TW201615678A - 萘酚醛樹脂之合成技術 - Google Patents
萘酚醛樹脂之合成技術 Download PDFInfo
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Abstract
本發明揭示出一種用以製得萘酚酚醛樹脂的方法,其包含下列、由下列組成或實質上由下列組成:在一反應區域中,於一反應條件下,讓a)一包含i)1至99重量百分比的1-萘酚及ii)1至99重量百分比的2-萘酚之萘酚成分與b)一醛接觸,以形成該萘酚酚醛樹脂。
本發明亦揭示出一種可硬化組成物,其包含下列、由下列組成或實質上由下列組成:a)一環氧樹脂;及b)一硬化劑組分,其包含i)一包含磷組成物的寡聚性化合物,其係醚化的可溶酚醛樹脂與9,10-二氫-9-氧雜-10-磷雜菲(phosphaphenanthrene)-10-氧化物之反應產物,及ii)一藉由上述方法製備的萘酚酚醛樹脂。可使用該可硬化組成物來製備半固化片及電積層板。
Description
本發明係關於一種環氧樹脂組成物。更特別的是,本發明係關於一種無鹵或實質上無鹵調配物。
環氧樹脂廣泛使用在塗料、黏著劑、印刷電路板、半導體封裝劑、黏著劑及航太複合物中,此係責承其優良的機械強度;抗化學、濕氣及腐蝕性;好的熱、黏著及電性質。已經使用萘酚酚醛樹脂(NPN)作為用於電積層板應用的環氧樹脂硬化劑。使用NPN亦可大大地改良防焰性及允許減低所使用的阻燃劑量。但是,NPN具有高製造成本及歸因於高系統黏度之差的半固化片外觀。因此,將想要一種避免這些負面態様的NPN製造方法。
本發明係一種用以製得萘酚酚醛樹脂的方法,其包含下列、由下列或實質上由下列組成:在一反應區域中,於一反應條件下,讓a)一包含i)1至99重量百分比的1-萘酚與ii)1至99重量百分比的2-萘酚之萘酚成分;與b)一醛接
觸,以形成該萘酚酚醛樹脂。
本發明亦係一種可硬化組成物,其包含下列、由下列或實質上由下列組成:a)一環氧樹脂;及b)一硬化劑組分,其包括i)一包含磷組成物的寡聚性化合物,其係醚化的可溶酚醛樹脂與9,10-二氫-9-氧雜-10-磷雜菲-10-氧化物之反應產物,及ii)一藉由上述方法製備的萘酚酚醛樹脂。
本發明係一種用以製得萘酚酚醛樹脂的方法。本發明係一種方法,其包含下列、由下列或實質上由下列組成:在一反應區域中,於一反應條件下,讓a)一包含i)1至99重量百分比的1-萘酚與ii)1至99重量百分比的2-萘酚之萘酚成分;與b)一醛接觸,以形成該萘酚酚醛樹脂。該反應條件可包括反應溫度在80℃至160℃的範圍內及反應時間在3至72小時的範圍內。
在多個具體實例中,讓一萘酚成分與三聚甲醛接觸以形成萘酚酚醛樹脂。該反應方法的實施例係在下列式1中描出。該萘酚酚醛樹脂產物係描出如為經修改的萘酚酚醛樹脂(m-NPN)。
在具體實例中,可使用三聚甲醛作為該醛。可使用其它醛,包括但不限於甲醛、脂肪族醛及芳香族醛。
在多個具體實例中,可在與醛接觸前,將該萘酚成分加入至溶劑。可使用任何合適的溶劑,諸如例如,甲苯及二甲苯。
該反應條件包括反應溫度在80℃至160℃的範圍內。於本文中包括及於本文中揭示出80℃至160℃之全部各別範圍及次範圍,例如,該反應溫度可從下限80℃、90℃、105℃或118℃至上限90℃、122℃、135℃、144℃、153℃或160℃。
該反應條件亦包括反應時間在3至72小時的範圍內。於本文中包括及於本文中揭示出3小時至72小時之全部各別範圍及次範圍,例如,該反應時間可從下限3小時、6.5小時、8小時或10小時至上限18小時、22小時、24小時、36小時、48小時及72小時。
在其它具體實例中,本發明係一種可硬化組成物。本發明係一種可硬化組成物,其包含下列、由下列或實質上由下列組成:a)一環氧樹脂;及b)一硬化劑組分,其包括i)一包含磷組成物的寡聚性化合物,其係醚化的可溶酚醛樹脂與9,10-二氫-9-氧雜-10-磷雜菲-10-氧化物之反應產物,及ii)一藉由上述方法製備的萘酚酚醛樹脂。該可硬化組成物可進一步選擇性包括一充填劑。該可硬化組成物可進一步選擇性包括一觸媒。
該可硬化組成物包含一環氧樹脂及一硬化劑,如在下列本文中更詳細地描述。
該可硬化組成物可進一步包括一或多種充填劑。該可硬化組成物可包含10至80重量百分比的一或多種充填劑。於本文中包括及於本文中揭示出10至80重量百分比的全部各別值及次範圍,例如,該充填劑之重量百分比可從下限10、12、15、20或25重量百分比至上限62、65、70、75或80重量百分比。例如,該可硬化組成物可包含15至75重量百分比的一或多種充填劑;或在可替代的實例中,該可硬化組成物可包含20至70重量百分比之一或多種充填劑。此充填劑包括但不限於天然二氧化矽、熔融二氧化矽、氧化鋁、水合氧化鋁及其組合。
該可硬化組成物可進一步包括一或多種觸媒。該可硬化組成物可包含0.01至50重量百分比的一或多種觸媒。於本文中包括及於本文中揭示出0.01至50重量百分比之全部各別值及次範圍,例如,該觸媒的重量百分比可從下限0.01、0.03、0.05、0.07或1重量百分比至上限2、6、10、15或50重量百分比。例如,該可硬化組成物可包含0.05至10重量百分比的一或多種觸媒;或在可替代的實例中,該可硬化組成物可包含0.05至2重量百分比的一或多種觸媒。此觸媒包括但不限於2-甲基咪唑(2MI)、2-苯基咪唑(2PI)、2-乙基-4-甲基咪唑(2E4MI)、1-苄基-2-苯基咪唑(1B2PZ)、硼酸、三苯膦(TPP)、四苯基硼酸四苯基鏻(TPP-k)及其組合。
該可硬化組成物可進一步包括一或多種增韌劑。該可硬化組成物可包含0.01至70重量百分比的一或多種增韌劑。於本文中包括及於本文中揭示出0.01至70重量百分比之全部各別值及次範圍,例如,該增韌劑的重量百分比可從下限0.01、0.05、1、1.5或2重量百分比至上限15、30、50、60或70重量百分比。例如,該可硬化組成物可包含1至50重量百分比的一或多種增韌劑;或在可替代的實例中,該可硬化組成物可包含2至30重量百分比的一或多種增韌劑。
此增韌劑包括但不限於核殼型橡膠。該核殼型橡膠係一聚合物,其包括一由含彈性體的聚合物或橡膠似的聚合物作為主要成份而形成之橡膠顆粒核心,及一由在該核心上進行接枝聚合的聚合物所形成之外殼層。該外殼層係藉由將一單體接枝聚合至核心來部分或全部覆蓋該橡膠顆粒核心之表面。通常來說,該橡膠顆粒核心係由丙烯酸或甲基丙烯酸酯單體、或二烯(共軛二烯)單體、或乙烯基單體、或矽氧烷型式單體及其組合構成。該增韌劑可選自於可商業購得的產品,例如,Paraloid EXL 2650A、EXL 2655、EXL 2691 A,其每種可從The Dow Chemical Company獲得;或來自Kaneka Corporation的Kane Ace® MX系列,諸如MX 120、MX 125、MX 130、MX 136、MX 551;或可從Mitsubishi Rayon獲得的METABLEN SX-006。
該可硬化組成物包含a)一環氧樹脂;及b)一硬化劑組分,其包含i)一包含磷組成物的寡聚性化合物,其係醚
化的可溶酚醛樹脂與9,10-二氫-9-氧雜-10-磷雜菲-10-氧化物之反應產物,及ii)一萘酚酚醛樹脂。
該可硬化組成物可包含10至90重量百分比的一或多種環氧樹脂。於本文中包括及於本文中揭示出10至90重量百分比之全部各別值及次範圍,例如,該環氧樹脂的重量百分比可從下限12、17、20、30或35重量百分比至上限55、70、86、90或98重量百分比。例如,該可硬化組成物可包含20至98重量百分比的一或多種環氧樹脂;或在可替代的實例中,該可硬化組成物可包含30至90重量百分比的一或多種環氧樹脂。在多個具體實例中,該環氧樹脂係一具有多於二個環氧基官能基之多官能基環氧樹脂。此環氧樹脂包括但不限於藉由縮水甘油化(glycidifying)酚或萘酚與醛之縮合產物所獲得的環氧樹脂,諸如萘酚酚醛環氧樹脂;藉由縮水甘油化萘酚、酚與甲醛之共縮合產物所獲得的環氧樹脂;雙酚-A酚醛環氧樹脂;雙酚-F酚醛環氧樹脂;及其組合。
本發明之可硬化組成物包括至少一種環氧樹脂。該環氧樹脂可係飽和或不飽和、脂肪族、環脂族、芳香族或雜環及可經取代。該環氧樹脂亦可係單體或聚合物。
在本文所揭示之具體實例中,使用於本發明的組分(a)中之環氧樹脂可變化及包括習知及可商業購得的環氧樹脂,其可單獨或以二或更多種之組合使用。在選擇用於本文所揭示的組成物之環氧樹脂時,應該不僅考慮最後產物的性質,而且亦要考慮到其可影響該樹脂組成物之加工
的黏度及其它性質。
該環氧化合物的實施例包括但不限於以多官能基醇、酚、環脂族羧酸、芳香族胺或胺基酚與表氯醇之反應產物為主的環氧化物。幾個非為限制的具體實例包括例如雙酚A二縮水甘油醚、雙酚F二縮水甘油醚、間苯二酚二縮水甘油醚及對-胺基酚的三縮水甘油基醚類。由熟悉人士已知之其它合適的環氧樹脂各別包括表氯醇與鄰-甲酚之反應產物,及酚型酚醛清漆。進一步環氧樹脂包括雙乙烯苯或雙乙烯萘的環氧化物。亦可使用二或更多種環氧樹脂之混合物。
在本發明中有用的環氧樹脂可選自於可商業購得的產品,例如,D.E.R®.331、D.E.R.332、D.E.R.383、D.E.R.334、D.E.N.431、D.E.N.438、D.E.R.736或D.E.R.732環氧樹脂,其可從The Dow Chemical Company獲得;或來自Synasia之Syna 21環脂族環氧樹脂。
該可硬化組成物可包含1至90重量百分比藉由上述提及的方法所製備之萘酚酚醛樹脂(之後指為”經修改的萘酚酚醛樹脂”或”m-NPN”)。於本文中包括及於本文中揭示出1至90重量百分比之全部各別值及次範圍,例如,該m-NPN的重量百分比可從下限1、1.2、1.5、12或20重量百分比至上限45、50、54、60或70重量百分比。例如,該可硬化組成物可包含1至60重量百分比的一或多種m-NPNs;或在可替代的實例中,該可硬化組成物可包含1至50重量百分比的一或多種m-NPNs。
該可硬化組成物可包含1至80重量百分比之一或多種包含磷組成物的寡聚性化合物,其係醚化的可溶酚醛樹脂與9,10-二氫-9-氧雜-10-磷雜菲-10-氧化物(DOPO)之反應產物。於本文中包括及於本文中揭示出1至80重量百分比之全部各別值及次範圍,例如,該DOPO化合物的重量百分比可從下限1.5、2、3、5或10重量百分比至上限20、40、55、60或70重量百分比。例如,該可硬化組成物可包含2至60重量百分比的一或多種DOPO化合物;或在可替代的實例中,該可硬化組成物可包含5至40重量百分比的一或多種DOPO化合物。
在具體實例中,該含DOPO化合物係一種包括含磷化合物的寡聚性組成物,其係醚化的可溶酚醛樹脂與9,10-二氫-9-氧雜-10-磷雜菲-10-氧化物(”H-DOP”)之反應產物。此反應產物係在下列式2中敘述。
可在美國專利案號8,124,716中找到關於此組成物及其製備之進一步訊息。
在一或多個具體實例中,該可硬化組成物可包括一溶劑。可使用溶劑來溶解該環氧樹脂及硬化劑組分或調整最後清漆之黏度。可使用的溶劑之實施例包括但不限於甲醇、丙酮、正丁醇、甲基乙基酮(MEK)、環己酮、苯、甲苯、二甲苯、二甲基甲醯胺(DMF)、乙醇(EtOH)、丙二醇甲基醚(PM)、醋酸丙二醇甲基醚酯(DOWANOLTM PMA)及其混合物。
該可硬化組成物可藉由熟習該項技術者已知之任何合適的方法製造。在具體實例中,一起混合該環氧樹脂組分、含磷化合物及聚合物酐之溶液。然後,將任何其它想要的組分,諸如上述的選擇性組分加入至該混合物。
本揭示的具體實例提供一種半固化片,其包括一補強組分及如於本文中所討論的可硬化組成物。該半固化片可藉由一包括讓一基質組分浸滲進該補強組分中之方法獲得。該基質組分包圍及/或支撐該補強組分。可將所揭示的可硬化組成物使用於該基質組分。該半固化片之基質組分與補強組分提供協合作用。此協合作用提供該半固化片及/或藉由硬化該半固化片所獲得之產物具有僅有各別組分所達不到的機械及/或物理性質。可使用該半固化片來製得用於印刷電路板的電積層板。
該補強組分可係纖維。該纖維的實施例包括但不限於玻璃、芳族聚醯胺、碳、聚酯、聚乙烯、石英、金屬、
陶瓷、生物質及其組合。該纖維可經塗佈。該纖維塗料的實施例包括但是不限於硼。
該玻璃纖維的實施例包括但不限於A-玻璃纖維、E-玻璃纖維、C-玻璃纖維、R-玻璃纖維、S-玻璃纖維、T-玻璃纖維及其組合。該芳族聚醯胺係有機聚合物,其實施例包括但不限於Kevlar®、Twaron®及其組合。該碳纖維的實施例包括但不限於從聚丙烯腈、瀝青、嫘螢、纖維素及其組合形成之那些纖維。該金屬纖維的實施例包括但不限於不銹鋼、鉻、鎳、鉑、鈦、銅、鋁、鈹、鎢及其組合。該陶瓷纖維的實施例包括但不限於從氧化鋁、二氧化矽、二氧化鋯、氮化矽、碳化矽、碳化硼、氮化硼、硼化矽及其組合形成的那些纖維。該生物質纖維的實施例包括但不限於從木材、非木材及其組合形成的那些纖維。
該補強組分可係織物。如於本文中所討論,該織物可從該纖維形成。該織物的實施例包括但不限於縫合織物、梭織物及其組合。該織物可係單向、多軸及其組合。該補強組分可係纖維與織物之組合。
該半固化片可藉由讓該基質組分浸滲進該補強組分中獲得。可藉由多種方法達成讓該基質組分浸滲進該補強組分中。可經由輥塗、浸泡、噴灑或其它此程序,讓該補強組分與該基質組分接觸來形成該半固化片。在該半固化片補強組分已經與該半固化片基質組分接觸後,可經由揮發移除該溶劑。同時及/或在溶劑揮發後,可硬化例如部分硬化該半固化片基質組分。此溶劑之揮發及/或部分硬
化可指為B-階段化。該B-階段化的產物可指為半固化片。
對某些應用來說,該B-階段化可經由曝露至溫度60℃至250℃發生;例如,該B-階段化可經由曝露至溫度65℃至240℃,或70℃至230℃發生。對某些應用來說,該B-階段化可發生一段時間1分鐘(min)至60分鐘;例如,該B-階段化可發生一段時間2分鐘至50分鐘,或5分鐘至40分鐘。但是,對某些應用來說,該B-階段化可在另一種溫度下發生及/或另一段時間時期。
可硬化(例如,更完全硬化)一或多片該半固化片以獲得一硬化產物。該半固化片可在進一步硬化前積層及/或形成一形狀。對某些應用來說(例如,當製造電積層板時),該半固化片層可與導電材料層交替放置。該導電材料的實施例包括但是不限於銅箔。然後,可讓該半固化片層曝露至該基質組分將變得更完全硬化的條件。
一個用以獲得該更完全硬化的產物的方法之實施例為加壓。可將一或多片半固化片放進加壓機中,於此讓其接受一硬化力量一段預定的硬化時間區間以獲得該更完全硬化的產物。該加壓機具有一在上述陳述的硬化溫度範圍中之硬化溫度。對一或多個具體實例來說,該加壓機具有一硬化溫度,其在一跳躍時間區間內從較低的硬化溫度跳躍至較高的硬化溫度。
在加壓期間,該一或多片半固化片可經由加壓機接受一硬化力量。該硬化力量的值可係10千巴斯卡(kPa)至350千巴斯卡;例如,該硬化力量的值可係20千巴斯卡至300
千巴斯卡,或30千巴斯卡至275千巴斯卡。該預定的硬化時間區間之值可係5秒至500秒;例如,該預定的硬化時間區間之值可係25秒至540秒,或45秒至520秒。對用以獲得該硬化產物之其它方法來說,其它硬化溫度、硬化力量值及/或預定的硬化時間區間係可能的。額外的是,可重覆該方法以進一步硬化該半固化片及獲得該硬化產物。
該半固化片可使用來製造複合物、電積層板及塗層。從該電積層板製備的印刷電路板可使用於多種應用。在具體實例中,該印刷電路板係使用在智慧型手機及平板電腦中。在多個具體實例中,該電積層板具有銅剝除強度在4磅/英吋至12磅/英吋的範圍內。
於50℃下,將1-萘酚(24克,0.17莫耳)及2-萘酚(12克,0.083莫耳)溶解在甲苯(75毫升)中(使用250毫升裝備有攪拌器、凝結器及用以引進N2的管子之3頸圓底燒瓶)。在固體消失後,加入草酸(300毫克,5毫莫耳),接著三聚甲醛(PF)(6.75克,0.225莫耳)。將該反應混合物慢慢加熱至90℃。伴隨著甲醛的解聚合一起顯露出大量氣泡,及伴隨著猛烈的回流發生該縮合反應。在其穩定後,伴隨著攪拌回流該混合物6.5小時。將其冷卻至50℃及丟棄上層甲苯溶液。在80℃下以環己酮(30毫升)溶解殘餘物1小時,在此之後,可沒有進一步純化而使用該溶液。取出小部分及在80℃真空烘箱中乾燥3小時。使用樣品的重量損失來計算該萘
酚酚醛樹脂組成物在環己酮中之濃度。
在1000毫升裝備有回流冷凝器、機械攪拌及溫度感應器的三頸圓底燒瓶中,將72克1-萘酚(0.5莫耳)加入至200毫升甲苯。將該混合物加熱至70℃以讓1-萘酚分散進溶劑中。然後,加入13克三聚甲醛(0.5*0.87莫耳)及1.26克草酸(0.5*0.02莫耳)。然後,將該反應混合物小心地加熱至110℃及在N2環境下攪拌72小時。允許該反應混合物冷卻至50℃及從該溶液析出產物。丟棄上層甲苯溶液及加入200毫升醋酸乙酯及額外攪拌該混合物10分鐘。以水清洗該醋酸乙酯溶液一次,然後以NaCl溶液兩次。收集有機相及在無水硫酸鈉上乾燥2小時。然後,過濾出鹽及在真空下移除大部分溶劑。最後,在100℃真空烘箱中乾燥該產物過夜。產率係80%。在最後產物中的萘酚單體含量係0.4%。1H NMR(丙酮-d6,400MHz):8.31-6.96ppm(m,6H);4.54-4.05ppm(m,1.5H);GPC(THF):Mn:1008克/莫耳;Mw:1615克/莫耳;D:1.60。
表2顯示出在不同條件下所製備之萘酚酚醛樹脂組成物的GPC結果。使用比較用合成來製備比較例A及使用發明合成來製備比較例B。實施例1-4全部使用發明合成來製備。可藉由反應時間及1-萘酚與2-萘酚之莫耳比率來控制m-NPN的分子量。因為2-萘酚趨向於在該反應中與甲醛二聚化,增加在起始材料中的2-萘酚比率會造成該產物之分子量減少。縮短反應時間亦造成萘酚酚醛樹脂組成物具有較低的分子量。
DENTM(”DEN”)438(XZ 92748):酚型酚醛清漆型式環氧樹脂,來自The Dow Chemical Company;(XZ 92741),含磷硬化劑,來自The Dow Chemical Company;萘酚酚醛樹脂(NPN)或經修改的萘酚酚醛樹脂(m-NPN):顯示在上述表2中的調配物。
2MI:硬化觸媒(10%在甲醇中),來自Sigma-Aldrich。
根據上述調配物來混合上述成份及搖晃以形成一均勻的溶液。然後,將觸媒加入至該清漆,及在維持於171℃的加熱板上測試該清漆之膠凝時間。從該加熱板表面回收該凝膠化的材料及在200℃烘箱中後硬化3小時。藉由DSC測量該硬化的材料之玻璃轉換溫度(Tg)。
將上述清漆塗刷在E-玻璃纖維薄片(Hexcel 7628)上,然後,將該玻璃纖維薄片放進177℃具有好的空氣流動之烘箱中一段所提供的時間以獲得該半固化片。然後,壓碎該半固化片以收集粉末。
製得一用於介電及DMTA測量的透明飾板。將該半固化片粉末放在一平坦鋁箔上,然後將該含有粉末的鋁箔放在一平坦金屬板上。將該組合加熱至200℃直到該粉末熔化。以另一片鋁箔覆蓋該熔化的粉末,然後將一平坦金屬板放在該鋁箔上。在200℃下熱加壓該組合1小時,然後,在200℃下後硬化另外3小時。獲得一具有厚度0.3毫米之無
氣泡飾板及使用於Dk/Df及DMTA測試。
在流動的氮大氣氛(50毫升/分鐘)下,使用DSC-Q2000儀器進行DSC實驗。在檢驗中使用約10毫克的硬化樹脂。在10℃/分鐘的加熱速率下施加從40℃至280℃的動態溫度掃描。使用相同的跳躍速率獲得二次掃描。
亦藉由動態機械熱分析(DMTA)測量該積層板的玻璃轉換溫度(Tg)。從在正切δ波峰中的最大值決定Tg。測試參數如下:
頻率:6.28弧度/秒
初始溫度:20.0℃
最後溫度:350.0℃
跳躍速率=3.0℃/分鐘
在室溫下,藉由裝備有Agilent 16453A測試夾具的Agilent 4991A Impendence/Material Analyzer來分析樣品。使用Agilent Teflon標準飾板,使用由供應商所提供的Dk/Df參數進行校正。藉由測微計來測量該Teflon標準飾板及全部樣品的厚度。
在表4中的結果顯示出以具有不同分子量之m-NPN所硬化的材料之熱性質(如上所述,較高的1-N及2-N比率意謂著較高分子量)。使用該無鹵調配物調查玻璃轉換
溫度Tg與m-NPN分子量的關係。藉由XZ 92741及具有較高分子量的m-NPN共硬化之XZ 92748具有較高Tg。對F4來說,當從比率3:1的1-N及2-N來製備m-NPN時,相應樹脂的Tg(188℃)顯示出類似於使用高分子量NPN作為硬化劑之比較用B(186℃)。與Dow的產品酚型酚醛清漆(PN,XZ92535)(比較用A)比較,當使用1-萘酚作為在起始材料中的主要組分(1-N與2-N的比率係高於2:1)(F3,F4)時,Tg係改良20℃。
測試具有不同多官能基環氧樹脂之調配物的熱性質。篩選出小量多官能基環氧樹脂(約總共3.0克清漆)。為了阻燃(FR)性質,亦將XZ 92741加入至該調配物以將磷含量調整至某一程度。由於較低的分子量,當使用eCHTP(四官能基環氧樹脂,74.2%在甲基乙基酮中,來自The Dow Chemical Company)及XZ 97109(雙酚A酚醛清漆型式環氧樹脂,75%在甲基乙基酮中,來自The Dow Chemical Company)作為該環氧樹脂組分時,包括實施例1的組成物之調配物(實施例9及實施例10)顯示出其Tg值各別比比較例E及F稍微低9℃及7℃(表5)。其亦闡明出與其它測
試的環氧樹脂諸如XZ 97109、Tactix 742及M-BOND 450(部分A)比較,eCHTP顯示出在這些調配物中的最高熱穩定性。
製備以實施例10為基底的積層板。詳細的清漆調配物係列在表6中。混合該等聚合物成份以形成一在環己酮中的均勻60%溶液。搖晃上述混合物1小時。然後,將該清漆塗裝在玻璃纖維薄片(Hexcel 7628)上及在171℃的換氣烘箱中部分硬化一段合適的時間(通常來說,約3分鐘)以製得半固化片。最後,在200℃下熱加壓8片半固化片一小時以製得一手工塗裝的積層板,在200℃下後硬化該積層板另外二小時。
測試該等積層板的性質及詳細結果係顯示在表7中。與酚型酚醛清漆(XZ 92535,酚型酚醛清漆,50%在PMA中,來自The Dow Chemical Company)基底的積層板(與在表6中的調配物相同,使用PN來置換NPN)比較,NPN基底的無鹵調配物顯示出較高Tg(204℃,藉由DSC)及Td,及較低的濕氣吸收。在2.6%磷含量(以總固體為基準)下,二者積層板可通過UL 94測試而具有V-0等級。該NPN基底的積層板之總燃燒時間係34秒,其係比PN基底的對應物(邊界,49秒)短。其亦顯示出有前途的機械性質和低Z軸熱膨脹係數及介電性質(Dk及Df)。
Claims (16)
- 一種用以製得萘酚酚醛樹脂的方法,其包括:在一反應區域中,於一反應條件下,讓下列接觸以形成該萘酚酚醛樹脂:a)一萘酚成分,其包含:i)1至99重量百分比的1-萘酚;與ii)1至99重量百分比的2-萘酚;及b)一醛。
- 如請求項1之方法,其中該反應條件包括80℃至160℃之反應溫度及3至72小時之反應時間。
- 如請求項1或2之方法,其中該醛係三聚甲醛。
- 如請求項1至3中任一項之方法,其中該萘酚成分係在與該醛接觸前存在於溶劑中。
- 一種可硬化組成物,其包含:a)一環氧樹脂;及b)一硬化劑組分,其包含:i)一包含磷組成物的寡聚性化合物,其係醚化的可溶酚醛樹脂與9,10-二氫-9-氧雜-10-磷雜菲-10-氧化物之反應產物;及ii)一藉由如請求項1之方法製備的萘酚酚醛樹脂。
- 如請求項5之可硬化組成物,更包含一選自於由下列所組成之群的充填劑:天然二氧化矽、熔融二氧化矽、氧 化鋁、水合氧化鋁及其組合。
- 如請求項5或6之可硬化組成物,其中該環氧樹脂係選自於由下列所組成之群:酚型酚醛環氧樹脂、雙酚A的二縮水甘油醚及其組合。
- 如請求項5至7中任一項之可硬化組成物,其中該含磷化合物具有下列結構:
- 如請求項5至8中任一項之可硬化組成物,更包含一觸媒。
- 如請求項5至9中任一項之可硬化組成物,其中,以該調配物的總重量為基準,該環氧樹脂組分係以10重量百分比至90重量百分比範圍之量存在,該含磷化合物係以2重量百分比至60重量百分比範圍之量存在,及該萘酚酚醛樹脂係以1重量百分比至60重量百分比範圍之量存在。
- 如請求項6至10中任一項之可硬化組成物,其中該充填劑係以10重量百分比至80重量百分比範圍之量存在。
- 如請求項9至11中任一項之可硬化組成物,其中該觸媒係以0.01重量百分比至50重量百分比範圍之量存在。
- 一種用以製備如請求項5至12中任一項之可硬化組成物之方法,其包括混合a)一環氧樹脂;及b)一硬化劑組分,其包含i)一包含磷組成物的寡聚性化合物,其係醚化的可溶酚醛樹脂與9,10-二氫-9-氧雜-10-磷雜菲-10-氧化物之反應產物及ii)一萘酚酚醛樹脂,以形成該可硬化組成物。
- 一種半固化片,其係從如請求項5至12中任一項之可硬化組成物製備。
- 一種電積層板,其係從如請求項5至12中任一項之可硬化組成物製備。
- 一種印刷電路板,其係從如請求項15之電積層板製備。
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