TW201901766A - Spacer and spacing method - Google Patents
Spacer and spacing method Download PDFInfo
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- TW201901766A TW201901766A TW107103726A TW107103726A TW201901766A TW 201901766 A TW201901766 A TW 201901766A TW 107103726 A TW107103726 A TW 107103726A TW 107103726 A TW107103726 A TW 107103726A TW 201901766 A TW201901766 A TW 201901766A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- Microelectronics & Electronic Packaging (AREA)
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
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Abstract
Description
本發明係關於間隔裝置及間隔方法。The present invention relates to a spacer device and a spacer method.
以往,所知的有使被黏貼於黏接薄片之複數被黏物之彼此間隔擴大的間隔裝置(例如,參照專利文獻1)。 [先前技術文獻] [專利文獻]Conventionally, there has been known a spacer device for increasing the distance between a plurality of adherends adhered to an adhesive sheet (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Literature]
[專利文獻1] 日本特開2014-232843號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-232843
[發明所欲解決之課題][Problems to be Solved by the Invention]
但是,在專利文獻1所記載之以往的間隔裝置中,黏貼有晶圓W(被黏物)之切割膠帶S(黏接薄片),因被黏貼於框件F般之框狀構件而進行朝拉伸手段26(間隔用保持手段)的收授,故當無如此之框狀構件時,產生黏接薄片之端部下垂,或動搖,而無法確實地將該黏接薄片之端部收授至間隔用保持手段這樣的不良情形。However, in the conventional spacer device described in Patent Document 1, the dicing tape S (adhesive sheet) to which the wafer W (adherent body) is adhered is directed toward the frame-like member F like the frame member F. The drawing means 26 (retaining means for spacing) is adopted. Therefore, when there is no such frame-shaped member, the end of the adhesive sheet is drooped or shaken, and the end of the adhesive sheet cannot be reliably received. To the bad situation such as holding means.
本發明之目的係在於提供可以確實地將黏接薄片之端部保持於間隔用保持手段之間隔裝置及間隔方法。 [用以解決課題之手段]An object of the present invention is to provide a spacer device and a spacer method capable of reliably holding an end portion of an adhesive sheet to a spacer holding means. [Means to solve the problem]
本發明採用記載於請求項之構成。 [發明效果]The present invention employs a configuration described in the claims. [Inventive effect]
若藉由本發明時,因對間隔用保持手段保持的包含端部之黏接薄片之外緣部,賦予特定張力,將一體物收授至間隔用保持手段,故不會有黏接黏片之端部下垂,搖動之情形,可以確實地將該黏接薄片之端部保持於間隔用保持手段。According to the present invention, since the outer edge portion of the adhesive sheet including the end portion held by the holding means by the space is given a specific tension, and the integrated body is accepted to the holding means by the space, there is no sticking of the adhesive sheet. When the end portion sags and shakes, it is possible to reliably hold the end portion of the adhesive sheet to the holding means for the interval.
以下,根據圖面說明本發明之實施型態。 另外,本實施型態中之X軸、Y軸、Z軸分別具有正交之關係,X軸及Y軸設為特定平面內之軸,Z軸設為與上述特定平面正交之軸。並且,在本實施型態中,以從與Y軸平行之箭頭BD方向觀看之情況為基準,在無舉出成為基準之圖示而表示方向之情況下,「上」為Z軸之箭頭方向,「下」為其相反方向,「左」為X軸之箭頭方向,「右」為其相反方向,「前」為Y軸箭頭方向,「後」為其相反方向。Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, the X-axis, Y-axis, and Z-axis in the present embodiment have orthogonal relationships. The X-axis and Y-axis are set as axes in a specific plane, and the Z-axis is set as an axis orthogonal to the specific plane. In addition, in this embodiment mode, the case is viewed from the direction of the arrow BD parallel to the Y axis as a reference, and when the direction is shown without a reference icon as a reference, "up" is the direction of the Z axis arrow , "Down" is the opposite direction, "Left" is the direction of the X-axis arrow, "Right" is the direction of the X-axis arrow, "Front" is the direction of the Y-axis arrow, and "Back" is the opposite direction.
本發明之間隔裝置10具備:複數間隔用保持手段20,其係保持在黏接薄片AS之一方之表面AS1,黏貼有複數被黏物CP之一體物WK中之該黏接薄片AS之端部AE1;間隔手段30,其係使保持黏接薄片AS之端部AE1之間隔用保持手段20做相對性移動,對黏接薄片AS賦予張力而使被黏物CP之彼此間隔擴大;收授手段40,其係保持一體物WK而將該一體物WK收授至複數間隔用保持手段20;及檢測手段50,其係攝影機或投影機等的攝影手段,或者光學感測器或超音波感測器等之各種感測器。另外,本實施型態之一體物WK在俯視正方形之黏接薄片AS之中央部,被黏貼有複數被黏物CP。The spacer device 10 of the present invention is provided with a plurality of spacer holding means 20, which are held on one surface AS1 of one of the adhesive sheets AS, and the ends of the adhesive sheet AS in the body WK of the plurality of adherends CP are adhered. AE1; spacing means 30, which is used to relatively move the distance between the ends AE1 of the adhesive sheet AS using the holding means 20 to apply tension to the adhesive sheet AS to increase the interval between the adherends CP; 40, which holds the integrated body WK and transfers the integrated body WK to the plural interval holding means 20; and the detection means 50, which is a photographing means such as a camera or a projector, or an optical sensor or an ultrasonic sensor Sensors and other sensors. In addition, the body WK, which is one embodiment of this embodiment, has a plurality of adherends CP adhered to the center of the square adhesive sheet AS in a square view.
間隔用保持手段20具備:下保持構件21,其係被支持於間隔手段30;作為驅動機器之旋轉馬達22,其係被支持於下保持構件21;及上保持構件23,其係被支持於其輸出軸22A。The interval holding means 20 includes a lower holding member 21 supported by the interval means 30, a rotary motor 22 as a driving device supported by the lower holding member 21, and an upper holding member 23 supported by Its output shaft 22A.
間隔手段30具備:作為驅動機器的線性馬達31,和被支持於其滑件31A,在上面側支持下保持構件21之保持臂32。The distance means 30 includes a linear motor 31 as a driving device, and a holding arm 32 that is supported by the slider 31A and holds the member 21 under the upper surface side support.
收授手段40具備:複數收授用保持手段41,其係保持在一體物WK中之黏接薄片AS之另外端部AE2;張力賦予手段42,其係使保持黏接薄片AS之另外端部AE2之收授用保持手段41做相對性移動,對間隔用保持手段20保持的包含端部AE1之黏接薄片AS之外緣部賦予特定張力;及搬運手段43,其係搬運以收授用保持手段41保持的一體物WK。 收授用保持手段41具備藉由減壓泵或真空抽氣器等之無圖示的減壓手段能夠吸附保持的4台吸附墊41A,和支持各吸附墊41A之支持臂41B。 張力賦予手段42具備作為驅動機器之4台XY平台42A,其具備能夠在X軸方向及Y軸方向之兩軸方向移動的滑件42B,在各滑件42B分別支持有支持臂41B。 搬運手段43具備有:作為多關節機器人43A,其係藉由複數機械臂所構成;和底框43C,其係被支持在其作業部亦即前端機械臂43B,支持4台XY平台42A。另外,多關節機器人43A為能夠在其作業範圍內,以任何位置、任何角度使在前端機械臂43B支持之物移位的所謂6軸機器人等即可,例如可以例示揭示於日本特開2016-81974之多關節機器人111等。The receiving means 40 is provided with a plurality of receiving and retaining means 41 for retaining the other end portion AE2 of the adhesive sheet AS in the integrated body WK, and a tension applying means 42 for retaining the other end portion of the adhesive sheet AS. The receiving and retaining means 41 for AE2 performs relative movement to give a specific tension to the outer edge of the adhesive sheet AS including the end portion AE1 held by the retaining means 20 for the interval; and the conveying means 43 is used for conveying and receiving The integrated body WK held by the holding means 41. The receiving / holding means 41 includes four adsorption pads 41A capable of being sucked and held by a pressure reducing means (not shown) such as a pressure reduction pump or a vacuum aspirator, and a support arm 41B which supports each of the adsorption pads 41A. The tension applying means 42 includes four XY stages 42A as driving devices, and includes sliders 42B capable of moving in both the X-axis direction and the Y-axis direction. Each of the sliders 42B supports a support arm 41B. The conveying means 43 includes a multi-joint robot 43A composed of a plurality of robot arms, and a bottom frame 43C which is supported on its operation portion, that is, a front-end robot arm 43B, and supports four XY platforms 42A. In addition, the articulated robot 43A may be a so-called 6-axis robot capable of displacing the object supported by the front end robot arm 43B at any position and angle within its operating range. For example, it is disclosed in Japanese Patent Application Laid-Open No. 2016- 81974 articulated robot 111 and so on.
說明以上之間隔裝置10之動作。 首先,對各構件在圖1(A)、(B)中以實線表示之初期位置待機的間隔裝置10,該間隔裝置10之使用者(以下,單稱為「使用者」)經由操作面板或個人電腦等之無圖示之操作手段而輸入自動運轉開始之訊號。如此一來,收授手段40驅動多關節機器人43A,使吸附墊41A抵接於被供給至無圖示之特定的一體物供給位置之一體物WK之黏接薄片AS之另外端部AE2之後,驅動無圖示之減壓手段,開始該黏接薄片AS之吸附保持。接著,收授手段40驅動多關節機器人43A,如圖1(B)中實線所示般,將以吸附墊41A所吸附保持之一體物WK搬運至各間隔用保持手段20之上方之後,驅動XY平台42A,以特定轉矩使吸附墊41A移動至黏接薄片AS之對角線方向,對間隔用保持手段20保持的包含端部AE1之黏接薄片AS之外緣部賦予特定張力。The operation of the above-mentioned spacer device 10 will be described. First, the spacer device 10 in which each component stands by at the initial position indicated by a solid line in FIGS. 1 (A) and (B), and a user of the spacer device 10 (hereinafter, simply referred to as a “user”) passes the operation panel. Or an unillustrated operating means, such as a personal computer, to input a signal to start automatic operation. In this way, the receiving and receiving means 40 drives the articulated robot 43A so that the suction pad 41A abuts on the other end AE2 of the adhesive sheet AS supplied to the body WK, which is one of the specific integrated supply positions (not shown) The pressure-reducing means (not shown) is driven to start adsorption and holding of the adhesive sheet AS. Next, the receiving means 40 drives the articulated robot 43A, and as shown by the solid line in FIG. 1 (B), the body WK adsorbed and held by the adsorption pad 41A is transferred above the holding means 20 for each interval, and then driven. The XY stage 42A moves the suction pad 41A to the diagonal direction of the adhesive sheet AS with a specific torque, and applies a specific tension to the outer edge portion of the adhesive sheet AS including the end portion AE1 held by the interval holding means 20.
此時,檢測手段50驅動攝影機等,進行被黏物CP之檢測,同時收授手段40驅動多關節機器人43A,根據該檢測手段50之檢測結果,邊進行被黏物CP之定位,邊如圖1(B)中以二點鏈線所示般,將對外緣部賦予特定張力之狀態的黏接薄片AS之端部AE1載置於下保持構件21上。收授手段40係以例如被黏物CP全體之中心位置不從該間隔裝置10之特定位置(例如,該間隔裝置10之中心位置)位置偏離之方式,或是被黏物CP全體之外輪廓邊或各被黏物CP之外輪廓邊分別與X軸和Y軸成為平行之方式,進行被黏物CP之定位。At this time, the detection means 50 drives the camera and the like to detect the adherent CP, and the receiving means 40 drives the articulated robot 43A. According to the detection result of the detection means 50, the adherence CP is positioned as shown in the figure. In 1 (B), as shown by a two-dot chain line, the end portion AE1 of the adhesive sheet AS in a state where a specific tension is applied to the outer edge portion is placed on the lower holding member 21. The receiving means 40 is such that the central position of the entire adherend CP does not deviate from a specific position of the spacer device 10 (for example, the central position of the spacer device 10), or the outline of the entire adherend CP Positioning of the adherend CP is performed in such a manner that the edges or the contour edges outside the adherend CP become parallel to the X axis and the Y axis, respectively.
之後,間隔用保持手段20驅動各旋轉馬達22,當以下保持構件21和上保持構件23保持黏接薄片AS之端部AE1時,收授手段40停止無圖示之減壓手段之驅動,解除黏接薄片AS之吸附保持之後,驅動多關節機器人43A,使吸附墊41A復位至初期位置。接著,間隔手段30驅動各線性馬達31,如圖1(C)所示般,使間隔用保持手段20彼此間隔開,對黏接薄片AS賦予張力而使被黏物CP之互相間隔擴大。此時。各被黏物CP係藉由黏接薄片AS之變形等,有彼此間隔不擴大成特定件間隔之情形。於是,根據檢測手段50之檢測結果,間隔手段30驅動各線性馬達31,以各被黏物CP之彼此間隔成為特定間隔之方式,使各間隔用保持手段20個別移動。Thereafter, each rotation motor 22 is driven by the interval holding means 20, and when the lower holding member 21 and the upper holding member 23 hold the end portion AE1 of the adhesive sheet AS, the receiving means 40 stops driving the pressure reducing means (not shown) and releases it. After the adsorption and holding of the adhesive sheet AS, the articulated robot 43A is driven to return the adsorption pad 41A to the initial position. Next, the spacer means 30 drives the linear motors 31 to space the spacer holding means 20 apart from each other as shown in FIG. 1 (C), and applies tension to the adhesive sheet AS to increase the interval between the adherends CP. at this time. Each of the adherends CP may not be enlarged to a specific piece interval due to deformation of the adhesive sheet AS or the like. Then, according to the detection result of the detection means 50, the interval means 30 drives the linear motors 31 to move each interval individually by the holding means 20 so that the interval between the adherends CP becomes a specific interval.
而且,藉由拾取裝置或搬運裝置等之無圖示之被黏物取出手段,所有的被黏物CP或特定量之被黏物CP從黏接薄片AS拆下時,間隔手段30驅動各線性馬達31,使各個滑件31A復位至初期位置之後,間隔用保持手段20驅動旋轉馬達22,使上保持構件23復位至初期位置。接著,作業員或無圖示之搬運手段去除殘留在下保持構件21上之黏接薄片AS,之後重複上述相同的動作。Furthermore, when all the adherends CP or a specific amount of the adherends CP are removed from the adhesive sheet AS by a non-illustrated adherend removal means such as a pickup device or a conveying device, the spacer means 30 drives each linear After the motor 31 resets each slider 31A to the initial position, the rotation motor 22 is driven by the interval holding means 20 to return the upper holding member 23 to the initial position. Next, the operator or a conveyance means (not shown) removes the adhesive sheet AS remaining on the lower holding member 21 and repeats the same operation as described above.
若藉由上述般之間隔裝置10時,因對間隔用保持手段20保持的包含端部AE1之黏接薄片AS之外緣部,賦予特定張力,將一體物WK收授至間隔用保持手段20,故不會有黏接黏片AS之端部AE1下垂,搖動之情形,可以確實地使該黏接薄片AS之端部AE1保持於間隔用保持手段20。When the spacer device 10 as described above is used, a specific tension is applied to the outer edge portion of the adhesive sheet AS including the end portion AE1 held by the spacer holding means 20, and the integrated body WK is imparted to the spacer holding means 20. Therefore, there is no case where the end portion AE1 of the adhesive sheet AS sags and shakes, and the end portion AE1 of the adhesive sheet AS can be surely maintained at the interval holding means 20.
在本發明中之手段及工程只要能發揮針對該些手段及工程所說明的動作、功能或工程,就不受任何限定,況且,不完全受限於在上述實施型態中表示的僅一實施型態的構成物或工程。例如,間隔用保持手段若係以複數或單數所構成,能夠保持在黏接薄片之一方之表面和另一方之表面之至少一方,黏貼複數被黏物或被分割而成為複數之被黏物的一體物中之該黏接薄片之端部者時,且對照申請時之技術常識,若為在其技術範圍內者,則不受任何限定(即使其他手段及工程亦同)。The means and processes in the present invention are not limited in any way as long as they can perform the actions, functions, or processes described with respect to those means and processes, and they are not completely limited to only one implementation shown in the above-mentioned implementation types A type of structure or project. For example, if the holding means for space is composed of plural or singular, it can be held on at least one of the surface of the adhesive sheet and the surface of the other, and the plural adhered or divided to become the plural adhered When the end of the adhesive sheet in the integrated body is compared with the technical common sense at the time of application, if it is within its technical scope, it is not limited (even if it is the same by other means and engineering).
本發眀之間隔裝置如圖2(A)所示般,即使設為具備有下述構件的間隔裝置10A亦可:間隔用保持手段20;抵接手段60,其係在較黏接薄片AS中黏貼有複數被黏物CP之被黏物黏接區域CE更外側,亦即在間隔用保持手段20保持的被保持區域HE之內側,抵接於該黏接薄片AS;和間隔手段30A,其係使保持黏接薄片AS之端部AE1之間隔用保持手段20及抵接手段60做相對性移動,對黏接薄片AS賦予張力而使被黏物CP之彼此間隔擴大;和收授手段40。 另外,在間隔裝置10A中,對和間隔裝置10相等的構成,且具有相同功能者,賦予與該間隔裝置10相同之號碼,省略其構成說明,簡化動作說明。As shown in FIG. 2 (A), the spacer device of the present hairpin can be provided with a spacer device 10A provided with the following members: holding means 20 for spacing and abutment means 60, which are attached to a relatively adhesive sheet AS The adhered area CE to which the plurality of adherends CP are pasted is further outside, that is, the inside of the held area HE held by the holding means 20 abuts against the bonding sheet AS; and the spacing means 30A, It is to relatively maintain the distance between the ends AE1 of the adhesive sheet AS by the holding means 20 and the abutment means 60, and apply tension to the adhesive sheet AS to expand the interval between the adherends CP; 40. In the spacer device 10A, those having the same structure as the spacer device 10 and having the same function are given the same number as the spacer device 10, and the description of the structure is omitted to simplify the operation description.
間隔手段30A具備被支持於底板BP上之作為驅動機器之直驅式馬達33,以其輸出軸33A支持下保持構件21。 抵接手段60具備被支持於抵板BP上之圓筒狀的抵接構件61。The distance means 30A includes a direct drive motor 33 as a driving device supported on the bottom plate BP, and the lower holding member 21 is supported by the output shaft 33A. The abutment means 60 includes a cylindrical contact member 61 supported by the contact plate BP.
如此之間隔裝置10A與間隔裝置10相同,收授手段40驅動多關節機器人43A、無圖示之減壓手段及XY平台42,如圖2(A)中二點鏈線所示般,邊對以吸附墊41A吸附保持的黏接薄片AS之外緣部賦予特定張力,邊將黏接薄片AS之端部AE1載置於下保持構件21上。之後,間隔用保持手段20驅動各旋轉馬達22,如圖2(B)所示般,以下保持構件21和上保持構件23保持黏接薄片AS之端部AE1之後,間隔手段30A驅動各直驅式馬達33,使間隔用保持手段20下降而使間隔用保持手段20及抵接手段60做相對性移動,對黏接薄片AS賦予張力而使被黏物CP之彼此間隔擴大。之後,當藉由無圖式之被黏物取出手段,被黏物CP從黏接薄片AS被拆下時,各手段驅動各個驅動機器,使各構件復位至初期位置之後,拆下殘留在下保持構件21上之黏接薄片AS,之後重複上述相同的動作。The spacer device 10A is the same as the spacer device 10, and the receiving means 40 drives the articulated robot 43A, the pressure reducing means (not shown) and the XY platform 42, as shown by the two-point chain line in FIG. 2 (A). The outer edge portion of the adhesive sheet AS that is sucked and held by the suction pad 41A is given a specific tension, and the end portion AE1 of the adhesive sheet AS is placed on the lower holding member 21. After that, each of the rotary motors 22 is driven by the interval holding means 20. As shown in FIG. 2 (B), after the lower holding member 21 and the upper holding member 23 hold the end portion AE1 of the adhesive sheet AS, the interval means 30A drives each direct drive. The type motor 33 lowers the interval holding means 20 and relatively moves the interval holding means 20 and the abutment means 60 to apply tension to the adhesive sheet AS to increase the interval between the adherends CP. Then, when the adherend CP is removed from the adhesive sheet AS by the unillustrated adherend removal means, each means drives each driving machine to reset each component to the initial position, and then removes and retains the remaining After the bonding sheet AS on the member 21 is repeated, the same operations as described above are repeated.
即使藉由如此之間隔裝置10A,亦可以取得與間隔裝置10相同之效果。Even with such a spacer device 10A, the same effect as that of the spacer device 10 can be obtained.
間隔用保持手段20即使為保持在另一方之表面AS2,或一方之表面AS1及另一方之表面AS2之雙方之表面黏貼複數被黏物CP之黏接薄片AS之端部AE1的構成亦可,即使為以機械式夾頭或夾頭汽缸等之把持手段、庫倫力、接合劑、黏接劑、磁力、柏努力吸附、驅動機器等保持黏接薄片AS之端部AE1的構成亦可 在間隔裝置10之情況下,間隔用保持手段20即使以例如將朝右方移動之該間隔用保持手段20設為一台,將朝左方移動之該間隔用保持手段20設為一台的兩台來構成亦可,即使以例如將朝右方、左方及其他方向移動之三台以上來構成亦可。 間隔用保持手段20為間隔裝置10A之情況下,即使為一台亦可即使為兩台以上亦可。The spacer holding means 20 may have a configuration in which the end surface AE1 of the plurality of adherends CP is adhered to the other surface AS2, or the surfaces of both the surface AS1 and the other surface AS2 are adhered to each other. Even if it is a structure that holds the end portion AE1 of the bonding sheet AS by a mechanical chuck or a chuck cylinder, a coulomb force, a cement, an adhesive, a magnetic force, a cypress, and a machine, the AE1 can be held at an interval. In the case of the device 10, even if the interval holding means 20 moving to the right is set as one unit, and the interval holding means 20 moving to the left is set as two units, It may be configured by three or more units that are moved to the right, left, and other directions, for example. When the interval holding means 20 is the spacer device 10A, even if it is one, it may be two or more.
間隔手段30、30A即使非複數而係單數亦可,在此情況下,例如間隔裝置10即使設為以一台線性馬達之兩個滑件,分別以一台支持間隔用保持手段20,擴大被黏物CP之彼此間隔的構成,且將被黏物CP之彼此間隔僅在一軸方向(例如,X軸方向或Y軸方向等)擴大的構成亦可。 間隔手段30即使為在三軸以上之方向擴大彼此間隔(例如,X軸方向、Y軸方向及其他軸方向)的構成亦可,例如即使設為使在X軸方向移動之複數間隔用保持手段20分別在Y軸方向移動之構成(使在Y軸方向移動之複數間隔用保持手段20分別在X軸方向移動的構成),擴大被黏物CP之彼此間隔亦可,即使為無法作動成被黏物CP之彼此間隔成為特定間隔的構成亦可。 間隔手段30A即使藉由邊使間隔用保持手段20停止或移動,邊使抵接手段60移動,使間隔用保持手段20及抵接手段60做相對性移動,對黏接薄片AS賦予張力而擴大被黏物CP之彼此間隔亦可。 間隔手段30、30A即使作業員操作按鈕或操作桿等,驅動線性馬達31、直驅式馬達33亦可,在此情況下,例如,即使構成將藉由檢測手段50的檢測結果顯示於螢幕或檢測器等之顯示器,以藉由顯示於該顯示器之檢測結果使被黏物CP之彼此間隔成為特定間隔之方式, 或是各被黏物CP之全體性集合形狀相對於基底的全體性集合形狀成為相似關係之方式,作業員驅動線性馬達31、直驅式馬達33亦可。The spacing means 30 and 30A may be singular even if they are not plural. In this case, for example, even if the spacing device 10 is provided with two sliders of one linear motor, and one holding means 20 is used to support the spacing, the space is expanded. A configuration in which the adherends CP are spaced apart from each other, and a configuration in which the interval between the adherends CP are only enlarged in one axial direction (for example, the X-axis direction or the Y-axis direction) may be used. The spacing means 30 may have a configuration in which the distance between each other (for example, the X-axis direction, the Y-axis direction, and other axis directions) is increased in three or more axes. For example, it may be a holding means for moving a plurality of intervals in the X-axis direction. The structure in which the 20 moves in the Y axis direction (the structure in which the plural intervals moving in the Y axis direction moves in the X axis direction by the holding means 20) can increase the interval between the adherends CP, even if it cannot be moved The structure in which the CPs are spaced apart from each other may be a specific interval. Even if the spacer means 30A stops or moves the spacer holding means 20, the abutment means 60 is moved, and the spacer holding means 20 and the abutment means 60 are moved relative to each other to increase the tension on the adhesive sheet AS. The adherends CP may be spaced apart from each other. The interval means 30 and 30A may drive the linear motor 31 and the direct drive motor 33 even if the operator operates a button or an operation lever. In this case, for example, even if it is configured to display the detection result by the detection means 50 on the screen or In a display such as a detector, the distance between the adherends CP is set to a specific interval by the detection result displayed on the display, or the overall collective shape of each adherent CP is relative to the overall collective shape of the substrate. To form a similar relationship, the operator may drive the linear motor 31 and the direct drive motor 33.
收授手段40即使不進行被黏物CP之定位,對外緣部賦予特定張力之狀態之黏接薄片AS之端部AE1在載置於下保持構件21上亦可。 張力賦予手段42即使對黏接物AS之外緣部,僅在X軸方向、Y軸方向或其他方向賦予特定張力亦可,即使非特定轉矩,使吸附墊41A移動特定距離而對黏接薄片AS之外緣部賦予特定張力亦可,即使使吸附墊41A移動至偏離黏接薄片AS之對角方向之方向亦可,即使非複數而係單數亦可,在此情況下,例如,即使設為以一台線性馬達之兩個滑件,分別以一組支持收授用保持手段41,對黏接薄片AS之外緣部賦予特定張力之構成,且僅在單軸方向(例如,X軸方向或Y軸方向等)擴大被黏物CP之彼此間隔的構成亦可。 收授用保持手段41即使為以機械式夾頭或夾頭汽缸等之把持手段、庫倫力、接合劑、黏接劑、磁力、柏努力吸附、驅動機器等保持黏接薄片AS之其他端部AE2的構成亦可。 張力賦予手段42即使作業員操作按鈕或操作桿等,驅動XY平台42A亦可,在此情況下,即使例如構成在螢幕或檢測器等之顯示器顯示XY平台42A輸出之轉矩,且構成被顯示於該顯示器之轉矩值成為特定值,或是在顯示器顯示XY平台42A之滑件42B之移動量,且以被顯示於該顯示器之移動量成為特定移動量之方式,作業員使XY平台42A驅動亦可。 收授手段40對黏接薄片AS之外緣部賦予的特定張力,若為該黏接薄片AS之外緣部不鬆弛之程度以上的張力時,使用者可以任意決定其值。Even if the receiving means 40 does not perform positioning of the adherend CP, the end portion AE1 of the adhesive sheet AS in a state where a specific tension is applied to the outer edge portion may be placed on the lower holding member 21. The tension applying means 42 may apply a specific tension only to the X-axis direction, the Y-axis direction, or other directions to the outer edge portion of the adherend AS. Even if the torque is not specified, the adsorption pad 41A is moved by a specific distance to adhere the adhesive. It is also possible to apply specific tension to the outer edge portion of the sheet AS, even if the suction pad 41A is moved to a direction deviating from the diagonal direction of the adhesive sheet AS, even if it is not plural but singular, in this case, for example, even if It is set as a structure in which two sliders of a linear motor are respectively provided with a set of holding support means 41 for receiving and receiving, and a specific tension is given to the outer edge portion of the adhesive sheet AS, and only in a uniaxial direction (for example, X (The axial direction or the Y-axis direction, etc.) may be configured to increase the distance between the adherends CP. The holding means 41 for receiving and receiving is a holding means such as a mechanical chuck or a chuck cylinder, a coulomb force, a cement, an adhesive, a magnetic force, a cypress, and a machine for holding the other end of the adhesive sheet AS. The structure of AE2 is also acceptable. The tension applying means 42 may drive the XY stage 42A even if the operator operates a button or an operation lever. In this case, for example, even if a display configured on a screen or a detector displays the torque output from the XY stage 42A, and the composition is displayed, When the torque value of the display becomes a specific value, or the movement amount of the slider 42B of the XY platform 42A is displayed on the display, and the movement amount displayed on the display becomes a specific movement amount, the operator makes the XY platform 42A Drive is also available. The specific tension given to the outer edge portion of the adhesive sheet AS by the receiving means 40, if the tension is more than the degree that the outer edge portion of the adhesive sheet AS does not loosen, the user can arbitrarily determine the value.
檢測手段50即使為例如作業員之目視亦可,在此情況下,為了以作業員之目視,對黏接薄片AS之外緣部賦予特定張力,或進行被黏物CP之位置和該間隔裝置10之定位,或使成為以被黏物CP之彼此間隔成為特定間隔,或使各被黏物CP之全體性集合形狀相對於基底的全體性集合形狀成為相似關係,即使構成操作驅動按鈕或操作桿等,而驅動XY平台42A、線性馬達31、直驅式馬達33亦可,即使在本發明之間隔裝置10、10A中無具備亦可。The detection means 50 may be, for example, the eyes of an operator. In this case, in order to provide the eyes of the operator with specific tension to the outer edge portion of the adhesive sheet AS, or perform the position of the adherend CP and the spacer device. The positioning of 10 makes the specific distance between the adherent CPs to each other, or makes the overall collective shape of each adherent CP similar to the overall collective shape of the substrate, even if it constitutes an operation driving button or operation. It is also possible to drive the XY stage 42A, the linear motor 31, and the direct-drive motor 33 by using a rod or the like, even if none of the spacer devices 10 and 10A of the present invention is provided.
抵接手段60除了角筒狀或橢圓筒狀之外,即使採用圓柱、角柱、橢圓柱等之其他形狀之抵接構件61亦可。The abutting means 60 may be a rectangular tube shape or an elliptical tube shape, or a contact member 61 having another shape such as a column, a corner column, or an elliptical column.
間隔裝置10即使構成首先收授手段40驅動XY平台42A,對黏接薄片AS之外緣部僅在X軸方向賦予特定張力之後,間隔用保持手段20驅動旋轉馬達22,僅以在X軸方向排列之間隔用保持手段20保持黏接薄片AS之端部AE1,之後,同樣地,對黏接薄片AS之外緣部,僅在Y軸方向賦予特定張力之後,僅以在Y軸方向排列之間隔用保持手段20保持黏接薄片AS之端部AE1亦可(在此情況下,即使X和Y相反亦可)。 在黏接薄片AS藉由特定能量,其黏接力下降之情況下,即使在以無圖式之被黏物取出手段從黏接薄片AS拆下被黏物CP之前,藉由能夠賦予特定能量之能量賦予手段使黏接薄片AS之黏接力下降亦可。另外,如此之能量賦予手段即使為所謂的波長之電磁波(例如,X射線或紅外線等),將被加熱或冷卻之氣體或液體等之流體等作為能量而賦予至黏接薄片AS者亦可,若為能夠因應黏接薄片AS之構成而賦予可以降低該黏接薄片AS之黏接力的能量者時任何皆可。Even if the spacer device 10 is configured to drive the XY stage 42A by the first receiving means 40, and after applying a specific tension to the outer edge portion of the adhesive sheet AS only in the X-axis direction, the spacer holding means 20 drives the rotary motor 22 only in the X-axis direction The arrangement interval holds the end portion AE1 of the adhesive sheet AS by the holding means 20, and thereafter, similarly, the outer edge portion of the adhesive sheet AS is given a specific tension only in the Y-axis direction, and then is aligned only in the Y-axis direction. The interval holding means 20 may hold the end portion AE1 of the adhesive sheet AS (in this case, even if X and Y are opposite). In the case where the adhesive strength of the adhesive sheet AS is reduced by a specific energy, even before the adherend CP is removed from the adhesive sheet AS by the unpatterned adherend removal method, the specific energy It is also possible to reduce the adhesive force of the adhesive sheet AS by the energy application method. In addition, even if such an energy imparting means is an electromagnetic wave of a so-called wavelength (for example, X-rays or infrared rays), a heated or cooled gas, a liquid, or the like can be applied to the adhesive sheet AS as energy, Any energy may be used as long as it is capable of reducing the adhesive force of the adhesive sheet AS in accordance with the configuration of the adhesive sheet AS.
在本發明中之黏接薄片AS及被黏物CP之材質、種類、形狀等並不特別限定。例如,黏接薄片AS或被黏物CP即使為圓形、橢圓形、三角形或四角形等之多角形、其他形狀亦可,黏接薄片AS即使為壓敏黏接性、熱敏性黏接性等之黏接型態者亦可。再者,黏接薄片AS即使為例如僅有黏接劑層之單層者,在基材和黏接劑層之間具有中間層者,在基材之上面具有覆蓋層等之3層以上者,並且可以從黏接劑層剝離基材的所謂兩面黏接薄片者亦可,如此之兩面黏接薄片即使具有單層或複層之中間層者,或無中間層之單層或複層者亦可。再者,作為被黏物CP,即使為例如食品、樹脂容器、矽半導體晶圓或化合物半導體晶圓等之半導體晶圓、半導體晶片、電路基板、光碟等之資訊記錄基板、玻璃板、鋼板、陶器、木板或樹脂等之單體物亦可,即使為以兩個以上所形成之複合物亦可,可以將任意型態之構件或物品等設為對象。另外,黏接薄片AS即使換成功能性、用途性的說法,例如資訊記載用標籤、裝飾用標籤、保護薄片、切割膠帶、晶粒黏接薄膜、晶粒結合膠帶、記錄層形成樹脂薄片等之任意薄片、薄膜、膠帶等亦可。 被黏物CP即使事先在黏接薄片AS存在複數亦可,即使在以間隔手段30、30A、其他機構或人工等賦予外力之時點,分割成複數,成為被分割成在黏接薄片AS上存在複數者亦可。作為如此地被分割而成為複數的被黏物CP,有例如對半導體晶圓或基板等照射雷射,在該半導體晶圓或基板等形成線狀或格子狀等之脆弱的脆弱層,在時而對黏接薄片AS賦予張力,時而直接性或間接性地對半導體晶圓或基板等賦予外力之時點被個片化,成為複數被黏物CP者,或例如以切斷刀切入樹脂或玻璃板等,先在該樹脂或玻璃板等形成線狀或格子狀等之不會貫通表背的切槽或裁線點等之切斷預定線,在時而對黏接薄片AS賦予張力,時而直接性或間接性地對樹脂或玻璃板等賦予外力之時點,被個片化成為複數被黏物CP等,不受到任何限定者。The materials, types, shapes, etc. of the adhesive sheet AS and the adherend CP in the present invention are not particularly limited. For example, the adhesive sheet AS or the adherend CP may have a polygonal shape such as a circle, an oval, a triangle, or a quadrangle, and other shapes may be used. The adhesive sheet AS may have pressure-sensitive adhesiveness, heat-sensitive adhesiveness, or the like. Adhesive type is also available. Furthermore, even if the adhesive sheet AS is, for example, a single layer having only an adhesive layer, one having an intermediate layer between the substrate and the adhesive layer, and three or more layers including a cover layer on the substrate And, the so-called double-sided adhesive sheet that can peel the substrate from the adhesive layer is also acceptable, so that the double-sided adhesive sheet has a single layer or a multilayer intermediate layer, or a single layer or a multilayer without an intermediate layer. Yes. Moreover, as the adherend CP, even information recording substrates such as food, resin containers, silicon semiconductor wafers or compound semiconductor wafers, semiconductor wafers, circuit boards, optical discs, glass plates, steel plates, A single object such as pottery, wood, resin, etc. may be used, even if it is a composite formed of two or more, any type of component or article can be targeted. In addition, even if the adhesive sheet AS is replaced with functional and usable terms, such as information recording labels, decorative labels, protective sheets, dicing tapes, die-bonding films, die-bonding tapes, recording layer forming resin sheets, etc. Any sheet, film, tape, etc. are also possible. The adherend CP may be plural in the adhesion sheet AS in advance, and even when external force is applied by the interval means 30, 30A, other mechanisms, or labor, it is divided into plural numbers, and it is divided into existence on the adhesion sheet AS. A plurality may be used. As the to-be-adhered object CP divided in this way, for example, a semiconductor wafer or a substrate is irradiated with a laser, and a fragile fragile layer such as a line or a grid is formed on the semiconductor wafer or the substrate. When the tension is applied to the adhesive sheet AS, the semiconductor wafer or the substrate is sometimes directly or indirectly applied with an external force, and when it is singulated, it becomes a plurality of adherends CP. For the glass plate, etc., firstly, the resin or the glass plate is formed into a cut line such as a line or a lattice shape that does not penetrate the front and back of the groove or cut point, and the tension is sometimes applied to the adhesive sheet AS. From time to time, when external force is directly or indirectly applied to a resin, a glass plate, or the like, it is singulated into a plurality of adherends, such as CP, without any limitation.
在上述實施型態中之驅動機器除了可以採用旋轉馬達、直驅式馬達、線性馬達、單軸機器人、多關節機器人等之電動機器、汽缸、油壓汽缸、無桿式汽缸及旋轉汽缸等之致動器等,亦可以可採用直接性或間接性地組合該些者。In addition to the driving machines in the above implementation modes, in addition to electric machines such as rotary motors, direct-drive motors, linear motors, single-axis robots, articulated robots, cylinders, hydraulic cylinders, rodless cylinders, and rotary cylinders, etc. Actuators and the like may be combined directly or indirectly.
10、10A‧‧‧間隔裝置10, 10A‧‧‧ Spacer
20‧‧‧間隔用保持手段20‧‧‧ Interval holding means
30、30A‧‧‧間隔手段30, 30A‧‧‧ Interval Means
40‧‧‧收授手段40‧‧‧ Means of Grant
41‧‧‧收授用保持手段41‧‧‧ Receiving means
42‧‧‧張力賦予手段42‧‧‧ Means of giving tension
43‧‧‧搬運手段43‧‧‧handling means
60‧‧‧抵接手段60‧‧‧Arrival means
AE1‧‧‧端部AE1‧‧‧End
AE2‧‧‧另外的端部AE2‧‧‧Other end
AS‧‧‧黏接薄片AS‧‧‧Adhesive sheet
AS1‧‧‧一方之表面AS1‧‧‧ surface
AS2‧‧‧另一方之表面AS2‧‧‧ surface of the other party
CE‧‧‧被黏物黏接區域CE‧‧‧ Adhesive area
CP‧‧‧被黏物CP‧‧‧ Adhesive
HE‧‧‧保持區域HE‧‧‧ holding area
WK‧‧‧一體物WK‧‧‧One
圖1(A)為與本發明之實施型態有關之間隔裝置之俯視圖。(B)、(C)為(A)之側視圖,其動作說明圖。 圖2(A)、(B)為本發明之其他例之說明圖。Fig. 1 (A) is a top view of a spacer device related to an embodiment of the present invention. (B) and (C) are side views of (A), and their operation explanatory diagrams. (2) (A) and (B) are explanatory diagrams of other examples of the present invention.
Claims (4)
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JP2001225986A (en) * | 2000-02-16 | 2001-08-21 | Ricoh Co Ltd | Sheet material holding device |
JP5133660B2 (en) * | 2007-11-27 | 2013-01-30 | 株式会社ディスコ | Breaking method of adhesive film mounted on backside of wafer |
JP5307384B2 (en) * | 2007-12-03 | 2013-10-02 | 株式会社ディスコ | Wafer division method |
JP5085452B2 (en) * | 2008-07-29 | 2012-11-28 | 株式会社ディスコ | Tape expansion unit |
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JP6059921B2 (en) * | 2012-08-31 | 2017-01-11 | 日東電工株式会社 | Adhesive tape application method and adhesive tape application device |
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