TW201614102A - Method and apparatus for uniform metallization on substrate - Google Patents

Method and apparatus for uniform metallization on substrate

Info

Publication number
TW201614102A
TW201614102A TW103135385A TW103135385A TW201614102A TW 201614102 A TW201614102 A TW 201614102A TW 103135385 A TW103135385 A TW 103135385A TW 103135385 A TW103135385 A TW 103135385A TW 201614102 A TW201614102 A TW 201614102A
Authority
TW
Taiwan
Prior art keywords
substrate holding
holding device
substrate
electrode
chamber body
Prior art date
Application number
TW103135385A
Other languages
Chinese (zh)
Other versions
TWI639725B (en
Inventor
David Wang
Fu-Ping Chen
Xi Wang
Original Assignee
Acm Res Shanghai Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Acm Res Shanghai Inc filed Critical Acm Res Shanghai Inc
Priority to TW103135385A priority Critical patent/TWI639725B/en
Publication of TW201614102A publication Critical patent/TW201614102A/en
Application granted granted Critical
Publication of TWI639725B publication Critical patent/TWI639725B/en

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Abstract

The present invention discloses an apparatus and method for uniforming metallization on substrates. According to one embodiment of the present invention, the apparatus for uniforming metallization on substrates comprises a submerged chamber body, at least one electrode, substrate holding device, at least one ultrasonic or megasonic device and a reflecting plate, and a first driving device. The submerged chamber body is used to hold metal salt electrolyte. At least one electrode is connected to at least one power source. The substrate holding device holds at least one piece of substrate, by which the conductive side faces one electrode for electric conduction via the substrate holding device. At least one ultrasonic or megasonic device and a reflecting plate are used to form a standing wave in the submerged chamber body. The first driving device drives the substrate holding device to vibrate periodically to make the substrate holding device pass through the entire region of the acoustic standing wave in order for the substrate to obtain a uniform distribution of acoustic intensity in the cumulative time.
TW103135385A 2014-10-13 2014-10-13 Method and apparatus for uniform metallization on a substrate TWI639725B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW103135385A TWI639725B (en) 2014-10-13 2014-10-13 Method and apparatus for uniform metallization on a substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW103135385A TWI639725B (en) 2014-10-13 2014-10-13 Method and apparatus for uniform metallization on a substrate

Publications (2)

Publication Number Publication Date
TW201614102A true TW201614102A (en) 2016-04-16
TWI639725B TWI639725B (en) 2018-11-01

Family

ID=56361148

Family Applications (1)

Application Number Title Priority Date Filing Date
TW103135385A TWI639725B (en) 2014-10-13 2014-10-13 Method and apparatus for uniform metallization on a substrate

Country Status (1)

Country Link
TW (1) TWI639725B (en)

Also Published As

Publication number Publication date
TWI639725B (en) 2018-11-01

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