TW201614730A - Chemical mechanical polishing pad with internal channels - Google Patents

Chemical mechanical polishing pad with internal channels

Info

Publication number
TW201614730A
TW201614730A TW104118131A TW104118131A TW201614730A TW 201614730 A TW201614730 A TW 201614730A TW 104118131 A TW104118131 A TW 104118131A TW 104118131 A TW104118131 A TW 104118131A TW 201614730 A TW201614730 A TW 201614730A
Authority
TW
Taiwan
Prior art keywords
polishing pad
polishing
chemical mechanical
mechanical polishing
internal channels
Prior art date
Application number
TW104118131A
Other languages
Chinese (zh)
Other versions
TWI652735B (en
Inventor
Jason G Fung
Rajeev Bajaj
Kasiraman Krishnan
Mahendra C Orilall
Fred C Redeker
Russell Edward Perry
Gregory E Menk
Daniel Redfield
Original Assignee
Applied Materials Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/695,778 external-priority patent/US20160101500A1/en
Priority claimed from US14/695,299 external-priority patent/US9873180B2/en
Application filed by Applied Materials Inc filed Critical Applied Materials Inc
Publication of TW201614730A publication Critical patent/TW201614730A/en
Application granted granted Critical
Publication of TWI652735B publication Critical patent/TWI652735B/en

Links

Landscapes

  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

A polishing pad for chemical mechanical polishing is provided. The polishing pad includes a base region having a supporting surface. The polishing pad further includes a plurality of polishing features forming a polishing surface, the polishing surface opposing the supporting surface. The polishing pad further includes one or more channels formed in an interior region of the polishing pad and extending at least partly around a center of the polishing pad, wherein each channel is fluidly coupled to at least one port.
TW104118131A 2014-10-09 2015-06-04 Chemical mechanical polishing pad with internal channels TWI652735B (en)

Applications Claiming Priority (8)

Application Number Priority Date Filing Date Title
US201462062092P 2014-10-09 2014-10-09
US62/062,092 2014-10-09
US201462065193P 2014-10-17 2014-10-17
US62/065,193 2014-10-17
US14/695,299 2015-04-24
US14/695,778 US20160101500A1 (en) 2014-10-09 2015-04-24 Chemical mechanical polishing pad with internal channels
US14/695,778 2015-04-24
US14/695,299 US9873180B2 (en) 2014-10-17 2015-04-24 CMP pad construction with composite material properties using additive manufacturing processes

Publications (2)

Publication Number Publication Date
TW201614730A true TW201614730A (en) 2016-04-16
TWI652735B TWI652735B (en) 2019-03-01

Family

ID=56361276

Family Applications (2)

Application Number Title Priority Date Filing Date
TW104118131A TWI652735B (en) 2014-10-09 2015-06-04 Chemical mechanical polishing pad with internal channels
TW108102132A TWI685896B (en) 2014-10-09 2015-06-04 Method of manufacturing chemical mechanical polishing pad with internal channels

Family Applications After (1)

Application Number Title Priority Date Filing Date
TW108102132A TWI685896B (en) 2014-10-09 2015-06-04 Method of manufacturing chemical mechanical polishing pad with internal channels

Country Status (1)

Country Link
TW (2) TWI652735B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114473842A (en) * 2020-11-11 2022-05-13 中国科学院微电子研究所 Grinding disc, chemical mechanical polishing device, system and method
CN114800057A (en) * 2022-05-11 2022-07-29 浙江工业大学 Polishing device based on non-Newtonian fluid film shearing mechanism

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI792559B (en) * 2021-09-13 2023-02-11 中國砂輪企業股份有限公司 Grinding tool capable of sensing grinding status and grinding system comprising the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW559975B (en) 2002-09-13 2003-11-01 Taiwan Semiconductor Mfg Equipment and method for preventing wafer from scratching
US20040242121A1 (en) 2003-05-16 2004-12-02 Kazuto Hirokawa Substrate polishing apparatus
JP2004243518A (en) 2004-04-08 2004-09-02 Toshiba Corp Polishing device
TWI287486B (en) 2006-05-04 2007-10-01 Iv Technologies Co Ltd Polishing pad and method thereof
US9067299B2 (en) * 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114473842A (en) * 2020-11-11 2022-05-13 中国科学院微电子研究所 Grinding disc, chemical mechanical polishing device, system and method
CN114800057A (en) * 2022-05-11 2022-07-29 浙江工业大学 Polishing device based on non-Newtonian fluid film shearing mechanism

Also Published As

Publication number Publication date
TW201929088A (en) 2019-07-16
TWI685896B (en) 2020-02-21
TWI652735B (en) 2019-03-01

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