TW202005724A - Cleaning system, cleaning apparatus and cleaning method - Google Patents

Cleaning system, cleaning apparatus and cleaning method Download PDF

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TW202005724A
TW202005724A TW107124436A TW107124436A TW202005724A TW 202005724 A TW202005724 A TW 202005724A TW 107124436 A TW107124436 A TW 107124436A TW 107124436 A TW107124436 A TW 107124436A TW 202005724 A TW202005724 A TW 202005724A
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mold
retaining wall
cleaning
item
patent application
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TW107124436A
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TWI734015B (en
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張瑞堂
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奇景光電股份有限公司
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Abstract

A cleaning system including a cleaning apparatus and a mold is provided. The cleaning apparatus includes a containing structure having a bottom surface and a wall. The wall extends from the bottom surface and forms a containing tank. The containing tank is suitable for containing a cleaning fluid. The mold is suitable for being supported by a top end of the wall and contacting the cleaning fluid. A cleaning method is also provided.

Description

清洗系統、清洗裝置及清洗方法Cleaning system, cleaning device and cleaning method

本發明是有關於一種清洗系統、清洗裝置及清洗方法，且特別是有關於一種用於清洗模具的清洗系統、清洗裝置及清洗方法。The invention relates to a cleaning system, a cleaning device and a cleaning method, and in particular to a cleaning system, a cleaning device and a cleaning method for cleaning a mold.

在一些晶圓製程中，利用模具將工作圖樣(working stamp)翻印至晶圓上，但模具會因翻印次數增加而造成模具表面殘留金屬缺陷以及殘膠，使得工作圖樣翻印的良率下降，所以必須適度地進行模具的清洗。習知清洗方法將模具浸入清洗液中以清除金屬缺陷，此種清洗方法容易使模具的邊緣產生剝離(peeling)現象，造成模具的損壞。In some wafer manufacturing processes, the mold is used to reprint the working stamp on the wafer, but the mold will cause metal defects and residual glue on the surface of the mold due to the increase in the number of reprints, which reduces the yield of the work pattern. The mold must be cleaned appropriately. Conventional cleaning methods immerse the mold in the cleaning liquid to remove metal defects. This cleaning method is likely to cause peeling of the edges of the mold and cause damage to the mold.

本發明提供一種清洗系統、清洗裝置及清洗方法，可在清洗模具時避免模具的邊緣產生剝離現象。The invention provides a cleaning system, a cleaning device and a cleaning method, which can avoid peeling of the edges of the mold when cleaning the mold.

本發明的清洗系統包括一清洗裝置以及一模具。清洗裝置包括一容納結構，其中容納結構具有一底面及一擋牆，擋牆從底面延伸出而形成一容納槽，容納槽適於容納一清洗液。模具適於被支撐於擋牆的一頂端並接觸清洗液。The cleaning system of the present invention includes a cleaning device and a mold. The cleaning device includes an accommodating structure, wherein the accommodating structure has a bottom surface and a retaining wall, the retaining wall extends from the bottom surface to form an accommodating groove, and the accommodating groove is suitable for accommodating a cleaning liquid. The mold is adapted to be supported on a top end of the retaining wall and contact the cleaning liquid.

在本發明的一實施例中，上述的模具的外徑大於容納槽的外徑。In an embodiment of the invention, the outer diameter of the above-mentioned mold is larger than the outer diameter of the accommodating groove.

在本發明的一實施例中，上述的清洗裝置更包括一限位結構，限位結構至少部分地圍繞容納槽且具有一限位面，當模具被支撐於擋牆的頂端時，限位面抵靠模具的至少部分周緣。In an embodiment of the present invention, the above-mentioned cleaning device further includes a limit structure, which at least partially surrounds the receiving slot and has a limit surface, when the mold is supported on the top of the retaining wall, the limit surface Against at least part of the periphery of the mold.

在本發明的一實施例中，上述的限位面與底面之間的距離大於擋牆的頂端與底面之間的距離。In an embodiment of the invention, the distance between the above-mentioned limiting surface and the bottom surface is greater than the distance between the top and bottom surface of the retaining wall.

在本發明的一實施例中，上述的限位結構具有至少一導引斜面，導引斜面鄰接限位面且適於導引模具至擋牆的頂端。In an embodiment of the invention, the above-mentioned limiting structure has at least one guiding slope, the guiding slope is adjacent to the limiting surface and is suitable for guiding the mold to the top of the retaining wall.

在本發明的一實施例中，上述的導引斜面傾斜於底面且傾斜於限位面。In an embodiment of the invention, the above-mentioned guiding slope is inclined to the bottom surface and to the limiting surface.

在本發明的一實施例中，上述的限位面垂直於底面。In an embodiment of the invention, the above-mentioned limiting surface is perpendicular to the bottom surface.

在本發明的一實施例中，上述的限位結構具有至少一缺口，缺口對位於容納結構的部分周緣。In an embodiment of the invention, the above-mentioned limiting structure has at least one notch, and the notch is located on a part of the periphery of the accommodating structure.

在本發明的一實施例中，上述的清洗裝置包括一氣體提供單元，氣體提供單元適於提供氣體至擋牆的頂端，以使模具分離於擋牆。In an embodiment of the present invention, the cleaning device described above includes a gas supply unit. The gas supply unit is adapted to supply gas to the top of the retaining wall to separate the mold from the retaining wall.

在本發明的一實施例中，上述的模具的一下表面接觸清洗液，部分清洗液適於沿下表面移至容納槽外。In an embodiment of the present invention, the lower surface of the above-mentioned mold contacts the cleaning liquid, and part of the cleaning liquid is suitable for moving out of the containing groove along the lower surface.

本發明的清洗裝置包括一容納結構以及一限位結構。容納結構具有一底面及一擋牆，其中擋牆從底面延伸出而形成一容納槽，容納槽適於容納一清洗液，一模具適於被支撐於擋牆的一頂端並接觸清洗液。限位結構至少部分地圍繞容納槽且具有一限位面，其中當模具被支撐於擋牆的頂端時，限位面抵靠模具的至少部分周緣。The cleaning device of the present invention includes an accommodating structure and a limiting structure. The accommodating structure has a bottom surface and a retaining wall, wherein the retaining wall extends from the bottom surface to form an accommodating groove, the accommodating groove is suitable for accommodating a cleaning liquid, and a mold is suitable for being supported on a top end of the retaining wall and contacting the cleaning liquid. The limiting structure at least partially surrounds the accommodating groove and has a limiting surface, wherein when the mold is supported on the top of the retaining wall, the limiting surface abuts at least part of the periphery of the mold.

在本發明的一實施例中，上述的限位面與底面之間的距離大於擋牆的頂端與底面之間的距離。In an embodiment of the invention, the distance between the above-mentioned limiting surface and the bottom surface is greater than the distance between the top and bottom surface of the retaining wall.

在本發明的一實施例中，上述的限位結構具有至少一導引斜面，導引斜面鄰接限位面且適於導引模具至擋牆的頂端。In an embodiment of the invention, the above-mentioned limiting structure has at least one guiding slope, the guiding slope is adjacent to the limiting surface and is suitable for guiding the mold to the top of the retaining wall.

在本發明的一實施例中，上述的導引斜面傾斜於底面且傾斜於限位面。In an embodiment of the invention, the above-mentioned guiding slope is inclined to the bottom surface and to the limiting surface.

在本發明的一實施例中，上述的限位面垂直於底面。In an embodiment of the invention, the above-mentioned limiting surface is perpendicular to the bottom surface.

在本發明的一實施例中，上述的限位結構具有至少一缺口，缺口對位於容納結構的部分周緣。In an embodiment of the invention, the above-mentioned limiting structure has at least one notch, and the notch is located on a part of the periphery of the accommodating structure.

在本發明的一實施例中，上述的清洗裝置包括一氣體提供單元，其中氣體提供單元適於提供氣體至擋牆的頂端，以使模具分離於擋牆。In an embodiment of the invention, the above-mentioned cleaning device includes a gas supply unit, wherein the gas supply unit is adapted to supply gas to the top of the retaining wall to separate the mold from the retaining wall.

本發明的清洗方法包括以下步驟。提供一容納結構，其中容納結構具有一底面及一擋牆，擋牆從底面延伸出而形成一容納槽。藉由容納槽容納一清洗液。藉由擋牆的一頂端支撐一模具，以使模具接觸清洗液。The cleaning method of the present invention includes the following steps. An accommodating structure is provided, wherein the accommodating structure has a bottom surface and a retaining wall, and the retaining wall extends from the bottom surface to form an accommodating groove. A cleaning liquid is accommodated by the accommodating tank. A mold is supported by a top end of the retaining wall so that the mold contacts the cleaning liquid.

在本發明的一實施例中，上述的清洗方法包括以下步驟。當模具被支撐於擋牆的頂端時，藉由一限位結構的一限位面抵靠模具的至少部分周緣。In an embodiment of the invention, the above cleaning method includes the following steps. When the mold is supported on the top of the retaining wall, a limiting surface of a limiting structure abuts at least part of the periphery of the mold.

在本發明的一實施例中，上述的清洗方法包括以下步驟。藉由限位結構的一導引斜面導引模具至擋牆的頂端。In an embodiment of the invention, the above cleaning method includes the following steps. The mold is guided to the top of the retaining wall by a guiding slope of the limit structure.

在本發明的一實施例中，上述的清洗方法包括以下步驟。藉由一氣體提供單元提供氣體至擋牆的頂端，以使模具分離於擋牆。In an embodiment of the invention, the above cleaning method includes the following steps. A gas supply unit provides gas to the top of the retaining wall to separate the mold from the retaining wall.

在本發明的一實施例中，上述的清洗方法包括以下步驟。使模具的一下表面接觸清洗液。使清洗液沿模具的下表面移至容納槽外。In an embodiment of the invention, the above cleaning method includes the following steps. Make one surface of the mold contact the cleaning liquid. The cleaning liquid is moved out of the containing tank along the lower surface of the mold.

基於上述，本發明的清洗系統使模具表面接觸清洗液，藉以清除模具表面的金屬缺陷，且由於模具是被支撐於容納槽之擋牆的頂端而非浸入容納槽內的清洗液中，故模具的邊緣不會與清洗液接觸。藉此，在清洗模具表面的同時避免了模具的邊緣產生剝離現象。Based on the above, the cleaning system of the present invention makes the surface of the mold contact with the cleaning liquid to remove metal defects on the surface of the mold, and because the mold is supported on the top of the retaining wall of the receiving tank instead of being immersed in the cleaning liquid in the receiving tank, the mold Will not come into contact with the cleaning fluid. In this way, peeling of the edges of the mold is avoided while cleaning the surface of the mold.

為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more obvious and understandable, the embodiments are specifically described below in conjunction with the accompanying drawings for detailed description as follows.

圖1是本發明一實施例的清洗系統的立體圖。圖2是圖1的清洗裝置的立體圖。圖3是圖1的清洗系統的局部示意圖。請參考圖1至圖3，本實施例的清洗系統100包括一清洗裝置110以及一模具120。清洗裝置110包括一容納結構111。容納結構111具有一底面111a及一擋牆111b，擋牆111b從底面111a延伸出而形成一容納槽111d，容納槽111d適於容納一清洗液C。清洗液C例如是強鹼清潔液，適於清除例如是鎳金屬的髒汙或是殘膠。模具120的外徑大於容納槽111d的外徑，使模具120適於被支撐於擋牆111b的一頂端111c並接觸清洗液C。在本實施例中，清洗裝置110被承載於一基座130，但在其他未示出的實施例中並不以此為限。FIG. 1 is a perspective view of a cleaning system according to an embodiment of the invention. Fig. 2 is a perspective view of the cleaning device of Fig. 1. 3 is a partial schematic view of the cleaning system of FIG. Please refer to FIGS. 1 to 3. The cleaning system 100 of this embodiment includes a cleaning device 110 and a mold 120. The cleaning device 110 includes a receiving structure 111. The accommodating structure 111 has a bottom surface 111a and a retaining wall 111b. The retaining wall 111b extends from the bottom surface 111a to form an accommodating groove 111d. The accommodating groove 111d is suitable for accommodating a cleaning liquid C. The cleaning liquid C is, for example, a strong alkaline cleaning liquid, which is suitable for removing dirt or residual glue such as nickel metal. The outer diameter of the mold 120 is larger than the outer diameter of the accommodating groove 111d, so that the mold 120 is adapted to be supported on a top 111c of the retaining wall 111b and contact the cleaning liquid C. In this embodiment, the cleaning device 110 is carried on a base 130, but in other embodiments not shown, it is not limited thereto.

本實施例的模具120例如是用以在晶圓製程中將工作圖樣翻印至晶圓上。具體而言，本實施例的模具120例如是由石英基材及形成於石英基材表面的鎳工作圖樣所組成，以利用模具120將工作圖樣翻印至晶圓上。隨著翻印次數增加，需要清理模具120表面所殘留的金屬缺陷以及殘膠。如上述般將模具120放置於擋牆111b的頂端111c，可使模具120的具有工作圖樣的下表面121接觸容納槽111d內的清洗液C，以清除留在下表面121的髒汙。The mold 120 of this embodiment is used to reprint the working pattern onto the wafer during the wafer manufacturing process, for example. Specifically, the mold 120 in this embodiment is composed of, for example, a quartz substrate and a nickel working pattern formed on the surface of the quartz substrate, so that the working pattern is printed on the wafer by the mold 120. As the number of reprints increases, it is necessary to clean the metal defects and residual glue remaining on the surface of the mold 120. By placing the mold 120 on the top 111c of the retaining wall 111b as described above, the lower surface 121 of the mold 120 having the working pattern can contact the cleaning liquid C in the accommodating tank 111d to remove the dirt remaining on the lower surface 121.

由於模具120被支撐於擋牆111b的頂端111c而非浸入容納槽111d內的清洗液C中，故模具120的周緣122不會接觸到清洗液C。藉此，在清洗模具120表面的同時避免了模具120的邊緣產生剝離現象。Since the mold 120 is supported by the top end 111c of the retaining wall 111b instead of being immersed in the cleaning liquid C in the accommodating tank 111d, the peripheral edge 122 of the mold 120 does not contact the cleaning liquid C. In this way, the surface of the mold 120 is cleaned while peeling off the edges of the mold 120 is avoided.

在本實施例中，清洗裝置110包括一限位結構112。所述限位結構112至少部分地圍繞容納槽111d。當模具120被支撐於擋牆111b的頂端111c時，限位結構112抵靠模具120的至少部分周緣122，以固定模具120的位置。In this embodiment, the cleaning device 110 includes a limiting structure 112. The limiting structure 112 at least partially surrounds the receiving groove 111d. When the mold 120 is supported on the top end 111c of the retaining wall 111b, the limiting structure 112 abuts at least a part of the peripheral edge 122 of the mold 120 to fix the position of the mold 120.

詳細而言，本實施例的限位結構112具有一限位面112a，限位面112a垂直於容納結構111的底面111a，且限位面112a與底面111a之間的距離大於擋牆111b的頂端111c與底面111a之間的距離。當模具120放置於擋牆111b的頂端111c時，限位結構112藉其限位面112a抵靠模具120的周緣122，以防止了模具120在清洗裝置110上產生非預期的橫向滑動。In detail, the limiting structure 112 of this embodiment has a limiting surface 112a, the limiting surface 112a is perpendicular to the bottom surface 111a of the receiving structure 111, and the distance between the limiting surface 112a and the bottom surface 111a is greater than the top of the retaining wall 111b The distance between 111c and the bottom surface 111a. When the mold 120 is placed on the top 111c of the retaining wall 111b, the limiting structure 112 abuts the peripheral edge 122 of the mold 120 by its limiting surface 112a, so as to prevent the mold 120 from unintended lateral sliding on the cleaning device 110.

另外，限位結構112更具有一導引斜面112b。導引斜面112b相較於限位面112a更加地遠離於底面111a，且鄰接限位面112a。並且，導引斜面112b傾斜於容納結構111的底面111a且傾斜於限位面112a。當使用者放置模具120至清洗裝置110時，導引斜面112b適於導引模具120至擋牆111b的頂端111c，並將模具120的周緣122導引至限位面112a使其與限位面112a互相抵靠。藉此，當使用者將模具120置於清洗狀置110上方時，不需要刻意地將模具120的周緣122對準限位面112a，只需大致地放置，導引斜面112b會使得模具120藉由重力順勢地滑入而抵靠於限位面112a並支撐於擋牆111b的頂端111c。In addition, the limiting structure 112 further has a guiding slope 112b. The guiding slope 112b is farther away from the bottom surface 111a than the limiting surface 112a, and is adjacent to the limiting surface 112a. Moreover, the guiding slope 112b is inclined to the bottom surface 111a of the accommodating structure 111 and to the limiting surface 112a. When the user places the mold 120 to the cleaning device 110, the guiding slope 112b is suitable for guiding the mold 120 to the top end 111c of the retaining wall 111b, and guiding the peripheral edge 122 of the mold 120 to the limiting surface 112a so that it and the limiting surface 112a leans against each other. In this way, when the user places the mold 120 above the cleaning position 110, there is no need to deliberately align the peripheral edge 122 of the mold 120 with the limiting surface 112a, but only to place it roughly, and the guiding slope 112b will cause the mold 120 to borrow It slides in by gravity to lean against the limiting surface 112a and is supported by the top end 111c of the retaining wall 111b.

在本實施例中，限位結構112對稱地設置並部分地圍繞於容納槽111d的兩側。限位結構112在其未圍繞容納槽111d的部分形成了兩個缺口112c，缺口112c對位於容納結構111的部分周緣。當模具120放置於容納結構111上時，使用者可藉由缺口112c的設計施力於模具120，以將模具120與容納結構111分離。In this embodiment, the limiting structure 112 is symmetrically arranged and partially surrounds both sides of the receiving groove 111d. The limiting structure 112 has two notches 112c formed on the portion of the limiting structure 112 that does not surround the accommodating groove 111d. The notches 112c are located on the periphery of the accommodating structure 111. When the mold 120 is placed on the accommodating structure 111, the user can apply force to the mold 120 through the design of the notch 112c to separate the mold 120 from the accommodating structure 111.

以下以圖1至圖3的實施例，說明本發明的清洗方法。圖4是對應於圖1的清洗系統的清洗方法流程圖。請參考圖1至圖4，首先，提供一容納結構111，其中容納結構111具有一底面111a及一擋牆111b，擋牆111b從底面111a延伸出而形成一容納槽111d(步驟S301)。接著，藉由容納槽111d容納一清洗液C(步驟S302)。隨後藉由擋牆111b的一頂端111c支撐一模具120，以使模具120接觸清洗液C(步驟S303)。The cleaning method of the present invention will be described below with the embodiments of FIGS. 1 to 3. 4 is a flowchart of a cleaning method corresponding to the cleaning system of FIG. 1. Please refer to FIGS. 1 to 4. First, a receiving structure 111 is provided. The receiving structure 111 has a bottom surface 111 a and a retaining wall 111 b. The retaining wall 111 b extends from the bottom surface 111 a to form a receiving groove 111 d (step S301 ). Next, a cleaning liquid C is accommodated in the accommodating tank 111d (step S302). Then, a mold 120 is supported by a top 111c of the retaining wall 111b, so that the mold 120 contacts the cleaning solution C (step S303).

為了使模具120的下表面121接觸清洗液C，在所述步驟S302中藉由容納槽111d容納清洗液C時，可使清洗液C的液面高度略高於擋牆111b的頂端111c，利用表面張力的特性使清洗液C停留在容納槽111d內。而在所述步驟S303中藉由擋牆111b的頂端111c支撐模具120時，高於擋牆111b的頂端111c的多餘的清洗液C會沿著模具120的下表面121移至容納槽111d外，以使容納槽111d內不存在多餘的空氣而呈現真空狀態。藉此，能確保模具120的下表面121對位於容納槽111d的部分能完全接觸到清洗液C，同時能確保模具120在清洗裝置110上的穩固性。In order to make the lower surface 121 of the mold 120 contact the cleaning liquid C, when the cleaning liquid C is contained in the containing tank 111d in the step S302, the liquid level of the cleaning liquid C may be slightly higher than the top 111c of the retaining wall 111b. The characteristic of the surface tension causes the cleaning liquid C to stay in the containing tank 111d. When the mold 120 is supported by the top 111c of the retaining wall 111b in the step S303, the excess cleaning solution C higher than the top 111c of the retaining wall 111b will move out of the accommodating groove 111d along the lower surface 121 of the mold 120. So that there is no excess air in the accommodating tank 111d, it will be in a vacuum state. As a result, the lower surface 121 of the mold 120 can fully contact the cleaning liquid C with the portion located in the receiving groove 111d, and at the same time, the stability of the mold 120 on the cleaning device 110 can be ensured.

圖5是本發明另一實施例的清洗系統的局部示意圖。請參考圖5，本實施例的清洗裝置110更包括一氣體提供單元113。氣體提供單元113適於提供氣體至擋牆111b的頂端111c。當氣體被提供至擋牆111b的頂端111c時，模具120與擋牆111b的頂端111c之間會產生氣泡以破除模具120與清洗裝置110之間的真空狀態，利於使用者以較為省力的方式將模具120與清洗裝置110分離。氣體提供單元113可如圖2所示設置於清洗裝置110內並對位於模具120的下表面121與擋牆111b頂端111c的接觸處，也可以***(圖中未示出)的形式另外配置，本發明不對此加以限制。另外，氣體提供單元113所提供的氣體例如是氮氣等的低活性氣體。5 is a partial schematic diagram of a cleaning system according to another embodiment of the invention. Referring to FIG. 5, the cleaning device 110 of this embodiment further includes a gas supply unit 113. The gas supply unit 113 is adapted to supply gas to the top end 111c of the retaining wall 111b. When gas is supplied to the top 111c of the retaining wall 111b, air bubbles are generated between the mold 120 and the top 111c of the retaining wall 111b to break the vacuum state between the mold 120 and the cleaning device 110, which is convenient for the user to save energy The mold 120 is separated from the cleaning device 110. The gas supply unit 113 may be provided in the cleaning device 110 as shown in FIG. 2 and located at the contact point between the lower surface 121 of the mold 120 and the top 111c of the retaining wall 111b, or may be additionally configured in the form of an air gun (not shown). The present invention does not limit this. In addition, the gas provided by the gas supply unit 113 is, for example, a low-activity gas such as nitrogen.

綜上所述，本發明的清洗系統使模具表面接觸清洗液，藉以清除模具表面的金屬缺陷，且由於模具是被支撐於容納槽之擋牆的頂端而非浸入容納槽內的清洗液中，故模具的邊緣不會與清洗液接觸。藉此，在清洗模具表面的同時避免了模具的邊緣產生剝離現象。In summary, the cleaning system of the present invention makes the surface of the mold contact with the cleaning liquid to remove metal defects on the surface of the mold, and because the mold is supported on the top of the retaining wall of the receiving tank instead of being immersed in the cleaning liquid in the receiving tank, Therefore, the edges of the mold will not come into contact with the cleaning fluid. In this way, peeling of the edges of the mold is avoided while cleaning the surface of the mold.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed as above with examples, it is not intended to limit the present invention. Any person with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be subject to the scope defined in the appended patent application.

100‧‧‧清洗系統110‧‧‧清洗裝置111‧‧‧容納結構111a‧‧‧底面111b‧‧‧擋牆111c‧‧‧頂端111d‧‧‧容納槽112‧‧‧限位結構112a‧‧‧限位面112b‧‧‧導引斜面112c‧‧‧缺口113‧‧‧氣體提供單元120‧‧‧模具121‧‧‧下表面122‧‧‧周緣130‧‧‧基座C‧‧‧清洗液100‧‧‧Cleaning system 110‧‧‧Cleaning device 111‧‧‧accommodating structure 111a‧‧‧bottom surface 111b‧‧‧retaining wall 111c‧‧‧top 111d‧‧‧accommodating groove 112‧‧‧limiting structure 112a‧‧ ‧Limiting surface 112b‧‧‧Guide slope 112c‧‧‧Notch 113‧‧‧Gas supply unit 120‧‧‧Mold 121‧‧‧Lower surface 122‧‧‧Periphery 130‧‧‧Base C‧‧‧Clean liquid

圖1是本發明一實施例的清洗系統的立體圖。 圖2是圖的清洗裝置的立體圖。 圖3是圖2中的清洗系統的局部示意圖。 圖4是對應於圖1的清洗系統的清洗方法流程圖。 圖5是本發明另一實施例的清洗系統的局部示意圖。FIG. 1 is a perspective view of a cleaning system according to an embodiment of the invention. FIG. 2 is a perspective view of the cleaning device of FIG. FIG. 3 is a partial schematic diagram of the cleaning system in FIG. 2. 4 is a flowchart of a cleaning method corresponding to the cleaning system of FIG. 1. 5 is a partial schematic diagram of a cleaning system according to another embodiment of the invention.

100‧‧‧清洗系統 100‧‧‧cleaning system

110‧‧‧清洗裝置 110‧‧‧cleaning device

111‧‧‧容納結構 111‧‧‧Accommodation structure

111a‧‧‧底面 111a‧‧‧Bottom

111b‧‧‧擋牆 111b‧‧‧Retaining wall

111c‧‧‧頂端 111c‧‧‧Top

111d‧‧‧容納槽 111d‧‧‧accommodation tank

112‧‧‧限位結構 112‧‧‧Limit structure

112a‧‧‧限位面 112a‧‧‧Limit surface

112b‧‧‧導引斜面 112b‧‧‧Guide slope

120‧‧‧模具 120‧‧‧Mould

121‧‧‧下表面 121‧‧‧Lower surface

122‧‧‧周緣 122‧‧‧periphery

130‧‧‧基座 130‧‧‧Dock

C‧‧‧清洗液 C‧‧‧Cleaning fluid

Claims (22)

一種清洗系統，包括： 一清洗裝置，包括一容納結構，其中該容納結構具有一底面及一擋牆，該擋牆從該底面延伸出而形成一容納槽，該容納槽適於容納一清洗液；以及 一模具，適於被支撐於該擋牆的一頂端並接觸該清洗液。A cleaning system includes: a cleaning device including an accommodating structure, wherein the accommodating structure has a bottom surface and a retaining wall, the retaining wall extends from the bottom surface to form an accommodating tank, and the accommodating tank is suitable for accommodating a cleaning liquid ; And a mold, suitable for being supported on a top of the retaining wall and in contact with the cleaning fluid. 如申請專利範圍第1項所述的清洗系統，其中該模具的外徑大於該容納槽的外徑。The cleaning system as described in item 1 of the patent application range, wherein the outer diameter of the mold is larger than the outer diameter of the containing groove. 如申請專利範圍第1項所述的清洗系統，其中該清洗裝置更包括一限位結構，該限位結構至少部分地圍繞該容納槽且具有一限位面，當該模具被支撐於該擋牆的頂端時，該限位面抵靠該模具的至少部分周緣。The cleaning system as described in item 1 of the patent application range, wherein the cleaning device further includes a limit structure that at least partially surrounds the receiving groove and has a limit surface when the mold is supported by the block At the top of the wall, the limiting surface abuts at least part of the periphery of the mold. 如申請專利範圍第3項所述的清洗系統，其中該限位面與該底面之間的距離大於該擋牆的該頂端與該底面之間的距離。The cleaning system according to item 3 of the patent application scope, wherein the distance between the limit surface and the bottom surface is greater than the distance between the top end of the retaining wall and the bottom surface. 如申請專利範圍第3項所述的清洗系統，其中該限位結構具有至少一導引斜面，該導引斜面鄰接該限位面且適於導引該模具至該擋牆的該頂端。The cleaning system according to item 3 of the patent application scope, wherein the limiting structure has at least one guiding slope, the guiding slope is adjacent to the limiting surface and is suitable for guiding the mold to the top of the retaining wall. 如申請專利範圍第5項所述的清洗系統，其中該導引斜面傾斜於該底面且傾斜於該限位面。The cleaning system as described in item 5 of the patent application scope, wherein the guiding slope is inclined to the bottom surface and to the limiting surface. 如申請專利範圍第3項所述的清洗系統，其中該限位面垂直於該底面。The cleaning system as described in item 3 of the patent application scope, wherein the limit surface is perpendicular to the bottom surface. 如申請專利範圍第3項所述的清洗系統，其中該限位結構具有至少一缺口，該缺口對位於該容納結構的部分周緣。The cleaning system according to item 3 of the patent application scope, wherein the limiting structure has at least one gap, and the gap pair is located at a part of the periphery of the receiving structure. 如申請專利範圍第1項所述的清洗系統，其中該清洗裝置包括一氣體提供單元，該氣體提供單元適於提供氣體至該擋牆的該頂端，以使該模具分離於該擋牆。The cleaning system as described in item 1 of the patent application scope, wherein the cleaning device includes a gas supply unit adapted to provide gas to the top end of the retaining wall to separate the mold from the retaining wall. 如申請專利範圍第1項所述的清洗系統，其中該模具的一下表面接觸該清洗液，部分該清洗液適於沿該下表面移至該容納槽外。The cleaning system as described in item 1 of the patent application scope, wherein a lower surface of the mold contacts the cleaning liquid, and part of the cleaning liquid is adapted to move out of the containing tank along the lower surface. 一種清洗裝置，包括： 一容納結構，具有一底面及一擋牆，其中該擋牆從該底面延伸出而形成一容納槽，該容納槽適於容納一清洗液，一模具適於被支撐於該擋牆的一頂端並接觸該清洗液；以及 一限位結構，至少部分地圍繞該容納槽且具有一限位面，其中當該模具被支撐於該擋牆的該頂端時，該限位面抵靠該模具的至少部分周緣。A cleaning device includes: an accommodating structure with a bottom surface and a retaining wall, wherein the retaining wall extends from the bottom surface to form an accommodating groove, the accommodating groove is suitable for accommodating a cleaning liquid, and a mold is suitable for being supported on A top end of the retaining wall is in contact with the cleaning liquid; and a limiting structure at least partially surrounding the containing groove and having a limiting surface, wherein when the mold is supported on the top end of the retaining wall, the limiting position The face abuts at least part of the periphery of the mold. 如申請專利範圍第11項所述的清洗裝置，其中該限位面與該底面之間的距離大於該擋牆的該頂端與該底面之間的距離。The cleaning device according to item 11 of the patent application scope, wherein the distance between the limit surface and the bottom surface is greater than the distance between the top end of the retaining wall and the bottom surface. 如申請專利範圍第11項所述的清洗裝置，其中該限位結構具有至少一導引斜面，該導引斜面鄰接該限位面且適於導引該模具至該擋牆的該頂端。The cleaning device according to item 11 of the patent application range, wherein the limiting structure has at least one guiding slope, the guiding slope is adjacent to the limiting surface and is suitable for guiding the mold to the top of the retaining wall. 如申請專利範圍第13項所述的清洗裝置，其中該導引斜面傾斜於該底面且傾斜於該限位面。The cleaning device as described in item 13 of the patent application range, wherein the guiding slope is inclined to the bottom surface and to the limiting surface. 如申請專利範圍第11項所述的清洗裝置，其中該限位面垂直於該底面。The cleaning device as described in item 11 of the patent application range, wherein the limit surface is perpendicular to the bottom surface. 如申請專利範圍第11項所述的清洗裝置，其中該限位結構具有至少一缺口，該缺口對位於該容納結構的部分周緣。The cleaning device according to item 11 of the patent application scope, wherein the limiting structure has at least one gap, and the gap pair is located at a part of the periphery of the receiving structure. 如申請專利範圍第11項所述的清洗裝置，包括一氣體提供單元，其中該氣體提供單元適於提供氣體至該擋牆的該頂端，以使該模具分離於該擋牆。The cleaning device as described in item 11 of the patent application scope includes a gas supply unit, wherein the gas supply unit is adapted to supply gas to the top end of the retaining wall to separate the mold from the retaining wall. 一種清洗方法，包括： 提供一容納結構，其中該容納結構具有一底面及一擋牆，該擋牆從該底面延伸出而形成一容納槽； 藉由該容納槽容納一清洗液；以及 藉由該擋牆的一頂端支撐一模具，以使該模具接觸該清洗液。A cleaning method includes: providing an accommodating structure, wherein the accommodating structure has a bottom surface and a retaining wall, the retaining wall extends from the bottom surface to form an accommodating tank; the accommodating tank accommodates a cleaning liquid; and by A top of the retaining wall supports a mold so that the mold contacts the cleaning liquid. 如申請專利範圍第18項所述的清洗方法，包括： 當該模具被支撐於該擋牆的該頂端時，藉由一限位結構的一限位面抵靠該模具的至少部分周緣。The cleaning method as described in item 18 of the patent application scope includes: when the mold is supported on the top end of the retaining wall, a limit surface of a limit structure abuts at least a part of the periphery of the mold. 如申請專利範圍第19項所述的清洗方法，包括： 藉由該限位結構的一導引斜面導引該模具至該擋牆的該頂端。The cleaning method as described in item 19 of the patent application scope includes: guiding the mold to the top of the retaining wall through a guiding slope of the limiting structure. 如申請專利範圍第18項所述的清洗方法，包括： 藉由一氣體提供單元提供氣體至該擋牆的該頂端，以使該模具分離於該擋牆。The cleaning method as described in item 18 of the patent application scope includes: providing gas to the top of the retaining wall by a gas supply unit to separate the mold from the retaining wall. 如申請專利範圍第18項所述的清洗方法，包括： 使該模具的一下表面接觸該清洗液；以及 使該清洗液沿該模具的該下表面移至該容納槽外。The cleaning method as described in item 18 of the patent application scope includes: bringing the lower surface of the mold into contact with the cleaning liquid; and moving the cleaning liquid along the lower surface of the mold to the outside of the containing tank.
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