TW201614102A - Method and apparatus for uniform metallization on substrate - Google Patents
Method and apparatus for uniform metallization on substrateInfo
- Publication number
- TW201614102A TW201614102A TW103135385A TW103135385A TW201614102A TW 201614102 A TW201614102 A TW 201614102A TW 103135385 A TW103135385 A TW 103135385A TW 103135385 A TW103135385 A TW 103135385A TW 201614102 A TW201614102 A TW 201614102A
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate holding
- holding device
- substrate
- electrode
- chamber body
- Prior art date
Links
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- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The present invention discloses an apparatus and method for uniforming metallization on substrates. According to one embodiment of the present invention, the apparatus for uniforming metallization on substrates comprises a submerged chamber body, at least one electrode, substrate holding device, at least one ultrasonic or megasonic device and a reflecting plate, and a first driving device. The submerged chamber body is used to hold metal salt electrolyte. At least one electrode is connected to at least one power source. The substrate holding device holds at least one piece of substrate, by which the conductive side faces one electrode for electric conduction via the substrate holding device. At least one ultrasonic or megasonic device and a reflecting plate are used to form a standing wave in the submerged chamber body. The first driving device drives the substrate holding device to vibrate periodically to make the substrate holding device pass through the entire region of the acoustic standing wave in order for the substrate to obtain a uniform distribution of acoustic intensity in the cumulative time.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103135385A TWI639725B (en) | 2014-10-13 | 2014-10-13 | Method and apparatus for uniform metallization on a substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW103135385A TWI639725B (en) | 2014-10-13 | 2014-10-13 | Method and apparatus for uniform metallization on a substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201614102A true TW201614102A (en) | 2016-04-16 |
TWI639725B TWI639725B (en) | 2018-11-01 |
Family
ID=56361148
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW103135385A TWI639725B (en) | 2014-10-13 | 2014-10-13 | Method and apparatus for uniform metallization on a substrate |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI639725B (en) |
-
2014
- 2014-10-13 TW TW103135385A patent/TWI639725B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI639725B (en) | 2018-11-01 |
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