TW201623903A - High-efficiency heat exchanger with staggered flow channels under nano fluid cooling - Google Patents
High-efficiency heat exchanger with staggered flow channels under nano fluid cooling Download PDFInfo
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本發明係屬一種熱交換器之技術領域，尤指一種奈米流體冷卻下具交錯流道之高效率熱交換器，可達到最佳熱交換之目的。 The invention belongs to the technical field of a heat exchanger, in particular to a high-efficiency heat exchanger with a staggered flow channel under the cooling of a nano-fluid, which can achieve the purpose of optimal heat exchange.
隨著CPU消耗功率不斷升高、晶圓尺寸微縮化等影響，使得晶方平均發熱量增高，2003年平均發熱量約50W/cm2，但電子資訊產品持續朝向輕薄、短小、多功能的趨勢演進，2011年已達250W/cm2，甚至有預測指出，如果晶片中的電晶體數量以現今的速率增長，到2015年其工作溫度可趨近於太陽表面，因此，對於CPU散熱的要求將會越來越嚴格。此外，隨著LED發光效率不斷提昇及價格快速下降，有預測分析指出，預估2015年全球LED照明市場產值將達170.69億美元，高亮度LED的應用範圍更擴及數位相機、照相手機，及中、小尺寸顯示器背光源等，但是LED的發光效率及壽命會隨著晶片接合點溫度的升高而快速驟減，因此，高功率LED面臨的散熱問題仍是重要而須克服的議題，最經濟有效的LED散熱方案將是主宰產品價值的重要關鍵之一。 With the increase in CPU power consumption and wafer size miniaturization, the average heat generation of the crystal side is increased. In 2003, the average heat generation was about 50 W/cm 2 , but the electronic information products continued to be light, thin, and multi-functional. Evolution, in 2011, has reached 250W/cm 2 , and even predictions indicate that if the number of transistors in the wafer grows at the current rate, its operating temperature can approach the surface of the sun by 2015, so the requirements for CPU heat dissipation will Will be more and more strict. In addition, with the continuous improvement of LED luminous efficiency and rapid price decline, there are prediction analysis that it is estimated that the global LED lighting market will reach US$17.069 billion in 2015, and the application range of high-brightness LEDs will be extended to digital cameras and camera phones. Medium and small size display backlights, etc., but the LED's luminous efficiency and lifetime will rapidly decrease as the junction temperature of the wafer increases. Therefore, the heat dissipation problem faced by high-power LEDs is still an important issue to be overcome. A cost-effective LED cooling solution will be one of the key factors that dominate the value of the product.
是以，針對上述習知結構所存在之問題點，如何開發一種更具理想實用性之創新結構，實是消費者所殷切企盼，亦係相關業者須努力研發突破之目標及方向。有鑑於此，發明人本於多年從事相關產品之製造開發與設計經驗，針對上述之目標，詳加設計與審慎評估後，終得一確具 實用性之本發明。 Therefore, in view of the problems existing in the above-mentioned conventional structure, how to develop an innovative structure with more ideal and practicality is really eagerly awaited by consumers, and it is also the goal and direction of relevant industry players to make efforts to develop breakthroughs. In view of this, the inventor has been engaged in the manufacturing development and design experience of related products for many years. After detailed design and careful evaluation, the inventors have finally achieved The invention of the utility.
為了達到上述之目的，係提供一種奈米流體冷卻下具交錯流道之高效率熱交換器，係包括：一下基板，該下基板設有排列成陣列之數第一凸出物；一上基板，該上基板設有排列成陣列之數第二凸出物，該上基板與該下基板相對嵌合，各該第一凸出物及各該第二凸出物係成交錯排列，形成交錯微流道；一側蓋，該側蓋係包圍該上基板及該下基板周圍，該側蓋、該上基板及該下基板形成一封閉空間，一進水口及一出水口係連通該封閉空間；該封閉空間鄰近於該進水口及該出水口處且於各該第一凸出物及各該第二凸出物之間的空隙內各設有一散熱發泡元件；一流體係由該進水口流入該封閉空間內，並由該出水口流出該封閉空間；其中，該流體內可加入奈米金屬粒子改變該流體的熱傳導係數，例如將三氧化二鋁金屬粉末溶入水中形成金屬粉末奈米流體，而金屬粉末奈米流體具有較高的等效熱傳導能力，可增強整體熱傳導能力；而金屬粉末奈米流體長期使用下，可能會產成粒子沈積，此粒子沈積將逐次增大熱阻，不利整體熱傳，在這種情形下，可另外加裝超音波震盪裝置與擾流裝置防止此現象發生。 In order to achieve the above object, a high-efficiency heat exchanger having a staggered flow path under cooling of a nanofluid is provided, comprising: a lower substrate provided with a first protrusion arranged in an array; and an upper substrate The upper substrate is provided with a plurality of second protrusions arranged in an array, the upper substrate is oppositely fitted to the lower substrate, and each of the first protrusions and each of the second protrusions are staggered to form an interlaced manner. a side cover that surrounds the upper substrate and the periphery of the lower substrate, the side cover, the upper substrate and the lower substrate form a closed space, and a water inlet and a water outlet communicate with the closed space a closed space is disposed adjacent to the water inlet and the water outlet, and each of the first protrusions and each of the second protrusions is provided with a heat dissipating foaming element; the first-class system is connected to the water inlet Flowing into the closed space, and flowing out of the closed space by the water outlet; wherein the liquid metal may be added to the fluid to change the heat transfer coefficient of the fluid, for example, the aluminum oxide metal powder is dissolved in water to form a metal powder nanometer. Fluid, and The powdered nano-fluid has higher equivalent heat conduction capacity and can enhance the overall heat conduction capacity; while the metal powder nano-fluid can produce particle deposition under long-term use, the particle deposition will increase the thermal resistance one by one, which is unfavorable to the overall heat. In this case, an ultrasonic oscillating device and a turbulence device can be additionally installed to prevent this phenomenon from occurring.
其中，各該第一凸出物及各該第二凸出物可為圓形或方形的柱狀體或條狀體； 其中，該散熱發泡元件為一具有多個開放式發泡孔隙之高穿透率發泡鋁結構所構成；其中，該進水口及該出水口係設置於該上基板上；其中，該下基板及該上基板為圓形、橢圓形、長方形或多邊形，例如三角形、方形、五邊形、六邊形、七邊形、八邊形等之形式；其中，該下基板、該上基板及該側蓋為鋁合金基材，係為冷鍛擠壓方式一體成型，並於外表面進行陽極表面處理；藉由以上構造，當該流體由該進水口流入該封閉空間內時，高穿透率之該散熱發泡元件可增強熱傳導並協助整流，使該流體得以均勻流入由各該第一凸出物及各該第二凸出物所形成規則交錯之流道，使得單位體積內的熱交換面積大幅增加，經過交錯之流道時被不斷的強迫分流與合流，即形成擾流現象，再透過鋁合金的各該第一凸出物及各該第二凸出物的高效熱傳能力，可達到最佳熱交換之目的。另外再加上而金屬粉末的奈米流體有較高的等效熱傳導能力，可增強熱交換器的散熱效果。 Wherein each of the first protrusions and each of the second protrusions may be a circular or square columnar body or a strip body; Wherein, the heat dissipating foaming member is formed by a high-throughput foamed aluminum structure having a plurality of open foaming pores; wherein the water inlet and the water outlet are disposed on the upper substrate; wherein, the lower portion The substrate and the upper substrate are in the form of a circle, an ellipse, a rectangle or a polygon, such as a triangle, a square, a pentagon, a hexagon, a heptagon, an octagon, etc., wherein the lower substrate, the upper substrate, and The side cover is an aluminum alloy substrate integrally formed by cold forging and extrusion, and is subjected to an anode surface treatment on the outer surface; by the above configuration, when the fluid flows into the closed space from the water inlet, the penetration is high. The heat dissipating foaming element can enhance heat conduction and assist in rectification, so that the fluid can uniformly flow into the regularly staggered flow path formed by each of the first protrusions and the second protrusions, so that the heat in a unit volume The exchange area is greatly increased. When the staggered flow channels are continuously forced to split and merge, the spoiler phenomenon is formed, and then the first protrusions of the aluminum alloy and the efficient heat transfer capability of each of the second protrusions are transmitted. Can reach the most The purpose of heat exchange. In addition, the nano-fluid of the metal powder has a higher equivalent heat transfer capability, which can enhance the heat dissipation effect of the heat exchanger.
本發明可應用於一發熱源，如電子裝備、CPU與高功率LED燈，且本發明可連接一散熱排、一水箱及一馬達而產生一循環迴路，幫助該發熱源達到散熱的目的，另外本發明也可應用於太陽能集熱裝置與廢熱能熱電轉換系統的集熱器、或熱水器或開飲機之加熱用途。 The invention can be applied to a heat source, such as an electronic equipment, a CPU and a high-power LED lamp, and the invention can connect a heat dissipation row, a water tank and a motor to generate a circulation loop to help the heat source achieve the purpose of heat dissipation, and The invention can also be applied to the heat collector of the solar heat collecting device and the waste heat energy thermoelectric conversion system, or the heating use of the water heater or the brewing machine.
有關本發明所採用之技術、手段及其功效，茲舉數較佳實施例並配合圖式詳細說明於後，相信本發明上述之目的、構造及特徵，當可由之得一深入而具體的瞭解。 The above-mentioned objects, structures and features of the present invention will be described in detail with reference to the preferred embodiments of the present invention. .
10‧‧‧下基板 10‧‧‧lower substrate
11‧‧‧第一凸出物 11‧‧‧First projection
20‧‧‧上基板 20‧‧‧Upper substrate
21‧‧‧第二凸出物 21‧‧‧Second projection
30‧‧‧側蓋 30‧‧‧ side cover
31‧‧‧封閉空間 31‧‧‧Enclosed space
32‧‧‧進水口 32‧‧‧ Inlet
33‧‧‧出水口 33‧‧‧Water outlet
34‧‧‧散熱發泡元件 34‧‧‧Dissipating foaming components
40‧‧‧流體 40‧‧‧ fluid
50‧‧‧發熱源 50‧‧‧heat source
60‧‧‧散熱排 60‧‧‧ heat sink
70‧‧‧水箱 70‧‧‧ water tank
80‧‧‧馬達 80‧‧‧ motor
第1圖係本發明之使用狀態示意圖。 Fig. 1 is a schematic view showing the state of use of the present invention.
第2圖係本發明之立體分解示意圖。 Figure 2 is a perspective exploded view of the present invention.
第3圖係本發明之立體組合示意圖。 Figure 3 is a schematic perspective view of the present invention.
第4圖係本發明第3圖之剖面示意圖。 Figure 4 is a schematic cross-sectional view of Fig. 3 of the present invention.
第5圖係本發明第二實施例之示意圖。 Figure 5 is a schematic view of a second embodiment of the present invention.
第6圖係本發明第三實施例之示意圖。 Figure 6 is a schematic view of a third embodiment of the present invention.
首先，如第1圖至第6圖所示，係本發明之較佳實施例，惟此等實施例僅供說明之用，在專利申請上並不受此結構之限制。 First, the preferred embodiments of the present invention are shown in Figures 1 through 6, but the embodiments are for illustrative purposes only and are not limited by the structure.
所述一種奈米流體冷卻下具交錯流道之高效率熱交換器，如第2~4圖所示，係包括：一下基板10，該下基板10設有排列成陣列之數第一凸出物11；一上基板20，該上基板20設有排列成陣列之數第二凸出物21，該上基板20與該下基板10相對嵌合，各該第一凸出物11及各該第二凸出物21係成交錯排列，形成交錯微流道；一側蓋30，該側蓋30係包圍該上基板20及該下基板10周圍，該側蓋30、該上基板20及該下基板10形成一封閉空間31，一進水口32及一出水口33係連通該封閉空間31；該封閉空間31鄰近於該進水口32及該出水口33處且於各該第一凸出物11及各該第二凸出物21之間的空隙內各設有一散熱發泡元件34； 一流體40係由該進水口32流入該封閉空間31內，並由該出水口33流出該封閉空間31；其中，該流體40內可加入奈米金屬粒子改變該流體40的熱傳導係數，例如將三氧化二鋁金屬粉末溶入水中形成金屬粉末奈米流體，而金屬粉末奈米流體具有較高的等效熱傳導能力，可增強整體熱傳導能力；而金屬粉末奈米流體長期使用下，可能會產成粒子沈積，此粒子沈積將逐次增大熱阻，不利整體熱傳，在這種情形下，可另外加裝超音波震盪裝置與擾流裝置防止此現象發生。 The high-efficiency heat exchanger having a staggered flow path cooled by the nano fluid, as shown in FIGS. 2 to 4, includes a lower substrate 10, and the lower substrate 10 is provided with a first protrusion arranged in an array. The upper substrate 20 is provided with a plurality of second protrusions 21 arranged in an array, and the upper substrate 20 is oppositely fitted to the lower substrate 10, and each of the first protrusions 11 and each of the first protrusions 11 The second protrusions 21 are arranged in a staggered manner to form an interlaced micro flow channel; a side cover 30 surrounding the upper substrate 20 and the lower substrate 10, the side cover 30, the upper substrate 20 and the side The lower substrate 10 forms a closed space 31. A water inlet 32 and a water outlet 33 communicate with the closed space 31. The closed space 31 is adjacent to the water inlet 32 and the water outlet 33 and is located at each of the first protrusions. 11 and each of the second protrusions 21 are provided with a heat dissipation foaming element 34; A fluid 40 flows into the enclosed space 31 from the water inlet 32, and flows out of the closed space 31 from the water outlet 33; wherein the metal 40 can be added to the fluid 40 to change the heat transfer coefficient of the fluid 40, for example, The aluminum oxide metal powder is dissolved in water to form a metal powder nano fluid, and the metal powder nano fluid has a higher equivalent heat conduction capability, which can enhance the overall heat conduction capability; while the metal powder nano fluid is used for a long time, it may be produced. In the case of particle deposition, this particle deposition will increase the thermal resistance one by one, which is disadvantageous to the overall heat transfer. In this case, an ultrasonic oscillating device and a spoiler device may be additionally installed to prevent this phenomenon from occurring.
其中，如第5~6圖所示，各該第一凸出物11及各該第二凸出物21可為圓形或方形的柱狀體或條狀體；其中，該散熱發泡元件34為一具有多個開放式發泡孔隙之高穿透率發泡鋁結構所構成；其中，該進水口32及該出水口33係設置於該上基板20上；其中，該下基板10及該上基板20為圓形、橢圓形、長方形或多邊形，例如三角形、方形、五邊形、六邊形、七邊形、八邊形等之形式；其中，該下基板10、該上基板20及該側蓋30為鋁合金基材，係為冷鍛擠壓方式一體成型，並於外表面進行陽極表面處理；藉由以上構造，如第4~5圖所示，當該流體40由該進水口32流入該封閉空間31內時，高穿透率之該散熱發泡元件34可增強熱傳導並協助整流，使該流體40得以均勻流入由各該第一凸出物11及各該第二凸出物21所形成規則交錯之流道，使得單位體積內的熱交換面積大幅增加，經過交錯之流道時被不斷的強迫分流與合流，即形成擾流現象，再透過鋁合金的 各該第一凸出物11及各該第二凸出物21的高效熱傳能力，可達到最佳熱交換之目的。另外再加上而金屬粉末的奈米流體有較高的等效熱傳導能力，可增強熱交換器的散熱效果。 Wherein, as shown in the fifth to sixth figures, each of the first protrusions 11 and each of the second protrusions 21 may be a circular or square columnar body or a strip-shaped body; wherein the heat-dissipating foaming element 34 is a high-throughput foamed aluminum structure having a plurality of open foaming pores; wherein the water inlet 32 and the water outlet 33 are disposed on the upper substrate 20; wherein the lower substrate 10 and The upper substrate 20 is in the form of a circle, an ellipse, a rectangle or a polygon, such as a triangle, a square, a pentagon, a hexagon, a heptagon, an octagon, etc., wherein the lower substrate 10 and the upper substrate 20 And the side cover 30 is an aluminum alloy substrate integrally formed by cold forging and extrusion, and is subjected to an anode surface treatment on the outer surface; by the above configuration, as shown in FIGS. 4 to 5, when the fluid 40 is used When the water inlet 32 flows into the closed space 31, the high-throughput heat-dissipating foaming member 34 can enhance heat conduction and assist in rectification, so that the fluid 40 can uniformly flow into the first protrusions 11 and the second portions. The regular intersecting flow paths formed by the protrusions 21 greatly increase the heat exchange area per unit volume. We are constantly forced to split and merge wrong road when his ilk, that is, the formation of turbulence phenomena, and then through the aluminum alloy The efficient heat transfer capability of each of the first protrusions 11 and the second protrusions 21 can achieve the purpose of optimal heat exchange. In addition, the nano-fluid of the metal powder has a higher equivalent heat transfer capability, which can enhance the heat dissipation effect of the heat exchanger.
而如第1圖所示，本發明可應用於一發熱源50，如電子裝備、CPU與高功率LED燈，且本發明可連接一散熱排60、一水箱70及一馬達80而產生一循環迴路，幫助該發熱源50達到散熱的目的，另外本發明也可應用於太陽能集熱裝置與廢熱能熱電轉換系統的集熱器、或熱水器或開飲機之加熱用途。 As shown in FIG. 1, the present invention can be applied to a heat source 50, such as an electronic device, a CPU, and a high-power LED lamp, and the present invention can connect a heat sink 60, a water tank 70, and a motor 80 to generate a cycle. The circuit helps the heat source 50 to achieve heat dissipation, and the invention can also be applied to the heat collector of the solar heat collecting device and the waste heat energy thermoelectric conversion system, or the heating use of the water heater or the brewing machine.
綜上所述，本發明確實已達突破性之結構設計，而具有改良之創作內容，同時又能夠達到產業上之利用性與進步性，且本發明未見於任何刊物，亦具新穎性，當符合專利法相關法條之規定，爰依法提出發明專利申請，懇請 鈞局審查委員授予合法專利權，至為感禱。 In summary, the present invention has indeed achieved a breakthrough structural design, and has improved creation content, and at the same time, can achieve industrial utilization and progress, and the present invention is not found in any publication, but also novel, when In accordance with the provisions of the relevant laws and regulations of the Patent Law, the application for invention patents is filed according to law, and the examination authority of the bureau is required to grant legal patent rights.
惟以上所述者，僅為本發明之一較佳實施例而已，當不能以之限定本發明實施之範圍；即大凡依本發明申請專利範圍所作之均等變化與修飾，皆應仍屬本發明專利涵蓋之範圍內。 However, the above description is only a preferred embodiment of the present invention, and the scope of the present invention is not limited thereto; that is, the equivalent variation and modification of the scope of the patent application of the present invention should still belong to the present invention. Within the scope of the patent.
10‧‧‧下基板 10‧‧‧lower substrate
11‧‧‧第一凸出物 11‧‧‧First projection
20‧‧‧上基板 20‧‧‧Upper substrate
21‧‧‧第二凸出物 21‧‧‧Second projection
30‧‧‧側蓋 30‧‧‧ side cover
32‧‧‧進水口 32‧‧‧ Inlet
33‧‧‧出水口 33‧‧‧Water outlet
34‧‧‧散熱發泡元件 34‧‧‧Dissipating foaming elements
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| TWI822020B (en) * | 2021-05-28 | 2023-11-11 | 大陸商中微半導體設備（上海）股份有限公司 | Temperature control components, temperature control devices and reaction chamber temperature control methods |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| US6988534B2 (en) * | 2002-11-01 | 2006-01-24 | Cooligy, Inc. | Method and apparatus for flexible fluid delivery for cooling desired hot spots in a heat producing device |
| US20090145581A1 (en) * | 2007-12-11 | 2009-06-11 | Paul Hoffman | Non-linear fin heat sink |
| TWI394200B (en) * | 2008-06-04 | 2013-04-21 | Tokyo Electron Ltd | Method and system for introducing process fluid through a chamber component |
| TWI437202B (en) * | 2010-07-30 | 2014-05-11 | Univ Chienkuo Technology | Array type porous media heat sink |
| CN203590074U (en) * | 2013-10-29 | 2014-05-07 | 浙江大学 | Micro-boss array type heat exchange module of thermoelectric generator |
| CN203758341U (en) * | 2014-01-16 | 2014-08-06 | 深圳市丰瑞德机电技术有限公司 | Heat exchanging plate, heat exchanger and heat exchanging system |
-
2014
- 2014-12-30 TW TW103146217A patent/TWI557392B/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI822020B (en) * | 2021-05-28 | 2023-11-11 | 大陸商中微半導體設備（上海）股份有限公司 | Temperature control components, temperature control devices and reaction chamber temperature control methods |
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| TWI557392B (en) | 2016-11-11 |
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