TW201643951A - Cutting device and cutting method - Google Patents
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- TW201643951A TW201643951A TW105101656A TW105101656A TW201643951A TW 201643951 A TW201643951 A TW 201643951A TW 105101656 A TW105101656 A TW 105101656A TW 105101656 A TW105101656 A TW 105101656A TW 201643951 A TW201643951 A TW 201643951A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 526
- 238000000034 method Methods 0.000 title claims description 33
- 239000000758 substrate Substances 0.000 claims abstract description 275
- 230000007246 mechanism Effects 0.000 claims description 76
- 230000007723 transport mechanism Effects 0.000 claims description 52
- 230000008569 process Effects 0.000 claims description 9
- 239000003550 marker Substances 0.000 claims description 5
- 238000012545 processing Methods 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 230000032258 transport Effects 0.000 claims description 4
- 229920005989 resin Polymers 0.000 description 41
- 239000011347 resin Substances 0.000 description 41
- 239000002184 metal Substances 0.000 description 23
- 229910052751 metal Inorganic materials 0.000 description 23
- 238000007789 sealing Methods 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 235000012431 wafers Nutrition 0.000 description 7
- 239000000470 constituent Substances 0.000 description 6
- 238000007689 inspection Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005488 sandblasting Methods 0.000 description 2
- 238000010897 surface acoustic wave method Methods 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 238000012937 correction Methods 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000000449 premovement Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Dicing (AREA)
Abstract
Description
本發明係關於一種切斷被切斷物，以製造被單片化之複數製品之切斷裝置及切斷方法。 The present invention relates to a cutting device and a cutting method for cutting a cut object to produce a plurality of singulated products.
使由印刷基板或導線架等所構成之基板，假想性地分割成格子狀之複數領域，組裝一個或複數個晶片狀之元件(例如半導體晶片)到各領域後，將樹脂密封基板全體稱做已密封基板。藉使用旋轉刀等之切斷機構，切斷已密封基板，分別單片化成各領域單位者成為製品。 A substrate composed of a printed circuit board or a lead frame is imaginarily divided into a plurality of fields in a lattice shape, and one or a plurality of wafer-shaped elements (for example, semiconductor wafers) are assembled to various fields, and the entire resin sealing substrate is referred to as The substrate has been sealed. By using a cutting mechanism such as a rotary blade, the sealed substrate is cut, and each of the individual units is formed into a product.
先前以來，使用切斷裝置，藉旋轉刀等之切斷機構，切斷已密封基板之既定領域。例如BGA(Ball Grid Array Package)製品，係如下地被切斷。首先，載置已密封基板到切斷用桌台上。接著，對位已密封基板。藉對位，設定分隔複數領域之假想性切斷線之位置。接著，相對性移動載置有已密封基板之切斷用桌台與切斷機構。噴射切削液到已密封基板的切斷處所，同時藉沿著被設定在已密封基板上之切斷線，藉切斷機構切斷已密封基板。藉切斷已密封基板，製造被單片化之製品。 Conventionally, a cutting device has been used to cut a predetermined field of a sealed substrate by a cutting mechanism such as a rotary blade. For example, a BGA (Ball Grid Array Package) product is cut as follows. First, the sealed substrate is placed on the cutting table. Next, the aligned substrate is sealed. By the alignment, the position of the hypothetical cut line separating the plural fields is set. Next, the table for cutting and the cutting mechanism for the sealed substrate are placed in relative movement. The cutting fluid is ejected to the cut position of the sealed substrate, and the sealed substrate is cut by the cutting mechanism along the cutting line set on the sealed substrate. The singulated article is manufactured by cutting the sealed substrate.
在切斷用桌台安裝有對應製品之切斷用治具。在切斷用治具上，載置吸著有已密封基板。切斷用治具係具有金 屬板及被固定在金屬板上之樹脂片。在樹脂片設有分別吸著保持已密封基板的複數領域之複數台地狀突起部。在複數之突起部分別設有吸著孔。吸著孔係自突起部的表面，貫穿樹脂片與金屬桌台。在突起部們之間，設有對應分隔已密封基板的各領域之複數切斷線之位置之複數切斷凹槽。切斷用桌台與切斷機構係相對性移動，藉此，已密封基板沿著複數切斷凹槽，被切斷而被單片化。 A cutting jig for a corresponding product is attached to the cutting table. The sealed substrate is placed on the cutting jig. Cutting fixture has gold A plate and a resin sheet fixed to the metal plate. The resin sheet is provided with a plurality of floor-like protrusions that respectively absorb and hold the sealed substrate. A suction hole is provided in each of the plurality of protrusions. The suction hole is formed from the surface of the protrusion and penetrates the resin sheet and the metal table. Between the protrusions, a plurality of cutting grooves corresponding to the positions separating the plurality of cutting lines of the respective fields of the sealed substrate are provided. The cutting table and the cutting mechanism are relatively moved, whereby the sealed substrate is cut along the plurality of grooves, cut and singulated.
當切斷已密封基板時，對位已密封基板的切斷線，到被安裝在切斷用桌台上之切斷用治具的切斷凹槽之位置以切斷之。沿著切斷線移動旋轉刀，藉此，切斷已密封基板。當在切斷用治具的切斷凹槽之位置，與已密封基板的切斷線之位置係偏移之狀態下，切斷已密封基板時，旋轉刀係自切斷凹槽之位置偏移，有時會切削樹脂片的一部份。藉樹脂片被切削，產生大量之切屑。藉突起部的周邊被切削，當在吸著孔產生洩漏時，吸著已密封基板或被單片化之製品變得困難。而且，切斷用治具之壽命變短，當頻繁地更換切斷用治具時，切斷裝置之運轉成本變高。因此，正確地對位已密封基板的切斷線之位置，到切斷用治具的切斷凹槽之位置以切斷係變得重要。 When the sealed substrate is cut, the cutting line of the aligned sealed substrate is cut at the position of the cutting groove of the cutting jig attached to the cutting table. The rotary blade is moved along the cutting line, thereby cutting the sealed substrate. When the position of the cutting groove of the cutting jig is offset from the position of the cutting line of the sealed substrate, the position of the rotating blade from the cutting groove is deviated when the sealed substrate is cut. Move, sometimes cutting a part of the resin sheet. The resin sheet is cut to produce a large amount of chips. By the periphery of the projection being cut, it is difficult to suck the sealed substrate or the singulated article when a leak occurs in the suction hole. Further, the life of the cutting jig is shortened, and when the jig for cutting is frequently replaced, the running cost of the cutting device becomes high. Therefore, it is important to accurately align the position of the cutting line of the sealed substrate to the position of the cutting groove of the cutting jig to cut the system.
可高精度進行位置檢出之切斷裝置，提案有「(省略)，一種切斷裝置，其具有：搬運機構，使電子電路基板藉供給部提起，以轉置到切斷用桌台上；以及切斷部，使被載置在切斷用桌台上之電子電路基板，切斷成各個電子電路，其特徵在於：搬運機構係具有進行電子電路基板之定位之定位機 構」(參照例如專利文獻1的段落【0009】、第1圖及第2圖)。 A cutting device capable of detecting a position with high precision is proposed as "(omitted), a cutting device having a transport mechanism for lifting an electronic circuit board by a supply portion and transferring it to a table for cutting; And a cutting unit that cuts the electronic circuit board placed on the cutting table into each electronic circuit, wherein the transport mechanism has a positioning machine that performs positioning of the electronic circuit board. (see, for example, paragraphs [0009], 1 and 2 of Patent Document 1).
【專利文獻1】日本特開2005-353723號公報 [Patent Document 1] Japanese Patent Laid-Open Publication No. 2005-353723
但是，在被開示於專利文獻1之切斷裝置1中，產生以下之課題。如專利文獻1的第1圖及第2圖所示，搬運機構24係在尖端具有握持部25，而藉機械手臂或XYZ移動台構成。在握持部25握持工件6，以自供給桌台15移轉到切斷用桌台28。握持部25係由握持板25a、吸著板25c、定位銷(定位機構的一部份)25d、彈簧25e等所構成。定位銷25d係用於定位工件6，持續握持在握持部25之物件。在工件6，係於與定位銷25d對應之位置設有定位孔(定位機構的一部份)6c。定位孔6c係被形成為直徑與定位銷25d概略一致之圓孔。 However, in the cutting device 1 disclosed in Patent Document 1, the following problems occur. As shown in FIGS. 1 and 2 of Patent Document 1, the transport mechanism 24 has a grip portion 25 at the tip end and is constituted by a robot arm or an XYZ moving table. The workpiece 6 is held by the grip portion 25 to be transferred from the supply table 15 to the cutting table 28. The grip portion 25 is composed of a grip plate 25a, a suction plate 25c, a positioning pin (a part of the positioning mechanism) 25d, a spring 25e, and the like. The positioning pin 25d is used to position the workpiece 6 and continuously hold the object in the grip portion 25. In the workpiece 6, a positioning hole (a part of the positioning mechanism) 6c is provided at a position corresponding to the positioning pin 25d. The positioning hole 6c is formed as a circular hole whose diameter substantially coincides with the positioning pin 25d.
在這種搬運機構24中，被設於握持板25a上之定位銷25d係被***工件6的定位孔6c以持續被定位，工件6藉空氣吸著，被吸著在握持板25a上。因此，必須在工件6上，形成四處之定位孔6c。在切斷之全部工件6上，形成四處之定位孔6c，所以，形成定位孔6c之手續與費用變成很多。當定位銷25d與定位孔6c沒有精度很好地被形成時，也有無法定位工件6之弊害。 In this transport mechanism 24, the positioning pin 25d provided on the grip plate 25a is inserted into the positioning hole 6c of the workpiece 6 to be continuously positioned, and the workpiece 6 is sucked by the air and sucked on the grip plate 25a. Therefore, it is necessary to form the positioning holes 6c at four places on the workpiece 6. Since the positioning holes 6c are formed in all of the cut workpieces 6, the procedure and cost for forming the positioning holes 6c become large. When the positioning pin 25d and the positioning hole 6c are formed with high precision, there is a disadvantage that the workpiece 6 cannot be positioned.
本發明係解決上述課題者，提供一種於切斷裝置 中，可正確對合已密封基板的切斷線之位置，到切斷用治具的切斷凹槽之位置之切斷裝置及切斷方法。 The present invention is to solve the above problems and provide a cutting device In this case, the cutting device and the cutting method for cutting the position of the cutting line of the sealed substrate to the position where the cutting groove of the jig is cut can be correctly aligned.
為解決上述課題，本發明之切斷裝置，係一種切斷裝置，其具有：切斷用治具，具有複數之第1標記與複數之切斷凹槽；切斷機構，被載置在切斷用治具上，使具有複數第2標記之被切斷物，沿著複數切斷線切斷；搬運機構，搬運被切斷物；以及移動機構，使切斷用治具與切斷機構相對性移動；藉沿著複數之切斷線切斷被切斷物以製造複數製品時被使用，其特徵在於具有：攝影機構，拍攝複數之第1標記及複數之第2標記；以及控制機構，藉搬運機構，對位被載置於切斷用治具上之被切斷物與切斷用治具；控制機構係比較由依據藉攝影機構所取得之影像數據所測得，且事先被記憶之特定之第1標記之位置資訊所構成之第1位置資訊，與由藉攝影機構被測得之特定之第2標記之位置資訊所構成之第2位置資訊，藉此，算出表示切斷用治具與被切斷物間之位置偏移之偏移量，搬運機構係自切斷用治具提起被切斷物，依據偏移量，使搬運機構與切斷用治具相對性移動，藉此，在使被切斷物移動至對應偏移量之目標位置後，搬運機構再次載置被切斷物到切斷用治具，藉被切斷物移動至目標位置後，複數切斷凹槽之位置與複數切斷線之位置係被對位，切斷機構係使再次被載置之被切斷物，沿著複數之切斷線切斷。 In order to solve the above problems, the cutting device of the present invention is a cutting device comprising: a cutting jig having a plurality of first marks and a plurality of cutting grooves; and a cutting mechanism placed on the cutting In the jig, the cut object having the plurality of second marks is cut along the plurality of cutting lines; the transport mechanism transports the object to be cut; and the moving mechanism causes the cutting jig and the cutting mechanism Relative movement; used when cutting a cut object along a plurality of cutting lines to manufacture a plurality of articles, comprising: a photographing mechanism, a first mark for capturing a plurality of marks and a second mark of plural; and a control mechanism By means of a transport mechanism, the object to be cut placed on the cutting jig and the jig for cutting are compared; the control mechanism is measured by the image data obtained by the photographing mechanism, and is previously The first position information composed of the position information of the specific first mark of the memory and the second position information composed of the position information of the specific second mark measured by the borrowing means, thereby calculating and indicating the cut Position between the jig and the object to be cut In the transfer mechanism, the object to be cut is lifted from the cutting jig, and the transport mechanism and the jig for the cutting are relatively moved in accordance with the offset amount, whereby the object to be cut is moved to the corresponding position. After the target position of the offset, the transport mechanism again places the object to be cut to the cutting jig, and after the object is moved to the target position, the position of the plurality of cut grooves and the position of the plurality of cutting lines are When it is aligned, the cutting mechanism causes the object to be placed to be placed again to be cut along a plurality of cutting lines.
本發明之切斷裝置，係在上述切斷裝置中，被包含在切斷機構且貢獻於切斷之機構的至少一部份，或者，自切 斷機構被供給且貢獻於切斷之機構的至少一部份，係通過切斷凹槽，切斷凹槽係對應複數切斷線之中，被切斷之切斷線。 The cutting device according to the present invention is characterized in that the cutting device is included in the cutting mechanism and contributes to at least a part of the cutting mechanism, or is self-cutting At least a part of the mechanism that is supplied and contributed to the cutting mechanism is cut by the cutting groove, and the cutting groove is cut into the cutting line corresponding to the plurality of cutting lines.
本發明之切斷裝置，係在上述切斷裝置中，相對性移動搬運機構與切斷用治具，藉此，沿著X方向、Y方向及θ方向中之至少一個方向，移動被切斷物到目標位置後，搬運機構係再次載置被切斷物到切斷用治具。 In the cutting device according to the present invention, in the cutting device, the movable transport mechanism and the cutting jig are relatively moved, whereby the movement is cut in at least one of the X direction, the Y direction, and the θ direction. After the object reaches the target position, the transport mechanism again places the object to be cut to the cutting jig.
本發明之切斷裝置，係在上述切斷裝置中，特定之第1標記，係自俯視觀之，分別沿著第1方向及與第1方向直交之第2方向，至少被設定兩個，特定之第2標記，係自俯視觀之，分別沿著第1方向及與第1方向直交之第2方向，至少被設定兩個。 In the cutting device according to the present invention, the specific first marking is set at least two along the first direction and the second direction orthogonal to the first direction, as viewed from above. The specific second mark is set at least two along the first direction and the second direction orthogonal to the first direction, as viewed from above.
本發明之切斷裝置，係在上述切斷裝置中，被切斷物係已密封基板，或者，被分割後之已密封基板。 In the cutting device according to the present invention, in the cutting device, the object to be cut is a sealed substrate or a sealed substrate that has been divided.
本發明之切斷裝置，係在上述切斷裝置中，被切斷物係在分別對應於複數製品之複數領域中，被製入功能元件之基板。 In the cutting device according to the present invention, in the cutting device, the object to be cut is formed into a substrate of the functional element in a plurality of fields corresponding to the plurality of products.
為解決上述課題，本發明之切斷方法，係一種切斷方法，其具有：準備具有複數切斷凹槽與複數第1標記之切斷用治具之工序；準備具有複數切斷線與複數第2標記之被切斷物之工序；藉搬運機構，載置被切斷物到切斷用治具上之工序；以及相對性移動切斷用治具與切斷機構，藉此，使用切斷機構，以沿著複數切斷線切斷被切斷物之工序；其特徵在於具有：藉攝影機構拍攝複數第1標記之中，特定之第1標記，以取得第1影像數據之工序；依據第1影像數據以影像處理，藉 此，取得由特定之第1標記之位置資訊所構成之第1位置資訊之工序；藉攝影機構拍攝複數第2標記之中，特定之第2標記，以取得第2影像數據之工序；依據第2影像數據以影像處理，藉此，取得由特定之第2標記之位置資訊所構成之第2位置資訊之工序；比較第1位置資訊與第2位置資訊，藉此，算出表示切斷用治具與被切斷物間之位置偏移之偏移量之工序；搬運機構係自切斷用治具，提起被切斷物之工序；依據偏移量，相對性移動搬運機構與切斷用治具，藉此，移動被切斷物至對應偏移量之目標位置之工序；以及搬運機構係再度載置被切斷物到切斷用治具之工序；在移動之工序中，移動被切斷物到目標位置，藉此，對位複數切斷凹槽之位置與複數切斷線之位置，在切斷之工序中，切斷再度被載置之被切斷物。 In order to solve the above problems, the cutting method of the present invention is a cutting method comprising the steps of preparing a cutting jig having a plurality of cutting grooves and a plurality of first marks; preparing a plurality of cutting lines and plural numbers The step of cutting the object of the second mark; the step of placing the object to be cut on the jig for cutting by the transport mechanism; and the jig and the cutting mechanism for relatively moving the cutting device, thereby using the cut a step of cutting the object to be cut along a plurality of cutting lines; and a step of capturing a first image of the plurality of first marks by the photographing means to obtain the first image data; According to the first image data, image processing, borrowing Here, the step of acquiring the first position information composed of the position information of the specific first mark; and the photographing means capturing the second mark of the plurality of second marks to obtain the second image data; 2: The image data is processed by the image, thereby obtaining the second position information composed of the position information of the specific second mark; and comparing the first position information with the second position information, thereby calculating the cut treatment a step of shifting the positional deviation from the object to be cut; the transport mechanism is a step of lifting the jig from the cutting jig, and lifting the transport mechanism and the cutting device according to the offset amount a step of moving the object to be cut to a target position corresponding to the offset; and a transport mechanism for placing the object to be cut again to the cutting jig; and in the moving process, moving When the cut object reaches the target position, the position of the groove and the position of the plurality of cutting lines are cut by the registration plural, and the object to be cut which is placed again is cut in the cutting step.
本發明之切斷方法，係在上述切斷方法中，在切斷之工序中，使被包含在切斷機構且貢獻於切斷之機構的至少一部份，或者，自切斷機構被供給且貢獻於切斷之機構的至少一部份，係通過切斷凹槽，切斷凹槽係對應複數切斷線之中，被切斷之切斷線。 In the cutting method according to the present invention, in the cutting method, at least a part of the mechanism included in the cutting mechanism and contributing to the cutting is supplied in the cutting step, or is supplied from the cutting mechanism. And at least a part of the mechanism contributing to the cutting is cut by cutting the groove, and the cutting line is cut by the cut line corresponding to the plurality of cutting lines.
本發明之切斷方法，係在上述切斷方法中，在移動被切斷物之工序中，相對性移動搬運機構與切斷用治具，藉此，沿著X方向、Y方向及θ方向中之至少一個方向，移動被切斷物到目標位置。 In the cutting method of the present invention, in the step of moving the object to be cut, the transporting means and the cutting jig are relatively moved, thereby along the X direction, the Y direction, and the θ direction. In at least one of the directions, the object to be cut is moved to the target position.
本發明之切斷方法，係在上述切斷方法中，其具有：自俯視觀之，分別沿著第1方向及與第1方向直交之第2方向，設定複數第1標記之中，至少由兩個所構成之特定之第 1標記之工序；以及自俯視觀之，分別沿著第1方向及與第1方向直交之第2方向，設定複數第2標記之中，至少由兩個所構成之特定之第2標記之工序。 In the cutting method according to the present invention, the cutting method has a shape in which a plurality of first marks are set along a first direction and a second direction orthogonal to the first direction, at least The specific number of the two a step of marking a mark; and a step of setting a specific second mark composed of at least two of the plurality of second marks along the first direction and the second direction orthogonal to the first direction, respectively, in plan view .
本發明之切斷方法，係在上述切斷方法中，被切斷物係已密封基板，或者，被分割後之已密封基板。 In the cutting method of the present invention, in the cutting method, the object to be cut is a sealed substrate or a sealed substrate after being divided.
本發明之切斷方法，係在上述切斷方法中，被切斷物係在分別對應於複數製品之複數領域中，被製入功能元件之基板。 In the cutting method of the present invention, in the cutting method, the object to be cut is formed into a substrate of the functional element in a plurality of fields corresponding to the plurality of products.
當依據本發明時，在切斷裝置中，其具有：切斷用治具，具有複數之第1標記與複數之切斷凹槽；切斷機構，被載置在切斷用治具上，使具有複數第2標記之被切斷物，沿著複數切斷線切斷；搬運機構，搬運被切斷物；移動機構，使切斷用治具與切斷機構相對性移動；攝影機構，拍攝複數之第1標記及複數之第2標記；以及控制機構，對位被切斷物與切斷用治具。比較藉攝影機構所測得，且事先被記憶之第1位置資訊，與藉攝影機構被測得之第2位置資訊，藉此，算出表示切斷用治具與被切斷物間之位置偏移之偏移量。依據偏移量，使搬運機構與切斷用治具相對性移動，藉此，移動被切斷物至目標位置。藉此，被設於切斷機構上之旋轉刀，係不自切斷用治具的切斷凹槽之位置偏移地，可沿著切斷線正確地切斷被切斷物。 According to the invention, the cutting device has a cutting jig having a plurality of first marks and a plurality of cutting grooves, and the cutting mechanism is placed on the cutting jig. The object to be cut having the plurality of second marks is cut along the plurality of cutting lines; the conveying mechanism transports the object to be cut; and the moving mechanism moves the cutting jig and the cutting mechanism relative to each other; The first mark of the plural number and the second mark of the plural number are photographed; and the control means, the object to be cut and the jig for cutting. Comparing the first position information measured by the photographing mechanism and being memorized in advance, and the second position information measured by the photographing mechanism, thereby calculating the positional deviation between the cutting jig and the object to be cut. The offset of the shift. According to the offset amount, the transport mechanism and the jig for cutting are relatively moved, whereby the object to be cut is moved to the target position. In this way, the rotary blade provided on the cutting mechanism can accurately cut the object to be cut along the cutting line without shifting the position of the cutting groove of the cutting jig.
1‧‧‧已密封基板(被切斷物) 1‧‧‧ Sealed substrate (cut object)
2‧‧‧基板 2‧‧‧Substrate
3‧‧‧密封樹脂 3‧‧‧ sealing resin
4,4A,4B,...,4G,4H‧‧‧第2標記 4,4A,4B,...,4G,4H‧‧‧2nd mark
5‧‧‧第1切斷線(切斷線) 5‧‧‧1st cutting line (cut line)
5‧‧‧第2切斷線(切斷線) 5‧‧‧2nd cutting line (cut line)
7‧‧‧領域(製品) 7‧‧‧Fields (products)
8‧‧‧切斷用桌台 8‧‧‧Severance table
9‧‧‧切斷用治具 9‧‧‧Cut cutting tool
10‧‧‧金屬桌台 10‧‧‧Metal table
11‧‧‧樹脂片 11‧‧‧Resin tablets
12‧‧‧突出部 12‧‧‧Protruding
13‧‧‧吸著孔 13‧‧‧Sucking holes
14‧‧‧空間 14‧‧‧ Space
15‧‧‧第1切斷凹槽(切斷凹槽) 15‧‧‧1st cut groove (cut groove)
16‧‧‧第2切斷凹槽(切斷凹槽) 16‧‧‧2nd cut groove (cut groove)
17,17A,17B,...,17G,17H‧‧‧第1標記 17,17A,17B,...,17G,17H‧‧‧1st mark
18,18A,18B,...,18G,18H‧‧‧第1標記 18, 18A, 18B, ..., 18G, 18H‧‧‧ 1st mark
19‧‧‧切斷裝置 19‧‧‧cutting device
20‧‧‧基板供給機構 20‧‧‧Substrate supply mechanism
21‧‧‧基板載置部 21‧‧‧Substrate Mounting Department
22‧‧‧搬運機構 22‧‧‧Transportation agencies
23‧‧‧移動機構 23‧‧‧Mobile agencies
24‧‧‧旋轉機構 24‧‧‧Rotating mechanism
25‧‧‧對位用攝影機(攝影機構) 25‧‧‧Alignment camera (photo agency)
26‧‧‧主軸(切斷機構) 26‧‧‧ Spindle (cutting mechanism)
27‧‧‧旋轉刀 27‧‧‧Rotary knife
28‧‧‧檢查用桌台 28‧‧‧Check table
29‧‧‧已切斷基板 29‧‧‧The substrate has been cut
30‧‧‧托盤 30‧‧‧Tray
31‧‧‧大型以密封基板 31‧‧‧ Large sealed substrate
32,32A,32B,...,32G,32H,32I,32J‧‧‧第2標記 32, 32A, 32B, ..., 32G, 32H, 32I, 32J‧‧‧ 2nd mark
33‧‧‧分割線 33‧‧‧ dividing line
34‧‧‧分割線 34‧‧‧ dividing line
35,35A,35B,35C,35D‧‧‧被分割之已密封基板(被切斷物) 35,35A, 35B, 35C, 35D‧‧‧Segmented sealed substrate (cut object)
A‧‧‧基板供給模組 A‧‧‧Substrate supply module
B‧‧‧基板切斷模組 B‧‧‧Substrate cutting module
C‧‧‧檢查模組 C‧‧‧Check module
P‧‧‧製品 P‧‧‧Products
CTL‧‧‧控制部(控制機構) CTL‧‧‧Control Department (Control Agency)
SUB‧‧‧已密封基板被載置之領域 SUB‧‧‧The field in which the sealed substrate has been placed
第1A圖係表示在本發明切斷裝置的實施例1中被使用之已密封基板之示意圖，其係自基板側觀看之俯視圖。 Fig. 1A is a schematic view showing a sealed substrate used in the first embodiment of the cutting device of the present invention, which is a plan view seen from the substrate side.
第1B圖係表示在本發明切斷裝置的實施例1中被使用之已密封基板之示意圖，其係自基板側觀看之正視圖。 Fig. 1B is a schematic view showing a sealed substrate used in the first embodiment of the cutting device of the present invention, which is a front view as seen from the substrate side.
第2A圖係表示對應第1A圖與第1B圖所示已密封基板之切斷用治具之示意圖，其係俯視圖。 Fig. 2A is a schematic view showing a cutting jig corresponding to the sealed substrate shown in Figs. 1A and 1B, and is a plan view.
第2B圖係表示對應第1A圖與第1B圖所示已密封基板之切斷用治具之示意圖，其係自A-A線所見之示意剖面圖。 Fig. 2B is a schematic view showing the jig for cutting the sealed substrate shown in Figs. 1A and 1B, which is a schematic cross-sectional view taken along line A-A.
第3A圖係表示在本發明切斷裝置的實施例2中之切斷用治具之示意圖，其係俯視圖。 Fig. 3A is a schematic view showing a cutting jig in the second embodiment of the cutting device of the present invention, which is a plan view.
第3B圖係表示在本發明切斷裝置的實施例2中之切斷用治具之示意圖，其係自B-B線所見之示意剖面圖。 Fig. 3B is a schematic view showing the jig for cutting in the second embodiment of the cutting device of the present invention, which is a schematic cross-sectional view taken from line B-B.
第4圖係表示在本發明切斷裝置的實施例3中之切斷裝置之示意俯視圖。 Fig. 4 is a schematic plan view showing a cutting device in a third embodiment of the cutting device of the present invention.
第5A圖係表示使用被設於切斷用治具上之第1標記，以載置已密封基板到切斷用桌台上之過程之示意剖面圖。 Fig. 5A is a schematic cross-sectional view showing a process of placing a sealed substrate on a cutting table by using a first mark provided on the cutting jig.
第5B圖係表示使用被設於切斷用治具上之第1標記，以載置已密封基板到切斷用桌台上之過程之示意剖面圖。 Fig. 5B is a schematic cross-sectional view showing a process of placing a sealed substrate on a cutting table by using a first mark provided on the cutting jig.
第5C圖係表示使用被設於切斷用治具上之第1標記，以載置已密封基板到切斷用桌台上之過程之示意剖面圖。 Fig. 5C is a schematic cross-sectional view showing a process of placing a sealed substrate on a cutting table by using a first mark provided on the cutting jig.
第5D圖係表示使用被設於切斷用治具上之第1標記，以載置已密封基板到切斷用桌台上之過程之示意剖面圖。 Fig. 5D is a schematic cross-sectional view showing a process of placing a sealed substrate on a cutting table by using a first mark provided on the cutting jig.
第5E圖係表示使用被設於切斷用治具上之第1標記，以載置已密封基板到切斷用桌台上之過程之示意剖面圖。 Fig. 5E is a schematic cross-sectional view showing a process of placing the sealed substrate on the cutting table by using the first mark provided on the cutting jig.
第6A圖係表示使在偏移到切斷用桌台之狀態下被載置之已密封基板，修正偏移量以載置到正常位置後之狀態之示意圖，其係表示已密封基板偏移後之狀態之俯視圖。 6A is a schematic view showing a state in which the sealed substrate placed in the state of being displaced to the cutting table is placed and the offset amount is corrected to be placed on the normal position, and the sealed substrate is offset. A top view of the state after.
第6B圖係表示使在偏移到切斷用桌台之狀態下被載置之已密封基板，修正偏移量以載置到正常位置後之狀態之示意圖，其係表示被載置到正常位置後之狀態之俯視圖。 Fig. 6B is a schematic view showing a state in which the sealed substrate placed in the state of being shifted to the cutting table is placed and the offset amount is corrected to be placed on the normal position, and is shown as being placed on the normal state. A top view of the state after the position.
第7A圖係表示在本發明切斷裝置的實施例4中，被使用之大型已密封基板之示意圖，其係自基板側觀看之俯視圖。 Fig. 7A is a schematic view showing a large sealed substrate to be used in the fourth embodiment of the cutting device of the present invention, which is a plan view seen from the substrate side.
第7B圖係表示在本發明切斷裝置的實施例4中，被使用之大型已密封基板之示意圖，其係表示四分割大型已密封基板後之狀態之俯視圖。 Fig. 7B is a plan view showing a large sealed substrate to be used in the fourth embodiment of the cutting device of the present invention, and is a plan view showing a state in which a large-sized sealed substrate is divided.
第8圖係表示載置被分割後之已密封基板到切斷用桌台後之已分割基板之狀態之俯視圖。 Fig. 8 is a plan view showing a state in which the divided substrate after the divided sealed substrate is placed on the cutting table.
如第2A圖及第2B圖所示，在切斷裝置中，安裝對應製品之切斷用治具9到切斷用桌台8。在切斷用治具9的樹脂片11，設置由複數之對位標記所構成第1標記17A、17B、...(以下，總稱為第1標記17。關於其他之構成元件也相同。)。第1標記17A、17B、...，係對應由形成在已密封基板1上之複數對位標記所構成之第2標記4A、4B、...而設置。在切斷用桌台8中，量測被形成在樹脂片11上之第1標記17的座標位置，以當作基準的座標位置而事先記憶。比較此基準的座標位置，與被載置於切斷用桌台8，且被測得之已密封基板1的第2標記4的座標位置，藉此，算出已密封基板1的偏移量。 藉修正此偏移量，可正確對位已密封基板1的第2標記4的位置，到切斷用治具9的第1標記17之位置。因此，可正確對位被設定於已密封基板1上之複數切斷線之位置，到被設於切斷用治具9上複數切斷凹槽之位置。藉此，被設於切斷機構上之旋轉刀，不會自切斷用治具9的切斷凹槽之位置偏移，可正確地沿著切斷線切斷已密封基板1。 As shown in FIGS. 2A and 2B, in the cutting device, the cutting jig 9 for the corresponding product is attached to the cutting table 8. In the resin sheet 11 of the jig 9 for cutting, the first marks 17A, 17B, ... (hereinafter, collectively referred to as the first marks 17) are formed by a plurality of alignment marks. The same applies to the other constituent elements. . The first marks 17A, 17B, ... are provided corresponding to the second marks 4A, 4B, ... formed by the plurality of alignment marks formed on the sealed substrate 1. In the cutting table 8, the coordinate position of the first mark 17 formed on the resin sheet 11 is measured, and is memorized in advance as a coordinate position of the reference. The coordinate position of the reference is compared with the coordinate position of the second mark 4 of the sealed substrate 1 which is placed on the cutting table 8 and is measured, thereby calculating the offset amount of the sealed substrate 1. By correcting this offset, the position of the second mark 4 of the sealed substrate 1 can be correctly aligned to the position of the first mark 17 of the jig 9 for cutting. Therefore, the position of the plurality of cutting lines set on the sealed substrate 1 can be correctly aligned, and the position of the plurality of cutting grooves provided on the cutting jig 9 can be cut. Thereby, the rotary blade provided in the cutting mechanism is not displaced from the position of the cutting groove of the cutting jig 9, and the sealed substrate 1 can be cut accurately along the cutting line.
針對本發明切斷裝置的實施例1，參照第1A圖、第1B圖、第2A圖及第2B圖做說明。為使在本申請案文件中之任何圖面皆容易瞭解，而適宜省略或誇張地示意描繪。針對相同之構成元件，係賦予相同編號而適宜省略其說明。 The first embodiment of the cutting device according to the present invention will be described with reference to Figs. 1A, 1B, 2A and 2B. In order to make any of the drawings in this document easy to understand, it is appropriate to omit or exaggerately depict the drawing. The same constituent elements are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.
如第1A圖及第1B圖所示，已密封基板係具有：基板2，由印刷基板或導線架等所構成；複數之晶片狀零件(未圖示)，被組裝在基板2具有之複數領域(下述)；以及密封樹脂3，被形成使得總括地覆蓋複數領域。已密封基板1係最後被切斷成被單片化之被切斷物。 As shown in FIGS. 1A and 1B, the sealed substrate has a substrate 2 composed of a printed substrate or a lead frame, and a plurality of wafer-shaped components (not shown) assembled in a plurality of fields of the substrate 2. (described below); and the sealing resin 3 are formed so as to collectively cover the plural fields. The sealed substrate 1 is finally cut into pieces that are singulated.
如第1A圖所示，在已密封基板1係沿著基板2的縱向及橫向，形成有多數之第2標記4A，4B，...(在圖中，以+表示之標記)。第2標記4係藉製品的尺寸及數量，而被任意設定。藉對位用之攝影機(未圖示)，第2標記4被拍攝，藉影像辨識，座標位置被量測。藉量測座標位置，進行已密封基板1之對位。在對位時，通常使用被形成在第2標記4的四角落之第2標記4。在第1A圖中，使被形成在第2標記4的四角落之第2標記4，將已密封基板1的左上當作基點，逆時 針旋轉地分別當作4A、4B、...、4G、4H。 As shown in FIG. 1A, a plurality of second marks 4A, 4B, ... (indicated by a mark in the figure) are formed in the sealed substrate 1 along the longitudinal direction and the lateral direction of the substrate 2. The second mark 4 is arbitrarily set in accordance with the size and number of the borrowed products. The second marker 4 is photographed by the camera (not shown) for registration, and the coordinate position is measured by image recognition. By measuring the coordinate position, the alignment of the sealed substrate 1 is performed. In the case of alignment, the second mark 4 formed at the four corners of the second mark 4 is usually used. In Fig. 1A, the second mark 4 formed at the four corners of the second mark 4 is used as the base point of the sealed upper substrate 1 in the reverse direction. The needles are rotated as 4A, 4B, ..., 4G, 4H, respectively.
使分別相向已密封基板1的縱向及橫向以形成之第2標記4連結，而沿著橫向之複數第1切斷線5，與沿著縱向之複數第2切斷線6，係被分別被假想性地設定。被複數第1切斷線5與複數第2切斷線6包圍之複數領域7係被單片化，藉此，分別對應被製造之製品。在第1A圖中，例如在橫向設定有七條第1切斷線5，在縱向設定有四條之第2切斷線5。因此，在橫向形成有三個領域7，在縱向形成有六個領域7，總計被形成十八個領域7而成格子狀。被形成在已密封基板1上之領域7，係藉被單片化之製品的尺寸及數量，而被任意設定。 The second marks 4 formed in the longitudinal direction and the lateral direction of the sealed substrate 1 are connected to each other, and the plurality of first cutting lines 5 along the lateral direction and the plurality of second cutting lines 6 along the longitudinal direction are respectively Imagine setting. The plurality of fields 7 surrounded by the plurality of first cutting lines 5 and the plurality of second cutting lines 6 are singulated, thereby corresponding to the manufactured products. In Fig. 1A, for example, seven first cutting lines 5 are set in the lateral direction, and four second cutting lines 5 are provided in the longitudinal direction. Therefore, three fields 7 are formed in the lateral direction, and six fields 7 are formed in the longitudinal direction, and a total of eighteen fields 7 are formed into a lattice shape. The field 7 formed on the sealed substrate 1 is arbitrarily set by the size and number of the singulated articles.
如第2A圖及第2B圖所示，切斷用桌台8係用於在切斷裝置中，切斷已密封基板1以單片化之桌台。在切斷用桌台8中，安裝有對應製品之切斷用治具9。切斷用治具9係具有金屬板10及被固定在金屬板10上之樹脂片11。在樹脂片11中，為了緩和機械性衝擊，需要有適度之柔軟性，樹脂片11係最好例如以矽膠系樹脂或氟系樹脂等形成。切斷用桌台8係對應複數製品以被共通化，僅切斷用治具9係對應製品以被更換。 As shown in FIGS. 2A and 2B, the cutting table 8 is used to cut a table in which the sealed substrate 1 is singulated in the cutting device. In the cutting table 8, a cutting jig 9 for the corresponding product is attached. The cutting jig 9 has a metal plate 10 and a resin sheet 11 fixed to the metal plate 10. In the resin sheet 11, in order to alleviate the mechanical impact, it is necessary to have appropriate flexibility, and the resin sheet 11 is preferably formed, for example, of a silicone resin or a fluorine resin. The cutting table 8 corresponds to a plurality of products to be common, and only the cutting jig 9-compatible product is replaced.
在切斷用治具9的樹脂片11中，設有複數之台地狀突起部12，突起部12係分別吸著保持已密封基板1中之複數領域7。在切斷用治具9分別設有自複數突起部12的表面，貫通樹脂片11與金屬板10之複數吸著孔13。複數吸著孔13係分別連接被設於切斷用桌台8上之空間14。空間14係被連 接到被設於外部之吸引機構(未圖示)。 In the resin sheet 11 for cutting the jig 9, a plurality of floor-like protrusions 12 are provided, and the protrusions 12 respectively hold and hold the plurality of fields 7 in the sealed substrate 1. The cutting jig 9 is provided with a surface from the plurality of protrusions 12, and penetrates the plurality of suction holes 13 of the resin sheet 11 and the metal plate 10. The plurality of suction holes 13 are connected to the space 14 provided on the cutting table 8, respectively. Space 14 is connected Receive an external attraction (not shown).
在突起部12們之間，分別設有複數第1切斷凹槽15及複數第2切斷凹槽16，使得對應分隔第1A圖及第1B圖所示之已密封基板1的複數領域7之複數第1切斷線5及複數第2切斷線6。複數第1切斷凹槽15係沿著樹脂片11(切斷用治具9)的橫向分別被形成，複數第2切斷凹槽16係沿著樹脂片11(切斷用治具9)的縱向分別被形成。相對於被設定於已密封基板1的最邊端之第1切斷線5及第2切斷線6而言，被形成在樹脂片11的最外周之突起部12的外側的空間，係具有與切斷凹槽相同之作用。複數第1切斷凹槽15及複數第2切斷凹槽16的深度(自突起部12的上表面至凹槽的內底面為止之距離)，係被設定成0.5mm~1.0mm左右。 Between the protrusions 12, a plurality of first cutting grooves 15 and a plurality of second cutting grooves 16 are provided so as to correspond to the plural fields 7 of the sealed substrate 1 shown in FIGS. 1A and 1B. The plurality of first cutting lines 5 and the plural second cutting lines 6. The plurality of first cutting grooves 15 are formed along the lateral direction of the resin sheet 11 (cutting jig 9), and the plurality of second cutting grooves 16 are along the resin sheet 11 (cutting jig 9) The longitudinal directions are formed separately. The space between the first cutting line 5 and the second cutting line 6 which are set at the outermost end of the sealed substrate 1 is formed outside the protruding portion 12 on the outermost periphery of the resin sheet 11 The same effect as cutting the groove. The depths of the plurality of first cutting grooves 15 and the plurality of second cutting grooves 16 (the distance from the upper surface of the protruding portion 12 to the inner bottom surface of the groove) are set to be about 0.5 mm to 1.0 mm.
而且，在實施例1中，使對應被設定於已密封基板1的最邊端上之第1切斷線5及第2切斷線6之切斷凹槽，不形成在切斷用治具9。本發明係不侷限於此，也可以使對應被設定於最邊端上之第1切斷線5及第2切斷線6之切斷凹槽，形成在切斷用治具9上。在此情形下，更設有包圍突起部12的外周之虛設之突起部。 Further, in the first embodiment, the cutting grooves corresponding to the first cutting line 5 and the second cutting line 6 which are set on the most end of the sealed substrate 1 are not formed in the cutting jig. 9. The present invention is not limited thereto, and the cutting grooves corresponding to the first cutting line 5 and the second cutting line 6 set at the most end may be formed on the cutting jig 9. In this case, a dummy protrusion that surrounds the outer circumference of the protrusion 12 is further provided.
如第2A圖所示，複數第1標記17A、17B、...(在圖中，以+表示之標記)係對應被形成在已密封基板1上之第2標記4(參照第1A圖)的位置，沿著縱向及橫向，被形成在樹脂片11上。例如對應被設於已密封基板1的四角落上之第2標記4A、4B、...、4G、4H的座標位置，於樹脂片11的四角落上，形成有第1標記17A、17B、...、17G、17H。而且，對 應被形成於已密封基板1上之第2標記4，必要數量之第1標記17係沿著縱向及橫向被形成。例如在第2A圖中，甚至兩個第1標記17沿著縱向被形成。在沿著縱向被形成之第1標記17A與17H之間形成有兩個第1標記17，在第1標記17D與17E之間形成有兩個第1標記17。 As shown in FIG. 2A, the plurality of first marks 17A, 17B, ... (indicated by + in the figure) correspond to the second mark 4 formed on the sealed substrate 1 (see FIG. 1A). The position is formed on the resin sheet 11 along the longitudinal direction and the lateral direction. For example, corresponding to the coordinate positions of the second marks 4A, 4B, ..., 4G, and 4H provided on the four corners of the sealed substrate 1, the first marks 17A and 17B are formed on the four corners of the resin sheet 11. ..., 17G, 17H. And, right The second mark 4 to be formed on the sealed substrate 1 is formed, and a necessary number of the first marks 17 are formed along the longitudinal direction and the lateral direction. For example, in Fig. 2A, even two first marks 17 are formed along the longitudinal direction. Two first marks 17 are formed between the first marks 17A and 17H formed along the longitudinal direction, and two first marks 17 are formed between the first marks 17D and 17E.
參照第1A圖、第1B圖、第2A圖及第2B圖，說明載置已密封基板1到切斷用治具9上以對位之動作。在切斷用桌台8中，切斷用治具9係被安裝在切斷用桌台8上，已密封基板1係被載置於切斷用治具9上。因此，可使切斷用治具9的被形成於樹脂片11上之第1標記17的位置資訊，與被形成於已密封基板1上之第2標記4的位置資訊，當作切斷用桌台8中之位置資訊(座標位置)以量測。 The operation of positioning the sealed substrate 1 to the cutting jig 9 to be aligned will be described with reference to FIGS. 1A, 1B, 2A, and 2B. In the cutting table 8, the cutting jig 9 is attached to the cutting table 8, and the sealed substrate 1 is placed on the cutting jig 9. Therefore, the positional information of the first mark 17 formed on the resin sheet 11 of the cutting jig 9 and the positional information of the second mark 4 formed on the sealed substrate 1 can be used as the cutting information. The position information (coordinate position) in the table 8 is measured.
首先，在未載置已密封基板1於切斷用治具9上之狀態下，使被形成於樹脂片11上之第1標記17，藉對位用之攝影機(未圖示)拍攝，以取得影像數據。依據影像數據以影像辨識，藉此，量測第1標記17的座標位置。將被測得之第1標記17的座標位置，當作切斷用桌台8中之基準的座標位置，以事先記憶。例如事先記憶被形成於樹脂片11的四角落上之八個第1標記17A、17B、...、17G、17H的座標位置。 First, in a state in which the sealed substrate 1 is not placed on the cutting jig 9, the first mark 17 formed on the resin sheet 11 is imaged by a camera (not shown) for alignment. Get image data. The image is identified based on the image data, whereby the coordinate position of the first mark 17 is measured. The coordinate position of the first mark 17 to be measured is taken as the coordinate position of the reference table 8 in the cutting table, and is memorized in advance. For example, the coordinate positions of the eight first marks 17A, 17B, ..., 17G, and 17H formed on the four corners of the resin sheet 11 are memorized in advance.
接著，使用搬運機構(未圖示)，載置已密封基板1到切斷用治具9上。在切斷用治具9上載置有已密封基板1之狀態下，拍攝被形成於已密封基板1上之第2標記4，以取得影像數據。依據影像數據以影像辨識，藉此，量測第2標記4的座標位置。例如量測被形成於四角落之第2標記4A、 4B、...、4G、4H等八個的座標位置。比較這些被量測之第2標記4的座標位置，與事先被記憶之第1標記17的座標位置。藉此，可算出已密封基板1的X方向、Y方向及θ方向之偏移量。 Next, the sealed substrate 1 is placed on the cutting jig 9 by using a transport mechanism (not shown). In the state in which the sealed substrate 1 is placed on the cutting jig 9 , the second mark 4 formed on the sealed substrate 1 is imaged to obtain image data. The image is identified based on the image data, whereby the coordinate position of the second mark 4 is measured. For example, the measurement is formed at the fourth mark 4A of the four corners, Eight coordinate positions of 4B, ..., 4G, 4H, etc. The coordinate position of the second marker 4 to be measured is compared with the coordinate position of the first marker 17 which is previously memorized. Thereby, the amount of shift of the sealed substrate 1 in the X direction, the Y direction, and the θ direction can be calculated.
接著，依據被算出之偏移量，修正這些偏移量。具體說來，首先，使用搬運機構(未圖示)，以自切斷用治具9舉起已密封基板1，保持已密封基板1在搬運機構上。接著，於在切斷用治具9未載置有已密封基板1，已密封基板1係被保持在搬運機構上之狀態下，沿著X方向、Y方向及θ方向之中至少一個方向，依據偏移量使搬運機構僅移動適當之量。藉移動之情事，移動被切斷物到對應偏移量之目標位置。目標位置係偏移量為零之位置，或者，與移動前相比較下，偏移量減少而成為接近零之位置。接著，使用搬運機構，再度載置已密封基板1到切斷用治具9上。 Then, these offsets are corrected based on the calculated offset. Specifically, first, the sealed substrate 1 is lifted from the cutting jig 9 by using a transport mechanism (not shown), and the sealed substrate 1 is held by the transport mechanism. Then, in the state in which the sealed substrate 1 is not placed on the cutting jig 9 and the sealed substrate 1 is held by the transport mechanism, it is along at least one of the X direction, the Y direction, and the θ direction. The handling mechanism is only moved by an appropriate amount depending on the offset. By moving the situation, move the object to be cut to the target position of the corresponding offset. The target position is at a position where the offset is zero, or, in comparison with the pre-movement, the offset is reduced to become a position close to zero. Next, the sealed substrate 1 is placed on the cutting jig 9 again by using the transport mechanism.
藉到此為止之工序，可正確對位已密封基板1的第2標記4之位置，到切斷用治具9的第1標記17之位置。當詳細說明時，可使第1標記17與第2標記4間之位置關係，決定成既定之位置關係。因此，可正確對位被設定到已密封基板1之複數第1切斷線5及複數第2切斷線6之位置，到設於切斷用治具9上之複數第1切斷凹槽15及複數第2切斷凹槽16之位置。藉此，被設於切斷機構之旋轉刀，係不自切斷用治具9的切斷凹槽之位置偏移地，可沿著切斷線，正確切斷已密封基板1。 By the above steps, the position of the second mark 4 of the sealed substrate 1 can be correctly aligned to the position of the first mark 17 of the cutting jig 9. When the details are described, the positional relationship between the first mark 17 and the second mark 4 can be determined to be a predetermined positional relationship. Therefore, the correct alignment can be set to the position of the plurality of first cutting lines 5 and the plurality of second cutting lines 6 of the sealed substrate 1 to the plurality of first cutting grooves provided on the cutting jig 9 15 and the position of the plurality of second cutting grooves 16. Thereby, the rotary blade provided in the cutting mechanism is not displaced from the position of the cutting groove of the cutting jig 9 and the sealed substrate 1 can be accurately cut along the cutting line.
在對應搬運機構(未圖示)與切斷用治具9之構 成，搬運機構係自切斷用治具9舉起已密封基板1，以保持已密封基板1在搬運機構之狀態下，也可以沿著X方向、Y方向及θ方向之中至少一個方向，依據偏移量使切斷用治具9僅移動適當之量。之後，使用搬運機構，再度載置已密封基板1到切斷用治具9上。 The configuration of the corresponding transport mechanism (not shown) and the cutting jig 9 In the conveyance mechanism, the sealed substrate 1 is lifted from the cutting jig 9 to hold the sealed substrate 1 in at least one of the X direction, the Y direction, and the θ direction while the sealed substrate 1 is held. The cutting jig 9 is moved only by an appropriate amount in accordance with the amount of shift. Thereafter, the sealed substrate 1 is placed on the cutting jig 9 again by using the transport mechanism.
本質上說來，只要在搬運機構自切斷用治具9舉起已密封基板1，以保持已密封基板1在搬運機構之狀態下，沿著X方向、Y方向及θ方向之中至少一個方向，依據偏移量使搬運機構與切斷用治具9僅相對性地移動適當之量即可。因應需要，使用切斷用治具9的第1標記17或已密封基板1的第2標記4，對合被設於切斷用治具9上之第1切斷凹槽15(或第2切斷凹槽16)之位置與旋轉刀(未圖示)之位置。也可以對合被設定在已密封基板1上之第1切斷線5(或第2切斷線6)之位置與旋轉刀(未圖示)之位置。到此為止說明過之偏移量之修正，係在其他實施例中，也同樣地被執行。 Essentially, at least one of the X direction, the Y direction, and the θ direction is held in the state in which the sealed substrate 1 is held by the transporting device 9 in the state in which the sealed substrate 1 is held by the transporting mechanism. The direction may be such that the transport mechanism and the cutting jig 9 are relatively moved by an appropriate amount depending on the amount of shift. If necessary, the first mark 17 of the cutting jig 9 or the second mark 4 of the sealed substrate 1 is used, and the first cutting groove 15 provided on the cutting jig 9 is aligned (or the second The position of the groove 16) and the position of the rotary blade (not shown) are cut. The position of the first cutting line 5 (or the second cutting line 6) set on the sealed substrate 1 and the position of the rotary blade (not shown) may be aligned. The correction of the offset described so far is also performed in the same manner in other embodiments.
搬運機構係在第4圖中，被表示成「搬運機構22」。伴隨著搬運機構與切斷用治具9相對性移動之在搬運機構與切斷用治具9間之位置之精度(本來必須所處之位置與實際位置間之偏移量)，係當與已密封基板1之偏移量相比較下，其係可忽視之非常地小。例如當重複移動，使得搬運機構與切斷用治具9成為相同位置關係時之位置之精度，係當與已密封基板1之偏移量相比較下，其係可忽視之非常地小。 The transport mechanism is shown as "transport mechanism 22" in Fig. 4 . The accuracy of the position between the transport mechanism and the cutting jig 9 relative to the transport mechanism 9 and the cutting jig 9 relative to each other (the amount of the position between the position and the actual position that must be located) is The offset of the sealed substrate 1 is negligibly small compared to the offset. For example, when the movement is repeated, the accuracy of the position when the transport mechanism and the jig 9 for cutting are in the same positional relationship is negligibly small compared with the offset amount of the sealed substrate 1.
當依據本實施例時，安裝對應製品之切斷用治具9到切斷用桌台8。在切斷用治具9的樹脂片11處，設置對應被 形成在已密封基板1上之複數第2標記4之複數第1標記17。在切斷用桌台8中，量測被形成在樹脂片11上之第1標記17的座標位置，以當作基準之座標位置而事先記憶。接著，量測被載置於切斷用桌台8上之已密封基板1的第2標記4的座標位置。比較第1標記17的座標位置與第2標記4的座標位置，藉此，可算出已密封基板1的偏移量。藉修正此偏移量，可正確對位已密封基板1的第2標記4的位置，到切斷用治具9的第1標記17的位置。因此，可正確對位被設定於已密封基板1上之複數切斷線之位置，到被設於切斷用治具9上之複數切斷凹槽之位置。藉此，被設於切斷機構上之旋轉刀，係不自切斷用治具9的切斷凹槽之位置偏移地，可沿著切斷線，正確切斷已密封基板1。 According to the present embodiment, the cutting jig 9 for the corresponding product is attached to the cutting table 8. At the resin sheet 11 of the cutting fixture 9, the corresponding setting is set. The plurality of first marks 17 of the plurality of second marks 4 formed on the sealed substrate 1 are formed. In the cutting table 8, the coordinate position of the first mark 17 formed on the resin sheet 11 is measured and stored as a reference coordinate position. Next, the coordinate position of the second mark 4 of the sealed substrate 1 placed on the cutting table 8 is measured. By comparing the coordinate position of the first mark 17 with the coordinate position of the second mark 4, the amount of shift of the sealed substrate 1 can be calculated. By correcting this offset, the position of the second mark 4 of the sealed substrate 1 can be correctly aligned to the position of the first mark 17 of the jig 9 for cutting. Therefore, the position of the plurality of cutting lines set on the sealed substrate 1 can be correctly aligned to the position of the plurality of cutting grooves provided on the cutting jig 9. Thereby, the rotary blade provided in the cutting mechanism can be accurately cut off the sealed substrate 1 along the cutting line without being displaced from the position of the cutting groove of the cutting jig 9.
當依據本實施例時，比較被形成在切斷用治具9上之第1標記17的座標位置，與被形成在已密封基板1上之第2標記4的座標位置，藉此，算出已密封基板1的偏移量。因此，也包含已密封基板1本身之尺寸參差、已密封基板1的反翹、承受冷卻水等之影響而已密封基板1伸縮之情形等，可算出被載置於切斷用治具9上狀態之已密封基板1的偏移量。因此，即使已密封基板1處於何種狀態下，皆可以提高對合被設定於已密封基板1上之切斷線之位置，到被設於切斷用治具9上之切斷凹槽之位置之精度。 According to the present embodiment, the coordinate position of the first mark 17 formed on the cutting jig 9 is compared with the coordinate position of the second mark 4 formed on the sealed substrate 1, thereby calculating The offset amount of the sealing substrate 1 is sealed. Therefore, the size of the sealed substrate 1 itself, the reverse warpage of the sealed substrate 1, the influence of the cooling water, and the like, and the expansion and contraction of the sealing substrate 1 are included, and the state of being placed on the cutting jig 9 can be calculated. The amount of offset of the sealed substrate 1. Therefore, even if the sealed substrate 1 is in any state, the position of the cutting line set on the sealed substrate 1 can be increased to the cutting groove provided on the cutting jig 9. The accuracy of the location.
當依據本實施例時，可正確對合被設定於已密封基板1上之切斷線之位置，到被設於切斷用治具9上之切斷凹槽之位置。因此，被設於切斷機構上之旋轉刀，係不自切斷凹 槽之位置偏移地，可沿著切斷線，正確切斷已密封基板1。藉此，可防止因為旋轉刀，而樹脂片11被切削。因此，變得不會自切斷用治具9產生切屑，或者，在切斷用治具9的吸著孔13產生洩漏。旋轉刀變得不切削樹脂片11，所以，切斷用治具9之壽命變長，可減少切斷裝置之運轉成本。 According to the present embodiment, the position of the cutting line set on the sealed substrate 1 can be correctly aligned to the position of the cutting groove provided on the cutting jig 9. Therefore, the rotary knife provided on the cutting mechanism does not cut the concave The position of the groove is offset, and the sealed substrate 1 can be cut off correctly along the cutting line. Thereby, it is possible to prevent the resin sheet 11 from being cut due to the rotation of the blade. Therefore, it is not possible to generate chips from the cutting jig 9 or to cause leakage in the suction hole 13 of the cutting jig 9. Since the rotary blade does not cut the resin sheet 11, the life of the cutting jig 9 becomes long, and the running cost of the cutting device can be reduced.
針對本發明切斷裝置的實施例2，參照第3A圖及第3B圖做說明。與實施例1之不同，係使切斷用治具9的對位標記(第1標記)，不形成於樹脂片11上，而形成在金屬桌台10上。此外之構成或動作係與實施例1相同，所以，省略其說明。 Embodiment 2 of the cutting device of the present invention will be described with reference to Figs. 3A and 3B. Unlike the first embodiment, the alignment mark (first mark) of the cutting jig 9 is formed on the metal table 10 without being formed on the resin sheet 11. The other configuration and operation are the same as those of the first embodiment, and thus the description thereof will be omitted.
如第3A圖所示，包圍樹脂片11的周圍，而複數第1標記18(在圖中，以+表示之標記)係沿著縱向及橫向，被形成在金屬板10上，使得可對應被設於已密封基板1上之第2標記4的位置。例如金屬板10的四角落上，形成有第1標記18A、18B、...、18G、18H，使得可對應被設於已密封基板1的四角落上之第2標記4A、4B、...、4G、4H(參照第1A圖)之位置。而且，可使必要數量之第1標記18沿著縱向及橫向形成，使得可對應被形成在已密封基板1上之第2標記4。在第3A圖中，係表示形成第1標記18，使得可對應被形成於已密封基板1上之全部之第2標記(參照第1A圖)之情形。 As shown in FIG. 3A, the periphery of the resin sheet 11 is surrounded, and a plurality of first marks 18 (indicated by a mark in the figure) are formed on the metal plate 10 in the longitudinal direction and the lateral direction so that it can be correspondingly The position of the second mark 4 on the sealed substrate 1 is set. For example, the first marks 18A, 18B, ..., 18G, and 18H are formed on the four corners of the metal plate 10 so as to correspond to the second marks 4A, 4B, ... which are provided on the four corners of the sealed substrate 1. ., 4G, 4H (refer to Figure 1A). Further, the necessary number of the first marks 18 can be formed in the longitudinal direction and the lateral direction so as to correspond to the second marks 4 formed on the sealed substrate 1. In the third drawing, the first mark 18 is formed so as to correspond to all of the second marks (see FIG. 1A) formed on the sealed substrate 1.
與第2A圖及第2B圖所示之情形相同地，可將切斷用治具9的被形成於金屬板10上之第1標記18的位置資訊，與被形成在已密封基板1上之第2標記4的位置資訊，當 作切斷用桌台8中之位置資訊以量測。量測被形成在金屬板10上之第1標記18的座標位置，以當作切斷用桌台8中之基準之座標位置，而事先記憶。比較此基準之座標位置，與被載置在切斷用桌台8上，且被測得之已密封基板1的第2標記4的座標位置，藉此，算出已密封基板1的偏移量。藉修正這些偏移量，可對應切斷用治具9的沿著X方向及Y方向被形成之第1標記18的位置地，對合已密封基板1的第2標記4的位置。因此，可正確對合被設定在已密封基板1上之複數切斷線的位置，到被設於切斷用治具9上之複數切斷凹槽的位置。藉此，被設於切斷機構上之旋轉刀，係不自切斷用治具9的切斷凹槽之位置偏移地，可沿著切斷線，正確切斷已密封基板1。 Similarly to the case shown in FIGS. 2A and 2B, the positional information of the first mark 18 formed on the metal plate 10 of the cutting jig 9 can be formed on the sealed substrate 1. Position information of the second mark 4, when The position information in the cutting table 8 is used for measurement. The coordinate position of the first mark 18 formed on the metal plate 10 is measured as the coordinate position of the reference in the cutting table 8, and is memorized in advance. The offset position of the sealed substrate 1 is calculated by comparing the coordinate position of the reference with the coordinate position of the second mark 4 of the sealed substrate 1 which is placed on the cutting table 8 and measured. . By correcting these offset amounts, the position of the second mark 4 of the sealed substrate 1 can be aligned in accordance with the position of the first mark 18 formed along the X direction and the Y direction of the jig 9 for cutting. Therefore, the position of the plurality of cutting lines set on the sealed substrate 1 can be correctly aligned to the position of the plurality of cutting grooves provided on the cutting jig 9. Thereby, the rotary blade provided in the cutting mechanism can be accurately cut off the sealed substrate 1 along the cutting line without being displaced from the position of the cutting groove of the cutting jig 9.
在實施例2中，係形成第1標記18在切斷用治具9的金屬板10上。與樹脂片11相比較下，金屬板10係第1標記之加工較容易，加工面之形狀變得銳利。因此，被形成在金屬板10上之第1標記18，係其輪廓比被形成在樹脂片11上之第1標記17還要明確。藉此，由影像辨識所做之第1標記18之對比變得明確。因此，提高切斷用治具9的第1標記18的座標位置之量測精度，對位精度也提高。關於此外係發揮與實施例1相同之效果，所以，省略其說明。 In the second embodiment, the first mark 18 is formed on the metal plate 10 of the cutting jig 9. Compared with the resin sheet 11, the metal sheet 10 is easy to process the first mark, and the shape of the processed surface becomes sharp. Therefore, the first mark 18 formed on the metal plate 10 has a contour that is more clear than the first mark 17 formed on the resin sheet 11. Thereby, the comparison of the first mark 18 by image recognition becomes clear. Therefore, the measurement accuracy of the coordinate position of the first mark 18 of the cutting jig 9 is improved, and the alignment accuracy is also improved. The other effects are the same as those of the first embodiment, and thus the description thereof will be omitted.
針對本發明切斷裝置的實施例3，參照第4圖~第6B圖做說明。如第4圖所示，切斷裝置19係使被切斷物單片化成複數製品之裝置。切斷裝置19係將基板供給模組A與基板切斷模組B與檢查模組C，分別當作構成元件而具有之。各 構成元件(各模組A~C)係分別相對於其他構成要素而言，可裝卸且可更換。 The third embodiment of the cutting device of the present invention will be described with reference to Figs. 4 to 6B. As shown in Fig. 4, the cutting device 19 is a device for singulating a cut object into a plurality of products. The cutting device 19 has the substrate supply module A, the substrate cutting module B, and the inspection module C as constituent elements. each The constituent elements (each module A to C) are detachable and replaceable with respect to other components.
在基板供給模組A設有：基板供給機構20，供給相當於被切斷物之已密封基板1；基板載置部21，接受已密封基板1；以及搬運機構22，搬運已密封基板1。搬運機構22係在基板載置部21中被定位後，藉搬運機構22，被搬運到基板切斷模組B。 The substrate supply module A is provided with a substrate supply mechanism 20 that supplies the sealed substrate 1 corresponding to the object to be cut, a substrate mounting portion 21 that receives the sealed substrate 1 , and a transport mechanism 22 that transports the sealed substrate 1 . The transport mechanism 22 is positioned in the substrate mounting portion 21, and then transported to the substrate cutting module B by the transport mechanism 22.
第4圖所示之切斷裝置19，係單切桌台式之切斷裝置。因此，在基板切斷模組B設有一個切斷用桌台8。切斷用桌台8係藉移動機構23，可在圖面的Y方向上移動，而且，藉旋轉機構24可在θ方向上旋轉。在切斷用桌台8安裝有切斷用治具9(參照第2A圖、第2B圖、第3A圖及第3B圖)，在切斷用治具9載置吸著有已密封基板1。 The cutting device 19 shown in Fig. 4 is a single-cut table cutting device. Therefore, one cutting table 8 is provided in the substrate cutting module B. The cutting table 8 is movable in the Y direction of the drawing by the moving mechanism 23, and is rotatable in the θ direction by the rotating mechanism 24. The cutting jig 9 is attached to the cutting table 8 (see FIGS. 2A, 2B, 3A, and 3B), and the sealed substrate 1 is placed on the cutting jig 9 .
在基板切斷模組B設有對位用之攝影機25。攝影機25係可獨立地在X方向上移動。攝影機25係在X方向上移動，而且，切斷用桌台8在Y方向上移動，藉此，量測被形成在已密封基板1上之第2標記4(參照第1A圖)的座標位置。藉此，沿著已密封基板1的橫向之複數第1切斷線5，與沿著已密封基板1的縱向之複數第2切斷線6，係分別假想性地被設定(參照第1A圖)。 A camera 25 for alignment is provided in the substrate cutting module B. The camera 25 is independently movable in the X direction. The camera 25 is moved in the X direction, and the cutting table 8 is moved in the Y direction, thereby measuring the coordinate position of the second mark 4 (see FIG. 1A) formed on the sealed substrate 1. . Thereby, the plurality of first cutting lines 5 along the lateral direction of the sealed substrate 1 and the plurality of second cutting lines 6 along the longitudinal direction of the sealed substrate 1 are imaginarily set (see FIG. 1A). ).
在基板切斷模組B設有做為切斷機構之主軸26。切斷裝置19係設有一個主軸26之單主軸構成之切斷裝置。主軸26係可單獨地在X方向與Z方向上移動。在主軸26組裝有旋轉刀27。在主軸26為了抑制因為高速旋轉之旋轉刀27所產 生之摩擦熱，設有噴射切削水之切削水用噴嘴(未圖示)。使切斷用桌台8與主軸26相對性移動，藉此，已密封基板1被切斷。旋轉刀27係在包含Y方向與Z方向之表面內旋轉，藉此，切斷已密封基板1。 The main shaft cutting module B is provided with a main shaft 26 as a cutting mechanism. The cutting device 19 is provided with a cutting device composed of a single spindle of the spindle 26. The main shaft 26 is individually movable in the X direction and the Z direction. A rotary blade 27 is assembled to the main shaft 26. In the spindle 26, in order to suppress the rotation of the knife 27 due to high-speed rotation The raw friction heat is provided with a nozzle for cutting water for cutting water (not shown). The cutting table 8 and the main shaft 26 are relatively moved, whereby the sealed substrate 1 is cut. The rotary blade 27 is rotated in a surface including the Y direction and the Z direction, whereby the sealed substrate 1 is cut.
在檢查模組C設有檢查用桌台28。在檢查用桌台28載置有由切斷已密封基板1以被單片化之複數製品P所構成之集合體，亦即，載置有已切斷基板29。複數製品P係被檢查用之攝影機(未圖示)檢查，而被選別良品與不良品。良品被收容在托盤30上。 An inspection table 28 is provided in the inspection module C. On the inspection table 28, an assembly including a plurality of products P which are singulated by cutting the sealed substrate 1 is placed, that is, the cut substrate 29 is placed. The plurality of products P are inspected by a camera (not shown) for inspection, and are selected as good and defective. The good product is housed on the tray 30.
而且，在本實施例中，使進行切斷裝置19之動作、已密封基板1之搬運、密封基板1之對位、密封基板1之切斷、以切斷基板29之檢查等之動作或控制之控制部CTL，設於基板供給單元A內。本發明並不侷限於此，也可以使控制部CTL設於其他單元內。 Further, in the present embodiment, the operation or control of the operation of the cutting device 19, the conveyance of the sealed substrate 1, the alignment of the sealing substrate 1, the cutting of the sealing substrate 1, and the inspection of the substrate 29 are performed. The control unit CTL is provided in the substrate supply unit A. The present invention is not limited to this, and the control unit CTL may be provided in another unit.
在本實施例中，說明過單切桌台式，且單主軸構成之切斷裝置19。本發明並不侷限於此，在單切桌台式，且雙主軸構成之切斷裝置，或者，雙切桌台式，且雙主軸構成之切斷裝置等之中，也可以適用本發明之切斷用桌台8。 In the present embodiment, a cutting device 19 having a single-spindle table and a single spindle is described. The present invention is not limited thereto, and the cutting device of the present invention can be applied to a single-cut table, a cutting device composed of a double-spindle, or a double-cut table, and a cutting device composed of a double-spindle. Use table 8.
參照第4圖~第6B圖，說明載置已密封基板1，到被安裝在切斷用桌台8上之切斷用治具9，以對位之動作。在實施例3中，說明於切斷用桌台8中，在切斷用治具9的金屬板10形成有第1標記18之情形。 Referring to Fig. 4 to Fig. 6B, the operation of placing the sealed substrate 1 on the cutting jig 9 attached to the cutting table 8 to align the position will be described. In the third embodiment, the case where the first mark 18 is formed in the metal plate 10 of the cutting jig 9 in the cutting table 8 will be described.
如第5A圖所示，切斷用桌台8係被配置使得縱向沿著X方向。因此，被配置使得橫向沿著Y方向(在第5A圖 中，係自紙面深處往眼前)。以下，說明切斷用桌台8係被配置使得縱向沿著X方向之情形。 As shown in Fig. 5A, the cutting table 8 is arranged such that the longitudinal direction is along the X direction. Therefore, it is configured to be laterally along the Y direction (in Figure 5A) In the middle of the paper, from the depth of the paper to the front). Hereinafter, the case where the cutting table 8 is arranged so that the longitudinal direction is along the X direction will be described.
在切斷用桌台8安裝有切斷用治具9。在切斷用治具9的金屬板10的四角落，形成有第1標記18A、18B、...、18G、18H(參照第3A圖)。在第5A圖中，係表示這些之中之第1標記18D及18E。 A cutting jig 9 is attached to the cutting table 8 . The first marks 18A, 18B, ..., 18G, and 18H are formed at four corners of the metal plate 10 of the cutting jig 9 (see Fig. 3A). In Fig. 5A, the first marks 18D and 18E among these are shown.
接著，例如使切斷用桌台8藉移動機構23(參照第4圖)，移動至Y方向之既定位置為止，而且，使對位用之攝影機25在X方向上移動，藉此，使攝影機25停止在切斷用治具9中之特定之第1標記18D上。藉攝影機25拍攝第1標記18D，以取得影像數據(第1影像數據)。依據影像數據進行影像辨識，藉此，量測第1標記18D的座標位置(第1位置資訊)以記憶之。而且，使攝影機25往+X方向移動，同樣地，量測第1標記18E之座標位置以記憶之。如此一來，使切斷用桌台8在Y方向上移動，而且，使攝影機25在X方向上移動，藉此，可以量測切斷用治具9的被形成於金屬板10上之第1標記18的座標位置以記憶之。因應需要，僅量測必要數量之第1標記18的座標位置以事先記憶之。將這些座標位置(第1位置資訊)，當作切斷用桌台8中之對位之基準之座標位置。在此情形下，量測例如沿著X方向之兩個第1標記18D及18E的座標位置，與沿著Y方向之兩個第1標記18B及18C(參照第3A圖)的座標位置。傳送被測得之第1標記18D、18E、18B、18C的座標位置的數據到切斷裝置19的控制部CTL(參照第4圖)，事先記憶之。 Next, for example, the cutting table 8 is moved to a predetermined position in the Y direction by the moving mechanism 23 (see FIG. 4), and the camera 25 for alignment is moved in the X direction, thereby making the camera 25 is stopped on the specific first mark 18D of the cutting jig 9. The first mark 18D is photographed by the camera 25 to acquire image data (first image data). Image recognition is performed based on the image data, whereby the coordinate position (first position information) of the first mark 18D is measured to be memorized. Further, the camera 25 is moved in the +X direction, and similarly, the coordinate position of the first mark 18E is measured to be memorized. In this way, the cutting table 8 is moved in the Y direction, and the camera 25 is moved in the X direction, whereby the cutting jig 9 can be measured on the metal plate 10. 1 mark the coordinate position of 18 to remember. As needed, only the necessary number of coordinate positions of the first mark 18 are measured to be memorized in advance. These coordinate positions (first position information) are used as coordinate positions on the basis of the alignment in the cutting table 8. In this case, for example, the coordinate positions of the two first marks 18D and 18E along the X direction and the coordinate positions of the two first marks 18B and 18C (see FIG. 3A) along the Y direction are measured. The data of the coordinate positions of the first marks 18D, 18E, 18B, and 18C to be measured are transmitted to the control unit CTL (see FIG. 4) of the cutting device 19, and are memorized in advance.
接著，如第5B圖所示，使用搬運機構22(參照第4圖)，載置已密封基板1到切斷用治具9上。此時，有時已密封基板1係被載置成自切斷用治具9的既定位置偏移。 Next, as shown in FIG. 5B, the sealed substrate 1 is placed on the cutting jig 9 by using the transport mechanism 22 (see FIG. 4). At this time, the sealed substrate 1 may be placed to be displaced from a predetermined position of the jig 9 for cutting.
接著，如第5C圖所示，使切斷用桌台8在Y方向上移動，而且，使攝影機25在X方向上移動，藉此，例如使攝影機25停止在被形成於已密封基板1上之特定第2標記4D上。藉攝影機25拍攝第2標記4D，以取得影像數據(第2影像數據)。依據影像數據進行影像辨識，藉此，量測第2標記4D的座標位置(第2位置資訊)。同樣地，量測第2標記4E的座標位置。在此情形下，量測例如沿著X方向之兩個第2標記4D及4E的座標位置，與沿著Y方向之兩個第2標記4B及4C(參照第1A圖)的座標位置。傳送被測得之第2標記4D、4E、4B、4C的座標位置(第2位置資訊)的數據到控制部CTL。 Next, as shown in FIG. 5C, the cutting table 8 is moved in the Y direction, and the camera 25 is moved in the X direction, whereby the camera 25 is stopped, for example, on the sealed substrate 1. The specific second mark 4D. The second marker 4D is captured by the camera 25 to acquire image data (second video data). Image recognition is performed based on the image data, thereby measuring the coordinate position (second position information) of the second mark 4D. Similarly, the coordinate position of the second mark 4E is measured. In this case, for example, the coordinate positions of the two second marks 4D and 4E along the X direction and the coordinate positions of the two second marks 4B and 4C (see FIG. 1A) along the Y direction are measured. The data of the coordinate position (second position information) of the second markers 4D, 4E, 4B, and 4C to be measured is transmitted to the control unit CTL.
在控制部CTL中，比較事先被記憶之切斷用治具9的第1標記18D、18E、18B、18C的座標位置，與被測得之已密封基板1的第2標記4D、4E、4B、4C的座標位置。數據處理這些座標位置的數據，藉此，可分別算出X方向之偏移、Y方向之偏移及θ方向之偏移。 In the control unit CTL, the coordinate positions of the first marks 18D, 18E, 18B, and 18C of the cutting jig 9 that have been memorized in advance are compared with the second marks 4D, 4E, and 4B of the sealed substrate 1 to be measured. , 4C coordinate position. The data is processed by the data of these coordinate positions, whereby the shift in the X direction, the shift in the Y direction, and the shift in the θ direction can be calculated.
數據處理事先被記憶之切斷用治具9的第1標記的座標位置，與被測得之已密封基板1的第2標記的座標位置之結果，當控制部CTL判斷未自已密封基板1偏移時，在載置有已密封基板1之狀態下，移動切斷用桌台8往+Y方向。使用主軸26(參照第4圖)，以沿著切斷線切斷已密封基板1。 As a result of the data processing of the coordinate position of the first mark of the cutting jig 9 which has been memorized in advance, and the coordinate position of the second mark of the sealed substrate 1 to be measured, the control unit CTL judges that the self-sealing substrate 1 is not biased. At the time of shifting, in the state in which the sealed substrate 1 is placed, the cutting table 8 is moved in the +Y direction. Using the spindle 26 (see FIG. 4), the sealed substrate 1 is cut along the cutting line.
進行數據處理後之結果，當控制部CTL判斷在已密封基板1有產生偏移時，如第5D圖所示，維持已密封基板1被載置於切斷用治具9上之狀態，搬運機構22(參照第4圖)自切斷用治具9提起已密封基板1。依據藉控制部CTL所算出之偏移量，搬運機構22修正已密封基板1的X方向、Y方向及θ方向之偏移量，使已密封基板1移動至切斷用治具9的既定位置的上方。具體說來，搬運機構22係沿著X方向、Y方向及θ方向中之至少一個方向，僅移動依據偏移量之適當量。 As a result of the data processing, when the control unit CTL determines that there is a shift in the sealed substrate 1, as shown in FIG. 5D, the sealed substrate 1 is placed on the cutting jig 9 and transported. The mechanism 22 (see FIG. 4) lifts the sealed substrate 1 from the cutting jig 9 for cutting. The transport mechanism 22 corrects the amount of shift in the X direction, the Y direction, and the θ direction of the sealed substrate 1 by the offset amount calculated by the control unit CTL, and moves the sealed substrate 1 to a predetermined position of the cutting jig 9 Above. Specifically, the transport mechanism 22 moves only in an appropriate amount according to the offset amount in at least one of the X direction, the Y direction, and the θ direction.
接著，如第5E圖所示，在已密封基板1之X方向、Y方向及θ方向之偏移量已被修正之位置中，搬運機構22再度載置已密封基板1到切斷用治具9上。藉此，已密封基板1係在被正確對位到切斷容治具9之既定位置之狀態下被載置。因此，可正確對合已密封基板1的切斷線之位置，到被設於切斷容治具9之切斷凹槽之位置。在已密封基板1的切斷線被正確對合到被設於切斷用治具9之切斷凹槽後之狀態下，可切斷已密封基板1。 Next, as shown in FIG. 5E, in the position where the offset amount of the sealed substrate 1 in the X direction, the Y direction, and the θ direction has been corrected, the transport mechanism 22 places the sealed substrate 1 again to the cutting jig. 9 on. Thereby, the sealed substrate 1 is placed in a state where it is correctly aligned to the predetermined position of the cutting fixture 9. Therefore, the position of the cutting line of the sealed substrate 1 can be correctly aligned to the position where the cutting groove of the cutting fixture 9 is cut. The sealed substrate 1 can be cut in a state in which the cutting line of the sealed substrate 1 is correctly aligned to the cutting groove provided in the cutting jig 9.
第6A圖及第6B圖係俯視地表示使第5A圖~第5E圖所示之已密封基板1，對位到切斷用治具9的既定位置後之動作。如第6A圖所示，在載置已密封基板1到切斷用桌台8後之狀態下，已密封基板1之位置係分別在X方向、Y方向及θ方向上偏移。在第6A圖中，以點線包圍之領域SUB，係在切斷用桌台8中，載置有已密封基板1之領域。例如自已密封基板1的第2標記4D及4E的座標位置，首先算出θ方向之偏移量。藉修正θ方向之偏移量，使已密封基板1的縱向及橫 向，可平行配置在切斷用桌台8的縱向及橫向上。自此狀態，分別修正X方向與Y方向之偏移量，藉此，如第6B圖所示，可配置已密封基板1到切斷用桌台8的既定領域SUB。 6A and 6B are views showing the operation of aligning the sealed substrate 1 shown in FIGS. 5A to 5E to a predetermined position of the cutting jig 9 in a plan view. As shown in FIG. 6A, in a state in which the sealed substrate 1 is placed on the cutting table 8, the positions of the sealed substrate 1 are shifted in the X direction, the Y direction, and the θ direction, respectively. In the sixth drawing, the field SUB surrounded by the dotted line is in the field in which the sealed substrate 1 is placed on the cutting table 8. For example, the coordinate position of the second marks 4D and 4E of the sealed substrate 1 is first calculated by the amount of shift in the θ direction. By correcting the offset of the θ direction, the longitudinal and horizontal sides of the sealed substrate 1 are made The orientation can be arranged in parallel in the longitudinal direction and the lateral direction of the cutting table 8. From this state, the amount of shift between the X direction and the Y direction is corrected, whereby the predetermined area SUB of the sealed substrate 1 to the cutting table 8 can be arranged as shown in Fig. 6B.
當依據本實施例時，在切斷裝置19中，可使搬運機構22在X方向、Y方向及Z方向上移動，而且，可在θ方向上旋轉。藉此，即使當已密封基板1自切斷用治具9的既定位置偏移時，也可藉搬運機構修正已密封基板1的偏移量。在已密封基板1自切斷用治具9的既定位置偏移之狀態下，藉搬運機構22再度提起已密封基板1。自此狀態，使搬運機構僅移動已密封基板1的偏移量，停止在切斷用治具9的既定位置的上方。之後，載置已密封基板1到切斷用治具9上。可載置已密封基板1到切斷用治具9的既定位置上，所以，可正確對合已密封基板1的切斷線之位置，到切斷用治具9的切斷凹槽之位置。不追加新的構成元件或新的功能到既存之切斷裝置19，就可以精度良好地進行已密封基板1之對位。不改良切斷裝置19，而且，不產生費用，就可以精度良好地進行已密封基板1之對位。因此，可抑制切斷裝置19之費用，同時可以提高切斷之精度及材料利用率。 According to the present embodiment, in the cutting device 19, the transport mechanism 22 can be moved in the X direction, the Y direction, and the Z direction, and can be rotated in the θ direction. Thereby, even when the sealed substrate 1 is displaced from the predetermined position of the cutting jig 9, the offset amount of the sealed substrate 1 can be corrected by the transport mechanism. The sealed substrate 1 is lifted again by the transport mechanism 22 in a state where the sealed substrate 1 is displaced from the predetermined position of the jig 9 for cutting. In this state, the transport mechanism moves only the offset amount of the sealed substrate 1, and stops above the predetermined position of the cutting jig 9. Thereafter, the sealed substrate 1 is placed on the cutting jig 9 for cutting. Since the sealed substrate 1 can be placed at a predetermined position of the cutting jig 9, the position of the cutting line of the sealed substrate 1 can be correctly aligned to the position of the cutting groove of the cutting jig 9 . The alignment of the sealed substrate 1 can be performed with high precision without adding a new constituent element or a new function to the existing cutting device 19. The cutting device 19 is not improved, and the alignment of the sealed substrate 1 can be performed with high precision without incurring a cost. Therefore, the cost of the cutting device 19 can be suppressed, and the cutting accuracy and material utilization rate can be improved.
當依據本實施例時，在正確對位已密封基板1的切斷線之位置，到切斷用治具9的切斷凹槽之位置後之狀態下，可切斷已密封基板1。因此，可防止因為旋轉刀而切削樹脂片11。可防止自切斷用治具9產生切屑，或者，在切斷用治具9的吸著孔13產生洩漏。旋轉刀變得不切削樹脂片11，所以，切斷用治具9之壽命變長，可減少切斷裝置19之運轉成 本。而且，可提高製品之材料利用率，提高製品之品質。 According to the present embodiment, the sealed substrate 1 can be cut in a state in which the position of the cutting line of the sealed substrate 1 is correctly aligned, and the position of the cutting groove of the cutting jig 9 is cut. Therefore, it is possible to prevent the resin sheet 11 from being cut by rotating the blade. It is possible to prevent chips from being generated from the jig for cutting, or to cause leakage in the suction hole 13 of the jig 9 for cutting. Since the rotary blade does not cut the resin sheet 11, the life of the cutting jig 9 becomes long, and the operation of the cutting device 19 can be reduced. this. Moreover, the material utilization rate of the product can be improved and the quality of the product can be improved.
而且，在本實施例中，搬運機構22係修正已密封基板1之X方向、Y方向及θ方向之偏移量，移動已密封基板1到切斷用治具9的既定位置的上方以載置。本發明並不侷限於此，也可以搬運機構22修正已密封基板1之X方向之偏移量，切斷用桌台8修正Y方向及θ方向之偏移量，載置已密封基板1到切斷用治具9的既定位置上。當係如此之情形時，也可以使搬運機構22係僅可在X方向上移動之構成。 Further, in the present embodiment, the transport mechanism 22 corrects the amount of shift of the sealed substrate 1 in the X direction, the Y direction, and the θ direction, and moves the sealed substrate 1 to the predetermined position of the cutting jig 9 to be carried. Set. The present invention is not limited thereto, and the transport mechanism 22 may correct the offset amount of the sealed substrate 1 in the X direction, and the cutting table 8 corrects the offset amount in the Y direction and the θ direction, and mounts the sealed substrate 1 to The cutting fixture 9 is positioned at a predetermined position. When this is the case, the transport mechanism 22 can be configured to move only in the X direction.
針對本發明切斷裝置的實施例4，參照第7A圖、第7B圖及第8圖以說明之。在實施例4中，說明無法載置到至目前為止說明過之既存切斷裝置19的切斷用桌台8上之大型已密封基板之切斷與單片化之方法。 Embodiment 4 of the cutting device of the present invention will be described with reference to Figs. 7A, 7B and 8. In the fourth embodiment, a method of cutting and singulating the large sealed substrate on the cutting table 8 of the existing cutting device 19 which has been described so far will be described.
如第7A圖所示，例如大型之已密封基板31具有600×500mm之大小。在已密封基板31中，係沿著基板的縱向及橫向，形成有多數之第2標記32(在圖面中，以+表示之標記)。在第7A圖中，使被形成在已密封基板31的四角落之八個第2標記32，將已密封基板31的左上當作基點，在逆時針旋轉之方向上，分別為32A、32B、...、32G、32H。在已密封基板31的四角落以外，也在縱向及橫向形成有多數之第2標記32。雖然未圖示，但是，被分別形成在已密封基板31中之被四分割之部分(被虛線及假想線四分割之部分)上之複數領域，係具有與第1A圖及第1B圖所示複數領域7相同之尺寸。 As shown in Fig. 7A, for example, the large sealed substrate 31 has a size of 600 × 500 mm. In the sealed substrate 31, a plurality of second marks 32 (indicated by + in the drawing) are formed along the longitudinal direction and the lateral direction of the substrate. In the seventh drawing, the eight second marks 32 formed on the four corners of the sealed substrate 31 are used as the base point of the upper left side of the sealed substrate 31, and 32A, 32B in the counterclockwise direction. ..., 32G, 32H. In addition to the four corners of the sealed substrate 31, a plurality of second marks 32 are formed in the longitudinal direction and the lateral direction. Although not shown, the plural fields which are respectively formed on the sealed substrate 31 which are divided into four (the portion divided by the broken line and the imaginary line) are as shown in FIGS. 1A and 1B. The same size of the plural field 7 is the same.
例如可搭載在第4圖所示切斷裝置19的切斷用桌 台8上之已密封基板的大小，係最大為320×320mm，所以，無法載置已密封基板31到切斷用桌台8。因此，在此狀態下，無法使用切斷裝置19以切斷已密封基板31。在此，分割已密封基板31成可搭載在切斷用桌台8上之大小。例如為了四分割已密封基板31，設定沿著橫向之分割線33與沿著縱向之分割線34。 For example, the cutting table of the cutting device 19 shown in Fig. 4 can be mounted. Since the size of the sealed substrate on the stage 8 is at most 320 × 320 mm, the sealed substrate 31 cannot be placed on the table 8 for cutting. Therefore, in this state, the cutting device 19 cannot be used to cut the sealed substrate 31. Here, the sealed substrate 31 is divided into a size that can be mounted on the cutting table 8. For example, in order to divide the sealed substrate 31 into four, the dividing line 33 along the lateral direction and the dividing line 34 along the longitudinal direction are set.
接著，如第7B圖所示，使用可分割大型已密封基板31之機構，沿著分割線33與分割線34，切斷已密封基板31。藉此，已密封基板31被四分割，被分割成具有300×250mm大小之已密封基板35。被分割後之已密封基板35A、35B、35C、35D，係具有可搭載在切斷裝置19的切斷用桌台8上之大小。藉分割已密封基板31，可減少已密封基板31原來具有之反翹或內部應力等。因此，被分割後之已密封基板35A、35B、35C、35D，係在反翹或尺寸等產生變化。 Next, as shown in FIG. 7B, the sealed substrate 31 is cut along the dividing line 33 and the dividing line 34 by using a mechanism that can divide the large sealed substrate 31. Thereby, the sealed substrate 31 is divided into four, and is divided into the sealed substrate 35 having a size of 300 × 250 mm. The divided sealed substrates 35A, 35B, 35C, and 35D have a size that can be mounted on the cutting table 8 of the cutting device 19. By dividing the sealed substrate 31, it is possible to reduce the backlash, internal stress, and the like which the sealed substrate 31 originally has. Therefore, the divided sealed substrates 35A, 35B, 35C, and 35D are changed in back warpage, size, and the like.
接著，如第8圖所示，例如使被四分割中之一個已密封基板35A，藉搬運機構22載置在切斷用桌台8上。在切斷用桌台8，安裝有第3A圖及第3B圖所示之切斷用治具9。因此，在切斷用治具9的金屬桌台10，形成有多數之第1標記18。在切斷用桌台8的既定領域SUB之範圍內，可載置已密封基板35A。 Next, as shown in Fig. 8, for example, one of the four divided sheets 35A is placed on the cutting table 8 by the transport mechanism 22. The cutting jig 9 shown in Figs. 3A and 3B is attached to the cutting table 8. Therefore, a plurality of first marks 18 are formed on the metal table 10 of the jig 9 for cutting. The sealed substrate 35A can be placed in the range of the predetermined area SUB of the cutting table 8.
在已密封基板35A中，將沿著縱向被形成之第2標記32中之某一個第2標記當作32I，將沿著橫向被形成之第2標記32中之某一個第2標記當作32J。 In the sealed substrate 35A, one of the second marks 32 formed along the longitudinal direction is regarded as 32I, and one of the second marks 32 formed along the lateral direction is regarded as 32J. .
藉對位用之攝影機25(參照第4圖)，量測沿著已 密封基板35A的縱向被形成之第2標記32A，32I，與沿著已密封基板35A的橫向被形成之第2標記32B，32J之座標位置。比較這些被測得之第2標記之座標位置，32A，32I及32B，32J，與事先記憶之第1標記18A，18H及18B，18C之座標位置。藉此，可算出已密封基板35A之偏移量。藉修正此偏移量，可對應切斷用桌台8的第1標記18之位置地，對合已密封基板35A的第2標記32之位置。因此，可正確對合被設定在已密封基板35A上之切斷線之位置，到被設於切斷用治具9上之切斷凹槽之位置。藉此，旋轉刀係不自切斷用治具9的切斷凹槽之位置偏移地，可沿著切斷線，正確切斷被分割後之已密封基板35A。同樣地，使被分割後之已密封基板35B，35C，35D，分別載置在切斷用桌台8上以切斷之。 By using the camera 25 for alignment (refer to Figure 4), the measurement along the already The second marks 32A and 32I formed in the longitudinal direction of the sealing substrate 35A are at the coordinate positions of the second marks 32B and 32J formed along the lateral direction of the sealed substrate 35A. The coordinate positions of the measured second marks, 32A, 32I and 32B, 32J, and the coordinate positions of the first marks 18A, 18H and 18B, 18C which are memorized in advance are compared. Thereby, the amount of shift of the sealed substrate 35A can be calculated. By correcting the offset amount, the position of the second mark 32 of the sealed substrate 35A can be aligned in accordance with the position of the first mark 18 of the cutting table 8. Therefore, the position of the cutting line set on the sealed substrate 35A can be correctly aligned to the position of the cutting groove provided on the cutting jig 9. Thereby, the rotary blade is not displaced from the position of the cutting groove of the cutting jig 9 and the divided sealed substrate 35A can be accurately cut along the cutting line. Similarly, the divided sealed substrates 35B, 35C, and 35D are placed on the cutting table 8 to be cut.
當依據本實施例時，藉分割無法搭載在既存之切斷裝置19的切斷用桌台8上之大型已密封基板31，可使用既存之切斷裝置19，切斷被分割後之已密封基板35。其係藉不採用使用如先前之定位銷之對位法，而採用使用對位用之攝影機25，以量測座標位置之對位法，而成為可能。比較被分割後之已密封基板35的第2標記32之座標位置，與事先記憶之切斷用桌台8的第1標記18之座標位置，藉此，可正確對位。因此，藉分割無法搭載在切斷用桌台8上之大型已密封基板，可使用既存之切斷裝置19以切斷之。 According to the present embodiment, by dividing the large sealed substrate 31 which cannot be mounted on the cutting table 8 of the existing cutting device 19, the existing cutting device 19 can be used to cut the sealed sealed portion. Substrate 35. It is possible to use the alignment method using the positioning pin as in the prior art, and to use the camera 25 for alignment to measure the coordinate position of the coordinate position. The coordinate position of the second mark 32 of the divided sealed substrate 35 is compared with the coordinate position of the first mark 18 of the cutting table 8 which has been memorized in advance, whereby the position can be correctly aligned. Therefore, the large sealed substrate that cannot be mounted on the cutting table 8 can be cut by using the existing cutting device 19.
當依據本實施例時，可分割大型之已密封基板31，以切斷被分割後之已密封基板35。藉分割已密封基板31，可減少已密封基板31之反翹或內部應力，所以，被分割後之 已密封基板35，係在反翹或尺寸等產生變化。即使當在被分割後之已密封基板35的尺寸產生變化時，因為量測已密封基板35的第2標記32之座標位置，所以，也可對於尺寸之變化進行修正。因此，可正確地進行被分割後之已密封基板35與切斷用桌台8之對位。 According to the present embodiment, the large sealed substrate 31 can be divided to cut the divided sealed substrate 35. By dividing the sealed substrate 31, the backlash or internal stress of the sealed substrate 31 can be reduced, so that after being divided The sealed substrate 35 is changed in anti-warpage, size, and the like. Even when the size of the sealed substrate 35 after the division is changed, since the coordinate position of the second mark 32 of the sealed substrate 35 is measured, the change in the size can be corrected. Therefore, the alignment between the divided sealed substrate 35 and the cutting table 8 can be accurately performed.
當依據本實施例時，可使用相同之切斷裝置19與相同之切斷用桌台8，切斷通常之已密封基板1與被分割後之已密封基板35。因此，不追加新的構成元件或新的功能到既存之切斷裝置19，就可以精度良好地進行已密封基板1及被分割後之已密封基板35之對位。不改良切斷裝置19，而且，不產生費用，就可以精度良好地進行已密封基板之對位。因此，可抑制切斷裝置19之費用，同時可切斷具有各種大小之已密封基板。 According to the present embodiment, the same cutting device 19 and the same cutting table 8 can be used to cut the normally sealed substrate 1 and the divided sealed substrate 35. Therefore, the alignment of the sealed substrate 1 and the divided sealed substrate 35 can be accurately performed without adding a new constituent element or a new function to the existing cutting device 19. The cutting device 19 is not improved, and the alignment of the sealed substrate can be performed with high precision without incurring a cost. Therefore, the cost of the cutting device 19 can be suppressed, and the sealed substrate having various sizes can be cut.
在各實施例中，被切斷物係表示切斷包含晶片狀元件(半導體晶片等)之已密封基板之情形。本發明並不侷限於此，已密封基板以外之被切斷物，也可以適用本發明到切斷下一個被切斷物以單片化之情形。第1係使製入有矽、由化合物半導體所構成之電路元件、MEMS(Micro Electro Mechanical Systems)等之功能元件之半導體晶圓(semiconductor wafer)單片化之情形。第2係使製入有電阻體、電容、偵知器、表面彈性波裝置等之功能元件之陶瓷基板及玻璃基板等單片化，以製造晶片電阻、晶片電容、晶片型之偵知器、表面彈性波裝置等製品之情形。在此兩個情形中，半導體晶圓及陶瓷基板等，係對應於被製入有分別對應複數領域之功能元件之基板。第3 係單片化樹脂成形品，以製造透鏡、光學模組及導光板等之光學零件之情形。第4係單片化樹脂成形品，以製造一般性成形製品之情形。第5係製造被當作種種電子設備的蓋體等使用之玻璃板之情形。在包含上述五個情形之種種情形中，可適用上述之內容。 In each of the embodiments, the object to be cut indicates a case where the sealed substrate including the wafer-shaped element (semiconductor wafer or the like) is cut. The present invention is not limited thereto, and the present invention may be applied to the object to be cut other than the sealed substrate, and the case where the next object to be cut is cut to be singulated. In the first embodiment, a semiconductor wafer in which a functional element composed of a compound semiconductor or a functional element such as MEMS (Micro Electro Mechanical Systems) is formed is formed into a single piece. In the second embodiment, a ceramic substrate, a glass substrate, or the like, which has a functional element such as a resistor, a capacitor, a detector, or a surface acoustic wave device, is formed into a single piece to manufacture a chip resistor, a chip capacitor, and a wafer type detector. The case of a product such as a surface acoustic wave device. In both cases, the semiconductor wafer, the ceramic substrate, and the like correspond to substrates on which functional elements corresponding to the plurality of domains are respectively formed. Third A single-piece resin molded article is used to manufacture optical components such as lenses, optical modules, and light guide plates. The fourth system is a single-piece resin molded article to produce a general molded article. The fifth system manufactures a glass plate which is used as a cover of various electronic devices. In the case of including the above five cases, the above contents can be applied.
在各實施例中，被切斷物係表示切斷具有具備縱向與橫向之矩形形狀之被切斷物之情形。本發明並不侷限於此，在切斷具有正方形形狀之被切斷物之情形，或者，切斷具有如半導體晶圓之實質上為圓形形狀之被切斷物之情形中，也可適用上述之內容。 In each of the embodiments, the object to be cut is a case where the object to be cut having a rectangular shape in the longitudinal direction and the lateral direction is cut. The present invention is not limited thereto, and may be applied to a case where a cut object having a square shape is cut, or a cut object having a substantially circular shape such as a semiconductor wafer is cut. The above content.
在各實施例中，比較被形成在已密封基板上之第2標記之座標位置，與被形成在切斷用治具9上之第1標記，藉此，算出偏移量。本發明並不侷限於此，複數之對位標記，也可以使用第2標記以外之圖案。可使用被形成在半導體晶圓上之實際電路圖案、已密封基板中之外接用端子之圖案、突起狀電極(凸塊、BGA中之球體)等以對位。 In each of the embodiments, the offset amount is calculated by comparing the coordinate position of the second mark formed on the sealed substrate with the first mark formed on the cutting jig 9. The present invention is not limited thereto, and a pattern other than the second mark may be used for the plurality of alignment marks. The actual circuit pattern formed on the semiconductor wafer, the pattern of the external connection terminals in the sealed substrate, the protruding electrodes (bumps, spheres in the BGA), or the like can be used to align.
在各實施例中，係使具有金屬板10及被固定在金屬板10上之樹脂片11之切斷用治具9，安裝在切斷用桌台8上。本發明並不侷限於此，也可以使用以一種或複數種金屬所構成之切斷用治具9，換言之，可使用金屬製之切斷用治具9。可以使用以一種或複數種樹脂所構成之切斷用治具9，換言之，可使用樹脂製之切斷用治具9。也可以不使用切斷用桌台8地，藉移動機構23與旋轉機構24直接移動切斷用治具9本體。 In each of the embodiments, the cutting jig 9 having the metal plate 10 and the resin sheet 11 fixed to the metal plate 10 is attached to the cutting table 8. The present invention is not limited thereto, and a cutting jig 9 made of one or a plurality of metals may be used. In other words, a metal cutting jig 9 may be used. A cutting jig 9 made of one or a plurality of kinds of resins can be used. In other words, a jig for cutting 9 made of a resin can be used. It is also possible to directly move the main body of the cutting jig 9 by the moving mechanism 23 and the rotating mechanism 24 without using the cutting table 8.
在各實施例中，切斷機構係使用旋轉刀。本發明並不侷限於此，也可以使用線鋸、帶鋸、雷射光、水刀、噴砂等。當使用線鋸及帶鋸時，當作做為貢獻於切斷之機構之刀(線鋸、帶鋸)可通過之空間之穿孔，係被設於切斷用治具上。當使用雷射光、水刀、噴砂時，當作貢獻於切斷之機構可通過之空間之穿孔，係被設於切斷用治具上。因此，在本發明中之「切斷凹槽」，係包含貫穿「切斷用治具」之狹縫狀之穿孔。被包含在切斷機構且貢獻於切斷之機構(旋轉刀、線鋸、帶鋸等)之至少一部份，係通過「切斷凹槽」。自切斷機構被供給且貢獻於切斷之機構(雷射光、高壓噴射水、磨粒等)之至少一部份，係通過「切斷凹槽」。 In various embodiments, the cutting mechanism uses a rotating knife. The present invention is not limited thereto, and a wire saw, a band saw, a laser beam, a water jet, sand blasting, or the like may be used. When a wire saw or a band saw is used, it is provided as a cutting jig for a space through which a knife (wire saw, band saw) that can contribute to the cutting mechanism can pass. When laser light, water jet, or sand blasting is used, the perforation of the space through which the mechanism contributing to the cutting is passed is provided on the cutting jig. Therefore, the "cutting groove" in the present invention includes a slit-shaped through hole penetrating the "cutting jig". At least a part of the mechanism (rotary knife, wire saw, band saw, etc.) included in the cutting mechanism and contributing to the cutting is passed through the "cut groove". At least a part of the mechanism (laser light, high-pressure jet water, abrasive grains, etc.) supplied from the cutting mechanism and contributing to the cutting is passed through the "cut groove".
本發明係不侷限於上述各實施例者，其係在不脫逸本發明旨趣之範圍內，因應需要，可任意且適當地組合、改變或選擇採用者。 The present invention is not limited to the above embodiments, and may be arbitrarily and appropriately combined, changed, or selected as needed, without departing from the scope of the present invention.
1‧‧‧已密封基板(被切斷物) 1‧‧‧ Sealed substrate (cut object)
8‧‧‧切斷用桌台 8‧‧‧Severance table
9‧‧‧切斷用治具 9‧‧‧Cut cutting tool
10‧‧‧金屬桌台 10‧‧‧Metal table
11‧‧‧樹脂片 11‧‧‧Resin tablets
12‧‧‧突出部 12‧‧‧Protruding
13‧‧‧吸著孔 13‧‧‧Sucking holes
15‧‧‧第1切斷凹槽(切斷凹槽) 15‧‧‧1st cut groove (cut groove)
16‧‧‧第2切斷凹槽(切斷凹槽) 16‧‧‧2nd cut groove (cut groove)
17,17A,17B,...,17G,17H‧‧‧第1標記 17,17A,17B,...,17G,17H‧‧‧1st mark
A‧‧‧基板供給模組 A‧‧‧Substrate supply module
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| JP2015021259A JP6212507B2 (en) | 2015-02-05 | 2015-02-05 | Cutting apparatus and cutting method |
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| JP7095082B2 (en) * | 2018-05-14 | 2022-07-04 | 株式会社Fuji | Lead wire cutting unit and mounting machine equipped with it |
| CN114340846B (en) | 2019-09-27 | 2022-11-29 | 株式会社东京精密 | Cutting device and method |
| JP7377092B2 (en) * | 2019-12-16 | 2023-11-09 | Ｔｏｗａ株式会社 | Statistical data generation method, cutting device and system |
| JP7446169B2 (en) * | 2020-06-26 | 2024-03-08 | キヤノントッキ株式会社 | Substrate transfer device, substrate processing system, substrate transfer method, electronic device manufacturing method, program and storage medium |
| JP7440356B2 (en) * | 2020-06-26 | 2024-02-28 | キヤノントッキ株式会社 | Alignment equipment, film forming equipment, alignment method, electronic device manufacturing method, program and storage medium |
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| JP7440355B2 (en) * | 2020-06-26 | 2024-02-28 | キヤノントッキ株式会社 | Alignment equipment, film forming equipment, alignment method, electronic device manufacturing method, program and storage medium |
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| CN114609711B (en) * | 2022-03-09 | 2023-07-18 | 业成科技（成都）有限公司 | Manufacturing method of optical element, clamping device, display module and electronic equipment |
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