TW201926589A - 分區電磁遮罩封裝結構及製造方法 - Google Patents

分區電磁遮罩封裝結構及製造方法 Download PDF

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TW201926589A
TW201926589A TW106146669A TW106146669A TW201926589A TW 201926589 A TW201926589 A TW 201926589A TW 106146669 A TW106146669 A TW 106146669A TW 106146669 A TW106146669 A TW 106146669A TW 201926589 A TW201926589 A TW 201926589A
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electromagnetic shielding
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肖俊義
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大陸商訊芯電子科技(中山)有限公司
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Abstract

本發明提出一種分區電磁遮罩封裝結構，包括基板、多個焊墊組、多個晶片、封膠體、電磁遮罩層以及注膠體。多個焊墊組電性連接於基板的表面，且每個焊墊組間隔設置並與晶片對應。晶片焊接於述焊墊組。封膠體將每個晶片單獨封膠。在所有封膠體外層濺鍍金屬，以形成電磁遮罩層。在電磁遮罩層的外層注入注膠體，覆蓋電磁遮罩層以形成封裝體。根據需要，將包括多個晶片的封裝體進行切割。本發明還揭示了一種分區電磁遮罩封裝結構製造方法。本發明提供的封裝結構及製造方法，電磁遮罩層在封裝體內部，無需外層不繡鋼濺鍍金屬，同時取代了現有技術中對封裝產品進行半切割所導致的翹曲現象，提高了產品良率，改善了產品外觀。

Description

分區電磁遮罩封裝結構及製造方法
本發明涉及封裝結構及製造方法，尤其涉及一種分區電磁遮罩封裝結構及製造方法。
現有的分區電磁遮罩封裝結構在製造時，主要分為以下兩種方案：
一種是，先對封裝結構進行半切割，再做電磁遮罩處理。
另一種是，先對封裝結構進行半切割，再做點膠，最後進行電磁遮罩處理。
針對上述方案，由於半切割操作增加了生產製造週期以及切割成本，且基板在半切割過程中容易發生翹曲的現象，導致產品良率較低以及產品外觀不佳。
另外，在點膠過程中產生氣洞，致使產品良率不容易管控，且銀膠成本過高。
有鑑於此，有必要提供一種分區電磁遮罩封裝結構及製造方法。
一種分區電磁遮罩封裝結構，包括基板、多個焊墊組、多個晶片、封膠體、電磁遮罩層以及注膠體，該多個焊墊組電性連接於該基板的表面，且每個焊墊組間隔設置並與晶片對應，該晶片焊接於該焊墊組，該封膠體將每個晶片單獨封膠，在所有封膠體外層濺鍍金屬，以形成該電磁遮罩層，在該電磁遮罩層的外層注入該注膠體，覆蓋該電磁遮罩層以形成封裝體，並根據需要，將包括該多個晶片的封裝體進行切割。
進一步地，該基板包括頂面和與該頂面相對設置的底面，該頂面設有多個接地線，該底面設有多個接地層，該接地線和該接地層電性連接。
進一步地，該焊墊組設置在該頂面，並位於兩個或者多個接地線之間。
進一步地，該電磁遮罩層覆蓋該接地線，並與該接地線連接。
一種分區電磁遮罩封裝結構製造方法，其特徵在於，該分區電磁遮罩封裝結構製造方法包括：
在基板設置多個焊墊組；
在每個該焊墊組上焊接晶片；
封膠體將每個該晶片進行單獨封膠；
在該封膠體外層濺鍍金屬，以形成電磁遮罩層；
在該電磁遮罩層外層注入注膠體，以覆蓋該電磁遮罩層以形成封裝體；
根據需要，將包括該多個晶片的封裝體進行切割。
進一步地，該方法還包括：在該基板的頂面設置多個接地線，在該基板的底面設置多個接地層，且該接地線與該接地層電性連接。
進一步地，該焊墊組設置在該基板的頂面，並位於兩個或者多個接地線之間。
進一步地，該電磁遮罩層覆蓋該接地線，並與該接地線連接。
本發明提供的分區電磁遮罩封裝結構及製造方法，通過封膠體對多個晶片進行分區隔離，再對注入封膠體後的多個晶片進行整片的濺鍍電磁遮罩層，且濺鍍的電磁遮罩層在封裝體內部，無需外層不繡鋼濺鍍金屬，同時取代了現有技術中對封裝產品進行半切割所導致的翹曲現象，採用本發明的分區電磁遮罩封裝結構能夠有效的提高產品良率，改善產品外觀。
請參照圖1，本發明提供的分區電磁遮罩封裝結構100，包括基板10、設於基板10上的多個焊墊組20、多個晶片30、封膠體40、電磁遮罩層50以及注膠體60。在圖1中，基板10包括頂面11和與頂面11相對設置的底面12。基板10的頂面11設有多個接地線13，底面12設有接地層14，且接地線13與接地層14電性連接。焊墊組20設置在基板10的頂面11，位於相鄰兩個或者多個接地線13之間，且接地線13將多個焊墊組20間隔開，每個焊墊組20對應焊接一個晶片30，從而多個晶片30間隔設置，通過封膠體40將每個晶片30進行單獨封膠。也就是說，在基板10上封裝有多個晶片30，且每個晶片30之間相互獨立。在封膠體40及接地線13的外層濺鍍金屬，以形成電磁遮罩層50，由於電磁遮罩層50與接地線13連接，以起到電磁遮罩的效果。在電磁遮罩層50外層注入注膠體60，覆蓋濺鍍金屬以形成封裝體，並根據需要，將包括該多個晶片的封裝體切割成單獨的產品。
進一步地，本發明採用系統級封裝（System In a Package，SIP）封裝，隨著智慧手機和物聯網的普及，預期的SIP模組複雜度逐漸增加，對分區電子遮罩未來需求潛力很大。
本發明的分區電磁遮罩封裝結構100，通過封膠體40對多個晶片30進行分區隔離，再對注入封膠體40後的多個晶片30進行整片的濺鍍電磁遮罩層50，且濺鍍的電磁遮罩層50在封裝體內部30，無需外層不繡鋼濺鍍金屬，同時取代了現有技術中對封裝產品進行半切割所導致的翹曲現象，採用本發明的分區電磁遮罩封裝結構100能夠有效的提高產品良率，改善產品外觀。
本發明另一實施例提供一種分區電磁遮罩封裝結構製造方法，用於將晶片30分區電磁遮罩封裝在基板10上。該分區電磁遮罩封裝方法包括如下步驟：
請同時參照圖2和圖3，步驟S100，在基板10的頂面11設置多個接地線13，在底面12設置多個接地層14，且接地線13與接地層14電性連接。
請同時參照圖2和圖4，步驟S200，在基板10的頂面11，且在相鄰兩個或者多個接地線13之間設置焊墊組20。
請同時參照圖2和圖5，步驟S300，在每個焊墊組20上焊接晶片30。
請同時參照圖2和圖6，步驟S400，通過封膠體40將每個晶片30進行單獨封膠。也就是說，在基板10上封裝有多個晶片30，且每個晶片30之間相互獨立。
請同時參照圖2和圖7，步驟S500，在封膠體40及接地線13的外層濺鍍金屬，以形成電磁遮罩層50。由於電磁遮罩層50與接地線13連接，以起到電磁遮罩的效果。
請同時參照圖2和圖8，步驟S600，在電磁遮罩層50外層注入注膠體60，覆蓋濺鍍金屬及將產品封裝成整體。
請同時參照圖2和圖9，步驟S700，根據使用需要，將封裝整體切割成多個產品。
進一步地，本發明採用系統級封裝（System In a Package，SIP）封裝，隨著智慧手機和物聯網的普及，預期的SIP模組複雜度逐漸增加，對分區電子遮罩未來需求潛力很大。
對本領域的普通技術人員來說，可以根據本發明的發明方案和發明構思結合生成的實際需要做出其他相應的改變或調整，而這些改變和調整都應屬於本發明權利要求的保護範圍。
100‧‧‧封裝結構
10‧‧‧基板
11‧‧‧頂面
12‧‧‧底面
13‧‧‧接地線
14‧‧‧接地層
20‧‧‧焊墊組
30‧‧‧晶片
40‧‧‧封膠體
50‧‧‧電磁遮罩層
60‧‧‧注膠體
圖1所示為本發明實施方式中分區電磁遮罩封裝結構截面示意圖。
圖2所示為本發明提供的分區電磁遮罩封裝結構製造方法的流程圖。
圖3所示為製造基板外層線路的示意圖。
圖4所示為在基板上設置焊墊組的示意圖。
圖5所示為基板表面焊接晶片的示意圖。
圖6所示為第一次注入封膠體的示意圖。
圖7所示為整體濺鍍金屬的示意圖。
圖8所示為注入注膠體的示意圖。
圖9所示為切割成單獨產品的示意圖。

Claims (8)

  1. 一種分區電磁遮罩封裝結構，包括基板、多個焊墊組、多個晶片、封膠體、電磁遮罩層以及注膠體，該多個焊墊組電性連接於該基板的表面，且每個焊墊組間隔設置並與晶片對應，該晶片焊接於該焊墊組，該封膠體將每個晶片單獨封膠，在所有封膠體外層濺鍍金屬，以形成該電磁遮罩層，在該電磁遮罩層的外層注入該注膠體，覆蓋該電磁遮罩層以形成封裝體，並根據需要，將包括該多個晶片的封裝體進行切割。
  2. 如申請專利範圍第1項所述之分區電磁遮罩封裝結構，其中，該基板包括頂面和與該頂面相對設置的底面，該頂面設有多個接地線，該底面設有多個接地層，該接地線和該接地層電性連接。
  3. 如申請專利範圍第2項所述之分區電磁遮罩封裝結構，其中，該焊墊組設置在該頂面，並位於兩個或者多個接地線之間。
  4. 如申請專利範圍第3項所述之分區電磁遮罩封裝結構，其中，該電磁遮罩層覆蓋該接地線，並與該接地線連接。
  5. 一種分區電磁遮罩封裝結構製造方法，其特徵在於，該分區電磁遮罩封裝結構製造方法包括： 在基板設置多個焊墊組； 在每個該焊墊組上焊接晶片； 封膠體將每個該晶片進行單獨封膠； 在該封膠體外層濺鍍金屬，以形成電磁遮罩層； 在該電磁遮罩層外層注入注膠體，以覆蓋該電磁遮罩層以形成封裝體； 根據需要，將包括該多個晶片的封裝體進行切割。
  6. 如申請專利範圍第5項所述之分區電磁遮罩封裝結構製造方法，其中，在之前，該方法還包括：在該基板的頂面設置多個接地線，在該基板的底面設置多個接地層，且該接地線與該接地層電性連接。
  7. 如申請專利範圍第5項所述之分區電磁遮罩封裝結構製造方法，其中，該焊墊組設置在該基板的頂面，並位於兩個或者多個接地線之間。
  8. 如申請專利範圍第7項所述之分區電磁遮罩封裝結構製造方法，其中，該電磁遮罩層覆蓋該接地線，並與該接地線連接。
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