TW201843438A - Circuit board assembly detection system and detection method thereof - Google Patents
Circuit board assembly detection system and detection method thereof Download PDFInfo
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本發明係關於一種組裝電路板檢測系統及組裝電路板檢測方法,特別是一種整合自動光學檢測(Automated-Optical Inspection, AOI)及在線測試(In Circuit Tester, ICT)的組裝電路板檢測系統及組裝電路板檢測方法。The invention relates to an assembled circuit board detecting system and an assembled circuit board detecting method, in particular to an integrated circuit board detecting system and assembly integrated with Automated-Optical Inspection (AOI) and In Circuit Tester (ICT). Board test method.
在製造電子產品的過程中,必定需要在印刷電路板(Printed Circuit Board, PCB)上組裝各式各樣的電子零件。這些電子零件通常可採用表面黏著技術(Surface Mount Technology, SMT)或是雙列直插封裝(Dual In Line Package, DIP)製程。其中,DIP製程零件的組裝方式,係將DIP零件的接腳***印刷電路板上的電鍍通孔(Plating Through Hole, PTH),並於印刷電路板底部塗佈助焊劑,再經由焊錫爐將零件焊接固定於印刷電路板上,然後進行組裝後測試,以確認組裝零件後的印刷電路板在板彎、漏電流、電容及其他組裝零件的電性功能等檢測項目中是否為正常,另外也需要檢測組裝電路板是否有缺件、錯件、極性反(Polarity reversed)等問題。In the process of manufacturing electronic products, it is necessary to assemble a variety of electronic components on a Printed Circuit Board (PCB). These electronic components are typically available in Surface Mount Technology (SMT) or Dual In Line Package (DIP) processes. Among them, the DIP process parts are assembled by inserting the pins of the DIP parts into a Plating Through Hole (PTH) on the printed circuit board, and applying flux to the bottom of the printed circuit board, and then passing the parts through the soldering furnace. Soldering is fixed on the printed circuit board and then assembled and tested to confirm whether the printed circuit board after assembling the components is normal in the test items such as plate bending, leakage current, capacitance and electrical functions of other assembled parts. Check the assembled circuit board for missing parts, wrong parts, and Polarity reversed.
詳言之,組裝後測試的類型大致上可分為AOI、ICT及功能驗證測試(Function Verification Test, FVT)等。實務上,前述各類型的測試項目通常係以分站處理方式進行,並由各站之操作員於測試機台執行對應的檢測步驟。而分屬於不同測試機台之多個測試項目一般可視實際需求安排,不存在必然的先後測試順序。然而,因受限於測試機台之硬體設備係個別獨立設置的現況,使得理論上可同時處理的測試項目必須分成多個站點依序進行,致使針對單一組裝電路板的總測試時間極為冗長且無效率。此外,由於組裝電路板上的DIP零件數量眾多,配合測試機台的操作員易於因疏忽、疲勞等因素導致目檢過程發生失誤,致使組裝電路板無法保持穩定良率的產出,更因此額外增加測試出錯後的重工費用。In particular, the types of post-assembly tests can be broadly classified into AOI, ICT, and Function Verification Test (FVT). In practice, each of the aforementioned types of test items is usually performed in a substation processing manner, and an operator of each station performs a corresponding detection step on the test machine. However, multiple test items belonging to different test machines are generally arranged according to actual needs, and there is no inevitable sequential test sequence. However, due to the fact that the hardware devices of the test machine are individually set independently, the test items that can theoretically be processed simultaneously must be divided into multiple sites in sequence, resulting in a total test time for a single assembled circuit board. Lengthy and inefficient. In addition, due to the large number of DIP parts on the assembled circuit board, the operator who cooperates with the test machine is prone to errors in the visual inspection process due to factors such as negligence and fatigue, resulting in the assembly board not being able to maintain a stable yield. Increase the rework cost after the test error.
考量前述組裝電路板於爐後檢測流程中總測試時間冗長以及人為操作疏失的問題,本發明提出一個整合多站測試於單站進行的組裝電路板檢測系統及組裝電路板檢測方法,藉由測試機台的硬體整合與軟體搭配,而達成縮短總測試工時與提升出貨品質的效果。Considering the lengthy time of the total test time and the problem of human operation in the post-furnace inspection process of the assembled circuit board, the present invention proposes an integrated circuit board detection system and an assembly circuit board detection method for integrating multi-station test in a single station, by testing The hardware integration of the machine and the software are combined to achieve the effect of shortening the total test hours and improving the quality of the shipment.
依據本發明一實施例的組裝電路板檢測系統,包括檢測平台、攝像裝置、壓抵板及運算主機。檢測平台具有承載面以放置組裝電路板,且承載面上具有複數個電路檢測接點。攝像裝置具有入光側朝向承載面,攝像裝置用以由入光側拍攝組裝電路板以產生待測影像。壓抵板可移動地設置於檢測平台及攝像裝置之間,壓抵板具有透光部,透光部對位於攝像裝置之入光側,壓抵板用以壓抵組裝電路板使組裝電路板之複數個料件之接腳電性連接前述的複數個電路檢測接點。運算主機電性連接檢測平台及攝像裝置,用以接收待測影像並對待測影像執行影像分析程式,及用以透過檢測平台對組裝電路板執行料件測試。An assembled circuit board detecting system according to an embodiment of the invention includes a detecting platform, a camera device, a pressing plate and a computing host. The inspection platform has a bearing surface for placing the assembled circuit board, and the mounting surface has a plurality of circuit detecting contacts. The imaging device has a light incident side facing the bearing surface, and the imaging device is configured to capture the assembled circuit board by the light incident side to generate an image to be tested. The pressing plate is movably disposed between the detecting platform and the imaging device, the pressing plate has a light transmitting portion, the light transmitting portion is located on the light incident side of the image capturing device, and the pressing plate is pressed against the assembled circuit board to assemble the circuit board. The pins of the plurality of materials are electrically connected to the plurality of circuit detecting contacts described above. The computing host is electrically connected to the detection platform and the camera device for receiving the image to be tested and performing an image analysis program on the image to be tested, and performing material testing on the assembled circuit board through the detection platform.
依據本發明另一實施例的組裝電路板檢測系統,同樣包括上述實施例中的檢測平台、攝像裝置、壓抵板及運算主機,且更包括輔助光源、板彎測試組件、顯示裝置、掃描裝置、資料傳輸裝置、資料庫主機、檢測光源及感測器。輔助光源具有出光側朝向承載面,出光側用於輸出光線照射組裝電路板。前述的檢測平台之承載面具有一置板區域,而板彎測試組件凸設於承載面且位於置板區域外。顯示裝置電性連接運算主機,用以顯示影像分析程式產生之影像分析訊號及料件測試產生之料件測試訊號。掃描裝置電性連接運算主機,用以取得對應於組裝電路板之一序號。資料傳輸裝置電性連接運算主機且通訊連接資料庫主機,資料傳輸裝置用以將前述的影像分析訊號及料件測試訊號傳送至資料庫主機儲存。檢測光源位於前述的置板區域內,且檢測光源朝向攝像裝置之入光側投射光線。感測器設置於承載面,感測器電性連接運算主機且係用以感測組裝電路板是否位於檢測平台之承載面之置板區域。The assembled circuit board detecting system according to another embodiment of the present invention also includes the detecting platform, the image capturing device, the pressing plate and the computing host in the above embodiments, and further includes an auxiliary light source, a plate bending test component, a display device, and a scanning device. , data transmission device, database host, detection source and sensor. The auxiliary light source has a light exiting side facing the bearing surface, and the light emitting side is for outputting light to illuminate the assembled circuit board. The bearing cover of the aforementioned detection platform has a plate area, and the plate bending test component is protruded from the bearing surface and located outside the plate area. The display device is electrically connected to the computing host for displaying the image analysis signal generated by the image analysis program and the material test signal generated by the material test. The scanning device is electrically connected to the computing host for obtaining a serial number corresponding to the assembled circuit board. The data transmission device is electrically connected to the computing host and communicates with the database host, and the data transmission device transmits the image analysis signal and the material test signal to the database host for storage. The detecting light source is located in the aforementioned plate area, and the detecting light source projects light toward the light incident side of the image capturing device. The sensor is disposed on the carrying surface, and the sensor is electrically connected to the computing host and is configured to sense whether the assembled circuit board is located in a mounting area of the bearing surface of the detecting platform.
依據本發明之一實施例的組裝電路板檢測方法,包括:將組裝電路板放置於檢測平台;以攝像裝置之入光側拍攝組裝電路板以產生待測影像;以運算主機接收待測影像並產生可續行訊號;在運算主機產生可續行訊號後,移動壓抵板壓抵組裝電路板使組裝電路板電性接觸檢測平台;以檢測平台對組裝電路板執行料件測試;以運算主機分析待測影像並產生影像分析訊號;及以運算主機根據料件測試產生料件測試訊號。An assembly circuit board detecting method according to an embodiment of the present invention includes: placing an assembled circuit board on a detecting platform; photographing an assembled circuit board on a light incident side of the image capturing device to generate an image to be tested; and receiving, by the computing host, the image to be tested Generating a continuable signal; after the computing host generates a continuable signal, the moving pressing plate is pressed against the assembled circuit board to electrically connect the detecting circuit board to the detecting platform; and the detecting platform performs the material testing on the assembled circuit board; The image to be tested is analyzed and an image analysis signal is generated; and the test piece is generated by the computing host according to the material test.
藉由上述架構,本案所揭露的組裝電路板檢測系統及組裝電路板檢測方法,整合對於組裝電路板必須執行的料件測試及影像分析,並在同一檢測平台上完成前述兩項主要的組裝電路板檢測流程;不僅達到節省整體測試時間的功效,更因此節省測試人力,並降低人為因素導致檢測疏漏的比率。With the above structure, the assembled circuit board detecting system and the assembled circuit board detecting method disclosed in the present invention integrate the material testing and image analysis which must be performed for assembling the circuit board, and complete the two main assembly circuits on the same detecting platform. Board inspection process; not only saves the overall test time, but also saves test manpower and reduces the rate of detection of omissions caused by human factors.
以上之關於本揭露內容之說明及以下之實施方式之說明係用以示範與解釋本發明之精神與原理,並且提供本發明之專利申請範圍更進一步之解釋。The above description of the disclosure and the following description of the embodiments of the present invention are intended to illustrate and explain the spirit and principles of the invention, and to provide further explanation of the scope of the invention.
以下在實施方式中詳細敘述本發明之詳細特徵以及優點,其內容足以使任何熟習相關技藝者了解本發明之技術內容並據以實施,且根據本說明書所揭露之內容、申請專利範圍及圖式,任何熟習相關技藝者可輕易地理解本發明相關之目的及優點。以下之實施例係進一步詳細說明本發明之觀點,但非以任何觀點限制本發明之範疇。The detailed features and advantages of the present invention are set forth in the Detailed Description of the Detailed Description of the <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> <RTIgt; The objects and advantages associated with the present invention can be readily understood by those skilled in the art. The following examples are intended to describe the present invention in further detail, but are not intended to limit the scope of the invention.
本發明之組裝電路板檢測系統及組裝電路板檢測方法適用於一已焊接DIP零件的組裝電路板。請一併參考圖1及圖2A,圖1係繪示本發明之一實施例的組裝電路板檢測系統功能方塊示意圖,所述的組裝電路板檢測系統1至少包括檢測平台11、攝像裝置13、壓抵板14及運算主機15。而圖2A係繪示除運算主機15以外的前述元件其相對位置側視圖。值得強調的是:在本發明中,運算主機15至少用於執行習知的在線檢測及自動光學檢測中的資料運算處理,尤其是當運算主機15配合檢測平台11及壓抵板14可執行在線檢測項目,而運算主機15配合攝像裝置13可執行自動光學檢測項目。The assembled circuit board inspection system and the assembled circuit board inspection method of the present invention are applicable to an assembled circuit board of a soldered DIP component. Referring to FIG. 1 and FIG. 2A together, FIG. 1 is a functional block diagram of an assembled circuit board detecting system according to an embodiment of the present invention. The assembled circuit board detecting system 1 includes at least a detecting platform 11 and an imaging device 13. The plate 14 and the computing host 15 are pressed. 2A is a side view showing the relative position of the aforementioned elements other than the computing unit 15. It should be emphasized that, in the present invention, the computing host 15 is at least used to perform data processing in the conventional online detection and automatic optical detection, especially when the computing host 15 cooperates with the detection platform 11 and the pressing plate 14 to perform online. The item is detected, and the computing host 15 cooperates with the camera 13 to execute an automatic optical detection item.
請參考圖3,其係檢測平台11的俯視圖。在本發明一實施例中,檢測平台11具有一承載面111,承載面111具有一置板區域1111供待測的組裝電路板20放置。為便於下文敘述,當組裝電路板20位於置板區域1111時,組裝電路板20朝向承載面111的一側簡稱為背面,且組裝電路板20背向承載面111的一側簡稱為正面。所述的置板區域1111係由置板區域1111四周的多個定位元件1113依據組裝電路板20平面面積大小界定範圍,定位元件1113例如係塑膠凸塊、金屬檔板或標示於承載面111上的定位點,本發明不以為限。置板區域1111內具有複數個電路檢測接點113,當組裝電路板20位於置板區域1111時,這些電路檢測接點113各自對位於組裝電路板20上DIP零件的測試接腳。Please refer to FIG. 3, which is a top view of the detection platform 11. In an embodiment of the invention, the detection platform 11 has a bearing surface 111 having a plated area 1111 for the assembled circuit board 20 to be tested. For convenience of the following description, when the assembled circuit board 20 is located in the boarding area 1111, the side of the assembled circuit board 20 facing the carrying surface 111 is simply referred to as the back side, and the side of the assembled circuit board 20 facing away from the carrying surface 111 is simply referred to as the front side. The positioning area 1111 is defined by a plurality of positioning elements 1113 around the boarding area 1111 according to the plane area of the assembled circuit board 20. The positioning component 1113 is, for example, a plastic bump, a metal baffle or is marked on the bearing surface 111. The positioning point is not limited to the present invention. The boarding area 1111 has a plurality of circuit detecting contacts 113. When the assembled circuit board 20 is located in the boarding area 1111, the circuit detecting contacts 113 respectively face the test pins of the DIP parts on the assembled circuit board 20.
在本發明另一實施例中,檢測平台11更包括複數個檢測光源115且這些檢測光源115位於承載面111的置板區域1111內。檢測光源115例如係發光二極體(Light-Emitting Diode, LED)或其他小型發光燈具,用以朝向組裝電路板20背面投射光線。當組裝電路板20有缺件時,代表所缺零件之金屬接腳並未正確安裝至組裝電路板20之貫穿孔,使得檢測光源115投射之光線可穿過貫穿孔而抵達攝像裝置13的入光側131。In another embodiment of the invention, the detection platform 11 further includes a plurality of detection light sources 115 and these detection light sources 115 are located in the plate-mounting region 1111 of the bearing surface 111. The detection light source 115 is, for example, a Light-Emitting Diode (LED) or other small light-emitting fixture for projecting light toward the back of the assembled circuit board 20. When the assembled circuit board 20 has a missing component, the metal pin representing the missing component is not correctly mounted to the through hole of the assembled circuit board 20, so that the light projected by the detecting light source 115 can pass through the through hole and reach the imaging device 13. Light side 131.
請一併參考圖2A及圖2B,壓抵板14具有一透光部141,透光部141例如係中空孔洞或透明材質板件。壓抵板14可移動地設置於攝像裝置13與檢測平台11之間,當壓抵板14完成下移動作而靜止時,如圖2B所示,將施加壓力使組裝電路板20背面複數個測試接腳電性接觸置板區域1111內的電路檢測接點113。在另一實施例中,壓抵板14更包括一針床,針床具複數個電路檢測探針,當壓抵板14完成下移動作而靜止時,將施加壓力使組裝電路板20正面複數個測試接腳電性接觸針床上的電路檢測探針。實務上,壓抵板14例如係一平面壓克力板,壓抵板14之一側接觸組裝電路板20正面以施加壓力,壓抵板14之另一側則垂直連接至伸縮桿件143之一端,伸縮桿件143另一端則垂直連接至一動力來源145。壓抵板14之下移動作係由運算主機15發送一可續行訊號通知動力來源145指示伸縮桿件143作動。此可續行訊號例如係由操作員按壓實體按鈕而產生,或是運算主機15在取得組裝電路板20之待測影像之後自行產生,本發明不以為限。而在運算主機15完成組裝電路板20的料件檢測之後,將通知動力來源145指示伸縮桿件143作動,使壓抵板14上移。Referring to FIG. 2A and FIG. 2B together, the pressing plate 14 has a light transmitting portion 141, such as a hollow hole or a transparent material plate. The pressing plate 14 is movably disposed between the imaging device 13 and the detecting platform 11. When the pressing plate 14 is moved to be stationary, as shown in FIG. 2B, pressure is applied to make the back of the assembled circuit board 20 a plurality of tests. The circuit in the electrical contact plate area 1111 of the pin detects the contact 113. In another embodiment, the pressing plate 14 further includes a needle bed having a plurality of circuit detecting probes. When the pressing plate 14 is moved to be stationary, the pressure is applied to cause the front surface of the assembled circuit board 20 to be plural. The test pins are electrically connected to the circuit detection probe on the needle bed. In practice, the pressing plate 14 is, for example, a flat acrylic plate, one side of the pressing plate 14 contacts the front surface of the assembled circuit board 20 to apply pressure, and the other side of the pressing plate 14 is vertically connected to the telescopic rod member 143. At one end, the other end of the telescopic rod 143 is vertically connected to a power source 145. The movement under the pressure plate 14 is sent by the computing host 15 to send a renewable signal to notify the power source 145 that the telescopic rod 143 is actuated. The continuation signal is generated by the operator pressing the physical button, or the computing host 15 generates the image after assembling the circuit board 20, which is not limited by the invention. After the computing host 15 completes the component inspection of the assembled circuit board 20, the power source 145 is notified to instruct the telescopic rod member 143 to actuate to move the pressing plate 14 upward.
在壓抵板14對組裝電路板20施加壓力使檢測平台11的電路檢測接點113電性接觸組裝電路板20的測試接腳的期間,運算主機15執行料件檢測程式。所述的料件檢測程式至少執行包括習知在線測試儀所執行之測試項目,例如開路、短路、缺件及錯件等測試項目,以及Type C、電容及漏電流等特定測試項目。必須說明的是,由於壓抵板14在下移時可能對組裝電路板20產生放電效果,因而造成漏電流量測數據具有誤差,故本發明之運算主機15執行的料件檢測程式,其中包含一電壓修正運算以修正漏電流量測數據。While the pressing plate 14 applies pressure to the assembled circuit board 20 so that the circuit detecting contact 113 of the detecting platform 11 electrically contacts the test pin of the assembled circuit board 20, the computing host 15 executes the component detecting program. The component inspection program performs at least test items including conventional online testers, such as open circuit, short circuit, missing parts and wrong parts, and specific test items such as Type C, capacitance and leakage current. It should be noted that since the pressing plate 14 may discharge the assembly circuit board 20 when moving downward, and thus the leakage current measurement data has an error, the material detecting program executed by the computing host 15 of the present invention includes one. Voltage correction operation to correct leakage current measurement data.
攝像裝置13例如係高像素彩色攝像機,為執行自動光學檢測的必要元件。請參考圖2A,在本發明之一實施例中,將攝像裝置13架設於檢測平台11正上方,且攝像裝置13與檢測平台11之承載面111的距離足以讓攝像裝置13拍攝完整面積的組裝電路板20正面,並產生一待測影像傳送至運算主機15。雖然壓抵板14位於攝像裝置13與檢測平台11之間,但並不因此遮蔽攝像裝置13拍攝組裝電路板20正面,由於本發明之壓抵板14具有透光部141的設計,透光部141例如係中空孔洞或透明材質板件,且透光部141位置對應於攝像裝置13的入光側131,入光側131即攝像鏡頭,故在壓抵板14尚未下移的期間,攝像裝置13可經由透光部141拍攝到完整面積的組裝電路板20正面。The imaging device 13 is, for example, a high-pixel color camera, which is an essential component for performing automatic optical detection. Referring to FIG. 2A, in an embodiment of the present invention, the imaging device 13 is mounted directly above the detection platform 11, and the distance between the imaging device 13 and the bearing surface 111 of the detection platform 11 is sufficient for the imaging device 13 to capture a complete area of the assembly. The circuit board 20 is front side and generates a to-be-tested image for transmission to the computing host 15. Although the pressing plate 14 is located between the imaging device 13 and the detecting platform 11, the shielding device 13 is not shielded from the front surface of the assembled circuit board 20. Since the pressing plate 14 of the present invention has the design of the light transmitting portion 141, the light transmitting portion 141 is, for example, a hollow hole or a transparent material plate, and the position of the light transmitting portion 141 corresponds to the light incident side 131 of the image pickup device 13 and the light incident side 131, that is, the image pickup lens. Therefore, the image pickup device is not moved down after the pressure plate 14 has been moved. 13 The entire front surface of the assembled circuit board 20 can be photographed via the light transmitting portion 141.
在本發明之另一實施例中,組裝電路板檢測系統1更包括一輔助光源12,輔助光源12例如係可調整亮度之燈具,用以自輔助光源12之出光側121投射光線至組裝電路板20正面,以避免外界光線不足導致攝像裝置13拍攝組裝電路板20正面而產生的待測影像對比度過低,影響影像分析結果。值得注意的是,實務上,為避免外界光線影響導致組裝電路板20之照明度不均,可將輔助光源12調整至最亮等級,再以影像分析程式修正曝光度,以達到組裝電路板20整體受到光源照射的亮度統一的效果。請參考圖2A,在本實施例中,輔助光源12位於檢測平台11的左右兩側,但不以此為限,但凡可滿足自出光側121投射光線至承載面111此一條件的位置,皆可設置輔助光源12。In another embodiment of the present invention, the assembled circuit board detection system 1 further includes an auxiliary light source 12, such as a brightness-adjustable light fixture for projecting light from the light-emitting side 121 of the auxiliary light source 12 to the assembled circuit board. The front side of the 20 is to prevent the external light from being insufficient, and the contrast of the image to be tested caused by the camera device 13 to photograph the front side of the assembled circuit board 20 is too low, which affects the image analysis result. It is worth noting that, in practice, in order to avoid the uneven illumination of the assembled circuit board 20 caused by the influence of external light, the auxiliary light source 12 can be adjusted to the brightest level, and then the exposure degree is corrected by the image analysis program to reach the assembled circuit board 20. The overall brightness of the light source is uniform. Referring to FIG. 2A, in the embodiment, the auxiliary light source 12 is located on the left and right sides of the detecting platform 11, but not limited thereto, but the position that the light is projected from the light emitting side 121 to the bearing surface 111 can be satisfied. An auxiliary light source 12 can be provided.
運算主機15例如係一工業控制電腦,此工業控制電腦具多核CPU或單核CPU,本發明不以為限。運算主機15包括運行於運算主機15上之料件測試程式和分析待測影像的影像分析程式。料件測試程式在完成所有電路檢測項目後產生一料件測試訊號,指示料件測試結果為通過或錯誤。影像分析程式根據待測影像與一標準影像執行影像比對演算法,包括色彩比對、灰度直方圖、顏色直方圖及顏色篩選級別線性分析等,但不以此為限;影像分析程式在完成後產生一影像分析訊號,指示影像分析結果為通過或錯誤。實務上,料件測試程式與影像分析程式可各自分屬於不同CPU運行,或各自分屬於單一CPU的不同執行緒執行。The computing host 15 is, for example, an industrial control computer having a multi-core CPU or a single-core CPU, and the invention is not limited thereto. The computing host 15 includes a component test program running on the computing host 15 and an image analysis program for analyzing the image to be tested. The material test program generates a material test signal after completing all circuit test items, indicating that the material test result is pass or error. The image analysis program performs an image comparison algorithm based on the image to be tested and a standard image, including color comparison, gray histogram, color histogram, and color analysis level linear analysis, but is not limited thereto; the image analysis program is Upon completion, an image analysis signal is generated indicating that the image analysis result is a pass or an error. In practice, the component test program and the image analysis program can be operated by different CPUs or by different threads that belong to a single CPU.
請參考圖1,在本發明之另一實施例中,檢測平台11更包括板彎測試組件117。板彎測試組件117例如係一紅外線裝置,具有紅外線發射接收功能。板彎測試組件117凸設於置板區域1111外圍,可量測組裝電路板20一長邊、一短邊或一角落的板彎現象。板彎測試組件117發射光線之行進方向係與該組裝電路板20之待測平面平行,且板彎測試組件117發射光線之路徑貼近於組裝電路板20之待測平面。若組裝電路板20之待測平面有板彎現象,則板彎測試組件117發射之光線將被彎曲的組裝電路板20阻擋而循原路徑反射回來被同一板彎測試組件117接收。板彎測試組件117並因此產生一板彎測試錯誤訊號傳送至運算主機15。Referring to FIG. 1, in another embodiment of the present invention, the detection platform 11 further includes a plate bending test assembly 117. The plate bending test assembly 117 is, for example, an infrared device having an infrared radiation receiving function. The plate bending test assembly 117 is protruded from the periphery of the platen area 1111, and can measure the plate bending phenomenon of a long side, a short side or a corner of the assembled circuit board 20. The direction in which the plate bending test component 117 emits light is parallel to the plane to be measured of the assembled circuit board 20, and the path of the plate bending test component 117 emitting light is close to the plane to be tested of the assembled circuit board 20. If the plane to be tested of the assembled circuit board 20 has a plate bending phenomenon, the light emitted by the plate bending test assembly 117 will be blocked by the bent assembled circuit board 20 and reflected back by the original path and received by the same plate bending test assembly 117. The plate bend test assembly 117 and thus a plate bend test error signal is transmitted to the computing host 15.
請參考圖1,在本發明之另一實施例中,組裝電路板20檢測系統1更包括檢測光源115、顯示裝置151,掃描裝置171、資料傳輸裝置173及資料庫主機175。檢測光源115如先前敘述,設置於檢測平台11的置板區域1111內,影像分析程式藉由判斷待測影像中是否具有檢測光源115投射之光線訊號,進而加強組裝電路板檢測系統1對於小型元件缺件的檢測能力。顯示裝置151例如係螢幕、七段顯示器、或是可供辨識的燈號,本發明不以此為限。在本實施例中,顯示裝置151係以螢幕呈現組裝電路板20的檢測項目,其呈現方式係以文字或圖像顯示料件測試訊號及影像分析訊號所指示的狀態。實務上,操作員觀看顯示裝置151可得知組裝電路板20的多項測試項目結果,據此決定是否將目前檢測的組裝電路板20判定為不良品。掃描裝置171係如係槍型條碼讀碼器,用以讀取組裝電路板20上之一條碼標籤以取得對應於該組裝電路板20的一序號,並將序號傳送至運算主機15。資料傳輸裝置173例如係資料採集終端(Data Collection Terminal, DCT),用以將組裝電路板20之序號及運算主機15產生之料件檢測結果與影像分析結果通訊傳送至資料庫主機175。資料庫主機175例如係現場資訊整合系統(Shop Floor Integrated System, SFIS),用以儲存組裝電路板20的多種檢測資訊,資料庫主機175藉由收集檢測產線上大量的組裝電路板20檢測資訊,據以改善組裝電路板20的製造過程,提升後續製造組裝電路板20的測試良率。Referring to FIG. 1, in another embodiment of the present invention, the assembly circuit board 20 detection system 1 further includes a detection light source 115, a display device 151, a scanning device 171, a data transmission device 173, and a database host 175. The detecting light source 115 is disposed in the platen area 1111 of the detecting platform 11 as described above, and the image analyzing program enhances the assembled circuit board detecting system 1 for small components by determining whether the image to be tested has the light signal projected by the detecting light source 115. The ability to detect missing parts. The display device 151 is, for example, a screen, a seven-segment display, or an identifiable light. The invention is not limited thereto. In the present embodiment, the display device 151 presents the detection items of the assembled circuit board 20 by the screen, and the presentation manner is the state indicated by the text or image display material test signal and the image analysis signal. In practice, the operator views the display device 151 to know the results of the plurality of test items of the assembled circuit board 20, and accordingly determines whether or not the currently detected assembled circuit board 20 is determined to be defective. The scanning device 171 is a gun type barcode reader for reading a barcode label on the assembled circuit board 20 to obtain a serial number corresponding to the assembled circuit board 20, and transmitting the serial number to the computing host 15. The data transmission device 173 is, for example, a data collection terminal (DCT) for transmitting the serial number of the assembled circuit board 20 and the component detection result generated by the computing host 15 and the image analysis result to the database host 175. The database host 175 is, for example, a Shop Floor Integrated System (SFIS) for storing various detection information of the assembled circuit board 20. The database host 175 detects information by collecting a large number of assembled circuit boards 20 on the inspection line. According to the manufacturing process of the assembled circuit board 20, the test yield of the subsequent assembled circuit board 20 is improved.
請參考圖1,在本發明之另一實施例中,檢測平台11更包括置板感測器,用以感測置板區域1111是否有待測組裝電路板20,並產生一置板感測訊號通知運算主機15。壓抵板14亦包括壓抵狀態感測器,用以感測壓抵板14位置狀態(壓抵狀態或閒置狀態),並產生一壓抵板位置訊號通知運算主機15。而運算主機15係根據置板感測訊號及壓抵板位置訊號控制攝像裝置13、板彎測試組件117及壓抵板14等裝置的作動。上述的置板感測器及壓抵狀態感測器例如係光線感測器或接觸感測器,本發明不以為限。Referring to FIG. 1, in another embodiment of the present invention, the detecting platform 11 further includes a board sensor for sensing whether the board area 1111 has an assembled circuit board 20 to be tested, and generates a board sensing. The signal is notified to the computing host 15. The pressing plate 14 also includes a pressing state sensor for sensing the position of the pressing plate 14 (pressing state or idle state), and generating a pressing plate position signal to notify the computing host 15. The computing host 15 controls the operation of the imaging device 13, the plate bending test assembly 117, and the pressing plate 14 according to the plate sensing signal and the pressing plate position signal. The above-mentioned plate sensor and the pressing state sensor are, for example, a light sensor or a contact sensor, and the invention is not limited thereto.
請參考圖4,以下依據本發明之一實施例,敘述組裝電路板檢測方法實際執行的流程,所述的組裝電路板檢測方法係應用於前文所述之組裝電路板檢測系統1。如步驟S41所述,首先由操作員將一待測組裝電路板20放置於檢測平台11的置板區域1111。然後如步驟S43所述,運算主機15控制攝像裝置13拍攝組裝電路板20並產生一待測影像。Referring to FIG. 4, a flow of actual implementation of the assembled circuit board detecting method according to an embodiment of the present invention is described below. The assembled circuit board detecting method is applied to the assembled circuit board detecting system 1 described above. As described in step S41, an operator assembled circuit board 20 to be tested is first placed on the boarding area 1111 of the detecting platform 11. Then, as described in step S43, the computing host 15 controls the imaging device 13 to capture the assembled circuit board 20 and generate a to-be-tested image.
在另一實施例中,操作員首先使用掃描裝置171取得此待測組裝電路板20之一序號,且掃描裝置171將此序號傳送至運算主機15,在掃描裝置171以一聲音訊號或一視覺訊號通知操作員已取得組裝電路板20之序號後,操作員再將組裝電路板20放置於檢測平台11的置板區域1111。在檢測平台11的置板感測器確認組裝電路板20已正確放置後,位於檢測平台11的承載面111上的板彎測試組件117進行組裝電路板20的板彎量測並將結果傳送至運算主機15。另外,運算主機15亦於此時調整輔助光源12的亮度,並控制攝像裝置13拍攝組裝電路板20並產生一待測影像訊號,攝像裝置13將此待測影像傳送至運算主機15。In another embodiment, the operator first obtains a serial number of the assembled circuit board 20 to be tested using the scanning device 171, and the scanning device 171 transmits the serial number to the computing host 15, where the audio signal or a visual is detected by the scanning device 171. After the signal informs the operator that the serial number of the assembled circuit board 20 has been obtained, the operator places the assembled circuit board 20 on the boarding area 1111 of the detecting platform 11. After the plate sensor of the inspection platform 11 confirms that the assembled circuit board 20 has been correctly placed, the plate bending test assembly 117 on the bearing surface 111 of the detection platform 11 performs the plate bending measurement of the assembled circuit board 20 and transmits the result to The computing host 15 is operated. In addition, the computing host 15 also adjusts the brightness of the auxiliary light source 12 at this time, and controls the imaging device 13 to capture the assembled circuit board 20 and generate a signal to be tested. The imaging device 13 transmits the image to be tested to the computing host 15.
在本發明之一實施例中,在組裝電路板20拍攝影像(以及板彎量測皆完成後),如步驟S45所述,運算主機15產生可續行訊號。所述的可續行訊號例如以顯示裝置151以文字或圖像方式呈現,其目的在通知操作員以手動方式按壓按鈕使壓抵板14下壓,如步驟S47所述。在又一實施例中,運算主機15亦可設定一等待時間,在運算主機15產生可續行訊號後,由運算主機15自行控制壓抵板14下壓。所述的下壓將使置板區域1111內的電路檢測接點113電性接觸組裝電路板20背面的測試接腳且位於壓抵板14上方針床的探針電性接觸組裝電路板20正面的測試接腳,以便檢測平台11執行料件的電路檢測動作。In an embodiment of the present invention, after the assembled circuit board 20 captures an image (and after the plate bending measurement is completed), the computing host 15 generates a renewable signal as described in step S45. The continuation signal is presented, for example, in the form of a text or image by the display device 151, the purpose of which is to notify the operator to manually press the button to press the pressing plate 14, as described in step S47. In another embodiment, the computing host 15 can also set a waiting time. After the computing host 15 generates a renewable signal, the computing host 15 controls the pressing plate 14 to press down. The pressing will cause the circuit detecting contact 113 in the boarding area 1111 to electrically contact the test pin on the back side of the assembled circuit board 20 and on the front side of the pressing board 14 on the pressing board 14 to electrically contact the assembled circuit board 20 Test pins are provided to detect that the platform 11 performs circuit detection actions of the components.
在本發明之一實施例中,如步驟S47所述,當壓抵板14完成下移動作而靜止時,位於壓抵板14的壓抵狀態感測器通知運算主機15目前為壓抵狀態,而運算主機15則開始執行料件檢測及影像分析程式,如步驟S491及S493所述。料件檢測係控制檢測平台11對組裝電路板20進行多項DIP零件的電性測試項目,並據此產生一料件測試訊號,指示料件測試結果為通過或錯誤。影像分析程式係以步驟S43儲存於運算主機15的組裝電路板20待測影像為輸入資料執行多項圖像比對演算法,藉此可偵測出組裝電路板20的打件錯誤,例如缺件(Missing)、偏斜(Skew)或墓碑(Tombstone)等,並據此產生一影像分析訊號,指示影像分析結果為通過或錯誤。必須特別強調的是:本發明所述的運算主機15具備可同時執行步驟S491(料件檢測)及步驟S493(影像分析)的運算能力,是以可節省先後執行步驟S491及步驟S493的額外工時。而在另一實施例中,在執行料件檢測之前,運算主機15先執行漏電流量測,並將量測結果傳回運算主機15進行電壓修正運算以獲得正確的漏電流量測數據,所述的電壓修正運算例如係運算主機15以程式將高電壓轉換為低電壓,以減少組裝電路板檢測系統1中的元件對組裝電路板20進行放電而造成漏電流量測數據不精確的問題。在漏電流量測完成之後,運算主機15繼續進行料件檢測及影像分析程式。In an embodiment of the present invention, as described in step S47, when the pressing plate 14 completes the lower movement and is stationary, the pressing state sensor located on the pressing plate 14 notifies the computing host 15 that the operating host 15 is currently in a pressed state. The computing host 15 then executes the component inspection and image analysis programs as described in steps S491 and S493. The material inspection system controls the detection platform 11 to perform electrical test items on the assembled circuit board 20 for a plurality of DIP parts, and accordingly generates a material test signal indicating that the material test result is pass or error. The image analysis program performs a plurality of image comparison algorithms by using the image to be measured stored in the assembly board 20 of the computing host 15 as the input data in step S43, thereby detecting the error of the assembly circuit board 20, such as missing parts. (Missing), skew (Skew) or tombstone (Tombstone), etc., and accordingly generate an image analysis signal indicating that the image analysis result is a pass or an error. It should be particularly emphasized that the computing host 15 of the present invention has the computing capability of performing step S491 (material detection) and step S493 (image analysis) at the same time, so that the additional work of step S491 and step S493 can be saved. Time. In another embodiment, before performing the component inspection, the computing host 15 first performs the leakage current measurement, and returns the measurement result to the computing host 15 for voltage correction operation to obtain the correct leakage current measurement data. The voltage correction operation is performed, for example, by the computing host 15 to convert the high voltage to a low voltage to reduce the problem that the components in the assembled circuit board detecting system 1 discharge the assembled circuit board 20 and cause the leakage current measurement data to be inaccurate. After the leakage current measurement is completed, the computing host 15 continues the component inspection and image analysis routine.
實務上,在組裝電路板20之各個測試項目如板彎測試、漏電流檢測、料件檢測及影像分析程式各自完成時,其檢測結果將由顯示裝置151以文字或圖像方式呈現,其目的在於讓操作員得知組裝電路板20之各個檢測項目通過與否,據此判斷組裝電路板20是否為一良品。所述的各個測試結果及對應待測組裝電路板20之序號,亦將透過資料傳輸裝置173(例如係數據資料採集器),以無線通訊或有線通訊方式傳送至資料庫主機175(例如係現場資訊整合系統)儲存。在又一實施例中,運算主機15在接收掃描裝置171發送的組裝電路板20序號時,便將此序號透過資料傳輸裝置173以通訊方式傳送至資料庫主機175儲存;換句話說,本發明並不限制組裝電路板20序號與對應此序號之組裝電路板檢測結果的傳送時機。In practice, when each test item such as the plate bending test, the leakage current detection, the material detection, and the image analysis program of the assembled circuit board 20 is completed, the detection result will be presented by the display device 151 in text or image. Let the operator know whether the respective detection items of the assembled circuit board 20 pass or not, and judge whether or not the assembled circuit board 20 is a good one. The respective test results and the serial numbers corresponding to the assembled circuit board 20 to be tested are also transmitted to the database host 175 via a data transmission device 173 (for example, a data data collector) by wireless communication or wired communication (for example, on the site). Information integration system) storage. In another embodiment, when the computing host 15 receives the serial number of the assembled circuit board 20 sent by the scanning device 171, the serial number is transmitted to the database host 175 via the data transmission device 173 for storage; in other words, the present invention The timing of assembling the circuit board 20 and the transmission result of the assembled circuit board corresponding to the serial number is not limited.
綜合以上所述,本發明之組裝電路板檢測系統1及組裝電路板檢測方法,藉由可達成在線測試功能及自動光學檢測功能的硬體整合,並將在線測試及自動光學檢測各自執行的檢測軟體安裝於同一運算主機15,使得料件檢測與影像分析得以在同一測試時間區段執行,藉此達到減少總測試時間的功效,並且降低人為操作失誤的機率。In summary, the assembled circuit board detecting system 1 and the assembled circuit board detecting method of the present invention can achieve the hardware integration of the online test function and the automatic optical detecting function, and perform the detection performed by the online test and the automatic optical test. The software is installed on the same computing host 15, so that the component inspection and image analysis can be performed in the same test time zone, thereby achieving the effect of reducing the total test time and reducing the probability of human error.
雖然本發明以前述之實施例揭露如上,然其並非用以限定本發明。在不脫離本發明之精神和範圍內,所為之更動與潤飾,均屬本發明之專利保護範圍。關於本發明所界定之保護範圍請參考所附之申請專利範圍。Although the present invention has been disclosed above in the foregoing embodiments, it is not intended to limit the invention. It is within the scope of the invention to be modified and modified without departing from the spirit and scope of the invention. Please refer to the attached patent application for the scope of protection defined by the present invention.
1‧‧‧組裝電路板檢測系統1‧‧‧Assembled board inspection system
11‧‧‧檢測平台11‧‧‧Testing platform
111‧‧‧承載面111‧‧‧ bearing surface
1111‧‧‧置板區域1111‧‧‧Setting area
1113‧‧‧定位元件1113‧‧‧ Positioning components
113‧‧‧電路檢測接點113‧‧‧Circuit detection contacts
115‧‧‧檢測光源115‧‧‧Detection light source
117‧‧‧板彎測試組件117‧‧‧ plate bending test assembly
12‧‧‧輔助光源12‧‧‧Auxiliary light source
121‧‧‧出光側121‧‧‧Lighting side
13‧‧‧攝像裝置13‧‧‧ camera
131‧‧‧入光側131‧‧‧light side
14‧‧‧壓抵板14‧‧‧Pressing board
141‧‧‧透光部141‧‧‧Transmission Department
143‧‧‧伸縮桿件143‧‧‧ Telescopic rods
145‧‧‧動力來源145‧‧‧Power source
15‧‧‧運算主機15‧‧‧ computing host
151‧‧‧顯示裝置151‧‧‧Display device
171‧‧‧掃描裝置171‧‧‧ scanning device
173‧‧‧資料傳輸裝置173‧‧‧Data transmission device
175‧‧‧資料庫主機175‧‧‧Database Host
20‧‧‧組裝電路板20‧‧‧Assemble the board
S41~S493‧‧‧步驟S41~S493‧‧‧Steps
圖1係依據本發明一實施例所繪示的組裝電路板檢測系統功能方塊示意圖。 圖2A係依據本發明一實施例所繪示的組裝電路板檢測系統側視圖,其中壓抵板為閒置狀態。 圖2B係依據本發明一實施例所繪示的組裝電路板檢測系統側視圖,其中壓抵板為壓抵狀態。 圖3係依據本發明一實施例所繪示的檢測平台俯視圖。1 is a functional block diagram of an assembled circuit board detection system according to an embodiment of the invention. 2A is a side view of an assembled circuit board inspection system in accordance with an embodiment of the invention, wherein the pressure plate is in an idle state. 2B is a side view of the assembled circuit board detection system according to an embodiment of the invention, wherein the pressing plate is in a pressed state. 3 is a top plan view of a detection platform according to an embodiment of the invention.
Claims (14)
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