TW202006370A - High frequency probe card device - Google Patents
High frequency probe card device Download PDFInfo
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- TW202006370A TW202006370A TW107124284A TW107124284A TW202006370A TW 202006370 A TW202006370 A TW 202006370A TW 107124284 A TW107124284 A TW 107124284A TW 107124284 A TW107124284 A TW 107124284A TW 202006370 A TW202006370 A TW 202006370A
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Abstract
Description
本發明涉及一種高頻探針卡,尤其涉及一種高頻探針卡裝置及其壓接模組與支撐件。 The invention relates to a high-frequency probe card, in particular to a high-frequency probe card device and its crimping module and support.
現有的高頻探針卡包含一柱塞(Plunger)、局部設置於上述柱塞端面的一軟性電路板、及固定於上述軟性電路板的多個偵測凸塊。其中,所述每個偵測凸塊皆不具有彈性,上述偵測凸塊是用來抵接並電性耦接於一待測物,並且通過上述軟性電路板傳輸相對應的信號。 The existing high-frequency probe card includes a plunger, a flexible circuit board partially disposed on the end surface of the plunger, and a plurality of detection bumps fixed on the flexible circuit board. Wherein, each of the detection bumps has no elasticity. The detection bumps are used to abut and electrically couple to an object to be tested, and transmit corresponding signals through the flexible circuit board.
然而,由於所述柱塞為單件式構造,所以當現有探針卡的多個偵測凸塊在頂抵於待測物時,上述柱塞容易受力而有偏斜的情況產生,使得上述多個偵測凸塊產生不同的位移行程,進而影響當現有探針卡的偵測結果。 However, since the plunger is a single-piece structure, when the multiple detection bumps of the existing probe card are pressed against the object to be measured, the plunger may easily be biased due to force, resulting in The above multiple detection bumps generate different displacement strokes, which in turn affects the detection results of the existing probe card.
於是,本發明人認為上述缺陷可改善,乃特潛心研究並配合科學原理的運用,終於提出一種設計合理且有效改善上述缺陷的本發明。 Therefore, the inventor believes that the above-mentioned defects can be improved, and Naite devotes himself to research and cooperates with the application of scientific principles, and finally proposes a reasonable design and effectively improves the above-mentioned defects of the present invention.
本發明實施例在於提供一種高頻探針卡裝置及其壓接模組與支撐件,能有效地改善現有高頻探針卡所可能產生的缺陷。 An embodiment of the present invention is to provide a high-frequency probe card device and a crimping module and a support member, which can effectively improve the defects that may be generated by the existing high-frequency probe card.
本發明實施例公開一種高頻探針卡裝置,包括:一支撐件, 包含;一定位結構,用來設置於一承載件;一行程結構,可移動地配置於所述定位結構,並且所述行程結構包含有:一支架,內部形成有貫穿狀的多個定位槽孔,並且所述支架可移動地配置於所述定位結構,而遠離所述定位結構的所述支架表面定義為一承載面;及多個導電彈性件,分別設置於多個所述定位槽孔,並且每個所述導電彈性件具有位於相反側的一第一端與一第二端;其中,每個所述導電彈性件的所述第一端對應於所述承載面,而每個所述導電彈性件的所述第二端穿出所述支架並用來抵接於所述承載件;一傳輸層,至少局部設置於所述承載面上、並抵接於每個所述導電彈性件的所述第一端;多個偵測凸塊,設置於所述傳輸層上,並且多個所述偵測凸塊與所述支撐件分別位於所述傳輸層的相反兩側;以及一電路板,電性連接於多個所述偵測凸塊的其中一個所述偵測凸塊,並且所述電路板包含有位於相反兩側的一第一板面與一第二板面,而所述電路板的所述第二板面用來電性耦接於一測試機台;其中,所述行程結構能以整體相對於所述定位結構移動,以使多個所述偵測凸塊的位移行程大致相同。 An embodiment of the present invention discloses a high-frequency probe card device, including: a support member, including; a positioning structure for setting on a carrier; a stroke structure, which is movably arranged in the positioning structure, and the The stroke structure includes: a bracket, a plurality of through-shaped positioning slots formed therein, and the bracket is movably arranged in the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface ; And a plurality of conductive elastic members, respectively provided in the plurality of positioning slots, and each of the conductive elastic members has a first end and a second end located on opposite sides; wherein, each of the conductive elastic The first end of the member corresponds to the bearing surface, and the second end of each conductive elastic member passes through the bracket and is used to abut the bearing member; a transmission layer is at least partially disposed On the carrying surface and abutting the first end of each conductive elastic member; a plurality of detection bumps are provided on the transmission layer, and a plurality of the detection bumps and The support members are located on opposite sides of the transmission layer; and a circuit board electrically connected to one of the detection bumps of the plurality of detection bumps, and the circuit board includes A first board surface and a second board surface on opposite sides, and the second board surface of the circuit board is used to electrically couple to a testing machine; wherein, the stroke structure can be relatively The positioning structure moves so that the displacement strokes of the plurality of detection bumps are substantially the same.
本發明實施例也公開一種高頻探針卡裝置的壓接模組,包括:一支撐件,包含;一定位結構;一行程結構,可移動地配置於所述定位結構,並且所述行程結構包含有:一支架,內部形成有貫穿狀的多個定位槽孔,並且所述支架可移動地配置於所述定位結構,而遠離所述定位結構的所述支架表面定義為一承載面;及多個導電彈性件,分別設置於多個所述定位槽孔,並且每個所述導電彈性件具有位於相反側的一第一端與一第二端;其中,每個所述導電彈性件的所述第一端對應於所述承載面,而每個所述導電彈性件的所述第二端穿出所述支架;一傳輸層,至少局部設置於所述承載面上、並抵接於每個所述導電彈性件的所述第一端;以及多個偵測凸塊,設置於所述傳輸層上,並且多個所述偵測凸塊與所述支撐件分別位於所述傳輸層的相反兩側;其中,所 述行程結構能以整體相對於所述定位結構移動,以使多個所述偵測凸塊的位移行程大致相同。 An embodiment of the present invention also discloses a crimping module for a high-frequency probe card device, which includes: a support, including; a positioning structure; a stroke structure, which is movably arranged in the positioning structure, and the stroke structure It includes: a bracket with a plurality of penetrating positioning slots formed therein, and the bracket is movably arranged in the positioning structure, and the surface of the bracket away from the positioning structure is defined as a bearing surface; and A plurality of conductive elastic members are respectively disposed in the plurality of positioning slots, and each of the conductive elastic members has a first end and a second end on opposite sides; wherein, each of the conductive elastic members The first end corresponds to the bearing surface, and the second end of each conductive elastic member passes through the bracket; a transmission layer is at least partially disposed on the bearing surface and abuts on The first end of each conductive elastic member; and a plurality of detection bumps, which are disposed on the transmission layer, and the plurality of detection bumps and the support member are respectively located on the transmission layer Opposite sides; wherein, the stroke structure can move relative to the positioning structure as a whole, so that the displacement strokes of the plurality of detection bumps are substantially the same.
本發明實施例另公開一種高頻探針卡裝置的支撐件,包括:一定位結構;以及一行程結構,可移動地配置於所述定位結構,並且所述行程結構能以整體相對於所述定位結構移動,所述行程結構包含有:一支架,內部形成有貫穿狀的多個定位槽孔,並且所述支架可移動地配置於所述定位結構,而遠離所述定位結構的所述支架表面定義為一承載面;以及多個導電彈性件,分別設置於多個所述定位槽孔,並且每個所述導電彈性件具有位於相反側的一第一端與一第二端;其中,每個所述導電彈性件的所述第一端對應於所述承載面,而每個所述導電彈性件的所述第二端穿出所述支架。 An embodiment of the present invention further discloses a support member of a high-frequency probe card device, which includes: a positioning structure; and a stroke structure, which is movably arranged in the positioning structure, and the stroke structure can be relatively integral to the The positioning structure moves. The stroke structure includes: a bracket with a plurality of through slots formed in the interior, and the bracket is movably arranged in the positioning structure and away from the bracket of the positioning structure The surface is defined as a bearing surface; and a plurality of conductive elastic members are respectively disposed in the plurality of positioning slots, and each of the conductive elastic members has a first end and a second end on opposite sides; wherein, The first end of each conductive elastic member corresponds to the bearing surface, and the second end of each conductive elastic member passes through the bracket.
綜上所述,本發明實施例所公開的高頻探針卡裝置及其壓接模組與支撐件,通過設有相互配合的定位結構與行程結構,據以使所述行程結構可整體相對於上述定位結構移動,而令位於支撐件上方的多個偵測凸塊的位移行程大致相同,使得所述高頻探針卡裝置能有較為精準的偵測結果。 In summary, the high-frequency probe card device, the crimping module and the supporting member disclosed in the embodiments of the present invention are provided with mutually matching positioning structure and stroke structure, so that the stroke structure can be opposite to the whole The above positioning structure moves, so that the displacement strokes of the plurality of detection bumps located above the support member are approximately the same, so that the high-frequency probe card device can have a more accurate detection result.
為能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與附圖,但是此等說明與附圖僅用來說明本發明,而非對本發明的保護範圍作任何的限制。 In order to understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, not to make any protection to the scope of the present invention. limit.
100‧‧‧高頻探針卡裝置 100‧‧‧High frequency probe card device
1‧‧‧支撐件 1‧‧‧Support
11‧‧‧連接板 11‧‧‧Connecting board
111‧‧‧導電線路 111‧‧‧Conducting circuit
112‧‧‧金屬墊 112‧‧‧Metal pad
113‧‧‧金屬接點 113‧‧‧Metal contact
12‧‧‧定位結構 12‧‧‧Positioning structure
121‧‧‧導引銷 121‧‧‧Guide pins
13‧‧‧行程結構 13‧‧‧Stroke structure
131‧‧‧支架 131‧‧‧Bracket
1311‧‧‧承載面 1311‧‧‧ bearing surface
1312‧‧‧軌道槽 1312‧‧‧Track groove
1313‧‧‧定位槽孔 1313‧‧‧Locating slot
132‧‧‧導電彈性件 132‧‧‧ conductive elastic
1321‧‧‧第一端 1321‧‧‧The first end
1322‧‧‧第二端 1322‧‧‧The second end
2‧‧‧傳輸層 2‧‧‧Transport layer
2a‧‧‧第一區塊 2a‧‧‧The first block
2b‧‧‧第二區塊 2b‧‧‧
2c‧‧‧連接區塊 2c‧‧‧Connect block
21c‧‧‧穿孔 21c‧‧‧Perforation
2d‧‧‧電路匹配單元 2d‧‧‧ circuit matching unit
21‧‧‧底層 21‧‧‧Bottom
22‧‧‧頂層 22‧‧‧Top
221‧‧‧接點 221‧‧‧Contact
23‧‧‧傳輸線 23‧‧‧ Transmission line
3、3’、3”‧‧‧偵測凸塊 3. 3’, 3”‧‧‧‧ bump detection
4‧‧‧電路板 4‧‧‧ circuit board
41‧‧‧第一板面 41‧‧‧ First board
411‧‧‧金屬墊 411‧‧‧Metal pad
42‧‧‧第二板面 42‧‧‧Second board
421‧‧‧機台接點 421‧‧‧ machine contact
422‧‧‧傳輸接點 422‧‧‧Transmission contact
43‧‧‧容置孔 43‧‧‧Accommodation hole
44‧‧‧連接孔 44‧‧‧Connecting hole
45‧‧‧增層結構 45‧‧‧Layered structure
5‧‧‧同軸纜線 5‧‧‧Coaxial cable
5a‧‧‧芯線 5a‧‧‧core wire
5b‧‧‧網狀屏蔽層 5b‧‧‧mesh shield
51‧‧‧穿設段 51‧‧‧ Piercing section
52‧‧‧埋置末段 52‧‧‧The last stage of embedding
53‧‧‧外接末段 53‧‧‧External
H‧‧‧高度方向 H‧‧‧ Height direction
圖1為本發明實施例一的高頻探針卡裝置的平面示意圖。 FIG. 1 is a schematic plan view of a high-frequency probe card device according to
圖2為本發明實施例二的高頻探針卡裝置的平面示意圖。 2 is a schematic plan view of a high-frequency probe card device according to
圖3為本發明實施例三的高頻探針卡裝置的平面示意圖。 3 is a schematic plan view of a high-frequency probe card device according to
圖4為本發明實施例四的高頻探針卡裝置的平面示意圖。 4 is a schematic plan view of a high-frequency probe card device according to
圖5為本發明實施例五的高頻探針卡裝置的平面示意圖。 5 is a schematic plan view of a high-frequency probe card device according to
請參閱圖1,其為本發明的實施例,需先說明的是,本實施例對應附圖所提及的相關數量與外型,僅用來具體地說明本發明的實施方式,以便於了解本發明的內容,而非用來侷限本發明的保護範圍。 Please refer to FIG. 1, which is an embodiment of the present invention. It should be noted that this embodiment corresponds to the relevant quantities and appearances mentioned in the drawings, and is only used to specifically illustrate the embodiments of the present invention, in order to facilitate understanding The content of the present invention is not intended to limit the protection scope of the present invention.
如圖1所示,其為本發明的實施例一。本實施例公開一種高頻探針卡裝置100,其能用來測試一待測物(圖未示,如:半導體晶圓)。需先說明的是,為便於理解本實施例,圖式是以上述高頻探針卡裝置100的局部平面示意圖來說明。 As shown in FIG. 1, it is
所述高頻探針卡裝置100包含有一支撐件1、配置於所述支撐件1上的一傳輸層2、設置於所述傳輸層2的多個偵測凸塊3、位置對應於所述支撐件1的一電路板4、及配置於所述傳輸層2與電路板4的一同軸纜線5。以下將分別介紹所述高頻探針卡裝置100的各個元件構造,並適時說明所述高頻探針卡裝置100的各個元件彼此之間的連接關係。 The high-frequency
需先說明的是,上述傳輸層2、多個偵測凸塊3、電路板4、及同軸纜線5於本實施例中也可以共同被定義為一信號傳輸模組,並且本實施例雖是以所述信號傳輸模組搭配於該支撐件1來說明,但本發明不受限於此。舉例來說,在本發明未繪示的其他實施例中,所述信號傳輸模組也可以是單獨地被運用(如:販賣)或搭配其他構件使用。 It should be noted that the
所述支撐件1包含有一連接板11、設置於上述連接板11(相當於承載件)的一定位結構12、及可移動地配置於所述定位結構12的一行程結構13。其中,所述行程結構13能以整體相對於上述定位結構12移動,以使位於支撐件1上方的多個偵測凸塊3的 位移行程大致相同。 The supporting
所述連接板11較佳為可彎折的軟性板材,但本實施例不受限於此。上述連接板11包含有一導電線路111、及分別連接於上述導電線路111兩端的一金屬墊112與一金屬接點113,並且上述金屬墊112與金屬接點113位於連接板11的同側(如:圖1中的連接板11上側);也就是說,所述金屬墊112與金屬接點113通過上述導電線路111而彼此電性連接。 The connecting
所述定位結構12於本實施例中包含有間隔地固定於上述連接板11上的多個導引銷121,並且上述多個導引銷121固定在設有金屬墊112的連接板11部位,但所述金屬墊112較佳是非完全被上述多個導引銷121所覆蓋。 In this embodiment, the
所述行程結構13電性耦接於上述連接板11的金屬墊112,並且遠離上述定位結構12的行程結構13表面(如:圖1中的行程結構13頂面)定義為一承載面1311,而上述承載面1311連接於所述傳輸層2。於本實施例中,所述行程結構13包含有可移動地配置於定位結構12的一支架131以及可伸縮地設置於支架131內的多個導電彈性件132。 The
更詳細地說,遠離所述定位結構12的支架131表面(如:圖1中的支架131頂面)被定義為該承載面1311,而鄰近於上述定位結構12的支架131表面(如:圖1中的支架131底面)凹設形成有多個軌道槽1312。 In more detail, the surface of the
其中,所述支架131以多個軌道槽1312分別組接於定位結構12的多個導引銷121,以使支架131能夠通過該些軌道槽1312與導引銷121的配合、而相對於定位結構12僅沿一高度方向H(如:圖1中的支架131頂面與底面之間的距離方向)移動;但上述支架131與定位結構12之間的配合方式也可以依據設計需求而加以調整變化,並不受限於本實施例所載。舉例來說,在本發明未繪 示的其他實施例中,所述定位結構12可以是包含有多個軌道槽,而所述支架131可以是形成有分別組接於上述多個軌道槽的多個導引銷。 Wherein, the
再者,所述支架131內部形成有(沿上述高度方向H呈)貫穿狀的多個定位槽孔1313,並且多個導電彈性件132分別設置於支架131的多個定位槽孔1313。其中,每個導電彈性件132具有位於相反側的一第一端1321與一第二端1322,並且上述導電彈性件132的第一端1321位置對應(或鄰近)於支架131的承載面1311,而所述導電彈性件132的第二端1322穿出所述支架131(的底面)並抵接於上述連接板11。而於本實施例中,其中一個導電彈性件132的第二端1322是抵接於連接板11的金屬墊112、藉以彼此電性連接。 Furthermore, a plurality of positioning slots 1313 (in the above-mentioned height direction H) penetrating are formed inside the
需說明的是,所述導電彈性件132於本實施例中是以一彈簧針(Pogo-pin)來說明,但導電彈性件132的具體構造於實際應用時也可以依據設計者的需求而加以調整變化,並不受限於本實施例所載。 It should be noted that, in this embodiment, the conductive
所述傳輸層2於本實施例中完全設置在上述支撐件1的承載面1311上,並且傳輸層2為多層堆疊之構造,而本實施例的傳輸層2是以一底層21與堆疊於所述底層21上的一頂層22來說明。其中,所述底層21設置於支撐件1的承載面1311上、並抵接於多個導電彈性件132的第一端1321,而所述傳輸層2於其頂層22內設有多個接點221,並且其中一個接點221延伸至底層21而與抵接於金屬墊112的該導電彈性件132相接。 In this embodiment, the
所述多個偵測凸塊3分別設置於傳輸層2的多個接點221上,也就是說,多個偵測凸塊3與支撐件1分別位於所述傳輸層2的相反兩側。其中,所述偵測凸塊3於本實施例中較佳是不具有彈 性,並且上述偵測凸塊3是用來可分離地頂抵於待測物(圖未示,如:半導體晶圓)。 The plurality of
所述電路板4包含有位於相反兩側的一第一板面41與一第二板面42,並且所述電路板4形成有貫穿上述第一板面41與所述第二板面42的一容置孔43與一連接孔44。其中,所述電路板4的厚度較佳是不大於支撐件1的厚度,並且上述容置孔43的孔徑對應於(如:略大於)支撐件1的寬度,而連接孔44的孔徑對應於(如:略大於)同軸纜線5的寬度。所述容置孔43是大致位於電路板4的中央處,而連接孔44則是位於容置孔43的一側,上述容置孔44的數量可依據測試需求而調整(如:增加),並不受限於圖式所載。 The
更詳細地說,所述電路板4於其第二板面42的一側部位(如:圖1中的第二板面42的右側部位)設有彼此電性耦接的一機台接點421與一傳輸接點422,並且所述電路板4的第二板面42通過機台接點421來電性耦接於一測試機台(圖未示)。 In more detail, the
再者,所述支撐件1的局部(如:定位結構12的至少局部與行程結構13)位於上述電路板4的容置孔43內,所述電路板4的傳輸接點422連接於支撐件1的金屬接點113,以使連接板11連接於所述電路板4的第二板面42;也就是說,所述連接板11的金屬墊112能通過導電線路111與金屬接點113而電性耦接於上述電路板4。據此,所述電路板4能夠通過傳輸層2與支撐件1(的連接板11及其電性耦接的導電彈性件132)而電性耦接於上述多個偵測凸塊3的其中一個偵測凸塊3’(也就是與金屬墊112電性耦接的該偵測凸塊3’)。 Furthermore, a part of the support member 1 (such as at least a part of the
換個角度來說,所述多個導電彈性件132的其中一個導電彈性件132的第一端1321抵接於傳輸層2而電性耦接於電路板4所對應的偵測凸塊3’,而其所述第二端1322穿出支架131並抵接於上述連接板11的金屬墊112。 In other words, the
所述同軸纜線5包含有一芯線5a、將上述芯線5a埋置於內的一絕緣層(圖未示)、圍繞於所述芯線5a外側且包覆於絕緣層外的一網狀屏蔽層5b、及包覆於上述網狀屏蔽層5b外的一塑料封套(圖未示)。當所述同軸纜線5改成與其他構件之間的連接關係來看時,所述同軸纜線5包含有一穿設段51及位於上述穿設段51相反兩側的一埋置末段52與一外接末段53。 The
其中,所述同軸纜線5的穿設段51位於電路板4的連接孔44內,所述埋置末段52埋設固定於傳輸層2內(位於底層21與頂層22之間),並且位於埋置末段52的芯線5a部位電性耦接於多個偵測凸塊3的其中一個偵測凸塊3”。而所述外接末段53穿出於上述電路板4的第二板面42且用來電性耦接於測試機台。而於本實施例中,所述同軸纜線5是以其位於埋置末段52的芯線5a部位與網狀屏蔽層5b部位分別電性耦接於多個偵測凸塊3的其中兩個所述偵測凸塊3”;也就是說,所述芯線5a與網狀屏蔽層5b是分別電性耦接於不同的偵測凸塊3”,並且上述芯線5a與網狀屏蔽層5b所電性耦接的偵測凸塊3”也不同於電路板4所電性耦接的偵測凸塊3’。 Wherein, the
據此,上述芯線5a電性耦接的該偵測凸塊3”能夠將其所偵測到的信號通過同軸纜線5直接傳輸至測試機台,藉以具備有較佳的傳輸效果。而上述芯線5a與相對應的偵測凸塊3”於本實施例中較佳是用來傳輸一高頻信號。 According to this, the
進一步地說,上述外接末段53可以設有一同軸接頭,藉以能夠插設於測試機台來達成電性耦接,所述埋置末段52的長度方向與所述穿設段51的長度方向較佳是相夾有介於80度~100度的一夾角。再者,本實施例中的高頻探針卡裝置100較佳是無須設有任何電容器或電感器,但本發明不以此為限。 Further, the
如圖2所示,其為本發明的實施例二,本實施例類似於上述實施例一,兩個實施例的相同處則不再加以贅述,而本實施例相較於上述實施例一的差異主要在於:所述傳輸層2與支撐件1的結構。 As shown in FIG. 2, this is the second embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared to the above-mentioned first embodiment. The difference mainly lies in the structure of the
所述電路板4與相對應的偵測凸塊3’於本實施例中僅通過所述傳輸層2而彼此電性耦接;也就是說,所述傳輸層2與導電彈性件132之間並未有電性上的連接,並且所述多個導電彈性件132僅用來提供支撐件1於往復位移時所需的彈力、但未作為信號傳輸使用。再者,所述連接板11僅用來作為定位結構12的承載件使用、但未設有做為電性傳輸用的導電線路111、金屬墊112、與金屬接點113。 In this embodiment, the
更詳細地說,所述傳輸層2於本實施例中包含有一第一區塊2a、一第二區塊2b、位於所述第一區塊2a與第二區塊2b之間的一連接區塊2c、及設置於所述連接區塊2c的一電路匹配單元2d。其中,所述第一區塊2a完全設置在支撐件1的承載面1311上,並且多個偵測凸塊3設置於所述第一區塊2a上;也就是說,所述第一區塊2a相當於上述實施例一的傳輸層2,而所述連接區塊2c與第二區塊2b則是相當於由第一區塊2a的頂層22朝向外側一體地延伸所形成。 More specifically, in this embodiment, the
所述連接區塊2c的局部位於上述電路板4的容置孔43內、且位於支撐件1與電路板4的容置孔43孔壁之間。其中,所述連接區塊2c形成有一穿孔21c,並且上述穿孔21c位於容置孔43外且鄰近所述第一區塊2a,以使所述同軸纜線5穿過上述連接區塊2c的穿孔21c。 The
所述第二區塊2b連接於上述電路板4的第二板面42(如:金屬接點113),所述傳輸層2於本實施例中設有自第一區塊2a延伸至第二區塊2b的至少一傳輸線23,並且電路板4所對應的偵測凸 塊3’設置於所述傳輸線23上,以使電路板4及其相對應的偵測凸塊3’能通過傳輸層2的傳輸線23來達成電性耦接。 The
再者,所述電路匹配單元2d(如:電容器或/及電感器)安裝於連接區塊2c上的傳輸層2部位、並鄰近於所述第一區塊2a。其中,所述電路匹配單元2d電性耦接於所述電路板4與相對應的偵測凸塊3’,以通過上述電路匹配單元2d來調整特性阻抗,進而達到阻抗匹配的效果。 Furthermore, the
如圖3所示,其為本發明的實施例三,本實施例類似於上述實施例二,兩個實施例的相同處則不再加以贅述,而本實施例相較於上述實施例二的差異主要在於:本實施例的高頻探針卡裝置100未包含有同軸纜線5及其相對應構造(如:連接孔44、穿孔21c、接點221)。 As shown in FIG. 3, it is the third embodiment of the present invention. This embodiment is similar to the above-mentioned second embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared with the above-mentioned second embodiment. The main difference is that the high-frequency
更詳細地說,所述傳輸層2上的傳輸線23為圖案化的傳輸構造,並且所述多個偵測凸塊3皆設置於上述傳輸線23,藉以使本實施例的所有偵測凸塊3僅可通過所述傳輸層2而與電路板4達成電性耦接。也就是說,本實施例中的多個偵測凸塊3皆是與電路板4電性耦接的偵測凸塊3’。需說明的是,所述多個偵測凸塊3’能通過傳輸線23的圖案化,以使上述多個偵測凸塊3各自獨立地電性耦接於電路板4。 In more detail, the
再者,所述傳輸層2與導電彈性件132之間並未有電性上的連接,並且所述多個導電彈性件132僅用來提供支撐件1於往復位移時所需的彈力、但未作為信號傳輸使用。 Furthermore, there is no electrical connection between the
如圖4所示,其為本發明的實施例四,本實施例類似於上述實施例一,兩個實施例的相同處則不再加以贅述,而本實施例相 較於上述實施例一的差異主要在於:所述電路板4及其與支撐件1之間的對應關係,並且本實施例的支撐件1未包含有上述連接板11。 As shown in FIG. 4, this is the fourth embodiment of the present invention. This embodiment is similar to the above-mentioned first embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared to the above-mentioned first embodiment. The difference mainly lies in: the corresponding relationship between the
所述電路板4於本實施例中包含有位於第一板面41且電性耦接至所述第二板面42的至少一個金屬墊411。其中,本實施例的金屬墊411數量為多個,並且電路板4也於第二板面42設有電性耦接至機台接點421的多個傳輸接點422,而上述多個金屬墊411分別電性耦接至所述第二板面42的多個傳輸接點422。 In this embodiment, the
再者,所述傳輸層2與電路板4分別位於支撐件1的相反兩側,所述電路板4與相對應的偵測凸塊3’通過上述傳輸層2與支撐件1而彼此電性耦接。其中,所述支撐件1的定位結構12設置於上述電路板4的第一板面41、且鄰近於上述多個金屬墊411,而所述行程結構13可移動地配置於上述定位結構12、並電性耦接於所述多個金屬墊411,據以令所述行程結構13能以整體相對於定位結構12移動,以使所述多個偵測凸塊3能同步移動且其位移行程大致相同。 Furthermore, the
更詳細地說,上述多個導電彈性件132的第一端1321抵接於所述傳輸層2而電性耦接於上述電路板4所對應的偵測凸塊3’,而多個導電彈性件132的第二端1322穿出所述支架131並分別抵接於多個金屬墊411。 In more detail, the first ends 1321 of the plurality of conductive
如圖5所示,其為本發明的實施例五,本實施例類似於上述實施例四,兩個實施例的相同處則不再加以贅述,而本實施例相較於上述實施例四的差異主要在於:所述電路板4的結構。 As shown in FIG. 5, this is the fifth embodiment of the present invention. This embodiment is similar to the above-mentioned fourth embodiment, and the similarities between the two embodiments will not be repeated, and this embodiment is compared with the above-mentioned fourth embodiment. The difference mainly lies in the structure of the
所述電路板4進一步包含有一增層結構45,並且所述增層結構45位於電路板4遠離第二板面42的部位(如:電路板4頂部),而所述增層結構45的外表面定義為上述第一板面41。其中,上述 多個金屬墊411設置於增層結構45,並且所述支撐件1的定位結構12也設置於電路板4的增層結構45上。此外,所述增層結構45於本實施例中是以位於電路板4頂部來說明,但本發明不以此為限。舉例來說:在本發明未繪示的其他實施例中,所述電路板5也可以在其底部進一步設有增層結構45。 The
綜上所述,本發明實施例所公開的高頻探針卡裝置100及其信號傳輸模組,通過上述傳輸層2與電路板4設置固定有該同軸纜線5,以使上述同軸纜線5的芯線5a所電性耦接的該偵測凸塊3、3’、3”,能夠將其所偵測到的信號(如:高頻信號)通過同軸纜線5直接傳輸至測試機台,藉以具備有較佳的傳輸效果。 In summary, the high-frequency
再者,本發明實施例所公開的高頻探針卡裝置100能提供包含有定位結構12與行程結構13的支撐件1,據以通過所述行程結構13可整體相對於上述定位結構12移動,而令位於支撐件1上方的多個偵測凸塊3、3’、3”的位移行程大致相同,使得所述高頻探針卡裝置100能有較為精準的偵測結果。 Furthermore, the high-frequency
以上所述僅為本發明的優選可行實施例,並非用來侷限本發明的保護範圍,凡依本發明專利範圍所做的均等變化與修飾,皆應屬本發明的權利要求書的保護範圍。 The above are only the preferred and feasible embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any changes and modifications made within the scope of the patent of the present invention shall fall within the scope of protection of the claims of the present invention.
100‧‧‧高頻探針卡裝置 100‧‧‧High frequency probe card device
1‧‧‧支撐件 1‧‧‧Support
11‧‧‧連接板 11‧‧‧Connecting board
12‧‧‧定位結構 12‧‧‧Positioning structure
121‧‧‧導引銷 121‧‧‧Guide pins
13‧‧‧行程結構 13‧‧‧Stroke structure
131‧‧‧支架 131‧‧‧Bracket
1311‧‧‧承載面 1311‧‧‧ bearing surface
1312‧‧‧軌道槽 1312‧‧‧Track groove
1313‧‧‧定位槽孔 1313‧‧‧Locating slot
132‧‧‧導電彈性件 132‧‧‧ conductive elastic
1321‧‧‧第一端 1321‧‧‧The first end
1322‧‧‧第二端 1322‧‧‧The second end
2‧‧‧傳輸層 2‧‧‧Transport layer
2a‧‧‧第一區塊 2a‧‧‧The first block
2b‧‧‧第二區塊 2b‧‧‧
2c‧‧‧連接區塊 2c‧‧‧Connect block
2d‧‧‧電路匹配單元 2d‧‧‧ circuit matching unit
21‧‧‧底層 21‧‧‧Bottom
22‧‧‧頂層 22‧‧‧Top
23‧‧‧傳輸線 23‧‧‧ Transmission line
3、3’‧‧‧偵測凸塊 3. 3’‧‧‧ bump detection
4‧‧‧電路板 4‧‧‧ circuit board
41‧‧‧第一板面 41‧‧‧ First board
42‧‧‧第二板面 42‧‧‧Second board
421‧‧‧機台接點 421‧‧‧ machine contact
422‧‧‧傳輸接點 422‧‧‧Transmission contact
43‧‧‧容置孔 43‧‧‧Accommodation hole
H‧‧‧高度方向 H‧‧‧ Height direction
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