TW201838495A - Manufacturing method and protective film for printed wiring board preventing a decrease in etching efficiency and protecting an insulating resin film adhered to a metal foil-clad laminate - Google Patents

Manufacturing method and protective film for printed wiring board preventing a decrease in etching efficiency and protecting an insulating resin film adhered to a metal foil-clad laminate Download PDF

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TW201838495A
TW201838495A TW107109266A TW107109266A TW201838495A TW 201838495 A TW201838495 A TW 201838495A TW 107109266 A TW107109266 A TW 107109266A TW 107109266 A TW107109266 A TW 107109266A TW 201838495 A TW201838495 A TW 201838495A
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main surface
metal foil
film
protective film
printed wiring
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TW107109266A
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TWI653920B (en
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松田文彦
成澤嘉彦
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日商日本美可多龍股份有限公司
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/09—Treatments involving charged particles
    • H05K2203/095—Plasma, e.g. for treating a substrate to improve adhesion with a conductor or for cleaning holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a manufacturing method and a protective film for a printed wiring board. The method can prevent a decrease in etching efficiency and protect an insulating resin film adhered to a metal foil-clad laminate in a plasma treatment step of removing a resin residue. A method of manufacturing a printed wiring board according to the present invention includes: a step of preparing a single-sided metal foil-clad laminate having an insulating base substrate and a metal foil, and a protective film having an insulating resin film and a metal film, a step of adhering the protective film to the single-sided metal foil-clad laminate, a step of irradiating a predetermined portion of the protective film with laser to form a bottom via hole, a step of removing resin residue by plasma etching, a step of removing the backside treatment film and the metal thin film on the bottom surface of the bottom via hole by wet etching, a step of filling a conductive paste in the bottom via hole using a printing method, and a step of peeling off the insulating resin film from the insulating base substrate.

Description

印刷配線板的製造方法以及保護膜    Method for manufacturing printed wiring board and protective film   

本發明係有關於印刷配線板的製造方法以及保護膜，更詳細而言，關於藉由導電糊劑來進行層間連接的印刷配線板的製造方法以及在該印刷配線板的製造方法中使用的保護膜。 The present invention relates to a method for manufacturing a printed wiring board and a protective film, and more specifically, to a method for manufacturing a printed wiring board for interlayer connection using a conductive paste and a protection used in the method for manufacturing the printed wiring board. membrane.

隨著電子設備的小型化、高功能化的進展，對印刷配線板的高密度化的要求正在提高。為了應對該要求，開發了多層化的印刷配線板。此外，作為高密度化的一個環節，在專利文獻1中記載了混成多層電路基板。該混成多層電路基板具有兩個多層電路基板(硬質電路基板)和將這些多層電路基板間進行連接的柔性印刷配線板(或柔性排線)。這些配線板以智慧手機等可擕式通訊設備、筆記型電腦、數位照相機、遊戲機等小型電子設備為中心而被廣泛使用。 With the progress of miniaturization and high functionality of electronic equipment, the demand for higher density of printed wiring boards is increasing. To meet this demand, multilayer printed wiring boards have been developed. In addition, Patent Literature 1 describes a hybrid multilayer circuit board as a step of increasing the density. The hybrid multilayer circuit board includes two multilayer circuit boards (hard circuit boards) and a flexible printed wiring board (or flexible wiring) that connects the multilayer circuit boards. These wiring boards are widely used mainly in small electronic devices such as portable communication devices such as smartphones, notebook computers, digital cameras, and game consoles.

近年來，電子設備所處理的訊息量急遽增加，因此電子設備內的訊號的傳送速率有越來越高速化的傾向。就電腦的情況而言，從2010年到2011年之間過渡到傳送速率為6Gbps的傳輸標準，在2013年還制定了傳送速率為10Gbps的標準。在這樣的狀況下，考慮傳輸線路中的訊號損耗(傳輸損耗)變得越來越重要。 In recent years, the amount of information processed by electronic devices has increased sharply, so the signal transmission rate in electronic devices tends to become faster and faster. As far as computers are concerned, from 2010 to 2011, the transition to a transmission rate of 6 Gbps was made, and in 2013 a standard of 10 Gbps was also developed. Under such conditions, it is becoming increasingly important to consider signal loss (transmission loss) in a transmission line.

柔性印刷配線板(FPC)中，為了減少傳輸損耗，開始適用介電常數以及介質損耗角正切(tan δ)低的液晶聚合物(Liquid Crystal Polymer；LCP)作為絕緣基座基材。然而，就液晶聚合物而言，厚度方向的熱膨脹係數比以往的聚醯亞胺等絕緣材料相比大，與以往通常用作層間連接路的鍍敷通孔之間的熱膨脹係數差大。因此，在使包含液晶聚合物的絕緣基座基材厚的情況下，有無法充分確保對溫度迴圈等的可靠性的危險。 In order to reduce transmission loss in flexible printed wiring boards (FPC), a liquid crystal polymer (LCP) with a low dielectric constant and a low dielectric loss tangent (tan δ) has been used as a base material for the insulating base. However, the thermal expansion coefficient of the liquid crystal polymer in the thickness direction is larger than that of conventional insulating materials such as polyimide, and the thermal expansion coefficient difference between the plated through holes that are conventionally used as interlayer connection paths is large. Therefore, when the insulating base substrate containing the liquid crystal polymer is made thick, there is a possibility that the reliability against temperature loops and the like cannot be sufficiently ensured.

在專利文獻2和專利文獻3中，記載了在以液晶聚合物作為絕緣基座基材的柔性印刷配線板中，將使用導電糊劑的導電孔適用於層間連接路，而不是鍍敷通孔。 Patent Documents 2 and 3 describe that in a flexible printed wiring board using a liquid crystal polymer as an insulating base substrate, conductive holes using a conductive paste are applied to interlayer connection paths instead of plated through holes. .

此外，專利文獻4中，記載了具有導電孔的印刷配線板的製造方法。在該方法中，將黏著性絕緣樹脂膜黏貼於覆金屬箔層疊板，在由雷射加工形成的有底導通孔中填充導電糊劑後，剝離絕緣樹脂膜，從而使導電糊劑的一部分從絕緣基座基材突出而製作配線基材。然後，以導電糊劑的突出部彼此抵接的方式層疊2塊配線基材。根據該方法，能夠用2塊配線基材來製造具有3個配線層的印刷配線板，能夠減少印刷配線板的製造所需要的材料，還可以簡化製造步驟。 In addition, Patent Document 4 describes a method for manufacturing a printed wiring board having a conductive hole. In this method, an adhesive insulating resin film is adhered to a metal foil-clad laminated board, and a conductive paste is filled in a bottomed via hole formed by laser processing, and then the insulating resin film is peeled off, so that a part of the conductive paste is removed from the conductive paste. The insulating base substrate protrudes to produce a wiring substrate. Then, two wiring base materials are laminated so that the protruding portions of the conductive paste abut each other. According to this method, a printed wiring board having three wiring layers can be manufactured from two wiring base materials, the materials required for manufacturing the printed wiring board can be reduced, and the manufacturing steps can be simplified.

[現有技術文獻] [Prior Art Literature]

[專利文獻] [Patent Literature]

專利文獻1：日本專利第2631287號。 Patent Document 1: Japanese Patent No. 2631287.

專利文獻2：日本特開2011-66293號公報。 Patent Document 2: Japanese Patent Application Laid-Open No. 2011-66293.

專利文獻3：日本特開2007-96121號公報。 Patent Document 3: Japanese Patent Application Laid-Open No. 2007-96121.

專利文獻4：日本特開2015-61058號公報。 Patent Document 4: Japanese Patent Application Laid-Open No. 2015-61058.

然而，在專利文獻4的情況下，存在幾個課題。對這些課題進行說明之前，參照圖12和圖13來說明比較例關於的印刷配線板的製造方法。 However, in the case of Patent Document 4, there are several problems. Before explaining these problems, a method for manufacturing a printed wiring board according to a comparative example will be described with reference to FIGS. 12 and 13.

首先，如圖12中的(a)所示，準備單面覆金屬箔層疊板103。該單面覆金屬箔層疊板103具有絕緣基座基材101、在絕緣基座基材101的一面形成的金屬箔102。絕緣基座基材101具有主面101a和與主面101a相反一側的主面101b。絕緣基座基材101包含液晶聚合物，其厚度為100μm。金屬箔102為銅箔，其厚度為12μm。 First, as shown in FIG. 12 (a), a single-sided metal foil-clad laminate 103 is prepared. The single-sided metal foil-clad laminate 103 includes an insulating base substrate 101 and a metal foil 102 formed on one surface of the insulating base substrate 101. The insulating base substrate 101 has a main surface 101a and a main surface 101b on the side opposite to the main surface 101a. The insulating base substrate 101 contains a liquid crystal polymer and has a thickness of 100 μm. The metal foil 102 is a copper foil and has a thickness of 12 μm.

接下来，如圖12中的(b)所示，藉由照相化學腐蝕法將金屬箔102圖案化，形成接受連接盤102a以及配線102b。 Next, as shown in FIG. 12 (b), the metal foil 102 is patterned by a photochemical etching method to form a receiving land 102 a and a wiring 102 b.

接下來，如圖12中的(c)所示，將在一面形成有微黏著材(未圖示)的絕緣樹脂膜104貼合於單面覆金屬箔層疊板103的主面101a。 Next, as shown in FIG. 12 (c), an insulating resin film 104 having a microadhesive material (not shown) formed on one surface is bonded to the main surface 101 a of the single-sided metal foil-clad laminate 103.

接下來，如圖13中的(a)所示，藉由對絕緣樹脂膜104的預定部位照射雷射，從而形成底面露出接受連接盤102a的有底導通孔105。然後，藉由電漿蝕刻來除去存在於有底導通孔105內部的樹脂殘渣(未圖示)。藉由該電漿蝕刻，絕緣樹脂膜104的表面被蝕刻而產生凹凸(參照圖13中的 (b))。 Next, as shown in FIG. 13 (a), a predetermined portion of the insulating resin film 104 is irradiated with a laser to form a bottomed via hole 105 having a bottom surface exposed to the receiving pad 102 a. Then, the resin residue (not shown) existing in the bottomed via 105 is removed by plasma etching. By this plasma etching, the surface of the insulating resin film 104 is etched to cause unevenness (see (b) in FIG. 13).

接下來，如圖13中的(b)所示，藉由濕式蝕刻來除去在有底導通孔105的底面露出的接受連接盤102a的背面處理膜(防護金屬膜)(未圖示)。該背面處理膜是指在金屬箔102的背面(即，與絕緣基座基材101接觸一側的面)形成的處理膜，是以提高金屬箔102與絕緣基座基材101的密合性等為目的而在單面覆金屬箔層疊板103的製造時設置的膜。 Next, as shown in FIG. 13 (b), the back surface treatment film (protective metal film) (not shown) of the receiving land 102 a exposed on the bottom surface of the bottomed via 105 is removed by wet etching. The back surface treatment film is a treatment film formed on the back surface of the metal foil 102 (that is, the surface in contact with the insulating base substrate 101), and is used to improve the adhesion between the metal foil 102 and the insulating base substrate 101. A film provided for the purpose of manufacturing a single-sided metal-clad laminated sheet 103 for the purpose of the like.

接下來，如圖13中的(c)所示，使用絲網印刷等印刷法來將導電糊劑106填充於有底導通孔105內。然後，從絕緣基座基材101剝離絕緣樹脂膜104。由此，使填充於有底導通孔105的導電糊劑106的一部分從絕緣基座基材101突出。導電糊劑106的突出量(突起量)按照絕緣樹脂膜104的厚度來規定。 Next, as shown in FIG. 13 (c), the conductive paste 106 is filled in the bottomed via 105 using a printing method such as screen printing. Then, the insulating resin film 104 is peeled from the insulating base substrate 101. Thereby, a part of the conductive paste 106 filled in the bottomed via 105 is protruded from the insulating base substrate 101. The amount of protrusion (the amount of protrusion) of the conductive paste 106 is determined in accordance with the thickness of the insulating resin film 104.

經過上述步驟，能夠得到導電糊劑106的一部分從絕緣基座基材101突出的配線基材，但存在以下說明的課題。 Through the above steps, a wiring substrate having a part of the conductive paste 106 protruding from the insulating base substrate 101 can be obtained, but there are problems described below.

首先，在藉由電漿蝕刻來除去有底導通孔105內的樹脂殘渣的步驟(電漿處理步驟)中，單面覆金屬箔層疊板103的上表面除了穿孔部分以外的整面由絕緣樹脂膜104被覆。因此，由絕緣樹脂膜104的表面(樹脂面)引起自由基顯著失活。其結果是，蝕刻速率大幅降低，有印刷配線板的製造效率大幅降低這樣的課題。 First, in the step (plasma treatment step) of removing the resin residue in the bottomed via 105 by plasma etching, the entire surface of the single-sided metal foil-clad laminate 103 except the perforated portion is covered with an insulating resin. The film 104 is covered. Therefore, radicals are significantly deactivated by the surface (resin surface) of the insulating resin film 104. As a result, there is a problem that the etching rate is significantly reduced, and the manufacturing efficiency of the printed wiring board is significantly reduced.

此外，由於在電漿處理步驟中，絕緣樹脂膜104的表 面被蝕刻而產生凹凸，因而在將導電糊劑填充於有底導通孔內的步驟(印刷步驟)中，導電糊劑容易殘留於絕緣樹脂膜104的表面。其結果是，有導電糊劑的產率降低這樣的課題。 In addition, in the plasma processing step, the surface of the insulating resin film 104 is etched to cause unevenness. Therefore, in the step (printing step) of filling the conductive paste in the bottomed via, the conductive paste is liable to remain on the insulation. The surface of the resin film 104. As a result, there is a problem that the yield of the conductive paste is reduced.

進而，由於在電漿處理步驟中絕緣樹脂膜104被蝕刻而厚度產生偏差，因而還有導電糊劑106的突起量變得不均勻這樣的課題。 Furthermore, since the thickness of the insulating resin film 104 is etched during the plasma processing step, the thickness of the conductive resin paste 106 becomes uneven.

本發明基於上述技術認知而進行的，其目的在於，提供一種在除去樹脂殘渣電漿處理步驟中，能夠防止蝕刻效率的降低並且能夠保護黏貼於覆金屬箔層疊板的絕緣樹脂膜的印刷配線板的製造方法以及保護膜。 The present invention is based on the above-mentioned technical knowledge, and an object thereof is to provide a printed wiring board capable of preventing a reduction in etching efficiency and protecting an insulating resin film adhered to a metal foil-clad laminate in a plasma treatment step for removing resin residues. Manufacturing method and protective film.

本發明的印刷配線板的製造方法具備下述步驟：準備覆金屬箔層疊板的步驟，前述覆金屬箔層疊板具備具有第一主面和與前述第一主面相反一側的第二主面的絕緣基座基材以及在前述第二主面形成的金屬箔；準備保護膜的步驟，前述保護膜具備具有第三主面和與前述第三主面相反一側的第四主面的絕緣樹脂膜以及在前述第三主面形成的金屬薄膜；黏貼步驟，以前述第一主面與前述第四主面相對的方式將前述保護膜貼合於前述覆金屬箔層疊板；雷射加工步驟，藉由對前述保護膜的預定部位照射雷射，從而形成在底面露出前述金屬箔的有底導通孔；電漿處理步驟，藉由電漿蝕刻來除去存在於前述有底導通孔內部的樹脂殘渣；軟蝕刻步驟，藉由濕式蝕刻來除去在前述有底導通孔 的底面露出的前述金屬箔的背面處理膜以及前述金屬薄膜；使用印刷方法在前述有底導通孔內填充導電糊劑的步驟；以及剝離前述絕緣樹脂膜的剝離步驟。 The method for manufacturing a printed wiring board of the present invention includes the steps of preparing a metal foil-clad laminate, the metal foil-clad laminate having a first main surface and a second main surface opposite to the first main surface. An insulating base substrate and a metal foil formed on the second main surface; a step of preparing a protective film, the protective film including insulation having a third main surface and a fourth main surface opposite to the third main surface A resin film and a metal thin film formed on the third main surface; an adhering step, bonding the protective film to the metal foil-clad laminate so that the first main surface is opposite to the fourth main surface; a laser processing step , By irradiating a predetermined portion of the protective film with a laser to form a bottomed via hole exposing the metal foil on the bottom surface; a plasma processing step, removing the resin existing inside the bottomed via hole by plasma etching Residue; soft etching step, removing the backside treatment film of the metal foil and the metal film exposed on the bottom surface of the bottomed via hole by wet etching; using a printing method first A step of filling a conductive paste in the bottomed via hole and a step of peeling the insulating resin film are described.

此外，前述印刷配線板的製造方法中，前述金屬薄膜可以具有下述厚度，即，在前述雷射加工步驟中由前述雷射貫通且在前述電漿處理步驟中前述絕緣樹脂膜不受到電漿蝕刻的厚度。 Further, in the method for manufacturing a printed wiring board, the metal thin film may have a thickness that is penetrated by the laser in the laser processing step and that the insulating resin film is not subjected to a plasma in the plasma processing step. Etched thickness.

此外，前述印刷配線板的製造方法中，前述金屬薄膜的厚度可以為0.08μm以上0.12μm以下。 In the method for manufacturing a printed wiring board, the thickness of the metal thin film may be 0.08 μm or more and 0.12 μm or less.

此外，前述印刷配線板的製造方法中，前述金屬薄膜也可以設為由銅、鋁或鎳形成。 In the method for manufacturing a printed wiring board, the metal thin film may be formed of copper, aluminum, or nickel.

此外，前述印刷配線板的製造方法中，前述金屬薄膜可以設為由與前述金屬箔相同的材料形成。 In the method for manufacturing a printed wiring board, the metal thin film may be formed of the same material as the metal foil.

此外，前述印刷配線板的製造方法中，前述黏貼步驟中，前述保護膜也可以設為藉由在前述絕緣樹脂膜的前述第四主面上形成的微黏著材而貼合於前述覆金屬箔層疊板。 Further, in the method for manufacturing a printed wiring board, in the pasting step, the protective film may be adhered to the metal-clad foil by a micro-adhesive material formed on the fourth main surface of the insulating resin film. Laminated boards.

此外，前述印刷配線板的製造方法中，前述黏貼步驟中，前述保護膜也可以設為藉由在前述絕緣基座基材的前述第一主面上形成的黏接劑層而貼合於前述覆金屬箔層疊板。 Further, in the method for manufacturing a printed wiring board, in the pasting step, the protective film may be attached to the first through an adhesive layer formed on the first main surface of the insulating base substrate. Metal-clad laminate.

此外，前述印刷配線板的製造方法中，也可以如下操作：作為前述覆金屬箔層疊板，準備進一步具有形成在前述絕緣基座基材的前述第一主面上的第二金屬箔的雙面覆 金屬箔層疊板；在前述黏貼步驟之前，進一步具備：將前述第二金屬箔圖案化而形成穿孔加工用掩模的步驟，以及形成黏接劑層的步驟，前述黏接劑層在前述絕緣基座基材的前述第一主面上形成且將經過前述圖案化的前述第二金屬箔埋沒；在前述黏貼步驟中，也可以以前述絕緣樹脂膜與前述黏接劑層黏接的方式將前述保護膜層疊在前述黏接劑層上。 In addition, in the method for manufacturing a printed wiring board, as the metal foil-clad laminate, a double-sided surface further including a second metal foil formed on the first main surface of the insulating base substrate may be prepared. A metal foil-clad laminate; before the pasting step, further comprising: a step of patterning the second metal foil to form a mask for perforation processing; and a step of forming an adhesive layer, the adhesive layer is on the insulation The first main surface of the base substrate is formed on the first main surface and the second metal foil that has been patterned is buried; in the pasting step, the insulating resin film and the adhesive layer may be adhered to each other. The protective film is laminated on the adhesive layer.

此外，前述印刷配線板的製造方法中，可以進一步具備：將藉由前述剝離步驟得到的具有前述導電糊劑的突出部的第一配線基材和第二配線基材，以前述突出部彼此抵接的方式層疊的步驟，以及將前述層疊後的第一配線基材以及第二配線基材加熱而一體化的步驟。 In addition, the method for manufacturing a printed wiring board may further include: abutting the first wiring substrate and the second wiring substrate having the protruding portions of the conductive paste obtained by the peeling step with the protruding portions against each other. A step of laminating in a continuous manner, and a step of heating and integrating the first wiring substrate and the second wiring substrate after being laminated.

本發明的保護膜的特徵在於，是貼合於覆金屬箔層疊板的保護膜，前述覆金屬箔層疊板具備具有第一主面和與前述第一主面相反一側的第二主面的絕緣基座基材以及在前述第二主面形成的金屬箔，前述保護膜具備具有第三主面和與前述第三主面相反一側的第四主面的絕緣樹脂膜以及在前述第三主面形成的金屬薄膜，介由微黏著材或黏接材層以前述第四主面與前述第一主面相對的方式貼合。 The protective film of the present invention is a protective film bonded to a metal foil-clad laminate, and the metal foil-clad laminate includes a first main surface and a second main surface opposite to the first main surface. An insulating base substrate and a metal foil formed on the second main surface; the protective film includes an insulating resin film having a third main surface and a fourth main surface opposite to the third main surface; and the third main surface The metal thin film formed on the main surface is bonded via a micro-adhesive material or an adhesive material layer in such a manner that the fourth main surface is opposite to the first main surface.

此外，前述保護膜中，前述金屬薄膜可以具有下述厚度，即，在藉由對前述保護膜的預定部位照射雷射而形成底面露出前述金屬箔的有底導通孔的雷射加工步驟中，易於由前述雷射貫通，在藉由電漿蝕刻來除去存在於前述有底導通孔內部的樹脂殘渣的電漿處理步驟中，前述絕緣樹 脂膜不受到電漿蝕刻，且在藉由濕式蝕刻來除去在前述有底導通孔的底面露出的前述金屬箔的背面處理膜的軟蝕刻步驟中被除去的厚度。 In addition, in the protective film, the metal thin film may have a thickness in a laser processing step of forming a bottomed via hole having a bottom surface exposed by the metal foil by irradiating a predetermined portion of the protective film with a laser, It is easy to be penetrated by the laser, and in a plasma processing step for removing resin residues existing in the bottomed via hole by plasma etching, the insulating resin film is not subjected to plasma etching and is wet-etched. To remove the thickness removed in the soft etching step of the back surface treatment film of the metal foil exposed on the bottom surface of the bottomed via.

此外，前述保護膜中，前述金屬薄膜的厚度也可以為0.08μm以上0.12μm以下。 In addition, in the protective film, the thickness of the metal thin film may be 0.08 μm or more and 0.12 μm or less.

本發明中，在將具有絕緣樹脂膜和在該絕緣樹脂膜的主面上形成的金屬薄膜的保護膜貼合於覆金屬箔層疊板，利用雷射加工形成有底導通孔之後，進行除去有底導通孔內的樹脂殘渣的電漿處理步驟。由於在電漿處理步驟中，絕緣樹脂膜的表面由金屬薄膜被覆，因而能夠防止由絕緣樹脂膜造成的自由基的失活。因此能夠防止因電漿蝕刻所引起的蝕刻速率的降低。 In the present invention, a protective film having an insulating resin film and a metal thin film formed on a main surface of the insulating resin film is bonded to a metal-clad laminated board, and a bottom via hole is formed by laser processing, and then removed. Plasma treatment step of the resin residue in the bottom via hole. Since the surface of the insulating resin film is covered with a metal thin film in the plasma processing step, it is possible to prevent the inactivation of radicals caused by the insulating resin film. Therefore, it is possible to prevent a decrease in the etching rate due to plasma etching.

此外，在電漿處理步驟中，絕緣樹脂膜由金屬薄膜所保護，不被蝕刻而維持平坦性。因此，在將導電糊劑填充於有底導通孔中的印刷步驟中，能夠防止導電糊劑的產率降低，並且能夠使導電糊劑的突起量均勻。 In addition, in the plasma processing step, the insulating resin film is protected by a metal thin film, and flatness is maintained without being etched. Therefore, in the printing step of filling the conductive paste in the bottomed via hole, it is possible to prevent a decrease in the yield of the conductive paste, and it is possible to make the protrusion amount of the conductive paste uniform.

如上所示，根據本發明，能夠在除去樹脂殘渣的電漿處理步驟中，防止蝕刻效率的降低，並且能夠保護黏貼於覆金屬箔層疊板的絕緣樹脂膜。 As described above, according to the present invention, it is possible to prevent a reduction in the etching efficiency in the plasma treatment step for removing the resin residue, and to protect the insulating resin film adhered to the metal foil-clad laminate.

1、21、101‧‧‧絕緣基座基材 1, 21, 101‧‧‧ Insulated base material

1a、1b、4a、4b、21a、21b、101a、101b‧‧‧主面 1a, 1b, 4a, 4b, 21a, 21b, 101a, 101b

1x、21x‧‧‧樹脂殘渣 1x, 21x ‧‧‧ resin residue

2、22、23、102‧‧‧金屬箔 2, 22, 23, 102‧‧‧ metal foil

2a、22a、23b、102a‧‧‧接受連接盤 2a, 22a, 23b, 102a

2b、22b、102b‧‧‧配線 2b, 22b, 102b‧‧‧ Wiring

3、103‧‧‧單面覆金屬箔層疊板 3.103‧‧‧Single-sided metal foil laminated board

4、104‧‧‧絕緣樹脂膜 4, 104‧‧‧ insulating resin film

5‧‧‧金屬薄膜 5‧‧‧ metal film

6‧‧‧保護膜 6‧‧‧ protective film

7、26a、26b、26c、26d、105‧‧‧有底導通孔 7, 26a, 26b, 26c, 26d, 105‧‧‧ bottomed via

8‧‧‧背面處理膜 8‧‧‧Backside treatment film

9、27、106‧‧‧導電糊劑 9, 27, 106‧‧‧ conductive paste

9a、27a‧‧‧突出部 9a, 27a ‧‧‧ protrusion

10、30‧‧‧配線基材 10, 30‧‧‧ wiring substrate

23a‧‧‧穿孔加工用掩模 23a‧‧‧Mask for drilling

24‧‧‧雙面覆金屬箔層疊板 24‧‧‧ double-sided metal foil laminate

25‧‧‧黏接劑層 25‧‧‧Adhesive layer

31、32、33、34‧‧‧導電孔 31, 32, 33, 34‧‧‧ conductive holes

40‧‧‧印刷配線板 40‧‧‧printed wiring board

圖1為用於說明第一實施方式的印刷配線板的製造方法的流程圖。 FIG. 1 is a flowchart for explaining a method for manufacturing a printed wiring board according to the first embodiment.

圖2為用於說明第一實施方式的印刷配線板的製造方 法的步驟剖視圖。 Fig. 2 is a process cross-sectional view for explaining a method of manufacturing a printed wiring board according to the first embodiment.

圖3為承接圖2的用於說明第一實施方式的印刷配線板的製造方法的步驟剖視圖。 3 is a cross-sectional view of a step for explaining the method of manufacturing the printed wiring board according to the first embodiment, following FIG. 2.

圖4為承接圖3的用於說明第一實施方式的印刷配線板的製造方法的步驟剖視圖。 FIG. 4 is a sectional view of a step for explaining the method of manufacturing a printed wiring board according to the first embodiment, following FIG. 3.

圖5為用於說明第二實施方式的印刷配線板的製造方法的流程圖。 FIG. 5 is a flowchart for explaining a method for manufacturing a printed wiring board according to the second embodiment.

圖6為用於說明第二實施方式的印刷配線板的製造方法的步驟剖視圖。 FIG. 6 is a process cross-sectional view for describing a method of manufacturing a printed wiring board according to the second embodiment.

圖7為承接圖6的用於說明第二實施方式的印刷配線板的製造方法的步驟剖視圖。 FIG. 7 is a process cross-sectional view illustrating a method of manufacturing a printed wiring board according to the second embodiment, following FIG. 6.

圖8為承接圖7的用於說明第二實施方式的印刷配線板的製造方法的步驟剖視圖。 FIG. 8 is a process cross-sectional view for explaining a method of manufacturing a printed wiring board according to the second embodiment, following FIG. 7.

圖9為用於說明第三實施方式的印刷配線板的製造方法的流程圖。 FIG. 9 is a flowchart for explaining a method for manufacturing a printed wiring board according to the third embodiment.

圖10為用於說明第三實施方式的印刷配線板的製造方法的步驟剖視圖。 FIG. 10 is a process cross-sectional view for describing a method of manufacturing a printed wiring board according to the third embodiment.

圖11為承接著圖10的用於說明第三實施方式的印刷配線板的製造方法的步驟剖視圖。 FIG. 11 is a process cross-sectional view for describing a method of manufacturing a printed wiring board according to the third embodiment, following FIG. 10.

圖12為用於說明比較例的印刷配線板的製造方法的步驟剖視圖。 FIG. 12 is a process sectional view for explaining a method of manufacturing a printed wiring board according to a comparative example.

圖13為承接圖12的用於說明比較例的印刷配線板的製造方法的步驟剖視圖。 FIG. 13 is a process cross-sectional view illustrating a method of manufacturing a printed wiring board according to a comparative example, following FIG. 12.

以下，對於本發明的實施方式，參照圖式進行說明。另外，各圖中對於具有等同功能的構成要素賦予相同的符號。 Hereinafter, embodiments of the present invention will be described with reference to the drawings. In addition, in each figure, the same code | symbol is attached | subjected to the component which has an equivalent function.

(第一實施方式) (First Embodiment)

對於本發明的第一實施方式的印刷配線板的製造方法，沿著圖1的流程圖進行說明。本實施方式以單面覆金屬箔層疊板為起始材料。 A method for manufacturing a printed wiring board according to the first embodiment of the present invention will be described along the flowchart in FIG. 1. This embodiment uses a single-sided metal foil-clad laminate as a starting material.

首先，準備單面覆金屬箔層疊板3和保護膜6(步驟S11)。如圖2中的(a)所示，單面覆金屬箔層疊板3具有絕緣基座基材1和在絕緣基座基材1的一面上形成的金屬箔2(第一金屬箔)。絕緣基座基材1具有主面1a(第一主面)和與主面1a相反一側的主面1b(第二主面)。本實施方式中，主面1a為絕緣基座基材1的上表面，主面1b為絕緣基座基材1的下表面。 First, a single-sided metal foil-clad laminate 3 and a protective film 6 are prepared (step S11). As shown in (a) of FIG. 2, the single-sided metal foil-clad laminate 3 includes an insulating base substrate 1 and a metal foil 2 (first metal foil) formed on one surface of the insulating base substrate 1. The insulating base substrate 1 includes a main surface 1a (first main surface) and a main surface 1b (second main surface) opposite to the main surface 1a. In the present embodiment, the main surface 1 a is the upper surface of the insulating base substrate 1, and the main surface 1 b is the lower surface of the insulating base substrate 1.

絕緣基座基材1為例如由液晶聚合物(LCP)等形成的絕緣膜，其厚度為例如100μm。另外，絕緣基座基材1可以具有可撓性，也可以不具有可撓性。例如，絕緣基座基材1可以是聚醯亞胺、聚對苯二甲酸乙二醇酯等用於柔性印刷配線板的絕緣樹脂膜，或也可以是如玻璃環氧樹脂那樣由硬質的絕緣樹脂形成。 The insulating base substrate 1 is an insulating film formed of, for example, a liquid crystal polymer (LCP) or the like, and has a thickness of, for example, 100 μm. The insulating base substrate 1 may or may not have flexibility. For example, the insulating base substrate 1 may be an insulating resin film for flexible printed wiring boards such as polyimide and polyethylene terephthalate, or it may be a hard insulating material such as glass epoxy resin. Resin formation.

金屬箔2形成於絕緣基座基材1的主面1b。金屬箔2為例如銅箔，其厚度為例如12μm。另外，金屬箔2也可以由銅以外的金屬(銀、鋁等)形成。 The metal foil 2 is formed on the main surface 1 b of the insulating base substrate 1. The metal foil 2 is, for example, a copper foil, and its thickness is, for example, 12 μm. The metal foil 2 may be formed of a metal (silver, aluminum, or the like) other than copper.

如圖2中的(b)所示，保護膜6具有可撓性的絕緣樹脂 膜4以及在該絕緣樹脂膜4的一面形成的金屬薄膜5。 As shown in FIG. 2 (b), the protective film 6 includes a flexible insulating resin film 4 and a metal thin film 5 formed on one surface of the insulating resin film 4.

絕緣樹脂膜4具有主面4a(第三主面)和與主面4a相反一側的主面4b(第四主面)。本實施方式中，主面4a為絕緣樹脂膜4的上表面，主面4b為絕緣樹脂膜4的下表面。 The insulating resin film 4 has a main surface 4a (a third main surface) and a main surface 4b (a fourth main surface) opposite to the main surface 4a. In this embodiment, the main surface 4 a is the upper surface of the insulating resin film 4, and the main surface 4 b is the lower surface of the insulating resin film 4.

絕緣樹脂膜4例如由聚對苯二甲酸乙二醇酯(PET)形成，其厚度為例如20μm。另外，絕緣樹脂膜4也可以由聚醯亞胺、聚醯胺、聚萘二甲酸乙二醇酯(PEN)等其他絕緣材料構成。 The insulating resin film 4 is formed of, for example, polyethylene terephthalate (PET), and has a thickness of, for example, 20 μm. The insulating resin film 4 may be made of other insulating materials such as polyimide, polyimide, and polyethylene naphthalate (PEN).

絕緣樹脂膜4的厚度規定導電糊劑的突起量(後述突出部9a的高度)。如果該突起量過大，則印刷配線板的平坦度受損。另一方面，如果突起量過小，則無法充分確保層間連接的可靠性。考慮到這樣的情況，絕緣樹脂膜4的厚度較佳為20±10μm的範圍，更佳為20±5μm的範圍。 The thickness of the insulating resin film 4 defines the amount of protrusion of the conductive paste (the height of the protruding portion 9a described later). If the amount of the protrusion is too large, the flatness of the printed wiring board is impaired. On the other hand, if the amount of protrusions is too small, the reliability of the interlayer connection cannot be sufficiently ensured. In consideration of such a case, the thickness of the insulating resin film 4 is preferably in a range of 20 ± 10 μm, and more preferably in a range of 20 ± 5 μm.

金屬薄膜5形成於主面4a。金屬薄膜5為例如銅蒸鍍膜。另外，金屬薄膜5也可以由銅以外的金屬，例如鋁、鎳構成。此外，金屬薄膜5也可以是藉由蒸鍍以外的方法，例如濺射、化學鍍來形成的薄膜。 The metal thin film 5 is formed on the main surface 4a. The metal thin film 5 is, for example, a copper vapor-deposited film. The metal thin film 5 may be made of a metal other than copper, for example, aluminum or nickel. The metal thin film 5 may be a thin film formed by a method other than vapor deposition, for example, sputtering or electroless plating.

金屬薄膜5具有在後述的雷射加工步驟中容易被雷射貫通的厚度。在此，「金屬薄膜5被貫通」是指在雷射的照射位置上金屬薄膜5的整個厚度被除去。 The metal thin film 5 has a thickness that is easily penetrated by a laser in a laser processing step described later. Here, "the metal thin film 5 is penetrated" means that the entire thickness of the metal thin film 5 is removed at the laser irradiation position.

此外，金屬薄膜5具有在後述的電漿處理步驟中絕緣樹脂膜4不受到電漿蝕刻的厚度。在此，「絕緣樹脂膜4不受到電漿蝕刻」是指絕緣樹脂膜4的主面4a維持被金屬薄膜5所被覆的狀態，不露出絕緣樹脂膜4。此外，金屬 薄膜5具有可在後述的軟蝕刻步驟中被除去的厚度。 The metal thin film 5 has a thickness such that the insulating resin film 4 is not subjected to plasma etching in a plasma processing step described later. Here, "the insulating resin film 4 is not subjected to plasma etching" means that the main surface 4a of the insulating resin film 4 is maintained in a state covered by the metal thin film 5, and the insulating resin film 4 is not exposed. The metal thin film 5 has a thickness that can be removed in a soft etching step described later.

第一實施方式中，在絕緣樹脂膜4的主面4b上形成有微黏著材(未圖示)。該微黏著材的厚度為例如10μm。微黏著材具有在後述的剝離步驟中能夠將保護膜6從單面覆金屬箔層疊板3剝離的程度的較弱黏著力。 In the first embodiment, a micro-adhesive material (not shown) is formed on the main surface 4 b of the insulating resin film 4. The thickness of the micro-adhesive material is, for example, 10 μm. The micro-adhesive material has a weak adhesive force to such an extent that the protective film 6 can be peeled from the single-sided metal foil-clad laminate 3 in a peeling step described later.

接下來，如圖2中的(c)所示，藉由照相化學腐蝕法將單面覆金屬箔層疊板3的金屬箔2圖案化而形成接受連接盤2a(步驟S12)。接受連接盤2a的直徑設為例如φ 250μm左右。另外，也可以在本步驟中形成配線2b。此外，本步驟也可以在進行了後述的黏貼步驟、雷射加工步驟、電漿處理步驟、軟蝕刻步驟、印刷步驟、剝離步驟或加熱步驟後進行。 Next, as shown in FIG. 2 (c), the metal foil 2 of the single-sided metal foil-clad laminate 3 is patterned by a photochemical etching method to form a receiving land 2 a (step S12). The diameter of the receiving lands 2a is set to, for example, about φ250 μm. The wiring 2b may be formed in this step. In addition, this step may be performed after performing an adhesion step, a laser processing step, a plasma processing step, a soft etching step, a printing step, a peeling step, or a heating step described later.

接下來，如圖2(d)和圖3中的(a)所示，將保護膜6貼合於單面覆金屬箔層疊板3(黏貼步驟，步驟S13)。更詳細而言，以絕緣基座基材1的主面1a與保護膜6的主面4b相對的方式將保護膜6貼合於單面覆金屬箔層疊板3。本步驟中，保護膜6藉由形成在絕緣樹脂膜4的主面4b上的微黏著材而貼合於單面覆金屬箔層疊板3。 Next, as shown in FIG. 2 (d) and FIG. 3 (a), the protective film 6 is attached to the single-sided metal foil-clad laminate 3 (adhesion step, step S13). More specifically, the protective film 6 is attached to the single-sided metal foil-clad laminate 3 so that the main surface 1 a of the insulating base substrate 1 and the main surface 4 b of the protective film 6 face each other. In this step, the protective film 6 is bonded to the single-sided metal foil-clad laminate 3 by a micro-adhesive material formed on the main surface 4 b of the insulating resin film 4.

接下來，如圖3中的(b)所示，藉由對保護膜6的預定部位照射雷射，從而形成在底面露出接受連接盤2a的有底導通孔7(雷射加工步驟，步驟S14)。有底導通孔7的直徑為例如φ 150μm至200μm。本步驟中所用的雷射為例如二氧化碳氣體雷射或UV-YAG雷射。 Next, as shown in FIG. 3 (b), a predetermined portion of the protective film 6 is irradiated with a laser to form a bottomed via hole 7 that exposes the receiving pad 2 a on the bottom surface (laser processing step, step S14). ). The diameter of the bottomed via hole 7 is, for example, φ 150 μm to 200 μm. The laser used in this step is, for example, a carbon dioxide gas laser or a UV-YAG laser.

接下來，如圖3中的(b)和圖3中的(c)所示，藉由電漿 蝕刻來除去存在於有底導通孔7內部的樹脂殘渣1x(電漿處理步驟，步驟S15)。如圖3中的(b)的放大圖所示，樹脂殘渣1x存在於在有底導通孔7的底面露出的接受連接盤2a的背面處理膜(防護金屬膜)8的微細凹部中、絕緣基座基材1與接受連接盤2a的邊界附近等。另外，藉由本步驟的電漿蝕刻來除去樹脂殘渣的處理被稱為表面沾汙去除處理。 Next, as shown in (b) in FIG. 3 and (c) in FIG. 3, the resin residue 1x existing inside the bottomed via 7 is removed by plasma etching (plasma processing step, step S15) . As shown in the enlarged view of (b) in FIG. 3, the resin residue 1x exists in the fine recessed portion of the back surface treatment film (protective metal film) 8 of the receiving land 2a exposed on the bottom surface of the bottomed via 7 and the insulating base. The vicinity of the boundary between the seat base material 1 and the receiving land 2a and the like. In addition, the process of removing the resin residue by the plasma etching in this step is called a surface stain removal process.

背面處理膜8是在金屬箔2的背面(即，與絕緣基座基材1接觸一側的面)形成的處理膜，其是以提高金屬箔2與絕緣基座基材1的密合性等為目的而在單面覆金屬箔層疊板3的製造時設置的膜。例如，背面處理膜8為Ni/Cr膜。 The back surface treatment film 8 is a treatment film formed on the back surface of the metal foil 2 (that is, the surface in contact with the insulating base substrate 1), and is used to improve the adhesion between the metal foil 2 and the insulating base substrate 1. A film provided for the purpose of manufacturing the single-sided metal-clad laminate 3 for the purpose. For example, the back surface treatment film 8 is a Ni / Cr film.

接下來，如圖4中的(a)所示，藉由濕式蝕刻來除去在有底導通孔7的底面露出的接受連接盤2a的背面處理膜8以及金屬薄膜5(軟蝕刻步驟，步驟S16)。本步驟中，不僅除去背面處理膜8，還除去保護膜6的金屬薄膜5。 Next, as shown in FIG. 4 (a), the back surface treatment film 8 and the metal film 5 of the receiving pad 2 a exposed on the bottom surface of the bottomed via 7 are removed by wet etching (soft etching step, step S16). In this step, not only the back surface treatment film 8 but also the metal thin film 5 of the protective film 6 is removed.

接下來，如圖4中的(b)所示，使用印刷方法在有底導通孔7內填充導電糊劑9(印刷步驟，步驟S17)。本步驟中，例如使用絲網印刷的方法。本步驟中，保護膜6發揮作為印刷掩模的功能。導電糊劑9是使銅粒子、銀粒子等金屬粒子分散於作為糊劑狀熱固性樹脂的樹脂黏合劑中而得到的糊劑。 Next, as shown in FIG. 4 (b), a conductive paste 9 is filled in the bottomed via 7 using a printing method (printing step, step S17). In this step, for example, a screen printing method is used. In this step, the protective film 6 functions as a print mask. The conductive paste 9 is a paste obtained by dispersing metal particles such as copper particles and silver particles in a resin binder as a paste-like thermosetting resin.

另外，在印刷步驟中，從防止氣孔的混入的觀點出發，較佳為在真空環境下進行導電糊劑的印刷。例如，使用絲網印刷用的真空印刷機較佳。由此，即使在印刷中產生空 隙(不被導電糊劑填充的區域)，該空隙也會在真空狀態的釋放時藉由大氣壓被壓碎而消失，因而能夠防止氣孔的產生。 In addition, in the printing step, it is preferable to perform printing of the conductive paste in a vacuum environment from the viewpoint of preventing the mixing of pores. For example, it is preferable to use a vacuum printer for screen printing. Accordingly, even when a void (a region not filled with the conductive paste) is generated during printing, the void is crushed and disappeared by the atmospheric pressure when the vacuum state is released, so that generation of pores can be prevented.

如上所述，由於金屬薄膜5在軟蝕刻步驟中被除去，因而在印刷步驟中，能夠防止構成金屬薄膜5的金屬成分作為異物而混入導電糊劑。 As described above, since the metal thin film 5 is removed in the soft etching step, it is possible to prevent the metal component constituting the metal thin film 5 from being mixed into the conductive paste as a foreign matter in the printing step.

接下來，如圖4中的(c)所示，從絕緣基座基材1剝離絕緣樹脂膜4(剝離步驟，步驟S18)。由此，使填充於有底導通孔7中的導電糊劑9的一部分從絕緣基座基材1突出，以作為突出部9a。 Next, as shown in FIG. 4 (c), the insulating resin film 4 is peeled from the insulating base substrate 1 (peeling step, step S18). As a result, a part of the conductive paste 9 filled in the bottomed via 7 is protruded from the insulating base substrate 1 as the protruding portion 9 a.

經過上述步驟，能夠得到圖4中的(c)所示的配線基材10。 Through the above steps, the wiring base material 10 shown in FIG. 4 (c) can be obtained.

如上所述，由於在電漿處理步驟中，絕緣樹脂膜4被金屬薄膜5所被覆，因此能夠防止因絕緣樹脂膜4引起的自由基的失活。因此，能夠防止因電漿蝕刻引起的蝕刻速率的降低。 As described above, since the insulating resin film 4 is covered with the metal thin film 5 in the plasma processing step, it is possible to prevent inactivation of radicals caused by the insulating resin film 4. Therefore, it is possible to prevent a decrease in the etching rate due to plasma etching.

此外，在電漿處理步驟中絕緣樹脂膜4被金屬薄膜5所被覆。因此，可以防止絕緣樹脂膜4的主面4a藉由電漿蝕刻而被蝕刻，可維持絕緣樹脂膜4的主面4a的平坦性。因此，可以抑制在印刷步驟中導電糊劑殘留於絕緣樹脂膜4，能夠防止導電糊劑的產率的降低。 In addition, the insulating resin film 4 is covered with the metal thin film 5 in the plasma processing step. Therefore, the main surface 4a of the insulating resin film 4 can be prevented from being etched by plasma etching, and the flatness of the main surface 4a of the insulating resin film 4 can be maintained. Therefore, it is possible to suppress the conductive paste from remaining on the insulating resin film 4 in the printing step, and it is possible to prevent a decrease in the yield of the conductive paste.

此外，由於在電漿處理步驟中絕緣樹脂膜4被金屬薄膜5保護，因而絕緣樹脂膜4的厚度可以維持均勻。因此，能夠使導電糊劑9的突起量(突出部9a的高度)均勻。 In addition, since the insulating resin film 4 is protected by the metal thin film 5 in the plasma processing step, the thickness of the insulating resin film 4 can be maintained uniform. Therefore, it is possible to make the protrusion amount (the height of the protruding portion 9a) of the conductive paste 9 uniform.

如上所示，根據第一實施方式，能夠防止電漿處理步驟的效率以及導電糊劑的產率降低，並且能夠使導電糊劑的突起量均勻。 As described above, according to the first embodiment, it is possible to prevent the efficiency of the plasma treatment step and the yield of the conductive paste from being lowered, and it is possible to make the protrusion amount of the conductive paste uniform.

另外，金屬薄膜5和金屬箔2較佳為在軟蝕刻步驟中能夠同時除去，更佳為由相同材料構成。本實施方式中，金屬薄膜5由與金屬箔2相同的銅構成。由此，在軟蝕刻步驟中，能夠防止因異種金屬的混合存在而引起的導電孔內的污染。 In addition, the metal thin film 5 and the metal foil 2 are preferably removed at the same time in the soft etching step, and more preferably, they are made of the same material. In the present embodiment, the metal thin film 5 is made of the same copper as the metal foil 2. Thus, in the soft etching step, it is possible to prevent contamination in the conductive holes caused by the mixed presence of dissimilar metals.

此外，在黏貼步驟中，也可以在單面覆金屬箔層疊板3的下表面也貼合保護膜6。由此，在電漿處理步驟中，能夠防止沒有被接受連接盤2a以及配線2b被覆的絕緣基座基材1的主面1b被蝕刻，也能夠防止因主面1b的露出而導致電漿處理步驟的效率降低。將單面覆金屬箔層疊板3的下表面用金屬板等夾具覆蓋而避免電漿與主面1b接觸，也能夠得到同樣的功效。 In addition, in the sticking step, the protective film 6 may also be bonded to the lower surface of the single-sided metal foil-clad laminate 3. Thus, in the plasma processing step, the main surface 1b of the insulating base substrate 1 not covered by the receiving pad 2a and the wiring 2b can be prevented from being etched, and the plasma processing can be prevented from being caused by the main surface 1b being exposed The efficiency of the steps is reduced. The same effect can be obtained by covering the lower surface of the single-sided metal foil-clad laminate 3 with a jig such as a metal plate to prevent the plasma from coming into contact with the main surface 1b.

<金屬薄膜的厚度> <Thickness of metal film>

對於考慮到雷射加工步驟以及電漿處理步驟時的金屬薄膜5的厚度以何種程度為較佳，基於實施例進行說明。 The extent to which the thickness of the metal thin film 5 in the laser processing step and the plasma processing step is taken into consideration will be described based on examples.

本實施例中，使用具有PET膜作為絕緣樹脂膜4，並具有在PET膜上形成的銅蒸鍍膜作為金屬薄膜5的保護膜6。在電漿處理步驟中，使用O2與CF4的混合氣體。在雷射加工步驟中，從穩定加工的觀點出發，使用作為紅外線雷射的二氧化碳氣體雷射。具體而言，使用三菱電機公司製的二氧化碳氣體雷射加工機(ML605GTXIII-5100U2)。利 用孔徑等將光束直徑調整為150μm。此外，將脈衝寬度設為10μSec，將每1個脈衝的能量設為4mJ，設為用5次射擊來形成1個有底導通孔7的加工條件。 In this embodiment, a protective film 6 having a PET film as the insulating resin film 4 and a copper vapor-deposited film formed on the PET film is used as the metal thin film 5. In the plasma treatment step, a mixed gas of O 2 and CF 4 is used. In the laser processing step, a carbon dioxide gas laser is used as an infrared laser from the viewpoint of stable processing. Specifically, a carbon dioxide gas laser processing machine (ML605GTXIII-5100U2) manufactured by Mitsubishi Electric Corporation was used. The beam diameter is adjusted to 150 μm using an aperture or the like. In addition, the pulse width was set to 10 μSec, the energy per pulse was set to 4 mJ, and the processing conditions for forming one bottomed via 7 with 5 shots were set.

在上述條件下，以金屬薄膜5的厚度為參數，調查了雷射加工步驟以及電漿處理步驟中的加工性。將其結果示於表1。表1中，為了比較，將12μm厚的銅箔時和在表面沒有形成金屬薄膜5的PET膜(相當於上述比較例的情況)時的結果也一併記載。此外，表1中的電漿蝕刻量表示使用間歇式的電漿裝置時的蝕刻量。 Under the above conditions, using the thickness of the metal thin film 5 as a parameter, the processability in the laser processing step and the plasma processing step was investigated. The results are shown in Table 1. In Table 1, for comparison, the results when the copper foil having a thickness of 12 μm is used and when the PET film (corresponding to the above-mentioned comparative example) in which the metal thin film 5 is not formed on the surface are also described. In addition, the plasma etching amount in Table 1 shows the etching amount when an intermittent plasma device is used.

關於電漿蝕刻量的測定方法，如下進行。首先，在PET膜上用膠帶貼附樹脂膜，進行電漿蝕刻。然後，用雷射顯微鏡測定由膠帶保護的部位和露出的部位(即未被膠帶所被覆的部位)之間的高低差。在此，作為雷射顯微鏡，使用基恩士公司製VK-X250。 The measurement method of the plasma etching amount is performed as follows. First, a resin film is attached to a PET film with an adhesive tape, and plasma etching is performed. Then, a laser microscope was used to measure the difference in height between the portion protected by the tape and the exposed portion (ie, the portion not covered by the tape). Here, as a laser microscope, VK-X250 manufactured by Keyence Corporation was used.

此外，表1中的銅蒸鍍膜的厚度時預先利用由導體電阻率測定導體厚度的裝置(三菱化學公司製，MCP-S521)進行測定的值。更具體而言，將銅蒸鍍後的樹脂膜切成300mm見方的大小，對所切出的樹脂膜，縱橫分別以100mm間隔(合計9處)測定銅蒸鍍膜的厚度，將其平均值作為代表值。 In addition, the thickness of the copper vapor-deposited film in Table 1 is a value measured in advance using an apparatus (MCP-S521, manufactured by Mitsubishi Chemical Corporation) for measuring the thickness of a conductor using a conductor resistivity. More specifically, the copper-deposited resin film was cut into a size of 300 mm square, and the thickness of the copper-deposited film was measured at 100 mm intervals (total of 9 points) in the vertical and horizontal directions of the cut resin film. Representative value.

銅蒸鍍膜的厚度為0.05μm的情況下，雖然在雷射加工步驟中貫通了銅蒸鍍膜，但在電漿處理步驟中的蝕刻量為1.3μm。該蝕刻量與12μm厚的銅箔的蝕刻量(1.9μm)相比為2/3左右。其理由是因為，由於銅蒸鍍膜過薄，因而在電漿處理步驟的中途，PET膜從銅蒸鍍膜露出而電漿蝕刻的效率降低。 When the thickness of the copper vapor-deposited film is 0.05 μm, although the copper vapor-deposited film is penetrated in the laser processing step, the amount of etching in the plasma processing step is 1.3 μm. This etching amount is about 2/3 compared with the etching amount (1.9 μm) of a 12 μm-thick copper foil. The reason is that, because the copper vapor-deposited film is too thin, the PET film is exposed from the copper vapor-deposited film in the middle of the plasma treatment step, and the efficiency of the plasma etching is reduced.

銅蒸鍍膜的厚度為0.08μm的情況下，在雷射加工步驟中貫通了銅蒸鍍膜，此外，在電漿處理步驟中的蝕刻量為2.0μm。該蝕刻量與12μm厚的銅箔時為同等程度。由此可知，如果銅蒸鍍膜的厚度有0.08μm，則在電漿處理步驟中PET膜不受到電漿蝕刻，能夠防止蝕刻效率的降低。 When the thickness of the copper vapor-deposited film is 0.08 μm, the copper vapor-deposited film is penetrated in the laser processing step, and the etching amount in the plasma processing step is 2.0 μm. This etching amount is about the same as that of a copper foil having a thickness of 12 μm. From this, it can be seen that if the thickness of the copper vapor-deposited film is 0.08 μm, the PET film is not subjected to plasma etching in the plasma treatment step, and a reduction in etching efficiency can be prevented.

在銅蒸鍍膜的厚度為0.1μm以及0.12μm的情況下，也能夠在雷射加工步驟中貫通銅蒸鍍膜。另一方面，銅蒸 鍍膜的厚度為0.15μm的情況下，無法在雷射加工步驟中貫通銅蒸鍍膜。另外，藉由對銅蒸鍍膜實施粗糙化處理，能夠增加紅外雷射的吸收。由此，數μm厚的銅膜也能夠貫通，但製造成本會增大。 Even when the thickness of the copper vapor-deposited film is 0.1 μm and 0.12 μm, the copper vapor-deposited film can be penetrated in the laser processing step. On the other hand, when the thickness of the copper vapor-deposited film is 0.15 m, the copper vapor-deposited film cannot be penetrated in the laser processing step. In addition, by subjecting the copper vapor-deposited film to a roughening treatment, the absorption of infrared laser light can be increased. As a result, a copper film having a thickness of several μm can pass through, but the manufacturing cost increases.

由上述結果可知，從在雷射加工步驟中的金屬薄膜5的加工性和在電漿處理步驟中的絕緣樹脂膜4的保護的觀點出發，金屬薄膜5的厚度較佳為0.08μm以上0.12μm以下。 From the above results, it is known that from the viewpoint of the processability of the metal thin film 5 in the laser processing step and the protection of the insulating resin film 4 in the plasma processing step, the thickness of the metal thin film 5 is preferably 0.08 μm or more and 0.12 μm or less. the following.

(第二實施方式) (Second Embodiment)

對於本發明的第二實施方式的印刷配線板的製造方法，沿著圖5的流程圖進行說明。本實施方式以雙面覆金屬箔層疊板為起始材料。 A method for manufacturing a printed wiring board according to a second embodiment of the present invention will be described along the flowchart of FIG. 5. This embodiment uses a double-sided metal foil-clad laminate as a starting material.

首先，準備雙面覆金屬箔層疊板24和保護膜6(步驟S21)。如圖6中的(a)所示，雙面覆金屬箔層疊板24具有絕緣基座基材21、金屬箔22(第一金屬箔)和金屬箔23(第二金屬箔)。絕緣基座基材21具有主面21a(第一主面)和與主面21a相反一側的主面21b(第二主面)。本實施方式中，主面21a為絕緣基座基材21的上表面，主面21b為絕緣基座基材21的下表面。 First, a double-sided metal foil-clad laminate 24 and a protective film 6 are prepared (step S21). As shown in (a) of FIG. 6, the double-sided metal foil-clad laminate 24 includes an insulating base substrate 21, a metal foil 22 (first metal foil), and a metal foil 23 (second metal foil). The insulating base substrate 21 has a main surface 21a (first main surface) and a main surface 21b (second main surface) opposite to the main surface 21a. In the present embodiment, the main surface 21 a is the upper surface of the insulating base substrate 21, and the main surface 21 b is the lower surface of the insulating base substrate 21.

絕緣基座基材21為例如由液晶聚合物(LCP)等形成的絕緣膜，其厚度為例如100μm。另外，絕緣基座基材21可以是具有可撓性的基材，也可以是不具有可撓性的基材。 The insulating base substrate 21 is an insulating film formed of, for example, a liquid crystal polymer (LCP) or the like, and has a thickness of, for example, 100 μm. The insulating base substrate 21 may be a substrate having flexibility, or a substrate having no flexibility.

金屬箔22形成在絕緣基座基材21的主面21b。金屬 箔23形成在絕緣基座基材21的主面21a。金屬箔22和23為例如銅箔，其厚度分別為例如12μm。另外，金屬箔22和23也可以由銅以外的金屬(銀、鋁等)形成。 The metal foil 22 is formed on the main surface 21 b of the insulating base substrate 21. The metal foil 23 is formed on the main surface 21a of the insulating base substrate 21. The metal foils 22 and 23 are, for example, copper foils, and their thicknesses are, for example, 12 μm. The metal foils 22 and 23 may be formed of a metal (silver, aluminum, or the like) other than copper.

如在第一實施方式中說明那樣，保護膜6具有絕緣樹脂膜4和金屬薄膜5。在第二實施方式中，如後前述保護膜6介由黏接劑層25與絕緣基座基材21黏接，因此可以在絕緣樹脂膜4的主面4b不形成微黏著材。另外，也可以使用在一面上形成有微黏著材的保護膜。 As described in the first embodiment, the protective film 6 includes an insulating resin film 4 and a metal thin film 5. In the second embodiment, as described later, the protective film 6 is adhered to the insulating base substrate 21 via the adhesive layer 25, so that a micro-adhesive material can not be formed on the main surface 4 b of the insulating resin film 4. Moreover, you may use the protective film which formed the microadhesive material on one surface.

接下來，如圖6中的(b)所示，藉由照相化學腐蝕法將雙面覆金屬箔層疊板24的金屬箔22和23圖案化，形成穿孔加工用掩模(敷形掩模)23a、接受連接盤22a以及接受連接盤23b(步驟S22)。穿孔加工用掩模23a以及接受連接盤23b形成於絕緣基座基材21的主面21a，接受連接盤22a形成於絕緣樹脂膜4的主面21b。如圖6中的(b)所示，穿孔加工用掩模23a形成在接受連接盤22a的上方。另外，金屬箔22的圖案化也可以在本步驟之後(進行了後述黏貼步驟、雷射加工步驟、電漿處理步驟、軟蝕刻步驟、印刷步驟、剝離步驟或加熱步驟之後)另行進行。 Next, as shown in FIG. 6 (b), the metal foils 22 and 23 of the double-sided metal foil-clad laminate 24 are patterned by a photochemical etching method to form a mask (conformal mask) for perforation processing. 23a. Accept the lands 22a and 23b (step S22). The mask 23 a for perforation processing and the receiving lands 23 b are formed on the main surface 21 a of the insulating base substrate 21, and the receiving lands 22 a are formed on the main surface 21 b of the insulating resin film 4. As shown in FIG. 6 (b), a mask 23a for perforation processing is formed above the receiving land 22a. In addition, the patterning of the metal foil 22 may be separately performed after this step (after performing the sticking step, laser processing step, plasma processing step, soft etching step, printing step, peeling step, or heating step described later).

本步驟中，也可以形成配線22b。接受連接盤22a以及23b的直徑設為例如φ 50μm左右。穿孔加工用掩模23a的直徑設為例如φ 350μm左右。 In this step, the wiring 22b may be formed. The diameter of the receiving lands 22a and 23b is set to, for example, about φ 50 μm. The diameter of the mask 23a for perforation processing is set to about 350 [mu] m, for example.

接下來，如圖6中的(c)所示，在絕緣基座基材21上形成黏接劑層25(步驟S23)。該黏接劑層25以將圖案化後的金屬箔23(即穿孔加工用掩模23a以及接受連接盤23b) 埋入的方式設置在絕緣基座基材21的主面21a。例如，黏接劑層25藉由將低流動度接合片(例如15μm厚)層壓於絕緣基座基材21來形成。為了在第三實施方式中說明的層疊步驟時還殘存所需要的黏接性，低流動度接合片的層壓在比熱固化溫度低的溫度下進行。 Next, as shown in FIG. 6 (c), an adhesive layer 25 is formed on the insulating base substrate 21 (step S23). The adhesive layer 25 is provided on the main surface 21 a of the insulating base substrate 21 so that the patterned metal foil 23 (that is, the mask 23 a for perforation processing and the receiving land 23 b) is embedded. For example, the adhesive layer 25 is formed by laminating a low-fluidity bonding sheet (for example, 15 μm thick) on the insulating base substrate 21. In order to maintain the required adhesiveness at the lamination step described in the third embodiment, lamination of the low-fluidity bonding sheet is performed at a temperature lower than the heat curing temperature.

另外，也可以在形成黏接劑層25之前，進行圖案化後的金屬箔23的粗糙化處理。由此，能夠提高金屬箔23和黏接劑層25的黏接強度。 In addition, before the formation of the adhesive layer 25, the roughening treatment of the patterned metal foil 23 may be performed. Thereby, the adhesive strength of the metal foil 23 and the adhesive layer 25 can be improved.

接下來，如圖6中的(c)所示，介由黏接劑層25將雙面覆金屬箔層疊板24與保護膜6貼合(黏貼步驟，步驟S24)。即，以絕緣樹脂膜4與黏接劑層25黏接的方式將保護膜6層疊在黏接劑層25上。更詳細而言，對於保護膜6，以絕緣基座基材21的主面21a與保護膜6的主面4b相對的方式，藉由黏接劑層25而貼合於雙面覆金屬箔層疊板24。本步驟中，保護膜6藉由在絕緣基座基材21的主面21a上形成的黏接劑層25與雙面覆金屬箔層疊板24貼合。 Next, as shown in FIG. 6 (c), the double-sided metal foil-clad laminate 24 and the protective film 6 are bonded via the adhesive layer 25 (adhesion step, step S24). That is, the protective film 6 is laminated on the adhesive layer 25 so that the insulating resin film 4 and the adhesive layer 25 are adhered. More specifically, the protective film 6 is bonded to the double-sided metal foil laminate by the adhesive layer 25 so that the main surface 21 a of the insulating base substrate 21 and the main surface 4 b of the protective film 6 face each other.板 24。 Plate 24. In this step, the protective film 6 is bonded to the double-sided metal foil-clad laminated board 24 through the adhesive layer 25 formed on the main surface 21 a of the insulating base substrate 21.

接下來，如圖7中的(a)所示，藉由對保護膜6的預定部位照射雷射來形成有底導通孔26a、26b、26c和26d(雷射加工步驟，步驟S25)。有底導通孔26a和26c為在中途中露出穿孔加工用掩模23a且在底面露出接受連接盤22a的較深的階梯式有底導通孔。有底導通孔26b為在底面露出接受連接盤23b的較淺的有底導通孔。有底導通孔26d是在底面露出接受連接盤22a的較深的有底導通孔。在本步驟中使用的雷射為例如二氧化碳氣體雷射。 Next, as shown in FIG. 7 (a), bottom via holes 26 a, 26 b, 26 c, and 26 d are formed by irradiating a predetermined portion of the protective film 6 with a laser (laser processing step, step S25). The bottomed vias 26a and 26c are deep stepped bottomed vias in which the mask 23a for perforation processing is exposed halfway and the receiving land 22a is exposed on the bottom surface. The bottomed via 26b is a shallow bottomed via that exposes the receiving pad 23b on the bottom surface. The bottomed via 26d is a deep bottomed via that exposes the receiving pad 22a on the bottom surface. The laser used in this step is, for example, a carbon dioxide gas laser.

另外，關於有底導通孔26a至26d的直徑，考慮到在第三實施方式中說明的層疊步驟中的對位偏移，較佳設為比有底導通孔7的直徑大。例如，有底導通孔26a、26c、26d的直徑設為φ 250μm至300μm，有底導通孔26b的直徑設為φ 200μm。 The diameter of the bottomed vias 26 a to 26 d is preferably larger than the diameter of the bottomed vias 7 in consideration of the misalignment in the lamination step described in the third embodiment. For example, the diameter of the bottomed vias 26a, 26c, and 26d is set to φ250 μm to 300 μm, and the diameter of the bottomed vias 26b is set to φ200 μm.

接下來，如圖7中的(b)所示，藉由電漿蝕刻來除去存在於有底導通孔26a至26d內部的樹脂殘渣21x(電漿處理步驟，步驟S26)。如圖7中的(a)的放大圖所示，樹脂殘渣21x存在於在有底導通孔26a的底面露出的接受連接盤22a的背面處理膜(防護金屬膜)8的微細凹部中、絕緣基座基材21與接受連接盤22a的邊界附近等。有底導通孔26b、26c和26d中也同樣地存在樹脂殘渣。 Next, as shown in FIG. 7 (b), the resin residue 21x existing inside the bottomed via holes 26a to 26d is removed by plasma etching (plasma processing step, step S26). As shown in the enlarged view of (a) in FIG. 7, the resin residue 21x exists in the fine recessed portion of the back surface treatment film (protective metal film) 8 of the receiving pad 22a exposed on the bottom surface of the bottomed via 26a, and the insulating base. The vicinity of the boundary between the seat base 21 and the receiving land 22a and the like. Residual residues are similarly present in the bottomed vias 26b, 26c, and 26d.

接下來，如圖7中的(c)所示，藉由濕式蝕刻來除去在有底導通孔26a、26c和26d的底面露出的接受連接盤22a的背面處理膜、在有底導通孔26b的底面露出的接受連接盤23b的背面處理膜(軟蝕刻步驟，步驟S27)。本步驟中，不僅除去金屬箔的背面處理膜，而且還除去保護膜6的金屬薄膜5。 Next, as shown in FIG. 7 (c), the backside treatment film of the receiving pad 22 a exposed on the bottom surface of the bottomed vias 26 a, 26 c, and 26 d is removed by wet etching, and the bottomed via 26 b is removed by wet etching. The back surface treatment film of the receiving lands 23b exposed on the bottom surface (soft etching step, step S27). In this step, not only the back surface treatment film of the metal foil, but also the metal thin film 5 of the protective film 6 is removed.

接下來，如圖8中的(a)所示，使用印刷方法，在有底導通孔26a至26d內填充導電糊劑27(印刷步驟，步驟S28)。本步驟中，使用例如絲網印刷的方法。導電糊劑27是使金屬粒子分散在作為糊劑狀的熱固性樹脂的樹脂黏合劑中而得到的糊劑。 Next, as shown in (a) of FIG. 8, the conductive paste 27 is filled in the bottomed vias 26 a to 26 d using a printing method (printing step, step S28). In this step, a method such as screen printing is used. The conductive paste 27 is a paste obtained by dispersing metal particles in a resin binder as a paste-like thermosetting resin.

接下來，如圖8中的(b)所示，從黏接劑層25剝離絕 緣樹脂膜4(剝離步驟，步驟S29)。由此，使填充在有底導通孔26a至26d中的導電糊劑27的一部分從黏接劑層25突出，以作為突出部27a。 Next, as shown in Fig. 8 (b), the insulating resin film 4 is peeled from the adhesive layer 25 (peeling step, step S29). Thereby, a part of the conductive paste 27 filled in the bottomed vias 26a to 26d is protruded from the adhesive layer 25 as the protruding portion 27a.

經過上述步驟，能夠得到圖8中的(b)中所示的配線基材30。 Through the above steps, the wiring base material 30 shown in FIG. 8 (b) can be obtained.

根據第二實施方式，與第一實施方式同樣地，能夠防止電漿處理步驟的效率以及導電糊劑的產率降低，並且能夠使導電糊劑27的突起量均勻。 According to the second embodiment, as in the first embodiment, it is possible to prevent the efficiency of the plasma processing step and the yield of the conductive paste from being lowered, and it is possible to make the protrusion amount of the conductive paste 27 uniform.

另外，關於金屬薄膜5的厚度，與第一實施方式中說明的情況同樣地，較佳為0.08μm以上0.12μm以下。 The thickness of the metal thin film 5 is preferably 0.08 μm or more and 0.12 μm or less as in the case described in the first embodiment.

此外，本實施方式中，形成了階梯形的深的有底導通孔26a、26c、淺的有底導通孔26b以及深的有底導通孔26d這3種有底導通孔，但也可以以它們的任意組合來形成有底導通孔。 Further, in the present embodiment, three types of bottomed vias, ie, stepped deep bottomed vias 26a, 26c, shallow bottomed vias 26b, and deep bottomed vias 26d, are formed. To form bottomed vias.

(第三實施方式) (Third Embodiment)

對於本發明的第三實施方式的印刷配線板的製造方法，沿著圖9的流程圖進行說明。本實施方式中，以在第一實施方式中製造的配線基材10以及在第二實施方式中製造的配線基材30為起始材料，製造多層的印刷配線板。 A method for manufacturing a printed wiring board according to a third embodiment of the present invention will be described along the flowchart of FIG. 9. In this embodiment, a multilayer printed wiring board is manufactured using the wiring substrate 10 manufactured in the first embodiment and the wiring substrate 30 manufactured in the second embodiment as starting materials.

首先，準備配線基材10和配線基材30(步驟S31)。如圖4所示，配線基材10具有在剝離步驟(第一實施方式的步驟S18)中得到的突出部9a。如圖8所示，配線基材30具有在剝離步驟(第二實施方式的步驟S29)中得到的突出部27a。 First, the wiring base material 10 and the wiring base material 30 are prepared (step S31). As shown in FIG. 4, the wiring substrate 10 has a protruding portion 9 a obtained in the peeling step (step S18 of the first embodiment). As shown in FIG. 8, the wiring substrate 30 has a protruding portion 27 a obtained in the peeling step (step S29 of the second embodiment).

接下來，如圖10所示，將配線基材10以及配線基材30以突出部9a與突出部27a彼此抵接的方式對位並層疊(層疊步驟，步驟S32)。 Next, as shown in FIG. 10, the wiring base material 10 and the wiring base material 30 are aligned and laminated so that the protruding portions 9 a and the protruding portions 27 a abut each other (stacking step, step S32).

接下來，將層疊後的配線基材10和配線基材30(以下，也稱為「層疊體」)加熱並一體化(加熱步驟，步驟S33)。具體而言，使用真空壓力裝置或真空層壓裝置，對層疊體進行加熱和加壓。例如，將層疊體加熱至200℃左右，並且以數MPa左右的壓力加壓。另外，該溫度與液晶聚合物的軟化溫度相比低50℃以上。 Next, the laminated wiring substrate 10 and the wiring substrate 30 (hereinafter, also referred to as “laminates”) are heated and integrated (heating step, step S33). Specifically, the laminated body is heated and pressed using a vacuum pressure device or a vacuum lamination device. For example, the laminated body is heated to about 200 ° C and pressurized at a pressure of about several MPa. This temperature is lower than the softening temperature of the liquid crystal polymer by 50 ° C or higher.

在使用真空壓力裝置的情況下，例如，在上述的加熱、加壓條件下將層疊體保持30分鐘至60分鐘左右。由此，完成黏接劑層25的熱固化以及導電糊劑9、27的黏合劑樹脂的熱固化。在使用真空層壓裝置的情況下，加熱、加壓時間為數分鐘左右，在其結束的時間點，熱固化反應尚未完成。因此，將層疊體從真空層壓裝置移送至烘爐裝置，進行後固化處理。後固化處理中，例如在200℃左右的溫度下將層疊體加熱60分鐘左右。由此，完成黏接劑層25的熱固化以及導電糊劑9、27的黏合劑樹脂的熱固化。 When a vacuum pressure device is used, for example, the laminated body is held under the above-mentioned heating and pressing conditions for about 30 minutes to about 60 minutes. This completes the thermal curing of the adhesive layer 25 and the thermal curing of the adhesive resin of the conductive pastes 9 and 27. In the case of using a vacuum laminating apparatus, the heating and pressing time is about several minutes, and the thermal curing reaction has not been completed at the time when it ends. Therefore, the laminated body is transferred from a vacuum laminating apparatus to an oven apparatus, and a post-curing process is performed. In the post-curing treatment, the laminate is heated, for example, at a temperature of about 200 ° C. for about 60 minutes. This completes the thermal curing of the adhesive layer 25 and the thermal curing of the adhesive resin of the conductive pastes 9 and 27.

另外，為了使導電糊劑9、27中所含的金屬粒子彼此藉由200℃左右的加熱來進行金屬鍵合，金屬粒子的熔點較佳為加熱溫度以下。作為這樣的低熔點金屬，可舉出例如In、SnIn、SnBi。導電糊劑的印刷步驟(步驟S17、S28)中，較佳為使用包含由這些低熔點金屬中的任一種構成的金屬粒子的導電糊劑。 In addition, in order that the metal particles contained in the conductive pastes 9 and 27 are metal-bonded to each other by heating at about 200 ° C., the melting point of the metal particles is preferably equal to or lower than the heating temperature. Examples of such a low-melting-point metal include In, SnIn, and SnBi. In the printing step (steps S17 and S28) of the conductive paste, it is preferable to use a conductive paste containing metal particles made of any of these low-melting metals.

此外，在金屬箔2、22、23為銅箔的情況下，在印刷步驟(步驟S17、S28)中，較佳為使用包含由Sn、Zn、Al、Ag、Ni或Cu或者它們的合金構成的金屬粒子的導電糊劑。由此，藉由200℃左右的加熱，從而導電糊劑9、27中所含的金屬粒子與銅箔形成合金層而進行金屬鍵合。 In addition, when the metal foils 2, 22, and 23 are copper foils, in the printing step (steps S17 and S28), it is preferable to use a composition including Sn, Zn, Al, Ag, Ni, or Cu, or an alloy thereof. Conductive paste of metal particles. Thereby, the metal particles contained in the conductive pastes 9 and 27 and the copper foil form an alloy layer by heating at about 200 ° C. to perform metal bonding.

經過上述步驟，能夠得到圖11所示的印刷配線板40。加熱步驟之後，根據需要，進行露在外側的配線層的表面處理、阻焊劑等的形成以及外形加工。 Through the above steps, the printed wiring board 40 shown in FIG. 11 can be obtained. After the heating step, if necessary, surface treatment of the exposed wiring layer, formation of solder resist, and the like are performed.

如圖11所示，印刷配線板40具備導電孔31、32、33、34。導電孔31將接受連接盤2a、穿孔加工用掩模23a與接受連接盤22a相互電性連接。這樣，導電孔31將形成在絕緣基座基材1的上表面的第一配線層、形成在絕緣基座基材21的上表面的第二配線層(內層)與形成在絕緣基座基材21的下表面的第三配線層的全部相互電性連接。導電孔32將第一配線層與第二配線層電性連接，導電孔33將第二配線層與第三配線層電性連接，導電孔34將第一配線層與第三配線層電性連接。這樣，能夠得到所有的組合的層間連接。 As shown in FIG. 11, the printed wiring board 40 includes conductive holes 31, 32, 33, and 34. The conductive hole 31 electrically connects the receiving lands 2a, the mask 23a for perforation processing, and the receiving lands 22a to each other. In this way, the conductive hole 31 forms the first wiring layer formed on the upper surface of the insulating base substrate 1, the second wiring layer (inner layer) formed on the upper surface of the insulating base substrate 21, and the insulating base substrate. All the third wiring layers on the lower surface of the material 21 are electrically connected to each other. The conductive hole 32 electrically connects the first wiring layer and the second wiring layer, the conductive hole 33 electrically connects the second wiring layer and the third wiring layer, and the conductive hole 34 electrically connects the first wiring layer and the third wiring layer. . In this way, all combinations of interlayer connections can be obtained.

如上所示，藉由將2塊配線基材(配線基材10和配線基材30)層疊，從而能夠得到具有3個配線層由導電孔相互電性連接的印刷配線板40。 As described above, by laminating two wiring substrates (the wiring substrate 10 and the wiring substrate 30), a printed wiring board 40 having three wiring layers electrically connected to each other through conductive holes can be obtained.

因此，根據第三實施方式，對於3個配線層，2塊配線基材就足夠，因而能夠削減印刷配線板的製造中所需要的材料，還能夠簡化製造步驟。其結果是，能夠削減製造 成本，並能夠以低價提供印刷配線板。 Therefore, according to the third embodiment, two wiring base materials are sufficient for three wiring layers, so that materials required for manufacturing a printed wiring board can be reduced, and manufacturing steps can be simplified. As a result, it is possible to reduce manufacturing costs and to provide a printed wiring board at a low price.

進而，由於配線基材10、30的導電糊劑的突起量均勻，因而能夠製造具有高可靠性的層間導電路的印刷配線板。 Furthermore, since the protrusion amounts of the conductive pastes of the wiring base materials 10 and 30 are uniform, it is possible to manufacture a printed wiring board having a highly reliable interlayer conductive circuit.

另外，上述印刷配線板40的製造方法中，在將配線基材10與配線基材30層疊的層疊步驟之前，將金屬箔2、金屬箔22圖案化而形成接受連接盤等的預定圖案，但本發明不限於此。例如，也可以在加熱步驟之後將金屬箔2和金屬箔22圖案化。 In the manufacturing method of the printed wiring board 40 described above, before the laminating step of laminating the wiring substrate 10 and the wiring substrate 30, the metal foil 2 and the metal foil 22 are patterned to form a predetermined pattern such as a land, but The invention is not limited to this. For example, the metal foil 2 and the metal foil 22 may be patterned after the heating step.

此外，對於具有3層配線層的印刷配線板進行了說明，但本發明可以適用於具有4層以上配線層的印刷配線板。 Although a printed wiring board having three wiring layers has been described, the present invention can be applied to a printed wiring board having four or more wiring layers.

<保護膜> <Protective film>

如上所述，保護膜6為具有絕緣樹脂膜4和金屬薄膜5的帶有金屬薄膜的保護膜，在製造具備由導電糊劑形成的導電孔的印刷配線板時，藉由微黏著材或黏接劑而可剝離地黏貼於覆金屬箔層疊板。覆金屬箔層疊板可以是單面覆金屬箔層疊板，或也可以是雙面覆金屬箔層疊板。 As described above, the protective film 6 is a protective film with a metal thin film having an insulating resin film 4 and a metal thin film 5. When a printed wiring board having conductive holes formed of a conductive paste is manufactured, a micro-adhesive material or adhesive is used. Adhesively and releasably adhere to the metal-clad laminate. The metal foil-clad laminate may be a single-sided metal foil-clad laminate, or may be a double-sided metal foil-clad laminate.

如前所述，金屬薄膜5具有如下厚度，即，在雷射加工步驟中被雷射容易地貫通，並在電漿處理步驟中絕緣樹脂膜4不受到電漿蝕刻，且在軟蝕刻步驟中被除去的厚度。 As described above, the metal thin film 5 has a thickness such that it is easily penetrated by the laser in the laser processing step, and the insulating resin film 4 is not subjected to plasma etching in the plasma processing step, and in the soft etching step Removed thickness.

藉由使用保護膜6，從而在電漿處理步驟中能夠防止蝕刻效率的降低，並且能夠保護黏貼於覆金屬箔層疊板的絕緣樹脂膜。其結果是，能夠防止電漿處理步驟的效率以及導電糊劑的產率降低並且能夠使導電糊劑9的突起量均 勻。 By using the protective film 6, it is possible to prevent a decrease in the etching efficiency in the plasma processing step and to protect the insulating resin film adhered to the metal foil-clad laminate. As a result, the efficiency of the plasma treatment step and the reduction in the yield of the conductive paste can be prevented, and the protrusion amount of the conductive paste 9 can be made uniform.

基於上述記載，如果是所屬技術領域中具有通常知識者，則有可能會想到本發明的追加功效、各種變形，但本發明的實施方式不限於上述實施方式。可以在不脫離從申請專利範圍中所規定的內容及其均等物導出的本發明的概念性構思和主旨的範圍內，進行各種追加、變更以及部分削除。 Based on the above description, if it is a person with ordinary knowledge in the technical field, he may think of additional effects and various modifications of the present invention, but the embodiments of the present invention are not limited to the above-mentioned embodiments. Various additions, changes, and partial deletions can be made without departing from the conceptual idea and gist of the present invention derived from the contents specified in the scope of the patent application and their equivalents.

Claims (12)

一種印刷配線板的製造方法，係具備下述步驟：準備覆金屬箔層疊板的步驟，前述覆金屬箔層疊板具備具有第一主面和與前述第一主面相反一側的第二主面的絕緣基座基材以及在前述第二主面形成的金屬箔；準備保護膜的步驟，前述保護膜具備具有第三主面和與前述第三主面相反一側的第四主面的絕緣樹脂膜以及在前述第三主面形成的金屬薄膜；黏貼步驟，以前述第一主面與前述第四主面相對的方式將前述保護膜貼合於前述覆金屬箔層疊板；雷射加工步驟，藉由對前述保護膜的預定部位照射雷射，從而形成在底面露出前述金屬箔的有底導通孔；電漿處理步驟，藉由電漿蝕刻來除去存在於前述有底導通孔的內部的樹脂殘渣；軟蝕刻步驟，藉由濕式蝕刻來除去在前述有底導通孔的底面露出的前述金屬箔的背面處理膜以及前述金屬薄膜；使用印刷方法在前述有底導通孔內填充導電糊劑的步驟；以及剝離前述絕緣樹脂膜的剝離步驟。     A method for manufacturing a printed wiring board includes the steps of preparing a metal foil-clad laminate, and the metal foil-clad laminate includes a first main surface and a second main surface opposite to the first main surface. An insulating base substrate and a metal foil formed on the second main surface; a step of preparing a protective film, the protective film including insulation having a third main surface and a fourth main surface opposite to the third main surface A resin film and a metal thin film formed on the third main surface; an adhering step, bonding the protective film to the metal foil-clad laminate so that the first main surface is opposite to the fourth main surface; a laser processing step By irradiating a predetermined portion of the protective film with a laser to form a bottomed via hole exposing the metal foil on the bottom surface; in a plasma processing step, removing the inside of the bottomed via hole by plasma etching Resin residue; soft etching step, removing the backside treatment film of the metal foil and the metal film exposed on the bottom surface of the bottomed via hole by wet etching; using a printing method to Said step of bottomed via hole filled with a conductive paste; and stripping the insulating resin film peeling step.     如請求項1所記載之印刷配線板的製造方法，其中前述金屬薄膜具有下述厚度，即，在前述雷射加工步驟 中由前述雷射貫通且在前述電漿處理步驟中前述絕緣樹脂膜不受到電漿蝕刻的厚度。     The method for manufacturing a printed wiring board according to claim 1, wherein the metal thin film has a thickness that is penetrated by the laser in the laser processing step and that the insulating resin film is not formed in the plasma processing step. Thickness subject to plasma etching.     如請求項2所記載之印刷配線板的製造方法，其中前述金屬薄膜的厚度為0.08μm以上0.12μm以下。     The method for manufacturing a printed wiring board according to claim 2, wherein the thickness of the metal thin film is 0.08 μm or more and 0.12 μm or less.     如請求項2或3所記載之印刷配線板的製造方法，其中前述金屬薄膜由銅、鋁或鎳形成。     The method for manufacturing a printed wiring board according to claim 2 or 3, wherein the metal thin film is formed of copper, aluminum, or nickel.     如請求項2或3所記載之印刷配線板的製造方法，其中前述金屬薄膜由與前述金屬箔相同的材料形成。     The method for manufacturing a printed wiring board according to claim 2 or 3, wherein the metal thin film is formed of the same material as the metal foil.     如請求項1至3中任一項所記載之印刷配線板的製造方法，其中前述黏貼步驟中，前述保護膜藉由在前述絕緣樹脂膜的前述第四主面上形成的微黏著材而貼合於前述覆金屬箔層疊板。     The method for manufacturing a printed wiring board according to any one of claims 1 to 3, wherein in the pasting step, the protective film is pasted by a micro-adhesive material formed on the fourth main surface of the insulating resin film. Combined with the metal foil-clad laminate.     如請求項1至3中任一項所記載之印刷配線板的製造方法，其中前述黏貼步驟中，前述保護膜藉由在前述絕緣基座基材的前述第一主面上形成的黏接劑層而貼合於前述覆金屬箔層疊板。     The method for manufacturing a printed wiring board according to any one of claims 1 to 3, wherein in the pasting step, the protective film is formed by an adhesive formed on the first main surface of the insulating base substrate. Layers and bonded to the metal foil-clad laminate.     如請求項1至3中任一項所記載之印刷配線板的製造方法，其中作為前述覆金屬箔層疊板，準備進一步具有形成在前述絕緣基座基材的前述第一主面上的第二金屬箔的雙面覆金屬箔層疊板；在前述黏貼步驟之前，進一步具備：將前述第二金屬箔圖案化而形成穿孔加工用掩模的步驟；以及 形成黏接劑層的步驟，前述黏接劑層在前述絕緣基座基材的前述第一主面上形成且將經過前述圖案化的前述第二金屬箔埋沒；在前述黏貼步驟中，以前述絕緣樹脂膜與前述黏接劑層黏接的方式將前述保護膜層疊在前述黏接劑層上。     The method for manufacturing a printed wiring board according to any one of claims 1 to 3, wherein the metal foil-clad laminate is further provided with a second formed on the first main surface of the insulating base substrate. The metal foil double-sided metal foil-clad laminated board; before the pasting step, further comprising: a step of patterning the second metal foil to form a mask for perforation processing; and a step of forming an adhesive layer, the pasting An adhesive layer is formed on the first main surface of the insulating base substrate and the patterned second metal foil is buried; in the pasting step, the insulating resin film is adhered to the adhesive layer. The aforementioned protective film is laminated on the aforementioned adhesive layer.     如請求項1至3中任一項所記載之印刷配線板的製造方法，其中進一步具備：將藉由前述剝離步驟得到的具有前述導電糊劑的突出部的第一配線基材和第二配線基材，以前述突出部彼此抵接的方式層疊的步驟；以及將前述層疊後的第一配線基材以及第二配線基材加熱並一體化的步驟。     The method for manufacturing a printed wiring board according to any one of claims 1 to 3, further comprising: a first wiring base material and a second wiring including a protruding portion having the conductive paste obtained by the peeling step. A step of laminating the substrates so that the protruding portions abut each other; and a step of heating and integrating the first wiring substrate and the second wiring substrate after the lamination.     一種保護膜，係貼合於覆金屬箔層疊板的保護膜，前述覆金屬箔層疊板具備具有第一主面和與前述第一主面相反一側的第二主面的絕緣基座基材以及在前述第二主面形成的金屬箔；前述保護膜具備具有第三主面和與前述第三主面相反一側的第四主面的絕緣樹脂膜以及在前述第三主面形成的金屬薄膜；介由微黏著材或黏接材層，以前述第四主面與前述第一主面相對的方式貼合。     A protective film is a protective film attached to a metal foil-clad laminate, the metal foil-clad laminate comprising an insulating base substrate having a first main surface and a second main surface opposite to the first main surface. And a metal foil formed on the second main surface; the protective film includes an insulating resin film having a third main surface and a fourth main surface opposite to the third main surface; and a metal formed on the third main surface A thin film; and pasted through the micro-adhesive material or the adhesive material layer in such a manner that the fourth main surface is opposite to the first main surface.     如請求項10所記載之保護膜，其中前述金屬薄膜具有下述厚度，即，在藉由對前述保護膜的預定部位照射 雷射而形成在底面露出前述金屬箔的有底導通孔的雷射加工步驟中，易於由前述雷射貫通；在藉由電漿蝕刻來除去存在於前述有底導通孔內部的樹脂殘渣的電漿處理步驟中，前述絕緣樹脂膜不受到電漿蝕刻，且在藉由濕式蝕刻來除去在前述有底導通孔的底面露出的前述金屬箔的背面處理膜的軟蝕刻步驟中被除去的厚度。     The protective film according to claim 10, wherein the metal thin film has a thickness such that a laser having a bottomed via hole exposed on the bottom surface of the metal foil is formed on the bottom surface by irradiating a predetermined portion of the protective film with a laser. In the processing step, it is easy to penetrate by the laser; in the plasma processing step of removing the resin residue existing in the bottomed via hole by plasma etching, the insulating resin film is not subjected to plasma etching, and The thickness removed in the soft etching step of removing the back surface treatment film of the metal foil exposed on the bottom surface of the bottomed via hole by wet etching.     如請求項11所記載之保護膜，其中前述金屬薄膜的厚度為0.08μm以上0.12μm以下。     The protective film according to claim 11, wherein the thickness of the metal thin film is 0.08 μm or more and 0.12 μm or less.    
TW107109266A 2017-03-28 2018-03-19 Method for manufacturing printed wiring board and protective film TWI653920B (en)

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