TW201711781A - Laser soldering apparatus - Google Patents
Laser soldering apparatus Download PDFInfo
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- TW201711781A TW201711781A TW105125535A TW105125535A TW201711781A TW 201711781 A TW201711781 A TW 201711781A TW 105125535 A TW105125535 A TW 105125535A TW 105125535 A TW105125535 A TW 105125535A TW 201711781 A TW201711781 A TW 201711781A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
- B23K26/211—Bonding by welding with interposition of special material to facilitate connection of the parts
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
本發明揭示一種雷射焊接裝置，更詳細而言，揭示一種可大面積地執行焊接製程的雷射焊接裝置。The present invention discloses a laser welding apparatus, and more particularly, a laser welding apparatus that can perform a welding process over a large area.
通常，於半導體製程中，利用焊料（solder）將半導體晶片接合至印刷電路板（Printed Circuit Board，PCB）而實現焊接製程。此時，焊接製程可包括如下製程：於在印刷電路板的特定位置印刷由鉛與錫的合金構成的焊料後，藉由高溫加熱而將上述焊料附著至印刷電路板。此種焊接製程通常稱為回流焊製程（reflow soldering process），廣泛地應用於整個產業界。Generally, in a semiconductor process, a solder wafer is formed by bonding a semiconductor wafer to a printed circuit board (PCB) using a solder. At this time, the soldering process may include a process of attaching the solder to the printed circuit board by heating at a high temperature after printing a solder composed of an alloy of lead and tin at a specific position of the printed circuit board. This type of soldering process is commonly referred to as a reflow soldering process and is widely used throughout the industry.
然而，現有的回流焊裝置具有體積較大、焊接製程所需時間較長的問題。作為解決上述問題的方案，開發有利用雷射的焊接裝置，但現有的雷射焊接裝置利用線形態的雷射束或點形態的雷射束，因此存在焊接製程需要更多的時間，並且於焊接製程後，在焊料內產生損傷（damage）、空隙（void）等的問題。However, the existing reflow soldering apparatus has a problem of a large volume and a long time required for the soldering process. As a solution to the above problem, a welding device using a laser has been developed, but the conventional laser welding device utilizes a laser beam of a line shape or a laser beam of a dot shape, so that it takes more time for the welding process, and After the soldering process, problems such as damage, voids, and the like are generated in the solder.
[發明欲解決的課題][Question to be solved by the invention]
根據本發明的一實施例，提供一種可大面積地執行焊接製程的雷射焊接裝置。According to an embodiment of the present invention, a laser welding apparatus capable of performing a welding process over a large area is provided.
[解決課題的手段][Means for solving the problem]
於本發明的一觀點中，提供一種雷射焊接裝置，其向基板上的焊接加工區域照射雷射束而執行焊接製程，上述雷射焊接裝置包括： 雷射光源，發射出多模雷射束；以及 光學系統，對自上述雷射光源射出的上述多模雷射束進行處理而照射至上述焊接加工區域，且包括使入射的上述多模雷射束成為固定尺寸的平行束而出射的準直器（collimator）。In one aspect of the present invention, a laser welding apparatus is provided that performs a welding process by irradiating a laser beam to a welding processing area on a substrate, the laser welding apparatus comprising: a laser source emitting a multimode laser beam And an optical system that processes the multi-mode laser beam emitted from the laser light source to be irradiated to the welding processing region, and includes a quasi-beam that is incident on the incident multi-mode laser beam Collimator.
上述雷射光源可包括多模雷射。上述雷射光源例如可包括雷射二極體或光纖雷射（fiber laser）。並且，上述雷射光源亦可包括第1單模雷射、第2單模雷射以及將上述第1單模雷射與第2單模雷射連接的耦合器（coupler）。此處，上述第1單模雷射及第2單模雷射可包括具有不同的纖芯（core）直徑的光纖雷射。The above laser source may comprise a multimode laser. The above-mentioned laser light source may include, for example, a laser diode or a fiber laser. Further, the laser light source may include a first single mode laser, a second single mode laser, and a coupler that connects the first single mode laser to the second single mode laser. Here, the first single mode laser and the second single mode laser described above may include fiber lasers having different core diameters.
上述光學系統可更包括擴散器（diffuser），上述擴散器使自上述準直器出射的上述多模雷射束均勻地擴散。此處，上述光學系統可更包括聚焦透鏡，上述聚焦透鏡對自上述擴散器出射的上述多模雷射束進行聚焦而照射至上述焊接加工區域。The optical system may further include a diffuser that uniformly diffuses the multi-mode laser beam emerging from the collimator. Here, the optical system may further include a focus lens that focuses the multi-mode laser beam emitted from the diffuser and irradiates the welding processing region.
上述光學系統可更包括成像透鏡（imaging lens），上述成像透鏡對自上述擴散器出射的上述多模雷射束的尺寸進行調節。The optical system may further include an imaging lens that adjusts a size of the multi-mode laser beam emitted from the diffuser.
上述雷射焊接裝置可包括對上述焊接加工區域的溫度進行測定的溫度測定單元。另外，上述雷射焊接裝置可包括溫度分佈系統，上述溫度分佈系統對上述雷射光源的輸出進行調節而控制上述焊接加工區域的溫度。並且，上述雷射焊接裝置可包括設置至上述基板上而使上述焊接加工區域露出的光罩（mask）。The above laser welding apparatus may include a temperature measuring unit that measures the temperature of the welding processing region. Further, the above-described laser welding apparatus may include a temperature distribution system that adjusts an output of the laser light source to control a temperature of the welding processing region. Further, the laser welding apparatus may include a mask that is provided on the substrate to expose the soldering processing region.
於另一觀點中，提供一種雷射焊接裝置，其向基板上的焊接加工區域照射雷射束而執行焊接製程，上述雷射焊接裝置包括： 雷射光源，發射出單模雷射束或多模雷射束；以及 光學系統，對自上述雷射光源射出的上述雷射束進行處理而照射至上述焊接加工區域，且包括準直器（collimator）及光束整形器（beam shaper），上述準直器使入射的上述單模雷射束或多模雷射束成為固定尺寸的平行束而出射，上述光束整形器將自上述準直器出射的上述雷射束轉換成扁平的形態。In another aspect, a laser welding apparatus is provided that performs a welding process by irradiating a laser beam to a welding processing area on a substrate, the laser welding apparatus comprising: a laser light source, emitting a single mode laser beam or more a mode laser beam; and an optical system that processes the laser beam emitted from the laser light source to illuminate the welding processing region, and includes a collimator and a beam shaper, The straightener emits the incident single mode laser beam or multimode laser beam into a parallel beam of a fixed size, and the beam shaper converts the laser beam emitted from the collimator into a flat form.
上述光學系統可更包括成像透鏡，上述成像透鏡對自上述光束整形器出射的上述單模雷射束或多模雷射束的尺寸進行調節。The optical system described above may further include an imaging lens that adjusts a size of the single mode laser beam or multimode laser beam emitted from the beam shaper.
於又一觀點中，提供一種雷射焊接裝置，其向基板上的焊接加工區域照射雷射束而執行焊接製程，上述雷射焊接裝置包括： 雷射光源，發射出多模雷射束；以及 光學系統，對自上述雷射光源射出的上述雷射束進行處理而照射至上述焊接加工區域，且包括使入射的上述多模雷射束成為特定形態的均勻光束而出射的光學棒（optical rod）。In still another aspect, a laser welding apparatus is provided that performs a welding process by irradiating a laser beam to a welding processing area on a substrate, the laser welding apparatus comprising: a laser light source emitting a multimode laser beam; An optical system that processes the laser beam emitted from the laser light source to be irradiated to the welding processing region, and includes an optical rod that emits the incident multi-mode laser beam into a uniform beam of a specific shape ).
上述光學系統可更包括成像透鏡，上述成像透鏡對自上述光學棒出射的上述多模雷射束的尺寸進行調節。The optical system may further include an imaging lens that adjusts a size of the multi-mode laser beam emitted from the optical rod.
[發明之效果][Effects of the Invention]
根據本發明的實施例，可將均勻且扁平形態的雷射束照射至大面積的焊接加工區域，因此可大面積地執行焊接製程。並且，可藉由利用雷射而大幅縮短焊接製程時間。另外，與利用熔爐的現有的焊接裝置相比，具有可大幅縮小裝置的尺寸及減少維護費用的優點。According to the embodiment of the present invention, the uniform and flat-shaped laser beam can be irradiated to the large-area welding processing region, so that the welding process can be performed over a large area. Moreover, the welding process time can be greatly shortened by using a laser. In addition, compared with the conventional welding device using the furnace, there is an advantage that the size of the device can be greatly reduced and the maintenance cost can be reduced.
以下，參照隨附圖式，詳細地對本發明的實施例進行說明。以下所例示的實施例並不限定本發明的範圍，而是為了向於本技術領域內具有常識者說明本發明而提供。於圖中，相同的參照符號表示相同的構成要素，為了說明的明確性，可誇張地表示各構成要素的尺寸或厚度。並且，於說明為特定的物質層存在於基板或其他層時，上述物質層能夠以與基板或其他層直接相接的方式存在，亦可於其等之間存在其他第3層。另外，於以下的實施例中，構成各層的物質為示例，除此之外亦可使用其他物質。Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. The examples exemplified below are not intended to limit the scope of the invention, but are provided to illustrate the invention to those skilled in the art. In the drawings, the same reference numerals are given to the same components, and the size or thickness of each component can be exaggerated for clarity of description. Further, when it is described that a specific substance layer exists on a substrate or another layer, the above-mentioned substance layer may exist in direct contact with a substrate or another layer, and another third layer may exist between them. Further, in the following examples, the substances constituting each layer are exemplified, and other substances may be used in addition to the above.
圖1a至圖1c是表示雷射焊接製程的圖。1a to 1c are views showing a laser welding process.
參照圖1a，於如印刷電路板（PCB）等的基板50的特定位置印刷焊料11。此處，焊料11能夠以球（ball）形態或粉末形態印刷至基板50上。接著，參照圖1b，藉由向印刷於基板50上的焊料11照射雷射束L而加熱熔融焊料11。於上述過程中，根據與時間對應的特定的溫度分佈（temperatue profile）而加熱熔融焊料11。接著，參照圖1c，照射雷射束L，藉此經加熱熔融的焊料10冷卻而附著至基板50。Referring to FIG. 1a, solder 11 is printed at a specific position of substrate 50 such as a printed circuit board (PCB). Here, the solder 11 can be printed onto the substrate 50 in a ball form or a powder form. Next, referring to FIG. 1b, the molten solder 11 is heated by irradiating the laser beam 11 printed on the substrate 50 with the laser beam L. In the above process, the molten solder 11 is heated in accordance with a specific temperatue profile corresponding to time. Next, referring to FIG. 1c, the laser beam L is irradiated, whereby the heat-melted solder 10 is cooled and adhered to the substrate 50.
圖2是概略性地表示本發明的例示性的實施例的雷射焊接裝置的圖。Fig. 2 is a view schematically showing a laser welding apparatus according to an exemplary embodiment of the present invention.
參照圖2，雷射焊接裝置100向基板150上的焊接加工區域（圖3a及圖3b中的焊接加工區域SA）照射雷射束L而執行焊接製程。此處，基板150例如可使用印刷電路板（PCB）等，但並非必須限定於此。雷射焊接裝置100包括：雷射光源110，發射出雷射束L；及光學系統120，對自雷射光源110射出的雷射束L進行處理而照射至基板150上的焊接加工區域SA。Referring to Fig. 2, the laser welding apparatus 100 irradiates the laser beam L to the welding processing region (the welding processing region SA in Figs. 3a and 3b) on the substrate 150 to perform a welding process. Here, the substrate 150 may be, for example, a printed circuit board (PCB) or the like, but is not necessarily limited thereto. The laser welding apparatus 100 includes a laser light source 110 that emits a laser beam L, and an optical system 120 that processes the laser beam L emitted from the laser light source 110 to be irradiated to the welding processing area SA on the substrate 150.
另外，雷射焊接裝置100可更包括溫度測定單元130及溫度分佈系統140。溫度測定單元130可於焊接製程中實時測定焊接加工區域SA的溫度。作為此種溫度測定單元130，例如可使用熱成像相機，但並不限定於此。In addition, the laser welding apparatus 100 may further include a temperature measuring unit 130 and a temperature distribution system 140. The temperature measuring unit 130 can measure the temperature of the welding processing area SA in real time in the welding process. As such a temperature measuring unit 130, for example, a thermal imaging camera can be used, but it is not limited thereto.
溫度分佈系統140利用藉由溫度測定單元130而測定到的溫度資料調節自雷射光源110出射的雷射束L的輸出，藉此可控制焊接加工區域SA的溫度。另一方面，於溫度分佈系統140的內部預先設定有與焊接製程所需的時間對應的溫度分佈。因此，溫度分佈系統140利用由溫度測定單元130測定到的溫度資料調節雷射束L的輸出，藉此可根據所設定的溫度分佈控制焊接加工區域SA的溫度。The temperature distribution system 140 adjusts the output of the laser beam L emitted from the laser light source 110 by using the temperature data measured by the temperature measuring unit 130, whereby the temperature of the welding processing region SA can be controlled. On the other hand, a temperature distribution corresponding to the time required for the welding process is previously set in the temperature distribution system 140. Therefore, the temperature distribution system 140 adjusts the output of the laser beam L using the temperature data measured by the temperature measuring unit 130, whereby the temperature of the welding processing region SA can be controlled in accordance with the set temperature distribution.
於如上所述的構造的雷射焊接裝置100中，由雷射光源110振盪出的雷射束L可經由特定的光學系統120轉換為具有大面積的均勻且扁平（flat）形態的光束而照射至焊接加工區域SA，藉此可大面積地執行焊接製程。另一方面，以下對形成均勻且扁平形態的雷射束的雷射光源及光學系統進行說明。In the laser welding apparatus 100 constructed as described above, the laser beam L oscillated by the laser light source 110 can be converted into a uniform and flat-shaped light beam having a large area by a specific optical system 120. The welding process area SA is thereby performed, whereby the welding process can be performed over a large area. On the other hand, a laser light source and an optical system which form a uniform and flat laser beam will be described below.
圖3a是表示圖2所示的基板150的平面的圖。Fig. 3a is a view showing a plane of the substrate 150 shown in Fig. 2 .
參照圖3a，於基板150的上表面的特定位置印刷有焊料S。此種基板150可更具備僅使焊接加工區域SA露出的光罩M。此處，焊接加工區域SA例如可具有約70 mm×70 mm以上的大面積。然而，並不限定於此。Referring to FIG. 3a, solder S is printed on a specific position of the upper surface of the substrate 150. Such a substrate 150 can further include a mask M that exposes only the soldered processing region SA. Here, the welding processing region SA may have, for example, a large area of about 70 mm × 70 mm or more. However, it is not limited to this.
本發明的例示性的實施例的雷射焊接裝置100可藉由雷射光源110及光學系統120而將大面積的均勻且扁平形態的雷射束L一次照射至藉由光罩M露出的大面積的焊接加工區域SA整體。The laser welding apparatus 100 of the exemplary embodiment of the present invention can irradiate a large-area uniform and flat-shaped laser beam L to the large area exposed by the mask M by the laser light source 110 and the optical system 120. The area of the welding processing area SA is overall.
另一方面，於圖3b中表示有自基板150去除光罩M的情況。若本發明的例示性的實施例的雷射焊接裝置100以矩陣形態具備多個雷射光源110，則可如圖3b所示般向形成於整個基板150的焊接加工區域SA照射雷射束L，藉此可大面積地執行焊接製程。On the other hand, the case where the mask M is removed from the substrate 150 is shown in Fig. 3b. When the laser welding apparatus 100 of the exemplary embodiment of the present invention includes a plurality of laser light sources 110 in a matrix form, the laser beam L can be irradiated to the welding processing area SA formed on the entire substrate 150 as shown in FIG. 3b. Thereby, the welding process can be performed over a large area.
根據如上所述的雷射焊接裝置100，可將均勻且扁平形態的雷射束L照射至大面積的焊接加工區域SA，因此可大面積地執行焊接製程。並且，藉由利用雷射，亦可大幅縮短焊接製程時間。並且，與利用熔爐（furnace）的現有的焊接裝置相比，本實施例的雷射焊接裝置100具有可大幅縮小尺寸，亦減少維護費用的優點。According to the laser welding apparatus 100 as described above, the uniform and flat-type laser beam L can be irradiated to the welding area SA of a large area, so that the welding process can be performed over a large area. Moreover, by using a laser, the welding process time can be greatly shortened. Further, the laser welding apparatus 100 of the present embodiment has an advantage that the size can be greatly reduced and the maintenance cost can be reduced as compared with the conventional welding apparatus using a furnace.
以下，對圖2所示的本發明的例示性的實施例的雷射焊接裝置100中的可實現照射至大面積的焊接加工區域SA的均勻且扁平形態的雷射束L的雷射光源及光學系統的各種示例進行說明。Hereinafter, a laser light source capable of realizing a uniform and flat-type laser beam L irradiated to a large-area welding processing region SA in the laser welding apparatus 100 of the exemplary embodiment of the present invention shown in FIG. 2 and Various examples of optical systems are described.
圖4是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的一示例的圖。4 is a view showing an example of a laser light source and an optical system applicable to the laser welding apparatus shown in FIG. 2.
參照圖4，雷射光源111可振盪出多模（multi mode）雷射束L。作為雷射光源11，例如可使用多模雷射。此種雷射光源11可包括雷射二極體或光纖雷射等，但並非必須限定於此。如下所述，自雷射光源111出射的多模雷射束L可呈其強度根據位置而均勻的扁平形態。Referring to Figure 4, the laser source 111 can oscillate a multimode laser beam L. As the laser light source 11, for example, a multimode laser can be used. Such a laser light source 11 may include a laser diode or a fiber laser or the like, but is not necessarily limited thereto. As described below, the multimode laser beam L emitted from the laser light source 111 can be in a flat shape in which its intensity is uniform according to the position.
圖5a至圖5c是表示高斯形態的雷射束及扁平形態的雷射束的圖。於圖5a至圖5c中，表示有與位置對應的雷射束的強度。5a to 5c are views showing a laser beam in a Gaussian configuration and a laser beam in a flat configuration. In Figs. 5a to 5c, the intensity of the laser beam corresponding to the position is shown.
於圖5a中，表示有高斯（Gaussian）形態的雷射束。參照圖5a可知，高斯形態的雷射束的強度於中間部分最大，越向邊緣側，其強度越小。因此，高斯形態的雷射束具有難以向照射區域照射強度均勻的雷射束的缺點。另一方面，於圖5b及圖5c中，表示有較高斯形態的雷射束扁平的形態的雷射束。於圖5b中，表示有圓形雷射束，於圖5c中，表示有四邊形雷射束。參照圖5b及圖5c可知，與圖5a所示的高斯形態的光束相比，扁平形態的雷射束的強度根據位置而固定。因此，扁平形態的雷射束可對照射區域照射強度相對均勻的雷射束。In Fig. 5a, a laser beam having a Gaussian shape is shown. Referring to Fig. 5a, the intensity of the Gaussian-type laser beam is the largest in the middle portion, and the intensity is smaller toward the edge side. Therefore, the Gaussian-shaped laser beam has a drawback that it is difficult to irradiate the irradiation region with a laser beam of uniform intensity. On the other hand, in Fig. 5b and Fig. 5c, a laser beam having a flattened laser beam in a Gaussian configuration is shown. In Fig. 5b, a circular laser beam is shown, and in Fig. 5c, a quadrilateral laser beam is shown. 5b and 5c, the intensity of the flat-type laser beam is fixed according to the position as compared with the Gaussian beam shown in Fig. 5a. Thus, a flat beam of laser beam can illuminate the illuminated area with a relatively uniform intensity of the laser beam.
於本實施例中，雷射光源111可發射出多模雷射束L，此種多模雷射束L經由特定的光學系統而成為圖5b或圖5c所示的相對扁平的形態的雷射束。另外，自雷射光源111振盪出的多模雷射束L一面出射一面發散，以此方式發散的多模雷射束L可於藉由準直器121而成為具有固定尺寸的平行束後，照射至大面積的焊接加工區域（圖3a及圖3b中的焊接加工區域SA）。因此，可對焊接加工區域SA照射具有相對均勻的強度的多模雷射束L，因此可大面積地執行焊接製程。In the present embodiment, the laser source 111 can emit a multimode laser beam L which becomes a relatively flat form of laser as shown in FIG. 5b or FIG. 5c via a specific optical system. bundle. Further, the multimode laser beam L oscillated from the laser light source 111 is diverged while being emitted, and the multimode laser beam L diverged in this manner can be a parallel beam having a fixed size by the collimator 121. Irradiation to a large area of the welding processing area (welding processing area SA in Figs. 3a and 3b). Therefore, the welding processing region SA can be irradiated with the multimode laser beam L having a relatively uniform intensity, so that the welding process can be performed over a large area.
圖6是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的另一示例的圖。Fig. 6 is a view showing another example of a laser light source and an optical system applicable to the laser welding apparatus shown in Fig. 2.
參照圖6，雷射光源112可發射出多模雷射束L。於本實施例中，雷射光源112可包括第1單模雷射112a、第2單模雷射112b以及將第1單模雷射112a與第2單模雷射112b連接的耦合器112c。此處，第1單模雷射112a及第2單模雷射112b可為具有不同的纖芯（core）直徑的光纖雷射。例如，第1單模雷射112a可為具有20 μm的纖芯直徑的光纖雷射，第2單模雷射112b可為具有600 μm的纖芯直徑的光纖雷射。如上所述，若藉由耦合器112c將第1單模雷射112a與第2單模雷射112b相連接，則可發射出多模雷射束L。此種多模雷射束L可如上所述般呈相對扁平的形態。Referring to Figure 6, a laser source 112 can emit a multimode laser beam L. In the present embodiment, the laser light source 112 may include a first single mode laser 112a, a second single mode laser 112b, and a coupler 112c that connects the first single mode laser 112a and the second single mode laser 112b. Here, the first single mode laser 112a and the second single mode laser 112b may be fiber lasers having different core diameters. For example, the first single mode laser 112a may be a fiber laser having a core diameter of 20 μm, and the second single mode laser 112b may be a fiber laser having a core diameter of 600 μm. As described above, when the first single mode laser 112a is connected to the second single mode laser 112b by the coupler 112c, the multimode laser beam L can be emitted. Such a multimode laser beam L can be in a relatively flat configuration as described above.
如上所述，自雷射光源112振盪出的多模雷射束L一面出射一面發散，以此方式發散的多模雷射束L於藉由準直器122成為具有固定尺寸的平行束後，可照射至大面積的焊接加工區域SA。藉此，可對整個焊接加工區域SA大面積地照射具有相對均勻的強度的多模雷射束L。As described above, the multimode laser beam L oscillated from the laser light source 112 is diverged while being emitted, and the multimode laser beam L diverged in this manner becomes a parallel beam having a fixed size by the collimator 122. It can be irradiated to a large area of the welding processing area SA. Thereby, the multi-mode laser beam L having a relatively uniform intensity can be irradiated to the entire welding processing region SA over a large area.
圖7是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。Fig. 7 is a view showing still another example of a laser light source and an optical system applicable to the laser welding apparatus shown in Fig. 2;
參照圖7，雷射光源113可發射出多模雷射束L。雷射光源113可包括多模雷射。並且，雷射光源亦可包括第1單模雷射、第2單模雷射及將第1單模雷射與第2單模雷射連接的耦合器。於此情形時，第1單模雷射及第2單模雷射可為具有不同的纖芯直徑的光纖雷射。自上述雷射光源113出射的多模雷射束L可如上所述般呈相對扁平的形態。Referring to Figure 7, a laser source 113 can emit a multimode laser beam L. The laser source 113 can include a multi-mode laser. Further, the laser light source may include a first single mode laser, a second single mode laser, and a coupler that connects the first single mode laser to the second single mode laser. In this case, the first single mode laser and the second single mode laser may be fiber lasers having different core diameters. The multimode laser beam L emerging from the above-described laser light source 113 can be in a relatively flat configuration as described above.
自雷射光源113振盪出的多模雷射束L入射至光學系統123。此處，光學系統123可包括準直器123a、擴散器123b及聚焦透鏡123c。自雷射光源113振盪出的多模雷射束L藉由經過準直器123a而成為具有固定尺寸的平行束。另外，自準直器123a出射的多模雷射束L通過擴散器123b而擴散。此處，擴散器123b發揮藉由使入射的多模雷射束L擴散而將其轉換為更均勻且扁平的形態的雷射束的作用。以此方式藉由擴散器123b而擴散的多模雷射束L可於藉由聚焦透鏡123c聚焦後，照射至大面積的焊接加工區域SA。藉此，可對整個焊接加工區域SA大面積地照射具有均勻的強度的多模雷射束。The multimode laser beam L oscillated from the laser light source 113 is incident on the optical system 123. Here, the optical system 123 may include a collimator 123a, a diffuser 123b, and a focus lens 123c. The multimode laser beam L oscillated from the laser light source 113 becomes a parallel beam having a fixed size by passing through the collimator 123a. Further, the multimode laser beam L emitted from the collimator 123a is diffused by the diffuser 123b. Here, the diffuser 123b functions as a laser beam that converts the incident multimode laser beam L into a more uniform and flat shape by diffusing it. The multimode laser beam L diffused by the diffuser 123b in this manner can be irradiated to the large-area welding processing region SA after being focused by the focus lens 123c. Thereby, the entire welding processing area SA can be irradiated to the multi-mode laser beam having a uniform intensity over a large area.
圖8是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。Fig. 8 is a view showing still another example of a laser light source and an optical system which can be applied to the laser welding apparatus shown in Fig. 2;
參照圖8，雷射光源114可發射出多模雷射束L。雷射光源114可包括多模雷射。並且，雷射光源114亦可包括第1單模雷射、第2單模雷射及將第1單模雷射與第2單模雷射連接的耦合器。自上述雷射光源114出射的多模雷射束L可呈扁平形態。Referring to Figure 8, a laser source 114 can emit a multimode laser beam L. Laser source 114 can include a multi-mode laser. Further, the laser light source 114 may include a first single mode laser, a second single mode laser, and a coupler that connects the first single mode laser to the second single mode laser. The multimode laser beam L emerging from the above-described laser light source 114 may have a flat shape.
自雷射光源114振盪出的多模雷射束L入射至光學系統124。此處，光學系統124可包括準直器124a、擴散器124b及成像透鏡124c。自雷射光源114振盪出的多模雷射束L藉由準直器124a而成為具有固定尺寸的平行束。另外，自準直器124a出射的多模雷射束L可通過擴散器124b而轉換為更均勻且扁平形態的雷射束。The multimode laser beam L oscillated from the laser light source 114 is incident on the optical system 124. Here, the optical system 124 may include a collimator 124a, a diffuser 124b, and an imaging lens 124c. The multimode laser beam L oscillated from the laser light source 114 is a parallel beam having a fixed size by the collimator 124a. Additionally, the multimode laser beam L emerging from the collimator 124a can be converted to a more uniform and flattened laser beam by the diffuser 124b.
接著，自擴散器124b出射的多模雷射束L可經由成像透鏡124c照射至大面積的焊接加工區域SA。此處，成像透鏡124c發揮將入射的多模雷射束L轉換為與焊接加工區域SA對應的尺寸而照射至焊接加工區域SA的作用。藉此，可對整個焊接加工區域SA大面積地照射具有均勻的強度的多模雷射束L。Next, the multimode laser beam L emitted from the diffuser 124b can be irradiated to the large-area welding processing region SA via the imaging lens 124c. Here, the imaging lens 124c functions to convert the incident multimode laser beam L into a size corresponding to the welding processing region SA and to irradiate the welding processing region SA. Thereby, the multi-mode laser beam L having uniform intensity can be irradiated to the entire welding processing region SA over a large area.
圖9是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。Fig. 9 is a view showing still another example of a laser light source and an optical system which can be applied to the laser welding apparatus shown in Fig. 2;
參照圖9，雷射光源115可發射出多模雷射束L。另外，自雷射光源115振盪出的多模雷射束L入射至光學系統125。此處，光學系統125可包括準直器125a、擴散器125b、聚焦透鏡125c及成像透鏡125d。自雷射光源115振盪出的多模雷射束L藉由準直器125a成為具有固定尺寸的平行束，此種平行的多模雷射束L通過擴散器125b擴散而成為更均勻的形態。另外，自擴散器125b出射的多模雷射束L可於藉由聚焦透鏡125c聚焦後，藉由成像透鏡125d而照射至大面積的焊接加工區域SA。作為一例，成像透鏡125d可為變焦成像透鏡，此種變焦成像透鏡可發揮調整光束點的尺寸的作用。Referring to Figure 9, a laser source 115 can emit a multimode laser beam L. Further, the multimode laser beam L oscillated from the laser light source 115 is incident on the optical system 125. Here, the optical system 125 may include a collimator 125a, a diffuser 125b, a focus lens 125c, and an imaging lens 125d. The multimode laser beam L oscillated from the laser light source 115 is a parallel beam having a fixed size by the collimator 125a, and the parallel multimode laser beam L is diffused by the diffuser 125b to have a more uniform shape. Further, the multimode laser beam L emitted from the diffuser 125b can be irradiated to the large-area welding processing region SA by the imaging lens 125d after being focused by the focus lens 125c. As an example, the imaging lens 125d may be a zoom imaging lens that functions to adjust the size of the beam spot.
圖10是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。Fig. 10 is a view showing still another example of a laser light source and an optical system which can be applied to the laser welding apparatus shown in Fig. 2;
參照圖10，雷射光源116可發射出多模雷射束L。雷射光源116可包括多模雷射。並且，雷射光源116亦可包括第1單模雷射、第2單模雷射及將第1單模雷射與第2單模雷射連接的耦合器。自上述雷射光源116出射的多模雷射束L可呈扁平的形態。Referring to Figure 10, a laser source 116 can emit a multimode laser beam L. Laser source 116 can include a multi-mode laser. Further, the laser light source 116 may include a first single mode laser, a second single mode laser, and a coupler that connects the first single mode laser to the second single mode laser. The multimode laser beam L emerging from the above-described laser light source 116 can be in a flat form.
自此種雷射光源116振盪出的多模雷射束L入射至光學系統126。此時，光學系統126可包括光學棒126a及成像透鏡126b。光學棒126a可發揮利用內部全反射使入射的光束成為具有特定形態的均勻的光束的作用。此處，光學棒126a例如可呈如四邊形或圓形等的剖面形狀，但並不限定於此。藉此，自雷射光源116振盪出的多模雷射束L可經由光學棒126a而轉換成特定形態的均勻的光束。例如，於光學棒126a具有四邊形的剖面形狀的情形時，自雷射光源116振盪出的圓形的雷射束可經由光學棒126a而轉換成均勻的四邊形雷射束。The multimode laser beam L oscillated from such a laser source 116 is incident on the optical system 126. At this time, the optical system 126 may include an optical rod 126a and an imaging lens 126b. The optical rod 126a can function to make the incident light beam into a uniform light beam having a specific shape by internal total reflection. Here, the optical rod 126a may have a cross-sectional shape such as a quadrangle or a circle, for example, but is not limited thereto. Thereby, the multimode laser beam L oscillated from the laser light source 116 can be converted into a uniform beam of a specific shape via the optical rod 126a. For example, in the case where the optical rod 126a has a quadrangular cross-sectional shape, the circular laser beam oscillated from the laser light source 116 can be converted into a uniform quadrilateral laser beam via the optical rod 126a.
自光學棒126a出射的均勻的多模雷射束L可經由成像透鏡126b而照射至大面積的焊接加工區域SA。成像透鏡126b可發揮將如上所述般入射的多模雷射束L轉換成與焊接加工區域SA對應的尺寸而照射的作用。藉此，可對整個焊接加工區域SA大面積地照射具有均勻的強度的多模雷射束L。The uniform multimode laser beam L emitted from the optical rod 126a can be irradiated to the large-area welding processing region SA via the imaging lens 126b. The imaging lens 126b can function to convert the multimode laser beam L incident as described above into a size corresponding to the welding processing region SA. Thereby, the multi-mode laser beam L having uniform intensity can be irradiated to the entire welding processing region SA over a large area.
圖11是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。Fig. 11 is a view showing still another example of a laser light source and an optical system which can be applied to the laser welding apparatus shown in Fig. 2.
參照圖11，雷射光源117可發射出多模雷射束L或單模雷射束L。因此，雷射光源117可包括多模雷射或單模雷射。自此種雷射光源117振盪出的雷射束L入射至光學系統127。此處，光學系統127可包括準直器127a、光束整形器127b及成像透鏡127c。於使用光束整形器127b的情形時，利用單模雷射的加工品質會更優異，但於本發明中，並不侷限於單模雷射加工。Referring to Figure 11, a laser source 117 can emit a multimode laser beam L or a single mode laser beam L. Thus, the laser source 117 can include a multi-mode laser or a single mode laser. The laser beam L oscillated from such a laser light source 117 is incident on the optical system 127. Here, the optical system 127 may include a collimator 127a, a beam shaper 127b, and an imaging lens 127c. In the case of using the beam shaper 127b, the processing quality using the single mode laser is more excellent, but in the present invention, it is not limited to single mode laser processing.
自雷射光源117振盪出的雷射束L可藉由準直器127a成為具有固定尺寸的平行束。另外，自準直器127a出射的雷射束L經由光束整形器127b。此處，光束整形器127b作為繞射光學裝置而可發揮如下作用：將入射的雷射束的形態轉換成均勻的形態、例如扁平形態，使光束的邊緣（edge）部分更陡峭（sharp）。因此，可藉由此種光束整形器127b而將自準直器127a出射的雷射束L轉換成更均勻的形態。The laser beam L oscillated from the laser light source 117 can be made into a parallel beam having a fixed size by the collimator 127a. Further, the laser beam L emitted from the collimator 127a passes through the beam shaper 127b. Here, the beam shaper 127b functions as a diffractive optical device to convert the form of the incident laser beam into a uniform form, for example, a flat form, and to sharpen an edge portion of the light beam. Therefore, the laser beam L emitted from the collimator 127a can be converted into a more uniform form by the beam shaper 127b.
自光束整形器127b出射的扁平形態的均勻的雷射束L可經由成像透鏡127c照射至大面積的焊接加工區域SA。成像透鏡127c可發揮將如上所述般入射的單模雷射束或多模雷射束L轉換成與焊接加工區域SA對應的尺寸而照射的作用。藉此，可對整個焊接加工區域SA大面積地照射具有均勻的強度的多模雷射束L。The flat laser beam L of uniform shape emitted from the beam shaper 127b can be irradiated to the large-area welding processing region SA via the imaging lens 127c. The imaging lens 127c can function to convert a single-mode laser beam or a multi-mode laser beam L incident as described above into a size corresponding to the welding processing region SA. Thereby, the multi-mode laser beam L having uniform intensity can be irradiated to the entire welding processing region SA over a large area.
圖12是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。Fig. 12 is a view showing still another example of a laser light source and an optical system which can be applied to the laser welding apparatus shown in Fig. 2;
參照圖12，雷射光源118可發射出多模雷射束L或單模雷射束L。自此種雷射光源118振盪出的雷射束L入射至光學系統128。此處，光學系統128可包括準直器128a、光束整形器128b、聚焦透鏡128c及成像透鏡128d。Referring to Figure 12, the laser source 118 can emit a multimode laser beam L or a single mode laser beam L. The laser beam L oscillated from such a laser light source 118 is incident on the optical system 128. Here, the optical system 128 may include a collimator 128a, a beam shaper 128b, a focus lens 128c, and an imaging lens 128d.
自雷射光源118振盪出的雷射束L可藉由準直器128a而成為具有固定尺寸的平行束。另外，自準直器128a出射的雷射束L可經由光束整形器128b而轉換成更均勻且扁平的形態。The laser beam L oscillated from the laser light source 118 can be a parallel beam having a fixed size by the collimator 128a. Additionally, the laser beam L exiting the collimator 128a can be converted to a more uniform and flat configuration via the beam shaper 128b.
自光束整形器128b出射的扁平形態的均勻的雷射束L可於藉由聚焦透鏡128c聚焦後，經由成像透鏡128d照射至大面積的焊接加工區域SA。成像透鏡128d可發揮將如上所述般入射的單模雷射束L或多模雷射束L轉換成與焊接加工區域SA對應的尺寸而照射的作用。藉此，可對整個焊接加工區域SA大面積地照射具有均勻的強度的雷射束L。The uniform laser beam L of the flat form emitted from the beam shaper 128b can be irradiated to the large-area welding processing area SA via the imaging lens 128d after being focused by the focus lens 128c. The imaging lens 128d can function to convert the single-mode laser beam L or the multi-mode laser beam L incident as described above into a size corresponding to the welding processing region SA. Thereby, the laser beam L having uniform intensity can be irradiated to the entire welding processing region SA over a large area.
如上所述，根據例示性的實施例，可對焊接加工區域大面積地照射均勻且扁平形態的雷射束，藉此可大面積地執行焊接製程，可藉由利用雷射而大幅縮短製程時間。另外，與利用熔爐（furnace）的現有的焊接裝置相比，雷射焊接裝置具有可縮小尺寸亦減少維護費用的優點。As described above, according to the exemplary embodiment, the welding processing region can be irradiated with a uniform and flat-shaped laser beam over a large area, whereby the welding process can be performed over a large area, and the processing time can be greatly shortened by using the laser. . In addition, the laser welding apparatus has an advantage of being downsized and reducing maintenance costs as compared with the conventional welding apparatus using a furnace.
以上，對本發明的實施例進行了說明，但上述實施例僅為示例，於本技術領域內具有常識者應理解可根據上述實施例實現各種變形及等同的其他實施例。The embodiments of the present invention have been described above, but the above-described embodiments are merely examples, and those skilled in the art should understand that various modifications and equivalents can be made in accordance with the embodiments described above.
10、11、S‧‧‧焊料
50、150‧‧‧基板
100‧‧‧雷射焊接裝置
110、111、112、113、114、115、116、117、118‧‧‧雷射光源
112a、112b‧‧‧單模雷射
112c‧‧‧耦合器
120、123、124、125、126、127、128‧‧‧光學系統
123b、124b、125b‧‧‧擴散器
121、122、123a、124a、125a、127a、128a‧‧‧準直器
123c、125c、128c‧‧‧聚焦透鏡
124c、125d、126b、127c、128d‧‧‧成像透鏡
126a‧‧‧光學棒
127b、128b‧‧‧光束整形器
130‧‧‧溫度測定單元
140‧‧‧溫度分佈系統
L‧‧‧雷射束
M‧‧‧光罩
SA‧‧‧焊接加工區域10, 11, S‧‧‧ solder
50, 150‧‧‧ substrate
100‧‧‧Laser welding device
110, 111, 112, 113, 114, 115, 116, 117, 118‧‧ ‧ laser source
112a, 112b‧‧‧ single mode laser
112c‧‧‧ coupler
120, 123, 124, 125, 126, 127, 128‧‧‧ optical systems
123b, 124b, 125b‧‧‧ diffuser
121, 122, 123a, 124a, 125a, 127a, 128a‧‧ ‧ collimator
123c, 125c, 128c‧‧ ‧focus lens
124c, 125d, 126b, 127c, 128d‧‧‧ imaging lenses
126a‧‧·optical rod
127b, 128b‧‧‧beam shaper
130‧‧‧Temperature measuring unit
140‧‧‧ Temperature Distribution System
L‧‧‧Laser beam
M‧‧‧Photo Mask
SA‧‧‧Welding processing area
圖1a至圖1c是表示雷射焊接製程的圖。 圖2是概略性地表示本發明的例示性實施例的雷射焊接裝置的圖。 圖3a及圖3b是表示圖2所示的基板的平面的圖。 圖4是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的一示例的圖。 圖5a至圖5c是表示高斯形態的雷射束及扁平形態的雷射束的圖。 圖6是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的另一示例的圖。 圖7是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。 圖8是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。 圖9是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。 圖10是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。 圖11是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。 圖12是表示可應用於圖2所示的雷射焊接裝置的雷射光源及光學系統的又一示例的圖。1a to 1c are views showing a laser welding process. Fig. 2 is a view schematically showing a laser welding apparatus according to an exemplary embodiment of the present invention. 3a and 3b are views showing a plane of the substrate shown in Fig. 2. 4 is a view showing an example of a laser light source and an optical system applicable to the laser welding apparatus shown in FIG. 2. 5a to 5c are views showing a laser beam in a Gaussian configuration and a laser beam in a flat configuration. Fig. 6 is a view showing another example of a laser light source and an optical system applicable to the laser welding apparatus shown in Fig. 2. Fig. 7 is a view showing still another example of a laser light source and an optical system applicable to the laser welding apparatus shown in Fig. 2; Fig. 8 is a view showing still another example of a laser light source and an optical system which can be applied to the laser welding apparatus shown in Fig. 2; Fig. 9 is a view showing still another example of a laser light source and an optical system which can be applied to the laser welding apparatus shown in Fig. 2; Fig. 10 is a view showing still another example of a laser light source and an optical system which can be applied to the laser welding apparatus shown in Fig. 2; Fig. 11 is a view showing still another example of a laser light source and an optical system which can be applied to the laser welding apparatus shown in Fig. 2. Fig. 12 is a view showing still another example of a laser light source and an optical system which can be applied to the laser welding apparatus shown in Fig. 2;
100‧‧‧雷射焊接裝置 100‧‧‧Laser welding device
110‧‧‧雷射光源 110‧‧‧Laser light source
120‧‧‧光學系統 120‧‧‧Optical system
130‧‧‧溫度測定單元 130‧‧‧Temperature measuring unit
140‧‧‧溫度分佈系統 140‧‧‧ Temperature Distribution System
150‧‧‧基板 150‧‧‧Substrate
L‧‧‧雷射束 L‧‧‧Laser beam
M‧‧‧光罩 M‧‧‧Photo Mask
Claims (19)
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| KR1020150119830A KR20170024491A (en) | 2015-08-25 | 2015-08-25 | Laser soldering apparatus |
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| KR101858440B1 (en) | 2017-08-25 | 2018-06-28 | 최병찬 | Laser soldering apparatus and method |
| KR102088902B1 (en) * | 2018-02-14 | 2020-03-13 | 주식회사 이오테크닉스 | Reflow soldering apparatus and reflow soldering method |
| KR102077732B1 (en) * | 2018-11-07 | 2020-04-07 | 김윤호 | Laser processing apparatus |
| KR102377331B1 (en) * | 2020-01-29 | 2022-03-21 | 김윤호 | Line beam optic and apparatus for laser lift off using the same |
| US20240003906A1 (en) | 2020-04-16 | 2024-01-04 | Nordic Bioscience A/S | Biomarker of Fibrosis |
| KR20220133377A (en) | 2021-03-24 | 2022-10-05 | 삼성전자주식회사 | Apparatus of manufacturing semiconductor |
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| KR20030015946A (en) * | 2001-08-18 | 2003-02-26 | 주식회사 이오테크닉스 | Method for strengthening the hardness of a plated layer and Apparatus thereof |
| KR20110026671A (en) * | 2009-09-08 | 2011-03-16 | 삼성테크윈 주식회사 | Solder reflow apparatus |
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| US9413137B2 (en) * | 2013-03-15 | 2016-08-09 | Nlight, Inc. | Pulsed line beam device processing systems using laser diodes |
| KR101548425B1 (en) * | 2013-10-25 | 2015-08-28 | 주식회사 넥스뷰티엑스 | Laser soldering apparatus for Semiconductor chip and PCB components |
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| US11628510B2 (en) | 2019-08-22 | 2023-04-18 | Delta Electronics, Inc. | Solder device and system controller thereof |
| US11980960B2 (en) | 2019-08-22 | 2024-05-14 | Delta Electronics, Inc. | Solder device and system controller thereof |
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