TW201638287A - Grinding tool - Google Patents
Grinding tool Download PDFInfo
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- TW201638287A TW201638287A TW104112575A TW104112575A TW201638287A TW 201638287 A TW201638287 A TW 201638287A TW 104112575 A TW104112575 A TW 104112575A TW 104112575 A TW104112575 A TW 104112575A TW 201638287 A TW201638287 A TW 201638287A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
- B24B53/017—Devices or means for dressing, cleaning or otherwise conditioning lapping tools
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
- B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
- B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
- B24D7/066—Grinding blocks; their mountings or supports
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
Abstract
Description
本發明是有關於一種研磨工具，且特別是有關於一種研磨顆粒之頂面為尖端之多邊錐體之研磨工具及其製造方法。 BACKGROUND OF THE INVENTION 1. Field of the Invention This invention relates to an abrasive tool, and more particularly to an abrasive tool having a tipped polygonal cone on the top surface of the abrasive particle and a method of making the same.
研磨工具已被廣泛使用於材料的切削、研磨、拋光和磨光等多種應用領域當中。在如石材加工業或精密磨削工業中，透過堅硬的研磨顆粒優異的耐磨性能使切割、磨削等加工程序之效率提升，並使這類加工行業的成本降低。 Grinding tools have been widely used in a variety of applications such as cutting, grinding, polishing and polishing of materials. In the stone processing industry or the precision grinding industry, the excellent wear resistance of hard abrasive particles increases the efficiency of cutting and grinding processes and reduces the cost of such processing industries.
化學機械研磨(Chemical Mechanical Polishing，CMP)係為各種產業中最常見的研磨製程。利用CMP製程可研磨各種物品的表面，包括陶瓷、矽、玻璃、石英、或金屬的晶片等。此外，隨著積體電路發展迅速，因CMP可達到大面積平坦之目的，故為半導體製程中常見的晶圓平坦化技術之一。尤有甚者，隨著電晶體的體積縮小化，CMP的加工次數也隨之增加，例如，在28奈米線寬的製程中，CMP的加工次數即可能高達至三十次。 Chemical Mechanical Polishing (CMP) is the most common grinding process in various industries. The surface of various articles can be ground using a CMP process, including ceramic, germanium, glass, quartz, or metal wafers. In addition, with the rapid development of integrated circuits, CMP can achieve a large area of flatness, so it is one of the common wafer planarization techniques in semiconductor manufacturing. In particular, as the volume of the transistor shrinks, the number of CMP processes increases. For example, in a 28 nm line width process, the number of CMP processes can be as high as thirty.
目前半導體工業每年花費超過十億美元製造必須具有非常平坦且光滑表面的矽晶圓。已有許多的技術用以 製造光滑且具有平坦表面之矽晶圓，最常見的製程便是CMP製程。在所有CMP製程中最重要的關鍵在於研磨晶圓的均勻度、積體電路(IC)線路的光滑性、產率的移除速率、CMP消耗品的壽命等方面，使CMP可以實現最高性能。 The semiconductor industry currently spends more than $1 billion annually to produce silicon wafers that must have a very flat and smooth surface. There are many technologies used To make a smooth wafer with a flat surface, the most common process is the CMP process. The most important key in all CMP processes is the uniformity of the polished wafer, the smoothness of the integrated circuit (IC) circuitry, the removal rate of the yield, the lifetime of the CMP consumables, etc., enabling CMP to achieve maximum performance.
在半導體的CMP製程中，係利用研磨墊(Pad)對晶圓或是其他半導體元件接觸，並視需要搭配研磨液使用，使研磨墊透過化學反應與物理機械力以移除晶圓表面之雜質或不平坦結構。當研磨墊使用一段時間後，由於研磨過程中所產生之研磨屑積滯於研磨墊之表面，造成研磨效果及效率降低。因此，可利用研磨工具(如：修整器)對研磨墊表面磨修，使研磨墊之表面再度粗糙化，並維持在最佳的研磨狀態。 In the semiconductor CMP process, the wafer or other semiconductor components are contacted by a pad, and used as needed with the polishing liquid, so that the polishing pad transmits chemical impurities and physical mechanical force to remove impurities on the surface of the wafer. Or uneven structure. When the polishing pad is used for a period of time, the grinding effect and the efficiency are lowered due to the accumulation of the grinding debris generated during the grinding process on the surface of the polishing pad. Therefore, the surface of the polishing pad can be ground by an abrasive tool (such as a dresser) to roughen the surface of the polishing pad and maintain the optimum grinding state.
為了提高研磨工具的切削率(cutting rate)，通常係藉由提高研磨顆粒之排列密度來達到目的。若是提高研磨顆粒之排列密度，隨著所使用的研磨顆粒數量增加，則會相對地造成研磨工具之製造成本提高。 In order to increase the cutting rate of the abrasive tool, it is usually achieved by increasing the arrangement density of the abrasive particles. If the arrangement density of the abrasive particles is increased, as the amount of abrasive particles used increases, the manufacturing cost of the polishing tool is relatively increased.
現行之研磨工具雖藉由提高研磨顆粒之排列密度可達到提高切削率的目的，但相對來說，會造成研磨工具之製造成本提高。因此，如何能在不增加研磨顆粒數量的情況下提高研磨工具的切削率，實屬當前重要研發課題之一，亦成為當前相關領域極需改進的目標。 Although the current grinding tool can increase the cutting rate by increasing the arrangement density of the abrasive particles, relatively speaking, the manufacturing cost of the grinding tool is increased. Therefore, how to improve the cutting rate of the grinding tool without increasing the amount of abrasive particles is one of the current important research and development topics, and it has become an urgent need for improvement in related fields.
本發明內容之一目的是在提供一種研磨工具及其 製造方法，藉以改善先前技術的問題。 One of the objects of the present invention is to provide an abrasive tool and Manufacturing methods to improve the problems of prior art.
本發明內容之一技術態樣是在提供一種研磨工具。前述研磨工具包含基板及多個研磨顆粒。基板具有工作面；研磨顆粒分佈於工作面上並突出於該工作面；其中，部分研磨顆粒係經由表面加工以形成的頂部為尖端之多邊錐體，該多邊錐體為正八角錐體或正四角錐體。 One aspect of the present invention is to provide an abrasive tool. The aforementioned grinding tool comprises a substrate and a plurality of abrasive particles. The substrate has a working surface; the abrasive particles are distributed on the working surface and protrude from the working surface; wherein the partially ground particles are processed through the surface to form a top-end polygonal cone, the polygonal cone being a regular octagonal cone or a regular square pyramid body.
於一實施例中，頂部為尖端之多邊錐體為正八角錐體，且正八角錐體上所包含的八個側面中之任兩相對側面以尖端為頂點所呈之夾角為80度到100度。 In one embodiment, the polygonal pyramid with the tip at the tip is a regular octagonal cone, and any two of the eight sides included on the regular octagonal cone have an angle of 80 degrees to 100 degrees with the tip as a vertex.
於上述實施例中，夾角為90度。 In the above embodiment, the included angle is 90 degrees.
於一實施例中，頂部為尖端之多邊錐體為正四角錐體，且正四角錐體上所包含的四個側面中之任兩相對側面以尖端為頂點所呈之夾角為70度到90度。 In one embodiment, the polygonal pyramid having a tip at the top is a regular square pyramid, and any two of the four sides included on the regular pyramid have an angle of 70 degrees to 90 degrees with the tip as a vertex.
於上述實施例中，夾角為80度。 In the above embodiment, the included angle is 80 degrees.
於一實施例中，每一研磨顆粒係固接於一研磨柱上，基板具有多個凹槽或多個貫穿孔，研磨柱固定於凹槽或貫穿孔中，並且研磨顆粒突出於工作面。 In one embodiment, each of the abrasive particles is fixed to a grinding column, the substrate has a plurality of grooves or a plurality of through holes, the grinding column is fixed in the groove or the through hole, and the abrasive particles protrude from the working surface.
於一實施例中，研磨顆粒係藉由硬焊、燒結或電鍍固接於研磨柱。 In one embodiment, the abrasive particles are fixed to the grinding column by brazing, sintering or electroplating.
於一實施例中，這些研磨顆粒係為鑽石、立方氮化硼、氧化鋁、碳化矽等高硬度性質之材質。 In one embodiment, the abrasive particles are of high hardness properties such as diamond, cubic boron nitride, aluminum oxide, tantalum carbide, and the like.
於一實施例中，基板之材料係為不銹鋼、塑膠或陶瓷。 In one embodiment, the material of the substrate is stainless steel, plastic or ceramic.
綜上所述，本發明之技術方案與現有技術相比具有 明顯的優點和有益效果。藉由上述技術方案，可達到相當的技術進步，並具有產業上的廣泛利用價值，其優點係能在不增加研磨顆粒數量的情況下提高研磨工具的切削率、表面粗糙度及切削力。 In summary, the technical solution of the present invention has a comparison with the prior art. Obvious advantages and benefits. With the above technical solutions, considerable technological progress can be achieved, and industrial use is widely used, and the advantage is that the cutting rate, surface roughness and cutting force of the grinding tool can be improved without increasing the amount of abrasive particles.
以下將以實施方式對上述之說明作詳細的描述，並對本發明之技術方案提供更進一步的解釋。 The above description will be described in detail in the following embodiments, and further explanation of the technical solutions of the present invention will be provided.
1‧‧‧研磨工具 1‧‧‧ grinding tools
11‧‧‧基板 11‧‧‧Substrate
111‧‧‧工作面 111‧‧‧Working face
112‧‧‧貫穿孔 112‧‧‧through holes
113‧‧‧底面 113‧‧‧ bottom
12‧‧‧研磨顆粒 12‧‧‧Abrasive particles
121‧‧‧第一研磨顆粒 121‧‧‧First abrasive particles
121a‧‧‧八面磨修體 121a‧‧‧Eight grinding body
121b‧‧‧四面磨修體 121b‧‧‧ four-faced grinding body
122‧‧‧第二研磨顆粒 122‧‧‧Second abrasive particles
123‧‧‧研磨柱 123‧‧‧ Grinding column
14‧‧‧黏膠體 14‧‧‧ Viscose
2、3、4、4'‧‧‧線段 2, 3, 4, 4'‧‧‧ segments
301~308、401~404、411~414‧‧‧側面 301~308, 401~404, 411~414‧‧‧ side
32、42、46‧‧‧尖端 32, 42, 46‧‧‧ cutting-edge
48、49‧‧‧夾角 48, 49‧‧‧ angle
437‧‧‧法線 437‧‧‧ normal
34、44、47‧‧‧稜角 34, 44, 47‧‧ ‧ angular
602~610‧‧‧步驟 602~610‧‧‧Steps
9‧‧‧磨盤 9‧‧‧ grinding disc
91‧‧‧鑽石盤面 91‧‧‧Diamond disk
第1圖為繪示本發明一實施例所提供之一種研磨工具的俯視圖。 FIG. 1 is a plan view showing an abrasive tool according to an embodiment of the present invention.
第2圖是沿著第1圖中線段2所截取之研磨工具中研磨柱固定於貫穿孔之剖面圖。 Fig. 2 is a cross-sectional view showing the grinding column fixed to the through hole in the grinding tool taken along line 2 in Fig. 1.
第3A圖為繪示本發明一實施例所提供之八面磨修體的俯視圖。 FIG. 3A is a plan view showing an eight-faced grinding body according to an embodiment of the present invention.
第3B圖是沿著第3A圖中線段3所截取之八面磨修體的剖面圖。 Fig. 3B is a cross-sectional view of the octagonal wear body taken along line 3 in Fig. 3A.
第4A圖為繪示本發明一實施例所提供之四面磨修體的俯視圖。 FIG. 4A is a plan view showing a four-faced grinding body according to an embodiment of the present invention.
第4B圖是沿著第4A圖中線段4所截取之四面磨修體的剖面圖。 Figure 4B is a cross-sectional view of the four-faced wear body taken along line 4 of Figure 4A.
第5圖為製成本發明一實施例所提供之研磨工具的方法之流程圖。 Figure 5 is a flow chart of a method of making an abrasive tool according to an embodiment of the present invention.
第6A圖為製成本發明一實施例所提供之研磨顆粒表面加工成四面磨修體的方法之示意圖。 Fig. 6A is a schematic view showing a method of processing the surface of the abrasive particles processed into a four-faced grinding body according to an embodiment of the present invention.
第6B圖是製成本發明一實施例所提供之研磨顆粒表面加工成四面磨修體時沿著第6A圖中線段4'所截取的剖面圖。 Fig. 6B is a cross-sectional view taken along line 4' of Fig. 6A when the surface of the abrasive particles provided by an embodiment of the present invention is processed into a four-faced grinding body.
為了使本發明內容之敘述更加詳盡與完備，可參照所附之圖式及以下所述各種實施例，圖式中相同之號碼代表相同或相似之元件，且圖式僅以說明為目的，並未依照原尺寸作圖。但所提供之實施例並非用以限制本發明所涵蓋的範圍，而結構運作之描述非用以限制其執行之順序，任何由元件重新組合之結構，所產生具有均等功效的裝置，皆為本發明所涵蓋的範圍。 In order to make the description of the present invention more complete and complete, the embodiments of the present invention are to be understood by the accompanying drawings. Not plotted according to the original size. However, the embodiments provided are not intended to limit the scope of the invention, and the description of the operation of the structure is not intended to limit the order of its execution, and any device that is recombined by the components produces equal devices. The scope covered by the invention.
第1圖為繪示本發明一實施例所提供之研磨工具1的俯視圖；第2圖是沿著第1圖中線段2所截取之研磨工具1中研磨柱123固定於貫穿孔112之剖面圖。如第1、2圖所示，研磨工具1包含基板11及多個研磨顆粒12。基板11的相對兩側分別具有工作面111、底面113，且基板11中還具有多個貫穿孔112，且貫穿孔112分別開通至基板11之工作面111、底面113。各研磨顆粒12分別固接於研磨柱123。研磨柱123分別透過黏膠體14固定於貫穿孔112中。黏膠體14可在基板11的底面113外露，且研磨顆粒12突出於基板11之工作面111，使研磨工具1可對於受研磨體進行均勻地研磨。於一實施例中，基板11之材料例如為不銹鋼、塑膠或陶瓷。 1 is a plan view showing a grinding tool 1 according to an embodiment of the present invention; and FIG. 2 is a cross-sectional view showing a grinding column 123 fixed to the through hole 112 in the grinding tool 1 taken along the line 2 in FIG. . As shown in FIGS. 1 and 2, the polishing tool 1 includes a substrate 11 and a plurality of abrasive particles 12. The opposite sides of the substrate 11 respectively have a working surface 111 and a bottom surface 113 , and the substrate 11 further has a plurality of through holes 112 , and the through holes 112 are respectively opened to the working surface 111 and the bottom surface 113 of the substrate 11 . Each of the abrasive particles 12 is fixed to the polishing column 123. The polishing column 123 is fixed to the through hole 112 through the adhesive body 14, respectively. The adhesive body 14 can be exposed on the bottom surface 113 of the substrate 11, and the abrasive particles 12 protrude from the working surface 111 of the substrate 11, so that the polishing tool 1 can be uniformly ground for the object to be polished. In one embodiment, the material of the substrate 11 is, for example, stainless steel, plastic or ceramic.
於一實施例中，研磨顆粒12係藉由硬焊、燒結或電鍍等方式固接於研磨柱123。其中，研磨柱123可為圓形柱或方柱等不同之形狀。於一實施例中，研磨柱123所採用之材料係為金屬。 In one embodiment, the abrasive particles 12 are fixed to the polishing column 123 by brazing, sintering, or electroplating. The grinding column 123 may have a different shape such as a circular column or a square column. In one embodiment, the material used for the polishing column 123 is metal.
於一實施例中，研磨顆粒12係為鑽石、立方氮化硼、氧化鋁、碳化矽等高硬度性質之材質。研磨顆粒12之粒徑值例如為20至30英制篩目(US mesh)，亦即用以篩選研磨顆粒12之篩網上每平方英吋中具有20至30個篩目。 In one embodiment, the abrasive particles 12 are made of high hardness properties such as diamond, cubic boron nitride, aluminum oxide, and tantalum carbide. The particle size of the abrasive particles 12 is, for example, 20 to 30 inch mesh (US mesh), i.e., 20 to 30 mesh per square inch of the screen for screening the abrasive particles 12.
如第1圖所示，研磨工具1上的研磨顆粒12中可包括多個第一研磨顆粒121及多個第二研磨顆粒122，其中，第一研磨顆粒121之表面有經過加工，第二研磨顆粒122之表面無經過加工。表面有經過加工之第一研磨顆粒121係分別以空心圓繪示，表面無經過加工之第二研磨顆粒122則分別以實心圓繪示，其中，第一研磨顆粒121及第二研磨顆粒122係穿插分佈，且第一研磨顆粒121大致均勻散佈於研磨工具1之工作面111上。 As shown in FIG. 1, the abrasive particles 12 on the abrasive tool 1 may include a plurality of first abrasive particles 121 and a plurality of second abrasive particles 122, wherein the surface of the first abrasive particles 121 has been processed, and the second polishing The surface of the particles 122 is not processed. The processed first abrasive particles 121 are respectively shown by hollow circles, and the second unprocessed abrasive particles 122 are respectively depicted by solid circles, wherein the first abrasive particles 121 and the second abrasive particles 122 are respectively The distribution is interspersed, and the first abrasive particles 121 are substantially uniformly dispersed on the working surface 111 of the abrasive tool 1.
第一研磨顆粒121係經由一磨盤對於研磨顆粒12之表面加工以形成，且第一研磨顆粒121可為不同的形狀規格，以達成不同的研磨效果。其中，第一研磨顆粒121可以是頂部為尖端之多邊錐體。依據本發明之實施例，第一研磨顆粒121可為正八角錐體，稱做八面磨修體，或是正四角錐體，稱做四面磨修體。 The first abrasive particles 121 are formed by processing a surface of the abrasive particles 12 via a grinding disc, and the first abrasive particles 121 may be of different shape specifications to achieve different grinding effects. Wherein, the first abrasive particles 121 may be a polygonal cone whose tip is a tip. According to an embodiment of the present invention, the first abrasive particles 121 may be a regular octagonal cone, referred to as an eight-faced grinding body, or a regular square pyramid, which is referred to as a four-faced grinding body.
第3A圖為繪示本發明一實施例所提供之八面磨修體121a的俯視圖；第3B圖是沿著第3A圖中線段3所截取 之八面磨修體121a的剖面圖。如第3A、3B圖所示，八面磨修體121a上包含八個側面301~308及一個尖端32，其中任兩相對側面(例如第3B圖所繪示之側面302及側面306)以尖端32為頂點所呈之一夾角稱做稜角34，稜角34之角度為80度到100度。當研磨顆粒為八面磨修體121a時，其作用為研磨工具在對於拋光墊進行拋光的過程中，八面磨修體121a具有較尖銳之尖端32，能在拋光墊上刻畫出較深的溝痕，使切削率提高。於一實施例中，當研磨顆粒為八面磨修體121a時，八面磨修體121a之稜角34的最佳角度為90度。 FIG. 3A is a plan view showing an octahedral grinding body 121a according to an embodiment of the present invention; FIG. 3B is a cross-sectional view taken along line 3 of FIG. 3A. A cross-sectional view of the octahedral grinding body 121a. As shown in FIGS. 3A and 3B, the eight-faced grinding body 121a includes eight side faces 301 to 308 and one tip end 32, and any two opposite sides (for example, the side face 302 and the side face 306 shown in FIG. 3B) are pointed. 32 is an angle formed by one of the vertices, and the angle of the corner 34 is 80 degrees to 100 degrees. When the abrasive particles are the octahedral grinding body 121a, the function is the grinding tool. During the polishing of the polishing pad, the octahedral grinding body 121a has a sharper tip 32, which can depict a deep groove on the polishing pad. Traces increase the cutting rate. In one embodiment, when the abrasive particles are the octahedral grinding body 121a, the optimum angle of the corners 34 of the octahedral grinding body 121a is 90 degrees.
第4A圖為繪示本發明另一實施例所提供之四面磨修體121b的俯視圖；第4B圖是沿著第4A圖中線段4所截取之四面磨修體121b的剖面圖。如第4A、4B圖所示，四面磨修體121b上包含四個側面401~404及一個尖端42，其中任兩相對側面(例如第4B圖所繪示之側面402及側面404)以尖端42為頂點所呈之一夾角稱做稜角44，其稜角44之角度為70度到90度。當研磨顆粒為四面磨修體121b時，其作用為研磨工具在對於拋光墊進行拋光的過程中，四面磨修體121b具有更尖銳之稜角44，能在拋光墊上刻畫出更深的溝痕，使切削率更高。於一實施例中，當研磨顆粒為四面磨修體121b時，四面磨修體121b之稜角44的最佳角度為80度。 4A is a plan view showing a four-faced grinding body 121b according to another embodiment of the present invention; and FIG. 4B is a cross-sectional view of the four-faced grinding body 121b taken along line 4 of FIG. 4A. As shown in FIGS. 4A and 4B, the four-faced grinding body 121b includes four sides 401 to 404 and a tip end 42, wherein any two opposite sides (for example, the side surface 402 and the side surface 404 shown in FIG. 4B) are pointed at the tip end 42. The angle formed by one of the vertices is referred to as an angular angle 44, and the angle of the corner 44 is 70 degrees to 90 degrees. When the abrasive particles are the four-faced grinding body 121b, the function of the abrasive tool is to polish the polishing pad, and the four-faced grinding body 121b has a sharper edge angle 44, which can depict deep groove marks on the polishing pad, so that The cutting rate is higher. In one embodiment, when the abrasive particles are the four-faced grinding body 121b, the optimum angle of the corners 44 of the four-faced grinding body 121b is 80 degrees.
四面磨修體係為八面磨修體的改良成品，即使四面磨修體的稜角角度與八面磨修體的稜角角度相同，由於四 面磨修體在研磨過程中接觸拋光墊的表面積較小，在拋光墊上刻畫出的溝痕較窄也較深，而八面磨修體在研磨過程中接觸拋光墊的表面積較大，在拋光墊上刻畫出的溝痕較寬也較淺。 The four-face grinding system is an improved finished product of the eight-face grinding body, even if the angular angle of the four-face grinding body is the same as that of the eight-face grinding body, due to the four The surface area of the surface grinding repairing body is small in contact with the polishing pad during the grinding process, and the groove marks on the polishing pad are narrower and deeper, and the surface area of the eight-faced grinding body contacting the polishing pad during the grinding process is larger, and is polished. The grooves marked on the mat are wider and shallower.
本發明中所揭示之表面有經過加工之四面磨修體及八面磨修體研磨顆粒的切削率係高於表面無加工之研磨顆粒的切削率。切削率愈高，拋光時的效果愈好。如第1圖所示，傳統研磨工具上之所有研磨顆粒，皆如同第二研磨顆粒122般，其研磨顆粒之表面無經過加工，而本發明所揭示之研磨工具1上同時具有多個第一研磨顆粒121及多個第二研磨顆粒122，如此一來將大大提升研磨工具之切削率(cutting rate)。 The cutting rate of the processed four-faced grinding body and the eight-faced grinding body abrasive grain on the surface disclosed in the present invention is higher than that of the surface unprocessed abrasive grain. The higher the cutting rate, the better the polishing effect. As shown in Fig. 1, all the abrasive particles on the conventional abrasive tool are like the second abrasive particles 122, and the surface of the abrasive particles is not processed, and the abrasive tool 1 disclosed in the present invention has a plurality of first The abrasive particles 121 and the plurality of second abrasive particles 122, as such, will greatly increase the cutting rate of the abrasive tool.
表面粗糙度係研磨顆粒對PAD修整時所產生在PAD表面上之粗糙度，表面粗糙度愈高，表示研磨顆粒對PAD表面上所產生的粗糙度愈大。本發明所揭示表面有經過加工之四面磨修體及八面磨修體研磨顆粒的表面粗糙度係高於表面無加工之研磨顆粒的表面粗糙度，而本發明所揭示之研磨工具1上同時具有多個第一研磨顆粒121及多個第二研磨顆粒122，如此一來將大大提升研磨工具之表面粗糙度。 The surface roughness is the roughness of the abrasive particles generated on the surface of the PAD when the PAD is trimmed. The higher the surface roughness, the greater the roughness generated by the abrasive particles on the surface of the PAD. The surface roughness of the processed four-faced abrasive body and the eight-faced abrasive body abrasive particle is higher than the surface roughness of the surface unprocessed abrasive particle, and the abrasive tool 1 disclosed in the present invention simultaneously There are a plurality of first abrasive particles 121 and a plurality of second abrasive particles 122, which will greatly enhance the surface roughness of the abrasive tool.
第5圖為繪示製成本發明一實施例所提供之研磨工具的方法之流程圖。如第5圖所示，本發明所提供之研磨工具的製造方法包含步驟502~510(應瞭解到，在本實施例中所提及的步驟，除特別敘明其順序者外，均可依實 際需要調整其前後順序，甚至可同時或部分同時執行)。至於實施該些步驟的硬體裝置，由於以上實施例已具體揭露，因此不再重複贅述之。 FIG. 5 is a flow chart showing a method of making an abrasive tool according to an embodiment of the present invention. As shown in FIG. 5, the manufacturing method of the grinding tool provided by the present invention includes steps 502 to 510 (it should be understood that the steps mentioned in the embodiment, except for specifically stating the order thereof, may be real It is necessary to adjust the order before and after, even at the same time or partially.) As for the hardware device for carrying out these steps, since the above embodiments have been specifically disclosed, the description thereof will not be repeated.
參見第5圖，於步驟502中，提供多個研磨顆粒。於一實施例中，研磨顆粒係為鑽石、立方氮化硼、氧化鋁、碳化矽等高硬度性質之材質。而研磨顆粒之粒徑值例如為20至30英制篩目(US mesh)，亦即用以篩選研磨顆粒之篩網上每平方英吋中具有20至30個篩目。 Referring to Figure 5, in step 502, a plurality of abrasive particles are provided. In one embodiment, the abrasive particles are materials of high hardness such as diamond, cubic boron nitride, aluminum oxide, and tantalum carbide. The particle size of the abrasive particles is, for example, 20 to 30 inch mesh (US mesh), i.e., 20 to 30 mesh per square inch of the sieve for screening abrasive particles.
參見第5圖，於步驟504中，用磨盤對於部分研磨顆粒之表面加工以形成頂部為尖端之多邊錐體。當研磨顆粒為頂部為尖端之多邊錐體時，研磨顆粒121可為正八角錐體，稱做八面磨修體，或是正四角錐體，稱做四面磨修體。 Referring to Fig. 5, in step 504, the surface of the partially abrasive particles is machined with a grinding disc to form a polygonal pyramid having a tip end. When the abrasive particles are polygonal pyramids with a tip at the top, the abrasive particles 121 may be a regular octagonal cone, referred to as an eight-faced grinding body, or a regular square pyramid, which is referred to as a four-faced grinding body.
由於八面磨修體及四面磨修體之差別，僅在於用磨盤將研磨顆粒之表面加工為正八角錐體或是正四角錐體，故以下僅以四面磨修體之加工方法進行說明。第6A圖為製成本發明一實施例所提供之研磨顆粒表面加工成四面磨修體121b的方法之示意圖，第6B圖是製成本發明一實施例所提供之研磨顆粒表面加工成四面磨修體121b時沿著第6A圖中線段4'所截取的剖面圖。 Since the difference between the eight-faced grinding body and the four-faced grinding body is only that the surface of the abrasive particles is processed into a regular octagonal cone or a regular square pyramid by a grinding disc, the following description will be made only by the processing method of the four-faced grinding body. 6A is a schematic view showing a method of processing the surface of the abrasive particles processed into the four-faced grinding body 121b according to an embodiment of the present invention, and FIG. 6B is a surface of the abrasive particles prepared by the embodiment of the present invention into a four-faced grinding body. A cross-sectional view taken along line 4' of Fig. 6A at 121b.
參見第6A、6B圖，用磨盤9對於研磨顆粒之表面加工，形成四面磨修體121b，四面磨修體121b上包含四個側面411~414及一個尖端46。舉例而言，當欲使用磨盤9對於研磨顆粒磨修出四面磨修體121b之側面414時，以通 過尖端46的水平面之法線437為基準，將磨盤9傾斜以使得磨盤9之鑽石盤面91與水平面之法線437之間維持夾角48。同樣地，當欲使用磨盤9對於研磨顆粒磨修出四面磨修體121b之側面412時，以通過尖端46的水平面之法線437為基準，將磨盤9傾斜以使得磨盤9之鑽石盤面91與法線437之間維持夾角49，其中，夾角49之角度與夾角48之角度大小相同。如此一來，兩相對側面412、414以尖端46為頂點所呈之一夾角為稜角47，稜角47之角度為70度到90度，反推回去，可知夾角48與夾角49之角度為35度到45度。以此類推，當欲使用磨盤9對於研磨顆粒磨修出四面磨修體121b之側面411及413時，也是同樣的方法。於一實施例中，當研磨顆粒為四面磨修體121b時，四面磨修體121b之稜角47之最佳角度為80度。 Referring to Figures 6A and 6B, the surface of the abrasive particles is processed by a grinding disc 9 to form a four-faced grinding body 121b having four sides 411 to 414 and a tip end 46. For example, when the grinding wheel 9 is used to grind the side 414 of the four-faced grinding body 121b with the abrasive particles, Based on the normal 437 of the horizontal plane of the tip 46, the disc 9 is tilted such that the angle between the diamond disk 91 of the disc 9 and the normal 437 of the horizontal plane is maintained. Similarly, when the side surface 412 of the four-faced grinding body 121b is to be ground for the abrasive particles using the grinding disc 9, the grinding disc 9 is inclined such that the diamond disk surface 91 of the grinding disc 9 is aligned with the normal line 437 passing through the horizontal plane of the tip 46. An angle 49 is maintained between the normals 437, wherein the angle of the included angle 49 is the same as the angle of the included angle 48. In this way, the angles of the opposite sides 412, 414 with the tip end 46 as an apex are the angle 47, and the angle of the corner 47 is 70 degrees to 90 degrees. When the angle is reversed, the angle between the angle 48 and the angle 49 is 35 degrees. To 45 degrees. By analogy, the same method is used when the grinding disc 9 is used to grind the sides 411 and 413 of the four-faced grinding body 121b with the abrasive grains. In one embodiment, when the abrasive particles are the four-faced grinding body 121b, the optimum angle of the corner 47 of the four-faced grinding body 121b is 80 degrees.
參見第2、5圖，於步驟506中，每一研磨顆粒12係固接於一研磨柱123上。於一實施例中，研磨顆粒12係藉由硬焊、燒結或電鍍固接於研磨柱123。 Referring to FIGS. 2 and 5, in step 506, each of the abrasive particles 12 is fixed to a grinding column 123. In one embodiment, the abrasive particles 12 are secured to the polishing column 123 by brazing, sintering, or electroplating.
參見第1、2、5圖，於步驟508中，提供具有工作面111之基板11，基板11具有多個凹槽或多個貫穿孔112。 Referring to Figures 1, 2, and 5, in step 508, a substrate 11 having a working surface 111 having a plurality of grooves or a plurality of through holes 112 is provided.
參見第1、2、5圖，於步驟510中，研磨柱123固定於凹槽或貫穿孔112中，並且所有研磨顆粒12分布於基板11之工作面111並突出於該工作面111。於一實施例中，研磨柱123可藉由黏膠體14固定於凹槽或貫穿孔112中。 Referring to FIGS. 1, 2, and 5, in step 510, the grinding column 123 is fixed in the groove or through hole 112, and all the abrasive particles 12 are distributed on the working surface 111 of the substrate 11 and protrude from the working surface 111. In one embodiment, the polishing column 123 can be fixed in the groove or through hole 112 by the adhesive body 14.
雖然本發明已以實施方式揭露如上，然其並非用以限定本發明，任何所屬領域中具有通常知識者，在不脫離 本發明之精神和範圍內，當可作各種之更動與潤飾，因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention, and any one of ordinary skill in the art does not In the spirit and scope of the present invention, the scope of the invention is defined by the scope of the appended claims.
1‧‧‧研磨工具 1‧‧‧ grinding tools
11‧‧‧基板 11‧‧‧Substrate
111‧‧‧工作面 111‧‧‧Working face
112‧‧‧貫穿孔 112‧‧‧through holes
113‧‧‧底面 113‧‧‧ bottom
12‧‧‧研磨顆粒 12‧‧‧Abrasive particles
123‧‧‧研磨柱 123‧‧‧ Grinding column
14‧‧‧黏膠體 14‧‧‧ Viscose
Claims (9)
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| US15/132,377 US20160303704A1 (en) | 2015-04-20 | 2016-04-19 | Grinding Tool |
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| TW104112575A TWI609742B (en) | 2015-04-20 | 2015-04-20 | Grinding tool |
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| JP2957519B2 (en) * | 1996-05-23 | 1999-10-04 | 旭ダイヤモンド工業株式会社 | Dresser for semiconductor wafer polishing pad and method of manufacturing the same |
| US6475253B2 (en) * | 1996-09-11 | 2002-11-05 | 3M Innovative Properties Company | Abrasive article and method of making |
| US5888119A (en) * | 1997-03-07 | 1999-03-30 | Minnesota Mining And Manufacturing Company | Method for providing a clear surface finish on glass |
| US8092707B2 (en) * | 1997-04-30 | 2012-01-10 | 3M Innovative Properties Company | Compositions and methods for modifying a surface suited for semiconductor fabrication |
| US6312484B1 (en) * | 1998-12-22 | 2001-11-06 | 3M Innovative Properties Company | Nonwoven abrasive articles and method of preparing same |
| US6634929B1 (en) * | 1999-04-23 | 2003-10-21 | 3M Innovative Properties Company | Method for grinding glass |
| US6458018B1 (en) * | 1999-04-23 | 2002-10-01 | 3M Innovative Properties Company | Abrasive article suitable for abrading glass and glass ceramic workpieces |
| US6776699B2 (en) * | 2000-08-14 | 2004-08-17 | 3M Innovative Properties Company | Abrasive pad for CMP |
| US7632434B2 (en) * | 2000-11-17 | 2009-12-15 | Wayne O. Duescher | Abrasive agglomerate coated raised island articles |
| CA2620407A1 (en) * | 2005-08-25 | 2007-03-01 | Hiroshi Ishizuka | Tool with sintered body polishing surface and method of manufacturing the same |
| US7410413B2 (en) * | 2006-04-27 | 2008-08-12 | 3M Innovative Properties Company | Structured abrasive article and method of making and using the same |
| FI20075533L (en) * | 2007-07-10 | 2009-01-11 | Kwh Mirka Ab Oy | Abrasive product and method for making the same |
| US8038750B2 (en) * | 2007-07-13 | 2011-10-18 | 3M Innovative Properties Company | Structured abrasive with overlayer, and method of making and using the same |
| US8080073B2 (en) * | 2007-12-20 | 2011-12-20 | 3M Innovative Properties Company | Abrasive article having a plurality of precisely-shaped abrasive composites |
| WO2010114075A1 (en) * | 2009-03-31 | 2010-10-07 | 本田技研工業株式会社 | Whetstone, method for producing whetstone, and device for producing whetstone |
| TWI417169B (en) * | 2009-06-11 | 2013-12-01 | Wei En Chen | Cutting tools with the top of the complex cutting |
| US20160263722A1 (en) * | 2013-10-18 | 2016-09-15 | 3M Innovative Properties Company | Coated abrasive article and method of making the same |
| TWM481093U (en) * | 2014-02-18 | 2014-07-01 | Kinik Co | Chemical mechanical polishing trimmer with adjustable tip height |
| GB201504759D0 (en) * | 2015-03-20 | 2015-05-06 | Rolls Royce Plc | Abrading tool for a rotary dresser |
-
2015
- 2015-04-20 TW TW104112575A patent/TWI609742B/en active
-
2016
- 2016-04-19 US US15/132,377 patent/US20160303704A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20160303704A1 (en) | 2016-10-20 |
| TWI609742B (en) | 2018-01-01 |
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