TW201929123A - Device manufacturing method - Google Patents

Device manufacturing method Download PDF

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Publication number
TW201929123A
TW201929123A TW108112834A TW108112834A TW201929123A TW 201929123 A TW201929123 A TW 201929123A TW 108112834 A TW108112834 A TW 108112834A TW 108112834 A TW108112834 A TW 108112834A TW 201929123 A TW201929123 A TW 201929123A
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unit
substrate
processing
section
moving
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TW108112834A
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TWI695445B (en
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濱田智秀
鈴木智也
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日商尼康股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/6773—Conveying cassettes, containers or carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H18/00—Winding webs
    • B65H18/08—Web-winding mechanisms
    • B65H18/10—Mechanisms in which power is applied to web-roll spindle
    • B65H18/103—Reel-to-reel type web winding and unwinding mechanisms
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/182—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations
    • B65H23/185—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in unwinding mechanisms or in connection with unwinding operations motor-controlled
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H23/00—Registering, tensioning, smoothing or guiding webs
    • B65H23/04—Registering, tensioning, smoothing or guiding webs longitudinally
    • B65H23/18—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web
    • B65H23/195—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations
    • B65H23/198—Registering, tensioning, smoothing or guiding webs longitudinally by controlling or regulating the web-advancing mechanism, e.g. mechanism acting on the running web in winding mechanisms or in connection with winding operations motor-controlled (Controlling electrical drive motors therefor)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776—Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2220/00—Function indicators
    • B65H2220/02—Function indicators indicating an entity which is controlled, adjusted or changed by a control process, i.e. output
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2513/00—Dynamic entities; Timing aspects
    • B65H2513/10—Speed
    • B65H2513/11—Speed angular
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/11—Dimensional aspect of article or web
    • B65H2701/113—Size
    • B65H2701/1133—Size of webs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2701/00—Handled material; Storage means
    • B65H2701/10—Handled articles or webs
    • B65H2701/17—Nature of material
    • B65H2701/175—Plastic
    • B65H2701/1752—Polymer film
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2801/00—Application field
    • B65H2801/61—Display device manufacture, e.g. liquid crystal displays
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere

Abstract

A cassette apparatus includes a first unit which performs one of a supply and a recovery of the substrate, and a second unit which performs another of the supply and the recovery of the substrate, wherein the first unit and the second unit are capable to move close to each other and move away from each other.

Description

元件製造方法Element manufacturing method

本發明係關於一種匣裝置、基板搬送裝置、基板處理裝置、及基板處理方法。
本申請根據2012年4月13日申請之日本特願2012-092132號主張優先權，將其內容援引於此。The present invention relates to a cassette device, a substrate transfer device, a substrate processing device, and a substrate processing method.
This application claims priority based on Japanese Patent Application No. 2012-092132 for which it applied on April 13, 2012, and uses the content here.

作為構成顯示器裝置等顯示裝置(顯示面板)之顯示元件，例如已知有液晶顯示元件、有機電致發光(有機EL)元件。目前，此等顯示元件係以與各像素對應在基板表面形成薄膜電晶體(Thin Film Transistor：TFT)之主動元件(Active device)漸為主流。As a display element constituting a display device (display panel) such as a display device, a liquid crystal display element or an organic electroluminescence (organic EL) element is known, for example. At present, these display elements are mainly mainstreamed with active devices (Thin Film Transistor: TFT) formed on the substrate surface corresponding to each pixel.

近年來，提出了一種在具有可撓性之片狀之基板(例如薄膜構件等)上形成顯示元件之技術。作為此種技術，例如有一種被稱為捲軸對捲軸(roll to roll)方式(以下，簡記為「捲軸方式」)者廣為人知(例如，參照專利文獻1)。捲軸方式，係將捲繞在基板供應側之供應用滾筒之一片之片狀基板(例如，帶狀之薄膜構件)送出、並一邊將送出之基板以基板回收側之回收用滾筒加以捲繞一邊藉由設置在供應用滾筒與回收用滾筒之間之處理裝置施加用以在基板上形成顯示面板或太陽電池面板等之電子元件之所欲加工處理。In recent years, a technique for forming a display element on a flexible sheet-like substrate (such as a film member) has been proposed. As such a technique, for example, there is a method known as a roll to roll method (hereinafter, simply referred to as a “roll method”) (for example, refer to Patent Document 1). The reel method is a method in which a sheet-like substrate (for example, a film-like film member) wound around one of the supply rollers on the substrate supply side is sent out, and the sent-out substrate is wound by a recycling roller on the substrate recovery side A processing device provided between the supply roller and the recycling roller is used to apply a desired processing process for forming electronic components such as a display panel or a solar cell panel on a substrate.

此外，在基板送出至被捲繞為止之期間，例如使用複數個搬送滾筒等搬送基板，在生產顯示面板之情形，使用複數個處理裝置(單元)來形成構成TFT之閘極電極、閘極絕緣膜、半導體膜、源極－汲極電極等，在基板之被處理面上依序形成顯示元件之構成要件。例如，在形成有機EL元件之情形時，係於基板上依序形成發光層、陽極、陰極、電路等。In addition, during the period from when the substrate is delivered to when it is wound, for example, a plurality of conveyance rollers are used to convey the substrate, and when a display panel is produced, a plurality of processing devices (units) are used to form the gate electrode and the gate insulation of the TFT. A film, a semiconductor film, a source-drain electrode, etc., sequentially form the constituent elements of a display element on the surface to be processed of the substrate. For example, in the case of forming an organic EL element, a light emitting layer, an anode, a cathode, and a circuit are sequentially formed on a substrate.

專利文獻1：國際公開第2006／100868號Patent Document 1: International Publication No. 2006/100868

然而，在上述構成，從送出至被捲繞為止之期間，由於基板掛架在複數個處理裝置，因此基板之全長變長，會有基板之管理不易之情形。However, in the above-mentioned configuration, since the substrate holder is mounted on a plurality of processing apparatuses from the time when the substrate is taken out to the time when the substrate is wound, the overall length of the substrate becomes long, which may make it difficult to manage the substrate.

本發明形態之目的在於提供一種能減輕搬送時基板之管理負擔之匣裝置、基板搬送裝置、基板處理裝置。An object of the aspect of the present invention is to provide a cassette device, a substrate transfer device, and a substrate processing device capable of reducing a management burden on a substrate during transfer.

本發明第一形態之匣裝置，具有：第一單元部，進行基板之供應及回收之一方；以及第二單元部，進行基板之供應及回收之另一方；第一單元部及第二單元部可彼此接近或分離。A cassette device according to a first aspect of the present invention includes: a first unit section for supplying and recovering a substrate; and a second unit section for supplying and recovering a substrate; a first unit section and a second unit section Can be approached or separated from each other.

本發明第二形態之基板搬送裝置，具有：第一單元部，係設成可在第一移動路徑移動，進行基板之供應及回收之一方；第二單元部，係設成可在第二移動路徑移動，進行基板之供應及回收之另一方；以及控制部，對配置在第一移動路徑與第二移動路徑之間之第一基板處理部，控制第一單元部使其進行基板之供應及回收之一方，且控制第二單元部使其進行基板之供應及回收之另一方；控制部對配置在第一移動路徑與第二移動路徑之間且與第一基板處理部不同之第二基板處理部，使第一單元部及第二單元部移動，控制第一單元部使其進行基板之供應及回收之另一方，且控制第二單元部使其進行該基板之供應及回收之一方。The substrate conveying device according to the second aspect of the present invention includes: a first unit section provided to be movable on the first moving path to supply and recover substrates; and a second unit section provided to be movable on the second The other side of the path movement to supply and recycle substrates; and the control unit, for the first substrate processing unit disposed between the first movement path and the second movement path, controls the first unit unit to perform substrate supply and recovery One party recovers and controls the second unit section to supply and recover the substrate; the control section controls a second substrate disposed between the first movement path and the second movement path and different from the first substrate processing part The processing unit moves the first unit portion and the second unit portion, controls the first unit portion to perform the other side of the substrate supply and recovery, and controls the second unit portion to perform the one side of the substrate supply and recovery.

本發明第三形態之基板處理裝置，具備：複數個處理部，係配置在第一移動路徑與第二移動路徑之間，對具有可撓性之基板進行處理；以及本發明第二形態之基板搬送裝置。A substrate processing apparatus according to a third aspect of the present invention includes a plurality of processing sections disposed between the first movement path and the second movement path to process a flexible substrate; and a substrate of the second aspect of the present invention. Transfer device.

本發明第四形態之基板處理方法，係用以將具有可撓性之長帶基板依序送至複數個處理裝置，並在該基板上形成電子元件，其特徵在於，包含：第一處理步驟，將包含在長邊方向捲繞有待供應至第一基板處理部之該基板之供應滾筒之第一單元部、與包含在長邊方向捲繞待從該第一基板處理部回收之該基板之回收滾筒之第二單元部配置成夾著該第一基板處理部，藉由該第一基板處理部處理從該供應滾筒供應之該基板後以該回收滾筒回收；第一移動步驟，使該第一單元部與該第二單元部一起沿著該供應滾筒與該回收滾筒之間之該基板從該第一基板處理部離開之第一方向移動；第二移動步驟，為了縮小該供應滾筒與該回收滾筒在該長邊方向之間隔，使該第一單元部與該第二單元部之至少一方沿著與該第一方向交叉之第二方向移動；以及第三移動步驟，使以既定間隔對向之該第一單元部與該第二單元部隨著該第一方向之並進運動、該第二方向之並進運動、在包含該第一方向與第二方向之面內之旋轉運動中之至少二個運動，一起朝向與該第一基板處理部不同之第二基板處理部移動。The substrate processing method of the fourth aspect of the present invention is used to sequentially send a flexible long-ribbed substrate to a plurality of processing devices and form an electronic component on the substrate. The method includes: a first processing step A first unit including a supply roller including the substrate to be supplied to the first substrate processing section wound in the longitudinal direction, and a substrate including the substrate to be recovered from the first substrate processing section wound in the longitudinal direction The second unit portion of the recovery roller is configured to sandwich the first substrate processing portion, and the substrate supplied from the supply roller is processed by the first substrate processing portion to be recovered by the recovery roller; a first moving step causes the first A unit part moves together with the second unit part along a first direction in which the substrate between the supply roller and the recovery roller leaves from the first substrate processing section; a second moving step is to reduce the supply roller and the The interval of the recovery roller in the long side direction causes at least one of the first unit portion and the second unit portion to move in a second direction crossing the first direction; and a third moving step such that The first unit portion and the second unit portion facing a predetermined interval move side by side with the first direction, the second direction, and the rotational movement in a plane including the first direction and the second direction. At least two of the movements move together toward a second substrate processing section different from the first substrate processing section.

根據本發明之形態，能減輕搬送時基板之管理負擔。According to the aspect of the present invention, it is possible to reduce the management burden of the substrate during transportation.

(第一實施形態)
以下，參照圖式說明本發明之第一實施形態。
圖1係顯示本實施形態之基板處理裝置(基板搬送裝置)100之整體構成之立體圖。如圖1所示，基板處理裝置100具有對具有可撓性之片狀基板(例如，帶狀之薄膜構件)S進行既定處理之處理部(第一基板處理部、第二基板處理部)10、搬送基板S之搬送部(匣裝置)20、及統籌控制處理部10及匣裝置20之控制部CONT。基板處理裝置100係設在例如製造工廠之地面FL上。(First Embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing the overall configuration of a substrate processing apparatus (substrate transfer apparatus) 100 according to this embodiment. As shown in FIG. 1, the substrate processing apparatus 100 includes a processing unit (a first substrate processing unit and a second substrate processing unit) 10 that performs a predetermined process on a flexible sheet substrate (for example, a thin film member) S. , A transport unit (box device) 20 that transports the substrate S, and an integrated control processing unit 10 and a control unit CONT of the box device 20. The substrate processing apparatus 100 is installed on the floor FL of a manufacturing plant, for example.

基板處理裝置100為對基板S之處理面(表面)執行各種處理之捲軸對捲軸(roll to roll)方式(以下，簡記為「捲軸方式」)之裝置。基板處理裝置100係用在在基板S上形成例如有機EL元件、液晶顯示元件等之顯示元件(電子元件)之情形。當然，在形成此等元件以外之元件(例如，太陽電池、濾色器、觸碰面板等)之系統使用基板處理裝置100亦可。The substrate processing apparatus 100 is a roll-to-roll method (hereinafter, simply referred to as a “roll method”) that performs various processes on the processing surface (surface) of the substrate S. The substrate processing apparatus 100 is used when a display element (electronic element) such as an organic EL element or a liquid crystal display element is formed on the substrate S. Of course, the substrate processing apparatus 100 may be used in a system for forming elements other than these elements (for example, solar cells, color filters, touch panels, etc.).

以下，說明本實施形態之基板處理裝置100之構成時，設定XYZ正交座標系統，一邊參照此XYZ正交座標系統一邊說明各構件之位置關係。以下之圖中，設XYZ正交座標系統中與地面FL平行之平面為XY平面。設XY平面中基板S移動之方向為Y軸方向、與Y軸方向正交之方向為X軸方向。又，設與地面FL(XY平面)垂直之方向為Z軸方向。又，將繞Z軸旋轉之方向記載為θZ軸方向。Hereinafter, when describing the configuration of the substrate processing apparatus 100 according to this embodiment, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to the XYZ orthogonal coordinate system. In the following figures, let the plane parallel to the ground FL in the XYZ orthogonal coordinate system be the XY plane. The direction in which the substrate S moves in the XY plane is the Y-axis direction, and the direction orthogonal to the Y-axis direction is the X-axis direction. The direction perpendicular to the ground FL (XY plane) is the Z-axis direction. The direction of rotation around the Z axis is described as the θZ axis direction.

作為在基板處理裝置100作為處理對象之基板S，可使用例如樹脂膜或不鏽鋼等之箔(foil)。樹脂膜可使用例如聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯基共聚物(Ethylene vinyl copolymer)樹脂、聚氯乙烯基樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、乙酸乙烯基樹脂、聚對苯二甲酸乙二醇酯、聚奈二甲酸乙二醇酯、不鏽鋼箔等材料。As the substrate S to be processed in the substrate processing apparatus 100, for example, a foil such as a resin film or stainless steel can be used. For the resin film, for example, polyethylene resin, polypropylene resin, polyester resin, Ethylene vinyl copolymer resin, polyvinyl chloride resin, cellulose resin, polyamide resin, polyimide resin, Polycarbonate resin, polystyrene resin, vinyl acetate resin, polyethylene terephthalate, polyethylene naphthalate, stainless steel foil and other materials.

基板S之短邊方向之尺寸係形成為例如50cm～2m程度、長邊方向之尺寸(一捲軸量之尺寸)則形成為例如10m以上。當然，此尺寸僅為一例，並不限於此例。例如基板S之短邊方向之尺寸為1m以下、或50cm以下亦可、亦可為2m以上。又，基板S之長邊方向之尺寸亦可在10m以下。The dimension in the short-side direction of the substrate S is, for example, about 50 cm to 2 m, and the dimension in the long-side direction (the size of one reel) is, for example, 10 m or more. Of course, this size is only an example, and it is not limited to this example. For example, the dimension in the short-side direction of the substrate S may be 1 m or less, or 50 cm or less, or may be 2 m or more. The size of the substrate S in the longitudinal direction may be 10 m or less.

基板S係形成為例如具有1mm以下之厚度且具有可撓性。此處，所謂可撓性，係指例如對基板施以至少自重程度之既定力亦不會斷裂或破裂、而能將該基板加以彎折之性質。此外，例如因上述既定力而彎折之性質亦包含於所指之可撓性。又，上述可撓性會隨著該基板材質、大小、厚度、温度、或周圍之溫度、溼度等之環境等而改變。再者，基板S可使用一片帶狀之基板、亦可使用將複數個單位基板加以連接而形成為帶狀之構成。The substrate S is formed to have a thickness of, for example, 1 mm or less and has flexibility. Here, the term "flexible" refers to a property that the substrate can be bent without applying a predetermined force of at least a degree of its own weight to the substrate without breaking or cracking. In addition, the property of bending due to the above-mentioned predetermined force is also included in the flexibility referred to. In addition, the flexibility described above may vary depending on the substrate material, size, thickness, temperature, ambient temperature, humidity, and the like. In addition, as the substrate S, a single strip-shaped substrate may be used, or a structure in which a plurality of unit substrates are connected to form a strip shape may be used.

基板S，以承受較高溫度(例如200℃程度)之熱其尺寸亦無實質上變化(熱變形小)之熱膨脹係數較小者較佳。例如可將無機填料混於樹脂膜以降低熱膨脹係數。作為無機填料，例如有氧化鈦、氧化鋅、氧化鋁、氧化矽等。It is preferable that the substrate S has a smaller coefficient of thermal expansion to withstand the heat of a higher temperature (for example, about 200 ° C.) and has no substantial change in size (small thermal deformation). For example, an inorganic filler may be mixed in a resin film to reduce the thermal expansion coefficient. Examples of the inorganic filler include titanium oxide, zinc oxide, aluminum oxide, and silicon oxide.

基板處理裝置100係設置在元件製造之工廠內。在工廠內之地面FL形成有導軌(第一移動路徑、第二移動路徑)30。導軌30具有第一軌道31、第二軌道32及第三軌道33。第一軌道31及第二軌道32係形成為在複數個處理部之排列方向(X軸方向)延伸。又，第一軌道31在Y軸方向配置在處理部10之一側，第二軌道32在Y軸方向配置在處理部10之另一側。亦即，第一軌道31及第二軌道32係設在於Y軸方向夾著處理部10之位置。第三軌道33在X軸方向分別配置在複數個處理部10之間。第三軌道33係形成為與Y軸方向平行，將第一軌道31與第二軌道32加以連接。在第一軌道31、第二軌道32及第三軌道33設定有例如X座標或Y座標等之位置資訊。上述位置資訊係以可藉由光感測器或磁感測器等感測器讀取之方式形成在各軌道。The substrate processing apparatus 100 is installed in a device manufacturing factory. A guide rail (first moving path, second moving path) 30 is formed on the floor FL in the factory. The guide rail 30 includes a first rail 31, a second rail 32, and a third rail 33. The first track 31 and the second track 32 are formed so as to extend in the arrangement direction (X-axis direction) of the plurality of processing sections. The first track 31 is arranged on one side of the processing unit 10 in the Y-axis direction, and the second track 32 is arranged on the other side of the processing unit 10 in the Y-axis direction. That is, the first rail 31 and the second rail 32 are provided at positions where the processing unit 10 is sandwiched in the Y-axis direction. The third rail 33 is disposed between the plurality of processing units 10 in the X-axis direction. The third rail 33 is formed parallel to the Y-axis direction, and connects the first rail 31 and the second rail 32. The first track 31, the second track 32, and the third track 33 are set with position information such as an X coordinate or a Y coordinate. The position information is formed on each track in such a manner that it can be read by a sensor such as a light sensor or a magnetic sensor.

基板處理裝置100具備匣裝置20。此匣裝置20具有進行基板S之供應及回收中之一方之第一單元部21、進行基板S之供應及回收中之另一方之第二單元部22。此外，基板S從第一單元部21及第二單元部22之一側被搬送至另一側。
第一單元部21及第二單元部22係分別準備有複數個。在地面FL設有使第一單元部21及第二單元部22之至少一方待機之緩衝部BF。在此緩衝部BF能使第一單元部21及第二單元部22待機。緩衝部BF係透過導軌30之一部分連接於第一軌道31、第二軌道32或第三軌道33。The substrate processing apparatus 100 includes a cassette apparatus 20. This cassette device 20 has a first unit section 21 that performs one of the supply and recovery of the substrate S, and a second unit section 22 that performs the other one of the supply and recovery of the substrate S. The substrate S is carried from one side of the first unit portion 21 and the second unit portion 22 to the other side.
A plurality of first unit portions 21 and second unit portions 22 are prepared. The floor FL is provided with a buffer portion BF that makes at least one of the first unit portion 21 and the second unit portion 22 stand by. Here, the buffer unit BF can make the first unit unit 21 and the second unit unit 22 stand by. The buffer portion BF is connected to the first rail 31, the second rail 32, or the third rail 33 through a part of the guide rail 30.

圖2係顯示匣裝置20中之第一單元部21側之構成之分解立體圖。圖3係顯示匣裝置20之一部分構成之圖。以下，為了方便說明，使圖2及圖3中X軸方向、Y軸方向、Z軸方向之顯示與圖1對應。
匣裝置20具備使第一單元部21對第二移動部22移動之移動機構24。移動機構24具備使第一單元部21移動之移動部(第一移動部)42。又，匣裝置20具有後述移動部側通訊部44及接觸抑制部47。FIG. 2 is an exploded perspective view showing the configuration on the first unit portion 21 side of the cassette device 20. FIG. 3 is a diagram showing a part of the structure of the cassette device 20. Hereinafter, for convenience of explanation, the display in the X-axis direction, the Y-axis direction, and the Z-axis direction in FIGS. 2 and 3 corresponds to FIG. 1.
The cassette device 20 includes a moving mechanism 24 that moves the first unit portion 21 to the second moving portion 22. The moving mechanism 24 includes a moving section (first moving section) 42 that moves the first unit section 21. In addition, the cassette device 20 includes a moving portion-side communication portion 44 and a contact suppressing portion 47 described later.

第一單元部21具有第一壁部40a、第二壁部40b、底部40c及外部連接部40d。又，在第一單元部21設有電池等之電源部(未圖示)。The first unit portion 21 includes a first wall portion 40a, a second wall portion 40b, a bottom portion 40c, and an external connection portion 40d. A power source unit (not shown) such as a battery is provided in the first unit unit 21.

第一壁部40a及第二壁部40b分別形成為板狀。第一壁部40a例如配置在-X軸側之端部。第二壁部40b例如配置在+X軸側之端部。第一壁部40a及第二壁部40b彼此平行地配置。此外，第一壁部40a及第二壁部40b形成為門狀亦可。The first wall portion 40a and the second wall portion 40b are each formed in a plate shape. The first wall portion 40a is arranged at, for example, an end portion on the −X axis side. The second wall portion 40b is arranged, for example, at an end portion on the + X axis side. The first wall portion 40a and the second wall portion 40b are arranged parallel to each other. The first wall portion 40a and the second wall portion 40b may be formed in a door shape.

底部40c係形成為與XY平面(地面FL)平行，將第一壁部40a及第二壁部40b加以連結。外部連接部40d例如以在X軸方向延伸之圓柱之棒狀構件形成，設在第一單元部21之+Y軸側端部。第一單元部21之+Y軸側端部係作為連接於外部之搬送機構之連接部作用。外部連接部40d係設在第一單元部21之高度方向(Z軸方向)之例如二個部位。The bottom portion 40c is formed parallel to the XY plane (ground surface FL), and connects the first wall portion 40a and the second wall portion 40b. The external connection portion 40 d is formed, for example, as a cylindrical rod-shaped member extending in the X-axis direction, and is provided at the + Y-axis side end portion of the first unit portion 21. The + Y-axis side end portion of the first unit portion 21 functions as a connection portion of an external transfer mechanism. The external connection portion 40 d is provided at, for example, two locations in the height direction (Z-axis direction) of the first unit portion 21.

在第一壁部40a及第二壁部40b中之連接部側之角部分別形成有缺口部40f。缺口部40f係設成可抵接於外部構造物。藉由使缺口部40f抵接於外部構造物，在第一單元部21與上述外部構造物之間進行定位。此外，圖2中，缺口部40f雖形成在+Y軸側端部，但例如為在- Y軸側端部設有缺口部40f之構成亦可。此情形，藉由使缺口部40f抵接於處理部10之一部分，可在第一單元部21與處理部10之間進行定位。Notch portions 40f are formed in corner portions on the connection portion side of the first wall portion 40a and the second wall portion 40b, respectively. The notch portion 40f is provided so as to be in contact with an external structure. Positioning the notch portion 40f against the external structure allows positioning between the first unit portion 21 and the external structure. In addition, although the notch part 40f is formed in the + Y-axis side end part in FIG. 2, for example, the notch part 40f may be provided in the -Y-axis side end part. In this case, positioning of the first unit portion 21 and the processing portion 10 can be performed by abutting the notch portion 40f on a portion of the processing portion 10.

在第一壁部40a及第二壁部40b之- Y軸側端部分別形成有第一連接部23a。第一單元部21係透過上述第一連接部23a連接於第二單元部22。作為第一連接部23a，使用例如可自動切換裝卸狀態之構成，例如電磁石等。A first connecting portion 23a is formed at each of the −Y-axis side end portions of the first wall portion 40a and the second wall portion 40b. The first unit portion 21 is connected to the second unit portion 22 through the first connection portion 23a. As the first connection portion 23a, for example, a structure capable of automatically switching the attachment / detachment state, for example, a magnet or the like is used.

第一單元部21具有收容基板之第一收容部40。在此第一收容部40設有安裝有捲繞有基板S之基板供應滾筒(供應捲軸)41c之基板驅動部(第一基板驅動部)41。基板驅動部41，藉由使基板S旋轉進行對第二單元部22側供應基板S之供應動作。基板驅動部41具有軸部(第一軸部)41a及旋轉驅動部(第一驅動部)41b。軸部41a形成為圓筒狀或圓柱狀，構成為可伸縮。藉由軸部41a伸縮，可從第一壁部40a與第二壁部40b之間移除，基板供應滾筒41c之安裝成為可能。軸部41a係配置成例如中心軸之軸線方向與X軸方向成為平行。軸部41a之一端部係藉由第一單元部21之第二壁部40b可旋轉地支承在圓周方向。在軸部41a設有可保持基板供應滾筒41c之端部之保持部(未圖示)。旋轉驅動部41b使軸部41a旋轉。藉由旋轉驅動部41b使軸部41a旋轉，基板S之供應動作(送出動作)成為可能。The first unit section 21 includes a first storage section 40 that stores a substrate. Here, the first storage section 40 is provided with a substrate driving section (first substrate driving section) 41 on which a substrate supply roller (supply reel) 41c on which the substrate S is wound is mounted. The substrate driving section 41 rotates the substrate S to perform a supply operation for supplying the substrate S to the second unit section 22 side. The substrate driving section 41 includes a shaft section (first shaft section) 41 a and a rotation driving section (first driving section) 41 b. The shaft portion 41a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. The shaft portion 41a can be removed from between the first wall portion 40a and the second wall portion 40b by the expansion and contraction of the shaft portion 41a, and mounting of the substrate supply roller 41c becomes possible. The shaft part 41a is arrange | positioned so that the axial direction of a central axis may become parallel to an X-axis direction, for example. One end portion of the shaft portion 41 a is rotatably supported in the circumferential direction by the second wall portion 40 b of the first unit portion 21. The shaft portion 41a is provided with a holding portion (not shown) that can hold an end portion of the substrate supply roller 41c. The rotation driving portion 41b rotates the shaft portion 41a. When the shaft portion 41a is rotated by the rotation driving portion 41b, the supply operation (feed-out operation) of the substrate S becomes possible.

在第一收容部40設有安裝有保護基板供應滾筒48c之保護基板驅動部(第一輔助部)48。在保護基板供應滾筒48c捲繞有覆蓋基板S之被處理面之保護基板(保護膜)C。保護基板驅動部48，藉由使保護基板供應滾筒48c旋轉，進行對第二單元部22側供應保護基板C之供應動作。保護基板C藉由覆蓋基板S之被處理面保護該被處理面。保護基板C係使用與基板S相同具有可撓性之材料形成為帶狀，具有與基板S大致相同之尺寸。The first storage portion 40 is provided with a protective substrate driving portion (first auxiliary portion) 48 on which a protective substrate supply roller 48c is mounted. A protective substrate (protective film) C covering the processing surface of the substrate S is wound around the protective substrate supply roller 48c. The protective substrate driving section 48 rotates the protective substrate supply roller 48 c to perform a supply operation of supplying the protective substrate C to the second unit section 22 side. The protective substrate C protects the processed surface by covering the processed surface of the substrate S. The protective substrate C is formed in a strip shape using the same flexible material as the substrate S, and has a size substantially the same as that of the substrate S.

保護基板驅動部48具有軸部48a及旋轉驅動部48b。軸部48a形成為圓筒狀或圓柱狀，構成為可伸縮。藉由軸部48a伸縮，可從第一壁部40a與第二壁部40b之間移除，保護基板供應滾筒48c之安裝成為可能。軸部48a係配置成例如中心軸之軸線方向與X軸方向成為平行。亦即，軸部41a及軸部48a係配置成中心軸之軸線方向成為彼此平行。軸部48a之一端部係藉由第一單元部21之第二壁部40b可旋轉地支承在圓周方向。在軸部48a設有可保持保護基板供應滾筒48c之端部之保持部(未圖示)。旋轉驅動部48b使軸部48a旋轉。藉由旋轉驅動部48b使軸部48a旋轉，保護基板C之供應動作(送出動作)成為可能。在保護基板驅動部48設有將送出之保護基板C重疊於基板S之機構(未圖示)。The protective substrate driving portion 48 includes a shaft portion 48 a and a rotation driving portion 48 b. The shaft portion 48a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. As the shaft portion 48a expands and contracts, it can be removed from between the first wall portion 40a and the second wall portion 40b, and installation of the protective substrate supply roller 48c becomes possible. The shaft part 48a is arrange | positioned so that the axial direction of a central axis may become parallel to an X-axis direction, for example. That is, the shaft portion 41a and the shaft portion 48a are arranged so that the axial directions of the central axis become parallel to each other. One end portion of the shaft portion 48 a is rotatably supported in the circumferential direction by the second wall portion 40 b of the first unit portion 21. The shaft portion 48a is provided with a holding portion (not shown) that can hold an end portion of the protective substrate supply roller 48c. The rotation driving portion 48b rotates the shaft portion 48a. By rotating the shaft portion 48a by the rotation driving portion 48b, the supply operation (feed-out operation) of the protective substrate C is enabled. The protective substrate driving unit 48 is provided with a mechanism (not shown) for overlapping the sent-out protective substrate C on the substrate S.

第一單元部21具有基板側通訊部(第一通訊部)43。基板側通訊部43係設在第一壁部40a之+Z軸側端面。基板側通訊部43例如可在與控制部CONT或第二單元部22等之間進行通訊。The first unit section 21 includes a substrate-side communication section (first communication section) 43. The substrate-side communication portion 43 is provided on the + Z-axis side end surface of the first wall portion 40a. The board-side communication unit 43 can communicate with, for example, the control unit CONT, the second unit unit 22, and the like.

第一單元部21具有接觸抑制部47。接觸抑制部47係設在第一壁部40a及第二壁部40b之+Y側端面。接觸抑制部47抑制第一壁部40a及第二壁部40b之+Y側端面與外部構造物接觸，且緩和接觸時之衝擊。接觸抑制部47具有例如從第一壁部40a及第二壁部40b往+Y軸側突出之棒狀構件、及承受對該棒狀構件作用之-Y軸方向之力之彈性構件。The first unit portion 21 includes a contact suppression portion 47. The contact suppressing portion 47 is provided on the + Y-side end faces of the first wall portion 40a and the second wall portion 40b. The contact suppressing portion 47 suppresses the + Y-side end surfaces of the first wall portion 40a and the second wall portion 40b from coming into contact with the external structure, and mitigates the impact during the contact. The contact suppressing portion 47 includes, for example, a rod-shaped member protruding from the first wall portion 40 a and the second wall portion 40 b toward the + Y-axis side, and an elastic member that receives a force in the −Y-axis direction acting on the rod-shaped member.

上述移動部42將第一單元部21支承成可移除。移動部42使第一單元部21往X軸方向、Y軸方向及Z軸方向移動。移動部42具有筐體51、腳輪52、升降部53、及腳輪驅動部54。又，在移動部42設有電池等之電源部(未圖示)。The moving portion 42 supports the first unit portion 21 so as to be removable. The moving section 42 moves the first unit section 21 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The moving section 42 includes a housing 51, a caster 52, a lifting section 53, and a caster driving section 54. A power supply unit (not shown) such as a battery is provided in the moving unit 42.

筐體51具有可動部51a及基部51b。可動部51a係設在筐體51之+Z軸側端部，設成藉由升降部53之驅動可往Z軸方向移動。藉由可動部51a往+Z軸方向移動，第一單元部21與上述可動部51a一體地往+Z軸方向移動。基部51b將可動部51a支承成可移動。The casing 51 includes a movable portion 51a and a base portion 51b. The movable portion 51 a is provided at the + Z-axis side end portion of the casing 51 and is configured to be movable in the Z-axis direction by the driving of the lifting portion 53. When the movable portion 51a is moved in the + Z axis direction, the first unit portion 21 and the movable portion 51a are moved in the + Z axis direction integrally. The base portion 51b supports the movable portion 51a so as to be movable.

腳輪52在筐體51之基部51b之-Z軸側端面設有四個。腳輪52係設成可藉由腳輪驅動部54之驅動而旋轉。藉由腳輪52旋轉，筐體51及第一單元部21一體地往X軸方向、Y軸方向及θZ軸方向移動。Four casters 52 are provided on the -Z axis side end surface of the base portion 51b of the casing 51. The caster 52 is provided so as to be rotatable by the drive of the caster driving portion 54. When the caster 52 is rotated, the housing 51 and the first unit portion 21 are integrally moved in the X-axis direction, the Y-axis direction, and the θZ-axis direction.

在可動部51a之+Z軸側之端面51c形成有槽部50。槽部50係V字狀形成在上述端面51c。另一方面，在第一單元部21之-Z軸側之端面40e形成有四個球狀支承部49。上述四個球狀支承部49分別支承於上述槽部50。藉由球狀支承部49支承於槽部50，限制往在第一單元部21與筐體51之間之X軸方向及Y軸方向之相對移動。此外，槽部50及球狀支承部49之數量分別為三個亦可。A groove portion 50 is formed on the end surface 51c on the + Z axis side of the movable portion 51a. The groove portion 50 is formed in a V shape on the end surface 51c. On the other hand, four spherical support portions 49 are formed on the end surface 40 e on the -Z axis side of the first unit portion 21. The four spherical support portions 49 are supported by the groove portions 50, respectively. The spherical support portion 49 is supported by the groove portion 50 to restrict relative movement in the X-axis direction and the Y-axis direction between the first unit portion 21 and the housing 51. The number of the groove portions 50 and the spherical support portions 49 may be three each.

又，在可動部51a設有裝卸檢測部46。裝卸檢測部46檢測第一單元部21是否安裝在筐體51。作為裝卸檢測部46，可使用例如檢測在槽部50與球狀支承部49之間之電阻值之感測器或檢測在槽部50之壓力之感測器等之各種感測器。裝卸檢測部46之檢測結果例如從移動部側通訊部44傳送至外部(控制部CONT、基板側通訊部43等)。In addition, the movable unit 51a is provided with an attachment / detachment detection unit 46. The attachment / detachment detection section 46 detects whether or not the first unit section 21 is attached to the casing 51. As the attachment / detachment detection unit 46, for example, various sensors such as a sensor that detects a resistance value between the groove portion 50 and the spherical support portion 49 or a sensor that detects a pressure in the groove portion 50 can be used. The detection result of the attachment / detachment detection unit 46 is transmitted from the mobile unit side communication unit 44 to the outside (the control unit CONT, the substrate side communication unit 43, etc.), for example.

移動部42具有移動部側通訊部(第一通訊部)44。移動部側通訊部44係設在筐體51之內部。移動部側通訊部44可在與例如控制部CONT或基板側通訊部43、第二單元部22等之間進行通訊。基板側通訊部43或移動部側通訊部44可接收用以控制第一單元部21之動作之第一控制訊號。在第一控制訊號包含例如控制移動部42之移動動作之訊號、或控制在第一單元部21之基板S之供應及回收動作之訊號等。The moving section 42 includes a moving section-side communication section (first communication section) 44. The moving part side communication part 44 is provided inside the casing 51. The mobile-portion communication unit 44 can communicate with, for example, the control unit CONT, the board-side communication unit 43, the second unit unit 22, and the like. The substrate-side communication unit 43 or the mobile-unit communication unit 44 may receive a first control signal for controlling the operation of the first unit unit 21. The first control signal includes, for example, a signal that controls the movement operation of the mobile unit 42 or a signal that controls the supply and recovery operation of the substrate S in the first unit unit 21.

如圖3所示，在筐體51之基部51b之-Z側之端面51d(與地面FL對向之面)設有位置檢測部(第一檢測部)55。位置檢測部55檢測第一單元部21之位置資訊。位置檢測部55，作為上述位置資訊，檢測例如設定在導軌30(第一軌道31、第二軌道32及第三軌道33)之位置資訊。位置檢測部55之檢測結果例如從移動部側通訊部44傳送至外部(控制部CONT、基板側通訊部43等)。例如，控制部CONT使用位置檢測部55之檢測結果使第一單元部21沿著導軌30移動。As shown in FIG. 3, a position detection section (first detection section) 55 is provided on the end surface 51d (the surface facing the ground FL) of the -Z side of the base portion 51b of the housing 51. The position detection section 55 detects the position information of the first unit section 21. The position detection unit 55 detects, as the position information, position information set on the guide rail 30 (the first rail 31, the second rail 32, and the third rail 33), for example. The detection result of the position detection unit 55 is transmitted from the mobile unit side communication unit 44 to the outside (the control unit CONT, the substrate side communication unit 43, etc.), for example. For example, the control unit CONT moves the first unit unit 21 along the guide rail 30 using the detection result of the position detection unit 55.

圖4係顯示匣裝置20中之第二單元部22之構成之分解立體圖。以下，為了方便說明，使圖4中X軸方向、Y軸方向、Z軸方向之顯示與圖1對應。
如圖4所示，第二單元部22具有基板驅動部(第二基板驅動部)61、基板側通訊部63、接觸抑制部67、保護基板驅動部(第二輔助部)68。又，設在匣裝置20之移動機構24具有使第二單元部22移動之移動部(第二移動部)62。FIG. 4 is an exploded perspective view showing the configuration of the second unit portion 22 in the cassette device 20. Hereinafter, for convenience of explanation, the display in the X-axis direction, the Y-axis direction, and the Z-axis direction in FIG. 4 corresponds to FIG. 1.
As shown in FIG. 4, the second unit section 22 includes a substrate driving section (second substrate driving section) 61, a substrate-side communication section 63, a contact suppression section 67, and a protective substrate driving section (second auxiliary section) 68. The moving mechanism 24 provided in the cassette device 20 includes a moving portion (second moving portion) 62 that moves the second unit portion 22.

第二單元部22具有第一壁部60a、第二壁部60b、底部60c及外部連接部60d。又，在第二單元部22設有電池等之電源部(未圖示)。第一單元部21及第二單元部22具有以XZ平面為基準之鏡面構造。The second unit portion 22 includes a first wall portion 60a, a second wall portion 60b, a bottom portion 60c, and an external connection portion 60d. A power source unit (not shown) such as a battery is provided in the second unit unit 22. The first unit section 21 and the second unit section 22 have a mirror surface structure based on the XZ plane.

第一壁部60a及第二壁部60b分別形成為板狀。第一壁部60a例如配置在-X軸側之端部。第二壁部60b例如配置在+X軸側之端部。第一壁部60a及第二壁部60b彼此平行地配置。此外，第一壁部60a及第二壁部60b形成為門狀亦可。The first wall portion 60a and the second wall portion 60b are each formed in a plate shape. The first wall portion 60a is arranged at an end portion on the -X axis side, for example. The second wall portion 60b is disposed at, for example, an end portion on the + X axis side. The first wall portion 60a and the second wall portion 60b are arranged parallel to each other. The first wall portion 60a and the second wall portion 60b may be formed in a door shape.

底部60c係形成為與XY平面(地面FL)平行，將第一壁部60a及第二壁部60b加以連結。外部連接部60d例如以在X軸方向延伸之圓柱之棒狀構件形成，設在第二單元部22之-Y軸側端部。第二單元部22之-Y軸側端部係作為連接於外部之搬送機構之連接部作用。外部連接部60d係設在第二單元部22之高度方向(Z軸方向)之例如二個部位。The bottom 60c is formed parallel to the XY plane (ground plane FL), and connects the first wall portion 60a and the second wall portion 60b. The external connection portion 60 d is formed, for example, as a cylindrical rod-shaped member extending in the X-axis direction, and is provided at the −Y-axis side end portion of the second unit portion 22. The -Y-axis side end portion of the second unit portion 22 functions as a connection portion of an external transfer mechanism. The external connection portion 60 d is provided at, for example, two portions in the height direction (Z-axis direction) of the second unit portion 22.

在第一壁部60a及第二壁部60b中之連接部側之角部分別形成有缺口部60f。缺口部60f係設成可抵接於外部構造物。藉由使缺口部60f抵接於外部構造物，在第二單元部22與上述外部構造物之間進行定位。此外，圖4中，缺口部60f雖形成在-Y軸側端部，但例如為在+ Y軸側端部設有缺口部60f之構成亦可。此情形，藉由使缺口部60f抵接於處理部10之一部分，可在第二單元部22與處理部10之間進行定位。Notch portions 60f are formed in corner portions on the connection portion side of the first wall portion 60a and the second wall portion 60b, respectively. The notch portion 60f is provided so as to be in contact with an external structure. By positioning the cutout portion 60f on the external structure, positioning is performed between the second unit portion 22 and the external structure. In addition, although the notch part 60f is formed in the -Y axis side end part in FIG. 4, for example, the notch part 60f may be provided in the + Y axis side end part. In this case, it is possible to perform positioning between the second unit portion 22 and the processing portion 10 by abutting the cutout portion 60f on a portion of the processing portion 10.

在第一壁部60a及第二壁部60b之+ Y軸側端部分別形成有第二連接部23b。第二單元部22係透過上述第二連接部23b連接於第一單元部21。作為第二連接部23b，使用例如可自動切換裝卸狀態之構成，例如電磁石等。A second connection portion 23b is formed at each of the + Y-axis side end portions of the first wall portion 60a and the second wall portion 60b. The second unit portion 22 is connected to the first unit portion 21 through the second connection portion 23b. As the second connection portion 23b, for example, a structure capable of automatically switching the attachment / detachment state, for example, a magnet or the like is used.

第二單元部22具有收容基板之第二收容部60。在此第二收容部60設有安裝有捲繞有基板S之基板回收滾筒(回收捲軸)61c之基板驅動部61。基板驅動部61，藉由使基板S旋轉進行回收從第一單元部21側供應之基板S之回收動作。基板驅動部61具有軸部(第二軸部)61a及旋轉驅動部(第二驅動部)61b。軸部61a形成為圓筒狀或圓柱狀，構成為可伸縮。藉由軸部61a伸縮，可從第一壁部60a與第二壁部60b之間移除，基板回收滾筒61c之安裝成為可能。軸部61a係配置成例如中心軸之軸線方向與X軸方向成為平行。軸部61a之一端部係藉由第二單元部22之第二壁部60b可旋轉地支承在圓周方向。在軸部61a設有可保持基板回收滾筒61c之端部之保持部(未圖示)。旋轉驅動部61b使軸部61a旋轉。藉由旋轉驅動部61b使軸部61a旋轉，基板S之供應動作(捲繞動作)成為可能。The second unit section 22 includes a second storage section 60 that stores a substrate. The second storage unit 60 is provided with a substrate driving unit 61 on which a substrate recovery roller (recycling reel) 61c on which the substrate S is wound is mounted. The substrate driving section 61 rotates the substrate S to perform a recovery operation for recovering the substrate S supplied from the first unit section 21 side. The substrate driving portion 61 includes a shaft portion (second shaft portion) 61 a and a rotation driving portion (second driving portion) 61 b. The shaft portion 61a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. The shaft portion 61a can be removed from between the first wall portion 60a and the second wall portion 60b by the expansion and contraction of the shaft portion 61a, and mounting of the substrate recovery roller 61c becomes possible. The shaft portion 61a is arranged such that, for example, the axial direction of the central axis is parallel to the X-axis direction. One end portion of the shaft portion 61 a is rotatably supported in the circumferential direction by the second wall portion 60 b of the second unit portion 22. The shaft portion 61a is provided with a holding portion (not shown) that can hold an end portion of the substrate recovery roller 61c. The rotation driving portion 61b rotates the shaft portion 61a. When the shaft portion 61a is rotated by the rotation driving portion 61b, the supply operation (winding operation) of the substrate S is enabled.

在第二收容部60設有安裝有保護基板供應滾筒68c之保護基板驅動部(第二輔助部)68。在保護基板供應滾筒68c捲繞有覆蓋基板S之被處理面之保護基板(保護膜)C。保護基板驅動部68，藉由使保護基板供應滾筒68c旋轉，進行回收從第一單元部21側供應之保護基板C之回收動作。The second storage section 60 is provided with a protective substrate driving section (second auxiliary section) 68 on which a protective substrate supply roller 68c is mounted. A protective substrate (protective film) C covering the processing surface of the substrate S is wound around the protective substrate supply roller 68c. The protective substrate driving section 68 rotates the protective substrate supply roller 68 c to perform a recovery operation for recovering the protective substrate C supplied from the first unit section 21 side.

保護基板驅動部68具有軸部68a及旋轉驅動部68b。軸部68a形成為圓筒狀或圓柱狀，構成為可伸縮。藉由軸部68a伸縮，可從第一壁部60a與第二壁部60b之間移除，保護基板供應滾筒68c之安裝成為可能。軸部68a係配置成例如中心軸之軸線方向與X軸方向成為平行。亦即，軸部61a及軸部68a係配置成中心軸之軸線方向成為彼此平行。軸部68a之一端部係藉由第二單元部22之第二壁部60b可旋轉地支承在圓周方向。在軸部68a設有可保持保護基板供應滾筒68c之端部之保持部(未圖示)。旋轉驅動部68b使軸部68a旋轉。藉由旋轉驅動部68b使軸部68a旋轉，保護基板C之供應動作(捲繞動作)成為可能。在保護基板驅動部68設有將送出之保護基板C重疊於基板S之機構(未圖示)。此外，在保護基板C重疊於基板S之狀態下捲繞於基板驅動部61之情形，亦可省略第二單元部22側之保護基板驅動部68。The protective substrate driving portion 68 includes a shaft portion 68 a and a rotation driving portion 68 b. The shaft portion 68a is formed in a cylindrical shape or a cylindrical shape, and is configured to be expandable and contractible. The shaft portion 68a can be removed from between the first wall portion 60a and the second wall portion 60b by the expansion and contraction of the shaft portion 68a, and installation of the protective substrate supply roller 68c becomes possible. The shaft part 68a is arrange | positioned so that the axial direction of a central axis may become parallel to an X-axis direction, for example. That is, the shaft portion 61a and the shaft portion 68a are arranged so that the axial directions of the central axes are parallel to each other. One end portion of the shaft portion 68 a is rotatably supported in the circumferential direction by the second wall portion 60 b of the second unit portion 22. The shaft portion 68a is provided with a holding portion (not shown) that can hold an end portion of the protective substrate supply roller 68c. The rotation driving portion 68b rotates the shaft portion 68a. By rotating the shaft portion 68a by the rotation driving portion 68b, the supply operation (winding operation) of the protective substrate C is enabled. The protective substrate driving unit 68 is provided with a mechanism (not shown) for overlapping the sent-out protective substrate C on the substrate S. In addition, in a case where the protective substrate C is wound around the substrate driving portion 61 with the protective substrate C superposed on the substrate S, the protective substrate driving portion 68 on the second unit portion 22 side may be omitted.

第二單元部22具有基板側通訊部(第二通訊部)63。基板側通訊部63係設在第二壁部60b之+Z軸側端面。基板側通訊部63例如可在與控制部CONT或第一單元部21等之間進行通訊。The second unit section 22 includes a substrate-side communication section (second communication section) 63. The substrate-side communication portion 63 is provided on the + Z-axis side end surface of the second wall portion 60b. The substrate-side communication unit 63 can communicate with, for example, the control unit CONT, the first unit unit 21, and the like.

第二單元部22具有接觸抑制部67。接觸抑制部67係設在第一壁部60a及第二壁部60b之-Y側端面。接觸抑制部67抑制第一壁部60a及第二壁部60b之-Y側端面與外部構造物接觸，且緩和接觸時之衝擊。接觸抑制部67具有例如從第一壁部60a及第二壁部60b往-Y軸側突出之棒狀構件、及承受對該棒狀構件作用之+Y軸方向之力之彈性構件。The second unit section 22 includes a contact suppression section 67. The contact suppressing portion 67 is provided on the −Y-side end surfaces of the first wall portion 60 a and the second wall portion 60 b. The contact suppressing portion 67 suppresses the -Y-side end surfaces of the first wall portion 60a and the second wall portion 60b from coming into contact with the external structure, and mitigates the impact during the contact. The contact suppressing portion 67 includes, for example, a rod-shaped member protruding from the first wall portion 60a and the second wall portion 60b toward the -Y axis side, and an elastic member that receives a force in the + Y axis direction acting on the rod-shaped member.

在可動部71a之+Z軸側之端面71c形成有槽部70。槽部70係V字狀形成在上述端面71c。另一方面，在第二單元部22之-Z軸側之端面60e形成有四個球狀支承部69。上述四個球狀支承部69分別支承於上述槽部70。藉由球狀支承部69支承於槽部70，限制往在第二單元部22與筐體71之間之X軸方向及Y軸方向之相對移動。此外，槽部70及球狀支承部69之數量分別為三個亦可。A groove portion 70 is formed on the end surface 71c on the + Z axis side of the movable portion 71a. The groove portion 70 is formed in a V-shape on the end surface 71c. On the other hand, four spherical support portions 69 are formed on the end surface 60 e on the -Z axis side of the second unit portion 22. The four spherical support portions 69 are supported by the groove portions 70, respectively. The spherical support portion 69 is supported by the groove portion 70 to restrict relative movement in the X-axis direction and the Y-axis direction between the second unit portion 22 and the housing 71. The number of the groove portions 70 and the spherical support portions 69 may be three each.

又，在可動部71a設有裝卸檢測部66。裝卸檢測部66檢測第二單元部22是否安裝在筐體71。作為裝卸檢測部66，可使用例如檢測在槽部70與球狀支承部69之間之電阻值之感測器或檢測在槽部70之壓力之感測器等之各種感測器。裝卸檢測部66之檢測結果例如從移動部側通訊部64傳送至外部(控制部CONT、基板側通訊部63等)。In addition, the movable portion 71a is provided with an attachment / detachment detection portion 66. The attachment / detachment detection section 66 detects whether the second unit section 22 is attached to the casing 71. As the attachment / detachment detection unit 66, for example, various sensors such as a sensor that detects a resistance value between the groove portion 70 and the spherical support portion 69 or a sensor that detects a pressure in the groove portion 70 can be used. The detection result of the attachment / detachment detection unit 66 is transmitted from the mobile unit side communication unit 64 to the outside (the control unit CONT, the substrate side communication unit 63, etc.), for example.

又，第二單元部22，除了上述構成外，具有連接檢測部(第二檢測部)65。連接檢測部65檢測第一單元部21與第二單元部22之間是否連接。作為連接檢測部65，可使用檢測第二連接部23b之電氣特性之感測器等。連接檢測部65之檢測結果例如從移動部側通訊部64傳送至外部(控制部CONT、基板側通訊部63等)。The second unit section 22 includes a connection detection section (second detection section) 65 in addition to the above-mentioned configuration. The connection detection section 65 detects whether or not the first unit section 21 and the second unit section 22 are connected. As the connection detection portion 65, a sensor or the like that detects the electrical characteristics of the second connection portion 23b can be used. The detection result of the connection detection unit 65 is transmitted from the mobile unit side communication unit 64 to the outside (the control unit CONT, the substrate side communication unit 63, etc.), for example.

上述移動部62將第二單元部22支承成可移除。移動部62使第二單元部22往X軸方向、Y軸方向及Z軸方向移動。移動部62具有筐體71、腳輪72、升降部73、及腳輪驅動部74。筐體71具有可動部71a及基部71b。控制部CONT控制腳輪72之旋轉速度。藉此，控制部CONT可控制移動部62之移動速度。又，在移動部62設有電池等之電源部(未圖示)。The moving portion 62 supports the second unit portion 22 so as to be removable. The moving section 62 moves the second unit section 22 in the X-axis direction, the Y-axis direction, and the Z-axis direction. The moving section 62 includes a housing 71, a caster 72, a lifting section 73, and a caster driving section 74. The casing 71 includes a movable portion 71a and a base portion 71b. The control unit CONT controls the rotation speed of the casters 72. Thereby, the control part CONT can control the moving speed of the moving part 62. A power supply unit (not shown) such as a battery is provided in the moving unit 62.

上述第二單元部22之移動部62與上述第一單元部21之移動部42構成使第一單元部21及第二單元部22相對移動之移動機構24。移動部42及移動部62分別可將第一單元部21及第二單元部22獨立地驅動。The moving portion 62 of the second unit portion 22 and the moving portion 42 of the first unit portion 21 constitute a moving mechanism 24 that relatively moves the first unit portion 21 and the second unit portion 22. The moving section 42 and the moving section 62 can drive the first unit section 21 and the second unit section 22 independently, respectively.

上述移動部62具有移動部側通訊部(第二通訊部)64。移動部側通訊部64係設在筐體71之內部。移動部側通訊部64可在與例如控制部CONT或基板側通訊部63、第一單元部21等之間進行通訊。基板側通訊部63及移動部側通訊部64可接收用以控制第二單元部22之動作之第二控制訊號。在第二控制訊號包含例如控制移動部62之移動動作之訊號、或控制在第二單元部22之基板S之供應動作之訊號等。The moving section 62 includes a moving section-side communication section (second communication section) 64. The moving part side communication part 64 is provided inside the casing 71. The mobile-portion communication unit 64 can communicate with, for example, the control unit CONT, the substrate-side communication unit 63, the first unit unit 21, and the like. The substrate-side communication unit 63 and the mobile-unit communication unit 64 may receive a second control signal for controlling the operation of the second unit unit 22. The second control signal includes, for example, a signal that controls the movement operation of the moving unit 62 or a signal that controls the supply operation of the substrate S in the second unit unit 22.

移動部62具有基板搬送控制部77。基板搬送控制部77控制第一單元部21及第二單元部22之基板S及保護基板C之搬送動作。基板搬送控制部77係透過移動部側通訊部64及基板側通訊部63控制軸部61a及軸部68a之旋轉速度。藉此，基板搬送控制部77可控制基板S及保護基板C之回收速度(捲繞速度)。The moving section 62 includes a substrate transfer control section 77. The substrate transfer control unit 77 controls the transfer operations of the substrate S and the protective substrate C of the first unit unit 21 and the second unit unit 22. The substrate transfer control unit 77 controls the rotation speed of the shaft portion 61 a and the shaft portion 68 a through the moving portion side communication portion 64 and the substrate side communication portion 63. Thereby, the substrate conveyance control unit 77 can control the recovery speed (winding speed) of the substrate S and the protective substrate C.

又，基板搬送控制部77係透過例如移動部側通訊部64及第一單元部21之基板側通訊部43控制軸部41a及軸部48a之旋轉速度。藉此，基板搬送控制部77可控制基板S及保護基板C之供應速度(送出速度)。The substrate transfer control unit 77 controls the rotation speed of the shaft portion 41 a and the shaft portion 48 a via the substrate-side communication portion 43 of the moving portion-side communication portion 64 and the first unit portion 21, for example. Thereby, the board | substrate conveyance control part 77 can control the supply speed (feeding speed) of the board | substrate S and the protective board | substrate C.

基板搬送控制部77控制第二單元部22之腳輪72之旋轉速度。藉此，基板搬送控制部77可控制移動部62之移動速度。又，基板搬送控制部77係透過移動部側通訊部64及第一單元部21之移動部側通訊部44控制第一單元部21之腳輪52之旋轉速度。藉此，基板搬送控制部77可控制移動部42之移動速度。The substrate transfer control section 77 controls the rotation speed of the casters 72 of the second unit section 22. Thereby, the board | substrate conveyance control part 77 can control the moving speed of the moving part 62. The substrate transfer control unit 77 controls the rotation speed of the caster 52 of the first unit 21 through the mobile unit-side communication unit 64 and the mobile unit-side communication unit 44 of the first unit unit 21. Thereby, the board | substrate conveyance control part 77 can control the moving speed of the moving part 42.

圖5係顯示使匣裝置20之第一單元部21與第二單元部22連接後之狀態之立體圖。
如圖5所示，第一單元部21及第二單元部22可在第一連接部23a與第二連接部23b對向之狀態下連接。第一連接部23a與第二連接部23b之間係藉由電磁石之磁力吸附。如上述，匣裝置20具備藉由第一連接部23a及第二連接部23b將第一單元部21與第二單元部22加以連接之連接部23。FIG. 5 is a perspective view showing a state where the first unit portion 21 and the second unit portion 22 of the cassette device 20 are connected.
As shown in FIG. 5, the first unit portion 21 and the second unit portion 22 may be connected in a state where the first connection portion 23 a and the second connection portion 23 b face each other. The first connection portion 23a and the second connection portion 23b are attracted by the magnetic force of the electromagnet. As described above, the cassette device 20 includes the connection portion 23 that connects the first unit portion 21 and the second unit portion 22 via the first connection portion 23a and the second connection portion 23b.

第一單元部21係支承在移動部42之筐體51且第二單元部22係支承在移動部62之筐體71之情形，第一單元部21與第二單元部22連接構成匣裝置20。此情形，移動部42及移動部62能使第一單元部21與第二單元部22在維持連接之狀態下一體地移動。In a case where the first unit portion 21 is supported by the casing 51 of the moving portion 42 and the second unit portion 22 is supported by the casing 71 of the moving portion 62, the first unit portion 21 and the second unit portion 22 are connected to form the cassette device 20 . In this case, the moving section 42 and the moving section 62 can move the first unit section 21 and the second unit section 22 integrally while maintaining the connection.

又，在第一單元部21與第二單元部22連接之情形，例如在第一連接部23a及第二連接部23b設置連接端子，藉由使上述連接端子彼此連接成為可在第一單元部21與第二單元部22之間收發資訊之構成亦可。In the case where the first unit portion 21 and the second unit portion 22 are connected, for example, connection terminals are provided in the first connection portion 23a and the second connection portion 23b. A structure for transmitting and receiving information between 21 and the second unit 22 may be used.

匣裝置20具有設在第一單元部21且安裝蓋構件CV之安裝部81。再者，匣裝置20具有設在第二單元部22且安裝蓋構件CV之安裝部82。蓋構件CV以例如塵埃等異物不進入之方式將第一單元部21及第二單元部22之內部加以密封。蓋構件CV係橫跨第一單元部21與第二單元部22之間安裝。The cassette device 20 includes a mounting portion 81 provided on the first unit portion 21 and mounting a cover member CV. Further, the cassette device 20 includes a mounting portion 82 provided on the second unit portion 22 and mounting a cover member CV. The cover member CV seals the inside of the first unit portion 21 and the second unit portion 22 so that foreign matter such as dust does not enter. The cover member CV is installed across the first unit portion 21 and the second unit portion 22.

圖5之蓋構件CV，例如雖顯示可在Z軸方向裝卸之構成，但並不限於此。例如，在第一單元部21之底部40c及第二單元部22之底部60c將蓋構件CV可旋轉地安裝亦可。又，以可伸縮或折疊之片狀構件形成蓋構件CV，將此蓋構件CV之一部分構成為可收容於底部40c亦可。此情形，從在第一單元部21之底部40c之+Y軸側端部將蓋構件CV引出，從第一單元部21之+Y軸側之側面往+Z軸側之側面懸掛，藉此可覆蓋第一單元部21。同樣地，從第二單元部22之底部60c之-Y軸側端部將蓋構件CV引出，從第二單元部22之-Y軸側之側面往+Z軸側之側面懸掛，藉此可覆蓋第二單元部22。又，從第一單元部21側往第二單元部22側捲繞懸掛蓋構件CV之構成亦可。Although the cover member CV in FIG. 5 shows a structure that can be attached and detached in the Z-axis direction, for example, it is not limited thereto. For example, the cover member CV may be rotatably attached to the bottom portion 40c of the first unit portion 21 and the bottom portion 60c of the second unit portion 22. Further, the cover member CV may be formed of a retractable or foldable sheet-like member, and a part of the cover member CV may be configured to be accommodated in the bottom portion 40c. In this case, the cover member CV is pulled out from the + Y-axis side end portion of the bottom portion 40c of the first unit portion 21, and is suspended from the + Y-axis side side to the + Z-axis side side of the first unit portion 21, thereby The first unit portion 21 may be covered. Similarly, the cover member CV is pulled out from the -Y axis side end portion of the bottom 60c of the second unit portion 22, and is suspended from the side surface of the -Y axis side of the second unit portion 22 to the side surface of the + Z axis side. Covering the second unit section 22. A configuration in which the suspension cover member CV is wound from the first unit portion 21 side to the second unit portion 22 side may be adopted.

圖6係顯示處理部10之構成之側視圖。圖6中，省略保護基板C、保護基板驅動部48及保護基板驅動部68之圖示。
如圖6所示，在處理部10之基板S之搬送方向，在上游側配置第一單元部21，在下游側配置第二單元部22。此外，處理部10在從第一單元部21供應且往第二單元部22搬送之基板S之移動路徑上，對上述基板S之被處理面Sa進行處理。處理部10具有處理裝置15、導引裝置16及對準測量裝置17。FIG. 6 is a side view showing the configuration of the processing section 10. In FIG. 6, illustrations of the protective substrate C, the protective substrate driving section 48, and the protective substrate driving section 68 are omitted.
As shown in FIG. 6, in the conveying direction of the substrate S of the processing section 10, the first unit section 21 is disposed on the upstream side, and the second unit section 22 is disposed on the downstream side. In addition, the processing section 10 processes the processing surface Sa of the substrate S on the moving path of the substrate S supplied from the first unit section 21 and conveyed to the second unit section 22. The processing unit 10 includes a processing device 15, a guide device 16, and an alignment measurement device 17.

處理裝置15具有用以對基板S之被處理面Sa形成例如有機EL元件之各種裝置。作為此種裝置，可舉出例如用以在被處理面Sa上形成分隔壁之分隔壁形成裝置、用以形成電極之電極形成裝置、用以形成發光層之發光層形成裝置等。更具體而言，可舉出液滴塗布裝置(例如噴墨型塗布裝置等)、成膜裝置(膜形成裝置，例如蒸鍍裝置、濺鍍裝置)、曝光裝置、顯影裝置、表面改質裝置、洗淨裝置、乾燥裝置、檢查基板之檢查裝置等。此等各裝置係沿著基板S之搬送路徑適當設置。The processing device 15 includes various devices for forming, for example, an organic EL element on the processing surface Sa of the substrate S. Examples of such a device include a partition wall forming device for forming a partition wall on the surface to be processed Sa, an electrode forming device for forming an electrode, and a light emitting layer forming device for forming a light emitting layer. More specifically, a droplet coating device (e.g., an inkjet type coating device, etc.), a film forming device (a film forming device, such as a vapor deposition device, a sputtering device), an exposure device, a developing device, and a surface modification device may be mentioned , Cleaning device, drying device, inspection device for inspecting substrates, etc. Each of these devices is appropriately installed along the conveyance path of the substrate S.

本實施形態中，處理裝置15具有具備收容用以對基板S進行顯影處理之顯影液11b之顯影液收容容器11a之顯影裝置11、及具備用以收容洗淨基板S之洗淨液12b之洗淨液收容容器12a之洗淨裝置12。此外，處理裝置15可收容進行使用上述液體以外之處理之裝置。In this embodiment, the processing device 15 includes a developing device 11 including a developing solution storage container 11a that contains a developing solution 11b for developing the substrate S, and a washing device 12b having a cleaning solution 12b that contains a cleaning substrate S. Washing device 12 of a clean liquid storage container 12a. In addition, the processing device 15 can accommodate a device that performs processing other than the above-mentioned liquid.

導引裝置16具有顯影側導引部13、洗淨側導引部14。顯影側導引部13具有第一墊13a、第二墊13d、第一滾筒13b及第二滾筒13c。The guide device 16 includes a developing-side guide portion 13 and a washing-side guide portion 14. The developing-side guide 13 includes a first pad 13a, a second pad 13d, a first roller 13b, and a second roller 13c.

第一墊13a係固定在處理裝置15之內部，將從第一單元部21供應之基板S導引至顯影液收容容器11a。第二墊13d係固定在處理裝置15之內部，將通過顯影液11b之基板S導引至顯影液收容容器11a之外部。The first pad 13a is fixed inside the processing device 15 and guides the substrate S supplied from the first unit section 21 to the developer storage container 11a. The second pad 13d is fixed inside the processing device 15 and guides the substrate S passing through the developing solution 11b to the outside of the developing solution storage container 11a.

第一滾筒13b及第二滾筒13c係設成可相對於顯影液收容容器11a在上下方向(Z軸方向)移動。在第一墊13a與第一滾筒13b之間、及第二墊13d與第二滾筒13c之間搬入基板S後，使第一滾筒13b及第二滾筒13c往顯影液收容容器11a側(下方，亦即-Z軸方向)移動，藉此在第一墊13a基板S之搬送方向往-Z軸方向變更，且基板S浸入顯影液11b，且可將基板S導引成通過顯影液11b之內部。The first roller 13b and the second roller 13c are provided so as to be movable in the vertical direction (Z-axis direction) with respect to the developer storage container 11a. After the substrate S is carried between the first pad 13a and the first roller 13b, and between the second pad 13d and the second roller 13c, the first roller 13b and the second roller 13c are brought to the developer storage container 11a side (below, (I.e., -Z axis direction) movement, thereby changing the conveying direction of the substrate S of the first pad 13a to the -Z axis direction, and the substrate S is immersed in the developing solution 11b, and the substrate S can be guided to pass through the inside of the developing solution 11b. .

洗淨側導引部14具有第一墊14a、第二墊14d、第一滾筒14b及第二滾筒14c。洗淨側導引部14之各滾筒與顯影側導引部13之各滾筒構成相同，因此省略說明。The washing-side guide portion 14 includes a first pad 14a, a second pad 14d, a first drum 14b, and a second drum 14c. Since the rollers of the washing-side guide portion 14 and the rollers of the developing-side guide portion 13 have the same configuration, description thereof is omitted.

又，顯影側導引部13之第一墊13a及第二墊13d與洗淨側導引部14之第一墊14a及第二墊14d導引基板S之被處理面Sa之背面。是以，此等第一墊13a、第二墊13d、第一墊14a及第二墊14d分別具有圓柱狀之導引面，具有複數個從此導引面噴出氣體之未圖示之噴出口，在導引面上可形成氣體之層。藉由此氣體之層，可在導引面以非接觸方式導引基板S之背面(被處理面Sa之相反側之面)。此外，替換第一墊13a及第二墊13d，使用旋轉滾筒亦可。使用旋轉滾筒之情形，在基板S之背面接觸旋轉滾筒之導引面之狀態下，旋轉滾筒導引基板S。The first pad 13 a and the second pad 13 d of the developing-side guide 13 and the first pad 14 a and the second pad 14 d of the cleaning-side guide 14 guide the back surface of the processed surface Sa of the substrate S. Therefore, the first pad 13a, the second pad 13d, the first pad 14a, and the second pad 14d each have a cylindrical guide surface and a plurality of unillustrated ejection ports for ejecting gas from the guide surface. A layer of gas can be formed on the guide surface. With this layer of gas, the back surface of the substrate S (the surface on the opposite side to the processed surface Sa) can be guided on the guide surface in a non-contact manner. In addition, instead of the first pad 13a and the second pad 13d, a rotary drum may be used. In the case of using a rotary roller, the rotary roller guides the substrate S in a state where the back surface of the substrate S is in contact with the guide surface of the rotary roller.

對準測量裝置17測量基板S之邊緣部或設在基板S之對準標記，根據其測量結果，對基板S進行對準動作。對準測量裝置17具有檢測基板S之邊緣部或對準標記之對準攝影機或根據上述對準攝影機之檢測結果調整基板S之位置(例如，基板S之寬度方向之位置)及姿勢(例如，相對於搬送方向之傾斜)之至少一方之調整裝置等。作為基板S之位置測量、速度測量，亦可使用以光學滑鼠之方式將雷射光投射在基板S上，光電檢測在基板S上產生之散斑圖案之變化之方式。The alignment measurement device 17 measures an edge portion of the substrate S or an alignment mark provided on the substrate S, and performs an alignment operation on the substrate S according to the measurement result. The alignment measurement device 17 has an alignment camera that detects the edge portion of the substrate S or an alignment mark, or adjusts the position (for example, the position in the width direction of the substrate S) of the substrate S (for example, the position of the substrate S) based on the detection result of the alignment camera. An adjustment device or the like for at least one of the inclination with respect to the conveying direction). As the position measurement and the speed measurement of the substrate S, a method of projecting laser light on the substrate S by means of an optical mouse and detecting the change of the speckle pattern generated on the substrate S by photoelectricity can also be used.

接著，說明以上述方式構成之基板處理裝置100之動作。圖7~圖12係顯示基板處理裝置100之動作之圖。圖7~圖12中，省略保護基板C、保護基板驅動部48及保護基板驅動部68之圖示。
首先，說明進行將基板S掛架在搬送機構24中之軸部41a與軸部61a之間之動作之情形。在以後之動作，以控制部CONT對例如基板側通訊部43及基板側通訊部63或移動部側通訊部44及移動部側通訊部64進行通訊以控制各部之情形為例進行說明。Next, the operation of the substrate processing apparatus 100 configured as described above will be described. 7 to 12 are diagrams showing operations of the substrate processing apparatus 100. In FIGS. 7 to 12, illustrations of the protective substrate C, the protective substrate driving section 48, and the protective substrate driving section 68 are omitted.
First, the case where the operation | movement which mounts the board | substrate S between the shaft part 41a and the shaft part 61a in the conveyance mechanism 24 is demonstrated. In subsequent operations, a case where the control unit CONT communicates with, for example, the substrate-side communication unit 43 and the substrate-side communication unit 63 or the mobile-unit communication unit 44 and the mobile-unit communication unit 64 to control each unit will be described as an example.

首先，第一單元部21使支承在移動部42之第一單元部21、第二單元部22使支承在移動部62之第二單元部22分別在複數個緩衝部BF待機。控制部CONT使一組第一單元部21及第二單元部22吸附在第一連接部23a與第二連接部23b之間以使第一收容部40與第二收容部60連接。藉此，上述第一單元部21及第二單元部22可一體地移動。First, the first unit portion 21 causes the first unit portion 21 and the second unit portion 22 supported by the moving portion 42 to cause the second unit portion 22 supported by the moving portion 62 to stand by in each of the plurality of buffer portions BF. The control unit CONT attracts a group of the first unit portion 21 and the second unit portion 22 between the first connection portion 23 a and the second connection portion 23 b to connect the first storage portion 40 and the second storage portion 60. Thereby, the said 1st unit part 21 and the 2nd unit part 22 can move integrally.

控制部CONT，首先使第一單元部21與第二單元部22從緩衝部BF往導軌30上一體地移動。之後，控制部CONT，如圖7所示，使上述第一單元部21與第二單元部22沿著導軌30移動，配置在第二軌道33之+Y側端部、亦即第一軌道31。此外，在第一單元部21之軸部41a預先安裝捲軸狀之基板S。在基板S之前端Sf，例如圖7所示之構成中安裝有導頭Lf，但為省略上述導頭Lf之構成亦可。The control unit CONT first moves the first unit unit 21 and the second unit unit 22 integrally from the buffer unit BF onto the guide rail 30. After that, the control unit CONT moves the first unit portion 21 and the second unit portion 22 along the guide rail 30 as shown in FIG. 7, and is disposed at the + Y side end portion of the second rail 33, that is, the first rail 31 . In addition, a roll-shaped substrate S is mounted on the shaft portion 41 a of the first unit portion 21 in advance. A lead Lf is attached to the front end Sf of the substrate S, for example, as shown in FIG. 7, but the structure of the lead Lf may be omitted.

接著，控制部CONT藉由旋轉驅動部41b使軸部41a旋轉。藉由此動作，基板S之前端Sf往軸部61a側送出，基板S之前端Sf到達軸部61a捲掛在上述軸部61a。此外，將基板S之前端Sf捲掛在軸部61a之操作為自動化亦可，但藉由人力使用固定帶等將前端Sf黏貼在軸部61a亦可。Next, the control unit CONT rotates the shaft portion 41a by the rotation driving portion 41b. With this operation, the front end Sf of the substrate S is sent out to the shaft portion 61a, and the front end Sf of the substrate S reaches the shaft portion 61a and is wound around the shaft portion 61a. In addition, the operation of winding the front end Sf of the substrate S on the shaft portion 61a may be automated, but the front end Sf may be adhered to the shaft portion 61a by using a fixing tape or the like by human power.

控制部CONT，在基板S之前端Sf捲掛在軸部61a後，切斷第一單元部21與第二單元部22之連接。藉此，第一單元部21與第二單元部22可獨立地移動。之後，控制部CONT，使軸部41a旋轉將基板S送出並同時使第二單元部22沿著第三軌道33往-Y軸方向移動。The control unit CONT cuts the connection between the first unit portion 21 and the second unit portion 22 after the front end Sf of the substrate S is wound around the shaft portion 61a. Thereby, the first unit part 21 and the second unit part 22 can move independently. After that, the control unit CONT rotates the shaft portion 41 a to send out the substrate S, and at the same time moves the second unit portion 22 along the third rail 33 in the -Y axis direction.

控制部CONT，在第二單元部22到達第三軌道33之-Y軸側端部、亦即第二軌道32為止，使第二單元部22移動。在第二單元部22移動之期間，第一單元部21維持配置在第一軌道31之狀態。藉由此動作，如圖8所示，第一單元部21配置在第一軌道31，第二單元部22配置在第二軌道32。又，基板S之前端Sf在捲掛在軸部61a之狀態下往-Y軸方向引出。The control unit CONT moves the second unit portion 22 until the second unit portion 22 reaches the -Y-axis side end portion of the third rail 33, that is, the second rail 32. While the second unit section 22 is moving, the first unit section 21 is maintained in a state of being arranged on the first rail 31. With this operation, as shown in FIG. 8, the first unit portion 21 is disposed on the first rail 31 and the second unit portion 22 is disposed on the second rail 32. In addition, the front end Sf of the substrate S is drawn out in the -Y axis direction while being wound on the shaft portion 61a.

之後，控制部CONT使處理裝置15之顯影側導引部13之第一滾筒13b及第二滾筒13c、及洗淨側導引部14之第一滾筒14b及第二滾筒14c往上方(+Z軸方向)預先移動。藉此，在第一滾筒13b及第二滾筒13c與顯影液收容容器11a(亦即，第一墊13a及第二墊13d)之間、第一滾筒14b及第二滾筒14c與洗淨液收容容器12a(亦即，第三墊14a及第四墊14d)之間形成基板S可通過之間隙。After that, the control unit CONT moves the first roller 13b and the second roller 13c of the developing-side guide 13 of the processing device 15 and the first roller 14b and the second roller 14c of the cleaning-side guide 14 upward (+ Z Axis direction). Thereby, between the first roller 13b and the second roller 13c and the developer storage container 11a (that is, the first pad 13a and the second pad 13d), the first roller 14b and the second roller 14c and the cleaning liquid are stored. The container 12a (that is, the third pad 14a and the fourth pad 14d) forms a gap through which the substrate S can pass.

控制部CONT對掛架在軸部41a與軸部61a之間之基板S往Y軸方向賦予適當之張力，以使基板S通過該間隙。基板S之張力能使用例如基板搬送控制部77控制第二單元部22側來調整。The control unit CONT applies a proper tension to the substrate S between the shaft portion 41a and the shaft portion 61a in the Y-axis direction so that the substrate S passes through the gap. The tension of the substrate S can be adjusted by, for example, controlling the side of the second unit section 22 using the substrate transfer control section 77.

在此狀態下，控制部CONT，如圖9所示，藉由旋轉驅動部41b及旋轉驅動部61b使第一單元部21及第二單元部22同步，分別在第一軌道31上及第二軌道32上往處理裝置15側(+X軸方向)移動。在此狀態下，基板S在Z軸方向分別配置在第一滾筒13b及第二滾筒13c與顯影液收容容器11a之間、第一滾筒14b及第二滾筒14c與洗淨液收容容器12a之間。In this state, the control unit CONT, as shown in FIG. 9, synchronizes the first unit unit 21 and the second unit unit 22 by the rotation driving unit 41 b and the rotation driving unit 61 b, respectively on the first rail 31 and the second unit 31. The rail 32 moves toward the processing device 15 side (+ X axis direction). In this state, the substrate S is disposed between the first roller 13b and the second roller 13c and the developer storage container 11a, and between the first roller 14b and the second roller 14c and the cleaning liquid storage container 12a in the Z-axis direction. .

控制部CONT，首先，使軸部41a及軸部61a旋轉以將基板S往-Y軸方向傳送並同時使顯影側導引部13之第一滾筒13b及第二滾筒13c往-Z軸方向移動。藉此，基板S浸於顯影液11b，對基板S進行顯影處理。之後，控制部CONT，使軸部41a及軸部61a旋轉以將基板S往-Y軸方向送出。藉由此動作，基板S中之已通過顯影液11b之部分到達洗淨裝置12。The control unit CONT first rotates the shaft portion 41a and the shaft portion 61a to convey the substrate S in the -Y axis direction and simultaneously moves the first roller 13b and the second roller 13c of the developing-side guide portion 13 in the -Z axis direction. . Thereby, the substrate S is immersed in the developing solution 11b, and the substrate S is subjected to a development process. After that, the control unit CONT rotates the shaft portion 41 a and the shaft portion 61 a to send the substrate S in the −Y axis direction. With this operation, the portion of the substrate S that has passed through the developer 11 b reaches the cleaning device 12.

接著，控制部CONT，使軸部41a及軸部61a旋轉以將基板S往-Y軸方向傳送並同時使洗淨側導引部14之第一滾筒14b及第二滾筒14c往-Z軸方向移動。藉此，基板S浸於洗淨液12b，對基板S進行洗淨處理。Next, the control unit CONT rotates the shaft portion 41a and the shaft portion 61a to transfer the substrate S in the -Y axis direction and simultaneously moves the first roller 14b and the second roller 14c of the cleaning side guide portion 14 in the -Z axis direction. mobile. Thereby, the substrate S is immersed in the cleaning liquid 12b, and the substrate S is subjected to a cleaning process.

此時，如圖10所示，在基板S中之搬送方向(-Y軸方向)之上游側施加顯影處理，在搬送方向之下游側施加洗淨處理。之後，控制部CONT使軸部41a及軸部61a旋轉以將基板S往-Y軸方向送出。藉由此動作，基板S中之已通過洗淨液12b之部分從洗淨裝置12往外部送出。At this time, as shown in FIG. 10, the developing process is applied to the upstream side in the transport direction (-Y axis direction) in the substrate S, and the cleaning process is applied to the downstream side in the transport direction. After that, the control unit CONT rotates the shaft portion 41 a and the shaft portion 61 a to send the substrate S in the −Y axis direction. With this operation, the portion of the substrate S that has passed through the cleaning solution 12b is sent from the cleaning device 12 to the outside.

如圖10所示，支承基板S之背面(被處理面Sa之相反側之面)者，在顯影側導引部13為第一墊13a及第二墊13d，在洗淨側導引部14為第一墊14a及第二墊14d，因此藉由形成在此等墊之導引面上之氣體層，能在對背面非接觸之狀態下搬送基板S。As shown in FIG. 10, those who support the back surface of the substrate S (the surface opposite to the processed surface Sa) are the first pad 13 a and the second pad 13 d on the development side guide 13, and the clean side guide 14 Since they are the first pad 14a and the second pad 14d, the substrate S can be transported without contacting the back surface by the gas layer formed on the guide surfaces of these pads.

控制部CONT依據顯影裝置11及洗淨裝置12之處理速度，調整從軸部41a往軸部61a移動之基板S之移動速度。又，控制部CONT，如圖11所示，依據捲繞於軸部41a之基板S之捲繞徑R1、與捲繞於軸部61a之基板S之捲繞徑R2，調整在旋轉驅動部41b及旋轉驅動部61b之驅動速度。藉由此動作，搬送速度在一定之狀態下搬送基板S。基板S之速度之監測，亦可藉由圖3之對準測量裝置17測量設在基板S之對準標記之時序(時間)進行。又，藉由基板S之捲繞徑R1、基板S之捲繞徑R2之變化調整升降部53及升降部73亦可。The control unit CONT adjusts the moving speed of the substrate S moving from the shaft portion 41 a to the shaft portion 61 a according to the processing speed of the developing device 11 and the cleaning device 12. As shown in FIG. 11, the control unit CONT adjusts the rotation driving unit 41 b based on the winding diameter R1 of the substrate S wound around the shaft portion 41 a and the winding diameter R2 of the substrate S wound around the shaft portion 61 a. And the driving speed of the rotation driving section 61b. With this operation, the substrate S is conveyed at a constant speed. The monitoring of the speed of the substrate S can also be performed by measuring the timing (time) of the alignment mark provided on the substrate S by the alignment measurement device 17 of FIG. 3. The lifting portion 53 and the lifting portion 73 may be adjusted by changing the winding diameter R1 of the substrate S and the winding diameter R2 of the substrate S.

在顯影處理及洗淨處理結束後，控制部CONT使軸部41a及軸部61a旋轉以將基板S往-Y軸方向傳送並同時使顯影側導引部13之第一滾筒13b及第二滾筒13c往+Z軸方向移動，且使洗淨側導引部14之第一滾筒14b及第二滾筒14c往+Z軸方向移動。After the development process and the cleaning process are completed, the control unit CONT rotates the shaft portion 41a and the shaft portion 61a to transfer the substrate S to the -Y axis direction and simultaneously causes the first roller 13b and the second roller of the developing-side guide 13 13c moves in the + Z axis direction, and moves the first roller 14b and the second roller 14c of the washing-side guide portion 14 in the + Z axis direction.

之後，控制部CONT，如圖12所示，藉由移動部42及移動部62之同步控制使第一單元部21及第二單元部22同步，分別沿著第一軌道31及第二軌道32往+X軸方向移動。藉由此動作，成為從處理裝置15往+X軸側退開之狀態。控制部CONT，在第一單元部21及第二單元部22到達第三軌道33為止後，使上述第一單元部21及第二單元部22之移動停止。After that, as shown in FIG. 12, the control unit CONT synchronizes the first unit unit 21 and the second unit unit 22 by the synchronization control of the movement unit 42 and the movement unit 62, and respectively follows the first track 31 and the second track 32. Move in the + X axis direction. As a result of this operation, the state is retracted from the processing device 15 toward the + X axis side. The control unit CONT stops the movement of the first unit unit 21 and the second unit unit 22 after the first unit unit 21 and the second unit unit 22 reach the third rail 33.

控制部CONT，在使第一單元部21及第二單元部22之移動停止後，使軸部61a旋轉並同時使第二單元部22往+Y軸方向移動。藉由此動作，軸部61a捲繞基板S同時軸部41a與軸部61a再次接近，第一單元部21之第一連接部23a與第二單元部22之第二連接部23b抵接。之後，控制部CONT，使電磁石啟動以吸附第一連接部23a與第二連接部23b。藉此，第一收容部40與第二收容部60再次連接，第一單元部21與第二單元部22一體化。之後，控制部CONT使一體化狀態之第一單元部21及第二單元部22沿著第一軌道31、第二軌道32及第三軌道33適當移動。在以上之動作，控制部CONT，以第一單元部21及第二單元部22彼此不會碰撞、混雜之方式，使用位置檢測部55及位置檢測部(第一檢測部)75所檢測之位置資訊適當地整理第一單元部21及第二單元部22之配置。The control unit CONT stops the movement of the first unit unit 21 and the second unit unit 22, and then rotates the shaft unit 61a and simultaneously moves the second unit unit 22 in the + Y-axis direction. With this operation, the shaft portion 61 a is wound around the substrate S while the shaft portion 41 a and the shaft portion 61 a approach again, and the first connection portion 23 a of the first unit portion 21 and the second connection portion 23 b of the second unit portion 22 abut. After that, the control unit CONT activates the electromagnet to attract the first connection portion 23a and the second connection portion 23b. Thereby, the first storage portion 40 and the second storage portion 60 are connected again, and the first unit portion 21 and the second unit portion 22 are integrated. After that, the control unit CONT appropriately moves the first unit unit 21 and the second unit unit 22 in the integrated state along the first rail 31, the second rail 32, and the third rail 33. In the above operations, the control unit CONT uses the positions detected by the position detection unit 55 and the position detection unit (first detection unit) 75 so that the first unit unit 21 and the second unit unit 22 do not collide with each other. The information appropriately arranges the configurations of the first unit section 21 and the second unit section 22.

如上述，本實施形態之匣裝置，具備具有進行具有可撓性之基板S之供應之基板驅動部41之第一單元部21、及具有在與上述第一單元部21之間設成可裝卸且在與基板驅動部41之間進行基板S之回收之基板驅動部61之第二單元部22，因此在上述第一單元部21與第二單元部22之間完成基板S之供應及回收。藉此，可抑制從送出至捲繞為止掛架之基板S之尺寸變長，因此可降低搬送時之基板S之管理負擔。As described above, the cassette device according to this embodiment includes the first unit section 21 having a substrate driving section 41 for supplying a flexible substrate S, and the first unit section 21 is detachably provided to the first unit section 21. In addition, the second unit portion 22 of the substrate driving portion 61 that recovers the substrate S between the substrate driving portion 41 and the substrate driving portion 41 completes the supply and recovery of the substrate S between the first unit portion 21 and the second unit portion 22. With this, it is possible to prevent the size of the substrate S in the rack from being extended from the delivery to the winding, and thus it is possible to reduce the management burden of the substrate S during transportation.

(第二實施形態)
接著，說明第二實施形態。
圖13係以示意方式顯示本實施形態之基板處理裝置200之構成之圖。
如圖13所示，本實施形態中，基板處理裝置200在Z軸方向形成為複數個階層(圖13中為3階層)。基板處理裝置200在各階具有處理部10及匣裝置20。又，在各階之地面FL1、地面FL2及地面FL3分別沿著處理部10形成有導軌30。(Second Embodiment)
Next, a second embodiment will be described.
FIG. 13 is a diagram schematically showing the configuration of a substrate processing apparatus 200 according to this embodiment.
As shown in FIG. 13, in the present embodiment, the substrate processing apparatus 200 is formed in a plurality of levels in the Z-axis direction (three levels in FIG. 13). The substrate processing apparatus 200 includes a processing unit 10 and a cassette device 20 at each stage. A guide rail 30 is formed on each of the floors FL1, FL2, and FL3 along the processing unit 10.

匣裝置20具有與上述實施形態相同之構成。亦即，第一單元部21與筐體51之間係設成可裝卸。又，第二單元部22與筐體71之間係設成可裝卸。又，第一單元部21與第二單元部22之間係設成可裝卸。The cassette device 20 has the same structure as the above-mentioned embodiment. That is, the first unit portion 21 and the casing 51 are detachably provided. The second unit portion 22 is detachably provided between the housing 71 and the case 71. The first unit portion 21 and the second unit portion 22 are detachably provided.

圖14係顯示基板處理裝置200之構成之剖面圖。
如圖14所示，基板處理裝置200具有三個處理室111~113。處理室111~113係藉由分隔部114分隔。分隔部114具備構成處理室111之地面FL1之分隔構件114a、構成處理室111之頂部及處理室112之地面FL2之分隔構件114b、構成處理室112之頂部及處理室113之地面FL3之分隔構件114c、構成處理室113之頂部之分隔構件114d。FIG. 14 is a cross-sectional view showing the configuration of the substrate processing apparatus 200.
As shown in FIG. 14, the substrate processing apparatus 200 includes three processing chambers 111 to 113. The processing chambers 111 to 113 are partitioned by a partition 114. The partition 114 includes a partition member 114a constituting the floor FL1 of the processing chamber 111, a partition member 114b constituting the top of the processing chamber 111 and the floor FL2 of the processing chamber 112, and a partition member constituting the top of the processing chamber 112 and the floor FL3 of the processing chamber 113. 114c. A partition member 114d constituting the top of the processing chamber 113.

處理室111，在複數個處理室中，配置在重力方向之最下部(最靠-Z軸側)。處理室111，形成對基板S進行使用液體之處理(濕式處理)之處理空間。在處理室111，例如圖14所示，作為處理裝置110，設有具備收容用以塗布基板S之光阻液之光阻液收容容器141a之塗布裝置141、具備收容用以對基板S進行顯影處理之顯影液之顯影液收容容器142a之顯影裝置142、具備收容用以洗淨基板S之洗淨液之洗淨液收容容器143a之洗淨裝置143、具備收容用以對洗淨處理後之基板S形成圖案之鍍金液之鍍金液收容容器144a之鍍金裝置144。此外，在處理室111可收容進行使用上述液體以外之處理之裝置。The processing chamber 111 is disposed at the lowermost position (most near the -Z axis side) in the gravity direction among the plurality of processing chambers. The processing chamber 111 forms a processing space for processing the substrate S using a liquid (wet processing). In the processing chamber 111, for example, as shown in FIG. 14, as the processing device 110, there is provided a coating device 141 including a photoresist storage container 141a for storing a photoresist liquid for coating the substrate S, and a container for developing the substrate S. A developing device 142 of the processed developer, a developer storage container 142a, a cleaning device 143 including a cleaning liquid storage container 143a that stores a cleaning liquid for cleaning the substrate S, and a cleaning device 143 The substrate S forms a patterned gold plating solution containing container 144a with a gold plating solution. In addition, the processing chamber 111 can accommodate a device that performs processing other than the above-mentioned liquid.

在分隔構件114a設有構成連接於未圖示之回收裝置之廢液回收流路之一部分之複數個回收管145。回收管145之一端部連接於塗布裝置141、顯影裝置142及洗淨裝置143之各個，另一端部連接於回收裝置所連接之未圖示之廢液回收流路。各回收管145將在塗布裝置141、顯影裝置142及洗淨裝置143成為廢液之光阻液、顯影液及洗淨液透過廢液回收流路排出至回收裝置。在回收管145設有未圖示之開閉閥等。控制部CONT可控制上述開閉閥之開閉之時序。本實施形態中，由於在重力方向之最下部之處理室111設有濕式處理用之裝置，因此可抑制此等裝置與回收裝置之間之廢液回收流路之流路系之長度。The partition member 114a is provided with a plurality of recovery pipes 145 constituting a part of a waste liquid recovery flow path connected to a recovery device (not shown). One end portion of the recovery tube 145 is connected to each of the coating device 141, the developing device 142, and the cleaning device 143, and the other end portion is connected to a waste liquid recovery flow path (not shown) connected to the recovery device. Each recovery tube 145 discharges the photoresist liquid, the developing liquid, and the cleaning liquid that become waste liquid in the coating device 141, the developing device 142, and the cleaning device 143 through the waste liquid recovery flow path to the recovery device. The recovery pipe 145 is provided with an on-off valve and the like (not shown). The control unit CONT can control the timing of opening and closing the on-off valve. In this embodiment, since the processing chamber 111 in the lowermost direction of gravity is provided with a device for wet processing, the length of the flow path system of the waste liquid recovery flow path between these devices and the recovery device can be suppressed.

處理室112係配置在處理室111之上方(+Z軸側)。處理室112，形成對基板S進行加熱處理之處理空間。在處理室112，作為處理裝置110，設有加熱基板S之加熱裝置151~153。加熱裝置151加熱藉由塗布裝置141塗布有光阻液之基板S，使光阻液乾燥。加熱裝置152再次加熱已通過處理室113之曝光裝置EX之基板S，使光阻液乾燥。加熱裝置152以與加熱裝置151之加熱溫度不同溫度、例如較加熱裝置151之加熱溫度高之溫度加熱基板S。加熱裝置153加熱藉由顯影裝置142進行顯影處理且藉由洗淨裝置143洗淨後之基板S，使基板S之表面乾燥。加熱裝置151~153具有在內部使基板S折返複數次之構成。在加熱裝置151~153之內部，基板S以彼此不接觸之方式在重疊折返之狀態下被搬送。因此，可維持基板S之被處理面Sa之狀態並同時將基板S高效率地收容在加熱裝置151~153。The processing chamber 112 is disposed above the processing chamber 111 (+ Z axis side). The processing chamber 112 forms a processing space for heating the substrate S. In the processing chamber 112, as the processing device 110, heating devices 151 to 153 for heating the substrate S are provided. The heating device 151 heats the substrate S coated with the photoresist liquid by the coating device 141 to dry the photoresist liquid. The heating device 152 heats the substrate S of the exposure device EX that has passed through the processing chamber 113 again to dry the photoresist liquid. The heating device 152 heats the substrate S at a temperature different from the heating temperature of the heating device 151, for example, a temperature higher than the heating temperature of the heating device 151. The heating device 153 heats the substrate S subjected to the development processing by the developing device 142 and washed by the cleaning device 143 to dry the surface of the substrate S. The heating devices 151 to 153 have a structure in which the substrate S is folded back several times. Inside the heating devices 151 to 153, the substrates S are conveyed in a state of being overlapped and folded back so as not to contact each other. Therefore, the substrate S can be efficiently stored in the heating devices 151 to 153 while maintaining the state of the processing surface Sa of the substrate S.

處理室113係配置在處理室112之上方(+Z軸側)。處理室113，係對基板S進行曝光處理之處理空間。在處理室113，作為處理裝置110，設有曝光裝置EX。曝光裝置EX透過光罩之圖案對在塗布裝置141塗布於基板S之光阻層照射曝光用光。The processing chamber 113 is disposed above the processing chamber 112 (+ Z axis side). The processing chamber 113 is a processing space for exposing the substrate S. In the processing chamber 113, an exposure device EX is provided as the processing device 110. The exposure device EX irradiates light for exposure to the photoresist layer coated on the substrate S by the coating device 141 through the pattern of the photomask.

在上述構成之基板處理裝置200設有複數個升起部160(161~166)。升起部160在不同階之間搬送第一單元部21及第二單元部22。例如，升起部161、升起部164、升起部165及升起部166在第一階與第二階之間搬送第一單元部21及第二單元部22。又，例如升起部162及升起部163在第二階與第三階之間搬送第一單元部21及第二單元部22。The substrate processing apparatus 200 configured as described above is provided with a plurality of raised portions 160 (161 to 166). The lifting section 160 transports the first unit section 21 and the second unit section 22 between different steps. For example, the raised portion 161, the raised portion 164, the raised portion 165, and the raised portion 166 transport the first unit portion 21 and the second unit portion 22 between the first stage and the second stage. For example, the raised portion 162 and the raised portion 163 transport the first unit portion 21 and the second unit portion 22 between the second and third steps.

各升起部160分別具有在Z軸方向貫通分隔構件114b及分隔構件114c之升降機構160a。
圖15係顯示升起部160之概略構成之立體圖。
如圖15所示，升降機構160a連接於第一單元部21之外部連接部40d或第二單元部22之連接部60d。升降機構160a具有使第一單元部21及第二單元部22往Z軸方向移動之未圖示之移動機構。升降機構160a能使一體化狀態之第一單元部21及第二單元部22往Z軸方向移動。Each of the raised portions 160 includes a lifting mechanism 160 a that penetrates the partition member 114 b and the partition member 114 c in the Z-axis direction.
FIG. 15 is a perspective view showing a schematic configuration of the raised portion 160.
As shown in FIG. 15, the lifting mechanism 160 a is connected to the external connection portion 40 d of the first unit portion 21 or the connection portion 60 d of the second unit portion 22. The elevating mechanism 160a includes a not-shown moving mechanism that moves the first unit portion 21 and the second unit portion 22 in the Z-axis direction. The lifting mechanism 160a can move the first unit portion 21 and the second unit portion 22 in the integrated state in the Z-axis direction.

又，升起部160具有使已跨階搬送之第一單元部21及第二單元部22分別安裝在設在搬送對象之階之移動部42及移動部62之筐體51及71之安裝部(未圖示)。藉此，收容於第一單元部21及第二單元部22之基板S可跨階移動。In addition, the lifting section 160 has mounting sections for the first unit section 21 and the second unit section 22 that have been transported across steps to be mounted on the casings 51 and 71 of the moving section 42 and the moving section 62 provided at the stage to be transported, respectively. (Not shown). Thereby, the substrate S accommodated in the first unit portion 21 and the second unit portion 22 can be moved in steps.

接著，說明上述基板處理裝置200之動作。
控制部CONT，將第一單元部21及第二單元部22從既定入口搬入處理室111，沿著導軌30往塗布裝置141移動。控制部CONT，在塗布裝置141，藉由與上述第一實施形態相同之動作，將第一單元部21配置在塗布裝置141之+Y側，將第二單元部22配置在塗布裝置141之-Y側。在此狀態下，控制部CONT，將基板S從第一單元部21往第二單元部22搬送，並同時對基板S之被處理面進行感光劑之塗布處理。Next, the operation of the substrate processing apparatus 200 will be described.
The control unit CONT carries the first unit unit 21 and the second unit unit 22 into the processing chamber 111 from a predetermined entrance, and moves the coating unit 141 along the guide rail 30. The control unit CONT arranges the first unit portion 21 on the + Y side of the coating device 141 and the second unit portion 22 on the coating device 141- Y side. In this state, the control unit CONT transports the substrate S from the first unit unit 21 to the second unit unit 22, and at the same time performs a coating process of the photosensitive agent on the processed surface of the substrate S.

在塗布裝置141進行處理後，控制部CONT，使第一單元部21及第二單元部22一體化，往升起部161移動。第一單元部21及第二單元部22到達升起部161之後，控制部CONT，在使第一單元部21與第二單元部22連接之狀態下，例如使第二單元部22之連接部60d連接於升起部161之升降機構160a。之後，控制部CONT，在使用升降機構160a使第一單元部21及第二單元部22一體化之狀態下，往+Z軸方向搬送。藉由此動作，解除第一單元部21與筐體51之間、第二單元部22與筐體71之間之安裝狀態，第一單元部21及第二單元部22從筐體51及筐體71分離，往+Z軸方向移動，從處理室111往處理室112搬送。After the coating device 141 performs the processing, the control unit CONT integrates the first unit unit 21 and the second unit unit 22 and moves to the raised portion 161. After the first unit portion 21 and the second unit portion 22 reach the raised portion 161, the control unit CONT connects the first unit portion 21 and the second unit portion 22, for example, the connection portion of the second unit portion 22 60d is connected to a lifting mechanism 160a of the lifting portion 161. After that, the control unit CONT transports the first unit unit 21 and the second unit unit 22 in the state of integrating the first unit unit 21 and the second unit unit 22 using the lifting mechanism 160a, and then transports the unit unit 21 in the + Z axis direction. With this operation, the installation state between the first unit portion 21 and the casing 51 and between the second unit portion 22 and the casing 71 is released, and the first unit portion 21 and the second unit portion 22 are removed from the casing 51 and the basket. The body 71 is separated, moves in the + Z axis direction, and is transported from the processing chamber 111 to the processing chamber 112.

控制部CONT，使配置在處理室112之移動部42及移動部62預先待機在升起部161之附近。控制部CONT，使用未圖示之安裝部使搬送至處理室112之第一單元部21及第二單元部22分別安裝在上述移動部42及移動部62。The control unit CONT causes the moving unit 42 and the moving unit 62 disposed in the processing chamber 112 to stand by in the vicinity of the raised portion 161 in advance. The control unit CONT uses a mounting unit (not shown) to mount the first unit unit 21 and the second unit unit 22 that are transported to the processing chamber 112 to the moving unit 42 and the moving unit 62, respectively.

之後，控制部CONT使用第一單元部21及第二單元部22將基板S搬入加熱裝置151，對基板S進行加熱處理。在加熱裝置151，在基板S例如彎折複數次之狀態下搬送基板S，在此搬送狀態下進行基板S之加熱。因此，可進行有效率地利用空間之加熱處理。在加熱裝置151，藉由加熱使形成在基板S之塗布膜乾燥。After that, the control unit CONT carries the substrate S into the heating device 151 using the first unit unit 21 and the second unit unit 22, and heats the substrate S. In the heating device 151, the substrate S is conveyed in a state where the substrate S is bent multiple times, for example, and the substrate S is heated in the conveyed state. Therefore, a heat treatment using space efficiently can be performed. In the heating device 151, the coating film formed on the substrate S is dried by heating.

在進行加熱處理後，控制部CONT，藉由上述相同之動作，透過升起部162將第一單元部21及第二單元部22搬送至處理室113。控制部CONT，在處理室113，將第一單元部21及第二單元部22搬入曝光裝置EX，對塗布在基板S之感光劑進行曝光處理。After the heat treatment is performed, the control unit CONT transfers the first unit unit 21 and the second unit unit 22 to the processing chamber 113 through the lifting unit 162 through the same operation as described above. The control unit CONT carries the first unit unit 21 and the second unit unit 22 into the exposure apparatus EX in the processing chamber 113, and performs exposure processing on the photosensitive agent applied to the substrate S.

在進行曝光處理後，控制部CONT，透過升起部163將第一單元部21及第二單元部22搬送至處理室112。控制部CONT，在處理室112，將第一單元部21及第二單元部22搬入加熱裝置152，對基板S進行加熱處理。在加熱裝置152，進行對感光後之塗布膜之加熱處理。After performing the exposure processing, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 through the lifting unit 163. The control unit CONT carries the first unit unit 21 and the second unit unit 22 into the heating device 152 in the processing chamber 112 to heat-process the substrate S. In the heating device 152, a heat treatment is performed on the photosensitive coating film.

在進行加熱處理後，控制部CONT，透過升起部164將第一單元部21及第二單元部22搬送至處理室111。控制部CONT，在處理室111，將第一單元部21及第二單元部22搬入顯影裝置142，對基板S進行顯影處理。在顯影裝置142，基板S浸於顯影液並同時從第一單元部21往第二單元部22搬送，在搬送之過程進行顯影處理。After the heat treatment, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 111 through the lifting unit 164. The control unit CONT carries the first unit unit 21 and the second unit unit 22 into the developing device 142 in the processing chamber 111 and performs a development process on the substrate S. In the developing device 142, the substrate S is immersed in a developing solution and is transferred from the first unit portion 21 to the second unit portion 22 at the same time, and the developing process is performed during the transfer.

在進行顯影處理後，控制部CONT，使第一單元部21及第二單元部22在一體化之狀態下往洗淨裝置143移動，將基板S搬入洗淨裝置143。在洗淨裝置143，基板S浸於洗淨液並同時從第一單元部21往第二單元部22搬送，在搬送之過程進行洗淨處理。After the development process is performed, the control unit CONT moves the first unit unit 21 and the second unit unit 22 to the cleaning device 143 in an integrated state, and carries the substrate S into the cleaning device 143. In the cleaning device 143, the substrate S is immersed in a cleaning solution and is simultaneously transported from the first unit portion 21 to the second unit portion 22, and a cleaning process is performed during the transportation.

在進行洗淨處理後，控制部CONT，透過升起部165將第一單元部21及第二單元部22搬送至處理室112。控制部CONT，在處理室112，將第一單元部21及第二單元部22搬入加熱裝置153，對基板S進行加熱處理。在加熱裝置153，進行用以使洗淨後之基板S乾燥之加熱處理或用以加熱塗布膜之加熱處理等。After the cleaning process is performed, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 through the lifting unit 165. The control unit CONT carries the first unit unit 21 and the second unit unit 22 into the heating device 153 in the processing chamber 112 to heat-process the substrate S. In the heating device 153, a heat treatment for drying the cleaned substrate S or a heat treatment for heating the coating film is performed.

在進行加熱處理後，控制部CONT，透過升起部166將第一單元部21及第二單元部22搬送至處理室111。控制部CONT，在處理室111，使第一單元部21及第二單元部22移動至鍍金裝置144，將基板S搬入鍍金裝置144。在鍍金裝置144，基板S浸於鍍金液並同時從第一單元部21往第二單元部22搬送，在搬送之過程進行鍍金處理。在進行鍍金處理後之基板S形成既定圖案。After the heat treatment is performed, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 111 through the lifting unit 166. The control unit CONT moves the first unit portion 21 and the second unit portion 22 to the gold plating device 144 in the processing chamber 111, and carries the substrate S into the gold plating device 144. In the gold plating device 144, the substrate S is immersed in a gold plating solution and is simultaneously transferred from the first unit portion 21 to the second unit portion 22, and is subjected to gold plating processing during the transfer. The substrate S after the gold plating process is formed into a predetermined pattern.

在進行鍍金處理後，控制部CONT，透過升起部166將第一單元部21及第二單元部22搬送至處理室112。控制部CONT，在處理室112，將第一單元部21及第二單元部22搬入未圖示之加熱裝置，進行加熱處理。After performing the gold plating process, the control unit CONT transports the first unit unit 21 and the second unit unit 22 to the processing chamber 112 through the lifting unit 166. The control unit CONT carries the first unit unit 21 and the second unit unit 22 into a heating device (not shown) in the processing chamber 112 and performs heating processing.

如上述，本實施形態之基板處理裝置200，在例如處理室111，在第一軌道31與第二軌道32之間，作為處理裝置110設有彼此進行不同處理之塗布裝置141、顯影裝置142、洗淨裝置143及鍍金裝置144，在此等各裝置(塗布裝置141、顯影裝置142、洗淨裝置143及鍍金裝置144)之間，使第一單元部21及第二單元部22移動，同時第一單元部21對各裝置供應基板S，第二單元部22回收基板S，因此可在複數個處理裝置110進行單晶圓處理。As described above, the substrate processing apparatus 200 of this embodiment is provided with, for example, the processing chamber 111 between the first rail 31 and the second rail 32 as the processing apparatus 110. The coating apparatus 141, the developing apparatus 142, and The cleaning device 143 and the gold plating device 144 move the first unit portion 21 and the second unit portion 22 between these devices (the coating device 141, the developing device 142, the cleaning device 143, and the gold plating device 144). Since the first unit section 21 supplies the substrate S to each device, and the second unit section 22 recovers the substrate S, a single wafer process can be performed in the plurality of processing devices 110.

藉此，可抑制從送出至捲繞為止掛架之基板S之尺寸變長，因此能減輕搬送時基板S之管理負擔。又，即使在一個生產線包含處理速度不同之複數個處理裝置110之情形，亦無須在生產線整體使處理速度一致，因此可有效率地利用各處理裝置110。再者，在具有複數個階層之基板處理裝置200，能將第一單元部21及第二單元部22從移動部42及移動部62分割並在不同階層之間搬送，因此能進行有效率之搬送。Thereby, it is possible to suppress the length of the substrate S in the rack from being delivered to the winding, and therefore, it is possible to reduce the management load of the substrate S during the transportation. In addition, even in a case where a plurality of processing apparatuses 110 having different processing speeds are included in one production line, it is not necessary to make the processing speeds uniform in the entire production line. Therefore, each processing apparatus 110 can be efficiently used. Furthermore, in the substrate processing apparatus 200 having a plurality of levels, the first unit portion 21 and the second unit portion 22 can be divided from the moving portion 42 and the moving portion 62 and transferred between different levels, so that it can be efficiently performed. Transport.

本發明之技術範圍並不限於上述實施形態，在不脫離本發明趣旨之範圍內可施加適當變更。
例如，上述實施形態中，以第一單元部21及第二單元部22之間設成可裝卸之構成為例進行說明，但並不限於此。The technical scope of the present invention is not limited to the above-mentioned embodiments, and appropriate changes can be made without departing from the scope of the present invention.
For example, in the embodiment described above, the configuration in which the first unit section 21 and the second unit section 22 are detachably mounted is taken as an example for description, but it is not limited thereto.

例如，為第一單元部21及第二單元部22彼此未安裝而僅進行接近及分離之構成亦可。又，並非第一單元部21與第二單元部22安裝，而是支承第一單元部21之移動部42與支承第二單元部22之移動部62可裝卸之構成亦可。For example, a configuration in which the first unit portion 21 and the second unit portion 22 are not attached to each other and only approach and separate may be adopted. In addition, instead of attaching the first unit portion 21 and the second unit portion 22, the moving portion 42 supporting the first unit portion 21 and the moving portion 62 supporting the second unit portion 22 may be detachable.

又，例如，上述實施形態中，以第一單元部21為基板S供應用、第二單元部22為基板S回收用為例進行說明，但並不限於此。例如，以第一單元部21為基板S回收用、第二單元部22為基板S供應用亦可。又，使第一單元部21及第二單元部22為相同構成，在導軌30上使第一單元部21與第二單元部22彼此替換，適當地切換供應動作與回收動作並同時進行基板S之搬送亦可。For example, in the above-mentioned embodiment, the first unit portion 21 is used for the supply of the substrate S and the second unit portion 22 is used for the recovery of the substrate S. However, the present invention is not limited to this. For example, the first unit portion 21 may be used for recovering the substrate S, and the second unit portion 22 may be used for supplying the substrate S. In addition, the first unit portion 21 and the second unit portion 22 have the same configuration, and the first unit portion 21 and the second unit portion 22 are replaced with each other on the guide rail 30, and the supply operation and the recovery operation are appropriately switched and the substrate S is simultaneously performed It can also be transported.

又，上述第二實施形態中，以基板處理裝置具有複數個階層之構成為例進行說明，但並不限於此。例如，如圖16所示，在Y軸方向配置有複數個生產線之構成亦可。此情形，作為處理部10之構成，在Y軸方向配置進行相同種類之處理之裝置之構成亦可。In the second embodiment described above, the substrate processing apparatus has a plurality of layers as an example, but it is not limited to this. For example, as shown in FIG. 16, a configuration in which a plurality of production lines are arranged in the Y-axis direction may be used. In this case, as the configuration of the processing unit 10, a configuration in which a device that performs the same kind of processing is arranged in the Y-axis direction may be used.

又，上述實施形態中，以在基部51b及基部71b之-Z軸側之端面51d及71d設有位置檢測部55及75之構成為例進行說明，但並不限於此。例如，如圖17所示，設有接觸於導軌30之端子(電力取得部)56及76之構成亦可。此情形，使電源預先連接於導軌30，藉此可透過端子56及76取得電力。Moreover, in the said embodiment, although the structure provided with the position detection parts 55 and 75 in the end surface 51d and 71d of the -Z axis side of the base part 51b and the base part 71b was demonstrated as an example, it is not limited to this. For example, as shown in FIG. 17, a configuration may be provided in which terminals (electric power acquisition units) 56 and 76 contacting the guide rail 30 are provided. In this case, the power source is connected to the guide rail 30 in advance, and thereby power can be obtained through the terminals 56 and 76.

又，例如，上述實施形態中，以第一單元部21及第二單元部22單方向通過處理部10而移動之情形為例進行說明，但並不限於此。In addition, for example, in the embodiment described above, the case where the first unit portion 21 and the second unit portion 22 are moved by the processing unit 10 in one direction is described as an example, but it is not limited thereto.

圖18(a)~圖18(c)係顯示第一單元部21及第二單元部22之移動動作之一例之圖。
例如，控制部CONT，如圖18(a)所示，將第一單元部21與第二單元部22拉離以引出基板S，如圖18(b)所示，使第一單元部21及第二單元部22沿著+X軸方向搬入處理部10並進行處理。之後，如圖18(c)所示，使第一單元部21及第二單元部22沿著-X軸方向返回移動亦可。藉此，處理部10之構成上，即使有基板S不易通過X軸方向之情形，亦可有效率地搬送基板S。18 (a) to 18 (c) are diagrams showing an example of a movement operation of the first unit portion 21 and the second unit portion 22.
For example, as shown in FIG. 18 (a), the control unit CONT pulls the first unit portion 21 and the second unit portion 22 apart to pull out the substrate S. As shown in FIG. 18 (b), the first unit portion 21 and The second unit section 22 is carried into the processing section 10 along the + X axis direction and processed. After that, as shown in FIG. 18 (c), the first unit portion 21 and the second unit portion 22 may be moved back in the -X axis direction. Thereby, even if the board | substrate S does not easily pass the X-axis direction in the structure of the processing part 10, the board | substrate S can be efficiently conveyed.

又，上述實施形態中，以在第一導軌31側配置第一單元部21及第二單元部22之後、使第二單元部22往第二導軌32側移動以引出基板S之情形為例進行說明，但並不限於此。例如，使第一單元部21從第二導軌32側往第一導軌31側移動，藉此引出基板S亦可。In the above embodiment, the case where the first unit portion 21 and the second unit portion 22 are arranged on the first rail 31 side, the second unit portion 22 is moved to the second rail 32 side, and the substrate S is pulled out is taken as an example. Explanation, but not limited to this. For example, the first unit portion 21 may be moved from the side of the second rail 32 to the side of the first rail 31 to thereby pull out the substrate S.

又，如圖19(a)所示，將第一單元部21及第二單元部22配置在第三軌道33之Y軸方向之中央部，之後，如圖19(b)所示，藉由使第一單元部21往+Y軸方向移動且第二單元部22往-Y軸方向移動，藉此引出基板S亦可。As shown in FIG. 19 (a), the first unit portion 21 and the second unit portion 22 are arranged at the center portion in the Y-axis direction of the third rail 33. Thereafter, as shown in FIG. 19 (b), The first unit portion 21 may be moved in the + Y-axis direction and the second unit portion 22 may be moved in the -Y-axis direction, thereby drawing the substrate S.

又，上述實施形態中，以第一單元部21及第二單元部22在Y軸方向排列之狀態下往X軸方向移動之情形為例進行說明，但並不限於此。例如，使第一單元部21及第二單元部22在X軸方向排列之狀態下往Y軸方向移動亦可。Moreover, in the said embodiment, although the case where the 1st unit part 21 and the 2nd unit part 22 moved to the X-axis direction in the state arrange | positioned in the Y-axis direction is demonstrated as an example, it is not limited to this. For example, the first unit portion 21 and the second unit portion 22 may be moved in the Y-axis direction in a state in which the X-axis direction is aligned.

例如，如圖20(a)所示，在X軸方向夾著處理部10之二個第三軌道33與第二軌道32之交叉點分別配置第一單元部21與第二單元部22。此時，設基板S為引出之狀態。之後，如圖20(b)所示，使第一單元部21及第二單元部22往+Y軸方向移動，藉此將基板S搬入處理部10。藉此，處理部10之構成上，即使有基板S不易在X軸方向搬入之情形，亦可有效率地搬送基板S。For example, as shown in FIG. 20 (a), the first unit portion 21 and the second unit portion 22 are respectively disposed at the intersections of the two third rails 33 and the second rails 32 of the processing unit 10 in the X-axis direction. At this time, the substrate S is taken out. Thereafter, as shown in FIG. 20 (b), the first unit unit 21 and the second unit unit 22 are moved in the + Y-axis direction, thereby carrying the substrate S into the processing unit 10. Thereby, even if the board | substrate S is difficult to carry in the X-axis direction in the structure of the processing part 10, the board | substrate S can be efficiently conveyed.

又，上述實施形態中，作為連接部23之構成，以第一連接部23a與第二連接部23b之間被電磁石吸附之構成為例進行說明，但並不限於此，為機械性鎖固以連接之構成亦可。In the above embodiment, as the configuration of the connection portion 23, the configuration in which the first connection portion 23a and the second connection portion 23b are adsorbed by the electromagnet will be described as an example, but it is not limited to this. A connection structure is also possible.

又，上述實施形態中，針對驅動基板S之軸部41a及軸部61a或驅動保護基板C之軸部48a及軸部68a，以例如中心軸之軸線方向配置成與X軸方向平行、基板S或保護基板C與XY平面平行地搬送之構成為例進行說明，但並不限於此。例如，針對軸部41a及軸部61a或軸部48a及軸部68a，為中心軸之軸線方向配置成與Z軸方向平行、基板S或保護基板C與YZ平面或ZX平面平行地搬送之構成亦可。Further, in the above-mentioned embodiment, the shaft portion 41a and the shaft portion 61a of the drive substrate S or the shaft portion 48a and the shaft portion 68a of the drive protection substrate C are arranged parallel to the X-axis direction and the substrate S, for example, in the axial direction of the central axis. The configuration in which the protective substrate C is transported in parallel with the XY plane is described as an example, but it is not limited to this. For example, the shaft portion 41a and the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a are arranged in such a manner that the axis direction of the central axis is parallel to the Z-axis direction, and the substrate S or the protective substrate C is transported in parallel with the YZ plane or the ZX plane. Yes.

又，上述實施形態中，以移動部42及移動部62之筐體51及71在Z軸方向升降而可調整軸部41a、軸部61a、軸部48a及軸部68a之Z軸方向之位置之形態為例進行說明，但並不限於此。例如，為軸部41a、軸部61a、軸部48a及軸部68a可在Z軸方向升降之構成亦可。Further, in the above-mentioned embodiment, the positions of the shaft portion 41a, the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a in the Z-axis direction can be adjusted by moving the housings 51 and 71 of the moving portion 42 and the moving portion 62 in the Z-axis direction. The form is described as an example, but it is not limited to this. For example, the shaft portion 41a, the shaft portion 61a, the shaft portion 48a, and the shaft portion 68a may be configured to be movable in the Z-axis direction.

又，可使用與上述實施形態不同構成之基板S。
圖21係顯示基板S之構成之圖。
如圖21所示，為形成有保護層90之構成亦可，該保護層90包圍基板S之被處理面Sa中之例如形成配線或電極、元件等之圖案形成區域P。A substrate S having a structure different from that of the above embodiment can be used.
FIG. 21 is a diagram showing the structure of the substrate S. FIG.
As shown in FIG. 21, it is also possible to have a configuration in which a protective layer 90 is formed, and the protective layer 90 surrounds, for example, a pattern forming region P in which a wiring, an electrode, an element, or the like is formed in the processing surface Sa of the substrate S.

上述保護層90形成為層厚大於圖案形成區域P。藉由此構成，即使保護基板C重疊於被處理面Sa之情形，亦可防止保護基板C接觸圖案形成區域P。此外，保護層90形成在保護基板C側亦可。The protective layer 90 is formed to have a layer thickness larger than that of the pattern formation region P. With this configuration, even when the protective substrate C overlaps the processing surface Sa, the protective substrate C can be prevented from contacting the pattern formation region P. The protective layer 90 may be formed on the protective substrate C side.

圖22~圖27係顯示基板搬送裝置之另一實施形態之立體圖。如上述圖2、圖3所說明，可搭載第一單元部21且自走之移動部42可藉由腳輪52之旋轉往X軸方向、Y軸方向及θZ軸方向移動。此點在可搭載第二單元部22且自走之移動部62亦相同。因此，如上述圖18~圖20所示，對在X軸方向延伸之第一軌道31與第二軌道32、在Y軸方向延伸之第三軌道33所構成之搬送導引機構，如圖22所示，鋪設作為附加搬送導引部之環狀軌道34a, 35a。22 to 27 are perspective views showing another embodiment of the substrate transfer apparatus. As described in FIG. 2 and FIG. 3 described above, the first unit portion 21 can be mounted and the self-propelled moving portion 42 can be moved in the X-axis direction, the Y-axis direction, and the θZ-axis direction by the rotation of the caster 52. This is also the same with the self-propelled moving section 62 in which the second unit section 22 can be mounted. Therefore, as shown in FIG. 18 to FIG. 20 described above, the transport guide mechanism composed of the first rail 31 and the second rail 32 extending in the X-axis direction and the third rail 33 extending in the Y-axis direction is shown in FIG. 22 As shown, loop tracks 34a, 35a are laid as additional transport guides.

環狀軌道34a係鋪設成從第一軌道31與第三軌道33交叉之中心點TC1起一定半徑之圓環狀。又，環狀軌道35a係鋪設成從第二軌道32與第三軌道33交叉之中心點TC2起一定半徑之圓環狀。環狀軌道34a, 35a作用為用以使移動部42或移動部62繞中心點TC1或TC2之周圍旋動(旋轉)之導引路徑。又，在中心點TC1, TC2之各個舖設有用以正確地定位移動部42, 62之圓板狀之標示部(包含作為指標之標記或感應訊號產生器等)34b, 35b。The ring-shaped track 34a is laid in a ring shape with a certain radius from the center point TC1 where the first track 31 and the third track 33 intersect. Further, the ring-shaped track 35a is laid in a ring shape with a certain radius from the center point TC2 where the second track 32 and the third track 33 intersect. The ring-shaped rails 34a, 35a function as a guide path for causing the moving part 42 or the moving part 62 to rotate (rotate) around the center point TC1 or TC2. In addition, each of the laying points at the center points TC1 and TC2 is used to accurately locate the circular plate-shaped marking portions (including markers or induction signal generators, etc.) 34b, 35b of the moving portions 42, 62.

接著，圖22所示之處理裝置10為例如大氣壓CVD裝置，以上部構造體10a與下部構造體10b構成。下部構造體10b係設置在工廠之地面(FL)，上部構造體10a相對於下部構造體10b在Z軸方向可動。
藉由使上部構造體10a在Z軸方向之上方移動，可將掛架在第一單元部21之軸部41c與第二單元部22之軸部61c之間之基板S在X軸方向並進移動並搬出處理裝置10外。Next, the processing apparatus 10 shown in FIG. 22 is, for example, an atmospheric pressure CVD apparatus, and includes an upper structure 10a and a lower structure 10b. The lower structure 10b is installed on the floor (FL) of the factory, and the upper structure 10a is movable in the Z-axis direction with respect to the lower structure 10b.
By moving the upper structure 10a above the Z-axis direction, the substrate S suspended between the shaft portion 41c of the first unit portion 21 and the shaft portion 61c of the second unit portion 22 can be moved in the X-axis direction. And carried out of the processing device 10.

圖22係顯示處理裝置10之基板S之處理結束、上部構造體10a位於上方之狀態下、使移動部42(第一單元部21)與移動部62(第二單元部22)往X軸方向同步移動之狀態。移動部42(第一單元部21)被第一軌道31導引並同時朝向作為原位置之中心點TC1往-X軸方向移動，移動部62(第二單元部22)被第二軌道32導引並同時朝向作為原位置之中心點TC2往-X軸方向移動。FIG. 22 shows that the processing of the substrate S of the processing device 10 is completed, and the moving part 42 (the first unit part 21) and the moving part 62 (the second unit part 22) are moved in the X-axis direction with the upper structure body 10a positioned upward. Status of synchronous movement. The moving part 42 (the first unit part 21) is guided by the first track 31 and simultaneously moves toward the -X axis toward the center point TC1 as the original position, and the moving part 62 (the second unit part 22) is guided by the second track 32 At the same time, it moves towards the -X axis direction toward the center point TC2 which is the original position.

之後，如圖23所示，移動部42(第一單元部21)與移動部62(第二單元部22)皆到達X軸方向之原位置(中心點TC1, TC2之位置)。此時，在Y軸方向延伸之第三軌道33正好位於移動部42與移動部62之間。Thereafter, as shown in FIG. 23, both the moving portion 42 (the first unit portion 21) and the moving portion 62 (the second unit portion 22) reach the original positions in the X-axis direction (the positions of the center points TC1, TC2). At this time, the third rail 33 extending in the Y-axis direction is located exactly between the moving portion 42 and the moving portion 62.

之後，移動部42(第一單元部21)與移動部62(第二單元部22)之任一方朝向另一方在Y軸方向移動。之狀態如圖24所示，此處，移動部42(第一單元部21)朝向移動部62(第二單元部22)，被第三軌道33導引移動。此時，第一單元部21之軸部41c或第二單元部22之軸部61c，與移動部42(第一單元部21)之Y軸方向之移動連動旋轉，將基板S以不鬆弛之方式捲繞。After that, either one of the moving portion 42 (the first unit portion 21) and the moving portion 62 (the second unit portion 22) moves in the Y-axis direction toward the other side. The state is shown in FIG. 24. Here, the moving part 42 (the first unit part 21) faces the moving part 62 (the second unit part 22) and is guided and moved by the third rail 33. At this time, the shaft portion 41c of the first unit portion 21 or the shaft portion 61c of the second unit portion 22 rotates in conjunction with the movement in the Y-axis direction of the moving portion 42 (the first unit portion 21), so that the substrate S is not loosened. Way winding.

圖25係顯示移動部42(第一單元部21)接近移動部62(第二單元部22)、如上述圖5所示連結(連接)之狀態。此時，移動部62(第二單元部22)位於中心點TC2(標示部35b)上，移動部42(第一單元部21)位於環狀軌道35a上。FIG. 25 shows a state where the moving section 42 (first unit section 21) approaches the moving section 62 (second unit section 22) and is connected (connected) as shown in FIG. 5 described above. At this time, the moving part 62 (the second unit part 22) is located on the center point TC2 (the marking part 35b), and the moving part 42 (the first unit part 21) is located on the ring-shaped rail 35a.

移動部62之腳輪72從此狀態在中心點TC2之周圍產生往θZ軸方向使移動部62(第二單元部22)旋動(自轉)之驅動力。一併地，移動部42之腳輪52產生沿著環狀軌道35a之周方向使移動部42(第一單元部21)旋動(旋轉)之驅動力。再者，此時，移動部62之腳輪72或移動部42之腳輪52，根據標示部35b之檢測結果，進行移動部62之自轉中心不會從中心點TC2往X軸方向與Y軸方向大幅地位置偏移之方向控制。From this state, the caster 72 of the moving part 62 generates a driving force for rotating (rotating) the moving part 62 (the second unit part 22) in the θZ axis direction around the center point TC2. Together, the casters 52 of the moving portion 42 generate a driving force that rotates (rotates) the moving portion 42 (first unit portion 21) along the circumferential direction of the ring-shaped rail 35a. Furthermore, at this time, the caster 72 of the moving part 62 or the caster 52 of the moving part 42 performs the rotation center of the moving part 62 from the center point TC2 in the X-axis direction and the Y-axis direction based on the detection result of the indicator 35b. Direction control of ground position offset.

圖26係顯示連結之移動部42(第一單元部21)與移動部62(第二單元部22)從圖25之狀態在XY面內以中心點TC2作為中心順時針旋轉90度之狀態。其旋轉方向在此處雖為順時針旋轉90度，但逆時針旋轉90度亦可。往哪個方向旋轉係依據對下一個處理裝置如何裝填基板S來決定。FIG. 26 shows a state where the moving portion 42 (the first unit portion 21) and the moving portion 62 (the second unit portion 22) that are connected are rotated 90 degrees clockwise from the state of FIG. 25 with the center point TC2 as the center in the XY plane. The rotation direction here is 90 degrees clockwise, but 90 degrees counterclockwise may be used. The rotation direction is determined by how the substrate S is loaded in the next processing apparatus.

之後，如圖27所示，保持由處理裝置10(例如，大氣壓CVD裝置)成膜處理後之基板S之捲軸之第二單元部22(移動部62)、與保持其餘之未處理之基板S之捲軸之第一單元部21(移動部42)係藉由第二軌道32之導引在+X軸方向成為一體且並進移動，橫向通過處理裝置10朝向下一個處理裝置。Thereafter, as shown in FIG. 27, the second unit section 22 (moving section 62) holding the reel of the substrate S after the film formation process by the processing apparatus 10 (for example, an atmospheric pressure CVD apparatus), and the remaining unprocessed substrate S are held The first unit section 21 (moving section 42) of the scroll is integrated and moved in the + X axis direction by the guidance of the second rail 32, and passes laterally through the processing device 10 toward the next processing device.

藉此，原位置(中心點TC1, TC2)空出，因此搭載下一個待處理基板S之移動部42-1(第一單元部21-1)與移動部62-1(第二單元部22-1)成為一體送往中心點TC1側之原位置。
之後，如圖27所示，在保持未處理之基板S之捲軸之第一單元部21-1(移動部42-1)位於中心點TC1(第一軌道31與第三軌道33之交叉點部)之狀態下，用以將已處理之基板S捲繞成捲軸狀之第二單元部22-1(移動部62-1)朝向中心點TC2沿著第三軌道33移動。With this, the original positions (center points TC1, TC2) are vacated, so the moving part 42-1 (first unit part 21-1) and moving part 62-1 (second unit part 22) of the next substrate S to be processed are mounted -1) It becomes the original position that is sent to the center point TC1 as a whole.
Thereafter, as shown in FIG. 27, the first unit portion 21-1 (moving portion 42-1) holding the reel of the unprocessed substrate S is located at the center point TC1 (the intersection portion of the first track 31 and the third track 33) ) State, the second unit portion 22-1 (moving portion 62-1) for winding the processed substrate S into a reel shape moves along the third track 33 toward the center point TC2.

如上述，移動部42(第一單元部21)或移動部62(第二單元部22)，藉由在工廠之地面FL上設置可自由地旋轉運動之空間(環狀軌道34a, 35a等)，能使處理裝置之配置之自由度、基板S(捲軸狀)之搬送方向之自由度、搬送效率提升。As described above, the moving section 42 (the first unit section 21) or the moving section 62 (the second unit section 22) is provided with a space (rotary rails 34a, 35a, etc.) that can freely rotate on the floor FL of the factory. , Can improve the degree of freedom in the arrangement of the processing device, the degree of freedom in the direction of the substrate S (reel-shaped), and the efficiency of the transfer.

以上之實施形態中，圖25、圖26中，使以一定間隔連結之移動部42(第一單元部21)與移動部62(第二單元部22)旋轉90度。然而，下一個處理裝置設置在例如圖25中之處理裝置10之-Y軸側之情形，沿著在-Y軸方向延伸之第三軌道33，使移動部42(第一單元部21)與移動部62(第二單元部22)直接往-Y軸方向移動亦可，從圖25之狀態繞中心點TC2周圍旋轉180度後往-Y軸方向移動亦可。In the above embodiment, in FIGS. 25 and 26, the moving portion 42 (the first unit portion 21) and the moving portion 62 (the second unit portion 22) connected at a certain interval are rotated by 90 degrees. However, in a case where the next processing device is provided, for example, on the -Y axis side of the processing device 10 in Fig. 25, the moving section 42 (the first unit section 21) and the third section 33 extend in the -Y axis direction, and The moving portion 62 (the second unit portion 22) may be directly moved in the -Y axis direction, or may be rotated in the -Y axis direction by rotating 180 degrees around the center point TC2 from the state shown in Fig. 25.

此外，圖25~圖27中，移動部42(第一單元部21)與移動部62(第二單元部22)在以一定間隔連結之狀態下移動。然而，兩者未必要機械性接觸，使用非接觸感測器等保持一定之空間間隙並同時在一定之位置偏移範圍內(例如1mm以下)使移動部42與移動部62相互追隨移動亦可。In addition, in FIGS. 25 to 27, the moving portion 42 (the first unit portion 21) and the moving portion 62 (the second unit portion 22) are moved while being connected at a certain interval. However, it is not necessary for the two to be in mechanical contact. It is also possible to use a non-contact sensor or the like to maintain a certain spatial gap and simultaneously move the moving part 42 and the moving part 62 within a certain position offset range (for example, 1 mm or less). .

不論如何，為了將對基板S之處理已完成之移動部42(第一單元部21)與移動部62(第二單元部22)搬送至下一個處理裝置(第二處理裝置)，伴隨著基板S往從已進行上述處理之處理裝置離開之第一方向(圖22~圖27中為X軸方向)之並進運動、往與上述第一方向交叉之第二方向(圖22~圖27中為Y軸方向) 之並進運動、在包含第一方向與第二方向之面內(圖22~圖27中為XY面)之旋轉運動中之至少二個運動(二個運動連續)，驅動各腳輪52, 72，使移動部42與移動部62一起移動。此外，並進運動未必限於X軸方向或Y軸方向，亦包含移動部42(第一單元部21)或移動部62(第二單元部22)在XY面內相對於X軸與Y軸之兩方傾斜之方向(例如，45度方向)直線移動之情形。In any case, in order to transfer the moving section 42 (first unit section 21) and moving section 62 (second unit section 22) for which the processing of the substrate S has been completed to the next processing apparatus (second processing apparatus), the substrate S moves in parallel to the first direction (X-axis direction in FIG. 22 to FIG. 27) away from the processing device that has undergone the above processing, and to the second direction (FIG. 22 to FIG. 27) that intersects the first direction. Y axis direction), at least two motions (two motions are continuous) among the rotation motions in the plane including the first direction and the second direction (XY plane in Fig. 22 to Fig. 27), driving each caster 52, 72 to move the moving part 42 together with the moving part 62. In addition, the parallel movement is not necessarily limited to the X-axis direction or the Y-axis direction, and also includes the moving portion 42 (the first unit portion 21) or the moving portion 62 (the second unit portion 22) in the XY plane with respect to both the X-axis and the Y-axis. In the case of a rectilinear oblique direction (for example, a 45-degree direction).

以上，說明了使用圖2~圖5所示之匣裝置(第一單元部21、第二單元部22)之基板S(或保護基板C)之搬送形態。然而，在各匣裝置內設置基板S之溫度之調整機構、濕度之調整機構、紫外線之照射機構等，作為處理裝置之一，設置溫度調整裝置、濕度調整裝置、紫外線照射裝置，在處理步驟中之適當時序對基板S進行調溫、除濕、加濕、UV照射亦可。In the above, the conveyance form of the board | substrate S (or the protective board | substrate C) using the cassette apparatus (the 1st unit part 21 and the 2nd unit part 22) shown in FIG. 2 ~ 5 was demonstrated. However, the temperature adjustment mechanism of the substrate S, the humidity adjustment mechanism, and the ultraviolet irradiation mechanism are provided in each cassette device. As one of the processing devices, a temperature adjustment device, a humidity adjustment device, and an ultraviolet irradiation device are provided. It is also possible to perform temperature adjustment, dehumidification, humidification, and UV irradiation on the substrate S at an appropriate timing.

一般而言，生產大型之高精細平板顯示器等之情形，母材即基板S被送往各種處理裝置，接受各種處理。尤其是，以捲軸對捲軸(roll to roll)方式對PET或PEN等之可撓性薄膜基板進行連續處理之情形，考量在各處理步驟應力累積在薄膜基板，薄膜基板變形。再者，接受處理之薄膜基板、或已堆積在基板上之膜材料，亦必須在各處理步驟將溫度、含有水分量、濕潤性等預先設定成適當狀態。Generally speaking, in the production of large-scale, high-definition flat panel displays, etc., the substrate S, which is the base material, is sent to various processing apparatuses and subjected to various processes. In particular, when a flexible film substrate such as PET or PEN is continuously processed by a roll-to-roll method, it is considered that stress is accumulated on the film substrate in each processing step, and the film substrate is deformed. Furthermore, the film substrate to be processed or the film material that has been deposited on the substrate must also be set to an appropriate state in advance in each processing step, such as temperature, moisture content, and wettability.

因此，在裝填有基板S之匣裝置20(第一單元部21、第二單元部22)之移動中、或待機中，使設在第一單元部21或第二單元部22內之溫度調整機構、濕度調整機構、或紫外線照射機構作動。或者，使匣裝置20在工廠內獨立設置之溫度調整裝置、濕度調整裝置、紫外線照射裝置移動以使基板S通過。如此，能將基板S(或其表面之膜材料)之溫度、水分含有量、濕潤性、內部應力等之狀態事先調整成適於下一個處理步驟用之處理裝置之規格。Therefore, the temperature of the cassette device 20 (the first unit section 21 and the second unit section 22) in which the substrate S is loaded is adjusted during the movement or standby of the cassette device 20 (the first unit section 21 and the second unit section 22). The mechanism, the humidity adjustment mechanism, or the ultraviolet irradiation mechanism operates. Alternatively, the temperature adjustment device, humidity adjustment device, and ultraviolet irradiation device independently provided in the factory of the cassette device 20 are moved to pass the substrate S. In this way, the temperature of the substrate S (or the film material on its surface), the state of the water content, the wettability, and the internal stress can be adjusted in advance to the specifications of the processing device suitable for the next processing step.

本發明之實施形態中，保持捲軸狀之基板S之匣裝置20可對各種處理裝置移動，因此可進行匣裝置單位之批量處理。因此，在處理步驟之前，即使加入調整基板S(或其表面之膜材料)之各種狀態之步驟(相當於一個處理步驟)，亦不會使生產線整體之產率大幅降低，可進行產率良好之生產。In the embodiment of the present invention, since the cassette device 20 holding the reel-shaped substrate S can be moved to various processing devices, batch processing can be performed in units of the cassette device. Therefore, even if a step (equivalent to a processing step) for adjusting various states of the substrate S (or a film material on the surface thereof) is added before the processing step, the yield of the entire production line will not be greatly reduced, and a good yield can be achieved. Of production.

S‧‧‧基板S‧‧‧ substrate

CONT‧‧‧控制部 CONT‧‧‧Control Department

BF‧‧‧緩衝部 BF‧‧‧Buffering Department

C‧‧‧保護基板 C‧‧‧protective substrate

CV‧‧‧蓋構件 CV‧‧‧ cover member

10‧‧‧處理部 10‧‧‧ Processing Department

20‧‧‧匣裝置 20‧‧‧box device

21‧‧‧第一單元部 21‧‧‧First Unit

22‧‧‧第二單元部 22‧‧‧Second Unit

23‧‧‧連接部 23‧‧‧Connecting Department

24‧‧‧移動機構 24‧‧‧ Mobile agency

30‧‧‧導軌 30‧‧‧rail

31‧‧‧第一軌道 31‧‧‧ first track

32‧‧‧第二軌道 32‧‧‧ second track

33‧‧‧第三軌道 33‧‧‧ Third Track

34a, 35a‧‧‧環狀軌道 34a, 35a

42, 62‧‧‧移動部 42, 62‧‧‧Mobile

43, 63‧‧‧基板側通訊部 43, 63‧‧‧Substrate side communication department

44, 64‧‧‧移動部側通訊部 44, 64‧‧‧ Mobile communication side

46, 66‧‧‧裝卸檢測部 46, 66‧‧‧ Loading and unloading inspection department

47, 67‧‧‧接觸抑制部 47, 67‧‧‧Contact suppression unit

51, 71‧‧‧筐體 51, 71‧‧‧ Casing

52, 72‧‧‧腳輪 52, 72‧‧‧ Casters

53, 73‧‧‧升降部 53, 73‧‧‧ Lifting Department

54, 74‧‧‧腳輪驅動部 54, 74‧‧‧caster drive unit

55, 75‧‧‧位置檢測部 55, 75‧‧‧Position detection section

56, 76‧‧‧端子 56, 76‧‧‧ terminals

65‧‧‧連接檢測部 65‧‧‧connection detection department

100, 200‧‧‧基板處理裝置 100, 200‧‧‧ substrate processing equipment

111~113‧‧‧處理室 111 ~ 113‧‧‧Processing Room

160‧‧‧升起部 160‧‧‧Lift

圖1係顯示第一實施形態之基板處理裝置之整體構成之立體圖。FIG. 1 is a perspective view showing the overall configuration of a substrate processing apparatus according to a first embodiment.

圖2係顯示本實施形態之第一單元部側之構成之分解立體圖。 FIG. 2 is an exploded perspective view showing the structure of the first unit portion side of the embodiment.

圖3係顯示本實施形態之匣裝置之一部分構成之圖。 FIG. 3 is a diagram showing a part of the structure of the cassette device according to this embodiment.

圖4係顯示本實施形態之第二單元部側之構成之分解立體圖。 Fig. 4 is an exploded perspective view showing the configuration of the second unit portion side of the embodiment.

圖5係顯示本實施形態之匣裝置之構成之圖。 Fig. 5 is a diagram showing the configuration of a cassette device according to this embodiment.

圖6係顯示本實施形態之處理部之構成之圖。 FIG. 6 is a diagram showing a configuration of a processing unit according to this embodiment.

圖7係顯示本實施形態之基板處理裝置之動作之一形態之圖。 FIG. 7 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

圖8係顯示本實施形態之基板處理裝置之動作之一形態之圖。 FIG. 8 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

圖9係顯示本實施形態之基板處理裝置之動作之一形態之圖。 FIG. 9 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

圖10係顯示本實施形態之基板處理裝置之動作之一形態之圖。 FIG. 10 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

圖11係顯示本實施形態之基板處理裝置之動作之一形態之圖。 FIG. 11 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

圖12係顯示本實施形態之基板處理裝置之動作之一形態之圖。 FIG. 12 is a diagram showing one aspect of the operation of the substrate processing apparatus according to this embodiment.

圖13係顯示第二實施形態之基板處理裝置之整體構成之立體圖。 FIG. 13 is a perspective view showing the overall configuration of a substrate processing apparatus according to a second embodiment.

圖14係顯示本實施形態之基板處理裝置之一部分構成之剖面圖。 FIG. 14 is a cross-sectional view showing a part of the structure of a substrate processing apparatus according to this embodiment.

圖15係顯示本實施形態之升起部之構成之立體圖。 Fig. 15 is a perspective view showing the structure of a raised portion in this embodiment.

圖16係顯示基板處理裝置之另一構成之圖。 FIG. 16 is a diagram showing another configuration of the substrate processing apparatus.

圖17係顯示基板處理裝置之另一構成之圖。 FIG. 17 is a diagram showing another configuration of the substrate processing apparatus.

圖18(a)~(c)係顯示基板處理裝置之另一構成之圖。 18 (a) to (c) are diagrams showing another configuration of the substrate processing apparatus.

圖19(a)、(b)係顯示基板處理裝置之另一構成之圖。 19 (a) and 19 (b) are diagrams showing another configuration of the substrate processing apparatus.

圖20(a)、(b)係顯示基板處理裝置之另一構成之圖。 20 (a) and 20 (b) are diagrams showing another configuration of the substrate processing apparatus.

圖21係顯示基板之另一構成之圖。 FIG. 21 is a diagram showing another configuration of the substrate.

圖22係顯示基板處理裝置之另一構成與動作狀態之圖。 FIG. 22 is a diagram showing another configuration and operation state of the substrate processing apparatus.

圖23係顯示圖22之基板處理裝置之下一個動作狀態之圖。 FIG. 23 is a diagram showing a next operating state of the substrate processing apparatus of FIG. 22.

圖24係顯示圖23之基板處理裝置之下一個動作狀態之圖。 FIG. 24 is a diagram showing a next operating state of the substrate processing apparatus of FIG. 23.

圖25係顯示圖24之基板處理裝置之下一個動作狀態之圖。 FIG. 25 is a diagram showing a next operating state of the substrate processing apparatus of FIG. 24.

圖26係顯示圖25之基板處理裝置之下一個動作狀態之圖。 FIG. 26 is a diagram showing a next operating state of the substrate processing apparatus of FIG. 25.

圖27係顯示圖26之基板處理裝置之下一個動作狀態之圖。 FIG. 27 is a diagram showing a next operating state of the substrate processing apparatus of FIG. 26.

Claims (4)

一種元件製造方法，其將具有可撓性之帶狀之基板裝填至處理裝置，在上述基板上形成元件；包含： 將具有於長邊方向捲繞有待供應至上述處理裝置之上述基板之供應滾筒，且能夠於包含上述基板之長邊方向及短邊方向之既定之面內進行並進運動與旋轉運動之第1單元部，與具有於長邊方向捲繞以上述處理裝置處理後之上述基板之回收滾筒，且能夠於上述既定之面內進行並進運動與旋轉運動之第2單元部，以上述基板掛架於上述供應滾筒與上述回收滾筒之間之狀態配置之動作；及 將上述基板裝填至上述處理裝置時，以伴隨上述第1單元部及上述第2單元部之至少一方以改變上述供應滾筒與上述回收滾筒之於上述長邊方向之間隔之方式移動之第1並進運動、上述第1單元部及上述第2單元部於上述短邊方向一起移動之第2並進運動、與上述第1單元部及上述第2單元部於上述既定之面內一起旋轉之旋轉運動之中之至少2種運動之方式，使上述第1單元部與上述第2單元部移動之動作。A method for manufacturing a component, wherein a flexible strip-shaped substrate is loaded into a processing device, and a component is formed on the substrate; comprising: The first unit having a supply roller having a substrate wound around the substrate to be supplied to the processing device in a long side direction and capable of performing a parallel movement and a rotating movement in a predetermined plane including the long side direction and the short side direction of the substrate And a second unit unit having a recovery roller that winds the substrate processed by the processing device in the long side direction, and can perform a parallel movement and a rotation movement in the predetermined surface, and the substrate is suspended on the substrate The operation of the state configuration between the supply roller and the above-mentioned recovery roller; and When the substrate is loaded into the processing device, the first parallel movement is performed along with at least one of the first unit portion and the second unit portion to change the interval between the supply roller and the recovery roller in the longitudinal direction. Movement, second parallel movement of the first unit portion and the second unit portion moving together in the short-side direction, and rotational movement of the first unit portion and the second unit portion rotating together in the predetermined plane Among at least two types of movements, the first unit portion and the second unit portion are moved. 如請求項1所述之元件製造方法，其中， 上述處理裝置具有對上述基板進行用以形成元件之第1處理之第1處理部及對經上述第1處理後之上述基板進行用以形成元件之第2處理之第2處理部； 使為了上述第1處理而於上述長邊方向以隔著上述第1處理部之方式配置之上述第1單元部及上述第2單元部，藉由上述第2並進運動成為自上述第1處理部退開後之狀態後，以藉由上述第1並進運動使上述第1單元部及上述第2單元部於上述長邊方向以既定間隔接近後之狀態、或使上述第1單元部及上述第2單元部於上述長邊方向連結後之狀態，一起朝向上述第2處理部移動。The component manufacturing method according to claim 1, wherein: The processing apparatus includes a first processing unit that performs a first process on the substrate to form an element and a second processing unit that performs a second process on the substrate to form a element after the first process; The first unit portion and the second unit portion arranged in the long-side direction with the first processing portion interposed therebetween for the first processing, are moved from the first processing portion by the second parallel movement. After the retracted state, the first unit portion and the second unit portion are brought closer to each other at a predetermined interval in the longitudinal direction by the first parallel movement, or the first unit portion and the first The two unit sections are moved toward the second processing section together after being connected in the longitudinal direction. 如請求項2所述之元件製造方法，其中， 上述第1處理部及上述第2處理部分別是：對應上述第1處理與上述第2處理之內容，於上述基板形成膜之膜形成裝置、加熱上述基板之加熱裝置、洗淨上述基板之洗淨裝置、曝光上述基板之曝光裝置、及檢查上述基板之檢查裝置之任一者。The component manufacturing method according to claim 2, wherein: The first processing unit and the second processing unit are: a film forming device for forming a film on the substrate, a heating device for heating the substrate, and a washing for cleaning the substrate in accordance with the contents of the first processing and the second processing. Any of a cleaning device, an exposure device that exposes the substrate, and an inspection device that inspects the substrate. 如請求項2或3所述之元件製造方法，其中， 上述第1單元部具有安裝上述供應滾筒之第1收容部、及可裝卸地保持該第1收容部且使該第1單元部進行並進運動及旋轉運動之第1移動部； 上述第2單元部具有安裝上述回收滾筒之第2收容部、及可裝卸地保持該第2收容部且使該第2單元部進行並進運動及旋轉運動之第2移動部； 當上述第1處理部及上述第2處理部於重力方向分離時，以使上述第1收容部與上述第2收容部連結後之狀態，使其等分別自上述第1移動部及上述第2移動部卸除，一起升降於重力方向。The component manufacturing method according to claim 2 or 3, wherein The first unit portion includes a first receiving portion to which the supply roller is mounted, and a first moving portion detachably holding the first receiving portion and causing the first unit portion to perform a parallel movement and a rotational movement; The second unit portion includes a second receiving portion to which the recovery drum is mounted, and a second moving portion detachably holding the second receiving portion and causing the second unit portion to perform a parallel movement and a rotational movement; When the first processing unit and the second processing unit are separated in the direction of gravity, the first receiving unit and the second receiving unit are connected to each other from the first moving unit and the second receiving unit. The moving part is removed and lifted in the direction of gravity together.
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JP6384580B2 (en) 2018-09-05
KR20190126455A (en) 2019-11-11
TW201810492A (en) 2018-03-16
TWI661498B (en) 2019-06-01
JP6304331B2 (en) 2018-04-04
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KR101949113B1 (en) 2019-02-15
KR101816343B1 (en) 2018-02-21
KR20180136574A (en) 2018-12-24
KR20150002647A (en) 2015-01-07
KR102042952B1 (en) 2019-11-08
KR20180003639A (en) 2018-01-09
KR102126421B1 (en) 2020-06-24
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CN106185413B (en) 2017-11-07

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