TW201928633A - Curved touch sensing apparatus and molding method thereof - Google Patents

Curved touch sensing apparatus and molding method thereof Download PDF

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Publication number
TW201928633A
TW201928633A TW107144020A TW107144020A TW201928633A TW 201928633 A TW201928633 A TW 201928633A TW 107144020 A TW107144020 A TW 107144020A TW 107144020 A TW107144020 A TW 107144020A TW 201928633 A TW201928633 A TW 201928633A
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Taiwan
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curved
injection
touch
molding method
curved substrate
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TW107144020A
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Chinese (zh)
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曾露
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大陸商深圳市柔宇科技有限公司
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Position Input By Displaying (AREA)
  • Manufacture Of Switches (AREA)

Abstract

Provided is a curved-surface touch-control sensing device, comprising: a curved-surface substrate and a touch-control electrode assembly, wherein the curved-surface substrate has an inner surface and an outer surface, the outer surface is a touch-control operation surface, the touch-control electrode assembly is arranged on the inner surface by means of injection moulding, and the touch-control electrode assembly senses a touch-control operation on the touch-control operation surface to generate a sensing signal. The touch-control electrode assembly is directly moulded on the curved-surface substrate by means of injection moulding, the moulding method is simple, and the moulding effect is good.

Description

曲面觸控感應裝置及其成型方法Curved touch sensing device and forming method thereof

本申請涉及曲面觸控加工領域，尤其涉及一種曲面觸控感應裝置及其成型方法。The present application relates to the field of curved touch processing, and in particular, to a curved touch sensing device and a forming method thereof.

隨著科學技術的發展，觸控輸入已是用戶與終端設備進行各種資訊交互的必需工具之一。觸控輸入分為平面觸控和曲面觸控。現有曲面觸控的加工方式主要分為兩種，第一種加工方式是：平面加工好觸控圖案後再貼合到曲面，其缺點在於，只能使觸控圖案近似於曲面，無法確保觸控圖案的曲率等與曲面完全一致。第二種加工方式是：直接在曲面上加工觸控圖案。然而，受制於現有加工設備的限制，目前暫無法實現曲面上直接加工觸控圖案。With the development of science and technology, touch input has become one of the necessary tools for users to perform various information interactions with terminal devices. Touch input is divided into flat touch and curved touch. The existing processing methods for curved touch are mainly divided into two types. The first processing method is: after the touch pattern is processed on the plane and then bonded to the curved surface, the disadvantage is that the touch pattern can only be approximated to a curved surface, and the touch cannot be guaranteed. The curvature of the control pattern is exactly the same as the curved surface. The second processing method is to process the touch pattern directly on the curved surface. However, due to the limitations of existing processing equipment, it is currently not possible to directly process touch patterns on curved surfaces.

本申請實施例公開一種曲面觸控感應裝置及其成型方法，能夠實現直接在曲面基體上成型觸控電極組件，以解決上述問題。The embodiment of the present application discloses a curved touch sensing device and a forming method thereof, which can realize directly forming a touch electrode assembly on a curved substrate to solve the above problems.

本申請實施例公開的一種曲面觸控感應裝置，包括：曲面基體和觸控電極組件，所述曲面基體具有內表面和外表面，所述外表面為觸控操作面，所述觸控電極組件通過注射成型的方式設置在所述內表面上，所述觸控電極組件感應在所述外表面上的觸控操作而產生感應信號。A curved touch sensing device disclosed in an embodiment of the present application includes a curved substrate and a touch electrode assembly, the curved substrate has an inner surface and an outer surface, the outer surface is a touch operation surface, and the touch electrode assembly It is disposed on the inner surface by injection molding, and the touch electrode assembly senses a touch operation on the outer surface to generate a sensing signal.

本申請實施例公開的一種成型方法，所述成型方法應用於曲面觸控感應裝置上，所述成型方法包括步驟：提供一曲面基體，所述曲面基體具有內表面和外表面，所述外表面為觸控操作面，所述內表面上設置有至少一個注入槽；提供一模芯，所述模芯與所述曲面基體的內表面相配合並蓋住所述至少一個注入槽以形成用於注入所述導電材料的型腔；及將導電材料注入所述型腔內以形成觸控電極組件，所述觸控電極組件感應在所述外表面上的觸控操作而產生感應信號。A molding method disclosed in the embodiment of the present application, wherein the molding method is applied to a curved touch sensing device, the molding method includes the steps of: providing a curved substrate having an inner surface and an outer surface, and the outer surface For the touch operation surface, at least one injection groove is provided on the inner surface; a mold core is provided, the mold core cooperates with the inner surface of the curved substrate and covers the at least one injection groove to form a surface for Injecting a cavity of the conductive material; and injecting a conductive material into the cavity to form a touch electrode assembly, the touch electrode assembly senses a touch operation on the outer surface to generate an induction signal.

本申請能夠通過注射成型的方式直接在曲面基體的內表面上成型觸控電極組件，成型方式簡單，成型效果好。In the present application, the touch electrode assembly can be directly formed on the inner surface of the curved substrate by injection molding, and the molding method is simple and the molding effect is good.

下面將結合本申請實施例中的圖示，對本申請實施例中的技術方案進行清楚、完整地描述，顯然，所描述的實施例僅是本申請一部分實施例，而不是全部的實施例。基於本申請中的實施例，所述技術領域具有通常知識者在沒有做出創造性勞動前提下所獲得的所有其他實施例，都屬於本申請保護的範圍。In the following, the technical solutions in the embodiments of the present application will be clearly and completely described in combination with the illustrations in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those with ordinary knowledge in the technical field without making creative work fall into the protection scope of the present application.

請參閱圖1，圖1為本申請一實施例中的曲面觸控感應裝置100的結構示意圖。所述曲面觸控感應裝置100呈圓球狀。所述曲面觸控感應裝置100包括兩個曲面基體10和兩個觸控電極組件30。Please refer to FIG. 1, which is a schematic structural diagram of a curved touch sensing device 100 according to an embodiment of the present application. The curved touch sensing device 100 is spherical. The curved touch sensing device 100 includes two curved substrates 10 and two touch electrode assemblies 30.

可理解，本實施例中，每個所述曲面基體10呈半球形殼體狀，其厚度大致均勻。所述兩個曲面基體10相向扣合後呈圓球狀。在其他實施例中，每個所述曲面基體10呈半橢球形殼體狀，其厚度也大致均勻。所述兩個曲面基體10相向扣合後呈橢球狀。在又一實施例中，所述曲面基體10可呈其他曲率大於零的適合形狀的曲面基體，此處不做限制。It can be understood that, in this embodiment, each of the curved substrates 10 is in the shape of a hemispherical shell, and its thickness is substantially uniform. The two curved substrates 10 are in a spherical shape after being fastened opposite each other. In other embodiments, each of the curved substrates 10 has a semi-ellipsoidal shell shape, and its thickness is also substantially uniform. The two curved substrates 10 are ellipsoidal when they are fastened to each other. In another embodiment, the curved surface base 10 may be another curved surface base of a suitable shape with a curvature greater than zero, which is not limited herein.

可理解，在其他實施例中，所述曲面觸控感應裝置100只包括一個所述曲面基體10和一個所述觸控電極組件30。也就是說，所述曲面觸控感應裝置100整體呈半球或者半橢球狀。具體可根據實際需要設置，此處不做限制。It can be understood that, in other embodiments, the curved touch sensing device 100 includes only one curved substrate 10 and one touch electrode assembly 30. In other words, the curved touch sensing device 100 has a hemispherical or semi-ellipsoidal shape as a whole. It can be set according to actual needs, and is not limited here.

請一併參考圖2，每個所述曲面基體10具有相對設置的外表面11和內表面13。其中，所述外表面11為觸控操作面。每個觸控電極組件30通過注射成型的方式設置在其中一個所述曲面基體10的內表面13上。所述觸控電極組件30感應在所述外表面11上的觸控操作而產生相應的感應信號。Please refer to FIG. 2 together. Each of the curved substrates 10 has an outer surface 11 and an inner surface 13 opposite to each other. The outer surface 11 is a touch operation surface. Each touch electrode assembly 30 is disposed on the inner surface 13 of one of the curved substrates 10 by injection molding. The touch electrode assembly 30 senses a touch operation on the outer surface 11 to generate a corresponding sensing signal.

可選擇地，所述曲面觸控感應裝置100還包括控制器（圖未示）。所述觸控電極組件30與所述控制器電性連接，所述控制器回應所述感應信號並根據所述感應信號識別所述外表面11的當前觸摸位置。具體地，當所述曲面觸控感應裝置100包括兩個曲面基體10和兩個所述觸控電極組件30時，所述控制器的數量也為兩個。每個控制器控制一組觸控電極組件30。同理，當所述曲面觸控感應裝置100包括一個曲面基體10和一個所述觸控電極組件30時，所述控制器的數量為一個。Optionally, the curved touch sensing device 100 further includes a controller (not shown). The touch electrode assembly 30 is electrically connected to the controller, and the controller responds to the sensing signal and recognizes the current touch position of the outer surface 11 according to the sensing signal. Specifically, when the curved touch sensing device 100 includes two curved bases 10 and two touch electrode assemblies 30, the number of the controllers is two. Each controller controls a group of touch electrode assemblies 30. Similarly, when the curved touch sensing device 100 includes a curved base 10 and a touch electrode assembly 30, the number of the controllers is one.

具體地，所述曲面基體10由聚對苯二甲酸類材料、聚甲基丙烯酸甲酯材料、玻璃，或其他適合的耐高溫的絕緣材料中的一種或者多種材料製成，此處不做限制。Specifically, the curved substrate 10 is made of one or more materials of a polyterephthalic acid-based material, a polymethyl methacrylate material, glass, or other suitable high-temperature-resistant insulation materials, which is not limited herein. .

具體地，所述觸控電極組件30需預先在所述內表面13上加工注入槽131，再在所述注入槽131中注入導電材料133並固化後形成。Specifically, the touch electrode assembly 30 is formed by processing an injection groove 131 on the inner surface 13 in advance, and then injecting a conductive material 133 into the injection groove 131 and curing it.

具體地，製作所述注入槽131的方法有：機械加工、注射成型、3D列印，或者其他適合的加工方式。Specifically, the method for manufacturing the injection groove 131 includes: machining, injection molding, 3D printing, or other suitable processing methods.

具體地，機械加工的方式為：在所述曲面基體10的內表面13上切削形成所述至少一個注入槽131。其中，機械加工的精度在±0.05mm以內。Specifically, the machining is performed by cutting the inner surface 13 of the curved substrate 10 to form the at least one injection groove 131. Among them, the accuracy of machining is within ± 0.05mm.

具體地，注射成型的方式為：通過注射成型成型所述曲面基體10，所述曲面基體10具有內表面13和外表面11，所述外表面11為觸控操作面，所述述曲面基體10的內表面13上設置有至少一個注入槽131。Specifically, the injection molding method includes: molding the curved substrate 10 by injection molding, the curved substrate 10 having an inner surface 13 and an outer surface 11, the outer surface 11 being a touch operation surface, and the curved substrate 10 The inner surface 13 is provided with at least one injection groove 131.

具體地，3D列印的方式為：通過3D列印成型所述曲面基體10，所述曲面基體10具有內表面13和外表面11，所述外表面11為觸控操作面，所述曲面基體10的內表面13上設置有至少一個注入槽131。Specifically, the 3D printing method is: forming the curved surface substrate 10 by 3D printing, the curved surface substrate 10 has an inner surface 13 and an outer surface 11, the outer surface 11 is a touch operation surface, and the curved substrate The inner surface 13 of 10 is provided with at least one injection groove 131.

具體地，所述曲面基體10包括相對設置的第一端15和第二端17。所述曲面基體10在所述第一端15上設置有注入口151。所述注入口151與所述至少一個注入槽131相通設置，所述導電材料133自所述注入口151注入所述至少一個注入槽131中並被固化。所述導電材料133為銀漿或者碳漿中的至少一種。Specifically, the curved base 10 includes a first end 15 and a second end 17 which are oppositely disposed. The curved substrate 10 is provided with an injection port 151 on the first end 15. The injection port 151 is communicated with the at least one injection groove 131, and the conductive material 133 is injected into the at least one injection groove 131 from the injection port 151 and is cured. The conductive material 133 is at least one of a silver paste or a carbon paste.

可選擇地，所述曲面基體10在所述第二端17上設置有溢出口171。所述溢出口171與所述至少一個注入槽131相通設置，注入所述注入槽131中的所述導電材料133在充滿所述注入槽131後，多餘的部分經所述溢出口171溢出，以使得所述導電材料133能夠完全充滿所述注入槽131，並且，多餘的部分經所述溢出口171溢出後可回收再利用，避免材料浪費。Optionally, the curved substrate 10 is provided with an overflow opening 171 on the second end 17. The overflow port 171 is provided in communication with the at least one injection groove 131. After the conductive material 133 injected into the injection groove 131 fills the injection groove 131, an excess portion overflows through the overflow port 171 to This enables the conductive material 133 to completely fill the injection groove 131, and the excess portion can be recycled and reused after overflowing through the overflow port 171 to avoid material waste.

可選擇地，在向所述注入槽131注入導電材料133時，在所述溢出口171增加負壓，促使所述導電材料133快速充滿所述至少一個注入槽131。Optionally, when the conductive material 133 is injected into the injection groove 131, a negative pressure is added to the overflow port 171, so that the conductive material 133 quickly fills the at least one injection groove 131.

具體地，本實施例中，每個所述注入槽131自所述曲面基體10的所述第一端15延伸至所述第二端17，而且多個所述注入槽131沿所述曲面基體10的經度方向間隔排列設置。Specifically, in this embodiment, each of the injection grooves 131 extends from the first end 15 to the second end 17 of the curved substrate 10, and a plurality of the injection grooves 131 along the curved substrate 10 longitude directions are arranged at intervals.

可選擇地，在其他實施例中，每個所述注入槽131自所述曲面基體10的所述第一端15向所述第二端17呈毛細血管狀延伸。Alternatively, in other embodiments, each of the injection grooves 131 extends in a capillary shape from the first end 15 to the second end 17 of the curved base body 10.

可理解，在其他實施例中，所述注入槽131的分佈和形狀由所述觸控電極組件30的電極及引線圖案決定，其只要一端與所述注入口151相通，另一端與所述溢出口171相通設置，並保證所述注入槽131的任意部位都能充滿導電材料133即可。It can be understood that, in other embodiments, the distribution and shape of the injection grooves 131 are determined by the electrodes and lead patterns of the touch electrode assembly 30, as long as one end communicates with the injection port 151 and the other end communicates with the overflow The outlets 171 are arranged in communication, and any portion of the injection groove 131 can be filled with the conductive material 133.

請參閱圖3、圖4、圖5和圖6，圖6為本申請一實施例中的曲面觸控感應裝置100的成型方法的流程示意圖。所述成型方法應用於前述的曲面觸控感應裝置100中，執行順序並不限於圖6所示的順序。所述方法包括步驟：Please refer to FIG. 3, FIG. 4, FIG. 5, and FIG. 6. FIG. 6 is a schematic flowchart of a method for forming the curved touch sensing device 100 according to an embodiment of the present application. The molding method is applied to the aforementioned curved touch sensing device 100, and the execution order is not limited to the order shown in FIG. The method includes steps:

步驟601：提供一曲面基體10，所述曲面基體10具有內表面13和外表面11，所述外表面11為觸控操作面，所述內表面13上設置有至少一個注入槽131。Step 601: A curved substrate 10 is provided. The curved substrate 10 has an inner surface 13 and an outer surface 11. The outer surface 11 is a touch operation surface. The inner surface 13 is provided with at least one injection groove 131.

具體地，每個所述曲面基體10具有相對設置的外表面11和內表面13。其中，所述外表面11為觸控操作面。每個觸控電極組件30通過注射成型的方式設置在其中一個所述曲面基體10的內表面13上。Specifically, each of the curved substrates 10 has an outer surface 11 and an inner surface 13 which are oppositely disposed. The outer surface 11 is a touch operation surface. Each touch electrode assembly 30 is disposed on the inner surface 13 of one of the curved substrates 10 by injection molding.

具體地，所述曲面基體10由聚對苯二甲酸類材料、聚甲基丙烯酸甲酯材料、玻璃，或其他適合的耐高溫的絕緣材料中的一種或者多種材料製成。Specifically, the curved substrate 10 is made of one or more materials selected from the group consisting of a polyterephthalic material, a polymethyl methacrylate material, glass, or other suitable high-temperature-resistant insulating materials.

具體地，所述觸控電極組件30需預先在所述內表面13上加工注入槽131，再在所述注入槽131中注入導電材料133並固化後形成。Specifically, the touch electrode assembly 30 is formed by processing an injection groove 131 on the inner surface 13 in advance, and then injecting a conductive material 133 into the injection groove 131 and curing it.

具體地，製作所述注入槽131的方法有：機械加工、注射成型、3D列印，或者其他適合的加工方式。Specifically, the method for manufacturing the injection groove 131 includes: machining, injection molding, 3D printing, or other suitable processing methods.

具體地，本實施例中，每個所述注入槽131自所述曲面基體10的所述第一端15延伸至所述第二端17，而且多個所述注入槽131沿所述曲面基體10的經度方向間隔排列設置。Specifically, in this embodiment, each of the injection grooves 131 extends from the first end 15 to the second end 17 of the curved substrate 10, and a plurality of the injection grooves 131 along the curved substrate 10 longitude directions are arranged at intervals.

具體地，所述曲面基體10包括相對設置的第一端15和第二端17。所述曲面基體10在所述第一端15上設置有注入口151。所述注入口151與所述至少一個注入槽131相通設置，所述導電材料133自所述注入口151注入所述至少一個注入槽131中並被固化。所述導電材料133為銀漿或者碳漿中的至少一種。Specifically, the curved base 10 includes a first end 15 and a second end 17 which are oppositely disposed. The curved substrate 10 is provided with an injection port 151 on the first end 15. The injection port 151 is communicated with the at least one injection groove 131, and the conductive material 133 is injected into the at least one injection groove 131 from the injection port 151 and is cured. The conductive material 133 is at least one of a silver paste or a carbon paste.

可選擇地，所述曲面基體10在所述第二端17上設置有溢出口171。所述溢出口171與所述至少一個注入槽131相通設置，注入所述注入槽131中的所述導電材料133在充滿所述注入槽131後，多餘的部分經所述溢出口171溢出，以使得所述導電材料133能夠完全充滿所述注入槽131，並且，多餘的部分經所述溢出口171溢出後可回收再利用，避免材料浪費。Optionally, the curved substrate 10 is provided with an overflow opening 171 on the second end 17. The overflow port 171 is provided in communication with the at least one injection groove 131. After the conductive material 133 injected into the injection groove 131 fills the injection groove 131, an excess portion overflows through the overflow port 171 to This enables the conductive material 133 to completely fill the injection groove 131, and the excess portion can be recycled and reused after overflowing through the overflow port 171 to avoid material waste.

步驟602：提供一模芯200，所述模芯200與所述曲面基體10的內表面13相配合並蓋住所述至少一個注入槽131以形成用於注入所述導電材料133的型腔135。Step 602: Provide a mold core 200 that cooperates with the inner surface 13 of the curved substrate 10 and covers the at least one injection groove 131 to form a cavity 135 for injecting the conductive material 133. .

具體地，所述模芯200可以採用具有密封性的矽膠或者橡膠材質製成，具有一定的密封性，可以確保在加壓注入導電材料133時緊密壓合所述注入槽131的位置，避免產生飛邊等缺陷。Specifically, the mold core 200 may be made of a silicon or rubber material having a sealing property, and has a certain sealing property, which can ensure that the position of the injection groove 131 is tightly pressed when the conductive material 133 is injected under pressure, thereby avoiding Defects such as flashing.

步驟603：將導電材料133注入所述型腔135內以形成觸控電極組件30。Step 603: Inject a conductive material 133 into the cavity 135 to form a touch electrode assembly 30.

具體地，所述導電材料133為銀漿或者碳漿，其在常溫下即具有一定的流動性，通過加熱即可固化。其中，固化參數主要跟材料本身相關。Specifically, the conductive material 133 is a silver paste or a carbon paste, which has a certain fluidity at normal temperature and can be cured by heating. Among them, the curing parameters are mainly related to the material itself.

具體地，注入所述導電材料133時，在所述溢出口171增加負壓，促使所述導電材料133從所述注入口151流經所述注入槽131並且多餘部分從所述溢出口171溢出回收。Specifically, when the conductive material 133 is injected, a negative pressure is added to the overflow port 171, so that the conductive material 133 flows from the injection port 151 through the injection groove 131 and an excess portion overflows from the overflow port 171. Recycle.

具體地，固化所述注入槽131內的導電材料133後，移除模芯200，使觸控電極組件30成型。Specifically, after the conductive material 133 in the injection groove 131 is cured, the mold core 200 is removed to form the touch electrode assembly 30.

步驟604：所述觸控電極組件30感應在所述外表面11上的觸控操作而產生感應信號。Step 604: The touch electrode assembly 30 senses a touch operation on the outer surface 11 to generate a sensing signal.

步驟605：回應所述感應信號並根據所述感應信號識別所述外表面11的當前觸摸位置。Step 605: Respond to the sensing signal and identify the current touch position of the outer surface 11 according to the sensing signal.

具體地，所述控制器回應所述感應信號並根據所述感應信號識別所述外表面11的當前觸摸位置。Specifically, the controller responds to the sensing signal and recognizes the current touch position of the outer surface 11 according to the sensing signal.

本申請能夠通過注射成型的方式直接在曲面基體10上成型觸控電極組件30，成型方式簡單，成型效果好。In the present application, the touch electrode assembly 30 can be directly formed on the curved substrate 10 by injection molding. The molding method is simple and the molding effect is good.

以上所述是本申請的優選實施例，應當指出，對於本技術領域的普通技術人員來說，在不脫離本申請原理的前提下，還可以做出若干改進和潤飾，這些改進和潤飾也視為本申請的保護範圍。The above is a preferred embodiment of the present application. It should be noted that for those of ordinary skill in the art, without departing from the principles of the present application, several improvements and retouches can be made. The scope of protection of this application.

100‧‧‧曲面觸控感應裝置100‧‧‧ curved touch sensing device

10‧‧‧曲面基體10‧‧‧ curved substrate

11‧‧‧外表面11‧‧‧ outer surface

13‧‧‧內表面13‧‧‧Inner surface

131‧‧‧注入槽131‧‧‧ injection tank

133‧‧‧導電材料133‧‧‧ conductive material

135‧‧‧型腔135‧‧‧ Cavity

15‧‧‧第一端15‧‧‧ the first end

151‧‧‧注入口151‧‧‧Injection port

17‧‧‧第二端17‧‧‧ the second end

171‧‧‧溢出口171‧‧‧overflow

30‧‧‧觸控電極組件30‧‧‧Touch electrode assembly

為了更清楚地說明本申請實施例中的技術方案，下面將對實施例中所需要使用的圖示作簡單地介紹，顯而易見地，下面描述中的圖示僅僅是本申請的一些實施例，對於所述技術領域具有通常知識者來講，在不付出創造性勞動的前提下，還可以根據這些圖示獲得其他的圖示。In order to explain the technical solutions in the embodiments of the present application more clearly, the diagrams used in the embodiments are briefly introduced below. Obviously, the diagrams in the following description are only some embodiments of the present application. For those skilled in the technical field, other illustrations can be obtained based on these illustrations without paying creative labor.

圖1為本申請一實施例中的曲面觸控感應裝置的結構示意圖。FIG. 1 is a schematic structural diagram of a curved touch sensing device according to an embodiment of the present application.

圖2為本申請一實施例中的曲面觸控感應裝置的兩曲面基體拼接後在II-II方向上的剖面示意圖。FIG. 2 is a schematic cross-sectional view in the direction of II-II of two curved substrates of a curved touch sensing device according to an embodiment of the present application after splicing.

圖3為本申請一實施例中的曲面觸控感應裝置的一曲面基體的截面示意圖。3 is a schematic cross-sectional view of a curved substrate of a curved touch sensing device according to an embodiment of the present application.

圖4為本申請一實施例中的圖3中所述曲面基體與模芯配合後的截面示意圖。FIG. 4 is a schematic cross-sectional view of the curved substrate and the mold core described in FIG. 3 according to an embodiment of the present application.

圖5為本申請一實施例中的圖4所述的曲面基體注入導電材料且移除模芯之後的截面示意圖。5 is a schematic cross-sectional view of the curved substrate described in FIG. 4 after the conductive material is injected and the mold core is removed according to an embodiment of the present application.

圖6為本申請一實施例中的曲面觸控感應裝置的成型方法的流程示意圖。FIG. 6 is a schematic flowchart of a method for forming a curved touch sensing device according to an embodiment of the present application.

Claims (17)

一種曲面觸控感應裝置，其改良在於，所述曲面觸控感應裝置包括：曲面基體和觸控電極組件，所述曲面基體具有內表面和外表面，所述外表面為觸控操作面，所述觸控電極組件通過注射成型的方式設置在所述內表面上，所述觸控電極組件感應在所述外表面上的觸控操作而產生感應信號。A curved touch sensing device is improved. The curved touch sensing device includes a curved substrate and a touch electrode assembly. The curved substrate has an inner surface and an outer surface, and the outer surface is a touch operation surface. The touch electrode assembly is disposed on the inner surface by injection molding, and the touch electrode assembly senses a touch operation on the outer surface to generate a sensing signal. 如申請專利範圍第1項所述的曲面觸控感應裝置，其中，所述曲面觸控感應裝置還包括控制器，所述觸控電極組件與所述控制器電性連接，所述控制器回應所述感應信號並根據所述感應信號識別所述外表面上的當前觸摸位置。The curved touch sensing device according to item 1 of the patent application scope, wherein the curved touch sensing device further includes a controller, the touch electrode assembly is electrically connected to the controller, and the controller responds The sensing signal and identifying a current touch position on the outer surface according to the sensing signal. 如申請專利範圍第1項所述的曲面觸控感應裝置，其中，所述曲面基體呈半球形殼體狀或半橢球形殼體狀；所述曲面基體由聚對苯二甲酸類材料、聚甲基丙烯酸甲酯材料、玻璃，或其他耐高溫的絕緣材料中的一種或者多種材料製成。The curved touch sensing device according to item 1 of the scope of patent application, wherein the curved substrate is in the shape of a semi-spherical shell or a semi-ellipsoidal shell; the curved substrate is made of polyterephthalic acid-based material, poly Made of one or more of methyl methacrylate material, glass, or other high temperature resistant insulating materials. 如申請專利範圍第1項所述的曲面觸控感應裝置，其中，所述曲面基體的內表面上設置有至少一個注入槽，所述觸控電極組件由注入所述至少一個注入槽中的導電材料固化形成。The curved touch sensing device according to item 1 of the scope of patent application, wherein at least one injection groove is provided on an inner surface of the curved substrate, and the touch electrode assembly is conductively injected into the at least one injection groove. The material solidifies. 如申請專利範圍第4項所述的曲面觸控感應裝置，其中，所述曲面基體包括相對設置的第一端和第二端，所述曲面基體在所述第一端上設置有注入口，所述注入口與所述至少一個注入槽相通設置，所述導電材料自所述注入口注入所述至少一個注入槽。The curved touch sensing device according to item 4 of the scope of patent application, wherein the curved substrate includes a first end and a second end opposite to each other, and the curved substrate is provided with an injection port on the first end, The injection port is provided in communication with the at least one injection slot, and the conductive material is injected into the at least one injection slot from the injection port. 如申請專利範圍第5項所述的曲面觸控感應裝置，其中，所述曲面基體在所述第二端上設置有溢出口，所述溢出口與所述至少一個注入槽相通設置，注入所述注入槽中的所述導電材料的部分經所述溢出口溢出。The curved touch sensing device according to item 5 of the scope of patent application, wherein the curved substrate is provided with an overflow port on the second end, and the overflow port is provided in communication with the at least one injection groove to inject into the A portion of the conductive material in the injection groove overflows through the overflow port. 如申請專利範圍第4至6任一項所述的曲面觸控感應裝置，其中，所述導電材料為銀漿或者碳漿中的至少一種。The curved touch sensing device according to any one of claims 4 to 6, wherein the conductive material is at least one of a silver paste or a carbon paste. 如申請專利範圍第5項所述的曲面觸控感應裝置，其中，每個所述注入槽自所述曲面基體的所述第一端延伸至所述第二端；或者，每個所述注入槽自所述曲面基體的所述第一端向所述第二端呈毛細血管狀延伸。The curved touch sensing device according to item 5 of the scope of patent application, wherein each of the injection grooves extends from the first end to the second end of the curved substrate; or, each of the injections The groove extends in a capillary shape from the first end to the second end of the curved substrate. 一種成型方法，所述成型方法應用於曲面觸控感應裝置上，所述成型方法包括步驟： 提供一曲面基體，所述曲面基體具有內表面和外表面，所述外表面為觸控操作面，所述內表面上設置有至少一個注入槽； 提供一模芯，所述模芯與所述曲面基體的內表面相配合並蓋住所述至少一個注入槽以形成用於注入導電材料的型腔； 將所述導電材料注入所述型腔內以形成觸控電極組件；以及 所述觸控電極組件感應在所述觸控操作面上的觸控操作而產生感應信號。A molding method applied to a curved touch sensing device, the molding method includes the steps of: providing a curved substrate having an inner surface and an outer surface, and the outer surface is a touch operation surface, The inner surface is provided with at least one injection groove; a mold core is provided, the mold core cooperates with the inner surface of the curved substrate and covers the at least one injection groove to form a cavity for injecting a conductive material ; Injecting the conductive material into the cavity to form a touch electrode assembly; and the touch electrode assembly senses a touch operation on the touch operation surface to generate a sensing signal. 如申請專利範圍第9項所述的成型方法，其中，所述成型方法還包括步驟： 提供一種控制器，所述觸控電極組件與所述控制器電性連接； 所述控制器回應所述感應信號並根據所述感應信號識別所述觸控操作面上的當前觸摸位置。The molding method according to item 9 of the scope of patent application, wherein the molding method further comprises the steps of: providing a controller, the touch electrode assembly is electrically connected to the controller; and the controller responds to the Sensing a signal and identifying a current touch position on the touch operation surface according to the sensing signal. 如申請專利範圍第9項所述的成型方法，其中，步驟“將導電材料注入所述型腔內以形成觸控電極組件”之後，所述成型方法還包括步驟： 固化所述導電材料，並移除所述模芯。The molding method according to item 9 of the scope of patent application, wherein after the step "injecting a conductive material into the cavity to form a touch electrode assembly", the molding method further includes the steps of: curing the conductive material, and Remove the mold core. 如申請專利範圍第9項所述的成型方法，其中，步驟“提供一模芯”之前，所述成型方法還包括步驟：將所述模芯做表面處理以降低其模芯表面能，使得所述導電材料與所述模芯的附著力降低；其中，所述表面處理為在所述模芯的表面噴塗高水滴角材料。The molding method according to item 9 of the scope of patent application, wherein before the step "providing a mold core", the molding method further includes the step of surface-treating the mold core to reduce the surface energy of the mold core, so that The adhesion between the conductive material and the mold core is reduced; wherein the surface treatment is spraying a material with a high water drop angle on the surface of the mold core. 如申請專利範圍第9項所述的成型方法，其中，所述曲面基體具有相對設置的第一端和第二端，所述曲面基體在所述第一端上設置有注入口，所述注入口與所述至少一個注入槽相通設置，所述成型方法還包括步驟：自所述注入口注入所述導電材料至所述至少一個注入槽。The molding method according to item 9 of the patent application scope, wherein the curved substrate has a first end and a second end opposite to each other, the curved substrate is provided with an injection port on the first end, and the injection An inlet is provided in communication with the at least one injection groove, and the molding method further includes the step of injecting the conductive material from the injection hole into the at least one injection groove. 如申請專利範圍第13項所述的成型方法，其中，所述曲面基體在所述第二端上設置有溢出口，所述至少一個注入槽分別與所述溢出口相通設置，所述成型方法還包括步驟：注入所述注入槽中的所述導電材料的部分經所述溢出口溢出。The molding method according to item 13 of the patent application scope, wherein the curved substrate is provided with an overflow port on the second end, and the at least one injection groove is provided in communication with the overflow port, respectively, and the molding method The method further includes the step of: overflowing a portion of the conductive material injected into the injection groove through the overflow port. 如申請專利範圍第14項所述的成型方法，其中，所述成型方法還包括步驟：在向所述注入槽注入導電材料時，在所述溢出口增加負壓，促使所述導電材料快速充滿所述至少一個注入槽。The molding method according to item 14 of the scope of patent application, wherein the molding method further comprises the step of: when injecting a conductive material into the injection groove, increasing a negative pressure at the overflow port to prompt the conductive material to fill up quickly The at least one injection slot. 如申請專利範圍第9項所述的成型方法，其中，所述內表面上設置有至少一個注入槽”具體為：通過機械加工的方式在所述曲面基體的內表面上切削形成所述至少一個注入槽。The molding method according to item 9 of the scope of patent application, wherein the at least one injection groove is provided on the inner surface is specifically: cutting the inner surface of the curved substrate to form the at least one by machining. Fill the tank. 如申請專利範圍第9項所述的成型方法，其中，“提供一曲面基體，所述曲面基體具有內表面和外表面，所述外表面為觸控操作面，所述內表面上設置有至少一個注入槽”具體為：通過注射成型或者3D列印的方式成型所述曲面基體，所述曲面基體具有內表面和外表面，所述外表面為觸控操作面，所述述曲面基體的內表面上設置有至少一個注入槽。The molding method according to item 9 of the scope of patent application, wherein "provide a curved substrate having an inner surface and an outer surface, said outer surface is a touch operation surface, and at least one inner surface is provided with “An injection slot” is specifically: molding the curved substrate by injection molding or 3D printing, the curved substrate has an inner surface and an outer surface, the outer surface is a touch operation surface, and the inner surface of the curved substrate The surface is provided with at least one injection groove.
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707259B (en) * 2019-05-31 2020-10-11 大陸商業成科技（成都）有限公司 Spherical touch device

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103135865B (en) * 2011-11-29 2016-06-01 天津富纳源创科技有限公司 touch module and preparation method thereof
CN103823595A (en) * 2014-03-13 2014-05-28 南昌欧菲光科技有限公司 Touch screen preparation method
CN105022520A (en) * 2014-04-30 2015-11-04 群创光电股份有限公司 Touch panel and touch display apparatus
CN203799363U (en) * 2014-05-05 2014-08-27 深圳市超维实业有限公司 Touch device with touchable curved surface
CN104156117A (en) * 2014-08-18 2014-11-19 信利光电股份有限公司 Touch panel, method for manufacturing touch panel and touch device
TW201614446A (en) * 2014-10-14 2016-04-16 Hon Hai Prec Ind Co Ltd Curved surface touch device and manufacturing method for curved surface touch device
JP2017068819A (en) * 2015-09-28 2017-04-06 双葉電子工業株式会社 Touch panel
CN105955549A (en) * 2016-07-01 2016-09-21 信利光电股份有限公司 Curved surface touch display module, manufacturing method thereof and electronic equipment
CN107300998B (en) * 2017-06-15 2020-04-24 昆山龙腾光电股份有限公司 Touch panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI707259B (en) * 2019-05-31 2020-10-11 大陸商業成科技（成都）有限公司 Spherical touch device

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