TW201805106A - Composite processing machine with material height and collision detection functions including a machine, a contact type detection device, a non-contact type detection device, a control module and a determining module - Google Patents

Abstract

A composite processing machine with material height and collision detection functions includes a machine, a contact type detection device, a non-contact type detection device, a control module and a determining module. The machine is provided thereon with a liftable working platform so that laser processing can be performed after a to-be-processed object is placed on the working platform. The contact type detection device and the non-contact type detection device are provided on the machine and are movable to change positions thereof. The control module is connected to the contact type detection device and the non-contact type detection device respectively. The determining module is operable to determine an outline of the to-be-processed object, so as to drive the control module to control the contact-type detection device and the non-contact type detection device to respectively or sequentially perform detection on the to-be-processed object.

Description

具材料高度與碰撞偵測之複合式加工機 Composite processing machine with material height and collision detection

本發明係有關一種可於同一機台上針對不同加工物件之特性而得到最佳之偵測效果之具材料高度與碰撞偵測之複合式加工機，特別適用於雷射雕刻機、雷射切割機、平台式印表機等XY平台式加工機之使用者。 The invention relates to a composite processing machine with material height and collision detection, which can obtain the best detection effect for the characteristics of different processed objects on the same machine, and is particularly suitable for laser engraving machines and laser cutting. Users of XY platform processing machines, such as printers and flatbed printers.

由於現今在印刷輸出產業上，主要包括有雷射雕刻/切割機、噴墨印刷列印機等加工機，一般加工機之基本原理，主要是自筆車上之雷射頭將雷射輸出之光束導引並聚焦到受刻物件的表面，聚焦後的光束，經材料吸收，溫度驟然昇高而氣化，使物件表面凹下，亦或者藉由聚焦後之高能量光束加熱融化加工物件表面，同時以高壓氣體吹除熔融材料，而達成雕刻或切割之目的。而噴墨印刷加工機可藉由噴墨頭將不同顏色墨水匣於同一位置噴印不同濃度顏色，以產生所欲呈現之色彩，並達到如同相片品質的水準，省去了製作分色網版的時間與工作，使在這競爭力的時代更具優勢。 Since the printing and output industry today mainly includes processing machines such as laser engraving / cutting machines and inkjet printing printers, the basic principle of general processing machines is mainly the laser beam output from the laser head on the pen cart. Guide and focus on the surface of the engraved object. The focused beam is absorbed by the material, and the temperature suddenly rises to vaporize, making the surface of the object concave, or heating and melting the surface of the processed object by focusing the high-energy beam At the same time, the molten material is blown away with high pressure gas to achieve the purpose of engraving or cutting. The inkjet printing machine can use inkjet heads to print different color ink cartridges at the same position with different density colors to produce the desired color and reach the level of photo quality, eliminating the need to make color separation screens. The time and work give us an advantage in this competitive era.

而在上述加工機上大多利用在X-Y工作平台上透過一偵測裝置，來偵測加工物件的厚度，除了防止在進行雕刻、切割或噴墨等加工 作業時，因加工刀具、雷射頭或噴墨頭碰撞到加工物件而造成受損之問題，亦可在加工作業前獲得加工刀具、雷射頭或噴墨頭等與加工物件表面的最佳間距，然而，目前市面上所有的加工機只搭配一種偵測裝置，使得僅能進行接觸式偵測或非接觸式偵測(如光學偵測)，又非接觸式偵測裝置易受環境、材料性質與顏色之影響，而接觸式偵測裝置易受加工物件表面狀況影響，如壓克力之透明材料，僅能使用接觸式偵測來偵測，而表面厚度不一的加工物件較適合非接觸式偵測來偵測，因此，如於同一機台上針對不同加工物件之特性而得到最佳之偵測效果，以增加提高加工時之效率與成品之良率，一直為本發明人研究之方向。 Most of the above processing machines use the X-Y working platform to detect the thickness of the processed object through a detection device, in addition to preventing processing such as engraving, cutting or inkjet During operation, the damage caused by the processing tool, laser head or inkjet head colliding with the processing object can also be obtained before the processing operation. Pitch, however, all processing machines currently on the market are equipped with only one detection device, making it possible to perform only contact detection or non-contact detection (such as optical detection), and non-contact detection devices are susceptible to the environment, The influence of material properties and colors, and the contact detection device is susceptible to the surface condition of processed objects. For example, acrylic transparent materials can only be detected by contact detection. Processing objects with different surface thicknesses are more suitable. Non-contact detection to detect. Therefore, if the best detection effect is obtained on the same machine for the characteristics of different processed objects, in order to increase the processing efficiency and the yield of the finished product, it has always been the inventor. Research direction.

本發明係有關一種結構簡單、操作方便且可於同一機台上針對不同加工物件之特性而得到最佳之偵測效果之具材料高度與碰撞偵測之複合式加工機。 The invention relates to a composite processing machine with material height and collision detection, which has a simple structure, convenient operation, and can obtain the best detection effect for different processing object characteristics on the same machine.

為達上述之目的，本發明所設一種具材料高度與碰撞偵測之複合式加工機，包括一機台、一接觸式偵測裝置、一非接觸式偵測裝置、一控制模組及一判斷模組，其中該機台上設有一可升降之工作平台，使當一加工物件置於該工作平台後，可進行雷射加工作業，該接觸式偵測裝置與該非接觸式偵測裝置係設於該機台上並可活動位移，而該控制模組係分別與該接觸式偵測裝置、非接觸式偵測裝置連接，而該判斷模組用以判斷該加工物件之外觀，以驅動該控制模組控制該接觸式偵測裝置、非接觸式偵測裝置個別或依序進行對該加工物件之偵測。 In order to achieve the above object, a composite processing machine with material height and collision detection provided by the present invention includes a machine, a contact detection device, a non-contact detection device, a control module and a A judging module, in which a lifting platform is provided on the machine platform, so that a laser processing operation can be performed after a processing object is placed on the working platform. The contact detection device and the non-contact detection device are The control module is connected to the contact detection device and the non-contact detection device respectively, and the judgment module is used to judge the appearance of the processed object to drive. The control module controls the contact detection device and the non-contact detection device to individually or sequentially detect the processed object.

實施時，該接觸式偵測裝置係可設為以探針方式或極限開關 方式等接觸式之偵測方式。 In practice, the contact detection device can be set as a probe or limit switch. Contact detection methods.

實施時，該非接觸式偵測裝置係可設為以紅外線方式、雷射方式、超音波等光學非接觸式之偵測方式。 During implementation, the non-contact detection device can be set as an optical non-contact detection method such as an infrared method, a laser method, and an ultrasonic wave.

實施時，該判斷模組係用以判斷該加工物件如透明度、表面平整性等之外觀後，始驅動該控制模組控制該接觸式偵測裝置、非接觸式偵測裝置個別或依序進行對該加工物件之偵測。 When implemented, the judgment module is used to judge the appearance of the processed object such as transparency, surface flatness, etc., and then drive the control module to control the contact detection device, non-contact detection device individually or sequentially. Detection of the processed object.

實施時，該接觸式偵測裝置與該非接觸式偵測裝置係可分別藉由一設置於該機台上之位移裝置，而可分別活動位移於該機台上，該位移裝置係可為筆車、筆車軸或噴墨頭等。 During implementation, the contact detection device and the non-contact detection device can be separately moved on the machine by a displacement device provided on the machine, and the displacement device can be a pen. Car, pen axle or inkjet head.

為進一步了解本發明，以下舉較佳之實施例，配合圖式、圖號，將本發明之具體構成內容及其所達成的功效詳細說明如下。 In order to further understand the present invention, the preferred embodiments will be described in detail below with reference to the drawings and figures, and the specific constitutional content of the present invention and its achieved effects will be described in detail as follows.

1‧‧‧機台 1‧‧‧machine

11‧‧‧工作平台 11‧‧‧Working Platform

12‧‧‧位移裝置 12‧‧‧ Displacement device

2‧‧‧接觸式偵測裝置 2‧‧‧contact detection device

3‧‧‧非接觸式偵測裝置 3‧‧‧ Non-contact detection device

4‧‧‧控制模組 4‧‧‧Control Module

5‧‧‧判斷模組 5‧‧‧ Judgment Module

第1圖係為本發明實施例中接觸式偵測裝置設於機台上之狀態示意圖。 FIG. 1 is a schematic diagram of a state where a contact detection device is set on a machine in an embodiment of the present invention.

第2圖係為本發明實施例中非接觸式偵測裝置設於機台上之狀態示意圖。 FIG. 2 is a schematic diagram of a state where a non-contact detection device is set on a machine according to an embodiment of the present invention.

第3圖係為本發明實施例中之架構圖。 FIG. 3 is a structural diagram in an embodiment of the present invention.

請參閱第1~3圖，圖式內容為本發明一種具材料高度與碰撞偵測之複合式加工機之一實施例，其係由一機台1、一接觸式偵測裝置2、一非接觸式偵測裝置3、一控制模組4及一判斷模組5所組成。 Please refer to Figs. 1 to 3, which is an embodiment of a composite processing machine with material height and collision detection according to the present invention. The machine is composed of a machine 1, a contact detection device 2, and a non- The contact detection device 3 is composed of a control module 4 and a judgment module 5.

該機台1上設有一可升降之工作平台11，始可調整其高低位 置，該機台1於該工作平台11上則複數個位移裝置(如筆車、筆車軸或是噴墨頭等移動裝置)，該接觸式偵測裝置2與該非接觸式偵測裝置3係分設於該機台1之不同之位移裝置12上，該接觸式偵測裝置2係可設為以探針方式或極限開關方式等接觸式之偵測方式，該非接觸式偵測裝置3係可設為以紅外線方式、雷射方式、超音波等光學非接觸式之偵測方式，因此使得當一加工物件置於該工作平台11後，可藉由進行雷射加工作業。 The machine 1 is provided with a liftable working platform 11 so that its height can be adjusted. The machine 1 is on the working platform 11 and has a plurality of displacement devices (such as a pen, a pen carriage, or a mobile device such as an inkjet head). The contact detection device 2 and the non-contact detection device 3 are Separately installed on different displacement devices 12 of the machine 1. The contact detection device 2 can be set as a contact detection method such as a probe method or a limit switch method. The non-contact detection device 3 is It can be set to optical non-contact detection methods such as infrared method, laser method, and ultrasonic wave, so that when a processing object is placed on the work platform 11, laser processing operations can be performed.

該控制模組4係分別與該接觸式偵測裝置2、非接觸式偵測裝置3連接，用以控制該接觸式偵測裝置2、非接觸式偵測裝置3進行對該加工物件之偵測。 The control module 4 is connected to the contact detection device 2 and the non-contact detection device 3, respectively, for controlling the contact detection device 2, the non-contact detection device 3 to detect the processed object. Measurement.

該判斷模組5係用以判斷該加工物件如透明度、表面平整性等之外觀，以驅動該控制模組4控制該接觸式偵測裝置2、非接觸式偵測裝置3個別或依序進行對該加工物件之偵測。 The judgment module 5 is used to judge the appearance of the processed object such as transparency, surface flatness, etc., so as to drive the control module 4 to control the contact detection device 2 and the non-contact detection device 3 individually or sequentially. Detection of the processed object.

因此，實施時，當使用者將加工物件置放於該工作平台11上後，即可啟動該判斷模組5判斷該加工物件，例如，若該加工物件係為一透明材料時，即可驅動該控制模組4控制該接觸式偵測裝置2來進行偵測該加工物件之料厚，若該加工物件為非透明材料時，可驅動該控制模組4控制該2接觸式偵測裝置或3非接觸式偵測裝置來進行偵測該加工物件之料厚，且若該加工物件為非透明材料且具有高低不平之表面高度時，則驅動該控制模組4控制該非接觸式偵測裝置3，以可較精確地偵測該加工物件之料厚，使得後續進行雕刻、切割或噴墨等加工作業時，可降低加工刀具、雷射頭或噴墨頭碰撞到加工物件而造成受損之問題，亦可在加工作業前獲得加工刀具、雷射頭或噴墨頭等與加工物件表面的最佳間距。 Therefore, during implementation, when a user places a processing object on the work platform 11, the judgment module 5 can be activated to determine the processing object. For example, if the processing object is a transparent material, it can be driven. The control module 4 controls the contact detection device 2 to detect the material thickness of the processed object. If the processed object is a non-transparent material, the control module 4 can be driven to control the 2 contact detection device or 3 non-contact detection device to detect the material thickness of the processed object, and if the processed object is a non-transparent material and has uneven surface height, the control module 4 is driven to control the non-contact detection device 3, to accurately detect the material thickness of the processed object, so that subsequent processing operations such as engraving, cutting or inkjet can reduce the damage of the processing tool, laser head or inkjet head to the processed object and cause damage For the problem, it is also possible to obtain the optimal distance between the processing tool, laser head or inkjet head and the surface of the processing object before the processing operation.

以上所述乃是本發明之具體實施例及所運用之技術手段，根據本文的揭露或教導可衍生推導出許多的變更與修正，仍可視為本發明之構想所作之等效改變，其所產生之作用仍未超出說明書及圖式所涵蓋之實質精神，均應視為在本發明之技術範疇之內，合先陳明。 The above are the specific embodiments of the present invention and the technical means used. According to the disclosure or teaching of this article, many changes and modifications can be derived, which can still be regarded as the equivalent changes made by the concept of the present invention. The functions that have not exceeded the essential spirit covered by the description and drawings should be regarded as within the technical scope of the present invention, and should be considered together.

綜上所述，依上文所揭示之內容，本發明確可達到發明之預期目的，提供一種具材料高度與碰撞偵測之複合式加工機，極具實用性與產業上利用之價值，爰依法提出發明專利申請。 In summary, according to the content disclosed above, the present invention can indeed achieve the intended purpose of the invention, and provide a composite processing machine with material height and collision detection, which has great practicality and industrial value. File an application for an invention patent in accordance with law.

2‧‧‧接觸式偵測裝置 2‧‧‧contact detection device

3‧‧‧非接觸式偵測裝置 3‧‧‧ Non-contact detection device

4‧‧‧控制模組 4‧‧‧Control Module

5‧‧‧判斷模組 5‧‧‧ Judgment Module

Claims (6)

一種具材料高度與碰撞偵測之複合式加工機，包括：一機台，該機台上設有一可升降之工作平台，始可調整其高低位置，使當一加工物件置於該工作平台後，可進行雷射加工作業；一接觸式偵測裝置，設於該機台上並可活動位移；一非接觸式偵測裝置，設於該機台上並可活動位移；一控制模組，係分別與該接觸式偵測裝置、非接觸式偵測裝置連接，用以控制該接觸式偵測裝置、非接觸式偵測裝置進行對該加工物件之偵測；一判斷模組，用以判斷該加工物件之外觀，以驅動該控制模組控制該接觸式偵測裝置、非接觸式偵測裝置個別或依序進行對該加工物件之偵測。 A composite processing machine with material height and collision detection includes: a machine, which is provided with a work platform that can be raised and lowered, and then its height position can be adjusted so that when a processing object is placed on the work platform , Can be used for laser processing operations; a contact detection device is installed on the machine and can be moved; a non-contact detection device is installed on the machine and can be moved; a control module, It is connected with the contact detection device and non-contact detection device respectively to control the contact detection device and non-contact detection device to detect the processed object; a judgment module is used to Judging the appearance of the processed object to drive the control module to control the contact detection device and the non-contact detection device to individually or sequentially detect the processing object. 如申請專利範圍第1項所述之具材料高度與碰撞偵測之複合式加工機，其中該接觸式偵測裝置係可設為以探針方式或極限開關方式等接觸式之偵測方式。 The composite processing machine with material height and collision detection as described in the first item of the patent application scope, wherein the contact detection device can be set as a contact detection method such as a probe method or a limit switch method. 如申請專利範圍第1項所述之具材料高度與碰撞偵測之複合式加工機，其中該非接觸式偵測裝置係可設為以紅外線方式、雷射方式、超音波等光學非接觸式之偵測方式。 The compound processing machine with material height and collision detection as described in item 1 of the scope of patent application, wherein the non-contact detection device can be set as an optical non-contact type with infrared method, laser method, ultrasonic wave, etc. Detection method. 如申請專利範圍第1項所述之具材料高度與碰撞偵測之複合式加工機，其中該判斷模組係用以判斷該加工物件如透明度、表面平整性等之外觀後，始驅動該控制模組控制該接觸式偵測裝置、非接觸式偵測裝置個別 或依序進行對該加工物件之偵測。 The compound processing machine with material height and collision detection as described in the first patent application scope, wherein the judgment module is used to judge the appearance of the processed object such as transparency, surface flatness, etc., and then drive the control The module controls the contact detection device and contactless detection device individually. Or sequentially detect the processed objects. 如申請專利範圍第1項所述之具材料高度與碰撞偵測之複合式加工機，其中該接觸式偵測裝置與該非接觸式偵測裝置係可分別藉由一設置於該機台上之位移裝置，而可分別活動位移於該機台上。 The compound processing machine with material height and collision detection according to item 1 of the scope of the patent application, wherein the contact detection device and the non-contact detection device can be respectively provided by a The displacement device can be moved and moved on the machine separately. 如申請專利範圍第5項所述之具材料高度與碰撞偵測之複合式加工機，其中該位移裝置係可為筆車或筆車軸。 According to the compound processing machine with material height and collision detection described in item 5 of the scope of patent application, the displacement device may be a pen carriage or a pen axle.