TW201608668A - Carrying device - Google Patents
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- TW201608668A TW201608668A TW103129551A TW103129551A TW201608668A TW 201608668 A TW201608668 A TW 201608668A TW 103129551 A TW103129551 A TW 103129551A TW 103129551 A TW103129551 A TW 103129551A TW 201608668 A TW201608668 A TW 201608668A
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Abstract
Description
本發明是有關於一種承載裝置，特別是指一種在製程中用以承載及定位待加工工件的承載裝置。 The invention relates to a carrying device, in particular to a carrying device for carrying and positioning a workpiece to be processed in a manufacturing process.
現有應用在例如半導體的曝光製程中的承載裝置，通常包括一用以承載並定位晶圓的承載盤，及一升降機構。承載盤具有一承載頂面、一底面、複數個貫穿承載頂面與底面的穿孔，及複數個形成於承載頂面的吸附溝槽。升降機構包含複數根分別穿設於穿孔並可相對於承載盤上下移動的銷桿。當升降機構的銷桿位在一承接位置時，銷桿凸伸出承載頂面，此時，移載裝置會移載晶圓並將其置放於銷桿上。隨後，銷桿會帶動晶圓向下移動，使晶圓置於承載頂面上。藉由吸附溝槽吸氣時所產生的吸力作用，使得晶圓能被吸附在承載頂面上。 Existing carrier devices for use in, for example, semiconductor exposure processes typically include a carrier disk for carrying and positioning the wafer, and a lifting mechanism. The carrier tray has a loading top surface, a bottom surface, a plurality of perforations extending through the top surface and the bottom surface of the bearing, and a plurality of adsorption grooves formed on the top surface of the bearing. The lifting mechanism includes a plurality of pins that are respectively threaded through the perforations and movable up and down relative to the carrier. When the pin of the lifting mechanism is in a receiving position, the pin protrudes from the carrying top surface, and at this time, the transfer device transfers the wafer and places it on the pin. Subsequently, the pin will move the wafer down, placing the wafer on the top surface of the carrier. The suction force generated by the suction of the adsorption groove enables the wafer to be adsorbed on the top surface of the carrier.
由於晶圓經過多道製程後，晶圓會產生翹曲的現象，且各銷桿外周緣與對應穿孔的內孔面之間形成有間隙，因此，當吸附溝槽在吸氣的過程中，承載盤外部的氣體會持續地經由前述間隙流入吸附溝槽內，導致吸附溝槽無法在承載頂面與晶圓之間抽真空。所以，現有承載裝置 無法穩固且確實地將晶圓定位在承載頂面，使得承載裝置帶動晶圓朝光罩方向移動的過程中，易造成晶圓脫離承載頂面而掉落的情形產生。再者，現有承載裝置更無法對晶圓進行整平的動作，導致晶圓無法準確地與光罩進行對位。 Since the wafer undergoes a plurality of processes, the wafer is warped, and a gap is formed between the outer circumference of each pin and the inner hole surface of the corresponding perforation. Therefore, when the adsorption groove is in the process of inhaling, The gas outside the carrier disk continuously flows into the adsorption trench through the gap, resulting in the adsorption trench not being able to draw a vacuum between the carrier top surface and the wafer. Therefore, the existing carrier device The wafer cannot be stably and surely positioned on the top surface of the carrier, so that the carrier device drives the wafer to move toward the reticle, which may cause the wafer to fall off the top surface of the carrier and fall. Moreover, the existing carrier device is even more incapable of leveling the wafer, and the wafer cannot be accurately aligned with the mask.
因此，本發明之主要目的，即在提供一種承載裝置，藉由承載盤的吸氣流道所產生的吸力吸附待加工工件，使待加工工件能穩固且確實地定位在承載盤的承載頂面。再者，藉由吸氣流道以抽真空的方式吸附待加工工件，真空吸附時所產生的強大吸力能完全地吸附待加工工件使其平貼在平整的承載頂面上，藉此，能有效地將翹曲之待加工工件整平。 Therefore, the main object of the present invention is to provide a carrying device that absorbs a workpiece to be processed by suction generated by an air suction passage of a carrier, so that the workpiece to be processed can be stably and surely positioned on the top surface of the carrier. . Furthermore, the workpiece to be processed is adsorbed by vacuuming the airflow path, and the strong suction force generated by vacuum adsorption can completely adsorb the workpiece to be processed and flatten it on the flat top surface of the bearing, thereby enabling Effectively flatten the warped workpiece to be machined.
於是本發明的承載裝置，適於承載一待加工工件，該承載裝置包含一承載盤，及一升降機構。 Therefore, the carrying device of the present invention is adapted to carry a workpiece to be processed, and the carrying device comprises a carrying tray and a lifting mechanism.
承載盤包括一可承載該待加工工件的承載頂面，及一底面，該承載盤界定出複數個貫穿該承載頂面與該底面的穿孔，及一貫穿該承載頂面與該底面並可對該待加工工件吸氣的第一吸氣流道，各該穿孔包含一形成於該底面的下開口、一連通於該下開口的容置孔部，及一下肩部，該容置孔部直徑大於該下開口直徑，該下肩部界定於該容置孔部與該下開口之間，升降機構包括複數個銷桿組件，各該銷桿組件經由對應的該穿孔的該下開口穿伸至該容置孔部內，各該銷桿組件可在一氣密位置及一承接位置之 間移動，當各該銷桿組件在該氣密位置時，各該銷桿組件抵接於該下肩部並封閉該下開口，當各該銷桿組件在該承接位置時，各該銷桿組件部分穿伸出該承載頂面並可承接該待加工工件。 The carrier tray includes a carrier top surface that can carry the workpiece to be processed, and a bottom surface. The carrier tray defines a plurality of through holes extending through the top surface of the carrier and the bottom surface, and a through-top surface and the bottom surface are The first air suction channel for inhaling the workpiece to be processed, each of the through holes includes a lower opening formed on the bottom surface, a receiving hole portion connected to the lower opening, and a lower shoulder portion, the diameter of the receiving hole portion Larger than the lower opening diameter, the lower shoulder is defined between the receiving hole portion and the lower opening, the lifting mechanism includes a plurality of pin assemblies, each of the pin assemblies extending through the corresponding lower opening of the through hole to In the receiving hole portion, each of the pin assemblies can be in an airtight position and a receiving position Moving between, when each of the pin assemblies is in the airtight position, each of the pin assemblies abuts against the lower shoulder and closes the lower opening, and when the pin assemblies are in the receiving position, each of the pins The component portion extends through the top surface of the carrier and can receive the workpiece to be processed.
該承載盤更包括一外周面，該承載裝置更包含一套接於該外周面的彈性環，該彈性環包括一上端緣，該上端緣高度高於該承載頂面高度並用以供該待加工工件抵接。 The carrying tray further includes an outer peripheral surface, and the carrying device further comprises a set of elastic rings connected to the outer peripheral surface, the elastic ring includes an upper end edge, the upper end edge height is higher than the height of the carrying top surface and is used for the processing The workpiece abuts.
該外周面包含一與該承載頂面相連接的立面部，及一連接於該立面部底端的平面部，該彈性環更包括一抵靠於該平面部的定位環部，及一由該定位環部外緣朝上延伸的彎折環部，該彎折環部具有該上端緣並與該立面部相間隔，該承載盤更界定一貫穿該立面部與該底面的第二吸氣流道，該第二吸氣流道與該彎折環部位置相對應。 The outer peripheral surface includes a vertical surface connected to the top surface of the carrying surface, and a flat portion connected to the bottom end of the vertical surface, the elastic ring further includes a positioning ring portion abutting against the flat portion, and a a bending ring portion extending outwardly from an outer edge of the ring portion, the bending ring portion having the upper end edge and spaced apart from the vertical surface portion, the carrier plate further defining a second suction penetrating the vertical surface portion and the bottom surface The air flow path corresponding to the position of the bending ring portion.
該立面部凹陷形成一鄰近該平面部的環形卡槽，該定位環部內緣卡接於該環形卡槽內，該彎折環部具有一由該定位環部外緣朝上並朝該立面部方向傾斜延伸的第一傾斜段，及一由該第一傾斜段頂端朝上並朝遠離該立面部方向傾斜延伸的第二傾斜段。 The vertical recess is formed with an annular card slot adjacent to the planar portion, and the inner edge of the positioning ring is engaged in the annular card slot, and the bent ring portion has an outer edge of the positioning ring portion facing upwards and facing the stand a first inclined section extending obliquely in the direction of the face, and a second inclined section extending upward from the top end of the first inclined section and obliquely extending away from the direction of the standing face.
各該銷桿組件包含設置於對應的該穿孔的該容置孔部內的一上銷桿及一偏壓彈簧，各該上銷桿包含一用以抵接於該下肩部以封閉該下開口的底端，及一用以承接該待加工工件的頂端，該偏壓彈簧用以對該上銷桿朝下偏壓使該底端迫緊接觸於該下肩部。 Each of the pin assemblies includes an upper pin disposed in the corresponding receiving hole of the through hole and a biasing spring, each of the upper pins including a pair for abutting the lower shoulder to close the lower opening The bottom end, and a top end for receiving the workpiece to be processed, the biasing spring is used to bias the upper pin downward so that the bottom end is in tight contact with the lower shoulder.
各該上銷桿是由彈性材質所製成，各該上銷桿更包含一具有該底端的底壁，及一由該底壁朝上凸伸並具有該頂端的桿體，該底壁直徑分別大於該下開口直徑及該桿體直徑。 Each of the upper pins is made of an elastic material, and each of the upper pins further includes a bottom wall having the bottom end, and a rod body protruding upward from the bottom wall and having the top end, the bottom wall diameter The diameter of the lower opening and the diameter of the rod are respectively greater.
各該上銷桿更包含一由該底壁外周緣朝上凸伸並與該桿體相間隔的周壁，各該穿孔更包含一連接於該下肩部的內孔面部，各該上銷桿的該周壁可滑動地接觸於該內孔面部。 Each of the upper pins further includes a peripheral wall extending upward from the outer peripheral edge of the bottom wall and spaced apart from the rod body, each of the through holes further including an inner hole surface portion connected to the lower shoulder portion, and each of the upper pins The peripheral wall is slidably contacted to the inner bore portion.
各該穿孔更包含一形成於該承載頂面並與該容置孔部相連通的上開口，及一上肩部，該容置孔部直徑大於該上開口直徑，該上肩部界定於該容置孔部與該上開口之間並與該內孔面部相連接，該桿體可穿伸出該上開口，該偏壓彈簧上下兩端分別抵接於該上肩部與該底壁。 Each of the through holes further includes an upper opening formed on the top surface of the carrier and communicating with the receiving hole portion, and an upper shoulder portion having a diameter larger than the diameter of the upper opening, the upper shoulder portion being defined by the upper opening The accommodating hole portion and the upper opening are connected to the inner hole surface portion, and the rod body can extend through the upper opening, and the upper and lower ends of the biasing spring abut against the upper shoulder portion and the bottom wall respectively.
該承載盤更包括一盤體，及複數個連接環，該盤體界定出該承載頂面與該第一吸氣流道，各該連接環用以承載對應的該上銷桿，該等連接環鎖固於該盤體並與該盤體共同界定出該等穿孔及該底面。 The carrier tray further includes a disk body and a plurality of connecting rings, the disk body defines the bearing top surface and the first air suction channel, and the connecting ring is configured to carry the corresponding upper pin, the connection A ring is secured to the disk and defines the perforations and the bottom surface together with the disk.
各該銷桿組件更包含一穿設於對應的該下開口的下銷桿，該下銷桿頂端頂抵於對應的該上銷桿的該底端，該升降機構更包括一連接於該下銷桿底端的致動組件，該致動組件用以帶動各該銷桿組件在該氣密位置及該承接位置之間移動。 Each of the pin assemblies further includes a lower pin disposed through the corresponding lower opening, the top end of the lower pin abutting against the bottom end of the corresponding upper pin, the lifting mechanism further comprising a connection An actuating assembly at the bottom end of the pin, the actuating assembly for moving the pin assembly between the airtight position and the receiving position.
本發明之功效在於：藉由升降機構的各銷桿組件及彈性環的設計，使得承載盤的第一吸氣流道及第二吸 氣流道能對腔室抽真空，並以抽真空的方式吸附待加工工件，藉此，使待加工工件能穩固且確實地定位在承載盤的承載頂面。再者，藉由真空吸附所產生的強大吸力能完全地吸附待加工工件使其平貼在平整的承載頂面上，藉此，能有效地將翹曲之待加工工件整平。 The effect of the invention is that the first suction air channel and the second suction of the carrier disk are designed by the design of each pin assembly and the elastic ring of the lifting mechanism The airflow path can evacuate the chamber and suck the workpiece to be processed by vacuuming, thereby enabling the workpiece to be processed to be stably and surely positioned on the top surface of the carrier. Moreover, the strong suction force generated by vacuum adsorption can completely adsorb the workpiece to be processed to be flat on the flat bearing top surface, thereby effectively flattening the warped workpiece to be processed.
1‧‧‧待加工工件 1‧‧‧Workpieces to be machined
231‧‧‧下環面 231‧‧‧ Lower annulus
11‧‧‧底面 11‧‧‧ bottom
232‧‧‧下通孔 232‧‧‧Under hole
12‧‧‧外周緣 12‧‧‧ outer periphery
24‧‧‧螺絲 24‧‧‧ screws
200‧‧‧承載裝置 200‧‧‧ Carrying device
25‧‧‧穿孔 25‧‧‧Perforation
2‧‧‧承載盤 2‧‧‧ Carrying tray
251‧‧‧下開口 251‧‧‧ opening
21‧‧‧盤體 21‧‧‧ dish
252‧‧‧上開口 252‧‧‧Opening
211‧‧‧承載頂面 211‧‧‧bearing top surface
253‧‧‧容置孔部 253‧‧‧ accommodating holes
212‧‧‧下表面 212‧‧‧ lower surface
254‧‧‧下肩部 254‧‧‧lower shoulder
213‧‧‧凹槽 213‧‧‧ Groove
255‧‧‧上肩部 255‧‧‧Upper shoulder
214‧‧‧底面 214‧‧‧ bottom
256‧‧‧內孔面部 256‧‧‧ hole face
215‧‧‧上通孔 215‧‧‧through hole
3‧‧‧升降機構 3‧‧‧ Lifting mechanism
216‧‧‧第一吸氣流道 216‧‧‧First suction channel
31‧‧‧汽缸 31‧‧‧ cylinder
217‧‧‧第一溝槽 217‧‧‧ first trench
32‧‧‧升降架 32‧‧‧lifting frame
218‧‧‧第二溝槽 218‧‧‧Second trench
33‧‧‧銷桿組件 33‧‧‧ pin assembly
219‧‧‧氣孔 219‧‧‧ stomata
331‧‧‧上銷桿 331‧‧‧Upper pole
220‧‧‧外周面 220‧‧‧ outer perimeter
332‧‧‧下銷桿 332‧‧‧Under the pin
221‧‧‧上立面部 221‧‧‧Upstanding face
333‧‧‧底壁 333‧‧‧ bottom wall
222‧‧‧下立面部 222‧‧‧Lower face
334‧‧‧桿體 334‧‧‧ rod body
223‧‧‧平面部 223‧‧‧Flat Department
335‧‧‧周壁 335‧‧‧Wall
224‧‧‧環形卡槽 224‧‧‧Ring card slot
336‧‧‧底端 336‧‧‧ bottom
225‧‧‧第二吸氣流道 225‧‧‧Second suction channel
337‧‧‧偏壓彈簧 337‧‧‧bias spring
23‧‧‧連接環 23‧‧‧Connecting ring
338‧‧‧頂端 338‧‧‧Top
4‧‧‧彈性環 4‧‧‧Flexible ring
432‧‧‧第二傾斜段 432‧‧‧Second inclined section
41‧‧‧上端緣 41‧‧‧Upper edge
51‧‧‧第一氣嘴 51‧‧‧ first gas nozzle
42‧‧‧定位環部 42‧‧‧ positioning ring
52‧‧‧第二氣嘴 52‧‧‧second gas nozzle
43‧‧‧彎折環部 43‧‧‧Bend ring
6‧‧‧腔室 6‧‧‧ chamber
431‧‧‧第一傾斜段 431‧‧‧First inclined section
I、II‧‧‧箭頭 I, II‧‧‧ arrows
本發明之其他的特徵及功效，將於參照圖式的實施方式中清楚地呈現，其中：圖1是本發明承載裝置之一實施例的立體圖；圖2是本發明承載裝置之一實施例的立體分解圖，說明承載盤、升降機構及彈性環之間的組裝關係；圖3是本發明承載裝置之一實施例由另一視角觀看的立體分解圖，說明承載盤、升降機構及彈性環之間的組裝關係；圖4是本發明承載裝置之一實施例的俯視圖，說明承載頂面凹陷形成有第一溝槽及第二溝槽；圖5是沿圖4中的V-V線所截取的剖視示意圖，說明銷桿組件位在氣密位置，上銷桿的底端抵接於下肩部並封閉下開口；圖6是沿圖4中的VI-VI線所截取的剖視示意圖，說明承載盤的盤體形成有第一吸氣流道及第二吸氣流道，以及彈性環與盤體之間的組裝關係；圖7是本發明承載裝置之一實施例的剖視示意圖，說明汽缸透過升降架帶動銷桿組件上移至承接位置，上銷桿 的桿體穿伸出承載頂面；圖8是本發明承載裝置之一實施例的剖視示意圖，說明移載裝置將待加工工件置放於上銷桿的頂端；圖9是本發明承載裝置之一實施例的剖視示意圖，說明汽缸透過升降架帶動下銷桿下移，偏壓彈簧藉由蓄積的復位彈力驅使上銷桿復位，使上銷桿的底端迫緊接觸於下肩部；圖10是本發明承載裝置之一實施例的剖視示意圖，說明待加工工件的底面抵接於承載盤的承載頂面，且彈性環的上端緣抵接於待加工工件的底面鄰近於外周緣處；及圖11是本發明承載裝置之一實施例的剖視示意圖，說明第一吸氣流道及第二吸氣流道吸氣，並將腔室抽真空，能穩固地將待加工工件吸附並定位於承載頂面，並將翹曲之待加工工件整平。 Other features and advantages of the present invention will be apparent from the embodiments of the present invention. FIG. 1 is a perspective view of an embodiment of the carrying device of the present invention. FIG. 2 is an embodiment of the carrying device of the present invention. 3 is an exploded perspective view illustrating an assembly relationship between a carrier disk, a lifting mechanism, and an elastic ring; FIG. 3 is an exploded perspective view of an embodiment of the carrier device of the present invention viewed from another viewing angle, illustrating a carrier disk, a lifting mechanism, and an elastic ring. FIG. 4 is a plan view showing an embodiment of the carrier device of the present invention, illustrating that the top surface of the carrier is recessed with a first trench and a second trench; FIG. 5 is a cross section taken along the line VV of FIG. Referring to the schematic view, the pin assembly is in an airtight position, the bottom end of the upper pin abuts against the lower shoulder and closes the lower opening; FIG. 6 is a cross-sectional view taken along line VI-VI of FIG. The disk body of the carrier disk is formed with a first air suction channel and a second air intake channel, and an assembly relationship between the elastic ring and the disk body; FIG. 7 is a cross-sectional view of an embodiment of the carrier device of the present invention, illustrating The cylinder drives the pin through the lifting frame Receiving member moves to a position on the pin Figure 8 is a schematic cross-sectional view of an embodiment of the carrying device of the present invention, illustrating the transfer device placing the workpiece to be processed on the top end of the upper pin; Figure 9 is the carrying device of the present invention A schematic cross-sectional view of one embodiment illustrates that the cylinder moves the lower pin down through the lifting frame, and the biasing spring drives the upper pin to be reset by the accumulated reset elastic force, so that the bottom end of the upper pin is tightly contacted with the lower shoulder. Figure 10 is a cross-sectional view showing an embodiment of the carrying device of the present invention, illustrating that the bottom surface of the workpiece to be processed abuts against the load bearing top surface of the carrier, and the upper end edge of the elastic ring abuts against the bottom surface of the workpiece to be processed adjacent to the outer circumference And FIG. 11 is a schematic cross-sectional view showing an embodiment of the carrying device of the present invention, illustrating that the first air suction channel and the second air suction channel are inhaled, and the chamber is evacuated to be stably processed. The workpiece is adsorbed and positioned on the top surface of the load, and the warped workpiece to be processed is leveled.
參閱圖1，是本發明承載裝置之一實施例，承載裝置200是應用在晶圓的半導體的曝光製程中，適於承載一待加工工件1(如圖8所示)，在本實施例中，待加工工件1是以一晶圓為例作說明。 1 is an embodiment of a carrier device of the present invention. The carrier device 200 is applied to a semiconductor semiconductor exposure process and is adapted to carry a workpiece 1 to be processed (as shown in FIG. 8). In this embodiment, The workpiece to be processed 1 is illustrated by taking a wafer as an example.
參閱圖2、圖3、圖4及圖5，承載裝置200包含一承載盤2、一升降機構3，及一彈性環4。承載盤2包括一盤體21，及複數個連接環23。盤體21包含一可承載待加工工件1(如圖8所示)的承載頂面211，及一相反於承載頂面211的下表面212。承載頂面211呈平整狀。下表面 212向上凹陷形成複數個凹槽213，各連接環23設置於對應的凹槽213內，各連接環23透過複數個螺絲24鎖固於盤體21，使得各連接環23能穩固地定位在對應的凹槽213內。各連接環23包含一下環面231，盤體21的下表面212與各連接環23的下環面231共同界定出承載盤2的一底面214。此外，盤體21形成有複數個延伸至承載頂面211且分別與該等凹槽213相連通的上通孔215，各連接環23形成有一與對應的上通孔215相連通的下通孔232，盤體21的該等上通孔215分別與該等連接環23的下通孔232共同界定出複數個貫穿承載頂面211與底面214的穿孔25。 2, 3, 4 and 5, the carrying device 200 comprises a carrying tray 2, a lifting mechanism 3, and an elastic ring 4. The carrier tray 2 includes a disk body 21 and a plurality of connection rings 23. The disk body 21 includes a carrier top surface 211 that can carry the workpiece 1 to be processed (as shown in FIG. 8), and a lower surface 212 that is opposite to the carrier top surface 211. The carrying top surface 211 is flat. lower surface A plurality of recesses 213 are formed in the recesses 212, and the connecting loops 23 are disposed in the corresponding recesses 213. The connecting loops 23 are locked to the disc body 21 through a plurality of screws 24, so that the connecting loops 23 can be stably positioned correspondingly. Inside the groove 213. Each of the connecting rings 23 includes a lower toroidal surface 231, and the lower surface 212 of the disk body 21 and the lower annular surface 231 of each of the connecting rings 23 together define a bottom surface 214 of the carrier disk 2. In addition, the disk body 21 is formed with a plurality of upper through holes 215 extending to the carrying top surface 211 and communicating with the grooves 213 respectively, and each connecting ring 23 is formed with a lower through hole communicating with the corresponding upper through hole 215. 232. The upper through holes 215 of the disk body 21 respectively define a plurality of through holes 25 penetrating the bearing top surface 211 and the bottom surface 214 together with the lower through holes 232 of the connecting rings 23.
各穿孔25包含一形成於底面214的下開口251、一形成於承載頂面211的上開口252，及一連通於下開口251與上開口252之間的容置孔部253，其中，容置孔部253直徑分別大於下開口251直徑及上開口252直徑。各穿孔25更包含一界定於下開口251與容置孔部253之間的下肩部254、一界定於上開口252與容置孔部253之間的上肩部255，及一連接於下肩部254與上肩部255之間的內孔面部256。 Each of the through holes 25 includes a lower opening 251 formed in the bottom surface 214, an upper opening 252 formed in the carrying top surface 211, and a receiving hole portion 253 communicating between the lower opening 251 and the upper opening 252. The diameter of the hole portion 253 is larger than the diameter of the lower opening 251 and the diameter of the upper opening 252, respectively. Each of the through holes 25 further includes a lower shoulder 254 defined between the lower opening 251 and the receiving hole 253, an upper shoulder 255 defined between the upper opening 252 and the receiving hole 253, and a lower joint 255. An inner bore portion 256 between the shoulder 254 and the upper shoulder 255.
升降機構3包括一致動組件，及複數個與致動組件相連接的銷桿組件33，致動組件包含一汽缸31，及一連接於汽缸31底端的升降架32，銷桿組件33連接於升降架32上。汽缸31透過例如螺鎖方式鎖固於盤體21的下表面212，汽缸31可帶動升降架32向上或向下移動。各銷桿組件33經由對應的穿孔25的下開口251穿伸至容置孔部 253內，汽缸31可透過升降架32帶動各銷桿組件33在一氣密位置(如圖5所示)及一承接位置(如圖7所示)之間移動。當各銷桿組件33在氣密位置時，各銷桿組件33抵接於下肩部254並封閉下開口251，當各銷桿組件33在承接位置時，各銷桿組件33部分穿伸出承載頂面211並可承接待加工工件1。 The lifting mechanism 3 includes an actuating assembly and a plurality of pin assemblies 33 coupled to the actuating assembly. The actuating assembly includes a cylinder 31 and a lifting frame 32 coupled to the bottom end of the cylinder 31. The pin assembly 33 is coupled to the lifting frame On the shelf 32. The cylinder 31 is locked to the lower surface 212 of the disk body 21 by, for example, a screw lock, and the cylinder 31 can move the crane frame 32 upward or downward. Each pin assembly 33 extends through the lower opening 251 of the corresponding through hole 25 to the receiving hole portion In 253, the cylinder 31 can move the pin assemblies 33 between the airtight position (as shown in FIG. 5) and a receiving position (shown in FIG. 7) through the lifting frame 32. When the pin assemblies 33 are in the airtight position, the pin assemblies 33 abut against the lower shoulders 254 and close the lower opening 251. When the pin assemblies 33 are in the receiving position, the pin assemblies 33 are partially extended. The top surface 211 is carried and can receive the workpiece 1 .
各銷桿組件33包含一設置於承載盤2的對應穿孔25的容置孔部253內的上銷桿331，及一設置於升降架32頂端的下銷桿332。各上銷桿331是由例如為矽膠等材質所製成，各上銷桿331包括一底壁333、一由底壁333頂端朝上凸伸的桿體334，及一由底壁333外周緣朝上凸伸並與桿體334相間隔的周壁335。底壁333呈圓形且其直徑分別大於下開口251直徑及桿體334直徑，底壁333具有一用以抵接於下肩部254以封閉下開口251的底端336，藉此，使底壁333與下開口251之間能保持氣密狀態。桿體334直徑小於上開口252直徑，桿體334可穿伸出上開口252以承接待加工工件1。周壁335可滑動地接觸於內孔面部256。各下銷桿332底端透過例如螺鎖方式鎖固於升降架32頂端，各下銷桿332頂端穿設於對應穿孔25的下開口251並頂抵於對應上銷桿331的底端336。 Each of the pin assemblies 33 includes an upper pin 331 disposed in the receiving hole portion 253 of the corresponding through hole 25 of the carrier disk 2, and a lower pin 332 disposed at the top end of the lifting frame 32. Each of the upper pins 331 is made of a material such as silicone, and each of the upper pins 331 includes a bottom wall 333, a rod 334 protruding upward from the top end of the bottom wall 333, and an outer periphery of the bottom wall 333. A peripheral wall 335 that projects upward and is spaced from the rod 334. The bottom wall 333 is circular and has a diameter larger than the diameter of the lower opening 251 and the diameter of the rod 334, respectively. The bottom wall 333 has a bottom end 336 for abutting the lower shoulder 254 to close the lower opening 251, thereby making the bottom The wall 333 and the lower opening 251 can be kept in an airtight state. The rod body 334 has a smaller diameter than the upper opening 252, and the rod body 334 can extend through the upper opening 252 to receive the workpiece 1. The peripheral wall 335 slidably contacts the inner bore portion 256. The bottom end of each lower pin 332 is locked to the top end of the lifting frame 32 by, for example, a screw lock. The top end of each lower pin 332 is disposed through the lower opening 251 of the corresponding through hole 25 and abuts against the bottom end 336 of the corresponding upper pin 331.
在本實施例中，各銷桿組件33更包含一設置於對應的穿孔25的容置孔部253內的偏壓彈簧337。偏壓彈簧337為一套設於桿體334且上下兩端分別抵接於上肩部255與底壁333的壓縮彈簧，偏壓彈簧337用以對上銷桿 331的底壁333朝下偏壓，藉此，使得底壁333的底端336能迫緊接觸於下肩部254，以確保底壁333的底端336與下肩部254之間能保持良好的氣密接觸狀態。 In this embodiment, each of the pin assemblies 33 further includes a biasing spring 337 disposed in the receiving hole portion 253 of the corresponding through hole 25. The biasing spring 337 is a set of compression springs disposed on the rod body 334 and the upper and lower ends respectively abut against the upper shoulder portion 255 and the bottom wall 333. The biasing spring 337 is used for the upper pin rod. The bottom wall 333 of the 331 is biased downwardly, whereby the bottom end 336 of the bottom wall 333 can be brought into tight contact with the lower shoulder 254 to ensure good retention between the bottom end 336 of the bottom wall 333 and the lower shoulder 254. The state of airtight contact.
欲將上銷桿331及偏壓彈簧337組裝於承載盤2的穿孔25內時，首先，先將各上銷桿331置於對應連接環23的下通孔232內，使連接環23承載上銷桿331。隨後，將各偏壓彈簧337套設於對應上銷桿331的桿體334上，使偏壓彈簧337下端抵接於底壁333。接著，將各連接環23置入對應的凹槽213內，使上銷桿331的桿體334穿伸至盤體21的上通孔215內，以及偏壓彈簧337上端抵接於上肩部255。最後，透過螺絲24將連接環23鎖固於盤體21，即完成組裝的動作。藉由連接環23可透過鎖固方式鎖固於盤體21的設計方式，能提升上銷桿331及偏壓彈簧337組裝時的便利性。 When the upper pin 331 and the biasing spring 337 are to be assembled in the through hole 25 of the carrier disk 2, first, the upper pin 331 is first placed in the lower through hole 232 of the corresponding connecting ring 23, so that the connecting ring 23 is carried. Pin 331. Then, the biasing springs 337 are sleeved on the rod body 334 corresponding to the upper pin 331 such that the lower end of the biasing spring 337 abuts against the bottom wall 333. Then, the connecting ring 23 is placed in the corresponding groove 213, the rod body 334 of the upper pin 331 is penetrated into the upper through hole 215 of the disk body 21, and the upper end of the biasing spring 337 abuts against the upper shoulder portion. 255. Finally, the connecting ring 23 is locked to the disk body 21 by the screws 24, that is, the assembly operation is completed. By the design of the connection ring 23 that can be locked to the disk body 21 by locking, the convenience of assembling the upper pin 331 and the biasing spring 337 can be improved.
特別說明的是，在設計時，各下銷桿332與對應上銷桿331之間的連接關係也可有下述的變化：各下銷桿332頂端與對應上銷桿331的底壁333之間可透過例如卡接方式、螺接方式或一體成型方式固定地連接在一起，藉此，可省略偏壓彈簧337的設置，使得各銷桿組件33的下銷桿332及上銷桿331同樣能在氣密位置與承接位置之間上下移動。 Specifically, in the design, the connection relationship between each of the lower pins 332 and the corresponding upper pin 331 may also have the following changes: the top end of each lower pin 332 and the bottom wall 333 of the corresponding upper pin 331 The two can be fixedly coupled together by, for example, a snap-on method, a screwing method, or an integral molding method, whereby the arrangement of the biasing springs 337 can be omitted, so that the lower pin 332 and the upper pin 331 of each pin assembly 33 are the same. It can move up and down between the airtight position and the receiving position.
參閱圖4、圖5及圖6，承載盤2的盤體21界定有一貫穿承載頂面211與底面214的第一吸氣流道216，第一吸氣流道216包含三條由承載頂面211向下凹陷的 第一溝槽217、複數個由承載頂面211向下凹陷的第二溝槽218，及一貫穿承載頂面211與底面214的氣孔219。各第一溝槽217呈長形狀，各第一溝槽217由承載頂面211中心向外延伸，三條第一溝槽217內側端彼此相連通。該等第二溝槽218呈同心圓狀地彼此相間隔排列且分別具有不同直徑，該等第二溝槽218與該等第一溝槽217相連通。氣孔219頂端位於盤體21中心並且連通於第一溝槽217內側端，氣孔219底端用以供一第一氣嘴51插置，第一氣嘴51與一抽氣機構(圖未示)相連接。當抽氣機構運作時，第一氣嘴51能透過氣孔219對第一溝槽217及第二溝槽218抽氣，藉此，第一溝槽217及第二溝槽218所產生的吸力能將待加工工件1穩固地吸附在承載頂面211上。 Referring to FIG. 4, FIG. 5 and FIG. 6, the disk body 21 of the carrier tray 2 defines a first air intake channel 216 extending through the top surface 211 and the bottom surface 214. The first air suction channel 216 includes three top surfaces 211. Shrinking downward The first trench 217, a plurality of second trenches 218 recessed downwardly from the carrying top surface 211, and a vent 219 extending through the top surface 211 and the bottom surface 214. Each of the first trenches 217 has a long shape, and each of the first trenches 217 extends outward from the center of the carrying top surface 211, and the inner ends of the three first trenches 217 communicate with each other. The second trenches 218 are concentrically arranged with each other and have different diameters, and the second trenches 218 are in communication with the first trenches 217. The top end of the air hole 219 is located at the center of the disk body 21 and communicates with the inner end of the first groove 217. The bottom end of the air hole 219 is for inserting a first air nozzle 51, and the first air nozzle 51 and a pumping mechanism (not shown) Connected. When the air suction mechanism is in operation, the first air nozzle 51 can pump the first trench 217 and the second trench 218 through the air hole 219, whereby the suction energy generated by the first trench 217 and the second trench 218 can be generated. The workpiece 1 to be processed is firmly adsorbed on the carrier top surface 211.
由於待加工工件1經過多道的半導體製程加工後，待加工工件1會呈略微翹曲而非完全平整的狀態，因此，為了避免第一吸氣流道216的第一溝槽217及第二溝槽218在抽氣的過程中，外部氣體會持續地經由待加工工件1的一底面11(如圖8所示)與承載頂面211之間的間隙流入，本實施例的承載裝置200透過彈性環4的設計來克服前述問題。在本實施例中，承載盤2的盤體21更包含一連接於承載頂面211與下表面212之間的外周面220，彈性環4是由例如為矽膠或橡膠等彈性材質所製成，彈性環4套接於外周面220上並包括一上端緣41，上端緣41高度高於承載頂面211高度，上端緣41用以抵接在待加工工件1的底面11且鄰近於待加工工件1的一外周緣12(如圖8所 示)，彈性環4的上端緣41與待加工工件1的底面11之間是呈氣密接觸的狀態。 Since the workpiece 1 to be processed is processed by a plurality of semiconductor processes, the workpiece 1 to be processed may be slightly warped rather than completely flat. Therefore, in order to avoid the first trench 217 and the second of the first air intake path 216 During the pumping process, the external gas continuously flows through the gap between the bottom surface 11 of the workpiece 1 to be processed (as shown in FIG. 8) and the load bearing top surface 211. The carrier device 200 of the embodiment transmits The design of the elastic ring 4 overcomes the aforementioned problems. In this embodiment, the disk body 21 of the carrier tray 2 further includes an outer peripheral surface 220 connected between the bearing top surface 211 and the lower surface 212. The elastic ring 4 is made of an elastic material such as silicone rubber or rubber. The elastic ring 4 is sleeved on the outer peripheral surface 220 and includes an upper end edge 41. The upper end edge 41 has a height higher than the height of the load bearing top surface 211. The upper end edge 41 is for abutting against the bottom surface 11 of the workpiece 1 to be processed and adjacent to the workpiece to be processed. An outer circumference 12 of 1 (as shown in Figure 8 It is shown that the upper end edge 41 of the elastic ring 4 is in airtight contact with the bottom surface 11 of the workpiece 1 to be processed.
當彈性環4的上端緣41抵接在待加工工件1的底面11時，彈性環4、待加工工件1以及承載盤2的盤體21之間共同界定一呈氣密狀態的腔室6(如圖9所示)。第一溝槽217及第二溝槽218在吸氣的過程中，由於位在彈性環4外部環境的空氣無法被吸入腔室6內，因此，第一溝槽217及第二溝槽218能對腔室6抽真空並以真空吸附方式吸附待加工工件1。由於真空吸附時所產生的強大吸力能完全地吸附待加工工件1使其平貼在平整的承載頂面211上，藉此，除了能穩固地將待加工工件1吸附並定位在承載頂面211之外，還能能有效地將翹曲之待加工工件1整平。 When the upper end edge 41 of the elastic ring 4 abuts against the bottom surface 11 of the workpiece 1 to be processed, the elastic ring 4, the workpiece 1 to be processed, and the disk body 21 of the carrier disk 2 jointly define a chamber 6 in an airtight state ( As shown in Figure 9). During the process of inhaling, the first groove 217 and the second groove 218 cannot be sucked into the chamber 6 due to the air located in the external environment of the elastic ring 4, so the first groove 217 and the second groove 218 can The chamber 6 is evacuated and the workpiece 1 to be processed is adsorbed by vacuum adsorption. Due to the strong suction generated during vacuum adsorption, the workpiece 1 to be processed can be completely adsorbed to be flat on the flat bearing top surface 211, whereby the workpiece 1 to be processed can be stably adsorbed and positioned on the bearing top surface 211. In addition, it is also possible to effectively flatten the warped workpiece 1 to be processed.
更具體地，盤體21的外周面220包括一與承載頂面211相連接的上立面部221、一與下表面212相連接的下立面部222，及一連接於上立面部221底端與下立面部222頂端之間的平面部223，其中，上立面部221凹陷形成一鄰***面部223的環形卡槽224。彈性環4包括一定位環部42，及一由定位環部42外緣朝上延伸並與上立面部221相間隔的彎折環部43，定位環部42內緣卡接於環形卡槽224內，使得定位環部42能抵靠並定位於平面部223上。彎折環部43具有一由定位環部42外緣朝上並朝上立面部221方向傾斜延伸的第一傾斜段431，及一由第一傾斜段431頂端朝上並朝遠離上立面部221方向傾斜延伸的第二 傾斜段432，第二傾斜段432具有用以抵接待加工工件1的底面11的上端緣41。 More specifically, the outer peripheral surface 220 of the disk body 21 includes an upper surface portion 221 connected to the carrier top surface 211, a lower surface portion 222 connected to the lower surface 212, and a upper surface portion 221 connected thereto. A flat portion 223 between the bottom end and the top end of the lower standing portion 222, wherein the upper standing portion 221 is recessed to form an annular card slot 224 adjacent to the flat portion 223. The elastic ring 4 includes a positioning ring portion 42 and a bending ring portion 43 extending upward from the outer edge of the positioning ring portion 42 and spaced apart from the upper surface portion 221. The inner edge of the positioning ring portion 42 is engaged with the annular card slot. Within 224, the positioning ring portion 42 is allowed to abut and be positioned on the planar portion 223. The bending ring portion 43 has a first inclined portion 431 extending obliquely upward from the outer edge of the positioning ring portion 42 and facing the upper façade 221, and a top end of the first inclined portion 431 facing upward and away from the upper façade The second portion of the portion 221 is obliquely extended The inclined section 432 has an upper end edge 41 for receiving the bottom surface 11 of the workpiece 1 .
承載盤2的盤體21更界定有一貫穿上立面部221與底面214的第二吸氣流道225，第二吸氣流道225形成於上立面部221的一端對應於彈性環4的彎折環部43，第二吸氣流道225底端則用以供一第二氣嘴52插置，第二氣嘴52與抽氣機構(圖未示)相連接。當抽氣機構運作時，第二氣嘴52能透過第二吸氣流道225對腔室6吸氣，藉此，能加速對腔室6抽真空的速度。此外，藉由彎折環部43的第一傾斜段431及第二傾斜段432的設計，使得第二吸氣流道225在吸氣抽真空的過程中，彎折環部43較容易朝向上立面部221方向凹陷變形。需說明的是，彈性環4的彎折環部43也可設計成朝向上立面部221方向凹陷的弧形狀，且前述弧形狀彎折環部43的開口朝向外側，彎折環部43的形狀不以本實施例所揭露的為限。 The disk body 21 of the carrier disk 2 further defines a second air intake channel 225 extending through the upper surface portion 221 and the bottom surface 214. The second air intake channel 225 is formed at one end of the upper surface portion 221 corresponding to the elastic ring 4. The second ring nozzle 52 is connected to a suction mechanism (not shown). When the pumping mechanism is in operation, the second air nozzle 52 can inhale the chamber 6 through the second air intake passage 225, whereby the speed at which the chamber 6 is evacuated can be accelerated. In addition, by the design of the first inclined section 431 and the second inclined section 432 of the bending ring portion 43, the second air suction passage 225 is relatively easy to face in the process of suction and vacuuming. The façade 221 is concavely deformed. It should be noted that the bending ring portion 43 of the elastic ring 4 may also be designed in an arc shape that is recessed toward the upper surface portion 221, and the opening of the arc-shaped bending ring portion 43 faces outward, and the bending portion is bent. The shape of 43 is not limited to the one disclosed in the embodiment.
參閱圖7、圖8及圖9，本實施例的待加工工件1是以經過多道半導體製程加工後而產生翹曲現象的晶圓為例作說明，其中，圖式所繪製的待加工工件1是以中間區域呈平整狀，而鄰近外周緣12的區域略往上翹曲為例。 Referring to FIG. 7 , FIG. 8 and FIG. 9 , the workpiece 1 to be processed in the embodiment is described by taking a wafer which is warped after being processed by a plurality of semiconductor processes as an example, wherein the workpiece to be processed is drawn by the drawing. 1 is an example in which the intermediate portion is flat, and the region adjacent to the outer peripheral edge 12 is slightly warped upward.
欲藉由承載裝置200承載待加工工件1以進行曝光作業時，首先，升降機構3的汽缸31會透過升降架32帶動各下頂桿332沿箭頭I方向往上移動，各下頂桿332會經由下開口251穿伸至容置孔部253內並將對應上銷桿331往上頂推，使上銷桿331移動至圖7所示的承接位置。 此時，各上銷桿331的桿體334一部分穿伸出上開口252及承載頂面211，桿體334的一頂端338間隔位於承載頂面211上方一段距離，且頂端338的高度高於彈性環4的上端緣41高度。各上銷桿331的底壁333會壓縮偏壓彈簧337使其壓縮變形並蓄積復位彈力。 When the workpiece 1 to be processed is carried by the carrying device 200 to perform the exposure operation, first, the cylinder 31 of the lifting mechanism 3 drives the lower ejector pins 332 to move upward in the direction of the arrow I through the lifting frame 32, and the lower ejector pins 332 will The lower pin 251 is inserted into the accommodating hole portion 253 and the corresponding pin 331 is pushed up, so that the upper pin 331 is moved to the receiving position shown in FIG. At this time, a portion of the rod body 334 of each of the upper pins 331 extends through the upper opening 252 and the bearing top surface 211. A top end 338 of the rod body 334 is spaced apart above the bearing top surface 211, and the height of the top end 338 is higher than the elasticity. The upper end edge 41 of the ring 4 is raised in height. The bottom wall 333 of each of the upper pins 331 compresses the biasing spring 337 to compressively deform and accumulate the return spring force.
接著，移載裝置(圖未示)會移載待加工工件1並將其置放於桿體334的頂端338，使待加工工件1的底面11抵接於頂端338。隨後，汽缸31會透過升降架32帶動各下頂桿332沿箭頭II方向往下移動，同時，各偏壓彈簧337所蓄積的復位彈力會驅使對應的上銷桿331沿箭頭II方向帶動待加工工件1下移。當待加工工件1的底面11抵接於承載盤2的承載頂面211時便無法繼續下移，此時，彈性環4的上端緣41會抵接在待加工工件1的底面11鄰近外周緣12處的位置，且彈性環4、待加工工件1以及承載盤2的盤體21之間共同界定出呈氣密狀態的腔室6。另一方面，各上銷桿331會繼續下移，使桿體334的頂端338與待加工工件1的底面11分離。當各上銷桿331的底端336迫緊接觸於下肩部254時，各上銷桿331即定位在圖9所示的氣密位置，此時，各上銷桿331的底端336封閉下開口251。 Next, the transfer device (not shown) transfers the workpiece 1 to be processed and places it on the top end 338 of the rod 334, so that the bottom surface 11 of the workpiece 1 to be processed abuts against the top end 338. Subsequently, the cylinder 31 drives the lower ejector pins 332 to move downward in the direction of the arrow II through the lifting frame 32. At the same time, the reset spring force accumulated by the biasing springs 337 drives the corresponding upper pin 331 to be driven in the direction of the arrow II. The workpiece 1 is moved down. When the bottom surface 11 of the workpiece 1 to be processed abuts against the bearing top surface 211 of the carrier 2, the lower end edge 41 of the elastic ring 4 abuts against the outer periphery of the bottom surface 11 of the workpiece 1 to be processed. At the position of 12, and the elastic ring 4, the workpiece 1 to be processed, and the disk 21 of the carrier 2 together define a chamber 6 in an airtight state. On the other hand, each of the upper pins 331 continues to move downward, separating the top end 338 of the rod 334 from the bottom surface 11 of the workpiece 1 to be processed. When the bottom end 336 of each upper pin 331 is in tight contact with the lower shoulder 254, the upper pin 331 is positioned in the airtight position shown in FIG. 9, at which time the bottom end 336 of each upper pin 331 is closed. Lower opening 251.
參閱圖4、圖9、圖10及圖11，當抽氣機構運作時，第一氣嘴51會透過氣孔219對第一溝槽217及第二溝槽218吸氣，使得待加工工件1中間區域被吸附在承載頂面211上。由於偏壓彈簧337的彈力作用，使得底壁333 的底端336迫緊接觸於下肩部254，以確保底壁333的底端336與下肩部254之間保持良好的氣密接觸狀態。此外，藉由各上銷桿331的周壁335接觸於對應穿孔25的內孔面部256的設計方式，使得各上銷桿331是呈封閉內孔面部256的狀態。第一溝槽217及第二溝槽218吸氣時所產生的吸力作用會將各穿孔25的容置孔部253內的氣體經由上開口252往上抽，藉由前述往上抽的吸力作用會使各上銷桿331的周壁335迫緊接觸於各穿孔25的內孔面部256，使周壁335與內孔面部256之間保持氣密接觸狀態。藉由前述底壁333的底端336與下肩部254之間的氣密接觸狀態，以及周壁335與內孔面部256之間的氣密接觸狀態，能有效地防止並阻斷外部氣體經由下開口251流入容置孔部253內。 Referring to FIG. 4, FIG. 9, FIG. 10 and FIG. 11, when the air suction mechanism is operated, the first air nozzle 51 inhales the first groove 217 and the second groove 218 through the air hole 219, so that the workpiece 1 to be processed is in the middle. The area is adsorbed on the carrying top surface 211. The bottom wall 333 is caused by the elastic force of the biasing spring 337 The bottom end 336 is in tight contact with the lower shoulder 254 to ensure a good airtight contact between the bottom end 336 of the bottom wall 333 and the lower shoulder 254. Further, by the design of the peripheral wall 335 of each of the upper pins 331 contacting the inner hole surface portion 256 of the corresponding through hole 25, each of the upper pins 331 is in a state of closing the inner hole surface portion 256. The suction force generated when the first groove 217 and the second groove 218 are inhaled causes the gas in the accommodating hole portion 253 of each of the through holes 25 to be drawn upward through the upper opening 252, and the sucking force is applied by the upward pumping. The peripheral wall 335 of each of the upper pins 331 is brought into tight contact with the inner hole surface portion 256 of each of the through holes 25, and the peripheral wall 335 and the inner hole surface portion 256 are kept in an airtight contact state. By the airtight contact state between the bottom end 336 of the bottom wall 333 and the lower shoulder portion 254, and the airtight contact state between the peripheral wall 335 and the inner hole surface portion 256, the external gas can be effectively prevented and blocked. The opening 251 flows into the accommodating hole portion 253.
另一方面，第二氣嘴52則會透過第二吸氣流道225對腔室6吸氣，由於各上銷桿331能防止並阻斷外部氣體經由下開口251流入容置孔部253內，因此，第一溝槽217、第二溝槽218及第二吸氣流道225能確實地將腔室6抽真空。當腔室6呈真空狀態後，真空吸附時所產生的強大吸力能完全地吸附待加工工件1，待加工工件1鄰近外周緣12的區域會略微往下彎曲變形，使得待加工工件1能平貼在平整的承載頂面211上。藉此，除了能穩固且確實地將待加工工件1吸附並定位在承載頂面211之外，還能有效地將翹曲之待加工工件1整平，使待加工工件1呈平整狀態。同時，真空吸附時所產生的強大吸力會使彎折環部43朝上立面部221方向凹陷，使得第一傾斜段431相對於 定位環部42彎折變形，而第二傾斜段432則相對於第一傾斜段431彎折變形，藉此，使得彎折環部43的上端緣41能隨著待加工工件1鄰近外周緣12區域往下彎曲變形而降低高度。當承載裝置200吸附待加工工件1並將其整平後，承載裝置200便能帶動待加工工件1朝光罩方向移動，使待加工工件1能準確地與光罩進行對位的動作，以進行後續的曝光作業。 On the other hand, the second air nozzle 52 inhales the chamber 6 through the second air suction passage 225, and the upper pin 331 can prevent and block the external air from flowing into the accommodating hole portion 253 via the lower opening 251. Therefore, the first groove 217, the second groove 218, and the second suction passage 225 can surely evacuate the chamber 6. When the chamber 6 is in a vacuum state, the strong suction force generated by vacuum adsorption can completely adsorb the workpiece 1 to be processed, and the area of the workpiece 1 to be processed adjacent to the outer circumference 12 is slightly bent and deformed, so that the workpiece 1 to be processed can be flattened. It is attached to the flat carrying top surface 211. Thereby, in addition to stably and surely adsorbing and positioning the workpiece 1 to be processed on the bearing top surface 211, the warped workpiece 1 to be processed can be effectively leveled, and the workpiece 1 to be processed is flat. At the same time, the strong suction force generated during vacuum adsorption causes the bending ring portion 43 to be recessed toward the upper standing portion 221, so that the first inclined portion 431 is opposed to The positioning ring portion 42 is bent and deformed, and the second inclined portion 432 is bent and deformed with respect to the first inclined portion 431, whereby the upper end edge 41 of the bending ring portion 43 can be adjacent to the outer peripheral edge 12 of the workpiece 1 to be processed. The area is bent downward to reduce the height. After the carrying device 200 adsorbs the workpiece 1 to be processed and leveled, the carrying device 200 can move the workpiece 1 to be processed toward the reticle, so that the workpiece 1 to be processed can accurately align with the reticle, Perform subsequent exposure jobs.
綜上所述，本實施例的承載裝置200，藉由升降機構3的各銷桿組件33及彈性環4的設計，使得承載盤2的第一吸氣流道216及第二吸氣流道225能對腔室6抽真空，藉此，待加工工件1便能穩固且確實地定位在承載盤2的承載頂面211。再者，藉由真空吸附時所產生的強大吸力能完全地吸附待加工工件1使其平貼在平整的承載頂面211上，藉此，能有效地將翹曲之待加工工件1整平，故確實能達成本發明之目的。 In summary, the carrier device 200 of the embodiment has the design of each pin assembly 33 and the elastic ring 4 of the lifting mechanism 3, so that the first air suction channel 216 and the second air suction channel of the carrier 2 are The chamber 225 can evacuate the chamber 6, whereby the workpiece 1 to be processed can be stably and surely positioned on the load bearing top surface 211 of the carrier tray 2. Moreover, the workpiece 1 to be processed can be completely adsorbed by the strong suction force generated by vacuum adsorption to be flatly attached to the flat bearing top surface 211, thereby effectively flattening the warped workpiece 1 to be processed. Therefore, the object of the present invention can be achieved.
惟以上所述者，僅為本發明之實施例而已，當不能以此限定本發明實施之範圍，即大凡依本發明申請專利範圍及專利說明書內容所作之簡單的等效變化與修飾，皆仍屬本發明專利涵蓋之範圍內。 However, the above is only the embodiment of the present invention, and the scope of the present invention is not limited thereto, that is, the simple equivalent changes and modifications made by the patent application scope and the patent specification of the present invention are still It is within the scope of the patent of the present invention.
200‧‧‧承載裝置 200‧‧‧ Carrying device
256‧‧‧內孔面部 256‧‧‧ hole face
2‧‧‧承載盤 2‧‧‧ Carrying tray
3‧‧‧升降機構 3‧‧‧ Lifting mechanism
21‧‧‧盤體 21‧‧‧ dish
31‧‧‧汽缸 31‧‧‧ cylinder
211‧‧‧承載頂面 211‧‧‧bearing top surface
32‧‧‧升降架 32‧‧‧lifting frame
212‧‧‧下表面 212‧‧‧ lower surface
33‧‧‧銷桿組件 33‧‧‧ pin assembly
213‧‧‧凹槽 213‧‧‧ Groove
331‧‧‧上銷桿 331‧‧‧Upper pole
214‧‧‧底面 214‧‧‧ bottom
332‧‧‧下銷桿 332‧‧‧Under the pin
215‧‧‧上通孔 215‧‧‧through hole
333‧‧‧底壁 333‧‧‧ bottom wall
219‧‧‧氣孔 219‧‧‧ stomata
334‧‧‧桿體 334‧‧‧ rod body
23‧‧‧連接環 23‧‧‧Connecting ring
335‧‧‧周壁 335‧‧‧Wall
231‧‧‧下環面 231‧‧‧ Lower annulus
336‧‧‧底端 336‧‧‧ bottom
232‧‧‧下通孔 232‧‧‧Under hole
337‧‧‧偏壓彈簧 337‧‧‧bias spring
25‧‧‧穿孔 25‧‧‧Perforation
338‧‧‧頂端 338‧‧‧Top
251‧‧‧下開口 251‧‧‧ opening
4‧‧‧彈性環 4‧‧‧Flexible ring
252‧‧‧上開口 252‧‧‧Opening
41‧‧‧上端緣 41‧‧‧Upper edge
253‧‧‧容置孔部 253‧‧‧ accommodating holes
42‧‧‧定位環部 42‧‧‧ positioning ring
254‧‧‧下肩部 254‧‧‧lower shoulder
43‧‧‧彎折環部 43‧‧‧Bend ring
255‧‧‧上肩部 255‧‧‧Upper shoulder
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| TW103129551A TWI552262B (en) | 2014-08-27 | 2014-08-27 | Bearing device |
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| CN111098155A (en) * | 2018-10-25 | 2020-05-05 | 捷普电子(新加坡)公司 | Rotary table device and workpiece carrying table |
| TWI761913B (en) * | 2019-09-17 | 2022-04-21 | 日商國際電氣股份有限公司 | Substrate processing apparatus, substrate carrier tray cover, manufacturing method of semiconductor device, and substrate processing method |
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| TW473904B (en) * | 2000-10-17 | 2002-01-21 | Applied Materials Inc | Chamber having substrate support |
| TWI343352B (en) * | 2006-08-11 | 2011-06-11 | Foxsemicon Integrated Tech Inc | Substrate carrier device |
| US8652260B2 (en) * | 2008-08-08 | 2014-02-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Apparatus for holding semiconductor wafers |
| JP6081292B2 (en) * | 2012-10-19 | 2017-02-15 | 東京エレクトロン株式会社 | Plasma processing equipment |
-
2014
- 2014-08-27 TW TW103129551A patent/TWI552262B/en active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111098155A (en) * | 2018-10-25 | 2020-05-05 | 捷普电子(新加坡)公司 | Rotary table device and workpiece carrying table |
| CN111098155B (en) * | 2018-10-25 | 2022-04-01 | 捷普电子(新加坡)公司 | Rotary table device and workpiece carrying table |
| TWI761913B (en) * | 2019-09-17 | 2022-04-21 | 日商國際電氣股份有限公司 | Substrate processing apparatus, substrate carrier tray cover, manufacturing method of semiconductor device, and substrate processing method |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI552262B (en) | 2016-10-01 |
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