TW201624164A - Gas pressure adjustment device - Google Patents
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- TW201624164A TW201624164A TW104135428A TW104135428A TW201624164A TW 201624164 A TW201624164 A TW 201624164A TW 104135428 A TW104135428 A TW 104135428A TW 104135428 A TW104135428 A TW 104135428A TW 201624164 A TW201624164 A TW 201624164A
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- 238000011144 upstream manufacturing Methods 0.000 claims description 26
- 230000004044 response Effects 0.000 abstract description 27
- 238000005422 blasting Methods 0.000 abstract 1
- 230000004043 responsiveness Effects 0.000 description 19
- 230000000052 comparative effect Effects 0.000 description 15
- 238000005259 measurement Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
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- 230000006641 stabilisation Effects 0.000 description 1
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D16/00—Control of fluid pressure
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D16/00—Control of fluid pressure
- G05D16/14—Control of fluid pressure with auxiliary non-electric power
- G05D16/16—Control of fluid pressure with auxiliary non-electric power derived from the controlled fluid
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Abstract
Description
本發明，係關於在氣體供應系統中使用將以一次壓力從上游側傳輸來的氣體等減壓成二次壓力而供應至下游側的導引調速器的調速器(氣體壓力調整裝置)。 The present invention relates to a governor (gas pressure adjusting device) for guiding a governor that is supplied to a downstream side by depressurizing a gas or the like that is transferred from the upstream side by a primary pressure into a secondary pressure in a gas supply system. .
例如都市氣體等的氣體供應方面，係為了將在上游側輸送管(以下，稱作「上游管」)內以一次壓力(高壓/中壓)而運送的氣體減壓至預先設定的二次側設定壓力而供應至下游側輸送管(以下，稱作「下游管」)，而設有氣體壓力調整裝置(氣體調速器)。 For example, the gas supplied by the primary side (hereinafter referred to as "the upstream pipe") is depressurized to a predetermined secondary side in the upstream side transfer pipe (hereinafter referred to as "upstream pipe"). The pressure is set to be supplied to the downstream side duct (hereinafter referred to as "downstream pipe"), and a gas pressure adjusting device (gas governor) is provided.
歷來的氣體調速器，係如示於圖10，一般而言，具備針對從上游往下游的氣體的量進行調整的主閥(調速器主體)11、連接於下游管13並依下游側的壓力(以下稱作「二次壓」)P2的變化而針對調速器主體11進行控制的導引調速器21。導引調速器21係設定成二次壓P2成為既定的基準動作控制壓Ps以下時，使主閥(調速器主體)11動作而對下游側供應氣體。 The conventional gas governor, as shown in Fig. 10, generally has a main valve (a governor body) 11 for adjusting the amount of gas from upstream to downstream, and is connected to the downstream pipe 13 and downstream. The governor 21 that controls the governor body 11 under the pressure (hereinafter referred to as "secondary pressure") P2 changes. When the secondary pressure P2 is equal to or lower than the predetermined reference operation control pressure Ps, the pilot governor 21 operates the main valve (the governor main body) 11 to supply the gas to the downstream side.
使用如此之導引調速器21的氣體壓力調整裝置，係 存在如下相反的特性：使對於下游側的壓力變動的響應性變佳時，容易發生晃動，抑制晃動的發生時響應性變差。 The gas pressure adjusting device using the pilot governor 21 is There is an inverse characteristic that when the responsiveness to the pressure fluctuation on the downstream side is improved, the sway is likely to occur, and the responsiveness is suppressed when the occurrence of the sway is suppressed.
設置於氣體等的供應線中的調速器等係不可使晃動發生。為此，在確保流量同時作成晃動不會發生的方法方面雖可考慮將導引調速器21的抽氣用膜片22充分縮擠，惟以此方法係將調速器主體打開的動作的響應性響應於二次壓P2的降低而顯著降低。尤其氣體壓力調整裝置從完全停止的完全閉塞狀態開始下游管13側的使用而使用量增加的情況下，開始使用而二次壓P2降低的時間點至實際上調速器主體11動作為止需要等待時間，故取決於下游側的使用量與配管容量的關係如何而於此等待時間內二次壓降低有時會變過大。 A governor or the like provided in a supply line such as a gas cannot cause swaying. For this reason, in the method of ensuring that the flow rate does not occur at the same time, it is conceivable to sufficiently shrink the suction diaphragm 22 of the guide governor 21, but this method is to open the governor main body. The responsiveness is significantly reduced in response to the decrease in the secondary pressure P2. In particular, when the gas pressure adjusting device starts to use the downstream pipe 13 from the completely stopped fully closed state and the usage amount increases, the time when the secondary pressure P2 starts to be lowered and the governor main body 11 is actually operated is required to wait. Since the time depends on the relationship between the amount of use on the downstream side and the piping capacity, the decrease in the secondary pressure during this waiting time may become excessive.
為了避開如此響應延遲而二次壓P2極端降低的狀態，供於抑制晃動的發生同時使響應性變佳用的先前技術方面，已提出如示於圖11的記載於專利文獻1之技術。 In order to avoid such a response delay, the state in which the secondary pressure P2 is extremely lowered, and the technique described in Patent Document 1 as shown in FIG. 11 has been proposed in the prior art for suppressing occurrence of sloshing and improving responsiveness.
記載於專利文獻1之技術，係除主導引調速器SB以外，設置副導引調速器SC。副導引調速器SC的下游管13側，係經由副導引線S28，而連接於將主導引調速器SB連接於下游管13的主導引線S26。此外，副導引調速器SC的動作設定壓力係設定為比主導引調速器SB低。如此構成，使得調整成抑制主導引調速器SB的晃動，同時二次壓P2降低時，首先副導引調速器SC響應從而使響應性變佳。 The technique described in Patent Document 1 is to provide a sub-guide governor SC in addition to the main pilot governor SB. The downstream pipe 13 side of the sub-guide governor SC is connected to the main lead S26 that connects the main pilot governor SB to the downstream pipe 13 via the sub-guide line S28. Further, the operation setting pressure of the sub-guide governor SC is set to be lower than that of the main pilot governor SB. In such a configuration, when the adjustment is made to suppress the sway of the main guide governor SB, and the secondary pressure P2 is lowered, the sub-guide governor SC first responds to improve the responsiveness.
[專利文獻1]日本發明專利公開昭和53-78637號公報 [Patent Document 1] Japanese Patent Publication No. 53-78637
然而，記載於專利文獻1之氣體調速器方面，係儘管使響應性變佳，惟副導引調速器SC動作時，氣體從副導引調速器SC經由副導引線S28及主導引線S26而流往下游管13。 However, in the gas governor described in Patent Document 1, although the responsiveness is improved, when the sub-guide governor SC operates, the gas is guided from the sub-guide governor SC via the sub-guide line S28 and The lead S26 flows to the downstream pipe 13.
此氣流係對於供應至主導引線S26的二次壓P2造成影響。為此存在副導引調速器SC開始動作時，無法正確將下游管的二次壓P2傳至主導引調速器SB，主導引調速器SB的動作成為不穩定如此之問題。 This air flow has an effect on the secondary pressure P2 supplied to the lead wire S26. For this reason, when the sub-guide governor SC starts to operate, the secondary pressure P2 of the downstream pipe cannot be correctly transmitted to the main pilot governor SB, and the operation of the main pilot governor SB becomes unstable.
本發明，係鑑於上述問題點者，目的在於提供一種氣體壓力調整裝置(氣體調速器)，可抑制晃動的發生，同時獲得迅速的響應性，並且可確保穩定而充分的流量。 The present invention has been made in view of the above problems, and an object thereof is to provide a gas pressure adjusting device (gas governor) capable of suppressing the occurrence of sloshing while obtaining rapid responsiveness and ensuring a stable and sufficient flow rate.
本發明相關之氣體壓力調整裝置，係鑑於上述現有技術的問題點而創作者，具備： 設置於管路的中途而將以一次壓從上游側輸送來的氣體減壓成二次壓而流放至下游側的主閥；經由限制器而連接前述主閥的上游側的管路與下游側的管路的主導引迴路；設於前述主導引迴路內的前述限制器的下游側，前述二次壓成為既定的基準動作控制壓以下時，針對通過前述主導引迴路的氣體的量進行控制，而以前述二次壓成為一定的方式針對前述主閥進行動作控制的主導引調速器；一端連接於前述主導引迴路的前述限制器與前述主導引調速器之間，另一端以與前述主導引迴路係不同的路徑而連接於前述下游側的管路的副導引迴路；以及設於前述副導引迴路內，前述二次壓成為比前述基準動作控制壓低的第2基準壓時，針對通過前述副導引迴路內的氣體的量進行控制從而動作控制前述主閥的副導引調速器。 The gas pressure adjusting device according to the present invention is a creator in view of the above problems of the prior art, and has: In the middle of the pipeline, the gas sent from the upstream side by the primary pressure is decompressed into a secondary pressure and discharged to the main valve on the downstream side; the pipeline on the upstream side of the main valve and the downstream side are connected via a limiter. a main pilot circuit of the pipeline; the downstream side of the restrictor provided in the main pilot circuit, and when the secondary pressure is equal to or lower than a predetermined reference operating pressure, the amount of gas passing through the main pilot circuit is controlled. And the main guide governor for controlling the operation of the main valve in a manner that the secondary pressure is constant; one end is connected between the restrictor of the main guide circuit and the main guide governor, and the other end is opposite to the foregoing a main guide circuit is connected to a sub-guide circuit of the downstream side pipeline in a different path; and is provided in the sub-guide circuit, and the second pressure is a second reference pressure lower than the reference operation control pressure. The sub-guide governor that controls the aforementioned main valve by controlling the amount of gas in the sub-guide circuit.
此外，於下游管側設置文氏管，而將副導引迴路連接於文氏管的細管部，從而可進一步使響應性提升。 Further, the venturi is provided on the downstream pipe side, and the sub-guide circuit is connected to the thin pipe portion of the venturi, so that the responsiveness can be further improved.
使副導引迴路的往下游管的連接點與主導引迴路係不同的位置，使副導引迴路與主導引迴路係不同的獨立的別的路徑，使得即使副導引調速器動作仍不會對於主導引調速器造成影響，穩定的動作成為可能。 The connection point of the secondary guiding circuit to the downstream pipe is different from the main guiding circuit, so that the auxiliary guiding circuit and the main guiding circuit are different independent paths, so that even if the auxiliary guiding governor is not operated It will affect the main guide governor, and stable action becomes possible.
10‧‧‧本發明的氣體壓力調整裝置 10‧‧‧ gas pressure adjusting device of the present invention
11‧‧‧主閥(調速器主體) 11‧‧‧Main valve (main governor body)
12‧‧‧上游側輸送管(上游管) 12‧‧‧ upstream side duct (upstream tube)
13‧‧‧下游側輸送管(下游管) 13‧‧‧Downstream conveying pipe (downstream pipe)
14‧‧‧限制器 14‧‧‧Restrictor
16‧‧‧封閉體 16‧‧‧Closed
17‧‧‧套筒 17‧‧‧Sleeve
18‧‧‧閥體 18‧‧‧ valve body
19‧‧‧上游側連接管路 19‧‧‧Upstream side connecting line
20‧‧‧主導引迴路 20‧‧‧Main guiding circuit
21‧‧‧主導引調速器 21‧‧‧Main guide governor
22‧‧‧抽氣用膜片 22‧‧‧Exhaust diaphragm
23‧‧‧可調膜片 23‧‧‧Adjustable diaphragm
30‧‧‧副導引迴路 30‧‧‧Sub-guided loop
31‧‧‧副導引調速器 31‧‧‧Sub-guide governor
50‧‧‧第2實施形態相關之氣體壓力調整裝置 50‧‧‧ gas pressure adjusting device according to the second embodiment
51‧‧‧文氏管 51‧‧‧ venturi tube
53‧‧‧細管部 53‧‧‧Small tube department
P1‧‧‧一次壓 P1‧‧‧One pressure
P2‧‧‧二次壓 P2‧‧‧Secondary pressure
Pc‧‧‧控制壓 Pc‧‧‧Control pressure
Ps‧‧‧基準動作控制壓 Ps‧‧‧ benchmark action control pressure
Pss‧‧‧副導引調速器的動作控制壓 Pss‧‧‧Auxiliary guide governor's action control pressure
Q‧‧‧流量 Q‧‧‧Flow
[圖1]針對本發明相關的氣體壓力調整裝置的一實施形態作繪示的圖。 Fig. 1 is a view showing an embodiment of a gas pressure adjusting device according to the present invention.
[圖2]針對使用本發明相關之氣體壓力調整裝置的主閥(氣體調速器主體)的一例進行繪示的圖。 Fig. 2 is a view showing an example of a main valve (gas governor main body) using the gas pressure adjusting device according to the present invention.
[圖3]示意性就在閉塞狀態下二次壓降低時針對氣體壓力調整裝置的動態響應進行顯示的二次壓的變化作繪示的圖形，(a)係針對無副導引調速器的情況下的二次壓的變化進行繪示的圖形，(b)係針對設置副導引調速器的情況下的二次壓的變化進行繪示的圖形。 [Fig. 3] is a diagram schematically showing changes in the secondary pressure of the gas pressure adjusting device when the secondary pressure is lowered in the occluded state, and (a) is directed to the no-pilot governor. In the case of the change in the secondary pressure, the graph is shown, and (b) is a graph showing the change in the secondary pressure in the case where the sub-guide governor is provided.
[圖4]針對本發明相關的氣體壓力調整裝置的其他實施形態作繪示的圖。 Fig. 4 is a view showing another embodiment of a gas pressure adjusting device according to the present invention.
[圖5]針對第2實施形態及其他實施形態的副導引迴路的往下游管的連接形態進行繪示的示意圖。 Fig. 5 is a schematic view showing a connection form of a sub-ducting circuit to a downstream pipe in the second embodiment and the other embodiments.
[圖6]針對上游管側的一次壓為0.2MPa且流量設為50m3/h的情況下的本發明相關之氣體壓力調整裝置及先前技術的P2-Q動態響應進行繪示的圖。 Fig. 6 is a view showing the gas pressure adjusting device according to the present invention and the P2-Q dynamic response of the prior art in the case where the primary pressure on the upstream pipe side is 0.2 MPa and the flow rate is 50 m 3 /h.
[圖7]針對上游管側的一次壓為0.25MPa且流量設為50m3/h的情況下的本發明相關之氣體壓力調整裝置及先前技術的P2-Q動態響應進行繪示的圖。 Fig. 7 is a view showing the gas pressure adjusting device according to the present invention and the P2-Q dynamic response of the prior art in the case where the primary pressure on the upstream pipe side is 0.25 MPa and the flow rate is 50 m 3 /h.
[圖8]針對上游管側的一次壓為0.3MPa且流量設為50m3/h的情況下的本發明相關之氣體壓力調整裝置及先 前技術的P2-Q動態響應進行繪示的圖。 8 is a diagram showing the gas pressure adjusting device according to the present invention and the P2-Q dynamic response of the prior art in the case where the primary pressure on the upstream pipe side is 0.3 MPa and the flow rate is 50 m 3 /h.
[圖9]針對將流量增至100m3/h時的動態響應進行繪示的圖。 [Fig. 9] A diagram showing a dynamic response when the flow rate is increased to 100 m 3 /h.
[圖10]針對先前技術相關的氣體壓力調整裝置的構成作繪示的示意圖。 Fig. 10 is a schematic view showing the configuration of a gas pressure adjusting device related to the prior art.
[圖11]針對專利文獻1相關的氣體壓力裝置的構成作繪示的圖。 FIG. 11 is a view showing the configuration of a gas pressure device according to Patent Document 1.
以下，參照圖式下說明關於本發明相關之氣體壓力調整裝置10。 Hereinafter, the gas pressure adjusting device 10 according to the present invention will be described with reference to the drawings.
圖1，係針對本發明相關之氣體壓力調整裝置10的構成的一例進行繪示的圖，圖2，係示意性針對主閥(調速器主體)11的一例進行繪示的圖。 Fig. 1 is a view showing an example of a configuration of a gas pressure adjusting device 10 according to the present invention, and Fig. 2 is a view schematically showing an example of a main valve (a governor main body) 11.
在圖1的氣體壓力調整裝置10中，係具有與示於圖10的先前技術同樣的功能的部分係使用相同號碼。 In the gas pressure adjusting device 10 of Fig. 1, the same number as that of the prior art shown in Fig. 10 is used.
此氣體壓力調整裝置10，係具有設置於管路的中途而將以一次壓P1從上游側傳送來的氣體減壓至二次壓P2而流放至下游側的主閥11。 The gas pressure adjusting device 10 has a main valve 11 that is disposed in the middle of the pipeline and that depressurizes the gas that has been transported from the upstream side by the primary pressure P1 to the secondary pressure P2 and flows to the downstream side.
本實施形態中採用為主閥11的軸流型調速器係現在廣為普及。其示意構造係如示於圖2，包含在周面具有多數個狹縫的鼓型的一對的封閉體16、塞住該封閉體16的狹縫的橡膠製的套筒17、將此等收納的圓筒狀的閥體18，在閥體18與套筒17之間的空間施加控制壓Pc，從 而以套筒17使鼓狀的一對的封閉體16的狹縫作開閉。 The axial flow type governor using the main valve 11 in the present embodiment is now widely used. The schematic structure is as shown in Fig. 2, and includes a pair of drum-shaped closing bodies 16 having a plurality of slits on the circumferential surface, and a rubber sleeve 17 that plugs the slits of the closing body 16, and the like. The cylindrical valve body 18 accommodated is subjected to a control pressure Pc in a space between the valve body 18 and the sleeve 17, and On the other hand, the slits of the pair of drum-shaped closing bodies 16 are opened and closed by the sleeve 17.
本發明的氣體壓力調整裝置10，係設有以繞著主閥11的方式連接著上游管12與下游管13的導引迴路。導引迴路，係由主導引迴路20與副導引迴路30所構成。 The gas pressure adjusting device 10 of the present invention is provided with a pilot circuit that connects the upstream pipe 12 and the downstream pipe 13 around the main valve 11. The pilot circuit is composed of a main guiding circuit 20 and a sub-guide circuit 30.
主導引迴路20及副導引迴路30，係皆在連接點C1連接於上游側管路12，於上游管側設有限制器14。藉此限制器14，產生針對主閥11進行動作控制的控制壓Pc。限制器14的輸出側係分為在下游側管路13的連接點C2與下游側管路13連接的主導引迴路20、在連接點C3連接於下游管路13的副導引迴路30的2個路徑。 Both the main guide circuit 20 and the sub-guide circuit 30 are connected to the upstream side pipe 12 at the connection point C1, and the limiter 14 is provided on the upstream pipe side. Thereby, the limiter 14 generates a control pressure Pc for controlling the operation of the main valve 11. The output side of the limiter system 14 into line 13 on the downstream side of the connection point C 2 with the main line 13 connected to the downstream side of the lead circuit 20 is connected to the secondary line downstream of the guide 13 at the connection point C 3 circuit 30 2 paths.
於主導引迴路20，係在限制器14與連接點C2之間，設有主導引調速器21，於副導引迴路30，係在限制器14與連接點C3之間設有副導引調速器31。 The main guiding circuit 20 is disposed between the limiter 14 and the connecting point C2, and is provided with a main guiding governor 21, and the sub-guide circuit 30 is provided with a sub-guide between the limiter 14 and the connecting point C3. Governor 31.
此外，限制器14的輸出，係經由管路40而連接於主閥11，將控制壓Pc供應至主閥11。二次壓P2降低時，副導引調速器31及主導引調速器21動作而控制壓Pc會下降，主閥11係與控制壓Pc的降低成比例地打開。主閥11打開，使得氣體被從上游管12供應至下游管13。 Further, the output of the limiter 14 is connected to the main valve 11 via the line 40, and the control pressure Pc is supplied to the main valve 11. When the secondary pressure P2 is lowered, the sub-guide governor 31 and the main pilot governor 21 are operated to lower the control pressure Pc, and the main valve 11 is opened in proportion to the decrease in the control pressure Pc. The main valve 11 is opened so that gas is supplied from the upstream pipe 12 to the downstream pipe 13.
於主導引調速器21，係被經由主導引線20而供應下游側的二次壓P2。主導引調速器21，係被利用彈簧壓及大氣壓而調整成，二次壓P2成為既定的基準動作控制壓Ps以下時，連接於在內部所設的膜片的閥會打 開。抽氣用膜片22係使朝向大氣壓的開口的大小產生變化的膜片，藉此調整主導引調速器21的響應靈敏度。 The main guide governor 21 is supplied with the secondary pressure P2 on the downstream side via the main lead 20. The main guide governor 21 is adjusted by the spring pressure and the atmospheric pressure. When the secondary pressure P2 is equal to or lower than the predetermined reference operation control pressure Ps, the valve connected to the diaphragm provided inside will be hit. open. The air suction diaphragm 22 adjusts the response sensitivity of the main guide governor 21 by changing the size of the opening toward the atmospheric pressure.
使主導引調速器21的響應性變佳時，主閥11會一口氣打開而二次壓P2會急劇上升，故主導引調速器21的開閉會重複而容易發生晃動。晃動的發生係從穩定控制的觀點而言對氣體壓力調整裝置極不佳，故為了響應性稍變差仍抑制晃動，先調整主導引調速器21的抽氣用膜片22。 When the responsiveness of the main pilot governor 21 is improved, the main valve 11 is opened at a time and the secondary pressure P2 is abruptly increased. Therefore, the opening and closing of the main pilot governor 21 is repeated and the sway is likely to occur. The occurrence of the sway is extremely poor in the gas pressure adjusting device from the viewpoint of the stability control. Therefore, in order to suppress the sway in order to slightly deteriorate the responsiveness, the suction diaphragm 22 of the main guide governor 21 is first adjusted.
副導引調速器31亦具有與主導引調速器21幾乎同樣的構造及功能。然而，副導引調速器31方面係可不具備抽氣用膜片的功能。此外，副導引調速器31，係輔助主導引調速器21的立升響應性者，故可為流量比主導引調速器21小者。例如，副導引調速器31係可為主導引調速器21的1/3程度的流量者。 The sub-guide governor 31 also has almost the same configuration and function as the main pilot governor 21. However, the sub-guide governor 31 does not have the function of a diaphragm for air suction. Further, the sub-guide governor 31 assists the hoist responsiveness of the main guide governor 21, so that the flow rate can be smaller than that of the main pilot governor 21. For example, the sub-guide governor 31 is capable of mainly controlling the flow rate of 1/3 of the governor 21.
副導引調速器31，係被調整成以比主導引調速器的基準動作控制壓Ps高的動作控制壓Pss而動作，響應性亦佳。此外，副導引調速器31係流量小，故控制壓Pc的降低少亦難發生晃動。 The sub-guide governor 31 is adjusted to operate at a higher operating control pressure Pss than the reference pilot control pressure Ps of the main pilot governor, and is also responsive. Further, since the sub-guide governor 31 has a small flow rate, the decrease in the control pressure Pc is less likely to occur.
例如，可將主導引調速器的動作控制壓Ps設定成2.2kPa，將副主導引調速器的動作控制壓Pss設定成2.5kPa前後。 For example, the operation control pressure Ps of the main pilot governor can be set to 2.2 kPa, and the operation control pressure Pss of the sub-main guide governor can be set to 2.5 kPa or so.
依如以上而構成的氣體壓力調整裝置10時，下游側的二次壓力P2下降，成為副導引調速器的動作控制壓Pss以下時，首先副導引調速器31打開，氣體從上 游管12經由副導引迴路30而流放至下游管13。此時，限制器14的下游側管路40的控制壓Pc降低。主閥11的控制壓Pc降低時主閥11打開，氣體被從上游管12供應至下游管13。另外，使用流量大的副導引調速器31的情況等，需要抑制晃動的情況下，係亦可如示於圖1，構成為在副導引迴路30的下游管13側設置可調膜片23。是否設置可調膜片23為任意。 In the gas pressure adjusting device 10 configured as described above, when the secondary pressure P2 on the downstream side is lowered and becomes equal to or less than the operating control pressure Pss of the sub-guide governor, the sub-guide governor 31 is first opened, and the gas is supplied from above. The swim tube 12 is discharged to the downstream pipe 13 via the sub-guide circuit 30. At this time, the control pressure Pc of the downstream side line 40 of the restrictor 14 is lowered. When the control pressure Pc of the main valve 11 is lowered, the main valve 11 is opened, and gas is supplied from the upstream pipe 12 to the downstream pipe 13. Further, when it is necessary to suppress the sway when the sub-guide governor 31 having a large flow rate is used, it is also possible to provide an adjustable film on the downstream pipe 13 side of the sub-guide circuit 30 as shown in FIG. Slice 23. Whether or not the adjustable diaphragm 23 is provided is arbitrary.
副導引調速器31打開後不久，藉抽氣用膜片22抑制了響應性的主導引調速器21的閥會為了抑制晃動而打開。藉此主閥11的控制壓Pc會進一步降低，大量的氣體從主閥11供應至下游側，二次壓P2被調整成既定的設定壓力(基準動作控制壓Ps)。 Shortly after the sub-guide governor 31 is opened, the valve of the main guide governor 21, which suppresses the responsiveness by the suction diaphragm 22, is opened to suppress the sway. Thereby, the control pressure Pc of the main valve 11 is further lowered, a large amount of gas is supplied from the main valve 11 to the downstream side, and the secondary pressure P2 is adjusted to a predetermined set pressure (reference operation control pressure Ps).
利用圖3作說明。圖3係示意性針對從主閥11閉塞的狀態至氣體壓力調整裝置動作的情況下的二次壓力的變動進行繪示的圖形。(a)係繪示藉僅有主導引迴路20而無副導引迴路30構成的氣體壓力調整裝置而進行調整的情況，(b)係繪示藉是本發明的構成的具備主導引迴路20及副導引迴路30的雙方的構成的氣體壓力調整裝置而進行調整的情況。 This will be explained using FIG. 3. Fig. 3 is a view schematically showing a change in secondary pressure from a state in which the main valve 11 is closed to a state in which the gas pressure adjusting device operates. (a) shows a case where the adjustment is performed by a gas pressure adjusting device including only the main guiding circuit 20 and no sub-induction circuit 30, and (b) shows that the main guiding circuit 20 is provided by the configuration of the present invention. The gas pressure adjusting device having the configuration of both of the sub-guide circuits 30 is adjusted.
主閥11閉塞而流量為“0”的狀態下，係由於閉鎖，比基準動作控制壓Ps略高。 When the main valve 11 is closed and the flow rate is "0", the lock is slightly higher than the reference operation control pressure Ps due to the lock.
如從圖3(a)得知，無副導引迴路30的情況下，係為了抑制晃動而縮擠抽氣用膜片22故響應性慢，下游側的使用量多的情況下，係亦可能發生二次壓P2降至“0”的 情況。 As shown in Fig. 3 (a), in the case where the sub-guide circuit 30 is not provided, the squeezing film 22 is squeezed in order to suppress the sway, so that the responsiveness is slow and the amount of use on the downstream side is large. It may happen that the secondary pressure P2 drops to "0" Happening.
相對於此，存在副導引迴路30的情況下，二次壓一降至副導引調速器31的動作控制壓Pss時副導引調速器31即立刻啟動，而主閥11的控制壓Pc下降。藉此，由於主閥11會打開，即使主導引調速器21不立刻響應仍從上游管12供應氣體至下游管13。為此，二次壓P2不會極端下降。另外副導引調速器31開始動作後不久，較晚主導引調速器21亦會啟動，故二次壓P2被立刻調整成既定的設定壓力(動作控制壓Ps)，晃動亦不會發生。 On the other hand, in the case where the sub-guide circuit 30 is present, the sub-guide governor 31 is immediately activated when the secondary pressure is lowered to the operation control pressure Pss of the sub-guide governor 31, and the control of the main valve 11 is started. The pressure Pc drops. Thereby, since the main valve 11 is opened, gas is supplied from the upstream pipe 12 to the downstream pipe 13 even if the main guide governor 21 does not respond immediately. For this reason, the secondary pressure P2 does not fall extremely. In addition, shortly after the start of the sub-guide governor 31, the main guide governor 21 is also activated, so that the secondary pressure P2 is immediately adjusted to a predetermined set pressure (action control pressure Ps), and the sway does not occur. .
如此設置副導引迴路30，使得即使降低主導引調速器21的響應性而抑制晃動，仍可氣體壓力調整裝置整體上使響應性變佳。 By providing the sub-guide circuit 30 in this manner, the gas pressure adjusting device as a whole can improve the responsiveness even if the responsiveness of the main guide governor 21 is lowered to suppress the sway.
此外，於主導引迴路20與副導引迴路30方面，構成為使從主導引調速器21與副導引調速器31往下游管13的連接路徑，分別成為獨立的不同路徑。為此，即使副導引調速器31動作，仍不會對於往主導引迴路20供應的二次壓P2造成影響。 Further, in the main guide circuit 20 and the sub-guide circuit 30, the connection paths from the main guide governor 21 and the sub-guide governor 31 to the downstream pipe 13 are formed as independent independent paths. For this reason, even if the sub-guide governor 31 operates, it does not affect the secondary pressure P2 supplied to the main pilot circuit 20.
因此，主導引調速器21，係可進行因應下游管13的實際的二次壓P2而進行穩定的控制動作。 Therefore, the main guide governor 21 can perform a stable control operation in response to the actual secondary pressure P2 of the downstream pipe 13.
圖4係繪示本發明的第2實施形態，圖5係針對第2實施形態及其他實施形態的副導引迴路30的往下游管13的連接形態進行繪示的示意圖。 Fig. 4 is a view showing a second embodiment of the present invention, and Fig. 5 is a schematic view showing a connection form of the sub-guide circuit 30 to the downstream pipe 13 in the second embodiment and the other embodiments.
第2實施形態中，係將副導引迴路30的往下 游側管路13的連接位置C3’，連接於設置在下游管的文氏管的細管部53。主閥11打開而供應氣體時，氣體流入下游管13，此時文氏管51的細管部53變比二次壓P2低，故緊接著主閥11打開之後的副導引調速器31的響應性變更佳。 In the second embodiment, the connection position C 3 ' of the downstream side line 13 of the sub-guide circuit 30 is connected to the narrow tube portion 53 of the venturi provided in the downstream pipe. When the main valve 11 is opened to supply gas, the gas flows into the downstream pipe 13, and at this time, the narrow pipe portion 53 of the venturi 51 becomes lower than the secondary pressure P2, so that the sub-guide governor 31 immediately after the main valve 11 is opened Responsive changes are good.
此外，在其他實施形態方面，亦可將副導引迴路30的往下游管13的連接位置，設於從主閥往下游管路的入口附近的管路急劇變寬的部分附近C3”。如此構成，使得氣體從主閥11的輸出側的細的管流出至寬的下游管13時的負壓會作用於副導引調速器31的動作控制壓Pss，可使副導引調速器31的響應性變佳。 Further, in another embodiment, the connection position of the sub-guide circuit 30 to the downstream pipe 13 may be provided in the vicinity of a portion where the pipe near the inlet of the main pipe to the downstream pipe is rapidly widened, C 3 "". With this configuration, the negative pressure when the gas flows out from the thin tube on the output side of the main valve 11 to the wide downstream tube 13 acts on the operation control pressure Pss of the sub-guide governor 31, so that the sub-guide speed can be adjusted. The responsiveness of the device 31 is improved.
圖6-圖8係針對藉本發明相關之氣體壓力調整裝置與歷來的壓力調整裝置的壓力調整時的二次壓P2與流量Q的動態響應進行比較下的圖形。 6 to 8 are graphs for comparing the dynamic response of the secondary pressure P2 and the flow rate Q at the time of pressure adjustment by the conventional gas pressure adjusting device according to the present invention.
圖6-圖8的(a)，係針對本發明的構成的氣體壓力調整裝置的P2-Q動態響應的測定結果進行繪示，亦即針對如示於圖1，將主導引迴路20的下游管側連接於從下游管13的二次壓P2穩定之處C2所分歧的整壓管，將副導引迴路30的下游管側連接於與主導引迴路30的連接位置C2係不同的下游管13的出口附近的位置C3的構成(以下，稱作「實施例1」)的氣體壓力調整裝置的P2-Q動態響應的測定結果進行繪示。圖6-圖8的(b)，係針對將圖1的氣體壓力調整裝置的主導引迴路20的下游管側如同實施例1連接於整壓管，並將副導引迴路30的下 游管側連接於是與主導引迴路20相同的位置C2的整壓管的構成(以下，稱作「比較例1」)的P2-Q動態響應的測定結果進行繪示。圖6-圖8的(c)係針對不設置副導引迴路30而僅以主導引迴路控制二次壓P2的調整的構成的氣體壓力調整裝置的P2-Q的動態響應的測定結果進行繪示(以下，稱作「比較例2」)。 6(a) are diagrams showing the measurement results of the P2-Q dynamic response of the gas pressure adjusting device of the configuration of the present invention, that is, for the downstream of the main guiding circuit 20 as shown in Fig. 1. The pipe side is connected to the pressure pipe branched from the secondary pressure P2 of the downstream pipe 13 at a point C 2 , and the downstream pipe side of the auxiliary pilot circuit 30 is connected to the connection position C 2 of the main pilot circuit 30 . The measurement result of the P2-Q dynamic response of the gas pressure adjusting device of the configuration of the position C 3 in the vicinity of the outlet of the downstream pipe 13 (hereinafter referred to as "Example 1") is shown. 6(a) of FIG. 8 are for connecting the downstream pipe side of the main pilot circuit 20 of the gas pressure adjusting device of FIG. 1 to the full pressure pipe as in Embodiment 1, and the downstream pipe side of the sub-guide circuit 30. The measurement results of the P2-Q dynamic response of the configuration of the pressure tube (hereinafter referred to as "Comparative Example 1") at the same position C 2 as the main guide circuit 20 are shown. (c) of FIG. 6 to FIG. 8 is a measurement result of the dynamic response of the P2-Q of the gas pressure adjusting device configured to control the secondary pressure P2 only by the main pilot circuit without providing the sub-guide circuit 30. (hereinafter referred to as "Comparative Example 2").
圖6-圖8，係分別繪示使一次壓P1變化為0.2MPa、0.25MPa、及0.3MPa的情況。此外，圖6-圖8的任一情況皆示出流量Q係流放50m3/h的情況。 6 to 8 show the case where the primary pressure P1 is changed to 0.2 MPa, 0.25 MPa, and 0.3 MPa, respectively. Further, any of the cases of Figs. 6 to 8 shows a case where the flow rate Q is discharged by 50 m 3 /h.
如從圖6-8得知，在本案發明的氣體壓力調整裝置10(實施例1)及比較例1方面，係比起比較例2時任一情況下二次壓P2皆較快穩定。此係設置副導引迴路的效果。 As is apparent from Fig. 6-8, in the gas pressure adjusting device 10 (Example 1) and Comparative Example 1 of the present invention, the secondary pressure P2 is faster and more stable than in the case of Comparative Example 2. This sets the effect of the secondary pilot loop.
此外，如從圖6-圖8的圖形(a)得知，在實施例1方面，係二次壓P2的過渡性的振動平息後係無論一次壓P1如何，二次壓P2維持於穩定的狀態。相對於此，尤其在未設置副導引迴路30的構成(比較例2)的P2-Q動態響應測定結果(c)方面，係調整開始時的過渡性的振動平息後二次壓P2仍上下較大地變動(振動)(圖6-圖8的(c)參照)。 Further, as is apparent from the graph (a) of FIGS. 6 to 8, in the first embodiment, the transitional vibration of the secondary pressure P2 is calmed down, and the secondary pressure P2 is maintained constant regardless of the primary pressure P1. status. On the other hand, in particular, in the P2-Q dynamic response measurement result (c) of the configuration (Comparative Example 2) in which the sub-guide circuit 30 is not provided, the transitional vibration at the start of the adjustment is subsided, and the secondary pressure P2 is still up and down. Large fluctuation (vibration) (refer to (c) of Fig. 6 - Fig. 8).
得知將副導引迴路的下游端連接於主迴路的下游端側的構成(比較例1)的動態響應(圖6-圖8的(b)參照)，係僅管沒有比較例2的構成(圖6-圖8的(c)參照)如此顯著，惟比起本案發明的實施例1的動 態響應(圖6-圖8的(a)參照)，二次壓P2轉移成穩定狀態後的二次壓P2的上下振動較大，相較於實施例1缺乏穩定性。 The dynamic response of the configuration (Comparative Example 1) in which the downstream end of the sub-guide circuit is connected to the downstream end side of the main circuit (see FIG. 6 to FIG. 8(b)) is considered to be the configuration of the second comparative example. (refer to (c) of Fig. 6 - Fig. 8) is so remarkable as to be the motion of the embodiment 1 of the present invention. The state response (refer to (a) of FIG. 6 to FIG. 8) is that the up-and-down vibration of the secondary pressure P2 after the secondary pressure P2 is shifted to the steady state is large, and the stability is inferior to that of the first embodiment.
初始的過渡振動平息後係近可能穩定的情況為理想，如此之上下振動幅度(振幅)，係大約0.1kPa為容許界限值，比較例1的動態響應係極限邊緣的振動值(尤其圖7、圖8的(b)參照)。 It is ideal that the initial transitional vibration subsides and is likely to be stable. The upper vibration amplitude (amplitude) is about 0.1 kPa as the allowable limit value. The dynamic response of Comparative Example 1 is the vibration value of the extreme edge (especially Figure 7, (b) of Fig. 8).
此外，如視看圖7的動態響應即可得知，一次壓P1變高時，在比較例1、2方面，係比起本案發明的實施例的動態響應(a)，緊接著關閉主閥之後的二次壓P2會大幅壓力上升。此二次壓P2的壓力上升雖越小越佳，惟示於圖7的動態響應方面，係得知比起實施例1在比較例1、2存在大2倍程度的壓力上升，二次壓P2穩定所需的時間亦長2倍程度，比起實施例1相當不穩定。 Further, as can be seen from the dynamic response of Fig. 7, when the primary pressure P1 becomes high, in the comparative examples 1 and 2, the dynamic response (a) of the embodiment of the present invention is followed, and the main valve is closed. After that, the secondary pressure P2 will increase the pressure. The pressure rise of the secondary pressure P2 is preferably as small as possible, but in terms of the dynamic response shown in Fig. 7, it is found that the pressure rise is twice as large as that of the comparative examples 1 and 2 in the first embodiment, and the secondary pressure is obtained. The time required for P2 to stabilize is also twice as long as it is quite unstable compared to Example 1.
此現象(動態響應)，在流量少的50m3/h程度下，係並不那麼顯著顯現，流量Q變越多，另外一次壓P1變越高越顯著顯現。作為參考，於圖9繪示將流量增至100m3/h時的動態響應。圖9的(a)-(c)，係繪示將流量Q增至100m3/h，將一次壓P1分別增為0.2MPa、0.25MPa、0.3MPa的情況下的動態響應。圖9的(a)-(c)係比較下任一者皆於左側顯現本案發明的實施例1的構成的動態響應，於右側顯現比較例1的動態響應。另外，在圖9，係未繪示關於比較例2，將主閥11關閉時，比較例2亦二次壓P2如同比較例1或比其以上急 劇壓力上升。 This phenomenon (dynamic response) is not so noticeable at a low flow rate of 50 m 3 /h, and the flow rate Q becomes more and more, and the other pressure P1 becomes higher and more pronounced. For reference, the dynamic response when the flow rate is increased to 100 m 3 /h is shown in FIG. (a)-(c) of FIG. 9 shows the dynamic response when the flow rate Q is increased to 100 m 3 /h and the primary pressure P1 is increased to 0.2 MPa, 0.25 MPa, and 0.3 MPa, respectively. In (a) to (c) of Fig. 9, the dynamic response of the configuration of the first embodiment of the present invention is shown on the left side, and the dynamic response of the comparative example 1 is shown on the right side. In addition, in FIG. 9, the comparative example 2 is not shown, and when the main valve 11 is closed, the comparative example 2 also has the secondary pressure P2 as compared with the comparative example 1 or the above-mentioned rapid pressure rise.
如從圖9得知，將流量Q增至100m3/h時，一次壓P1為0.2MPa、0.25MPa、0.3MPa時的任一者皆緊接著主閥11關閉之後的二次壓P2，與本案發明的實施例1比較下存在2倍以上大的壓力上升。2次壓P2穩定所需的時間亦與其成比例而需要約2倍程度的時間。 As is apparent from Fig. 9, when the flow rate Q is increased to 100 m 3 /h, the primary pressure P1 is 0.2 MPa, 0.25 MPa, and 0.3 MPa, and the secondary pressure P2 immediately after the main valve 11 is closed, and In the first embodiment of the present invention, there is a pressure increase of 2 times or more. The time required for the stabilization of the secondary pressure P2 is also proportional to it and takes about twice as long.
另外，在將比較例1的副導引迴路30的下游管側連接於主導引迴路20的構成方面，係偶爾主閥11未打開的狀態下，仍有時二次壓會時常變動。此現象顯著顯示於圖7的(b)。此係顯示主閥11幾乎閉塞狀態下稍使1m3/h程度的少量的氣體從上游管12流放至下游管13時，引起二次壓P2晃動而未穩定的現象。如此之晃動現象，係藉本發明的構成，亦即藉使副導引迴路30的下游管路與主導引迴路20的下游管路為獨立的不同路徑，使得完全消失(圖6-圖8的(a)及圖9參照)。 Further, in the configuration in which the downstream pipe side of the sub-guide circuit 30 of Comparative Example 1 is connected to the main pilot circuit 20, even when the main valve 11 is not opened, the secondary pressure may fluctuate from time to time. This phenomenon is remarkably shown in (b) of Fig. 7 . This shows that when a small amount of gas of about 1 m 3 /h is slightly discharged from the upstream pipe 12 to the downstream pipe 13 in the state where the main valve 11 is almost closed, the secondary pressure P2 is shaken and is not stabilized. Such a sloshing phenomenon is completely eliminated by the configuration of the present invention, that is, by the downstream path of the secondary guiding circuit 30 and the downstream piping of the main guiding circuit 20, so that it completely disappears (Fig. 6-8). (a) and Figure 9 refer to).
如從以上得知，依本發明時，得知可提供一種氣體壓力調整裝置，使主導引迴路20與副導引迴路30的下游管側的連接為分別不同的位置C2、C3，而使各迴路20、30為分別獨立的不同的路徑，使得響應性佳，晃動少且穩定將二次壓P2維持於一定值。 As can be seen from the above, according to the present invention, it is known that a gas pressure adjusting device can be provided such that the connections of the main guide circuit 20 and the downstream pipe side of the sub-guide circuit 30 are respectively different positions C 2 , C 3 , and The respective circuits 20 and 30 are independent and different paths, so that the responsiveness is good, the sway is small, and the secondary pressure P2 is stably maintained at a constant value.
此外，於下游管設置文氏管51，而使副導引迴路30的下游管側連接於文氏管51的細管部，使得可使主閥11閥開時的響應性進一步提升。 Further, the venturi 51 is disposed in the downstream pipe, and the downstream pipe side of the sub-guide circuit 30 is connected to the narrow pipe portion of the venturi 51, so that the responsiveness when the main valve 11 is opened can be further improved.
再者，亦可藉將副導引迴路30的下游管側， 連接於下游管的主閥11的輸出附近，而使主閥11閥開時的響應性提升。 Furthermore, the downstream side of the secondary guiding circuit 30 can also be borrowed. It is connected to the vicinity of the output of the main valve 11 of the downstream pipe, and the responsiveness when the main valve 11 is opened is increased.
10‧‧‧本發明的氣體壓力調整裝置 10‧‧‧ gas pressure adjusting device of the present invention
11‧‧‧主閥(調速器主體) 11‧‧‧Main valve (main governor body)
12‧‧‧上游側輸送管(上游管) 12‧‧‧ upstream side duct (upstream tube)
13‧‧‧下游側輸送管(下游管) 13‧‧‧Downstream conveying pipe (downstream pipe)
14‧‧‧限制器 14‧‧‧Restrictor
19‧‧‧上游側連接管路 19‧‧‧Upstream side connecting line
20‧‧‧主導引迴路 20‧‧‧Main guiding circuit
21‧‧‧主導引調速器 21‧‧‧Main guide governor
22‧‧‧抽氣用膜片 22‧‧‧Exhaust diaphragm
23‧‧‧可調膜片 23‧‧‧Adjustable diaphragm
30‧‧‧副導引迴路 30‧‧‧Sub-guided loop
31‧‧‧副導引調速器 31‧‧‧Sub-guide governor
40‧‧‧管路 40‧‧‧pipe
Pc‧‧‧控制壓 Pc‧‧‧Control pressure
P1‧‧‧一次壓 P1‧‧‧One pressure
P2‧‧‧二次壓 P2‧‧‧Secondary pressure
C1、C2、C3‧‧‧連接點 C 1 , C 2 , C 3 ‧‧‧ connection points
Claims (3)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2014-223153 | 2014-10-31 | ||
| JP2014223153A JP6335757B2 (en) | 2014-10-31 | 2014-10-31 | Gas pressure regulator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201624164A true TW201624164A (en) | 2016-07-01 |
| TWI652561B TWI652561B (en) | 2019-03-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104135428A TWI652561B (en) | 2014-10-31 | 2015-10-28 | Gas pressure adjustment device |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JP6335757B2 (en) |
| CN (1) | CN107003683B (en) |
| MY (1) | MY179014A (en) |
| RU (1) | RU2659348C1 (en) |
| SG (1) | SG11201702870QA (en) |
| TW (1) | TWI652561B (en) |
| WO (1) | WO2016067991A1 (en) |
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| RU2766837C1 (en) * | 2021-06-25 | 2022-03-16 | Роман Анатольевич Реймер | Gas pressure regulator |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722242Y2 (en) * | 1976-12-02 | 1982-05-14 | ||
| JP3237925B2 (en) * | 1992-10-27 | 2001-12-10 | 大阪瓦斯株式会社 | Pressure control device and its pressure setting method |
| JPH08171425A (en) * | 1994-12-19 | 1996-07-02 | Tokico Ltd | Pressure controller |
| CN1163804C (en) * | 1997-02-06 | 2004-08-25 | Smc株式会社 | Pneumatic pressure regulator |
| JPH11212656A (en) * | 1998-01-30 | 1999-08-06 | Osaka Gas Co Ltd | Pressure governing mechanism |
| JP4488945B2 (en) * | 2005-03-31 | 2010-06-23 | 大阪瓦斯株式会社 | Pressure regulator |
| JP4454533B2 (en) * | 2005-05-16 | 2010-04-21 | 東京瓦斯株式会社 | Pressure regulator |
| JP5319056B2 (en) * | 2006-08-01 | 2013-10-16 | トヨタ自動車株式会社 | Fuel cell system |
| ATE542994T1 (en) * | 2008-08-29 | 2012-02-15 | Delphi Tech Holding Sarl | IMPROVED FUEL PRESSURE REGULATION SYSTEM AND IMPROVED FUEL PRESSURE REGULATOR FOR USE THEREIN |
| JP5616748B2 (en) * | 2010-10-29 | 2014-10-29 | Ｉ・Ｔ・Ｏ株式会社 | Pressure regulator |
| JP5547608B2 (en) * | 2010-11-04 | 2014-07-16 | 東京瓦斯株式会社 | Pressure regulator |
-
2014
- 2014-10-31 JP JP2014223153A patent/JP6335757B2/en active Active
-
2015
- 2015-10-21 CN CN201580058344.0A patent/CN107003683B/en active Active
- 2015-10-21 RU RU2017118398A patent/RU2659348C1/en active
- 2015-10-21 SG SG11201702870QA patent/SG11201702870QA/en unknown
- 2015-10-21 WO PCT/JP2015/079676 patent/WO2016067991A1/en active Application Filing
- 2015-10-21 MY MYPI2017000586A patent/MY179014A/en unknown
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| Publication number | Publication date |
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| TWI652561B (en) | 2019-03-01 |
| JP6335757B2 (en) | 2018-05-30 |
| JP2016091199A (en) | 2016-05-23 |
| CN107003683A (en) | 2017-08-01 |
| CN107003683B (en) | 2020-03-20 |
| RU2659348C1 (en) | 2018-06-29 |
| MY179014A (en) | 2020-10-26 |
| WO2016067991A1 (en) | 2016-05-06 |
| SG11201702870QA (en) | 2017-05-30 |
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