TW201727393A - Pattern drawing apparatus and pattern drawing method - Google Patents
Pattern drawing apparatus and pattern drawing method Download PDFInfo
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- TW201727393A TW201727393A TW105131295A TW105131295A TW201727393A TW 201727393 A TW201727393 A TW 201727393A TW 105131295 A TW105131295 A TW 105131295A TW 105131295 A TW105131295 A TW 105131295A TW 201727393 A TW201727393 A TW 201727393A
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2051—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source
- G03F7/2057—Exposure without an original mask, e.g. using a programmed deflection of a point source, by scanning, by drawing with a light beam, using an addressed light or corpuscular source using an addressed light valve, e.g. a liquid crystal device
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/2002—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image
- G03F7/2004—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light
- G03F7/2006—Exposure; Apparatus therefor with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image characterised by the use of a particular light source, e.g. fluorescent lamps or deep UV light using coherent light; using polarised light
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/29—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the position or the direction of light beams, i.e. deflection
- G02F1/33—Acousto-optical deflection devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
- G03F7/24—Curved surfaces
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70283—Mask effects on the imaging process
- G03F7/70291—Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70216—Mask projection systems
- G03F7/70358—Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/7055—Exposure light control in all parts of the microlithographic apparatus, e.g. pulse length control or light interruption
- G03F7/70566—Polarisation control
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Nonlinear Science (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Optical Modulation, Optical Deflection, Nonlinear Optics, Optical Demodulation, Optical Logic Elements (AREA)
Abstract
Description
本發明係關於一種掃描照射至被照射體上之聚焦光而描繪圖案之圖案描繪裝置及圖案描繪方法。 The present invention relates to a pattern drawing device and a pattern drawing method for scanning a focused light that is irradiated onto an object to be irradiated to draw a pattern.
作為使用旋轉多角鏡之描繪裝置，例如已知電子照片方式之圖像形成裝置，其係如下述專利文獻1所揭示般，利用多角鏡使來自雷射二極體(LD)之射束反覆偏向，並使偏向後之射束經由f θ透鏡於感光體上掃描。專利文獻1所揭示之圖像形成裝置中，根據雷射二極體(LD)之驅動電流之變化而預測包含雷射二極體(LD)、旋轉多角鏡、及f θ透鏡等之寫入單元內之溫度變化。而且，為了修正因溫度變化而產生之f θ透鏡之倍率誤差(射束之主掃描方向之倍率誤差)，而變更響應圖像訊號對雷射二極體(LD)進行點亮控制時成為基準之寫入用之時脈訊號之頻率。然而，於應描繪之圖像之圖案為用於電子器件之圖案之情形時，即便如專利文獻1般，僅藉由時脈訊號之頻率變更來修正倍率誤差，亦無法細緻地應對高精度之倍率修正。 As an image forming apparatus using a rotating polygon mirror, for example, an image forming apparatus of an electrophotographic type is known, and as disclosed in Patent Document 1 below, a beam from a laser diode (LD) is repeatedly biased by a polygon mirror. And causing the deflected beam to scan on the photoreceptor via the f θ lens. In the image forming apparatus disclosed in Patent Document 1, the writing including the laser diode (LD), the rotating polygon mirror, and the f θ lens is predicted based on the change in the driving current of the laser diode (LD). Temperature change within the unit. Further, in order to correct the magnification error of the f θ lens due to the temperature change (magnification error in the main scanning direction of the beam), the change response image signal is used as a reference for lighting control of the laser diode (LD). The frequency of the clock signal used for writing. However, when the pattern of the image to be drawn is a pattern for an electronic device, even if the frequency error is corrected by the frequency change of the clock signal as in Patent Document 1, the precision can not be meticulously handled. Magnification correction.
[先前技術文獻] [Previous Technical Literature]
[專利文獻] [Patent Literature]
[專利文獻1]日本專利特開2009-220489號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2009-220489
本發明之第1態樣係一種圖案描繪裝置，其係一面將來自光源之射束根據圖案資訊進行強度調變，一面將上述射束投射至基板上而於主掃描方向進行掃描，藉此於上述基板上形成圖案者，且具備：掃描裝置，其為了上述射束於上述主掃描方向上之掃描，將包含使來自上述光源之上述射束偏向之偏向構件之複數個掃描單元以投射至上述基板上之上述射束之掃描軌跡相互錯開之方式配置；及電光偏向裝置，其能夠為了將來自上述光源之上述射束分時供給至上述複數個掃描單元之各者，而將來自上述光源之上述射束切換為偏向狀態或非偏向狀態，並且為了使上述射束之掃描軌跡於與上述主掃描方向交叉之副掃描方向移位，而調整上述射束之偏向角。 A first aspect of the present invention is a pattern drawing device that scans a beam from a light source according to pattern information and projects the beam onto a substrate to scan in a main scanning direction. And forming a pattern on the substrate, further comprising: a scanning device for projecting the plurality of scanning units including the deflecting member that deflects the beam from the light source to the scanning in the main scanning direction The scanning trajectories of the beams on the substrate are arranged to be shifted from each other; and the electro-optic deflecting device is capable of supplying the light beams from the light source to each of the plurality of scanning units in time division The beam is switched to a deflected state or a non-biased state, and the deflection angle of the beam is adjusted in order to shift the scanning trajectory of the beam in the sub-scanning direction intersecting the main scanning direction.
本發明之第2態樣係一種圖案描繪方法，其係一面將來自光源之射束根據圖案資訊進行強度調變，一面將上述射束投射至基板上而於主掃描方向進行掃描，藉此於上述基板上形成圖案者，且包括如下步驟：以投射至上述基板上之上述射束之掃描軌跡相互錯開之方式配置之複數個掃描單元使用偏向構件將來自上述光源之上述射束於上述主掃描方向進行掃描；及為了將來自上述光源之上述射束分時供給至上述複數個掃描單元之各者，而將來自上述光源之上述射束切換為偏向狀態或非偏向狀態，並且使藉由上述複數個掃描單元之各者而掃描之上述射束之掃描軌跡於與上述主掃描方向交叉之副掃描方向移位。 According to a second aspect of the present invention, a pattern drawing method is characterized in that a beam from a light source is intensity-modulated according to pattern information, and the beam is projected onto a substrate and scanned in a main scanning direction. Forming a pattern on the substrate, and comprising the steps of: arranging, by the plurality of scanning units, the scanning trajectories of the beams projected onto the substrate to be offset from each other by using a deflecting member to perform the beam from the light source to the main scanning Scanning the direction; and switching the beam from the light source to a biased state or a non-biased state in order to supply the beam from the light source to each of the plurality of scanning units in a time division manner, and The scanning trajectory of the beam scanned by each of the plurality of scanning units is shifted in the sub-scanning direction crossing the main scanning direction.
10‧‧‧器件製造系統 10‧‧‧Device Manufacturing System
12‧‧‧基板搬送機構 12‧‧‧Substrate transport mechanism
14‧‧‧曝光頭 14‧‧‧Exposure head
16‧‧‧控制裝置 16‧‧‧Control device
20‧‧‧脈衝光產生部 20‧‧‧ Pulse Light Generation Department
22、152a、152b‧‧‧控制電路 22, 152a, 152b‧‧‧ control circuit
30、32‧‧‧DFB半導體雷射元件 30, 32‧‧‧DFB semiconductor laser components
34、38‧‧‧偏光分光器 34, 38‧‧‧ polarized beam splitter
35‧‧‧脈衝光源部 35‧‧‧ pulse light source department
36‧‧‧電光元件 36‧‧‧Electro-optical components
36a‧‧‧驅動電路 36a‧‧‧Drive Circuit
42‧‧‧激發光源 42‧‧‧Excitation source
44‧‧‧合併器 44‧‧‧Combiner
46‧‧‧光纖光放大器 46‧‧‧Fiber optical amplifier
48、50‧‧‧波長轉換光學元件 48, 50‧‧‧ wavelength conversion optics
60‧‧‧時脈產生部 60‧‧‧ Clock Generation Department
62‧‧‧修正像素指定部 62‧‧‧Revision pixel designation
64‧‧‧送出時序切換部 64‧‧‧Send timing switching
70‧‧‧第1分頻計數器電路 70‧‧‧1st divide counter circuit
72、74、80、82‧‧‧延遲元件 72, 74, 80, 82‧‧‧ delay elements
76‧‧‧預設部 76‧‧‧Preset Department
78‧‧‧第2分頻計數器電路 78‧‧‧2nd divide counter circuit
100‧‧‧多角鏡驅動控制部 100‧‧‧Multi-angle mirror drive control unit
102‧‧‧選擇元件驅動控制部 102‧‧‧Select component drive control unit
102A‧‧‧驅動電路 102A‧‧‧Drive Circuit
102A1‧‧‧局部振盪電路 102A1‧‧‧Local Oscillation Circuit
102A2‧‧‧混合電路 102A2‧‧‧ mixed circuit
102A3‧‧‧放大電路 102A3‧‧‧Amplification circuit
104‧‧‧射束控制裝置 104‧‧‧Ball control device
110‧‧‧整體倍率設定部 110‧‧‧ overall magnification setting unit
112‧‧‧局部倍率設定部 112‧‧‧Local magnification setting
114‧‧‧描繪資料輸出部 114‧‧‧Drawing data output department
114a‧‧‧第1資料輸出部 114a‧‧‧1st data output department
114b‧‧‧第2資料輸出部 114b‧‧‧2nd Data Export Department
116‧‧‧曝光控制部 116‧‧‧Exposure Control Department
150、200‧‧‧時脈訊號產生部 150, 200‧‧‧ Clock Signal Generation Department
154‧‧‧合成光學構件 154‧‧‧Synthetic optical components
160‧‧‧光導光構件 160‧‧‧Light guiding members
162‧‧‧射束輪廓分析儀 162‧‧·beam profile analyzer
202‧‧‧修正點指定部 202‧‧‧Revision Point Designation Department
204‧‧‧時脈切換部 204‧‧‧clock switch
212‧‧‧分頻計數器電路 212‧‧‧Divided counter circuit
214‧‧‧移位脈衝輸出部 214‧‧‧Shift pulse output
AM1m、AM11~AM14、AM2m、AM21~AM24‧‧‧對準顯微鏡 AM1m, AM11~AM14, AM2m, AM21~AM24‧‧‧ alignment microscope
AOMa、AOMb、AOMcn、AOMc1~AOMc6‧‧‧描繪用光學元件 Optical components for AOMa, AOMb, AOMcn, AOMc1~AOMc6‧‧
AOMn、AOM1~AOM6‧‧‧選擇用光學元件 AOMn, AOM1~AOM6‧‧‧Select optical components
AXo‧‧‧中心軸 AXo‧‧‧ central axis
BDU‧‧‧射束切換部 BDU‧‧·Ball Switching Department
BMn、BM1~BM6‧‧‧記憶體部 BMn, BM1~BM6‧‧‧ memory
BSC、BSCa、BSCb‧‧‧像素移位脈衝 BSC, BSCa, BSCb‧‧‧ pixel shift pulse
CK、CKa、CKb、CKs、CKp、LTC‧‧‧時脈訊號 CK, CKa, CKb, CKs, CK p , LTC‧‧‧ clock signals
CMgn、CMgn'‧‧‧局部倍率修正資訊 CMgn, CMgn'‧‧‧ local magnification correction information
CYa、CYb‧‧‧柱面透鏡 CYa, CYb‧‧‧ cylindrical lens
De01~De49‧‧‧延遲電路 De01~De49‧‧‧Delay circuit
DLn、DL1~DL6‧‧‧串列資料 DLn, DL1~DL6‧‧‧Listed data
DR‧‧‧旋轉筒 DR‧‧‧Rotary tube
ENja、EN1a~EN4a、ENjb、EN1b~EN4b‧‧‧編碼器 ENja, EN1a~EN4a, ENjb, EN1b~EN4b‧‧‧ encoder
EX‧‧‧曝光裝置 EX‧‧‧Exposure device
FT、FT1、FT2‧‧‧f θ透鏡 FT, FT1, FT2‧‧‧f θ lenses
GT1m、GT2m、GX1‧‧‧OR閘極部 GT1m, GT2m, GX1‧‧‧OR gate
LB、LBa、LBb、LBn、Lse、LB1~LB6、LB1'‧‧‧射束 LB, LBa, LBb, LBn, Lse, LB1~LB6, LB1'‧‧·beam
Len、Le1~Le6‧‧‧照射中心軸 Len, Le1~Le6‧‧‧radiation center axis
LPn、LP1~LP6‧‧‧入射允許訊號 LPn, LP1~LP6‧‧‧ incident allowable signal
LS、LSa、LSb‧‧‧光源裝置 LS, LSa, LSb‧‧‧ light source device
Lx1~Lx4‧‧‧設置方位線 Lx1~Lx4‧‧‧Set the bearing line
MKm、MK1~MK4‧‧‧對準標記 MKm, MK1~MK4‧‧‧ alignment mark
Nv、Nv'‧‧‧修正位置資訊 Nv, Nv'‧‧‧Revised location information
OPn、OP1~OP6‧‧‧原點感測器 OPn, OP1~OP6‧‧‧ origin sensor
OSMn、OSM1~OSM6‧‧‧描繪允許訊號生成部 OSMn, OSM1~OSM6‧‧‧ depicting the allowable signal generation department
P‧‧‧基板 P‧‧‧Substrate
PM‧‧‧多角鏡 PM‧‧‧ polygon mirror
POL、POL'‧‧‧伸縮資訊 POL, POL'‧‧‧ telescopic information
PR1~PR6‧‧‧處理裝置 PR1~PR6‧‧‧Processing device
Px、Py、Pxy、φ‧‧‧尺寸 Px, Py, Pxy, φ‧‧‧ size
SBa、SBb‧‧‧描繪位元串資料 SBa, SBb‧‧‧ depicting bit string data
SCA‧‧‧倍率資訊 SCA‧‧‧ rate information
SDa、SDb‧‧‧刻度尺部 SDa, SDb‧‧‧ scale section
SLn、SL1~SL6、SL1'‧‧‧描繪線 SLn, SL1~SL6, SL1'‧‧‧ depicting lines
SP、SP'‧‧‧聚焦光 SP, SP'‧‧‧ focused light
SQn、SQ1~SQ6‧‧‧描繪允許訊號 SQn, SQ1~SQ6‧‧‧ depicting the allowable signal
SZn、SZ1~SZ6‧‧‧原點訊號 SZn, SZ1~SZ6‧‧‧ origin signal
Un、U1~U6、Ua1、UR1‧‧‧掃描單元 Un, U1~U6, Ua1, UR1‧‧‧ scan unit
Vs‧‧‧掃描速度 Vs‧‧‧ scan speed
W‧‧‧曝光區域 W‧‧‧Exposure area
圖1係表示第1實施形態之包含對基板實施曝光處理之曝光裝置之器件製造系統之概略構成的圖。 Fig. 1 is a view showing a schematic configuration of a device manufacturing system including an exposure apparatus that performs exposure processing on a substrate according to the first embodiment.
圖2係表示曝光裝置之構成之構成圖。 Fig. 2 is a view showing the configuration of the configuration of an exposure apparatus.
圖3係表示圖2所示之於旋轉筒捲繞有基板之狀態之詳細圖。 Fig. 3 is a detailed view showing a state in which a substrate is wound around a rotating drum shown in Fig. 2;
圖4係表示於基板上掃描之聚焦光之描繪線及形成於基板上之對準標記的圖。 4 is a view showing a drawing line of focused light scanned on a substrate and an alignment mark formed on the substrate.
圖5係表示圖2所示之掃描單元之光學性構成之圖。 Fig. 5 is a view showing the optical configuration of the scanning unit shown in Fig. 2.
圖6係表示圖2所示之射束切換部之構成圖。 Fig. 6 is a view showing the configuration of a beam switching unit shown in Fig. 2;
圖7係表示圖2所示之光源裝置之構成之圖。 Fig. 7 is a view showing the configuration of the light source device shown in Fig. 2;
圖8係表示圖7所示之訊號產生部所產生之時脈訊號、描繪位元串資料、及自偏光分光器射出之射束之關係的時序圖。 Fig. 8 is a timing chart showing the relationship between the clock signal generated by the signal generating unit shown in Fig. 7, the drawing bit string data, and the beam emitted from the polarization beam splitter.
圖9係表示具有使修正像素伸縮之功能的圖7所示之訊號產生部之構成的圖。 Fig. 9 is a view showing a configuration of a signal generating unit shown in Fig. 7 having a function of expanding and contracting a corrected pixel.
圖10係表示圖9所示之預設部所輸出之預設值之真值表的圖。 Fig. 10 is a view showing a truth value table of preset values outputted from the preset portion shown in Fig. 9.
圖11係表示圖9所示之時脈產生部所產生之時脈訊號之各時脈脈衝、第2分頻計數器電路之計數值、像素移位脈衝之輸出時序、輸入至圖7所示之驅動電路之串列資料之像素之邏輯資訊之切換時序的時序圖。 11 is a diagram showing clock pulses of a clock signal generated by the clock generation unit shown in FIG. 9, a count value of a second frequency division counter circuit, and an output timing of a pixel shift pulse, which are input to FIG. A timing diagram of the switching timing of the logic information of the pixels of the serial data of the driving circuit.
圖12係表示圖2所示之曝光裝置之電性構成之方塊圖。 Fig. 12 is a block diagram showing the electrical configuration of the exposure apparatus shown in Fig. 2.
圖13係表示自設置於各掃描單元之圖5之原點感測器輸出之原點訊號及根據原點訊號而由圖12所示之選擇元件驅動控制部生成之入射允許訊號 的時序圖。 13 is a view showing an origin signal output from the origin sensor of FIG. 5 provided in each scanning unit and an incident permission signal generated by the selection element drive control unit shown in FIG. 12 according to the origin signal. Timing diagram.
圖14係表示圖12所示之描繪資料輸出部之構成的圖。 Fig. 14 is a view showing the configuration of a drawing material output unit shown in Fig. 12;
圖15係表示由圖14所示之描繪允許訊號生成部所生成之描繪允許訊號及於描繪允許訊號為高位準之期間中自圖9之送出時序切換部輸出之像素移位脈衝的時序圖。 Fig. 15 is a timing chart showing the pixel shift pulses output from the delivery timing switching unit of Fig. 9 in the period in which the drawing permission signal generated by the drawing enable signal generating unit shown in Fig. 14 and the drawing permission signal are in the high level.
圖16係表示於最大掃描長度之範圍內伸縮之描繪線之位置與延遲時間之關係的圖。 Fig. 16 is a view showing the relationship between the position of the drawing line which is expanded and contracted within the range of the maximum scanning length and the delay time.
圖17係表示第1實施形態之變形例中之光源裝置之構成的圖。 Fig. 17 is a view showing the configuration of a light source device in a modification of the first embodiment.
圖18係表示圖17所示之時脈訊號產生部之構成之圖。 Fig. 18 is a view showing the configuration of a clock signal generating unit shown in Fig. 17;
圖19係說明圖18之時脈訊號產生部之動作之時序圖。 Fig. 19 is a timing chart for explaining the operation of the clock signal generating unit of Fig. 18.
圖20係表示第2實施形態中之設置於光源裝置之內部之訊號產生部之構成的圖。 Fig. 20 is a view showing the configuration of a signal generating unit provided inside the light source device in the second embodiment.
圖21A係表示圖20所示之延遲電路之構成之第1例的圖，圖21B係表示圖20所示之延遲電路之構成之第2例的圖。 21A is a view showing a first example of the configuration of the delay circuit shown in FIG. 20, and FIG. 21B is a view showing a second example of the configuration of the delay circuit shown in FIG. 20.
圖22係表示自圖20所示之訊號產生部之各部輸出之訊號的時序圖。 Fig. 22 is a timing chart showing signals output from the respective sections of the signal generating section shown in Fig. 20.
圖23A係說明未進行局部倍率修正之情形時所描繪之圖案之圖，圖23B係說明按照圖22所示之時序圖進行局部倍率修正(縮小)之情形時所描繪之圖案的圖。 Fig. 23A is a view for explaining a pattern drawn when local magnification correction is not performed, and Fig. 23B is a view for explaining a pattern drawn when local magnification correction (reduction) is performed in accordance with the timing chart shown in Fig. 22.
圖24係上述各實施形態之變形例1之說明圖，且係代替根據上述各實施形態(亦包含變形例)中所說明之圖案資料調變聚焦光之強度之電光元件而使用描繪用光學元件之情形時的描繪用光學元件之配置例的圖。 Fig. 24 is an explanatory view showing a modification 1 of each of the above embodiments, and an optical element for drawing is used instead of the electro-optical element for adjusting the intensity of the focused light according to the pattern data described in each of the above embodiments (including the modification). In the case of the case, the arrangement example of the optical element for drawing is shown.
圖25係上述各實施形態之變形例4之說明圖，且係模式性地表示上述 各實施形態(亦包含變形例)中所說明之射束切換部中之聚光透鏡、選擇用光學元件、準直透鏡、及單元側入射鏡之配置、與掃描單元內之第2柱面透鏡之配置之關係的圖。 Fig. 25 is an explanatory view showing a fourth modification of each of the above embodiments, and schematically shows the above The arrangement of the collecting lens, the selecting optical element, the collimating lens, and the unit side incident mirror in the beam switching unit described in each embodiment (including the modified example), and the second cylindrical lens in the scanning unit A diagram of the relationship of the configuration.
圖26係上述各實施形態(亦包含變形例)之變形例5之說明圖，且係表示代替多角鏡而使用檢流計鏡之掃描單元之主要部分構成的圖。 Fig. 26 is an explanatory view showing a modification 5 of each of the above embodiments (including a modification), and is a view showing a configuration of a main part of a scanning unit using a galvanometer mirror instead of a polygon mirror.
圖27係上述各實施形態(亦包含變形例)之變形例6之說明圖，且係藉由機械性旋轉機構而呈圓弧狀地掃描聚焦光之方式之掃描單元之立體圖。 Fig. 27 is an explanatory view of a modification 6 of each embodiment (including a modification), and is a perspective view of a scanning unit in which a focused light is scanned in an arc shape by a mechanical rotating mechanism.
圖28係詳細地表示第3實施形態中之光源裝置之脈衝光產生部內之波長轉換部之構成的圖。 FIG. 28 is a view showing the configuration of the wavelength conversion unit in the pulse light generating unit of the light source device according to the third embodiment.
圖29係表示第3實施形態中之自光源裝置至最初之選擇用光學元件為止之射束之光路的圖。 Fig. 29 is a view showing an optical path of a beam from the light source device to the first selection optical element in the third embodiment.
圖30係表示第3實施形態中之自選擇用光學元件至下一段之選擇用光學元件為止之光路與選擇用光學元件之驅動器電路之構成的圖。 Fig. 30 is a view showing the configuration of the optical path of the optical element for selection from the optical element for selection to the optical element for selection of the next stage and the driver circuit for the optical element for selection in the third embodiment.
圖31係說明選擇用光學元件之後之選擇用之單元側入射鏡處之射束選擇與射束移位之情況的圖。 Fig. 31 is a view for explaining the case of beam selection and beam shift at the unit side incident mirror for selection after selection of the optical element.
圖32係說明自多角鏡至基板為止之射束之行為之圖。 Figure 32 is a diagram illustrating the behavior of the beam from the polygon mirror to the substrate.
圖33係表示第3實施形態之變形例中之串疊方式之描繪裝置之概略構成之一部分的圖。 Fig. 33 is a view showing a part of a schematic configuration of a drawing apparatus of a cascade type in a modification of the third embodiment.
圖34係表示第4實施形態中之射束切換部BDU內之與1個掃描單元Un對應之射束切換部之構成的圖。 Fig. 34 is a view showing a configuration of a beam switching unit corresponding to one scanning unit Un in the beam switching unit BDU in the fourth embodiment.
圖35係表示將構成圖6(或圖24)所示之射束切換部BDU之選擇用光 學元件AOMn與單元側入射鏡IMn置換成圖34之構成之變形例的圖。 Figure 35 is a view showing the selection light for constituting the beam switching unit BDU shown in Figure 6 (or Figure 24). The element AOMn and the unit side incident mirror IMn are replaced by a modification of the configuration of FIG.
圖36係表示以聲光偏向元件AODs構成圖35之射束移位器部SFTa、SFTb之情形時之一例的圖。 Fig. 36 is a view showing an example of a case where the beam shifter units SFTa and SFTb of Fig. 35 are formed by the acousto-optic deflecting element AODs.
圖37係表示代替各實施形態或變形例中使用之選擇用光學元件AOMn、AOMa、AOMb或聲光偏向元件AODs而設置之射束偏向構件之變形例的圖。 Fig. 37 is a view showing a modification of the beam deflecting member provided instead of the selecting optical elements AOMn, AOMa, AOMb or the acousto-optic deflecting element AODs used in the respective embodiments or modifications.
針對本發明之態樣之圖案描繪裝置及圖案描繪方法，舉出較佳之實施形態，一面參照隨附圖式，一面於下文進行詳細說明。再者，本發明之態樣並不限定於該等實施形態，亦包含添加有多種變更或改良者。亦即，以下所記載之構成要素中包含業者能夠容易地設想者、實質上相同者，以下所記載之構成要素可適當組合。又，能夠於不脫離本發明之主旨之範圍內進行構成要素之各種省略、置換或變更。 The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Furthermore, the aspect of the present invention is not limited to the embodiments, and includes various modifications and improvements. In other words, among the constituent elements described below, the constituent elements that can be easily imagined by the operator are substantially the same, and the constituent elements described below can be combined as appropriate. Further, various omissions, substitutions, and changes of the components may be made without departing from the spirit of the invention.
[第1實施形態] [First Embodiment]
圖1係表示第1實施形態之包含對基板(被照射體)P實施曝光處理之曝光裝置EX之器件製造系統10之概略構成的圖。再者，於以下之說明中，只要未特別說明，則設定以重力方向為Z方向之XYZ正交座標系，並按照圖中所示之箭頭而說明X方向、Y方向、及Z方向。 Fig. 1 is a view showing a schematic configuration of a device manufacturing system 10 including an exposure apparatus EX that performs exposure processing on a substrate (irradiated body) P according to the first embodiment. In the following description, unless otherwise specified, an XYZ orthogonal coordinate system in which the direction of gravity is the Z direction is set, and the X direction, the Y direction, and the Z direction are described in accordance with the arrows shown in the drawing.
器件製造系統10係對基板P實施特定之處理(曝光處理等)而製造電子器件之系統(基板處理裝置)。器件製造系統10係例如構築有製造作為電子器件之可撓性顯示器、膜狀之觸控面板、液晶顯示面板用之 膜狀之彩色濾光片、可撓性配線、或可撓性感測器等之生產線的製造系統。以下，作為電子器件以可撓性顯示器為前提進行說明。作為可撓性顯示器，有例如有機EL顯示器、液晶顯示器等。器件製造系統10具有所謂的輥對輥(Roll To Roll)方式之構造，即，自將可撓性之片狀之基板(薄片基板)P捲成輥狀之供給輥FR1送出基板P，並對所送出之基板P連續地實施各種處理之後，利用回收輥FR2捲取各種處理後之基板P。基板P具有基板P之移動方向(搬送方向)成為長邊方向(長尺寸)且寬度方向成為短邊方向(短條)之帶狀之形狀。於第1實施形態中，示出至膜狀之基板P至少經過處理裝置(第1處理裝置)PR1、處理裝置(第2處理裝置)PR2、曝光裝置(第3處理裝置)EX、處理裝置(第4處理裝置)PR3、及處理裝置(第5處理裝置)PR4而被捲取至回收輥FR2為止之例。 The device manufacturing system 10 is a system (substrate processing apparatus) that manufactures an electronic device by performing a specific process (exposure process or the like) on the substrate P. The device manufacturing system 10 is configured, for example, to manufacture a flexible display as an electronic device, a film-shaped touch panel, and a liquid crystal display panel. A manufacturing system for a production line of a film-shaped color filter, a flexible wiring, or a flexible sensor. Hereinafter, description will be made on the assumption that the electronic device is a flexible display. Examples of the flexible display include an organic EL display, a liquid crystal display, and the like. The device manufacturing system 10 has a so-called Roll To Roll type structure in which a substrate P is fed from a supply roller FR1 in which a flexible sheet-like substrate (sheet substrate) P is wound into a roll shape, and After the supplied substrate P is continuously subjected to various processes, the substrate P after various treatments is taken up by the recovery roller FR2. The substrate P has a strip shape in which the moving direction (transport direction) of the substrate P is in the longitudinal direction (long dimension) and the width direction is in the short side direction (short strip). In the first embodiment, the film-form substrate P is subjected to at least a processing device (first processing device) PR1, a processing device (second processing device) PR2, an exposure device (third processing device) EX, and a processing device ( The fourth processing device) PR3 and the processing device (the fifth processing device) PR4 are wound up to the recovery roller FR2.
再者，本第1實施形態中，X方向係於水平面內基板P自供給輥FR1朝向回收輥FR2之方向(搬送方向)。Y方向係於水平面內與X方向正交之方向，且係基板P之寬度方向(短尺寸方向)。Z方向係和X方向與Y方向正交之方向(上方向)，且與重力起作用之方向平行。 In the first embodiment, the X direction is in the direction (transport direction) in which the substrate P in the horizontal plane is directed from the supply roller FR1 toward the recovery roller FR2. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is a width direction (short dimension direction) of the substrate P. The Z direction is a direction orthogonal to the Y direction and the Y direction (upward direction), and is parallel to the direction in which gravity acts.
基板P使用例如樹脂膜、或者由不鏽鋼等金屬或合金構成之箔(膜)等。作為樹脂膜之材質，可使用例如包含聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯-乙烯酯共聚物樹脂、聚氯乙烯樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂、及乙酸乙烯酯樹脂中之至少1個以上者。又，基板P之厚度或剛性(楊氏模數)只要為如於通過器件製造系統10之搬送路徑時基板P不會產生因屈曲形成之折痕或不可逆之皺褶之範圍即可。作為基板P之母材，厚度為25μm~200μm 左右之PET(聚對苯二甲酸乙二酯)或PEN(聚萘二甲酸乙二酯)等之膜係較佳之薄片基板之典型。 As the substrate P, for example, a resin film or a foil (film) made of a metal or an alloy such as stainless steel is used. As a material of the resin film, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene-vinyl ester copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, a polyimide resin, or the like can be used. At least one of a polycarbonate resin, a polystyrene resin, and a vinyl acetate resin. Further, the thickness or rigidity (Young's modulus) of the substrate P may be a range in which the substrate P does not have creases due to buckling or irreversible wrinkles as long as it passes through the transport path of the device manufacturing system 10. As the base material of the substrate P, the thickness is 25 μm to 200 μm. The film of PET or the like (polyethylene terephthalate) or PEN (polyethylene naphthalate) is preferably a typical sheet substrate.
基板P存在於由處理裝置PR1、處理裝置PR2、曝光裝置EX、處理裝置PR3、及處理裝置PR4所實施之各處理中受熱之情形，故而較佳為選定熱膨脹係數不太大之材質之基板P。例如，可藉由將無機填料混合於樹脂膜而抑制熱膨脹係數。無機填料可為例如氧化鈦、氧化鋅、氧化鋁、或氧化矽等。又，基板P可為利用浮式法等製造之厚度100μm左右之極薄玻璃之單層體，或亦可為於該極薄玻璃貼合上述樹脂膜、箔等而成之積層體。 The substrate P is heated in the respective processes performed by the processing device PR1, the processing device PR2, the exposure device EX, the processing device PR3, and the processing device PR4. Therefore, it is preferable to select a substrate P of a material having a thermal expansion coefficient which is not too large. . For example, the coefficient of thermal expansion can be suppressed by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide, or cerium oxide. In addition, the substrate P may be a single layer body of an extremely thin glass having a thickness of about 100 μm manufactured by a floating method or the like, or a laminate in which the resin film, the foil, or the like is bonded to the ultrathin glass.
且說，所謂基板P之可撓性(flexibility)係指即便對基板P施加自重程度之力亦不會剪切或斷裂而能夠使該基板P彎曲之性質。又，因自重程度之力而彎曲之性質亦包含於可撓性。又，根據基板P之材質、大小、厚度、成膜於基板P上之層構造、溫度、或濕度等環境等，可撓性之程度會發生變化。總之，只要於在本第1實施形態之器件製造系統10內之搬送路徑上所設置之各種搬送用滾筒、旋轉筒等搬送方向轉換用之構件確實地捲繞基板P之情形時，可不屈曲而帶有折痕或破損(產生破碎或裂紋)地順利搬送基板P，便可稱為可撓性之範圍。 In addition, the flexibility of the substrate P means a property that the substrate P can be bent without being sheared or broken even if a force of its own weight is applied to the substrate P. Moreover, the property of bending due to the force of the degree of self-weight is also included in the flexibility. Further, the degree of flexibility varies depending on the material, size, thickness of the substrate P, the layer structure formed on the substrate P, the temperature, or the environment such as humidity. In other words, when the substrate P is reliably wound around the transport direction switching member such as the various transport rollers and the rotary cylinder provided in the transport path in the device manufacturing system 10 of the first embodiment, the buckling can be performed without buckling. The substrate P can be smoothly conveyed with creases or breakage (breaking or cracking), which is called the range of flexibility.
處理裝置PR1係一面將自供給輥FR1搬送來之基板P朝向處理裝置PR2以特定之速度於沿著長尺寸方向之搬送方向(+X方向)進行搬送、一面對基板P進行塗佈處理之塗佈裝置。處理裝置PR1於基板P之表面選擇性地或均勻地塗佈感光性功能液。表面塗佈有該感光性功能液之基板P被朝向處理裝置PR2搬送。 In the processing apparatus PR1, the substrate P conveyed from the supply roller FR1 is conveyed toward the processing apparatus PR2 at a specific speed in the transport direction (+X direction) along the longitudinal direction, and the substrate P is coated. Coating device. The processing device PR1 selectively or uniformly applies the photosensitive functional liquid on the surface of the substrate P. The substrate P on which the photosensitive functional liquid is applied is transported toward the processing device PR2.
處理裝置PR2係一面將自處理裝置PR1搬送來之基板P朝向曝光裝置EX以特定之速度於搬送方向(+X方向)進行搬送、一面對基板P進行乾燥處理之乾燥裝置。處理裝置PR2係藉由將熱風或乾燥空氣等乾燥用空氣(暖風)吹送至基板P之表面之鼓風機、紅外線光源、陶瓷加熱器等而去除感光性功能液中所含之溶劑或水，而使感光性功能液乾燥。藉此，於基板P之表面選擇性地或均勻地形成成為感光性功能層(光感應層)之膜。再者，亦可藉由將乾燥膜貼附於基板P之表面而於基板P之表面形成感光性功能層。於該情形時，只要代替處理裝置PR1及處理裝置PR2而設置將乾燥膜貼附於基板P之貼附裝置(處理裝置)即可。 The processing device PR2 is a drying device that transports the substrate P transported from the processing device PR1 toward the exposure device EX at a specific speed in the transport direction (+X direction) and performs a drying process on the substrate P. The processing device PR2 removes the solvent or water contained in the photosensitive functional liquid by blowing a drying air (warm air) such as hot air or dry air onto the surface of the substrate P by an air blower, an infrared light source, a ceramic heater or the like. The photosensitive functional liquid is dried. Thereby, a film which becomes a photosensitive functional layer (photosensitive layer) is selectively or uniformly formed on the surface of the substrate P. Further, a photosensitive functional layer may be formed on the surface of the substrate P by attaching a dried film to the surface of the substrate P. In this case, a bonding device (processing device) that attaches the dried film to the substrate P may be provided instead of the processing device PR1 and the processing device PR2.
此處，該感光性功能液(層)之典型性者係光阻劑(液狀或乾燥膜狀)，但作為不需要顯影處理之材料，有受到紫外線之照射之部分之親液撥液性被改質之感光性矽烷偶合劑(SAM)、或於受到紫外線之照射之部分顯露鍍覆還原基之感光性還原劑等。於作為感光性功能液(層)使用感光性矽烷偶合劑之情形時，基板P上之經紫外線曝光之圖案部分自撥液性改質成親液性。因此，藉由於成為親液性之部分之上選擇塗佈含有導電性油墨(含有銀或銅等導電性奈米粒子之油墨)或半導體材料之液體等，可形成成為構成薄膜電晶體(TFT)等之電極、半導體、絕緣或連接用之配線之圖案層。於作為感光性功能液(層)使用感光性還原劑之情形時，於基板P上之經紫外線曝光之圖案部分顯露鍍覆還原基。因此，曝光後，將基板P直接於含有鈀離子等之鍍覆液中浸漬固定時間，藉此形成(析出)鈀之圖案層。此種鍍覆處理係加成(additive)之製程，但此外，亦可以作為減成(subtractive)之製程之蝕刻處理為前提。於該情形時，被送至曝光 裝置EX之基板P亦可為將母材設為PET或PEN並於其表面全面或選擇性地蒸鍍鋁(Al)或銅(Cu)等之金屬性薄膜，進而於其上積層光阻劑層而成者。本第1實施形態中，作為感光性功能液(層)使用感光性還原劑。 Here, the photosensitive functional liquid (layer) is typically a photoresist (liquid or dry film), but as a material that does not require development treatment, there is a lyophilic liquid repellency of a portion irradiated with ultraviolet rays. The photosensitive decane coupling agent (SAM) to be modified, or a photosensitive reducing agent which is exposed to the ultraviolet ray and which exposes the reduction group. When a photosensitive decane coupling agent is used as the photosensitive functional liquid (layer), the ultraviolet-exposed pattern portion on the substrate P is modified from liquid-repellent property to lyophilic property. Therefore, it is possible to form a thin film transistor (TFT) by selectively applying a liquid containing a conductive ink (an ink containing conductive nano particles such as silver or copper) or a semiconductor material to the lyophilic portion. A pattern layer of wiring for electrodes, semiconductors, insulation or connections. In the case where a photosensitive reducing agent is used as the photosensitive functional liquid (layer), the plated reduction group is exposed on the ultraviolet-exposed pattern portion on the substrate P. Therefore, after the exposure, the substrate P is immersed in a plating solution containing palladium ions or the like for a fixed period of time to form (precipitate) a pattern layer of palladium. Such a plating treatment is an additive process, but it can also be premised on the etching process of a subtractive process. In this case, it is sent to the exposure The substrate P of the device EX may be a metal film having a base material of PET or PEN and vapor-deposited aluminum (Al) or copper (Cu) on the surface thereof, or a layer of photoresist thereon. Layered. In the first embodiment, a photosensitive reducing agent is used as the photosensitive functional liquid (layer).
曝光裝置EX係一面將自處理裝置PR2搬送來之基板P朝向處理裝置PR3以特定之速度於搬送方向(+X方向)進行搬送、一面對基板P進行曝光處理之處理裝置。曝光裝置EX對基板P之表面(感光性功能層之表面，即感光面)照射與電子器件用之圖案(例如，構成電子器件之TFT之電極或配線等之圖案)相應之光圖案。藉此，於感光性功能層形成與上述圖案對應之潛像(改質部)。 The exposure apparatus EX is a processing apparatus that performs conveyance processing on the substrate P while the substrate P transported from the processing apparatus PR2 is conveyed toward the processing apparatus PR3 at a specific speed in the transport direction (+X direction). The exposure apparatus EX irradiates the surface of the substrate P (the surface of the photosensitive functional layer, that is, the photosensitive surface) with a light pattern corresponding to a pattern for an electronic device (for example, a pattern of electrodes or wirings of TFTs constituting the electronic device). Thereby, a latent image (modified portion) corresponding to the above pattern is formed on the photosensitive functional layer.
於本第1實施形態中，曝光裝置EX係不使用遮罩之直接成像方式之曝光裝置、所謂的光柵掃描方式之曝光裝置(圖案描繪裝置)。曝光裝置EX係一面將基板P向+X方向(副掃描之方向)搬送，一面將曝光用之脈衝狀之射束LB(脈衝射束)之聚焦光SP於基板P之被照射面(感光面)上沿特定之掃描方向(Y方向)一維地掃描(主掃描)，並且將聚焦光SP之強度根據圖案資料(描繪資料、圖案資訊)高速地調變(接通/斷開)，對此於下文中進行詳細說明。藉此，於基板P之被照射面描繪曝光與電子器件、電路或配線等之特定之圖案相應之光圖案。亦即，於基板P之副掃描、與聚焦光SP之主掃描中，聚焦光SP於基板P之被照射面上相對地二維掃描，而於基板P描繪曝光特定之圖案。又，由於基板P係沿搬送方向(+X方向)搬送，故而藉由曝光裝置EX曝光圖案之曝光區域W沿著基板P之長尺寸方向隔開特定之間隔而設置有複數個(參照圖4)。由於在該曝光區域W形成電子器件，故而曝光區域W亦為器件形成區域。再者，由於 電子器件係藉由複數個圖案層(形成有圖案之層)重合而構成，故而亦可藉由曝光裝置EX曝光與各層對應之圖案。 In the first embodiment, the exposure apparatus EX is an exposure apparatus that does not use a direct imaging method of a mask, and a so-called raster scanning type exposure apparatus (pattern drawing apparatus). The exposure apparatus EX transports the focused light SP of the pulsed beam LB (pulse beam) on the irradiated surface of the substrate P while the substrate P is being transported in the +X direction (the direction of the sub-scanning). ) scanning one-dimensionally (main scanning) in a specific scanning direction (Y direction), and modulating the intensity of the focused light SP according to the pattern data (drawing data, pattern information) at high speed (on/off), This is explained in detail below. Thereby, a light pattern corresponding to a specific pattern such as an electronic device, a circuit, or a wiring is drawn on the illuminated surface of the substrate P. That is, in the main scanning of the substrate P and the main scanning of the focused light SP, the focused light SP is relatively two-dimensionally scanned on the illuminated surface of the substrate P, and the exposure-specific pattern is drawn on the substrate P. Further, since the substrate P is transported in the transport direction (+X direction), the exposure region W of the exposure pattern by the exposure device EX is provided at a plurality of intervals along the longitudinal direction of the substrate P (see FIG. 4). ). Since the electronic device is formed in the exposed region W, the exposed region W is also a device formation region. Again, because Since the electronic device is formed by superposing a plurality of pattern layers (layers on which the pattern is formed), the pattern corresponding to each layer can be exposed by the exposure device EX.
處理裝置PR3係一面將自曝光裝置EX搬送來之基板P朝向處理裝置PR4以特定之速度於搬送方向(+X方向)進行搬送、一面對基板P進行濕式處理之濕式處理裝置。本第1實施形態中，處理裝置PR3對基板P進行作為濕式處理之一種之鍍覆處理。亦即，將基板P在貯存於處理槽之鍍覆液中浸漬特定時間。藉此，於感光性功能層之表面析出(形成)與潛像相應之圖案層。亦即，根據基板P之感光性功能層上之聚焦光SP之照射部分與非照射部分之差異，而於基板P上選擇性地形成特定之材料(例如鈀)，而其成為圖案層。 The processing apparatus PR3 is a wet processing apparatus that transports the substrate P transported from the exposure apparatus EX toward the processing apparatus PR4 at a specific speed in the transport direction (+X direction) and wet-processes the substrate P. In the first embodiment, the processing apparatus PR3 performs a plating process as a type of wet processing on the substrate P. That is, the substrate P is immersed in the plating solution stored in the treatment tank for a specific period of time. Thereby, a pattern layer corresponding to the latent image is deposited (formed) on the surface of the photosensitive functional layer. That is, a specific material (for example, palladium) is selectively formed on the substrate P in accordance with the difference between the irradiated portion and the non-irradiated portion of the focused light SP on the photosensitive functional layer of the substrate P, and becomes a pattern layer.
再者，於作為感光性功能層使用感光性矽烷偶合劑之情形時，由處理裝置PR3進行作為濕式處理之一種之液體(例如含有導電性油墨等之液體)塗佈處理或鍍覆處理。即便於該情形時，亦於感光性功能層之表面形成與潛像相應之圖案層。亦即，根據基板P之感光性功能層之聚焦光SP之照射部分與被照射部分之差異，於基板P上選擇性地形成特定之材料(例如導電性油墨或鈀等)，而其成為圖案層。又，於作為感光性功能層採用光阻劑之情形時，藉由處理裝置PR3進行作為濕式處理之一種之顯影處理。於該情形時，藉由該顯影處理而將與潛像相應之圖案形成於感光性功能層(光阻劑)。 In the case where a photosensitive decane coupling agent is used as the photosensitive functional layer, the treatment device PR3 performs a coating treatment or a plating treatment of a liquid (for example, a liquid containing a conductive ink or the like) which is one of the wet treatments. That is, in this case, a pattern layer corresponding to the latent image is formed on the surface of the photosensitive functional layer. That is, depending on the difference between the irradiated portion of the focused light SP of the photosensitive functional layer of the substrate P and the portion to be irradiated, a specific material (for example, conductive ink or palladium, etc.) is selectively formed on the substrate P, and becomes a pattern. Floor. Further, when a photoresist is used as the photosensitive functional layer, the development processing as one of the wet processing is performed by the processing device PR3. In this case, a pattern corresponding to the latent image is formed on the photosensitive functional layer (photoresist) by the development processing.
處理裝置PR4係一面將自處理裝置PR3搬送來之基板P朝向回收輥FR2以特定之速度於搬送方向(+X方向)進行搬送、一面對基板P進行清洗、乾燥處理之清洗/乾燥裝置。處理裝置PR4對經實施濕式處理 之基板P進行利用純水之清洗，其後於玻璃轉移溫度以下使其乾燥至基板P之水分含有率成為特定值以下為止。 The processing device PR4 is a cleaning/drying device that transports the substrate P transported from the processing device PR3 toward the recovery roller FR2 at a specific speed in the transport direction (+X direction) and cleans and dries the substrate P. Processing device PR4 is subjected to wet processing The substrate P is cleaned with pure water, and then dried at a temperature below the glass transition temperature until the water content of the substrate P becomes a specific value or less.
再者，於作為感光性功能層使用感光性矽烷偶合劑之情形時，處理裝置PR4亦可為對基板P進行退火處理與乾燥處理之退火/乾燥裝置。退火處理係為了使所塗佈之導電性油墨中含有之奈米粒子彼此之電性鍵結變得牢固，例如將來自閃光燈之高亮度之脈衝光照射至基板P。於作為感光性功能層採用光阻劑之情形時，亦可於處理裝置PR4與回收輥FR2之間設置進行蝕刻處理之處理裝置(濕式處理裝置)PR5、與對經實施蝕刻處理之基板P進行清洗、乾燥處理之處理裝置(清洗/乾燥裝置)PR6。藉此，於作為感光性功能層採用光阻劑之情形時，藉由實施蝕刻處理，而於基板P形成圖案層。亦即，根據基板P之感光性功能層之聚焦光SP之照射部分與被照射部分之差異，於基板P上選擇性地形成特定之材料(例如鋁(Al)或銅(Cu)等)，而其成為圖案層。處理裝置PR5、PR6具有將送來之基板P朝向回收輥FR2而以特定之速度將基板P於搬送方向(+X方向)進行搬送之功能。複數個處理裝置PR1~PR4(視需要亦包含處理裝置PR5、PR6)就將基板P向+X方向搬送之功能而言係作為基板搬送裝置而構成。 Further, when a photosensitive decane coupling agent is used as the photosensitive functional layer, the processing apparatus PR4 may be an annealing/drying apparatus that performs annealing treatment and drying treatment on the substrate P. In the annealing treatment, in order to make the nanoparticles contained in the applied conductive ink electrically bond to each other, for example, high-intensity pulsed light from a flash lamp is irradiated onto the substrate P. When a photoresist is used as the photosensitive functional layer, a processing device (wet processing device) PR5 for performing etching treatment and a substrate P for performing etching treatment may be provided between the processing device PR4 and the recovery roller FR2. A treatment device (cleaning/drying device) PR6 for washing and drying treatment. Therefore, when a photoresist is used as the photosensitive functional layer, a pattern layer is formed on the substrate P by performing an etching process. That is, a specific material (for example, aluminum (Al) or copper (Cu), etc.) is selectively formed on the substrate P according to the difference between the irradiated portion of the focused light SP of the photosensitive functional layer of the substrate P and the portion to be irradiated. And it becomes a pattern layer. The processing apparatuses PR5 and PR6 have a function of transporting the substrate P toward the recovery roller FR2 at a specific speed in the transport direction (+X direction). The functions of the plurality of processing devices PR1 to PR4 (including the processing devices PR5 and PR6 as necessary) for transporting the substrate P in the +X direction are configured as a substrate transfer device.
以如此之方式，經實施各處理之基板P由回收輥FR2回收。經過器件製造系統10之至少各處理而將1個圖案層形成於基板P上。如上所述，電子器件係藉由複數個圖案層重合而構成，故而為了生成電子器件，必須使如圖1所示之器件製造系統10之各處理經歷至少2次。因此，可藉由將捲取有基板P之回收輥FR2作為供給輥FR1安裝於另一器件製造系統10，而積層圖案層。重複此種動作，而形成電子器件。處理後之基板P成 為複數個電子器件隔開特定之間隔沿著基板P之長尺寸方向相連之狀態。亦即，基板P成為多倒角用之基板。 In this manner, the substrate P subjected to each treatment is recovered by the recovery roller FR2. One pattern layer is formed on the substrate P through at least each process of the device manufacturing system 10. As described above, the electronic device is constructed by superposing a plurality of pattern layers. Therefore, in order to generate an electronic device, it is necessary to subject each process of the device manufacturing system 10 shown in FIG. 1 to at least two times. Therefore, the pattern layer can be laminated by attaching the recovery roller FR2 on which the substrate P is wound as the supply roller FR1 to the other device manufacturing system 10. This action is repeated to form an electronic device. After processing the substrate P into A plurality of electronic devices are connected to each other along a long dimension of the substrate P at a specific interval. That is, the substrate P becomes a substrate for multi-chamfering.
回收有以電子器件相連之狀態形成之基板P之回收輥FR2亦可安裝於未圖示之切割裝置。安裝有回收輥FR2之切割裝置係藉由將處理後之基板P按每個電子器件(作為器件形成區域之曝光區域W)進行分割(切割)而使之成為複數個單片之電子器件。基板P之尺寸係例如寬度方向(為短尺寸之方向)之尺寸為10cm~2m左右，長度方向(為長尺寸之方向)之尺寸為10m以上。再者，基板P之尺寸並不限定於上述之尺寸。 The recovery roller FR2 that collects the substrate P formed in a state in which the electronic components are connected to each other may be attached to a cutting device (not shown). The cutting device to which the recovery roller FR2 is mounted is a plurality of monolithic electronic devices by dividing (cutting) the processed substrate P into each electronic device (the exposure region W as a device formation region). The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (direction of the short dimension), and 10 m or more in the longitudinal direction (the direction in the long dimension). Furthermore, the size of the substrate P is not limited to the above-described size.
圖2係表示曝光裝置EX之構成之構成圖。曝光裝置EX係收納於調溫室ECV內。該調溫室ECV係藉由將內部保持為特定之溫度、特定之濕度而抑制於內部被搬送之基板P之因溫度引起之形狀變化，並且被設定為考慮了基板P之吸濕性及伴隨搬送而產生之靜電之帶電等之濕度。調溫室ECV係經由被動或主動之抗振單元SU1、SU2而配置於製造工廠之設置面E。抗振單元SU1、SU2減少來自設置面E之振動。該設置面E既可為工廠之地面本身，亦可為專用地設置於地面上以製造出水平面之設置基座(底座)上之面。曝光裝置EX至少具備基板搬送機構12、同一構成之2個光源裝置(光源)LS(LSa、LSb)、射束切換部(包含電光偏向裝置)BDU、曝光頭(掃描裝置)14、控制裝置16、複數個對準顯微鏡AM1m、AM2m(再者，m=1、2、3、4)、及複數個編碼器ENja、ENjb(再者，j=1、2、3、4)。控制裝置(控制部)16係控制曝光裝置EX之各部者。該控制裝置16包含電腦及記錄有程式之記錄媒體等，藉由該電腦執行程式而作為本第1實施形態之控制裝置16發揮功能。 Fig. 2 is a view showing the configuration of the configuration of the exposure apparatus EX. The exposure apparatus EX is housed in a greenhouse ECV. The greenhouse ECV is controlled to maintain the temperature change due to the temperature of the substrate P that is transported internally by maintaining the internal temperature at a specific temperature and specific humidity, and is set to take into consideration the hygroscopicity of the substrate P and the accompanying transport. And the humidity of the generated static electricity, etc. The greenhouse ECV is placed on the installation surface E of the manufacturing plant via the passive or active anti-vibration units SU1 and SU2. The anti-vibration units SU1, SU2 reduce the vibration from the set surface E. The setting surface E can be either the floor of the factory itself or a surface specially provided on the ground to create a horizontal surface on the base (base). The exposure apparatus EX includes at least a substrate transport mechanism 12, two light source devices (light sources) LS (LSa, LSb) having the same configuration, a beam switching unit (including an electro-optic deflecting device) BDU, an exposure head (scanning device) 14, and a control device 16. A plurality of alignment microscopes AM1m, AM2m (again, m = 1, 2, 3, 4), and a plurality of encoders ENja, ENjb (again, j = 1, 2, 3, 4). The control device (control unit) 16 controls each of the exposure devices EX. The control device 16 includes a computer, a recording medium on which a program is recorded, and the like, and the computer controls the program to function as the control device 16 of the first embodiment.
基板搬送機構12係構成器件製造系統10之上述基板搬送裝置之一部分者，將自處理裝置PR2搬送之基板P於曝光裝置EX內以特定之速度搬送之後，以特定之速度送出至處理裝置PR3。藉由該基板搬送機構12，而規定了於曝光裝置EX內被搬送之基板P之搬送路徑。基板搬送機構12自基板P之搬送方向之上游側(-X方向側)起依序具有邊緣位置控制器EPC、驅動滾筒R1、張力調整滾筒RT1、旋轉筒(圓筒轉筒)DR、張力調整滾筒RT2、驅動滾筒R2、及驅動滾筒R3。 The substrate transfer mechanism 12 constitutes one of the substrate transfer devices of the device manufacturing system 10, and the substrate P transported from the processing device PR2 is transported at a specific speed in the exposure device EX, and then sent to the processing device PR3 at a specific speed. The substrate transport mechanism 12 defines a transport path of the substrate P that is transported in the exposure apparatus EX. The substrate transfer mechanism 12 has an edge position controller EPC, a drive roller R1, a tension adjustment roller RT1, a rotary cylinder (cylinder rotor) DR, and tension adjustment from the upstream side (−X direction side) of the substrate P in the transport direction. The drum RT2, the drive roller R2, and the drive roller R3.
邊緣位置控制器EPC調整自處理裝置PR2搬送之基板P之寬度方向(Y方向且基板P之短尺寸方向)上之位置。亦即，邊緣位置控制器EPC係以呈施加有特定之張力之狀態被搬送之基板P之寬度方向之端部(邊緣)之位置處於相對於目標位置為±十數μm~數十μm左右之範圍(容許範圍)的方式，使基板P於寬度方向移動，而調整基板P於寬度方向上之位置。邊緣位置控制器EPC具有供基板P以施加有特定之張力之狀態架設之滾筒、及檢測基板P之寬度方向之端部(邊緣)之位置之未圖示之邊緣感測器(端部檢測部)。邊緣位置控制器EPC根據上述邊緣感測器檢測出之檢測訊號而使邊緣位置控制器EPC之上述滾筒於Y方向移動，而調整基板P於寬度方向上之位置。驅動滾筒(夾壓滾筒)R1一面保持自邊緣位置控制器EPC搬送之基板P之正背兩面，一面使基板P旋轉，而將基板P朝向旋轉筒DR搬送。再者，邊緣位置控制器EPC亦可以捲繞至旋轉筒DR之基板P之長尺寸方向相對於旋轉筒DR之中心軸AXo始終正交之方式，適當調整基板P於寬度方向上之位置，並且以修正基板P於行進方向上之斜率誤差之方式，適當調整邊緣位置控制器EPC之上述滾筒之旋轉軸 與Y軸之平行度。 The edge position controller EPC adjusts the position in the width direction (the Y direction and the short dimension direction of the substrate P) of the substrate P conveyed from the processing apparatus PR2. In other words, the edge position controller EPC is positioned at an end portion (edge) in the width direction of the substrate P that is conveyed in a state in which a specific tension is applied, and is at about tens of μm to several tens of μm with respect to the target position. The range (permissible range) is such that the substrate P is moved in the width direction to adjust the position of the substrate P in the width direction. The edge position controller EPC has a roller for arranging the substrate P in a state in which a specific tension is applied, and an edge sensor (end portion detecting portion) (not shown) for detecting the position of the end portion (edge) of the substrate P in the width direction. ). The edge position controller EPC moves the roller of the edge position controller EPC in the Y direction according to the detection signal detected by the edge sensor, and adjusts the position of the substrate P in the width direction. The driving roller (nip roller) R1 holds the front and back surfaces of the substrate P conveyed from the edge position controller EPC, and rotates the substrate P to transport the substrate P toward the rotating cylinder DR. Furthermore, the edge position controller EPC can also appropriately adjust the position of the substrate P in the width direction so that the long dimension direction of the substrate P wound to the rotating cylinder DR is always orthogonal to the central axis AXo of the rotating cylinder DR, and The rotation axis of the roller of the edge position controller EPC is appropriately adjusted in such a manner as to correct the slope error of the substrate P in the traveling direction. Parallelism to the Y axis.
旋轉筒DR具有於Y方向延伸並且於與重力起作用之方向交叉之方向延伸之中心軸AXo、及自中心軸AXo固定半徑之圓筒狀之外周面。旋轉筒DR一面沿著該外周面(圓周面)使基板P之一部分於長尺寸方向呈圓筒面狀彎曲地予以支持(保持)，一面以中心軸AXo為中心旋轉而將基板P向+X方向搬送。旋轉筒DR利用其外周面對被投射來自曝光頭14之射束LB(聚焦光SP)之基板P上之區域(部分)予以支持。旋轉筒DR自與供形成電子器件之面(形成有感光面之側之面)為相反側之面(背面)側支持(密接保持)基板P。於旋轉筒DR之Y方向之兩側，設置有以旋轉筒DR繞中心軸AXo旋轉之方式由環狀之軸承支持之軸Sft。該軸Sft係藉由被賦予來自由控制裝置16控制之未圖示之旋轉驅動源(例如馬達或減速機構等)之旋轉轉矩而繞中心軸AXo以固定之旋轉速度旋轉。再者，為方便起見，將包含中心軸AXo且與YZ平面平行之平面稱為中心面Poc。 The rotating cylinder DR has a central axis AXo extending in the Y direction and extending in a direction intersecting the direction in which gravity acts, and a cylindrical outer circumferential surface having a fixed radius from the central axis AXo. The rotating cylinder DR supports (holds) one of the substrates P in a cylindrical shape along the outer peripheral surface (circumferential surface), and rotates the substrate P toward the center by rotating the central axis AXo. Direction transfer. The rotating cylinder DR is supported by a region (portion) on the substrate P facing the beam LB (focusing light SP) projected from the exposure head 14 by its outer circumference. The rotating cylinder DR supports (closely holds) the substrate P from the side (back surface) side opposite to the surface on which the electronic device is formed (the side on which the photosensitive surface is formed). On both sides of the rotating cylinder DR in the Y direction, a shaft Sft supported by a ring-shaped bearing so as to rotate about the central axis AXo of the rotating cylinder DR is provided. The shaft Sft is rotated at a fixed rotational speed about the central axis AXo by a rotational torque supplied from a rotational drive source (for example, a motor or a speed reduction mechanism) controlled by the control device 16. Further, for the sake of convenience, a plane including the central axis AXo and parallel to the YZ plane is referred to as a central plane Poc.
驅動滾筒(夾壓滾筒)R2、R3係沿著基板P之搬送方向(+X方向)隔開特定之間隔而配置，對曝光後之基板P賦予特定之鬆弛量(餘量)。驅動滾筒R2、R3係與驅動滾筒R1同樣地，一面保持基板P之正背兩面，一面使基板P旋轉，而將基板P朝向處理裝置PR3搬送。張力調整滾筒RT1、RT2係向-Z方向被施壓，而對被捲繞至旋轉筒DR且被支持之基板P於長尺寸方向賦予特定之張力。藉此，使施加於旋轉筒DR之被賦予至基板P之長尺寸方向之張力穩定化為特定之範圍內。控制裝置16係藉由控制未圖示之旋轉驅動源(例如馬達或減速機等)而使驅動滾筒R1~R3旋轉。再者，驅動滾筒R1~R3之旋轉軸、及張力調整滾筒RT1、RT2之旋轉軸與 旋轉筒DR之中心軸AXo平行。 The drive rollers (nip rolls) R2 and R3 are arranged at a predetermined interval along the transport direction (+X direction) of the substrate P, and a specific slack amount (balance) is applied to the exposed substrate P. Similarly to the drive roller R1, the drive rollers R2 and R3 rotate the substrate P while holding the front and back surfaces of the substrate P, and transport the substrate P toward the processing device PR3. The tension adjusting rollers RT1 and RT2 are pressed in the -Z direction, and the substrate P that is wound around the rotating cylinder DR and supported is given a specific tension in the longitudinal direction. Thereby, the tension applied to the long dimension direction of the substrate P applied to the rotating cylinder DR is stabilized within a specific range. The control device 16 rotates the drive rollers R1 to R3 by controlling a rotary drive source (for example, a motor or a reducer) (not shown). Furthermore, the rotation axes of the driving rollers R1 to R3 and the rotation axes of the tension adjusting rollers RT1 and RT2 are The central axis AXo of the rotating cylinder DR is parallel.
光源裝置LS(LSa、LSb)產生並射出脈衝狀之射束(脈衝射束、脈衝光、雷射)LB。該射束LB係於370nm以下之波長頻帶具有峰值波長之紫外線光，且將射束LB之發光頻率(振盪頻率、特定頻率)設為Fa。光源裝置LS(LSa、LSb)所射出之射束LB經由射束切換部BDU而入射至曝光頭14。光源裝置LS(LSa、LSb)按照控制裝置16之控制而以發光頻率Fa發出並射出射束LB。該光源裝置LS(LSa、LSb)之構成於下文進行詳細說明，第1實施形態中係使用光纖放大雷射光源(諧波雷射光源)，其係由產生紅外波長區域之脈衝光之半導體雷射元件、光纖放大器、將經放大之紅外波長區域之脈衝光轉換為紫外波長區域之脈衝光之波長轉換元件(諧波產生元件)等構成，能夠獲得振盪頻率Fa為數百MHz且1脈衝光之發光時間為微微秒左右之高亮度之紫外線之脈衝光。再者，存在為了區分來自光源裝置LSa之射束LB、與來自光源裝置LSb之射束LB，而將來自光源裝置LSa之射束LB以LBa表示且將來自光源裝置LSb之射束LB以LBb表示之情形。 The light source device LS (LSa, LSb) generates and emits a pulsed beam (pulse beam, pulsed light, laser) LB. The beam LB is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the light emission frequency (oscillation frequency, specific frequency) of the beam LB is set to Fa. The beam LB emitted from the light source device LS (LSa, LSb) is incident on the exposure head 14 via the beam switching portion BDU. The light source device LS (LSa, LSb) emits at the emission frequency Fa and emits the beam LB in accordance with the control of the control device 16. The configuration of the light source device LS (LSa, LSb) will be described in detail below. In the first embodiment, an optical fiber-amplified laser light source (harmonic laser light source) is used, which is a semiconductor laser that generates pulsed light in an infrared wavelength region. A radiation element, an optical fiber amplifier, a wavelength conversion element (harmonic generating element) that converts pulsed light in an amplified infrared wavelength region into pulsed light in an ultraviolet wavelength region, and the like, and can obtain an oscillation frequency Fa of several hundred MHz and one pulse of light. The illuminating time is a pulsed light of ultraviolet light having a high brightness of about picoseconds. Furthermore, in order to distinguish the beam LB from the light source device LSa with the beam LB from the light source device LSb, the beam LB from the light source device LSa is represented by LBa and the beam LB from the light source device LSb is taken as LBb Indicate the situation.
射束切換部BDU使來自2個光源裝置LS(LSa、LSb)之射束LB(LBa、LBb)入射至構成曝光頭14之複數個掃描單元Un(再者，n=1、2、…、6)中之2個掃描單元Un，並且將射束LB(LBa、LBb)入射之掃描單元Un進行切換。詳細而言，射束切換部BDU使來自光源裝置LSa之射束LBa入射至3個掃描單元U1~U3中之1個掃描單元Un，使來自光源裝置LSb之射束LBb入射至3個掃描單元U4~U6中之1個掃描單元Un。又，射束切換部BDU將射束LBa入射之掃描單元Un於掃描單元U1~U3 之中進行切換，將掃描射束LBb入射之掃描單元Un於掃描單元U4~U6之中進行切換。 The beam switching unit BDU causes the beam LB (LBa, LBb) from the two light source devices LS (LSa, LSb) to enter the plurality of scanning units Un constituting the exposure head 14 (again, n = 1, 2, ..., 6) Two scanning units Un, and the scanning unit Un in which the beam LB (LBa, LBb) is incident is switched. Specifically, the beam switching unit BDU causes the beam LBa from the light source device LSa to enter one of the three scanning units U1 to U3, and causes the beam LBb from the light source device LSb to be incident on the three scanning units. One scanning unit Un in U4~U6. Further, the beam switching unit BDU injects the scanning unit Un of the beam LBa into the scanning units U1 to U3. Among them, switching is performed, and the scanning unit Un in which the scanning beam LBb is incident is switched among the scanning units U4 to U6.
射束切換部BDU係以射束LBn入射至進行聚焦光SP之掃描之掃描單元Un之方式切換射束LBa、LBb入射之掃描單元Un。亦即，射束切換部BDU係使來自光源裝置LSa之射束LBa入射至掃描單元U1~U3中之進行聚焦光SP之掃描之1個掃描單元Un。同樣地，射束切換部BDU係使來自光源裝置LSb之射束LBb入射至掃描單元U4~U6中之進行聚焦光SP之掃描之1個掃描單元Un。關於該射束切換部BDU在下文進行詳細說明。再者，關於掃描單元U1~U3，進行聚焦光SP之掃描之掃描單元Un依照U1→U2→U3之順序切換，關於掃描單元U4~U6，進行聚焦光SP之掃描之掃描單元Un依照U4→U5→U6之順序切換。 The beam switching unit BDU switches the scanning unit Un in which the beams LBa and LBb are incident so that the beam LBn is incident on the scanning unit Un that scans the focused light SP. In other words, the beam switching unit BDU is configured such that the beam LBa from the light source device LSa is incident on one of the scanning units U1 to U3 for scanning the focused light SP. Similarly, the beam switching unit BDU causes the beam LBb from the light source device LSb to enter one scanning unit Un that scans the focused light SP among the scanning units U4 to U6. The beam switching unit BDU will be described in detail below. Further, regarding the scanning units U1 to U3, the scanning unit Un that scans the focused light SP is switched in the order of U1 → U2 → U3, and the scanning unit Un that scans the focused light SP with respect to the scanning units U4 to U6 is in accordance with U4 → The sequence of U5→U6 is switched.
曝光頭14成為將同一構成之複數個掃描單元Un(U1~U6)排列而成之所謂的多射束型之曝光頭。曝光頭14藉由複數個掃描單元Un(U1~U6)於由旋轉筒DR之外周面(圓周面)支持之基板P之一部分描繪圖案。曝光頭14對基板P重複進行電子器件用之圖案曝光，因此被曝光圖案之曝光區域(電子器件形成區域)W沿著基板P之長尺寸方向隔開特定之間隔而設置有複數個(參照圖4)。複數個掃描單元Un(U1~U6)係以特定之配置關係而配置。複數個掃描單元Un(U1~U6)係隔著中心面Poc於基板P之搬送方向以2行呈錯位排列而配置。第奇數號掃描單元U1、U3、U5係在相對於中心面Poc為基板P之搬送方向之上游側(-X方向側)且沿Y方向相隔特定之間隔而配置成1行。第偶數號掃描單元U2、U4、U6係在相對於中心面Poc為基板P之搬送方向之下游側(+X方向側)，沿Y 方向相隔特定之間隔而配置成1行。第奇數號掃描單元U1、U3、U5、與第偶數號掃描單元U2、U4、U6相對於中心面Poc對稱地設置。 The exposure head 14 is a so-called multi-beam type exposure head in which a plurality of scanning units Un (U1 to U6) having the same configuration are arranged. The exposure head 14 draws a pattern on a portion of the substrate P supported by the outer circumferential surface (circumferential surface) of the rotary cylinder DR by a plurality of scanning units Un (U1 to U6). Since the exposure head 14 repeatedly performs pattern exposure for the electronic device on the substrate P, the exposure region (electronic device formation region) W of the exposure pattern is provided at a plurality of intervals along the longitudinal direction of the substrate P (refer to the figure). 4). A plurality of scanning units Un (U1 to U6) are arranged in a specific arrangement relationship. The plurality of scanning units Un (U1 to U6) are arranged in a row in a row in the direction in which the substrate P is conveyed across the center plane Poc. The odd-numbered scanning units U1, U3, and U5 are arranged on the upstream side (the -X direction side) in the conveyance direction of the substrate P with respect to the center plane Poc, and are arranged in one line at a predetermined interval in the Y direction. The even-numbered scanning units U2, U4, and U6 are on the downstream side (+X direction side) of the substrate P in the transport direction with respect to the center plane Poc, along the Y The directions are arranged in one line at a specific interval. The odd-numbered scanning units U1, U3, U5 and the even-numbered scanning units U2, U4, U6 are symmetrically arranged with respect to the center plane Poc.
各掃描單元Un(U1~U6)係一面將來自光源裝置LS(LSa、LSb)之射束LB以於基板P之被照射面上收斂成聚焦光SP之方式投射，一面將該聚焦光SP藉由旋轉之多角鏡PM(參照圖5)一維地掃描。藉由該各掃描單元Un(U1~U6)之多角鏡(偏向構件)PM，聚焦光SP於基板P之被照射面上一維地掃描。藉由該聚焦光SP之掃描，於基板P上(基板P之被照射面上)規定出描繪1行量之圖案之直線性之描繪線(掃描線)SLn(再者，n=1、2、…、6)。關於該掃描單元Un之構成，於下文進行詳細說明。 Each of the scanning units Un (U1 to U6) projects the beam LB from the light source device LS (LSa, LSb) so that the irradiated surface of the substrate P converges into the focused light SP, and the focused light SP is borrowed. It is scanned one-dimensionally by the rotating polygon mirror PM (refer to FIG. 5). The focused light SP is scanned one-dimensionally on the illuminated surface of the substrate P by the polygon mirror (biasing member) PM of each of the scanning units Un (U1 to U6). By scanning the focused light SP, a linear drawing line (scanning line) SLn for drawing a pattern of one line is specified on the substrate P (the surface to be irradiated on the substrate P) (again, n=1, 2) ,...,6). The configuration of the scanning unit Un will be described in detail below.
掃描單元U1沿著描繪線SL1掃描聚焦光SP，同樣地，掃描單元U2~U6沿著描繪線SL2~SL6掃描聚焦光SP。如圖3、圖4所示，複數個掃描單元Un(U1~U6)之描繪線SLn(SL1~SL6)被設定為於Y方向(基板P之寬度方向、主掃描方向)上接合而不相互分離。再者，存在將經由射束切換部BDU入射至掃描單元Un之來自光源裝置LS(LSa、LSb)之射束LB表示為LBn之情形。而且，存在將入射至掃描單元U1之射束LBn以LB1表示，同樣地，將入射至掃描單元U2~U6之射束LBn以LB2~LB6表示之情形。該描繪線SLn(SL1~SL6)係示出藉由掃描單元Un(U1~U6)而掃描之射束LBn(LB1~LB6)之聚焦光SP之掃描軌跡者。入射至掃描單元Un之射束LBn可為向特定之方向偏光後之直線偏光(P偏光或S偏光)之射束，本第1實施形態中設為P偏光之射束。 The scanning unit U1 scans the focused light SP along the drawing line SL1, and similarly, the scanning units U2 to U6 scan the focused light SP along the drawing lines SL2 to SL6. As shown in FIGS. 3 and 4, the drawing lines SLn (SL1 to SL6) of the plurality of scanning units Un (U1 to U6) are set to be joined in the Y direction (the width direction of the substrate P and the main scanning direction) without being mutually joined. Separation. Further, there is a case where the beam LB from the light source device LS (LSa, LSb) incident on the scanning unit Un via the beam switching unit BDU is represented as LBn. Further, the beam LBn incident on the scanning unit U1 is represented by LB1, and similarly, the beam LBn incident on the scanning units U2 to U6 is represented by LB2 to LB6. The drawing line SLn (SL1 to SL6) shows the scanning trajectory of the focused light SP of the beam LBn (LB1 to LB6) scanned by the scanning unit Un (U1 to U6). The beam LBn incident on the scanning unit Un may be a beam of linearly polarized light (P-polarized or S-polarized light) polarized in a specific direction, and is a beam of P-polarized light in the first embodiment.
如圖4所示，以複數個掃描單元Un(U1~U6)全部覆蓋曝光區域W之寬度方向之全部之方式，各掃描單元Un(U1~U6)分擔掃描 區域。藉此，各掃描單元Un(U1~U6)可於在基板P之寬度方向分割成之複數個區域(描繪範圍)分別描繪圖案。例如，若將1個掃描單元Un之Y方向之掃描長度(描繪線SLn之長度)設為20~60mm左右，則藉由將第奇數號掃描單元U1、U3、U5之3個、與第偶數號掃描單元U2、U4、U6之3個之共計6個掃描單元Un於Y方向配置，而將可描繪之Y方向之寬度擴寬至120~360mm左右。各描繪線SLn(SL1~SL6)之長度(描繪範圍之長度)原則上設為相同。亦即，沿著描繪線SL1~SL6之各者掃描之射束LBn之聚焦光SP之掃描距離原則上設為相同。再者，於欲擴寬曝光區域W之寬度之情形時，可藉由延長描繪線SLn自身之長度或者增加於Y方向配置之掃描單元Un之數量來應對。 As shown in FIG. 4, each of the scanning units Un (U1 to U6) shares the scanning in such a manner that all of the scanning units Un (U1 to U6) cover the entire width direction of the exposure area W. region. Thereby, each of the scanning units Un (U1 to U6) can draw a pattern in each of a plurality of regions (drawing ranges) divided in the width direction of the substrate P. For example, when the scanning length of the Y-direction of one scanning unit Un (the length of the drawing line SLn) is about 20 to 60 mm, three of the odd-numbered scanning units U1, U3, and U5 and the even number are used. A total of six scanning units Un of the three scanning units U2, U4, and U6 are arranged in the Y direction, and the width of the usable Y direction is widened to about 120 to 360 mm. The length of each drawing line SLn (SL1 to SL6) (the length of the drawing range) is basically the same. That is, the scanning distances of the focused lights SP of the beams LBn scanned along the respective drawing lines SL1 to SL6 are basically the same. Further, in the case where the width of the exposure region W is to be widened, it is possible to cope with the increase in the length of the drawing line SLn itself or the number of scanning units Un arranged in the Y direction.
再者，實際之各描繪線SLn(SL1~SL6)被設定為較聚焦光SP於被照射面上實際可掃描之最大之長度(最大掃描長度)略短。例如，若將於主掃描方向(Y方向)之描繪倍率為初始值(未修正倍率)之情形時可描繪圖案之描繪線SLn之掃描長度設為30mm，則聚焦光SP於被照射面上之最大掃描長度係使描繪線SLn之描繪開始點(掃描開始點)側與描繪結束點(掃描結束點)側之各者具有0.5mm左右之餘裕而被設定為31mm左右。藉由如此般設定，可於聚焦光SP之最大掃描長度31mm之範圍內，將30mm之描繪線SLn之位置於主掃描方向進行微調整，或者對描繪倍率進行微調整。聚焦光SP之最大掃描長度並不限定於31mm，而係主要由掃描單元Un內之設置於多角鏡(旋轉多角鏡)PM之後的f θ透鏡FT(參照圖5)之口徑決定。 Furthermore, the actual respective drawing lines SLn (SL1 to SL6) are set to be slightly shorter than the maximum length (maximum scanning length) that the focused light SP actually scans on the illuminated surface. For example, when the drawing magnification of the drawable pattern SLn is set to 30 mm in the case where the drawing magnification in the main scanning direction (Y direction) is the initial value (uncorrected magnification), the focused light SP is on the illuminated surface. The maximum scanning length is set to a margin of about 31 mm by a margin of about 0.5 mm for each of the drawing start point (scanning start point) side and the drawing end point (scanning end point) side of the drawing line SLn. By setting in this way, the position of the drawing line SLn of 30 mm can be finely adjusted in the main scanning direction within the range of the maximum scanning length of the focused light SP of 31 mm, or the drawing magnification can be finely adjusted. The maximum scanning length of the focused light SP is not limited to 31 mm, and is mainly determined by the aperture of the f θ lens FT (see FIG. 5) provided in the scanning unit Un after the polygon mirror (rotary polygon mirror) PM.
多條描繪線SLn(SL1~SL6)係隔著中心面Poc於旋轉筒 DR之圓周方向以2行呈錯位排列而配置。第奇數號描繪線SL1、SL3、SL5位於相對於中心面Poc為基板P之搬送方向之上游側(-X方向側)之基板P之被照射面上。第偶數號描繪線SL2、SL4、SL6位於相對於中心面Poc為基板P之搬送方向之下游側(+X方向側)之基板P之被照射面上。描繪線SL1~SL6係與基板P之寬度方向、亦即旋轉筒DR之中心軸AXo大致並行。 A plurality of drawing lines SLn (SL1 to SL6) are rotated around the center plane Poc The circumferential direction of the DR is arranged in two rows in a staggered arrangement. The odd-numbered drawing lines SL1, SL3, and SL5 are located on the illuminated surface of the substrate P on the upstream side (the -X direction side) of the substrate P in the transport direction with respect to the center plane Poc. The even-numbered drawing lines SL2, SL4, and SL6 are located on the illuminated surface of the substrate P on the downstream side (+X-direction side) of the substrate P in the transport direction with respect to the center plane Poc. The drawing lines SL1 to SL6 are substantially parallel to the width direction of the substrate P, that is, the central axis AXo of the rotating cylinder DR.
描繪線SL1、SL3、SL5沿著基板P之寬度方向(主掃描方向)隔開特定之間隔而於直線上排列成1行。描繪線SL2、SL4、SL6亦同樣地，沿著基板P之寬度方向(主掃描方向)隔開特定之間隔而於直線上排列成1行。此時，描繪線SL2於基板P之寬度方向上配置於描繪線SL1與描繪線SL3之間。同樣地，描繪線SL3於基板P之寬度方向上配置於描繪線SL2與描繪線SL4之間。描繪線SL4於基板P之寬度方向上配置於描繪線SL3與描繪線SL5之間，描繪線SL5於基板P之寬度方向上配置於描繪線SL4與描繪線SL6之間。如此，多條描繪線SLn(SL1~SL6)於Y方向(主掃描方向)上以相互錯開之方式配置。 The drawing lines SL1, SL3, and SL5 are arranged in a line on the straight line at a predetermined interval along the width direction (main scanning direction) of the substrate P. Similarly, the drawing lines SL2, SL4, and SL6 are arranged in a line on the straight line at a predetermined interval along the width direction (main scanning direction) of the substrate P. At this time, the drawing line SL2 is disposed between the drawing line SL1 and the drawing line SL3 in the width direction of the substrate P. Similarly, the drawing line SL3 is disposed between the drawing line SL2 and the drawing line SL4 in the width direction of the substrate P. The drawing line SL4 is disposed between the drawing line SL3 and the drawing line SL5 in the width direction of the substrate P, and the drawing line SL5 is disposed between the drawing line SL4 and the drawing line SL6 in the width direction of the substrate P. In this manner, the plurality of drawing lines SLn (SL1 to SL6) are arranged to be shifted from each other in the Y direction (main scanning direction).
沿著第奇數號描繪線SL1、SL3、SL5之各者掃描之射束LB1、LB3、LB5之聚焦光SP之主掃描方向成為一維之方向，且成為同一方向。沿著第偶數號描繪線SL2、SL4、SL6之各者掃描之射束LB2、LB4、LB6之聚焦光SP之主掃描方向成為一維之方向，且成為同一方向。沿著該描繪線SL1、SL3、SL5掃描之射束LB1、LB3、LB5之聚焦光SP之主掃描方向、與沿著描繪線SL2、SL4、SL6掃描之射束LB2、LB4、LB6之聚焦光SP之主掃描方向亦可互為相反方向。本第1實施形態中，沿著描繪線SL1、SL3、 SL5掃描之射束LB1、LB3、LB5之聚焦光SP之主掃描方向為-Y方向。又，沿著描繪線SL2、SL4、SL6掃描之射束LB2、LB4、LB6之聚焦光SP之主掃描方向為+Y方向。藉此，描繪線SL1、SL3、SL5之描繪開始點側之端部、與描繪線SL2、SL4、SL6之描繪開始點側之端部於Y方向上鄰接或一部分重複。又，描繪線SL3、SL5之描繪結束點側之端部、與描繪線SL2、SL4之描繪結束點側之端部於Y方向上鄰接或一部分重複。於以使在Y方向相鄰之描繪線SLn之端部彼此一部分重複之方式配置各描繪線SLn之情形時，例如宜在相對於各描繪線SLn之長度而言包含描繪開始點、或描繪結束點在內於Y方向數%以下之範圍內使之重複。再者，所謂將描繪線SLn於Y方向接合，意味著使描繪線SLn之端部彼此於Y方向上鄰接或一部分重複。 The main scanning direction of the focused light SP of the beams LB1, LB3, and LB5 scanned along each of the odd-numbered drawing lines SL1, SL3, and SL5 is one-dimensional and becomes the same direction. The main scanning directions of the focused lights SP of the beams LB2, LB4, and LB6 scanned along the even-numbered drawing lines SL2, SL4, and SL6 are in the one-dimensional direction and are in the same direction. The main scanning direction of the focused light SP of the beams LB1, LB3, LB5 scanned along the drawing lines SL1, SL3, SL5, and the focused light of the beams LB2, LB4, LB6 scanned along the drawing lines SL2, SL4, SL6 The main scanning directions of the SPs can also be opposite to each other. In the first embodiment, along the drawing lines SL1 and SL3, The main scanning direction of the focused light SP of the SL5 scanning beams LB1, LB3, LB5 is the -Y direction. Further, the main scanning direction of the focused light SP of the beams LB2, LB4, and LB6 scanned along the drawing lines SL2, SL4, and SL6 is the +Y direction. Thereby, the end portions on the drawing start point side of the drawing lines SL1, SL3, and SL5 and the end portions on the drawing start point side of the drawing lines SL2, SL4, and SL6 are adjacent or partially overlapped in the Y direction. Further, the end portions on the drawing end point side of the drawing lines SL3 and SL5 and the end portions on the drawing end point side of the drawing lines SL2 and SL4 are adjacent or partially overlapped in the Y direction. When the respective drawing lines SLn are arranged such that the end portions of the drawing lines SLn adjacent to each other in the Y direction are overlapped with each other, for example, it is preferable to include the drawing start point or the drawing end with respect to the length of each drawing line SLn. The point is repeated within a range of several % or less in the Y direction. In addition, joining the drawing line SLn in the Y direction means that the end portions of the drawing line SLn are adjacent to each other or partially overlapped in the Y direction.
再者，描繪線SLn之副掃描方向之寬度(X方向之尺寸)係與聚焦光SP之大小(直徑)φ相應之粗細度。例如，於聚焦光SP之大小(尺寸)φ為3μm之情形時，描繪線SLn之寬度亦為3μm。聚焦光SP亦可以重疊特定之長度(例如設為聚焦光SP之大小φ之7/8)之方式沿著描繪線SLn投射。又，於將在Y方向相鄰之描繪線SLn(例如描繪線SL1與描繪線SL2)彼此相互連接之情形時亦以重疊特定之長度(例如聚焦光SP之大小φ之7/8)為宜。 Further, the width (the size in the X direction) of the sub-scanning direction of the drawing line SLn is the thickness corresponding to the size (diameter) φ of the focused light SP. For example, when the size (size) φ of the focused light SP is 3 μm, the width of the drawing line SLn is also 3 μm. The focused light SP can also be projected along the drawing line SLn in such a manner that a specific length (for example, 7/8 of the size φ of the focused light SP) is overlapped. Further, in the case where the drawing lines SLn adjacent to each other in the Y direction (for example, the drawing line SL1 and the drawing line SL2) are connected to each other, it is preferable to overlap a specific length (for example, 7/8 of the size φ of the focused light SP). .
於本第1實施形態之情形時，來自光源裝置LS(LSa、LSb)之射束LB(LBa、LBb)為脈衝光，因此於主掃描期間投射至描繪線SLn上之聚焦光SP根據射束LB(LBa、LBb)之振盪頻率Fa(例如400MHz)而離散。因此，必須使藉由射束LB之1脈衝光投射之聚焦光SP與藉由下 一個1脈衝光投射之聚焦光SP於主掃描方向重疊。該重疊之量係根據聚焦光SP之大小φ、聚焦光SP之掃描速度(主掃描之速度)Vs、及射束LB之振盪頻率Fa而設定。聚焦光SP之有效大小φ係於聚焦光SP之強度分佈以高斯分佈近似之情形時由聚焦光SP之波峰強度之1/e2(或1/2)決定。本第1實施形態中，以聚焦光SP重疊相對於有效大小(尺寸)φ而言之φ×7/8左右之方式，設定聚焦光SP之掃描速度Vs及振盪頻率Fa。因此，聚焦光SP之沿著主掃描方向之投射間隔成為φ/8。因此，較理想為，於副掃描方向(與描繪線SLn正交之方向)上亦設定為，於沿著描繪線SLn之聚焦光SP之1次掃描與下一次掃描之間，基板P移動聚焦光SP之有效大小φ之大致1/8之距離。又，於基板P上之感光性功能層之曝光量之設定可藉由射束LB(脈衝光)之峰值之調整而實現，但於在不提高射束LB之強度之狀況下欲增大曝光量之情形時，只要藉由聚焦光SP之主掃描方向之掃描速度Vs之降低、射束LB之振盪頻率Fa之增大、或基板P之副掃描方向之搬送速度Vt之降低等之任一種方法來增加聚焦光SP於主掃描方向或副掃描方向上之重疊量即可。聚焦光SP之主掃描方向之掃描速度Vs係與多角鏡PM之轉數(旋轉速度Vp)成比例地變快。 In the case of the first embodiment, since the beams LB (LBa, LBb) from the light source devices LS (LSa, LSb) are pulsed light, the focused light SP projected onto the drawing line SLn during the main scanning period is based on the beam. The oscillation frequency Fa (for example, 400 MHz) of LB (LBa, LBb) is discrete. Therefore, it is necessary to overlap the focused light SP projected by the one pulse light of the beam LB and the focused light SP projected by the next one pulse light in the main scanning direction. The amount of overlap is set in accordance with the magnitude φ of the focused light SP, the scanning speed of the focused light SP (the speed of the main scanning) Vs, and the oscillation frequency Fa of the beam LB. The effective size φ of the focused light SP is determined by the 1/e 2 (or 1/2) of the peak intensity of the focused light SP when the intensity distribution of the focused light SP is approximated by a Gaussian distribution. In the first embodiment, the scanning speed Vs and the oscillation frequency Fa of the focused light SP are set such that the focused light SP overlaps with respect to the effective size (size) φ by about φ × 7/8. Therefore, the projection interval of the focused light SP along the main scanning direction becomes φ/8. Therefore, it is preferable that the sub-scanning direction (the direction orthogonal to the drawing line SLn) is also set such that the substrate P moves the focus between the first scanning and the next scanning of the focused light SP along the drawing line SLn. The effective size φ of the light SP is approximately 1/8 of the distance. Moreover, the setting of the exposure amount of the photosensitive functional layer on the substrate P can be realized by adjusting the peak value of the beam LB (pulse light), but the exposure is increased without increasing the intensity of the beam LB. In the case of the amount, the scanning speed Vs in the main scanning direction of the focused light SP is decreased, the oscillation frequency Fa of the beam LB is increased, or the transport speed Vt in the sub-scanning direction of the substrate P is lowered. The method may increase the amount of overlap of the focused light SP in the main scanning direction or the sub-scanning direction. The scanning speed Vs of the main scanning direction of the focused light SP becomes faster in proportion to the number of revolutions (rotation speed Vp) of the polygon mirror PM.
各掃描單元Un(U1~U6)係以於至少XZ平面內各射束LBn朝向旋轉筒DR之中心軸AXo行進之方式將各射束LBn朝向基板P照射。藉此，自各掃描單元Un(U1~U6)朝向基板P行進之射束LBn之光路(射束中心軸)於XZ平面與基板P之被照射面之法線平行。又，各掃描單元Un(U1~U6)以照射於描繪線SLn(SL1~SL6)之射束LBn於與YZ平面平行之面內相對於基板P之被照射面垂直之方式將射束LBn朝向基板P照 射。即，於被照射面上之聚焦光SP之主掃描方向上，投射至基板P之射束LBn(LB1~LB6)以遠心之狀態掃描。此處，將通過藉由各掃描單元Un(U1~U6)所規定之特定之描繪線SLn(SL1~SL6)之各中點且與基板P之被照射面垂直之線(或亦稱為光軸)稱為照射中心軸Len(Le1~Le6)。 Each of the scanning units Un (U1 to U6) irradiates each of the beams LBn toward the substrate P so that at least the respective beams LBn in the XZ plane travel toward the central axis AXo of the rotating cylinder DR. Thereby, the optical path (beam center axis) of the beam LBn traveling from the respective scanning units Un (U1 to U6) toward the substrate P is parallel to the normal line of the irradiated surface of the substrate P on the XZ plane. Further, each scanning unit Un (U1 to U6) directs the beam LBn so that the beam LBn irradiated on the drawing line SLn (SL1 to SL6) is perpendicular to the illuminated surface of the substrate P in a plane parallel to the YZ plane. Substrate P photo Shoot. That is, the beam LBn (LB1 to LB6) projected onto the substrate P in the main scanning direction of the focused light SP on the illuminated surface is scanned in a state of telecentricity. Here, a line (or also referred to as light) which is perpendicular to the illuminated surface of the substrate P by the midpoints of the specific drawing lines SLn (SL1 to SL6) defined by the respective scanning units Un (U1 to U6) The axis is called the illumination center axis Len (Le1 to Le6).
該各照射中心軸Len(Le1~Le6)成為於XZ平面連結描繪線SL1~SL6與中心軸AXo之線。第奇數號掃描單元U1、U3、U5之各者之照射中心軸Le1、Le3、Le5於XZ平面成為同一方向，第偶數號掃描單元U2、U4、U6之各者之照射中心軸Le2、Le4、Le6於XZ平面成為同一方向。又，照射中心軸Le1、Le3、Le5與照射中心軸Le2、Le4、Le6被設定為於XZ平面相對於中心面Poc之角度成為±θ 1(參照圖2)。 Each of the irradiation center axes Len (Le1 to Le6) is a line connecting the drawing lines SL1 to SL6 and the central axis AXo on the XZ plane. The illumination center axes Le1, Le3, and Le5 of the odd-numbered scanning units U1, U3, and U5 are in the same direction on the XZ plane, and the illumination center axes Le2, Le4 of the even-numbered scanning units U2, U4, and U6 are Le6 becomes the same direction in the XZ plane. Further, the irradiation central axes Le1, Le3, and Le5 and the irradiation central axes Le2, Le4, and Le6 are set such that the angle of the XZ plane with respect to the center plane Poc becomes ±θ 1 (see FIG. 2).
圖2所示之複數個對準顯微鏡AM1m(AM11~AM14)、AM2m(AM21~AM24)係用以檢測圖4所示之形成於基板P之複數個對準標記MKm(MK1~MK4)者，且沿Y方向設置有複數個(本第1實施形態中為4個)。複數個對準標記MKm(MK1~MK4)係用以使描繪於基板P之被照射面上之曝光區域W之特定之圖案與基板P相對地對位(對準)的基準標記。複數個對準顯微鏡AM1m(AM11~AM14)、AM2m(AM21~AM24)係於由旋轉筒DR之外周面(圓周面)所支持之基板P上檢測複數個對準標記MKm(MK1~MK4)。複數個對準顯微鏡AM1m(AM11~AM14)設置於較來自曝光頭14之射束LBn(LB1~LB6)之聚焦光SP所照射的基板P上之被照射區域(由描繪線SL1~SL6包圍之區域)更靠基板P之搬送方向之上游側(-X方向側)。又，複數個對準顯微鏡AM2m(AM21~AM24)設置於較來自曝光頭14之射束LBn(LB1~LB6)之聚焦光SP所照射的基板P 上之被照射區域(由描繪線SL1~SL6包圍之區域)更靠基板P之搬送方向之下游側(+X方向側)。 The plurality of alignment microscopes AM1m (AM11~AM14) and AM2m (AM21~AM24) shown in FIG. 2 are used to detect a plurality of alignment marks MKm (MK1~MK4) formed on the substrate P shown in FIG. Further, a plurality of them are provided in the Y direction (four in the first embodiment). The plurality of alignment marks MKm (MK1 to MK4) are reference marks for aligning (aligning) the specific pattern of the exposure region W drawn on the illuminated surface of the substrate P with respect to the substrate P. A plurality of alignment microscopes AM1m (AM11 to AM14) and AM2m (AM21 to AM24) detect a plurality of alignment marks MKm (MK1 to MK4) on the substrate P supported by the outer circumferential surface (circumferential surface) of the rotary cylinder DR. A plurality of alignment microscopes AM1m (AM11 to AM14) are disposed on the substrate P irradiated on the substrate P irradiated by the focused light SP from the beam LBn (LB1 to LB6) of the exposure head 14 (are surrounded by the drawing lines SL1 to SL6) The area) is further on the upstream side (the −X direction side) of the transfer direction of the substrate P. Further, a plurality of alignment microscopes AM2m (AM21 to AM24) are disposed on the substrate P irradiated by the focused light SP of the beam LBn (LB1 to LB6) from the exposure head 14. The upper irradiated area (the area surrounded by the drawing lines SL1 to SL6) is further on the downstream side (+X direction side) of the substrate P in the transport direction.
對準顯微鏡AM1m(AM11~AM14)、AM2m(AM21~AM24)具有：光源，其將對準用之照明光投射至基板P；觀察光學系統(包含物鏡)，其獲得基板P之表面之包含對準標記MKm之局部區域(觀察區域)Vw1m(Vw11~Vw14)、Vw2m(Vw21~Vw24)之放大像；及CCD、CMOS等攝像元件，其等在基板P於搬送方向移動期間，利用與基板P之搬送速度Vt相應之高速快門拍攝該放大像。複數個對準顯微鏡AM1m(AM11~AM14)、AM2m(AM21~AM24)之各者所拍攝之攝像訊號(圖像資料)被送至控制裝置16。控制裝置16之標記位置檢測部106(參照圖12)藉由進行該送來之複數個攝像訊號之圖像解析，而檢測基板P上之對準標記MKm(MK1~MK4)之位置(標記位置資訊)。再者，對準用之照明光係相對於基板P上之感光性功能層基本不具有感度之波長區域之光、例如波長500~800nm左右之光。 The alignment microscopes AM1m (AM11~AM14) and AM2m (AM21~AM24) have a light source that projects illumination light for alignment onto the substrate P, and an observation optical system (including an objective lens) that obtains alignment of the surface of the substrate P. An enlarged image of a local region (observation region) Vw1m (Vw11 to Vw14) and Vw2m (Vw21 to Vw24) of the mark MKm; and an image pickup device such as a CCD or a CMOS, and the substrate P is used while the substrate P is moved in the transport direction. The high-speed shutter corresponding to the transport speed Vt captures the magnified image. The image pickup signals (image data) taken by each of the plurality of alignment microscopes AM1m (AM11 to AM14) and AM2m (AM21 to AM24) are sent to the control device 16. The mark position detecting unit 106 (see FIG. 12) of the control device 16 detects the position of the alignment mark MKm (MK1 to MK4) on the substrate P by performing image analysis of the plurality of supplied image signals (mark position) News). Further, the illumination light for alignment is substantially no light having a wavelength region of sensitivity with respect to the photosensitive functional layer on the substrate P, for example, light having a wavelength of about 500 to 800 nm.
複數個對準標記MK1~MK4設置於各曝光區域W之周圍。對準標記MK1、MK4係於曝光區域W之基板P之寬度方向之兩側沿著基板P之長尺寸方向以固定之間隔Dh形成有複數個。對準標記MK1形成於基板P之寬度方向之-Y方向側，對準標記MK4形成於基板P之寬度方向之+Y方向側。此種對準標記MK1、MK4配置成，於基板P未受到較大之張力或接受熱製程而變形之狀態下，於基板P之長尺寸方向(X方向)上成為同一位置。進而，對準標記MK2、MK3係於對準標記MK1與對準標記MK4之間且曝光區域W之+X方向側與-X方向側之空白部沿著基板P之寬度方 向(短尺寸方向)形成。對準標記MK2、MK3形成於曝光區域W與曝光區域W之間。對準標記MK2形成於基板P之寬度方向之-Y方向側，對準標記MK3形成於基板P之+Y方向側。 A plurality of alignment marks MK1 to MK4 are disposed around each of the exposure regions W. The alignment marks MK1 and MK4 are formed on the both sides in the width direction of the substrate P in the exposure region W at a fixed interval Dh along the longitudinal direction of the substrate P. The alignment mark MK1 is formed on the -Y direction side in the width direction of the substrate P, and the alignment mark MK4 is formed on the +Y direction side in the width direction of the substrate P. The alignment marks MK1 and MK4 are disposed so as to be in the same position in the long dimension direction (X direction) of the substrate P in a state where the substrate P is not deformed by a large tension or subjected to a heat process. Further, the alignment marks MK2 and MK3 are disposed between the alignment mark MK1 and the alignment mark MK4, and the blank portion of the +X direction side and the -X direction side of the exposure region W is along the width of the substrate P. It is formed in the direction of (short dimension). The alignment marks MK2, MK3 are formed between the exposure region W and the exposure region W. The alignment mark MK2 is formed on the -Y direction side in the width direction of the substrate P, and the alignment mark MK3 is formed on the +Y direction side of the substrate P.
進而，排列於基板P之-Y方向側之端部之對準標記MK1與空白部之對準標記MK2之Y方向之間隔、空白部之對準標記MK2與對準標記MK3之Y方向之間隔、及排列於基板P之+Y方向側之端部之對準標記MK4與空白部之對準標記MK3之Y方向之間隔均設定為相同距離。該等對準標記MKm(MK1~MK4)可於第1層之圖案層之形成時一併形成。例如，可於曝光第1層之圖案時，於供曝光圖案之曝光區域W之周圍將對準標記用之圖案亦一併曝光。再者，對準標記MKm亦可形成於曝光區域W內。例如，可於曝光區域W內且沿著曝光區域W之輪廓而形成。又，亦可將形成於曝光區域W內之電子器件之圖案中之特定位置之圖案部分、或特定形狀之部分用作對準標記MKm。 Further, the interval between the alignment mark MK1 of the end portion on the -Y direction side of the substrate P and the alignment mark MK2 of the blank portion in the Y direction, the interval between the alignment mark MK2 of the blank portion and the Y direction of the alignment mark MK3 The distance between the alignment mark MK4 arranged at the end on the +Y direction side of the substrate P and the alignment mark MK3 of the blank portion is set to be the same distance. The alignment marks MKm (MK1 to MK4) can be formed together at the time of formation of the pattern layer of the first layer. For example, when the pattern of the first layer is exposed, the pattern for the alignment mark is also exposed at all around the exposure region W for the exposure pattern. Further, the alignment mark MKm may also be formed in the exposure region W. For example, it may be formed in the exposed region W and along the contour of the exposed region W. Further, a pattern portion at a specific position in the pattern of the electronic device formed in the exposure region W or a portion of a specific shape may be used as the alignment mark MKm.
如圖4所示，對準顯微鏡AM11、AM21係以拍攝存在於物鏡之觀察區域(檢測區域)Vw11、Vw21內之對準標記MK1之方式配置。同樣地，對準顯微鏡AM12~AM14、AM22~AM24係以拍攝存在於物鏡之觀察區域Vw12~Vw14、Vw22~Vw24內之對準標記MK2~MK4之方式配置。因此，複數個對準顯微鏡AM11~AM14、AM21~AM24係與複數個對準標記MK1~MK4之位置對應地，自基板P之-Y方向側起依照AM11~AM14、AM21~AM24之順序沿著基板P之寬度方向設置。再者，於圖3中，省略了對準顯微鏡AM2m(AM21~AM24)之觀察區域Vw2m(Vw21~Vw24)之圖示。 As shown in FIG. 4, the alignment microscopes AM11 and AM21 are arranged to capture the alignment marks MK1 existing in the observation areas (detection areas) Vw11 and Vw21 of the objective lens. Similarly, the alignment microscopes AM12 to AM14 and AM22 to AM24 are arranged to capture the alignment marks MK2 to MK4 existing in the observation areas Vw12 to Vw14 and Vw22 to Vw24 of the objective lens. Therefore, a plurality of alignment microscopes AM11~AM14 and AM21~AM24 are associated with the positions of the plurality of alignment marks MK1 to MK4, and are arranged in the order of AM11~AM14 and AM21~AM24 from the -Y direction side of the substrate P. The substrate P is disposed in the width direction. Further, in FIG. 3, illustration of the observation region Vw2m (Vw21 to Vw24) of the alignment microscope AM2m (AM21 to AM24) is omitted.
複數個對準顯微鏡AM1m(AM11~AM14)係設置成，於X方向上，曝光位置(描繪線SL1~SL6)與觀察區域Vw1m(Vw11~Vw14)之距離變得短於曝光區域W之X方向之長度。複數個對準顯微鏡AM2m(AM21~AM24)亦同樣地設置成，於X方向上，曝光位置(描繪線SL1~SL6)與觀察區域Vw2m(Vw21~Vw24)之距離變得短於曝光區域W之X方向之長度。再者，於Y方向設置之對準顯微鏡AM1m、AM2m之數量可根據於基板P之寬度方向形成之對準標記MKm之數量而變更。又，各觀察區域Vw1m(Vw11~Vw14)、Vw2m(Vw21~Vw24)之基板P之被照射面上之大小係根據對準標記MK1~MK4之大小或對準精度(位置測量精度)而設定，為100~500μm見方左右之大小。 A plurality of alignment microscopes AM1m (AM11 to AM14) are arranged such that in the X direction, the distance between the exposure position (drawing lines SL1 to SL6) and the observation region Vw1m (Vw11 to Vw14) becomes shorter than the X direction of the exposure region W. The length. A plurality of alignment microscopes AM2m (AM21 to AM24) are similarly arranged such that the distance between the exposure position (drawing lines SL1 to SL6) and the observation area Vw2m (Vw21 to Vw24) becomes shorter than the exposure area W in the X direction. The length of the X direction. Further, the number of the alignment microscopes AM1m and AM2m provided in the Y direction can be changed in accordance with the number of alignment marks MKm formed in the width direction of the substrate P. Further, the size of the irradiated surface of the substrate P of each of the observation regions Vw1m (Vw11 to Vw14) and Vw2m (Vw21 to Vw24) is set according to the size of the alignment marks MK1 to MK4 or the alignment accuracy (position measurement accuracy). It is about 100~500μm square.
如圖3所示，於旋轉筒DR之兩端部，設置有遍及旋轉筒DR之外周面之圓周方向之整體而形成為環狀的具有刻度之刻度尺部SDa、SDb。該刻度尺部SDa、SDb係於旋轉筒DR之外周面之圓周方向以固定之間距(例如20μm)刻設有凹狀或凸狀之柵線之繞射光柵，且構成為增量型之刻度尺。該刻度尺部SDa、SDb繞中心軸AXo而與旋轉筒DR一體地旋轉。作為讀取刻度尺部SDa、SDb之刻度尺讀取頭之複數個編碼器ENja、ENjb(再者，j=1、2、3、4)係以與該刻度尺部SDa、SDb對向之方式設置(參照圖2、圖3)。再者，於圖3中，省略了編碼器EN4a、EN4b之圖示。 As shown in FIG. 3, at both end portions of the rotary cylinder DR, scaled portions SDa and SDb which are formed in a ring shape over the entire circumferential direction of the outer circumferential surface of the rotary cylinder DR are provided. The scale portions SDa and SDb are diffraction gratings having concave or convex gate lines at a fixed distance (for example, 20 μm) in the circumferential direction of the outer circumferential surface of the rotary cylinder DR, and are configured as incremental scales. ruler. The scale portions SDa and SDb rotate integrally with the rotary cylinder DR around the central axis AXo. A plurality of encoders ENja and ENjb (again, j=1, 2, 3, 4) which read the scale reading heads of the scale portions SDa and SDb are opposed to the scale portions SDa and SDb. Mode setting (refer to Figure 2 and Figure 3). Furthermore, in FIG. 3, the illustration of the encoders EN4a and EN4b is omitted.
編碼器ENja、ENjb係光學性地檢測旋轉筒DR之旋轉角度位置者。與設置於旋轉筒DR之-Y方向側之端部之刻度尺部SDa對向地，設置有4個編碼器ENja(EN1a、EN2a、EN3a、EN4a)。同樣地，與設置於旋轉筒DR之+Y方向側之端部之刻度尺部SDb對向地，設置有4個編碼器 ENjb(EN1b、EN2b、EN3b、EN4b)。 The encoders ENja and ENjb optically detect the rotational angular position of the rotating cylinder DR. Four encoders ENja (EN1a, EN2a, EN3a, EN4a) are provided opposite to the scale portion SDa provided at the end portion on the -Y direction side of the rotary cylinder DR. Similarly, four encoders are provided opposite to the scale portion SDb provided at the end portion of the rotary cylinder DR on the +Y direction side. ENjb (EN1b, EN2b, EN3b, EN4b).
編碼器EN1a、EN1b係設置在相對於中心面Poc為基板P之搬送方向之上游側(-X方向側)，且配置於設置方位線Lx1上(參照圖2、圖3)。設置方位線Lx1成為於XZ平面連結編碼器EN1a、EN1b之測量用之光束之於刻度尺部SDa、SDb上之投射位置(讀取位置)與中心軸AXo之線。又，設置方位線Lx1成為於XZ平面連結各對準顯微鏡AM1m(AM11~AM14)之觀察區域Vw1m(Vw11~Vw14)與中心軸AXo之線。亦即，複數個對準顯微鏡AM1m(AM11~AM14)亦配置於設置方位線Lx1上。 The encoders EN1a and EN1b are disposed on the upstream side (the −X direction side) of the substrate P in the transport direction with respect to the center plane Poc, and are disposed on the set azimuth line Lx1 (see FIGS. 2 and 3). The azimuth line Lx1 is a line connecting the projection position (reading position) of the light beam for measurement on the scale portions SDa and SDb to the central axis AXo of the XZ plane connecting encoders EN1a and EN1b. Further, the azimuth line Lx1 is a line connecting the observation regions Vw1m (Vw11 to Vw14) of the alignment microscopes AM1m (AM11 to AM14) and the central axis AXo on the XZ plane. That is, a plurality of alignment microscopes AM1m (AM11 to AM14) are also disposed on the set orientation line Lx1.
編碼器EN2a、EN2b係設置在相對於中心面Poc為基板P之搬送方向之上游側(-X方向側)，且設置於較編碼器EN1a、EN1b更靠基板P之搬送方向之下游側(+X方向側)。編碼器EN2a、EN2b配置於設置方位線Lx2上(參照圖2、圖3)。設置方位線Lx2成為於XZ平面連結編碼器EN2a、EN2b之測量用之光束之於刻度尺部SDa、SDb上之投射位置(讀取位置)與中心軸AXo之線。該設置方位線Lx2係於XZ平面成為與照射中心軸Le1、Le3、Le5相同角度位置而與之重疊。 The encoders EN2a and EN2b are disposed on the upstream side (the -X direction side) of the substrate P in the transport direction with respect to the center plane Poc, and are disposed on the downstream side of the substrate P in the transport direction of the encoders EN1a and EN1b (+ X direction side). The encoders EN2a and EN2b are arranged on the set azimuth line Lx2 (see FIGS. 2 and 3). The azimuth line Lx2 is a line connecting the projection position (reading position) of the light beam for measuring the XZ plane connecting encoders EN2a and EN2b on the scale portions SDa and SDb and the central axis AXo. The set azimuth line Lx2 is formed such that the XZ plane is at the same angular position as the illumination center axes Le1, Le3, and Le5.
編碼器EN3a、EN3b係設置在相對於中心面Poc為基板P之搬送方向之下游側(+X方向側)，且配置於設置方位線Lx3上(參照圖2、圖3)。設置方位線Lx3成為於XZ平面連結編碼器EN3a、EN3b之測量用之光束之於刻度尺部SDa、SDb上之投射位置(讀取位置)與中心軸AXo之線。該設置方位線Lx3於XZ平面成為與照射中心軸Le2、Le4、Le6相同角度位置而與之重疊。因此，設置方位線Lx2與設置方位線Lx3被設定為，於XZ平面，相對於中心面Poc之角度成為±θ 1(參照圖2)。 The encoders EN3a and EN3b are disposed on the downstream side (+X direction side) of the substrate P in the transport direction with respect to the center plane Poc, and are disposed on the installation direction line Lx3 (see FIGS. 2 and 3). The azimuth line Lx3 is a line connecting the projection position (reading position) of the light beam for measuring the XZ plane connecting encoders EN3a and EN3b to the scale portions SDa and SDb and the central axis AXo. The set azimuth line Lx3 is overlapped with the XZ plane at the same angular position as the illumination center axes Le2, Le4, and Le6. Therefore, the set azimuth line Lx2 and the set azimuth line Lx3 are set such that the angle with respect to the center plane Poc is ±θ 1 on the XZ plane (see FIG. 2).
編碼器EN4a、EN4b係設置於較編碼器EN3a、EN3b更靠基板P之搬送方向之下游側(+X方向側)，且配置於設置方位線Lx4上(參照圖2)。設置方位線Lx4成為於XZ平面連結編碼器EN4a、EN4b之測量用之光束之於刻度尺部SDa、SDb上之投射位置(讀取位置)與中心軸AXo之線。又，設置方位線Lx4成為於XZ平面連結各對準顯微鏡AM2m(AM21~AM24)之觀察區域Vw2m(Vw21~Vw24)與中心軸AXo之線。亦即，複數個對準顯微鏡AM2m(AM21~AM24)亦配置於設置方位線Lx4上。該設置方位線Lx1與設置方位線Lx4被設定為，於XZ平面，相對於中心面Poc之角度成為±θ 2(參照圖2)。 The encoders EN4a and EN4b are disposed on the downstream side (+X direction side) of the substrate P in the transport direction of the encoders EN3a and EN3b, and are disposed on the set azimuth line Lx4 (see FIG. 2). The azimuth line Lx4 is a line connecting the projection position (reading position) of the light beam for measuring the XZ plane coupling encoders EN4a and EN4b on the scale portions SDa and SDb and the central axis AXo. Further, the azimuth line Lx4 is a line connecting the observation regions Vw2m (Vw21 to Vw24) of the alignment microscopes AM2m (AM21 to AM24) and the central axis AXo on the XZ plane. That is, a plurality of alignment microscopes AM2m (AM21 to AM24) are also disposed on the set orientation line Lx4. The set azimuth line Lx1 and the set azimuth line Lx4 are set such that the angle with respect to the center plane Poc is ±θ 2 on the XZ plane (see FIG. 2).
各編碼器ENja(EN1a~EN4a)、ENjb(EN1b~EN4b)係朝向刻度尺部SDa、SDb投射測量用之光束而光電檢測其反射射束(繞射光)，藉此將為脈衝訊號之檢測訊號輸出至控制裝置16。控制裝置16之旋轉位置檢測部108(參照圖12)藉由將該檢測訊號(脈衝訊號)計數，而以次微米之解析度測量旋轉筒DR之旋轉角度位置及角度變化。根據該旋轉筒DR之角度變化，亦可測量基板P之搬送速度Vt。旋轉位置檢測部108將來自各編碼器ENja(EN1a~EN4a)、ENjb(EN1b~EN4b)之檢測訊號分別個別地計數。 Each of the encoders ENja (EN1a to EN4a) and ENjb (EN1b to EN4b) project a light beam for measurement toward the scale portions SDa and SDb and photoelectrically detect the reflected beam (diffracted light), thereby detecting the pulse signal. Output to control device 16. The rotational position detecting unit 108 (see FIG. 12) of the control device 16 measures the rotational angle position and the angular change of the rotating cylinder DR by the submicron resolution by counting the detection signal (pulse signal). The transport speed Vt of the substrate P can also be measured in accordance with the change in the angle of the rotating cylinder DR. The rotational position detecting unit 108 individually counts the detection signals from the encoders ENja (EN1a to EN4a) and ENjb (EN1b to EN4b).
具體而言，旋轉位置檢測部108具有複數個計數器電路CNja(CN1a~CN4a)、CNjb(CN1b~CN4b)。計數器電路CN1a將來自編碼器EN1a之檢測訊號計數，計數器電路CN1b將來自編碼器EN1b之檢測訊號計數。以同樣之方式，計數器電路CN2a~CN4a、CN2b~CN4b將來自編碼器EN2a~EN4a、EN2b~EN4b之檢測訊號計數。該各計數器電路CNja(CN1a ~CN4a)、CNjb(CN1b~CN4b)係當各編碼器ENja(EN1a~EN4a)、ENjb(EN1b~EN4b)檢測出形成於刻度尺部SDa、SDb之圓周方向之一部分的圖3所示之原點標記(原點圖案)ZZ時，將與檢測出原點標記ZZ之編碼器ENja、ENjb對應之計數值重設為0。 Specifically, the rotational position detecting unit 108 has a plurality of counter circuits CNja (CN1a to CN4a) and CNjb (CN1b to CN4b). The counter circuit CN1a counts the detection signal from the encoder EN1a, and the counter circuit CN1b counts the detection signal from the encoder EN1b. In the same manner, the counter circuits CN2a~CN4a, CN2b~CN4b count the detection signals from the encoders EN2a~EN4a, EN2b~EN4b. Each counter circuit CNja (CN1a ~CN4a) and CNjb (CN1b~CN4b) are the originals shown in Fig. 3 in which the encoders ENja (EN1a to EN4a) and ENjb (EN1b to EN4b) detect one of the circumferential directions of the scale portions SDa and SDb. When the dot mark (origin pattern) ZZ is set, the count value corresponding to the encoders ENja and ENjb in which the origin mark ZZ is detected is reset to zero.
該計數器電路CN1a、CN1b之計數值之任一者或其平均值係作為設置方位線Lx1上之旋轉筒DR之旋轉角度位置而使用，計數器電路CN2a、CN2b之計數值之任一者或平均值係作為設置方位線Lx2上之旋轉筒DR之旋轉角度位置而使用。同樣地，計數器電路CN3a、CN3b之計數值之任一者或平均值係作為設置方位線Lx3上之旋轉筒DR之旋轉角度位置而使用，計數器電路CN4a、CN4b之計數值之任一者或其平均值係作為設置方位線Lx4上之旋轉筒DR之旋轉角度位置而使用。再者，因旋轉筒DR之製造誤差等而使旋轉筒DR相對於中心軸AXo偏心地旋轉之情形除外，原則上，計數器電路CN1a、CN1b之計數值相同。以同樣之方式，計數器電路CN2a、CN2b之計數值亦相同，計數器電路CN3a、CN3b之計數值、計數器電路CN4a、CN4b之計數值亦分別相同。 Any one of the count values of the counter circuits CN1a and CN1b or the average value thereof is used as the rotation angle position of the rotary cylinder DR on the set orientation line Lx1, and any one of the count values of the counter circuits CN2a and CN2b or the average value. It is used as the rotational angle position of the rotating cylinder DR on the azimuth line Lx2. Similarly, any one of the count values of the counter circuits CN3a and CN3b or the average value is used as the rotation angle position of the rotary cylinder DR on the set azimuth line Lx3, and any of the count values of the counter circuits CN4a and CN4b or The average value is used as the rotational angle position of the rotary cylinder DR on the azimuth line Lx4. In addition, the rotation cylinder DR is eccentrically rotated with respect to the central axis AXo due to a manufacturing error of the rotary cylinder DR or the like. In principle, the counter circuits CN1a and CN1b have the same count value. In the same manner, the count values of the counter circuits CN2a and CN2b are also the same, and the count values of the counter circuits CN3a and CN3b and the count values of the counter circuits CN4a and CN4b are also the same.
如上所述，對準顯微鏡AM1m(AM11~AM14)與編碼器EN1a、EN1b配置於設置方位線Lx1上，對準顯微鏡AM2m(AM21~AM24)與編碼器EN4a、EN4b配置於設置方位線Lx4上。因此，根據藉由標記位置檢測部106對複數個對準顯微鏡AM1m(AM11~AM14)所拍攝之複數個攝像訊號之圖像解析所進行的對準標記MKm(MK1~MK4)之位置檢測、與對準顯微鏡AM1m所拍攝之瞬間之旋轉筒DR之旋轉角度位置之資訊(基於編碼器EN1a、EN1b之計數值)，可高精度地測量設置方位線Lx1上之基 板P之位置。同樣地，根據藉由標記位置檢測部106對複數個對準顯微鏡AM2m(AM21~AM24)所拍攝之複數個攝像訊號之圖像解析所進行的對準標記MKm(MK1~MK4)之位置檢測、與對準顯微鏡AM2m所拍攝之瞬間之旋轉筒DR之旋轉角度位置之資訊(基於編碼器EN4a、EN4b之計數值)，可高精度地測量設置方位線Lx4上之基板P之位置。 As described above, the alignment microscopes AM1m (AM11 to AM14) and the encoders EN1a and EN1b are disposed on the set azimuth line Lx1, and the alignment microscopes AM2m (AM21 to AM24) and the encoders EN4a and EN4b are disposed on the set azimuth line Lx4. Therefore, the position detection of the alignment marks MKm (MK1 to MK4) by the image analysis of the plurality of image pickup signals captured by the plurality of alignment microscopes AM1m (AM11 to AM14) by the mark position detecting unit 106, and Aligning the rotation angle position of the rotating cylinder DR at the instant of the microscope AM1m (based on the count values of the encoders EN1a and EN1b), the base on the set bearing line Lx1 can be measured with high precision. The position of the board P. Similarly, the position detection of the alignment marks MKm (MK1 to MK4) by image analysis of a plurality of image pickup signals captured by the plurality of alignment microscopes AM2m (AM21 to AM24) by the mark position detecting unit 106, The position of the substrate P on the set azimuth line Lx4 can be accurately measured with information on the rotational angular position of the rotating cylinder DR at the instant of the alignment microscope AM2m (based on the count values of the encoders EN4a, EN4b).
又，來自編碼器EN1a、EN1b之檢測訊號之計數值、來自編碼器EN2a、EN2b之檢測訊號之計數值、來自編碼器EN3a、EN3b之檢測訊號之計數值、及來自編碼器EN4a、EN4b之檢測訊號之計數值於各編碼器ENja、ENjb檢測出原點標記ZZ之瞬間被重設為零。因此，於將基於編碼器EN1a、EN1b之計數值為第1值(例如100)時之捲繞至旋轉筒DR之基板P之設置方位線Lx1上之位置設為第1位置的情形時，若基板P上之第1位置被搬送至設置方位線Lx2上之位置(描繪線SL1、SL3、SL5之位置)，則基於編碼器EN2a、EN2b計數值成為第1值(例如100)。同樣地，若基板P上之第1位置被搬送至設置方位線Lx3上之位置(描繪線SL2、SL4、SL6之位置)，則基於編碼器EN3a、EN3b之檢測訊號之計數值成為第1值(例如100)。同樣地，若基板P上之第1位置被搬送至設置方位線Lx4上之位置，則基於編碼器EN4a、EN4b之檢測訊號之計數值成為第1值(例如100)。 Moreover, the count value of the detection signals from the encoders EN1a, EN1b, the count value of the detection signals from the encoders EN2a, EN2b, the count values of the detection signals from the encoders EN3a, EN3b, and the detection from the encoders EN4a, EN4b The count value of the signal is reset to zero at the instant when each encoder ENja, ENjb detects the origin mark ZZ. Therefore, when the position where the count value of the encoders EN1a and EN1b is the first value (for example, 100) and is wound on the set azimuth line Lx1 of the substrate P of the rotary cylinder DR is the first position, When the first position on the substrate P is transported to the position on the set azimuth line Lx2 (the position of the drawing lines SL1, SL3, and SL5), the count value based on the encoders EN2a and EN2b becomes the first value (for example, 100). Similarly, when the first position on the substrate P is transported to the position on the set azimuth line Lx3 (the positions of the drawing lines SL2, SL4, and SL6), the count value of the detection signals by the encoders EN3a and EN3b becomes the first value. (eg 100). Similarly, when the first position on the substrate P is transported to the position on the set azimuth line Lx4, the count value of the detection signals by the encoders EN4a and EN4b becomes the first value (for example, 100).
且說，基板P捲繞至旋轉筒DR之較兩端之刻度尺部SDa、SDb更內側。圖2中，將刻度尺部SDa、SDb之外周面之自中心軸AXo之半徑設定得小於旋轉筒DR之外周面之自中心軸AXo之半徑。然而，亦可如圖3所示，將刻度尺部SDa、SDb之外周面以成為與捲繞至旋轉筒DR之基板P之外周面同一面之方式設定。亦即，亦可以刻度尺部SDa、SDb之外 周面之自中心軸AXo之半徑(距離)、與捲繞至旋轉筒DR之基板P之外周面(被照射面)之自中心軸AXo之半徑(距離)相同之方式予以設定。藉此，各編碼器ENja(EN1a~EN4a)、ENjb(EN1b~EN4b)可在與捲繞至旋轉筒DR之基板P之被照射面相同徑向之位置檢測刻度尺部SDa、SDb。因此，可減少因編碼器ENja、ENjb所獲得之測量位置與處理位置(描繪線SL1~SL6)於旋轉筒DR之徑向上不同而產生的阿貝誤差。 Further, the substrate P is wound to the inner side of the scale portions SDa and SDb at both ends of the rotary cylinder DR. In FIG. 2, the radius from the central axis AXo of the outer peripheral surface of the scale portions SDa and SDb is set smaller than the radius from the central axis AXo of the outer peripheral surface of the rotary cylinder DR. However, as shown in FIG. 3, the outer peripheral surfaces of the scale portions SDa and SDb may be set so as to be flush with the outer peripheral surface of the substrate P wound around the rotary cylinder DR. That is, it is also possible to use the scales other than SDa and SDb. The radius (distance) of the circumferential surface from the central axis AXo is set to be the same as the radius (distance) from the central axis AXo of the outer surface (irradiated surface) of the substrate P wound around the rotating cylinder DR. Thereby, each of the encoders ENja (EN1a to EN4a) and ENjb (EN1b to EN4b) can detect the scale portions SDa and SDb at the same radial position as the surface to be irradiated of the substrate P wound around the rotating cylinder DR. Therefore, the Abbe error caused by the difference between the measurement position obtained by the encoders ENja and ENjb and the processing position (drawing lines SL1 to SL6) in the radial direction of the rotary cylinder DR can be reduced.
但，由於作為被照射體之基板P之厚度會相差十數μm~數百μm，差異較大，故而難以使刻度尺部SDa、SDb之外周面之半徑、與捲繞至旋轉筒DR之基板P之外周面之半徑始終相同。因此，於圖3所示之刻度尺部SDa、SDb之情形時，其外周面(刻度尺面)之半徑被設定為與旋轉筒DR之外周面之半徑一致。進而，亦可利用個別之圓盤構成刻度尺部SDa、SDb，並將該圓盤(刻度尺圓盤)同軸地安裝於旋轉筒DR之軸Sft。於該情形時，亦以使刻度尺圓盤之外周面(刻度尺面)之半徑與旋轉筒DR之外周面之半徑一致成阿貝誤差處於容許值內之程度為宜。 However, since the thickness of the substrate P as the object to be irradiated differs by a few ten μm to several hundreds μm, the difference is large, and it is difficult to make the radius of the outer peripheral surface of the scale portions SDa and SDb and the substrate wound to the rotating drum DR. The radius of the outer surface of P is always the same. Therefore, in the case of the scale portions SDa and SDb shown in FIG. 3, the radius of the outer peripheral surface (scale surface) is set to coincide with the radius of the outer peripheral surface of the rotary cylinder DR. Further, the scale portions SDa and SDb may be formed by individual disks, and the disk (scale disk) may be coaxially attached to the axis Sft of the rotary cylinder DR. In this case, it is preferable that the radius of the outer peripheral surface (scale surface) of the scale disc coincides with the radius of the outer peripheral surface of the rotary cylinder DR so that the Abbe error is within the allowable value.
由以上，根據由對準顯微鏡AM1m(AM11~AM14)檢測出之對準標記MKm(MK1~MK4)之基板P上之位置、與基於編碼器EN1a、EN1b之計數值(計數器電路CN1a、CN1b之計數值之任一者或平均值)，而由控制裝置16決定基板P之長尺寸方向(X方向)上之曝光區域W之描繪曝光之開始位置。再者，由於事先已知曝光區域W之X方向之長度，故而控制裝置16每當檢測特定個數之對準標記MKm(MK1~MK4)時便決定為描繪曝光之開始位置。而且，於將已決定曝光開始位置時之基於編碼器EN1a、EN1b之計數值設為第1值(例如100)之情形時，若基於編碼器EN2a、 EN2b計數值成為第1值(例如100)，則基板P之長尺寸方向上之曝光區域W之描繪曝光之開始位置位於描繪線SL1、SL3、SL5上。因此，掃描單元U1、U3、U5可根據編碼器EN2a、EN2b之計數值開始聚焦光SP之掃描。又，若基於編碼器EN3a、EN3b之計數值成為第1值(例如100)，則基板P之長尺寸方向上之曝光區域W之描繪曝光之開始位置位於描繪線SL2、SL4、SL6上。因此，掃描單元U2、U4、U6可根據編碼器EN3a、EN3b之計數值開始聚焦光SP之掃描。 From the above, based on the position on the substrate P of the alignment marks MKm (MK1 to MK4) detected by the alignment microscope AM1m (AM11 to AM14), and the count values based on the encoders EN1a and EN1b (counter circuits CN1a, CN1b) The control device 16 determines the start position of the drawing exposure of the exposure region W in the long dimension direction (X direction) of the substrate P by any one of the count values or the average value. Further, since the length of the exposure region W in the X direction is known in advance, the control device 16 determines the start position of the drawing exposure every time a specific number of alignment marks MKm (MK1 to MK4) are detected. Further, when the count value based on the encoders EN1a and EN1b when the exposure start position has been determined is set to the first value (for example, 100), if based on the encoder EN2a, When the EN2b count value becomes the first value (for example, 100), the start position of the drawing exposure of the exposure region W in the longitudinal direction of the substrate P is located on the drawing lines SL1, SL3, and SL5. Therefore, the scanning units U1, U3, U5 can start scanning of the focused light SP based on the count values of the encoders EN2a, EN2b. When the count value of the encoders EN3a and EN3b is the first value (for example, 100), the start position of the drawing exposure of the exposure region W in the longitudinal direction of the substrate P is located on the drawing lines SL2, SL4, and SL6. Therefore, the scanning units U2, U4, U6 can start scanning of the focused light SP based on the count values of the encoders EN3a, EN3b.
通常，藉由張力調整滾筒RT1、RT2對基板P於長尺寸方向賦予特定之張力，而使基板P一面與旋轉筒DR密接，一面隨著旋轉筒DR之旋轉而搬送。但，因旋轉筒DR之旋轉速度Vp較快，或張力調整滾筒RT1、RT2賦予至基板P之張力變得過低或變得過高等理由，而存在產生基板P相對於旋轉筒DR之滑動之可能性。於未產生基板P相對於旋轉筒DR之滑動之狀態時，在基於編碼器EN4a、4b之計數值成為與對準顯微鏡AM1m拍攝對準標記MKmA(某特定之對準標記MKm)之瞬間之基於編碼器EN1a、EN1b之計數值(例如150)相同之值之情形時，藉由對準顯微鏡AM2m檢測該對準標記MKmA。 Usually, the substrate P is fixed to the longitudinal direction by the tension adjusting rollers RT1 and RT2, and the substrate P is conveyed while being rotated by the rotation of the rotating cylinder DR while being in close contact with the rotating cylinder DR. However, the rotation speed Vp of the rotating cylinder DR is fast, or the tension applied to the substrate P by the tension adjusting rollers RT1 and RT2 is too low or too high, and there is a possibility that the sliding of the substrate P with respect to the rotating cylinder DR occurs. possibility. When the state in which the substrate P is slid with respect to the rotating cylinder DR is not generated, the basis based on the encoders EN4a, 4b is the timing of the alignment mark MKmA (a specific alignment mark MKm) with the alignment microscope AM1m. In the case where the count values of the encoders EN1a, EN1b (for example, 150) are the same, the alignment mark MKmA is detected by the alignment microscope AM2m.
然而，於產生基板P相對於旋轉筒DR之滑動之情形時，即便基於編碼器EN4a、EN4b之計數值成為與對準顯微鏡AM1m拍攝對準標記MKmA之瞬間之基於編碼器EN1a、EN1b之計數值(例如150)相同之值，亦無法藉由對準顯微鏡AM2m檢測該對準標記MKmA。於該情形時，基於編碼器EN4a、EN4b之計數值例如超過150之後藉由對準顯微鏡AM2m檢測對準標記MKmA。因此，可根據對準顯微鏡AM1m拍攝對準標記MKmA 之瞬間之基於編碼器EN1a、EN1b之計數值、與對準顯微鏡AM2m拍攝對準標記MKmA之瞬間之編碼器EN4a、EN4b之計數值，而求出相對於基板P之滑動量。如此，可藉由追加設置該對準顯微鏡AM2m及編碼器EN4a、EN4b，測定基板P之滑動量。 However, in the case where the sliding of the substrate P with respect to the rotating cylinder DR is generated, even if the count value based on the encoders EN4a, EN4b becomes the count value based on the encoders EN1a, EN1b at the instant of the alignment of the alignment mark MKmA with the alignment microscope AM1m (for example, 150) the same value, and the alignment mark MKmA cannot be detected by the alignment microscope AM2m. In this case, the alignment mark MKmA is detected by the alignment microscope AM2m based on the count values of the encoders EN4a, EN4b, for example, exceeding 150. Therefore, the alignment mark MKmA can be taken according to the alignment microscope AM1m. At the moment, the slip amount with respect to the substrate P is obtained based on the count values of the encoders EN1a and EN1b and the count values of the encoders EN4a and EN4b at the instant of the alignment of the alignment mark MKmA with the alignment microscope AM2m. In this manner, the alignment amount of the substrate P can be measured by additionally providing the alignment microscope AM2m and the encoders EN4a and EN4b.
接下來，參照圖5對掃描單元Un(U1~U6)之光學性構成進行說明。再者，各掃描單元Un(U1~U6)具有同一構成，因此僅對掃描單元U1進行說明，對於其他掃描單元Un省略其說明。又，於圖5中，將與照射中心軸Len(Le1)平行之方向設為Zt方向，將位於與Zt方向正交之平面上且基板P自處理裝置PR2經過曝光裝置EX朝向處理裝置PR3之方向設為Xt方向，將與Zt方向正交之平面上且與Xt方向正交之方向設為Yt方向。亦即，圖5之Xt、Yt、Zt之三維座標係使圖2之X、Y、Z之三維座標以Y軸為中心而以Z軸方向與照射中心軸Len(Le1)平行之方式旋轉而成的三維座標。 Next, the optical configuration of the scanning unit Un (U1 to U6) will be described with reference to Fig. 5 . Further, since each of the scanning units Un (U1 to U6) has the same configuration, only the scanning unit U1 will be described, and the description of the other scanning units Un will be omitted. In addition, in FIG. 5, the direction parallel to the irradiation center axis Len (Le1) is set to the Zt direction, and the substrate P is located on a plane orthogonal to the Zt direction, and the substrate P is directed from the processing apparatus PR2 to the processing apparatus PR3 via the exposure apparatus EX. The direction is set to the Xt direction, and the direction orthogonal to the Xt direction and the direction orthogonal to the Xt direction is set to the Yt direction. That is, the three-dimensional coordinates of Xt, Yt, and Zt of FIG. 5 are such that the three-dimensional coordinates of X, Y, and Z of FIG. 2 are rotated in the Z-axis direction in parallel with the illumination central axis Len (Le1) with the Y-axis as the center. The three-dimensional coordinates.
如圖5所示，於掃描單元U1內，沿著自射束LB1之入射位置至被照射面(基板P)為止之射束LB1之行進方向而設置有反射鏡M10、擴束器BE、反射鏡M11、偏光分光器BS1、反射鏡M12、移位光學構件(平行平板)SR、偏向調整光學構件(稜鏡)DP、場孔徑FA、反射鏡M13、λ/4波長板QW、柱面透鏡CYa、反射鏡M14、多角鏡PM、f θ透鏡FT、反射鏡M15、柱面透鏡CYb。進而，於掃描單元U1內，設置有檢測掃描單元U1之可開始描繪之時點之原點感測器(原點檢測器)OP1、與用以經由偏光分光器BS1檢測來自被照射面(基板P)之反射光之光學透鏡系統G10及光檢測器DT。 As shown in FIG. 5, in the scanning unit U1, a mirror M10, a beam expander BE, and a reflection are provided along the traveling direction of the beam LB1 from the incident position of the beam LB1 to the illuminated surface (substrate P). Mirror M11, polarizing beam splitter BS1, mirror M12, shifting optical member (parallel flat plate) SR, deflection adjusting optical member (稜鏡) DP, field aperture FA, mirror M13, λ/4 wavelength plate QW, cylindrical lens CYa, mirror M14, polygon mirror PM, f θ lens FT, mirror M15, cylindrical lens CYb. Further, in the scanning unit U1, an origin sensor (origin detector) OP1 for detecting the time at which the scanning unit U1 can start drawing is provided, and an originating surface (substrate P) for detecting via the polarizing beam splitter BS1. An optical lens system G10 and a photodetector DT that reflect light.
入射至掃描單元U1之射束LB1朝向-Zt方向行進，入射至相對於XtYt平面傾斜45°之反射鏡M10。以入射至該掃描單元U1之射束LB1之軸線與照射中心軸Le1同軸之方式入射至反射鏡M10。反射鏡M10作為使射束LB1入射至掃描單元U1之入射光學構件發揮功能，將所入射之射束LB1沿著與Xt軸平行地設定之光軸AXa且朝著向-Xt方向遠離反射鏡M10之反射鏡M11沿-Xt方向反射。因此，光軸AXa於與XtZt平面平行之面內和照射中心軸Le1正交。反射鏡M10所反射之射束LB1透過沿著光軸AXa配置之擴束器BE而入射至反射鏡M11。擴束器BE使透過之射束LB1之直徑擴大。擴束器BE具有聚光透鏡Be1、及使藉由聚光透鏡Be1而收斂之後發散之射束LB1成為平行光之準直透鏡Be2。 The beam LB1 incident on the scanning unit U1 travels in the -Zt direction and is incident on the mirror M10 which is inclined by 45 with respect to the XtYt plane. The mirror M10 is incident so that the axis of the beam LB1 incident on the scanning unit U1 is coaxial with the illumination central axis Le1. The mirror M10 functions as an incident optical member that causes the beam LB1 to enter the scanning unit U1, and the incident beam LB1 is set along the optical axis AXa parallel to the Xt axis and away from the mirror M10 in the -Xt direction. The mirror M11 is reflected in the -Xt direction. Therefore, the optical axis AXa is orthogonal to the illumination central axis Le1 in a plane parallel to the XtZt plane. The beam LB1 reflected by the mirror M10 is incident on the mirror M11 through the beam expander BE disposed along the optical axis AXa. The beam expander BE enlarges the diameter of the transmitted beam LB1. The beam expander BE has a condensing lens Be1 and a collimating lens Be2 that causes the beam LB1 which is diverged by the condensing lens Be1 to become parallel light.
反射鏡M11相對於YtZt平面傾斜45°地配置，將所入射之射束LB1(光軸AXa)朝向偏光分光器BS1沿-Yt方向反射。向-Yt方向遠離反射鏡M11而設置之偏光分光器BS1之偏振分光面係相對於YtZt平面傾斜45°地配置，反射P偏光之射束，使向與P偏光正交之方向偏光後之直線偏光(S偏光)之射束透過。由於入射至掃描單元U1之射束LB1為P偏光之射束，故而偏光分光器BS1將來自反射鏡M11之射束LB1向-Xt方向反射而引導至反射鏡M12側。 The mirror M11 is disposed at an angle of 45° with respect to the YtZt plane, and reflects the incident beam LB1 (optical axis AXa) toward the polarization beam splitter BS1 in the -Yt direction. The polarization splitting surface of the polarization beam splitter BS1 provided in the -Yt direction away from the mirror M11 is disposed at an angle of 45° with respect to the YtZt plane, and reflects the beam of the P-polarized beam so as to be polarized in a direction orthogonal to the P-polarized light. The beam of polarized light (S-polarized light) is transmitted. Since the beam LB1 incident on the scanning unit U1 is a P-polarized beam, the polarization beam splitter BS1 reflects the beam LB1 from the mirror M11 in the -Xt direction and guides it to the mirror M12 side.
反射鏡M12係相對於XtYt平面傾斜45°地配置，將所入射之射束LB1朝著向-Zt方向遠離反射鏡M12之反射鏡M13沿-Zt方向反射。由反射鏡M12反射之射束LB1沿著與Zt軸平行之光軸AXc通過移位光學構件SR、偏向調整光學構件DP、及場孔徑(視場光闌)FA而入射至反射鏡M13。移位光學構件SR於與射束LB1之行進方向(光軸AXc)正交之平 面(XtYt平面)內二維地調整射束LB1之剖面內之中心位置。移位光學構件SR係由沿著光軸AXc配置之2片石英之平行平板Sr1、Sr2所構成，平行平板Sr1可繞Xt軸傾斜，平行平板Sr2可繞Yt軸傾斜。藉由該平行平板Sr1、Sr2分別繞Xt軸、Yt軸傾斜，於與射束LB1之行進方向正交之XtYt平面內，將射束LB1之中心位置二維地移位微小量。該平行平板Sr1、Sr2係於控制裝置16之控制之下由未圖示之致動器(驅動部)驅動。 The mirror M12 is disposed at an angle of 45° with respect to the XtYt plane, and reflects the incident beam LB1 in the −Zt direction toward the mirror M13 that is away from the mirror M12 in the −Zt direction. The beam LB1 reflected by the mirror M12 is incident on the mirror M13 via the shift optical member SR, the deflection adjustment optical member DP, and the field aperture (field stop) FA along the optical axis AXc parallel to the Zt axis. The shifting optical member SR is flat with respect to the traveling direction (optical axis AXc) of the beam LB1 The center position in the cross section of the beam LB1 is two-dimensionally adjusted in the plane (XtYt plane). The shift optical member SR is composed of two quartz parallel plates Sr1 and Sr2 arranged along the optical axis AXc, and the parallel flat plate Sr1 is tiltable about the Xt axis, and the parallel flat plate Sr2 is tiltable about the Yt axis. The parallel plates Sr1 and Sr2 are inclined about the Xt axis and the Yt axis, respectively, and the center position of the beam LB1 is two-dimensionally shifted by a small amount in the XtYt plane orthogonal to the traveling direction of the beam LB1. The parallel flat plates Sr1 and Sr2 are driven by an actuator (drive unit) (not shown) under the control of the control device 16.
偏向調整光學構件DP係對由反射鏡M12反射並通過移位光學構件SR而來之射束LB1之相對於光軸AXc之斜率進行微調整者。偏向調整光學構件DP係由沿著光軸AXc配置之2個楔狀之稜鏡Dp1、Dp2所構成，稜鏡Dp1、Dp2之各者係可獨立地以光軸AXc為中心旋轉360°地設置。藉由調整2個稜鏡Dp1、Dp2之旋轉角度位置，而進行到達至反射鏡M13之射束LB1之軸線與光軸AXc之平行度校正、或到達至基板P之被照射面之射束LB1之軸線與照射中心軸Le1之平行度校正。再者，藉由2個稜鏡Dp1、Dp2偏向調整後之射束LB1存在於與射束LB1之剖面平行之面內橫向移位之情形，該橫向移位可藉由上文之移位光學構件SR而恢復原位。該稜鏡Dp1、Dp2係於控制裝置16之控制之下由未圖示之致動器(驅動部)驅動。 The deflection adjustment optical member DP finely adjusts the slope of the beam LB1 reflected by the mirror M12 and passed through the displacement optical member SR with respect to the optical axis AXc. The deflection adjustment optical member DP is composed of two wedge-shaped ridges Dp1 and Dp2 arranged along the optical axis AXc, and each of the 稜鏡Dp1 and Dp2 is independently rotatable 360° around the optical axis AXc. . By adjusting the rotational angle positions of the two 稜鏡Dp1, Dp2, the parallelism of the axis of the beam LB1 reaching the mirror M13 and the optical axis AXc is corrected, or the beam LB1 reaching the illuminated surface of the substrate P is obtained. The parallelism of the axis to the illumination center axis Le1 is corrected. Furthermore, the beam LB1 whose polarization is adjusted by the two 稜鏡Dp1 and Dp2 is laterally displaced in a plane parallel to the cross section of the beam LB1, and the lateral shift can be shifted by the above optical The member SR is restored to its original position. The 稜鏡Dp1 and Dp2 are driven by an actuator (drive unit) (not shown) under the control of the control device 16.
如此，通過移位光學構件SR與偏向調整光學構件DP之射束LB1透過場孔徑FA之圓形開口而到達至反射鏡M13。場孔徑FA之圓形開口係將經擴束器BE擴大後之射束LB1之剖面內之強度分佈之周邊部分截斷之光闌。若將場孔徑FA之圓形開口設為可調整口徑之可變式虹彩光闌，則可調整聚焦光SP之強度(亮度)。 In this manner, the beam LB1 of the shifting optical member SR and the deflection adjusting optical member DP passes through the circular opening of the field aperture FA to reach the mirror M13. The circular opening of the field aperture FA is a truncation of the peripheral portion of the intensity distribution in the cross section of the beam LB1 after the beam expander BE is enlarged. If the circular opening of the field aperture FA is set to a variable aperture iris of adjustable aperture, the intensity (brightness) of the focused light SP can be adjusted.
反射鏡M13係相對於XtYt平面傾斜45°地配置，將所入射之射束LB1朝向反射鏡M14沿+Xt方向反射。反射鏡M13所反射之射束LB1經由λ/4波長板QW及柱面透鏡CYa而入射至反射鏡M14。反射鏡M14將所入射之射束LB1朝向多角鏡(旋轉多面鏡、掃描用偏向構件)PM反射。多角鏡PM將所入射之射束LB1朝向具有與Xt軸平行之光軸AXf之f θ透鏡FT而向+Xt方向側反射。多角鏡PM係為了將射束LB1之聚焦光SP於基板P之被照射面上進行掃描而將所入射之射束LB1於與XtYt平面平行之面內一維地偏向(反射)。具體而言，多角鏡PM具有於Zt軸方向延伸之旋轉軸AXp、及形成於旋轉軸AXp之周圍之複數個反射面RP(本實施形態中將反射面RP之數量Np設為8)。可藉由使該多角鏡PM以旋轉軸AXp為中心沿特定之旋轉方向旋轉，而使照射至反射面RP之脈衝狀之射束LB1之反射角連續地變化。藉此，藉由1個反射面RP使射束LB1之反射方向偏向，而可將照射至基板P之被照射面上之射束LB1之聚焦光SP沿主掃描方向(基板P之寬度方向、Yt方向)進行掃描。 The mirror M13 is disposed at an angle of 45° with respect to the XtYt plane, and reflects the incident beam LB1 toward the mirror M14 in the +Xt direction. The beam LB1 reflected by the mirror M13 is incident on the mirror M14 via the λ/4 wavelength plate QW and the cylindrical lens CYa. The mirror M14 reflects the incident beam LB1 toward the polygon mirror (rotating polygon mirror, scanning deflecting member) PM. The polygon mirror PM reflects the incident beam LB1 toward the +Xt direction side toward the f θ lens FT having the optical axis AXf parallel to the Xt axis. The polygon mirror PM is configured to scan (reflect) the incident beam LB1 in a plane parallel to the XtYt plane in order to scan the focused light SP of the beam LB1 on the illuminated surface of the substrate P. Specifically, the polygon mirror PM has a rotation axis AXp extending in the Zt-axis direction and a plurality of reflection surfaces RP formed around the rotation axis AXp (in the present embodiment, the number Np of the reflection surfaces RP is 8). The reflection angle of the pulsed beam LB1 irradiated to the reflection surface RP can be continuously changed by rotating the polygon mirror PM around the rotation axis AXp in a specific rotation direction. Thereby, the reflection direction of the beam LB1 is deflected by the one reflection surface RP, and the focused light SP of the beam LB1 irradiated onto the irradiation surface of the substrate P can be in the main scanning direction (the width direction of the substrate P, Scan in the Yt direction).
亦即，可藉由1個反射面RP將射束LB1之聚焦光SP沿主掃描方向進行掃描。因此，於多角鏡PM之1旋轉中，聚焦光SP於基板P之被照射面上掃描之描繪線SL1之數量最大為與反射面RP之數量相同之8條。多角鏡PM係於控制裝置16之控制之下藉由旋轉驅動源(例如馬達或減速機構等)RM而以固定之速度旋轉。如上文所說明般，描繪線SL1之有效長度(例如30mm)被設定為可藉由該多角鏡PM掃描聚焦光SP之最大掃描長度(例如31mm)以下之長度，且於初始設定(設計上)中，於最大掃描長度之中央設定有描繪線SL1之中心點(照射中心軸Le1通過之點)。 That is, the focused light SP of the beam LB1 can be scanned in the main scanning direction by one reflecting surface RP. Therefore, in the one rotation of the polygon mirror PM, the number of the drawing lines SL1 scanned by the focused light SP on the illuminated surface of the substrate P is at most eight in the same number as the number of the reflecting surfaces RP. The polygon mirror PM is rotated at a fixed speed by a rotary drive source (for example, a motor or a speed reduction mechanism, etc.) under the control of the control device 16. As described above, the effective length (for example, 30 mm) of the drawing line SL1 is set to be longer than the maximum scanning length (for example, 31 mm) of the focused light SP by the polygon mirror PM, and is initially set (designed) In the center of the maximum scanning length, the center point of the drawing line SL1 (the point at which the irradiation center axis Le1 passes) is set.
柱面透鏡CYa係於與基於多角鏡PM之主掃描方向(旋轉方向)正交之非掃描方向(Zt方向)上，將所入射之射束LB1收斂於多角鏡PM之反射面RP上。亦即，柱面透鏡CYa將射束LB1在反射面RP上收斂成於與XtYt平面平行之方向延伸之長條狀(長橢圓狀)。藉由母線與Yt方向平行之柱面透鏡CYa及下述之柱面透鏡CYb，即便為反射面RP相對於Zt方向傾斜之情形(反射面RP相對於XtYt平面之法線之斜率)，亦可抑制其影響。例如，可抑制照射至基板P之被照射面上之射束LB1(描繪線SL1)之照射位置因多角鏡PM之各反射面RP之各者之微小之斜率誤差而向Xt方向偏移。 The cylindrical lens CYa converges the incident beam LB1 on the reflection surface RP of the polygon mirror PM in a non-scanning direction (Zt direction) orthogonal to the main scanning direction (rotation direction) of the polygon mirror PM. That is, the cylindrical lens CYa converges the beam LB1 on the reflecting surface RP into an elongated shape (long elliptical shape) extending in a direction parallel to the XtYt plane. By the cylindrical lens CYa parallel to the Yt direction of the bus bar and the cylindrical lens CYb described below, even if the reflection surface RP is inclined with respect to the Zt direction (the slope of the reflection surface RP with respect to the normal to the XtYt plane), Suppress its effects. For example, it is possible to suppress the irradiation position of the beam LB1 (drawing line SL1) irradiated onto the illuminated surface of the substrate P from being shifted in the Xt direction by a slight slope error of each of the reflection surfaces RP of the polygon mirror PM.
具有於Xt軸方向延伸之光軸AXf之f θ透鏡(掃描用透鏡系統)FT係將由多角鏡PM反射之射束LB1於XtYt平面內以與光軸AXf平行之方式投射至反射鏡M15之遠心系統之掃描透鏡。射束LB1向f θ透鏡FT之入射角θ根據多角鏡PM之旋轉角(θ/2)而變化。f θ透鏡FT經由反射鏡M15及柱面透鏡CYb將射束LB1投射至與該入射角θ成比例之基板P之被照射面上之像高位置。若將焦點距離設為fo，將像高位置設為y，則f θ透鏡FT被設計成滿足y=fo×θ之關係(畸變像差)。因此，藉由該f θ透鏡FT，可將射束LB1於Yt方向(Y方向)準確地以等速進行掃描。於向f θ透鏡FT之入射角θ為0度時，入射至f θ透鏡FT之射束LB1沿著光軸AXf上行進。 The f θ lens (scanning lens system) FT having the optical axis AXf extending in the Xt-axis direction projects the beam LB1 reflected by the polygon mirror PM into the telecentricity of the mirror M15 in the XtYt plane in parallel with the optical axis AXf. The scanning lens of the system. The incident angle θ of the beam LB1 to the f θ lens FT changes according to the rotation angle (θ/2) of the polygon mirror PM. The f θ lens FT projects the beam LB1 to the image height position on the illuminated surface of the substrate P which is proportional to the incident angle θ via the mirror M15 and the cylindrical lens CYb. If the focal length is set to fo and the image height position is set to y, the f θ lens FT is designed to satisfy the relationship of y=fo×θ (distortion aberration). Therefore, with the f θ lens FT, the beam LB1 can be accurately scanned at a constant speed in the Yt direction (Y direction). When the incident angle θ to the f θ lens FT is 0 degrees, the beam LB1 incident on the f θ lens FT travels along the optical axis AXf.
反射鏡M15將來自f θ透鏡FT之射束LB1經由柱面透鏡CYb朝著基板P向-Zt方向反射。藉由f θ透鏡FT及母線與Yt方向平行之柱面透鏡CYb，投射至基板P之射束LB1於基板P之被照射面上被收斂為 直徑數μm左右(例如3μm)之微小之聚焦光SP。又，投射至基板P之被照射面上之聚焦光SP藉由多角鏡PM而根據於Yt方向延伸之描繪線SL1一維掃描。再者，f θ透鏡FT之光軸AXf與照射中心軸Le1位於同一平面上，該平面與XtZt平面平行。因此，於光軸AXf上行進之射束LB1藉由反射鏡M15向-Zt方向反射，成為與照射中心軸Le1同軸而投射至基板P。於本第1實施形態中，至少f θ透鏡FT作為將藉由多角鏡PM偏向後之射束LB1投射至基板P之被照射面之投射光學系統發揮功能。又，至少反射構件(反射鏡M11~M15)及偏光分光器BS1作為將自反射鏡M10至基板P為止之射束LB1之光路彎折之光路偏向構件發揮功能。藉由該光路偏向構件，可使入射至反射鏡M10之射束LB1之入射軸與照射中心軸Le1大致同軸。於XtZt平面上，通過掃描單元U1內之射束LB1通過大致U字狀或字狀之光路之後向-Zt方向行進而投射至基板P。 The mirror M15 reflects the beam LB1 from the f θ lens FT toward the substrate P in the -Zt direction via the cylindrical lens CYb. The beam LB1 projected onto the substrate P by the f θ lens FT and the cylindrical lens CYb parallel to the Yt direction is converged on the illuminated surface of the substrate P into minute focused light having a diameter of about several μm (for example, 3 μm). SP. Further, the focused light SP projected onto the illuminated surface of the substrate P is scanned one-dimensionally by the drawing line SL1 extending in the Yt direction by the polygon mirror PM. Furthermore, the optical axis AXf of the f θ lens FT is on the same plane as the illumination central axis Le1, which is parallel to the XtZt plane. Therefore, the beam LB1 traveling on the optical axis AXf is reflected by the mirror M15 in the -Zt direction, and is projected coaxially with the irradiation central axis Le1 to be projected onto the substrate P. In the first embodiment, at least the f θ lens FT functions as a projection optical system that projects the beam LB1 deflected by the polygon mirror PM onto the illuminated surface of the substrate P. Further, at least the reflection members (mirrors M11 to M15) and the polarization beam splitter BS1 function as optical path deflecting members that bend the optical path of the beam LB1 from the mirror M10 to the substrate P. By the optical path deflecting member, the incident axis of the beam LB1 incident on the mirror M10 can be made substantially coaxial with the irradiation central axis Le1. On the XtZt plane, the beam LB1 passing through the scanning unit U1 passes through a substantially U-shape or The word-shaped light path then travels in the -Zt direction and is projected onto the substrate P.
如此，於基板P沿X方向被搬送之狀態下，藉由各掃描單元Un(U1~U6)將射束LBn(LB1~LB6)之聚焦光SP於主掃描方向(Y方向)一維地掃描，藉此可將聚焦光SP於基板P之被照射面相對地進行二維掃描。 In this manner, in a state where the substrate P is transported in the X direction, the focused light SP of the beam LBn (LB1 to LB6) is scanned one-dimensionally in the main scanning direction (Y direction) by each scanning unit Un (U1 to U6). Thereby, the focused light SP can be scanned two-dimensionally on the illuminated surface of the substrate P.
再者，作為一例，於將描繪線SLn(SL1~SL6)之有效長度設為30mm，一面每次重疊有效大小φ為3μm之聚焦光SP之7/8，亦即每次重疊2.625(=3×7/8)μm，一面將聚焦光SP沿著描繪線SLn(SL1~SL6)照射至基板P之被照射面上之情形時，聚焦光SP以0.375μm之間隔照射。因此，1次掃描所照射之聚焦光SP之數量成為80000(=30[mm]/0.375[μm])。又，若將基板P之副掃描方向之進給速度(搬送速度) Vt設為0.6048mm/sec，於副掃描方向上亦將聚焦光SP之掃描以0.375μm之間隔進行，則沿著描繪線SLn之1次掃描開始(描繪開始)時點與下一掃描開始時點之時間差Tpx成為約620μsec(=0.375[μm]/0.6048[mm/sec])。該時間差Tpx係8反射面RP之多角鏡PM旋轉1面(45度=360度/8)之時間。該情形時，必須以多角鏡PM之1旋轉之時間成為約4.96msec(=8×620[μsec])之方式設定，因此多角鏡PM之旋轉速度Vp被設定為每秒約201.613旋轉(=1/4.96[msec])、即約12096.8rpm。 Further, as an example, when the effective length of the drawing line SLn (SL1 to SL6) is 30 mm, 7/8 of the focused light SP having an effective size φ of 3 μm is superimposed each time, that is, each overlap is 2.625 (=3). When the focused light SP is irradiated onto the illuminated surface of the substrate P along the drawing line SLn (SL1 to SL6) at ×7/8) μm, the focused light SP is irradiated at intervals of 0.375 μm. Therefore, the number of focused lights SP irradiated by one scan becomes 80,000 (=30 [mm] / 0.375 [μm]). Further, when the substrate P is fed in the sub-scanning direction (transport speed) Vt is set to 0.6048 mm/sec, and the scanning of the focused light SP is also performed at intervals of 0.375 μm in the sub-scanning direction, and the point from the start of the scanning (the start of drawing) along the drawing line SLn and the point of the start of the next scanning are performed. The time difference Tpx becomes about 620 μsec (=0.375 [μm] / 0.6048 [mm/sec]). This time difference Tpx is the time when the polygon mirror PM of the 8 reflecting surface RP is rotated by one surface (45 degrees = 360 degrees / 8). In this case, it is necessary to set the rotation time of the polygon mirror PM 1 to about 4.96 msec (= 8 × 620 [μsec]), so the rotational speed Vp of the polygon mirror PM is set to be about 201.613 rotations per second (=1). /4.96 [msec]), ie about 12096.8 rpm.
另一方面，多角鏡PM之1反射面RP所反射之射束LB1有效地入射至f θ透鏡FT之最大入射角度(與聚焦光SP之最大掃描長度對應)係由f θ透鏡FT之焦點距離與最大掃描長度大致決定。作為一例，於8反射面RP之多角鏡PM之情形時，在1反射面RP之旋轉角度45度之中有助於實際掃描之旋轉角度α之比率(掃描效率)以α/45度表示。本第1實施形態中，由於將有助於實際掃描之旋轉角度α設為15度，故而掃描效率成為1/3(=15度/45度)，f θ透鏡FT之最大入射角成為30度(以光軸AXf為中心±15度)。因此，將聚焦光SP掃描描繪線SLn之最大掃描長度(例如31mm)之程度所需要之時間Ts成為Ts=Tpx×掃描效率，於上文之數值例之情形時，時間Ts成為約206.666…μsec(=620[μsec]/3)。由於將本第1實施形態中之描繪線SLn(SL1~SL6)之有效掃描長度設為30mm，故而沿著該描繪線SLn之聚焦光SP之1掃描之掃描時間Tsp成為約200μsec(=206.666…[μsec]×30[mm]/31[mm])。因此，於該時間Tsp之期間，必須照射80000之聚焦光SP(脈衝光)，故而來自光源裝置LS(LSa、LSb)之射束LB之發光頻率(振盪頻率)Fa成為Fa≒80000次/200μsec=400MHz。 On the other hand, the maximum incident angle (corresponding to the maximum scanning length of the focused light SP) of the beam LB1 reflected by the reflecting surface RP of the polygon mirror PM1 is effectively incident on the focal length of the f θ lens FT. It is roughly determined by the maximum scan length. As an example, in the case of the polygon mirror PM of the eight reflecting surface RP, the ratio (scanning efficiency) which contributes to the actual scanning rotation angle α among the rotation angles of the one reflecting surface RP of 45 degrees is represented by α/45 degrees. In the first embodiment, since the rotation angle α which contributes to the actual scanning is 15 degrees, the scanning efficiency becomes 1/3 (=15 degrees/45 degrees), and the maximum incident angle of the fθ lens FT becomes 30 degrees. (±15 degrees centered on the optical axis AXf). Therefore, the time Ts required to the extent that the focused light SP scans the maximum scanning length (for example, 31 mm) of the drawing line SLn becomes Ts = Tpx × scanning efficiency, and in the case of the numerical example above, the time Ts becomes about 206.666 ... μsec. (=620[μsec]/3). Since the effective scanning length of the drawing line SLn (SL1 to SL6) in the first embodiment is 30 mm, the scanning time Tsp of the scanning of the focused light SP along the drawing line SLn is about 200 μsec (=206.666... [μsec] × 30 [mm] / 31 [mm]). Therefore, during this time Tsp, it is necessary to illuminate the focused light SP (pulsed light) of 80,000, so that the light-emitting frequency (oscillation frequency) Fa of the beam LB from the light source device LS (LSa, LSb) becomes Fa ≒ 80000 times / 200 μsec =400MHz.
圖5所示之原點感測器OP1係當多角鏡PM之反射面RP之旋轉位置到達可開始利用反射面RP之聚焦光SP之掃描之特定位置時產生原點訊號SZ1。換言之，原點感測器OP1係當接下來進行聚焦光SP之掃描之反射面RP之角度成為特定之角度位置時產生原點訊號SZ1。由於多角鏡PM具有8個反射面RP，故而原點感測器OP1於多角鏡PM進行1旋轉期間輸出8次原點訊號SZ1。該原點感測器OP1所產生之原點訊號SZ1被送至控制裝置16。自原點感測器OP1產生原點訊號SZ1之後，經過延遲時間Td1後，開始聚焦光SP沿著描繪線SL1之掃描。亦即，該原點訊號SZ1成為表示利用掃描單元U1之聚焦光SP之描繪開始時序(掃描開始時序)的資訊。 The origin sensor OP1 shown in FIG. 5 generates an origin signal SZ1 when the rotational position of the reflecting surface RP of the polygon mirror PM reaches a specific position at which scanning of the focused light SP by the reflecting surface RP can be started. In other words, the origin sensor OP1 generates the origin signal SZ1 when the angle of the reflecting surface RP on which the scanning of the focused light SP is next becomes a specific angular position. Since the polygon mirror PM has eight reflection surfaces RP, the origin sensor OP1 outputs eight times of the origin signal SZ1 during one rotation of the polygon mirror PM. The origin signal SZ1 generated by the origin sensor OP1 is sent to the control device 16. After the origin signal SZ1 is generated from the origin sensor OP1, after the delay time Td1 elapses, scanning of the focused light SP along the drawing line SL1 is started. In other words, the origin signal SZ1 is information indicating the drawing start timing (scanning start timing) of the focused light SP by the scanning unit U1.
原點感測器OP1具有將對基板P之感光性功能層為非感光性之波長區域之雷射射束Bga射出至反射面RP之射束送光系統opa、及接受於反射面RP反射之雷射射束Bga之反射射束Bgb而產生原點訊號SZ1之射束受光系統opb。雖未圖示，但射束送光系統opa具有射出雷射射束Bga之光源、及將光源所發出之雷射射束Bga投射至反射面RP之光學構件(反射鏡或透鏡等)。雖未圖示，但射束受光系統opb具有包含接受所受到之反射射束Bgb而轉換為電氣訊號之光電轉換元件的受光部、及將反射面RP所反射之反射射束Bgb引導至上述受光部之光學構件(反射鏡或透鏡等)。射束送光系統opa與射束受光系統opb設置於如下位置，即：當多角鏡PM之旋轉位置到達利用反射面RP之聚焦光SP之掃描即將開始之前之特定位置時，射束受光系統opb可接受射束送光系統opa所射出之雷射射束Bga之反射射束Bgb。再者，將設置於掃描單元U2~U6之原點感測器OPn以OP2 ~OP6表示，且將由原點感測器OP2~OP6產生之原點訊號SZn以SZ2~SZ6表示。控制裝置16係根據該原點訊號SZn(SZ1~SZ6)而管理哪一掃描單元Un接下來進行聚焦光SP之掃描。又，存在將自產生原點訊號SZ2~SZ6之後至開始沿著基於掃描單元U2~U6之描繪線SL2~SL6之聚焦光SP之掃描為止之延遲時間Tdn以Td2~Td6表示之情形。 The origin sensor OP1 has a beam light transmitting system opa that emits a laser beam Bga that is a non-photosensitive wavelength region of the photosensitive layer of the substrate P to the reflecting surface RP, and receives reflection from the reflecting surface RP. The reflected beam Bgb of the laser beam Bga generates the beam receiving system opb of the origin signal SZ1. Although not shown, the beam light transmission system opa has a light source that emits the laser beam Bga and an optical member (mirror, lens, or the like) that projects the laser beam Bga emitted from the light source onto the reflection surface RP. Although not shown, the beam receiving system opb has a light receiving unit including a photoelectric conversion element that receives the reflected reflected beam Bgb and is converted into an electrical signal, and a reflected beam Bgb that reflects the reflecting surface RP to the above-mentioned light receiving unit. Optical components (mirrors, lenses, etc.). The beam light-receiving system opa and the beam-receiving system opb are disposed at a position where the beam receiving system opb is at a specific position just before the scanning of the focusing light SP of the reflecting surface RP is about to start before the scanning of the polygon mirror PM is started. The reflected beam Bgb of the laser beam Bga emitted by the beam delivery system opa can be accepted. Furthermore, the origin sensor OPn provided in the scanning units U2 to U6 is OP2 ~OP6 indicates that the origin signal SZn generated by the origin sensors OP2~OP6 is represented by SZ2~SZ6. The control device 16 manages which scanning unit Un scans the focused light SP next based on the origin signal SZn (SZ1 to SZ6). Further, there is a case where the delay time Tdn from the generation of the origin signal SZ2 to SZ6 to the start of the scanning of the focused light SP based on the drawing lines SL2 to SL6 of the scanning units U2 to U6 is represented by Td2 to Td6.
圖5所示之光檢測器DT具有將所入射之光進行光電轉換之光電轉換元件。於旋轉筒DR之表面，形成有預先確定之基準圖案。形成有該基準圖案之旋轉筒DR上之部分係由對於射束LB1之波長區域較低之反射率(10~50%)之原材料所構成，未形成有基準圖案之旋轉筒DR上之其他部分係由反射率為10%以下之材料或吸收光之材料所構成。因此，若於未捲繞有基板P之狀態(或通過基板P之透明部之狀態)下，自掃描單元U1對旋轉筒DR之形成有基準圖案之區域照射射束LB1之聚焦光SP，則其反射光通過柱面透鏡CYb、反射鏡M15、f θ透鏡FT、多角鏡PM、反射鏡M14、柱面透鏡CYa、λ/4波長板QW、反射鏡M13、場孔徑FA、偏向調整光學構件DP、移位光學構件SR、及反射鏡M12而入射至偏光分光器BS1。此處，於偏光分光器BS1與基板P之間、具體而言反射鏡M13與柱面透鏡CYa之間，設置有λ/4波長板QW。藉此，照射至基板P之射束LB1藉由該λ/4波長板QW而自P偏光轉換為圓偏振光之射束LB1，自基板P入射至偏光分光器BS1之反射光藉由該λ/4波長板QW而自圓偏振光轉換為S偏光。因此，來自基板P之反射光透過偏光分光器BS1而經由光學透鏡系統G10入射至光檢測器DT。 The photodetector DT shown in Fig. 5 has a photoelectric conversion element that photoelectrically converts incident light. A predetermined reference pattern is formed on the surface of the rotating cylinder DR. The portion of the rotating cylinder DR on which the reference pattern is formed is composed of a material having a low reflectance (10 to 50%) with respect to the wavelength region of the beam LB1, and other portions on the rotating drum DR in which the reference pattern is not formed. It is composed of a material having a reflectance of 10% or less or a material that absorbs light. Therefore, if the substrate P is not wound (or the transparent portion of the substrate P), the region of the rotating cylinder DR on which the reference pattern is formed is irradiated with the focused light SP of the beam LB1. The reflected light passes through the cylindrical lens CYb, the mirror M15, the f θ lens FT, the polygon mirror PM, the mirror M14, the cylindrical lens CYa, the λ/4 wavelength plate QW, the mirror M13, the field aperture FA, and the deflection adjusting optical member. The DP, the shift optical member SR, and the mirror M12 are incident on the polarization beam splitter BS1. Here, a λ/4 wavelength plate QW is provided between the polarizing beam splitter BS1 and the substrate P, specifically, between the mirror M13 and the cylindrical lens CYa. Thereby, the beam LB1 irradiated to the substrate P is converted from the P-polarized light to the beam LB1 of the circularly polarized light by the λ/4 wavelength plate QW, and the reflected light incident from the substrate P to the polarization beam splitter BS1 is obtained by the λ /4 wavelength plate QW and convert from circularly polarized light to S polarized light. Therefore, the reflected light from the substrate P passes through the polarization beam splitter BS1 and enters the photodetector DT via the optical lens system G10.
此時，於脈衝狀之射束LB1連續地入射至掃描單元U1之狀 態下，將旋轉筒DR旋轉而由掃描單元U1掃描聚焦光SP，藉此，聚焦光SP二維地照射至旋轉筒DR之外周面。因此，可藉由光檢測器DT獲取形成於旋轉筒DR之基準圖案之圖像。 At this time, the pulsed beam LB1 is continuously incident on the scanning unit U1. In this state, the rotating cylinder DR is rotated to scan the focused light SP by the scanning unit U1, whereby the focused light SP is two-dimensionally irradiated to the outer circumferential surface of the rotating cylinder DR. Therefore, the image of the reference pattern formed on the rotating cylinder DR can be acquired by the photodetector DT.
具體而言，響應用於射束LB1(聚焦光SP)之脈衝發光之時脈訊號LTC(由光源裝置LS製作)而將自光檢測器DT輸出之光電訊號之強度變化進行數位取樣，藉此以Yt方向之一維之圖像資料之形式獲取。進而，響應測量描繪線SL1上之旋轉筒DR之旋轉角度位置之編碼器EN2a、EN2b之測量值，每隔副掃描方向之固定距離(例如聚焦光SP之大小φ之1/8)將Yt方向之一維之圖像資料於Xt方向排列，藉此獲得旋轉筒DR之表面之二維之圖像資訊。控制裝置16基於該獲取之旋轉筒DR之基準圖案之二維之圖像資訊，而測量掃描單元U1之描繪線SL1之斜率。所謂該描繪線SL1之斜率，既可為各掃描單元Un(U1~U6)間之相對斜率，亦可為相對於旋轉筒DR之中心軸AXo之斜率(絕對斜率)。再者，當然以同樣之方式亦可測量各描繪線SL2~SL6之斜率。 Specifically, the intensity change of the photoelectric signal output from the photodetector DT is digitally sampled in response to the pulse signal LTC (made by the light source device LS) for the pulse light emission of the beam LB1 (the focused light SP). Obtained in the form of image data of one dimension in the Yt direction. Further, in response to the measurement values of the encoders EN2a, EN2b measuring the rotational angular position of the rotating cylinder DR on the drawing line SL1, the fixed distance in every sub-scanning direction (for example, 1/8 of the size φ of the focused light SP) will be the Yt direction. One-dimensional image data is arranged in the Xt direction, thereby obtaining two-dimensional image information of the surface of the rotating cylinder DR. The control device 16 measures the slope of the drawing line SL1 of the scanning unit U1 based on the two-dimensional image information of the reference pattern of the obtained rotating cylinder DR. The slope of the drawing line SL1 may be a relative slope between the scanning units Un (U1 to U6) or a slope (absolute slope) with respect to the central axis AXo of the rotating cylinder DR. Furthermore, of course, the slope of each of the drawing lines SL2 to SL6 can be measured in the same manner.
再者，複數個掃描單元Un(U1~U6)係以複數個掃描單元Un(U1~U6)之各者可繞照射中心軸Len(Le1~Le6)旋動(旋轉)之方式保持於未圖示之本體框架。若該各掃描單元Un(U1~U6)繞照射中心軸Len(Le1~Le6)旋動，則各描繪線SLn(SL1~SL6)亦於基板P之被照射面上繞照射中心軸Len(Le1~Le6)旋動。因此，各描繪線SLn(SL1~SL6)相對於Y方向傾斜。即便於各掃描單元Un(U1~U6)繞照射中心軸Len(Le1~Le6)旋動之情形時，通過各掃描單元Un(U1~U6)內之射束LBn(LB1~LB6)與各掃描單元Un(U1~U6)內之光學性構件之相對之位置關係亦 不變。因此，各掃描單元Un(U1~U6)可沿著於基板P之被照射面上旋動之描繪線SLn(SL1~SL6)掃描聚焦光SP。該各掃描單元Un(U1~U6)之繞照射中心軸Len(Le1~Le6)之旋動係於控制裝置16之控制之下由未圖示之致動器執行。 Furthermore, the plurality of scanning units Un (U1 to U6) are held in a manner that each of the plurality of scanning units Un (U1 to U6) can be rotated (rotated) around the illumination center axis Len (Le1 to Le6). The ontology framework shown. When the scanning units Un (U1 to U6) are rotated around the irradiation center axis Len (Le1 to Le6), the respective drawing lines SLn (SL1 to SL6) are also wound around the irradiation center axis Len on the illuminated surface of the substrate P (Le1). ~Le6) Rotate. Therefore, each of the drawing lines SLn (SL1 to SL6) is inclined with respect to the Y direction. That is, when each scanning unit Un (U1 to U6) is rotated around the irradiation center axis Len (Le1 to Le6), the beam LBn (LB1 to LB6) and each scanning in each scanning unit Un (U1 to U6) are passed. The relative positional relationship of the optical components in the unit Un (U1~U6) constant. Therefore, each of the scanning units Un (U1 to U6) can scan the focused light SP along the drawing lines SLn (SL1 to SL6) that are rotated on the illuminated surface of the substrate P. The rotation of the respective scanning units Un (U1 to U6) around the irradiation center axis Len (Le1 to Le6) is performed by an actuator (not shown) under the control of the control device 16.
因此，控制裝置16可藉由根據所測量出之各描繪線SLn之斜率使掃描單元Un(U1~U6)繞照射中心軸Len(Le1~Le6)旋動，而保持多條描繪線SLn(SL1~SL6)之平行狀態。又，在基於使用對準顯微鏡AM1m、AM2m檢測出之對準標記MKm之位置而基板P或曝光區域W形變(變形)之情形時，有必要使所描繪之圖案亦與之相應地發生形變。因此，控制裝置16係於判斷基板P或曝光區域W形變(變形)之情形時，藉由使掃描單元Un(U1~U6)繞照射中心軸Len(Le1~Le6)旋動，而與基板P或曝光區域W之形變(變形)相應地使各描繪線SLn相對於Y方向略微地傾斜。此時，於本實施形態中，如下文所說明般，可進行如使沿著各描繪線SLn描繪之圖案按照所指定之倍率(例如ppm級)伸縮之控制、或者使各描繪線SLn個別地於副掃描方向(圖5中之Xt方向)略微地移位之控制。 Therefore, the control device 16 can hold the plurality of drawing lines SLn (SL1) by rotating the scanning unit Un (U1 to U6) around the irradiation center axis Len (Le1 to Le6) according to the measured slopes of the respective drawing lines SLn. Parallel state of ~SL6). Further, in the case where the substrate P or the exposure region W is deformed (deformed) based on the position of the alignment mark MKm detected using the alignment microscopes AM1m and AM2m, it is necessary to deform the drawn pattern accordingly. Therefore, when the control device 16 determines that the substrate P or the exposure region W is deformed (deformed), the scanning unit Un (U1 to U6) is rotated around the illumination center axis Len (Le1 to Le6) to be aligned with the substrate P. Alternatively, the deformation (deformation) of the exposure region W causes the respective drawing lines SLn to be slightly inclined with respect to the Y direction. At this time, in the present embodiment, as described below, it is possible to perform control such that the pattern drawn along each drawing line SLn is expanded and contracted at a specified magnification (for example, ppm level), or each drawing line SLn is individually formed. The control is slightly shifted in the sub-scanning direction (Xt direction in Fig. 5).
再者，即便掃描單元Un之照射中心軸Len、與掃描單元Un實際地旋動之軸(旋動中心軸)不完全一致，只要兩者於特定之容許範圍內同軸即可。該特定之容許範圍被設定為，使掃描單元Un旋動角度θ sm時之實際之描繪線SLn之描繪開始點(或描繪結束點)、與假定照射中心軸Len與旋動中心軸完全時使掃描單元Un旋動特定之角度θ sm時之設計上之描繪線SLn之描繪開始點(或描繪結束點)之差分量於聚焦光SP之主掃描方向上成為特定之距離(例如，聚焦光SP之大小φ)以內。又，即便實 際入射至掃描單元Un之射束LBn之光軸與掃描單元Un之旋動中心軸不完全一致，只要於上述特定之容許範圍內同軸即可。 In addition, even if the irradiation central axis Len of the scanning unit Un does not completely coincide with the axis (spinning central axis) in which the scanning unit Un actually rotates, it is sufficient that the two are coaxial within a specific allowable range. The specific allowable range is set such that the drawing start point (or drawing end point) of the actual drawing line SLn when the scanning unit Un is rotated by the angle θ sm is made to be equal to the assumed irradiation center axis Len and the rotation center axis. The difference between the drawing start point (or the drawing end point) of the design drawing line SLn when the scanning unit Un rotates the specific angle θ sm becomes a specific distance in the main scanning direction of the focused light SP (for example, the focused light SP Within the size φ). Again, even if it is The optical axis of the beam LBn incident on the scanning unit Un does not completely match the rotation center axis of the scanning unit Un, and may be coaxial within the above-specified tolerance range.
圖6係射束切換部BDU之構成圖。射束切換部BDU具有複數個選擇用光學元件AOMn(AOM1~AOM6)、複數個聚光透鏡CD1~CD6、複數個反射鏡M1~M14、複數個單元側入射鏡IM1~IM6、複數個準直透鏡CL1~CL6、及吸收體TR1、TR2。選擇用光學元件AOMn(AOM1~AOM6)係對射束LB(LBa、LBb)具有透過性者，且係由超音波訊號驅動之聲光調變元件(AOM：Acousto-Optic Modulator)。該等光學性構件(選擇用光學元件AOM1~AOM6、聚光透鏡CD1~CD6、反射鏡M1~M14、單元側入射鏡IM1~IM6、準直透鏡CL1~CL6、及吸收體TR1、TR2)由板狀之支持構件IUB支持。該支持構件IUB於複數個掃描單元Un(U1~U6)之上方(+Z方向側)自下方(-Z方向側)支持該等光學性構件。因此，支持構件IUB亦具備將成為發熱源之選擇用光學元件AOMn(AOM1~AOM6)與複數個掃描單元Un(U1~U6)之間隔熱之功能。 Fig. 6 is a view showing the configuration of the beam switching unit BDU. The beam switching unit BDU has a plurality of selection optical elements AOMn (AOM1 to AOM6), a plurality of condensing lenses CD1 to CD6, a plurality of mirrors M1 to M14, a plurality of unit side incident mirrors IM1 to IM6, and a plurality of collimations. Lenses CL1 to CL6 and absorbers TR1 and TR2. The optical element AOMn (AOM1 to AOM6) is selected to have transparency to the beam LB (LBa, LBb), and is an acoustic light modulation element (AOM: Acousto-Optic Modulator) driven by an ultrasonic signal. The optical members (selecting optical elements AOM1 to AOM6, collecting lenses CD1 to CD6, mirrors M1 to M14, unit side incident mirrors IM1 to IM6, collimating lenses CL1 to CL6, and absorbers TR1 and TR2) are composed of The plate-shaped support member IUB is supported. The support member IUB supports the optical members from below (the -Z direction side) above the plurality of scanning units Un (U1 to U6) (+Z direction side). Therefore, the supporting member IUB also has a function of insulating between the selection optical elements ANOM (AOM1 to AOM6) serving as a heat source and the plurality of scanning units Un (U1 to U6).
射束LBa自光源裝置LSa藉由反射鏡M1~M6而使其光路彎曲成曲折狀地被引導至吸收體TR1。又，來自光源裝置LSb之射束LBb亦同樣地，藉由反射鏡M7~M14而使其光路彎曲成曲折狀地被引導至吸收體TR2。以下，於選擇用光學元件AOMn(AOM1~AOM6)均為斷開狀態(未施加有超音波訊號之狀態)之情形時，進行詳細敍述。 The beam LBa is guided from the light source device LSa to the absorber TR1 by bending the optical path into a meander shape by the mirrors M1 to M6. Further, similarly, the beam LBb from the light source device LSb is guided to the absorber TR2 by bending the optical path in a meander shape by the mirrors M7 to M14. Hereinafter, in the case where the selection optical elements AOMn (AOM1 to AOM6) are both in an off state (a state in which an ultrasonic signal is not applied), a detailed description will be given.
來自光源裝置LSa之射束LBa(平行射束)係與Y軸平行地向+Y方向行進並通過聚光透鏡CD1入射至反射鏡M1。於反射鏡M1向-X方向反射之射束LBa直接地透過配置於聚光透鏡CD1之焦點位置(光束 腰位置)之第1選擇用光學元件AOM1，並藉由準直透鏡CL1而再次形成為平行射束，到達反射鏡M2。於反射鏡M2向+Y方向反射之射束LBa在通過聚光透鏡CD2之後由反射鏡M3向+X方向反射。 The beam LBa (parallel beam) from the light source device LSa travels in the +Y direction in parallel with the Y-axis and is incident on the mirror M1 through the collecting lens CD1. The beam LBa reflected by the mirror M1 in the -X direction directly transmits the focus position (beam) disposed on the condenser lens CD1 The first selection optical element AOM1 of the waist position is again formed into a parallel beam by the collimator lens CL1, and reaches the mirror M2. The beam LBa reflected by the mirror M2 in the +Y direction is reflected by the mirror M3 in the +X direction after passing through the condenser lens CD2.
由反射鏡M3向+X方向反射之射束LBa直接地透過配置於聚光透鏡CD2之焦點位置(光束腰位置)之第2選擇用光學元件AOM2，藉由準直透鏡CL2而再次形成為平行射束，到達反射鏡M4。由反射鏡M4向+Y方向反射之射束LBa在通過聚光透鏡CD3之後由反射鏡M5向-X方向反射。由反射鏡M5向-X方向反射之射束LBa直接地透過配置於聚光透鏡CD3之焦點位置(光束腰位置)之第3選擇用光學元件AOM3，藉由準直透鏡CL3而再次形成為平行射束，到達反射鏡M6。於反射鏡M6向+Y方向反射之射束LBa入射至吸收體TR1。該吸收體TR1係為了抑制射束LBa向外部之洩漏而吸收射束LBa的光阱。 The beam LBa reflected by the mirror M3 in the +X direction is directly transmitted through the second selection optical element AOM2 disposed at the focus position (beam waist position) of the condensing lens CD2, and is again formed by the collimator lens CL2. Parallel beams arrive at mirror M4. The beam LBa reflected by the mirror M4 in the +Y direction is reflected by the mirror M5 in the -X direction after passing through the condenser lens CD3. The beam LBa reflected by the mirror M5 in the -X direction is directly transmitted through the third selection optical element AOM3 disposed at the focus position (beam waist position) of the condensing lens CD3, and is again formed by the collimator lens CL3. Parallel beams arrive at mirror M6. The beam LBa reflected by the mirror M6 in the +Y direction is incident on the absorber TR1. The absorber TR1 is a light trap that absorbs the beam LBa in order to suppress leakage of the beam LBa to the outside.
來自光源裝置LSb之射束LBb(平行射束)係與Y軸平行地向+Y方向行進併入射至反射鏡M13，於反射鏡M13向+X方向反射之射束LBb由反射鏡M14向+Y方向反射。於反射鏡M14向+Y方向反射之射束LBb在通過聚光透鏡CD4之後由反射鏡M7向+X方向反射。由反射鏡M7向+X方向反射之射束LBb直接地透過配置於聚光透鏡CD4之焦點位置(光束腰位置)之第4選擇用光學元件AOM4，藉由準直透鏡CL4而再次形成為平行射束，到達反射鏡M8。由反射鏡M8向+Y方向反射之射束LBb在通過聚光透鏡CD5之後由反射鏡M9向-X方向反射。 The beam LBb (parallel beam) from the light source device LSb travels in the +Y direction parallel to the Y axis and enters the mirror M13, and the beam LBb reflected in the +X direction from the mirror M13 is mirrored by the mirror M14. Reflected in the Y direction. The beam LBb reflected by the mirror M14 in the +Y direction is reflected by the mirror M7 in the +X direction after passing through the condensing lens CD4. The beam LBb reflected by the mirror M7 in the +X direction is directly transmitted through the fourth selection optical element AOM4 disposed at the focus position (beam waist position) of the condensing lens CD4, and is again formed by the collimator lens CL4. Parallel beams arrive at mirror M8. The beam LBb reflected by the mirror M8 in the +Y direction is reflected by the mirror M9 in the -X direction after passing through the condenser lens CD5.
由反射鏡M9向-X方向反射之射束LBb直接地透過配置於聚光透鏡CD5之焦點位置(光束腰位置)之第5選擇用光學元件AOM5， 藉由準直透鏡CL5而再次形成為平行射束，到達反射鏡M10。由反射鏡M10向+Y方向反射之射束LBb在通過聚光透鏡CD6之後由反射鏡M11向+X方向反射。由反射鏡M11向+X方向反射之射束LBb直接地透過配置於聚光透鏡CD6之焦點位置(光束腰位置)之第6選擇用光學元件AOM6，藉由準直透鏡CL6而再次形成為平行射束，到達反射鏡M12。於反射鏡M12向-Y方向反射之射束LBb入射至吸收體TR2。該吸收體TR2係為了抑制射束LBb向外部之洩漏而吸收射束LBb的光阱。 The beam LBb reflected by the mirror M9 in the -X direction directly passes through the fifth selection optical element AOM5 disposed at the focus position (beam waist position) of the condenser lens CD5. The parallel beam is again formed by the collimator lens CL5 and reaches the mirror M10. The beam LBb reflected by the mirror M10 in the +Y direction is reflected by the mirror M11 in the +X direction after passing through the condenser lens CD6. The beam LBb reflected by the mirror M11 in the +X direction is directly transmitted through the sixth selection optical element AOM6 disposed at the focus position (beam waist position) of the condensing lens CD6, and is again formed by the collimator lens CL6. Parallel beams arrive at mirror M12. The beam LBb reflected by the mirror M12 in the -Y direction is incident on the absorber TR2. The absorber TR2 absorbs the light trap of the beam LBb in order to suppress leakage of the beam LBb to the outside.
如上所述，選擇用光學元件AOM1~AOM3係以使來自光源裝置LSa之射束LBa依序透過之方式沿著射束LBa之行進方向串聯地配置。又，選擇用光學元件AOM1~AOM3係以藉由聚光透鏡CD1~CD3與準直透鏡CL1~CL3而於各選擇用光學元件AOM1~AOM3之內部形成射束LBa之光束腰之方式配置。藉此，使入射至選擇用光學元件(聲光調變元件)AOM1~AOM3之射束LBa之直徑變小，提高了繞射效率，並且提高了響應性。同樣地，選擇用光學元件AOM4~AOM6係以使來自光源裝置LSb之射束LBb依序透過之方式沿著射束LBb之行進方向串聯地配置。又，選擇用光學元件AOM4~AOM6係以藉由聚光透鏡CD4~CD6與準直透鏡CL4~CL6而於各選擇用光學元件AOM4~AOM6之內部形成射束LBb之光束腰之方式配置。藉此，使入射至選擇用光學元件(聲光調變元件)AOM4~AOM6之射束LBb之直徑變小，提高了繞射效率，並且提高了響應性。 As described above, the selection optical elements AOM1 to AOM3 are arranged in series so that the beam LBa from the light source device LSa is sequentially transmitted in the traveling direction of the beam LBa. Further, the selection optical elements AOM1 to AOM3 are arranged such that the beam waists of the beams LBa are formed inside the respective selection optical elements AOM1 to AOM3 by the condensing lenses CD1 to CD3 and the collimator lenses CL1 to CL3. Thereby, the diameter of the beam LBa incident on the selection optical elements (acoustic-light modulation elements) AOM1 to AOM3 is made small, the diffraction efficiency is improved, and the responsiveness is improved. Similarly, the selection optical elements AOM4 to AOM6 are arranged in series so that the beam LBb from the light source device LSb is sequentially transmitted in the traveling direction of the beam LBb. Further, the selection optical elements AOM4 to AOM6 are arranged such that the beam waists of the beams LBb are formed inside the respective selection optical elements AOM4 to AOM6 by the condensing lenses CD4 to CD6 and the collimator lenses CL4 to CL6. Thereby, the diameter of the beam LBb incident on the selection optical elements (acoustic-light modulation elements) AOM4 to AOM6 is made small, the diffraction efficiency is improved, and the responsiveness is improved.
各選擇用光學元件AOMn(AOM1~AOM6)係當被施加超音波訊號(高頻訊號)時便使入射之射束(0次光)LB(LBa、LBb)以與高頻之頻率相應之繞射角繞射後之一次繞射光作為射出射束(射束LBn) 而產生。本第1實施形態中，將自複數個選擇用光學元件AOMn(AOM1~AOM6)之各者作為一次繞射光射出之射束LBn設為射束LB1~LB6，各選擇用光學元件AOMn(AOM1~AOM6)係作為發揮將來自光源裝置LSa、LSb之射束LB(LBa、LBb)之光路偏向之功能者來操作。但，實際之聲光調變元件由於一次繞射光之產生效率為0次光之80%左右，故而藉由各選擇用光學元件AOMn(AOM1~AOM6)之各者而偏向之射束LBn(LB1~LB6)較原先之射束LB(LBa、LBb)之強度降低。又，選擇用光學元件AOMn(AOM1~AOM6)之任一個為接通狀態時，未繞射而直行之0次光殘存20%左右，但其最終會由吸收體TR1、TR2吸收。 Each of the selection optical elements AOMn (AOM1~AOM6) is such that when an ultrasonic signal (high-frequency signal) is applied, the incident beam (0-order light) LB (LBa, LBb) is wound around the frequency of the high-frequency. One diffracted light after the angle of diffraction is used as the outgoing beam (beam LBn) And produced. In the first embodiment, the beam LBn emitted from each of the plurality of selection optical elements AOMn (AOM1 to AOM6) as the primary diffracted light is set as the beams LB1 to LB6, and the optical elements AOMn (AOM1~) are selected. AOM 6) is operated as a function of deflecting the optical paths of the beams LB (LBa, LBb) from the light source devices LSa and LSb. However, the actual acousto-optic modulation element has a generation efficiency of about 80% of the zero-order light, so that the beam LBn (LB1) is biased by each of the selection optical elements AOMn (AOM1 to AOM6). ~LB6) is lower in intensity than the original beam LB (LBa, LBb). Further, when any one of the selection optical elements AOMn (AOM1 to AOM6) is in an ON state, the zero-order light that has not been diffracted and left straight remains at about 20%, but eventually it is absorbed by the absorbers TR1 and TR2.
如圖6所示，複數個選擇用光學元件AOMn(AOM1~AOM6)之各者係以將作為經偏向之一次繞射光之射束LBn(LB1~LB6)相對於入射之射束LB(LBa、LBb)朝-Z方向偏向之方式設置。自選擇用光學元件AOMn(AOM1~AOM6)之各者偏向而射出之射束LBn(LB1~LB6)投射至設置於與選擇用光學元件AOMn(AOM1~AOM6)之各者隔開特定距離之位置之單元側入射鏡IM1~IM6，於該處向-Z方向以與照射中心軸Le1~Le6同軸之方式反射。由單元側入射鏡IM1~IM6(以下，亦簡稱為鏡LM1~IM6)反射之射束LB1~LB6通過形成於支持構件IUB之開口部TH1~TH6之各者以沿著照射中心軸Le1~Le6之方式入射至掃描單元Un(U1~U6)之各者。 As shown in FIG. 6, each of the plurality of selection optical elements AOMn (AOM1 to AOM6) is configured to use a beam LBn (LB1 to LB6) which is a primary diffracted light with respect to the incident beam LB (LBa, LBb) is set in the direction of the -Z direction. The beam LBn (LB1 to LB6) emitted from the selection optical element AOMn (AOM1 to AOM6) is projected to a position spaced apart from the selection optical element ANOMn (AOM1 to AOM6) by a specific distance. The unit side entrance mirrors IM1 to IM6 are reflected in the -Z direction coaxially with the illumination center axes Le1 to Le6. The beams LB1 to LB6 reflected by the unit side incident mirrors IM1 to IM6 (hereinafter also referred to simply as the mirrors LM1 to IM6) pass through the respective opening portions TH1 to TH6 formed in the support member IUB along the irradiation center axes Le1 to Le6. This method is incident on each of the scanning units Un (U1 to U6).
再者，選擇用光學元件AOMn係藉由超音波而於透過構件中之特定方向產生折射率之週期性之疏密變化之繞射光柵，因此於入射射束LB(LBa、LBb)為直線偏光(P偏光或S偏光)之情形時，其偏光方向 與繞射光柵之週期方向係以一次繞射光之產生效率(繞射效率)變得最高之方式予以設定。如圖6，於各選擇用光學元件AOMn以使入射之射束LB(LBa、LBs)向-Z方向繞射偏向之方式設置之情形時，生成於選擇用光學元件AOMn內之繞射光柵之週期方向亦為-Z方向，因此以與之匹配之方式設定(調整)來自光源裝置LS(LSa、LSb)之射束LB之偏光方向。 Further, the optical element AOMn is selected to be a diffraction grating in which a periodic variation of the refractive index is generated in a specific direction in the transmissive member by ultrasonic waves, and thus the incident beam LB (LBa, LBb) is linearly polarized. (P-polarized or S-polarized), the direction of polarization The period direction of the diffraction grating is set such that the generation efficiency (diffraction efficiency) of the primary diffracted light becomes the highest. As shown in Fig. 6, when each of the selecting optical elements AOMn is disposed such that the incident beam LB (LBa, LBs) is deflected in the -Z direction, the diffraction grating is formed in the optical element AOM for selection. Since the periodic direction is also in the -Z direction, the polarization direction of the beam LB from the light source device LS (LSa, LSb) is set (adjusted) in a matching manner.
各選擇用光學元件AOMn(AOM1~AOM6)可使用構成、功能、作用等彼此相同者。複數個選擇用光學元件AOMn(AOM1~AOM6)係按照來自控制裝置16之驅動訊號(高頻訊號)之接通/斷開，而將使入射之射束LB(LBa、LBb)繞射後之繞射光之產生接通/斷開。例如，選擇用光學元件AOM1於未被施加來自控制裝置16之驅動訊號(高頻訊號)而為斷開之狀態時，不使入射之來自光源裝置LSa之射束LBa繞射而使其透過。因此，透過選擇用光學元件AOM1後之射束LBa透過準直透鏡CL1入射至反射鏡M2。另一方面，選擇用光學元件AOM1於被施加來自控制裝置16之驅動訊號(高頻訊號)而為接通之狀態時，使入射之射束LBa繞射而朝向鏡IM1。亦即，根據該驅動訊號而將選擇用光學元件AOM1開關。鏡IM1選擇作為藉由選擇用光學元件AOM1而繞射之一次繞射光之射束LB1將其向掃描單元U1側反射。於選擇用之鏡IM1反射之射束LB1通過支持構件IUB之開口部TH1沿著照射中心軸Le1入射至掃描單元U1。因此，鏡IM1係以所反射之射束LB1之光軸成為與照射中心軸Le1同軸之方式將所入射之射束LB1反射。又，於選擇用光學元件AOM1為接通之狀態時，直接地透過選擇用光學元件AOM1之射束LB之0次光(入射射束之20%左右之強度)透過其後之準直透鏡CL1~CL3、聚光透鏡CD2~CD3、反射鏡M2~ M6、及選擇用光學元件AOM2~AOM3而到達至吸收體TR1。 The respective optical elements AOMn (AOM1 to AOM6) can be used in the same configuration, function, action, and the like. A plurality of selection optical elements AOMn (AOM1~AOM6) are used to circulate the incident beam LB (LBa, LBb) according to the on/off of the driving signal (high frequency signal) from the control device 16. The generation of diffracted light is turned on/off. For example, when the selection optical element AOM1 is turned off without applying a driving signal (high-frequency signal) from the control device 16, the incident beam LBa from the light source device LSa is not diffracted and transmitted. Therefore, the beam LBa transmitted through the selection optical element AOM1 is incident on the mirror M2 through the collimator lens CL1. On the other hand, when the selection optical element AOM1 is turned on when the drive signal (high-frequency signal) from the control device 16 is applied, the incident beam LBa is diffracted toward the mirror IM1. That is, the selection optical element AOM1 is switched in accordance with the drive signal. The mirror IM1 is selected to be reflected toward the scanning unit U1 side by the beam LB1 of the primary diffracted light diffracted by the optical element AOM1. The beam LB1 reflected by the mirror IM1 for selection is incident on the scanning unit U1 along the irradiation center axis Le1 through the opening portion TH1 of the supporting member IUB. Therefore, the mirror IM1 reflects the incident beam LB1 such that the optical axis of the reflected beam LB1 is coaxial with the irradiation central axis Le1. Further, when the selection optical element AOM1 is turned on, the zero-order light (the intensity of about 20% of the incident beam) of the beam LB of the selection optical element AOM1 is directly transmitted through the subsequent collimator lens CL1. ~CL3, condenser lens CD2~CD3, mirror M2~ M6 and the selection optical elements AOM2 to AOM3 reach the absorber TR1.
同樣地，選擇用光學元件AOM2、AOM3於未被施加來自控制裝置16之驅動訊號(高頻訊號)而為斷開之狀態時，不使所入射之射束LBa(0次光)繞射而使其向準直透鏡CL2、CL3側(反射鏡M4、M6側)透過。另一方面，選擇用光學元件AOM2、AOM3於被施加來自控制裝置16之驅動訊號而為接通之狀態時，使作為所入射之射束LBa之一次繞射光之射束LB2、LB3朝向鏡IM2、IM3。該鏡IM2、IM3將藉由選擇用光學元件AOM2、AOM3而繞射之射束LB2、LB3向掃描單元U2、U3側反射。於鏡IM2、IM3反射之射束LB2、LB3通過支持構件IUB之開口部TH2、TH3而與照射中心軸Le2、Le3同軸地入射至掃描單元U2、U3。 Similarly, when the optical elements AOM2 and AOM3 are selected to be turned off without being applied with the driving signal (high-frequency signal) from the control device 16, the incident beam LBa (0-order light) is not diffracted. It is transmitted to the collimator lenses CL2 and CL3 (on the mirrors M4 and M6 side). On the other hand, when the optical elements AOM2 and AOM3 are selected to be turned on when the driving signal from the control device 16 is applied, the beams LB2 and LB3 which are the primary diffracted beams of the incident beam LBa are directed toward the mirror IM2. , IM3. The mirrors IM2, IM3 reflect the beams LB2, LB3 which are diffracted by the selection optical elements AOM2, AOM3 toward the scanning units U2, U3. The beams LB2 and LB3 reflected by the mirrors IM2 and IM3 are incident on the scanning units U2 and U3 coaxially with the irradiation center axes Le2 and Le3 through the opening portions TH2 and TH3 of the supporting member IUB.
如此，控制裝置16藉由將應施加至選擇用光學元件AOM1~AOM3之各者之驅動訊號(高頻訊號)設為接通/斷開(高位準/低位準)，而將選擇用光學元件AOM1~AOM3之任一個開關，在射束LBa朝向後續之選擇用光學元件AOM2、AOM3或吸收體TR1、或者經偏向之射束LB1~LB3之1個朝向相對應之掃描單元U1~U3該兩者之間進行切換。 Thus, the control device 16 sets the selection optical element by turning on/off (high level/low level) of the driving signal (high frequency signal) to be applied to each of the selection optical elements AOM1 to AOM3. Any one of AOM1~AOM3 switches toward the subsequent selection optical element AOM2, AOM3 or absorber TR1, or one of the deflected beams LB1~LB3 toward the corresponding scanning unit U1~U3 Switch between people.
又，選擇用光學元件AOM4於未被施加來自控制裝置16之驅動訊號(高頻訊號)而為斷開之狀態時，不使入射之來自光源裝置LSb之射束LBb繞射而使其向準直透鏡CL4側(反射鏡M8側)透過。另一方面，選擇用光學元件AOM4於被施加來自控制裝置16之驅動訊號而為接通之狀態時，使作為所入射之射束LBb之一次繞射光之射束LB4朝向鏡IM4。該鏡IM4將藉由選擇用光學元件AOM4而繞射之射束LB4向掃描單元U4側反射。於鏡IM4反射之射束LB4變得與照射中心軸Le4同軸而通過支持 構件IUB之開口部TH4入射至掃描單元U4。 Further, when the selection optical element AOM4 is turned off without applying a driving signal (high-frequency signal) from the control device 16, the incident beam LBb from the light source device LSb is not diffracted and aligned. The straight lens CL4 side (the side of the mirror M8) is transmitted. On the other hand, when the selection optical element AOM4 is turned on when the drive signal from the control device 16 is applied, the beam LB4 which is the primary diffracted light of the incident beam LBb is directed toward the mirror IM4. This mirror IM4 reflects the beam LB4 diffracted by the selection optical element AOM4 toward the scanning unit U4 side. The beam LB4 reflected by the mirror IM4 becomes coaxial with the illumination central axis Le4 and passes through the support The opening portion TH4 of the member IUB is incident on the scanning unit U4.
同樣地，選擇用光學元件AOM5、AOM6於未被施加來自控制裝置16之驅動訊號(高頻訊號)而為斷開之狀態時，不使所入射之射束LBb繞射而使其向準直透鏡CL5、CL6側(反射鏡M10、M12側)透過。另一方面，選擇用光學元件AOM5、AOM6於被施加來自控制裝置16之驅動訊號而為接通之狀態時，使作為所入射之射束LBb之一次繞射光之射束LB5、LB6朝向鏡IM5、IM6。該鏡IM5、IM6將藉由選擇用光學元件AOM5、AOM6而繞射之射束LB5、LB6向掃描單元U5、U6側反射。於鏡IM5、IM6反射之射束LB5、LB6變得與照射中心軸Le5、Le6同軸而通過支持構件IUB之開口部TH5、TH6之各者入射至掃描單元U5、U6。 Similarly, when the optical elements AOM5 and AOM6 are turned off without being applied with the driving signal (high-frequency signal) from the control device 16, the incident beam LBb is not diffracted and collimated. The lenses CL5 and CL6 (the mirrors M10 and M12 sides) pass through. On the other hand, when the optical elements AOM5 and AOM6 are selected to be turned on when the driving signal from the control device 16 is applied, the beams LB5 and LB6 which are the primary diffracted beams of the incident beam LBb are directed toward the mirror IM5. , IM6. The mirrors IM5 and IM6 reflect the beams LB5 and LB6 which are diffracted by the selection optical elements AOM5 and AOM6 toward the scanning units U5 and U6. The beams LB5 and LB6 reflected by the mirrors IM5 and IM6 are coaxial with the irradiation central axes Le5 and Le6, and are incident on the scanning units U5 and U6 through the respective openings TH5 and TH6 of the supporting member IUB.
如此，控制裝置16藉由將應施加至選擇用光學元件AOM4~AOM6之各者之驅動訊號(高頻訊號)設為接通/斷開(高位準/低位準)，而將選擇用光學元件AOM4~AOM6之任一個開關，在射束LBb朝向後續之選擇用光學元件AOM5、AOM6或吸收體TR2、或者經偏向之射束LB4~LB6之1個朝向相對應之掃描單元U4~U6該兩者之間進行切換。 In this manner, the control device 16 sets the selection optical element by turning on/off (high level/low level) of the driving signal (high frequency signal) to be applied to each of the selection optical elements AOM4 to AOM6. Any one of the switches AOM4~AOM6, the beam LBb is oriented toward the subsequent selection optical element AOM5, AOM6 or absorber TR2, or one of the deflected beams LB4~LB6 is oriented to the corresponding scanning unit U4~U6 Switch between people.
如上所述，射束切換部BDU藉由具備沿著來自光源裝置LSa之射束LBa之行進方向而串聯地配置之複數個選擇用光學元件AOMn(AOM1~AOM3)，可切換射束LBa之光路而選擇射束LBn(LB1~LB3)所入射之1個掃描單元Un(U1~U3)。因此，可使作為來自光源裝置LSa之射束LBa之一次繞射光之射束LBn(LB1~LB3)依序入射至3個掃描單元Un(U1~U3)之各者。例如，於欲使射束LB1入射至掃描單元U1之情形時，控制裝置16僅將複數個選擇用光學元件AOM1~AOM3中之選擇用 光學元件AOM1設為接通狀態，於欲使射束LB3入射至掃描單元U3之情形時，僅將選擇用光學元件AOM3設為接通狀態即可。 As described above, the beam switching unit BDU can switch the optical path of the beam LBa by providing a plurality of selection optical elements AOMn (AOM1 to AOM3) arranged in series along the traveling direction of the beam LBa from the light source device LSa. One scanning unit Un (U1 to U3) incident on the beam LBn (LB1 to LB3) is selected. Therefore, the beam LBn (LB1 to LB3) which is the primary diffracted light of the beam LBa from the light source device LSa can be sequentially incident on each of the three scanning units Un (U1 to U3). For example, when the beam LB1 is to be incident on the scanning unit U1, the control device 16 selects only a plurality of selection optical elements AOM1 to AOM3. When the optical element AOM1 is set to the ON state, when the beam LB3 is to be incident on the scanning unit U3, only the selection optical element AOM3 may be turned on.
同樣地，射束切換部BDU藉由具備沿著來自光源裝置LSb之射束LBb之行進方向而串聯地配置之複數個選擇用光學元件AOMn(AOM4~AOM6)，可切換射束LBb之光路而選擇射束LBn(LB4~LB6)所入射之1個掃描單元Un(U4~U6)。因此，可使作為來自光源裝置LSb之射束LBb之一次繞射光之射束LBn(LB4~LB6)依序入射至3個掃描單元Un(U4~U6)之各者。例如，於欲使射束LB4入射至掃描單元U4之情形時，控制裝置16僅將複數個選擇用光學元件AOM4~AOM6中之選擇用光學元件AOM4設為接通狀態，於欲使射束LB6入射至掃描單元U6之情形時，僅將選擇用光學元件AOM6設為接通狀態即可。 Similarly, the beam switching unit BDU can switch the optical path of the beam LBb by providing a plurality of selection optical elements AOMn (AOM4 to AOM6) arranged in series along the traveling direction of the beam LBb from the light source device LSb. One scanning unit Un (U4 to U6) incident on the beam LBn (LB4 to LB6) is selected. Therefore, the beam LBn (LB4 to LB6) which is the primary diffracted light of the beam LBb from the light source device LSb can be sequentially incident on each of the three scanning units Un (U4 to U6). For example, when the beam LB4 is to be incident on the scanning unit U4, the control device 16 sets only the selection optical element AOM4 of the plurality of selection optical elements AOM4 to AOM6 to the on state, in order to make the beam LB6 In the case of entering the scanning unit U6, only the selection optical element AOM6 may be turned on.
該複數個選擇用光學元件AOMn(AOM1~AOM6)係與複數個掃描單元Un(U1~U6)對應地設置，切換是否使射束LBn入射至所對應之掃描單元Un。再者，本第1實施形態中，將選擇用光學元件AOM1~AOM3稱為第1光學元件模組，將選擇用光學元件AOM4~AOM6稱為第2光學元件模組。又，將與第1光學元件模組之選擇用光學元件AOM1~AOM3對應之掃描單元U1~U3稱為第1掃描模組，將與第2光學元件模組之選擇用光學元件AOM4~AOM6對應之掃描單元U4~U6稱為第2掃描模組。因此，於第1掃描模組之任一個掃描單元Un、與第2掃描模組之任一個掃描單元Un中，聚焦光SP之掃描並行地進行。 The plurality of selection optical elements AOMn (AOM1 to AOM6) are provided corresponding to the plurality of scanning units Un (U1 to U6), and whether or not the beam LBn is incident on the corresponding scanning unit Un. In the first embodiment, the selection optical elements AOM1 to AOM3 are referred to as a first optical element module, and the selection optical elements AOM4 to AOM6 are referred to as a second optical element module. Further, the scanning units U1 to U3 corresponding to the selection optical elements AOM1 to AOM3 of the first optical element module are referred to as a first scanning module, and correspond to the selection optical elements AOM4 to AOM6 of the second optical element module. The scanning units U4 to U6 are referred to as second scanning modules. Therefore, in any one of the scanning unit Un of the first scanning module and the scanning unit Un of the second scanning module, the scanning of the focused light SP is performed in parallel.
如上所述，本第1實施形態中係將有助於掃描單元Un之多角鏡PM之實際掃描之旋轉角度α設為15度，因此掃描效率成為1/3。因 此，例如，於1個掃描單元Un旋轉1反射面RP之角度(45度)期間，可進行聚焦光SP之掃描之角度成為15度，於其以外之角度範圍(30度)，無法進行聚焦光SP之掃描，而於該期間入射至多角鏡PM之射束LBn變得無效。因此，於某一個掃描單元Un之多角鏡PM之旋轉角度成為無助於實際掃描之角度期間，藉由使射束LBn入射至其以外之其他掃描單元Un，可藉由其他掃描單元Un之多角鏡PM進行聚焦光SP之掃描。由於多角鏡PM之掃描效率為1/3，故而於某一個掃描單元Un自掃描聚焦光SP至進行下一掃描之前之期間，可對其以外之2個掃描單元Un分配射束LBn而進行聚焦光SP之掃描。因此，本第1實施形態係將複數個掃描單元Un(U1~U6)分為2個群(掃描模組)，將3個掃描單元U1~U3作為第1掃描模組，將3個掃描單元U4~U6作為第2掃描模組。 As described above, in the first embodiment, the rotation angle α of the actual scanning of the polygon mirror PM which contributes to the scanning unit Un is set to 15 degrees, so that the scanning efficiency is 1/3. because For example, during the period (45 degrees) during which one scanning unit Un rotates the one reflecting surface RP, the angle at which the focused light SP is scanned can be 15 degrees, and the angle range (30 degrees) other than the scanning unit Un can not be focused. The scanning of the light SP, and the beam LBn incident to the polygon mirror PM during this period becomes invalid. Therefore, during the period when the rotation angle of the polygon mirror PM of one of the scanning units Un becomes an angle which does not contribute to the actual scanning, the scanning unit Un can be incident on the scanning unit Un other than the other scanning unit Un. The mirror PM performs scanning of the focused light SP. Since the scanning efficiency of the polygon mirror PM is 1/3, the beam LBn can be distributed to the two scanning units Un other than the scanning unit SP until the next scanning is performed until the next scanning is performed. Scan of light SP. Therefore, in the first embodiment, a plurality of scanning units Un (U1 to U6) are divided into two groups (scanning modules), and three scanning units U1 to U3 are used as the first scanning module, and three scanning units are used. U4~U6 are used as the second scanning module.
藉此，例如於掃描單元U1之多角鏡PM旋轉45度(1反射面RP之相應量)期間，可使射束LBn(LB1~LB3)依序入射至3個掃描單元U1~U3之任一個。因此，掃描單元U1~U3之各者可不使來自光源裝置LSa之射束LBa變得無效，而依序進行聚焦光SP之掃描。同樣地，於掃描單元U4之多角鏡PM旋轉45度(1反射面RP之相應量)期間，可使射束LBn(LB4~LB6)依序入射至至3個掃描單元U4~U6之任一個。因此，掃描單元U4~U6可不使來自光源裝置LSb之射束LBb變得無效，而依序進行聚焦光SP之掃描。再者，於各掃描單元Un自開始聚焦光SP之掃描至開始下一掃描之前之期間，多角鏡PM旋轉恰好1反射面RP之角度(45度)。 Thereby, for example, during the rotation of the polygon mirror PM of the scanning unit U1 by 45 degrees (the corresponding amount of the one reflecting surface RP), the beam LBn (LB1 to LB3) can be sequentially incident on any one of the three scanning units U1 to U3. . Therefore, each of the scanning units U1 to U3 can sequentially scan the focused light SP without invalidating the beam LBa from the light source device LSa. Similarly, during the rotation of the polygon mirror PM of the scanning unit U4 by 45 degrees (the corresponding amount of the reflection surface RP), the beam LBn (LB4 to LB6) can be sequentially incident on any one of the three scanning units U4 to U6. . Therefore, the scanning units U4 to U6 can sequentially scan the focused light SP without invalidating the beam LBb from the light source device LSb. Further, the polygon mirror PM rotates at an angle (45 degrees) of exactly 1 reflection surface RP during the scanning of the scanning unit SP from the start of the scanning of the focused light SP to the start of the next scanning.
本第1實施形態中，由於各掃描模組之3個掃描單元Un(U1~U3、U4~U6)之各者係依照特定之順序進行聚焦光SP之掃描，故而與 之對應地，控制裝置16將各光學元件模組之3個選擇用光學元件AOMn(AOM1~AOM3、AOM4~AOM6)依照特定之順序切換為接通，而依序切換射束LBn(LB1~LB3、LB4~LB6)所入射之掃描單元Un(U1~U3、U4~U6)。例如，於各掃描模組之3個掃描單元U1~U3、U4~U6進行聚焦光SP之掃描之順序為U1→U2→U3、U4→U5→U6之情形時，控制裝置16將各光學元件模組之3個選擇用光學元件AOMn(AOM1~AOM3、AOM4~AOM6)依照AOM1→AOM2→AOM3、AOM4→AOM5→AOM6、之順序切換為接通，而將射束LBn所入射之掃描單元Un依照U1→U2→U3、U4→U5→U6之順序進行切換。 In the first embodiment, each of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module performs scanning of the focused light SP in a specific order, and thus Correspondingly, the control device 16 switches the three selection optical elements ANOn (AOM1 to AOM3, AOM4 to AOM6) of each optical element module to be turned on in a specific order, and sequentially switches the beam LBn (LB1 to LB3). , LB4~LB6) Scanning unit Un (U1~U3, U4~U6) incident on. For example, when the scanning units of the scanning units SP are U1→U2→U3, U4→U5→U6 in the scanning unit U1~U3 and U4~U6 of each scanning module, the control device 16 sets the optical elements. The three optical modules AOMn (AOM1~AOM3, AOM4~AOM6) are switched to ON in the order of AOM1→AOM2→AOM3, AOM4→AOM5→AOM6, and the scanning unit Un incident on the beam LBn Switching is performed in the order of U1 → U2 → U3, U4 → U5 → U6.
再者，為了於多角鏡PM旋轉1反射面RP之角度(45度)期間，各掃描模組之3個掃描單元Un(U1~U3、U4~U6)依序進行聚焦光SP之掃描，各掃描模組之3個掃描單元Un(U1~U3、U4~U6)之各多角鏡PM必須滿足如下之條件而進行旋轉。該條件係指必須以各掃描模組之3個掃描單元Un(U1~U3、U4~U6)之各多角鏡PM成為同一旋轉速度Vp之方式進行同步控制，並且以各多角鏡PM之旋轉角度位置(各反射面RP之角度位置)成為特定之相位關係之方式進行同步控制。將各掃描模組之3個掃描單元Un之多角鏡PM之旋轉速度Vp相同地進行旋轉稱為同步旋轉。 Furthermore, in order to rotate the angle of the reflection surface RP (45 degrees) of the polygon mirror PM, the three scanning units Un (U1~U3, U4~U6) of each scanning module sequentially scan the focused light SP, Each polygon mirror PM of the three scanning units Un (U1 to U3, U4 to U6) of the scanning module must be rotated under the following conditions. This condition means that the polygon mirrors PM of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module must be synchronously controlled so as to be at the same rotation speed Vp, and the rotation angle of each polygon mirror PM is required. The position (the angular position of each reflecting surface RP) is synchronously controlled so as to have a specific phase relationship. Rotating the rotational speed Vp of the polygon mirror PM of the three scanning units Un of each scanning module in the same manner is referred to as synchronous rotation.
射束切換部BDU之各選擇用光學元件AOMn(AOM1~AOM6)僅在基於掃描單元Un(U1~U6)之各者之多角鏡PM的聚焦光SP之1次掃描期間之間成為接通狀態即可。又，若將多角鏡PM之反射面數設為Np，將多角鏡PM之旋轉速度設為Vp(rpm)，則與多角鏡PM之反射面 RP之1面之旋轉角度對應的時間Tpx成為Tpx=60/(Np×Vp)[秒]。例如，於反射面數Np為8，旋轉速度Vp[rpm]為1.20968萬之情形時，時間Tpx成為約0.62毫秒。若其換算成頻率，則為約1.6129kHz左右，此即意味著，為與用以響應圖案資料(描繪資料)而將紫外區之波長之射束LB以數十MHz左右高速地調變之聲光調變元件相比相當低之響應頻率之聲光調變元件即可。因此，可使用相對於入射之射束LB(0次光)偏向之射束LB1~LB6(一次繞射光)之繞射角較大者，相對於直接地通過選擇用光學元件AOM1~AOM6之射束LB之行進路徑，將經偏向之射束LB1~LB6分離之鏡IM1~IM6之配置變得容易。 The selection optical elements AOMn (AOM1 to AOM6) of the beam switching unit BDU are turned on only during the one-scan period of the focused light SP of the polygon mirror PM of each of the scanning units Un (U1 to U6). Just fine. When the number of reflection faces of the polygon mirror PM is Np and the rotation speed of the polygon mirror PM is Vp (rpm), the reflection surface of the polygon mirror PM is used. The time Tpx corresponding to the rotation angle of one side of the RP becomes Tpx=60/(Np×Vp) [sec]. For example, when the number of reflection surfaces Np is 8, and the rotation speed Vp [rpm] is 1,200,968, the time Tpx becomes about 0.62 milliseconds. If it is converted into a frequency, it is about 1.6129 kHz, which means that the beam LB of the wavelength of the ultraviolet region is modulated at a high speed of about several tens of MHz in response to the pattern data (drawing data). The optical modulation component can be compared to a relatively low response frequency acousto-optic modulation component. Therefore, it is possible to use a larger diffraction angle of the beams LB1 to LB6 (primary diffracted light) which are biased with respect to the incident beam LB (zero-order light), and to directly pass the selection optical elements AOM1 to AOM6. The path of the bundle LB facilitates the arrangement of the mirrors IM1 to IM6 in which the deflected beams LB1 to LB6 are separated.
圖7係表示光源裝置(脈衝光源裝置、脈衝雷射裝置)LSa(LSb)之構成之圖。作為光纖雷射裝置之光源裝置LSa(LSb)具備脈衝光產生部20與控制電路22。脈衝光產生部20具有DFB半導體雷射元件30、32、偏光分光器34、作為描繪用光調變器之電光元件(強度調變部)36、該電光元件36之驅動電路36a、偏光分光器38、吸收體40、激發光源42、合併器44、光纖光放大器46、波長轉換光學元件48、50、及複數個透鏡元件GL。控制電路22具有產生時脈訊號LTC及像素移位脈衝BSC之訊號產生部22a。再者，存在如下情形：為了區分自光源裝置LSa之訊號產生部22a輸出之像素移位脈衝BSC與自光源裝置LSb之訊號產生部22a輸出之像素移位脈衝BSC，而將來自光源裝置LSa之像素移位脈衝BSC以BSCa表示，將來自光源裝置LSb之像素移位脈衝BSC以BSCb表示。 Fig. 7 is a view showing the configuration of a light source device (pulse light source device, pulse laser device) LSa (LSb). The light source device LSa (LSb) as the optical fiber laser device includes a pulse light generating unit 20 and a control circuit 22. The pulse light generating unit 20 includes DFB semiconductor laser elements 30 and 32, a polarization beam splitter 34, an electro-optical element (intensity modulation unit) 36 as a light modulator for drawing, a drive circuit 36a of the electro-optical element 36, and a polarization beam splitter. 38. Absorber 40, excitation source 42, combiner 44, fiber optic amplifier 46, wavelength converting optical elements 48, 50, and a plurality of lens elements GL. The control circuit 22 has a signal generating portion 22a that generates a clock signal LTC and a pixel shift pulse BSC. Furthermore, there is a case where the pixel shift pulse BSC outputted from the signal generating portion 22a of the light source device LSa and the pixel shift pulse BSC outputted from the signal generating portion 22a of the light source device LSb are distinguished from the light source device LSa. The pixel shift pulse BSC is represented by BSCa, and the pixel shift pulse BSC from the light source device LSb is represented by BSCb.
DFB半導體雷射元件(第1固體雷射元件)30係以作為特定頻率之振盪頻率Fa(例如400MHz)產生陡峭(峻峭)或尖銳之脈衝狀 之種子光(脈衝射束、射束)S1，DFB半導體雷射元件(第2固體雷射元件)32係以作為特定頻率之振盪頻率Fa(例如400MHz)產生緩慢(時間上遲滯)之脈衝狀之種子光(脈衝射束、射束)S2。DFB半導體雷射元件30所產生之種子光S1與DFB半導體雷射元件32所產生之種子光S2之發光時序同步。種子光S1、S2均係每1脈衝之能量大致相同，偏光狀態互不相同，波峰強度係種子光S1較強。該種子光S1與種子光S2為直線偏光之光，其偏光方向相互正交。本第1實施形態中，將DFB半導體雷射元件30所產生之種子光S1之偏光狀態設為S偏光，將DFB半導體雷射元件32所產生之種子光S2之偏光狀態設為P偏光而進行說明。該種子光S1、S2為紅外波長區域之光。 The DFB semiconductor laser element (first solid laser element) 30 generates a steep (severe) or sharp pulse shape at an oscillation frequency Fa (for example, 400 MHz) as a specific frequency. The seed light (pulse beam, beam) S1, and the DFB semiconductor laser element (second solid laser element) 32 generate a slow (time lag) pulse shape at an oscillation frequency Fa (for example, 400 MHz) which is a specific frequency. Seed light (pulse beam, beam) S2. The seed light S1 generated by the DFB semiconductor laser element 30 is synchronized with the light emission timing of the seed light S2 generated by the DFB semiconductor laser element 32. The seed light S1 and S2 are substantially the same energy per pulse, and the polarization states are different from each other, and the peak intensity is stronger than the seed light S1. The seed light S1 and the seed light S2 are linearly polarized light, and their polarization directions are orthogonal to each other. In the first embodiment, the polarization state of the seed light S1 generated by the DFB semiconductor laser device 30 is S-polarized, and the polarization state of the seed light S2 generated by the DFB semiconductor laser device 32 is P-polarized. Description. The seed lights S1 and S2 are light in the infrared wavelength region.
控制電路22係以響應自訊號產生部22a送來之時脈訊號LTC之時脈脈衝而使種子光S1、S2發光之方式控制DFB半導體雷射元件30、32。藉此，該DFB半導體雷射元件30、32響應時脈訊號LTC之各時脈脈衝(振盪頻率Fa)而以特定頻率(振盪頻率)Fa發出種子光S1、S2。該控制電路22係由控制裝置16控制。將該時脈訊號LTC之時脈脈衝之週期(=1/Fa)稱為基準週期Ta。DFB半導體雷射元件30、32中產生之種子光S1、S2被引導至偏光分光器34。 The control circuit 22 controls the DFB semiconductor laser elements 30, 32 in such a manner that the seed lights S1, S2 emit light in response to a clock pulse of the clock signal LTC sent from the signal generating portion 22a. Thereby, the DFB semiconductor laser elements 30, 32 emit the seed lights S1, S2 at a specific frequency (oscillation frequency) Fa in response to the respective clock pulses (oscillation frequency Fa) of the clock signal LTC. The control circuit 22 is controlled by the control device 16. The period (=1/Fa) of the clock pulse of the clock signal LTC is referred to as a reference period Ta. The seed lights S1, S2 generated in the DFB semiconductor laser elements 30, 32 are guided to the polarization beam splitter 34.
再者，該成為基準時脈訊號之時脈訊號LTC係成為被供給至用以指定點陣圖狀之圖案資料之記憶電路中之列方向之位址之計數器部CONn(CON1~CON6)(參照圖14)之各者之像素移位脈衝BSC(BSCa、BSCb)之基準者，詳情見下文。又，對於訊號產生部22a，自控制裝置16輸入用以進行基板P之被照射面上之描繪線SLn之整體倍率修正之整體倍 率修正資訊TMg、與用以進行描繪線SLn之局部倍率修正之局部倍率修正資訊CMgn(CMg1~CMg6)。藉此，可對基板P之被照射面上之描繪線SLn之長度(掃描長度)進行微調整，該情形於下文進行詳細說明。該描繪線SLn之伸縮(掃描長度之微調整)可於描繪線SLn之最大掃描長度(例如31mm)之範圍內進行。再者，本第1實施形態中之所謂整體倍率修正，若簡單說明，則係指如下修正：保持描繪資料上之1像素(1位元)中所包含之聚焦光之數量為固定之狀態而將沿主掃描方向投射之聚焦光SP之投射間隔(亦即，聚焦光之振盪頻率)均一地進行微調整，藉此一致地修正描繪線SLn整體之掃描方向之倍率。又，本第1實施形態中之所謂局部倍率修正，若簡單說明，則係指如下修正：以位於設定在1描繪線上之離散之複數個修正點之各者之1像素(1位元)為對象，使該修正點之像素中應包含之聚焦光之數量相對於鄰接之另一像素中應包含之聚焦光之數量增減，藉此使描繪於基板上之各修正點處之像素之大小沿主掃描方向略微伸縮。 Further, the clock signal LTC which becomes the reference clock signal is the counter unit CONn (CON1 to CON6) which is supplied to the address in the column direction of the memory circuit for designating the pattern data of the dot pattern (refer to The reference of the pixel shift pulse BSC (BSCa, BSCb) of each of FIG. 14) is described below. Further, the signal generating unit 22a inputs the entire magnification of the overall magnification correction of the drawing line SLn on the illuminated surface of the substrate P from the control device 16. The rate correction information TMg and the local magnification correction information CMgn (CMg1 to CMg6) for performing local magnification correction of the drawing line SLn. Thereby, the length (scanning length) of the drawing line SLn on the illuminated surface of the substrate P can be finely adjusted, which will be described in detail below. The expansion and contraction of the drawing line SLn (fine adjustment of the scanning length) can be performed within the range of the maximum scanning length (for example, 31 mm) of the drawing line SLn. In the first embodiment, the overall magnification correction in the first embodiment is a correction in which the number of focused lights included in one pixel (one bit) on the drawing data is fixed. The projection interval of the focused light SP projected in the main scanning direction (that is, the oscillation frequency of the focused light) is finely adjusted uniformly, thereby uniformly correcting the magnification of the scanning direction of the entire drawing line SLn. In the first embodiment, the local magnification correction in the first embodiment is modified as follows: one pixel (1 bit) of each of a plurality of discrete correction points located on the 1 drawing line is The object is such that the number of focused lights that should be included in the pixels of the correction point is increased or decreased relative to the amount of focused light that should be included in another adjacent pixel, thereby sizing the pixels at each correction point on the substrate Slightly expand and contract along the main scanning direction.
偏光分光器34係使S偏光之光透過且反射P偏光之光者，將DFB半導體雷射元件30所產生之種子光S1與DFB半導體雷射元件32所產生之種子光S2引導至電光元件36。詳細而言，偏光分光器34係藉由使DFB半導體雷射元件30所產生之S偏光之種子光S1透過而將種子光S1引導至電光元件36。又，偏光分光器34係藉由反射DFB半導體雷射元件32所產生之P偏光之種子光S2而將種子光S2引導至電光元件36。DFB半導體雷射元件30、32、及偏光分光器34構成生成種子光S1、S2之脈衝光源部35。 The polarizing beam splitter 34 transmits the S-polarized light and reflects the P-polarized light, and directs the seed light S1 generated by the DFB semiconductor laser element 30 and the seed light S2 generated by the DFB semiconductor laser element 32 to the electro-optic element 36. . Specifically, the polarization beam splitter 34 guides the seed light S1 to the electro-optical element 36 by transmitting the S-polarized seed light S1 generated by the DFB semiconductor laser element 30. Further, the polarization beam splitter 34 guides the seed light S2 to the electro-optical element 36 by reflecting the P-polarized seed light S2 generated by the DFB semiconductor laser element 32. The DFB semiconductor laser elements 30 and 32 and the polarization beam splitter 34 constitute a pulse light source unit 35 that generates the seed lights S1 and S2.
電光元件(強度調變部)36係對於種子光S1、S2具有透過 性者，例如使用電光調變器(EOM：Electro-Optic Modulator)。電光元件36係響應描繪位元串資料SBa(SBb)之高位準/低位準狀態而藉由驅動電路36a切換種子光S1、S2之偏光狀態者。描繪位元串資料SBa係基於與掃描單元U1~U3之各者應曝光之圖案相應之圖案資料(位元圖案)而生成者，描繪位元串資料SBb係基於與掃描單元U4~U6之各者應曝光之圖案相應之圖案資料(位元圖案)而生成者。因此，描繪位元串資料SBa被輸入至光源裝置LSa之驅動電路36a，描繪位元串資料SBb被輸入至光源裝置LSb之驅動電路36a。由於來自DFB半導體雷射元件30、DFB半導體雷射元件32之各者之種子光S1、S2之波長區域較長，為800nm以上，故而作為電光元件36可使用偏光狀態之切換響應性為GHz程度者。 The electro-optical element (intensity modulation unit) 36 is permeable to the seed light S1, S2 For example, an electro-optical modulator (EOM: Electro-Optic Modulator) is used. The electro-optic element 36 switches the polarization state of the seed lights S1, S2 by the drive circuit 36a in response to the high level/low level state in which the bit string data SBa (SBb) is drawn. The drawing bit string data SBa is generated based on the pattern data (bit pattern) corresponding to the pattern to be exposed by each of the scanning units U1 to U3, and the drawing bit string data SBb is based on each of the scanning units U4 to U6. The person should be generated by the corresponding pattern data (bit pattern) of the exposed pattern. Therefore, the drawing bit string data SBa is input to the driving circuit 36a of the light source device LSa, and the drawing bit string data SBb is input to the driving circuit 36a of the light source device LSb. Since the wavelength regions of the seed lights S1 and S2 from each of the DFB semiconductor laser device 30 and the DFB semiconductor laser device 32 are longer than 800 nm, the switching responsiveness of the polarizing state can be GHz as the electro-optical element 36. By.
圖案資料(描繪資料)係針對每個掃描單元Un而設置，且將藉由各掃描單元Un而描繪之圖案按照根據聚焦光SP之大小φ而設定之尺寸Pxy之像素進行分割，將複數個像素之各者以與上述圖案相應之邏輯資訊(像素資料)表示者。亦即，該圖案資料係由以將沿著聚焦光SP之主掃描方向(Y方向)之方向設為列方向且將沿著基板P之副搬送方向(X方向)之方向設為行方向之方式被二維分解之複數個像素之邏輯資訊所構成的點陣圖資料。該像素之邏輯資訊係「0」或「1」之1位元之資料。「0」之邏輯資訊意味著將照射至基板P之聚焦光SP之強度設為低位準(非描繪)，「1」之邏輯資訊意味著將照射至基板P上之聚焦光SP之強度設為高位準(描繪)。再者，將像素之尺寸Pxy之主掃描方向(Y方向)之尺寸設為Py，將副掃描方向(X方向)之尺寸設為Px。 The pattern data (drawing data) is provided for each scanning unit Un, and the pattern drawn by each scanning unit Un is divided into pixels of a size Pxy set according to the size φ of the focused light SP, and a plurality of pixels are divided. Each of them is represented by logical information (pixel data) corresponding to the above pattern. That is, the pattern data is set such that the direction along the main scanning direction (Y direction) of the focused light SP is the column direction and the direction along the sub-transporting direction (X direction) of the substrate P is the row direction. A bitmap data composed of logical information of a plurality of pixels which are two-dimensionally decomposed. The logical information of the pixel is the data of one bit of "0" or "1". The logical information of "0" means that the intensity of the focused light SP irradiated onto the substrate P is set to a low level (not drawn), and the logical information of "1" means that the intensity of the focused light SP irradiated onto the substrate P is set to High level (depiction). Further, the size of the main scanning direction (Y direction) of the pixel size Pxy is Py, and the size of the sub-scanning direction (X direction) is Px.
圖案資料之1行之像素之邏輯資訊係對應於1條之描繪線 SLn(SL1~SL6)者。因此，1行之像素之數量係根據基板P之被照射面上之像素之尺寸Pxy與描繪線SLn之長度而決定。該1像素之尺寸Pxy被設定為與聚焦光SP之大小φ同等程度或其以上，例如於聚焦光SP之有效大小φ為3μm之情形時，1像素之尺寸Pxy被設定為3μm見方程度以上。根據1行之像素之邏輯資訊，而將沿著1條描繪線SLn(SL1~SL6)投射至基板P之聚焦光SP之強度進行調變。將該1行之像素之邏輯資訊稱為串列資料DLn。亦即，圖案資料係串列資料DLn於行方向排列而成之點陣圖資料。將掃描單元U1之圖案資料之串列資料DLn以DL1表示，同樣地，將掃描單元U2~U6之圖案資料之串列資料DLn以DL2~DL6表示。 The logical information of the pixels of the 1 line of the pattern data corresponds to the drawing line of 1 line SLn (SL1~SL6). Therefore, the number of pixels in one line is determined according to the size Pxy of the pixel on the illuminated surface of the substrate P and the length of the drawing line SLn. The size Pxy of the one pixel is set to be equal to or larger than the size φ of the focused light SP. For example, when the effective size φ of the focused light SP is 3 μm, the size Pxy of one pixel is set to be more than 3 μm square. The intensity of the focused light SP projected onto the substrate P along one of the drawing lines SLn (SL1 to SL6) is modulated according to the logical information of the pixels of one line. The logical information of the pixels of one line is referred to as serial data DLn. That is, the pattern data is a bitmap data in which the serial data DLn is arranged in the row direction. The tandem data DLn of the pattern data of the scanning unit U1 is represented by DL1, and similarly, the tandem data DLn of the pattern data of the scanning units U2 to U6 is represented by DL2 to DL6.
又，掃描模組之3個掃描單元U1~U3(U4~U6)反覆執行依照特定之順序逐次進行聚焦光SP之掃描之動作，因此與之對應地，掃描模組之3個掃描單元U1~U3(U4~U6)之圖案資料之串列資料DL1~DL3(DL4~DL6)亦依照特定之順序被輸出至光源裝置LSa(LSb)之驅動電路36a。將依序輸出至該光源裝置LSa之驅動電路36a之串列資料DL1~DL3稱為描繪位元串資料SBa，將依序輸出至該光源裝置LSb之驅動電路36a之串列資料DL4~DL6稱為描繪位元串資料SBb。 Moreover, the three scanning units U1 to U3 (U4 to U6) of the scanning module repeatedly perform the scanning operation of the focused light SP in a predetermined order, and accordingly, the scanning unit U1 of the scanning module is correspondingly The serial data DL1 to DL3 (DL4 to DL6) of the pattern data of U3 (U4 to U6) are also output to the drive circuit 36a of the light source device LSa (LSb) in a specific order. The serial data DL1 to DL3 sequentially outputted to the driving circuit 36a of the light source device LSa is referred to as a drawing bit string data SBa, and is sequentially outputted to the serial data DL4 to DL6 of the driving circuit 36a of the light source device LSb. To draw the bit string data SBb.
例如，於第1掃描模組中，進行聚焦光SP之掃描之掃描單元Un之順序為U1→U2→U3之情形時，首先，1行之串列資料DL1被輸出至光源裝置LSa之驅動電路36a，繼而，1行之串列資料DL2被輸出至光源裝置LSa之驅動電路36a等狀態時，構成描繪位元串資料SBa之1行之串列資料DL1~DL3以DL1→DL2→DL3之順序被輸出至光源裝置LSa之驅動電路36a。其後，下一行串列資料DL1~DL3以DL1→DL2→DL3之順序作 為描繪位元串資料SBa被輸出至光源裝置LSa之驅動電路36a。同樣地，於第2掃描模組中，進行聚焦光SP之掃描之掃描單元Un之順序為U4→U5→U6之情形時，首先，1行之串列資料DL4被輸出至光源裝置LSb之驅動電路36a，繼而，1行之串列資料DL5被輸出至光源裝置LSb之驅動電路36a等狀態時，構成描繪位元串資料SBb之1行之串列資料DL4~DL6以DL4→DL5→DL6之順序被輸出至光源裝置LSb之驅動電路36a。其後，下一行串列資料DL4~DL6以DL4→DL5→DL6之順序作為描繪位元串資料SBb被輸出至光源裝置LSb之驅動電路36a。關於對該光源裝置LSa(LSb)之驅動電路36a輸出描繪位元串資料SBa(SBb)之具體構成，於下文進行詳細說明。 For example, in the case where the scanning unit Un for scanning the focused light SP is in the order of U1 → U2 → U3 in the first scanning module, first, the one-line serial data DL1 is output to the driving circuit of the light source device LSa. 36a, then, when the one-line serial data DL2 is output to the drive circuit 36a of the light source device LSa, etc., the serial data DL1 to DL3 which constitute one line of the bit string data SBa are arranged in the order of DL1 → DL2 → DL3. It is output to the drive circuit 36a of the light source device LSa. Thereafter, the next line of serial data DL1~DL3 is in the order of DL1→DL2→DL3 The drawing bit data SBa is output to the driving circuit 36a of the light source device LSa. Similarly, in the case where the scanning unit Un for scanning the focused light SP is in the order of U4 → U5 → U6 in the second scanning module, first, the one-line serial data DL4 is output to the driving of the light source device LSb. In the circuit 36a, when the one-line serial data DL5 is output to the driving circuit 36a of the light source device LSb or the like, the serial data DL4 to DL6 which constitute one line of the bit string data SBb are formed by DL4 → DL5 → DL6. The sequence is output to the drive circuit 36a of the light source device LSb. Thereafter, the next-line serial data DL4 to DL6 are output to the drive circuit 36a of the light source device LSb as the drawing bit string data SBb in the order of DL4 → DL5 → DL6. The specific configuration of the output bit string data SBa (SBb) for the drive circuit 36a of the light source device LSa (LSb) will be described in detail below.
於輸入至驅動電路36a之描繪位元串資料SBa(SBb)之1像素之邏輯資訊為低位準(「0」)狀態時，電光元件36不改變種子光S1、S2之偏光狀態而直接將其引導至偏光分光器38。另一方面，於輸入至驅動電路36a之描繪位元串資料SBa(SBb)之1像素之邏輯資訊為高位準(「1」)狀態時，電光元件36改變所入射之種子光S1、S2之偏光狀態、亦即將偏光方向改變90度而將其引導至偏光分光器38。如此，驅動電路36a基於描繪位元串資料SBa(SBb)而驅動電光元件36，藉此，電光元件36於描繪位元串資料SBa(SBb)之像素之邏輯資訊為高位準狀態(「1」)時，將S偏光之種子光S1轉換為P偏光之種子光S1，將P偏光之種子光S2轉換為S偏光之種子光S2。 When the logic information of one pixel of the drawing bit string data SBa (SBb) input to the driving circuit 36a is in the low level ("0" state), the electrooptic element 36 directly changes the polarization state of the seed lights S1, S2 without changing the polarization state of the seed light S1, S2. It is guided to the polarizing beam splitter 38. On the other hand, when the logic information of one pixel of the drawing bit string data SBa(SBb) input to the driving circuit 36a is in the high level ("1") state, the electro-optical element 36 changes the incident seed light S1, S2. The polarization state, that is, the polarization direction is changed by 90 degrees, and is guided to the polarization beam splitter 38. In this manner, the driving circuit 36a drives the electro-optical element 36 based on the drawing bit string data SBa (SBb), whereby the logic information of the pixel of the electro-optical element 36 in the drawing bit string data SBa (SBb) is in a high level state ("1" When the S-polarized seed light S1 is converted into the P-polarized seed light S1, the P-polarized seed light S2 is converted into the S-polarized seed light S2.
偏光分光器38係使P偏光之光透過而經由透鏡元件GL將其引導至合併器44，且使S偏光之光反射而將其引導至吸收體40者。將透 過該偏光分光器38之光(種子光)以射束Lse表示。該脈衝狀之射束Lse之振盪頻率成為Fa。激發光源42產生激發光，該產生之激發光通過光纖42a而被引導至合併器44。合併器44將自偏光分光器38照射之射束Lse與激發光合成並輸出至光纖光放大器46。光纖光放大器46摻雜有由激發光激發之雷射介質。因此，於經合成之射束Lse及激發光傳輸之光纖光放大器46內，藉由激發光激發雷射介質，藉此作為種子光之射束Lse放大。作為摻雜於光纖光放大器46內之雷射介質，使用鉺(Er)、鐿(Yb)、銩(Tm)等稀土類元素。該經放大之射束Lse自光纖光放大器46之射出端46a伴有特定之發散角地放射，並藉由透鏡元件GL收斂或準直而入射至波長轉換光學元件48。 The polarizing beam splitter 38 transmits P-polarized light and guides it to the combiner 44 via the lens element GL, and reflects the S-polarized light to guide it to the absorber 40. Will be transparent The light (seed light) passing through the polarizing beam splitter 38 is represented by a beam Lse. The oscillation frequency of the pulsed beam Lse is Fa. Excitation source 42 produces excitation light that is directed through beam 42a to combiner 44. The combiner 44 combines the beam Lse irradiated from the polarization beam splitter 38 with the excitation light and outputs it to the fiber optical amplifier 46. The fiber optic amplifier 46 is doped with a laser medium that is excited by excitation light. Therefore, in the fiber optical amplifier 46 in which the combined beam Lse and the excitation light are transmitted, the laser medium is excited by the excitation light, thereby being amplified as the beam Lse of the seed light. As the laser medium doped in the optical fiber optical amplifier 46, a rare earth element such as Er (Er), Yb (Yb) or Tm (Tm) is used. The amplified beam Lse is radiated from the emitting end 46a of the fiber optical amplifier 46 with a specific divergence angle, and is incident on the wavelength converting optical element 48 by the convergence or collimation of the lens element GL.
波長轉換光學元件(第1波長轉換光學元件)48係藉由二次諧波產生(Second Harmonic Generation：SHG)而將所入射之射束Lse(波長λ)轉換為波長為λ之1/2之二次諧波。作為波長轉換光學元件48，較佳地使用作為准相位匹配(Quasi Phase Matching：QPM)晶體之PPLN(Periodically Poled LiNbO3)晶體。再者，亦可使用PPLT(Periodically Poled LiTaO3)晶體等。 The wavelength conversion optical element (first wavelength conversion optical element) 48 converts the incident beam Lse (wavelength λ) into a wavelength λ of λ by second harmonic generation (SHG). Second harmonic. As the wavelength conversion optical element 48, a PPLN (Periodically Poled LiNbO 3 ) crystal which is a Quasi Phase Matching (QPM) crystal is preferably used. Further, a PPLT (Periodically Poled LiTaO 3 ) crystal or the like can also be used.
波長轉換光學元件(第2波長轉換光學元件)50係藉由經波長轉換光學元件48轉換後之二次諧波(波長λ/2)與未經波長轉換光學元件48轉換而殘留之種子光(波長λ)之和頻產生(Sum Frequency Generation：SFG)，而產生波長為λ之1/3之三次諧波。該三次諧波成為於370mm以下之波長頻帶(例如355nm)具有峰值波長之紫外線光(射束LB)。 The wavelength conversion optical element (second wavelength conversion optical element) 50 is a seed light which is retained by the second harmonic (wavelength λ/2) converted by the wavelength conversion optical element 48 and converted without the wavelength conversion optical element 48 ( The sum of the wavelengths λ) is generated by Sum Frequency Generation (SFG), and the third harmonic of the wavelength λ is generated. The third harmonic is ultraviolet light (beam LB) having a peak wavelength in a wavelength band of 370 mm or less (for example, 355 nm).
如圖8所示，於施加至驅動電路36a之描繪位元串資料SBa (SBb)之1像素之邏輯資訊為低位準(「0」)之情形時，電光元件(強度調變部)36不改變所入射之種子光S1、S2之偏光狀態而直接將其引導至偏光分光器38。因此，透過偏光分光器38之射束Lse成為種子光S2。因此，自光源裝置LSa(LSb)最終輸出之P偏光之LBa(LBb)具有與來自DFB半導體雷射元件32之種子光S2相同之振盪分佈(時間特性)。即，於該情形時，射束LBa(LBb)係脈衝之波峰強度較低而成為時間上遲滯之鈍化特性。由於光纖光放大器46對於此種波峰強度較低之種子光S2之放大效率較低，故而自光源裝置LSa(LSb)射出之射束LBa(LBb)成為無法放大至曝光所必需之能量之光。因此，就曝光之觀點而言，實質上成為與光源裝置LSa(LSb)未射出射束LBa(LBb)相同之結果。亦即，照射至基板P之聚焦光SP之強度成為低位準。但，於未進行圖案之曝光期間(非曝光期間)，源自種子光S2之紫外區之射束LBa(LBb)雖強度微小但仍持續照射。因此，於描繪線SL1~SL6長時間在基板P上之同一位置持續某種狀態之情形(例如，因搬送系統之故障而導致基板P停止之情形等)時，宜在光源裝置LSa(LSb)之射束LBa(LBb)之射出窗(省略圖示)設置可動擋板，將射出窗關閉。 As shown in FIG. 8, the drawing bit string data SBa is applied to the driving circuit 36a. When the logical information of one pixel of (SBb) is a low level ("0"), the electro-optical element (intensity modulation unit) 36 directly directs the polarization of the incident seed light S1, S2 to the polarized light. Beam splitter 38. Therefore, the beam Lse transmitted through the polarization beam splitter 38 becomes the seed light S2. Therefore, the L-polarized light LBa (LBb) which is finally output from the light source device LSa (LSb) has the same oscillation distribution (time characteristic) as the seed light S2 from the DFB semiconductor laser element 32. That is, in this case, the peak intensity of the beam of the beam LBa (LBb) is low and becomes a passivation characteristic of temporal lag. Since the fiber optical amplifier 46 has low amplification efficiency for the seed light S2 having such a low peak intensity, the beam LBa (LBb) emitted from the light source device LSa (LSb) becomes light that cannot be amplified to the energy necessary for exposure. Therefore, from the viewpoint of exposure, substantially the same result as that of the light source device LSa (LSb) not emitting the beam LBa (LBb). That is, the intensity of the focused light SP irradiated onto the substrate P becomes a low level. However, during the exposure period in which the pattern is not performed (non-exposure period), the beam LBa (LBb) derived from the ultraviolet region of the seed light S2 is continuously irradiated although the intensity is small. Therefore, when the drawing lines SL1 to SL6 continue to be in a certain state at the same position on the substrate P for a long time (for example, when the substrate P is stopped due to a failure of the transport system), it is preferable to use the light source device LSa (LSb). The emission window (not shown) of the beam LBa (LBb) is provided with a movable shutter to close the emission window.
另一方面，如圖8所示，於施加至驅動電路36a之描繪位元串資料SBa(SBb)之1像素之邏輯資訊為高位準(「1」)之情形時，電光元件(強度調變部)36改變所入射之種子光S1、S2之偏光狀態而將其引導至偏光分光器38。因此，透過偏光分光器38之射束Lse成為種子光S1。因此，自光源裝置LSa(LSb)射出之射束LBa(LBb)成為由來自DFB半導體雷射元件30之種子光S1所生成者。由於來自DFB半導體雷射元件30之種子 光S1之波峰強度較強，故而藉由光纖光放大器46有效率地放大而自光源裝置LSa(LSb)輸出之P偏光之射束LBa(LBb)具有基板P之曝光所必需之能量。亦即，照射至基板P之聚焦光SP之強度成為高位準。 On the other hand, as shown in FIG. 8, when the logic information of one pixel of the drawing bit string data SBa (SBb) applied to the driving circuit 36a is a high level ("1"), the electro-optic element (intensity modulation) The portion 36 changes the polarization state of the incident seed lights S1, S2 and directs it to the polarization beam splitter 38. Therefore, the beam Lse transmitted through the polarization beam splitter 38 becomes the seed light S1. Therefore, the beam LBa (LBb) emitted from the light source device LSa (LSb) is generated by the seed light S1 from the DFB semiconductor laser element 30. Due to the seed from the DFB semiconductor laser element 30 Since the peak intensity of the light S1 is strong, the P-polarized beam LBa (LBb) output from the light source device LSa (LSb) by the optical fiber amplifier 46 has the energy necessary for the exposure of the substrate P. That is, the intensity of the focused light SP irradiated onto the substrate P becomes a high level.
如此，由於在光源裝置LSa(LSb)內設置有作為描繪用光調變器之電光元件36，故而可藉由控制1個電光元件(強度調變部)36，而使藉由掃描模組之3個掃描單元U1~U3(U4~U6)掃描之聚焦光SP之強度根據應描繪之圖案進行調變。因此，自光源裝置LSa(LSb)射出之射束LBa(LBb)成為強度經調變之描繪射束。 In this way, since the electro-optical element 36 as the light modulator for drawing is provided in the light source device LSa (LSb), one electro-optical element (intensity modulation unit) 36 can be controlled by the scanning module. The intensity of the focused light SP scanned by the three scanning units U1 to U3 (U4 to U6) is modulated according to the pattern to be drawn. Therefore, the beam LBa (LBb) emitted from the light source device LSa (LSb) becomes a intensity-modulated drawing beam.
此處，本第1實施形態中，即便於驅動電路36a未被施加描繪位元串資料SBa(DL1~DL3)、SBb(DL4~DL6)期間，亦自光源裝置LSa、LSb射出源自種子光S2之射束LBa、LBb。因此，即便於可進行聚焦光SP之掃描之最大掃描長度(例如31mm)以下之範圍內設定描繪線SLn之有效掃描長度(例如30mm)，實際上聚焦光SP仍遍及最大掃描長度之整個範圍地沿主掃描方向進行掃描。但，投射至描繪線SLn以外之位置之聚焦光SP之強度為低位準。因此，本第1實施形態之所謂描繪線SLn係指根據各串列資料DL1~DL6而調變聚焦光SP之強度後所掃描的、亦即描繪的掃描線。因此，沿著描繪線SLn之聚焦光SP之掃描期間與串列資料DLn之各像素之邏輯資訊輸出期間大致相同。 Here, in the first embodiment, even when the drawing bit string data SBa (DL1 to DL3) and SBb (DL4 to DL6) are not applied to the drive circuit 36a, the light source device LSa, LSb emits the seed light. Beams LBa, LBb of S2. Therefore, even if the effective scanning length (for example, 30 mm) of the drawing line SLn is set within a range in which the maximum scanning length (for example, 31 mm) of the scanning of the focused light SP can be performed, the focused light SP is actually spread over the entire range of the maximum scanning length. Scan in the main scan direction. However, the intensity of the focused light SP projected to a position other than the drawing line SLn is a low level. Therefore, the drawing line SLn in the first embodiment refers to a scanning line which is scanned after the intensity of the focused light SP is modulated in accordance with each of the serial data DL1 to DL6. Therefore, the scanning period of the focused light SP along the drawing line SLn is substantially the same as the logical information output period of each pixel of the serial data DLn.
再者，亦可考慮在圖7之構成中，省略DFB半導體雷射元件32及偏光分光器34，僅將來自DFB半導體雷射元件30之種子光S1利用基於圖案資料(描繪位元串資料SBa、SBb、或串列資料DLn)之電光元件36之偏光狀態之切換而呈猝發波狀地導光至光纖光放大器46。然而，若採 用該構成，則種子光S1向光纖光放大器46之入射週期性會根據應描繪之圖案而較大程度地紊亂。即，若於來自DFB半導體雷射元件30之種子光S1不入射至光纖光放大器46之狀態持續之後，種子光S1入射至光纖光放大器46，則剛入射後之種子光S1以較通常時更大之放大率放大，而存在自光纖光放大器46產生具有規定以上大小之強度之射束的問題。對此，本第1實施形態中，作為較佳之態樣，於種子光S1不入射至光纖光放大器46期間，將來自DFB半導體雷射元件32之種子光S2(波峰強度較低之遲滯之脈衝光)入射至光纖光放大器46，藉此解決了此種問題。 Further, in the configuration of FIG. 7, it is also conceivable that the DFB semiconductor laser element 32 and the polarization beam splitter 34 are omitted, and only the seed light S1 from the DFB semiconductor laser element 30 is used based on pattern data (drawing bit string data SBa) The polarization state of the electro-optical element 36 of the SBb or the serial data DLn is switched to the optical fiber amplifier 46 in a wave-like manner. However, if With this configuration, the incident periodicity of the seed light S1 to the optical fiber amplifier 46 is largely disturbed in accordance with the pattern to be drawn. That is, if the seed light S1 is incident on the fiber optical amplifier 46 after the seed light S1 from the DFB semiconductor laser element 30 is not incident on the optical fiber amplifier 46, the seed light S1 immediately after the incident is more normal. The amplification factor is large, and there is a problem that the fiber optical amplifier 46 generates a beam having a strength of a predetermined size or more. On the other hand, in the first embodiment, as the preferred embodiment, the seed light S2 from the DFB semiconductor laser element 32 (the pulse having a lower peak intensity is delayed) during the period when the seed light S1 is not incident on the optical fiber amplifier 46. Light) is incident on the fiber optic amplifier 46, thereby solving this problem.
又，雖係將電光元件36開關，但亦可基於圖案資料(描繪位元串資料SBa、SBb、或串列資料DLn)而驅動DFB半導體雷射元件30、32。於該情形時，該DFB半導體雷射元件30、32作為描繪用光調變器(強度調變部)發揮功能。亦即，控制電路22基於描繪位元串資料SBa(DL1~DL3)、SBb(DL4~DL6)控制DFB半導體雷射元件30、32，選擇性(二者擇一)地產生以特定頻率Fa呈脈衝狀振盪之種子光S1、S2。於該情形時，不需要偏光分光器34、38、電光元件36、及吸收體40，自DFB半導體雷射元件30、32之任一者選擇性地脈衝振盪之種子光S1、S2之一者直接入射至合併器44。此時，控制電路22以避免來自DFB半導體雷射元件30之種子光S1與來自DFB半導體雷射元件32之種子光S2同時入射至光纖光放大器46之方式控制各DFB半導體雷射元件30、32之驅動。即，於對基板P照射各射束LBn之聚焦光SP之情形時，以僅種子光S1入射至光纖光放大器46之方式控制DFB半導體雷射元件30。又，於不對基板P照射各射束LBn之聚焦光SP(使聚焦光SP之強度極低)之情形時，以僅種子光S2入射至 光纖光放大器46之方式控制DFB半導體雷射元件32。如此，是否對基板P照射射束LBn係根據像素之邏輯資訊(高位準/低位準)來決定。又，該情形時之種子光S1、S2之偏光狀態均為P偏光即可。 Further, although the electro-optical element 36 is switched, the DFB semiconductor laser elements 30 and 32 may be driven based on pattern data (drawing the bit string data SBa, SBb, or the serial data DLn). In this case, the DFB semiconductor laser elements 30 and 32 function as a light modulator (intensity modulation unit) for drawing. That is, the control circuit 22 controls the DFB semiconductor laser elements 30, 32 based on the rendered bit string data SBa (DL1 ~ DL3), SBb (DL4 ~ DL6), selectively (alternatively) generated at a specific frequency Fa Pulsed oscillating seed light S1, S2. In this case, the polarization beam splitters 34, 38, the electro-optical element 36, and the absorber 40 are not required, and one of the seed lights S1, S2 selectively pulse-pulsed from either of the DFB semiconductor laser elements 30, 32 is required. Directly incident to the combiner 44. At this time, the control circuit 22 controls the respective DFB semiconductor laser elements 30, 32 in such a manner that the seed light S1 from the DFB semiconductor laser element 30 and the seed light S2 from the DFB semiconductor laser element 32 are simultaneously incident on the fiber optical amplifier 46. Drive. That is, in the case where the substrate P is irradiated with the focused light SP of each of the beams LBn, the DFB semiconductor laser element 30 is controlled such that only the seed light S1 is incident on the optical fiber optical amplifier 46. Further, when the substrate P is not irradiated with the focused light SP of each of the beams LBn (the intensity of the focused light SP is extremely low), only the seed light S2 is incident on the substrate. The fiber optic optical amplifier 46 controls the DFB semiconductor laser element 32 in a manner. Thus, whether or not the substrate P is irradiated with the beam LBn is determined based on the logical information (high level/low level) of the pixel. Further, in this case, the polarization states of the seed lights S1 and S2 may be P-polarized light.
此處，光源裝置LSa(LSb)係於聚焦光SP之掃描中，以對於基板P之被照射面上之尺寸Pxy之1像素，聚焦光SP沿主掃描方向投射N個(本第1實施形態中，設為N=8)之方式，射出射束LBa(LBb)。自該光源裝置LSa(LSb)射出之射束LBa(LBb)係響應訊號產生部22a所產生之時脈訊號LTC之時脈脈衝而產生。因此，為了對尺寸Pxy之1像素投射N個(N為2以上之整數)聚焦光SP，而於將主掃描方向上聚焦光SP相對於基板P之相對之掃描速度設為Vs時，訊號產生部22a必須以由Pxy/(N×Vs)或Py/(N×Vs)決定之基準週期Ta(=1/Fa)產生時脈訊號LTC之時脈脈衝。例如，若將有效描繪線SLn之長度設為30mm，將1次掃描時間Tsp設為200μsec，則聚焦光SP之掃描速度Vs成為150m/sec。而且，於像素之尺寸Pxy(Px及Py)為與聚焦光SP之有效大小相同之3μm且N為8個之情形時，基準週期Ta=3μm/(8×150m/sec)=0.0025μsec，該頻率Fa(=1/Ta)成為400MHz。 Here, the light source device LSa (LSb) is in the scanning of the focused light SP, and N of the focused light SP is projected in the main scanning direction with respect to one pixel of the size Pxy on the illuminated surface of the substrate P (this first embodiment) In the case where N=8), the beam LBa(LBb) is emitted. The beam LBa (LBb) emitted from the light source device LSa (LSb) is generated in response to a clock pulse of the clock signal LTC generated by the signal generating portion 22a. Therefore, in order to project N (N is an integer of 2 or more) focused light SP for one pixel of the size Pxy, the signal is generated when the relative scanning speed of the focused light SP with respect to the substrate P in the main scanning direction is Vs. The portion 22a must generate a clock pulse of the clock signal LTC with a reference period Ta (=1/Fa) determined by Pxy/(N × Vs) or Py / (N × Vs). For example, when the length of the effective drawing line SLn is 30 mm and the scanning time Tsp is 200 μsec, the scanning speed Vs of the focused light SP is 150 m/sec. Further, when the pixel size Pxy (Px and Py) is 3 μm and N is the same as the effective size of the focused light SP, the reference period Ta = 3 μm / (8 × 150 m / sec) = 0.0025 μsec, The frequency Fa (=1/Ta) becomes 400 MHz.
原則上，對於1像素對應有N(=8)個聚焦光SP，因此每當時脈訊號LTC之時脈脈衝輸出N個(8個)時，由輸出至驅動電路36a之串列資料DL1~DL3(DL4~DL6)所構成之描繪位元串資料SBa(SBb)之像素之邏輯資訊便向列方向移位1個。如圖8所示，若自開始輸出作為某像素之像素資料之邏輯資訊(「1」)後輸出8個時脈脈衝，則輸出下一像素之邏輯資訊之「0」。而且，為了對各描繪線SL1~SL3(SL4~SL6)之長 度局部地進行倍率修正，對於在各描繪線SL1~SL3(SL4~SL6)上離散地呈等間隔配置之成為修正對象之像素(以下為修正像素)，對應有N±m個(m為具有m<N之關係的1以上之整數)之聚焦光SP。因此，若對修正像素輸出N±m個時脈訊號LTC之時脈脈衝，則輸出至驅動電路36a之描繪位元串資料SBa(SBb)之像素之邏輯資訊向列方向移位1個。例如，於N為8、m為1之情形時，對於修正像素投射7個或9個聚焦光SP。因此，修正像素於主掃描方向伸縮，結果，描繪線SL1~SL3(SL4~SL6)之各者整體性地伸縮。對於修正像素以外之非修正像素，投射8個聚焦光SP。該修正像素之指定及修正像素之主掃描方向上之伸縮率(倍率)係基於包含用以指定修正像素之修正位置資訊Nv及表示修正像素於主掃描方向上之伸縮率(倍率)之倍率資訊SCA的局部倍率修正資訊(修正資訊)CMgn而決定。再者，倍率資訊SCA係表示「±m」之值之資訊。該局部倍率修正資訊CMgn(CMg1~CMg6)針對每個掃描單元Un(U1~U6)而設置。 In principle, there are N (=8) focused lights SP corresponding to one pixel, so when N (eight) clock pulses are output for each pulse signal LTC, the serial data DL1 to DL3 outputted to the driving circuit 36a are output. The logical information of the pixels of the bit string data SBa (SBb) formed by (DL4 to DL6) is shifted by one in the column direction. As shown in FIG. 8, when eight clock pulses are outputted from the start of outputting logical information ("1") as pixel data of a certain pixel, "0" of the logical information of the next pixel is output. Moreover, in order to length the respective drawing lines SL1 to SL3 (SL4 to SL6) The magnification correction is performed locally, and the pixels to be corrected (hereinafter referred to as correction pixels) which are discretely arranged at equal intervals on the respective drawing lines SL1 to SL3 (SL4 to SL6) correspond to N±m (m is Focused light SP of an integer of 1 or more in the relationship of m < N. Therefore, when a clock pulse of N±m clock signals LTC is output to the correction pixel, the logical information of the pixel output to the drawing bit string data SBa (SBb) of the drive circuit 36a is shifted by one in the column direction. For example, when N is 8 and m is 1, 7 or 9 focused lights SP are projected for the corrected pixel. Therefore, the correction pixel expands and contracts in the main scanning direction, and as a result, each of the drawing lines SL1 to SL3 (SL4 to SL6) expands and contracts integrally. For the non-corrected pixels other than the corrected pixels, eight focused lights SP are projected. The correction pixel designation and the expansion ratio (magnification) in the main scanning direction of the correction pixel are based on the correction position information Nv for specifying the correction pixel and the magnification information indicating the expansion ratio (magnification) of the correction pixel in the main scanning direction. SCA's local magnification correction information (correction information) CMgn is determined. Furthermore, the rate information SCA is information indicating the value of "±m". The local magnification correction information CMgn (CMg1 to CMg6) is set for each scanning unit Un (U1 to U6).
本第1實施形態中，於不進行局部倍率修正之情形時，於每1描繪線SLn沿主掃描方向掃描80000之聚焦光SP，每1像素之聚焦光SP為8個，因此每1描繪線SLn之像素之數量(串列資料DLn之邏輯資訊之數量)為10000(=80000/8)。又，由於將「N」設為8，將「m」設為1，故而於進行局部倍率修正之情形時，對修正像素照射7個或9個(N±m個)聚焦光SP，而由於每1描繪線SLn之像素之數量仍為10000，故而於1描繪線SLn照射之聚焦光SP之數量變得多於或少於80000。例如，於伸長之情形時，對修正像素投射9個聚焦光SP，故而於每1描繪線SLn存在40個修正像素之情形時，於1描繪線SLn照射之聚焦光SP之數量成為80040。 又，於縮小之情形時，對修正像素投射7個聚焦光SP，故而於每1描繪線SLn存在40個修正像素之情形時，於1描繪線SLn照射之聚焦光SP之數量成為79960。 In the first embodiment, when the local magnification correction is not performed, the focused light SP of 80000 is scanned in the main scanning direction for each drawing line SLn, and the focused light SP per pixel is eight. The number of pixels of SLn (the number of logical information of the serial data DLn) is 10000 (=80000/8). Further, since "N" is set to 8 and "m" is set to 1, when the local magnification correction is performed, seven or nine (N ± m) focused lights SP are irradiated to the corrected pixels, The number of pixels per 1 drawing line SLn is still 10000, so the number of focused lights SP irradiated by the drawing line SLn becomes more or less than 80,000. For example, in the case of elongation, nine focused lights SP are projected on the correction pixels. Therefore, when there are 40 correction pixels per one drawing line SLn, the number of focused lights SP irradiated on the drawing line SLn becomes 80040. Further, in the case of reduction, the seven focused lights SP are projected on the correction pixels. Therefore, when there are 40 correction pixels per one drawing line SLn, the number of focused lights SP irradiated by the one drawing line SLn becomes 79960.
圖9係表示具有使光源裝置LSa(LSb)之修正像素伸縮之功能之訊號產生部22a之構成的圖。訊號產生部22a具有時脈產生部(振盪器)60、修正像素指定部62、及送出時序切換部64。該時脈產生部60、修正像素指定部62、及送出時序切換部64等可藉由FPGA(Field Programmable Gate Array)彙集而構成。 FIG. 9 is a view showing a configuration of a signal generating unit 22a having a function of expanding and contracting a correction pixel of the light source device LSa (LSb). The signal generation unit 22a includes a clock generation unit (oscillator) 60, a correction pixel designation unit 62, and a transmission timing switching unit 64. The clock generation unit 60, the correction pixel designation unit 62, the transmission timing switching unit 64, and the like can be configured by an FPGA (Field Programmable Gate Array).
時脈產生部60使與整體倍率修正資訊TMg相應之振盪頻率Fa之時脈訊號(基準時脈訊號)LTC振盪。本第1實施形態中，於整體倍率修正資訊TMg為0之情形時，時脈產生部60以400MHz之振盪頻率Fa產生(生成)時脈脈衝(時脈訊號LTC)。因此，於該情形時，光源裝置LS(LSa、LSb)將脈衝狀之射束LB(LBa、LBb)以400MHz射出。又，本第1實施形態中，於振盪頻率Fa為400MHz時，以80000個聚焦光SP沿著主掃描方向以0.375μm間隔照射之方式設定多角鏡PM之旋轉速度Vp，因此描繪線SLn之掃描長度成為30mm。若根據整體倍率修正資訊TMg而振盪頻率Fa變得高於400MHz，則於基板P之被照射面上之聚焦光SP之主掃描方向之投射間隔變短，其結果為，描繪線SLn變得短於30mm。相反地，若根據整體倍率修正資訊TMg而振盪頻率Fa變得低於400MHz，則於基板P之被照射面上之聚焦光SP之掃描方向之投射間隔變長，其結果為，描繪線SLn變得長於30mm。如此，可根據整體倍率修正資訊TMg而調整描繪線SLn之整體倍率。基板P之被照射面上之像素之主掃描方向上之尺 寸Pxy之長度根據該整體倍率修正資訊TMg而伸縮，但由於本第1實施形態中整體倍率修正資訊TMg係設為0(振盪頻率Fa=400MHz)，故而像素之尺寸Pxy成為與聚焦光SP之大小φ相同程度。時脈產生部60所產生之時脈訊號LTC被送至控制電路22，並且亦被送至修正像素指定部62及送出時序切換部64。 The clock generation unit 60 oscillates the clock signal (reference clock signal) LTC of the oscillation frequency Fa corresponding to the overall magnification correction information TMg. In the first embodiment, when the overall magnification correction information TMg is 0, the clock generation unit 60 generates (generates) a clock pulse (clock signal LTC) at an oscillation frequency Fa of 400 MHz. Therefore, in this case, the light source device LS (LSa, LSb) emits the pulsed beam LB (LBa, LBb) at 400 MHz. In the first embodiment, when the oscillation frequency Fa is 400 MHz, the rotation speed Vp of the polygon mirror PM is set so that the 80 Å focused light SP is irradiated at intervals of 0.375 μm along the main scanning direction, so that the scanning of the drawing line SLn is performed. The length is 30mm. When the oscillation frequency Fa becomes higher than 400 MHz based on the overall magnification correction information TMg, the projection interval of the focused light SP on the illuminated surface of the substrate P becomes shorter, and as a result, the drawing line SLn becomes shorter. At 30mm. On the other hand, when the oscillation frequency Fa becomes lower than 400 MHz based on the overall magnification correction information TMg, the projection interval in the scanning direction of the focused light SP on the illuminated surface of the substrate P becomes long, and as a result, the drawing line SLn becomes It is longer than 30mm. In this way, the overall magnification of the drawing line SLn can be adjusted based on the overall magnification correction information TMg. The ruler in the main scanning direction of the pixel on the illuminated surface of the substrate P The length of the inch Pxy is expanded and contracted based on the overall magnification correction information TMg. However, since the overall magnification correction information TMg is set to 0 (the oscillation frequency Fa=400 MHz) in the first embodiment, the pixel size Pxy becomes the focused light SP. The size φ is the same. The clock signal LTC generated by the clock generation unit 60 is sent to the control circuit 22, and is also sent to the correction pixel designation unit 62 and the transmission timing switching unit 64.
修正像素指定部62係於沿著各描繪線SLn(SL1~SL6)排列之複數個像素之中，將配置於特定之位置之至少1個像素指定為修正像素者。修正像素指定部62係基於作為局部倍率修正資訊(修正資訊)CMgn(CMg1~CMg6)之一部分之修正位置資訊(設定值)Nv而指定修正像素。局部倍率修正資訊(修正資訊)CMgn之修正位置資訊Nv係用以根據沿著描繪線SLn描繪之圖案之描繪倍率(或描繪線SLn之主掃描方向上之倍率)而對描繪線SLn上之等間隔地離散之複數個位置之各者指定修正像素的資訊，且係表示修正像素與修正像素之距離間隔(等間隔)之資訊。藉此，修正像素指定部62可將配置於描繪線SLn(SL1~SL6)上之等間隔地離散之位置的複數個像素指定為修正像素。沿各描繪線SLn(SL1~SL6)排列之複數個像素中之未被指定為修正像素之像素成為非修正像素，因此可謂，修正像素指定部62藉由指定修正像素而亦指定了非修正像素。再者，於「N±m」之「m」之值固定之情形時，應修正之描繪線SLn(SL1~SL6)之伸縮率越大，則所指定之修正像素之數量越多。 The corrected pixel specifying unit 62 designates at least one pixel arranged at a specific position as a corrected pixel among a plurality of pixels arranged along each drawing line SLn (SL1 to SL6). The corrected pixel specifying unit 62 specifies the corrected pixel based on the corrected position information (set value) Nv which is a part of the partial magnification correction information (correction information) CMgn (CMg1 to CMg6). The local magnification correction information (correction information) CMgn correction position information Nv is used to draw on the drawing line SLn based on the drawing magnification of the pattern drawn along the drawing line SLn (or the magnification in the main scanning direction of the drawing line SLn) Each of the plurality of discretely spaced positions specifies the information of the corrected pixel and is information indicating the distance (equal interval) between the modified pixel and the corrected pixel. Thereby, the corrected pixel specifying unit 62 can designate a plurality of pixels arranged at equal intervals in the drawing lines SLn (SL1 to SL6) as the corrected pixels. Among the plurality of pixels arranged along the respective drawing lines SLn (SL1 to SL6), the pixels which are not designated as the corrected pixels become uncorrected pixels. Therefore, the corrected pixel specifying unit 62 also specifies the uncorrected pixels by specifying the corrected pixels. . In addition, when the value of "m" of "N±m" is fixed, the larger the expansion ratio of the drawing line SLn (SL1 to SL6) to be corrected, the larger the number of correction pixels specified.
送出時序切換部(送出時序控制部)64根據修正像素指定部62基於局部倍率修正資訊CMgn(CMg1~CMg6)之修正位置資訊Nv而指定之修正像素、與局部倍率修正資訊CMgn(CMg1~CMg6)之倍率資訊 SCA，而對串列資料DLn(DL1~DL6)之各像素之邏輯資訊之送出時序進行控制(切換)。亦即，於沿著描繪線SLn(SL1~SL6)掃描聚焦光SP之像素為修正像素之情形時，以修正像素基於局部倍率修正資訊CMgn(CMg1~CMg6)之倍率資訊SCA而伸縮之方式，對送出(供給)至驅動電路36a之串列資料DLn之像素之邏輯資訊(亦即，圖案資料之列方向之每個像素之邏輯資訊)之送出時序進行切換。 The transmission timing switching unit (sending timing control unit) 64 specifies the correction pixel and the local magnification correction information CMgn (CMg1 to CMg6) based on the corrected position information Nv of the local magnification correction information CMgn (CMg1 to CMg6) by the correction pixel specifying unit 62. Rate information SCA controls (switches) the timing of the transmission of the logical information of each pixel of the serial data DLn (DL1 to DL6). That is, when the pixel that scans the focused light SP along the drawing line SLn (SL1 to SL6) is a corrected pixel, the modified pixel is expanded and contracted based on the magnification information SCA of the local magnification correction information CMgn (CMg1 to CMg6). The timing of the transmission of the logical information (i.e., the logical information of each pixel in the direction of the column of the pattern data) of the data of the serial data DLn sent (supplied) to the drive circuit 36a is switched.
詳細而言，送出時序切換部64係以如下方式對送出至驅動電路36a之串列資料DLn(DL1~DL6)之各像素之邏輯資訊之送出時序進行切換，即：於聚焦光SP對描繪線SLn(SL1~SL6)上之並非修正像素之像素(普通像素、非修正像素)進行掃描之時序，時脈訊號LTC之時脈脈衝(聚焦光SP)之N個對應1像素，於聚焦光SP對描繪線SLn(SL1~SL6)上之修正像素進行掃描之時序，時脈訊號LTC之時脈脈衝(聚焦光SP)之N±m個對應1像素。亦即，送出時序切換部64係以如下方式對送出至驅動電路36a之串列資料DLn(DL1~DL6)之各像素之邏輯資訊之送出時序進行切換(控制)，即：於聚焦光SP對描繪線SLn(SL1~SL6)上之普通像素進行掃描之時序，若時脈訊號LTC之時脈脈衝產生N個，則下一像素之邏輯資訊便輸出至驅動電路36a，於聚焦光SP對描繪線SLn(SL1~SL6)上之修正像素進行掃描之時序，若時脈訊號LTC之時脈脈衝產生N±m個，則下一像素之邏輯資訊便輸出至驅動電路36a。該「±m」之值係基於作為局部倍率修正資訊CMgn(CMg1~CMg6)之一部分之倍率資訊SCA而決定。 Specifically, the delivery timing switching unit 64 switches the timing of transmitting the logical information of each pixel of the serial data DLn (DL1 to DL6) sent to the drive circuit 36a as follows: SLn (SL1~SL6) is not the timing of scanning pixels (normal pixels, non-corrected pixels) of the correction pixel, and the clock pulses of the pulse signal LTC (focusing light SP) correspond to 1 pixel, and the focused light SP The timing of scanning the correction pixels on the drawing lines SLn (SL1 to SL6) is such that N±m of the clock pulse (focusing light SP) of the clock signal LTC corresponds to one pixel. In other words, the delivery timing switching unit 64 switches (controls) the timing of transmitting the logical information of each pixel of the serial data DLn (DL1 to DL6) sent to the drive circuit 36a as follows: When the normal pixels on the line SLn (SL1~SL6) are scanned, if the clock pulse of the clock signal LTC is N, the logic information of the next pixel is output to the driving circuit 36a, and the focused light SP is drawn. When the correction pixels on the line SLn (SL1 to SL6) are scanned, if the clock pulse of the clock signal LTC is N±m, the logic information of the next pixel is output to the drive circuit 36a. The value of "±m" is determined based on the magnification information SCA which is a part of the local magnification correction information CMgn (CMg1 to CMg6).
修正像素指定部62係使用與藉由射束切換部BDU而射束LBn入射之掃描單元Un對應的局部倍率修正資訊CMgn之修正位置資訊 Nv，指定配置於射束LBn入射之掃描單元Un之描繪線SLn上之複數個修正像素。送出時序切換部64係基於修正像素指定部62所指定的射束LBn入射之掃描單元Un之描繪線SLn上之修正像素、及與射束LBn入射之掃描單元Un對應之局部倍率修正資訊CMgn之倍率資訊SCA，而對與射束LBn入射之掃描單元Un對應之串列資料DLn之各像素之邏輯資訊之送出時序進行切換。 The corrected pixel specifying unit 62 uses the corrected position information of the local magnification correction information CMgn corresponding to the scanning unit Un in which the beam LBn is incident by the beam switching unit BDU. Nv specifies a plurality of correction pixels arranged on the drawing line SLn of the scanning unit Un on which the beam LBn is incident. The delivery timing switching unit 64 is based on the correction pixel on the drawing line SLn of the scanning unit Un in which the beam LBn specified by the correction pixel specifying unit 62 is incident, and the local magnification correction information CMgn corresponding to the scanning unit Un in which the beam LBn is incident. The magnification information SCA switches the timing of the transmission of the logical information of each pixel of the serial data DLn corresponding to the scanning unit Un to which the beam LBn is incident.
光源裝置LSa之情形時，藉由射束切換部BDU之第1光學元件模組(AOM1~AOM3)而將來自光源裝置LSa之射束LBa(LB1~LB3)引導至第1掃描模組(U1~U3)之任一個掃描單元Un。因此，光源裝置LSa之訊號產生部22a之修正像素指定部62基於與掃描單元U1~U3中之射束LBn入射之1個掃描單元Un對應的局部倍率修正資訊CMgn之修正位置資訊Nv而指定修正像素。又，光源裝置LSa之訊號產生部22a之送出時序切換部64係基於掃描單元U1~U3中之射束LBn入射之1個掃描單元Un之局部倍率修正資訊CMgn之倍率資訊SCA、與修正像素指定部62所指定之修正像素，對與射束LBn入射之1個掃描單元Un對應之串列資料DLn之每個像素之邏輯資訊之送出時序進行切換。例如，於射束LB2入射至掃描單元U2之情形時，光源裝置LSa之修正像素指定部62基於與掃描單元U2對應之局部倍率修正資訊CMg2之修正位置資訊Nv，將配置於描繪線SL2上之等間隔地離散之位置之複數個像素指定為修正像素。而且，光源裝置LSa之訊號產生部22a之送出時序切換部64係基於修正像素指定部62所指定之描繪線SL2上之修正像素、與局部倍率修正資訊CMg2之倍率資訊SCA，對與掃描單元U2對應之串列資料DL2之各像素之邏輯資訊之送出時 序進行切換。 In the case of the light source device LSa, the beam LBas (LB1 to LB3) from the light source device LSa are guided to the first scanning module (U1) by the first optical element modules (AOM1 to AOM3) of the beam switching unit BDU. ~U3) Any one of the scanning units Un. Therefore, the corrected pixel specifying unit 62 of the signal generating unit 22a of the light source device LSa specifies the correction based on the corrected position information Nv of the local magnification correction information CMgn corresponding to one scanning unit Un in which the beam LBn of the scanning units U1 to U3 is incident. Pixel. Further, the transmission timing switching unit 64 of the signal generation unit 22a of the light source device LSa is based on the magnification information SCA of the partial magnification correction information CMgn and the correction pixel designation of one scanning unit Un incident on the beam LBn in the scanning units U1 to U3. The correction pixel designated by the unit 62 switches the timing of the transmission of the logical information for each pixel of the serial data DLn corresponding to one scanning unit Un in which the beam LBn is incident. For example, when the beam LB2 is incident on the scanning unit U2, the corrected pixel specifying unit 62 of the light source device LSa is disposed on the drawing line SL2 based on the corrected position information Nv of the local magnification correction information CMg2 corresponding to the scanning unit U2. A plurality of pixels at discrete positions are equally designated as correction pixels. Further, the transmission timing switching unit 64 of the signal generation unit 22a of the light source device LSa is based on the correction pixel on the drawing line SL2 designated by the correction pixel specifying unit 62 and the magnification information SCA of the local magnification correction information CMg2, and the scanning unit U2. When the logical information of each pixel of the corresponding serial data DL2 is sent out The sequence is switched.
又，光源裝置LSb之情形時，藉由射束切換部BDU之第2光學元件模組(AOM4~AOM6)而將來自光源裝置LSb之射束LBb(LB4~LB6)引導至第2掃描模組(U4~U6)之任一個掃描單元Un。因此，光源裝置LSb之訊號產生部22a之修正像素指定部62係基於與掃描單元U4~U6中之射束LBn入射之1個掃描單元Un對應之局部倍率修正資訊CMgn之修正位置資訊Nv而指定修正像素。又，光源裝置LSb之訊號產生部22a之送出時序切換部64係基於掃描單元U4~U6中之射束LBn入射之1個掃描單元Un之局部倍率修正資訊CMgn之倍率資訊SCA、與修正像素指定部62所指定之修正像素，對與射束LBn入射之1個掃描單元Un對應之串列資料DLn之每個像素之邏輯資訊之送出時序進行切換。例如，於射束LB6入射至掃描單元U6之情形時，光源裝置LSb之修正像素指定部62基於與掃描單元U6對應之局部倍率修正資訊CMg6之修正位置資訊Nv，將配置於描繪線SL6上之等間隔地離散之位置之複數個像素指定為修正像素。而且，光源裝置LSb之送出時序切換部64係基於修正像素指定部62所指定之描繪線SL6上之修正像素、與局部倍率修正資訊CMg6之倍率資訊SCA，對與掃描單元U6對應之串列資料DL6之各像素之邏輯資訊之送出時序進行切換。 Further, in the case of the light source device LSb, the beam LBb (LB4 to LB6) from the light source device LSb is guided to the second scanning module by the second optical element modules (AOM4 to AOM6) of the beam switching unit BDU. Scanning unit Un of any of (U4~U6). Therefore, the corrected pixel specifying unit 62 of the signal generating unit 22a of the light source device LSb is specified based on the corrected position information Nv of the local magnification correction information CMgn corresponding to one scanning unit Un in which the beam LBn of the scanning units U4 to U6 is incident. Correct the pixel. Further, the transmission timing switching unit 64 of the signal generation unit 22a of the light source device LSb is based on the magnification information SCA of the partial magnification correction information CMgn and the correction pixel designation of one scanning unit Un incident on the beam LBn in the scanning units U4 to U6. The correction pixel designated by the unit 62 switches the timing of the transmission of the logical information for each pixel of the serial data DLn corresponding to one scanning unit Un in which the beam LBn is incident. For example, when the beam LB6 is incident on the scanning unit U6, the corrected pixel specifying unit 62 of the light source device LSb is disposed on the drawing line SL6 based on the corrected position information Nv of the local magnification correction information CMg6 corresponding to the scanning unit U6. A plurality of pixels at discrete positions are equally designated as correction pixels. Further, the transmission timing switching unit 64 of the light source device LSb is based on the correction pixel on the drawing line SL6 designated by the correction pixel specifying unit 62 and the magnification information SCA of the local magnification correction information CMg6, and the serial data corresponding to the scanning unit U6. The timing of the logical information of each pixel of the DL6 is switched.
若對修正像素指定部62進行具體說明，則修正像素指定部62具有第1分頻計數器電路70與延遲元件72、74。第1分頻計數器電路70係減法計數器，被輸入時脈訊號LTC之時脈脈衝(基準時脈脈衝)。第1分頻計數器電路70係計數值C1被預設為修正位置資訊(設定值)Nv，每 當被輸入時脈訊號LTC之時脈脈衝時便將計數值C1減量。第1分頻計數器電路70係當計數值C1成為0時輸出1脈衝之一致訊號Ida。亦即，第1分頻計數器電路70係當將時脈訊號LTC之時脈脈衝計數相當於修正位置資訊Nv之量時輸出一致訊號Ida。該一致訊號Ida意味著後續1像素為修正像素，第1分頻計數器電路70係藉由輸出一致訊號Ida而指定修正像素。當一致訊號Ida被輸出時，根據接下來產生之時脈脈衝而發光之射束LBn之聚焦光SP便投射至修正像素。第1分頻計數器電路70輸出之一致訊號Ida係經由延遲元件72而被輸入至第1分頻計數器電路70。第1分頻計數器電路70當被輸入一致訊號Ida時便成為可預設之狀態，當被新輸入時脈訊號LTC之時脈脈衝時便將計數值C1預設為修正位置資訊(設定值)Nv。藉此，可沿著描繪線SLn等間隔地指定複數個修正像素。再者，修正位置資訊Nv之具體值於下文中例示。 When the modified pixel specifying unit 62 is specifically described, the corrected pixel specifying unit 62 includes the first frequency dividing counter circuit 70 and the delay elements 72 and 74. The first frequency division counter circuit 70 is a subtraction counter, and is input with a clock pulse (reference clock pulse) of the clock signal LTC. The first frequency dividing counter circuit 70 is configured to count the value C1 as the corrected position information (set value) Nv, each When the clock pulse of the pulse signal LTC is input, the count value C1 is decremented. The first frequency division counter circuit 70 outputs a coincidence signal Ida of one pulse when the count value C1 becomes zero. That is, the first frequency division counter circuit 70 outputs the coincidence signal Ida when the clock pulse count of the clock signal LTC is equal to the amount of the corrected position information Nv. The coincidence signal Ida means that the subsequent one pixel is a modified pixel, and the first frequency dividing counter circuit 70 specifies the corrected pixel by outputting the coincidence signal Ida. When the coincidence signal Ida is output, the focused light SP of the beam LBn that emits light according to the pulse pulse generated next is projected to the corrected pixel. The coincidence signal Ida output from the first frequency division counter circuit 70 is input to the first frequency division counter circuit 70 via the delay element 72. The first frequency dividing counter circuit 70 becomes a preset state when the coincidence signal Ida is input, and the counting value C1 is preset as the corrected position information (set value) when the clock pulse of the pulse signal LTC is newly input. Nv. Thereby, a plurality of correction pixels can be specified at equal intervals along the drawing line SLn. Furthermore, the specific value of the corrected position information Nv is exemplified below.
該一致訊號Ida係經由延遲元件74而作為1脈衝之設定訊號Spp被輸出至送出時序切換部64。延遲元件72、74係將所輸入之一致訊號Ida延遲固定時間而輸出者。延遲元件72、74之延遲時間(固定時間)係較時脈訊號LTC之基準週期Ta短之時間。藉此，可於被輸入時脈訊號LTC之時脈脈衝而計數值C1成為0後，與下一時脈脈衝之輸入同時將第1分頻計數器電路70之計數值C1預設為修正位置資訊Nv。又，可於被輸入時脈訊號LTC之時脈脈衝而計數值C1成為0後，在被輸入下一時脈脈衝之前將設定訊號Spp輸出至送出時序切換部64。 The coincidence signal Ida is output to the transmission timing switching unit 64 as a one-pulse setting signal Spp via the delay element 74. The delay elements 72 and 74 are outputted by delaying the input coincidence signal Ida by a fixed time. The delay time (fixed time) of the delay elements 72, 74 is shorter than the reference period Ta of the clock signal LTC. Thereby, after the clock pulse of the clock signal LTC is input and the count value C1 becomes 0, the count value C1 of the first frequency division counter circuit 70 is preset as the correction position information Nv simultaneously with the input of the next clock pulse. . Further, after the clock pulse of the clock signal LTC is input and the count value C1 becomes 0, the setting signal Spp is output to the transmission timing switching unit 64 before the next clock pulse is input.
若對送出時序切換部64進行具體說明，則送出時序切換部64具有預設部76、第2分頻計數器電路78、及延遲元件80、82。對於預設 部76，輸出表示下一像素相當於時脈訊號LTC之時脈脈衝(聚焦光SP)之幾個之預設值以用於將連續產生之時脈訊號LTC之時脈脈衝(聚焦光SP)按每個像素進行劃分。對於該預設部76，輸入作為局部倍率修正資訊CMgn之一部分之倍率資訊SCA(由伸縮資訊POL與伸縮率資訊REC構成)。該伸縮資訊POL係表示使修正像素伸長或縮小之資訊，伸縮率資訊REC係表示使修正像素相對於普通像素以多少比率伸長或伸縮之資訊。相對於修正像素對應有N±m個聚焦光SP(時脈訊號LTC之時脈脈衝)係如上文所述，倍率資訊SCA係表示該「±m」之資訊。而且，「±m」之極性「±」對應於伸縮資訊(極性資訊)POL，「m」對應於伸縮率資訊REC。於1位元之伸縮資訊POL之值為高位準(邏輯值為「1」)之情形時係指極性「+」(使修正像素伸長)，於低位準(邏輯值為「0」)之情形時係指極性「-」(使修正像素縮小)。聚焦光SP之1次掃描期間中係輸入同一倍率資訊SCA。因此，1描繪線SLn上之所指定之修正像素全部以同一倍率伸長或縮小。再者，本第1實施形態中，根據伸縮率資訊REC而設定為m=1。 When the delivery timing switching unit 64 is specifically described, the transmission timing switching unit 64 includes a preset unit 76, a second frequency division counter circuit 78, and delay elements 80 and 82. For presets The portion 76 outputs a preset value indicating that the next pixel corresponds to the clock pulse (focus light SP) of the clock signal LTC for the clock pulse (focus light SP) of the continuously generated clock signal LTC. Divided by each pixel. For the preset unit 76, the magnification information SCA (consisting of the expansion information POL and the expansion ratio information REC) which is a part of the partial magnification correction information CMgn is input. The expansion information POL is information indicating that the correction pixel is extended or contracted, and the expansion ratio information REC is information indicating how much the correction pixel is elongated or stretched with respect to the normal pixel. The N±m focused lights SP (clock pulses of the clock signal LTC) corresponding to the corrected pixels are as described above, and the magnification information SCA indicates the information of the “±m”. Further, the polarity "±" of "±m" corresponds to the telescopic information (polarity information) POL, and "m" corresponds to the telescopic rate information REC. In the case where the value of the 1-bit telescopic information POL is high (the logical value is "1"), the polarity "+" (the correction pixel is elongated) is used, and the low level (the logical value is "0") The time is the polarity "-" (to make the correction pixel smaller). The same magnification information SCA is input during one scan of the focused light SP. Therefore, all of the designated correction pixels on the one drawing line SLn are elongated or reduced at the same magnification. Furthermore, in the first embodiment, m=1 is set based on the expansion ratio information REC.
於未產生1脈衝之設定訊號Spp之期間(亦即，設定訊號Spp之邏輯值為「0」之期間)，於主掃描方向掃描之聚焦光SP所通過(掃描)之像素成為修正像素以外之普通之像素(普通像素)。因此，對於普通像素，相對於1像素對應有N(=8)個聚焦光SP(時脈訊號LTC之時脈脈衝)，因此預設部76於未被輸入1脈衝之設定訊號Spp之期間，將「7」之預設值輸出至第2分頻計數器電路78。另一方面，若產生1脈衝之設定訊號Spp(邏輯值為「1」)，則聚焦光SP接下來通過(掃描)之像素為修正像素。因此，對於修正像素，相對於1像素對應有N±m(=8±1)個聚焦光 SP(時脈訊號LTC之時脈脈衝)，因此預設部76當被輸入1脈衝之設定訊號Spp時將7±1之預設值輸出至第2分頻計數器電路78。例如，於伸縮資訊POL為「+」(伸長)之情形時，預設部76輸出「8」之預設值，於伸縮資訊POL為「-」(縮小)之情形時，預設部76輸出「6」之預設值。因此，本第1實施形態中之預設部76所輸出之預設值之真值表係如圖10般示出。 In the period in which the set pulse Spp of one pulse is not generated (that is, the period in which the logical value of the set signal Spp is "0"), the pixel through which the focused light SP scanned in the main scanning direction passes (scanned) becomes a modified pixel. Normal pixels (ordinary pixels). Therefore, for an ordinary pixel, N (=8) pieces of focused light SP (a clock pulse of the clock signal LTC) are associated with one pixel, and therefore the preset portion 76 is not input with a set pulse Spp of one pulse. The preset value of "7" is output to the second frequency division counter circuit 78. On the other hand, if the setting signal Spp of one pulse is generated (the logical value is "1"), the pixel that the focused light SP passes through (scanning) is the corrected pixel. Therefore, for the corrected pixel, there are N±m (=8±1) focused lights corresponding to 1 pixel. SP (clock pulse of the clock signal LTC), the preset unit 76 outputs a preset value of 7±1 to the second frequency dividing counter circuit 78 when the setting signal Spp of one pulse is input. For example, when the telescopic information POL is "+" (elongation), the preset unit 76 outputs a preset value of "8". When the telescopic information POL is "-" (reduced), the preset portion 76 outputs The default value of "6". Therefore, the truth value table of the preset value outputted by the preset unit 76 in the first embodiment is as shown in FIG.
亦即，如圖10之真值表所示，預設部76於未被輸入1脈衝之設定訊號Spp之期間(亦即，設定訊號Spp之邏輯值為「0」之期間)，無關伸縮資訊POL而將「7」之預設值輸出至第2分頻計數器電路78。又，預設部76當被輸入1脈衝之設定訊號Spp(邏輯值為「1」)時將與伸縮資訊POL相應之預設值(「6」或「8」)輸出至第2分頻計數器電路78。預設部76於伸縮資訊POL為「1」(伸長)之情形時，將「8」之預設值輸出至第2分頻計數器電路78，於伸縮資訊POL為「0」(縮小)之情形時，將「6」之預設值輸出至第2分頻計數器電路78。 That is, as shown in the truth table of FIG. 10, the preset portion 76 is in a period in which the set signal Spp of one pulse is not input (that is, the period during which the logical value of the signal Spp is set to "0"), irrelevant information. The preset value of "7" is output to the second frequency divider counter circuit 78 by POL. Further, when the preset signal Spp (logical value "1") is input, the preset portion 76 outputs a preset value ("6" or "8") corresponding to the telescopic information POL to the second frequency dividing counter. Circuit 78. When the extension information POL is "1" (elongation), the preset portion 76 outputs the preset value of "8" to the second frequency division counter circuit 78, and the expansion information POL is "0" (reduced). At this time, the preset value of "6" is output to the second frequency division counter circuit 78.
第2分頻計數器電路78係減法計數器，被輸入時脈訊號LTC之時脈脈衝。第2分頻計數器電路78係計數值C2被預設為自預設部76輸出之預設值，每當被輸入時脈訊號LTC之時脈脈衝時便將計數值C2減量。第2分頻計數器電路78係當計數值C2成為0時輸出1脈衝之一致訊號Idb。亦即，第2分頻計數器電路78係當將時脈訊號LTC之時脈脈衝計數相當於預設值之量時輸出一致訊號Idb。該一致訊號Idb係表示1像素之劃分之資訊，經由延遲元件82而作為像素移位脈衝BSC(BSCa、BSCb)輸出。若產生該像素移位脈衝BSC(BSCa、BSCb)，則輸出至驅動電路36a之串列資料DLn之像素之邏輯資訊便向列方向移位1個。亦即，若產生像素移位脈 衝BSC(BSCa、BSCb)，則列方向之下一像素之邏輯資訊被輸入至驅動電路36a。若產生像素移位脈衝BSCa，則輸入至光源裝置LSa之驅動電路36a之串列資料DL1~DL3之像素之邏輯資訊向列方向移位1個，同樣地，若產生像素移位脈衝BSCb，則輸入至光源裝置LSb之驅動電路36a之串列資料DL4~DL6之像素之邏輯資訊向列方向移位1個。 The second frequency dividing counter circuit 78 is a subtraction counter, and is input with a clock pulse of the clock signal LTC. The second frequency dividing counter circuit 78 is preset to the preset value output from the preset unit 76, and the count value C2 is decremented each time the clock pulse of the pulse signal LTC is input. The second frequency division counter circuit 78 outputs a coincidence signal Idb of one pulse when the count value C2 becomes zero. That is, the second frequency division counter circuit 78 outputs the coincidence signal Idb when the clock pulse count of the clock signal LTC is equal to the preset value. The coincidence signal Idb is information indicating division of one pixel, and is output as a pixel shift pulse BSC (BSCa, BSCb) via the delay element 82. When the pixel shift pulse BSC (BSCa, BSCb) is generated, the logical information of the pixel outputted to the serial data DLn of the drive circuit 36a is shifted by one in the column direction. That is, if a pixel shift pulse is generated When the BSC (BSCa, BSCb) is flushed, the logic information of one pixel below the column direction is input to the drive circuit 36a. When the pixel shift pulse BSCa is generated, the logical information of the pixels of the serial data DL1 to DL3 input to the drive circuit 36a of the light source device LSa is shifted by one in the column direction. Similarly, if the pixel shift pulse BSCb is generated, The logical information of the pixels of the serial data DL4 to DL6 input to the drive circuit 36a of the light source device LSb is shifted by one in the column direction.
第2分頻計數器電路78所輸出之一致訊號Idb係經由延遲元件80而被輸入至第2分頻計數器電路78。第2分頻計數器電路78係當被輸入一致訊號Idb時便成為可預設之狀態，當被新輸入時脈訊號LTC之時脈脈衝時便將計數值C2預設為自預設部76輸出之預設值。藉此，能夠以如下方式對串列資料DLn之各像素之邏輯資訊之送出時序進行切換，即：於聚焦光SP掃描普通像素之時序，若時脈訊號LTC之時脈脈衝產生8個，則輸出下一像素之邏輯資訊，於聚焦光SP掃描修正像素之時序，若時脈訊號LTC之時脈脈衝產生7個或9個，則輸出下一像素之邏輯資訊。 The coincidence signal Idb output from the second frequency division counter circuit 78 is input to the second frequency division counter circuit 78 via the delay element 80. The second frequency division counter circuit 78 is in a preset state when the coincidence signal Idb is input. When the clock pulse of the pulse signal LTC is newly input, the count value C2 is preset as the output from the preset unit 76. The default value. Thereby, the timing of sending the logical information of each pixel of the serial data DLn can be switched as follows: when the focused light SP scans the timing of the normal pixel, if the clock pulse of the clock signal LTC is generated, then The logic information of the next pixel is output, and the timing of the corrected pixel is scanned by the focused light SP. If the clock pulse of the clock signal LTC is 7 or 9, the logic information of the next pixel is output.
再者，延遲元件80、82係使所輸入之一致訊號Idb延遲固定時間而輸出者，該延遲時間(固定時間)係較時脈訊號LTC之基準週期Ta短之時間。藉此，可於被輸入時脈訊號LTC之時脈脈衝而計數值C2成為0後，與下一時脈脈衝之輸入同時將第2分頻計數器電路78之計數值C2預設為自預設部76輸出之預設值。又，可於被輸入時脈訊號LTC之時脈脈衝而計數值C2成為0後，在被輸入下一時脈脈衝之前將像素移位脈衝BSC(BSCa、BSCb)自訊號產生部22a輸出。 Furthermore, the delay elements 80 and 82 output the delayed coincidence signal Idb for a fixed time, and the delay time (fixed time) is shorter than the reference period Ta of the clock signal LTC. Thereby, after the clock pulse of the clock signal LTC is input and the count value C2 becomes 0, the count value C2 of the second frequency divider counter circuit 78 is preset as the self-preset portion simultaneously with the input of the next clock pulse. The preset value of 76 output. Further, after the clock pulse of the clock signal LTC is input and the count value C2 becomes 0, the pixel shift pulses BSC (BSCa, BSCb) are output from the signal generating portion 22a before the next clock pulse is input.
如此，於時脈訊號LTC之時脈脈衝輸出相當於修正位置資訊Nv之數量之前，亦即，於聚焦光SP通過修正像素之前，不產生1脈衝 之設定訊號Spp，因此第2分頻計數器電路78當計數值C2成為0時預設為自預設部76輸出之預設值「7」。因此，每當時脈訊號LTC之時脈脈衝輸出8個時，便自訊號產生部22a輸出像素移位脈衝BSC(BSCa、BSCb)，被輸入至驅動電路36a之串列資料DLn之像素之邏輯資訊向列方向移位1個。因此，於在主掃描方向掃描之聚焦光SP通過非修正對象之像素(普通像素)之時序，對像素投射8個聚焦光SP。 Thus, before the clock pulse output of the clock signal LTC is equivalent to the number of corrected position information Nv, that is, no pulse is generated until the focused light SP passes through the corrected pixel. Since the setting signal Spp is set, the second frequency dividing counter circuit 78 is preset to the preset value "7" output from the preset portion 76 when the count value C2 becomes zero. Therefore, when the clock pulse output of the current pulse signal LTC is eight, the pixel shift pulse BSC (BSCa, BSCb) is output from the signal generating portion 22a, and the logic information of the pixel of the serial data DLn input to the drive circuit 36a is output. Shift one direction in the column direction. Therefore, the focused light SP is projected on the pixel by the timing at which the focused light SP scanned in the main scanning direction passes through the pixel (normal pixel) of the non-corrected object.
而且，每當時脈訊號LTC之時脈脈衝輸出相當於修正位置資訊Nv之數量時，亦即，每當聚焦光SP通過修正像素時，與來自第1分頻計數器電路70之一致訊號Ida相應之1脈衝之設定訊號Spp被輸入至預設部76。因此，第2分頻計數器電路78之計數值C2係每當時脈訊號LTC之時脈脈衝輸出相當於修正位置資訊Nv之數量時，被預設為與自預設部76輸出之伸縮資訊POL相應之預設值(「6」或「8」)。因此，於伸縮資訊POL為「0」之情形時，第2分頻計數器電路78之計數值C2被預設為「6」之預設值，因此若時脈訊號LTC之時脈脈衝被輸出7個，則自訊號產生部22a輸出像素移位脈衝BSC(BSCa、BSCb)。又，於伸縮資訊POL為「1」之情形時，第2分頻計數器電路78之計數值C2被預設為「8」之預設值，因此若時脈訊號LTC之時脈脈衝被輸出9個，則自訊號產生部22a輸出像素移位脈衝BSC(BSCa、BSCb)。若該像素移位脈衝BSC(BSCa、BSCb)被輸出，則輸入至驅動電路36a之串列資料DLn之像素之邏輯資訊向列方向移位1個。因此，於在主掃描方向掃描之聚焦光SP通過修正像素之時序，對1像素投射7個或9個聚焦光SP。其結果為，可使於描繪線SLn上離散地呈等間隔(時脈訊號LTC之時脈脈衝之Nv間隔)配置之修正像素伸縮。 Moreover, when the clock pulse output of the current pulse signal LTC is equivalent to the number of correction position information Nv, that is, each time the focused light SP passes through the correction pixel, it corresponds to the coincidence signal Ida from the first frequency division counter circuit 70. The 1-pulse setting signal Spp is input to the preset portion 76. Therefore, the count value C2 of the second frequency dividing counter circuit 78 is preset to correspond to the stretching information POL outputted from the preset unit 76 when the clock pulse output of the current pulse signal LTC is equivalent to the number of the corrected position information Nv. The default value ("6" or "8"). Therefore, when the telescopic information POL is "0", the count value C2 of the second frequency division counter circuit 78 is preset to a preset value of "6", so if the clock pulse of the clock signal LTC is output 7 The self-signal generating unit 22a outputs pixel shift pulses BSC (BSCa, BSCb). Moreover, when the telescopic information POL is "1", the count value C2 of the second frequency division counter circuit 78 is preset to a preset value of "8", so if the clock pulse of the clock signal LTC is output 9 The self-signal generating unit 22a outputs pixel shift pulses BSC (BSCa, BSCb). When the pixel shift pulses BSC (BSCa, BSCb) are output, the logical information of the pixels of the serial data DLn input to the drive circuit 36a is shifted by one in the column direction. Therefore, the focused light SP scanned in the main scanning direction projects 7 or 9 focused lights SP for 1 pixel by correcting the timing of the pixels. As a result, it is possible to expand and contract the correction pixel which is disposed at equal intervals (Nv interval of the clock pulse of the clock signal LTC) on the drawing line SLn.
若將1描繪線SLn之像素之數量設為10000，於描繪線SLn上將修正像素之數量等間隔地配置40個，則修正像素以250像素間隔配置。於該情形時，修正對象以外之像素(普通像素)成為9960個。於修正像素之聚焦光SP(時脈訊號LTC之時脈脈衝)之數量為7個之情形(伸縮資訊POL為「0」之情形)時，於1描繪線SLn投射之聚焦光SP之數量成為79960(=80000-40、或者=9960×8+40×7)，修正位置資訊Nv成為1999(=79960/40)。因此，以1描繪線SLn來看，若將無局部倍率修正之情形時之掃描長度(描繪線SLn之長度)之初始值設為30mm，則藉由局部倍率修正而縮小後之掃描長度因未照射相當於40個之聚焦光SP而縮小了15μm(=3μm×1/8×40)，其倍率成為0.9995(=29.985/30)，即-500ppm。又，於修正像素之聚焦光SP(時脈訊號LTC之時脈脈衝)之數量為9個之情形(伸縮資訊POL為「1」之情形)時，於1描繪線SLn投射之聚焦光SP之數量成為80040(=80000+40、或者=9960×8+40×9)，修正位置資訊Nv成為2001(=80040/40)。因此，以1描繪線SLn來看，若將無局部倍率修正之情形時之掃描長度(描繪線SLn之長度)之初始值設為30mm，則藉由局部倍率修正而伸長後之掃描長度因多照射相當於40個之聚焦光SP而伸長了15μm(=3μm×1/8×40)，其倍率成為1.0005(=30.015/30)，即+500ppm。再者，如上所述，時脈訊號LTC之時脈脈衝係無關局部倍率修正之有無而以特定頻率(振盪頻率)Fa產生，故而沿著描繪線SLn之聚焦光SP之投射間隔固定，本第1實施形態中，將聚焦光SP之大小φ設為3μm，聚焦光SP沿著主掃描方向一面每次重疊7/8一面投射。亦即，聚焦光SP之投射間隔成為聚焦光SP之大小φ之1/8即0.375μm，修正像素中之每1像素之 伸縮量亦成為±0.375μm。 When the number of pixels of the one drawing line SLn is 10000, and the number of correction pixels is arranged at equal intervals on the drawing line SLn at intervals of 40, the correction pixels are arranged at intervals of 250 pixels. In this case, the number of pixels (normal pixels) other than the correction target is 9,960. When the number of the focused light SP (the clock pulse of the clock signal LTC) of the corrected pixel is seven (when the telescopic information POL is "0"), the number of focused lights SP projected on the drawing line SLn becomes 79960 (=80000-40, or =9960×8+40×7), the corrected position information Nv becomes 1999 (=79960/40). Therefore, when the initial value of the scanning length (the length of the drawing line SLn) when the local magnification correction is not performed is set to 30 mm in the case of the one drawing line SLn, the scanning length reduced by the local magnification correction is not Irradiation of 40 focused light SP was reduced by 15 μm (= 3 μm × 1/8 × 40), and the magnification was 0.9995 (= 29.985/30), that is, -500 ppm. Further, when the number of the focused light SP (the clock pulse of the clock signal LTC) of the corrected pixel is nine (when the telescopic information POL is "1"), the focused light SP projected by the line SLn is drawn by 1 The number becomes 80040 (=80000+40, or =9960×8+40×9), and the corrected position information Nv becomes 2001 (=80040/40). Therefore, when the initial value of the scanning length (the length of the drawing line SLn) when the local magnification correction is not performed is 30 mm, the scanning length after stretching by the local magnification correction is large. Irradiation of 40 focused light SP was carried out and the length was 15 μm (= 3 μm × 1/8 × 40), and the magnification was 1.0005 (= 30.015 / 30), that is, +500 ppm. Further, as described above, the clock pulse of the clock signal LTC is generated at a specific frequency (oscillation frequency) Fa irrespective of the presence or absence of the local magnification correction, so that the projection interval of the focused light SP along the drawing line SLn is fixed. In the first embodiment, the size φ of the focused light SP is set to 3 μm, and the focused light SP is projected on the side of the main scanning direction by 7/8. That is, the projection interval of the focused light SP becomes 1/8 of the size φ of the focused light SP, that is, 0.375 μm, and each pixel in the corrected pixel is corrected. The amount of expansion and contraction also became ±0.375 μm.
該局部倍率修正資訊CMgn(CMg1~CMg6)之修正位置資訊(設定值)Nv可任意地變更，可根據描繪線SLn之倍率而適當設定。例如，可以位於描繪線SLn上之修正像素成為1個之方式設定修正位置資訊Nv。根據整體倍率修正資訊TMg，亦可使描繪線SL伸縮，但局部倍率修正可進行細緻之微小之倍率修正。例如，當振盪頻率Fa為400MHz且將描繪線SLn之掃描長度(描繪範圍)之初始值設為30mm時，於根據整體倍率修正資訊TMg使描繪線SLn之掃描長度伸縮或伸長15μm(比率500ppm)之情形時，必須使振盪頻率Fa變大或變小約0.2MHz(比率500ppm)，該調整較為困難。又，即便可進行調整，亦係以固定之延遲(時間常數)而切換為調整後之振盪頻率Fa，因此於該期間無法獲得所需要之倍率。進而，於描繪倍率之修正比設定為500ppm以下、例如數ppm~數十ppm左右之情形時，相較於改變光源裝置LSa(LSb)之振盪頻率Fa之整體倍率修正方式，增減離散之修正像素中之聚焦光之數量之局部倍率修正方式能簡單地進行解析度較高之修正。當然，若併用整體倍率修正方式與局部倍率修正方式之兩者，則能夠獲得既應對較大之描繪倍率之修正比亦可進行高解析度之修正等優點。 The corrected position information (set value) Nv of the local magnification correction information CMgn (CMg1 to CMg6) can be arbitrarily changed, and can be appropriately set according to the magnification of the drawing line SLn. For example, the corrected position information Nv can be set so that the number of correction pixels located on the drawing line SLn is one. According to the overall magnification correction information TMg, the drawing line SL can be made to expand and contract, but the local magnification correction can perform fine and small magnification correction. For example, when the oscillation frequency Fa is 400 MHz and the initial value of the scanning length (drawing range) of the drawing line SLn is set to 30 mm, the scanning length of the drawing line SLn is stretched or stretched by 15 μm (ratio 500 ppm) based on the overall magnification correction information TMg. In the case of the case, it is necessary to make the oscillation frequency Fa larger or smaller by about 0.2 MHz (ratio 500 ppm), which is difficult. Further, even if adjustment is possible, the adjusted oscillation frequency Fa is switched with a fixed delay (time constant), so that the required magnification cannot be obtained during this period. Further, when the correction ratio of the drawing magnification is set to 500 ppm or less, for example, several ppm to several tens of ppm, the correction of the increase or decrease of the dispersion is compared with the overall magnification correction method of changing the oscillation frequency Fa of the light source device LSa (LSb). The local magnification correction method of the number of focused lights in the pixels can be easily corrected with a high resolution. Of course, if both the overall magnification correction method and the local magnification correction method are used in combination, it is possible to obtain an advantage that the correction ratio of the large drawing magnification can be corrected and the high resolution can be corrected.
又，雖係根據伸縮率資訊REC將m設定為1，但m只要為具有m<N之關係之1以上之整數即可。進而，1描繪線SLn中係將修正位置資訊Nv之值設為固定，但亦可於1描繪線SLn變更修正位置資訊Nv。即便於該情形時，於描繪線SLn上之離散之位置指定複數個修正像素亦不變，但藉由變更修正位置資訊Nv，可使修正像素間之間隔變得不均一。進 而，亦可於沿著描繪線SLn之射束之每1掃描、或多角鏡PM之每1旋轉時，不改變描繪線SLn上之修正像素之數量，而使修正像素之位置不同。 Further, although m is set to 1 based on the expansion ratio information REC, m may be an integer of 1 or more having a relationship of m < N. Further, in the drawing line SLn, the value of the corrected position information Nv is fixed, but the corrected position information Nv may be changed in the drawing line SLn. That is, in this case, the plurality of correction pixels are not changed at the discrete positions on the drawing line SLn. However, by changing the corrected position information Nv, the interval between the corrected pixels can be made non-uniform. Enter Alternatively, the number of correction pixels on the drawing line SLn may be changed without changing the number of correction pixels on the drawing line SLn for every scan of the beam along the drawing line SLn or for each rotation of the polygon mirror PM.
再者，時脈產生部60所產生之時脈訊號LTC之時脈脈衝係經由閘極電路GTa而被輸入至修正像素指定部62之第1分頻計數器電路70及送出時序切換部64之第2分頻計數器電路78。該閘極電路GTa係於下述描繪允許訊號SQn為高位準(邏輯值為1)之期間開啟之閘極。亦即，第1分頻計數器電路70及第2分頻計數器電路78僅於描繪允許訊號SQn為高位準之期間中將時脈訊號LTC之時脈脈衝進行計數。該描繪允許訊號SQn(SQ1~SQ6)係表示是否允許利用所對應之掃描單元Un(U1~U6)之聚焦光SP之掃描進行描繪的訊號，且僅於高位準之期間中允許描繪。亦即，僅於該描繪允許訊號SQn(SQ1~SQ6)為高位準之期間中，所對應之掃描單元Un(U1~U6)之聚焦光SP一面沿著描繪線SLn(SL1~SL6)掃描，一面基於串列資料DLn(DL1~DL6)而調變其強度。 Further, the clock pulse of the clock signal LTC generated by the clock generation unit 60 is input to the first frequency division counter circuit 70 and the transmission timing switching unit 64 of the correction pixel designation unit 62 via the gate circuit GTa. The divide-by-2 counter circuit 78. The gate circuit GTa is a gate that is turned on during the period in which the enable signal SQn is at a high level (logic value of 1). That is, the first frequency division counter circuit 70 and the second frequency division counter circuit 78 count the clock pulses of the clock signal LTC only during the period in which the enable signal SQn is at the high level. The drawing enable signal SQn (SQ1 to SQ6) indicates whether or not the signal to be rendered by the scanning of the focused light SP of the corresponding scanning unit Un (U1 to U6) is allowed, and the drawing is allowed only during the high level period. That is, only during the period in which the drawing enable signal SQn (SQ1 to SQ6) is at the high level, the focused light SP of the corresponding scanning unit Un (U1 to U6) is scanned along the drawing line SLn (SL1 to SL6). One side is modulated based on the serial data DLn (DL1 to DL6).
因此，於光源裝置LSa之閘極電路GTa，被施加與掃描單元U1~U3對應之3個描繪允許訊號SQ1~SQ3。光源裝置LSa之閘極電路GTa於描繪允許訊號SQ1~SQ3之任一者為高位準(H)之期間將所輸入之時脈訊號LTC之時脈脈衝輸出。同樣地，於光源裝置LSb之閘極電路GTa，被施加與掃描單元U4~U6對應之3個描繪允許訊號SQ4~SQ6。光源裝置LSb之閘極電路GTa於描繪允許訊號SQ4~SQ6之任一者為高位準(H)之期間將所輸入之時脈訊號LTC之時脈脈衝輸出。如上所述，所謂描繪線SLn係指於聚焦光SP沿著主掃描方向而掃描之最大掃描長度之範圍內根據串列資料DLn進行強度調變之範圍。如此，僅於描繪允許訊號SQn為高位準之期 間中，將時脈訊號LTC之時脈脈衝進行計數，藉此，第1分頻計數器電路70可準確地指定位於描繪線SLn上之修正像素，第2分頻計數器電路78可準確地劃分位於描繪線SL上之像素。 Therefore, three drawing permission signals SQ1 to SQ3 corresponding to the scanning units U1 to U3 are applied to the gate circuit GMa of the light source device LSa. The gate circuit GTa of the light source device LSa outputs a clock pulse of the input clock signal LTC while the one of the enable signals SQ1 to SQ3 is at the high level (H). Similarly, three drawing enable signals SQ4 to SQ6 corresponding to the scanning units U4 to U6 are applied to the gate circuit GMa of the light source device LSb. The gate circuit GTa of the light source device LSb outputs a clock pulse of the input clock signal LTC while the one of the enable signals SQ4 to SQ6 is at the high level (H). As described above, the drawing line SLn is a range in which the intensity is modulated in accordance with the serial data DLn within the range of the maximum scanning length of the focused light SP scanned along the main scanning direction. In this way, only the period in which the allowable signal SQn is high is drawn. In the middle, the clock pulse of the clock signal LTC is counted, whereby the first frequency dividing counter circuit 70 can accurately specify the correction pixel located on the drawing line SLn, and the second frequency dividing counter circuit 78 can be accurately divided. Draws the pixels on line SL.
圖11係表示時脈訊號LTC之各時脈脈衝、第2分頻計數器電路78之計數值C2、像素移位脈衝BSC(BSCa、BSCb)之輸出時序、輸入至驅動電路36a之串列資料DLn之像素之邏輯資訊之切換時序的時序圖。再者，圖11中，為方便起見，將響應時脈訊號LTC之時脈脈衝而產生之射束LB之聚焦光SP之大小φ顯示為相對於像素之尺寸Pxy極小。如圖11所示，第2分頻計數器電路78係每當被輸入時脈訊號LTC之時脈脈衝時便將計數值C2減量，當該計數值C2成為0時輸出一致訊號Idb(省略圖示)。與該一致訊號Idb相應地輸出像素移位脈衝BSC(BSCa、BSCb)。該像素移位脈衝BSC(BSCa、BSCb)係於自計數值C2成為0之時脈脈衝至輸入下一時脈脈衝為止之期間輸出。根據該像素移位脈衝BSC(BSCa、BSCb)，輸入至驅動電路36a之串列資料DLn之像素之邏輯資訊向列方向移位1個。亦即，若像素移位脈衝BSC(BSCa、BSCb)被輸出，則下一列像素之邏輯資訊被輸出至驅動電路36a。圖11中，示出根據像素移位脈衝BSC(BSCa、BSCb)之輸出而依照「0」→「1」→「1」→「0」之順序切換像素之邏輯資訊之例。 11 is a diagram showing the clock pulses of the clock signal LTC, the count value C2 of the second frequency division counter circuit 78, the output timing of the pixel shift pulses BSC (BSCa, BSCb), and the serial data DLn input to the drive circuit 36a. A timing diagram of the switching timing of the logical information of the pixels. Further, in Fig. 11, for the sake of convenience, the size φ of the focused light SP of the beam LB generated in response to the clock pulse of the clock signal LTC is shown to be extremely small with respect to the pixel size Pxy. As shown in FIG. 11, the second frequency division counter circuit 78 decrements the count value C2 every time the clock pulse of the pulse signal LTC is input, and outputs the coincidence signal Idb when the count value C2 becomes 0 (omitted from illustration ). The pixel shift pulses BSC (BSCa, BSCb) are output corresponding to the coincidence signal Idb. The pixel shift pulses BSC (BSCa, BSCb) are outputted from the time pulse value when the count value C2 becomes 0 to the time when the next clock pulse is input. According to the pixel shift pulse BSC (BSCa, BSCb), the logical information of the pixel of the serial data DLn input to the drive circuit 36a is shifted by one in the column direction. That is, if the pixel shift pulses BSC (BSCa, BSCb) are output, the logic information of the next column of pixels is output to the drive circuit 36a. FIG. 11 shows an example of switching logic information of pixels in accordance with the output of the pixel shift pulses BSC (BSCa, BSCb) in the order of "0" → "1" → "1" → "0".
雖未圖示，但第1分頻計數器電路70係每當被輸入時脈訊號LTC之時脈脈衝時便將計數值C1減量，當該計數值C1成為0時輸出一致訊號Ida。與該一致訊號Ida相應地，設定訊號Spp(值為「1」)產生並被輸入至預設部76。第1分頻計數器電路70係於輸出一致訊號Ida後，當被 新輸入時脈訊號LTC之時脈脈衝時將計數值C1預設為修正位置資訊Nv。 Although not shown, the first frequency division counter circuit 70 decrements the count value C1 every time the clock pulse of the pulse signal LTC is input, and outputs the coincidence signal Ida when the count value C1 becomes zero. Corresponding to the coincidence signal Ida, the setting signal Spp (value "1") is generated and input to the preset portion 76. The first frequency dividing counter circuit 70 is connected to the output of the coincidence signal Ida when When the clock pulse of the new input clock signal LTC is newly input, the count value C1 is preset as the corrected position information Nv.
第2分頻計數器電路78係當計數值C2成為0時，與下一時脈訊號LTC之時脈脈衝之輸入同時將計數值C2預設為自預設部76輸出之預設值。該預設部76係於未產生設定訊號Spp(值為「1」)之情形時，輸出「7」之預設值。因此，於未產生1脈衝之設定訊號Spp之期間(設定訊號Spp之邏輯值為「0」之期間)，每當時脈訊號LTC之時脈脈衝產生8個時，便自訊號產生部22a輸出像素移位脈衝BSC(BSCa、BSCb)。因此，於未產生1脈衝之設定訊號Spp之期間，對於1像素(普通像素)沿著主掃描方向投射8個聚焦光SP。 The second frequency division counter circuit 78 presets the count value C2 to the preset value output from the preset unit 76 simultaneously with the input of the clock pulse of the next clock signal LTC when the count value C2 becomes zero. The preset unit 76 outputs a preset value of "7" when the set signal Spp (value "1") is not generated. Therefore, during the period in which the set pulse Spp of one pulse is not generated (the period in which the logical value of the set signal Spp is "0"), when the clock pulse of the current pulse signal LTC is generated eight, the pixel is output from the signal generating portion 22a. Shift pulse BSC (BSCa, BSCb). Therefore, during the period in which the one-shot setting signal Spp is not generated, eight focused lights SP are projected in the main scanning direction for one pixel (ordinary pixel).
另一方面，當設定訊號Spp(值為「1」)被輸入至預設部76時(當第1分頻計數器電路70之計數值C1成為「0」時)，來自預設部76之預設值成為與伸縮資訊POL相應之值(「6」或「8」)。因此，當產生1脈衝之設定訊號Spp(邏輯值為「1」)時，時脈訊號LTC之時脈脈衝產生7個或9個之後，自訊號產生部22a輸出像素移位脈衝BSC(BSCa、BSCb)。因此，當產生1脈衝之設定訊號Spp時，對於1像素(修正像素)沿著主掃描方向投射7個或9個聚焦光SP。圖11所示之例中，當產生設定訊號Spp時預設值被設定為「6」，因此，當產生7個時脈脈衝時輸出有像素移位脈衝BSC(BSCa、BSCb)。其後，於第1分頻計數器電路70之計數值C1再次成為0之前，設定訊號Spp之邏輯值保持為「0」，因此第2分頻計數器電路78之計數值C2之預設值回至「7」。 On the other hand, when the setting signal Spp (value "1") is input to the preset portion 76 (when the count value C1 of the first frequency dividing counter circuit 70 becomes "0"), the preset from the preset portion 76 The set value is a value corresponding to the telescopic information POL ("6" or "8"). Therefore, when the one-shot setting signal Spp (logical value "1") is generated, after the clock pulse of the clock signal LTC is generated seven or nine, the self-signal generating portion 22a outputs the pixel shift pulse BSC (BSCa, BSCb). Therefore, when the one-shot setting signal Spp is generated, seven or nine focused lights SP are projected in the main scanning direction for one pixel (corrected pixel). In the example shown in Fig. 11, the preset value is set to "6" when the setting signal Spp is generated. Therefore, when seven clock pulses are generated, the pixel shift pulses BSC (BSCa, BSCb) are output. Thereafter, before the count value C1 of the first frequency dividing counter circuit 70 becomes 0 again, the logic value of the setting signal Spp remains "0", so the preset value of the count value C2 of the second frequency dividing counter circuit 78 is returned to "7".
再者，雖係將修正像素指定部62及送出時序切換部64設置於訊號產生部22a之內部，但亦可將修正像素指定部62及送出時序切換部 64設置於控制電路22之內部且訊號產生部22a之外部，或亦可將修正像素指定部62及送出時序切換部64設置於控制電路22之外部。於該情形時，亦可將修正像素指定部62及送出時序切換部64設置於下述射束控制裝置104之內部(例如，描繪資料輸出部114之內部)。 Further, although the corrected pixel specifying unit 62 and the sending timing switching unit 64 are provided inside the signal generating unit 22a, the corrected pixel specifying unit 62 and the sending timing switching unit may be provided. The 64 is provided inside the control circuit 22 and outside the signal generating unit 22a, or the corrected pixel specifying unit 62 and the sending timing switching unit 64 may be provided outside the control circuit 22. In this case, the corrected pixel specifying unit 62 and the sending timing switching unit 64 may be provided inside the beam control device 104 (for example, inside the drawing data output unit 114).
圖12係表示曝光裝置EX之電性構成之方塊圖。曝光裝置EX之控制裝置16具有多角鏡驅動控制部100、選擇元件驅動控制部102、射束控制裝置104、標記位置檢測部106、及旋轉位置檢測部108。再者，各掃描單元Un(U1~U6)之原點感測器OPn(OP1~OP6)所輸出之原點訊號SZn(SZ1~SZ6)被輸入至多角鏡驅動控制部100及選擇元件驅動控制部102。再者，圖12所示之例中，示出如下狀態：來自光源裝置LSa(LSb)之射束LBa(LBb)藉由選擇用光學元件AOM2(AOM5)而繞射，作為其一次繞射光之射束LB2(LB5)入射至掃描單元U2(U5)。 Fig. 12 is a block diagram showing the electrical configuration of the exposure apparatus EX. The control device 16 of the exposure device EX includes a polygon mirror drive control unit 100, a selection element drive control unit 102, a beam control device 104, a mark position detecting unit 106, and a rotational position detecting unit 108. Furthermore, the origin signals SZn (SZ1 to SZ6) output from the origin sensors OPn (OP1 to OP6) of the scanning units Un (U1 to U6) are input to the polygon mirror drive control unit 100 and the selection element drive control. Part 102. Further, in the example shown in Fig. 12, the state in which the beam LBa (LBb) from the light source device LSa (LSb) is diffracted by the optical element AOM2 (AOM5) is selected as the primary diffracted light. The beam LB2 (LB5) is incident on the scanning unit U2 (U5).
多角鏡驅動控制部100驅動控制各掃描單元Un(U1~U6)之多角鏡PM之旋轉。多角鏡驅動控制部100具有驅動各掃描單元Un(U1~U6)之多角鏡PM之旋轉驅動源(馬達或減速機等)RM，藉由驅動控制該馬達之旋轉，而驅動控制多角鏡PM之旋轉。多角鏡驅動控制部100係以各掃描模組之3個掃描單元Un(U1~U3、U4~U6)之多角鏡PM之旋轉角度位置成為特定之相位關係之方式，使各掃描模組之3個掃描單元Un(U1~U3、U4~U6)之多角鏡PM之各者同步旋轉。詳細而言，多角鏡驅動控制部100係以各掃描模組之3個掃描單元Un(U1~U3、U4~U6)之多角鏡PM之旋轉速度(轉數)Vp彼此相同且旋轉角度位置之相位每次偏移固定角度之方式，控制複數個掃描單元Un(U1~U6)之多角鏡PM之旋轉。再 者，各掃描單元Un(U1~U6)之多角鏡PM之旋轉速度Vp均設為相同。 The polygon mirror drive control unit 100 drives and controls the rotation of the polygon mirror PM of each of the scanning units Un (U1 to U6). The polygon mirror drive control unit 100 has a rotary drive source (motor, reducer, etc.) RM for driving the polygon mirror PM of each of the scanning units Un (U1 to U6), and drives and controls the polygon mirror PM by driving the rotation of the motor. Rotate. The polygon mirror drive control unit 100 sets each of the scanning modules so that the rotation angle position of the polygon mirror PM of the three scanning units Un (U1 to U3, U4 to U6) of each scanning module has a specific phase relationship. Each of the polygon mirrors PM of the scanning units Un (U1 to U3, U4 to U6) rotates synchronously. Specifically, the polygon mirror drive control unit 100 uses the rotation speeds (number of revolutions) Vp of the polygon mirrors PM of the three scanning units Un (U1 to U3, U4 to U6) of the respective scanning modules to be the same as each other and the rotation angle position. The rotation of the polygon mirror PM of the plurality of scanning units Un (U1 to U6) is controlled by shifting the phase by a fixed angle each time. again The rotational speeds Vp of the polygon mirrors PM of the scanning units Un (U1 to U6) are all set to be the same.
本第1實施形態中，如上所述，將有助於實際掃描之多角鏡PM之旋轉角度α設為15度，因此反射面RP為8個之八角形之多角鏡PM之掃描效率成為1/3。第1掃描模組中，利用3個掃描單元Un之聚焦光SP之掃描依照U1→U2→U3之順序進行。因此，以呈依照該順序該3個掃描單元U1~U3之各者之多角鏡PM之旋轉角度位置之相位每次偏移15度之狀態等速旋轉之方式，掃描單元U1~U3之各者之多角鏡PM由多角鏡驅動控制部100同步控制。又，第2掃描模組中，利用3個掃描單元Un之聚焦光SP之掃描依照U4→U5→U6之順序進行。因此，以呈依照該順序3個掃描單元U4~U6之各者之多角鏡PM之旋轉角度位置之相位每次偏移15度之狀態等速旋轉之方式，掃描單元U4~U6之各者之多角鏡PM由多角鏡驅動控制部100同步控制。 In the first embodiment, as described above, since the rotation angle α of the polygon mirror PM which contributes to the actual scanning is 15 degrees, the scanning efficiency of the polygon mirror PM having the eight octagons of the reflection surface RP is 1/1. 3. In the first scanning module, the scanning of the focused light SP by the three scanning units Un is performed in the order of U1 → U2 → U3. Therefore, each of the scanning units U1 to U3 is rotated in a state in which the phase of the rotation angle position of the polygon mirror PM of each of the three scanning units U1 to U3 in the order is shifted by 15 degrees each time. The polygon mirror PM is synchronously controlled by the polygon mirror drive control unit 100. Further, in the second scanning module, the scanning of the focused light SP by the three scanning units Un is performed in the order of U4 → U5 → U6. Therefore, each of the scanning units U4 to U6 is rotated at a constant speed in a state in which the phase of the rotation angle position of the polygon mirror PM of each of the three scanning units U4 to U6 in the order is shifted by 15 degrees. The polygon mirror PM is synchronously controlled by the polygon mirror drive control unit 100.
具體而言，如圖13所示，多角鏡驅動控制部100係例如關於第1掃描模組，將來自掃描單元U1之原點感測器OP1之原點訊號SZ1作為基準，以來自掃描單元U2之原點感測器OP2之原點訊號SZ2延遲時間Ts而產生之方式，控制掃描單元U2之多角鏡PM之旋轉相位。多角鏡驅動控制部100係將原點訊號SZ1作為基準，以來自掃描單元U3之原點感測器OP3之原點訊號SZ3延遲2×時間Ts而產生之方式，控制掃描單元U3之多角鏡PM之旋轉相位。該時間Ts係多角鏡PM旋轉15度之時間(聚焦光SP之最大掃描時間)，本第1實施形態中，為約206.666…μsec(=Tpx×1/3=620[μsec]/3)。藉此，各掃描單元U1~U3之各者之多角鏡PM之旋轉角度位置之相位差成為依照U1、U2、U3之順序每次偏移15度之狀態。因此， 第1掃描模組之3個掃描單元U1~U3可依照U1→U2→U3之順序進行聚焦光SP之掃描。 Specifically, as shown in FIG. 13 , the polygon mirror drive control unit 100 uses the origin signal SZ1 from the origin sensor OP1 of the scanning unit U1 as a reference, for example, from the scanning unit U2 with respect to the first scanning module. The origin signal S2 of the origin sensor OP2 is generated by the delay time Ts, and the rotation phase of the polygon mirror PM of the scanning unit U2 is controlled. The polygon mirror drive control unit 100 controls the polygon mirror PM of the scanning unit U3 in such a manner that the origin signal SZ1 is used as a reference and the origin signal SZ3 from the origin sensor OP3 of the scanning unit U3 is delayed by 2×time Ts. Rotation phase. This time Ts is the time when the polygon mirror PM is rotated by 15 degrees (the maximum scanning time of the focused light SP), and in the first embodiment, it is about 206.666 ... μsec (= Tpx × 1/3 = 620 [μsec] / 3). Thereby, the phase difference of the rotational angle position of the polygon mirror PM of each of the scanning units U1 to U3 is in a state of being shifted by 15 degrees in the order of U1, U2, and U3. therefore, The three scanning units U1 to U3 of the first scanning module can scan the focused light SP in the order of U1 → U2 → U3.
關於第2掃描模組亦同樣地，多角鏡驅動控制部100例如將來自掃描單元U4之原點感測器OP4之原點訊號SZ4作為基準，以來自掃描單元U5之原點感測器OP5之原點訊號SZ5延遲時間Ts而產生之方式，控制掃描單元U5之多角鏡PM之旋轉相位。多角鏡驅動控制部100係將原點訊號SZ4作為基準，以來自掃描單元U6之原點感測器OP6之原點訊號SZ6延遲2×時間Ts而產生之方式，控制掃描單元U6之多角鏡PM之旋轉相位。藉此，各掃描單元U4~U6之各者之多角鏡PM之旋轉角度位置之相位成為依照U4、U5、U6之順序每次偏移15度之狀態。因此，第2掃描模組之3個掃描單元Un(U4~U6)可依照U4→U5→U6之順序進行聚焦光SP之掃描。 Similarly to the second scanning module, the polygon mirror driving control unit 100 uses, for example, the origin signal SZ4 from the origin sensor OP4 of the scanning unit U4 as a reference, and the origin sensor OP5 from the scanning unit U5. The origin signal SZ5 is generated in a delay time Ts to control the rotational phase of the polygon mirror PM of the scanning unit U5. The polygon mirror drive control unit 100 controls the polygon mirror PM of the scanning unit U6 by using the origin signal SZ4 as a reference and generating the origin signal SZ6 from the origin sensor OP6 of the scanning unit U6 by 2× time Ts. Rotation phase. Thereby, the phase of the rotation angle position of the polygon mirror PM of each of the scanning units U4 to U6 is in a state of being shifted by 15 degrees in the order of U4, U5, and U6. Therefore, the three scanning units Un (U4 to U6) of the second scanning module can scan the focused light SP in the order of U4 → U5 → U6.
選擇元件驅動控制部(射束切換驅動控制部)102控制射束切換部BDU之各光學元件模組之選擇用光學元件AOMn(AOM1~AOM3、AOM4~AOM6)，自各掃描模組之1個掃描單元Un開始聚焦光SP之掃描後至開始下一掃描之前，將來自光源裝置LS(LSa、LSb)之射束LB(LBa、LBb)依序分配至各掃描模組之3個掃描單元Un(U1~U3、U4~U6)。再者，自1個掃描單元Un開始聚焦光SP之掃描後至開始下一掃描之前，多角鏡PM旋轉45度，其時間間隔成為時間Tpx(=3×Ts)。 The selection element drive control unit (beam switching drive control unit) 102 controls the selection optical elements AOMn (AOM1 to AOM3, AOM4 to AOM6) of the optical element modules of the beam switching unit BDU, and scans from each scanning module. After the unit Un starts scanning of the focused light SP and before starting the next scan, the beams LB (LBa, LBb) from the light source device LS (LSa, LSb) are sequentially assigned to the three scanning units Un of each scanning module ( U1~U3, U4~U6). Further, the polygon mirror PM is rotated by 45 degrees from the scanning of the focused light SP from one scanning unit Un to the start of the next scanning, and the time interval is time Tpx (= 3 × Ts).
具體而言，選擇元件驅動控制部102係當產生原點訊號SZn(SZ1~SZ6)時，僅於自原點訊號SZn產生後固定時間(接通時間Ton)內，對與產生有原點訊號SZn(SZ1~SZ6)之掃描單元Un(U1~U6)對應 之選擇用光學元件AOMn(AOM1~AOM6)施加驅動訊號(高頻訊號)HFn(HF1~HF6)。藉此，被施加有驅動訊號(高頻訊號)HFn之選擇用光學元件AOMn僅於接通時間Ton內成為接通狀態，可使射束LBn入射至所對應之掃描單元Un。又，由於使射束LBn入射至產生有原點訊號SZn之掃描單元Un，故而能夠使射束LBn入射至可進行聚焦光SP之掃描之掃描單元Un。再者，該接通時間Ton為時間Ts以下之時間。 Specifically, when the selection element drive control unit 102 generates the origin signal SZn (SZ1 to SZ6), only the origin signal (the on time Ton) is generated after the origin signal SZn is generated, and the origin signal is generated. Corresponding to the scanning unit Un(U1~U6) of SZn(SZ1~SZ6) The driving signal (high frequency signal) HFn (HF1 to HF6) is applied by the optical element AOMn (AOM1 to AOM6). Thereby, the selection optical element AOMn to which the drive signal (high-frequency signal) HFn is applied is turned on only in the on-time Ton, and the beam LBn can be incident on the corresponding scanning unit Un. Further, since the beam LBn is incident on the scanning unit Un in which the origin signal SZn is generated, the beam LBn can be incident on the scanning unit Un capable of scanning the focused light SP. Furthermore, the on-time Ton is a time equal to or less than the time Ts.
第1掃描模組之3個掃描單元U1~U3中產生之原點訊號SZ1~SZ3係以時間Ts間隔依照SZ1→SZ2→SZ3之順序產生。因此，對於第1光學元件模組之各選擇用光學元件AOM1~AOM3，以時間Ts間隔依照AOM1→AOM2→AOM3之順序施加僅接通時間Ton之驅動訊號(高頻訊號)HF1~HF3。因此，第1光學元件模組(AOM1~AOM3)可將來自光源裝置LSa之射束LBn(LB1~LB3)入射之1個掃描單元Un以時間Ts間隔依照U1→U2→U3之順序進行切換。藉此，進行聚焦光SP之掃描之掃描單元Un以時間Ts間隔依照U1→U2→U3之順序進行切換。又，可於自掃描單元U1開始聚焦光SP之掃描後至開始下一掃描之前之時間(Tpx=3×Ts)內，使來自光源裝置LSa之射束LBn(LB1~LB3)依序入射至3個掃描單元Un(U1~U3)之任一個。 The origin signals SZ1 to SZ3 generated in the three scanning units U1 to U3 of the first scanning module are generated in the order of SZ1 → SZ2 → SZ3 at intervals of time Ts. Therefore, for each of the selection optical elements AOM1 to AOM3 of the first optical element module, drive signals (high-frequency signals) HF1 to HF3 of only the ON time Ton are applied in the order of AOM1 → AOM2 → AOM3 at intervals of time Ts. Therefore, the first optical element modules (AOM1 to AOM3) can switch one scanning unit Un from which the beam LBn (LB1 to LB3) incident from the light source device LSa is incident in the order of U1 → U2 → U3 at intervals of time Ts. Thereby, the scanning unit Un that performs scanning of the focused light SP is switched in the order of U1 → U2 → U3 at intervals of time Ts. Further, the beam LBn (LB1 to LB3) from the light source device LSa can be sequentially incident to the time (Tpx = 3 × Ts) from the scanning of the focused light SP to the start of the next scanning from the scanning unit U1. Any of the three scanning units Un (U1 to U3).
同樣地，第2掃描模組之3個掃描單元U4~U6中產生之原點訊號SZ4~SZ6係以時間Ts間隔依照SZ4→SZ5→SZ6之順序產生。因此，對於第2光學元件模組之各選擇用光學元件AOM4~AOM6，以時間Ts間隔依照AOM4→AOM5→AOM6之順序施加僅接通時間Ton之驅動訊號(高頻訊號)HF4~HF6。因此，第2光學元件模組(AOM4~AOM6)可將來自 光源裝置LSb之射束LBn(LB4~LB6)入射之1個掃描單元Un以時間Ts間隔依照U4→U5→U6之順序進行切換。藉此，進行聚焦光SP之掃描之掃描單元Un以時間Ts間隔依照U4→U5→U6之順序進行切換。又，可於自掃描單元U4開始聚焦光SP之掃描後至開始下一掃描之前之時間(Tpx=3×Ts)內，使來自光源裝置LSb之射束LBn(LB4~LB6)依序入射至3個掃描單元Un(U4~U6)之任一個。 Similarly, the origin signals SZ4 to SZ6 generated in the three scanning units U4 to U6 of the second scanning module are generated in the order of SZ4 → SZ5 → SZ6 at intervals of time Ts. Therefore, for each of the selection optical elements AOM4 to AOM6 of the second optical element module, drive signals (high-frequency signals) HF4 to HF6 of only the ON time Ton are applied in the order of AOM4 → AOM5 → AOM6 at intervals of time Ts. Therefore, the second optical component module (AOM4~AOM6) can come from One scanning unit Un incident on the beam LBn (LB4 to LB6) of the light source device LSb is switched in the order of U4 → U5 → U6 at intervals of time Ts. Thereby, the scanning unit Un that performs scanning of the focused light SP is switched in the order of U4 → U5 → U6 at intervals of time Ts. Further, the beam LBn (LB4 to LB6) from the light source device LSb may be sequentially incident to the time (Tpx = 3 × Ts) from the scanning of the focused light SP to the start of the next scanning from the scanning unit U4. One of the three scanning units Un (U4 to U6).
若對選擇元件驅動控制部102進而詳細說明，則選擇元件驅動控制部102係當產生原點訊號SZn(SZ1~SZ6)時，如圖13所示生成僅於原點訊號SZn(SZ1~SZ6)產生後固定時間(接通時間Ton)內成為H(高位準)之複數個入射允許訊號LPn(LP1~LP6)。該等複數個入射允許訊號LPn(LP1~LP6)係允許將所對應之選擇用光學元件AOMn(AOM1~AOM6)設為接通狀態之訊號。亦即，入射允許訊號LPn(LP1~LP6)係允許射束LBn(LB1~LB6)向所對應之掃描單元Un(U1~U6)入射之訊號。而且，選擇元件驅動控制部102係僅於入射允許訊號LPn(LP1~LP6)成為H(高位準)之接通時間Ton內，對所對應之選擇用光學元件AOMn(AOM1~AOM6)施加驅動訊號(高頻訊號)HFn(HF1~HF6)，而將所對應之選擇用光學元件AOMn設為接通狀態(產生一次繞射光之狀態)。例如，選擇元件驅動控制部102僅於入射允許訊號LP1~LP3成為H(高位準)之固定時間Ton內，對所對應之選擇用光學元件AOM1~AOM3施加驅動訊號HF1~HF3。藉此，來自光源裝置LSa之射束LB1~LB3入射至所對應之掃描單元U1~U3。又，選擇元件驅動控制部102僅於入射允許訊號LP4~LP6成為H(高位準)之固定時間Ton內，對所對應之選擇用光學元件AOM4~ AOM6施加驅動訊號(高頻訊號)HF4~HF6。藉此，來自光源裝置LSb之射束LB4~LB6入射至所對應之掃描單元U4~U6。 When the selection element drive control unit 102 is further described in detail, the selection element drive control unit 102 generates the origin signal SZn (SZ1 to SZ6) as shown in FIG. 13 when the origin signal SZn (SZ1 to SZ6) is generated. A plurality of incident enable signals LPn (LP1 to LP6) which become H (high level) within a fixed time (on time Ton) are generated. The plurality of incident enable signals LPn (LP1 to LP6) are signals for allowing the corresponding selection optical elements ANOn (AOM1 to AOM6) to be turned on. That is, the incident enable signal LPn (LP1 to LP6) is a signal that allows the beam LBn (LB1 to LB6) to be incident on the corresponding scanning unit Un (U1 to U6). Further, the selection element drive control unit 102 applies a drive signal to the corresponding selection optical element ANOn (AOM1 to AOM6) only within the on-time Ton of the incident enable signal LPn (LP1 to LP6) to be H (high level). (High-frequency signal) HFn (HF1 to HF6), and the corresponding selection optical element AOMn is set to an on state (a state in which one-time diffracted light is generated). For example, the selection element drive control unit 102 applies the drive signals HF1 to HF3 to the corresponding selection optical elements AOM1 to AOM3 within a fixed time Ton of the incident enable signals LP1 to LP3 at H (high level). Thereby, the beams LB1 to LB3 from the light source device LSa are incident on the corresponding scanning units U1 to U3. Further, the selection element drive control unit 102 selects the corresponding selection optical element AOM4~ only for a fixed time Ton at which the incident enable signals LP4 to LP6 become H (high level). AOM6 applies drive signals (high frequency signals) HF4~HF6. Thereby, the beams LB4 to LB6 from the light source device LSb are incident on the corresponding scanning units U4 to U6.
如圖13所示，與第1光學元件模組之3個選擇用光學元件AOM1~AOM3對應之入射允許訊號LP1~LP3係成為H(高位準)之上升時序依照LP1→LP2→LP3之順序以時間Ts為單位偏移，且，成為H(高位準)之接通時間Ton不會相互重複。因此，射束LBn(LB1~LB3)入射之掃描單元Un以時間Ts間隔依照U1→U2→U3之順序進行切換。同樣地，與第2光學元件模組之3個選擇用光學元件AOM4~AOM6對應之入射允許訊號LP4~LP6係成為H(高位準)之上升時序依照LP4→LP5→LP6之順序以時間Ts為單位偏移，且，成為H(高位準)之接通時間Ton不會相互重複。因此，射束LBn(LB4~LB6)入射之掃描單元Un以時間Ts間隔依照U4→U5→U6之順序進行切換。選擇元件驅動控制部102將所生成之複數個入射允許訊號LPn(LP1~LP6)輸出至射束控制裝置104。 As shown in FIG. 13, the incident enable signals LP1 to LP3 corresponding to the three selection optical elements AOM1 to AOM3 of the first optical element module are H (high level) rising timing in the order of LP1 → LP2 → LP3. The time Ts is a unit offset, and the on-time Ton which becomes H (high level) does not overlap each other. Therefore, the scanning units Un in which the beams LBn (LB1 to LB3) are incident are switched in the order of U1 → U2 → U3 at intervals of time Ts. Similarly, the incident enable signals LP4 to LP6 corresponding to the three selection optical elements AOM4 to AOM6 of the second optical element module are H (high level) rising timing in accordance with the order of LP4 → LP5 → LP6 with time Ts The unit shifts, and the on-time Ton which becomes H (high level) does not overlap each other. Therefore, the scanning unit Un in which the beam LBn (LB4 to LB6) is incident is switched in the order of U4 → U5 → U6 at intervals of time Ts. The selection element drive control unit 102 outputs the generated plurality of incident enable signals LPn (LP1 to LP6) to the beam control device 104.
射束控制裝置(射束控制部)104係控制射束LB(LBa、LBb、LBn)之發光頻率Fa、供射束LB之聚焦光SP描繪之描繪線SLn之倍率、及射束LB之強度調變者。射束控制裝置104具備整體倍率設定部110、局部倍率設定部112、描繪資料輸出部114、及曝光控制部116。整體倍率設定部(整體倍率修正資訊記憶部)110記憶自曝光控制部116送來之整體倍率修正資訊TMg，並且將整體倍率修正資訊TMg輸出至光源裝置LS(LSa、LSb)之控制電路22之訊號產生部22a。訊號產生部22a之時脈產生部60生成與該整體倍率修正資訊TMg相應之振盪頻率Fa之時脈訊號LTC。 The beam control device (beam control unit) 104 controls the emission frequency Fa of the beam LB (LBa, LBb, LBn), the magnification of the drawing line SLn drawn by the focused light SP of the beam LB, and the intensity of the beam LB. Modulator. The beam steering device 104 includes an overall magnification setting unit 110, a local magnification setting unit 112, a drawing material output unit 114, and an exposure control unit 116. The overall magnification setting unit (the overall magnification correction information storage unit) 110 stores the overall magnification correction information TMg sent from the exposure control unit 116, and outputs the overall magnification correction information TMg to the control circuit 22 of the light source device LS (LSa, LSb). The signal generating unit 22a. The clock generation unit 60 of the signal generation unit 22a generates a clock signal LTC of the oscillation frequency Fa corresponding to the overall magnification correction information TMg.
局部倍率設定部(局部倍率修正資訊記憶部、修正資訊記憶 部)112記憶自曝光控制部116送來之局部倍率修正資訊(修正資訊)CMgn，並且將局部倍率修正資訊CMgn輸出至光源裝置LS(LSa、LSb)之控制電路22之訊號產生部22a。基於該局部倍率修正資訊CMgn，而指定(特定)描繪線SLn上之修正像素之位置，並決定其倍率。控制電路22之訊號產生部22a根據基於該局部倍率修正資訊CMg所決定之修正像素、及其倍率，而輸出像素移位脈衝BSC(BSCa、BSCb)。再者，局部倍率設定部112記憶自曝光控制部116送來之掃描單元Un(U1~U6)各自之局部倍率修正資訊CMgn(CMg1~CMg6)。而且，局部倍率設定部112將與進行聚焦光SP之掃描之掃描單元Un對應之局部倍率修正資訊CMgn輸出至光源裝置LS(LSa、LSb)之訊號產生部22a。亦即，局部倍率設定部112將與產生有原點訊號SZn(SZ1~SZ6)之掃描單元Un對應之局部倍率修正資訊CMgn輸出至成為入射至該掃描單元Un之射束LBn之產生源的光源裝置LSa(LSa、LSb)之訊號產生部22a。 Local magnification setting unit (local magnification correction information memory unit, correction information memory The portion 112 stores the local magnification correction information (correction information) CMgn sent from the exposure control unit 116, and outputs the local magnification correction information CMgn to the signal generation unit 22a of the control circuit 22 of the light source device LS (LSa, LSb). Based on the local magnification correction information CMgn, the position of the correction pixel on the drawing line SLn is specified (specifically), and the magnification is determined. The signal generation unit 22a of the control circuit 22 outputs the pixel shift pulses BSC (BSCa, BSCb) based on the corrected pixels determined based on the local magnification correction information CMg and their magnifications. Further, the local magnification setting unit 112 stores the local magnification correction information CMgn (CMg1 to CMg6) of each of the scanning units Un (U1 to U6) sent from the exposure control unit 116. Further, the local magnification setting unit 112 outputs the partial magnification correction information CMgn corresponding to the scanning unit Un that performs scanning of the focused light SP to the signal generation unit 22a of the light source device LS (LSa, LSb). In other words, the local magnification setting unit 112 outputs the local magnification correction information CMgn corresponding to the scanning unit Un in which the origin signal SZn (SZ1 to SZ6) is generated to the light source that is the source of the beam LBn incident on the scanning unit Un. The signal generating unit 22a of the device LSa (LSa, LSb).
例如，於產生有原點訊號SZn之掃描單元Un(亦即，接下來進行聚焦光SP之掃描之掃描單元Un)為掃描單元U1~U3之任一者之情形時，局部倍率設定部112將與產生有原點訊號SZn之掃描單元Un對應之局部倍率修正資訊CMgn輸出至光源裝置LSa之訊號產生部22a。同樣地，於產生有原點訊號SZn之掃描單元Un為掃描單元U4~U6之任一者之情形時，局部倍率設定部112將與產生有原點訊號SZn之掃描單元Un對應之局部倍率修正資訊CMgn輸出至光源裝置LSb之訊號產生部22a。藉此，針對每個掃描模組，與進行聚焦光SP之掃描之掃描單元Un(U1~U3、U4~U6)對應之像素移位脈衝BSC(BSCa、BSCb)自光源裝置LS(LSa、LSb)之送 出時序切換部64輸出。藉此，可針對每條描繪線SLn個別地調整掃描長度。 For example, when the scanning unit Un having the origin signal SZn (that is, the scanning unit Un that scans the focused light SP next) is any of the scanning units U1 to U3, the local magnification setting unit 112 will The local magnification correction information CMgn corresponding to the scanning unit Un having the origin signal SZn is output to the signal generating portion 22a of the light source device LSa. Similarly, when the scanning unit Un having the origin signal SZn is one of the scanning units U4 to U6, the local magnification setting unit 112 corrects the local magnification corresponding to the scanning unit Un in which the origin signal SZn is generated. The information CMgn is output to the signal generating unit 22a of the light source device LSb. Thereby, for each scanning module, the pixel shifting pulses BSC (BSCa, BSCb) corresponding to the scanning unit Un (U1 to U3, U4 to U6) that scans the focused light SP are from the light source device LS (LSa, LSb). Send The output timing switching unit 64 outputs. Thereby, the scan length can be individually adjusted for each of the drawing lines SLn.
描繪資料輸出部114將與第1掃描模組之3個掃描單元Un(U1~U3)中之產生有原點訊號SZn之掃描單元Un(接下來進行聚焦光SP之掃描之掃描單元Un)對應的1行量之串列資料DLn作為描繪位元串資料SBa輸出至光源裝置LSa之驅動電路36a。又，描繪資料輸出部114將與第2掃描模組之3個掃描單元Un(U4~U6)中之產生有原點訊號SZn之掃描單元Un(接下來進行聚焦光SP之掃描之掃描單元Un)對應的1行量之串列資料DLn(DL4~DL6)作為描繪位元串資料SBb輸出至光源裝置LSb之驅動電路36a。關於第1掃描模組，進行聚焦光SP之掃描之掃描單元U1~U3之順序成為U1→U2→U3，因此描繪資料輸出部114將依照DL1→DL2→DL3之順序重複之串列資料DL1~DL3作為描繪位元串資料SBa輸出。關於第2掃描模組，進行聚焦光SP之掃描之掃描單元U4~U6之順序成為U4→U5→U6，因此描繪資料輸出部114將依照DL4→DL5→DL6之順序重複之串列資料DL4~DL6作為描繪位元串資料SBb輸出。 The drawing data output unit 114 corresponds to the scanning unit Un (the scanning unit Un that scans the focused light SP) in which the origin signal SZn is generated among the three scanning units Un (U1 to U3) of the first scanning module. The one-line serial data DLn is output as the drawing bit string data SBa to the driving circuit 36a of the light source device LSa. Further, the drawing data output unit 114 scan unit Un with the origin signal SZn among the three scanning units Un (U4 to U6) of the second scanning module (the scanning unit Un that performs the scanning of the focused light SP next) The corresponding one-line serial data DLn (DL4 to DL6) is output as the drawing bit string data SBb to the drive circuit 36a of the light source device LSb. In the first scanning module, since the order of the scanning units U1 to U3 for scanning the focused light SP is U1 → U2 → U3, the drawing data output unit 114 repeats the serial data DL1 in the order of DL1 → DL2 → DL3. DL3 is output as a bit string data SBa. In the second scanning module, since the order of the scanning units U4 to U6 for scanning the focused light SP is U4 → U5 → U6, the drawing data output unit 114 repeats the serial data DL4 in the order of DL4 → DL5 → DL6. DL6 is output as a drawing bit string data SBb.
使用圖14，對描繪資料輸出部114之構成進行詳細說明。描繪資料輸出部114具有輸出描繪位元串資料SBa之第1資料輸出部114a、及輸出描繪位元串資料SBb之第2資料輸出部114b。第1資料輸出部114a具有與掃描單元U1~U3(選擇用光學元件AOM1~AOM3)之各者對應之3個生成電路GE1、GE2、GE3、及3輸入之OR閘極部GT1m。生成電路GE1具有記憶體部BM1、計數器部CON1、2輸入之AND閘極部GT1a、GT1b、及描繪允許訊號生成部OSM1。生成電路GE2具有記憶體部BM2、計數器部CON2、2輸入之AND閘極部GT2a、GT2b、及描繪允許訊號生成部OSM2。 生成電路GE3具有記憶體部BM3、計數器部CON3、2輸入之AND閘極部GT3a、GT3b、及描繪允許訊號生成部OSM3。第2資料輸出部114b具有與掃描單元U1~U3(選擇用光學元件AOM1~AOM3)之各者對應之3個生成電路GE4、GE5、GE6、及3輸入之OR閘極部GT2m。生成電路GE4具有記憶體部BM4、計數器部CON4、2輸入之AND閘極部GT4a、GT4b、及描繪允許訊號生成部OSM4。生成電路GE5具有記憶體部BM5、計數器部CON5、2輸入之AND閘極部GT5a、GT5b、及描繪允許訊號生成部OSM5。生成電路GE6具有記憶體部BM6、計數器部CON6、2輸入之AND閘極部GT6a、GT6b、及描繪允許訊號生成部OSM6。 The configuration of the drawing material output unit 114 will be described in detail with reference to Fig. 14 . The drawing data output unit 114 has a first data output unit 114a that outputs the drawing bit string data SBa, and a second data output unit 114b that outputs the drawing bit string data SBb. The first data output unit 114a has three OR gates GT1m input to the three generation circuits GE1, GE2, GE3, and 3 corresponding to each of the scanning units U1 to U3 (selection optical elements AOM1 to AOM3). The generating circuit GE1 includes a memory unit BM1, AND gate units GT1a and GT1b input from the counter units CON1 and 2, and a drawing permission signal generating unit OSM1. The generating circuit GE2 includes a memory portion BM2, AND gate portions GT2a and GT2b input from the counter portions CON2 and 2, and a drawing permission signal generating portion OSM2. The generating circuit GE3 includes a memory unit BM3, AND gate units GT3a and GT3b input from the counter units CON3 and 2, and a drawing permission signal generating unit OSM3. The second data output unit 114b includes three generation circuits GE4, GE5, GE6, and three input OR gate portions GT2m corresponding to each of the scanning units U1 to U3 (selection optical elements AOM1 to AOM3). The generating circuit GE4 includes a memory unit BM4, AND gate units GT4a and GT4b input from the counter units CON4 and 2, and a drawing permission signal generating unit OSM4. The generating circuit GE5 includes a memory unit BM5, AND gate units GT5a and GT5b input from the counter units CON5 and 2, and a drawing permission signal generating unit OSM5. The generating circuit GE6 includes a memory unit BM6, AND gate units GT6a and GT6b input from the counter units CON6 and 2, and a drawing permission signal generating unit OSM6.
各描繪允許訊號生成部OSMn(OSM1~OSM6)係由單擊多諧振盪器等構成。各描繪允許訊號生成部OSMn(OSM1~OSM6)生成將利用所對應之掃描單元Un(U1~U6)之聚焦光SP之描繪開始時序進行調整之描繪允許訊號SQn(SQ1~SQ6)。對於各描繪允許訊號生成部OSMn(OSM1~OSM6)輸入所對應之掃描單元Un(U1~U6)之入射允許訊號LPn(LP1~LP6)，基於該輸入之入射允許訊號LPn(LP1~LP6)而生成描繪允許訊號SQn(SQ1~SQ6)。例如，對於描繪允許訊號生成部OSM1輸入有入射允許訊號LP1，描繪允許訊號生成部OSM1基於該輸入之入射允許訊號LP1而生成描繪允許訊號SQ1。同樣地，對於描繪允許訊號生成部OSM2~OSM6輸入有入射允許訊號LP2~LP6，描繪允許訊號生成部OSM2~OSM6基於該輸入之入射允許訊號LP2~LP6而生成描繪允許訊號SQ2~SQ6。於該描繪允許訊號SQn(SQ1~SQ6)成為高位準(H)之期間中，所對應之掃描單元Un(U1~U6)之串列資料DLn(DL1~DL6)被輸出至驅動電路36a。 Each of the drawing permission signal generating units OSMn (OSM1 to OSM6) is constituted by a click multivibrator or the like. Each of the drawing enable signal generating units OSMn (OSM1 to OSM6) generates a drawing permission signal SQn (SQ1 to SQ6) for adjusting the drawing start timing of the focused light SP by the corresponding scanning unit Un (U1 to U6). The incidence enable signals LPn (LP1 to LP6) of the scanning unit Un (U1 to U6) corresponding to the respective drawing enable signal generating units OSMn (OSM1 to OSM6) are input based on the input incident enable signals LPn (LP1 to LP6). A rendering enable signal SQn (SQ1~SQ6) is generated. For example, when the drawing permission signal generating unit OSM1 inputs the incident permission signal LP1, the drawing permission signal generating unit OSM1 generates the drawing permission signal SQ1 based on the input incident permission signal LP1. Similarly, the drawing permission signal generating units OSM2 to OSM6 input the incident permission signals LP2 to LP6, and the drawing permission signal generating units OSM2 to OSM6 generate the drawing permission signals SQ2 to SQ6 based on the input incident permission signals LP2 to LP6. In the period in which the drawing enable signal SQn (SQ1 to SQ6) is in the high level (H), the serial data DLn (DL1 to DL6) of the corresponding scanning unit Un (U1 to U6) is output to the drive circuit 36a.
圖15係表示藉由描繪允許訊號生成部OSMn而生成之描繪允許訊號SQn及於描繪允許訊號SQn為高位準(邏輯值為1)之期間中所輸出之像素移位脈衝BSC的時序圖。如上所述，當產生原點訊號SZn(SZ1~SZ6)時，生成自原點訊號SZn(SZ1~SZ6)產生後固定時間(接通時間Ton)內成為高位準(H)之入射允許訊號LPn(LP1~LP6)。再者，該接通時間Ton當然係作為掃描單元Un之聚焦光SP之最大掃描時間之時間Ts以下之時間。描繪允許訊號生成部OSMn(OSM1~OSM6)生成如下之描繪允許訊號SQn(SQ1~SQ6)：自入射允許訊號LPn(LP1~LP6)成為高位準「1」後亦即自原點訊號SZn(SZ1~SZ6)產生後經過延遲時間Tdn(Td1~Td6)之後上升，且，與入射允許訊號LPn(LP1~LP6)成為低位準「0」同時或在其之前下降。例如，描繪允許訊號生成部OSM3生成如下之描繪允許訊號SQ3：自入射允許訊號LP3成為高位準後經過延遲時間Td3之後上升，且，與入射允許訊號LP3成為低位準同時或在其之前下降。該描繪允許訊號SQ1~SQ3係依照SQ1→SQ2→SQ3之順序成為高位準(H)，成為高位準(H)之時間不會相互重複。同樣地，描繪允許訊號SQ4~SQ6係依照SQ4→SQ5→SQ6之順序成為高位準(H)，成為高位準(H)之時間不會相互重複。於該描繪允許訊號SQn(SQ1~SQ6)實際上成為高位準(H)之期間，允許於基板P之被照射面上進行聚焦光SP之描繪。 15 is a timing chart showing the pixel shift pulse BSC outputted during the period in which the drawing enable signal SQn generated by the enable signal generating portion OSMn and the drawing enable signal SQn are at the high level (logical value 1). As described above, when the origin signal SZn (SZ1 to SZ6) is generated, the incident enable signal LPn which becomes a high level (H) in the fixed time (on time Ton) after the origin signal SZn (SZ1 to SZ6) is generated is generated. (LP1~LP6). Further, the on-time Ton is of course a time equal to or less than the time Ts of the maximum scanning time of the focused light SP of the scanning unit Un. The drawing enable signal generating unit OSMn (OSM1 to OSM6) generates the following drawing permission signals SQn (SQ1 to SQ6): since the incident enable signal LPn (LP1 to LP6) becomes the high level "1", that is, from the origin signal SZn (SZ1) ~SZ6) rises after the delay time Tdn (Td1 to Td6) after the generation, and falls at the same time as or before the incident enable signal LPn (LP1 to LP6) becomes the low level "0". For example, the drawing enable signal generating unit OSM3 generates the drawing permission signal SQ3 which rises after the delay time Td3 elapses after the incident enable signal LP3 becomes the high level, and falls at or before the incident allowable signal LP3. The drawing permission signals SQ1 to SQ3 are in a high level (H) in the order of SQ1 → SQ2 → SQ3, and the time to become a high level (H) does not overlap each other. Similarly, the drawing permission signals SQ4 to SQ6 are in the high order (H) in the order of SQ4 → SQ5 → SQ6, and the time to become the high level (H) does not overlap each other. While the drawing enable signal SQn (SQ1 to SQ6) is actually at the high level (H), the drawing of the focused light SP is allowed to be performed on the illuminated surface of the substrate P.
藉由使該延遲時間Tdn變動，可使基板P上之描繪線SLn之位置沿主掃描方向(Y方向)移位。亦即，藉由縮短延遲時間Td，描繪線SLn之主掃描方向上之位置向描繪開始位置側(與主掃描方向相反之側)移位，藉由延長延遲時間Td，描繪線SLn之主掃描方向上之位置向描繪結 束位置側(主掃描方向側)移位。該延遲時間Tdn原則上以描繪線SLn之中心點到達最大掃描長度(例如31mm)之中央(中點)之方式設定。因此，若於延遲時間Tdn保持固定之狀態下，描繪線SLn之掃描長度根據整體倍率修正資訊TMg及局部倍率修正資訊CMgn之至少一者而伸縮，則描繪線SLn之中心點不會位於最大掃描長度之中央。因此，亦可根據整體倍率修正資訊TMg及局部倍率修正資訊CMgn而決定該延遲時間Tdn。藉由該延遲時間Tdn(Td1~Td6)，可使各描繪線SLn(SL1~SL6)沿著主掃描方向個別地移位。曝光控制部116係基於整體倍率修正資訊TMg及局部倍率修正資訊CMgn而生成表示延遲時間Tdn(Td1~Td6)之延遲資訊，並將所生成之延遲資訊輸出至描繪允許訊號生成部OSMn(OSM1~OSM6)。描繪允許訊號生成部OSMn(OSM1~OSM6)基於所輸入之延遲資訊而決定生成之描繪允許訊號SQn(SQ1~SQ6)之延遲時間Tdn(Td1~Td6)。 By changing the delay time Tdn, the position of the drawing line SLn on the substrate P can be shifted in the main scanning direction (Y direction). That is, by shortening the delay time Td, the position of the drawing line SLn in the main scanning direction is shifted toward the drawing start position side (the side opposite to the main scanning direction), and the main scanning of the drawing line SLn is performed by extending the delay time Td. Position in the direction The beam position side (main scanning direction side) is shifted. The delay time Tdn is set in principle such that the center point of the drawing line SLn reaches the center (midpoint) of the maximum scanning length (for example, 31 mm). Therefore, if the scan length of the drawing line SLn is expanded and contracted according to at least one of the overall magnification correction information TMg and the local magnification correction information CMgn while the delay time Tdn is kept fixed, the center point of the drawing line SLn is not located at the maximum scanning. The center of the length. Therefore, the delay time Tdn can also be determined based on the overall magnification correction information TMg and the local magnification correction information CMgn. By the delay time Tdn (Td1 to Td6), each of the drawing lines SLn (SL1 to SL6) can be individually shifted in the main scanning direction. The exposure control unit 116 generates delay information indicating the delay time Tdn (Td1 to Td6) based on the overall magnification correction information TMg and the local magnification correction information CMgn, and outputs the generated delay information to the drawing permission signal generation unit OSMn (OSM1~). OSM6). The delay time Tdn (Td1 to Td6) of the drawing permission signal SQn (SQ1 to SQ6) generated by the permission signal generating unit OSMn (OSM1 to OSM6) based on the input delay information is determined.
圖16係表示於最大掃描長度之範圍內伸縮之描繪線SLn之位置與延遲時間Td之關係的圖。符號MSLn表示最大掃描長度之描繪線SLn。又，符號SLna表示未伸縮之初始值之描繪線SLn，將該情形時之延遲時間Tdn以Tda表示。亦即，以描繪線SLna之中心點pa到達最大掃描長度之中點pm之方式，將該延遲時間Tda設定為初始值。又，符號SLnb係表示將初始值之描繪線SLna藉由整體倍率修正或局部倍率修正而縮小時之描繪線SLn之符號，符號SLnc係表示將初始值之描繪線SLna藉由整體倍率修正或局部倍率修正而伸長時之描繪線SLn之符號。 Fig. 16 is a view showing the relationship between the position of the drawing line SLn which is expanded and contracted within the range of the maximum scanning length and the delay time Td. The symbol MSLn represents the drawing line SLn of the maximum scanning length. Further, the symbol SLna represents the drawing line SLn of the initial value which is not stretched, and the delay time Tdn in this case is represented by Tda. In other words, the delay time Tda is set to an initial value such that the center point pa of the drawing line SLna reaches the midpoint pm of the maximum scanning length. Further, the symbol SLnb indicates the sign of the drawing line SLn when the initial value line SLna is reduced by the overall magnification correction or the local magnification correction, and the symbol SLnc indicates that the initial value line SLna is corrected by the overall magnification or locally. The sign of the drawing line SLn when the magnification is corrected and extended.
於將描繪線SLnb之延遲時間設為與描繪線SLna時相同之延遲時間Tda之情形時，描繪開始時序與描繪線SLna時相同。因此，描繪線 SLnb之描繪開始點不會相對於描繪線SLna之描繪開始點沿主掃描方向移位。然而，若為該情形，則由於描繪線SLnb相對於描繪線SLna縮小，故而描繪線SLnb之描繪結束點較描繪線SLna之描繪結束點向描繪開始點側偏移。因此，描繪線SLnb之中心點pb之位置較最大掃描長度之描繪線MSLn之中點pm之位置向描繪開始點側偏移。因此，於描繪線SLnb之情形時，亦可基於描繪線SLnb之縮小率，以描繪線SLnb之中心點pb與描繪線MSLn之中點pm一致之方式決定延遲時間Tdb。該情形時之延遲時間Tdb變得長於延遲時間Tda，描繪線SLnb之描繪開始點成為較描繪線SLna之描繪開始點向描繪結束點側(主掃描方向側)移位之狀態。 When the delay time of the drawing line SLnb is set to the same delay time Tda as when the drawing line SLna is used, the drawing start timing is the same as that in the case of the drawing line SLna. Therefore, draw lines The drawing start point of SLnb is not shifted in the main scanning direction with respect to the drawing start point of the drawing line SLna. However, in this case, since the drawing line SLnb is reduced with respect to the drawing line SLna, the drawing end point of the drawing line SLnb is shifted toward the drawing start point side from the drawing end point of the drawing line SLna. Therefore, the position of the center point pb of the drawing line SLnb is shifted from the position of the point pm of the drawing line MSLn of the maximum scanning length toward the drawing start point side. Therefore, in the case of drawing the line SLnb, the delay time Tdb can be determined such that the center point pb of the drawing line SLnb coincides with the point pm of the drawing line MSLn based on the reduction ratio of the drawing line SLnb. In this case, the delay time Tdb is longer than the delay time Tda, and the drawing start point of the drawing line SLnb is shifted to the drawing end point side (main scanning direction side) from the drawing start point of the drawing line SLna.
又，於將描繪線SLnc之延遲時間設為與描繪線SLna時相同之延遲時間Tda之情形時，描繪開始時序與描繪線SLna時相同。因此，描繪線SLnc之描繪開始點不會相對於描繪線SLna之描繪開始點沿主掃描方向移位。然而，若為該情形，則由於描繪線SLnb相對於描繪線SLna伸長，故而描繪線SLnc之描繪結束點較描繪線SLna之描繪結束點向描繪結束點側(主掃描方向側)偏移。因此，描繪線SLnc之中心點pc之位置較最大掃描長度之描繪線MSLn之中點pm之位置向描繪結束點側偏移。因此，於描繪線SLnc之情形時，亦可基於描繪線SLnc之伸長率，以描繪線SLnc之中心點pc與描繪線MSLn之中點pm一致之方式決定延遲時間Tdc。該情形時之延遲時間Tdc變得短於延遲時間Tda，描繪線SLnc之描繪開始點成為較描繪線SLna之描繪開始點向描繪開始點側(與主掃描方向相反之側)移位之狀態。 Further, when the delay time of the drawing line SLnc is set to the same delay time Tda as when the drawing line SLna is used, the drawing start timing is the same as that in the case of the drawing line SLna. Therefore, the drawing start point of the drawing line SLnc is not shifted in the main scanning direction with respect to the drawing start point of the drawing line SLna. However, in this case, since the drawing line SLnb is extended with respect to the drawing line SLna, the drawing end point of the drawing line SLnc is shifted toward the drawing end point side (main scanning direction side) from the drawing end point of the drawing line SLna. Therefore, the position of the center point pc of the drawing line SLnc is shifted from the position of the point pm of the drawing line MSLn of the maximum scanning length toward the drawing end point side. Therefore, in the case of drawing the line SLnc, the delay time Tdc can be determined such that the center point pc of the drawing line SLnc coincides with the point pm of the drawing line MSLn based on the elongation rate of the drawing line SLnc. In this case, the delay time Tdc is shorter than the delay time Tda, and the drawing start point of the drawing line SLnc is shifted to the drawing start point side (the side opposite to the main scanning direction) from the drawing start point of the drawing line SLna.
返回至圖14之說明，各描繪允許訊號生成部OSMn(OSM1 ~OSM6)所生成之描繪允許訊號SQn(SQ1~SQ6)被輸入至AND閘極部GTnb(GT1b~GT6b)之一輸入端子。詳細而言，於AND閘極部GT1b之一輸入端子，被輸入有描繪允許訊號SQ1，同樣地，於AND閘極部GT2b~GT6b之一輸入端子，被輸入有描繪允許訊號SQ2~SQ6。於AND閘極部GTnb(GT1b~GT6b)之另一輸入端子，被輸入有像素移位脈衝BSC(BSCa、BSCb)。於AND閘極部GT1b~GT3b，被同時輸入有來自光源裝置LSa之訊號產生部22a之像素移位脈衝BSCa，於AND閘極部GT4b~GT6b，被同時輸入有來自光源裝置LSb之訊號產生部22a之像素移位脈衝BSCb。AND閘極部GTnb(GT1b~GT6b)係如圖15所示，僅於自描繪允許訊號生成部OSMn(OSM1~OSM6)輸入之描繪允許訊號SQn(SQ1~SQ6)為高位準之時間內將所輸入之像素移位脈衝BSC(BSCa、BSCb)輸出。再者，藉由圖9之閘極電路GTa，於描繪允許訊號SQ1~SQ3(SQ4~SQ6)為高位準之期間中生成像素移位脈衝BSCa(BSCb)。 Returning to the description of FIG. 14, each of the drawing permission signal generating sections OSMn (OSM1) The drawing enable signal SQn (SQ1 to SQ6) generated by ~OSM6) is input to one of the input terminals of the AND gate portion GTnb (GT1b to GT6b). Specifically, the drawing permission signal SQ1 is input to one of the input terminals of the AND gate portion GT1b, and the drawing permission signals SQ2 to SQ6 are input to one of the input terminals of the AND gate portions GT2b to GT6b. Pixel shift pulses BSC (BSCa, BSCb) are input to the other input terminal of the AND gate portion GTnb (GT1b to GT6b). In the AND gate portions GT1b to GT3b, the pixel shift pulse BSCa from the signal generating portion 22a of the light source device LSa is simultaneously input, and the signal generating portion from the light source device LSb is simultaneously input to the AND gate portions GT4b to GT6b. The pixel shift pulse BSCb of 22a. As shown in FIG. 15, the AND gate portion GTnb (GT1b to GT6b) is only used when the drawing permission signal SQn (SQ1 to SQ6) input from the drawing enable signal generating unit OSMn (OSM1 to OSM6) is at a high level. The input pixel shift pulse BSC (BSCa, BSCb) is output. Further, by the gate circuit GTa of FIG. 9, the pixel shift pulse BSCa (BSCb) is generated while the rendering enable signals SQ1 to SQ3 (SQ4 to SQ6) are at the high level.
於3個AND閘極部GT1b~GT3b(GT4b~GT6b)，被輸入有使與3個描繪允許訊號SQ1~SQ3(SQ4~SQ6)中之成為高位準之描繪允許訊號SQn對應之掃描單元Un之串列資料DLn之像素移位的像素移位脈衝BSCa(BSCb)。若詳細說明，則於描繪允許訊號SQ1為高位準之期間中，使與描繪允許訊號SQ1對應之掃描單元U1之串列資料DL1之像素移位之像素移位脈衝BSCa被輸入至3個AND閘極部GT1b~GT3b。又，於描繪允許訊號SQ2、SQ3為高位準之期間中，使與描繪允許訊號SQ2、SQ3對應之掃描單元U2、U3之串列資料DL2、DL3之像素移位之像素移位脈衝BSCa被輸入至3個AND閘極部GT1b~GT3b。以同樣之方式，於描繪允許訊號 SQ4~SQ6為高位準之期間中，使與描繪允許訊號SQ4~SQ6對應之掃描單元U4~U6之串列資料DL4~DL6之像素移位之像素移位脈衝BSCb被輸入至3個AND閘極部GT4b~GT6b。 Scanning units Un corresponding to the drawing permission signal SQn which is a high level among the three drawing permission signals SQ1 to SQ3 (SQ4 to SQ6) are input to the three AND gate portions GT1b to GT3b (GT4b to GT6b). The pixel shift pulse BSCa (BSCb) of the pixel shift of the serial data DLn. As described in detail, in the period in which the rendering enable signal SQ1 is at the high level, the pixel shift pulse BSCa for shifting the pixel of the serial data DL1 of the scanning unit U1 corresponding to the drawing enable signal SQ1 is input to the three AND gates. Pole GT1b~GT3b. Further, in the period in which the rendering enable signals SQ2 and SQ3 are at the high level, the pixel shift pulse BSCa for shifting the pixels of the serial data DL2, DL3 of the scanning units U2, U3 corresponding to the drawing enable signals SQ2, SQ3 is input. Up to 3 AND gate parts GT1b~GT3b. In the same way, depicting the allowed signal In the period in which the SQ4 to SQ6 are in the high level, the pixel shift pulse BSCb for shifting the pixels of the serial data DL4 to DL6 of the scanning units U4 to U6 corresponding to the drawing enable signals SQ4 to SQ6 is input to the three AND gates. Department GT4b~GT6b.
各記憶體部(描繪資料記憶部)BMn(BM1~BM6)係記憶與所對應之掃描單元Un(U1~U6)應描繪曝光之圖案相應之圖案資料(點陣圖)之記憶體。計數器部CONn(CON1~CON6)係用以將記憶體部BMn(BM1~BM6)中所記憶之圖案資料中之串列資料DLn(DL1~DL6)之各像素之邏輯資訊於列方向以1像素為單位同步地輸出至像素移位脈衝BSC(BSCa、BSCb)的計數器。藉此，於描繪允許訊號SQn(SQ1~SQ6)為高位準(H)之時間中，與之對應之掃描單元Un(U1~U6)之串列資料DLn(DL1~DL6)之各像素之邏輯資訊於列方向以1像素為單位同步地輸出至像素移位脈衝BSC(BSCa、BSCb)。例如，於描繪允許訊號SQ1(SQ2、SQ3)為高位準(H)之期間中，串列資料DL1(DL2、DL3)之邏輯資訊以1像素為單位同步地輸出至像素移位脈衝BSCa。又，於描繪允許訊號SQ4(SQ5、SQ6)為高位準(H)之期間中，串列資料DL4(DL5、DL6)之邏輯資訊以1像素為單位同步地輸出至像素移位脈衝BSCb。 Each memory unit (drawing data storage unit) BMn (BM1 to BM6) stores a memory of the pattern data (dot map) corresponding to the pattern of the exposure, and the corresponding scanning unit Un (U1 to U6). The counter unit CONn (CON1 to CON6) is for dividing the logical information of each pixel of the serial data DLn (DL1 to DL6) in the pattern data stored in the memory portion BMn (BM1 to BM6) by 1 pixel in the column direction. The counters of the pixel shift pulses BSC (BSCa, BSCb) are output to the units in synchronization. Therefore, in the time when the allowable signal SQn (SQ1~SQ6) is at the high level (H), the logic of each pixel of the serial data DLn (DL1~DL6) of the scanning unit Un(U1~U6) corresponding thereto is logically drawn. The information is synchronously output to the pixel shift pulses BSC (BSCa, BSCb) in units of 1 pixel in the column direction. For example, in the period in which the rendering enable signals SQ1 (SQ2, SQ3) are in the high level (H), the logical information of the serial data DL1 (DL2, DL3) is synchronously output to the pixel shift pulse BSCa in units of one pixel. In the period in which the rendering enable signal SQ4 (SQ5, SQ6) is in the high level (H), the logical information of the serial data DL4 (DL5, DL6) is synchronously output to the pixel shift pulse BSCb in units of one pixel.
又，記憶體部BMn(BM1~BM6)中所記憶之圖案資料之串列資料DLn(DL1~DL6)藉由未圖示之位址計數器等而向行方向移位。亦即，藉由未圖示之位址計數器讀出之行係如第1行、第2行、第3行、…般移位。該移位係例如若為與掃描單元U1對應之記憶體部BM1，則於將串列資料DL1輸出結束之後，於與接下來進行掃描之掃描單元U2對應之入射允許訊號LP2成為高位準(H)之時點(產生原點訊號SZ2之時點)進行。 記憶體部BM2中所記憶之圖案資料之串列資料DL2之移位係於將串列資料DL2輸出結束之後，於與接下來進行掃描之掃描單元U3對應之入射允許訊號LP3成為高位準(H)之時點(產生原點訊號SZ3之時點)進行。又，記憶體部BM3中所記憶之圖案資料之串列資料DL3之移位係於將串列資料DL3輸出結束之後，於與接下來進行掃描之掃描單元U1對應之入射允許訊號LP1成為高位準(H)之時點(產生原點訊號SZ1之時點)進行。再者，第1掃描模組之3個掃描單元U1~U3係依照U1→U2→U3之順序進行聚焦光SP之掃描。 Further, the tandem data DLn (DL1 to DL6) of the pattern data stored in the memory portion BMn (BM1 to BM6) is shifted in the row direction by an address counter or the like (not shown). That is, the line read by the address counter (not shown) is shifted as in the first line, the second line, and the third line. For example, if the shift portion is the memory portion BM1 corresponding to the scanning unit U1, after the output of the serial data DL1 is completed, the incident enable signal LP2 corresponding to the scanning unit U2 to be scanned next becomes a high level (H). At the time (the point when the origin signal SZ2 is generated). The shift of the tandem data DL2 of the pattern data stored in the memory portion BM2 is after the end of the output of the serial data DL2, and the incident enable signal LP3 corresponding to the scanning unit U3 to be scanned next becomes a high level (H). At the time (the point when the origin signal SZ3 is generated). Further, the shift of the tandem data DL3 of the pattern data stored in the memory portion BM3 is after the output of the serial data DL3 is completed, and the incident enable signal LP1 corresponding to the scanning unit U1 to be scanned next becomes a high level. At the time point (H) (the point at which the origin signal SZ1 is generated). Furthermore, the three scanning units U1 to U3 of the first scanning module perform scanning of the focused light SP in the order of U1 → U2 → U3.
以同樣之方式，記憶體部BM4~BM6中所記憶之圖案資料之串列資料DL4~DL6之移位係於將串列資料DL4~DL6輸出結束之後，於與接下來進行掃描之掃描單元U5、U6、U4對應之入射允許訊號LP5、LP6、LP4成為高位準(H)之時點(產生原點訊號SZ5、SZ6、SZ4之時點)進行。再者，第2掃描模組之3個掃描單元U4~U6係依照U4→U5→U6之順序進行聚焦光SP之掃描。 In the same manner, the shifting of the tandem data DL4~DL6 of the pattern data memorized in the memory portions BM4 to BM6 is performed after the output of the serial data DL4 to DL6 is completed, and the scanning unit U5 is scanned next. The U6 and U4 corresponding incident enable signals LP5, LP6, and LP4 are at a high level (H) (at the time when the origin signals SZ5, SZ6, and SZ4 are generated). Furthermore, the three scanning units U4 to U6 of the second scanning module perform scanning of the focused light SP in the order of U4 → U5 → U6.
自記憶體部BMn(BM1~BM6)輸出之串列資料DLn(DL1~DL6)被輸入至AND閘極部GTna(GT1a~GT6a)之一輸入端子。於AND閘極部GTna(GT1a~GT6a)之另一輸入端子，被輸入有入射允許訊號LPn(LP1~LP6)。因此，AND閘極部GTna(GT1a~GT6a)係於入射允許訊號LPn(LP1~LP6)為高位準(H)之期間中(時間Ton中)輸出串列資料DLn(DL1~DL6)。藉此，進行聚焦光SP之掃描之掃描單元Un之串列資料DLn被輸出。藉此，串列資料DLn(DL1~DL3)自第1資料輸出部114a之生成電路GE1~GE3依照DL1→DL2→DL3之順序輸出，而被輸入至3輸入之 OR閘極部GT1m。以同樣之方式，串列資料DLn(DL4~DL6)自第2資料輸出部114b之生成電路GE4~GE6依照DL4→DL5→DL6之順序輸出，而被輸入至3輸入之OR閘極部GT2m。 The serial data DLn (DL1 to DL6) output from the memory portion BMn (BM1 to BM6) is input to one of the input terminals of the AND gate portion GTna (GT1a to GT6a). An incident enable signal LPn (LP1 to LP6) is input to the other input terminal of the AND gate portion GTna (GT1a to GT6a). Therefore, the AND gate portion GTna (GT1a to GT6a) outputs the serial data DLn (DL1 to DL6) in the period in which the incident enable signal LPn (LP1 to LP6) is at the high level (H) (in the time Ton). Thereby, the serial data DLn of the scanning unit Un that performs scanning of the focused light SP is output. As a result, the serial data DLn (DL1 to DL3) are output from the generation circuits GE1 to GE3 of the first data output unit 114a in the order of DL1 → DL2 → DL3, and are input to the three inputs. OR gate GT1m. In the same manner, the serial data DLn (DL4 to DL6) are output from the generation circuits GE4 to GE6 of the second data output unit 114b in the order of DL4 → DL5 → DL6, and are input to the 3-input OR gate unit GT2m.
OR閘極部GT1m將依照DL1→DL2→DL3之順序被反覆輸入之串列資料DLn(DL1→DL2→DL3)作為描繪位元串資料SBa輸出至光源裝置LSa之驅動電路36a。藉此，第1掃描模組之3個掃描單元U1~U3可依照U1→U2→U3之順序進行聚焦光SP之掃描，與此同時，將與圖案資料相應之圖案描繪曝光。以同樣之方式，OR閘極部GT2m將依照DL4→DL5→DL6之順序被反覆輸入之串列資料DLn作為描繪位元串資料SBb輸出至光源裝置LSb之驅動電路36a。藉此，第2掃描模組之3個掃描單元U4~U6可依照U4→U5→U6之順序進行聚焦光SP之掃描，與此同時，將與圖案資料相應之圖案描繪曝光。 The OR gate unit GT1m outputs the serial data DLn (DL1 → DL2 → DL3) which is repeatedly input in the order of DL1 → DL2 → DL3 as the drawing bit string data SBa to the drive circuit 36a of the light source device LSa. Thereby, the three scanning units U1 to U3 of the first scanning module can scan the focused light SP in the order of U1 → U2 → U3, and at the same time, expose the pattern corresponding to the pattern data. In the same manner, the OR gate portion GT2m outputs the serial data DLn repeatedly input in the order of DL4 → DL5 → DL6 as the drawing bit string data SBb to the driving circuit 36a of the light source device LSb. Thereby, the three scanning units U4 to U6 of the second scanning module can scan the focused light SP in the order of U4 → U5 → U6, and at the same time, expose the pattern corresponding to the pattern data.
再者，本第1實施形態中，針對每個掃描單元Un(U1~U6)，準備圖案資料，以掃描模組為單位，自3個掃描單元Un(U1~U3、U4~U6)之圖案資料之中，依照進行聚焦光SP之掃描之掃描單元Un之順序(U1→U2→U3、U4→U5→U6)輸出串列資料DL1~DL3、DL4~DL6。然而，由於進行聚焦光SP之掃描之掃描單元Un之順序被預先決定，故而亦可針對每個掃描模組，準備將3個掃描單元Un(U1~U3、U4~U6)之圖案資料之各串列資料DLn(DL1~DL3、DL4~DL6)組合而成之1個圖案資料。亦即，亦可針對每個掃描模組，構築將3個掃描單元Un(U1~U3、U4~U6)之圖案資料之各行之串列資料DLn(DL1~DL3、DL4~DL6)依照進行聚焦光SP之掃描之掃描單元Un之順序排列而成之1個圖案資料。於 該情形時，只要將針對每個掃描模組構築之1個圖案資料之串列資料DLn根據描繪允許訊號SQn(SQ1~SQ3、SQ4~SQ6)自第1行依序輸出即可。 Further, in the first embodiment, pattern data is prepared for each scanning unit Un (U1 to U6), and patterns of three scanning units Un (U1 to U3, U4 to U6) are used in units of scanning modules. In the data, the serial data DL1 to DL3 and DL4 to DL6 are output in the order of the scanning unit Un for scanning the focused light SP (U1 → U2 → U3, U4 → U5 → U6). However, since the order of the scanning unit Un for performing the scanning of the focused light SP is determined in advance, it is also possible to prepare each of the pattern data of the three scanning units Un (U1 to U3, U4 to U6) for each scanning module. One pattern data of a combination of DLn (DL1~DL3, DL4~DL6). In other words, it is also possible to construct a series of data DLn (DL1 to DL3, DL4 to DL6) of each row of pattern data of three scanning units Un (U1 to U3, U4 to U6) for each scanning module. One pattern data in which the scanning unit Un of the scanning of the light SP is arranged in order. to In this case, the tandem data DLn of one pattern data constructed for each scanning module may be sequentially output from the first line in accordance with the drawing permission signal SQn (SQ1 to SQ3, SQ4 to SQ6).
且說，圖12所示之曝光控制部116係控制整體倍率設定部110、局部倍率設定部112、及描繪資料輸出部114者。於曝光控制部116，被輸入有標記位置檢測部106檢測出之設置方位線Lx1、Lx4上之對準標記MKm(MK1~MK4)之位置資訊、與旋轉位置檢測部108檢測出之設置方位線Lx1~Lx4上之旋轉筒DR之旋轉角度位置資訊(基於計數器電路CN1a~CN4a、CN1b~CN4b之計數值)。曝光控制部116基於設置方位線Lx1上之對準標記MKm(MK1~MK4)之位置資訊、與設置方位線Lx1上之旋轉筒DR之旋轉角度位置(計數器電路CN1a、CN1b之計數值)而檢測(決定)基板P之副掃描方向(X方向)上之曝光區域W之描繪曝光之開始位置。 Further, the exposure control unit 116 shown in FIG. 12 controls the overall magnification setting unit 110, the local magnification setting unit 112, and the drawing material output unit 114. The exposure control unit 116 receives the position information of the alignment marks MKm (MK1 to MK4) on the set azimuth lines Lx1 and Lx4 detected by the mark position detecting unit 106, and the set position line detected by the rotational position detecting unit 108. Rotation angle position information of the rotating cylinder DR on Lx1~Lx4 (based on the counter values of the counter circuits CN1a~CN4a, CN1b~CN4b). The exposure control unit 116 detects based on the position information of the alignment marks MKm (MK1 to MK4) on the orientation line Lx1 and the rotation angle position of the rotary cylinder DR on the orientation line Lx1 (the count values of the counter circuits CN1a and CN1b). (Determining) the starting position of the drawing exposure of the exposure area W in the sub-scanning direction (X direction) of the substrate P.
然後，曝光控制部116基於檢測出描繪曝光之開始位置時之設置方位線Lx1上之旋轉筒DR之旋轉角度位置、與設置方位線Lx2上之旋轉角度位置(基於計數器電路CN2a、CN2b之計數值)，判斷基板P之描繪曝光之開始位置是否被搬送至位於設置方位線Lx2上之描繪線SL1、SL3、SL5上。曝光控制部116當判斷描繪曝光之開始位置被搬送至描繪線SL1、SL3、SL5上時控制局部倍率設定部112及描繪資料輸出部114等，使掃描單元U1、U3、U5開始利用聚焦光SP之掃描進行之描繪。 Then, the exposure control unit 116 is based on the rotational angle position of the rotating cylinder DR on the set azimuth line Lx1 when the start position of the exposure is drawn, and the rotational angle position on the set azimuth line Lx2 (based on the count values of the counter circuits CN2a, CN2b) It is determined whether or not the start position of the drawing exposure of the substrate P is conveyed to the drawing lines SL1, SL3, and SL5 located on the set azimuth line Lx2. When the exposure control unit 116 determines that the start position of the drawing exposure is conveyed onto the drawing lines SL1, SL3, and SL5, the local magnification setting unit 112 and the drawing material output unit 114 are controlled to cause the scanning units U1, U3, and U5 to start using the focused light SP. The depiction of the scan.
於該情形時，曝光控制部116係於掃描單元U1、U3進行描繪曝光之時序，使局部倍率設定部112將與進行聚焦光SP之掃描之掃描單元U1、U3對應之局部倍率修正資訊CMg1、CMg3輸出至光源裝置LSa之訊號產生部22a。藉此，光源裝置LSa之訊號產生部22a根據局部倍率修正 資訊CMg1、CMg3而產生使進行聚焦光SP之掃描之掃描單元U1、U3之串列資料DL1、DL3之像素移位之像素移位脈衝BSCa。根據該像素移位脈衝BSCa，描繪資料輸出部114使與進行聚焦光SP之掃描之掃描單元U1、U3對應之串列資料DL1、DL3之各像素之邏輯資訊以1像素為單位不斷移位。同樣地，曝光控制部116於掃描單元U5進行描繪曝光之時序，使局部倍率設定部112將與掃描單元U5對應之局部倍率修正資訊CMg5輸出至光源裝置LSb之訊號產生部22a。藉此，光源裝置LSb之訊號產生部22a根據局部倍率修正資訊CMg5而產生使與進行聚焦光SP之掃描之掃描單元U5對應之串列資料DL5之像素移位之像素移位脈衝BSCb。根據該像素移位脈衝BSCb，描繪資料輸出部114使進行聚焦光SP之掃描之掃描單元U5之串列資料DL5之各像素之邏輯資訊以1像素為單位不斷移位。 In this case, the exposure control unit 116 causes the local magnification setting unit 112 to perform the partial magnification correction information CMg1 corresponding to the scanning units U1 and U3 that perform the scanning of the focused light SP, at the timing when the scanning units U1 and U3 perform the drawing exposure. The CMg 3 is output to the signal generating portion 22a of the light source device LSa. Thereby, the signal generating portion 22a of the light source device LSa corrects according to the local magnification. The information CMg1, CMg3 generates a pixel shift pulse BSCa for shifting the pixels of the serial data DL1, DL3 of the scanning units U1, U3 for scanning the focused light SP. According to the pixel shift pulse BSCa, the rendering material output unit 114 shifts the logical information of each pixel of the serial data DL1, DL3 corresponding to the scanning units U1, U3 that scan the focused light SP by one pixel. Similarly, the exposure control unit 116 causes the local magnification setting unit 112 to output the partial magnification correction information CMg5 corresponding to the scanning unit U5 to the signal generation unit 22a of the light source device LSb at the timing of the drawing exposure by the scanning unit U5. Thereby, the signal generation unit 22a of the light source device LSb generates a pixel shift pulse BSCb for shifting the pixel of the serial data DL5 corresponding to the scanning unit U5 that performs the scanning of the focused light SP, based on the local magnification correction information CMg5. According to the pixel shift pulse BSCb, the drawing data output unit 114 shifts the logical information of each pixel of the serial data DL5 of the scanning unit U5 that scans the focused light SP by one pixel.
其後，曝光控制部116基於檢測出描繪曝光之開始位置時之設置方位線Lx1上之旋轉筒DR之旋轉角度位置、與設置方位線Lx3上之旋轉角度位置(計數器電路CN3a、CN3b之計數值)，判斷基板P之描繪曝光之開始位置是否被搬送至位於設置方位線Lx3上之描繪線SL2、SL4、SL6上。曝光控制部116當判斷描繪曝光之開始位置被搬送至描繪線SL2、SL4、SL6上時控制局部倍率設定部112及描繪資料輸出部114，進而，使掃描單元U2、U4、U6開始聚焦光SP之掃描。 Thereafter, the exposure control unit 116 determines the rotation angle position of the rotary cylinder DR on the set azimuth line Lx1 when the start position of the exposure is drawn, and the rotation angle position on the set orientation line Lx3 (counter values of the counter circuits CN3a, CN3b). It is determined whether or not the start position of the drawing exposure of the substrate P is conveyed onto the drawing lines SL2, SL4, and SL6 located on the set azimuth line Lx3. When the exposure control unit 116 determines that the start position of the drawing exposure is conveyed onto the drawing lines SL2, SL4, and SL6, the local magnification setting unit 112 and the drawing material output unit 114 are controlled, and the scanning units U2, U4, and U6 start to focus the light SP. Scanning.
於該情形時，曝光控制部116於掃描單元U2進行描繪曝光之時序，使局部倍率設定部112將與進行聚焦光SP之掃描之掃描單元U2對應之局部倍率修正資訊CMg2輸出至光源裝置LSa之訊號產生部22a。藉此，光源裝置LSa之訊號產生部22a根據局部倍率修正資訊CMg2而產生使 進行聚焦光SP之掃描之掃描單元U2之串列資料DL2之像素移位之像素移位脈衝BSCa。根據該像素移位脈衝BSCa，描繪資料輸出部114使進行聚焦光SP之掃描之掃描單元U2之串列資料DL2之各像素之邏輯資訊以1像素為單位不斷移位。同樣地，曝光控制部116於掃描單元U4、U6進行描繪曝光之時序，使局部倍率設定部112將與掃描單元U4、U6對應之局部倍率修正資訊CMg4、CMg6輸出至光源裝置LSb之訊號產生部22a。藉此，光源裝置LSb之訊號產生部22a根據局部倍率修正資訊CMg4、CMg6而產生使進行聚焦光SP之掃描之掃描單元U4、U6之串列資料DL4、DL6之像素移位之像素移位脈衝BSCb。根據該像素移位脈衝BSCb，描繪資料輸出部114使進行聚焦光SP之掃描之掃描單元U4、U6之串列資料DL4、DL6之各像素之邏輯資訊以1像素為單位不斷移位。 In this case, the exposure control unit 116 outputs the partial magnification correction information CMg2 corresponding to the scanning unit U2 that performs the scanning of the focused light SP to the light source device LSa at the timing of the drawing exposure by the scanning unit U2. The signal generating unit 22a. Thereby, the signal generating unit 22a of the light source device LSa generates the local magnification correction information CMg2 based on the local magnification correction information CMg2. The pixel shift pulse BSCa of the pixel shift of the serial data DL2 of the scanning unit U2 of the scanning of the focused light SP is performed. According to the pixel shift pulse BSCa, the drawing data output unit 114 shifts the logical information of each pixel of the serial data DL2 of the scanning unit U2 that scans the focused light SP by one pixel. Similarly, the exposure control unit 116 causes the scanning unit U4 and U6 to perform the drawing exposure, and causes the local magnification setting unit 112 to output the partial magnification correction information CMg4 and CMg6 corresponding to the scanning units U4 and U6 to the signal generation unit of the light source device LSb. 22a. Thereby, the signal generating unit 22a of the light source device LSb generates a pixel shift pulse for shifting the pixels of the serial data DL4, DL6 of the scanning units U4, U6 for scanning the focused light SP based on the local magnification correction information CMg4, CMg6. BSCb. According to the pixel shift pulse BSCb, the drawing material output unit 114 shifts the logical information of each pixel of the serial data DL4 and DL6 of the scanning units U4 and U6 that scans the focused light SP by one pixel.
如由上文之圖4可知，基板P係向+X方向被搬送，故而描繪線SL1、SL3、SL5之各者上之描繪曝光先行，基板P進而被搬送特定距離後進行描繪線SL2、SL4、SL6之各者上之描繪曝光。另一方面，第1掃描模組之3個掃描單元U1~U3之各多角鏡PM、第2掃描模組之3個掃描單元U4~U6之各多角鏡PM係具有特定之相位差地被旋轉控制，因此原點訊號SZ1~SZ3、SZ4~SZ6如圖13所示般具有相當於時間Ts之相位差地持續產生。因此，產生如圖13所示之入射允許訊號LPn(LP1~LP6)，於自描繪線SL1、SL3、SL5上之描繪曝光之開始時點至描繪線SL2、SL4、SL6上之描繪曝光之開始之前之期間，亦將圖14中之AND閘極部GT2a、GT4a、GT6a開啟，而輸出串列資料DL2、DL4、DL6。因此，於曝光區域W之描繪曝光之開始位置到達至描繪線SL2、SL4、SL6上之前，便藉由利用掃描 單元U2、U4、U6之聚焦光SP之掃描而描繪圖案。 As can be seen from FIG. 4 above, the substrate P is transported in the +X direction. Therefore, the drawing exposure on each of the drawing lines SL1, SL3, and SL5 is advanced, and the substrate P is further transported by a specific distance, and then the drawing lines SL2 and SL4 are performed. , the exposure of each of the SL6. On the other hand, each polygon mirror PM of the three scanning units U1 to U3 of the first scanning module and the polygon mirrors PM of the three scanning units U4 to U6 of the second scanning module are rotated with a specific phase difference. Since the control, the origin signals SZ1 to SZ3 and SZ4 to SZ6 have a phase difference corresponding to the time Ts as shown in FIG. Therefore, an incidence permission signal LPn (LP1 to LP6) as shown in FIG. 13 is generated, before the start of the drawing exposure on the drawing lines SL1, SL3, and SL5 to the drawing exposure on the drawing lines SL2, SL4, and SL6. In the meantime, the AND gate portions GT2a, GT4a, and GT6a in Fig. 14 are also turned on, and the serial data DL2, DL4, and DL6 are output. Therefore, by using the scanning before the start position of the drawing exposure of the exposure region W reaches the drawing lines SL2, SL4, SL6 The pattern of the focused light SP of the cells U2, U4, U6 is scanned.
因此，較佳為於圖14之構成中，於每個生成電路GEn(GE1~GE6)設置選擇閘極電路，該選擇閘極電路係藉由曝光控制部116之控制而選擇將入射允許訊號LPn(LP1~LP6)輸送或禁止輸送至AND閘極部GTna(GT1a~GT6a)及描繪允許訊號生成部OSMn(OSM1~OSM6)。藉此，僅於各生成電路GEn(GE1~GE6)之選擇閘極電路開啟之期間中，對AND閘極部GTna(GT1a~GT6a)及描繪允許訊號生成部OSMn(OSM1~OSM6)輸入有入射允許訊號LPn(LP1~LP6)。因此，曝光控制部116可藉由關閉生成電路GE2、GE4、GE6之選擇閘極電路且開啟生成電路GE1、GE3、GE5之選擇閘極電路，而禁止串列資料DL2、DL4、DL6之輸出。又，藉由關閉該生成電路GE2、GE4、GE6之選擇閘極電路，亦不會生成描繪允許訊號SQ2、SQ4、SQ6。因此，於關閉生成電路GE2、GE4、GE6之選擇閘極電路之期間，亦禁止藉由閘極電路GTa(參照圖9)而生成使串列資料DL2、DL4、DL6之像素移位之像素移位脈衝BSC(BSCa、BSCb)。 Therefore, in the configuration of FIG. 14, a selection gate circuit is provided for each of the generation circuits GEn (GE1 to GE6), and the selection gate circuit selects the incident enable signal LPn by the control of the exposure control unit 116. (LP1 to LP6) are conveyed or prohibited from being sent to the AND gate portion GTna (GT1a to GT6a) and the drawing permission signal generating portion OSMn (OSM1 to OSM6). Thereby, the input to the AND gate portion GTna (GT1a to GT6a) and the drawing permission signal generating portion OSMn (OSM1 to OSM6) is incident only during the period in which the selection gate circuit of each of the generating circuits GEn (GE1 to GE6) is turned on. Allow signal LPn (LP1~LP6). Therefore, the exposure control unit 116 can disable the output of the serial data DL2, DL4, and DL6 by turning off the selection gate circuits of the generation circuits GE2, GE4, and GE6 and turning on the selection gate circuits of the generation circuits GE1, GE3, and GE5. Further, by turning off the selection gate circuits of the generation circuits GE2, GE4, and GE6, the drawing permission signals SQ2, SQ4, and SQ6 are not generated. Therefore, during the period of turning off the selection gate circuits of the generation circuits GE2, GE4, and GE6, it is also prohibited to generate pixel shifts for shifting the pixels of the serial data DL2, DL4, and DL6 by the gate circuit GTa (see FIG. 9). Bit pulse BSC (BSCa, BSCb).
再者，於不在各生成電路GEn(GE1~GE6)設置選擇閘極電路之情形時，曝光控制部116可藉由將輸出至光源裝置LSa、LSb之驅動電路36a之描繪位元串資料SBa、SBb中之、串列資料DL2、DL4、DL6所對應部分之像素之邏輯資訊全部取消為「0」，而實質上取消利用掃描單元U2、U4、U6之描繪曝光。取消期間中，自記憶體部BM2、BM4、BM6輸出之串列資料DL2、DL4、DL6之行未移位而保持為第1行。然後，自曝光區域W之描繪曝光之開始位置到達至描繪線SL2、SL4、SL6上之後，開始串列資料DL2、DL4、DL6之輸出，進行串列資料DL2、DL4、DL6向行方 向之移位。 Further, when the selection gate circuit is not provided in each of the generation circuits GEn (GE1 to GE6), the exposure control unit 116 can display the bit string data SBa of the drive circuit 36a output to the light source devices LSa and LSb, In the SBb, the logical information of the pixels corresponding to the serial data DL2, DL4, and DL6 is all canceled to "0", and the drawing exposure by the scanning units U2, U4, and U6 is substantially canceled. In the cancel period, the rows of the serial data DL2, DL4, and DL6 output from the memory portions BM2, BM4, and BM6 are not shifted and remain in the first row. Then, after the start position of the drawing exposure of the exposure region W reaches the drawing lines SL2, SL4, and SL6, the output of the serial data DL2, DL4, and DL6 is started, and the serial data DL2, DL4, and DL6 are sent to the line side. Shift to it.
同樣地，曝光區域W之描繪曝光之結束位置先到達至描繪線SL1、SL3、SL5上，其後隔開固定之時間到達至描繪線SL2、SL4、SL6上。因此，描繪曝光之結束位置到達至描繪線SL1、SL3、SL5之後，且到達至描繪線SL2、SL4、SL6為止，僅利用掃描單元U2、U4、U6進行圖案之描繪曝光。因此，曝光控制部116可藉由關閉生成電路GE1、GE3、GE5之選擇閘極電路且開啟生成電路GE2、GE4、GE6之選擇閘極電路，而禁止串列資料DL1、DL3、DL5之輸出。又，藉由關閉該生成電路GE1、GE3、GE5之選擇閘極電路，亦禁止藉由圖9所示之閘極電路GTa而生成使串列資料DL1、DL3、DL5之像素移位之像素移位脈衝BSC(BSCa、BSCb)。再者，於不在各生成電路GEn(GE1~GE6)設置選擇閘極電路之情形時，曝光控制部116可藉由將輸出至光源裝置LSa、LSb之驅動電路36a之描繪位元串資料SBa、SBb中之、串列資料DL1、DL3、DL5所對應部分之像素之邏輯資訊全部取消為「0」，而實質上取消利用掃描單元U1、U3、U5之描繪曝光。 Similarly, the end position of the drawing exposure of the exposure region W reaches the drawing lines SL1, SL3, and SL5 first, and then reaches the drawing lines SL2, SL4, and SL6 at a fixed time. Therefore, after the end position of the drawing exposure reaches the drawing lines SL1, SL3, and SL5 and reaches the drawing lines SL2, SL4, and SL6, the drawing exposure of the pattern is performed only by the scanning units U2, U4, and U6. Therefore, the exposure control unit 116 can disable the output of the serial data DL1, DL3, and DL5 by turning off the selection gate circuits of the generation circuits GE1, GE3, and GE5 and turning on the selection gate circuits of the generation circuits GE2, GE4, and GE6. Further, by turning off the selection gate circuits of the generation circuits GE1, GE3, and GE5, it is also prohibited to generate pixel shifts for shifting the pixels of the serial data DL1, DL3, and DL5 by the gate circuit GTa shown in FIG. Bit pulse BSC (BSCa, BSCb). Further, when the selection gate circuit is not provided in each of the generation circuits GEn (GE1 to GE6), the exposure control unit 116 can display the bit string data SBa of the drive circuit 36a output to the light source devices LSa and LSb, In SBb, the logical information of the pixels corresponding to the portions of the serial data DL1, DL3, and DL5 are all canceled to "0", and the drawing exposure by the scanning units U1, U3, and U5 is substantially canceled.
又，曝光控制部116基於標記位置檢測部106檢測出之設置方位線Lx1、Lx4上之對準標記MKm(MK1~MK4)之位置資訊、與旋轉位置檢測部108檢測出之設置方位線Lx1、Lx4上之旋轉筒DR之旋轉角度位置資訊，而逐次運算基板P或曝光區域W之形變(變形)。例如，於基板P於長尺寸方向受到較大之張力或接受熱製程而變形之情形時，曝光區域W之形狀亦發生形變(發生變形)，對準標記MKm(MK1~MK4)之排列亦未成為如圖4所示之矩形狀，而成為形變之(變形之)狀態。於基板P 或曝光區域W發生形變之情形時，必須與之相應地變更各描繪線SLn之倍率，因此，曝光控制部116基於運算出之基板P或曝光區域W之形變，生成整體倍率修正資訊TMg及局部倍率修正資訊CMgn之至少一者。然後，該生成之整體倍率修正資訊TMg及局部倍率修正資訊CMgn之至少一者被輸出至整體倍率設定部110或局部倍率設定部112。藉此，可提高重疊曝光之精度。又，曝光控制部116亦可根據基板P或曝光區域W之形變，而針對各描繪線SLn分別生成修正傾斜角資訊。基於該生成之修正傾斜角資訊，上文所述之上述致動器使各掃描單元Un(U1~U6)繞照射中心軸Len(Le1~Le6)旋動。藉此，重疊曝光之精度更加提高。曝光控制部116亦可每當藉由各掃描單元Un(U1~U6)進行聚焦光SP之掃描時，或者每當進行特定次數之聚焦光SP之掃描時，或者於基板P或曝光區域W之形變之傾向超出容許範圍而變化時，再次生成整體倍率修正資訊TMg及局部倍率修正資訊CMgn之至少一者、與修正傾斜角資訊。 Further, the exposure control unit 116 determines the position information of the alignment marks MKm (MK1 to MK4) on the set azimuth lines Lx1 and Lx4 detected by the mark position detecting unit 106, and the set orientation line Lx1 detected by the rotational position detecting unit 108. The rotation angle position information of the rotating cylinder DR on the Lx4 is sequentially subjected to deformation (deformation) of the substrate P or the exposure region W. For example, when the substrate P is subjected to a large tension in the longitudinal direction or is deformed by a thermal process, the shape of the exposed region W is also deformed (deformed), and the alignment marks MKm (MK1 to MK4) are not arranged. It becomes a rectangular shape as shown in FIG. 4, and becomes a deformed (deformed) state. On the substrate P When the exposure region W is deformed, the magnification of each of the drawing lines SLn must be changed accordingly. Therefore, the exposure control unit 116 generates the overall magnification correction information TMg and the partial portion based on the calculated deformation of the substrate P or the exposure region W. At least one of the magnification correction information CMgn. Then, at least one of the generated overall magnification correction information TMg and the local magnification correction information CMgn is output to the overall magnification setting unit 110 or the local magnification setting unit 112. Thereby, the precision of the overlapping exposure can be improved. Further, the exposure control unit 116 may generate corrected tilt angle information for each of the drawing lines SLn based on the deformation of the substrate P or the exposure region W. Based on the generated corrected tilt angle information, the above-described actuator rotates each of the scanning units Un (U1 to U6) around the illumination center axis Len (Le1 to Le6). Thereby, the accuracy of overlapping exposure is further improved. The exposure control unit 116 may also perform scanning of the focused light SP by each of the scanning units Un (U1 to U6), or each time a specific number of times of scanning of the focused light SP is performed, or in the substrate P or the exposure area W. When the tendency of the deformation changes beyond the allowable range, at least one of the overall magnification correction information TMg and the local magnification correction information CMgn is generated again, and the corrected tilt angle information is generated.
如上所述，第1實施形態之曝光裝置EX係一面將藉由來自脈衝光源部35之種子光S1、S2而生成之射束LB(Lse、LBa、LBb、LBn)之聚焦光SP根據圖案進行強度調變，一面使聚焦光SP沿著基板P上之描繪線SLn而相對地掃描，藉此於基板P上描繪圖案。而且，曝光裝置EX至少具備記憶體部BMn、時脈產生部60、光源控制部、修正像素指定部62、及送出時序切換部64。如上所述，記憶體部BMn係記憶有藉由掃描單元Un之聚焦光SP之掃描而描繪之圖案資料者。時脈產生部60生成如下之時脈訊號LTC：具有由Pxy/(N×Vs)決定之基準週期Ta，於聚焦光SP之掃描中每1像素之尺寸Pxy具有N個時脈脈衝。光源控制部至少由控制電路 22、電光元件36、驅動電路36a、及描繪資料輸出部114構成。該光源控制部係以響應時脈訊號LTC之時脈脈衝而產生射束LB之方式控制脈衝光源部35，並且基於自記憶體部BMn依序送出之構成圖案資料之串列資料DLn之每個像素之邏輯資訊而將射束LB之強度進行調變。修正像素指定部62將於描繪線SLn上排列之複數個像素之中配置在特定之位置之至少1個像素指定為修正像素。送出時序切換部64係以如下方式對像素之邏輯資訊之自記憶體部BMn之送出時序進行切換，即：於聚焦光SP對描繪線SLn上之修正像素以外之普通像素進行掃描之時序，時脈脈衝之N個對應1像素，於聚焦光SP對描繪線SLn上之修正像素進行掃描之時序，時脈脈衝之N±m個對應1像素。因此，可細緻地修正描繪線SLn(描繪之圖案)之倍率，而可進行微米級之精密之重疊曝光。 As described above, the exposure apparatus EX of the first embodiment performs the focusing light SP of the beam LB (Lse, LBa, LBb, LBn) generated by the seed lights S1 and S2 from the pulse light source unit 35 according to the pattern. The intensity is modulated, and the focused light SP is relatively scanned along the drawing line SLn on the substrate P, thereby drawing a pattern on the substrate P. Further, the exposure apparatus EX includes at least a memory unit BMn, a clock generation unit 60, a light source control unit, a correction pixel designation unit 62, and a transmission timing switching unit 64. As described above, the memory portion BMn stores the pattern data drawn by the scanning of the focused light SP of the scanning unit Un. The clock generation unit 60 generates a clock signal LTC having a reference period Ta determined by Pxy/(N × Vs) and having N clock pulses per pixel size Pxy in the scanning of the focused light SP. The light source control unit is at least controlled by the control circuit 22. The electro-optical element 36, the drive circuit 36a, and the drawing data output unit 114 are configured. The light source control unit controls the pulse light source unit 35 so as to generate the beam LB in response to the clock pulse of the clock signal LTC, and each of the serial data DLn constituting the pattern data sequentially sent from the memory unit BMn. The logic of the pixel modulates the intensity of the beam LB. The corrected pixel specifying unit 62 designates at least one pixel disposed at a specific position among the plurality of pixels arranged on the drawing line SLn as the corrected pixel. The delivery timing switching unit 64 switches the timing of the transmission of the logic information of the pixel from the memory portion BMn, that is, the timing at which the focused light SP scans the normal pixels other than the corrected pixels on the drawing line SLn. N of the pulse pulses correspond to one pixel, and the corrected light of the focused light SP on the drawing line SLn is scanned, and N±m of the clock pulse corresponds to one pixel. Therefore, the magnification of the drawing line SLn (the pattern to be drawn) can be finely corrected, and the precise overlapping exposure of the micron order can be performed.
曝光裝置EX具備複數個掃描單元Un，該等掃描單元Un具有：多角鏡PM，其將射束LB一維地偏向；及光學透鏡構件(至少包含f θ透鏡FT及柱面透鏡CYb)，其將經多角鏡PM偏向之射束LB入射而於基板P上聚光為聚焦光SP。曝光裝置EX藉由自複數個掃描單元Un之各者投射之聚焦光SP而於基板P上描繪圖案。藉此，可簡單地擴大曝光區域W之範圍。 The exposure apparatus EX includes a plurality of scanning units Un having a polygon mirror PM that one-dimensionally deflects the beam LB, and an optical lens member (including at least an f θ lens FT and a cylindrical lens CYb). The beam LB deflected by the polygon mirror PM is incident and collected on the substrate P as the focused light SP. The exposure device EX draws a pattern on the substrate P by the focused light SP projected from each of the plurality of scanning units Un. Thereby, the range of the exposure area W can be simply expanded.
曝光裝置EX具備：多角鏡驅動控制部100，其以複數個掃描單元Un之各者之多角鏡PM之旋轉角度位置成為特定之相位關係之方式使多角鏡PM之各者同步旋轉；及射束切換部BDU，其將來自光源裝置LSa(或LSb)之射束根據多角鏡PM之旋轉角度位置以依序引導至複數個掃描單元Un中之任一個之方式進行切換。藉此，可於自1個掃描單元Un開始 聚焦光SP之掃描後至開始下一掃描之前之期間，複數個掃描單元Un之各者依序進行聚焦光SP之掃描。其結果為，可有效地活用射束LB。 The exposure apparatus EX includes a polygon mirror drive control unit 100 that synchronously rotates each of the polygon mirrors PM so that the rotation angle position of the polygon mirror PM of each of the plurality of scanning units Un becomes a specific phase relationship; and the beam The switching unit BDU switches the beam from the light source device LSa (or LSb) in order to sequentially guide the rotation angle position of the polygon mirror PM to any one of the plurality of scanning units Un. Thereby, starting from one scanning unit Un During the scanning of the focused light SP until the start of the next scanning, each of the plurality of scanning units Un sequentially scans the focused light SP. As a result, the beam LB can be effectively utilized.
曝光裝置EX具備將用以指定位於描繪線SLn上之複數個像素中之成為修正對象之修正像素之局部倍率修正資訊(修正資訊)CMgn記憶於複數個掃描單元Un之各者的局部倍率設定部(修正資訊記憶部)112。修正像素指定部62係基於與藉由射束切換部BDU而導入有射束LB之掃描單元Un對應之局部倍率修正資訊CMgn，指定位於被導入有射束LB之掃描單元Un之描繪線SLn上之修正像素。藉此，可針對每個描繪線SLn(掃描單元Un)，細緻地修正描繪線SLn(描繪之圖案)之倍率。因此，圖案曝光之重疊精度提高。 The exposure apparatus EX includes a local magnification setting unit that stores local magnification correction information (correction information) CMgn of the correction pixels to be corrected in the plurality of pixels located on the drawing line SLn in each of the plurality of scanning units Un. (Correction information storage unit) 112. The corrected pixel specifying unit 62 specifies the local magnification correction information CMgn corresponding to the scanning unit Un into which the beam LB is introduced by the beam switching unit BDU, and specifies the drawing line SLn located on the scanning unit Un to which the beam LB is introduced. Corrected pixels. Thereby, the magnification of the drawing line SLn (the pattern to be drawn) can be finely corrected for each drawing line SLn (scanning unit Un). Therefore, the overlay precision of the pattern exposure is improved.
局部倍率修正資訊CMgn包含修正位置資訊Nv，該修正位置資訊Nv用以按照沿描繪線SLn描繪之圖案之描繪倍率而於描繪線SLn上之離散之複數個位置之各者指定修正像素。修正像素指定部62基於修正位置資訊Nv，而指定離散地位於描繪線SLn上之複數個修正像素。送出時序切換部64係在位於描繪線SLn上之複數個修正像素之各者，以相對於修正像素對應有N±m個時脈訊號LTC之時脈脈衝之方式，將邏輯資訊之自記憶體部BMn之送出時序進行切換。藉此，可無不均地使描繪線SLn(描繪之圖案)進行倍率修正(伸縮)。 The local magnification correction information CMgn includes correction position information Nv for designating correction pixels for each of a plurality of discrete positions on the drawing line SLn in accordance with the drawing magnification of the pattern drawn along the drawing line SLn. The corrected pixel specifying unit 62 specifies a plurality of modified pixels discretely located on the drawing line SLn based on the corrected position information Nv. The sending timing switching unit 64 is a self-memory of logic information in a manner of a plurality of correction pixels located on the drawing line SLn in a manner corresponding to a clock pulse of N±m clock signals LTC with respect to the correction pixel. The timing of the delivery of the portion BMn is switched. Thereby, the drawing line SLn (the pattern to be drawn) can be subjected to magnification correction (expansion and contraction) without unevenness.
局部倍率修正資訊CMgn包含用以按照沿描繪線SLn描繪之圖案之描繪倍率而設定上述之「±m」之值之倍率資訊SCA。藉此，可使描繪線SLn(描繪之圖案)按照描繪倍率伸縮。 The local magnification correction information CMgn includes the magnification information SCA for setting the value of "±m" described above in accordance with the drawing magnification of the pattern drawn along the drawing line SLn. Thereby, the drawing line SLn (the pattern to be drawn) can be expanded and contracted at the drawing magnification.
射束切換部BDU具有複數個選擇用光學元件AOMn，該等 選擇用光學元件AOMn係沿著來自光源裝置LSa(或LSb)之射束LB之行進方向而串聯地配置，且切換射束LB之光路而選擇射束LB所入射之1個掃描單元Un。因此，可使來自光源裝置LSa(或LSb)之射束LB有效率地集中於應描繪曝光之1個掃描單元Un，從而獲得較高之曝光量。例如，於將來自光源裝置LSa(或LSb)之1個射束LB使用複數個射束分光器振幅分割為3個，並將分割後之3個射束LB之各者經由根據串列資料DLn而調變之描繪用之聲光調變元件(強度調變部)AOM引導至3個掃描單元Un的情形時，若將描繪用之聲光調變元件中之射束強度之衰減設為20%，將各掃描單元Un內之射束強度之衰減設為30%，則在將原先之射束LB之強度設為100%時，1個掃描單元Un中之聚焦光SP之強度成為約18.67%。另一方面，如第1實施形態，於將來自光源裝置LSa(或LSb)之射束LB藉由3個選擇用光學元件AOMn(AOM1~AOM3、AOM4~AOM6)而偏向，並將其入射至3個掃描單元Un(U1~U3、U4~U6)之任一個之情形時，於將選擇用光學元件AOMn中之射束強度之衰減設為20%時，1個掃描單元Un中之聚焦光SP之強度成為原先之射束LB之強度之約56%。 The beam switching unit BDU has a plurality of selection optical elements AOMn, and the like The selection optical element AOMn is arranged in series along the traveling direction of the beam LB from the light source device LSa (or LSb), and switches the optical path of the beam LB to select one scanning unit Un into which the beam LB is incident. Therefore, the beam LB from the light source device LSa (or LSb) can be efficiently concentrated on one scanning unit Un to which the exposure should be drawn, thereby obtaining a higher exposure amount. For example, one beam LB from the light source device LSa (or LSb) is divided into three using a plurality of beam splitters, and each of the three divided beams LB is passed through the serial data DLn. When the AOM of the acousto-optic modulation element (intensity modulation unit) for the modulation is guided to the three scanning units Un, the attenuation of the beam intensity in the acousto-optic modulation element for drawing is set to 20 %, the attenuation of the beam intensity in each scanning unit Un is set to 30%, and when the intensity of the original beam LB is set to 100%, the intensity of the focused light SP in one scanning unit Un becomes about 18.67. %. On the other hand, in the first embodiment, the beam LB from the light source device LSa (or LSb) is deflected by the three selection optical elements ANOn (AOM1 to AOM3, AOM4 to AOM6), and is incident on the beam LB. In the case of any one of the three scanning units Un (U1 to U3, U4 to U6), when the attenuation of the beam intensity in the optical element for selection AOMn is set to 20%, the focused light in one scanning unit Un The intensity of the SP is about 56% of the intensity of the original beam LB.
複數個選擇用光學元件AOMn係與複數個掃描單元Un對應而設置，切換是否使射束LB入射至所對應之掃描單元Un。因此，可簡單地選擇複數個掃描單元Un中之、射束LBn應入射之1個掃描單元Un。 A plurality of selection optical elements AOMn are provided corresponding to the plurality of scanning units Un, and whether or not the beam LB is incident on the corresponding scanning unit Un is switched. Therefore, it is possible to easily select one of the plurality of scanning units Un that the beam LBn should be incident on.
再者，本第1實施形態中，多角鏡PM之掃描效率為1/3，將分配有射束LBa、LBb之掃描單元Un之數量設為3個，因此將6個選擇用光學元件AOMn(AOM1~AOM6)分為2個光學元件模組(2個組)，與之對應地，將6個掃描單元Un(U1~U6)分為2個掃描模組(2個組)。然 而，於多角鏡PM之掃描效率為1/H，掃描單元Un及選擇用光學元件AOMn之數量為Q之情形時，將Q個選擇用光學元件AOMn分為Q/H個光學元件模組(Q/H之組)。而且，將Q個掃描單元Un分為Q/H之掃描模組即可。該情形時，較佳為使Q/H個光學元件模組(Q/H之組)之各者所包含之選擇用光學元件AOMn之數量相等，又，使Q/H個掃描模組(Q/H之組)之各者所包含之掃描單元Un之數量亦相等。再者，該Q/H較佳為正數。亦即，Q較佳為H之倍數。例如，於多角鏡PM之掃描效率為1/2，掃描單元Un及選擇用光學元件AOMn之數量為6個之情形時，只要將6個選擇用光學元件AOMn均等地分為3個光學元件模組(3個組)，且將6個掃描單元Un均等地分為3個掃描模組(3個組)即可。 Further, in the first embodiment, the scanning efficiency of the polygon mirror PM is 1/3, and the number of scanning units Un to which the beams LBa and LBb are allocated is three. Therefore, six selection optical elements ANOm ( AOM1~AOM6) is divided into two optical component modules (two groups), and correspondingly, six scanning units Un (U1 to U6) are divided into two scanning modules (two groups). Of course On the other hand, when the scanning efficiency of the polygon mirror PM is 1/H, and the number of the scanning unit Un and the selection optical element AOMn is Q, the Q selection optical elements AMnM are divided into Q/H optical element modules ( Group of Q/H). Further, it is sufficient to divide the Q scanning units Un into Q/H scanning modules. In this case, it is preferable to make the number of selection optical elements ANOMn included in each of the Q/H optical element modules (groups of Q/H) equal, and to make Q/H scanning modules (Q) The number of scanning units Un included in each of the groups of /H is also equal. Furthermore, the Q/H is preferably a positive number. That is, Q is preferably a multiple of H. For example, when the scanning efficiency of the polygon mirror PM is 1/2, and the number of the scanning unit Un and the selection optical element AOMn is six, the six selection optical elements AOMn are equally divided into three optical element modes. Groups (3 groups), and 6 scanning units Un can be equally divided into 3 scanning modules (3 groups).
又，上述第1實施形態中係將多角鏡PM之形狀設為八角形(反射面RP為8個)，但亦可為六角形、七角形，或亦可為九角形以上。藉此，多角鏡PM之掃描效率亦發生改變。一般而言，於多角形之形狀之多角鏡PM之反射面數Np以外之條件(例如，f θ透鏡FT之口徑或焦點距離等條件)相同之情形時，反射面數Np越多，則多角鏡PM之1反射面RP之掃描效率越大，反射面數越少，則多角鏡PM之掃描效率越小。又，反射面數Np越多，則多角鏡PM之外形越接近於圓形，因此旋轉中之風阻損失減少，而可使多角鏡PM更高速地旋轉。例如，如上文之例，於將8面之多角鏡PM以未達1/3之掃描效率使用之情形時，亦可變為24面(8面÷1/3)之多角鏡PM。但，於該情形時，為了將來自1個光源裝置LSa(LSb)之射束LBa(LBb)分時分配至3個掃描單元Un之各者，只要以如下方式控制3個掃描單元Un之各者之24面之多角鏡PM即可：以成為同一角度相 位之(原點訊號以同一時序產生之)方式同步旋轉，且每隔多角鏡PM之2個反射面進行1次描繪。 Further, in the first embodiment, the shape of the polygon mirror PM is octagonal (eight reflecting surfaces RP), but it may be hexagonal or heptagonal, or may be octagonal or more. Thereby, the scanning efficiency of the polygon mirror PM also changes. In general, when the conditions other than the number of reflection surfaces Np of the polygonal mirror PM of the polygonal shape (for example, the condition of the aperture or the focal length of the f θ lens FT) are the same, the more the number of reflection surfaces Np, the more the polygon The scanning efficiency of the reflecting surface RP of the mirror PM is larger, and the smaller the number of reflecting surfaces, the smaller the scanning efficiency of the polygon mirror PM. Further, the more the number of reflection surfaces Np is, the closer the shape of the polygon mirror PM is to the circular shape, so that the windage loss during the rotation is reduced, and the polygon mirror PM can be rotated at a higher speed. For example, as in the above example, when the polygon mirror PM of 8 faces is used at a scanning efficiency of less than 1/3, it can also be changed into a polygon mirror PM of 24 faces (8 faces 1/3). However, in this case, in order to time-distribute the beam LBa (LBb) from one light source device LSa (LSb) to each of the three scanning units Un, it is necessary to control each of the three scanning units Un as follows. The 24 polygon polygon PM can be used to become the same angle phase The bits (the origin signals are generated at the same timing) are synchronously rotated, and are drawn once for each of the two reflecting surfaces of the polygon mirror PM.
又，上述第1實施形態中，像素之尺寸Px與尺寸Py係設為相同長度(例如3μm)，但亦可使尺寸Px與尺寸Py之長度不同。關鍵在於，只要時脈產生部60生成具有由Py/(N×Vs)決定之基準週期Ta且於聚焦光SP之掃描中每1像素之尺寸Py具有N個時脈脈衝之時脈訊號LTC即可。 Further, in the first embodiment, the pixel size Px and the size Py are the same length (for example, 3 μm), but the length Px and the size Py may be different. The key is that the clock generation unit 60 generates the clock signal LTC having the reference period Ta determined by Py/(N×Vs) and having the N pulse pulses per pixel Py in the scanning of the focused light SP. can.
[第1實施形態之變形例] [Modification of the first embodiment]
上述第1實施形態亦可以如下方式變形。 The first embodiment described above can also be modified as follows.
於上述第1實施形態中，相對於普通像素對應有N(=8)個聚焦光SP(時脈訊號LTC之時脈脈衝)，相對於修正像素對應有N±m(=8±1)個聚焦光SP(時脈訊號LTC之時脈脈衝)。又，由於將1像素之尺寸Pxy設為與聚焦光SP之大小φ相同之3μm且將時脈訊號LTC之振盪頻率Fa設為400MHz，故而沿主掃描方向掃描之聚焦光SP之投射間隔成為0.375μm。因此，修正像素成為於主掃描方向上相對於尺寸Pxy為3μm之普通像素伸縮0.375μm後之大小。亦即，修正像素伸縮之比率成為12.5(=0.375/3)%。又，於根據倍率資訊SCA而決定之「±m」之值為「±2」之情形時，相對於尺寸Pxy為3μm之普通像素，修正像素伸縮0.75μm，其比率成為25(=0.75/3)%。 In the first embodiment described above, N (=8) focused lights SP (clock pulses of the clock signal LTC) are associated with the normal pixels, and N±m (=8±1) corresponding to the corrected pixels. Focusing light SP (clock pulse of the pulse signal LTC). Further, since the size Pxy of one pixel is set to 3 μm which is the same as the size φ of the focused light SP and the oscillation frequency Fa of the clock signal LTC is set to 400 MHz, the projection interval of the focused light SP scanned in the main scanning direction becomes 0.375. Mm. Therefore, the corrected pixel has a size of 0.375 μm after stretching in a main scanning direction with respect to a normal pixel having a size Pxy of 3 μm. That is, the ratio of the corrected pixel expansion and contraction becomes 12.5 (=0.375/3)%. In the case where the value of "±m" determined by the magnification information SCA is "±2", the normal pixel of the size Pxy of 3 μm is corrected to have a pixel expansion of 0.75 μm, and the ratio becomes 25 (=0.75/3). )%.
相對於此，若將1像素之尺寸Pxy設為與聚焦光SP之大小φ相同之3μm，且將時脈訊號LTC之振盪頻率Fa設為400MHz之2倍即800MHz，則相對於普通像素對應有16個聚焦光SP(時脈訊號LTC之時脈 脈衝)。因此，若使根據倍率資訊SCA而決定之「±m」之值維持為「±1」，則相對於修正像素對應有16±1個聚焦光SP(時脈訊號LTC之時脈脈衝)。於該情形時，於主掃描方向掃描之聚焦光SP之投射間隔成為0.1875(3×1/16)μm。因此，修正像素於主掃描方向上相對於尺寸Pxy為3μm之普通像素伸縮0.1875μm，其比率成為6.25(=0.1875/3)%。又，於根據倍率資訊SCA而決定之「±m」之值為「±2」之情形時，相對於尺寸Pxy為3μm普通像素，修正像素伸縮0.375μm，其比率成為12.5%。因此，提高時脈訊號LTC之振盪頻率Fa可進行細緻之倍率修正。 On the other hand, when the size Pxy of one pixel is set to be 3 μm which is the same as the size φ of the focused light SP, and the oscillation frequency Fa of the clock signal LTC is set to be twice the 400 MHz, that is, 800 MHz, it corresponds to the normal pixel. 16 focused lights SP (clock of LTC signal LTC) pulse). Therefore, if the value of "±m" determined based on the magnification information SCA is maintained at "±1", 16±1 focused lights SP (clock pulses of the clock signal LTC) are associated with the corrected pixels. In this case, the projection interval of the focused light SP scanned in the main scanning direction is 0.1875 (3 × 1/16) μm. Therefore, the corrected pixel is expanded and contracted by 0.1875 μm with respect to the ordinary pixel having a size Pxy of 3 μm in the main scanning direction, and the ratio thereof becomes 6.25 (= 0.1875/3)%. In the case where the value of "±m" determined based on the magnification information SCA is "±2", the normal pixel of the size Pxy is 3 μm, and the corrected pixel is expanded and contracted by 0.375 μm, and the ratio is 12.5%. Therefore, the oscillation frequency Fa of the clock signal LTC can be improved to perform fine magnification correction.
然而，即便於將振盪頻率Fa自400MHz提高之情形時，亦存在脈衝光產生部20之DFB半導體雷射元件30、32無法以提高後之振盪頻率Fa(例如800MHz)產生脈衝狀之種子光S1、S2之情形。又，於使用能夠以提高後之振盪頻率Fa響應之DFB半導體雷射元件30、32之情形時，存在成本增高之間題。因此，本變形例中係藉由合成以400MHz之振盪頻率Fb產生之射束LB而將聚焦光SP之頻率設為800MHz。 However, even in the case where the oscillation frequency Fa is increased from 400 MHz, the DFB semiconductor laser elements 30, 32 of the pulse light generating portion 20 cannot generate the pulsed seed light S1 with the increased oscillation frequency Fa (for example, 800 MHz). The situation of S2. Further, in the case of using the DFB semiconductor laser elements 30, 32 which can respond with an increased oscillation frequency Fa, there is a problem of an increase in cost. Therefore, in the present modification, the frequency of the focused light SP is set to 800 MHz by synthesizing the beam LB generated at the oscillation frequency Fb of 400 MHz.
再者，本變形例中，將描繪線SLn(SL1~SL6)之有效長度設為30mm，一面將有效大小φ為3μm之聚焦光SP每次重疊15/16、亦即2.8125(=3×15/16)μm，一面將聚焦光SP沿著描繪線SLn(SL1~SL6)照射至基板P上(基板P之被照射面上)。因此，聚焦光SP之投射間隔成為0.1875μm，1次掃描中照射之聚焦光SP之數量成為160000(=30[mm]/0.1875[μm])。又，由於將聚焦光SP之頻率(振盪頻率Fa)設為800MHz，且於1次掃描中照射160000次聚焦光SP，故而沿著描繪線SLn之聚焦光SP之1次掃描所需要之時間Tsp成為200μsec(= 160000[次]/800[MHz])，其掃描速度Vs成為150m/sec(=30[mm]/200[μsec])。又，於副掃描方向上，亦係若聚焦光SP之掃描以0.1875μm之間隔進行，則基板P必須每時間Tpx(=620μsec)行進0.1875μm，因此搬送速度(進給速度)Vt成為約0.3024mm/sec(=0.1875[μm]/620[μsec])。再者，本變形例之多角鏡PM之旋轉速度Vp與上述第1實施形態相同，設為約12096.8rpm。 Further, in the present modification, the effective length of the drawing line SLn (SL1 to SL6) is set to 30 mm, and the focused light SP having the effective size φ of 3 μm is superimposed 15/16, that is, 2.8125 (= 3 × 15). /16) μm, the focused light SP is irradiated onto the substrate P (the illuminated surface of the substrate P) along the drawing line SLn (SL1 to SL6). Therefore, the projection interval of the focused light SP becomes 0.1875 μm, and the number of focused lights SP irradiated in one scan becomes 160,000 (=30 [mm] / 0.1875 [μm]). Further, since the frequency (oscillation frequency Fa) of the focused light SP is set to 800 MHz, and the focused light SP is irradiated 160,000 times in one scan, the time Tsp required for one scan of the focused light SP along the drawing line SLn is performed. Become 200μsec (= 160000 [times] / 800 [MHz]), the scanning speed Vs is 150 m/sec (= 30 [mm] / 200 [μsec]). Further, in the sub-scanning direction, if the scanning of the focused light SP is performed at intervals of 0.1875 μm, the substrate P must travel 0.1875 μm per time Tpx (= 620 μsec), so the transport speed (feed speed) Vt becomes about 0.3024. Mm/sec (= 0.1875 [μm] / 620 [μsec]). In addition, the rotational speed Vp of the polygon mirror PM of the present modification is about 12096.8 rpm as in the first embodiment.
圖17係表示本變形例中之光源裝置LSa(LSb)之構成之圖。再者，對與上述第1實施形態相同之構成標附相同符號，僅對不同之處進行說明。光源裝置LSa(LSb)具有時脈訊號產生部150、2個控制電路152a、152b、2個脈衝光產生部20(以下為20a、20b)、OR閘極部(時脈產生部)GX1、及合成光學構件154。 Fig. 17 is a view showing the configuration of a light source device LSa (LSb) in the present modification. The same components as those in the above-described first embodiment are denoted by the same reference numerals, and only differences will be described. The light source device LSa (LSb) includes a clock signal generation unit 150, two control circuits 152a and 152b, two pulse light generation units 20 (hereinafter referred to as 20a and 20b), an OR gate portion (clock generation unit) GX1, and The optical member 154 is synthesized.
時脈訊號產生部150產生複數個(M個)時脈訊號(第1時脈訊號)CK，其等係於將聚焦光SP之掃描速度設為Vs，將N設為2以上之整數，且將脈衝光產生部20(脈衝光源部35)之數量設為M時，具有由(Pxy×M)/(N×Vs)決定之基準週期Tb，並且每基準週期Tb之1/M之修正時間賦予相位。該M為2以上之整數且小於N之整數。本變形例中，由於每1像素之時脈脈衝(聚焦光SP)之數量N為16，M為2，Pxy為3μm，Vs為150m/sec，因此基準週期Tb=(3μm×2)/(16×150m/sec)=0.0025μsec，其頻率Fb(1/Tc)成為400MHz。又，時脈訊號產生部150產生每基準週期Tb之1/M之修正時間賦予相位之複數個(M個)時脈訊號，因此產生每基準週期Tb之1/2修正時間賦予相位之2個時脈訊號CK。將該2個時脈訊號CK以CKa、CKb表示。亦即，本變形例之時脈訊號產生部150生 成相互間相位偏移半週期之400MHz之時脈訊號CKa、CKb。時脈訊號產生部150所產生(生成)之時脈訊號CKa被輸出至控制電路152a及OR閘極部GX1，時脈訊號CKb被輸出至控制電路152b及OR閘極部GX1。 The clock signal generating unit 150 generates a plurality of (M) clock signals (first clock signals) CK, such as setting the scanning speed of the focused light SP to Vs, and setting N to an integer of 2 or more, and When the number of the pulse light generating unit 20 (pulse light source unit 35) is M, the reference period Tb determined by (Pxy × M) / (N × Vs) and the correction time of 1/M per reference period Tb Give the phase. The M is an integer of 2 or more and less than an integer of N. In the present modification, since the number N of clock pulses (focus light SP) per pixel is 16, M is 2, Pxy is 3 μm, and Vs is 150 m/sec, so the reference period Tb = (3 μm × 2) / ( 16 × 150 m / sec) = 0.0025 μsec, and its frequency Fb (1/Tc) becomes 400 MHz. Further, the clock signal generation unit 150 generates a plurality of (M) clock signals which are given to the phase by the correction time of 1/M of the reference period Tb. Therefore, two correction phases are given for each reference period Tb. Clock signal CK. The two clock signals CK are represented by CKa and CKb. That is, the clock signal generating unit 150 of the present modification is The clock signals CKa and CKb are shifted by 400 MHz in half phase from each other. The clock signal CKa generated (generated) by the clock signal generating unit 150 is output to the control circuit 152a and the OR gate portion GX1, and the clock signal CKb is output to the control circuit 152b and the OR gate portion GX1.
圖18係表示時脈訊號產生部150之構成之圖。時脈訊號產生部150具有時脈產生部60、單擊脈衝產生器LC、2輸入之AND閘極部GX2、GX3、及NOT閘極部GX4。如上述第1實施形態中亦說明般，時脈產生部60產生(生成)與整體倍率修正資訊TMg相應之振盪頻率Fc(週期Tc=1/Fc)之時脈訊號CKs。本變形例中，時脈產生部60係生成於將整體倍率修正資訊TMg設為0且整體倍率修正資訊TMg為0之情形時振盪頻率(發光頻率)Fc為800MHz之時脈訊號CKs。時脈產生部60所產生之時脈訊號CKs被分別輸入至AND閘極部GX1、GX2之一輸入端子及單擊脈衝產生器LC。 FIG. 18 is a view showing the configuration of the clock signal generation unit 150. The clock signal generation unit 150 includes a clock generation unit 60, click gate generators GX2 and GX3 input from the pulse generators LC and 2, and a NOT gate unit GX4. As described in the first embodiment, the clock generation unit 60 generates (generates) the clock signal CKs of the oscillation frequency Fc (period Tc=1/Fc) corresponding to the overall magnification correction information TMg. In the present modification, the clock generation unit 60 generates the clock signal CKs whose oscillation frequency (light emission frequency) Fc is 800 MHz when the overall magnification correction information TMg is set to 0 and the overall magnification correction information TMg is 0. The clock signal CKs generated by the clock generating unit 60 is input to one of the input terminals of the AND gate portions GX1 and GX2, respectively, and the click pulse generator LC.
單擊脈衝產生器LC通常係輸出邏輯值「0」之訊號SDo，但若產生時脈訊號CKs之時脈脈衝，則僅於自時脈脈衝之下降起固定時間Tdp內輸出邏輯值「1」之訊號SDo。亦即，單擊脈衝產生器LC係根據時脈訊號CKs之時脈脈衝之下降而僅於固定時間Tdp內使邏輯值反轉。時間Tdp被設定為Tc<Tdp<2×Tc之關係，較佳為被設定為Tdp≒1.5×Tc。於AND閘極部GX3之另一輸入端子，被輸入有該訊號SDo。於AND閘極部GX2之另一輸入端子，經由NOT閘極部GX4而被輸入有訊號SDo。亦即，於AND閘極部GX2，被輸入有使訊號SDo反轉後之訊號。AND閘極部GX2係基於所輸入之時脈訊號CKs與使訊號SDo之值反轉後之訊號而輸出時脈訊號CKa。AND閘極部GX3係基於所輸入之時脈訊號CKs與訊號SDo而 輸出時脈訊號CKb。因此，AND閘極部GX2僅於訊號SDo之邏輯值為「0」時將所輸入之時脈訊號CKs之時脈脈衝輸出，AND閘極部GX3僅於訊號SDo之邏輯值為「1」時將所輸入之時脈訊號CKs之時脈脈衝輸出。 Clicking the pulse generator LC usually outputs the signal SDo of the logic value "0", but if the clock pulse of the clock signal CKs is generated, the logic value "1" is output only for a fixed time Tdp from the falling of the clock pulse. Signal SDo. That is, the click pulse generator LC inverts the logic value only for a fixed time Tdp according to the falling of the clock pulse of the clock signal CKs. The time Tdp is set to a relationship of Tc < Tdp < 2 × Tc, and is preferably set to Tdp ≒ 1.5 × Tc. The signal SDo is input to the other input terminal of the AND gate portion GX3. A signal SDo is input to the other input terminal of the AND gate portion GX2 via the NOT gate portion GX4. That is, a signal for inverting the signal SDo is input to the AND gate portion GX2. The AND gate portion GX2 outputs the clock signal CKA based on the input clock signal CKs and the signal in which the value of the signal SDo is inverted. The AND gate GX3 is based on the input clock signal CKs and signal SDo Output clock signal CKb. Therefore, the AND gate portion GX2 outputs the clock pulse of the input clock signal CKs only when the logic value of the signal SDo is "0", and the AND gate portion GX3 only when the logic value of the signal SDo is "1" The clock pulse of the input clock signal CKs is output.
圖19係說明圖18之時脈訊號產生部150之動作之時序圖。若於訊號SDo之邏輯值為「0」(低位準)之狀態下，產生時脈訊號CKs之時脈脈衝(將該時脈脈衝稱為第1個時脈脈衝)，則AND閘極部GX3之輸出訊號(時脈訊號CKb)之值成為「0」(低位準)。亦即，AND閘極部GX3不將所輸入之第1個時脈脈衝輸出。另一方面，於訊號SDo之邏輯值為「0」之情形時，藉由NOT閘極部GX4將使訊號SDo之值反轉後之值「1」輸入至AND閘極部GX2，因此AND閘極部GX2之輸出訊號(時脈訊號CKa)之值成為「1」。亦即，AND閘極部GX2將所輸入之第1個時脈脈衝輸出。 Fig. 19 is a timing chart for explaining the operation of the clock signal generating unit 150 of Fig. 18. If the logic value of the signal SDo is "0" (low level), the clock pulse of the clock signal CKs is generated (this clock pulse is referred to as the first clock pulse), and the AND gate portion GX3 The value of the output signal (clock signal CKb) becomes "0" (low level). That is, the AND gate portion GX3 does not output the input first clock pulse. On the other hand, when the logic value of the signal SDo is "0", the value "1" in which the value of the signal SDo is inverted is input to the AND gate portion GX2 by the NOT gate portion GX4, so the AND gate The value of the output signal (clock signal CKA) of the pole GX2 becomes "1". That is, the AND gate portion GX2 outputs the input first clock pulse.
若於訊號SDo之邏輯值「0」之狀態下，產生時脈訊號CKs之時脈脈衝，則單擊脈衝產生器LC僅於自該時脈脈衝之下降起固定時間Tdp內將訊號SDo之邏輯值設為「1」。由於時脈訊號CKs之時脈脈衝係以較時間Tdp短之週期Tc產生，故而於產生下一個(第2個)時脈脈衝之時序，訊號SDo之邏輯值仍為「1」。因此，AND閘極部GX3將所輸入之第2個時脈脈衝輸出，AND閘極部GX2不將第2個時脈脈衝輸出。由於第3個時脈脈衝係於自第1個時脈脈衝之下降起經過固定時間Tdp之後產生，故而於產生第3個時脈脈衝之時序，訊號SDo之邏輯成為「0」。因此，AND閘極部GX3不將所輸入之第3個時脈脈衝輸出，而AND閘極部GX2將所輸入之第3個時脈脈衝輸出。藉由重複此種動作，AND閘極部GX2生成將振盪頻率Fc為800MHz之時脈訊號CKs之時脈脈衝每隔1個予以減省之時 脈訊號CKa，AND閘極部GX3係以相對於時脈訊號CKa相位偏移半週期之方式，生成將振盪頻率Fc為800MHz之時脈訊號CKs之時脈脈衝每隔1個予以減省之時脈訊號CKb。亦即，時脈訊號產生部150將振盪頻率Fc為800MHz之時脈訊號CKs分頻為1/2，且生成了相互間相位偏移半週期之2個時脈訊號CKa、CKb。因此，該時脈訊號CKa、CKb之振盪頻率(發光頻率)Fb成為400MHz。 If the clock pulse of the clock signal CKs is generated in the state of the logic value "0" of the signal SDo, the pulse generator LC is clicked only for the logic of the signal SDo within a fixed time Tdp from the falling of the clock pulse. The value is set to "1". Since the clock pulse of the clock signal CKs is generated in the period Tc shorter than the time Tdp, the logic value of the signal SDo is still "1" at the timing of the next (second) clock pulse. Therefore, the AND gate portion GX3 outputs the input second clock pulse, and the AND gate portion GX2 does not output the second clock pulse. Since the third clock pulse is generated after a fixed time Tdp has elapsed since the fall of the first clock pulse, the logic of the signal SDo becomes "0" at the timing of the third clock pulse. Therefore, the AND gate portion GX3 does not output the input third clock pulse, and the AND gate portion GX2 outputs the input third clock pulse. By repeating such an operation, the AND gate portion GX2 generates a clock pulse of the clock signal CKs having an oscillation frequency Fc of 800 MHz, which is reduced every other time. The pulse signal CKA and the AND gate GX3 are generated by dividing the clock pulse of the clock signal CKs having the oscillation frequency Fc of 800 MHz every other time by shifting the phase of the clock signal CKA by a half cycle. Pulse signal CKb. In other words, the clock signal generation unit 150 divides the clock signal CKs whose oscillation frequency Fc is 800 MHz into 1/2, and generates two clock signals CKa and CKb which are mutually phase-shifted by a half cycle. Therefore, the oscillation frequency (light-emitting frequency) Fb of the clock signals CKa and CKb becomes 400 MHz.
控制電路152a係以響應時脈訊號CKa之各時脈脈衝而發出種子光S1、S2之方式，控制脈衝光產生部20a之脈衝光源部35(具體而言為DFB半導體雷射元件30、32)。藉此，脈衝光產生部20a射出之射束LBa1(LBb1)之頻率成為400MHz。控制電路152b係以響應時脈訊號CKb之各時脈脈衝而發出種子光S1、S2之方式，控制脈衝光產生部20b之脈衝光源部35(具體而言為DFB半導體雷射元件30、32)。藉此，脈衝光產生部20b射出之射束LBa2(LBb2)之頻率成為400MHz，且，射出時序之相位相對於射束LBa1(LBb1)偏移半週期。 The control circuit 152a controls the pulse light source unit 35 (specifically, the DFB semiconductor laser elements 30 and 32) of the pulse light generating unit 20a so as to emit the seed lights S1 and S2 in response to the respective pulse pulses of the clock signal CKA. . Thereby, the frequency of the beam LBa1 (LBb1) emitted from the pulse light generating unit 20a becomes 400 MHz. The control circuit 152b controls the pulse light source unit 35 (specifically, the DFB semiconductor laser elements 30 and 32) of the pulse light generating unit 20b so as to emit the seed lights S1 and S2 in response to the respective pulse pulses of the clock signal CKb. . Thereby, the frequency of the beam LBa2 (LBb2) emitted from the pulse light generating unit 20b is 400 MHz, and the phase of the emission timing is shifted by half a cycle with respect to the beam LBa1 (LBb1).
再者，本變形例中，各脈衝光產生部20a、20b之DFB半導體雷射元件30、32發出之種子光S1、S2係相互間偏光方向正交之直線偏光之光，且，脈衝光產生部20a、20b之DFB半導體雷射元件30彼此及DFB半導體雷射元件32彼此亦係相互間偏光方向正交之直線偏光之光。藉此，自脈衝光產生部20a射出之射束LBa1(LBb1)與自脈衝光產生部20b射出之射束LBa2(LBb2)成為相互直行之直線偏光之光。本變形例中，脈衝光產生部20a之DFB半導體雷射元件30發出之種子光S1及脈衝光產生部20b之DFB半導體雷射元件32發出之種子光S2之偏光狀態均成為S偏光。又， 脈衝光產生部20a之DFB半導體雷射元件32發出之種子光S2及脈衝光產生部20b之DFB半導體雷射元件30發出之種子光S1之偏光狀態均成為P偏光。因此，本變形例中，脈衝光產生部20a射出之射束LBa1(LBb1)成為P偏光之光，脈衝光產生部20b射出之射束LBa2(LBb2)成為S偏光之光。再者，前提在於，脈衝光產生部20a之偏光分光器34使S偏光之光透過且反射P偏光之光，脈衝光產生部20b之偏光分光器34使P偏光之光透過且反射S偏光之光。又，前提在於，脈衝光產生部20a之偏光分光器38使P偏光之光透過且反射S偏光之光，脈衝光產生部20b之偏光分光器38使S偏光之光透過且反射P偏光之光。 Further, in the present modification, the seed lights S1 and S2 emitted from the DFB semiconductor laser elements 30 and 32 of the pulse light generating units 20a and 20b are linearly polarized lights orthogonal to each other in the polarization direction, and pulse light is generated. The DFB semiconductor laser elements 30 and the DFB semiconductor laser elements 32 of the portions 20a and 20b are also linearly polarized lights whose polarization directions are orthogonal to each other. Thereby, the beam LBa1 (LBb1) emitted from the pulse light generating unit 20a and the beam LBa2 (LBb2) emitted from the pulse light generating unit 20b become linearly polarized light that is straight to each other. In the present modification, the polarized state of the seed light S1 emitted from the DFB semiconductor laser element 30 of the pulse light generating unit 20a and the seed light S2 emitted from the DFB semiconductor laser element 32 of the pulse light generating unit 20b is S-polarized. also, The polarization state of the seed light S1 emitted from the seed light S2 emitted from the DFB semiconductor laser element 32 of the pulse light generating unit 20a and the DFB semiconductor laser element 30 of the pulse light generating unit 20b is P-polarized. Therefore, in the present modification, the beam LBa1 (LBb1) emitted from the pulse light generating unit 20a is P-polarized light, and the beam LBa2 (LBb2) emitted from the pulse light generating unit 20b is S-polarized light. In addition, the polarizing beam splitter 34 of the pulsed light generating unit 20a transmits the S-polarized light and reflects the P-polarized light, and the polarizing beam splitter 34 of the pulsed light generating unit 20b transmits the P-polarized light and reflects the S-polarized light. Light. Further, the polarizing beam splitter 38 of the pulsed light generating unit 20a transmits the P-polarized light and reflects the S-polarized light, and the polarizing beam splitter 38 of the pulsed light generating unit 20b transmits the S-polarized light and reflects the P-polarized light. .
OR閘極部GX1係將所輸入之相位相互間偏移半週期之2個時脈訊號CKa、CKb合成而生成(產生)1個時脈訊號(基準時脈訊號)LTC。藉此，時脈訊號LTC之各時脈脈衝(基準時脈脈衝)以800MHz之振盪頻率Fa(週期Ta=1/Fa)產生。再者，由於時脈訊號LTC與時脈訊號產生部150之時脈產生部60所產生之時脈訊號CKs之頻率及相位相同，故而亦可不設置OR閘極部GX1。於該情形時，只要將時脈產生部60所產生之時脈訊號CKs用作時脈訊號LTC即可。 The OR gate portion GX1 synthesizes and generates (generates) one clock signal (reference clock signal) LTC by combining the two clock signals CKa and CKb whose input phases are shifted from each other by a half cycle. Thereby, each clock pulse (reference clock pulse) of the clock signal LTC is generated at an oscillation frequency Fa (cycle Ta = 1/Fa) of 800 MHz. Further, since the clock signal LTC and the clock signal CKs generated by the clock generating unit 60 of the clock signal generating unit 150 have the same frequency and phase, the OR gate portion GX1 may not be provided. In this case, the clock signal CKs generated by the clock generating unit 60 may be used as the clock signal LTC.
又，時脈訊號產生部150亦可為具有時脈產生部60與可變延遲電路(省略圖示)之構成。於該情形時，時脈產生部60係以400MHz之振盪頻率Fc生成(產生)時脈訊號CKs，並且上述可變延遲電路係使時脈訊號CKs延遲時脈訊號CKs之週期Tc(=1/Fc)之1/2。時脈訊號產生部150將時脈產生部60所產生之時脈訊號CKs作為時脈訊號CKa輸出至控制電路152a及OR閘極部GX1，並且將上述可變延遲電路使之延遲1/2週期 Tc後之時脈訊號CKs作為時脈訊號CKb輸出至控制電路152b及OR閘極部GX1。 Further, the clock signal generation unit 150 may have a configuration in which the clock generation unit 60 and the variable delay circuit (not shown) are provided. In this case, the clock generating unit 60 generates (generates) the clock signal CKs at an oscillation frequency Fc of 400 MHz, and the variable delay circuit delays the clock signal CKs by the period Tc of the clock signal CKs (=1/). 1/2 of Fc). The clock signal generating unit 150 outputs the clock signal CKs generated by the clock generating unit 60 as the clock signal CKa to the control circuit 152a and the OR gate portion GX1, and delays the variable delay circuit by 1/2 cycle. The clock signal CKs after Tc is output as the clock signal CKb to the control circuit 152b and the OR gate portion GX1.
雖未圖示，但該時脈訊號LTC經由閘極電路GTa被輸入至與圖9所示為同一構成之修正像素指定部62及送出時序切換部64。本變形例中，基於該800MHz之時脈訊號LTC，指定修正像素，決定描繪位元串資料SBa(SBb)或串列資料DL1~DL3(DL4~DL6)之各像素之邏輯資訊之送出時序、亦即使輸出之邏輯資訊之像素移位之時序、亦即像素移位脈衝SBCa(SBCb)之輸出時序。該修正像素指定部62及送出時序切換部64可設置於光源裝置LSa(LSb)之內部，亦可設置於光源裝置LSa(LSb)之外部。 Although not shown, the clock signal LTC is input to the correction pixel designation unit 62 and the transmission timing switching unit 64 having the same configuration as that shown in FIG. 9 via the gate circuit GTa. In the present modification, the corrected pixel is specified based on the 800 MHz clock signal LTC, and the timing of sending the logical information of each pixel of the bit string data SBa (SBb) or the serial data DL1 to DL3 (DL4 to DL6) is determined. Also, the timing of the pixel shift of the output logical information, that is, the output timing of the pixel shift pulse SBCa (SBCb). The correction pixel specifying unit 62 and the transmission timing switching unit 64 may be provided inside the light source device LSa (LSb) or may be provided outside the light source device LSa (LSb).
而且，根據自該送出時序切換部64輸出之像素移位脈衝BSCa(BSCb)依序輸出之描繪位元串資料SBa(SBb)或串列資料DL1~DL3(DL4~DL6)之各像素之邏輯資訊被輸出至光源裝置LSa(LSb)之脈衝光產生部20a、20b之驅動電路36a。因此，自脈衝光產生部20a、20b射出之射束LBa1(LBb1)、LBa2(LBb2)係其強度基於該描繪位元串資料SBa(SBb)或串列資料DL1~DL3(DL4~DL6)而調變。又，所射出之射束LBa1(LBb1)、LBa2(LBb2)藉由合成光學構件154而合成為1個射束LBa(LBb)。該射束LBa1(LBb1)與射束LBa2(LBb2)係振盪頻率Fb為400MHz而相同，且相位偏移半週期，因此藉由合成光學構件154而合成800MHz之射束LBa(LBb)。因此，該生成之振盪頻率Fa(=800MHz)之射束LBa(LBb)自光源裝置LSa(LSb)射出。 Further, the logic of each pixel of the drawing bit string data SBa (SBb) or the serial data DL1 to DL3 (DL4 to DL6) sequentially outputted from the pixel shift pulse BSCa (BSCb) output from the transmission timing switching unit 64 is sequentially output. The information is output to the drive circuit 36a of the pulse light generating units 20a and 20b of the light source device LSa (LSb). Therefore, the beams LBa1 (LBb1) and LBa2 (LBb2) emitted from the pulsed light generating units 20a and 20b are based on the drawing bit string data SBa (SBb) or the serial data DL1 to DL3 (DL4 to DL6). Modulation. Further, the emitted beams LBa1 (LBb1) and LBa2 (LBb2) are combined into one beam LBa (LBb) by the synthetic optical member 154. Since the beam LBa1 (LBb1) and the beam LBa2 (LBb2) have the same oscillation frequency Fb of 400 MHz and are phase-shifted by a half period, the beam LBA (LBb) of 800 MHz is synthesized by synthesizing the optical member 154. Therefore, the generated beam LBa (LBb) of the oscillation frequency Fa (=800 MHz) is emitted from the light source device LSa (LSb).
合成光學構件154至少具有：偏光分光器PBS，其將脈衝光 產生部20a所射出之P偏光之射束LBa1(LBb1)與脈衝光產生部20b所射出之S偏光之射束LBa2(LBb2)合成；鏡M20、M21，其等將脈衝光產生部20a所射出之射束LBa1(LBb1)引導至偏光分光器PBS；及鏡M22，其將脈衝光產生部20b所射出之射束LBa2(LBb2)引導至偏光分光器PBS。偏光分光器PBS具有使P偏光之光透過且反射S偏光之光之特性，因此使射束LBa1(LBb1)透過，且反射射束LBa2(LBb2)。此時，偏光分光器PBS之偏向分離面配置成，相對於與入射至偏光分光器PBS之射束LBa1(LBb1)之光軸正交之平面傾斜45度，且，相對於與入射至偏光分光器PBS之射束LBa2(LBb2)之光軸正交之平面傾斜45度。藉此，透過偏光分光器PBS之射束LBa1(LBb1)與於偏光分光器反射之射束LBa2(LBb2)成為同軸，因此射束LBa1(LBb1)與射束LBa2(LBb2)合成。 The synthetic optical member 154 has at least: a polarizing beam splitter PBS that will pulse light The P-polarized beam LBa1 (LBb1) emitted from the generating portion 20a is combined with the S-polarized beam LBa2 (LBb2) emitted from the pulsed light generating portion 20b, and the mirrors M20 and M21 are emitted from the pulsed light generating portion 20a. The beam LBa1 (LBb1) is guided to the polarization beam splitter PBS; and the mirror M22 guides the beam LBa2 (LBb2) emitted from the pulse light generating portion 20b to the polarization beam splitter PBS. The polarization beam splitter PBS has a characteristic of transmitting P-polarized light and reflecting S-polarized light, so that the beam LBa1 (LBb1) is transmitted and the beam LBa2 (LBb2) is reflected. At this time, the polarization separation surface of the polarization beam splitter PBS is disposed so as to be inclined by 45 degrees with respect to a plane orthogonal to the optical axis of the beam LBa1 (LBb1) incident on the polarization beam splitter PBS, and is separated from the incident light beam. The plane orthogonal to the optical axis of the beam LBa2 (LBb2) of the PBS is inclined by 45 degrees. Thereby, the beam LBa1 (LBb1) transmitted through the polarization beam splitter PBS and the beam LBa2 (LBb2) reflected by the polarization beam splitter are coaxial, and thus the beam LBa1 (LBb1) and the beam LBa2 (LBb2) are combined.
再者，自光源裝置LSa(LSb)射出之射束LBa(LBb)成為包含P偏光之射束LB1a(LB1b)與S偏光之射束LB2a(LB2b)者，因此亦可省略圖5所示之掃描單元Un內之光學透鏡系統G10、光檢測器DT、及λ/4波長板QW。於該情形時，變得無法檢測描繪線SLn之斜率。又，於欲檢測描繪線SLn之斜率之情形時，將射束LB1a(LB1b)與射束LB2a(LB2b)之偏向狀態藉由偏光板等而均設為相同(例如，直線P偏光或圓偏振光)。而且，合成光學構件154以相互間成為同軸之方式合成該2個射束LB1a(LB1b)、射束LB2a(LB2b)即可。 Further, since the beam LBa (LBb) emitted from the light source device LSa (LSb) is the beam LB1a (LB1b) including the P-polarized light and the beam LB2a (LB2b) of the S-polarized light, the same as shown in FIG. 5 may be omitted. The optical lens system G10, the photodetector DT, and the λ/4 wavelength plate QW in the scanning unit Un. In this case, it becomes impossible to detect the slope of the drawing line SLn. Further, when the slope of the drawing line SLn is to be detected, the deflection state of the beam LB1a (LB1b) and the beam LB2a (LB2b) is set to be the same by a polarizing plate or the like (for example, a straight line P polarization or a circular polarization) Light). Further, the combined optical member 154 may be configured by combining the two beams LB1a (LB1b) and the beam LB2a (LB2b) so as to be coaxial with each other.
如此，本變形例之曝光裝置EX中，光源裝置LSa(LSb)係將由2個脈衝光產生部20(20a、20b)以400MHz發出之射束LBa1(LBb1)、LBa2(LBb2)進行強度調變，並將該經強度調變之射束LBa1(LBb1)、LBa2 (LBb2)合成而作為射束LBa(LBb)射出，因此與上述第1實施形態相比，可進而細緻地修正描繪線SLn(描繪之圖案)之倍率。 As described above, in the exposure apparatus EX of the present modification, the light source device LSa (LSb) is intensity-modulated by the beams LBa1 (LBb1) and LBa2 (LBb2) emitted from the two pulsed light generating units 20 (20a, 20b) at 400 MHz. And the intensity-modulated beam LBa1 (LBb1), LBa2 Since (LBb2) is synthesized and emitted as the beam LBa (LBb), the magnification of the drawing line SLn (pattern to be drawn) can be further finely corrected as compared with the above-described first embodiment.
再者，若射束LBa1(LBb1)、LBa2(LBb2)之每單位面積之強度較強，則與之相應地，會於偏光分光器PBS等產生燒痕。因此，為了降低每單位面積之強度，亦可設置使射束LBa1(LBb1)、LBa2(LBb2)之直徑放大之放大透鏡G20a、G20b、及使經放大之射束LBa1(LBb1)、LBa2(LBb2)為平行光之準直透鏡CL20a、CL20b。又，參照符號160係包含用以將經合成之射束LBa(LBb)引導至射束輪廓分析儀162之反射鏡等的光導光構件。該光導光構件160係以於射束輪廓分析儀162之測量面上射束LBa(LBb)成為聚焦光之方式將射束LBa(LBb)聚光(收斂)。射束輪廓分析儀162高精度地測量經聚光之射束LBa(LBb)之聚焦光之二維之光強度分佈。藉此，可精密地測量經合成之射束LBa(LBb)之射束LBa1(LBb1)與射束LBa2(LBb2)之同軸性。該光導光構件160構成為可藉由反射鏡之移動等而自射束LBa(LBb)之光軸位置(光路)退避。 In addition, when the intensity per unit area of the beams LBa1 (LBb1) and LBa2 (LBb2) is strong, burn marks are generated in the polarization beam splitter PBS or the like. Therefore, in order to reduce the intensity per unit area, it is also possible to provide amplification lenses G20a, G20b for amplifying the diameters of the beams LBa1 (LBb1) and LBa2 (LBb2), and to make the amplified beams LBa1 (LBb1), LBa2 (LBb2) ) is collimating lenses CL20a, CL20b of parallel light. Further, reference numeral 160 includes a light guiding member for guiding the synthesized beam LBa (LBb) to a mirror or the like of the beam profile analyzer 162. The light guiding member 160 condenses (converges) the beam LBa (LBb) so that the beam LBa (LBb) becomes focused light on the measuring surface of the beam profile analyzer 162. The beam profile analyzer 162 measures the two-dimensional light intensity distribution of the focused light of the concentrated beam LBa (LBb) with high precision. Thereby, the coaxiality of the beam LBa1 (LBb1) of the combined beam LBa (LBb) and the beam LBa2 (LBb2) can be precisely measured. The light guiding member 160 is configured to be retractable from the optical axis position (optical path) of the beam LBa (LBb) by the movement of the mirror or the like.
又，本變形例中係相對於1像素對應有16個聚焦光SP(時脈訊號LTC之時脈脈衝)，但亦可相對於1像素對應有8個聚焦光SP(時脈訊號LTC之時脈脈衝)。若聚焦光SP之投射間隔與本變形例與同樣地設為0.1875μm，則8個聚焦光SP對應1像素，因此1像素之尺寸Pxy成為1.5(=0.1875×8)μm。因此，於該情形時，聚焦光SP之大小φ亦設為與尺寸Pxy相同程度以下之大小、亦即1.5μm以下。即便於該情形時，亦可獲得與本變形例同樣之效果，並且可減小像素之尺寸，因此可將圖案之解像度、解析度飛躍性地精細化，從而可描繪曝光更高精細之圖案。 Further, in the present modification, 16 focused lights SP (clock pulses of the clock signal LTC) are associated with one pixel, but eight focused lights SP may be associated with one pixel (the timing of the pulse signal LTC) Pulse pulse). When the projection interval of the focused light SP is 0.1875 μm in the same manner as in the present modification, the eight focused lights SP correspond to one pixel, and therefore the size Pxy of one pixel is 1.5 (=0.1875×8) μm. Therefore, in this case, the size φ of the focused light SP is also equal to or smaller than the size Pxy, that is, 1.5 μm or less. That is, in this case, the same effect as in the present modification can be obtained, and the size of the pixel can be reduced. Therefore, the resolution and resolution of the pattern can be dramatically refined, and a pattern with higher exposure can be drawn.
像素之尺寸Px與尺寸Py係設為相同長度(例如3μm)，但亦可使尺寸Px與尺寸Py之長度不同。關鍵在於，只要時脈訊號產生部150產生具有由(Py×M)/(N×Vs)決定之基準週期Tb並且每基準週期Tb之1/M之修正時間賦予相位之複數個(M個)時脈訊號(第1時脈訊號)CK即可。 The size Px of the pixel and the size Py are set to be the same length (for example, 3 μm), but the length Px may be different from the length of the size Py. The key point is that the clock signal generation unit 150 generates a plurality of (M) phases having a reference period Tb determined by (Py × M) / (N × Vs) and a correction time of 1/M per reference period Tb. The clock signal (1st clock signal) CK can be used.
[第2實施形態] [Second Embodiment]
其次，對第2實施形態進行說明。上述第1實施形態(亦包含變形例)中，將主掃描方向上之聚焦光SP之投射間隔設為固定，藉由局部地變更修正像素之每1像素之聚焦光SP(時脈訊號LTC之時脈脈衝)之數量，而使描繪線SLn之掃描長度伸縮。相對於此，本第2實施形態中，每1像素之聚焦光SP(時脈訊號LTC之時脈脈衝)之數量全部設為相同，藉由局部地變更主掃描方向上之聚焦光SP之投射間隔，而使描繪線SLn之掃描長度伸縮。 Next, a second embodiment will be described. In the first embodiment (including the modified example), the projection interval of the focused light SP in the main scanning direction is fixed, and the focused light SP per pixel of the corrected pixel is locally changed (the clock signal LTC) The number of clock pulses) is such that the scan length of the drawing line SLn is stretched. On the other hand, in the second embodiment, the number of focused lights SP (clock pulses of the pulse signal LTC) per pixel is set to be the same, and the projection of the focused light SP in the main scanning direction is locally changed. The interval is made to stretch the scan length of the drawing line SLn.
再者，於本第2實施形態中，將描繪線SLn(SL1~SL6)之有效長度設為30mm，將聚焦光SP之大小φ設為3μm，原則上將主掃描方向上之聚焦光SP之投射間隔設為聚焦光SP之大小φ之1/2、亦即1.5μm。因此，1次掃描中所照射之聚焦光SP之數量成為20000(=30[mm]/1.5[μm])。又，若將基板P之副掃描方向之進給速度(搬送速度)Vt設為2.419mm/sec，於副掃描方向上亦以1.5μm之間隔進行聚焦光SP之掃描，則沿著描繪線SLn之1次掃描開始(描繪開始)時點與下一掃描開始時點之時間差Tpx成為約620μsec(=1.5[μm]/2.419[mm/sec])。該時間差Tpx係8反射面RP之多角鏡PM旋轉1面(45度=360度/8)之時間。 於該情形時，必須以多角鏡PM之1旋轉之時間成為約4.96msec(=8×620[μsec])之方式設定，因此多角鏡PM之旋轉速度Vp被設定為每秒約201.613旋轉(=1/4.96[msec])、即約12096.8rpm。 In the second embodiment, the effective length of the drawing line SLn (SL1 to SL6) is 30 mm, and the size φ of the focused light SP is 3 μm. In principle, the focused light SP in the main scanning direction is used. The projection interval is set to 1/2 of the size φ of the focused light SP, that is, 1.5 μm. Therefore, the number of focused lights SP irradiated in one scan becomes 20,000 (=30 [mm] / 1.5 [μm]). In addition, when the feed rate (transport speed) Vt of the substrate P in the sub-scanning direction is 2.419 mm/sec, and the scanning of the focused light SP is performed at intervals of 1.5 μm in the sub-scanning direction, the scanning line SLn is along the drawing line SLn. The time difference Tpx between the start of the first scanning start (the start of drawing) and the point of the next scanning start is about 620 μsec (=1.5 [μm] / 2.419 [mm/sec]). This time difference Tpx is the time when the polygon mirror PM of the 8 reflecting surface RP is rotated by one surface (45 degrees = 360 degrees / 8). In this case, it is necessary to set the rotation time of the polygon mirror PM 1 to about 4.96 msec (= 8 × 620 [μsec]), so the rotational speed Vp of the polygon mirror PM is set to be about 201.613 rotations per second (= 1/4.96 [msec]), that is, about 12096.8 rpm.
又，將多角鏡PM之反射面之數量Np設為8，將其掃描效率設為1/3。因此，將聚焦光SP掃描描繪線SLn之最大掃描長度(例如31mm)所需要之時間Ts成為Ts=Tpx×掃描效率，於上文之數值例之情形時，時間Ts成為約206.666…μsec(620[μsec]/3)。由於將描繪線SLn(SL1~SL6)不伸縮之情形(倍率為1倍之情形)之有效掃描長度設為30mm，故而沿著該描繪線SLn之聚焦光SP之1掃描之掃描時間Tsp成為約200μsec(=206.666…[μsec]×30[mm]/31[mm])。因此，於描繪線SLn不伸縮之情形時，於該時間Tsp之期間，必須照射20000之聚焦光SP(脈衝光)，因此來自光源裝置LS之射束LB之發光頻率(振盪頻率)Fe成為Fe≒20000[次]/200[μsec]=100MHz。又，聚焦光SP之掃描速度Vs成為30[mm]/200[μsec]=150m/sec。再者，本第2實施形態中，將1像素之尺寸Pxy設為與聚焦光SP之有效大小φ相同之3μm，相對於1像素對應有2個聚焦光SP(時脈訊號LTC之時脈脈衝)。 Further, the number Np of reflection surfaces of the polygon mirror PM is set to 8, and the scanning efficiency is set to 1/3. Therefore, the time Ts required for the maximum scanning length (for example, 31 mm) of the focused light SP scanning drawing line SLn becomes Ts = Tpx × scanning efficiency, and in the case of the numerical example above, the time Ts becomes about 206.666 ... μsec (620 [μsec]/3). Since the effective scanning length of the case where the drawing line SLn (SL1 to SL6) is not stretched (the magnification is 1 time) is set to 30 mm, the scanning time Tsp of the scanning of the focused light SP along the drawing line SLn becomes about 200 μsec (=206.666...[μsec]×30 [mm]/31 [mm]). Therefore, when the drawing line SLn is not stretched, it is necessary to irradiate the focused light SP (pulsed light) of 20,000 during the time Tsp, so that the light-emitting frequency (oscillation frequency) Fe of the beam LB from the light source device LS becomes Fe. ≒20000 [times] / 200 [μsec] = 100 MHz. Further, the scanning speed Vs of the focused light SP is 30 [mm] / 200 [μsec] = 150 m / sec. Further, in the second embodiment, the size Pxy of one pixel is set to be 3 μm which is the same as the effective size φ of the focused light SP, and two focused lights SP are associated with one pixel (the pulse pulse of the clock signal LTC) ).
圖20係表示第2實施形態中之設置於光源裝置LSa(LSb)之內部之訊號產生部22a之構成的圖。再者，對於與上述第1實施形態(亦包含變形例)相同之構成標附相同符號，僅說明不同之部分。該訊號產生部22a係與上述第1實施形態同樣地，設置於控制電路22之內部，但亦可設置於控制電路22之外部。又，亦可於光源裝置LSa(LSb)之外部設置該訊號產生部22a。又，本第2實施形態中，自圖12所示之局部倍率設定部 112將具有修正位置資訊Nv'與伸縮資訊(極性資訊)POL'之局部倍率修正資訊CMgn'送至訊號產生部22a。該局部倍率設定部112係針對每個掃描單元Un(U1~U6)而記憶局部倍率修正資訊CMgn'(CMg1'~CMg6')。局部倍率設定部112係與上述第1實施形態同樣地，將與進行聚焦光SP之掃描之掃描單元Un對應之局部倍率修正資訊CMgn'輸出至光源裝置LS(LSa、LSb)之訊號產生部22a。再者，局部倍率修正資訊CMgn'係用以進行局部倍率修正之資訊。 Fig. 20 is a view showing the configuration of the signal generating unit 22a provided inside the light source device LSa (LSb) in the second embodiment. The same components as those in the first embodiment (including the modifications) are denoted by the same reference numerals, and only the different parts will be described. The signal generating unit 22a is provided inside the control circuit 22 as in the first embodiment, but may be provided outside the control circuit 22. Further, the signal generating portion 22a may be provided outside the light source device LSa (LSb). Further, in the second embodiment, the local magnification setting unit shown in Fig. 12 The local magnification correction information CMgn' having the corrected position information Nv' and the telescopic information (polarity information) POL' is sent to the signal generating unit 22a. The local magnification setting unit 112 stores the local magnification correction information CMgn' (CMg1' to CMg6') for each of the scanning units Un (U1 to U6). Similarly to the above-described first embodiment, the local magnification setting unit 112 outputs the partial magnification correction information CMgn' corresponding to the scanning unit Un that scans the focused light SP to the signal generation unit 22a of the light source device LS (LSa, LSb). . Furthermore, the local magnification correction information CMgn' is used to perform local magnification correction information.
訊號產生部22a具有時脈訊號產生部200、修正點指定部202、及時脈切換部204。該時脈訊號產生部200、修正點指定部202、及時脈切換部204等可藉由FPGA(Field Programmable Gate Array)彙集而構成。時脈訊號產生部200生成具有較由φ/Vs決定之週期短之基準週期Te並且每基準週期Te之1/N之修正時間賦予相位差之複數個(N個)時脈訊號CKp(p=0、1、2、…、N-1)。φ係聚焦光SP之有效大小，Vs係聚焦光SP相對於基板P之主掃描方向之相對速度。再者，於基準週期Te較由φ/Vs決定之週期長之情形時，沿主掃描方向照射之聚焦光SP隔開特定之間隔而離散地照射至基板P之被照射面上。相反地，於基準週期Te較由φ/Vs決定之週期短之情形時，聚焦光SP以於主掃描方向上相互重疊之方式照射至基板P之被照射面上。本第2實施形態中，原則上係以聚焦光SP每次重疊大小φ之1/2之方式照射振盪頻率Fe為100MHz之脈衝狀之聚焦光SP，因此基準週期Te成為1/Fe=1/100[MHz]=10[nsec]，而成為小於φ/Vs=3[μm]/150[mm/sec]=20nsec之值。又，由於設為N=50，故而時脈訊號產生部200生成被賦予0.2nsec(=10[nsec]/50)之相位差之50個時脈訊號CK0 ~CK49。 The signal generation unit 22a includes a clock signal generation unit 200, a correction point designation unit 202, and a time pulse switching unit 204. The clock signal generation unit 200, the correction point designation unit 202, the time-series switching unit 204, and the like can be configured by an FPGA (Field Programmable Gate Array). The clock signal generation unit 200 generates a plurality of (N) clock signals CK p (p) having a reference period Te shorter than the period determined by φ/Vs and a correction time of 1/N per reference period Te. =0, 1, 2, ..., N-1). φ is the effective size of the focused light SP, and Vs is the relative speed of the focused light SP with respect to the main scanning direction of the substrate P. Further, when the reference period Te is longer than the period determined by φ/Vs, the focused light SP irradiated in the main scanning direction is discretely irradiated onto the illuminated surface of the substrate P at a predetermined interval. On the other hand, when the reference period Te is shorter than the period determined by φ/Vs, the focused light SP is irradiated onto the illuminated surface of the substrate P so as to overlap each other in the main scanning direction. In the second embodiment, in principle, the focused light SP having the oscillation frequency Fe of 100 MHz is irradiated so that the focused light SP is overlapped by 1/2 of the size φ, so that the reference period Te becomes 1/Fe=1/ 100 [MHz] = 10 [nsec], and becomes a value smaller than φ / Vs = 3 [μm] / 150 [mm / sec] = 20 nsec. Further, since N = 50, the clock signal generating unit 200 generates 50 clock signals CK 0 to CK 49 which are given a phase difference of 0.2 nsec (= 10 [nsec] / 50).
具體而言，時脈訊號產生部200具有時脈產生部(振盪器)60、與複數個(N-1個)延遲電路De(De01~De49)。時脈產生部60產生由以與整體倍率修正資訊TMg相應之振盪頻率Fe(=1/Te)振盪之時脈脈衝構成之時脈訊號CK0。本第2實施形態中，將整體倍率修正資訊TMg設為0，時脈產生部60以100MHz之振盪頻率Fe(基準週期Te=10nsec)產生時脈訊號CK0。 Specifically, the clock signal generation unit 200 includes a clock generation unit (oscillator) 60 and a plurality of (N-1) delay circuits De (De01 to De49). The clock generation unit 60 generates a clock signal CK 0 composed of a clock pulse oscillating at an oscillation frequency Fe (=1/Te) corresponding to the overall magnification correction information TMg. In the second embodiment, the overall magnification correction information TMg is set to 0, and the clock generation unit 60 generates the clock signal CK 0 at an oscillation frequency Fe (reference period Te = 10 nsec) of 100 MHz.
來自時脈產生部60之時脈訊號(輸出訊號)CK0被輸入至串聯地連接之複數個延遲電路De(De01~De49)之初段(開端)之延遲電路De0，並且被輸入至時脈切換部204之第1個輸入端子。該延遲電路De(De01~De049)使作為輸入訊號之時脈訊號CKp延遲固定時間(Te/N=0.2nsec)後輸出。因此，初段之延遲電路De01將為與時脈產生部60所產生之時脈訊號CK0相同之基準週期Te(10nsec)且相對於時脈訊號CK0具有0.2nsec之延遲之時脈訊號(輸出訊號)CK1輸出。同樣地，第2段延遲電路De02將為與來自前段之延遲電路De01之時脈訊號(輸出訊號)CK1相同之基準週期Te(10nsec)且相對於時脈訊號CK1具有0.2nsec之延遲之時脈訊號(輸出訊號)CK2輸出。第3段以後之延遲電路De03~De49亦同樣地，將為與來自前段之延遲電路De02~De48之時脈訊號(輸出訊號)CK2~CK48相同之基準週期Te(10nsec)且相對於時脈訊號CK2~CK48具有0.2nsec之延遲之時脈訊號(輸出訊號)CK3~CK49輸出。 The clock signal (output signal) CK 0 from the clock generating unit 60 is input to the delay circuit De0 of the first stage (starting end) of the plurality of delay circuits De (De01 to De49) connected in series, and is input to the clock switching. The first input terminal of the portion 204. The delay circuit De (De01 to De049) delays the clock signal CK p as an input signal by a fixed time (Te/N = 0.2 nsec) and outputs it. Therefore, the initial stage delay circuit De01 will be the same reference period Te (10 nsec) as the clock signal CK 0 generated by the clock generation unit 60 and have a delay of 0.2 nsec with respect to the clock signal CK 0 (output Signal) CK 1 output. Similarly, the second stage delay circuit De02 will have the same reference period Te (10 nsec) as the clock signal (output signal) CK 1 from the previous stage delay circuit De01 and have a delay of 0.2 nsec with respect to the clock signal CK 1 . Clock signal (output signal) CK 2 output. Similarly, the delay circuits De03 to De49 after the third stage will be the same reference period Te (10 nsec) as the clock signals (output signals) CK 2 to CK 48 from the delay circuits De02 to De48 of the previous stage, and with respect to the time. The pulse signals CK 2 to CK 48 have a clock signal (output signal) CK 3 to CK 49 output with a delay of 0.2 nsec.
時脈訊號CK0~CK49係每0.2nsec被賦予相位差之訊號，因此時脈訊號CK0成為呈與時脈訊號CK49相同之基準週期Te(10nsec)且相 對於時脈訊號CK49進而具有0.2nsec之延遲之時脈訊號、即恰好偏移1週期之訊號。因此，時脈訊號CK0可視為實質上相對於時脈訊號CK49之各時脈脈衝延遲0.2nsec之時脈訊號。來自延遲電路De01~De49之時脈訊號CK1~CK49被輸入至時脈切換部204之第2個~第50個輸入端子。 The clock signal CK 0 ~ CK 49 lines per 0.2nsec phase difference is given of signals, so the clock signal CK becomes 0 when correlated with the reference clock signal CK 49 the same period Te (10nsec) with respect to the clock signal CK 49 and further A clock signal with a delay of 0.2 nsec, that is, a signal that is exactly shifted by one cycle. Therefore, the clock signal CK 0 can be regarded as a clock signal that is substantially delayed by 0.2 nsec with respect to each clock pulse of the clock signal CK 49 . The clock signals CK 1 to CK 49 from the delay circuits De01 to De49 are input to the second to 50th input terminals of the clock switching unit 204.
各延遲電路De(De01~De49)例如使用如圖21A或圖21B所示之閘極電路(邏輯電路)。圖21A中係由一輸入端子In1被輸入有輸入訊號(時脈訊號CKp)且另一輸入端子In2被施加有高位準(邏輯值為1)之訊號之AND閘極電路GT10所構成。藉由該AND閘極電路GT10，將相對於輸入訊號(時脈訊號CKp)具有0.2nsec之延遲之輸出訊號(時脈訊號CKp+1)輸出。又，圖21B中係由一輸入端子In1被輸入有輸入訊號(時脈訊號CKp)且另一輸入端子In2被施加有低位準(邏輯值為0)之訊號之OR閘極電路GT11所構成。藉由該OR閘極電路GT11，將相對於輸入訊號(時脈訊號CKp)具有0.2nsec之延遲之輸出訊號(時脈訊號CKp+1)輸出。如此，各延遲電路De(De01~De49)可藉由以複數個電晶體組成之閘極電路(邏輯電路)而獲得所需之延遲時間，或亦可為將1~2個電晶體連接而成之簡單之構成。 Each of the delay circuits De (De01 to De49) uses, for example, a gate circuit (logic circuit) as shown in FIG. 21A or FIG. 21B. FIG. 21A is a line input terminal In1 is input to an input signal (clock signal CK p) and the other input terminal of the AND gate circuit In2 GT10 is applied with the high level (logical value 1) is constituted of the signal. An output signal (clock signal CK p+1 ) having a delay of 0.2 nsec with respect to the input signal (clock signal CK p ) is output by the AND gate circuit GT10. And, FIG. 21B, a line from the input terminal In1 is input to an input signal (clock signal CK p) and the other input terminal of the OR gate circuit In2 GT11 is applied with the low level (logical value 0) of the signal is composed of . An output signal (clock signal CK p+1 ) having a delay of 0.2 nsec with respect to the input signal (clock signal CK p ) is output by the OR gate circuit GT11. In this way, each of the delay circuits De (De01 to De49) can obtain a desired delay time by using a gate circuit (logic circuit) composed of a plurality of transistors, or can also connect one or two transistors. The simple composition.
時脈切換部204係選擇所輸入之50個時脈訊號CKp(CK0~CK49)中之任一個時脈訊號CKp並將所選擇之時脈訊號CKp作為時脈訊號(基準時脈訊號)LTC輸出之多工器(選擇電路)。因此，時脈訊號LTC之振盪頻率Fa(=1/Ta)原則上與時脈訊號CK0~CK49之振盪頻率Fe(=1/Ta)亦即100MHz相同。控制電路22係以響應自時脈切換部204輸出之時脈訊號LTC之各時脈脈衝而發出種子光S1、S2之方式控制DFB半導體雷射元 件30、32。因此，自光源裝置LSa(LSb)射出之脈衝狀之射束LBa(LBb)之振盪頻率Fa原則上成為100MHz。 When any of the input lines 204 to select the clock switching unit 50 the clock signal CK p (CK 0 ~ CK 49 ) are of a clock signal CK p and the selected clock signal as a clock signal CK p (reference Pulse signal) LTC output multiplexer (select circuit). Therefore, the oscillation frequency Fa (=1/Ta) of the clock signal LTC is in principle the same as the oscillation frequency Fe (=1/Ta) of the clock signals CK 0 to CK 49 , that is, 100 MHz. The control circuit 22 controls the DFB semiconductor laser elements 30 and 32 in such a manner as to emit the seed lights S1 and S2 in response to the respective pulse pulses of the clock signal LTC output from the clock switching unit 204. Therefore, the oscillation frequency Fa of the pulsed beam LBa (LBb) emitted from the light source device LSa (LSb) is, in principle, 100 MHz.
時脈切換部204係於聚焦光SP通過位於掃描線上之特定之修正點CPP之時點將作為時脈訊號LTC輸出之時脈訊號CKp、亦即因射束LBa(LBb)之產生而引起之時脈訊號CKp切換為相位差不同之另一時脈訊號CKp。時脈切換部204係於聚焦光SP通過修正點CPP之時點將選擇作為時脈訊號LTC之時脈訊號CKp切換為相對於當前選擇作為時脈訊號LTC之時脈訊號CKp具有0.2nsec之相位差之時脈訊號CKp±1。該切換時脈訊號CKp±1之相位差之方向、亦即相位延遲0.2nsec之方向或相位提前0.2nsec之方向係根據作為局部倍率修正資訊(修正資訊)CMgn'(CMg1'~CMg6')之一部分的1位元之伸縮資訊(極性資訊)POL'而決定。 The clock switching unit 204 causes the clock signal CK p outputted as the clock signal LTC, that is, due to the generation of the beam LBa (LBb), when the focused light SP passes through the specific correction point CPP located on the scanning line. The clock signal CK p is switched to another clock signal CK p having a different phase difference. The clock switching unit 204 based on the focused light SP is selected as the clock signal LTC clock signal CK p point switch through the fixed points of the CPP with respect 0.2nsec of the currently selected as the clock signal of the clock signal CK p LTC is The phase difference signal is CK p±1 . The direction of the phase difference of the switching clock signal CK p±1 , that is, the direction of the phase delay of 0.2 nsec or the phase advance of 0.2 nsec is based on the local magnification correction information (correction information) CMgn'(CMg1'~CMg6'). A part of the 1-bit telescopic information (polar information) POL' is determined.
於伸縮資訊POL'為高位準「1」(伸長)之情形時，時脈切換部204選擇相對於當前作為時脈訊號LTC輸出之時脈訊號CKp相位延遲0.2nsec之時脈訊號CKp+1作為時脈訊號LTC而輸出。又，於伸縮資訊POL'為低位準「0」(縮小)之情形時，時脈切換部204選擇相對於當前作為時脈訊號LTC輸出之時脈訊號CKp相位提前0.2nsec之時脈訊號CKp-1作為時脈訊號LTC而輸出。例如，時脈切換部204係在當前作為時脈訊號LTC輸出之時脈訊號CKp為CK11的情況下，於伸縮資訊POL'為高位準(H)之情形時，將作為時脈訊號LTC輸出之時脈訊號CKp切換為時脈訊號CK12，於伸縮資訊POL'為低位準(L)之情形時，將作為時脈訊號LTC輸出之時脈訊號CKp切換為時脈訊號CK10。於聚焦光SP之1次掃描期間中，輸入同一伸縮資訊POL'。 Information to the telescopic POL 'when at the high level "1" (elongation) of the case, the clock switching unit 204 selects the output of the current with respect to the clock signal as a clock signal CK p LTC phase delay of the clock signal CK p + 0.2nsec 1 is output as the clock signal LTC. In addition, the telescopic information POL 'at a low level "0" (narrowing) of the case, the clock switching unit 204 selects the phase of the clock signal output for the current LTC as the clock signal CK p phase advance of the clock signal CK 0.2nsec P-1 is output as the clock signal LTC. For example, when the clock signal CK p currently outputted as the clock signal LTC is CK 11 , when the telescopic information POL′ is at the high level (H), the clock switching unit 204 will be used as the clock signal LTC. The output clock signal CK p is switched to the clock signal CK 12 , and when the telescopic information POL ' is low level (L), the clock signal CK p outputted as the clock signal LTC is switched to the clock signal CK 10 . During the one-scan period of the focused light SP, the same telescopic information POL' is input.
時脈切換部204係使用與藉由射束切換部BDU而射束LBn入射之掃描單元Un對應之局部倍率修正資訊CMgn'之伸縮資訊POL'來決定作為時脈訊號LTC輸出之時脈訊號CKp之相位偏移之方向(相位提前之方向或延遲之方向)。來自光源裝置LSa之射束LBa(LB1~LB3)被引導至掃描單元U1~U3之任一個。因此，光源裝置LSa之訊號產生部22a之時脈切換部204係基於與掃描單元U1~U3中之射束LBn入射之1個掃描單元Un對應之局部倍率修正資訊CMgn'之伸縮資訊POL'，而決定作為時脈訊號LTC被輸出之時脈訊號CKp之相位偏移之方向。例如，於射束LB2入射至掃描單元U2之情形時，光源裝置LSa之時脈切換部204基於與掃描單元U2對應之局部倍率修正資訊CMg2'之伸縮資訊POL'，而決定作為時脈訊號LTC被輸出之時脈訊號CKp之相位偏移之方向。 The clock switching unit 204 determines the clock signal CK outputted as the clock signal LTC using the telescopic information POL' of the local magnification correction information CMgn' corresponding to the scanning unit Un in which the beam LBn is incident by the beam switching unit BDU. The direction of the phase shift of p (the direction of phase advance or the direction of delay). The beams LBa (LB1 to LB3) from the light source device LSa are guided to any one of the scanning units U1 to U3. Therefore, the clock switching unit 204 of the signal generating unit 22a of the light source device LSa is based on the stretching information POL' of the partial magnification correction information CMgn' corresponding to one scanning unit Un in which the beam LBn of the scanning units U1 to U3 is incident. The direction of the phase offset of the clock signal CK p outputted as the clock signal LTC is determined. For example, when the beam LB2 is incident on the scanning unit U2, the clock switching unit 204 of the light source device LSa determines the clock signal LTC based on the telescopic information POL' of the local magnification correction information CMg2' corresponding to the scanning unit U2. The direction of the phase offset of the output clock signal CK p .
又，來自光源裝置LSb之射束LBb(LB4~LB6)被引導至掃描單元U4~U6之任一個。因此，光源裝置LSb之訊號產生部22a之時脈切換部204係基於與掃描單元U4~U6中之射束LBn入射之1個掃描單元Un對應之局部倍率修正資訊CMgn'之伸縮資訊POL'，而決定作為時脈訊號LTC被輸出之時脈訊號CKp之相位偏移之方向。例如，於射束LB6入射至掃描單元U6之情形時，光源裝置LSb之時脈切換部204基於與掃描單元U6對應之局部倍率修正資訊CMg6'之伸縮資訊POL'，而決定作為時脈訊號LTC被輸出之時脈訊號CKp之相位偏移之方向。 Further, the beam LBb (LB4 to LB6) from the light source device LSb is guided to any one of the scanning units U4 to U6. Therefore, the clock switching unit 204 of the signal generating unit 22a of the light source device LSb is based on the stretching information POL' of the local magnification correction information CMgn' corresponding to one scanning unit Un in which the beam LBn of the scanning units U4 to U6 is incident. The direction of the phase offset of the clock signal CK p outputted as the clock signal LTC is determined. For example, when the beam LB6 is incident on the scanning unit U6, the clock switching unit 204 of the light source device LSb determines the clock signal LTC based on the telescopic information POL' of the local magnification correction information CMg6' corresponding to the scanning unit U6. The direction of the phase offset of the output clock signal CK p .
修正點指定部202將各描繪線SLn(SL1~SL6)上之特定之點指定為修正點CPP。修正點指定部202係基於作為局部倍率修正資訊(修正資訊)CMgn'(CMg1'~CMg6')之一部分之用以指定修正點CPP之修正位 置資訊(設定值)Nv'而指定修正點CPP。該局部倍率修正資訊CMgn'之修正位置資訊Nv'係用以按照沿描繪線SLn描繪之圖案之描繪倍率(或描繪線SLn之主掃描方向上之倍率)而於描繪線SLn上之等間隔地離散之複數個位置之各者指定修正點CPP之資訊，且係表示修正點CPP與修正點CPP之距離間隔(等間隔)之資訊。藉此，修正點指定部202可將於描繪線SLn(SL1~SL6)上呈等間隔離散地配置之位置指定為修正點CPP。該修正點CPP被設定於沿描繪線SLn投射之相鄰2個聚焦光SP之投射位置(聚焦光SP之中心位置)之間。 The correction point designation unit 202 specifies a specific point on each of the drawing lines SLn (SL1 to SL6) as the correction point CPP. The correction point specifying unit 202 specifies the correction bit of the correction point CPP based on a part of the partial magnification correction information (correction information) CMgn' (CMg1' to CMg6'). Set the information (set value) Nv' and specify the correction point CPP. The corrected position information Nv' of the local magnification correction information CMgn' is used to equally spaced the drawing line SLn according to the drawing magnification of the pattern drawn along the drawing line SLn (or the magnification in the main scanning direction of the drawing line SLn) Each of the discrete plurality of positions specifies the information of the correction point CPP, and is information indicating the distance (equal interval) between the correction point CPP and the correction point CPP. Thereby, the correction point specifying unit 202 can designate the position at which the drawing lines SLn (SL1 to SL6) are discretely arranged at equal intervals as the correction point CPP. The correction point CPP is set between the projection positions of the adjacent two focused lights SP projected along the drawing line SLn (the center position of the focused light SP).
修正點指定部202係使用與藉由射束切換部BDU而射束LBn入射之掃描單元Un對應之局部倍率修正資訊CMgn'之修正位置資訊Nv'來指定修正點CPP。由於來自光源裝置LSa之射束LBa(LB1~LB3)被引導至掃描單元U1~U3之任一個，故而光源裝置LSa之訊號產生部22a之修正點指定部202基於與掃描單元U1~U3中之射束LBn入射之1個掃描單元Un對應之局部倍率修正資訊CMgn'之修正位置資訊Nv'而指定修正點CPP。例如，於射束LB2入射至掃描單元U2之情形時，光源裝置LSa之修正點指定部202基於與掃描單元U2對應之局部倍率修正資訊CMg2'之修正位置資訊Nv'，將於描繪線SLn2上呈等間隔離散地配置之複數個位置指定為修正點CPP。 The correction point designation unit 202 specifies the correction point CPP using the correction position information Nv' of the local magnification correction information CMgn' corresponding to the scanning unit Un in which the beam LBn is incident by the beam switching unit BDU. Since the beam LBa (LB1 to LB3) from the light source device LSa is guided to any one of the scanning units U1 to U3, the correction point specifying portion 202 of the signal generating portion 22a of the light source device LSa is based on the scanning unit U1 to U3. The correction point CPP is specified by the correction position information Nv' of the local magnification correction information CMgn' corresponding to one scanning unit Un incident on the beam LBn. For example, when the beam LB2 is incident on the scanning unit U2, the correction point specifying unit 202 of the light source device LSa is based on the corrected position information Nv' of the local magnification correction information CMg2' corresponding to the scanning unit U2, and will be on the drawing line SLn2. A plurality of positions that are discretely arranged at equal intervals are designated as correction points CPP.
又，由於來自光源裝置LSb之射束LBb(LB4~LB6)被引導至掃描單元U4~U6之任一個，故而光源裝置LSb之訊號產生部22a之修正點指定部202基於與掃描單元U4~U6中之射束LBn入射之1個掃描單元Un對應之局部倍率修正資訊CMgn'之修正位置資訊Nv'而指定修正點CPP。 例如，於射束LB6入射至掃描單元U6之情形時，光源裝置LSb之修正點指定部202基於與掃描單元U6對應之局部倍率修正資訊CMg6'之修正位置資訊Nv'，將於描繪線SLn6上呈等間隔離散地配置之複數個位置指定為修正點CPP。 Further, since the beam LBb (LB4 to LB6) from the light source device LSb is guided to any one of the scanning units U4 to U6, the correction point specifying portion 202 of the signal generating portion 22a of the light source device LSb is based on the scanning unit U4 to U6. The correction point CPP is specified by the correction position information Nv' of the local magnification correction information CMgn' corresponding to one scanning unit Un incident on the beam LBn. For example, when the beam LB6 is incident on the scanning unit U6, the correction point specifying unit 202 of the light source device LSb is based on the corrected position information Nv' of the local magnification correction information CMg6' corresponding to the scanning unit U6, and will be on the drawing line SLn6. A plurality of positions that are discretely arranged at equal intervals are designated as correction points CPP.
若對該修正點指定部202進行具體說明，則修正點指定部202具有分頻計數器電路212與移位脈衝輸出部214。分頻計數器電路212係減法計數器，其被輸入自時脈切換部204輸出之時脈訊號LTC之時脈脈衝(基準時脈脈衝)。自時脈切換部204輸出之時脈訊號LTC之時脈脈衝經由閘極電路GTa而被輸入至分頻計數器電路212。閘極電路GTa係上述第1實施形態中所說明之於描繪允許訊號SQn為高位準(H)之期間開啟之閘極。亦即，分頻計數器電路212僅於描繪允許訊號SQn為高位準之期間中將時脈訊號LTC之時脈脈衝計數。於光源裝置LSa之訊號產生部22a之閘極電路GTa，被施加與掃描單元U1~U3對應之3個描繪允許訊號SQ1~SQ3。因此，光源裝置LSa之閘極電路GTa於描繪允許訊號SQ1~SQ3之任一者為高位準(H)之期間將所輸入之時脈訊號LTC之時脈脈衝輸出至分頻計數器電路212。同樣地，於光源裝置LSb之訊號產生部22a之閘極電路GTa，被施加與掃描單元U4~U6對應之3個描繪允許訊號SQ4~SQ6。因此，光源裝置LSb之閘極電路GTa於描繪允許訊號SQ4~SQ6之任一者為高位準(H)之期間將所輸入之時脈訊號LTC之時脈脈衝輸出至分頻計數器電路212。 When the correction point specifying unit 202 is specifically described, the correction point specifying unit 202 includes a frequency dividing counter circuit 212 and a shift pulse output unit 214. The frequency division counter circuit 212 is a subtraction counter that is input to a clock pulse (reference clock pulse) of the clock signal LTC output from the clock switching unit 204. The clock pulse of the clock signal LTC output from the clock switching unit 204 is input to the frequency division counter circuit 212 via the gate circuit GTa. The gate circuit GTa is a gate that is turned on during the period in which the drawing enable signal SQn is at the high level (H) as described in the first embodiment. That is, the frequency division counter circuit 212 counts the clock pulses of the clock signal LTC only during the period in which the enable signal SQn is at a high level. The three drawing permission signals SQ1 to SQ3 corresponding to the scanning units U1 to U3 are applied to the gate circuit GMa of the signal generating unit 22a of the light source device LSa. Therefore, the gate circuit GTa of the light source device LSa outputs the clock pulse of the input clock signal LTC to the frequency division counter circuit 212 while the one of the enable signals SQ1 to SQ3 is at the high level (H). Similarly, three drawing permission signals SQ4 to SQ6 corresponding to the scanning units U4 to U6 are applied to the gate circuit GMa of the signal generating unit 22a of the light source device LSb. Therefore, the gate circuit GTa of the light source device LSb outputs the clock pulse of the input clock signal LTC to the frequency division counter circuit 212 while the one of the enable signals SQ4 to SQ6 is high (H).
分頻計數器電路212係計數值C3被預設為修正位置資訊(設定值)Nv'，每當被輸入時脈訊號LTC之時脈脈衝時便將計數值C3減量。 分頻計數器電路212係當計數值C3成為0時，將1脈衝之一致訊號Idc輸出至移位脈衝輸出部214。亦即，分頻計數器電路212係當將時脈訊號LTC之時脈脈衝計數相當於修正位置資訊Nv'之量時輸出一致訊號Idc。該一致訊號Idc係表示於下一時脈脈衝產生之前存在修正點CPP之資訊。又，分頻計數器電路212係於計數值C3成為0後，當被輸入下一時脈脈衝時，將計數值C3預設為修正位置資訊Nv'。藉此，可沿著描繪線SLn等間隔地指定複數個修正點CPP。再者，修正位置資訊Nv'之具體值於下文予以例示。 The frequency dividing counter circuit 212 is preset to the corrected position information (set value) Nv', and the count value C3 is decremented each time the clock pulse of the pulse signal LTC is input. The frequency division counter circuit 212 outputs a one-pulse coincidence signal Idc to the shift pulse output unit 214 when the count value C3 becomes zero. That is, the frequency division counter circuit 212 outputs the coincidence signal Idc when the clock pulse count of the clock signal LTC is equal to the amount of the corrected position information Nv'. The coincidence signal Idc represents information that there is a correction point CPP before the next clock pulse is generated. Further, the frequency division counter circuit 212 is configured to preset the count value C3 to the corrected position information Nv' when the count value C3 becomes 0, and when the next clock pulse is input. Thereby, a plurality of correction points CPP can be specified at equal intervals along the drawing line SLn. Furthermore, the specific value of the corrected position information Nv' is exemplified below.
移位脈衝輸出部214係當被輸入一致訊號Idc時將移位脈衝CS輸出至時脈切換部204。當產生該移位脈衝CS時，時脈切換部204切換作為時脈訊號LTC輸出之時脈訊號CKp。該移位脈衝CS係表示修正點CPP之資訊，且係於分頻計數器電路212之計數值C3成為0後，下一時脈脈衝被輸入之前產生。因此，於根據使分頻計數器電路212之計數值C3為0之時脈脈衝而產生之射束LBa(LBb)之聚焦光SP於基板P上之位置、與根據下一時脈脈衝而產生之射束LBa(LBb)之聚焦光SP於基板P上之位置之間存在修正點CPP。 The shift pulse output unit 214 outputs the shift pulse CS to the clock switching unit 204 when the coincidence signal Idc is input. When the shift pulse CS is generated, the clock switching unit 204 switches the clock signal CK p outputted as the clock signal LTC. The shift pulse CS is information indicating the correction point CPP, and is generated after the count value C3 of the frequency division counter circuit 212 becomes 0, and the next clock pulse is input. Therefore, the position of the focused light SP of the beam LBa (LBb) generated on the clock pulse generated by the clock pulse having the count value C3 of the frequency dividing counter circuit 212 on the substrate P and the shot generated according to the next clock pulse are generated. There is a correction point CPP between the positions of the focused light SP of the beam LBa (LBb) on the substrate P.
如上所述，本第2實施形態中，若每1描繪線SLn投射20000個聚焦光SP，且於描繪線SLn上呈等間隔離散地配置40個修正點CPP，則以聚焦光SP(時脈訊號LTC之時脈脈衝)之500個間隔配置修正點CPP。因此，修正位置資訊Nv'成為500。 As described above, in the second embodiment, when 20,000 focused lights SP are projected per one drawing line SLn and 40 correction points CPP are discretely arranged on the drawing line SLn at equal intervals, the focused light SP (clock) is used. The 500-bit interval configuration correction point CPP of the signal pulse of the LTC. Therefore, the corrected position information Nv' becomes 500.
圖22係表示自圖20所示之訊號產生部22a之各部輸出之訊號之時序圖。時脈訊號產生部200所產生之50個時脈訊號CK0~CK49均成為雖為與時脈產生部60輸出之時脈訊號CK0相同之週期Te、但其相位逐個 延遲0.2nsec者。因此，例如，時脈訊號CK3成為相對於時脈訊號CK0相位延遲0.6nsec者，時脈訊號CK49成為相對於時脈訊號CK0相位延遲9.8nsec者。 Fig. 22 is a timing chart showing signals output from the respective sections of the signal generating section 22a shown in Fig. 20. Each of the 50 clock signals CK 0 to CK 49 generated by the clock signal generating unit 200 is a period Te which is the same as the clock signal CK 0 outputted by the clock generating unit 60, but whose phase is delayed by 0.2 nsec. Therefore, for example, the clock signal CK 3 becomes a phase delay of 0.6 nsec with respect to the clock signal CK 0 , and the clock signal CK 49 becomes a phase delay of 9.8 nsec with respect to the clock signal CK 0 .
分頻計數器電路212係當將自時脈切換部204輸出之時脈訊號LTC之時脈脈衝計數相當於修正位置資訊(設定值)Nv'之量時輸出一致訊號Idc(省略圖示)，與之相應地，移位脈衝輸出部214輸出移位脈衝CS。移位脈衝輸出部214通常係輸出高位準(邏輯值為1)之訊號，但卻將當被輸出一致訊號Idc時便下降至低位準(邏輯值為0)且當經過時脈訊號CKp之基準週期Te之一半(半週期)之時間時便上升至高位準(邏輯值為1)之移位脈衝CS輸出。藉此，該移位脈衝CS係於分頻計數器電路212將時脈訊號LTC之時脈脈衝計數相當於修正位置資訊(設定值)Nv'之量後至被輸入下一時脈脈衝之前上升。 The frequency division counter circuit 212 outputs a coincidence signal Idc (not shown) when the clock pulse count of the clock signal LTC output from the clock switching unit 204 corresponds to the corrected position information (set value) Nv', and Accordingly, the shift pulse output unit 214 outputs the shift pulse CS. The shift pulse output unit 214 usually outputs a signal with a high level (logic value of 1), but will fall to a low level (logical value 0) when outputting the coincidence signal Idc and when passing the reference of the clock signal CKp. The shift pulse CS output rises to a high level (logic value of 1) at the time of one half (half period) of the period Te. Thereby, the shift pulse CS is caused by the frequency division counter circuit 212 to increase the clock pulse count of the clock signal LTC by the amount corresponding to the corrected position information (set value) Nv' until it is input to the next clock pulse.
時脈切換部204響應移位脈衝CS之上升，將作為時脈訊號LTC輸出之時脈訊號CKp自曾在移位脈衝CS即將產生之前輸出之時脈訊號CKp切換為於與伸縮資訊POL'相應之方向相位偏移0.2nsec之時脈訊號CKp±1。圖22之例中，由於將曾在移位脈衝CS即將產生之前作為時脈訊號LTC輸出之時脈訊號CKp設為CK0，且將伸縮資訊POL'設為「0」(縮小)，故而響應移位脈衝CS之上升，而切換為時脈訊號CK49。如此，於伸縮資訊POL'為「0」之情形時，每當聚焦光SP通過修正點CPP時(亦即，每當產生移位脈衝CS時)，時脈切換部204以相位每次提前0.2nsec之方式切換作為時脈訊號LTC輸出之時脈訊號CKp。因此，被作為時脈訊號LTC輸出(選擇)之時脈訊號CKp係依照CK0→CK49→CK48→CK47→…之順序切換。於產 生該移位脈衝CS之修正點CPP之位置，時脈訊號LTC之週期成為相對於基準週期Te(=10nsec)短0.2nsec之時間(9.8nsec)，其以後，至聚焦光SP通過下一修正點CPP之前(至產生下一移位脈衝CS之前)，時脈訊號LTC之週期成為基準週期Te(=10nsec)。 When the clock switching unit 204 in response to a shift pulse rising CS, the clock signal LTC will be output as the clock signal CK p from the output before the shift pulse was about to produce the CS clock signal CK p switched to telescopic information POL 'The corresponding direction phase shift is 0.2nsec clock signal CK p±1 . In the example of FIG. 22, since the clock signal CK p outputted as the clock signal LTC before the shift pulse CS is to be generated is set to CK 0 and the telescopic information POL' is set to "0" (reduced), In response to the rise of the shift pulse CS, it is switched to the clock signal CK 49 . Thus, when the telescopic information POL' is "0", whenever the focused light SP passes the correction point CPP (that is, whenever the shift pulse CS is generated), the clock switching portion 204 advances the phase by 0.2 each time. The nsec mode switches the clock signal CK p as the output of the clock signal LTC. Therefore, the clock signal CK p output (selected) as the clock signal LTC is switched in the order of CK 0 →CK 49 →CK 48 →CK 47 →. At the position of the correction point CPP at which the shift pulse CS is generated, the period of the clock signal LTC becomes a time (9.8 nsec) shorter than the reference period Te (=10 nsec) by 0.2 nsec, and thereafter, the focused light SP passes through the next. Before the correction point CPP (before the generation of the next shift pulse CS), the period of the clock signal LTC becomes the reference period Te (= 10 nsec).
相反地，於伸縮資訊POL'為「1」之情形時，每當聚焦光SP通過修正點CPP時(亦即，每當產生移位脈衝CS時)，時脈切換部204以相位每次延遲0.2nsec之方式切換作為時脈訊號LTC而輸出(選擇)之時脈訊號CKp。因此，被作為時脈訊號LTC輸出(選擇)之時脈訊號CKp係依照CK0→CK1→CK2→CK3→…之順序切換。於產生該移位脈衝CS之修正點CPP之位置，時脈訊號LTC之週期成為相對於基準週期Te(=10nsec)長0.2nsec之時間(10.2nsec)，其以後，至聚焦光SP通過下一修正點CPP之前(至產生下一移位脈衝CS之前)，時脈訊號LTC之週期成為基準週期Te(=10nsec)。 Conversely, when the telescopic information POL' is "1", the clock switching section 204 delays each phase every time the focused light SP passes the correction point CPP (that is, whenever the shift pulse CS is generated). In the mode of 0.2 nsec, the clock signal CK p which is output (selected) as the clock signal LTC is switched. Therefore, the clock signal CK p output (selected) as the clock signal LTC is switched in the order of CK 0 → CK 1 → CK 2 → CK 3 → . At the position of the correction point CPP at which the shift pulse CS is generated, the period of the clock signal LTC becomes a time (10.2 nsec) longer than the reference period Te (=10 nsec) by 0.2 nsec, and thereafter, the focused light SP passes through the next. Before the correction point CPP (before the generation of the next shift pulse CS), the period of the clock signal LTC becomes the reference period Te (= 10 nsec).
本第2實施形態中，由於有效大小φ為3μm之聚焦光SP以每次重疊1.5μm之方式沿主掃描方向投射，故而修正點CPP處之時脈訊號LTC之週期之修正時間(±0.2nsec)相當於0.03μm(=1.5[μm]×(±0.2[nsec]/10[nsec]))，每1像素伸縮±0.03μm。因此，與上述第1實施形態(亦包含變形例)相比，可進行更細緻之倍率修正。 In the second embodiment, since the focused light SP having an effective size φ of 3 μm is projected in the main scanning direction so as to overlap 1.5 μm each time, the correction time of the period of the pulse signal LTC at the correction point CPP (±0.2 nsec) is corrected. ) corresponds to 0.03 μm (=1.5 [μm] × (±0.2 [nsec]/10 [nsec])), and is stretched by ±0.03 μm per pixel. Therefore, it is possible to perform finer magnification correction as compared with the first embodiment (including the modification).
圖23A係說明未進行局部倍率修正之情形時所描繪之圖案PP之圖，圖23B係說明按照圖22所示之時序圖進行局部倍率修正(縮小)之情形時所描繪之圖案PP之圖。再者，將強度為高位準之聚焦光SP以實線表示，將強度為低位準或零之聚焦光SP以虛線表示。 Fig. 23A is a view for explaining a pattern PP which is drawn when local magnification correction is not performed, and Fig. 23B is a view for explaining a pattern PP which is depicted when local magnification correction (reduction) is performed in accordance with the timing chart shown in Fig. 22. Further, the focused light SP having a high level of intensity is indicated by a solid line, and the focused light SP having a low level or zero is indicated by a broken line.
如圖23A、圖23B所示，藉由響應時脈訊號LTC之各時脈脈衝而產生之聚焦光SP描繪圖案PP。為了區分圖23A與圖23B之時脈訊號LTC與圖案PP，將圖23A(未進行局部倍率修正之情形時)之時脈訊號LTC、圖案PP以LTC1、PP1表示，將圖23B(已進行局部倍率修正之情形時)之時脈訊號LTC、圖案PP以LTC2、PP2表示。 As shown in FIGS. 23A and 23B, the pattern PP is drawn by the focused light SP generated in response to each clock pulse of the clock signal LTC. In order to distinguish the clock signal LTC and the pattern PP of FIG. 23A and FIG. 23B, the clock signal LTC and the pattern PP of FIG. 23A (when the local magnification correction is not performed) are represented by LTC1 and PP1, and FIG. 23B is performed. In the case of the magnification correction, the clock signal LTC and the pattern PP are represented by LTC2 and PP2.
於未進行局部倍率修正之情形時，如圖23A所示，所描繪之各像素之尺寸Pxy於主掃描方向上成為固定之長度。再者，將像素之副掃描方向(X方向)之長度以Px表示，將主掃描方向(Y方向)之長度以Py表示。若按照如圖22所示之時序圖進行局部倍率修正(縮小)，則包含修正點CPP之像素之尺寸Pxy成為像素之長度Py縮短△Py(=0.03μm)之狀態。相反地，若進行伸長之局部倍率修正，則包含修正點CPP之像素之尺寸Pxy成為像素之長度Py伸長△Py(=0.03μm)之狀態。 When the local magnification correction is not performed, as shown in FIG. 23A, the size Pxy of each pixel to be depicted becomes a fixed length in the main scanning direction. Further, the length of the sub-scanning direction (X direction) of the pixel is represented by Px, and the length of the main scanning direction (Y direction) is represented by Py. When the local magnification correction (reduction) is performed in accordance with the timing chart shown in FIG. 22, the size Pxy of the pixel including the correction point CPP is in a state in which the length Py of the pixel is shortened by ΔPy (=0.03 μm). On the other hand, when the local magnification correction of the elongation is performed, the size Pxy of the pixel including the correction point CPP is in a state in which the length Py of the pixel is elongated by ΔPy (=0.03 μm).
再者，雖對於串列資料DLn之像素移位並未特別提及，但每當時脈訊號LTC之時脈脈衝自時脈切換部204輸出2個時，圖12所示之描繪資料輸出部114將輸出至光源裝置LSa(LSb)之驅動電路36a之串列資料DLn之像素之邏輯資訊於列方向移位1個。藉此，聚焦光SP(時脈訊號LTC之時脈脈衝)之2個對應1像素。 Further, although the pixel shift of the serial data DLn is not particularly mentioned, when the clock pulse of the current pulse signal LTC is output from the clock switching unit 204, the drawing data output unit 114 shown in FIG. The logical information of the pixels of the serial data DLn outputted to the drive circuit 36a of the light source device LSa (LSb) is shifted by one in the column direction. Thereby, two of the focused light SP (clock pulse of the clock signal LTC) correspond to one pixel.
如上所述，第2實施形態之曝光裝置EX係一面將與來自脈衝光源部35之種子光S1、S2相應地生成之射束LB(Lse、LBa、LBb、LBn)之聚焦光SP根據圖案資料進行強度調變，一面使聚焦光SP沿著基板P上之描繪線SLn而相對地掃描，藉此於基板P上描繪圖案。曝光裝置EX至少具備時脈訊號產生部200、控制電路(光源控制部)22、及時脈切換部204。 如上所述，時脈訊號產生部200生成具有較由φ/Vs決定之週期短之基準週期Te(例如10nsec)並且每基準週期Te之1/N之修正時間(例如0.2nsec)賦予相位差之複數個(N=50個)時脈訊號CKp(CK0~CK49)。控制電路(光源控制部)22係以響應複數個時脈訊號CKp中之任一個時脈訊號CKp(時脈訊號LTC)之各時脈脈衝而產生射束LB之方式控制脈衝光源部35。時脈切換部204於聚焦光SP通過在描繪線SLn上指定之特定之修正點CPP之時點，將因射束LB之產生而引起之時脈訊號CKp、亦即作為時脈訊號LTC輸出之時脈訊號CKp切換為相位差不同之另一時脈訊號CKp。因此，可細緻地修正描繪線SLn(描繪之圖案)之倍率，從而可進行微米級之精密之重疊曝光。 As described above, the exposure apparatus EX of the second embodiment is based on the pattern data of the beam LB (Lse, LBa, LBb, LBn) generated in accordance with the seed lights S1 and S2 from the pulse light source unit 35. The intensity is modulated, and the focused light SP is relatively scanned along the drawing line SLn on the substrate P, thereby drawing a pattern on the substrate P. The exposure apparatus EX includes at least a clock signal generation unit 200, a control circuit (light source control unit) 22, and a time pulse switching unit 204. As described above, the clock signal generation unit 200 generates a reference period Te (for example, 10 nsec) having a period shorter than φ/Vs and a correction time (for example, 0.2 nsec) per reference period Te of 1/N to give a phase difference. A plurality of (N=50) clock signals CK p (CK 0 ~ CK 49 ). A control circuit (light source control section) 22 to a system clock signal CK p (clock signal LTC) of each clock pulse of the clock signal CK p in response to any of a plurality of the generated beam LB unit 35 controls the pulsed light source . When the focused light SP passes through the specific correction point CPP specified on the drawing line SLn, the clock switching unit 204 outputs the clock signal CK p due to the generation of the beam LB, that is, as the clock signal LTC. The clock signal CK p is switched to another clock signal CK p having a different phase difference. Therefore, the magnification of the drawing line SLn (the pattern to be drawn) can be finely corrected, so that precise overlapping exposure of the micron order can be performed.
時脈切換部204係於聚焦光SP通過描繪線SLn上之修正點CPP時，切換為相對於當前輸入至控制電路22之時脈訊號CKp具有修正時間(±Te/N=0.2nsec)之相位差之時脈訊號CKp。藉此，可更細緻地修正描繪線SLn(描繪之圖案)之倍率。 The clock switching unit 204 based on the focused light is depicted by the SP line SLn point correction in the CPP, with respect to the current input is switched to the control circuit when the clock signal CK p 22 having a correction time (± Te / N = 0.2nsec) of The phase difference signal CK p . Thereby, the magnification of the drawing line SLn (the pattern to be drawn) can be corrected in more detail.
曝光裝置EX具備將用以指定描繪線SLn上之修正點CPP之局部倍率修正資訊(修正資訊)CMgn'記憶於複數個掃描單元Un之各者之局部倍率設定部(修正資訊記憶部)112。時脈切換部204係基於與藉由射束切換部BDU而被導入有射束LB之掃描單元Un對應之局部倍率修正資訊CMgn'而切換時脈訊號CKp。藉此，可針對每個描繪線SLn(掃描單元Un)，細緻地修正描繪線SLn(描繪之圖案)之倍率。因此，圖案曝光之重疊精度提高。 The exposure apparatus EX includes a local magnification setting unit (correction information storage unit) 112 that stores local magnification correction information (correction information) CMgn' for specifying the correction point CPP on the drawing line SLn in each of the plurality of scanning units Un. The clock switching unit 204 switches the clock signal CK p based on the local magnification correction information CMgn' corresponding to the scanning unit Un to which the beam LB is introduced by the beam switching unit BDU. Thereby, the magnification of the drawing line SLn (the pattern to be drawn) can be finely corrected for each drawing line SLn (scanning unit Un). Therefore, the overlay precision of the pattern exposure is improved.
局部倍率修正資訊CMgn'包含用以按照沿描繪線SLn描繪之 圖案之描繪倍率而於描繪線SLn上之離散之複數個位置之各者指定修正點CPP之修正位置資訊Nv'。時脈切換部204係基於修正位置資訊Nv'而於描繪線SLn上之複數個修正點CPP之各者切換時脈訊號CKp。藉此，可無不均地使描繪線SLn(描繪之圖案)進行倍率修正(伸縮)。 The local magnification correction information CMgn' includes correction position information Nv' for specifying the correction point CPP for each of a plurality of discrete positions on the drawing line SLn in accordance with the drawing magnification of the pattern drawn along the drawing line SLn. The clock switching unit 204 switches the clock signal CK p for each of the plurality of correction points CPP on the drawing line SLn based on the corrected position information Nv'. Thereby, the drawing line SLn (the pattern to be drawn) can be subjected to magnification correction (expansion and contraction) without unevenness.
局部倍率修正資訊CMgn'包含按照沿描繪線SLn描繪之圖案之描繪倍率而切換時脈訊號CKp為相對於當前輸入至控制電路22之時脈訊號CKp相位延遲之方向或提前之方向之伸縮資訊(極性資訊)POL'。藉此，根據伸縮資訊POL'，可使描繪線SLn(描繪之圖案)伸長或縮小。 Partial magnification correction information CMgn 'comprises time in accordance with the drawing magnification of the pattern of the edge delineation lines SLn depicts the switched clock signal CK p with respect to the current input to the control circuit of the clock 22 stretching direction signal CK p phase delay of or the direction of advance of Information (polar information) POL'. Thereby, the drawing line SLn (the pattern to be drawn) can be elongated or reduced according to the telescopic information POL'.
再者，時脈切換部204亦可將作為時脈訊號LTC輸出之時脈訊號CKp切換為相對於作為當前輸出之時脈訊號LTC而輸出之時脈訊號CKp具有q×Te/N=q×0.2nsec之相位差之時脈訊號CKp±q。其中，q設為具有q<N之關係之1以上之整數。因此，例如，於q為2之情形，且作為當前輸出之時脈訊號LTC而輸出之時脈訊號CKp為時脈訊號CK11之情形時，當伸縮資訊POL'為「1」時，時脈切換部204切換為相對於時脈訊號CK11相位延遲0.4nsec之時脈訊號CK13。又，於伸縮資訊POL'為「1」之情形時，時脈切換部204切換為相對於時脈訊號CK11相位提前0.4nsec之時脈訊號CK9。表示該「q」之值之資訊作為伸縮率資訊REC'而自局部倍率設定部112(參照圖12)被輸入至時脈切換部204。該伸縮率資訊REC'包含於局部倍率修正資訊CMgn'之一部分。於聚焦光SP之1次掃描期間中，輸入同一伸縮率資訊REC'。 Further, the clock switching unit 204 may be used as the switching clock signal CK p LTC output clock signal with respect to the clock signal as the output current of the LTC output of the clock signal CK p q × Te / N = The clock signal CK p±q of the phase difference of q × 0.2nsec. Here, q is an integer of 1 or more having a relationship of q<N. Therefore, for example, when q is 2 and the clock signal CK p outputted as the current output clock signal LTC is the clock signal CK 11 , when the telescopic information POL ' is "1", the time is The pulse switching unit 204 switches to the clock signal CK 13 whose phase is delayed by 0.4 nsec with respect to the clock signal CK 11 . Further, when the telescopic information POL' is "1", the clock switching unit 204 switches to the clock signal CK 9 which is advanced by 0.4 nsec with respect to the phase signal CK 11 . The information indicating the value of "q" is input to the clock switching unit 204 from the local magnification setting unit 112 (see FIG. 12) as the expansion ratio information REC'. The expansion ratio information REC' is included in one of the partial magnification correction information CMgn'. In the one-scan period of the focused light SP, the same stretch ratio information REC' is input.
該局部倍率修正資訊CMgn'(CMg1'~CMg6')之修正位置資訊(設定值)Nv'可任意地變更，可根據描繪線SLn之倍率而適當設定。例 如，亦可以位於描繪線SLn上之修正點CPP成為1個之方式設定修正位置資訊Nv'。又，1描繪線SLn中係將修正位置資訊Nv'之值設為固定，但亦可於1描繪線SLn變更修正位置資訊Nv'。即便於該情形時，於描繪線SLn上之離散之位置指定複數個修正點CPP亦不變，但藉由變更修正位置資訊Nv，可使修正點CPP之間隔變得不均一。進而，亦可於沿著描繪線SLn之射束LBn(聚焦光SP)之每1掃描、或多角鏡PM之每1旋轉時，不改變描繪線SLn上之修正像素之數量，而使修正像素(修正點CPP)之位置不同。 The corrected position information (set value) Nv' of the local magnification correction information CMgn' (CMg1' to CMg6') can be arbitrarily changed, and can be appropriately set according to the magnification of the drawing line SLn. example For example, the correction position information Nv' may be set such that the correction point CPP located on the drawing line SLn is one. Further, in the drawing line SLn, the value of the corrected position information Nv' is fixed, but the corrected position information Nv' may be changed in the one drawing line SLn. That is, in this case, the plurality of correction points CPP are not changed at the discrete positions on the drawing line SLn. However, by changing the corrected position information Nv, the interval of the correction points CPP can be made non-uniform. Further, it is also possible to correct the number of correction pixels on the drawing line SLn without changing the number of correction pixels on the drawing line SLn every one scan of the beam LBn (focus light SP) along the drawing line SLn or every one rotation of the polygon mirror PM The position of the (correction point CPP) is different.
[第1及第2實施形態之變形例] [Modification of First and Second Embodiments]
上述各實施形態(亦包含變形例)亦可進行如下之變形。再者，對於與上述各實施形態(亦包含變形例)相同之構成標附相同符號，僅對不同之處進行說明。 The above embodiments (including modifications) may be modified as follows. In addition, the same configurations as those of the above-described embodiments (including modifications) are denoted by the same reference numerals, and only differences will be described.
(變形例1)上述各實施形態(亦包含變形例)中，使用描繪位元串資料SBa(串列資料DL1~DL3)、SBb(串列資料DL4~DL6)將設置於光源裝置LSa、LSb之脈衝光產生部20之作為描繪用光調變器之電光元件(強度調變部)36開關。然而，變形例1中，作為描繪用光調變器，代替電光元件36而使用描繪用光學元件AOM。該描繪用光學元件AOM為聲光調變元件(AOM：Acousto-Optic Modulator)。 (Modification 1) In each of the above embodiments (including a modification), the drawing bit string data SBa (serial data DL1 to DL3) and SBb (serial data DL4 to DL6) are used to be provided in the light source devices LSa, LSb. The pulse light generating unit 20 is switched as an electro-optical element (intensity modulation unit) 36 as a light modulator for drawing. However, in the first modification, as the optical modulator for drawing, the optical element for drawing AOM is used instead of the electro-optical element 36. The drawing optical element AOM is an Acousto-Optic Modulator (AOM).
例如，如圖24所示，於射束切換部BDU之選擇用光學元件AOM1~AOM3中之來自光源裝置LSa之射束LBa最初入射之選擇用光學元件AOM1與光源裝置LSa之間，配置描繪用光學元件(強度調變部)AOMa。同樣地，於射束切換部BDU之選擇用光學元件AOM4~AOM6中之來自光 源裝置LSb之射束LBb最初入射之選擇用光學元件AOM4與光源裝置LSb之間，配置描繪用光學元件(強度調變部)AOMb。該描繪用光學元件AOMa係根據自圖14所示之描繪資料輸出部114之第1資料輸出部114a輸出之描繪位元串資料SBa(串列資料DL1~DL3)而開關，描繪用光學元件AOMb係根據自第2資料輸出部114b輸出之描繪位元串資料SBb(串列資料DL4~DL6)而開關。該描繪用光學元件AOMa(AOMb)於像素之邏輯資訊為「0」之情形時使所入射之射束LBa(LBb)透過並將其引導至未圖示之吸收體，於像素之邏輯資訊為「1」之情形時產生使所入射之射束LBa(LBb)繞射後之一次繞射光。該產生之一次繞射光被引導至選擇用光學元件AOM1(AOM4)。因此，於像素之邏輯資訊為「0」之情形時，聚焦光SP未投射至基板P之被照射面上，故而聚焦光SP之強度成為低位準(零)，於像素之邏輯資訊為「1」之情形時，聚焦光SP之強度成為高位準。藉此，可使藉由掃描單元U1~U3(U4~U6)掃描之聚焦光SP之強度根據串列資料DL1~DL3(DL4~DL6)而調變。即便於該情形時，亦可獲得與上述各實施形態等同樣之效果。 For example, as shown in FIG. 24, the selection optical element AOM1 and the light source device LSa, which are initially incident on the beam LBa from the light source device LSa in the selection optical elements AOM1 to AOM3 of the beam switching unit BDU, are arranged for drawing. Optical element (intensity modulation unit) AOMa. Similarly, the light from the selection optical elements AOM4 to AOM6 of the beam switching unit BDU An optical element (intensity modulation unit) AOMb is disposed between the selection optical element AOM4 and the light source device LSb, to which the beam LBb of the source device LSb is first incident. The drawing optical element AOMa is switched based on the drawing bit string data SBa (serial data DL1 to DL3) output from the first data output unit 114a of the drawing data output unit 114 shown in FIG. 14 , and the drawing optical element AOMb The switch is switched based on the drawing bit string data SBb (the serial data DL4 to DL6) output from the second data output unit 114b. When the logic element AOMa (AOMb) of the drawing is in the case where the logical information of the pixel is "0", the incident beam LBa (LBb) is transmitted and guided to an absorber (not shown), and the logical information of the pixel is In the case of "1", the primary diffracted light is obtained by diffracting the incident beam LBa (LBb). The generated primary diffracted light is guided to the selection optical element AOM1 (AOM4). Therefore, when the logic information of the pixel is "0", the focused light SP is not projected onto the illuminated surface of the substrate P, so the intensity of the focused light SP becomes a low level (zero), and the logical information of the pixel is "1". In the case of the case, the intensity of the focused light SP becomes a high level. Thereby, the intensity of the focused light SP scanned by the scanning units U1 to U3 (U4 to U6) can be modulated in accordance with the serial data DL1 to DL3 (DL4 to DL6). In other words, in the case of this case, the same effects as those of the above embodiments can be obtained.
又，亦可將描繪用光學元件(強度調變部)AOMcn(AOMc1~AOMc6)設置於每個掃描單元Un(U1~U6)。於該情形時，描繪用光學元件AOMcn可設置於各掃描單元Un之反射鏡M14(參照圖5)之近前。該各掃描單元Un(U1~U6)之描繪用光學元件AOMcn(AOMc1~AOMc6)係根據各串列資料DLn(DL1~DL6)而開關。設置於掃描單元U1內之描繪用光學元件AOMc1係根據串列資料DL1而開關。同樣地，設置於掃描單元U2~U6內之描繪用光學元件AOMc2~AOMc6係根據串列資料DL2~ DL6而開關。又，各掃描單元Un之描繪用光學元件AOMcn於像素之邏輯資訊為「0」之情形時，將所入射之射束LBn引導至未圖示之吸收體，於像素之邏輯資訊為「1」之情形產生使所入射之射束LBn繞射後之一次繞射光。該產生之一次繞射光(射束LBn)被引導至反射鏡M14而作為聚焦光SP投射至基板上。 Further, the drawing optical element (intensity modulation unit) AOMcn (AOMc1 to AOMc6) may be provided in each of the scanning units Un (U1 to U6). In this case, the drawing optical element AOMcn can be disposed in front of the mirror M14 (see FIG. 5) of each scanning unit Un. The drawing optical elements AOMcn (AOMc1 to AOMc6) of the respective scanning units Un (U1 to U6) are switched in accordance with the serial data DLn (DL1 to DL6). The drawing optical element AOMc1 provided in the scanning unit U1 is switched based on the serial data DL1. Similarly, the drawing optical elements AOMc2 to AOMc6 provided in the scanning units U2 to U6 are based on the serial data DL2~ DL6 and switch. Further, when the logical information of the pixel AOMcn for each scanning unit Un is "0", the incident beam LBn is guided to an absorber (not shown), and the logical information of the pixel is "1". The situation produces a primary diffracted light that is diffracted by the incident beam LBn. The generated primary diffracted light (beam LBn) is directed to the mirror M14 and projected onto the substrate as focused light SP.
本變形例1中，於光源裝置LSa(LSb)內，無須進行射束LB之強度調變，故而不需要DFB半導體雷射元件32、偏光分光器34、38、電光元件36、及吸收體40。因此，DFB半導體雷射元件30發出之種子光S1被直接引導至合併器44。 In the first modification, in the light source device LSa (LSb), the intensity modulation of the beam LB does not need to be performed, so the DFB semiconductor laser element 32, the polarization beam splitters 34, 38, the electrooptic element 36, and the absorber 40 are not required. . Therefore, the seed light S1 emitted from the DFB semiconductor laser element 30 is directly guided to the combiner 44.
(變形例2)亦可將來自光源裝置LS之射束LB之各者使用複數個射束分光器而分割成3個或6個，並使分割成之3個或6個射束LB之各者入射至3個或6個掃描單元Un。於該情形時，使用串列資料DLn對入射至掃描單元Un之分割後之各個射束LB進行強度調變。 (Modification 2) Each of the beams LB from the light source device LS may be divided into three or six using a plurality of beam splitters, and each of the three or six beams LB may be divided into three or six beams LB. It is incident on 3 or 6 scanning units Un. In this case, the intensity of each of the divided beams LB incident on the scanning unit Un is intensity-modulated using the serial data DLn.
(變形例3)上述各實施形態(亦包含變形例)中，於使片狀之基板P密接於旋轉筒DR之外周面之狀態下，於呈圓筒面狀彎曲之基板P之表面利用複數個掃描單元Un之各者而沿著描繪線SLn進行圖案描繪。然而，例如，如國際公開第WO2013/150677號手冊所揭示，亦可為如將基板P一面呈平面狀支持、一面於長尺寸方向進給並且進行曝光處理之構成。於該情形時，若基板P之表面被設定為與XY平面平行，則例如只要以圖2、圖3所示之第奇數號掃描單元U1、U3、U5之各照射中心軸Le1、Le3、Le5、與第偶數號掃描單元U2、U4、U6之各照射中心軸Le2、Le4、Le6在與XZ平面平行之面內觀察時相互與Z軸平行且於X方向以固定之間隔存在之方 式配置複數個掃描單元U1~U6即可。 (Variation 3) In the above-described respective embodiments (including the modified example), in a state in which the sheet-like substrate P is adhered to the outer peripheral surface of the rotary cylinder DR, the surface of the substrate P which is curved in a cylindrical shape is used in plural. Each of the scanning units Un performs pattern drawing along the drawing line SLn. However, for example, as disclosed in the handbook of International Publication No. WO2013/150677, it is also possible to carry out the exposure process by feeding the substrate P in a planar shape while being fed in the longitudinal direction. In this case, if the surface of the substrate P is set to be parallel to the XY plane, for example, the illumination center axes Le1, Le3, and Le5 of the odd-numbered scanning units U1, U3, and U5 shown in FIGS. 2 and 3 are used. And the illumination center axes Le2, Le4, and Le6 of the even-numbered scanning units U2, U4, and U6 are parallel to each other when viewed in a plane parallel to the XZ plane, and exist at a fixed interval in the X direction. A plurality of scanning units U1 to U6 can be configured.
(變形例4)於以上之第1實施形態、第2實施形態、或該等各變形例中，各掃描單元Un係如圖5所示，設置將朝向多角鏡PM之反射面之射束LBn於一維方向(圖5中為Zt方向)收斂之第1柱面透鏡(複曲面透鏡)CYa、及將於多角鏡PM之1個反射面反射並通過f θ透鏡FT之射束LBn於一維方向(圖5中為Xt方向)收斂之第2柱面透鏡(複曲面透鏡)CYb，藉此抑制了因多角鏡PM之各反射面之略微之傾倒所導致之描繪線SLn(聚焦光SP)之向副掃描方向(Xt方向)之晃動。於該情形時，於與第1柱面透鏡CYa之母線正交之面內觀察時，第1柱面透鏡CYa之後側焦點係以成為多角鏡PM之反射面之位置之方式設定。進而，於與第2柱面透鏡CYb之母線正交之面內觀察時，f θ透鏡FT與第2柱面透鏡CYb之合成系統係以多角鏡PM之反射面與基板P之被照射面成為光學上共軛之關係(成像關係)之方式設定。即，以多角鏡PM之反射面於特定之公差範圍內位於f θ透鏡FT之前側焦點之位置或其附近之方式設定，且以基板P之被照射面於特定之焦點深度範圍(Depth of Focus)內位於第2柱面透鏡CYb之後側焦點之位置之方式設定。 (Variation 4) In the first embodiment, the second embodiment, or the modifications described above, each scanning unit Un is provided with a beam LBn that faces the reflecting surface of the polygon mirror PM as shown in FIG. a first cylindrical lens (torre lens) CYa that converges in a one-dimensional direction (Zt direction in FIG. 5), and a beam LBn that is reflected by one reflecting surface of the polygon mirror PM and passes through the f θ lens FT The second cylindrical lens (the toric lens) CYb which converges in the dimension direction (Xt direction in FIG. 5), thereby suppressing the drawing line SLn (focusing light SP) caused by the slight tilting of the respective reflecting surfaces of the polygon mirror PM The sway to the sub-scanning direction (Xt direction). In this case, when viewed in a plane orthogonal to the bus bar of the first cylindrical lens CYa, the rear focal point of the first cylindrical lens CYa is set so as to be the position of the reflecting surface of the polygon mirror PM. Further, when viewed in a plane orthogonal to the bus bar of the second cylindrical lens CYb, the combined system of the f θ lens FT and the second cylindrical lens CYb is such that the reflecting surface of the polygon mirror PM and the irradiated surface of the substrate P become The optical conjugate relationship (imaging relationship) is set. That is, the reflection surface of the polygon mirror PM is set at or near the position of the front focus of the f θ lens FT within a specific tolerance range, and the illuminated surface of the substrate P is in a specific focus depth range (Depth of Focus) The setting is set in the position of the back focus of the second cylindrical lens CYb.
進而，於此種關係之下，圖6或圖24之設置於射束切換部BDU中之選擇用光學元件AOMn(AOM1~AOM6)或描繪用光學元件AOMa、AOMb、或者設置於各掃描單元Un內之描繪用光學元件AOMcn(AOMc1~AOMc6)將使入射射束(0次光)作為描繪用射束(一次繞射光)繞射之偏向位置設定為於與基板P上之描繪線SLn交叉之方向(X方向或Xt方向)上與基板P之被照射面、及多角鏡PM之反射面之各者光學上共 軛。即，利用該等光學元件AOM之描繪用射束(一次繞射光)之偏向方向被設定為在光學上對應於與柱面透鏡CYb(或CYa)之母線之方向正交(或交叉)之呈現折射力之方向。 Further, in this relationship, the selection optical elements AOMn (AOM1 to AOM6) or the drawing optical elements AOMa and AOMb provided in the beam switching unit BDU of FIG. 6 or FIG. 24 are provided in each scanning unit Un. The drawing optical element AOMcn (AOMc1 to AOMc6) internally sets the deflection position of the incident beam (zero-order light) as a drawing beam (primary diffracted light) to be intersected with the drawing line SLn on the substrate P. The direction (X direction or Xt direction) is optically shared with the illuminated surface of the substrate P and the reflective surface of the polygon mirror PM yoke. That is, the deflection direction of the drawing beam (primary diffracted light) by the optical elements AOM is set to be optically corresponding to the orthogonal (or intersecting) representation of the direction of the bus bar of the cylindrical lens CYb (or CYa). The direction of the refractive power.
此種子光學元件AOM(聲光調變元件)因藉由超音波振動而於內部生成繞射光柵之光學構件之溫度而存在偏向角(繞射角)變動等問題。然而，藉由如上所述般將利用光學元件AOM之描繪用射束(一次繞射光)之偏向方向設定為與呈現第2柱面透鏡CYb(或第1柱面透鏡CYa)之折射力之方向吻合，可抑制由因光學元件AOM之溫度變化產生之偏向角(繞射角)之變動所引起之描繪線SLn(聚焦光SP)向副掃描方向(Xt方向)之變動。 The seed optical element AOM (acoustic-light modulation element) has a problem that the deflection angle (diffraction angle) fluctuates due to the temperature of the optical member of the diffraction grating generated by the ultrasonic vibration. However, the direction of the deflection of the drawing beam (primary diffracted light) by the optical element AOM is set to be the direction of the refractive power of the second cylindrical lens CYb (or the first cylindrical lens CYa) as described above. The matching can suppress the fluctuation of the drawing line SLn (the focused light SP) in the sub-scanning direction (Xt direction) caused by the fluctuation of the deflection angle (diffraction angle) due to the temperature change of the optical element AOM.
參照圖25對上述情形進行說明。圖25係將圖6或圖24所示之射束切換部BDU中之聚光透鏡(condenser lens)CD1、選擇用光學元件AOM1、準直透鏡CL1、及單元側入射鏡IM1之配置、與掃描單元U1內之第2柱面透鏡CYb之配置之關係省略中途之光路而模式性地表示之圖。入射至聚光透鏡CD1之射束LBa係具有例如數mm直徑之圓形剖面之平行射束，且藉由聚光透鏡CD1而以於後側焦點之位置成為光束腰(最小徑)之方式收斂。設定為，選擇用光學元件AOM1之偏向位置Pdf到達至該光束腰之位置。於選擇用光學元件AOM1為接通狀態(入射允許訊號LP1為H狀態)時，於偏向位置Pdf，生成相對於入射之射束LBa使朝向改變偏向角(繞射角)θ df之射束(一次繞射光)LB1。於選擇用光學元件AOM1為斷開狀態(入射允許訊號LP1為L狀態)時，不進行偏向位置Pdf處之射束LBa之繞射，因此射束LBa自偏向位置Pdf直接成為發散射束而射向準直透 鏡CL1。準直透鏡CL1之前側焦點之位置亦與選擇用光學元件AOM1之偏向位置Pdf吻合，因此透過準直透鏡CL1之射束LBa再次成為平行射束而射向下一段之聚光透鏡CD2、選擇用光學元件AOM2。 The above case will be described with reference to Fig. 25 . 25 is a view showing the arrangement and scanning of a condenser lens CD1, a selection optical element AOM1, a collimator lens CL1, and a unit side entrance mirror IM1 in the beam switching unit BDU shown in FIG. 6 or FIG. The relationship between the arrangement of the second cylindrical lenses CYb in the unit U1 is schematically shown by omitting the optical path in the middle. The beam LBa incident on the condensing lens CD1 has a parallel beam of a circular cross section of, for example, several mm in diameter, and is formed by the condensing lens CD1 so that the position of the rear focus becomes the beam waist (minimum diameter). convergence. It is set such that the deflection position Pdf of the optical element AOM1 is selected to reach the position of the beam waist. When the selection optical element AOM1 is in the ON state (the incident permission signal LP1 is in the H state), at the deflection position Pdf, a beam is generated which changes the direction of the deflection angle (diffraction angle) θ df with respect to the incident beam LBa ( One time diffracted light) LB1. When the selection optical element AOM1 is in the off state (the incident permission signal LP1 is in the L state), the diffraction of the beam LBa at the deflection position Pdf is not performed, so that the beam LBa is directly emitted as a diverging beam from the deflection position Pdf. Direct alignment Mirror CL1. The position of the front focus of the collimator lens CL1 also coincides with the deflection position Pdf of the selection optical element AOM1. Therefore, the beam LBa transmitted through the collimator lens CL1 becomes a parallel beam again and is emitted to the next section of the condenser lens CD2. Optical component AOM2.
藉由選擇用光學元件AOM1而偏向(繞射)之射束LB1由單元側入射鏡IM1反射而射向掃描單元U1。上文之圖6、圖24中雖省略了圖示，但於鏡IM1之後設置有如與準直透鏡CL1相同之準直透鏡CL1'，使自選擇用光學元件AOM1成為發散射束行進之射束LB1為平行射束。因此，準直透鏡CL1'之前側焦點之位置被設定為選擇用光學元件AOM1之偏向位置Pdf。通過準直透鏡CL1'之射束LB1入射至圖5之掃描單元U1，並經過第1柱面透鏡CYa、多角鏡PM、f θ透鏡FT、及反射鏡M15等而入射至母線於Yt方向延伸之第2柱面透鏡CYb之後，於基板P上之描繪線SL1上聚光為聚焦光SP。於圖25中，描繪線SL1係於Yt方向呈直線延伸，聚焦光SP係於Yt方向掃描。此處，第2柱面透鏡CYb呈現折射力之方向為Xt方向。 The beam LB1 deflected (diffracted) by the selection of the optical element AOM1 is reflected by the unit side incident mirror IM1 and is incident on the scanning unit U1. Although not shown in FIGS. 6 and 24, the collimator lens CL1' is provided behind the mirror IM1, and the self-selecting optical element AOM1 is a beam that travels as a diverging beam. LB1 is a parallel beam. Therefore, the position of the front focus of the collimator lens CL1' is set to the bias position Pdf of the selection optical element AOM1. The beam LB1 passing through the collimator lens CL1' is incident on the scanning unit U1 of FIG. 5, and is incident on the bus bar in the Yt direction through the first cylindrical lens CYa, the polygon mirror PM, the f θ lens FT, and the mirror M15. After the second cylindrical lens CYb, the focused light SP is collected on the drawing line SL1 on the substrate P. In FIG. 25, the drawing line SL1 extends in a straight line in the Yt direction, and the focused light SP is scanned in the Yt direction. Here, the second cylindrical lens CYb exhibits a direction in which the refractive power is in the Xt direction.
若藉由選擇用光學元件AOM1而偏向之射束LB1之偏向角θ df因選擇用光學元件AOM1之溫度變化而變動△θ df，則自準直透鏡CL1'射出之射束LB1成為於橫向平行移動(漂移)之射束LB1'。漂移後之射束LB1'於自f θ透鏡FT射出時係自本來之射出位置向Xt方向漂移而射出，但藉由第2柱面透鏡CYb之折射力，射束LB1'聚光為聚焦光SP之Xt方向之位置相對於漂移前之位置基本不變。如此，將選擇用光學元件AOM1之偏向位置Pdf與基板P之被照射面設定為光學上共軛之關係，於與第2柱面透鏡CYb(或第1柱面透鏡CYa)之母線正交之面(即，圖25中之與XtZt 面平行之面)內，將選擇用光學元件AOM1之偏向位置Pdf與多角鏡PM之反射面設定為光學上共軛之關係，而且將利用選擇用光學元件AOM1之射束LB1之偏向方向(繞射方向)設定為位於與XtZt面平行之面內，藉此，即便依存於選擇用光學元件AOM1之溫度變化而使偏向角θ df發生變動，亦可將因此引起之描繪線SL1(聚焦光SP)之位置變動抑制至可忽略之程度。如上所述之關係在用於其他掃描單元U2~U6之選擇用光學元件AOM2~AOM6或描繪用光學元件AOMa、AOMb、或者設置於各掃描單元Un內之描繪用光學元件AOMcn(AOMc1~AOMc6)中亦同樣地設定。 When the deflection angle θ df of the beam LB1 deflected by the selection optical element AOM1 fluctuates by Δθ df due to the temperature change of the selection optical element AOM1, the beam LB1 emitted from the collimator lens CL1' becomes laterally parallel. Move (drift) beam LB1'. The beam LB1' after the drift is emitted from the original emission position in the Xt direction when it is emitted from the f θ lens FT, but the beam LB1' is condensed into the focused light by the refractive power of the second cylindrical lens CYb. The position of the Xt direction of the SP is substantially unchanged from the position before the drift. In this manner, the position of the deflecting position Pdf of the optical element AOM1 and the surface to be irradiated of the substrate P are optically conjugated, and are orthogonal to the bus bar of the second cylindrical lens CYb (or the first cylindrical lens CYa). Face (ie, in Figure 25 with XtZt In the plane parallel to the plane, the deflection position Pdf of the optical element AOM1 and the reflection surface of the polygon mirror PM are set to be optically conjugated, and the deflection direction of the beam LB1 of the selection optical element AOM1 is used. The radiation direction is set to be in a plane parallel to the XtZt plane, whereby the deflection angle θ df is varied depending on the temperature change of the selection optical element AOM1, and thus the drawing line SL1 (focusing light SP) may be caused. The positional change is suppressed to a negligible extent. The relationship described above is used for the selection optical elements AOM2 to AOM6 for other scanning units U2 to U6, the drawing optical elements AOMa, AOMb, or the drawing optical elements AOMcn (AOMc1 to AOMc6) provided in each scanning unit Un. It is also set in the same way.
且說，上文之第1實施形態(亦包含變形例)中，由於光源裝置LS(LSa、LSb)為脈衝雷射光源，故而以與於描繪線SLn上指定之1個修正像素對應之時脈訊號LTC之脈衝數(聚焦光SP之脈衝數)和與其他非修正像素對應之時脈訊號LTC之脈衝數不同之方式控制描繪資料(位元串)之讀出，並響應該時脈訊號LTC之脈衝，使來自光源裝置LS(LSa、LSb)之射束LB脈衝發光。然而，於將光源裝置LS(LSa、LSb)設為亦可連續發光之半導體雷射光源、或發光二極體(LED)等半導體光源而設置於複數個掃描單元Un之各者，且利用來自該半導體光源之射束直接生成聚焦光SP之情形時，亦可以於修正像素與其他像素(非修正像素)使半導體光源之發光時間略有差異之方式予以控制。於此種控制時，只要僅於上文之圖8所示之描繪位元串資料SBa(SBb)為H位準之期間使半導體光源連續點亮即可。當然，亦可響應利用如圖8中之時脈訊號LTC與描繪位元串資料SBa(SBb)之邏輯積(AND)而獲得之時脈脈衝，使半導體光源脈衝點亮。 In addition, in the first embodiment (including the modified example), since the light source device LS (LSa, LSb) is a pulsed laser light source, the clock corresponding to one correction pixel specified on the drawing line SLn is used. The number of pulses of the signal LTC (the number of pulses of the focused light SP) and the number of pulses of the pulse signal LTC corresponding to the other non-corrected pixels control the reading of the drawing data (bit string) and respond to the clock signal LTC The pulse causes the beam LB from the light source device LS (LSa, LSb) to illuminate. However, the light source device LS (LSa, LSb) is provided as a semiconductor laser light source that can continuously emit light, or a semiconductor light source such as a light-emitting diode (LED), and is provided in each of the plurality of scanning units Un, and is utilized by When the beam of the semiconductor light source directly generates the focused light SP, it may be controlled such that the correction pixel and the other pixels (non-corrected pixels) slightly change the light-emitting time of the semiconductor light source. In the case of such control, the semiconductor light source may be continuously turned on only during the period in which the bit string data SBa (SBb) shown in FIG. 8 is H level. Of course, the semiconductor light source can also be pulsed in response to a clock pulse obtained by using a logical product (AND) of the clock signal LTC and the depicted bit string data SBa (SBb) as shown in FIG.
(變形例5)以上之各實施形態或變形例中，利用多角鏡PM進行聚焦光SP之主掃描方向之掃描，但亦可代替多角鏡PM，而使用如圖26所示之檢流計鏡(振動鏡)GM。圖26表示本變形例5之掃描單元Ua1之檢流計鏡GM與f θ透鏡FT之平面配置。f θ透鏡FT之光軸AXf係與正交座標系XYZ之X軸平行地配置，檢流計鏡GM之旋轉(振動)中心軸Cg係與Z軸與平行地配置。檢流計鏡GM之反射平面被設定為，與Z軸平行，並且於繞旋轉中心軸Cg之振動之中立位置，相對於f θ透鏡FT之光軸AXf於XY面內成為45度之角度。通過射束送光系統入射至檢流計鏡GM之反射面之來自光源裝置LS之射束LB1(根據描繪資料而經強度調變之剖面為圓形之平行射束)於該反射面向+X方向反射。由檢流計鏡GM反射之射束LB1係於特定之偏轉角度θ g之範圍入射至f θ透鏡FT，且於基板P上之描繪線SL1聚光為聚焦光SP。 (Variation 5) In each of the above embodiments and modifications, the scanning of the main scanning direction of the focused light SP is performed by the polygon mirror PM, but instead of the polygon mirror PM, the galvanometer mirror shown in Fig. 26 may be used. (Vibrating mirror) GM. Fig. 26 shows the planar arrangement of the galvanometer mirror GM and the f θ lens FT of the scanning unit Ua1 of the fifth modification. The optical axis AXf of the f θ lens FT is arranged in parallel with the X axis of the orthogonal coordinate system XYZ, and the rotation (vibration) central axis Cg of the galvanometer mirror GM is arranged in parallel with the Z axis. The reflection plane of the galvanometer mirror GM is set to be parallel to the Z axis, and is at a neutral position about the rotation center axis Cg, and is at an angle of 45 degrees with respect to the optical axis AXf of the f θ lens FT in the XY plane. The beam LB1 from the light source device LS incident on the reflecting surface of the galvanometer mirror GM by the beam light transmitting system (the parallel beam whose intensity is modulated according to the drawing data is circular) is on the reflecting surface +X Directional reflection. The beam LB1 reflected by the galvanometer mirror GM is incident on the f θ lens FT in a range of a specific deflection angle θ g , and is concentrated on the drawing line SL1 on the substrate P as the focused light SP.
於將檢流計鏡GM設為主掃描用之偏向構件之情形時，聚焦光SP之主掃描方向之掃描速度不固定，有時會在描繪線SL1之中央部與周邊部產生少許速度差。其原因在於，會產生因檢流計鏡GM之往復振動引起之射束LB1之偏轉角度之變化不會相對於時間軸成為線形之部分。此種聚焦光SP之速度不均係表現為沿著主掃描方向之描繪圖案之局部之描繪倍率誤差、尤其於描繪線SLn之中央部與周邊部之倍率誤差。根據上文之第1實施形態、或第2實施形態，對於此種局部之倍率誤差亦可容易地修正。 When the galvanometer mirror GM is used as the deflecting member for main scanning, the scanning speed in the main scanning direction of the focused light SP is not constant, and a slight speed difference may occur in the central portion and the peripheral portion of the drawing line SL1. This is because the change in the deflection angle of the beam LB1 due to the reciprocating vibration of the galvanometer mirror GM does not become linear with respect to the time axis. The speed unevenness of the focused light SP is expressed as a drawing magnification error of a part of the drawing pattern along the main scanning direction, in particular, a magnification error of the central portion and the peripheral portion of the drawing line SLn. According to the first embodiment or the second embodiment described above, such local magnification error can be easily corrected.
(變形例6)圖27係代替如多角鏡PM或檢流計鏡GM般改變反射來自光源裝置LS之射束LB1之反射面之角度而將射束LB1於主掃描方向偏向掃描，而係藉由機械性旋轉機構將射束LB1之聚焦光SP於被照 射體(基板P)上呈圓弧狀地掃描之方式之掃描單元UR1的立體圖。於圖27中，基板P係與正交座標系XYZ之XY面平行地配置，且為了進行副掃描而於X方向以特定速度移動。於掃描單元UR1設置有：鏡MR1，其將沿與Z軸平行地設定之射束送光系統之光軸AXu入射之射束LB1(剖面為圓形之平行射束)彎折成90度；聚光透鏡G30，其將具有與XY面平行之光軸AXv且由鏡MR1反射之射束LB1沿光軸AXv同軸地入射；及鏡MR2，其將與XY面平行之光軸AXv彎折成與Z軸平行之光軸AXw。聚光透鏡G30將所入射之射束LB1於基板P之表面(被照射面)聚光為聚焦光SP'。掃描單元UR1之殼體將鏡MR1、MR2、聚光透鏡G30保持為一體，且以與Z軸平行之光軸AXu為中心軸於與XY面平行之面內如箭頭AR朝一方向以特定速度高速旋轉。 (Modification 6) FIG. 27 is a method of changing the angle of the reflection surface of the beam LB1 from the light source device LS as in the case of the polygon mirror PM or the galvanometer mirror GM, and deflecting the beam LB1 in the main scanning direction. The focused light SP of the beam LB1 is illuminated by a mechanical rotating mechanism A perspective view of the scanning unit UR1 in such a manner that the projectile (substrate P) is scanned in an arc shape. In FIG. 27, the substrate P is disposed in parallel with the XY plane of the orthogonal coordinate system XYZ, and is moved at a specific speed in the X direction for sub-scanning. The scanning unit UR1 is provided with a mirror MR1 that bends a beam LB1 (a parallel beam having a circular cross section) incident on an optical axis AXu of the beam light-transmitting system set in parallel with the Z-axis to 90 degrees; a condenser lens G30 that coaxially transmits a beam LB1 having an optical axis AXv parallel to the XY plane and reflected by the mirror MR1 along the optical axis AXv; and a mirror MR2 that bends the optical axis AXv parallel to the XY plane into The optical axis AXw parallel to the Z axis. The condenser lens G30 condenses the incident beam LB1 on the surface (irradiated surface) of the substrate P into the focused light SP'. The housing of the scanning unit UR1 holds the mirrors MR1, MR2, and the collecting lens G30 integrally, and has a high speed at a specific speed in a direction parallel to the XY plane with the optical axis AXu parallel to the Z axis as a central axis. Rotate.
於被照射面上，若將與成為旋轉中心軸之光軸AXu之延長線交叉之點設為旋轉中心點CR，則藉由掃描單元UR1之旋轉，聚焦光SP'沿著以自旋轉中心點CR起長度Lam為半徑之圓進行掃描。該掃描單元UR1之構成中，聚焦光SP'可跨及半徑Lam之圓上之360度而投射至被照射面。然而，實際上係考慮副掃描方向及半徑Lam之圓之曲率，僅於掃描單元UR1處於固定之角度範圍θ u時，將根據描繪資料而經強度調變之聚焦光SP'投射至被照射面，並沿著與角度範圍θ u對應之圓弧狀之描繪線SL1'描繪圖案。本變形例之情形時，較佳為利用聚焦光SP'之圓弧狀之描繪線SL1'之掃描開始點Js與掃描結束點Je之副掃描方向(X方向)之各位置一致。 On the illuminated surface, if the point intersecting the extension line of the optical axis AXu which is the central axis of rotation is the rotation center point CR, the focused light SP' is along the center of the self-rotation by the rotation of the scanning unit UR1. CR scans a circle whose length Lam is a radius. In the configuration of the scanning unit UR1, the focused light SP' can be projected onto the illuminated surface across 360 degrees on the circle of the radius Lam. However, in practice, considering the curvature of the sub-scanning direction and the circle of the radius Lam, the intensity-modulated focused light SP' is projected onto the illuminated surface only when the scanning unit UR1 is in the fixed angular range θ u And the pattern is drawn along the arc-shaped drawing line SL1' corresponding to the angle range θ u . In the case of the present modification, it is preferable that the scanning start point Js of the arc-shaped drawing line SL1' of the focused light SP' coincides with the respective positions of the scanning direction (X direction) of the scanning end point Je.
又，本變形例之情形時，由於描繪線SL1'並非與Y軸平行之直線，故而與描繪資料相應之聚焦光SP'之強度調變之控制(時序)係只 要使圓弧狀之描繪線SL1'重合於描繪資料之二維之像素映射上，並根據與聚焦光SP'之掃描位置(掃描單元UR1之旋轉角度位置)相應之像素位元為描繪狀態(「1」)或非描繪狀態(「0」)而調變聚焦光SP'(射束LB1)之強度即可。為了即時精密地測量聚焦光SP'之掃描位置，於掃描單元UR1之殼體，較佳為與光軸AXu同軸地設置半徑Lam左右之旋轉編碼器用之刻度尺圓板。圖27中，將掃描單元UR1之殼體以自光軸AXu(旋轉中心點CR)沿徑向延伸之角柱狀示出，但為了減少旋轉時之軸晃動等而獲得穩定之旋轉特性，較理想為設為具有保持鏡MR1、MR2、聚光透鏡G30之Z方向之厚度之圓盤狀。 Further, in the case of the present modification, since the drawing line SL1' is not a straight line parallel to the Y-axis, the control (timing) of the intensity modulation of the focused light SP' corresponding to the drawing material is only The arc-shaped drawing line SL1' is superposed on the two-dimensional pixel map of the drawing material, and the pixel bit corresponding to the scanning position of the focused light SP' (the rotational angular position of the scanning unit UR1) is drawn ( The intensity of the focused light SP' (beam LB1) may be modulated by "1") or non-drawing state ("0"). In order to accurately and accurately measure the scanning position of the focused light SP', a scale disk for a rotary encoder having a radius of about 30 is provided coaxially with the optical axis AXu in the housing of the scanning unit UR1. In Fig. 27, the housing of the scanning unit UR1 is shown in a columnar shape extending in the radial direction from the optical axis AXu (rotation center point CR), but it is preferable to obtain stable rotation characteristics in order to reduce shaft sway or the like during rotation. The disk shape is set to have a thickness in the Z direction of the holding mirrors MR1, MR2 and the collecting lens G30.
[第3實施形態] [Third embodiment]
其次，對第3實施形態進行說明。再者，對於與上述各實施形態(亦包含變形例)相同之構成標附相同符號，僅對不同之處進行說明。作為上述各實施形態之變形例4而說明之圖25之構成中，藉由基於聚光透鏡CD與準直透鏡(準直透鏡)LC之複數個中繼系統，於來自光源裝置LSa(LSb)之射束LBa(LBb)製作複數個光束腰(聚光點)，於該光束腰之位置之各者配置有選擇用光學元件(聲光調變元件)AOM1~AOM6。射束LBa(LBb)之光束腰位置係以最終與基板P之表面(射束LB1~LB6之各聚焦光SP)光學上共軛之方式設定，因此即便因選擇用光學元件(聲光調變元件)AOM1~AOM6之特性變化等而使偏向角產生誤差，亦可抑制基板P上之聚焦光SP於副掃描方向(Xt方向)漂移。因此，於針對每個掃描單元Un，將基於聚焦光SP之描繪線SLn沿副掃描方向(Xt方向)在像素尺寸(數μm)程度之範圍內微調整之情形時，只要使上文之圖5所示之掃描單元Un內之平 行平板Sr2傾斜即可。進而，於使平行平板Sr2之傾斜自動化時，只要設置小型之壓電馬達或傾斜量之監控系統等機構即可。 Next, a third embodiment will be described. In addition, the same configurations as those of the above-described embodiments (including modifications) are denoted by the same reference numerals, and only differences will be described. In the configuration of FIG. 25 described as a modification 4 of each of the above embodiments, a plurality of relay systems based on the condenser lens CD and the collimator lens (collimator lens) LC are used in the light source device LSa (LSb). A plurality of beam waists (converging points) are formed by the beam LBa (LBb), and a selection optical element (acoustic and light modulation element) AOM1 to AOM6 is disposed at each of the positions of the beam waist. The beam waist position of the beam LBa (LBb) is set to be optically conjugate with the surface of the substrate P (the focused light SP of the beams LB1 to LB6), so that even the optical element for selection (acoustic and light modulation) The variation of the characteristics of the AOM1 to AOM6 causes an error in the deflection angle, and the focus light SP on the substrate P is prevented from drifting in the sub-scanning direction (Xt direction). Therefore, in the case where the drawing line SLn based on the focused light SP is finely adjusted in the sub-scanning direction (Xt direction) within the range of the pixel size (several μm) for each scanning unit Un, as long as the above figure is made The flat inside the scanning unit Un shown in 5 The flat plate Sr2 can be tilted. Further, when the inclination of the parallel flat plate Sr2 is automated, a mechanism such as a small piezoelectric motor or a tilt amount monitoring system may be provided.
然而，即便使平行平板Sr2之傾斜自動化，但仍為機械性驅動，故而難以進行具有與例如多角鏡PM之1旋轉之時間對應之較高之響應性的控制。對此，第3實施形態中，將上文之各實施形態或變形例之設置於曝光裝置(描繪裝置)EX之如圖7之光源裝置LS(LSa、LSb)至各掃描單元Un之射束送光系統(射束切換部BDU)之光學性構成或配置稍微變更，使選擇用光學元件(聲光調變元件)AOM1~AOM6兼具射束之開關功能以及將聚焦光SP之位置於副掃描方向進行微調整之移位功能。以下，藉由圖28~圖32來說明本第3實施形態之構成。 However, even if the inclination of the parallel flat plate Sr2 is automated, it is mechanically driven, so that it is difficult to perform control having high responsiveness corresponding to, for example, the time of one rotation of the polygon mirror PM. On the other hand, in the third embodiment, the light source device LS (LSa, LSb) of FIG. 7 provided in the exposure apparatus (drawing apparatus) EX in each of the above embodiments or modifications is directed to the beam of each scanning unit Un. The optical configuration or arrangement of the light-transmitting system (beam switching unit BDU) is slightly changed, so that the selection optical elements (acoustic-light modulation elements) AOM1 to AOM6 have both the switching function of the beam and the position of the focused light SP. The shifting function of the fine adjustment of the scanning direction. Hereinafter, the configuration of the third embodiment will be described with reference to Figs. 28 to 32.
圖28係詳細地表示上文之圖7所示之光源裝置LSa(LSb)之脈衝光產生部20內之波長轉換部之構成的圖，圖29係表示自光源裝置LSa(LSb)至最初之選擇用光學元件AOM1為止之射束LBa(省略LBb)之光路的圖，圖30係表示自選擇用光學元件AOM1至下一段選擇用光學元件AOM2為止之光路與選擇用光學元件AOM1之驅動器電路之構成的圖，圖31係說明選擇用光學元件AOM1之後之選擇用之鏡(分支反射鏡)IM1處之射束選擇與射束移位之情況的圖，圖32係說明自多角鏡PM至基板P為止之射束之行為的圖。 Fig. 28 is a view showing in detail the configuration of the wavelength converting portion in the pulse light generating portion 20 of the light source device LSa (LSb) shown in Fig. 7 above, and Fig. 29 shows the light source device LSa (LSb) from the initial stage. FIG. 30 shows a light path of the beam LBa (omitted from LBb) until the optical element AOM1 is selected, and FIG. 30 shows the optical path from the selection optical element AOM1 to the next selection optical element AOM2 and the driver circuit of the selection optical element AOM1. FIG. 31 is a view for explaining a case where beam selection at the mirror (branch mirror) IM1 after selection of the optical element AOM1 is selected and a beam shift, and FIG. 32 is a view illustrating the process from the polygon mirror PM to the substrate. A diagram of the behavior of the beam up to P.
如圖28所示，經放大之種子光Lse自光源裝置LSa內之光纖光放大器46之射出端46a以較小之發散角(NA：數值孔徑)射出。透鏡元件GL(GLa)係以種子光Lse於第1波長轉換元件48中成為光束腰之方式聚光。因此，藉由第1波長轉換元件48而經波長轉換之一次諧波射束具 有發散性地入射至透鏡元件GL(GLb)。透鏡元件GLb係以一次諧波射束於第2波長轉換元件50中成為光束腰之方式聚光。藉由第2波長轉換元件50而經波長轉換之二次諧波射束具有發散性地入射至透鏡元件GL(GLc)。透鏡元件GLc係以使二次諧波射束為大致平行之較細之射束LBa(LBb)且自光源裝置LSa之射出窗20H射出之方式配置。自射出窗20H射出之射束LBa之直徑為數mm以下，較佳為1mm左右。如此，波長轉換元件48、50之各者係以藉由透鏡元件GLa、GLb而與光纖光放大器46之射出端46a(發光點)光學上共軛之方式設定。因此，即便於因波長轉換元件48、50之結晶特性之變動而使所生成之諧波射束之行進方向略微傾斜之情形時，亦可抑制自射出窗20H射出之射束LBa之角度方向(方位)上之漂移。再者，圖28中係將透鏡元件GLc與射出窗20H相隔地示出，但亦可將透鏡元件GLc自身配置於射出窗20H之位置。 As shown in Fig. 28, the amplified seed light Lse is emitted from the emission end 46a of the optical fiber amplifier 46 in the light source device LSa at a small divergence angle (NA: numerical aperture). The lens element GL (GLa) is condensed so that the seed light Lse becomes a beam waist in the first wavelength conversion element 48. Therefore, the wavelength-converted first harmonic beam device by the first wavelength conversion element 48 It is incident on the lens element GL (GLb) in a divergent manner. The lens element GLb is condensed so that the first harmonic beam is incident on the second wavelength conversion element 50 as a beam waist. The second harmonic beam that has been wavelength-converted by the second wavelength conversion element 50 is incident on the lens element GL (GLc) in a divergent manner. The lens element GLc is disposed such that the second harmonic beam is a substantially parallel thin beam LBa (LBb) and is emitted from the emission window 20H of the light source device LSa. The diameter of the beam LBa emitted from the emission window 20H is several mm or less, preferably about 1 mm. As described above, each of the wavelength conversion elements 48 and 50 is set to be optically conjugate with the emission end 46a (light-emitting point) of the optical fiber amplifier 46 by the lens elements GLa and GLb. Therefore, even when the traveling direction of the generated harmonic beam is slightly inclined due to fluctuations in the crystal characteristics of the wavelength conversion elements 48 and 50, the angular direction of the beam LBa emitted from the emission window 20H can be suppressed ( Drift on the azimuth). In FIG. 28, the lens element GLc is shown spaced apart from the emission window 20H, but the lens element GLc itself may be disposed at the position of the emission window 20H.
如圖29所示，自射出窗20H射出之射束LBa沿著基於2個聚光透鏡CD0、CD1之擴束器系統之光軸AXj行進，轉換為射束直徑縮小為1/2左右之大致平行射束而入射至第1段選擇用光學元件AOM1。來自射出窗20H之射束LBa於聚光透鏡CD0與聚光透鏡CD1之間之聚光位置Pep成為光束腰。聚光透鏡CD1係作為上文之圖6(或圖24)中之聚光透鏡CD1而設置。進而，選擇用光學元件AOM1內之射束之偏向位置Pdf(繞射點)係以藉由基於聚光透鏡CD0、CD1之擴束器系統而與射出窗20H於光學上共軛之方式設定。進而，聚光位置Pep係以與圖28中之光纖光放大器46之射出端46a、波長轉換元件48、50之各者光學上共軛之方式設定。又，選擇用光學元件AOM1之射束之偏向方向、即開關時作為所入射之射束LBa 之一次繞射光射出之射束LB1之繞射方向被設定為Z方向(使基板P上之聚焦光SP於副掃描方向移位之方向)。通過選擇用光學元件AOM1之射束LBa例如成為射束直徑為約0.5mm左右之平行射束，作為一次繞射光射出之射束LB1亦成為射束直徑為約0.5mm左右之平行射束。亦即，於上述各實施形態(亦包含變形例)中係以於選擇用光學元件AOM1內成為光束腰之方式將射束LBa(LBb)收斂，但本第3實施形態中，將通過選擇用光學元件AOM1之射束LBa(LBb)設為具有微小直徑之平行射束。 As shown in Fig. 29, the beam LBa emitted from the emission window 20H travels along the optical axis AXj of the beam expander system based on the two condensing lenses CD0 and CD1, and is converted into a beam diameter of about 1/2. The parallel beam is incident on the first segment selection optical element AOM1. The condensing position Pep of the beam LBa from the emission window 20H between the condensing lens CD0 and the condensing lens CD1 becomes the beam waist. The condensing lens CD1 is provided as the condensing lens CD1 in Fig. 6 (or Fig. 24) above. Further, the deflection position Pdf (diffraction point) of the beam in the selection optical element AOM1 is set so as to be optically conjugate with the emission window 20H by the beam expander system based on the condensing lenses CD0 and CD1. Further, the condensing position Pep is set to be optically conjugate with the emission end 46a of the optical fiber amplifier 46 and the wavelength conversion elements 48 and 50 in Fig. 28 . Further, the direction in which the beam of the optical element AOM1 is deflected, that is, the switch is used as the incident beam LBa The diffraction direction of the beam LB1 emitted by the diffracted light is set to the Z direction (the direction in which the focused light SP on the substrate P is displaced in the sub-scanning direction). The beam LBa of the selection optical element AOM1 is, for example, a parallel beam having a beam diameter of about 0.5 mm, and the beam LB1 emitted as primary diffracted light also has a parallel beam having a beam diameter of about 0.5 mm. In other embodiments (including the modified example), the beam LBa (LBb) is converged so that the inside of the optical element AOM1 is the beam waist. However, in the third embodiment, the selection is performed. The beam LBa (LBb) of the optical element AOM1 is set as a parallel beam having a small diameter.
如圖30所示，透過選擇用光學元件AOM1之射束LBa、與開關時作為一次繞射光而偏向之射束LB1均入射至與光軸AXj同軸地配置之準直透鏡CL1(相當於圖6、或圖24中之透鏡CL1)。選擇用光學元件AOM1之偏向位置Pdf被設定為準直透鏡CL1之前側焦點之位置。因此，射束LBa與射束LB1以於準直透鏡(聚光透鏡)CL1之後側焦點之面Pip分別成為光束腰之方式收斂。沿著準直透鏡CL1之光軸AXj行進之射束LBa係以自面Pip發散之狀態入射至圖6(或圖24)所示之聚光透鏡(condenser lens)CD2，並再次成為射束直徑為0.5mm左右之平行射束，而入射至第2段選擇用光學元件AOM2。第2段選擇用光學元件AOM2之偏光位置Pdf係藉由基於準直透鏡CL1與聚光透鏡CD2之中繼系統而與選擇用光學元件AOM1之偏光位置Pdf配置成共軛關係。 As shown in FIG. 30, the beam LBa through the selection optical element AOM1 and the beam LB1 which is deflected as the primary diffracted light at the time of switching are incident on the collimator lens CL1 which is disposed coaxially with the optical axis AXj (corresponding to FIG. 6). Or the lens CL1) in Fig. 24. The deflection position Pdf of the selection optical element AOM1 is set to the position of the front focus of the collimator lens CL1. Therefore, the beam LBa and the beam LB1 converge in such a manner that the surface Pip of the rear focus of the collimator lens (condensing lens) CL1 becomes the beam waist. The beam LBA traveling along the optical axis AXj of the collimator lens CL1 is incident on the condenser lens CD2 shown in FIG. 6 (or FIG. 24) in a state of being diverged from the surface Pip, and becomes the beam diameter again. It is a parallel beam of about 0.5 mm, and is incident on the second-stage selection optical element AOM2. The polarization position Pdf of the second-stage selection optical element AOM2 is arranged in a conjugate relationship with the polarization position Pdf of the selection optical element AOM1 by the relay system based on the collimator lens CL1 and the condensing lens CD2.
圖6或圖24所示之選擇用之鏡IM1於本第3實施形態中係配置於準直透鏡CL1與聚光透鏡CD2之間之面Pip之附近。於面Pip，射束LBa、LB1成為最細之光束腰而於Z方向分離，因此鏡IM1之反射面IM1a之配置變得容易。選擇用光學元件AOM1之偏向位置Pdf與面Pip係藉由準 直透鏡CL1而成為光瞳位置與像面之關係，自準直透鏡CL1射向鏡IM1之反射面IM1a之射束LB1之中心軸(主光線)變得與射束LBa之主光線(光軸AXj)平行。於鏡IM1之反射面IM1a反射之射束LB1藉由與聚光透鏡CD2同等之準直透鏡CL1a而轉換為平行射束，射向圖5所示之掃描單元U1之鏡M10。再者，面Pip係藉由準直透鏡CL1與圖29中之聚光透鏡CD1而與聚光位置Pep成為光學上共軛之關係。因此，面Pip與圖28之光纖光放大器46之射出端46a、波長轉換元件48、50之各者亦為共軛之關係。亦即，面Pip係藉由以透鏡元件GLa、GLb、GLc、聚光透鏡CD0、CD1、及準直透鏡CL1構成之中繼透鏡系統而與光纖光放大器46之射出端46a、波長轉換元件48、50之各者共軛地設定。 The mirror IM1 for selection shown in Fig. 6 or Fig. 24 is disposed in the vicinity of the surface Pip between the collimator lens CL1 and the condensing lens CD2 in the third embodiment. In the surface Pip, the beams LBa and LB1 are the thinnest beam waists and are separated in the Z direction. Therefore, the arrangement of the reflecting surface IM1a of the mirror IM1 is facilitated. The bias position Pdf and the surface Pip of the optical element AOM1 are selected by the standard The straight lens CL1 is in the relationship between the pupil position and the image plane, and the central axis (principal ray) of the beam LB1 from the collimating lens CL1 toward the reflecting surface IM1a of the mirror IM1 becomes the chief ray of the beam LBa (optical axis) AXj) Parallel. The beam LB1 reflected by the reflecting surface IM1a of the mirror IM1 is converted into a parallel beam by the collimating lens CL1a equivalent to the collecting lens CD2, and is incident on the mirror M10 of the scanning unit U1 shown in FIG. Further, the surface Pip is optically conjugated with the condensing position Pep by the collimator lens CL1 and the condensing lens CD1 of FIG. Therefore, the face Pip is also conjugated to each of the output end 46a and the wavelength converting elements 48, 50 of the optical fiber amplifier 46 of FIG. That is, the surface Pip is connected to the emission end 46a of the optical fiber amplifier 46 and the wavelength conversion element 48 by the relay lens system including the lens elements GLa, GLb, GLc, the condenser lens CD0, CD1, and the collimator lens CL1. Each of 50 is conjugated.
準直透鏡CL1a之光軸AXm係與圖5中之照射中心線Le1同軸地設定，且於基於開關時之選擇用光學元件AOM1之射束LB1之偏向角為規定角度(基準之設定角)時，以射束LB1之中心線(主光線)成為與光軸AXm同軸之方式入射至準直透鏡CL1a。又，鏡IM1之反射面IM1a係如圖30般設為如下大小，即：以不遮斷射束LBa之光路之方式僅反射射束LB1，並且即便於到達至反射面IM1a之射束LB1於Z方向略微移位之情形時亦確實地反射射束LB1。但，於將選擇鏡IM1之反射面IM1a配置於面Pip之位置之情形時，製作出射束LB1於反射面IM1a上聚光而成之聚焦光，因此宜以反射面IM1a自面Pip之位置稍微偏移之方式將鏡IM1於X方向錯開配置。又，於反射面IM1a形成有紫外線耐性較高之反射膜(介電體多層膜)。 The optical axis AXm of the collimator lens CL1a is set coaxially with the illumination center line Le1 in FIG. 5, and when the deflection angle of the beam LB1 of the selection optical element AOM1 based on the switch is a predetermined angle (set angle of reference) The center line (principal ray) of the beam LB1 is incident on the collimator lens CL1a so as to be coaxial with the optical axis AXm. Further, the reflection surface IM1a of the mirror IM1 is set to have a size as shown in FIG. 30, that is, only the beam LB1 is reflected so as not to block the optical path of the beam LBa, and even after reaching the beam LB1 to the reflection surface IM1a The beam LB1 is also reflected exactly when the Z direction is slightly shifted. However, when the reflecting surface IM1a of the selective mirror IM1 is disposed at the position of the surface Pip, the focused light obtained by collecting the beam LB1 on the reflecting surface IM1a is formed. Therefore, it is preferable that the reflecting surface IM1a is slightly from the position of the surface Pip. In the manner of offset, the mirror IM1 is staggered in the X direction. Further, a reflective film (dielectric multilayer film) having high ultraviolet resistance is formed on the reflecting surface IM1a.
本第3實施形態中，於上文之圖12所示之選擇元件驅動控 制部102內，設置有用以使選擇用光學元件AOM1具有射束之開關功能與移位功能之兩者之驅動電路102A。驅動電路102A係由局部振盪電路102A1、混合電路102A2、及放大電路102A3所構成，該局部振盪電路102A1係接收用以將應施加至選擇用光學元件AOM1之驅動訊號HF1之頻率自基準頻率改變之修正訊號FSS，而生成與應針對基準頻率進行修正之頻率相應的修正高頻訊號，該混合電路102A2係將由基準振盪器102S製作之穩定之頻率之高頻訊號與來自局部振盪電路102A1之修正高頻訊號以頻率進行加減運算之方式合成，該放大電路102A3係將於混合電路102A2中經頻率合成之高頻訊號轉換為放大至適於選擇用光學元件AOM1之超音波振子之驅動之振幅的驅動訊號HF1。放大電路102A3具備響應於圖12之選擇元件驅動控制部102中生成之入射允許訊號LP1而將高頻之驅動訊號HF1切換為高位準與低位準(或振幅零)之開關功能。因此，於驅動訊號HF1為高位準之振幅之期間(訊號LP1為H位準期間)，選擇用光學元件AOM1將射束LBa偏向而生成射束LB1。如以上之圖30之鏡IM1與準直透鏡CL1a之光學系統及驅動電路102A對於其他選擇用光學元件AOM2~AOM6之各者亦同樣地設置。於以上之構成中，局部振盪電路102A1與混合電路102A2作為根據修正訊號FSS之值使驅動訊號HF1之頻率變化之頻率調變電路發揮功能。 In the third embodiment, the selection component driving control shown in FIG. 12 above is controlled. Inside the system 102, a drive circuit 102A for causing the selection optical element AOM1 to have both a switching function and a shift function of the beam is provided. The driving circuit 102A is composed of a partial oscillating circuit 102A1, a mixing circuit 102A2, and an amplifying circuit 102A3. The local oscillating circuit 102A1 receives a frequency for changing the frequency of the driving signal HF1 to be applied to the selecting optical element AOM1 from the reference frequency. The correction signal FSS is generated to generate a modified high frequency signal corresponding to the frequency to be corrected for the reference frequency, and the hybrid circuit 102A2 is configured to stabilize the high frequency signal of the stable frequency produced by the reference oscillator 102S and the correction from the local oscillation circuit 102A1. The frequency signal is synthesized by frequency addition and subtraction, and the amplifying circuit 102A3 converts the frequency-synthesized high-frequency signal in the hybrid circuit 102A2 into a drive that is amplified to an amplitude suitable for driving the ultrasonic transducer of the optical element AOM1. Signal HF1. The amplifying circuit 102A3 is provided with a switching function for switching the high frequency driving signal HF1 to a high level and a low level (or amplitude zero) in response to the incident enable signal LP1 generated in the selection element drive control unit 102 of FIG. Therefore, during the period in which the drive signal HF1 is at the high level amplitude (the signal LP1 is in the H level period), the selection optical element AOM1 deflects the beam LBa to generate the beam LB1. The optical system and the drive circuit 102A of the mirror IM1 and the collimator lens CL1a of the above-described FIG. 30 are also provided in the same manner for each of the other selection optical elements AOM2 to AOM6. In the above configuration, the local oscillation circuit 102A1 and the hybrid circuit 102A2 function as a frequency modulation circuit that changes the frequency of the drive signal HF1 in accordance with the value of the correction signal FSS.
於該驅動電路102A中，於修正訊號FSS表示修正量零之情形時，自放大電路102A3之輸出之驅動訊號HF1之頻率被設定為如基於選擇用光學元件AOM1之射束LB1之偏向角成為規定角度(基準之設定角)之規定頻率。於修正訊號FSS表示修正量+△Fs之情形時，以基於選擇用光 學元件AOM1之射束LB1之偏向角相對於規定角度增加△θ γ之方式修正驅動訊號HF1之頻率。於修正訊號FSS表示修正量-△Fs之情形時，以基於選擇用光學元件AOM1之射束LB1之偏向角相對於規定角度減少△θ γ之方式修正驅動訊號HF1之頻率。若射束LB1之偏向角相對於規定角度變化±△θ γ，則入射至鏡IM1之反射面IM1a之射束LB1之位置略向Z方向移位，自準直透鏡CL1a射出之射束LB1(平行射束)相對於光軸AXm略微傾斜。藉由圖31對該情況進行進一步說明。 In the driving circuit 102A, when the correction signal FSS indicates the correction amount of zero, the frequency of the driving signal HF1 output from the amplifying circuit 102A3 is set to be as specified by the deflection angle of the beam LB1 based on the selecting optical element AOM1. The specified frequency of the angle (set angle of the reference). When the correction signal FSS indicates the correction amount + ΔFs, the light is selected based on The frequency of the drive signal HF1 is corrected in such a manner that the deflection angle of the beam LB1 of the element AOM1 is increased by Δθ γ with respect to a predetermined angle. When the correction signal FSS indicates the correction amount -ΔFs, the frequency of the drive signal HF1 is corrected such that the deflection angle of the beam LB1 based on the selection optical element AOM1 is decreased by Δθ γ with respect to the predetermined angle. When the deflection angle of the beam LB1 is changed by ±Δθ γ with respect to the predetermined angle, the position of the beam LB1 incident on the reflection surface IM1a of the mirror IM1 is slightly displaced in the Z direction, and the beam LB1 emitted from the collimator lens CL1a ( The parallel beam) is slightly inclined with respect to the optical axis AXm. This situation is further illustrated by Figure 31.
圖31係表示誇大地表示藉由選擇用光學元件AOM1而偏向之射束LB1之移位之情況之光路圖。於射束LB1藉由選擇用光學元件AOM1而以規定角度偏向之情形時，射束LB1之中心軸成為與準直透鏡CL1a之光軸AXm同軸。此時，自準直透鏡CL1射出之射束LB1之中心軸係自原先之射束LBa之中心軸(光軸AXj)向-Z方向隔開△SF0。若自該狀態將驅動選擇用光學元件AOM1之驅動訊號HF1之頻率提高例如△Fs，則選擇用光學元件AOM1處之射束LB1之偏向角相對於規定角度增加△θ γ，到達至鏡IM1之射束LB1'之中心軸AXm'自光軸AXj向-Z方向隔開△SF1而存在。如此，根據驅動訊號HF1之頻率之△Fs之變化，射向鏡IM1之射束LB1'之中心軸AXm'自規定位置(與光軸AXm同軸之位置)向-Z方向橫向移位(平行移動)△SF1-△SF0。 Fig. 31 is a view showing an optical path in which the displacement of the beam LB1 deflected by the selection optical element AOM1 is exaggerated. When the beam LB1 is deflected by a predetermined angle by the selection optical element AOM1, the central axis of the beam LB1 is coaxial with the optical axis AXm of the collimator lens CL1a. At this time, the central axis of the beam LB1 emitted from the collimator lens CL1 is separated from the central axis (optical axis AXj) of the original beam LBa by ΔSF0 in the -Z direction. If the frequency of the driving signal HF1 for driving the selection optical element AOM1 is increased by, for example, ΔFs from this state, the deflection angle of the beam LB1 at the selection optical element AOM1 is increased by Δθ γ with respect to a predetermined angle, and reaches the mirror IM1. The central axis AXm' of the beam LB1' exists from the optical axis AXj in the -Z direction by ΔSF1. Thus, according to the change of the ΔFs of the frequency of the driving signal HF1, the central axis AXm' of the beam LB1' incident on the mirror IM1 is laterally displaced from the predetermined position (the position coaxial with the optical axis AXm) in the -Z direction (parallel movement) ) ΔSF1-ΔSF0.
於光軸AXm上，存在相當於面Pip之面Pip'，於該面Pip'，射束LB1(LB1')以成為光束腰之方式聚光。自面Pip'射向準直透鏡CL1a之射束LB1'之中心軸AXm'與光軸AXm平行，且藉由將面Pip'設定於準直透鏡CL1a之前側焦點之位置，而自準直透鏡CL1a射出之射束LB1'轉換為相 對於光軸AXm於XZ面內略微傾斜之平行射束。本第3實施形態中，以面Pip'最終與基板P之表面(聚焦光SP)共軛之方式，配置掃描單元U1內之透鏡系統(圖5中之透鏡Be1、Be2、柱面透鏡CYa、CYb、f θ透鏡TF)。 On the optical axis AXm, there is a surface Pip' corresponding to the surface Pip, on which the beam LB1 (LB1') is concentrated as a beam waist. The central axis AXm' of the beam LB1' from the face Pip' to the collimating lens CL1a is parallel to the optical axis AXm, and the self-collimating lens is set by setting the face Pip' to the position of the front focus of the collimating lens CL1a. The beam LB1' emitted by CL1a is converted into phase A parallel beam that is slightly tilted in the XZ plane for the optical axis AXm. In the third embodiment, the lens system in the scanning unit U1 is disposed such that the surface Pip' is finally conjugated to the surface (focusing light SP) of the substrate P (the lenses Be1, Be2, the cylindrical lens CYa in Fig. 5, CYb, f θ lens TF).
圖32係將自掃描單元U1內之多角鏡PM之1個反射面RP(RPa)至基板P為止之光路展開而自Yt方向觀察之圖。藉由選擇用光學元件AOM1而以規定角度偏向之射束LB1於與XtYt面平行之面內入射至多角鏡PM之反射面RPa而反射。入射至反射面RPa之射束LB1於XtZt面內係藉由圖5所示之第1柱面透鏡CYa而於反射面RPa上向Zt方向收斂。於反射面RPa反射之射束LB1於包含f θ透鏡FT之光軸AXf且與XtYt面平行之面內根據多角鏡PM之旋轉速度而高速地偏向，且經由f θ透鏡FT與第2柱面透鏡CYb而於基板P上聚光為聚焦光SP。聚焦光SP於圖31中係於與紙面垂直之方向一維掃描。 Fig. 32 is a view showing the optical path from the one reflecting surface RP (RPa) of the polygon mirror PM in the scanning unit U1 to the substrate P, and is viewed from the Yt direction. The beam LB1 deflected at a predetermined angle by the selection optical element AOM1 is incident on the reflection surface RPa of the polygon mirror PM in a plane parallel to the XtYt plane, and is reflected. The beam LB1 incident on the reflecting surface RPa converges in the Zt direction on the reflecting surface RPa by the first cylindrical lens CYa shown in FIG. 5 in the XtZt plane. The beam LB1 reflected on the reflecting surface RPa is deflected at a high speed in accordance with the rotational speed of the polygon mirror PM in a plane including the optical axis AXf of the f θ lens FT and parallel to the XtYt plane, and passes through the f θ lens FT and the second cylinder. The lens CYb is concentrated on the substrate P as the focused light SP. The focused light SP is one-dimensionally scanned in the direction perpendicular to the plane of the paper in FIG.
另一方面，如圖31般於面Pip'相對於射束LB1橫向移位△SF1-△SF0後之射束LB1'入射至多角鏡PM之反射面RPa上之相對於射束LB之照射位置略向Zt方向偏移之位置。藉此，於反射面RPa反射之射束LB1'之光路以於XtZt面內與射束LB1之光路略微偏移之狀態通過f θ透鏡FT與第2柱面透鏡CYb而於基板P上聚光為聚焦光SP'。多角鏡PM之反射面RPa在光學上配置為f θ透鏡FT之光瞳面，藉由利用2個柱面透鏡CYa、CYb之面傾斜修正之作用，而於圖32之XtZt面內，反射面RPa與基板P之表面成為共軛關係。因此，若照射至多角鏡PM之反射面RPa上之射束LB1如射束LB1'般向Zt方向略微移位，則基板P上之聚焦光SP如聚焦光SP'般於副掃描方向移位△SFp。 On the other hand, as shown in Fig. 31, the beam LB1' after the plane Pip' is laterally shifted by ΔSF1 - ΔSF0 with respect to the beam LB1 is incident on the reflecting surface RPa of the polygon mirror PM with respect to the irradiation position of the beam LB. A position slightly offset from the Zt direction. Thereby, the optical path of the beam LB1' reflected by the reflecting surface RPa is condensed on the substrate P by the f θ lens FT and the second cylindrical lens CYb in a state where the XtZt plane is slightly offset from the optical path of the beam LB1. To focus on the light SP'. The reflecting surface RPa of the polygon mirror PM is optically arranged as the pupil plane of the f θ lens FT, and by the surface tilt correction using the two cylindrical lenses CYa and CYb, the reflecting surface is in the XtZt plane of FIG. RPa has a conjugate relationship with the surface of the substrate P. Therefore, if the beam LB1 irradiated onto the reflecting surface RPa of the polygon mirror PM is slightly displaced in the Zt direction as the beam LB1', the focused light SP on the substrate P is shifted in the sub-scanning direction like the focused light SP'. △ SFp.
如以上之構成，藉由使選擇用光學元件AOM1之驅動訊號HF1之頻率自規定頻率變化±△Fs，可使聚焦光SP於副掃描方向移位±△SFp。該移位量(｜△SFp｜)雖受到選擇用光學元件AOM1自身之偏向角之最大範圍、鏡IM1之反射面IM1a之大小、掃描單元U1內之至多角鏡PM為止之光學系統(中繼系統)之倍率、多角鏡PM之反射面之Zt方向之幅、自多角鏡PM至基板P為止之倍率(f θ透鏡FT之倍率)等之限制，但被設定為聚焦光SP之基板P上之有效大小(直徑)程度、或於描繪資料上定義之像素尺寸(Pxy)程度之範圍。當然，亦可設定為其以上之移位量。再者，雖係關於選擇用光學元件AOM1及掃描單元U1進行了說明，但關於其他選擇用光學元件AOM2~AOM6及掃描單元U2~U6亦同樣。 According to the above configuration, the focus light SP can be shifted by ±ΔSFp in the sub-scanning direction by changing the frequency of the driving signal HF1 of the selecting optical element AOM1 by ±ΔFs from the predetermined frequency. The shift amount (|ΔSFp|) is subjected to the optical system of the maximum range of the deflection angle of the selection optical element AOM1 itself, the size of the reflection surface IM1a of the mirror IM1, and the polygon mirror PM in the scanning unit U1 (relay) The magnification of the system, the width of the reflection surface of the polygon mirror PM in the Zt direction, the magnification from the polygon mirror PM to the substrate P (the magnification of the f θ lens FT), etc., but is set to the substrate P of the focused light SP The effective size (diameter) or the extent of the pixel size (Pxy) defined on the data. Of course, it can also be set to the above shift amount. Further, although the selection optical element AOM1 and the scanning unit U1 have been described, the same applies to the other selection optical elements AOM2 to AOM6 and the scanning units U2 to U6.
如此，本第3實施形態中，可將選擇用光學元件AOMn(AOM1~AOM6)兼用於響應入射允許訊號LPn(LP1~LP6)之射束之開關功能、與響應修正訊號FSS之聚焦光SP之移位功能，因此對各掃描單元Un(U1~U6)供給射束之射束送光系統(射束切換部BDU)之構成變得簡單。進而，與在每個掃描單元Un分別設置射束選擇用與聚焦光SP之移位用之聲光調變元件(AOM或AOD)之情形相比，可減少發熱源，而可提高曝光裝置EX之溫度穩定性。尤其，驅動聲光調變元件之驅動電路(102A)成為較大之發熱源，但由於驅動訊號HF1為50MHz以上之高頻，故而配置於聲光調變元件之附近。即便設置冷卻驅動電路(102A)之機構，若其數量較多，則裝置內之溫度亦容易於短時間內上升，從而有可能會因光學系統(透鏡或鏡)之基於溫度變化之變動而導致描繪精度降低。因此，較理想為成為熱源之驅動電路、及聲光調變元件較少。又，於選擇用光學元件 AOMn(AOM1~AOM6)之各者受溫度變化之影響而使作為入射射束LBa(LBb)之一次繞射光偏向之射束LBn之偏向角變動之情形時，在本第3實施形態中，可藉由設置將圖30之賦予至驅動電路102A之修正訊號FSS之值根據溫度變化而調整之反饋控制系統，而容易地抵消偏向角之變動。 As described above, in the third embodiment, the selection optical element AOMn (AOM1 to AOM6) can be used for both the switching function of the beam in response to the incident enable signal LPn (LP1 to LP6) and the focused light SP of the response correction signal FSS. Since the shift function is applied, the configuration of the beam light-emitting system (beam switching unit BDU) that supplies the beam to each of the scanning units Un (U1 to U6) is simplified. Further, compared with the case where the acousto-optic modulation element (AOM or AOD) for shifting the beam selection and the focused light SP is separately provided for each scanning unit Un, the heat source can be reduced, and the exposure apparatus EX can be improved. Temperature stability. In particular, the drive circuit (102A) for driving the acousto-optic modulation element becomes a large heat source. However, since the drive signal HF1 has a high frequency of 50 MHz or more, it is disposed in the vicinity of the acousto-optic modulation element. Even if the mechanism of the cooling drive circuit (102A) is provided, if the number is large, the temperature inside the device is likely to rise in a short time, which may cause a change in temperature of the optical system (lens or mirror) due to temperature changes. The drawing accuracy is reduced. Therefore, it is preferable that the drive circuit to be a heat source and the acousto-optic modulation element are small. In addition, in the selection of optical components In the case where each of AOMn (AOM1 to AOM6) is subjected to a change in temperature and the deflection angle of the beam LBn which is the primary diffracted light of the incident beam LBa (LBb) fluctuates, in the third embodiment, The variation of the deflection angle is easily offset by providing a feedback control system that adjusts the value of the correction signal FSS given to the drive circuit 102A of FIG. 30 according to the temperature change.
本第3實施形態之選擇用光學元件AOMn之射束移位功能係可將來自複數個掃描單元Un之各者之射束LBn之聚焦光SPn之描繪線SLn之位置高速地於副掃描方向進行微調整。例如，若將圖30所示之選擇用光學元件AOM1以每當入射允許訊號LP1成為H位準時便改變基於修正訊號FSS之修正量之方式進行控制，則可針對多角鏡PM之每個反射面、即聚焦光SP之每次掃描，使描繪線SL1於副掃描方向在像素大小(或聚焦光之大小)程度之範圍內移位。因此，使鄰接之掃描單元Un之各者繞著照射中心軸Le1~Le6略微旋轉而調整各描繪線SLn之斜率之後，以如上文之第1實施形態或第2實施形態之方式修正描繪倍率，此外如第3實施形態般使描繪線SLn於副掃描方向移位，藉此可提高各描繪線SLn之端部之圖案描繪時之連接之精度。又，於相對於已形成在基板P之基底圖案重疊描繪新的圖案時，亦可提高該重疊之精度。 In the beam shifting function of the optical element AOMn for selection according to the third embodiment, the position of the drawing line SLn of the focused light SPn from the beam LBn of each of the plurality of scanning units Un can be performed at a high speed in the sub-scanning direction. Micro adjustment. For example, if the selection optical element AOM1 shown in FIG. 30 is controlled in such a manner that the correction amount based on the correction signal FSS is changed every time the incident permission signal LP1 becomes H level, each reflection surface of the polygon mirror PM can be used. That is, each scan of the focused light SP shifts the drawing line SL1 in the sub-scanning direction within the range of the pixel size (or the size of the focused light). Therefore, after the adjacent scanning unit Un rotates slightly around the irradiation center axes Le1 to Le6 to adjust the slope of each drawing line SLn, the drawing magnification is corrected as in the first embodiment or the second embodiment described above. Further, as in the third embodiment, the drawing line SLn is displaced in the sub-scanning direction, whereby the accuracy of the connection at the time of pattern drawing of the end portions of the respective drawing lines SLn can be improved. Further, when a new pattern is superimposed on the base pattern formed on the substrate P, the accuracy of the overlap can be improved.
以上之第3實施形態中，基板P之表面(射束LBn聚光成為聚焦光SP之位置)、與圖31中之面Pip'係設定為相互共軛之關係，進而，面Pip'(Pip)與光源裝置LSa(LSb)中之波長轉換元件48、50、光纖光放大器46之射出端46a之各者亦設定為相互共軛之關係。因此，於將多角鏡PM之反射面之1個設定為向固定之朝向靜止之狀態，並將射束LBn經由f θ透鏡FT與柱面透鏡CYb而作為聚焦光SP投射至基板P之表面之1點之情 形時，即便因波長轉換元件48、50之結晶特性之變化而使諧波射束之行進方向在角度上進行漂移，亦不會受其影響，而基板P上之聚焦光SP靜止。該情形意味著，聚焦光SP之主掃描方向之掃描開始位置、或響應原點訊號SD之描繪開始位置穩定而不會於主掃描方向漂移。因此，能夠長時間以穩定之精度進行圖案描繪。 In the third embodiment described above, the surface of the substrate P (the position at which the beam LBn is condensed to be the focused light SP) and the surface Pip' in Fig. 31 are set to be conjugate with each other, and further, the surface Pip' (Pip) Each of the wavelength conversion elements 48 and 50 and the emission end 46a of the optical fiber amplifier 46 in the light source device LSa (LSb) is also set to be conjugate with each other. Therefore, one of the reflecting surfaces of the polygon mirror PM is set to be in a state of being stationary toward the fixed direction, and the beam LBn is projected as the focused light SP onto the surface of the substrate P via the f θ lens FT and the cylindrical lens CYb. 1 point In the case of the shape, even if the traveling direction of the harmonic beam is angularly shifted due to the change in the crystal characteristics of the wavelength converting elements 48, 50, the focused light SP on the substrate P is stationary. This means that the scanning start position of the main scanning direction of the focused light SP or the drawing start position in response to the origin signal SD is stable and does not drift in the main scanning direction. Therefore, pattern drawing can be performed with stable accuracy for a long time.
[第3實施形態之變形例] [Modification of Third Embodiment]
上述第3實施形態亦可進行如下之變形。上述各實施形態或其變形例中，以基於複數個掃描單元Un(U1~U6)之各者之描繪線SLn(SL1~SL6)於主掃描方向(Y方向)偏移且於端部連接之方式配置掃描單元Un，以便能夠覆蓋圖案描繪區域(曝光區域W)之Y方向之寬度。然而，例如，如日本專利特開2014-160130號公報所揭示，即便為如多條描繪線SLn(複數個掃描射束)於副掃描方向偏移而配置之串疊方式之描繪裝置，亦可藉由變更光學系統之配置，而與第3實施形態同樣地，使選擇用光學元件AOMn兼用作開關功能與聚焦光SP(描繪線SLn)之移位功能。 The third embodiment described above can also be modified as follows. In each of the above-described embodiments or their modifications, the drawing lines SLn (SL1 to SL6) of the plurality of scanning units Un (U1 to U6) are shifted in the main scanning direction (Y direction) and connected at the ends. The scanning unit Un is configured in such a manner as to cover the width of the Y-direction of the pattern drawing area (exposure area W). However, as disclosed in Japanese Laid-Open Patent Publication No. 2014-160130, even a drawing device in which a plurality of drawing lines SLn (a plurality of scanning beams) are arranged to be shifted in the sub-scanning direction may be used. By changing the arrangement of the optical system, similarly to the third embodiment, the selection optical element AMn is also used as a shift function of the switching function and the focused light SP (drawing line SLn).
圖33係表示如下之串疊方式之描繪裝置之概略構成之一部分之圖，該串疊方式之描繪裝置係對1個多角鏡PM之不同之2個反射面RPa、RPb之各者投射根據描繪圖案(描繪之圖案)而經強度調變之射束LB1、LB2，由反射面PRa反射之射束LB1入射至具有與X軸平行之光軸AXf1之第1f θ透鏡FT(以下為FT1)，由反射面PRb反射之射束LB2入射至具有與X軸平行之光軸AXf2之第2f θ透鏡FT(以下為FT2)。第1f θ透鏡FT1與第2f θ透鏡FT2雖於圖33中省略了圖示，但如上文之圖5所示之f θ透鏡FT般配置，於第1、第2各f θ透鏡FT1、FT2之後，同樣設置 有鏡M15、第2柱面透鏡CYb。再者，有時亦會為簡化說明而省略一部分之構成之圖示，並省去其說明。 FIG. 33 is a view showing a part of a schematic configuration of a tandem type drawing device for projecting each of two different reflection surfaces RPa and RPb of one polygon mirror PM. The beam LB1 and LB2 whose intensity is modulated by the pattern (the pattern of drawing), the beam LB1 reflected by the reflecting surface PRa is incident on the first f θ lens FT (hereinafter referred to as FT1) having the optical axis AXf1 parallel to the X axis. The beam LB2 reflected by the reflecting surface PRb is incident on the second f θ lens FT (hereinafter referred to as FT2) having the optical axis AXf2 parallel to the X-axis. Although the first fθ lens FT1 and the second f θ lens FT2 are not shown in FIG. 33, they are arranged like the f θ lens FT shown in FIG. 5 above, and the first and second f θ lenses FT1 and FT2. After that, the same setting There is a mirror M15 and a second cylindrical lens CYb. Further, in some cases, a part of the configuration is omitted for simplification of explanation, and the description thereof is omitted.
上文之圖7所示之來自光源裝置LSa之射束LBa係經由圖28、圖29所示之光學系統成為射束直徑為0.5mm左右之平行射束而入射至最初之選擇用光學元件(聲光調變元件)AOM1。藉由切換為偏向狀態之選擇用光學元件AOM1而作為一次繞射光偏向之射束LB1係如圖30中所說明般，藉由準直透鏡(聚光透鏡)CL1而於鏡IM1之附近成為光束腰而聚光。藉由鏡IM1向-Z方向反射之射束LB1係藉由如圖31般配置之準直透鏡CL1a而再次變化為平行射束，由鏡M13(以下為M13a)反射而入射至第1柱面透鏡CYa(以下為CYa1)。藉由第1柱面透鏡CYa1而僅於Z方向收斂之射束LB1被照射至繞與Z軸平行之旋轉中心AXp旋轉之多角鏡PM之第1反射面RPa。反射面RPa被設定為位於具有光軸AXf1之未圖示之第1f θ透鏡(掃描用透鏡)FT1之光瞳面，射束LB1於基板P(被照射體)之表面保持遠心之狀態而進行一維掃描。 The beam LBa from the light source device LSa shown in FIG. 7 described above is incident on the first selection optical element by a parallel beam having a beam diameter of about 0.5 mm via the optical system shown in FIGS. 28 and 29 ( Acousto-optic modulation component) AOM1. The beam LB1 which is deflected by the selective optical element AOM1 by the switching optical element AOM1 as shown in FIG. 30 is lighted in the vicinity of the mirror IM1 by the collimator lens (condensing lens) CL1. Gathering at the waist. The beam LB1 reflected by the mirror IM1 in the -Z direction is again changed into a parallel beam by the collimator lens CL1a arranged as shown in FIG. 31, and is reflected by the mirror M13 (hereinafter referred to as M13a) and incident on the first cylinder. Lens CYa (hereinafter CYa1). The beam LB1 that converges only in the Z direction by the first cylindrical lens CYa1 is irradiated to the first reflection surface RPa of the polygon mirror PM that rotates around the rotation center AXp parallel to the Z axis. The reflection surface RPa is set to a pupil plane of the first f θ lens (scanning lens) FT1 (not shown) having the optical axis AXf1, and the beam LB1 is held in a state where the surface of the substrate P (irradiated body) is held at a telecentric state. One-dimensional scanning.
又，於選擇用光學元件AOM1切換為非偏向狀態之情形時，入射至選擇用光學元件AOM1之射束LBa沿著準直透鏡(聚光透鏡)CL1之光軸(AXj)直行，於選擇用之鏡IM1之上方空間成為光束腰而收斂之後，成為發散射束並由鏡M2反射。由鏡M2反射之射束LBa藉由聚光透鏡CD2而再次轉換為平行射束，由鏡M3反射，併入射至第2段選擇用光學元件AOM2。鏡M2、M3與聚光透鏡CD2係與上文之圖6或圖24所示者相同，選擇用光學元件AOM1與選擇用光學元件AOM2之各偏向位置Pdf係藉由基於準直透鏡(聚光透鏡)CL1與聚光透鏡CD2之中繼系統而設定為共軛 關係。 Further, when the selection optical element AOM1 is switched to the non-biased state, the beam LBa incident on the selection optical element AOM1 goes straight along the optical axis (AXj) of the collimator lens (condensing lens) CL1 for selection. After the space above the mirror IM1 is converged as a beam waist, it becomes a scatter beam and is reflected by the mirror M2. The beam LBa reflected by the mirror M2 is again converted into a parallel beam by the condensing lens CD2, reflected by the mirror M3, and incident on the second-stage selecting optical element AOM2. The mirrors M2, M3 and the collecting lens CD2 are the same as those shown in FIG. 6 or FIG. 24 above, and the respective deflecting positions Pdf of the selecting optical element AOM1 and the selecting optical element AOM2 are based on a collimating lens (concentrating light) Lens) CL1 and concentrating lens CD2 relay system set to conjugate relationship.
藉由切換為偏向狀態之選擇用光學元件AOM2而作為一次繞射光偏向之射束LB2係藉由準直透鏡(聚光透鏡)CL2而於鏡IM2之附近成為光束腰而聚光。藉由鏡IM2而向-Z方向反射之射束LB2係藉由如圖31般配置之準直透鏡CL2a而再次變化為平行射束，由鏡M13(以下為M13b)反射而入射至第1柱面透鏡CYa(以下為CYa2)。藉由第1柱面透鏡CYa2而僅於Z方向收斂之射束LB2被照射至多角鏡PM之第2反射面RPb。反射面RPb被設定為位於具有光軸AXf2之未圖示之第2f θ透鏡(掃描用透鏡)FT2之光瞳面，射束LB2於基板P(被照射體)之表面保持遠心之狀態而進行一維掃描。於選擇用光學元件AOM1、AOM2之兩者為非偏向狀態之情形時，透過選擇用光學元件AOM2之射束LBa藉由聚光透鏡CD3而再次轉換為平行射束，射向與第2段選擇用光學元件AOM2配置成共軛關係之第3段選擇用光學元件AOM3。 The beam LB2, which is the primary diffracted light deflected by the selection optical element AOM2, which is switched to the deflected state, is collected by the collimator lens (condensing lens) CL2 in the vicinity of the mirror IM2. The beam LB2 reflected in the -Z direction by the mirror IM2 is again changed into a parallel beam by the collimator lens CL2a arranged as shown in FIG. 31, and is reflected by the mirror M13 (hereinafter referred to as M13b) and incident on the first column. Face lens CYa (hereinafter referred to as CYa2). The beam LB2 that converges only in the Z direction by the first cylindrical lens CYa2 is irradiated onto the second reflection surface RPb of the polygon mirror PM. The reflecting surface RPb is set to be on the pupil plane of the second f θ lens (scanning lens) FT2 (not shown) having the optical axis AXf2, and the beam LB2 is held in a state of being telecentric on the surface of the substrate P (irradiated body). One-dimensional scanning. When both of the selection optical elements AOM1 and AOM2 are in an unbiased state, the beam LBa through the selection optical element AOM2 is again converted into a parallel beam by the condensing lens CD3, and is selected for the second stage. The third segment selection optical element AOM3 is arranged in the conjugate relationship by the optical element AOM2.
此處，包含第1f θ透鏡FT1、及其後之鏡M15(以下為M15a)與第2柱面透鏡CYb(以下為CYb1)在內而設為第1掃描用光學系統，包含第2f θ透鏡FT2、及其後之鏡M15(以下為M15b)與第2柱面透鏡CYb(以下為CYb2)在內而設為第2掃描用光學系統。來自第1掃描用光學系統之射束LB1之聚焦光之掃描軌跡(描繪線SL1)、與來自第2掃描用光學系統之射束LB2之聚焦光之掃描軌跡(描繪線SL2)於圖33中在X方向(副掃描方向)錯開配置。 Here, the 1st f θ lens FT1 and the subsequent mirror M15 (hereinafter referred to as M15a) and the second cylindrical lens CYb (hereinafter referred to as CYb1) are used as the first scanning optical system, and include the 2fth θ lens. The FT2 and the subsequent mirror M15 (hereinafter referred to as M15b) and the second cylindrical lens CYb (hereinafter referred to as CYb2) are used as the second scanning optical system. The scanning trajectory (drawing line SL1) of the focused light from the beam LB1 of the first scanning optical system and the scanning trajectory (drawing line SL2) of the focused light from the beam LB2 of the second scanning optical system are shown in FIG. The configuration is shifted in the X direction (sub-scanning direction).
此種串疊型之描繪裝置中，可將藉由基於第1掃描用光學系統之描繪線SL1描繪之圖案、與藉由基於第2掃描用光學系統之描繪線SL2 描繪之圖案於基板P(被照射體)上之同一曝光區域W內重疊曝光(雙重曝光)，或者將其等於在基板P之搬送方向(長尺寸方向)相隔之2個曝光區域W之各者曝光。於該情形時，藉由對施加至選擇用光學元件AOM1之驅動訊號HF1、施加至選擇用光學元件AOM2之驅動訊號HF2之任一者或兩者賦予頻率調變，可將描繪線SL1與SL2之搬送方向(副掃描方向)之間隔距離進行微調整，而可提高雙重曝光時之重疊精度。又，若將如圖33之構成之射束掃描裝置應用於多色(RGB、CMY)之雷射射束印表機等，則亦可將所印刷之圖像之色偏差抑制為較小。 In the tandem type drawing device, the pattern drawn by the drawing line SL1 based on the first scanning optical system and the drawing line SL2 based on the second scanning optical system can be used. The drawn pattern is overlap-exposed (double exposure) in the same exposure region W on the substrate P (irradiated body), or is equal to each of the two exposure regions W spaced apart in the transport direction (long dimension direction) of the substrate P. exposure. In this case, the rendering lines SL1 and SL2 can be given by applying frequency modulation to either or both of the driving signal HF1 applied to the selecting optical element AOM1 and the driving signal HF2 applied to the selecting optical element AOM2. The distance between the transport directions (sub-scanning directions) is finely adjusted, and the superimposition accuracy at the time of double exposure can be improved. Further, when the beam scanning device having the configuration shown in Fig. 33 is applied to a multi-color (RGB, CMY) laser beam printer or the like, the color deviation of the printed image can be suppressed to be small.
以上，本變形例中，藉由將來自光源裝置LSa之射束LBa串聯地通過2個(複數個)選擇用光學元件(聲光調變元件)AOM1、AOM2，將任一個選擇用光學元件AOMn切換為偏向狀態，而可選擇性地切換自不同角度方向射向多角鏡PM之反射面之描繪用之射束(LBn)。選擇用光學元件AOM1、AOM2之各者之向偏光狀態/非偏向狀態之切換之時序可自由地設定。例如，於僅藉由描繪線SL1(第1掃描用光學系統)於基板P上描繪圖案之情形時，只要以將入射允許訊號LP1(圖12、圖30)設為主動之狀態(如圖13般響應原點訊號SZ1而反覆生成H位準之狀態)且將入射允許訊號LP2保持L位準之方式進行限制即可。 As described above, in the present modification, any one of the selection optical elements AOMn is obtained by passing the beam LBa from the light source device LSa in series through two (plural) selection optical elements (acoustic and light modulation elements) AOM1 and AOM2. Switching to the deflected state, the beam (LBn) for drawing the reflecting surface of the polygon mirror PM from different angular directions can be selectively switched. The timing of switching between the polarization state and the non-bias state of each of the optical elements AOM1 and AOM2 can be freely set. For example, when the pattern is drawn on the substrate P by the drawing line SL1 (the first scanning optical system), the incident permission signal LP1 (FIG. 12, FIG. 30) is set to be active (FIG. 13). It is preferable to limit the state in which the H-level is generated in response to the origin signal SZ1 and to maintain the incident enable signal LP2 at the L level.
[第4實施形態] [Fourth embodiment]
上述之第1~第3實施形態、及其等之各變形例中，將用以將來自光源裝置LSa(LSb)之射束LBa(LBb)選擇性地供給至掃描單元Un(U1~U6)之任一者之選擇用光學元件AOMn(AOM1~AOM6)設為聲光調變元件。即，雖係將相對於入射射束以特定之繞射角偏向而輸出之一次繞射光作為 描繪用之射束LBn供給至掃描單元Un，但選擇用光學元件AOMn(AOM1~AOM6)亦可為不使用繞射現象之電光偏向構件。圖34表示第4實施形態之射束切換部BDU內之與1個掃描單元Un對應之射束切換部之構成，本實施形態中，設置入射來自光源裝置LSa(LSb)之射束LBa(LBb)之電光元件OSn及根據透過電光元件OSn之射束之偏光特性而使射束透過或將其反射之偏光分光器BSn，以代替上文之圖25所示之選擇用光學元件AOM1與單元側入射鏡IM1之組合系統、或圖30所示之選擇用光學元件AOM1、準直透鏡CL1、單元側入射鏡IM1之組合系統。 In the first to third embodiments described above and the modifications thereof, the beam LBa (LBb) from the light source device LSa (LSb) is selectively supplied to the scanning unit Un (U1 to U6). The selection optical element AOMn (AOM1 to AOM6) is used as an acousto-optic modulation element. That is, although the primary diffracted light that is output with respect to the incident beam at a specific diffraction angle is used as The drawing beam LBn is supplied to the scanning unit Un, but the selection optical element AOMn (AOM1 to AOM6) may be an electro-optic deflecting member that does not use a diffraction phenomenon. Fig. 34 shows a configuration of a beam switching unit corresponding to one scanning unit Un in the beam switching unit BDU of the fourth embodiment. In the present embodiment, a beam LBa (LBb) incident from the light source device LSa (LSb) is provided. In place of the selection optical element AOM1 and the unit side shown in FIG. 25, the electro-optical element OSn and the polarization beam splitter BSn that transmits or reflects the beam according to the polarization characteristics of the beam transmitted through the electro-optical element OSn. A combination system of the incident mirrors IM1, or a combination system of the selection optical elements AOM1, the collimator lenses CL1, and the unit side incident mirrors IM1 shown in FIG.
於圖34中，於將自光源裝置LSa(LSb)成為平行射束而射出之射束LBa(LBb)之行進方向設定為與X軸平行時，若將入射至電光元件OSn之射束LBa(LBb)設為向Y方向偏光之直線偏光，對形成於電光元件OSn之在Y方向對向之面之電極EJp、EJm之間施加數Kv之電壓，則透過電光元件OSn之射束成為自入射時之偏光狀態旋轉90度而向Z方向偏光之直線偏光，併入射至偏光分光器BSn。於不對電極EJp、EJm間施加電壓之情形時，透過電光元件OSn之射束成為直接以入射時之偏光狀態向Y方向偏光之直線偏光。因此，於電極EJp、EJm間之電壓為零之斷開狀態時，來自電光元件OSn之射束直接透過立方體狀之偏光分光器BSn之偏光分割面psp(相對於XY面與YZ面之各者傾斜45度之面)。於對電極EJp、EJm間施加電壓之接通狀態時，來自電光元件OSn之射束由偏光分光器BSn之偏光分割面psp反射，而成為根據描繪資料(例如圖14中之描繪位元串資料SBa、SBb)經強度調變之描繪用之射束LBn而射向掃描單元Un。電光元件OSn係由呈現於被施加之電場強度之一次方時折射率變化之泡克耳斯 效應、或於被施加之電場強度之二次方時折射率變化之克爾效應之結晶介質或非晶介質所構成。又，電光元件OSn亦可為呈現代替電場而因磁場使折射率變化之法拉第效應之結晶介質。 In Fig. 34, when the traveling direction of the beam LBa (LBb) emitted from the light source device LSa (LSb) as a parallel beam is set to be parallel to the X-axis, the beam LBa (o) incident on the electro-optical element OSn ( LBb) is a linearly polarized light that is polarized in the Y direction, and a voltage of several Kv is applied between the electrodes EJp and EJm formed on the surface opposite to the Y direction of the electro-optical element OSn, and the beam transmitted through the electro-optical element OSn becomes self-incident. When the polarization state is rotated by 90 degrees, the linearly polarized light is polarized in the Z direction, and is incident on the polarization beam splitter BSn. When a voltage is not applied between the electrodes EJp and EJm, the beam transmitted through the electro-optical element OSn becomes a linearly polarized light that is directly polarized in the Y direction in a polarized state at the time of incidence. Therefore, when the voltage between the electrodes EJp and EJm is zero, the beam from the electro-optical element OSn directly passes through the polarization splitting plane psp of the cube-shaped polarizing beam splitter BSn (relative to each of the XY plane and the YZ plane). Tilt to a 45 degree surface). When a voltage is applied between the counter electrodes EJp and EJm, the beam from the electro-optical element OSn is reflected by the polarization splitting plane psp of the polarizing beam splitter BSn, and is based on the drawing data (for example, the bit string data depicted in FIG. 14). SBa, SBb) are directed to the scanning unit Un by the beam LBn for intensity modulation. The electro-optic element OSn is a bubbler that exhibits a refractive index change at the primary of the applied electric field strength. The effect or the crystalline medium or amorphous medium of the Kerr effect of the refractive index change at the quadratic time of the applied electric field strength. Further, the electro-optical element OSn may be a crystal medium exhibiting a Faraday effect of changing the refractive index by a magnetic field instead of an electric field.
圖35表示將構成圖6(或圖24)所示之射束切換部BDU之選擇用光學元件AOM1~AOM6與單元側入射鏡IM1~IM6置換成圖34之構成之變形例。自光源裝置LSa作為平行射束(射束直徑為1mm以下)射出之直線偏光之射束LBa係經由如圖25、圖30所示之聲光調變元件、或使用聲光偏向元件(AOD)之射束移位器部SFTa，依序通過電光元件OS1、偏光分光器BS1、電光元件OS2、偏光分光器BS2、電光元件OS3、偏光分光器BS3之後，入射至吸收體TR1。偏光分光器BS1係於對電光元件OS1施加有電場時，將射束LBa作為描繪用之射束LB1朝向掃描單元U1反射。同樣地，偏光分光器BS2係於對電光元件OS2施加有電場時，將射束LBa作為描繪用之射束LB2朝向掃描單元U2反射，偏光分光器BS3係於對電光元件OS3施加有電場時，將射束LBa作為描繪用之射束LB3朝向掃描單元U3反射。圖35中，僅對電光元件OS1~OS3中之電光元件OS2施加電場，自射束移位器部SFTa射出之射束LBa作為射束LB2僅入射至掃描單元U2。 Fig. 35 shows a modification in which the selection optical elements AOM1 to AOM6 and the unit side entrance mirrors IM1 to IM6 constituting the beam switching unit BDU shown in Fig. 6 (or Fig. 24) are replaced by Fig. 34. The linearly polarized beam LBa emitted from the light source device LSa as a parallel beam (having a beam diameter of 1 mm or less) passes through the acousto-optic modulation element shown in FIGS. 25 and 30, or uses an acousto-optic deflecting element (AOD). The beam shifter unit SFTa sequentially passes through the electro-optical element OS1, the polarization beam splitter BS1, the electro-optical element OS2, the polarization beam splitter BS2, the electro-optical element OS3, and the polarization beam splitter BS3, and then enters the absorber TR1. The polarizing beam splitter BS1 is configured to reflect the beam LBa as the drawing beam LB1 toward the scanning unit U1 when an electric field is applied to the electro-optical element OS1. Similarly, when the electric field is applied to the electro-optical element OS2, the polarization beam splitter BS2 reflects the beam LBa as the drawing beam LB2 toward the scanning unit U2, and the polarization beam splitter BS3 applies an electric field to the electro-optical element OS3. The beam LBa is reflected as a beam LB3 for drawing toward the scanning unit U3. In FIG. 35, an electric field is applied only to the electro-optical element OS2 of the electro-optical elements OS1 to OS3, and the beam LBa emitted from the beam shifter unit SFTa is incident only on the scanning unit U2 as the beam LB2.
同樣地，自光源裝置LSb作為平行射束(射束直徑為1mm以下)射出之直線偏光之射束LBb係經由使用聲光偏向元件(AOD)之射束移位器部SFTb，依序通過電光元件OS4、偏光分光器BS4、電光元件OS5、偏光分光器BS5、電光元件OS6、偏光分光器BS6之後，入射至吸收體TR2。偏光分光器BS4係於對電光元件OS4施加有電場時，將射束LBb作為描繪 用之射束LB4朝向掃描單元U4反射，偏光分光器BS5係於對電光元件OS5施加有電場時，將射束LBb作為描繪用之射束LB5朝向掃描單元U5反射，偏光分光器BS6係於對電光元件OS6施加有電場時，將射束LBb作為描繪用之射束LB6朝向掃描單元U6反射。圖35中，僅對電光元件OS4~OS6中之電光元件OS6施加電場，自射束移位器部SFTb射出之射束LBb作為射束LB6僅入射至掃描單元U6。 Similarly, the linearly polarized beam LBb emitted from the light source device LSb as a parallel beam (beam diameter of 1 mm or less) passes through the beam shifter portion SFTb using the acousto-optic deflecting element (AOD), and sequentially passes the electro-optic beam. The element OS4, the polarization beam splitter BS4, the electro-optical element OS5, the polarization beam splitter BS5, the electro-optical element OS6, and the polarization beam splitter BS6 are incident on the absorber TR2. The polarizing beam splitter BS4 is configured to depict the beam LBb when an electric field is applied to the electro-optical element OS4. The beam LB4 is reflected toward the scanning unit U4. When the polarizing beam splitter BS5 applies an electric field to the electro-optical element OS5, the beam LBb is reflected toward the scanning unit U5 as the drawing beam LB5, and the polarization beam splitter BS6 is paired. When an electric field is applied to the electro-optical element OS6, the beam LBb is reflected as a beam LB6 for drawing toward the scanning unit U6. In FIG. 35, an electric field is applied only to the electro-optical element OS6 of the electro-optical elements OS4 to OS6, and the beam LBb emitted from the beam shifter unit SFTb is incident only on the scanning unit U6 as the beam LB6.
作為一例，射束移位器部SFTa、SFTb係使用聲光偏向元件AODs而如圖36般構成。聲光偏向元件AODs係根據來自與圖30所示之驅動電路102A同樣之驅動電路之驅動訊號HFn而被驅動。來自光源裝置LSa(LSb)之平行之射束LBa(LBb)係與光軸同軸而入射至焦點距離f1之透鏡CG1，且以於面pu成為光束腰之方式聚光。聲光偏向元件AODs之偏向點配置於面pu之位置。於驅動訊號HFn為斷開之狀態下，於面pu成為光束腰之射束LBa(LBb)不會繞射，而係自面pu入射至焦點距離f2之透鏡CG2，成為平行射束而由鏡OM反射併入射至吸收體TR3。於驅動訊號HFn施加至聲光偏向元件AODs之接通狀態時，聲光偏向元件AODs生成以與驅動訊號HFn之頻率相應之繞射角偏向之射束LBa(LBb)之一次繞射光。該一次繞射光於此處稱為經偏向之射束LBa(LBb)。聲光偏向元件AODs之偏向點配置於為透鏡CG2之焦點距離f2之位置之面pu，因此自透鏡CG2射出之經偏向之射束LBa(LBb)成為與透鏡CG2之光軸平行之平行射束，入射至圖35之電光元件OS1、或OS4。 As an example, the beam shifter units SFTa and SFTb are configured as shown in FIG. 36 using the acousto-optic deflecting element AODs. The acousto-optic deflecting element AODs are driven in accordance with a driving signal HFn from the same driving circuit as the driving circuit 102A shown in FIG. The parallel beam LBa (LBb) from the light source device LSa (LSb) is incident on the lens CG1 having the focal length f1 coaxially with the optical axis, and is concentrated so that the surface pu becomes the beam waist. The deflection point of the acousto-optic deflecting element AODs is disposed at the position of the surface pu. When the drive signal HFn is off, the beam LBa (LBb) is not diffracted on the surface pu, but is incident on the lens CG2 from the surface pu to the focal length f2, and becomes a parallel beam. The mirror OM reflects and is incident on the absorber TR3. When the driving signal HFn is applied to the ON state of the acousto-optic deflecting element AODs, the acousto-optic deflecting element AODs generates the primary diffracted light of the beam LBa (LBb) which is deflected by the diffraction angle corresponding to the frequency of the driving signal HFn. This primary diffracted light is referred to herein as a deflected beam LBa (LBb). The deflection point of the acousto-optic deflecting element AODs is disposed on the plane pu which is the position of the focal length f2 of the lens CG2, so that the deflected beam LBa(LBb) emitted from the lens CG2 becomes a parallel beam parallel to the optical axis of the lens CG2. The light is incident on the electro-optical element OS1, or OS4 of FIG.
藉由改變被施加至聲光偏向元件AODs之驅動訊號HFn之頻率，自透鏡CG2射出之射束LBa(LBb)以與透鏡CG2之光軸平行之狀 態於與光軸垂直之方向位置變換。射束LBa(LBb)之位置變換之方向於圖34所示之電光元件OSn(OS1或OS4)之入射端面上對應於Z方向，移位量對應於驅動訊號HFn之頻率之變化量。本實施形態之情形時，射束移位器部SFTa相對於3個掃描單元U1、U2、U3共通地設置。因此，被施加至聲光偏向元件AODs之驅動訊號HFn之頻率係與圖35之電光元件OS1~OS3之任一個、或電光元件OS4~OS6之任一個成為接通狀態之時序同步地，以與針對自對應於成為接通狀態之電光元件OSn之掃描單元Un射出之射束LBn所設定之聚焦光SP之向副掃描方向(X方向)之移位量△SFp(參照圖32)對應之方式相應地進行調變(FM調變)。藉此，通過電光元件OS1~OS3(OS4~OS6)之射束LBa(LBb)在圖34中於Z方向平行地移位，由偏光分光器BS1~BS3(BS4~BS6)反射之射束LBn(LB1~Lb6)在圖34中於X方向平行移位。藉此，如圖32中所說明，聚焦光SP於副掃描方向移位△SFp。再者，圖36中，射束LBa(LBb)以於聲光偏向元件AODs之偏向點收斂為光束腰之方式構成，但亦可設為將穿過聲光偏向元件AODs之射束LBa(LBb)設為如圖30般較細之平行射束，且於如圖31之狀態下使分配至各掃描單元U1~U6之射束LBn略微移位之構成。 By changing the frequency of the driving signal HFn applied to the acousto-optic deflecting element AODs, the beam LBa (LBb) emitted from the lens CG2 is changed in position parallel to the optical axis of the lens CG2 in a direction perpendicular to the optical axis. The direction of the position change of the beam LBa (LBb) corresponds to the Z direction on the incident end face of the electro-optical element OSn (OS1 or OS4) shown in FIG. 34, and the shift amount corresponds to the amount of change in the frequency of the drive signal HFn. In the case of the present embodiment, the beam shifter unit SFTa is provided in common to the three scanning units U1, U2, and U3. Therefore, the frequency of the driving signal HFn applied to the acousto-optic deflecting element AODs is synchronized with the timing of any one of the electro-optical elements OS1 to OS3 of FIG. 35 or the electro-optical elements OS4 to OS6 being turned on. A method corresponding to the shift amount ΔSFp (see FIG. 32) of the focused light SP set in the beam LBn corresponding to the beam LBn emitted from the scanning unit Un of the electro-optical element OSn in the ON state, in the sub-scanning direction (X direction) Modulate (FM modulation) accordingly. Thereby, the beam LBa(LBb) passing through the electro-optical elements OS1 to OS3 (OS4 to OS6) is displaced in parallel in the Z direction in FIG. 34, and the beam LBn reflected by the polarization beam splitters BS1 to BS3 (BS4 to BS6). (LB1 to Lb6) are shifted in parallel in the X direction in Fig. 34. Thereby, as illustrated in FIG. 32, the focused light SP is shifted by ΔSFp in the sub-scanning direction. Further, in Fig. 36, the beam LBa (LBb) is configured such that the deflection point of the acousto-optic deflecting element AODs converges to the beam waist, but may be set to the beam LBA through the acousto-optic deflecting element AODs ( LBb) is a parallel beam which is thinner as shown in Fig. 30, and the beam LBn assigned to each of the scanning units U1 to U6 is slightly shifted as shown in Fig. 31.
以上，本實施形態中，為了將來自光源裝置LSa(LSb)之射束LBa(LBb)選擇性地分配(切換)至3個掃描單元U1~U3(U4~U6)之任一個，而使用了不具有偏向作用之電光元件OS1~OS3(OS4~OS6)，因此，為了使聚焦光SP於副掃描方向移位，將基於具有偏向作用之聲光偏向元件AODs之射束移位器SFTa(SFTb)設置於光路上之電光元件OS1~OS3(OS4~OS6)之上游側。若如此構成，則將3個掃描單元U1~U3(U4 ~U6)之各者中之聚焦光SP之向副掃描方向之高速之移位動作利用基於1個聲光偏向元件AODs之射束移位器SFTa(SFTb)來進行，因此，可減少聲光偏向元件及其驅動電路之數量，而可減少熱源。 As described above, in the present embodiment, in order to selectively distribute (switch) the beam LBa (LBb) from the light source device LSa (LSb) to any of the three scanning units U1 to U3 (U4 to U6), it is used. Since the electro-optical elements OS1 to OS3 (OS4 to OS6) do not have a biasing action, in order to shift the focused light SP in the sub-scanning direction, the beam shifter SFTa (SFTb) based on the acousto-optic deflecting element AODs having a biasing action is used. ) is disposed on the upstream side of the electro-optical elements OS1 to OS3 (OS4 to OS6) on the optical path. If so configured, three scanning units U1~U3 (U4) The high-speed shifting operation of the focused light SP in the sub-scanning direction in each of the ~U6) is performed by the beam shifter SFTa (SFTb) based on one acousto-optic deflecting element AODs, thereby reducing the sound and light The number of biasing elements and their drive circuits reduces heat sources.
[變形例] [Modification]
圖37表示代替於上述之各實施形態或變形例中使用之選擇用光學元件AOM1~AOM6、AOMa、AOMb或聲光偏向元件AODs而設置且不依靠繞射作用之射束偏向構件之一例。圖37(A)表示於以特定之厚度形成為稜鏡狀(三角形)之透過性之結晶介質之對向之平行之側面(圖37(A)中為上下表面)形成有電極EJp、EJm之電光元件ODn。結晶介質係作為化學組成由KDP(KH2PO4)、ADP(NH4H2PO4)、KD*P(KD2PO4)、KDA(KH2AsO4)、BaTiO3、SrTiO3、LiNbO3、LiTaO3等表示之材料。自電光元件ODn之一斜面入射之射束LBa(LBb)係於電極EJp、EJm間之電場為零時，根據結晶介質之初始之折射率與空氣之折射率之差而偏向，並自另一斜面射出。若對電極EJp、EJm間施加固定值以上之電場，則結晶介質之折射率自初始值變化，因此所入射之射束LBa(LBb)成為自另一斜面以與初始之角度不同之角度射出之射束LBn。即便使用此種電光元件ODn，亦可將來自光源裝置LSa(LSb)之射束LBa(LBb)分時切換並供給至掃描單元U1~U6之各者。又，藉由改變施加至電光元件ODn之電場強度，使射出之射束LBn之偏向角略微高速地改變，因此，亦可使電光元件ODn兼具開關功能以及使基板P上之聚焦光SP於副掃描方向移位微量之功能。進而，亦可代替如圖36之單獨之射束移位器部SFTa(SFTb)之聲光偏向元件AOMs而使用電光元件ODn。 Fig. 37 shows an example of a beam deflecting member which is provided instead of the diffraction action, instead of the selection optical elements AOM1 to AOM6, AOMa, AOMb or the acousto-optic deflecting element AODs used in the above-described respective embodiments or modifications. 37(A) shows the side faces (the upper and lower surfaces in FIG. 37(A)) which are parallel to each other in the direction in which the transparent crystal medium having a specific thickness is formed into a meandering shape (triangle) is formed with electrodes EJp and EJm. Electro-optic element ODn. The crystallization medium is used as a chemical composition from KDP (KH 2 PO 4 ), ADP (NH 4 H 2 PO 4 ), KD*P (KD 2 PO 4 ), KDA (KH 2 AsO 4 ), BaTiO 3 , SrTiO 3 , LiNbO. 3 , LiTaO 3 and other materials. When the electric field between the electrodes EJp and EJm is zero, the beam LBa(LBb) incident from one of the electro-optical elements ODn is biased according to the difference between the initial refractive index of the crystal medium and the refractive index of the air, and is biased from the other The bevel is shot. When an electric field of a fixed value or more is applied between the electrodes EJp and EJm, the refractive index of the crystal medium changes from the initial value, so that the incident beam LBa (LBb) is emitted from the other inclined surface at an angle different from the initial angle. Beam LBn. Even if such an electro-optical element ODn is used, the beam LBa (LBb) from the light source device LSa (LSb) can be switched and supplied to each of the scanning units U1 to U6 in a time-division manner. Further, by changing the intensity of the electric field applied to the electro-optical element ODn, the deflection angle of the emitted beam LBn is slightly changed at a high speed. Therefore, the electro-optical element ODn can also have a switching function and the focused light SP on the substrate P can be The sub-scanning direction shifts the function of a small amount. Further, instead of the acousto-optic deflecting element AOMs of the individual beam shifter portion SFTa (SFTb) of Fig. 36, the electro-optical element ODn may be used.
圖37(B)表示例如日本專利特開2014-081575號公報、國 際公開公報WO2005/124398號手冊所揭示之使用基於KTN(KTa1-xNbxO3)晶體之電光元件KDn之射束偏向構件之例。於圖37(B)中，電光元件KDn係由沿著射束LBa(LBb)之行進方向形成為較長之角柱狀之結晶介質、與夾著該結晶介質而對向配置之電極EJp、EJm所構成。電光元件KDn係以保持為固定之溫度(例如40多度)之方式收納於具有調溫功能之盒體內。於電極EJp、EJm間之電場強度為零時，自角柱狀之KTN結晶介質之一端面入射之射束LBa(LBb)於KTN結晶介質內直行而自另一端面射出。若對電極EJp、EJm間施加電場強度，則通過KTN結晶介質內之射束LBa(LBb)於電場之方向偏向，自另一端面作為射束LBn射出。KTN結晶介質亦係根據電場之強度而折射率變化之材料，但與上文所列舉之各種結晶介質相比，可於低一位程度之電場強度(數百V)獲得較大之折射率變化。因此，若改變施加至電極EJp、EJm間之電壓，則可將自電光元件KDn射出之射束LBn之相對於原先之射束LBa(LBb)之偏向角於相對較大之範圍(例如，0度~5度)內高速地調整。 FIG. 37(B) shows a beam deflection of an electro-optic element KDn based on a KTN (KTa 1-x Nb x O 3 ) crystal disclosed in the manual of Japanese Laid-Open Patent Publication No. 2014-081575, No. WO2005/124398. An example of a component. In Fig. 37(B), the electro-optical element KDn is a crystal medium formed into a long columnar shape along the traveling direction of the beam LBa (LBb), and an electrode EJp, EJm disposed opposite to the crystal medium. Composition. The electro-optical element KDn is housed in a case having a temperature adjustment function so as to be maintained at a fixed temperature (for example, 40 degrees or more). When the electric field intensity between the electrodes EJp and EJm is zero, the beam LBa (LBb) incident from one end face of the KTN crystal medium of the angular column shape is straight in the KTN crystal medium and is emitted from the other end surface. When an electric field intensity is applied between the electrodes EJp and EJm, the beam LBa (LBb) in the KTN crystal medium is deflected in the direction of the electric field, and is emitted as the beam LBn from the other end surface. The KTN crystallization medium is also a material whose refractive index changes according to the strength of the electric field, but can obtain a larger refractive index change at a lower electric field strength (hundreds of V) than the various crystallization mediums listed above. . Therefore, if the voltage applied between the electrodes EJp and EJm is changed, the deflection angle of the beam LBn emitted from the electro-optical element KDn with respect to the original beam LBa (LBb) can be in a relatively large range (for example, 0). Adjusted at a high speed within ~5 degrees).
即便使用此種電光元件KDn，亦可將來自光源裝置LSa(LSb)之射束LBa(LBb)分時切換並供給至掃描單元U1~U6之各者。又，藉由改變施加至電光元件KDn之電場強度，使射出之射束LBn之偏向角高速地改變，因此，亦可使電光元件KDn兼具開關功能以及使基板P上之聚焦光SP於副掃描方向移位之功能。進而，亦可代替如圖36之單獨之射束移位器部SFTa(SFTb)之聲光偏向元件AOMs而使用電光元件KDn。 Even when such an electro-optical element KDn is used, the beam LBa (LBb) from the light source device LSa (LSb) can be switched and supplied to each of the scanning units U1 to U6 in a time-division manner. Further, by changing the electric field intensity applied to the electro-optical element KDn, the deflection angle of the emitted beam LBn is changed at a high speed. Therefore, the electro-optical element KDn can also have a switching function and the focused light SP on the substrate P can be made to the sub-electrode. The function of shifting the direction of the scan. Further, instead of the acousto-optic deflecting element AOMs of the individual beam shifter portion SFTa (SFTb) of Fig. 36, the electro-optical element KDn may be used.
102‧‧‧選擇元件驅動控制部 102‧‧‧Select component drive control unit
102A‧‧‧驅動電路 102A‧‧‧Drive Circuit
102A1‧‧‧局部振盪電路 102A1‧‧‧Local Oscillation Circuit
102A2‧‧‧混合電路 102A2‧‧‧ mixed circuit
102A3‧‧‧放大電路 102A3‧‧‧Amplification circuit
102S‧‧‧基準振盪器 102S‧‧‧ reference oscillator
AOM1、AOM2‧‧‧選擇用光學元件 AOM1, AOM2‧‧‧Select optical components
AXj、AXm‧‧‧光軸 AXj, AXm‧‧‧ optical axis
CD2‧‧‧聚光透鏡 CD2‧‧‧ concentrating lens
CL1、CL1a‧‧‧準直透鏡 CL1, CL1a‧‧ ‧ collimating lens
FSS‧‧‧修正訊號 FSS‧‧‧ correction signal
HF1‧‧‧驅動訊號(高頻訊號) HF1‧‧‧ drive signal (high frequency signal)
LB1、LBa‧‧‧射束 LB1, LBa‧‧‧ beam
LP1‧‧‧入射允許訊號 LP1‧‧‧ incident allowable signal
Pdf‧‧‧偏向位置 Pdf‧‧‧ biased position
Pip‧‧‧面 Pip‧‧‧ face
IM1‧‧‧單元側入射鏡 IM1‧‧‧ unit side entrance mirror
IM1a‧‧‧反射面 IM1a‧‧‧reflecting surface
X‧‧‧方向 X‧‧‧ direction
Y‧‧‧方向 Y‧‧‧ direction
Z‧‧‧方向 Z‧‧‧ direction
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2016
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| TWI667530B (en) * | 2017-09-28 | 2019-08-01 | 日商紐富來科技股份有限公司 | Inspection method and inspection device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116974156A (en) | 2023-10-31 |
| JP6651768B2 (en) | 2020-02-19 |
| WO2017057415A1 (en) | 2017-04-06 |
| TW202038024A (en) | 2020-10-16 |
| JP2017067823A (en) | 2017-04-06 |
| CN109991733B (en) | 2021-07-30 |
| HK1257067A1 (en) | 2019-10-11 |
| HK1248829A1 (en) | 2018-10-19 |
| CN108931899B (en) | 2021-08-06 |
| TWI762965B (en) | 2022-05-01 |
| CN108931899A (en) | 2018-12-04 |
| CN109991733A (en) | 2019-07-09 |
| CN110082905B (en) | 2022-06-03 |
| KR20180058728A (en) | 2018-06-01 |
| CN110082905A (en) | 2019-08-02 |
| CN108139690A (en) | 2018-06-08 |
| TWI701525B (en) | 2020-08-11 |
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