TW201805488A - Diaphragm member capable of inhibiting the diaphragm from being separated from a housing even when a water pressure is applied to the diaphragm - Google Patents
Diaphragm member capable of inhibiting the diaphragm from being separated from a housing even when a water pressure is applied to the diaphragm Download PDFInfo
- Publication number
- TW201805488A TW201805488A TW106127193A TW106127193A TW201805488A TW 201805488 A TW201805488 A TW 201805488A TW 106127193 A TW106127193 A TW 106127193A TW 106127193 A TW106127193 A TW 106127193A TW 201805488 A TW201805488 A TW 201805488A
- Authority
- TW
- Taiwan
- Prior art keywords
- diaphragm
- electrode
- holding portion
- electrode holding
- separator
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/002—Cell separation, e.g. membranes, diaphragms
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
本發明是有關於一種隔膜構件。The present invention relates to a diaphragm member.
已知的是，在對半導體晶圓（wafer）等的基板表面進行金屬鍍敷的情況下，使用包含殼體（case）及安裝於該殼體的隔膜的陽極室（本發明中所說的隔膜構件）（例如專利文獻1）。 現有技術文獻 專利文獻When metal plating is performed on a substrate surface of a semiconductor wafer or the like, it is known to use an anode chamber including a case and a diaphragm mounted on the case. Diaphragm member) (for example, Patent Document 1). Prior Art Literature Patent Literature
日本專利特開2009-173992號公報Japanese Patent Laid-Open No. 2009-173992
[發明所欲解決之問題] 然而，在使用此種隔膜構件的情況下，存在下述問題：因鍍敷液而對隔膜產生水壓，因此而導致隔膜從殼體剝落，結果容易在隔膜上穿孔。 本發明是為了解決所述問題而完成，其目的在於提供一種隔膜構件，即使對隔膜產生水壓，亦可抑制隔膜從殼體剝落。 [解決問題之手段][Problems to be Solved by the Invention] However, when such a diaphragm member is used, there is a problem that the diaphragm is peeled off from the casing due to the water pressure on the diaphragm due to the plating solution, and as a result, the diaphragm is easily peeled off. perforation. This invention is made in order to solve the said problem, and an object of this invention is to provide the diaphragm member which can suppress peeling of a diaphragm from a housing | casing, even if a water pressure is generate | occur | produced to a diaphragm. [Means for solving problems]
為了達成所述目的，本發明的隔膜構件具有以下的結構。 （1）一種隔膜構件，包括：殼體，具有電極保持部；以及隔膜，具有將電極導入所述電極保持部的導入口，且被安裝於所述殼體，所述電極保持部包含所述殼體的平面壁部、及將所述平面壁部的周緣部翻折而成的翻折部，所述隔膜覆蓋由所述電極保持部所保持的電極及所述電極保持部，並且在所述平面壁部安裝於所述殼體。 （2）如（1）所述的隔膜構件，其中，在所述翻折部更包括與所述電極接觸的突起部。 （3）如（1）或（2）所述的隔膜構件，其中，由所述殼體及所述隔膜構成袋狀體。 [發明的效果]To achieve the above object, the diaphragm member of the present invention has the following structure. (1) A separator member including: a case having an electrode holding portion; and a separator having an introduction port through which an electrode is introduced into the electrode holding portion and attached to the case, the electrode holding portion including the electrode A flat wall portion of the case and a folded portion obtained by folding a peripheral edge portion of the flat wall portion, the separator covers the electrode held by the electrode holding portion and the electrode holding portion, and The plane wall portion is mounted on the casing. (2) The separator member according to (1), wherein the folded portion further includes a protruding portion in contact with the electrode. (3) The diaphragm member according to (1) or (2), wherein the bag-shaped body is constituted by the case and the diaphragm. [Effect of the invention]
藉由本發明，可提供一種隔膜構件，即使對隔膜產生水壓，亦可抑制隔膜從殼體剝落。According to the present invention, it is possible to provide a diaphragm member that can suppress peeling of a diaphragm from a case even if water pressure is generated on the diaphragm.
本發明人等發現，在使用此種隔膜構件的情況下，存在下述問題，即，當從鍍敷液中取出隔膜構件時，因殘存於隔膜構件內側（電極側，以下相同）的鍍敷液，從隔膜構件內側朝向外側而對隔膜產生水壓，因此會導致隔膜從殼體剝落，結果容易在隔膜上穿孔，從而完成本發明。The present inventors have found that when such a separator member is used, there is a problem that when the separator member is taken out from the plating solution, the plating remains on the inside of the separator member (electrode side, the same applies hereinafter). The liquid causes water pressure on the diaphragm from the inside to the outside of the diaphragm member, so that the diaphragm is peeled off from the casing, and as a result, it is easy to perforate the diaphragm, thereby completing the present invention.
以下，對於本發明的隔膜構件，參考圖式來進行說明。 圖1是用於說明本發明的實施形態的隔膜構件的概念立體圖。圖2是表示從殼體本體10拆卸了圖1所示的隔膜構件1的隔膜20時的結構的概念立體圖。圖3是從圖1的A方向觀察的本發明的實施形態的隔膜構件1的俯視圖。圖4是從圖1的B、C及D方向觀察的殼體10的翻折部10A2附近的側面圖。 本發明的實施形態的隔膜構件1如圖1至圖4所示，其特徵在於具備：殼體10，具有電極保持部10A；以及隔膜20，具有將電極30導入所述電極保持部10A的導入口10B，且被安裝於所述殼體10，所述電極保持部10A包含所述殼體10的平面壁部10A1、及將所述平面壁部10A1的周緣部翻折而成的翻折部10A2，所述隔膜20覆蓋由所述電極保持部10A所保持的電極30及所述電極保持部10A，並且在所述平面壁部10A1安裝於所述殼體10。 如此，本發明的實施形態的隔膜構件1中，隔膜20在平面壁部10A1安裝於所述殼體10，因此當從鍍敷液中取出隔膜構件時，即使在因殘存於隔膜構件內側的鍍敷液，而從隔膜構件內側朝向外側而對隔膜產生有水壓的情況下，亦可抑制隔膜從殼體剝落。Hereinafter, the diaphragm member of the present invention will be described with reference to the drawings. FIG. 1 is a conceptual perspective view for explaining a diaphragm member according to an embodiment of the present invention. FIG. 2 is a conceptual perspective view showing a configuration when the diaphragm 20 of the diaphragm member 1 shown in FIG. 1 is removed from the case body 10. FIG. 3 is a plan view of the diaphragm member 1 according to the embodiment of the present invention, as viewed from a direction A in FIG. 1. FIG. 4 is a side view of the vicinity of the folded portion 10A2 of the casing 10 as viewed from the directions B, C, and D in FIG. 1. As shown in FIGS. 1 to 4, a separator member 1 according to an embodiment of the present invention includes a housing 10 having an electrode holding portion 10A, and a separator 20 having an introduction to introduce an electrode 30 into the electrode holding portion 10A. The mouth 10B is attached to the case 10, and the electrode holding portion 10A includes a flat wall portion 10A1 of the case 10 and a folded portion formed by folding a peripheral edge portion of the flat wall portion 10A1. 10A2, the separator 20 covers the electrode 30 and the electrode holding portion 10A held by the electrode holding portion 10A, and is attached to the case 10 at the flat wall portion 10A1. As described above, in the diaphragm member 1 according to the embodiment of the present invention, the diaphragm 20 is attached to the case 10 at the flat wall portion 10A1. Therefore, when the diaphragm member is taken out from the plating solution, When the liquid is applied, and when water pressure is exerted on the diaphragm from the inside to the outside of the diaphragm member, peeling of the diaphragm from the casing can also be suppressed.
圖5（a）及圖5（b）是將從圖1的A方向觀察的電極保持部10A的附近放大的、用於說明本發明的效果的概念圖。 如圖5（a）所示，在隔膜20安裝於翻折部10A2而非平面壁部10A1的情況下，當從鍍敷液中取出隔膜構件1時，因殘存於隔膜構件內側的鍍敷液，從隔膜構件1內側朝向外側而對隔膜20產生水壓P1，而且，伴隨該水壓P1，在翻折部10A2的安裝端部O1部分，朝該安裝剝落的方向產生應力P2。可認為：因該應力P2，隔膜20會從翻折部10A2剝落，或者未剝落但以安裝端部O1為起點而隔膜20側發生破損等，由此，容易在隔膜20上穿孔。另外，若將在隔膜20穿有孔的隔膜構件再次用於鍍敷，則在鍍敷中於隔膜構件內側的電極周邊產生的淤渣（sludge）或氣體（例如在鍍銅的情況下為氧）容易從該孔流入基板側，因此容易產生基板的鍍敷不良等，因而不佳。FIGS. 5 (a) and 5 (b) are conceptual diagrams illustrating the effect of the present invention in an enlarged manner in the vicinity of the electrode holding portion 10A viewed from the direction of A in FIG. 1. As shown in FIG. 5 (a), when the diaphragm 20 is mounted on the folded portion 10A2 instead of the flat wall portion 10A1, when the diaphragm member 1 is taken out from the plating solution, the plating liquid remains on the inside of the diaphragm member. A water pressure P1 is generated on the diaphragm 20 from the inside of the diaphragm member 1 toward the outside, and with this water pressure P1, a stress P2 is generated in the mounting peeling portion O1 portion of the folded portion 10A2 in the direction of the mounting peeling. It is considered that due to the stress P2, the diaphragm 20 is peeled off from the folded portion 10A2, or the diaphragm 20 is broken at the mounting end O1 as a starting point without peeling off, and thus the diaphragm 20 is easily perforated. In addition, if a separator member having a hole perforated in the separator 20 is used for plating again, sludge or gas (for example, oxygen in the case of copper plating) generated around the electrode inside the separator member during plating. ) It is easy to flow into the substrate side from this hole, and thus it is easy to cause poor plating of the substrate and the like.
另一方面，如圖5（b）所示，在隔膜20於平面壁部10A1安裝的情況下，當從鍍敷液取出隔膜構件1時，儘管會因殘留於隔膜構件1內的鍍敷液，而從隔膜構件1內部朝向外側對隔膜20產生水壓P1，但與隔膜20和平面壁部10A1的安裝端部O2部分相關的、該安裝剝落的方向的應力P3成為與應力P1大致反向的應力。因而，可認為，即使如上所述般對隔膜20產生水壓P1，但在隔膜20在平面壁部10A1安裝的情況下，伴隨水壓P1而產生的應力P3與應力P2相比，得到大幅抑制。 因此，本發明即使對隔膜產生水壓，亦可抑制隔膜從殼體剝落。On the other hand, as shown in FIG. 5 (b), when the diaphragm 20 is mounted on the flat wall portion 10A1, when the diaphragm member 1 is taken out from the plating liquid, it may be caused by the plating liquid remaining in the diaphragm member 1. The water pressure P1 is generated on the diaphragm 20 from the inside of the diaphragm member 1 to the outside. However, the stress P3 in the direction of the peeling of the diaphragm 20 and the mounting end portion O2 of the flat wall portion 10A1 becomes substantially opposite to the stress P1 stress. Therefore, even if the water pressure P1 is generated on the diaphragm 20 as described above, when the diaphragm 20 is mounted on the flat wall portion 10A1, the stress P3 accompanying the water pressure P1 is significantly suppressed compared with the stress P2. . Therefore, the present invention can suppress peeling of the separator from the case even if water pressure is generated on the separator.
圖6是用於更具體地說明本發明的、將從圖1的A方向觀察的電極保持部10A的附近放大的概念圖。 具體而言，電極保持部10A具有翻折部10A2，該翻折部10A2是殼體10的成為導入電極的導入口10B的一邊（圖1中為殼體10的A方向的一邊）以外的三邊（圖1中為殼體10的B、C、D方向的三邊）的周緣部朝向設置隔膜20的方向翻折而成，且該電極保持部10A是指翻折部10A2的前端10A2a朝向殼體本體10方向的垂直線H1、與垂直線H2之間的區域，該垂直線H2是通過作為具有翻折部10A2的殼體本體10的最周緣端部10A2b且與所述垂直線H1平行的、朝向殼體本體10的平面壁部10A1方向的垂直線（參考圖6）。 另外，在電極保持部10A中，「平面壁部10A1」是安裝隔膜20的至少外表面為平面（通過該外表面的任意二點的直線位於該外表面上的面）的部位。而且，在電極保持部10A中，「翻折部10A2」是從安裝隔膜20的平面壁部10A1的至少外表面並非平面的部分（圖6中：邊界線O3）直至翻折部10A2的前端10A2a之間的部位。 而且，本發明中所說的「安裝」，包含利用黏著劑或雙面膠帶等來接合的情況、或者藉由熱封（heat seal）來接合的情況。另外，若考慮到從隔膜構件的溶析或因鍍敷液造成的黏著劑的劣化等，殼體本體10與隔膜20的安裝較佳為藉由不使用黏著劑的熱封來接合。FIG. 6 is a conceptual view enlarged in the vicinity of the electrode holding portion 10A viewed from the direction of A in FIG. 1 to explain the present invention more specifically. Specifically, the electrode holding portion 10A includes a folded portion 10A2 which is three sides other than the side of the casing 10 that becomes the introduction port 10B for introducing the electrode (the side in the A direction of the casing 10 in FIG. 1). The peripheral edges of the sides (three sides in the B, C, and D directions of the casing 10 in FIG. 1) are folded toward the direction in which the diaphragm 20 is provided, and the electrode holding portion 10A refers to the front end 10A2a of the folded portion 10A2. The area between the vertical line H1 in the direction of the housing body 10 and the vertical line H2 which passes through the peripheral edge end portion 10A2b of the housing body 10 having the folded portion 10A2 and is parallel to the vertical line H1 A vertical line toward the plane wall portion 10A1 of the casing body 10 (refer to FIG. 6). In addition, in the electrode holding portion 10A, the “planar wall portion 10A1” is a portion where at least the outer surface of the mounting diaphragm 20 is a plane (a surface on which a straight line passing through any two points of the outer surface lies on the outer surface). Further, in the electrode holding portion 10A, the “folded portion 10A2” is a portion from which at least the outer surface of the planar wall portion 10A1 on which the diaphragm 20 is mounted is not a plane (in FIG. 6: a boundary line O3) to the front end 10A2 a of the folded portion 10A2. Between parts. The term "mounting" as used in the present invention includes a case of bonding with an adhesive, a double-sided tape, or the like, or a case of bonding with a heat seal. In addition, in consideration of dissolution from the diaphragm member, deterioration of the adhesive due to the plating solution, and the like, the mounting of the case body 10 and the separator 20 is preferably performed by heat sealing without using an adhesive.
殼體10的材質只要是可耐受鍍敷液者，則並無特別限定。本實施形態中，較佳為使用聚氯乙烯樹脂。而且，殼體10的平面壁部10A1或翻折部10A2的厚度T1例如為1 mm～5 mm。 隔膜20的材質只要是可耐受鍍敷液，且不使隔膜構件內的鍍敷液中的氣體或淤渣通過者，則並無特別限定。本實施形態中，較佳為使用對聚對苯二甲酸乙二酯（polyethylene terephthalate）樹脂塗佈（coating）有聚偏二氟乙烯樹脂者。而且，隔膜20的寬度或高度是根據殼體構件10的寬度或高度來適時設定。而且，隔膜20的厚度例如為100 μm～400 μm。 電極30較佳為使用不溶性電極。The material of the casing 10 is not particularly limited as long as it can withstand the plating solution. In this embodiment, a polyvinyl chloride resin is preferably used. The thickness T1 of the flat wall portion 10A1 or the folded portion 10A2 of the case 10 is, for example, 1 mm to 5 mm. The material of the separator 20 is not particularly limited as long as it can withstand the plating solution and does not allow gas or sludge in the plating solution in the separator member to pass through. In this embodiment, it is preferable to use a polyethylene terephthalate resin coated with a polyvinylidene fluoride resin. The width or height of the diaphragm 20 is appropriately set in accordance with the width or height of the case member 10. The thickness of the separator 20 is, for example, 100 μm to 400 μm. The electrode 30 is preferably an insoluble electrode.
圖7是表示將本發明的實施形態的隔膜構件設置於鍍敷裝置時的各構件的配置的概念剖面圖。 當使用本發明的隔膜構件1而設置於鍍敷裝置100時，將電極30設為陽極，且固定於電極支持構件50，並以電極30的兩端部（圖1中的方向B、方向C的兩端部）從隔膜構件1的導入口10B進入電極保持部10A內的方式，將電極30及電極支持構件50從隔膜構件1的導入口10B導入至隔膜構件1內，並如圖7所示，以與作為陰極的被鍍敷基板W相向的方式，而浸漬設置於鍍敷液M中。 另外，當藉由未圖示的提起裝置而提起浸漬於該鍍敷液M中的隔膜構件1時，成為在隔膜構件1的內部殘留有鍍敷液M的狀態，但即使在此情況下，如上所述，由於本實施形態的隔膜構件1是將隔膜20安裝於電極保持部10A的平面壁部10A1，因此可抑制隔膜20從殼體10剝落。7 is a conceptual cross-sectional view showing an arrangement of each member when the diaphragm member according to the embodiment of the present invention is installed in a plating apparatus. When the separator member 1 of the present invention is used in the plating apparatus 100, the electrode 30 is set as an anode, and the electrode support member 50 is fixed to both ends of the electrode 30 (direction B, direction C in FIG. 1). The two ends of the diaphragm member 1 are introduced into the electrode holding portion 10A from the inlet 10B of the diaphragm member 1, and the electrode 30 and the electrode supporting member 50 are introduced into the diaphragm member 1 from the inlet 10B of the diaphragm member 1, as shown in FIG. As shown, the substrate is immersed in the plating solution M so as to face the substrate W to be plated as a cathode. In addition, when the diaphragm member 1 immersed in the plating solution M is lifted by a lifting device (not shown), the plating solution M remains in the diaphragm member 1. However, even in this case, As described above, since the separator member 1 of this embodiment is the flat wall portion 10A1 in which the separator 20 is attached to the electrode holding portion 10A, the separator 20 can be prevented from peeling from the case 10.
另外，包含殼體10及安裝於殼體10的隔膜20的隔膜構件1較佳為圖1及圖2所示的袋狀體（殼體10的成為導入電極的導入口10B的一邊（圖1中為殼體10的A方向的一邊）以外的三邊（圖1中為殼體10的B、C及D方向的三邊）如圖1所示，均具有翻折部10A，且三邊均是隔膜20與殼體本體10於平面壁部10A1處安裝的狀態）。 藉由設為此種袋狀體，從而可進一步抑制在鍍敷中，隔膜構件1內的包含氣體或淤渣的鍍敷液朝向基板側的流入。In addition, the diaphragm member 1 including the case 10 and the diaphragm 20 attached to the case 10 is preferably a bag-shaped body shown in FIGS. 1 and 2 (the side of the case 10 that is the introduction port 10B of the introduction electrode (FIG. 1 Among the three sides other than the one in the A direction of the casing 10 (the three sides in the B, C, and D directions of the casing 10 in FIG. 1), as shown in FIG. Both are in a state where the diaphragm 20 and the housing body 10 are mounted at the flat wall portion 10A1). By using such a bag-shaped body, it is possible to further suppress inflow of the plating solution containing gas or sludge into the substrate side in the separator member 1 during plating.
圖8是對本發明的實施形態的隔膜構件的其他實施形態進行的說明的、將電極保持部10A的附近放大的概念圖。 本實施形態的隔膜構件如圖8所示，電極保持部10A的翻折部10A2的形狀有一部分不同。其他則與所述實施形態同樣，因此省略說明。 如圖8所示，較佳為，在所述翻折部10A2更具備突起部10AC，該突起部10AC可接觸至被導入電極保持部10A的電極30。 藉由具備此種突起部10AC，從而可將被導入電極保持部10A的電極30簡易地固定在翻折部10A2。進而，因突起部10AC的存在，翻折部10A2的前端10A2a必然容易朝電極30方向（圖8中α）傾斜，因此可抑制該前端10A2a與隔膜20的接觸，防止因該前端10A2a造成的隔膜20的破損等。 [實施例]FIG. 8 is a conceptual view illustrating another embodiment of the separator member according to the embodiment of the present invention, and enlarging the vicinity of the electrode holding portion 10A. As shown in FIG. 8, in the separator member of this embodiment, the shape of the folded portion 10A2 of the electrode holding portion 10A is partially different. Other points are the same as those of the above-mentioned embodiment, and therefore descriptions thereof are omitted. As shown in FIG. 8, preferably, the folded portion 10A2 further includes a protruding portion 10AC, and the protruding portion 10AC can contact the electrode 30 introduced into the electrode holding portion 10A. By having such a protruding portion 10AC, the electrode 30 introduced into the electrode holding portion 10A can be easily fixed to the folded portion 10A2. Furthermore, due to the existence of the protruding portion 10AC, the front end 10A2a of the folded portion 10A2 must be easily inclined toward the electrode 30 (α in FIG. 8). Therefore, the contact between the front end 10A2a and the separator 20 can be suppressed, and the diaphragm caused by the front end 10A2a can be prevented. Damage of 20, etc. [Example]
（實施例1） 準備加工成圖2所示般形狀的聚氯乙烯樹脂製的殼體10（寬40 cm、高100 cm）、與對聚對苯二甲酸乙二酯樹脂塗佈有聚偏二氟乙烯樹脂的厚度200 μm的隔膜20（橫65 cm、縱115 cm），在殼體10的導入口10B以外的三邊的電極保持部10A的平面壁部10A1的外表面，藉由熱封而接合隔膜20，製作出袋狀體即圖1所示般的隔膜構件1。 隨後，將不溶性的電極30固定於電極支持構件50，並以電極30的兩端部（圖1中的方向B、方向C的兩端部）從隔膜構件1的導入口10B進入電極保持部10A的方式，將電極30及電極支持構件50從隔膜構件1的導入口10B導入隔膜構件1內，並如圖7所示，以與被鍍敷基板W相向的方式而浸漬設置於鍍敷液M中，對被鍍敷基板W實施規定時間的鍍銅。 隨後，在隔膜構件1中導入有電極30及電極支持構件50的狀態下，從鍍敷液M中提起隔膜構件1。此時，將殘留在隔膜構件1內部的體積（約48000 cm3 ）的鍍敷液M從隔膜構件1內部予以排出，且從隔膜構件1內取出電極30及電極支持構件50，最後，以純水清洗隔膜構件1。 對經純水清洗的隔膜構件1，藉由目測來確認殼體10的導入口10B以外的三邊上的隔膜20的剝落狀況。(Example 1) A case 10 (40 cm in width and 100 cm in height) made of a polyvinyl chloride resin having a shape as shown in Fig. 2 was prepared, and a polyethylene terephthalate resin was applied. The outer surface of the flat wall portion 10A1 of the electrode holding portion 10A on the three sides other than the inlet 10B of the case 10 with a thickness of 200 μm of the diaphragm 20 (65 cm in width and 115 cm in length) of a 200 μm difluoroethylene resin is heated by heat. The diaphragm 20 is sealed and joined, and a bag-shaped body, that is, a diaphragm member 1 as shown in FIG. 1 is produced. Subsequently, the insoluble electrode 30 is fixed to the electrode supporting member 50, and both ends of the electrode 30 (direction B and both ends in the direction C in FIG. 1) enter the electrode holding portion 10A from the introduction port 10B of the separator member 1 As shown in FIG. 7, the electrode 30 and the electrode supporting member 50 are introduced into the diaphragm member 1 from the inlet 10B of the diaphragm member 1, and are immersed in the plating solution M so as to face the substrate W to be plated, as shown in FIG. 7. In the process, the substrate W to be plated is subjected to copper plating for a predetermined time. Subsequently, the separator member 1 is lifted from the plating solution M in a state where the electrode 30 and the electrode support member 50 are introduced into the separator member 1. At this time, the volume (approximately 48000 cm 3 ) of the plating solution M remaining inside the separator member 1 is discharged from the inside of the separator member 1, and the electrode 30 and the electrode support member 50 are taken out of the separator member 1. The diaphragm member 1 is washed with water. With respect to the diaphragm member 1 washed with pure water, the peeling state of the diaphragm 20 on three sides other than the inlet 10B of the casing 10 was confirmed by visual inspection.
（實施例2） 使用加工成具備圖8所示般突起部10AC的形狀的聚氯乙烯樹脂製的殼體10（寬40 cm、高100 cm），其他則以與實施例1同樣的方法，製作出袋狀體即圖1所示般的隔膜構件1。隨後，以與實施例1同樣的方法，實施鍍銅後，藉由目測來確認殼體10的導入口10B以外的三邊上的隔膜20的剝落狀況。(Example 2) A case 10 (40 cm in width and 100 cm in height) made of a polyvinyl chloride resin processed into a shape having a protrusion portion 10AC as shown in FIG. 8 was used. A bag-shaped body, that is, a diaphragm member 1 as shown in FIG. 1 was produced. Subsequently, after the copper plating was performed in the same manner as in Example 1, the peeling state of the separators 20 on three sides other than the inlet 10B of the casing 10 was visually confirmed.
（比較例1） 準備加工成圖2所示般形狀的聚氯乙烯樹脂製的殼體10（寬40 cm、高100 cm）、與對聚對苯二甲酸乙二酯樹脂塗佈有聚偏二氟乙烯樹脂的厚度200 μm的隔膜20（橫65 cm、縱115 cm），在殼體10的導入口10B以外的三邊的電極保持部10A的翻折部10A1的外表面，藉由熱封而接合隔膜20，製作出袋狀體即圖1所示般的隔膜構件1。 隨後，以與實施例1同樣的方法，實施鍍銅後，藉由目測來確認殼體10的導入口10B以外的三邊上的隔膜20的剝落狀況。(Comparative Example 1) A case 10 (40 cm in width and 100 cm in height) made of a polyvinyl chloride resin having a shape as shown in Fig. 2 was prepared, and a polyethylene terephthalate resin was applied. A 200 μm-thick diaphragm 20 (65 cm in width and 115 cm in length) of difluoroethylene resin is formed on the outer surface of the folded portion 10A1 of the electrode holding portion 10A on three sides other than the inlet 10B of the case 10 by heat. The diaphragm 20 is sealed and joined, and a bag-shaped body, that is, a diaphragm member 1 as shown in FIG. 1 is produced. Subsequently, after the copper plating was performed in the same manner as in Example 1, the peeling state of the separators 20 on three sides other than the inlet 10B of the casing 10 was visually confirmed.
其結果，在比較例1中，確認到殼體10的二邊（圖1中的B方向及C方向）的隔膜20從翻折部10A2剝落。另一方面，在實施例1、實施例2中，未確認到殼體10的三邊（圖1中的A方向、B方向及C方向）的隔膜20從平面壁部10A1剝落。 [產業上的可利用性]As a result, in Comparative Example 1, it was confirmed that the separators 20 on both sides (direction B and direction C in FIG. 1) of the casing 10 were peeled off from the folded portion 10A2. On the other hand, in Example 1 and Example 2, it was not confirmed that the separator 20 on three sides (directions A, B, and C in FIG. 1) of the casing 10 was peeled from the flat wall portion 10A1. [Industrial availability]
本發明的隔膜構件即使對隔膜產生水壓，亦可抑制隔膜從殼體剝落，因此可較佳地利用於金屬氣鍍敷用途。The diaphragm member of the present invention can suppress peeling of the diaphragm from the casing even if it generates water pressure on the diaphragm, and therefore can be preferably used for metal gas plating applications.
1‧‧‧隔膜構件
10‧‧‧殼體
10A‧‧‧電極保持部
10B‧‧‧導入口
10A1‧‧‧平面壁部
10A2‧‧‧翻折部
10A2a‧‧‧前端
10A2b‧‧‧最周緣端部
10AC‧‧‧突起部
20‧‧‧隔膜
30‧‧‧電極（陽極）
50‧‧‧電極支持構件
100‧‧‧鍍敷裝置
A、B、C、D、α‧‧‧方向
H1、H2‧‧‧垂直線
M‧‧‧鍍敷液
O1、O2‧‧‧安裝端部
O3‧‧‧邊界線
P1‧‧‧水壓
P2、P3‧‧‧應力
T1、T2‧‧‧厚度
W‧‧‧被鍍敷基板（陰極）
H’‧‧‧高
W’‧‧‧寬1‧‧‧ diaphragm member
10‧‧‧shell
10A‧‧‧electrode holding section
10B‧‧‧Inlet
10A1‧‧‧Plane wall
10A2‧‧‧Folding section
10A2a‧‧‧Front
10A2b‧‧‧The most peripheral end
10AC‧‧‧ protrusion
20‧‧‧ diaphragm
30‧‧‧ electrode (anode)
50‧‧‧electrode support member
100‧‧‧ plating equipment
A, B, C, D, α‧‧‧ directions
H1, H2‧‧‧ vertical line
M‧‧‧plating solution
O1, O2‧‧‧ Mounting end
O3‧‧‧ boundary
P1‧‧‧Water pressure
P2, P3‧‧‧stress
T1, T2‧‧‧thickness
W‧‧‧ Plated substrate (cathode)
H'‧‧‧ High
W'‧‧‧ wide
圖1是用於對本發明的實施形態的隔膜構件進行說明的概念立體圖。 圖2是表示從殼體本體10拆卸了圖1所示的隔膜構件1的隔膜20時的結構的概念立體圖。 圖3是從圖1的A方向觀察的本發明的實施形態的隔膜構件1的俯視圖。 圖4是從圖1的B、C及D方向觀察的殼體10的翻折部10A2附近的側面圖。 圖5（a）及圖5（b）是將從圖1的A方向觀察的電極保持部10A的附近放大的、用於說明本發明的效果的概念圖。 圖6是用於更具體地說明本發明的、將從圖1的A方向觀察的電極保持部10A的附近放大的概念圖。 圖7是表示將本發明的實施形態的隔膜構件設置於鍍敷裝置時的各構件的配置的概念剖面圖。 圖8是對本發明的實施形態的隔膜構件的其他實施形態進行的說明的、將電極保持部10A的附近放大的概念圖。FIG. 1 is a conceptual perspective view for explaining a diaphragm member according to an embodiment of the present invention. FIG. 2 is a conceptual perspective view showing a configuration when the diaphragm 20 of the diaphragm member 1 shown in FIG. 1 is removed from the case body 10. FIG. 3 is a plan view of the diaphragm member 1 according to the embodiment of the present invention, as viewed from a direction A in FIG. 1. FIG. 4 is a side view of the vicinity of the folded portion 10A2 of the casing 10 as viewed from the directions B, C, and D in FIG. 1. FIGS. 5 (a) and 5 (b) are conceptual diagrams illustrating the effect of the present invention in an enlarged manner in the vicinity of the electrode holding portion 10A viewed from the direction of A in FIG. 1. FIG. 6 is a conceptual view enlarged in the vicinity of the electrode holding portion 10A viewed from the direction of A in FIG. 1 to explain the present invention more specifically. 7 is a conceptual cross-sectional view showing an arrangement of each member when the diaphragm member according to the embodiment of the present invention is installed in a plating apparatus. FIG. 8 is a conceptual view illustrating another embodiment of the separator member according to the embodiment of the present invention, and enlarging the vicinity of the electrode holding portion 10A.
1‧‧‧隔膜構件 1‧‧‧ diaphragm member
10‧‧‧殼體 10‧‧‧shell
10A‧‧‧電極保持部 10A‧‧‧electrode holding section
10B‧‧‧導入口 10B‧‧‧Inlet
10A1‧‧‧平面壁部 10A1‧‧‧Plane wall
10A2‧‧‧翻折部 10A2‧‧‧Folding section
20‧‧‧隔膜 20‧‧‧ diaphragm
30‧‧‧電極(陽極) 30‧‧‧ electrode (anode)
Claims (3)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-158780 | 2016-08-12 | ||
| JP2016158780A JP6754636B2 (en) | 2016-08-12 | 2016-08-12 | Septal member |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201805488A true TW201805488A (en) | 2018-02-16 |
| TWI732022B TWI732022B (en) | 2021-07-01 |
Family
ID=61195055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106127193A TWI732022B (en) | 2016-08-12 | 2017-08-11 | Diaphragm member |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP6754636B2 (en) |
| CN (1) | CN107723783B (en) |
| TW (1) | TWI732022B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7256042B2 (en) * | 2019-03-20 | 2023-04-11 | 株式会社ユアサメンブレンシステム | Diaphragm member |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5184308B2 (en) * | 2007-12-04 | 2013-04-17 | 株式会社荏原製作所 | Plating apparatus and plating method |
| US8575028B2 (en) * | 2011-04-15 | 2013-11-05 | Novellus Systems, Inc. | Method and apparatus for filling interconnect structures |
| TWI534302B (en) * | 2013-09-30 | 2016-05-21 | 欣興電子股份有限公司 | Membrane device |
| CN104562162B (en) * | 2013-10-21 | 2018-03-23 | 欣兴电子股份有限公司 | Diaphragm apparatus |
-
2016
- 2016-08-12 JP JP2016158780A patent/JP6754636B2/en active Active
-
2017
- 2017-08-10 CN CN201710683109.3A patent/CN107723783B/en active Active
- 2017-08-11 TW TW106127193A patent/TWI732022B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| CN107723783A (en) | 2018-02-23 |
| CN107723783B (en) | 2021-08-24 |
| JP6754636B2 (en) | 2020-09-16 |
| TWI732022B (en) | 2021-07-01 |
| JP2018024928A (en) | 2018-02-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2014157944A (en) | Gas supply member and plasma processing apparatus | |
| US20150107771A1 (en) | Trap apparatus and substrate processing apparatus | |
| JP2010129845A (en) | Electrostatic chuck and method for manufacturing the same | |
| US9583355B2 (en) | Plasma processing apparatus and plasma processing method | |
| JP2011066426A (en) | Swing nozzle unit and substrate treatment apparatus having the same | |
| TWI678436B (en) | Electroplating apparatus | |
| TW201805488A (en) | Diaphragm member capable of inhibiting the diaphragm from being separated from a housing even when a water pressure is applied to the diaphragm | |
| TW201739322A (en) | Plasma source and substrate treating apparatus including the same | |
| JP5547366B2 (en) | Plasma processing equipment | |
| JP2020136616A (en) | Placement base and substrate processing device | |
| KR101905640B1 (en) | Apparatus for treating substrate | |
| JP6923889B2 (en) | Board processing equipment | |
| JP6757073B2 (en) | Plating equipment | |
| JP6572800B2 (en) | Vacuum equipment | |
| US20140332497A1 (en) | Plasma processing apparatus and plasma processing method | |
| JP7361588B2 (en) | Edge ring and substrate processing equipment | |
| JP2012199491A (en) | Processing apparatus | |
| JP7134804B2 (en) | COLLET CHUCK, SEMICONDUCTOR MANUFACTURING APPARATUS, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD | |
| JP2014225579A (en) | Dry etching device and method | |
| JP2013149634A (en) | Dry etching device | |
| JP7171371B2 (en) | etching equipment | |
| JP2007329499A (en) | Plasma treatment apparatus | |
| JP2012082447A (en) | Substrate treatment apparatus and method | |
| KR20170116718A (en) | Apparatus and method for treating substrate | |
| JP5488384B2 (en) | Substrate processing equipment |