TW201814849A - Electronic package and method of manufacture - Google Patents
Electronic package and method of manufacture Download PDFInfo
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- TW201814849A TW201814849A TW105133233A TW105133233A TW201814849A TW 201814849 A TW201814849 A TW 201814849A TW 105133233 A TW105133233 A TW 105133233A TW 105133233 A TW105133233 A TW 105133233A TW 201814849 A TW201814849 A TW 201814849A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/552—Protection against radiation, e.g. light or electromagnetic waves
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/04105—Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/12105—Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
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- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
本發明係有關一種封裝技術，尤指一種半導體封裝件及其製法。 The invention relates to a packaging technology, in particular to a semiconductor package and a method for manufacturing the same.
隨著電子產業的蓬勃發展，電子產品也逐漸邁向多功能、高性能的趨勢。為了滿足電子封裝件微型化(miniaturization)的封裝需求，係發展出晶圓級封裝(Wafer Level Packaging，簡稱WLP)的技術。 With the vigorous development of the electronics industry, electronic products are gradually moving towards the trend of multifunctional and high performance. In order to meet the packaging needs of miniaturization of electronic packages, the technology of Wafer Level Packaging (WLP) was developed.
第1A至1E圖係為習知晶圓級半導體封裝件1之製法之剖面示意圖。 1A to 1E are schematic cross-sectional views of a conventional method for manufacturing a wafer-level semiconductor package 1.
如第1A圖所示，形成一熱化離形膠層(thermal release tape)100於一承載件10上；接著，置放複數半導體元件11於該熱化離形膠層100上，該些半導體元件11具有相對之作用面11a與非作用面11b，各該作用面11a上均具有複數電極墊110，且各該作用面11a黏著於該熱化離形膠層100上。 As shown in FIG. 1A, a thermal release tape layer 100 is formed on a carrier 10. Then, a plurality of semiconductor elements 11 are placed on the thermal release tape layer 100. The element 11 has opposite active surfaces 11 a and non-active surfaces 11 b. Each of the active surfaces 11 a has a plurality of electrode pads 110, and each of the active surfaces 11 a is adhered to the thermal release adhesive layer 100.
如第1B圖所示，形成一封裝膠體14於該熱化離形膠層100上，以包覆該半導體元件11。 As shown in FIG. 1B, an encapsulant 14 is formed on the thermal release adhesive layer 100 to cover the semiconductor element 11.
如第1C圖所示，烘烤該封裝膠體14，同時硬化該熱化離形膠層100，而移除該熱化離形膠層100與該承載件10，以外露出該半導體元件11之作用面11a。 As shown in FIG. 1C, the encapsulating gel 14 is baked, and the thermal release adhesive layer 100 is hardened at the same time, and the thermal release adhesive layer 100 and the carrier 10 are removed, and the role of the semiconductor element 11 is exposed outside. Face 11a.
如第1D圖所示，形成一線路結構16於該封裝膠體14與該半導體元件11之作用面11a上，令該線路結構16電性連接該電極墊110。接著，形成一絕緣保護層18於該線路結構16上，且該絕緣保護層18外露該線路結構16之部分表面，以供結合如銲球之導電元件17。 As shown in FIG. 1D, a circuit structure 16 is formed on the active surface 11 a of the encapsulant 14 and the semiconductor element 11, so that the circuit structure 16 is electrically connected to the electrode pad 110. Next, an insulating protection layer 18 is formed on the circuit structure 16, and a part of the surface of the circuit structure 16 is exposed from the insulating protection layer 18 for bonding the conductive element 17 such as a solder ball.
如第1E圖所示，沿如第1D圖所示之切割路徑L進行切單製程，以獲取複數個半導體封裝件1。 As shown in FIG. 1E, a singulation process is performed along the cutting path L shown in FIG. 1D to obtain a plurality of semiconductor packages 1.
惟，習知半導體封裝件1於運作時，因其不具有用於防止電磁干擾(Electromagnetic interference，簡稱EMI)的屏蔽(shielding)結構，故該半導體元件11容易遭受到外界之電磁干擾(EMI)，導致該半導體封裝件1的電性運作功能不正常，因而影響整體該半導體封裝件1的電性效能。 However, it is known that the semiconductor package 1 is susceptible to external electromagnetic interference (EMI) because it does not have a shielding structure for preventing electromagnetic interference (EMI) during operation. , Which causes the electrical operation function of the semiconductor package 1 to be abnormal, thereby affecting the overall electrical performance of the semiconductor package 1.
因此，如何克服上述習知技術的種種問題，實已成目前亟欲解決的課題。 Therefore, how to overcome the problems of the above-mentioned conventional technologies has become an issue that is urgently sought to be solved at present.
鑒於上述習知技術之缺失，本發明提供一種電子封裝件，係包括：承載結構；電子元件，係設於該承載結構上；屏蔽件，係設於該承載結構上；包覆層，係形成於該承載結構上，以令該包覆層包覆該電子元件與該屏蔽件；金屬層，係形成於該包覆層上並電性連接該屏蔽件；以及對位件，係位於該包覆層之側面。 In view of the lack of the above-mentioned conventional technologies, the present invention provides an electronic package including: a load-bearing structure; an electronic component provided on the load-bearing structure; a shield member provided on the load-bearing structure; On the supporting structure, the cover layer covers the electronic component and the shield; a metal layer is formed on the cover layer and is electrically connected to the shield; and a positioning member is located on the package. Side of the cladding.
本發明復提供一種電子封裝件之製法，係包括：設置電子元件、屏蔽件與對位件於一承載結構上；形成包覆層於該承載結構上，以令該包覆層包覆該電子元件與屏蔽件，且令該對位件外露於該包覆層；以及形成金屬層於該包覆層上，且令該金屬層電性連接該屏蔽件。 The invention further provides a method for manufacturing an electronic package, which comprises: setting an electronic component, a shield, and a counter-position on a supporting structure; forming a covering layer on the supporting structure, so that the covering layer covers the electronics A component and a shield, and the positioning member is exposed on the covering layer; and a metal layer is formed on the covering layer, and the metal layer is electrically connected to the shield.
前述之製法中，該對位件係為盒體。 In the aforementioned manufacturing method, the positioning member is a box body.
前述之製法中，該對位件具有外露於該包覆層之容置空間，以作為對位基準。復包括移除該包覆層之部分材質及該對位件之部分材質，使該容置空間外露於該包覆層。 In the aforementioned manufacturing method, the positioning member has an accommodating space exposed from the covering layer as a positioning reference. The method includes removing a part of the material of the covering layer and a part of the material of the positioning member, so that the accommodation space is exposed to the covering layer.
前述之電子封裝件及其製法中，該電子元件係電性連接該承載結構。 In the aforementioned electronic package and its manufacturing method, the electronic component is electrically connected to the carrying structure.
前述之電子封裝件及其製法中，該屏蔽件係電性連接該承載結構。 In the aforementioned electronic package and its manufacturing method, the shield is electrically connected to the carrier structure.
前述之電子封裝件及其製法中，該屏蔽件外露於該包覆層，例如，藉由該對位件作為對位基準，以於該包覆層中形成外露該屏蔽件之凹部，因此，該金屬層延伸至該凹部中，以接觸該屏蔽件。 In the aforementioned electronic package and its manufacturing method, the shielding member is exposed on the coating layer. For example, the positioning member is used as an alignment reference to form a recess in the coating layer that exposes the shielding member. Therefore, The metal layer extends into the recess to contact the shield.
前述之電子封裝件及其製法中，該金屬層係接觸該屏蔽件。 In the aforementioned electronic package and its manufacturing method, the metal layer is in contact with the shield.
前述之電子封裝件及其製法中，該金屬層復形成於該對位件上。 In the aforementioned electronic package and its manufacturing method, the metal layer is formed on the alignment member.
前述之電子封裝件及其製法中，該對位件之高度係高於該電子元件之高度。 In the aforementioned electronic package and its manufacturing method, the height of the positioning member is higher than the height of the electronic component.
前述之電子封裝件及其製法中，該對位件之上表面係 齊平該包覆層之上表面。 In the aforementioned electronic package and its manufacturing method, the upper surface of the alignment member is Level the upper surface of the cladding layer.
前述之電子封裝件及其製法中，該對位件之硬度係小於布式硬度650HB。 In the aforementioned electronic package and its manufacturing method, the hardness of the positioning member is less than the cloth hardness 650HB.
由上可知，本發明之電子封裝件及其製法，主要藉由該電子元件外圍覆蓋有該屏蔽件與該金屬層，以於該電子封裝件運作時，該電子元件不會遭受電磁干擾，故相較於習知技術，本發明之電子封裝件的電性運作功能得以正常運作，避免電性效能受到影響。 As can be seen from the above, the electronic package and its manufacturing method of the present invention are mainly covered by the shield and the metal layer on the periphery of the electronic component, so that the electronic component will not suffer electromagnetic interference when the electronic package operates, Compared with the conventional technology, the electrical operation function of the electronic package of the present invention can operate normally, thereby preventing the electrical performance from being affected.
1‧‧‧半導體封裝件 1‧‧‧ semiconductor package
10‧‧‧承載件 10‧‧‧ Carrier
100‧‧‧熱化離形膠層 100‧‧‧ Heat release coating
11‧‧‧半導體元件 11‧‧‧Semiconductor
11a,21a‧‧‧作用面 11a, 21a‧‧‧ surface
11b,21b‧‧‧非作用面 11b, 21b ‧‧‧ non-active surface
110‧‧‧電極墊 110‧‧‧electrode pad
14‧‧‧封裝膠體 14‧‧‧ encapsulated colloid
16‧‧‧線路結構 16‧‧‧ Line Structure
17,26‧‧‧導電元件 17,26‧‧‧ conductive elements
18‧‧‧絕緣保護層 18‧‧‧Insulation protective layer
2‧‧‧電子封裝件 2‧‧‧electronic package
20‧‧‧承載結構 20‧‧‧ bearing structure
20a‧‧‧第一側 20a‧‧‧first side
20b‧‧‧第二側 20b‧‧‧Second side
200‧‧‧線路層 200‧‧‧ Line layer
201‧‧‧絕緣層 201‧‧‧ Insulation
21,21’‧‧‧電子元件 21,21’‧‧‧Electronic components
210‧‧‧導電凸塊 210‧‧‧Conductive bump
210’‧‧‧銲線 210’‧‧‧ welding wire
22‧‧‧屏蔽件 22‧‧‧shield
23‧‧‧對位件 23‧‧‧Alignment pieces
230‧‧‧容置空間 230‧‧‧accommodation space
24‧‧‧包覆層 24‧‧‧ cladding
24a‧‧‧第一表面 24a‧‧‧first surface
24b‧‧‧第二表面 24b‧‧‧Second surface
24c‧‧‧側面 24c‧‧‧side
240,240’‧‧‧凹部 240,240 ’‧‧‧ recess
25,250‧‧‧金屬層 25,250‧‧‧metal layer
260‧‧‧凸塊底下金屬層 260‧‧‧ metal layer under the bump
L‧‧‧切割路徑 L‧‧‧ cutting path
h,t‧‧‧高度 h, t‧‧‧height
第1A至1E圖係為習知半導體封裝件之製法之剖面示意圖；以及第2A至2F圖係為本發明之電子封裝件之製法的剖面示意圖。 Figures 1A to 1E are schematic sectional views of a conventional method for manufacturing a semiconductor package; and Figures 2A to 2F are schematic sectional views of a method for manufacturing an electronic package of the present invention.
以下藉由特定的具體實施例說明本發明之實施方式，熟悉此技藝之人士可由本說明書所揭示之內容輕易地瞭解本發明之其他優點及功效。 The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.
須知，本說明書所附圖式所繪示之結構、比例、大小等，均僅用以配合說明書所揭示之內容，以供熟悉此技藝之人士之瞭解與閱讀，並非用以限定本發明可實施之限定條件，故不具技術上之實質意義，任何結構之修飾、比例關係之改變或大小之調整，在不影響本發明所能產生之功效及所能達成之目的下，均應仍落在本發明所揭示之技術內容得能涵蓋之範圍內。同時，本說明書中所引用之如 「上」、「第一」、「第二」及「一」等之用語，亦僅為便於敘述之明瞭，而非用以限定本發明可實施之範圍，其相對關係之改變或調整，在無實質變更技術內容下，當亦視為本發明可實施之範疇。 It should be noted that the structures, proportions, sizes, etc. shown in the drawings in this specification are only used to match the content disclosed in the specification for the understanding and reading of those skilled in the art, and are not intended to limit the implementation of the present invention. The limited conditions are not technically significant. Any modification of the structure, change of the proportional relationship, or adjustment of the size shall still fall within the scope of this invention without affecting the effects and goals that the invention can produce. The technical content disclosed by the invention can be covered. At the same time, the The terms "up", "first", "second", and "one" are only for the convenience of description, and are not used to limit the scope of the present invention. Without substantially changing the technical content, it should be regarded as the scope of the present invention.
第2A至2F圖係為本發明之電子封裝件2之製法的剖面示意圖。 2A to 2F are schematic cross-sectional views of a method for manufacturing the electronic package 2 according to the present invention.
如第2A圖所示，提供一承載結構20，其具有相對之第一側20a與第二側20b，且於該承載結構20之第一側20a上設有相互分隔之至少一電子元件21,21’、複數屏蔽件22與複數對位件23。 As shown in FIG. 2A, a supporting structure 20 is provided, which has a first side 20a and a second side 20b opposite to each other, and at least one electronic component 21 separated from each other on the first side 20a of the supporting structure 20, 21 ', a plurality of shield members 22 and a plurality of counterposition members 23.
於本實施例中，該承載結構20係為具有核心層之線路結構或無核心層(coreless)之線路結構，其具有絕緣層201與設於該絕緣層201上之線路層200，如扇出(fan out)型重佈線路層(redistribution layer，簡稱RDL)，且形成該線路層200之材質係為銅，而形成該絕緣層201之材質係為如聚對二唑苯(Polybenzoxazole，簡稱PBO)、聚醯亞胺(Polyimide，簡稱PI)、預浸材(Prepreg，簡稱PP)等之介電材。應可理解地，該承載結構20亦可為其它承載晶片之承載件，如有機板材、晶圓(wafer)、或其他具有金屬佈線(routing)之載板，並不限於上述。 In this embodiment, the carrier structure 20 is a line structure with a core layer or a coreless line structure, which has an insulation layer 201 and a line layer 200 provided on the insulation layer 201, such as fan-out. (fan out) redistribution layer (RDL), the material forming the circuit layer 200 is copper, and the material forming the insulating layer 201 is, for example, polybenzoxazole (PBO) ), Polyimide (PI), Prepreg (PP), and other dielectric materials. It should be understood that the carrier structure 20 may also be other carriers for carrying wafers, such as organic plates, wafers, or other carrier boards with metal routing, and is not limited to the above.
再者，該電子元件21,21’係為主動元件、被動元件或其二者組合等，其中，該主動元件係例如半導體晶片，且該被動元件係例如電阻、電容及電感。具體地，該電子元件21,21’係為射頻晶片(例如：藍芽晶片或Wi-Fi晶片)， 但亦可為其它不受電磁波干擾之電子元件。例如，該電子元件21係具有相對之作用面21a及非作用面21b，該作用面21a具有複數電極墊(圖略)，其藉由複數如銲錫材料之導電凸塊210以覆晶方式設於該承載結構20上並電性連接該線路層200；或者，該電子元件21’可藉由複數銲線210’以打線方式電性連接該線路層200。然而，有關該電子元件電性連接該承載結構之方式不限於上述。 Furthermore, the electronic components 21, 21 'are active components, passive components, or a combination of the two, etc., wherein the active components are, for example, semiconductor wafers, and the passive components are, for example, resistors, capacitors, and inductors. Specifically, the electronic component 21, 21 'is a radio frequency chip (for example, a Bluetooth chip or a Wi-Fi chip), But it can also be other electronic components that are not affected by electromagnetic waves. For example, the electronic component 21 has an opposite active surface 21a and a non-active surface 21b. The active surface 21a has a plurality of electrode pads (not shown), which are provided in a flip-chip manner by a plurality of conductive bumps 210 such as solder material. The carrier structure 20 is electrically connected to the circuit layer 200; or, the electronic component 21 'can be electrically connected to the circuit layer 200 by a plurality of bonding wires 210'. However, the manner in which the electronic component is electrically connected to the carrier structure is not limited to the above.
又，該屏蔽件22係為導電材板體，其立設於該承載結構20上且位於各該電子元件21,21’周圍並電性連接該線路層200，以藉由該些屏蔽件22作為電磁波屏障，而防止各該電子元件21,21’之間相互電磁波(或訊號)干擾。 In addition, the shield 22 is a conductive material plate, which is erected on the supporting structure 20 and is located around each of the electronic components 21 and 21 ′ and is electrically connected to the circuit layer 200 so as to pass the shields 22. As an electromagnetic wave barrier, the electronic components 21 and 21 'are prevented from interfering with each other with electromagnetic waves (or signals).
另外，該對位件23係為絕緣材、半導體材或導電材，其硬度係小於布式硬度650HB(較佳為小於15HB，最佳為小於7.0HB)，且該對位件23相對該第一側20a之高度h係高於該電子元件21,21’相對該第一側20a之高度t，且其呈現盒體狀，例如，具有至少一容置空間230，而該容置空間230係朝該第一側20a之方向封蓋。具體地，該對位件23之設置位置可位在該電子元件21,21’及該屏蔽件22整體之外圍，例如位於該第一側20a之虛設(dummy)區域，即未設有線路之區域，亦即位於後續進行切單之切割路徑上，以減少材料的耗損。應可理解地，該對位件23亦可為中空狀或實心狀，如虛設蓋體(dummy lid)。 In addition, the positioning member 23 is an insulating material, a semiconductor material or a conductive material, and its hardness is less than the cloth hardness of 650HB (preferably less than 15HB, and most preferably less than 7.0HB), and the positioning member 23 is relatively The height h of one side 20a is higher than the height t of the electronic component 21, 21 'relative to the first side 20a, and it has a box shape. For example, it has at least one receiving space 230, and the receiving space 230 is Capping in the direction of the first side 20a. Specifically, the positioning position of the alignment member 23 may be located on the periphery of the electronic components 21, 21 'and the shield 22 as a whole, such as a dummy area on the first side 20a, that is, a line without a line. The area is located on the cutting path for subsequent singulation to reduce material consumption. It should be understood that the positioning member 23 may also be hollow or solid, such as a dummy lid.
如第2B圖所示，形成一包覆層24於該承載結構20之第一側20a上，以令該包覆層24包覆該電子元件 21,21’、該些屏蔽件22與該些對位件23。接著，形成複數如銲球之導電元件26於該承載結構20之第二側20b之線路層200上，俾供後續接置如封裝結構或其它結構(如晶片)之電子裝置(圖略)。 As shown in FIG. 2B, a covering layer 24 is formed on the first side 20 a of the supporting structure 20 so that the covering layer 24 covers the electronic component. 21, 21 ', the shielding members 22 and the positioning members 23. Next, a plurality of conductive elements 26 such as solder balls are formed on the circuit layer 200 on the second side 20b of the carrier structure 20 for subsequent connection of electronic devices such as a package structure or other structures (such as a chip) (not shown).
於本實施例中，該包覆層24係為絕緣材，如聚醯亞胺(polyimide，簡稱PI)、乾膜(dry film)、環氧樹脂(expoxy)或封裝材(molding compound)，其可用壓合(lamination)或模壓(molding)之方式形成於該承載結構20之第一側20a上。 In this embodiment, the coating layer 24 is an insulating material, such as polyimide (PI), dry film, epoxy, or molding compound. It can be formed on the first side 20a of the supporting structure 20 by lamination or molding.
再者，該包覆層24係具有相對之第一表面24a與第二表面24b，使該包覆層24之第一表面24a結合至該承載結構20之第一側20a上。 Furthermore, the cladding layer 24 has a first surface 24 a and a second surface 24 b opposite to each other, so that the first surface 24 a of the cladding layer 24 is bonded to the first side 20 a of the supporting structure 20.
又，於最外層之線路層200上可形成一凸塊底下金屬層(Under Bump Metallurgy，簡稱UBM)260，以利於結合該導電元件26。 In addition, an under bump metallurgy (UBM) 260 can be formed on the outermost circuit layer 200 to facilitate the bonding of the conductive element 26.
如第2C圖所示，移除該包覆層24之第二表面24b之部分材質及該對位件23之部分材質，使該些對位件23之容置空間230外露於該包覆層24之第二表面24b。 As shown in FIG. 2C, a part of the material of the second surface 24b of the coating layer 24 and a part of the material of the positioning member 23 are removed, so that the accommodation spaces 230 of the positioning members 23 are exposed to the coating layer. 24 的 第二 表面 24b。 24 of the second surface 24b.
於本實施例中，係藉由研磨方式或雷射方式移除該包覆層24之第二表面24b之部分材質及該對位件23之部分材質，且該包覆層24之第二表面24b(上表面)可齊平該些對位件23之上表面(或該容置空間230之端面)。應可理解地，由於該對位件23高於該電子元件21,21’與銲線210’，故於研磨時不會磨傷該電子元件21,21’與銲線 210’。 In this embodiment, a part of the material of the second surface 24b of the cladding layer 24 and a part of the material of the positioning member 23 are removed by a grinding method or a laser method, and the second surface of the cladding layer 24 is removed. 24b (upper surface) can be flush with the upper surface of the positioning members 23 (or the end surface of the accommodating space 230). It should be understood that, since the positioning member 23 is higher than the electronic components 21, 21 'and the bonding wire 210', the electronic components 21, 21 'and the bonding wire will not be damaged during grinding. 210 ’.
再者，當形成該包覆層24時，該包覆層24之第二表面24b已齊平該些對位件23之表面，故只需移除該對位件23之部分材質，使該容置空間230外露於該包覆層24之第二表面24b，而不需移除該包覆層24之部分材質。 Furthermore, when the cladding layer 24 is formed, the second surface 24b of the cladding layer 24 is flush with the surfaces of the alignment members 23, so only a part of the material of the alignment members 23 needs to be removed, so that the The accommodating space 230 is exposed on the second surface 24 b of the coating layer 24 without removing a part of the material of the coating layer 24.
或者，該些對位件23之容置空間230亦可朝上設置(即朝遠離該第一側20a之方向外露)，故當形成該包覆層24時，該包覆層24可形成於該容置空間230中或不形成於該容置空間230中，且只需移除該包覆層24之部分材質，另視需求可移除或不移除該對位件23之部分材質。 Alternatively, the accommodating spaces 230 of the alignment members 23 may also be set upward (ie, exposed in a direction away from the first side 20a), so when the cladding layer 24 is formed, the cladding layer 24 may be formed in The accommodating space 230 may or may not be formed in the accommodating space 230, and only a part of the material of the cladding layer 24 needs to be removed, and a part of the material of the positioning member 23 may be removed or not removed as required.
如第2D圖所示，形成複數凹部240於該包覆層24之第二表面24b上，使該些屏蔽件22之端部外露於該凹部240。 As shown in FIG. 2D, a plurality of concave portions 240 are formed on the second surface 24 b of the cladding layer 24 such that ends of the shielding members 22 are exposed to the concave portions 240.
於本實施例中，係以該對位件23(或該容置空間230)作為對位基準，藉由雷射燒除該包覆層24之部分材質，以形成該些凹部240。 In this embodiment, the positioning member 23 (or the accommodating space 230) is used as a positioning reference, and a part of the material of the coating layer 24 is removed by laser to form the recesses 240.
如第2E圖所示，透過如電鍍之方式形成一金屬層25於該包覆層24之第二表面24b與該對位件23上，且該金屬層250延伸至該凹部240中，使該金屬層250接觸該屏蔽件22，以令該金屬層25,250電性連接該屏蔽件22，俾供作為電磁屏蔽隔間(EMI partition)。 As shown in FIG. 2E, a metal layer 25 is formed on the second surface 24b of the cladding layer 24 and the positioning member 23 by electroplating, and the metal layer 250 extends into the recess 240, so that The metal layer 250 contacts the shielding member 22, so that the metal layers 25, 250 are electrically connected to the shielding member 22 and serve as an EMI partition.
於本實施例中，形成該金屬層25,250之材質如金、銀、銅(Cu)、鎳(Ni)、鐵(Fe)、鋁(Al)、不銹鋼(Sus)等。 In this embodiment, the material for forming the metal layer 25, 250 is, for example, gold, silver, copper (Cu), nickel (Ni), iron (Fe), aluminum (Al), stainless steel (Sus), or the like.
再者，亦可藉由塗佈(coating)、濺鍍(sputtering)、化 鍍、無電鍍或蒸鍍等方式形成該金屬層25,250。 Furthermore, coating, sputtering, and chemical conversion can also be used. The metal layer 25,250 is formed by plating, electroless plating, or evaporation.
又，於其它實施例中，該金屬層25亦可延伸至該容置空間230中。 Moreover, in other embodiments, the metal layer 25 can also extend into the accommodating space 230.
如第2F圖所示，將該對位件23之容置空間230作為切割路徑，而沿其進行切單製程，以得到本發明之電子封裝件2，且該對位件23之部分材質可保留於該包覆層24之側面24c上。 As shown in FIG. 2F, the accommodating space 230 of the positioning member 23 is used as a cutting path, and a cutting process is performed along it to obtain the electronic package 2 of the present invention, and a part of the material of the positioning member 23 may be It remains on the side surface 24 c of the coating layer 24.
因此，本發明之電子封裝件2之製法係藉由該些電子元件21,21’外圍覆蓋有該屏蔽件22與該金屬層25，故該電子封裝件2於運作時，該些電子元件21,21’不會遭受外界之電磁干擾(EMI)，且該些電子元件21,21’之間亦不會相互電磁干擾，因而該電子封裝件2的電性運作功能得以正常，進而不會影響整體該電子封裝件2的電性效能。 Therefore, the manufacturing method of the electronic package 2 of the present invention is to cover the electronic components 21, 21 'with the shield 22 and the metal layer 25 on the periphery. Therefore, when the electronic package 2 is in operation, the electronic components 21 , 21 'will not be subject to external electromagnetic interference (EMI), and the electronic components 21, 21' will not be electromagnetically interfered with each other, so the electrical operation function of the electronic package 2 is normal, and will not affect The electrical performance of the electronic package 2 is overall.
再者，藉由該對位件23作為對位基準，以於形成該些凹部240時，能有效外露該些屏蔽件22。相對地，若未設置該對位件23，於形成該凹部240時將會移位(shift)而未對齊於該屏蔽件22上方，因而無法外露該屏蔽件22，如第2D圖所示之凹部240’(以虛線表示)，導致該金屬層250無法與該屏蔽件22接觸電性導通，進而衍生產品不良的問題。 In addition, the alignment members 23 are used as alignment references so that the shields 22 can be effectively exposed when the recesses 240 are formed. In contrast, if the alignment member 23 is not provided, when the recess 240 is formed, it will be shifted and not aligned above the shielding member 22, so the shielding member 22 cannot be exposed, as shown in FIG. 2D. The recess 240 ′ (represented by a dashed line) causes the metal layer 250 to be unable to be electrically connected with the shielding member 22, thereby causing a problem of defective products.
本發明亦提供一種電子封裝件2，其包括：一承載結構20、至少一電子元件21,21’、一屏蔽件22、一包覆層24、一金屬層25,250以及一對位件23。 The present invention also provides an electronic package 2 comprising: a carrying structure 20, at least one electronic component 21, 21 ', a shield 22, a cladding layer 24, a metal layer 25, 250, and a pair of positioning members 23.
所述之電子元件21,21’係設於該承載結構20上並電 性連接該承載結構20。 The electronic components 21, 21 'are disposed on the supporting structure 20 and are powered on. Sexually connected to the carrying structure 20.
所述之屏蔽件22係設於該承載結構20上並電性連接該承載結構20。 The shielding member 22 is disposed on the supporting structure 20 and is electrically connected to the supporting structure 20.
所述之包覆層24係形成於該承載結構20上，以令該包覆層24包覆該電子元件21,21’與該屏蔽件22。 The covering layer 24 is formed on the supporting structure 20, so that the covering layer 24 covers the electronic components 21, 21 ′ and the shielding member 22.
所述之金屬層25,250係形成於該包覆層24上並電性連接該屏蔽件22，且復形成於該對位件23上。 The metal layers 25 and 250 are formed on the cladding layer 24 and are electrically connected to the shielding member 22. The metal layers 25 and 250 are further formed on the positioning member 23.
所述之對位件23係位於該包覆層24之側面24c，且該對位件23可作為屏蔽結構。 The positioning member 23 is located on a side surface 24 c of the covering layer 24, and the positioning member 23 can be used as a shielding structure.
於一實施例中，該屏蔽件22外露於該包覆層24，例如，該包覆層24係具有外露該屏蔽件22之凹部240，使該金屬層250延伸至該凹部240中，以接觸該屏蔽件22。 In an embodiment, the shielding member 22 is exposed from the covering layer 24. For example, the covering layer 24 has a recessed portion 240 exposing the shielding member 22, so that the metal layer 250 extends into the recessed portion 240 to contact The shield 22.
於一實施例中，該對位件23之高度h係高於該電子元件21,21’之高度t，且該對位件23之上表面係齊平該包覆層24之上表面(包覆層24之第二表面24b)。 In an embodiment, the height h of the alignment member 23 is higher than the height t of the electronic components 21, 21 ', and the upper surface of the alignment member 23 is flush with the upper surface of the cladding layer 24 (package The second surface 24b) of the cladding 24.
綜上所述，本發明之電子封裝件及其製法，係藉由該屏蔽件與該金屬層之設計，以於運作該電子封裝件時，能避免該電子元件遭受電磁干擾，故該電子封裝件的電性運作功能得以正常運作，而該電子封裝件的電性效能不會受到影響。 In summary, the electronic package and its manufacturing method of the present invention are designed by the shield and the metal layer to prevent the electronic component from being subjected to electromagnetic interference when the electronic package is operated, so the electronic package The electrical operation function of the device can work normally, and the electrical performance of the electronic package will not be affected.
上述實施例係用以例示性說明本發明之原理及其功效，而非用於限制本發明。任何熟習此項技藝之人士均可在不違背本發明之精神及範疇下，對上述實施例進行修改。因此本發明之權利保護範圍，應如後述之申請專利範 圍所列。 The above embodiments are used to exemplify the principle of the present invention and its effects, but not to limit the present invention. Anyone skilled in the art can modify the above embodiments without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the rights of the present invention should be as follows Listed.
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| WO2024087201A1 (en) * | 2022-10-28 | 2024-05-02 | 宏启胜精密电子(秦皇岛)有限公司 | Circuit board assembly and manufacturing method therefor, and packaging structure |
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| US7327015B2 (en) * | 2004-09-20 | 2008-02-05 | Advanced Semiconductor Engineering, Inc. | Semiconductor device package |
| US7829981B2 (en) * | 2008-07-21 | 2010-11-09 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages with electromagnetic interference shielding |
| WO2011111079A1 (en) * | 2010-03-11 | 2011-09-15 | Datalogic Scanning Group Sr.L. | Image capturing device |
| US8105872B2 (en) * | 2010-06-02 | 2012-01-31 | Stats Chippac, Ltd. | Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die |
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| US9190367B1 (en) * | 2014-10-22 | 2015-11-17 | Advanced Semiconductor Engineering, Inc. | Semiconductor package structure and semiconductor process |
| US9673150B2 (en) * | 2014-12-16 | 2017-06-06 | Nxp Usa, Inc. | EMI/RFI shielding for semiconductor device packages |
| US9786623B2 (en) * | 2015-03-17 | 2017-10-10 | STATS ChipPAC Pte. Ltd. | Semiconductor device and method of forming PoP semiconductor device with RDL over top package |
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