TW201713447A - Laser surface preparation of coated substrate - Google Patents
Laser surface preparation of coated substrate Download PDFInfo
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- TW201713447A TW201713447A TW105132476A TW105132476A TW201713447A TW 201713447 A TW201713447 A TW 201713447A TW 105132476 A TW105132476 A TW 105132476A TW 105132476 A TW105132476 A TW 105132476A TW 201713447 A TW201713447 A TW 201713447A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0738—Shaping the laser spot into a linear shape
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/18—Working by laser beam, e.g. welding, cutting or boring using absorbing layers on the workpiece, e.g. for marking or protecting purposes
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
- B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/002—Precutting and tensioning or breaking
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/06—Severing by using heat
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
- C03B33/074—Glass products comprising an outer layer or surface coating of non-glass material
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
- C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/28—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material
- C03C17/32—Surface treatment of glass, not in the form of fibres or filaments, by coating with organic material with synthetic or natural resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/34—Coated articles, e.g. plated or painted; Surface treated articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/16—Composite materials, e.g. fibre reinforced
- B23K2103/166—Multilayered materials
- B23K2103/172—Multilayered materials wherein at least one of the layers is non-metallic
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/30—Organic material
- B23K2103/42—Plastics
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/54—Glass
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
- C03C2218/328—Partly or completely removing a coating
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Abstract
Description
本發明大體上關於經塗覆的基材，且更明確言之，是關於欲進行雷射切割之經塗覆基材(coated substrate)的雷射製備方法。The present invention relates generally to coated substrates and, more specifically, to laser fabrication methods for coated substrates to be laser cut.
精密微加工技術的進步及相關製程的改進使得尺寸得以縮小、重量減輕且降低材料成本，而有助於諸如但不限於可用於觸控螢幕、平板電腦、智慧型手機及電視之平面顯示器等產品快速成長。由於這些進步，使得超快速工業雷射成為用在需要高精密微加工之應用上的重要工具。期望可使用這類雷射的雷射切割製程以可控制的方式來分割基材，所生成的碎屑可忽略不計且對基材造成最少缺陷及低的表面下(subsurface)損傷。在不限制本發明的情況下，藉由形成垂直斷裂線或受損印跡來建立阻力最小的裂紋擴大路徑以沿著該路徑分割基材，可使某些雷射切割製程符合此等期望。此等製程使破裂及分割作用侷限在該受損印跡處並防止在基材的任何其他部分中產生裂紋或使裂紋減至最少。Advances in precision micromachining technology and improvements in related processes have enabled size reduction, weight reduction, and material cost reduction, and are useful for products such as, but not limited to, flat panel displays for touch screens, tablets, smart phones, and televisions. growing up very fast. As a result of these advances, ultra-fast industrial lasers have become an important tool for applications requiring high precision micromachining. It is desirable to use a laser cutting process using such lasers to divide the substrate in a controlled manner, resulting in negligible debris and minimal defects and low subsurface damage to the substrate. Without limiting the invention, certain laser cutting processes may meet such expectations by forming a vertical fracture line or a damaged footprint to create a crack-extended path with minimal resistance to split the substrate along the path. These processes limit the rupture and segmentation to the damaged footprint and prevent cracking or minimize cracking in any other portion of the substrate.
基材表面上的塗層可能降低雷射切割製程的效果。例如，塗層可能吸收部分的雷射光束、改變雷射光束進入基材內部部分的傳播作用。這會進而限制雷射能量到達基材內部部分的量，而降低在基材中所形成之受損印跡的品質。因此，使裂紋擴大作用侷限在該受損印跡處這件事變得較不可預期且較不易控制，也使基材分割變得較為困難。此外，分割經塗覆的基材可能形成無法接受的碎屑量，且亦可能對該基材的該等分割部分造成缺陷或表面下的損傷。The coating on the surface of the substrate may reduce the effectiveness of the laser cutting process. For example, the coating may absorb a portion of the laser beam and change the propagation of the laser beam into the interior portion of the substrate. This in turn limits the amount of laser energy reaching the inner portion of the substrate, while reducing the quality of the damaged print formed in the substrate. Therefore, the limitation of crack propagation to the damaged footprint becomes less predictable and less controllable, which also makes substrate segmentation more difficult. In addition, segmenting the coated substrate may result in an unacceptable amount of debris and may also cause defects or subsurface damage to the segmented portions of the substrate.
根據本發明一實施例提供一種供欲接受雷射切割之經塗覆基材用的雷射製備方法。該方法包括引導雷射燒蝕光束至聚合物塗層的目標部分，以從經塗覆的基材上實質去除該目標部分，其中該聚合物塗層的該目標部分具有介於約10微米至約6.0毫米間的寬度。According to an embodiment of the invention, a laser preparation method for a coated substrate to be subjected to laser cutting is provided. The method includes directing a laser ablation beam to a target portion of a polymer coating to substantially remove the target portion from the coated substrate, wherein the target portion of the polymer coating has a thickness of between about 10 microns Width of about 6.0 mm.
根據本發明另一實施例提供一種用於雷射切割經塗覆基材的方法。該方法包括引導雷射燒蝕光束至聚合物塗層的複數個目標部分，以從經塗覆的基材上實質去除該複數個目標部分而形成預定塗層去除圖案。該方法進一步包括引導雷射切割光束沿該預定塗層去除圖案行進，及使該經塗覆的基材分割成至少兩個經塗覆部分。該預定塗層去除圖案具有介於約10微米至約6.0毫米間的寬度。In accordance with another embodiment of the present invention, a method for laser cutting a coated substrate is provided. The method includes directing a laser ablation beam to a plurality of target portions of a polymer coating to substantially remove the plurality of target portions from the coated substrate to form a predetermined coating removal pattern. The method further includes directing the laser cutting beam to travel along the predetermined coating removal pattern and dividing the coated substrate into at least two coated portions. The predetermined coating removal pattern has a width of between about 10 microns and about 6.0 mm.
在以下實施方式中將舉出附加特徵及優點，且所屬技術領域中熟悉技藝者將可由說明內容或藉由實施本文(包括以下實施方式、申請專利範圍及所附圖式)中所述的實施例而易於瞭解或領會部分的特徵及優點。Additional features and advantages will be set forth in the description which follows, and those skilled in the <Desc/Clms Page number> For example, it is easy to understand or appreciate some of the features and advantages.
應明白，先前整體概述及隨後的詳細說明皆僅做示範之用，意在提供概觀綜述或架構以供瞭解該等請求像的本質及特性。所含附圖可提供進一步的瞭解且應併入本案說明書中並構成本案說明書的一部分。該等圖式示出一或更多個實施例且可配合說明內容用來解說各種實施例的原理及操作方式。It should be understood that the foregoing general overview and subsequent detailed description are for illustrative purposes only and are intended to provide an overview or a structure for understanding the nature and characteristics of the claimed. The accompanying drawings are provided to provide a further understanding and are incorporated in the description of the specification and constitute a part of the specification. The drawings illustrate one or more embodiments and may be used to illustrate the principles and operation of the various embodiments.
現將參照本發明實施例做詳細說明，且附圖中圖示出該(等)實施例中的實例。在所有圖式中將儘可能地使用相同元件符號來代表相同或相似的部分。The detailed description will now be made with reference to the embodiments of the present invention, and the examples in this embodiment are illustrated. Wherever possible, the same reference numerals will be used to the
除非文中另有清楚指示，否則單數用語「一」、及「該」包括複數之意。用來描述相同特性之所有範圍的端點值皆為可各自獨立地組合且包含所載明的端點值。所有參考文獻皆以引用方式併入本案。Unless the context clearly dictates otherwise, the singular terms "a" and "the" mean plural. The endpoint values used to describe all ranges of the same feature are all independently combinable and include the endpoint values stated. All references are incorporated herein by reference.
以下先概要描述本發明，隨後再依據數個示例性實施例來詳細說明本發明。在個別示例性實施例中所示出互相搭配組合的特徵並無需全部實施。尤其，個別特徵亦可省略或與該同一示例性實施例或與其他示例性實施例中所示的其他特徵以某些其他方式進行組合。The invention will be briefly described below, and the invention will be described in detail below with reference to several exemplary embodiments. Features that are shown in combination with each other in the various exemplary embodiments are not required to be fully implemented. In particular, individual features may also be omitted or combined in some other manner with the same exemplary embodiment or with other features shown in other exemplary embodiments.
本發明實施例是關於可供欲接受雷射切割之經塗覆基材用的雷射製備方法及有關用來雷射切割經塗覆之基材的方法。如文中所述，經塗覆之基材塗有聚合物塗層。例如，聚合物塗層可包括但不限於高折射率聚合物(HRIP)、保護性聚合物膜及光阻劑材料。文中所使用的高折射率聚合物(HRIP)一詞是用來表示具有大於1.50之折射率的聚合物。又如文中所述般，基材為雷射燒蝕光束波長可穿透的材料，該材料可為，但不限於，玻璃、熔融矽石(fused silica)、藍寶石或雷射燒蝕光束波長可穿透的任何其他材料。Embodiments of the present invention relate to laser preparation methods for coated substrates that are subject to laser cutting and to methods for laser cutting coated substrates. As described herein, the coated substrate is coated with a polymeric coating. For example, the polymer coating can include, but is not limited to, a high refractive index polymer (HRIP), a protective polymer film, and a photoresist material. The term high refractive index polymer (HRIP) as used herein is used to mean a polymer having a refractive index greater than 1.50. As described herein, the substrate is a material that is transparent to the wavelength of the laser ablation beam, which may be, but is not limited to, glass, fused silica, sapphire, or laser ablation beam wavelengths. Any other material that penetrates.
根據本發明實施例，經塗覆之基材的雷射製備方法包括引導雷射燒蝕光束至聚合物塗層的目標部分，以實質去除該聚合物塗層的該目標部分。較佳者，實質去除聚合物塗層的目標部分包括去除該聚合物塗層之該目標部分處約100%的聚合物。然而，亦可設想實質去除聚合物塗層的目標部分可包括去除該聚合物塗層之該目標部分處超過約90%、或超過約95%或甚至高過約98%的聚合物。當用於本文中，「雷射燒蝕光束(ablative laser beam)」一詞為配置用來造成聚合物塗層材料燒蝕的雷射光束。可由皮秒雷射或飛秒雷射發射該雷射燒蝕光束，其中該等雷射可為脈衝式雷射且可配置用來產生單次雷射脈衝或脈衝叢發，藉以形成雷射燒蝕光束而與該經塗覆基材的聚合物塗層產生交互作用。該雷射燒蝕光束可具有會被聚合物塗層所吸收的波長。藉著聚合物塗層吸收該雷射光束，該雷射光束不會進入下方基材中且不會加熱該下方基材或在該下方基材中造成應力。或者，該雷射燒蝕光束在該目標部分處所具有的強度可在該雷射燒蝕光束之焦點體積(focal volume)內的聚合物塗層中產生多光子吸收作用。該雷射燒蝕光束的波長及/或強度可根據該經塗覆基材的聚合物塗層材料而改變。此外，該雷射的脈衝持續時間(pulse duration)可加以選擇，使得在交互作用時間內沒有顯著的熱從該目標部分擴散出來(特別是例如：τ＜＜d2 /α，其中d為雷射光束的焦點直徑，τ為雷射脈衝持續時間，及α為聚合物材料的熱擴散常數)。In accordance with an embodiment of the present invention, a laser preparation method for a coated substrate includes directing a laser ablation beam to a target portion of a polymer coating to substantially remove the target portion of the polymer coating. Preferably, substantially removing the target portion of the polymeric coating comprises removing about 100% of the polymer at the target portion of the polymeric coating. However, it is also contemplated that substantially removing the target portion of the polymeric coating can include removing more than about 90%, or more than about 95% or even more than about 98% of the polymer at the target portion of the polymeric coating. As used herein, the term "ablative laser beam" is a laser beam configured to cause ablation of a polymeric coating material. The laser ablation beam can be emitted by a picosecond laser or a femtosecond laser, wherein the laser can be a pulsed laser and can be configured to generate a single laser pulse or pulse burst to form a laser burn The beam is etched to interact with the polymer coating of the coated substrate. The laser ablation beam can have a wavelength that is absorbed by the polymer coating. The laser beam is absorbed by the polymer coating, the laser beam does not enter the underlying substrate and does not heat the underlying substrate or cause stress in the underlying substrate. Alternatively, the intensity of the laser ablation beam at the target portion can produce multiphoton absorption in the polymer coating within the focal volume of the laser ablation beam. The wavelength and/or intensity of the laser ablation beam can vary depending on the polymeric coating material of the coated substrate. Furthermore, the pulse duration of the laser can be selected such that no significant heat is diffused from the target portion during the interaction time (especially for example: τ<<d 2 /α, where d is Ray The focal diameter of the beam, τ is the duration of the laser pulse, and α is the thermal diffusion constant of the polymer material).
引導雷射燒蝕光束至目標部分可包括對該聚合物塗層的該目標部分施加至少一雷射脈衝。在該聚合物塗層的該目標部分處進行燒蝕(ablation)之後，該雷射燒蝕光束可對準該聚合物塗層的後續目標部分，而得以對該聚合物塗層的該後續目標部分施加後續雷射脈衝以實質去除該經塗覆基材上的該後續目標部分。在該聚合物塗層的該後續目標部分處進行燒蝕之後，該雷射燒蝕光束可視需要進行任意次數的重新對準以對該聚合物塗層的多個後續目標部分施加後續雷射脈衝並根據預定的塗層去除圖案來持續進行此動作。由於該雷射燒蝕光束可聚焦成具有直徑及周長的圓點，故可藉著使該雷射燒蝕光束的焦點有至少一部分與該先前已去除之目標部分的至少一部分重疊的方式依據預定塗層去除圖案來去除目標部分。以此方式，該預定塗層去除圖案可為具有實質一致寬度的實質直線。如以下所述，該預定塗層去除圖案的寬度可實質等於該雷射燒蝕光束之焦點的直徑。在任何情況下，該預定塗層去除圖案的寬度實質等於該目標部分的寬度，該目標部分的寬度可例如為約10微米至約6.0毫米，例如約100微米至約4.0毫米或甚至約200微米至約2.0毫米。可對該等目標部分的每個部分施加任意次數的雷射脈衝以求實質去除該聚合物塗層的該目標部分。在某些情況下，每個目標部分接受一次雷射脈衝可能足以實質去除該聚合物塗層的每個目標部分。或者，可對該等目標部分各自施加兩次或更多次雷射脈衝以去除該聚合物塗層的該等目標部分。Directing the laser ablation beam to the target portion can include applying at least one laser pulse to the target portion of the polymer coating. After ablation at the target portion of the polymer coating, the laser ablation beam can be aligned to a subsequent target portion of the polymer coating to achieve the subsequent target of the polymer coating. A subsequent laser pulse is applied in part to substantially remove the subsequent target portion on the coated substrate. After ablation at the subsequent target portion of the polymer coating, the laser ablation beam can be realigned as many times as needed to apply subsequent laser pulses to a plurality of subsequent target portions of the polymer coating. This action is continued in accordance with a predetermined coating removal pattern. Since the laser ablation beam can be focused into a circle having a diameter and a perimeter, the manner in which at least a portion of the focus of the laser ablation beam overlaps at least a portion of the previously removed target portion can be relied upon. The coating is removed from the pattern to remove the target portion. In this manner, the predetermined coating removal pattern can be a substantially straight line having a substantially uniform width. As described below, the predetermined coating removal pattern may have a width substantially equal to the diameter of the focus of the laser ablation beam. In any event, the predetermined coating removal pattern has a width substantially equal to the width of the target portion, and the target portion may have a width of, for example, from about 10 microns to about 6.0 mm, such as from about 100 microns to about 4.0 mm or even about 200 microns. Up to about 2.0 mm. Any number of laser pulses can be applied to each portion of the target portions to substantially remove the target portion of the polymer coating. In some cases, receiving a laser pulse for each target portion may be sufficient to substantially remove each target portion of the polymer coating. Alternatively, two or more laser pulses may be applied to each of the target portions to remove the target portions of the polymer coating.
引導雷射燒蝕光束至目標部分可包括在該經塗覆基材的經塗覆表面附近配置該雷射燒蝕光束來源及對該聚合物塗層的該目標部分施加至少一雷射脈衝。或者，當該經塗覆基材包括至少一未經塗覆的表面時，引導雷射燒蝕光束至目標部分的步驟可包括在該至少一未經塗覆的表面附近配置該雷射燒蝕光束來源，及引導該雷射燒蝕光束前往該至少一未經塗覆的表面並通過該基材而到達該聚合物塗層，以對該聚合物塗層的該目標部分施加至少一雷射脈衝。Directing the laser ablation beam to the target portion can include disposing the source of the laser ablation beam adjacent the coated surface of the coated substrate and applying at least one laser pulse to the target portion of the polymer coating. Alternatively, when the coated substrate comprises at least one uncoated surface, the step of directing the laser ablation beam to the target portion can include disposing the laser ablation near the at least one uncoated surface Source of the beam, and directing the laser ablation beam to the at least one uncoated surface and through the substrate to reach the polymer coating to apply at least one laser to the target portion of the polymer coating pulse.
可在該聚合物塗層的該目標部分上形成相對大的焦點來進行引導雷射燒蝕光束至該目標部分的步驟。當用於本文中，相對大的焦點為所具有之直徑與該聚合物塗層之目標部分的寬度實質相等的雷射光束點。藉著在x方向或y方向上移動該雷射燒蝕光束(或移動該經塗覆基材)且無需在角方向上進行任何附加掃描，具有此相對大焦點的雷射燒蝕光束可形成該預定塗層去除圖案。或者，可在該聚合物塗層的該目標部分上形成相對小的焦點來進行引導雷射燒蝕光束至該目標部分的步驟。當用於本文中，相對小的焦點為所具有之直徑比該聚合物塗層之目標部分的寬度要小的雷射光束點。此種相對小的焦點無法藉著單獨在x方向上或y方向上移動該雷射燒蝕光束(或移動該經塗覆基材)來形成該預定塗層去除圖案。使用此種相對小焦點的雷射脈衝，亦可以一角方向引導該雷射燒蝕光束指向該等目標部分的附加部位處來進行掃描以去除該等目標部分。A relatively large focus can be formed on the target portion of the polymer coating to perform the step of directing the laser ablation beam to the target portion. As used herein, a relatively large focus is a laser beam spot having a diameter substantially equal to the width of the target portion of the polymer coating. A laser ablation beam having this relatively large focus can be formed by moving the laser ablation beam (or moving the coated substrate) in the x or y direction without any additional scanning in the angular direction The predetermined coating removes the pattern. Alternatively, a relatively small focus can be formed on the target portion of the polymer coating to perform the step of directing the laser ablation beam to the target portion. As used herein, a relatively small focus is a laser beam spot having a diameter that is less than the width of the target portion of the polymer coating. Such relatively small focus cannot form the predetermined coating removal pattern by moving the laser ablation beam alone (or moving the coated substrate) in the x-direction or the y-direction. Using such a relatively small focus laser pulse, the laser ablation beam can also be directed at an additional location of the target portion to scan to remove the target portion.
通常，會對欲接受雷射切割的經塗覆基材進行製備，以期僅沿預定塗層去除圖案來去除聚合物塗層的目標部分而不會去除該經塗覆基材之該聚合物塗層的其他部分。當已去除該聚合物塗層的該等目標部分之後，引導雷射切割光束沿著該預定塗層去除圖案行進，該雷射切割光束將不會接觸到該經塗覆基材之該聚合物塗層的其他部分。此方式可進而使該聚合物塗層之其他部分的去除或劣化情況減至最少，同時亦可防止該聚合物塗層在該雷射切割光束傳播方面上可能有所變化作用的情況發生。根據本發明實施例，該等目標部分具有足以容納雷射切割光束的寬度。Typically, a coated substrate to be subjected to laser cutting is prepared in order to remove the target portion of the polymer coating only by removing the pattern along the predetermined coating without removing the polymer coating of the coated substrate. The rest of the layer. After the target portions of the polymer coating have been removed, the laser cutting beam is directed to travel along the predetermined coating removal pattern, the laser cutting beam will not contact the polymer of the coated substrate The other part of the coating. This approach can in turn minimize or minimize the removal or degradation of other portions of the polymeric coating while also preventing the polymeric coating from possibly changing in terms of the laser cutting beam propagation. According to an embodiment of the invention, the target portions have a width sufficient to accommodate the laser cutting beam.
本發明實施例可進一步包括從去除該聚合物塗層之該等目標部分的步驟中提取出殘餘產物。在該聚合物塗層的該目標部分附近(例如，上方)可配置具有至少一抽吸口的設備，如此得以在去除該聚合物塗層之目標部分的期間形成負壓且引導該等殘餘產物通過該至少一抽吸口並提取該等殘餘產物。此外，亦可在該聚合物塗層的該目標部分附近(例如，上方)配置具有至少一排放口的設備以將氣體導向該聚合物塗層的該目標部分。該具有至少一抽吸口的設備可能與該具有至少一排放口的設備不同。或者，設備可兼具至少一抽吸口及至少一排放口。本發明實施例可包括任意數目的排放口。在與該至少一抽吸口合作下，來自該至少一排放口的氣流會形成氣流通量(gas throughput)，該氣流通量可引導殘餘產物從該目標部分流向該至少一抽吸口並使該等殘餘產物散播至該經塗覆基材之其他部分處的程度降至最低。在該雷射燒蝕光束以一角方向進行掃描的實施例中，可移動該至少一抽吸口以使其位置保持位在該聚合物塗層的該目標附近(例如，位在該聚合物塗層之該目標部分上方)，及/或可移動該至少一排放口以使其位置保持在可將氣體導向該聚合物塗層的該目標部分之處。或者可移動該經塗覆基材以維持該至少一抽吸口及/或該至少一排放口的位置。Embodiments of the invention may further include extracting residual product from the step of removing the target portions of the polymer coating. An apparatus having at least one suction port may be disposed adjacent (eg, above) the target portion of the polymer coating such that a negative pressure is formed and the residual product is directed during removal of the target portion of the polymer coating The residual product is extracted through the at least one suction port. Additionally, a device having at least one vent may be disposed adjacent (e.g., above) the target portion of the polymer coating to direct gas to the target portion of the polymer coating. The device having at least one suction port may be different from the device having at least one discharge port. Alternatively, the apparatus may have at least one suction port and at least one discharge port. Embodiments of the invention may include any number of vents. In cooperation with the at least one suction port, the gas flow from the at least one vent may form a gas throughput that directs residual product from the target portion to the at least one suction port and The extent to which the residual product is dispersed to other portions of the coated substrate is minimized. In embodiments where the laser ablation beam is scanned in an angular direction, the at least one suction port can be moved to maintain its position near the target of the polymer coating (eg, in the polymer coating) Above the target portion of the layer, and/or the at least one vent can be moved to maintain its position at the target portion where the gas can be directed to the polymer coating. Alternatively, the coated substrate can be moved to maintain the position of the at least one suction port and/or the at least one discharge port.
第1圖為流程圖100，該流程圖100根據本發明實施例示出一種可供欲接受雷射切割之經塗覆基材用的雷射製備方法。如圖所示，在步驟102中，引導雷射燒蝕光束至聚合物塗層的目標部分而從經塗覆基材上實質去除該聚合物塗層的該目標部分。於步驟104，對該聚合物塗層的該目標部分施加至少一雷射脈衝。於步驟106，使該雷射燒蝕光束對準該聚合物塗層的後續目標部分。於步驟108，對該聚合物塗層的該後續目標部分施加至少一後續雷射脈衝。於步驟110，判斷該預定塗層去除圖案是否完成。若尚未完成，該方法回到步驟106，使該雷射燒蝕光束對準該聚合物塗層的後續目標部分。若判斷該塗層去除圖案已完成，則可結束該方法。1 is a flow chart 100 showing a laser preparation method for a coated substrate to be subjected to laser cutting in accordance with an embodiment of the present invention. As shown, in step 102, the laser ablation beam is directed to a target portion of the polymer coating to substantially remove the target portion of the polymer coating from the coated substrate. At step 104, at least one laser pulse is applied to the target portion of the polymer coating. At step 106, the laser ablation beam is directed at a subsequent target portion of the polymer coating. At step 108, at least one subsequent laser pulse is applied to the subsequent target portion of the polymer coating. At step 110, it is determined whether the predetermined coating removal pattern is completed. If not, the method returns to step 106 to align the laser ablation beam with a subsequent target portion of the polymer coating. If it is judged that the coating removal pattern has been completed, the method can be ended.
本發明實施例亦有關用來雷射切割經塗覆基材的方法。在該經塗覆基材的製備製程中，藉著引導雷射燒蝕光束至該聚合物塗層的複數個目標部分而沿著預定塗層去除圖案實質去除該聚合物塗層的該複數個目標部分，接著是，在已去除該聚合物塗層的該等目標部分之後可引導雷射切割光束沿著該預定塗層去除圖案行進，以將該經塗覆基材分割成多個經塗覆的部分。如上所述，本發明實施例有助於引導雷射切割光束順著該預定塗層去除圖案行進，其中該雷射切割光束不會與該經塗覆基材之該聚合物塗層的其他部分接觸。Embodiments of the invention are also directed to methods for laser cutting a coated substrate. In the preparation process of the coated substrate, the plurality of polymer coatings are substantially removed along the predetermined coating removal pattern by directing the laser ablation beam to the plurality of target portions of the polymer coating. a target portion, followed by guiding the laser cut beam along the predetermined coating removal pattern after the target portions of the polymer coating have been removed to divide the coated substrate into a plurality of coated Covered part. As described above, embodiments of the present invention facilitate directing a laser cutting beam to travel along the predetermined coating removal pattern, wherein the laser cutting beam does not interact with other portions of the polymer coating of the coated substrate. contact.
引導雷射切割光束沿著該預定塗層去除圖案行進的步驟包括使脈衝式雷射切割光束在該經塗覆基材中聚焦成雷射光束聚焦線，以沿著該經塗覆基材中的該雷射切割光束聚焦線產生誘發性吸收作用(induced absorption)。該脈衝式雷射切割光束聚焦在該經塗覆基材中的複數個位置處而沿著該經塗覆基材中的該雷射切割光束聚焦線產生誘發性吸收作用，並在該經塗覆基材中之該複數個位置的每個位置處沿著該雷射切割光束聚焦線形成受損印跡(damage track)。就每個雷射脈衝而言，會沿著該雷射切割光束聚焦線在該經塗覆基材中製造出個別的受損印跡。在該經塗覆基材中之該複數個位置的每個位置處所形成一連串的此等受損印跡可能彼此之間靠得夠近而沿著該預定塗層去除圖案挨在一起以形成橫向連接的該等受損印跡，並可沿著該等受損印跡使該經塗覆基材分割開來。為此，該雷射以特定重複速率進行脈衝。雷射點的尺寸及間距可加以選擇，如此得以沿著該等雷射點的線在該表面處形成期望的受損印跡。The step of directing the laser cutting beam to travel along the predetermined coating removal pattern includes focusing a pulsed laser cutting beam in the coated substrate into a laser beam focusing line to be along the coated substrate The laser cutting beam focus line produces induced absorption. The pulsed laser-cut beam is focused at a plurality of locations in the coated substrate to induce absorption along the laser-cut beam focus line in the coated substrate, and the coating is applied A damage track is formed along the laser cut beam focus line at each of the plurality of locations in the substrate. For each laser pulse, an individual damaged footprint is created in the coated substrate along the laser cutting beam focus line. A series of such damaged prints formed at each of the plurality of locations in the coated substrate may be close enough to each other and joined together along the predetermined coating removal pattern to form a lateral connection The damaged imprints can be separated along the damaged imprints. To this end, the laser is pulsed at a specific repetition rate. The size and spacing of the laser spots can be selected such that a desired damaged footprint is formed at the surface along the lines of the laser points.
本發明實施例可進一步包括使該經塗覆基材分割成至少兩個經塗覆的部分。較佳沿著橫向連接的該等受損印跡來分割該經塗覆基材。分割(separating)該經塗覆基材的步驟可包括對該經塗覆基材施加熱應力。該熱應力可例如為不均勻地加熱或冷卻該經塗覆基材。可使用CO2 雷射沿著該等橫向連接的受損印跡照射該經塗覆基材來施加該等熱應力。或者，分割該經塗覆基材的步驟可包括對該經塗覆基材施加機械性應力。施加此等應力具有促使裂紋沿著該等個別受損印跡及沿著該等橫向連接的受損印跡而擴大的效果，使得該基材可分割成多個經塗覆的部分。Embodiments of the invention may further include dividing the coated substrate into at least two coated portions. Preferably, the coated substrate is divided along the damaged prints that are laterally joined. The step of separating the coated substrate can include applying thermal stress to the coated substrate. The thermal stress can be, for example, uneven heating or cooling of the coated substrate. The coated substrate can be illuminated with the CO 2 laser along the laterally connected damaged blots to apply the thermal stresses. Alternatively, the step of dividing the coated substrate can include applying a mechanical stress to the coated substrate. Applying such stress has the effect of causing the crack to expand along the individual damaged prints and along the transversely attached damaged prints such that the substrate can be divided into a plurality of coated portions.
根據本發明實施例，該雷射切割光束的波長實質上可穿透該基材的材料。實質上可穿透一詞，意指該雷射切割光束的強度於該光束方向上在基材中每毫米之穿透深度的光束強度衰減量為約15%或更少。該雷射可例如波長為1064奈米的Nd:YAG雷射或波長為1030奈米的Yb:YAG雷射，或特別是對於紅外線波長範圍可透射的半導體基材而言，該雷射可為波長範圍介於約1.5微米至約1.8微米間的Er:YAG雷射。According to an embodiment of the invention, the wavelength of the laser cut beam is substantially transparent to the material of the substrate. The term "substantially permeable" means that the intensity of the intensity of the laser-cut beam in the direction of the beam in the direction of penetration of the beam per millimeter of penetration in the substrate is about 15% or less. The laser can be, for example, a Nd:YAG laser having a wavelength of 1064 nm or a Yb:YAG laser having a wavelength of 1030 nm, or particularly for a semiconductor substrate that is transmissive in the infrared wavelength range, the laser can be An Er:YAG laser having a wavelength ranging from about 1.5 microns to about 1.8 microns.
該雷射切割光束的脈衝持續時間可加以選擇，使得在交互作用的時間內沒有顯著的熱從該交互作用區域擴散出來(特別是例如：τ＜＜d2 /α，其中d為焦點直徑，τ為雷射脈衝持續時間，及α為基材材料的熱擴散常數)。該雷射切割光束的脈衝能量可加以選擇，使得該交互作用區域內的強度(即為在該聚焦線中的強度)能產生誘發性吸收作用。該聚焦線可具有介於約0.1毫米至約100毫米間的長度。The pulse duration of the laser-cut beam can be selected such that no significant heat is diffused from the interaction region during the interaction time (especially for example: τ<<d 2 /α, where d is the focal diameter, τ is the duration of the laser pulse, and α is the thermal diffusion constant of the substrate material). The pulse energy of the laser-cut beam can be selected such that the intensity within the interaction region (i.e., the intensity in the focus line) produces an induced absorption. The focus line can have a length of between about 0.1 mm to about 100 mm.
該雷射切割光束的偏極性(polarization)可能影響在表面處的交互作用(反射率)及在發生該誘發式吸收作用處之材料內的交互作用類型。可藉由在熱激發之後誘發出自由電荷載子(通常是電子)的方式、或藉由多光子吸收作用及內部光致離子化作用(internal photoionization)的方式、或藉由進行直接場致離子化作用(光的場強度直接打斷電子鍵結)而發生該誘發式吸收作用。可例如使用所謂的凱迪希參數(Keldysh parameter)來判斷所生成的電荷載子類型。對於某些材料而言(例如，雙折射性材料)，該雷射光的進一步吸收/透射作用取決於偏極性而定這點可能是重要的，且因此該使用者可(例如藉由簡單地探試方式)選擇使用合適的透鏡進行偏極化以利於分割各別的材料。因此，若該材料不是光等向性(optically isotropic)，而例如是雙折射性時，該雷射光在材料中的傳播亦會受到偏極性的影響。因此，偏極性及偏極向量(polarization vector)的方向可加以選擇，而得以如期望般地僅形成一條聚焦線，而不是兩條(尋常射線及異常射線)。The polarization of the laser-cut beam may affect the interaction at the surface (reflectance) and the type of interaction within the material where the induced absorption occurs. Can be induced by free charge carriers (usually electrons) after thermal excitation, or by multiphoton absorption and internal photoionization, or by direct field ionization This induced absorption occurs when the action (the field strength of the light directly interrupts the electron bond). The so-called Keldysh parameter can be used, for example, to determine the type of charge sub-generated. For certain materials (eg, birefringent materials), it may be important that the further absorption/transmission of the laser light depends on the polarity, and thus the user may (for example by simply exploring Trial mode) Select to use a suitable lens for polarization to facilitate segmentation of individual materials. Therefore, if the material is not optically isotropic, and is, for example, birefringent, the propagation of the laser light in the material is also affected by the polarity. Therefore, the direction of the polarity and the polarization vector can be selected to form only one focus line as desired, instead of two (normal rays and abnormal rays).
再者，可依據脈衝持續時間、脈衝能量及聚焦線的直徑來選擇強度，使得較佳是在該基材的微結構中，不會發生大量燒蝕或大量熔化的情形，而是較佳僅會形成受損印跡。對於諸如玻璃或透明晶體這類典型的材料而言，使用次奈秒(sub-nanosecond)範圍內(即，特別是使用例如介於約0.1皮秒(ps)至約100ps間且較佳少於約15ps之脈衝持續時間)的脈衝雷射可最容易滿足此項要求。Furthermore, the intensity can be selected according to the pulse duration, the pulse energy and the diameter of the focus line, so that it is preferred that in the microstructure of the substrate, a large amount of ablation or a large amount of melting does not occur, but preferably only A damaged blot will be formed. For typical materials such as glass or transparent crystals, use in the sub-nanosecond range (i.e., especially using, for example, between about 0.1 picoseconds (ps) to about 100 ps and preferably less than A pulsed laser with a pulse duration of about 15 ps is the easiest to meet this requirement.
在某些實施例中，該雷射切割光束聚焦線的平均直徑δ(即，焦點直徑)介於約0.3微米至約5.0微米間，較佳介於約1.0微米至約3.0微米間，更佳介於約0.4微米至約4.0微米間，且甚至更佳為約2.0微米，及/或該雷射切割光束的脈衝持續時間τ可加以選擇，而使得在該雷切割光束與該基材材料交互作用的時間內，該材料中的熱擴散作用可忽略不計，較佳不會發生熱擴散作用，為此較佳是根據τ＜＜d2 /α來設定τ、δ及該基材材料的熱擴散常數α，及/或較佳τ可選定為少於約10奈秒(ns)、更佳為少約100皮秒(ps)，及/或該雷射切割光束的脈衝重複率介於約10kHz至約1000kHz間(例如，約100kHz)，及/或該雷射切割光束可採用單次脈衝式雷射或叢發脈衝式(burst-pulse)雷射般的操作方式，且每次叢發脈衝的能量介於約40微焦耳(uJ)至約1000uJ，及/或在該雷射切割光束之切割端所直接測得的平均雷射功率為介於約10瓦(watts)至約100瓦間，例如介於約30瓦至約50瓦間。In some embodiments, the laser cutting beam focus line has an average diameter δ (ie, a focal diameter) of between about 0.3 microns and about 5.0 microns, preferably between about 1.0 microns and about 3.0 microns, more preferably between Between about 0.4 microns and about 4.0 microns, and even more preferably about 2.0 microns, and/or the pulse duration τ of the laser-cut beam can be selected such that the Ray-cut beam interacts with the substrate material During the time, the thermal diffusion in the material is negligible, and preferably no thermal diffusion occurs. For this reason, it is preferred to set τ, δ and the thermal diffusion constant of the substrate material according to τ<<d 2 /α. α, and/or preferably τ may be selected to be less than about 10 nanoseconds (ns), more preferably less than about 100 picoseconds (ps), and/or the laser cutting beam has a pulse repetition rate of between about 10 kHz and Between approximately 1000 kHz (eg, approximately 100 kHz), and/or the laser-cut beam may be operated in a single pulsed or burst-pulse-like manner, and each burst pulsed The energy is between about 40 microjoules (uJ) to about 1000 uJ, and/or directly measured at the cut end of the laser cutting beam The average laser power between about 10 W (Watts) to between about 100 Watts, such as between about 30 watts to about 50 watts room.
第2圖為流程圖200，該流程圖200根據本發明實施例示出一種用來雷射切割經塗覆基材的方法。如圖所示，在步驟202中，藉著引導雷射燒蝕光束至聚合物塗層的多個目標部分而從經塗覆基材上實質去除該聚合物塗層的該等該目標部分以形成預定塗層去除圖案。於步驟204，引導雷射切割光束沿著該預定塗層去除圖案行進。於步驟206，使該經塗覆基材分割成至少兩個經塗覆部分。一旦該經塗覆基材被分割開來，便可終止該方法。2 is a flow chart 200 showing a method for laser cutting a coated substrate in accordance with an embodiment of the present invention. As shown, in step 202, the target portion of the polymer coating is substantially removed from the coated substrate by directing the laser ablation beam to the plurality of target portions of the polymeric coating. A predetermined coating removal pattern is formed. At step 204, the laser cutting beam is directed to travel along the predetermined coating removal pattern. At step 206, the coated substrate is divided into at least two coated portions. Once the coated substrate is separated, the process can be terminated.
第3A圖及第3B圖根據本發明實施例圖示出用來進行經塗覆基材之雷射製備的組件1。如圖所示，可將具有聚合物塗層15的經塗覆基材10放置在平臺30上。簡單而言，在控制器40的指揮下使用雷射系統20來產生雷射光束。該雷射系統20包括用來提供脈衝雷射光束的雷射光源24及用以將來自該雷射光源的脈衝雷射光引導至該經塗覆基材10的光學系統22。可使用平臺30作為平移機構而可相對於該光學系統22所引導的雷射光束來定位該經塗覆基材10。3A and 3B illustrate an assembly 1 for performing laser preparation of a coated substrate in accordance with an embodiment of the present invention. As shown, coated substrate 10 having polymer coating 15 can be placed on platform 30. Briefly, the laser system 20 is used under the direction of the controller 40 to produce a laser beam. The laser system 20 includes a laser source 24 for providing a pulsed laser beam and an optical system 22 for directing pulsed laser light from the laser source to the coated substrate 10. The coated substrate 10 can be positioned relative to the laser beam directed by the optical system 22 using the platform 30 as a translation mechanism.
控制系統40可配置成高自動化設備，並利用電腦輔助製造程式42來實質控制該設備，該電腦輔助製造程式42可產生可執行檔以用來指揮該平臺30與該雷射組件20之間的相對運動。第3A圖示出在x-y平面中該雷射組件20與該經塗覆基材10之間的相對移動。第3B圖為示出在z方向上及在角方向θ上該雷射組件20與該經塗覆基材10間之相對移動的側視圖。Control system 40 can be configured as a highly automated device and utilizes computer-aided manufacturing program 42 to substantially control the device. The computer-assisted manufacturing program 42 can generate executable files for directing between the platform 30 and the laser assembly 20. Relative movement. Figure 3A shows the relative movement between the laser assembly 20 and the coated substrate 10 in the x-y plane. FIG. 3B is a side view showing the relative movement between the laser assembly 20 and the coated substrate 10 in the z direction and in the angular direction θ.
根據本發明實施例，設備1可包括固定式雷射組件20，其中平臺30配置成可在雷射組件20下方移動。或者，設備1可包括固定式平臺30，其中雷射組件20配置成可在平臺30上方移動。亦可思及平臺30及雷射組件20兩者皆配置成可移動。平臺30可例如為可編程數值控制(CNC)設備。例如，平臺30可配置成可在一軸方向上移動，而雷射組件20則配置成可沿其他軸移動。程式42亦可配置成可用來控制雷射系統20的雷射參數及光學參數。According to an embodiment of the invention, the device 1 may comprise a fixed laser assembly 20, wherein the platform 30 is configured to be movable under the laser assembly 20. Alternatively, device 1 may include a stationary platform 30 in which laser assembly 20 is configured to be movable over platform 30. It is also contemplated that both platform 30 and laser assembly 20 are configured to be movable. Platform 30 can be, for example, a programmable numerical control (CNC) device. For example, the platform 30 can be configured to move in an axial direction while the laser assembly 20 is configured to be movable along other axes. The program 42 can also be configured to control the laser parameters and optical parameters of the laser system 20.
控制系統40配置成可操作雷射組件20以求可精確地在經塗覆基材10之聚合物塗層15上的精確位置處形成雷射光束焦點。雷射系統20包括脈衝雷射24，脈衝雷射24可配合光學系統22一同運作。具體言之，控制單元40配置成可控制光學系統22及脈衝雷射24，且在控制器40的控制下，該雷射系統20產生脈衝式線狀聚焦雷射光束的單次雷射脈衝或脈衝叢發而與該經塗覆基材10的聚合物塗層15發生交互作用。該雷射光束的特性是具有可在聚合物材料內產生誘發性吸收作用的焦點，從而引起材料改質(material modification)。在本文中此材料改質作用意指燒蝕(ablation)，燒蝕一詞是描述因外來的對流熱能量及/或輻射熱能量而使聚合物材料發生熱化學分解、汽化及去除聚合物材料。可使用可編程數值控制(CNC)設備來實行該控制系統40。The control system 40 is configured to operate the laser assembly 20 to accurately form a laser beam focus at a precise location on the polymer coating 15 of the coated substrate 10. The laser system 20 includes a pulsed laser 24 that can operate in conjunction with the optical system 22. In particular, the control unit 40 is configured to control the optical system 22 and the pulsed laser 24, and under the control of the controller 40, the laser system 20 produces a single laser pulse of a pulsed linearly focused laser beam or The pulse bursts interact with the polymer coating 15 of the coated substrate 10. The characteristic of the laser beam is that it has a focus that produces an induced absorption in the polymer material, causing material modification. In this context, the modification of the material means ablation, and the term ablation is to describe the thermochemical decomposition, vaporization and removal of the polymeric material by the external convective thermal energy and/or radiant heat energy. The control system 40 can be implemented using a programmable numerical control (CNC) device.
參閱美國專利申請案公開號US2014/0199519號，並以引用方式併入該案說明書全文內容，以用來更詳細地整體說明該雷射系統20，尤其是說明該雷射光源24。亦參閱國際專利申請案公開號WO2014/079570號，並以引用方式併入該案說明書全文內容，以供更詳細地整體說明該雷射系統20之用，尤其是用來說明該雷射光源24。Reference is made to U.S. Patent Application Publication No. US 2014/0199519, the disclosure of which is incorporated herein in its entirety by reference in its entirety in its entirety in its entirety in its entirety in its entirety. Reference is also made to the International Patent Application Publication No. WO 2014/079570, the entire contents of which is hereby incorporated by reference in its entirety for the entire disclosure of the entire disclosure of the disclosure of .
第2A圖及第2B圖根據本發明實施例圖示可供雷射製備經塗覆基材用之組件1的附加特徵。為求清晰，第4A圖及第4B圖中未圖示雷射系統20，然而應瞭解，該等圖中所示的該等組件包括第3A圖及第3B圖中所示的雷射系統20。如第4A圖中所示，具有抽吸口60的設備可配置在經塗覆基材10之聚合物塗層12的目標部分上方。箭頭62概括地繪示殘餘產物從該目標部分流向該抽吸口60。此外，如第4B圖所示，亦可配置至少一排放口70以用來將氣體引導至該聚合物塗層12的目標部分。第4B圖示出具有兩個排放口70的組件，但該組件可包括任意數目的排放口70。箭頭72概括地繪出從該排放口70流向該目標部分的氣流，及箭頭62概括地繪出氣體與殘餘產物的混合物從該目標部分流向該抽吸口60。配合該抽吸口60，來自至少一排放口70的氣流形成氣體通量，該氣體通量引導殘餘產物從該目標部分流向該抽吸口60並使殘餘產物在經塗覆基材10上的散播情形減至最小。2A and 2B illustrate additional features of an assembly 1 for laser-prepared coated substrates in accordance with an embodiment of the present invention. For clarity, the laser system 20 is not illustrated in Figures 4A and 4B, however it should be understood that the components shown in the figures include the laser system 20 shown in Figures 3A and 3B. . As shown in FIG. 4A, a device having a suction port 60 can be disposed over a target portion of the polymer coating 12 of the coated substrate 10. Arrow 62 generally depicts the residual product flowing from the target portion to the suction port 60. Additionally, as shown in FIG. 4B, at least one vent 70 can also be configured to direct gas to a target portion of the polymer coating 12. FIG. 4B illustrates an assembly having two vents 70, but the assembly can include any number of vents 70. Arrow 72 generally depicts the flow of gas from the vent 70 to the target portion, and arrow 62 generally depicts the mixture of gas and residual product flowing from the target portion to the suction port 60. In cooperation with the suction port 60, the gas stream from the at least one vent 70 forms a gas flux that directs residual product from the target portion to the suction port 60 and the residual product on the coated substrate 10. The dissemination situation is minimized.
第5A圖及第5B圖為光學顯微鏡影像，該等影像示出塗覆有聚合物塗層的兩個對照性經塗覆基材500及經塗覆基材600。該等基材是具有厚度約500奈米之聚合物塗層的玻璃基材。該經塗覆基材500及該經塗覆600各自之聚合物塗層的多個部分經過製備以供進行雷射切割之用。第5A圖示出具有聚合物塗層部分520及塗層去除圖案510的第一經塗覆基材500。使用不具有抽吸口的組件來製備該第一經塗覆基材500以供進行雷射切割之用。第5B圖示出具有聚合物塗層部分620及塗層去除圖案610的第二經塗覆基材600。使用具有抽吸口的組件來製備該第二經塗覆基材600以供進行雷射切割之用。如第5A圖中所見，由去除該第一經塗覆基材之聚合物塗層目標部分所生成的殘餘產物在雷射製備該第一塗覆基材500的期間內及在製備之後散播至該聚合物塗層部分520。相較之下，如第5B圖中所見，當使用具有抽吸口的組件來進行雷射製備時，殘餘產物散播至聚合物塗層620及殘餘產物在塗層去除圖案610中再沈積的情況兩者皆有所減輕。5A and 5B are optical microscope images showing two control coated substrates 500 and coated substrates 600 coated with a polymer coating. The substrates are glass substrates having a polymer coating having a thickness of about 500 nanometers. The coated substrate 500 and portions of the respective polymer coating of the coated 600 are prepared for laser cutting. FIG. 5A illustrates a first coated substrate 500 having a polymer coated portion 520 and a coating removal pattern 510. The first coated substrate 500 is prepared using an assembly that does not have a suction port for laser cutting. FIG. 5B illustrates a second coated substrate 600 having a polymer coated portion 620 and a coating removal pattern 610. The second coated substrate 600 is prepared using an assembly having a suction port for laser cutting. As seen in FIG. 5A, the residual product formed by removing the target portion of the polymer coating of the first coated substrate is dispersed during the laser preparation of the first coated substrate 500 and after preparation to The polymer coating portion 520. In contrast, as seen in FIG. 5B, when the assembly with the suction port is used for laser preparation, the residual product is dispersed to the polymer coating 620 and the residual product is redeposited in the coating removal pattern 610. Both have been alleviated.
根據本發明之態樣(1)提供一種供欲接受雷射切割之經塗覆基材用的雷射製備方法。該方法包括引導雷射燒蝕光束至聚合物塗層的目標部分，以從經塗覆基材上實質去除該目標部分，其中該聚合物塗層的該目標部分具有介於約10微米至約6.0毫米間的寬度。According to a aspect (1) of the present invention, there is provided a laser preparation method for a coated substrate to be subjected to laser cutting. The method includes directing a laser ablation beam to a target portion of a polymer coating to substantially remove the target portion from the coated substrate, wherein the target portion of the polymer coating has a thickness of between about 10 microns and about Width between 6.0 mm.
根據本發明之另一態樣(2)所提供的態樣(1)之方法，其中該雷射燒蝕光束具有會被該聚合物塗層所吸收的波長。A method according to aspect (1) of the invention, wherein the laser ablation beam has a wavelength which is absorbed by the polymer coating.
根據本發明之另一態樣(3)提供態樣(1)-態樣(2)中任一態樣的方法，其中該雷射燒蝕光束所具有的強度可在該雷射燒蝕光束之焦點體積內的聚合物塗層中產生多光子吸收作用。According to another aspect of the present invention (3), there is provided a method of any of the aspects (1) to (2), wherein the laser ablation beam has an intensity at which the laser ablated beam Multiphoton absorption occurs in the polymer coating within the focal volume.
根據本發明另一態樣(4)提供態樣(1)-態樣(3)中任一態樣的方法，其中引導該雷射燒蝕光束至該目標部分的步驟包括對該聚合物塗層的該目標部分施加至少一雷射脈衝。According to another aspect of the invention (4), there is provided a method of any one of aspect (1) to aspect (3), wherein the step of directing the laser ablation beam to the target portion comprises coating the polymer At least one laser pulse is applied to the target portion of the layer.
根據本發明另一態樣(5)所提供之態樣(4)的方法進一步包括，在對該聚合物塗層的該目標部分施加至少一雷射脈衝之後，使該雷射燒蝕光束對準該聚合物塗層的後續目標部分，及對該聚合物塗層的該後續目標部分施加至少一後續雷射脈衝以從該經塗覆基材上實質去除該聚合物塗層的該後續目標部分。The method according to another aspect (5) of the present invention (5), further comprising: after applying at least one laser pulse to the target portion of the polymer coating, causing the laser ablation beam pair Subsequent target portions of the polymer coating, and applying at least one subsequent laser pulse to the subsequent target portion of the polymer coating to substantially remove the subsequent target of the polymer coating from the coated substrate section.
根據本發明另一態樣(6)提供態樣(5)的方法，其中該聚合物塗層之該後續目標部分有至少一部分與該聚合物塗層之該目標部分的至少一部分重疊。According to another aspect of the invention (6), the method of aspect (5), wherein the subsequent target portion of the polymer coating has at least a portion overlapping at least a portion of the target portion of the polymer coating.
根據本發明另一態樣(7)提供態樣(5)-態樣(6)中任一態樣的方法，其中根據預定塗層去除圖案來進行使該雷射燒蝕光束對準該聚合物塗層之後續目標部分的步驟。According to another aspect of the present invention (7), there is provided a method of any of the aspects (5) to (6), wherein the laser ablation beam is aligned to the polymerization according to a predetermined coating removal pattern. The step of the subsequent target portion of the coating.
根據本發明另一態樣(8)提供態樣(7)的方法，其中該預定塗層去除圖案為具有實質一致寬度的實質直線。According to another aspect of the present invention (8), the method of aspect (7) is provided, wherein the predetermined coating removal pattern is a substantially straight line having a substantially uniform width.
根據本發明另一態樣(9)提供態樣(8)的方法，其中該預定塗層去除圖案的該實質一致寬度實質等於聚合物塗層之目標部分的寬度。According to another aspect of the invention (9), the method of aspect (8), wherein the substantially uniform width of the predetermined coating removal pattern is substantially equal to the width of the target portion of the polymer coating.
根據本發明另一態樣(10)提供態樣(5)-態樣(9)中任一態樣的方法，其中使該雷射燒蝕光束對準該聚合物塗層之後續目標部分的步驟包括在x方向及y方向之其中一方向上移動該經塗覆基材及該雷射燒蝕光束之其中一者。According to another aspect of the present invention (10), there is provided a method of any of the aspects (5) to (9), wherein the laser ablation beam is aligned with a subsequent target portion of the polymer coating The step includes moving the coated substrate and one of the laser ablation beams upward in one of the x-direction and the y-direction.
根據本發明另一態樣(11)提供態樣(10)的方法，其中使該雷射燒蝕光束對準該聚合物塗層之後續目標部分的步驟進一步包括使該雷射燒蝕光束以一角方向進行掃描。According to another aspect of the invention (11), the method of aspect (10), wherein the step of aligning the laser ablation beam with a subsequent target portion of the polymer coating further comprises: causing the laser ablation beam to Scan in one corner.
根據本發明另一態樣(12)提供態樣(1)-態樣(11)中任一態樣的方法，其中引導雷射燒蝕光束至該目標部分的步驟包括在該經塗覆基材的經塗覆表面附近配置該雷射燒蝕光束的來源及對該聚合物塗層的該目標部分施加至少一雷射脈衝。According to another aspect of the present invention (12), there is provided a method of any of the aspects (1) to (11), wherein the step of guiding the laser ablation beam to the target portion is included in the coated substrate A source of the laser ablation beam is disposed adjacent the coated surface of the material and at least one laser pulse is applied to the target portion of the polymer coating.
根據本發明另一態樣(13)提供態樣(1)-態樣(11)中任一態樣的方法，其中引導雷射燒蝕光束至該目標部分的步驟包括在該經塗覆基材的至少一未經塗覆表面附近配置該雷射燒蝕光束來源，及引導該雷射燒蝕光束前往該至少一未經塗覆表面並通過該經塗覆基材而到達該聚合物塗層，以對該聚合物塗層的該目標部分施加至少一雷射脈衝。According to another aspect of the present invention (13), there is provided a method of any one of aspect (1) to aspect (11), wherein the step of guiding the laser ablation beam to the target portion is included in the coated substrate Disposing the source of the laser ablation beam near at least one uncoated surface, and directing the laser ablation beam to the at least one uncoated surface and passing the coated substrate to the polymer coating a layer to apply at least one laser pulse to the target portion of the polymer coating.
根據本發明另一態樣(14)提供態樣(1)-態樣(13)中任一態樣的方法，該方法進一步包括從去除該聚合物塗層之該目標部分的步驟中提取出殘餘產物。According to another aspect of the invention (14), there is provided a method of any of the aspects (1) to (13), the method further comprising extracting from the step of removing the target portion of the polymer coating Residual product.
根據本發明另一態樣(15)提供態樣(14)的方法，該方法進一步包括在該聚合物塗層的該目標部分附近配置具有至少一抽吸口的設備。According to another aspect of the invention (15), the method of aspect (14) is provided, the method further comprising disposing a device having at least one suction port adjacent the target portion of the polymer coating.
根據本發明另一態樣(16)提供態樣(15)的方法，該方法進一步包括在該聚合物塗層的該目標部分附近配置至少一氣體排放口。According to another aspect of the invention (16), the method of aspect (15) is provided, the method further comprising disposing at least one gas vent near the target portion of the polymer coating.
根據本發明另一態樣(17)提供態樣(1)-態樣(16)中任一態樣的方法，其中該聚合物塗層的該目標部分具有介於約100微米至約4.0毫米間的寬度。According to another aspect of the invention (17), the method of any one of aspects (1) to (16), wherein the target portion of the polymer coating has a thickness of from about 100 microns to about 4.0 mm The width between the two.
根據本發明另一態樣(18)提供態樣(1)-態樣(17)中任一態樣的方法，其中該聚合物塗層的該目標部分具有介於約200微米至約2.0毫米間的寬度。According to another aspect of the present invention (18), the method of any one of aspect (1) to aspect (17), wherein the target portion of the polymer coating has a thickness of from about 200 μm to about 2.0 mm The width between the two.
根據本發明另一態樣(19)提供態樣(1)-態樣(18)中任一態樣的方法，其中該聚合物塗層包括選自以下群組中的材料：高折射率聚合物(HRIP)、保護性聚合物膜及光阻劑材料。According to another aspect of the present invention (19), the method of any one of aspect (1) to aspect (18), wherein the polymer coating comprises a material selected from the group consisting of high refractive index polymerization (HRIP), protective polymer film and photoresist material.
根據本發明另一態樣(20)提供態樣(1)-態樣(19)中任一態樣的方法，其中該經塗覆基材包括雷射燒蝕光束之波長可透射的材料。According to another aspect of the invention (20), there is provided a method of any of the aspects (1) to (19), wherein the coated substrate comprises a wavelength transmissive material of a laser ablation beam.
根據本發明另一態樣(21)提供態樣(20)的方法，其中該雷射燒蝕光束之波長可透射的材料是選自於由玻璃、熔融矽石及藍寶石所構成的群組中。According to another aspect of the invention (21), the method of aspect (20), wherein the wavelength transmissive material of the laser ablation beam is selected from the group consisting of glass, fused vermiculite, and sapphire .
根據本發明一態樣(22)提供一種用於雷射切割經塗覆基材的方法。該方法包括引導雷射燒蝕光束至聚合物塗層的複數個目標部分以從經塗覆基材上實質去除該複數個目標部分而形成預定塗層去除圖案，引導雷射切割光束沿該預定塗層去除圖案行進；及使該經塗覆基材分割成至少兩個經塗覆部分，其中該預定塗層去除圖案具有介於約10微米至約6.0毫米間的寬度。A method for laser cutting a coated substrate is provided in accordance with an aspect of the invention (22). The method includes directing a laser ablation beam to a plurality of target portions of a polymer coating to substantially remove the plurality of target portions from the coated substrate to form a predetermined coating removal pattern, directing the laser cutting beam along the predetermined The coating removal pattern travels; and the coated substrate is divided into at least two coated portions, wherein the predetermined coating removal pattern has a width of between about 10 microns and about 6.0 mm.
根據本發明另一態樣(23)提供態樣(22)的方法，其中引導雷射切割光束沿該預定塗層去除圖案行進的步驟包括使雷射切割光束在該經塗覆基材中的複數個位置處聚焦成雷射切割光束聚焦線，以沿著該經塗覆基材中的該雷射切割光束聚焦線產生誘發性吸收作用，並在該經塗覆基材中之該複數個位置的每個位置處沿著該雷射切割光束聚焦線形成受損印跡。According to another aspect of the invention (23), the method of aspect (22), wherein the step of directing the laser cutting beam along the predetermined coating removal pattern comprises causing the laser cutting beam to be in the coated substrate Focusing at a plurality of locations into a laser-cut beam focus line to produce an induced absorption along the laser-cut beam focus line in the coated substrate, and the plurality of in the coated substrate A damaged footprint is formed along the laser cutting beam focus line at each location of the location.
根據本發明另一態樣(24)提供態樣(23)的方法，其中在該經塗覆基材中該複數個位置之每個位置處的該等受損印跡形成橫向連接的受損印跡。According to another aspect of the invention (24), the method of aspect (23), wherein the damaged imprint at each of the plurality of locations in the coated substrate forms a laterally connected damaged imprint .
根據本發明另一態樣(25)提供態樣(23)-態樣(24)中任一態樣的方法，其中該雷射切割光束聚焦線具有介於約0.1毫米至約100毫米間的長度。According to another aspect of the invention (25), there is provided a method of any of the aspects (23) to (24), wherein the laser cutting beam focusing line has a distance between about 0.1 mm and about 100 mm length.
根據本發明另一態樣(26)提供態樣(22)-態樣(25)中任一態樣的方法，其中引導該雷射燒蝕光束至該複數個目標部分的部分包括對該聚合物塗層之該複數個部分的每個部分施加至少一雷射脈衝。According to another aspect of the invention (26), there is provided a method of any one of aspect (22) to aspect (25), wherein directing the portion of the laser ablation beam to the plurality of target portions comprises the polymerizing At least one laser pulse is applied to each of the plurality of portions of the coating.
根據本發明另一態樣(27)提供態樣(22)-態樣(26)中任一態樣的方法，其中引導雷射切割光束沿該預定塗層去除圖案行進的步驟包括引導該雷射切割光束，使得該雷射切割光束不會接觸到該經塗覆基材的該聚合物塗層。According to another aspect of the present invention (27), there is provided a method of any one of aspect (22) to aspect (26), wherein the step of directing the laser cutting beam to travel along the predetermined coating removal pattern comprises guiding the mine The cutting beam is fired such that the laser cutting beam does not contact the polymeric coating of the coated substrate.
根據本發明另一態樣(28)提供態樣(22)-態樣(27)中任一態樣的方法，其中使該經塗覆基材分割成至少兩個經塗覆部分的步驟包括對該經塗覆基材施加熱應力。According to another aspect of the invention (28), there is provided a method of any one of aspect (22) to aspect (27), wherein the step of dividing the coated substrate into at least two coated portions comprises Thermal stress is applied to the coated substrate.
根據本發明另一態樣(29)提供態樣(28)的方法，其中對該經塗覆基材施加熱應力的步驟包括沿著該預定塗層去除圖案施加CO2 雷射。Aspect provides (28) a method according to another aspect of the present invention (29), wherein the step of applying a thermal stress to the coated substrate comprises a CO 2 laser is applied along the predetermined pattern is removed coating.
根據本發明另一態樣(30)提供態樣(22)-態樣(27)中任一態樣的方法，其中使該經塗覆基材分割成至少兩個經塗覆部分的步驟包括對該經塗覆基材施加機械性應力。According to another aspect of the invention (30), there is provided a method of any one of aspect (22) to aspect (27), wherein the step of dividing the coated substrate into at least two coated portions comprises Mechanical stress is applied to the coated substrate.
根據本發明另一態樣(31)提供態樣(22)-態樣(30)中任一態樣的方法，其中該雷射切割光束是利用脈衝式雷射來源所產生。According to another aspect of the invention (31), there is provided a method of any of the aspects (22) to (30), wherein the laser cut beam is produced using a pulsed laser source.
根據本發明另一態樣(32)提供態樣(22)-態樣(31)中任一態樣的方法，其中該雷射切割光束是利用選自以下群組中的雷射來源所產生，該群組由以下雷射所組成：波長為1064奈米的Nd:YAG雷射、波長為1030奈米的Yb:YAG雷射及波長介於約1.5微米至約1.8微米間的Er:YAG雷射。According to another aspect of the invention (32), there is provided a method of any of the aspects (22) to (31), wherein the laser cut beam is generated using a laser source selected from the group consisting of The group consists of the following lasers: Nd:YAG laser with a wavelength of 1064 nm, Yb:YAG laser with a wavelength of 1030 nm, and Er:YAG with a wavelength between about 1.5 μm and about 1.8 μm. Laser.
根據本發明另一態樣(33)提供態樣(22)-態樣(32)中任一態樣的方法，其中該預定塗層去除圖案具有介於約100微米至約4.0毫米間的寬度。According to another aspect of the invention (33), the method of any aspect of aspect (22) - aspect (32), wherein the predetermined coating removal pattern has a width of between about 100 microns and about 4.0 mm .
根據本發明另一態樣(34)提供態樣(22)-態樣(33)中任一態樣的方法，其中該預定塗層去除圖案具有介於約200微米至約2.0毫米間的寬度。According to another aspect of the invention (34), there is provided a method of any one of aspect (22) to aspect (33), wherein the predetermined coating removal pattern has a width of between about 200 microns and about 2.0 mm .
所屬技術領域中熟悉該項技藝者將明白在不偏離本發明精神及範圍下，當可做出各種修飾及變化。A person skilled in the art will recognize that various modifications and changes can be made without departing from the spirit and scope of the invention.
1‧‧‧設備
10‧‧‧經塗覆基材
12‧‧‧聚合物塗層
20‧‧‧雷射系統
22‧‧‧光學系統
24‧‧‧雷射光源/脈衝雷射
30‧‧‧平臺
40‧‧‧控制器/控制系統/控制單元
42‧‧‧電腦輔助製造程式
60‧‧‧抽吸口
62‧‧‧箭頭
70‧‧‧排放口
72‧‧‧箭頭
100‧‧‧流程圖
102‧‧‧步驟
104‧‧‧步驟
106‧‧‧步驟
108‧‧‧步驟
110‧‧‧步驟
200‧‧‧流程圖
202‧‧‧步驟
204‧‧‧步驟
206‧‧‧步驟
500‧‧‧經塗覆基材
510‧‧‧塗層去除圖案
520‧‧‧聚合物塗層部分
600‧‧‧經塗覆基材
610‧‧‧塗層去除圖案
620‧‧‧聚合物塗層部分1‧‧‧ Equipment
10‧‧‧ coated substrate
12‧‧‧ polymer coating
20‧‧‧Laser system
22‧‧‧Optical system
24‧‧‧Laser light source/pulse laser
30‧‧‧ platform
40‧‧‧Controller/Control System/Control Unit
42‧‧‧Computer Aided Manufacturing Program
60‧‧ ‧ suction port
62‧‧‧ arrow
70‧‧‧Drainage
72‧‧‧ arrow
100‧‧‧ Flowchart
102‧‧‧Steps
104‧‧‧Steps
106‧‧‧Steps
108‧‧‧Steps
110‧‧‧Steps
200‧‧‧flow chart
202‧‧‧Steps
204‧‧‧Steps
206‧‧‧Steps
500‧‧‧ coated substrate
510‧‧‧Coating removal pattern
520‧‧‧ polymer coating section
600‧‧‧ coated substrate
610‧‧‧Coating removal pattern
620‧‧‧ polymer coated part
藉由以下說明內容及純粹作為非限制性實例之用的附圖將可更清楚地瞭解本發明，其中：The invention will be more clearly understood from the following description and the accompanying drawings, which
第1圖為根據本發明實施例所做的流程圖，該流程圖示出可供欲接受雷射切割之經塗覆基材用的雷射製備方法；1 is a flow chart showing a laser preparation method for a coated substrate to be subjected to laser cutting in accordance with an embodiment of the present invention;
第2圖為根據本發明實施例所做的流程圖，該流程圖示出用來雷射切割經塗覆基材的方法；2 is a flow chart showing a method for laser cutting a coated substrate in accordance with an embodiment of the present invention;
第3A圖及第3B圖為根據本發明所示用來進行經塗覆基材之雷射製備的組件圖解說明；3A and 3B are diagrammatic illustrations of components for performing laser preparation of coated substrates in accordance with the present invention;
第4A圖及第4B圖為根據本發明所示用來進行經塗覆基材之雷射製備的組件圖解說明；4A and 4B are diagrammatic illustrations of components for performing laser preparation of coated substrates in accordance with the present invention;
第5A圖是經製備而可用來進行雷射切割之經塗覆基材的光學顯微鏡影像；及Figure 5A is an optical microscope image of a coated substrate prepared for laser cutting; and
第5B圖為根據本發明實施例示出經製備而可用來進行雷射切割之經塗覆基材的光學顯微影像。Figure 5B is an optical micrograph showing a coated substrate that can be prepared for laser cutting in accordance with an embodiment of the present invention.
國內寄存資訊 (請依寄存機構、日期、號碼順序註記) 無Domestic deposit information (please note according to the order of the depository, date, number)
國外寄存資訊 (請依寄存國家、機構、日期、號碼順序註記) 無Foreign deposit information (please note in the order of country, organization, date, number)
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1‧‧‧設備 1‧‧‧ Equipment
10‧‧‧經塗覆基材 10‧‧‧ coated substrate
12‧‧‧聚合物塗層 12‧‧‧ polymer coating
30‧‧‧平臺 30‧‧‧ platform
60‧‧‧抽吸口 60‧‧ ‧ suction port
62‧‧‧箭頭 62‧‧‧ arrow
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201562238356P | 2015-10-07 | 2015-10-07 | |
| US62/238,356 | 2015-10-07 |
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| TW201713447A true TW201713447A (en) | 2017-04-16 |
| TWI702106B TWI702106B (en) | 2020-08-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| TW105132476A TWI702106B (en) | 2015-10-07 | 2016-10-07 | Method for laser cutting and laser preparation of a coated substrate |
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| US (1) | US11904410B2 (en) |
| EP (1) | EP3359324B1 (en) |
| JP (1) | JP2018529527A (en) |
| KR (1) | KR102542407B1 (en) |
| CN (1) | CN108136543A (en) |
| TW (1) | TWI702106B (en) |
| WO (1) | WO2017062423A1 (en) |
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- 2016-10-05 JP JP2018517581A patent/JP2018529527A/en not_active Abandoned
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| EP3359324B1 (en) | 2021-11-17 |
| KR102542407B1 (en) | 2023-06-13 |
| KR20180061350A (en) | 2018-06-07 |
| CN108136543A (en) | 2018-06-08 |
| US11904410B2 (en) | 2024-02-20 |
| JP2018529527A (en) | 2018-10-11 |
| EP3359324A1 (en) | 2018-08-15 |
| WO2017062423A1 (en) | 2017-04-13 |
| US20170100801A1 (en) | 2017-04-13 |
| TWI702106B (en) | 2020-08-21 |
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