TW201622281A - Surface mounted device type laser module - Google Patents
Surface mounted device type laser module Download PDFInfo
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- TW201622281A TW201622281A TW104135816A TW104135816A TW201622281A TW 201622281 A TW201622281 A TW 201622281A TW 104135816 A TW104135816 A TW 104135816A TW 104135816 A TW104135816 A TW 104135816A TW 201622281 A TW201622281 A TW 201622281A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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Abstract
Description
本發明係關於一種雷射模組，尤其關於一種表面固定元件型式的雷射模組。 The present invention relates to a laser module, and more particularly to a laser module of the surface fixing component type.
請參閱圖1，其為習知雷射模組的部分結構透視示意圖。習知雷射模組1係採用同軸封裝(TO CAN)的型式，包括遮罩11、基座12、雷射二極體13、光感二極體14、散熱件15、第一焊腳16以及第二焊腳17，且散熱件15以及光感二極體14固設於基座12上，而雷射二極體13則設置在散熱件15上；其中，雷射二極體13以及光感二極體14分別透過電線18、19而連接於第一焊腳16以及第二焊腳17，且第一焊腳16以及第二焊腳17分別向下穿過基座12並凸出於外，其用來穿過一外部的電路板(圖未示)的穿孔以進而被焊接在電路板上，如此一來，雷射模組1與電路板之間就可進行電子訊號的傳遞。 Please refer to FIG. 1 , which is a perspective view showing a partial structure of a conventional laser module. The conventional laser module 1 adopts a coaxial package (TO CAN) type, including a mask 11, a susceptor 12, a laser diode 13, a photodiode 14, a heat sink 15, and a first solder fillet 16. And the second soldering leg 17, and the heat sink 15 and the photodiode 14 are fixed on the base 12, and the laser diode 13 is disposed on the heat sink 15; wherein the laser diode 13 and The photodiode 14 is connected to the first solder fillet 16 and the second solder fillet 17 through the wires 18 and 19, respectively, and the first solder fillet 16 and the second solder fillet 17 respectively pass down through the base 12 and protrude. In addition, it is used to pass through the perforation of an external circuit board (not shown) to be soldered on the circuit board, so that the electronic signal can be transmitted between the laser module 1 and the circuit board. .
再者，遮罩11設置於基座12上，用來包罩雷射二極體13、光感二極體14以及散熱件15，且遮罩11具有一開口111，並供一準直透鏡安置其上；當雷射二極體13經由第一焊腳16而接收電力時可提供雷射光束L1，且大部分的雷射光束L11會往遮罩11的開口111方向行進，並於經由準直透鏡10後向外輸出， 而少部份的雷射光束L12則往光感二極體14的方向投射，以供光感二極體14進行光偵測；其中，光感二極體14於偵測的過程中會產生偵測訊號，並使該些偵測訊號經由第二焊腳17傳輸至電路板，供後續相關的控制程序使用。 Furthermore, the mask 11 is disposed on the base 12 for covering the laser diode 13, the light-sensitive diode 14 and the heat sink 15, and the mask 11 has an opening 111 and a collimating lens. Placed thereon; when the laser diode 13 receives power via the first solder fillet 16, a laser beam L1 can be provided, and most of the laser beam L11 will travel toward the opening 111 of the mask 11 and The collimator lens 10 is output to the outside, A small portion of the laser beam L12 is projected toward the photodiode 14 for light detection by the photodiode 14; wherein the photodiode 14 is generated during the detection process. The signals are detected and transmitted to the circuit board via the second solder pins 17 for subsequent control programs.
特別說明的是，以往為了將雷射模組1焊接在電路板，雷射模組1上需額外設置用來穿過電路板第一焊腳16與第二焊腳17；然而，這類焊腳有其最小尺寸的限制，否則焊腳就容易因外力而被折斷，但如此封裝方式導致雷射模組1無法有效的微小化，更遑論將其應用於手持裝置、穿戴式裝置等輕、薄、短小之設計的電子設備上。 In particular, in the past, in order to solder the laser module 1 to the circuit board, the laser module 1 is additionally provided for passing through the first solder fillet 16 and the second solder fillet 17 of the circuit board; however, this type of soldering The foot has a limitation of its minimum size, otherwise the soldering foot is easily broken by external force, but the package method causes the laser module 1 to be ineffectively miniaturized, let alone apply it to a handheld device, a wearable device, etc. Thin, short design on electronic devices.
再者，習知的雷射模組1在整合光學元件(如準直透鏡10)時因其本身結構的限制往往造成所佔空間過大，亦是無法達成小型化需求的原因之一。另，習知的雷射模組1大都是以單一發光源為主，因而無法滿足現今電子設備所需的多光源或多波長的需求，進而侷限了手持裝置、穿戴式裝置等電子設備的快速發展；根據以上的說明，習知的雷射模組1仍有待改善。 Moreover, the conventional laser module 1 often has too much space due to the limitation of its structure when integrating optical components (such as the collimator lens 10), and is also one of the reasons why the miniaturization demand cannot be achieved. In addition, the conventional laser module 1 is mostly based on a single light source, and thus cannot meet the requirements of multiple light sources or multiple wavelengths required by today's electronic devices, thereby limiting the speed of electronic devices such as handheld devices and wearable devices. Development; according to the above description, the conventional laser module 1 still needs to be improved.
本發明之一目的在提供一種表面固定元件(surface mounted device,SMD)型式的雷射模組，使其所應用的電子裝置的整體體積得以縮小，而又由於雷射模組的殼體內使用反射光學件改變邊射型雷射二極體單元所提供之雷射光束的傳輸路徑，令表面固定型雷射模組的厚度更能有效降低，故適合應用在手持裝置、穿戴式裝置等輕、薄、短小之設計的電子設備上。 SUMMARY OF THE INVENTION One object of the present invention is to provide a surface mount device (SMD) type laser module that reduces the overall size of an electronic device to be applied, and uses reflection in the housing of the laser module. The optical component changes the transmission path of the laser beam provided by the edge-emitting laser diode unit, so that the thickness of the surface-fixed laser module can be effectively reduced, so it is suitable for use in handheld devices, wearable devices, etc. Thin, short design on electronic devices.
本發明之一另一目的在提供一種整合繞射光學元件的表面固定型雷射模組，使得雷射繞射投影的效果得以發揮，且雷射模組還可具有多個邊射型雷射二極體單元，因此能滿足現今電子設備所需的多光源或多波長的需求，進而加速手持裝置、穿 戴式裝置等電子設備的發展。 Another object of the present invention is to provide a surface-fixed laser module incorporating a diffractive optical element, so that the effect of laser diffraction projection can be exerted, and the laser module can also have multiple edge-emitting lasers. The diode unit can meet the multi-source or multi-wavelength requirements of today's electronic devices, thereby accelerating handheld devices and wearing Development of electronic devices such as wearable devices.
於一較佳實施例中，本發明提供一種表面固定型雷射模組，包括：一殼體，其具有一開口；一基座，容置於該殼體內並具有暴露於該基座和該殼體外之至少一表面傳輸結構以供至少一電子信號通過其中；一邊射型雷射二極體單元，固定於該基座並提供至少一雷射光束；以及一反射光學件，供該至少一雷射光束中之一第一部份投射至其上，並反射該至少一雷射光束之該第一部份使該第一部份通過該殼體的該開口。 In a preferred embodiment, the present invention provides a surface-fixed laser module comprising: a housing having an opening; a base housed in the housing and having the base and the At least one surface transmission structure outside the housing for passing at least one electronic signal; a side-emitting laser diode unit fixed to the base and providing at least one laser beam; and a reflective optical member for the at least one A first portion of the laser beam is projected thereon and reflects the first portion of the at least one laser beam to pass the first portion through the opening of the housing.
於一較佳實施例中，表面固定型雷射模組更包括設置於該基座之一光感二極體單元，且該邊射型雷射二極體單元位於該反射光學件以及該光感二極體單元之間；其中，該至少一雷射光束中之一第二部份係投射至該光感二極體單元以供該光感二極體單元進行偵測。 In a preferred embodiment, the surface-fixed laser module further includes a photodiode unit disposed on the pedestal, and the edge-emitting laser diode unit is located at the reflective optic and the light Between the diode units, wherein a second portion of the at least one laser beam is projected to the photodiode unit for detection by the photodiode unit.
於一較佳實施例中，表面固定型雷射模組更包括至少一光學元件，且該邊射型雷射二極體單元位於該基座以及該至少一光學元件之間；其中，該至少一光學元件係用以對被該反射光學件反射之該些光束進行光學處理。 In a preferred embodiment, the surface-fixed laser module further includes at least one optical component, and the edge-emitting laser diode unit is located between the pedestal and the at least one optical component; wherein the at least An optical component is used to optically process the beams reflected by the reflective optic.
於一較佳實施例中，該至少一雷射光束中之一中心雷射光束係於從該邊射型雷射二極體單元之一發光區域之一中心處投射至該反射光學件上後被垂直反射，以朝該至少一光學元件之一光心的方向行進。 In a preferred embodiment, a center laser beam of the at least one laser beam is projected onto the reflective optic from a center of one of the illumination regions of the edge-emitting laser diode unit. Reflected vertically to travel in the direction of the optical center of one of the at least one optical element.
於一較佳實施例中，該至少一光學元件係包括一準直光學元件，用以準直被該反射光學件反射之該至少一雷射光束。 In a preferred embodiment, the at least one optical component includes a collimating optical component for collimating the at least one laser beam reflected by the reflective optic.
於一較佳實施例中，該至少一光學元件更包括一繞射光學元件，用以對通過該準直光學元件之該至少一雷射光束進行光束整型並予以向外輸出。 In a preferred embodiment, the at least one optical component further includes a diffractive optical component for beam shaping and outputting the at least one laser beam passing through the collimating optical component.
於一較佳實施例中，該準直光學元件之一第一光軸與該繞射光學元件之一第二光軸之間的距離小於0.2公厘。 In a preferred embodiment, the distance between the first optical axis of one of the collimating optical elements and the second optical axis of one of the diffractive optical elements is less than 0.2 mm.
於一較佳實施例中，該準直光學元件之一第一光軸與該繞射光學元件之一第二光軸之間的夾角小於2.5度。 In a preferred embodiment, the angle between the first optical axis of one of the collimating optical elements and the second optical axis of one of the diffractive optical elements is less than 2.5 degrees.
於一較佳實施例中，該準直光學元件以及該繞射光學元件係整合為單一光學結構。 In a preferred embodiment, the collimating optical element and the diffractive optical element are integrated into a single optical structure.
於一較佳實施例中，該準直光學元件之一有效焦距f係滿足下列條件式：0.5公厘<f<3公厘。 In a preferred embodiment, the effective focal length f of one of the collimating optical elements satisfies the following conditional formula: 0.5 mm < f < 3 mm.
於一較佳實施例中，該準直光學元件之一數值孔徑N.A.係滿足下列條件式：N.A.<0.5。 In a preferred embodiment, the numerical aperture N.A. of one of the collimating optical elements satisfies the following conditional formula: N.A.<0.5.
於一較佳實施例中，該反射光學件包括一反射鏡，且該反射鏡具有一非球面型表面。 In a preferred embodiment, the reflective optic includes a mirror and the mirror has an aspherical surface.
於一較佳實施例中，該非球面型表面係為一雙錐面(biconic)，以修正該表面固定型雷射模組所輸出之一光斑形狀。 In a preferred embodiment, the aspherical surface is a double biconic to correct a spot shape output by the surface-fixed laser module.
於一較佳實施例中，該非球面型表面係用以供該至少一雷射光束之該第一部分投射至其上並予以反射而使該至少一雷射光束之該第一部分沿著與該準直光學元件之一第一光軸之誤差角小於2度的方向行進。 In a preferred embodiment, the aspherical surface is configured to project the first portion of the at least one laser beam onto and reflect the first portion of the at least one laser beam along the alignment One of the straight optical elements travels in a direction in which the error angle of the first optical axis is less than 2 degrees.
於一較佳實施例中，該至少一光學元件上係塗佈一抗反射膜(anti-reflection coating)。 In a preferred embodiment, the at least one optical component is coated with an anti-reflection coating.
於一較佳實施例中，該至少一表面傳輸結構係包括至少一電墊片或至少一接腳。 In a preferred embodiment, the at least one surface transmission structure comprises at least one electrical pad or at least one pin.
於一較佳實施例中，表面固定型繞射光學雷射模組更包括一另一邊射型雷射二極體單元以及一另一反射光學件；其中，該邊射型雷射二極體單元以及該另一邊射型雷射二極體單元所提供之任一該雷射光束係於投射至該反射光學件以及該另一反射光學件中之至少一者後被反射，以通過該殼體的該開口。 In a preferred embodiment, the surface-fixed diffractive optical laser module further includes a further edge-emitting laser diode unit and a further reflective optical member; wherein the edge-emitting laser diode And any one of the laser beam provided by the unit and the other edge-emitting laser diode unit is reflected after being projected to at least one of the reflective optics and the other reflective optic to pass the shell The opening of the body.
於一較佳實施例中，該邊射型雷射二極體單元係包括複數個雷射二極體晶片，以提供複數個雷射光束。 In a preferred embodiment, the edge-emitting laser diode unit includes a plurality of laser diode wafers to provide a plurality of laser beams.
於一較佳實施例中，表面固定型雷射模組更包括設置於該基座外之一光感二極體單元以及一導光元件，且該導光元件用以導引該至少一雷射光束中之一第二部份往該光感二極體單元行進，以供該光感二極體單元進行偵測。 In a preferred embodiment, the surface-fixed laser module further includes a photodiode unit disposed outside the pedestal and a light guiding component, and the light guiding component is configured to guide the at least one ray A second portion of the beam travels toward the photodiode unit for detection by the photodiode unit.
1‧‧‧雷射模組 1‧‧‧Laser module
2‧‧‧表面固定型雷射模組 2‧‧‧Surface-mounted laser module
11‧‧‧遮罩 11‧‧‧ mask
12‧‧‧基座 12‧‧‧ Pedestal
13‧‧‧雷射二極體 13‧‧‧Laser diode
14‧‧‧光感二極體 14‧‧‧Light diopter
15‧‧‧散熱件 15‧‧‧ Heat sink
16‧‧‧第一焊腳 16‧‧‧First solder fillet
17‧‧‧第二焊腳 17‧‧‧Second solder fillet
18‧‧‧電線 18‧‧‧Wire
19‧‧‧電線 19‧‧‧Wire
21‧‧‧殼體 21‧‧‧ housing
22‧‧‧基座 22‧‧‧ pedestal
23‧‧‧邊射型雷射二極體單元 23‧‧‧Side-emitting laser diode unit
24‧‧‧光感二極體單元 24‧‧‧Light diode unit
25‧‧‧反射光學件 25‧‧‧Reflective optics
26‧‧‧光學元件 26‧‧‧Optical components
27‧‧‧導光元件 27‧‧‧Light guiding elements
111‧‧‧開口 111‧‧‧ openings
211‧‧‧開口 211‧‧‧ openings
212‧‧‧凹槽 212‧‧‧ Groove
221‧‧‧表面傳輸結構 221‧‧‧Surface transmission structure
231‧‧‧雷射二極體晶片 231‧‧‧Laser Diode Wafer
251‧‧‧反射鏡 251‧‧‧Mirror
261‧‧‧準直光學元件 261‧‧‧ Collimating optics
262‧‧‧繞射光學元件 262‧‧‧Diffractive optical components
2611‧‧‧光軸 2611‧‧‧ optical axis
2612‧‧‧光心 2612‧‧‧Lightheart
2612‧‧‧光軸 2612‧‧‧ optical axis
2622‧‧‧光心 2622‧‧‧Lightheart
L1‧‧‧雷射光束 L1‧‧‧Laser beam
L2‧‧‧雷射光束 L2‧‧‧Laser beam
L11‧‧‧雷射光束 L11‧‧‧Laser beam
L12‧‧‧雷射光束 L12‧‧‧Laser beam
L21‧‧‧雷射光束 L21‧‧‧Laser beam
L22‧‧‧雷射光束 L22‧‧‧Laser beam
L211‧‧‧中心雷射光束 L211‧‧‧Center laser beam
圖1：係為習知雷射模組的部分結構示意圖。 Figure 1: is a partial structural diagram of a conventional laser module.
圖2：係為本發明表面固定型雷射模組於一第一較佳實施例之外觀結構示意圖。 2 is a schematic view showing the appearance of a surface-fixed laser module of the present invention in a first preferred embodiment.
圖3：係為圖2所示表面固定型雷射模組的立體分解示意圖。 Fig. 3 is a perspective exploded view showing the surface-fixed laser module shown in Fig. 2.
圖4：係為圖2所示表面固定型雷射模組的部份結構前視圖。 Figure 4 is a front elevational view showing a portion of the structure of the surface mount type laser module shown in Figure 2.
圖5：係為本發明表面固定型雷射模組於一第二較佳實施例之部分結構的結構示意圖。 Fig. 5 is a structural schematic view showing a part of the structure of the surface-fixed laser module of the present invention in a second preferred embodiment.
圖6：係為本發明表面固定型雷射模組於一第三較佳實施例之部分結構的結構示意圖。 Fig. 6 is a structural schematic view showing a part of the structure of the surface-fixed laser module of the present invention in a third preferred embodiment.
請參閱圖2~圖4，圖2為本發明表面固定型雷射模組於一第一較佳實施例之外觀結構示意圖，圖3為圖2所示表面固定型雷射模組的立體分解示意圖，圖4為圖2所示表面固定型雷射模組的部份結構前視圖。表面固定型雷射模組2包括殼體21、基座22、邊射型雷射二極體(edge-emitting type LD)單元23、光感二極體(PD)單元24、反射光學件25以及多個光學元件26，且基座22容置於殼體21內，其承載一或多個邊射型雷射二極體單元23、光感二極體單元24以及反射光學件25，並可以提供一 平坦表面或具有底面的凹穴來固定一或多個邊射型雷射二極體單元23、光感二極體單元24以及反射光學件25；其中，基座22具有暴露於基座22和殼體21外的多個表面傳輸結構221，其厚度遠小於基座22與殼體21的厚度，並可透過錫膏焊接於電路板上(圖未示)，使得來自表面固定型雷射模組2的電子訊號可藉由通過表面傳輸結構221而傳輸進入電路板，而來自電路板的電子訊號亦可藉由通過表面傳輸結構221而傳輸進入表面固定型雷射模組2；較佳者，表面傳輸結構221可以電墊片的形式或接腳的形式呈現，但不以上述為限。再者，除了固定於基座22外，上述的反射光學件25亦可被固定於殼體21中適當的位置。另外，本案中的反射光學件25，廣義地可包括反射鏡、固定反射鏡的固定機構，或更包括調整反射鏡角度的調整機構，圖上僅為示意，實際體現時。反射鏡、固定機構和調整機構可皆固定於基座22或殼體21，或是分別固定於不同處。又，雖然圖示上的基座22是以長方體的形式呈現，但不以此為限，應用上可依據實際需求而設計。 2 to FIG. 4, FIG. 2 is a schematic view showing the appearance of a surface-fixed laser module according to a first preferred embodiment of the present invention, and FIG. 3 is a perspective exploded view of the surface-fixed laser module shown in FIG. FIG. 4 is a front view showing a partial structure of the surface-fixed laser module shown in FIG. 2. The surface-fixed laser module 2 includes a housing 21, a susceptor 22, an edge-emitting type LD unit 23, a photodiode (PD) unit 24, and a reflective optics 25. And a plurality of optical elements 26, and the susceptor 22 is received in the housing 21, and carries one or more edge-emitting laser diode units 23, a photodiode unit 24, and a reflective optics 25, and Can provide one a flat surface or a recess having a bottom surface to fix one or more of the edge-emitting laser diode unit 23, the photodiode unit 24, and the reflective optics 25; wherein the susceptor 22 has a susceptor 22 and The plurality of surface transmission structures 221 outside the casing 21 have a thickness much smaller than the thickness of the susceptor 22 and the casing 21, and can be soldered to the circuit board through a solder paste (not shown), so that the surface-mounted laser mode is obtained. The electronic signal of group 2 can be transmitted into the circuit board through the surface transmission structure 221, and the electronic signal from the circuit board can also be transmitted into the surface-fixed laser module 2 through the surface transmission structure 221; preferably The surface transmission structure 221 may be in the form of an electrical pad or a pin, but is not limited to the above. Furthermore, in addition to being fixed to the susceptor 22, the reflective optics 25 described above may be fixed in place in the housing 21. In addition, the reflective optics 25 in the present case may broadly include a mirror, a fixing mechanism for fixing the mirror, or an adjustment mechanism for adjusting the angle of the mirror, which is merely illustrative and practical. The mirror, the fixing mechanism and the adjustment mechanism may be fixed to the base 22 or the housing 21, or may be fixed at different places. Moreover, although the pedestal 22 is shown in the form of a rectangular parallelepiped, it is not limited thereto, and the application can be designed according to actual needs.
又，殼體21及/或基座22可提供散熱，殼體21具有一開口211，其中開口211的圓形形狀和大小不限圖上所示，亦可為其他形狀和大小，主要讓非透光的殼體21內的雷射光束能夠通過到達外界。再者，該多個光學元件26設置於開口211處或開口211的鄰近處，而邊射型雷射二極體單元23包括一雷射二極體晶片231，其在水平方向上是位於反射光學件25以及光感二極體單元24之間，在垂直方向上則是位於基座22以及該多個光學元件26之間；其中，邊射型雷射二極體單元23於接收電力(如經由表面傳輸結構221接收電力)後可提供複數雷射光束L2，且該些雷射光束L2的第一部份(主要部份)光束L21係往反射光學件25的方向行進，以於投射至反射光學件25上後被反射光學件25反射而朝殼體21的開口211行進，進而供該多個光學元件26進行光學處理並向外輸出；另外，該些雷射光束L2的第二部份(次要部份)光束L22則往光感二極體單元24的方向投射，以供光感二極體單 元24進行光偵測，且光感二極體單元24於偵測的過程中會產生偵測訊號，並使該些偵測訊號經由表面傳輸結構221向外傳輸，供後續相關的控制程序使用。 Moreover, the housing 21 and/or the base 22 can provide heat dissipation, and the housing 21 has an opening 211. The circular shape and size of the opening 211 are not limited to those shown in the drawings, and may be other shapes and sizes. The laser beam within the light transmissive housing 21 can pass through to the outside world. Furthermore, the plurality of optical elements 26 are disposed at the opening 211 or adjacent to the opening 211, and the edge-emitting laser diode unit 23 includes a laser diode wafer 231 which is located in the horizontal direction. The optical member 25 and the photodiode unit 24 are located between the susceptor 22 and the plurality of optical elements 26 in the vertical direction; wherein the edge-emitting type laser diode unit 23 receives power ( The plurality of laser beams L2 may be provided after receiving power via the surface transmission structure 221, and the first (main portion) light beam L21 of the laser beams L2 travels in the direction of the reflective optics 25 for projection After being reflected on the reflective optics 25, it is reflected by the reflective optics 25 and travels toward the opening 211 of the housing 21, and then the optical components 26 are optically processed and outputted outward; in addition, the second of the laser beams L2 Part (secondary part) of the light beam L22 is projected in the direction of the light-sensitive diode unit 24 for the light-sensitive diode single The light detecting unit generates a detecting signal during the detecting process, and transmits the detecting signals to the outside through the surface transmitting structure 221 for subsequent related control programs. .
於本較佳實施例中，該多個光學元件26係包括一準直光學元件261以及一繞射光學元件262(diffractive optical element,DOE)，且準直光學元件261固設於殼體21的開口211處，而繞射光學元件262則位於準直光學元件261的上方，並固設於殼體21上的凹槽212處；其中，準直光學元件261用以準直被反射光學件25所反射的雷射光束L21，使通過準直光學元件261的雷射光束L21以較佳的入射方向入射至繞射光學元件262，而繞射光學元件262則用以對通過準直光學元件261的雷射光束L21進行光束整型並予以向外輸出，一般來說，透過繞射光學元件262的紋路設計，可使表面固定型雷射模組2成為特定結構光源的產生器，並可發揮雷射繞射投影的效果；惟，繞射光學元件本身係為熟知本技藝人士所知悉，在此即不再予以贅述。 In the preferred embodiment, the plurality of optical elements 26 include a collimating optical element 261 and a diffractive optical element (DOE), and the collimating optical element 261 is fixed to the housing 21. At the opening 211, the diffractive optical element 262 is located above the collimating optical element 261 and is fixed to the recess 212 on the housing 21; wherein the collimating optical element 261 is used to collimate the reflected optic 25 The reflected laser beam L21 causes the laser beam L21 passing through the collimating optical element 261 to be incident on the diffractive optical element 262 in a preferred incident direction, and the diffractive optical element 262 is used to pass the collimating optical element 261. The laser beam L21 performs beam shaping and is externally outputted. Generally, the surface-fixed laser module 2 can be used as a generator of a specific structure light source through the grain design of the diffractive optical element 262, and can be utilized. The effect of laser diffraction projection; however, the diffractive optical element itself is known to those skilled in the art and will not be described again herein.
較佳者，準直光學元件261及/或繞射光學元件262上可分別塗佈有抗反射膜(anti-reflection coating)以提高光穿透率，且準直光學元件261的有效焦距f以及數值孔徑N.A.分別滿足下列條件式：0.5公厘<f<3公厘，N.A.<0.5，但不以上述為限。 Preferably, the collimating optical element 261 and/or the diffractive optical element 262 are respectively coated with an anti-reflection coating to increase the light transmittance, and the effective focal length f of the collimating optical element 261 and The numerical aperture NA satisfies the following conditional formula: 0.5 mm < f < 3 mm, NA < 0.5, but is not limited to the above.
再者，反射光學件25至少包括一反射鏡251，且反射鏡251具有一非球面型表面，如雙錐面(biconic)，用以使投射至其上的雷射光束L21能夠沿著與準直光學元件261之光軸2611(第一光軸)之誤差角小於2度的方向行進，且非球面型表面還具有修正表面固定型雷射模組2所輸出之光斑形狀的功效。於較佳的情況下，該些雷射光束L21中的一中心雷射光束L211係於從邊射型雷射二極體單元23的發光區域的中心處投射至反射鏡251上後被垂直向上反射以朝該些光學元件26的光心2612、2622(光線通過此些點的前後方向不變)的方向行進。再者，本案考量反射光學件 25造成的誤差而使得中心雷射光束L211無法確實地被垂直反射時，則準直光學元件261的光軸2611與繞射光學元件262的光軸2621(第二光軸)之間的偏移量以小於0.2公厘為佳，且準直光學元件261的光軸2611與繞射光學元件262的光軸2621之間的夾角以小於2.5度為佳。 Furthermore, the reflective optics 25 includes at least one mirror 251, and the mirror 251 has an aspherical surface, such as a biconic surface, for enabling the laser beam L21 projected thereon to follow The optical axis 2611 (first optical axis) of the straight optical element 261 has an error angle of less than 2 degrees, and the aspherical surface has the effect of correcting the shape of the spot output by the surface-fixed laser module 2. Preferably, a central laser beam L211 of the plurality of laser beams L21 is projected from the center of the light-emitting region of the edge-emitting laser diode unit 23 to the mirror 251 and then vertically upward. The reflection travels in the direction toward the optical centers 2612, 2622 of the optical elements 26 (the light rays passing through the front and rear directions of the dots). Furthermore, this case considers reflective optics When the error caused by 25 causes the center laser beam L211 to be unable to be reflected vertically, the offset between the optical axis 2611 of the collimating optical element 261 and the optical axis 2621 (second optical axis) of the diffractive optical element 262 Preferably, the amount is less than 0.2 mm, and the angle between the optical axis 2611 of the collimating optical element 261 and the optical axis 2621 of the diffractive optical element 262 is preferably less than 2.5 degrees.
又，於另一較佳實施例中，準直光學元件261以及繞射光學元件262係整合為單一光學結構；可選擇地，一板體設置於準直光學元件261以及繞射光學元件262之間，且為了克服因準直光學元件261以及繞射光學元件262的整合所造成的誤差，板體係採用不同於準直光學元件261以及繞射光學元件262的材質，以對雷射光束L21的穿透方向進行修正並提高光穿透率。 Moreover, in another preferred embodiment, the collimating optical element 261 and the diffractive optical element 262 are integrated into a single optical structure; alternatively, a plate is disposed between the collimating optical element 261 and the diffractive optical element 262. In order to overcome the error caused by the integration of the collimating optical element 261 and the diffractive optical element 262, the plate system uses materials different from the collimating optical element 261 and the diffractive optical element 262 to oppose the laser beam L21. The direction of penetration is corrected and the light transmittance is increased.
特別說明的是，本發明設計將邊射型雷射二極體單元23的雷射二極體晶片231以平行於基座22的方式設置，使得雷射二極體晶片231所提供的雷射光束L21是以近乎水平的方式入射至反射光學件25上，再透過反射光學件25使入射其上的雷射光束L21近乎垂直向上反射而從殼體21的開口211向外輸出，藉此有效降低雷射模組2的厚度，而又由於本發明將雷射模組設計為表面固定元件(surface mounted device,SMD)的型式，更能有效縮小整體體積，俾使其應用於手持裝置、穿戴式裝置等輕、薄、短小之設計的電子設備上。 Specifically, the present invention is designed such that the laser diode 231 of the edge-emitting laser diode unit 23 is disposed in parallel with the susceptor 22 such that the laser provided by the laser diode 231 is provided. The light beam L21 is incident on the reflective optical member 25 in a nearly horizontal manner, and is transmitted through the reflective optical member 25 to cause the laser light beam L21 incident thereon to be reflected from the opening 211 of the casing 21 to be substantially outwardly reflected upward, thereby being effective. The thickness of the laser module 2 is reduced, and since the laser module is designed as a surface mounted device (SMD), the overall volume can be effectively reduced, and the utility model can be applied to a handheld device and wear. Lightweight, thin, short design electronic devices such as devices.
當然，上述僅為實施例，熟知本技藝人士可依據實際應用需求而進行任何均等的變更設計，舉例來說，可變更設計為，將反射光學件25固定在非基座22處，如固設在殼體21內的適當處；再舉例來說，雖然上述實施例中表面固定型繞射光學雷射模組僅包括單一邊射型雷射二極體單元23以及單一反射光學件25，但可變更設計為如圖5所示。請參閱圖5，其為本發明表面固定型雷射模組於一第二較佳實施例之部分結構的結構示意圖。本較佳實施例之表面固定型繞射光學雷射模組大致類似於前述第一較佳實施例中所述者，在此及不再予以贅述；而本較佳實施例與 前述較佳實施例之不同處在於，基座22上包括多個邊射型雷射二極體單元23以及多個反射光學件25作適當的配置，可搭配同一光感二極體單元24，則任一邊射型雷射二極體單元23的雷射二極體晶片所提供的任一雷射光束皆可於被相對應的反射光學件25反射後朝殼體21之開口211的方向行進以向外輸出。同理，當單一個邊射型雷射二極體單元23具有多個雷射二極體晶片231時亦可利用相似的方式達到本案之目的。 Of course, the above is only an embodiment, and those skilled in the art can perform any equal modification design according to actual application requirements. For example, the design can be modified to fix the reflective optical member 25 at the non-base 22, such as fixing. Where appropriate in the housing 21; for example, although the surface-mounted diffractive optical laser module of the above embodiment includes only a single edge-emitting type laser diode unit 23 and a single reflecting optical element 25, The design can be changed as shown in Figure 5. Please refer to FIG. 5 , which is a structural diagram of a partial structure of a surface-fixed laser module according to a second preferred embodiment of the present invention. The surface-mounted diffractive optical laser module of the preferred embodiment is substantially similar to that described in the foregoing first preferred embodiment, and will not be further described herein; however, the preferred embodiment is The difference between the foregoing preferred embodiments is that the pedestal 22 includes a plurality of edge-emitting laser diode units 23 and a plurality of reflective optical members 25 for proper configuration, and can be matched with the same photodiode unit 24. Any laser beam provided by the laser diode package of any of the edge-emitting laser diode units 23 can be reflected by the corresponding reflective optics 25 toward the opening 211 of the casing 21. Output to the outside. Similarly, when a single edge-emitting type laser diode unit 23 has a plurality of laser diode chips 231, the purpose of the present invention can be achieved in a similar manner.
又舉例來說，雖然上述實施例中表面固定型繞射光學雷射模組的光感二極體單元24皆是設置於基座22上，但可變更設計為如圖6所示。請參閱圖6，其為本發明表面固定型雷射模組於一第三較佳實施例之部分結構的結構示意圖。本較佳實施例之表面固定型繞射光學雷射模組大致類似於前述第一與第二較佳實施例中所述者，在此及不再予以贅述；而本較佳實施例與前述較佳實施例之不同處在於，光感二極體單元24是設置於基座22的外側，且表面固定型繞射光學雷射模組更包括導光元件27，用以於雷射光束L2的部份光束入射至其上時導引光束L22往光感二極體單元24行進，進而使得設置於基座22外側的光感二極體單元24可進行光偵測，如同前述實施例的說明，光感二極體單元24於偵測的過程中會產生偵測訊號，供後續相關的控制程序使用。 For example, although the photodiode unit 24 of the surface-fixed diffractive optical laser module in the above embodiment is disposed on the susceptor 22, it can be modified as shown in FIG. 6. Please refer to FIG. 6 , which is a structural diagram of a partial structure of a surface mount type laser module according to a third preferred embodiment of the present invention. The surface-fixed diffractive optical laser module of the preferred embodiment is substantially similar to that described in the first and second preferred embodiments, and will not be described again; and the preferred embodiment and the foregoing The difference between the preferred embodiment is that the photodiode unit 24 is disposed outside the susceptor 22, and the surface-fixed diffractive optical laser module further includes a light guiding element 27 for the laser beam L2. When the partial light beam is incident thereon, the guiding light beam L22 travels to the light sensing diode unit 24, so that the light sensing diode unit 24 disposed outside the susceptor 22 can perform light detection, as in the foregoing embodiment. The photo-sensing diode unit 24 generates a detection signal during the detection process for subsequent control programs.
於本較佳實施例中，光感二極體單元24可以是一平面式(planar type)光感二極體單元或一丘狀式(dome type)光感二極體單元，而導光元件27可以是一光反射元件或一繞射光學元件(DOE)，並可被設計呈一薄膜狀或以塗料(coating)的方式形成。惟上述僅為一實施例，光感二極體單元的形式、導光元件的位置、形式及其形成方式並不以上述為限。 In the preferred embodiment, the photodiode unit 24 can be a planar type photodiode unit or a dome type photodiode unit, and the light guiding element 27 may be a light reflecting element or a diffractive optical element (DOE) and may be designed to be formed in the form of a film or in a coating. However, the above is only an embodiment, and the form of the photodiode unit, the position and form of the light guiding element, and the manner of forming the same are not limited to the above.
以上所述僅為本發明之較佳實施例，並非用以限定本發明之申請專利範圍，因此凡其它未脫離本發明所揭示之精神下所完成之等效改變或修飾，均應包含於本案之申請專利範圍內。 The above are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Therefore, any equivalent changes or modifications made without departing from the spirit of the present invention should be included in the present invention. Within the scope of the patent application.
21‧‧‧殼體 21‧‧‧ housing
22‧‧‧基座 22‧‧‧ pedestal
23‧‧‧邊射型雷射二極體單元 23‧‧‧Side-emitting laser diode unit
24‧‧‧光感二極體單元 24‧‧‧Light diode unit
25‧‧‧反射光學件 25‧‧‧Reflective optics
26‧‧‧光學元件 26‧‧‧Optical components
211‧‧‧開口 211‧‧‧ openings
212‧‧‧凹槽 212‧‧‧ Groove
221‧‧‧表面傳輸結構 221‧‧‧Surface transmission structure
261‧‧‧準直光學元件 261‧‧‧ Collimating optics
262‧‧‧繞射光學元件 262‧‧‧Diffractive optical components
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|---|---|---|---|---|
| CN110710070A (en) * | 2017-06-02 | 2020-01-17 | 欧司朗光电半导体有限公司 | Semiconductor laser device and method for manufacturing semiconductor laser device |
| TWI752498B (en) * | 2020-05-15 | 2022-01-11 | 新加坡商超穎光學科技私人有限公司 | Laser module and laser die and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI358727B (en) * | 2007-11-08 | 2012-02-21 | Univ Nat Chunghsing | Integrated optical read-write apparatus |
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2015
- 2015-10-30 TW TW104135816A patent/TWI556533B/en active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110710070A (en) * | 2017-06-02 | 2020-01-17 | 欧司朗光电半导体有限公司 | Semiconductor laser device and method for manufacturing semiconductor laser device |
| US11189990B2 (en) | 2017-06-02 | 2021-11-30 | Osram Oled Gmbh | Semiconductor laser component and method of producing a semiconductor laser component |
| TWI752498B (en) * | 2020-05-15 | 2022-01-11 | 新加坡商超穎光學科技私人有限公司 | Laser module and laser die and manufacturing method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI556533B (en) | 2016-11-01 |
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