TW201614246A - Temperature control device of crimping device of test equipment and temperature control method thereof - Google Patents

Temperature control device of crimping device of test equipment and temperature control method thereof

Info

Publication number
TW201614246A
TW201614246A TW103134598A TW103134598A TW201614246A TW 201614246 A TW201614246 A TW 201614246A TW 103134598 A TW103134598 A TW 103134598A TW 103134598 A TW103134598 A TW 103134598A TW 201614246 A TW201614246 A TW 201614246A
Authority
TW
Taiwan
Prior art keywords
heat
temperature control
testing
pressing
electronic element
Prior art date
Application number
TW103134598A
Other languages
Chinese (zh)
Other versions
TWI506286B (en
Inventor
zhi-wei Xie
Original Assignee
Hon Tech Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hon Tech Inc filed Critical Hon Tech Inc
Priority to TW103134598A priority Critical patent/TW201614246A/en
Application granted granted Critical
Publication of TWI506286B publication Critical patent/TWI506286B/zh
Publication of TW201614246A publication Critical patent/TW201614246A/en

Links

Abstract

This disclosure relates to a temperature control device of a crimping device of test equipment and an associated temperature control method. The crimping device includes a lower pressing lever driven by a driving source to lift and lower. The front end of the lower pressing lever is provided with a pressing jig set. The pressing jig set comprises an upper plate installed to the lower pressing lever by connection and a pressing block installed under the upper plate. The temperature control device of the crimping device installs heating plates and a temperature sensor on the pressing block and connects a plate-like uniform plate on top of thepressing block. On top of the uniform plate are several heat-dissipation fins and heat-dissipation fans. When the pressing block of the pressing jig set presses an electronic element for testing, the electronic element can be heated to the testing temperature using heating fins. When electronic element exceeds the testing temperature, heat-uniforming plates, heat-dissipation fins, and heat-dissipation fans can also be used to instantly dissipate the heat of the electronic element to maintain within the predetermined testing temperature range to conduct testing and ensure the yield rate of products.
TW103134598A 2014-10-03 2014-10-03 Temperature control device of crimping device of test equipment and temperature control method thereof TW201614246A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103134598A TW201614246A (en) 2014-10-03 2014-10-03 Temperature control device of crimping device of test equipment and temperature control method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103134598A TW201614246A (en) 2014-10-03 2014-10-03 Temperature control device of crimping device of test equipment and temperature control method thereof

Publications (2)

Publication Number Publication Date
TWI506286B TWI506286B (en) 2015-11-01
TW201614246A true TW201614246A (en) 2016-04-16

Family

ID=55220065

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103134598A TW201614246A (en) 2014-10-03 2014-10-03 Temperature control device of crimping device of test equipment and temperature control method thereof

Country Status (1)

Country Link
TW (1) TW201614246A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613448B (en) * 2017-04-06 2018-02-01 致茂電子股份有限公司 Device for pressing electronic component with different downward forces
TWI632843B (en) * 2017-12-01 2018-08-11 微星科技股份有限公司 Profile and identity recognizing device
TWI634336B (en) * 2017-08-29 2018-09-01 京元電子股份有限公司 Floating temperature sensor and semiconductor element test module using the same
TWI682270B (en) * 2018-07-24 2020-01-11 致茂電子股份有限公司 High/low-temperature testing apparatus and method
CN110749783A (en) * 2018-07-24 2020-02-04 致茂电子股份有限公司 High-low temperature test equipment and test method thereof
CN113447748A (en) * 2021-06-29 2021-09-28 贵州航天电子科技有限公司 Device for high and low temperature test of electronic product
TWI827473B (en) * 2023-02-22 2023-12-21 鴻勁精密股份有限公司 Processing machine of electronic component

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI641842B (en) * 2017-08-14 2018-11-21 鴻勁精密股份有限公司 Crimp of electronic component crimping mechanism and test classification device
KR102131954B1 (en) * 2019-02-15 2020-07-09 유피이(주) An apparatus for testing integrated circuit devices and method thereof
TWI741491B (en) * 2020-02-07 2021-10-01 孫偉志 Processor heat dissipation module with 3-dimension heat dissipation, burning-in device, and method of using the same
TWI769627B (en) * 2020-12-18 2022-07-01 鴻勁精密股份有限公司 Temperature controlling unit and operating apparatus using the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6034978A (en) * 1999-05-12 2000-03-07 Cymer, Inc. Gas discharge laser with gas temperature control
TWI247399B (en) * 2004-06-01 2006-01-11 Via Tech Inc Package and temperature-control method of electronic device with active temperature control
CN201152650Y (en) * 2007-12-18 2008-11-19 华南理工大学 Cold-hot transformation apparatus having solid multi-lattice
TWI368651B (en) * 2008-10-24 2012-07-21 Quanta Comp Inc Temperature variation apparatus
TWM376907U (en) * 2009-09-29 2010-03-21 Shen-Quan Zheng LED lamp with ceramic thermoelectric heat-dissipation substrate

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI613448B (en) * 2017-04-06 2018-02-01 致茂電子股份有限公司 Device for pressing electronic component with different downward forces
TWI634336B (en) * 2017-08-29 2018-09-01 京元電子股份有限公司 Floating temperature sensor and semiconductor element test module using the same
TWI632843B (en) * 2017-12-01 2018-08-11 微星科技股份有限公司 Profile and identity recognizing device
TWI682270B (en) * 2018-07-24 2020-01-11 致茂電子股份有限公司 High/low-temperature testing apparatus and method
CN110749783A (en) * 2018-07-24 2020-02-04 致茂电子股份有限公司 High-low temperature test equipment and test method thereof
US11061067B2 (en) * 2018-07-24 2021-07-13 Chroma Ate Inc. Apparatus and method for a high temperature test and a low temperature test and configured to maintain an electronic component under test near a test temperature
CN110749783B (en) * 2018-07-24 2022-05-10 致茂电子股份有限公司 High-low temperature test equipment and test method thereof
CN113447748A (en) * 2021-06-29 2021-09-28 贵州航天电子科技有限公司 Device for high and low temperature test of electronic product
TWI827473B (en) * 2023-02-22 2023-12-21 鴻勁精密股份有限公司 Processing machine of electronic component

Also Published As

Publication number Publication date
TWI506286B (en) 2015-11-01

Similar Documents

Publication Publication Date Title
TW201614246A (en) Temperature control device of crimping device of test equipment and temperature control method thereof
TW201130069A (en) Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same
MY186867A (en) Device and method for controlling an electrical heater to limit temperature according to desired temperature profile over time
EP2395116A3 (en) Steel sheet heating device, method for producing press-formed part, and press-formed part
EP2778696A3 (en) Direct injection phase change temperature control system
EP3409728A4 (en) Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device
MX2013004101A (en) Method and arrangement for attaching a chip to a printed conductive surface.
EP3422831A4 (en) Thermally conductive sheet, production method therefor, and heat dissipation device
EP2355133A3 (en) Substrate heating apparatus, substrate heating method and substrate processing system
WO2016069835A3 (en) Apparatus and method for shaping heated glass sheets
MY178246A (en) Device and method for the selective carbonization of paper
EP3608953A4 (en) Cooling apparatus, heat sink, electronic device, and method for cooling control
SG10201902774XA (en) Expanding method and expanding apparatus
CA2879720A1 (en) Apparatus, systems, and methods for performing thermal melt analyses and amplifications
PL3376122T3 (en) Method and device for detecting the heat given off by a heating surface
WO2014014925A3 (en) Sample encapsulation system and method
ES2544503A1 (en) Procedure for regulating the temperature of a cooking range (Machine-translation by Google Translate, not legally binding)
TR201900363T4 (en) Method and apparatus for high temperature welding of a hardener on a composite panel with a thermoplastic matrix.
WO2012019601A3 (en) Method and device for setting connecting elements that are self-drilling without chip formation
MX2016008473A (en) Steel plate heating method and steel plate heating device.
ES1163758U (en) Sealing device for glass with vacuum chamber (Machine-translation by Google Translate, not legally binding)
WO2016061006A3 (en) Carbon nanotubes as a thermal interface material
GB2522371A (en) Thermal-mechanical testing apparatus for electrically conductive specimen testing systems and method for use thereof
EP2634495A3 (en) Apparatus for supervising hot plates
CN204054649U (en) A kind of upper heated die device of full-automatic plastic cement products hot press