TW201614246A - Temperature control device of crimping device of test equipment and temperature control method thereof - Google Patents
Temperature control device of crimping device of test equipment and temperature control method thereofInfo
- Publication number
- TW201614246A TW201614246A TW103134598A TW103134598A TW201614246A TW 201614246 A TW201614246 A TW 201614246A TW 103134598 A TW103134598 A TW 103134598A TW 103134598 A TW103134598 A TW 103134598A TW 201614246 A TW201614246 A TW 201614246A
- Authority
- TW
- Taiwan
- Prior art keywords
- heat
- temperature control
- testing
- pressing
- electronic element
- Prior art date
Links
Abstract
This disclosure relates to a temperature control device of a crimping device of test equipment and an associated temperature control method. The crimping device includes a lower pressing lever driven by a driving source to lift and lower. The front end of the lower pressing lever is provided with a pressing jig set. The pressing jig set comprises an upper plate installed to the lower pressing lever by connection and a pressing block installed under the upper plate. The temperature control device of the crimping device installs heating plates and a temperature sensor on the pressing block and connects a plate-like uniform plate on top of thepressing block. On top of the uniform plate are several heat-dissipation fins and heat-dissipation fans. When the pressing block of the pressing jig set presses an electronic element for testing, the electronic element can be heated to the testing temperature using heating fins. When electronic element exceeds the testing temperature, heat-uniforming plates, heat-dissipation fins, and heat-dissipation fans can also be used to instantly dissipate the heat of the electronic element to maintain within the predetermined testing temperature range to conduct testing and ensure the yield rate of products.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103134598A TW201614246A (en) | 2014-10-03 | 2014-10-03 | Temperature control device of crimping device of test equipment and temperature control method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103134598A TW201614246A (en) | 2014-10-03 | 2014-10-03 | Temperature control device of crimping device of test equipment and temperature control method thereof |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI506286B TWI506286B (en) | 2015-11-01 |
TW201614246A true TW201614246A (en) | 2016-04-16 |
Family
ID=55220065
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103134598A TW201614246A (en) | 2014-10-03 | 2014-10-03 | Temperature control device of crimping device of test equipment and temperature control method thereof |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW201614246A (en) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI613448B (en) * | 2017-04-06 | 2018-02-01 | 致茂電子股份有限公司 | Device for pressing electronic component with different downward forces |
TWI632843B (en) * | 2017-12-01 | 2018-08-11 | 微星科技股份有限公司 | Profile and identity recognizing device |
TWI634336B (en) * | 2017-08-29 | 2018-09-01 | 京元電子股份有限公司 | Floating temperature sensor and semiconductor element test module using the same |
TWI682270B (en) * | 2018-07-24 | 2020-01-11 | 致茂電子股份有限公司 | High/low-temperature testing apparatus and method |
CN110749783A (en) * | 2018-07-24 | 2020-02-04 | 致茂电子股份有限公司 | High-low temperature test equipment and test method thereof |
CN113447748A (en) * | 2021-06-29 | 2021-09-28 | 贵州航天电子科技有限公司 | Device for high and low temperature test of electronic product |
TWI827473B (en) * | 2023-02-22 | 2023-12-21 | 鴻勁精密股份有限公司 | Processing machine of electronic component |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI641842B (en) * | 2017-08-14 | 2018-11-21 | 鴻勁精密股份有限公司 | Crimp of electronic component crimping mechanism and test classification device |
KR102131954B1 (en) * | 2019-02-15 | 2020-07-09 | 유피이(주) | An apparatus for testing integrated circuit devices and method thereof |
TWI741491B (en) * | 2020-02-07 | 2021-10-01 | 孫偉志 | Processor heat dissipation module with 3-dimension heat dissipation, burning-in device, and method of using the same |
TWI769627B (en) * | 2020-12-18 | 2022-07-01 | 鴻勁精密股份有限公司 | Temperature controlling unit and operating apparatus using the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6034978A (en) * | 1999-05-12 | 2000-03-07 | Cymer, Inc. | Gas discharge laser with gas temperature control |
TWI247399B (en) * | 2004-06-01 | 2006-01-11 | Via Tech Inc | Package and temperature-control method of electronic device with active temperature control |
CN201152650Y (en) * | 2007-12-18 | 2008-11-19 | 华南理工大学 | Cold-hot transformation apparatus having solid multi-lattice |
TWI368651B (en) * | 2008-10-24 | 2012-07-21 | Quanta Comp Inc | Temperature variation apparatus |
TWM376907U (en) * | 2009-09-29 | 2010-03-21 | Shen-Quan Zheng | LED lamp with ceramic thermoelectric heat-dissipation substrate |
-
2014
- 2014-10-03 TW TW103134598A patent/TW201614246A/en unknown
Cited By (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI613448B (en) * | 2017-04-06 | 2018-02-01 | 致茂電子股份有限公司 | Device for pressing electronic component with different downward forces |
TWI634336B (en) * | 2017-08-29 | 2018-09-01 | 京元電子股份有限公司 | Floating temperature sensor and semiconductor element test module using the same |
TWI632843B (en) * | 2017-12-01 | 2018-08-11 | 微星科技股份有限公司 | Profile and identity recognizing device |
TWI682270B (en) * | 2018-07-24 | 2020-01-11 | 致茂電子股份有限公司 | High/low-temperature testing apparatus and method |
CN110749783A (en) * | 2018-07-24 | 2020-02-04 | 致茂电子股份有限公司 | High-low temperature test equipment and test method thereof |
US11061067B2 (en) * | 2018-07-24 | 2021-07-13 | Chroma Ate Inc. | Apparatus and method for a high temperature test and a low temperature test and configured to maintain an electronic component under test near a test temperature |
CN110749783B (en) * | 2018-07-24 | 2022-05-10 | 致茂电子股份有限公司 | High-low temperature test equipment and test method thereof |
CN113447748A (en) * | 2021-06-29 | 2021-09-28 | 贵州航天电子科技有限公司 | Device for high and low temperature test of electronic product |
TWI827473B (en) * | 2023-02-22 | 2023-12-21 | 鴻勁精密股份有限公司 | Processing machine of electronic component |
Also Published As
Publication number | Publication date |
---|---|
TWI506286B (en) | 2015-11-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW201614246A (en) | Temperature control device of crimping device of test equipment and temperature control method thereof | |
TW201130069A (en) | Direct liquid-contact micro-channel heat transfer devices, methods of temperature control for semiconductive devices, and processes of forming same | |
MY186867A (en) | Device and method for controlling an electrical heater to limit temperature according to desired temperature profile over time | |
EP2395116A3 (en) | Steel sheet heating device, method for producing press-formed part, and press-formed part | |
EP2778696A3 (en) | Direct injection phase change temperature control system | |
EP3409728A4 (en) | Thermally conductive sheet, production method for thermally conductive sheet, heat dissipation member, and semiconductor device | |
MX2013004101A (en) | Method and arrangement for attaching a chip to a printed conductive surface. | |
EP3422831A4 (en) | Thermally conductive sheet, production method therefor, and heat dissipation device | |
EP2355133A3 (en) | Substrate heating apparatus, substrate heating method and substrate processing system | |
WO2016069835A3 (en) | Apparatus and method for shaping heated glass sheets | |
MY178246A (en) | Device and method for the selective carbonization of paper | |
EP3608953A4 (en) | Cooling apparatus, heat sink, electronic device, and method for cooling control | |
SG10201902774XA (en) | Expanding method and expanding apparatus | |
CA2879720A1 (en) | Apparatus, systems, and methods for performing thermal melt analyses and amplifications | |
PL3376122T3 (en) | Method and device for detecting the heat given off by a heating surface | |
WO2014014925A3 (en) | Sample encapsulation system and method | |
ES2544503A1 (en) | Procedure for regulating the temperature of a cooking range (Machine-translation by Google Translate, not legally binding) | |
TR201900363T4 (en) | Method and apparatus for high temperature welding of a hardener on a composite panel with a thermoplastic matrix. | |
WO2012019601A3 (en) | Method and device for setting connecting elements that are self-drilling without chip formation | |
MX2016008473A (en) | Steel plate heating method and steel plate heating device. | |
ES1163758U (en) | Sealing device for glass with vacuum chamber (Machine-translation by Google Translate, not legally binding) | |
WO2016061006A3 (en) | Carbon nanotubes as a thermal interface material | |
GB2522371A (en) | Thermal-mechanical testing apparatus for electrically conductive specimen testing systems and method for use thereof | |
EP2634495A3 (en) | Apparatus for supervising hot plates | |
CN204054649U (en) | A kind of upper heated die device of full-automatic plastic cement products hot press |