TW201840404A - Ground member, shielded printed circuit board, and method for manufacturing shielded printed circuit board - Google Patents

Abstract

An objective of the present invention is to provide a ground member which can be positioned as desired, and which, when using repeated heating and cooling to mount components onto a shielded printed circuit board using the ground member, is less susceptible to deviations occurring between conductive protrusions of the ground member and a shield layer of a shield film. This ground member comprises an external connection member which has a first main surface and a second main surface opposite to the first main surface, and which is conductive. The first main surface of the ground member has conductive protrusions, and the ground member is characterized in that a layer of a metal with a low melting point is formed on the surface of the conductive protrusions.

Description

接地構件、屏蔽印刷配線板及屏蔽印刷配線板之製造方法Grounding member, shielded printed wiring board and manufacturing method of shielded printed wiring board

本發明係關於接地構件、屏蔽印刷配線板及屏蔽印刷配線板之製造方法。The invention relates to a grounding member, a shielded printed wiring board and a method of manufacturing a shielded printed wiring board.

背景技術 在急速發展小型化、高機能化的行動電話、視訊攝影機、筆記型電腦等電子設備中，為了將電路裝入複雜的機構中，大多會使用撓性印刷配線板。再者，活用其優異之可撓性，亦會利用在像是印刷頭般的可動部與控制部之連接。於該等電子設備中，必須要有電磁波屏蔽措施，於裝置內所使用之撓性印刷配線板中，亦開始使用施以電磁波屏蔽措施的撓性印刷配線板(以下亦記載為「屏蔽印刷配線板」)。2. Description of the Related Art In electronic devices such as mobile phones, video cameras, and notebook computers that are rapidly becoming smaller and more functional, flexible printed wiring boards are often used in order to incorporate circuits into complicated mechanisms. In addition, the use of its excellent flexibility will also be used in the connection between the movable part and the control part like a print head. In such electronic equipment, electromagnetic wave shielding measures are necessary, and the flexible printed wiring boards used for electromagnetic wave shielding measures are also used in the flexible printed wiring boards used in the device (hereinafter also referred to as "shielded printed wiring board").

一般的屏蔽印刷配線板通常由基體薄膜及屏蔽薄膜構成，該基體薄膜係於基底薄膜上依序設置印刷電路與絕緣薄膜而成，該屏蔽薄膜則由接著劑層、積層於上述接著劑層之屏蔽層及積層於上述接著劑層之絕緣層構成，並以上述接著劑層與上述基體薄膜相接之方式被覆上述基體薄膜。 於印刷電路中包含有接地電路，接地電路為能接地而與電子設備的殼體電性連接。 如上所述，屏蔽印刷配線板之基體薄膜於包含接地電路的印刷電路上設置有絕緣薄膜。又，基體薄膜被具有絕緣層的屏蔽薄膜所被覆。 故，為了將接地電路與電子設備的殼體電性連接，必須於絕緣薄膜及屏蔽薄膜的一部分預先開孔。 這在設計印刷電路上會成為妨礙自由度的主要原因。The general shielded printed wiring board is usually composed of a base film and a shielding film. The base film is formed by sequentially placing a printed circuit and an insulating film on the base film. The shielding film is composed of an adhesive layer and a layer laminated on the adhesive layer. The shielding layer and the insulating layer laminated on the adhesive layer are formed, and the base film is covered so that the adhesive layer is in contact with the base film. The printed circuit includes a grounding circuit. The grounding circuit is electrically connected to the casing of the electronic device for grounding. As described above, the base film of the shielded printed wiring board is provided with an insulating film on the printed circuit including the ground circuit. In addition, the base film is covered with a shielding film having an insulating layer. Therefore, in order to electrically connect the ground circuit to the casing of the electronic device, it is necessary to pre-open a part of the insulating film and the shielding film. This will become a major obstacle to freedom in designing printed circuits.

於專利文獻1中揭示有一種屏蔽薄膜，其於分離薄膜的單面塗佈形成被覆薄膜，且於前述被覆薄膜表面設置由金屬薄膜層與接著劑層構成的屏蔽層，並且該屏蔽薄膜具有接地構件，該接地構件於一端側具有突起，該突起壓抵於前述被覆薄膜並穿過該被覆薄膜而與前述屏蔽層連接，該接地構件的另一端側則露出、形成為可與其附近的接地部連接。 在製作專利文獻1記載的屏蔽薄膜時，係以接地構件之突起穿過被覆薄膜的方式使接地構件壓抵於被覆薄膜。因此，接地構件可配置於屏蔽薄膜的任意位置。 若使用此種屏蔽薄膜來製造屏蔽印刷配線板，可於任意位置將接地電路與電子設備的殼體電性連接。Patent Document 1 discloses a shielding film which is coated on one side of a separation film to form a coating film, and a shielding layer composed of a metal thin film layer and an adhesive layer is provided on the surface of the coating film, and the shielding film has a ground The grounding member has a protrusion on one end side, the protrusion is pressed against the coating film and passes through the coating film to be connected to the shielding layer, and the other end side of the grounding member is exposed to form a grounding portion near it connection. When manufacturing the shielding film described in Patent Document 1, the grounding member is pressed against the coating film such that the protrusion of the grounding member passes through the coating film. Therefore, the grounding member can be arranged at any position of the shielding film. If such a shielding film is used to manufacture a shielded printed wiring board, the grounding circuit can be electrically connected to the casing of the electronic device at any position.

先行技術文獻 專利文獻 專利文獻1：日本專利第4201548號公報Advanced technical literature Patent literature Patent literature 1: Japanese Patent No. 4201548

發明概要 發明欲解決之課題 屏蔽印刷配線板為了安裝零件，於焊料回焊步驟等中會被反覆進行加熱、冷卻。 當安裝零件至專利文獻1記載之屏蔽印刷配線板時，若如此反覆進行加熱及冷卻，會有因熱膨脹、熱收縮所造成的體積變化而使接地構件的突起與屏蔽層的連接受損，從而發生電阻值上升的現象。SUMMARY OF THE INVENTION PROBLEMS TO BE SOLVED BY THE INVENTION The shielded printed wiring board is repeatedly heated and cooled in the solder reflow step and the like in order to mount components. When mounting components to the shielded printed wiring board described in Patent Document 1, repeated heating and cooling in this manner may cause volume changes due to thermal expansion and thermal shrinkage, which may damage the connection between the protrusion of the grounding member and the shielding layer, thereby The phenomenon that the resistance value rises.

本發明係用以解決上述問題而完成的發明，本發明之目的在於提供一種接地構件，其可配置於任意位置，且對使用該接地構件之屏蔽印刷配線板反覆進行加熱及冷卻以安裝零件時，於接地構件之導電性突起與屏蔽薄膜之屏蔽層間不易發生偏移。The present invention is made to solve the above problems. The object of the present invention is to provide a grounding member which can be arranged at any position, and when the shielded printed wiring board using the grounding member is repeatedly heated and cooled to install parts It is not easy to shift between the conductive protrusion of the grounding member and the shielding layer of the shielding film.

用以解決課題之方法 即，本發明之接地構件之特徵在於：其係由具有導電性的外部連接構件構成，該外部連接構件具有第1主面與位於上述第1主面相反側之第2主面，並於上述第1主面具有導電性突起，於上述導電性突起表面形成有低熔點金屬層。The method for solving the problem, that is, the grounding member of the present invention is characterized in that it is composed of a conductive external connecting member having a first main surface and a second side located on the opposite side of the first main surface The main surface has conductive protrusions on the first main surface, and a low melting point metal layer is formed on the surface of the conductive protrusions.

本發明之接地構件係使用在由基體薄膜與屏蔽薄膜構成的屏蔽印刷配線板。 首先，就屏蔽印刷配線板之構造進行說明。 於屏蔽印刷配線板中，基體薄膜係於基底薄膜上依序設置包含接地電路之印刷電路與絕緣薄膜而形成的薄膜。 又，屏蔽薄膜係由屏蔽層及積層於屏蔽層之絕緣層所構成的薄膜。 然後，於屏蔽印刷配線板中，屏蔽薄膜係以屏蔽薄膜之屏蔽層配置於較絕緣層更靠基體薄膜側之方式被覆基體薄膜。 本發明之接地構件係以本發明接地構件之導電性突起貫穿屏蔽薄膜之絕緣層的方式，壓抵於屏蔽印刷配線板而配置。 又，如此於屏蔽印刷配線板配置本發明接地構件時，不需要於屏蔽印刷配線板的屏蔽薄膜之絕緣層預先設孔等，可於任意位置配置本發明接地構件。The grounding member of the present invention is used in a shielded printed wiring board composed of a base film and a shielding film. First, the structure of the shielded printed wiring board will be described. In the shielded printed wiring board, the base film is a film formed by sequentially setting a printed circuit including an earth circuit and an insulating film on the base film. The shielding film is a film composed of a shielding layer and an insulating layer laminated on the shielding layer. Then, in the shielded printed wiring board, the shielding film covers the base film such that the shielding layer of the shielding film is disposed closer to the base film side than the insulating layer. The grounding member of the present invention is arranged such that the conductive protrusion of the grounding member of the present invention penetrates the insulating layer of the shielding film and is pressed against the shielded printed wiring board. In addition, when the grounding member of the present invention is disposed on the shielded printed wiring board in this manner, it is not necessary to provide holes or the like in advance in the insulating layer of the shielding film of the shielded printed wiring board, and the grounding member of the present invention can be disposed at any position.

又，本發明之接地構件中，於導電性突起的表面形成有低熔點金屬層。 將本發明的接地構件配置於屏蔽印刷配線板時、或於配置後在屏蔽印刷配線板安裝零件的零件安裝步驟中亦可進行加熱。藉由該加熱，低熔點金屬層會軟化，可使接地構件之導電性突起與屏蔽薄膜之屏蔽層的密接性提高。 因此，縱使是對使用本發明接地構件之屏蔽印刷配線板反覆進行加熱及冷卻以安裝零件的情況，於接地構件之導電性突起與屏蔽薄膜之屏蔽層間仍不易發生偏移。In addition, in the grounding member of the present invention, a low-melting-point metal layer is formed on the surface of the conductive protrusion. When the grounding member of the present invention is placed on the shielded printed wiring board or after the placement, it may be heated in the component mounting step of the shielded printed wiring board mounting component. By this heating, the low melting point metal layer is softened, and the adhesion between the conductive protrusion of the ground member and the shield layer of the shield film can be improved. Therefore, even if the shielded printed wiring board using the grounding member of the present invention is repeatedly heated and cooled to mount parts, the conductive protrusions of the grounding member and the shielding layer of the shielding film are unlikely to shift.

於本發明之接地構件中，上述低熔點金屬層宜由熔點300℃以下的金屬形成。 若低熔點金屬層由熔點300℃以下的金屬形成，將接地構件配置於屏蔽印刷配線板時，低熔點金屬層容易軟化，可使接地構件之導電性突起與屏蔽薄膜之屏蔽層的密接性良好地提高。 若低熔點金屬層由熔點超過300℃的金屬形成，則在將接地構件配置於屏蔽印刷配線板時的加熱溫度會變高。因此，接地構件或屏蔽印刷配線板容易因為熱而受到損傷。In the grounding member of the present invention, the low-melting-point metal layer is preferably formed of a metal having a melting point of 300 ° C or lower. If the low-melting-point metal layer is formed of a metal with a melting point of 300 ° C or less, when the grounding member is placed on the shielded printed wiring board, the low-melting-point metal layer is easily softened, and the adhesion between the conductive protrusion of the grounding member and the shielding layer of the shielding film is good To improve. If the low-melting-point metal layer is formed of a metal having a melting point exceeding 300 ° C, the heating temperature when the grounding member is placed on the shielded printed wiring board becomes high. Therefore, the ground member or the shielded printed wiring board is easily damaged by heat.

於本發明之接地構件中，上述低熔點金屬層之厚度宜為0.1~50μm。 若低熔點金屬層之厚度未達0.1μm，因為構成低熔點金屬層之金屬量較少，故將接地構件配置於屏蔽印刷配線板時，接地構件之導電性突起與屏蔽薄膜之屏蔽層的密接性會變得不易提高。 若低熔點金屬層之厚度超過50μm，則由於低熔點金屬層較厚，故接地構件的導電性突起變粗。因此，將接地構件配置於屏蔽印刷配線板時變得不易貫穿屏蔽薄膜之絕緣層。In the grounding member of the present invention, the thickness of the low melting point metal layer is preferably 0.1-50 μm. If the thickness of the low-melting-point metal layer is less than 0.1 μm, because the amount of metal constituting the low-melting-point metal layer is small, when the grounding member is arranged on the shielded printed wiring board, the conductive protrusion of the grounding member is in close contact with the shielding layer of the shielding film Sex will become difficult to improve. If the thickness of the low-melting-point metal layer exceeds 50 μm, the low-melting-point metal layer is thick, so that the conductive protrusion of the ground member becomes thick. Therefore, when the ground member is placed on the shield printed wiring board, it becomes difficult to penetrate the insulating layer of the shield film.

於本發明之接地構件中，上述低熔點金屬層宜包含助焊劑。 藉由低熔點金屬層包含助焊劑，當構成低熔點金屬層之金屬軟化時，構成低熔點金屬層之金屬與接地構件之導電性突起以及屏蔽薄膜之屏蔽層可變得容易密接。 其結果，可使接地構件之導電性突起與屏蔽薄膜之屏蔽層的密接性更為提高。In the grounding member of the present invention, the low melting point metal layer preferably contains flux. Since the low-melting-point metal layer contains flux, when the metal constituting the low-melting-point metal layer is softened, the metal constituting the low-melting-point metal layer and the conductive protrusion of the ground member and the shielding layer of the shielding film can become easily adhered. As a result, the adhesion between the conductive protrusion of the ground member and the shielding layer of the shielding film can be further improved.

於本發明之接地構件中，上述外部連接構件宜包含選自於由銅、鋁、銀、金、鎳、鉻、鈦、鋅及不鏽鋼所構成群組中之至少一種。 此等材料為適合用於將接地構件與外部接地電性連接的材料。In the grounding member of the present invention, the external connection member preferably includes at least one selected from the group consisting of copper, aluminum, silver, gold, nickel, chromium, titanium, zinc, and stainless steel. These materials are suitable for electrically connecting the grounding member to the external ground.

於本發明之接地構件中，上述第2主面宜形成有耐腐蝕層。 若於接地構件之第2主面形成有耐腐蝕層，可防止接地構件腐蝕。In the grounding member of the present invention, the second main surface is preferably formed with a corrosion-resistant layer. If a corrosion-resistant layer is formed on the second main surface of the grounding member, corrosion of the grounding member can be prevented.

於本發明之接地構件中，上述耐腐蝕層宜包含選自於由鎳、金、銀、鉑、鈀、銠、銥、釕、鋨及此等合金所構成群組中之至少一種。 此等材料不易腐蝕。因此，此等材料為適用於本發明接地構件之耐腐蝕層的材料。In the grounding member of the present invention, the corrosion-resistant layer preferably includes at least one selected from the group consisting of nickel, gold, silver, platinum, palladium, rhodium, iridium, ruthenium, osmium, and these alloys. These materials are not easily corroded. Therefore, these materials are suitable for the corrosion-resistant layer of the grounding member of the present invention.

於本發明之接地構件中，上述導電性突起亦可為柱狀。 若導電性突起為柱狀，則將接地構件壓抵於屏蔽薄膜之絕緣層時變得容易貫穿絕緣層。In the grounding member of the present invention, the conductive protrusion may be columnar. If the conductive protrusion is columnar, it becomes easier to penetrate the insulating layer when the ground member is pressed against the insulating layer of the shielding film.

於本發明之接地構件中，上述導電性突起之底面面積宜為1.0~1.0×10⁶ μm² 。 若導電性突起之底面面積未達1.0μm² ，導電性突起之強度變弱，導電性突起變得容易折斷。若導電性突起折斷，則導電性突起與外部連接構件之電性連接會切斷。而且，在技術上難以形成如此細的導電性突起。 若導電性突起之底面面積超過1.0×10⁶ μm² ，因為導電性突起過粗，故將接地構件配置於屏蔽印刷配線板時，變得不易貫穿屏蔽薄膜之絕緣層。In the grounding member of the present invention, the area of the bottom surface of the conductive protrusion is preferably 1.0 to 1.0 × 10 ⁶ μm ² . If the area of the bottom surface of the conductive protrusion is less than 1.0 μm ² , the strength of the conductive protrusion becomes weak, and the conductive protrusion becomes easily broken. If the conductive protrusion is broken, the electrical connection between the conductive protrusion and the external connection member is cut. Moreover, it is technically difficult to form such fine conductive protrusions. If the area of the bottom surface of the conductive protrusion exceeds 1.0 × 10 ⁶ μm ² , because the conductive protrusion is too thick, it becomes difficult to penetrate the insulating layer of the shield film when the ground member is placed on the shield printed wiring board.

於本發明之接地構件中，上述導電性突起彼此的間距宜為1~1000μm。 導電性突起彼此的間距未達1μm的接地構件，技術上難以製作。 若導電性突起彼此的間距超過1000μm，則導電性突起密度變低，導電性突起與屏蔽薄膜之屏蔽層的總接觸面積變小。因此，導電性突起與屏蔽薄膜之屏蔽層的密接性容易降低。In the grounding member of the present invention, the distance between the conductive protrusions is preferably 1 to 1000 μm. It is technically difficult to produce a ground member having a distance between conductive protrusions of less than 1 μm. If the distance between the conductive protrusions exceeds 1000 μm, the density of the conductive protrusions becomes low, and the total contact area between the conductive protrusions and the shielding layer of the shielding film becomes small. Therefore, the adhesion between the conductive protrusion and the shielding layer of the shielding film is likely to decrease.

於本發明之接地構件中，上述外部連接構件可以上述第1主面側突出之方式彎曲，突出的上述外部連接構件的一部分可成為上述導電性突起。 此種形狀的接地構件，只要將外部連接構件彎折即可輕易地製作。In the grounding member of the present invention, the external connecting member may be bent so that the first main surface side protrudes, and a part of the protruding external connecting member may become the conductive protrusion. The grounding member of this shape can be easily manufactured by bending the external connection member.

本發明之屏蔽印刷配線板之特徵在於：其具備基體薄膜、屏蔽薄膜及接地構件，該基體薄膜係於基底薄膜上依序設置包含接地電路之印刷電路及絕緣薄膜而成，該屏蔽薄膜係由屏蔽層及積層於上述屏蔽層之絕緣層構成，並且以上述屏蔽層配置於較上述絕緣層更靠上述基體薄膜側之方式被覆上述基體薄膜，該接地構件配置於上述屏蔽薄膜之絕緣層上；其中，上述接地構件由外部連接構件及導電性突起構成，該外部連接構件具有第1主面與位於上述第1主面相反側之第2主面，且具有導電性，該導電性突起配置於上述第1主面側，於上述導電性突起表面形成有低熔點金屬層；並且，上述接地構件之導電性突起貫穿上述屏蔽薄膜之絕緣層，上述接地構件之低熔點金屬層係連接於上述屏蔽薄膜之屏蔽層，上述接地構件之外部連接構件可與外部接地電性連接。The shielded printed wiring board of the present invention is characterized in that it is provided with a base film, a shielding film and a grounding member. The base film is formed by sequentially placing a printed circuit including a grounding circuit and an insulating film on the base film. The shielding film is made of A shielding layer and an insulating layer laminated on the shielding layer, and covering the base film such that the shielding layer is disposed closer to the base film side than the insulating layer, and the grounding member is disposed on the insulating layer of the shielding film; Wherein, the grounding member is composed of an external connecting member and a conductive protrusion, the external connecting member has a first main surface and a second main surface located on the opposite side of the first main surface, and has conductivity, and the conductive protrusion is arranged at On the first main surface side, a low melting point metal layer is formed on the surface of the conductive protrusion; and the conductive protrusion of the ground member penetrates the insulating layer of the shielding film, and the low melting point metal layer of the ground member is connected to the shield The shielding layer of the film, the external connection member of the grounding member can be electrically connected to the external ground.

於本發明之屏蔽印刷配線板中使用接地構件，亦即使用本發明之接地構件，該接地構件係由外部連接構件及導電性突起構成，該外部連接構件具有第1主面與位於上述第1主面相反側之第2主面且具有導電性，該導電性突起配置於上述第1主面側且於上述導電性突起表面形成有低熔點金屬層。因此，縱使是對本發明之屏蔽印刷配線板反覆進行加熱及冷卻而安裝零件的情況，於接地構件之導電性突起與屏蔽薄膜之屏蔽層間亦不易發生偏移。A ground member is used in the shielded printed wiring board of the present invention, that is, the ground member of the present invention is used. The ground member is composed of an external connecting member and a conductive protrusion, the external connecting member has a first main surface and is located on the first The second main surface opposite to the main surface has conductivity, and the conductive protrusion is disposed on the first main surface side and a low melting point metal layer is formed on the surface of the conductive protrusion. Therefore, even if the shield printed wiring board of the present invention is repeatedly heated and cooled to mount components, the conductive protrusions of the ground member and the shielding layer of the shielding film are unlikely to shift.

於本發明之屏蔽印刷配線板中，上述屏蔽薄膜宜由接著劑層、積層於上述接著劑層之上述屏蔽層及積層於上述屏蔽層之上述絕緣層構成，且上述屏蔽薄膜之接著劑層係與上述基體薄膜接觸。 若屏蔽薄膜具有接著劑層，則於製造屏蔽印刷配線板時可使屏蔽薄膜容易接著於基體薄膜。In the shielded printed wiring board of the present invention, the shielding film is preferably composed of an adhesive layer, the shielding layer stacked on the adhesive layer, and the insulating layer stacked on the shielding layer, and the adhesive layer of the shielding film is Contact with the above-mentioned base film. If the shielding film has an adhesive layer, the shielding film can be easily adhered to the base film when manufacturing the shielded printed wiring board.

於本發明之屏蔽印刷配線板中，上述屏蔽薄膜之接著劑層宜為導電性接著劑層。 若屏蔽薄膜之接著劑層為導電性接著劑層，藉由接地構件之導電性突起貫通屏蔽薄膜之絕緣層，接地構件之導電性突起與導電性接著劑層即接觸，而可將接地構件之外部連接構件與基體薄膜之接地電路電性連接。In the shielded printed wiring board of the present invention, the adhesive layer of the shielding film is preferably a conductive adhesive layer. If the adhesive layer of the shielding film is a conductive adhesive layer, the conductive protrusion of the grounding member penetrates through the insulating layer of the shielding film, the conductive protrusion of the grounding member and the conductive adhesive layer contact, and the grounding member can The external connection member is electrically connected to the ground circuit of the base film.

於本發明之屏蔽印刷配線板中，上述屏蔽薄膜之屏蔽層宜由金屬構成。 金屬作為屏蔽電磁波之屏蔽層可良好地發揮功能。In the shielded printed wiring board of the present invention, the shielding layer of the shielding film is preferably made of metal. Metal can function well as a shielding layer for shielding electromagnetic waves.

於本發明之屏蔽印刷配線板中，以上述屏蔽薄膜而言，於上述接著劑層與上述屏蔽層之間、及/或於上述屏蔽層與上述絕緣層之間宜形成有屏蔽薄膜之低熔點金屬層，且上述屏蔽薄膜之低熔點金屬層宜與上述接地構件之導電性突起連接。 若為如此構造，可使接地構件之導電性突起與屏蔽薄膜之屏蔽層的密接性、或接地構件之導電性突起與屏蔽薄膜之接著劑層的密接性提高。In the shielded printed wiring board of the present invention, for the shielding film, a low melting point of the shielding film is preferably formed between the adhesive layer and the shielding layer, and / or between the shielding layer and the insulating layer Metal layer, and the low melting point metal layer of the shielding film is preferably connected to the conductive protrusion of the grounding member. With such a structure, the adhesion between the conductive protrusion of the ground member and the shielding layer of the shielding film or the adhesion of the conductive protrusion of the grounding member and the adhesive layer of the shielding film can be improved.

於本發明之屏蔽印刷配線板中，上述屏蔽薄膜之屏蔽層可為導電性接著劑層，上述導電性接著劑層可與上述基體薄膜接觸。 在屏蔽層為導電性接著劑層之情況，屏蔽層會兼具用以將屏蔽薄膜接著於基體薄膜之功能、及用以屏蔽電磁波之兩功能。In the shielded printed wiring board of the present invention, the shielding layer of the shielding film may be a conductive adhesive layer, and the conductive adhesive layer may be in contact with the base film. When the shielding layer is a conductive adhesive layer, the shielding layer will have both the function of bonding the shielding film to the base film and the function of shielding electromagnetic waves.

於本發明之屏蔽印刷配線板中，於上述屏蔽層與上述絕緣層之間宜形成有屏蔽薄膜之低熔點金屬層，且上述屏蔽薄膜之低熔點金屬層宜與上述接地構件之導電性突起連接。 若為如此構造，可使接地構件之導電性突起與屏蔽薄膜之屏蔽層的密接性提高。In the shielded printed wiring board of the present invention, a low-melting-point metal layer of a shielding film is preferably formed between the shielding layer and the insulating layer, and the low-melting-point metal layer of the shielding film is preferably connected to the conductive protrusion of the grounding member . With such a structure, the adhesion between the conductive protrusion of the ground member and the shielding layer of the shielding film can be improved.

本發明之屏蔽印刷配線板之製造方法的特徵在於：前述屏蔽印刷配線板具備基體薄膜、屏蔽薄膜及上述本發明之接地構件，該基體薄膜係於基底薄膜上依序設置包含接地電路之印刷電路及絕緣薄膜而成，該屏蔽薄膜具有屏蔽層及積層於上述屏蔽層之絕緣層，該本發明之接地構件配置於上述屏蔽薄膜之絕緣層上；上述屏蔽印刷配線板之製造方法具有以下步驟：屏蔽薄膜載置步驟，係以上述屏蔽薄膜之屏蔽層配置於較上述屏蔽薄膜之絕緣層更靠上述基體薄膜側之方式，將上述屏蔽薄膜載置於上述基體薄膜；接地構件配置步驟，係以上述接地構件之導電性突起朝向上述屏蔽薄膜之絕緣層側之方式，將上述接地構件配置於前述屏蔽薄膜；加壓步驟，係加壓上述接地構件，以使上述接地構件之導電性突起貫通上述屏蔽薄膜之絕緣層；及加熱步驟，係加熱上述接地構件之低熔點金屬層使之軟化，以使上述接地構件之低熔點金屬層連接於上述屏蔽薄膜之屏蔽層。The method for manufacturing a shielded printed wiring board of the present invention is characterized in that the shielded printed wiring board includes a base film, a shielding film, and the above grounding member of the present invention, and the base film is provided on the base film in sequence with a printed circuit including a ground circuit And the insulating film, the shielding film has a shielding layer and an insulating layer laminated on the shielding layer, the grounding member of the present invention is disposed on the insulating layer of the shielding film; the manufacturing method of the shielding printed wiring board has the following steps: The step of placing the shielding film is to place the shielding film on the base film in such a manner that the shielding layer of the shielding film is arranged closer to the base film side than the insulating layer of the shielding film; The ground member is disposed on the shielding film with the conductive protrusions facing the insulating layer side of the shielding film; the pressing step presses the grounding member so that the conductive protrusions of the grounding member pass through the The insulating layer of the shielding film; and the heating step is to heat the above Member of the low melting point metal layer is softened, so that the low melting point metal layer of the ground member is connected to the shield layer of the mask film.

藉由使用上述本發明之接地構件，可製造本發明之屏蔽印刷配線板。By using the above grounding member of the present invention, the shielded printed wiring board of the present invention can be manufactured.

於本發明之屏蔽印刷配線板之製造方法中，亦可同時進行上述加壓步驟及上述加熱步驟。 藉由同時進行該等步驟，可使製造效率提高。In the method for manufacturing a shielded printed wiring board of the present invention, the above-mentioned pressing step and the above-mentioned heating step may be simultaneously performed. By performing these steps simultaneously, the manufacturing efficiency can be improved.

於本發明之屏蔽印刷配線板之製造方法中，上述屏蔽薄膜宜由接著劑層、積層於上述接著劑層之上述屏蔽層及積層於上述屏蔽層之上述絕緣層構成。 若屏蔽薄膜具有接著劑層，則於屏蔽薄膜載置步驟中可使屏蔽薄膜容易接著於基體薄膜。In the method for manufacturing a shielded printed wiring board of the present invention, the shielding film is preferably composed of an adhesive layer, the shielding layer stacked on the adhesive layer, and the insulating layer stacked on the shielding layer. If the shielding film has an adhesive layer, the shielding film can be easily adhered to the base film in the shielding film placing step.

於本發明之屏蔽印刷配線板之製造方法中，上述屏蔽薄膜之接著劑層宜為導電性接著劑層。 若屏蔽薄膜之接著劑層為導電性接著劑層，藉由使接地構件之導電性突起貫通屏蔽薄膜之絕緣層，可使接地構件之導電性突起與導電性接著劑層接觸，而可將接地構件之外部連接構件與基體薄膜之接地電路電性連接。In the method for manufacturing a shielded printed wiring board of the present invention, the adhesive layer of the shielding film is preferably a conductive adhesive layer. If the adhesive layer of the shielding film is a conductive adhesive layer, by allowing the conductive protrusions of the grounding member to pass through the insulating layer of the shielding film, the conductive protrusions of the grounding member can be brought into contact with the conductive adhesive layer to ground The external connection member of the member is electrically connected to the ground circuit of the base film.

於本發明之屏蔽印刷配線板之製造方法中，上述屏蔽薄膜之屏蔽層宜由金屬構成。 金屬作為屏蔽電磁波之屏蔽層可良好地發揮功能。In the method for manufacturing a shielded printed wiring board of the present invention, the shielding layer of the shielding film is preferably made of metal. Metal can function well as a shielding layer for shielding electromagnetic waves.

於本發明之屏蔽印刷配線板之製造方法中，上述屏蔽薄膜中，於上述接著劑層與上述屏蔽層之間、及/或上述屏蔽層與上述絕緣層之間宜形成有屏蔽薄膜之低熔點金屬層，於上述加熱步驟中宜使上述屏蔽薄膜之低熔點金屬層軟化而與上述接地構件之導電性突起連接。 藉此，可使接地構件之導電性突起與屏蔽薄膜之屏蔽層的密接性、或接地構件之導電性突起與屏蔽薄膜之接著劑層的密接性提高。In the method for manufacturing a shielded printed wiring board of the present invention, in the shielding film, a low melting point of the shielding film is preferably formed between the adhesive layer and the shielding layer, and / or between the shielding layer and the insulating layer The metal layer preferably softens the low-melting-point metal layer of the shielding film in the heating step and connects to the conductive protrusion of the ground member. Thereby, the adhesion between the conductive protrusion of the ground member and the shielding layer of the shielding film or the adhesion of the conductive protrusion of the grounding member and the adhesive layer of the shielding film can be improved.

於本發明之屏蔽印刷配線板之製造方法中，上述屏蔽薄膜之屏蔽層宜為導電性接著劑層。 若屏蔽層為導電性接著劑層，屏蔽層會兼具用以將屏蔽薄膜接著於基體薄膜的功能、及用以屏蔽電磁波的功能。In the method for manufacturing a shielded printed wiring board of the present invention, the shielding layer of the shielding film is preferably a conductive adhesive layer. If the shielding layer is a conductive adhesive layer, the shielding layer will have both the function of attaching the shielding film to the base film and the function of shielding electromagnetic waves.

於本發明之屏蔽印刷配線板之製造方法中，上述屏蔽薄膜中宜於上述屏蔽層與上述絕緣層之間形成有屏蔽薄膜之低熔點金屬層，於上述加熱步驟中宜使上述屏蔽薄膜之低熔點金屬層軟化而與上述接地構件之導電性突起連接。 藉此，可使接地構件之導電性突起與屏蔽薄膜之屏蔽層的密接性提高。In the method for manufacturing a shielded printed wiring board of the present invention, in the shielding film, a low-melting-point metal layer having a shielding film is preferably formed between the shielding layer and the insulating layer, and the shielding film is preferably made low in the heating step The melting point metal layer softens and is connected to the conductive protrusion of the ground member. Thereby, the adhesion between the conductive protrusion of the ground member and the shielding layer of the shielding film can be improved.

發明效果 將本發明接地構件配置於屏蔽印刷配線板時，不需要於屏蔽印刷配線板的屏蔽薄膜之絕緣層預先設孔等，可於任意位置配置本發明接地構件。 又，在對使用本發明接地構件之屏蔽印刷配線板反覆進行加熱及冷卻以安裝零件時，可防止於接地構件之導電性突起與屏蔽薄膜之屏蔽層或接著劑層間發生偏移。Effect of the Invention When the grounding member of the present invention is arranged on a shielded printed wiring board, it is not necessary to provide holes or the like in advance to the insulating layer of the shielding film of the shielded printed wiring board, and the grounding member of the present invention can be arranged at any position. In addition, when the shielded printed wiring board using the grounding member of the present invention is repeatedly heated and cooled to mount parts, it is possible to prevent deviation between the conductive protrusion of the grounding member and the shielding layer or adhesive layer of the shielding film.

用以實施發明之形態 以下就本發明之接地構件具體地進行說明。惟，本發明不限定於以下實施形態，可於不變更本發明主旨之範圍內適當地變更後進行應用。Forms for Carrying Out the Invention The grounding member of the present invention will be specifically described below. However, the present invention is not limited to the following embodiments, and can be applied after being appropriately changed without changing the gist of the present invention.

(第一實施形態) 首先，就本發明第一實施形態之接地構件進行說明。 圖1係示意性顯示本發明接地構件之一例的截面圖。 如圖1所示，接地構件1具備且具有導電性之外部連接構件10，該外部連接構件10具有第1主面11及位於第1主面11相反側之第2主面12。 又，於第1主面11形成有導電性突起20。 進而，於導電性突起20表面形成有低熔點金屬層21。(First Embodiment) First, the grounding member of the first embodiment of the present invention will be described. FIG. 1 is a cross-sectional view schematically showing an example of the grounding member of the present invention. As shown in FIG. 1, the ground member 1 includes a conductive external connection member 10 having a first main surface 11 and a second main surface 12 located on the opposite side of the first main surface 11. In addition, a conductive protrusion 20 is formed on the first main surface 11. Furthermore, a low-melting-point metal layer 21 is formed on the surface of the conductive protrusion 20.

接地構件1係使用在由基體薄膜與屏蔽薄膜構成的屏蔽印刷配線板。The grounding member 1 is used for a shield printed wiring board composed of a base film and a shield film.

以下，使用圖式就屏蔽印刷配線板之構造進行說明。 圖2係示意性顯示使用本發明接地構件之屏蔽印刷配線板之一例的截面圖。Hereinafter, the structure of the shielded printed wiring board will be described using drawings. 2 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the grounding member of the present invention.

如圖2所示，屏蔽印刷配線板50由基體薄膜60與屏蔽薄膜70構成。 於屏蔽印刷配線板50中，基體薄膜60係於基底薄膜61上依序設置包含接地電路62a之印刷電路62與絕緣薄膜63而成的薄膜。 又，屏蔽薄膜70係由接著劑層71、積層於接著劑層71之屏蔽層72及積層於屏蔽層72之絕緣層73構成的薄膜。 然後，於屏蔽印刷配線板50中，屏蔽薄膜70係以屏蔽薄膜70之接著劑層71與基體薄膜60相接之方式被覆基體薄膜60。 再者，屏蔽薄膜70之接著劑層71係導電性接著劑層。As shown in FIG. 2, the shield printed wiring board 50 is composed of a base film 60 and a shield film 70. In the shielded printed wiring board 50, the base film 60 is a film formed by sequentially setting the printed circuit 62 including the ground circuit 62a and the insulating film 63 on the base film 61. The shielding film 70 is a film composed of an adhesive layer 71, a shielding layer 72 laminated on the adhesive layer 71, and an insulating layer 73 laminated on the shielding layer 72. Then, in the shield printed wiring board 50, the shield film 70 covers the base film 60 such that the adhesive layer 71 of the shield film 70 is in contact with the base film 60. Furthermore, the adhesive layer 71 of the shielding film 70 is a conductive adhesive layer.

接著，使用圖式說明將接地構件1使用於屏蔽印刷配線板50之情形。 圖3(a)及(b)係示意性顯示將本發明接地構件使用於屏蔽印刷配線板時之一例的示意圖。 如圖3(a)及(b)所示，接地構件1係以接地構件1之導電性突起20貫穿屏蔽薄膜70之絕緣層73的方式，壓抵於屏蔽印刷配線板50而配置。 然後，如圖3(a)所示，亦可以進一步按壓接地構件1，使其導電性突起20貫穿屏蔽薄膜70之屏蔽層72，從而使接地構件1之導電性突起20與屏蔽薄膜70之接著劑層71接觸。 又，如圖3(b)所示，亦可使接地構件1之導電性突起20僅與屏蔽薄膜70之屏蔽層72接觸。 因為接著劑層71為導電性接著劑層，故藉由使導電性突起20與接著劑層71及屏蔽層72接觸、或者使導電性突起20與屏蔽層72接觸，可將接地構件1之外部連接構件10與基體薄膜60之接地電路62a電性連接。 又，接地構件1之外部連接構件10連接於外部接地GND。Next, the case where the ground member 1 is used for shielding the printed wiring board 50 will be described using drawings. 3 (a) and (b) are schematic diagrams schematically showing an example when the grounding member of the present invention is used for a shielded printed wiring board. As shown in FIGS. 3 (a) and (b), the ground member 1 is arranged so that the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 73 of the shielding film 70 and presses against the shield printed wiring board 50. Then, as shown in FIG. 3 (a), the ground member 1 may be further pressed so that the conductive protrusion 20 penetrates the shield layer 72 of the shield film 70, so that the conductive protrusion 20 of the ground member 1 and the shield film 70 are adhered The agent layer 71 contacts. Furthermore, as shown in FIG. 3 (b), the conductive protrusion 20 of the ground member 1 may be brought into contact with only the shielding layer 72 of the shielding film 70. Since the adhesive layer 71 is a conductive adhesive layer, by contacting the conductive protrusion 20 with the adhesive layer 71 and the shielding layer 72 or contacting the conductive protrusion 20 with the shielding layer 72, the outside of the grounding member 1 can be The connecting member 10 is electrically connected to the ground circuit 62a of the base film 60. In addition, the external connection member 10 of the ground member 1 is connected to the external ground GND.

像這樣將接地構件1配置於屏蔽印刷配線板50，故不需要於屏蔽印刷配線板50的屏蔽薄膜70之絕緣層73預先設孔等，即可於任意位置配置接地構件1。Since the grounding member 1 is arranged on the shielded printed wiring board 50 in this way, it is not necessary to provide holes or the like in advance in the insulating layer 73 of the shielding film 70 of the shielded printed wiring board 50, and the grounding member 1 can be arranged at any position.

又，於接地構件1中，於導電性突起20表面形成有低熔點金屬層21。 將接地構件1配置於屏蔽印刷配線板50時、或於配置後的零件安裝步驟中亦會進行加熱。藉由該加熱，低熔點金屬層21即軟化，可使接地構件1之導電性突起20與屏蔽薄膜70之屏蔽層72的密接性、或者接地構件1之導電性突起20與屏蔽薄膜70之接著劑層71的密接性提高。 因此，縱使是對使用接地構件1之屏蔽印刷配線板50反覆進行加熱及冷卻而安裝零件的情況，於接地構件1之導電性突起20與屏蔽薄膜70之屏蔽層72或接著劑層71間亦不易發生偏移。其結果，可抑制基體薄膜60之接地電路62a-外部接地GND間的電阻增加。 再者，在構成屏蔽層72的金屬與構成導電性突起20表面之低熔點金屬層21的金屬可形成合金之情況，藉由此等金屬形成合金，接地構件1之導電性突起20與屏蔽薄膜70之屏蔽層72之密接性將更為提高。In addition, in the ground member 1, a low-melting-point metal layer 21 is formed on the surface of the conductive protrusion 20. When the grounding member 1 is arranged on the shielded printed wiring board 50 or in the component mounting step after the arrangement, heating is also performed. By this heating, the low-melting-point metal layer 21 is softened, and the adhesion between the conductive protrusion 20 of the ground member 1 and the shield layer 72 of the shield film 70 or the adhesion between the conductive protrusion 20 of the ground member 1 and the shield film 70 can be made The adhesiveness of the agent layer 71 is improved. Therefore, even if the shield printed circuit board 50 using the grounding member 1 is repeatedly heated and cooled to mount parts, between the conductive protrusion 20 of the grounding member 1 and the shielding layer 72 or the adhesive layer 71 of the shielding film 70 It is not easy to shift. As a result, the increase in resistance between the ground circuit 62a of the base film 60 and the external ground GND can be suppressed. Furthermore, in the case where the metal constituting the shielding layer 72 and the metal constituting the low-melting-point metal layer 21 on the surface of the conductive protrusion 20 can form an alloy, by forming an alloy with these metals, the conductive protrusion 20 of the ground member 1 and the shielding film The adhesion of the shield layer 72 of 70 will be more improved.

另外，低熔點金屬層21亦可於使接地構件1之導電性突起20與屏蔽層72連接後在屏蔽印刷配線板安裝零件的步驟中使之軟化。 例如以為了安裝零件而使用焊料的情況而言，會進行焊料回焊步驟。此時，可藉由回焊時的熱使低熔點金屬層21軟化。In addition, the low-melting-point metal layer 21 may be softened in the step of shielding the printed wiring board mounting component after connecting the conductive protrusion 20 of the ground member 1 to the shielding layer 72. For example, in the case of using solder for mounting parts, a solder reflow step is performed. At this time, the low-melting-point metal layer 21 can be softened by heat during reflow.

於接地構件1中，低熔點金屬層21宜由熔點300℃以下的金屬形成。 若低熔點金屬層21由熔點300℃以下的金屬形成，在將接地構件1配置於屏蔽印刷配線板50時，低熔點金屬層21容易軟化，可使接地構件1之導電性突起20與屏蔽薄膜70之屏蔽層72或接著劑層71的密接性良好地提高。 若低熔點金屬層由熔點超過300℃的金屬形成，則將接地構件配置於屏蔽印刷配線板時的加熱溫度會變高。因此，接地構件或屏蔽印刷配線板容易因為熱而受到損傷。In the ground member 1, the low-melting-point metal layer 21 is preferably formed of a metal having a melting point of 300 ° C or lower. If the low-melting-point metal layer 21 is formed of a metal having a melting point of 300 ° C. or lower, when the grounding member 1 is disposed on the shielded printed wiring board 50, the low-melting-point metal layer 21 is easily softened, and the conductive protrusion 20 and the shielding film of the grounding member 1 can be made The adhesion of the shielding layer 72 or the adhesive layer 71 of 70 is improved well. If the low-melting-point metal layer is formed of a metal having a melting point exceeding 300 ° C, the heating temperature when the grounding member is placed on the shielded printed wiring board becomes high. Therefore, the ground member or the shielded printed wiring board is easily damaged by heat.

於接地構件1中，形成低熔點金屬層21之金屬並無特別限定，但宜包含選自於由銦、錫、鉛及鉍所構成群組中之至少一種。 此等金屬具備形成低熔點金屬層21時適合的熔點及導電性。In the grounding member 1, the metal forming the low-melting-point metal layer 21 is not particularly limited, but it preferably includes at least one selected from the group consisting of indium, tin, lead, and bismuth. These metals have a melting point and conductivity suitable for forming the low-melting-point metal layer 21.

於接地構件1中，低熔點金屬層21之厚度宜為0.1~50μm。 若低熔點金屬層之厚度未達0.1μm，因為形成低熔點金屬層之金屬量較少，故將接地構件配置於屏蔽印刷配線板時，接地構件之導電性突起與屏蔽薄膜之屏蔽層或接著劑層的密接性會變得不易提高。 若低熔點金屬層之厚度超過50μm，則由於低熔點金屬層較厚，故接地構件的導電性突起會變粗。因此，將接地構件配置於屏蔽印刷配線板時，變得不易貫穿屏蔽薄膜之絕緣層。In the grounding member 1, the thickness of the low-melting-point metal layer 21 is preferably 0.1-50 μm. If the thickness of the low-melting-point metal layer is less than 0.1 μm, because the amount of metal forming the low-melting-point metal layer is small, when the grounding member is disposed on the shielded printed wiring board, the conductive protrusion of the grounding member and the shielding layer of the shielding film or the bonding The adhesiveness of the agent layer becomes difficult to improve. If the thickness of the low-melting-point metal layer exceeds 50 μm, the low-melting-point metal layer is thick, so that the conductive protrusion of the ground member becomes thick. Therefore, when the ground member is arranged on the shield printed wiring board, it becomes difficult to penetrate the insulating layer of the shield film.

於接地構件1中，低熔點金屬層21宜包含助焊劑。 藉由低熔點金屬層21包含助焊劑，當構成低熔點金屬層21之金屬軟化時，構成低熔點金屬層21之金屬與接地構件1之導電性突起20以及屏蔽薄膜70之屏蔽層72或接著劑層71就變得容易密接。 其結果，可使接地構件1之導電性突起20與屏蔽薄膜70之屏蔽層72或接著劑層71之密接性更為提高。In the grounding member 1, the low-melting-point metal layer 21 preferably contains flux. Since the low-melting-point metal layer 21 contains flux, when the metal constituting the low-melting-point metal layer 21 is softened, the metal constituting the low-melting-point metal layer 21 and the conductive protrusion 20 of the ground member 1 and the shielding layer 72 of the shielding film 70 or then The agent layer 71 becomes easily adhered. As a result, the adhesion between the conductive protrusion 20 of the ground member 1 and the shielding layer 72 or the adhesive layer 71 of the shielding film 70 can be further improved.

作為助焊劑並無特別限定，可使用多元羧酸、乳酸、檸檬酸、油酸、硬脂酸、麩胺酸、苯甲酸、甘油、松香等周知者。The flux is not particularly limited, and known ones such as polycarboxylic acid, lactic acid, citric acid, oleic acid, stearic acid, glutamic acid, benzoic acid, glycerin, and rosin can be used.

於接地構件1中，外部連接構件10宜包含選自於由銅、鋁、銀、金、鎳、鉻、鈦、鋅及不鏽鋼所構成群組中之至少一種。 此等材料為適合用於將接地構件1與外部接地GND電性連接的材料。In the grounding member 1, the external connection member 10 preferably includes at least one selected from the group consisting of copper, aluminum, silver, gold, nickel, chromium, titanium, zinc, and stainless steel. These materials are suitable for electrically connecting the ground member 1 to the external ground GND.

低熔點金屬層21由錫或其合金構成時，於導電性突起20表面宜存在鎳。即，導電性突起20表面宜被鎳層包覆，於其上存在低熔點金屬層21。 低熔點金屬層21由錫或其合金構成時，有低熔點金屬層21與導電性突起20表面的金屬形成合金之情形。 然而，藉由導電性突起20表面存在鎳，可防止構成低熔點金屬層21的錫與構成導電性突起20的金屬形成合金。其結果，構成低熔點金屬層21的錫可有效率地與屏蔽層形成合金。因此，可減少用於低熔點金屬層21的錫量。When the low-melting-point metal layer 21 is composed of tin or its alloy, nickel is preferably present on the surface of the conductive protrusion 20. That is, the surface of the conductive protrusion 20 is preferably covered with a nickel layer, and a low-melting-point metal layer 21 is present thereon. When the low-melting-point metal layer 21 is composed of tin or an alloy thereof, the low-melting-point metal layer 21 and the metal on the surface of the conductive protrusion 20 may form an alloy. However, the presence of nickel on the surface of the conductive protrusion 20 prevents tin constituting the low-melting-point metal layer 21 from forming an alloy with the metal constituting the conductive protrusion 20. As a result, tin constituting the low-melting-point metal layer 21 can efficiently form an alloy with the shield layer. Therefore, the amount of tin used for the low-melting-point metal layer 21 can be reduced.

於接地構件1中，於第2主面12宜形成有耐腐蝕層。 若於接地構件1之第2主面12形成有耐腐蝕層，可防止接地構件1腐蝕。In the grounding member 1, a corrosion-resistant layer is preferably formed on the second main surface 12. If a corrosion-resistant layer is formed on the second main surface 12 of the ground member 1, the ground member 1 can be prevented from corroding.

於接地構件1中，耐腐蝕層宜包含選自於由鎳、金、銀、鉑、鈀、銠、銥、釕、鋨及此等合金所構成群組中之至少一種。 此等材料不易腐蝕。因此，此等材料為適用於接地構件1之耐腐蝕層的材料。In the grounding member 1, the corrosion-resistant layer preferably includes at least one selected from the group consisting of nickel, gold, silver, platinum, palladium, rhodium, iridium, ruthenium, osmium, and these alloys. These materials are not easily corroded. Therefore, these materials are suitable for the corrosion-resistant layer of the ground member 1.

於接地構件1中，導電性突起20亦可為柱狀，例如可為圓柱、橢圓柱、三角柱、四角柱、五角柱、六角柱、八角柱等。 若導電性突起20為柱狀，則將接地構件1壓抵於屏蔽薄膜70之絕緣層73時可變得容易貫穿絕緣層73。In the grounding member 1, the conductive protrusion 20 may also be columnar, for example, it may be cylindrical, elliptical, triangular, quadrangular, pentagonal, hexagonal, or octagonal. If the conductive protrusion 20 has a column shape, the ground layer 1 can easily penetrate the insulating layer 73 when pressed against the insulating layer 73 of the shielding film 70.

於接地構件1中，導電性突起之底面面積宜為1.0~1.0×10⁶ μm² 。 若導電性突起之底面面積未達1.0μm² ，導電性突起之強度變弱，導電性突起變得容易折斷。若導電性突起折斷，則導電性突起與外部連接構件之電性連接會切斷。因此，基體薄膜之接地電路-外部接地間的電阻容易變高。而且，在技術上難以形成如此細的導電性突起。 若導電性突起之底面面積超過1.0×10⁶ μm² ，因為導電性突起過粗，故將接地構件配置於屏蔽印刷配線板時會變得不易貫穿屏蔽薄膜之絕緣層。In the grounding member 1, the area of the bottom surface of the conductive protrusion is preferably 1.0 to 1.0 × 10 ⁶ μm ² . If the area of the bottom surface of the conductive protrusion is less than 1.0 μm ² , the strength of the conductive protrusion becomes weak, and the conductive protrusion becomes easily broken. If the conductive protrusion is broken, the electrical connection between the conductive protrusion and the external connection member is cut. Therefore, the resistance between the ground circuit of the base film and the external ground is likely to increase. Moreover, it is technically difficult to form such fine conductive protrusions. If the area of the bottom surface of the conductive protrusion exceeds 1.0 × 10 ⁶ μm ² , because the conductive protrusion is too thick, it becomes difficult to penetrate the insulating layer of the shielding film when the grounding member is placed on the shielding printed wiring board.

於接地構件1中，導電性突起彼此的間距宜為1~1000μm。 導電性突起彼此的間距未達1μm的接地構件，技術上難以製作。 若導電性突起彼此的間距超過1000μm，則導電性突起的密度變低，導電性突起與屏蔽薄膜之屏蔽層或接著劑層的總接觸面積變小。因此，基體薄膜之接地電路-外部接地間的電阻容易變高。In the ground member 1, the distance between the conductive protrusions is preferably 1 to 1000 μm. It is technically difficult to produce a ground member having a distance between conductive protrusions of less than 1 μm. If the distance between the conductive protrusions exceeds 1000 μm, the density of the conductive protrusions becomes low, and the total contact area between the conductive protrusions and the shielding layer or the adhesive layer of the shielding film becomes small. Therefore, the resistance between the ground circuit of the base film and the external ground is likely to increase.

接著，說明本發明接地構件之製造方法之一例。 本發明接地構件之製造方法包含：(1)基體準備步驟、(2)導電性突起形成步驟、及(3)低熔點金屬層形成步驟。Next, an example of the manufacturing method of the grounding member of the present invention will be described. The manufacturing method of the grounding member of the present invention includes: (1) a substrate preparation step, (2) a conductive protrusion forming step, and (3) a low melting point metal layer forming step.

以下，使用圖式就各步驟進行說明。 圖4(a)~(d)係按步驟順序示意性顯示本發明接地構件之製造方法之一例的步驟圖。Hereinafter, each step will be described using the drawings. 4 (a) to (d) are step diagrams schematically showing an example of the manufacturing method of the grounding member of the present invention in the order of steps.

(1)基體準備步驟 首先，如圖4(a)所示，準備成為接地構件基體的金屬箔2。 金屬箔2宜為在說明上述接地構件之外部連接構件的材料時所說明的金屬。(1) Base preparation step First, as shown in FIG. 4 (a), the metal foil 2 to be the base of the ground member is prepared. The metal foil 2 is preferably the metal described when describing the material of the external connection member of the ground member.

(2)導電性突起形成步驟 接著，如圖4(b)所示，以用以形成導電性突起的抗蝕劑91遮蔽金屬箔2的一主面。(2) Conductive protrusion forming step Next, as shown in FIG. 4 (b), a main surface of the metal foil 2 is masked with a resist 91 for forming conductive protrusions.

接著，如圖4(c)所示，蝕刻金屬箔2。 作為蝕刻所使用的蝕刻液，宜配合金屬箔的素材等而適當選擇。 例如金屬箔為銅箔時，作為蝕刻液宜使用過硫酸鈉水溶液、過氧化氫水和硫酸的混合液、氯化鐵水溶液、氯化銅水溶液等。 可藉由本步驟形成接地構件1之外部連接構件10及導電性突起20。Next, as shown in FIG. 4 (c), the metal foil 2 is etched. The etching solution used for etching is suitably selected according to the material of the metal foil and the like. For example, when the metal foil is copper foil, an aqueous solution of sodium persulfate, a mixture of hydrogen peroxide water and sulfuric acid, an aqueous solution of ferric chloride, an aqueous solution of copper chloride, etc. are preferably used as the etching solution. The external connection member 10 and the conductive protrusion 20 of the ground member 1 can be formed by this step.

(3)低熔點金屬層形成步驟 接著，如圖4(d)所示，於導電性突起20表面形成低熔點金屬層21。 形成低熔點金屬層21的方法並無特別限定，可採用鍍覆法等。 例如，以外部連接構件10及導電性突起20由銅構成而欲鍍覆錫的情況而言，可使用無電解鍍覆或電解鍍覆。(3) Low melting point metal layer forming step Next, as shown in FIG. 4 (d), a low melting point metal layer 21 is formed on the surface of the conductive protrusion 20. The method of forming the low-melting-point metal layer 21 is not particularly limited, and a plating method or the like can be used. For example, in the case where the external connection member 10 and the conductive protrusion 20 are made of copper and are to be plated with tin, electroless plating or electrolytic plating may be used.

通過以上步驟，可製造接地構件1。Through the above steps, the ground member 1 can be manufactured.

接著，說明使用接地構件1之屏蔽印刷配線板之製造方法。 另外，該屏蔽印刷配線板之製造方法亦為本發明屏蔽印刷配線板之製造方法的一例。Next, a method of manufacturing the shielded printed wiring board using the grounding member 1 will be described. In addition, the manufacturing method of the shielded printed wiring board is also an example of the manufacturing method of the shielded printed wiring board of the present invention.

本發明之屏蔽印刷配線板之製造方法中，該屏蔽印刷配線板具備基體薄膜、屏蔽薄膜及上述接地構件1，該基體薄膜係於基底薄膜上依序設置包含接地電路之印刷電路及絕緣薄膜而成，該屏蔽薄膜具有屏蔽層及積層於上述屏蔽層之絕緣層，該接地構件1配置於上述屏蔽薄膜之絕緣層上；上述屏蔽印刷配線板之製造方法包含以下步驟：(1)屏蔽薄膜載置步驟、(2)接地構件配置步驟、(3)加壓步驟、及(4)加熱步驟。In the method for manufacturing a shielded printed wiring board of the present invention, the shielded printed wiring board includes a base film, a shielding film, and the grounding member 1 described above. The base film is provided with a printed circuit including a ground circuit and an insulating film in sequence on the base film. The shielding film has a shielding layer and an insulating layer laminated on the shielding layer. The grounding member 1 is disposed on the insulating layer of the shielding film. The manufacturing method of the shielded printed wiring board includes the following steps: (1) Placement step, (2) grounding member placement step, (3) pressurization step, and (4) heating step.

以下，使用圖式就各步驟進行說明。 圖5係示意性顯示本發明屏蔽印刷配線板之製造方法中屏蔽薄膜載置步驟之一例的步驟圖。 圖6係示意性顯示本發明屏蔽印刷配線板之製造方法中接地構件配置步驟之一例的步驟圖。 圖7係示意性顯示本發明屏蔽印刷配線板之製造方法中加壓步驟之一例的步驟圖。 圖8係示意性顯示本發明屏蔽印刷配線板之製造方法中加熱步驟之一例的步驟圖。Hereinafter, each step will be described using the drawings. FIG. 5 is a step diagram schematically showing an example of a step of placing a shielding film in the method for manufacturing a shielded printed wiring board of the present invention. FIG. 6 is a step diagram schematically showing an example of an arrangement step of the grounding member in the manufacturing method of the shielded printed wiring board of the present invention. 7 is a step diagram schematically showing an example of a pressing step in the method for manufacturing a shielded printed wiring board of the present invention. FIG. 8 is a step diagram schematically showing an example of the heating step in the manufacturing method of the shielded printed wiring board of the present invention.

(1)屏蔽薄膜載置步驟 於本步驟中，首先準備於基底薄膜61上依序設置包含接地電路62a之印刷電路62與絕緣薄膜63而成的基體薄膜60。 又，亦準備由作為導電性接著劑層的接著劑層71、積層於接著劑層71之屏蔽層72及積層於屏蔽層72之絕緣層73構成的屏蔽薄膜70。 然後，如圖5所示，以屏蔽薄膜70之接著劑層71連接於基體薄膜60上之方式載置屏蔽薄膜70，製作屏蔽印刷配線板50(參照圖6)。(1) Step of placing a shielding film In this step, first, a base film 60 in which a printed circuit 62 including a ground circuit 62a and an insulating film 63 is sequentially provided on the base film 61 is prepared. In addition, a shielding film 70 composed of an adhesive layer 71 as a conductive adhesive layer, a shielding layer 72 laminated on the adhesive layer 71, and an insulating layer 73 laminated on the shielding layer 72 is also prepared. Then, as shown in FIG. 5, the shielding film 70 is placed so that the adhesive layer 71 of the shielding film 70 is connected to the base film 60 to produce a shielded printed wiring board 50 (see FIG. 6).

構成基體薄膜60之基底薄膜61及絕緣薄膜63的材料並無特別限定，但宜由工程塑膠構成。作為上述工程塑膠，例如可舉例：聚對苯二甲酸乙二酯、聚丙烯、交聯聚乙烯、聚酯、聚苯并咪唑、聚醯亞胺、聚醯亞胺醯胺、聚醚醯亞胺、聚苯硫醚等樹脂。 又，於此等工程塑膠中，在要求阻燃性時以聚苯硫醚薄膜為佳，而要求耐熱性時則以聚醯亞胺薄膜為佳。再者，基底薄膜61之厚度宜為10~40μm，絕緣薄膜63之厚度宜為10~30μm。The materials of the base film 61 and the insulating film 63 constituting the base film 60 are not particularly limited, but are preferably made of engineering plastics. Examples of the engineering plastics include polyethylene terephthalate, polypropylene, cross-linked polyethylene, polyester, polybenzimidazole, polyimide, polyimide amide, polyether amide. Amine, polyphenylene sulfide and other resins. In addition, among these engineering plastics, polyphenylene sulfide film is preferred when flame retardancy is required, and polyimide film is preferred when heat resistance is required. Furthermore, the thickness of the base film 61 is preferably 10 to 40 μm, and the thickness of the insulating film 63 is preferably 10 to 30 μm.

又，於絕緣薄膜63形成有用以使印刷電路62局部露出的孔部63a。 孔部63a之形成方法並無特別限定，可採用雷射加工等習知方法。In addition, a hole 63 a is formed in the insulating film 63 to partially expose the printed circuit 62. The method of forming the hole 63a is not particularly limited, and conventional methods such as laser processing can be used.

屏蔽薄膜70之接著劑層71係由樹脂和導電性微粒子構成的導電性接著劑層。The adhesive layer 71 of the shielding film 70 is a conductive adhesive layer composed of resin and conductive fine particles.

作為構成接著劑層71之樹脂並無特別限定，但宜為丙烯酸系樹脂、環氧系樹脂、矽系樹脂、熱塑性彈性體系樹脂、橡膠系樹脂、聚酯系樹脂、胺甲酸乙酯系樹脂等。 又，於接著劑層71中亦可包含脂肪酸烴樹脂、C5/C9混合樹脂、松香、松香衍生物、萜烯樹脂、芳香族系烴樹脂、熱反應性樹脂等黏著性賦予劑。若包含此等黏著性賦予劑，則可使接著劑層71之黏著性提高。The resin constituting the adhesive layer 71 is not particularly limited, but it is preferably an acrylic resin, an epoxy resin, a silicon resin, a thermoplastic elastomer resin, a rubber resin, a polyester resin, a urethane resin, etc. . In addition, the adhesive agent layer 71 may contain an adhesion-imparting agent such as fatty acid hydrocarbon resin, C5 / C9 mixed resin, rosin, rosin derivative, terpene resin, aromatic hydrocarbon resin, and heat-reactive resin. If such an adhesiveness-imparting agent is included, the adhesiveness of the adhesive layer 71 can be improved.

作為構成接著劑層71之導電性微粒子並無特別限定，例如有銅粉、銀粉、鎳粉、銀包銅粉(Ag包Cu粉)、金包銅粉、銀包鎳粉(Ag包Ni粉)、金包鎳粉，此等金屬粉可利用霧化法、羰基法等製作。又，除上述外，亦可使用於金屬粉被覆樹脂的粒子、於樹脂被覆金屬粉的粒子。再者，導電性微粒子宜為Ag包Cu粉或Ag包Ni粉。其理由為可利用便宜的材料獲得導電性穩定的導電性微粒子。 再者，導電性微粒子的形狀並不需限定為球狀，例如亦可為樹枝狀、片狀、尖峰狀、棒狀、纖維狀、針狀等。又，於導電性微粒子表面可設置低熔點金屬層。此時的低熔點金屬層可使用上述的材料。The conductive fine particles constituting the adhesive layer 71 are not particularly limited, and examples include copper powder, silver powder, nickel powder, silver-coated copper powder (Ag-coated Cu powder), gold-coated copper powder, and silver-coated nickel powder (Ag-coated Ni powder ), Gold-coated nickel powder, these metal powders can be produced by atomization method, carbonyl method, etc. In addition to the above, particles coated with resin by metal powder and particles coated with resin by metal powder may also be used. Furthermore, the conductive fine particles are preferably Ag-coated Cu powder or Ag-coated Ni powder. The reason is that conductive fine particles with stable conductivity can be obtained from inexpensive materials. In addition, the shape of the conductive fine particles does not need to be limited to a spherical shape, and for example, it may be dendritic, sheet-like, spike-like, rod-like, fibrous, or needle-like. In addition, a low melting point metal layer may be provided on the surface of the conductive fine particles. In this case, the above-mentioned materials can be used for the low-melting-point metal layer.

因為屏蔽薄膜70之接著劑層71為導電性接著劑層，故藉由接地構件1之導電性突起20貫通屏蔽薄膜70之絕緣層73，使得接地構件1之導電性突起20與屏蔽薄膜70之屏蔽層72及接著劑層71接觸、或者使得接地構件1之導電性突起20與屏蔽薄膜70之屏蔽層72接觸，從而可將接地構件1之外部連接構件10與基體薄膜60之接地電路62a電性連接。Since the adhesive layer 71 of the shielding film 70 is a conductive adhesive layer, the conductive protrusion 20 of the grounding member 1 penetrates the insulating layer 73 of the shielding film 70 so that the conductive protrusion 20 of the grounding member 1 and the shielding film 70 The shielding layer 72 and the adhesive layer 71 are in contact, or the conductive protrusion 20 of the grounding member 1 is in contact with the shielding layer 72 of the shielding film 70, thereby electrically connecting the external connection member 10 of the grounding member 1 and the grounding circuit 62a of the base film 60 Sexual connection.

進而，接著劑層71可為各向異性導電性接著劑層，亦可為等向性導電性接著劑層，但較佳為各向異性導電性接著劑層。當接著劑層71為各向異性導電性接著劑層時，導電性微粒子相對於接著劑層71總體量宜以3~39重量%之範圍來含有。又，導電性微粒子之平均粒徑宜為2~20μm範圍，但宜根據各向異性導電性接著劑層厚度選擇最佳的尺寸。 又，當接著劑層71為等向性導電性接著劑層時，導電性微粒子相對於接著劑層71總體量，宜以超過39重量%且95重量%以下之範圍來含有。導電性微粒子之平均粒徑可與各向異性導電性接著劑層相同地進行選擇。Furthermore, the adhesive layer 71 may be an anisotropic conductive adhesive layer or an isotropic conductive adhesive layer, but it is preferably an anisotropic conductive adhesive layer. When the adhesive layer 71 is an anisotropic conductive adhesive layer, the conductive fine particles are preferably contained in the range of 3 to 39% by weight relative to the total amount of the adhesive layer 71. In addition, the average particle diameter of the conductive fine particles is preferably in the range of 2 to 20 μm, but the optimal size is preferably selected according to the thickness of the anisotropic conductive adhesive layer. In addition, when the adhesive layer 71 is an isotropic conductive adhesive layer, the conductive fine particles are preferably contained in a range of more than 39% by weight and 95% by weight or less relative to the total amount of the adhesive layer 71. The average particle diameter of the conductive fine particles can be selected in the same manner as the anisotropic conductive adhesive layer.

屏蔽薄膜70之屏蔽層72，只要是展現可將源自電訊號的非必要輻射或源自外部的電磁波等雜訊予以遮蔽之屏蔽效果，則由任何材料構成均可。例如，屏蔽層72可由等向性導電性樹脂或金屬構成。 屏蔽層72由金屬構成時，可為金屬箔或蒸鍍膜等金屬層，抑或形成為層狀的導電性粒子集合體。屏蔽層72為金屬層時，構成金屬的材料宜包含選自於由鎳、銅、銀、金、鈀、鋁、鉻、鈦、鋅及其等合金所構成群組中之至少一種。 當屏蔽層72為導電性粒子集合體時，可使用上述導電性微粒子。 此等材料為導電性較高、適合作為屏蔽層的材料。The shielding layer 72 of the shielding film 70 may be made of any material as long as it exhibits a shielding effect that can shield unnecessary noise from electrical signals or electromagnetic waves from outside. For example, the shielding layer 72 may be composed of isotropic conductive resin or metal. When the shielding layer 72 is made of metal, it may be a metal layer such as a metal foil or a vapor-deposited film, or may be formed as a layered collection of conductive particles. When the shielding layer 72 is a metal layer, the material constituting the metal preferably includes at least one selected from the group consisting of nickel, copper, silver, gold, palladium, aluminum, chromium, titanium, zinc, and other alloys. When the shielding layer 72 is an assembly of conductive particles, the above-mentioned conductive fine particles can be used. These materials are highly conductive and suitable as shielding materials.

關於屏蔽薄膜70之屏蔽層72的厚度宜為0.01~10μm。 屏蔽層的厚度未達0.01μm，難以獲得充分的屏蔽效果。 若屏蔽層的厚度超過10μm，則難以彎曲。The thickness of the shielding layer 72 of the shielding film 70 is preferably 0.01-10 μm. The thickness of the shielding layer is less than 0.01 μm, and it is difficult to obtain a sufficient shielding effect. If the thickness of the shield layer exceeds 10 μm, it is difficult to bend.

作為屏蔽薄膜70之絕緣層73的材料並無特別限定，但宜為環氧系樹脂、聚酯系樹脂、丙烯酸系樹脂、酚系樹脂、胺甲酸乙酯系樹脂等。The material of the insulating layer 73 of the shielding film 70 is not particularly limited, but it is preferably an epoxy resin, polyester resin, acrylic resin, phenol resin, urethane resin, or the like.

關於屏蔽薄膜70之絕緣層73的厚度宜為1~10μm。The thickness of the insulating layer 73 of the shielding film 70 is preferably 1-10 μm.

(2)接地構件配置步驟 於本步驟中，如圖6所示，係以使接地構件1之導電性突起20朝向屏蔽薄膜70之絕緣層73側之方式，將接地構件1配置於屏蔽薄膜70。(2) Grounding member arrangement step In this step, as shown in FIG. 6, the grounding member 1 is arranged on the shielding film 70 such that the conductive protrusion 20 of the grounding member 1 faces the insulating layer 73 side of the shielding film 70 .

(3)加壓步驟 於本步驟中，如圖7所示，為了使接地構件1之外部連接構件10與基體薄膜60之接地電路62a電性連接，係加壓接地構件1，以使接地構件1之導電性突起20貫通屏蔽薄膜70之絕緣層73。藉此，接地構件1之導電性突起20就會與屏蔽薄膜70之接著劑層71及屏蔽層72接觸。 加壓時之壓力宜為0.5MPa~10MPa。 再者，於本步驟中，亦可使接地構件1之導電性突起20僅貫通屏蔽薄膜70之絕緣層73，使接地構件1之導電性突起20僅與屏蔽薄膜70之屏蔽層72接觸。(3) Pressure step In this step, as shown in FIG. 7, in order to electrically connect the external connection member 10 of the ground member 1 to the ground circuit 62 a of the base film 60, the ground member 1 is pressed to make the ground member The conductive protrusion 20 of 1 penetrates the insulating layer 73 of the shielding film 70. As a result, the conductive protrusion 20 of the grounding member 1 comes into contact with the adhesive layer 71 and the shielding layer 72 of the shielding film 70. The pressure during pressurization should be 0.5MPa ~ 10MPa. Furthermore, in this step, the conductive protrusions 20 of the ground member 1 may penetrate only the insulating layer 73 of the shielding film 70, and the conductive protrusions 20 of the ground member 1 may only contact the shielding layer 72 of the shielding film 70.

(4)加熱步驟 於本步驟中，如圖8所示，為了使接地構件1之低熔點金屬層21與屏蔽薄膜70之屏蔽層72連接，係加熱接地構件1之低熔點金屬層21使之軟化。 使接地構件1之低熔點金屬層21軟化時的溫度並無特別限定，宜為100~300℃。 藉此，可使接地構件1之導電性突起20與屏蔽薄膜70之屏蔽層72的密接性、或接地構件1之導電性突起20與屏蔽薄膜70之接著劑層71的密接性提高。(4) Heating step In this step, as shown in FIG. 8, in order to connect the low-melting-point metal layer 21 of the ground member 1 to the shielding layer 72 of the shielding film 70, the low-melting-point metal layer 21 of the ground member 1 is heated to soften. The temperature at which the low-melting-point metal layer 21 of the grounding member 1 is softened is not particularly limited, but is preferably 100 to 300 ° C. Thereby, the adhesion between the conductive protrusion 20 of the ground member 1 and the shield layer 72 of the shield film 70 or the adhesion between the conductive protrusion 20 of the ground member 1 and the adhesive layer 71 of the shield film 70 can be improved.

再者，於本發明屏蔽印刷配線板之製造方法中，加熱步驟只要是可使接地構件之導電性突起之低熔點金屬層軟化而與屏蔽薄膜之屏蔽層連接，加熱步驟可於任何階段進行。 例如可與上述加壓步驟同時進行、抑或作為獨立步驟進行。 藉由同時進行加壓步驟與加熱步驟，可使製造效率提高。Furthermore, in the manufacturing method of the shielded printed wiring board of the present invention, the heating step may be performed at any stage as long as the low melting point metal layer of the conductive protrusion of the ground member is softened and connected to the shielding layer of the shielding film. For example, it may be performed simultaneously with the above-mentioned pressurization step, or may be performed as a separate step. By simultaneously performing the pressing step and the heating step, the manufacturing efficiency can be improved.

又，加熱步驟亦可於對加壓步驟後之屏蔽印刷配線板安裝零件的步驟中進行。例如為了安裝零件而使用焊料的情況，會進行焊料回焊步驟。亦可藉由該回焊步驟回焊時的熱使低熔點金屬層軟化。此時，會同時進行加熱步驟與零件安裝。In addition, the heating step may also be performed in the step of mounting components on the printed wiring board after the pressing step. For example, when solder is used for mounting parts, a solder reflow step is performed. The low melting point metal layer can also be softened by the heat during reflow in this reflow step. At this time, the heating step and parts installation are performed simultaneously.

通過以上步驟，可製造具備接地構件1之屏蔽印刷配線板50。藉此製成的具備接地構件1之屏蔽印刷配線板50為本發明屏蔽印刷配線板的一例。Through the above steps, the shielded printed wiring board 50 including the ground member 1 can be manufactured. The shielded printed wiring board 50 provided with the grounding member 1 produced by this is an example of the shielded printed wiring board of the present invention.

又，於上述本發明屏蔽印刷配線板之製造方法中，在上述屏蔽薄膜載置步驟中，亦可準備於接著劑層與屏蔽層之間、及/或屏蔽層與絕緣層之間形成有低熔點金屬層的屏蔽薄膜。 進而，於加熱步驟宜使屏蔽薄膜之低熔點金屬層軟化而與接地構件之導電性突起連接。 藉此，可使接地構件之導電性突起與屏蔽薄膜之屏蔽層的密接性、或接地構件之導電性突起與屏蔽薄膜之接著劑層的密接性提高。In addition, in the manufacturing method of the above-mentioned shielded printed wiring board of the present invention, in the above-mentioned shielding film placing step, it may be prepared between the adhesive layer and the shielding layer, and / or between the shielding layer and the insulating layer Shielding film of melting point metal layer. Furthermore, in the heating step, the low melting point metal layer of the shielding film is preferably softened and connected to the conductive protrusion of the ground member. Thereby, the adhesion between the conductive protrusion of the ground member and the shielding layer of the shielding film or the adhesion of the conductive protrusion of the grounding member and the adhesive layer of the shielding film can be improved.

屏蔽薄膜之低熔點金屬層宜由熔點300℃以下的金屬形成。 若屏蔽薄膜之低熔點金屬層由熔點300℃以下的金屬形成，將接地構件配置於屏蔽印刷配線板時，屏蔽薄膜之低熔點金屬層容易軟化，可使接地構件之導電性突起與屏蔽薄膜之屏蔽層或接著劑層的密接性良好地提高。The low melting point metal layer of the shielding film is preferably formed of a metal with a melting point below 300 ° C. If the low-melting-point metal layer of the shielding film is formed of a metal with a melting point of 300 ° C or less, when the grounding member is placed on the shielded printed wiring board, the low-melting-point metal layer of the shielding film is easily softened, which can cause the conductive protrusion of the grounding member The adhesion of the shielding layer or the adhesive layer is improved well.

又，形成屏蔽薄膜之低熔點金屬層的金屬並無特別限定，但宜包含選自於由銦、錫、鉛及鉍所構成群組中之至少一種。 此等金屬具備形成低熔點金屬層時適合的熔點及導電性。In addition, the metal forming the low-melting-point metal layer of the shielding film is not particularly limited, but it is preferable to include at least one selected from the group consisting of indium, tin, lead, and bismuth. These metals have a suitable melting point and conductivity when forming a low-melting metal layer.

又，屏蔽薄膜之低熔點金屬層的厚度宜為0.1~50μm、較佳為0.1~10μm。 若低熔點金屬層之厚度未達0.1μm，因為形成低熔點金屬層之金屬量較少，故將接地構件配置於屏蔽印刷配線板時，接地構件之導電性突起與屏蔽薄膜之屏蔽層或導電層的密接性會變得不易提高。 若屏蔽薄膜之低熔點金屬層厚度超過50μm，則於屏蔽薄膜之低熔點金屬層軟化時，屏蔽層會變得容易變形。 結果，屏蔽薄膜之屏蔽特性會變得容易降低。In addition, the thickness of the low melting point metal layer of the shielding film is preferably 0.1 to 50 μm, preferably 0.1 to 10 μm. If the thickness of the low-melting-point metal layer is less than 0.1 μm, because the amount of metal forming the low-melting-point metal layer is small, when the grounding member is arranged on the shielded printed wiring board, the conductive protrusion of the grounding member and the shielding layer of the shielding film or conductive The adhesion of the layer becomes difficult to improve. If the thickness of the low-melting-point metal layer of the shielding film exceeds 50 μm, the shielding layer will be easily deformed when the low-melting-point metal layer of the shielding film is softened. As a result, the shielding characteristics of the shielding film become easily reduced.

屏蔽薄膜之低熔點金屬層宜包含助焊劑。 藉由屏蔽薄膜之低熔點金屬層包含助焊劑，當構成屏蔽薄膜之低熔點金屬層之金屬軟化時，構成屏蔽薄膜之低熔點金屬層的金屬與接地構件之導電性突起變得容易密接。 其結果，可使屏蔽薄膜之低熔點金屬層與接地構件之導電性突起的密接性更為提高。The low melting point metal layer of the shielding film should preferably contain flux. Since the low-melting-point metal layer of the shielding film contains flux, when the metal constituting the low-melting-point metal layer of the shielding film is softened, the metal constituting the low-melting-point metal layer of the shielding film and the conductive protrusions of the ground member become easily adhered. As a result, the adhesion between the low-melting-point metal layer of the shield film and the conductive protrusion of the ground member can be further improved.

其次，就將接地構件1使用於如下屏蔽印刷配線板150之情形進行說明。 圖9(a)及(b)係示意性顯示使用本發明接地構件之屏蔽印刷配線板之製造方法之一例圖。 圖10係示意性顯示使用本發明接地構件之屏蔽印刷配線板之一例的截面圖。Next, a case where the grounding member 1 is used for shielding the printed wiring board 150 as follows will be described. 9 (a) and (b) are diagrams schematically showing an example of a manufacturing method of a shielded printed wiring board using the grounding member of the present invention. 10 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the ground member of the present invention.

如圖9(a)所示，製造屏蔽印刷配線板150時，首先於基體薄膜160載置屏蔽薄膜170。 基體薄膜160係於基底薄膜161上依序設置包含接地電路162a之印刷電路162與絕緣薄膜163而成的薄膜。 又，屏蔽薄膜170係由接著劑層171、積層於接著劑層171之屏蔽層172及積層於屏蔽層172之絕緣層173構成的薄膜，且屏蔽層172為具有凸部172a及凹部172b之波狀形狀。 再者，屏蔽薄膜170之接著劑層171可具有導電性抑或不具有導電性。As shown in FIG. 9 (a), when manufacturing the shield printed wiring board 150, first, the shield film 170 is placed on the base film 160. The base film 160 is a film formed by sequentially setting a printed circuit 162 including an earth circuit 162a and an insulating film 163 on the base film 161. In addition, the shielding film 170 is a film composed of an adhesive layer 171, a shielding layer 172 laminated on the adhesive layer 171, and an insulating layer 173 laminated on the shielding layer 172, and the shielding layer 172 is a wave having a convex portion 172a and a concave portion 172b Shape. Furthermore, the adhesive layer 171 of the shielding film 170 may or may not be conductive.

接著，如圖9(b)所示，藉由加壓可製造屏蔽印刷配線板150。 於該加壓時，屏蔽薄膜170之屏蔽層172之凸部172a推開接著劑層171而連接於基體薄膜160之接地電路162a。Next, as shown in FIG. 9 (b), the shielded printed wiring board 150 can be manufactured by pressing. During this pressurization, the convex portion 172a of the shielding layer 172 of the shielding film 170 pushes away the adhesive layer 171 and is connected to the ground circuit 162a of the base film 160.

藉此，可製造如圖10所示的屏蔽印刷配線板150。 即，如圖10所示，屏蔽印刷配線板150由基體薄膜160與屏蔽薄膜170構成。 於屏蔽印刷配線板150中，基體薄膜160係於基底薄膜161上依序設置包含接地電路162a之印刷電路162與絕緣薄膜163而成的薄膜。 又，屏蔽薄膜170係由接著劑層171、積層於接著劑層171之屏蔽層172及積層於屏蔽層172之絕緣層173構成的薄膜，且屏蔽層172為具有凸部172a及凹部172b之波狀形狀。 然後，於屏蔽印刷配線板150中，屏蔽薄膜170係以屏蔽薄膜170之接著劑層171與基體薄膜160相接之方式被覆基體薄膜160。 又，屏蔽層172之凸部172a的一部分從接著劑層171露出，而與基體薄膜160之接地電路162a接觸。With this, the shielded printed wiring board 150 shown in FIG. 10 can be manufactured. That is, as shown in FIG. 10, the shield printed wiring board 150 is composed of the base film 160 and the shield film 170. In the shielded printed wiring board 150, the base film 160 is a film formed by sequentially setting the printed circuit 162 including the ground circuit 162a and the insulating film 163 on the base film 161. In addition, the shielding film 170 is a film composed of an adhesive layer 171, a shielding layer 172 laminated on the adhesive layer 171, and an insulating layer 173 laminated on the shielding layer 172, and the shielding layer 172 is a wave having a convex portion 172a and a concave portion 172b Shape. Then, in the shield printed wiring board 150, the shield film 170 covers the base film 160 in such a manner that the adhesive layer 171 of the shield film 170 is in contact with the base film 160. In addition, a part of the convex portion 172a of the shielding layer 172 is exposed from the adhesive layer 171, and is in contact with the ground circuit 162a of the base film 160.

接著，使用圖式說明將接地構件1使用於屏蔽印刷配線板150之情形。 圖11係示意性顯示將本發明接地構件使用於屏蔽印刷配線板時之一例的示意圖。 如圖11所示，接地構件1係以使接地構件1之導電性突起20貫穿屏蔽薄膜170之絕緣層173的方式，壓抵於屏蔽印刷配線板150而配置。 然後，接地構件1之導電性突起20就會與屏蔽薄膜170之屏蔽層172接觸。Next, the case where the ground member 1 is used for shielding the printed wiring board 150 will be described using drawings. FIG. 11 is a schematic diagram schematically showing an example when the grounding member of the present invention is used for shielding a printed wiring board. As shown in FIG. 11, the ground member 1 is arranged so that the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 173 of the shield film 170 and is pressed against the shield printed wiring board 150. Then, the conductive protrusion 20 of the ground member 1 comes into contact with the shielding layer 172 of the shielding film 170.

如上所述，因為屏蔽薄膜170之屏蔽層172與基體薄膜160之接地電路162a接觸，故接地構件1之外部連接構件10與基體薄膜160之接地電路162a就會電性連接。 而且，接地構件1之外部連接構件10就會連接於外部接地GND。As described above, since the shielding layer 172 of the shielding film 170 contacts the ground circuit 162a of the base film 160, the external connection member 10 of the ground member 1 and the ground circuit 162a of the base film 160 are electrically connected. Furthermore, the external connection member 10 of the ground member 1 is connected to the external ground GND.

像這樣將接地構件1配置於屏蔽印刷配線板150，故不需要於屏蔽印刷配線板150的屏蔽薄膜170之絕緣層173預先設孔等，即可於任意位置配置接地構件1。Since the ground member 1 is disposed on the shielded printed wiring board 150 in this manner, it is not necessary to provide holes or the like in advance in the insulating layer 173 of the shielding film 170 of the shielded printed wiring board 150, and the ground member 1 can be disposed at any position.

又，於接地構件1中，於導電性突起20表面形成有低熔點金屬層21。 將接地構件1配置於屏蔽印刷配線板150時、或於配置後的零件安裝步驟中亦會進行加熱。藉由該加熱，低熔點金屬層21會軟化，而可使接地構件1之導電性突起20與屏蔽薄膜170之屏蔽層172的密接性提高。 因此，縱使是對使用接地構件1之屏蔽印刷配線板150反覆進行加熱及冷卻而安裝零件的情況，於接地構件1之導電性突起20與屏蔽薄膜170之屏蔽層172間亦不易發生偏移。其結果，可抑制基體薄膜160之接地電路162a-外部接地GND間的電阻增加。In addition, in the ground member 1, a low-melting-point metal layer 21 is formed on the surface of the conductive protrusion 20. When the grounding member 1 is arranged on the shielded printed wiring board 150 or in the component mounting step after the arrangement, heating is also performed. By this heating, the low-melting-point metal layer 21 is softened, and the adhesion between the conductive protrusion 20 of the ground member 1 and the shielding layer 172 of the shielding film 170 can be improved. Therefore, even if the shield printed circuit board 150 using the grounding member 1 is repeatedly heated and cooled to mount components, the conductive protrusion 20 of the grounding member 1 and the shielding layer 172 of the shielding film 170 are less likely to shift. As a result, the increase in resistance between the ground circuit 162a of the base film 160 and the external ground GND can be suppressed.

於屏蔽印刷配線板150中，理想的基體薄膜160與說明上述屏蔽印刷配線板50中所記載的基體薄膜60相同。In the shield printed wiring board 150, the ideal base film 160 is the same as the base film 60 described in the shield printed wiring board 50 described above.

於屏蔽印刷配線板150中，構成屏蔽薄膜170之屏蔽層172及絕緣層173的理想材料與說明上述屏蔽印刷配線板50中所記載的屏蔽薄膜70之屏蔽層72及絕緣層73相同。In the shielded printed wiring board 150, the ideal materials constituting the shielding layer 172 and the insulating layer 173 of the shielding film 170 are the same as the shielding layer 72 and the insulating layer 73 of the shielding film 70 described in the shielding printed wiring board 50 described above.

於屏蔽印刷配線板150中，構成屏蔽薄膜170之屏蔽薄膜170的接著劑層171的理想材料並無特別限定，但宜為丙烯酸系樹脂、環氧系樹脂、矽系樹脂、熱塑性彈性體系樹脂、橡膠系樹脂、聚酯系樹脂、胺甲酸乙酯系樹脂等。 又，於接著劑層171中亦可包含脂肪酸烴樹脂、C5/C9混合樹脂、松香、松香衍生物、萜烯樹脂、芳香族系烴樹脂、熱反應性樹脂等黏著性賦予劑。若包含此等黏著性賦予劑，則可使接著劑層171之黏著性提高。In the shielded printed wiring board 150, the ideal material of the adhesive layer 171 constituting the shielding film 170 of the shielding film 170 is not particularly limited, but it is preferably acrylic resin, epoxy resin, silicon resin, thermoplastic elastomer resin, Rubber-based resin, polyester-based resin, urethane-based resin, etc. In addition, the adhesive agent layer 171 may contain an adhesiveness-imparting agent such as fatty acid hydrocarbon resin, C5 / C9 mixed resin, rosin, rosin derivative, terpene resin, aromatic hydrocarbon resin, and heat-reactive resin. If such an adhesiveness-imparting agent is included, the adhesiveness of the adhesive layer 171 can be improved.

又，於屏蔽印刷配線板150中，以屏蔽薄膜170而言，於屏蔽層172與絕緣層173間可形成有屏蔽薄膜170之低熔點金屬層，且屏蔽薄膜170之低熔點金屬層可與接地構件1之導電性突起20連接。 若為如此構造，可使接地構件1之導電性突起20與屏蔽薄膜170之屏蔽層172的密接性提高。In addition, in the shielded printed wiring board 150, in terms of the shielding film 170, a low melting point metal layer of the shielding film 170 may be formed between the shielding layer 172 and the insulating layer 173, and the low melting point metal layer of the shielding film 170 may be grounded The conductive protrusions 20 of the member 1 are connected. With such a structure, the adhesion between the conductive protrusion 20 of the ground member 1 and the shielding layer 172 of the shielding film 170 can be improved.

其次，就將接地構件1使用於如下屏蔽印刷配線板250之情形進行說明。 圖12係示意性顯示使用本發明接地構件之屏蔽印刷配線板之一例的截面圖。Next, a case where the grounding member 1 is used for shielding the printed wiring board 250 as follows will be described. 12 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the ground member of the present invention.

如圖12所示，屏蔽印刷配線板250由基體薄膜260與屏蔽薄膜270構成。 於屏蔽印刷配線板250中，基體薄膜260係於基底薄膜261上依序設置包含接地電路262a之印刷電路262與絕緣薄膜263而成的薄膜。 又，屏蔽薄膜270係由接著劑層271、積層於接著劑層271之屏蔽層272及積層於屏蔽層272之絕緣層273構成的薄膜。 然後，於屏蔽印刷配線板250中，屏蔽薄膜270係以屏蔽薄膜270之接著劑層271與基體薄膜260相接之方式被覆基體薄膜260。 又，屏蔽薄膜270之接著劑層271不具有導電性，印刷電路262與屏蔽層272未電性連接。As shown in FIG. 12, the shield printed wiring board 250 is composed of a base film 260 and a shield film 270. In the shielded printed wiring board 250, the base film 260 is a film formed by sequentially setting the printed circuit 262 including the ground circuit 262a and the insulating film 263 on the base film 261. The shielding film 270 is a film composed of an adhesive layer 271, a shielding layer 272 laminated on the adhesive layer 271, and an insulating layer 273 laminated on the shielding layer 272. Then, in the shield printed wiring board 250, the shield film 270 covers the base film 260 in such a manner that the adhesive layer 271 of the shield film 270 is in contact with the base film 260. In addition, the adhesive layer 271 of the shielding film 270 has no conductivity, and the printed circuit 262 and the shielding layer 272 are not electrically connected.

接著，使用圖式說明將接地構件1使用於屏蔽印刷配線板250之情形。 圖13係示意性顯示將本發明接地構件使用於屏蔽印刷配線板時之一例的示意圖。 如圖13所示，接地構件1係以接地構件1之導電性突起20貫穿屏蔽薄膜270之絕緣層273且與屏蔽層272連接的方式，壓抵於屏蔽印刷配線板250而配置。 藉此，接地構件1之導電性突起20與屏蔽薄膜270之屏蔽層272就會接觸。因此，可將接地構件1之外部連接構件10與屏蔽薄膜270之屏蔽層272電性連接。 而且，接地構件1之外部連接構件10就會連接於外部接地GND。Next, a case where the ground member 1 is used for shielding the printed wiring board 250 will be described using drawings. FIG. 13 is a schematic diagram showing an example when the grounding member of the present invention is used for shielding a printed wiring board. As shown in FIG. 13, the grounding member 1 is arranged so that the conductive protrusion 20 of the grounding member 1 penetrates the insulating layer 273 of the shielding film 270 and is connected to the shielding layer 272 and is pressed against the shielded printed wiring board 250. As a result, the conductive protrusion 20 of the ground member 1 and the shielding layer 272 of the shielding film 270 are in contact. Therefore, the external connection member 10 of the ground member 1 and the shielding layer 272 of the shielding film 270 can be electrically connected. Furthermore, the external connection member 10 of the ground member 1 is connected to the external ground GND.

於如此配置有接地構件1之屏蔽印刷配線板250中，因為屏蔽薄膜270之屏蔽層272會與外部接地GND電性連接，故屏蔽層272可以遮蔽電磁波之電磁波屏蔽之形式良好地起作用。In the shielded printed wiring board 250 configured with the ground member 1 in this way, since the shielding layer 272 of the shielding film 270 is electrically connected to the external ground GND, the shielding layer 272 can shield electromagnetic waves in the form of electromagnetic wave shielding functioning well.

像這樣將接地構件1配置於屏蔽印刷配線板250，故不需要於屏蔽印刷配線板250的屏蔽薄膜270之絕緣層273預先設孔等，即可於任意位置配置接地構件1。Since the ground member 1 is arranged on the shielded printed wiring board 250 in this way, it is not necessary to provide holes or the like in advance in the insulating layer 273 of the shielding film 270 of the shielded printed wiring board 250, and the ground member 1 can be arranged at any position.

又，於接地構件1中，於導電性突起20表面形成有低熔點金屬層21。 將接地構件1配置於屏蔽印刷配線板250時、或於配置後的零件安裝步驟中亦會進行加熱。藉由該加熱，低熔點金屬層21會軟化，而可使接地構件1之導電性突起20與屏蔽薄膜270之屏蔽層272的密接性提高。 因此，縱使是對使用接地構件1之屏蔽印刷配線板250反覆進行加熱及冷卻以安裝零件的情況，於接地構件1之導電性突起20與屏蔽薄膜270之屏蔽層272間亦不易發生偏移。In addition, in the ground member 1, a low-melting-point metal layer 21 is formed on the surface of the conductive protrusion 20. When the grounding member 1 is arranged on the shielded printed wiring board 250 or in the component mounting step after the arrangement, heating is also performed. By this heating, the low-melting-point metal layer 21 is softened, and the adhesion between the conductive protrusion 20 of the ground member 1 and the shielding layer 272 of the shielding film 270 can be improved. Therefore, even if the shielded printed wiring board 250 using the grounding member 1 is repeatedly heated and cooled to mount parts, the conductive protrusion 20 of the grounding member 1 and the shielding layer 272 of the shielding film 270 are unlikely to shift.

又，接著劑層271因為未含有導電性微粒子，故可減低接著劑層271的原材料費，並可使接著劑層271薄型化。In addition, since the adhesive layer 271 does not contain conductive fine particles, the raw material cost of the adhesive layer 271 can be reduced, and the adhesive layer 271 can be made thin.

於屏蔽印刷配線板250中，理想的基體薄膜260與說明上述屏蔽印刷配線板50中所記載的基體薄膜60相同。In the shield printed wiring board 250, the ideal base film 260 is the same as the base film 60 described in the shield printed wiring board 50 described above.

於屏蔽印刷配線板250中，構成屏蔽薄膜270之屏蔽層272及絕緣層273的理想材料與說明上述屏蔽印刷配線板50中所記載的屏蔽薄膜70之屏蔽層72及絕緣層73相同。In the shielded printed wiring board 250, the ideal materials constituting the shielding layer 272 and the insulating layer 273 of the shielding film 270 are the same as the shielding layer 72 and the insulating layer 73 of the shielding film 70 described in the shielding printed wiring board 50 described above.

於屏蔽印刷配線板250中，構成屏蔽薄膜270的屏蔽薄膜270之接著劑層271理想材料並無特別限定，但宜為丙烯酸系樹脂、環氧系樹脂、矽系樹脂、熱塑性彈性體系樹脂、橡膠系樹脂、聚酯系樹脂、胺甲酸乙酯系樹脂等。 又，於接著劑層271中亦可包含脂肪酸烴樹脂、C5/C9混合樹脂、松香、松香衍生物、萜烯樹脂、芳香族系烴樹脂、熱反應性樹脂等黏著性賦予劑。若包含此等黏著性賦予劑，則可使接著劑層271之黏著性提高。In the shielded printed wiring board 250, the ideal material of the adhesive layer 271 of the shielding film 270 constituting the shielding film 270 is not particularly limited, but it is preferably acrylic resin, epoxy resin, silicon resin, thermoplastic elastomer resin, rubber Resin, polyester resin, urethane resin, etc. In addition, the adhesive agent layer 271 may contain an adhesiveness-imparting agent such as fatty acid hydrocarbon resin, C5 / C9 mixed resin, rosin, rosin derivative, terpene resin, aromatic hydrocarbon resin, and heat-reactive resin. If such an adhesiveness-imparting agent is included, the adhesiveness of the adhesive layer 271 can be improved.

又，於屏蔽印刷配線板250中，以屏蔽薄膜270而言，於屏蔽層272與絕緣層273之間可形成有屏蔽薄膜270之低熔點金屬層，且屏蔽薄膜270之低熔點金屬層亦可與接地構件1之導電性突起20連接。 若為如此構造，可使接地構件1之導電性突起20與屏蔽薄膜270之屏蔽層272的密接性提高。In addition, in the shielded printed wiring board 250, in terms of the shielding film 270, a low melting point metal layer of the shielding film 270 may be formed between the shielding layer 272 and the insulating layer 273, and the low melting point metal layer of the shielding film 270 may also be It is connected to the conductive protrusion 20 of the ground member 1. With such a structure, the adhesion between the conductive protrusion 20 of the ground member 1 and the shielding layer 272 of the shielding film 270 can be improved.

其次，就將接地構件1使用於如下的屏蔽印刷配線板350之情形進行說明。 圖14係示意性顯示使用本發明接地構件之屏蔽印刷配線板之一例的截面圖。Next, the case where the grounding member 1 is used for the shielded printed wiring board 350 as follows will be described. 14 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the ground member of the present invention.

如圖14所示，屏蔽印刷配線板350由基體薄膜360與屏蔽薄膜370構成。 於屏蔽印刷配線板350中，基體薄膜360係於基底薄膜361上依序設置包含接地電路362a之印刷電路362與絕緣薄膜363而成的薄膜。 又，屏蔽薄膜370係由屏蔽層372及積層於屏蔽層372之絕緣層373構成的薄膜。 然後，於屏蔽印刷配線板350中，屏蔽薄膜370係以屏蔽薄膜370之屏蔽層372與基體薄膜360相接之方式被覆基體薄膜360。 再者，屏蔽薄膜370之屏蔽層372係導電性接著劑層。As shown in FIG. 14, the shield printed wiring board 350 is composed of a base film 360 and a shield film 370. In the shielded printed wiring board 350, the base film 360 is a film formed by sequentially setting the printed circuit 362 including the ground circuit 362a and the insulating film 363 on the base film 361. The shielding film 370 is a film composed of a shielding layer 372 and an insulating layer 373 laminated on the shielding layer 372. Then, in the shield printed wiring board 350, the shield film 370 covers the base film 360 in such a manner that the shield layer 372 of the shield film 370 is in contact with the base film 360. Furthermore, the shielding layer 372 of the shielding film 370 is a conductive adhesive layer.

接著，使用圖式說明將接地構件1使用於屏蔽印刷配線板350之情形。 圖15係示意性顯示將本發明接地構件使用於屏蔽印刷配線板時之一例的示意圖。 如圖15所示，接地構件1係以接地構件1之導電性突起20貫穿屏蔽薄膜370之絕緣層373的方式，壓抵於屏蔽印刷配線板350而配置。 然後，接地構件1之導電性突起20就會與屏蔽薄膜370之屏蔽層372接觸。Next, the case where the ground member 1 is used for shielding the printed wiring board 350 will be described using drawings. FIG. 15 is a schematic diagram schematically showing an example when the grounding member of the present invention is used for shielding a printed wiring board. As shown in FIG. 15, the ground member 1 is arranged such that the conductive protrusion 20 of the ground member 1 penetrates the insulating layer 373 of the shield film 370 and is pressed against the shield printed wiring board 350. Then, the conductive protrusion 20 of the ground member 1 comes into contact with the shielding layer 372 of the shielding film 370.

如上所述，因為屏蔽薄膜370之屏蔽層372與基體薄膜360之接地電路362a接觸，故接地構件1之外部連接構件10與基體薄膜360之接地電路362a就會電性連接。 而且，接地構件1之外部連接構件10就會連接於外部接地GND。As described above, since the shield layer 372 of the shield film 370 is in contact with the ground circuit 362a of the base film 360, the external connection member 10 of the ground member 1 and the ground circuit 362a of the base film 360 are electrically connected. Furthermore, the external connection member 10 of the ground member 1 is connected to the external ground GND.

像這樣將接地構件1配置於屏蔽印刷配線板350，故不需要於屏蔽印刷配線板350的屏蔽薄膜370之絕緣層373預先設孔等，即可於任意位置配置接地構件1。Since the grounding member 1 is arranged on the shielded printed wiring board 350 in this way, it is not necessary to provide holes or the like in advance in the insulating layer 373 of the shielding film 370 of the shielded printed wiring board 350, and the grounding member 1 can be arranged at an arbitrary position.

又，於接地構件1中，於導電性突起20表面形成有低熔點金屬層21。 將接地構件1配置於屏蔽印刷配線板350時、或於配置後的零件安裝步驟中亦會進行加熱。藉由該加熱，低熔點金屬層21會軟化，而可使接地構件1之導電性突起20與屏蔽薄膜370之屏蔽層372的密接性提高。 因此，縱使是對使用接地構件1之屏蔽印刷配線板350反覆進行加熱及冷卻而安裝零件的情況，於接地構件1之導電性突起20與屏蔽薄膜370之屏蔽層372間亦不易發生偏移。其結果，可抑制基體薄膜360之接地電路362a-外部接地GND間的電阻增加。In addition, in the ground member 1, a low-melting-point metal layer 21 is formed on the surface of the conductive protrusion 20. When the grounding member 1 is arranged on the shielded printed wiring board 350 or in the component mounting step after the arrangement, heating is also performed. By this heating, the low-melting-point metal layer 21 is softened, and the adhesion between the conductive protrusion 20 of the ground member 1 and the shielding layer 372 of the shielding film 370 can be improved. Therefore, even if the shield printed circuit board 350 using the ground member 1 is repeatedly heated and cooled to mount components, the conductive protrusion 20 of the ground member 1 and the shield layer 372 of the shield film 370 are less likely to shift. As a result, an increase in resistance between the ground circuit 362a of the base film 360 and the external ground GND can be suppressed.

又，於屏蔽印刷配線板350中，因為屏蔽薄膜370之屏蔽層372為導電性接著劑層，故屏蔽薄膜370之屏蔽層372兼具用以將屏蔽薄膜370接著於基體薄膜360的功能、及用以屏蔽電磁波的功能。 因此，即使在用以與基體薄膜360之接著上不使用接著劑等，仍可使屏蔽薄膜370容易地接著於基體薄膜360。Furthermore, in the shielded printed wiring board 350, since the shielding layer 372 of the shielding film 370 is a conductive adhesive layer, the shielding layer 372 of the shielding film 370 also has the function of adhering the shielding film 370 to the base film 360, and Used to shield electromagnetic waves. Therefore, even if an adhesive or the like is not used for bonding to the base film 360, the shielding film 370 can be easily adhered to the base film 360.

於屏蔽印刷配線板350中，理想的基體薄膜360與說明上述屏蔽印刷配線板50中所記載的基體薄膜60相同。In the shield printed wiring board 350, an ideal base film 360 is the same as the base film 60 described in the shield printed wiring board 50 described above.

於屏蔽印刷配線板350中，構成屏蔽薄膜370之絕緣層373的理想材料與說明上述屏蔽印刷配線板50中所記載的屏蔽薄膜70之絕緣層73相同。In the shield printed wiring board 350, the ideal material constituting the insulating layer 373 of the shield film 370 is the same as the insulating layer 73 of the shield film 70 described in the shield printed wiring board 50 described above.

於屏蔽印刷配線板350中，屏蔽薄膜370之屏蔽層372係由樹脂和導電性微粒子構成的導電性接著劑層。In the shielded printed wiring board 350, the shielding layer 372 of the shielding film 370 is a conductive adhesive layer composed of resin and conductive fine particles.

作為構成屏蔽層372之樹脂並無特別限定，但宜為丙烯酸系樹脂、環氧系樹脂、矽系樹脂、熱塑性彈性體系樹脂、橡膠系樹脂、聚酯系樹脂、胺甲酸乙酯系樹脂等。 又，於屏蔽層372中亦可包含脂肪酸烴樹脂、C5/C9混合樹脂、松香、松香衍生物、萜烯樹脂、芳香族系烴樹脂、熱反應性樹脂等黏著性賦予劑。若包含此等黏著性賦予劑，則可使屏蔽層372之黏著性提高。The resin constituting the shielding layer 372 is not particularly limited, but is preferably an acrylic resin, an epoxy resin, a silicon resin, a thermoplastic elastomer resin, a rubber resin, a polyester resin, a urethane resin, or the like. In addition, the shielding layer 372 may contain an adhesiveness-imparting agent such as fatty acid hydrocarbon resin, C5 / C9 mixed resin, rosin, rosin derivative, terpene resin, aromatic hydrocarbon resin, and heat-reactive resin. If such an adhesion-imparting agent is included, the adhesion of the shielding layer 372 can be improved.

作為構成屏蔽層372之導電性微粒子並無特別限定，例如有銅粉、銀粉、鎳粉、銀包銅粉(Ag包Cu粉)、金包銅粉、銀包鎳粉(Ag包Ni粉)、金包鎳粉，此等金屬粉可利用霧化法、羰基法等製作。又，除上述外，亦可使用於金屬粉被覆樹脂的粒子、於樹脂被覆金屬粉的粒子。再者，導電性微粒子宜為Ag包Cu粉或Ag包Ni粉。其理由為可利用便宜的材料獲得導電性穩定的導電性微粒子。 再者，導電性微粒子的形狀並不需限定為球狀，例如亦可為樹枝狀、片狀、尖峰狀、棒狀、纖維狀、針狀等。The conductive fine particles constituting the shielding layer 372 are not particularly limited, and examples include copper powder, silver powder, nickel powder, silver-coated copper powder (Ag-coated Cu powder), gold-coated copper powder, and silver-coated nickel powder (Ag-coated Ni powder) , Gold-coated nickel powder, these metal powders can be produced by atomization method, carbonyl method, etc. In addition to the above, particles coated with resin by metal powder and particles coated with resin by metal powder may also be used. Furthermore, the conductive fine particles are preferably Ag-coated Cu powder or Ag-coated Ni powder. The reason is that conductive fine particles with stable conductivity can be obtained from inexpensive materials. In addition, the shape of the conductive fine particles does not need to be limited to a spherical shape, and for example, it may be dendritic, sheet-like, spike-like, rod-like, fibrous, or needle-like.

進而，屏蔽薄膜370之屏蔽層372宜為等向性導電性接著劑層。 此時，導電性微粒子相對於屏蔽層總體量，宜以超過39重量%且95重量%以下之範圍來含有。導電性微粒子之平均粒徑宜為2~20μm。Furthermore, the shielding layer 372 of the shielding film 370 is preferably an isotropic conductive adhesive layer. In this case, the conductive fine particles are preferably contained in a range of more than 39% by weight and 95% by weight or less relative to the total amount of the shield layer. The average particle size of the conductive fine particles is preferably 2-20 μm.

又，於屏蔽印刷配線板350中，以屏蔽薄膜370而言，屏蔽層372與絕緣層373之間亦可形成有屏蔽薄膜370之低熔點金屬層，且屏蔽薄膜370之低熔點金屬層亦可與接地構件1之導電性突起20連接。 若為如此構造，可使接地構件1之導電性突起20與屏蔽薄膜370之屏蔽層372的密接性提高。Furthermore, in the shielded printed wiring board 350, in terms of the shielding film 370, a low melting point metal layer of the shielding film 370 may be formed between the shielding layer 372 and the insulating layer 373, and the low melting point metal layer of the shielding film 370 may also be It is connected to the conductive protrusion 20 of the ground member 1. With such a structure, the adhesion between the conductive protrusion 20 of the ground member 1 and the shielding layer 372 of the shielding film 370 can be improved.

目前為止說明的上述使用接地構件1之屏蔽印刷配線板150、使用接地構件1之屏蔽印刷配線板250及使用接地構件1之屏蔽印刷配線板350為本發明屏蔽印刷配線板的一例。The above-described shielded printed wiring board 150 using the grounding member 1, the shielded printed wiring board 250 using the grounding member 1, and the shielded printed wiring board 350 using the grounding member 1 described above are examples of the shielded printed wiring board of the present invention.

又，上述使用接地構件1之屏蔽印刷配線板150、使用接地構件1之屏蔽印刷配線板250或使用接地構件1之屏蔽印刷配線板350，可藉由如下方法製造，即：在製造上述使用接地構件1之屏蔽印刷配線板50的方法中的「(1)屏蔽薄膜載置步驟」中，準備屏蔽薄膜170、屏蔽薄膜270或屏蔽薄膜370來取代屏蔽薄膜70。In addition, the above-mentioned shielded printed wiring board 150 using the grounding member 1, the shielding printed wiring board 250 using the grounding member 1, or the shielding printed wiring board 350 using the grounding member 1 can be manufactured by the following method: In the method of shielding the printed wiring board 50 of the component 1, in the "(1) shielding film placing step", a shielding film 170, a shielding film 270, or a shielding film 370 are prepared instead of the shielding film 70.

(第二實施形態) 接著，說明本發明接地構件之其他態樣之第二實施形態的接地構件。(Second Embodiment) Next, a ground member of a second embodiment of another aspect of the ground member of the present invention will be described.

圖16係示意性顯示本發明接地構件之一例的截面圖。 如圖16所示，接地構件101由具有導電性之外部連接構件110構成，具有第1主面111及位於第1主面111相反側之第2主面112。 外部連接構件110係以第1主面111側突出之方式彎曲多數次，突出的外部連接構件110的一部分會成為導電性突起120。 進而，於導電性突起120表面、即外部連接構件110的第1主面111形成有低熔點金屬層121。16 is a cross-sectional view schematically showing an example of the grounding member of the present invention. As shown in FIG. 16, the ground member 101 is composed of a conductive external connection member 110 and has a first main surface 111 and a second main surface 112 located on the opposite side of the first main surface 111. The external connection member 110 is bent many times so that the first main surface 111 side protrudes, and a part of the protruding external connection member 110 becomes the conductive protrusion 120. Furthermore, a low-melting-point metal layer 121 is formed on the surface of the conductive protrusion 120, that is, the first main surface 111 of the external connection member 110.

此種形狀的接地構件101，只要將外部連接構件110彎折即可輕易地製作。The ground member 101 having such a shape can be easily manufactured by bending the external connection member 110.

接地構件101中之外部連接構件110的理想材料、形成低熔點金屬層121的理想金屬等，與上述接地構件1中之外部連接構件10的理想材料、形成低熔點金屬層21的理想金屬等相同。The ideal material of the external connection member 110 in the ground member 101, the ideal metal forming the low melting point metal layer 121, etc. are the same as the ideal material of the external connection member 10 in the above ground member 1, the ideal metal forming the low melting point metal layer 21, etc. .

接著，使用圖式說明將接地構件101使用於上述屏蔽印刷配線板50之情形。 圖17係示意性顯示將本發明接地構件使用於屏蔽印刷配線板時之一例的示意圖。 如圖17所示，接地構件101係以接地構件101之導電性突起120貫穿屏蔽薄膜70之絕緣層73及屏蔽層72的方式，壓抵於屏蔽印刷配線板50而配置。 然後，接地構件101之導電性突起120就會與屏蔽薄膜70之接著劑層71及屏蔽層72接觸。Next, the case where the ground member 101 is used for the above-mentioned shielded printed wiring board 50 will be described using drawings. FIG. 17 is a schematic diagram schematically showing an example when the grounding member of the present invention is used for shielding a printed wiring board. As shown in FIG. 17, the grounding member 101 is arranged such that the conductive protrusion 120 of the grounding member 101 penetrates the insulating layer 73 and the shielding layer 72 of the shielding film 70 and presses against the shielded printed wiring board 50. Then, the conductive protrusion 120 of the ground member 101 comes into contact with the adhesive layer 71 and the shield layer 72 of the shield film 70.

如上所述，因為屏蔽薄膜70之接著劑層71與基體薄膜60之接地電路62a接觸，故接地構件101之外部連接構件110與基體薄膜60之接地電路62a就會電性連接。 而且，接地構件101之外部連接構件110就會連接於外部接地GND。As described above, since the adhesive layer 71 of the shield film 70 is in contact with the ground circuit 62a of the base film 60, the external connection member 110 of the ground member 101 and the ground circuit 62a of the base film 60 are electrically connected. Furthermore, the external connection member 110 of the ground member 101 is connected to the external ground GND.

[實施例] 以下顯示更具體地說明本發明之實施例，但本發明並不限定於此等實施例。[Examples] The following shows more specifically examples of the present invention, but the present invention is not limited to these examples.

(實施例1-1) (1)金屬箔準備步驟 首先，準備厚度為35μm的銅箔。(Example 1-1) (1) Metal foil preparation procedure First, copper foil with a thickness of 35 µm was prepared.

(2)導電性突起形成步驟 接著，以抗蝕劑遮蔽銅箔的一主面。 然後，使用硫酸/過氧化氫系蝕刻液作為蝕刻液蝕刻銅箔，形成圓柱形的導電性突起。 所形成的導電性突起係高度為25μm、底面直徑為30μm，導電性突起彼此的間距為90μm。(2) Step of forming conductive bumps Next, one main surface of the copper foil is covered with a resist. Then, the copper foil was etched using a sulfuric acid / hydrogen peroxide-based etchant as an etchant to form cylindrical conductive protrusions. The height of the formed conductive protrusions was 25 μm, the diameter of the bottom surface was 30 μm, and the pitch between the conductive protrusions was 90 μm.

(3)低熔點金屬層形成步驟 接著，藉由電解鍍錫於導電性突起鍍覆錫，形成低熔點金屬層。 低熔點金屬層之厚度為2μm。(3) Step of forming a low-melting-point metal layer Next, tin is electroplated on the conductive bumps to form a low-melting-point metal layer. The thickness of the low melting point metal layer is 2 μm.

將鍍覆後的銅箔切成縱×橫=10mm×10mm，製成實施例1-1的接地構件。The plated copper foil was cut into vertical × horizontal = 10 mm × 10 mm to prepare the grounding member of Example 1-1.

(實施例1-2)~(實施例1-36)及(比較例1-1)~(比較例1-15) 除了將導電性突起之底面直徑、導電性突起彼此之間距寬度、切割後的接地構件尺寸如表1及2所示般變更外，與實施例1-1相同方法製成實施例1-2~實施例1-36及比較例1-1~比較例1-15的接地構件。 又，除了不設置Sn鍍覆層、將導電性突起之底面直徑、導電性突起彼此之間距寬度、切割後的接地構件尺寸如表2所示般變更外，與實施例1-1相同方法製成比較例1-1~比較例1-15的接地構件。(Example 1-2) ~ (Example 1-36) and (Comparative Example 1-1) ~ (Comparative Example 1-15) In addition to the diameter of the bottom surface of the conductive protrusions, the width of the distance between the conductive protrusions, after cutting The dimensions of the grounding member are changed as shown in Tables 1 and 2, and the grounding of Examples 1-2 to 1-36 and Comparative Examples 1-1 to 1-15 are made in the same manner as Example 1-1. member. In addition, except that the Sn plating layer was not provided, the diameter of the bottom surface of the conductive protrusions, the width between the conductive protrusions, and the size of the ground member after cutting were changed as shown in Table 2, it was produced in the same manner as in Example 1-1 The grounding members of Comparative Examples 1-1 to 1-15 were prepared.

[表1] [Table 1]

[表2] [Table 2]

(實施例2-1) 使用實施例1-1的接地構件，以如下記載的方法製造實施例2-1的屏蔽印刷配線板。(Example 2-1) Using the grounding member of Example 1-1, the shielded printed wiring board of Example 2-1 was manufactured by the method described below.

(1)屏蔽薄膜載置步驟 首先，準備於基底薄膜上依序設置包含接地電路之印刷電路與絕緣薄膜而成的基體薄膜。 於基體薄膜中，基底薄膜由聚醯亞胺構成，接地電路及印刷電路由銅構成，絕緣薄膜由聚醯亞胺構成。 又，於絕緣薄膜形成有用以使印刷電路局部露出的孔部。(1) Mounting step of shielding film First, prepare a base film formed by sequentially placing a printed circuit including an earth circuit and an insulating film on the base film. In the base film, the base film is made of polyimide, the ground circuit and the printed circuit are made of copper, and the insulating film is made of polyimide. In addition, holes are formed in the insulating film to partially expose the printed circuit.

又，準備依序積層有各向異性導電性接著劑層、屏蔽層及絕緣層的屏蔽薄膜。 各向異性導電性接著劑層由雙酚A型環氧樹脂及平均粒徑10μm的銅微粒子構成，其等的重量比為雙酚A型環氧樹脂：銅微粒子=100：47(換算成重量份)。又，各向異性導電性接著劑層之厚度為9μm。 又，屏蔽層由銅構成，其厚度為2μm。 又，絕緣層由環氧樹脂構成，其厚度為6μm。In addition, a shielding film in which an anisotropic conductive adhesive layer, a shielding layer, and an insulating layer are sequentially stacked is prepared. The anisotropic conductive adhesive layer is composed of bisphenol A epoxy resin and copper fine particles with an average particle size of 10 μm, and the equivalent weight ratio is bisphenol A epoxy resin: copper fine particles = 100: 47 Copies). In addition, the thickness of the anisotropic conductive adhesive layer was 9 μm. In addition, the shield layer is made of copper, and its thickness is 2 μm. In addition, the insulating layer is made of epoxy resin, and its thickness is 6 μm.

接著，將屏蔽薄膜以各向異性導電性接著劑層連接於基體薄膜上之方式載置於基體薄膜上。Next, the shielding film is placed on the base film such that the anisotropic conductive adhesive layer is connected to the base film.

(2)接地構件配置步驟 接著，將實施例1-1的接地構件以其導電性突起朝向屏蔽薄膜之絕緣層側之方式配置於屏蔽薄膜。(2) Grounding member arrangement step Next, the grounding member of Example 1-1 was placed on the shielding film with its conductive protrusions facing the insulating layer side of the shielding film.

(3)加壓步驟 然後，為了使實施例1-1的接地構件之外部連接構件與基體薄膜之接地電路電性連接，加壓接地構件，以使接地構件之導電性突起貫通屏蔽薄膜之絕緣層。 加壓時之溫度為180℃、壓力為2MPa。(3) Pressing step Then, in order to electrically connect the external connection member of the ground member of Example 1-1 to the ground circuit of the base film, the ground member is pressed so that the conductive protrusion of the ground member penetrates the insulation of the shielding film Floor. The temperature during pressurization is 180 ° C and the pressure is 2MPa.

(4)加熱步驟 然後，將接地構件、屏蔽薄膜及配線板投入加熱步驟(回焊步驟)，該加熱步驟係在260℃×5秒的條件下進行加熱。 又，於該加熱步驟中，係使實施例1-1之接地構件中形成在導電性突起表面的低熔點金屬層軟化，藉由低熔點金屬層而使接地構件之導電性突起與屏蔽薄膜之各向異性導電性接著劑層及屏蔽層連接。(4) Heating step Then, the grounding member, the shielding film, and the wiring board are put into a heating step (reflow step), which is performed under the conditions of 260 ° C × 5 seconds. In this heating step, the low-melting-point metal layer formed on the surface of the conductive protrusion in the grounding member of Example 1-1 is softened, and the conductive protrusion of the grounding member and the shielding film are made by the low-melting-point metal layer The anisotropic conductive adhesive layer and the shield layer are connected.

通過以上步驟，製成實施例2-1的屏蔽印刷配線板。Through the above steps, the shielded printed wiring board of Example 2-1 was produced.

(實施例2-2)~(實施例2-36)及(比較例2-1)~(比較例2-15) 除了使用實施例1-2~實施例1-36及比較例1-1~比較例1-15的接地構件作為接地構件外，與實施例2-1相同方法製成實施例2-2~實施例2-36及比較例2-1~比較例2-15的屏蔽印刷配線板。(Example 2-2) ~ (Example 2-36) and (Comparative Example 2-1) ~ (Comparative Example 2-15) Except using Example 1-2 ~ Example 1-36 and Comparative Example 1-1 ~ The grounding member of Comparative Example 1-15 was used as the grounding member, and the shield printing of Example 2-2 to Example 2-36 and Comparative Example 2-1 to Comparative Example 2-15 was made in the same manner as Example 2-1. Patch panel.

(加熱冷卻後的電阻值測定試驗) 將各實施例及各比較例之屏蔽印刷配線板於135℃下加熱一小時。接著，反覆進行加熱處理與冷卻處理合計5次，加熱處理係於260℃下加熱5秒，冷卻處理係靜置至135℃為止。 然後，對各實施例及各比較例的屏蔽印刷配線板測定基體薄膜之接地電路-外部接地間的電阻值。將結果顯示於表1及2。(Measurement test of resistance value after heating and cooling) The shielded printed wiring boards of each example and each comparative example were heated at 135 ° C for one hour. Next, the heating treatment and the cooling treatment were repeated five times in total. The heating treatment system was heated at 260 ° C for 5 seconds, and the cooling treatment system was allowed to stand until 135 ° C. Then, the resistance value between the ground circuit of the base film and the external ground was measured for the shielded printed wiring boards of each example and each comparative example. The results are shown in Tables 1 and 2.

(因加熱冷卻造成的電阻值變化的測定試驗) 分別準備4個實施例2-1~實施例2-36之屏蔽印刷配線板、及比較例2-1~比較例2-15之屏蔽印刷配線板，測定基體薄膜之接地電路-外部接地間的電阻值(初始值)。 接著，將各屏蔽印刷配線板於135℃下加熱一小時，測定基體薄膜之接地電路-外部接地間的電阻值(初始加熱時)。 然後，反覆進行加熱處理與冷卻處理合計5次，加熱處理係於260℃加熱5秒，冷卻處理係靜置至135℃為止理，於各冷卻處理結束時測定基體薄膜之接地電路-外部接地間的電阻值(循環1~5)。 將結果顯示於圖18。 圖18係顯示藉由加熱冷卻所造成的電阻值變化的測定試驗結果圖。 又，將測得的電阻值之平均值及標準偏差顯示於表3。(Measurement test of resistance value change due to heating and cooling) Four shielded printed wiring boards of Example 2-1 to Example 2-36, and shielded printed wiring of Comparative Example 2-1 to Comparative Example 2-15 were prepared respectively Board, the resistance value (initial value) between the ground circuit of the base film and the external ground is measured. Next, each shielded printed wiring board was heated at 135 ° C for one hour, and the resistance value between the ground circuit of the base film and the external ground (the initial heating) was measured. Then, heat treatment and cooling treatment were repeated 5 times in total. The heating treatment was heated at 260 ° C for 5 seconds, and the cooling treatment was allowed to stand until 135 ° C. At the end of each cooling treatment, the grounding circuit of the base film and the external grounding were measured. Resistance value (cycle 1 ~ 5). The results are shown in Figure 18. Fig. 18 is a graph showing the measurement test results of the change in resistance value caused by heating and cooling. In addition, the average value and standard deviation of the measured resistance values are shown in Table 3.

[表3] [table 3]

如表1及2所示，實施例2-1~實施例2-36之屏蔽印刷配線板顯示即使反覆進行加熱冷卻，基體薄膜之接地電路-外部接地間的電阻值亦不易變高。As shown in Tables 1 and 2, the shielded printed wiring boards of Examples 2-1 to 2-36 show that even if heating and cooling are repeated, the resistance value between the ground circuit of the base film and the external ground is not likely to increase.

又，如圖18及表3所示，實施例2-1~實施例2-36之屏蔽印刷配線板即使於初始加熱後反覆進行加熱冷卻其電阻值亦不易變化，表示藉由反覆加熱冷卻，其電阻值仍維持穩定。Moreover, as shown in FIG. 18 and Table 3, the resistance of the shielded printed wiring boards of Examples 2-1 to 2-36 does not change easily even after repeated heating and cooling after the initial heating, indicating that by repeated heating and cooling Its resistance value remains stable.

1‧‧‧接地構件1‧‧‧Ground member

2‧‧‧金屬箔2‧‧‧Metal foil

10‧‧‧外部連接構件10‧‧‧External connection member

11‧‧‧第1主面11‧‧‧ 1st main face

12‧‧‧第2主面12‧‧‧ 2nd main face

20‧‧‧導電性突起20‧‧‧ conductive protrusion

21‧‧‧低熔點金屬層21‧‧‧Low melting point metal layer

50‧‧‧屏蔽印刷配線板50‧‧‧Shielded printed wiring board

60‧‧‧基體薄膜60‧‧‧Matrix film

61‧‧‧基底薄膜61‧‧‧ Base film

62‧‧‧印刷電路62‧‧‧ Printed Circuit

62a‧‧‧接地電路62a‧‧‧Ground circuit

63‧‧‧絕緣薄膜63‧‧‧Insulating film

63a‧‧‧孔部63a‧‧‧hole

70‧‧‧屏蔽薄膜70‧‧‧Shielding film

71‧‧‧接著劑層71‧‧‧adhesive layer

72‧‧‧屏蔽層72‧‧‧Shield

73‧‧‧絕緣層73‧‧‧Insulation

91‧‧‧抗蝕劑91‧‧‧resist

101‧‧‧接地構件101‧‧‧Ground member

110‧‧‧外部連接構件110‧‧‧External connection member

111‧‧‧第1主面111‧‧‧ 1st main face

112‧‧‧第2主面112‧‧‧ 2nd main face

120‧‧‧導電性突起120‧‧‧ conductive protrusion

121‧‧‧低熔點金屬層121‧‧‧ Low melting point metal layer

150‧‧‧屏蔽印刷配線板150‧‧‧Shielded printed wiring board

160‧‧‧基體薄膜160‧‧‧Matrix film

161‧‧‧基底薄膜161‧‧‧ Base film

162‧‧‧印刷電路162‧‧‧ Printed Circuit

162a‧‧‧接地電路162a‧‧‧Ground circuit

163‧‧‧絕緣薄膜163‧‧‧Insulating film

170‧‧‧屏蔽薄膜170‧‧‧Shielding film

171‧‧‧接著劑層171‧‧‧ Adhesive layer

172‧‧‧屏蔽層172‧‧‧Shield

172a‧‧‧凸部172a‧‧‧Convex

172b‧‧‧凹部172b‧‧‧recess

173‧‧‧絕緣層173‧‧‧Insulation

250‧‧‧屏蔽印刷配線板250‧‧‧Shielded printed wiring board

260‧‧‧基體薄膜260‧‧‧Matrix film

261‧‧‧基底薄膜261‧‧‧ Base film

262‧‧‧印刷電路262‧‧‧ Printed Circuit

262a‧‧‧接地電路262a‧‧‧Ground circuit

263‧‧‧絕緣薄膜263‧‧‧Insulating film

270‧‧‧屏蔽薄膜270‧‧‧Shielding film

271‧‧‧接著劑層271‧‧‧ Adhesive layer

272‧‧‧屏蔽層272‧‧‧Shield

273‧‧‧絕緣層273‧‧‧Insulation

350‧‧‧屏蔽印刷配線板350‧‧‧Shielded printed wiring board

360‧‧‧基體薄膜360‧‧‧Matrix film

361‧‧‧基底薄膜361‧‧‧ Base film

362‧‧‧印刷電路362‧‧‧Printed Circuit

362a‧‧‧接地電路362a‧‧‧Ground circuit

363‧‧‧絕緣薄膜363‧‧‧Insulating film

370‧‧‧屏蔽薄膜370‧‧‧Shielding film

372‧‧‧屏蔽層372‧‧‧Shield

373‧‧‧絕緣層373‧‧‧Insulation

GND‧‧‧外部接地GND‧‧‧External ground

圖1係示意性顯示本發明接地構件之一例的截面圖。 圖2係示意性顯示使用本發明接地構件之屏蔽印刷配線板之一例的截面圖。 圖3(a)及(b)係示意性顯示將本發明接地構件使用於屏蔽印刷配線板時之一例的示意圖。 圖4(a)~(d)係按步驟順序示意性顯示本發明接地構件之製造方法之一例的步驟圖。 圖5係示意性顯示本發明屏蔽印刷配線板之製造方法中屏蔽薄膜載置步驟之一例的步驟圖。 圖6係示意性顯示本發明屏蔽印刷配線板之製造方法中接地構件配置步驟之一例的步驟圖。 圖7係示意性顯示本發明屏蔽印刷配線板之製造方法中加壓步驟之一例的步驟圖。 圖8係示意性顯示本發明屏蔽印刷配線板之製造方法中加熱步驟之一例的步驟圖。 圖9(a)及(b)係示意性顯示使用本發明接地構件之屏蔽印刷配線板之製造方法之一例圖。 圖10係示意性顯示使用本發明接地構件之屏蔽印刷配線板之一例的截面圖。 圖11係示意性顯示將本發明接地構件使用於屏蔽印刷配線板時之一例的示意圖。 圖12係示意性顯示使用本發明接地構件之屏蔽印刷配線板之一例的截面圖。 圖13係示意性顯示將本發明接地構件使用於屏蔽印刷配線板時之一例的示意圖。 圖14係示意性顯示使用本發明接地構件之屏蔽印刷配線板之一例的截面圖。 圖15係示意性顯示將本發明接地構件使用於屏蔽印刷配線板時之一例的示意圖。 圖16係示意性顯示本發明接地構件之一例的截面圖。 圖17係示意性顯示將本發明接地構件使用於屏蔽印刷配線板時之一例的示意圖。 圖18係顯示藉由加熱冷卻所造成的電阻值變化的測定試驗結果圖。FIG. 1 is a cross-sectional view schematically showing an example of the grounding member of the present invention. 2 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the grounding member of the present invention. 3 (a) and (b) are schematic diagrams schematically showing an example when the grounding member of the present invention is used for a shielded printed wiring board. 4 (a) to (d) are step diagrams schematically showing an example of the manufacturing method of the grounding member of the present invention in the order of steps. FIG. 5 is a step diagram schematically showing an example of a step of placing a shielding film in the method for manufacturing a shielded printed wiring board of the present invention. FIG. 6 is a step diagram schematically showing an example of an arrangement step of the grounding member in the manufacturing method of the shielded printed wiring board of the present invention. 7 is a step diagram schematically showing an example of a pressing step in the method for manufacturing a shielded printed wiring board of the present invention. FIG. 8 is a step diagram schematically showing an example of the heating step in the manufacturing method of the shielded printed wiring board of the present invention. 9 (a) and (b) are diagrams schematically showing an example of a manufacturing method of a shielded printed wiring board using the grounding member of the present invention. 10 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the ground member of the present invention. FIG. 11 is a schematic diagram schematically showing an example when the grounding member of the present invention is used for shielding a printed wiring board. 12 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the ground member of the present invention. FIG. 13 is a schematic diagram showing an example when the grounding member of the present invention is used for shielding a printed wiring board. 14 is a cross-sectional view schematically showing an example of a shielded printed wiring board using the ground member of the present invention. FIG. 15 is a schematic diagram schematically showing an example when the grounding member of the present invention is used for shielding a printed wiring board. 16 is a cross-sectional view schematically showing an example of the grounding member of the present invention. FIG. 17 is a schematic diagram schematically showing an example when the grounding member of the present invention is used for shielding a printed wiring board. Fig. 18 is a graph showing the measurement test results of the change in resistance value caused by heating and cooling.

Claims (26)

一種接地構件，特徵在於： 其係由具有導電性的外部連接構件構成，該外部連接構件具有第1主面與位於前述第1主面相反側之第2主面，並於前述第1主面具有導電性突起， 於前述導電性突起表面形成有低熔點金屬層。A grounding member, characterized in that it is composed of a conductive external connecting member having a first main surface and a second main surface located on the opposite side of the first main surface, and on the first main surface It has conductive protrusions, and a low melting point metal layer is formed on the surface of the conductive protrusions. 如請求項1之接地構件，其中前述低熔點金屬層由熔點300℃以下的金屬形成。The ground member of claim 1, wherein the aforementioned low-melting-point metal layer is formed of a metal having a melting point of 300 ° C or lower. 如請求項1或2之接地構件，其中前述低熔點金屬層的厚度為0.1~50μm。The grounding member according to claim 1 or 2, wherein the thickness of the aforementioned low-melting metal layer is 0.1-50 μm. 如請求項1至3中任一項之接地構件，其中前述低熔點金屬層包含助焊劑。The ground member according to any one of claims 1 to 3, wherein the aforementioned low-melting-point metal layer contains a flux. 如請求項1至4中任一項之接地構件，其中前述外部連接構件包含選自於由銅、鋁、銀、金、鎳、鉻、鈦、鋅及不鏽鋼所構成群組中之至少一種。The ground member according to any one of claims 1 to 4, wherein the external connection member includes at least one selected from the group consisting of copper, aluminum, silver, gold, nickel, chromium, titanium, zinc, and stainless steel. 如請求項1至5中任一項之接地構件，其中於前述第2主面形成有耐腐蝕層。The grounding member according to any one of claims 1 to 5, wherein a corrosion-resistant layer is formed on the second main surface. 如請求項6之接地構件，其中前述耐腐蝕層包含選自於由鎳、金、銀、鉑、鈀、銠、銥、釕、鋨及其等之合金所構成群組中之至少一種。The ground member of claim 6, wherein the corrosion-resistant layer includes at least one selected from the group consisting of nickel, gold, silver, platinum, palladium, rhodium, iridium, ruthenium, osmium, and alloys thereof. 如請求項1至7中任一項之接地構件，其中前述導電性突起為柱狀。The ground member according to any one of claims 1 to 7, wherein the aforementioned conductive protrusion is columnar. 如請求項8之接地構件，其中前述導電性突起之底面面積為1.0~1.0×10⁶ μm² 。The grounding member according to claim 8, wherein the area of the bottom surface of the conductive protrusion is 1.0 to 1.0 × 10 ⁶ μm ² . 如請求項8或9之接地構件，其中前述導電性突起彼此的間距為1~1000μm。The grounding member according to claim 8 or 9, wherein the distance between the aforementioned conductive protrusions is 1 to 1000 μm. 如請求項1至7中任一項之接地構件，其中前述外部連接構件係以前述第1主面側突出之方式彎曲，突出的前述外部連接構件的一部分成為前述導電性突起。The grounding member according to any one of claims 1 to 7, wherein the external connection member is bent such that the first main surface side protrudes, and a part of the protruding external connection member becomes the conductive protrusion. 一種屏蔽印刷配線板，特徵在於： 其具備基體薄膜、屏蔽薄膜及接地構件， 該基體薄膜係於基底薄膜上依序設置包含接地電路之印刷電路及絕緣薄膜而成， 該屏蔽薄膜係由屏蔽層及積層於前述屏蔽層之絕緣層構成，並且以前述屏蔽層配置於較前述絕緣層更靠前述基體薄膜側之方式被覆前述基體薄膜， 該接地構件配置於前述屏蔽薄膜之絕緣層上； 其中，前述接地構件由外部連接構件及導電性突起構成， 該外部連接構件具有第1主面與位於前述第1主面相反側之第2主面，且具有導電性， 該導電性突起配置於前述第1主面側， 於前述導電性突起表面形成有低熔點金屬層； 並且，前述接地構件之導電性突起貫穿前述屏蔽薄膜之絕緣層； 前述接地構件之低熔點金屬層係連接於前述屏蔽薄膜之屏蔽層； 前述接地構件之外部連接構件可與外部接地電性連接。A shielded printed wiring board, characterized in that it is provided with a base film, a shielding film and a grounding member, the base film is formed by sequentially placing a printed circuit including a grounding circuit and an insulating film on the base film, the shielding film is composed of a shielding layer And an insulating layer laminated on the shielding layer, and covering the base film so that the shielding layer is disposed closer to the base film side than the insulating layer, and the grounding member is disposed on the insulating layer of the shielding film; wherein, The ground member is composed of an external connection member and a conductive protrusion having a first main surface and a second main surface located on the opposite side of the first main surface, and having conductivity, and the conductive protrusion is disposed on the first 1 The main surface side, a low melting point metal layer is formed on the surface of the conductive protrusion; and, the conductive protrusion of the ground member penetrates the insulating layer of the shielding film; the low melting point metal layer of the ground member is connected to the shielding film Shielding layer; the external connecting member of the aforementioned grounding member can be electrically connected to the external grounding. 如請求項12之屏蔽印刷配線板，其中前述屏蔽薄膜係由接著劑層、積層於前述接著劑層之前述屏蔽層及積層於前述屏蔽層之前述絕緣層構成， 且前述屏蔽薄膜之接著劑層與前述基體薄膜接觸。The shielded printed wiring board according to claim 12, wherein the shielding film is composed of an adhesive layer, the shielding layer laminated on the adhesive layer, and the insulating layer laminated on the shielding layer, and the adhesive layer of the shielding film Contact with the aforementioned base film. 如請求項13之屏蔽印刷配線板，其中前述屏蔽薄膜之接著劑層為導電性接著劑層。The shielded printed wiring board according to claim 13, wherein the adhesive layer of the aforementioned shielding film is a conductive adhesive layer. 如請求項13或14之屏蔽印刷配線板，其中前述屏蔽薄膜之屏蔽層係由金屬構成。The shielded printed wiring board according to claim 13 or 14, wherein the shielding layer of the foregoing shielding film is made of metal. 如請求項13至15中任一項之屏蔽印刷配線板，其中前述屏蔽薄膜中，於前述接著劑層與前述屏蔽層之間、及/或於前述屏蔽層與前述絕緣層之間形成有屏蔽薄膜之低熔點金屬層，且前述屏蔽薄膜之低熔點金屬層係與前述接地構件之導電性突起連接。The shielded printed wiring board according to any one of claims 13 to 15, wherein in the shielding film, a shield is formed between the adhesive layer and the shielding layer, and / or between the shielding layer and the insulating layer The low-melting-point metal layer of the film, and the low-melting-point metal layer of the shielding film are connected to the conductive protrusions of the ground member. 如請求項12之屏蔽印刷配線板，其中前述屏蔽薄膜之屏蔽層為導電性接著劑層，前述導電性接著劑層係與前述基體薄膜接觸。The shielded printed wiring board according to claim 12, wherein the shielding layer of the shielding film is a conductive adhesive layer, and the conductive adhesive layer is in contact with the base film. 如請求項17之屏蔽印刷配線板，其中前述屏蔽薄膜中，於前述屏蔽層與前述絕緣層之間形成有屏蔽薄膜之低熔點金屬層，且前述屏蔽薄膜之低熔點金屬層係與前述接地構件之導電性突起連接。The shielded printed wiring board according to claim 17, wherein in the shielding film, a low-melting-point metal layer of the shielding film is formed between the shielding layer and the insulating layer, and the low-melting-point metal layer of the shielding film and the grounding member The conductive protrusions are connected. 一種屏蔽印刷配線板之製造方法，特徵在於： 前述屏蔽印刷配線板具備基體薄膜、屏蔽薄膜及如請求項1至11中任一項之接地構件， 該基體薄膜係於基底薄膜上依序設置包含接地電路之印刷電路及絕緣薄膜而成， 該屏蔽薄膜具有屏蔽層及積層於前述屏蔽層之絕緣層， 該接地構件配置於前述屏蔽薄膜之絕緣層上； 上述屏蔽印刷配線板之製造方法具有以下步驟： 屏蔽薄膜載置步驟，係以前述屏蔽薄膜之屏蔽層配置於較前述屏蔽薄膜之絕緣層更靠前述基體薄膜側之方式，將前述屏蔽薄膜載置於前述基體薄膜； 接地構件配置步驟，係以前述接地構件之導電性突起朝向前述屏蔽薄膜之絕緣層側之方式，將前述接地構件配置於前述屏蔽薄膜； 加壓步驟，係加壓前述接地構件，以使前述接地構件之導電性突起貫通前述屏蔽薄膜之絕緣層；及 加熱步驟，係加熱前述接地構件之低熔點金屬層使之軟化，以使前述接地構件之低熔點金屬層連接於前述屏蔽薄膜之屏蔽層。A method for manufacturing a shielded printed wiring board, characterized in that: the shielded printed wiring board includes a base film, a shielding film, and a grounding member according to any one of claims 1 to 11, the base film is provided on the base film in sequence and includes A printed circuit of an earth circuit and an insulating film, the shielding film has a shielding layer and an insulating layer laminated on the shielding layer, the grounding member is disposed on the insulating layer of the shielding film; the manufacturing method of the shielded printed wiring board has the following Step: The step of placing the shielding film is to place the shielding film on the base film in such a manner that the shielding layer of the shielding film is arranged closer to the base film side than the insulating layer of the shielding film; The grounding member is arranged on the shielding film with the conductive protrusions of the grounding member facing the insulating layer side of the shielding film; the pressing step is to pressurize the grounding member to make the conductive protrusions of the grounding member Through the insulating layer of the aforementioned shielding film; and the heating step is heating Low melting point metal layer of said ground member is softened, so that the low melting point metal layer of the grounding member connected to the shield layer of the mask film. 如請求項19之屏蔽印刷配線板之製造方法，其係同時進行前述加壓步驟及前述加熱步驟。The method for manufacturing a shielded printed wiring board according to claim 19, which simultaneously performs the aforementioned pressing step and the aforementioned heating step. 如請求項19或20之屏蔽印刷配線板之製造方法，其中前述屏蔽薄膜係由接著劑層、積層於前述接著劑層之前述屏蔽層及積層於前述屏蔽層之前述絕緣層構成。The method for manufacturing a shielded printed wiring board according to claim 19 or 20, wherein the shielding film is composed of an adhesive layer, the shielding layer laminated on the adhesive layer, and the insulating layer laminated on the shielding layer. 如請求項21之屏蔽印刷配線板之製造方法，其中前述屏蔽薄膜之接著劑層為導電性接著劑層。The method for manufacturing a shielded printed wiring board according to claim 21, wherein the adhesive layer of the foregoing shielding film is a conductive adhesive layer. 如請求項21或22之屏蔽印刷配線板之製造方法，其中前述屏蔽薄膜之屏蔽層係由金屬構成。The method for manufacturing a shielded printed wiring board according to claim 21 or 22, wherein the shielding layer of the aforementioned shielding film is made of metal. 如請求項21至23中任一項之屏蔽印刷配線板之製造方法，其中前述屏蔽薄膜中，於前述接著劑層與前述屏蔽層之間、及/或於前述屏蔽層與前述絕緣層之間形成有屏蔽薄膜之低熔點金屬層； 且於前述加熱步驟中，使前述屏蔽薄膜之低熔點金屬層軟化而與前述接地構件之導電性突起連接。The method for manufacturing a shielded printed wiring board according to any one of claims 21 to 23, wherein in the shielding film, between the adhesive layer and the shielding layer, and / or between the shielding layer and the insulating layer Forming a low-melting-point metal layer of the shielding film; and in the heating step, softening the low-melting-point metal layer of the shielding film to be connected to the conductive protrusion of the ground member. 如請求項19或20之屏蔽印刷配線板之製造方法，其中前述屏蔽薄膜之屏蔽層為導電性接著劑層。The method for manufacturing a shielded printed wiring board according to claim 19 or 20, wherein the shielding layer of the aforementioned shielding film is a conductive adhesive layer. 如請求項25之屏蔽印刷配線板之製造方法，其中前述屏蔽薄膜中，於前述屏蔽層與前述絕緣層之間形成有屏蔽薄膜之低熔點金屬層； 且於前述加熱步驟中，使前述屏蔽薄膜之低熔點金屬層軟化而與前述接地構件之導電性突起連接。A method for manufacturing a shielded printed wiring board according to claim 25, wherein in the shielding film, a low-melting-point metal layer of the shielding film is formed between the shielding layer and the insulating layer; The low melting point metal layer softens and is connected to the conductive protrusion of the ground member.