TW201802481A - Flexible assembly IC handler and flexible assembly IC test system - Google Patents
Flexible assembly IC handler and flexible assembly IC test system Download PDFInfo
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本發明相關於一種彈性組合之半導體元件處理裝置以及半導體元件分類測試系統,特別是有關一種可以因應各種半導體元件處理與測試的需求而快速地變更其內組成的半導體元件處理裝置以及半導體元件分類測試系統。The present invention relates to a flexible combination of a semiconductor component processing apparatus and a semiconductor component classification test system, and more particularly to a semiconductor component processing apparatus and semiconductor component classification test which can quickly change its composition in response to the requirements of various semiconductor component processing and testing requirements. system.
隨著半導體元件(例如IC、MEMS等)的多樣化與多功能化,對半導體元件所需提供的處理(例如加熱、翻面、外觀檢查、轉換、定位、分類、雷射標籤、標籤檢視等)與測試(電性測試、射頻測試、直線往復測試、翻轉測試、旋轉測試、以及老化測試等)也變的多樣化。通常,在完成半導體製作後,在對半導體元件進行測試之前或之後,對於不同種類或規格的半導體元件需要進行不同的處理程序(例如加熱、翻面、外觀檢查、轉換、定位等)。但是,大多數的半導體元件處理裝置都僅具有單一處理功能,所以測試廠往往為了能應付所有的處理程序,必需要購置各種不同功能的處理裝置備用,而這些處理裝置都不便宜,所以使得處理成本與測試成本大幅地增加,並且由於並非每一處理程序都是經常實施的,所以導致很多處理裝置的使用頻率低,而造成浪費。其次,有時候需要進行多道不同的處理程序,此時往往需要將半導體元件先輸送到一處理裝置中進行處理程序,帶此一處理程序完成後,再將其集中並藉由人工或是機械將半導體元件送到另一處理裝置進行另一處理程序,而無法在同一處理裝置完成所有的處理程序,所以不但費時且降低了處理效率與測試效率,更因此增加了半導體元件在測試廠內的時間,而無法達到快速交貨的目標。With the diversification and versatility of semiconductor components (such as ICs, MEMS, etc.), the processing required for semiconductor components (such as heating, flipping, visual inspection, conversion, positioning, classification, laser labeling, label inspection, etc.) ) and testing (electrical testing, radio frequency testing, linear reciprocating testing, flip testing, rotating testing, and aging testing, etc.) have also become diversified. Generally, after the semiconductor fabrication is completed, different processing procedures (such as heating, flipping, visual inspection, conversion, positioning, etc.) are required for different types or specifications of semiconductor components before or after testing the semiconductor components. However, most of the semiconductor component processing devices have only a single processing function, so in order to be able to cope with all the processing procedures, the tester must purchase a processing device of various functions, and these processing devices are not cheap, so that the processing is performed. Cost and test costs are greatly increased, and since not every process is often implemented, many processing devices are used less frequently and waste. Secondly, sometimes it is necessary to carry out a plurality of different processing procedures. At this time, it is often necessary to transport the semiconductor components to a processing device for processing, and after the processing is completed, concentrate them and manually or mechanically The semiconductor component is sent to another processing device for another processing procedure, and all processing procedures cannot be completed in the same processing device, so that time-consuming and low processing efficiency and testing efficiency are reduced, thereby increasing the semiconductor component in the test factory. Time, and the goal of fast delivery cannot be achieved.
本發明之一目的為提供一種彈性組合之半導體元件處理裝置,其可以依照所需要的處理流程彈性且快速地組裝與變更,並可將所需要之進出料模式與處理流程統一於其上實施,而無需購置各種不同功能的轉換裝置以因應客戶所要求的各種處理流程,從而降低因需購置各種不同功能的處理裝置所增加的成本以及因某些處理裝置使用頻率不高所造成的浪費,以節省轉換與處理流程的成本與時間,並縮短半導體元件在測試廠內的時間,而達到快速出貨的目的。An object of the present invention is to provide a flexible combination of semiconductor component processing apparatus that can be flexibly and quickly assembled and modified in accordance with a required processing flow, and that the required in-and-out mode and processing flow can be unified thereon. There is no need to purchase a variety of different conversion devices to meet the various processing procedures required by the customer, thereby reducing the cost of processing devices that require the purchase of various functions and the waste caused by the low frequency of use of certain processing devices. Save the cost and time of conversion and processing, and shorten the time of semiconductor components in the test plant to achieve fast shipping.
本發明之另一目的為提供一種彈性組合之半導體元件分類測試系統,其可以依照所需要的處理流程自由地選擇所需的進出料模式、半導體元件處理模式(或流程)、以及測試模式,而彈性且快速地組裝與變更而成,而將所需要之進出料模式、半導體元件處理流程、以及測試統一於其上實施,而無需以人工或是機械將半導體元件輸送至其他機台實施這些進出料模式、半導體元件處理模式(或流程)、以及測試模式,從而節省測試成本與時間,並縮短半導體元件在測試廠內的時間,而達到快速出貨的目的。Another object of the present invention is to provide a flexible combined semiconductor component classification test system that can freely select a desired input/output mode, a semiconductor component processing mode (or process), and a test mode in accordance with a required processing flow. Flexible and quick assembly and change, and the required input and output modes, semiconductor component processing flow, and testing are unified on the implementation, without the need to manually or mechanically transport semiconductor components to other machines to implement these in and out Material mode, semiconductor component processing mode (or process), and test mode, thereby saving test cost and time, and shortening the time of semiconductor components in the test factory to achieve fast shipping.
根據本發明之一目的,本發明提供一種彈性組合之半導體元件處理裝置。此彈性組合之半導體元件處理裝置包含一用以輸入半導體元件的進料模組、一用以輸出半導體元件的出料模組與一用以對半導體元件進行處理的處理模組。進料模組包含數種不同種類的入料單元,出料模組包含數種不同種類的出料單元,處理模組包含數個處理單元,每一處理單元都為一獨立且分離的個體,且每一處理單元皆具有二處理單元連結定位機構,藉由二處理單元連結定位機構分別與一出料單元的該出料單元連結定位機構以及一入料單元的入料單元連結定位機構結合,以組合成一半導體元件處理裝置,從而可以自由地選取不同的處理單元與不同的入料單元以及不同出料單元進行搭接而組合成具有不同的功能的半導體元件處理裝置。According to an aspect of the present invention, there is provided an elastic component semiconductor device processing apparatus. The flexible combination semiconductor component processing apparatus includes a feed module for inputting a semiconductor component, a discharge module for outputting the semiconductor component, and a processing module for processing the semiconductor component. The feeding module comprises several different types of feeding units, the discharging module comprises several different kinds of discharging units, the processing module comprises several processing units, and each processing unit is an independent and separate individual. Each processing unit has two processing unit connection positioning mechanisms, and the two processing unit connection positioning mechanisms are respectively combined with the discharge unit connection positioning mechanism of one discharge unit and the feeding unit connection positioning mechanism of a feeding unit. In order to combine into a semiconductor component processing apparatus, it is possible to freely select different processing units to be overlapped with different feeding units and different discharging units to be combined into semiconductor component processing apparatuses having different functions.
根據本發明之另一目的,本發明提供一種彈性組合之半導體元件分類測試系統。此彈性組合之半導體元件分類測試系統包含一用以輸入半導體元件的進料模組、一用以對半導體元件進行測試的測試模組、以及一用以輸出半導體元件的出料模組。進料模組包含數種不同種類的入料單元,每一入料單元都為一獨立且分離的個體,且每一入料單元皆具有一入料單元連結定位機構。測試模組包含數種不同種類的測試單元,每一測試單元都為一獨立且分離的個體,且每一測試單元皆具有至少二測試單元連結定位機構。出料模組包含數種不同種類的出料單元,每一出料單元都為一獨立且分離的個體,且每一出料單元皆具有一出料單元連結定位機構。每一測試單元可以藉由二測試單元連結定位機構分別連接一入料單元的入料單元連結定位機構與一出料單元的出料單元連結定位機構,而將測試單元設置於該入料單元與出料單元之間,而可以快速地組合可以將所需的進出料模式與測試實施於統一於其上實施的半導體元件分類測試系統,藉此測試廠可以自由地選取不同的入料單元、不同的測試單元、以及不同的出料單元進行搭接而組合成不同的半導體元件分類測試系統,以符合客戶的需求與要求。According to another object of the present invention, the present invention provides an elastic combination semiconductor component classification test system. The flexible combination semiconductor component classification test system includes a feed module for inputting a semiconductor component, a test module for testing the semiconductor component, and a discharge module for outputting the semiconductor component. The feed module comprises a plurality of different types of feed units, each of which is an independent and separate individual, and each of the feed units has a feed unit connection positioning mechanism. The test module includes several different types of test units, each of which is an independent and separate individual, and each test unit has at least two test unit joint positioning mechanisms. The discharge module comprises several different types of discharge units, each of which is an independent and separate individual, and each discharge unit has a discharge unit connection positioning mechanism. Each test unit can be connected to the feeding unit of the feeding unit and the discharging unit of the discharging unit by the two testing unit connecting and positioning mechanisms, and the testing unit is disposed on the feeding unit. Between the discharge units, the combination can be quickly combined to implement the required input and output modes and tests on the semiconductor component classification test system unified on the implementation, so that the test factory can freely select different feed units and different The test unit and the different discharge units are lapped and combined into different semiconductor component classification test systems to meet the needs and requirements of the customer.
如第一圖所示,為依據本發明之一實施例之彈性組合之半導體元件處理裝置1之示意圖,其中半導體元件處理裝置包含進料模組10、出料模組20、處理模組30。本實施例中進料模組10包含由震動盤入料單元(Bowl feeder loader)、載盤入料單元(Tray loader)、載管入料單元(Tube loader)、載盤入料單元(Tray loader)、捲帶入料單元(Tape-on-reel loader)、以及晶圓框架進料入料單元(Wafer frame loader)等所構成的群組中的至少兩種入料單元,而出料模組20包含由箱盒出料單元(Boxing unloader)、載盤出料單元(Tray unloader)、載管出料單元(Tube unloader)、捲帶出料單元(Tape-on-reel unloader)、等所構成的群組中的至少兩種出料單元。處理模組30中的每一處理單元32~32E都為一獨立且分離的個體,且每一處理單元32~32E皆具有一用以傳遞半導體元件的輸送單元34~34E以及二處理單元連結定位機構31與33~31E與33E。二處理單元連結定位機構31與33~31E與33E皆為一卡扣定位機構,而分別設置於每一處理單元32~32E的兩側邊。每一處理單元32~32E可以藉由二處理單元連結定位機構31與33~31E與33E分別與進料模組10中的任一入料單元12~12E以及出料模組20中的任一出料單元22~22E卡扣結合,而將處理單元32~32E設置於入料單元12~12E與出料單元22~22E之間。再者,進料模組10中的每一半導體元件輸送單元14~14E都包含有一用以輸送載盤的載移單元16~16E以及一用以將半導體元件由原本的包裝中取出並放置於載盤上的拾取單元18~18E。雖然,在本實施例中,每一半導體元件輸送單元14~14E都僅具有一載移單元16~16E,但是並不以此為限,而是可以依照需求增加,藉此,使用者可以依照客戶所提供的半導體元件包裝的種類(或模式)、所需要的處理模式(或流程)、以及客戶所要求的半導體元件包裝的種類(或模式),自由地由進料模組10及出料模組20中選出符合客戶所提供的半導體元件包裝的種類(或模式)的入料單元12~12E及出料單元22~22E,自由地由處理模組30中選出符合所需處理模式(或流程)的處理單元32~32E,而藉由卡扣的方式將三者快速地組裝成各種不同的半導體元件處理裝置,即具有不同包裝轉換功能與處理功能的半導體元件處理裝置。As shown in the first figure, a schematic diagram of a semiconductor component processing apparatus 1 according to an embodiment of the present invention, wherein the semiconductor component processing apparatus includes a feed module 10, a discharge module 20, and a processing module 30. In the present embodiment, the feeding module 10 comprises a Bowl feeder loader, a Tray loader, a Tube loader, and a Tray loader. ), at least two feeding units of a group consisting of a tape-on-reel loader and a wafer frame feed unit (Wafer frame loader), and a discharge module 20 comprises a boxing unloader, a tray unloader, a tube unloader, a tape-and-reel unloader, and the like. At least two discharge units in the group. Each processing unit 32-32E in the processing module 30 is an independent and separate entity, and each processing unit 32-32E has a transport unit 34~34E for transmitting semiconductor components and two processing unit joint positioning. Mechanisms 31 and 33~31E and 33E. The two processing unit connection positioning mechanisms 31 and 33~31E and 33E are all a snap positioning mechanism, and are respectively disposed on both sides of each processing unit 32~32E. Each of the processing units 32-32E can be coupled to the positioning mechanism 31 and 33~31E and 33E by the two processing units, respectively, and any one of the feeding units 12~12E and the discharging module 20 of the feeding module 10. The discharging units 22 to 22E are snap-fitted, and the processing units 32 to 32E are disposed between the feeding units 12 to 12E and the discharging units 22 to 22E. Furthermore, each of the semiconductor component transfer units 14 to 14E in the feed module 10 includes a transfer unit 16-16E for transporting the carrier and a device for taking out and placing the semiconductor component from the original package. Pickup units 18~18E on the carrier. In this embodiment, each of the semiconductor component transport units 14-14E has only one load shifting unit 16~16E, but it is not limited thereto, but may be increased according to requirements, whereby the user can follow The type (or mode) of the semiconductor component package provided by the customer, the required processing mode (or process), and the type (or mode) of the semiconductor component package required by the customer, freely from the feed module 10 and the discharge The loading unit 12~12E and the discharging unit 22~22E which are selected according to the type (or mode) of the semiconductor component package provided by the customer are selected from the module 20, and are freely selected by the processing module 30 to meet the required processing mode (or The processing units 32 to 32E of the process are quickly assembled into various semiconductor device processing devices by snapping, that is, semiconductor device processing devices having different package switching functions and processing functions.
在這些處理單元32~32E中,若可以載盤直接做為進行處理流程時的半導體元件載具,例如加熱、外觀檢查等等處理流程,處理單元的輸送單元(例如處理單元32~32D之輸送單元34~34D)則可直接採用一運送載盤的載移單元,直接運送已裝載有半導體元件的載盤進行處理,不需要進行半導體的拾取與放置。在這些導體元件處理單元32~32E中,若是無法以載盤直接做為進行處理流程時的半導體元件載具(例如處理單元32E),其輸送單元(例如處理單元32E之輸送單元34E)則會包含至少一用以輸送載盤的載移單元(例如載移單元36E)以及一用以將半導體元件由載盤中取出而放置於該處理單元上進行處理的拾取單元(例如拾取單元38E),藉此進行半導體元件的取放與載盤的運送。In these processing units 32 to 32E, if the carrier can be directly used as a semiconductor component carrier for performing a processing flow, such as a heating, visual inspection, etc., the processing unit of the processing unit (for example, the processing unit 32 to 32D) Units 34 to 34D) can directly carry a carrier loaded with semiconductor components for processing by directly carrying a carrier unit carrying the carrier, without the need for semiconductor pick-up and placement. In these conductor element processing units 32 to 32E, if the carrier is not directly used as the semiconductor component carrier (for example, the processing unit 32E), the transport unit (for example, the transport unit 34E of the processing unit 32E) A picking unit (for example, a picking unit 38E) including at least one carrying unit for transporting the carrier (for example, the loading unit 36E) and a semiconductor element for being taken out from the carrier and disposed on the processing unit for processing, Thereby, the pick-and-place of the semiconductor element and the transport of the carrier are performed.
在組裝好所需的半導體元件處理裝置後,入料單元12~12E會藉由拾取單元18~18E與載移單元16~16E,將半導體元件由原本的包裝(例如散裝,載盤(tray)包裝、載管(tube)包裝、捲帶(tape-on-reel)包裝、或晶圓框架(wafer frame)包裝中取出並放置於載盤中,並將載盤藉由入料單元12~12E的載移單元16~16E輸送至處理單元32~32E的輸送單元34~34E(或載移單元36E)。之後,藉由輸送單元34~34E(或載移單元36E)而將直接載盤運送處理區內或處理區附近,而在處理區中直接對載盤上的半導體元件進行處理,或先藉由拾取單元38E將載盤上的半導體元件取出並放置到處理區內再進行處理。等處理完畢之後,則藉由輸送單元34~34D直接將載盤運送至出料單元22~22E中的載移單元26~26E,或是先以拾取單元38E將處理區內的半導體元件取出並放置於載盤上,再藉由輸送單元34E(或載移單元36E)將載盤運送至出料單元22~22E中的載移單元26~26E。然後,藉由出料單元22~22E的載移單元26~26E與拾取單元28~28E移動載盤,並將半導體元件由載盤中取出而放置於客戶所要求的半導體元件包裝中,而完成對半導體元件的處理與包裝轉換。以下第二A圖至第二G圖將舉出第一圖所示彈性組合之半導體元件處理裝置1所能組合的半導體元件處理裝置的各種實施例,但是並不以此為限,而是可以依照需求任意變更各個實施例中所選取的入料單元的種類與數量、處理單元的種類與數量、以及出料單元的種類與數量。After the required semiconductor component processing apparatus is assembled, the feeding units 12 to 12E will package the semiconductor components from the original packaging (for example, bulk, tray) by the pickup units 18 to 18E and the carrier units 16 to 16E. Take out in a package, tube package, tape-on-reel package, or wafer frame package and place it in the carrier, and place the carrier through the feeding unit 12~12E The transfer units 16-16E are transported to the transport units 34-34E (or the load transfer unit 36E) of the processing units 32-32E. Thereafter, the direct transport trays are transported by the transport units 34-34E (or the load transfer unit 36E). The semiconductor element on the carrier is directly processed in the processing area or in the vicinity of the processing area, or the semiconductor component on the carrier is first taken out by the pickup unit 38E and placed in the processing area for processing. After the processing is completed, the carrier is directly transported to the loading units 26 to 26E in the discharging units 22 to 22E by the conveying units 34 to 34D, or the semiconductor elements in the processing area are first taken out and placed by the picking unit 38E. On the carrier, the carrier is transported to and from the transport unit 34E (or the transport unit 36E). The transfer units 26 to 26E in the material units 22 to 22E. Then, the carrier units 26 to 26E and the pickup units 28 to 28E of the discharge units 22 to 22E move the carrier and take out the semiconductor components from the carrier. The semiconductor component processing package and the package conversion are completed in the semiconductor component package required by the customer. The following second to second G diagrams show the elastic component combination semiconductor component processing apparatus 1 shown in the first figure. Various embodiments of the semiconductor device processing apparatus that can be combined, but not limited thereto, may arbitrarily change the type and quantity of the feeding unit selected in each embodiment, the type and quantity of the processing unit, and The type and quantity of the discharge unit.
參照第二A圖,半導體元件處理裝置1A為選取彈性組合之半導體元件處理裝置1中的入料單元12(即震動盤入料單元)、處理單元32A(即翻面單元)、以及出料單元22C (即載盤出料單元)而組合成的單一之入料單元、一個處理單元、以及一個出料單元的設計組合。藉由將二處理單元連結定位機構31A與33A,分別與入料單元12(即震動盤入料單元)的入料單元連結定位機構11與出料單元22C (即載盤出料單元)的出料單元連結定位機構21C卡扣結合,可以輕易地在短時間內,組裝成所需之半導體元件處理裝置1A,以完成對半導體元件的翻面處理以及包裝轉換(即半導體元件由散裝轉換成載盤包裝)的半導體元件處理裝置1A。請續參第二B圖,其為選取彈性組合之半導體元件處理裝置2中的入料單元12 (即震動盤入料單元)、處理單元32D(即定位單元)、以及出料單元22D (即捲帶出料單元)所組合成的半導體元件處理裝置1B的示意圖,其採取與半導體元件處理裝置2A類似的設計組合。半導體元件處理裝置1B中的入料單元12(即震動盤入料單元)、處理單元32D(即定位單元)、以及出料單元22D (即捲帶出料單元)分別具有一用以運送空載盤的第二載移單元17、37D與27D,用以將空載盤回收而重新使用。Referring to FIG. 2A, the semiconductor element processing apparatus 1A is a charging unit 12 (ie, a vibrating tray feeding unit), a processing unit 32A (ie, a flipping unit), and a discharging unit in the semiconductor component processing apparatus 1 that is elastically combined. 22C (ie, the tray discharge unit) is a combination of a single feed unit, a processing unit, and a discharge unit. By connecting the two processing units to the positioning mechanisms 31A and 33A, respectively, the feeding unit of the feeding unit 12 (ie, the vibrating tray feeding unit) is coupled to the positioning mechanism 11 and the discharging unit 22C (ie, the tray discharging unit). The material unit joint positioning mechanism 21C is snap-fitted, and can be assembled into a desired semiconductor component processing apparatus 1A in a short time to complete the flipping process of the semiconductor component and the package conversion (that is, the semiconductor component is converted from bulk to carrier The semiconductor element processing apparatus 1A of the disk package). Please refer to FIG. 2B, which is a feeding unit 12 (ie, a vibrating tray feeding unit), a processing unit 32D (ie, a positioning unit), and a discharging unit 22D in the semiconductor component processing apparatus 2 of the elastic combination. A schematic view of a semiconductor element processing apparatus 1B assembled by a tape take-up unit, which adopts a design combination similar to that of the semiconductor element processing apparatus 2A. The feeding unit 12 (ie, the vibrating tray feeding unit), the processing unit 32D (ie, the positioning unit), and the discharging unit 22D (ie, the take-up and discharge unit) in the semiconductor component processing apparatus 1B respectively have one for carrying no load. The second loading units 17, 37D and 27D of the disc are used to recover the empty tray and reuse it.
再者,考量到入料單元的入料速度、處理單元的處理速度、以及出料單元的出料速度之間的落差可能所組成的半導體處理裝置無法連續進行處理而會有停滯(idle)的可能,所以本發明之半導體元件處理裝置也可以採取多個入料單元、單一處理單元、以及單一出料單元組裝的設計,多個出料單元、單一處理單元、以及與單一入料單元組裝的設計,多個處理單元、單一入料單元、以及單一出料單元組裝的設計,多個處理單元、多個入料單元、以及單一出料單元組裝的設計,多個處理單元、單一入料單元、以及多個出料單元組裝的設計,或是多個處理單元、多個入料單元、以及多個出料單元組裝的設計。第二C圖所示之半導體元件處理裝置1C即為選取彈性組合之半導體元件處理裝置1中的入料單元12 (即震動盤入料單元)、處理單元32B (即外觀檢查單元)、以及出料單元22C (即載盤出料單元)所組合成的多個入料單元、單一處理單元、以及單一出料單元組裝的設計。藉由兩個入料單元12(即震動盤入料單元)以交替輪流的方式輸送至處理單元32B (即外觀檢查單元)的輸送單元34B上,避免因某個或某些單元速度較快產生待料或停滯。雖然在本實施例中兩入料單元12皆為震動盤入料單元且彼此並聯,但是可以依照需求與空間限制,採取彼此串連的方式,增加入料單元的數量,以及依照入廠的半導體元件所採取的包裝種類,同時採用2種或多種不同入料模式的入料單元。Furthermore, considering that the difference between the feed rate of the feed unit, the processing speed of the processing unit, and the discharge speed of the discharge unit may not be continuously processed by the semiconductor processing apparatus, there may be an idling. It is possible that the semiconductor component processing apparatus of the present invention can also adopt a design in which a plurality of charging units, a single processing unit, and a single discharging unit are assembled, a plurality of discharging units, a single processing unit, and a single feeding unit. Design, multiple processing units, single feed unit, and single discharge unit assembly design, multiple processing units, multiple feed units, and single discharge unit assembly design, multiple processing units, single feed unit And the design of multiple discharge unit assembly, or the design of multiple processing units, multiple feeding units, and multiple discharge units. The semiconductor element processing apparatus 1C shown in FIG. 2C is a charging unit 12 (ie, a vibrating tray feeding unit), a processing unit 32B (ie, an appearance inspection unit), and a discharge unit in the semiconductor component processing apparatus 1 that is elastically combined. The design of a plurality of feed units, a single processing unit, and a single discharge unit assembled by the material unit 22C (ie, the tray discharge unit). The two feeding units 12 (ie, the vibrating tray feeding unit) are alternately rotated to the conveying unit 34B of the processing unit 32B (ie, the visual inspection unit) to avoid the speed of one or some units being relatively fast. Waiting or stagnating. Although in the present embodiment, the two feeding units 12 are vibrating tray feeding units and are connected in parallel with each other, they can be connected in series according to the requirements and space constraints, increasing the number of feeding units, and according to the semiconductors entering the factory. The type of packaging that the component takes, and two or more feeding units with different feeding modes.
第二D圖所示之半導體元件處理裝置1D為選取彈性組合之半導體元件處理裝置1中的入料單元12 (即震動盤入料單元)、處理單元32B (即外觀檢查單元)、以及出料單元22C (即載盤出料單元)所組合成的多個出料單元、單一處理單元、以及與單一入料單元組裝的設計。藉由處理單元32B (即外觀檢查單元)的輸送單元34B以交替輪流的方式,將載盤連同其上的半導體元件以交替輪流的方式,分別運送至2個出料單元22C (即載盤出料單元)各自的載移單元26A上,避免因各單元間的速度差異所產生的等待或停滯。雖然在本實施例中,兩出料單元22C 皆為載盤出料單元且彼此並聯的方式,但是可以依照需求與空間限制,採取彼此串連的方式,增加出料單元的數量,以及,同時採用2種或多種不同出料模式的出料單元。The semiconductor element processing apparatus 1D shown in FIG. 2D is a charging unit 12 (ie, a vibrating tray feeding unit), a processing unit 32B (ie, an appearance inspection unit), and a discharge unit in the semiconductor component processing apparatus 1 that is elastically combined. The unit 22C (ie, the tray discharge unit) combines a plurality of discharge units, a single processing unit, and a design assembled with a single feed unit. By means of the transport unit 34B of the processing unit 32B (ie, the visual inspection unit), the carrier and the semiconductor elements thereon are alternately alternately transported to the two discharge units 22C (ie, the trays are discharged in an alternate manner). The material unit) on each of the load-carrying units 26A avoids waiting or stagnation caused by the difference in speed between the units. Although in the present embodiment, the two discharge units 22C are all the tray discharge units and are connected in parallel with each other, the number of the discharge units can be increased in series according to the requirements and space constraints, and at the same time, A discharge unit with two or more different discharge modes.
第二E圖所示之半導體元件處理裝置1E即為選取彈性組合之半導體元件處理裝置2中的入料單元12 (即震動盤入料單元)、處理單元32B (即外觀檢查單元)、處理單元32C(轉換單元)、以及出料單元22C (即載盤出料單元)所組合成的多個處理單元、單一入料單元、以及單一出料單元組裝的設計。藉由此一設計,可以統一於同一裝置上進行多種處理並且完成包裝轉換。當然考量到各個單元之間的速度差異,也可以採取如多個入料單元的設計,例如第二F圖所示選取彈性組合之半導體元件處理裝置1中的入料單元12 (即震動盤入料單元)、處理單元32B (即外觀檢查單元)、處理單元32C(轉換單元)、以及出料單元22C (即載盤出料單元)所組合成的半導體元件處理裝置1F,或是多個出料單元的設計,例如第二G圖所示選取彈性組合之半導體元件處理裝置1中的入料單元12 (即震動盤入料單元)、處理單元32B (即外觀檢查單元)、處理單元32C(轉換單元)、以及出料單元22C (即載盤出料單元)半導體元件處理裝置所組合成的半導體元件處理裝置1G。當然,在上述設計中,也可採用多個不同的入料單元的設計,或是多個不同的出料單元的設計。藉此,可統一於同一半導體元件處理裝置中完成多種包裝轉換與多種處理。The semiconductor element processing apparatus 1E shown in FIG. E is a feeding unit 12 (ie, a vibrating tray feeding unit), a processing unit 32B (ie, an appearance inspection unit), and a processing unit in the semiconductor component processing apparatus 2 that is elastically combined. 32C (conversion unit), and a design of a plurality of processing units, a single feeding unit, and a single discharging unit assembled by the discharging unit 22C (ie, the tray discharging unit). With this design, multiple processes can be performed on the same device and package conversion can be completed. Of course, considering the difference in speed between the various units, it is also possible to adopt a design such as a plurality of feeding units, for example, the feeding unit 12 in the semiconductor component processing apparatus 1 of the elastic combination is selected as shown in the second F diagram (ie, the vibration input a semiconductor unit processing apparatus 1F in which a processing unit 32B (ie, an appearance inspection unit), a processing unit 32C (conversion unit), and a discharge unit 22C (ie, a tray discharge unit) are combined, or a plurality of The design of the material unit, for example, the feeding unit 12 (ie, the vibrating tray feeding unit), the processing unit 32B (ie, the visual inspection unit), and the processing unit 32C in the semiconductor component processing apparatus 1 of the elastic combination are selected as shown in FIG. The conversion unit) and the discharge unit 22C (that is, the tray discharge unit) are semiconductor element processing apparatuses 1G in which the semiconductor element processing apparatuses are combined. Of course, in the above design, a plurality of different feeding unit designs or a plurality of different discharging unit designs may be employed. Thereby, a plurality of package conversions and various processes can be performed in the same semiconductor component processing apparatus.
上述各個實施例之半導體元件處理裝置1A~1G中的入料單元、處理單元、以及出料單元,都可以分別以第一圖所示之彈性組合之半導體元件處理裝置1中的進料模組10的任一入料單元、處理模組30中的任一處理單元、以及出料模組20中的任一出料單元單元取代,從而彈性地組裝成各種不同的入料模式、處理模式、以及出料模式組合的半導體元件處理裝置,以因應各種不同的半導體元件包裝轉換以及處理流程的需求。另外,上述各個實施例之半導體元件處理裝置1A~1G都可以採取與第二B圖所示之半導體元件處理裝置2B相似的設計,而入料單元、處理單元、以及出料單元中都設置有第二載移單元,從而在上述各個實施例之半導體元件處理裝置1A~1G中組成一將空載盤由出料單元運送回入料單元而進行再利用的空盤運送機構。The feeding unit, the processing unit, and the discharging unit in the semiconductor element processing apparatuses 1A to 1G of the above-described respective embodiments may each be a feeding module in the semiconductor component processing apparatus 1 of the elastic combination shown in the first figure. Any one of the feeding units, any one of the processing modules 30, and one of the discharging units 20 of the discharging module 20 are replaced, thereby being elastically assembled into various feeding modes, processing modes, And a semiconductor component processing apparatus in combination with a discharge mode to meet the needs of various semiconductor component package conversion and processing flows. In addition, the semiconductor element processing apparatuses 1A to 1G of the above-described respective embodiments may adopt a design similar to that of the semiconductor element processing apparatus 2B shown in FIG. 2B, and the feeding unit, the processing unit, and the discharging unit are provided with The second carrier unit constitutes an empty disk transport mechanism for transporting the empty tray from the discharge unit back to the feed unit for reuse in the semiconductor element processing apparatuses 1A to 1G of the above-described respective embodiments.
根據上述實施例,本發明之彈性組合之半導體元件處理裝置1可以依照半導體元件進廠的包裝形式(或種類),所需要的處理需求或流程、以及半導體元件出廠的包裝形式(或種類),自由地選取具有符合客戶所提供的半導體元件的包裝形式(或種類)的入料單元、可以實施所需要處理流程的處理單元、以及符合客戶所要求的半導體元件的包裝形式(或種類)的出料單元,並藉由卡扣結合或是其他簡單的搭接方式輕易且快速地組裝成各種具有不同包裝模式、處理模式、以及出料模式的半導體元件處理裝置,即具有不同轉換功能與處理功能的半導體元件處理裝置。藉由此半導體元件處理裝置可以統一於其上各種半導體元件包裝的轉換以及對半導體元件的處理,所以不需要購置各種不同包裝轉換功能的半導體元件轉換裝置(即半導體元件處理裝置)備用,以及不需要購置各種不同處理功能的即半導體元件處理裝置備用,以因應客戶所要求的各種包裝轉換與處理流程的需求,所以可以省下因需購置各種不同包裝轉換功能的半導體元件轉換裝置(即半導體元件處理裝置)以及各種不同處理功能的即半導體元件處理裝置所增加的成本,以及因某些半導體元件處理裝置使用頻率不高所造成的浪費,從而節省轉換(或處理)流程的成本與時間,並縮短半導體元件在測試廠內的時間,而可以達到快速出貨的目的。According to the above embodiment, the elastic component semiconductor device processing apparatus 1 of the present invention can be in accordance with the packaging form (or type) of the semiconductor component, the required processing requirements or flow, and the packaging form (or type) of the semiconductor component. Freely selecting a feeding unit having a packaging form (or type) conforming to the semiconductor component provided by the customer, a processing unit capable of implementing the required processing flow, and a packaging form (or type) of the semiconductor component required to meet the customer's requirements The material unit is easily and quickly assembled into various semiconductor component processing devices having different packaging modes, processing modes, and discharging modes by snap-in or other simple bonding methods, that is, having different conversion functions and processing functions. Semiconductor component processing device. By this semiconductor device processing apparatus, it is possible to unify the conversion of various semiconductor element packages thereon and the processing of the semiconductor elements, so that it is not necessary to purchase semiconductor element conversion devices (ie, semiconductor element processing devices) of various package conversion functions, and It is necessary to purchase a variety of different processing functions, that is, a semiconductor component processing device, in order to meet various packaging conversion and processing requirements required by the customer, thereby saving the semiconductor component conversion device (ie, semiconductor component) for purchasing various packaging conversion functions. The cost of the processing device) and the various processing functions, ie, the semiconductor component processing device, and the waste caused by the low frequency of use of some semiconductor component processing devices, thereby saving the cost and time of the conversion (or processing) process, and Shorten the time of semiconductor components in the test plant, and achieve the purpose of fast shipment.
另外,本發明也提供一種彈性組合之半導體元件分類測試系統。參照第三圖,其為一彈性組合之半導體元件分類測試系統2的示意圖。彈性組合之半導體元件分類測試系統2包含一用以輸入半導體元件的進料模組10、一用以對半導體元件進行測試的測試模組40、以及一用以輸出半導體元件的出料模組20,而由進料模組10、測試模組40、以及出料模組20所組成。測試模組40包含數種不同種類的測試單元42~42E,意即測試單元42~42E具有不同的測試功能(或是測試模式)。舉例來說,測試單元42~42E可以分別為電性測試單元、射頻測試單元(RF tester)、直線往復測試單元、翻轉測試單元以及旋轉測試單元等動態測試單元,但是並不以上述測試單元的種類與序列為限,而是可以依照需求任意增減測試單元的種類以及變更序列。In addition, the present invention also provides an elastic combination semiconductor component classification test system. Referring to the third figure, it is a schematic diagram of a flexible combination of semiconductor component classification test system 2. The flexible combination semiconductor component classification test system 2 includes a feed module 10 for inputting semiconductor components, a test module 40 for testing semiconductor components, and a discharge module 20 for outputting semiconductor components. The utility model is composed of a feeding module 10, a testing module 40, and a discharging module 20. The test module 40 includes several different types of test units 42-42E, meaning that the test units 42-42E have different test functions (or test modes). For example, the test units 42 to 42E may be dynamic test units such as an electrical test unit, a radio frequency test unit (RF tester), a linear reciprocating test unit, a flip test unit, and a rotary test unit, but are not the above test units. The type and sequence are limited, but the type of the test unit and the sequence of changes can be arbitrarily increased or decreased according to requirements.
如第三圖所示,每一測試單元42~42E都為一獨立且分離的個體,且每一測試單元42~42E皆具有一用以傳送半導體元件與載盤的輸送單元44~44E以及至少二測試單元連結定位機構41與43~41E與43E。藉此,可以輕易地將一測試單元42~42E與任一入料單元12~12E以及任一出料單元22~22E快速地組裝成各種不同進料模式、測試模式(或功能)、以及出料模式組合的半導體元件分類測試系統。As shown in the third figure, each of the test units 42-42E is an independent and separate individual, and each of the test units 42-42E has a transport unit 44-44E for transporting the semiconductor component and the carrier, and at least The two test units are coupled to the positioning mechanism 41 and 43 to 41E and 43E. Thereby, a test unit 42~42E and any of the feeding units 12~12E and any of the discharging units 22~22E can be quickly assembled into various feeding modes, test modes (or functions), and Semiconductor component classification test system with material mode combination.
在這些測試單元42~42E中,若可以載盤直接做為進行測試流程時的半導體元件載具,例如直線往復測試、翻轉測試以及旋轉測試等測試流程,其測試單元的輸送單元(例如測試單元42B~42E之輸送單元44B~44E)則可直接採用一用以運送載盤的單元,直接運送已裝載有半導體元件的載盤進行測試,不需要進行半導體的拾取與放置。在這些測試單元42~42E中,若是無法以載盤直接做為進行處理流程時的半導體元件載具(例如測試單元42、42A),其輸送單元(例如測試單元42、42A之輸送單元44、44A)則會包含至少一用以輸送載盤的載移單元(例如載移單元46、46A)以及一用以將半導體元件由載盤中取出而放置於該測試單元上進行測試的拾取單元(例如拾取單元48、48A),藉此進行半導體元件的取放與載盤的運送。雖然,第三圖所示之半導體元件分類測試系統是用於測試流程,而第一圖所示之半導體元件處理裝置,但兩者的運作方式相類似,於此不再贅述,但是第三圖所示之半導體元件分類測試系統會在半導體元件運送到出料單元時,出料單元會依照測試的結果對半導體元件進行分類,再進行包裝。以下第四A圖至第四G圖將舉出第三圖所示之彈性組合之半導體元件分類測試系統2所能組合的半導體元件分類測試系統的各種實施例,但是並不以此為限,而是可以依照需求任意變更各個實施例中所選取的入料單元的種類與數量、測試單元的種類與數量、以及出料單元的種類與數量。In these test units 42 to 42E, if the carrier can be directly used as a semiconductor component carrier during the test flow, such as a linear reciprocating test, a flip test, and a rotation test, the test unit's transport unit (for example, a test unit) The transport units 44B-44E) of 42B~42E can directly carry the test plate for carrying the carrier, and directly carry the carrier loaded with the semiconductor component for testing, without the need for semiconductor pick-and-place. In these test units 42 to 42E, if the carrier is not directly used as the semiconductor component carrier (for example, the test unit 42, 42A), the transport unit (for example, the transport unit 44 of the test unit 42, 42A, 44A) will include at least one carrier unit (eg, carrier unit 46, 46A) for transporting the carrier and a pick-up unit for placing the semiconductor component on the test unit for testing on the test unit ( For example, the pickup unit 48, 48A) is used to carry out the pick-and-place of the semiconductor element and the transport of the carrier. Although the semiconductor component classification test system shown in the third figure is used for the test flow, and the semiconductor component processing apparatus shown in the first figure, the operation modes of the two are similar, and will not be described again, but the third diagram The semiconductor component classification test system shown will classify the semiconductor components according to the test results and then package them when the semiconductor components are transported to the discharge unit. 4A to 4G, the various embodiments of the semiconductor component classification test system that can be combined by the elastic combination semiconductor component classification test system 2 shown in the third figure are exemplified, but are not limited thereto. Rather, the type and quantity of the feeding unit selected in each embodiment, the type and quantity of the testing unit, and the type and quantity of the discharging unit can be arbitrarily changed according to requirements.
參照第四A圖,半導體元件分類測試系統2A選取彈性組合之半導體元件分類測試系統2中的入料單元12B(即載管入料單元)、測試單元42 (即電性測試單元)、以及出料單元22C (即載盤出料單元)所組合成的採取一入料單元、一測試單元、以及一出料單元的設計組合。藉由將二測試單元連結定位機構41與43,分別與入料單元12B(即載管入料單元)的入料單元連結定位機構11B以及出料單元22C (即載盤出料單元)的出料單元連結定位機構21C卡扣結合,而可以輕易地在短時間(例如10分鐘或更短的時間)內組裝成可以統一於其上完成對半導體元件的電性測試以及包裝轉換(即半導體元件由散裝轉換成載盤包裝)的半導體元件分類測試系統2A。參照第四B圖,其為選取彈性組合之半導體元件分類測試系統2中的入料單元12B(即載管入料單元)、測試單元42 (即電性測試單元)、以及出料單元22C (即載盤出料單元)所組合成的半導體元件分類測試系統2B的示意圖,其採用與第四A圖所示之半導體元件分類測試系統2A相似的設計組合,。半導體元件分類測試系統2B的入料單元12B(即載管入料單元)、測試單元42 (即電性測試單元)、以及出料單元22C (即載盤出料單元)分別都具有一第二載移單元17B、第二載移單元47、以及第二載移單元27C,從而組成一用以將空載盤由出料單元22C (即載盤出料單元)傳回入料單元12B(即載管入料單元)的第二載移單元17B的空載盤運送機構。Referring to FIG. 4A, the semiconductor component classification test system 2A selects the feeding unit 12B (ie, the carrier feeding unit), the testing unit 42 (ie, the electrical testing unit), and the out-of-load in the semiconductor component classification test system 2 of the elastic combination. The material unit 22C (ie, the tray discharge unit) is combined to adopt a design combination of a feeding unit, a testing unit, and a discharging unit. By connecting the two test units to the positioning mechanisms 41 and 43, respectively, the feeding unit of the feeding unit 12B (ie, the carrier feeding unit) is coupled to the positioning mechanism 11B and the discharging unit 22C (ie, the tray discharging unit). The material unit joint positioning mechanism 21C is snap-fitted, and can be easily assembled in a short time (for example, 10 minutes or less) to perform electrical testing on the semiconductor element and package conversion (ie, semiconductor component). The semiconductor element classification test system 2A is converted into a carrier package by bulk. Referring to FIG. 4B, it is a feeding unit 12B (ie, a carrier feeding unit), a testing unit 42 (ie, an electrical testing unit), and a discharging unit 22C in the semiconductor component classification test system 2 of the elastic combination. That is, a schematic diagram of the semiconductor element classification test system 2B combined by the carrier discharge unit, which employs a design combination similar to that of the semiconductor element classification test system 2A shown in FIG. The feeding unit 12B (ie, the carrier feeding unit), the testing unit 42 (ie, the electrical testing unit), and the discharging unit 22C (ie, the tray discharging unit) of the semiconductor component sorting test system 2B each have a second The loading unit 17B, the second loading unit 47, and the second loading unit 27C are configured to pass the empty tray from the discharging unit 22C (ie, the tray discharging unit) back to the feeding unit 12B (ie, The empty tray transport mechanism of the second load carrying unit 17B of the carrier feed unit.
再者,考量到入料單元的入料速度、測試單元的處測試速度、以及出料單元的出料速度之間的落差可能所組成的半導體元件分類測試系統無法連續進行測試而會有停滯(idle)的可能,所以本發明之半導體元件處理裝置也可以採取多個入料單元、單一測試單元、以及單一出料單元組裝的設計,例如第四C圖所示之選取彈性組合之半導體元件分類測試系統2中的入料單元12B(即載管入料單元)、測試單元42 (即電性測試單元)、以及出料單元22D (即捲帶出料單元)所組合成的半導體元件分類測試系統2C,多個出料單元、單一測試單元、以及與單一入料單元組裝的設計,例如第四D圖所示之取彈性組合之半導體元件分類測試系統2中的入料單元12B(即載管入料單元)、測試單元42 (即電性測試單元)、以及出料單元22D (即捲帶出料單元)所組合成的半導體元件分類測試系統2D,多個測試單元、單一入料單元、以及單一出料單元組裝的設計,例如第四E圖所示之選取彈性組合之半導體元件分類測試系統2中的入料單元12B(即載管入料單元)、測試單元42 (即電性測試單元)、測試單元42A(射頻測試單元)、以及出料單元22D (即捲帶出料單元)組裝而成所組合成的半導體元件分類測試系統2E,多個測試單元、多個入料單元、以及單一出料單元組裝的設計,例如第四F圖所示之選取彈性組合之半導體元件分類測試系統2中的入料單元12B(即載管入料單元)、測試單元42 (即電性測試單元)、測試單元42A(射頻測試單元)、以及出料單元22D (即捲帶出料單元)所組合成的半導體元件分類測試系統2F,多個測試單元、單一入料單元、以及多個出料單元組裝的設計,例如第四G圖所示之選取彈性組合之半導體元件分類測試系統2中的入料單元12B(即載管入料單元)、測試單元42 (即電性測試單元)、測試單元42A(射頻測試單元)、以及出料單元22D (即捲帶出料單元)所組合成的半導體元件分類測試系統2G,或是多個測試單元、多個入料單元、以及多個出料單元組裝的設計。這些半導體元件分類測試系統2C-2G與第二C-G圖所示之半導體元件處理裝置1C-1G具有類似的結構與運作方式,且可以採取類似的組裝設計,只需要將半導體元件處理裝置1C-1G中的處理單元改以測試單元取代就可以了,所以對於這些部分不再贅述,兩者在運作方式的不同處也已於第三圖的相關說明中詳述,所同樣於此不再贅述。Furthermore, considering the drop between the feed rate of the feed unit, the test speed of the test unit, and the discharge speed of the discharge unit, the semiconductor component classification test system may not be continuously tested and may be stagnant ( Idle), so the semiconductor component processing apparatus of the present invention can also adopt a design in which a plurality of feeding units, a single testing unit, and a single discharging unit are assembled, for example, the semiconductor component classification of the selected elastic combination shown in FIG. Semiconductor component classification test of the combination of the feeding unit 12B (ie, the carrier feeding unit), the testing unit 42 (ie, the electrical testing unit), and the discharging unit 22D (ie, the tape discharging unit) in the test system 2 System 2C, a plurality of discharge units, a single test unit, and a design assembled with a single feed unit, such as the feed unit 12B in the semiconductor component classification test system 2 of the elastic combination shown in FIG. 4D (ie, The semiconductor component classification test system 2D combined with the tube feeding unit), the testing unit 42 (ie, the electrical testing unit), and the discharging unit 22D (ie, the tape discharging unit), a test unit, a single feed unit, and a single discharge unit assembly design, such as the feed unit 12B (ie, the load tube feed unit) in the semiconductor component classification test system 2 of the selected elastic combination shown in FIG. The test unit 42 (ie, the electrical test unit), the test unit 42A (radio frequency test unit), and the discharge unit 22D (ie, the tape take-up unit) are assembled into a combined semiconductor component classification test system 2E, multiple The design of the test unit, the plurality of feed units, and the single discharge unit assembly, such as the feed unit 12B (ie, the load tube feed unit) in the semiconductor component classification test system 2 of the selected elastic combination shown in FIG. , a test unit 42 (ie, an electrical test unit), a test unit 42A (radio frequency test unit), and a discharge unit 22D (ie, a tape take-up unit) are combined into a semiconductor component classification test system 2F, a plurality of test units, The design of the single feeding unit and the assembly of the plurality of discharging units, for example, the feeding unit 12B (ie, the feeding unit) of the semiconductor component classification test system 2 of the selected elastic combination shown in FIG. Unit 42 (ie, electrical test unit), test unit 42A (radio frequency test unit), and discharge unit 22D (ie, take-up and discharge unit) are combined into a semiconductor component classification test system 2G, or a plurality of test units, Design of multiple feed units and multiple discharge units assembled. These semiconductor element classification test systems 2C-2G have similar structures and operation modes as the semiconductor element processing apparatuses 1C-1G shown in the second CG diagram, and can adopt a similar assembly design, and only need to process the semiconductor element processing apparatus 1C-1G. The processing unit in the process can be replaced by the test unit, so these parts will not be described again. The difference between the two modes of operation is also detailed in the related description of the third figure, and will not be repeated here.
上述各個實施例之半導體元件分類測試系統2A~2G中的入料單元、測試單元、以及出料單元,都可以分別以第三圖所示之彈性組合之半導體元件分類測試系統2中的進料模組10的任一入料單元、測試模組40中的任一測試單元、以及出料模組20中的任一出料單元單元取代,從而彈性地組裝成各種不同的入料模式、測試模式、以及出料模式組合的半導體元件分類測試系統,以因應各種不同的半導體元件包裝轉換以及測試的需求。另外,上述各個實施例之半導體元件分類測試系統2A~2G都可以採取與第四B圖所示之半導體元件分類測試系統2B相似的設計,而載入料單元、測試單元、以及出料單元中都設置有第二載移單元,從而在上述各個實施例之半導體元件分類測試系統2A~2G中組成一將空載盤由出料單元運送回入料單元而進行再利用的空盤運送機構。在上述實施例中用以運送載盤的載移單元與輸送單元,以及用以運送空載盤的第二載移單元,可以採用可以運送載盤或空載盤的運載軌道、運載平台、或是其他可以運送載盤或空載盤的機構。The feeding unit, the testing unit, and the discharging unit in the semiconductor component sorting test systems 2A to 2G of the above respective embodiments can respectively classify the feeding in the test system 2 by the elastic combination of the semiconductor elements shown in the third figure. Any one of the feeding unit of the module 10, any one of the testing modules 40, and one of the discharging unit 20 is replaced, so as to be elastically assembled into various feeding modes and tested. A semiconductor component classification test system combining mode and discharge mode to meet the needs of various semiconductor component package conversion and testing. In addition, the semiconductor element classification test systems 2A to 2G of the above respective embodiments may adopt a design similar to the semiconductor element classification test system 2B shown in FIG. 4B, and are loaded into the material unit, the test unit, and the discharge unit. Each of the semiconductor element sorting test systems 2A to 2G of each of the above-described embodiments constitutes an empty disc transport mechanism that transports the empty tray from the discharge unit back to the feed unit for reuse. In the above embodiment, the loading unit and the transport unit for transporting the carrier, and the second loading unit for transporting the empty tray, may be carried by a carrier rail, a carrier platform, or a transport platform capable of transporting the carrier or the empty carrier. It is another mechanism that can transport pallets or empty pallets.
根據上述實施例,本發明之彈性組合之半導體元件分類測試系統2可以依照客戶所提供的半導體元件的包裝形式(或種類),即半導體元件進廠的包裝形式(或種類),所需要的測試需求或流程、以及客戶所要求的半導體元件的包裝形式(或種類),即半導體元件出廠的包裝形式(或種類),自由地選取具有符合客戶所提供的半導體元件的包裝形式(或種類)的入料單元、可以實施所需要測試流程的測試單元、以及符合客戶所要求的半導體元件的包裝形式(或種類)的出料單元,並藉由卡扣結合或是其他簡單的搭接方式輕易且快速地組裝成各種具有不同包裝模式、測試模式、以及出料模式的半導體元件分類測試系統,即具有不同轉換功能與處理功能的半導體元件分類測試系統。藉由此半導體元件分類測試系統可以統一於其上各種半導體元件包裝的轉換以及對半導體元件的測試,所以不但不需要購置各種不同包裝轉換功能的半導體元件轉換裝置(即半導體元件處理裝置)備用,以及不需要購置各種不同處理功能的即半導體元件處理裝置備用,以因應客戶所要求的各種包裝轉換與處理流程的需求,更不需要不需要以人工或機械將半導體元件運送至測試機台與轉換裝置(或處理裝置),所以可以省下因需購置各種不同包裝轉換功能的半導體元件轉換裝置(即半導體元件處理裝置)以及各種不同處理功能的即半導體元件處理裝置所增加的成本,以及因某些半導體元件處理裝置使用頻率不高所造成的浪費,並且減少半導體元件在不同的機台間轉移所需耗費的時間,從而節省轉換(或處理)流程的成本與時間,並縮短半導體元件在測試廠內的時間,而可以達到快速出貨的目的。According to the above embodiment, the elastic component semiconductor component classification test system 2 of the present invention can be tested according to the package form (or type) of the semiconductor component provided by the customer, that is, the package form (or type) of the semiconductor component into the factory. The requirements or processes, and the packaging form (or type) of the semiconductor components required by the customer, that is, the packaging form (or type) of the semiconductor component, are freely selected to have a packaging form (or type) conforming to the semiconductor component provided by the customer. The feeding unit, the testing unit that can implement the required testing process, and the discharging unit of the packaging form (or type) of the semiconductor component required by the customer, and are easily combined by snapping or other simple bonding methods. Quickly assembled into various semiconductor component classification test systems with different packaging modes, test modes, and discharge modes, that is, semiconductor component classification test systems having different conversion functions and processing functions. The semiconductor component classification test system can unify the conversion of various semiconductor component packages and the testing of the semiconductor components thereon, so that it is not necessary to purchase semiconductor component conversion devices (ie, semiconductor component processing devices) of various package conversion functions. And the semiconductor component processing device that does not need to purchase various processing functions is spared, in order to meet the requirements of various packaging conversion and processing processes required by the customer, and does not need to manually or mechanically transport the semiconductor components to the testing machine and convert Since the device (or the processing device) can save the cost of the semiconductor component conversion device (ie, the semiconductor component processing device) that purchases various package conversion functions and the semiconductor component processing device of various processing functions, and These semiconductor component processing devices use waste caused by low frequency, and reduce the time required for semiconductor components to transfer between different machines, thereby saving the cost and time of the conversion (or processing) process and shortening the testing of semiconductor components. In-plant Room, and you can achieve rapid shipment.
本發明更提供一種兼具包裝轉換、其他處理功能(例如加熱、翻面、外觀檢查、轉換、定位、分類、雷射標籤、標籤檢視等)、以及測試功能的彈性組合之半導體元件分類測試系統。參照第五圖,其為一可以同時兼具包裝轉換、處理功能、以及測試功能的彈性組合之半導體元件分類測試系統3的示意圖。彈性組合之半導體元件分類測試系統3包含一用以輸入半導體元件的進料模組10、一用以對半導體元件進行處理的處理模組30、一用以對半導體元件進行測試的測試模組40、以及一用以輸出半導體元件的出料模組20,而由進料模組10、處理模組30、測試模組40、以及出料模組20所組成。彈性組合之半導體元件分類測試系統3所使用的進料模組10處理模組30、測試模組40、以及與前文各個實施例所揭示的進料模組、處理模組、測試模組、以及出料模組相同,所以於此不再贅述。The invention further provides a semiconductor component classification test system which combines packaging conversion, other processing functions (such as heating, flipping, visual inspection, conversion, positioning, classification, laser labeling, label inspection, etc.) and elastic combination of testing functions. . Referring to the fifth figure, it is a schematic diagram of a semiconductor component classification test system 3 which can simultaneously combine the packaging conversion, the processing function, and the elastic combination of the test functions. The flexible combination semiconductor component classification test system 3 includes a feed module 10 for inputting a semiconductor component, a processing module 30 for processing the semiconductor component, and a test module 40 for testing the semiconductor component. And a discharge module 20 for outputting a semiconductor component, and comprising a feed module 10, a processing module 30, a test module 40, and a discharge module 20. The processing module 10, the test module 40, and the feed module, processing module, test module, and the same as disclosed in the foregoing embodiments are used in the flexible component semiconductor component classification test system 3 The discharging module is the same, so it will not be described here.
如第五圖所示,使用者可以依照半導體元件進廠的包裝形式(或種類),自由地由進料模組10選取相應的入料單元,依照半導體元件所需要的處理流程,而自由地由處理模組30相應的處理單元,依照半導體元件所需要的測試,而自由地由測試模組40相應的測試單元,依照客戶所要求的半導體元件的包裝形式(或種類),自由地由出料模組20相應的出料單元,並藉由入料單元的入料單元連結定位機構、處理單元的二處理單元連結定位機構、測試單元的二測試理單元連結定位機構、以及出料單元的出料單元連結定位機構,而將四者輕易且快速地卡扣結合,而組合成一可以於統一於其上實施半導體元件包裝轉換、半導體元件處理流程、以及半導體元件測試流程的半導體元件分類測試系統,使得可以於統一於一半導體元件分類測試系統自動化地實施半導體元件包裝轉換、半導體元件處理流程、以及半導體元件測試流程。以下第六A圖至第六F圖將舉出第五圖所示之彈性組合之半導體元件分類測試系統3所能組合的半導體元件分類測試系統的各種實施例,但是並不以此為限,而是可以依照需求任意變更各個實施例中所選取的入料單元的種類與數量、處理單元的種類與數量、測試單元的種類與數量、以及出料單元的種類與數量。As shown in the fifth figure, the user can freely select the corresponding feeding unit from the feeding module 10 according to the packaging form (or type) of the semiconductor component entering the factory, and freely according to the processing flow required by the semiconductor component. The corresponding processing unit of the processing module 30 is freely available from the corresponding test unit of the test module 40 according to the test required by the semiconductor component, according to the packaging form (or type) of the semiconductor component required by the customer. The corresponding discharging unit of the material module 20 is connected to the positioning mechanism by the feeding unit of the feeding unit, the two processing unit connecting positioning mechanism of the processing unit, the two testing unit connecting positioning mechanism of the testing unit, and the discharging unit. The discharging unit is coupled with the positioning mechanism, and the four are easily and quickly snap-fitted, and combined into a semiconductor component classification test system capable of performing semiconductor component package conversion, semiconductor component processing flow, and semiconductor component testing process unified thereon. , enabling automated implementation of semiconductor component packaging in a unified semiconductor component classification test system In other words, the process flow of the semiconductor element, and a semiconductor device testing process. 6 to 6 F show various embodiments of the semiconductor component classification test system that can be combined by the elastic combination semiconductor component classification test system 3 shown in FIG. 5, but are not limited thereto. Rather, the type and quantity of the feeding unit selected in each embodiment, the type and quantity of the processing unit, the type and quantity of the testing unit, and the type and quantity of the discharging unit can be arbitrarily changed according to requirements.
參照第六A圖,其為選取彈性組合之半導體元件分類測試系統3中的入料單元12B(即載管入料單元)、處理單元32(即加熱試單元)、測試單元42 (即電性測試單元)、以及出料單元22C (即載盤出料單元)所組合成的半導體元件分類測試系統3A的示意圖。藉由將入料單元連結定位機構11B、二處理單元連結定位機構31與33、二測試單元連結定位機構41與43、以及出料單元連結定位機構21C相互卡扣結合,而可以輕易地在短時間(例如10分鐘或更短的時間)內組裝成半導體元件分類測試系統3A。入料單元12B(即載管入料單元)、處理單元32(即加熱試單元)、測試單元42 (即電性測試單元)、以及出料單元22C (即載盤出料單元)等的運作方式以於前文說明,於此不再贅述。藉此,可以於半導體元件分類測試系統3A統一完成對半導體元件的、處理流程、測試、以及包裝轉換(即半導體元件由載管包裝轉換成載盤包裝)。第六B圖所示之半導體元件分類測試系統3B與半導體元件分類測試系統3A採用相似的組成設計,但是,半導體元件分類測試系統3B的入料單元12B(即載管入料單元)、處理單元32(即加熱試單元)、測試單元42 (即電性測試單元)、以及出料單元22C (即載盤出料單元)分別都具有一第二載移單元17B、第二載移單元37、第二載移單元47、以及第二載移單元27C,所以可以將空載盤由出料單元22C (即載盤出料單元)傳送回入料單元12B(即載管入料單元)的第二載移單元17B,而重新使用。另外,也可依照需求而改採將處理單元設置於測試單元之後(即處理單元設置於測試單元與出料單元之間)的設計,例如第六C圖所示之選取性組合之半導體元件分類測試系統3中的入料單元12B(即載管入料單元)、測試單元42 (即電性測試單元)、處理單元32B(即外觀檢查單元)、以及出料單元22C (即載盤出料單元)所組合成的半導體元件分類測試系統3C。Referring to FIG. 6A, the charging unit 12B (ie, the carrier feeding unit), the processing unit 32 (ie, the heating unit), and the testing unit 42 (ie, electrical) in the semiconductor component classification test system 3 of the elastic combination are selected. A schematic diagram of a semiconductor component classification test system 3A in which a test unit) and a discharge unit 22C (ie, a tray discharge unit) are combined. By snapping the feeding unit coupling positioning mechanism 11B, the two processing unit coupling positioning mechanisms 31 and 33, the two testing unit coupling positioning mechanisms 41 and 43 , and the discharging unit coupling positioning mechanism 21C, it is easy to be short. The semiconductor component classification test system 3A is assembled in time (for example, 10 minutes or less). Operation of the feeding unit 12B (ie, the tube feeding unit), the processing unit 32 (ie, the heating unit), the testing unit 42 (ie, the electrical testing unit), and the discharging unit 22C (ie, the tray discharging unit) The method is as described above and will not be described here. Thereby, the processing flow, the test, and the package conversion of the semiconductor element can be uniformly performed in the semiconductor element classification test system 3A (that is, the semiconductor element is converted into a carrier package by the carrier package). The semiconductor component classification test system 3B shown in FIG. 6B and the semiconductor component classification test system 3A adopt a similar composition design, but the charging unit 12B (ie, the carrier feeding unit) of the semiconductor component classification test system 3B, and the processing unit 32 (ie, heating test unit), test unit 42 (ie, electrical test unit), and discharge unit 22C (ie, tray discharge unit) respectively have a second load unit 17B, a second load unit 37, The second loading unit 47 and the second loading unit 27C, so that the empty tray can be transported back to the feeding unit 12B (ie, the carrier feeding unit) by the discharging unit 22C (ie, the tray discharging unit). The second loading unit 17B is reused. In addition, the design of the semiconductor unit after the processing unit is disposed after the test unit (ie, the processing unit is disposed between the test unit and the discharge unit) may be modified according to requirements. For example, the semiconductor component classification of the selective combination shown in FIG. Feed unit 12B (ie, tube feed unit), test unit 42 (ie, electrical test unit), processing unit 32B (ie, visual inspection unit), and discharge unit 22C in test system 3 (ie, tray discharge) Unit) The semiconductor component classification test system 3C combined.
再者,考量到入料單元的入料速度、處理單元的處理速度、測試單元的測試速度、以及出料單元的出料速度之間的落差可能所組成的半導體處理單元無法連續進行處理而會有停滯(idle)的可能,以及考量到結合各種需求,所以本發明之半導體元件分類測試系統也可以採取多個半導體處理單元、單一半導體入料單元、單一測試單元、以及單一出料單元組裝的設計,例如第六D圖所示之選取彈性組合之半導體元件分類測試系統3中的入料單元12B(即載管入料單元)、處理單元32(即加熱試單元)、測試單元42 (即電性測試單元)、處理單元32B(即外觀檢查單元)、以及出料單元22C (即載盤出料單元)所組合成的半導體元件分類測試系統3D;多個入料單元、單一處理單元、單一測試單元、以及單一出料單元組裝的設計,例如六E圖所示之選取彈性組合之半導體元件分類測試系統4中的入料單元12B(即載管入料單元)、處理單元32(即加熱試單元)、測試單元42 (即電性測試單元)、以及出料單元22C (即載盤出料單元)所組合成的半導體元件分類測試系統3E,多個出料單元、單一處理單元、單一測試單元、以及與單一入料單元組裝的設計,例如第六F圖所示之選取彈性組合之半導體元件分類測試系統3中的入料單元12B(即載管入料單元)、處理單元32(即加熱試單元)、測試單元42 (即電性測試單元)、以及出料單元22C (即載盤出料單元)所組合成的半導體元件分類測試系統3F,或是各種數量的出料單元、各種數量的處理單元、各種數量的測試單元、以及與各種數量的入料單元搭配組合的組裝設計,其中,這些半導體元件分類測試系統中的各個組成單元的搭接方式與運作方式與前文所示實施例相似,所於此不再贅述。藉此,可以統一於半導體元件分類測試系統上完成對半導體元件的、測試、處理流程、以及包裝轉換。在彈性組合之半導體元件分類測試系統3所組合成的半導體元件分類測試系統中,可以同時採用2個或多個具有相同或不同入料模式的入料單元的組合以及2個或多個具有相同或不同出料模式的出料單元的組合搭接於複數個測試單元的設計。Furthermore, considering the drop between the feed rate of the feed unit, the processing speed of the processing unit, the test speed of the test unit, and the discharge speed of the discharge unit, the semiconductor processing unit may not be processed continuously. The possibility of having an idle, and considering various combinations of requirements, the semiconductor component classification test system of the present invention can also be assembled by a plurality of semiconductor processing units, a single semiconductor charging unit, a single test unit, and a single discharge unit. Design, for example, the feeding unit 12B (ie, the carrier feeding unit), the processing unit 32 (ie, the heating unit), and the testing unit 42 in the semiconductor component classification test system 3 of the selected elastic combination shown in FIG. Electrical component test unit), processing unit 32B (ie, visual inspection unit), and discharge unit 22C (ie, tray discharge unit) combined semiconductor component classification test system 3D; multiple feed units, single processing unit, Single test unit, and single discharge unit assembly design, such as the selected elastic combination of semiconductor component classification test system shown in Figure 6E Feed unit 12B (ie, carrier feed unit), processing unit 32 (ie, heating test unit), test unit 42 (ie, electrical test unit), and discharge unit 22C (ie, tray discharge unit) The combined semiconductor component classification test system 3E, a plurality of discharge units, a single processing unit, a single test unit, and a design assembled with a single feed unit, such as the semiconductor component classification selected by the elastic combination shown in FIG. Feed unit 12B (ie, tube feed unit), processing unit 32 (ie, heating unit), test unit 42 (ie, electrical test unit), and discharge unit 22C in test system 3 (ie, tray discharge) Unit) a semiconductor component classification test system 3F, or various numbers of discharge units, various numbers of processing units, various numbers of test units, and assembly designs combined with various numbers of input units, wherein The overlapping manners and operation modes of the respective constituent units in the semiconductor component classification test system are similar to those of the foregoing embodiments, and will not be described herein. Thereby, the semiconductor component, the test, the processing flow, and the package conversion can be completed uniformly on the semiconductor component classification test system. In the semiconductor component classification test system in which the elastic component semiconductor component classification test system 3 is combined, two or more combinations of the feed cells having the same or different feed modes and two or more of the same can be simultaneously used. Or a combination of discharge units of different discharge modes overlaps the design of a plurality of test units.
上述各個實施例之半導體元件分類測試系統3A~3F中的入料單元、測試單元、以及出料單元,都可以分別以第五圖所示之彈性組合之半導體元件分類測試系統3中的進料模組10的任一入料單元、處理模組30的任一處理單元、測試模組40中的任一測試單元、以及出料模組20中的任一出料單元單元取代,從而彈性地組裝成各種不同的入料模式、處理模式、測試模式、以及出料模式組合的半導體元件分類測試系統,以因應各種不同的半導體元件包裝轉換、處理流程以及測試的需求。另外,上述各個實施例之半導體元件分類測試系統3A~3F都可以採取與第六B圖所示之半導體元件分類測試系統3B相似的設計,而載具有一可以將空載盤由出料單元運送回入料單元而進行再利用的空盤運送機構。The feeding unit, the testing unit, and the discharging unit in the semiconductor component sorting test systems 3A to 3F of the above respective embodiments can be respectively classified by the elastic component of the semiconductor component classification test system 3 shown in FIG. Any one of the feeding unit of the module 10, any processing unit of the processing module 30, any one of the testing modules 40, and any one of the discharging unit units 20, thereby elastically Semiconductor component classification test systems assembled into a variety of different feed modes, processing modes, test modes, and discharge modes to accommodate a variety of different semiconductor component package conversion, processing flows, and testing needs. In addition, the semiconductor element classification test systems 3A to 3F of the above respective embodiments may adopt a design similar to the semiconductor element classification test system 3B shown in FIG. B, and have a carrier capable of transporting the empty tray from the discharge unit. An empty disk transport mechanism that returns to the feed unit for reuse.
根據上述實施例,本發明之彈性組合之半導體元件分類測試系統可以依照客戶所提供的半導體元件的包裝形式(或種類),即半導體元件進廠的包裝形式(或種類),所需要的處理流程、所需要的測試需求或流程、以及客戶所要求的半導體元件的包裝形式(或種類),即半導體元件出廠的包裝形式(或種類),自由地選取具有符合客戶所提供的半導體元件的包裝形式(或種類)的入料單元、可以實施所需要處理流程的處理單元、可以實施所需要測試流程的測試單元、以及符合客戶所要求的半導體元件的包裝形式(或種類)的出料單元,並藉由卡扣結合或是其他簡單的搭接方式輕易且快速地組裝成各種具有不同包裝模式、處理模式、測試模式、以及出料模式的半導體元件分類測試系統,即具有不同處理功能的半導體元件分類測試系統。藉由此半導體元件分類測試系統可以統一於其上各種半導體元件包裝的轉換以及對半導體元件的處理與測試,所以不但不需要購置各種不同包裝轉換功能的半導體元件轉換裝置(即半導體元件處理裝置)備用,以及不需要購置各種不同處理功能的(即半導體元件處理裝置)備用,以因應客戶所要求的各種包裝轉換與處理流程的需求,更不需要不需要以人工或機械將半導體元件運送至測試機台與轉換裝置(或處理裝置),所以可以省下因需購置各種不同包裝轉換功能的半導體元件轉換裝置(即半導體元件處理裝置)以及各種不同處理功能的即半導體元件處理裝置所增加的成本,以及因某些半導體元件處理裝置使用頻率不高所造成的浪費,並且減少半導體元件在不同的機台間轉移所需耗費的時間,從而節省轉換(或處理)流程的成本與時間,而可以達到快速出貨的目的。According to the above embodiment, the flexible component semiconductor component classification test system of the present invention can be processed according to the packaging form (or type) of the semiconductor component provided by the customer, that is, the packaging form (or type) of the semiconductor component into the factory, and the required processing flow. , the required test requirements or processes, and the packaging form (or type) of the semiconductor components required by the customer, that is, the packaging form (or type) of the semiconductor component, freely selected to have a packaging form conforming to the semiconductor component provided by the customer. a (or type) feed unit, a processing unit that can perform the required process flow, a test unit that can perform the required test flow, and a discharge unit that conforms to the packaging form (or type) of the semiconductor component required by the customer, and Quickly and quickly assemble into various semiconductor component classification test systems with different packaging modes, processing modes, test modes, and discharge modes by snap-fit or other simple bonding methods, that is, semiconductor components having different processing functions Classification test system. By this semiconductor component classification test system, it is possible to unify the conversion of various semiconductor component packages and the processing and testing of the semiconductor components thereon, so that it is not necessary to purchase semiconductor component conversion devices (ie, semiconductor component processing devices) having various package conversion functions. Standby, as well as the need to purchase a variety of different processing functions (ie, semiconductor component processing equipment), in order to meet the needs of various packaging conversion and processing procedures required by customers, and do not need to manually or mechanically transport semiconductor components to the test. The machine and the conversion device (or the processing device) can save the added cost of the semiconductor component conversion device (ie, the semiconductor component processing device) and various semiconductor processing devices that are required to purchase various package conversion functions. And the waste caused by the low frequency of use of some semiconductor component processing devices, and reducing the time required for the transfer of semiconductor components between different machines, thereby saving the cost and time of the conversion (or processing) process, and Achieve fast shipments of.
1‧‧‧彈性組合之半導體元件處理裝置
1A、1B、1C、1D、1E、1F、1G‧‧‧半導體元件處理裝置
2‧‧‧彈性組合之半導體元件分類測試系統
2A、2B、2C、2D、2E、2F、2G‧‧‧半導體元件分類測試系統
3‧‧‧彈性組合之半導體元件分類測試系統
3A、3B、3C、3D、3E、3F、3G‧‧‧半導體元件分類測試系統
10‧‧‧進料模組
11、11A、11B、11C、11D、11E‧‧‧入料單元連結定位機構
12、12A、12B、12C、12D、12E‧‧‧入料單元
14、14A、14B、14C、14D、14E‧‧‧輸送單元
16、16A、16B、16C、16D、16E‧‧‧載移單元
17、17B‧‧‧第二載移單元
18、18A、18B、18C、18D、18E‧‧‧拾取單元
20‧‧‧出料模組
21、21A、21B、21C、21D、21E‧‧‧出料單元連結定位機構
22、22A、22B、22C、22D、22E‧‧‧出料單元
24、24A、24B、24C、24D、24E‧‧‧輸送單元
26、26A、26B、26C、26D、26E‧‧‧載移單元
27C、27D‧‧‧第二載移單元
28、28A、28B、28C、28D、28E‧‧‧拾取單元
30‧‧‧處理模組
31、31A、31B、31C、31D、31E‧‧‧處理單元連結定位機構
32、32A、32B、32C、32D、32E‧‧‧處理單元
33、33A、33B、33C、33D、33E‧‧‧處理單元連結定位機構
34、34A、34B、34C、34D、34E‧‧‧輸送單元
36E‧‧‧載移單元
37D‧‧‧第二載移單元
37D‧‧‧第二載移單元
38E‧‧‧拾取單元
40‧‧‧測試模組
41、41A、41B、41C、41D、41E‧‧‧測試單元連結定位機構
42、42A、42B、42C、42D、42E‧‧‧測試單元
43、43A、43B、43C、43D、43E‧‧‧測試單元連結定位機構
44、44A、44B、44C、44D、44E輸送單元‧‧‧46、46A‧‧‧載移單元
47‧‧‧第二載移單元
48、48A‧‧‧拾取單元1‧‧‧Flexible combination of semiconductor component processing devices
1A, 1B, 1C, 1D, 1E, 1F, 1G‧‧‧ semiconductor device processing device
2‧‧‧Flexible combination of semiconductor component classification test system
2A, 2B, 2C, 2D, 2E, 2F, 2G‧‧‧ semiconductor component classification test system
3‧‧‧Flexible combination of semiconductor component classification test system
3A, 3B, 3C, 3D, 3E, 3F, 3G‧‧‧ semiconductor component classification test system
10‧‧‧ Feeding module
11, 11A, 11B, 11C, 11D, 11E‧‧‧ feeding unit connection positioning mechanism
12, 12A, 12B, 12C, 12D, 12E‧‧‧ Feeding unit
14, 14A, 14B, 14C, 14D, 14E‧‧‧ delivery unit
16, 16A, 16B, 16C, 16D, 16E‧‧‧loading unit
17, 17B‧‧‧Second loading unit
18, 18A, 18B, 18C, 18D, 18E‧‧‧ picking unit
20‧‧‧Drawing module
21, 21A, 21B, 21C, 21D, 21E‧‧‧ discharge unit connection positioning mechanism
22, 22A, 22B, 22C, 22D, 22E‧‧‧ discharge unit
24, 24A, 24B, 24C, 24D, 24E‧‧‧ delivery unit
26, 26A, 26B, 26C, 26D, 26E‧‧‧loading unit
27C, 27D‧‧‧Second loading unit
28, 28A, 28B, 28C, 28D, 28E‧‧‧ picking unit
30‧‧‧Processing module
31, 31A, 31B, 31C, 31D, 31E‧‧‧ processing unit connection positioning mechanism
32, 32A, 32B, 32C, 32D, 32E‧‧‧ processing unit
33, 33A, 33B, 33C, 33D, 33E‧‧‧ processing unit connection positioning mechanism
34, 34A, 34B, 34C, 34D, 34E‧‧‧ delivery unit
36E‧‧‧Loading unit
37D‧‧‧Second loading unit
37D‧‧‧Second loading unit
38E‧‧‧ picking unit
40‧‧‧Test module
41, 41A, 41B, 41C, 41D, 41E‧‧‧ test unit connection positioning mechanism
42, 42A, 42B, 42C, 42D, 42E‧‧‧ test units
43, 43A, 43B, 43C, 43D, 43E‧‧‧ test unit connection positioning mechanism
44, 44A, 44B, 44C, 44D, 44E transport unit ‧ ‧ 46, 46A ‧ ‧ loading unit
47‧‧‧Second loading unit
48, 48A‧‧‧ picking unit
第一圖本發明之另一實施例之彈性組合之半導體元件處理裝置之示意圖的示意圖。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a schematic view showing a schematic view of a flexible combination semiconductor device processing apparatus according to another embodiment of the present invention.
第二A圖至第二G圖為本發明第四圖所示之彈性組合之半導體元件處理裝置之各種實施例的示意圖。2A to 2G are schematic views of various embodiments of the elastic component semiconductor device processing apparatus shown in the fourth embodiment of the present invention.
第三圖為本發明之一實施例之彈性組合之半導體元件分類測試系統的示意圖。The third figure is a schematic diagram of a flexible combined semiconductor component classification test system according to an embodiment of the present invention.
第四A圖至第四G圖為本發明第六圖所示之彈性組合之半導體元件分類測試系統之各種實施例的示意圖。4A to 4G are schematic views of various embodiments of the elastic component semiconductor component classification test system shown in the sixth embodiment of the present invention.
第五圖為本發明之另一實施例之彈性組合之半導體元件分類測試系統的示意圖。FIG. 5 is a schematic diagram of a semiconductor component classification test system of an elastic combination according to another embodiment of the present invention.
第六A圖至第六F圖為本發明第六圖所示之彈性組合之半導體元件分類測試系統之各種實施例的示意圖。6A to 6F are schematic views of various embodiments of the elastic component semiconductor component classification test system shown in Fig. 6 of the present invention.
1‧‧‧彈性組合之半導體元件處理裝置 1‧‧‧Flexible combination of semiconductor component processing devices
10‧‧‧進料模組 10‧‧‧ Feeding module
11、11A、11B、11C、11D、11E‧‧‧入料單元連結定位機構 11, 11A, 11B, 11C, 11D, 11E‧‧‧ feeding unit connection positioning mechanism
12、12A、12B、12C、12D、12E‧‧‧入料單元 12, 12A, 12B, 12C, 12D, 12E‧‧‧ Feeding unit
14、14A、14B、14C、14D、14E‧‧‧輸送單元 14, 14A, 14B, 14C, 14D, 14E‧‧‧ delivery unit
16、16A、16B、16C、16D、16E‧‧‧載移單元 16, 16A, 16B, 16C, 16D, 16E‧‧‧loading unit
18、18A、18B、18C、18D、18E‧‧‧拾取單元 18, 18A, 18B, 18C, 18D, 18E‧‧‧ picking unit
20‧‧‧出料模組 20‧‧‧Drawing module
21、21A、21B、21C、21D、21E‧‧‧出料單元連結定位機構 21, 21A, 21B, 21C, 21D, 21E‧‧‧ discharge unit connection positioning mechanism
22、22A、22B、22C、22D、22E‧‧‧出料單元 22, 22A, 22B, 22C, 22D, 22E‧‧‧ discharge unit
24、24A、24B、24C、24D、24E‧‧‧輸送單元 24, 24A, 24B, 24C, 24D, 24E‧‧‧ delivery unit
26、26A、26B、26C、26D、26E‧‧‧載移單元 26, 26A, 26B, 26C, 26D, 26E‧‧‧loading unit
28、28A、28B、28C、28D、28E‧‧‧拾取單元 28, 28A, 28B, 28C, 28D, 28E‧‧‧ picking unit
30‧‧‧處理模組 30‧‧‧Processing module
31、31A、31B、31C、31D、31E‧‧‧處理單元連結定位機構 31, 31A, 31B, 31C, 31D, 31E‧‧‧ processing unit connection positioning mechanism
32、32A、32B、32C、32D、32E‧‧‧處理單元 32, 32A, 32B, 32C, 32D, 32E‧‧‧ processing unit
33、33A、33B、33C、33D、33E‧‧‧處理單元連結定位機構 33, 33A, 33B, 33C, 33D, 33E‧‧‧ processing unit connection positioning mechanism
34、34A、34B、34C、34D、34E‧‧‧輸送單元 34, 34A, 34B, 34C, 34D, 34E‧‧‧ delivery unit
36E‧‧‧載移單元 36E‧‧‧Loading unit
38E‧‧‧拾取單元 38E‧‧‧ picking unit
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