TW201912313A - Polishing tool and manufacturing method thereof capable of achieving the goal of fast polishing speed and high precision - Google Patents
Polishing tool and manufacturing method thereof capable of achieving the goal of fast polishing speed and high precision Download PDFInfo
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本發明為有關一種研磨工具及其製造方法，尤指一種應用範圍較廣且能兼顧快速及高精度目標的研磨工具、以及該研磨工具之製造方法。The present invention relates to an abrasive tool and a method of manufacturing the same, and more particularly to an abrasive tool having a wide range of applications and capable of achieving both rapid and high precision targets, and a method of manufacturing the same.
研磨拋光的目的在於使工件表面達到預定的平坦度，習知進行研磨拋光時所使用的研磨工具通常利用結合劑將磨粒結合在一起而形成，以具有高硬度、高研磨能力以及高研磨效率特性。The purpose of the grinding and polishing is to achieve a predetermined flatness of the surface of the workpiece. Conventionally, the grinding tools used in the polishing and polishing are usually formed by bonding abrasive grains together with a bonding agent to have high hardness, high grinding ability and high grinding efficiency. characteristic.
習知的研磨工具，舉例來說，英國專利公告號GB929187A提出的研磨工具包括磨料以及含有不飽和聚合物的結合劑，且磨料的表面被衍生自鹼性矽烷結構的有機官能化烯基聚矽氧烷包覆。關於該結合劑，在一較佳實施例中可包括3%至6%的不飽和有機聚合物，如天然橡膠、異戊二烯(isoprene)、聚丁二烯(polybutadiene)、丁二烯-苯乙烯(butadiene-styrene)、丁二烯丙烯腈(butadiene acrylonitrile)、氯丁二烯(chloroprene)、聚酯樹脂(polyester resin)；以及97%至94%的樹脂，如酚醛樹脂、苯胺甲醛樹脂、或環氧樹脂等，據此獲得耐水性佳、甚至在潮濕狀態下有更佳強度表現的研磨工具。Conventional abrasive tools, for example, the abrasive tool proposed in British Patent Publication No. GB929187A includes an abrasive and a binder containing an unsaturated polymer, and the surface of the abrasive is derived from an organic functionalized alkenyl polyfluorene derived from a basic decane structure. Oxyalkane coating. With respect to the binder, in a preferred embodiment, it may comprise from 3% to 6% of an unsaturated organic polymer such as natural rubber, isoprene, polybutadiene, butadiene. Butadiene-styrene, butadiene acrylonitrile, chloroprene, polyester resin; and 97% to 94% resin, such as phenolic resin, aniline formaldehyde resin Or epoxy resin, etc., thereby obtaining an abrasive tool which has good water resistance and has better strength performance even in a wet state.
日本專利公告號JP3082040B1的研磨工具中所使用的結合劑主要成分為聚合物以及聚合性黏彈性物質，該聚合物如酪蛋白、纖維素樹脂、或乙酸乙烯酯；而該聚合性黏彈性物質如顆粒合成橡膠、天然橡膠等。該結合劑有助於提高研磨材料的自修整效果，減少磨料的劣化，進而確保該研磨工具能夠穩定地長時間進行研磨。The main component of the binder used in the grinding tool of Japanese Patent Publication No. JP3082040B1 is a polymer and a polymerizable viscoelastic material such as casein, cellulose resin, or vinyl acetate; and the polymerizable viscoelastic material such as Granular synthetic rubber, natural rubber, etc. The binder helps to improve the self-trimming effect of the abrasive material, reduces the deterioration of the abrasive, and ensures that the abrasive tool can be stably ground for a long time.
日本專利公開號JP2008272835A的研磨工具則利用可撓性環氧樹脂來固定磨料，在此申請案的一實施例中，該環氧樹脂可為經由如丙烯腈丁二烯橡膠(NBR)、末端酸基液態丁腈橡膠(CTBN)、聚丁二烯(polybutadiene)等橡膠成分導入環氧基的橡膠加成環氧樹脂，據此獲得研磨過程中不易發生碎裂及細小裂紋的研磨工具。The abrasive tool of Japanese Patent Publication No. JP2008272835A utilizes a flexible epoxy resin to fix the abrasive. In an embodiment of the application, the epoxy resin may be via a terminal acid such as acrylonitrile butadiene rubber (NBR). A rubber component such as a liquid nitrile rubber (CTBN) or a polybutadiene is introduced into an epoxy-based rubber addition epoxy resin, whereby an abrasive tool which is less prone to chipping and fine cracking during the grinding process is obtained.
中國專利公告號CN102001057B的研磨工具則包括天然橡膠4-6重量分、氧化鋅0.5-1.5重量分、硫磺4-6重量分、環氧樹脂0.5-2.5重量分、抗老化劑0.4-0.6重量分、促進劑0.3-0.7重量分、碳化矽6-8重量分、白鋼玉2-4重量分、硌鋼玉2-4重量分、樹脂粉1-3重量分、樹脂液0.5-1.5重量分、以及凝固劑3-5重量分，獲得具有良好耐磨性、導熱性、耐蝕性以及韌性的研磨工具。The grinding tool of Chinese Patent Publication No. CN102001057B includes 4-6 parts by weight of natural rubber, 0.5-1.5 parts by weight of zinc oxide, 4-6 parts by weight of sulfur, 0.5-2.5 parts by weight of epoxy resin, and 0.4-0.6 weight of anti-aging agent. , accelerator 0.3-0.7 parts by weight, niobium carbide 6-8 parts by weight, white steel jade 2-4 parts by weight, niobium steel jade 2-4 parts by weight, resin powder 1-3 parts by weight, resin liquid 0.5-1.5 parts by weight, and The coagulant is 3-5 parts by weight to obtain an abrasive tool having good wear resistance, thermal conductivity, corrosion resistance and toughness.
然而，即便研磨工具的使用已有長久的歷史、且研磨技術亦日趨成熟，但同樣地，對於工件品質的精細度要求也較以往大幅提升，因此，目前使用的研磨工具仍有許多課題亟需進一步研發改良以符合相關領域的需求。However, even though the use of grinding tools has a long history and the grinding technology is becoming more mature, similarly, the fineness requirements for the quality of the workpiece have been greatly improved. Therefore, there are still many problems in the currently used grinding tools. Further research and development to meet the needs of related fields.
本發明的主要目的，在於克服習知研磨工具加工應用範圍較無彈性，故在進行研磨時得使用多種不同種類的研磨工具方能達到兼顧快速及高精度目標的不便因素。The main object of the present invention is to overcome the inelastic application range of the conventional grinding tool, so that a plurality of different types of grinding tools can be used in the grinding to achieve the inconvenience of taking into account the fast and high precision targets.
為了達到上述目的，本發明提供一種研磨工具，該研磨工具包括：一基座；一設置於該基座之一表面的研磨層，該研磨層具有一遠離該基座之工作面以及一靠近該基座之非工作面，該研磨層包括一結合劑、一第一增靭材料、以及複數個分散在該結合劑以及該第一增靭材料之中的磨料，且至少一部分之該磨料露出該研磨層之該工作面；以及一第二增靭材料，該第二增靭材料係分散於該研磨層中、或者在該研磨層之該非工作面上形成一緩衝層，該第二增靭材料係為矽氧烷類化合物。In order to achieve the above object, the present invention provides an abrasive tool comprising: a base; an abrasive layer disposed on a surface of the base, the abrasive layer having a working surface away from the base and a proximity a non-working surface of the susceptor, the polishing layer comprising a bonding agent, a first toughening material, and a plurality of abrasives dispersed in the bonding agent and the first toughening material, and at least a portion of the abrasive is exposed a working surface of the polishing layer; and a second toughening material dispersed in the polishing layer or forming a buffer layer on the non-working surface of the polishing layer, the second toughening material It is a oxoxane compound.
於本發明一實施例中，該結合劑係為一環氧樹脂。In an embodiment of the invention, the bonding agent is an epoxy resin.
於本發明一實施例中，該第一增靭材料係選自由一固態橡膠、一液態橡膠及其組合所組成之群組。In an embodiment of the invention, the first toughening material is selected from the group consisting of a solid rubber, a liquid rubber, and combinations thereof.
於本發明一實施例中，該磨料係為鑽石、立方氮化硼、氧化鋁、或碳化矽。In an embodiment of the invention, the abrasive is diamond, cubic boron nitride, aluminum oxide, or tantalum carbide.
於本發明一實施例中，該研磨層更包括至少一添加物，該添加物係為一副磨料、一樹脂強化添加物、或一研磨潤滑添加物。In an embodiment of the invention, the polishing layer further comprises at least one additive, the additive being a pair of abrasives, a resin-reinforced additive, or a grinding lubrication additive.
本發明更提供一種研磨工具之製造方法，包括：提供一基座；將一結合劑、一第一增靭材料、一第二增靭材料、以及複數個磨料混合形成一混合漿料；以及將該混合漿料塗覆於該基座之一表面而形成一研磨層，其中，該第二增靭材料係為矽氧烷類化合物。The invention further provides a method for manufacturing an abrasive tool, comprising: providing a susceptor; mixing a bonding agent, a first toughening material, a second toughening material, and a plurality of abrasives to form a mixed slurry; The mixed slurry is coated on one surface of the base to form an abrasive layer, wherein the second toughening material is a siloxane compound.
本發明又提供一種研磨工具之製造方法，包括：提供一基座；將一第二增靭材料塗覆於該基座之一表面而形成一緩衝層，該第二增靭材料係為矽氧烷類化合物；將一結合劑、一第一增靭材料、以及複數個磨料混合形成一混合漿料；以及將該混合漿料塗覆於該緩衝層之一表面而形成一研磨層。The invention further provides a method for manufacturing an abrasive tool, comprising: providing a pedestal; applying a second toughening material to a surface of the pedestal to form a buffer layer, wherein the second toughening material is argon An alkane compound; a binder, a first toughening material, and a plurality of abrasives are mixed to form a mixed slurry; and the mixed slurry is applied to one surface of the buffer layer to form an abrasive layer.
於本發明一實施例之製造方法中，該結合劑係為一環氧樹脂。In the manufacturing method of one embodiment of the present invention, the bonding agent is an epoxy resin.
於本發明一實施例之製造方法中，該第一增靭材料係選自由一固態橡膠、一液態橡膠及其組合所組成之群組。In a manufacturing method according to an embodiment of the present invention, the first toughening material is selected from the group consisting of a solid rubber, a liquid rubber, and a combination thereof.
於本發明一實施例之製造方法中，該磨料係為鑽石、立方氮化硼、氧化鋁、或碳化矽。In the manufacturing method of one embodiment of the present invention, the abrasive is diamond, cubic boron nitride, aluminum oxide, or tantalum carbide.
於本發明一實施例之製造方法中，該混合漿料更包括至少一添加物，該添加物係為一副磨料、一樹脂強化添加物、或一研磨潤滑添加物。In the manufacturing method of one embodiment of the present invention, the mixed slurry further comprises at least one additive, which is a pair of abrasives, a resin-reinforced additive, or a grinding lubrication additive.
習知研磨工具缺乏彈性，如果希望能兼顧快速及高精度目標，就必須在研磨進行過程使用多種不同種類的研磨工具，但將耗費無生產工時在該些研磨工具的修整、校刀、以及設定加工參數上。本發明的研磨工具藉由該第一增靭材料及第二增靭材料的搭配組合，使得該研磨工具在受到不同速度的衝擊時能夠表現出不同的硬度，因此，本發明的研磨工具在研磨進行時，可藉由將該研磨工具的操作參數調整為強烈或保守，令該研磨工具承受大或小的衝擊力而提升或降低該研磨工具的硬度，以進行高移除率之加工或高精度之研磨加工，相較於習知技術而言，加工應用範圍較具彈性、應用範圍較廣，故能克服習知技術中得使用多種不同種類的研磨工具方能得到快速及高精度目標的不便因素。Conventional grinding tools lack flexibility. If you want to achieve fast and high-precision goals, you must use a variety of different types of grinding tools during the grinding process, but it will cost you no time to trim, calibrate, and Set the processing parameters. The grinding tool of the present invention can make the grinding tool exhibit different hardness when subjected to impact of different speeds by the combination of the first toughening material and the second toughening material, and therefore, the grinding tool of the present invention is grinding. When performed, the operating parameters of the grinding tool can be adjusted to be strong or conservative, so that the grinding tool can withstand large or small impact forces to increase or decrease the hardness of the grinding tool for high removal rate processing or high. Accurate grinding processing, compared with the prior art, the processing application range is more flexible and the application range is wider, so it can overcome the conventional technology to use a variety of different types of grinding tools to achieve fast and high precision targets. Inconvenience factor.
有關本發明的詳細說明及技術內容，現就配合圖式說明如下：The detailed description and technical content of the present invention will now be described as follows:
第一實施例First embodiment
請參考『圖1A』及『圖1B』，係本發明第一實施例的研磨工具1示意圖，該研磨工具1主要包括一基座10以及一研磨層20。Please refer to FIG. 1A and FIG. 1B , which are schematic views of a grinding tool 1 according to a first embodiment of the present invention. The grinding tool 1 mainly includes a base 10 and an abrasive layer 20 .
該基座10係用於支撐該研磨層20，可選擇如不銹鋼或環氧樹脂作為該基座10，然本發明並不以此為限，其他適合的硬質材料亦可選用。The pedestal 10 is used to support the polishing layer 20, and the susceptor 10 may be selected as stainless steel or epoxy resin. However, the present invention is not limited thereto, and other suitable hard materials may also be used.
該研磨層20設置在該基座10之一表面，其中，該研磨層20遠離該基座10之一側為工作面20a，靠近該基座10之一側則為非工作面20b。本實施例中，該研磨層20包括一結合劑202、一第一增靭材料203、以及複數個分散在該結合劑202以及該第一增靭材料203之中的磨料201，為了要達到研磨目的，至少一部分之該磨料201露出該研磨層20之該工作面20a。The polishing layer 20 is disposed on a surface of the susceptor 10, wherein the polishing layer 20 is away from the side of the susceptor 10 as a working surface 20a, and one side of the susceptor 10 is a non-working surface 20b. In this embodiment, the polishing layer 20 includes a bonding agent 202, a first toughening material 203, and a plurality of abrasives 201 dispersed in the bonding agent 202 and the first toughening material 203, in order to achieve grinding. Purpose, at least a portion of the abrasive 201 exposes the face 20a of the abrasive layer 20.
適用於本實施例的該結合劑202可為環氧樹脂，於一非限制性實施例中舉例可為雙酚A型環氧樹脂；而該第一增靭材料203則可為一固態橡膠、一液態橡膠、或者為一固態橡膠以及一液態橡膠之混合，該固態橡膠舉例可為天然橡膠(NR)、苯乙烯丁二烯橡膠(SBR)、三元乙丙橡膠(EPDM)、丁基異丁烯異戊二烯橡膠(IIR)、聚異戊二烯橡膠(IR)及丙烯腈丁二烯橡膠(NBR)，本實施例中，該固態橡膠較佳為苯乙烯丁二烯橡膠(SBR)；而該液態橡膠舉例可為末端酸基液態丁腈橡膠(CTBN)、端羧基或端羥基聚丁二烯和丁二烯-苯乙烯共聚物、端巰基(-SH)聚硫橡膠、端異氰酸酯基聚酯和聚醚、或不飽和端基聚矽氧烷，本實施例中，該液態橡膠較佳為末端酸基液態丁腈橡膠(如CTBN 1300*8、或CTBN 1300*13)；該磨料201則可選用鑽石、立方氮化硼、氧化鋁、碳化矽、或其任意組合。The bonding agent 202 suitable for the present embodiment may be an epoxy resin. In one non-limiting embodiment, the bisphenol A epoxy resin may be exemplified; and the first toughening material 203 may be a solid rubber. a liquid rubber, or a mixture of a solid rubber and a liquid rubber, which may be exemplified by natural rubber (NR), styrene butadiene rubber (SBR), ethylene propylene diene monomer (EPDM), butyl isobutylene. Isoprene rubber (IIR), polyisoprene rubber (IR) and acrylonitrile butadiene rubber (NBR), in this embodiment, the solid rubber is preferably styrene butadiene rubber (SBR); The liquid rubber may be, for example, a terminal acid-based liquid nitrile rubber (CTBN), a terminal carboxyl group or a hydroxyl group polybutadiene and a butadiene-styrene copolymer, a terminal mercapto group (-SH) polysulfide rubber, and an isocyanate group. Polyester and polyether, or unsaturated end group polyoxyalkylene, in this embodiment, the liquid rubber is preferably a terminal acid-based liquid nitrile rubber (such as CTBN 1300*8, or CTBN 1300*13); the abrasive 201 may be selected from diamonds, cubic boron nitride, alumina, tantalum carbide, or any combination thereof.
於本實施例的該研磨層20中更包括有一第二增靭材料301，該第二增靭材料301與該結合劑202、該第一增靭材料203、以及該磨料201均勻地分散在該研磨層20中。該第二增靭材料301可為一矽氧烷類化合物。The polishing layer 20 of the embodiment further includes a second toughening material 301, the second toughening material 301 and the bonding agent 202, the first toughening material 203, and the abrasive 201 are uniformly dispersed in the In the polishing layer 20. The second toughening material 301 can be a monooxane compound.
除此之外，亦可視需要在該研磨層20中添加其他的添加物，譬如，副磨料，如氧化鈰等；樹脂強化添加物，如奈米碳管(CNT)或纖維素奈米纖維(CNF)；或研磨潤滑添加物，如石墨等。In addition, other additives such as secondary abrasives such as ruthenium oxide and the like, and resin-reinforced additives such as carbon nanotubes (CNT) or cellulose nanofibers may be added to the polishing layer 20 as needed. CNF); or abrasive lubrication additives such as graphite.
至於本實施例中，該研磨工具1可藉由下列步驟S1a至S4a製得。As for the present embodiment, the abrasive tool 1 can be produced by the following steps S1a to S4a.
S1a：提供該基座10；S1a: providing the base 10;
S2a：將該結合劑202、該第一增靭材料203、該第二增靭材料301、以及複數個磨料201以低速攪拌混合形成一混合漿料，以本實施例為例，如以該混合漿料之總體積為基準，該第一增靭材料203的體積百分比為1%至40%、該第二增靭材料301的體積百分比為1%至40%、且該磨料201的體積百分比為5%至40%，其餘可為該結合劑202。譬如，於本實施例 中，以該混合漿料之總體積為基準，該第一增韌材料203的體積百分比為3%、該第二增韌材料301的體積百分比為37 %、該磨料201係為8 mm 至15mm之鑽石磨料，體積百分比為20 %、以及體積百分比為40%之結合劑。然而，該第二增靭材料301、該結合劑202、該第一增靭材料203、以及該磨料201的組成比例並不僅限於上述範圍，而可視需求加以調整。且，此步驟中所述的「低速攪拌」係指進行攪拌時轉速為5 m/s至50 m/s，於一實施例中，可利用不高於30 m/s之轉速進行，其目的在於使該混合漿料中各成分得以充分且均勻地混合，然而，使用者可依據需求而任意變化轉速，本發明不侷限於此。S2a: the bonding agent 202, the first toughening material 203, the second toughening material 301, and the plurality of abrasives 201 are stirred and mixed at a low speed to form a mixed slurry, which is exemplified by the embodiment, such as the mixing. Based on the total volume of the slurry, the volume percentage of the first toughening material 203 is 1% to 40%, the volume percentage of the second toughening material 301 is 1% to 40%, and the volume percentage of the abrasive 201 is From 5% to 40%, the balance may be the binder 202. For example, in the present embodiment, the volume percentage of the first toughening material 203 is 3%, the volume percentage of the second toughening material 301 is 37%, and the abrasive 201 is based on the total volume of the mixed slurry. It is a 8 mm to 15 mm diamond abrasive with a volume percentage of 20% and a 40% by volume binder. However, the composition ratio of the second toughening material 301, the bonding agent 202, the first toughening material 203, and the abrasive 201 is not limited to the above range, but may be adjusted as needed. Moreover, the "low-speed agitation" described in this step means that the rotation speed is 5 m/s to 50 m/s when stirring, and in one embodiment, the rotation speed can be performed not higher than 30 m/s. The components in the mixed slurry are sufficiently and uniformly mixed. However, the user can arbitrarily change the number of rotations according to the demand, and the present invention is not limited thereto.
至於該結合劑202、該第一增靭材料203、該第二增靭材料301、以及該磨料201彼此之間的混合順序亦沒有特別限制，舉例來說，可先混合該結合劑202以及該第一增靭材料203後，再加入該第二增靭材料301，最後加入該磨料201；或者在其他實施例中，也可以先混合該結合劑202以及該第二增靭材料301後，再加入該第一增靭材料203，最後加入該磨料201；又或者在其他實施例中，可先混合該結合劑202、該第一增靭材料203、該第二增靭材料301後，再加入該磨料201混合，本發明對此並無限制。The order of mixing the bonding agent 202, the first toughening material 203, the second toughening material 301, and the abrasive 201 with each other is also not particularly limited. For example, the bonding agent 202 may be mixed first and After the first toughening material 203, the second toughening material 301 is further added, and finally the abrasive 201 is added; or in other embodiments, the bonding agent 202 and the second toughening material 301 may be mixed first, and then Adding the first toughening material 203, and finally adding the abrasive 201; or in other embodiments, the bonding agent 202, the first toughening material 203, the second toughening material 301 may be mixed first, and then added. The abrasive 201 is mixed, and the present invention is not limited thereto.
S3a：將該混合漿料塗覆於該基座10之一表面而形成該研磨層20，為了使該研磨層20具有研磨效果，至少一部分之該磨料201露出該研磨層20之該工作面20a。S3a: applying the mixed slurry to one surface of the susceptor 10 to form the polishing layer 20. In order to impart a grinding effect to the polishing layer 20, at least a portion of the abrasive 201 exposes the working surface 20a of the polishing layer 20. .
S4a：進行固化成型步驟，譬如，加熱該混合漿料，從而獲得該研磨工具1。S4a: A curing molding step is performed, for example, heating the mixed slurry to obtain the abrasive tool 1.
上述步驟中可選用的該基座10材料、該結合劑202、該第一增靭材料203、該第二增靭材料301、該磨料201、以及可進一步添加在該研磨層20中之該添加物種類已於前文中有詳細說明，故在此不另贅述。The susceptor 10 material, the bonding agent 202, the first toughening material 203, the second toughening material 301, the abrasive 201, and the addition which may be further added to the polishing layer 20 may be selected in the above steps. The types of objects have been described in detail in the foregoing, so they are not described here.
第二實施例Second embodiment
請續參考『圖2A』及『圖2B』，係本發明第二實施例的研磨工具1示意圖，該研磨工具1與第一實施例的結構相似，不同點在於：第二實施例的研磨工具1中的該研磨層20未包括該第二增靭材料203，該第二增靭材料203係在該基座10以及該研磨層20之間形成為一緩衝層30。Referring to FIG. 2A and FIG. 2B, FIG. 2B is a schematic view of a grinding tool 1 according to a second embodiment of the present invention. The grinding tool 1 is similar in structure to the first embodiment, except that the grinding tool of the second embodiment is used. The polishing layer 20 of 1 does not include the second toughening material 203, and the second toughening material 203 is formed as a buffer layer 30 between the susceptor 10 and the polishing layer 20.
即，於第二實施例中，該第二增靭材料301並非如第一實施例係分散於該研磨層20中，而是在該研磨層20之該非工作面20b上形成該緩衝層30，本實施例中，該緩衝層30的一表面接觸該基座10、另一表面則接觸該研磨層20。That is, in the second embodiment, the second toughening material 301 is not dispersed in the polishing layer 20 as in the first embodiment, but the buffer layer 30 is formed on the non-working surface 20b of the polishing layer 20, In this embodiment, one surface of the buffer layer 30 contacts the susceptor 10, and the other surface contacts the polishing layer 20.
因此，第二實施例的該研磨工具1的製備方法也與第一實施例略有不同，主要包括以下步驟S1b至S5b。Therefore, the preparation method of the abrasive tool 1 of the second embodiment is also slightly different from the first embodiment, and mainly includes the following steps S1b to S5b.
S1b：提供一基座10；S1b: providing a base 10;
S2b：將一第二增靭材料203塗覆於該基座10之一表面而形成一緩衝層30；S2b: a second toughening material 203 is applied to one surface of the susceptor 10 to form a buffer layer 30;
S3b：將一結合劑202、一第一增靭材料203、以及複數個磨料201以低速攪拌混合形成一混合漿料，其中，以該混合漿料之總體積為基準，該結合劑202、該第一增靭材料203、以及該磨料201的混合比例舉例可為：體積百分比為1%至40%的該第一增靭材料203、體積百分比為5%至40%的該磨料201、其餘則可為該結合劑202，且關於上述組成的混合順序亦可依需求而調整。此外，此步驟中所述的「低速攪拌」係指進行攪拌時轉速為5 m/s至50 m/s，於一實施例中，可利用不高於30 m/s之轉速進行，其目的在於使該混合漿料中各成分得以充分且均勻地混合，然而，使用者可依據需求而任意變化轉速，本發明不侷限於此；S3b: mixing a binder 202, a first toughening material 203, and a plurality of abrasives 201 at a low speed to form a mixed slurry, wherein the bonding agent 202 is based on the total volume of the mixed slurry. The mixing ratio of the first toughening material 203 and the abrasive 201 may be, for example, 1% to 40% by volume of the first toughening material 203, 5% to 40% by volume of the abrasive 201, and the rest. The binder 202 can be used, and the order of mixing with respect to the above composition can also be adjusted as needed. In addition, the "low-speed agitation" described in this step means that the rotation speed is 5 m/s to 50 m/s when stirring, and in one embodiment, the rotation speed can be performed by using not more than 30 m/s. The components in the mixed slurry are sufficiently and uniformly mixed. However, the user can arbitrarily change the rotation speed according to the demand, and the present invention is not limited thereto;
S4b：將該混合漿料塗覆於該緩衝層30之一表面而形成一研磨層20；以及S4b: applying the mixed slurry to one surface of the buffer layer 30 to form an abrasive layer 20;
S5b：進行固化成型步驟，譬如，加熱該混合漿料，從而獲得該研磨工具1。S5b: A curing molding step is performed, for example, heating the mixed slurry to obtain the abrasive tool 1.
於第二實施例中，關於該基座10材料、該結合劑202、該第一增靭材料203、該第二增靭材料301、該磨料201、以及可進一步添加至該研磨層20中的添加物的種類等，同第一實施例的說明，在此不另贅述。In the second embodiment, the base 10 material, the bonding agent 202, the first toughening material 203, the second toughening material 301, the abrasive 201, and further may be added to the polishing layer 20 The type of the additive and the like are the same as those of the first embodiment and will not be further described herein.
比較例Comparative example
本發明的比較例提供的研磨工具，除了未加入該第一增靭材料203以及該第二增靭材料301外，其餘結構及製造方法大致上與第一實施例的該研磨工具1相同。The grinding tool provided by the comparative example of the present invention is substantially the same as the grinding tool 1 of the first embodiment except that the first toughening material 203 and the second toughening material 301 are not added.
實驗例Experimental example
以第一實施例的該研磨工具1對一矽基板進行研磨，移除率及平坦度的測試結果如『圖3』及『圖4』。實際測試結果顯示：相較於未加入該第一增靭材料203以及該第二增靭材料301的比較例1的研磨工具，第一實施例的該研磨工具1在移除率有顯著的改善，約略在第10分鐘後開始產生差異，且在第30分鐘的移除量約為比較例的兩倍，並且可獲得與習知技術的研磨工具(即，比較例1)相同水準、甚至更優秀的平坦度。The polishing tool 1 of the first embodiment is used to polish a substrate, and the test results of the removal rate and the flatness are as shown in FIG. 3 and FIG. 4. The actual test results show that the grinding tool 1 of the first embodiment has a significant improvement in removal rate compared to the grinding tool of Comparative Example 1 to which the first toughening material 203 and the second toughening material 301 are not added. , about the difference started after the 10th minute, and the removal amount at the 30th minute is about twice that of the comparative example, and can be obtained at the same level as the grinding tool of the prior art (ie, Comparative Example 1), or even more. Excellent flatness.
綜上所述，本發明的研磨工具因加工應用範圍較具彈性、應用範圍較廣，而能克服過去在研磨進行過程中得使用多種不同種類的研磨工具方能達到兼顧快速及高精度目標之不便因素。In summary, the grinding tool of the present invention can overcome the goal of fast and high precision by using a plurality of different types of grinding tools in the past, because the processing application range is more flexible and the application range is wider. Inconvenience factor.
詳言之，本發明的研磨工具中藉由該第一增靭材料及第二增靭材料的搭配組合，使得該研磨工具在受到不同速度的衝擊時能夠表現出不同的硬度。因此，當研磨進行過程中改變該研磨工具的操作參數為強烈或保守，使該研磨工具承受大或小的衝擊力，藉此提升或降低該研磨工具的硬度以進行高移除率之加工或高精度之研磨加工。In detail, in the grinding tool of the present invention, the combination of the first toughening material and the second toughening material enables the grinding tool to exhibit different hardness when subjected to impact at different speeds. Therefore, changing the operating parameters of the grinding tool during the grinding process is strong or conservative, subjecting the grinding tool to a large or small impact force, thereby increasing or decreasing the hardness of the grinding tool for high removal rate processing or High precision grinding.
以上已將本發明做一詳細說明，惟以上所述者，僅爲本發明的一較佳實施例而已，當不能限定本發明實施的範圍。即凡依本發明申請範圍所作的均等變化與修飾等，皆應仍屬本發明的專利涵蓋範圍內。The present invention has been described in detail above, but the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the scope of the invention. That is, the equivalent changes and modifications made by the scope of the present application should remain within the scope of the patent of the present invention.
1‧‧‧研磨工具1‧‧‧ grinding tools
10‧‧‧基座10‧‧‧ Pedestal
20‧‧‧研磨層20‧‧‧Abrasive layer
20a‧‧‧工作面20a‧‧‧Working face
20b‧‧‧非工作面20b‧‧‧Non-working face
201‧‧‧磨料201‧‧‧Abrasive
202‧‧‧結合劑202‧‧‧Binder
203‧‧‧第一增靭材料203‧‧‧First toughened material
30‧‧‧緩衝層30‧‧‧buffer layer
301‧‧‧第二增靭材料301‧‧‧Second toughening material
『圖1A』，為本發明第一實施例的研磨工具示意圖。 『圖1B』，為本發明第一實施例的研磨工具立體示意圖。 『圖2A』，為本發明第二實施例的研磨工具示意圖。 『圖2B』，為本發明第二實施例的研磨工具立體示意圖。 『圖3』，為使用本發明第一實施例的研磨工具後，在移除率方面的測試結果。 『圖4』，為使用本發明第一實施例的研磨工具後，在表面粗糙度(Ra)方面的測試結果。Fig. 1A is a schematic view of a grinding tool according to a first embodiment of the present invention. Fig. 1B is a perspective view showing the grinding tool of the first embodiment of the present invention. Fig. 2A is a schematic view of a grinding tool according to a second embodiment of the present invention. 2B is a perspective view of the grinding tool according to the second embodiment of the present invention. "Fig. 3" is a test result in terms of removal rate after using the grinding tool of the first embodiment of the present invention. Fig. 4 is a test result in terms of surface roughness (Ra) after using the polishing tool of the first embodiment of the present invention.
Claims (17)
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| JP5921790B1 (en) * | 2014-07-07 | 2016-05-24 | バンドー化学株式会社 | Polishing film |
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