TW202001232A - Defect inspection apparatus and defect inspection method - Google Patents

Defect inspection apparatus and defect inspection method Download PDF

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TW202001232A
TW202001232A TW108122198A TW108122198A TW202001232A TW 202001232 A TW202001232 A TW 202001232A TW 108122198 A TW108122198 A TW 108122198A TW 108122198 A TW108122198 A TW 108122198A TW 202001232 A TW202001232 A TW 202001232A
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detection
imaging
product
defect
scattered
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TWI728386B (en
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楊曉青
申永強
韓雪山
王帆
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大陸商上海微電子裝備(集團)股份有限公司
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    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
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    • G01N21/88Investigating the presence of flaws or contamination
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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Abstract

A defect inspection apparatus and a defect inspection method. The defect inspection apparatus comprises an illumination module and an imaging inspection module. The illumination module is configured to generate a detection light beam, and to make the detection light beam incident to the inspection surface of a product to be inspected. The imaging inspection module is configured to detect whether the detection light beam is scattered by the inspection surface of said product so as to generate a scattered imaging light beam, and if detecting the scattered imaging light beam, to determine defect information of said product according to the scattered imaging light beam. The illuminance of the detection light beam satisfies: (U1*R)/(U2*L) ≥ S1, wherein S1 is a signal-to-noise ratio needing to be satisfied to suppress crosstalk on the non-inspection surface of said product, U1 is the central illuminance of the detection light beam, R is the scattering efficiency of light by the minimum inspectable defect at a receivable angle, U2 is the illuminance of the half-width edge of the detection light beam, and L is the scattering efficiency of light by the maximum crosstalk object on the non-detection surface at a receivable angle. The half width W of the detection light beam satisfies: d*(tan[alpha]+tan[beta]) > FOV/2+W, wherein d is the thickness of said product, FOV is an effective field of view of the imaging inspection module, [alpha] is the angle of refraction of the detection light beam in said product, and [beta] is the angle of refraction of the scattered imaging light beam in said product.

Description

缺陷檢測裝置及缺陷檢測方法 Defect detection device and defect detection method

本發明實施例關於缺陷檢測技術領域,例如關於一種缺陷檢測裝置及缺陷檢測方法。 The embodiments of the present invention relate to the field of defect detection technology, for example, to a defect detection device and a defect detection method.

在半導體積體電路或平板顯示的製備工藝中,為使產品保持較高的良率,在對光罩或玻璃基板等進行曝光前,都需要進行缺陷(包含外來顆粒、指紋、劃痕、針孔等)檢測,以達到控制污染的目的。 In the manufacturing process of semiconductor integrated circuits or flat panel displays, in order to maintain a high yield of products, defects (including foreign particles, fingerprints, scratches, needles) are required before exposure to the photomask or glass substrate, etc. Holes, etc.) to achieve the purpose of controlling pollution.

圖1是現有的一種缺陷檢測裝置的結構示意圖,一般集成在光刻設備中的顆粒檢測裝置通常採用暗場散射測量技術,其檢測原理如圖1所示,從光源10發出的照明光線101經待測物體104上的缺陷114散射,散射光線102最終被探測器103所探測,接著根據探測器103檢測到的散射光線確定缺陷的尺寸大小。 FIG. 1 is a schematic structural diagram of an existing defect detection device. The particle detection device generally integrated in a lithography apparatus usually uses dark field scattering measurement technology. The detection principle is shown in FIG. 1. The illumination light 101 emitted from the light source 10 is The defect 114 on the object to be measured 104 is scattered, and the scattered light 102 is finally detected by the detector 103, and then the size of the defect is determined according to the scattered light detected by the detector 103.

但現有的缺陷檢測裝置在缺陷檢測的過程中,待測產品的下表面圖案容易產生串擾訊號,影響缺陷檢測結果的準確性。 However, during the defect detection process of the existing defect detection device, the pattern of the lower surface of the product to be tested is prone to crosstalk signals, which affects the accuracy of the defect detection result.

本發明提供一種缺陷檢測裝置及缺陷檢測方法,以實現抑制缺陷檢測過程中產生的串擾。 The invention provides a defect detection device and a defect detection method, so as to suppress crosstalk generated in the defect detection process.

第一方面,本發明實施例提供一種缺陷檢測裝置,包含照明模組及成像檢測模組;前述照明模組設置為產生探測光束,並使前述探測光束入射至待測產品的檢測面;前述成像檢測模組設置為檢測前述探測光束是否經前述待測產品的檢測面散射產生散射成像光束,並在檢測到前述探測光束經前述待測產品的檢測面散射產生散射成像光束的情況下,根據前述散射成像光束確定前述待測產品的缺陷訊息;其中,前述探測光束的照度滿足:(U1×R)/(U2×L)

Figure 108122198-A0202-12-0002-13
S1;其中,S1為抑制前述待測產品的非檢測面的串擾需要滿足的訊噪比,U1為前述探測光束的中心照度,R為最小可檢測缺陷在可被接收角度內對光線的散射效率,U2為前述探測光束的半寬邊緣的照度,L為前述非檢測面上的最大串擾物在可被接收角度內對光線的散射效率;前述探測光束的半寬W滿足:d×(tanα+tanβ)>FOV/2+W;其中,d為前述待測產品的厚度;FOV為前述成像檢測模組的有效視場;α為探測光束在前述待測產品中的折射角,β為前述散射成像光束在前述待測產品中的折射角。 In a first aspect, an embodiment of the present invention provides a defect detection device, including a lighting module and an imaging detection module; the aforementioned lighting module is configured to generate a detection beam and make the detection beam incident on the detection surface of the product to be tested; the aforementioned imaging The detection module is configured to detect whether the detection beam is scattered by the detection surface of the product under test to generate a scattered imaging beam, and when it is detected that the detection beam is scattered by the detection surface of the product under test to generate a scattered imaging beam, according to the foregoing The scattered imaging beam determines the defect information of the aforementioned product to be tested; wherein, the illuminance of the aforementioned detection beam satisfies: (U1×R)/(U2×L)
Figure 108122198-A0202-12-0002-13
S1; where S1 is the signal-to-noise ratio that needs to be met to suppress the crosstalk of the non-detection surface of the product under test, U1 is the central illuminance of the detection beam, and R is the light scattering efficiency of the smallest detectable defect within the acceptable angle , U2 is the illuminance of the half-width edge of the detection beam, L is the scattering efficiency of the maximum crosstalk on the non-detection surface to the light within the acceptable angle; the half-width W of the detection beam satisfies: d×(tanα+ tanβ)>FOV/2+W; where d is the thickness of the product to be tested; FOV is the effective field of view of the imaging detection module; α is the angle of refraction of the detection beam in the product to be tested, and β is the scattering The angle of refraction of the imaging beam in the aforementioned product to be tested.

在一些實施例中,前述探測光束的照度還滿足:(U1×R)/(U2×M×N)

Figure 108122198-A0202-12-0002-14
S2;其中,S2為抑制鏡像串擾需要滿足的訊噪比,M為前述探測光束在鏡像串擾區域內沿鏡像串擾方向的散射效率,N為前述照明視場光線在鏡像串擾方向的散射光線在前述待測產品內的反射率; 前述探測光束的半寬W還滿足:2d×tanθ-FOV/2
Figure 108122198-A0202-12-0003-15
W,其中,θ為前述探測光束在鏡像串擾方向的散射光線在前述待測產品中的折射角。 In some embodiments, the illuminance of the aforementioned detection beam further satisfies: (U1×R)/(U2×M×N)
Figure 108122198-A0202-12-0002-14
S2; where S2 is the signal-to-noise ratio that needs to be met to suppress the image crosstalk, M is the scattering efficiency of the detection beam in the image crosstalk direction in the image crosstalk area, and N is the scattered light of the illumination field light in the image crosstalk direction in the foregoing The reflectivity in the product to be tested; the half-width W of the aforementioned detection beam also satisfies: 2d×tanθ-FOV/2
Figure 108122198-A0202-12-0003-15
W, where θ is the angle of refraction of the scattered light of the detection beam in the direction of the mirror image crosstalk in the product to be tested.

在一些實施例中,前述探測光束的主光線的角度偏差小於5°;前述散射成像光束的主光線的角度偏差小於5°。 In some embodiments, the angle deviation of the chief rays of the aforementioned detection beam is less than 5°; the angle deviation of the aforementioned chief rays of the scattered imaging beam is less than 5°.

在一些實施例中,前述缺陷檢測裝置進一步包含:水平運動模組;前述水平運動模組設置為承載前述待測產品沿平行於前述待測產品的檢測面的方向運動。 In some embodiments, the defect detection device further includes: a horizontal motion module; the horizontal motion module is configured to carry the product to be tested in a direction parallel to the detection surface of the product to be tested.

在一些實施例中,前述缺陷檢測裝置進一步包含:焦面測量模組及垂直運動模組;前述焦面測量模組設置為檢測前述待測產品的檢測面的離焦量;前述垂直運動模組設置為根據前述離焦量控制前述待測產品沿垂直於前述檢測面的方向運動。 In some embodiments, the defect detection device further includes: a focal plane measurement module and a vertical motion module; the focal plane measurement module is configured to detect the defocus amount of the detection surface of the product to be tested; and the vertical motion module It is set to control the product to be tested to move in a direction perpendicular to the detection surface according to the defocus amount.

在一些實施例中,前述成像檢測模組設置為根據連續多次獲取的散射成像光束確定多個成像訊號,並對前述多個成像訊號進行積分以確定前述缺陷訊息。 In some embodiments, the aforementioned imaging detection module is configured to determine a plurality of imaging signals based on the scattered imaging beams obtained consecutively for multiple times, and integrate the plurality of imaging signals to determine the aforementioned defect information.

在一些實施例中,前述成像檢測模組包含積分相機;前述積分相機為時間延時積分相機(Time Delay Integration,TDI)、互補金屬氧化物半導體(Complementary Metal Oxide Semiconductor,CMOS)相機或者電荷耦合元件(charge coupled device,CCD)相機。 In some embodiments, the imaging detection module includes an integration camera; the integration camera is a time delay integration camera (Time Delay Integration, TDI), a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) camera, or a charge-coupled device ( charge coupled device (CCD) camera.

在一些實施例中,前述成像檢測模組進一步包含聚光單元,前述聚光單元設置為會聚前述散射成像光束,使會聚後的前述散射成像光束入射 到前述積分相機。 In some embodiments, the imaging detection module further includes a condensing unit. The condensing unit is configured to converge the scattered imaging light beam so that the converged scattered imaging light beam enters the integration camera.

在一些實施例中,前述探測光束滿足高斯分布。 In some embodiments, the aforementioned detection beam satisfies the Gaussian distribution.

第二方面,本發明實施例進一步提供一種光刻設備,包含上述第一方面所述的缺陷檢測裝置。 In a second aspect, an embodiment of the present invention further provides a lithography apparatus, including the defect detection device described in the first aspect above.

第三方面,本發明實施例進一步提供一種缺陷檢測方法,包含:藉由照明模組產生探測光束,並使前述探測光束入射至待測產品的檢測面上;前述探測光束的照度及探測光束的半寬分別滿足:(U1×R)/(U2×L)

Figure 108122198-A0202-12-0004-16
S1,d×(tanα+tanβ)>FOV/2+W;藉由成像檢測模組檢測前述探測光束是否經前述待測產品的檢測面散射產生散射成像光束,並在檢測到前述探測光束經前述待測產品的檢測面散射產生散射成像光束的情況下,根據前述成像光線確定缺陷訊息;其中,S1為抑制前述待測產品的非檢測面的串擾需要滿足的訊噪比,U1為前述探測光束的中心照度,R為最小可檢測缺陷在可被接收角度內對光線的散射效率,U2為前述探測光束的半寬邊緣的照度,L為前述非檢測面上的最大串擾物在可被接收角度內對光線的散射效率,d為前述待測產品的厚度;FOV為前述成像檢測模組的有效視場;α為探測光束在前述待測產品中的折射角,β為前述散射成像光束在前述待測產品中的折射角。 In a third aspect, an embodiment of the present invention further provides a defect detection method, including: generating a detection beam by an illumination module and making the detection beam incident on the detection surface of the product to be tested; the illuminance of the detection beam and the detection beam The half-widths respectively satisfy: (U1×R)/(U2×L)
Figure 108122198-A0202-12-0004-16
S1, d×(tanα+tanβ)>FOV/2+W; the imaging detection module detects whether the detection beam is scattered by the detection surface of the product under test to generate a scattered imaging beam, and detects that the detection beam passes through the In the case where the detection surface of the product under test scatters and generates a scattered imaging beam, the defect information is determined according to the aforementioned imaging light; where S1 is the signal-to-noise ratio that must be satisfied to suppress crosstalk on the non-detection surface of the product under test, and U1 is the aforementioned detection beam The central illuminance of R, R is the light scattering efficiency of the smallest detectable defect within the acceptable angle, U2 is the illuminance of the half-width edge of the aforementioned detection beam, and L is the maximum crosstalk on the aforementioned non-detection surface at the acceptable angle Internal scattering efficiency of light, d is the thickness of the product under test; FOV is the effective field of view of the imaging detection module; α is the angle of refraction of the detection beam in the product under test, β is the scattering imaging beam in the aforementioned The angle of refraction in the product to be tested.

在一些實施例中,根據前述散射成像光束確定缺陷訊息包含:根據連續多次獲取的散射成像光束確定多個成像訊號;對前述多個成像訊號進行積分以確定前述缺陷訊息。 In some embodiments, determining the defect information according to the scattered imaging light beam includes: determining a plurality of imaging signals based on the scattered imaging light beams obtained consecutively multiple times; integrating the plurality of imaging signals to determine the defect information.

本發明實施例藉由最小可檢測缺陷在可被接收角度內對光線的散射效率、非檢測面上的最大串擾物在可被接收角度內對光線的散射效率,以及抑制待測產品的非檢測面的串擾所需要的訊噪比,得到探測光束的半寬邊緣與探測光束的中心之間的相對照度;藉由探測光束在待測產品中的折射角、散射成像光束在待測產品中的折射角、待測產品的厚度以及成像檢測模組的有效視場,得到夠滿足抑制待測產品的非檢測面的串擾所需要的探測光束的半寬;根據相對照度及探測光束的半寬可以確定照明模組的具體參數,藉由設置滿足上述參數的照明模組,使得本發明實施例的缺陷檢測裝置在缺陷檢測過程中可以抑制缺陷檢測過程中產生的串擾,提高缺陷檢測精度。 The embodiment of the present invention uses the minimum detectable defect to scatter the light within the receivable angle, the maximum crosstalk of the non-detection surface to scatter the light within the receivable angle, and suppress the non-detection of the product under test The signal-to-noise ratio required by the crosstalk of the surface can obtain the relative illuminance between the half-width edge of the detection beam and the center of the detection beam; by the angle of refraction of the detection beam in the product to be measured and the scattering imaging beam in the product to be tested The refraction angle, the thickness of the product to be measured and the effective field of view of the imaging detection module can obtain a half-width of the detection beam sufficient to suppress the crosstalk of the non-detection surface of the product to be tested; according to the relative illuminance and the half-width of the detection beam Determine the specific parameters of the lighting module, and by setting the lighting module to meet the above parameters, the defect detection device of the embodiment of the present invention can suppress the crosstalk generated in the defect detection process during the defect detection process and improve the defect detection accuracy.

10‧‧‧光源 10‧‧‧Light source

101‧‧‧照明光線 101‧‧‧Lighting

102‧‧‧散射光線 102‧‧‧scattered light

103‧‧‧探測器 103‧‧‧ detector

104‧‧‧待測物體 104‧‧‧Object to be measured

114‧‧‧缺陷 114‧‧‧ Defect

20‧‧‧照明模組 20‧‧‧Lighting Module

201‧‧‧探測光束 201‧‧‧ Probe beam

2011‧‧‧中心光線 2011‧‧‧Central light

2012‧‧‧邊緣光線 2012‧‧‧Edge light

202‧‧‧反射光束 202‧‧‧Reflected beam

30‧‧‧成像檢測模組 30‧‧‧ Imaging detection module

301‧‧‧散射成像光束 301‧‧‧scattered imaging beam

3010‧‧‧第一成像光線 3010‧‧‧First imaging light

3011‧‧‧第二成像光線 3011‧‧‧The second imaging light

3012‧‧‧第三成像光線 3012‧‧‧ Third imaging light

302‧‧‧積分相機 302‧‧‧ Integral camera

303‧‧‧聚光單元 303‧‧‧Concentrating unit

40‧‧‧待測產品 40‧‧‧Product to be tested

401‧‧‧缺陷 401‧‧‧ Defect

4011‧‧‧第一缺陷 4011‧‧‧ First defect

4012‧‧‧第二缺陷 4012‧‧‧Second defect

402‧‧‧串擾物 402‧‧‧ Crosstalk

50‧‧‧水平運動模組 50‧‧‧horizontal movement module

60‧‧‧垂直運動模組 60‧‧‧Vertical motion module

70‧‧‧焦面測量模組 70‧‧‧ focal plane measurement module

【圖1】是現有的一種缺陷檢測裝置的結構示意圖。 [Figure 1] is a schematic structural diagram of a conventional defect detection device.

【圖2】是本發明實施例提供的缺陷檢測裝置的結構示意圖。 [FIG. 2] is a schematic structural diagram of a defect detection device provided by an embodiment of the present invention.

【圖3】是本發明實施例提供的探測光束的半寬的結構示意圖。 Fig. 3 is a schematic diagram of the half-width of a detection beam provided by an embodiment of the present invention.

【圖4】是本發明實施例提供的下層串擾原理圖。 Fig. 4 is a schematic diagram of lower layer crosstalk provided by an embodiment of the present invention.

【圖5】是本發明實施例提供的鏡像串擾原理圖。 Fig. 5 is a schematic diagram of mirror crosstalk provided by an embodiment of the present invention.

【圖6】是本發明實施例提供的探測光束的結構示意圖。 [Fig. 6] is a schematic structural diagram of a detection beam provided by an embodiment of the present invention.

【圖7】是本發明實施例提供的散射成像光束及成像檢測模組的結構示意圖。 7 is a schematic diagram of the structure of a scattered imaging beam and an imaging detection module provided by an embodiment of the present invention.

【圖8】是本發明實施例提供的另一缺陷檢測裝置的結構示意圖。 [FIG. 8] is a schematic structural diagram of another defect detection device provided by an embodiment of the present invention.

【圖9】是本發明實施例提供的探測光束與缺陷之間的位置關係示意圖。 9 is a schematic diagram of the positional relationship between the detection beam and the defect provided by the embodiment of the present invention.

【圖10】是本發明實施例提供的缺陷檢測方法的流程圖。 [Figure 10] is a flowchart of a defect detection method provided by an embodiment of the present invention.

下面結合圖式及實施例對本發明作進一步的詳細說明。可以理解的是,此處所描述的具體實施例僅僅用於解釋本發明,而非對本發明的限定。此外還需要說明的是,為了便於描述,圖式中僅示出與本發明相關的部分而非全部結構。 The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. In addition, it should be noted that, in order to facilitate description, the drawings only show parts but not all structures related to the present invention.

圖2是本發明實施例提供的缺陷檢測裝置的結構示意圖,請參考圖2,前述裝置包含照明模組20及成像檢測模組30;照明模組20設置為產生探測光束201,並使探測光束201入射至待測產品40的檢測面上;成像檢測模組30設置為檢測探測光束201是否經待測產品40的檢測面散射產生散射成像光束301,並在檢測到前述探測光束經前述待測產品的檢測面散射產生散射成像光束的情況下,根據散射成像光束301確定待測產品40的缺陷訊息。 FIG. 2 is a schematic structural diagram of a defect detection device provided by an embodiment of the present invention. Please refer to FIG. 2. The aforementioned device includes an illumination module 20 and an imaging detection module 30; the illumination module 20 is configured to generate a detection beam 201 and make the detection beam 201 is incident on the detection surface of the product to be tested 40; the imaging detection module 30 is configured to detect whether the detection beam 201 is scattered by the detection surface of the product to be tested 40 to generate a scattered imaging beam 301, and upon detecting that the detection beam passes through the test When the scattered imaging beam is generated by the scattering of the detection surface of the product, the defect information of the product to be tested 40 is determined according to the scattered imaging beam 301.

其中,探測光束201的照度滿足:(U1×R)/(U2×L)

Figure 108122198-A0202-12-0006-17
S1;其中,S1為抑制待測產品40的非檢測面的串擾需要滿足的訊噪比,U1為探測光束201的中心照度,R為最小可檢測缺陷在可被接收角度內對光線的散射效率,U2為探測光束201的半寬邊緣的照度,L為非檢測面上的最大串擾物在可被接收角度內對光線的散射效率。探測光束201的半寬W滿足:d×[tanα+tanβ]>FOV/2+W;其中,d為待測產品40的厚度;FOV為成像檢測模組30的有效視場;α為探測光束201在待測產品40中的折射角,β為散射成像光束301在待測產品中的折射角。 Among them, the illuminance of the detection beam 201 satisfies: (U1×R)/(U2×L)
Figure 108122198-A0202-12-0006-17
S1; where S1 is the signal-to-noise ratio that needs to be satisfied to suppress the crosstalk of the non-detection surface of the product under test 40, U1 is the central illuminance of the detection beam 201, and R is the scattering efficiency of the smallest detectable defect within the acceptable angle of light , U2 is the illuminance of the half-width edge of the detection beam 201, L is the scattering efficiency of the largest crosstalk object on the non-detection surface to the light within the acceptable angle. The half-width W of the detection beam 201 satisfies: d×[tanα+tanβ]>FOV/2+W; where d is the thickness of the product 40 to be measured; FOV is the effective field of view of the imaging detection module 30; α is the detection beam 201 is the angle of refraction in the product under test 40, β is the angle of refraction of the scattered imaging beam 301 in the product under test.

具體地,照明模組20產生的光線會在待測產品上形成探測光束201。如果探測光束201在待測產品40的檢測面上未遇見缺陷401,根據光的 反射定律,探測光束201在待測產品40的檢測面形成反射光束202,反射光束202通常不能進入成像檢測模組30。如果探測光束201在待測產品40的檢測面上遇見缺陷401,缺陷401會使光線發生散射效應,部分被散射後的光線能夠進入成像檢測模組30,例如散射成像光束301。成像檢測模組30根據散射成像光束301可以確定出待測產品40上的缺陷訊息,例如缺陷的尺寸等。其中,待測產品40的檢測面是指待測產品40靠近照明模組20的面,缺陷401通常位於待測產品40的檢測面上;待測產品40的非檢測面是指與待測產品40的檢測面相對設置的面。 Specifically, the light generated by the lighting module 20 will form a detection beam 201 on the product to be tested. If the detection beam 201 does not encounter the defect 401 on the detection surface of the product to be tested 40, according to the law of light reflection, the detection beam 201 forms a reflected beam 202 on the detection surface of the product to be tested 40, which usually cannot enter the imaging detection module 30. If the detection beam 201 encounters a defect 401 on the detection surface of the product to be tested 40, the defect 401 will cause a scattering effect of light, and part of the scattered light can enter the imaging detection module 30, such as the scattered imaging beam 301. The imaging detection module 30 can determine the defect information on the product to be tested 40 according to the scattered imaging beam 301, such as the size of the defect. The detection surface of the product 40 under test refers to the surface of the product 40 under test near the lighting module 20, and the defect 401 is usually located on the detection surface of the product under test 40; the non-detection surface of the product under test 40 refers to the product under test The detection surface of 40 is the surface opposite to the one provided.

圖3是本發明實施例提供的探測光束的半寬的結構示意圖。具體地,請參考圖2及圖3,對於高斯光束,光束的中心在待測產品40的檢測面上的照度較大,而光束的半寬邊緣在待測產品40的檢測面上形成的照度較小。其中,光束的半寬邊緣一般可以根據需要進行設定,例如,可以把照度為光束中心區域的照度的1/100的位置設定為光束的半寬邊緣,或者把照度為光束中心區域的照度的1/10000的位置設定為光束的半寬邊緣,本實施例不作具體限制。 FIG. 3 is a schematic structural diagram of a half-width of a detection beam provided by an embodiment of the present invention. Specifically, please refer to FIG. 2 and FIG. 3, for the Gaussian beam, the center of the beam has a large illuminance on the detection surface of the product to be tested 40, and the half-width edge of the beam has an illuminance formed on the detection surface of the product to be tested 40 Smaller. The half-width edge of the light beam can generally be set as needed. For example, the position where the illuminance is 1/100 of the illuminance in the center area of the beam can be set as the half-width edge of the beam, or the illuminance can be 1 The position of /10000 is set to the half-width edge of the light beam, which is not specifically limited in this embodiment.

圖4是本發明實施例提供的下層串擾原理圖。具體地,請參考圖2及圖4,下層串擾是指由於待測產品40的非檢測面上的串擾物402導致的串擾。待測產品40的非檢測面可能包含串擾物402,當待測產品40為光罩時,串擾物402可以是週期性結構的光柵等。探測光束201包含探測光束201中心的光線2011及探測光束201半寬邊緣的光線2012,在檢測缺陷時,可採用探測光束201中心的光線2011作為檢測光線,對缺陷401進行檢測。照明視場的中心光線2011經過缺陷401的散射後,形成的散射成像光束301被成 像檢測模組30接收。此時,如果探測光束201的半寬邊緣光線2012經過待測產品40折射後,剛好落在成像檢測模組30的有效視場FOV的有效範圍內,經串擾物402散射後,可以形成串擾訊號並被成像檢測模組30檢測到。 4 is a schematic diagram of lower layer crosstalk provided by an embodiment of the present invention. Specifically, please refer to FIGS. 2 and 4. The lower crosstalk refers to crosstalk caused by the crosstalk 402 on the non-detection surface of the product 40 to be tested. The non-detection surface of the product to be tested 40 may contain a crosstalk 402. When the product to be tested 40 is a photomask, the crosstalk 402 may be a grating with a periodic structure or the like. The detection beam 201 includes the light 2011 at the center of the detection beam 201 and the light 2012 at the half-width edge of the detection beam 201. When detecting a defect, the light 2011 at the center of the detection beam 201 can be used as the detection light to detect the defect 401. After the central ray 2011 of the illumination field of view is scattered by the defect 401, the formed scattered imaging light beam 301 is received by the imaging detection module 30. At this time, if the half-width edge light 2012 of the detection beam 201 is refracted by the product to be tested 40 and falls within the effective range of the effective field of view FOV of the imaging detection module 30, after being scattered by the crosstalk object 402, a crosstalk signal may be formed And detected by the imaging detection module 30.

為了抑制待測產品40的非檢測面的串擾訊號,避免串擾訊號影響缺陷的檢測結果,探測光束201的照度需要控制在一定的範圍內。探測光束201的照度可以滿足(U1×R)/(U2×L)

Figure 108122198-A0202-12-0008-18
S1。具體地,R可以根據最小可檢測缺陷的尺寸、照明模組20以及成像檢測模組30的位置等參數確定;L可以根據照明模組20及成像檢測模組30的位置以及最大串擾物的尺寸等參數確定。據此,根據上述公式可以確定探測光束201的半寬邊緣的照度U2及探測光束201的中心照度U1的比值U2/U1,即確定中心照度及半寬邊緣的照度的相對照度。 In order to suppress the crosstalk signal on the non-detection surface of the product to be tested 40 and prevent the crosstalk signal from affecting the defect detection result, the illuminance of the detection beam 201 needs to be controlled within a certain range. The illuminance of the detection beam 201 can satisfy (U1×R)/(U2×L)
Figure 108122198-A0202-12-0008-18
S1. Specifically, R can be determined according to parameters such as the size of the smallest detectable defect, the position of the lighting module 20 and the imaging detection module 30; L can be determined according to the position of the lighting module 20 and the imaging detection module 30, and the size of the largest crosstalk object Other parameters are determined. Accordingly, the ratio U2/U1 of the illuminance U2 of the half-width edge of the detection beam 201 and the center illuminance U1 of the detection beam 201 can be determined according to the above formula, that is, the relative illuminance of the center illuminance and the half-width edge illuminance can be determined.

此外,探測光束201的半寬W滿足:d×[tanα+tanβ]>FOV/2+W。對於確定的缺陷檢測裝置及待測產品40,成像檢測模組30的有效視場FOV的數值是確定的,探測光束201在待測產品40中的折射角α及散射成像光束301在待測產品40中的折射角β可以根據照明模組20及成像檢測模組30的位置確定,據此,可以根據上述公式確定探測光束201的半寬W。可以理解的是,當確定探測光束201的半寬W以及探測光束的半寬邊緣的照度U2及探測光束201的中心照度U1的比值後,就可以唯一地確定探測光束201,藉由調節照明模組20的工作參數,就可以得到能夠抑制下層串擾的探測光束201。 In addition, the half width W of the detection beam 201 satisfies: d×[tanα+tanβ]>FOV/2+W. For the determined defect detection device and the product to be tested 40, the value of the effective field of view FOV of the imaging detection module 30 is determined. The refraction angle α of the detection beam 201 in the product to be tested 40 and the scattered imaging beam 301 are in the product to be tested The refraction angle β in 40 can be determined according to the positions of the illumination module 20 and the imaging detection module 30, and accordingly, the half width W of the detection beam 201 can be determined according to the above formula. It can be understood that, when the ratio of the half-width W of the detection beam 201 and the illuminance U2 of the half-width edge of the detection beam 201 and the central illuminance U1 of the detection beam 201 is determined, the detection beam 201 can be uniquely determined by adjusting the illumination mode With the operating parameters of group 20, a detection beam 201 capable of suppressing crosstalk at the lower layer can be obtained.

本實施例藉由最小可檢測缺陷在可被接收角度內對光線的散射效率、非檢測面上的最大串擾物在可被接收角度內對光線的散射效率,以及抑 制待測產品的非檢測面的串擾所需要的訊噪比,得到探測光束的半寬邊緣與探測光束的中心之間的相對照度;藉由探測光束在待測產品中的折射角、散射成像光束在待測產品中的折射角、待測產品的厚度以及成像檢測模組的有效視場,得到夠滿足抑制待測產品的非檢測面的串擾所需要的探測光束的半寬;根據相對照度及探測光束的半寬可以確定照明模組的具體參數,藉由設置滿足上述參數的照明模組,使得本發明實施例的缺陷檢測裝置在缺陷檢測過程中可以抑制缺陷檢測過程中產生的串擾,提高缺陷檢測精度。 This embodiment uses the minimum detectable defect to scatter the light within the receivable angle, the maximum crosstalk of the non-detection surface to scatter the light within the receivable angle, and suppress the non-detection surface of the product to be tested The required signal-to-noise ratio of the crosstalk is obtained by the relative illuminance between the half-width edge of the detection beam and the center of the detection beam; by the angle of refraction of the detection beam in the product to be tested and the refraction of the scattering imaging beam in the product to be tested The angle, the thickness of the product to be measured and the effective field of view of the imaging detection module can obtain the half width of the detection beam that is sufficient to suppress the crosstalk of the non-detection surface of the product to be tested; it can be determined according to the relative illuminance and the half width of the detection beam For the specific parameters of the lighting module, by setting a lighting module that satisfies the above parameters, the defect detection device of the embodiment of the present invention can suppress crosstalk generated during the defect detection process during the defect detection process and improve the defect detection accuracy.

具體地,為了提高檢測靈敏度本實施例的成像檢測模組30藉由接收缺陷散射光來確定缺陷訊息,即採用暗場成像,探測光束201在待測產品40中的折射角α通常不等於散射成像光束301在待測產品40中的折射角β,即α≠β。示例性地,當待測產品40的厚度d為6.35mm時,折射角α的取值滿足30°<α<45°,且折射角β滿足30°<β<45°,為獲得較好的檢測結果,可選地,|α-β|>3.5°。示例性地,設FOV=1.5mm,α=42°,β=35°,d=6.35mm,則W<d×(tanα+tanβ)-FOV/2=6.35×(0.9+0.7)-1.5/2=9.41mm。為了得到清晰的檢測結果,S1=3,L=3333.3×R,則U2

Figure 108122198-A0202-12-0009-19
(U1×R)/(S1×L)=U1/10000。如果探測光束201滿足理想高斯函數,在已知相對照度為最大值1/10000及探測光束201的半寬W=9.41mm的情況下,探測光束201可以唯一地確定。此時,照明視場的半高的半寬(照明視場50%相對照度的半寬)為W1=2.97mm,探測光束201的半高的全寬WFWHM=2×W1=5.94mm。 Specifically, in order to improve the detection sensitivity, the imaging detection module 30 of this embodiment determines the defect information by receiving the scattered light of the defect, that is, using dark field imaging, the refraction angle α of the detection beam 201 in the product to be tested 40 is generally not equal to the scattering The refraction angle β of the imaging beam 301 in the product to be measured 40, that is, α≠β. Exemplarily, when the thickness d of the product 40 to be measured is 6.35 mm, the value of the refraction angle α satisfies 30°<α<45°, and the refraction angle β satisfies 30°<β<45°, in order to obtain a better Test results, optionally, |α-β|>3.5°. Exemplarily, if FOV=1.5mm, α=42°, β=35°, d=6.35mm, then W<d×(tanα+tanβ)-FOV/2=6.35×(0.9+0.7)-1.5/ 2=9.41mm. In order to get clear test results, S1=3, L=3333.3×R, then U2
Figure 108122198-A0202-12-0009-19
(U1×R)/(S1×L)=U1/10000. If the detection beam 201 satisfies the ideal Gaussian function, the detection beam 201 can be uniquely determined when the relative illuminance is known to be a maximum of 1/10000 and the half width W of the detection beam 201=9.41 mm. At this time, the half-height and half-width of the illumination field (the half-width of the illumination field at 50% relative illuminance) is W1=2.97 mm, and the full-width of the half-height of the detection beam 201 is W FWHM =2×W1=5.94 mm.

在一些實施例中,探測光束201的照度還滿足:(U1×R)/(U2×M×N)

Figure 108122198-A0202-12-0009-20
S2;其中,S2為抑制鏡像串擾需要滿足的訊噪比,M為探測光束201在鏡像串擾區域內沿鏡像串擾方向的散射效率,N為探測光束201沿鏡像 串擾方向的散射光線在待測產品內的反射率;探測光束201的半寬W還滿足:2d×tanθ-FOV/2
Figure 108122198-A0202-12-0010-21
W,其中,θ為探測光束201沿鏡像串擾方向的散射光線在待測產品40中的折射角。 In some embodiments, the illuminance of the detection beam 201 also satisfies: (U1×R)/(U2×M×N)
Figure 108122198-A0202-12-0009-20
S2; where S2 is the signal-to-noise ratio that needs to be met to suppress the image crosstalk, M is the scattering efficiency of the detection beam 201 in the image crosstalk area in the image crosstalk direction, and N is the scattered light of the detection beam 201 in the image crosstalk direction in the product under test Internal reflectance; the half-width W of the detection beam 201 also satisfies: 2d×tanθ-FOV/2
Figure 108122198-A0202-12-0010-21
W, where θ is the angle of refraction of the scattered light of the detection beam 201 along the mirror image crosstalk direction in the product to be tested 40.

圖5是發明本實施例提供的鏡像串擾原理圖。可選地,請參考圖2及圖5,探測光束201的中心光線2011在遇到第一缺陷4011後,形成散射成像光束301,成像檢測模組30可以根據散射成像光束301確定待測產品40的缺陷訊息。探測光束201的邊緣光線2012經過待測產品40的檢測面上的第二缺陷4012散射後,散射光線進入待測產品40中,並在待測產品40的非檢測面反射後形成的反射。可以理解的是,缺陷檢測裝置當前的正在檢測的缺陷是第一缺陷4011,如果第二缺陷4012的反射產生的光線進入成像檢測模組30的有效視場FOV,就會形成鏡像串擾訊號,並對第一缺陷4011的檢測結果形成串擾,這種串擾稱為鏡像串擾。如果鏡像串擾訊號的強度較大,就會影響第一缺陷4011的檢測的清晰度及準確度。 FIG. 5 is a principle diagram of mirror crosstalk provided by this embodiment of the present invention. Optionally, please refer to FIG. 2 and FIG. 5, after the central light 2011 of the detection beam 201 encounters the first defect 4011, a scattered imaging beam 301 is formed, and the imaging detection module 30 can determine the product 40 to be tested according to the scattered imaging beam 301 Defect message. After the edge light 2012 of the detection beam 201 is scattered by the second defect 4012 on the detection surface of the product to be tested 40, the scattered light enters the product to be tested 40 and is reflected after being reflected by the non-detection surface of the product to be tested 40. It can be understood that the defect currently being detected by the defect detection device is the first defect 4011. If the light generated by the reflection of the second defect 4012 enters the effective field of view FOV of the imaging detection module 30, a mirror crosstalk signal will be formed, and The detection result of the first defect 4011 forms crosstalk, which is called mirror crosstalk. If the intensity of the image crosstalk signal is large, it will affect the clarity and accuracy of the detection of the first defect 4011.

為了抑制鏡像串擾,需要使探測光束201的照度滿足:(U1×R)/(U2×M×N)

Figure 108122198-A0202-12-0010-22
S2,以及使探測光束201的半寬W滿足:2d×tanθ-FOV/2
Figure 108122198-A0202-12-0010-23
W。一般來說,待測產品40的檢測面上的鏡像串擾區域內的缺陷顆粒的尺寸越大,M的值越大。對於確定的待測產品40,在照明模組20及成像檢測模組30的位置及角度,以及最大缺陷的尺寸確定後,即可確定M值。探測光束在待測產品40內的反射率N與待測產品40的折射率有關。示例性地,探測光束從空氣進入待測產品40,經折射及反射後,從待測產品40再次出射至空氣中,由於空氣的折射率n1通常為1,如果待測產品的折射率n2為1.5,那麼反射率N=(n2-n1)2/(n2+n1)2=(1.5-1)2/(1.5+1)2=0.04。 In order to suppress the image crosstalk, the illuminance of the detection beam 201 needs to satisfy: (U1×R)/(U2×M×N)
Figure 108122198-A0202-12-0010-22
S2, and the half width W of the detection beam 201 satisfies: 2d×tanθ-FOV/2
Figure 108122198-A0202-12-0010-23
W. In general, the larger the size of the defective particles in the mirror crosstalk area on the detection surface of the product 40 to be tested, the larger the value of M. For the determined product 40 to be tested, the M value can be determined after the positions and angles of the illumination module 20 and the imaging detection module 30 and the size of the largest defect are determined. The reflectivity N of the probe beam in the product under test 40 is related to the refractive index of the product under test 40. Exemplarily, the detection beam enters the product under test 40 from the air, and after refraction and reflection, exits from the product under test 40 into the air again. Since the refractive index n1 of the air is usually 1, if the refractive index n2 of the product under test is 1.5, then the reflectivity N=(n2-n1) 2 /(n2+n1) 2 =(1.5-1) 2 /(1.5+1) 2 =0.04.

根據探測光束201在鏡像串擾方向的散射光線在待測產品中的折射角θ,待測產品40的厚度d,以及成像檢測模組30的有效視場FOV,即可確定出探測光束201的半寬W。可以理解的是,當確定探測光束201的半寬W以及探測光束201的半寬邊緣的照度U2及探測光束201的中心照度U1的比值後,就可以唯一地確定探測光束201,藉由調節照明模組20的工作參數,就可以得到能夠抑制鏡像串擾的探測光束201。 According to the refraction angle θ of the scattered light of the detection beam 201 in the mirror crosstalk direction in the product under test, the thickness d of the product under test 40, and the effective field of view FOV of the imaging detection module 30, the half of the detection beam 201 can be determined Wide W. It can be understood that when the ratio of the half-width W of the detection beam 201 and the half-width edge U2 of the detection beam 201 and the central illumination U1 of the detection beam 201 is determined, the detection beam 201 can be uniquely determined by adjusting the illumination With the working parameters of the module 20, a detection beam 201 capable of suppressing image crosstalk can be obtained.

示例性地,已知250μm的標準缺陷顆粒的散射光照度為10μm的標準缺陷顆粒的625倍,設探測光束201滿足理想高斯分布,為保證100um的標準缺陷顆粒不產生鏡像串擾,設探測光束201在待測產品40的折射率n=1.5,則探測光束201在鏡像串擾方向的散射光線在待測產品40中的反射率N=0.04,探測光束201在鏡像串擾方向的散射光線在待測產品40中的折射率折射角θ=35°,抑制鏡像串擾需要滿足的訊噪比S2=4,由此可知,U2

Figure 108122198-A0202-12-0011-24
(U1×R)/(S2×M×N)=U1/100。設待測產品的厚度d=6.35mm,FOV=1.5mm,則探測光束201的半寬W
Figure 108122198-A0202-12-0011-25
2d×tanθ-FOV/2=8.14mm。根據探測光束201的半寬邊緣的照度U2及探測光束201的中心照度U1的比值U2/U1確定的相對照度,以及探測光束201的半寬W的值,即可唯一地確定探測光束201。 Exemplarily, it is known that the scattered illuminance of the standard defect particles of 250 μm is 625 times that of the standard defect particles of 10 μm. The detection beam 201 satisfies the ideal Gaussian distribution. To ensure that the 100 μm standard defect particles do not produce mirror crosstalk, the detection beam 201 is set at When the refractive index of the product 40 to be tested n=1.5, the reflectivity of the scattered light of the detection beam 201 in the direction of the mirror crosstalk in the product 40 to be tested N=0.04, and the scattered light of the detection beam 201 in the direction of the mirror crosstalk in the product 40 to be tested The index of refraction in θ=35°, the signal-to-noise ratio S2=4 that needs to be satisfied to suppress the image crosstalk, from which we can see that U2
Figure 108122198-A0202-12-0011-24
(U1×R)/(S2×M×N)=U1/100. If the thickness of the product to be tested is d=6.35mm and FOV=1.5mm, the half-width W of the detection beam 201
Figure 108122198-A0202-12-0011-25
2d×tanθ-FOV/2=8.14mm. The detection beam 201 can be uniquely determined according to the relative illuminance determined by the illuminance U2 of the half-width edge of the detection beam 201 and the ratio U2/U1 of the center illuminance U1 of the detection beam 201, and the value of the half-width W of the detection beam 201.

圖6是本發明實施例提供的探測光束的結構示意圖。可選地,請參考圖6,探測光束201的主光線的角度偏差小於5°;散射成像光束的主光線的角度偏差小於5°。具體地,照明模組出射的探測光束201在待測產品40的檢測面上形成照明視場103,為保證缺陷檢測的準確度,探測光束201的出射方向需盡可能地相同。探測光束201的主光線是指照明視場的中心附近的光線;通常,當探測光束201的主光線角度偏差小於5°時,可以得到較為準確的 缺陷檢測結果;當探測光束201的主光線角度偏差小於1°時,可以得到更為精確的測量結果。示例性地,以波長為640nm的光為探測光束201,對20um的標準缺陷顆粒進行檢測時,當探測光束201的散射效率隨探測光束201的角度的偏差為10°時,散射效率的差值高達61.3%,由於缺陷產生散射光可能為任意方向,因此,該差異無法校正,導致缺陷檢測結果不準確。 6 is a schematic structural diagram of a detection beam provided by an embodiment of the present invention. Optionally, referring to FIG. 6, the angle deviation of the chief rays of the detection beam 201 is less than 5°; the angle deviation of the chief rays of the scattered imaging beam is less than 5°. Specifically, the detection beam 201 emitted by the illumination module forms an illumination field 103 on the detection surface of the product to be tested 40. In order to ensure the accuracy of defect detection, the exit direction of the detection beam 201 needs to be as same as possible. The chief ray of the detection beam 201 refers to the light near the center of the illumination field of view; generally, when the angle deviation of the main ray of the detection beam 201 is less than 5°, more accurate defect detection results can be obtained; when the angle of the main ray of the detection beam 201 When the deviation is less than 1°, more accurate measurement results can be obtained. Exemplarily, when the light with a wavelength of 640 nm is used as the detection beam 201 to detect 20 um standard defect particles, when the deviation of the scattering efficiency of the detection beam 201 from the angle of the detection beam 201 is 10°, the difference in scattering efficiency As high as 61.3%, because the scattered light generated by the defect may be in any direction, the difference cannot be corrected, resulting in inaccurate defect detection results.

圖7是本發明實施例提供的散射成像光束及成像檢測模組的結構示意圖。具體地,請參考圖2及圖7,由於探測光束被缺陷401散射後,形成的散射成像光束301的方向是任意的。能夠進入成像檢測模組30中的散射成像光束301包含不同方向的第一成像光線3010、第二成像光線3011及第三成像光線3012;其中,第一成像光線3010最接近垂直於成像檢測模組30接收散射成像光束301的面,因此,第一成像光線3010為散射成像光束301的主光線。對於散射成像光束301的主光線,其角度偏差也應該小於5°,可選地,散射成像光束301的主光線的角度偏差可以小於1°。 7 is a schematic structural diagram of a scattered imaging beam and an imaging detection module provided by an embodiment of the present invention. Specifically, please refer to FIGS. 2 and 7. Since the detection beam is scattered by the defect 401, the direction of the formed scattered imaging beam 301 is arbitrary. The scattered imaging beam 301 that can enter the imaging detection module 30 includes first imaging light 3010, second imaging light 3011, and third imaging light 3012 in different directions; wherein the first imaging light 3010 is closest to the imaging detection module 30 receives the surface of the scattered imaging light beam 301, therefore, the first imaging light 3010 is the chief light of the scattered imaging light beam 301. The angle deviation of the chief rays of the scattered imaging beam 301 should also be less than 5°. Alternatively, the angle deviation of the chief rays of the scattered imaging beam 301 may be less than 1°.

圖8是本發明實施例提供的另一缺陷檢測裝置的結構示意圖。可選地,請參考圖8,前述缺陷檢測裝置進一步包含水平運動模組50;水平運動模組50設置為承載待測產品40沿平行於待測產品40的檢測面的方向運動。具體地,在缺陷檢測過程中,水平運動模組50帶動待測產品40沿平行於待測產品40的檢測面的方向移動,實現對整個待測產品40的掃描檢測。 8 is a schematic structural diagram of another defect detection device provided by an embodiment of the present invention. Optionally, referring to FIG. 8, the aforementioned defect detection device further includes a horizontal motion module 50; the horizontal motion module 50 is configured to carry the product 40 to be tested in a direction parallel to the detection surface of the product 40 to be tested. Specifically, in the defect detection process, the horizontal motion module 50 drives the product to be tested 40 to move in a direction parallel to the detection surface of the product to be tested 40, so as to realize the scanning detection of the entire product to be tested 40.

可選地,本實施例提供的缺陷檢測裝置進一步包含:焦面測量模組70及垂直運動模組60;焦面測量模組70設置為檢測待測產品40的檢測面的離焦量;垂直運動模組60設置為根據離焦量控制待測產品40沿垂直於檢測面的方向運動。具體地,藉由測量待測產品40的檢測面與焦面測量模組70 之間的距離,即得到待測產品40的檢測面與成像檢測模組30之間的離焦量。垂直運動模組60可以設置為調節待測產品40的高度,從而調節待測產品40與照明模組20及成像檢測模組30的相對位置,保證缺陷檢測結果的準確性。 Optionally, the defect detection device provided in this embodiment further includes: a focal plane measurement module 70 and a vertical motion module 60; the focal plane measurement module 70 is configured to detect the defocus amount of the detection surface of the product 40 to be tested; vertical The motion module 60 is configured to control the product to be tested 40 to move in a direction perpendicular to the detection surface according to the defocus amount. Specifically, by measuring the distance between the detection surface of the product to be tested 40 and the focal plane measurement module 70, the defocus amount between the detection surface of the product to be tested 40 and the imaging detection module 30 is obtained. The vertical motion module 60 can be set to adjust the height of the product 40 to be tested, thereby adjusting the relative position of the product 40 to be tested, the illumination module 20 and the imaging detection module 30, to ensure the accuracy of the defect detection results.

可選地,成像檢測模組30設置為根據連續多次獲取的散射成像光束301確定多個成像訊號,並對多個成像訊號進行積分以確定缺陷訊息。為了保證對較小的缺陷顆粒的檢測的準確性,需要成像檢測模組30具有較高的空間解析度;具體地,通常要求缺陷檢測裝置的空間解析度小於0.1mm。仍以探測光束201的半高半寬W1為2.97mm為例,當空間解析度小於W1的0.2倍,即,空間解析度小於0.2×2.97=0.594mm時,但是由於探測光束201難以達到理想的直線狀態,探測光束201存在調焦誤差,檢測過程中出現的照明視場的焦面波動,待測產品的檢測面並非完全水準,以及水平運動模組的運動軸在運動過程中存在俯仰、翻滾或偏轉等,導致缺陷在照明視場中的位置存在較大差異,從而使缺陷接收及散射的光線能量存在較大差異,使得缺陷檢測的結果受上述偶然因素的影響較大。 Optionally, the imaging detection module 30 is configured to determine a plurality of imaging signals based on the scattered imaging beam 301 acquired multiple times in succession, and integrate the plurality of imaging signals to determine defect information. In order to ensure the accuracy of detecting smaller defective particles, the imaging detection module 30 needs to have a higher spatial resolution; specifically, the spatial resolution of the defect detection device is generally required to be less than 0.1 mm. Still taking the detection beam 201 with a half-height and half-width W1 of 2.97mm as an example, when the spatial resolution is less than 0.2 times W1, that is, the spatial resolution is less than 0.2×2.97=0.594mm, but it is difficult to achieve the ideal due to the detection beam 201 Straight line state, the detection beam 201 has a focus error, the focal plane of the illumination field of view fluctuates during the detection process, the detection surface of the product to be tested is not completely level, and the motion axis of the horizontal motion module has pitch and roll during the motion Or deflection, etc., resulting in a large difference in the position of the defect in the illumination field of view, so that there is a large difference in the energy of the light received and scattered by the defect, so that the result of the defect detection is greatly affected by the above accidental factors.

圖9是本實施例提供的探測光束與缺陷之間的位置關係示意圖。可選地,示例性的,請參考圖9,從t1至t4時刻,由於缺陷與探測光束的相對位置發生變化,t1時刻缺陷位於第一位置P1,t2時刻缺陷位於第二位置P2,t3時刻缺陷位於第三位置P3,t4時刻缺陷位於第四位置P4,成像檢測模組在不同時刻採集到的缺陷訊息,其對應的訊號強度差異很大,影響缺陷檢測精度及檢測的重複性,導致缺陷的檢測結果不可靠。但是本實施例藉由對從t1至t4時刻採集到的所有訊號進行積分處理後,得到的總的缺陷檢測訊號相對穩定,檢測精度及檢測的重複性可以大幅度提高。需要說明的是,本實施例僅示 例性的對連續四次採集的訊號進行積分,並非對本發明的限定。 9 is a schematic diagram of the positional relationship between the detection beam and the defect provided by this embodiment. Alternatively, for example, please refer to FIG. 9, from time t1 to t4, due to the change in the relative position of the defect and the detection beam, the defect is located at the first position P1 at time t1, the defect is located at the second position P2, time t3 The defect is located at the third position P3, and the defect is located at the fourth position P4 at time t4. The defect information collected by the imaging inspection module at different times has a large difference in signal intensity, which affects the accuracy and repeatability of the defect detection, resulting in defects Test results are not reliable. However, in this embodiment, by integrating all the signals collected from time t1 to time t4, the total defect detection signal obtained is relatively stable, and the detection accuracy and detection repeatability can be greatly improved. It should be noted that this embodiment only exemplarily integrates the signals collected four times in succession, and does not limit the present invention.

可選地,請繼續參考圖8,成像檢測模組30包含積分相機302;積分相機302可以為TDI相機、CMOS相機或者CCD相機。具體地,TDI相機是一種時間延遲積分相機,可以對移動的物體進行連續拍照,記錄採集物體移動過程中的位置變化。CMOS相機的核心結構是CMOS元件,解析度高,能夠用於記錄移動中物體的位置訊息。CCD相機的解析度高,尤其在拍攝的位置或移動時,藉由對CCD相機拍攝的畫面進行處理後,可以得到詳細的物體移動位置訊息。可以理解的是,積分相機302亦可以是其他類型的相機,本實施例對此不作具體限制。 Optionally, please continue to refer to FIG. 8, the imaging detection module 30 includes an integration camera 302; the integration camera 302 may be a TDI camera, a CMOS camera, or a CCD camera. Specifically, the TDI camera is a time-delay integration camera, which can continuously take pictures of moving objects and record the position change during the movement of the collected objects. The core structure of a CMOS camera is a CMOS element, which has high resolution and can be used to record the position information of moving objects. The resolution of the CCD camera is high, especially in the shooting position or movement, by processing the picture taken by the CCD camera, detailed object movement position information can be obtained. It can be understood that the integration camera 302 may also be another type of camera, which is not specifically limited in this embodiment.

可選地,成像檢測模組30進一步包含聚光單元303,聚光單元303設置為匯聚散射成像光束301,使匯聚後的成像光線301入射到積分相機302。由於探測光束201被缺陷401散射後,形成的散射成像光束301可以沿任意方向傳播,能夠進入到成像檢測模組30的光線為發散光。為了方便缺陷訊息的檢測,需要對發散的散射成像光束301進行匯聚。可選地,聚光單元303可以為一組透鏡,透鏡的個數可以根據實際需要設置,本實施例不作具體限制。 Optionally, the imaging detection module 30 further includes a condensing unit 303 configured to converge the scattered imaging light beam 301 so that the condensed imaging light 301 is incident on the integrating camera 302. Since the detection beam 201 is scattered by the defect 401, the formed scattered imaging beam 301 can propagate in any direction, and the light that can enter the imaging detection module 30 is divergent light. In order to facilitate the detection of defect information, the divergent scattered imaging beam 301 needs to be converged. Optionally, the condensing unit 303 may be a group of lenses, and the number of lenses may be set according to actual needs, and this embodiment is not specifically limited.

可選地,探測光束201滿足高斯分布。具體地,照明模組20出射的探測光束201可以為高斯光束。高斯光束的振幅按照高斯函數的規律變化,光束中心的照度較大,從光束中心往光束邊緣,高斯光束的振幅衰減較快,藉由一定的光學調節手段,容易得到視場寬度較小的光束,從而可以更好的抑制缺陷檢測過程中產生的串擾,提高缺陷檢測的精度。 Optionally, the detection beam 201 satisfies the Gaussian distribution. Specifically, the detection beam 201 emitted by the lighting module 20 may be a Gaussian beam. The amplitude of the Gaussian beam changes according to the law of the Gaussian function. The illumination at the center of the beam is large. From the center of the beam to the edge of the beam, the amplitude of the Gaussian beam decays faster. With certain optical adjustment methods, it is easy to obtain a beam with a small field of view width Therefore, the crosstalk generated during the defect detection process can be better suppressed, and the accuracy of defect detection can be improved.

本實施例進一步提供一種光刻設備,前述光刻設備可以包含本 發明任意實施例所述的缺陷檢測裝置。 This embodiment further provides a lithography apparatus. The foregoing lithography apparatus may include the defect detection device according to any embodiment of the present invention.

本實施例提供的光刻設備,藉由最小可檢測缺陷在可被接收角度內對光線的散射效率、非檢測面上的最大串擾物在可被接收角度內對光線的散射效率,以及抑制待測產品的非檢測面的串擾所需要的訊噪比,得到探測光束的半寬邊緣與探測光束的中心之間的相對照度;藉由探測光束在待測產品中的折射角、散射成像光束在待測產品中的折射角、待測產品的厚度以及成像檢測模組的有效視場,得到夠滿足抑制待測產品的非檢測面的串擾所需要的探測光束的半寬;根據相對照度及探測光束的半寬可以確定照明模組的具體參數,藉由設置滿足上述參數的照明模組,使得本發明實施例的缺陷檢測裝置在缺陷檢測過程中可以抑制缺陷檢測過程中產生的串擾,提高缺陷檢測精度。 The lithographic apparatus provided in this embodiment uses the minimum detectable defect to scatter the light within the acceptable angle, the maximum crosstalk on the non-detection surface to scatter the light within the acceptable angle, and suppress The signal-to-noise ratio required for the crosstalk of the non-detection surface of the measured product is obtained as the relative illuminance between the half-width edge of the detection beam and the center of the detection beam; by the angle of refraction of the detection beam in the product to be tested, the scattered imaging beam The refraction angle of the product under test, the thickness of the product under test, and the effective field of view of the imaging detection module can obtain a half-width of the detection beam that is sufficient to suppress the crosstalk of the non-detection surface of the product under test; according to the relative illuminance and detection The half-width of the light beam can determine the specific parameters of the lighting module. By setting the lighting module to meet the above parameters, the defect detection device of the embodiment of the present invention can suppress the crosstalk generated in the defect detection process during the defect detection process and improve the defect Detection accuracy.

基於同一發明構思,在缺陷檢測裝置的基礎上,本實施例進一步提供一種缺陷檢測方法。本實施例提供的缺陷檢測方法可以由上述任意實施例所提供的缺陷檢測裝置來執行,缺陷檢測方法具備與缺陷檢測裝置相應的功效。未在本實施例中詳盡描述的技術細節,可參見本發明任意實施例所提供的缺陷檢測裝置。 Based on the same inventive concept, on the basis of the defect detection device, this embodiment further provides a defect detection method. The defect detection method provided in this embodiment may be performed by the defect detection device provided in any of the above embodiments, and the defect detection method has the corresponding function as the defect detection device. For technical details that are not described in detail in this embodiment, refer to the defect detection device provided in any embodiment of the present invention.

圖10是本發明實施例提供的缺陷檢測方法的流程圖。可選地,本實施例進一步提供一種缺陷檢測方法,包含: 10 is a flowchart of a defect detection method provided by an embodiment of the present invention. Optionally, this embodiment further provides a defect detection method, including:

步驟1、藉由照明模組產生探測光束,並使探測光束入射至待測產品的檢測面上;探測光束的照度及探測光束的半寬分別滿足:(U1×R)/(U2×L)

Figure 108122198-A0202-12-0015-32
S1,d×[tanα+tanβ]>FOV/2+W。 Step 1. Generate the detection beam by the illumination module and make the detection beam incident on the detection surface of the product to be tested; the illuminance of the detection beam and the half-width of the detection beam satisfy: (U1×R)/(U2×L)
Figure 108122198-A0202-12-0015-32
S1, d×[tanα+tanβ]>FOV/2+W.

步驟2、藉由成像檢測模組檢測探測光束是否經待測產品的檢測面散射產生散射成像光束,並在檢測到前述探測光束經前述待測產品的檢測 面散射產生散射成像光束的情況下,根據散射成像光束確定缺陷訊息。 Step 2: The imaging detection module detects whether the detection beam is scattered by the detection surface of the product under test to generate a scattered imaging beam, and when it is detected that the detection beam is scattered by the detection surface of the product under test to generate a scattered imaging beam, Determine the defect information based on the scattered imaging beam.

其中,S1為抑制待測產品的非檢測面的串擾需要滿足的訊噪比,U1為探測光束的中心照度,R為最小可檢測缺陷在可被接收角度內對光線的散射效率,U2為探測光束的半寬邊緣的照度,L為非檢測面上的最大串擾物在可被接收角度內對光線的散射效率,d為待測產品的厚度;FOV為成像檢測模組的有效視場;α為探測光束在待測產品中的折射角,β為散射成像光束在待測產品中的折射角。 Among them, S1 is the signal-to-noise ratio that must be met to suppress the crosstalk of the non-detection surface of the product under test, U1 is the central illuminance of the detection beam, R is the scattering efficiency of the smallest detectable defect within the acceptable angle of light, and U2 is the detection Illumination of the half-width edge of the beam, L is the scattering efficiency of the largest crosstalk object on the non-detection surface within the acceptable angle of light, d is the thickness of the product to be measured; FOV is the effective field of view of the imaging detection module; α To detect the angle of refraction of the light beam in the product to be measured, β is the angle of refraction of the scattered imaging light beam in the product to be measured.

本實施例藉由最小可檢測缺陷在可被接收角度內對光線的散射效率、非檢測面上的最大串擾物在可被接收角度內對光線的散射效率,以及抑制待測產品的非檢測面的串擾所需要的訊噪比,得到探測光束的半寬邊緣與探測光束的中心之間的相對照度;藉由探測光束在待測產品中的折射角、散射成像光束在待測產品中的折射角、待測產品的厚度以及成像檢測模組的有效視場,得到夠滿足抑制待測產品的非檢測面的串擾所需要的探測光束的半寬;根據相對照度及探測光束的半寬可以確定照明模組的具體參數,藉由設置滿足上述參數的照明模組,使得本發明實施例的缺陷檢測裝置在缺陷檢測過程中可以抑制缺陷檢測過程中產生的串擾,提高缺陷檢測精度 This embodiment uses the minimum detectable defect to scatter the light within the receivable angle, the maximum crosstalk of the non-detection surface to scatter the light within the receivable angle, and suppress the non-detection surface of the product to be tested The required signal-to-noise ratio of the crosstalk is obtained by the relative illuminance between the half-width edge of the detection beam and the center of the detection beam; by the angle of refraction of the detection beam in the product to be tested and the refraction of the scattering imaging beam in the product to be tested The angle, the thickness of the product to be measured and the effective field of view of the imaging detection module can obtain the half width of the detection beam that is sufficient to suppress the crosstalk of the non-detection surface of the product to be tested; it can be determined according to the relative illuminance and the half width of the detection beam For the specific parameters of the lighting module, by setting the lighting module to satisfy the above parameters, the defect detection device of the embodiment of the present invention can suppress the crosstalk generated in the defect detection process during the defect detection process and improve the defect detection accuracy

可選地,根據成像光線確定缺陷訊息包含:根據連續多次獲取的散射成像光束確定多個成像訊號,對多個成像訊號進行積分以確定缺陷訊息。 Optionally, determining the defect information according to the imaging light includes: determining a plurality of imaging signals according to the scattered imaging light beams obtained consecutively for multiple times, and integrating the plurality of imaging signals to determine the defect information.

具體地,為了提高缺陷檢測的品質,可以連續多次獲取散射成像光束,從而獲得多個成像訊號,對多個成像訊號進行積分,進而提高缺陷檢測的精度及檢測的可重複性。 Specifically, in order to improve the quality of defect detection, the scattered imaging beams can be acquired multiple times in succession, thereby obtaining multiple imaging signals, and integrating the multiple imaging signals, thereby improving the accuracy of the defect detection and the repeatability of the detection.

301‧‧‧散射成像光束 301‧‧‧scattered imaging beam

40‧‧‧待測產品 40‧‧‧Product to be tested

401‧‧‧缺陷 401‧‧‧ Defect

402‧‧‧串擾物 402‧‧‧ Crosstalk

2011‧‧‧中心光線 2011‧‧‧Central light

2012‧‧‧邊緣光線 2012‧‧‧Edge light

Claims (12)

一種缺陷檢測裝置,其特徵係包含照明模組及成像檢測模組;前述照明模組設置為產生探測光束,並使前述探測光束入射至待測產品的檢測面上;前述成像檢測模組設置為檢測前述探測光束是否經前述待測產品的檢測面散射產生散射成像光束,並在檢測到前述探測光束經前述待測產品的檢測面散射產生散射成像光束的情況下,根據前述散射成像光束確定前述待測產品的缺陷訊息;其中,前述探測光束的照度滿足:(U1×R)/(U2×L)
Figure 108122198-A0202-13-0001-33
S1;其中,S1為抑制前述待測產品的非檢測面的串擾需要滿足的訊噪比,U1為前述探測光束的中心照度,R為最小可檢測缺陷在可被接收角度內對光線的散射效率,U2為前述探測光束的半寬邊緣的照度,L為前述非檢測面上的最大串擾物在可被接收角度內對光線的散射效率;前述探測光束的半寬W滿足:d×(tanα+tanβ)>FOV/2+W;其中,d為前述待測產品的厚度;FOV為前述成像檢測模組的有效視場;α為探測光束在前述待測產品中的折射角,β為前述散射成像光束在前述待測產品中的折射角。
A defect detection device, characterized in that it includes an illumination module and an imaging detection module; the illumination module is configured to generate a detection beam, and the detection beam is incident on the detection surface of the product to be tested; and the imaging detection module is configured as Detecting whether the detection beam is scattered by the detection surface of the product under test to generate a scattering imaging beam, and when detecting that the detection beam is scattered by the detection surface of the product under test to generate a scattering imaging beam, determining the foregoing from the scattering imaging beam Defect information of the product to be tested; where the illuminance of the aforementioned detection beam satisfies: (U1×R)/(U2×L)
Figure 108122198-A0202-13-0001-33
S1; where S1 is the signal-to-noise ratio that needs to be met to suppress the crosstalk of the non-detection surface of the product under test, U1 is the central illuminance of the detection beam, and R is the light scattering efficiency of the smallest detectable defect within the acceptable angle , U2 is the illuminance of the half-width edge of the detection beam, L is the scattering efficiency of the maximum crosstalk on the non-detection surface to the light within the acceptable angle; the half-width W of the detection beam satisfies: d×(tanα+ tanβ)>FOV/2+W; where d is the thickness of the product to be tested; FOV is the effective field of view of the imaging detection module; α is the angle of refraction of the detection beam in the product to be tested, and β is the scattering The angle of refraction of the imaging beam in the aforementioned product to be tested.
如申請專利範圍第1項所記載之缺陷檢測裝置,其中,前述探測光束的照度還滿足:(U1×R)/(U2×M×N)
Figure 108122198-A0202-13-0001-34
S2;其中,S2為抑制鏡像串擾需要滿足的訊噪比,M為前述探測光束在鏡像串擾區域內沿鏡像串擾方向的散射效率,N為前述探測光束在鏡像串擾方向的散射光線在前述待測產品內的反射率; 前述探測光束的半寬W還滿足:2d×tanθ-FOV/2
Figure 108122198-A0202-13-0002-29
W,其中,θ為前述探測光束沿鏡像串擾方向的散射光線在前述待測產品中的折射角。
The defect detection device as described in item 1 of the patent application scope, wherein the illuminance of the detection beam further satisfies: (U1×R)/(U2×M×N)
Figure 108122198-A0202-13-0001-34
S2; where S2 is the signal-to-noise ratio that needs to be satisfied to suppress the image crosstalk, M is the scattering efficiency of the aforementioned detection beam in the image crosstalk direction in the image crosstalk area, and N is the scattered light of the aforementioned detection beam in the image crosstalk direction in the aforementioned test Reflectance within the product; the half width W of the aforementioned detection beam also satisfies: 2d×tanθ-FOV/2
Figure 108122198-A0202-13-0002-29
W, where θ is the angle of refraction of the scattered light of the probe beam along the mirror image crosstalk direction in the product to be tested.
如申請專利範圍第1項所記載之缺陷檢測裝置,其中,前述探測光束的主光線的角度偏差小於5°;前述散射成像光束的主光線的角度偏差小於5°。 The defect detection device as described in item 1 of the patent application range, wherein the angle deviation of the chief rays of the detection beam is less than 5°; the angle deviation of the chief rays of the scattered imaging beam is less than 5°. 如申請專利範圍第1項所記載之缺陷檢測裝置,其中,進一步包含:水平運動模組;前述水平運動模組設置為承載前述待測產品沿平行於前述待測產品的檢測面的方向運動。 The defect detection device as described in Item 1 of the patent application scope further includes: a horizontal motion module; the horizontal motion module is configured to carry the product to be tested in a direction parallel to the detection surface of the product to be tested. 如申請專利範圍第1項所記載之缺陷檢測裝置,其中,進一步包含:焦面測量模組及垂直運動模組;前述焦面測量模組設置為檢測前述待測產品的檢測面的離焦量;前述垂直運動模組設置為根據前述離焦量控制前述待測產品沿垂直於前述檢測面的方向運動。 The defect detection device as described in item 1 of the patent application scope further includes: a focal plane measurement module and a vertical motion module; the focal plane measurement module is configured to detect the defocus amount of the detection surface of the product to be tested The vertical motion module is configured to control the product to be tested to move in a direction perpendicular to the detection surface according to the defocus amount. 如申請專利範圍第1項所記載之缺陷檢測裝置,其中,前述成像檢測模組設置為根據連續多次獲取的散射成像光束確定多個成像訊號,並對前述多個成像訊號進行積分以確定前述缺陷訊息。 The defect detection device as described in item 1 of the patent application scope, wherein the imaging detection module is configured to determine a plurality of imaging signals based on the scattered imaging beams obtained consecutively for multiple times, and integrate the plurality of imaging signals to determine the aforesaid Defect message. 如申請專利範圍第6項所記載之缺陷檢測裝置,其中,前述成像檢測模組包含積分相機;前述積分相機為時間延時積分TDI相機、互補金屬氧化物半導體CMOS相機或者電荷耦合元件CCD相機。 The defect detection device as described in Item 6 of the patent application range, wherein the imaging detection module includes an integration camera; the integration camera is a time-delay integration TDI camera, a complementary metal oxide semiconductor CMOS camera, or a charge-coupled element CCD camera. 如申請專利範圍第7項所記載之缺陷檢測裝置,其中, 前述成像檢測模組進一步包含聚光單元,前述聚光單元設置為會聚前述散射成像光束,使會聚後的前述散射成像光束入射到前述積分相機。 The defect detection device as described in item 7 of the patent application range, wherein the imaging detection module further includes a condensing unit configured to converge the scattered imaging light beam so that the converged scattered imaging light beam enters the foregoing Integral camera. 如申請專利範圍第1項所記載之缺陷檢測裝置,其中,前述探測光束滿足高斯分布。 The defect detection device described in item 1 of the patent application range, wherein the detection beam satisfies the Gaussian distribution. 一種光刻設備,其特徵係包含申請專利範圍第1-9項任一項所記載之缺陷檢測裝置。 A lithographic apparatus, characterized in that it includes the defect detection device described in any of items 1-9 of the patent application. 一種缺陷檢測方法,其特徵係包含:藉由照明模組產生探測光束,並使前述探測光束入射至待測產品的檢測面上;前述探測光束的照度及探測光束的半寬分別分別滿足:(U1×R)/(U2×L)
Figure 108122198-A0202-13-0003-30
S1,d×(tanα+tanβ)>FOV/2+W;藉由成像檢測模組檢測前述探測光束是否經前述待測產品的檢測面散射產生散射成像光束,並在檢測到前述探測光束經前述待測產品的檢測面散射產生散射成像光束的情況下,根據前述散射成像光束確定缺陷訊息;其中,S1為抑制前述待測產品的非檢測面的串擾需要滿足的訊噪比,U1為前述探測光束的中心照度,R為最小可檢測缺陷在可被接收角度內對光線的散射效率,U2為前述探測光束的半寬邊緣的照度,L為前述非檢測面上的最大串擾物在可被接收角度內對光線的散射效率,d為前述待測產品的厚度;FOV為前述成像檢測模組的有效視場;α為探測光束在前述待測產品中的折射角,β為前述散射成像光束在前述待測產品中的折射角。
A defect detection method, which includes: generating a detection beam by an illumination module and making the detection beam incident on the detection surface of the product to be tested; the illuminance of the detection beam and the half width of the detection beam respectively satisfy: U1×R)/(U2×L)
Figure 108122198-A0202-13-0003-30
S1, d×(tanα+tanβ)>FOV/2+W; the imaging detection module detects whether the detection beam is scattered by the detection surface of the product under test to generate a scattered imaging beam, and detects that the detection beam passes through the If the scattered imaging beam is generated by the scattering of the detection surface of the product under test, the defect information is determined according to the aforementioned scattered imaging beam; S1 is the signal-to-noise ratio that must be satisfied to suppress the crosstalk of the non-detection surface of the product under test, and U1 is the aforementioned detection The central illuminance of the beam, R is the scattering efficiency of the smallest detectable defect within the acceptable angle, U2 is the illuminance of the half-width edge of the aforementioned detection beam, and L is the maximum crosstalk on the non-detection surface that can be received Light scattering efficiency within an angle, d is the thickness of the product under test; FOV is the effective field of view of the imaging detection module; α is the angle of refraction of the detection beam in the product under test, β is the scattering imaging beam at The refraction angle in the aforementioned product to be tested.
如申請專利範圍第11項所記載之缺陷檢測方法,其中,根據前述散射成像光束確定缺陷訊息包含:根據連續多次獲取的散射成像光束確定多個成像訊號; 對前述多個成像訊號進行積分以確定前述缺陷訊息。 The defect detection method as described in item 11 of the patent application scope, wherein determining the defect information based on the aforementioned scattered imaging light beam includes: determining a plurality of imaging signals based on the scattered imaging light beams obtained multiple times in succession; integrating the plurality of imaging signals to Confirm the aforementioned defect message.
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