TW201947233A - Guide board, manufacturing method thereof, and probe head having the same - Google Patents
Guide board, manufacturing method thereof, and probe head having the same Download PDFInfo
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- TW201947233A TW201947233A TW107115993A TW107115993A TW201947233A TW 201947233 A TW201947233 A TW 201947233A TW 107115993 A TW107115993 A TW 107115993A TW 107115993 A TW107115993 A TW 107115993A TW 201947233 A TW201947233 A TW 201947233A
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Abstract
Description
本揭示是關於一種導位板及其製造方法，特別是關於一種採用多板件組合結構的導位板和具有該導位板之探針頭。 The present disclosure relates to a positioning plate and a manufacturing method thereof, and particularly to a positioning plate using a multi-plate assembly structure and a probe head having the same.
探針頭(probe head)具有多片導位板用以固定多個探針並以提供一致性作動的機構。現有之單一片導位板為一體成型之結構，且均採用單一種無機絕緣材料製作。為了使導位板具有足夠的剛性，市售導位板的材料大多選用氮化矽。 The probe head has a plurality of positioning plates for fixing a plurality of probes and providing a mechanism for consistent operation. The existing single-piece guide plate is an integrally formed structure, and all are made of a single inorganic insulating material. In order to make the guide plate have sufficient rigidity, most of the commercially available guide plates are made of silicon nitride.
氮化矽材料的價格偏高，且傳統的燒結方式無法滿足其品質要求，故在生產製造過程中，需使用特殊燒結方式，例如放電電漿燒結。並且，氮化矽在燒結成塊後須以研磨方式加工至所需的尺寸及厚度。由於傳統的導位板為單一結構，故隨著晶圓腳位增加以及為了滿足多晶粒晶圓同步測試的需求，導位板的面積將隨著探針的數量增加而變大。然而，隨著導位板的尺寸越大，其製造價格也越昂貴。特別地，現行技術還難以對大尺寸(例如12吋)的氮化矽基板進行研磨加工，除了研磨機台製作不易以外，其加工品質也難以控制在要求的規範內。另外，為了成功地在導位板上形成微小孔洞，加工條件被限制在需採用短脈衝的飛秒雷射進行，該 技術存在一定的失敗率，如此，倘若孔洞加工失敗則會導致整個導位板報廢。上述種種限制都會造成導位板的設計及應用受到侷限，且隨著導位板的尺寸增加，其加工困難度、材料成本、加工時間皆會隨之提高，進而造成製造成本高昂與影響導位板的發展。 The price of silicon nitride material is high, and the traditional sintering method cannot meet its quality requirements. Therefore, in the manufacturing process, special sintering methods are required, such as discharge plasma sintering. In addition, after sintering and agglomerating the silicon nitride, it must be processed to the required size and thickness by grinding. Because the conventional guide plate has a single structure, the area of the guide plate will increase with the increase of the number of probes as the number of wafer pins increases and in order to meet the requirements of multi-die wafer synchronous testing. However, the larger the size of the guide plate, the more expensive it is to manufacture. In particular, the current technology also makes it difficult to grind a large-sized (eg, 12-inch) silicon nitride substrate. In addition to the difficulty of making a polishing machine, its processing quality is also difficult to control within the required specifications. In addition, in order to successfully form tiny holes in the guide plate, the processing conditions are limited to the use of a short pulse of femtosecond laser. This technology has a certain failure rate. In this case, if the hole processing fails, the entire guide bit will be caused Board scrapped. The above-mentioned restrictions will cause the design and application of the guide plate to be limited. As the size of the guide plate increases, the processing difficulty, material cost and processing time will increase accordingly, which will cause high manufacturing costs and affect the guide plate. Board development.
有鑑於此，有必要提出一種用於組裝在探針頭之導位板，以解決習知技術中存在的問題。 In view of this, it is necessary to propose a guide plate for assembling on the probe head to solve the problems existing in the conventional technology.
為解決上述習知技術之問題，本揭示之目的在於提供一種導位板和具有該導位板之探針頭，其中導位板是採用多板件的組合結構，並依照需求使用適當的材料與加工方法，進而解決大尺寸之導位板的製造困難與成本高昂的問題。 In order to solve the problems of the conventional technology, the purpose of this disclosure is to provide a guide plate and a probe head having the guide plate, wherein the guide plate adopts a combination structure of multiple plates and uses appropriate materials according to requirements. And processing methods, thereby solving the problems of manufacturing difficulty and high cost of the large-sized guide plate.
為達成上述目的，本揭示提供一種導位板，用於晶圓量測之探針頭，包含：一載板，包含至少一開口；以及一微孔導位板，與該載板連接且組裝在該載板之該至少一開口之位置，其中該微孔導位板包含複數個開孔，並且每一開孔是用於與一探針對應組裝。 In order to achieve the above object, the present disclosure provides a positioning board, a probe head for wafer measurement, including: a carrier board including at least one opening; and a micro-hole guide board connected to the carrier board and assembled. At the position of the at least one opening of the carrier plate, the micro-hole guide plate includes a plurality of openings, and each opening is used for corresponding assembly with a probe.
於本揭示其中之一較佳實施例當中，該微孔導位板與該載板是採用不同的材料。 In one preferred embodiment of the present disclosure, the micro-hole guide plate and the carrier plate are made of different materials.
於本揭示其中之一較佳實施例當中，該微孔導位板和該載板的材料包含陶瓷、金屬、玻璃、或藍寶石。 In one preferred embodiment of the present disclosure, the material of the micro-hole guide plate and the carrier plate comprises ceramic, metal, glass, or sapphire.
於本揭示其中之一較佳實施例當中，該導位板還包含一黏貼層，設置在該載板與該微孔導位板之間，用於黏接該微孔導位板與該載板。 In one of the preferred embodiments of the present disclosure, the guide plate further includes an adhesive layer disposed between the carrier plate and the micro-hole guide plate for bonding the micro-hole guide plate and the carrier. board.
本揭示還提供一種用於晶圓量測之探針頭，包含：複數個探 針；至少一導位板，包含：一載板，包含至少一開口；以及一微孔導位板，與該載板連接且組裝在該載板之該至少一開口之位置，其中該微孔導位板包含複數個開孔，並且每一開孔是用於與該複數個探針之其中之一探針對應組裝。 The present disclosure also provides a probe head for wafer measurement, including: a plurality of probes; at least one guide plate, including: a carrier plate, including at least one opening; and a micro-hole guide plate, and the The carrier board is connected and assembled at the position of the at least one opening of the carrier board, wherein the microwell guide plate includes a plurality of openings, and each opening is a probe for connecting with the plurality of probes. Corresponds to assembly.
於本揭示其中之一較佳實施例當中，該導位板還包含一黏貼層，設置在該載板與該微孔導位板之間，用於黏接該微孔導位板與該載板。 In one of the preferred embodiments of the present disclosure, the guide plate further includes an adhesive layer disposed between the carrier plate and the micro-hole guide plate for bonding the micro-hole guide plate and the carrier. board.
本揭示還提供導位板之製造方法，該導位板用於晶圓量測之探針頭，方法包含：提供一載板，其中該載板包含至少一開口；以及提供一微孔導位板，其中該微孔導位板包含複數個開孔，並且每一開孔是用於與一探針對應組裝；以及連接該載板與該微孔導位板，其中該微孔導位板組裝在該載板之該至少一開口之位置。 The present disclosure also provides a method for manufacturing a guide plate for a probe head for wafer measurement. The method includes: providing a carrier plate, wherein the carrier plate includes at least one opening; and providing a micro-hole guide. A plate, wherein the micro-hole guide plate includes a plurality of openings, and each of the holes is used for corresponding assembly with a probe; and connecting the carrier plate and the micro-hole guide plate, wherein the micro-hole guide plate Assembled at the position of the at least one opening of the carrier board.
於本揭示其中之一較佳實施例當中，該微孔導位板是以黏接方式組裝在該載板上。 In one preferred embodiment of the present disclosure, the micro-hole guide plate is assembled on the carrier plate by an adhesive method.
於本揭示其中之一較佳實施例當中，該微孔導位板之複數個開孔之形成方法包含雷射穿孔、雷射改質蝕刻穿孔、紫外光改質蝕刻穿孔、或電漿穿孔加工法。 In one of the preferred embodiments of the present disclosure, the method for forming a plurality of openings of the micro-hole guide plate includes laser perforation, laser modified etching perforation, ultraviolet modified etching perforation, or plasma perforation processing. law.
相較於先前技術，本揭示藉由使探針頭之導位板設計為將微孔區域與非微孔區域分開製作接著再組合在一起之多板件的結構。如此，分開製作的板件可依各自需求進行材料的選擇，及選擇適當地加工方法，以達到最有利之製作方式，進而增加生產良率與降低生產成本。 Compared with the prior art, the present disclosure uses a design of the guide plate of the probe head to separate the micro-porous area from the non-micro-porous area to make a multi-plate structure. In this way, the separately manufactured plates can be selected according to their respective needs and the appropriate processing method to achieve the most advantageous manufacturing method, thereby increasing production yield and reducing production costs.
10‧‧‧導位板 10‧‧‧ Guide plate
11‧‧‧載板 11‧‧‧ Carrier Board
110‧‧‧第一開口 110‧‧‧First opening
111‧‧‧第二開口 111‧‧‧ second opening
12‧‧‧第一微孔導位板 12‧‧‧The first microwell guide plate
121‧‧‧第一開孔 121‧‧‧ first opening
13‧‧‧第二微孔導位板 13‧‧‧Second microwell guide plate
131‧‧‧第二開孔 131‧‧‧Second opening
2‧‧‧探針頭 2‧‧‧ probe head
21‧‧‧第一間隔板 21‧‧‧First spacer
22‧‧‧第一導位板 22‧‧‧The first guide plate
221‧‧‧第一載板 221‧‧‧ the first carrier board
2210‧‧‧第一開口 2210‧‧‧First opening
222‧‧‧第一微孔導位板 222‧‧‧The first micro-well guide plate
2220‧‧‧第一開孔 2220‧‧‧First opening
23‧‧‧第二間隔板 23‧‧‧Second spacer
24‧‧‧第二導位板 24‧‧‧Second Guide Plate
241‧‧‧第二載板 241‧‧‧Second carrier board
2410‧‧‧第二開口 2410‧‧‧Second opening
242‧‧‧第二微孔導位板 242‧‧‧Second microwell guide plate
2420‧‧‧第二開孔 2420‧‧‧Second opening
25‧‧‧黏貼層 25‧‧‧ Adhesive layer
26‧‧‧黏貼層 26‧‧‧ Adhesive layer
27‧‧‧探針 27‧‧‧ Probe
S1~S3‧‧‧步驟 Steps S1 ~ S3‧‧‧‧
第1圖顯示本揭示之較佳實施例之導位板之結構示意圖；第2圖顯示第1圖導位板之製造流程圖；第3圖顯示本揭示之較佳實施例之探針頭之零件***圖；以及第4圖顯示第3圖之探針頭之剖面示意圖。 Fig. 1 shows the structure of the guide plate of the preferred embodiment of the present disclosure; Fig. 2 shows the manufacturing flow chart of the guide plate of Fig. 1; Fig. 3 shows the probe head of the preferred embodiment of the present disclosure. Exploded view of parts; and Figure 4 shows a schematic cross-sectional view of the probe head of Figure 3.
為了讓本揭示之上述及其他目的、特徵、優點能更明顯易懂，下文將特舉本揭示較佳實施例，並配合所附圖式，作詳細說明如下。 In order to make the above and other objects, features, and advantages of the present disclosure more comprehensible, the following describes the preferred embodiments of the present disclosure and the accompanying drawings in detail, as follows.
請參照第1圖和第2圖，第1圖顯示本揭示之較佳實施例之導位板10之結構示意圖，以及第2圖顯示第1圖導位板之製造流程圖。導位板10是作為用於晶圓量測之探針頭之其中一部份零件，其包含載板11、第一微孔導位板12、和第二微孔導位板13。在製造導位板10時，首先，步驟S1，提供載板11，其中載板11內部開設有第一開口110和第二開口111(對應第1圖之虛線範圍)。可選地，載板11上可設置用於與另一元件對應組裝的組裝孔或對位孔。載板11的材料可選自於金屬、陶瓷(包含氮化矽)、藍寶石、或玻璃等。應當注意的是，由於載板11佔了導位板10較大部分的面積，故材料選擇上載板11可採用相較於第一微孔導位板12和第二微孔導位板13之價格相對低廉且加工容易的材料製成，如此可有效地降低導位板10整體的製造成本。 Please refer to FIG. 1 and FIG. 2. FIG. 1 shows a schematic structural diagram of the guide plate 10 according to the preferred embodiment of the present disclosure, and FIG. 2 shows a manufacturing flow chart of the guide plate of FIG. 1. The guide plate 10 is a part of a probe head for wafer measurement, and includes a carrier plate 11, a first micro-hole guide plate 12, and a second micro-hole guide plate 13. When manufacturing the guide plate 10, first, step S1, a carrier plate 11 is provided, wherein the carrier plate 11 is provided with a first opening 110 and a second opening 111 (corresponding to the dotted line range in FIG. 1). Optionally, an assembly hole or an alignment hole may be provided on the carrier plate 11 for assembling corresponding to another component. The material of the carrier plate 11 may be selected from metals, ceramics (including silicon nitride), sapphire, or glass. It should be noted that, since the carrier plate 11 occupies a larger area of the guide plate 10, the material selection carrier plate 11 can be compared with the first micro hole guide plate 12 and the second micro hole guide plate 13. The price is relatively low and the material is easy to process. This can effectively reduce the overall manufacturing cost of the guide plate 10.
如第1圖和第2圖所示，接著，進行步驟S2，提供第一微孔導位板12和第二微孔導位板13，其中第一微孔導位板12和第二微孔導位板13分別設有複數個第一開孔121和複數個第二開孔131。該等第一開孔121和第二開孔131是用於使插裝在探針頭內之複數個探針彼此分 離，進而避免相鄰兩探針彼此接觸而造成短路或訊號異常。第一微孔導位板12和第二微孔導位板13的材料可選自於金屬、陶瓷(包含氮化矽)、藍寶石、或玻璃等。較佳地，第一微孔導位板12和第二微孔導位板13可使用較小尺寸(例如小於12吋)之基材進行加工。可以理解的是，對於小面積的材料加工來說，不但加工機台容易取得，且加工技術的成熟度也較高，進而可有效地提高該等第一開孔121和第二開孔131的加工良率。 As shown in FIG. 1 and FIG. 2, step S2 is then performed to provide a first microwell guide plate 12 and a second microwell guide plate 13, wherein the first microwell guide plate 12 and the second microwell The guide plate 13 is respectively provided with a plurality of first openings 121 and a plurality of second openings 131. The first openings 121 and the second openings 131 are used to separate a plurality of probes inserted in the probe head from each other, thereby preventing adjacent two probes from contacting each other to cause a short circuit or an abnormal signal. The material of the first microvia guide plate 12 and the second microvia guide plate 13 may be selected from metals, ceramics (including silicon nitride), sapphire, or glass. Preferably, the first micro-hole guide plate 12 and the second micro-hole guide plate 13 can be processed using a substrate with a smaller size (for example, less than 12 inches). It can be understood that, for small-area material processing, not only are the processing machines easy to obtain, but the maturity of the processing technology is also high, which can effectively improve the first opening 121 and the second opening 131. Processing yield.
為了符合探針頭之導位板10的品質需求，第一微孔導位板12和第二微孔導位板13之該等第一開孔121和第二開孔131可選用飛秒雷射穿孔的方式加工。進一步地，為了減少製程時間，除了飛秒雷射穿孔外，亦可使用雷射改質蝕刻穿孔、紫外光改質蝕刻穿孔、或電漿穿孔之其他加工方法來加速第一微孔導位板12和第二微孔導位板13的製作。舉例來說，以紫外光改質蝕刻穿孔為例，當第一微孔導位板12和第二微孔導位板13是採用感光材料的情況下，由於感光材料中存有感光劑，其在吸收紫外光能量並經過高溫(如600度)熱處理後，會在紫外光照射區域產生結晶，使得結晶區與非結晶區在化學藥液的蝕刻下有數十倍的反應速率差的特性，藉此以化學藥液蝕刻方式，即可一次完成大量微孔的生產，進而有效地減少製程時間。又，雷射改質蝕刻穿孔即為選擇另一適當的基材，並且將紫外光改為雷射光之加工方法。另一方面，在製作本揭示之微孔導位板時，可先選用一尺寸較大的基材，在其上同時加工製作複數個以陣列排列的微孔導位板，接著選取孔洞狀態優良的部分，再對該部分進行切割以獲得開孔品質優良的單一個微孔導位 板(如第一微孔導位板12和第二微孔導位板13)。藉此批次性生產多個微孔導位板的方式，可有效地節省導位板10的生產時間。 In order to meet the quality requirements of the guide plate 10 of the probe head, the first opening 121 and the second opening 131 of the first micro-hole guide plate 12 and the second micro-hole guide plate 13 may use femtosecond thunder. Perforation processing. Further, in order to reduce the process time, in addition to femtosecond laser perforation, other processing methods such as laser modified etched perforation, ultraviolet light modified etched perforation, or plasma perforation can be used to accelerate the first microhole guide plate. 12 and fabrication of the second micro-hole guide plate 13. For example, taking ultraviolet light modified etching perforation as an example, when the first micro-hole guide plate 12 and the second micro-hole guide plate 13 are made of a photosensitive material, since a photosensitive agent is stored in the photosensitive material, After absorbing the energy of ultraviolet light and heat-treating at a high temperature (such as 600 degrees), crystals will be generated in the area irradiated with ultraviolet light, so that the crystalline area and the amorphous area have a characteristic of tens of times the difference in reaction rate under the etching of the chemical solution, In this way, a large number of micropores can be produced at one time by the chemical solution etching method, thereby effectively reducing the process time. In addition, laser modified etched perforation is to select another suitable substrate, and change the ultraviolet light to laser light processing method. On the other hand, when making the micro-hole guide plate disclosed in this disclosure, a larger-sized substrate can be selected first, and a plurality of micro-hole guide plates arranged in an array are simultaneously processed on the substrate, and then the hole state is selected to be excellent. Then, the part is cut to obtain a single micro-hole guide plate (such as the first micro-hole guide plate 12 and the second micro-hole guide plate 13) with excellent opening quality. In this way, a batch production method of a plurality of micro-hole guide plates can effectively save the production time of the guide plates 10.
如第1圖和第2圖所示，最後，進行步驟S3，連接載板11、第一微孔導位板12、和第二微孔導位板13。載板11、第一微孔導位板12、和第二微孔導位板13三者為彼此獨立的板件。以導位板10整體來看，載板11是位在導位板10的非微孔區域，以及第一微孔導位板12和第二微孔導位板13是位在導位板10的微孔區域，其中第一微孔導位板12是藉由精密接合設備而組裝在載板11之第一開口110的位置，以及第二微孔導位板13是藉由精密接合設備而組裝在載板11之第二開口111的位置。較佳地，考慮到導位板10整體必須為薄型的板件以利於其應用，故載板11、第一微孔導位板12、和第二微孔導位板13三者是採用貼合的方式黏接。如此，將載板11、第一微孔導位板12、和第二微孔導位板13三者採用分開製作的方式，故可依各自需求進行材料的選擇，及選擇適當地加工方法，以達到最有利之製作方式，進而增加生產良率與降低生產成本。另一方面，由於載板11、第一微孔導位板12、和第二微孔導位板13三者為彼此獨立形成的板件，故在製作上不會因單一個板件的損壞而導致導位板10的報廢，進而可降低材料的損耗和製作成本。進一步來說，對於要製作具有大尺寸(例如12吋以上)的導位板10時，載板11較佳地可以採用加工容易、平整度佳、且價格低廉的金屬材料。並且，大尺寸的載板11上相對可放置較多個微孔導位板。如此，導位板10的尺寸就不會因為材料加工上的限制而難以製作出大尺寸的規格，進而可有效地製作出成品尺寸相對較大的探針頭。 As shown in FIG. 1 and FIG. 2, finally, step S3 is performed to connect the carrier plate 11, the first micro-hole guide plate 12, and the second micro-hole guide plate 13. The carrier plate 11, the first micro-hole guide plate 12, and the second micro-hole guide plate 13 are independent plates. Looking at the guide plate 10 as a whole, the carrier plate 11 is located in the non-microporous area of the guide plate 10, and the first microhole guide plate 12 and the second microhole guide plate 13 are located in the guide plate 10. Of the microporous area, wherein the first microporous guide plate 12 is assembled at the position of the first opening 110 of the carrier plate 11 by a precision bonding device, and the second microporous guide plate 13 is formed by a precision bonding device. Assembled at the position of the second opening 111 of the carrier board 11. Preferably, considering that the guide plate 10 as a whole must be a thin plate to facilitate its application, three of the carrier plate 11, the first micro-hole guide plate 12, and the second micro-hole guide plate 13 are affixed. Glued together. In this way, the carrier plate 11, the first micro-hole guide plate 12, and the second micro-hole guide plate 13 are separately manufactured. Therefore, the material selection and the appropriate processing method can be selected according to their respective needs. In order to achieve the most favorable production method, and then increase production yield and reduce production costs. On the other hand, since the carrier plate 11, the first micro-hole guide plate 12, and the second micro-hole guide plate 13 are plates formed independently of each other, they are not damaged by a single plate in production. As a result, the guide plate 10 is scrapped, which can further reduce material loss and manufacturing costs. Further, when the guide plate 10 having a large size (for example, 12 inches or more) is to be manufactured, the carrier plate 11 may preferably be made of a metal material that is easy to process, has good flatness, and is inexpensive. In addition, a plurality of micro-hole guide plates can be relatively placed on the large-sized carrier plate 11. In this way, the size of the guide plate 10 will not be difficult to produce a large size due to the limitation on the material processing, and further, a probe head with a relatively large finished product size can be effectively produced.
請參照第3圖和第4圖，第3圖顯示本揭示之較佳實施例之探 針頭2之零件***圖，以及第4圖顯示第3圖之探針頭2之剖面示意圖。應當注意的是，為了清楚表示，第3圖和第4圖並非等以比例繪製。探針頭2包含第一間隔板21、第一導位板22、第二間隔板23、第二導位板24、複數個探針27。探針頭2是用於固定複數個探針27並且在晶圓量測時提供一致性作動的機構。 Please refer to FIG. 3 and FIG. 4. FIG. 3 shows an exploded view of the probe head 2 of the preferred embodiment of the present disclosure, and FIG. 4 shows a schematic cross-sectional view of the probe head 2 of FIG. It should be noted that for clarity, Figures 3 and 4 are not drawn to scale. The probe head 2 includes a first spacer plate 21, a first guide plate 22, a second spacer plate 23, a second guide plate 24, and a plurality of probes 27. The probe head 2 is a mechanism for fixing a plurality of probes 27 and providing a consistent operation during wafer measurement.
如第3圖所示，第一導位板22包含第一載板221和兩個第一微孔導位板222，其中第一載板221上設置有與兩個第一微孔導位板222對應的兩個第一開口2210，以及每一第一微孔導位板222設置有複數個以陣列排列的第一開孔2220。兩個第一微孔導位板222是分別連接在第一導位板22上，且設置在對應於兩個第一開口2210的位置。相似地，第二導位板24包含第二載板241和兩個第二微孔導位板242，其中第二載板241上設置有與兩個第二微孔導位板242對應的兩個第二開口2410，以及每一第二微孔導位板242設置有複數個以陣列排列的第二開孔2420。兩個第二微孔導位板242是分別連接在第二導位板24上，且設置在對應於兩個第二開口2410的位置。應當注意的是，在其他不同實施例中，導位板的數量、載板上之開口數量與排布、微孔導位板之數量與排布、微孔導位板上之開孔之數量與排布可依照實際應用而改變，本揭示不侷限於此。 As shown in FIG. 3, the first guide plate 22 includes a first carrier plate 221 and two first micro-hole guide plates 222, wherein the first carrier plate 221 is provided with two first micro-hole guide plates. The two first openings 2210 corresponding to 222 and each of the first microwell guide plates 222 are provided with a plurality of first openings 2220 arranged in an array. The two first micro-hole guide plates 222 are respectively connected to the first guide plate 22 and are disposed at positions corresponding to the two first openings 2210. Similarly, the second guide plate 24 includes a second carrier plate 241 and two second micro-hole guide plates 242. The second carrier plate 241 is provided with two corresponding to the two second micro-hole guide plates 242. The second openings 2410 and each of the second microwell guide plates 242 are provided with a plurality of second openings 2420 arranged in an array. The two second micro-hole guide plates 242 are respectively connected to the second guide plate 24 and are disposed at positions corresponding to the two second openings 2410. It should be noted that in other different embodiments, the number of guide plates, the number and arrangement of openings on the carrier plate, the number and arrangement of micro-hole guide plates, and the number of openings on the micro-hole guide plate The arrangement and arrangement may be changed according to practical applications, and the present disclosure is not limited thereto.
如第3圖所示，為了讓該等探針27順利通過，第一間隔板21和第二間隔板23在對應第一導位板22和第二導位板24之微孔區域的位置分別開設有開口。並且，第一間隔板21是用於讓第一導位板22和另一元件兩者相隔開一特定的距離，以及第二間隔板23是用於讓第一導位板22和第二導位板24兩者相隔開一特定的距離。又，如第4圖所示，第一微孔導位板222 和第二微孔導位板242之每一第一開孔2220和每一第二開孔2420僅可允許一個探針27通過，如此藉由間隔板與開孔之間的隔離，可達到確保相鄰兩探針27彼此分離不接觸之目的。 As shown in FIG. 3, in order to allow the probes 27 to pass through, the positions of the first spacer plate 21 and the second spacer plate 23 corresponding to the micro-hole areas of the first guide plate 22 and the second guide plate 24 are respectively Opening. In addition, the first spacer plate 21 is used to separate the first positioning plate 22 from another component by a specific distance, and the second spacer plate 23 is used to separate the first positioning plate 22 and the second guide. The position plates 24 are separated by a specific distance. In addition, as shown in FIG. 4, each of the first openings 2220 and each of the second openings 2420 of the first microwell guide plate 222 and the second microwell guide plate 242 can only allow one probe 27 to pass through. In this way, the isolation between the partition plate and the opening can achieve the purpose of ensuring that two adjacent probes 27 are separated from each other without contact.
如第4圖所示，第一載板221與第一微孔導位板222之間還包含黏貼層25，用於黏接第一載板221與第一微孔導位板222。又，第二載板241與第二微孔導位板242之間還包含另一黏貼層26，用於黏接第二載板241與第二微孔導位板242。可以理解的是，通過膠黏的方式連接第一載板221與第一微孔導位板222，或連接第二載板241與第二微孔導位板242，可達到使第一導位板22和第二導位板24兩者間距小於25毫米，進而讓探針頭2整體具有薄型化之特點。 As shown in FIG. 4, an adhesive layer 25 is further included between the first carrier plate 221 and the first micro-hole guide plate 222 for bonding the first carrier plate 221 and the first micro-hole guide plate 222. In addition, another adhesive layer 26 is included between the second carrier plate 241 and the second micro-hole guide plate 242 for bonding the second carrier plate 241 and the second micro-hole guide plate 242. It can be understood that, by connecting the first carrier plate 221 and the first micro-hole guide plate 222 by gluing, or connecting the second carrier plate 241 and the second micro-hole guide plate 242, the first guide position can be achieved. The distance between the plate 22 and the second guide plate 24 is less than 25 mm, so that the probe head 2 as a whole is thin.
綜上所述，本揭示藉由使探針頭之導位板設計為將微孔區域與非微孔區域分開製作接著再組合在一起之多板件的結構。如此，分開製作的板件可依各自需求進行材料的選擇，及選擇適當地加工方法，以達到最有利之製作方式，進而增加生產良率與降低生產成本。再者，由於導位板之微孔區域與非微孔區域為彼此獨立形成的板件，故在製作上不會因單一個板件的損壞而導致導位板整體的報廢，進而可降低材料的損耗和製作成本。 In summary, the present disclosure uses a design of the guide plate of the probe head to separate the micro-porous area from the non-micro-porous area to make a multi-plate structure. In this way, the separately manufactured plates can be selected according to their respective needs and the appropriate processing method to achieve the most advantageous manufacturing method, thereby increasing production yield and reducing production costs. Furthermore, since the micro-hole area and the non-micro-hole area of the guide plate are plates formed independently of each other, the entire guide plate is not scrapped due to the damage of a single plate in the production, which can reduce the material. Loss and production costs.
以上僅是本揭示的較佳實施方式，應當指出，對於所屬領域技術人員，在不脫離本揭示原理的前提下，還可以做出若干改進和潤飾，這些改進和潤飾也應視為本揭示的保護範圍。 The above are only the preferred embodiments of the present disclosure. It should be noted that for those skilled in the art, without departing from the principles of the present disclosure, several improvements and retouches can be made. These improvements and retouches should also be regarded as the present disclosure. protected range.
Claims (13)
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| US6927586B2 (en) * | 2000-03-06 | 2005-08-09 | Wentworth Laboratories, Inc. | Temperature compensated vertical pin probing device |
| KR100791136B1 (en) * | 2002-04-16 | 2008-01-02 | 닛폰 하츠죠 가부시키가이샤 | Holder for conductive contact |
| JP4905876B2 (en) * | 2005-10-31 | 2012-03-28 | 日本発條株式会社 | Method for manufacturing conductive contact holder and conductive contact holder |
| WO2009001731A1 (en) * | 2007-06-22 | 2008-12-31 | Nhk Spring Co., Ltd. | Conductive contact holder and conductive contact unit |
| MY154101A (en) * | 2008-11-26 | 2015-04-30 | Nhk Spring Co Ltd | Probe-unit base member and probe unit |
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