TW201938926A - Multilayer constrained-layer damping - Google Patents

Multilayer constrained-layer damping Download PDF

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TW201938926A
TW201938926A TW108106244A TW108106244A TW201938926A TW 201938926 A TW201938926 A TW 201938926A TW 108106244 A TW108106244 A TW 108106244A TW 108106244 A TW108106244 A TW 108106244A TW 201938926 A TW201938926 A TW 201938926A
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damping
layer
laminate
glass transition
multilayer
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TW108106244A
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TWI821247B (en
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曼和許 加奈森
亨瑞 Ｗ 米里曼
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美商艾維利 丹尼森公司
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Priority claimed from PCT/US2018/023119 external-priority patent/WO2019182553A1/en
Priority claimed from US15/925,150 external-priority patent/US11059264B2/en
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Abstract

Provided herein is are multilayer damping laminates comprising alternating damping and constraining layers. The materials and configurations of the damping layers are selected such that the damping layers have a decreasing glass transition temperature profile beginning at the first damping layer, allowing the laminates to effectively dissipate vibrations over a wider range of operating temperatures and/or frequencies. Also provided are systems and methods using the multilayer damping laminates.

Description

多層拘束層阻尼Multilayer restraint damping

本發明大體上係關於用於消散振動之多層阻尼層壓物。The present invention relates generally to multilayer damping laminates for dissipating vibration.

在許多市場(例如汽車市場、家用電器市場及電子市場)中，需要減少非所欲的振動及相關之噪音產生。作為一個實例，汽車產業正趨向於增加採用重量較輕的車輛。因此，越來越多地使用重量較輕的鋁及聚合物材料。然而，此等設計及材料之使用導致與車輛振動及振動相關噪音相關之其他問題。In many markets, such as the automotive market, the home appliance market, and the electronics market, there is a need to reduce unwanted vibration and related noise generation. As an example, the automotive industry is trending towards increasing adoption of lighter vehicles. Therefore, lighter weight aluminum and polymer materials are increasingly used. However, these designs and the use of materials cause other problems related to vehicle vibration and vibration-related noise.

通常，噪音及振動問題藉由以下兩種方法來管理：加強結構幾何形狀以對振動更具抵抗性，及阻尼結構以減小振動幅度。除了此等解決方案之外，聲學技術亦可用於吸收、反射及隔離來自其來源之聲波，例如在其等到達汽車駕駛室內的乘客之前。Generally, noise and vibration problems are managed by two methods: strengthening the geometry of the structure to be more resistant to vibration, and damping the structure to reduce the amplitude of the vibration. In addition to these solutions, acoustic technology can also be used to absorb, reflect, and isolate sound waves from their source, such as before they reach the passenger cabin of a car.

結構阻尼方法可關於阻尼帶或層壓物之應用，該等阻尼帶或層壓物包括加強或拘束載體材料及阻尼材料。阻尼帶在消散振動中之有效性可取決於意欲消散之振動之頻率及阻尼帶材料之溫度。特定言之，習知的阻尼帶僅在相對窄的溫度範圍內提供振動阻尼，該溫度範圍可能不包括意欲阻尼之結構之所有標準操作溫度。因此，仍需要在更寬的溫度範圍內有效且高效地抑制或減少振動之阻尼層壓物。Structural damping methods may relate to the application of damping bands or laminates that include reinforced or restrained carrier materials and damping materials. The effectiveness of the damping band in dissipating vibrations may depend on the frequency of the vibrations intended to dissipate and the temperature of the material of the damping band. In particular, conventional damping bands provide vibration damping only over a relatively narrow temperature range, which may not include all standard operating temperatures of a structure intended to be damped. Therefore, there is still a need for a damping laminate that effectively and efficiently suppresses or reduces vibration over a wider temperature range.

在一個實施例中，本發明係關於一種多層阻尼層壓物，其在約200 Hz下具有大於約0.05之的複合損耗因子。在許多實施例中，多層阻尼層壓物在至少約30℃之溫度範圍內具有大於約0.05之複合損耗因子。多層阻尼層壓物包括第一阻尼層、外部拘束層及第二阻尼層，其中該第二阻尼層之至少一部分設置在第一阻尼層與外部拘束層之間。多層阻尼層壓物亦包括內部拘束層，其至少一部分設置在第一阻尼層與第二阻尼層之間。在許多實施例中，該第一阻尼層包括第一黏著劑，及該第二阻尼層包括第二黏著劑。在一些實施例中，該第一阻尼層包括第一黏彈性阻尼材料，及該第二阻尼層包括第二黏彈性阻尼材料。在許多實施例中，該第一阻尼層包括黏著劑及該第二阻尼層亦包括黏著劑。在許多實施例中，該第一阻尼層包括壓敏黏著劑。在許多實施例中，該第二阻尼層亦包括壓敏黏著劑。在許多實施例中，該內部拘束層及外部拘束層各自獨立地包括金屬。在一些實施例中，該內部拘束層及外部拘束層各自獨立地為金屬箔片。層壓物之阻尼層可具有從第一阻尼層開始遞減之玻璃轉變溫度分佈。在許多實施例中，第一阻尼層之玻璃轉變溫度(即第一玻璃轉變溫度)係比第二阻尼層之玻璃轉變溫度(即第二玻璃轉變溫度)高至少5℃。在一些實施例中，第一玻璃轉變溫度與第二玻璃轉變溫度之差異係在約5℃至約35℃之範圍內。在一些實施例中，該第一及第二玻璃轉變溫度各自獨立地在約-60℃至約100℃之範圍內。在一些實施例中，層壓物之阻尼層可具有從第一阻尼層開始遞增之平臺模量分佈。在許多實施例中，層壓物之阻尼層可各自具有黏彈性損耗因子，其中若第一玻璃轉變溫度與第二玻璃轉變溫度之差異係小於約20℃，則第一黏彈性損耗因子與第二黏彈性損耗因子之差異在約0.2至約1.5之範圍內，且其中若第一玻璃轉變溫度與第二玻璃轉變溫度之差異係大於約20℃，則第一黏彈性損耗因子與第二黏彈性損耗因子之差異在約0.2至約3.0之範圍內。在一些實施例中，層壓物之阻尼層可各自具有黏彈性損耗因子，其中若第一玻璃轉變溫度與第二玻璃轉變溫度之差異係小於約20℃，則第一黏彈性損耗因子之最大值與第二黏彈性損耗因子之最大值之差異在約0.2至約1.5之範圍內，且其中若第一玻璃轉變溫度與第二玻璃轉變溫度之差異係大於約20℃，則第一黏彈性損耗因子之最大值與第二黏彈性損耗因子之最大值之差異在約0.2至約3.0之範圍內。在許多實施例中，第一阻尼層及第二阻尼層各自獨立地具有在約0.1密耳至約200密耳範圍內之厚度。在一些實施例中，內部拘束層及外部拘束層各自獨立地具有在約0.2密耳至約120密耳範圍內之厚度。在一些實施例中，多層阻尼層壓物進一步包括連接至與第二阻尼層相對的第一阻尼層之襯墊層。In one embodiment, the present invention is directed to a multilayer damping laminate having a composite loss factor greater than about 0.05 at about 200 Hz. In many embodiments, the multilayer damping laminate has a composite loss factor greater than about 0.05 over a temperature range of at least about 30 ° C. The multilayer damping laminate includes a first damping layer, an outer restraint layer, and a second damping layer, wherein at least a portion of the second damping layer is disposed between the first damping layer and the outer restraint layer. The multilayer damping laminate also includes an internal restraint layer, at least a portion of which is disposed between the first damping layer and the second damping layer. In many embodiments, the first damping layer includes a first adhesive, and the second damping layer includes a second adhesive. In some embodiments, the first damping layer includes a first viscoelastic damping material, and the second damping layer includes a second viscoelastic damping material. In many embodiments, the first damping layer includes an adhesive and the second damping layer also includes an adhesive. In many embodiments, the first damping layer includes a pressure-sensitive adhesive. In many embodiments, the second damping layer also includes a pressure-sensitive adhesive. In many embodiments, the inner restraint layer and the outer restraint layer each independently include metal. In some embodiments, the inner restraint layer and the outer restraint layer are each independently a metal foil. The damping layer of the laminate may have a glass transition temperature distribution that decreases from the first damping layer. In many embodiments, the glass transition temperature (ie, the first glass transition temperature) of the first damping layer is at least 5 ° C higher than the glass transition temperature (ie, the second glass transition temperature) of the second damping layer. In some embodiments, the difference between the first glass transition temperature and the second glass transition temperature is in a range of about 5 ° C to about 35 ° C. In some embodiments, the first and second glass transition temperatures are each independently in a range of about -60 ° C to about 100 ° C. In some embodiments, the damping layer of the laminate may have a platform modulus distribution that increases from the first damping layer. In many embodiments, the damping layers of the laminate may each have a viscoelastic loss factor, wherein if the difference between the first glass transition temperature and the second glass transition temperature is less than about 20 ° C, the first viscoelastic loss factor and the first The difference between the two viscoelastic loss factors is in the range of about 0.2 to about 1.5, and if the difference between the first glass transition temperature and the second glass transition temperature is greater than about 20 ° C, the first viscoelastic loss factor and the second viscosity The difference in elastic loss factor is in the range of about 0.2 to about 3.0. In some embodiments, the damping layers of the laminate may each have a viscoelastic loss factor, wherein if the difference between the first glass transition temperature and the second glass transition temperature is less than about 20 ° C, the maximum of the first viscoelastic loss factor The difference between the value and the maximum value of the second viscoelastic loss factor is in the range of about 0.2 to about 1.5, and if the difference between the first glass transition temperature and the second glass transition temperature is greater than about 20 ° C, the first viscoelasticity The difference between the maximum value of the loss factor and the maximum value of the second viscoelastic loss factor is in the range of about 0.2 to about 3.0. In many embodiments, the first damping layer and the second damping layer each independently have a thickness in a range from about 0.1 mils to about 200 mils. In some embodiments, the inner restraint layer and the outer restraint layer each independently have a thickness in a range from about 0.2 mils to about 120 mils. In some embodiments, the multilayer damping laminate further includes a cushion layer connected to the first damping layer opposite the second damping layer.

在另一個實施例中，本發明係關於多層阻尼層壓物，其包括N個阻尼層、N-1個內部拘束層及外部拘束層，其中N為大於或等於約2之整數。每個阻尼層之至少一部分係與其他阻尼層共同延伸。每一第M個內部拘束層之至少一部分設置在第M個阻尼層與第(M+1)個阻尼層之間，其中M為在1至N-1範圍內之整數。第N個阻尼層之至少一部分設置在第(N-1)個拘束層與外部拘束層之間。層壓物之阻尼層各自獨立地具有玻璃轉變溫度Tg ，其中Tg (N) ＜ Tg (N-1) ＜ Tg (N-2) ＜ … ＜ Tg (1)。在許多實施例中，層壓物之阻尼層各自獨立地具有平臺模量(Go )，其中Go (N) ＞ Go (N-1) ＞ Go (N-2) ＞ … ＞ Go (1)。In another embodiment, the present invention relates to a multilayer damping laminate, which includes N damping layers, N-1 inner restraint layers, and outer restraint layers, where N is an integer greater than or equal to about 2. At least a portion of each damping layer is coextensive with other damping layers. At least a part of each of the Mth internal restraint layers is disposed between the Mth damping layer and the (M + 1) th damping layer, where M is an integer in the range of 1 to N-1. At least a part of the Nth damping layer is disposed between the (N-1) th restraint layer and the outer restraint layer. The damping layers of the laminate each independently have a glass transition temperature T g , where T g (N) <T g (N-1) <T g (N-2) <... <T g (1). In many embodiments, the damping layers of the laminate each independently have a platform modulus (G o ), where G o (N)> G o (N-1)> G o (N-2)>...> G o (1).

在另一個實施例中，本發明係關於一種包含如上所述的多層阻尼層壓物之系統。該系統進一步包括連接至多層阻尼層壓物之第一阻尼層之基礎基板。In another embodiment, the invention relates to a system comprising a multilayer damping laminate as described above. The system further includes a base substrate connected to a first damping layer of the multilayer damping laminate.

在另一個實施例中，本發明係關於一種減少基礎基板之振動之方法。該方法包括提供經受振動之基礎基板。該方法進一步包括將基礎基板連接至所提供的多層阻尼層壓物之第一阻尼層。在一些實施例中，該方法進一步包括隨著多層阻尼層壓物之施加溫度在關注頻率下測定時從第一玻璃轉變溫度變為第二玻璃轉變溫度，最大剪切應變之位置從第一阻尼層移位至第二阻尼層。在許多實施例中，基礎結構之振動在連續之溫度及頻率範圍內消散。In another embodiment, the present invention relates to a method for reducing vibration of a base substrate. The method includes providing a base substrate subjected to vibration. The method further includes connecting the base substrate to a first damping layer of the provided multilayer damping laminate. In some embodiments, the method further includes changing the position of the maximum shear strain from the first damping as the applied temperature of the multilayer damping laminate changes from the first glass transition temperature to the second glass transition temperature when measured at the frequency of interest. The layer is shifted to the second damping layer. In many embodiments, vibrations of the base structure are dissipated over a continuous temperature and frequency range.

本發明大體上係關於多層阻尼層壓物，當其連接至經受振動之結構時，有利地能夠在寬的溫度及頻率範圍內有效地消散振動。例如，阻尼層壓物有益於減少結構之非所欲的振動，因為此等振動可降低結構之穩定性、增加疲勞及應力、縮短操作壽命，及促進非所欲的振動副作用，諸如產生噪音或車輛乘客之不適。The present invention relates generally to multilayer damping laminates that, when connected to a structure subjected to vibration, are advantageously capable of effectively dissipating vibration over a wide range of temperatures and frequencies. For example, damping laminates are useful for reducing undesired vibrations of a structure because these vibrations can reduce the stability of the structure, increase fatigue and stress, shorten operating life, and promote undesired side effects of vibration, such as generating noise or Discomfort of vehicle passengers.

習知而言，對此等振動結構應用阻尼處理以減少振動之發生及強度。一些阻尼處理採用拘束層阻尼(CLD)構造，其包括加強元件及阻尼元件之分層組態。此等CLD處理可有效地減輕在特定溫度下之某些振動頻率，該等溫度部分地藉由阻尼元件材料之選擇確定。因此，習知CLD處理之有效溫度範圍可係相對有限。已知在每次處理中使用不同黏彈性阻尼材料之多個CLD處理之分層堆疊可用於拓寬阻尼之溫度範圍。然而，以此種方式拓寬阻尼溫度會不利地導致峰值阻尼性能之非所欲降低。此外，增加阻尼寬度之CLD處理之此種堆疊增加處理產品之質量，此亦係非所欲的。Conventionally, damping treatment is applied to these vibration structures to reduce the occurrence and intensity of vibration. Some damping treatments use a restraint layer damping (CLD) construction, which includes a layered configuration of reinforcing elements and damping elements. These CLD treatments can effectively mitigate certain vibration frequencies at specific temperatures, which are determined in part by the choice of material for the damping element. Therefore, the effective temperature range of the conventional CLD process can be relatively limited. It is known that layered stacks of multiple CLD treatments using different viscoelastic damping materials in each treatment can be used to widen the temperature range of the damping. However, widening the damping temperature in this manner can disadvantageously lead to an undesired reduction in peak damping performance. In addition, such a stack of CLD treatments with increased damping width increases the quality of the processed product, which is also undesirable.

本文揭示使用具有特定流變性質之阻尼材料之多層CLD處理之組態，該等阻尼材料允許在寬溫度下以增加的阻尼效率進行阻尼。所識別的流變性質提供可用於選擇黏彈性材料之參數，該等黏彈性材料可根據特定設計標準配置在堆疊組態中。此允許構造具有不同流變特性之不同阻尼層之新穎的多層阻尼層壓物。此等新穎的層壓物有益地展示寬的溫度阻尼，峰值阻尼之降低最小(若有的話)且處理重量之添加很少。This article discloses a multi-layer CLD processing configuration using a damping material with specific rheological properties that allows damping at a wide temperature with increased damping efficiency. The identified rheological properties provide parameters that can be used to select viscoelastic materials, which can be configured in a stacked configuration according to specific design standards. This allows the construction of novel multilayer damping laminates with different damping layers having different rheological properties. These novel laminates beneficially exhibit wide temperature damping, with minimal (if any) reduction in peak damping and little addition of processing weight.

阻尼層壓物及其組件阻尼層之阻尼性能可在就其各自的損耗因子方面進行描述。阻尼材料或阻尼層之黏彈性損耗因子tan(d)係其將振動能轉換成熱能之能力之量度。作為一般實踐，選擇為高阻尼之各個阻尼層之阻尼材料或組合物可具有約0.5或更大之黏彈性損耗因子。在分層構造中，總體構造之總損耗因子(亦稱為複合損耗因子(CLF))通常被認為係在0.05或更大之值下有效的。複合損耗因子隨振動頻率及溫度而變化，且就所給定的頻率而言，可繪製複合損耗因子對溫度之曲線。該曲線之最大CLF值可被稱為峰值阻尼值，且具有大於約0.05之CLF之曲線部分之橫坐標寬度可被稱為阻尼溫度範圍。在所給定振動頻率下特定阻尼處理之阻尼效率可然後藉由以下等式計算：

其中ξ為阻尼效率，W為以℃計的阻尼溫度範圍，M為峰值阻尼值，及ρA 為以kg/m計的線性密度。The damping properties of a damping laminate and its component damping layers can be described in terms of their respective loss factors. The viscoelastic loss factor tan (d) of a damping material or layer is a measure of its ability to convert vibrational energy into thermal energy. As a general practice, the damping material or composition selected for each damping layer of high damping may have a viscoelastic loss factor of about 0.5 or more. In a layered structure, the total loss factor of the overall structure (also known as the composite loss factor (CLF)) is generally considered to be effective at a value of 0.05 or greater. The composite loss factor varies with the vibration frequency and temperature, and for a given frequency, a curve of the composite loss factor versus temperature can be plotted. The maximum CLF value of the curve may be referred to as a peak damping value, and the abscissa width of a curve portion having a CLF greater than about 0.05 may be referred to as a damping temperature range. The damping efficiency of a particular damping treatment at a given vibration frequency can then be calculated by the following equation:

Where ξ is the damping efficiency, W is the damping temperature range in ° C, M is the peak damping value, and ρ A is the linear density in kg / m.

當使用黏彈性阻尼材料作為阻尼材料之CLD處理應用於其中黏彈性阻尼材料為黏著劑之振動基板時，來自基板之振動可轉移至與該基板接觸之黏著劑。在黏著劑之玻璃化轉變方案範圍內，假設基板、黏著劑及拘束層係經耦合使得所有三者在相似波長下振動，由於黏著劑聚合物鏈之分子運動，振動作為熱能而損失，藉此導致能量損失，此進一步導致振動幅度之阻尼。因此，在此一構造中，振動阻尼僅在接近黏著劑之玻璃轉變溫度之溫度下係最大的。此導致複合損耗因子曲線之阻尼溫度範圍狹窄地定位在阻尼材料玻璃轉變溫度附近，且阻尼效率隨著阻尼溫度範圍變窄而減小。When a CLD process using a viscoelastic damping material as a damping material is applied to a vibration substrate in which the viscoelastic damping material is an adhesive, the vibration from the substrate can be transferred to the adhesive in contact with the substrate. Within the scope of the glass transition solution of the adhesive, it is assumed that the substrate, the adhesive, and the restraint layer are coupled to cause all three to vibrate at similar wavelengths. Due to the molecular motion of the polymer chain of the adhesive, the vibration is lost as thermal energy. This results in energy loss, which further results in damping of the vibration amplitude. Therefore, in this configuration, vibration damping is greatest only at temperatures close to the glass transition temperature of the adhesive. As a result, the damping temperature range of the composite loss factor curve is narrowly positioned near the glass transition temperature of the damping material, and the damping efficiency decreases as the damping temperature range becomes narrower.

因此，多層阻尼層壓物能夠藉由包括交替的阻尼層在更寬的阻尼溫度範圍內消散振動能量，該等阻尼層隨著溫度接近其不同的玻璃轉變溫度而依序地展示最大剪切應變。以此方式，例如，當阻尼層壓物之溫度接近每個連續黏著劑層之玻璃轉變溫度時，交替的黏著劑層可依次吸收振動能量。多個拘束層之存在以及在一定溫度及頻率範圍內的振動能量之連續耗散可允許更高的阻尼幅度以及在更寬的溫度及頻率範圍內之阻尼。參考以上等式，此等多層層壓物構造可提供更高的阻尼溫度範圍(W)值，就相同的材料線密度(ρA )而言，峰值阻尼(M)很少或沒有損失，導致提高的阻尼效率(ξ)。
阻尼層 Therefore, multilayer damping laminates can dissipate vibration energy over a wider range of damping temperatures by including alternating damping layers that sequentially exhibit maximum shear strain as the temperature approaches its different glass transition temperatures. . In this way, for example, as the temperature of the damping laminate approaches the glass transition temperature of each successive adhesive layer, the alternating adhesive layers may sequentially absorb vibrational energy. The presence of multiple restraint layers and the continuous dissipation of vibration energy over a range of temperatures and frequencies may allow for higher damping amplitudes and damping over a wider range of temperatures and frequencies. With reference to the above equations, these multilayer laminate constructions can provide higher damping temperature range (W) values with little or no peak damping (M) for the same material linear density (ρ A ), resulting in Improved damping efficiency (ξ).
Damping layer

在一個實施例中，揭示多層阻尼層壓物。該層壓物包括具有第一玻璃轉變溫度之第一阻尼層及具有第二玻璃轉變溫度之第二阻尼層。層壓物之阻尼層具有從第一阻尼層開始遞減之玻璃轉變溫度分佈，例如，第一阻尼層玻璃轉變溫度(第一玻璃轉變溫度)係大於第二阻尼層玻璃轉變溫度(第二玻璃轉變溫度))。第一玻璃轉變溫度與第二玻璃轉變溫度之差異可(例如)在約5℃至約35℃，例如，約5℃至約30℃、約5℃至約20℃、約7.5℃至約22.5℃、約10℃至約25℃、約12.5℃至約27.5℃、或約15℃至約30℃範圍內。就上限而言，第一玻璃轉變溫度與第二玻璃轉變溫度之差異可係小於約35℃，例如，小於約30.0℃、小於約27.5℃、小於約25.0℃、小於約22.5℃、小於約20.0℃、小於約17.5℃、小於約15.0℃、小於約12.5℃、小於約10.0℃、或小於約7.5℃。就下限而言，第一玻璃轉變溫度與第二玻璃轉變溫度之差異可係大於約5℃，例如，大於約7.5℃、大於約10.0℃、大於約12.5℃、大於約15.0℃、大於約17.5℃、大於約20.0℃、大於約22.5℃、大於約25℃、或大於約27.5℃。亦涵蓋較大的溫度差(例如，大於約35.0℃)及較小的溫度差(例如，小於約5.0℃)。In one embodiment, a multilayer damping laminate is disclosed. The laminate includes a first damping layer having a first glass transition temperature and a second damping layer having a second glass transition temperature. The damping layer of the laminate has a glass transition temperature distribution that decreases from the first damping layer. For example, the glass transition temperature (first glass transition temperature) of the first damping layer is greater than the second glass transition temperature (second glass transition). temperature)). The difference between the first glass transition temperature and the second glass transition temperature may be, for example, about 5 ° C to about 35 ° C, for example, about 5 ° C to about 30 ° C, about 5 ° C to about 20 ° C, about 7.5 ° C to about 22.5 ° C, about 10 ° C to about 25 ° C, about 12.5 ° C to about 27.5 ° C, or about 15 ° C to about 30 ° C. In terms of upper limits, the difference between the first glass transition temperature and the second glass transition temperature may be less than about 35 ° C, for example, less than about 30.0 ° C, less than about 27.5 ° C, less than about 25.0 ° C, less than about 22.5 ° C, and less than about 20.0 ° C, less than about 17.5 ° C, less than about 15.0 ° C, less than about 12.5 ° C, less than about 10.0 ° C, or less than about 7.5 ° C. In terms of the lower limit, the difference between the first glass transition temperature and the second glass transition temperature may be greater than about 5 ° C, for example, greater than about 7.5 ° C, greater than about 10.0 ° C, greater than about 12.5 ° C, greater than about 15.0 ° C, greater than about 17.5 ° C, greater than about 20.0 ° C, greater than about 22.5 ° C, greater than about 25 ° C, or greater than about 27.5 ° C. Larger temperature differences (eg, greater than about 35.0 ° C) and smaller temperature differences (eg, less than about 5.0 ° C) are also encompassed.

多層阻尼層壓物之複合損耗因子可如ASTM E 756-98，「Standard Test Method for Measuring Vibration-Damping Properties of Materials」 (2018)中所述來確定。多層阻尼層壓物在200 Hz下可具有如下之複合損耗因子：大於約0.05，例如，大於約0.06、大於約0.07、大於約0.08、大於約0.09、大於約0.10、大於約0.20、大於約0.30、大於約0.40、或大於約0.50。多層阻尼層壓物在200 Hz下之複合損耗因子在至少約20℃之溫度範圍內，例如，至少約22℃、至少約24℃、至少約26℃、至少約28℃、至少約30℃、至少約32℃、至少約34℃、至少約35℃、至少約36℃、至少約38℃、或至少約40℃，可係大於約0.05。在一些實施例中，所提供的具有不同第一及第二阻尼層組合物之層壓物在阻尼溫度範圍內具有適宜複合損耗因子，該阻尼溫度範圍比其中兩個阻尼層具有相同組合物(例如，兩個層均具有第一阻尼層組合物或兩個層均具有第二阻尼層組合物)之類似層壓物之阻尼溫度範圍高至少5℃。The composite loss factor of a multilayer damping laminate can be determined as described in ASTM E 756-98, "Standard Test Method for Measuring Vibration-Damping Properties of Materials" (2018). The multilayer damping laminate may have a composite loss factor at 200 Hz: greater than about 0.05, for example, greater than about 0.06, greater than about 0.07, greater than about 0.08, greater than about 0.09, greater than about 0.10, greater than about 0.20, greater than about 0.30 , Greater than about 0.40, or greater than about 0.50. The composite loss factor of the multilayer damping laminate at 200 Hz is in a temperature range of at least about 20 ° C, for example, at least about 22 ° C, at least about 24 ° C, at least about 26 ° C, at least about 28 ° C, at least about 30 ° C, At least about 32 ° C, at least about 34 ° C, at least about 35 ° C, at least about 36 ° C, at least about 38 ° C, or at least about 40 ° C, can be greater than about 0.05. In some embodiments, the provided laminates having different first and second damping layer compositions have a suitable composite loss factor in a damping temperature range that is greater than two of the damping layers having the same composition ( For example, a similar laminate having a first damping layer composition in both layers or a second damping layer composition in both layers) has a damping temperature range that is at least 5 ° C higher.

在某些情況中，若第一阻尼材料係經選擇為「高溫」阻尼材料，在0℃或高於0℃時在200 Hz下出現峰值阻尼，及第二阻尼材料經選擇為「低溫」阻尼材料，在0℃或低於0℃時200 Hz下出現峰值阻尼，在無任何額外設計約束下，則所得複合損耗因子曲線可包括複合損耗因子降低小於0.05之局部最小值。在一些實施例中，為避免此種阻尼破壞，第一玻璃轉變溫度與第二玻璃轉變溫度之差異係部分地基於第一阻尼層及第二阻尼層之厚度來選擇。第一阻尼層可具有第一阻尼層厚度(H1 )，及第二阻尼層可具有第二阻尼層厚度(H2 )。第一玻璃轉變溫度Tg (1)與第二玻璃轉變溫度Tg (2)之最小玻璃轉變溫度差異(ΔTg,min )及最大玻璃轉變溫度差異(ΔTg,max )可(例如)使用以下公式來選擇：
In some cases, if the first damping material is selected as a "high temperature" damping material, peak damping occurs at 200 Hz at 0 ° C or higher, and the second damping material is selected as a "low temperature" damping For materials, peak damping occurs at 200 Hz at or below 0 ° C. Without any additional design constraints, the resulting composite loss factor curve may include a local minimum where the composite loss factor is reduced by less than 0.05. In some embodiments, to avoid such damping damage, the difference between the first glass transition temperature and the second glass transition temperature is selected based in part on the thickness of the first and second damping layers. The first damping layer may have a first damping layer thickness (H 1 ), and the second damping layer may have a second damping layer thickness (H 2 ). The minimum glass transition temperature difference (ΔT g, min ) and the maximum glass transition temperature difference (ΔT g, max ) of the first glass transition temperature T g (1) and the second glass transition temperature T g (2) can be used, for example, Use the following formula to choose:

第一阻尼層厚度及第二阻尼層厚度可(例如)各自獨立地在0.1密耳至約200密耳，例如，0.1密耳至10密耳、0.2密耳至20密耳、0.5密耳至40密耳、1密耳至90密耳、或2密耳至200密耳範圍內。就上限而言，第一及第二阻尼層厚度可各自獨立地為小於200密耳，例如，小於90密耳、小於40密耳、小於20密耳、小於10密耳、小於5密耳、小於2密耳、小於1密耳、小於0.5密耳、或小於0.2密耳。就下限而言，第一及第二阻尼層厚度可各自獨立地為大於0.1密耳，例如，大於0.2密耳、大於0.5密耳、大於1密耳、大於2密耳、大於5密耳、大於10密耳、大於20密耳、大於40密耳、或大於90密耳。亦涵蓋更大的厚度(例如，大於200密耳)及更小的厚度(例如，小於0.1密耳)。The thickness of the first damping layer and the thickness of the second damping layer may be, for example, independently from 0.1 mils to about 200 mils, for example, 0.1 mils to 10 mils, 0.2 mils to 20 mils, and 0.5 mils to 40 mil, 1 mil to 90 mil, or 2 mil to 200 mil. As far as the upper limit is concerned, the thicknesses of the first and second damping layers can each independently be less than 200 mils, for example, less than 90 mils, less than 40 mils, less than 20 mils, less than 10 mils, less than 5 mils, Less than 2 mils, less than 1 mil, less than 0.5 mils, or less than 0.2 mils. As far as the lower limit is concerned, the thicknesses of the first and second damping layers can each independently be greater than 0.1 mil, for example, greater than 0.2 mil, greater than 0.5 mil, greater than 1 mil, greater than 2 mil, greater than 5 mil, Greater than 10 mils, greater than 20 mils, greater than 40 mils, or greater than 90 mils. Larger thicknesses (eg, greater than 200 mils) and smaller thicknesses (eg, less than 0.1 mils) are also encompassed.

在某些情況中，第一玻璃轉變溫度及第二玻璃轉變溫度可(例如)各自獨立地在約-60℃至約100℃，例如，-60℃至36℃、-44℃至52℃、-28℃至68℃、-12℃至84℃、或4℃至100℃範圍內。就上限而言，第一及第二玻璃轉變溫度可各自獨立地為小於100℃，例如，小於84℃、小於68℃、小於52℃、小於36℃、小於20℃、小於4℃、小於-12℃、小於-28℃、或小於-44℃。就下限而言，第一及第二玻璃轉變溫度可各自獨立地為大於-60℃，例如，大於-44℃、大於-28℃、大於-12℃、大於4℃、大於20℃、大於36℃、大於52℃、大於68℃、或大於84℃。亦涵蓋更大的玻璃轉變溫度(例如，大於100℃)及更小的玻璃轉變溫度(例如，小於-60℃)。本文所述的玻璃轉變溫度可藉由線性黏彈性方案中之動態力學分析例如在10弧度/秒及0.1%應變下來測量。In some cases, the first glass transition temperature and the second glass transition temperature can be, for example, each independently at about -60 ° C to about 100 ° C, for example, -60 ° C to 36 ° C, -44 ° C to 52 ° C, -28 ° C to 68 ° C, -12 ° C to 84 ° C, or 4 ° C to 100 ° C. As far as the upper limit is concerned, the first and second glass transition temperatures may each be independently less than 100 ° C, for example, less than 84 ° C, less than 68 ° C, less than 52 ° C, less than 36 ° C, less than 20 ° C, less than 4 ° C, and less than- 12 ° C, less than -28 ° C, or less than -44 ° C. As far as the lower limit is concerned, the first and second glass transition temperatures may each be independently greater than -60 ° C, for example, greater than -44 ° C, greater than -28 ° C, greater than -12 ° C, greater than 4 ° C, greater than 20 ° C, greater than 36 ° C, greater than 52 ° C, greater than 68 ° C, or greater than 84 ° C. Larger glass transition temperatures (eg, greater than 100 ° C) and smaller glass transition temperatures (eg, less than -60 ° C) are also encompassed. The glass transition temperature described herein can be measured by dynamic mechanical analysis in a linear viscoelastic solution, such as at 10 radians / second and 0.1% strain.

多層阻尼層壓物之第一及第二阻尼層間的關係亦可在就其各自的平臺模量方面進行表徵。材料之平臺模量係橡膠振盪反應方案中材料之特徵性彈性儲積模量之量度。第一及第二阻尼層之組成可經選擇，使得第一阻尼層之第一平臺模量及第二阻尼層之第二平臺模量在溫度接近其各自的玻璃轉變溫度時改良剪切應變從第一阻尼層至第二阻尼層之連續轉變。在一些情況中，層壓物之阻尼層可具有從第一阻尼層開始遞增之平臺模量分佈，例如，第二平臺模量係大於第一平臺模量。第二平臺模量與第一平臺模量之比率可(例如)在約1至約200，例如1至20、2至40、3至70、5至100、或8到200範圍內。就上限而言，第二平臺模量與第一平臺模量之比率可係小於200，例如，小於100、小於70、小於40、小於20、小於10、小於8、小於5、小於3或小於2。就下限而言，第二平臺模量與第一平臺模量之比率可係大於1，例如，大於2、大於3、大於5、大於8、大於10、大於20、大於40、大於70、或大於100。亦涵蓋更大的比率，例如，大於200。The relationship between the first and second damping layers of the multilayer damping laminate can also be characterized in terms of their respective platform modulus. The platform modulus of a material is a measure of the material's characteristic elastic storage modulus in a rubber oscillation reaction scheme. The composition of the first and second damping layers can be selected such that the first platform modulus of the first damping layer and the second platform modulus of the second damping layer improve the shear strain from a temperature near their respective glass transition temperatures. Continuous transition from the first damping layer to the second damping layer. In some cases, the damping layer of the laminate may have a platform modulus distribution increasing from the first damping layer, for example, the second platform modulus is greater than the first platform modulus. The ratio of the second platform modulus to the first platform modulus may, for example, be in the range of about 1 to about 200, such as 1 to 20, 2 to 40, 3 to 70, 5 to 100, or 8 to 200. In terms of the upper limit, the ratio of the second platform modulus to the first platform modulus may be less than 200, for example, less than 100, less than 70, less than 40, less than 20, less than 10, less than 8, less than 5, less than 3, or less than 2. As far as the lower limit is concerned, the ratio of the second platform modulus to the first platform modulus may be greater than 1, for example, greater than 2, greater than 3, greater than 5, greater than 8, greater than 10, greater than 20, greater than 40, greater than 70, or Greater than 100. Larger ratios are also covered, for example, greater than 200.

第一及第二阻尼層之材料亦可經選擇，使得第一平臺模量與第二平臺模量之差異部分地基於第一阻尼層及第二阻尼層之厚度。在一些實施例中，第二平臺模量(G0,2 )與第一平臺模量(G0,1 )之最小比率接近1， 且可使用以下等式來選擇第二平臺模量與第一平臺模量之最大比率：
The materials of the first and second damping layers can also be selected so that the difference between the modulus of the first platform and the modulus of the second platform is based in part on the thickness of the first and second damping layers. In some embodiments, the minimum ratio of the second platform modulus ( G 0,2 ) to the first platform modulus ( G 0,1 ) is close to 1 , and the following equation can be used to select the second platform modulus and the first platform modulus ( G 0,1 ). The maximum ratio of the modulus of a platform:

多層阻尼層壓物之第一及第二阻尼層間的關係亦可在就其各自的黏彈性損耗因子方面進行表徵。在許多實施例中，層壓物之阻尼層可各自具有黏彈性損耗因子，其中若第一玻璃轉變溫度與第二玻璃轉變溫度之差異係小於約20℃，則第一黏彈性損耗因子與第二黏彈性損耗因子之差異在約0.2至約1.5之範圍內，且其中若第一玻璃轉變溫度與第二玻璃轉變溫度之差異係大於約20℃，則第一黏彈性損耗因子與第二黏彈性損耗因子之差異在約0.2至約3.0之範圍內。在一些實施例中，層壓物之阻尼層可各自具有黏彈性損耗因子，其中若第一玻璃轉變溫度與第二玻璃轉變溫度之差異係小於約20℃，則第一黏彈性損耗因子之最大值與第二黏彈性損耗因子之最大值之差異在約0.2至約1.5之範圍內，且其中若第一玻璃轉變溫度與第二玻璃轉變溫度之差異係大於約20℃，則第一黏彈性損耗因子之最大值與第二黏彈性損耗因子之最大值之差異在約0.2至約3.0之範圍內。第一及第二阻尼層之組成可經選擇，使得第一阻尼層之第一黏彈性損耗因子及第二阻尼層之第二黏彈性損耗因子允許每個層有助於產生大於約0.05之整體複合損耗因子。在一些情況中，第一及第二阻尼層係經組態使得最小第一黏彈性損耗因子(tan(δ)1,min )與最小第二黏彈性損耗因子(tan(δ)2,min )在期望的操作溫度或頻率範圍標度內與阻尼層厚度相關，根據以下公式：

其中H1 及H2 各以米為單位。The relationship between the first and second damping layers of the multilayer damping laminate can also be characterized in terms of their respective viscoelastic loss factors. In many embodiments, the damping layers of the laminate may each have a viscoelastic loss factor, wherein if the difference between the first glass transition temperature and the second glass transition temperature is less than about 20 ° C, the first viscoelastic loss factor and the first The difference between the two viscoelastic loss factors is in the range of about 0.2 to about 1.5, and if the difference between the first glass transition temperature and the second glass transition temperature is greater than about 20 ° C, the first viscoelastic loss factor and the second viscosity The difference in elastic loss factor is in the range of about 0.2 to about 3.0. In some embodiments, the damping layers of the laminate may each have a viscoelastic loss factor, wherein if the difference between the first glass transition temperature and the second glass transition temperature is less than about 20 ° C, the maximum of the first viscoelastic loss factor The difference between the value and the maximum value of the second viscoelastic loss factor is in the range of about 0.2 to about 1.5, and if the difference between the first glass transition temperature and the second glass transition temperature is greater than about 20 ° C, the first viscoelasticity The difference between the maximum value of the loss factor and the maximum value of the second viscoelastic loss factor is in the range of about 0.2 to about 3.0. The composition of the first and second damping layers can be selected such that the first viscoelastic loss factor of the first damping layer and the second viscoelastic loss factor of the second damping layer allow each layer to help produce an overall greater than about 0.05 Compound loss factor. In some cases, the first and second damping layers are configured such that the minimum first viscoelastic loss factor (tan (δ) 1, min ) and the minimum second viscoelastic loss factor (tan (δ) 2, min ) Related to the thickness of the damping layer over a desired operating temperature or frequency range scale, according to the following formula:

H 1 and H 2 are each in meters.

第一及第二阻尼層亦可經組態成使得第一及第二黏彈性損耗因子之差異係與第一及第二玻璃轉變溫度之差異有關。例如，當第一及第二玻璃轉變溫度之差異(或絕對差異)係小於約20℃時，第一及第二黏彈性損耗因子之差異(或絕對差異)可在約0.2至約1.5，例如，0.20至0.98、0.33至1.11、0.46至1.24、0.59至1.37、或0.72至1.50之範圍內。就上限而言，當第一及第二玻璃轉變溫度之差異係小於20℃時，第一及第二黏彈性損耗因子之差異可係小於1.50，例如，小於1.37、小於1.24、小於1.11、小於0.98、小於0.85、小於0.72、小於0.59、小於0.46、或小於0.33。就下限而言，當第一及第二玻璃轉變溫度之差異係小於約20℃時，第一及第二黏彈性損耗因子之差異可係大於約0.20，例如，大於0.33、大於0.46、大於0.59、大於0.72、大於0.85、大於0.98、大於1.11、大於1.24、或大於1.37。The first and second damping layers may also be configured such that the difference between the first and second viscoelastic loss factors is related to the difference between the first and second glass transition temperatures. For example, when the difference (or absolute difference) between the first and second glass transition temperatures is less than about 20 ° C, the difference (or absolute difference) between the first and second viscoelastic loss factors may be from about 0.2 to about 1.5, such as , In the range of 0.20 to 0.98, 0.33 to 1.11, 0.46 to 1.24, 0.59 to 1.37, or 0.72 to 1.50. In terms of upper limit, when the difference between the first and second glass transition temperatures is less than 20 ° C, the difference between the first and second viscoelastic loss factors may be less than 1.50, for example, less than 1.37, less than 1.24, less than 1.11, and less than 0.98, less than 0.85, less than 0.72, less than 0.59, less than 0.46, or less than 0.33. In terms of the lower limit, when the difference between the first and second glass transition temperatures is less than about 20 ° C, the difference between the first and second viscoelastic loss factors may be greater than about 0.20, for example, greater than 0.33, greater than 0.46, and greater than 0.59. , Greater than 0.72, greater than 0.85, greater than 0.98, greater than 1.11, greater than 1.24, or greater than 1.37.

作為另一實例，當第一及第二玻璃轉變溫度之差異係大於約20℃時，第一及第二黏彈性損耗因子之差異(或絕對差異)可在約0.2至約3.0，例如，0.20至1.88、0.48至2.16、0.76至2.44、1.04至2.72、或1.32至3.00之範圍內。就上限而言，當第一及第二玻璃轉變溫度之差異係大於約20℃時，第一及第二黏彈性損耗因子之差異可係小於約3.0，例如，小於2.72、小於2.44、小於2.16、小於1.88、小於1.60、小於1.32、小於1.04、小於0.76、或小於0.48。就下限而言，當第一及第二玻璃轉變溫度之差異係大於約20℃時，第一及第二黏彈性損耗因子之差異可係大於約0.2，例如，大於0.48、大於0.76、大於1.04、大於1.32、大於1.6、大於1.88、大於2.16、大於2.44、或大於2.72。As another example, when the difference between the first and second glass transition temperatures is greater than about 20 ° C, the difference (or absolute difference) between the first and second viscoelastic loss factors may be from about 0.2 to about 3.0, for example, 0.20 To 1.88, 0.48 to 2.16, 0.76 to 2.44, 1.04 to 2.72, or 1.32 to 3.00. In terms of upper limit, when the difference between the first and second glass transition temperatures is greater than about 20 ° C, the difference between the first and second viscoelastic loss factors may be less than about 3.0, for example, less than 2.72, less than 2.44, and less than 2.16. , Less than 1.88, less than 1.60, less than 1.32, less than 1.04, less than 0.76, or less than 0.48. In terms of the lower limit, when the difference between the first and second glass transition temperatures is greater than about 20 ° C, the difference between the first and second viscoelastic loss factors may be greater than about 0.2, for example, greater than 0.48, greater than 0.76, greater than 1.04 , Greater than 1.32, greater than 1.6, greater than 1.88, greater than 2.16, greater than 2.44, or greater than 2.72.

每個阻尼層之組成可包括彈性、非彈性、黏性及/或黏彈性材料。例如，阻尼材料可係可壓縮的且可包括恢復力。在一個態樣中，阻尼材料可包括橡膠、塑膠，例如，尼龍、皮革、織物、泡沫、海綿、凝膠或類似物。該等阻尼層可係複合物設計。在一些實施例中，每個阻尼層包括一或多種黏彈性阻尼材料。在一些實施例中，該第一阻尼層包括第一黏彈性阻尼材料，及該第二阻尼層包括第二黏彈性阻尼材料。在許多實施例中，具有第一黏彈性阻尼材料之第一阻尼層包括黏著劑。在許多實施例中，具有第二黏彈性阻尼材料之第二阻尼層亦包括黏著劑。在許多實施例中，第一阻尼層及第二阻尼層中之至少一者中之黏著劑包括壓敏黏著劑。The composition of each damping layer may include elastic, inelastic, viscous, and / or viscoelastic materials. For example, the damping material may be compressible and may include a restoring force. In one aspect, the damping material may include rubber, plastic, such as nylon, leather, fabric, foam, sponge, gel, or the like. The damping layers may be composite designs. In some embodiments, each damping layer includes one or more viscoelastic damping materials. In some embodiments, the first damping layer includes a first viscoelastic damping material, and the second damping layer includes a second viscoelastic damping material. In many embodiments, the first damping layer having the first viscoelastic damping material includes an adhesive. In many embodiments, the second damping layer having the second viscoelastic damping material also includes an adhesive. In many embodiments, the adhesive in at least one of the first and second damping layers includes a pressure-sensitive adhesive.

阻尼材料可包括一或多種聚矽氧黏著劑。聚矽氧黏著劑可包括聚有機矽氧烷分散液或膠，諸如聚二甲基矽氧烷、聚二甲基/甲基乙烯基矽氧烷、聚二甲基/甲基苯基矽氧烷、聚二甲基/二苯基矽氧烷及其摻合物。聚矽氧黏著劑可包括聚矽氧樹脂，諸如MQ樹脂或樹脂之摻合物。市售的此等聚矽氧黏著劑組合物之非限制性實例包括黏著劑7651、7652、7657、Q2-7406、Q2-7566、Q2-7735及7956，均可從Dow Corning (Midland，MI)獲得；SILGRIP™ PSA518、590、595、610、915、950及6574，可從Momentive Performance Materials (Waterford，NY)獲得；及KRT-009及KRT-026，可從Shin-Etsu Silicone (Akron，OH)獲得。The damping material may include one or more polysiloxane adhesives. Polysiloxane adhesives may include polyorganosiloxane dispersions or glues such as polydimethylsiloxane, polydimethyl / methylvinylsiloxane, polydimethyl / methylphenylsiloxane Alkane, polydimethyl / diphenylsiloxane and blends thereof. The polysiloxane adhesive may include a polysiloxane resin such as an MQ resin or a blend of resins. Non-limiting examples of these commercially available silicone adhesive compositions include adhesives 7651, 7652, 7657, Q2-7406, Q2-7566, Q2-7735, and 7956, all available from Dow Corning (Midland, MI) Obtained; SILGRIP ™ PSA518, 590, 595, 610, 915, 950, and 6574, available from Momentive Performance Materials (Waterford, NY); and KRT-009 and KRT-026, available from Shin-Etsu Silicone (Akron, OH) obtain.

阻尼材料可包含丙烯酸基或聚矽氧基單體。在一些實施例中，阻尼材料包含選自由以下組成之群之一或多種丙烯酸基單體：丙烯酸甲酯、丙烯酸乙酯、丙烯酸丁酯、丙烯酸2-乙基己酯、丙烯酸異辛酯、丙烯酸異冰片酯、丙烯酸異壬酯、丙烯酸異癸酯、甲基丙烯酸酯、甲基丙烯酸甲酯、丙烯酸甲基丁酯、丙烯酸4-甲基-2-苯酯、甲基丙烯酸丁酯、甲基丙烯酸2-乙基己酯及甲基丙烯酸異辛酯。有用的丙烯酸烷基酯包括丙烯酸正丁酯、丙烯酸2-乙基己酯、丙烯酸異辛酯。在一個實施例中，丙烯酸酯單體係在乙烯基酯，諸如乙酸乙烯酯、丁酸乙烯酯、丙酸乙烯酯、異丁酸乙烯酯、戊酸乙烯酯、叔碳酸乙烯酯(vinyl versitate)及類似物之存在下聚合。基於形成丙烯酸酯主鏈之單體之總重量計，乙烯基酯可以至多約35 wt%之總量存在。在一個實施例中，丙烯酸酯單體與不飽和羧酸共聚合。不飽和羧酸尤其可包括丙烯酸、甲基丙烯酸、衣康酸(itaconic acid)、丙烯酸β羧基乙酯及類似物。The damping material may include acrylic-based or polysiloxy monomers. In some embodiments, the damping material comprises one or more acrylic-based monomers selected from the group consisting of: methyl acrylate, ethyl acrylate, butyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate, acrylic acid Isobornyl, isononyl acrylate, isodecyl acrylate, methacrylate, methyl methacrylate, methyl butyl acrylate, 4-methyl-2-phenyl acrylate, butyl methacrylate, methyl 2-ethylhexyl acrylate and isooctyl methacrylate. Useful alkyl acrylates include n-butyl acrylate, 2-ethylhexyl acrylate, isooctyl acrylate. In one embodiment, the monoacrylate system is in a vinyl ester, such as vinyl acetate, vinyl butyrate, vinyl propionate, vinyl isobutyrate, vinyl valerate, vinyl versitate And the like in the presence of polymerization. The vinyl ester may be present in a total amount of up to about 35 wt% based on the total weight of the monomers forming the acrylate backbone. In one embodiment, the acrylate monomer is copolymerized with an unsaturated carboxylic acid. Unsaturated carboxylic acids may include acrylic acid, methacrylic acid, itaconic acid, beta carboxyethyl acrylate, and the like.

在一些實施例中，阻尼材料包含選自由以下組成之群之一或多種聚矽氧基單體：矽氧烷、矽烷及雜氮矽三環(silatrane)二醇。在一些實施例中，阻尼材料包含選自由以下組成之群之一或多種聚矽氧基單體：1,4-雙[二甲基[2-(5-降冰片烯-2-基)乙基]矽基]苯；1,3-二環己基-1,1,3,3-肆(二甲基矽基氧基)二矽氧烷；1,3-二環己基-1,1,3,3-肆(二甲基乙烯基矽基氧基)二矽氧烷；1,3-二環己基-1,1,3,3-四[(降冰片烯-2-基)乙基二甲基矽基氧基]二矽氧烷；1,3-二乙烯基四甲基二矽氧烷；1,1,3,3,5,5-六甲基-1,5-雙[2-(5-降冰片烯-2-基)乙基]三矽氧烷；1,1,3,3-四甲基-1,3-雙[2-(5-降冰片烯-2-基)乙基]二矽氧烷；2,4,6,8-四甲基-2,4,6,8-四乙烯基環四矽氧烷；N-[3-(三甲氧基矽基)丙基]-N′-(4-乙烯基苄基)乙二胺；及3-[參(三甲基矽氧基)矽基]丙基乙烯基胺甲酸酯。In some embodiments, the damping material comprises one or more polysiloxy monomers selected from the group consisting of: siloxane, silane, and silatrane diol. In some embodiments, the damping material comprises one or more polysiloxy monomers selected from the group consisting of: 1,4-bis [dimethyl [2- (5-norbornene-2-yl) ethyl [Silyl] silyl] benzene; 1,3-dicyclohexyl-1,1,3,3- (Dimethylsilyloxy) disilaxane; 1,3-dicyclohexyl-1,1, 3,3-Di (dimethylvinylsilyloxy) disiloxane; 1,3-dicyclohexyl-1,1,3,3-tetrakis [(norbornene-2-yl) ethyl Dimethylsilyloxy] disilaxane; 1,3-divinyltetramethyldisilaxane; 1,1,3,3,5,5-hexamethyl-1,5-bis [ 2- (5-norbornene-2-yl) ethyl] trisiloxane; 1,1,3,3-tetramethyl-1,3-bis [2- (5-norbornene-2- ) Ethyl] disiloxane; 2,4,6,8-tetramethyl-2,4,6,8-tetravinylcyclotetrasiloxane; N- [3- (trimethoxysilyl) ) Propyl] -N '-(4-vinylbenzyl) ethylenediamine; and 3- [gins (trimethylsiloxy) silyl] propylvinylcarbamate.

阻尼材料可包括聚矽氧聚合物、丙烯酸聚合物或甲基丙烯酸聚合物。適宜之丙烯酸聚合物包括(但不限於) S2000N、S692N、AT20N、XPE 1043及XPE 1045，均可從Avery Dennison (Glendale，CA)獲得；及H9232，可從BASF (Florham Park，NJ)獲得。在一個實施例中，將丙烯酸聚合物組合物與量高達聚合物之30乾重%的橡膠聚合物摻合，該橡膠聚合物包括(但不限於)多嵌段共聚物，例如苯乙烯異戊二烯-苯乙烯(SIS)、苯乙烯-乙烯丁烯-苯乙烯(SEBS)及類似物。有用之三嵌段之實例係可從Kraton Polymer Inc. (Houston，TX)獲得。多嵌段聚合物可用於改變丙烯酸組合物之阻尼峰及其他物理性質。其他阻尼材料可包括橡膠聚合物。適宜之橡膠聚合物包括(但不限於)彈性體、丁基橡膠、苯乙烯嵌段共聚物(稱為SBC，例如，Kraton)、聚矽氧橡膠、腈橡膠、異戊二烯、丁二烯。在一些實施例中，橡膠聚合物組合物可與丙烯酸聚合物及/或丙烯酸聚合物摻合。The damping material may include a silicone polymer, an acrylic polymer, or a methacrylic polymer. Suitable acrylic polymers include, but are not limited to, S2000N, S692N, AT20N, XPE 1043, and XPE 1045, all available from Avery Dennison (Glendale, CA); and H9232, available from BASF (Florham Park, NJ). In one embodiment, the acrylic polymer composition is blended with a rubber polymer in an amount up to 30% by dry weight of the polymer, the rubber polymer including, but not limited to, a multi-block copolymer such as styrene isoprene Diene-styrene (SIS), styrene-ethylene butene-styrene (SEBS), and the like. Examples of useful triblocks are available from Kraton Polymer Inc. (Houston, TX). Multi-block polymers can be used to alter the damping peaks and other physical properties of acrylic compositions. Other damping materials may include rubber polymers. Suitable rubber polymers include, but are not limited to, elastomers, butyl rubber, styrene block copolymers (referred to as SBC, such as Kraton), silicone rubber, nitrile rubber, isoprene, butadiene . In some embodiments, the rubber polymer composition may be blended with an acrylic polymer and / or an acrylic polymer.

可將各種官能基併入阻尼材料之聚合物中。可將官能基併入至由丙烯酸基單體或矽基單體形成之聚合物中(例如)作為末端片段。代表性官能基包括(但不限於)羥基、環氧基、氰基、異氰酸酯、胺基、芳氧基、芳烷氧基、肟基、乙醯基、環氧醚及乙烯基醚、烷氧基羥甲基、環醚、硫醇、二苯甲酮、苯乙酮、醯基膦、噻噸酮、及二苯甲酮、苯乙酮、醯基膦及噻噸酮之衍生物。Various functional groups can be incorporated into the polymer of the damping material. A functional group may be incorporated into a polymer formed from an acrylic monomer or a silicon-based monomer, for example, as a terminal fragment. Representative functional groups include, but are not limited to, hydroxyl, epoxy, cyano, isocyanate, amine, aryloxy, aralkoxy, oxime, acetamyl, epoxy ether and vinyl ether, alkoxy Derivatives of methylolmethyl, cyclic ether, thiol, benzophenone, acetophenone, fluorenylphosphine, thioxanthone, and benzophenone, acetophenone, fluorenylphosphine, and thioxanthone.

具有氫鍵鍵結能力之官能基係熟知的且包括羧基、醯胺、羥基、胺基、吡啶基、氧基、胺甲醯基及其混合物。在一些實施例中，阻尼材料之丙烯酸聚合物主鏈包括極性共聚單體乙烯基吡咯啶酮及丙烯酸。具有氫鍵鍵結官能性之其他單體之實例包括甲基丙烯酸、乙烯醇、己內酯、環氧乙烷、乙二醇、丙二醇、丙烯酸2-羥基乙酯、N-乙烯基己内醯胺、甲基丙烯酸乙醯乙醯氧基乙酯及其他。Functional groups having hydrogen bonding capabilities are well known and include carboxyl, amidine, hydroxyl, amine, pyridyl, oxy, carbamoyl, and mixtures thereof. In some embodiments, the acrylic polymer backbone of the damping material includes a polar comonomer vinyl pyrrolidone and acrylic acid. Examples of other monomers having hydrogen bonding functionality include methacrylic acid, vinyl alcohol, caprolactone, ethylene oxide, ethylene glycol, propylene glycol, 2-hydroxyethyl acrylate, N-vinyl caprolactone Amine, Ethyl Acetyl Ethyl Methacrylate and others.

在一些實施例中，阻尼材料包含具有可進一步交聯之官能性之一或多個共聚單體。可交聯共聚單體之實例包括(甲基)丙烯酸、丙烯酸2-羥基乙酯、甲基丙烯酸縮水甘油酯、衣康酸、烯丙基縮水甘油醚及類似物、及其混合物。官能基部分(諸如彼等以上所述者)可用於使聚合物鏈交聯，以將高碳數側鏈連接到主鏈，或兩者。In some embodiments, the damping material comprises one or more comonomers having functionalities that can be further crosslinked. Examples of the crosslinkable comonomer include (meth) acrylic acid, 2-hydroxyethyl acrylate, glycidyl methacrylate, itaconic acid, allyl glycidyl ether and the like, and mixtures thereof. Functional moieties, such as those described above, can be used to cross-link polymer chains to connect high carbon number side chains to the main chain, or both.

阻尼材料可進一步包含交聯劑，該交聯劑可廣泛地變化。適宜交聯劑之實例包括多官能丙烯酸酯及甲基丙烯酸酯，諸如二丙烯酸酯(乙二醇二丙烯酸酯、丙二醇二丙烯酸酯、聚乙二醇二丙烯酸酯及己二醇二丙烯酸酯)、二甲基丙烯酸酯(乙二醇二丙烯酸酯、二乙二醇二甲基丙烯酸酯及1,3-丁二醇二甲基丙烯酸酯)、三丙烯酸酯(三羥甲基丙烷三甲基丙烯酸酯、乙氧基化三羥甲基丙烷三丙烯酸酯及季戊四醇三丙烯酸酯)、及三甲基丙烯酸酯(季戊四醇三甲基丙烯酸酯及三羥甲基丙烷三甲基丙烯酸酯)、以及二乙烯酯，諸如二乙烯基苯、琥珀酸二乙烯酯、己二酸二乙烯酯、馬來酸二乙烯酯、草酸二乙烯酯及丙二酸二乙烯酯。The damping material may further include a cross-linking agent, which may vary widely. Examples of suitable crosslinking agents include polyfunctional acrylates and methacrylates, such as diacrylates (ethylene glycol diacrylate, propylene glycol diacrylate, polyethylene glycol diacrylate, and hexanediol diacrylate), Dimethacrylate (ethylene glycol diacrylate, diethylene glycol dimethacrylate, and 1,3-butanediol dimethacrylate), triacrylate (trimethylolpropane trimethacrylate) Esters, ethoxylated trimethylolpropane triacrylate and pentaerythritol triacrylate), and trimethacrylates (pentaerythritol trimethacrylate and trimethylolpropane trimethacrylate), and diethylene glycol Esters such as divinylbenzene, divinyl succinate, divinyl adipate, divinyl maleate, divinyl oxalate, and divinyl malonate.

存在於阻尼材料中之額外交聯劑可用於在聚矽氧基基質中形成交聯。在一些實施例中，過氧化物交聯劑(諸如二苯甲醯基過氧化物)係適宜的。在一些實施例中，交聯劑為含有矽-氫化物官能性之化合物。此等交聯劑之非限制性實例包括PEROXAN BP 50W、PEROXAN BIC及PEROXAN Bu，均可從Pergan (Bocholt，Germany)獲得；LUPEROX® A75及A98，可從Arkema (King of Prussia，PA)獲得；及PERKADOX® CH-50及PD 50SPS，來自Akzo Nobel (Chicago，IL)。交聯可藉由加熱或其他技術(一般取決於所使用的化學系統)促進。Additional crosslinkers present in the damping material can be used to form crosslinks in the polysiloxy matrix. In some embodiments, a peroxide cross-linking agent, such as a benzamidine peroxide, is suitable. In some embodiments, the cross-linking agent is a compound containing silicon-hydride functionality. Non-limiting examples of these crosslinking agents include PEROXAN BP 50W, PEROXAN BIC and PEROXAN Bu, all available from Pergan (Bocholt, Germany); LUPEROX® A75 and A98, available from Arkema (King of Prussia, PA); And PERKADOX® CH-50 and PD 50SPS from Akzo Nobel (Chicago, IL). Cross-linking can be promoted by heating or other techniques (generally depending on the chemical system used).

可用於阻尼材料中之其他示例性化學交聯劑包括(但不限於)具有或不具有觸媒(諸如二月桂酸二丁基錫)之二-、三-或聚-異氰酸酯；離子交聯劑；及二-、三-或多-官能氮丙啶。市售化學交聯劑之示例性非限制性實例包括乙醯丙酮鋁(AAA)，可從NOAH Technologies (San Antonio，TX)獲得；TYZOR®，可從DuPont (Wilmington，DE)獲得；XAMA®，可從Bayer (Pittsburgh，PA)獲得；及PAPI™及VORONATE™，可從Dow Chemical獲得。Other exemplary chemical cross-linking agents that can be used in damping materials include, but are not limited to, bi-, tri-, or poly-isocyanates with or without catalysts such as dibutyltin dilaurate; ionic cross-linking agents; Di-, tri- or poly-functional aziridine. Illustrative non-limiting examples of commercially available chemical cross-linking agents include aluminum acetoacetone (AAA), available from NOAH Technologies (San Antonio, TX); TYZOR®, available from DuPont (Wilmington, DE); XAMA®, Available from Bayer (Pittsburgh, PA); and PAPI ™ and VORONATE ™, available from Dow Chemical.

阻尼材料可視需要包含一或多種增黏劑或樹脂，且此等增黏劑(當使用時)可廣泛地變化。在一些情況中，阻尼材料之增黏劑包括單一增黏劑。在其他情況中，增黏劑包括多種增黏劑產品之混合物。適宜之商業增黏劑包括(但不限於)(例如)氫化DCPD樹脂(諸如HD1100、HD1120，來自Luhua (China))及E5400(來自Exxon Mobil (Houston，TX))。其他適宜之氫化樹脂包括完全氫化之樹脂，諸如REGALITE™ S1100、R1090、R1100、C100R及C100W，來自Eastman (Kingsport，TN)；及完全氫化之C9樹脂QM-100A及QM-115A，來自Hebei Qiming (China)。The damping material may contain one or more tackifiers or resins as needed, and these tackifiers (when used) may vary widely. In some cases, the tackifier of the damping material includes a single tackifier. In other cases, the tackifier includes a mixture of multiple tackifier products. Suitable commercial tackifiers include, but are not limited to, for example, hydrogenated DCPD resins (such as HD1100, HD1120 from Luhua (China)) and E5400 (from Exxon Mobil (Houston, TX)). Other suitable hydrogenated resins include fully hydrogenated resins such as REGALITE ™ S1100, R1090, R1100, C100R, and C100W from Eastman (Kingsport, TN); and fully hydrogenated C9 resins QM-100A and QM-115A from Hebei Qiming ( China).

阻尼材料亦可視需要包含一或多種塑化劑，且此等塑化劑(當使用時)可廣泛地變化。在一些實施例中，塑化劑具有高分子量及/或高黏度。在某些情況中，塑化劑包括單一塑化劑。在其他情況中，塑化劑包括多種塑化劑產品之混合物。適宜之商業塑化劑包括(但不限於)(例如) KN 4010及KP 6030，來自Sinopec (Beijing，China)；Claire F55，來自Tianjin (China)；F550，來自Formosa Petrochemical (China)、及各種聚異丁烯產品。The damping material may also include one or more plasticizers as needed, and these plasticizers (when used) can vary widely. In some embodiments, the plasticizer has a high molecular weight and / or a high viscosity. In some cases, the plasticizer includes a single plasticizer. In other cases, the plasticizer includes a mixture of multiple plasticizer products. Suitable commercial plasticizers include, but are not limited to, for example, KN 4010 and KP 6030 from Sinopec (Beijing, China); Claire F55 from Tianjin (China); F550 from Formosa Petrochemical (China), and various polymers Isobutylene products.

阻尼材料可視需要包含一或多種蠟，且此等蠟(當使用時)可廣泛地變化。在一些情況中，蠟包括單一蠟。在其他情況中，蠟包括多種蠟產品之混合物。蠟可具有更高的分子量，以便有利地改良油之遷移。示例性蠟包括微晶蠟、石蠟、烴蠟及其組合。適宜之商業蠟包括(但不限於)(例如) Sasol蠟3971、7835、6403、6805及1800，來自Sasol (Houston，TX)；A-C1702、A-C6702、A-C5180，來自Honeywell (Morristown，NJ)；及MICROWAX™ FG 7730及MICROWAX™ FG 8113，來自Paramelt (Muskegon，MI)。The damping material may contain one or more waxes as needed, and these waxes (when used) may vary widely. In some cases, the wax includes a single wax. In other cases, the wax includes a mixture of wax products. The wax may have a higher molecular weight in order to advantageously improve the migration of the oil. Exemplary waxes include microcrystalline wax, paraffin wax, hydrocarbon wax, and combinations thereof. Suitable commercial waxes include, but are not limited to, for example, Sasol waxes 3971, 7835, 6403, 6805, and 1800 from Sasol (Houston, TX); A-C1702, A-C6702, A-C5180 from Honeywell (Morristown, NJ); and MICROWAX ™ FG 7730 and MICROWAX ™ FG 8113 from Paramelt (Muskegon, MI).

阻尼材料可包含經選擇以改良在更寬泛範圍之操作溫度下之阻尼性能之一或多種粉末添加劑。在一些實施例中，阻尼材料包含一或多種丙烯酸基粉末添加劑。適宜之市售丙烯酸基粉末添加劑包括SPHEROMERS® CA 6、SPHEROMERS® CA 10、SPHEROMERS® CA 15、KRATON® SBS 1101 AS、KRATON® SB 1011 AC、KRATON® TM 1116聚合物、KRATON® D1101 A聚合物、KRATON® D1114 P聚合物、KRATON® D1114 P聚合物、Zeon NIPOL® 1052、Zeon NIPOL®1041及Zeon NIPOL®NS 612。在一些實施例中，阻尼材料包含一或多種聚矽氧基粉末添加劑。適宜之市售聚矽氧基粉末添加劑包括Shin-Etsu KMP 597、Shin-Etsu KMP 600及Shin-Etsu KMP 701。The damping material may include one or more powder additives selected to improve damping performance over a wider range of operating temperatures. In some embodiments, the damping material comprises one or more acrylic-based powder additives. Suitable commercially available acrylic-based powder additives include SPHEROMERS® CA 6, SPHEROMERS® CA 10, SPHEROMERS® CA 15, KRATON® SBS 1101 AS, KRATON® SB 1011 AC, KRATON® TM 1116 polymer, KRATON® D1101 A polymer, KRATON® D1114 P polymer, KRATON® D1114 P polymer, Zeon NIPOL® 1052, Zeon NIPOL® 1041, and Zeon NIPOL® NS 612. In some embodiments, the damping material includes one or more polysiloxy powder additives. Suitable commercially available polysiloxy powder additives include Shin-Etsu KMP 597, Shin-Etsu KMP 600, and Shin-Etsu KMP 701.

在一些實施例中，阻尼材料包含一或多種高表面積無機填料或填料及顏料之組合。高表面積可包括在約0.01 m2 /g至約300 m2 /g範圍內之表面積。高表面積無機填料可包括填料，諸如(但不限於)碳黑、碳酸鈣、二氧化鈦、(親水性改性及疏水改性)二氧化矽、雲母、滑石、高嶺土、黏土、矽藻土、硫酸鋇、硫酸鋁、或其中兩者或更多者之混合物。市售高表面積無機填料之實例包括彼等可從Evonik Degussa GmbH (Essen，Germany)獲得者。包括前述實例之無機填料可用於調節阻尼片之阻尼及其他物理性質。亦可使用或替代地使用各種有機填料。In some embodiments, the damping material comprises one or more high surface area inorganic fillers or a combination of fillers and pigments. The high surface area may include a surface area in a range of about 0.01 m 2 / g to about 300 m 2 / g. High surface area inorganic fillers can include fillers such as (but not limited to) carbon black, calcium carbonate, titanium dioxide, (hydrophilic and hydrophobically modified) silicon dioxide, mica, talc, kaolin, clay, diatomaceous earth, barium sulfate , Aluminum sulfate, or a mixture of two or more thereof. Examples of commercially available high surface area inorganic fillers include those available from Evonik Degussa GmbH (Essen, Germany). Inorganic fillers including the foregoing examples can be used to adjust the damping and other physical properties of the damping sheet. Various organic fillers can also be used or alternatively.

在另一個實施例中，填料組合實例可包括抗結塊劑，其係根據加工及/或使用條件進行選擇。此等試劑之實例包括(例如)二氧化矽、滑石、矽藻土及其任何混合物。填料顆粒可為細碎的實質上不溶於水之無機填料顆粒。In another embodiment, examples of filler combinations may include anticaking agents, which are selected based on processing and / or use conditions. Examples of such agents include, for example, silica, talc, diatomaceous earth, and any mixtures thereof. The filler particles may be finely divided inorganic filler particles that are substantially insoluble in water.

細碎的實質上不溶於水之無機填料顆粒可包括金屬氧化物之顆粒。構成顆粒之金屬氧化物可係簡單金屬氧化物，即單一金屬之氧化物，或其可係複合金屬氧化物，即兩種或更多種金屬之氧化物。金屬氧化物之顆粒可係單一金屬氧化物之顆粒，或其等可係不同金屬氧化物之不同顆粒之混合物。適宜金屬氧化物之實例包括氧化鋁、二氧化矽及二氧化鈦。其他氧化物可視需要以少量存在。此等可選氧化物之實例包括(但不限於)氧化鋯、氧化鉿及氧化釔。可視需要存在之其他金屬氧化物係彼等通常作為雜質存在之金屬氧化物，諸如(例如)氧化鐵。出於本說明書及申請專利範圍之目的，矽被認為係金屬。當顆粒為氧化鋁之顆粒時，最常見的氧化鋁為氧化鋁一氫氧化物。已知氧化鋁一氫氧化物AlO(OH)之顆粒及其製法。The finely divided, substantially water-insoluble inorganic filler particles may include particles of metal oxides. The metal oxide constituting the particle may be a simple metal oxide, that is, an oxide of a single metal, or it may be a composite metal oxide, that is, an oxide of two or more metals. The metal oxide particles can be particles of a single metal oxide, or they can be a mixture of different particles of different metal oxides. Examples of suitable metal oxides include aluminum oxide, silicon dioxide, and titanium dioxide. Other oxides may be present in small amounts as required. Examples of such optional oxides include, but are not limited to, zirconia, hafnium oxide, and yttrium oxide. Other metal oxides that may be present are those metal oxides that are typically present as impurities, such as, for example, iron oxide. For the purposes of this specification and the scope of patent applications, silicon is considered a metal. When the particles are alumina particles, the most common alumina is alumina-hydroxide. Particles of alumina-hydroxide AlO (OH) and methods for making the same are known.

金屬微粒可用於阻尼材料中，例如，金屬粉末(諸如鋁、銅或特殊鋼)、二硫化鉬、氧化鐵(例如氧化鐵黑)、摻銻二氧化鈦及摻鎳二氧化鈦。亦可使用金屬合金微粒。Metal particles can be used in damping materials, for example, metal powders (such as aluminum, copper, or special steel), molybdenum disulfide, iron oxide (such as iron oxide black), antimony-doped titanium oxide, and nickel-doped titanium dioxide. Metal alloy particles can also be used.

可將添加劑(諸如碳黑及其他顏料、紫外光吸收劑、紫外線穩定劑、抗氧化劑、阻燃劑、導熱或導電劑、後固化劑及類似物)摻入至阻尼材料中以改變阻尼塊(damping patch)之性質。此等添加劑亦可包括(例如)一或多種抑制劑、消泡劑、著色劑、發光劑、緩衝劑、抗結塊劑、潤濕劑、消光劑、抗靜電劑、酸清除劑、加工助劑、擠出助劑及其他。紫外光吸收劑包括羥基苯基苯并***及氫化二苯甲酮(hydrobenzophenone)。抗氧化劑包括(例如)受阻酚、受阻胺、及氫氧化硫及氫氧化磷分解劑(諸如Irganox 1520L)。填料、顏料、塑化劑、阻燃劑、UV穩定劑及類似物在許多實施例中係可選的且在特定實施例中可以0至30%或更大，諸如高達40%之濃度使用。在某些實施例中，填料(無機及/或有機)、顏料、塑化劑、阻燃劑、UV穩定劑及其組合之總量為0.1%至30%，且更特定言之1%至20%。Additives such as carbon black and other pigments, ultraviolet light absorbers, ultraviolet stabilizers, antioxidants, flame retardants, thermal or conductive agents, post-curing agents, and the like can be incorporated into the damping material to change the damping block ( damping patch). These additives may also include, for example, one or more inhibitors, defoamers, colorants, luminescent agents, buffering agents, anti-caking agents, wetting agents, matting agents, antistatic agents, acid scavengers, processing aids Agents, extrusion aids and others. Ultraviolet light absorbers include hydroxyphenylbenzotriazole and hydrobenzophenone. Antioxidants include, for example, hindered phenols, hindered amines, and sulfur and phosphorus hydroxide decomposers (such as Irganox 1520L). Fillers, pigments, plasticizers, flame retardants, UV stabilizers, and the like are optional in many embodiments and may be used in concentrations of 0 to 30% or greater, such as up to 40%. In certain embodiments, the total amount of fillers (inorganic and / or organic), pigments, plasticizers, flame retardants, UV stabilizers, and combinations thereof is 0.1% to 30%, and more specifically 1% to 20%.

阻尼材料亦可包含一或多種溶劑。適宜溶劑之非限制性實例包括甲苯、二甲苯、四氫呋喃、己烷、庚烷、環己烷、環己酮、二氯甲烷、異丙醇、乙醇、乙酸乙酯、乙酸丁酯、乙酸異丙酯及其組合。應瞭解，本發明標的阻尼材料並不限於此等溶劑且可使用各種其他溶劑、添加劑及/或黏度調節劑(諸如反應性稀釋劑)。
拘束層 The damping material may also contain one or more solvents. Non-limiting examples of suitable solvents include toluene, xylene, tetrahydrofuran, hexane, heptane, cyclohexane, cyclohexanone, dichloromethane, isopropanol, ethanol, ethyl acetate, butyl acetate, isopropyl acetate Esters and combinations thereof. It should be understood that the subject damping material is not limited to these solvents and various other solvents, additives, and / or viscosity modifiers such as reactive diluents can be used.
Binding layer

在一些情況中，第一及第二阻尼層可藉由內部拘束層彼此分開，該內部拘束層之至少一部分係設置在第一阻尼層與第二阻尼層之間。內部拘束層之一個面可直接與第一阻尼層相鄰，或可在內部拘束層與第一阻尼層之間設置有一或多個中介層。內部拘束層之相對面可直接與第二阻尼層相鄰，或可在內部拘束層與第二阻尼層之間設置有一或多個中介層。In some cases, the first and second damping layers may be separated from each other by an internal restraint layer, at least a portion of which is disposed between the first and second damping layers. One face of the internal restraint layer may be directly adjacent to the first damping layer, or one or more intervening layers may be disposed between the inner restraint layer and the first damping layer. The opposite surface of the internal restraint layer may be directly adjacent to the second damping layer, or one or more intervening layers may be disposed between the internal restraint layer and the second damping layer.

在一些情況中，多層阻尼層壓物包括外部拘束層。層壓物之第二阻尼層之至少一部分可設置在第一阻尼層與外部拘束層之間。第二阻尼層之至少一部分可設置在內部拘束層與外部拘束層之間。外部拘束層之一個面可直接與第二阻尼層相鄰，或在第二阻尼層與外部拘束層之間可有一或多個中介層。在一些情況中，第二阻尼層之一個面係直接與內部拘束層相鄰，且第二阻尼層之相對面係直接與外部拘束層相鄰。In some cases, the multilayer damping laminate includes an external restraint layer. At least a portion of the second damping layer of the laminate may be disposed between the first damping layer and the external restraint layer. At least a portion of the second damping layer may be disposed between the inner restraint layer and the outer restraint layer. One face of the outer restraint layer may be directly adjacent to the second damping layer, or there may be one or more intervening layers between the second damping layer and the outer restraint layer. In some cases, one face of the second damping layer is directly adjacent to the inner restraint layer, and the opposite face of the second damping layer is directly adjacent to the outer restraint layer.

內部拘束層及外部拘束層之厚度可(例如)各自獨立地在約0.2密耳至約120密耳，例如，0.2密耳至9密耳、0.4密耳至20密耳、0.7密耳至35密耳、1.5密耳至65密耳或2.5密耳至120密耳之範圍內。內部及外部拘束層厚度可各自獨立地在約2密耳至約50密耳，例如，2密耳至15密耳、3密耳至20密耳、4密耳至25密耳、5.5密耳至35密耳、或7密耳至50密耳之範圍內。就上限而言，內部及外部拘束層厚度可各自獨立地小於約120密耳，例如，小於65密耳、小於50密耳、小於35密耳、小於25密耳、小於20密耳、小於15密耳、小於10密耳、小於9密耳、小於7密耳、小於5.5密耳、小於5密耳、小於4密耳、小於3密耳、小於2.5密耳、小於1.5密耳、小於0.7密耳、或小於0.4密耳。就下限而言，內部及外部拘束層厚度可各自獨立地大於約0.2密耳，例如，大於0.4密耳、大於0.7密耳、大於1.5密耳、大於2.5密耳、大於3密耳、大於4密耳、大於5密耳、大於5.5密耳、大於7密耳、大於9密耳、大於10密耳、大於15密耳、大於20密耳、大於25密耳、大於35密耳、大於50密耳、或大於65密耳。亦涵蓋更大的厚度(例如，大於120密耳)及更小的厚度(例如，小於0.2密耳)。The thickness of the inner restraint layer and the outer restraint layer can be, for example, independently from about 0.2 mils to about 120 mils, for example, 0.2 mils to 9 mils, 0.4 mils to 20 mils, 0.7 mils to 35 Mils, 1.5 mils to 65 mils, or 2.5 mils to 120 mils. The thickness of the inner and outer restraint layers can be independently from about 2 mils to about 50 mils, for example, 2 mils to 15 mils, 3 mils to 20 mils, 4 mils to 25 mils, 5.5 mils To 35 mils, or 7 to 50 mils. In terms of upper limits, the thickness of the inner and outer restraint layers can each independently be less than about 120 mils, for example, less than 65 mils, less than 50 mils, less than 35 mils, less than 25 mils, less than 20 mils, and less than 15 Mil, less than 10 mil, less than 9 mil, less than 7 mil, less than 5.5 mil, less than 5 mil, less than 4 mil, less than 3 mil, less than 2.5 mil, less than 1.5 mil, less than 0.7 Mils, or less than 0.4 mils. As far as the lower limit is concerned, the thickness of the inner and outer restraint layers can each independently be greater than about 0.2 mils, for example, greater than 0.4 mils, greater than 0.7 mils, greater than 1.5 mils, greater than 2.5 mils, greater than 3 mils, greater than 4 Mil, greater than 5 mil, greater than 5.5 mil, greater than 7 mil, greater than 9 mil, greater than 10 mil, greater than 15 mil, greater than 20 mil, greater than 25 mil, greater than 35 mil, greater than 50 Mils, or greater than 65 mils. Larger thicknesses (eg, greater than 120 mils) and smaller thicknesses (eg, less than 0.2 mils) are also encompassed.

內部及外部拘束層可各自獨立地包含一或多種硬化材料，其中該等拘束層中之各者可具有相似或不同之組成。硬化材料可包含一或多種聚合物材料。聚合物材料之非限制性實例包括聚氯乙烯(PVC)、聚烯烴(諸如聚乙烯(PE)及/或聚丙烯(PP))、聚對苯二甲酸乙二酯(PET)、聚碳酸酯(PC)、聚苯乙烯(PS)、及此等及其他材料之組合。The inner and outer restraint layers may each independently contain one or more hardened materials, where each of the restraint layers may have a similar or different composition. The hardened material may include one or more polymer materials. Non-limiting examples of polymer materials include polyvinyl chloride (PVC), polyolefins such as polyethylene (PE) and / or polypropylene (PP), polyethylene terephthalate (PET), polycarbonate (PC), polystyrene (PS), and combinations of these and other materials.

硬化材料可包含一或多種金屬或金屬合金。金屬之非限制性實例包括鋁、鋼、鎂、青銅、銅、黃銅、鈦、鐵、鈹、鉬、鎢或鋨。在一些實施例中，內部及外部拘束層各自獨立地為金屬箔片。The hardened material may include one or more metals or metal alloys. Non-limiting examples of metals include aluminum, steel, magnesium, bronze, copper, brass, titanium, iron, beryllium, molybdenum, tungsten, or thallium. In some embodiments, the inner and outer restraint layers are each independently a metal foil.

硬化材料可包含一或多種天然或人造木材。硬化材料可包含一或多種纖維。纖維之非限制性實例包括***纖維、亞麻纖維、玻璃纖維及碳纖維。硬化材料可包含一或多種碳基材料，包括碳奈米管、石墨烯、金剛石、卡賓(carbine)或其組合。硬化材料亦可包含陶瓷。亦可使用複合材料及此等材料之組合。
襯墊層 The hardened material may include one or more natural or artificial woods. The hardened material may include one or more fibers. Non-limiting examples of fibers include hemp fibers, flax fibers, glass fibers, and carbon fibers. The hardened material may include one or more carbon-based materials, including carbon nanotubes, graphene, diamond, carbin, or a combination thereof. The hardened material may also include ceramics. Composite materials and combinations of these materials can also be used.
Cushion

在一些情況中，多層層壓膜包括連接至第一阻尼層之襯墊層。襯墊層之一個面可直接與第一阻尼層相鄰，或在第一阻尼層與襯墊層之間可有一或多個中介層。在一些情況中，第一阻尼層之一個面係直接與內部拘束層相鄰，且第一阻尼層之相對面係直接與襯墊層相鄰。In some cases, the multilayer laminate film includes a cushion layer connected to the first damping layer. One side of the cushion layer may be directly adjacent to the first damping layer, or there may be one or more intervening layers between the first damping layer and the cushion layer. In some cases, one face of the first damping layer is directly adjacent to the internal restraint layer, and the opposite face of the first damping layer is directly adjacent to the cushion layer.

離型襯墊可用作保護性覆蓋物，使得該離型襯墊保持在適當位置，直至多層阻尼層壓物準備好附著至物體或表面。若層壓物中包括襯墊或離型襯墊，則可將多種材料及組態用於襯墊。在許多實施例中，襯墊為紙或紙基材料。在許多其他實施例中，襯墊為一或多種聚合物材料之聚合物膜。通常，襯墊之至少一個面塗覆有離型材料，諸如聚矽氧或聚矽氧基材料。如所瞭解，襯墊之離型塗覆面與外部第一阻尼層之以其他方式暴露的面接觸。在將標籤施覆至關注表面之前，移除襯墊以藉此暴露層壓物之第一阻尼層。襯墊可呈單個薄片之形式。或者，襯墊可呈多個部分或面板之形式。
廣義化多層阻尼層壓物 A release liner can be used as a protective covering so that the release liner remains in place until the multilayer damping laminate is ready to attach to an object or surface. If the laminate includes a liner or release liner, a variety of materials and configurations can be used for the liner. In many embodiments, the liner is paper or a paper-based material. In many other embodiments, the liner is a polymer film of one or more polymer materials. Typically, at least one side of the gasket is coated with a release material, such as a polysiloxane or polysiloxy material. As understood, the release-coated surface of the gasket is in contact with the otherwise exposed surface of the outer first damping layer. Prior to applying the label to the surface of interest, the liner is removed to thereby expose the first damping layer of the laminate. The cushion may be in the form of a single sheet. Alternatively, the cushion may be in the form of multiple sections or panels.
Generalized multilayer damping laminate

在一個實施例中，揭示另一種多層阻尼層壓物。如本文所述，多層阻尼層壓物可具有第一阻尼層及第二阻尼層。另外，除了第一阻尼層及第二阻尼層之外，多層阻尼層壓物可包含更多阻尼層。一般而言，多層阻尼層壓物包括N個阻尼層，該等阻尼層各自獨立地具有玻璃轉變溫度Tg ，其中N為大於或等於2之整數。N個阻尼層配置成使得第一阻尼層為直接與振動基板接觸以消散振動之阻尼層。然後，以遞增順序編號位於第一阻尼層上方之阻尼層，其中每個阻尼層之玻璃轉變溫度小於其下方之阻尼層之玻璃轉變溫度。然後藉由不等式描述多層阻尼層壓物之各阻尼層玻璃轉變溫度之間的關係：

在一些實施例中，每個阻尼層亦具有平臺模量Go ，該平臺模量Go 係大於其下方之阻尼層之平臺模量Go 。然後藉由不等式描述多層阻尼層壓物之各阻尼層平臺模量之間的關係：
In one embodiment, another multilayer damping laminate is disclosed. As described herein, the multilayer damping laminate may have a first damping layer and a second damping layer. In addition, the multilayer damping laminate may include more damping layers in addition to the first damping layer and the second damping layer. Generally speaking, a multilayer damping laminate includes N damping layers, each of which independently has a glass transition temperature T g , where N is an integer greater than or equal to two. The N damping layers are configured such that the first damping layer is a damping layer that is in direct contact with the vibration substrate to dissipate vibration. Then, the damping layers located above the first damping layer are numbered in ascending order, wherein the glass transition temperature of each damping layer is lower than the glass transition temperature of the damping layer below it. Then the relationship between the glass transition temperatures of the damping layers of the multilayer damping laminate is described by an inequality:

In some embodiments, each of the damping layer also has internet modulus G o, is greater than the plateau modulus of the damping layer of the lower plateau modulus G o lines G o. Then the relationship between the platform modulus of each damping layer of the multilayer damping laminate is described by an inequality:

作為示例性實例，在一些實施例中，N=2。在此一構造中，當操作溫度接近第一玻璃轉變溫度Tg (1)時，底部黏著劑(層1)經過其玻璃化轉變。由於該阻尼層與振動基板直接接觸，因此該層可能經受剪切變形，從而允許振動能量耗散。此外，因為該阻尼層具有最低的平臺模量Go ，故其將經受最大的剪切變形。隨著層壓物之操作溫度接近第二玻璃轉變溫度Tg (2) (＜ Tg (1))，底部阻尼層進入其玻璃狀態且因此表現得像玻璃狀固體。因此，在接近Tg (2)之溫度下，當頂部阻尼層經過其玻璃化轉變時，底部阻尼層將充作振動基板厚度之無窮小的增量。由於底部阻尼層1在該溫度下係玻璃狀的，因此所有剪切應變將集中於頂部阻尼層上。以此方式，隨著多層阻尼層壓物之溫度從Tg (1)變為Tg (2)，阻尼從底部阻尼層按順序轉移至頂部阻尼層，藉此允許在更寬的溫度範圍內進行阻尼。總之，兩個層均圍繞其各自的玻璃轉變溫度充作阻尼層。As an illustrative example, in some embodiments, N = 2. In this configuration, when the operating temperature approaches the first glass transition temperature T g (1), the bottom adhesive (layer 1) undergoes its glass transition. Since the damping layer is in direct contact with the vibration substrate, this layer may undergo shear deformation, allowing vibration energy to be dissipated. In addition, because the damping layer has the lowest platform modulus Go , it will experience the largest shear deformation. As the operating temperature of the laminate approaches the second glass transition temperature T g (2) (<T g (1)), the bottom damping layer enters its glass state and therefore behaves like a glassy solid. Therefore, at a temperature near T g (2), when the top damping layer undergoes its glass transition, the bottom damping layer will serve as an infinitesimal increase in the thickness of the vibration substrate. Since the bottom damping layer 1 is glassy at this temperature, all shear strains will be concentrated on the top damping layer. In this way, as the temperature of the multilayer damping laminate changes from T g (1) to T g (2), the damping is sequentially transferred from the bottom damping layer to the top damping layer, thereby allowing a wider temperature range Perform damping. In summary, both layers act as damping layers around their respective glass transition temperatures.

本發明亦關於包括基礎基板及如上所述之多層阻尼層壓物之系統。基礎基板可(例如)為車輛、器具或電子裝置之表面。在一些實施例中，車輛包括減振片。在一些實施例中，車輛為汽車。The invention also relates to a system comprising a base substrate and a multilayer damping laminate as described above. The base substrate may be, for example, a surface of a vehicle, an appliance, or an electronic device. In some embodiments, the vehicle includes a vibration damper. In some embodiments, the vehicle is a car.

涵蓋以下實施例。涵蓋特徵及實施例之所有組合。The following examples are covered. All combinations of features and embodiments are covered.

實施例1：一種多層阻尼層壓物，該層壓物包括：第一阻尼層，其具有第一玻璃轉變溫度及第一阻尼層厚度(H1 )；第二阻尼層，其具有第二玻璃轉變溫度及第二阻尼層厚度(H2 )；內部拘束層，其之至少一部分設置在第一阻尼層與第二阻尼層之間；及外部拘束層，其中該第二阻尼層之至少一部分設置在內部拘束層與外部拘束層之間，其中該層壓物之阻尼層具有從第一阻尼層開始遞減之玻璃轉變溫度分佈，且其中該多層阻尼層壓物之在200Hz下之複合損耗因子大於0.05。Embodiment 1: A multilayer damping laminate including: a first damping layer having a first glass transition temperature and a first damping layer thickness (H 1 ); a second damping layer having a second glass Transition temperature and thickness of the second damping layer (H 2 ); an internal restraint layer, at least a part of which is disposed between the first damping layer and the second damping layer; and an external restraint layer, wherein at least a part of the second damping layer is provided Between the internal restraint layer and the external restraint layer, the damping layer of the laminate has a glass transition temperature distribution that decreases from the first damping layer, and wherein the multilayer loss laminate has a composite loss factor at 200 Hz greater than 0.05.

實施例2：如實施例1之實施例，其中復合損耗因子係大於0.1。Embodiment 2: The embodiment of Embodiment 1, wherein the composite loss factor is greater than 0.1.

實施例3：如實施例3之實施例，其中在至少30℃之溫度範圍內，復合損耗因子係大於0.05。Embodiment 3: The embodiment of Embodiment 3, wherein the compound loss factor is greater than 0.05 in a temperature range of at least 30 ° C.

實施例4：如實施例1至3中任一實施例之實施例，其中第一玻璃轉變溫度與第二玻璃轉變溫度之差異係在(-3(H1 /H2 )2 +15)℃至(15(H1 /H2 )2 +20)℃之範圍內。Embodiment 4: The embodiment of any one of embodiments 1 to 3, wherein the difference between the first glass transition temperature and the second glass transition temperature is (-3 (H 1 / H 2 ) 2 +15) ° C To (15 (H 1 / H 2 ) 2 +20) ° C.

實施例5：如實施例1至4中任一實施例之實施例，其中第一玻璃轉變溫度係比第二玻璃轉變溫度高至少5℃。Embodiment 5: The embodiment of any one of embodiments 1 to 4, wherein the first glass transition temperature is at least 5 ° C higher than the second glass transition temperature.

實施例6：如實施例1至5中任一實施例之實施例，其中第一玻璃轉變溫度與第二玻璃轉變溫度之差異係在5℃至35℃之範圍內。Embodiment 6: The embodiment of any one of embodiments 1 to 5, wherein the difference between the first glass transition temperature and the second glass transition temperature is in the range of 5 ° C to 35 ° C.

實施例7：如實施例1至6中任一實施例之實施例，其中第一玻璃轉變溫度係在-60℃至100℃之範圍內。Embodiment 7: The embodiment of any one of embodiments 1 to 6, wherein the first glass transition temperature is in a range of -60 ° C to 100 ° C.

實施例8：如實施例1至7中任一實施例之實施例，其中第二玻璃轉變溫度係在-60℃至100℃之範圍內。Embodiment 8: The embodiment of any one of embodiments 1 to 7, wherein the second glass transition temperature is in a range of -60 ° C to 100 ° C.

實施例9：如實施例1至8中任一實施例之實施例，其中第一阻尼層具有第一平臺模量，其中第二阻尼層具有第二平臺模量，且其中層壓物之阻尼層具有從第一阻尼層開始遞增之平臺模量分佈。Embodiment 9: The embodiment of any one of embodiments 1 to 8, wherein the first damping layer has a first platform modulus, wherein the second damping layer has a second platform modulus, and wherein the damping of the laminate is The layer has a platform modulus distribution increasing from the first damping layer.

實施例10：如實施例9之實施例，其中第二平臺模量與第一平臺模量之比率係在1至(10(H1 /H2 )1.25 +10)之範圍內。Embodiment 10: The embodiment of embodiment 9, wherein the ratio of the second platform modulus to the first platform modulus is in the range of 1 to (10 (H 1 / H 2 ) 1.25 +10).

實施例11：如實施例1至10中任一實施例之實施例，其中第一阻尼層具有大於((10-10 /H1 2.5 )+0.25)之第一黏彈性損耗因子，且其中第二阻尼層具有大於((10-10 /H2 2.5 )+0.25)之第二黏彈性損耗因子，其中H1 及H2 之單位分別為米。Embodiment 11: The embodiment of any one of embodiments 1 to 10, wherein the first damping layer has a first viscoelastic loss factor greater than ((10 -10 / H 1 2.5 ) +0.25), and wherein the first The two damping layers have a second viscoelastic loss factor greater than ((10 -10 / H 2 2.5 ) +0.25), where the units of H 1 and H 2 are meters.

實施例12：如實施例11之實施例，其中若第一玻璃轉變溫度與第二玻璃轉變溫度之差異係小於20℃，則第一黏彈性損耗因子與第二黏彈性損耗因子之差異係在0.2至1.5之範圍內，且其中若第一玻璃轉變溫度與第二玻璃轉變溫度之差異係大於20℃，則第一黏彈性損耗因子與第二黏彈性損耗因子之差異係在0.2至3之範圍內。Embodiment 12: As in the embodiment of embodiment 11, if the difference between the first glass transition temperature and the second glass transition temperature is less than 20 ° C, the difference between the first viscoelastic loss factor and the second viscoelastic loss factor is between In the range of 0.2 to 1.5, and if the difference between the first glass transition temperature and the second glass transition temperature is greater than 20 ° C, the difference between the first viscoelastic loss factor and the second viscoelastic loss factor is between 0.2 and 3. Within range.

實施例13：如實施例1至12中任一實施例之實施例，其中第一阻尼層包含第一黏彈性阻尼材料及第二阻尼層包含第二黏彈性阻尼材料。Embodiment 13: The embodiment of any one of embodiments 1 to 12, wherein the first damping layer includes a first viscoelastic damping material and the second damping layer includes a second viscoelastic damping material.

實施例14：如實施例1至13中任一實施例之實施例，其中內部拘束層及外部拘束層各自獨立地包含金屬。Embodiment 14: The embodiment of any one of embodiments 1 to 13, wherein the inner restraint layer and the outer restraint layer each independently include a metal.

實施例15：如實施例1至14中任一實施例之實施例，其中內部拘束層及外部拘束層各自獨立地為金屬箔片。Embodiment 15: The embodiment of any one of embodiments 1 to 14, wherein the inner restraint layer and the outer restraint layer are each independently a metal foil.

實施例16：如實施例1至15中任一實施例之實施例，其中第一阻尼層厚度係在0.1密耳至200密耳之範圍內。Embodiment 16: The embodiment of any one of embodiments 1 to 15, wherein the thickness of the first damping layer is in the range of 0.1 mil to 200 mil.

實施例17：如實施例1至16中任一實施例之實施例，其中第二阻尼厚度係在0.1密耳至200密耳之範圍內。Embodiment 17: The embodiment of any one of embodiments 1 to 16, wherein the second damping thickness is in the range of 0.1 mil to 200 mil.

實施例18：如實施例1至17中任一實施例之實施例，其中內部拘束層及外部拘束層各自獨立地具有在0.2密耳至120密耳之範圍內的厚度。Embodiment 18: The embodiment of any one of embodiments 1 to 17, wherein the inner restraint layer and the outer restraint layer each independently have a thickness in a range of 0.2 mils to 120 mils.

實施例19：如實施例1至17中任一實施例之實施例，其中內部拘束層及外部拘束層各自獨立地具有在2密耳至50密耳範圍內之厚度。Embodiment 19: The embodiment of any one of embodiments 1 to 17, wherein the inner restraint layer and the outer restraint layer each independently have a thickness in a range of 2 mils to 50 mils.

實施例20：如實施例1至19中任一實施例之實施例，其進一步包括：連接至與第二阻尼層相對之第一阻尼層之襯墊層。Embodiment 20: The embodiment of any one of embodiments 1 to 19, further comprising: a cushion layer connected to the first damping layer opposite to the second damping layer.

實施例21：一種多層阻尼層壓物，其包括：N個阻尼層，其中N為大於或等於2之整數，其中每個阻尼層之至少一部分係與其他阻尼層共同延伸，且其中每個阻尼層獨立地具有玻璃轉變溫度(Tg )，其中Tg (N) ＜ Tg (N-1) ＜ Tg (N-2) ＜ … ＜ Tg (1)；N-1個內部拘束層，其中每一第M個內部拘束層之至少一部分設置在第M個阻尼層與第(M + 1)個阻尼層之間，其中M為1至N-1之整數；及外部拘束層，其中第N個阻尼層之至少一部分設置在第(N-1)個拘束層與外部拘束層之間。Embodiment 21: A multilayer damping laminate, comprising: N damping layers, where N is an integer greater than or equal to 2, wherein at least a portion of each damping layer is coextensive with other damping layers, and wherein each damping The layers independently have a glass transition temperature (T g ), where T g (N) <T g (N-1) <T g (N-2) <… <T g (1); N-1 internal restraint layers , At least a portion of each of the Mth internal restraint layer is disposed between the Mth damping layer and the (M + 1) th damping layer, where M is an integer from 1 to N-1; and the external restraint layer, wherein At least a part of the Nth damping layer is disposed between the (N-1) th restraint layer and the outer restraint layer.

實施例22：如實施例21之實施例，其中每個阻尼層獨立地具有平臺模量(Go )，且其中Go (N) ＞ Go (N-1) ＞ Go (N-2) ＞ … ＞ Go (1)。Embodiment 22: The embodiment of embodiment 21, wherein each damping layer independently has a platform modulus (G o ), and wherein G o (N)> G o (N-1)> G o (N-2 )…… ＞ G o (1).

實施例23：一種系統，其包括：基礎基板；及如實施例1至22中任一實施例之實施例多層阻尼層壓物，其中第一阻尼層係連接到基礎基板。Embodiment 23: A system including: a base substrate; and the multilayer damping laminate of the embodiment of any one of embodiments 1 to 22, wherein the first damping layer is connected to the base substrate.

實施例24：一種降低基礎基板振動之方法，該方法包括：提供經受振動之基礎基板；及將如實施例1至22中任一實施例之實施例多層阻尼層壓物之第一阻尼層連接至基礎基板，藉此減小基礎結構之振動。Embodiment 24: A method for reducing vibration of a base substrate, the method comprising: providing a base substrate subjected to vibration; and connecting a first damping layer of the multilayer damping laminate of the embodiment of any one of embodiments 1 to 22 To the base substrate, thereby reducing the vibration of the base structure.

實施例25：如實施例24之一個實施例，其進一步包括：隨著多層阻尼層壓物之溫度在關注頻率下測定時從第一玻璃轉變溫度變為第二玻璃轉變溫度，最大剪切應變之位置從第一阻尼層移位至第二阻尼層。Embodiment 25: As an embodiment of Embodiment 24, it further comprises: as the temperature of the multilayer damping laminate is measured at the frequency of interest, from the first glass transition temperature to the second glass transition temperature, the maximum shear strain The position is shifted from the first damping layer to the second damping layer.

實施例26：如實施例24或25之一個實施例，其中基礎結構之振動在連續的溫度及頻率範圍內消散。Embodiment 26: An embodiment of Embodiment 24 or 25, wherein the vibration of the basic structure is dissipated in a continuous temperature and frequency range.

鑑於以下非限制性實例，將更好地理解本發明。
實例 The invention will be better understood in view of the following non-limiting examples.
Examples

具有顯示於下表1中之流變性質之五種不同黏彈性阻尼材料係用於構造不同示例性多層阻尼層壓物。表1中之材料包括丙烯酸共聚物材料A、橡膠嵌段共聚物材料B、增黏丙烯酸共聚物材料C、丙烯酸共聚物材料D及作為材料E之增黏型材料D。藉由振盪剪切流變學，在0.1%之應用應變及10弧度/秒之頻率下，使用由TA Instruments (New Castle，DE)製造的DHR-2流變儀，測定每種材料之性質。每當需要時，使用時間-溫度疊加將材料特性適當地移位至應用之頻率範圍，以與設計規則相關聯。tan(δ)之最大值為在玻璃轉變溫度下之tan(δ)值。將平臺模量作為超過玻璃轉變溫度的該溫度下之儲積模量值，其中tan(δ)首先達到局部最小值。
Five different viscoelastic damping materials with the rheological properties shown in Table 1 below are used to construct different exemplary multilayer damping laminates. The materials in Table 1 include acrylic copolymer material A, rubber block copolymer material B, tackifying acrylic copolymer material C, acrylic copolymer material D, and tackifying material D as material E. The properties of each material were measured by oscillating shear rheology at a applied strain of 0.1% and a frequency of 10 radians per second using a DHR-2 rheometer manufactured by TA Instruments (New Castle, DE). Whenever needed, use time-temperature superposition to properly shift material properties to the frequency range of the application to correlate with design rules. The maximum value of tan (δ) is the value of tan (δ) at the glass transition temperature. The platform modulus is taken as the value of the storage modulus at the temperature exceeding the glass transition temperature, where tan (δ) first reaches a local minimum.

使用表1中的五種阻尼材料中之兩者組態八個不同多層阻尼層壓物中之各者。四個示例性層壓物包括如本文所論述之特定組態之阻尼材料層，而四個比較層壓物包括以相反順序組態之相同阻尼材料層。八個層壓物之性能特性呈現於下文所示的表2中。遵循SAE J1637 (2018)或ASTM E-756 (2018)在0.75-mm厚的不銹鋼樑上以200 Hz之參考頻率測定每個層壓物之複合損耗因子(CLF)。在表2中，「DL」係指阻尼層，及「CL」係指拘束層。表2中的包括兩個值之彼等單元首先列出底層之值且其次係頂層之值，其中「底部」阻尼材料係指第一阻尼層(即與振動基板直接接觸之材料)，及「頂部」阻尼材料係指第二阻尼層(即設置在內部及外部拘束層之間的材料)。就CLF ≥ 0.05而言，測定CLF之寬度，即阻尼溫度範圍。



Each of the eight different multilayer damping laminates was configured using two of the five damping materials in Table 1. Four exemplary laminates include layers of damping material in a particular configuration as discussed herein, while four comparative laminates include the same layer of damping material configured in reverse order. The performance characteristics of the eight laminates are presented in Table 2 shown below. The composite loss factor (CLF) of each laminate was determined in accordance with SAE J1637 (2018) or ASTM E-756 (2018) on a 0.75-mm thick stainless steel beam at a reference frequency of 200 Hz. In Table 2, "DL" refers to the damping layer, and "CL" refers to the restraint layer. The units in Table 2 that include two values first list the values of the bottom layer and secondly the values of the top layer, where the "bottom" damping material refers to the first damping layer (that is, the material in direct contact with the vibration substrate), and " The "top" damping material refers to the second damping layer (ie, the material disposed between the inner and outer restraint layers). For CLF ≥ 0.05, determine the width of CLF, which is the damping temperature range.



表2之實例1為使用各5密耳的表1材料A及材料B之多層阻尼層壓物。當如本發明中所述組態此等阻尼材料時，亦即，具有較低平臺模量之較高Tg 材料經層化作為底部阻尼材料，及具有較高平臺模量之較低Tg 材料經層化作為頂部阻尼材料，驚人地觀測到CLF寬度增加25%及峰值CLF增加30%(與比較例A相比)。相反地，比較例A係以材料B作為底部阻尼層及以材料B作為頂部阻尼材料而建構，因此並不具有如本文所述之組態。此外，雖然兩種順序均導致具有相同線密度之阻尼層壓物，但在底部具有材料A而在頂部具有材料B之層壓物證實阻尼效率增加50%。Example 1 of Table 2 is a multilayer damping laminate using material A and material B of Table 1 of 5 mils each. When these damping materials are configured as described in the present invention, that is, a higher T g material with a lower platform modulus is layered as a bottom damping material, and a lower T g with a higher platform modulus The material was layered as a top damping material, and a 25% increase in CLF width and a 30% increase in peak CLF were surprisingly observed (compared to Comparative Example A). In contrast, Comparative Example A was constructed with material B as the bottom damping layer and material B as the top damping material, and therefore did not have the configuration as described herein. In addition, although both sequences resulted in a damping laminate with the same linear density, a laminate with material A at the bottom and material B at the top confirmed a 50% increase in damping efficiency.

表2之實例2為使用各5密耳的表1材料B及材料C之多層阻尼層壓物。當如本發明中所述組態此等阻尼材料時，亦即，具有較低平臺模量之較高Tg 材料經層化作為底部阻尼材料，及具有較高平臺模量之較低Tg 材料經層化作為頂部阻尼材料，觀測到CLF寬度增加50%及峰值CLF的可忽略的減小(與比較例B相比)。相反地，比較例B係以材料B作為底部阻尼層及以材料C作為頂部阻尼層而建構，因此並不具有如本文所述之組態。使用表1之平臺模量值，可以看出，以材料C作為底部阻尼層及以材料B作為頂部阻尼層之實例2之平臺模量比率G0,2 /G0,1 為約為8，而就以材料A作為底部阻尼層及以材料B作為頂部阻尼層之實施例1而言，平臺模量比率為約4。因此，雖然材料A及C具有相似的流變材料性質，但實例2之平臺模量比率之較高值允許明顯更高之CLF寬度。Example 2 of Table 2 is a multilayer damping laminate using material 5 and material C of Table 1 each of 5 mils. When these damping materials are configured as described in the present invention, that is, a higher T g material with a lower platform modulus is layered as a bottom damping material, and a lower T g with a higher platform modulus The material was layered as a top damping material, and a 50% increase in CLF width and a negligible decrease in peak CLF were observed (compared to Comparative Example B). In contrast, Comparative Example B was constructed with material B as the bottom damping layer and material C as the top damping layer, and therefore did not have the configuration as described herein. Using the platform modulus values in Table 1, it can be seen that the platform modulus ratio G 0,2 / G 0,1 of Example 2 with material C as the bottom damping layer and material B as the top damping layer is about 8, For Example 1 with material A as the bottom damping layer and material B as the top damping layer, the platform modulus ratio is about 4. Therefore, although materials A and C have similar rheological material properties, the higher value of the platform modulus ratio of Example 2 allows a significantly higher CLF width.

表2之實例3為使用各5密耳的表1材料C及材料D之多層阻尼層壓物。當如本發明中所述組態此等阻尼材料時，亦即，具有較低平臺模量之較高Tg 材料經層化作為底部阻尼材料，及具有較高平臺模量之較低Tg 材料經層化作為頂部阻尼材料，觀測到CLF寬度增加20%及峰值CLF的可忽略的減小(與比較例C相比)。相反地，比較例C係以材料D作為底部阻尼層及以材料C作為頂部阻尼層而建構，因此並不具有如本文所述之組態。遵循差示性流變學該等阻尼層之排序導致阻尼效率提高。亦應注意到，儘管材料C及材料D之玻璃轉變溫度之差異相對較大(33℃)，但藉由確保峰值tan(δ)差異及平臺模量比率在以上許多實施例中所述之範圍內，獲得具有極寬阻尼溫度範圍之多層阻尼層壓物，而沒有增加處理的額外重量。在許多實施例中，多層阻尼層壓物可設計成為其所欲應用提供輕質結構。Example 3 of Table 2 is a multilayer damping laminate using materials C and D of Table 1 each of 5 mils. When these damping materials are configured as described in the present invention, that is, a higher T g material with a lower platform modulus is layered as a bottom damping material, and a lower T g with a higher platform modulus The material was layered as a top damping material, and a 20% increase in CLF width and a negligible decrease in peak CLF were observed (compared to Comparative Example C). In contrast, Comparative Example C was constructed with material D as the bottom damping layer and material C as the top damping layer, and therefore does not have the configuration as described herein. The ordering of these damping layers following differential rheology leads to an increase in damping efficiency. It should also be noted that although the difference in glass transition temperature between materials C and D is relatively large (33 ° C), by ensuring that the peak tan (δ) difference and the platform modulus ratio are in the ranges described in many of the above examples In this way, a multilayer damping laminate having an extremely wide damping temperature range is obtained without adding extra weight to the process. In many embodiments, the multilayer damping laminate can be designed to provide a lightweight structure for its intended application.

涉及不同黏彈性阻尼材料拓寬阻尼曲線寬度之習知方法描述在底層中使用在0℃或高於0℃時出現在200 Hz下之峰值阻尼之「高溫」材料及在頂層中使用在0℃或低於0℃時出現在200 Hz下之峰值阻尼之「低溫」阻尼材料，並未進一步描述什麼構成較佳或可接受之「高溫」或「低溫」材料。若認為「高溫」阻尼材料為具有高玻璃轉變溫度之材料，及「低溫」阻尼材料為具有較低玻璃轉變溫度之材料，則期望在底部層化材料A及在頂部層化材料E(實例4)以產生顯著更寬之CLF曲線(與其中材料E在底部層化及材料A在頂部層化之組態(比較例D)相比)。然而，相反地，表2中之結果顯示，與比較例D相比，在底部具有材料A及在頂部具有材料E之層壓構造僅提供可忽略的增加的阻尼寬度。此外，與比較例D相比，實施例4構造亦產生減小的峰值CLF。該觀察結果可由於實例4 G0,2 /G0,1 平臺模量比率僅為0.2(其小於實例1至3之平臺模量比率)引起。此等結果證實藉由根據如上所述之平臺模量比率組態阻尼層，可在拓寬阻尼溫度區域中實現進一步的改進。The conventional method involving widening the damping curve width of different viscoelastic damping materials describes the use of "high temperature" materials with peak damping at 200 Hz at or above 0 ° C in the bottom layer and use of 0 ° C or A "low temperature" damping material with peak damping at 200 Hz below 0 ° C does not further describe what constitutes a better or acceptable "high temperature" or "low temperature" material. If a "high temperature" damping material is considered to be a material with a high glass transition temperature, and a "low temperature" damping material is to be a material with a lower glass transition temperature, it is desirable to layer material A on the bottom and material E on the top (Example 4 ) To produce a significantly wider CLF curve (compared to the configuration where material E is stratified at the bottom and material A is stratified at the top (Comparative Example D)). In contrast, however, the results in Table 2 show that, compared to Comparative Example D, the laminated structure with the material A at the bottom and the material E at the top only provided a negligibly increased damping width. In addition, compared with Comparative Example D, the structure of Example 4 also produced a reduced peak CLF. This observation can be caused by the fact that the G0,2 / G0,1 platform modulus ratio of Example 4 is only 0.2 (which is smaller than the platform modulus ratios of Examples 1 to 3). These results confirm that by configuring the damping layer according to the platform modulus ratio as described above, further improvements can be achieved in widening the damping temperature region.

雖然已詳細地描述所揭示，但熟習此項技術者將容易理解在本發明精神及範疇內之修改。鑑於前述論述、本技術中之相關知識及以上結合先前技術及具體實施方式所論述之參考文獻，其揭示內容均係以引用的方式併入本文。另外，應理解，本發明之態樣及下文及/或在隨附申請專利範圍中所述之各種實施例及各種特徵之部分可整體或部分地組合或互換。在各種實施例之前述描述中，參考另一實施例之彼等實施例可與熟習此項技術者將理解的其他實施例適當地組合。此外，一般技術者將明瞭，前述描述僅係例示性的，而非無意限制本發明。Although the disclosure has been described in detail, those skilled in the art will readily understand modifications that are within the spirit and scope of the invention. In view of the foregoing discussion, relevant knowledge in the technology, and the references discussed above in connection with the prior art and specific implementations, the disclosures are incorporated herein by reference. In addition, it should be understood that aspects of the present invention and various embodiments and various features described below and / or in the scope of the accompanying patent application may be combined or interchanged in whole or in part. In the foregoing description of the various embodiments, reference to another embodiment thereof may be appropriately combined with other embodiments that will be understood by those skilled in the art. In addition, those skilled in the art will appreciate that the foregoing description is exemplary only and is not intended to limit the present invention in any way.

Claims (28)

一種多層阻尼層壓物，其包括： 第一阻尼層，其具有第一玻璃轉變溫度及第一阻尼層厚度(H1 )； 第二阻尼層，其具有第二玻璃轉變溫度及第二阻尼層厚度(H2 )； 內部拘束層，其至少一部分係設置在該第一阻尼層與該第二阻尼層之間；及 外部拘束層，其中該第二阻尼層之至少一部分係設置在該內部拘束層與該外部拘束層之間，其中該層壓物之該等阻尼層具有從該第一阻尼層開始遞減之玻璃轉變溫度分佈，及其中該多層阻尼層壓物在200 Hz下具有大於約0.05之複合損耗因子。A multilayer damping laminate, comprising: a first damping layer having a first glass transition temperature and a first damping layer thickness (H 1 ); a second damping layer having a second glass transition temperature and a second damping layer Thickness (H 2 ); at least a portion of the inner restraint layer is disposed between the first damping layer and the second damping layer; and an outer restraint layer, wherein at least a portion of the second damping layer is provided at the inner restraint layer Between the layer and the outer restraint layer, wherein the damping layers of the laminate have a glass transition temperature distribution decreasing from the first damping layer, and wherein the multilayer damping laminate has a greater than about 0.05 at 200 Hz Complex loss factor. 如請求項1之多層阻尼層壓物，其中該複合損耗因子係大於約0.1。The multilayer damping laminate of claim 1, wherein the composite loss factor is greater than about 0.1. 如請求項1之多層阻尼層壓物，其中該複合損耗因子在至少30℃之溫度範圍內係大於約0.05。The multilayer damping laminate of claim 1, wherein the composite loss factor is greater than about 0.05 over a temperature range of at least 30 ° C. 如請求項1至3中任一項之多層阻尼層壓物，其中該第一玻璃轉變溫度與該第二玻璃轉變溫度之差異係在(-3(H1 /H2 )2 +15)℃至(15(H1 /H2 )2 +20)℃之範圍內。The multilayer damping laminate of any one of claims 1 to 3, wherein a difference between the first glass transition temperature and the second glass transition temperature is (-3 (H 1 / H 2 ) 2 +15) ° C To (15 (H 1 / H 2 ) 2 +20) ° C. 如請求項1至3中任一項之多層阻尼層壓物，其中該第一玻璃轉變溫度係比該第二玻璃轉變溫度高至少5℃。The multilayer damping laminate of any one of claims 1 to 3, wherein the first glass transition temperature is at least 5 ° C higher than the second glass transition temperature. 如請求項1至3中任一項之多層阻尼層壓物，其中該第一玻璃轉變溫度與該第二玻璃轉變溫度之差異係在約5℃至約35℃之範圍內。The multilayer damping laminate of any one of claims 1 to 3, wherein a difference between the first glass transition temperature and the second glass transition temperature is in a range of about 5 ° C to about 35 ° C. 如請求項1至3中任一項之多層阻尼層壓物，其中該第一玻璃轉變溫度係在約-60℃至約100℃之範圍內。The multilayer damping laminate of any one of claims 1 to 3, wherein the first glass transition temperature is in a range of about -60 ° C to about 100 ° C. 如請求項1至3中任一項之多層阻尼層壓物，其中該第二玻璃轉變溫度係在約-60℃至約100℃之範圍內。The multilayer damping laminate of any one of claims 1 to 3, wherein the second glass transition temperature is in a range of about -60 ° C to about 100 ° C. 如請求項1至3中任一項之多層阻尼層壓物，其中該第一阻尼層具有第一平臺模量，其中該第二阻尼層具有第二平臺模量，及其中該層壓物之該等阻尼層具有從該第一阻尼層開始遞增之平臺模量分佈。The multilayer damping laminate of any one of claims 1 to 3, wherein the first damping layer has a first platform modulus, wherein the second damping layer has a second platform modulus, and The damping layers have a platform modulus distribution that increases from the first damping layer. 如請求項9之多層阻尼層壓物，其中該第二平臺模量與該第一平臺模量之比率係在1至(10(H1 /H2 )1.25 +10)之範圍內。The multilayer damping laminate of claim 9, wherein the ratio of the second platform modulus to the first platform modulus is in the range of 1 to (10 (H 1 / H 2 ) 1.25 +10). 如請求項1至3中任一項之多層阻尼層壓物，其中該第一阻尼層具有大於((10-10 /H1 2.5 )+0.25)之第一黏彈性損耗因子，及其中該第二阻尼層具有大於((10-10 /H2 2.5 )+0.25)之第二黏彈性損耗因子，其中H1 及H2 之單位分別為米。The multilayer damping laminate of any one of claims 1 to 3, wherein the first damping layer has a first viscoelastic loss factor greater than ((10 -10 / H 1 2.5 ) +0.25), and the first The two damping layers have a second viscoelastic loss factor greater than ((10 -10 / H 2 2.5 ) +0.25), where the units of H 1 and H 2 are meters. 如請求項11之多層阻尼層壓物，其中若該第一玻璃轉變溫度與該第二玻璃轉變溫度之差異係小於約20℃，則該第一黏彈性損耗因子與該第二黏彈性損耗因子之差異係在0.2至1.5之範圍內，及其中若該第一玻璃轉變溫度與該第二玻璃轉變溫度之差異係大於約20℃，則該第一黏彈性損耗因子與該第二黏彈性損耗因子之差異係在0.2至3之範圍內。The multilayer damping laminate of claim 11, wherein if the difference between the first glass transition temperature and the second glass transition temperature is less than about 20 ° C, the first viscoelastic loss factor and the second viscoelastic loss factor The difference is in the range of 0.2 to 1.5, and if the difference between the first glass transition temperature and the second glass transition temperature is greater than about 20 ° C, the first viscoelastic loss factor and the second viscoelastic loss The difference in factors is in the range of 0.2 to 3. 如請求項1至3中任一項之多層阻尼層壓物，其中該第一阻尼層包含第一黏彈性阻尼材料及該第二阻尼層包含第二黏彈性阻尼材料。The multilayer damping laminate of any one of claims 1 to 3, wherein the first damping layer comprises a first viscoelastic damping material and the second damping layer comprises a second viscoelastic damping material. 如請求項13之多層阻尼層壓物，其中該第一黏彈性阻尼材料及該第二黏彈性阻尼材料中之至少一者包含黏著劑。The multilayer damping laminate of claim 13, wherein at least one of the first viscoelastic damping material and the second viscoelastic damping material comprises an adhesive. 如請求項14之多層阻尼層壓物，其中該黏著劑為壓敏黏著劑。The multilayer damping laminate of claim 14, wherein the adhesive is a pressure-sensitive adhesive. 如請求項1至3中任一項之多層阻尼層壓物，其中該內部拘束層及該外部拘束層各自獨立地包含金屬。The multilayer damping laminate of any one of claims 1 to 3, wherein the inner restraint layer and the outer restraint layer each independently comprise a metal. 如請求項1至3中任一項之多層阻尼層壓物，其中該內部拘束層及該外部拘束層各自獨立地為金屬箔片。The multilayer damping laminate of any one of claims 1 to 3, wherein the inner restraint layer and the outer restraint layer are each independently a metal foil. 如請求項1至3中任一項之多層阻尼層壓物，其中該第一阻尼層厚度係在約0.1密耳至約200密耳之範圍內。The multilayer damping laminate of any one of claims 1 to 3, wherein the thickness of the first damping layer is in a range of about 0.1 mils to about 200 mils. 如請求項1至3中任一項之多層阻尼層壓物，其中該第二阻尼厚度係在約0.1密耳至約200密耳之範圍內。The multilayer damping laminate of any one of claims 1 to 3, wherein the second damping thickness is in a range of about 0.1 mils to about 200 mils. 如請求項1至3中任一項之多層阻尼層壓物，其中該內部拘束層及該外部拘束層之厚度各自獨立地在約0.2密耳至約120密耳之範圍內。The multilayer damping laminate of any one of claims 1 to 3, wherein the thickness of the inner restraint layer and the outer restraint layer are each independently in a range of about 0.2 mils to about 120 mils. 如請求項1至3中任一項之多層阻尼層壓物，其中該內部拘束層及該外部拘束層之厚度各自獨立地在約2密耳至約50密耳之範圍內。The multilayer damping laminate of any one of claims 1 to 3, wherein the thickness of the inner restraint layer and the outer restraint layer are each independently in a range of about 2 mils to about 50 mils. 如請求項1至3中任一項之多層阻尼層壓物，其進一步包括： 襯墊層，其係連接至與第二阻尼層相對之第一阻尼層。The multilayer damping laminate of any one of claims 1 to 3, further comprising: The cushion layer is connected to the first damping layer opposite to the second damping layer. 一種多層阻尼層壓物，其包括： N個阻尼層，其中N為大於或等於2之整數，其中每個阻尼層之至少一部分係與其他阻尼層共同延伸，且其中每個阻尼層獨立地具有玻璃轉變溫度(Tg )，其中Tg (N) ＜ Tg (N-1) ＜ Tg (N-2) ＜ … ＜ Tg (1)； N-1個內部拘束層，其中每一第M個內部拘束層之至少一部分係設置在第M個阻尼層與第(M+1)個阻尼層之間，其中M為1到N-1之整數；及 外部拘束層，其中第N個阻尼層之至少一部分係設置在第(N-1)個拘束層與該外部拘束層之間。A multilayer damping laminate comprising: N damping layers, where N is an integer greater than or equal to 2, wherein at least a portion of each damping layer is coextensive with other damping layers, and wherein each damping layer independently has Glass transition temperature (T g ), where T g (N) <T g (N-1) <T g (N-2) <... <T g (1); N-1 internal restraint layers, each of which At least a part of the Mth inner restraint layer is disposed between the Mth damping layer and the (M + 1) th damping layer, where M is an integer from 1 to N-1; and the outer restraint layer, where the Nth At least a part of the damping layer is disposed between the (N-1) th restraint layer and the outer restraint layer. 如請求項23之多層阻尼層壓物，其中每個阻尼層獨立地具有平臺模量(Go )，且其中Go (N) ＞ Go (N-1) ＞ Go (N-2) ＞ … ＞ Go (1)。The multilayer damping laminate of claim 23, wherein each damping layer independently has a platform modulus (G o ), and wherein G o (N)> G o (N-1)> G o (N-2) ＞… G o (1). 一種系統，其包括： 基礎基板；及 如請求項1至24中任一項之多層阻尼層壓物，其中該第一阻尼層係連接至該基礎基板。A system including: Base substrate; and The multilayer damping laminate of any one of claims 1 to 24, wherein the first damping layer is connected to the base substrate. 一種減少基礎基板之振動之方法，該方法包括： 提供經受振動之基礎基板；及 將如請求項1至24中任一項之多層阻尼層壓物之第一阻尼層連接至該基礎基板，藉此減小基礎結構之振動。A method for reducing vibration of a base substrate, the method includes: Providing a base substrate subjected to vibration; and The first damping layer of the multilayer damping laminate according to any one of claims 1 to 24 is connected to the base substrate, thereby reducing the vibration of the base structure. 如請求項26之方法，其進一步包括： 隨著多層阻尼層壓物之溫度在關注頻率下測定時從第一玻璃轉變溫度變為第二玻璃轉變溫度，最大剪切應變之位置從第一阻尼層移位至第二阻尼層。The method of claim 26, further comprising: As the temperature of the multilayer damping laminate changes from the first glass transition temperature to the second glass transition temperature when measured at the frequency of interest, the position of the maximum shear strain is shifted from the first damping layer to the second damping layer. 如請求項26或27之方法，其中該基礎基板之振動係在連續之溫度及頻率範圍內消散。The method of claim 26 or 27, wherein the vibration of the base substrate is dissipated in a continuous temperature and frequency range.
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