TW201931967A

TW201931967A - Laminated body and method for manufacturing same

Info

Publication number: TW201931967A
Application number: TW107146872A
Authority: TW
Inventors: 山根勇介; 品田詠逸; 和田大; 篠原翔
Original assignee: 日商日立化成股份有限公司
Priority date: 2017-12-27
Filing date: 2018-12-25
Publication date: 2019-08-01
Also published as: JP7057792B2; JPWO2019130496A1; TWI820073B; WO2019130496A1

Abstract

Disclosed is a method for manufacturing a laminated body 100 having a laminated structure wherein an insulating member 30 is disposed between a substrate 10 and a substrate 20. The method is provided with a step for: forming, in the substrate 10, a through hole 12a penetrating the substrate 10; forming, in the substrate 20, a through hole 22a penetrating the substrate 20; forming, in the insulating member 30, a through hole 32a, in a state wherein the insulating member 30 is disposed between the substrate 10 and the substrate 20; and forming, with the through hole 12a, the through hole 22a, and the through hole 32a, a through hole 100a penetrating the laminated body 100. The method is provided for the purpose of manufacturing the substrate 100 wherein: the substrate 10 has a conductor section 14a disposed on the inner wall of the through hole 12a; the substrate 20 has a conductor section 24a disposed on the inner wall of the through hole 22a; a surface electrode 16a is disposed on a substrate 10 main surface 10a facing the substrate 20, said surface electrode being at a position different from the position where the through hole 12a is formed; a surface electrode 26a is disposed on a substrate 20 main surface 20a facing the substrate 10, said surface electrode being at a position different from the position where the through hole 22a is formed; and a through hole 12a end section on the reverse side of the substrate 20, and a through hole 22a end section on the reverse side of the substrate 10 are electrically connected to each other via the conductor section 14a, the surface electrode 16a, the surface electrode 26a, and the conductor section 24a.

Description

積層體及其製造方法Laminated body and method of manufacturing same

本發明是有關於一種積層體及其製造方法。The present invention relates to a laminate and a method of manufacturing the same.

多層配線板例如可藉由如下方式獲得，即：在將形成有電路的兩面覆銅積層板與絕緣性接著劑交替積層而使其一體化後，在需要連接的部位設置將多層配線板的整體在積層方向上予以貫通的貫通孔，進而藉由利用金屬鍍敷在貫通孔的內壁製作導體部，而設置將貫通孔的兩端部電性連接的貫通通孔（through-hole）。The multilayer wiring board can be obtained, for example, by alternately laminating and integrating the double-sided copper-clad laminate in which the circuit is formed and the insulating adhesive, and then providing the entire multilayer wiring board at a portion to be connected. A through hole penetrating in the lamination direction is further formed by forming a conductor portion on the inner wall of the through hole by metal plating, and a through hole is electrically connected to both end portions of the through hole.

貫通通孔跨及多層配線板的積層方向上的整體而形成，因此，在多層配線板的表面，為了避免與貫通通孔的電性連接，以避開貫通通孔的形成位置的方式配置電路圖案。因此，在貫通通孔結構中，對於提升配線密度而言存在限度。Since the through-hole is formed over the entire laminated direction of the multilayer wiring board, the circuit is disposed so as to avoid the formation position of the through-hole by avoiding electrical connection with the through-hole on the surface of the multilayer wiring board. pattern. Therefore, in the through via structure, there is a limit to the increase in wiring density.

多層配線板中所封裝的零件主要是表面封裝，所以用以連接零件與多層配線板的連接部年年狹小化。隨著多層配線板中所封裝的零件的高密度化，封裝件數亦逐漸增加，從而要求多層配線板的貫通通孔間距的狹小化、配線電路的層數的增加等。例如，已知有一種帶填隙式導孔（interstitial via hole）（IVH：非貫通通孔）的多層配線板，其設置有在設置將多層配線板整體在積層方向上予以貫通的貫通孔之後，藉由金屬鍍敷對貫通孔的內壁形成導體部而獲得的貫通通孔。此多層配線板與僅有貫通通孔的多層配線板相比，能夠進行小徑的開孔，從而容易應對窄間距化。The components packaged in the multilayer wiring board are mainly surface packages, so the connection portion for connecting the parts to the multilayer wiring board is narrowed year by year. As the number of components packaged in the multilayer wiring board is increased, the number of packages is gradually increased, and the pitch of the through-holes of the multilayer wiring board is required to be narrow, and the number of layers of the wiring circuit is increased. For example, a multilayer wiring board having an interstitial via hole (IVH: non-through via) is provided, which is provided after a through hole is provided which penetrates the entire multilayer wiring board in the lamination direction. A through-hole obtained by forming a conductor portion on the inner wall of the through hole by metal plating. This multilayer wiring board can perform opening of a small diameter as compared with a multilayer wiring board which has only a through-hole, and can easily cope with narrow pitch.

為了應對進一步的高密度化而開發了層間連接技術。例如，已知在配線板的表面形成增層（build up layer）後，對藉由雷射等而設置的非貫通孔的內壁進行鍍敷，視必要層數逐次堆積將非貫通孔的兩端部電性連接的結構的增層（build up）工法。進而，作為增層工法以外的層間連接技術，提出有不使用鍍敷，而使用導電性糊、各向異性導電材料等作為層間連接構件的多層配線板的製造技術。In order to cope with further high density, an inter-layer connection technique has been developed. For example, it is known that after forming a build up layer on the surface of the wiring board, the inner wall of the non-through hole provided by laser or the like is plated, and two non-through holes are successively stacked depending on the number of layers necessary. A build up method for the structure of the ends electrically connected. Further, as an interlayer connection technique other than the build-up method, a technique for manufacturing a multilayer wiring board using a conductive paste or an anisotropic conductive material as an interlayer connection member without using plating has been proposed.

例如，在下述專利文獻1中，揭示了將對薄型的預浸體中所設的孔之中填充有導電性糊的構件、電路基板等重合後，進行加熱·加壓而形成一枚的多層配線板的方法。For example, in the following Patent Document 1, it is disclosed that a member in which a conductive paste is filled in a hole provided in a thin prepreg, a circuit board, and the like are superposed, and then a plurality of layers are formed by heating and pressurizing. The method of the wiring board.

在下述專利文獻2中，揭示了一種多層配線板，其藉由如下方式而獲得，即：在藉由對電路板、銅箔等之上所形成的凸塊按壓絕緣材料，使凸塊自絕緣材料貫通而獲得的結構體之上，重合電路板、銅箔等，之後，藉由加熱·加壓進行積層以進行一體化。In the following Patent Document 2, a multilayer wiring board is disclosed which is obtained by insulating a bump by pressing an insulating material on a bump formed on a circuit board, a copper foil or the like. On the structure obtained by the material passing through, a circuit board, a copper foil, or the like is superposed, and then laminated by heating and pressurization to be integrated.

在下述專利文獻3中，揭示了在導體板上形成山形或大致圓錐狀的導電性凸塊後，對絕緣性預浸體基材進行加熱使其軟化並壓製貫插，藉此形成包括導電性凸塊的導孔（via）的方法。Patent Document 3 listed below discloses that after forming a mountain-shaped or substantially conical conductive bump on a conductor plate, the insulating prepreg base material is heated to be softened and pressed, thereby forming electrical conductivity. The method of the via of the bump.

在下述專利文獻4中，揭示了藉由在硬化的絕緣構件中所設的孔之中填充導電性糊，而對形成有貫通絕緣構件的厚度方向的導電性的導孔的多個構件進行積層來形成多層電路基板的方法。
[現有技術文獻]
[專利文獻]In the following Patent Document 4, it is disclosed that a plurality of members having conductive vias formed in a thickness direction penetrating the insulating member are laminated by filling a conductive paste in a hole provided in the cured insulating member. A method of forming a multilayer circuit substrate.
[Prior Art Literature]
[Patent Literature]

[專利文獻1]日本專利特開平11-87870號公報
[專利文獻2]日本專利特開平9-162553號公報
[專利文獻3]日本專利特開2013-110230號公報
[專利文獻4]日本專利特開2015-26689號公報[Patent Document 1] Japanese Patent Laid-Open No. Hei 11-87870
[Patent Document 2] Japanese Patent Laid-Open No. Hei 9-162553
[Patent Document 3] Japanese Patent Laid-Open Publication No. 2013-110230
[Patent Document 4] Japanese Patent Laid-Open No. 2015-26689

[發明所欲解決之課題]
且說，作為多層配線板所封裝的零件，可列舉在貫通孔（貫通通孔）內***並保持有銷的銷***型（壓入配合銷（press fit pin）型）的零件。為了使用銷***型的零件，需要貫通多層配線板中的多個基板的貫通孔。[Problems to be solved by the invention]
In addition, as a component packaged in the multilayer wiring board, a pin insertion type (press fit pin type) in which a pin is inserted and held in a through hole (through hole) is exemplified. In order to use a pin insertion type component, a through hole penetrating through a plurality of substrates in the multilayer wiring board is required.

雖然可在藉由對多個基板進行積層（層間連接）而獲得了多層配線板之後將貫通孔設置於多層配線板，但需要貫通多個基板，因此擔心多層配線板的製造步驟變長、多層配線板的製造成本變高等。因此，作為多層配線板而使用的積層體或作為為了獲得多層配線板而使用的積層體，要求有效率地獲得能夠封裝銷***型的零件的積層體。Although it is possible to provide a multilayer wiring board by laminating a plurality of substrates (interlayer connection), and to provide a through hole in the multilayer wiring board, it is necessary to penetrate a plurality of substrates. Therefore, it is feared that the manufacturing steps of the multilayer wiring board become long and multilayer. The manufacturing cost of the wiring board becomes high. Therefore, a laminated body used as a multilayer wiring board or a laminated body used for obtaining a multilayer wiring board is required to efficiently obtain a laminated body capable of encapsulating a pin-inserted type component.

本發明是鑒於所述情況而成，目的在於提供一種積層體的製造方法，其能夠有效率地獲得能夠封裝銷***型的零件的積層體。而且，本發明的目的在於提供一種能夠藉由所述製造方法而獲得的積層體。
[解決課題之手段]The present invention has been made in view of the above circumstances, and it is an object of the invention to provide a method for producing a laminated body which can efficiently obtain a laminated body capable of encapsulating a pin-inserted type component. Moreover, an object of the present invention is to provide a laminate which can be obtained by the above production method.
[Means for solving the problem]

本發明的積層體的製造方法是具有在第一基板與第二基板之間存在絕緣構件的積層結構的積層體的製造方法，所述積層體的製造方法包括：將貫通所述第一基板的第一貫通孔形成於所述第一基板，將貫通所述第二基板的第二貫通孔形成於所述第二基板，在將所述絕緣構件配置於所述第一基板與所述第二基板之間的狀態下，對所述絕緣構件形成貫通孔，藉由所述第一貫通孔、所述第二貫通孔及所述絕緣構件的所述貫通孔而形成貫通所述積層體的貫通孔的步驟，所述第一基板具有配置於所述第一貫通孔的內壁的第一導體部，所述第二基板具有配置於所述第二貫通孔的內壁的第二導體部，在所述第一基板中的與所述第二基板相向的第一主面中，在與所述第一貫通孔的形成位置不同的位置，配置有第一表面電極，在所述第二基板中的與所述第一基板相向的第二主面中，在與所述第二貫通孔的形成位置不同的位置，配置有第二表面電極，所述第一貫通孔中的與所述第二基板相反的一側的端部跟所述第二貫通孔中的與所述第一基板相反的一側的端部經由所述第一導體部、所述第一表面電極、所述第二表面電極及所述第二導體部而電性連接。The method for producing a laminated body according to the present invention is a method for producing a laminated body having a laminated structure in which an insulating member is present between a first substrate and a second substrate, the method for manufacturing the laminated body comprising: penetrating the first substrate a first through hole is formed in the first substrate, a second through hole penetrating the second substrate is formed on the second substrate, and the insulating member is disposed on the first substrate and the second substrate a through hole is formed in the insulating member in a state between the substrates, and the through hole penetrating through the laminated body is formed by the first through hole, the second through hole, and the through hole of the insulating member In the step of the hole, the first substrate has a first conductor portion disposed on an inner wall of the first through hole, and the second substrate has a second conductor portion disposed on an inner wall of the second through hole. a first surface electrode is disposed on the first main surface of the first substrate facing the second substrate at a position different from a position at which the first through hole is formed, and the second substrate is disposed on the second substrate In the opposite direction to the first substrate a second surface electrode is disposed at a position different from a position at which the second through hole is formed, and an end portion of the first through hole opposite to the second substrate An end of the second through hole opposite to the first substrate is electrically connected via the first conductor portion, the first surface electrode, the second surface electrode, and the second conductor portion Sexual connection.

根據本發明的積層體的製造方法，將貫通第一基板的第一貫通孔形成於第一基板，將貫通第二基板的第二貫通孔形成於第二基板，在將絕緣構件配置於第一基板與第二基板之間的狀態下，對絕緣構件形成貫通孔，藉由第一貫通孔、第二貫通孔及絕緣構件的貫通孔而形成貫通積層體的貫通孔。在此情況下，在進行形成貫通積層體的貫通孔的操作時，第一基板及第二基板預先形成有貫通孔，因此無需除了絕緣構件之外亦對第一基板及第二基板形成貫通孔。因此，能夠將積層體的製造步驟簡略化，並且可抑制積層體的製造成本變高。因此，根據本發明的積層體的製造方法，可有效率地獲得能夠封裝銷***型的零件的積層體。According to the method of manufacturing a laminated body of the present invention, the first through hole penetrating the first substrate is formed on the first substrate, the second through hole penetrating the second substrate is formed on the second substrate, and the insulating member is disposed on the first substrate. In a state between the substrate and the second substrate, a through hole is formed in the insulating member, and a through hole penetrating the laminated body is formed by the first through hole, the second through hole, and the through hole of the insulating member. In this case, when the through hole forming the through laminated body is formed, the first substrate and the second substrate are formed with through holes in advance, and therefore it is not necessary to form through holes for the first substrate and the second substrate in addition to the insulating member. . Therefore, the manufacturing steps of the laminated body can be simplified, and the manufacturing cost of the laminated body can be suppressed from becoming high. Therefore, according to the method for producing a laminated body of the present invention, it is possible to efficiently obtain a laminated body capable of encapsulating a pin-inserted type component.

且說，雖然可在藉由對多個基板進行積層（層間連接）而獲得了多層配線板之後將貫通孔設置於多層配線板，但若基板厚，則有難以利用小徑的鑽機（drill）進行加工（發生鑽機斷裂）之虞，並且有貫通孔的內壁所配置的導體部的鍍敷的均勻性（均鍍力（throwing power），例如，貫通孔的縱橫比超過25時的鍍敷的均勻性）下降之虞。另一方面，根據本發明的積層體的製造方法，即便在基板厚的情況下，亦可使用小徑的鑽機來形成貫通積層體的貫通孔。而且，即便在基板厚的情況下，亦因在積層多個基板之前已預先對基板形成有導體部，而無需考慮積層基板後的鍍敷的均勻性。根據該些，可容易地將孔小徑化，所以可增大形成於基板的貫通孔間的距離。在此情況下，信號線的增加等成為可能，並且亦容易進行信號線的引繞。In addition, although a multilayer wiring board can be obtained by laminating a plurality of substrates (interlayer connection), and the through holes are provided in the multilayer wiring board, if the substrate is thick, it is difficult to use a drill having a small diameter. The uniformity of the plating of the conductor portion disposed on the inner wall of the through hole (the throwing power), for example, the plating of the through hole when the aspect ratio exceeds 25 Uniformity). On the other hand, according to the method for producing a laminated body of the present invention, even when the substrate is thick, a through hole penetrating through the laminated body can be formed using a drill having a small diameter. Further, even when the substrate is thick, since the conductor portion is formed in advance on the substrate before the plurality of substrates are laminated, it is not necessary to consider the uniformity of plating after the laminated substrate. According to this, since the diameter of the hole can be easily reduced, the distance between the through holes formed in the substrate can be increased. In this case, an increase in signal lines and the like is possible, and it is also easy to guide the signal lines.

本發明的積層體的製造方法亦可為藉由雷射加工來形成所述絕緣構件的所述貫通孔的形態。本發明的積層體的製造方法亦可為藉由鑽孔（drill）加工來形成所述絕緣構件的所述貫通孔的形態。The method for producing a laminated body according to the present invention may be a form of forming the through hole of the insulating member by laser processing. The method for producing a laminated body according to the present invention may be a form of forming the through hole of the insulating member by drilling.

本發明的積層體具有在第一基板與第二基板之間存在絕緣構件的積層結構，其中，貫通所述第一基板的第一貫通孔、貫通所述第二基板的第二貫通孔及貫通所述絕緣構件的貫通孔構成貫通所述積層體的貫通孔，所述第一基板具有配置於所述第一貫通孔的內壁的第一導體部，所述第二基板具有配置於所述第二貫通孔的內壁的第二導體部，在所述第一基板中的與所述第二基板相向的第一主面中，在與所述第一貫通孔的形成位置不同的位置，配置有第一表面電極，在所述第二基板中的與所述第一基板相向的第二主面中，在與所述第二貫通孔的形成位置不同的位置，配置有第二表面電極，所述第一貫通孔中的與所述第二基板相反的一側的端部跟所述第二貫通孔中的與所述第一基板相反的一側的端部經由所述第一導體部、所述第一表面電極、所述第二表面電極及所述第二導體部而電性連接。The laminated body of the present invention has a laminated structure in which an insulating member is interposed between the first substrate and the second substrate, wherein the first through hole penetrating the first substrate, the second through hole penetrating the second substrate, and the through hole The through hole of the insulating member constitutes a through hole penetrating the laminated body, the first substrate has a first conductor portion disposed on an inner wall of the first through hole, and the second substrate is disposed in the a second conductor portion of the inner wall of the second through hole is located at a position different from a position at which the first through hole is formed in the first main surface of the first substrate facing the second substrate; a first surface electrode is disposed, and a second surface electrode is disposed at a position different from a position at which the second through hole is formed in a second main surface of the second substrate facing the first substrate An end of the first through hole opposite to the second substrate and an end of the second through hole opposite to the first substrate via the first conductor Portion, the first surface electrode, the second surface And the second conductor portion electrically connected.

所述第一表面電極與所述第二表面電極亦可藉由配置在所述第一表面電極與所述第二表面電極之間的導電構件而彼此電性連接。The first surface electrode and the second surface electrode may also be electrically connected to each other by a conductive member disposed between the first surface electrode and the second surface electrode.

本發明的積層體亦可為如下形態：進而將貫通所述第一基板的第三貫通孔形成於所述第一基板，所述第一基板進而具有配置於所述第三貫通孔的內壁的第三導體部，進而將貫通所述第二基板的第四貫通孔形成於所述第二基板，所述第二基板進而具有配置於所述第四貫通孔的內壁的第四導體部，在所述第一主面配置有第三表面電極，在所述第二主面配置有第四表面電極。In the laminated body of the present invention, the third through hole penetrating the first substrate may be formed on the first substrate, and the first substrate further includes an inner wall disposed on the third through hole. The third conductor portion further forms a fourth through hole penetrating the second substrate on the second substrate, and the second substrate further includes a fourth conductor portion disposed on an inner wall of the fourth through hole A third surface electrode is disposed on the first main surface, and a fourth surface electrode is disposed on the second main surface.

本發明的積層體亦可為如下形態：在所述第一基板、所述絕緣構件及所述第二基板的積層方向上彼此重疊的位置，形成有所述第三貫通孔及所述第四貫通孔，所述第三表面電極配置於所述第一主面中的所述第三貫通孔的形成位置，所述第四表面電極配置於所述第二主面中的所述第四貫通孔的形成位置。The laminated body of the present invention may be characterized in that the third through hole and the fourth portion are formed at positions overlapping each other in the stacking direction of the first substrate, the insulating member, and the second substrate. a through hole, the third surface electrode is disposed at a position where the third through hole is formed in the first main surface, and the fourth surface electrode is disposed in the fourth through hole in the second main surface The location where the holes are formed.

本發明的積層體亦可為如下形態：在所述第一基板、所述絕緣構件及所述第二基板的積層方向上彼此不重疊的位置，形成有所述第三貫通孔及所述第四貫通孔，所述第三表面電極配置於所述第一主面中的所述第三貫通孔的形成位置，所述第四表面電極配置於所述第二主面中的與所述第三表面電極相向的位置。In the laminated body of the present invention, the third through hole and the first portion may be formed at positions that do not overlap each other in a stacking direction of the first substrate, the insulating member, and the second substrate. a fourth through hole, wherein the third surface electrode is disposed at a position where the third through hole is formed in the first main surface, and the fourth surface electrode is disposed in the second main surface and the first surface The position at which the three surface electrodes face each other.

亦可為如下形態：所述第三表面電極與所述第四表面電極藉由配置在所述第三表面電極與所述第四表面電極之間的導電構件而彼此電性連接。The third surface electrode and the fourth surface electrode are electrically connected to each other by a conductive member disposed between the third surface electrode and the fourth surface electrode.

本發明的積層體亦可為在所述第三表面電極與所述第四表面電極之間未配置導電構件的形態。The laminate of the present invention may be in a form in which a conductive member is not disposed between the third surface electrode and the fourth surface electrode.

亦可為：所述第一貫通孔及所述第二貫通孔中的至少一者的直徑大於所述絕緣構件的所述貫通孔的直徑。The diameter of at least one of the first through hole and the second through hole may be larger than a diameter of the through hole of the insulating member.

亦可為：所述第一貫通孔的直徑及所述第二貫通孔的直徑大於所述絕緣構件的所述貫通孔的直徑。The diameter of the first through hole and the diameter of the second through hole may be larger than the diameter of the through hole of the insulating member.

[發明的效果]
根據本發明，可有效率且容易地獲得能夠封裝銷***型的零件的積層體。根據所述本發明，可提高積層體的設計自由度及貫通孔的形成自由度。[Effects of the Invention]
According to the present invention, a laminated body capable of encapsulating a pin insertion type part can be obtained efficiently and easily. According to the present invention, the degree of freedom in designing the laminated body and the degree of freedom in forming the through holes can be improved.

以下，適當參照圖示，對本發明的實施方式進行說明。但是，本發明並不限定於以下的實施方式。各圖中的構成要素的大小為概念性者，構成要素間的大小的相對關係不限定於各圖所示者。Hereinafter, embodiments of the present invention will be described with reference to the drawings as appropriate. However, the present invention is not limited to the following embodiments. The size of the constituent elements in each drawing is conceptual, and the relative relationship between the sizes of the constituent elements is not limited to those shown in the respective drawings.

本實施方式的積層體具有在第一基板與第二基板之間存在絕緣構件的積層結構，其中，貫通第一基板的第一貫通孔、貫通第二基板的第二貫通孔及貫通絕緣構件的貫通孔構成貫通積層體的貫通孔，第一基板具有配置於第一貫通孔的內壁的第一導體部，第二基板具有配置於第二貫通孔的內壁的第二導體部，在第一基板中的與第二基板相向的第一主面中，在與第一貫通孔的形成位置不同的位置，配置有第一表面電極，在第二基板中的與第一基板相向的第二主面中，在與第二貫通孔的形成位置不同的位置，配置有第二表面電極，第一貫通孔中的與第二基板相反的一側的端部跟第二貫通孔中的與第一基板相反的一側的端部經由第一導體部、第一表面電極、第二表面電極及第二導體部而電性連接。The laminated body of the present embodiment has a laminated structure in which an insulating member is interposed between the first substrate and the second substrate, wherein the first through hole penetrating the first substrate, the second through hole penetrating the second substrate, and the through-insulating member The through hole constitutes a through hole penetrating the laminated body, the first substrate has a first conductor portion disposed on the inner wall of the first through hole, and the second substrate has a second conductor portion disposed on the inner wall of the second through hole. a first surface electrode disposed at a position different from a position at which the first through hole is formed in a first main surface of the substrate opposite to the second substrate, and a second surface facing the first substrate in the second substrate In the main surface, a second surface electrode is disposed at a position different from a position at which the second through hole is formed, and an end portion of the first through hole opposite to the second substrate and the second through hole An end of the opposite side of the substrate is electrically connected via the first conductor portion, the first surface electrode, the second surface electrode, and the second conductor portion.

基板的貫通孔（第一貫通孔及第二貫通孔中的至少一者）的直徑（與基板的厚度方向正交的方向上的直徑）可為0.1 mm以上，可為0.2 mm以上，可為0.3 mm以上，可為0.4 mm以上，可為0.5 mm以上。基板（第一基板及/或第二基板）的貫通孔的直徑可為5 mm以下，可為3 mm以下，可為1 mm以下。第一基板的貫通孔的直徑與第二基板的貫通孔的直徑既可彼此相同亦可不同。The diameter of the through hole (at least one of the first through hole and the second through hole) of the substrate (the diameter in the direction perpendicular to the thickness direction of the substrate) may be 0.1 mm or more, and may be 0.2 mm or more. 0.3 mm or more, 0.4 mm or more, and 0.5 mm or more. The diameter of the through hole of the substrate (the first substrate and/or the second substrate) may be 5 mm or less, may be 3 mm or less, and may be 1 mm or less. The diameter of the through hole of the first substrate and the diameter of the through hole of the second substrate may be the same or different.

絕緣構件的貫通孔的直徑（與絕緣構件的厚度方向正交的方向上的直徑）可為0.1 mm以上，可為0.2 mm以上，可為0.3 mm以上，可為0.4 mm以上，可為0.45 mm以上，可為0.5 mm以上。絕緣構件的貫通孔的直徑可為1 mm以下，可為0.9 mm以下，可為0.8 mm以下，可為0.7 mm以下，可為0.6 mm以下。The diameter of the through hole of the insulating member (diameter in a direction orthogonal to the thickness direction of the insulating member) may be 0.1 mm or more, 0.2 mm or more, 0.3 mm or more, 0.4 mm or more, and 0.45 mm. The above may be 0.5 mm or more. The through hole of the insulating member may have a diameter of 1 mm or less, may be 0.9 mm or less, may be 0.8 mm or less, may be 0.7 mm or less, or may be 0.6 mm or less.

基板的貫通孔（第一貫通孔及第二貫通孔中的至少一者）的直徑與絕緣構件的貫通孔的直徑之差，就容易抑制對絕緣構件形成貫通孔時基板的貫通孔內的導體部破損的觀點而言，可為0.1 mm以上，可為0.15 mm以上，可為0.2 mm以上。第一貫通孔及第二貫通孔中的至少一者的直徑與絕緣構件的貫通孔的直徑之差的上限值例如為0.5 mm。The difference between the diameter of the through hole (at least one of the first through hole and the second through hole) of the substrate and the diameter of the through hole of the insulating member makes it easy to suppress the conductor in the through hole of the substrate when the through hole is formed in the insulating member From the viewpoint of damage, it may be 0.1 mm or more, 0.15 mm or more, and 0.2 mm or more. The upper limit of the difference between the diameter of at least one of the first through hole and the second through hole and the diameter of the through hole of the insulating member is, for example, 0.5 mm.

絕緣構件的貫通孔的直徑既可與基板的貫通孔（第一貫通孔及第二貫通孔中的至少一者）的直徑相同，亦可不同。例如，亦可為：基板的貫通孔（第一貫通孔及第二貫通孔中的至少一者）的直徑大於絕緣構件的貫通孔的直徑。而且，亦可為：第一貫通孔的直徑及第二貫通孔的直徑大於絕緣構件的貫通孔的直徑。較佳為絕緣構件的貫通孔的直徑與基板的貫通孔的直徑相同（直徑相同）。在此情況下，容易在對絕緣構件形成貫通孔後自基板的貫通孔內除去絕緣構件的構成材料，可抑制基板的貫通孔內積存異物等。而且，可抑制零件封裝時，絕緣構件接觸***型的銷而導致絕緣構件的構成材料飛散。The diameter of the through hole of the insulating member may be the same as or different from the diameter of the through hole (at least one of the first through hole and the second through hole) of the substrate. For example, the diameter of the through hole (at least one of the first through hole and the second through hole) of the substrate may be larger than the diameter of the through hole of the insulating member. Further, the diameter of the first through hole and the diameter of the second through hole may be larger than the diameter of the through hole of the insulating member. It is preferable that the diameter of the through hole of the insulating member is the same as the diameter of the through hole of the substrate (the same diameter). In this case, it is easy to remove the constituent material of the insulating member from the through hole of the substrate after forming the through hole in the insulating member, and it is possible to suppress the accumulation of foreign matter or the like in the through hole of the substrate. Further, when the package of the component is suppressed, the insulating member contacts the insert-type pin, and the constituent material of the insulating member is scattered.

導體部的厚度（導體部在貫通孔的徑向上的厚度）可為10 μm以上，可為15 μm以上，可為20 μm以上。導體部14a～導體部14d及導體部24a～導體部24d的厚度可為40 μm以下，可為35 μm以下，可為30 μm以下。The thickness of the conductor portion (the thickness of the conductor portion in the radial direction of the through hole) may be 10 μm or more, may be 15 μm or more, and may be 20 μm or more. The thickness of the conductor portion 14a to the conductor portion 14d and the conductor portion 24a to the conductor portion 24d may be 40 μm or less, 35 μm or less, or 30 μm or less.

圖1是表示本實施方式的積層體的概略剖面圖。圖1所示的積層體（多層配線板）100包括基板（第一基板）10、基板（第二基板）20及絕緣構件30，具有在基板10與基板20之間存在絕緣構件30的積層結構。絕緣構件30與基板10及基板20相接。基板10、絕緣構件30及基板20依次積層。Fig. 1 is a schematic cross-sectional view showing a laminated body of the embodiment. The laminated body (multilayer wiring board) 100 shown in FIG. 1 includes a substrate (first substrate) 10, a substrate (second substrate) 20, and an insulating member 30, and has a laminated structure in which an insulating member 30 is present between the substrate 10 and the substrate 20. . The insulating member 30 is in contact with the substrate 10 and the substrate 20. The substrate 10, the insulating member 30, and the substrate 20 are laminated in this order.

基板10、基板20的大小、形狀等並無特別限定。基板10及基板20的大小、形狀等既可彼此相同亦可不同。The size, shape, and the like of the substrate 10 and the substrate 20 are not particularly limited. The size, shape, and the like of the substrate 10 and the substrate 20 may be the same or different.

作為基板10、基板20，可使用印刷配線板。作為印刷配線板，可列舉兩面電路板、多層配線板、多線（multi wire）配線板等。印刷配線板中所使用的基材的種類並無限定，就抑制積層時的加壓加熱導致的變形（尺寸變化）的觀點而言，較佳為含有玻璃布等強化材的絕緣基材。就同樣的觀點而言，作為基材，較佳為美國電機製造商協會（National Electrical Manufacturers Association，NEMA）規格的阻燃劑（Flame Retardant，FR）-5等級的基材、玻璃轉移溫度高的基材（例如，含有聚醯亞胺樹脂等的基材）。As the substrate 10 and the substrate 20, a printed wiring board can be used. Examples of the printed wiring board include a double-sided circuit board, a multilayer wiring board, and a multi-wire wiring board. The type of the substrate to be used in the printed wiring board is not limited, and from the viewpoint of suppressing deformation (dimension change) due to pressure heating at the time of lamination, an insulating base material containing a reinforcing material such as glass cloth is preferable. From the same viewpoint, the base material is preferably a National Electrical Manufacturers Association (NEMA) flame retardant (Flame Retardant, FR)-5 grade substrate, and has a high glass transition temperature. A substrate (for example, a substrate containing a polyimide resin or the like).

基板10具有在基板10的厚度方向上貫通基板10的多個貫通孔12a～貫通孔12d，並具有配置於該貫通孔12a～貫通孔12d的內壁的導體部（導孔）14a～導體部（導孔）14d。導體部14a～導體部14d沿著貫通孔的軸向，自貫通孔12a～貫通孔12d中的基板20側的端部起，延伸至貫通孔12a～貫通孔12d中的與基板20相反的一側的端部。基板20具有在基板20的厚度方向上貫通基板20的多個貫通孔22a～貫通孔22d，並具有配置於該貫通孔22a～貫通孔22d的內壁的導體部（導孔）24a～導體部（導孔）24d。導體部24a～導體部24d沿著貫通孔的軸向，自貫通孔22a～貫通孔22d中的基板10側的端部起，延伸至貫通孔22a～貫通孔22d中的與基板10相反的一側的端部。基板10及基板20具有貫通通孔結構。貫通孔12a～貫通孔12d與貫通孔22a～貫通孔22d形成於基板10、絕緣構件30及基板20的積層方向上的相向位置。The substrate 10 has a plurality of through holes 12a to 12d penetrating through the substrate 10 in the thickness direction of the substrate 10, and has a conductor portion (guide hole) 14a to a conductor portion disposed on the inner wall of the through hole 12a to the through hole 12d. (guide hole) 14d. The conductor portion 14a to the conductor portion 14d extend from the end portion of the through hole 12a to the through hole 12d on the substrate 20 side in the axial direction of the through hole, and extend to the opposite of the substrate 20 from the through hole 12a to the through hole 12d. The end of the side. The substrate 20 has a plurality of through holes 22a to 22d penetrating through the substrate 20 in the thickness direction of the substrate 20, and has a conductor portion (guide hole) 24a to a conductor portion disposed on the inner wall of the through hole 22a to the through hole 22d. (guide hole) 24d. The conductor portion 24a to the conductor portion 24d extend in the axial direction of the through hole from the end portion on the substrate 10 side of the through hole 22a to the through hole 22d, and extend to the opposite of the substrate 10 from the through hole 22a to the through hole 22d. The end of the side. The substrate 10 and the substrate 20 have a through via structure. The through holes 12 a to 12 d and the through holes 22 a to 22 d are formed at positions facing each other in the stacking direction of the substrate 10 , the insulating member 30 , and the substrate 20 .

在積層體100中，在基板10的厚度方向上貫通基板10的貫通孔12a（第一貫通孔）、在基板20的厚度方向上貫通基板20的貫通孔22a（第二貫通孔）及在絕緣構件30的厚度方向上貫通絕緣構件30的貫通孔32a形成了在積層體100的厚度方向上貫通積層體100的貫通孔100a。貫通基板10的貫通孔12b、貫通基板20的貫通孔22b及貫通絕緣構件30的貫通孔32b形成了在積層體100的厚度方向上貫通積層體100的貫通孔100b。貫通孔12a、貫通孔12b、貫通孔22a、貫通孔22b具有徑向中央部中空的結構。在貫通孔12c、貫通孔12d、貫通孔22c、貫通孔22d中的導體部14c、導體部14d、導體部24c、導體部24d的佔有空間以外的空間中填充有埋孔樹脂40。作為埋孔樹脂40，可使用太陽油墨製造（TAIYO INK MFG.）股份有限公司製造的商品名：THP-100DX1、拓自達（tatsuta）電線股份有限公司製造的商品名：AE1244等。In the laminated body 100, the through hole 12a (first through hole) penetrating the substrate 10 in the thickness direction of the substrate 10, the through hole 22a (second through hole) penetrating the substrate 20 in the thickness direction of the substrate 20, and the insulation The through hole 32a penetrating the insulating member 30 in the thickness direction of the member 30 forms a through hole 100a that penetrates the laminated body 100 in the thickness direction of the laminated body 100. The through hole 12b penetrating the substrate 10, the through hole 22b penetrating the substrate 20, and the through hole 32b penetrating the insulating member 30 form a through hole 100b penetrating the laminated body 100 in the thickness direction of the laminated body 100. The through hole 12a, the through hole 12b, the through hole 22a, and the through hole 22b have a hollow central portion in the radial direction. The buried via resin 40 is filled in a space other than the space occupied by the conductor portion 14c, the conductor portion 14d, the conductor portion 24c, and the conductor portion 24d in the through hole 12c, the through hole 12d, the through hole 22c, and the through hole 22d. As the buried hole resin 40, trade name: THP-100DX1, manufactured by TAIYO INK MFG., and trade name: AE1244 manufactured by Tatsuta Electric Wire Co., Ltd., etc. can be used.

構成貫通孔100a的貫通孔12a及貫通孔22a形成於在基板10、絕緣構件30及基板20的積層方向上彼此重疊的位置。構成貫通孔100b的貫通孔12b及貫通孔22b形成於在基板10、絕緣構件30及基板20的積層方向上彼此重疊的位置。在基板10的貫通孔及基板20的貫通孔形成於在基板10、絕緣構件30及基板20的積層方向上彼此重疊的位置的情況下，兩貫通孔的中心軸既可為相同的軸，亦可不是相同的軸。在未形成有貫通積層體100的貫通孔的位置，基板10的貫通孔及基板20的貫通孔既可形成於在基板10、絕緣構件30及基板20的積層方向上彼此重疊的位置，亦可形成於彼此不重疊的位置。The through hole 12a and the through hole 22a constituting the through hole 100a are formed at positions overlapping each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20. The through hole 12b and the through hole 22b constituting the through hole 100b are formed at positions overlapping each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20. When the through hole of the substrate 10 and the through hole of the substrate 20 are formed at positions overlapping each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20, the central axes of the two through holes may be the same axis. Not the same axis. The through hole of the substrate 10 and the through hole of the substrate 20 may be formed at positions overlapping each other in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20 at a position where the through hole penetrating the laminated body 100 is not formed. They are formed at positions that do not overlap each other.

在基板10中的與基板20相向的主面（第一主面）10a中與貫通孔12a的形成位置不同的位置，配置有表面電極（第一表面電極，焊盤（land））16a。表面電極16a配置於主面10a中的與貫通孔12a的形成位置鄰接的位置。表面電極16a與貫通孔12a內的導體部14a相接，從而與導體部14a電性連接。在基板20中的與基板10相向的主面（第二主面）20a中與貫通孔22a的形成位置不同的位置，配置有表面電極（第二表面電極，焊盤）26a。表面電極26a配置於主面20a中的與貫通孔22a的形成位置鄰接的位置。表面電極26a與貫通孔22a內的導體部24a相接，從而與導體部24a電性連接。A surface electrode (first surface electrode, land) 16a is disposed at a position on the main surface (first main surface) 10a of the substrate 10 that faces the substrate 20 at a position different from the position at which the through hole 12a is formed. The surface electrode 16a is disposed at a position adjacent to the formation position of the through hole 12a in the main surface 10a. The surface electrode 16a is in contact with the conductor portion 14a in the through hole 12a, and is electrically connected to the conductor portion 14a. A surface electrode (second surface electrode, pad) 26a is disposed at a position on the main surface (second main surface) 20a of the substrate 20 that faces the substrate 10 at a position different from the position at which the through hole 22a is formed. The surface electrode 26a is disposed at a position adjacent to the formation position of the through hole 22a in the main surface 20a. The surface electrode 26a is in contact with the conductor portion 24a in the through hole 22a, and is electrically connected to the conductor portion 24a.

在主面10a中與貫通孔12b的形成位置不同的位置，配置有表面電極16b。在主面10a中的貫通孔12c、貫通孔12d的形成位置配置有表面電極（焊墊（pad））16c、表面電極（焊墊）16d。在主面20a中與貫通孔22b的形成位置不同的位置，配置有表面電極26b。在主面20a中的貫通孔22c、貫通孔22d的形成位置配置有表面電極（焊墊）26c、表面電極（焊墊）26d。若在貫通孔12c、貫通孔12d、貫通孔22c、貫通孔22d內填充有埋孔樹脂40，則容易在貫通孔12c、貫通孔12d、貫通孔22c、貫通孔22d的形成位置形成表面電極16c、表面電極16d、表面電極26c、表面電極26d。而且，表面電極16c、表面電極16d、表面電極26c、表面電極26d容易跟與導體部14c、導體部14d、導體部24c、導體部24d電性連接的導電構件（例如，後述導電構件50c）接觸，所以可藉由配置表面電極16c、表面電極16d、表面電極26c、表面電極26d而容易地獲得導體部14c、導體部14d、導體部24c、導體部24d與導電構件的電性連接。The surface electrode 16b is disposed at a position different from the position at which the through hole 12b is formed in the main surface 10a. A surface electrode (pad) 16c and a surface electrode (pad) 16d are disposed at a position where the through hole 12c and the through hole 12d are formed in the main surface 10a. The surface electrode 26b is disposed at a position different from the position at which the through hole 22b is formed in the main surface 20a. A surface electrode (pad) 26c and a surface electrode (pad) 26d are disposed at a position where the through hole 22c and the through hole 22d are formed in the main surface 20a. When the via hole resin 12 is filled in the through hole 12c, the through hole 12d, the through hole 22c, and the through hole 22d, the surface electrode 16c is easily formed at the formation position of the through hole 12c, the through hole 12d, the through hole 22c, and the through hole 22d. The surface electrode 16d, the surface electrode 26c, and the surface electrode 26d. Further, the surface electrode 16c, the surface electrode 16d, the surface electrode 26c, and the surface electrode 26d are easily brought into contact with a conductive member (for example, a conductive member 50c to be described later) electrically connected to the conductor portion 14c, the conductor portion 14d, the conductor portion 24c, and the conductor portion 24d. Therefore, the surface portion of the conductor portion 14c, the conductor portion 14d, the conductor portion 24c, and the conductor portion 24d and the conductive member can be easily obtained by arranging the surface electrode 16c, the surface electrode 16d, the surface electrode 26c, and the surface electrode 26d.

在積層體100中，基板10的貫通孔（例如，貫通孔12a）中的與基板20相反的一側（與主面10a相反的一側）的端部跟基板20的貫通孔（例如，貫通孔22a）中的與基板10相反的一側（與主面20a相反的一側）的端部至少經由基板10的導體部（例如，導體部14a（第一導體部））、基板10的表面電極（例如，表面電極16a）、基板20的表面電極（例如，表面電極26a）及基板20的導體部（例如，導體部24a（第二導體部））而電性連接。表面電極16a與表面電極26a藉由配置於表面電極16a與表面電極26a之間的導電構件50a而彼此電性連接。表面電極16c與表面電極26c藉由配置於表面電極16c與表面電極26c之間的導電構件50c而彼此電性連接。關於表面電極16d與表面電極26d，因不在表面電極16d與表面電極26d之間配置導電構件，而在表面電極16d與表面電極26d之間存在絕緣構件30，因此彼此未電性連接。In the laminated body 100, the end of the through hole (for example, the through hole 12a) of the substrate 10 opposite to the substrate 20 (the side opposite to the main surface 10a) and the through hole of the substrate 20 (for example, through) The end of the hole 22a) opposite to the substrate 10 (the side opposite to the main surface 20a) passes through at least the conductor portion of the substrate 10 (for example, the conductor portion 14a (first conductor portion)), the surface of the substrate 10 The electrode (for example, the surface electrode 16a), the surface electrode of the substrate 20 (for example, the surface electrode 26a), and the conductor portion of the substrate 20 (for example, the conductor portion 24a (second conductor portion)) are electrically connected. The surface electrode 16a and the surface electrode 26a are electrically connected to each other by the conductive member 50a disposed between the surface electrode 16a and the surface electrode 26a. The surface electrode 16c and the surface electrode 26c are electrically connected to each other by the conductive member 50c disposed between the surface electrode 16c and the surface electrode 26c. Regarding the surface electrode 16d and the surface electrode 26d, since the conductive member is not disposed between the surface electrode 16d and the surface electrode 26d, the insulating member 30 is present between the surface electrode 16d and the surface electrode 26d, and thus is not electrically connected to each other.

導電構件（例如，導電構件50a、導電構件50c）中所使用的導電性材料，只要具有導電性則並無限定，較佳為在印刷配線板中的一般性的積層溫度（200℃以下）下進行熔融而形成金屬間鍵後的再熔融溫度為250℃以上的材料。作為導電性材料，可列舉銅、錫合金等。導電性材料例如較佳為含有銅粒子及金屬包覆銅粒子（例如，被銀、金或錫包覆的銅粒子）中的至少一者作為第一金屬，並含有選自由錫、鉍、銀、鋅及鈀所組成的群組中的至少一種的金屬作為第二金屬。第二金屬較佳為與第一金屬形成金屬間化合物。在此情況下，第二金屬較佳為至少含有錫。作為導電構件，可使用導電性糊。作為導電構件，可列舉奧梅特（Ormet）公司製造的商品名：HT-710，拓自達（tatsuta）電線股份有限公司製造的商品名：MPA500等。The conductive material used in the conductive member (for example, the conductive member 50a and the conductive member 50c) is not limited as long as it has conductivity, and is preferably a general laminated temperature (200 ° C or lower) in a printed wiring board. A material having a remelting temperature of 250 ° C or higher after melting to form an intermetallic bond. Examples of the conductive material include copper, a tin alloy, and the like. The conductive material is preferably, for example, at least one of copper particles and metal-coated copper particles (for example, copper particles coated with silver, gold or tin) as the first metal, and contains at least one selected from the group consisting of tin, antimony, and silver. A metal of at least one of the group consisting of zinc and palladium is used as the second metal. The second metal preferably forms an intermetallic compound with the first metal. In this case, the second metal preferably contains at least tin. As the conductive member, a conductive paste can be used. As a conductive member, the brand name: HT-710 manufactured by Ormet, and the brand name of MPA500 by the Tatsuta Wire Co., Ltd. are mentioned.

為了保護表面電極的表面，亦可對基板的表面實施表面處理（表面精加工）。表面處理較佳為鍍金。根據表面電極的材料的種類（例如，銅），若放置於大氣中，則存在因表面形成氧化膜（例如，氧化銅膜）而表面電極與導電構件的連接性下降的情況。在此情況下，藉由鍍金等對表面電極的表面進行保護，容易抑制表面電極的氧化劣化。In order to protect the surface of the surface electrode, surface treatment (surface finishing) may also be performed on the surface of the substrate. The surface treatment is preferably gold plating. Depending on the type of material of the surface electrode (for example, copper), if it is placed in the atmosphere, the surface of the surface electrode and the conductive member may be lowered due to the formation of an oxide film (for example, a copper oxide film) on the surface. In this case, by protecting the surface of the surface electrode by gold plating or the like, it is easy to suppress oxidative degradation of the surface electrode.

絕緣構件30只要具有絕緣性則並無特別限定。作為絕緣構件30，例如可使用具有絕緣性的薄膜（film）。絕緣構件30的絕緣材料例如包括樹脂組成物。樹脂組成物就容易控制流動性的觀點而言，較佳為含有樹脂（聚合物），更佳為含有熱硬化性樹脂。作為熱硬化性樹脂，可列舉環氧樹脂、酚樹脂、聚醯亞胺樹脂等。The insulating member 30 is not particularly limited as long as it has insulating properties. As the insulating member 30, for example, an insulating film can be used. The insulating material of the insulating member 30 includes, for example, a resin composition. From the viewpoint of easily controlling the fluidity, the resin composition preferably contains a resin (polymer), and more preferably contains a thermosetting resin. Examples of the thermosetting resin include an epoxy resin, a phenol resin, and a polyimide resin.

在樹脂組成物含有熱硬化性樹脂的情況下，硬化物（熱硬化物）的玻璃轉移溫度就提升零件封裝時的回流（reflow）耐性的觀點而言，較佳為150℃以上，更佳為180℃以上。在樹脂組成物含有熱硬化性樹脂的情況下，樹脂組成物就抑制硬化物的熱膨脹率的觀點而言，較佳為含有填料等粒子作為強化材。When the resin composition contains a thermosetting resin, the glass transition temperature of the cured product (thermosetting material) is preferably 150° C. or higher, and more preferably from the viewpoint of improving reflow resistance during packaging of the device. Above 180 °C. When the resin composition contains a thermosetting resin, the resin composition preferably contains particles such as a filler as a reinforcing material from the viewpoint of suppressing the thermal expansion coefficient of the cured product.

玻璃轉移溫度可藉由以下的方法來進行測定。
（樣本製作方法）
以乾燥後的厚度成為100 μm的方式，使用敷料器（applicator）將熱硬化性樹脂組成物塗佈於離型聚對苯二甲酸乙二酯（polyethylene terephthalate，PET）薄膜（帝人杜邦薄膜（Teijin DuPont Films）公司製造，商品名：A-53）上，之後以溫度130℃，時間30分鐘的條件進行乾燥，藉此製作半硬化的薄膜。其次，自離型PET薄膜剝去半硬化的薄膜。並且，在藉由將半硬化的薄膜夾持於兩枚金屬製的框中而對薄膜進行了固定之後，以溫度185℃、時間60分鐘的條件進行乾燥，藉此製作包括硬化的熱硬化性樹脂組成物的薄膜。
（測定方法）
使用TA儀器（TA Instruments）公司製造，裝置名：TMA-2940，以夾具：拉伸、夾頭間距離：15 mm、測定溫度：室溫～350℃、升溫溫度：10℃/分、拉伸負載：5 gf、樣本尺寸：寬度5 mm×長度25 mm的條件進行測定，自所獲得的溫度-位移曲線藉由切線法求出玻璃轉移溫度。The glass transition temperature can be measured by the following method.
(sample production method)
The thermosetting resin composition was applied to a release-type polyethylene terephthalate (PET) film using an applicator so that the thickness after drying became 100 μm (Teijin) It was manufactured by DuPont Films, Inc., trade name: A-53), and then dried at a temperature of 130 ° C for 30 minutes to prepare a semi-cured film. Next, the semi-hardened film was peeled off from the release PET film. Further, the film was fixed by sandwiching a semi-cured film in a frame made of two metals, and then dried at a temperature of 185 ° C for 60 minutes to prepare a thermosetting property including hardening. A film of a resin composition.
(test methods)
Manufactured by TA Instruments (TA Instruments), device name: TMA-2940, with clamp: stretching, distance between chucks: 15 mm, measuring temperature: room temperature to 350 ° C, heating temperature: 10 ° C / min, stretching Load: 5 gf, sample size: width 5 mm × length 25 mm were measured, and the glass transition temperature was determined by the tangent method from the obtained temperature-displacement curve.

作為絕緣構件30的絕緣材料，例如可列舉日立化成股份有限公司製造的商品名：AS-401HS、日立化成股份有限公司製造的商品名：AS-9500。在使用包括包含玻璃纖維或碳纖維的不織布、玻璃布·碳布（Carbon Cloth）的絕緣材料的情況下，根據不織布·布的緻密帶來的厚度的不同，表面電極的高度容易因各表面電極而不均，所以存在連接電阻值變得不穩定的情況。因此，絕緣材料亦可不含包含玻璃纖維或碳纖維的不織布、玻璃布·碳布等。The insulating material of the insulating member 30 is, for example, trade name: AS-401HS manufactured by Hitachi Chemical Co., Ltd., and trade name: AS-9500 manufactured by Hitachi Chemical Co., Ltd. In the case of using an insulating material including a non-woven fabric containing glass fibers or carbon fibers, or a carbon cloth (Carbon Cloth), the height of the surface electrode is easily changed by the surface electrodes depending on the thickness of the nonwoven fabric and the denseness of the cloth. Since it is uneven, there is a case where the connection resistance value becomes unstable. Therefore, the insulating material may not contain a non-woven fabric containing glass fibers or carbon fibers, a glass cloth, a carbon cloth, or the like.

在本實施方式的積層體中，基板只要具有構成貫通積層體的貫通孔（例如，貫通上述積層體100的貫通孔100a、貫通孔100b）的貫通孔（例如上述貫通孔12a、貫通孔12b、貫通孔22a、貫通孔22b）即可。貫通積層體的貫通孔既可僅形成一個，亦可形成多個。構成貫通積層體的貫通孔的貫通孔既可在各基板僅形成一個，亦可在至少一個基板形成多個。In the laminated body of the present embodiment, the substrate has a through hole (for example, the through hole 12a and the through hole 12b that penetrates the through hole 100a and the through hole 100b of the laminated body 100). The through hole 22a and the through hole 22b) may be used. The through holes penetrating the laminated body may be formed only in one or a plurality of through holes. The through hole constituting the through hole penetrating the laminated body may be formed only in one substrate or may be formed in at least one substrate.

在本實施方式的積層體中，基板亦可具有不構成貫通積層體的貫通孔的貫通孔。例如，如上述積層體100所示，基板10亦可除了貫通孔12a之外亦具有貫通孔12c、貫通孔12d（第三貫通孔）以作為貫通基板10的貫通孔。而且，基板20亦可除了貫通孔22a之外亦具有貫通孔22c、貫通孔22d（第四貫通孔）以作為貫通基板20的貫通孔。該些貫通孔12c、貫通孔12d、貫通孔22c、貫通孔22d不構成貫通積層體100的貫通孔。貫通孔12c、貫通孔12d與貫通孔22c、貫通孔22d形成於基板10、絕緣構件30及基板20的積層方向上的相向位置。In the laminated body of the present embodiment, the substrate may have a through hole that does not constitute a through hole penetrating the laminated body. For example, as shown in the laminated body 100, the substrate 10 may have a through hole 12c and a through hole 12d (third through hole) in addition to the through hole 12a as a through hole penetrating the substrate 10. Further, the substrate 20 may have a through hole 22c and a through hole 22d (fourth through hole) in addition to the through hole 22a as a through hole penetrating the substrate 20. The through holes 12c, the through holes 12d, the through holes 22c, and the through holes 22d do not constitute through holes penetrating the laminated body 100. The through hole 12c, the through hole 12d, the through hole 22c, and the through hole 22d are formed at opposite positions in the stacking direction of the substrate 10, the insulating member 30, and the substrate 20.

基板10具有配置於貫通孔12c、貫通孔12d的內壁的導體部14c、導體部14d（第三導體部）。在基板10的主面10a配置有表面電極16c、表面電極16d（第三表面電極），表面電極16c、表面電極16d配置於主面10a中的貫通孔12c、貫通孔12d的形成位置。基板20具有配置於貫通孔22c、貫通孔22d的內壁的導體部24c、導體部24d（第四導體部）。在基板20的主面20a配置有表面電極26c、表面電極26d（第四表面電極），表面電極26c、表面電極26d配置於主面20a中的貫通孔22c、貫通孔22d的形成位置。配置於不構成貫通積層體的貫通孔的貫通孔的形成位置的表面電極既可為藉由配置於表面電極之間的導電構件而彼此電性連接的形態（表面電極16c、表面電極26c的形態），亦可為在表面電極之間未配置導電構件的形態（表面電極16d、表面電極26d的形態）。在表面電極之間未配置導電構件的形態中，在表面電極之間存在絕緣構件30。The substrate 10 has a conductor portion 14c and a conductor portion 14d (third conductor portion) which are disposed in the through hole 12c and the inner wall of the through hole 12d. The surface electrode 16c and the surface electrode 16d (third surface electrode) are disposed on the main surface 10a of the substrate 10, and the surface electrode 16c and the surface electrode 16d are disposed at positions where the through hole 12c and the through hole 12d are formed in the main surface 10a. The substrate 20 has a conductor portion 24c and a conductor portion 24d (fourth conductor portion) which are disposed on the inner wall of the through hole 22c and the through hole 22d. The surface electrode 26c and the surface electrode 26d (fourth surface electrode) are disposed on the main surface 20a of the substrate 20, and the surface electrode 26c and the surface electrode 26d are disposed at positions where the through hole 22c and the through hole 22d are formed in the main surface 20a. The surface electrode disposed at a position where the through hole of the through hole that does not penetrate the laminated body is electrically connected to each other by the conductive member disposed between the surface electrodes (the form of the surface electrode 16c and the surface electrode 26c) The form in which the conductive member is not disposed between the surface electrodes (the surface electrode 16d and the surface electrode 26d) may be used. In the form in which the conductive member is not disposed between the surface electrodes, the insulating member 30 is present between the surface electrodes.

作為不構成貫通積層體的貫通孔的貫通孔的另一例，可列舉圖2（a）、圖2（b）所示的示例。在圖2（a）、圖2（b）中，在基板10、絕緣構件30及基板20的積層方向上彼此不重疊的位置形成有貫通孔12c及貫通孔22c，表面電極16c配置於主面10a中的貫通孔12c的形成位置，表面電極26c配置於主面20a中的與表面電極16c相向的位置。表面電極16c、表面電極26c既可為藉由配置於表面電極16c、表面電極26c之間的導電構件50c而彼此電性連接的形態（圖2（a）），亦可為在表面電極16c、表面電極26c之間未配置導電構件的形態（圖2（b））。As another example of the through hole which does not constitute the through hole which penetrates the laminated body, the example shown in FIG. 2 (a) and FIG. 2 (b) is mentioned. In FIGS. 2(a) and 2(b), a through hole 12c and a through hole 22c are formed at positions where the substrate 10, the insulating member 30, and the substrate 20 do not overlap each other, and the surface electrode 16c is disposed on the main surface. In the position where the through hole 12c is formed in 10a, the surface electrode 26c is disposed at a position facing the surface electrode 16c of the main surface 20a. The surface electrode 16c and the surface electrode 26c may be electrically connected to each other by the conductive member 50c disposed between the surface electrode 16c and the surface electrode 26c (Fig. 2(a)), or may be the surface electrode 16c, A form in which the conductive member is not disposed between the surface electrodes 26c (Fig. 2(b)).

本實施方式的積層體可藉由本實施方式的積層體的製造方法來獲得。本實施方式的積層體的製造方法包括：將貫通第一基板的第一貫通孔形成於第一基板，將貫通第二基板的第二貫通孔形成於第二基板，在將絕緣構件配置於第一基板與第二基板之間的狀態下，對絕緣構件形成貫通孔，藉由第一貫通孔、第二貫通孔及絕緣構件的貫通孔而形成貫通積層體的貫通孔的貫通孔形成步驟。The laminated body of the present embodiment can be obtained by the method for producing a laminated body of the present embodiment. The method for manufacturing a laminated body according to the present embodiment includes: forming a first through hole penetrating through the first substrate on the first substrate, forming a second through hole penetrating the second substrate on the second substrate, and arranging the insulating member on the first substrate In a state between the substrate and the second substrate, a through hole is formed in the insulating member, and a through hole forming step of penetrating the through hole of the laminated body is formed by the first through hole, the second through hole, and the through hole of the insulating member.

本實施方式的積層體的製造方法例如依次包括基板準備步驟、導體部形成步驟、表面電極形成步驟、積層步驟及貫通孔形成步驟。The manufacturing method of the laminated body of this embodiment includes, for example, a substrate preparation step, a conductor portion forming step, a surface electrode forming step, a lamination step, and a through hole forming step.

基板準備步驟是準備具有在基板的厚度方向上貫通基板的貫通孔的基板（第一基板及第二基板）的步驟。作為貫通孔的形成方法，可使用與後述絕緣構件的貫通孔的形成方法同樣的方法（例如鑽孔加工）。The substrate preparation step is a step of preparing a substrate (first substrate and second substrate) having a through hole penetrating through the substrate in the thickness direction of the substrate. As a method of forming the through hole, a method similar to the method of forming the through hole of the insulating member to be described later (for example, drilling) can be used.

導體部形成步驟是在基板（第一基板及第二基板）的貫通孔的內壁形成導體部的步驟。導體部例如可藉由鍍敷來形成。在導體部形成步驟中，亦可在形成導體部之後，對不構成貫通積層體的貫通孔的貫通孔填充絕緣材料。The conductor portion forming step is a step of forming a conductor portion on the inner wall of the through hole of the substrate (the first substrate and the second substrate). The conductor portion can be formed, for example, by plating. In the conductor portion forming step, after the conductor portion is formed, the through hole that does not constitute the through hole penetrating the layered body may be filled with an insulating material.

表面電極形成步驟是在基板（第一基板及第二基板）的主面中與構成貫通積層體的貫通孔的貫通孔的形成位置不同的位置，形成表面電極的步驟。在表面電極形成步驟中，可在與構成貫通積層體的貫通孔的貫通孔的形成位置鄰接的位置形成表面電極。而且，能夠以與基板的貫通孔內的導體部相接的方式形成表面電極。表面電極例如可藉由對配置於基板的主面的金屬層（例如銅箔）進行蝕刻來形成。金屬層例如可藉由鍍敷來形成。在表面電極形成步驟中，亦可在基板的主面中不構成貫通積層體的貫通孔的貫通孔的形成位置，進而形成表面電極。The surface electrode forming step is a step of forming a surface electrode at a position different from a position at which the through holes forming the through holes penetrating the laminated body are formed on the main surface of the substrate (the first substrate and the second substrate). In the surface electrode forming step, the surface electrode can be formed at a position adjacent to the formation position of the through hole constituting the through hole of the through laminated body. Further, the surface electrode can be formed in contact with the conductor portion in the through hole of the substrate. The surface electrode can be formed, for example, by etching a metal layer (for example, a copper foil) disposed on the main surface of the substrate. The metal layer can be formed, for example, by plating. In the surface electrode forming step, the surface electrode may be formed without forming a through hole of the through hole penetrating the laminated body on the main surface of the substrate.

積層步驟是經由絕緣構件對第一基板與第二基板進行積層的步驟。在積層步驟中，可經由絕緣構件及導電構件對第一基板及第二基板進行積層。為了將第一基板的表面電極與第二基板的表面電極電性連接，可在該些表面電極彼此相向的狀態下對基板彼此進行積層並進行加熱·加壓。The lamination step is a step of laminating the first substrate and the second substrate via the insulating member. In the laminating step, the first substrate and the second substrate may be laminated via the insulating member and the conductive member. In order to electrically connect the surface electrode of the first substrate to the surface electrode of the second substrate, the substrates may be laminated and heated and pressurized in a state in which the surface electrodes face each other.

在對基板彼此進行積層的情況下，就精度良好地進行對位的觀點而言，較佳為將積層對位用的銷***至為了***銷而設置的貫通孔（對位用的貫通孔）來進行基板的對位。積層對位用的銷既可僅***至一個貫通孔，亦可***至多個貫通孔。In the case where the substrates are laminated to each other, it is preferable to insert the pin for the alignment alignment into the through hole for inserting the pin (the through hole for alignment) from the viewpoint of accurately positioning the substrate. To perform the alignment of the substrate. The pin for the laminated alignment may be inserted only into one through hole or may be inserted into a plurality of through holes.

在積層步驟中，為了將配置於基板的主面的表面電極彼此電性連接，而在絕緣構件中的表面電極間的位置形成貫通孔。在絕緣構件中的不將表面電極彼此電性連接的位置，既可不形成貫通孔，亦可形成貫通孔。絕緣構件的貫通孔的形成方法並無特別限定，可使用貫通孔形成步驟中的後述絕緣構件的貫通孔的形成方法。In the laminating step, in order to electrically connect the surface electrodes disposed on the main surface of the substrate, through holes are formed at positions between the surface electrodes in the insulating member. A through hole may be formed in a position where the surface electrodes are not electrically connected to each other in the insulating member. The method of forming the through hole of the insulating member is not particularly limited, and a method of forming the through hole of the insulating member to be described later in the through hole forming step can be used.

較佳為在絕緣構件的表面配置有離型膜。在此情況下，可防止異物向絕緣構件的表面的附著。進而，離型膜在之後步驟的導電構件（例如，導電性糊）供給時，作為用以保護絕緣構件的表面的保護膜而發揮作用，不再需要準備對準導電構件的供給位置而開口的保護遮罩，因此可減少積層體的製造成本。作為離型膜，例如可列舉帝人杜邦股份有限公司製造的單面離型處理PET薄膜（例如，商品名：A-31）。在對基板彼此進行積層時剝離離型膜。Preferably, a release film is disposed on the surface of the insulating member. In this case, adhesion of foreign matter to the surface of the insulating member can be prevented. Further, when the release film is supplied from a conductive member (for example, a conductive paste) in a subsequent step, it functions as a protective film for protecting the surface of the insulating member, and it is no longer necessary to prepare to align the supply position of the conductive member to open. The mask is protected, so that the manufacturing cost of the laminate can be reduced. As the release film, for example, a one-side release-treated PET film (for example, trade name: A-31) manufactured by Teijin DuPont Co., Ltd. can be cited. The release film is peeled off when the substrates are laminated to each other.

在對絕緣構件形成貫通孔後，將絕緣構件貼合（層壓（laminate））於基板的主面。其次，在利用導電構件對表面電極彼此進行連接的情況下，對絕緣構件的貫通孔填充導電構件。貫通孔中所填充的導電構件與表面電極相接。導電構件既可在對基板與絕緣構件積層後填充於貫通孔，亦可在積層前填充於貫通孔。例如，可在將絕緣構件貼合於第一基板後，對貫通孔填充導電構件，之後對第一基板及絕緣構件積層第二基板。當在絕緣構件中構成貫通積層體的貫通孔的貫通孔的形成位置，形成有開口部時，導電構件被配置於該開口部內，在形成構成貫通積層體的貫通孔的貫通孔時成為阻礙，因此較佳為在構成貫通積層體的貫通孔的貫通孔的形成位置未形成有開口部。After the through hole is formed in the insulating member, the insulating member is bonded (laminate) to the main surface of the substrate. Next, when the surface electrodes are connected to each other by the conductive member, the through holes of the insulating member are filled with the conductive member. The conductive member filled in the through hole is in contact with the surface electrode. The conductive member may be filled in the through hole after laminating the substrate and the insulating member, or may be filled in the through hole before lamination. For example, after the insulating member is bonded to the first substrate, the conductive member may be filled in the through hole, and then the second substrate may be laminated on the first substrate and the insulating member. When the opening of the through hole that penetrates the through hole of the laminated body is formed in the insulating member, when the opening is formed, the conductive member is disposed in the opening, and the through hole forming the through hole penetrating the laminated body is formed as an obstacle. Therefore, it is preferable that the opening portion is not formed at the position where the through hole constituting the through hole of the laminated body is formed.

作為供給導電構件的方法，例如可列舉藉由網版印刷法、分配（dispenser）法等來配置導電性糊的方法。作為導電性糊，例如可列舉藉由將金屬材料混合於黏合劑樹脂而保持黏性，並使網版印刷、分配加工等簡單化的材料。在使用此種導電性糊的情況下，就保持導電構件的形狀的觀點而言，較佳為藉由在配置導電性糊後進行熱處理來進行黏合劑樹脂的預備硬化，藉此提高導電性糊的黏性。在此情況下，可在溫度70℃～150℃、時間10分鐘～120分鐘的範圍內進行熱處理。若溫度為70℃以上或時間為10分鐘以上，則容易充分地提高黏性，並容易保持導電性糊的形狀。若溫度為150℃以下或時間為120分鐘以下，則容易抑制黏性過度變高及/或黏合劑樹脂的硬化推進，並且即便導電性糊熔融亦容易形成充分的金屬間化合物。藉由保持導電構件的形狀，容易確保充分的連接性。As a method of supplying a conductive member, for example, a method of arranging a conductive paste by a screen printing method, a dispenser method, or the like can be mentioned. The conductive paste may, for example, be a material which is obtained by mixing a metal material with a binder resin to maintain viscosity, and simplifying screen printing, dispensing processing, and the like. In the case of using such a conductive paste, from the viewpoint of maintaining the shape of the conductive member, it is preferred to perform preliminary hardening of the binder resin by heat treatment after disposing the conductive paste, thereby improving the conductive paste. Stickiness. In this case, the heat treatment can be carried out at a temperature of from 70 ° C to 150 ° C for a period of from 10 minutes to 120 minutes. When the temperature is 70° C. or higher or the time is 10 minutes or longer, it is easy to sufficiently improve the viscosity and to easily maintain the shape of the conductive paste. When the temperature is 150° C. or less or the time is 120 minutes or less, it is easy to suppress an excessive increase in viscosity and/or hardening progress of the binder resin, and it is easy to form a sufficient intermetallic compound even if the conductive paste is melted. By maintaining the shape of the conductive member, it is easy to ensure sufficient connectivity.

在貫通孔形成步驟中，將貫通第一基板的第一貫通孔形成於第一基板，將貫通第二基板的第二貫通孔形成於第二基板，在將絕緣構件配置於第一基板與第二基板之間的狀態下，對絕緣構件形成貫通孔，藉由第一貫通孔、第二貫通孔及絕緣構件的貫通孔來形成貫通積層體的貫通孔。絕緣構件的貫通孔可藉由經由第一貫通孔或第二貫通孔對絕緣構件中的自貫通孔露出的部分進行處理而形成。In the through hole forming step, the first through hole penetrating the first substrate is formed on the first substrate, the second through hole penetrating the second substrate is formed on the second substrate, and the insulating member is disposed on the first substrate and the first substrate In a state between the two substrates, a through hole is formed in the insulating member, and a through hole penetrating the laminated body is formed by the first through hole, the second through hole, and the through hole of the insulating member. The through hole of the insulating member can be formed by processing a portion of the insulating member exposed from the through hole through the first through hole or the second through hole.

絕緣構件的貫通孔的形成方法並無特別限定。貫通孔既可藉由物理性的處理來形成，亦可藉由化學性的處理來形成。作為物理性的處理，可列舉雷射加工（雷射照射）、鑽孔加工（切削加工）、衝壓加工等。作為化學性處理，可列舉藥液處理等。在鑽孔加工中，存在基板的貫通孔內的導體部剝落的情況。在藉由藥液處理使絕緣材料熔融而形成貫通孔的情況下，為了抑制基板表面的藥液附著，較佳為貼附離型膜（例如PET薄膜）等。在使用雷射加工的情況下，因是照射雷射來進行加工，所以與鑽孔等切削加工相比，不依存於孔徑或鑽孔徑，容易抑制導體部的損傷。因此，作為絕緣構件的貫通孔的形成方法，較佳為雷射加工。The method of forming the through hole of the insulating member is not particularly limited. The through holes can be formed by physical treatment or by chemical treatment. Examples of the physical treatment include laser processing (laser irradiation), drilling processing (cutting processing), and press processing. As the chemical treatment, a chemical liquid treatment or the like can be mentioned. In the drilling process, the conductor portion in the through hole of the substrate may be peeled off. When the insulating material is melted by the chemical liquid treatment to form a through hole, it is preferable to attach a release film (for example, a PET film) or the like in order to suppress adhesion of the chemical solution on the surface of the substrate. In the case of using laser processing, since the laser beam is irradiated for processing, it is easier to suppress the damage of the conductor portion without depending on the hole diameter or the drill hole diameter compared with the cutting process such as drilling. Therefore, the method of forming the through hole as the insulating member is preferably laser processing.

作為雷射加工中的雷射，可列舉：CO₂ 雷射、UV雷射、YAG雷射、UV-YAG雷射等。CO₂ 雷射的雷射波長為9400 nm，相對於此，UV-YAG雷射的雷射波長為355 nm，UV-YAG雷射在小徑加工方面優異，但使用CO₂ 雷射可在當前的量產加工中形成直徑50 μm以上的孔。進而，CO₂ 雷射的輸出比UV雷射的輸出大10倍以上，所以CO₂ 雷射的生產效率高於UV雷射。因此，作為雷射，較佳為CO₂ 雷射。Examples of the laser in the laser processing include a CO ₂ laser, a UV laser, a YAG laser, and a UV-YAG laser. The laser wavelength of the CO ₂ laser is 9400 nm. In contrast, the laser wavelength of the UV-YAG laser is 355 nm. The UV-YAG laser is excellent in small diameter processing, but the CO ₂ laser can be used at present. A hole having a diameter of 50 μm or more is formed in mass production processing. Furthermore, the output of the CO ₂ laser is more than 10 times larger than the output of the UV laser, so the production efficiency of the CO ₂ laser is higher than that of the UV laser. Therefore, as the laser, a CO ₂ laser is preferred.

以下，使用圖3（a）、圖3（b）及圖4（a）、圖4（b），作為一例，對圖1的積層體100的製造方法進行說明。圖3（a）、圖3（b）及圖4（a）、圖4（b）是表示本實施方式的積層體的製造方法的概略剖面圖。Hereinafter, a method of manufacturing the laminated body 100 of FIG. 1 will be described using FIG. 3(a), FIG. 3(b), FIG. 4(a), and FIG. 4(b) as an example. 3(a), 3(b), 4(a), and 4(b) are schematic cross-sectional views showing a method of manufacturing the laminated body of the embodiment.

首先，如圖3（a）所示，準備具有在基板10的厚度方向上貫通基板10的貫通孔12a～貫通孔12d的基板10。基板10具有與積層於基板10的基板（基板20）相向的主面10a。First, as shown in FIG. 3( a ), a substrate 10 having a through hole 12 a to a through hole 12 d penetrating through the substrate 10 in the thickness direction of the substrate 10 is prepared. The substrate 10 has a main surface 10a that faces the substrate (substrate 20) laminated on the substrate 10.

其次，如圖3（b）所示，在基板10的貫通孔12a～貫通孔12d的內壁形成導體部14a～導體部14d。繼而，對貫通孔12c、貫通孔12d填充絕緣材料。並且，在基板10的主面10a中與構成貫通積層體100的貫通孔100a、貫通孔100b的貫通孔12a、貫通孔12b的形成位置不同的位置，形成表面電極16a、表面電極16b。而且，在基板10的主面10a中不構成貫通積層體100的貫通孔的貫通孔12c、貫通孔12d的形成位置，形成表面電極16c、表面電極16d。Then, as shown in FIG. 3(b), the conductor portion 14a to the conductor portion 14d are formed on the inner wall of the through hole 12a to the through hole 12d of the substrate 10. Then, the through hole 12c and the through hole 12d are filled with an insulating material. In the main surface 10a of the substrate 10, the surface electrode 16a and the surface electrode 16b are formed at positions different from the through hole 10a and the through hole 12a of the through hole 100b and the through hole 12b. In the main surface 10a of the substrate 10, the through hole 12c and the through hole 12d which penetrate the through hole of the laminated body 100 are not formed, and the surface electrode 16c and the surface electrode 16d are formed.

進而，作為積層於基板10的基板，準備具有與基板10同樣的構成的基板20。Further, as the substrate laminated on the substrate 10, the substrate 20 having the same configuration as that of the substrate 10 is prepared.

其次，如圖4（a）所示，準備具有形成於與基板10的表面電極16a、表面電極16c的配置位置對應的位置的貫通孔的絕緣構件30。繼而，在將絕緣構件30貼附於基板10的主面10a之後進行加熱·加壓。並且，對絕緣構件30的貫通孔填充導電構件50a、導電構件50c，使表面電極16a與導電構件50a接觸，並且使表面電極16c與導電構件50c接觸。進而，以基板20的表面電極26a～表面電極26d與基板10的表面電極16a～表面電極16d相向的方式，對基板20中的配置有表面電極26a～表面電極26d的主面20a貼附絕緣構件30，之後進行加熱·加壓。在此情況下，在貫通孔12a與貫通孔22a之間的位置、貫通孔12b與貫通孔22b之間的位置及貫通孔12d與貫通孔22d之間的位置配置有絕緣構件30。Next, as shown in FIG. 4(a), an insulating member 30 having a through hole formed at a position corresponding to the arrangement position of the surface electrode 16a of the substrate 10 and the surface electrode 16c is prepared. Then, after the insulating member 30 is attached to the main surface 10a of the substrate 10, heating and pressurization are performed. Then, the conductive member 50a and the conductive member 50c are filled in the through hole of the insulating member 30, the surface electrode 16a is brought into contact with the conductive member 50a, and the surface electrode 16c is brought into contact with the conductive member 50c. Further, the surface electrode 26a to the surface electrode 26d of the substrate 20 are opposed to the surface electrode 16a to the surface electrode 16d of the substrate 10, and an insulating member is attached to the main surface 20a of the substrate 20 on which the surface electrode 26a to the surface electrode 26d are disposed. 30, followed by heating and pressurization. In this case, the insulating member 30 is disposed at a position between the through hole 12a and the through hole 22a, a position between the through hole 12b and the through hole 22b, and a position between the through hole 12d and the through hole 22d.

其次，如圖4（b）所示，在絕緣構件30中的貫通孔12a與貫通孔22a之間的部分形成貫通孔32a，藉由貫通孔12a、貫通孔22a及貫通孔32a來形成貫通積層體100的貫通孔100a。而且，藉由在絕緣構件30中的貫通孔12b與貫通孔22b之間的部分形成貫通孔32b，藉由貫通孔12b、貫通孔22b及貫通孔32b來形成貫通積層體100的貫通孔100b。藉由以上，可獲得圖1的積層體100。Next, as shown in FIG. 4(b), a through hole 32a is formed in a portion between the through hole 12a and the through hole 22a in the insulating member 30, and a through layer is formed by the through hole 12a, the through hole 22a, and the through hole 32a. The through hole 100a of the body 100. Further, the through hole 32b is formed in a portion between the through hole 12b and the through hole 22b in the insulating member 30, and the through hole 100b penetrating the laminated body 100 is formed by the through hole 12b, the through hole 22b, and the through hole 32b. From the above, the laminated body 100 of Fig. 1 can be obtained.

根據本實施方式的積層體100的製造方法，將貫通基板10的貫通孔12a、貫通孔12b形成於基板10，將貫通基板20的貫通孔22a、貫通孔22b形成於基板20，在將絕緣構件30配置於基板10與基板20之間的狀態下，對絕緣構件30形成貫通孔32a、貫通孔32b，藉由貫通孔12a、貫通孔12b、貫通孔22a、貫通孔22b及貫通孔32a、貫通孔32b而形成貫通積層體100的貫通孔100a、貫通孔100b。在此情況下，在進行形成貫通積層體100的貫通孔100a、貫通孔100b的操作時，預先對基板10及基板20形成了貫通孔12a、貫通孔12b、貫通孔22a、貫通孔22b，因此無需除了絕緣構件30之外，亦對基板10及基板20形成貫通孔。因此，能夠將積層體的製造步驟簡略化，並且可抑制積層體的製造成本變高。因此，根據本實施方式的積層體100的製造方法，可有效率地獲得能夠封裝銷***型的零件的積層體100。According to the method of manufacturing the laminated body 100 of the present embodiment, the through hole 12a and the through hole 12b penetrating the substrate 10 are formed on the substrate 10, and the through hole 22a and the through hole 22b penetrating the substrate 20 are formed on the substrate 20, and the insulating member is formed. 30 is disposed between the substrate 10 and the substrate 20, and the through hole 32a and the through hole 32b are formed in the insulating member 30, and the through hole 12a, the through hole 12b, the through hole 22a, the through hole 22b, and the through hole 32a are penetrated. The through hole 100a and the through hole 100b which penetrate the laminated body 100 are formed in the hole 32b. In this case, when the through hole 100a and the through hole 100b of the through laminated body 100 are formed, the through hole 12a, the through hole 12b, the through hole 22a, and the through hole 22b are formed in the substrate 10 and the substrate 20 in advance. It is not necessary to form a through hole in the substrate 10 and the substrate 20 in addition to the insulating member 30. Therefore, the manufacturing steps of the laminated body can be simplified, and the manufacturing cost of the laminated body can be suppressed from becoming high. Therefore, according to the method of manufacturing the laminated body 100 of the present embodiment, the laminated body 100 capable of encapsulating the pin insertion type component can be efficiently obtained.

根據本實施方式的積層體100的製造方法，即便在基板厚的情況下，亦可使用小徑的鑽機來形成貫通積層體的貫通孔。而且，即便在基板厚的情況下，亦因在積層多個基板之前已預先對基板形成有導體部，而無需考慮積層基板後的鍍敷的均勻性。根據該些，可容易地將孔小徑化，所以可增大形成於基板的貫通孔間的距離。在此情況下，信號線的增加等成為可能，並且亦容易進行信號線的引繞。According to the method of manufacturing the laminated body 100 of the present embodiment, even when the substrate is thick, a through hole penetrating the laminated body can be formed using a drill having a small diameter. Further, even when the substrate is thick, since the conductor portion is formed in advance on the substrate before the plurality of substrates are laminated, it is not necessary to consider the uniformity of plating after the laminated substrate. According to this, since the diameter of the hole can be easily reduced, the distance between the through holes formed in the substrate can be increased. In this case, an increase in signal lines and the like is possible, and it is also easy to guide the signal lines.

在本實施方式的積層體100的製造方法中，貫通孔12a中的與基板20相反的一側的端部跟22a貫通孔中的與基板10相反的一側的端部經由導體部14a、表面電極16a、導電構件50a、表面電極16b及導體部24a而電性連接，藉此，可將積層體100的兩面電性連接。In the method of manufacturing the laminated body 100 of the present embodiment, the end portion of the through hole 12a opposite to the substrate 20 and the end portion of the through hole 22a on the side opposite to the substrate 10 pass through the conductor portion 14a and the surface. The electrode 16a, the conductive member 50a, the surface electrode 16b, and the conductor portion 24a are electrically connected to each other, whereby both surfaces of the laminated body 100 can be electrically connected.

根據本實施方式，可獲得連接可靠性優異的積層體。而且，即便在基板的厚度厚的情況下，亦可有效率地獲得能夠封裝銷***型的零件的積層體。According to the present embodiment, a laminate having excellent connection reliability can be obtained. Further, even when the thickness of the substrate is thick, it is possible to efficiently obtain a laminated body capable of encapsulating a pin-inserted type component.

以上，對本發明的實施方式進行了說明，但本發明不限定於所述實施方式。例如，基板的積層數並無特別限定，亦可為3層以上。在3層以上的積層體中，只要自2層以上的積層結構的其中一面至另一面來形成貫通該積層結構整體的貫通孔即可，可不自積層體的其中一面至另一面來形成貫通3層以上的貫通孔。在形成有貫通積層體整體的貫通孔的情況下，即便在對積層體實施使用了液體的處理的情況下，亦容易抑制貫通孔內殘存液體。
實施例 Although the embodiments of the present invention have been described above, the present invention is not limited to the embodiments. For example, the number of layers of the substrate is not particularly limited, and may be three or more layers. In the laminated body of three or more layers, the through hole penetrating through the entire laminated structure may be formed from one side to the other of the two or more laminated structures, and the through hole may not be formed from one side to the other side of the laminated body. Through holes above the layer. In the case where the through hole penetrating the entire laminated body is formed, even when the liquid layer is treated on the laminated body, it is easy to suppress the liquid remaining in the through hole.
Example

（實施例1）
在樹脂層厚度0.10 mm、銅箔厚度18 μm、尺寸660 mm×615 mm的環氧樹脂系覆銅積層板（日立化成股份有限公司製造，商品名：MCL-E-679）的兩面形成配線電路而製作了10枚內層基板。(Example 1)
A wiring circuit is formed on both sides of an epoxy resin-based copper-clad laminate (manufactured by Hitachi Chemical Co., Ltd., trade name: MCL-E-679) having a resin layer thickness of 0.10 mm, a copper foil thickness of 18 μm, and a size of 660 mm × 615 mm. Ten inner substrates were produced.

其次，準備樹脂層厚度0.1 mm、尺寸660 mm×615 mm的預浸體A（日立化成股份有限公司製造，商品名：GEA-679）20枚。繼而，藉由銷層壓（pin lamination）方式進行內層基板間的對位。並且，將1枚所述內層基板與2枚所述預浸體A交替配置，在配置於最外側的內層基板的更外側配置1枚預浸體B（與預浸體A同樣的預浸體）。進而，將厚度18 μm、尺寸660 mm×615 mm的電解銅箔（日本電解股份有限公司製造，商品名：YGP-18）配置於預浸體B上，之後藉由真空壓製機進行加熱·加壓壓製而一體化。在加熱·加壓壓製後，為了除去端面露出的預浸體的樹脂，而將基板尺寸切斷為605 mm×500 mm，獲得厚度3.00 mm的結構體A。Next, 20 prepregs A (manufactured by Hitachi Chemical Co., Ltd., trade name: GEA-679) having a resin layer thickness of 0.1 mm and a size of 660 mm × 615 mm were prepared. Then, the alignment between the inner substrates is performed by pin lamination. In addition, one of the inner layer substrates and the two prepregs A are alternately arranged, and one prepreg B is disposed on the outer side of the outermost inner substrate (the same prepreg as the prepreg A) Dip). Further, an electrolytic copper foil (manufactured by Nippon Electrolysis Co., Ltd., trade name: YGP-18) having a thickness of 18 μm and a size of 660 mm × 615 mm was placed on the prepreg B, and then heated and heated by a vacuum press. Compressed and integrated. After the heating and press-pressing, in order to remove the resin of the prepreg exposed on the end surface, the substrate size was cut to 605 mm × 500 mm to obtain a structure A having a thickness of 3.00 mm.

其次，使用數值控制（numerical control，NC）控制開孔機，以直徑0.65 mm的鑽機對準所述結構體A的內層位置進行開孔而形成貫通孔（直徑0.65 mm）。Next, a numerical control (NC) control perforator was used to align the inner layer position of the structural body A with a drill having a diameter of 0.65 mm to form a through hole (diameter 0.65 mm).

其次，藉由過錳酸處理除去孔內的污跡（smear），之後使用加厚無電解銅鍍敷形成厚度25 μm的鍍敷層（導體部）。Next, the smear in the pores was removed by permanganic treatment, and then a plating layer (conductor portion) having a thickness of 25 μm was formed using thick electroless copper plating.

其次，作為非導電性材料而準備埋孔樹脂（太陽油墨製造股份有限公司製造，商品名：THP-100DX1），之後使用真空印刷機藉由網版印刷法進行樹脂埋入。此時的樹脂埋入不對構成貫通多層配線板（最終獲得的積層體）的貫通孔的貫通孔進行，而是對不構成貫通多層配線板的貫通孔的貫通孔進行。其次，對包括埋入了樹脂的部位的基板的整個主面進行加厚無電解銅鍍敷，形成厚度15 μm的銅層。其次，藉由利用蓋孔（tenting）法對銅層進行蝕刻，而製作2枚具有配置於基板中的與構成貫通多層配線板的貫通孔的貫通孔的形成位置鄰接的位置的表面電極A及配置於埋入了樹脂的部位的表面電極B（蓋鍍敷）的印刷配線板。Next, a buried resin (manufactured by Sun Ink Manufacturing Co., Ltd., trade name: THP-100DX1) was prepared as a non-conductive material, and then resin was embedded by a screen printing method using a vacuum printer. In this case, the resin is embedded in the through hole that does not form the through hole penetrating the multilayer wiring board (the layered body finally obtained), and is not formed in the through hole that does not penetrate the through hole of the multilayer wiring board. Next, the entire main surface of the substrate including the portion in which the resin was embedded was subjected to thick electroless copper plating to form a copper layer having a thickness of 15 μm. Then, the copper layer is etched by a tenting method to form two surface electrodes A having positions adjacent to the formation positions of the through holes constituting the through holes penetrating the multilayer wiring board. A printed wiring board that is placed on the surface electrode B (cover plating) where the resin is buried.

其次，針對具有包括含有熱硬化性樹脂的樹脂組成物的樹脂層（標稱厚度：0.075 mm）及配置於樹脂層的單面的PET薄膜（厚度：0.025 mm）的絕緣構件（日立化成股份有限公司製造，商品名：AS-401HS，尺寸605 mm×500 mm），使用NC控制開孔機，以直徑0.55 mm的鑽機，在配置用以對表面電極彼此進行電性連接的導電構件的位置形成貫通孔。進而，在配置用以在積層時保持層間隔的銷的位置形成貫通孔。Next, an insulating member having a resin layer (nominal thickness: 0.075 mm) including a resin composition containing a thermosetting resin and a PET film (thickness: 0.025 mm) disposed on one side of the resin layer (Hitachi Chemical Co., Ltd.) Made by the company, trade name: AS-401HS, size 605 mm × 500 mm), using NC controlled hole drilling machine, with a diameter of 0.55 mm rig, in the position of the conductive member configured to electrically connect the surface electrodes to each other Through hole. Further, a through hole is formed at a position where a pin for maintaining a layer interval at the time of lamination is disposed.

其次，以絕緣構件的樹脂層與第一印刷配線板相接並且自絕緣構件的貫通孔露出表面電極的方式，對第一印刷配線板的其中一面載置絕緣構件。繼而，使用真空層壓機，以溫度85℃、壓力0.5 MPa、加壓時間30秒（真空抽吸30秒）的條件進行加熱·加壓。Next, an insulating member is placed on one surface of the first printed wiring board such that the resin layer of the insulating member is in contact with the first printed wiring board and the surface electrode is exposed from the through hole of the insulating member. Then, heating and pressurization were carried out using a vacuum laminator under the conditions of a temperature of 85 ° C, a pressure of 0.5 MPa, and a pressurization time of 30 seconds (vacuum suction for 30 seconds).

其次，在露出電性連接的表面電極的絕緣構件的貫通孔內填充導電性材料（拓自達（tatsuta）電線股份有限公司製造，商品名：MPA500）。所填充的孔數為12000孔。此時，配置於絕緣構件的表面的PET薄膜成為保護遮罩，從而僅對絕緣構件的貫通孔內供給MPA500，防止了MPA500附著於絕緣構件中的其他部位。Next, a conductive material (manufactured by Tatsuta Electric Wire Co., Ltd., trade name: MPA500) was filled in the through hole of the insulating member exposing the surface electrode to be electrically connected. The number of holes filled was 12,000 holes. At this time, the PET film disposed on the surface of the insulating member serves as a protective mask, and the MPA 500 is supplied only to the through hole of the insulating member, and the MPA 500 is prevented from adhering to other portions of the insulating member.

其次，將配置於絕緣構件的表面的PET薄膜自絕緣構件剝離。繼而，對第一印刷配線板的貫通孔***銷以進行對位，在此基礎上將第二印刷配線板重疊於絕緣構件，之後，藉由真空壓製機以溫度180℃、壓力3 MPa、時間90分鐘的壓製條件進行加熱·加壓壓製，製作了結構體B。此時，以使第一印刷配線板的表面電極與第二印刷配線板的表面電極相向的方式重疊印刷配線板彼此。Next, the PET film disposed on the surface of the insulating member is peeled off from the insulating member. Then, the pin is inserted into the through hole of the first printed wiring board to be aligned, and the second printed wiring board is superposed on the insulating member, and then the temperature is 180 ° C, the pressure is 3 MPa, and the time is controlled by a vacuum press. The structure B was produced by heating and press-pressing under 90-minute pressing conditions. At this time, the printed wiring boards are superimposed so that the surface electrodes of the first printed wiring board face the surface electrodes of the second printed wiring board.

其次，使用雷射開孔機（CO₂ 雷射），對絕緣構件中的自印刷配線板的貫通孔露出的部分進行雷射照射，將貫通孔（直徑0.55 mm）形成於絕緣構件。以輸出6.0 W、週期1.0 ms、脈衝寬度30 μs、發射（shot）數20次的條件進行雷射照射。其結果，將絕緣構件中的位於2枚印刷配線板的貫通孔間的部位除去，獲得具有貫通多層配線板的貫通孔的多層配線板（積層體）。Next, a portion of the insulating member exposed from the through hole of the printed wiring board was subjected to laser irradiation using a laser boring machine (CO ₂ laser), and a through hole (diameter: 0.55 mm) was formed in the insulating member. The laser irradiation was performed under the conditions of an output of 6.0 W, a period of 1.0 ms, a pulse width of 30 μs, and a shot number of 20 times. As a result, a portion of the insulating member between the through holes of the two printed wiring boards is removed, and a multilayer wiring board (layered body) having through holes penetrating the multilayer wiring board is obtained.

（實施例2）
在與實施例1同樣地製作了結構體B之後，使用NC控制開孔機，以直徑0.45 mm的鑽機，在絕緣構件中的自印刷配線板的貫通孔露出的部分，將貫通孔（直徑0.45 mm）形成於絕緣構件，藉此，獲得具有貫通多層配線板的貫通孔的多層配線板（積層體）。(Example 2)
After the structure B was produced in the same manner as in the first embodiment, a through hole (diameter 0.45) was formed in a portion of the insulating member exposed from the through hole of the printed wiring board by using an NC controlled hole puncher with a diameter of 0.45 mm. Mm) is formed on the insulating member, whereby a multilayer wiring board (layered body) having a through hole penetrating the multilayer wiring board is obtained.

10、20‧‧‧基板10, 20‧‧‧ substrate

10a、20a‧‧‧主面 10a, 20a‧‧‧ main faces

12a～12d、22a～22d、32a～32b‧‧‧貫通孔 12a～12d, 22a～22d, 32a～32b‧‧‧through hole

14a～14d、24a～24d‧‧‧導體部 14a～14d, 24a～24d‧‧‧Conductor

16a～16d、26a～26d‧‧‧表面電極 16a～16d, 26a～26d‧‧‧ surface electrode

30‧‧‧絕緣構件 30‧‧‧Insulating components

40‧‧‧埋孔樹脂 40‧‧‧buried resin

50a、50c‧‧‧導電構件 50a, 50c‧‧‧ conductive members

100‧‧‧積層體 100‧‧‧Layer

100a、100b‧‧‧貫通孔 100a, 100b‧‧‧through holes

圖1是表示本發明的一實施方式的積層體的概略剖面圖。Fig. 1 is a schematic cross-sectional view showing a laminated body according to an embodiment of the present invention.

圖2（a）、圖2（b）是表示本發明的另一實施方式的積層體的概略剖面圖。 2(a) and 2(b) are schematic cross-sectional views showing a laminated body according to another embodiment of the present invention.

圖3（a）、圖3（b）是表示本發明的一實施方式的積層體的製造方法的概略剖面圖。 3(a) and 3(b) are schematic cross-sectional views showing a method of manufacturing a laminated body according to an embodiment of the present invention.

圖4（a）、圖4（b）是表示本發明的一實施方式的積層體的製造方法的概略剖面圖。 4(a) and 4(b) are schematic cross-sectional views showing a method of manufacturing a laminated body according to an embodiment of the present invention.

Claims

一種積層體的製造方法，其是具有在第一基板與第二基板之間存在絕緣構件的積層結構的積層體的製造方法，所述積層體的製造方法包括：將貫通所述第一基板的第一貫通孔形成於所述第一基板，將貫通所述第二基板的第二貫通孔形成於所述第二基板，在將所述絕緣構件配置於所述第一基板與所述第二基板之間的狀態下，對所述絕緣構件形成貫通孔，藉由所述第一貫通孔、所述第二貫通孔及所述絕緣構件的所述貫通孔而形成貫通所述積層體的貫通孔的步驟，所述第一基板具有配置於所述第一貫通孔的內壁的第一導體部，所述第二基板具有配置於所述第二貫通孔的內壁的第二導體部，在所述第一基板中的與所述第二基板相向的第一主面中，在與所述第一貫通孔的形成位置不同的位置，配置有第一表面電極，在所述第二基板中的與所述第一基板相向的第二主面中，在與所述第二貫通孔的形成位置不同的位置，配置有第二表面電極，所述第一貫通孔中的與所述第二基板相反的一側的端部跟所述第二貫通孔中的與所述第一基板相反的一側的端部經由所述第一導體部、所述第一表面電極、所述第二表面電極及所述第二導體部而電性連接。A method for producing a laminate, which is a method for producing a laminate having a laminated structure in which an insulating member is present between a first substrate and a second substrate, the method for producing the laminate comprising: a first through hole penetrating the first substrate is formed on the first substrate, a second through hole penetrating the second substrate is formed on the second substrate, and the insulating member is disposed on the first substrate a through hole is formed in the insulating member in a state between the first substrate and the second substrate, and the through hole is formed by the first through hole, the second through hole, and the through hole of the insulating member a step of forming a through hole penetrating the laminated body, The first substrate has a first conductor portion disposed on an inner wall of the first through hole, The second substrate has a second conductor portion disposed on an inner wall of the second through hole, a first surface electrode is disposed at a position different from a position at which the first through hole is formed in the first main surface of the first substrate facing the second substrate, a second surface electrode is disposed at a position different from a position at which the second through hole is formed in the second main surface of the second substrate facing the first substrate, An end of the first through hole opposite to the second substrate and an end of the second through hole opposite to the first substrate via the first conductor portion The first surface electrode, the second surface electrode, and the second conductor portion are electrically connected.

如申請專利範圍第1項所述的積層體的製造方法，其中，藉由雷射加工來形成所述絕緣構件的所述貫通孔。The method for producing a laminated body according to claim 1, wherein the through hole of the insulating member is formed by laser processing.

如申請專利範圍第1項所述的積層體的製造方法，其中，藉由鑽孔加工來形成所述絕緣構件的所述貫通孔。The method for producing a laminated body according to claim 1, wherein the through hole of the insulating member is formed by drilling.

一種積層體，具有在第一基板與第二基板之間存在絕緣構件的積層結構，其中，貫通所述第一基板的第一貫通孔、貫通所述第二基板的第二貫通孔及貫通所述絕緣構件的貫通孔構成貫通所述積層體的貫通孔，所述第一基板具有配置於所述第一貫通孔的內壁的第一導體部，所述第二基板具有配置於所述第二貫通孔的內壁的第二導體部，在所述第一基板中的與所述第二基板相向的第一主面中，在與所述第一貫通孔的形成位置不同的位置，配置有第一表面電極，在所述第二基板中的與所述第一基板相向的第二主面中，在與所述第二貫通孔的形成位置不同的位置，配置有第二表面電極，所述第一貫通孔中的與所述第二基板相反的一側的端部跟所述第二貫通孔中的與所述第一基板相反的一側的端部經由所述第一導體部、所述第一表面電極、所述第二表面電極及所述第二導體部而電性連接。A laminated body having a laminated structure in which an insulating member is present between a first substrate and a second substrate, wherein a first through hole penetrating the first substrate, a second through hole penetrating the second substrate, and a through hole penetrating the insulating member constitute a through hole penetrating the laminated body. The first substrate has a first conductor portion disposed on an inner wall of the first through hole, The second substrate has a second conductor portion disposed on an inner wall of the second through hole, a first surface electrode is disposed at a position different from a position at which the first through hole is formed in the first main surface of the first substrate facing the second substrate, a second surface electrode is disposed at a position different from a position at which the second through hole is formed in the second main surface of the second substrate facing the first substrate, An end of the first through hole opposite to the second substrate and an end of the second through hole opposite to the first substrate via the first conductor portion The first surface electrode, the second surface electrode, and the second conductor portion are electrically connected.

如申請專利範圍第4項所述的積層體，其中，所述第一表面電極與所述第二表面電極藉由配置在所述第一表面電極與所述第二表面電極之間的導電構件而彼此電性連接。The laminate according to claim 4, wherein the first surface electrode and the second surface electrode are disposed by a conductive member disposed between the first surface electrode and the second surface electrode They are electrically connected to each other.

如申請專利範圍第4項或第5項所述的積層體，其中，進而將貫通所述第一基板的第三貫通孔形成於所述第一基板，所述第一基板進而具有配置於所述第三貫通孔的內壁的第三導體部，進而將貫通所述第二基板的第四貫通孔形成於所述第二基板，所述第二基板進而具有配置於所述第四貫通孔的內壁的第四導體部，在所述第一主面配置有第三表面電極，在所述第二主面配置有第四表面電極。The laminate according to claim 4 or 5, wherein Further, a third through hole penetrating the first substrate is formed on the first substrate, The first substrate further has a third conductor portion disposed on an inner wall of the third through hole, Further, a fourth through hole penetrating the second substrate is formed on the second substrate, The second substrate further has a fourth conductor portion disposed on an inner wall of the fourth through hole, Configuring a third surface electrode on the first main surface, A fourth surface electrode is disposed on the second main surface.

如申請專利範圍第6項所述的積層體，其中，在所述第一基板、所述絕緣構件及所述第二基板的積層方向上彼此重疊的位置，形成有所述第三貫通孔及所述第四貫通孔，所述第三表面電極配置於所述第一主面中的所述第三貫通孔的形成位置，所述第四表面電極配置於所述第二主面中的所述第四貫通孔的形成位置。The laminate according to claim 6, wherein The third through hole and the fourth through hole are formed at positions overlapping each other in the stacking direction of the first substrate, the insulating member, and the second substrate. The third surface electrode is disposed at a position where the third through hole in the first main surface is formed, The fourth surface electrode is disposed at a position where the fourth through hole in the second main surface is formed.

如申請專利範圍第6項所述的積層體，其中，在所述第一基板、所述絕緣構件及所述第二基板的積層方向上彼此不重疊的位置，形成有所述第三貫通孔及所述第四貫通孔，所述第三表面電極配置於所述第一主面中的所述第三貫通孔的形成位置，所述第四表面電極配置於所述第二主面中的與所述第三表面電極相向的位置。The laminate according to claim 6, wherein The third through hole and the fourth through hole are formed at positions that do not overlap each other in a stacking direction of the first substrate, the insulating member, and the second substrate. The third surface electrode is disposed at a position where the third through hole in the first main surface is formed, The fourth surface electrode is disposed at a position facing the third surface electrode of the second main surface.

如申請專利範圍第6項至第8項中任一項所述的積層體，其中，所述第三表面電極與所述第四表面電極藉由配置在所述第三表面電極與所述第四表面電極之間的導電構件而彼此電性連接。The laminate according to any one of claims 6 to 8, wherein The third surface electrode and the fourth surface electrode are electrically connected to each other by a conductive member disposed between the third surface electrode and the fourth surface electrode.

如申請專利範圍第6項至第8項中任一項所述的積層體，其中，在所述第三表面電極與所述第四表面電極之間未配置導電構件。The laminate according to any one of claims 6 to 8, wherein A conductive member is not disposed between the third surface electrode and the fourth surface electrode.

如申請專利範圍第4項至第10項中任一項所述的積層體，其中，所述第一貫通孔及所述第二貫通孔中的至少一者的直徑大於所述絕緣構件的所述貫通孔的直徑。The laminate according to any one of claims 4 to 10, wherein A diameter of at least one of the first through hole and the second through hole is larger than a diameter of the through hole of the insulating member.

如申請專利範圍第4項至第11項中任一項所述的積層體，其中，所述第一貫通孔的直徑及所述第二貫通孔的直徑大於所述絕緣構件的所述貫通孔的直徑。The laminate according to any one of claims 4 to 11, wherein The diameter of the first through hole and the diameter of the second through hole are larger than the diameter of the through hole of the insulating member.