三輥軋製混合均勻形成，在加溫烘烤的過程中，焊錫合金粉末31會熔解而焊接不同元件。然而習知技術並沒有以電子漿料形成親水性毛細結構之應用概念，因此，習知製作微熱導管(Micro Heat Pipe)及均溫板(Vapor Chamber)之毛細結構時需要使用加工溝槽(Groove)、燒結銅粉末(Sintered Powder)、塞入纖維(fiber)或金屬網(mesh)等方法，然而用這些方法來製作毛細結構，在元件厚度很薄(等於或小於0.4mm)且空腔高度及空間不足時，將導致該毛細結構之毛細力功能不足，而且製作困難等問題。 Since electronic paste can adjust its rheology, dispersion and viscosity through organic solvents or other additives, electronic paste has good powder uniformity distribution, and can meet the process requirements of printing and small hole filling. In the conventional technology, as shown in FIG. 1, the composition of the electronic paste 3 used for welding is a functional powder 31 (solder alloy powder) and flux 32 which are uniformly formed by three-roll rolling and mixing. During the heating and baking process, the solder alloy powder 31 will melt to weld different components. However, the conventional technology does not use electronic paste to form a hydrophilic capillary structure. Application concept, therefore, it is necessary to use processing grooves (Groove), sintered copper powder (Sintered Powder), and fiber (fiber) when making capillary structures of Micro Heat Pipe and Vapor Chamber. Or metal mesh (mesh) and other methods, but using these methods to make the capillary structure, when the thickness of the element is very thin (equal to or less than 0.4mm) and the cavity height and space are insufficient, it will result in insufficient capillary force function of the capillary structure. Moreover, the production is difficult.

以燒結銅粉末的微熱導管(Micro Heat Pipe)毛細結構的製造方式為例，是將一中心棒置入一銅質管體中心後，於銅質管體內部倒入銅粉末後進行長時間的高溫燒結。燒結完成後予以冷卻，再將中心棒從銅質管體中拔出，以形成銅質管體內部管壁上的多孔性毛細結構。而均温板(Vapor Chamber)毛細結構的製造方式是將銅質粉末舖設在一銅板上進行高温燒結處理，燒結完成後予以冷卻，以形成銅板表面上的毛細結構。由於銅粉末粒徑大小和分佈會影響孔隙率，並且要讓銅粉在部分熔解的狀況下燒結於銅質管體，又要避免孔隙率過低和銅質管體變形，實務上燒結的時間與溫度必須精準的控制。而且，將銅粉末舖設在銅質管或銅板上時，無法平均掌握銅粉末的平整度及密度，燒結後的毛細結構亦有可能分佈不均。再者，銅的熔點為攝氏1085度，進行高温燒結銅粉末時需要耗費大量熱能及電力。 Taking the sintered copper powder micro heat pipe (Micro Heat Pipe) capillary structure manufacturing method as an example, a center rod is placed in the center of a copper tube body, and the copper powder is poured into the copper tube body for a long time. High temperature sintering. After the sintering is completed, it is cooled, and then the central rod is pulled out of the copper tube body to form a porous capillary structure on the inner wall of the copper tube body. The capillary structure of the Vapor Chamber is manufactured by laying copper powder on a copper plate for high-temperature sintering and cooling after the sintering to form a capillary structure on the surface of the copper plate. Because the size and distribution of copper powder particle size will affect the porosity, and the copper powder should be sintered in the copper tube body in a partially melted state, and the porosity is too low and the copper tube body deformation should be avoided. In practice, the sintering time and The temperature must be accurately controlled. Moreover, when laying copper powder on a copper tube or a copper plate, the flatness and density of the copper powder cannot be grasped evenly, and the capillary structure after sintering may be unevenly distributed. Furthermore, the melting point of copper is 1085 degrees Celsius, and high-temperature sintering of copper powder requires a large amount of heat and electricity.

雖然習知微熱導管及均溫板的毛細結構有溝槽(Groove)、纖維(Fiber)、銅網(Mesh)以及燒結銅粉末(Sintered Powder)四種類型，其中以燒結銅粉末(Sintered Powder)毛細力最佳，亦不受重力影響，但在超薄的微熱導管(Micro Heat Pipe)及均溫板(Vapor Chamber)製作上，燒結銅粉末(Sintered Powder)的毛細結構很難製作，而鋪設纖維(Fiber)或銅網(Mesh)成為主流，然而要在只有不到0.2mm深的溝槽中鋪設纖維(Fiber)或銅網(Mesh)在量產上不易自動化，良率控制不易。 Although the capillary structures of conventional micro heat pipes and temperature equalizing plates have four types: Groove, Fiber, Mesh, and Sintered Powder, among which Sintered Powder The capillary force is the best, and it is not affected by gravity. However, in the manufacture of ultra-thin Micro Heat Pipes and Vapor Chambers, the capillary structure of sintered powder is difficult to fabricate and lay Fiber (Fiber) or copper mesh (Mesh) It is the mainstream, however, it is not easy to automate mass production and yield control is difficult to lay fiber (Fiber) or copper mesh (Mesh) in grooves less than 0.2mm deep.

有鑑於此，本發明提出了一種混合兩種不同熔點金屬粉末之電子漿料，可應用在扁平的微熱導管(Flatten Micro Heat Pipe)及均溫板(Vapor Chamber)的毛細結構之製作，除了能在狹小的空間內容易控制毛細結構厚度，也易於自動化大量生產。 In view of this, the present invention proposes an electronic paste that mixes two kinds of metal powders with different melting points, which can be applied to the production of capillary structures of flat micro heat pipes (Flatten Micro Heat Pipe) and temperature equalizing plates (Vapor Chamber). It is easy to control the thickness of the capillary structure in a narrow space, and it is also easy to automate mass production.

根據本發明之一具體實施例，混合兩種不同熔點金屬粉末之電子漿料包含一具有第一熔點之第一金屬合金粉末、一具有第二熔點之第二金屬粉末以及一助焊劑。助焊劑用以均勻混合第一金屬合金粉末與第二金屬粉末。其中，第一熔點之溫度低於第二熔點之溫度。在此具體實施例中，其中電子漿料係應用於製作扁平熱導管之毛細結構或均溫板之毛細結構。電子漿料以鋼版印刷、網版印刷或噴塗之方式塗佈在具有表面可焊性之一元件上，並且藉由快速加熱烘烤該電子漿料，在元件之表面形成多孔性毛細結構。 According to an embodiment of the present invention, the electronic paste mixing two different melting point metal powders includes a first metal alloy powder having a first melting point, a second metal powder having a second melting point, and a flux. The flux is used to uniformly mix the first metal alloy powder and the second metal powder. The temperature of the first melting point is lower than the temperature of the second melting point. In this specific embodiment, the electronic paste is used to make the capillary structure of the flat heat pipe or the capillary structure of the temperature equalizing plate. The electronic paste is coated on one element with surface solderability by stencil printing, screen printing or spraying, and by rapidly heating and baking the electronic paste, a porous capillary structure is formed on the surface of the element.

在一具體實施例中，其中第一金屬合金粉末為熔點溫度低於450℃之軟焊材料合金。在較佳的具體實施例中，第一金屬合金粉末為錫基合金之焊錫粉末。 In a specific embodiment, the first metal alloy powder is a solder material alloy with a melting point temperature lower than 450°C. In a preferred embodiment, the first metal alloy powder is a tin-based alloy solder powder.

在一具體實施例中，其中第二金屬粉末為銅粉末。 In a specific embodiment, the second metal powder is copper powder.

在另一具體實施例中，其中第二金屬粉末為一包鍍金屬粉末，包鍍金屬粉末是一種表面鍍有其他可焊性金屬材質之金屬粉末。 In another specific embodiment, the second metal powder is a package of metal-plated powder. The metal-plated powder is a metal powder coated with other solderable metal materials on the surface.

本發明中的助焊劑係由松香樹脂、表面活性劑、添加劑以及有機溶劑所組成。 The flux in the present invention consists of rosin resin, surfactant, and additives And organic solvents.

並且，第一金屬合金粉末及第二金屬粉末之顆粒大小分別呈現常態分佈。 Moreover, the particle sizes of the first metal alloy powder and the second metal powder respectively exhibit normal distribution.

綜上所述，本發明之混合兩種不同熔點金屬粉末之電子漿料藉由兩種不同熔點金屬粉末的加溫烘烤與冷卻以製作毛細結構，提升了製作流程彈性，增加量產效率，亦可解決需要耗費大量熱能及電力的問題，並且，是一種嶄新的電子漿料應用概念。 In summary, the electronic paste of the present invention that mixes two different melting point metal powders is heated and baked and cooled by two different melting point metal powders to make capillary structures, which improves the flexibility of the production process and increases the mass production efficiency. It can also solve the problem of consuming a lot of heat and electricity, and is a brand-new application concept of electronic paste.

1‧‧‧電子漿料 1‧‧‧Electronic paste

11‧‧‧第一金屬合金粉末 11‧‧‧ First metal alloy powder

12‧‧‧第二金屬粉末 12‧‧‧Second metal powder

13‧‧‧助焊劑 13‧‧‧flux

15‧‧‧毛細結構 15‧‧‧Capillary structure

20‧‧‧基板 20‧‧‧ substrate

201‧‧‧溝槽 201‧‧‧Groove

22‧‧‧包鍍金屬粉末 22‧‧‧Package of metal-plated powder

221‧‧‧外層金屬 221‧‧‧Outer metal

222‧‧‧內層金屬 222‧‧‧Inner metal

3‧‧‧習知電子漿料 3‧‧‧Knowledge electronic paste

31‧‧‧功能性粉末 31‧‧‧Functional powder

32‧‧‧助焊劑 32‧‧‧flux

50‧‧‧隔板 50‧‧‧Partition

60‧‧‧刮刀 60‧‧‧Scraper

圖1係繪示先前技術之電子漿料之組成示意圖。 FIG. 1 is a schematic diagram of the composition of the electronic paste in the prior art.

圖2係繪示根據本發明之一具體實施例之混合兩種不同熔點金屬粉末之電子漿料之組成示意圖。 FIG. 2 is a schematic diagram showing the composition of an electronic paste mixed with two different melting point metal powders according to an embodiment of the present invention.

圖3a至圖3c係繪示根據本發明之一具體實施例中電子漿料應用於形成毛細結構之步驟示意圖。 3a to 3c are schematic diagrams illustrating steps of applying electronic paste to forming a capillary structure according to an embodiment of the present invention.

圖4係繪示根據本發明之一具體實施例之包鍍金屬粉末之示意圖。 FIG. 4 is a schematic diagram of a metal-coated powder according to an embodiment of the invention.

圖5a至5c係繪示根據本發明之一具體實施例中電子漿料應用於形成毛細結構之步驟示意圖。 5a to 5c are schematic diagrams illustrating steps of applying electronic paste to forming a capillary structure according to an embodiment of the present invention.

為了讓本發明的優點，精神與特徵可以更容易且明確地了解，後續將以具體實施例並參照所附圖式進行詳述與討論。值得注意的是，這些具體實施例僅為本發明代表性的具體實施例，其中所舉例的特定方法、裝置、條件、材質等並非用以限定本發明或對應的具體實施例。又，圖中各裝置僅係用於表達其相對位置且未按其實際比例繪述，合先敘明。 In order to make the advantages, spirit and features of the present invention easier and clearer to understand, detailed descriptions and discussions will follow with specific embodiments and with reference to the accompanying drawings. It is worth noting that these specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. also, The devices in the figure are only used to express their relative positions and are not drawn according to their actual proportions.

請參考圖2及圖3a至3c。圖2係繪示根據本發明之一具體實施例之混合兩種不同熔點金屬粉末之電子漿料之組成示意圖。圖3a至圖3c係繪示根據本發明之一具體實施例中電子漿料應用於形成毛細結構之步驟示意圖。本具體實施例之一種混合兩種不同熔點金屬粉末之電子漿料1，其包含有具有第一熔點之第一金屬合金粉末11、具有第二熔點之第二金屬粉末12以及一助焊劑13。助焊劑13用以均勻混合第一金屬合金粉末11與第二金屬粉末12。其中，第一熔點之溫度低於第二熔點溫度。本發明之電子漿料1可應用於製作扁平微熱導管之毛細結構或均溫板之毛細結構，電子漿料1以噴塗、鋼版印刷或網版印刷之方式塗佈在具有表面可焊性之一元件上，並且藉由加熱電子漿料1，在元件之表面形成毛細結構。在本具體實施例中，元件可為扁平微熱導管或均溫板之結構或部份結構如：基板20，而基板20可以是扁平微熱導管或均溫板之內壁或是扁平的微熱導管中之內壁溝槽需形成毛細結構之平面或結構。 Please refer to Figure 2 and Figures 3a to 3c. FIG. 2 is a schematic diagram showing the composition of an electronic paste mixing two different melting point metal powders according to an embodiment of the present invention. 3a to 3c are schematic diagrams illustrating steps of applying electronic paste to forming a capillary structure according to an embodiment of the present invention. In this embodiment, an electronic paste 1 mixing two kinds of metal powders with different melting points includes a first metal alloy powder 11 having a first melting point, a second metal powder 12 having a second melting point, and a flux 13. The flux 13 is used to uniformly mix the first metal alloy powder 11 and the second metal powder 12. The temperature of the first melting point is lower than the temperature of the second melting point. The electronic paste 1 of the present invention can be applied to make the capillary structure of a flat micro-heat pipe or the capillary structure of a temperature equalizing plate. The electronic paste 1 is coated on the surface with solderability by spraying, stencil printing or screen printing. On an element, and by heating the electronic paste 1, a capillary structure is formed on the surface of the element. In this specific embodiment, the component may be a flat micro heat pipe or a temperature equalizing plate structure or part of the structure such as the substrate 20, and the substrate 20 may be an inner wall of the flat micro heat pipe or the temperature equalizing plate or a flat micro heat pipe The inner wall groove needs to form the plane or structure of the capillary structure.

在實際應用中，首先將第一金屬合金粉末11與第二金屬粉末12以及助焊劑13均勻混合成電子漿料1，接著利用鋼版印刷之方式將電子漿料1塗佈在扁平微熱導管或均溫板之基板20上。在此具體實施例中，首先，隔板50上設置有數個孔對應熱導管或均溫板之基板20中需形成毛細結構15之溝槽201，將隔板50放置在基板20上後，接著再用刮刀60以印刷的方式將電子漿料1塗佈在熱導管或均溫板之基板20，此時，電子漿料1會穿過隔板50上的孔塗佈至基板20之溝槽201內。塗佈完成後將含有電子漿料1的基板20進行加溫烘烤。首先於電子漿料內的助焊劑中的有機溶劑會先揮發掉，當基板20加熱到達並超過第一熔點之溫度時，第一金屬合金粉末11熔解成焊料，由於第二金屬粉末12之第二熔點溫度大於第一熔點之溫度，因此，第二金屬粉末12不會熔解。此時，焊料沾附在基板20以及第二金屬粉末12上。當焊料冷卻凝固時，複數個第二金屬粉末12之間互相焊接，同時第二金屬粉末12也被焊接在基板20上，進而形成多孔性的毛細結構15。 In practical applications, firstly, the first metal alloy powder 11 and the second metal powder 12 and the flux 13 are uniformly mixed to form the electronic paste 1, and then the electronic paste 1 is coated on the flat micro heat pipe or by means of stencil printing On the substrate 20 of the soaking plate. In this specific embodiment, first, the separator 50 is provided with several holes corresponding to the grooves 201 of the heat pipe or the temperature equalizing plate of the substrate 20 where the capillary structure 15 needs to be formed. After the separator 50 is placed on the substrate 20, then Then, the electronic paste 1 is applied to the substrate 20 of the heat pipe or the temperature equalization plate by a doctor blade 60 in a printing manner. At this time, the electronic paste 1 is applied to the groove of the substrate 20 through the hole in the separator 50 Within 201. After the coating is completed, the substrate 20 containing the electronic paste 1 is heated and baked. First, the organic solvent in the flux in the electronic paste will evaporate first When the substrate 20 is heated up to and exceeds the temperature of the first melting point, the first metal alloy powder 11 is melted into solder. Since the second melting temperature of the second metal powder 12 is greater than the temperature of the first melting point, the second metal powder 12 will not melt. At this time, the solder adheres to the substrate 20 and the second metal powder 12. When the solder cools and solidifies, a plurality of second metal powders 12 are welded to each other, and at the same time, the second metal powders 12 are also welded to the substrate 20, thereby forming a porous capillary structure 15.

在一具體實施例中，其中第一金屬合金粉末為熔點溫度低於450℃之軟焊材料合金。實際應用中，第一金屬合金粉末為錫基合金。在實際應用中，第一金屬合金粉末可為63/37比例的錫鉛合金，熔點為183℃；96.5/3/0.5比例的錫銀銅合金，熔點為218℃；96.5/3.5比例的錫銀合金，熔點為221℃；99.3/0.7比例的錫銅合金，熔點為227℃，或其他軟焊材料合金。在電子漿料的燒結過程中，僅需加熱到達並超過前述各錫基合金之焊錫材料熔點溫度，第一金屬合金粉末即可熔解成焊料，當焊料冷卻凝固時，複數個第二金屬粉末之間互相焊接，同時第二金屬粉末也被焊接在基板上，進而形成毛細結構。因此，不需耗費大量熱能及電力。 In a specific embodiment, the first metal alloy powder is a solder material alloy with a melting point temperature lower than 450°C. In practical applications, the first metal alloy powder is a tin-based alloy. In practical applications, the first metal alloy powder may be a tin-lead alloy with a 63/37 ratio and a melting point of 183°C; a tin-silver-copper alloy with a 96.5/3/0.5 ratio and a melting point of 218°C; a tin-silver with a ratio of 96.5/3.5 Alloy, melting point is 221 ℃; 99.3/0.7 ratio of tin-copper alloy, melting point is 227 ℃, or other solder alloy alloy. In the sintering process of electronic paste, the first metal alloy powder can be melted into solder by heating to reach and exceed the melting point temperature of the solder material of the aforementioned tin-based alloys. When the solder cools and solidifies, the plurality of second metal powders Are welded to each other, and the second metal powder is also welded to the substrate, thereby forming a capillary structure. Therefore, there is no need to consume a lot of heat and electricity.

在一具體實施例中，其中第二金屬粉末為銅粉末。在實際應用中，當包含電子漿料的基板加熱到達並超過第一熔點之溫度時，第一金屬合金粉末熔解成焊料，由於銅的熔點為1085℃，又銅粉末之熔點溫度大於第一熔點之溫度，因此，銅粉末不會熔解。此時，焊料沾附在基板以及銅粉末上。當焊料冷卻凝固時，銅粉末之間互相焊接，同時銅粉末也被焊接在基板上，進而形成毛細結構。 In a specific embodiment, the second metal powder is copper powder. In practical applications, when the substrate containing the electronic paste is heated up to and exceeds the temperature of the first melting point, the first metal alloy powder is melted into solder, because the melting point of copper is 1085°C, and the melting temperature of the copper powder is higher than the first melting point The temperature, therefore, the copper powder will not melt. At this time, the solder adheres to the substrate and the copper powder. When the solder cools and solidifies, the copper powder is soldered to each other, and the copper powder is also soldered to the substrate, thereby forming a capillary structure.

請參考圖4及圖5a至5c。圖4係繪示根據本發明之一具體實施例之包鍍金屬粉末之示意圖。圖5a至5c係繪示根據本發明之一具體實施例中電子漿料應用於形成毛細結構之步驟示意圖。在一具體實施例中，其中第二金屬粉末為包鍍金屬粉末22，包鍍金屬粉末22是一種表面鍍有其他可焊性金屬材質之金屬粉末。在實際應用中，包鍍金屬粉末22包含兩層結構，外層金屬221為可焊性金屬，內層金屬222為金屬粉末，其中，外層金屬221的第三熔點小於內層金屬222的第二熔點。在此具體實施例中，外層金屬221可為銀或鎳金屬，內層金屬222可為銅金屬。因此，當基板20加熱到達並超過第一熔點時，第一金屬合金粉末11熔解成焊料，又因內層金屬222之熔點係為前述之第二熔點，高於第一金屬合金粉末11之第一熔點以及包鍍金屬粉末22之外層金屬221之第三熔點，因此，內層金屬222不會熔解，而焊料可焊接外層金屬221並且將第二金屬粉末相互焊接並焊接於基板20上而形成多孔性之毛細結構15。 Please refer to Figure 4 and Figures 5a to 5c. FIG. 4 is a schematic diagram of a metal-coated powder according to an embodiment of the invention. 5a to 5c illustrate a specific embodiment according to the present invention The schematic diagram of the steps of applying the medium electronic paste to the formation of capillary structures. In a specific embodiment, the second metal powder is coated metal powder 22, and the coated metal powder 22 is a metal powder coated with other weldable metal material on the surface. In practical applications, the coated metal powder 22 includes a two-layer structure, the outer metal 221 is a weldable metal, and the inner metal 222 is a metal powder, wherein the third melting point of the outer metal 221 is less than the second melting point of the inner metal 222 . In this specific embodiment, the outer layer metal 221 may be silver or nickel metal, and the inner layer metal 222 may be copper metal. Therefore, when the substrate 20 heats up to and exceeds the first melting point, the first metal alloy powder 11 melts into solder, and the melting point of the inner metal 222 is the aforementioned second melting point, which is higher than the first melting point of the first metal alloy powder 11 A melting point and the third melting point of the outer metal 221 coated with the metal powder 22, therefore, the inner metal 222 will not melt, and the solder can weld the outer metal 221 and the second metal powder is welded to each other and the substrate 20 to form孔性的Capillary structure 15.

在一具體實施例中，助焊劑係由松香樹脂、表面活性劑、添加劑以及有機溶劑所組成。在實際應用中，松香樹脂係用來確保焊接過程順利進行的材料；表面活性劑係用來降低表面張力；添加劑係用來調整流動性、分散性、粘性等性能；有機溶劑係用來分散、包裹漿料中的粉末，並賦予漿料流動性。因此，藉由助焊劑可將電子漿料中的金屬及金屬合金粉末均勻的印刷在基板20上並進一步形成具多孔性之毛細結構。此外，藉由調整助焊劑及金屬粉末的成分比例不同還可以用來調整加熱後形成毛細結構的厚度，藉以調整熱導管內空腔的剩餘氣道空間。 In a specific embodiment, the flux is composed of rosin resin, surfactant, additives and organic solvent. In practical applications, rosin resin is used to ensure the smooth progress of the welding process; surfactants are used to reduce surface tension; additives are used to adjust the properties of fluidity, dispersibility, viscosity, etc.; organic solvents are used to disperse, Wrap the powder in the slurry and give the slurry fluidity. Therefore, the flux and the metal and metal alloy powder in the electronic paste can be uniformly printed on the substrate 20 and further form a porous capillary structure. In addition, by adjusting the composition ratio of the flux and the metal powder, it can also be used to adjust the thickness of the capillary structure after heating to adjust the remaining airway space of the cavity in the heat pipe.

在一具體實施例中，第一金屬合金粉末及第二金屬粉末之顆粒大小分別呈現常態分佈。在實際應用中，第一金屬合金粉末及第二金屬粉末之顆粒大小可介於1μm至100μm。在現有的工藝技術中，粉末之顆粒不易確保皆能維持在同一大小，本發明也不須相同大小之粉末顆粒。因此，在本發明的技術中，當第一金屬合金粉末及第二金屬粉末之顆粒大小分別呈現常態分佈時，即可利用本發明之技術形成不規則狀之多孔性毛細結構。在部分具體實施例中，第一金屬合金粉末及/或第二金屬粉末之顆粒大小可於1μm至30μm的範圍中呈現常態分布。 In a specific embodiment, the particle sizes of the first metal alloy powder and the second metal powder respectively exhibit a normal distribution. In practical applications, the particle size of the first metal alloy powder and the second metal powder may be between 1 μm and 100 μm. In the existing process technology, powder particles It is not easy to ensure that all can be maintained at the same size, and the present invention does not require powder particles of the same size. Therefore, in the technique of the present invention, when the particle sizes of the first metal alloy powder and the second metal powder respectively exhibit a normal distribution, the technique of the present invention can be used to form an irregular porous capillary structure. In some embodiments, the particle size of the first metal alloy powder and/or the second metal powder may have a normal distribution in the range of 1 μm to 30 μm.

綜上所述，本發明之混合兩種不同熔點金屬粉末之電子漿料藉由兩種不同熔點金屬粉末的加溫烘烤與冷卻以製作多孔性之毛細結構，提升了製作流程彈性，增加量產效率，亦可解決需要耗費大量熱能及電力的問題，並且，是一種嶄新的電子漿料應用概念。 In summary, the electronic paste of the present invention that mixes two different melting point metal powders is heated and baked and cooled by two different melting point metal powders to make a porous capillary structure, which improves the flexibility of the production process and increases the amount Production efficiency can also solve the problem of consuming a lot of heat and electricity, and is a brand-new application concept of electronic paste.

藉由以上較佳具體實施例之詳述，係希望能更加清楚描述本發明之特徵與精神，而並非以上述所揭露的較佳具體實施例來對本發明之範疇加以限制。相反地，其目的是希望能涵蓋各種改變及具相等性的安排於本發明所欲申請之專利範圍的範疇內。因此，本發明所申請之專利範圍的範疇應該根據上述的說明作最寬廣的解釋，以致使其涵蓋所有可能的改變以及具相等性的安排。 With the above detailed description of the preferred embodiments, it is hoped that the features and spirit of the present invention can be described more clearly, rather than limiting the scope of the present invention with the preferred embodiments disclosed above. On the contrary, the purpose is to cover various changes and equivalent arrangements within the scope of the patent application of the present invention. Therefore, the scope of the patent application scope of the present invention should be interpreted broadly based on the above description, so that it covers all possible changes and equivalent arrangements.

1‧‧‧電子漿料 1‧‧‧Electronic paste

11‧‧‧第一金屬合金粉末 11‧‧‧ First metal alloy powder

12‧‧‧第二金屬粉末 12‧‧‧Second metal powder

13‧‧‧助焊劑 13‧‧‧flux

Claims

一種混合兩種不同熔點金屬粉末之電子漿料(Paste)，其包含有：一具有第一熔點之第一金屬合金粉末(Metal Alloy Powder)；一具有第二熔點之第二金屬粉末(Metal Powder)；以及一助焊劑(Flux)，用以均勻混合該第一金屬合金粉末與該第二金屬粉末成為漿料狀；其中，該第一熔點之溫度低於該第二熔點之溫度。 An electronic paste (Paste) mixing two kinds of metal powders with different melting points includes: a first metal alloy powder (Metal Alloy Powder) having a first melting point; a second metal powder (Metal Powder) having a second melting point ); and a flux (Flux) for uniformly mixing the first metal alloy powder and the second metal powder into a slurry; wherein, the temperature of the first melting point is lower than the temperature of the second melting point.

根據申請專利範圍第1項所述之混合兩種不同熔點金屬粉末之電子漿料，其中該第一金屬合金粉末為熔點溫度低於450℃之一錫基合金(Tin Alloy)軟焊(Soldering)材料。 The electronic paste mixing two different melting point metal powders according to item 1 of the patent application scope, wherein the first metal alloy powder is a tin alloy soldering (Tin Alloy) soldering (Soldering) with a melting point temperature lower than 450°C material.

根據申請專利範圍第1項所述之混合兩種不同熔點金屬粉末之電子漿料，其中該第二金屬粉末為一銅粉末(Cu Powder)。 According to the electronic paste in which two different melting point metal powders are mixed as described in item 1 of the patent application scope, wherein the second metal powder is a Cu powder.

根據申請專利範圍第3項所述之混合兩種不同熔點金屬粉末之電子漿料，其中該第二金屬粉末為一包鍍金屬粉末(Coated Metal Powder)，該包鍍金屬粉末是一種表面鍍有其它可焊性金屬材質之金屬粉末。 According to item 3 of the patent application scope, an electronic paste mixing two different melting point metal powders, wherein the second metal powder is a package of coated metal powder (Coated Metal Powder), the packaged metal powder is a surface coated with Metal powder of other weldable metal materials.

根據申請專利範圍第1項所述之混合兩種不同熔點金屬粉末之電子漿料，其中該助焊劑係由一松香樹脂(Rosin Resin)、一表面活性劑(Surfactant)、一添加劑(Additive)以及一有機溶劑(Organic Solvent)所組成。 According to item 1 of the patent application scope, an electronic paste mixing two different melting point metal powders, wherein the flux is composed of a rosin resin (Rosin Resin), a surfactant (Surfactant), an additive (Additive) and An organic solvent (Organic Solvent).

根據申請專利範圍第5項所述之混合兩種不同熔點金屬粉末之電子漿料，其中該第一金屬合金粉末及該第二金屬粉末之顆粒大小分別呈現常態分佈。 According to the electronic paste in which two different melting point metal powders are mixed as described in item 5 of the patent application range, the particle sizes of the first metal alloy powder and the second metal powder respectively exhibit a normal distribution.

根據申請專利範圍第1項所述之混合兩種不同熔點金屬粉末之電子漿料，其中該第一金屬合金粉末及該第二金屬粉末之顆粒皆小於100um。 According to the electronic paste in which two different melting point metal powders are mixed as described in item 1 of the patent application range, the particles of the first metal alloy powder and the second metal powder are both less than 100um.

根據申請專利範圍第1項所述之混合兩種不同熔點金屬粉末之電子漿料，其中該電子漿料係應用於製作一扁平微熱導管(Flatten Heat Pipe)之一毛細結構。 According to item 1 of the patent application scope, an electronic paste mixing two kinds of metal powders with different melting points is used, wherein the electronic paste is used to make a capillary structure of a flat micro heat pipe.

根據申請專利範圍第1項所述之混合兩種不同熔點金屬粉末之電子漿料，其中該電子漿料係應用於製作一均溫板(Vapor Chamber)之一毛細結構。 According to item 1 of the patent application scope, an electronic paste mixing two kinds of metal powders with different melting points is used, wherein the electronic paste is used to make a capillary structure of a temperature equalizing plate (Vapor Chamber).

根據申請專利範圍第1項所述之混合兩種不同熔點金屬粉末之電子漿料，其中該電子漿料可用鋼板印刷(Stencil Printing)、網版印刷(Screen Printing)或噴塗(Spray Coating)之方式塗佈在具有表面可焊性之一元件上，並且藉由加熱該電子漿料，進而在該元件之表面形成具多孔性之一毛細結構。 According to the first paragraph of the patent application scope of mixing two different melting point metal powder electronic paste, wherein the electronic paste can be used for steel plate printing (Stencil Printing), screen printing (Screen Printing) or spraying (Spray Coating) It is coated on an element with surface solderability, and by heating the electronic paste, a capillary structure with porosity is formed on the surface of the element.