TW201727245A - Electronic component transfer apparatus and electronic component inspection apparatus - Google Patents
Electronic component transfer apparatus and electronic component inspection apparatus Download PDFInfo
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- TW201727245A TW201727245A TW106113657A TW106113657A TW201727245A TW 201727245 A TW201727245 A TW 201727245A TW 106113657 A TW106113657 A TW 106113657A TW 106113657 A TW106113657 A TW 106113657A TW 201727245 A TW201727245 A TW 201727245A
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- refrigerant
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2601—Apparatus or methods therefor
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
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- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
本發明係關於一種電子零件搬送裝置及電子零件檢查裝置。The present invention relates to an electronic component conveying device and an electronic component inspection device.
先前以來，例如已知有檢查IC(integrated circuit，積體電路)元件等電子零件之電氣特性之電子零件檢查裝置，且於該電子零件檢查裝置，裝入有用以將IC元件搬送至檢查部之保持部為止之電子零件搬送裝置。IC元件之檢查時係將IC元件配置於保持部，使設置於保持部之複數個探針與IC元件之各端子接觸。如此之IC元件之檢查存在將IC元件冷卻至特定溫度而進行之情形。於專利文獻1中，記載有以內部具有設定為特定之溫度之均熱室及測試室，且IC晶片於測試室中進行檢查之方式構成之IC處置器。而且，為進行IC元件之冷卻，而使用對均熱室及測試室供給冷風之冷凍裝置。冷凍裝置係以與IC處置器分開且與該IC處置器相鄰之方式設置於地板上。[先前技術文獻][專利文獻] [專利文獻1]日本專利特開2000-46904號公報For example, an electronic component inspection device for inspecting electrical characteristics of an electronic component such as an IC (integrated circuit) component has been known, and the electronic component inspection device is loaded with an IC component for transporting the IC component to the inspection unit. The electronic component transport device up to the holding unit. In the inspection of the IC element, the IC element is placed in the holding portion, and the plurality of probes provided in the holding portion are brought into contact with the respective terminals of the IC element. The inspection of such an IC component is carried out by cooling the IC component to a specific temperature. Patent Document 1 describes an IC handler including a soaking chamber and a test chamber which are set to have a specific temperature inside, and an IC wafer is inspected in a test chamber. Further, in order to cool the IC device, a refrigerating device that supplies cold air to the soaking chamber and the test chamber is used. The freezer is placed on the floor in a manner separate from the IC handler and adjacent to the IC handler. [Prior Art Document] [Patent Document] [Patent Document 1] Japanese Patent Laid-Open Publication No. 2000-46904
[發明所欲解決之問題] 然而，專利文獻1係於例如使IC處置器移動搬送之情形時，必須亦將冷凍裝置一同地搬送，導致搬送作業變得繁雜。又，搬送作業係事先地將連接IC處置器與冷凍裝置之配管暫時地解除之後進行。而且，於搬送目的地，必須再次使用配管，將IC處置器與冷凍裝置重新連接，導致設置作業變得繁雜。 本發明之目的在於提供一種搬送作業或搬送後之設置作業較為容易之電子零件搬送裝置及電子零件檢查裝置。 [解決問題之技術手段] 本發明係為解決上述課題之至少一部分研製而成者，且可作為以下之形態或適用例而實現。[適用例1]本發明之電子零件搬送裝置之特徵在於具備：配置有電子零件之電子零件配置部、及配置於上述電子零件配置部之鉛垂上方、且將冷媒供給至上述電子零件配置部之冷媒供給裝置。藉此，成為將冷媒供給裝置預先地裝載於上方之構成，因此，可將冷媒供給裝置一同地搬送，從而搬送作業變得容易。又，即便不將冷媒供給裝置與電子零件配置部之間之配管解除亦可進行搬送，因此，搬送後之設置作業變得容易。[適用例2]較佳為，於本發明之電子零件搬送裝置中，具備：可配置檢查上述電子零件之檢查部之檢查部配置部、及配置與上述檢查部連接之測試機之測試機配置空間，且自上述鉛垂上方俯視之上述冷媒供給裝置之重心之位置位於自上述鉛垂上方俯視上述測試機配置空間之區域以外之區域。藉此，電子零件搬送裝置係被裝載冷媒供給裝置之前之重心移動至冷媒供給裝置之重心側，從而與該重心相同地被配置於俯視測試機配置空間之區域以外之區域。藉由如此之配置，而將檢查裝置穩定地設置。[適用例3]較佳為，於本發明之電子零件搬送裝置中，將上述冷媒供給裝置配置於搬送上述電子零件之路徑之鉛垂上方。藉此，存在冷媒供給裝置之正下方之空氣被冷卻且聚積於下方之傾向。亦因該空氣，載置電子零件之周圍亦變冷，從而冷卻效率提昇。[適用例4]較佳為，於本發明之電子零件搬送裝置中，上述冷媒供給裝置與上述電子零件配置部藉由流通上述冷媒之第1配管而連接，上述第1配管被第2配管覆蓋，且上述第1配管與上述第2配管之間之至少一部分充滿預先規定之濕度之氣體。藉此，可防止於第2配管之內側或外側產生結露。[適用例5]較佳為，於本發明之電子零件搬送裝置中，於上述冷媒供給裝置之鉛垂下方，設置有接收來自上述冷媒供給裝置之冷媒之漏液之漏液接收部、及使上述漏液自上述漏液接收部流向鉛垂下方之配管。藉此，可防止液體飛散至配置有電子零件配置部之區域。[適用例6]較佳為，於本發明之電子零件搬送裝置中，於較上述電子零件配置部更鉛垂下方，設置有腳輪。藉此，搬送作業變得容易。[適用例7]本發明之電子零件檢查裝置之特徵在於具備：配置電子零件之電子零件配置部、配置於上述電子零件配置部之鉛垂上方；且將冷媒供給至上述電子零件配置部之冷媒供給裝置、及檢查上述電子零件之檢查部。 藉此，成為將冷媒供給裝置預先裝載於上方之構成，因此，可將冷媒供給裝置一同地搬送，從而搬送作業變得容易。又，即便不將冷媒供給裝置與電子零件配置部之間之配管解除亦可進行搬送，因此，搬送後之設置作業變得容易。[Problems to be Solved by the Invention] However, in the case of, for example, the case where the IC handler is moved and transported, the freezer must be transported together, and the transport operation becomes complicated. Further, the transport operation is performed after the piping for connecting the IC handler and the freezing device is temporarily released. Further, at the transfer destination, it is necessary to re-connect the IC handler to the freezer by using the piping again, which complicates the installation work. An object of the present invention is to provide an electronic component conveying apparatus and an electronic component inspection apparatus which are easy to carry out after a conveyance operation or a conveyance. [Technical means for solving the problem] The present invention has been developed to solve at least a part of the above problems, and can be realized as the following aspects or application examples. [Application Example 1] The electronic component transporting apparatus of the present invention includes an electronic component arrangement portion in which electronic components are disposed, and is disposed vertically above the electronic component placement portion, and supplies the refrigerant to the electronic component placement portion. The refrigerant supply device. With this configuration, the refrigerant supply device is placed in advance. Therefore, the refrigerant supply device can be transported together, and the transport operation can be facilitated. In addition, the transportation can be performed without releasing the piping between the refrigerant supply device and the electronic component placement unit. Therefore, the installation work after the transportation becomes easy. [Application Example 2] The electronic component transport apparatus according to the present invention includes: an inspection unit arrangement unit that can arrange an inspection unit for inspecting the electronic component, and a tester arrangement in which a test machine connected to the inspection unit is disposed The position of the center of gravity of the refrigerant supply device, which is viewed from above in the vertical direction, is located in a region outside the region from the vertical upper side of the test machine arrangement space. As a result, the center of gravity of the electronic component transport device before being loaded with the refrigerant supply device is moved to the center of gravity of the refrigerant supply device, and is placed in a region other than the region in which the tester is disposed in the same manner as the center of gravity. With such a configuration, the inspection device is stably set. [Application Example 3] In the electronic component conveying apparatus of the present invention, it is preferable that the refrigerant supply device is disposed vertically above a path for transporting the electronic component. Thereby, there is a tendency that the air directly under the refrigerant supply device is cooled and accumulated. Also, due to the air, the surrounding of the mounted electronic components is also cooled, so that the cooling efficiency is improved. [Application Example 4] In the electronic component conveying apparatus of the present invention, the refrigerant supply device and the electronic component placement unit are connected by a first pipe through which the refrigerant flows, and the first pipe is covered by the second pipe. At least a part of the first pipe and the second pipe are filled with a gas having a predetermined humidity. Thereby, condensation can be prevented from occurring inside or outside the second pipe. [Application Example 5] In the electronic component conveying apparatus of the present invention, preferably, the liquid leakage receiving portion that receives the leakage of the refrigerant from the refrigerant supply device and the liquid leakage receiving portion of the refrigerant supply device are vertically disposed below the refrigerant supply device The liquid leakage flows from the liquid leakage receiving portion to a pipe vertically below. Thereby, it is possible to prevent the liquid from scattering to the area where the electronic component arrangement portion is disposed. [Application Example 6] In the electronic component conveying apparatus of the present invention, it is preferable that the caster is provided vertically below the electronic component arrangement portion. Thereby, the transfer operation becomes easy. [Application Example 7] The electronic component inspection apparatus of the present invention includes: an electronic component arrangement portion in which electronic components are disposed, a vertically disposed upper portion of the electronic component placement portion; and a refrigerant that supplies the refrigerant to the electronic component placement portion A supply device and an inspection unit for inspecting the electronic component. With this configuration, the refrigerant supply device is placed in advance. Therefore, the refrigerant supply device can be transported together, and the transport operation can be facilitated. In addition, the transportation can be performed without releasing the piping between the refrigerant supply device and the electronic component placement unit. Therefore, the installation work after the transportation becomes easy.
以下，基於隨附圖式中所示之較佳之實施形態，對本發明之電子零件搬送裝置及電子零件檢查裝置詳細地進行說明。＜第1實施形態＞圖1係自正面側觀察本發明之電子零件搬送裝置(第1實施形態)之概略立體圖。圖2係自背面側觀察本發明之電子零件搬送裝置(第1實施形態)之概略立體圖。圖3～圖5分別係表示本發明之電子零件檢查裝置(第1實施形態)之概略俯視圖。圖6係表示本發明之電子零件檢查裝置(第1實施形態)之概略正視圖。圖7係模式性表示本發明之電子零件搬送裝置所具備之冷媒供給裝置之內部結構之概略構成圖。圖8係表示本發明之電子零件檢查裝置(第1實施形態)中之冷媒供給裝置與冷卻對象之間之配管狀態之圖。圖9係圖8中之A-A線剖視圖。圖10係圖8中之B-B線剖視圖。再者，以下，為便於說明，而如圖1所示，將相互地正交之3軸設為X軸、Y軸及Z軸。又，包含X軸與Y軸之XY平面成為水平，且Z軸成為鉛垂(重力方向)。又，將與X軸平行之方向亦稱為「X方向」，將與Y軸平行之方向亦稱為「Y方向」，且將與Z軸平行之方向亦稱為「Z方向」。又，將電子零件之搬送方向之上游側亦簡稱為「上游側」，且將下游側亦簡稱為「下游側」。又，本案說明書中所謂之「水平」係不限於完全之水平，只要不阻礙電子零件之搬送，則亦包括相對於水平若干地(例如未達5°左右)傾斜之狀態在內。圖1、圖2中所示之檢查裝置(電子零件檢查裝置)1係例如用以檢查、測試(以下簡稱為「檢查」)BGA(Ball grid array，球狀柵格陣列)封裝或LGA(Land grid array，平面閘格陣列)封裝等之IC元件、LCD(Liquid Crystal Display，液晶顯示器)、CIS(CMOS(complementary metal oxide semiconductor，互補金氧半導體) Image Sensor，CMOS影像感測器)等電子零件之電氣特性之裝置。再者，以下，為便於說明，而對於將IC元件用作進行檢查之上述電子零件之情形代表性地進行說明，且將該IC元件設為「IC元件90」。又，檢查裝置1係最外包裝由外殼覆蓋，且於該外殼，例如具有前外殼70、側外殼71及72、後外殼73、及頂外殼74。如圖3及圖4所示，檢查裝置1係分為托盤供給區域A1、元件供給區域(以下簡稱為「供給區域」)A2、檢查區域A3、元件回收區域(以下簡稱為「回收區域」)A4、及托盤去除區域A5。而且，IC元件90係依序地經由托盤供給區域A1至托盤去除區域A5為止之上述各區域，於中途之檢查區域A3被進行檢查。如此般，檢查裝置1成為具備於各區域搬送IC元件90之電子零件搬送裝置、於檢查區域A3內進行檢查之檢查部16、及控制部80者。再者，檢查裝置1係將配設有托盤供給區域A1及托盤去除區域A5之側成為正面側(參照圖1)，且將該正面側之相反側、即配設有檢查區域A3之側作為背面側(參照圖2)而使用。托盤供給區域A1係被供給排列有未檢查狀態之複數個IC元件90之托盤200之區域。於托盤供給區域A1中，可堆疊大量之托盤200。供給區域A2係將來自托盤供給區域A1之托盤200上所配置之複數個IC元件90分別供給至檢查區域A3之區域。再者，以橫跨托盤供給區域A1與供給區域A2之方式，設置有逐個地搬送托盤200之托盤搬送機構11A、11B。於供給區域A2中，設置有溫度調整部(均熱板)12、元件搬送頭13、及托盤搬送機構(第1搬送裝置)15。溫度調整部12係將複數個IC元件90加熱或冷卻，將該IC元件90調整為適於檢查之溫度之裝置。圖3及圖4所示之構成係將溫度調整部12於Y方向上配置、固定2個。而且，藉由托盤搬送機構11A自托盤供給區域A1所搬入(搬送而至)之托盤200上之IC元件90係搬送、載置於任一溫度調整部12。元件搬送頭13係可於供給區域A2內移動地被支持。藉此，元件搬送頭13可負責自托盤供給區域A1搬入之托盤200與溫度調整部12之間之IC元件90之搬送、及溫度調整部12與下述元件供給部14之間之IC元件90之搬送。托盤搬送機構15係於X方向上搬送所有之IC元件90已被去除之狀態之空之托盤200之機構。而且，於該搬送後，空之托盤200藉由托盤搬送機構11B而自供給區域A2返回至托盤供給區域A1。檢查區域A3係檢查IC元件90之區域。於該檢查區域A3中，設置有元件供給部(供給梭)14、檢查部16、元件搬送頭17、及元件回收部(回收梭)18。元件供給部14係將經溫度調整之IC元件90搬送至檢查部16附近之裝置。該元件供給部14係於供給區域A2與檢查區域A3之間可沿著X方向移動地受到支持。又，於圖3及圖4所示之構成中，在Y方向上配置有2個元件供給部14，且將溫度調整部12上之IC元件90搬送、載置於任一元件供給部14。檢查部16係檢查、測試IC元件90之電氣特性之單元。再者，檢查部16係配置於檢查部配置部29之插槽，且相對於該檢查部配置部29可自由裝卸(參照圖4)。藉此，可根據IC元件90之種類等，更換檢查部16。於該檢查部16，設置有在保持著IC元件90之狀態下與該IC元件90之端子電性地連接之複數個探針。各探針係與連接於檢查部16之測試機600所具備之檢查控制部電性地連接。而且，使IC元件90之端子與探針電性地連接(接觸)，經由探針進行IC元件90之檢查。IC元件90之檢查係基於記憶於上述檢查控制部中之程式而進行。再者，檢查部16可與溫度調整部12同樣地加熱或冷卻IC元件90，將該IC元件90調整為適於檢查之溫度。元件搬送頭17係可於檢查區域A3內移動地受到支持。藉此，元件搬送頭17可將自供給區域A2搬入之元件供給部14上之IC元件90搬送、載置於檢查部16上。元件回收部18係將檢查部16中之檢查已結束之IC元件90搬送至回收區域A4之裝置。該元件回收部18係於檢查區域A3與回收區域A4之間可沿著X方向移動地受到支持。又，圖3及圖4所示之構成中，元件回收部18係與元件供給部14同樣地於Y方向上配置有2個，且檢查部16上之IC元件90被搬送、載置於任一元件回收部18。該搬送係由元件搬送頭17來進行。回收區域A4係將檢查已結束之IC元件90回收之區域。於該回收區域A4，設置有回收用托盤19、元件搬送頭20、及托盤搬送機構21。又，於回收區域A4，亦準備有空之托盤200。回收用托盤19係固定於回收區域A4內，且於圖3及圖4所示之構成中，沿著X方向配置有3個。又，空之托盤200亦沿著X方向配置有3個。而且，移動至回收區域A4之元件回收部18上之IC元件90係搬送、載置於該等回收用托盤19及空之托盤200中之任一者。藉此，將IC元件90按照每一檢查結果進行回收、分類。元件搬送頭20係可於回收區域A4內移動地受到支持。藉此，元件搬送頭20可將IC元件90自元件回收部18搬送至回收用托盤19或空之托盤200。托盤搬送機構21係將自托盤去除區域A5搬入之空之托盤200於X方向進行搬送之機構。而且，於該搬送後，將空之托盤200配設於IC元件90所回收之位置，即可成為上述3個空之托盤200中之任一者。托盤去除區域A5係將排列著檢查結束狀態之複數個IC元件90之托盤200回收、去除之區域。於托盤去除區域A5中，可堆疊大量之托盤200。又，以橫跨回收區域A4與托盤去除區域A5之方式，設置有逐個地搬送托盤200之托盤搬送機構22A、22B。托盤搬送機構22A係將載置著檢查結束之IC元件90之托盤200自回收區域A4搬送至托盤去除區域A5之機構。托盤搬送機構22B係將用以回收IC元件90之空之托盤200自托盤去除區域A5搬送至回收區域A4之機構。控制部80具有例如驅動控制部。驅動控制部係控制例如托盤搬送機構11A、11B、溫度調整部12、元件搬送頭13、元件供給部14、托盤搬送機構15、檢查部16、元件搬送頭17、元件回收部18、元件搬送頭20、托盤搬送機構21、托盤搬送機構22A、22B之各部分之驅動。再者，上述測試機600之檢查控制部係基於例如記憶於未圖示之記憶體內之程式，進行配置於檢查部16之IC元件90之電氣特性之檢查等。以上所述之檢查裝置1係構成為亦除了溫度調整部12或檢查部16以外，元件搬送頭13、元件供給部14，元件搬送頭17亦可將IC元件90加熱或冷卻。藉此，IC元件90於被搬送之期間，溫度被維持為固定。而且，以下，說明對IC元件90進行冷卻，於例如-60℃～-40℃之範圍內之低溫環境下進行檢查之情形。又，溫度調整部12或檢查部16等可進行溫度調整之部分係被配置IC元件90之部分，從而存在將該等總稱為「電子零件配置部30」之情形。如圖2、圖4、圖5所示，於檢查裝置1之背面側，形成有被***、配置測試機600之測試機配置空間A6。該測試機配置空間A6係位於供給區域A2及檢查區域A3之下側。又，測試機600具有於配置於測試機配置空間A6內之狀態下，與檢查區域A3之檢查部16連接之測試頭(未圖示)。而且，於該連接狀態下，可進行對於檢查部16上之IC元件90之檢查。再者，如圖2及圖5所示，於測試機配置空間A6之下方，突出有樑31。如上所述，檢查裝置1係對IC元件90進行冷卻，於低溫環境下進行檢查。該冷卻中，使用冷卻單元300。冷卻單元300係對作為冷卻對象之電子零件配置部30供給冷媒C，將該電子零件配置部30上之IC元件90冷卻之冷媒供給裝置(冷卻裝置)。作為冷媒C，可使用例如使液體氮汽化而得者。再者，於供給區域A2或檢查區域A3等，被供給有乾燥空氣(dry air)DA。藉此，以可防止冷卻時之結露之程度進行濕度調整。如圖7所示，於冷卻單元300中，在儲存著液體氮之作為供給部之儲存槽301，經由流路302連接有供給路徑303。該供給路徑303係大致相等之流路剖面積連續之管，且連接於電子零件配置部30。於供給路徑303，配設有閥304，且該閥304係將供給路徑303進行開閉，控制液體氮對汽化室305之供給量。於該等供給路徑303，配設有熱交換器307。熱交換器307係所謂之板式熱交換器，且配設於閥304之下游側，並且被隔熱材308所覆蓋。於熱交換器307，以該熱交換器307中之流體成為並流之方式連接有供給路徑303，且於汽化室305連接有供給路徑303。汽化室305係形成為比供給路徑303之流路剖面積更大之流路剖面積，因此，具有比供給路徑303更大之流路內面積及體積。流入至汽化室305之液體氮藉由曝露於溫度高於液體氮之沸點之熱交換器307之內部而成為溫度低於目標溫度之氮氣，且自熱交換器307中流出。即，熱交換器307係作為使液體氮汽化之汽化容器發揮功能，並非使冷媒C膨脹而使該冷媒C之溫度下降者，且非使冷媒C積極地吸收熱交換器307之周圍之熱者。而且，於熱交換器307內汽化後之低溫之氮氣被送入至電子零件配置部30。又，於電子零件配置部30之排出口，連接有排出路徑309。排出路徑309係將自電子零件配置部30排出之氮氣導入至收容箱(未圖示)。於排出路徑309，配設有限制氣體流入電子零件配置部30之止回閥310。又，於排出路徑309，配設有作為使該排出路徑309中流通之氮氣升溫至常溫程度之升溫部之熱交換器311。熱交換器311係所謂之板式熱交換器，且排出路徑309中流通之氮氣流入至低溫流體室312，乾燥空氣供給源313所產生之乾燥空氣DA流入至高溫流體室314。該等氮氣及乾燥空氣DA係以於熱交換器311內成為並流之方式流通。乾燥空氣供給源313係由壓縮機或乾燥機構成，且來自該乾燥空氣供給源313之乾燥空氣DA藉由空氣加熱器315而升溫至高於常溫之溫度。而且，乾燥空氣DA係藉由與熱交換器311中之排出路徑309之氮氣之熱交換而使溫度下降至常溫程度後，被導入至上述收容箱。又，於排出路徑309，在較熱交換器311更下游側配設有限制氣體流入低溫流體室312之止回閥316。具有以上所述之內部結構之冷卻單元300如圖1、圖2及圖4所示，其整體之外形形狀呈沿X方向之長條之長方體狀。而且，該冷卻單元300係配置、固定於設置有電子零件配置部30之區域(供給區域A2、檢查區域A3)之鉛垂上方(Z軸正側)、即搬送IC元件90之路徑之鉛垂上方。如此般，檢查裝置1成為於上方預先裝載有冷卻單元300者(以下將該構成稱作「單元化」)。藉由單元化，而發揮以下之效果。(1)如上所述，檢查裝置1係與測試機600連接而使用。又，例如工廠或測試室配置有IC元件90之依每一道檢查而異之複數種測試機600。且，一般而言於檢查裝置1為例如「邏輯系之處置器」之情形時，將該檢查裝置1移動搬送至測試機600旁而使用。另一方面，測試機600與檢查裝置1相比較不易搬送，又，較佳為，預先設為儘可能不搬送而維持固定之狀態。因此，由於檢查裝置1成為經單元化者，故可與冷卻單元300一同地進行搬送，由此，搬送作業變得容易。該單元化與冷卻單元300與檢查裝置1分開放置之情形(參照例如專利文獻1)相比，於搬送方面極為有效之構成。(2)又，可藉由單元化，而即便不將冷卻單元300與電子零件配置部30之間之配管解除亦可進行搬送。藉此，將檢查裝置1搬送至測試機600之底部之後，便可迅速地使用，即設置作業較為容易。由此，可實現IC元件90之檢查成本(測試成本)之抑制。(3)可藉由單元化，而使冷卻單元300與電子零件配置部30之間之配管路徑，例如與冷卻單元300與檢查裝置1分開放置之情形相比變短。藉此，可抑制用以將配管路徑隔熱之範圍。又，可抑制或防止冷媒C自冷卻單元300到達電子零件配置部30之前被加溫，從而冷卻精度提昇。進而，亦利於消耗電力降低、即節能。(4)又，於冷卻單元300分開放置之情形時，必須於地板上確保與冷卻單元300相應之設置空間，但可藉由單元化，而實現空間節省化。(5)又，藉由單元化，而使設置有需要冷卻之電子零件配置部30之區域位於冷卻單元300之正下方。藉此，於該區域內，存在冷卻單元300之正下方之空氣聚積於下方之傾向。即便利用該空氣，亦可將電子零件配置部30之周圍冷卻，從而冷卻效率提昇。如上所述，冷卻單元300係位於設置有電子零件配置部30之區域之鉛垂上方，但其中尤佳為配置於橫跨供給區域A2與回收區域A4之區域(參照圖4)。該區域亦為在檢查裝置1之俯視下與托盤供給區域A1及托盤去除區域A5之任一者均不重合之區域。如此般，藉由配置冷卻單元300，而將冷卻單元300之重心CG300 配置於俯視測試機配置空間A6之區域以外之區域(參照圖5)。且說，如圖5所示，裝載冷卻單元300之前之檢查裝置1之重心CG1 係配置於俯視測試機配置空間A6之區域內。若自該狀態起裝載冷卻單元300，則因重心CG300 之上述位置，而使檢查裝置1之重心CG1 移動至重心CG300 側，從而與該重心CG300 同樣地被配置於俯視測試機配置空間A6之區域以外之區域。藉此，將檢查裝置1穩定地設置。再者，冷卻單元300之X方向之總長度較佳為檢查裝置1之X方向之總長度之50%以上且100%以下，更佳為80%以上且100%以下。冷卻單元300之Y方向之縱深較佳為檢查裝置1之Y方向之縱深之20%以上且50%以下，更佳為20%以上且30%以下。冷卻單元300之Z方向之高度較佳為檢查裝置1之Z方向之高度之20%以上且50%以下，更佳為20%以上且30%以下。又，冷卻單元300之總重量較佳為檢查裝置1之總重量之10%以上且30%以下，更佳為20%以上且30%以下。如圖7所示，於冷卻單元300中，設置有流路302、供給路徑303、及排出路徑309。檢查裝置1可例如利用管4構成該等流路(參照圖8)。於圖8所示之構成中，供給冷媒C之冷卻單元300與由冷媒C所冷卻之冷卻對象(電子零件配置部30)利用2根管4而連接。該等2根管4中，一管4作為將冷媒C自冷卻單元300供給至冷卻對象之供給管線發揮功能，另一管4作為將用於冷卻對象之冷卻之冷媒C回收之回收管線發揮功能。如圖9及圖10所示，管4係呈具有冷媒C所流通(充滿)之1根第1配管41及將第1配管41覆蓋、即第1配管41所插穿之第2配管42之套管結構者。第1配管41係供冷媒C流下而被充滿之管體。該第1配管41係外徑d1 - 1 較佳為例如4 mm以上且8 mm以下，且內徑d1 - 2 較佳為2 mm以上且6 mm以下。又，作為第1配管41之構成材料，並無特別限定，例如可使用聚四氟乙烯等。又，於第1配管41之外周部，形成有隔熱層43。藉此，可將第1配管41與外部隔熱。隔熱層43之厚度t較佳為例如6 mm以上且9 mm以下。又，作為隔熱層43之構成材料，並無特別限定，例如可使用發泡橡膠。第2配管42係與第1配管41之間之部分為供預先規定之濕度之空氣流下而被充滿之管體。作為該空氣，可設為乾燥空氣DA。再者，第2配管42係外徑d2 - 1 較佳為例如30 mm以上且50 mm以下，且內徑d2 - 2 較佳為20 mm以上且40 mm以下。作為第2配管42之構成材料，並無特別限定，例如可使用聚胺基甲酸酯等。如此般，管4係構成為最內側被冷媒C充滿，且其外側由隔熱層43所覆蓋，進而外側被乾燥空氣DA充滿。藉此，可防止隔熱層43接觸於外部氣體，從而可防止於隔熱層43與第2配管42之間產生結露。又，於第2配管42，較佳為具有大量之凹凸。即，第2配管42較佳為呈現蛇腹狀。藉此，管4作為整體容易彎曲，由此，管4之捲繞(配管)變得容易。如圖10所示，於管4，設置有以將第1配管41與第2配管42同心地配置方式進行定位之定位構件44。定位構件44係沿著管4之長度方向隔開間隔地配置有複數個。藉此，第1配管41與第2配管42之定位變得容易。定位構件44係呈環狀，且嵌合於第1配管41與第2配管42之間。又，於定位構件44，至少形成有1個供乾燥空氣DA通過之缺損部(貫通孔)441。如圖6所示，於冷卻單元300之鉛垂下方，設置有接收來自冷卻單元300之冷媒C之漏液之第1漏液接收部51、使漏液自第1漏液接收部51流向下方之配管52、及接收來自配管52之漏液之第2漏液接收部53。第1漏液接收部51係配置於冷卻單元300之正下方，且將該冷卻單元300之底部整體覆蓋之碟狀之構件。藉此，可防止液體飛散至供給區域A2或回收區域A4。配管52係與第1漏液接收部51內連通之可撓管。該配管52係繞過供給區域A2或回收區域A4，延伸至檢查裝置1之最下方為止。聚積於第1漏液接收部51之液體可於配管52中流下。第2漏液接收部53係載置於地板之碟狀之構件。配管52之口部521係於第2漏液接收部53內開口。藉此，可利用第2漏液接收部53接收在配管52中流下之液體，從而可防止液體飛散至地板。再者，於檢查裝置1中，可將第2漏液接收部53省略。如圖5、圖6所示，於較電子零件配置部30更鉛垂下方、即檢查裝置1之最下方，設置有分散配置之複數個(圖5中為4個)腳輪61、及分散配置之複數個(圖5中為7個)調節腳62。再者，調節腳62之至少1個較佳為配置於樑31。藉由腳輪61，而使檢查裝置1之搬送變得容易。又，可藉由調節腳62，而將搬送後之檢查裝置1固定於地板，由此，便可穩定地進行檢查。＜第2實施形態＞圖11係表示本發明之電子零件檢查裝置(第2實施形態)之概略俯視圖。以下，參照該圖，對本發明之電子零件搬送裝置及電子零件檢查裝置之第2實施形態進行說明，但以與上述實施形態不同之處為中心進行說明，相同之事項省略其說明。本實施形態係除了冷媒供給裝置之配置部位不同以外，與上述第1實施形態相同。如圖11所示，本實施形態係將冷卻單元300於檢查裝置1之俯視下，遍及回收區域A4之Y方向之大致整體重合地配置。亦藉由如此之配置，而將裝載冷卻單元300之後之檢查裝置1之重心CG1 配置於俯視測試機配置空間A6之區域以外之區域。藉此，將檢查裝置1穩定地設置。＜第3實施形態＞圖12係表示本發明之電子零件檢查裝置(第3實施形態)中之冷媒供給裝置與冷卻對象之間之配管狀態之橫向剖視圖。以下，參照該圖，對本發明之電子零件搬送裝置及電子零件檢查裝置之第3實施形態進行說明，但以與上述實施形態不同之處為中心進行說明，相同之事項省略其說明。本實施形態係除了管之構成不同以外，與上述第1實施形態相同。如圖12所示，於本實施形態中，管4係2根第1配管41被第2配管42成束地覆蓋。藉此，可將2根第1配管41中之一第1配管41設為將冷媒C供給至冷卻對象之供給用途，且將另一第1配管41設為將來自冷卻對象之冷媒C回收之回收用途。再者，第1配管41之設置數於本實施形態為2根，但不僅限於此，亦可為3根以上。＜第4實施形態＞圖13係表示本發明之電子零件檢查裝置(第4實施形態)中之冷媒供給裝置與冷卻對象之間之配管狀態之圖。以下，參照該圖，對本發明之電子零件搬送裝置及電子零件檢查裝置之第4實施形態進行說明，但以與上述實施形態不同之處為中心進行說明，相同之事項省略其說明。本實施形態係除了管之配置態樣不同以外，與上述第1實施形態相同。如圖13所示，於本實施形態中，管4係長度方向之一部分被箱體400所包圍、即收納。該箱體400係暫時地被充填乾燥空氣DA者，藉此，例如可對使用乾燥空氣DA之部分(例如亦可為管4)分配該乾燥空氣DA。＜第5實施形態＞圖14係表示本發明之電子零件檢查裝置(第5實施形態)中之冷媒供給裝置與冷卻對象之間之配管狀態之圖。以下，參照該圖，對本發明之電子零件搬送裝置及電子零件檢查裝置之第5實施形態進行說明，但以與上述實施形態不同之處為中心進行說明，相同之事項省略其說明。本實施形態係除了管之配置態樣不同以外，與上述第1實施形態相同。如圖14所示，本實施形態係將管4之兩端部分別連接於箱狀之連接部500。連接部500彼此係經由管4之第2配管42而相互地連通。藉此，例如於對圖14中之左側之連接部500中輸送乾燥空氣DA之情形時，該乾燥空氣DA於第2配管42內流下，從而到達圖14中之右側之連接部500。以上，基於圖示之實施形態，對本發明之電子零件搬送裝置及電子零件檢查裝置進行了說明，但本發明並非僅限於此，構成電子零件搬送裝置及電子零件檢查裝置之各部分可與能夠發揮相同之功能之任意之構成者進行置換。又，亦可附加任意之構成物。 又，本發明之電子零件搬送裝置及電子零件檢查裝置亦可為將上述各實施形態中之任意2個以上之構成(特徵)組合而成者。Hereinafter, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention will be described in detail based on preferred embodiments shown in the drawings. <First Embodiment> Fig. 1 is a schematic perspective view of the electronic component conveying device (first embodiment) of the present invention as seen from the front side. Fig. 2 is a schematic perspective view of the electronic component conveying device (first embodiment) of the present invention as seen from the back side. 3 to 5 are schematic plan views showing an electronic component inspection device (first embodiment) of the present invention. Fig. 6 is a schematic front view showing an electronic component inspection device (first embodiment) of the present invention. FIG. 7 is a schematic configuration diagram showing the internal structure of a refrigerant supply device provided in the electronic component conveying device of the present invention. FIG. 8 is a view showing a piping state between the refrigerant supply device and the cooling target in the electronic component inspection device (first embodiment) of the present invention. Figure 9 is a cross-sectional view taken along line AA of Figure 8. Figure 10 is a cross-sectional view taken along line BB of Figure 8. In the following description, for convenience of explanation, as shown in FIG. 1, the three axes orthogonal to each other are defined as an X axis, a Y axis, and a Z axis. Further, the XY plane including the X-axis and the Y-axis is horizontal, and the Z-axis is vertical (gravity direction). Further, the direction parallel to the X axis is also referred to as "X direction", the direction parallel to the Y axis is also referred to as "Y direction", and the direction parallel to the Z axis is also referred to as "Z direction". Moreover, the upstream side of the conveyance direction of the electronic component is also simply referred to as "upstream side", and the downstream side is also simply referred to as "downstream side". Further, the term "level" as used in the specification of the present invention is not limited to a complete level, and includes a state in which the electronic component is not inclined, and the state is inclined with respect to a certain level (for example, not about 5 degrees). The inspection apparatus (electronic component inspection apparatus) 1 shown in FIG. 1 and FIG. 2 is used, for example, for inspection, testing (hereinafter referred to as "inspection") BGA (Ball Grid Array) package or LGA (Land (Land) Grid array, planar gate array, etc. IC components such as IC components, LCD (Liquid Crystal Display), CIS (CMOS (complementary metal oxide semiconductor) Image Sensor, CMOS image sensor) The device for electrical characteristics. In the following, for convenience of explanation, the case where the IC component is used as the above-described electronic component for inspection is representatively described, and the IC component is referred to as "IC component 90". Further, the inspection device 1 is covered by an outer casing, and has, for example, a front outer casing 70, side outer casings 71 and 72, a rear outer casing 73, and a top outer casing 74. As shown in FIG. 3 and FIG. 4, the inspection apparatus 1 is divided into a tray supply area A1, a component supply area (hereinafter simply referred to as "supply area") A2, an inspection area A3, and a component collection area (hereinafter referred to as "recovery area"). A4, and the tray removal area A5. Further, the IC element 90 is sequentially inspected in the inspection area A3 in the middle through the above-described respective areas from the tray supply area A1 to the tray removal area A5. In this manner, the inspection apparatus 1 is an electronic component transport apparatus that transports the IC component 90 in each area, an inspection unit 16 that performs inspection in the inspection area A3, and a control unit 80. In addition, the inspection apparatus 1 sets the side on which the tray supply area A1 and the tray removal area A5 are disposed to the front side (see FIG. 1), and the side opposite to the front side, that is, the side on which the inspection area A3 is disposed. It is used on the back side (see Fig. 2). The tray supply area A1 is supplied with an area of the tray 200 in which a plurality of IC elements 90 in an unchecked state are arranged. In the tray supply area A1, a large number of trays 200 can be stacked. The supply area A2 supplies a plurality of IC elements 90 disposed on the tray 200 from the tray supply area A1 to the area of the inspection area A3. Further, the tray transport mechanisms 11A and 11B that transport the trays 200 one by one are provided so as to straddle the tray supply area A1 and the supply area A2. In the supply area A2, a temperature adjustment unit (heating plate) 12, a component transfer head 13, and a tray conveyance mechanism (first conveyance device) 15 are provided. The temperature adjustment unit 12 heats or cools a plurality of IC elements 90 to adjust the IC element 90 to a temperature suitable for inspection. In the configuration shown in FIGS. 3 and 4, the temperature adjustment unit 12 is disposed and fixed in the Y direction. Then, the IC component 90 on the tray 200 loaded (transferred) from the tray supply area A1 by the tray transport mechanism 11A is transported and placed on any of the temperature adjustment units 12. The component transfer head 13 is movably supported in the supply area A2. Thereby, the component transfer head 13 can be responsible for the transfer of the IC component 90 between the tray 200 and the temperature adjustment unit 12 carried in from the tray supply area A1, and the IC component 90 between the temperature adjustment unit 12 and the component supply unit 14 described below. Transfer. The tray transport mechanism 15 is a mechanism for transporting the empty tray 200 in a state in which all the IC elements 90 have been removed in the X direction. Then, after the transfer, the empty tray 200 is returned from the supply area A2 to the tray supply area A1 by the tray transport mechanism 11B. The inspection area A3 is an area in which the IC component 90 is inspected. In the inspection area A3, a component supply unit (supply shuttle) 14, an inspection unit 16, a component transfer head 17, and a component collection unit (recycling shuttle) 18 are provided. The component supply unit 14 is a device that transports the temperature-adjusted IC device 90 to the vicinity of the inspection unit 16. The component supply unit 14 is supported between the supply region A2 and the inspection region A3 so as to be movable in the X direction. Further, in the configuration shown in FIGS. 3 and 4, two component supply portions 14 are disposed in the Y direction, and the IC device 90 on the temperature adjustment portion 12 is transported and placed on any of the component supply portions 14. The inspection unit 16 is a unit that inspects and tests the electrical characteristics of the IC component 90. Further, the inspection unit 16 is disposed in the slot of the inspection unit arranging unit 29, and is detachably attachable to the inspection unit arranging unit 29 (see FIG. 4). Thereby, the inspection unit 16 can be replaced according to the type of the IC component 90 or the like. The inspection unit 16 is provided with a plurality of probes electrically connected to the terminals of the IC element 90 while the IC element 90 is held. Each probe system is electrically connected to an inspection control unit provided in the testing machine 600 connected to the inspection unit 16 . Further, the terminal of the IC element 90 is electrically connected (contacted) to the probe, and the IC element 90 is inspected via the probe. The inspection of the IC component 90 is performed based on the program stored in the above-described inspection control section. Further, the inspection unit 16 can heat or cool the IC element 90 in the same manner as the temperature adjustment unit 12, and adjust the IC element 90 to a temperature suitable for inspection. The component transfer head 17 is movably supported in the inspection area A3. Thereby, the element transfer head 17 can transport and mount the IC element 90 on the component supply unit 14 carried in from the supply area A2 to the inspection unit 16. The component recovery unit 18 is a device that transports the IC component 90 in the inspection unit 16 to the collection area A4. The component recovery unit 18 is supported between the inspection region A3 and the recovery region A4 so as to be movable in the X direction. In the configuration shown in FIG. 3 and FIG. 4, the component collection unit 18 is disposed in the Y direction in the same manner as the component supply unit 14, and the IC component 90 on the inspection unit 16 is transported and placed. A component recovery unit 18. This transfer is performed by the component transfer head 17. The recycling area A4 will check the area where the completed IC component 90 is recovered. In the collection area A4, a collection tray 19, a component transfer head 20, and a tray conveyance mechanism 21 are provided. Further, in the collection area A4, an empty tray 200 is also prepared. The recovery tray 19 is fixed in the collection area A4, and in the configuration shown in FIGS. 3 and 4, three are arranged along the X direction. Further, the empty tray 200 is also arranged in three along the X direction. Then, the IC element 90 moved to the component collection unit 18 of the collection area A4 is transported and placed on any of the collection trays 19 and the empty trays 200. Thereby, the IC element 90 is recovered and classified according to each inspection result. The component transfer head 20 is movably supported in the recovery area A4. Thereby, the component transfer head 20 can transport the IC component 90 from the component collection part 18 to the collection tray 19 or the empty tray 200. The tray transport mechanism 21 is a mechanism that transports the empty tray 200 loaded from the tray removal area A5 in the X direction. Further, after the transfer, the empty tray 200 is placed at a position where the IC element 90 is collected, and any of the three empty trays 200 can be obtained. The tray removal area A5 is an area in which the trays 200 of the plurality of IC elements 90 in the inspection end state are collected and removed. In the tray removal area A5, a large number of trays 200 can be stacked. Further, the tray transport mechanisms 22A and 22B that transport the trays 200 one by one are provided so as to straddle the collection area A4 and the tray removal area A5. The tray transport mechanism 22A is a mechanism that transports the tray 200 on which the inspected IC element 90 is placed from the collection area A4 to the tray removal area A5. The tray transport mechanism 22B is a mechanism that transports the empty tray 200 for collecting the IC component 90 from the tray removal area A5 to the collection area A4. The control unit 80 has, for example, a drive control unit. The drive control unit controls, for example, the tray conveyance mechanisms 11A and 11B, the temperature adjustment unit 12, the component transfer head 13, the component supply unit 14, the tray conveyance mechanism 15, the inspection unit 16, the component transfer head 17, the component collection unit 18, and the component transfer head. 20. Driving of each portion of the tray transport mechanism 21 and the tray transport mechanisms 22A, 22B. In addition, the inspection control unit of the test machine 600 performs inspection of electrical characteristics of the IC component 90 disposed in the inspection unit 16 based on, for example, a program stored in a memory (not shown). The inspection apparatus 1 described above is configured such that the element transfer head 13 and the component supply unit 14 in addition to the temperature adjustment unit 12 or the inspection unit 16, and the element transfer head 17 can heat or cool the IC element 90. Thereby, the temperature of the IC element 90 is maintained constant while being transported. Further, hereinafter, the case where the IC element 90 is cooled and inspected in a low temperature environment within a range of, for example, -60 ° C to -40 ° C will be described. In addition, a part in which the temperature adjustment unit 12 or the inspection unit 16 can perform temperature adjustment is a part in which the IC element 90 is placed, and this is collectively referred to as "electronic component placement unit 30". As shown in FIG. 2, FIG. 4, and FIG. 5, the test machine arrangement space A6 in which the test machine 600 is inserted and disposed is formed on the back side of the inspection apparatus 1. The test machine configuration space A6 is located below the supply area A2 and the inspection area A3. Further, the testing machine 600 has a test head (not shown) connected to the inspection unit 16 of the inspection area A3 in a state of being placed in the testing machine arrangement space A6. Further, in this connected state, inspection of the IC component 90 on the inspection portion 16 can be performed. Further, as shown in FIGS. 2 and 5, a beam 31 is protruded below the test machine arrangement space A6. As described above, the inspection apparatus 1 cools the IC element 90 and performs inspection in a low temperature environment. In this cooling, the cooling unit 300 is used. The cooling unit 300 is a refrigerant supply device (cooling device) that supplies the refrigerant C to the electronic component placement unit 30 that is to be cooled, and cools the IC component 90 on the electronic component placement unit 30. As the refrigerant C, for example, a liquid nitrogen can be used for vaporization. Further, dry air DA is supplied to the supply area A2, the inspection area A3, and the like. Thereby, the humidity adjustment is performed to the extent that condensation can be prevented during cooling. As shown in FIG. 7, in the cooling unit 300, the supply path 303 is connected via the flow path 302 to the storage tank 301 which is the supply part of the liquid nitrogen. The supply path 303 is a tube having substantially the same flow path sectional area and is connected to the electronic component placement unit 30. A valve 304 is disposed in the supply path 303, and the valve 304 opens and closes the supply path 303 to control the supply amount of the liquid nitrogen to the vaporization chamber 305. A heat exchanger 307 is disposed in the supply paths 303. The heat exchanger 307 is a so-called plate heat exchanger, and is disposed on the downstream side of the valve 304 and covered by the heat insulating material 308. In the heat exchanger 307, the supply path 303 is connected to the fluid in the heat exchanger 307, and the supply path 303 is connected to the vaporization chamber 305. The vaporization chamber 305 is formed to have a larger cross-sectional area of the flow path than the flow path of the supply path 303, and therefore has a larger inner flow area and volume than the supply path 303. The liquid nitrogen flowing into the vaporization chamber 305 becomes nitrogen gas having a temperature lower than the target temperature by being exposed to the inside of the heat exchanger 307 whose temperature is higher than the boiling point of the liquid nitrogen, and flows out from the heat exchanger 307. In other words, the heat exchanger 307 functions as a vaporization vessel that vaporizes liquid nitrogen, and does not cause the refrigerant C to expand to lower the temperature of the refrigerant C, and does not allow the refrigerant C to actively absorb the heat around the heat exchanger 307. . Further, the low-temperature nitrogen gas vaporized in the heat exchanger 307 is sent to the electronic component placement unit 30. Further, a discharge path 309 is connected to the discharge port of the electronic component placement unit 30. The discharge path 309 introduces the nitrogen gas discharged from the electronic component placement unit 30 into a storage box (not shown). A check valve 310 that restricts the flow of gas into the electronic component placement portion 30 is disposed in the discharge path 309. Further, a heat exchanger 311 as a temperature rising portion for raising the temperature of the nitrogen gas flowing through the discharge path 309 to a normal temperature is disposed in the discharge path 309. The heat exchanger 311 is a so-called plate heat exchanger, and the nitrogen gas flowing through the discharge path 309 flows into the low temperature fluid chamber 312, and the dry air DA generated by the dry air supply source 313 flows into the high temperature fluid chamber 314. The nitrogen gas and the dry air DA are distributed in the heat exchanger 311 so as to flow in parallel. The dry air supply source 313 is constituted by a compressor or a dryer, and the dry air DA from the dry air supply source 313 is heated by the air heater 315 to a temperature higher than a normal temperature. Further, the dry air DA is cooled to a normal temperature by heat exchange with nitrogen gas in the discharge path 309 in the heat exchanger 311, and then introduced into the storage box. Further, on the discharge path 309, a check valve 316 that restricts the flow of gas into the low temperature fluid chamber 312 is disposed on the downstream side of the heat exchanger 311. As shown in FIG. 1, FIG. 2, and FIG. 4, the cooling unit 300 having the internal structure described above has a rectangular shape in which the entire outer shape is elongated in the X direction. Further, the cooling unit 300 is disposed and fixed to the vertical upper side (the positive side of the Z axis) of the region (the supply region A2 and the inspection region A3) where the electronic component placement portion 30 is provided, that is, the vertical path of the path for transporting the IC component 90. Above. In this manner, the inspection apparatus 1 is a unit in which the cooling unit 300 is mounted in advance (hereinafter, this configuration is referred to as "unitization"). By unitizing, the following effects are exerted. (1) As described above, the inspection apparatus 1 is connected to the test machine 600 and used. Further, for example, the factory or the test room is provided with a plurality of test machines 600 of the IC component 90 depending on each inspection. In general, when the inspection apparatus 1 is, for example, a "logic system handler", the inspection apparatus 1 is moved and transported to the side of the test machine 600 for use. On the other hand, the test machine 600 is less likely to be transported than the inspection device 1, and it is preferable that the test machine 600 is kept in a fixed state without being transported as much as possible. Therefore, since the inspection apparatus 1 is a unitized person, it can be conveyed together with the cooling unit 300, and the conveyance operation becomes easy. This unitization and cooling unit 300 are placed separately from the inspection apparatus 1 (see, for example, Patent Document 1), and are extremely effective in transportation. (2) Further, the unit can be transported without releasing the piping between the cooling unit 300 and the electronic component placement unit 30. Thereby, after the inspection apparatus 1 is conveyed to the bottom of the test machine 600, it can be used rapidly, that is, it is easy to set up an operation. Thereby, the suppression of the inspection cost (test cost) of the IC component 90 can be achieved. (3) The piping path between the cooling unit 300 and the electronic component placement unit 30 can be shortened as compared with the case where the cooling unit 300 is placed separately from the inspection apparatus 1 by unitization. Thereby, the range for insulating the piping path can be suppressed. Moreover, it is possible to suppress or prevent the refrigerant C from being warmed before the cooling unit 300 reaches the electronic component arrangement portion 30, and the cooling accuracy is improved. Furthermore, it also contributes to a reduction in power consumption, that is, energy saving. (4) Further, in the case where the cooling unit 300 is separately placed, the installation space corresponding to the cooling unit 300 must be secured on the floor, but space saving can be achieved by unitization. (5) Further, by unitizing, the area in which the electronic component arrangement portion 30 to be cooled is provided is located immediately below the cooling unit 300. Thereby, in this area, there is a tendency that air directly under the cooling unit 300 accumulates below. Even if the air is used, the periphery of the electronic component placement unit 30 can be cooled, and the cooling efficiency can be improved. As described above, the cooling unit 300 is located vertically above the region in which the electronic component placement portion 30 is provided. However, it is particularly preferable to arrange the cooling unit 300 in a region spanning the supply region A2 and the recovery region A4 (see FIG. 4). This area is also an area that does not overlap with any of the tray supply area A1 and the tray removal area A5 in the plan view of the inspection apparatus 1. In this manner, by arranging the cooling unit 300, the center of gravity CG 300 of the cooling unit 300 is disposed in a region outside the region overlooking the tester arrangement space A6 (see FIG. 5). Let us now turn, as shown in Figure 5, the center of gravity of the load before the inspection apparatus 300 of the cooling unit 1 CG 1 lines arranged in a top region of A6 tester configuration space. When the cooling unit 300 is loaded from this state, the center of gravity CG 1 of the inspection apparatus 1 is moved to the center of gravity CG 300 by the above-described position of the center of gravity CG 300 , and is placed in the plan tester configuration in the same manner as the center of gravity CG 300. An area outside the area of space A6. Thereby, the inspection apparatus 1 is stably set. Further, the total length of the cooling unit 300 in the X direction is preferably 50% or more and 100% or less, more preferably 80% or more and 100% or less of the total length of the inspection apparatus 1 in the X direction. The depth of the cooling unit 300 in the Y direction is preferably 20% or more and 50% or less, more preferably 20% or more and 30% or less of the depth of the inspection apparatus 1 in the Y direction. The height of the cooling unit 300 in the Z direction is preferably 20% or more and 50% or less, more preferably 20% or more and 30% or less of the height of the inspection apparatus 1 in the Z direction. Further, the total weight of the cooling unit 300 is preferably 10% or more and 30% or less, more preferably 20% or more and 30% or less, based on the total weight of the inspection apparatus 1. As shown in FIG. 7, the cooling unit 300 is provided with a flow path 302, a supply path 303, and a discharge path 309. The inspection device 1 can constitute the flow paths (see Fig. 8), for example, by means of the tubes 4. In the configuration shown in FIG. 8, the cooling unit 300 that supplies the refrigerant C and the cooling target (electronic component placement unit 30) that is cooled by the refrigerant C are connected by two tubes 4. Among the two tubes 4, one tube 4 functions as a supply line for supplying the refrigerant C from the cooling unit 300 to the cooling target, and the other tube 4 functions as a recovery line for recovering the cooling medium C for cooling. . As shown in FIG. 9 and FIG. 10, the pipe 4 is a first pipe 41 having the refrigerant C flowing (filled), and the first pipe 41, that is, the second pipe 42 through which the first pipe 41 is inserted. Casing structure. The first pipe 41 is a pipe body in which the refrigerant C flows down and is filled. The first pipe 41 is an outer diameter d 1 - 1, for example, preferably 4 mm or more and 8 mm or less, and an inner diameter d 1 - 2 is preferably 2 mm or more and 6 mm or less. In addition, the constituent material of the first pipe 41 is not particularly limited, and for example, polytetrafluoroethylene or the like can be used. Further, a heat insulating layer 43 is formed on the outer peripheral portion of the first pipe 41. Thereby, the first pipe 41 can be insulated from the outside. The thickness t of the heat insulating layer 43 is preferably, for example, 6 mm or more and 9 mm or less. Further, the constituent material of the heat insulating layer 43 is not particularly limited, and for example, a foamed rubber can be used. The portion between the second pipe 42 and the first pipe 41 is a pipe body that is filled with air having a predetermined humidity and is filled. As this air, it can be set as dry air DA. Furthermore, the second pipe 42 is an outer diameter d 2 - 1 is preferably, for example, 30 mm or more and 50 mm or less, and has an inner diameter d 2 - 2 is preferably 20 mm or more and 40 mm or less. The constituent material of the second pipe 42 is not particularly limited, and for example, a polyurethane or the like can be used. In this manner, the tube 4 is configured such that the innermost portion is filled with the refrigerant C, and the outer side thereof is covered with the heat insulating layer 43, and the outer side is filled with the dry air DA. Thereby, it is possible to prevent the heat insulating layer 43 from coming into contact with the outside air, and it is possible to prevent dew condensation between the heat insulating layer 43 and the second pipe 42. Further, it is preferable that the second pipe 42 has a large number of irregularities. That is, the second pipe 42 preferably has a bellows shape. Thereby, the tube 4 is easily bent as a whole, whereby the winding (pipe) of the tube 4 becomes easy. As shown in FIG. 10, the tube 4 is provided with a positioning member 44 that positions the first pipe 41 and the second pipe 42 concentrically. The positioning members 44 are disposed at a plurality of intervals along the longitudinal direction of the tube 4. Thereby, the positioning of the first pipe 41 and the second pipe 42 is facilitated. The positioning member 44 is annular and fitted between the first pipe 41 and the second pipe 42. Further, at least one of the positioning members 44 is formed with a defective portion (through hole) 441 through which the dry air DA passes. As shown in FIG. 6, the first liquid leakage receiving portion 51 that receives the liquid leakage from the refrigerant C of the cooling unit 300 is provided below the cooling unit 300, and the liquid leakage flows from the first liquid leakage receiving portion 51 downward. The piping 52 and the second liquid leakage receiving portion 53 that receives the liquid leakage from the piping 52. The first liquid leakage receiving portion 51 is disposed in a dish-like member that is disposed directly under the cooling unit 300 and that covers the entire bottom portion of the cooling unit 300. Thereby, it is possible to prevent the liquid from scattering to the supply region A2 or the recovery region A4. The pipe 52 is a flexible pipe that communicates with the inside of the first liquid leakage receiving portion 51. This pipe 52 bypasses the supply area A2 or the recovery area A4 and extends to the lowermost position of the inspection apparatus 1. The liquid accumulated in the first liquid leakage receiving portion 51 can flow down in the pipe 52. The second liquid leakage receiving portion 53 is a member that is placed on a dish in the floor. The mouth portion 521 of the pipe 52 is opened in the second liquid leakage receiving portion 53. Thereby, the liquid that has flowed down in the pipe 52 can be received by the second liquid leakage receiving portion 53, and the liquid can be prevented from scattering to the floor. Further, in the inspection apparatus 1, the second liquid leakage receiving portion 53 can be omitted. As shown in FIG. 5 and FIG. 6, a plurality of (four in FIG. 5) casters 61 and a distributed arrangement are disposed vertically below the electronic component placement unit 30, that is, at the bottom of the inspection apparatus 1. A plurality of (7 in Fig. 5) adjustment feet 62. Furthermore, at least one of the adjustment legs 62 is preferably disposed on the beam 31. The transfer of the inspection device 1 is facilitated by the casters 61. Moreover, the inspection apparatus 1 after the conveyance can be fixed to the floor by adjusting the foot 62, whereby the inspection can be performed stably. <Second Embodiment> Fig. 11 is a schematic plan view showing an electronic component inspection device (second embodiment) of the present invention. In the following, the second embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted. This embodiment is the same as the above-described first embodiment except that the arrangement position of the refrigerant supply device is different. As shown in FIG. 11, in the present embodiment, the cooling unit 300 is disposed in a substantially uniform manner in the Y direction of the recovery area A4 in a plan view of the inspection apparatus 1. Also by so configured, and after the load test apparatus 300 of the center of gravity of the cooling unit 1 CG 1 disposed in a region other than a top region of the configuration space A6 of the testing machine. Thereby, the inspection apparatus 1 is stably set. <Third Embodiment> FIG. 12 is a transverse cross-sectional view showing a state of piping between a refrigerant supply device and a cooling target in the electronic component inspection device (third embodiment) of the present invention. In the following, the third embodiment of the electronic component transport apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted. This embodiment is the same as the above-described first embodiment except that the configuration of the tube is different. As shown in FIG. 12, in the present embodiment, the tube 4 is composed of two first pipes 41 which are covered by the second pipe 42 in a bundle. In this way, one of the two first pipes 41 can be used for supplying the refrigerant C to the cooling target, and the other first pipe 41 can be used to recover the refrigerant C from the cooling target. Recycling use. In addition, the number of the first pipes 41 is two in the present embodiment, but the number of the first pipes is not limited thereto, and may be three or more. <Fourth Embodiment> FIG. 13 is a view showing a piping state between a refrigerant supply device and a cooling target in the electronic component inspection device (fourth embodiment) of the present invention. In the following, the fourth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the description of the same matters will be omitted. This embodiment is the same as the above-described first embodiment except that the arrangement of the tubes is different. As shown in Fig. 13, in the present embodiment, one of the tubes 4 in the longitudinal direction is surrounded by the casing 400, that is, stored. The tank 400 is temporarily filled with dry air DA, whereby the dry air DA can be distributed, for example, to a portion using the dry air DA (for example, the tube 4). <Fifth Embodiment> FIG. 14 is a view showing a state of piping between a refrigerant supply device and a cooling target in the electronic component inspection device (fifth embodiment) of the present invention. In the following, the fifth embodiment of the electronic component conveying apparatus and the electronic component inspection apparatus according to the present invention will be described with reference to the drawings. However, the differences from the above-described embodiments will be mainly described, and the same matters will not be described. This embodiment is the same as the above-described first embodiment except that the arrangement of the tubes is different. As shown in Fig. 14, in the present embodiment, both end portions of the tube 4 are connected to the box-shaped connecting portion 500, respectively. The connecting portions 500 communicate with each other via the second pipes 42 of the tubes 4 . Thereby, for example, when the dry air DA is conveyed to the connecting portion 500 on the left side in FIG. 14, the dry air DA flows down in the second pipe 42 to reach the connecting portion 500 on the right side in FIG. As described above, the electronic component conveying device and the electronic component inspection device of the present invention have been described based on the embodiments of the present invention. However, the present invention is not limited thereto, and various components constituting the electronic component conveying device and the electronic component inspection device can be utilized. Any component of the same function is replaced. Further, any constituent may be added. Moreover, the electronic component conveying apparatus and the electronic component inspection apparatus of the present invention may be formed by combining any two or more of the above-described configurations (features).
1‧‧‧檢查裝置(電子零件檢查裝置)
4‧‧‧管
11A、11B‧‧‧托盤搬送機構
12‧‧‧溫度調整部(均熱板)
13‧‧‧元件搬送頭
14‧‧‧元件供給部(供給梭)
15‧‧‧托盤搬送機構
16‧‧‧檢查部
17‧‧‧元件搬送頭
18‧‧‧元件回收部(回收梭)
19‧‧‧回收用托盤
20‧‧‧元件搬送頭
21‧‧‧托盤搬送機構
22A、22B‧‧‧托盤搬送機構
29‧‧‧檢查部配置部
30‧‧‧電子零件配置部
31‧‧‧樑
41‧‧‧第1配管
42‧‧‧第2配管
43‧‧‧隔熱層
44‧‧‧定位構件
51‧‧‧第1漏液接收部
52‧‧‧配管
53‧‧‧第2漏液接收部
61‧‧‧腳輪
62‧‧‧調節腳
70‧‧‧前外殼
71‧‧‧側外殼
72‧‧‧側外殼
73‧‧‧後外殼
74‧‧‧頂外殼
80‧‧‧控制部
90‧‧‧IC元件
200‧‧‧托盤
300‧‧‧冷卻單元
301‧‧‧儲存槽
302‧‧‧流路
303‧‧‧供給路徑
304‧‧‧閥
305‧‧‧汽化室
307‧‧‧熱交換器
308‧‧‧隔熱材
309‧‧‧排出路徑
310‧‧‧止回閥
311‧‧‧熱交換器
312‧‧‧低溫流體室
313‧‧‧乾燥空氣供給源
314‧‧‧高溫流體室
315‧‧‧空氣加熱器
316‧‧‧止回閥
400‧‧‧箱體
441‧‧‧缺損部(貫通孔)
500‧‧‧連接部
521‧‧‧口部
600‧‧‧測試機
A1‧‧‧托盤供給區域
A2‧‧‧元件供給區域(供給區域)
A3‧‧‧檢查區域
A4‧‧‧元件回收區域(回收區域)
A5‧‧‧托盤去除區域
A6‧‧‧測試機配置空間
C‧‧‧冷媒
CG1、CG300‧‧‧重心
DA‧‧‧乾燥空氣(dry air)
t‧‧‧厚度
d1 - 1
、d2 - 1‧‧‧
外徑
d1 - 2
、d2 - 2‧‧‧
內徑1‧‧‧Inspection device (electronic parts inspection device)
4‧‧‧ tube
11A, 11B‧‧‧Tray transport mechanism
12‧‧‧Temperature adjustment unit (soaking plate)
13‧‧‧Component transport head
14‧‧‧Component supply unit (supply shuttle)
15‧‧‧Tray transport mechanism
16‧‧‧Inspection Department
17‧‧‧Component head
18‧‧‧Component Recycling Department (Recycling Shuttle)
19‧‧‧Recycling tray
20‧‧‧Component head
21‧‧‧Tray transport mechanism
22A, 22B‧‧‧Tray transport mechanism
29‧‧‧ Inspection Department Configuration Department
30‧‧‧Electronic Parts Configuration Department
31‧‧‧ beams
41‧‧‧1st piping
42‧‧‧2nd piping
43‧‧‧Insulation
44‧‧‧ Positioning members
51‧‧‧1st liquid leakage receiving unit
52‧‧‧Pipe
53‧‧‧Second liquid leakage receiving unit
61‧‧‧ casters
62‧‧‧Adjustment feet
70‧‧‧ front casing
71‧‧‧ side shell
72‧‧‧ side shell
73‧‧‧ rear casing
74‧‧‧ top shell
80‧‧‧Control Department
90‧‧‧IC components
200‧‧‧Tray
300‧‧‧Cooling unit
301‧‧‧ storage tank
302‧‧‧flow path
303‧‧‧Supply path
304‧‧‧ valve
305‧‧‧vaporization room
307‧‧‧ heat exchanger
308‧‧‧Insulation
309‧‧‧Drainage path
310‧‧‧ check valve
311‧‧‧ heat exchanger
312‧‧‧Cryogenic fluid chamber
313‧‧‧ Dry air supply source
314‧‧‧High temperature fluid chamber
315‧‧‧Air heater
316‧‧‧ check valve
400‧‧‧ cabinet
441‧‧‧Defects (through holes)
500‧‧‧Connecting Department
521‧‧‧ mouth
600‧‧‧Tester
A1‧‧‧Tray supply area
A2‧‧‧Component supply area (supply area)
A3‧‧‧ inspection area
A4‧‧‧Component recycling area (recycling area)
A5‧‧‧Tray removal area
A6‧‧‧Tester configuration space
C‧‧‧Refrigerant
CG 1 , CG 300 ‧ ‧ center of gravity
DA‧‧‧dry air
T‧‧‧thickness
d 1 - 1 , d 2 - 1 ‧‧‧ OD
d 1 - 2, d 2 - 2 ‧‧‧ Inside diameter
圖1係自正面側觀察本發明之電子零件搬送裝置(第1實施形態)之概略立體圖。圖2係自背面側觀察本發明之電子零件搬送裝置(第1實施形態)之概略立體圖。圖3係表示本發明之電子零件檢查裝置(第1實施形態)之概略俯視圖。圖4係表示本發明之電子零件檢查裝置(第1實施形態)之概略俯視圖。圖5係表示本發明之電子零件檢查裝置(第1實施形態)之概略俯視圖。圖6係表示本發明之電子零件檢查裝置(第1實施形態)之概略正視圖。圖7係模式性表示本發明之電子零件搬送裝置所具備之冷媒供給裝置之內部結構之概略構成圖。圖8係表示本發明之電子零件檢查裝置(第1實施形態)中之冷媒供給裝置與冷卻對象之間之配管狀態之圖。圖9係圖8中之A-A線剖視圖。圖10係圖8中之B-B線剖視圖。圖11係表示本發明之電子零件檢查裝置(第2實施形態)之概略俯視圖。圖12係表示本發明之電子零件檢查裝置(第3實施形態)中之冷媒供給裝置與冷卻對象之間之配管狀態之橫向剖視圖。圖13係表示本發明之電子零件檢查裝置(第4實施形態)中之冷媒供給裝置與冷卻對象之間之配管狀態之圖。 圖14係表示本發明之電子零件檢查裝置(第5實施形態)中之冷媒供給裝置與冷卻對象之間之配管狀態之圖。Fig. 1 is a schematic perspective view of the electronic component conveying device (first embodiment) of the present invention as seen from the front side. Fig. 2 is a schematic perspective view of the electronic component conveying device (first embodiment) of the present invention as seen from the back side. Fig. 3 is a schematic plan view showing an electronic component inspection device (first embodiment) of the present invention. Fig. 4 is a schematic plan view showing an electronic component inspection device (first embodiment) of the present invention. Fig. 5 is a schematic plan view showing an electronic component inspection device (first embodiment) of the present invention. Fig. 6 is a schematic front view showing an electronic component inspection device (first embodiment) of the present invention. FIG. 7 is a schematic configuration diagram showing the internal structure of a refrigerant supply device provided in the electronic component conveying device of the present invention. FIG. 8 is a view showing a piping state between the refrigerant supply device and the cooling target in the electronic component inspection device (first embodiment) of the present invention. Figure 9 is a cross-sectional view taken along line A-A of Figure 8. Figure 10 is a cross-sectional view taken along line B-B of Figure 8. Fig. 11 is a schematic plan view showing an electronic component inspection device (second embodiment) of the present invention. FIG. 12 is a transverse cross-sectional view showing a state of piping between a refrigerant supply device and a cooling target in the electronic component inspection device (third embodiment) of the present invention. FIG. 13 is a view showing a piping state between the refrigerant supply device and the cooling target in the electronic component inspection device (fourth embodiment) of the present invention. Fig. 14 is a view showing a state of piping between a refrigerant supply device and a cooling target in the electronic component inspection device (fifth embodiment) of the present invention.
1‧‧‧檢查裝置(電子零件檢查裝置) 1‧‧‧Inspection device (electronic parts inspection device)
31‧‧‧樑 31‧‧‧ beams
71‧‧‧側外殼 71‧‧‧ side shell
73‧‧‧後外殼 73‧‧‧ rear casing
74‧‧‧頂外殼 74‧‧‧ top shell
80‧‧‧控制部 80‧‧‧Control Department
300‧‧‧冷卻單元 300‧‧‧Cooling unit
A2‧‧‧元件供給區域(供給區域) A2‧‧‧Component supply area (supply area)
A3‧‧‧檢查區域 A3‧‧‧ inspection area
A4‧‧‧元件回收區域(回收區域) A4‧‧‧Component recycling area (recycling area)
A6‧‧‧測試機配置空間 A6‧‧‧Tester configuration space
Claims (7)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014145713A JP2016023938A (en) | 2014-07-16 | 2014-07-16 | Electronic component conveyance device and electronic component inspection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201727245A true TW201727245A (en) | 2017-08-01 |
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ID=55147223
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW106113657A TW201727245A (en) | 2014-07-16 | 2015-07-13 | Electronic component transfer apparatus and electronic component inspection apparatus |
| TW104122617A TWI586970B (en) | 2014-07-16 | 2015-07-13 | Electronic parts conveyor and electronic parts inspection device |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104122617A TWI586970B (en) | 2014-07-16 | 2015-07-13 | Electronic parts conveyor and electronic parts inspection device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2016023938A (en) |
| KR (2) | KR20160009481A (en) |
| CN (1) | CN105277869A (en) |
| TW (2) | TW201727245A (en) |
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|---|---|---|---|---|
| JP2017173075A (en) * | 2016-03-23 | 2017-09-28 | セイコーエプソン株式会社 | Electronic component conveyance device and electronic component inspection device |
| TW201819931A (en) * | 2016-11-29 | 2018-06-01 | 日商精工愛普生股份有限公司 | Electronic parts conveying device and electronic parts inspection device capable of accurately and efficiently inspecting electronic parts |
| TWI629490B (en) * | 2017-07-07 | 2018-07-11 | 鴻勁精密股份有限公司 | Electronic component testing equipment with lower-type cold source conveying device |
| KR102440374B1 (en) * | 2017-07-20 | 2022-09-06 | (주)테크윙 | Hander for testing electronic components |
| JP2019045169A (en) * | 2017-08-30 | 2019-03-22 | セイコーエプソン株式会社 | Electronic component conveyance apparatus and electronic component inspection device |
| JP7273656B2 (en) * | 2019-08-14 | 2023-05-15 | 東京エレクトロン株式会社 | How to pre-cool the prober and probe card |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4065059B2 (en) | 1998-07-24 | 2008-03-19 | 株式会社アドバンテスト | IC test equipment |
| JP2002130916A (en) * | 2000-10-18 | 2002-05-09 | Sumitomo Heavy Ind Ltd | Low-temperature cooling unit equipped with dew formation preventing mechanism |
| US7233159B2 (en) * | 2004-06-02 | 2007-06-19 | Emc Corporation | Ergonomic, rotatable electronic component testing apparatus |
| CN102713462A (en) * | 2010-01-05 | 2012-10-03 | 大金工业株式会社 | Refrigeration device |
| KR101745894B1 (en) * | 2012-08-21 | 2017-06-12 | (주)테크윙 | Heating device for test handler |
| KR101936348B1 (en) * | 2012-09-17 | 2019-01-08 | 삼성전자주식회사 | test handler for realizing rapid temperature transition and semiconductor device test method using the same |
-
2014
- 2014-07-16 JP JP2014145713A patent/JP2016023938A/en active Pending
-
2015
- 2015-01-28 KR KR1020150013233A patent/KR20160009481A/en active Application Filing
- 2015-02-28 CN CN201510091746.2A patent/CN105277869A/en active Pending
- 2015-07-13 TW TW106113657A patent/TW201727245A/en unknown
- 2015-07-13 TW TW104122617A patent/TWI586970B/en not_active IP Right Cessation
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2016
- 2016-09-01 KR KR1020160112561A patent/KR20160106538A/en not_active Application Discontinuation
Also Published As
| Publication number | Publication date |
|---|---|
| TWI586970B (en) | 2017-06-11 |
| CN105277869A (en) | 2016-01-27 |
| TW201604555A (en) | 2016-02-01 |
| JP2016023938A (en) | 2016-02-08 |
| KR20160106538A (en) | 2016-09-12 |
| KR20160009481A (en) | 2016-01-26 |
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