TW201702762A - Pattern drawing device and pattern drawing method - Google Patents
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/12—Scanning systems using multifaceted mirrors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N1/00—Scanning, transmission or reproduction of documents or the like, e.g. facsimile transmission; Details thereof
- H04N1/04—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa
- H04N1/113—Scanning arrangements, i.e. arrangements for the displacement of active reading or reproducing elements relative to the original or reproducing medium, or vice versa using oscillating or rotating mirrors
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Laser Beam Printer (AREA)
- Mechanical Optical Scanning Systems (AREA)
- Facsimile Scanning Arrangements (AREA)
Abstract
Description
本發明係關於一種掃描照射至被照射體上之光束的光點以描繪圖案之圖案描繪裝置及圖案描繪方法。 The present invention relates to a pattern drawing device and a pattern drawing method for scanning a spot of a light beam that is irradiated onto an object to be irradiated to draw a pattern.
如日本特開2004-117865號公報所揭示，已知有如下技術：於藉由雷射光束之掃描而於感光體上描繪圖像之雷射掃描裝置(彩色雷射列印機)中，使用一個多面鏡掃描複數條雷射光束的各者，沿著複數條掃描線描繪圖像。 As disclosed in Japanese Laid-Open Patent Publication No. 2004-117865, there is known a technique of using a laser scanning device (color laser printer) for drawing an image on a photoreceptor by scanning a laser beam. A polygon mirror scans each of the plurality of laser beams to depict an image along a plurality of scan lines.
日本特開2004-117865號公報中，揭示有如下串接型雷射掃描裝置，該串接型雷射掃描裝置係於被照射體之移動方向即副掃描方向上隔開地平行配置掃描線，該掃描線由利用一個多面鏡的不同反射面的各者而偏向掃描之複數條雷射光束生成。對於日本特開2004-117865號公報所揭示之雷射掃描裝置而言，被照射體(感光鼓等)上所能描繪出之圖像的掃描線方向(主掃描方向)最大尺寸，係由一條掃描線的長度決定。因此，為了增大所能描繪出之圖像的主掃描方向尺寸，需要以使掃描線變更長之方式，增大多面鏡之後的掃描光學系統(透鏡或面鏡等)。另一方面，對於利用光點之掃描而描繪最小線寬為數μm~20μm左右之電子電路用的高精細圖案且使其曝光之曝光裝置而言，需要使光點的尺寸(直徑)為最小線寬的數分之一(1/2~1/4)左右，並且需要與掃描線上的光點的投射位置同步且高精度及 高速地控制與描繪圖案的資料相對應之光點的強度調變。然而，若使藉由透過多面鏡之光束偏向掃描而生成之一條掃描線變長，則隨著多面鏡之後的掃描光學系統等之大型化，難以穩定地維持描繪高精細圖案時所需之掃描線的配置精度或光學性能。 Japanese Laid-Open Patent Publication No. 2004-117865 discloses a tandem type laser scanning apparatus in which scanning lines are arranged in parallel in a sub-scanning direction in which a subject is moved, that is, in a sub-scanning direction. The scan line is generated by a plurality of laser beams that are biased toward each other using different reflective surfaces of a polygon mirror. In the laser scanning device disclosed in Japanese Laid-Open Patent Publication No. 2004-117865, the maximum size of the scanning line direction (main scanning direction) of the image that can be drawn on the object to be irradiated (photosensitive drum or the like) is one. The length of the scan line is determined. Therefore, in order to increase the size of the main scanning direction of the image that can be drawn, it is necessary to increase the scanning optical system (lens, mirror, etc.) after the polygon mirror so that the scanning line is changed long. On the other hand, in an exposure apparatus which draws a high-definition pattern for an electronic circuit having a minimum line width of about several μm to 20 μm by scanning with a light spot, it is necessary to make the size (diameter) of the spot a minimum line. a wide fraction (1/2~1/4), and needs to be synchronized with the projection position of the spot on the scan line with high precision and The intensity modulation of the spot corresponding to the data of the drawing pattern is controlled at high speed. However, if one of the scanning lines is made longer by scanning the beam through the polygon mirror, the scanning optical system and the like after the polygon mirror are enlarged, and it is difficult to stably maintain the scanning required for drawing the high-definition pattern. Line configuration accuracy or optical performance.
本發明之第1態樣係一種圖案描繪裝置，使來自光源裝置之光束呈點狀地聚光於被照射體上，使聚光後之光點沿著既定之掃描線進行主掃描，並且對上述被照射體進行副掃描，藉此在上述被照射體上描繪既定圖案，其具備：旋轉多面鏡，為了上述主掃描而繞旋轉軸旋轉；第1導光光學系統，從第1方向朝上述旋轉多面鏡投射來自上述光源裝置之第1光束；第2導光光學系統，從與上述第1方向不同之第2方向朝上述旋轉多面鏡投射來自上述光源裝置之第2光束；第1投射光學系統，使由上述旋轉多面鏡反射之上述第1光束聚光並作為第1光點而投射至第1掃描線上；以及第2投射光學系統，使由上述旋轉多面鏡反射之上述第2光束聚光並作為第2光點而投射至第2掃描線上；以使上述第1掃描線與上述第2掃描線於上述被照射體上位於上述副掃描方向上之相同位置且在上述主掃描方向上錯開之方式，配置上述第1投射光學系統與上述第2投射光學系統。 A first aspect of the present invention is a pattern drawing device that condenses a light beam from a light source device in a spot shape on an object to be irradiated, and performs a main scanning of the collected light spot along a predetermined scanning line, and The object to be irradiated is sub-scanned to draw a predetermined pattern on the object to be irradiated, and includes a rotating polygon mirror that rotates about a rotation axis for the main scanning, and the first light guiding optical system faces the first direction a rotating polygon mirror projects a first light beam from the light source device; and a second light guiding optical system projects a second light beam from the light source device toward the rotating polygon mirror from a second direction different from the first direction; the first projection optics a system that condenses the first light beam reflected by the rotating polygon mirror and projects it onto a first scanning line as a first spot; and a second projection optical system that converges the second light beam reflected by the rotating polygon mirror The light is projected onto the second scanning line as the second spot; the first scanning line and the second scanning line are located at the same position in the sub-scanning direction on the object to be irradiated, and The staggered manner in the scanning direction, arranged above the first projection optical system and the second projection optical system.
本發明之第2態樣係一種圖案描繪裝置，對可撓性之長條之片材基板即被照射體沿著長邊方向進行副掃描、且使基於描繪資料而強度調變之光點沿著於與上述被照射體之長邊方向正交之寬度方向延伸之掃描線進行主掃描，藉此在上述被照射體上描繪與上述描繪資料相對應之圖 案，其具備：旋轉多面鏡，為了上述主掃描而繞旋轉軸旋轉；第1導光光學系統，從第1方向朝上述旋轉多面鏡投射第1光束；第2導光光學系統，從與上述第1方向不同之第2方向朝上述旋轉多面鏡投射第2光束；第1投射光學系統，使由上述旋轉多面鏡反射之上述第1光束聚光並作為第1光點而投射至第1掃描線上；以及第2投射光學系統，使由上述旋轉多面鏡反射之上述第2光束聚光並作為第2光點而投射至第2掃描線上；以將上述第1掃描線與上述第2掃描線的各掃描長度設為相同，並且於上述主掃描方向以上述掃描長度以下之間隔分離設定上述第1掃描線與上述第2掃描線之方式，配置上述第1投射光學系統與上述第2投射光學系統。 According to a second aspect of the present invention, there is provided a pattern drawing device for performing a sub-scanning of a flexible sheet substrate, that is, an object to be irradiated, in the longitudinal direction, and for adjusting the intensity of the intensity based on the drawing data. Main scanning is performed on a scanning line extending in a width direction orthogonal to the longitudinal direction of the object to be irradiated, thereby drawing a map corresponding to the drawing material on the object to be irradiated a rotating polygon mirror that rotates around a rotation axis for the main scanning; the first light guiding optical system projects a first light beam from the first direction toward the rotating polygon mirror; and the second light guiding optical system a second light beam is projected toward the rotating polygon mirror in a second direction different from the first direction; the first projection optical system condenses the first light beam reflected by the rotating polygon mirror and projects the first light spot as a first light spot to the first scanning And the second projection optical system condenses the second light beam reflected by the rotating polygon mirror and projects the second light beam as a second light spot onto the second scanning line; and the first scanning line and the second scanning line Each of the scanning lengths is set to be the same, and the first scanning optical system and the second projection optical are arranged such that the first scanning line and the second scanning line are separated and set at intervals of the scanning length or less in the main scanning direction. system.
本發明之第3態樣係一種圖案描繪方法，使來自光源裝置之光束呈點狀地聚光於被照射體上，使聚光後之光點沿著既定之掃描線進行主掃描，並且對上述被照射體進行副掃描，藉此在上述被照射體上描繪既定圖案，其包含如下步驟：將來自上述光源裝置之第1光束從第1方向朝旋轉多面鏡投射；將來自上述光源裝置之第2光束從與上述第1方向不同之第2方向朝上述旋轉多面鏡投射；藉由上述旋轉多面鏡之旋轉，對射入至上述旋轉多面鏡之不同反射面而反射之上述第1光束及上述第2光束進行偏向掃描；使由上述旋轉多面鏡反射之上述第1光束聚光並作為第1光點而投射至第1掃描線上；以及使由上述旋轉多面鏡反射之上述第2光束聚光並作為第2光點而投射至第2掃描線上；上述第1掃描線與上述第2掃描線於上述被照射體上位於上述副掃描方向上之相同位置，且於上述主掃描方向上錯開。 A third aspect of the present invention is a pattern drawing method for concentrating a light beam from a light source device in a spot shape on an object to be irradiated, and performing a main scanning of the collected light spot along a predetermined scanning line, and The object to be irradiated is sub-scanned to draw a predetermined pattern on the object to be irradiated, and the method includes the steps of: projecting a first light beam from the light source device toward the rotating polygon mirror from a first direction; and using the light source device The second light beam is projected toward the rotating polygon mirror from a second direction different from the first direction; and the first light beam reflected by the different reflecting surface of the rotating polygon mirror is reflected by the rotation of the rotating polygon mirror The second light beam is subjected to deflection scanning; the first light beam reflected by the rotating polygon mirror is collected and projected onto the first scanning line as a first light spot; and the second light beam reflected by the rotating polygon mirror is collected The light is projected onto the second scanning line as the second light spot; the first scanning line and the second scanning line are located at the same position in the sub-scanning direction on the object to be irradiated, and The main scanning direction is staggered.
本發明之第4態樣係一種圖案描繪方法，對可撓性之長條之 片材基板即被照射體沿著長邊方向進行副掃描、且使基於描繪資料而強度調變之光點沿著於與上述被照射體之長邊方向正交之寬度方向延伸之掃描線進行主掃描，藉此在上述被照射體上描繪與上述描繪資料相對應之圖案，其包含如下步驟：將第1光束從第1方向朝旋轉多面鏡投射；將第2光束從與上述第1方向不同之第2方向朝上述旋轉多面鏡投射；藉由上述旋轉多面鏡之旋轉，對射入至上述旋轉多面鏡之不同反射面而反射之上述第1光束及上述第2光束進行偏向掃描；使由上述旋轉多面鏡反射之上述第1光束聚光並作為第1光點而投射至第1掃描線上；以及使由上述旋轉多面鏡反射之上述第2光束聚光並作為第2光點而投射至第2掃描線上；將上述第1掃描線與上述第2掃描線之各掃描長度設為相同，並且於上述主掃描方向以上述掃描長度以下之間隔分離設定上述第1掃描線與上述第2掃描線。 A fourth aspect of the present invention is a pattern drawing method for a flexible strip The sheet substrate, that is, the irradiated body is sub-scanned along the longitudinal direction, and the light spot whose intensity is modulated based on the drawing material is along the scanning line extending in the width direction orthogonal to the longitudinal direction of the object to be irradiated. Main scanning, thereby drawing a pattern corresponding to the drawing material on the object to be irradiated, comprising the steps of: projecting the first light beam from the first direction toward the rotating polygon mirror; and separating the second light beam from the first direction a different second direction is projected toward the rotating polygon mirror; and the first light beam and the second light beam reflected by the different reflecting surfaces of the rotating polygon mirror are deflected by the rotation of the rotating polygon mirror; The first light beam reflected by the rotating polygon mirror is condensed and projected onto the first scanning line as a first spot; and the second light beam reflected by the rotating polygon mirror is condensed and projected as a second spot a second scanning line; the scanning lengths of the first scanning line and the second scanning line are the same, and the first scanning is performed at intervals of the scanning length or less in the main scanning direction The scan line and the second scan line described above.
本發明之第5態樣係一種圖案描繪裝置，一邊沿著副掃描方向搬送被照射體、一邊使來自光源裝置之光束呈點狀地聚光於上述被照射體上，使聚光後之光點沿著與上述副掃描方向正交之掃描線進行主掃描，藉此在上述被照射體上描繪既定圖案，其具備：旋轉多面鏡，繞既定之旋轉軸旋轉；第1導光光學系統，從第1方向朝上述旋轉多面鏡投射來自上述光源裝置之第1光束；第2導光光學系統，從與上述第1方向不同之第2方向朝上述旋轉多面鏡投射來自上述光源裝置之第2光束；第1投射光學系統，使由上述旋轉多面鏡反射之上述第1光束聚光並作為第1光點而投射至第1掃描線上；以及第2投射光學系統，使由上述旋轉多面鏡反射之上述第2光束聚光並作為第2光點而投射至第2掃描線上；且具備描繪單 元，該描繪單元係以於上述被照射體上沿著上述主掃描方向及上述副掃描方向中的至少一個方向平行地錯開配置上述第1掃描線與上述第2掃描線之方式，一體地保持上述旋轉多面鏡、上述第1導光光學系統、上述第2導光光學系統、上述第1投射光學系統及上述第2投射光學系統且可旋動；上述描繪單元之旋動中心軸，係設定成相對於上述被照射體垂直地通過上述第1掃描線之中點與上述第2掃描線之中點之間。 According to a fifth aspect of the present invention, in a pattern drawing device, a light beam from a light source device is collected in a spot shape while being irradiated along the sub-scanning direction, and the light is collected. The dot is subjected to main scanning along a scanning line orthogonal to the sub-scanning direction, thereby drawing a predetermined pattern on the object to be irradiated, comprising: a rotating polygon mirror rotating around a predetermined rotation axis; and a first light guiding optical system; Projecting a first light beam from the light source device toward the rotating polygon mirror from a first direction; the second light guiding optical system projects a second light from the light source device toward the rotating polygon mirror from a second direction different from the first direction a first projection optical system that condenses the first light beam reflected by the rotating polygon mirror and projects it onto the first scanning line as a first spot; and the second projection optical system reflects the rotating polygon mirror The second light beam is condensed and projected onto the second scanning line as a second light spot; In the drawing unit, the first scanning line and the second scanning line are arranged in parallel along at least one of the main scanning direction and the sub-scanning direction, and the drawing unit is integrally held. The rotating polygon mirror, the first light guiding optical system, the second light guiding optical system, the first projection optical system, and the second projection optical system are rotatable; and the rotation center axis of the drawing unit is set The object is vertically passed between the point of the first scanning line and the point of the second scanning line with respect to the object to be irradiated.
本發明之第6態樣係一種圖案描繪方法，一邊沿著副掃描方向搬送被照射體、一邊使來自光源裝置之光束呈點狀地聚光於上述被照射體上，使聚光後之光點沿著於與上述副掃描方向正交之方向延伸之掃描線進行主掃描，藉此在上述被照射體上描繪既定圖案，其包含如下步驟：將來自上述光源裝置之第1光束從第1方向朝旋轉多面鏡投射；將來自上述光源裝置之第2光束從與上述第1方向不同之第2方向朝上述旋轉多面鏡投射；藉由上述旋轉多面鏡之旋轉，對射入至上述旋轉多面鏡之不同反射面而反射之上述第1光束及上述第2光束進行偏向掃描；使由上述旋轉多面鏡反射之上述第1光束聚光並作為第1光點而投射至第1掃描線上；使由上述旋轉多面鏡反射之上述第2光束聚光並作為第2光點而投射至第2掃描線上；以及以旋動中心軸為中心，使上述第1掃描線與上述第2掃描線旋動，上述旋動中心軸係相對於上述被照射體垂直，且設定於上述第1掃描線之中點與上述第2掃描線之中點之間。 According to a sixth aspect of the present invention, in a pattern drawing method, a light beam from a light source device is collected in a spot shape on the object to be irradiated while the object to be irradiated is conveyed in the sub-scanning direction, and the light is collected. The main scanning is performed on the scanning line extending in a direction orthogonal to the sub-scanning direction, thereby drawing a predetermined pattern on the object to be irradiated, and the method includes the step of: first lightening the first light beam from the light source device The direction is projected toward the rotating polygon mirror; the second light beam from the light source device is projected toward the rotating polygon mirror from a second direction different from the first direction; and the rotating polygon mirror is injected into the rotating multi-faceted mirror The first light beam and the second light beam reflected by the different reflecting surfaces of the mirror are deflected and scanned, and the first light beam reflected by the rotating polygon mirror is collected and projected onto the first scanning line as a first light spot; The second light beam reflected by the rotating polygon mirror is condensed and projected onto the second scanning line as a second light spot; and the first scanning line and the second surface are centered on a central axis of rotation The scanning line is rotated, and the center axis of the rotation is perpendicular to the object to be irradiated, and is set between a point between the first scanning line and a point between the second scanning line.
本發明之第7態樣係一種圖案描繪裝置，使來自光源裝置之光束於被照射體上進行主掃描，並且使上述被照射體與上述光束沿著與上述主掃描交叉之方向相對地進行副掃描，藉此在上述被照射體上描繪圖 案，其具備：光偏向構件，為了上述主掃描而改變反射面的角度；第1投射光學系統，投射第1光束作為在上述被照射體上沿主掃描方向掃描之光束，上述第1光束為從第1方向投射至上述光偏向構件並由上述光偏向構件之反射面反射後之光束；以及第2投射光學系統，投射第2光束作為在上述被照射體上沿主掃描方向掃描之光束，上述第2光束為從與第1方向不同之第2方向投射至上述光偏向構件並由上述光偏向構件之反射面反射後之光束；以使藉由上述第1光束之主掃描而形成之第1掃描線、與藉由上述第2光束之主掃描而形成之第2掃描線在上述主掃描方向上錯開之方式，配置上述第1投射光學系統與上述第2投射光學系統。 According to a seventh aspect of the present invention, in a pattern drawing device, a light beam from a light source device is subjected to main scanning on an object to be irradiated, and the object to be irradiated and the light beam are opposed to each other in a direction intersecting with the main scanning. Scanning, thereby drawing a picture on the irradiated body In the case of the optical deflecting member, the angle of the reflecting surface is changed for the main scanning, and the first projection optical system projects the first light beam as a light beam scanned in the main scanning direction on the object to be irradiated, and the first light beam is a light beam that is projected from the first direction to the light deflecting member and reflected by the reflecting surface of the light deflecting member; and a second projection optical system that projects the second light beam as a light beam that is scanned in the main scanning direction on the irradiated body. The second light beam is a light beam that is projected from the second direction different from the first direction to the light deflecting member and reflected by the reflecting surface of the light deflecting member; and is formed by the main scanning of the first light beam The first projection optical system and the second projection optical system are disposed such that the scanning line and the second scanning line formed by the main scanning of the second light beam are shifted in the main scanning direction.
10‧‧‧元件製造系統 10‧‧‧Component Manufacturing System
12‧‧‧基板搬送機構 12‧‧‧Substrate transport mechanism
14‧‧‧光源裝置 14‧‧‧Light source device
16‧‧‧曝光頭 16‧‧‧Exposure head
18‧‧‧控制裝置 18‧‧‧Control device
20、20b‧‧‧第1導光光學系統 20, 20b‧‧‧1st light guiding optical system
22、22b‧‧‧第2導光光學系統 22, 22b‧‧‧2nd light guiding optical system
24、24a、24b‧‧‧第1投射光學系統 24, 24a, 24b‧‧‧1st projection optical system
26、26a、26b‧‧‧第2投射光學系統 26, 26a, 26b‧‧‧2nd projection optical system
100‧‧‧驅動電路 100‧‧‧ drive circuit
AMa(AMa1~AMa4)、AMb(AMb1~AMb4)‧‧‧對準顯微鏡 AMa (AMa1~AMa4), AMb (AMb1~AMb4)‧‧‧ alignment microscope
AOMa、AOMb‧‧‧光學元件 AOMa, AOMb‧‧‧ optical components
AXc、AXfa、AXfb‧‧‧光軸 AXc, AXfa, AXfb‧‧‧ optical axis
AXo1‧‧‧中心軸(第1中心軸) AXo1‧‧‧ central axis (1st central axis)
AXo2‧‧‧中心軸(第2中心軸) AXo2‧‧‧ central axis (2nd central axis)
AXp‧‧‧旋轉軸 AXp‧‧‧Rotary axis
AXr‧‧‧旋動中心軸 AXr‧‧‧Rotating central axis
AXs‧‧‧中心線 AXs‧‧‧ center line
AXt‧‧‧中心軸 AXt‧‧‧ central axis
BFa、BFb‧‧‧光束成形光學系統 BFa, BFb‧‧‧ Beam Forming Optical System
BS1‧‧‧第1光束分光器(半反射鏡) BS1‧‧‧1st beam splitter (half mirror)
BS2a、BS3a、BS3b、BS4a、BS4b‧‧‧光束分光器 BS2a, BS3a, BS3b, BS4a, BS4b‧‧‧ Beam splitter
BS2b‧‧‧第2光束分光器 BS2b‧‧‧2nd beam splitter
BW1、BW2‧‧‧收斂位置 BW1, BW2‧‧‧ convergence position
BX‧‧‧光束擴展器 BX‧‧‧beam expander
CCv、CV1、CV2‧‧‧特性 CCv, CV1, CV2‧‧‧ characteristics
CD‧‧‧聚光透鏡 CD‧‧‧ Concentrating lens
CLa、CLb‧‧‧準直透鏡 CLa, CLb‧‧ ‧ collimating lens
CLT‧‧‧描繪位元訊號 CLT‧‧‧ depicting bit signals
CY1、CY2a、CY2b‧‧‧柱面透鏡 CY1, CY2a, CY2b‧‧‧ cylindrical lens
CY1a、CY1b‧‧‧第1柱面透鏡 CY1a, CY1b‧‧‧1st cylindrical lens
DE‧‧‧控制訊號 DE‧‧‧ control signal
DR1、DR2‧‧‧旋轉筒 DR1, DR2‧‧‧ rotating drum
E‧‧‧設置面 E‧‧‧Setting surface
ECV‧‧‧溫控室 ECV‧‧‧temperature control room
EPC‧‧‧邊緣位置控制器 EPC‧‧‧Edge Position Controller
EX‧‧‧曝光裝置 EX‧‧‧Exposure device
fa‧‧‧前側焦點距離 Fa‧‧‧Front focus distance
fb‧‧‧後側焦點距離 Fb‧‧‧back focus distance
FTa、FTb‧‧‧fθ透鏡 FTa, FTb‧‧‧fθ lens
LB、LBa、LBa-1、LBa-2、LBb、LBb-1、LBb-2‧‧‧光束 LB, LBa, LBa-1, LBa-2, LBb, LBb-1, LBb-2‧‧ beams
LBu‧‧‧0次光束 LBu‧‧0 light beam
Lo、Lo-α‧‧‧分隔距離 Lo, Lo-α‧‧‧ separation distance
LS‧‧‧雷射光源 LS‧‧‧Laser light source
M1、M1’、M3a、M3b、M4、M4a、M4b、M5、M5a、M5b、M6a、M6b、M7a、M7b、M8、M11a、M11b、M12a、M12b、M13a、M13b、M14a、M14b、M15a、M15b‧‧‧反射鏡 M1, M1', M3a, M3b, M4, M4a, M4b, M5, M5a, M5b, M6a, M6b, M7a, M7b, M8, M11a, M11b, M12a, M12b, M13a, M13b, M14a, M14b, M15a, M15b ‧‧‧Reflector
M2‧‧‧三角反射鏡 M2‧‧‧ triangular mirror
M10‧‧‧三角反射鏡(直角鏡) M10‧‧‧triangular mirror (right angle mirror)
M10a、M10b、RP、RPa~RPh‧‧‧反射面 M10a, M10b, RP, RPa~RPh‧‧·reflecting surface
MK1~MK4‧‧‧對準標記 MK1~MK4‧‧‧ alignment mark
MR1、MR2a、MR2b、MR3a、MR3b‧‧‧面鏡 MR1, MR2a, MR2b, MR3a, MR3b‧‧‧ face mirror
P‧‧‧基板(被照射體) P‧‧‧Substrate (irradiated body)
p13a、p13b、p14a、p14b‧‧‧彎折位置 P13a, p13b, p14a, p14b‧‧‧ bending position
PBSa、PBSb‧‧‧偏振光束分光器 PBSa, PBSb‧‧‧ polarized beam splitter
Pcd‧‧‧後側焦點面 Pcd‧‧‧backside focal plane
PM、PMa、PMb‧‧‧多面鏡 PM, PMa, PMb‧‧‧ polygon mirror
Poc1、Poc2‧‧‧中心面 Poc1, Poc2‧‧‧ center surface
PR1、PR2‧‧‧處理裝置 PR1, PR2‧‧‧ processing device
Pv‧‧‧平面 Pv‧‧ plane
QPa、QPb‧‧‧1/4波長板 QPa, QPb‧‧‧1/4 Wavelength Board
R1、R2‧‧‧驅動輥 R1, R2‧‧‧ drive roller
Ra、Rb、Ro‧‧‧值 Ra, Rb, Ro‧‧ values
RT1、RT2、RT3‧‧‧張力調整輥 RT1, RT2, RT3‧‧‧ tension adjustment roller
Sdv‧‧‧高頻驅動訊號 Sdv‧‧‧ high frequency drive signal
SF‧‧‧高頻振盪器 SF‧‧‧High Frequency Oscillator
Sft1、Sft2‧‧‧軸 Sft1, Sft2‧‧‧ axis
SLa、SLb‧‧‧描繪線(掃描線) SLa, SLb‧‧‧ drawing line (scanning line)
SL1a~SL6a、SL1b~SL6b‧‧‧描繪線 SL1a~SL6a, SL1b~SL6b‧‧‧ depicting lines
SP、SPa、SPb‧‧‧光點 SP, SPa, SPb‧‧‧ spot
SRa、SRb‧‧‧偏移光學構件(偏移光學板) SRa, SRb‧‧‧ offset optical components (offset optical plate)
STa、STb、STc、STd、STe‧‧‧連接部 STa, STb, STc, STd, STe‧‧‧ Connections
SU1、SU2‧‧‧防振單元 SU1, SU2‧‧‧ anti-vibration unit
Tsq‧‧‧延遲時間 Tsq‧‧‧Delayed time
Ua2、Ub‧‧‧描繪單元 Ua2, Ub‧‧‧ drawing unit
Ub1‧‧‧第1描繪單元 Ub1‧‧‧1st drawing unit
Ub2‧‧‧第2描繪單元 Ub2‧‧‧2nd drawing unit
Ub3‧‧‧第3描繪單元 Ub3‧‧‧3rd drawing unit
U1、U2、U3、U4、U5、U6‧‧‧描繪單元 U1, U2, U3, U4, U5, U6‧‧‧ drawing unit
W‧‧‧曝光區域 W‧‧‧Exposure area
WS1~WS6‧‧‧分割區域 WS1~WS6‧‧‧ segmented area
X、Xt、Y、Yt、Z、Z‧‧‧方向 X, Xt, Y, Yt, Z, Z‧‧‧ directions
θm1、θm2‧‧‧入射角 Θm1, θm2‧‧‧ incident angle
θo、θy、△θz‧‧‧角度 Θo, θy, △θz‧‧‧ angle
θs‧‧‧角度範圍 Θs‧‧‧angle range
△Yh、△Zh‧‧‧位置偏移量 △Yh, △Zh‧‧‧ position offset
圖1係顯示第1實施形態之包含對基板實施曝光處理之曝光裝置之元件製造系統的概略構成之圖。 Fig. 1 is a view showing a schematic configuration of a component manufacturing system including an exposure apparatus that performs exposure processing on a substrate according to the first embodiment.
圖2係顯示圖1所示之複數個描繪單元之配置關係、及設置於基板之被照射面上的各描繪單元之描繪線的配置關係之圖。 2 is a view showing an arrangement relationship of a plurality of drawing units shown in FIG. 1 and an arrangement relationship of drawing lines of respective drawing units provided on an illuminated surface of a substrate.
圖3係顯示使在主掃描方向相鄰之描繪線的端部彼此一致時之各描繪單元之描繪線的配置關係之圖。 3 is a view showing an arrangement relationship of drawing lines of respective drawing units when the ends of the drawing lines adjacent in the main scanning direction are aligned with each other.
圖4係顯示使在掃描方向相鄰之描繪線的端部彼此各重疊固定長度時之各描繪單元之描繪線的配置關係之圖。 4 is a view showing an arrangement relationship of drawing lines of respective drawing units when the end portions of the drawing lines adjacent in the scanning direction are overlapped with each other by a fixed length.
圖5係從-Yt(-Y)方向側觀察之圖1所示之描繪單元之構成圖。 Fig. 5 is a view showing the configuration of the drawing unit shown in Fig. 1 as seen from the -Yt (-Y) direction side.
圖6係從+Zt方向側觀察之圖5所示之描繪單元之構成圖。 Fig. 6 is a view showing the configuration of the drawing unit shown in Fig. 5 as seen from the +Zt direction side.
圖7係從+Zt方向側觀察透過圖5所示之光學元件及準直透鏡射入至反 射鏡之光束的光路之圖。 Figure 7 is an optical element and a collimating lens shown in Figure 5 as viewed from the +Zt direction side. A diagram of the optical path of the beam of the mirror.
圖8係從+Xt方向側觀察從反射鏡射入至描繪單元之反射鏡之光束的光路之圖。 Fig. 8 is a view showing an optical path of a light beam incident from a mirror to a mirror of a drawing unit as viewed from the +Xt direction side.
圖9係於XtZt面內觀察圖5所示之描繪單元內的作為反射構件之反射鏡與聚光透鏡之配置關係之圖。 Fig. 9 is a view showing the arrangement relationship between a mirror as a reflection member and a condensing lens in the drawing unit shown in Fig. 5 in the XtZt plane.
圖10係於XtYt面內觀察圖9所示之作為反射構件之反射鏡與聚光透鏡之配置關係之圖。 Fig. 10 is a view showing the arrangement relationship between the mirror as a reflection member and the condensing lens shown in Fig. 9 in the XtYt plane.
圖11A係從+Zt方向側觀察當使圖5所示之描繪單元整體繞旋動中心軸旋動既定角度時，平行地射入至作為反射構件之反射鏡的光束之反射方向發生變化之樣子之圖，圖11B係從光束的前進方向側觀察使圖5所示之描繪單元整體旋動既定角度時之作為反射構件之反射鏡中的光束之位置變化之圖。 11A is a view showing a change in the direction of reflection of a light beam incident in parallel to a mirror as a reflection member when the entire drawing unit shown in FIG. 5 is rotated by a predetermined angle around a central axis of rotation as viewed from the +Zt direction side. FIG. 11B is a view showing a change in position of a light beam in a mirror as a reflection member when the drawing unit shown in FIG. 5 is rotated by a predetermined angle as viewed from the direction of the forward direction of the light beam.
圖12係從+Zt方向側觀察第1實施形態的變形例1中的利用多面鏡之光束掃描系統時之圖。 FIG. 12 is a view of the beam scanning system using the polygon mirror in the first modification of the first embodiment as seen from the +Zt direction side.
圖13係從+Xt方向側觀察圖12的光束掃描系統時之圖。 Fig. 13 is a view of the beam scanning system of Fig. 12 as seen from the +Xt direction side.
圖14係從+Zt方向側觀察第1實施形態的變形例2中的射入至多面鏡並反射之光束的光路時之圖。 FIG. 14 is a view of the optical path of the light beam incident on the polygon mirror and reflected in the second modification of the first embodiment as seen from the +Zt direction side.
圖15係從+Xt方向側觀察圖14的光束掃描系統時之圖。 Fig. 15 is a view of the beam scanning system of Fig. 14 as seen from the +Xt direction side.
圖16A係從+Zt方向側觀察第1實施形態的變形例4中的利用多面鏡之光束掃描系統時之圖，圖16B係從-Xt方向側觀察圖16A的光束掃描系統時之圖。 Fig. 16A is a view of the beam scanning system using the polygon mirror in the fourth modification of the first embodiment as seen from the +Zt direction side, and Fig. 16B is a view of the beam scanning system of Fig. 16A viewed from the -Xt direction side.
圖17係顯示第2實施形態中的描繪單元之一部分的構成之圖。 Fig. 17 is a view showing a configuration of a part of a drawing unit in the second embodiment.
圖18係從-Yt(-Y)方向側觀察之第3實施形態的描繪單元Ub之構成圖。 Fig. 18 is a configuration diagram of the drawing unit Ub of the third embodiment as seen from the -Yt (-Y) direction side.
圖19係從+Xt方向側觀察圖18所示之描繪單元中的自多面鏡朝向+Zt側的構成之圖。 Fig. 19 is a view showing a configuration from the polygon mirror toward the +Zt side in the drawing unit shown in Fig. 18 as seen from the +Xt direction side.
圖20係從+Zt方向側觀察圖18所示之描繪單元中的自多面鏡朝向-Zt方向側的構成之圖。 Fig. 20 is a view showing a configuration from the polygon mirror toward the -Zt direction side in the drawing unit shown in Fig. 18 as seen from the +Zt direction side.
圖21係顯示沿著Y(Yt)方向將基板上所形成的作為電子元件形成區域之曝光區域一分為六，藉由6條描繪線對帶狀之複數個分割區域的各者描繪圖案的情形之一例。 21 is a view showing that an exposure region formed as an electronic component forming region on a substrate is divided into six along a Y (Yt) direction, and a pattern is drawn by each of a plurality of stripe-shaped plurality of divided regions by six drawing lines. An example of a situation.
圖22係顯示第3實施形態之設於fθ透鏡之後的反射鏡之配置角度的例子之圖。 Fig. 22 is a view showing an example of the arrangement angle of the mirrors provided after the fθ lens in the third embodiment.
圖23係顯示用以將圖1中所示之光源裝置14所提供之兩條光束分配至圖2中的4個描繪單元的各者的光束分配系統之一例的構成之圖。 Fig. 23 is a view showing the configuration of an example of a light beam distribution system for distributing the two light beams provided by the light source device 14 shown in Fig. 1 to each of the four drawing units in Fig. 2.
圖24係對第4實施形態之描繪單元之多面鏡與後續之反射鏡之間的光束之偏向狀態進行說明之圖。 Fig. 24 is a view for explaining a state in which a light beam is deflected between a polygon mirror and a subsequent mirror of the drawing unit of the fourth embodiment.
圖25係顯示基於圖24之多面鏡或反射鏡中的反射率之入射角依存性之一例之特性的曲線圖。 Fig. 25 is a graph showing the characteristics of an incident angle dependency of the reflectance in the polygon mirror or the mirror of Fig. 24.
圖26係顯示用於對因反射鏡的反射率之入射角依存性而產生之光束強度變動進行調整之聲光調變元件(AOM)的控制系統的構成之圖。 Fig. 26 is a view showing a configuration of a control system of an acousto-optic modulation element (AOM) for adjusting a variation in beam intensity due to an incident angle dependency of a reflectance of a mirror.
圖27係顯示圖26的控制系統中的各部分之訊號的波形或時序之一例之時序圖。 Fig. 27 is a timing chart showing an example of a waveform or timing of signals of respective sections in the control system of Fig. 26.
以下，揭示較佳實施形態且參照隨附圖式，詳細地對本發明 的態樣之圖案描繪裝置及圖案描繪方法進行說明。另外，本發明的態樣並不限定於該等實施形態，亦包含添加有多種變更或改良之形態。即，以下所記載之構成要素中包含業者能夠容易地設想之構成要素、實質上相同之構成要素，以下所記載之構成要素可適當地組合。又，能夠於不脫離本發明宗旨之範圍內，對構成要素進行各種省略、替換或變更。 Hereinafter, the preferred embodiments are disclosed and the present invention will be described in detail with reference to the accompanying drawings. The pattern drawing device and the pattern drawing method will be described. Further, the aspect of the present invention is not limited to the embodiments, and includes various modifications and improvements. In other words, the constituent elements described below include constituent elements that can be easily conceived by the manufacturer, and substantially the same constituent elements, and the constituent elements described below can be combined as appropriate. Further, various omissions, substitutions, and changes may be made in the components without departing from the scope of the invention.
[第1實施形態] [First Embodiment]
圖1係顯示第1實施形態之包含對基板(被照射體)P實施曝光處理之曝光裝置EX之元件製造系統10的概略構成之圖。另外，於以下說明中，設定以重力方向作為Z方向之XYZ正交座標系，只要無特別說明，則根據圖示之箭頭對X方向、Y方向及Z方向進行說明。 FIG. 1 is a view showing a schematic configuration of a component manufacturing system 10 including an exposure apparatus EX that performs exposure processing on a substrate (illuminated body) P according to the first embodiment. In addition, in the following description, the XYZ orthogonal coordinate system in which the gravity direction is the Z direction is set, and unless otherwise indicated, the X direction, the Y direction, and the Z direction will be described based on the arrows shown.
元件製造系統10為構建有製造線之製造系統，該製造線例如製造作為電子元件之可撓性顯示器(flexible display)、膜狀觸控面板、液晶顯示面板用之膜狀彩色濾光片、或焊接電子零件之可撓性配線片等。以下，以可撓性顯示器為前提而對電子元件進行說明。作為可撓性顯示器，例如存在有機EL(Electroluminescence，電致發光)顯示器、液晶顯示器等。元件製造系統10具有所謂的捲對捲(Roll To Roll)方式之構造，即，從將可撓性的片狀(膜狀)基板(片材基板)P捲繞為捲狀而成的未圖示之供給捲送出基板P，連續地對所送出之基板P實施各種處理之後，利用未圖示之回收捲捲取各種處理後之基板P。基板P具有基板P的移動方向成為長邊方向(長條)，且寬度方向成為短邊方向(短條)之帶狀的形狀。從上述供給捲輸送來之基板P，依序由處理裝置PR1、曝光裝置(圖案描繪裝置、光束掃描裝置)EX及處理裝置PR2等實施各種處理，且由上述回收捲捲取。 The component manufacturing system 10 is a manufacturing system in which a manufacturing line is constructed, for example, a flexible display as an electronic component, a film-shaped touch panel, a film-shaped color filter for a liquid crystal display panel, or A flexible wiring sheet for soldering electronic parts. Hereinafter, the electronic component will be described on the premise of a flexible display. As the flexible display, for example, an organic EL (Electroluminescence) display, a liquid crystal display, or the like is present. The component manufacturing system 10 has a so-called Roll To Roll type structure in which a flexible sheet-like (film-like) substrate (sheet substrate) P is wound into a roll. The substrate P is fed out from the supply tray, and various processes are continuously performed on the substrate P to be fed, and then the processed substrates P are taken up by a recovery roll (not shown). The substrate P has a strip shape in which the moving direction of the substrate P is a longitudinal direction (long strip) and a width direction is a short side direction (short strip). The substrate P transported from the supply roll is sequentially subjected to various processes by the processing device PR1, the exposure device (pattern drawing device, beam scanning device) EX, and the processing device PR2, and is taken up by the recovery roll.
另外，X方向係於水平面內從處理裝置PR1經由曝光裝置EX朝向處理裝置PR2之方向(搬送方向)。Y方向係於水平面內與X方向正交之方向，且係基板P的寬度方向。Z方向係與X方向及Y方向正交之方向(上方向)，且與重力作用方向平行。 Further, the X direction is a direction (transport direction) from the processing device PR1 to the processing device PR2 via the exposure device EX in the horizontal plane. The Y direction is a direction orthogonal to the X direction in the horizontal plane, and is a width direction of the substrate P. The Z direction is a direction orthogonal to the X direction and the Y direction (upward direction) and is parallel to the direction of gravity action.
基板P例如可使用樹脂膜、或者由不銹鋼等金屬或合金構成之箔(foil)等。作為樹脂膜之材質，亦可使用例如包含有聚乙烯樹脂、聚丙烯樹脂、聚酯樹脂、乙烯乙烯醇共聚物樹脂、聚氯乙烯樹脂、纖維素樹脂、聚醯胺樹脂、聚醯亞胺樹脂、聚碳酸酯樹脂、聚苯乙烯樹脂及乙酸乙烯酯樹脂中的至少一種以上者。又，基板P的厚度或剛性(楊氏模量)只要處於如下範圍即可，該範圍係指於通過曝光裝置EX的搬送路徑時，不會使基板P產生由壓彎引起之折痕或不可逆之皺褶之範圍。作為基板P之母材，厚度為25μm~200μm左右之PET(Polyethylene terephthalate，聚對苯二甲酸乙二酯)或PEN(Polyethylene naphthalate，聚萘二甲酸乙二酯)等之膜為較佳之片材基板之典型。 As the substrate P, for example, a resin film or a foil made of a metal or an alloy such as stainless steel can be used. As a material of the resin film, for example, a polyethylene resin, a polypropylene resin, a polyester resin, an ethylene vinyl alcohol copolymer resin, a polyvinyl chloride resin, a cellulose resin, a polyamide resin, or a polyimide resin may be used. At least one of a polycarbonate resin, a polystyrene resin, and a vinyl acetate resin. Further, the thickness or rigidity (Young's modulus) of the substrate P may be in the range of not to cause the substrate P to be creased or irreversible due to press bending when passing through the transport path of the exposure apparatus EX. The range of wrinkles. As a base material of the substrate P, a film of PET (Polyethylene terephthalate) or PEN (Polyethylene naphthalate) having a thickness of about 25 μm to 200 μm is a preferable sheet. Typical of the substrate.
基板P有時會有在由處理裝置PR1、曝光裝置EX及處理裝置PR2實施之各處理中受熱的情形，因此，較佳為選定熱膨脹係數明顯不大之材質之基板P。例如，能夠藉由將無機填料混合於樹脂膜而抑制熱膨脹係數。無機填料例如亦可為氧化鈦、氧化鋅、氧化鋁或氧化矽等。又，基板P可為利用浮式法等製造出之厚度為100μm左右之極薄玻璃的單層體，亦可為將上述樹脂膜、箔等貼合於該極薄玻璃而成之積層體。 The substrate P may be heated in each of the processes performed by the processing device PR1, the exposure device EX, and the processing device PR2. Therefore, it is preferable to select the substrate P of a material having a significantly small thermal expansion coefficient. For example, the coefficient of thermal expansion can be suppressed by mixing an inorganic filler with a resin film. The inorganic filler may be, for example, titanium oxide, zinc oxide, aluminum oxide or cerium oxide. In addition, the substrate P may be a single layer body of an extremely thin glass having a thickness of about 100 μm which is produced by a floating method or the like, or a laminate in which the resin film, the foil, or the like is bonded to the extremely thin glass.
而且，基板P之可撓性(flexibility)係指即使對基板P施加自重(本身的重量)程度之力，亦不會使其折斷或斷裂而能彎曲該基板P的性 質。又，因自重程度之力而彎曲之性質亦包含於可撓性。又，可撓性之程度會根據基板P的材質、大小、厚度、基板P上所形成之層構造、溫度、濕度等環境而改變。總之，只要在將基板P正確地捲繞於本第1實施形態之元件製造系統10內的搬送路徑中所設置之各種搬送用輥、旋轉筒等搬送方向轉換用之構件時，能夠順暢地搬送基板P而不會將其壓彎而產生折痕或導致破損(裂開或劃傷)，則可謂處於可撓性之範圍。 Further, the flexibility of the substrate P means the ability to bend the substrate P without breaking or breaking it even if the substrate P is subjected to a self-weight (its own weight). quality. Moreover, the property of bending due to the force of the degree of self-weight is also included in the flexibility. Further, the degree of flexibility varies depending on the material, size, thickness of the substrate P, the layer structure formed on the substrate P, temperature, humidity, and the like. In other words, when the substrate P is accurately wound around the transporting direction, such as various transport rollers and rotating cylinders, which are provided in the transport path in the component manufacturing system 10 of the first embodiment, it can be smoothly transported. The substrate P can be said to be in a range of flexibility without bending it to cause creases or causing breakage (cracking or scratching).
處理裝置PR1對由曝光裝置EX進行曝光處理之基板P進行前步驟處理。處理裝置PR1往曝光裝置EX輸送已進行前步驟處理之基板P。藉由該前步驟處理，往曝光裝置EX輸送之基板P為表面形成有感光性功能層(光感應層、感光層)之基板(感光基板)P。 The processing device PR1 performs a pre-step process on the substrate P subjected to the exposure processing by the exposure device EX. The processing device PR1 transports the substrate P that has been subjected to the previous step processing to the exposure device EX. By the pre-processing, the substrate P transported to the exposure apparatus EX is a substrate (photosensitive substrate) P on which a photosensitive functional layer (photosensitive layer, photosensitive layer) is formed.
該感光性功能層，係作為溶液而塗布於基板P上，並藉由進行乾燥而成為層(膜)。典型之感光性功能層為光阻，但作為無需顯影處理之材料，存在有將受紫外線照射後之部分的親液疏液性改質之感光性矽烷耦合劑(SAM)、或使受到紫外線照射後之部分顯露出鍍敷還原基之感光性還原劑等。於使用感光性矽烷耦合劑作為感光性功能層之情形時，基板P上的由紫外線曝光後之圖案部分從疏液性改質為親液性。因此，選擇含有導電性墨水(含有銀或銅等導電性奈米粒子之墨水)或半導體材料之液體等並將其塗布於已成為親液性之部分上，藉此能夠形成成為構成薄膜電晶體(TFT)等之電極、半導體、絕緣或連接用之配線的圖案層。於使用感光性還原劑作為感光性功能層之情形時，於基板P上的以紫外線曝光後之圖案部分顯露出鍍敷還原基。因此，於曝光之後，立即將基板P於包含鈀離子等之鍍敷液中浸漬固定時間，藉此形成(析出)鈀之圖案層。此種鍍敷處理為附加 (additive)製程，此外，於以作為消去(subtractive)製程之蝕刻處理為前提之情形時，往曝光裝置EX輸送之基板P亦可為如下基板，係將母材設為PET或PEN，於其表面完全或選擇性地蒸鍍鋁(Al)或銅(Cu)等的金屬性薄膜，進一步於該金屬性薄膜上積層(層疊)光阻層而成者。 The photosensitive functional layer is applied onto the substrate P as a solution, and is dried to form a layer (film). A typical photosensitive functional layer is a photoresist, but as a material that does not require development treatment, there is a photosensitive decane coupling agent (SAM) which is modified by lyophilic liquid repellency after irradiation with ultraviolet rays, or is exposed to ultraviolet rays. The latter part reveals a photosensitive reducing agent such as a plating reduction group. When a photosensitive decane coupling agent is used as the photosensitive functional layer, the pattern portion exposed to ultraviolet rays on the substrate P is modified from lyophobic to lyophilic. Therefore, a liquid or the like containing a conductive ink (ink containing conductive nanoparticles such as silver or copper) or a semiconductor material is selected and applied to a portion which is lyophilic, whereby a thin film transistor can be formed. A pattern layer of an electrode, a semiconductor, an insulating or a wiring for connection such as (TFT). In the case where a photosensitive reducing agent is used as the photosensitive functional layer, the plated reduction group is exposed on the pattern portion of the substrate P exposed to ultraviolet rays. Therefore, immediately after the exposure, the substrate P is immersed in a plating solution containing palladium ions or the like for a fixed period of time to form (precipitate) a pattern layer of palladium. This plating treatment is attached (additive) process, in addition to the premise of the etching process as a subtractive process, the substrate P transported to the exposure apparatus EX may be a substrate in which the base material is made of PET or PEN. The surface is completely or selectively vapor-deposited with a metallic thin film such as aluminum (Al) or copper (Cu), and a photoresist layer is further laminated (laminated) on the metallic thin film.
於本第1實施形態中，曝光裝置EX為不使用光罩之直描方式的曝光裝置，即所謂之光柵掃描(raster scan)方式的曝光裝置。曝光裝置EX對從處理裝置PR1供給來之基板P的被照射面(感光面)照射與顯示器用的電路或配線等既定圖案相對應之光圖案。雖於以下將詳細地進行說明，但曝光裝置EX係一邊往+X方向(副掃描方向)搬送基板P、一邊於基板P上(基板P的被照射面上)沿著既定之掃描方向(Y方向)一維地掃描(主掃描)曝光用光束LB的光點SP，且根據圖案資料(描繪資料)而高速地對光點SP之強度進行調變(導通/斷開)。藉此，於基板P的被照射面曝光描繪與顯示器用的電路或配線等既定圖案相對應之光圖案。也就是，利用基板P之副掃描與光點SP之主掃描，於基板P的被照射面上相對地二維掃描光點SP，從而於基板P曝光描繪既定圖案。又，曝光裝置EX對基板P反復進行電子元件用的圖案曝光，且基板P沿著搬送方向(+X方向)被搬送，因此，沿著基板P的長條方向隔開既定間隔地設置複數個藉由曝光裝置EX曝光圖案之曝光區域W(參照圖2)。由於在該曝光區域W形成電子元件，因此曝光區域W亦為電子元件形成區域。另外，電子元件係由複數個圖案層(形成有圖案之層)重疊而構成，因此藉由曝光裝置EX曝光對應各層之圖案。 In the first embodiment, the exposure apparatus EX is an exposure apparatus that does not use a direct mask type of a photomask, that is, a so-called raster scan type exposure apparatus. The exposure apparatus EX irradiates the illuminated surface (photosensitive surface) of the substrate P supplied from the processing apparatus PR1 with a light pattern corresponding to a predetermined pattern such as a circuit or a wiring for display. In the following description, the exposure apparatus EX transports the substrate P in the +X direction (sub-scanning direction) on the substrate P (the irradiated surface of the substrate P) along the predetermined scanning direction (Y). The direction is to scan (mainly scan) the spot SP of the exposure light beam LB one-dimensionally, and to adjust the intensity (on/off) of the spot SP at a high speed in accordance with the pattern data (drawing data). Thereby, a light pattern corresponding to a predetermined pattern such as a circuit or a wiring for display is exposed on the illuminated surface of the substrate P. That is, the sub-scan of the substrate P and the main scanning of the spot SP are used to scan the spot SP two-dimensionally on the illuminated surface of the substrate P, thereby exposing and drawing a predetermined pattern on the substrate P. Further, the exposure apparatus EX repeatedly exposes the pattern of the electronic component to the substrate P, and the substrate P is transported in the transport direction (+X direction). Therefore, a plurality of spacers are arranged at predetermined intervals along the longitudinal direction of the substrate P. The exposed area W of the pattern is exposed by the exposure device EX (refer to FIG. 2). Since the electronic component is formed in the exposed region W, the exposed region W is also an electronic component forming region. Further, since the electronic component is formed by overlapping a plurality of pattern layers (layers in which the pattern is formed), the pattern corresponding to each layer is exposed by the exposure device EX.
處理裝置PR2對已由曝光裝置EX進行曝光處理之基板P進行後步驟處理(例如鍍敷處理或顯影、蝕刻處理等)。藉由該後步驟處理，於 基板P上形成元件之圖案層。 The processing device PR2 performs post-step processing (for example, plating treatment or development, etching treatment, etc.) on the substrate P that has been subjected to exposure processing by the exposure device EX. By the subsequent step processing, A pattern layer of elements is formed on the substrate P.
如上所述，電子元件係藉由重疊複數個圖案層而構成，因此經由元件製造系統10的至少各處理，生成一個圖案層。因此，為了生成電子元件，必須至少兩次經過如圖1所示之元件製造系統10的各處理。因此，藉由將捲取有基板P之回收捲作為供給捲而安裝於其他元件製造系統10，能夠積層圖案層。反復地進行如上所述之動作，以形成電子元件。因此，處理後之基板P處於複數個電子元件隔開既定間隔並沿著基板P的長條方向相連之狀態。也就是，基板P成為多倒角用之基板。 As described above, since the electronic component is configured by stacking a plurality of pattern layers, one pattern layer is formed via at least each processing of the component manufacturing system 10. Therefore, in order to generate an electronic component, it is necessary to pass through the processes of the component manufacturing system 10 as shown in FIG. 1 at least twice. Therefore, by attaching the recovered roll in which the substrate P is wound up as a supply roll to the other component manufacturing system 10, the pattern layer can be laminated. The above-described operations are repeatedly performed to form an electronic component. Therefore, the processed substrate P is in a state in which a plurality of electronic components are spaced apart from each other by a predetermined interval and along the strip direction of the substrate P. That is, the substrate P becomes a substrate for multi-chamfering.
將在電子元件相連之狀態下形成之基板P回收而成之回收捲，亦可安裝於未圖示之切割裝置。安裝有回收捲之切割裝置，就每一電子元件對處理後之基板P進行分割(切割(singulation))，藉此形成複數個成為單片之電子元件。關於基板P的尺寸，例如寬度方向(短條方向)之尺寸為10cm~2m左右，長度方向(長條方向)之尺寸為10m以上。另外，基板P的尺寸並不限定於上述尺寸。 The recovery roll obtained by collecting the substrate P formed in a state in which the electronic components are connected to each other may be attached to a cutting device (not shown). A cutting device equipped with a recovery roll divides (singulation) the processed substrate P for each electronic component, thereby forming a plurality of electronic components that become a single chip. The size of the substrate P is, for example, about 10 cm to 2 m in the width direction (strip direction) and 10 m or more in the longitudinal direction (long direction). Further, the size of the substrate P is not limited to the above size.
其次，詳細地對曝光裝置EX進行說明。曝光裝置EX儲存於溫控室ECV內。該溫控室ECV藉由將內部保持於既定溫度、既定濕度，抑制在內部搬送之基板P因溫度所引起之形狀變化，並且設定為考慮了基板P的吸濕性或帶有伴隨搬送而產生之靜電等之濕度。溫控室ECV透過被動或主動之防振單元SU1、SU2而配置於製造工場之設置面E。防振單元SU1、SU2減少來自設置面E之振動。該設置面E可為專門鋪設於工場地面上之設置基座(台座)上的面，亦可為地面。曝光裝置EX至少具備基板搬送機構12、光源裝置14、曝光頭16、控制裝置18及對準顯微鏡AMa(AMa1 ~AMa4)、AMb(AMb1~AMb4)。 Next, the exposure apparatus EX will be described in detail. The exposure device EX is stored in the temperature control chamber ECV. The temperature control chamber ECV maintains the internal temperature at a predetermined temperature and a predetermined humidity, and suppresses the shape change caused by the temperature of the substrate P transported inside, and is set to take into consideration the hygroscopicity of the substrate P or the accompanying transfer. The humidity of static electricity, etc. The temperature control room ECV is disposed on the installation surface E of the manufacturing plant through the passive or active vibration isolating units SU1 and SU2. The vibration isolating units SU1, SU2 reduce the vibration from the setting surface E. The setting surface E may be a surface specially laid on the base (the pedestal) on the surface of the work site, or may be the ground. The exposure apparatus EX includes at least a substrate transport mechanism 12, a light source device 14, an exposure head 16, a control device 18, and an alignment microscope AMa (AMa1). ~AMa4), AMb (AMb1~AMb4).
基板搬送機構12，以既定速度將從處理裝置PR1搬送來之基板P搬送至處理裝置PR2。藉由該基板搬送機構12規定於曝光裝置EX內搬送之基板P的搬送路徑。基板搬送機構12從基板P的搬送方向的上游側(-X方向側)，依序具有邊緣位置控制器EPC、驅動輥R1、張力調整輥RT1、旋轉筒(圓筒滾筒台)DR1、張力調整輥RT2、旋轉筒(圓筒滾筒台)DR2、張力調整輥RT3及驅動輥R2。 The substrate transport mechanism 12 transports the substrate P transported from the processing device PR1 to the processing device PR2 at a predetermined speed. The substrate transport mechanism 12 defines a transport path of the substrate P transported in the exposure apparatus EX. The substrate transfer mechanism 12 has an edge position controller EPC, a drive roller R1, a tension adjustment roller RT1, a rotary cylinder (cylinder roller table) DR1, and tension adjustment from the upstream side (the -X direction side) of the substrate P in the transport direction. Roller RT2, a rotating cylinder (cylinder roller table) DR2, a tension adjusting roller RT3, and a driving roller R2.
邊緣位置控制器EPC調整從處理裝置PR1搬送來之基板P之寬度方向(Y方向即基板P的短條方向)位置。也就是，邊緣位置控制器EPC以使於施加有既定張力之狀態下搬送之基板P的寬度方向端部(邊緣)之位置相對於目標位置處於±十數μm~數十μm左右之範圍(允許範圍)之方式，使基板P於寬度方向移動，調整基板P之寬度方向位置。邊緣位置控制器EPC，具有以施加有既定張力之狀態掛設基板P之輥、以及對基板P的寬度方向端部(邊緣)之位置進行檢測的未圖示之邊緣感測器(端部檢測部)。邊緣位置控制器EPC，基於上述邊緣感測器所檢測出之檢測訊號，使邊緣位置控制器EPC的上述輥於Y方向移動，調整基板P之寬度方向位置。驅動輥(軋輥)R1，一邊保持從邊緣位置控制器EPC搬送來之基板P的表背兩面、一邊進行旋轉，將基板P朝向旋轉筒DR1搬送。邊緣位置控制器EPC，以使搬送往旋轉筒DR1之基板P的長條方向與旋轉筒DR1的中心軸AXo1正交之方式，對基板P之寬度方向位置進行調整。將從驅動輥R1搬送來之基板P掛設於張力調整輥RT1之後，導引至旋轉筒DR1。 The edge position controller EPC adjusts the position of the substrate P conveyed from the processing device PR1 in the width direction (the Y direction, that is, the short direction of the substrate P). In other words, the edge position controller EPC is in the range of ±10 μm to several tens of μm with respect to the target position with respect to the target position in the width direction end portion (edge) of the substrate P conveyed in a state where a predetermined tension is applied. In the range), the substrate P is moved in the width direction, and the position in the width direction of the substrate P is adjusted. The edge position controller EPC has a roller that mounts the substrate P in a state where a predetermined tension is applied, and an edge sensor (not shown) that detects the position of the end portion (edge) of the substrate P in the width direction (end detection) unit). The edge position controller EPC moves the roller of the edge position controller EPC in the Y direction based on the detection signal detected by the edge sensor to adjust the position of the substrate P in the width direction. The driving roller (roller) R1 rotates while holding the front and back surfaces of the substrate P conveyed from the edge position controller EPC, and conveys the substrate P toward the rotating cylinder DR1. The edge position controller EPC adjusts the position of the substrate P in the width direction so that the longitudinal direction of the substrate P conveyed to the rotating cylinder DR1 is orthogonal to the central axis AXo1 of the rotating cylinder DR1. The substrate P conveyed from the driving roller R1 is hung on the tension adjusting roller RT1, and then guided to the rotating cylinder DR1.
旋轉筒(第1旋轉筒)DR1，具有沿Y方向延伸並且沿著與重 力作用方向交叉之方向延伸之中心軸(第1中心軸)AXo1、以及與中心軸AXo1相距固定半徑之圓筒狀的外周面。旋轉筒DR1使基板P的一部分效仿(模仿)其外周面(圓周面)而沿著長條方向呈圓筒面狀地彎曲並支承，並且以中心軸AXo1為中心進行旋轉而將基板P往+X方向搬送。旋轉筒DR1於重力作用方向側的相反側(+Z方向側)，從形成有感光面之面的相反側之面(背面)側支承基板P。旋轉筒DR1利用其圓周面，支承供來自後述之曝光頭16之描繪單元U1、U2、U5、U6的各者之光束的光點投射之基板P上的區域(部分)。於旋轉筒DR1的Y方向的兩側設有以旋轉筒DR1繞中心軸AXo1旋轉之方式由環狀之軸承支承之軸Sft1。該軸Sft1藉由施加來自受控制裝置18控制之未圖示之旋轉驅動源(例如馬達或減速機構等)之轉矩而繞中心軸AXo1旋轉。另外，為方便起見，將包含中心軸AXo1且與YZ平面平行之平面稱為中心面Poc1。 Rotating cylinder (first rotating cylinder) DR1 has an extension in the Y direction and along the weight A central axis (first central axis) AXo1 extending in a direction in which the force directions intersect, and a cylindrical outer peripheral surface having a fixed radius from the central axis AXo1. The rotating cylinder DR1 bends and supports a part of the substrate P in a cylindrical shape along the longitudinal direction of the outer peripheral surface (circumferential surface), and rotates around the central axis AXo1 to push the substrate P to the + Transfer in the X direction. The rotating cylinder DR1 supports the substrate P on the opposite side (+Z direction side) from the side on which the light is applied, from the side (back surface) side opposite to the surface on which the photosensitive surface is formed. The rotating cylinder DR1 supports a region (portion) on the substrate P on which the spot of the light beam from each of the drawing units U1, U2, U5, and U6 of the exposure head 16 to be described later is projected by the circumferential surface. A shaft Sft1 supported by an annular bearing so that the rotary cylinder DR1 rotates about the central axis AXo1 is provided on both sides of the rotary cylinder DR1 in the Y direction. The shaft Sft1 is rotated about the central axis AXo1 by applying a torque from a rotary drive source (for example, a motor or a speed reduction mechanism or the like) (not shown) controlled by the controlled device 18. Further, for the sake of convenience, a plane including the central axis AXo1 and parallel to the YZ plane is referred to as a central plane Poc1.
從旋轉筒DR1搬出之基板P，在掛設於張力調整輥RT2之後，被導引至設置在較旋轉筒DR1更下游側(+X方向側)之旋轉筒DR2。旋轉筒(第2旋轉筒)DR2具有與旋轉筒DR1相同之構成。也就是，旋轉筒DR2具有沿Y方向延伸並且沿著與重力作用方向交叉之方向延伸之中心軸(第2中心軸)AXo2、以及與中心軸AXo2相距固定半徑之圓筒狀的外周面。旋轉筒DR2，使基板P的一部分效仿其外周面(圓周面)而於長條方向呈圓筒面狀地彎曲並支承，並且以中心軸AXo2為中心而旋轉以將基板P往+X方向搬送。旋轉筒DR2於重力作用方向側的相反側(+Z方向側)，從背面側支承基板P。旋轉筒DR2利用其圓周面，支承供來自後述之曝光頭16之描繪單元U3、U4的各者之描繪用之光束的光點投射之基板P上的區域(部分)。於旋 轉筒DR2亦設置有軸Sft2。該軸Sft2藉由施加來自受控制裝置18控制之未圖示之旋轉驅動源(例如馬達或減速機構等)之轉矩而繞中心軸AXo2旋轉。旋轉筒DR1的中心軸AXo1與旋轉筒DR2的中心軸AXo2處於平行狀態。另外，為方便起見，將包含中心軸AXo2且與YZ平面平行之平面稱為中心面Poc2。 The substrate P carried out from the rotating drum DR1 is guided to the rotating drum DR2 provided on the downstream side (+X direction side) of the rotating cylinder DR1 after being hung on the tension adjusting roller RT2. The rotating cylinder (second rotating cylinder) DR2 has the same configuration as the rotating cylinder DR1. That is, the rotating cylinder DR2 has a central axis (second central axis) AXo2 extending in the Y direction and extending in a direction intersecting the direction of gravity action, and a cylindrical outer peripheral surface having a fixed radius from the central axis AXo2. In the rotating cylinder DR2, a part of the substrate P is curved and supported in a cylindrical shape in the longitudinal direction, and is rotated around the central axis AXo2 to transport the substrate P in the +X direction. . The rotating cylinder DR2 supports the substrate P from the back side on the side opposite to the side in the direction of gravity action (+Z direction side). The rotating cylinder DR2 supports a region (portion) on the substrate P on which the light beam for drawing from each of the drawing units U3 and U4 of the exposure head 16 to be described later is projected by the circumferential surface. Yu Xuan The drum DR2 is also provided with an axis Sft2. The shaft Sft2 is rotated about the central axis AXo2 by applying a torque from a rotary drive source (for example, a motor or a speed reduction mechanism or the like) (not shown) controlled by the controlled device 18. The central axis AXo1 of the rotating cylinder DR1 is in a parallel state with the central axis AXo2 of the rotating cylinder DR2. Further, for the sake of convenience, a plane including the central axis AXo2 and parallel to the YZ plane is referred to as a central plane Poc2.
從旋轉筒DR2搬出之基板P，在掛設於張力調整輥RT2之後，被導引至驅動輥R2。驅動輥(軋輥)R2與驅動輥R1同樣地，一邊保持基板P之表背兩面、一邊進行旋轉，將基板P往處理裝置PR2搬送。張力調整輥RT1~張力調整輥RT3，往-Z方向彈壓，沿著長條方向對捲繞支承於旋轉筒DR1、DR2之基板P施加既定張力。藉此，使對掛設於旋轉筒DR1、DR2之基板P賦予之長條方向之張力穩定於既定範圍內。另外，控制裝置18藉由對未圖示之旋轉驅動源(例如馬達或減速機構等)進行控制，使驅動輥R1、R2旋轉。 The substrate P carried out from the rotating drum DR2 is guided to the driving roller R2 after being hung on the tension adjusting roller RT2. Similarly to the driving roller R1, the driving roller (roller) R2 rotates while holding both front and back sides of the substrate P, and transports the substrate P to the processing apparatus PR2. The tension adjusting roller RT1 to the tension adjusting roller RT3 are biased in the -Z direction, and apply a predetermined tension to the substrate P that is wound and supported by the rotating cylinders DR1, DR2 along the longitudinal direction. Thereby, the tension in the longitudinal direction given to the substrate P attached to the rotating cylinders DR1 and DR2 is stabilized within a predetermined range. Moreover, the control device 18 rotates the drive rollers R1 and R2 by controlling a rotation drive source (for example, a motor or a speed reduction mechanism) (not shown).
光源裝置14具有光源(脈衝光源)，且對描繪單元U1~描繪單元U6各者射出脈衝狀之光束(脈衝光、雷射)LB。該光束LB係於370nm以下之波長帶中具有峰值波長之紫外光，將光束LB之發光頻率設為Fs。光源裝置14根據控制裝置18之控制，以發光頻率Fs發光射出光束LB。 The light source device 14 has a light source (pulse light source), and emits a pulsed light beam (pulse light, laser) LB to each of the drawing unit U1 to the drawing unit U6. The light beam LB is ultraviolet light having a peak wavelength in a wavelength band of 370 nm or less, and the light emission frequency of the light beam LB is Fs. The light source device 14 emits light beam LB at a light-emitting frequency Fs according to control of the control device 18.
曝光頭16具備來自光源裝置14之光束LB所分別射入之複數個描繪單元U(U1~U6)。曝光頭16藉由複數個描繪單元U(U1~U6)，對由旋轉筒DR1、DR2的圓周面支承之基板P的一部分描繪圖案。曝光頭16藉由具有構成相同之複數個描繪單元U(U1~U6)，而成為所謂之多光束型曝光頭。描繪單元U1、U5、U2、U6設置於旋轉筒DR1的上方，描繪單元U3、 U4設置於旋轉筒DR2的上方。描繪單元U1、U5相對於中心面Poc1配置於基板P的搬送方向的上游側(-X方向側)，且沿Y方向隔開既定間隔地配置。描繪單元U2、U6相對於中心面Poc1配置於基板P的搬送方向的下游側(+X方向側)，且沿Y方向隔開既定間隔地配置。又，描繪單元U3相對於中心面Poc2配置於基板P的搬送方向的上游側(-X方向側)。描繪單元U4相對於中心面Poc2配置於基板P的搬送方向的下游側(+X方向側)。描繪單元U1、U5與描繪單元U2、U6相對於中心面Poc1對稱地設置，描繪單元U3與描繪單元U4相對於中心面Poc2對稱地設置。 The exposure head 16 includes a plurality of drawing units U (U1 to U6) into which the light beams LB from the light source device 14 are respectively incident. The exposure head 16 draws a pattern on a part of the substrate P supported by the circumferential surfaces of the rotating cylinders DR1, DR2 by a plurality of drawing units U (U1 to U6). The exposure head 16 is a so-called multi-beam type exposure head by having a plurality of drawing units U (U1 to U6) having the same configuration. The drawing units U1, U5, U2, U6 are disposed above the rotating cylinder DR1, and the drawing unit U3, U4 is disposed above the rotating cylinder DR2. The drawing units U1 and U5 are disposed on the upstream side (the −X direction side) of the transport direction of the substrate P with respect to the center plane Poc1, and are arranged at predetermined intervals in the Y direction. The drawing units U2 and U6 are disposed on the downstream side (+X direction side) of the substrate P in the transport direction with respect to the center plane Poc1, and are arranged at predetermined intervals in the Y direction. Moreover, the drawing unit U3 is disposed on the upstream side (the −X direction side) of the transport direction of the substrate P with respect to the center plane Poc2. The drawing unit U4 is disposed on the downstream side (+X direction side) of the substrate P in the transport direction with respect to the center plane Poc2. The drawing units U1, U5 and the drawing units U2, U6 are symmetrically arranged with respect to the center plane Poc1, and the drawing unit U3 and the drawing unit U4 are symmetrically arranged with respect to the center plane Poc2.
各描繪單元U(U1~U6)，使來自光源裝置14之兩條光束LB分別於基板P的被照射面上收斂並投射於基板P的被照射面(感光面)，且沿著既定之兩條描繪線(掃描線)SLa、SLb一維地掃描已於基板P的被照射面上收斂之兩個光點SP。雖於以下將詳細地說明該描繪單元U的構成，但對於本第1實施形態而言，在一個描繪單元U中設置有一個旋轉多面鏡(光束偏向器、光偏向構件)與兩個fθ透鏡系統(掃描光學系統)，一個描繪單元U(U1~U6)於基板P上的不同之兩處分別形成光點SP產生之掃描線。因此，兩條光束LB從光源裝置14被輸送至各描繪單元U之各者。另外，來自光源裝置14之光束LB，透過光束分配系統而分支成複數條光束LB，成為兩條光束LB而射入至各描繪單元U(U1~U6)之各者，上述光束分配系統係藉由未圖示之反射鏡及光束分光器等構成。 Each of the drawing units U (U1 to U6) causes the two light beams LB from the light source device 14 to converge on the illuminated surface of the substrate P and project on the illuminated surface (photosensitive surface) of the substrate P, and along the predetermined two The strip drawing lines (scanning lines) SLa and SLb scan the two spots SP that have converge on the illuminated surface of the substrate P in one dimension. Although the configuration of the drawing unit U will be described in detail below, in the first embodiment, one rotating polygon mirror (beam deflector, light deflecting member) and two fθ lenses are provided in one drawing unit U. In the system (scanning optical system), one drawing unit U (U1 to U6) forms a scanning line generated by the spot SP on two different places on the substrate P. Therefore, the two light beams LB are sent from the light source device 14 to each of the drawing units U. Further, the light beam LB from the light source device 14 is branched into a plurality of light beams LB through the beam distribution system, and is incident on each of the drawing units U (U1 to U6) by the two light beams LB, and the light beam distribution system is used. It consists of a mirror, a beam splitter, etc. which are not shown.
各描繪單元U(U1~U6)，於XZ平面中，以使兩條光束LB朝向旋轉筒DR1的中心軸AXo1或旋轉筒DR2的中心軸AXo2前進之方式，朝向基板P照射兩條光束LB。藉此，從各描繪單元U(U1~U6)朝向基板P 上的兩條描繪線SLa、SLb前進之兩條光束LB的光路(光束中心軸)，於XZ平面中，與基板P的被照射面的法線平行。於本第1實施形態中，從描繪單元U1、U5朝向旋轉筒DR1前進之光束LB的光路(光束中心軸)，係以使相對於中心面Poc1之角度成為-θ1之方式設定。從描繪單元U2、U6朝向旋轉筒DR2前進之光束LB的光路(光束中心軸)，係以使相對於中心面Poc1之角度成為+θ1之方式設定。又，從描繪單元U3朝向旋轉筒DR2前進之光束LB的光路(光束中心軸)，係以使相對於中心面Poc2之角度成為-θ1之方式設定。從描繪單元U4朝向旋轉筒DR2前進之光束LB的光路(光束中心軸)，係以使相對於中心面Poc2之角度成為+θ1之方式設定。又，各描繪單元U(U1~U6)，以使照射於兩條描繪線SLa、SLb之光束LB在與YZ平面平行之面內相對於基板P的被照射面垂直之方式，朝向基板P照射光束LB。亦即，於被照射面上之光點SP的主掃描方向上，投射於基板P的光束LB以遠心(telecentric)狀態掃描。 Each drawing unit U (U1 to U6) irradiates the substrate P with two light beams LB so that the two light beams LB advance toward the central axis AXo1 of the rotating cylinder DR1 or the central axis AXo2 of the rotating cylinder DR2 in the XZ plane. Thereby, from each drawing unit U (U1~U6) toward the substrate P The upper two optical lines (beam center axis) of the two light beams LB that are drawn by the lines SLa and SLb are parallel to the normal to the illuminated surface of the substrate P in the XZ plane. In the first embodiment, the optical path (beam center axis) of the light beam LB that is advanced from the drawing units U1 and U5 toward the rotating cylinder DR1 is set such that the angle with respect to the center plane Poc1 is -θ1. The optical path (beam center axis) of the light beam LB that is advanced from the drawing units U2 and U6 toward the rotating cylinder DR2 is set such that the angle with respect to the center plane Poc1 is +θ1. Moreover, the optical path (beam center axis) of the light beam LB which advances from the drawing unit U3 toward the rotating cylinder DR2 is set so that the angle with respect to the center surface Poc2 may be - (theta). The optical path (beam center axis) of the light beam LB that is advanced from the drawing unit U4 toward the rotating cylinder DR2 is set such that the angle with respect to the center plane Poc2 is +θ1. Further, each drawing unit U (U1 to U6) irradiates the substrate P so that the light beam LB irradiated on the two drawing lines SLa and SLb is perpendicular to the illuminated surface of the substrate P in a plane parallel to the YZ plane. Beam LB. That is, the light beam LB projected on the substrate P is scanned in a telecentric state in the main scanning direction of the spot SP on the illuminated surface.
如圖2所示，複數個描繪單元U(U1~U6)係以既定之配置關係配置。各描繪單元U(U1~U6)的兩條描繪線SLa、SLb沿著主掃描方向即Y方向延伸，於基板P的被照射面上處於副掃描方向(X方向)上之相同位置，且於主掃描方向(Y方向)錯開地配置。也就是，各描繪單元U(U1~U6)的描繪線SLa、SLb，以平行狀態僅於主掃描方向(Y方向)上分隔地配置。又，描繪線SLa、SLb的掃描長度(長度)被設定為相同長度，並且描繪線SLa與描繪線SLb被設定為在主掃描方向上以掃描長度以下之間隔分隔。 As shown in FIG. 2, a plurality of drawing units U (U1 to U6) are arranged in a predetermined arrangement relationship. The two drawing lines SLa and SLb of each drawing unit U (U1 to U6) extend in the Y direction, which is the main scanning direction, and are in the same position in the sub-scanning direction (X direction) on the illuminated surface of the substrate P, and The main scanning direction (Y direction) is shifted. That is, the drawing lines SLa and SLb of the drawing units U (U1 to U6) are arranged in a parallel state only in the main scanning direction (Y direction). Moreover, the scanning lengths (lengths) of the drawing lines SLa and SLb are set to the same length, and the drawing line SLa and the drawing line SLb are set to be spaced apart by the scanning length or less in the main scanning direction.
複數個描繪單元U(U1~U6)，配置成複數個描繪單元U(U1~U6)的描繪線SLa、SLb如圖2所示，在Y方向(基板P的寬度方向、主掃 描方向)上相接而不彼此分離。各描繪單元U(U1~U6)可繞旋動中心軸AXr，例如於±1.5度之範圍內，以μrad之解析度而微小旋動，以對XY面內之描繪線(掃描線)SLa、SLb的斜度進行調整。該旋動中心軸AXr係相對於基板P垂直地通過連接描繪線(第1掃描線)SLa之中點與描繪線(第2掃描線)SLb之中點的線段之中心點(中點)之軸。該軸之延長線，與圖1中的旋轉筒DR1的中心軸AXo1或旋轉筒DR2的中心軸AXo2交叉。另外，於第1實施形態中，各描繪單元U(U1~U6)的描繪線SLa與描繪線SLb，於副掃描方向上為相同位置，且於主掃描方向上彼此分隔，因此，旋動中心軸AXr配置於通過描繪線SLa、SLb之直線上，且配置於描繪線SLa與描繪線SLb之間隙的中心點。 A plurality of drawing units U (U1 to U6), and drawing lines SLa and SLb arranged in a plurality of drawing units U (U1 to U6) are in the Y direction (width direction of the substrate P, main scanning) as shown in Fig. 2 The drawing directions are connected without being separated from each other. Each drawing unit U (U1 to U6) is rotatable around the central axis AXr, for example, within a range of ±1.5 degrees, and is slightly rotated by a resolution of μrad to draw a line (scanning line) SLa in the XY plane. The slope of the SLb is adjusted. The rotation center axis AXr is perpendicularly connected to the center point (mid point) of the line segment connecting the point between the drawing line (first scanning line) SLa and the drawing line (second scanning line) SLb with respect to the substrate P. axis. The extension line of the shaft intersects with the central axis AXo1 of the rotating cylinder DR1 in FIG. 1 or the central axis AXo2 of the rotating cylinder DR2. Further, in the first embodiment, the drawing line SLa and the drawing line SLb of the drawing units U (U1 to U6) are at the same position in the sub-scanning direction and are separated from each other in the main scanning direction, and therefore, the center is rotated. The axis AXr is disposed on a straight line passing through the drawing lines SLa and SLb, and is disposed at a center point of the gap between the drawing line SLa and the drawing line SLb.
若描繪單元U(U1~U6)繞旋動中心軸AXr稍微旋動(旋轉)，則掃描光束LB的光點SP之描繪線SLa、SLb亦會相應地以旋動中心軸AXr為中心而旋動(旋轉)。藉此，若描繪單元U(U1~U6)旋動固定角度，則描繪線SLa、SLb亦會相應地以旋動中心軸AXr為中心，相對於Y方向(Y軸)傾斜固定角度。上述各描繪單元U(U1~U6)在控制裝置18的控制下，藉由包含致動器之未圖示的響應性高之驅動機構而繞旋動中心軸AXr旋動。 When the drawing unit U (U1 to U6) is slightly rotated (rotated) around the rotation center axis AXr, the drawing lines SLa and SLb of the spot SP of the scanning beam LB are also rotated about the rotation center axis AXr. Move (rotate). Accordingly, when the drawing unit U (U1 to U6) is rotated at a fixed angle, the drawing lines SLa and SLb are also inclined at a fixed angle with respect to the Y direction (Y axis) around the rotation center axis AXr. Each of the drawing units U (U1 to U6) is rotated about the rotation center axis AXr by a drive mechanism including a high responsiveness of an actuator (not shown) under the control of the control device 18.
另外，有時會以SL1a、SL1b表示描繪單元U1的兩條描繪線SLa、SLb，同樣地，以SL2a、SL2b~SL6a、SL6b表示描繪單元U2~U6的兩條描繪線SLa、SLb。又，有時會將描繪線SLa、SLb僅總稱為描繪線SL。 Further, the two drawing lines SLa and SLb of the drawing unit U1 may be indicated by SL1a and SL1b, and the two drawing lines SLa and SLb of the drawing units U2 to U6 may be similarly represented by SL2a, SL2b to SL6a, and SL6b. Further, the drawing lines SLa and SLb may be collectively referred to simply as the drawing line SL.
如圖2所示，以使複數個描繪單元U(U1~U6)完全覆蓋曝光區域W的整個寬度方向之方式，由各描繪單元U(U1~U6)分擔掃描區域。 藉此，各描繪單元U(U1~U6)能夠按沿基板P之寬度方向分割而成之複數個區域描繪圖案。例如，若將描繪線SL的掃描長度(長度)設為20mm~40mm左右，則藉由沿Y方向配置共計6個描繪單元U，使所能描繪之Y方向寬度擴大至約240mm~480mm左右。各描繪線SL(SL1a、SL1b~SL6a、SL6b)的長度(掃描長度)原則上相同。也就是，沿著複數條描繪線SL(SL1a、SL1b~SL6a、SL6b)的各者掃描之光束LB的光點SP的掃描距離原則上相同。另外，於欲擴大曝光區域W的寬度之情形時，能夠藉由延長描繪線SL(SLa、SLb)自身的長度、或增加沿Y方向配置之描繪單元U的數量加以應對。 As shown in FIG. 2, the scanning area is shared by each drawing unit U (U1 to U6) so that a plurality of drawing units U (U1 to U6) completely cover the entire width direction of the exposure area W. Thereby, each drawing unit U (U1 to U6) can draw a pattern in a plurality of areas divided in the width direction of the substrate P. For example, when the scanning length (length) of the drawing line SL is set to about 20 mm to 40 mm, a total of six drawing units U are arranged in the Y direction, and the width in the Y direction that can be drawn is expanded to about 240 mm to 480 mm. The length (scanning length) of each of the drawing lines SL (SL1a, SL1b to SL6a, SL6b) is basically the same. That is, the scanning distance of the spot SP of the light beam LB scanned by each of the plurality of drawing lines SL (SL1a, SL1b to SL6a, SL6b) is basically the same. Further, when the width of the exposure region W is to be increased, it is possible to cope with the length of the drawing line SL (SLa, SLb) itself or the number of drawing units U arranged in the Y direction.
描繪線SL1a、SL1b、SL2a、SL2b、SL5a、SL5b、SL6a、SL6b，位於由旋轉筒DR1支承之基板P的被照射面上。描繪線SL1a、SL1b、SL2a、SL2b、SL5a、SL5b、SL6a、SL6b，夾著中心面Poc1而呈2行地沿旋轉筒DR1之圓周方向配置。描繪線SL1a、SL1b、SL5a、SL5b，相對於中心面Poc1位於基板P的搬送方向的上游側(-X方向側)之基板P的被照射面上。描繪線SL2a、SL2b、SL6a、SL6b，相對於中心面Poc1位於基板P的搬送方向的下游側(+X方向側)之基板P的被照射面上。 The drawing lines SL1a, SL1b, SL2a, SL2b, SL5a, SL5b, SL6a, and SL6b are located on the illuminated surface of the substrate P supported by the rotating cylinder DR1. The drawing lines SL1a, SL1b, SL2a, SL2b, SL5a, SL5b, SL6a, and SL6b are arranged in the circumferential direction of the rotating cylinder DR1 in two rows with the center plane Poc1 interposed therebetween. The drawing lines SL1a, SL1b, SL5a, and SL5b are located on the illuminated surface of the substrate P on the upstream side (the -X direction side) of the substrate P in the transport direction with respect to the center plane Poc1. The drawing lines SL2a, SL2b, SL6a, and SL6b are located on the illuminated surface of the substrate P on the downstream side (+X direction side) of the substrate P in the transport direction with respect to the center plane Poc1.
描繪線SL3a、SL3b、SL4a、SL4b，位於由旋轉筒DR2支承之基板P的被照射面上。描繪線SL3a、SL3b、SL4a、SL4b，夾著中心面Poc2而呈2行地沿旋轉筒DR2的圓周方向配置。描繪線SL3a、SL3b，相對於中心面Poc2位於基板P的搬送方向的上游側(-X方向側)之基板P的被照射面上。描繪線SL4a、SL4b，相對於中心面Poc2位於基板P的搬送方向的下游側(+X方向側)之基板P的被照射面上。描繪線SL1a、SL1b~SL6a、SL6b與基板P的寬度方向也就是旋轉筒DR1、DR2的中心軸AXo1、AXo2大致並 行。 The drawing lines SL3a, SL3b, SL4a, and SL4b are located on the illuminated surface of the substrate P supported by the rotating cylinder DR2. The drawing lines SL3a, SL3b, SL4a, and SL4b are arranged in the circumferential direction of the rotating cylinder DR2 in two rows with the center plane Poc2 interposed therebetween. The drawing lines SL3a and SL3b are located on the illuminated surface of the substrate P on the upstream side (the −X direction side) of the substrate P in the transport direction with respect to the center plane Poc2. The drawing lines SL4a and SL4b are located on the illuminated surface of the substrate P on the downstream side (+X direction side) of the substrate P in the transport direction with respect to the center plane Poc2. The width directions of the drawing lines SL1a, SL1b to SL6a, and SL6b and the substrate P are substantially the central axes AXo1 and AXo2 of the rotating cylinders DR1 and DR2. Row.
奇數號的描繪線SL1a、SL1b、SL3a、SL3b、SL5a、SL5b，在Y方向(基板P的寬度方向)上，沿著基板P的寬度方向(掃描方向)隔開既定間隔而配置於直線上。偶數號的描繪線SL2a、SL2b、SL4a、SL4b、SL6a、SL6b亦同樣地在Y方向上，沿著基板P的寬度方向隔開既定間隔而配置於直線上。此時，描繪線SL1b在Y方向上配置於描繪線SL2a與描繪線SL2b之間。描繪線SL3a在Y方向上配置於描繪線SL2b與描繪線SL4a之間。描繪線SL3b在Y方向上配置於描繪線SL4a與描繪線SL4b之間。描繪線SL5a在Y方向上配置於描繪線SL4b與描繪線SL6a之間。描繪線SL5b在Y方向上配置於描繪線SL6a與描繪線SL6b之間。也就是，描繪線SL係以如下方式配置：在Y方向上，從-Y方向側起依序按照SL1a、SL2a、SL1b、SL2b、SL3a、SL4a、SL3b、SL4b、SL5a、SL6a、SL5b、SL6b之順序所描繪之圖案，以Y方向的端部相接。 The odd-numbered drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, and SL5b are arranged on the straight line at a predetermined interval in the Y direction (the width direction of the substrate P) along the width direction (scanning direction) of the substrate P. Similarly, the even-numbered drawing lines SL2a, SL2b, SL4a, SL4b, SL6a, and SL6b are arranged on the straight line at a predetermined interval in the Y direction along the width direction of the substrate P. At this time, the drawing line SL1b is disposed between the drawing line SL2a and the drawing line SL2b in the Y direction. The drawing line SL3a is disposed between the drawing line SL2b and the drawing line SL4a in the Y direction. The drawing line SL3b is disposed between the drawing line SL4a and the drawing line SL4b in the Y direction. The drawing line SL5a is disposed between the drawing line SL4b and the drawing line SL6a in the Y direction. The drawing line SL5b is disposed between the drawing line SL6a and the drawing line SL6b in the Y direction. That is, the drawing line SL is arranged in such a manner that in the Y direction, SL1a, SL2a, SL1b, SL2b, SL3a, SL4a, SL3b, SL4b, SL5a, SL3a, SL5b, SL6b are sequentially followed from the -Y direction side. The patterns depicted in the sequence are joined at the ends in the Y direction.
沿著奇數號的描繪線SL1a、SL1b、SL3a、SL3b、SL5a、SL5b的各者掃描之光束LB的光點SP的掃描方向為一維方向，且為相同方向(+Y方向)。沿著偶數號的描繪線SL2a、SL2b、SL4a、SL4b、SL6a、SL6b的各者掃描之光束LB的光點SP的掃描方向為一維方向，且為相同方向(-Y方向)。沿著上述奇數號的描繪線SL1a、SL1b、SL3a、SL3b、SL5a、SL5b掃描之光束LB的光點SP的掃描方向(+Y方向)、與沿著偶數號的描繪線SL2a、SL2b、SL4a、SL4b、SL6a、SL6b掃描之光束LB的光點SP的掃描方向(-Y方向)為彼此相反之方向。藉此，於描繪線SL1b、SL3a、SL3b、SL5a、SL5b的描繪開始位置(描繪開始點之位置)、與描繪線SL2a、SL2b、SL4a、SL4b、SL6a 的描繪開始位置所描繪之圖案相接。又，於描繪線SL1a、SL1b、SL3a、SL3b、SL5a、SL5b的描繪結束位置(描繪結束點之位置)、與描繪線SL2a、SL2b、SL4a、SL4b、SL6a、SL6b的描繪結束位置所描繪之圖案相接。另外，於初始狀態下，位於直線上之奇數號的描繪線SL1a、SL1b、SL5a、SL5b、與位於直線上之偶數號的描繪線SL2a、SL2b、SL6a、SL6b沿著基板P的搬送方向(旋轉筒DR1的圓周方向)隔開固定長度(間隔長度)配置。同樣地，於初始狀態下，位於直線上之奇數號的描繪線SL3a、SL3b、與位於直線上之偶數號的描繪線SL4a、SL4b沿著基板P的搬送方向(旋轉筒DR2的圓周方向)隔開固定長度(間隔長度)配置。 The scanning direction of the spot SP of the light beam LB scanned along each of the odd-numbered drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, and SL5b is a one-dimensional direction and is in the same direction (+Y direction). The scanning direction of the spot SP of the light beam LB scanned along each of the even-numbered drawing lines SL2a, SL2b, SL4a, SL4b, SL6a, and SL6b is a one-dimensional direction and is the same direction (-Y direction). The scanning direction (+Y direction) of the spot SP of the light beam LB scanned along the odd-numbered drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, SL5b, and the drawing lines SL2a, SL2b, SL4a along the even-numbered lines, The scanning direction (-Y direction) of the spot SP of the light beam LB scanned by the SL4b, SL6a, and SL6b is opposite to each other. Thereby, the drawing start position (the position of the drawing start point) of the drawing lines SL1b, SL3a, SL3b, SL5a, and SL5b, and the drawing lines SL2a, SL2b, SL4a, SL4b, and SL6a are formed. The pattern depicted at the beginning of the depiction is connected. Further, the drawing end positions (the positions at the drawing end points) of the drawing lines SL1a, SL1b, SL3a, SL3b, SL5a, and SL5b and the patterns drawn at the drawing end positions of the drawing lines SL2a, SL2b, SL4a, SL4b, SL6a, and SL6b are drawn. Docked. Further, in the initial state, the odd-numbered drawing lines SL1a, SL1b, SL5a, and SL5b on the straight line and the even-numbered drawing lines SL2a, SL2b, SL6a, and SL6b located on the straight line are along the transport direction of the substrate P (rotation) The circumferential direction of the cylinder DR1 is arranged with a fixed length (interval length). Similarly, in the initial state, the odd-numbered drawing lines SL3a and SL3b on the straight line and the even-numbered drawing lines SL4a and SL4b located on the straight line are separated in the conveying direction of the substrate P (the circumferential direction of the rotating cylinder DR2). Open fixed length (interval length) configuration.
另外，描繪線SL的寬度(X方向尺寸)，為與光點SP的尺寸(直徑)φ相對應之粗細度。例如，於光點SP的有效尺寸φ為3μm之情形時，描繪線SL的寬度亦為3μm。光點SP亦可以按照既定長度(例如光點SP的有效尺寸φ的一半)重疊之方式，沿著描繪線SL投射。又，在掃描方向上彼此相鄰接之描繪線SL的端部(例如描繪線SL1a的描繪結束點與描繪線SL2a的描繪結束點)，亦可按照既定長度(例如光點SP的尺寸φ的一半)在Y方向上重疊。 Further, the width (X-direction dimension) of the drawing line SL is the thickness corresponding to the size (diameter) φ of the spot SP. For example, when the effective size φ of the spot SP is 3 μm, the width of the drawing line SL is also 3 μm. The spot SP may also be projected along the drawing line SL in such a manner that a predetermined length (for example, half of the effective size φ of the spot SP) overlaps. Further, the end portion of the drawing line SL adjacent to each other in the scanning direction (for example, the drawing end point of the drawing line SL1a and the drawing end point of the drawing line SL2a) may be a predetermined length (for example, the size φ of the spot SP). Half) overlap in the Y direction.
圖3係顯示使在主掃描方向上相鄰之描繪線SL的端部彼此一致(鄰接)時之各描繪單元U的描繪線SLa、SLb的配置關係之圖。如圖3所示，將描繪單元U的描繪線SLa、SLb的掃描長度、及描繪單元U的描繪線SLa與描繪線SLb之Y方向分隔距離(間隙)均設為Lo。因此，能夠以使在主掃描方向上相鄰之描繪線SL彼此的端部在主掃描方向上鄰接之方式，配置彼此相對向之描繪單元U1、U3、U5的描繪線SLa、SLb與描繪單 元U2、U4、U6的描繪線SLa、SLb。另外，描繪單元U的旋動中心軸AXr，係設定成通過描繪線SLa、SLb之間的分隔距離Lo的中心點。 FIG. 3 is a view showing an arrangement relationship of the drawing lines SLa and SLb of the drawing units U when the ends of the drawing lines SL adjacent in the main scanning direction are aligned with each other (adjacent). As shown in FIG. 3, the scanning length of the drawing lines SLa and SLb of the drawing unit U and the Y-direction separation distance (gap) of the drawing line S of the drawing unit U and the drawing line SL are both set to Lo. Therefore, the drawing lines SLa, SLb and the drawing sheets of the drawing units U1, U3, and U5 facing each other can be arranged such that the end portions of the drawing lines SL adjacent to each other in the main scanning direction are adjacent to each other in the main scanning direction. Drawing lines SLa, SLb of the elements U2, U4, and U6. Further, the center axis of rotation AXr of the drawing unit U is set so as to pass through the center point of the separation distance Lo between the lines SLa and SLb.
圖4係顯示使在掃描方向上相鄰之描繪線SL的端部彼此各重疊α/2(固定長度)時之各描繪單元U的描繪線SLa、SLb的配置關係之圖。如圖4所示，將描繪線SLa、SLb的掃描長度設為Lo，將描繪單元U的描繪線SLa與描繪線SLb之Y方向分隔距離(間隙)設為Lo-α。因此，能夠以使在主掃描方向上相鄰之描繪線SL彼此的端部在主掃描方向重疊α/2之方式，配置彼此相對向之描繪單元U1、U3、U5的描繪線SLa、SLb與描繪單元U2、U4、U6的描繪線SLa、SLb。另外，描繪單元U的旋動中心軸AXr，係設定成通過描繪線SLa、SLb之間的分隔距離Lo-α的中心點。 FIG. 4 is a view showing an arrangement relationship of the drawing lines SLa and SLb of the drawing units U when the end portions of the drawing lines SL adjacent in the scanning direction are overlapped by each other by α/2 (fixed length). As shown in FIG. 4, the scanning lengths of the drawing lines SLa and SLb are set to Lo, and the distance (gap) in the Y direction of the drawing line SLa of the drawing unit U and the drawing line SLb is set to Lo-α. Therefore, it is possible to arrange the drawing lines SLa, SLb of the drawing units U1, U3, and U5 with respect to each other so that the end portions of the drawing lines SL adjacent to each other in the main scanning direction overlap by α/2 in the main scanning direction. The drawing lines SLa, SLb of the units U2, U4, and U6 are drawn. Further, the center axis of rotation AXr of the drawing unit U is set so as to pass through the center point of the separation distance Lo-α between the lines SLa and SLb.
圖1所示之控制裝置18，對曝光裝置EX的各部分進行控制。該控制裝置18包含電腦與記錄有程式之記錄媒體等，該電腦藉由執行程式而作為本第1實施形態之控制裝置18發揮功能。又，圖1所示之對準顯微鏡AMa(AMa1~AMa4)、AMb(AMb1~AMb4)，係用以檢測圖2所示之基板P上所形成之對準標記MK(MK1~MK4)。複數個對準顯微鏡AMa(AMa1~AMa4)沿著Y方向設置。同樣地，複數個對準顯微鏡AMb(AMb1~AMb4)亦沿著Y方向設置。對準標記MK(MK1~MK4)，係用以使在基板P的被照射面上的曝光區域W描繪之圖案與基板P相對地對準(alignment)的基準標記。對準顯微鏡AMa(AMa1~AMa4)，在由旋轉筒DR1的圓周面支承之基板P上，檢測對準標記MK(MK1~MK4)。對準顯微鏡AMa(AMa1~AMa4)，設置在較從描繪單元U1、U5照射至基板P的被照射面上之光束LB的光點SP之位置(描繪線SL1a、SL1b、SL5a、SL5b)更靠基板P的搬送方向的上游側(-X 方向側)。又，對準顯微鏡AMb(AMb1~AMb4)，在由旋轉筒DR2的圓周面支承之基板P上，檢測對準標記MK(MK1~MK4)。對準顯微鏡AMb(AMb1~AMb4)設置在較從描繪單元U3照射至基板P的被照射面上之光束LB的光點SP之位置(描繪線SL3a、SL3b)更靠基板P的搬送方向的上游側(-X方向側)。 The control unit 18 shown in Fig. 1 controls each part of the exposure apparatus EX. The control device 18 includes a computer and a recording medium on which a program is recorded, and the computer functions as the control device 18 of the first embodiment by executing a program. Further, alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4) shown in Fig. 1 are used to detect alignment marks MK (MK1 to MK4) formed on the substrate P shown in Fig. 2. A plurality of alignment microscopes AMa (AMa1~AMa4) are arranged along the Y direction. Similarly, a plurality of alignment microscopes AMb (AMb1 to AMb4) are also arranged along the Y direction. The alignment marks MK (MK1 to MK4) are reference marks for aligning the pattern drawn by the exposure region W on the illuminated surface of the substrate P with the substrate P. The alignment marks MK (MK1 to MK4) are detected on the substrate P supported by the circumferential surface of the rotating cylinder DR1 by the alignment microscope AMa (AMa1 to AMa4). The alignment microscopes AMa (AMa1 to AmA4) are disposed closer to the positions (drawing lines SL1a, SL1b, SL5a, and SL5b) of the light spot SP of the light beam LB irradiated onto the illuminated surface of the substrate P from the drawing units U1 and U5. The upstream side of the transport direction of the substrate P (-X Direction side). Moreover, the alignment marks MK (MK1 to MK4) are detected on the substrate P supported by the circumferential surface of the rotating cylinder DR2 by the alignment microscope AMb (AMb1 to AMb4). The alignment microscopes AMb (AMb1 to AMb4) are disposed upstream of the substrate P in the transport direction of the light spot SP of the light beam LB irradiated onto the illuminated surface of the substrate P from the drawing unit U3 (the drawing lines SL3a, SL3b). Side (-X direction side).
對準顯微鏡AMa(AMa1~AMa4)、AMb(AMb1~AMb4)具有未圖示的將對準用的照明光投射至基板P之光源、與拍攝其反射光之攝影元件(CCD(Charge Coupled Device，電荷耦合元件)、CMOS(Complementary Metal Oxide Semiconductor，互補金屬氧化物半導體)等)。對準顯微鏡AMa(AMa1~AMa4)、AMb(AMb1~AMb4)拍攝得之攝影訊號，被發送至控制裝置18。對準顯微鏡AMa(AMa1~AMa4)、AMb(AMb1~AMb4)，拍攝存在於未圖示之觀察區域內之對準標記MK(MK1~MK4)。各對準顯微鏡AMa(AMa1~AMa4)、AMb(AMb1~AMb4)的觀察區域沿著Y方向設置，且根據對準標記MK(MK1~MK4)的Y方向位置而配置。因此，對準顯微鏡AMa1、AMb1能夠拍攝對準標記MK1，同樣地，對準顯微鏡AMa2~AMa4、AMb2~AMb4能夠拍攝對準標記MK2~MK4。基板P的被照射面上的該觀察區域之大小，係根據對準標記MK(MK1~MK4)的大小或對準精度(位置測定精度)而設定，其為100μm~500μm左右見方之大小。控制裝置18，基於來自對準顯微鏡AMa(AMa1~AMa4)、AMb(AMb1~AMb4)之攝影訊號，檢測對準標記MK的位置。另外，對準用的照明光係對基板P的感光性功能層而言幾乎不具有感度之波長帶之光，例如波長為500nm~800nm左右之光。又，對準顯微鏡AMa、AMb的攝影元件，由於需要於基板P移 動期間拍攝對準標記MK，因此其快門時間設定為與基板P的搬送速度相對應之高速快門時間(電荷儲存時間等攝影時間)。 The alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4) have a light source for projecting illumination light for projection onto the substrate P and a photographic element (CCD (Charge Coupled Device) for capturing the reflected light (not shown). Coupling element), CMOS (Complementary Metal Oxide Semiconductor, etc.). The photographing signals taken by the alignment microscopes AMa (AMa1~AMa4) and AMb (AMb1~AMb4) are sent to the control device 18. The alignment marks MK (MK1 to MK4) existing in an observation area not shown are photographed by aligning the microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4). The observation areas of the alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4) are arranged along the Y direction, and are arranged in accordance with the position of the alignment marks MK (MK1 to MK4) in the Y direction. Therefore, the alignment marks MK1 can be imaged by the alignment microscopes AMa1 and AMb1, and the alignment marks MK2 to MK4 can be imaged by the alignment microscopes AMa2 to AMa4 and AMb2 to AMb4. The size of the observation region on the illuminated surface of the substrate P is set according to the size of the alignment marks MK (MK1 to MK4) or the alignment accuracy (position measurement accuracy), and is about 100 μm to 500 μm square. The control device 18 detects the position of the alignment mark MK based on the imaging signals from the alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4). Further, the illumination light for alignment has almost no light having a wavelength band of sensitivity to the photosensitive functional layer of the substrate P, for example, light having a wavelength of about 500 nm to 800 nm. Moreover, the photographic elements aligned with the microscopes AMa and AMb are required to be moved on the substrate P. The alignment mark MK is photographed during the movement, and therefore the shutter time is set to a high-speed shutter time (photographing time such as charge storage time) corresponding to the conveyance speed of the substrate P.
其次，對描繪單元U的構成進行說明。各描繪單元U具有相同構成，因此於本第1實施形態中，以描繪單元U2為例進行說明。以下，於描繪單元U的說明中，為了特定描繪單元U內的各構件或光束的配置而設定正交座標系XtYtZt。正交座標系XtYtZt的Yt軸設定成與正交座標系XYZ的Y軸平行，正交座標系XtYtZt設定成相對於正交座標系XYZ繞Y軸傾斜固定角度。 Next, the configuration of the drawing unit U will be described. Since each drawing unit U has the same configuration, in the first embodiment, the drawing unit U2 will be described as an example. Hereinafter, in the description of the drawing unit U, the orthogonal coordinate system XtYtZt is set in order to specify the arrangement of each member or light beam in the drawing unit U. The Yt axis of the orthogonal coordinate system XtYtZt is set to be parallel to the Y axis of the orthogonal coordinate system XYZ, and the orthogonal coordinate system XtYtZt is set to be inclined at a fixed angle with respect to the orthogonal coordinate system XYZ about the Y axis.
圖5係從-Yt(-Y)方向側觀察之描繪單元U2之構成圖，圖6係從+Zt方向側觀察之描繪單元U2之構成圖。射入至描繪單元U2之兩條光束LB中，以LBa表示一條光束LB，以LBb表示另一條光束LB。又，有時會以SPa表示光束(第1光束)LBa的光點SP，以SPb表示光束(第2光束)LBb的光點SP。光點(第1光點)SPa於描繪線SL2a(SLa)上掃描，光點(第2光點)SPb於描繪線SL2b(SLb)上掃描。 Fig. 5 is a configuration diagram of the drawing unit U2 as seen from the -Yt (-Y) direction side, and Fig. 6 is a configuration diagram of the drawing unit U2 as viewed from the +Zt direction side. The two beams LB are incident on the drawing unit U2, one beam LB is represented by LBa, and the other beam LB is represented by LBb. Further, the spot SP of the light beam (first light beam) LBa is indicated by SPa, and the spot SP of the light beam (second light beam) LBb is indicated by SPb. The light spot (first light spot) SPa is scanned on the drawing line SL2a (SLa), and the light spot (second light spot) SPb is scanned on the drawing line SL2b (SLb).
另外，於圖6中，為了容易理解，以較描繪線SL2a、SL2b更粗之點表示光點SPa、SPb。又，於圖5、圖6中，將與旋動中心軸AXr平行之方向設為Zt方向，將處於與Zt方向正交之平面上、基板P從處理裝置PR1經由曝光裝置EX朝向處理裝置PR2的方向設為Xt方向，將處於與Zt方向正交之平面上、與Xt方向正交之方向設為Yt方向。也就是，圖5、圖6的Xt、Yt、Zt的三維座標，係以Y軸為中心而Z軸方向與旋動中心軸AXr平行之方式使圖1的X、Y、Z的三維坐標旋轉而成之三維座標。 In addition, in FIG. 6, in order to make it easy to understand, the light spot SPa and SPb are shown in the point which is thicker than the drawing line SL2a and SL2b. Further, in FIGS. 5 and 6, the direction parallel to the central axis of rotation AXr is set to the Zt direction, and the substrate P is directed from the processing device PR1 to the processing device PR2 via the exposure device EX on a plane orthogonal to the Zt direction. The direction is set to the Xt direction, and the direction orthogonal to the Xt direction on the plane orthogonal to the Zt direction is set to the Yt direction. That is, the three-dimensional coordinates of Xt, Yt, and Zt of FIGS. 5 and 6 are such that the three-dimensional coordinates of X, Y, and Z of FIG. 1 are rotated in such a manner that the Y-axis is centered and the Z-axis direction is parallel to the rotational central axis AXr. The three-dimensional coordinates.
描繪單元U2具備反射鏡M1、聚光透鏡CD、三角反射鏡 M2、反射鏡M3a、M3b、偏移光學構件(偏移光學板)SRa、SRb、光束成形光學系統BFa、BFb、反射鏡M4、柱面透鏡CY1、反射鏡M5、多面鏡PM、反射鏡M6a、M6b、fθ透鏡FTa、FTb、反射鏡M7a、M7b及柱面透鏡CY2a、CY2b的光學系統。該等光學系統(反射鏡M1、聚光透鏡CD等)，作為一個描繪單元U2而一體地形成於高剛性之框體內。也就是，描繪單元U2一體地保持該等光學系統。對於兩條光束LBa、LBb均射入之光學系統，僅加註參照符號，對於兩條光束LBa、LBb各自分別地射入且兩條光束LBa、LBb成對地設置之光學系統，在參照符號之後加註a、b。簡單而言，對於僅光束LBa射入之光學系統，在參照符號之後加註a，對於僅光束LBb射入之光學系統，在參照符號之後加註b。 The drawing unit U2 is provided with a mirror M1, a collecting lens CD, and a triangular mirror M2, mirrors M3a, M3b, offset optical members (offset optical plates) SRa, SRb, beam shaping optical systems BFa, BFb, mirror M4, cylindrical lens CY1, mirror M5, polygon mirror PM, mirror M6a , M6b, fθ lens FTa, FTb, mirrors M7a, M7b and optical systems of cylindrical lenses CY2a, CY2b. These optical systems (mirror M1, condenser lens CD, etc.) are integrally formed in a highly rigid casing as one drawing unit U2. That is, the drawing unit U2 integrally holds the optical systems. For an optical system in which both light beams LBa and LBb are incident, only the reference symbols are added, and the optical systems in which the two light beams LBa and LBb are respectively incident and the two light beams LBa and LBb are disposed in pairs are referred to as reference symbols. Then add a, b. In short, for an optical system in which only the light beam LBa is incident, a is added after the reference symbol, and for the optical system in which only the light beam LBb is incident, b is added after the reference symbol.
如圖5所示，來自光源裝置14之兩條光束LBa、LBb，在透過兩個光學元件AOMa、AOMb及兩個準直透鏡CLa、CLb之後，由反射鏡M8反射，以與Zt軸平行之狀態射入至描繪單元U2。射入至描繪單元U2之兩條光束LBa、LBb，於XtZt平面中，沿著描繪單元U2的旋動中心軸AXr射入至反射鏡M1。圖7係從+Zt方向側觀察透過光學元件AOMa、AOMb及準直透鏡CLa、CLb而射入至反射鏡M8之光束LBa、LBb的光路之圖，圖8係從+Xt方向側觀察從反射鏡M8射入至描繪單元U2的反射鏡M1之光束LBa、LBb的光路之圖。另外，於圖7、圖8中，亦以Xt、Yt、Zt的三維座標系表示。 As shown in FIG. 5, the two light beams LBa, LBb from the light source device 14 are reflected by the mirror M8 after being transmitted through the two optical elements AOMa, AOMb and the two collimating lenses CLa, CLb to be parallel to the Zt axis. The state is injected into the drawing unit U2. The two light beams LBa, LBb incident on the drawing unit U2 are incident on the mirror M1 along the rotational center axis AXr of the drawing unit U2 in the XtZt plane. Fig. 7 is a view showing an optical path of the light beams LBa and LBb incident on the mirror M8 through the optical elements AOMa and AOMb and the collimator lenses CLa and CLb as viewed from the +Zt direction side, and Fig. 8 is a reflection from the +Xt direction side. The mirror M8 is incident on the optical path of the light beams LBa and LBb of the mirror M1 of the drawing unit U2. In addition, in FIGS. 7 and 8, it is also represented by a three-dimensional coordinate system of Xt, Yt, and Zt.
光學元件AOMa、AOMb，係對光束LBa、LBb具有透射性者，係聲光調變元件(AOM：Acousto-Optic Modulator)。光學元件AOMa、AOMb藉由使用超音波(高頻訊號)，使射入之光束LBa、LBb以與高頻波的頻率相 對應之繞射角繞射，從而改變光束LBa、LBb的光路即前進方向。光學元件AOMa、AOMb，根據來自控制裝置18之驅動訊號(高頻訊號)的導通/斷開，導通/斷開產生使射入之光束LBa、LBb繞射而成之繞射光(一次繞射光束)。 The optical elements AOMa and AOMb are optically modulating elements (AOM: Acousto-Optic Modulator). The optical elements AOMa and AOMb use the ultrasonic waves (high-frequency signals) to make the incident light beams LBa and LBb at a frequency corresponding to the high-frequency waves. The corresponding diffraction angle is diffracted, thereby changing the optical path of the light beams LBa, LBb, that is, the advancing direction. The optical elements AOMa, AOMb are turned on/off according to the driving signal (high-frequency signal) from the control device 18, and are turned on/off to generate diffracted light by diffracting the incident light beams LBa, LBb (primary diffracted beam) ).
光學元件AOMa於來自控制裝置18之驅動訊號(高頻訊號)為斷開之狀態時，不使射入之光束LBa繞射而使其透過。因此，於驅動訊號為斷開之狀態時，透過光學元件AOMa之光束Lba，射入至未圖示之吸收體而不射入至準直透鏡CLa及反射鏡M8。此意味著投射至基板P的被照射面上之光點SPa的強度被調變為低位準(零)。另一方面，於光學元件AOMa根據來自控制裝置18之驅動訊號(高頻訊號)而導通之狀態時，產生使射入之光束LBa繞射而成之一次繞射光束。因此，於驅動訊號為導通之狀態時，利用光學元件AOMa而偏向之一次繞射光束(為了便於說明而設為來自光學元件AOMa之光束LBa)，在透過準直透鏡CLa之後，射入至反射鏡M8。此意味著投射至基板P的被照射面上之光點SPa的強度被調變為高位準。 When the optical element AOMa is in a state in which the driving signal (high-frequency signal) from the control device 18 is off, the incident light beam LBa is not diffracted and transmitted. Therefore, when the drive signal is in the off state, the light beam Lba transmitted through the optical element AOMa is incident on the absorber (not shown) and is not incident on the collimator lens CLa and the mirror M8. This means that the intensity of the spot SPa projected onto the illuminated surface of the substrate P is adjusted to a low level (zero). On the other hand, when the optical element AOMa is turned on in accordance with the driving signal (high-frequency signal) from the control device 18, a primary diffracted beam obtained by diffracting the incident light beam LBa is generated. Therefore, when the driving signal is in the on state, the primary diffracted beam (the light beam LBa from the optical element AOMa for the sake of convenience) is deflected by the optical element AOMa, and is incident on the reflection after passing through the collimating lens CLa. Mirror M8. This means that the intensity of the spot SPa projected onto the illuminated surface of the substrate P is adjusted to a high level.
同樣地，光學元件AOMb於來自控制裝置18之驅動訊號(高頻訊號)為斷開之狀態時，不使射入之光束LBb繞射而使其透過，因此，透過光學元件AOMb之光束LBb，射入至未圖示之吸收體而不射入至準直透鏡CLb及反射鏡M8。此意味著投射至基板P的被照射面上之光點SPb的強度被調變為低位準(零)。另一方面，於光學元件AOMb根據來自控制裝置18之驅動訊號(高頻訊號)而導通之狀態時，使射入之光束LBb繞射，因此，利用光學元件AOMb而偏向之光束LBb(一次繞射光束)，在透過準直透鏡CLb之後，射入至反射鏡M8。此意味著投射至基板P的被照射面上之光點SPb的強度被調變為高位準。控制裝置18根據描繪線SL2a所描繪之圖案的 圖案資料(位元映射)，高速地使施加至光學元件AOMa之驅動訊號導通/斷開，並且基於以描繪線SL2b描繪之圖案的圖案資料，高速地使施加至光學元件AOMb之驅動訊號導通/斷開。也就是，光點SPa、SPb的強度，係根據圖案資料而被調變為高位準與低位準。另外，射入至光學元件AOMa、AOMb之光束LBa、LBb，以於光學元件AOMa、AOMb內達到光束腰寬(beam waist)之方式聚光，因此，利用光學元件AOMa、AOMb而偏向並輸出之光束LBa、LBb(一次繞射光束)成為發散光，準直透鏡CLa、CLb使該發散光成為既定光束直徑之平行光束。 Similarly, when the optical element AOMb is in an off state from the driving signal (high frequency signal) from the control device 18, the incident light beam LBb is not diffracted and transmitted, and therefore, the light beam LBb transmitted through the optical element AOMb, It is incident on an absorber (not shown) and is not incident on the collimator lens CLb and the mirror M8. This means that the intensity of the spot SPb projected onto the illuminated surface of the substrate P is adjusted to a low level (zero). On the other hand, when the optical element AOMb is turned on in accordance with the driving signal (high-frequency signal) from the control device 18, the incident light beam LBb is diffracted, and therefore, the light beam LBb deflected by the optical element AOMb (one-time winding) The light beam is incident on the mirror M8 after passing through the collimator lens CLb. This means that the intensity of the spot SPb projected onto the illuminated surface of the substrate P is adjusted to a high level. The control device 18 is based on the pattern depicted by the line SL2a The pattern data (bit map) enables the driving signal applied to the optical element AOMa to be turned on/off at high speed, and the driving signal applied to the optical element AOMb is turned on at a high speed based on the pattern data of the pattern drawn by the drawing line SL2b/ disconnect. That is, the intensities of the spots SPa and SPb are adjusted to a high level and a low level according to the pattern data. In addition, the light beams LBa and LBb incident on the optical elements AOMa and AOMb are collected so as to reach the beam waist in the optical elements AOMa and AOMb, and therefore are deflected and output by the optical elements AOMa and AOMb. The light beams LBa and LBb (primary diffracted beams) become divergent light, and the collimator lenses CLa and CLb make the divergent light a parallel beam of a predetermined beam diameter.
反射鏡M8將射入之光束LBa、LBb往-Zt方向進行反射並導引至描繪單元U2的反射鏡(反射構件)M1。經反射鏡M8反射後之光束LBa、LBb，以相對於旋動中心軸AXr對稱之方式射入至描繪單元U2的反射鏡M1。此時，光束LBa、LBb可於反射鏡M1上交叉，亦可不交叉。圖6、圖8中顯示光束LBa、LBb於反射鏡M1上的旋動中心軸AXr之位置交叉之例子。也就是，光束LBa、LBb相對於旋動中心軸AXr以固定角度射入至反射鏡M1。於本第1實施形態中，光束LBa、LBb沿著Yt(Y)方向，以相對於旋動中心軸AXr對稱之方式射入至反射鏡M1。另外，亦可以如下方式進行設計，亦即，光束LBa、LBb以相對於旋動中心軸AXr對稱之方式平行地射入至反射鏡M1。 The mirror M8 reflects the incident light beams LBa and LBb in the -Zt direction and guides them to the mirror (reflecting member) M1 of the drawing unit U2. The light beams LBa and LBb reflected by the mirror M8 are incident on the mirror M1 of the drawing unit U2 so as to be symmetrical with respect to the central axis of rotation AXr. At this time, the light beams LBa and LBb may or may not intersect on the mirror M1. 6 and 8 show an example in which the positions of the light-emitting axes LBa and LBb intersect with the central axis of rotation AXr on the mirror M1. That is, the light beams LBa, LBb are incident on the mirror M1 at a fixed angle with respect to the rotational central axis AXr. In the first embodiment, the light beams LBa and LBb are incident on the mirror M1 so as to be symmetrical with respect to the rotation center axis AXr along the Yt (Y) direction. Alternatively, the light beams LBa and LBb may be incident in parallel to the mirror M1 so as to be symmetrical with respect to the central axis of rotation AXr.
返回至圖5、圖6的說明，反射鏡M1將射入之光束LBa、LBb往+Xt方向進行反射。經反射鏡M1反射後之光束LBa、LBb(各自為平行光束)，如圖6所示，於XtYt面內，彼此以固定之張開角逐漸分離。聚光透鏡CD為如下透鏡，係使來自反射鏡M1之光束LBa、LBb各自的中心軸 於XtYt面內相互平行，並且使光束LBa、LBb各自聚光於既定之焦點位置。該聚光透鏡CD的功能將於以下說明，而聚光透鏡CD的前側焦點位置以處於反射鏡M1的反射面上或其附近之方式設定。三角反射鏡M2將透過聚光透鏡CD之光束LBa往-Yt(-Y)方向側進行90度之反射並導引至反射鏡M3a，並且將透過聚光透鏡CD之光束LBb往+Yt(+Y)方向側進行90度之反射並導引至反射鏡M3b。 Returning to the description of FIGS. 5 and 6, the mirror M1 reflects the incident light beams LBa and LBb in the +Xt direction. The light beams LBa, LBb (each being a parallel beam) reflected by the mirror M1 are gradually separated from each other at a fixed opening angle in the XtYt plane as shown in FIG. The condensing lens CD is a lens that is a central axis of each of the light beams LBa and LBb from the mirror M1. The XtYt planes are parallel to each other, and the light beams LBa and LBb are each condensed at a predetermined focus position. The function of the condensing lens CD will be described below, and the front focus position of the condensing lens CD is set so as to be on or near the reflecting surface of the mirror M1. The triangular mirror M2 reflects the light beam LBa passing through the condenser lens CD toward the -Yt (-Y) direction side by 90 degrees and guides it to the mirror M3a, and transmits the light beam LBb transmitted through the condenser lens CD to +Yt (+ Y) The direction side is reflected by 90 degrees and guided to the mirror M3b.
反射鏡M3a將射入之光束LBa往+Xt方向側進行90度之反射。經反射鏡M3a反射之光束LBa，透過偏移光學構件(由平行平板形成之第1偏移光學構件)SRa及光束成形光學系統BFa而射入至反射鏡M4。反射鏡M3b將射入之光束LBb往+Xt方向側進行90度之反射。經反射鏡M3b反射之光束LBb，透過偏移光學構件(由平行平板形成之第2偏移光學構件)SRb及光束成形光學系統BFb而射入至反射鏡M4。藉由三角反射鏡M2與反射鏡M3a、M3b，使Yt方向上之透過聚光透鏡CD後的光束LBa、LBb的各中心軸之距離擴大。偏移光學構件SRa、SRb在與光束LBa、LBb的前進方向正交之平面(YtZt平面)內，調整光束LBa、LBb的中心位置。偏移光學構件SRa、SRb，具有與YtZt平面平行之兩塊石英平行板，一塊平行板可繞Yt軸傾斜，另一塊平行板可繞Zt軸傾斜。上述兩塊平行板分別繞Yt軸、Zt軸傾斜，藉此，在與光束LBa、LBb的前進方向正交之YtZt平面中，二維地對光束LBa、LBb的中心之位置進行微量偏移。上述兩塊平行板於控制裝置18的控制下，由未圖示之致動器(驅動部)驅動。光束成形光學系統BFa、BFb係成形光束LBa、LBb之光學系統，例如使藉由聚光透鏡CD聚光之光束LBa、LBb的直徑成形為預定大小之直徑。 The mirror M3a reflects the incident light beam LBa toward the +Xt direction side by 90 degrees. The light beam LBa reflected by the mirror M3a is incident on the mirror M4 through the offset optical member (the first offset optical member formed by the parallel flat plate) SRa and the beam shaping optical system BFa. The mirror M3b reflects the incident light beam LBb by 90 degrees toward the +Xt direction side. The light beam LBb reflected by the mirror M3b is incident on the mirror M4 through the offset optical member (the second offset optical member formed by the parallel flat plate) SRb and the beam shaping optical system BFb. The distance between the central axes of the light beams LBa and LBb transmitted through the condensing lens CD in the Yt direction is increased by the triangular mirror M2 and the mirrors M3a and M3b. The offset optical members SRa and SRb adjust the center positions of the light beams LBa and LBb in a plane (YtZt plane) orthogonal to the traveling directions of the light beams LBa and LBb. The offset optical members SRa, SRb have two quartz parallel plates parallel to the YtZt plane, one parallel plate can be inclined about the Yt axis, and the other parallel plate can be tilted about the Zt axis. The two parallel plates are inclined around the Yt axis and the Zt axis, respectively, whereby the positions of the centers of the light beams LBa and LBb are two-dimensionally shifted in the YtZt plane orthogonal to the advancing directions of the light beams LBa and LBb. The two parallel plates are driven by an actuator (drive unit) (not shown) under the control of the control unit 18. The beam shaping optical systems BFa and BFb are optical systems for shaping the light beams LBa and LBb. For example, the diameters of the light beams LBa and LBb condensed by the condensing lens CD are formed into a diameter of a predetermined size.
如圖5所示，反射鏡M4使來自光束成形光學系統BFa、BFb之光束LBa、LBb往-Zt方向反射。經反射鏡M4反射之光束LBa、LBb，透過第1柱面透鏡CY1而射入至反射鏡M5。反射鏡M5將來自反射鏡M4之光束LBa、LBb往-Xt方向進行反射並使該光束LBa、LBb射入至多面鏡PM的各個反射面RP。光束LBa從第1方向射入至多面鏡PM的第1反射面RP，光束LBb從與第1方向不同之第2方向射入至多面鏡PM的其他的第2反射面RP。 As shown in FIG. 5, the mirror M4 reflects the light beams LBa and LBb from the beam shaping optical systems BFa and BFb in the -Zt direction. The light beams LBa and LBb reflected by the mirror M4 are incident on the mirror M5 through the first cylindrical lens CY1. The mirror M5 reflects the light beams LBa and LBb from the mirror M4 in the -Xt direction and causes the light beams LBa and LBb to enter the respective reflection surfaces RP of the polygon mirror PM. The light beam LBa is incident on the first reflection surface RP of the polygon mirror PM from the first direction, and the light beam LBb is incident on the other second reflection surface RP of the polygon mirror PM from the second direction different from the first direction.
多面鏡PM將射入之光束LBa、LBb往fθ透鏡FTa、FTb進行反射。為了使光束LBa、LBb的光點SPa、SPb於基板P的被照射面上進行掃描，多面鏡PM以使射入之光束LBa、LBb偏向之方式進行反射。藉此，因多面鏡PM旋轉，光束LBa、LBb在與XtYt平面平行之面內，一維地進行偏向掃描。具體而言，多面鏡PM係旋轉多面鏡，其具有沿著Zt軸方向延伸之旋轉軸AXp、與以圍繞旋轉軸AXp之方式繞旋轉軸AXp配置之複數個反射面RP。於第1實施形態中，多面鏡PM為具有8個與Zt軸平行之反射面RP且具有正八邊形之形狀的旋轉多面鏡。以旋轉軸AXp為中心而使該多面鏡PM往既定之旋轉方向旋轉，藉此，能夠使照射至反射面RP之脈衝狀的光束LBa、LBb的反射角連續地產生變化。藉此，能夠分別藉由第1反射面RP與第2反射面RP而將光束LBa、LBb的反射方向偏向，使照射至基板P的被照射面上之光束LBa、LBb的光點SPa、SPb沿著主掃描方向進行掃描。 The polygon mirror PM reflects the incident light beams LBa and LBb toward the fθ lenses FTa and FTb. In order to scan the light spots SPa and SPb of the light beams LBa and LBb on the illuminated surface of the substrate P, the polygon mirror PM reflects the incident light beams LBa and LBb. Thereby, since the polygon mirror PM rotates, the light beams LBa and LBb are deflected one-dimensionally in a plane parallel to the XtYt plane. Specifically, the polygon mirror PM-based rotating polygon mirror has a rotation axis AXp extending in the Zt-axis direction and a plurality of reflection faces RP disposed around the rotation axis AXp around the rotation axis AXp. In the first embodiment, the polygon mirror PM is a rotating polygon mirror having eight reflective surfaces RP parallel to the Zt axis and having a regular octagonal shape. By rotating the polygon mirror PM in a predetermined rotation direction around the rotation axis AXp, the reflection angles of the pulsed light beams LBa and LBb irradiated to the reflection surface RP can be continuously changed. Thereby, the reflection directions of the light beams LBa and LBb can be deflected by the first reflection surface RP and the second reflection surface RP, respectively, and the light spots SPa and SPb of the light beams LBa and LBb irradiated onto the irradiation surface of the substrate P can be made. Scan along the main scan direction.
多面鏡PM的一個反射面RP，由於使光束LBa、LBb均進行偏向掃描，因此能夠使光點SPa、SPb沿著描繪線SL2a、SL2b進行掃描。 因此，多面鏡PM旋轉一周，則沿著基板P的被照射面上的描繪線SL2a、SL2b的光點SPa、SPb之掃描次數最大為與反射面RP的數量相同之8次。多面鏡PM藉由包含馬達等之多面鏡驅動部而以固定速度旋轉。藉由該多面鏡驅動部，多面鏡PM的旋轉受控制裝置18控制。 Since one of the reflection surfaces RP of the polygon mirror PM is deflected by the light beams LBa and LBb, the light spots SPa and SPb can be scanned along the drawing lines SL2a and SL2b. Therefore, when the polygon mirror PM rotates once, the number of scans of the spots SPa and SPb along the drawing lines SL2a and SL2b on the illuminated surface of the substrate P is at most eight times the same as the number of the reflection faces RP. The polygon mirror PM is rotated at a fixed speed by a polygon mirror driving portion including a motor or the like. The rotation of the polygon mirror PM is controlled by the control device 18 by the polygon mirror driving unit.
另外，當將描繪線SL2a、SL2b的長度例如設為30mm，使3μm之光點SPa、SPb以各重疊1.5μm之方式而脈衝發光，並且將光點SPa、SPb沿著描繪線SL2a、SL2b照射至基板P的被照射面上時，以一次掃描照射之光點SP的數量(脈衝發光數)為20000(30mm/1.5μm)。又，若將沿著描繪線SL2a、SL2b之光點SPa、SPb之掃描時間設為200μsec，則於此期間，必須進行20000次照射脈衝狀的光點SP，因此，光源裝置14之發光頻率Fs為Fs≧20000次/200μsec=100MHz。 Further, when the lengths of the drawing lines SL2a and SL2b are set to, for example, 30 mm, the light spots SPa and SPb of 3 μm are pulse-emitted so as to overlap by 1.5 μm, and the light spots SPa and SPb are irradiated along the drawing lines SL2a and SL2b. When the surface of the substrate P is irradiated, the number of spots SP (pulse emission number) irradiated by one scan is 20,000 (30 mm/1.5 μm). In addition, when the scanning time of the light spots SPa and SPb along the drawing lines SL2a and SL2b is 200 μsec, it is necessary to perform the irradiation of the spot SP of 20,000 times in this period. Therefore, the light-emitting frequency Fs of the light source device 14 is obtained. It is 20,000 times for Fs / 200 μsec = 100 MHz.
第1柱面透鏡CY1，在與由多面鏡PM產生之掃描方向(旋轉方向)正交之非掃描方向(Zt方向)上，使射入之光束LBa、LBb收斂於多面鏡PM的反射面RP上。即使存在如下情形(反射面RP相對於XtYt平面的法線即Zt軸傾斜)，亦能夠抑制其影響，該情形係指因該母線與Yt方向平行之第1柱面透鏡CY1、及後述之第2柱面透鏡CY2a、CY2b，而使反射面RP相對於Zt方向傾斜。例如，能夠抑制照射至基板P的被照射面上之光束LBa、LBb的光點SPa、SPb(描繪線SL2a、SL2b)之照射位置，因多面鏡PM的各反射面RP之極小之斜度誤差而於Xt方向上偏移。 The first cylindrical lens CY1 converges the incident light beams LBa and LBb on the reflection surface RP of the polygon mirror PM in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) generated by the polygon mirror PM. on. Even if there is a case where the reflection surface RP is inclined with respect to the normal line of the XtYt plane, that is, the Zt axis, the influence can be suppressed. This case refers to the first cylindrical lens CY1 which is parallel to the Yt direction of the bus bar, and the following description. The cylindrical lenses CY2a and CY2b incline the reflection surface RP with respect to the Zt direction. For example, it is possible to suppress the irradiation position of the light spots SPa and SPb (drawing lines SL2a, SL2b) of the light beams LBa and LBb irradiated onto the illuminated surface of the substrate P, and the inclination error of each reflection surface RP of the polygon mirror PM is extremely small. It is offset in the Xt direction.
詳細而言，多面鏡PM將射入之光束LBa往-Yt(-Y)方向側進行反射並導引至反射鏡M6a。又，多面鏡PM將射入之光束LBb往+Yt(+Y)方向側進行反射並導引至反射鏡M6b。反射鏡M6a將射入之光束LBa往-Xt 方向側進行反射並導引至具有沿著Xt軸方向延伸之光軸AXfa的fθ透鏡FTa。反射鏡M6b將射入之光束LBb往-Xt方向側進行反射並導引至具有沿著Xt軸方向延伸之光軸AXfb(與光軸AXfa平行)的fθ透鏡FTb。 In detail, the polygon mirror PM reflects the incident light beam LBa toward the -Yt (-Y) direction side and guides it to the mirror M6a. Further, the polygon mirror PM reflects the incident light beam LBb toward the +Yt (+Y) direction side and guides it to the mirror M6b. Mirror M6a will inject the beam LBa to -Xt The direction side is reflected and guided to the fθ lens FTa having the optical axis AXfa extending in the Xt-axis direction. The mirror M6b reflects the incident light beam LBb toward the -Xt direction side and guides it to the fθ lens FTb having the optical axis AXfb (parallel to the optical axis AXfa) extending in the Xt-axis direction.
fθ(f-θ)透鏡FTa、FTb為遠心系統的掃描透鏡，其於XtYt平面中，將經反射鏡M6a、M6b反射之來自多面鏡PM之光束LBa、LBb，以與光軸AXfa、AXfb平行之方式投射至反射鏡M7a、M7b。反射鏡M7a將射入之光束LBa朝向基板P的被照射面並往-Zt方向進行反射，反射鏡M7b將射入之光束LBb朝向基板P的被照射面並往-Zt方向進行反射。經反射鏡M7a反射之光束Lba，透過第2柱面透鏡CY2a而投射至基板P的被照射面，經反射鏡M7b反射之光束LBb，透過第2柱面透鏡CY2b而投射至基板P的被照射面。藉由該fθ透鏡FTa及母線與Yt方向平行之第2柱面透鏡CY2a，投射至基板P之光束LBa於基板P的被照射面上，收斂為有效直徑為數μm左右(例如3μm)之微小之光點SPa。同樣地，藉由fθ透鏡FTb及母線與Yt方向平行之第2柱面透鏡CY2b，投射至基板P之光束LBb於基板P的被照射面上，收斂為有效直徑為數μm左右(例如3μm)之微小之光點SPb。投射至該基板P的被照射面上之光點SPa、SPb，藉由一個多面鏡PM旋轉而沿著於主掃描方向(Yt方向、Y方向)延伸之描繪線SL2a、SL2b同時一維地掃描。 The fθ(f-θ) lens FTa, FTb is a scanning lens of a telecentric system, and in the XtYt plane, the light beams LBa, LBb from the polygon mirror PM reflected by the mirrors M6a, M6b are parallel to the optical axes AXfa, AXfb The method is projected to the mirrors M7a, M7b. The mirror M7a reflects the incident light beam LBa toward the illuminated surface of the substrate P in the -Zt direction, and the mirror M7b reflects the incident light beam LBb toward the illuminated surface of the substrate P in the -Zt direction. The light beam Lba reflected by the mirror M7a is projected onto the illuminated surface of the substrate P through the second cylindrical lens CY2a, and the light beam LBb reflected by the mirror M7b is transmitted through the second cylindrical lens CY2b and projected onto the substrate P. surface. By the fθ lens FTa and the second cylindrical lens CY2a in which the bus bar is parallel to the Yt direction, the light beam LBa projected onto the substrate P converges on the illuminated surface of the substrate P, and converges to a small diameter of about several μm (for example, 3 μm). Spot SPa. Similarly, the light beam LBb projected onto the substrate P by the fθ lens FTb and the second cylindrical lens CY2b in which the bus bar is parallel to the Yt direction converges on the illuminated surface of the substrate P to have an effective diameter of about several μm (for example, 3 μm). Tiny light spot SPb. The light spots SPa and SPb projected onto the illuminated surface of the substrate P are simultaneously scanned one-dimensionally along the drawing lines SL2a, SL2b extending in the main scanning direction (Yt direction, Y direction) by one polygon mirror PM rotation. .
往fθ透鏡FTa、FTb射入之光束的入射角θ(相對於光軸之角度)，會根據多面鏡PM的旋轉角(θ/2)而改變。fθ透鏡FTa，將光束LBa的光點SPa投射至與光束LBa的入射角成比例之基板P的被照射面上之像高位置。同樣地，fθ透鏡FTb，將光束LBb的光點SPb投射至與光束LBb 的入射角成比例之基板P的被照射面上之像高位置。若將焦點距離設為f，將像高位置設為y，則fθ透鏡FTa、FTb具有y=f×θ之關係(畸變像差(distortion))。因此，可藉由該fθ透鏡FTa、FTb，使光束LBa、LBb的光點SPa、SPb沿著Yt方向(Y方向)正確地進行等速掃描。當往fθ透鏡FTa、FTb射入之光束LBa、LBb的入射角θ為0度時，射入至fθ透鏡FTa、FTb之光束LBa、LBb沿著光軸AXfa、AXfb上前進。 The incident angle θ (the angle with respect to the optical axis) of the light beam incident on the fθ lenses FTa and FTb changes depending on the rotation angle (θ/2) of the polygon mirror PM. The fθ lens FTa projects the spot SPa of the light beam LBa to the image height position on the illuminated surface of the substrate P which is proportional to the incident angle of the light beam LBa. Similarly, the fθ lens FTb projects the spot SPb of the light beam LBb to the light beam LBb. The incident angle is proportional to the image height position of the illuminated surface of the substrate P. When the focal length is f and the image height is y, the fθ lenses FTa and FTb have a relationship of y=f×θ (distortion). Therefore, the light spots SPa and SPb of the light beams LBa and LBb can be accurately scanned in the Yt direction (Y direction) by the fθ lenses FTa and FTb. When the incident angle θ of the light beams LBa and LBb incident on the fθ lenses FTa and FTb is 0 degrees, the light beams LBa and LBb incident on the fθ lenses FTa and FTb advance along the optical axes AXfa and AXfb.
以上之聚光透鏡CD、三角反射鏡M2、反射鏡M3a、偏移光學構件SRa、光束成形光學系統BFa、反射鏡M4、第1柱面透鏡CY1及反射鏡M5，係作為從第1方向朝多面鏡PM導引光束LBa之第1導光光學系統20而發揮功能。又，聚光透鏡CD、三角反射鏡M2、反射鏡M3b、偏移光學構件SRb、光束成形光學系統BFb、反射鏡M4、第1柱面透鏡CY1及反射鏡M5，係作為從與第1方向不同之第2方向朝多面鏡PM導引光束LBb之第2導光光學系統22而發揮功能。另外，雖將聚光透鏡CD、三角反射鏡M2、反射鏡M4、第1柱面透鏡CY1及反射鏡M5設為第1導光光學系統20與第2導光光學系統22共通之構件，但亦可按第1導光光學系統20與第2導光光學系統22而個別地設置該等構件中的至少一部分。又，反射鏡M6a、fθ透鏡FTa、反射鏡M7a及第2柱面透鏡CY2a，係作為第1投射光學系統24而發揮功能，該第1投射光學系統24係使由多面鏡PM反射之光束LBa聚光並作為光點SPa而投射至描繪線SL2a(SLa)上。同樣地，反射鏡M6b、fθ透鏡FTb、反射鏡M7b及第2柱面透鏡CY2b，係作為第2投射光學系統26而發揮功能，該第2投射光學系統26係使由多面鏡PM反射之光束LBb聚光並作為光點SPb而投射至描繪線SL2b(SLb)上。該第1投 射光學系統24與第2投射光學系統26，係以如下方式配置，即，使描繪線SLa、SLb於副掃描方向上處於相同位置且於主掃描方向上分隔。又，以使描繪線SLa、SLb於主掃描方向上以掃描長度以下之間隔分隔之方式配置第1投射光學系統24與第2投射光學系統26。 The above condensing lens CD, triangular mirror M2, mirror M3a, offset optical member SRa, beam shaping optical system BFa, mirror M4, first cylindrical lens CY1, and mirror M5 are oriented from the first direction toward The polygon mirror PM guides the first light guiding optical system 20 of the light beam LBa to function. Further, the condenser lens CD, the triangular mirror M2, the mirror M3b, the offset optical member SRb, the beam shaping optical system BFb, the mirror M4, the first cylindrical lens CY1, and the mirror M5 are used as the first direction and the first direction. The second direction different from the polygon mirror PM guide beam LBb functions in the second direction. In addition, the condensing lens CD, the triangular mirror M2, the mirror M4, the first cylindrical lens CY1, and the mirror M5 are members common to the first light guiding optical system 20 and the second light guiding optical system 22, but At least a part of the members may be individually provided in the first light guiding optical system 20 and the second light guiding optical system 22. Further, the mirror M6a, the fθ lens FTa, the mirror M7a, and the second cylindrical lens CY2a function as the first projection optical system 24, and the first projection optical system 24 is a light beam LBa reflected by the polygon mirror PM. The light is collected and projected onto the drawing line SL2a (SLa) as the light spot SPa. Similarly, the mirror M6b, the fθ lens FTb, the mirror M7b, and the second cylindrical lens CY2b function as the second projection optical system 26, and the second projection optical system 26 is a beam that is reflected by the polygon mirror PM. The LBb is condensed and projected onto the drawing line SL2b (SLb) as the spot SPb. The first vote The optical system 24 and the second projection optical system 26 are arranged such that the drawing lines SLa and SLb are at the same position in the sub-scanning direction and are separated in the main scanning direction. In addition, the first projection optical system 24 and the second projection optical system 26 are disposed such that the drawing lines SLa and SLb are spaced apart at intervals of the scanning length in the main scanning direction.
於本第1實施形態之情形下，即使當使光束LBa、LBb射入至反射鏡M1上的旋動中心軸AXr通過之位置時，光束LBa、LBb亦不會與旋動中心軸AXr平行地射入至反射鏡M1，而是如圖8所示，以相對於旋動中心軸AXr以固定斜度於反射鏡M1上(或其附近)交叉之方式射入。因此，若描繪單元U2整體繞旋動中心軸AXr旋動，則光束LBa、LBb相對於反射鏡M1之入射角度相對地產生變化。藉此，描繪單元U2內之經反射鏡M1反射之光束LBa、LBb的反射方向，根據描繪單元U2繞旋動中心軸AXr之旋動而二維地產生變化。 In the case of the first embodiment, even when the light beams LBa and LBb are incident on the position where the rotational central axis AXr of the mirror M1 passes, the light beams LBa and LBb are not parallel to the rotational central axis AXr. The light is incident on the mirror M1, but is incident as shown in FIG. 8 so as to intersect the mirror M1 at a fixed inclination with respect to the rotational center axis AXr (or its vicinity). Therefore, when the drawing unit U2 is rotated about the entire rotation center axis AXr, the incident angles of the light beams LBa and LBb with respect to the mirror M1 relatively change. Thereby, the reflection directions of the light beams LBa and LBb reflected by the mirror M1 in the drawing unit U2 are two-dimensionally changed according to the rotation of the drawing unit U2 around the rotation center axis AXr.
圖9、圖10係誇張地顯示描繪單元U2未繞旋動中心軸AXr旋動之初始位置狀態、與描繪單元U2從初始位置旋動△θz後之狀態下的描繪單元U2內之光束LBa的反射方向的變化(光束前進路徑的變化)之圖。圖9係於XtZt面內觀察反射鏡(反射構件)M1與聚光透鏡CD之配置關係之圖，圖10係於XtYt面內觀察反射鏡M1與聚光透鏡CD之配置關係之圖。另外，描繪單元U2內之光束LBb的反射方向於描繪單元U2繞旋動中心軸AXr旋動時產生變化之原理，與光束LBa之情形相同，因此僅針對光束LBa進行說明。此處，聚光透鏡CD的光軸AXc，係設定為於反射鏡M1的反射面(相對於XtYt面設定為45°)上與旋動中心軸AXr交叉，反射鏡M1的反射面設定於聚光透鏡CD的前側焦點距離fa的位置。進一步地，光束LBa、 LBb，於聚光透鏡CD的後側焦點距離fb的位置之面Pcd(後側焦點面)，以達到光束腰寬(最小直徑)之方式收斂之後發散。於圖9、圖10中，以實線所示之光束LBa-1，表示描繪單元U2整體未旋轉之初始位置狀態，也就是描繪線SL2a與Yt(Y)方向平行之狀態時之光束LBa。以兩點鏈線所示之光束LBa-2，表示描繪單元U2整體繞旋動中心軸AXr旋動△θz後之狀態時之光束LBa。 9 and FIG. 10 are exaggeratedly showing the initial position state in which the drawing unit U2 is not rotated about the rotation center axis AXr, and the light beam LBa in the drawing unit U2 in a state where the drawing unit U2 is rotated by Δθz from the initial position. A diagram of the change in the direction of reflection (the change in the path of the beam). Fig. 9 is a view showing the arrangement relationship between the mirror (reflecting member) M1 and the collecting lens CD in the XtZt in-plane view, and Fig. 10 is a view showing the arrangement relationship between the mirror M1 and the collecting lens CD in the XtYt plane. Further, the principle in which the reflection direction of the light beam LBb in the drawing unit U2 is changed when the drawing unit U2 is rotated around the rotation center axis AXr is the same as that in the case of the light beam LBa, and therefore only the light beam LBa will be described. Here, the optical axis AXc of the condenser lens CD is set so as to intersect the rotation center axis AXr on the reflection surface (set to 45° with respect to the XtYt plane) of the mirror M1, and the reflection surface of the mirror M1 is set to be gathered. The front focal point of the optical lens CD is at a position away from the fa. Further, the light beam LBa, LBb, the surface Pcd (rear focus surface) at the position of the rear focal length fb of the condenser lens CD converges to reach the beam waist width (minimum diameter) and then diverges. In FIGS. 9 and 10, the light beam LBa-1 shown by the solid line indicates the initial position state in which the drawing unit U2 is not rotated as a whole, that is, the light beam LBa when the drawing line SL2a and the Yt (Y) direction are parallel. The light beam LBa-2 indicated by the two-dot chain line indicates the light beam LBa when the drawing unit U2 is rotated around the center axis AXr by Δθz.
當描繪單元U2繞旋動中心軸AXr旋動時，光束LBa(LBb)相對於反射鏡M1的反射面之相對性的入射角度產生變化。如圖10所示，若將投射至反射鏡M1之前的反射鏡M8的反射面上之光束LBa設為LBa(M8)，則根據圖8之光束配向狀態可知：於初始位置狀態下，XtYt面內之投射至反射鏡M1上之光束LBa與光束LBa(M8)的各位置，在與Yt軸平行之方向上分隔。於描繪單元U2整體從初始位置狀態旋轉(傾斜)角度△θz之情形時，若從反射鏡M1觀察，則反射鏡M8上的光束LBa(M8)之位置對應於角度△θz而相對地於Xt方向上偏移(實際上繞旋動中心軸AXr旋轉)。 When the drawing unit U2 is rotated about the rotation center axis AXr, the incident angle of the relative angle of the light beam LBa (LBb) with respect to the reflection surface of the mirror M1 changes. As shown in FIG. 10, if the light beam LBa on the reflecting surface of the mirror M8 before being projected onto the mirror M1 is LBa (M8), it can be seen from the state of the beam alignment of FIG. 8 that the XtYt surface is in the initial position state. The respective positions of the light beam LBa and the light beam LBa (M8) projected onto the mirror M1 are separated in a direction parallel to the Yt axis. When the drawing unit U2 is rotated (tilted) by the angle Δθz from the initial position state, the position of the light beam LBa (M8) on the mirror M8 corresponds to the angle Δθz and is relatively opposite to Xt when viewed from the mirror M1. Offset in direction (actually around the rotation center axis AXr).
藉此，於初始位置狀態時經反射鏡M1反射之光束LBa-1的光路(中心線)，在描繪單元U2整體旋轉角度△θz之後，成為光束LBa-2並於XtYt面內傾斜。另外，於圖10中，XtYt面內的初始位置狀態時之光束LBa-1的中心線與聚光透鏡CD的光軸AXc之交叉角，與圖8所示之YtZt面內的光束LBa的中心線與旋動中心軸AXr之交叉角一致。因此，後側焦點面Pcd內的初始位置狀態下之光束LBa-1的收斂位置BW1，在描繪單元U2整體旋轉角度△θz之後，作為後側焦點面Pcd內的光束LBa-2的收斂位置BW2，在Yr方向上位置錯開(平行偏移)△Yh。根據與角度△θz之間的 △Yh=fy(△θz)之幾何學關係式，唯一地求出該位置偏移量△Yh。另外，從聚光透鏡CD朝向後側焦點面Pcd之光束LBa-1與光束LBa-2的各中心線，均與光軸AXc平行。 Thereby, the optical path (center line) of the light beam LBa-1 reflected by the mirror M1 in the initial position state becomes the light beam LBa-2 and is inclined in the XtYt plane after the entire drawing unit U2 is rotated by the angle Δθz. Further, in Fig. 10, the intersection angle between the center line of the light beam LBa-1 and the optical axis AXc of the collecting lens CD in the initial position state in the XtYt plane, and the center of the light beam LBa in the YtZt plane shown in Fig. 8 The line coincides with the angle of intersection of the central axis AXr of the rotation. Therefore, the convergence position BW1 of the light beam LBa-1 in the initial position state in the rear side focal plane Pcd is the convergence position BW2 of the light beam LBa-2 in the rear side focal plane Pcd after the entire rotation angle Δθz of the drawing unit U2. In the Yr direction, the position is shifted (parallel offset) ΔYh. According to the angle Δθz The geometric relationship of ΔYh=fy(Δθz) is used to uniquely determine the positional shift amount ΔYh. Further, each of the center lines of the light beam LBa-1 and the light beam LBa-2 from the condenser lens CD toward the rear focal plane Pcd is parallel to the optical axis AXc.
另一方面，如圖9誇張所示，若於XtZt面內觀察使描繪單元U2整體從初始位置狀態旋轉角度△θz之後的光束LBa-2之配向狀態，則射入至反射鏡M1之光束LBa的中心線相對於旋動中心軸AXr在Yt方向上傾斜，因此，光束LBa-2從旋轉角度△θz之後的反射鏡M1，相對於初始位置狀態下之光束LBa-1(與光軸AXc平行)向Zt軸方向傾斜地前進並射入至聚光透鏡CD。因此，後側焦點面Pcd內的初始位置狀態下之光束LBa-1的收斂位置BW1，在描繪單元U2整體旋轉角度△θz之後，作為後側焦點面Pcd內的光束LBa-2的收斂位置BW2，向Zt方向位置錯開(平行偏移)△Zh。根據與角度△θz之間的△Zh=fz(△θz)之幾何學關係式，唯一地求出該位置偏移量△Zh。另外，於本第1實施形態之構成中，Zt軸方向之位置偏移量△Zh大於Yt軸方向之位置偏移量△Yh。以上的作用對於光束LBb而言亦相同，在使描繪單元U2整體旋轉角度△θz之後，藉由聚光透鏡CD而收斂之後側焦點面Pcd內的光束LBb-2的位置，相對於後側焦點面Pcd內的初始位置狀態時之光束LBb-1的位置，在Yt方向與Zt方向上位置偏移。 On the other hand, as shown in FIG. 9 exaggeratedly, if the alignment state of the light beam LBa-2 after the entire drawing unit U2 is rotated by the angle Δθz from the initial position state is observed in the XtZt plane, the light beam LBa incident on the mirror M1 is observed. The center line is inclined in the Yt direction with respect to the rotation center axis AXr, and therefore, the beam LLB-2 is rotated from the mirror M1 after the rotation angle Δθz to the beam LBa-1 in the initial position state (parallel to the optical axis AXc) ) is advanced obliquely in the Zt axis direction and incident on the collecting lens CD. Therefore, the convergence position BW1 of the light beam LBa-1 in the initial position state in the rear side focal plane Pcd is the convergence position BW2 of the light beam LBa-2 in the rear side focal plane Pcd after the entire rotation angle Δθz of the drawing unit U2. , the position is shifted (parallel offset) ΔZh in the Zt direction. The positional shift amount ΔZh is uniquely obtained from the geometric relationship of ΔZh=fz (Δθz) between the angle Δθz. Further, in the configuration of the first embodiment, the positional shift amount ΔZh in the Zt-axis direction is larger than the positional shift amount ΔYh in the Yt-axis direction. The above operation is also the same for the light beam LBb. After the entire drawing unit U2 is rotated by the angle Δθz, the position of the light beam LBb-2 in the rear focal plane Pcd is converged by the condensing lens CD, with respect to the rear focus. The position of the light beam LBb-1 at the initial position state in the plane Pcd is shifted in the Yt direction from the Zt direction.
如上所述，於本第1實施形態中，因具備如反射鏡M1的反射面處於前側焦點距離fa的位置之聚光透鏡CD，而能夠始終使從聚光透鏡CD射出之光束LBa-2(LBb-2)的中心線與光束LBa-1(LBb-1)的中心線平行。因此，藉由聚光透鏡CD之後配置之偏移光學構件SRa、SRb的斜度調整，以使描繪單元U2整體旋轉角度△θz之後所產生的光束LBa、LBb的位置 偏移量△Yh、△Zh為零之方式進行修正。藉此，能夠使兩條光束LBa、LBb沿著初始位置狀態時之光路而正確地通過之後的光學系統。藉由使用基於幾何學關係式即△Yh=fy(△θz)、△Zh=fz(△θz)而預先作成之角度△θz與斜度調整量的關係表等，能夠高速地執行偏移光學構件SRa、SRb的斜度調整。藉此，即使是描繪單元U2整體旋動之情形，亦能夠使光束LBa、LBb射入至多面鏡PM的反射面RP的適當位置。 As described above, in the first embodiment, since the condensing lens CD having the reflection surface of the mirror M1 at the position of the front focal length fa is provided, the light beam LBa-2 emitted from the condensing lens CD can be always used ( The center line of LBb-2) is parallel to the center line of the light beam LBa-1 (LBb-1). Therefore, the inclination of the offset optical members SRa, SRb disposed after the condensing lens CD is adjusted so that the position of the light beams LBa, LBb generated after the entire drawing unit U2 is rotated by the angle Δθz Correction is performed in such a manner that the offsets ΔYh and ΔZh are zero. Thereby, the two light beams LBa and LBb can be accurately passed through the subsequent optical system along the optical path in the initial position state. The offset optics can be executed at high speed by using a relationship table between the angle Δθz and the slope adjustment amount which are prepared in advance based on the geometric relationship, that is, ΔYh=fy (Δθz) and ΔZh=fz (Δθz). The inclination of the members SRa, SRb is adjusted. Thereby, even if the drawing unit U2 is integrally rotated, the light beams LBa and LBb can be incident on the appropriate position of the reflection surface RP of the polygon mirror PM.
另外，只要能夠使來自反射鏡M8之光束LBa、LBb在與旋動中心軸AXr相同之軸上射入至反射鏡M1，則光束LBa、LBb相對於反射鏡M1之入射角度不會因描繪單元U繞旋動中心軸AXr旋動而產生變化。因此，於描繪單元U內，經反射鏡M1反射之光束LBa、LBb的反射方向不會因描繪單元U之旋動而產生變化。使射入至反射鏡M1之兩條光束LBa、LBb處於同一軸上，且於反射鏡M1以後的描繪單元U2內，在空間上使兩條光束LBa、LBb分離之一個方法在於組成如下系統，係將偏振光束分光器(polarizing beam-splitter)等配置於反射鏡M1之後，對偏振狀態彼此正交之光束LBa、LBb進行同軸合成，使其射入至反射鏡M1，且利用偏振光束分光器等進行偏振分離。 Further, as long as the light beams LBa and LBb from the mirror M8 can be incident on the mirror M1 on the same axis as the rotation central axis AXr, the incident angles of the light beams LBa and LBb with respect to the mirror M1 are not caused by the drawing unit. U rotates around the central axis AXr to make a change. Therefore, in the drawing unit U, the reflection directions of the light beams LBa and LBb reflected by the mirror M1 are not changed by the rotation of the drawing unit U. One method of spatially separating the two light beams LBa and LBb in the drawing unit U2 after the mirror M1 is such that the two light beams LBa and LBb incident on the mirror M1 are on the same axis, and the following system is formed. After the polarizing beam-splitter or the like is disposed on the mirror M1, the light beams LBa and LBb orthogonal to each other are coaxially combined and injected into the mirror M1, and the polarizing beam splitter is used. The polarization separation is performed.
於圖9、圖10中以如下情形為例進行說明，該情形係使相對於旋動中心軸AXr以固定斜度且相對於旋動中心軸AXr對稱之光束LBa、LBb(平行光束)射入至反射鏡M1的相同位置，現針對使相對於旋動中心軸AXr在Yt方向上對稱且與旋動中心軸AXr彼此平行地配向之兩條光束LBa、LBb(平行光束)射入至反射鏡M1的情形進行說明。圖11A係從+Zt方向側誇張地顯示當使描繪單元U2整體繞旋動中心軸AXr旋動角度(既定角 度)△θz時，射入至反射鏡(反射構件)M1之光束LBa、LBb的反射方向產生變化的樣子之圖，圖11B係從光束LBa、LBb的前進方向側(+Xt方向側)觀察使描繪單元U2整體旋動角度△θz時之反射鏡M1中的光束LBa、LBb的位置變化之圖。 In FIGS. 9 and 10, a case will be described in which the light beams LBa and LBb (parallel beams) which are symmetric with respect to the rotation center axis AXr with a fixed inclination and with respect to the rotation center axis AXr are incident. To the same position of the mirror M1, the two beams LBa, LBb (parallel beams) which are symmetrical with respect to the central axis AXr in the Yt direction and aligned with the central axis AXr in parallel with each other are incident on the mirror. The case of M1 is explained. Fig. 11A is an exaggerated display from the +Zt direction side when the drawing unit U2 is integrally rotated around the central axis AXr (a predetermined angle) In the case of Δθz, the reflection directions of the light beams LBa and LBb incident on the mirror (reflecting member) M1 are changed, and FIG. 11B is observed from the traveling direction side (+Xt direction side) of the light beams LBa and LBb. A diagram showing changes in the positions of the light beams LBa and LBb in the mirror M1 when the drawing unit U2 is rotated by the entire angle Δθz.
另外，於圖11A中，正交座標系XtYtZt係針對描繪單元U2所設定之正交座標系，因此，描繪單元U2整體旋動角度△θz之後的正交座標系XtYtZt如以虛線所示，成為繞Zt軸傾斜角度△θz後之正交座標系。因此，於描繪單元U2未旋動之初始位置狀態時，沿著描繪線SL2之光點SP的主掃描方向(Yt方向)與Y方向平行，但於描繪單元U2整體旋動角度△θz之情形時，沿著旋動後之描繪單元U2的描繪線SL2之光點SP的主掃描方向(Yt方向)，相對於Y方向傾斜。又，如圖11A、圖11B所示，將以於兩條光束LBa、LBb的Yt方向的中間位置沿Xt方向延伸之方式設定、且與旋動中心軸AXr正交的線設為中心軸AXt。該中心軸AXt相當於前面的圖9、圖10中的聚光透鏡CD的光軸AXc。進一步地，如圖11A、圖11B所示，於經反射鏡M1反射之兩條光束LBa、LBb與中心軸AXt平行地前進之情形時，將前面的圖9、圖10中所說明之聚光透鏡CD改為較小直徑之聚光透鏡，且個別地設置於兩條光束LBa、LBb各自的光路中。 In addition, in FIG. 11A, the orthogonal coordinate system XtYtZt is an orthogonal coordinate system set by the drawing unit U2. Therefore, the orthogonal coordinate system XtYtZt after the entire rotation angle Δθz of the drawing unit U2 is indicated by a broken line. The orthogonal coordinate system after the angle Δθz is inclined around the Zt axis. Therefore, when the drawing unit U2 is not rotated in the initial position state, the main scanning direction (Yt direction) of the spot SP along the drawing line SL2 is parallel to the Y direction, but the drawing unit U2 is integrally rotated by the angle Δθz. At the time, the main scanning direction (Yt direction) of the spot SP of the drawing line SL2 of the drawing unit U2 after the rotation is inclined with respect to the Y direction. Further, as shown in FIG. 11A and FIG. 11B, a line which is set so that the intermediate position of the two light beams LBa and LBb in the Yt direction extends in the Xt direction and which is orthogonal to the rotation central axis AXr is set as the central axis AXt. . This central axis AXt corresponds to the optical axis AXc of the condensing lens CD in the foregoing FIGS. 9 and 10. Further, as shown in FIGS. 11A and 11B, when the two light beams LBa and LBb reflected by the mirror M1 are advanced in parallel with the central axis AXt, the condensing light described in the foregoing FIGS. 9 and 10 is used. The lens CD is changed to a condenser lens of a smaller diameter, and is separately provided in the respective optical paths of the two light beams LBa and LBb.
於圖11A中，以實線所示之反射鏡M1，係表示描繪單元U2未旋動之初始位置狀態、也就是描繪線SL2a、SL2b與Y方向平行之狀態時的反射鏡M1。又，以實線所示之光束LBa-1、LBb-1，係表示朝向初始位置狀態時的反射鏡M1之入射位置、及由該反射鏡M1往Xt軸方向反射之光束LBa、LBb。又，以兩點鏈線所示之反射鏡M1’，係誇張地表示描 繪單元U2旋動角度△θz之狀態時的反射鏡M1之配置。進一步地，以兩點鏈線所示之光束LBa-2、LBb-2，係表示描繪單元U2旋動角度△θz之狀態時的由反射鏡M1’反射之光束LBa、LBb。 In FIG. 11A, the mirror M1 shown by the solid line indicates the mirror M1 when the initial position state of the drawing unit U2 is not rotated, that is, when the drawing lines SL2a and SL2b are parallel to the Y direction. Further, the light beams LBa-1 and LBb-1 indicated by the solid lines indicate the incident position of the mirror M1 when facing the initial position state, and the light beams LBa and LBb reflected by the mirror M1 in the Xt-axis direction. Further, the mirror M1' shown by a two-dot chain line is exaggeratedly described. The arrangement of the mirror M1 when the drawing unit U2 rotates the state of the angle Δθz. Further, the light beams LBa-2 and LBb-2 indicated by the two-dot chain line indicate the light beams LBa and LBb reflected by the mirror M1' when the drawing unit U2 is in the state of the rotation angle Δθz.
當描繪單元U2旋動時，於XtYt平面中，由反射鏡M1’反射之光束LBa-2、LBb-2的反射方向亦根據描繪單元U2的旋動而旋轉。進一步地，光束LBa、LBb射入至反射鏡M1之相對位置(尤其是Zt方向之位置)因描繪單元U2之旋動而產生變化，因此，在與中心軸AXt垂直之平面Pv(與YtZt面平行)中，由反射鏡M1’反射之光束LBa-2、LBb-2的各中心線，如圖11B所示，與中心軸AXt平行，但位置繞中心軸AXt產生變化。 When the drawing unit U2 is rotated, in the XtYt plane, the reflection directions of the light beams LBa-2, LBb-2 reflected by the mirror M1' are also rotated in accordance with the rotation of the drawing unit U2. Further, the relative positions of the light beams LBa and LBb incident on the mirror M1 (especially the position in the Zt direction) are changed by the rotation of the drawing unit U2, and therefore, on the plane Pv (with the YtZt plane) perpendicular to the central axis AXt In parallel, the center lines of the light beams LBa-2 and LBb-2 reflected by the mirror M1' are parallel to the central axis AXt as shown in Fig. 11B, but the position changes around the central axis AXt.
如圖11B所示，於描繪單元U2為初始位置狀態時，由反射鏡M1反射之光束LBa-1、LBb-1，以往±Yt(Y)方向與中心軸AXt隔開固定距離之方式平行配置。然而，若描繪單元U2旋動角度△θz，則與此對應地，以中心軸AXt為中心而描繪出圓弧之方式，由反射鏡M1反射之光束LBa-2往-Zt方向及+Yt方向移動，由反射鏡M1反射之光束LBb-2往+Zt方向及-Yt方向移動。因此，將導致通過反射鏡M1之後的各光學構件之兩條光束LBa、LBb的各光路與初始位置狀態時之光路不同，而無法使光束LBa、LBb射入至多面鏡PM的反射面RP的適當位置。 As shown in FIG. 11B, when the drawing unit U2 is in the initial position state, the light beams LBa-1 and LBb-1 reflected by the mirror M1 are arranged in parallel with the central axis AXt by a fixed distance. . However, when the drawing unit U2 is rotated by the angle Δθz, the arc is reflected by the mirror M1 in the -Zt direction and the +Yt direction in such a manner that the arc is drawn around the central axis AXt. Moving, the light beam LBb-2 reflected by the mirror M1 moves in the +Zt direction and the -Yt direction. Therefore, the optical paths of the two light beams LBa and LBb of the optical members after passing through the mirror M1 are different from those of the initial position state, and the light beams LBa and LBb cannot be incident on the reflection surface RP of the polygon mirror PM. The right place.
然而，於本第1實施形態中，於反射鏡M1之後設置有偏移光學構件SRa、SRb，因此，能夠於平面Pv內，在Yt方向與Zt方向上二維地對光束LBa、LBb各自的中心線進行調整。因此，即使是描繪單元U2整體旋動之情形，亦能夠於描繪單元U2內的偏移光學構件SRa、SRb以後，將光束LBa、LBb各自的光路修正(調整)為描繪單元U未旋動之初始位置狀 態時的正確之光路。藉此，能夠使光束LBa、LBb射入至多面鏡PM的反射面RP的適當位置。 However, in the first embodiment, since the offset optical members SRa and SRb are provided after the mirror M1, the light beams LBa and LBb can be two-dimensionally aligned in the Yt direction and the Zt direction in the plane Pv. The center line is adjusted. Therefore, even if the drawing unit U2 is integrally rotated, the optical paths of the light beams LBa and LBb can be corrected (adjusted) to the drawing unit U after the offset optical members SRa and SRb in the drawing unit U2. Initial position The correct light path. Thereby, the light beams LBa and LBb can be incident on the appropriate position of the reflection surface RP of the polygon mirror PM.
另外，藉由三角反射鏡M2與反射鏡M3a、M3b，使由反射鏡M1反射之光束LBa、LBb的中心線在XtYt面內的Yt方向上之間隔擴大，因此，能夠縮短射入至描繪單元U2的反射鏡M1之兩條光束LBa、LBb的各中心線的間隔，且能夠使射入至描繪單元U2(反射鏡M1)之光束LBa、LBb靠近旋動中心軸AXr。其結果，即使是描繪單元Ub旋動之情形，亦能夠將平面Pv內的伴隨該旋動之光束LBa、LBb的各中心線的位置變化量抑制為較小。 Further, since the triangular mirror M2 and the mirrors M3a and M3b expand the interval between the center lines of the light beams LBa and LBb reflected by the mirror M1 in the Yt direction in the XtYt plane, the injection into the drawing unit can be shortened. The distance between the center lines of the two light beams LBa and LBb of the mirror M1 of U2 makes it possible to bring the light beams LBa and LBb incident on the drawing unit U2 (mirror M1) close to the rotation center axis AXr. As a result, even if the drawing unit Ub is rotated, the amount of change in the position of each center line accompanying the swirling light beams LBa and LBb in the plane Pv can be suppressed to be small.
而且，控制裝置18能夠基於使用對準顯微鏡AMa(AMa1~AMa4)、AMb(AMb1~AMb4)而檢測出之對準標記MK(MK1~MK4)的位置，檢測曝光區域W的傾斜(斜度)或歪斜(變形)。關於該曝光區域W的傾斜(斜度)或歪斜，例如存在有因捲繞於旋轉筒DR1、DR2而被搬送之基板P的長條方向相對於中心軸AXo1、AXo2傾斜或歪斜，而使曝光區域W傾斜或歪斜的情形。又，即使是捲繞於旋轉筒DR1、DR2而被搬送之基板P未傾斜或未歪斜之情形，當形成下層的圖案層時，有時會因基板P傾斜(傾倒)或歪斜地被搬送而導致曝光區域W自身歪斜。此外，有時亦會有因在前步驟中對基板P施加之熱影響，而導致基板P自身呈線性或非線性地產生變形。 Further, the control device 18 can detect the inclination (inclination) of the exposure region W based on the positions of the alignment marks MK (MK1 to MK4) detected using the alignment microscopes AMa (AMa1 to AMa4) and AMb (AMb1 to AMb4). Or skewed (deformed). In the inclination (inclination) or skew of the exposure region W, for example, the longitudinal direction of the substrate P conveyed by the rotation cylinders DR1 and DR2 is inclined or skewed with respect to the central axes AXo1 and AXo2, and the exposure is performed. The case where the area W is inclined or skewed. Moreover, even if the substrate P conveyed by the rotating cylinders DR1 and DR2 is not inclined or skewed, when the lower layer pattern layer is formed, the substrate P may be tilted (tilted) or skewed. This causes the exposure area W to be skewed by itself. Further, there is a case where there is a thermal influence exerted on the substrate P in the previous step, and the substrate P itself is deformed linearly or nonlinearly.
因此，控制裝置18，根據使用對準顯微鏡AMa(AMa1~AMb4)而檢測出之曝光區域W的整體或一部分的傾斜(斜度)或歪斜，使描繪單元U1、U2、U5、U6繞旋動中心軸AXr旋動。又，控制裝置18，根據使用對準顯微鏡AMb(AMb1~AMb4)而檢測出之曝光區域W的整體或一部分的傾 斜(斜度)或歪斜，使描繪單元U3、U4繞旋動中心軸AXr旋動。此時，控制裝置18，亦根據描繪單元U(U1~U6)的旋動角，驅動偏移光學構件SRa、SRb。 Therefore, the control device 18 rotates the drawing units U1, U2, U5, and U6 in accordance with the inclination (inclination) or skew of the entire or a part of the exposure region W detected using the alignment microscopes AMa (AMa1 to AMb4). The central axis AXr is rotated. Further, the control device 18 tilts the whole or a part of the exposure region W detected based on the alignment microscope AMb (AMb1 to AMb4). The inclination (inclination) or skew causes the drawing units U3, U4 to rotate about the rotation center axis AXr. At this time, the control device 18 also drives the offset optical members SRa, SRb according to the turning angle of the drawing unit U (U1 to U6).
具體而言，例如由於捲繞於旋轉筒DR1、DR2而被搬送之基板P傾斜(傾倒)或歪斜，因此需要對應於該傾斜(傾倒)、歪斜而使描繪之既定圖案亦傾斜或歪斜。又，作為其他例子，當重新將既定圖案重疊於下層圖案上而進行描繪時，需要對應於下層圖案的整體或一部分之傾斜或歪斜而使描繪之既定圖案亦傾斜或歪斜。因此，為了使描繪之既定圖案傾斜或歪斜，控制裝置18使描繪單元U(U1~U6)個別地旋動，從而使描繪線SLa、SLb相對於Y方向傾斜。 Specifically, for example, since the substrate P conveyed by the rotating cylinders DR1 and DR2 is inclined (tilted) or skewed, it is necessary to tilt or skew the predetermined pattern of the drawing in accordance with the inclination (tilting) and skew. Further, as another example, when the predetermined pattern is superimposed on the lower layer pattern and the drawing is performed, it is necessary to incline or skew the predetermined pattern of the drawing in accordance with the inclination or skew of the whole or a part of the lower layer pattern. Therefore, in order to tilt or skew the predetermined pattern to be drawn, the control device 18 individually rotates the drawing units U (U1 to U6) so that the drawing lines SLa and SLb are inclined with respect to the Y direction.
如此，於第1實施形態中，描繪單元U使用一個多面鏡PM而使光束LBa、LBb的光點SPa、SPb沿著描繪線SLa、SLb掃描，以使描繪線SLa、SLb在基板P上位於副掃描方向上之相同位置，且在主掃描方向上隔開之方式，配置第1投射光學系統24與第2投射光學系統26。進一步地，將描繪單元U的旋動中心軸設定於主掃描方向上之兩條描繪線SLa、SLb之間的位置，較佳為設定於將主掃描方向上之描繪線SLa、SLb各自的中點位置二等分之位置。 As described above, in the first embodiment, the drawing unit U scans the light spots SPa and SPb of the light beams LBa and LBb along the drawing lines SLa and SLb using one polygon mirror PM so that the drawing lines SLa and SLb are positioned on the substrate P. The first projection optical system 24 and the second projection optical system 26 are disposed at the same position in the sub-scanning direction and spaced apart in the main scanning direction. Further, the rotation central axis of the drawing unit U is set at a position between the two drawing lines SLa and SLb in the main scanning direction, and is preferably set in each of the drawing lines SLa and SLb in the main scanning direction. The position of the point is halved.
藉此，即使描繪單元U旋動，亦能夠抑制藉由描繪單元U掃描光束LBa、LBb的光點SPa、SPb之描繪線SLa、SLb在基板P上的位置偏移增大，且可簡單地對描繪線SLa、SLb的斜度進行調整。相反地，於以在主掃描方向上處於相同位置、且在副掃描方向上彼此隔開之方式設置有複數條掃描線之日本特開2004-117865號公報中，於使雷射掃描裝置旋動而對複數條掃描線之斜度進行調整之情形時，掃描線會以雷射掃描裝置的旋 動中心位置為中心而描繪出圓弧之方式移動。因此，掃描線越遠離旋動中心位置，則由雷射掃描裝置旋動引起之被照射體上的掃描線的位置偏移越大。亦即，於本第1實施形態中，由於以在副掃描方向上處於相同位置、且在主掃描方向上隔開之方式設定描繪線SLa、SLb，因此能夠不使由描繪單元U之旋動引起之基板P上的描繪線SLa、SLb的位置偏移過分地增大。又，由於能夠縮短描繪線SL的掃描長度，因此能夠穩定地維持描繪超詳細圖案所需之掃描線的配置精度或光學性能。 Thereby, even if the drawing unit U is rotated, it is possible to suppress the positional shift of the drawing lines SLa, SLb of the light spots SPa and SPb of the light beams LBa and LBb by the drawing unit U on the substrate P from increasing, and simply The inclination of the drawing lines SLa, SLb is adjusted. On the contrary, in the case of a plurality of scanning lines which are disposed at the same position in the main scanning direction and spaced apart from each other in the sub-scanning direction, the laser scanning device is rotated. When the slope of a plurality of scanning lines is adjusted, the scanning line is rotated by the laser scanning device. The center of the motion is centered and moves in a manner that depicts an arc. Therefore, the farther the scanning line is from the center of the rotation center, the larger the positional deviation of the scanning line on the irradiated body caused by the rotation of the laser scanning device. In other words, in the first embodiment, the drawing lines SLa and SLb are set so as to be at the same position in the sub-scanning direction and spaced apart in the main scanning direction, so that the drawing unit U can be prevented from being rotated. The positional deviation of the drawing lines SLa, SLb on the substrate P caused excessively increases. Moreover, since the scanning length of the drawing line SL can be shortened, the arrangement precision or optical performance of the scanning line required for drawing the super detailed pattern can be stably maintained.
以將描繪線SLa、SLb的各掃描長度設定為相同，並且在主掃描方向上以掃描長度以下之間隔分離設定描繪線SLa、SLb之方式，配置第1投射光學系統24與第2投射光學系統26。藉此，可藉由複數個描繪單元U，使各描繪單元U的描繪線SLa、SLb在主掃描方向上相接，並且能夠抑制基板P上之各描繪單元U的描繪線SLa、SLb的位置偏移增大，且可簡單地對描繪線SLa、SLb的斜度進行調整。 The first projection optical system 24 and the second projection optical system are disposed such that the scanning lines SLa and SLb are set to be the same, and the drawing lines SLa and SLb are separated by an interval of the scanning length or less in the main scanning direction. 26. Thereby, the drawing lines SLa and SLb of the respective drawing units U can be brought into contact in the main scanning direction by the plurality of drawing units U, and the positions of the drawing lines SLa and SLb of the respective drawing units U on the substrate P can be suppressed. The offset is increased, and the inclination of the drawing lines SLa, SLb can be simply adjusted.
描繪單元U的旋動中心軸AXr，係相對於基板P垂直地通過連接描繪單元U的描繪線SLa、SLb各自的中點之線段的中心點。藉此，能夠使伴隨描繪單元U的旋動之描繪線SLa、SLb的位置偏移為最小限度，且能夠簡單地對描繪線SLa、SLb的斜度進行調整。 The center axis of rotation AXr of the drawing unit U is perpendicularly connected to the center point of the line segment connecting the midpoints of the drawing lines SLa and SLb of the drawing unit U with respect to the substrate P. Thereby, the positional shift of the drawing lines SLa and SLb accompanying the drawing of the drawing unit U can be minimized, and the inclination of the drawing lines SLa and SLb can be easily adjusted.
來自光源裝置14之光束LBa、LBb，以相對於旋動中心軸AXr對稱之方式而射入至描繪單元U，因此，即使是描繪單元U繞旋動中心軸AXr旋動之情形，亦能夠抑制通過描繪單元U內之光束LBa、LBb的各中心線之位置偏移變大。 The light beams LBa and LBb from the light source device 14 are incident on the drawing unit U so as to be symmetrical with respect to the rotation center axis AXr. Therefore, even if the drawing unit U is rotated about the rotation center axis AXr, it can be suppressed. The positional shift of each center line of the light beams LBa and LBb in the drawing unit U becomes large.
描繪單元U於旋動中心軸AXr通過之位置具備反射鏡M1， 該反射鏡M1係對射入之光束LBa、LBb進行反射並導引至第1導光光學系統20及第2導光光學系統22。藉此，即使是描繪單元U旋動之情形，由於來自光源裝置14之光束LBa、LBb於描繪單元U內首先射入至反射鏡M1，因此能夠將光束LBa、LBb的光點SPa、SPb投射至描繪線SLa、SLb上。 The drawing unit U is provided with a mirror M1 at a position where the rotation center axis AXr passes, The mirror M1 reflects the incident light beams LBa and LBb and guides them to the first light guiding optical system 20 and the second light guiding optical system 22. Thereby, even if the drawing unit U is rotated, since the light beams LBa and LBb from the light source device 14 are first incident on the mirror M1 in the drawing unit U, the light spots SPa and SPb of the light beams LBa and LBb can be projected. Up to the drawing lines SLa, SLb.
第1導光光學系統20具備偏移光學構件SRa，該偏移光學構件SRa係使由反射鏡M1反射之光束LBa的位置在與光束LBa的前進方向交叉之平面上偏移，第2導光光學系統22具備偏移光學構件SRb，該偏移光學構件SRb係使由反射鏡M1反射之光束LBb的位置在與光束LBb的前進方向交叉之平面上偏移。藉此，即使是描繪單元U旋動之情形，亦能夠使光束LBa、LBb通過描繪單元U內的適當光路而射入至多面鏡PM。因此，能夠抑制因描繪單元U之旋動而使光點SPa、SPb未照射至基板P的被照射面、或光點SPa、SPb投射至偏離斜度調整後之描繪線SLa、SLb之位置等問題產生。 The first light guiding optical system 20 includes an offset optical member SRa that shifts the position of the light beam LBa reflected by the mirror M1 on a plane intersecting the traveling direction of the light beam LBa, and the second light guiding The optical system 22 is provided with an offset optical member SRb that shifts the position of the light beam LBb reflected by the mirror M1 on a plane intersecting the traveling direction of the light beam LBb. Thereby, even if the drawing unit U is rotated, the light beams LBa and LBb can be incident on the polygon mirror PM through the appropriate optical path in the drawing unit U. Therefore, it is possible to suppress the irradiation of the light-emitting points SPa and SPb onto the substrate P by the irradiation of the drawing unit U, or the projection of the light spots SPa and SPb to the positions of the drawing lines SLa and SLb after the deviation slope adjustment. The problem arises.
複數個描繪單元U，係以使各條描繪線SLa、SLb沿著主掃描方向(基板P的寬度方向)相接(接合)之方式配置。藉此，能夠使基板P的寬度方向上之可描繪範圍擴大。 The plurality of drawing units U are arranged such that the respective drawing lines SLa and SLb are in contact with each other in the main scanning direction (the width direction of the substrate P). Thereby, the drawable range in the width direction of the substrate P can be enlarged.
以使複數個描繪單元U中的既定數量之描繪單元U的描繪線SLa、SLb位於旋轉筒DR1的外周面所支承之基板P上，且使剩餘之描繪單元的描繪線SLa、SLb位於旋轉筒DR2的外周面所支承之基板P上的方式，配置複數個描繪單元U。藉此，無需將全部之描繪單元U配置於一個旋轉筒DR，使描繪單元U的配置自由度提高。另外，亦可設置3個以上之旋轉筒DR，對於3個以上之旋轉筒DR各自配置一個以上之描繪單元U。 The drawing lines SLa, SLb of a predetermined number of drawing units U in the plurality of drawing units U are located on the substrate P supported by the outer peripheral surface of the rotating cylinder DR1, and the drawing lines SLa, SLb of the remaining drawing units are located in the rotating cylinder A plurality of drawing units U are disposed so as to be on the substrate P supported by the outer peripheral surface of the DR2. Thereby, it is not necessary to arrange all the drawing units U in one rotating cylinder DR, and the degree of freedom in arrangement of the drawing unit U is improved. Further, three or more rotating cylinders DR may be provided, and one or more drawing units U may be disposed for each of the three or more rotating cylinders DR.
使描繪線SLa、SLb(描繪單元)旋動(傾斜)，以使應描繪於基板P的被照射面上之既定圖案傾斜。藉此，能夠使與基板P的搬送狀態或基板P的曝光區域W的形狀相對應之描繪之既定圖案的形狀產生變化。又，當重新將既定圖案重疊於基板P的被照射面上所預先形成之下層圖案上以進行描繪時，能夠基於下層圖案的整體或一部分的斜度、或非線性變形之測量結果，使描繪線SLa、SLb旋動(傾斜)。藉此，相對於形成於下層之圖案之重疊精度提高。 The drawing lines SLa and SLb (drawing units) are rotated (tilted) so as to be inclined in a predetermined pattern to be drawn on the illuminated surface of the substrate P. Thereby, the shape of the predetermined pattern which is drawn corresponding to the conveyance state of the board|substrate P, or the shape of the exposure area W of the board|substrate P can be changed. Further, when the predetermined pattern is superimposed on the illuminated surface of the substrate P and the lower layer pattern is formed in advance to perform the drawing, the drawing can be performed based on the measurement result of the whole or a part of the lower layer pattern or the nonlinear deformation. The lines SLa and SLb are rotated (tilted). Thereby, the superposition accuracy with respect to the pattern formed in the lower layer is improved.
另外，將各描繪單元U(U1~U6)的描繪線SLa、SLb配置於副掃描方向上之相同位置，但亦可配置於副掃描方向上之不同位置。總之，描繪線SLa、SLb只要在主掃描方向上彼此隔開即可。即使是該情形，旋動中心軸AXr亦相對於基板P的被照射面垂直地通過設定於描繪線SLa的中點與描繪線SLb的中點之間的點、或連接描繪線SLa與描繪線SLb的各中點之線段上所設定之中心點，因此，能夠使伴隨描繪單元U的旋動之描繪線SLa、SLb的位置偏移減小。 Further, the drawing lines SLa and SLb of the drawing units U (U1 to U6) are arranged at the same position in the sub-scanning direction, but they may be arranged at different positions in the sub-scanning direction. In short, the drawing lines SLa, SLb may be spaced apart from each other in the main scanning direction. Even in this case, the central axis of rotation AXr passes through a point set between the midpoint of the drawing line SLa and the midpoint of the drawing line SLb, or the drawing line SLa and the drawing line, perpendicularly to the illuminated surface of the substrate P. The center point set on the line segment of each midpoint of the SLb can reduce the positional deviation of the drawing lines SLa, SLb accompanying the rotation of the drawing unit U.
進一步地，於本第1實施形態中，利用一個多面鏡PM進行分別沿著兩條描繪線SLa、SLb之光點SPa、SPb的主掃描，因此，如圖2所示，即使是與Y方向寬度大之基板P上的曝光區域W相對應地設定12條描繪線SL1a~SL6a、SL1b~SL6b之情形，多面鏡PM之數量亦只要一半即6個即可。因此，伴隨多面鏡PM的高速旋轉(例如兩萬rpm以上)而產生之振動或噪音(風噪音)亦受到抑制。 Further, in the first embodiment, the main scanning of the light spots SPa and SPb along the two drawing lines SLa and SLb is performed by one polygon mirror PM. Therefore, as shown in FIG. 2, even in the Y direction. In the case where the exposure areas W on the substrate P having a large width are correspondingly set to the twelve drawing lines SL1a to SL6a and SL1b to SL6b, the number of the polygon mirrors PM may be six or six. Therefore, vibration or noise (wind noise) generated by the high-speed rotation of the polygon mirror PM (for example, 20,000 rpm or more) is also suppressed.
[第1實施形態的變形例] [Modification of the first embodiment]
上述第1實施形態，亦可有如下所述之變形例。 The first embodiment described above may have the following modifications.
(變形例1)圖12係從+Zt方向側觀察上述第1實施形態的變形例1中的利用多面鏡PM之光束掃描系統時之圖，圖13係從+Xt方向側觀察圖12的光束掃描系統時之圖。另外，針對與上述第1實施形態相同之構成標記同一符號且省略其說明，僅對與上述第1實施形態不同之部分進行說明。本變形例1的多面鏡PM，亦如圖12所示為具有8個反射面RPa~反射面RPh之正八邊形，位於夾著旋轉軸AXp而對稱之位置之兩個反射面(例如反射面RPa與反射面RPe、反射面RPc與反射面RPg等)彼此平行。 (Modification 1) FIG. 12 is a view of the beam scanning system using the polygon mirror PM in the first modification of the first embodiment as seen from the +Zt direction side, and FIG. 13 is a view of the light beam of FIG. 12 viewed from the +Xt direction side. A diagram of the system when scanning. The same components as those of the above-described first embodiment are denoted by the same reference numerals, and the description thereof will not be repeated, and only the differences from the first embodiment will be described. As shown in FIG. 12, the polygon mirror PM of the first modification is a regular octagon having eight reflection surfaces RPa to RPh, and two reflection surfaces (for example, reflection surfaces) located symmetrically with respect to the rotation axis AXp. RPa and the reflecting surface RPe, the reflecting surface RPc, the reflecting surface RPg, and the like are parallel to each other.
如圖13所示，反射鏡M4a將透過光束成形光學系統BFa而往+Xt方向前進之光束LBa，往-Zt方向進行反射。藉由反射鏡M4a往-Zt方向反射之光束LBa，在通過母線被設定為與Xt軸平行之第1柱面透鏡CY1a之後，射入至反射鏡M5a。反射鏡M5a將射入之光束LBa往+Yt方向進行反射並導引至多面鏡PM的第1反射面RPc。如圖12所示，多面鏡PM將射入之光束LBa往反射鏡M5a側(-Yt方向側)進行反射並導引至反射鏡M6a。如上述第1實施形態中所述，反射鏡M6a將射入之光束Lba往-Xt方向進行反射並導引至fθ透鏡FTa。同樣地，反射鏡M4b將透過光束成形光學系統BFb而往+X方向前進之光束LBb，往-Zt方向進行反射。藉由反射鏡M4b而往-Zt方向反射之光束LBb，在通過母線被設定為與Xt軸平行的第1柱面透鏡CY1b之後，射入至反射鏡M5b。反射鏡M5b將射入之光束LBb往-Yt方向進行反射並導引至多面鏡PM的第2反射面RPg。多面鏡PM，將射入之光束LBb往反射鏡M5b側(+Yt方向側)進行反射並導引至反射鏡M6b。如上述第1實施形態中所述，反射鏡M6b將射入之光束LBb往-Xt方向進行反射並導引至fθ透鏡FTb。反射鏡M6a、M6b，配置於Zt方向上 之相同位置。而且，反射鏡M5a配置在較反射鏡M6a更靠-Zt方向側，反射鏡M5b配置在較反射鏡M6b更靠+Zt方向側。又，反射鏡M5a、M5b與反射鏡M6a、M6b設置於Xt方向上之大致相同之位置。也就是，反射鏡M5a、M5b、反射鏡M6a、M6b沿著Yt方向設置。 As shown in FIG. 13, the mirror M4a reflects the light beam LBa which is transmitted through the beam shaping optical system BFa in the +Xt direction in the -Zt direction. The light beam LBa reflected by the mirror M4a in the -Zt direction is set to the first cylindrical lens CY1a parallel to the Xt axis by the bus bar, and then incident on the mirror M5a. The mirror M5a reflects the incident light beam LBa in the +Yt direction and guides it to the first reflection surface RPc of the polygon mirror PM. As shown in FIG. 12, the polygon mirror PM reflects the incident light beam LBa toward the mirror M5a side (the -Yt direction side) and guides it to the mirror M6a. As described in the first embodiment, the mirror M6a reflects the incident light beam Lba in the -Xt direction and guides it to the fθ lens FTa. Similarly, the mirror M4b reflects the light beam LBb that has passed through the beam shaping optical system BFb in the +X direction in the -Zt direction. The light beam LBb reflected in the -Zt direction by the mirror M4b is set to the first cylindrical lens CY1b parallel to the Xt axis by the bus bar, and then incident on the mirror M5b. The mirror M5b reflects the incident light beam LBb in the -Yt direction and guides it to the second reflection surface RPg of the polygon mirror PM. The polygon mirror PM reflects the incident light beam LBb toward the mirror M5b side (+Yt direction side) and guides it to the mirror M6b. As described in the first embodiment, the mirror M6b reflects the incident light beam LBb in the -Xt direction and guides it to the fθ lens FTb. Mirrors M6a, M6b, arranged in the Zt direction The same location. Further, the mirror M5a is disposed on the side closer to the -Zt direction than the mirror M6a, and the mirror M5b is disposed on the side closer to the +Zt direction than the mirror M6b. Further, the mirrors M5a and M5b and the mirrors M6a and M6b are disposed at substantially the same position in the Xt direction. That is, the mirrors M5a, M5b and the mirrors M6a, M6b are disposed along the Yt direction.
取代上述第1實施形態的反射鏡M4而設置上述反射鏡M4a、M4b，該等反射鏡M4a、M4b具有與反射鏡M4同等之功能。又，取代上述第1實施形態的第1柱面透鏡CY1而設置第1柱面透鏡CY1a、CY1b，該等第1柱面透鏡CY1a、CY1b具有與第1柱面透鏡CY1同等之功能。也就是，柱面透鏡CY1a、CY1b，在與由多面鏡PM產生之掃描方向(旋轉方向)正交之非掃描方向(Zt方向)上，使射入之光束LBa、LBb收斂於多面鏡PM的反射面RP上。同樣地，取代上述第1實施形態的反射鏡M5而設置反射鏡M5a、M5b，該等反射鏡M5a、M5b具有與反射鏡M5同等之功能。如此，於第1導光光學系統20與第2導光光學系統22各個中個別地設置有上述第1實施形態的反射鏡M4、第1柱面透鏡CY1及反射鏡M5而成者，成為反射鏡M4a、M4b、第1柱面透鏡CY1a、CY1b及反射鏡M5a、M5b。 The mirrors M4a and M4b are provided instead of the mirror M4 of the first embodiment, and the mirrors M4a and M4b have functions equivalent to those of the mirror M4. Further, the first cylindrical lenses CY1a and CY1b are provided instead of the first cylindrical lens CY1 of the first embodiment, and the first cylindrical lenses CY1a and CY1b have functions equivalent to those of the first cylindrical lens CY1. That is, the cylindrical lenses CY1a, CY1b converge the incident light beams LBa, LBb to the polygon mirror PM in the non-scanning direction (Zt direction) orthogonal to the scanning direction (rotation direction) generated by the polygon mirror PM. On the reflective surface RP. Similarly, mirrors M5a and M5b are provided instead of the mirror M5 of the first embodiment described above, and the mirrors M5a and M5b have functions equivalent to those of the mirror M5. In this manner, the mirror M4, the first cylindrical lens CY1, and the mirror M5 of the first embodiment are separately provided in each of the first light guiding optical system 20 and the second light guiding optical system 22, and are reflected. The mirrors M4a and M4b, the first cylindrical lenses CY1a and CY1b, and the mirrors M5a and M5b.
另外，XtYt面內的射入至反射鏡M4a、M4b之光束LBa、LBb的Yt方向距離，藉由圖6中所示之三角反射鏡M2與反射鏡M3a、M3b，而以大於多面鏡PM的Yt方向的尺寸(直徑)之方式擴大。 In addition, the Yt direction distance of the light beams LBa and LBb incident on the mirrors M4a, M4b in the XtYt plane is larger than that of the polygon mirror PM by the triangular mirror M2 and the mirrors M3a, M3b shown in FIG. The size (diameter) of the Yt direction is expanded.
於本變形例1中，如圖13所示，以使多面鏡PM的旋轉軸AXp從與Zt軸平行之狀態在Yt方向上傾斜固定角度θy(不滿45°)之方式，傾斜配置多面鏡PM整體。因此，多面鏡PM的各反射面RP中，位於在旋轉過程中分別與反射鏡M6a、M6b相向之位置的反射面RPc、RPg，相對於 Zt軸在Yt方向上傾斜固定角度θy。圖12、圖13顯示此種多面鏡PM的反射面RPc、與夾著旋轉軸AXp而與反射面RPc相對向之反射面RPg均與Xt軸平行之瞬間的狀態。此時，從與旋轉軸AXp正交之Xt方向觀察，射入至多面鏡PM的反射面RPc、RPg之光束LBa、LBb，係相對於各反射面RPc、RPg傾斜地以入射角θy射入，因此，能夠使藉由多面鏡PM產生之光束LBa、LBb的反射位置為Zt方向上之相同的高度位置。亦即，能夠使反射鏡M6a、M6b各自的Zt方向位置相同。進一步地，能夠將由多面鏡PM反射並朝向反射鏡M6a、M6b之光束LBa、LBb的各中心線(前進方向)設定為與XtYt面平行。藉此，能夠使第1投射光學系統24及第2投射光學系統26的Zt方向的位置為相同位置，容易將基板P的被照射面上的描繪線SLa、SLb配置於直線上。 In the first modification, as shown in FIG. 13, the polygon mirror PM is obliquely arranged such that the rotation axis AXp of the polygon mirror PM is inclined at a fixed angle θy (less than 45°) in the Yt direction from the state parallel to the Zt axis. overall. Therefore, among the reflection surfaces RP of the polygon mirror PM, the reflection surfaces RPc and RPg located at positions facing the mirrors M6a and M6b during the rotation are opposed to The Zt axis is inclined at a fixed angle θy in the Yt direction. FIG. 12 and FIG. 13 show a state in which the reflecting surface RPc of the polygon mirror PM and the reflecting surface RPg facing the reflecting surface RPc and the reflecting surface RPg are both parallel to the Xt axis. At this time, the light beams LBa and LBb incident on the reflection surfaces RPc and RPg of the polygon mirror PM are incident at an incident angle θy obliquely with respect to the respective reflection surfaces RPc and RPg as viewed in the Xt direction orthogonal to the rotation axis AXp. Therefore, the reflection positions of the light beams LBa and LBb generated by the polygon mirror PM can be made the same height position in the Zt direction. That is, the positions of the mirrors M6a and M6b in the Zt direction can be made the same. Further, each center line (forward direction) of the light beams LBa and LBb reflected by the polygon mirror PM and directed toward the mirrors M6a and M6b can be set to be parallel to the XtYt plane. With this configuration, the positions of the first projection optical system 24 and the second projection optical system 26 in the Zt direction can be made the same position, and the drawing lines SLa and SLb on the illuminated surface of the substrate P can be easily arranged on a straight line.
另外，如圖13所示，當構成為使多面鏡PM傾斜角度θy，使光束LBa、LBb各自從Yt方向投射至多面鏡PM的彼此平行之兩個反射面RPc、RPg的各者，且使反射面RPc上的光束LBa的投射位置與反射面RPg上的光束LBb的投射位置之Zt方向高度對齊時，若增大傾斜角度θy，則亦必須增大旋轉軸AXp方向上之反射面RPa~反射面RPh的高度尺寸。於本變形例1之情形時，若增大多面鏡PM的傾斜角度θy，則雖容易配置反射鏡M5a、M5b、M6a、M6b等，但旋轉軸AXp方向上之多面鏡PM的反射面RPa~反射面RPh的尺寸變大，使多面鏡PM的質量增大。因此，於優先考慮減小多面鏡PM的質量以實現旋轉高速化之情形時，亦可在Zt方向上，使反射面RPc上的光束LBa的投射位置與反射面RPg上的光束LBb的投射位置不同。 Further, as shown in FIG. 13, when the polygon mirror PM is inclined by an angle θy, each of the light beams LBa and LBb is projected from the Yt direction to each of the two reflecting surfaces RPc and RPg parallel to each other of the polygon mirror PM, and When the projection position of the light beam LBa on the reflection surface RPc is aligned with the height in the Zt direction of the projection position of the light beam LBb on the reflection surface RPg, if the inclination angle θy is increased, the reflection surface RPa in the rotation axis AXp direction must also be increased. The height dimension of the reflecting surface RPH. In the case of the first modification, when the inclination angle θy of the polygon mirror PM is increased, the mirrors M5a, M5b, M6a, M6b and the like are easily disposed, but the reflection surface RPa of the polygon mirror PM in the direction of the rotation axis AXp is The size of the reflecting surface RPh is increased to increase the mass of the polygon mirror PM. Therefore, when the quality of the polygon mirror PM is reduced to achieve a high speed of rotation, the projection position of the light beam LBa on the reflection surface RPc and the projection position of the light beam LBb on the reflection surface RPg may be made in the Zt direction. different.
又，如圖13所示，從與旋轉軸AXp正交之Xt方向觀察，使射入至多面鏡PM的有助於描繪之反射面RPc、RPg之光束LBa、LBb，在YtZt面內相對於反射面RPc、RPg傾斜地射入，藉此，能夠使光束LBa、LBb的入射方向與反射方向在旋轉軸AXp方向或Zt方向上不同。藉此，於從旋轉軸AXp方向或Zt方向觀察多面鏡PM之情形時(圖12之狀態)，能夠使各光束LBa、LBb以大致正交之方式射入至有助於描繪之反射面RPc、RPg。亦即，於在XtYt面內進行觀察之情形時，能夠將由反射鏡M5a、M5b反射並朝向多面鏡PM的反射面RPc、RPg之光束LBa、LBb的各中心線AXs的延長線，設定為均通過多面鏡PM的旋轉軸AXp。 Moreover, as shown in FIG. 13, the light beams LBa and LBb which are incident on the reflecting surfaces RPc and RPg of the polygon mirror PM which are incident on the polygon mirror PM are observed in the YtZt plane as viewed in the Xt direction orthogonal to the rotation axis AXp. The reflection surfaces RPc and RPg are incident obliquely, whereby the incident directions of the light beams LBa and LBb and the reflection direction can be made different in the rotation axis AXp direction or the Zt direction. Thereby, when the polygon mirror PM is viewed from the rotation axis AXp direction or the Zt direction (the state of FIG. 12), each of the light beams LBa and LBb can be incident in a substantially orthogonal manner to the reflection surface RPc which contributes to the drawing. , RPg. In other words, when viewing in the XtYt plane, the extension lines of the center lines AXs of the light beams LBa and LBb reflected by the mirrors M5a and M5b and directed toward the reflecting surfaces RPc and RPg of the polygon mirror PM can be set to Through the rotation axis AXp of the polygon mirror PM.
藉由如上所述之構成，當於XtYt面內進行觀察時，由多面鏡PM的有助於描繪之反射面RPc、RPg的各者反射之光束LBa、LBb，以中心線AXs為中心並在固定之角度範圍θs內偏向掃描之狀態下，被導引至第1投射光學系統24(具體而言為fθ透鏡FTa)及第2投射光學系統26(具體而言為fθ透鏡FTb)。因此，於從旋轉軸AXp方向或Zt方向觀察之情形時，能夠將連續射入至一個反射面RP(RPc、RPg)之脈衝狀的光束LBa、LBb的有效反射角範圍(θs)分為以中心線AXs為中心之均等之角度範圍(±θs/2)，以一次掃描沿著描繪線SLa、SLb之光點SPa、SPb。藉此，以多面鏡PM掃描之光束LBa、LBb或光點SPa、SPb的光學性能(像差特性、聚焦特性、光點品質等)或等速性提高，使掃描精度提高。 According to the configuration described above, when viewed in the XtYt plane, the light beams LBa and LBb reflected by the respective reflecting surfaces RPc and RPg of the polygon mirror PM are centered on the center line AXs and The fixed angle range θs is guided to the first projection optical system 24 (specifically, the fθ lens FTa) and the second projection optical system 26 (specifically, the fθ lens FTb). Therefore, when viewed from the rotation axis AXp direction or the Zt direction, the effective reflection angle range (θs) of the pulse-shaped light beams LBa, LBb continuously incident on one reflection surface RP (RPc, RPg) can be divided into The center line AXs is an equal angular range (±θs/2) at the center, and scans the spots SPa, SPb along the drawing lines SLa, SLb at a time. Thereby, the optical properties (aberration characteristics, focusing characteristics, spot quality, etc.) or the constant velocity of the light beams LBa, LBb or the spots SPa and SPb scanned by the polygon mirror PM are improved, and the scanning accuracy is improved.
(變形例2)圖14係從+Zt方向側觀察上述第1實施形態的變形例2中的利用多面鏡PMa之光束掃描系統時之圖，圖15係從+Xt方向側觀察圖14的光束掃描系統時之圖。另外，針對與上述第1實施形態的變形 例1相同之構成標記相同符號，僅對不同部分進行說明。另外，反射鏡M5a、M5b處於Zt方向上之相同位置，且配置在較反射鏡M6a、M6b更靠+Zt方向側。又，反射鏡M5a、M5b與反射鏡M6a、M6b設置於Xt方向上大致相同之位置。 (Variation 2) FIG. 14 is a view of the beam scanning system using the polygon mirror PMa in the second modification of the first embodiment as seen from the +Zt direction side, and FIG. 15 is a view of the light beam of FIG. 14 viewed from the +Xt direction side. A diagram of the system when scanning. Further, with respect to the modification of the first embodiment described above The same components as in the first embodiment are denoted by the same reference numerals, and only the different portions will be described. Further, the mirrors M5a and M5b are at the same position in the Zt direction, and are disposed on the +Zt direction side of the mirrors M6a and M6b. Further, the mirrors M5a and M5b and the mirrors M6a and M6b are provided at substantially the same position in the Xt direction.
於本變形例2中，使具有8個反射面RPa~反射面RPh之多面鏡PMa的旋轉軸AXp與Zt軸平行，且以相對於旋轉軸AXp傾斜角度θy之方式形成多面鏡PMa的各反射面RPa~反射面RPh。圖14、圖15顯示此種多面鏡PMa的第1反射面RPc、與夾著旋轉軸AXp而與反射面RPc相對向之第2反射面RPg均與Xt軸平行之瞬間的狀態。而且，如圖15所示，從與旋轉軸AXp正交之Xt方向觀察，若相對於反射面RPc、RPg從斜上方(+Zt方向)投射朝向多面鏡PMa的反射面RPc之光束LBa、朝向反射面RPg之光束LBb的各者，則能夠將各反射面RPc、RPg上的光束LBa、LBb之反射位置設定為在與XtYt面平行之面內、即Zt方向上相同的高度位置。也就是，能夠使Zt方向上之多面鏡PMa所反射之光束LBa、LBb的中心線的位置相同。藉此，與上述第1實施形態的變形例1同樣地，能夠使第1投射光學系統24及第2投射光學系統26的Zt方向的位置為相同位置，而容易將基板P的被照射面上的描繪線SLa、SLb配置於直線上。 In the second modification, the rotation axis AXp of the polygon mirror PMa having the eight reflection surfaces RPa to RPh is parallel to the Zt axis, and each reflection of the polygon mirror PMa is formed so as to be inclined by the angle θy with respect to the rotation axis AXp. Surface RPa~reflection surface RPh. FIG. 14 and FIG. 15 show a state in which the first reflecting surface RPc of the polygon mirror PMa and the second reflecting surface RPg facing the reflecting surface RPc and the second reflecting surface RPg are parallel to the Xt axis. As shown in FIG. 15, when viewed from the Xt direction orthogonal to the rotation axis AXp, the light beam LBa toward the reflection surface RPc of the polygon mirror PMa is projected obliquely upward (+Zt direction) with respect to the reflection surfaces RPc and RPg. Each of the light beams LBb of the reflecting surface RPg can set the reflection positions of the light beams LBa and LBb on the respective reflecting surfaces RPc and RPg to the same height position in the plane parallel to the XtYt plane, that is, in the Zt direction. That is, the positions of the center lines of the light beams LBa and LBb reflected by the polygon mirror PMa in the Zt direction can be made the same. In the same manner as the first modification of the first embodiment, the positions of the first projection optical system 24 and the second projection optical system 26 in the Zt direction can be made the same position, and the illuminated surface of the substrate P can be easily formed. The drawing lines SLa and SLb are arranged on a straight line.
又，從Xt方向觀察，使射入至多面鏡PMa的反射面RPa~反射面RPh中的夾著旋轉軸AXp而相對向之兩個反射面RP(例如RPc與RPg)的各者之光束LBa、LBb，相對於反射面RP在Z方向上傾斜地射入，因此，若於YtZt面內進行觀察，則如圖15所示，能夠使光束LBa、LBb的入射角度方向與反射角度方向於旋轉軸AXp方向(Zt方向)隔開角度2θy。藉此， 於從旋轉軸AXp方向(Zt方向)觀察多面鏡PMa之情形時，如圖14所示，能夠使光束LBa、LBb各自的入射方向與反射方向為相同方向。其結果，由多面鏡PMa反射之來自反射鏡M5a、M5b之光束LBa、LBb射入至反射鏡M6a、M6b而不會返回至反射鏡M5a、M5b。 In addition, the light beam LBa of each of the two reflection surfaces RP (for example, RPc and RPg) that is incident on the rotation axis AXp and the reflection surface RPh to the reflection surface RPh of the polygon mirror PMa is observed from the Xt direction. LBb is incident obliquely in the Z direction with respect to the reflection surface RP. Therefore, when viewed in the YtZt plane, as shown in FIG. 15, the incident angle direction and the reflection angle direction of the light beams LBa and LBb can be made on the rotation axis. The AXp direction (Zt direction) is separated by an angle of 2θy. With this, When the polygon mirror PMa is viewed from the rotation axis AXp direction (Zt direction), as shown in FIG. 14, the incident directions of the light beams LBa and LBb and the reflection direction can be made the same direction. As a result, the light beams LBa and LBb from the mirrors M5a and M5b reflected by the polygon mirror PMa are incident on the mirrors M6a and M6b without returning to the mirrors M5a and M5b.
本變形例2亦與前面的圖12之變形例1同樣地，由多面鏡PMa的有助於描繪之反射面RPc、RPg的各者反射之光束LBa、LBb，以中心線AXs為中心並在固定之角度範圍θs內偏向掃描之狀態下，導引至第1投射光學系統24(具體而言為fθ透鏡FTa)及第2投射光學系統26(具體而言為fθ透鏡FTb)。因此，能夠將連續射入至一個反射面RP(RPc、RPg)之脈衝狀的光束LBa、LBb的有效反射角範圍(θs)分為以中心線AXs為中心之均等之角度範圍(±θs/2)，以一次掃描沿著描繪線SLa、SLb之光點。藉此，以多面鏡PMa掃描之光束LBa、LBb或光點SPa、SPb的光學性能(像差特性、聚焦特性、光點品質等)或等速性提高，使掃描精度提高。 In the second modification, as in the first modification of FIG. 12, the light beams LBa and LBb reflected by the reflection surfaces RPc and RPg of the polygon mirror PMa are centered on the center line AXs. The fixed angle range θs is guided to the first projection optical system 24 (specifically, the fθ lens FTa) and the second projection optical system 26 (specifically, the fθ lens FTb). Therefore, the effective reflection angle range (θs) of the pulsed light beams LBa and LBb which are continuously incident on one reflection surface RP (RPc, RPg) can be divided into equal angular ranges centered on the center line AXs (±θs/ 2), scanning the light spots along the drawing lines SLa, SLb in one scan. Thereby, the optical characteristics (aberration characteristics, focusing characteristics, spot quality, etc.) or the constant velocity of the light beams LBa, LBb or the spots SPa and SPb scanned by the polygon mirror PMa are improved, and the scanning accuracy is improved.
(變形例3)於上述第1實施形態的變形例1中，使多面鏡PM的旋轉軸AXp相對於Zt軸在Yz方向上傾斜角度θy，於上述變形例2中，使多面鏡PMa的旋轉軸AXp與Zt軸平行，且以相對於Zt軸傾斜角度θy之方式形成多面鏡PMa的各反射面RPa~反射面RPh。但是，多面鏡PM之配置或各反射面RP(RPa~RPh)之構成並不限定於上述變形例1、變形例2。例如，亦可使用如上述第1實施形態般之構成之多面鏡PM，使光束LB相對於與各反射面RP(與Zt軸及旋轉軸AXp平行)垂直之面(與XtYt面平行)從斜上方(或下方)射入。藉此，於從多面鏡PM的旋轉軸AXp方向觀察多面鏡PM之情形時，在各反射面RP以光束LBa、LBb垂直射入之方式配置之 狀態下，能夠使光束LBa、LBb之入射方向與反射方向相同，且能夠使光束LBa、LBb之入射方向與反射方向在旋轉軸AXp(Zt軸)方向錯開。因此，多面鏡PM能夠使由兩個反射面RP的各者反射之光束LBa、LBb，以中心線AXs為中心並在固定之角度範圍θs(以中心線AXs為中心之角度±θs/2之分配)內偏向，並將其導引至第1投射光學系統24(具體而言為fθ透鏡FTa)及第2投射光學系統26(具體而言為fθ透鏡FTb)。如此，即使是變形例3之情形，亦與上述第1實施形態的變形例1、變形例2同樣地，以多面鏡PM掃描之光束LBa、LBb或光點SPa、SPb的光學性能(像差特性、聚焦特性、光點品質等)或等速性提高，使掃描精度提高。 (Variation 3) In the first modification of the first embodiment, the rotation axis AXp of the polygon mirror PM is inclined by an angle θy in the Yz direction with respect to the Zt axis, and in the second modification, the rotation of the polygon mirror PMa is performed. The axis AXp is parallel to the Zt axis, and each of the reflection surface RPa to the reflection surface RPh of the polygon mirror PMa is formed so as to be inclined by an angle θy with respect to the Zt axis. However, the arrangement of the polygon mirror PM or the configuration of each of the reflection surfaces RP (RPa to RPh) is not limited to the above-described Modification 1 and Modification 2. For example, the polygon mirror PM having the configuration of the first embodiment described above may be used, and the light beam LB may be inclined from the plane perpendicular to the respective reflecting surfaces RP (parallel to the Zt axis and the rotation axis AXp) (parallel to the XtYt plane). Shoot above (or below). When the polygon mirror PM is viewed from the direction of the rotation axis AXp of the polygon mirror PM, the reflection surfaces RP are arranged such that the light beams LBa and LBb are incident perpendicularly. In the state, the incident directions of the light beams LBa and LBb can be made the same as the reflection direction, and the incident directions of the light beams LBa and LBb and the reflection direction can be shifted in the direction of the rotation axis AXp (Zt axis). Therefore, the polygon mirror PM enables the light beams LBa, LBb reflected by each of the two reflecting surfaces RP to be centered on the center line AXs and at a fixed angular range θs (the angle ± θs/2 centered on the center line AXs) The inner deflection is directed to the first projection optical system 24 (specifically, the fθ lens FTa) and the second projection optical system 26 (specifically, the fθ lens FTb). In the case of the third modification, the optical properties (aberrations) of the light beams LBa, LBb or the spots SPa and SPb scanned by the polygon mirror PM are similar to those of the first modification and the second modification of the first embodiment. Improvement in characteristics, focusing characteristics, spot quality, etc., or constant velocity, which improves scanning accuracy.
(變形例4)如圖16A、圖16B所示，亦可使用偏振光束分光器PBS(PBSa、PBSb)作為其他構成，該其他構成係使用正八邊形的多面鏡PM，且如前面的變形例1~變形例3的各者般，使射入至有助於描繪之多面鏡PM的反射面RP之光束LBa、LBb之入射方向與其反射方向，於在XtYt面內進行觀察時為相同方向，上述正八邊形的多面鏡PM係如上述變形例3般，旋轉軸AXp與Zt軸平行，且各反射面RPa~反射面RPh亦與旋轉軸AXp平行。圖16A係從+Zt方向側觀察上述第1實施形態的變形例4中的利用多面鏡PM之光束掃描系統時之圖，圖16B係從-Xt方向側觀察圖16A的光束掃描系統時之圖。另外，對與前面的第1實施形態、變形例1~變形例3的各者中所說明之構件相同之構件標記相同符號，僅對不同部分進行說明。 (Modification 4) As shown in FIG. 16A and FIG. 16B, a polarization beam splitter PBS (PBSa, PBSb) may be used as another configuration, and the other configuration uses a polygon octagonal polygon mirror PM, and the former modification In the same manner as in the third modification, the incident directions of the light beams LBa and LBb incident on the reflecting surface RP of the polygon mirror PM contributing to the drawing and the direction of reflection thereof are the same directions when viewed in the XtYt plane. In the above-described regular octagon polygon mirror PM, as in the third modification, the rotation axis AXp is parallel to the Zt axis, and each of the reflection surfaces RPa to RPh is also parallel to the rotation axis AXp. Fig. 16A is a view of the beam scanning system using the polygon mirror PM in the fourth modification of the first embodiment as seen from the +Zt direction side, and Fig. 16B is a view of the beam scanning system of Fig. 16A viewed from the -Xt direction side. . It is to be noted that the same members as those described in the first embodiment and the first modification to the third modification are denoted by the same reference numerals, and only the different portions will be described.
如圖16A、圖16B所示，於本變形例4中，在多面鏡PM與反射鏡M6a之間，配置光束之入射出射面與XtYt面、XtZt面的各者平行之 長方體狀的偏振光束分光器PBSa，在多面鏡PM與反射鏡M6b之間，配置光束之入射出射面與XtYt面、XtZt面的各者平行之長方體狀的偏振光束分光器PBSb。偏振光束分光器PBSa、PBSb各自的偏振光分離面，係設定為相對於XtYt面與XtZt面均傾斜45°。進一步地，於偏振光束分光器PBSa與多面鏡PM之間設置1/4波長板QPa，於偏振光束分光器PBSb與多面鏡PM之間設置1/4波長板QPb。 As shown in FIG. 16A and FIG. 16B, in the fourth modification, the incident exit surface of the light beam is arranged in parallel with each of the XtYt plane and the XtZt plane between the polygon mirror PM and the mirror M6a. The rectangular beam-shaped polarization beam splitter PBSa is disposed between the polygon mirror PM and the mirror M6b, and has a rectangular parallelepiped polarization beam splitter PBSb in which the incident exit surface of the light beam is parallel to each of the XtYt plane and the XtZt plane. The polarization separation surfaces of the polarization beam splitters PBSa and PBSb are set to be inclined by 45° with respect to the XtYt plane and the XtZt plane. Further, a quarter-wavelength plate QPa is disposed between the polarization beam splitter PBSa and the polygon mirror PM, and a quarter-wavelength plate QPb is disposed between the polarization beam splitter PBSb and the polygon mirror PM.
於以上構成中，利用光學元件(聲光調變元件)AOMa(參照圖5、圖7)而受到調變後之光束LBa，如圖16B所示，在藉由母線與Xt軸平行之第1柱面透鏡CY1a而於Yt方向上收斂之狀態下，與Zt軸平行地從+Zt方向側射入至偏振光束分光器PBSa。使光束LBa成為直線S偏振光之後，光束LBa大部分由偏振光束分光器PBSa的偏振光分離面反射，透過1/4波長板QPa而成為圓偏振光，並朝向多面鏡PM。當多面鏡PM之旋轉角度位置，例如如圖16A所示，處於從有助於光束LBa之描繪之一個反射面PRc與XtZt面平行之狀態起的角度±θs/2之範圍內時，透過1/4波長板QPa之光束LBa由反射面PRc反射，再次通過1/4波長板QPa而成為直線P偏振光，且返回至偏振光束分光器PBSa。因此，由反射面PRc反射之光束LBa的大部分，透過偏振光束分光器PBSa的偏振光分離面而朝向反射鏡M6a。 In the above configuration, the light beam LBa modulated by the optical element (acoustic and light modulation element) AOMa (see FIGS. 5 and 7) is as shown in FIG. 16B, and the first line is parallel to the Xt axis by the bus bar. In the state where the cylindrical lens CY1a converges in the Yt direction, it is incident from the +Zt direction side to the polarization beam splitter PBSa in parallel with the Zt axis. After the light beam LBa is linearly polarized, the light beam LBa is mostly reflected by the polarization separation surface of the polarization beam splitter PBSa, passes through the quarter-wavelength plate QPa, and becomes circularly polarized light, and faces the polygon mirror PM. When the rotational angle position of the polygon mirror PM is, for example, as shown in FIG. 16A, within a range of an angle ± θs/2 from a state in which the reflection surface PRc and the XtZt plane of the drawing of the light beam LBa are parallel, the transmission 1 The light beam LBa of the /4 wavelength plate QPa is reflected by the reflection surface PRc, passes through the quarter-wavelength plate QPa again, becomes linear P-polarized light, and returns to the polarization beam splitter PBSa. Therefore, most of the light beam LBa reflected by the reflecting surface PRc passes through the polarization separating surface of the polarization beam splitter PBSa toward the mirror M6a.
同樣地，利用光學元件(聲光調變元件)AOMb(參照圖5、圖7)而受到調變後之光束LBb，如圖16B所示，在藉由母線與Xt軸平行之第1柱面透鏡CY1b而於Yt方向上收斂之狀態下，與Zt軸平行地從+Zt方向側射入至偏振光束分光器PBSb。使光束LBb成為直線S偏振光之後，光束LBb大部分由偏振光束分光器PBSb的偏振光分離面反射，透過1/4波長 板QPb而成為圓偏振光，並朝向多面鏡PM。當多面鏡PM之旋轉角度位置如圖16A所示，處於從有助於光束LBb之描繪之一個反射面PRg與XtZt面平行之狀態起的角度±θs/2之範圍內時，透過1/4波長板QPb之光束LBb由反射面PRg反射，再次通過1/4波長板QPb而成為直線P偏振光，並返回至偏振光束分光器PBSb。因此，由反射面PRg反射之光束LBb的大部分，透過偏振光束分光器PBSb的偏振光分離面而朝向反射鏡M6b。 Similarly, the light beam LBb modulated by the optical element (acoustic and light modulation element) AOMb (see FIGS. 5 and 7) is as shown in FIG. 16B, and the first cylinder surface parallel to the Xt axis by the bus bar is shown. In a state where the lens CY1b converges in the Yt direction, it enters the polarization beam splitter PBSb from the +Zt direction side in parallel with the Zt axis. After the light beam LBb is made into a linear S-polarized light, the light beam LBb is mostly reflected by the polarization separation surface of the polarization beam splitter PBSb, and transmitted through the 1/4 wavelength. The plate QPb becomes circularly polarized light and faces the polygon mirror PM. When the rotational angle position of the polygon mirror PM is within the range of the angle ± θs/2 from the state in which the reflection surface PRg and the XtZt plane of the drawing of the light beam LBb are parallel, as shown in FIG. 16A, the transmission is 1/4. The light beam LBb of the wavelength plate QPb is reflected by the reflection surface PRg, passes through the quarter-wavelength plate QPb again, and becomes linear P-polarized light, and returns to the polarization beam splitter PBSb. Therefore, most of the light beam LBb reflected by the reflection surface PRg passes through the polarization separation surface of the polarization beam splitter PBSb toward the mirror M6b.
藉由如上所述之構成，由反射鏡M6a反射之光束LBa、由反射鏡M6b反射之光束LBb各自在與XtYt面平行之面內，於角度範圍θs內掃描。又，以如下方式配置：反射鏡M6a之後所配置之第1投射光學系統24(具體而言為fθ透鏡FTa)的光軸AXfa之延長線，藉由反射鏡M6a彎折90而與多面鏡PM的旋轉軸AXp交叉，反射鏡M6b之後所配置之第2投射光學系統26(具體而言為fθ透鏡FTb)的光軸AXfb之延長線，藉由反射鏡M6b彎折90°而與多面鏡PM的旋轉軸AXp交叉。因此，於本變形例4中，多面鏡PM能夠使由兩個反射面(例如RPc與RPg)的各者反射之光束LBa、LBb，以光軸AXfa、AXfb為中心並在固定之角度範圍θs(以光軸AXfa、AXfb為中心之角度±θs/2之分配)內偏向，並將其導引至第1投射光學系統24(fθ透鏡FTa)及第2投射光學系統26(fθ透鏡FTb)。如此，即使是變形例4之情形，以多面鏡PM掃描之光束LBa、LBb或光點SPa、SPb的光學性能(像差特性、聚焦特性、光點品質等)或等速性提高，使掃描精度提高。又，與前面的第1實施形態及其變形例1~變形例3同樣地，於本變形例4中，藉由一個多面鏡PM之兩條光束LBa、LBb各自之偏向掃描所生成之描繪線SLa、SLb，亦能夠設定為如下長度例如30mm~80mm左右，該長度 為能夠以與應描繪之圖案的微細度(最小線寬)或光點SPa、SPb的有效尺寸(直徑)相對應之精度而保持直線性之長度。 With the configuration described above, the light beam LBa reflected by the mirror M6a and the light beam LBb reflected by the mirror M6b are each scanned in the angular range θs in a plane parallel to the XtYt plane. Further, an extension line of the optical axis AXfa of the first projection optical system 24 (specifically, the fθ lens FTa) disposed after the mirror M6a is bent in the following manner, and the polygon mirror PM is bent by the mirror M6a. The rotation axis AXp intersects, and the extension line of the optical axis AXfb of the second projection optical system 26 (specifically, the fθ lens FTb) disposed after the mirror M6b is bent by 90° with the mirror M6b and the polygon mirror PM The axis of rotation AXp crosses. Therefore, in the fourth modification, the polygon mirror PM can illuminate the light beams LBa and LBb reflected by the two reflecting surfaces (for example, RPc and RPg) around the optical axes AXfa and AXfb at a fixed angular range θs. (distribution of the angle ±θs/2 centered on the optical axes AXfa and AXfb) is internally deflected and guided to the first projection optical system 24 (fθ lens FTa) and the second projection optical system 26 (fθ lens FTb). . Thus, even in the case of the modification 4, the optical properties (aberration characteristics, focusing characteristics, spot quality, etc.) or the constant velocity of the light beams LBa, LBb or the spots SPa, SPb scanned by the polygon mirror PM are improved, so that scanning is performed. Increased accuracy. Further, similarly to the first embodiment and the first to third modifications thereof, in the fourth modification, the drawing lines generated by the deflection of the two light beams LBa and LBb of one polygon mirror PM are respectively SLa and SLb can also be set to a length of, for example, about 30 mm to 80 mm, which is The length of the linearity can be maintained in accordance with the precision corresponding to the fineness (minimum line width) of the pattern to be drawn or the effective size (diameter) of the light spots SPa, SPb.
另外，於以上之變形例4中，以多面鏡PM偏向掃描之光束LBa、LBb，如圖16A所示，在與描繪線SLa、SLb的長度相對應之有效角度範圍θs內，射入至偏振光束分光器PBSa、PBSb。因此，偏振光束分光器PBSa、PBSb之P偏振光與S偏振光之分離程度即消光比，被設定為最大達到該角度範圍θs以上。作為如上所述之偏振光束分光器PBSa、PBSb之一例，於偏振光分離面反復積層有氧化鉿(HfO2)膜與二氧化矽(SiO2)膜而成之偏振光束分光器已揭示於國際公開第2014/073535號公報。 Further, in the above-described Modification 4, the light beams LBa and LBb which are deflected by the polygon mirror PM are incident on the polarization angle range θs corresponding to the lengths of the drawing lines SLa and SLb as shown in FIG. 16A. Beam splitter PBSa, PBSb. Therefore, the degree of separation between the P-polarized light of the polarization beam splitters PBSa and PBSb and the S-polarized light, that is, the extinction ratio, is set to be at most the angle range θs or more. As an example of the polarizing beam splitters PBSa and PBSb as described above, a polarizing beam splitter in which a hafnium oxide (HfO 2 ) film and a ceria (SiO 2 ) film are repeatedly laminated on a polarization separating surface has been disclosed in the international Publication No. 2014/073535.
[第2實施形態] [Second Embodiment]
圖17係顯示第2實施形態中的描繪單元Ua的一部分的構成之圖。各描繪單元Ua具有相同構成，因此，於本第2實施形態中，亦以沿著描繪線SL2a、SL2b上掃描光點SPa、SPb之描繪單元Ua2為例進行說明。另外，針對與上述第1實施形態相同之構成標記相同符號。又，僅對與上述第1實施形態不同之部分進行說明。 Fig. 17 is a view showing a configuration of a part of the drawing unit Ua in the second embodiment. Since each drawing unit Ua has the same configuration, in the second embodiment, the drawing unit Ua2 that scans the light spots SPa and SPb along the drawing lines SL2a and SL2b will be described as an example. The same components as those in the first embodiment are denoted by the same reference numerals. Further, only portions different from the above-described first embodiment will be described.
於第2實施形態中，多面鏡PM係以使旋轉軸AXp沿著Xt軸方向延伸之方式設置，fθ透鏡FTa、FTb係以使其光軸AXfa、AXfb沿著Zt軸方向延伸之方式設置。往-Zt軸方向前進之光束LBa、LBb射入至該多面鏡PM的8個反射面RP中的於YtZt面內彼此形成90°夾角之兩個反射面RP(圖17中為反射面RPb、RPh)。多面鏡PM的第1反射面RP(此處為RPh)，將從第1方向射入之光束LBa往-Yt方向側進行反射並導引至反射鏡M6a。由反射鏡M6a反射之光束Lba往-Zt方向前進，在透過fθ透鏡FTa及柱面 透鏡CY2a之後，射入至基板P。藉由該fθ透鏡FTa及柱面透鏡CY2a，射入至基板P之光束LBa於基板P的被照射面上成為光點SPa。又，多面鏡PM的第2反射面RP(此處為RPb)，將從與第1方向不同之第2方向射入之光束LBb往+Yt方向側進行反射並導引至反射鏡M6b。由反射鏡M6b反射之光束LBb往-Zt方向前進，在透過fθ透鏡FTb及柱面透鏡CY2b之後，射入至基板P。藉由該fθ透鏡FTb及柱面透鏡CY2b，射入至基板P之光束LBb於基板P的被照射面上成為光點SPb。投射至基板P的被照射面上之光點SPa、SPb，藉由多面鏡PM之旋轉而於描繪線SL2a、SL2b上等速掃描。 In the second embodiment, the polygon mirror PM is provided such that the rotation axis AXp extends in the Xt-axis direction, and the fθ lenses FTa and FTb are provided such that the optical axes AXfa and AXfb extend in the Zt-axis direction. The light beams LBa and LBb which are advanced in the -Zt axis direction are incident on the two reflection surfaces RP of the eight reflection surfaces RP of the polygon mirror PM which form an angle of 90° with each other in the YtZt plane (the reflection surface RPb in FIG. 17 , RPh). The first reflecting surface RP (here, RPh) of the polygon mirror PM reflects the light beam LBa incident from the first direction toward the -Yt direction side and guides it to the mirror M6a. The light beam Lba reflected by the mirror M6a advances in the -Zt direction, passes through the fθ lens FTa and the cylinder After the lens CY2a, it is incident on the substrate P. The light beam LBa incident on the substrate P becomes the light spot SPa on the illuminated surface of the substrate P by the fθ lens FTa and the cylindrical lens CY2a. Further, the second reflecting surface RP (here, RPb) of the polygon mirror PM reflects the light beam LBb incident from the second direction different from the first direction toward the +Yt direction side and guides it to the mirror M6b. The light beam LBb reflected by the mirror M6b advances in the -Zt direction, passes through the fθ lens FTb and the cylindrical lens CY2b, and then enters the substrate P. The light beam LBb incident on the substrate P becomes the light spot SPb on the illuminated surface of the substrate P by the fθ lens FTb and the cylindrical lens CY2b. The spots SPa and SPb projected onto the illuminated surface of the substrate P are scanned at equal speed on the drawing lines SL2a, SL2b by the rotation of the polygon mirror PM.
如此，以旋轉軸AXp沿著Xt軸方向延伸之方式設置多面鏡PM，且以其光軸AXfa、AXfb沿著Zt軸方向延伸之方式設置fθ透鏡FTa、FTb，因此，無需如上述第1實施形態般設置反射鏡M7a、M7b，該反射鏡M7a、M7b係將透過fθ透鏡FTa、FTb之往-Xt方向前進之光束LBa、LBb往-Z方向進行反射。此種構成亦能夠獲得與上述第1實施形態相同之效果。 In this manner, the polygon mirror PM is provided so as to extend along the Xt-axis direction of the rotation axis AXp, and the fθ lenses FTa and FTb are provided so that the optical axes AXfa and AXfb extend in the Zt-axis direction. Therefore, the first embodiment is not required. The mirrors M7a and M7b are configured to reflect the light beams LBa and LBb that have passed through the fθ lenses FTa and FTb in the −Xt direction in the −Z direction. Also in such a configuration, the same effects as those of the first embodiment described above can be obtained.
另外，於本第2實施形態中，反射鏡M6a、fθ透鏡FTa及柱面透鏡CY2a係作為第1投射光學系統24a而發揮功能，反射鏡M6b、fθ透鏡FTb及柱面透鏡CY2b係作為第2投射光學系統26a而發揮功能。本第2實施形態之描繪單元Ua亦可繞旋動中心軸AXr旋動，旋動中心軸AXr通過連接描繪線SL2a的中點與描繪線SL2b的中點之線段的中心點，且相對於基板P的被照射面垂直地通過。 Further, in the second embodiment, the mirror M6a, the fθ lens FTa, and the cylindrical lens CY2a function as the first projection optical system 24a, and the mirror M6b, the fθ lens FTb, and the cylindrical lens CY2b are the second. The projection optical system 26a functions. The drawing unit Ua of the second embodiment may be rotated about the rotation center axis AXr, and the rotation center axis AXr is connected to the center point of the line segment of the midpoint of the drawing line SL2a and the midpoint of the drawing line SL2b with respect to the substrate. The illuminated surface of P passes vertically.
又，於本第2實施形態中，雖無特別圖示，但取代上述第1實施形態的第1導光光學系統20及第2導光光學系統22，以使來自光源裝 置14之光束LBa、LBb往-Z方向前進並射入至多面鏡PM之方式，配置將光束LBa、LBb導引至多面鏡PM之第1導光光學系統及第2導光光學系統。 Further, in the second embodiment, the first light guiding optical system 20 and the second light guiding optical system 22 of the first embodiment are replaced with the second light guiding optical system 22, unless otherwise specified. The light beams LBa and LBb of the set 14 are advanced in the −Z direction and incident on the polygon mirror PM, and the first light guiding optical system and the second light guiding optical system that guide the light beams LBa and LBb to the polygon mirror PM are disposed.
如上述第1實施形態的變形例3中所述，使光束LB相對於與反射面RP的旋轉方向交叉之方向(多面鏡PM的旋轉軸AXp延伸之方向)傾斜地射入至反射面RP，藉此，亦能夠使光束LBa、LBb之入射方向與反射方向在旋轉軸AXp方向錯開。因此，能夠獲得與上述第1實施形態的變形例3相同之效果。 As described in the third modification of the first embodiment, the light beam LB is incident on the reflection surface RP obliquely with respect to the direction intersecting the rotation direction of the reflection surface RP (the direction in which the rotation axis AXp of the polygon mirror PM extends). Therefore, the incident directions of the light beams LBa and LBb and the reflection direction can be shifted in the direction of the rotation axis AXp. Therefore, the same effects as those of the third modification of the first embodiment described above can be obtained.
又，亦可如上述第1實施形態的變形例1中所述，在從與旋轉軸AXp正交之方向觀察多面鏡PM之情形時，使多面鏡PM的旋轉軸AXp相對於Xt方向傾斜。又，亦可使用上述第1實施形態的變形例2中所說明之多面鏡PMa。亦即，亦可使圖17中的多面鏡PM的旋轉軸AXp與Xt軸平行，且以從與旋轉軸AXp平行之狀態如圖15所示般傾斜角度θy之方式，形成多面鏡PM的各反射面RP(RPa~RPh)。藉此，從與旋轉軸AXp正交之方向觀察，藉由使射入至多面鏡PM的各反射面RP(RPa~RPh)之光束LBa、LBb相對於各反射面RP傾斜地射入，而能夠獲得與上述第1實施形態的變形例1、變形例2相同之效果。 Further, as described in the first modification of the first embodiment, when the polygon mirror PM is viewed from the direction orthogonal to the rotation axis AXp, the rotation axis AXp of the polygon mirror PM is inclined with respect to the Xt direction. Further, the polygon mirror PMa described in the second modification of the first embodiment can be used. In other words, the rotation axis AXp of the polygon mirror PM in FIG. 17 may be parallel to the Xt axis, and each of the polygon mirrors PM may be formed so as to be inclined by an angle θy as shown in FIG. 15 from a state parallel to the rotation axis AXp. Reflecting surface RP (RPa ~ RPh). By this, the light beams LBa and LBb incident on the respective reflecting surfaces RP (RPa to RPh) of the polygon mirror PM are incident obliquely with respect to the respective reflecting surfaces RP as viewed in the direction orthogonal to the rotation axis AXp. The same effects as those of the first modification and the second modification of the first embodiment are obtained.
[第3實施形態] [Third embodiment]
圖18係從-Yt(-Y)方向側觀察之第3實施形態的描繪單元Ub之構成圖，圖19係從+Xt方向側觀察自多面鏡PMb朝向+Zt側之描繪單元Ub的構成之圖，圖20係從+Zt方向側觀察自多面鏡PMb朝向-Zt方向側之描繪單元Ub的構成之圖。另外，針對與上述第1實施形態相同之構成標記相同符號。又，僅對與上述第1實施形態不同之部分進行說明。 18 is a configuration diagram of the drawing unit Ub of the third embodiment as seen from the -Yt (-Y) direction side, and FIG. 19 is a configuration of the drawing unit Ub from the polygon mirror PMb toward the +Zt side as viewed from the +Xt direction side. FIG. 20 is a view showing a configuration of the drawing unit Ub from the polygon mirror PMb toward the −Zt direction side as viewed from the +Zt direction side. The same components as those in the first embodiment are denoted by the same reference numerals. Further, only portions different from the above-described first embodiment will be described.
如圖19所示，描繪單元Ub具備稜線與Xt軸平行之三角反射鏡(直角鏡)M10、反射鏡M11a、M11b、偏移光學構件SRa、SRb、母線與Xt軸平行之柱面透鏡CY1a、CY1b、8個反射面RP之多面鏡PMb、反射鏡M12a、M12b、反射鏡M13a、M13b、反射鏡M14a、M14b、fθ透鏡FTa、FTb、反射鏡M15a、M15b、及母線與Yt軸平行之柱面透鏡CY2a、CY2b之光學系統。對於關於兩條光束LBa、LBb成對地設置之光學系統，在參照符號之後加註a、b。 As shown in FIG. 19, the drawing unit Ub includes a triangular mirror (orthogonal mirror) M10 whose ridge line is parallel to the Xt axis, mirrors M11a and M11b, offset optical members SRa, SRb, and a cylindrical lens CY1a in which the bus bar is parallel to the Xt axis. CY1b, polygon mirror PMb of 8 reflecting surfaces RP, mirrors M12a, M12b, mirrors M13a, M13b, mirrors M14a, M14b, fθ lenses FTa, FTb, mirrors M15a, M15b, and columns parallel to the Yt axis Optical system of surface lenses CY2a, CY2b. For the optical system in which the two light beams LBa, LBb are arranged in pairs, a and b are added after the reference symbols.
如圖19所示，來自光源裝置14之兩條光束LBa、LBb(均為平行光束)，夾著旋動中心軸AXr而平行地排列並往-Zt方向前進，射入至夾著描繪單元Ub的三角反射鏡M10的稜線之不同的反射面M10a、M10b。該光束LBa、LBb以相對於與Zt軸平行之旋動中心軸AXr在Yt方向上對稱之方式，射入至描繪單元Ub的三角反射鏡M10的各反射面M10a、M10b。三角反射鏡M10的反射面M10a，將光束LBa往-Yt方向進行反射並導引至反射鏡M11a，三角反射鏡M10的反射面M10b，將光束LBb往+Yt方向進行反射並導引至反射鏡M11b。由反射鏡M11a反射之光束Lba往-Zt方向前進，在透過偏移光學構件SRa及柱面透鏡CY1a之後，射入至多面鏡PMb的反射面RP(例如反射面RPa)。由反射鏡M11b反射之光束LBb，往-Zt方向前進，在透過偏移光學構件SRb及柱面透鏡CY1b之後，射入至多面鏡PMb的反射面RP(例如反射面RPe)。多面鏡PMb的反射面RPa與反射面RPe，位於夾著多面鏡PMb的旋轉軸AXp而對稱之位置。 As shown in FIG. 19, the two light beams LBa and LBb (both parallel beams) from the light source device 14 are arranged in parallel in the -Zt direction with the rotation center axis AXr interposed therebetween, and are incident on the drawing unit Ub. Different reflection surfaces M10a, M10b of the ridgeline of the triangular mirror M10. The light beams LBa and LBb are incident on the respective reflection surfaces M10a and M10b of the triangular mirror M10 of the drawing unit Ub so as to be symmetrical with respect to the rotation central axis AXr parallel to the Zt axis in the Yt direction. The reflecting surface M10a of the triangular mirror M10 reflects the light beam LBa in the -Yt direction and guides it to the mirror M11a, and the reflecting surface M10b of the triangular mirror M10 reflects the light beam LBb in the +Yt direction and guides it to the mirror. M11b. The light beam Lba reflected by the mirror M11a advances in the -Zt direction, passes through the offset optical member SRa and the cylindrical lens CY1a, and then enters the reflection surface RP (for example, the reflection surface RPa) of the polygon mirror PMb. The light beam LBb reflected by the mirror M11b advances in the -Zt direction, passes through the offset optical member SRb and the cylindrical lens CY1b, and then enters the reflection surface RP (for example, the reflection surface RPe) of the polygon mirror PMb. The reflecting surface RPa and the reflecting surface RPe of the polygon mirror PMb are located symmetrically with respect to the rotation axis AXp of the polygon mirror PMb.
於本第3實施形態中，如圖20所示，多面鏡PMb的旋轉軸AXp係設定為與旋動中心軸AXr同軸。利用三角反射鏡M10及反射鏡 M11a、M11b(參照圖19)，使射入至多面鏡PMb之光束LBa、LBb的各中心線之間的Yt方向距離擴大。藉此，能夠縮短射入至描繪單元Ub之光束LBa、LBb的光軸間之距離，且能夠使射入至描繪單元Ub(三角反射鏡M10)之光束LBa、LBb靠近旋動中心軸AXr。其結果，即使是描繪單元Ub整體旋動之情形，亦能夠抑制伴隨該旋動之光束LBa、LBb的各中心線的位置於描繪單元Ub內大幅度地產生變化。伴隨描繪單元Ub的旋動之光束LBa、LBb的各中心線的位置變化，藉由與第1實施形態同樣地發揮功能之偏移光學構件SRa、SRb修正。 In the third embodiment, as shown in FIG. 20, the rotation axis AXp of the polygon mirror PMb is set to be coaxial with the rotation center axis AXr. Use triangular mirror M10 and mirror M11a and M11b (see FIG. 19) expand the distance in the Yt direction between the center lines of the light beams LBa and LBb incident on the polygon mirror PMb. Thereby, the distance between the optical axes of the light beams LBa and LBb incident on the drawing unit Ub can be shortened, and the light beams LBa and LBb incident on the drawing unit Ub (triangular mirror M10) can be brought close to the rotation center axis AXr. As a result, even if the drawing unit Ub is integrally rotated, it is possible to suppress a large change in the position of each center line of the light beams LBa and LBb accompanying the rotation in the drawing unit Ub. The positional changes of the respective center lines of the light beams LBa and LBb of the drawing unit Ub are corrected by the offset optical members SRa and SRb that function similarly to the first embodiment.
另外，三角反射鏡M10的反射面M10a、反射鏡M11a、偏移光學構件SRa及柱面透鏡CY1a係作為將光束LBa朝向多面鏡PMb的第1反射面RP(RPa)導引之第1導光光學系統20b而發揮功能。又，三角反射鏡M10的反射面M10b、反射鏡M11b、偏移光學構件SRb及柱面透鏡CY1b係作為將光束LBb朝向多面鏡PMb的與第1反射面不同之第2反射面RP(RPe)導引之第2導光光學系統22b而發揮功能。另外，三角反射鏡M10的各反射面M10a、M10b，亦可為個別地設置於第1導光光學系統20b與第2導光光學系統22b之平面鏡。另外，柱面透鏡CY1a(CY1b亦相同)具有僅在Yt方向上使作為平行光束射入之光束LBa(LBb)收斂之折射能力，因此，沿著Xt方向呈狹縫狀延伸之光點投射至多面鏡PMb的反射面RPa(反射面RPe)上。 Further, the reflection surface M10a, the mirror M11a, the offset optical member SRa, and the cylindrical lens CY1a of the triangular mirror M10 are the first light guides that guide the light beam LBa toward the first reflection surface RP (RPa) of the polygon mirror PMb. The optical system 20b functions. Further, the reflection surface M10b of the triangular mirror M10, the mirror M11b, the offset optical member SRb, and the cylindrical lens CY1b are the second reflection surface RP (RPe) different from the first reflection surface in that the light beam LBb faces the polygon mirror PMb. The guided second light guiding optical system 22b functions. Further, each of the reflection surfaces M10a and M10b of the triangular mirror M10 may be a plane mirror that is separately provided to the first light guiding optical system 20b and the second light guiding optical system 22b. Further, the cylindrical lens CY1a (the same as CY1b) has a refractive power that converges the light beam LBa (LBb) incident as a parallel beam only in the Yt direction, and therefore, a light spot extending in a slit shape along the Xt direction is projected to The reflecting surface RPa (reflecting surface RPe) of the polygon mirror PMb.
若於XtYt面內進行觀察，本第3實施形態之多面鏡PMb如圖20所示，外形呈正八邊形，形成於其周圍之8個反射面RPa~反射面RPh(圖19圖示有RPa~RPe)各自係以相對於旋轉軸AXp(旋動中心軸AXr) 傾斜45度之方式形成。亦即，多面鏡PMb成為如沿著中心線方向以適當厚度對正八角錐體進行切割而成之形狀，該正八角錐體的底面為正八邊形且8個側面各自相對於中心線傾斜45度。因此，多面鏡PMb的各反射面(RPa~RPh)，將往-Zt方向前進之光束Lba往-Yt方向側呈直角地進行反射並導引至反射鏡M12a，且將往-Zt方向前進之光束LBb往+Yt方向側呈直角地進行反射並導引至反射鏡M12b。因此，如上述第1實施形態的變形例2般，多面鏡PMb能夠以各中心線AXs(與兩個fθ透鏡FTa、FTb的各光軸AXfa、AXfb同軸)為中心，在固定之角度範圍θs內，對由8個反射面RPa~反射面RPh中的例如反射面RPa、RPe反射之光束LBa、LBb進行反射。藉此，透過多面鏡PMb之光束LBa、LBb的光點SPa、SPb之光學性能、掃描直線性、等速性提高，使掃描精度(描繪精度)提高。 As shown in Fig. 20, the polygon mirror PMb of the third embodiment has a regular octagonal shape and is formed around the eight reflecting surfaces RPa to RPh (Fig. 19 shows RPa). ~RPe) are each relative to the axis of rotation AXp (rotation center axis AXr) It is formed by tilting 45 degrees. That is, the polygon mirror PMb has a shape in which the square octagon is cut at an appropriate thickness along the center line direction, and the bottom surface of the regular octagon is a regular octagon and each of the eight sides is inclined by 45 degrees with respect to the center line. Therefore, each of the reflecting surfaces (RPa to RPh) of the polygon mirror PMb reflects the light beam Lba advancing in the -Zt direction at a right angle to the -Yt direction side and guides it to the mirror M12a, and proceeds to the -Zt direction. The light beam LBb is reflected at a right angle to the +Yt direction side and guided to the mirror M12b. Therefore, as in the second modification of the first embodiment, the polygon mirror PMb can be centered on each center line AXs (coaxial with the respective optical axes AXfa and AXfb of the two fθ lenses FTa and FTb) at a fixed angular range θs The light beams LBa and LBb reflected by, for example, the reflection surfaces RPa and RPe among the eight reflection surfaces RPa to RPh are reflected. Thereby, the optical performance, the scanning linearity, and the constant velocity of the light spots SPa and SPb of the light beams LBa and LBb transmitted through the polygon mirror PMb are improved, and the scanning accuracy (drawing accuracy) is improved.
如圖18、圖20所示，藉由反射鏡M12a而往-Xt方向反射之來自多面鏡PMb(例如反射面RPa)之光束LBa，經由反射鏡M13a、M14a而被導引至fθ透鏡FTa。同樣地，藉由反射鏡M12b而往+Xt方向反射之來自多面鏡PMb(例如反射面RPe)之光束LBb，經由反射鏡M13b、M14b而被導引至fθ透鏡FTb。反射鏡M13a於彎折位置p13a將從反射鏡M12a往-Xt方向前進之光束LBa往-Zt方向反射，且反射鏡M14a於彎折位置p14a將來自反射鏡M13a之光束LBa往+Xt方向反射並導引至fθ透鏡FTa。反射鏡M13b於彎折位置p13b將從反射鏡M12b往+Xt方向前進之光束LBb往-Zt方向反射，且反射鏡M14b於彎折位置p14b將來自反射鏡M13a之光束LBb往-Xt方向反射並導引至fθ透鏡FTb。另外，雖於圖20中省略圖示，但透過反射鏡M12a、M13a、M14a射入至fθ透鏡FTa之光束Lba，藉由柱面透鏡CY1a 的作用，若於XtYt面內觀察時，成為大致平行之光束，若於XtZt面內觀察時，則如圖18所示般成為發散光束。 As shown in FIGS. 18 and 20, the light beam LBa from the polygon mirror PMb (for example, the reflection surface RPa) reflected in the -Xt direction by the mirror M12a is guided to the fθ lens FTa via the mirrors M13a and M14a. Similarly, the light beam LBb from the polygon mirror PMb (for example, the reflection surface RPe) reflected by the mirror M12b in the +Xt direction is guided to the fθ lens FTb via the mirrors M13b, M14b. The mirror M13a reflects the light beam LBa advancing from the mirror M12a in the -Xt direction at the bending position p13a in the -Zt direction, and the mirror M14a reflects the light beam LBa from the mirror M13a in the +Xt direction at the bending position p14a. Guided to the fθ lens FTa. The mirror M13b reflects the light beam LBb advancing from the mirror M12b in the +Xt direction at the bending position p13b in the -Zt direction, and the mirror M14b reflects the light beam LBb from the mirror M13a in the -Xt direction at the bending position p14b. Guided to the fθ lens FTb. Further, although not shown in FIG. 20, the light beam Lba incident on the fθ lens FTa through the mirrors M12a, M13a, and M14a is obtained by the cylindrical lens CY1a. When it is observed in the XtYt plane, it becomes a substantially parallel beam, and if it is observed in the XtZt plane, it becomes a divergent beam as shown in FIG.
透過fθ透鏡FTa(光軸AXfa與Xt軸平行)往+Xt方向前進之光束LBa，於遠心狀態下，藉由反射鏡M15a往-Zt方向反射，在透過柱面透鏡CY2a之後，成為圓形的光點SPa投射至基板P的被照射面上。同樣地，透過fθ透鏡FTb(光軸AXfb與Xt軸平行)往-Xt方向前進之光束LBb，於遠心狀態下，藉由反射鏡M15b往-Zt方向反射，在透過柱面透鏡CY2b之後，成為圓形的光點SPb投射至基板P的被照射面上。藉由fθ透鏡FTa及柱面透鏡CY2a，投射至基板P之光束LBa於基板P的被照射面上收斂成微小之光點SPa。同樣地，藉由fθ透鏡FTb及柱面透鏡CY2b，投射至基板P之光束LBb於基板P的被照射面上收斂成微小之光點SPb。投射至基板P的被照射面上之兩個光點SPa、SPb，因一個多面鏡PMb之旋轉而同時於描繪線SLa、SLb上進行一維掃描。於本第3實施形態之構成的情形中，兩個光點SPa、SPb沿著描繪線SLa、SLb彼此逆向地進行掃描移動。繼而，如圖20所示以如下方式進行設定，即，當使多面鏡PMb於XtYt面內順時針旋轉時，成為描繪圖案的Yt方向連接部之描繪線SLa的+Yt方向端部與描繪線SLb的-Yt方向端部分別成為光點SPa、SPb之掃描結束位置。相反地，當使多面鏡PMb於XtYt面內逆時針旋轉時，成為描繪圖案的Yt方向連接部之描繪線SLa的+Yt方向端部與描繪線SLb的-Yt方向端部分別成為光點SPa、SPb之掃描開始位置。 The light beam LBa that advances in the +Xt direction through the fθ lens FTa (the optical axis AXfa is parallel to the Xt axis) is reflected in the -Zt direction by the mirror M15a in the telecentric state, and becomes circular after passing through the cylindrical lens CY2a. The light spot SPa is projected onto the illuminated surface of the substrate P. Similarly, the light beam LBb that travels in the -Xt direction through the fθ lens FTb (the optical axis AXfb is parallel to the Xt axis) is reflected in the -Zt direction by the mirror M15b in the telecentric state, and passes through the cylindrical lens CY2b. The circular spot SPb is projected onto the illuminated surface of the substrate P. The light beam LBa projected onto the substrate P converges on the illuminated surface of the substrate P by the fθ lens FTa and the cylindrical lens CY2a to form a minute spot SPa. Similarly, the light beam LBb projected onto the substrate P converges on the illuminated surface of the substrate P by the fθ lens FTb and the cylindrical lens CY2b to form a minute spot SPb. The two spots SPa, SPb projected onto the illuminated surface of the substrate P are simultaneously scanned one-dimensionally on the drawing lines SLa, SLb by the rotation of one polygon mirror PMb. In the case of the configuration of the third embodiment, the two spots SPa and SPb are scanned and moved in the opposite directions along the drawing lines SLa and SLb. Then, as shown in FIG. 20, when the polygon mirror PMb is rotated clockwise in the XtYt plane, the +Yt direction end portion and the drawing line of the drawing line SLa of the Yt direction connecting portion of the drawing pattern are set as follows. The end portions of the SLb in the -Yt direction are the scanning end positions of the spots SPa and SPb, respectively. On the other hand, when the polygon mirror PMb is rotated counterclockwise in the XtYt plane, the end portion of the drawing line SLa of the Yt direction connecting portion of the drawing pattern in the +Yt direction and the end portion of the drawing line SLb in the -Yt direction become the spot SPa, respectively. , the start position of the SPb scan.
於以上構成中，反射鏡M12a、M13a、M14a、M15a、fθ透鏡FTa及柱面透鏡CY2a，係作為第1投射光學系統24b而發揮功能，該第 1投射光學系統24b係使由多面鏡PMb反射並偏向掃描之光束LBa聚光以作為光點SPa而投射至描繪線SLa上。又，反射鏡M12b、M13b、M14b、M15b、fθ透鏡FTb及柱面透鏡CY2b，係作為第2投射光學系統26b而發揮功能，該第2投射光學系統26b係使由多面鏡PMb反射並偏向掃描之光束LBb聚光以作為光點SPb而投射至描繪線SLb上。 In the above configuration, the mirrors M12a, M13a, M14a, M15a, the fθ lens FTa, and the cylindrical lens CY2a function as the first projection optical system 24b. The projection optical system 24b condenses the light beam LBa reflected by the polygon mirror PMb and deflected toward the scanning to be projected onto the drawing line SLa as the light spot SPa. Further, the mirrors M12b, M13b, M14b, M15b, the fθ lens FTb, and the cylindrical lens CY2b function as the second projection optical system 26b, and the second projection optical system 26b is reflected by the polygon mirror PMb and deflected toward the scanning. The light beam LBb is condensed to be projected onto the drawing line SLb as the light spot SPb.
又，如圖18、圖20所示，於第3實施形態中，自多面鏡PMb的反射面RP至fθ透鏡FTa、FTb為止之光路長度，藉由其間之反射鏡M12a~M14a、M12b~M14b延長，因此，作為fθ透鏡FTa、FTb能夠使用光束入射側的焦點距離長者。一般而言，多面鏡PM(PMa、PMb亦相同)的反射面，配置於遠心之fθ透鏡FTa(FTb)的光束入射側之焦點距離fs的位置(光瞳位置)或其附近。因此，若將被照射面上之描繪線SLa(SLb)的長度設為Lss，將此時射入至fθ透鏡之光束的偏向角度範圍設為θs，則可近似地表示Lss≒fs．sin(θs)之關係。因此，於將描繪線SLa(SLb)的長度Lss設為固定值之情形時，只要使用焦點距離fs長之fθ透鏡，便能夠與此對應地減小偏向角度範圍θs。此意味著有助於沿著描繪線SLa(SLb)之光點SPa(SPb)的一次掃描之多面鏡PM(PMa、PMb)的旋轉角度範圍θs/2變小，具有有利於高速化之優點。 Further, as shown in Figs. 18 and 20, in the third embodiment, the optical path length from the reflection surface RP of the polygon mirror PMb to the fθ lenses FTa and FTb is reflected by the mirrors M12a to M14a, M12b to M14b therebetween. Since the fθ lenses FTa and FTb can be used, the focal length on the incident side of the light beam can be used. In general, the reflecting surface of the polygon mirror PM (the same applies to PMa and PMb) is disposed at or near the focal point distance (the pupil position) of the light incident side of the fθ lens FTa (FTb) of the telecentric. Therefore, if the length of the drawing line SLa (SLb) on the illuminated surface is Lss, and the deflection angle range of the light beam incident on the fθ lens at this time is θs, the Lss≒fs can be approximated. The relationship between sin(θs). Therefore, when the length Lss of the drawing line SLa (SLb) is set to a fixed value, the deflection angle range θs can be reduced in accordance with this by using an fθ lens having a focal length fs. This means that the rotation angle range θs/2 of the polygon mirrors PM (PMa, PMb) which is one scan along the light spot SPa (SPb) of the drawing line SLa (SLb) becomes small, and has the advantage of being advantageous for speeding up. .
本第3實施形態之描繪單元Ub，如圖20所示，在Yt方向上錯開地設定描繪線SLa與描繪線SLb，以使掃描光點SPa、光點SPb的各者之描繪線SLa與描繪線SLb在副掃描方向上彼此分隔，且在主掃描方向上，端部鄰接或一部分重疊。也就是，描繪線SLa、SLb係以於平行狀態下在副掃描方向(基板P之搬送方向)上分隔，且在主掃描方向上無間隙地連續 之方式配置。因此，於配置複數個此種描繪單元Ub之情形時，例如以圖21之方式進行配置。 As shown in FIG. 20, the drawing unit Ub of the third embodiment is configured such that the drawing line SLa and the drawing line SLb are shifted in the Yt direction so that the drawing line SLa and the drawing of each of the scanning spot SPa and the spot SPb are drawn. The lines SLb are spaced apart from each other in the sub-scanning direction, and in the main scanning direction, the ends are adjacent or partially overlapped. That is, the drawing lines SLa, SLb are separated in the sub-scanning direction (the transport direction of the substrate P) in the parallel state, and are continuous without a gap in the main scanning direction. The way it is configured. Therefore, when a plurality of such drawing units Ub are arranged, for example, they are arranged as shown in FIG.
圖21顯示如下情形的一例，係對應於前面的圖2，沿著Y(Yt)方向將基板P上所形成的作為電子元件形成區域之曝光區域W一分為六，藉由6條描繪線SL1a、SL1b、SL2a、SL2b、SL3a、SLb，於帶狀的複數個分割區域WS1~分割區域WS6的各者中描繪圖案。此處，與如前面的圖18~圖20般之描繪單元Ub為相同構成之第1描繪單元Ub1之兩條描繪線SL1a、SL1b，設定成分別於沿著Y方向相鄰接之分割區域WS1、WS2描繪圖案。同樣地，與描繪單元Ub為相同構成之第2描繪單元Ub2之兩條描繪線SL2a、SL2b，設定成分別於沿著Y方向相鄰接之分割區域WS3、WS4描繪圖案，與描繪單元Ub為相同構成之第3描繪單元Ub3之兩條描繪線SL3a、SL3b，設定成分別於沿著Y方向相鄰接之分割區域WS5、WS6描繪圖案。以在分割區域WS1與分割區域WS2之連接部STa、分割區域WS2與分割區域WS3之連接部STb、分割區域WS3與分割區域WS4之連接部STc、分割區域WS4與分割區域WS5之連接部STd及分割區域WS5與分割區域WS6之連接部STe，6條描繪線SL1a、…、SL3a、SL3b各自的端部在Y方向上精密地一致或稍微重疊之方式，精密地調整各描繪線的Y方向位置或各描繪線的描繪倍率。 21 shows an example in which the exposure region W as the electronic component forming region formed on the substrate P is divided into six in the Y (Yt) direction in accordance with the previous FIG. 2, and six drawing lines are formed. SL1a, SL1b, SL2a, SL2b, SL3a, and SLb draw patterns in each of a plurality of strip-shaped divided regions WS1 to WS6. Here, the two drawing lines SL1a and SL1b of the first drawing unit Ub1 having the same configuration as the drawing unit Ub as shown in FIGS. 18 to 20 above are set to the divided areas WS1 adjacent to each other in the Y direction. WS2 draws a pattern. Similarly, the two drawing lines SL2a and SL2b of the second drawing unit Ub2 having the same configuration as the drawing unit Ub are set so as to draw patterns on the divided areas WS3 and WS4 adjacent to each other in the Y direction, and the drawing unit Ub is The two drawing lines SL3a and SL3b of the third drawing unit Ub3 having the same configuration are set to draw patterns on the divided areas WS5 and WS6 adjacent to each other in the Y direction. A connection portion STa between the divided region WS1 and the divided region WS2, a connection portion STb between the divided region WS2 and the divided region WS3, a connection portion STc between the divided region WS3 and the divided region WS4, a connection portion STd between the divided region WS4 and the divided region WS5, and In the connection portion STe between the divided region WS5 and the divided region WS6, the end portions of the six drawing lines SL1a, ..., SL3a, and SL3b are precisely aligned or slightly overlapped in the Y direction, and the Y-direction position of each drawing line is precisely adjusted. Or the drawing magnification of each drawing line.
如此，於本第3實施形態中，設定成利用描繪單元Ub(Ub1~Ub3)而掃描光點SPa、SPb之兩條描繪線SLa、SLb，在副掃描方向上彼此分隔，且在主掃描方向上，端部鄰接或一部分重疊。即使於該情形，使描繪單元Ub整體稍微旋轉時之旋動中心軸AXr，亦能夠設定成相對於基板P 垂直地通過連接兩條描繪線SLa、SLb的中點之線段的中心點。因此，即使是為了獲得高重合精度而使描繪單元Ub整體繞旋動中心軸AXr旋動之情形，亦能夠抑制藉由描繪單元Ub而掃描光點SPa、SPb之兩條描繪線SLa、SLb在基板P上的位置偏移變大，因此，能夠一邊進行高精度的圖案描繪、一邊簡單地對描繪線SLa、SLb的斜度(被照射面內的相對於Y軸之斜度)進行調整。 As described above, in the third embodiment, the two drawing lines SLa and SLb of the scanning spots SPa and SPb are scanned by the drawing unit Ub (Ub1 to Ub3), and are separated from each other in the sub-scanning direction, and are in the main scanning direction. Upper, adjacent or partially overlapping. Even in this case, the rotation center axis AXr when the drawing unit Ub is slightly rotated as a whole can be set to be relative to the substrate P. The center points of the line segments that depict the midpoints of the lines SLa, SLb are connected vertically. Therefore, even if the drawing unit Ub is rotated around the rotation center axis AXr in order to obtain high coincidence precision, it is possible to suppress the two drawing lines SLa, SLb of the scanning spots SPa and SPb by the drawing unit Ub. Since the positional shift on the substrate P is increased, it is possible to easily adjust the inclination of the drawing lines SLa and SLb (the inclination of the surface to be irradiated with respect to the Y axis) while performing high-precision pattern drawing.
另外，於上述各實施形態(亦包含變形例)中，複數個描繪單元U、Ua、Ub的描繪線SL均設為相同之掃描長度，但亦可使掃描長度不同。於該情形時，可於描繪單元U、Ua、Ub之間，使描繪線SL的掃描長度不同，亦可於同一描繪單元U、Ua、Ub中，使描繪線SLa、SLb的掃描長度不同。進一步地，雖使旋動中心軸AXr相對於基板P垂直地通過連接描繪單元U、Ua、Ub的描繪線SLa、SLb各自的中點之線段的中心點，但該旋動中心軸AXr亦可為相對於基板P垂直之方向，且設定於連接描繪線SLa、SLb各自的中點之線段上。 Further, in each of the above embodiments (including the modified example), the drawing lines SL of the plurality of drawing units U, Ua, and Ub are all set to the same scanning length, but the scanning lengths may be different. In this case, the scanning length of the drawing line SL may be different between the drawing units U, Ua, and Ub, and the scanning lengths of the drawing lines SLa and SLb may be different in the same drawing unit U, Ua, and Ub. Further, the rotation central axis AXr is connected to the center point of the line segment of the midpoint of the drawing lines SLa and SLb of the drawing units U, Ua, and Ub perpendicularly to the substrate P, but the rotation center axis AXr may be It is a direction perpendicular to the substrate P and is set on a line segment connecting the midpoints of the respective drawing lines SLa and SLb.
在以上的第3實施形態之情形中，為了如第1實施形態般，於沿著長條方向呈圓筒面狀地由旋轉筒DR1、DR2支承之基板P的被照射面進行圖案描繪，如圖22所示，只要以使藉由描繪單元Ub的fθ透鏡FTa(FTb)之後的反射鏡M15a(M15b)而彎折之光軸AXfa(AXfb)的延長線朝向旋轉筒DR1或DR2的中心軸(旋轉中心軸)AXo1或AXo2之方式，將XZ面內之反射鏡M15a(M15b)的斜度設定為45度以外之角度，且亦以於傾斜之光軸AXfa(AXfb)上聚焦之方式，相對於XY面傾斜配置柱面透鏡CY2a(CY2b)即可。另外，於與XY面平行地平坦支承基板P之情形時，例如能夠使用國 際公開第2013/150677號公報所揭示之搬送裝置。又，亦可取代旋轉筒DR1、DR2而使用墊構件(基板支承保持具)，該墊構件(基板支承保持具)係於呈圓筒面狀地彎曲之表面形成有多個微細之氣體噴出孔(及多個微細之抽吸孔)，且利用氣體軸承以非接觸或低摩擦狀態支承基板P的背面側，以使基板P沿著長條方向呈圓筒狀地彎曲並支承該基板P。又，於上述第1實施形態~第2實施形態及其等的變形例中，可取代旋轉筒DR1、DR2，而使用國際公開第2013/150677號公報所揭示之與XY面平行地平坦支承基板P之搬送裝置，亦可使用利用氣體軸承以非接觸或低摩擦狀態支承基板P的背面側之上述墊構件(基板支承保持具)。 In the case of the third embodiment, as described in the first embodiment, the illuminated surface of the substrate P supported by the rotating cylinders DR1 and DR2 in a cylindrical shape along the longitudinal direction is patterned. As shown in Fig. 22, the extension of the optical axis AXfa (AXfb) bent by the mirror M15a (M15b) after the fθ lens FTa (FTb) of the drawing unit Ub is directed toward the central axis of the rotating cylinder DR1 or DR2. (rotation of the central axis) AXo1 or AXo2, the inclination of the mirror M15a (M15b) in the XZ plane is set to an angle other than 45 degrees, and also on the tilting optical axis AXfa (AXfb), The cylindrical lens CY2a (CY2b) may be disposed obliquely with respect to the XY plane. Further, when the substrate P is flatly supported in parallel with the XY plane, for example, the country can be used. The transport apparatus disclosed in Japanese Laid-Open Patent Publication No. 2013/150677. Further, instead of the rotary cylinders DR1 and DR2, a pad member (substrate support holder) may be used. The spacer member (substrate support holder) is formed with a plurality of fine gas ejection holes formed on a surface curved in a cylindrical shape. (and a plurality of fine suction holes), and the back side of the substrate P is supported by the gas bearing in a non-contact or low-friction state so that the substrate P is bent in a cylindrical shape along the longitudinal direction and supports the substrate P. Further, in the first embodiment to the second embodiment and the modifications thereof, the substrate can be flatly supported in parallel with the XY plane as disclosed in International Publication No. 2013/150677, instead of the rotating cylinders DR1 and DR2. In the P transfer device, the pad member (substrate support holder) on the back side of the substrate P may be supported by a gas bearing in a non-contact or low-friction state.
[第1實施形態~第3實施形態的變形例] [First to third modifications of the third embodiment]
第1實施形態~第3實施形態亦可有如下所述之變形例。 The first embodiment to the third embodiment may have the following modifications.
(變形例1)圖23係顯示光束分配系統的一例的構成之圖，該光束分配系統係用於將從圖1中所示之光源裝置14提供之光束LB(兩條光束LBa、LBb)例如分配至圖2中的4個描繪單元U1、U2、U5、U6的各者。另外，該光束分配系統不僅可適用於第1實施形態之描繪裝置，亦可適用於第2實施形態、第3實施形態及其等的變形例之描繪裝置。 (Modification 1) FIG. 23 is a view showing a configuration of an example of a light beam distribution system for a light beam LB (two light beams LBa, LBb) to be supplied from the light source device 14 shown in FIG. Each of the four drawing units U1, U2, U5, U6 in Fig. 2 is assigned. Further, the light beam distribution system can be applied not only to the drawing device of the first embodiment but also to the drawing device of the second embodiment, the third embodiment, and the like.
於光源裝置14中設置輸出紫外線區域的高輝度之雷射光束(連續光或脈衝光)之雷射光源LS、將來自雷射光源LS之光束轉換為既定直徑(例如數mm直徑)之平行光束之光束擴展器BX、將成為平行光束之光束一分為二之第1光束分光器(半反射鏡)BS1及面鏡MR1。由光束分離器BS1反射之光束作為光束LBa而射入至第2光束分離器BS2a，透過光束分光器BS1之光束由面鏡MR1反射以作為光束LBb而射入至第2光束分離器 BS2b。光束分離器BS1之分割比為1：1，光束LBa、LBb之各光強度(照度)大致相等。射入至光束分離器BS2a之光束LBa、及射入至光束分離器BS2b之光束LBb進一步以相等之強度比而一分為二。 In the light source device 14, a laser beam LS that outputs a high-intensity laser beam (continuous light or pulsed light) in an ultraviolet region is provided, and a beam from the laser source LS is converted into a parallel beam of a predetermined diameter (for example, a diameter of several mm). The beam expander BX is a first beam splitter (half mirror) BS1 and a mirror MR1 which are divided into two beams of a parallel beam. The light beam reflected by the beam splitter BS1 is incident on the second beam splitter BS2a as the light beam LBa, and the light beam transmitted through the beam splitter BS1 is reflected by the mirror MR1 to be incident on the second beam splitter as the light beam LBb. BS2b. The split ratio of the beam splitter BS1 is 1:1, and the respective light intensities (illuminances) of the light beams LBa and LBb are substantially equal. The light beam LBa incident on the beam splitter BS2a and the light beam LBb incident on the beam splitter BS2b are further divided into two at equal intensity ratios.
射入至光束分離器BS2a之光束LBa中，透過光束分離器BS2a之光束LBa射入至第3光束分光器BS3a(分割比為1：1)。射入至光束分光器BS2b之光束LBb中，透過光束分光器BS2b之光束LBb射入至第3光束分光器BS3b(分割比為1：1)。由光束分光器BS3a、BS3b的各者反射之兩條光束LBa、LBb，夾著描繪單元U1的旋動中心軸AXr相互平行，透過相對應之光學元件AOMa、AOMb(參照圖5等)而朝向描繪單元U1。繼而，透過光束分光器BS3a、BS3b的各者之兩條光束LBa、LBb分別由面鏡MR2a、MR2b反射之後，夾著描繪單元U2的旋動中心軸AXr相互平行，透過相對應之光學元件AOMa、AOMb而朝向描繪單元U2。 The light beam LBa incident on the beam splitter BS2a is incident on the third beam splitter BS3a (the split ratio is 1:1). The light beam LBb incident on the beam splitter BS2b is incident on the third beam splitter BS3b (the split ratio is 1:1). The two light beams LBa and LBb reflected by each of the beam splitters BS3a and BS3b are parallel to each other across the central axis of rotation AXr of the drawing unit U1, and are transmitted through the corresponding optical elements AOMa and AOMb (see FIG. 5 and the like). The unit U1 is depicted. Then, the two light beams LBa and LBb transmitted through the respective beams of the beam splitters BS3a and BS3b are reflected by the mirrors MR2a and MR2b, respectively, and then parallel to the central axis of rotation AXr of the drawing unit U2, and transmitted through the corresponding optical element AOMa. AOMb faces the drawing unit U2.
進一步地，前面的由光束分光器BS2a反射之光束LBa射入至第4光束分光器BS4a(分割比為1：1)，前面的由光束分光器BS2b反射之光束LBb射入至第4光束分光器BS4b(分割比為1：1)。由光束分光器BS4a、BS4b的各者反射之兩條光束LBa、LBb，夾著描繪單元U5的旋動中心軸AXr相互平行，透過相對應之光學元件AOMa、AOMb而朝向描繪單元U5。繼而，透過光束分光器BS4a、BS4b的各者之兩條光束LBa、LBb分別由面鏡MR3a、MR3b反射之後，夾著描繪單元U6的旋動中心軸AXr相互平行，透過相對應之光學元件AOMa、AOMb而朝向描繪單元U6。藉由以上之構成，分配至4個描繪單元U1、U2、U5的各者之光束LBa、LBb均被設定為大致相等之光強度。 Further, the front light beam LBa reflected by the beam splitter BS2a is incident on the fourth beam splitter BS4a (the division ratio is 1:1), and the front light beam LBb reflected by the beam splitter BS2b is incident on the fourth beam splitting. BS4b (segment ratio is 1:1). The two light beams LBa and LBb reflected by each of the beam splitters BS4a and BS4b are parallel to each other across the rotation central axis AXr of the drawing unit U5, and are transmitted to the drawing unit U5 through the corresponding optical elements AOMa and AOMb. Then, the two light beams LBa and LBb transmitted through the respective beams of the beam splitters BS4a and BS4b are reflected by the mirrors MR3a and MR3b, respectively, and then parallel to the central axis of rotation AXr of the drawing unit U6, and transmitted through the corresponding optical element AOMa. The AOMb faces the drawing unit U6. According to the above configuration, the light beams LBa and LBb assigned to each of the four drawing units U1, U2, and U5 are set to have substantially equal light intensities.
而且，光源裝置14內的雷射光源，只要是放射出紫外線區域波長之高輝度之光束，則亦可為固體雷射、氣體雷射中的任一種雷射。若使用光纖雷射光源作為固體雷射，則儘管是相對較精小的框體，仍能夠獲得高輸出之紫外光束，且容易裝入至曝光裝置(描繪裝置)EX的本體內，上述光纖雷射光源係利用光纖放大器將來自半導體雷射二極體之紅外線區域波長之光束(數百MHz之脈衝光)放大之後，藉由波長轉換元件而放射出紫外線區域波長之光束(脈衝光)。進一步地，於以上之第1實施形態~第3實施形態及各變形例中，雖為在曝光裝置EX本體內，可以旋動中心軸AXr為中心而旋轉之描繪單元U(Ua、Ub)內未設有描繪用之光源的構成，但於可利用來自半導體雷射二極體(LD)或發光二極體(LED)等之光束的強度而充分地描繪(曝光)圖案之情形時，亦可於各描繪單元U(Ua、Ub)內設置供給光束LBa、LBb之LD或LED。但是，由上述LD或LED形成之光源部於圖案描繪動作中，溫度會相當地上升，因此，需要設置對描繪單元U(Ua、Ub)內的光源部進行隔熱、冷卻等之溫度調整機構，以將描繪單元U(Ua、Ub)整體之溫度變化抑制得較小。於該情形時，亦將如圖5所示之光學元件AOMa、AOMb設置於各描繪單元U(Ua、Ub)內。 Further, the laser light source in the light source device 14 may be any one of a solid laser beam and a gas laser as long as it emits a light beam having a high luminance in the ultraviolet region. If a fiber laser source is used as the solid laser, a relatively high-output ultraviolet light beam can be obtained, and it can be easily incorporated into the body of the exposure device (drawing device) EX, which is a relatively small frame. The light source is an optical fiber amplifier that amplifies a light beam (pulse light of several hundred MHz) from the wavelength of the infrared region of the semiconductor laser diode, and then emits a light beam (pulsed light) having a wavelength of the ultraviolet region by the wavelength conversion element. Further, in the first embodiment to the third embodiment and the modifications described above, the drawing unit U (Ua, Ub) that can rotate around the central axis AXr in the exposure apparatus EX body is used. Although the configuration of the light source for drawing is not provided, when the pattern is sufficiently drawn (exposed) by the intensity of the light beam from the semiconductor laser diode (LD) or the light-emitting diode (LED), An LD or an LED that supplies the light beams LBa, LBb may be provided in each of the drawing units U (Ua, Ub). However, since the temperature of the light source unit formed by the LD or the LED is relatively high during the pattern drawing operation, it is necessary to provide a temperature adjustment mechanism that heats and cools the light source unit in the drawing unit U (Ua, Ub). In order to suppress the temperature change of the entire drawing unit U (Ua, Ub) to be small. In this case, the optical elements AOMa and AOMb as shown in FIG. 5 are also disposed in the respective drawing units U (Ua, Ub).
(變形例2)於以上之第1實施形態~第3實施形態及其等的各變形例中，多面鏡PM(PMa、PMb)係設為繞旋轉軸AXp以45度之間隔配置有8個反射面而成之8面體(或八角錐體狀)，但反射面之數量亦可為任意數量，能夠同樣地使用3面~6面、9面、10面、12面、15面、16面、18面、20面等之多面鏡。一般而言，即使多面鏡之直徑相同，反射面數越多，則風損越小，因此可使其更高速地旋轉。又，於第1實施形態~第3實施 形態及其等的各變形例中，雖省略了圖示及說明，但於多面鏡PM(PMa、PMb)周圍的兩處設置有原點感測器，該原點感測器係於多面鏡PM(PMa、PMb)的不同反射面的各者所反射之兩條光束LBa、LBb朝向與描繪線(掃描線)SLa、SLb上的光點SPa、SPb的掃描開始點分別對應之反射方向時，輸出原點訊號。沿著描繪線SLa、SLb之光點SPa、SPb的掃描位置之管理(偏移設定等)或基於圖案資料之光點SPa、SPb之強度調變(光學元件AOMa、AOMb之導通/斷開)的時序等，係基於該原點訊號與對應於光點SPa、SPb之掃描速度之時脈訊號而控制。 (Variation 2) In each of the first to third embodiments and the like, the polygon mirrors PM (PMa, PMb) are arranged at intervals of 45 degrees around the rotation axis AXp. The octahedron (or octagonal cone shape) formed by the reflecting surface, but the number of reflecting surfaces can be any number, and the same can be used for 3 to 6 faces, 9 faces, 10 faces, 12 faces, 15 faces, 16 Polyhedron with face, 18 faces, 20 faces, etc. In general, even if the diameter of the polygon mirror is the same, the larger the number of reflection surfaces, the smaller the wind loss, so that it can be rotated at a higher speed. Further, in the first embodiment to the third embodiment In the respective modifications of the form and the like, although illustration and description are omitted, an origin sensor is provided at two places around the polygon mirror PM (PMa, PMb), and the origin sensor is attached to the polygon mirror. When the two light beams LBa and LBb reflected by the different reflection surfaces of the PM (PMa, PMb) are directed to the reflection directions corresponding to the scanning start points of the light spots SPa and SPb on the drawing lines (scanning lines) SLa and SLb, respectively. , output the origin signal. Control of the scanning position of the light spots SPa, SPb along the drawing lines SLa, SLb (offset setting, etc.) or intensity modulation of the light spots SPa, SPb based on the pattern data (on/off of the optical elements AOMa, AOMb) The timing and the like are controlled based on the origin signal and the clock signal corresponding to the scanning speeds of the spots SPa and SPb.
[第4實施形態] [Fourth embodiment]
於以上之第1實施形態~第3實施形態及其等的各變形例中，在自多面鏡PM(PMa、PMb)至fθ透鏡FTa、FTb為止之光路中，設置有反射鏡M6a、M6b或M12a、M12b，該反射鏡M6a、M6b或M12a、M12b係於使多面鏡PM(PMa、PMb)所反射之光束LBa、LBb偏向之面(於圖5、圖6之實施形態、圖12~圖16之各實施形態、圖18~圖20之實施形態中為與XtYt面平行之面，於圖17之實施形態中為與YtZt面平行之面)內，使光束LBa、LBb彎折。於來自光源裝置14之光束LB(LBa、LBb)處於較240nm左右之波長更長之紫外線波長帶之情形時，多面鏡PM(PMa、PMb)或各反射鏡的反射面，係於玻璃或陶瓷母材的表面蒸鍍具有高反射率之鋁層，進一步於該鋁層上蒸鍍用於防止氧化等之介電體薄膜(單層或複數層)而製成。於多面鏡PM之情形時，利用鋁進行形成母材本體之加工，對成為反射面之部分進行光學研磨之後，於其表面蒸鍍介電體薄膜(單層或複數層)。對於具有此種反射面之構造之多面鏡PM(PMa、PMb)或反射鏡M6a、M6b、M12a、M12b，射入至反 射面之光束LBa、LBb的入射角會根據用於主掃描之光束偏向角度而大幅度地改變，於光束LBa、LBb具有偏振特性之情形時，有時並無法忽視反射後之光束的強度根據入射角的變化而產生變化之傾向，即反射面之反射率之入射角依存性的影響。 In the first to third embodiments and the other modified examples described above, the mirrors M6a and M6b are provided in the optical paths from the polygon mirrors PM (PMa, PMb) to the fθ lenses FTa and FTb. M12a, M12b, the mirrors M6a, M6b or M12a, M12b are arranged to deflect the light beams LBa and LBb reflected by the polygon mirrors PM (PMa, PMb) (in the embodiment of Figs. 5 and 6 and Fig. 12 to Fig. In each of the embodiments of Fig. 16 and the embodiment shown in Figs. 18 to 20, the surface parallel to the XtYt plane, in the embodiment parallel to the YtZt plane in the embodiment of Fig. 17, the light beams LBa and LBb are bent. When the light beam LB (LBa, LBb) from the light source device 14 is in an ultraviolet wavelength band longer than a wavelength of about 240 nm, the polygon mirror PM (PMa, PMb) or the reflecting surface of each mirror is attached to glass or ceramic. An aluminum layer having a high reflectance is deposited on the surface of the base material, and a dielectric thin film (single layer or a plurality of layers) for preventing oxidation or the like is further deposited on the aluminum layer. In the case of the polygon mirror PM, the base material is formed by aluminum, and the portion to be the reflecting surface is optically polished, and then a dielectric film (single layer or a plurality of layers) is deposited on the surface. For the polygon mirror PM (PMa, PMb) or the mirrors M6a, M6b, M12a, M12b having the configuration of such a reflecting surface, the injection is reversed The incident angles of the incident light beams LBa and LBb are greatly changed according to the beam deflection angle for the main scanning. When the light beams LBa and LBb have polarization characteristics, the intensity of the reflected light beam may not be ignored. The tendency of the change in the incident angle to change, that is, the influence of the incident angle dependence of the reflectance of the reflecting surface.
圖24係於YtZt面內，對投射至前面的圖17所說明之多面鏡PM與反射鏡M6a的各者之光束LBa之入射角或反射角的狀況進行說明之圖。圖24所說明之狀況，亦可同樣地產生於其他實施形態(圖5、圖6、圖12~圖16、圖18~圖20)中。於圖24中，當YtZt面內之多面鏡PM的一個反射面RPh的角度θo為45°時，與Zt軸平行地射入之光束LBa以與Yt軸平行之方式由反射面RPh反射之後，利用反射鏡M6a而彎折90°，且與後續之fθ透鏡FTa的光軸AXfa同軸地前進。若多面鏡PM設為於圖24中順時針旋轉之多面鏡，則沿著描繪線SL2a(SLa)之光點SPa的有效掃描之開始點為反射面RPh在YtZt面內達到角度θo-△θa之時點，光點SPa的有效掃描之結束點為反射面RPh在YtZt面內達到角度θo+△θa之時點。因此，由多面鏡PM的反射面RPh反射並朝向反射鏡M6a之光束LBa相對於光軸AXfa之偏向角度範圍為±2△θa。當光束LBa相對於光軸AXfa之偏向角為+2△θa時，投射至反射鏡M6a的反射面之光束LBa之入射角θm1為θm1=45°-2△θa，當光束LBa相對於光軸AXfa之偏向角為-2△θa時，投射至反射鏡M6a的反射面之光束LBa之入射角θm2為θm2=45°+2△θa。 Fig. 24 is a view for explaining the state of incidence or reflection angle of the light beam LBa of each of the polygon mirror PM and the mirror M6a projected to the front surface of Fig. 17 in the YtZt plane. The situation described in Fig. 24 can also be similarly produced in other embodiments (Fig. 5, Fig. 6, Fig. 12 to Fig. 16, Fig. 18 to Fig. 20). In FIG. 24, when the angle θo of one reflecting surface RPh of the polygon mirror PM in the YtZt plane is 45°, the light beam LBa incident in parallel with the Zt axis is reflected by the reflecting surface RPh in parallel with the Yt axis. It is bent by 90° by the mirror M6a, and is advanced coaxially with the optical axis AXfa of the subsequent fθ lens FTa. If the polygon mirror PM is set to the polygon mirror rotated clockwise in FIG. 24, the starting point of the effective scanning along the spot SPa of the drawing line SL2a (SLa) is the angle θo-Δθa in the YtZt plane as the reflecting surface RPh. At the time point, the end point of the effective scanning of the spot SPa is the point at which the reflecting surface RPh reaches the angle θo + Δθa in the YtZt plane. Therefore, the deflection angle of the light beam LBa reflected by the reflection surface RPh of the polygon mirror PM and directed toward the mirror M6a with respect to the optical axis AXfa is ±2Δθa. When the deflection angle of the light beam LBa with respect to the optical axis AXfa is +2 Δθa, the incident angle θm1 of the light beam LBa projected onto the reflecting surface of the mirror M6a is θm1=45°-2Δθa, when the light beam LBa is relative to the optical axis When the deflection angle of AXfa is -2 Δθa, the incident angle θm2 of the light beam LBa projected onto the reflecting surface of the mirror M6a is θm2 = 45° + 2 Δθa.
此處，使用圖25說明由往反射鏡M6a射入之光束LBa之入射角的變化所產生之影響。圖25係說明使具有紫外線波長帶之偏振特性之光束射入至由鋁層與介電體薄膜構成之反射面時所觀察到的反射率之入射 角依存性之特性CV1之曲線圖，縱軸表示反射面的反射率(%)，橫軸表示往反射面射入之光束之入射角(度)。一般而言，當將光束以0°之入射角(即垂直入射)投射至反射面時，反射率最大。對於圖25之特性CV1而言，最大反射率為90%左右。當入射角為45°左右時，反射率約為87%，但隨著入射角進一步增大，反射率會大幅度地降低。於多面鏡PM的各反射面(RPh)之反射率與特性CV1相同之情形時，如圖24所示，射入至多面鏡PM的反射面RPh之光束LBa之入射角，以45°為中心而於±△θa之範圍內產生變化。此處，若為了掃描描繪線SLa而射入至fθ透鏡系統FTa之光束LBa的最大偏向角度範圍±2△θa為以光軸AXfa為中心之±15°，則由於△θa為7.5°，因此往多面鏡PM的反射面RPh射入之光束LBa之入射角，以45°為中心而於37.5°~52.5°之範圍內產生變化。於特性CV1方面，入射角為37.5°時之反射率約為88%，入射角為52.5°時之反射率約為85.5%。 Here, the influence of the change in the incident angle of the light beam LBa incident on the mirror M6a will be described using FIG. Figure 25 is a view showing the incidence of reflectance observed when a light beam having a polarization characteristic of an ultraviolet wavelength band is incident on a reflecting surface composed of an aluminum layer and a dielectric film. The graph of the angular dependence characteristic CV1, the vertical axis represents the reflectance (%) of the reflecting surface, and the horizontal axis represents the incident angle (degree) of the light beam incident on the reflecting surface. In general, when the beam is projected onto the reflecting surface at an incident angle of 0° (ie, normal incidence), the reflectance is maximum. For the characteristic CV1 of Fig. 25, the maximum reflectance is about 90%. When the incident angle is about 45°, the reflectance is about 87%, but as the incident angle is further increased, the reflectance is greatly reduced. When the reflectance of each reflecting surface (RPh) of the polygon mirror PM is the same as the characteristic CV1, as shown in FIG. 24, the incident angle of the light beam LBa incident on the reflecting surface RPh of the polygon mirror PM is centered at 45°. A change occurs within the range of ±Δθa. Here, if the maximum deflection angle range ±2Δθa of the light beam LBa incident on the fθ lens system FTa for scanning the drawing line SLa is ±15° around the optical axis AXfa, since Δθa is 7.5°, The incident angle of the light beam LBa incident on the reflecting surface RPh of the polygon mirror PM changes in the range of 37.5° to 52.5° around 45°. For the characteristic CV1, the reflectance at an incident angle of 37.5° is about 88%, and the reflectance at an incident angle of 52.5° is about 85.5%.
根據以上的內容，於使由多面鏡PM反射之光束LBa維持原狀態射入至fθ透鏡系統FTa之情形時，根據特性CV1，描繪線SLa上的掃描開始點處之光點SPa的強度、與掃描結束點處之光點SPa的強度產生了88%-85.5%=2.5%之差。此意味著若以描繪線SLa的中央附近之光點SPa的強度為基準，則於描繪線SLa的兩端部，強度誤差為±1.25%。於基板P上形成之感光性功能層為光阻或乾膜之情形時，主掃描過程中的光點SP的強度偏差之允許範圍可謂為±2%左右，若強度誤差(偏差)為±1.25%，則可被允許。 According to the above, when the light beam LBa reflected by the polygon mirror PM is maintained in the original state and incident on the fθ lens system FTa, the intensity of the spot SPa at the scanning start point on the line SLa is plotted according to the characteristic CV1. The intensity of the spot SPa at the end of the scan produces a difference of 88% - 85.5% = 2.5%. This means that the intensity error is ±1.25% at both ends of the drawing line SLa based on the intensity of the spot SPa near the center of the drawing line SLa. When the photosensitive functional layer formed on the substrate P is a photoresist or a dry film, the allowable range of the intensity deviation of the spot SP during the main scanning process is about ±2%, and the intensity error (deviation) is ±1.25. % can be allowed.
然而，如圖24所示，於多面鏡PM之後亦存在有入射角會因用於光束LBa之主掃描之偏向而大幅度地產生變化的反射鏡M6a，因此， 投射至基板P上之光點SPa的強度會在主掃描方向上產生更大之強度誤差。如前面的說明所述，射入至反射鏡M6a之光束LBa之入射角，於θm1~θm2之間產生變化。於將△θa設為7.5°之情形時，θm1=45°-15°=30°，θm2=45°+15°=60°。若反射鏡M6a之反射率之入射角依存性亦與圖25的特性CV1相同，則於描繪線SLa上的光點SPa之掃描開始點，往反射鏡M6a射入之光束LBa之入射角為θm1=30°，因此，該入射角下之反射鏡M6a之反射率約為88.5%。因此，根據與多面鏡PM的反射面RPh之反射率88%之積，於光點SPa之掃描開始點，反射率總計為77.9%(88%×88.5%)。又，於描繪線SLa上的光點SPa之掃描結束點，往反射鏡M6a射入之光束LBa之入射角為θm2=60°，因此，該入射角下之反射鏡M6a之反射率約為81%。因此，根據與多面鏡PM的反射面RPh之反射率85.5%之積，於光點SPa之掃描結束點，反射率總計為69.3%(85.5%×81%)。根據以上的內容，多面鏡PM的反射面與反射鏡M6a的反射面中的總計之反射率之入射角依存性變成圖25中的特性CV2般。另外，當光束LBa相對於多面鏡PM的反射面與反射鏡M6a的反射面該兩者之入射角為45°時，總計之反射率約為75.7%(87%×87%)。 However, as shown in FIG. 24, after the polygon mirror PM, there is also a mirror M6a in which the incident angle greatly changes due to the deflection for the main scanning of the light beam LBa. The intensity of the spot SPa projected onto the substrate P produces a greater intensity error in the main scanning direction. As described above, the incident angle of the light beam LBa incident on the mirror M6a changes between θm1 and θm2. When Δθa is set to 7.5°, θm1=45°-15°=30°, θm2=45°+15°=60°. If the incident angle dependence of the reflectance of the mirror M6a is also the same as the characteristic CV1 of FIG. 25, the incident angle of the light beam LBa incident on the mirror M6a is θm1 at the scanning start point of the spot SPa on the drawing line SLa. = 30°, therefore, the reflectance of the mirror M6a at the incident angle is about 88.5%. Therefore, according to the product of the reflectance 88% of the reflection surface RPh of the polygon mirror PM, the reflectance at the scanning start point of the spot SPa is 77.9% (88% × 88.5%). Further, at the scanning end point of the spot SPa on the drawing line SLa, the incident angle of the light beam LBa incident on the mirror M6a is θm2 = 60°, and therefore, the reflectance of the mirror M6a at the incident angle is about 81. %. Therefore, the reflectance is 69.3% (85.5% × 81%) at the scanning end point of the spot SPa based on the product of the reflectance 85.5% of the reflection surface RPh of the polygon mirror PM. According to the above, the incident angle dependence of the total reflectance of the reflecting surface of the polygon mirror PM and the reflecting surface of the mirror M6a becomes the characteristic CV2 in FIG. Further, when the incident angle of the light beam LBa with respect to the reflecting surface of the polygon mirror PM and the reflecting surface of the mirror M6a is 45, the total reflectance is about 75.7% (87% × 87%).
如上所述，反射鏡M6a(M6b、M12a、M12b亦相同)具有與使由多面鏡PM反射之光束LBa(LBb)偏向之面(於圖17之實施形態中與YtZt面平行，於其他實施形態中與XtYt面平行)正交之反射面，因此，光束LBa(LBb)之入射角的變化大，對於圖25之特性CV2而言，於掃描開始點與掃描結束點，光點SPa(SPb)的強度會產生約8.6%之誤差。該值未必處於允許範圍，若有必要，較為理想的是設置某些修正(調整)機構。圖25所示之 特性CV1為一例，於反射鏡的反射面由介電體的多層膜構成之情形時，相對於入射角之反射率之變化率(斜度)有時亦會進一步增大。因此，預先透過實驗或模擬等而求出實際所使用之多面鏡PM與反射鏡M6a(M6b)各自的反射率之特性CV1，且預先求出相對於描繪線SLa(SLb)上的光點SPa(SPb)的掃描位置之光束強度之變化傾向(強度偏差、斜度等)。 As described above, the mirror M6a (M6b, M12a, and M12b are also the same) has a surface that is deflected by the light beam LBa (LBb) reflected by the polygon mirror PM (in the embodiment of Fig. 17, it is parallel to the YtZt plane, and in other embodiments) The plane is orthogonal to the XtYt plane. Therefore, the incident angle of the beam LBa (LBb) changes greatly. For the characteristic CV2 of Fig. 25, at the scanning start point and the scanning end point, the spot SPa (SPb) The intensity will produce an error of about 8.6%. This value is not necessarily within the allowable range, and it is desirable to set some correction (adjustment) mechanisms if necessary. Figure 25 The characteristic CV1 is an example. When the reflecting surface of the mirror is composed of a multilayer film of a dielectric, the rate of change (inclination) of the reflectance with respect to the incident angle may be further increased. Therefore, the characteristic CV1 of the reflectance of each of the polygon mirror PM and the mirror M6a (M6b) actually used is obtained by an experiment, simulation, or the like, and the spot SPa on the drawing line SLa (SLb) is obtained in advance. (SPb) The tendency of the beam intensity at the scanning position (intensity deviation, slope, etc.).
於上述光束強度之變化傾向為允許範圍以上之情形時，於反射鏡M6a、M6b、M12a、M12b之後的光束光路中，設置主掃描方向上之透射率連續或階段性地產生變化之中性密度濾光(ND濾光)板，能夠以光學方式抑制或修正相對於基板P上的光點SPa(SPb)的掃描位置之強度變化之傾向(強度偏差、斜度等)。中性密度濾光板能夠配置於反射鏡M6a、M6b(M12a、M12b)與fθ透鏡系統FTa、FTb之間的光路中、或fθ透鏡系統FTa、FTb與基板P之間的光路中。於fθ透鏡系統FTa、FTb之後的光路中，以覆蓋描繪線SLa、SLb之尺寸設置有平凸狀的第2柱面透鏡CY2a、CY2b，因此，亦可於該柱面透鏡CY2a、CY2b的附近設置中性密度濾光板。又，如圖5、圖18、圖22所示，於設置有以垂直射入至基板P之方式使從fθ透鏡系統FTa、FTb射出之掃描光束LBa、LBb彎折之反射鏡M7a、M7b、M15a、M15b之情形時，亦可於反射面蒸鍍使主掃描方向上之反射鏡M7a、M7b、M15a、M15b之反射率連續或階段性地產生變化之薄膜，或於反射面積層由厚度為0.1mm以下之薄玻璃所形成之中性密度濾光板，以光學方式調整(修正)相對於光點SPa(SPb)的主掃描位置之強度偏差。 When the change in the intensity of the beam tends to be above the allowable range, the transmittance in the main scanning direction is set to change continuously or in stages in the beam path after the mirrors M6a, M6b, M12a, and M12b. The filtered (ND filter) plate can optically suppress or correct the tendency (intensity deviation, slope, etc.) of the intensity change with respect to the scanning position of the spot SPa (SPb) on the substrate P. The neutral density filter can be disposed in the optical path between the mirrors M6a, M6b (M12a, M12b) and the fθ lens systems FTa, FTb, or in the optical path between the fθ lens systems FTa, FTb and the substrate P. In the optical path after the fθ lens systems FTa and FTb, the second cylindrical lenses CY2a and CY2b having the flat convex shape are provided so as to cover the drawing lines SLa and SLb. Therefore, the cylindrical lenses CY2a and CY2b may be provided. Set the neutral density filter. Further, as shown in FIG. 5, FIG. 18, and FIG. 22, mirrors M7a and M7b for bending the scanning light beams LBa and LBb emitted from the fθ lens systems FTa and FTb so as to vertically enter the substrate P are provided. In the case of M15a or M15b, a film which is vapor-deposited on the reflecting surface so that the reflectances of the mirrors M7a, M7b, M15a, and M15b in the main scanning direction are continuously or stepwise may be formed, or the thickness of the reflective area layer is The thin-density glass of 0.1 mm or less forms a neutral density filter, and optically adjusts (corrects) the intensity deviation with respect to the main scanning position of the spot SPa (SPb).
亦可藉由電氣性的修正機構修正相對於光點SPa(SPb)的掃描位置之強度變化之傾向(強度偏差、斜度等)。圖26係顯示為了根據描繪 資料使射入至描繪單元的多面鏡PM(PMa、PMb)之前的光束導通/斷開，而以前面的圖5、圖7所示之方式設置之光學元件(聲光調變元件、強度調變構件)AOMa、AOMb的控制系統的一例之方框圖。於圖26中，驅動電路100將導通/斷開用的高頻驅動訊號Sdv輸出至光學元件AOMa(AOMb)。此處，所謂的光學元件AOMa(AOMb)之斷開狀態，係指未對光學元件AOMa(AOMb)施加高頻驅動訊號Sdv，而將來自光源裝置14之光束LB在維持原狀態下作為0次光束LBu而使其透過之狀態；所謂的導通狀態，係指對光學元件AOMa(AOMb)施加高頻驅動訊號Sdv，將來自光源裝置14之光束LB之一次繞射光作為光束LBa(LBb)，以既定繞射角使其偏向而加以輸出之狀態。該繞射角係由驅動訊號Sdv(高頻訊號)的頻率(例如80MHz)決定。進一步地，若改變驅動訊號Sdv的振幅，則繞射效率會產生變化，而能夠對作為一次繞射光之光束LBa(LBb)的強度進行調整。 The tendency (intensity deviation, slope, etc.) of the intensity change with respect to the scanning position of the spot SPa (SPb) can also be corrected by an electrical correction mechanism. Figure 26 is shown for illustration The data is such that the light beam that is incident on the polygon mirror PM (PMa, PMb) before the drawing unit is turned on/off, and the optical element (acoustic and light modulation element, intensity adjustment) is arranged in the manner shown in the foregoing FIGS. 5 and 7. Variable block) A block diagram of an example of a control system of AOMa and AOMb. In FIG. 26, the drive circuit 100 outputs the on/off high frequency drive signal Sdv to the optical element AOMa (AOMb). Here, the off state of the optical element AOMa (AOMb) means that the high frequency drive signal Sdv is not applied to the optical element AOMa (AOMb), and the light beam LB from the light source device 14 is maintained as 0 times. The state in which the light beam LBu is transmitted; the so-called conductive state means that the high frequency driving signal Sdv is applied to the optical element AOMa (AOMb), and the primary light of the light beam LB from the light source device 14 is taken as the light beam LBa (LBb). A state in which the diffraction angle is biased to be output. The diffraction angle is determined by the frequency of the drive signal Sdv (high frequency signal) (for example, 80 MHz). Further, when the amplitude of the driving signal Sdv is changed, the diffraction efficiency is changed, and the intensity of the light beam LBa (LBb) which is the primary diffracted light can be adjusted.
驅動電路100，將頻率固定且振幅穩定的來自高頻振盪器SF之高頻訊號、以像素單位按位元串列從記憶體讀出之描繪位元訊號CLT、及控制訊號DE予以輸入，該記憶體記憶有使一個像素與1位元相對應而成之位元映射形式的描繪資料(圖案資料)。驅動電路100於描繪位元訊號CLT為邏輯值「1」之期間，輸出來自高頻振盪器SF之高頻訊號作為驅動訊號Sdv，於描繪位元訊號CLT為邏輯值「0」之期間，禁止送出驅動訊號Sdv。進一步地，驅動電路100內設置有功率放大器，該功率放大器能夠根據控制訊號DE而改變來自高頻振盪器SF之高頻訊號的振幅。控制訊號DE為類比訊號或數位訊號，例如為指示功率放大器的放大率(增益)之值。此處，將控制訊號DE設為類比訊號。 The driving circuit 100 inputs a high frequency signal from the high frequency oscillator SF with a fixed frequency and a stable amplitude, a drawing bit signal CLT read from a memory in a pixel unit, and a control signal DE. The memory memory has a drawing data (pattern data) in the form of a bit map in which one pixel corresponds to one bit. The driving circuit 100 outputs the high frequency signal from the high frequency oscillator SF as the driving signal Sdv while the bit signal CLT is being plotted as the logic value "1", and is prohibited during the period in which the drawing bit signal CLT is a logic value "0". Send the drive signal Sdv. Further, a power amplifier is disposed in the driving circuit 100, and the power amplifier can change the amplitude of the high frequency signal from the high frequency oscillator SF according to the control signal DE. The control signal DE is an analog signal or a digital signal, for example, a value indicating the power amplifier's amplification (gain). Here, the control signal DE is set as an analog signal.
此處，使用圖27之時序圖對如下情況進行說明，該情況係指於沿著描繪線SLa(SLb)掃描光點SPa(SPb)之圖案描繪動作中，對光束LBa(LBb)的強度進行調整。於圖27中，原點訊號在多面鏡PM的反射面旋轉至既定之角度位置並開始在基板P上掃描光點SPa(SPb)之前的時點，產生脈衝波形。因此，於多面鏡PM的反射面為8個面之情形時，原點訊號的脈衝波形在多面鏡PM旋轉一周的過程中產生8次。從產生原點訊號的脈衝波形起經過固定之延遲時間Tsq之後，產生描繪導通訊號(邏輯值「1」)，描繪位元訊號CLT施加至驅動電路100，從而開始藉由光束LBa(LBb)描繪圖案。此時，控制訊號DE的值(類比電壓)以如下特性CCv而變遷，即，從描繪導通訊號變為邏輯值「1」時之值Ra起增大，且在描繪導通訊號從邏輯值「1」變為「0」時達到值Rb。於圖27中，於控制訊號DE的值為Ro之情形時，驅動電路100內的功率放大器的增益被設定為初始值(例如10倍)。於圖27之情形時，設定為Ra<Ro<Rb，因此，於描繪導通訊號上升至「1」之描繪線SLa上的掃描開始點附近，功率放大器的增益被設定為低於初始值，因此投射至基板P之光點SPa(SPb)的強度小於初始值。又，於描繪導通訊號下降至「0」之描繪線SLa上的掃描結束點附近，功率放大器的增益被設定為高於初始值，因此，投射至基板P之光點SPa(SPb)的強度大於初始值。藉此，能夠電氣性地調整(修正)根據光點SPa(SPb)的主掃描方向位置而產生之強度偏差。 Here, a case will be described using the timing chart of FIG. 27, which refers to the intensity of the light beam LBa (LBb) in the pattern drawing operation along the drawing line SLa (SLb) scanning spot SPa (SPb). Adjustment. In Fig. 27, the origin signal generates a pulse waveform when the reflecting surface of the polygon mirror PM is rotated to a predetermined angular position and starts to scan the spot SPa (SPb) on the substrate P. Therefore, when the reflecting surface of the polygon mirror PM is eight faces, the pulse waveform of the origin signal is generated eight times during the one rotation of the polygon mirror PM. After a fixed delay time Tsq from the pulse waveform generating the origin signal, a drawing communication number (logical value "1") is generated, and the drawing bit signal CLT is applied to the driving circuit 100, thereby starting to be depicted by the light beam LBa (LBb) pattern. At this time, the value (analog voltage) of the control signal DE is changed by the following characteristic CCv, that is, the value Ra from the drawing of the communication number to the logical value "1" is increased, and the communication number is drawn from the logical value "1". When it becomes "0", it reaches the value Rb. In FIG. 27, when the value of the control signal DE is Ro, the gain of the power amplifier in the drive circuit 100 is set to an initial value (for example, 10 times). In the case of FIG. 27, Ra<Ro<Rb is set, so that the gain of the power amplifier is set lower than the initial value in the vicinity of the scanning start point on the drawing line SLa in which the drawing communication number rises to "1", The intensity of the spot SPa (SPb) projected onto the substrate P is smaller than the initial value. Further, in the vicinity of the scanning end point on the drawing line SLa where the drawing communication number drops to "0", the gain of the power amplifier is set higher than the initial value, and therefore, the intensity of the spot SPa (SPb) projected onto the substrate P is greater than Initial value. Thereby, the intensity deviation due to the position in the main scanning direction of the spot SPa (SPb) can be electrically adjusted (corrected).
如上所述之控制訊號DE的波形，能夠藉由將描繪導通訊號或原點訊號予以輸入之簡單之時間常數電路(積分電路等)而生成。又，控制訊號DE的特性CCv於圖27中呈線性地產生變化，但亦可藉由適當之濾波 器電路而呈非線性地產生變化。於以數位資訊而非類比波形授予控制訊號DE之情形時，只要以能夠以控制訊號DE的數位值改變功率放大器的增益之方式進行變形即可。 The waveform of the control signal DE as described above can be generated by a simple time constant circuit (integration circuit or the like) that inputs a pilot signal or an origin signal. Moreover, the characteristic CCv of the control signal DE changes linearly in FIG. 27, but can also be filtered by appropriate filtering. The circuit changes nonlinearly. In the case where the control signal DE is given by the digital information instead of the analog waveform, the deformation can be performed in such a manner that the gain of the power amplifier can be changed by the digital value of the control signal DE.
如以上的圖26、圖27中所述，使授予光學元件AOMa(AOMb)之高頻驅動訊號Sdv的振幅產生變化而對投射至基板P之光束LBa(LBb)的強度進行調整之電氣調整機構，在對從複數個描繪單元的各者投射至基板P之光束間的相對強度差進行調整時亦有效果。另外，電氣性地對光束LBa(LBb)的強度進行調整之機構，亦可實現例如於光源裝置14為產生紫外線波長帶之雷射光束之半導體雷射光源或高輝度LED光源之情形時，對光源的發光輝度自身進行調整。 As described above with reference to FIGS. 26 and 27, the electrical adjustment mechanism for adjusting the intensity of the light beam LBa (LBb) projected to the substrate P by changing the amplitude of the high frequency driving signal Sdv imparted to the optical element AOMa (AOMb) It is also effective in adjusting the relative intensity difference between the light beams projected from the plurality of drawing units to the substrate P. Further, the mechanism for electrically adjusting the intensity of the light beam LBa (LBb) can also be realized, for example, when the light source device 14 is a semiconductor laser light source or a high-luminance LED light source that generates a laser beam of an ultraviolet wavelength band. The illuminance of the light source itself is adjusted.
又，如以上的圖5、圖6、圖17所示，當於朝向反射面為8個面之多面鏡PM之兩條光束LBa、LBb相互平行之狀態下，利用多面鏡PM的反射面中的彼此成90°之關係之反射面的各者而使光束LBa與光束LBb反射時，光束LBa之光點SPa與光束LBb之光點SPb以相同時序於基板P上進行掃描。然而，如國際公開第2015/166910號公報所揭示，於分時(time-sharing)地將來自一個光源裝置14之光束LB分成光束LBa與光束LBb之情形時，需要進行設定，以使光點SPa之主掃描與光點SPb之主掃描不會以相同時序被執行。為此之簡單之實施形態，為於圖5、圖6、圖17所示之構成中，使用反射面為9個面之多面鏡作為多面鏡PM。於多面鏡為9個面之情形時，例如光束LBa射入至一個反射面的旋轉方向中央之時序，為其他光束LBb射入至9個面的多面鏡的反射面與反射面之間(稜線部)之時序。亦即，藉由改變反射面之數量，可使光點SPa之主掃描與光點SPb之 主掃描的時序錯開。又，對於圖5、圖6、圖17所示之構成，於多面鏡PM為8個面，且使光點SPa之主掃描與光點SPb之主掃描的時序錯開之情形時，只要將朝向多面鏡PM之光束LBa與光束LBb從相互平行之狀態設為不平行之狀態即可。 Further, as shown in FIG. 5, FIG. 6, and FIG. 17 above, in the state in which the two light beams LBa and LBb of the polygon mirror PM having eight faces facing the reflecting surface are parallel to each other, the reflecting surface of the polygon mirror PM is used. When the light beam LBa and the light beam LBb are reflected by each of the reflecting surfaces in a 90° relationship with each other, the light spot SPa of the light beam LBa and the light spot SPb of the light beam LBb are scanned on the substrate P at the same timing. However, as disclosed in Japanese Laid-Open Patent Publication No. 2015/166910, when the light beam LB from one light source device 14 is divided into the light beam LBa and the light beam LBb in time-sharing, setting is required to make the light spot The main scan of SPa and the main scan of spot SPb are not performed at the same timing. For the simple embodiment of the present invention, in the configuration shown in Figs. 5, 6, and 17, a polygon mirror having nine reflecting surfaces is used as the polygon mirror PM. When the polygon mirror is nine planes, for example, the timing at which the light beam LBa is incident on the center of the rotation direction of one of the reflection surfaces is such that the other light beam LBb is incident between the reflection surface and the reflection surface of the polygon mirror of nine faces (ridge line) Timing of the department). That is, by changing the number of reflecting surfaces, the main scanning of the spot SPa and the spot SPb can be made. The timing of the main scan is staggered. Further, in the configuration shown in FIG. 5, FIG. 6, and FIG. 17, when the polygon mirror PM has eight faces and the timing of the main scanning of the spot SPa and the main scanning of the spot SPb are shifted, the orientation is as long as The light beam LBa and the light beam LBb of the polygon mirror PM may be in a state of being non-parallel from a state in which they are parallel to each other.
AXr‧‧‧旋動中心軸 AXr‧‧‧Rotating central axis
MK1~MK4‧‧‧對準標記 MK1~MK4‧‧‧ alignment mark
P‧‧‧基板(被照射體) P‧‧‧Substrate (irradiated body)
PM‧‧‧多面鏡 PM‧‧‧Multiface mirror
Poc1、Poc2‧‧‧中心面 Poc1, Poc2‧‧‧ center surface
SLa、SLb‧‧‧描繪線(掃描線) SLa, SLb‧‧‧ drawing line (scanning line)
SL1a~SL6a、SL1b~SL6b‧‧‧描繪線 SL1a~SL6a, SL1b~SL6b‧‧‧ depicting lines
U1、U2、U3、U4、U5、U6‧‧‧描繪單元 U1, U2, U3, U4, U5, U6‧‧‧ drawing unit
W‧‧‧曝光區域 W‧‧‧Exposure area
X、Y、Z‧‧‧方向 X, Y, Z‧‧ Direction
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| TWI693482B (en) * | 2018-12-22 | 2020-05-11 | 財團法人工業技術研究院 | Exposure apparatus |
| US20230266674A1 (en) * | 2020-05-09 | 2023-08-24 | Inspec Inc. | Drawing method, drawing device, and program |
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