TW201732091A - Electroplating system which can use even more aggressive, more reliable means to increase electroplating quality and generate excellent benefits - Google Patents
Electroplating system which can use even more aggressive, more reliable means to increase electroplating quality and generate excellent benefits Download PDFInfo
- Publication number
- TW201732091A TW201732091A TW105106409A TW105106409A TW201732091A TW 201732091 A TW201732091 A TW 201732091A TW 105106409 A TW105106409 A TW 105106409A TW 105106409 A TW105106409 A TW 105106409A TW 201732091 A TW201732091 A TW 201732091A
- Authority
- TW
- Taiwan
- Prior art keywords
- anode
- electroplating system
- members
- electroplating
- frame body
- Prior art date
Links
Abstract
Description
本創作係有關一種電鍍系統,特別是指一種可依照產品外形或產品吊掛配置型態不同,配合調整電力分佈狀態的電鍍系統。This creation relates to an electroplating system, in particular to an electroplating system that can adjust the distribution of power according to the shape of the product or the configuration of the product.
眾所周知,“電鍍”乃係一種利用電解還原反應在物體上鍍一層膜的方法,其所使用之機器設備,因電鍍產品的不同而有所差異,而無論使用何種形式的機器設備,於電鍍區內皆設計有數量不等的電極棒作為陽極,以使電鍍液中產生金屬離子的游離現象,被鍍工件通常係設計為陰極。As we all know, "electroplating" is a method of coating a film on an object by electrolytic reduction. The equipment used varies depending on the plating product, regardless of the type of machine used. A variety of electrode rods are designed in the region as anodes to cause the release of metal ions in the plating solution, and the workpiece to be plated is usually designed as a cathode.
於進行電鍍作業時,則分別在陽極與陰極輸入電壓,令電鍍液因電解反應而析出金屬離子,且該些金屬離子會沈積於陰極端,而在陰極還原後,形成鍍著於被鍍工件表面之金屬鍍層;目前已知的電鍍系統,則可依電鍍金屬提供方式區分為溶解性陽極電鍍系統及不溶解陽極電鍍系統。During the electroplating operation, the voltage is input to the anode and the cathode respectively, so that the electroplating solution precipitates metal ions due to the electrolysis reaction, and the metal ions are deposited on the cathode end, and after the cathode is reduced, the plating is performed on the workpiece to be plated. The metal plating of the surface; the currently known electroplating system can be divided into a soluble anodizing system and an insoluble anodizing system according to the manner of plating metal.
在不溶解性陽極電鍍系統中,當電流從陽極頂部流至陽極底部時,其電流量會因電阻而遞減,換言之,在陽極頂部處,由於通過此處的電流較大,因此較多的金屬離子被分解釋放,而通過下方部位所通過的電流較通過上方部位的電流少,因此較少的金屬離子被分解釋放出來,進而在電鍍槽中產生電力線分佈並不均勻(即電流的密度分佈不均勻)的現象。In an insoluble anodizing system, when current flows from the top of the anode to the bottom of the anode, the amount of current decreases due to electrical resistance. In other words, at the top of the anode, more metal is present due to the larger current passing there. The ions are decomposed and released, and the current passing through the lower part is less than the current passing through the upper part, so less metal ions are decomposed and released, and the power line distribution in the plating tank is not uniform (that is, the density distribution of the current is not Uniform) phenomenon.
此現象將造成產品位在電流密度大的地方鍍層厚,反之產品位在電流密度小的地方則鍍層薄;不但會因為產品表面的鍍層不均勻而嚴重影響產品的品質(尤其是子產品),在某些情況下,電流密度過大(電力線過密)亦容易造成產品焦黑;因此,如何提供一種可依照產品外形或產品吊掛配置型態不同,配合調整電力分佈狀態的電鍍系統,長久以來一直是產業界所亟欲解決之課題。This phenomenon will cause the product to be thicker in the place where the current density is large. On the contrary, the product is thin in the place where the current density is small; not only will the quality of the product (especially the sub-product) be seriously affected by the uneven coating on the surface of the product. In some cases, the current density is too large (the power line is too dense), which is also likely to cause the product to be black; therefore, how to provide an electroplating system that can adjust the distribution of power according to the shape of the product or the configuration of the product, has long been The industry is trying to solve the problem.
有鑑於此,本創作即在提供一種可依照產品外形或產品吊掛配置型態不同,配合調整電力分佈狀態的電鍍系統,為其主要目的者。In view of this, the present invention provides an electroplating system that can adjust the distribution of power according to the shape of the product or the configuration of the product, and its main purpose.
為了達到上述目的,本創作之電鍍系統,係於一電鍍槽中配置有一陰極端,以及至少一陽極端;其中:該至少一陽極端係設有複數個呈相互絕緣狀態配置的陽極件,另有複數個導電件分別與各該陽極件電氣連接。In order to achieve the above object, the electroplating system of the present invention is provided with a cathode end and at least one anode end in a plating tank; wherein: the at least one anode end is provided with a plurality of anode members arranged in an insulated state, and plural A conductive member is electrically connected to each of the anode members.
利用上述結構特徵,本創作之電鍍系統,可透過對任一或任意數個陽極件通電的方式,於電鍍槽中產生不同電力線分佈狀態;尤其,所欲電鍍的產品外型或吊掛配置型態有所改變時,只需透過簡單切換電流供應迴路的方式,產生對應的電力線分佈狀態,不須更動原有陽極端設備,即可以更為積極、可靠之手段增加電鍍品質,並能產生良好之效益。By utilizing the above structural features, the electroplating system of the present invention can generate different power line distribution states in the plating tank by energizing any one or any of the anode members; in particular, the product to be electroplated or the hanging configuration type When the state changes, it is only necessary to change the current supply circuit to generate the corresponding power line distribution state. It is not necessary to change the original anode end equipment, that is, the plating quality can be increased more actively and reliably, and it can produce good. Benefits.
依據上述結構特徵,所述該至少一陽極端,係設有一架體,各該陽極件係呈相互絕緣的狀態設於該架體上。According to the above structural feature, the at least one anode end is provided with a frame body, and each of the anode members is disposed on the frame body in an insulated state.
依據上述結構特徵,所述該至少一陽極端,係設有一架體,各該陽極件係呈相互絕緣的狀態設於該架體上;各該導電件係固設於該架體上。According to the above structural feature, the at least one anode end is provided with a frame body, and each of the anode members is disposed on the frame body in an insulated state; each of the conductive members is fixed on the frame body.
依據上述結構特徵,所述該電鍍系統,係進一步包括一供連接外部電源的分電盤,該分電盤係供與各該陽極件所設置之導電件電氣連接,該分電盤上設有複數供分別控制各該陽極件之電路導通與否的開關電路。According to the above structural feature, the electroplating system further includes a distribution board for connecting an external power source, the distribution board is electrically connected to the conductive member provided by each of the anode members, and the distribution board is provided with A plurality of switching circuits for controlling whether the circuits of the anode members are turned on or not.
依據上述結構特徵,所述該電鍍系統,係進一步包括一供連接外部電源的分電盤,該分電盤係供與各該陽極件所設置之導電件電氣連接,該分電盤上設有複數供分別控制各該陽極件之電路導通與否的開關電路;該至少一陽極端,係設有一架體,各該陽極件係呈相互絕緣的狀態設於該架體上;各該導電件係固設於該架體上;該分度盤係設有複數供分別與各該導電件電氣連接的導線。According to the above structural feature, the electroplating system further includes a distribution board for connecting an external power source, the distribution board is electrically connected to the conductive member provided by each of the anode members, and the distribution board is provided with a plurality of switching circuits for respectively controlling whether the circuits of the anode members are turned on or not; the at least one anode end is provided with a frame body, and each of the anode members is disposed on the frame body in an insulated state; each of the conductive members is The fixing plate is fixed on the frame; the indexing plate is provided with a plurality of wires for electrically connecting to the respective conductive members.
依據上述結構特徵,所述各該陽極件係設有複數網孔。According to the above structural features, each of the anode members is provided with a plurality of meshes.
所述各該陽極件係呈長方形之外型輪廓。Each of the anode members has a rectangular profile.
所述各該陽極件係呈圓形之外型輪廓。Each of the anode members has a circular profile.
所述各該陽極件係呈正方形之外型輪廓。Each of the anode members has a square profile.
所述各該陽極件係呈橢圓形之外型輪廓。Each of the anode members has an elliptical profile.
所述各該陽極件係呈三角形之外型輪廓。Each of the anode members has a triangular profile.
所述各該陽極件係呈梯形之外型輪廓。Each of the anode members has a trapezoidal profile.
所述各該陽極件係L形之外型輪廓。Each of the anode members is an L-shaped profile.
所述該至少一陽極端設有至少兩種不同外型輪廓的陽極件。The at least one anode end is provided with an anode member of at least two different profiles.
依據上述結構特徵,所述該電鍍系統,該陽極片連接一擺動裝置。According to the above structural feature, in the electroplating system, the anode piece is connected to a swinging device.
依據上述結構特徵,所述該電鍍系統,該陽極端連接一擺動裝置。According to the above structural feature, in the electroplating system, the anode end is connected to a swinging device.
依據上述結構特徵,所述該電鍍系統,該陰極端連接一擺動裝置。According to the above structural feature, the electroplating system has a cathode end connected to a swinging device.
依據上述結構特徵,所述該電鍍系統,該架體連接一擺動裝置。According to the above structural feature, the plating system is connected to a swinging device.
本創作所揭露的電鍍系統,主要利用具有複數可供分別控制電路導通與否的陽極件設計,使得以透過對任一或任意數個陽極件通電的方式,於電鍍槽中產生不同電力線分佈狀態;尤其,所欲電鍍的產品外型或吊掛配置型態有所改變時,只需透過簡單切換電流供應迴路的方式,產生對應的電力線分佈狀態,不須更動原有陽極端設備,即可以更為積極、可靠之手段增加電鍍品質,並能產生良好之效益。The electroplating system disclosed in the present application mainly utilizes an anode member design having a plurality of separate control circuit conduction states, so that different power line distribution states are generated in the plating tank by energizing any one or any of the anode members. In particular, when the shape or hanging configuration type of the product to be electroplated is changed, it is only necessary to change the current supply circuit to generate the corresponding power line distribution state, without changing the original anode end device. More active and reliable means to increase plating quality and produce good results.
本創作主要提供一種可依照產品外形或產品吊掛配置型態不同,配合調整電力分佈狀態的電鍍系統,如第1圖所示,本創作之電鍍系統,基本上係於一電鍍槽10中配置有一陰極端20,以及至少一陽極端30;其中:該至少一陽極端30係設有複數個呈相互絕緣狀態配置的陽極件32,另有複數個導電件33分別與各該陽極件32電氣連接;於實施時,所述該至少一陽極端30,係可進一步設有一架體31,各該陽極件32係呈相互絕緣的狀態設於該架體31上。This creation mainly provides an electroplating system that can adjust the distribution of power according to the shape of the product or the configuration of the product hanging. As shown in Fig. 1, the electroplating system of the present invention is basically arranged in a plating tank 10. a cathode end 20, and at least one anode end 30; wherein: the at least one anode end 30 is provided with a plurality of anode members 32 arranged in an insulated state, and a plurality of conductive members 33 are electrically connected to the anode members 32, respectively; In the implementation, the at least one anode end 30 may further be provided with a frame body 31, and each of the anode members 32 is disposed on the frame body 31 in a state of being insulated from each other.
原則上,本創作之電鍍系統,於實際運作時,係可將成對的陽極端30分別置於電鍍槽10內部相對於陰極端20之兩側,且於陰極端20吊掛欲進行電鍍的產品,使分別在陽極端30與陰極端20輸入電流之狀態下,令電鍍槽10內之電鍍液因電解反應而析出沈積於陰極端的金屬離子,待金屬離子於陰極還原後,形成鍍著於產品表面的金屬鍍層。In principle, in the actual electroplating system, the pair of anode ends 30 can be respectively placed inside the plating tank 10 on both sides of the cathode end 20, and the cathode end 20 is suspended for electroplating. The product is such that, in the state where the current is input to the anode terminal 30 and the cathode terminal 20, the plating solution in the plating bath 10 is precipitated by the electrolytic reaction to deposit metal ions deposited on the cathode end, and after the metal ions are reduced at the cathode, the plating is formed. Metal plating on the surface of the product.
由於,本創作之電鍍系統,係設置複數可供分別控制電路導通與否的陽極件32,因此可透過對任一或任意數個陽極件32通電的方式,於電鍍槽中產生不同電力線分佈狀態;尤其,所欲電鍍的產品外型或吊掛配置型態有所改變時,只需透過簡單切換電流供應迴路的方式,產生對應的電力線分佈狀態,不須更動原有陽極端設備,即可以更為積極、可靠之手段增加電鍍品質,並能產生良好之效益。Since the electroplating system of the present invention is provided with a plurality of anode members 32 for controlling whether the circuits are respectively turned on or not, different power line distribution states can be generated in the plating tank by energizing any one or any of the plurality of anode members 32. In particular, when the shape or hanging configuration type of the product to be electroplated is changed, it is only necessary to change the current supply circuit to generate the corresponding power line distribution state, without changing the original anode end device. More active and reliable means to increase plating quality and produce good results.
如第2圖所示,在所述該至少一陽極端30,係設有一架體31,且各該陽極件32係呈相互絕緣的狀態設於該架體31上之結構型態下,各該導電件33亦可固設於該架體31上,且各該導電件33之一端且相對伸出該架體31預先設定之長度為佳,不但較有利於整體陽極端30之安裝架設,更較方便導電件33與外部電源電氣連接。As shown in FIG. 2, a frame body 31 is disposed on the at least one anode end 30, and each of the anode members 32 is disposed in a state of being insulated from each other on a structure of the frame body 31. The conductive member 33 can also be fixed on the frame body 31, and one end of each of the conductive members 33 and the length of the frame body 31 extending relative to the frame body 31 are preferably set, which is not only advantageous for the installation and erection of the integral anode end 30, but also It is convenient to electrically connect the conductive member 33 to an external power source.
如第3圖所示,本創作之電鍍系統,係可進一步包括一供連接外部電源的分電盤40,該分電盤40係供與各該陽極件32所設置之導電件33電氣連接,該分電盤40上設有複數供分別控制各該陽極件32之電路導通與否的開關電路。As shown in FIG. 3, the electroplating system of the present invention may further include a distribution board 40 for connecting an external power source, and the distribution board 40 is electrically connected to the conductive members 33 provided by the anode members 32. The distribution board 40 is provided with a plurality of switching circuits for controlling whether the circuits of the anode members 32 are turned on or not.
本創作之電鍍系統,又以進一步包括一供連接外部電源的分電盤40,該分電盤40係供與各該陽極件32所設置之導電件33電氣連接,該分電盤40上設有複數供分別控制各該陽極件32之電路導通與否的開關電路;該至少一陽極端30,係設有一架體31,各該陽極件32係呈相互絕緣的狀態設於該架體31上,各該導電件33係固設於該架體31上,以及該分度盤40係設有複數供分別與各該導電件33電氣連接的導線41之結構型態呈現為佳。The electroplating system of the present invention further includes a distribution board 40 for connecting an external power source, and the distribution board 40 is electrically connected to the conductive members 33 provided on the anode members 32. The distribution board 40 is provided. A plurality of switching circuits for controlling whether the circuits of the anode members 32 are respectively turned on or not; the at least one anode end 30 is provided with a frame body 31, and each of the anode members 32 is disposed on the frame body 31 in a state of being insulated from each other. Each of the conductive members 33 is fixed to the frame body 31, and the indexing plate 40 is preferably provided with a plurality of structural forms for electrically connecting the wires 41 to the respective conductive members 33.
本創作之電鍍系統,在上揭各種可能實施的結構型態下,所述各該陽極件32係設有複數網孔321,亦即所述該陽極件32係可以呈網、籃之結構型態呈現,使其電鍍槽中的金屬離子得以獲致較佳的流動性。In the electroplating system of the present invention, each of the anode members 32 is provided with a plurality of meshes 321 in a structure in which various embodiments are possible, that is, the anode member 32 can be in the form of a net or a basket. The state is such that the metal ions in the plating bath are subjected to better fluidity.
以及,在上揭第2圖所示之實施例中,所述各該陽極件32係呈長方形之外型輪廓;於實施時,所述各該陽極件32亦可呈如第3圖所示圓形之外型輪廓,或者呈如第4圖所示正方形之外型輪廓,甚至可以分別呈如第5圖當中所示橢圓形之外型輪廓、三角形之外型輪廓、梯形之外型輪廓及L形之外型輪廓;必要時,所述該至少一陽極端30,亦可設有至少兩種不同外型輪廓的陽極件32。再者,亦可如第6圖所示,於實施時,所述各該陽極端30可進一步設置於陽極片50與陰極端20間,確保電鍍品質;或可如第7圖所示,於實施時,該陽極端30可設置於陽極片50相對於陰極端20之另一側;進一步,陰極端20、陽極端30及陽極片50可依其需求連接一擺動裝置70,達到鍍層更均勻的效果。In the embodiment shown in FIG. 2, each of the anode members 32 has a rectangular outer shape; in practice, each of the anode members 32 can also be as shown in FIG. A circular outline, or a square outline as shown in Fig. 4, or even an elliptical outer contour, a triangular outer contour, a trapezoidal outer contour as shown in Fig. 5, respectively. And an L-shaped profile; if necessary, the at least one anode end 30 may also be provided with at least two different profiles of the anode member 32. Furthermore, as shown in FIG. 6, in the implementation, each of the anode ends 30 may be further disposed between the anode sheet 50 and the cathode end 20 to ensure plating quality; or as shown in FIG. In practice, the anode end 30 can be disposed on the other side of the anode sheet 50 relative to the cathode end 20; further, the cathode end 20, the anode end 30, and the anode sheet 50 can be connected to a swinging device 70 according to the requirements to achieve a more uniform coating. Effect.
具體而言,本創作所揭露的電鍍系統,主要利用具有複數可供分別控制電路導通與否的陽極件設計,使得以透過對任一或任意數個陽極件通電的方式,於電鍍槽中產生不同電力線分佈狀態;尤其,所欲電鍍的產品外型或吊掛配置型態有所改變時,只需透過簡單切換電流供應迴路的方式,產生對應的電力線分佈狀態,不須更動原有陽極端設備,即可以更為積極、可靠之手段增加電鍍品質,並能產生良好之效益。Specifically, the electroplating system disclosed in the present application mainly utilizes an anode member design having a plurality of separate control circuit conduction states, so that the electroplating tank is generated by energizing any one or any of the anode members. Different power line distribution states; in particular, when the appearance or hanging configuration type of the product to be electroplated is changed, the corresponding power line distribution state can be generated by simply switching the current supply circuit, and the original anode end is not required to be changed. Equipment, that is, can be more active and reliable means to increase the quality of plating, and can produce good benefits.
以上所述之實施例僅係為說明本創作之技術思想及特點,其目的在使熟習此項技藝之人士能夠瞭解本創作之內容並據以實施,當不能以之限定本創作之專利範圍,即大凡依本創作所揭示之精神所作之均等變化或修飾,仍應涵蓋在本創作之專利範圍內。The embodiments described above are only for explaining the technical idea and characteristics of the present invention, and the purpose thereof is to enable those skilled in the art to understand the contents of the present invention and implement them according to the scope of the patent. That is, the equivalent changes or modifications made by the people in accordance with the spirit revealed by this creation should still be covered by the scope of the patent of this creation.
10‧‧‧電鍍槽
20‧‧‧陰極端
30‧‧‧陽極端
31‧‧‧架體
32‧‧‧陽極件
321‧‧‧網孔
33‧‧‧導電件
40‧‧‧分電盤
41‧‧‧導線
50‧‧‧陽極片
70‧‧‧擺動裝置10‧‧‧ plating bath
20‧‧‧ cathode end
30‧‧‧Anode end
31‧‧‧ ‧ frame
32‧‧‧Anode parts
321‧‧‧ mesh
33‧‧‧Electrical parts
40‧‧‧Distribution tray
41‧‧‧Wire
50‧‧‧Anode film
70‧‧‧Swing device
第1圖係為本創作之電鍍系統基本組成架構圖。 第2圖係為本創作第一實施例之陽極端外觀立體圖。 第3圖係為本創作第二實施例之陽極端結構示意圖。 第4圖係為本創作第三實施例之陽極端結構示意圖。 第5圖係為本創作第四實施例之陽極端結構示意圖。 第6圖係為本創作第五實施例之陽極端使用狀態示意圖。 第7圖係為本創作第六實施例之陽極端使用狀態示意圖。The first picture is the basic composition of the electroplating system of this creation. Fig. 2 is a perspective view showing the appearance of the anode end of the first embodiment of the present invention. Figure 3 is a schematic view showing the structure of the anode end of the second embodiment of the present invention. Fig. 4 is a schematic view showing the structure of the anode end of the third embodiment of the present invention. Fig. 5 is a schematic view showing the structure of the anode end of the fourth embodiment of the present invention. Fig. 6 is a schematic view showing the state of use of the anode end of the fifth embodiment of the present invention. Fig. 7 is a schematic view showing the state of use of the anode end of the sixth embodiment of the present invention.
10‧‧‧電鍍槽 10‧‧‧ plating bath
20‧‧‧陰極端 20‧‧‧ cathode end
30‧‧‧陽極端 30‧‧‧Anode end
31‧‧‧架體 31‧‧‧ ‧ frame
32‧‧‧陽極件 32‧‧‧Anode parts
33‧‧‧導電件 33‧‧‧Electrical parts
Claims (22)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105106409A TW201732091A (en) | 2016-03-02 | 2016-03-02 | Electroplating system which can use even more aggressive, more reliable means to increase electroplating quality and generate excellent benefits |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW105106409A TW201732091A (en) | 2016-03-02 | 2016-03-02 | Electroplating system which can use even more aggressive, more reliable means to increase electroplating quality and generate excellent benefits |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI561684B TWI561684B (en) | 2016-12-11 |
TW201732091A true TW201732091A (en) | 2017-09-16 |
Family
ID=58227270
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW105106409A TW201732091A (en) | 2016-03-02 | 2016-03-02 | Electroplating system which can use even more aggressive, more reliable means to increase electroplating quality and generate excellent benefits |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201732091A (en) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM504102U (en) * | 2015-03-30 | 2015-07-01 | Applied Equipment Ltd | Electroplating equipment |
-
2016
- 2016-03-02 TW TW105106409A patent/TW201732091A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TWI561684B (en) | 2016-12-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101054701B (en) | Method of increasing electroplating evenness | |
CN102605397A (en) | Electroplating system and electroplating method | |
CN201574207U (en) | Electroplating bath with uniform distribution of power lines | |
CN102534733B (en) | Electroplanting device and electro-plating method | |
CN205529122U (en) | Electroplating system | |
CN201924097U (en) | Electroplating device | |
CN205529121U (en) | Electroplated anode device | |
JP2016180148A (en) | Electrolytic plating apparatus | |
US20170298530A1 (en) | Electroplating anode assembly | |
JP2016156084A (en) | Electrolytic plating apparatus | |
US20170298529A1 (en) | Electroplating system | |
CN107190306A (en) | Electroplating system | |
CN202017059U (en) | Electroplating equipment with baffle plates | |
CN205669074U (en) | PCB board copper plating device | |
CN107190307A (en) | Electroplating anode device | |
TW201732091A (en) | Electroplating system which can use even more aggressive, more reliable means to increase electroplating quality and generate excellent benefits | |
TWM522953U (en) | Electroplating system | |
CN206512300U (en) | The anode segmenting device of electroplating device | |
CN102392292B (en) | Electroplating method for encapsulation substrates | |
CN203683711U (en) | Copper plating rectifying device | |
TW201732090A (en) | Electroplating anode device which ensures the electroplating quality of the product in a relatively more aggressive and reliable manner | |
TWM522956U (en) | Electroplated anode device | |
KR101565355B1 (en) | Electroplating apparatus and processing method thereof | |
CN204616216U (en) | For the web plate of copper facing filling perforation | |
CN107761158A (en) | A kind of electroplating device and electro-plating method |