TW201819766A - Air cooling heat dissipation device - Google Patents
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本案係關於一種氣冷散熱裝置，尤指一種利用氣體泵浦提供驅動氣流以進行散熱之氣冷散熱裝置。The present invention relates to an air-cooling heat dissipating device, and more particularly to an air-cooling heat dissipating device that uses a gas pump to provide a driving airflow for heat dissipation.
隨著科技的進步，各種電子設備例如可攜式電腦、平板電腦、工業電腦、可攜式通訊裝置、影音播放器等已朝向輕薄化、可攜式及高效能的趨勢發展，這些電子設備於其有限內部空間中必須配置各種高積集度或高功率之電子元件，為了使電子設備之運算速度更快和功能更強大，電子設備內部之電子元件於運作時將產生更多的熱能，並導致高溫。此外，這些電子設備大部分皆設計為輕薄、扁平且具緊湊外型，且沒有額外的內部空間用於散熱冷卻，故電子設備中的電子元件易受到熱能、高溫的影響，進而導致干擾或受損等問題。With the advancement of technology, various electronic devices such as portable computers, tablet computers, industrial computers, portable communication devices, video players, etc. have been trending toward thin, portable, high-performance, and these electronic devices are In the limited internal space, various high-accumulation or high-power electronic components must be configured. In order to make the electronic device faster and more powerful, the electronic components inside the electronic device will generate more heat during operation, and Causes high temperatures. In addition, most of these electronic devices are designed to be thin, flat, and compact, and have no additional internal space for heat dissipation. Therefore, electronic components in electronic devices are susceptible to heat and high temperatures, which may cause interference or interference. Damage and other issues.
一般而言，電子設備內部的散熱方式可分為主動式散熱及被動式散熱。主動式散熱通常採用軸流式風扇或鼓風式風扇設置於電子設備內部，藉由軸流式風扇或鼓風式風扇驅動氣流，以將電子設備內部電子元件所產生的熱能轉移，俾實現散熱。然而，軸流式風扇及鼓風式風扇在運作時會產生較大的噪音，且其體積較大不易薄型化及小型化，再則軸流式風扇及鼓風式風扇的使用壽命較短，故傳統的軸流式風扇及鼓風式風扇並不適用於輕薄化及可攜式之電子設備中實現散熱。Generally speaking, the heat dissipation method inside the electronic device can be divided into active heat dissipation and passive heat dissipation. The active heat dissipation is usually disposed inside the electronic device by using an axial fan or a blower fan, and the airflow is driven by the axial fan or the blower fan to transfer the heat energy generated by the electronic components inside the electronic device to achieve heat dissipation. . However, axial fans and blower fans generate large noise during operation, and their bulk is not easy to be thinner and smaller, and axial fans and blower fans have a shorter service life. Therefore, the traditional axial flow fan and the blower fan are not suitable for heat dissipation in thin and light portable and portable electronic devices.
再者，許多電子元件會利用例如表面黏貼技術(Surface Mount Technology, SMT)、選擇性焊接(Selective Soldering)等技術焊接於印刷電路板(Printed Circuit Board, PCB)上，然而採用前述焊接方式所焊接之電子元件，於經長時間處於高熱能、高溫環境下，容易使電子元件與印刷電路板相脫離，且大部分電子元件亦不耐高溫，若電子元件長時間處於高熱能、高溫環境下，易導致電子元件之性能穩定度下降及壽命減短。Furthermore, many electronic components are soldered to a printed circuit board (PCB) using techniques such as Surface Mount Technology (SMT) and Selective Soldering, but soldered by the soldering method described above. The electronic components are easily separated from the printed circuit board after being in a high thermal energy and high temperature environment for a long time, and most of the electronic components are not resistant to high temperatures. If the electronic components are in a high heat and high temperature environment for a long time, It is easy to cause the performance stability of electronic components to decrease and the lifespan to be shortened.
第1圖係為傳統散熱機構之結構示意圖。如第1圖所示，傳統散熱機構係為一被動式散熱機構，其包括熱傳導板12，該熱傳導板12係藉由一導熱膠13與一待散熱之電子元件11相貼合，藉由導熱膠13以及熱傳導板12所形成之熱傳導路徑，可使電子元件11利用熱傳導及自然對流方式達到散熱。然而，前述散熱機構之散熱效率較差，無法滿足應用需求。Figure 1 is a schematic view of the structure of a conventional heat dissipation mechanism. As shown in FIG. 1 , the conventional heat dissipating mechanism is a passive heat dissipating mechanism, and includes a heat conducting plate 12 which is adhered to a electronic component 11 to be dissipated by a thermal conductive adhesive 13 by a thermal conductive adhesive. 13 and the heat conduction path formed by the heat conduction plate 12 allows the electronic component 11 to achieve heat dissipation by heat conduction and natural convection. However, the heat dissipation mechanism of the foregoing heat dissipation mechanism is inferior and cannot meet the application requirements.
有鑑於此，實有必要發展一種氣冷散熱裝置，以解決現有技術所面臨之問題。In view of this, it is necessary to develop an air-cooling heat sink to solve the problems faced by the prior art.
本案之目的在於提供一種氣冷散熱裝置，其可應用於各種電子設備，以對電子設備內部之電子元件進行循環式熱對流散熱，俾提升散熱效能，降低噪音，且使電子設備內部電子元件之性能穩定並延長使用壽命。The purpose of the present invention is to provide an air-cooling heat dissipating device, which can be applied to various electronic devices to perform circulating heat convection heat dissipation on electronic components inside the electronic device, improve heat dissipation performance, reduce noise, and enable electronic components inside the electronic device. Stable performance and long life.
本案之另一目的在於提供一種氣冷散熱裝置，其具有溫控功能，可依據電子設備內部電子元件之溫度變化，控制氣體泵浦之運作，俾提升散熱效能，以及延長氣冷散熱裝置之使用壽命。Another object of the present invention is to provide an air-cooling heat dissipating device having a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, improve the heat dissipation performance, and prolong the use of the air cooling device. life.
為達上述目的，本案之一較廣義實施樣態為提供一種氣冷散熱裝置，用於對電子元件散熱，該氣冷散熱裝置包含：導流載體，包括第一表面、第二表面、腔室、導氣端開口以及複數個導流排氣槽，其中腔室貫穿第一表面及第二表面，導氣端開口設置於第一表面並與腔室相連通，複數個導流排氣槽設置於第二表面並與腔室相連通，其中電子元件係容置於腔室；以及氣體泵浦，設置於導流載體之第一表面，且封閉導氣端開口，其中藉由驅動氣體泵浦，以將氣流經由導氣端開口導入腔室，並對電子元件進行熱交換，且將與電子元件進行熱交換後之氣流經由複數個導流排氣槽排出。In order to achieve the above object, a generalized implementation of the present invention provides an air-cooling heat dissipating device for dissipating heat from an electronic component, the air-cooling heat dissipating device comprising: a flow guiding carrier, including a first surface, a second surface, and a chamber a gas guiding end opening and a plurality of flow guiding exhaust grooves, wherein the chamber penetrates the first surface and the second surface, the air guiding end opening is disposed on the first surface and communicates with the chamber, and the plurality of guiding exhaust grooves are disposed And on the second surface and in communication with the chamber, wherein the electronic component is housed in the chamber; and the gas is pumped, disposed on the first surface of the flow guiding carrier, and the opening of the gas guiding end is closed, wherein the gas is driven by driving The airflow is introduced into the chamber through the air-conducting end opening, and the electronic components are heat-exchanged, and the airflow after heat exchange with the electronic components is discharged through the plurality of guiding exhaust grooves.
為達上述目的，本案之另一較廣義實施樣態為提供一種氣冷散熱裝置，用於對電子元件散熱，氣冷散熱裝置包含：導流載體，包括第一表面、第二表面、腔室、導氣端開口以及複數個導流排氣槽，其中腔室貫穿第一表面及第二表面，導氣端開口設置於第一表面並與腔室相連通，複數個導流排氣槽設置於第二表面並與腔室相連通，其中電子元件係容置於腔室；散熱器，貼附於電子元件，且位於腔室；以及氣體泵浦，設置於導流載體之第一表面，且封閉導氣端開口，其中藉由驅動氣體泵浦，以將氣流經由導氣端開口導入腔室，並對電子元件進行熱交換，且將與電子元件進行熱交換後之氣流經由複數個導流排氣槽排出。In order to achieve the above object, another generalized embodiment of the present invention provides an air-cooling heat dissipating device for dissipating heat from an electronic component. The air-cooling heat dissipating device comprises: a flow guiding carrier, including a first surface, a second surface, and a chamber a gas guiding end opening and a plurality of flow guiding exhaust grooves, wherein the chamber penetrates the first surface and the second surface, the air guiding end opening is disposed on the first surface and communicates with the chamber, and the plurality of guiding exhaust grooves are disposed And on the second surface and in communication with the chamber, wherein the electronic component is housed in the chamber; the heat sink is attached to the electronic component and located in the chamber; and the gas is pumped and disposed on the first surface of the flow guiding carrier, And closing the air-conducting end opening, wherein the gas is pumped to introduce the airflow into the chamber through the air-conducting end opening, and the electronic component is heat-exchanged, and the airflow after heat exchange with the electronic component is passed through a plurality of guides The exhaust vent is discharged.
為達上述目的，本案之再一較廣義實施樣態為提供一種氣冷散熱裝置，用於對電子元件散熱，氣冷散熱裝置包含：導流載體，包括第一表面、第二表面、腔室、導氣端開口以及複數個導流排氣槽，其中腔室貫穿第一表面及第二表面，導氣端開口設置於第一表面並與腔室相連通，複數個導流排氣槽設置於第二表面並與腔室相連通，其中電子元件係容置於腔室；導熱管柱，貼附於電子元件之表面，且位於腔室；以及氣體泵浦，設置於導流載體之第一表面，且封閉導氣端開口，其中藉由驅動氣體泵浦，以將氣流經由導氣端開口導入腔室，並對電子元件進行熱交換，且將與電子元件進行熱交換後之氣流經由複數個導流排氣槽排出。In order to achieve the above object, a more general implementation of the present invention provides an air-cooling heat dissipating device for dissipating heat from an electronic component. The air-cooling heat dissipating device comprises: a flow guiding carrier comprising a first surface, a second surface, and a chamber a gas guiding end opening and a plurality of flow guiding exhaust grooves, wherein the chamber penetrates the first surface and the second surface, the air guiding end opening is disposed on the first surface and communicates with the chamber, and the plurality of guiding exhaust grooves are disposed On the second surface and in communication with the chamber, wherein the electronic component is housed in the chamber; the heat pipe string is attached to the surface of the electronic component and located in the chamber; and the gas pump is disposed on the flow guide carrier a surface, and a closed air-conducting end opening, wherein the gas is pumped by the driving gas to introduce the airflow into the chamber through the air-conducting end opening, and heat exchanges the electronic components, and the airflow after heat exchange with the electronic components is passed through A plurality of diversion vents are exhausted.
體現本案特徵與優點的一些典型實施例將在後段的說明中詳細敘述。應理解的是本案能夠在不同的態樣上具有各種的變化，其皆不脫離本案的範圍，且其中的說明及圖示在本質上係當作說明之用，而非架構於限制本案。Some exemplary embodiments embodying the features and advantages of the present invention are described in detail in the following description. It is to be understood that the present invention is capable of various modifications in various aspects, and is not to be construed as a limitation.
第2A圖為本案第一實施例之氣冷散熱裝置之結構示意圖，第2B圖為第2A圖所示之氣冷散熱裝置於AA截面之結構示意圖，以及第3圖為第2A圖所示之導流載體之結構示意圖。如第2A、2B及3圖所示，本案之氣冷散熱裝置2可應用於一電子設備，例如但不限於可攜式電腦、平板電腦、工業電腦、可攜式通訊裝置、影音播放器，以對電子設備內待散熱之電子元件3進行散熱。本案之氣冷散熱裝置2包含導流載體20、氣體泵浦22。導流載體20包括第一表面20a、第二表面20b、腔室201、導氣端開口202以及複數個導流排氣槽203，其中腔室201係貫穿第一表面20a及第二表面20b，導氣端開口202設置於第一表面20a並與腔室201相連通。複數個導流排氣槽203係設置於第二表面20b，用以供氣體流通，其中每一個導流排氣槽203之一端係連通於腔室201，且每一個導流排氣槽203之另一端係延伸至導流載體20之側壁204且與外部相連通，藉此導流載體20之側壁204形成複數個排氣端開口205。導流載體20之腔室201係容設電子元件3。氣體泵浦22係固設於導流載體20之第一表面20a上，且組裝定位於導氣端開口202，並且封閉該導氣端開口202。其中藉由驅動氣體泵浦22，以將氣流經由導氣端開口202導入導流載體20之腔室201並對電子元件3進行熱交換，且將與該電子元件3進行熱交換後之氣流經由複數個導流排氣槽203排出，俾實現對電子元件3之散熱。2A is a schematic structural view of the air-cooling heat dissipating device of the first embodiment of the present invention, FIG. 2B is a structural schematic view of the air-cooling heat dissipating device shown in FIG. 2A in the AA cross section, and FIG. 3 is a second FIG. Schematic diagram of the structure of the flow guiding carrier. As shown in Figures 2A, 2B and 3, the air-cooling heat sink 2 of the present invention can be applied to an electronic device such as, but not limited to, a portable computer, a tablet computer, an industrial computer, a portable communication device, and a video player. The heat dissipation of the electronic component 3 to be dissipated in the electronic device is performed. The air cooling device 2 of the present invention includes a flow guiding carrier 20 and a gas pump 22. The flow guiding carrier 20 includes a first surface 20a, a second surface 20b, a chamber 201, an air guiding end opening 202, and a plurality of guiding exhaust grooves 203, wherein the chamber 201 extends through the first surface 20a and the second surface 20b. The air guide end opening 202 is disposed on the first surface 20a and communicates with the chamber 201. A plurality of diversion vents 203 are disposed on the second surface 20b for gas circulation, wherein one end of each of the diversion vents 203 is in communication with the chamber 201, and each of the diversion vents 203 The other end extends to the side wall 204 of the flow guide carrier 20 and is in communication with the exterior whereby the side walls 204 of the flow guide carrier 20 form a plurality of exhaust end openings 205. The chamber 201 of the flow guiding carrier 20 houses the electronic component 3. The gas pump 22 is fixed to the first surface 20a of the flow guide carrier 20, and is assembled and positioned at the air guide end opening 202, and closes the air guide end opening 202. The gas pump 22 is driven to introduce the gas flow into the chamber 201 of the flow guiding carrier 20 via the air guiding end opening 202, and exchange heat with the electronic component 3, and the airflow after heat exchange with the electronic component 3 is passed through A plurality of diversion vents 203 are exhausted to achieve heat dissipation to the electronic component 3.
於一些實施例中，導流載體20可為但不限於一框體。於本實施例中，導氣端開口202係位於第一表面20a之中央區域。電子元件3係設置於一承載基板4上，其中承載基板4可為但不限於印刷電路板。承載基板4係與導流載體20之第二表面20b相連接，並且使電子元件3容置於導流載體20之腔室201。複數個導流排氣槽203係設置於第二表面20b，且以輻射狀方式向外延伸。於一些實施例中，複數個導流排氣槽203之另一端所形成之排氣端開口205係位於導流載體20之複數個側壁204以及複數個邊角處207，藉此可使氣流於導流載體20之周邊向外排出。In some embodiments, the flow guide carrier 20 can be, but is not limited to, a frame. In the present embodiment, the air guide opening 202 is located in a central region of the first surface 20a. The electronic component 3 is disposed on a carrier substrate 4, wherein the carrier substrate 4 can be, but not limited to, a printed circuit board. The carrier substrate 4 is connected to the second surface 20b of the flow guiding carrier 20, and the electronic component 3 is housed in the chamber 201 of the flow guiding carrier 20. A plurality of flow guiding exhaust grooves 203 are disposed on the second surface 20b and extend outward in a radial manner. In some embodiments, the exhaust end opening 205 formed at the other end of the plurality of flow guiding exhaust grooves 203 is located at a plurality of side walls 204 of the flow guiding carrier 20 and at a plurality of corners 207, thereby allowing airflow to The periphery of the flow guiding carrier 20 is discharged outward.
於本實施例中，氣體泵浦22係為一壓電致動氣體泵浦，用以驅動氣體流動。氣體泵浦22係固設於導流載體20之第一表面20a上，且組裝定位於導氣端開口202，並且封閉該導氣端開口202。承載基板4係貼合設置於導流載體20之第二表面20b，換言之導流載體20與氣體泵浦22之組合體係罩蓋接合於承載基板4上，並使電子元件3而容置於導流載體20之腔室201中。藉由氣體泵浦22及承載基板4封閉導氣端開口202，可使導氣端開口202、腔室201以及複數個導流排氣槽203定義形成封閉式流道，藉此可集中對電子元件3散熱，俾提升散熱效能。應強調的是，本案並不以形成封閉式流道為限，其他流道形式亦可依據實際應用需求調整與變化。當然，在另一實施例中(未圖示)，導流載體20也可設置一容置部，在導氣端開口202外圍，意即容置部為第一表面20a向內凹陷之凹槽，在導氣端開口202外圍，氣體泵浦22直接組裝於容置部上封閉導氣端開口202，同樣也可以實施上述的氣冷散熱裝置2之散熱作用。如此氣體泵浦22凹置組裝於容置部中之設計，以降低氣冷散熱裝置2之整體高度，並可達到輕薄化之效果。In the present embodiment, the gas pump 22 is a piezoelectrically actuated gas pump for driving gas flow. The gas pump 22 is fixed to the first surface 20a of the flow guide carrier 20, and is assembled and positioned at the air guide end opening 202, and closes the air guide end opening 202. The carrier substrate 4 is disposed on the second surface 20b of the flow guiding carrier 20, in other words, the combination cover of the flow guiding carrier 20 and the gas pump 22 is bonded to the carrier substrate 4, and the electronic component 3 is placed in the guide. In the chamber 201 of the flow carrier 20. By closing the air guiding end opening 202 by the gas pump 22 and the carrier substrate 4, the air guiding end opening 202, the chamber 201 and the plurality of guiding exhaust grooves 203 can be defined to form a closed flow path, thereby focusing on the electrons Component 3 dissipates heat and enhances heat dissipation. It should be emphasized that this case is not limited to the formation of closed flow channels, and other flow path forms can be adjusted and changed according to actual application needs. Of course, in another embodiment (not shown), the flow guiding carrier 20 can also be provided with a receiving portion at the periphery of the air guiding end opening 202, that is, the receiving portion is a recess in which the first surface 20a is recessed inward. At the periphery of the air-conducting end opening 202, the gas pump 22 is directly assembled on the accommodating portion to close the air-conducting end opening 202, and the heat-dissipating effect of the air-cooling heat-dissipating device 2 described above can also be implemented. The gas pump 22 is recessed and assembled in the accommodating portion to reduce the overall height of the air-cooling heat dissipating device 2, and the effect of thinning and thinning can be achieved.
於本實施例中，氣體泵浦22係用以驅動氣體流動，以將氣體由氣冷散熱裝置2之外部經由導氣端開口202導入腔室201中。當氣體泵浦22將氣體導入腔室201時，所導入氣體與腔室201內之電子元件3進行熱交換，並推動腔室201中之氣流快速流動，促使熱交換後之氣流將熱能經由導流載體20之複數個導流排氣槽203排至氣冷散熱裝置2之外部。由於氣體泵浦22係連續地作動以導入氣體，使電子元件3可與連續導入之氣體進行熱交換，同時使熱交換後的氣體經由導流載體20之複數個導流排氣槽203排出，藉此可實現對電子元件3之散熱，且可提高散熱效能，進而增加電子元件3之性能穩定度及壽命。In the present embodiment, the gas pump 22 is used to drive the gas flow to introduce the gas into the chamber 201 from the outside of the air-cooling heat sink 2 via the air-conducting end opening 202. When the gas pump 22 introduces the gas into the chamber 201, the introduced gas exchanges heat with the electronic component 3 in the chamber 201, and pushes the airflow in the chamber 201 to flow rapidly, so that the airflow after the heat exchange passes the heat energy through the guide. The plurality of flow guiding exhaust grooves 203 of the flow carrier 20 are discharged to the outside of the air cooling heat sink 2. Since the gas pump 22 is continuously operated to introduce a gas, the electronic component 3 can exchange heat with the continuously introduced gas, and the heat-exchanged gas is discharged through the plurality of flow guiding exhaust grooves 203 of the flow guiding carrier 20. Thereby, the heat dissipation to the electronic component 3 can be achieved, and the heat dissipation performance can be improved, thereby increasing the performance stability and the life of the electronic component 3.
第4圖為本案第二實施例之氣冷散熱裝置之截面結構示意圖。如第4圖所示，本實施例之氣冷散熱裝置2a與第2B圖所示之氣冷散熱裝置2相似，且相同之元件標號代表相同之結構、元件與功能，於此不再贅述。相較於第2B圖所示之氣冷散熱裝置2，本實施例之氣冷散熱裝置2a更包括一散熱器25，連接設置於電子元件3之表面且位於腔室201中。散熱器25包括一底座251及複數個散熱片252，底座251貼附於電子元件3之表面，複數個散熱片252係垂直連接於底座251。藉由散熱器25之設置，可增加散熱面積，使電子元件3所產生之熱能可經由散熱器25而與導入腔室201中之氣體進行熱交換，俾提升散熱效能。Fig. 4 is a schematic cross-sectional view showing the air-cooling heat dissipating device of the second embodiment of the present invention. As shown in FIG. 4, the air-cooling heat dissipating device 2a of the present embodiment is similar to the air-cooling heat dissipating device 2 shown in FIG. 2B, and the same component numbers denote the same structures, elements, and functions, and will not be described again. Compared with the air-cooling heat dissipating device 2 shown in FIG. 2B, the air-cooling heat dissipating device 2a of the present embodiment further includes a heat sink 25 connected to the surface of the electronic component 3 and located in the chamber 201. The heat sink 25 includes a base 251 and a plurality of heat sinks 252. The base 251 is attached to the surface of the electronic component 3, and a plurality of heat sinks 252 are vertically connected to the base 251. By the arrangement of the heat sink 25, the heat dissipation area can be increased, and the heat energy generated by the electronic component 3 can be exchanged with the gas introduced into the chamber 201 via the heat sink 25 to improve the heat dissipation performance.
第5圖為本案第三實施例之氣冷散熱裝置之截面結構示意圖。如第5圖所示，本實施例之氣冷散熱裝置2b與第2B圖所示之氣冷散熱裝置2相似，且相同之元件標號代表相同之結構、元件與功能，於此不再贅述。相較於第2B圖所示之氣冷散熱裝置2，本實施例之氣冷散熱裝置2b包括一導熱管柱26，連接設置於電子元件3之表面且位於腔室201中。導熱管柱26貼附於電子元件3之表面，且導熱管柱26由具高導熱係數之導熱材料所製成。於一些實施例中，導熱管柱26之一端係由導流載體20之側壁204延伸出導流載體20外部坐熱交換，且導熱管柱26之另一端延伸至電子元件3之表面並與電子元件3相接觸。藉由導熱管柱26之設置，可使電子元件3所產生之熱能可經由導熱管柱26而與腔室201中之氣體更快速地進行熱交換，俾提升散熱效能。Fig. 5 is a schematic cross-sectional view showing the air-cooling heat dissipating device of the third embodiment of the present invention. As shown in FIG. 5, the air-cooling heat dissipating device 2b of the present embodiment is similar to the air-cooling heat dissipating device 2 shown in FIG. 2B, and the same component numbers denote the same structures, elements and functions, and will not be described again. Compared with the air-cooling heat dissipating device 2 shown in FIG. 2B, the air-cooling heat dissipating device 2b of the present embodiment includes a heat-conducting heat pipe column 26 connected to the surface of the electronic component 3 and located in the chamber 201. The heat pipe string 26 is attached to the surface of the electronic component 3, and the heat pipe string 26 is made of a heat conductive material having a high thermal conductivity. In some embodiments, one end of the heat pipe string 26 extends from the side wall 204 of the flow guide carrier 20 out of the outer side of the flow guide carrier 20, and the other end of the heat pipe string 26 extends to the surface of the electronic component 3 and is associated with the electron. Element 3 is in contact. By the arrangement of the heat-conducting column 26, the heat energy generated by the electronic component 3 can be heat-exchanged with the gas in the chamber 201 through the heat-conducting column 26 to improve the heat dissipation performance.
第6A及6B圖分別為本案較佳實施例之氣體泵浦於不同視角之分解結構示意圖，第7圖為第6A及6B圖所示之壓電致動器之剖面結構示意圖，以及第8圖為第6A及6B圖所示之氣體泵浦之剖面結構示意圖。如第6A、6B、7及8圖所示，氣體泵浦22係為一壓電致動氣體泵浦，且包括進氣板221、共振片222、壓電致動器223、絕緣片2241、2242及導電片225等結構，其中壓電致動器223係對應於共振片222而設置，並使進氣板221、共振片222、壓電致動器223、絕緣片2241、導電片225及另一絕緣片2242等依序堆疊設置，其組裝完成之剖面圖係如第8圖所示。6A and 6B are respectively schematic views of the exploded structure of the gas pump of the preferred embodiment of the present invention at different viewing angles, and FIG. 7 is a schematic cross-sectional structural view of the piezoelectric actuator shown in FIGS. 6A and 6B, and FIG. It is a schematic diagram of the cross-sectional structure of the gas pump shown in Figs. 6A and 6B. As shown in FIGS. 6A, 6B, 7 and 8, the gas pump 22 is a piezoelectrically actuated gas pump and includes an air inlet plate 221, a resonance plate 222, a piezoelectric actuator 223, and an insulating sheet 2241. 2242 and a conductive sheet 225 and the like, wherein the piezoelectric actuator 223 is disposed corresponding to the resonator piece 222, and the air inlet plate 221, the resonance piece 222, the piezoelectric actuator 223, the insulating piece 2241, the conductive piece 225, and Another insulating sheet 2242 and the like are sequentially stacked, and the assembled cross-sectional view is as shown in FIG.
於本實施例中，進氣板221具有至少一進氣孔221a，其中進氣孔221a之數量以4個為較佳，但不以此為限。進氣孔221a係貫穿進氣板221，用以供氣體自裝置外順應大氣壓力之作用而自該至少一進氣孔221a流入氣體泵浦22之中。進氣板221上具有至少一匯流排孔221b，用以與進氣板221另一表面之該至少一進氣孔221a對應設置。於匯流排孔221b的中心交流處係具有中心凹部221c，且中心凹部221c係與匯流排孔221b相連通，藉此可將自該至少一進氣孔221a進入匯流排孔221b之氣體引導並匯流集中至中心凹部221c，以實現氣體傳遞。於本實施例中，進氣板221具有一體成型的進氣孔221a、匯流排孔221b及中心凹部221c，且於中心凹部221c處即對應形成一匯流氣體的匯流腔室，以供氣體暫存。於一些實施例中，進氣板221之材質可為例如但不限於不鏽鋼材質所構成。於另一些實施例中，由該中心凹部221c處所構成之匯流腔室之深度與匯流排孔221b之深度相同，但不以此為限。共振片222係由一可撓性材質所構成，但不以此為限，且於共振片222上具有一中空孔洞2220，係對應於進氣板221之中心凹部221c而設置，以使氣體流通。於另一些實施例中，共振片222係可由一銅材質所構成，但不以此為限。In the present embodiment, the air inlet plate 221 has at least one air inlet hole 221a, and the number of the air inlet holes 221a is preferably four, but not limited thereto. The air inlet hole 221a penetrates the air inlet plate 221 for allowing gas to flow from the at least one air inlet hole 221a into the gas pump 22 from the outside of the device in response to atmospheric pressure. The air inlet plate 221 has at least one bus bar hole 221b corresponding to the at least one air inlet hole 221a of the other surface of the air intake plate 221. The center AC portion of the bus bar hole 221b has a central recess portion 221c, and the center recess portion 221c communicates with the bus bar hole 221b, whereby the gas entering the bus bar hole 221b from the at least one air inlet hole 221a can be guided and converged. Concentration to the central recess 221c to achieve gas transfer. In the present embodiment, the air inlet plate 221 has an integrally formed air inlet hole 221a, a bus bar hole 221b and a central recessed portion 221c, and a confluent chamber corresponding to a confluent gas is formed at the central recess portion 221c for temporarily storing the gas. . In some embodiments, the material of the air inlet plate 221 may be made of, for example, but not limited to, a stainless steel material. In other embodiments, the depth of the confluence chamber formed by the central recess 221c is the same as the depth of the bus bar hole 221b, but is not limited thereto. The resonator piece 222 is made of a flexible material, but not limited thereto, and has a hollow hole 2220 on the resonance piece 222, which is disposed corresponding to the central concave portion 221c of the air inlet plate 221 to allow gas to circulate. . In other embodiments, the resonant plate 222 can be made of a copper material, but is not limited thereto.
壓電致動器223係由一懸浮板2231、一外框2232、至少一支架2233以及一壓電片2234所共同組裝而成，其中，該壓電片2234貼附於懸浮板2231之第一表面2231c，用以施加電壓產生形變以驅動該懸浮板2231彎曲振動，以及該至少一支架2233係連接於懸浮板2231以及外框2232之間，於本實施例中，該支架2233係連接設置於懸浮板2231與外框2232之間，其兩端點係分別連接於外框2232、懸浮板2231，以提供彈性支撐，且於支架2233、懸浮板2231及外框2232之間更具有至少一空隙2235，該至少一空隙2235係與導氣端開口202相連通，用以供氣體流通。應強調的是，懸浮板2231、外框2232以及支架2233之型態及數量不以前述實施例為限，且可依實際應用需求變化。另外，外框2232係環繞設置於懸浮板2231之外側，且具有一向外凸設之導電接腳2232c，用以供電連接之用，但不以此為限。The piezoelectric actuator 223 is assembled by a suspension plate 2231, an outer frame 2132, at least one bracket 2233, and a piezoelectric piece 2234. The piezoelectric piece 2234 is attached to the first suspension plate 2231. The surface 2231c is configured to apply a voltage to generate a deformation to drive the suspension plate 2231 to bend and vibrate, and the at least one bracket 2233 is connected between the suspension plate 2231 and the outer frame 2232. In this embodiment, the bracket 2233 is connected to the Between the suspension plate 2231 and the outer frame 2232, the two ends are respectively connected to the outer frame 2232 and the suspension plate 2231 to provide elastic support, and at least one gap between the bracket 2233, the suspension plate 2231 and the outer frame 2232. 2235, the at least one gap 2235 is in communication with the air guide opening 202 for gas circulation. It should be emphasized that the type and number of the suspension plate 2231, the outer frame 2232, and the bracket 2233 are not limited to the foregoing embodiments, and may be changed according to actual application requirements. In addition, the outer frame 2232 is disposed on the outer side of the suspension plate 2231, and has an outwardly protruding conductive pin 2232c for power connection, but is not limited thereto.
懸浮板2231係為一階梯面之結構(如第7圖所示)，意即於懸浮板2231之第二表面2231b更具有一凸部2231a，該凸部2231a可為但不限為一圓形凸起結構。懸浮板2231之凸部2231a係與外框2232之第二表面2232a共平面，且懸浮板2231之第二表面2231b及支架2233之第二表面2233a亦為共平面，且該懸浮板2231之凸部2231a及外框2232之第二表面2232a與懸浮板2231之第二表面2231b及支架2233之第二表面2232a之間係具有一特定深度。懸浮板2231之第一表面2231c，其與外框2232之第一表面2232b及支架2233之第一表面2233b為平整之共平面結構，而壓電片2234則貼附於此平整之懸浮板2231之第一表面2231c處。於另一些實施例中，懸浮板2231之型態亦可為一雙面平整之板狀正方形結構，並不以此為限，可依照實際施作情形而任施變化。於一些實施例中，懸浮板2231、支架2233以及外框2232係可為一體成型之結構，且可由一金屬板所構成，例如但不限於不鏽鋼材質所構成。又於另一些實施例中，壓電片2234之邊長係小於該懸浮板2231之邊長。再於另一些實施例中，壓電片2234之邊長係等於懸浮板2231之邊長，且同樣設計為與懸浮板2231相對應之正方形板狀結構，但並不以此為限。The suspension plate 2231 is a stepped surface structure (as shown in FIG. 7), that is, the second surface 2231b of the suspension plate 2231 has a convex portion 2231a, which may be, but is not limited to, a circular shape. Raised structure. The convex portion 2231a of the suspension plate 2231 is coplanar with the second surface 2232a of the outer frame 2232, and the second surface 2231b of the suspension plate 2231 and the second surface 2233a of the bracket 2233 are also coplanar, and the convex portion of the suspension plate 2231 The second surface 2232a of the 2231a and the outer frame 2232 has a specific depth between the second surface 2231b of the suspension plate 2231 and the second surface 2232a of the bracket 2233. The first surface 2231c of the suspension plate 2231 is flush with the first surface 2232b of the outer frame 2232 and the first surface 2233b of the bracket 2233, and the piezoelectric piece 2234 is attached to the flat suspension plate 2231. At the first surface 2231c. In other embodiments, the shape of the suspension plate 2231 may also be a double-sided flat plate-like square structure, and is not limited thereto, and may be changed according to actual application conditions. In some embodiments, the suspension plate 2231, the bracket 2233, and the outer frame 2232 may be integrally formed, and may be composed of a metal plate such as, but not limited to, a stainless steel material. In still other embodiments, the length of the side of the piezoelectric sheet 2234 is smaller than the length of the side of the suspension plate 2231. In other embodiments, the length of the piezoelectric sheet 2234 is equal to the length of the side of the suspension plate 2231, and is also designed as a square plate structure corresponding to the suspension plate 2231, but is not limited thereto.
氣體泵浦22之絕緣片2241、導電片225及另一絕緣片2242係依序對應設置於壓電致動器223之下，且其形態大致上對應於壓電致動器223之外框2232之形態。於一些實施例中，絕緣片2241、2242係由絕緣材質所構成，例如但不限於塑膠，俾提供絕緣功能。於另一些實施例中，導電片225可由導電材質所構成，例如但不限於金屬材質，以提供電導通功能。於本實施例中，導電片225上亦可設置一導電接腳225a，以實現電導通功能。The insulating sheet 2241 of the gas pump 22 and the conductive sheet 225 and the other insulating sheet 2242 are sequentially disposed under the piezoelectric actuator 223, and the shape thereof substantially corresponds to the outer frame 2232 of the piezoelectric actuator 223. The form. In some embodiments, the insulating sheets 2241, 2242 are made of an insulating material such as, but not limited to, a plastic, and the insulating function is provided. In other embodiments, the conductive sheet 225 may be formed of a conductive material such as, but not limited to, a metal material to provide an electrical conduction function. In this embodiment, a conductive pin 225a may be disposed on the conductive sheet 225 to achieve an electrical conduction function.
於本實施例中，氣體泵浦22係依序由進氣板221、共振片222、壓電致動器223、絕緣片2241、導電片225及另一絕緣片2242等堆疊而成，且於共振片222與壓電致動器223之間係具有一間隙h，於本實施例中，係於共振片222及壓電致動器223之外框2232周緣之間的間隙h中填入一填充材質，例如但不限於導電膠，以使共振片222與壓電致動器223之懸浮板2231之凸部2231a之間可維持該間隙h之深度，進而可導引氣流更迅速地流動，且因懸浮板2231之凸部2231a與共振片222保持適當距離使彼此接觸干涉減少，促使噪音產生可被降低。於另一些實施例中，亦可藉由加高壓電致動器223之外框2232之高度，以使其與共振片222組裝時增加一間隙，但不以此為限。In this embodiment, the gas pump 22 is sequentially stacked by the air inlet plate 221, the resonance plate 222, the piezoelectric actuator 223, the insulating sheet 2241, the conductive sheet 225, and the other insulating sheet 2242, and A gap h is formed between the resonator piece 222 and the piezoelectric actuator 223. In the present embodiment, a gap h between the periphery of the frame 2232 outside the resonator piece 222 and the piezoelectric actuator 223 is filled in. The filling material, such as but not limited to the conductive paste, maintains the depth of the gap h between the resonator piece 222 and the convex portion 2231a of the suspension plate 2231 of the piezoelectric actuator 223, thereby guiding the airflow to flow more rapidly. Further, since the convex portion 2231a of the suspension plate 2231 is kept at an appropriate distance from the resonance piece 222, the mutual contact interference is reduced, and the noise generation can be reduced. In other embodiments, the height of the outer frame 2232 of the high voltage electric actuator 223 may be increased to increase a gap when assembled with the resonant plate 222, but not limited thereto.
於本實施例中，共振片222具有一可動部222a及一固定部222b，當進氣板221、共振片222與壓電致動器223依序對應組裝後，於可動部222a處可與其上的進氣板221共同形成一匯流氣體的腔室，且在共振片222與壓電致動器223之間更形成一第一腔室220，用以暫存氣體，且第一腔室220係透過共振片222之中空孔洞2220而與進氣板221之中心凹部221c處的腔室相連通，且第一腔室220之兩側則由壓電致動器223之支架2233之間的空隙2235而與設置於其下之導氣端開口202相連通。In this embodiment, the resonant plate 222 has a movable portion 222a and a fixed portion 222b. When the air bearing plate 221, the resonant plate 222 and the piezoelectric actuator 223 are sequentially assembled, the movable portion 222a can be mounted thereon. The air inlet plates 221 together form a chamber for the confluent gas, and a first chamber 220 is further formed between the resonance plate 222 and the piezoelectric actuator 223 for temporarily storing gas, and the first chamber 220 is The cavity at the central recess 221c of the air inlet plate 221 is communicated through the hollow hole 2220 of the resonator piece 222, and the two sides of the first chamber 220 are separated by a gap 2235 between the brackets 2233 of the piezoelectric actuator 223. It is in communication with the air guiding end opening 202 provided thereunder.
第9A至9E圖為第6A及6B圖所示之氣體泵浦作動之流程結構圖。請參閱第8圖、第9A圖至第9E圖，本案之氣體泵浦之作動流程簡述如下。當氣體泵浦22進行作動時，壓電致動器223受電壓致動而以支架2233為支點，進行垂直方向之往復式振動。如第9A圖所示，當壓電致動器223受電壓致動而向下振動時，由於共振片222係為輕、薄之片狀結構，是以當壓電致動器223振動時，共振片222亦會隨之共振而進行垂直之往復式振動，即為共振片222對應中心凹部221c的部分亦會隨之彎曲振動形變，即該對應中心凹部221c的部分係為共振片222之可動部222a，是以當壓電致動器223向下彎曲振動時，此時共振片222對應中心凹部221c的可動部222a會因氣體的帶入及推壓以及壓電致動器223振動之帶動，而隨著壓電致動器223向下彎曲振動形變，則氣體由進氣板221上的至少一進氣孔221a進入，並透過至少一匯流排孔221b以匯集到中央的中心凹部221c處，再經由共振片222上與中心凹部221c對應設置的中空孔洞2220向下流入至第一腔室220中。其後，由於受壓電致動器223振動之帶動，共振片222亦會隨之共振而進行垂直之往復式振動，如第9B圖所示，此時共振片222之可動部222a亦隨之向下振動，並貼附抵觸於壓電致動器223之懸浮板2231之凸部2231a上，使懸浮板2231之凸部2231a以外的區域與共振片222兩側之固定部222b之間的匯流腔室的間距不會變小，並藉由此共振片222之形變，以壓縮第一腔室220之體積，並關閉第一腔室220中間流通空間，促使其內的氣體推擠向兩側流動，進而經過壓電致動器223之支架2233之間的空隙2235而向下穿越流動。之後，如第9C圖所示，共振片222之可動部222a向上彎曲振動形變，而回復至初始位置，且壓電致動器223受電壓驅動以向上振動，如此同樣擠壓第一腔室220之體積，惟此時由於壓電致動器223係向上抬升，因而使得第一腔室220內的氣體會朝兩側流動，進而帶動氣體持續地自進氣板221上的至少一進氣孔221a進入，再流入中心凹部221c所形成之腔室中。之後，如第9D圖所示，該共振片222受壓電致動器223向上抬升的振動而共振向上，此時共振片222之可動部222a亦隨之向上振動，進而減緩氣體持續地自進氣板221上的至少一進氣孔221a進入，再流入中心凹部221c所形成之腔室中。最後，如第9E圖所示，共振片222之可動部222a亦回復至初始位置。由此實施態樣可知，當共振片222進行垂直之往復式振動時，係可由其與壓電致動器223之間的間隙h以增加其垂直位移的最大距離，換句話說，於該兩結構之間設置間隙h可使共振片222於共振時可產生更大幅度的上下位移。是以，在經此氣體泵浦22之流道設計中產生壓力梯度，使氣體高速流動，並透過流道進出方向之阻抗差異，將氣體由吸入端傳輸至排出端，以完成氣體輸送作業，即使在排出端有氣壓之狀態下，仍有能力持續將氣體推入導氣端腔室23a，並可達到靜音之效果，如此重覆第9A至9E圖之氣體泵浦22作動，即可使氣體泵浦22產生一由外向內的氣體傳輸。9A to 9E are flow chart diagrams of the gas pumping operation shown in Figs. 6A and 6B. Please refer to Fig. 8 and Fig. 9A to Fig. 9E. The operation flow of the gas pump in this case is briefly described as follows. When the gas pump 22 is actuated, the piezoelectric actuator 223 is biased by the voltage and is reciprocatingly vibrating in the vertical direction with the holder 2233 as a fulcrum. As shown in FIG. 9A, when the piezoelectric actuator 223 is vibrated downward by voltage, since the resonance piece 222 is a light and thin sheet-like structure, when the piezoelectric actuator 223 vibrates, The resonating piece 222 also resonates to reciprocate vertically, that is, the portion of the resonating piece 222 corresponding to the central concave portion 221c is also deformed by bending vibration, that is, the portion corresponding to the central concave portion 221c is movable of the resonant piece 222. The portion 222a is such that when the piezoelectric actuator 223 is bent downward, the movable portion 222a of the resonator piece 222 corresponding to the central recess 221c is driven by the introduction and pushing of the gas and the vibration of the piezoelectric actuator 223. And as the piezoelectric actuator 223 is bent and vibrated downward, the gas enters through at least one air inlet hole 221a on the air intake plate 221, and passes through at least one bus bar hole 221b to be collected to the central central recess 221c. Then, the hollow hole 2220 disposed corresponding to the central recess 221c on the resonator piece 222 flows downward into the first chamber 220. Thereafter, due to the vibration of the piezoelectric actuator 223, the resonator piece 222 resonates and reciprocates vertically. As shown in Fig. 9B, the movable portion 222a of the resonator piece 222 is also followed. The vibration is downwardly slid and adhered to the convex portion 2231a of the suspension plate 2231 of the piezoelectric actuator 223, so that the convergence between the region other than the convex portion 2231a of the suspension plate 2231 and the fixed portion 222b on both sides of the resonance plate 222 The spacing of the chambers does not become small, and is deformed by the resonant plate 222 to compress the volume of the first chamber 220 and close the intermediate flow space of the first chamber 220, thereby causing the gas therein to be pushed to both sides. The flow, which in turn passes through the gap 2235 between the brackets 2233 of the piezoelectric actuator 223, traverses the flow. Thereafter, as shown in FIG. 9C, the movable portion 222a of the resonator piece 222 is bent and vibrated upward to return to the initial position, and the piezoelectric actuator 223 is driven by the voltage to vibrate upward, thus also pressing the first chamber 220. The volume, but at this time, the piezoelectric actuator 223 is lifted upward, so that the gas in the first chamber 220 flows toward both sides, thereby driving the gas continuously from at least one air inlet hole on the air inlet plate 221. The 221a enters and flows into the chamber formed by the central recess 221c. Thereafter, as shown in FIG. 9D, the resonator piece 222 is resonated upward by the upward vibration of the piezoelectric actuator 223, and the movable portion 222a of the resonator piece 222 is also vibrated upward, thereby slowing down the gas continuously. At least one air inlet hole 221a in the gas plate 221 enters and flows into the chamber formed by the central recess portion 221c. Finally, as shown in Fig. 9E, the movable portion 222a of the resonator piece 222 also returns to the initial position. It can be seen from this embodiment that when the resonant plate 222 performs vertical reciprocating vibration, the maximum distance between the vertical displacement of the resonant plate 222 and the piezoelectric actuator 223 can be increased, in other words, in the two The provision of a gap h between the structures allows the resonator piece 222 to generate a larger vertical displacement when resonating. Therefore, a pressure gradient is generated in the flow channel design of the gas pump 22, so that the gas flows at a high speed, and the gas is transmitted from the suction end to the discharge end through the difference in impedance of the flow path in and out of the flow path to complete the gas transfer operation. Even if there is air pressure at the discharge end, there is still the ability to continuously push the gas into the air guide end chamber 23a, and the effect of mute can be achieved, so that the gas pump 22 of FIG. 9A to FIG. 9E is repeated to operate. Gas pump 22 produces a gas transfer from the outside to the inside.
承上所述，透過上述氣體泵浦22之作動，將氣體導入導流載體20之腔室201，使所導入氣體與電子元件3進行熱交換，並推動腔室201中之氣體快速流動，促使熱交換後的氣體將熱能經由導流載體20之複數個導流排氣槽203處排至氣冷散熱裝置2之外部，藉此以提高散熱冷卻的效率，進而增加電子元件3之性能穩定度及壽命。As described above, the gas is introduced into the chamber 201 of the flow guiding carrier 20 by the operation of the gas pump 22, so that the introduced gas exchanges heat with the electronic component 3, and the gas in the chamber 201 is pushed to flow rapidly. The heat-exchanged gas discharges thermal energy to the outside of the air-cooling heat dissipating device 2 through the plurality of diversion venting grooves 203 of the flow guiding carrier 20, thereby improving the efficiency of heat dissipation and cooling, thereby increasing the performance stability of the electronic component 3. And life.
第10圖為本案第三較佳實施例之氣冷散熱裝置之架構示意圖。如第10圖所示，本實施例之氣冷散熱裝置2c與第2B圖所示之氣冷散熱裝置2相似，且相同之元件標號代表相同之結構、元件與功能，於此不再贅述。相較於第2B圖所示之氣冷散熱裝置2，本實施例之氣冷散熱裝置2c係具有溫控功能，其更包括控制系統21，該控制系統21包含控制單元211及溫度感測器212，其中控制單元21係與氣體泵浦22電連接，以控制氣體泵浦22之運作。溫度感測器212係設置於導流載體20之腔室201內，且鄰近於電子元件3，以用於感測電子元件3之溫度。溫度感測器212係電連接於控制單元21，感測電子元件3附近之溫度，或者直接貼附於電子元件3上感測電子元件3溫度，並將感測訊號傳輸至控制單元211。控制單元211依據溫度感測器212之感測訊號，判斷該電子元件3之溫度是否高於一溫度門檻值，當控制單元211判斷該電子元件3之溫度高於該溫度門檻值時，發出一控制訊號至氣體泵浦22，以致能氣體泵浦22運作，藉此使氣體泵浦22驅動氣流流動以對電子元件3進行散熱冷卻，俾使電子元件3散熱冷卻並降低溫度。當控制單元211判斷該電子元件3之溫度低於該溫度門檻值時，發出一控制訊號至氣體泵浦22，以停止氣體泵浦22運作，藉此可避免氣體泵浦22持續運作而導致壽命減短，降低額外的能量的耗損。是以，透過控制系統21之設置，使氣冷散熱裝置2之氣體泵浦22於電子元件3溫度過熱時可進行散熱冷卻，並於電子元件3溫度降低後停止運作，藉此可避免氣體泵浦22持續運作而導致壽命減短，降低額外的能量的耗損，亦可使電子元件3於一較佳溫度環境下運作，提高電子元件3的穩定度。FIG. 10 is a schematic structural view of an air-cooling heat dissipating device according to a third preferred embodiment of the present invention. As shown in FIG. 10, the air-cooling heat dissipating device 2c of the present embodiment is similar to the air-cooling heat dissipating device 2 shown in FIG. 2B, and the same component numbers denote the same structures, elements, and functions, and will not be described again. Compared with the air-cooling heat dissipating device 2 shown in FIG. 2B, the air-cooling heat dissipating device 2c of the present embodiment has a temperature control function, and further includes a control system 21 including a control unit 211 and a temperature sensor. 212, wherein the control unit 21 is electrically coupled to the gas pump 22 to control the operation of the gas pump 22. The temperature sensor 212 is disposed in the chamber 201 of the flow guiding carrier 20 and adjacent to the electronic component 3 for sensing the temperature of the electronic component 3. The temperature sensor 212 is electrically connected to the control unit 21, senses the temperature in the vicinity of the electronic component 3, or directly attaches to the electronic component 3 to sense the temperature of the electronic component 3, and transmits the sensing signal to the control unit 211. The control unit 211 determines whether the temperature of the electronic component 3 is higher than a temperature threshold according to the sensing signal of the temperature sensor 212. When the control unit 211 determines that the temperature of the electronic component 3 is higher than the temperature threshold, the control unit 211 issues a The control signal is applied to the gas pump 22 to operate the gas pump 22, whereby the gas pump 22 drives the airflow to dissipate heat from the electronic component 3, thereby cooling the electronic component 3 and lowering the temperature. When the control unit 211 determines that the temperature of the electronic component 3 is lower than the temperature threshold, a control signal is sent to the gas pump 22 to stop the operation of the gas pump 22, thereby preventing the gas pump 22 from continuing to operate and causing the life. Shorten and reduce the loss of extra energy. Therefore, through the setting of the control system 21, the gas pump 22 of the air-cooling heat sink 2 can be cooled and cooled when the temperature of the electronic component 3 is overheated, and stops after the temperature of the electronic component 3 is lowered, thereby avoiding the gas pump. The continued operation of the Pu 22 results in a shortened life span, reducing the consumption of additional energy, and also allowing the electronic component 3 to operate in a preferred temperature environment to improve the stability of the electronic component 3.
綜上所述，本案提供一種氣冷散熱裝置，其可應用於各種電子設備以對其內部之電子元件散熱，俾提升散熱效能，降低噪音，且使電子設備內部電子元件之性能穩定並延長使用壽命。此外，本案之氣冷散熱裝置，其具有溫控功能，可依據電子設備內部電子元件之溫度變化，控制氣體泵浦之運作，俾提升散熱效能，以及延長散熱裝置之使用壽命。In summary, the present invention provides an air-cooling heat dissipating device, which can be applied to various electronic devices to dissipate heat from internal electronic components, improve heat dissipation performance, reduce noise, and stabilize and prolong the performance of electronic components inside electronic devices. life. In addition, the air-cooling heat dissipating device of the present case has a temperature control function, which can control the operation of the gas pump according to the temperature change of the electronic components inside the electronic device, improve the heat dissipation performance, and prolong the service life of the heat dissipating device.
本案得由熟知此技術之人士任施匠思而為諸般修飾，然皆不脫如附申請專利範圍所欲保護者。This case has been modified by people who are familiar with the technology, but it is not intended to be protected by the scope of the patent application.
11‧‧‧電子元件
12‧‧‧熱傳導板
13‧‧‧導熱膠
2、2a、2b、2c‧‧‧氣冷散熱裝置
20‧‧‧導流載體
20a‧‧‧第一表面
20b‧‧‧第二表面
201‧‧‧腔室
202‧‧‧導氣端開口
203‧‧‧導流排氣槽
204‧‧‧側壁
205‧‧‧排氣端開口
207‧‧‧邊角
21‧‧‧控制系統
211‧‧‧控制單元
212‧‧‧溫度感測器
22‧‧‧氣體泵浦
220‧‧‧第一腔室
221‧‧‧進氣板
221a‧‧‧進氣孔
221b‧‧‧匯流排孔
221c‧‧‧中心凹部
222‧‧‧共振片
222a‧‧‧可動部
222b‧‧‧固定部
2220‧‧‧中空孔洞
223‧‧‧壓電致動器
2231‧‧‧懸浮板
2231a‧‧‧凸部
2231b‧‧‧第二表面
2231c‧‧‧第一表面
2232‧‧‧外框
2232a‧‧‧第二表面
2232b‧‧‧第一表面
2232c‧‧‧導電接腳
2233‧‧‧支架
2233a‧‧‧第二表面
2233b‧‧‧第一表面
2234‧‧‧壓電片
2235‧‧‧空隙
2241、2242‧‧‧絕緣片
225‧‧‧導電片
225a‧‧‧導電接腳
25‧‧‧散熱器
251‧‧‧底座
252‧‧‧散熱片
26‧‧‧導熱管柱
3‧‧‧電子元件
4‧‧‧承載基板11‧‧‧Electronic components
12‧‧‧heat transfer board
13‧‧‧thermal adhesive
2, 2a, 2b, 2c‧‧‧ air-cooling heat sink
20‧‧‧Guide vector
20a‧‧‧ first surface
20b‧‧‧second surface
201‧‧‧ chamber
202‧‧‧ Air conduction opening
203‧‧‧Guided exhaust trough
204‧‧‧ side wall
205‧‧‧Exhaust end opening
207‧‧‧ corner
21‧‧‧Control system
211‧‧‧Control unit
212‧‧‧temperature sensor
22‧‧‧ gas pump
220‧‧‧ first chamber
221‧‧‧Air intake plate
221a‧‧‧Air intake
221b‧‧‧ bus bar hole
221c‧‧‧Center recess
222‧‧‧Resonance film
222a‧‧‧movable department
222b‧‧‧Fixed Department
2220‧‧‧ hollow holes
223‧‧‧ Piezoelectric Actuator
2231‧‧‧suspension plate
2231a‧‧‧ convex
2231b‧‧‧ second surface
2231c‧‧‧ first surface
2232‧‧‧Front frame
2232a‧‧‧ second surface
2232b‧‧‧ first surface
2232c‧‧‧Electrical pins
2233‧‧‧ bracket
2233a‧‧‧second surface
2233b‧‧‧ first surface
2234‧‧‧ Piezo Pieces
2235‧‧‧ gap
2241, 2242‧‧‧Insulation
225‧‧‧Electrical sheet
225a‧‧‧Electrical pins
25‧‧‧ radiator
251‧‧‧Base
252‧‧‧ Heat sink
26‧‧‧Heat pipe column
3‧‧‧Electronic components
4‧‧‧Loading substrate
第1圖為傳統散熱機構之結構示意圖。 第2A圖為本案第一實施例之氣冷散熱裝置之結構示意圖。 第2B圖為第2A圖所示之氣冷散熱裝置於AA截面之結構示意圖。 第3圖為第2A圖所示之導流載體之結構示意圖。 第4圖為本案第二實施例之氣冷散熱裝置之結構示意圖。 第5圖為本案第三實施例之氣冷散熱裝置之結構示意圖。 第6A及6B圖分別為本案較佳實施例之氣體泵浦於不同視角之分解結構示意圖。 第7圖為第6A及6B圖所示之壓電致動器之剖面結構示意圖。 第8圖為第6A及6B圖所示之氣體泵浦之剖面結構示意圖。 第9A至9E圖為第6A及6B圖所示之氣體泵浦作動之流程結構圖。 第10圖為本案第四實施例之氣冷散熱裝置之架構示意圖。Figure 1 is a schematic view of the structure of a conventional heat dissipation mechanism. 2A is a schematic structural view of the air-cooling heat dissipating device of the first embodiment of the present invention. Fig. 2B is a schematic view showing the structure of the air-cooling heat dissipating device shown in Fig. 2A in the AA cross section. Fig. 3 is a schematic view showing the structure of the flow guiding carrier shown in Fig. 2A. Figure 4 is a schematic view showing the structure of the air-cooling heat dissipating device of the second embodiment of the present invention. Figure 5 is a schematic view showing the structure of the air-cooling heat dissipating device of the third embodiment of the present invention. 6A and 6B are respectively schematic views showing the decomposition structure of the gas pump of the preferred embodiment of the present invention at different viewing angles. Fig. 7 is a schematic cross-sectional view showing the piezoelectric actuator shown in Figs. 6A and 6B. Fig. 8 is a schematic cross-sectional view showing the gas pump shown in Figs. 6A and 6B. 9A to 9E are flow chart diagrams of the gas pumping operation shown in Figs. 6A and 6B. Figure 10 is a schematic view showing the structure of the air-cooling heat dissipating device of the fourth embodiment of the present invention.
Claims (12)
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| TW105138664A TWI686538B (en) | 2016-11-24 | 2016-11-24 | Air cooling heat dissipation device |
| JP2017224435A JP6487994B2 (en) | 2016-11-24 | 2017-11-22 | Air cooling heat dissipation device |
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| Application Number | Priority Date | Filing Date | Title |
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| TW105138664A TWI686538B (en) | 2016-11-24 | 2016-11-24 | Air cooling heat dissipation device |
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| TW201819766A true TW201819766A (en) | 2018-06-01 |
| TWI686538B TWI686538B (en) | 2020-03-01 |
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| TW105138664A TWI686538B (en) | 2016-11-24 | 2016-11-24 | Air cooling heat dissipation device |
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| TW (1) | TWI686538B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112432086A (en) * | 2020-11-25 | 2021-03-02 | 浙江北光科技股份有限公司 | LED (light-emitting diode) down lamp |
| TWI747076B (en) * | 2019-11-08 | 2021-11-21 | 研能科技股份有限公司 | Heat dissipating component for mobile device |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11784109B2 (en) | 2018-08-10 | 2023-10-10 | Frore Systems Inc. | Method and system for driving piezoelectric MEMS-based active cooling devices |
| KR102677216B1 (en) | 2019-10-30 | 2024-06-24 | 프로리 시스템스 인코포레이티드 | MEMS-based airflow system |
| US11796262B2 (en) | 2019-12-06 | 2023-10-24 | Frore Systems Inc. | Top chamber cavities for center-pinned actuators |
| WO2021126791A1 (en) | 2019-12-17 | 2021-06-24 | Frore Systems Inc. | Mems-based cooling systems for closed and open devices |
| JP2022022557A (en) | 2020-06-26 | 2022-02-07 | 株式会社Soken | Distance estimation device |
| CN116325139A (en) | 2020-10-02 | 2023-06-23 | 福珞尔***公司 | Active heat sink |
| CN113710055B (en) * | 2021-07-19 | 2024-03-29 | 南京精诚微控信息科技有限公司 | Central control system for intelligent equipment |
| CN114793410B (en) * | 2022-04-25 | 2023-11-24 | 太仓陶氏电气有限公司 | High-power air-cooled water-cooled composite radiator of inverter |
| WO2024118845A1 (en) * | 2022-11-30 | 2024-06-06 | Frore Systems Inc. | Integration of active mems cooling systems into thin computing devices |
Family Cites Families (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2625398B2 (en) * | 1995-03-17 | 1997-07-02 | 日本電気株式会社 | Multi-chip cooling device |
| JP3120802B2 (en) * | 1999-03-15 | 2000-12-25 | 富士通株式会社 | heatsink |
| US7180742B1 (en) * | 2004-05-24 | 2007-02-20 | Nvidia Corporation | Apparatus and method for cooling semiconductor devices |
| US7814965B1 (en) * | 2005-10-27 | 2010-10-19 | United States Thermoelectric Consortium | Airflow heat dissipation device |
| WO2008069264A1 (en) * | 2006-12-09 | 2008-06-12 | Murata Manufacturing Co., Ltd. | Piezoelectric pump |
| JP4873075B2 (en) * | 2007-03-12 | 2012-02-08 | 株式会社村田製作所 | Fluid transfer device |
| JP5205957B2 (en) * | 2007-12-27 | 2013-06-05 | ソニー株式会社 | Piezoelectric pump, cooling device and electronic device |
| JP2010225788A (en) * | 2009-03-23 | 2010-10-07 | Nikon Corp | Electronic apparatus |
| JP2012124246A (en) * | 2010-12-07 | 2012-06-28 | Murata Mfg Co Ltd | Heat radiator for electronic equipment |
| KR101918261B1 (en) * | 2011-11-28 | 2018-11-14 | 삼성전자주식회사 | Semiconductor packages for a mobile device |
| TWI524840B (en) * | 2012-03-30 | 2016-03-01 | 台達電子工業股份有限公司 | Heat dissipating module |
| JP2013223818A (en) * | 2012-04-20 | 2013-10-31 | Murata Mfg Co Ltd | Piezoelectric actuator and electronic apparatus |
| JP2014107362A (en) * | 2012-11-27 | 2014-06-09 | Lenovo Singapore Pte Ltd | Heat dissipation device of electronic device and heat dissipation method |
| TWI552838B (en) * | 2013-06-24 | 2016-10-11 | 研能科技股份有限公司 | Micro-gas pressure driving apparatus |
| US10085363B2 (en) * | 2014-05-22 | 2018-09-25 | General Electric Company | Integrated compact impingement on extended heat surface |
| JP6028779B2 (en) * | 2014-10-03 | 2016-11-16 | 株式会社村田製作所 | Fluid control device |
-
2016
- 2016-11-24 TW TW105138664A patent/TWI686538B/en active
-
2017
- 2017-11-22 JP JP2017224435A patent/JP6487994B2/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI747076B (en) * | 2019-11-08 | 2021-11-21 | 研能科技股份有限公司 | Heat dissipating component for mobile device |
| US11770913B2 (en) | 2019-11-08 | 2023-09-26 | Microjet Technology Co., Ltd. | Heat-dissipating component for mobile device |
| CN112432086A (en) * | 2020-11-25 | 2021-03-02 | 浙江北光科技股份有限公司 | LED (light-emitting diode) down lamp |
| CN112432086B (en) * | 2020-11-25 | 2022-06-17 | 浙江北光科技股份有限公司 | LED (light-emitting diode) down lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2018085510A (en) | 2018-05-31 |
| JP6487994B2 (en) | 2019-03-20 |
| TWI686538B (en) | 2020-03-01 |
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