TW201707966A - Metal tape for absorbing impact - Google Patents

Metal tape for absorbing impact Download PDF

Info

Publication number
TW201707966A
TW201707966A TW105122318A TW105122318A TW201707966A TW 201707966 A TW201707966 A TW 201707966A TW 105122318 A TW105122318 A TW 105122318A TW 105122318 A TW105122318 A TW 105122318A TW 201707966 A TW201707966 A TW 201707966A
Authority
TW
Taiwan
Prior art keywords
adhesive
layer
metal tape
foam
impact
Prior art date
Application number
TW105122318A
Other languages
Chinese (zh)
Inventor
朴鍾睍
李海準
鄭煋憲
Original Assignee
日進材料股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日進材料股份有限公司 filed Critical 日進材料股份有限公司
Publication of TW201707966A publication Critical patent/TW201707966A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C09J2400/16—Metal
    • C09J2400/163—Metal in the substrate
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2433/00—Presence of (meth)acrylic polymer
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2475/00—Presence of polyurethane
    • C09J2475/006—Presence of polyurethane in the substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Adhesive Tapes (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)

Abstract

Disclosed is a metal tape for absorbing an impact, including: a heat conductive layer; an impact absorbing layer; and an adhesive layer, in which the impact absorbing layer includes a polymer foam, the impact absorbing layer is formed on one surface or both surfaces of the heat conductive layer without a bonding layer, and the adhesive layer is formed on the other surface of the impact absorbing layer on which the heat conductive layer is formed. The metal tape has an excellent heat radiating effect, and the impact absorbing layer is formed on the heat conductive layer without a separate bonding layer, so that the metal tape can exhibit an excellent impact absorbing effect of a device with a limited thickness.

Description

吸收衝擊的金屬膠帶 Shock-absorbing metal tape 【相關應用的交叉引用】[Cross-reference to related applications]

本申請案主張在2015年7月23日於韓國智慧財產局提申之韓國專利申請案號10-2016-0104388的優先權和利益，其全文將透過引用的方式併入本文中。 The priority and benefit of Korean Patent Application No. 10-2016-0104388, filed on Jan. 23, 2015, to the Korean Intellectual Property Office, is hereby incorporated by reference.

本發明係關於一種吸收衝擊的金屬膠帶，更特定地為一種吸收衝擊的金屬膠帶，其包含：熱傳導層、衝擊吸收層及黏著(adhesive)層，其中該衝擊吸收層包含聚合物發泡體，且形成在該熱傳導層的一邊表面或兩邊表面上，該黏著層形成在該衝擊吸收層的另一邊表面上，其上方有該熱傳導層形成。 The present invention relates to an impact-absorbing metal tape, more particularly an impact-absorbing metal tape comprising: a heat conducting layer, an impact absorbing layer and an adhesive layer, wherein the impact absorbing layer comprises a polymer foam, And formed on one side surface or both side surfaces of the heat conductive layer, the adhesive layer is formed on the other side surface of the impact absorbing layer, and the heat conductive layer is formed thereon.

如手機、硬式磁碟機(HDD)、電視機及液晶顯示器的電子設備是由精細的機械組件和電子設備所構成，此外，電子設備和電子組件近來變得輕、薄、短、小。 Electronic devices such as mobile phones, hard disk drives (HDDs), televisions, and liquid crystal displays are composed of fine mechanical components and electronic devices. In addition, electronic devices and electronic components have recently become light, thin, short, and small.

根據最近的趨勢，當從外部施加物理性衝擊時，電子設備很容易有損壞的問題或疑慮，且因為根據輕、薄、短、小的趨勢，有大量的電子設備需要被安裝在電子設備的小空間中，以至於每單位體積中所產生的熱量大幅地增加；此外，從外部流入的污染性材料(如灰塵)會干擾電 子設備內部的氣流而造成電子組件過熱，因而導致縮短了電子設備的壽命。 According to recent trends, when physical shocks are applied from the outside, electronic devices are prone to damage or doubts, and because of the trend of light, thin, short, and small, a large number of electronic devices need to be installed in electronic devices. In a small space, the amount of heat generated per unit volume is greatly increased; in addition, polluting materials (such as dust) flowing from the outside interfere with electricity. The airflow inside the sub-device causes the electronic components to overheat, thus shortening the life of the electronic device.

在電子設備中，電子組件的黏著膠帶是用於接合(bonding)和固定如引線、散熱板、半導體晶片及模墊的電子組件，且該電子組件的黏著膠帶包含：固定引線框架的黏著膠帶、接合散熱板的膠帶、捲膠帶式自動接合(TAB)膠帶、晶片上引線(Lead On Chip，LOC)膠帶及其類似物，電子組件的黏著膠帶需要具有可抵抗嚴苛條件(如：高溫、潮溼，以及從組裝過程到電子組件組裝後被當成完成品使用的時間裡，由外部所施加的電壓)的充份特性，還要有優良的黏著力。 In an electronic device, an adhesive tape of an electronic component is an electronic component for bonding and fixing a lead wire, a heat sink, a semiconductor wafer, and a die pad, and the adhesive tape of the electronic component includes: an adhesive tape that fixes the lead frame, Tapes for bonding heat sinks, tape-and-tape automatic bonding (TAB) tapes, Lead On Chip (LOC) tapes, and the like, adhesive tapes for electronic components are required to withstand harsh conditions (eg, high temperature, humidity) And the charging characteristics of the voltage applied from the outside during the assembly process to the time when the electronic component is assembled and used as a finished product, and excellent adhesion.

在這方面，韓國專利申請案公開號10-2011-0108055揭示了“散熱膠帶及其製造方法”，其中使用黏著層將散熱層接合至金屬基底材料上，且該黏著層是由聚合物所形成，當使用該聚合物黏著層時，其散熱表現會由於黏著層的厚度而降解，這點成為了問題。 In this regard, Korean Patent Application Publication No. 10-2011-0108055 discloses "heat-dissipating tape and a method of manufacturing the same" in which an adhesive layer is used to bond a heat dissipation layer to a metal base material, and the adhesive layer is formed of a polymer. When the polymer adhesive layer is used, the heat dissipation performance is degraded by the thickness of the adhesive layer, which becomes a problem.

因此，當務之急為發展電子組件的黏著膠帶，其具有優良的黏著力、對產生在電子設備內部之熱量具有優良散熱效果、以及能充分抵抗從外部施加的嚴格條件。 Therefore, it is imperative to develop an adhesive tape for an electronic component which has excellent adhesion, excellent heat dissipation effect on heat generated inside the electronic device, and sufficient resistance against strict conditions applied from the outside.

本發明已致力於提供一種吸收衝擊的金屬膠帶。 The present invention has been made in an effort to provide an impact-absorbing metal tape.

此外，本發明已致力於提供一種金屬膠帶，其包含：熱傳導層、衝擊吸收層及黏著層，以藉由衝擊吸收層吸收衝擊且藉由熱傳導層提供散熱效果。 Further, the present invention has been made in an effort to provide a metal tape comprising: a heat conducting layer, an impact absorbing layer, and an adhesive layer to absorb an impact by the impact absorbing layer and to provide a heat dissipating effect by the heat conducting layer.

此外，本發明已致力於提供一種金屬膠帶，其中該衝擊吸收層形成在無接合層的熱傳導層上，以防止衝擊吸收效果和散熱效果因為接 合層的存在而降解。 Further, the present invention has been made in an effort to provide a metal tape in which the impact absorbing layer is formed on a heat conducting layer having no bonding layer to prevent impact absorption effect and heat dissipation effect Degradation by the presence of the layer.

本發明之一示範性具體實例提供了吸收衝擊的金屬膠帶，其包含：熱傳導層、衝擊吸收層及黏著層，其中該衝擊吸收層包含聚合物發泡體，且形成在無接合層之該熱傳導層的一邊表面或兩邊表面上，該黏著層形成在該衝擊吸收層的另一邊表面上，其上方有該熱傳導層形成。 An exemplary embodiment of the present invention provides an impact-absorbing metal tape comprising: a heat conductive layer, an impact absorbing layer, and an adhesive layer, wherein the impact absorbing layer comprises a polymer foam, and the heat conduction formed in the jointless layer On one side surface or both side surfaces of the layer, the adhesive layer is formed on the other side surface of the impact absorbing layer, and the heat conductive layer is formed thereon.

該聚合物發泡體可為任何一或多種選自由下列所組成之群組：聚胺甲酸乙酯發泡體、聚乙烯發泡體、聚烯烴發泡體、聚氯乙烯發泡體、聚碳酸酯發泡體、聚醚醯亞胺發泡體、聚醯胺發泡體、聚酯發泡體、聚二氯亞乙烯發泡體、聚甲基丙烯酸甲酯發泡體及聚三聚異氰酸酯發泡體。 The polymer foam may be any one or more selected from the group consisting of polyurethane foam, polyethylene foam, polyolefin foam, polyvinyl chloride foam, and poly Carbonate foam, polyether oxime foam, polyamide foam, polyester foam, polydivinylidene foam, polymethyl methacrylate foam, and polytrimerization Isocyanate foam.

該熱傳導層可為任何一或多種選自由下列所組成之群組：銅、不銹鋼(SUS)、銀、鉛、碳鋼、青銅、鎳、鉑、鎢、鑄鐵及銅箔。 The heat conducting layer can be any one or more selected from the group consisting of copper, stainless steel (SUS), silver, lead, carbon steel, bronze, nickel, platinum, tungsten, cast iron, and copper foil.

該熱傳導層可為銅或銅箔，且該銅箔可具有3至30%的伸長率和0.3至3微米的表面粗糙度Ra。 The heat conductive layer may be copper or copper foil, and the copper foil may have an elongation of 3 to 30% and a surface roughness Ra of 0.3 to 3 μm.

該黏著層可為任何一或多種選自由下列所組成之群組：聚乙烯醇類黏著劑、丙烯酸類黏著劑、乙酸乙烯酯類黏著劑、胺甲酸乙酯類黏著劑、聚酯類黏著劑、聚烯烴類黏著劑、聚乙烯烷基醚類黏著劑、橡膠類黏著劑、氯乙烯-乙酸乙烯酯類黏著劑、苯乙烯-丁二烯-苯乙烯(SBS)類黏著劑、苯乙烯-丁二烯-苯乙烯(SEBS)氫化類黏著劑、乙烯類黏著劑、矽類黏著劑及丙烯酸酯類黏著劑。 The adhesive layer may be any one or more selected from the group consisting of polyvinyl alcohol adhesives, acrylic adhesives, vinyl acetate adhesives, urethane adhesives, polyester adhesives. , polyolefin adhesives, polyvinyl alkyl ether adhesives, rubber adhesives, vinyl chloride-vinyl acetate adhesives, styrene-butadiene-styrene (SBS) adhesives, styrene - Butadiene-styrene (SEBS) hydrogenated adhesives, vinyl adhesives, enamel adhesives and acrylate adhesives.

該衝擊吸收層可具有25至45%的衝擊吸收率和15%至35%的初始彈性係數。 The impact absorbing layer may have an impact absorption rate of 25 to 45% and an initial elastic modulus of 15% to 35%.

該衝擊吸收層可具有5至20微米的平均氣泡直徑(cell diameter)。 The impact absorbing layer may have an average cell diameter of 5 to 20 microns (cell Diameter).

吸收衝擊之金屬膠帶的整體厚度可為75至300微米，且衝擊吸收層的厚度可為50至200微米。 The impact-absorbing metal tape may have an overall thickness of 75 to 300 μm, and the impact absorbing layer may have a thickness of 50 to 200 μm.

黏著層的厚度可為5至100微米。 The thickness of the adhesive layer can be from 5 to 100 microns.

如同本發明之一示範性具體實例，本發明係關於吸收衝擊的金屬膠帶，其進一步包含位於黏著層(其上方有吸收衝擊層形成)另一邊表面上的脫離薄膜層。 As an exemplary embodiment of the present invention, the present invention relates to an impact-absorbing metal tape further comprising a release film layer on the other side surface of the adhesive layer (on which the impact-absorbing layer is formed).

本發明係關於吸收衝擊的金屬膠帶，更特定地是提供了吸收衝擊的金屬膠帶，其包含具有高熱傳導率而展現出優良散熱效果的熱傳導層。 The present invention relates to an impact-absorbing metal tape, and more particularly to an impact-absorbing metal tape comprising a heat-conducting layer having high thermal conductivity and exhibiting an excellent heat-dissipating effect.

在本發明中，沉積衝擊吸收層和熱傳導層而不使用接合層，以至於有可能防止一個問題，即衝擊吸收效果和散熱效果因為黏著層的厚度而降解；並根據最近電子設備輕、薄、短、小的趨勢，即使是具有限厚度的金屬膠帶，吸收外部衝擊的效果和散去內部熱能的效果仍是優良的。 In the present invention, the impact absorbing layer and the heat conducting layer are deposited without using a bonding layer, so that it is possible to prevent a problem that the impact absorbing effect and the heat dissipating effect are degraded by the thickness of the adhesive layer; and according to recent electronic devices, light and thin, Short and small trend, even metal tape with limited thickness, the effect of absorbing external impact and dissipating internal heat is still excellent.

1‧‧‧熱傳導層 1‧‧‧heat conduction layer

2‧‧‧衝擊吸收層 2‧‧‧ Shock Absorbing Layer

3‧‧‧黏著層 3‧‧‧Adhesive layer

4‧‧‧脫離薄膜層 4‧‧‧From the film layer

圖1為根據本發明示範性具體實例之圖式，說明吸收衝擊之金屬膠帶的結構，其中熱傳導層、衝擊吸收層、黏著層及脫離薄膜層依次層疊。 BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a view showing the structure of an impact-absorbing metal tape in which a heat conductive layer, an impact absorbing layer, an adhesive layer, and a release film layer are laminated in this order, according to an exemplary embodiment of the present invention.

圖2為根據本發明示範性具體實例之圖式，說明吸收衝擊之金屬膠帶的結構，其中脫離薄膜層、黏著層、衝擊吸收層、熱傳導層、衝擊吸收層、黏著層及脫離薄膜層依次層疊。 2 is a view showing the structure of an impact-absorbing metal tape in which a release film layer, an adhesive layer, an impact absorbing layer, a heat conductive layer, an impact absorbing layer, an adhesive layer, and a release film layer are sequentially laminated according to an exemplary embodiment of the present invention. .

圖3為根據本發明示範性具體實例之衝擊吸收層的SEM照 片。 3 is an SEM photograph of an impact absorbing layer according to an exemplary embodiment of the present invention. sheet.

圖4為根據本發明示範性具體實例之衝擊吸收層的SEM照片。 4 is a SEM photograph of an impact absorbing layer according to an exemplary embodiment of the present invention.

本發明的示範性具體實例僅用於說明之目的，還有讓熟諳此技藝者充分理解本發明範圍。以下的示範性具體實例可用各種形式進行修改，且本發明的範圍不受限於該示範性具體實例；相反地，提供此等實例將使得本揭露資訊徹底和完整，並將本發明之概念完全傳達予熟諳此技藝者。 The exemplified embodiments of the present invention are intended to be illustrative only, and the scope of the invention is fully understood by those skilled in the art. The following exemplary embodiments may be modified in various forms, and the scope of the present invention is not limited by the exemplary embodiments; rather, the provision of such examples will make the disclosure information complete and complete, and complete the concept of the present invention. Communicate to those skilled in the art.

此外，在圖式中，為描述的方便和清楚而誇大了各層的厚度或尺寸，且圖式中的相同參考符號引述相同的元件；在本說明書中所使用的術語「及/或」包含一或多種相對應之列舉項目的任何一種或全部組合。 In addition, in the drawings, the thickness or size of each layer is exaggerated for the convenience and clarity of the description, and the same reference numerals in the drawings refer to the same elements; the term "and/or" used in this specification includes a Or any combination of any one or more of the corresponding listed items.

在本文中所使用的術語是用於描述特定示範性具體實例之目的且並非意圖限定本發明；除非是在上下文中有另外明確指出，否則在本文中所使用的單數形式也意圖包括複數形式；在本申請案中，應當理解術語「包含」和「具有」意圖表明特徵、數字、步驟、操作方式、構成元素，還有描述於說明書中之組件及其組合的存在，而且不預先排除一或多種其它特徵、數字、步驟、操作方式、構成要素、組件或其組合存在或加入的可能性。 The singular forms used herein are intended to include the plural, and are not intended to limit the invention; In the present application, the terms "comprising" and "having" are intended to indicate the presence of features, numbers, steps, modes of operation, constituent elements, and the presence of components and combinations thereof described in the specification, and without precluding one or The possibility of the presence or addition of various other features, numbers, steps, modes of operation, components, components or combinations thereof.

在本發明中，黏著層可為例如黏著劑組成物之層。在本發明中，術語「黏著層」可意指透過塗佈或硬化所形成的「黏著劑或黏著劑組成物」；術語「硬化黏著劑或黏著劑組成物」可意指在黏著劑或黏著劑組成 物裡面之交聯結構的物質化，此乃藉由黏著劑或黏著劑組成物中所含之成份的物理或化學效應或反應；「固化」可藉由下列來誘發，例如：在室溫下維持、施加水份、施加熱、有效能量射線的輻射或結合其至少兩種方法。取決於各例子，黏著劑或黏著劑組成物依其固化被誘發的型式，可被稱為例如：室溫可固化黏著劑組成物、水份可固化黏著劑組成物、熱固性黏著劑組成物、有效能量射線可固化黏著劑組成物，或是混合式可固化黏著劑或黏著劑組成物。 In the present invention, the adhesive layer may be, for example, a layer of an adhesive composition. In the present invention, the term "adhesive layer" may mean an "adhesive or adhesive composition" formed by coating or hardening; the term "hardened adhesive or adhesive composition" may mean adhesive or adhesive. Composition The materialization of the crosslinked structure in the substance, which is the physical or chemical effect or reaction of the components contained in the adhesive or adhesive composition; "curing" can be induced by, for example, at room temperature Maintaining, applying moisture, applying heat, radiation of effective energy rays, or combining at least two methods thereof. Depending on the examples, the type in which the adhesive or the adhesive composition is induced according to its curing may be referred to as, for example, a room temperature curable adhesive composition, a moisture curable adhesive composition, a thermosetting adhesive composition, An effective energy ray curable adhesive composition, or a hybrid curable adhesive or adhesive composition.

在本發明中，熱傳導是一種現象，其中熱能不斷地從高溫部分傳遞到低溫部分，且並未伴隨材料的移動。熱傳導層意指一種層，其中有熱傳導發生，熱的傳導可以透過熱傳導率來表示，且可透過熱線法、保護熱流法、保護熱板法及雷射脈衝法來分類熱傳導率，熱傳導率的數值是用k或瓦/(千k)來表示，熱傳導率的測量是透過下列等式來定義： In the present invention, heat conduction is a phenomenon in which thermal energy is continuously transmitted from a high temperature portion to a low temperature portion without accompanying movement of the material. The heat conduction layer means a layer in which heat conduction occurs, heat conduction can be expressed by thermal conductivity, and thermal conductivity, thermal conductivity, and thermal conductivity can be classified by hot wire method, protective heat flow method, protective hot plate method, and laser pulse method. It is expressed in k or watts / (thousands k), and the measurement of thermal conductivity is defined by the following equation:

當熱阻是由感應熱阻R=△T/q所組織時，從熱和電的相似性觀點來看，利用電路中的電壓、電流及電阻關係可知： When the thermal resistance is organized by the induced thermal resistance R = ΔT / q, from the viewpoint of thermal and electrical similarity, the relationship between voltage, current and resistance in the circuit can be known:

在此例中，熱阻R是樣品的熱阻Rs和接觸表面的熱阻Rc之總和，在這裡，當錯誤校正因子F被誘發時，熱阻表示如下：R=Rs+Rc=F‧△T/q In this case, the thermal resistance R is the sum of the thermal resistance R s of the sample and the thermal resistance R c of the contact surface. Here, when the error correction factor F is induced, the thermal resistance is expressed as follows: R = R s + R c =F‧△T/q

Rs=F[(T1-T2)/q]-Rc R s =F[(T 1 -T 2 )/q]-R c

Rs：樣品的熱阻 R s : thermal resistance of the sample

F：熱傳導的補償係數 F: compensation coefficient of heat conduction

T1：高於樣品的溫度 T 1 : higher than the temperature of the sample

T2：低於樣品的溫度 T 2 : lower than the temperature of the sample

q：每單位面積中的熱傳導率 q: thermal conductivity per unit area

Rc：接觸熱阻 R c : contact thermal resistance

當樣品的熱阻Rs是透過使用上述公式來計算時，樣品的熱傳遞率k可透過下列關係式來計算。 When the thermal resistance R s of the sample is calculated by using the above formula, the heat transfer rate k of the sample can be calculated by the following relationship.

Ls：樣品的厚度 L s : thickness of the sample

如同本發明之一示範性具體實例，本發明係關於一種吸收衝擊的金屬膠帶，其包含：熱傳導層、衝擊吸收層及黏著層，其中該衝擊吸收層包含聚合物發泡體，且形成在無接合層之該熱傳導層的一邊表面或兩邊表面上，該黏著層形成在該衝擊吸收層的另一邊表面上，其上方有該熱傳導層形成；更特定地是該吸收衝擊的金屬膠帶為一種金屬膠帶，其中衝擊吸收層、熱傳導層及黏著層依次層疊，或是一種金屬膠帶，其中第一黏著層、第一衝擊吸收層、第一熱傳導層、第二衝擊吸收層及第二黏著層依次層疊，該第一黏著層和第二黏著層僅有層疊的位置不同，但具有相同成份，且該第一衝擊吸收層和第二衝擊吸收層也僅有層疊的位置不同，但具有相同成份。 As an exemplary embodiment of the present invention, the present invention relates to an impact-absorbing metal tape comprising: a heat conductive layer, an impact absorbing layer, and an adhesive layer, wherein the impact absorbing layer comprises a polymer foam and is formed in none On one side surface or both side surfaces of the heat conducting layer of the bonding layer, the adhesive layer is formed on the other side surface of the impact absorbing layer, and the heat conducting layer is formed thereon; more specifically, the metal tape for absorbing impact is a metal The tape, wherein the impact absorbing layer, the heat conducting layer and the adhesive layer are laminated in sequence, or a metal tape, wherein the first adhesive layer, the first impact absorbing layer, the first heat conducting layer, the second impact absorbing layer and the second adhesive layer are sequentially laminated The first adhesive layer and the second adhesive layer are only different in lamination, but have the same composition, and the first impact absorbing layer and the second impact absorbing layer are only different in lamination, but have the same composition.

如同本發明之示範性具體實例，該聚合物發泡體為任何一或多種選自由下列所組成之群組：聚胺甲酸乙酯發泡體、聚苯乙烯發泡體、 聚乙烯發泡體、聚烯烴發泡體、聚氯乙烯發泡體、聚碳酸酯發泡體、聚醚醯亞胺發泡體、聚醯胺發泡體、聚酯發泡體、聚二氯亞乙烯發泡體、聚甲基丙烯酸甲酯發泡體及聚三聚異氰酸酯發泡體，且較佳為聚胺甲酸乙酯發泡體或聚苯乙烯發泡體。 As an exemplary embodiment of the present invention, the polymer foam is any one or more selected from the group consisting of polyurethane foams, polystyrene foams, Polyethylene foam, polyolefin foam, polyvinyl chloride foam, polycarbonate foam, polyether phthalimide foam, polyamide foam, polyester foam, poly 2 A vinylidene chloride foam, a polymethyl methacrylate foam, and a polytrimeric isocyanate foam, and is preferably a polyurethane foam or a polystyrene foam.

該聚苯乙烯發泡體包含苯乙烯，且較佳為一或多種選自由下列所組成之群組：苯乙烯均聚物之通用聚苯乙烯(GPPS)、橡膠在苯乙烯中聚合之抗衝擊的耐衝擊聚苯乙烯(HIPS)，以及有發泡劑混合在內的發泡性聚苯乙烯(EPS)。此外，該發泡體包含聚胺甲酸乙酯，且該聚胺甲酸乙酯包含聚三聚異氰酸酯和較佳為一或多種選自由下列所組成之群組：聚醚類聚胺甲酸乙酯，包含：多元醇和含有二醇或三醇的聚酯類聚胺甲酸乙酯。此外，該發泡體包括聚胺甲酸乙酯，且該聚胺甲酸乙酯可透過層疊具有不同比重的聚酯類聚胺甲酸乙酯和聚醚類聚胺甲酸乙酯、具有不同比重的聚酯類聚胺甲酸乙酯和聚酯類聚胺甲酸乙酯，或具有不同比重的聚醚類聚胺甲酸乙酯和聚醚類聚胺甲酸乙酯來組成。另外，該發泡體包括聚胺甲酸乙酯，且該聚胺甲酸乙酯可與聚苯乙烯層疊。 The polystyrene foam comprises styrene, and preferably one or more selected from the group consisting of: styrene homopolymer, general-purpose polystyrene (GPPS), rubber, anti-impact polymerization in styrene Impact polystyrene (HIPS), and expandable polystyrene (EPS) with a mixture of blowing agents. Further, the foam comprises polyurethane, and the polyurethane comprises polytrimeric isocyanate and preferably one or more selected from the group consisting of polyether polyurethanes, including Polyol and polyester polyurethane containing diol or triol. In addition, the foam comprises polyurethane, and the polyurethane is permeable to polyester-polyurethane and polyether polyurethane having different specific gravities, and polyesters having different specific gravity. Ethyl carbamate and polyester polyurethane, or polyether polyurethane and polyether polyurethane with different specific gravity. Further, the foam includes polyurethane, and the polyurethane may be laminated with polystyrene.

如同本發明之示範性具體實例，該熱傳導層為任何一或多種選自由下列所組成之群組：銅、不銹鋼(SUS)、銀、鉛、碳鋼、青銅、鎳、鉑、鎢、鑄鐵及銅箔；熱傳導層的熱傳導率表示出極優良的熱傳導率，其中鋁的熱傳導率為237瓦/千K、銅的熱傳導率為400瓦/千K、不銹鋼的熱導率為12至45瓦/千K、銀的熱傳導率為429瓦/千K、鉛的熱傳導率為35瓦/千K、碳鋼的熱傳導率為36至53瓦/千K的、青銅的熱傳導率為110瓦/千K、鎳的熱傳導率為59至90瓦/千K、鉑的熱導率為71.6瓦/千K、鎢的 熱導率是53至66瓦/千K、鑄鐵的熱傳導率為64瓦/千K，以及銅箔的熱導率是372瓦/千K，使得電子設備內部所產生的散熱效果優良。 As an exemplary embodiment of the present invention, the heat conducting layer is any one or more selected from the group consisting of copper, stainless steel (SUS), silver, lead, carbon steel, bronze, nickel, platinum, tungsten, cast iron, and Copper foil; the thermal conductivity of the heat conducting layer indicates excellent thermal conductivity, wherein the thermal conductivity of aluminum is 237 watts/kK, the thermal conductivity of copper is 400 watts/kK, and the thermal conductivity of stainless steel is 12 to 45 watts/ The thermal conductivity of kilo K and silver is 429 watts/kK, the thermal conductivity of lead is 35 watts/kK, the thermal conductivity of carbon steel is 36 to 53 watts/kK, and the thermal conductivity of bronze is 110 watts/kK. The thermal conductivity of nickel is 59 to 90 watts/kilogram, and the thermal conductivity of platinum is 71.6 watts/kK. The thermal conductivity is 53 to 66 watts/kilogram, the thermal conductivity of cast iron is 64 watts/kilogram K, and the thermal conductivity of copper foil is 372 watts/kilogram K, which makes the heat dissipation effect inside the electronic device excellent.

如同本發明之示範性具體實例，本發明係關於吸收衝擊的金屬膠帶，其中銅箔的伸長率為3至30%，銅箔的表面粗糙度Ra為0.3至3微米，且較佳地，銅箔的伸長率為5至25%，銅箔的表面粗糙度Ra為0.5至2微米。當銅箔的伸長率低於3%時，銅箔的伸長率低，以至於當聚合物發泡體在銅箔上發泡時，不可能施加張力於銅箔，故因而不均勻地形成聚合物發泡層，當施加過大的張力於銅箔時，可能會有銅箔斷裂的問題。當銅箔的表面粗糙度Ra超過3微米時，會有熱傳導率低的問題，也會有需要使用大量的聚合物發泡體來填充銅箔的表面，以至於生產成本的利潤不大的問題。 As an exemplary embodiment of the present invention, the present invention relates to an impact-absorbing metal tape wherein the copper foil has an elongation of 3 to 30%, the copper foil has a surface roughness Ra of 0.3 to 3 μm, and preferably, copper. The elongation of the foil is 5 to 25%, and the surface roughness Ra of the copper foil is 0.5 to 2 μm. When the elongation of the copper foil is less than 3%, the elongation of the copper foil is low, so that when the polymer foam is foamed on the copper foil, it is impossible to apply tension to the copper foil, so that polymerization is unevenly formed. The foam layer may have a problem that the copper foil is broken when excessive tension is applied to the copper foil. When the surface roughness Ra of the copper foil exceeds 3 μm, there is a problem that the thermal conductivity is low, and there is a problem that a large amount of polymer foam is required to fill the surface of the copper foil, so that the profit of production cost is not large. .

如同本發明之示範性具體實例，該黏著層可為任何一或多種選自由下列所組成之群組的黏著劑：聚乙烯醇類黏著劑、丙烯酸類黏著劑、乙酸乙烯酯類黏著劑、胺甲酸乙酯類黏著劑、聚酯類黏著劑、聚烯烴類黏著劑、聚乙烯烷基醚類黏著劑、橡膠類黏著劑、氯乙烯-乙酸乙烯酯類黏著劑、苯乙烯-丁二烯-苯乙烯(SBS)類黏著劑、苯乙烯-丁二烯-苯乙烯(SEBS)氫化類黏著劑、乙烯類黏著劑、矽類黏著劑及丙烯酸酯類黏著劑，且較佳為一或多種選自由下列所組成之群組：丙烯酸類黏著劑、胺甲酸乙酯類黏著劑及矽類黏著劑，且更佳地，該黏著劑組成物可包含丙烯酸聚合物或聚胺甲酸乙酯類黏著劑；如為丙烯酸聚合物，可使用具有重量平均分子量(Mw)為400,000或更多的聚合物。術語「重量平均分子量」是利用凝膠滲層析法(GPC)所測定之相對於標準聚苯乙烯的轉換數值，且在 本說明書中，除非另有規定，「分子量」可意指「重量平均分子量」，有可能將黏著劑的耐久性維持在的適當範圍內，此乃透過使聚合物的分子量為400,000或更多，分子量的上限並沒有特別限定，例如：在考慮到塗佈特性和類似特性時，分子量的上限可以被調整至約2,500,000或更低的範圍內。該丙烯酸類聚合物可包含衍生自例如(間)丙烯酸酯化合物的聚合單元。(間)丙烯酸酯化合物的實例可包含(間)丙烯酸烷基酯。在考慮到內聚力、玻璃轉換溫度及黏著特性時，具有烷基的(金屬)丙烯酸烷基酯，其中碳原子數為1至10。單體的實例包括(間)丙烯酸甲酯、(間)丙烯酸乙酯、(間)直鏈(n-profile)(間)丙烯酸酯、(間)丙烯酸異丙酯、(間)丙烯酸正丁酯、(間)丙烯酸叔丁酯、(間)丙烯酸仲丁酯、(間)丙烯酸戊酯、(間)丙烯酸2-乙基己酯、(間)丙烯酸2-乙基丁酯、(間)丙烯酸正辛酯、(間)丙烯酸，異辛酯、(間)丙烯酸異壬酯、(間)丙烯酸月桂酯或(間)丙烯酸十四烷酯，如為(間)丙烯酸酯化合物，除了(間)丙烯酸烷基酯之外的其它化合物也可以使用；該聚胺甲酸乙酯類黏著劑i)具有大多數黏著物表面的有效潤濕性、ii)具有一種特性，即與黏著物輕易地氫鍵結，以及iii)具有一種特性，即藉由小的分子尺寸輕易地滲透至多孔性黏著物，且與具有活性氫的黏著物形成共價鍵，此外，該種胺甲酸乙酯類黏著劑包含①單包裝型乳液聚胺甲酸乙酯類黏著劑、②雙包裝型乳液聚胺甲酸乙酯粘合劑及③胺甲酸乙酯/丙烯酸混合物黏著劑，且並不限於此。 As an exemplary embodiment of the present invention, the adhesive layer may be any one or more adhesives selected from the group consisting of polyvinyl alcohol adhesives, acrylic adhesives, vinyl acetate adhesives, amines. Ethyl formate adhesive, polyester adhesive, polyolefin adhesive, polyvinyl alkyl ether adhesive, rubber adhesive, vinyl chloride-vinyl acetate adhesive, styrene-butadiene Styrene (SBS) type adhesive, styrene-butadiene-styrene (SEBS) hydrogenated adhesive, vinyl adhesive, anthraquinone adhesive and acrylate adhesive, and preferably one or more Freely grouped as follows: an acrylic adhesive, an urethane adhesive, and an anthraquintic adhesive, and more preferably, the adhesive composition may comprise an acrylic polymer or a polyurethane adhesive. As the acrylic polymer, a polymer having a weight average molecular weight (Mw) of 400,000 or more can be used. The term "weight average molecular weight" is a conversion value measured by gel permeation chromatography (GPC) relative to standard polystyrene, and In the present specification, unless otherwise specified, "molecular weight" may mean "weight average molecular weight", and it is possible to maintain the durability of the adhesive within an appropriate range by making the molecular weight of the polymer 400,000 or more. The upper limit of the molecular weight is not particularly limited, for example, the upper limit of the molecular weight can be adjusted to a range of about 2,500,000 or less in consideration of coating characteristics and the like. The acrylic polymer may comprise polymerized units derived from, for example, an (meth) acrylate compound. Examples of the (meta) acrylate compound may include an alkyl (meth) acrylate. The alkyl (meth) acrylate having an alkyl group in an amount of from 1 to 10 in view of cohesive force, glass transition temperature, and adhesion characteristics. Examples of the monomer include (meta) methyl acrylate, (m) ethyl acrylate, (inter) n-profile acrylate, isopropyl acrylate, n-butyl acrylate , (m-)-tert-butyl acrylate, (inter) sec-butyl acrylate, (m) pentyl acrylate, (meth) 2-ethylhexyl acrylate, (di) 2-ethyl butyl acrylate, (m) acrylic acid N-octyl ester, (meta) acrylic acid, isooctyl ester, (meta) isodecyl acrylate, (m) lauryl acrylate or (m) decyl acrylate, such as (m) acrylate compound, in addition to (between) Other compounds than alkyl acrylates can also be used; the polyurethane adhesives i) have the effective wettability of most adhesive surfaces, ii) have a property of easily hydrogen bonding with the adhesive. The knot, and iii) have a property of easily penetrating into the porous adhesive by a small molecular size and forming a covalent bond with the active hydrogen-containing adhesive, and further, the urethane-based adhesive contains 1 single-package emulsion polyurethane adhesive, 2 double-package emulsion polyurethane adhesive and 3 uric acid Ester / acrylic adhesive mixtures, and it is not limited thereto.

如同本發明之示範性具體實例，本發明係關於吸收衝擊的金屬膠帶，其中衝擊吸收層具有25至45%的衝擊吸收率和15%至35%的初始彈性係數，且較佳為30至40%的衝擊吸收率和20%至30%的初始彈性係數； 當衝擊吸收率低於25%且初始彈性係數低於15%時，初始彈性係數低，以至於衝擊吸收率表示出低數值度，故藉金屬膠帶的衝擊吸收效果輕微，此外當初始彈性係數超過35%且衝擊吸收率超過45%時，金屬膠帶的黏著力降解，以至於有耐久性的問題。 As an exemplary embodiment of the present invention, the present invention relates to an impact-absorbing metal tape, wherein the impact absorbing layer has an impact absorption ratio of 25 to 45% and an initial elastic modulus of 15% to 35%, and preferably 30 to 40. % impact absorption rate and an initial elastic modulus of 20% to 30%; When the impact absorption rate is less than 25% and the initial elastic modulus is less than 15%, the initial elastic modulus is low, so that the impact absorption rate indicates a low numerical value, so the impact absorption effect by the metal tape is slight, and when the initial elastic modulus exceeds At 35% and the impact absorption rate exceeds 45%, the adhesion of the metal tape is degraded, so that there is a problem of durability.

如同本發明之示範性具體實例，本發明係關於吸收衝擊的金屬膠帶，其中衝擊吸收層具有5至20微米的平均氣泡直徑，較佳為7至15微米，平均氣泡尺寸可以用例如ASTM D3576-77測量，該衝擊吸收層包含聚合物發泡體，且該聚合物發泡體是低密度的交聯(部分交聯或完全交聯)聚合物，並具有一種特性，即可透過外力壓縮該聚合物發泡體，當該外力被移除後，該聚合物發泡體會恢復至具有原始體積，藉由上述特性，該衝擊吸收層吸收衝擊。然而，當平均氣泡直徑小於5微米時，在外力壓縮該衝擊吸收層時所造成的一定程度壓縮過於輕微，以至於衝擊吸收效果可能會差，當平均氣泡直徑超過20微米時，該衝擊吸收層可能會失去某特性，即該衝擊吸收層在被外力壓縮後會恢復至具有原始體積。 As an exemplary embodiment of the present invention, the present invention relates to an impact-absorbing metal tape wherein the impact absorbing layer has an average cell diameter of 5 to 20 μm, preferably 7 to 15 μm, and the average bubble size can be, for example, ASTM D3576- Measuring 77, the impact absorbing layer comprises a polymer foam, and the polymer foam is a low-density cross-linked (partially cross-linked or fully cross-linked) polymer, and has a property that the external force can be compressed The polymer foam, when the external force is removed, the polymer foam returns to have an original volume, and the impact absorbing layer absorbs the impact by the above characteristics. However, when the average bubble diameter is less than 5 μm, the compression caused by the external force compressing the impact absorbing layer is too slight, so that the impact absorption effect may be poor, and when the average bubble diameter exceeds 20 μm, the impact absorbing layer It may lose a characteristic that the impact absorbing layer will return to its original volume after being compressed by an external force.

如同本發明之示範性具體實例，吸收衝擊之金屬膠帶的整體厚度為75至300微米，且衝擊吸收層的厚度為50至200微米，更佳地，吸收衝擊之金屬膠帶的整體厚度為100至250微米，且衝擊吸收層的厚度為75至150微米；當金屬膠帶的整體厚度為小於75微米，且衝擊吸收層的厚度小於50微米時，該衝擊吸收層太薄，以至於對外力的衝擊吸收效果輕微，當金屬膠帶的整體厚度超過300微米，且衝擊吸收層的厚度超過200微米時，該衝擊吸收層太厚，以至於該金屬膠帶不適用於電子設備輕、薄、短、小之趨勢，且生產成本的利潤不大。 As an exemplary embodiment of the present invention, the impact-absorbing metal tape has an overall thickness of 75 to 300 μm, and the impact absorbing layer has a thickness of 50 to 200 μm. More preferably, the impact-absorbing metal tape has an overall thickness of 100 to 250 μm, and the thickness of the impact absorbing layer is 75 to 150 μm; when the overall thickness of the metal tape is less than 75 μm and the thickness of the impact absorbing layer is less than 50 μm, the impact absorbing layer is too thin to impact external force The absorption effect is slight. When the overall thickness of the metal tape exceeds 300 μm and the thickness of the impact absorbing layer exceeds 200 μm, the impact absorbing layer is too thick, so that the metal tape is not suitable for use in electronic equipment, light, thin, short, and small. The trend, and the profit of production costs is not large.

如同本發明之示範性具體實例，本發明係關於吸收衝擊的金屬膠帶，其中黏著層的厚度為5至100微米，且較佳為5至50微米；當該黏著層的厚度小於5微米時，該黏著層太薄，以至於會有黏著效果降解的問題，當該黏著層的厚度超過100微米時，會有生產成本的利潤不大且熱傳導效果降解的問題。 As an exemplary embodiment of the present invention, the present invention relates to an impact-absorbing metal tape, wherein the thickness of the adhesive layer is 5 to 100 μm, and preferably 5 to 50 μm; when the thickness of the adhesive layer is less than 5 μm, The adhesive layer is too thin to have a problem of degradation of the adhesive effect. When the thickness of the adhesive layer exceeds 100 μm, there is a problem that the profit of production cost is small and the heat conduction effect is degraded.

如同本發明之示範性具體實例，本發明係關於吸收衝擊的金屬膠帶，其更進一步包含位於黏著層(其上方有吸收衝擊形成)另一邊表面上的脫離薄膜層。特定地，本發明係關於吸收衝擊的金屬膠帶，其中熱傳導層、衝擊吸收層、黏著層及脫離薄膜層依次層疊，或是吸收衝擊的金屬膠帶，其中脫離薄膜層、黏著層、衝擊吸收層、熱傳導層、衝擊吸收層、黏著層及脫離薄膜層依次層疊。該脫離薄膜層的厚度並未特別限定，但可為5至50微米，在此範圍內，有可能保護接合層和黏著劑薄膜以免於外部的物理性衝擊，並使得已完成產品維持適當的體積和重量，因而使操作者在移動中和工作時能易於工作。 As an exemplary embodiment of the present invention, the present invention relates to an impact-absorbing metal tape, which further comprises a release film layer on the other side surface of the adhesive layer (on which the impact is formed). Specifically, the present invention relates to an impact-absorbing metal tape, wherein a heat conductive layer, an impact absorbing layer, an adhesive layer, and a release film layer are sequentially laminated, or an impact-absorbing metal tape, wherein the film layer, the adhesive layer, the impact absorbing layer, The heat conductive layer, the impact absorbing layer, the adhesive layer, and the release film layer are laminated in this order. The thickness of the release film layer is not particularly limited, but may be 5 to 50 μm, and in this range, it is possible to protect the bonding layer and the adhesive film from external physical impact and to maintain a proper volume of the finished product. And weight, thus making the operator easy to work while on the move and at work.

以下將透過實例對本發明進行更詳細地描述，然而，這些實例僅用於說明本發明之目的，對於熟諳此技藝者而言，顯而易見的是，根據本發明之原理事項的本發明範圍並不限定於下列實例。 The invention is described in more detail below by way of examples, however, these examples are only intended to illustrate the purpose of the invention, and it is obvious to those skilled in the art that the scope of the invention is not limited by the principles of the invention. In the following examples.

如圖1之說明，本發明之配置通常分為三層，本發明包含熱傳導層1、衝擊吸收層2及黏著層3，本發明可進一步包含脫離薄膜層4，以使得黏著層3免於遭受外部的異物或衝擊；如圖2之說明，作為本發明之示範性具體實例，本發明具有一種結構，其中脫離薄膜層4、黏著層3、衝擊吸收層2、熱傳導層1、衝擊吸收層2、黏著層3及脫離薄膜層4依次 層疊。即圖1係關於金屬膠帶，其包含形成在金屬膠帶之一邊表面上的黏著層，且圖2係關於雙邊金屬膠帶，其包含形成在金屬膠帶之兩邊表面上的黏著層。金屬膠帶的整體厚度為75至300微米，且較佳為100至200微米。衝擊吸收層2的厚度為50至200微米，且較佳為75至150微米。黏著層3的厚度為5至100微米，較佳為5至50微米，且更佳為5至25微米。 As illustrated in Fig. 1, the configuration of the present invention is generally divided into three layers, and the present invention comprises a heat conducting layer 1, an impact absorbing layer 2 and an adhesive layer 3. The present invention may further comprise a release film layer 4 to protect the adhesive layer 3 from suffering. External foreign matter or impact; as illustrated in FIG. 2, as an exemplary embodiment of the present invention, the present invention has a structure in which the release film layer 4, the adhesive layer 3, the impact absorption layer 2, the heat conduction layer 1, and the impact absorption layer 2 are , the adhesive layer 3 and the release film layer 4 in turn Cascade. That is, Fig. 1 relates to a metal tape comprising an adhesive layer formed on one side surface of a metal tape, and Fig. 2 relates to a double-sided metal tape comprising an adhesive layer formed on both side surfaces of the metal tape. The metal tape has an overall thickness of 75 to 300 μm, and preferably 100 to 200 μm. The impact absorbing layer 2 has a thickness of 50 to 200 μm, and preferably 75 to 150 μm. The thickness of the adhesive layer 3 is 5 to 100 μm, preferably 5 to 50 μm, and more preferably 5 to 25 μm.

熱傳導層1為任何一或多種選自由下列所組成之群組：銅、不銹鋼(SUS)、銀、鉛、碳鋼、青銅、鎳、鉑、鎢、鑄鐵及銅箔，且較佳為銅或銅箔。可不受限地使用所屬技術領域中已知的典型銅箔來作為該銅箔，且該銅箔包含例如透過滾鍛法和電解法製造的所有銅箔。更佳地，該銅箔為電解銅箔，但不限於此。 The heat conducting layer 1 is any one or more selected from the group consisting of copper, stainless steel (SUS), silver, lead, carbon steel, bronze, nickel, platinum, tungsten, cast iron, and copper foil, and is preferably copper or Copper foil. A typical copper foil known in the art can be used as the copper foil without limitation, and the copper foil contains all copper foils manufactured, for example, by roll forging and electrolytic methods. More preferably, the copper foil is an electrolytic copper foil, but is not limited thereto.

衝擊吸收層2包含聚合物發泡體，且該聚合物發泡體為任何一或多種選自由下列所組成之群組：聚胺甲酸乙酯發泡體、聚苯乙烯發泡體、聚乙烯發泡體、聚烯烴發泡體、聚氯乙烯發泡體、聚碳酸酯發泡體、聚醚醯亞胺發泡體、聚醯胺發泡體、聚酯發泡體、聚二氯亞乙烯發泡體、聚甲基丙烯酸甲酯發泡體及聚三聚異氰酸酯發泡體，且較佳為聚胺甲酸乙酯發泡體或聚苯乙烯發泡體。 The impact absorbing layer 2 comprises a polymer foam, and the polymer foam is any one or more selected from the group consisting of polyurethane foam, polystyrene foam, polyethylene. Foam, polyolefin foam, polyvinyl chloride foam, polycarbonate foam, polyether phthalimide foam, polyamine foam, polyester foam, polydichloro An ethylene foam, a polymethyl methacrylate foam, and a polytrimeric isocyanate foam, and preferably a polyurethane foam or a polystyrene foam.

在該聚合物發泡體中，有大量的小氣泡形成於聚合物內部，以至於該聚合物輕且具有優良的可撓性和抗衝擊性，以至於該聚合物發泡體被廣泛用作包裝材料、緩衝材料、輕質結構材料及其類似物。聚合物發泡體的製作方法包含化學方法和物理方法，化學方法是一種製作發泡體的方法，其透過徹底地混合聚合物樹脂和發泡劑，並透過進行適當操作來產生氣體以分解發泡劑；物理方法一種製作發泡體的方法，其透過使發泡劑 滲透到樹脂，然後減壓和膨脹該發泡劑。化學方法主要應用於發泡聚胺甲酸乙酯和聚烯烴，物理方法主要應用於發泡聚苯乙烯和聚烯烴。 In the polymer foam, a large amount of small bubbles are formed inside the polymer, so that the polymer is light and has excellent flexibility and impact resistance, so that the polymer foam is widely used. Packaging materials, cushioning materials, lightweight structural materials and the like. The method for producing a polymer foam includes a chemical method and a physical method, and the chemical method is a method for producing a foam by thoroughly mixing a polymer resin and a foaming agent, and performing a proper operation to generate a gas to decompose the hair. Foaming agent; a method of making a foam by passing a foaming agent The resin is infiltrated, and then the blowing agent is depressurized and expanded. The chemical method is mainly applied to foaming polyurethane and polyolefin, and the physical method is mainly applied to expanded polystyrene and polyolefin.

由於環境問題的增加，透過物理方法而非化學方法所製造之合成樹脂發泡顆粒的方法已被廣泛地採用。作為物理方法之發泡劑者為有機發泡劑，如氟氯碳化物(CFC)、丙烷及丁烷，還有無機發泡劑，如二氧化碳和氮，但考慮到大氣污染時，將增加如二氧化碳之無機發泡劑的使用。 Due to an increase in environmental problems, a method of producing synthetic resin foamed particles by physical methods other than chemical methods has been widely employed. As a physical method, the foaming agent is an organic foaming agent such as chlorofluorocarbon (CFC), propane and butane, and an inorganic foaming agent such as carbon dioxide and nitrogen, but when air pollution is considered, it will increase as The use of inorganic blowing agents for carbon dioxide.

黏著層3可為任何一或多種選自由下列所組成之群組：聚乙烯醇類黏著劑、丙烯酸類黏著劑、乙酸乙烯酯類黏著劑、胺甲酸乙酯類黏著劑、聚酯類黏著劑、聚烯烴類黏著劑、聚乙烯烷基醚類黏著劑、橡膠類黏著劑、氯乙烯-乙酸乙烯酯類黏著劑、苯乙烯-丁二烯-苯乙烯(SBS)類黏著劑、苯乙烯-丁二烯-苯乙烯(SEBS)氫化類黏著劑、乙烯類黏著劑、矽類黏著劑及丙烯酸酯類黏著劑，較佳為任何一或多種選自由下列所組成之群組：丙烯酸類黏著劑、胺甲酸乙酯類黏著劑及矽類黏著劑，且更佳地，該黏著劑組成物可包含丙烯酸聚合物或胺甲酸乙酯類黏著劑。 The adhesive layer 3 may be any one or more selected from the group consisting of polyvinyl alcohol adhesives, acrylic adhesives, vinyl acetate adhesives, urethane adhesives, polyester adhesives. , polyolefin adhesives, polyvinyl alkyl ether adhesives, rubber adhesives, vinyl chloride-vinyl acetate adhesives, styrene-butadiene-styrene (SBS) adhesives, styrene - A butadiene-styrene (SEBS) hydrogenated adhesive, an ethylene adhesive, an anthraquintic adhesive, and an acrylate adhesive, preferably any one or more selected from the group consisting of acrylic adhesives And an urethane-based adhesive and an anthraquinone-based adhesive, and more preferably, the adhesive composition may comprise an acrylic polymer or a urethane-based adhesive.

可透過所屬技術領域中的典型已知技術來進行黏著層3與衝擊吸收層的接合。例如：黏著層3可以接合到衝擊吸收層，此乃透過在該衝擊吸收層表面上塗覆丙烯酸樹脂組成物或聚胺甲酸乙酯樹脂組成物清漆，然後加熱、乾燥及固化該丙烯酸樹脂組成物或聚胺甲酸乙酯樹脂組成物清漆，或是在該衝擊吸收層表面上配置黏著片材或薄膜(其透過加熱和乾燥塗佈在支撐體上的樹脂清漆而獲得)，然後將黏著片材或薄膜與衝擊吸收層接合。 The bonding of the adhesive layer 3 to the impact absorbing layer can be carried out by a typical known technique in the art. For example, the adhesive layer 3 may be bonded to the impact absorbing layer by applying an acrylic resin composition or a polyurethane resin composition varnish on the surface of the impact absorbing layer, and then heating, drying and curing the acrylic resin composition or a polyurethane varnish composition varnish, or an adhesive sheet or film disposed on the surface of the impact absorbing layer (which is obtained by heating and drying a resin varnish coated on the support), and then bonding the sheet or The film is bonded to the impact absorbing layer.

在此例中，當塗覆該丙烯酸樹脂組成物或聚胺甲酸乙酯樹脂 組成物至基底材料上時，可不受限地使用在所屬技術領域中已知的典型各種塗佈方法，例如，浸漬塗佈、壓鑄模塗佈(die coating)、輥壓塗佈、刮刀式塗佈(comma coating)、鑄造及其組合；此外，乾襙方法和乾燥條件可為所屬技術領域中已知典型範圍內的黏著劑，以及例如：乾燥可在溫度為50至170℃下進行1至30分鐘。 In this case, when the acrylic resin composition or the polyurethane resin is applied When the composition is applied to the substrate material, various typical coating methods known in the art can be used without limitation, for example, dip coating, die coating, roll coating, blade coating. Comma coating, casting, and combinations thereof; in addition, the cognacing method and drying conditions may be an adhesive within a typical range known in the art, and for example, drying may be carried out at a temperature of 50 to 170 ° C to 1 to 30 minutes.

脫離薄膜層4在被放置在黏著層3的一邊表面(圖1中的下表面)上以保護該粘接劑層3，該脫離薄膜層4可使用纖維素薄膜，如：三乙醯纖維素(TAC)薄膜、如聚對酞酸乙二酯(PET)的聚酯薄膜、聚碳酸酯薄膜、聚醚碸薄膜、丙烯酸薄膜、聚乙烯薄膜、聚丙烯薄膜、包含環類或降莰烯結構的聚烯烴薄膜，或是如乙烯-丙烯共聚物薄膜的聚烯烴類薄膜，但不限定於此等，較佳地，可用鬆力(release force)為10克/英吋之脫離用PET薄膜以易於脫離。 The release film layer 4 is placed on one side surface (lower surface in FIG. 1) of the adhesive layer 3 to protect the adhesive layer 3, and the release film layer 4 may use a cellulose film such as triacetyl cellulose. (TAC) film, polyester film such as polyethylene terephthalate (PET), polycarbonate film, polyether enamel film, acrylic film, polyethylene film, polypropylene film, containing ring or norbornene structure a polyolefin film, or a polyolefin film such as an ethylene-propylene copolymer film, but is not limited thereto, and preferably, a release film having a release force of 10 g/inch can be used. Easy to separate.

實施例 Example

製造用於吸收衝擊的金屬膠帶。 A metal tape for absorbing impact is produced.

實施例1 Example 1

透過在厚度為35微米的銅箔上混合聚胺甲酸乙酯樹脂和發泡劑，且讓混合物在110至280℃的溫度下發泡而形成厚度為105微米的聚胺甲酸乙酯發泡層，接著在160℃下3分鐘後，將10微米的丙烯酸類黏著劑轉印塗佈於聚胺甲酸乙酯發泡層上，在此例中，使用刮刀式塗佈機來進行塗佈方法，製造出具有整體厚度為150微米的金屬膠帶。 A polyurethane foam layer having a thickness of 105 μm is formed by mixing a polyurethane resin and a foaming agent on a copper foil having a thickness of 35 μm and allowing the mixture to foam at a temperature of 110 to 280 ° C. Then, after 3 minutes at 160 ° C, a 10 μm acrylic adhesive was transferred onto the polyurethane foam layer. In this example, a coating method was performed using a knife coater. A metal tape having an overall thickness of 150 μm was produced.

實施例2 Example 2

除了使用具有厚度40微米之銅箔和形成100微米的聚胺甲 酸乙酯發泡層以外，用跟實施例1相同之方式製造吸收衝擊的金屬膠帶。 In addition to using copper foil with a thickness of 40 microns and forming a 100 micron polyamine An impact-absorbing metal tape was produced in the same manner as in Example 1 except for the acid ethyl ester foam layer.

實施例3 Example 3

除了使用具有厚度45微米之銅箔和形成95微米的聚胺甲酸乙酯發泡層以外，用跟實施例1相同之方式製造吸收衝擊的金屬膠帶。 An impact-absorbing metal tape was produced in the same manner as in Example 1 except that a copper foil having a thickness of 45 μm and a polyurethane foam layer having a thickness of 95 μm were used.

實施例4 Example 4

除了使用具有伸長率10%和表面粗糙度1微米的銅箔以外，用跟實施例1相同之方式製造吸收衝擊的金屬膠帶。 An impact-absorbing metal tape was produced in the same manner as in Example 1 except that a copper foil having an elongation of 10% and a surface roughness of 1 μm was used.

比較實施例1 Comparative Example 1

除了在厚度35微米的銅層上之厚度10微米的聚胺甲酸乙酯黏著層，還有接合至聚胺甲酸乙酯黏著層的聚胺甲酸乙酯發泡層以外，用跟實施例1相同之方式製造吸收衝擊的金屬膠帶。 The same as in Example 1 except that the polyurethane adhesive layer having a thickness of 10 μm on the copper layer having a thickness of 35 μm and the polyurethane foam layer bonded to the adhesive layer of polyurethane were used. The method of manufacturing a metal tape that absorbs impact.

比較實施例2 Comparative Example 2

除了形成厚度70微米的銅層和厚度70微米的聚胺甲酸乙酯發泡層以外，用跟實施例1相同之方式製造吸收衝擊的金屬膠帶。 An impact-absorbing metal tape was produced in the same manner as in Example 1 except that a copper layer having a thickness of 70 μm and a polyurethane foam layer having a thickness of 70 μm were formed.

比較實施例3 Comparative Example 3

除了使用具有伸長率2%和表面粗糙度1微米的銅箔以外，用跟實施例0.1相同之方式製造吸收衝擊的金屬膠帶。 An impact-absorbing metal tape was produced in the same manner as in Example 0.1 except that a copper foil having an elongation of 2% and a surface roughness of 1 μm was used.

比較實施例4 Comparative Example 4

透過將黏著層塗佈在銅箔上來製造金屬膠帶，不進行其中的聚胺甲酸乙酯發泡。 A metal tape is produced by coating an adhesive layer on a copper foil, and the polyurethane foaming therein is not performed.

實施例1至4和比較實施例1至4之金屬膠帶的厚度數值顯示於下表1當中。 The thickness values of the metal tapes of Examples 1 to 4 and Comparative Examples 1 to 4 are shown in Table 1 below.

吸收衝擊之金屬膠帶的性質特徵。 The nature of the metal tape that absorbs impact.

實施例1至4和比較實施例1至4之金屬膠帶的特性評比結果顯示於表2當中。 The property evaluation results of the metal tapes of Examples 1 to 4 and Comparative Examples 1 to 4 are shown in Table 2.

杜邦衝擊測試是一種附著強度的評比(分離和剝落)，透過水平放置樣品、使該樣品跟像輻射狀的衝頭形狀相接觸，且在特定高度上投下具有特定負載的重量。在比較實施例1的例子，即包含黏著層的金屬膠帶中，該黏著層的厚度為10微米，其佔膠帶的百分比小，但由於該黏著層，該金屬膠顯示出低數值的杜邦衝擊測試結果，以至於可看出黏著強度也不大；在比較實施例2的例子中，銅箔具70微米(大)的厚度，以至於金屬膠帶的熱傳導率高，但即使衝擊吸收層具有70微米(大)的厚度，該金屬帶在恢復率、抗壓強度及杜邦衝擊測試中顯示出來的數值低；在比較實施例3的例子中，銅箔的伸長率較低，以至於不可能在製造金屬膠帶的過程中對該金屬膠帶施加張力，因而引起所塗覆之聚胺甲酸乙酯發泡層的厚度不均勻的問題，從而該金屬膠帶的表面不光滑，以至於無法測量特性，如抗壓強度。 The DuPont impact test is a measure of adhesion strength (separation and spalling) by placing the sample horizontally, contacting the sample with a radial shaped punch shape, and casting a weight with a specific load at a specific height. In the example of Comparative Example 1, that is, the metal tape including the adhesive layer, the adhesive layer has a thickness of 10 μm, which is a small percentage of the tape, but due to the adhesive layer, the metal adhesive exhibits a low value DuPont impact test. As a result, it can be seen that the adhesive strength is not large; in the example of Comparative Example 2, the copper foil has a thickness of 70 μm (large), so that the thermal conductivity of the metal tape is high, but even the impact absorption layer has 70 μm. (large) thickness, the metal strip showed a low value in recovery rate, compressive strength, and DuPont impact test; in the example of Comparative Example 3, the elongation of the copper foil was low, so that it was impossible to manufacture The metal tape is subjected to tension during the process of the metal tape, thereby causing a problem of uneven thickness of the coated polyurethane foam layer, so that the surface of the metal tape is not smooth, so that characteristics cannot be measured, such as resistance. Pressure strength.

相較於僅使用銅箔所製造的金屬膠帶(比較實施例4)而言，在實施例1至4的例子中，金屬膠帶的熱傳導率低，但在衝擊吸收測試的杜邦衝擊測試中，該金屬膠帶相較於比較實施例4的金屬膠帶顯示出更佳的結果。除此之外，該金屬膠帶在抗壓強度和恢復率中顯示出更佳的結果。 In the examples of Examples 1 to 4, the thermal conductivity of the metal tape was low compared to the metal tape manufactured using only the copper foil (Comparative Example 4), but in the DuPont impact test of the impact absorption test, The metal tape showed better results than the metal tape of Comparative Example 4. In addition to this, the metal tape showed better results in compressive strength and recovery rate.

1‧‧‧熱傳導層 1‧‧‧heat conduction layer

2‧‧‧衝擊吸收層 2‧‧‧ Shock Absorbing Layer

3‧‧‧黏著層 3‧‧‧Adhesive layer

4‧‧‧脫離薄膜層 4‧‧‧From the film layer

Claims (18)

一種吸收衝擊的金屬膠帶，其包含：熱傳導層、衝擊吸收層、及黏著層，其中該衝擊吸收層包含聚合物發泡體，該衝擊吸收層形成在無接合層之該熱傳導層的一邊表面或兩邊表面上，且該黏著層形成在該衝擊吸收層的另一邊表面上，其上方有該熱傳導層形成。 An impact-absorbing metal tape comprising: a heat conductive layer, an impact absorbing layer, and an adhesive layer, wherein the impact absorbing layer comprises a polymer foam formed on a side surface of the heat conductive layer of the jointless layer or On both sides of the surface, the adhesive layer is formed on the other side surface of the impact absorbing layer, and the heat conductive layer is formed thereon. 如申請專利範圍第1項的金屬膠帶，其中該聚合物發泡體為任何一或多種選自由下列所組成之群組：聚胺甲酸乙酯發泡體、聚乙烯發泡體、聚烯烴發泡體、聚氯乙烯發泡體、聚碳酸酯發泡體、聚醚醯亞胺發泡體、聚醯胺發泡體、聚酯發泡體、聚二氯亞乙烯發泡體、聚甲基丙烯酸甲酯發泡體及聚三聚異氰酸酯發泡體。 The metal tape of claim 1, wherein the polymer foam is any one or more selected from the group consisting of polyurethane foam, polyethylene foam, and polyolefin. Foam body, polyvinyl chloride foam, polycarbonate foam, polyether phthalimide foam, polyamide foam, polyester foam, polydivinylidene foam, polymethyl A methyl acrylate foam and a polytrimeric isocyanate foam. 如申請專利範圍第2項的金屬膠帶，其中該聚合物發泡體為聚胺甲酸乙酯發泡體或聚苯乙烯發泡體。 The metal tape of claim 2, wherein the polymer foam is a polyurethane foam or a polystyrene foam. 如申請專利範圍第1項的金屬膠帶，其中該熱傳導層為任何一或多種選自由下列所組成之群組：銅、不銹鋼(SUS)、銀、鉛、碳鋼、青銅、鎳、鉑、鎢、鑄鐵及銅箔。 The metal tape of claim 1, wherein the heat conductive layer is any one or more selected from the group consisting of copper, stainless steel (SUS), silver, lead, carbon steel, bronze, nickel, platinum, tungsten. , cast iron and copper foil. 如申請專利範圍第4項的金屬膠帶，其中該熱傳導層為銅或銅箔。 The metal tape of claim 4, wherein the heat conductive layer is copper or copper foil. 如申請專利範圍第4項的金屬膠帶，其中該銅箔具有3至30%的伸長 率和0.3至3微米的表面粗糙度Ra。 The metal tape of claim 4, wherein the copper foil has an elongation of 3 to 30% Rate and surface roughness Ra of 0.3 to 3 microns. 如申請專利範圍第6項的金屬膠帶，其中該銅箔具有5至25%的伸長率和0.5至2微米的表面粗糙度Ra。 The metal tape of claim 6, wherein the copper foil has an elongation of 5 to 25% and a surface roughness Ra of 0.5 to 2 μm. 如申請專利範圍第1項的金屬膠帶，其中該黏著層為任何一或多種選自由下列所組成之群組：聚乙烯醇類黏著劑、丙烯酸類黏著劑、乙酸乙烯酯類黏著劑、胺甲酸乙酯類黏著劑、聚酯類黏著劑、聚烯烴類黏著劑、聚乙烯烷基醚類黏著劑、橡膠類黏著劑、氯乙烯-乙酸乙烯酯類黏著劑、苯乙烯-丁二烯-苯乙烯(SBS)類黏著劑、苯乙烯-丁二烯-苯乙烯(SEBS)氫化類黏著劑、乙烯類黏著劑、矽類黏著劑及丙烯酸酯類黏著劑。 The metal tape of claim 1, wherein the adhesive layer is any one or more selected from the group consisting of polyvinyl alcohol adhesives, acrylic adhesives, vinyl acetate adhesives, and uric acid. Ethyl ester adhesive, polyester adhesive, polyolefin adhesive, polyvinyl alkyl ether adhesive, rubber adhesive, vinyl chloride-vinyl acetate adhesive, styrene-butadiene-benzene Ethylene (SBS) type adhesive, styrene-butadiene-styrene (SEBS) hydrogenated adhesive, vinyl adhesive, anthraquinone adhesive and acrylate adhesive. 如申請專利範圍第8項的金屬膠帶，其中該黏著層為一或多種選自由下列所組成之群組：丙烯酸類黏著劑、胺甲酸乙酯類黏著劑及矽類黏著劑。 The metal tape of claim 8, wherein the adhesive layer is one or more selected from the group consisting of an acrylic adhesive, an urethane adhesive, and an anthraquintic adhesive. 如申請專利範圍第1項的金屬膠帶，其中該衝擊吸收層具有25至45%的衝擊吸收率和15%至35%的初始彈性係數。 The metal tape of claim 1, wherein the impact absorbing layer has an impact absorption ratio of 25 to 45% and an initial elastic modulus of 15% to 35%. 如申請專利範圍第10項的金屬膠帶，其中該衝擊吸收層具有30至40%的衝擊吸收率和20%至30%的初始彈性係數。 The metal tape of claim 10, wherein the impact absorbing layer has an impact absorption rate of 30 to 40% and an initial elastic modulus of 20% to 30%. 如申請專利範圍第1項的金屬膠帶，其中該衝擊吸收層具有20至40微米的平均氣泡直徑。 The metal tape of claim 1, wherein the impact absorbing layer has an average cell diameter of 20 to 40 μm. 如申請專利範圍第12項的金屬膠帶，其中該衝擊吸收層具有25至35微米的平均氣泡直徑。 The metal tape of claim 12, wherein the impact absorbing layer has an average cell diameter of 25 to 35 microns. 如申請專利範圍第1項的金屬膠帶，其中吸收衝擊之該金屬膠帶的整 體厚度為75至300微米，且該衝擊吸收層的厚度為50至200微米。 For example, the metal tape of claim 1 of the patent scope, wherein the metal tape that absorbs the impact is integrated The body thickness is 75 to 300 μm, and the impact absorbing layer has a thickness of 50 to 200 μm. 如申請專利範圍第14項的金屬膠帶，其中吸收衝擊之該金屬膠帶的整體厚度為100至200微米，且該衝擊吸收層的厚度為75至150微米。 The metal tape of claim 14, wherein the metal tape absorbing the impact has an overall thickness of 100 to 200 μm, and the impact absorbing layer has a thickness of 75 to 150 μm. 如申請專利範圍第1項的金屬膠帶，其中該黏著層的厚度為5至100微米。 The metal tape of claim 1, wherein the adhesive layer has a thickness of 5 to 100 μm. 如申請專利範圍第16項的金屬膠帶，其中該黏著層的厚度為5至50微米。 The metal tape of claim 16, wherein the adhesive layer has a thickness of 5 to 50 μm. 如申請專利範圍第16項的金屬膠帶，其更進一步包含：位於該黏著層(其上方有該衝擊吸收層形成)另一邊表面上的脫離薄膜層。 The metal tape of claim 16, further comprising: a release film layer on the other side surface of the adhesive layer (on which the impact absorption layer is formed).
TW105122318A 2015-07-23 2016-07-15 Metal tape for absorbing impact TW201707966A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1020150104388A KR101802951B1 (en) 2015-07-23 2015-07-23 Metal tape for absorbing impact

Publications (1)

Publication Number Publication Date
TW201707966A true TW201707966A (en) 2017-03-01

Family

ID=57877876

Family Applications (1)

Application Number Title Priority Date Filing Date
TW105122318A TW201707966A (en) 2015-07-23 2016-07-15 Metal tape for absorbing impact

Country Status (3)

Country Link
KR (1) KR101802951B1 (en)
CN (1) CN106366961A (en)
TW (1) TW201707966A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102334411B1 (en) * 2017-07-25 2021-12-03 삼성디스플레이 주식회사 Display apparatus and manufacturing the same
KR101922938B1 (en) * 2017-09-29 2018-11-29 일진머티리얼즈 주식회사 Multi-functional composite sheet having function of controlling electromagnetic wave, thermal radiation, and absorbing impact
KR102041859B1 (en) * 2017-10-25 2019-11-08 일진머티리얼즈 주식회사 Composite sheet for absorbing impact

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110305357B (en) * 2012-11-27 2021-06-01 积水化学工业株式会社 Thermally conductive foam sheet for electronic device and thermally conductive laminate for electronic device
KR101500467B1 (en) * 2013-10-29 2015-03-12 닛토덴코 가부시키가이샤 Laminate

Also Published As

Publication number Publication date
CN106366961A (en) 2017-02-01
KR101802951B1 (en) 2017-11-29
KR20170011569A (en) 2017-02-02

Similar Documents

Publication Publication Date Title
JP4761428B2 (en) Adhesive tapes
WO2016075753A1 (en) Adhesive tape having foamed resin base material, and method for producing same
JP6363156B2 (en) Battery adhesive sheet and lithium ion battery
TW201707966A (en) Metal tape for absorbing impact
US20190016927A1 (en) Adhesive Strips
JP6322469B2 (en) Substrate processing method
TW201809178A (en) Pressure-sensitive adhesive strip
JP7029456B2 (en) Laminates and touch panels
JP6565804B2 (en) Adhesive tape, heat dissipation sheet, electronic device, and method for producing adhesive tape
JP2018515638A (en) Double-sided tape, electronic device including double-sided tape, and method for producing double-sided tape
JPWO2018110255A1 (en) Transfer sheet
KR20170065514A (en) Foam composite sheet
KR20180086558A (en) Composite sheet for absorbing impact
KR101659987B1 (en) Swelling tape having polyurethane film
KR101954650B1 (en) Composite sheet for absorbing impact
KR102041859B1 (en) Composite sheet for absorbing impact
JP6294775B2 (en) Double-sided adhesive tape and base material for double-sided adhesive tape
TW201842103A (en) Adhesive sheet
JP6204132B2 (en) Release sheet and adhesive sheet
KR20140052457A (en) A heat film with function of heat-shield and heat-diffusion
JP5315678B2 (en) Polishing pad manufacturing method
TW201933455A (en) Dicing die-bonding film achieving good peelability between an adhesive layer as a die-bonding film and a separator and suppressing the floating of the adhesive layer and the separator
JP2009148876A (en) Polishing pad and polishing method using it
JP6440405B2 (en) Substrate processing method
JP6432063B2 (en) Waterproof double-sided adhesive tape and portable information terminal device