TW201600316A - Heating elements and thermal release adhesives - Google Patents
Heating elements and thermal release adhesives Download PDFInfo
- Publication number
- TW201600316A TW201600316A TW104110269A TW104110269A TW201600316A TW 201600316 A TW201600316 A TW 201600316A TW 104110269 A TW104110269 A TW 104110269A TW 104110269 A TW104110269 A TW 104110269A TW 201600316 A TW201600316 A TW 201600316A
- Authority
- TW
- Taiwan
- Prior art keywords
- heating element
- adhesive
- heat release
- outer casing
- release adhesive
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1633—Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
- G06F1/1656—Details related to functional adaptations of the enclosure, e.g. to provide protection against EMI, shock, water, or to host detachable peripherals like a mouse or removable expansions units like PCMCIA cards, or to provide access to internal components for maintenance or to removable storage supports like CDs or DVDs, or to mechanically mount accessories
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Central Heating Systems (AREA)
Abstract
Description
本發明係有關於一種加熱元件及熱釋放黏著劑。 This invention relates to a heating element and a heat release adhesive.
一種裝置，諸如一個人電腦(PC)、平板、行動電話、顯示器等，可使用固定器，諸如螺絲以將組件組裝在一起。該裝置可藉由移除該等固定器而被分解(例如，用於修理)以獲得對內部組件的取用。 A device, such as a personal computer (PC), tablet, mobile phone, display, etc., can be secured using a fixture, such as a screw. The device can be disassembled (eg, for repair) by removing the fixtures to obtain access to internal components.
依據本發明之一實施例，係特地提出一種裝置，其包含：一第一外殼，其包括一將被耦合至一第二外殼的一耦合表面；設置於該耦合表面上之一熱釋放黏著劑；及一加熱元件，用以一致地加熱及實質上同時橫越該耦合表面釋放該熱釋放黏著劑，以將該第二外殼自該第一外殼之該耦合表面釋放。 According to an embodiment of the present invention, a device is specifically provided, comprising: a first housing comprising a coupling surface to be coupled to a second housing; and a heat release adhesive disposed on the coupling surface And a heating element for uniformly heating and substantially simultaneously releasing the heat releasing adhesive across the coupling surface to release the second outer casing from the coupling surface of the first outer casing.
100‧‧‧裝置 100‧‧‧ device
102‧‧‧外殼 102‧‧‧Shell
110‧‧‧加熱元件 110‧‧‧heating elements
120‧‧‧熱釋放黏著劑 120‧‧‧Hot release adhesive
200‧‧‧裝置 200‧‧‧ device
202‧‧‧第一外殼 202‧‧‧ first shell
203‧‧‧特徵 203‧‧‧Characteristics
204‧‧‧耦合表面 204‧‧‧Coupling surface
205‧‧‧埠 205‧‧‧埠
206‧‧‧第二外殼 206‧‧‧Second outer casing
208‧‧‧使用者介面 208‧‧‧User interface
210‧‧‧加熱元件 210‧‧‧ heating element
211‧‧‧第一區段 211‧‧‧ first section
212‧‧‧接點 212‧‧‧Contacts
213‧‧‧第二區段 213‧‧‧Second section
214‧‧‧導體 214‧‧‧Conductor
216‧‧‧電源供應 216‧‧‧Power supply
218‧‧‧切換器 218‧‧‧Switch
220‧‧‧熱釋放黏著劑 220‧‧‧Hot release adhesive
300‧‧‧裝置 300‧‧‧ device
302‧‧‧第一外殼 302‧‧‧ first shell
305‧‧‧分離埠 305‧‧‧Separation
306‧‧‧第二外殼 306‧‧‧ second casing
308‧‧‧螢幕 308‧‧‧ screen
310‧‧‧加熱元件 310‧‧‧ heating element
320‧‧‧熱釋放黏著劑 320‧‧‧Hot release adhesive
400A‧‧‧裝置 400A‧‧‧ device
400B‧‧‧裝置 400B‧‧‧ device
400C‧‧‧裝置 400C‧‧‧ device
400D‧‧‧裝置 400D‧‧‧ device
402‧‧‧第一外殼 402‧‧‧ first casing
403‧‧‧扣合特徵 403‧‧‧Withholding characteristics
405‧‧‧埠 405‧‧‧埠
406‧‧‧第二外殼 406‧‧‧ second casing
410‧‧‧加熱元件 410‧‧‧heating elements
420‧‧‧熱釋放黏著劑 420‧‧‧Hot release adhesive
500‧‧‧流程圖 500‧‧‧flow chart
510‧‧‧區塊 510‧‧‧ Block
520‧‧‧區塊 520‧‧‧ Block
530‧‧‧區塊 530‧‧‧ Block
圖1係根據一實例，包括一加熱元件及一熱釋放黏著劑之裝置的透視展開圖。 BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is a perspective exploded view of a device including a heating element and a heat releasing adhesive, according to an example.
圖2係根據一實例，包括一加熱元件及一熱釋放黏著劑之裝置的透視展開圖。 2 is a perspective exploded view of a device including a heating element and a heat release adhesive, according to an example.
圖3係根據一實例，包括一加熱元件及一熱釋放黏著劑之裝置的透視展開圖。 Figure 3 is a perspective exploded view of a device including a heating element and a heat release adhesive, according to an example.
圖4A係根據一實例，包括一第一外殼及埠之裝置的一後視圖。 4A is a rear elevational view of a device including a first housing and a cassette, according to an example.
圖4B係根據一實例，包括該第一外殼及一第二外殼之該裝置，沿圖4A之線A-A取得之側視圖。 Figure 4B is a side elevational view taken along line A-A of Figure 4A, in accordance with an example, of the apparatus including the first outer casing and a second outer casing.
圖4C係根據一實例，包括該第一外殼及該第二外殼之該裝置的一側視圖，顯示圖4B之該經圈選之部分的進一步細節。 4C is a side elevational view of the apparatus including the first outer casing and the second outer casing, showing further details of the circled portion of FIG. 4B, according to an example.
圖4D係根據一實例，包括該第一外殼及該第二外殼之該裝置的一側視圖，顯示圖4C之該經圈選之部分的進一步細節。 4D is a side elevational view of the apparatus including the first outer casing and the second outer casing, showing further details of the circled portion of FIG. 4C, according to an example.
圖5係基於根據一實例之釋放一熱釋放黏著劑的流程圖。 Figure 5 is a flow diagram based on the release of a heat release adhesive according to an example.
電子裝置可使用固定器諸如螺絲、黏著劑，及類似物被組裝。然而，此等固定器係與用於開啟及維修該等裝置的耗時及複雜分解技術有關。維修台的主要花費可由於花費於獲取將被維修之一失效組件或其他特徵的時間。 例如，一操作器可能需要數分鐘時間以移除螺絲用以分解一裝置。再者，於一裝置上螺絲的外觀並非美學上令人愉悅的。一黏著帶可被用於替代螺絲，以將裝置組件固定在一起。然而，需要特殊工具(例如，一吹風機或加熱槍)及勞力密集技術以分解及開啟以黏著帶固定的裝置。 The electronic device can be assembled using a fixture such as a screw, an adhesive, and the like. However, such fixtures are associated with time consuming and complex decomposition techniques for opening and servicing such devices. The primary cost of the service station can be due to the time spent acquiring one of the components or other features that will be repaired. For example, an operator may take several minutes to remove a screw to disassemble a device. Moreover, the appearance of the screws on a device is not aesthetically pleasing. An adhesive strip can be used in place of the screws to secure the device components together. However, special tools (for example, a hair dryer or a heat gun) and labor intensive techniques are required to disassemble and open the device secured by the adhesive tape.
此處提供的實例使得得以使用一熱釋放黏著劑及加熱元件，以提供輕易分解，同時具有使用一黏著劑，諸如極高黏著接合(VHB)帶的其他益處之優點。該加熱元件可基於適型於複數裝置組件、表面，及/或黏著劑的一薄可撓性片材，而不實質上增加裝置厚度。該加熱元件可如預期地且一致地基於施用之電能而產生熱，以使得得以滑順並輕易地開啟該裝置，而不另外需要一空器加熱器/吹風機及與由於一經加熱之空氣環境下工作所致的不舒適相關聯。因此，實例裝置可節省維修台時間，最小化清除黏著劑的需要，並確保裝置在正常操作條件下保持穩固的組裝及/或封裝。 The examples provided herein enable the use of a heat release adhesive and heating element to provide easy disassembly while having the advantage of using an adhesive, such as the other benefits of very high adhesion joint (VHB) tape. The heating element can be based on a thin flexible sheet suitable for a plurality of device components, surfaces, and/or adhesives without substantially increasing the thickness of the device. The heating element can generate heat as intended and consistently based on the applied electrical energy to enable smoothing and easy opening of the device without the need for an empty heater/hair dryer and work with a heated air environment The resulting discomfort is associated. Thus, the example device can save bench time, minimize the need to remove the adhesive, and ensure that the device remains securely assembled and/or packaged under normal operating conditions.
圖1係根據一實例，包括一加熱元件110及一熱釋放黏著劑120之一裝置100的透視展開圖。該裝置100亦可包括一外殼102，該加熱元件110及熱釋放黏著劑120被耦合至其上。圖1顯示該加熱元件110及熱釋放黏著劑120呈相對於該外殼102的一個配置。然而，於替代實例中，該順序可被更改(例如，該熱釋放黏著劑120可被放置於該加熱元件110及外殼102之間)。再者，於替代實例中，加熱元件110及/或熱釋放黏著劑120的額外層可被使用。 1 is a perspective exploded view of a device 100 including a heating element 110 and a heat release adhesive 120, according to an example. The device 100 can also include a housing 102 to which the heating element 110 and heat release adhesive 120 are coupled. FIG. 1 shows the heating element 110 and the heat release adhesive 120 in a configuration relative to the outer casing 102. However, in an alternative example, the sequence can be modified (eg, the heat release adhesive 120 can be placed between the heating element 110 and the outer casing 102). Again, in alternative examples, additional layers of heating element 110 and/or heat release adhesive 120 can be used.
該裝置100可為一電子裝置諸如一電話、一體成型件、顯示器、平板等，其處美觀及輕薄尺寸(由所使用之固定器諸如螺絲所影響)可為重要的。該裝置100亦可為一醫藥裝置，其處精準及小型尺寸可由醫藥程序所要求。此等裝置100可輕易地藉由施用電能至該加熱元件110，以釋放該可適型於該加熱元件110之熱釋放黏著劑120而分解。 The device 100 can be an electronic device such as a telephone, an integral molded article, a display, a flat panel, etc., which can be aesthetically pleasing and of a slim size (affected by the fasteners used, such as screws). The device 100 can also be a medical device, the precision and small size of which can be required by a medical program. Such devices 100 can be readily decomposed by applying electrical energy to the heating element 110 to release the heat releasing adhesive 120 that is compatible with the heating element 110.
該加熱元件110可為一薄元件諸如一膜或一金屬軌跡。於一實例中，一薄(例如，0.2微米(mm)的量級)、輕質、有機聚合物膜諸如聚亞醯胺可被使用，以使得該加熱元件110得以具有諸如高抗張強度、抗撕裂性，及尺寸穩定度之益處。於一實例中，該加熱元件110可形成為一多層加熱元件，諸如聚亞醯胺薄膜的二外層包夾(sandwiching)銅之內層。於一替代實例中，一金屬軌跡諸如銅可被用作該加熱元件110。該加熱元件110的各種特性可基於將被加熱之材料種類而被選擇，以決定用以觸發該熱釋放黏著劑120之熱釋放之輸入電能的相應特徵。例如，一加熱元件110在給予之給定瓦特密度(例如，每平方公分5瓦特)下可提供用於一種類之熱釋放黏著劑120的充足加熱，該一種類之熱釋放黏著劑120係基於用於在一時間期間內達到一釋放溫度的電能等級。於一實例中，基於表面區域覆蓋率，該加熱元件110可提供一致地熱輻射。該加熱元件110亦可基於一固體圖案完全覆蓋一區域。該加熱元件110亦可基於一圖案選擇性地覆蓋一區域。該覆蓋圖案可為重複性的，諸如一菱形網格或包含該加熱元件110之材料的其他重複圖案(基 於條紋、方格、六角形、圈等之基質(matrix))。該覆蓋圖案亦可基於不規則形狀以覆蓋由該加熱元件110所占據的區域。該覆蓋區域可對應至將被熱加熱並釋放之該黏著劑的一區域/表面。其他可能影響該加熱特性及/或用於達到該閥值釋放溫度之參數的其他因素，包括該加熱元件110對該外殼102及該熱釋放黏著劑120的相近性，及該外殼102的特性(例如，該外殼102的導熱性或絕緣性等級)。 The heating element 110 can be a thin element such as a film or a metal track. In one example, a thin (eg, on the order of 0.2 micrometers (mm)), lightweight, organic polymer film such as polyamidamine can be used to enable the heating element 110 to have, for example, high tensile strength, Tear resistance, and the benefits of dimensional stability. In one example, the heating element 110 can be formed as a multilayer heating element, such as a two-layer inner layer of sandwiching copper of a polyimide film. In an alternate example, a metal trace such as copper can be used as the heating element 110. The various characteristics of the heating element 110 can be selected based on the type of material to be heated to determine the corresponding characteristics of the input electrical energy used to trigger the heat release of the heat release adhesive 120. For example, a heating element 110 can provide sufficient heating for one type of heat release adhesive 120 at a given watt density (e.g., 5 watts per square centimeter), which is based on a class of heat release adhesives 120 based on A level of electrical energy used to reach a release temperature over a period of time. In one example, the heating element 110 can provide consistent thermal radiation based on surface area coverage. The heating element 110 can also completely cover an area based on a solid pattern. The heating element 110 can also selectively cover an area based on a pattern. The overlay pattern can be repetitive, such as a diamond grid or other repeating pattern of material comprising the heating element 110. In the matrix of stripes, squares, hexagons, circles, etc. The cover pattern may also be based on an irregular shape to cover the area occupied by the heating element 110. The coverage area may correspond to a region/surface of the adhesive that will be heated and released by heat. Other factors that may affect the heating characteristics and/or parameters used to achieve the threshold release temperature include the proximity of the heating element 110 to the outer casing 102 and the heat release adhesive 120, and the characteristics of the outer casing 102 ( For example, the thermal conductivity or insulation rating of the outer casing 102).
該等各種參數可依據該加熱元件110對該加熱釋放黏著劑120的相近性，其他組件，諸如該外殼102的滲漏能力(sinking ability)，及其他因素。例如，一第一等級之電能可達成與彼此接觸之組件的熱釋放，而沒有太多熱由該外殼102滲漏(例如，當該加熱元件110係自該外殼102絕緣，或當外殼102係塑膠或其他熱導性差材料)。於一替代實例中，可能需要額外能量，例如，當該加熱元件110並非直接與該熱釋放黏著劑120接觸，或當該加熱元件110係與一導熱外殼102(例如，鋁)相接觸。 The various parameters may depend on the proximity of the heating element 110 to the heat release adhesive 120, other components, such as the sinking ability of the outer casing 102, and other factors. For example, a first level of electrical energy can achieve thermal release of components in contact with each other without much heat leaking from the outer casing 102 (eg, when the heating element 110 is insulated from the outer casing 102, or when the outer casing 102 is Plastic or other poorly conductive material). In an alternate example, additional energy may be required, for example, when the heating element 110 is not in direct contact with the heat release adhesive 120, or when the heating element 110 is in contact with a thermally conductive outer casing 102 (eg, aluminum).
其他變數為可能的，除了顯示於圖1的示範性配置。各種元件之厚度並未符合比例而顯示，且亦可變化。該加熱元件110可為更厚的，以1mm或更多的級數，或更薄，以40微米(0.04mm)或更少的級數。因此，該等各種元件的厚度可被選擇為適當於所欲的分解特質(例如，基於熱釋放黏著劑120或其他組件的種類)，以及為了建構一清薄裝置100的所欲的美觀性(例如，藉由基於一薄加熱元件110及熱釋放黏著劑120而得以實現一非常薄的裝置)。 Other variables are possible except for the exemplary configuration shown in FIG. The thickness of the various components is not shown to scale and may vary. The heating element 110 can be thicker, in the order of 1 mm or more, or thinner, in a series of 40 microns (0.04 mm) or less. Accordingly, the thickness of the various components can be selected to suit the desired decomposition characteristics (e.g., based on the type of heat release adhesive 120 or other component), and to create the desired aesthetics of a thin device 100 ( For example, a very thin device can be realized by a thin heating element 110 and a heat release adhesive 120.
該熱釋放黏著劑120可呈各種形式被提供，諸如液體、膠體、固體、帶狀、噴霧等等。於一實例中，該熱釋放黏著劑120係一極高黏性黏結帶(very high adhesive bond tape)以提供在該裝置100之正常操作溫度下的良好黏結。當加熱至與該熱釋放黏著劑120相關之一預定釋放溫度，該熱釋放黏著劑120釋放該黏結。於一實例中，該熱釋放黏著劑120可為一經熱活化之箔，諸如來自Nitto Denko公司之Revalpha®膠帶。於一替代實例中，該熱釋放黏著劑120及該加熱元件110可作為一膠帶一起提供，例如，作為一預先成型形狀及/或作為用於裝置組配、可被切割成所欲的長度的一捲熱釋放黏著加熱元件。 The heat release adhesive 120 can be provided in various forms such as liquids, gels, solids, ribbons, sprays, and the like. In one example, the heat release adhesive 120 is a very high adhesive bond tape to provide good adhesion at the normal operating temperature of the device 100. The heat release adhesive 120 releases the bond when heated to a predetermined release temperature associated with the heat release adhesive 120. In one example, the heat release adhesive 120 can be a heat activated foil such as Revalpha® tape from Nitto Denko. In an alternative embodiment, the heat release adhesive 120 and the heating element 110 can be provided as a tape, for example, as a preformed shape and/or as a device assembly that can be cut to a desired length. A roll of heat releases the adhesive heating element.
圖1之該展開圖顯示該加熱元件110、熱釋放黏著劑120，及外殼102的一例示配置，其可如所顯示的被組裝在一起。例如，該加熱元件110可被與該外殼102整合，例如，作為放置於該外殼102上的一印刷電路板軌跡。於一替代實例中，該加熱元件110可基於一加熱元件黏著劑(於圖1中未特別顯示)被耦合至該外殼102的一耦合表面，諸如藉由放置一黏著劑於該加熱元件110及該外殼102之間。於一實例中，該加熱元件110及外殼102之間的該黏著劑可對熱有抗性(例如，非熱釋放)，或可使用與該熱釋放黏著劑120不同的一熱釋放溫度。因此，該加熱元件110可加熱以釋放該熱釋放黏著劑120，而保持黏著至該外殼102。於一替代實例中，該加熱元件110亦可為自該外殼102可熱釋放的，例如，於與該熱釋放黏著劑120實質上相似的釋放溫度下。 The expanded view of Figure 1 shows an exemplary configuration of the heating element 110, heat release adhesive 120, and outer casing 102 that can be assembled as shown. For example, the heating element 110 can be integrated with the housing 102, for example, as a printed circuit board trace placed on the housing 102. In an alternative embodiment, the heating element 110 can be coupled to a coupling surface of the housing 102 based on a heating element adhesive (not specifically shown in FIG. 1), such as by placing an adhesive on the heating element 110 and Between the outer casings 102. In one example, the adhesive between the heating element 110 and the outer casing 102 can be heat resistant (eg, non-heat release), or a different heat release temperature than the heat release adhesive 120 can be used. Accordingly, the heating element 110 can be heated to release the heat releasing adhesive 120 while remaining adhered to the outer casing 102. In an alternative embodiment, the heating element 110 can also be heat release from the outer casing 102, for example, at a release temperature substantially similar to the heat release adhesive 120.
該裝置100，包括加熱元件110、熱釋放黏著劑120，及/或外殼102，可被工廠組裝，例如，使用一組裝機架用以對準裝置100的該等組件。該加熱元件110可被安裝於該外殼102上，例如，經由設置於該加熱元件110面向該外殼102之該側的一黏著劑。該熱釋放黏著劑120可被放置於該加熱元件110上，包夾該加熱元件110介於該熱釋放黏著劑120及該外殼102間。另一組件可被放置於該熱釋放黏著劑120頂部，諸如一第二外殼(未顯示)或其他組件。 The device 100, including the heating element 110, the heat release adhesive 120, and/or the outer casing 102, can be factory assembled, for example, using an assembly frame for aligning the components of the device 100. The heating element 110 can be mounted to the outer casing 102, for example, via an adhesive disposed on the side of the heating element 110 that faces the outer casing 102. The heat release adhesive 120 can be placed on the heating element 110 between the heat release adhesive 120 and the outer casing 102. Another component can be placed on top of the heat release adhesive 120, such as a second outer casing (not shown) or other components.
該熱釋放黏著劑120被顯示一般具有與該底下的加熱元件110相同寬度。然而，寬度可被變化。於一實例中，該熱釋放黏著劑120可為更寬，且該加熱元件110可為更窄，因此該熱釋放黏著劑120可覆蓋該加熱元件110的邊緣，並與該外殼102的一耦合表面相接觸，即使當該加熱元件110係包夾介於該熱釋放黏著劑120及該外殼102間。因此，由於該加熱元件110可藉由憑藉該熱放黏著劑120黏著至該外殼102，用以黏著該加熱元件110至該外殼102的一分離的黏著劑可被省略。其他技術可被使用以允許該熱釋放黏著劑120固定該加熱元件110，例如，基於截去(cutout)或於該加熱元件110中之其他幾何特徵，其等允許該加熱元件110係設置於該熱釋放黏著劑120及該外殼102之間時，該熱釋放黏著劑120接觸該外殼102。 The heat release adhesive 120 is shown to generally have the same width as the underlying heating element 110. However, the width can be varied. In one example, the heat release adhesive 120 can be wider, and the heating element 110 can be narrower, such that the heat release adhesive 120 can cover the edge of the heating element 110 and couple with the outer casing 102 The surfaces are in contact even when the heating element 110 is sandwiched between the heat release adhesive 120 and the outer casing 102. Therefore, since the heating element 110 can be adhered to the outer casing 102 by the heat-dissipating adhesive 120, a separate adhesive for adhering the heating element 110 to the outer casing 102 can be omitted. Other techniques may be used to allow the heat release adhesive 120 to secure the heating element 110, for example, based on cutouts or other geometric features in the heating element 110, which allow the heating element 110 to be placed The heat release adhesive 120 contacts the outer casing 102 when the adhesive 120 and the outer casing 102 are thermally released.
分解可在一機架的使用下或不使用機架而達成。於一實例中，該熱釋放黏著劑120可具有，例如，攝氏120度(C)的一第一釋放溫度，而該加熱元件110可基於具有， 例如，200℃之一第二釋放溫度的一黏著劑被黏著至該外殼102。分解期間，電能可被施用至該加熱元件110以加熱該熱釋放黏著劑120至該第一釋放溫度。該裝置可接著被打開，例如，藉由自一第二外殼(未顯示於圖1)分離該第一外殼102。由於該整個加熱元件110得以達到該釋放溫度，該整個熱釋放黏著劑120被釋放且滑順地分離而不損害及/或干擾該熱釋放黏著劑120。因此，不需要熟習此藝者小心地意圖施用一加熱槍於一裝置100周圍，由於該加熱元件110係得以實質上一致地達到該所欲的釋放溫度並同時橫越該整個裝置(當需要熱時)。分離後，該熱釋放黏著劑120可基於暴露至周圍環境而冷卻至低於該釋放溫度，且可被再次使用而沒有清理及/或再次施用該熱釋放黏著劑120的問題或需要。該裝置100可被再次組裝而沒有對該熱釋放黏著劑120、加熱元件110，或外殼102的損害或翹動痕跡之風險。因此，不像其他使用黏著劑的裝置，沒有需要包括一分離的維修步驟用以清除及/或再次施用前述經使用之黏著劑，造成對於維修裝置100之顯著的成本節省。 Decomposition can be achieved with or without the use of a rack. In one example, the heat release adhesive 120 can have a first release temperature of, for example, 120 degrees Celsius (C), and the heating element 110 can be based on having For example, an adhesive at a second release temperature of 200 ° C is adhered to the outer casing 102. During decomposition, electrical energy can be applied to the heating element 110 to heat the heat release adhesive 120 to the first release temperature. The device can then be opened, for example, by separating the first housing 102 from a second housing (not shown in Figure 1). Since the entire heating element 110 is able to reach the release temperature, the entire heat release adhesive 120 is released and smoothly separated without damaging and/or interfering with the heat release adhesive 120. Thus, it is not necessary for those skilled in the art to be careful to apply a heat gun around a device 100, since the heating element 110 is capable of substantially consistently reaching the desired release temperature while traversing the entire device (when heat is required) Time). After separation, the heat release adhesive 120 can be cooled to below the release temperature based on exposure to the surrounding environment and can be reused without the problem or need to clean and/or reapply the heat release adhesive 120. The device 100 can be reassembled without the risk of damage or warpage of the heat release adhesive 120, the heating element 110, or the outer casing 102. Thus, unlike other devices that use adhesives, there is no need to include a separate maintenance step to remove and/or reapply the aforementioned adhesives used, resulting in significant cost savings for the servicing device 100.
再者，裝置100的益處使得前述無法維修之裝置能夠成為可維修的。例如，一視覺靈敏的觸控顯示模組，例如，一液晶模組(LCM)包括一觸控模組及一具有前玻璃之液晶顯示，可由一供應商作為一套組提供。該套組先前並非意欲被分解或再組裝，由於該等視覺組件之敏感性的本質及與試圖移除任何殘留之黏著劑或以不一致的空氣吹風機加熱相關的問題。因此，若該LCM套組故障，該整個 LCM被棄置，其增加顯著的製造成本。然而，藉由使用此處所述之該加熱元件110及熱釋放黏著劑120，該LCM可被精準地及實質上被加熱以一致地釋放該黏著劑而沒有損傷(且不加熱該裝置之其他、潛在熱敏感性區域)，使得再次加工及再組裝為可行的，造成實質上的製造成本節省。相似的節省可在其他裝置，包括由於現存的分解技術(例如，使用空氣加熱器)先前為可拋棄式且未被認定為可維修的醫藥裝置，由於該針尖熱施用，及精準監控經施用之溫度及施用剛好足以達到熱釋放之熱的能力，確保該裝置被保護免於過量及/或在分解期間不必要的熱施用的危害。 Moreover, the benefits of the device 100 enable the aforementioned unserviceable device to be serviceable. For example, a visually sensitive touch display module, for example, a liquid crystal module (LCM) including a touch module and a liquid crystal display having a front glass, can be provided by a supplier as a set. This kit was not previously intended to be broken down or reassembled due to the nature of the sensitivity of the visual components and the problems associated with attempting to remove any residual adhesive or heating with an inconsistent air blower. Therefore, if the LCM kit fails, the whole LCM is disposed of, which adds significant manufacturing costs. However, by using the heating element 110 and the heat release adhesive 120 described herein, the LCM can be accurately and substantially heated to consistently release the adhesive without damage (and without heating the device) , potentially heat sensitive areas), making reprocessing and reassembly possible, resulting in substantial manufacturing cost savings. Similar savings can be made in other devices, including previously disposable medical devices that are not considered repairable due to existing decomposition techniques (eg, using air heaters), due to thermal application of the tip, and precise monitoring of the application. The temperature and the ability to apply just enough heat to achieve heat release ensure that the device is protected from excessive and/or unnecessary heat application during decomposition.
於一實例中，該裝置100的分解藉由施用適當的電能至接點而達成，該等接點與該加熱元件110連通(例如，如圖1中虛線圈所顯示，於由該加熱元件110所形成之該電力迴圈中的分開處)。於替代實例中，該加熱能量可使用其他技術傳輸，諸如誘導、輻射，或其他提供能量的技術(例如，不使用物理接觸)以一致地加熱該加熱元件110至該熱釋放黏著劑120的該釋放溫度。 In one example, the decomposition of the device 100 is achieved by applying appropriate electrical energy to the contacts that are in communication with the heating element 110 (eg, as indicated by the dashed circle in FIG. 1 by the heating element 110) The separation in the power loop formed). In an alternative example, the heating energy can be transmitted using other techniques, such as induction, radiation, or other energy-providing techniques (eg, without using physical contact) to uniformly heat the heating element 110 to the heat-releasing adhesive 120. Release the temperature.
該加熱元件110及該熱釋放黏著劑120顯示於圖1，為實質上與彼此重疊且適型於彼此。於替代實例中，該等組件可以不同方式配置，且可彼此間隔、彼此不重疊，及/或不適型於彼此。在這樣的情況下，施用至該加熱元件110的該能量可被因此增加，以配合任何間隔或其他影響該等組件之間的該相對配置的特徵及對應來自該加熱元件110至該熱釋放黏著劑120的熱轉移，以達到與該熱釋放黏著劑 120相關聯的該釋放溫度。例如，該加熱元件110可橫越該整個量之熱釋放黏著劑120提供一致加熱，以允許組件平滑的脫離而沒有可能由於該熱釋放黏著劑120之至少一區段的不完全的熱釋放而導致的負面效應，造成撕裂該熱釋放黏著劑120及/或損害該加熱元件110及/或其他元件。例如，電能可做為5-12伏特(V)的直流電(DC)以高至大約500毫安培(ma)被施用。於配置包括與不同電能需求相關聯之特徵的實例中(例如，一較大長度的加熱元件、較厚或更多層的熱釋放黏著劑120)，該經施用的能量可被改變以更改該電壓、電流、施用期間，及/或其他態樣。此等特徵可被儲存於一分解工作臺及/或附接至一用於維修裝置的機架。此等特徵亦可被儲存於該裝置本身，例如，基於一非揮發性記憶體及/或以特徵/參數編程之控制器，該等特徵/參數對於用於施用分解能至裝置為特定的。該等用於分解的特徵可由許多因素所影響，諸如對應至大或小裝置的該加熱元件110的尺寸/長度及達到該特定熱釋放黏著劑120之該釋放溫度。該加熱元件110亦可以一較不受控制的方式操作，例如，允許加熱元件110提供熱一不確定量之時間，同時監控該加熱元件110的溫度並在該熱釋放溫度被達到及/或超過一充足量之時間時切斷電源(如該裝置100之設計參數所述)。 The heating element 110 and the heat release adhesive 120 are shown in Figure 1 and are substantially overlapping each other and are shaped to each other. In alternative examples, the components may be configured in different ways and may be spaced apart from each other, not overlapping each other, and/or unsuitable for each other. In such a case, the energy applied to the heating element 110 can be increased to match any spacing or other features that affect the relative configuration between the components and corresponding to the heat release adhesive from the heating element 110. Heat transfer of agent 120 to achieve the heat release adhesive 120 associated with this release temperature. For example, the heating element 110 can provide uniform heating across the entire amount of heat release adhesive 120 to allow for smooth detachment of the assembly without possible incomplete heat release from at least a portion of the heat release adhesive 120. The resulting negative effects cause tearing of the heat release adhesive 120 and/or damage to the heating element 110 and/or other components. For example, electrical energy can be applied as a direct current (DC) of 5-12 volts (V) at up to about 500 milliamperes (ma). In instances where the configuration includes features associated with different electrical energy requirements (eg, a larger length of heating element, a thicker or more layer of heat release adhesive 120), the applied energy can be altered to modify the Voltage, current, period of application, and/or other aspects. These features can be stored on a disassembly work station and/or attached to a rack for service equipment. Such features may also be stored in the device itself, for example, based on a non-volatile memory and/or a controller programmed with features/parameters that are specific to the device for applying the decomposition energy. The features for decomposition may be affected by a number of factors, such as the size/length of the heating element 110 corresponding to the large or small device and the release temperature of the particular heat release adhesive 120. The heating element 110 can also be operated in a less controlled manner, for example, allowing the heating element 110 to provide heat for an indefinite amount of time while monitoring the temperature of the heating element 110 and at and/or exceeding the heat release temperature. The power is turned off for a sufficient amount of time (as described in the design parameters of the device 100).
該加熱元件110及/或熱釋放黏著劑120可與該裝置100整合用以實質上一致及同時地加熱。因此，下列風險被消除，例如，加熱比所有角(corner)更少，或不均/不完全 的加熱，並造成操作該裝置100時該熱釋放黏著劑120或其他組件的斷裂。於一實例中，該加熱元件110可被分離成各種區段，及/或可為如顯示的鄰近帶體(stip)，對應至該熱釋放黏著劑120的位置(其亦為區段式及/或鄰近的)。相似地，該加熱元件110的各區段可提供對應至該裝置100之該等各部分之加熱需要的不同加熱特徵(例如，基於接收一分享的電子訊號)。 The heating element 110 and/or the heat release adhesive 120 can be integrated with the apparatus 100 for substantially uniform and simultaneous heating. Therefore, the following risks are eliminated, for example, heating is less than all corners, or uneven/incomplete The heating and causing the heat release adhesive 120 or other components to break when the device 100 is operated. In one example, the heating element 110 can be separated into various sections, and/or can be a stip as shown, corresponding to the location of the heat release adhesive 120 (which is also segmented and / or adjacent). Similarly, the sections of the heating element 110 can provide different heating characteristics corresponding to the heating requirements of the various parts of the apparatus 100 (e.g., based on receiving a shared electronic signal).
因此，此處所敘述之例示裝置得以降低分解時間，造成徹底降低的工作站維修成本。用於任何先前存在之黏著劑的清除時間亦被徹底降低，由於該熱釋放黏著劑120之實質上一致且同步地釋放消除該熱釋放黏著劑120、加熱元件110，或其他組件的部分釋放及斷裂。該裝置100的視覺美學亦被改良，藉由消除使用可見的固定器諸如螺絲，甚至是在將被分解複數次之裝置100上之螺絲的需要。因此，該熱釋放黏著劑120可提供在正常操作溫度範圍下該裝置100的良好密封，而仍然在回應至所需之熱釋放能量的精準應用下得以輕易如所欲的分解，同時避免浪費的能源(例如，如經加熱之空氣吹風機/空***)。 Thus, the exemplary devices described herein reduce decomposition time, resulting in a completely reduced workstation maintenance cost. The removal time for any pre-existing adhesive is also substantially reduced, since the substantially uniform and simultaneous release of the heat-releasing adhesive 120 eliminates the partial release of the heat-releasing adhesive 120, the heating element 110, or other components. fracture. The visual aesthetics of the device 100 has also been improved by eliminating the need to use visible fixtures such as screws, even screws on the device 100 that will be broken down multiple times. Thus, the heat release adhesive 120 provides a good seal of the device 100 over a normal operating temperature range while still being readily decomposed as desired in response to the precise application of the desired heat release energy while avoiding waste. Energy (for example, a heated air blower/air gun).
圖2係根據一實例，包括一加熱元件210及一熱釋放黏著劑220的一裝置200的透視展開圖。該熱釋放黏著劑220係配置於一第一外殼202及該加熱元件210之間。一第二外殼206係經由該加熱元件210及熱釋放黏著劑220耦合至該第一外殼202。額外層(例如，熱釋放黏著劑220及/或加熱元件210的額外層)可被使用，但並未特別顯示於圖2。該第 二外殼206包括一使用者介面208(例如，經由一顯示螢幕)及控制器(未顯示)。該加熱元件210包括接點212(例如，用於接收電能或是與該裝置200通訊)，且係顯示為由一導體214連接之一第一區段211及第二區段213。該第一外殼202包括一耦合表面204、一埠205、一特徵203(例如，一偏壓特徵、一夾持固定特徵，及/或其他組件)、一切換器218，及一電源供應216。 2 is a perspective exploded view of a device 200 including a heating element 210 and a heat release adhesive 220, according to an example. The heat release adhesive 220 is disposed between a first outer casing 202 and the heating element 210. A second outer casing 206 is coupled to the first outer casing 202 via the heating element 210 and the heat release adhesive 220. Additional layers (eg, heat release adhesive 220 and/or additional layers of heating element 210) can be used, but are not specifically shown in FIG. The first The second housing 206 includes a user interface 208 (e.g., via a display screen) and a controller (not shown). The heating element 210 includes a contact 212 (eg, for receiving electrical energy or for communicating with the device 200) and is shown coupled to a first section 211 and a second section 213 by a conductor 214. The first housing 202 includes a coupling surface 204, a 205, a feature 203 (eg, a biasing feature, a clamping feature, and/or other components), a switch 218, and a power supply 216.
接點212係用以提供用於該加熱元件210接收電能的路徑。於一實例中，該等接點212可與該第一外殼202或第二外殼206上之對應之接點對齊，例如，於埠205處是外部可取得的，諸如一擴充埠或麥克風埠。因此，該等接點212可藉由將該裝置200放置於一分解碼頭(dock)中以接收電能，以提供用於該加熱元件210的能量以達到用於分解的閾值釋放溫度。於一實例中，該加熱元件210可經由該擴充連接埠205處兩個插針(pin)上之接點212終止，一實例埠205可具有標準的八個插針，及此等桿之二者(或兩個額外的非標準插針)可連接至該加熱元件210。一標準埠，諸如一通用串列匯流排(USB)埠，可包括訂製修改的插針以符合用於該加熱元件210接收電能。於替代實例中，該等終端點可位於分離處及/或外部不可見的隱藏位置及/或對於該裝置200之末端使用者為不顯見處。例如，於該第一外殼202及/或第二外殼206處之一麥克風埠可包含凹入位於在該對應外殼之一外部表面中之一針孔後面的電性接點。其他實例可使用誘導或其他非接觸性技術用於接收用於加熱元件 210的能量。 Contact 212 is used to provide a path for the heating element 210 to receive electrical energy. In one example, the contacts 212 can be aligned with corresponding contacts on the first housing 202 or the second housing 206, for example, externally available at the port 205, such as an expansion port or microphone. Thus, the contacts 212 can receive electrical energy by placing the device 200 in a decomposition dock to provide energy for the heating element 210 to reach a threshold release temperature for decomposition. In one example, the heating element 210 can be terminated via the contacts 212 on the two pins of the expansion port 205. An example port 205 can have standard eight pins, and the second of the rods (or two additional non-standard pins) can be connected to the heating element 210. A standard port, such as a universal serial bus (USB) port, can include custom modified pins for receiving electrical energy for the heating element 210. In an alternative example, the termination points may be located at separate locations and/or externally invisible hidden locations and/or may be inconspicuous to the end user of the device 200. For example, one of the microphone housings at the first housing 202 and/or the second housing 206 can include an electrical contact recessed behind one of the pinholes in one of the outer surfaces of the corresponding housing. Other examples may use induction or other non-contact techniques for receiving components for heating 210 energy.
該裝置200可經由其本身之電力供應216，諸如一耦合至一牆壁輸出之交流/直流(AC/DC)轉換器，及/或於該裝置200中之一內含電池提供電能至該加熱元件210。裝置200可包括一內部連接至該等接點212，其亦可為外部可取得的。於一替代實例中，裝置200可提供一目錄選項以分解該裝置，例如，經由可經由該使用者介面208存取之服務目錄。該裝置可基於切換器218選擇性地耦合該等接點212至內部及/或外部電力來源。例如，切換器218可預設(default)至一外部連接用於經由埠205施用電能。切換器218可基於一機械切換器，及/或基於一電子目錄選擇而切換。該切換器218可經由使用者介面208而被外部或內部觸發。該切換器218可選擇性地連接該電力供應器216至該等接點212。該裝置200可包括一控制器(未顯示)，諸如一中央處理單元(CPU)，以操作電腦可讀取之指令以控制該加熱元件210的加熱。於一實例中，該裝置可包括溫度感測器以使得該控制器可以監測在施用電能至該加熱元件210期間該加熱元件210的溫度。因此，該控制器可視需要智慧施用電能，並有效地在達到及/或超過一閾值釋放溫度(對應至設計參數)時終止輸送至該加熱元件210的能源。 The device 200 can provide electrical energy to the heating element via its own power supply 216, such as an alternating current/direct current (AC/DC) converter coupled to a wall output, and/or containing a battery in one of the devices 200 210. Device 200 can include an internal connection to the contacts 212, which can also be externally accessible. In an alternate example, device 200 can provide a directory option to decompose the device, for example, via a service directory accessible via the user interface 208. The device can selectively couple the contacts 212 to internal and/or external power sources based on the switch 218. For example, switch 218 can default to an external connection for applying electrical energy via port 205. Switch 218 can be switched based on a mechanical switch and/or based on an electronic catalog selection. The switch 218 can be triggered externally or internally via the user interface 208. The switch 218 can selectively connect the power supply 216 to the contacts 212. The apparatus 200 can include a controller (not shown), such as a central processing unit (CPU), for operating computer readable commands to control heating of the heating element 210. In one example, the device can include a temperature sensor such that the controller can monitor the temperature of the heating element 210 during application of electrical energy to the heating element 210. Thus, the controller can intelligently apply electrical energy as needed and effectively terminate the energy delivered to the heating element 210 upon reaching and/or exceeding a threshold release temperature (corresponding to design parameters).
該加熱元件210可被分離成複數區段，諸如該第一區段211及第二區段213，或任何數量的區段。於一實例中，該等區段被用於配合該第一外殼202之該耦合表面204特定輪廓或斷點，諸如那些由特徵203造成者。該第一區段 211可使用與該第二區段213不同種類之加熱元件，諸如一不同材料、厚度、表面區域，或其他特性。因此，需要時，根據設計參數，該第一區段211可與該第二區段213輸送不同量之熱。再者，該第一區段211可自該第二區段213分離而佈線(例如，各區段可被直接佈線至埠205、電源供應216，及/或切換器218之插針)，允許選擇性加熱被施用(例如，藉由該裝置200及/或一修理台機架之控制器)以選擇性分解該裝置200之不同部分。該導體214可連接該第一區段211至該第二區段213，且可為一電線、電路板軌跡，或其他用於電性導通之導體。該導體214不需要提供熱，但可被選擇以根據該裝置200的設計說明以提供熱。該導體214可與該加熱元件210基於負載彈簧之接點電性接觸。例如，一系列的導體214可被設置於該第二外殼206上，以負載彈簧(例如，葉片)接點延伸自該第二外殼206處之該等導體至該加熱元件210。此等負載彈簧之接點亦可提供該一分解偏差力於該第一外殼202及該第二外殼206之間。 The heating element 210 can be separated into a plurality of sections, such as the first section 211 and the second section 213, or any number of sections. In one example, the segments are used to match a particular contour or breakpoint of the coupling surface 204 of the first outer casing 202, such as those caused by feature 203. The first section 211 may use a different type of heating element than the second section 213, such as a different material, thickness, surface area, or other characteristic. Thus, the first section 211 can deliver a different amount of heat to the second section 213 as needed, depending on design parameters. Moreover, the first segment 211 can be separated from the second segment 213 for routing (eg, the segments can be routed directly to the port 205, the power supply 216, and/or the pins of the switch 218), allowing Selective heating is applied (e.g., by the apparatus 200 and/or a controller of a repair station frame) to selectively decompose different portions of the apparatus 200. The conductor 214 can connect the first section 211 to the second section 213 and can be a wire, a circuit board track, or other conductor for electrical conduction. The conductor 214 need not provide heat, but can be selected to provide heat in accordance with the design specifications of the device 200. The conductor 214 can be in electrical contact with the heating element 210 based on the contact of the load spring. For example, a series of conductors 214 can be disposed on the second outer casing 206 with load springs (eg, vanes) extending from the conductors at the second outer casing 206 to the heating element 210. The contacts of the load springs may also provide the decomposed biasing force between the first outer casing 202 and the second outer casing 206.
該特徵203可為扣合件(snap)以提供用於該第一外殼202及該第二外殼206之扣合在一起的組裝。該扣合件203可為機械式致動的，例如，使用一槓桿以翹動工具用以扣合及解扣該扣合件特徵203。複數特徵203可被使用，雖然一單一特徵203係特別顯示於圖2中。該特徵203亦可為一負載彈簧之特徵，以提供該第一外殼202及該第二外殼206之間的分解偏差，以使得該裝置200可基於該加熱元件210達到用於該熱釋放黏著劑220之熱釋放溫度而自動跳開。 The feature 203 can be a snap to provide an snap-fit assembly for the first outer casing 202 and the second outer casing 206. The fastener 203 can be mechanically actuated, for example, using a lever to warp the tool for snapping and unfastening the fastener feature 203. The complex feature 203 can be used, although a single feature 203 is particularly shown in FIG. The feature 203 can also be a load spring feature to provide a separation bias between the first outer casing 202 and the second outer casing 206 such that the device 200 can be used for the heat release adhesive based on the heating element 210. 220 heat release temperature and automatically jumps off.
該特徵203亦可代表被分開組裝至該裝置200上的組件，但亦是希望使用該加熱元件210可被輕易分解。例如，該特徵203可為一電磁干擾(EMI)籠，其係使用一第一熱釋放黏著劑密封至該第一外殼202，該第一釋放黏著劑具有較該熱釋放黏著劑220高的釋放溫度。該EMI籠因此可避免需要於該裝置200內部的螺絲或其他固定器，且避免使用兩種不同尺寸之螺絲(例如，一較大外部外殼螺絲，及一較小內部組件/電路螺絲)的複雜性。該EMI籠可幾乎不需要被分解，且因此在即使當該等外殼202、206基於該熱釋放黏著劑220之一第一熱釋放溫度而分解時可保持接觸。但當需要時，該相同熱元件210可被加熱至一較高溫度以釋放該EMI籠特徵203，基於一第二熱釋放溫度。於替代實例中，該EMI籠特徵203可包括其他加熱元件，或加熱元件區段，用於該特定特徵之可分開控制之加熱及分解。該分開加熱元件可被提供逾一分開表面或位準(例如，於一提升或凹面位準)，相比於該加熱元件210及該外殼耦合表面204的其餘部分。於替代實例中，得以同時達到不同溫度的複數加熱元件可被分散遍布於該裝置200，用於同時或非同時達到各種閾值溫度以熱釋放對應之黏著劑。因此，該加熱元件211係被客製化且可等高於該裝置200之任何內部特徵。 This feature 203 may also represent components that are separately assembled to the device 200, but it is also desirable to use the heating element 210 to be easily disassembled. For example, the feature 203 can be an electromagnetic interference (EMI) cage sealed to the first outer casing 202 using a first heat release adhesive having a higher release than the heat release adhesive 220 temperature. The EMI cage thus avoids the need for screws or other fixtures inside the device 200 and avoids the complexity of using two different sized screws (eg, a larger outer casing screw, and a smaller internal component/circuit screw). Sex. The EMI cage can hardly be decomposed, and thus can remain in contact even when the outer casings 202, 206 are decomposed based on a first heat release temperature of the heat release adhesive 220. However, when desired, the same thermal element 210 can be heated to a higher temperature to release the EMI cage feature 203 based on a second heat release temperature. In an alternate example, the EMI cage feature 203 can include other heating elements, or heating element segments, for separately controllable heating and decomposition of the particular feature. The separate heating element can be provided with more than one separate surface or level (e.g., at a raised or concave level) compared to the heating element 210 and the remainder of the outer casing coupling surface 204. In an alternate embodiment, a plurality of heating elements that simultaneously achieve different temperatures can be dispersed throughout the apparatus 200 for simultaneously or non-simultaneously reaching various threshold temperatures to thermally release the corresponding adhesive. Thus, the heating element 211 is customized and can be equal to any internal features of the device 200.
圖3係根據一實例，包括一加熱元件310及一熱釋放黏著劑320之一裝置300的透視展開圖。一第一外殼302將被耦合至該熱釋放黏著劑320、加熱元件310，及第二外殼306。該第二外殼306係耦合至一螢幕308。該螢幕包括一分 離埠305，例如，用於一麥克風及/或照相機，其亦可被用於允許審慎地(discreet)電能輸送至該加熱元件310的接點。 3 is a perspective exploded view of a device 300 including a heating element 310 and a heat release adhesive 320, according to an example. A first outer casing 302 will be coupled to the heat release adhesive 320, the heating element 310, and the second outer casing 306. The second housing 306 is coupled to a screen 308. The screen includes one point The escape 305, for example, for a microphone and/or camera, can also be used to allow the discreet power to be delivered to the contacts of the heating element 310.
該第一外殼302係用於全效合一顯示器的背面覆蓋物。該熱釋放黏著劑320可為在捲盤中可得的一黏著帶，諸如極高黏著接合(VHB)帶。該熱釋放黏著劑320係顯示為複數分離區段，但可被提供做為一單一區段。該加熱元件310被顯示具有一輪廓形狀，以適型於該裝置300中之該等組件。該加熱元件310亦具有對應至該螢幕308之該埠305的一連續性斷開。該第二外殼306可為用於該顯示器螢幕308之一表框(bezel)。該螢幕308可為玻璃或其他透明材料，其可被黏著至該表框/第二外殼306，使用一熱釋放黏著劑(未特別顯示於圖3中)。因此，裝置300可包括一分離黏著劑於該螢幕308及該第二外殼306之間。因此，該螢幕308可分開自該第二外殼306移除，例如，基於一第二溫度閾值(例如，高於與該熱釋放黏著劑320相關聯之一第一閾值釋放溫度)。裝置300之該第一外殼302可被打開用於基於一第一、較低閾值釋放溫度而維修，而不需要移除螢幕308。再者，一單一加熱元件310可被提供，用於釋放具有相應複數個不同熱釋放黏著劑的不同組件(即，來自加熱元件310的熱可被輸送至複數個不同熱釋放黏著劑，包括熱釋放黏著劑320及用於該螢幕308之一黏著劑的該等複數區段)。於一替代實例中，裝置300可包括一非熱可釋放性黏著層。例如，一熱釋放黏著劑可被用於該加熱元件310及該第二外殼306之間， 且一非熱可釋放性黏著劑(例如，VHB帶)可被用於該熱釋放黏著劑320的位置。因此，替代實例可基於一3-部分堆疊，使用VHB黏著劑、加熱元件310，及熱釋放黏著劑320。 The first outer casing 302 is for a back cover of a full-effect display. The heat release adhesive 320 can be an adhesive tape available in the reel, such as a very high adhesion joint (VHB) tape. The heat release adhesive 320 is shown as a plurality of discrete sections, but can be provided as a single section. The heating element 310 is shown to have a contoured shape to accommodate the components in the device 300. The heating element 310 also has a continuous break corresponding to the crucible 305 of the screen 308. The second housing 306 can be a bezel for the display screen 308. The screen 308 can be a glass or other transparent material that can be adhered to the bezel/second casing 306 using a heat release adhesive (not specifically shown in Figure 3). Accordingly, device 300 can include a separate adhesive between the screen 308 and the second outer casing 306. Accordingly, the screen 308 can be removed separately from the second housing 306, for example, based on a second temperature threshold (eg, above a first threshold release temperature associated with the heat release adhesive 320). The first housing 302 of the device 300 can be opened for servicing based on a first, lower threshold release temperature without the need to remove the screen 308. Furthermore, a single heating element 310 can be provided for releasing different components having a corresponding plurality of different heat release adhesives (ie, heat from the heating element 310 can be delivered to a plurality of different heat release adhesives, including heat The adhesive 320 and the plurality of segments for the adhesive of the screen 308 are released. In an alternate example, device 300 can include a non-thermally releasable adhesive layer. For example, a heat release adhesive can be used between the heating element 310 and the second outer casing 306. And a non-thermally releasable adhesive (for example, a VHB tape) can be used for the position of the heat release adhesive 320. Thus, alternative examples may be based on a 3-part stack using VHB adhesive, heating element 310, and heat release adhesive 320.
該加熱元件310被顯示為一連續區段，即使在缺少該熱釋放黏著劑320的對應部分處。於一替代實例中，對應至熱釋放黏著劑320中之該等間隙的加熱元件310的該等部分可藉由非加熱器導體替代。該加熱元件310亦可被提供為分離獨立加熱元件以對應至該熱釋放黏著劑320之該等分離獨立區段。該加熱元件310被顯示具有適型凸出部以留下用於該裝置300內之內部輪廓及/或組件(例如，機械支撐鉸鏈、輸入/輸出(I/O)埠等)之間隙。該加熱元件310可在其用於接收電能的電路間隙處提供接點，對應至該埠305(例如，一分離麥克風埠)。 The heating element 310 is shown as a continuous section, even in the absence of a corresponding portion of the heat release adhesive 320. In an alternate example, the portions of the heating element 310 corresponding to the gaps in the heat release adhesive 320 may be replaced by non-heater conductors. The heating element 310 can also be provided as a separate independent heating element to correspond to the separate discrete sections of the heat release adhesive 320. The heating element 310 is shown with a conforming projection to leave a gap for internal contours and/or components (eg, mechanical support hinges, input/output (I/O) turns, etc.) within the device 300. The heating element 310 can provide a contact at its circuit gap for receiving electrical energy, corresponding to the crucible 305 (eg, a separate microphone).
圖4A係根據一實例之包括一第一外殼402及埠405的一裝置400A的後視圖。該埠405係於該第一外殼402中的面後方麥克風。因此，該裝置400A可經由在該埠405中分離設置之接點接收電能，而不自該裝置400A之光面美觀上視覺干擾。 4A is a rear elevational view of a device 400A including a first outer casing 402 and a weir 405, according to an example. The cassette 405 is attached to the rear-facing microphone in the first housing 402. Thus, the device 400A can receive electrical energy via contacts that are separately disposed in the bore 405 without aesthetically visually interfering from the smooth side of the device 400A.
圖4B係根據一實例之裝置400B的側剖面視圖，沿圖4A之線A-A取得，包括該第一外殼402及一第二外殼406。該裝置400B顯示圖4A之該埠405的分離本質，其於圖4B中看不到。因此，該埠405並不打斷該裝置400B的視覺語言。 4B is a side cross-sectional view of the apparatus 400B according to an example taken along line A-A of FIG. 4A, including the first outer casing 402 and a second outer casing 406. The device 400B shows the separation nature of the crucible 405 of Figure 4A, which is not visible in Figure 4B. Therefore, the 埠405 does not interrupt the visual language of the device 400B.
圖4C係根據一實例之該裝置400C的側剖面圖視 圖，顯示圖4B之該圈選部分的進一步細節，包括該第一外殼402及該第二外殼406。該第一外殼402及該第二外殼406可被非常近的連結在一起以將加熱元件及熱釋放黏著劑的該等層包夾，而不需要加厚該裝置以將該等外殼自彼此實質上間隔以得到對於各種層的空間。因此，該第一外殼402及第二外殼406可於其中包括額外特徵，諸如用於提供低音反射空氣腔的音訊埠或其他路由音訊及相配的揚聲器。 4C is a side cross-sectional view of the device 400C according to an example. The figure shows further details of the circled portion of FIG. 4B, including the first outer casing 402 and the second outer casing 406. The first outer casing 402 and the second outer casing 406 can be joined together very closely to enclose the heating element and the layers of the heat release adhesive without the need to thicken the device to substantially separate the outer casings from each other. Space up to get space for the various layers. Thus, the first outer casing 402 and the second outer casing 406 can include additional features therein, such as audio cassettes or other routing audio and matching speakers for providing bass reflex air chambers.
圖4D係根據一實例之該裝置400D之側剖面視圖，顯示圖4C之該圈選部分的進一步細節，包括該第一外殼402及該第二外殼406。一加熱元件410被顯示包夾於熱釋放黏著劑420的兩層之間。該裝置亦包括一扣合特徵403，以提供一扣合在一起的組裝及該第一外殼402及該第二外殼406之間的保持(retention)。一單一加熱元件410可提供熱給該等熱釋放黏著劑420兩者。於替代實例中，複數加熱元件410可被使用。因此，該熱釋放黏著劑420可被精準地且實質上同時釋放，使得該第一外殼402可以被乾淨地自該第二外殼406分離。圖4D亦顯示外殼材料及黏著劑/加熱器材料之間的尺寸差異，顯示該加熱元件410的相對薄度以確保裝置400D維持薄且外觀令人愉悅的。 4D is a side cross-sectional view of the device 400D according to an example showing further details of the circled portion of FIG. 4C, including the first outer casing 402 and the second outer casing 406. A heating element 410 is shown sandwiched between two layers of heat release adhesive 420. The device also includes a snap feature 403 to provide a snap fit assembly and retention between the first outer casing 402 and the second outer shell 406. A single heating element 410 can provide heat to both of the heat release adhesives 420. In an alternative example, a plurality of heating elements 410 can be used. Thus, the heat release adhesive 420 can be released accurately and substantially simultaneously such that the first outer casing 402 can be cleanly separated from the second outer casing 406. Figure 4D also shows the difference in dimensions between the outer casing material and the adhesive/heater material, showing the relative thinness of the heating element 410 to ensure that the device 400D remains thin and aesthetically pleasing.
參照圖5，一流程圖表係根據本發明之各種實例被顯示。該流程圖表代表可被與參照先前圖式所討論之各種系統及裝置一同利用的方法。雖然以一特定順序顯示，本發明並非意欲被如此限制。反而是，係顯示性地考量到各種方法可以不同順序發生及/或同時與該等被顯示者之 外其他方法同時發生。 Referring to Figure 5, a flow chart is shown in accordance with various examples of the present invention. The flowchart represents a method that can be utilized with the various systems and devices discussed with reference to the previous figures. Although shown in a particular order, the invention is not intended to be so limited. Rather, it is explicitly considered that various methods may occur in different orders and/or simultaneously with such displayed persons. Other methods happen at the same time.
圖5係基於根據一實例之一釋放一熱釋放黏著劑的流程圖500。於區塊510中，電能被施用置一加熱元件，該加熱元件係適型於一裝置之一外殼的一耦合表面。例如，該加熱元件可確保一裝置的各種階層及表面，以同時提供熱至複數個不同表面。於區塊520中，熱係一致地橫越設置於該耦合表面上之一熱釋放黏著劑而產生。例如，該加熱元件可自一分離埠接收電能，該分離埠係位於一裝置外殼之一外部表面上，或可自一內部電池接收電能。於區塊530中，該熱釋放黏著劑係實質上同時橫越該加熱元件而被釋放，以使得得以分解該外殼。例如，該加熱元件可達到一第一閾值熱釋放溫度以分解該裝置而不損害該熱釋放黏著劑，同時不影響與一第二、更高閾值熱釋放溫度相關聯之其他黏著劑。 Figure 5 is a flow diagram 500 based on the release of a heat release adhesive in accordance with one of the examples. In block 510, electrical energy is applied to a heating element that is adapted to a coupling surface of one of the housings of the device. For example, the heating element can ensure various levels and surfaces of a device to simultaneously provide heat to a plurality of different surfaces. In block 520, a thermal system is produced consistently across a heat release adhesive disposed on the coupling surface. For example, the heating element can receive electrical energy from a separate raft that is located on an exterior surface of one of the device housings or that can receive electrical energy from an internal battery. In block 530, the heat release adhesive is released substantially simultaneously across the heating element to enable decomposition of the outer casing. For example, the heating element can reach a first threshold heat release temperature to decompose the device without damaging the heat release adhesive without affecting other adhesives associated with a second, higher threshold heat release temperature.
此處提供之實例可被施用於硬體(例如，一控制器)、軟體，或二者之組合中。實例系統可包括一控制器/處理器及記憶體來源用於執行儲存於一有形非過渡介質(例如，揮發性記憶體、非揮發性記憶體，及/或電腦可讀媒介)中之指令。非過渡電腦可讀介質可為有形的且具有儲存於其上之電腦可讀的指令，其等藉由一處理器係可執行地用以實施根據本發明之實例。 The examples provided herein can be applied to a hardware (eg, a controller), a soft body, or a combination of both. The example system can include a controller/processor and memory source for executing instructions stored in a tangible, non-transitional medium (eg, volatile memory, non-volatile memory, and/or computer readable medium). The non-transitional computer readable medium can be tangible and have computer readable instructions stored thereon that are executable by a processor to implement an example in accordance with the present invention.
一實例系統(例如，一計算裝置)可包括及/或接收儲存一組電腦可讀指令(例如軟體)之一有形非過度電腦可讀介質以允許一可擇地選單用以選擇一分解選項，或監測 一加熱元件之溫度。如此處所使用的，該處理器可包括一或複數個處理器，諸如於一並聯處理系統中。該記憶體可包括可由該處理器定址之記憶體用於電腦可讀指令的執行。該電腦可讀介質可包括揮發及/或非揮發性記憶體諸如隨機存取記憶體(「RAM」)、磁性記憶體諸如硬碟、軟碟，及/或帶記憶體，一固態驅動機(「SSD」)、快閃記憶體、相變記憶體等等。 An example system (eg, a computing device) can include and/or receive a tangible, non-excessive computer readable medium storing a set of computer readable instructions (eg, software) to allow an optional menu to select a decomposition option, Or monitoring The temperature of a heating element. As used herein, the processor can include one or more processors, such as in a parallel processing system. The memory can include memory that can be addressed by the processor for execution of computer readable instructions. The computer readable medium can include volatile and/or nonvolatile memory such as random access memory ("RAM"), magnetic memory such as a hard disk, floppy disk, and/or memory with a solid state drive ( "SSD"), flash memory, phase change memory, etc.
100‧‧‧裝置 100‧‧‧ device
102‧‧‧外殼 102‧‧‧Shell
110‧‧‧加熱元件 110‧‧‧heating elements
120‧‧‧熱釋放黏著劑 120‧‧‧Hot release adhesive
Claims (15)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/US2014/032612 WO2015152906A1 (en) | 2014-04-02 | 2014-04-02 | Heating elements and thermal release adhesives |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW201600316A true TW201600316A (en) | 2016-01-01 |
Family
ID=54241035
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW104110269A TW201600316A (en) | 2014-04-02 | 2015-03-30 | Heating elements and thermal release adhesives |
Country Status (2)
| Country | Link |
|---|---|
| TW (1) | TW201600316A (en) |
| WO (1) | WO2015152906A1 (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US10369774B2 (en) | 2017-06-30 | 2019-08-06 | Microsoft Technology Licensing, Llc | Thermally conductive de-bonding aid |
| US10520987B2 (en) * | 2017-09-08 | 2019-12-31 | Microsoft Technology Licensing, Llc | Secured device portions |
| US11084955B2 (en) | 2018-07-23 | 2021-08-10 | Microsoft Technology Licensing, Llc | Pressure sensitive adhesive with thermally conductive release tab |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102004050949A1 (en) * | 2004-10-18 | 2006-04-20 | Tesa Ag | Process for recycling electronic components |
| JP5235294B2 (en) * | 2006-11-10 | 2013-07-10 | 日東電工株式会社 | Heat-foaming type removable acrylic adhesive tape or sheet |
| JP2008142674A (en) * | 2006-12-13 | 2008-06-26 | Fujitsu Ltd | Electric equipment and disassembly method of electric equipment |
| JP2008144116A (en) * | 2006-12-13 | 2008-06-26 | Nitto Denko Corp | Double-sided pressure-sensitive adhesive sheet and liquid crystal display device |
| JP5525017B2 (en) * | 2012-09-03 | 2014-06-18 | 日東電工株式会社 | Non-electric equipment having a dismantling structure and a dismantling structure |
-
2014
- 2014-04-02 WO PCT/US2014/032612 patent/WO2015152906A1/en active Application Filing
-
2015
- 2015-03-30 TW TW104110269A patent/TW201600316A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| WO2015152906A1 (en) | 2015-10-08 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20190152129A1 (en) | Methods for Forming Electronic Devices with Bent Display Edges | |
| WO2017026650A1 (en) | Accessory device for wireless charging and electronic device having the same | |
| US20140287299A1 (en) | Heat-Debonding Adhesives | |
| US9019710B2 (en) | Devices having flexible printed circuits with bent stiffeners | |
| US20160353616A1 (en) | Electronic subassemblies for electronic devices | |
| US9568255B2 (en) | Electronic device | |
| TWI653496B (en) | Electronic device and method of switching camera module | |
| JP3898118B2 (en) | Manufacturing method of sheet heating device having temperature detection function | |
| TW201600316A (en) | Heating elements and thermal release adhesives | |
| US9048597B2 (en) | Structures for securing printed circuit connectors | |
| BR112019000104B1 (en) | BATTERY AND ELECTRONIC DEVICE COVERAGE | |
| TWI650631B (en) | Electronic device associated with the structure of the base portion of the computing device | |
| CN113170590B (en) | Electronic device with waterproof structure | |
| US9769929B1 (en) | Interconnect structures for electronic devices with component arrays | |
| TWI323862B (en) | Flat display apparatus and flexible housing | |
| US9304338B2 (en) | Methods for assembling display structures | |
| CN110083197A (en) | Electronic device and the method for switching camera model | |
| TW201416832A (en) | Fixing sheet and electronic apparatus | |
| US9122086B2 (en) | Display apparatus | |
| CN209460678U (en) | A kind of shell mechanism suitable for fingerprint recognition tablet computer | |
| US9335801B2 (en) | Frame and electronic device having the same | |
| JP6201627B2 (en) | Heat dissipation structure of monitor device | |
| US20220368869A1 (en) | Image projector | |
| CN220764834U (en) | Heating pen for attaching mobile phone protective film | |
| CN217936414U (en) | Electronic device |