TW202006370A

TW202006370A - High frequency probe card device

Info

Publication number: TW202006370A
Application number: TW107124284A
Authority: TW
Inventors: 李文聰; 謝開傑
Original assignee: 中華精測科技股份有限公司
Priority date: 2018-07-13
Filing date: 2018-07-13
Publication date: 2020-02-01
Also published as: TWI666454B

Abstract

The present disclosure provides a high frequency probe card device, a depressing module thereof, and a supporting member thereof. The supporting member includes a positioning structure and a movable structure movably cooperated with the positioning structure. The movable structure is configured to entirely move relative to the positioning structure. The movable structure includes a frame and a plurality of elastic conductors. The frame has a plurality of positioning holes penetrating there-through. The frame is movably disposed on the positioning structure, and a surface of the frame arranged away from the positioning structure is defined as a carrying surface. The elastic conductors are respectively positioned in the positioning holes. Each of the elastic conductors has a first end corresponding in position to the carrying surface and an opposite second end passing through the frame.

Description

高頻探針卡裝置及其壓接模組與支撐件 High-frequency probe card device and its crimping module and support

本發明涉及一種高頻探針卡，尤其涉及一種高頻探針卡裝置及其壓接模組與支撐件。 The invention relates to a high-frequency probe card, in particular to a high-frequency probe card device and its crimping module and support.

現有的高頻探針卡包含一柱塞(Plunger)、局部設置於上述柱塞端面的一軟性電路板、及固定於上述軟性電路板的多個偵測凸塊。其中，所述每個偵測凸塊皆不具有彈性，上述偵測凸塊是用來抵接並電性耦接於一待測物，並且通過上述軟性電路板傳輸相對應的信號。 The existing high-frequency probe card includes a plunger, a flexible circuit board partially disposed on the end surface of the plunger, and a plurality of detection bumps fixed on the flexible circuit board. Wherein, each of the detection bumps has no elasticity. The detection bumps are used to abut and electrically couple to an object to be tested, and transmit corresponding signals through the flexible circuit board.

然而，由於所述柱塞為單件式構造，所以當現有探針卡的多個偵測凸塊在頂抵於待測物時，上述柱塞容易受力而有偏斜的情況產生，使得上述多個偵測凸塊產生不同的位移行程，進而影響當現有探針卡的偵測結果。 However, since the plunger is a single-piece structure, when the multiple detection bumps of the existing probe card are pressed against the object to be measured, the plunger may easily be biased due to force, resulting in The above multiple detection bumps generate different displacement strokes, which in turn affects the detection results of the existing probe card.

於是，本發明人認為上述缺陷可改善，乃特潛心研究並配合科學原理的運用，終於提出一種設計合理且有效改善上述缺陷的本發明。 Therefore, the inventor believes that the above-mentioned defects can be improved, and Naite devotes himself to research and cooperates with the application of scientific principles, and finally proposes a reasonable design and effectively improves the above-mentioned defects of the present invention.

本發明實施例在於提供一種高頻探針卡裝置及其壓接模組與支撐件，能有效地改善現有高頻探針卡所可能產生的缺陷。 An embodiment of the present invention is to provide a high-frequency probe card device and a crimping module and a support member, which can effectively improve the defects that may be generated by the existing high-frequency probe card.

本發明實施例公開一種高頻探針卡裝置，包括：一支撐件，包含；一定位結構，用來設置於一承載件；一行程結構，可移動地配置於所述定位結構，並且所述行程結構包含有：一支架，內部形成有貫穿狀的多個定位槽孔，並且所述支架可移動地配置於所述定位結構，而遠離所述定位結構的所述支架表面定義為一承載面；及多個導電彈性件，分別設置於多個所述定位槽孔，並且每個所述導電彈性件具有位於相反側的一第一端與一第二端；其中，每個所述導電彈性件的所述第一端對應於所述承載面，而每個所述導電彈性件的所述第二端穿出所述支架並用來抵接於所述承載件；一傳輸層，至少局部設置於所述承載面上、並抵接於每個所述導電彈性件的所述第一端；多個偵測凸塊，設置於所述傳輸層上，並且多個所述偵測凸塊與所述支撐件分別位於所述傳輸層的相反兩側；以及一電路板，電性連接於多個所述偵測凸塊的其中一個所述偵測凸塊，並且所述電路板包含有位於相反兩側的一第一板面與一第二板面，而所述電路板的所述第二板面用來電性耦接於一測試機台；其中，所述行程結構能以整體相對於所述定位結構移動，以使多個所述偵測凸塊的位移行程大致相同。 An embodiment of the present invention discloses a high-frequency probe card device, including: a support member, including; a positioning structure for setting on a carrier; a stroke structure, which is movably arranged in the positioning structure, and the The stroke structure includes: a bracket, a plurality of through-shaped positioning slots formed therein, and the bracket is movably arranged in the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface ; And a plurality of conductive elastic members, respectively provided in the plurality of positioning slots, and each of the conductive elastic members has a first end and a second end located on opposite sides; wherein, each of the conductive elastic The first end of the member corresponds to the bearing surface, and the second end of each conductive elastic member passes through the bracket and is used to abut the bearing member; a transmission layer is at least partially disposed On the carrying surface and abutting the first end of each conductive elastic member; a plurality of detection bumps are provided on the transmission layer, and a plurality of the detection bumps and The support members are located on opposite sides of the transmission layer; and a circuit board electrically connected to one of the detection bumps of the plurality of detection bumps, and the circuit board includes A first board surface and a second board surface on opposite sides, and the second board surface of the circuit board is used to electrically couple to a testing machine; wherein, the stroke structure can be relatively The positioning structure moves so that the displacement strokes of the plurality of detection bumps are substantially the same.

本發明實施例也公開一種高頻探針卡裝置的壓接模組，包括：一支撐件，包含；一定位結構；一行程結構，可移動地配置於所述定位結構，並且所述行程結構包含有：一支架，內部形成有貫穿狀的多個定位槽孔，並且所述支架可移動地配置於所述定位結構，而遠離所述定位結構的所述支架表面定義為一承載面；及多個導電彈性件，分別設置於多個所述定位槽孔，並且每個所述導電彈性件具有位於相反側的一第一端與一第二端；其中，每個所述導電彈性件的所述第一端對應於所述承載面，而每個所述導電彈性件的所述第二端穿出所述支架；一傳輸層，至少局部設置於所述承載面上、並抵接於每個所述導電彈性件的所述第一端；以及多個偵測凸塊，設置於所述傳輸層上，並且多個所述偵測凸塊與所述支撐件分別位於所述傳輸層的相反兩側；其中，所述行程結構能以整體相對於所述定位結構移動，以使多個所述偵測凸塊的位移行程大致相同。 An embodiment of the present invention also discloses a crimping module for a high-frequency probe card device, which includes: a support, including; a positioning structure; a stroke structure, which is movably arranged in the positioning structure, and the stroke structure It includes: a bracket with a plurality of penetrating positioning slots formed therein, and the bracket is movably arranged in the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface; and A plurality of conductive elastic members are respectively disposed in the plurality of positioning slots, and each of the conductive elastic members has a first end and a second end on opposite sides; wherein, each of the conductive elastic members The first end corresponds to the bearing surface, and the second end of each conductive elastic member passes through the bracket; a transmission layer is at least partially disposed on the bearing surface and abuts on The first end of each conductive elastic member; and a plurality of detection bumps, which are disposed on the transmission layer, and the plurality of detection bumps and the support member are respectively located on the transmission layer Opposite sides; wherein, the stroke structure can move relative to the positioning structure as a whole, so that the displacement strokes of the plurality of detection bumps are substantially the same.

本發明實施例另公開一種高頻探針卡裝置的支撐件，包括：一定位結構；以及一行程結構，可移動地配置於所述定位結構，並且所述行程結構能以整體相對於所述定位結構移動，所述行程結構包含有：一支架，內部形成有貫穿狀的多個定位槽孔，並且所述支架可移動地配置於所述定位結構，而遠離所述定位結構的所述支架表面定義為一承載面；以及多個導電彈性件，分別設置於多個所述定位槽孔，並且每個所述導電彈性件具有位於相反側的一第一端與一第二端；其中，每個所述導電彈性件的所述第一端對應於所述承載面，而每個所述導電彈性件的所述第二端穿出所述支架。 An embodiment of the present invention further discloses a support member of a high-frequency probe card device, which includes: a positioning structure; and a stroke structure, which is movably arranged in the positioning structure, and the stroke structure can be relatively integral to the The positioning structure moves. The stroke structure includes: a bracket with a plurality of through slots formed in the interior, and the bracket is movably arranged in the positioning structure and away from the bracket of the positioning structure The surface is defined as a bearing surface; and a plurality of conductive elastic members are respectively disposed in the plurality of positioning slots, and each of the conductive elastic members has a first end and a second end on opposite sides; wherein, The first end of each conductive elastic member corresponds to the bearing surface, and the second end of each conductive elastic member passes through the bracket.

綜上所述，本發明實施例所公開的高頻探針卡裝置及其壓接模組與支撐件，通過設有相互配合的定位結構與行程結構，據以使所述行程結構可整體相對於上述定位結構移動，而令位於支撐件上方的多個偵測凸塊的位移行程大致相同，使得所述高頻探針卡裝置能有較為精準的偵測結果。 In summary, the high-frequency probe card device, the crimping module and the supporting member disclosed in the embodiments of the present invention are provided with mutually matching positioning structure and stroke structure, so that the stroke structure can be opposite to the whole The above positioning structure moves, so that the displacement strokes of the plurality of detection bumps located above the support member are approximately the same, so that the high-frequency probe card device can have a more accurate detection result.

為能更進一步瞭解本發明的特徵及技術內容，請參閱以下有關本發明的詳細說明與附圖，但是此等說明與附圖僅用來說明本發明，而非對本發明的保護範圍作任何的限制。 In order to understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, not to make any protection to the scope of the present invention. limit.

100‧‧‧高頻探針卡裝置 100‧‧‧High frequency probe card device

1‧‧‧支撐件 1‧‧‧Support

11‧‧‧連接板 11‧‧‧Connecting board

111‧‧‧導電線路 111‧‧‧Conducting circuit

112‧‧‧金屬墊 112‧‧‧Metal pad

113‧‧‧金屬接點 113‧‧‧Metal contact

12‧‧‧定位結構 12‧‧‧Positioning structure

121‧‧‧導引銷 121‧‧‧Guide pins

13‧‧‧行程結構 13‧‧‧Stroke structure

131‧‧‧支架 131‧‧‧Bracket

1311‧‧‧承載面 1311‧‧‧ bearing surface

1312‧‧‧軌道槽 1312‧‧‧Track groove

1313‧‧‧定位槽孔 1313‧‧‧Locating slot

132‧‧‧導電彈性件 132‧‧‧ conductive elastic

1321‧‧‧第一端 1321‧‧‧The first end

1322‧‧‧第二端 1322‧‧‧The second end

2‧‧‧傳輸層 2‧‧‧Transport layer

2a‧‧‧第一區塊 2a‧‧‧The first block

2b‧‧‧第二區塊 2b‧‧‧ Block 2

2c‧‧‧連接區塊 2c‧‧‧Connect block

21c‧‧‧穿孔 21c‧‧‧Perforation

2d‧‧‧電路匹配單元 2d‧‧‧ circuit matching unit

21‧‧‧底層 21‧‧‧Bottom

22‧‧‧頂層 22‧‧‧Top

221‧‧‧接點 221‧‧‧Contact

23‧‧‧傳輸線 23‧‧‧ Transmission line

3、3’、3”‧‧‧偵測凸塊 3. 3’, 3”‧‧‧‧ bump detection

4‧‧‧電路板 4‧‧‧ circuit board

41‧‧‧第一板面 41‧‧‧ First board

411‧‧‧金屬墊 411‧‧‧Metal pad

42‧‧‧第二板面 42‧‧‧Second board

421‧‧‧機台接點 421‧‧‧ machine contact

422‧‧‧傳輸接點 422‧‧‧Transmission contact

43‧‧‧容置孔 43‧‧‧Accommodation hole

44‧‧‧連接孔 44‧‧‧Connecting hole

45‧‧‧增層結構 45‧‧‧Layered structure

5‧‧‧同軸纜線 5‧‧‧Coaxial cable

5a‧‧‧芯線 5a‧‧‧core wire

5b‧‧‧網狀屏蔽層 5b‧‧‧mesh shield

51‧‧‧穿設段 51‧‧‧ Piercing section

52‧‧‧埋置末段 52‧‧‧The last stage of embedding

53‧‧‧外接末段 53‧‧‧External

H‧‧‧高度方向 H‧‧‧ Height direction

圖1為本發明實施例一的高頻探針卡裝置的平面示意圖。 FIG. 1 is a schematic plan view of a high-frequency probe card device according to Embodiment 1 of the present invention.

圖2為本發明實施例二的高頻探針卡裝置的平面示意圖。 2 is a schematic plan view of a high-frequency probe card device according to Embodiment 2 of the present invention.

圖3為本發明實施例三的高頻探針卡裝置的平面示意圖。 3 is a schematic plan view of a high-frequency probe card device according to Embodiment 3 of the present invention.

圖4為本發明實施例四的高頻探針卡裝置的平面示意圖。 4 is a schematic plan view of a high-frequency probe card device according to Embodiment 4 of the present invention.

圖5為本發明實施例五的高頻探針卡裝置的平面示意圖。 5 is a schematic plan view of a high-frequency probe card device according to Embodiment 5 of the present invention.

請參閱圖1，其為本發明的實施例，需先說明的是，本實施例對應附圖所提及的相關數量與外型，僅用來具體地說明本發明的實施方式，以便於了解本發明的內容，而非用來侷限本發明的保護範圍。 Please refer to FIG. 1, which is an embodiment of the present invention. It should be noted that this embodiment corresponds to the relevant quantities and appearances mentioned in the drawings, and is only used to specifically illustrate the embodiments of the present invention, in order to facilitate understanding The content of the present invention is not intended to limit the protection scope of the present invention.

[實施例一] [Example 1]

如圖1所示，其為本發明的實施例一。本實施例公開一種高頻探針卡裝置100，其能用來測試一待測物(圖未示，如：半導體晶圓)。需先說明的是，為便於理解本實施例，圖式是以上述高頻探針卡裝置100的局部平面示意圖來說明。 As shown in FIG. 1, it is Embodiment 1 of the present invention. This embodiment discloses a high-frequency probe card device 100, which can be used to test an object to be tested (not shown in the figure, such as a semiconductor wafer). It should be noted that, in order to facilitate understanding of this embodiment, the drawing is illustrated by a partial schematic plan view of the high-frequency probe card device 100 described above.

所述高頻探針卡裝置100包含有一支撐件1、配置於所述支撐件1上的一傳輸層2、設置於所述傳輸層2的多個偵測凸塊3、位置對應於所述支撐件1的一電路板4、及配置於所述傳輸層2與電路板4的一同軸纜線5。以下將分別介紹所述高頻探針卡裝置100的各個元件構造，並適時說明所述高頻探針卡裝置100的各個元件彼此之間的連接關係。 The high-frequency probe card device 100 includes a support member 1, a transmission layer 2 disposed on the support member 1, a plurality of detection bumps 3 disposed on the transmission layer 2, and a position corresponding to the A circuit board 4 of the support 1 and a coaxial cable 5 disposed on the transmission layer 2 and the circuit board 4. Hereinafter, the structure of each element of the high-frequency probe card device 100 will be introduced, and the connection relationship between each element of the high-frequency probe card device 100 will be described in time.

需先說明的是，上述傳輸層2、多個偵測凸塊3、電路板4、及同軸纜線5於本實施例中也可以共同被定義為一信號傳輸模組，並且本實施例雖是以所述信號傳輸模組搭配於該支撐件1來說明，但本發明不受限於此。舉例來說，在本發明未繪示的其他實施例中，所述信號傳輸模組也可以是單獨地被運用(如：販賣)或搭配其他構件使用。 It should be noted that the transmission layer 2, the plurality of detection bumps 3, the circuit board 4, and the coaxial cable 5 can also be collectively defined as a signal transmission module in this embodiment. The signal transmission module is matched with the supporting member 1 for description, but the invention is not limited thereto. For example, in other embodiments not shown in the present invention, the signal transmission module may also be used alone (eg, sold) or used with other components.

所述支撐件1包含有一連接板11、設置於上述連接板11(相當於承載件)的一定位結構12、及可移動地配置於所述定位結構12的一行程結構13。其中，所述行程結構13能以整體相對於上述定位結構12移動，以使位於支撐件1上方的多個偵測凸塊3的位移行程大致相同。 The supporting member 1 includes a connecting plate 11, a positioning structure 12 disposed on the connecting plate 11 (equivalent to a carrier), and a stroke structure 13 movably disposed on the positioning structure 12. Wherein, the stroke structure 13 can move relative to the positioning structure 12 as a whole, so that the displacement strokes of the plurality of detection protrusions 3 located above the support member 1 are substantially the same.

所述連接板11較佳為可彎折的軟性板材，但本實施例不受限於此。上述連接板11包含有一導電線路111、及分別連接於上述導電線路111兩端的一金屬墊112與一金屬接點113，並且上述金屬墊112與金屬接點113位於連接板11的同側(如：圖1中的連接板11上側)；也就是說，所述金屬墊112與金屬接點113通過上述導電線路111而彼此電性連接。 The connecting plate 11 is preferably a flexible sheet material that can be bent, but this embodiment is not limited thereto. The connection board 11 includes a conductive circuit 111 and a metal pad 112 and a metal contact 113 respectively connected to the two ends of the conductive circuit 111, and the metal pad 112 and the metal contact 113 are located on the same side of the connection board 11 (e.g. : Upper side of the connection board 11 in FIG. 1); that is to say, the metal pad 112 and the metal contact 113 are electrically connected to each other through the conductive line 111.

所述定位結構12於本實施例中包含有間隔地固定於上述連接板11上的多個導引銷121，並且上述多個導引銷121固定在設有金屬墊112的連接板11部位，但所述金屬墊112較佳是非完全被上述多個導引銷121所覆蓋。 In this embodiment, the positioning structure 12 includes a plurality of guide pins 121 fixed to the connection plate 11 at intervals, and the plurality of guide pins 121 are fixed to the connection plate 11 where the metal pad 112 is provided. However, the metal pad 112 is preferably not completely covered by the plurality of guide pins 121.

所述行程結構13電性耦接於上述連接板11的金屬墊112，並且遠離上述定位結構12的行程結構13表面(如：圖1中的行程結構13頂面)定義為一承載面1311，而上述承載面1311連接於所述傳輸層2。於本實施例中，所述行程結構13包含有可移動地配置於定位結構12的一支架131以及可伸縮地設置於支架131內的多個導電彈性件132。 The stroke structure 13 is electrically coupled to the metal pad 112 of the connecting plate 11, and the surface of the stroke structure 13 (such as the top surface of the stroke structure 13 in FIG. 1) away from the positioning structure 12 is defined as a bearing surface 1311. The bearing surface 1311 is connected to the transmission layer 2. In the present embodiment, the stroke structure 13 includes a bracket 131 movably disposed in the positioning structure 12 and a plurality of conductive elastic members 132 retractably disposed in the bracket 131.

更詳細地說，遠離所述定位結構12的支架131表面(如：圖1中的支架131頂面)被定義為該承載面1311，而鄰近於上述定位結構12的支架131表面(如：圖1中的支架131底面)凹設形成有多個軌道槽1312。 In more detail, the surface of the bracket 131 away from the positioning structure 12 (such as the top surface of the bracket 131 in FIG. 1) is defined as the bearing surface 1311, and is adjacent to the surface of the bracket 131 of the positioning structure 12 (see the figure) (The bottom surface of the bracket 131 in FIG. 1) is concavely formed with a plurality of rail grooves 1312.

其中，所述支架131以多個軌道槽1312分別組接於定位結構12的多個導引銷121，以使支架131能夠通過該些軌道槽1312與導引銷121的配合、而相對於定位結構12僅沿一高度方向H(如：圖1中的支架131頂面與底面之間的距離方向)移動；但上述支架131與定位結構12之間的配合方式也可以依據設計需求而加以調整變化，並不受限於本實施例所載。舉例來說，在本發明未繪示的其他實施例中，所述定位結構12可以是包含有多個軌道槽，而所述支架131可以是形成有分別組接於上述多個軌道槽的多個導引銷。 Wherein, the bracket 131 is respectively connected to the plurality of guide pins 121 of the positioning structure 12 with a plurality of track grooves 1312, so that the bracket 131 can be positioned relative to the guide pin 121 through the cooperation of the track grooves 1312 and the guide pins 121 The structure 12 only moves along a height direction H (such as the distance between the top surface and the bottom surface of the bracket 131 in FIG. 1); however, the above-mentioned cooperation between the bracket 131 and the positioning structure 12 can also be adjusted according to design requirements Changes are not limited to those contained in this embodiment. For example, in other embodiments not shown in the present invention, the positioning structure 12 may include a plurality of rail grooves, and the bracket 131 may be formed with multiple Guide pins.

再者，所述支架131內部形成有(沿上述高度方向H呈)貫穿狀的多個定位槽孔1313，並且多個導電彈性件132分別設置於支架131的多個定位槽孔1313。其中，每個導電彈性件132具有位於相反側的一第一端1321與一第二端1322，並且上述導電彈性件132的第一端1321位置對應(或鄰近)於支架131的承載面1311，而所述導電彈性件132的第二端1322穿出所述支架131(的底面)並抵接於上述連接板11。而於本實施例中，其中一個導電彈性件132的第二端1322是抵接於連接板11的金屬墊112、藉以彼此電性連接。 Furthermore, a plurality of positioning slots 1313 (in the above-mentioned height direction H) penetrating are formed inside the bracket 131, and the plurality of conductive elastic members 132 are respectively disposed in the plurality of positioning slots 1313 of the bracket 131. Each conductive elastic member 132 has a first end 1321 and a second end 1322 on opposite sides, and the position of the first end 1321 of the conductive elastic member 132 corresponds (or is adjacent) to the bearing surface 1311 of the bracket 131, The second end 1322 of the conductive elastic member 132 passes through (the bottom surface) of the bracket 131 and abuts against the connecting plate 11. In this embodiment, the second end 1322 of one of the conductive elastic members 132 is in contact with the metal pad 112 of the connecting plate 11 to be electrically connected to each other.

需說明的是，所述導電彈性件132於本實施例中是以一彈簧針(Pogo-pin)來說明，但導電彈性件132的具體構造於實際應用時也可以依據設計者的需求而加以調整變化，並不受限於本實施例所載。 It should be noted that, in this embodiment, the conductive elastic member 132 is described by a pogo-pin, but the specific structure of the conductive elastic member 132 can also be applied according to the needs of the designer in practical applications. Adjustment changes are not limited to those contained in this embodiment.

所述傳輸層2於本實施例中完全設置在上述支撐件1的承載面1311上，並且傳輸層2為多層堆疊之構造，而本實施例的傳輸層2是以一底層21與堆疊於所述底層21上的一頂層22來說明。其中，所述底層21設置於支撐件1的承載面1311上、並抵接於多個導電彈性件132的第一端1321，而所述傳輸層2於其頂層22內設有多個接點221，並且其中一個接點221延伸至底層21而與抵接於金屬墊112的該導電彈性件132相接。 In this embodiment, the transmission layer 2 is completely disposed on the bearing surface 1311 of the support 1 described above, and the transmission layer 2 is a multi-layer stacked structure, and the transmission layer 2 of this embodiment is a bottom layer 21 and stacked on the A top layer 22 on the bottom layer 21 will be described. Wherein, the bottom layer 21 is disposed on the bearing surface 1311 of the support member 1 and abuts on the first ends 1321 of the plurality of conductive elastic members 132, and the transmission layer 2 is provided with a plurality of contacts in the top layer 22 221, and one of the contacts 221 extends to the bottom layer 21 and is in contact with the conductive elastic member 132 abutting on the metal pad 112.

所述多個偵測凸塊3分別設置於傳輸層2的多個接點221上，也就是說，多個偵測凸塊3與支撐件1分別位於所述傳輸層2的相反兩側。其中，所述偵測凸塊3於本實施例中較佳是不具有彈性，並且上述偵測凸塊3是用來可分離地頂抵於待測物(圖未示，如：半導體晶圓)。 The plurality of detection bumps 3 are respectively disposed on the plurality of contacts 221 of the transmission layer 2, that is to say, the plurality of detection bumps 3 and the support member 1 are respectively located on opposite sides of the transmission layer 2. Wherein, the detection bump 3 is preferably not flexible in this embodiment, and the detection bump 3 is used to detachably abut the object to be measured (not shown in the figure, such as: semiconductor wafer ).

所述電路板4包含有位於相反兩側的一第一板面41與一第二板面42，並且所述電路板4形成有貫穿上述第一板面41與所述第二板面42的一容置孔43與一連接孔44。其中，所述電路板4的厚度較佳是不大於支撐件1的厚度，並且上述容置孔43的孔徑對應於(如：略大於)支撐件1的寬度，而連接孔44的孔徑對應於(如：略大於)同軸纜線5的寬度。所述容置孔43是大致位於電路板4的中央處，而連接孔44則是位於容置孔43的一側，上述容置孔44的數量可依據測試需求而調整(如：增加)，並不受限於圖式所載。 The circuit board 4 includes a first board surface 41 and a second board surface 42 on opposite sides, and the circuit board 4 is formed through the first board surface 41 and the second board surface 42 A receiving hole 43 and a connecting hole 44. Wherein, the thickness of the circuit board 4 is preferably not greater than the thickness of the supporting member 1, and the diameter of the accommodating hole 43 corresponds to (eg, slightly larger than) the width of the supporting member 1, and the diameter of the connecting hole 44 corresponds to (Slightly larger than) the width of the coaxial cable 5. The accommodating hole 43 is located roughly at the center of the circuit board 4, and the connecting hole 44 is located at one side of the accommodating hole 43. The number of the accommodating holes 44 can be adjusted according to the test requirements (eg, increase), It is not limited to the pictures.

更詳細地說，所述電路板4於其第二板面42的一側部位(如：圖1中的第二板面42的右側部位)設有彼此電性耦接的一機台接點421與一傳輸接點422，並且所述電路板4的第二板面42通過機台接點421來電性耦接於一測試機台(圖未示)。 In more detail, the circuit board 4 is provided with a machine contact electrically coupled to each other on one side of the second board 42 (such as the right part of the second board 42 in FIG. 1) 421 and a transmission contact 422, and the second board 42 of the circuit board 4 is electrically coupled to a testing machine (not shown) through the machine contact 421.

再者，所述支撐件1的局部(如：定位結構12的至少局部與行程結構13)位於上述電路板4的容置孔43內，所述電路板4的傳輸接點422連接於支撐件1的金屬接點113，以使連接板11連接於所述電路板4的第二板面42；也就是說，所述連接板11的金屬墊112能通過導電線路111與金屬接點113而電性耦接於上述電路板4。據此，所述電路板4能夠通過傳輸層2與支撐件1(的連接板11及其電性耦接的導電彈性件132)而電性耦接於上述多個偵測凸塊3的其中一個偵測凸塊3’(也就是與金屬墊112電性耦接的該偵測凸塊3’)。 Furthermore, a part of the support member 1 (such as at least a part of the positioning structure 12 and the stroke structure 13) is located in the receiving hole 43 of the circuit board 4, and the transmission contact 422 of the circuit board 4 is connected to the support member 1 metal contact 113 to connect the connection board 11 to the second board surface 42 of the circuit board 4; that is to say, the metal pad 112 of the connection board 11 can pass through the conductive line 111 and the metal contact 113 It is electrically coupled to the circuit board 4. According to this, the circuit board 4 can be electrically coupled to one of the plurality of detection bumps 3 through the transmission layer 2 and the support member 1 (the connecting board 11 and its electrically conductive conductive elastic member 132) A detection bump 3'(that is, the detection bump 3'electrically coupled to the metal pad 112).

換個角度來說，所述多個導電彈性件132的其中一個導電彈性件132的第一端1321抵接於傳輸層2而電性耦接於電路板4所對應的偵測凸塊3’，而其所述第二端1322穿出支架131並抵接於上述連接板11的金屬墊112。 In other words, the first end 1321 of one of the conductive elastic members 132 abuts the transmission layer 2 and is electrically coupled to the detection bump 3 ′ corresponding to the circuit board 4, The second end 1322 passes through the bracket 131 and contacts the metal pad 112 of the connecting plate 11.

所述同軸纜線5包含有一芯線5a、將上述芯線5a埋置於內的一絕緣層(圖未示)、圍繞於所述芯線5a外側且包覆於絕緣層外的一網狀屏蔽層5b、及包覆於上述網狀屏蔽層5b外的一塑料封套(圖未示)。當所述同軸纜線5改成與其他構件之間的連接關係來看時，所述同軸纜線5包含有一穿設段51及位於上述穿設段51相反兩側的一埋置末段52與一外接末段53。 The coaxial cable 5 includes a core wire 5a, an insulating layer (not shown) in which the core wire 5a is embedded, and a mesh-shaped shielding layer 5b surrounding the core wire 5a and covering the insulating layer And a plastic envelope (not shown) wrapped around the above-mentioned mesh shielding layer 5b. When the coaxial cable 5 is changed into a connection relationship with other components, the coaxial cable 5 includes a penetration section 51 and a buried end section 52 on opposite sides of the penetration section 51 With an external terminal 53.

其中，所述同軸纜線5的穿設段51位於電路板4的連接孔44內，所述埋置末段52埋設固定於傳輸層2內(位於底層21與頂層22之間)，並且位於埋置末段52的芯線5a部位電性耦接於多個偵測凸塊3的其中一個偵測凸塊3”。而所述外接末段53穿出於上述電路板4的第二板面42且用來電性耦接於測試機台。而於本實施例中，所述同軸纜線5是以其位於埋置末段52的芯線5a部位與網狀屏蔽層5b部位分別電性耦接於多個偵測凸塊3的其中兩個所述偵測凸塊3”；也就是說，所述芯線5a與網狀屏蔽層5b是分別電性耦接於不同的偵測凸塊3”，並且上述芯線5a與網狀屏蔽層5b所電性耦接的偵測凸塊3”也不同於電路板4所電性耦接的偵測凸塊3’。 Wherein, the penetration section 51 of the coaxial cable 5 is located in the connection hole 44 of the circuit board 4, and the buried end section 52 is buried and fixed in the transmission layer 2 (located between the bottom layer 21 and the top layer 22 ), and is located The portion of the core wire 5a of the embedded terminal section 52 is electrically coupled to one of the detection bumps 3" of the plurality of detection bumps 3. The external terminal section 53 passes through the second surface of the circuit board 4 42 and is used to electrically couple to the testing machine. In this embodiment, the coaxial cable 5 is electrically coupled to the portion of the core wire 5a and the mesh shielding layer 5b at the end 52 of the embedding 52 In two of the plurality of detection bumps 3, the detection bumps 3"; that is, the core wire 5a and the mesh shielding layer 5b are electrically coupled to different detection bumps 3", respectively In addition, the detection bump 3 ″ electrically coupled to the core wire 5 a and the mesh shield layer 5 b is also different from the detection bump 3 ′ electrically coupled to the circuit board 4.

據此，上述芯線5a電性耦接的該偵測凸塊3”能夠將其所偵測到的信號通過同軸纜線5直接傳輸至測試機台，藉以具備有較佳的傳輸效果。而上述芯線5a與相對應的偵測凸塊3”於本實施例中較佳是用來傳輸一高頻信號。 According to this, the detection bump 3" electrically coupled to the core wire 5a can directly transmit the detected signal to the testing machine through the coaxial cable 5, so as to have a better transmission effect. The core 5a and the corresponding detection bump 3" are preferably used to transmit a high-frequency signal in this embodiment.

進一步地說，上述外接末段53可以設有一同軸接頭，藉以能夠插設於測試機台來達成電性耦接，所述埋置末段52的長度方向與所述穿設段51的長度方向較佳是相夾有介於80度~100度的一夾角。再者，本實施例中的高頻探針卡裝置100較佳是無須設有任何電容器或電感器，但本發明不以此為限。 Further, the external terminal 53 may be provided with a coaxial connector, so that it can be plugged into the testing machine to achieve electrical coupling. The length direction of the embedded terminal 52 and the length direction of the through segment 51 It is preferable that the phases include an angle between 80 degrees and 100 degrees. Furthermore, the high-frequency probe card device 100 in this embodiment preferably does not need to be provided with any capacitor or inductor, but the invention is not limited to this.

[實施例二] [Example 2]

如圖2所示，其為本發明的實施例二，本實施例類似於上述實施例一，兩個實施例的相同處則不再加以贅述，而本實施例相較於上述實施例一的差異主要在於：所述傳輸層2與支撐件1的結構。 As shown in FIG. 2, this is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared to the above-mentioned first embodiment. The difference mainly lies in the structure of the transmission layer 2 and the support 1.

所述電路板4與相對應的偵測凸塊3’於本實施例中僅通過所述傳輸層2而彼此電性耦接；也就是說，所述傳輸層2與導電彈性件132之間並未有電性上的連接，並且所述多個導電彈性件132僅用來提供支撐件1於往復位移時所需的彈力、但未作為信號傳輸使用。再者，所述連接板11僅用來作為定位結構12的承載件使用、但未設有做為電性傳輸用的導電線路111、金屬墊112、與金屬接點113。 In this embodiment, the circuit board 4 and the corresponding detection bump 3 ′ are electrically coupled to each other only through the transmission layer 2; that is, between the transmission layer 2 and the conductive elastic member 132 There is no electrical connection, and the plurality of conductive elastic members 132 are only used to provide the elastic force required by the support member 1 when moving back, but it is not used for signal transmission. Furthermore, the connecting plate 11 is only used as a carrier of the positioning structure 12, but it is not provided with a conductive line 111, a metal pad 112, and a metal contact 113 for electrical transmission.

更詳細地說，所述傳輸層2於本實施例中包含有一第一區塊2a、一第二區塊2b、位於所述第一區塊2a與第二區塊2b之間的一連接區塊2c、及設置於所述連接區塊2c的一電路匹配單元2d。其中，所述第一區塊2a完全設置在支撐件1的承載面1311上，並且多個偵測凸塊3設置於所述第一區塊2a上；也就是說，所述第一區塊2a相當於上述實施例一的傳輸層2，而所述連接區塊2c與第二區塊2b則是相當於由第一區塊2a的頂層22朝向外側一體地延伸所形成。 More specifically, in this embodiment, the transmission layer 2 includes a first block 2a, a second block 2b, and a connection area between the first block 2a and the second block 2b Block 2c, and a circuit matching unit 2d provided in the connection block 2c. Wherein, the first block 2a is completely disposed on the bearing surface 1311 of the support 1, and a plurality of detection bumps 3 are disposed on the first block 2a; that is, the first block 2a corresponds to the transmission layer 2 of the first embodiment, and the connection block 2c and the second block 2b are formed by the top layer 22 of the first block 2a extending integrally outward.

所述連接區塊2c的局部位於上述電路板4的容置孔43內、且位於支撐件1與電路板4的容置孔43孔壁之間。其中，所述連接區塊2c形成有一穿孔21c，並且上述穿孔21c位於容置孔43外且鄰近所述第一區塊2a，以使所述同軸纜線5穿過上述連接區塊2c的穿孔21c。 The connection block 2c is partially located in the receiving hole 43 of the circuit board 4 and between the supporting member 1 and the hole wall of the receiving hole 43 of the circuit board 4. A through hole 21c is formed in the connecting block 2c, and the through hole 21c is located outside the receiving hole 43 and adjacent to the first block 2a, so that the coaxial cable 5 passes through the through hole of the connecting block 2c 21c.

所述第二區塊2b連接於上述電路板4的第二板面42(如：金屬接點113)，所述傳輸層2於本實施例中設有自第一區塊2a延伸至第二區塊2b的至少一傳輸線23，並且電路板4所對應的偵測凸塊3’設置於所述傳輸線23上，以使電路板4及其相對應的偵測凸塊3’能通過傳輸層2的傳輸線23來達成電性耦接。 The second block 2b is connected to the second board surface 42 of the circuit board 4 (eg, metal contact 113). In this embodiment, the transmission layer 2 is provided to extend from the first block 2a to the second At least one transmission line 23 of the block 2b, and the detection bump 3'corresponding to the circuit board 4 is disposed on the transmission line 23, so that the circuit board 4 and its corresponding detection bump 3'can pass through the transmission layer 2 transmission line 23 to achieve electrical coupling.

再者，所述電路匹配單元2d(如：電容器或/及電感器)安裝於連接區塊2c上的傳輸層2部位、並鄰近於所述第一區塊2a。其中，所述電路匹配單元2d電性耦接於所述電路板4與相對應的偵測凸塊3’，以通過上述電路匹配單元2d來調整特性阻抗，進而達到阻抗匹配的效果。 Furthermore, the circuit matching unit 2d (such as a capacitor or/and an inductor) is installed at the location of the transmission layer 2 on the connection block 2c and is adjacent to the first block 2a. Wherein, the circuit matching unit 2d is electrically coupled to the circuit board 4 and the corresponding detection bump 3', so as to adjust the characteristic impedance through the circuit matching unit 2d, thereby achieving the effect of impedance matching.

[實施例三] [Embodiment 3]

如圖3所示，其為本發明的實施例三，本實施例類似於上述實施例二，兩個實施例的相同處則不再加以贅述，而本實施例相較於上述實施例二的差異主要在於：本實施例的高頻探針卡裝置100未包含有同軸纜線5及其相對應構造(如：連接孔44、穿孔21c、接點221)。 As shown in FIG. 3, it is the third embodiment of the present invention. This embodiment is similar to the above-mentioned second embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared with the above-mentioned second embodiment. The main difference is that the high-frequency probe card device 100 of this embodiment does not include the coaxial cable 5 and its corresponding structure (eg, connection hole 44, through-hole 21c, contact 221).

更詳細地說，所述傳輸層2上的傳輸線23為圖案化的傳輸構造，並且所述多個偵測凸塊3皆設置於上述傳輸線23，藉以使本實施例的所有偵測凸塊3僅可通過所述傳輸層2而與電路板4達成電性耦接。也就是說，本實施例中的多個偵測凸塊3皆是與電路板4電性耦接的偵測凸塊3’。需說明的是，所述多個偵測凸塊3’能通過傳輸線23的圖案化，以使上述多個偵測凸塊3各自獨立地電性耦接於電路板4。 In more detail, the transmission line 23 on the transmission layer 2 is a patterned transmission structure, and the plurality of detection bumps 3 are all disposed on the transmission line 23, so that all the detection bumps 3 of this embodiment The electrical coupling with the circuit board 4 can only be achieved through the transmission layer 2. That is to say, the plurality of detection bumps 3 in this embodiment are all detection bumps 3'electrically coupled to the circuit board 4. It should be noted that the plurality of detection bumps 3'can be patterned by the transmission line 23, so that the plurality of detection bumps 3 are electrically coupled to the circuit board 4 independently.

再者，所述傳輸層2與導電彈性件132之間並未有電性上的連接，並且所述多個導電彈性件132僅用來提供支撐件1於往復位移時所需的彈力、但未作為信號傳輸使用。 Furthermore, there is no electrical connection between the transmission layer 2 and the conductive elastic member 132, and the plurality of conductive elastic members 132 are only used to provide the elastic force required for the support member 1 to move back and forth, but Not used as a signal transmission.

[實施例四] [Embodiment 4]

如圖4所示，其為本發明的實施例四，本實施例類似於上述實施例一，兩個實施例的相同處則不再加以贅述，而本實施例相較於上述實施例一的差異主要在於：所述電路板4及其與支撐件1之間的對應關係，並且本實施例的支撐件1未包含有上述連接板11。 As shown in FIG. 4, this is the fourth embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared to the above-mentioned first embodiment. The difference mainly lies in: the corresponding relationship between the circuit board 4 and the support 1, and the support 1 in this embodiment does not include the connection board 11 described above.

所述電路板4於本實施例中包含有位於第一板面41且電性耦接至所述第二板面42的至少一個金屬墊411。其中，本實施例的金屬墊411數量為多個，並且電路板4也於第二板面42設有電性耦接至機台接點421的多個傳輸接點422，而上述多個金屬墊411分別電性耦接至所述第二板面42的多個傳輸接點422。 In this embodiment, the circuit board 4 includes at least one metal pad 411 located on the first board surface 41 and electrically coupled to the second board surface 42. In this embodiment, the number of the metal pads 411 is plural, and the circuit board 4 is also provided with a plurality of transmission contacts 422 electrically coupled to the machine contact 421 on the second board surface 42. The pads 411 are electrically coupled to the plurality of transmission contacts 422 of the second board 42 respectively.

再者，所述傳輸層2與電路板4分別位於支撐件1的相反兩側，所述電路板4與相對應的偵測凸塊3’通過上述傳輸層2與支撐件1而彼此電性耦接。其中，所述支撐件1的定位結構12設置於上述電路板4的第一板面41、且鄰近於上述多個金屬墊411，而所述行程結構13可移動地配置於上述定位結構12、並電性耦接於所述多個金屬墊411，據以令所述行程結構13能以整體相對於定位結構12移動，以使所述多個偵測凸塊3能同步移動且其位移行程大致相同。 Furthermore, the transmission layer 2 and the circuit board 4 are located on opposite sides of the support 1 respectively, and the circuit board 4 and the corresponding detection bump 3'are electrically connected to each other through the transmission layer 2 and the support 1 Coupling. Wherein, the positioning structure 12 of the supporting member 1 is disposed on the first board surface 41 of the circuit board 4 and adjacent to the plurality of metal pads 411, and the stroke structure 13 is movably disposed on the positioning structure 12, And electrically coupled to the plurality of metal pads 411, so that the stroke structure 13 can move relative to the positioning structure 12 as a whole, so that the plurality of detection bumps 3 can move synchronously and their displacement strokes Roughly the same.

更詳細地說，上述多個導電彈性件132的第一端1321抵接於所述傳輸層2而電性耦接於上述電路板4所對應的偵測凸塊3’，而多個導電彈性件132的第二端1322穿出所述支架131並分別抵接於多個金屬墊411。 In more detail, the first ends 1321 of the plurality of conductive elastic members 132 abut on the transmission layer 2 and are electrically coupled to the detection bumps 3 ′ corresponding to the circuit board 4, and the plurality of conductive elastics The second end 1322 of the member 132 passes through the bracket 131 and abuts against the plurality of metal pads 411 respectively.

[實施例五] [Embodiment 5]

如圖5所示，其為本發明的實施例五，本實施例類似於上述實施例四，兩個實施例的相同處則不再加以贅述，而本實施例相較於上述實施例四的差異主要在於：所述電路板4的結構。 As shown in FIG. 5, this is the fifth embodiment of the present invention. This embodiment is similar to the above-mentioned fourth embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared with the above-mentioned fourth embodiment. The difference mainly lies in the structure of the circuit board 4.

所述電路板4進一步包含有一增層結構45，並且所述增層結構45位於電路板4遠離第二板面42的部位(如：電路板4頂部)，而所述增層結構45的外表面定義為上述第一板面41。其中，上述多個金屬墊411設置於增層結構45，並且所述支撐件1的定位結構12也設置於電路板4的增層結構45上。此外，所述增層結構45於本實施例中是以位於電路板4頂部來說明，但本發明不以此為限。舉例來說：在本發明未繪示的其他實施例中，所述電路板5也可以在其底部進一步設有增層結構45。 The circuit board 4 further includes a build-up structure 45, and the build-up structure 45 is located at a portion of the circuit board 4 away from the second board surface 42 (eg, the top of the circuit board 4), while the build-up structure 45 is outside The surface is defined as the first plate surface 41 described above. Wherein, the above-mentioned plurality of metal pads 411 are disposed on the build-up structure 45, and the positioning structure 12 of the support 1 is also disposed on the build-up structure 45 of the circuit board 4. In addition, in this embodiment, the build-up structure 45 is described on the top of the circuit board 4, but the invention is not limited thereto. For example: In other embodiments not shown in the present invention, the circuit board 5 may be further provided with a build-up structure 45 at the bottom thereof.

[本發明實施例的技術效果] [Technical Effects of Embodiments of the Invention]

綜上所述，本發明實施例所公開的高頻探針卡裝置100及其信號傳輸模組，通過上述傳輸層2與電路板4設置固定有該同軸纜線5，以使上述同軸纜線5的芯線5a所電性耦接的該偵測凸塊3、3’、3”，能夠將其所偵測到的信號(如：高頻信號)通過同軸纜線5直接傳輸至測試機台，藉以具備有較佳的傳輸效果。 In summary, the high-frequency probe card device 100 and its signal transmission module disclosed in the embodiments of the present invention are provided with the coaxial cable 5 fixed through the transmission layer 2 and the circuit board 4 to make the coaxial cable The detection bumps 3, 3', 3" electrically coupled to the core wire 5a of 5 can directly transmit the detected signals (such as high-frequency signals) to the testing machine through the coaxial cable 5 , In order to have better transmission effect.

再者，本發明實施例所公開的高頻探針卡裝置100能提供包含有定位結構12與行程結構13的支撐件1，據以通過所述行程結構13可整體相對於上述定位結構12移動，而令位於支撐件1上方的多個偵測凸塊3、3’、3”的位移行程大致相同，使得所述高頻探針卡裝置100能有較為精準的偵測結果。 Furthermore, the high-frequency probe card device 100 disclosed in the embodiment of the present invention can provide the support 1 including the positioning structure 12 and the stroke structure 13, so that the stroke structure 13 can move relative to the positioning structure 12 as a whole Therefore, the displacement strokes of the plurality of detection bumps 3, 3', 3" located above the support 1 are substantially the same, so that the high-frequency probe card device 100 can have a more accurate detection result.

以上所述僅為本發明的優選可行實施例，並非用來侷限本發明的保護範圍，凡依本發明專利範圍所做的均等變化與修飾，皆應屬本發明的權利要求書的保護範圍。 The above are only the preferred and feasible embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any changes and modifications made within the scope of the patent of the present invention shall fall within the scope of protection of the claims of the present invention.

100‧‧‧高頻探針卡裝置 100‧‧‧High frequency probe card device

1‧‧‧支撐件 1‧‧‧Support

11‧‧‧連接板 11‧‧‧Connecting board

12‧‧‧定位結構 12‧‧‧Positioning structure

121‧‧‧導引銷 121‧‧‧Guide pins

13‧‧‧行程結構 13‧‧‧Stroke structure

131‧‧‧支架 131‧‧‧Bracket

1311‧‧‧承載面 1311‧‧‧ bearing surface

1312‧‧‧軌道槽 1312‧‧‧Track groove

1313‧‧‧定位槽孔 1313‧‧‧Locating slot

132‧‧‧導電彈性件 132‧‧‧ conductive elastic

1321‧‧‧第一端 1321‧‧‧The first end

1322‧‧‧第二端 1322‧‧‧The second end

2‧‧‧傳輸層 2‧‧‧Transport layer

2a‧‧‧第一區塊 2a‧‧‧The first block

2b‧‧‧第二區塊 2b‧‧‧ Block 2

2c‧‧‧連接區塊 2c‧‧‧Connect block

2d‧‧‧電路匹配單元 2d‧‧‧ circuit matching unit

21‧‧‧底層 21‧‧‧Bottom

22‧‧‧頂層 22‧‧‧Top

23‧‧‧傳輸線 23‧‧‧ Transmission line

3、3’‧‧‧偵測凸塊 3. 3’‧‧‧ bump detection

4‧‧‧電路板 4‧‧‧ circuit board

41‧‧‧第一板面 41‧‧‧ First board

42‧‧‧第二板面 42‧‧‧Second board

421‧‧‧機台接點 421‧‧‧ machine contact

422‧‧‧傳輸接點 422‧‧‧Transmission contact

43‧‧‧容置孔 43‧‧‧Accommodation hole

H‧‧‧高度方向 H‧‧‧ Height direction

Claims

一種高頻探針卡裝置，包括：一支撐件，包含；一定位結構，用來設置於一承載件；一行程結構，可移動地配置於所述定位結構，並且所述行程結構包含有：一支架，內部形成有貫穿狀的多個定位槽孔，並且所述支架可移動地配置於所述定位結構，而遠離所述定位結構的所述支架表面定義為一承載面；及多個導電彈性件，分別設置於多個所述定位槽孔，並且每個所述導電彈性件具有位於相反側的一第一端與一第二端；其中，每個所述導電彈性件的所述第一端對應於所述承載面，而每個所述導電彈性件的所述第二端穿出所述支架並用來抵接於所述承載件；一傳輸層，至少局部設置於所述承載面上、並抵接於每個所述導電彈性件的所述第一端；多個偵測凸塊，設置於所述傳輸層上，並且多個所述偵測凸塊與所述支撐件分別位於所述傳輸層的相反兩側；以及一電路板，電性連接於多個所述偵測凸塊的其中一個所述偵測凸塊，並且所述電路板包含有位於相反兩側的一第一板面與一第二板面，而所述電路板的所述第二板面用來電性耦接於一測試機台；其中，所述行程結構能以整體相對於所述定位結構移動，以使多個所述偵測凸塊的位移行程大致相同。 A high-frequency probe card device includes: a support member, including; a positioning structure for setting on a carrier; a stroke structure, which is movably arranged in the positioning structure, and the stroke structure includes: A bracket with a plurality of positioning slots formed in the interior, and the bracket is movably arranged in the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface; and a plurality of conductive The elastic members are respectively disposed in the plurality of positioning slots, and each of the conductive elastic members has a first end and a second end on opposite sides; wherein, the first One end corresponds to the bearing surface, and the second end of each conductive elastic member passes through the bracket and is used to abut the bearing member; a transmission layer is at least partially disposed on the bearing surface Up and in contact with the first end of each of the conductive elastic members; a plurality of detection bumps are provided on the transmission layer, and the plurality of detection bumps and the support are respectively Located on opposite sides of the transmission layer; and a circuit board electrically connected to one of the detection bumps of the plurality of detection bumps, and the circuit board includes a A first board surface and a second board surface, and the second board surface of the circuit board is used to be electrically coupled to a testing machine; wherein, the stroke structure can move relative to the positioning structure as a whole , So that the displacement strokes of the plurality of detection bumps are approximately the same.

如請求項1所述的高頻探針卡裝置，其中，所述電路板形成有貫穿所述第一板面與所述第二板面的一容置孔，並且所述支撐件的局部位於所述容置孔內；所述支撐件進一步包含有一連接板，並且所述定位結構設置於所述連接板上。 The high-frequency probe card device according to claim 1, wherein the circuit board is formed with an accommodating hole penetrating the first board surface and the second board surface, and the support member is partially located The accommodating hole; the supporting member further includes a connecting plate, and the positioning structure is disposed on the connecting plate.

如請求項2所述的高頻探針卡裝置，其中，所述電路板與相對應的所述偵測凸塊通過所述支撐件而彼此電性耦接；所述連接板連接於所述電路板的所述第二板面，並且所述連接板包含有電性耦接於所述電路板的一金屬墊，多個所述導電彈性件的其中一個所述導電彈性件的所述第一端抵接於所述傳輸層而電性耦接於所述電路板所對應的所述偵測凸塊，而其所述第二端抵接於所述金屬墊。 The high-frequency probe card device according to claim 2, wherein the circuit board and the corresponding detection bump are electrically coupled to each other through the support member; the connection board is connected to the The second board surface of the circuit board, and the connecting board includes a metal pad electrically coupled to the circuit board, one of the conductive elastic members, the first of the conductive elastic members One end abuts the transmission layer and is electrically coupled to the detection bump corresponding to the circuit board, and the second end abuts the metal pad.

如請求項2所述的高頻探針卡裝置，其中，所述電路板與相對應的所述偵測凸塊僅通過所述傳輸層而彼此電性耦接，並且所述傳輸層包含有：一第一區塊，設置在所述承載面上，並且多個所述偵測凸塊設置於所述第一區塊上；一第二區塊，連接於所述電路板的所述第二板面；一連接區塊，位於所述第一區塊與所述第二區塊之間，並且所述連接區塊的局部位於所述容置孔內。 The high-frequency probe card device according to claim 2, wherein the circuit board and the corresponding detection bump are electrically coupled to each other only through the transmission layer, and the transmission layer includes : A first block is provided on the bearing surface, and a plurality of the detection bumps are provided on the first block; a second block is connected to the first block of the circuit board Two plates; a connecting block, located between the first block and the second block, and a part of the connecting block is located in the accommodating hole.

如請求項4所述的高頻探針卡裝置，其中，所述傳輸層包含有設置於所述連接區塊的一電路匹配單元，並且所述電路匹配單元鄰近於所述第一區塊、並電性耦接於所述電路板與相對應的所述偵測凸塊。 The high-frequency probe card device according to claim 4, wherein the transmission layer includes a circuit matching unit provided in the connection block, and the circuit matching unit is adjacent to the first block, It is electrically coupled to the circuit board and the corresponding detection bump.

如請求項1所述的高頻探針卡裝置，其中，所述傳輸層完全設置在所述承載面上，並且所述電路板與相對應的所述偵測凸塊通過所述傳輸層與所述支撐件而彼此電性耦接。 The high-frequency probe card device according to claim 1, wherein the transmission layer is completely provided on the bearing surface, and the circuit board and the corresponding detection bump pass through the transmission layer and The support members are electrically coupled to each other.

如請求項6所述的高頻探針卡裝置，其中，所述傳導層與所述電路板分別位於所述支撐件的相反兩側，並且所述電路板包含有位於所述第一板面且電性耦接至所述第二板面的一金屬墊；所述定位結構設置於所述電路板的所述第一板面，多個所述導電彈性件的其中一個所述導電彈性件的所述第一端抵接於所述傳輸層而電性耦接於所述電路板所對應的所述偵測凸塊，而其所述第二端抵接於所述金屬墊。 The high-frequency probe card device according to claim 6, wherein the conductive layer and the circuit board are respectively located on opposite sides of the support, and the circuit board includes the first board surface And a metal pad electrically coupled to the second board surface; the positioning structure is disposed on the first board surface of the circuit board, and one of the plurality of conductive elastic members is the conductive elastic member The first end of the abuts on the transmission layer and is electrically coupled to the detection bump corresponding to the circuit board, and the second end thereof abuts on the metal pad.

一種高頻探針卡裝置的壓接模組，包括：一支撐件，包含；一定位結構；一行程結構，可移動地配置於所述定位結構，並且所述行程結構包含有：一支架，內部形成有貫穿狀的多個定位槽孔，並且所述支架可移動地配置於所述定位結構，而遠離所述定位結構的所述支架表面定義為一承載面；及多個導電彈性件，分別設置於多個所述定位槽孔，並且每個所述導電彈性件具有位於相反側的一第一端與一第二端；其中，每個所述導電彈性件的所述第一端對應於所述承載面，而每個所述導電彈性件的所述第二端穿出所述支架；一傳輸層，至少局部設置於所述承載面上、並抵接於每個所述導電彈性件的所述第一端；以及多個偵測凸塊，設置於所述傳輸層上，並且多個所述偵測凸塊與所述支撐件分別位於所述傳輸層的相反兩側；其中，所述行程結構能以整體相對於所述定位結構移動，以使多個所述偵測凸塊的位移行程大致相同。 A crimping module for a high-frequency probe card device includes: a support member, including; a positioning structure; a stroke structure, which is movably arranged in the positioning structure, and the stroke structure includes: a bracket, A plurality of penetrating positioning slots are formed inside, and the bracket is movably arranged in the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface; and a plurality of conductive elastic members, Are respectively disposed in the plurality of positioning slots, and each of the conductive elastic members has a first end and a second end on opposite sides; wherein, the first end of each of the conductive elastic members corresponds to On the bearing surface, and the second end of each conductive elastic member passes through the bracket; a transmission layer is at least partially disposed on the bearing surface and abuts on each conductive elastic The first end of the member; and a plurality of detection bumps, which are disposed on the transmission layer, and the plurality of detection bumps and the support are respectively located on opposite sides of the transmission layer; wherein , The stroke structure can move relative to the positioning structure as a whole, so that the displacement strokes of the plurality of detection bumps are substantially the same.

如請求項8所述的高頻探針卡裝置的壓接模組，其中，所述傳輸層完全設置在所述承載面上，多個所述導電彈性件的其中一個所述導電彈性件的所述第一端抵接於所述傳輸層而電性耦接於多個所述偵測凸塊的其中一個所述偵測凸塊，而其所述第二端用來抵接於一金屬墊。 The crimping module of the high-frequency probe card device according to claim 8, wherein the transmission layer is completely disposed on the carrying surface, and one of the plurality of conductive elastic members of the conductive elastic member The first end abuts the transmission layer and is electrically coupled to one of the detection bumps, and the second end of the detection bump is used to contact a metal pad.

一種高頻探針卡裝置的支撐件，包括：一定位結構；以及一行程結構，可移動地配置於所述定位結構，並且所述行程結構能以整體相對於所述定位結構移動，所述行程結構包含有：一支架，內部形成有貫穿狀的多個定位槽孔，並且所述支架可移動地配置於所述定位結構，而遠離所述定位結構的所述支架表面定義為一承載面；以及多個導電彈性件，分別設置於多個所述定位槽孔，並且每個所述導電彈性件具有位於相反側的一第一端與一第二端；其中，每個所述導電彈性件的所述第一端對應於所述承載面，而每個所述導電彈性件的所述第二端穿出所述支架。 A support member of a high-frequency probe card device includes: a positioning structure; and a stroke structure, which is movably arranged in the positioning structure, and the stroke structure can move relative to the positioning structure as a whole. The stroke structure includes: a bracket, a plurality of through-shaped positioning slots formed therein, and the bracket is movably arranged in the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface ; And a plurality of conductive elastic members, respectively disposed in the plurality of positioning slots, and each of the conductive elastic members has a first end and a second end located on opposite sides; wherein, each of the conductive elastic The first end of the member corresponds to the bearing surface, and the second end of each conductive elastic member passes through the bracket.