TW202010638A - 標籤貼紙 - Google Patents

標籤貼紙 Download PDF

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TW202010638A
TW202010638A TW107131807A TW107131807A TW202010638A TW 202010638 A TW202010638 A TW 202010638A TW 107131807 A TW107131807 A TW 107131807A TW 107131807 A TW107131807 A TW 107131807A TW 202010638 A TW202010638 A TW 202010638A
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Taiwan
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layer
material layer
surface material
label
label sticker
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TW107131807A
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English (en)
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TWI673164B (zh
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王蔡金枝
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王蔡金枝
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Priority to TW107131807A priority Critical patent/TWI673164B/zh
Priority to JP2018188028A priority patent/JP2020042248A/ja
Priority to CN201910641908.3A priority patent/CN110885643A/zh
Priority to EP19189038.3A priority patent/EP3623147A1/en
Priority to US16/525,638 priority patent/US20200079978A1/en
Priority to AU2019210510A priority patent/AU2019210510A1/en
Priority to CA3050879A priority patent/CA3050879A1/en
Priority to MYPI2019004382A priority patent/MY202194A/en
Priority to KR1020190096256A priority patent/KR20200030445A/ko
Application granted granted Critical
Publication of TWI673164B publication Critical patent/TWI673164B/zh
Publication of TW202010638A publication Critical patent/TW202010638A/zh
Priority to US17/474,124 priority patent/US11915621B2/en
Priority to JP2023126090A priority patent/JP2023133502A/ja

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
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Abstract

本發明係提供一種標籤貼紙，該標籤貼紙其包含一底層；一離型層，塗佈於該底層的上表面；一第一面材層，其下表面塗佈有一高黏性膠層，且該第一面材層的下表面透過該高黏性膠層貼附於該離型層上；及一第二面材層，其下表面塗佈有一低黏性膠層，且該第二面材層的下表面透過該低黏性膠層貼附於該第一面材層的上表面，該第二面材層的形狀與該第一面材層的形狀相對應，該第二面材層的面積大小與該第一面材層的面積大小相同。藉由如上所述之標籤貼紙，可以避免加工過程殘留的膠絲干擾標籤貼紙的使用。

Description

標籤貼紙
本發明係關於一種標籤貼紙，尤其是關於一種可以避免加工過程殘留的膠絲干擾標籤貼紙的使用之標籤貼紙。
習知的一般貼紙通常不採用高黏性膠，以避免一般貼紙的膠面黏性過強，而使得在貼紙的加工製造過程中，於加工機器設備表面上殘留膠絲，並且也可避免習知的一般貼紙從所貼附的物品上撕下後會產生殘留膠絲。習知的標籤貼紙為了使標籤貼紙可以黏貼於較難附著的物體上，例如，表面上沾有油、水、灰塵等介質的物體或是低溫物品，故須採用高黏性膠。然而，在習知標籤貼紙加工過程中，由於習知標籤貼紙其上所塗佈的黏膠具有高黏性，當以刀模對連續貼紙材料進行切割加工時，刀模的刀刃也會同時沾黏到連續貼紙材料上的高黏性膠，在刀模的刀刃裁切連續貼紙材料完畢離開連續貼紙材料後，便會同時拉起其所沾黏的高黏性膠，如圖1所示，進而在裁切後的標籤貼紙成品2的表面邊緣殘留膠絲21，除此之外，在將裁切後的標籤貼紙成品與加工後產生的連續廢料拉開分離時，標籤貼紙成品上的高黏性膠也會被同時拉起，在標籤貼紙成品的表面邊緣殘留膠絲。
標籤貼紙成品的表面邊緣所殘留的膠絲容易沾黏到灰塵或是其他髒汙物質，而使標籤貼紙成品的表面邊緣變得髒汙，影響標籤貼紙的美觀。同時，在捲捆標籤貼紙成品或是在標籤貼紙成品的表面上進行油墨印刷時，捲捆標籤貼紙成品或是對標籤貼紙成品進行印刷的機器設備，很容易會因為沾黏到標籤貼紙成品表面上的膠絲而干擾機器設備運作或是造成列印品質不良，甚至使機器設備停擺故障。此外，當標籤貼紙作為電器絕緣片來使用時，標籤貼紙表面上的膠絲也可能會沾黏到其他元件。因此，如何避免加工過程殘留的膠絲干擾標籤貼紙的使用，仍為一項有待解決之問題。
本發明之目的即針對上述問題，提供一種標籤貼紙，其包含一底層；一離型層，塗佈於該底層的上表面；一第一面材層，其下表面塗佈或黏貼有一高黏性膠層，且該第一面材層的下表面透過該高黏性膠層貼附於該離型層上；及一第二面材層，其下表面塗佈有一低黏性膠層，且該第二面材層的下表面透過該低黏性膠層貼附於該第一面材層的上表面，該第二面材層的形狀與該第一面材層的形狀相對應，該第二面材層的面積大小與該第一面材層的面積大小相同。
如上所述之標籤貼紙，該第二面材層的厚度為0.01 mm~0.1 mm。
如上所述之標籤貼紙，該低黏性膠層的厚度為0.01 mm~0.1 mm。
如上所述之標籤貼紙，該第二面材層的材料係選自銅版紙、特多龍及聚丙烯合成紙所組成之群組。
如上所述之標籤貼紙，該高黏性膠層的材料係選自油性壓克力膠、水性壓克力膠及熱熔膠所組成之群組。
如上所述之標籤貼紙，該低黏性膠層的材料係選自油性壓克力膠、水性壓克力膠、橡膠、熱熔膠及矽膠所組成之群組。
如上所述之標籤貼紙，該第二面材層的厚度為0.05 mm。
如上所述之標籤貼紙，該低黏性膠層的厚度為0.03 mm。
藉由如上所述之標籤貼紙，可以避免加工過程殘留的膠絲干擾標籤貼紙的使用。
為充分瞭解本發明之目的、特徵及功效，茲藉由下述具體之實施例，並配合所附之圖式，對本發明做一詳細說明，說明如後：
本發明之實施例提供一標籤貼紙1，參照圖2，該標籤貼紙1的製作過程包含下列流程。
先提供一連續底層11a，將一連續離型層12a塗佈於該連續底層11a的上表面，接著提供一連續第一面材層14a，將高黏性膠13a塗佈於該連續第一面材層14a的下表面，將該連續第一面材層14a的下表面貼附於該連續離型層12a上，使該連續底層11a、該連續離型層12a、該高黏性膠13a及該連續第一面材層14a形成一連續貼紙片材10，然後以一刀模（圖中未示）對該連續貼紙片材10進行加工裁切，接著從經裁切的連續貼紙片材10上拉起連續廢料（圖中未示），便製成複數個貼紙結構100。該等貼紙結構100如同習知的標籤貼紙，可能會因為前述之加工裁切過程，使得該刀模的刀刃沾黏到該高黏性膠13a，並且在該刀模對該連續貼紙片材10進行裁切完畢後離開該連續貼紙片材10時，該刀模同時拉起所沾黏到的該高黏性膠13a的膠絲，並將膠絲殘留在該等貼紙結構100的第一面材層14的上表面邊緣。
本實施例為避免殘留在該等貼紙結構100的第一面材層14的上表面邊緣的膠絲干擾標籤貼紙的使用，因此該等貼紙結構100的第一面材層14的上表面上各再覆蓋一第二面材層16，使得殘留在該等貼紙結構100的第一面材層14的上表面邊緣的膠絲被該等第二面材層16覆蓋住，藉此避免殘留在該等貼紙結構100的第一面材層14的上表面邊緣的膠絲干擾最終的標籤貼紙1成品的使用。將各該第二面材層16覆蓋於各該貼紙結構100的第一面材層14的上表面的過程敘述如下。
先將低黏性膠塗佈於各該貼紙結構100的第二面材層16的下表面形成一低黏性膠層15，接著將各該第二面材層16的下表面貼附於各該貼紙結構100的第一面材層14的上表面，各該第二面材層16的形狀與各該貼紙結構100的形狀相對應，各該第二面材層16的面積大小係與各該貼紙結構100的面積大小相同，如此一來，即可製成本實施例之標籤貼紙1。該標籤貼紙1後續可再經由進一步的印刷製程或列印製程，例如將油墨印刷於該標籤貼紙1最上層的第二面材層16上，或是將碳帶(ribbon)或碳粉列印於該標籤貼紙1最上層的第二面材層16上，使該標籤貼紙1可做為識別標籤、廣告標籤或絕緣標籤之用，但該標籤貼紙1亦可視需求來進行其他的加工製程，而不以本實施例為限。
參見圖3，該標籤貼紙1包含一底層11、一離型層12、一高黏性膠層13、一第一面材層14、一低黏性膠層15及一第二面材層16。該離型層12塗佈於該底層11的上表面。該第一面材層14的下表面塗佈該高黏性膠層13，該第一面材層14的下表面透過該高黏性膠層13貼附於該離型層12上。該第二面材層16的下表面塗佈有該低黏性膠層15，且該第二面材層16的下表面透過該低黏性膠層15貼附該第一面材層14的上表面，該第二面材層16的形狀與該第一面材層14的形狀相對應，且該第二面材層16的面積大小與該第一面材層14的面積大小相同，讓該第二面材層16覆蓋到該第一面材層14的上表面邊緣。
在此所提到的該第二面材層16與該第一面材層14的「面積大小相同」，是指「實質面積大小相同」，亦即，該第二面材層16的面積大小因為公差或是製作需求而略為大於該第一面材層14的面積大小，而使該第二面材層16的表面邊緣在肉眼觀察下不顯著地超出該第一面材層14的表面邊緣邊界，在上述情況下，該第二面材層16與該第一面材層14的尺寸仍為「面積大小相同」。
由於在該標籤貼紙1加工製作過程中，高黏性膠的膠絲會沾黏到該第一面材層14的上表面邊緣，透過該第二面材層16覆蓋於該第一面材層14上，使得沾黏於該第一面材層14的上表面邊緣的膠絲也被該第二面材層16覆蓋住，藉此，該標籤貼紙1便可以避免加工過程殘留的膠絲干擾該標籤貼紙1後續的使用，例如，黏貼於物體上呈現識別標誌或是在該標籤貼紙1表面上進行印刷加工。
在本實施例中，該第二面材層16的厚度為0.05 mm，但在其他實施例中，該第二面材層的厚度可為0.01 mm~0.1 mm，或是依據不同需求而使該第二面材層16具有其他的厚度，不以本實施例為限。同時，該第一面材層14亦可與該第二面材層16具有相同的厚度，或是依據不同需求而使該第一面材層14具有其他的厚度。
在本實施例中，該低黏性膠層15的厚度為0.03 mm，但在其他實施例中，該低黏性膠層15的厚度可為0.01 mm~0.1 mm，或是依據不同需求而使該低黏性膠層15具有其他的厚度，不以本實施例為限。同時，該高黏性膠層13亦可與該低黏性膠層15具有相同的厚度，或是依據不同需求而使該高黏性膠層13具有其他的厚度。
在本實施例中，該底層11的材料為格拉辛紙(Glassine)，但在其他實施例中，該底層11的材料可視需求選自由現有已知的可與該離型層12結合的材料，不以本實施例為限。在本實施例中，該離型層12的材料為矽氧樹脂(silicone)。此外，在其他實施例中，該底層11及該離型層12可以替換為聚乙烯淋膜離型紙。
該第一面材層14與該第二面材層16的材料同為特多龍(Tetoron，即聚酯纖維)，但在其他實施例中，該第一面材層14與該第二面材層16的材料可分別選自由銅版紙、特多龍及聚丙烯合成紙所組成之群組，或是選用現有已知可用於承載黏膠的材料，不以本實施例為限。
在本實施例中，高黏性膠可指黏度大於2 Pa.s的膠體或是可牢固地附著於較難附著的物體上的膠體，在本實施例中，高黏性膠亦可指其黏度相對於該低黏性膠層來得高的膠體。該高黏性膠層13的材料為油性壓克力膠，但在其他實施例中，該高黏性膠層13的材料可選用水性壓克力膠、熱熔膠、矽膠或是選用其他現有已知可用於高黏性膠的材料，而不以本實施例為限。此外，在本實施例中，係透過在該第一面材層14的下表面塗佈形成該高黏性膠層13的膠體而使該高黏性膠層13附著於該第一面材層14的下表面，但在其他實施例中，該高黏性膠層13可以為一膠膜（該膠膜係由聚乙烯對苯二甲酸酯基材或是棉基材所負載），透過將膠膜型態的該高黏性膠層13黏貼於該第一面材層14的下表面而使該高黏性膠層13附著於該第一面材層14的下表面。
在本實施例中，低黏性膠可指黏度小於2 Pa.s的膠體或是較容易從所附著的物體上移除的膠體，在本實施例中，低黏性膠亦可指其黏度相對於該高黏性膠層來得低的膠體。該低黏性膠層15的材料為水性壓克力膠，但在其他實施例中，該低黏性膠層15的材料可選用油性壓克力膠、矽膠、橡膠、熱熔膠或是選用其他現有已知可用於低黏性膠的材料，而不以本實施例為限。
如上所述之標籤貼紙，透過該第二面材層覆蓋於該第一面材層上，使得沾黏於該第一面材層的上表面邊緣的膠絲也被該第二面材層覆蓋住，藉此，該標籤貼紙便可以避免加工過程殘留的膠絲干擾該標籤貼紙後續的使用。
本發明在上文中已以較佳實施例揭露，然熟習本項技術者應理解的是，該實施例僅用於描繪本發明，而不應解讀為限制本發明之範圍。應注意的是，舉凡與該實施例等效之變化與置換，均應設為涵蓋於本發明之範疇內。因此，本發明之保護範圍當以申請專利範圍所界定者為準。
1:標籤貼紙10:連續貼紙片材100:貼紙結構11:底層11a:連續底層12:離型層12a:連續離型層13:高黏性膠層13a:高黏性膠14:第一面材層14a:連續第一面材層15:低黏性膠層16:第二面材層2:標籤貼紙成品21:膠絲
圖1係為習知標籤貼紙上殘留膠絲的示意圖。 圖2係為本發明實施例之標籤貼紙的製作流程示意圖。 圖3係為本發明實施例之標籤貼紙的剖面示意圖。
無
1:標籤貼紙
11:底層
12:離型層
13:高黏性膠層
14:第一面材層
15:低黏性膠層
16:第二面材層

Claims (8)

  1. 一種標籤貼紙，包含： 一底層； 一離型層，塗佈於該底層的上表面； 一第一面材層，其下表面塗佈或黏貼有一高黏性膠層，且該第一面材層的下表面透過該高黏性膠層貼附於該離型層上；及 一第二面材層，其下表面塗佈有一低黏性膠層，且該第二面材層的下表面透過該低黏性膠層黏合貼附於該第一面材層的上表面，該第二面材層的形狀與該第一面材層的形狀相對應，該第二面材層的面積大小與該第一面材層的面積大小相同。
  2. 如請求項1所述之標籤貼紙，其中該第二面材層的厚度為0.01 mm~0.1 mm。
  3. 如請求項1所述之標籤貼紙，其中該低黏性膠層的厚度為0.01 mm~0.1 mm。
  4. 如請求項1所述之標籤貼紙，其中該第二面材層的材料係選自銅版紙、特多龍及聚丙烯合成紙所組成之群組。
  5. 如請求項1所述之標籤貼紙，其中該高黏性膠層的材料係選自油性壓克力膠、水性壓克力膠及熱熔膠所組成之群組。
  6. 如請求項1所述之標籤貼紙，其中該低黏性膠層的材料係選自油性壓克力膠、水性壓克力膠、橡膠、熱熔膠及矽膠所組成之群組。
  7. 如請求項2所述之標籤貼紙，其中該第二面材層的厚度為0.05 mm。
  8. 如請求項3所述之標籤貼紙，其中該低黏性膠層的厚度為0.03 mm。
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