TW201537721A - 整合型光學模組的封裝結構 - Google Patents

整合型光學模組的封裝結構 Download PDF

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TW201537721A
TW201537721A TW103112030A TW103112030A TW201537721A TW 201537721 A TW201537721 A TW 201537721A TW 103112030 A TW103112030 A TW 103112030A TW 103112030 A TW103112030 A TW 103112030A TW 201537721 A TW201537721 A TW 201537721A
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light receiving
optical module
integrated optical
substrate
package structure
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TW103112030A
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TWI667767B (zh
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Ming-De Du
yao-ting Ye
You-Chen Lin
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Lingsen Precision Ind Ltd
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Priority to US14/337,721 priority patent/US9449955B2/en
Publication of TW201537721A publication Critical patent/TW201537721A/zh
Priority to US15/247,300 priority patent/US9905548B2/en
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Abstract

一種整合型光學模組的封裝結構包含有一基板、一設於基板之光接收區的光接收晶片、一設於基板上之電子元件、一封蓋以及一透鏡，其中封蓋設置於基板之上且具有一位於光接收晶片上方之光接收孔，而透鏡係固設於封蓋且位於光接收孔。藉此，本發明之整合型光學模組的封裝結構不僅將晶片與電子元件整合於一封裝結構中，以降低封裝之成本並提升良率，更因透鏡具有濾光、聚焦或散射之效果，其有助於增加光學辨識之準確度。

Description

整合型光學模組的封裝結構
本發明係與封裝結構有關，特別是指一種整合型光學模組的封裝結構，其不僅可降低封裝成本並提升生產良率，更可增加其光學辨識的準確度。
目前的手持式電子裝置(例如智慧型手機)為了避免觸控面板被誤觸或因應省電之需求，通常會設有一近接光學感應模組，亦即當上述手持式電子裝置一旦靠近物體的表面(例如臉部)時，即會產生感應進行部分電源關閉動作，該模組之運作原理大致是利用一光發射晶片發射出一光源，經由中介物體(例如：臉部)的反射將光源投射至相鄰之光感應晶片接收，再轉換成電子訊號進行後續處理。
然而，習用之光學模組的封裝形式是將光發射晶片、光接收晶片或是輔助用之被動元件先行獨立進行封裝後，接著再集結於同一基板上，如此獨立封裝再集結一起的結構使得光學模組需花費較高的製作成本。此外，由於習用之光學模組並不具備光線聚焦的元件，故當光發射晶片所發射的光束投射到不平整的物體表面時，很容易讓光接收晶片無法確實地接收到反射的光束，進而影響後續的判讀結果。
綜上所陳，習用之光學模組具有上述之缺失而有待改進。
本發明之主要目的在於提供一種整合型光學模組的封裝結構，其可降低封裝成本並提升生產良率，更可增加光學辨識的準確度。
為了達成上述之目的，本發明之整合型光學模組的封裝結構包含有一基板、一光接收晶片、一電子元件、一封蓋以及一透鏡，其中該基板定義出一光接收區，該光接收晶片設於該基板之光接收區，該電子元件設於該基板上，該封蓋係設置於該基板之上且具有一光接收孔，該光接收孔位於該光接收晶片之上方，以及該透鏡係固設於該封蓋且位於該光接收孔。
其中該電子元件為特殊應用積體電路(ASIC)。
其中該封蓋具有一與該光接收孔相互連通之容置空間，且該透鏡位於該容置空間內側。
其中該透鏡為凹透鏡、凸透鏡或平面鏡。
其中該光接收晶片或該電子元件係利用表面黏貼技術(Surface Mounting Technology)設於該基板上。
其中該光接收晶片或該電子元件係利用打線製程(Wire Bond)設於該基板上。
其中該透鏡係以膠黏方式或射出成形方式設於該封蓋。
為了達成上述之目的，本發明之另一整合型光學模組的封裝結構包含有一基板、一光接收晶片、一光發射晶片、一電子元件、一封蓋以及至二透鏡，其中該基板定義出一光接收區及一光發射區，該光接收晶片設於該基板之光接 收區，該光發射晶片設於該基板之光發射區，該封蓋係設置於該基板之上，且具有一光發射孔、一光接收孔、一第一容置空間、一第二容置空間及一阻隔各該容置空間之擋牆，該光發射孔及該光接收孔分別位於該光發射晶片及該光接收晶片之上方，該第一、第二容置空間分別與該光接收孔及該光發射孔相互連通，以及各該透鏡係分別位於該封蓋之第一、第二容置空間內，且於該光接收孔及該光發射孔之上方。
其中各該透鏡為凹透鏡、凸透鏡或平面鏡。
其中各該透鏡分別固設於該封蓋。
其中一該透鏡固設於該封蓋，另一該透鏡射於該光發射晶片之上表面。
其中更包含有一設於該基板上之電子元件。
其中各該晶片或該電子單元係利用表面黏貼技術(Surface Mounting Technology)設於該基板上。
其中各該晶片或該電子單元係利用打線製程(Wire Bond)設於該基板上。
其中該至少一透鏡係以膠黏方式或射出成形方式設於該封蓋。
其中該透鏡之材質為玻璃或塑膠。
其中該透鏡之表面鍍有一濾光層。
其中該封蓋係為一體成形所構成，且材質為金屬或塑膠。
藉此，本發明之整合型光學模組的封裝結構不僅 將晶片與電子元件整合於同一封裝結構中，以降低封裝之成本並提升其生產的良率，更因透鏡具有濾光、聚焦或散射之效果，其有助於增加光學辨識之準確度。
為使 貴審查委員能進一步了解本發明之構成、特徵及其目的，以下乃舉本發明之若干實施例，並配合圖式詳細說明如後，同時讓熟悉該技術領域者能夠具體實施，惟以下所述者，僅係為了說明本發明之技術內容及特徵而提供之一實施方式，凡為本發明領域中具有一般通常知識者，於了解本發明之技術內容及特徵之後，以不違背本發明之精神下，所為之種種簡單之修飾、替換或構件之減省，皆應屬於本發明意圖保護之範疇。
10、10'‧‧‧光學模組的封裝結構
20‧‧‧基板
21‧‧‧光接收區
23‧‧‧光發射區
30‧‧‧光接收晶片
40‧‧‧電子元件
50‧‧‧封蓋
51‧‧‧光接收孔
53‧‧‧容置空間
531‧‧‧第一容置空間
533‧‧‧第二容置空間
55‧‧‧光發射孔
57‧‧‧擋牆
60‧‧‧透鏡
61‧‧‧濾光層
70‧‧‧光發射晶片
第1圖為本發明一第一較佳實施例所提供之整合型光學模組的封裝結構之剖視圖，主要顯示平面之透鏡固設於封蓋之內側。
第2圖為本發明該第一較佳實施例所提供之整合型光學模組的封裝結構之剖視圖，主要顯示透鏡為凸透鏡。
第3圖為本發明該第一較佳實施例所提供之整合型光學模組的封裝結構之剖視圖，主要顯示透鏡為凹透鏡。
第4圖為本發明一第二較佳實施例所提供之整合型光學模組的封裝結構之剖視圖，主要顯示一透鏡設於第一容置空間內且位於光接收晶片之上方，而另一透鏡則設於光發射晶片上。
第5圖為本發明該第二較佳實施例所提供之整合型光學模組的封裝結構之剖視圖，主要顯示二透鏡分別設於第一、第二容置空間內且位於光接收晶片及光發射晶片之上方。
為了詳細說明本發明之結構、特徵及功效所在，茲列舉一較佳實施例並配合下列圖式說明如後，其中：
請先參閱第1圖至第3圖所示，為本發明一第一較佳實施例所提供之一種整合型光學模組的封裝結構10，其包含有：
一基板20，定義出一光接收區21，而為了降低該基板20材料之成本，係可用有機材質之雙馬來醯亞胺三嗪(Bismaleimide Triazine)基板等非陶瓷基板。
一光接收晶片30，設於該基板20之光接收區21，以接收外部光源之用。
一電子元件40，設於該基板20上，而為了滿足不同產品在功能上之需求，該電子元件40係為特殊應用積體電路(ASIC)或具節能功能之元件等。
一封蓋50，係為一體成形所構成，且材質為金屬或塑膠，該封蓋50設置於該基板20之上，且具有一光接收孔51以及一容置空間53，該光接收孔51位於該光接收晶片30之上方，而該容置空間53係與該光接收孔51相互連通，以供外界光源穿過該光接收孔51而由該光接收晶片30所接收。
一透鏡60，係固設於該封蓋50且位於該光接收 孔51，在本發明該第一較佳實施例中，該透鏡60除了可為凹透鏡、凸透鏡或平面鏡，也可依客戶之需求而做出不同屈率的透鏡60，以提高外部光源傳遞至該光接收晶片30之效率，或是在該透鏡60之表面鍍上一濾光層61，以達到波長過濾之效果。而在該透鏡60設置的部分，該透鏡60可用膠黏黏合的方式固定在該封蓋50之容置空間53的內側，也可利用射出成形方式將該透鏡60嵌入於該封蓋50中，因該透鏡60並非如一般模壓製程係將膠體直接形成於晶片上，取而代之的是透鏡與晶片為兩道獨立的生產線，故透鏡60的製作將不會直接影響整體封裝的良率，此將有助降低開發之成本以及提升產品之良率。
再進一步述之，本發明該第一較佳實施例中，其電性連接之方式係先將該光接收晶片30及該電子元件40係先固設於該基板20後，再利用打線製程(Wire Bond)將該光接收晶片30、該電子元件40及該基板20作連接。
請再參閱第4圖及第5圖所示，係為本發明一第二較佳實施例之整合型光學模組的封裝結構10'，其包含有該基板20、該光接收晶片30、一光發射晶片70、該電子元件40、該封蓋50以及至少一透鏡60，其中該第二較佳實施例與該第一較佳實施例不同之處在於該基板20不僅定義出該光接收區21，同時另定義出一光發射區23，而該光發射區23係供該發射晶片70設置之用，此外，該封蓋50為了讓該發射晶片70之光源由單一方向傳遞至外部，故於該封蓋50位於該光發射晶片70上方之處設有一光發射孔55，而為避免該光發射晶片 70與該光接收晶片30處在同一空間中產生彼此相互干擾的問題，故設有一擋牆57之結構將該封蓋之內部隔出一第一容置空間531及一第二容置空間533，其中該第一、第二容置空間531、533分別與該光接收孔51及該光發射孔55相互連通，而該光接收晶片30位於該第一容置空間531中，該光發射晶片70與該電子元件40位於該第二容置空間533中。藉此，該光發射晶片70所發出之光源僅會由該光發射孔55而傳遞至外界物體的表面，再經由反射後會再穿過該光接收孔而由該光接收晶片所接收，而該光發射晶片70之側向光源將會被該擋牆57所阻擋，以避免側向光源直接照射到該光接收晶片30而產生干擾。
在該光接收晶片30、該光發射晶片70以及該電子元件40與該基板20電性連接之部分，除前述利用打線製程(Wire Bond)之外，也可利用表面黏貼技術(Surface Mounting Technology)將其設於該基板20上。
在該透鏡60的部分，可如第4圖所示，其中一該透鏡60設置在該封蓋50之光接收孔51且於第一容置空間531之內側，並位於該光接收晶片30的上方，而另一該透鏡60則設於該光發射晶片70之上表面；或如第5圖所示，係將兩個透鏡60分別設置在該光接收孔51及該光發射孔55，且分別於該第一、第二容置空間531、533之內側，並分別位於該光接收晶片30及該光發射晶片70的上方，如此一來，不同的透鏡60設置位置再搭配如該第一較佳實施例所述該透鏡60可為凹透鏡、凸透鏡或平面鏡後，使得本發明之整合型光 學模組的封裝結構10、10'不論是在光源的發射或是接收上皆能輕易地進行效率之調整，以滿足不同使用上之需求，更因透鏡60具有濾光、聚焦或散射之效果，其有助於增加光學辨識之準確度。
總括來說，本發明之整合型光學模組的封裝結構不僅將晶片與電子元件整合於同一封裝結構中，以降低封裝之成本並提升其生產的良率，更因透鏡具有濾光、聚焦或散射之效果，其有助於增加光學辨識之準確度。
本發明於前揭露實施例中所揭露的構成元件，僅為舉例說明，並非用來限制本案之範圍，其他等效元件的替代或變化，亦應為本案之申請專利範圍所涵蓋。
10‧‧‧光學模組的封裝結構
20‧‧‧基板
21‧‧‧光接收區
30‧‧‧光接收晶片
40‧‧‧電子元件
50‧‧‧封蓋
51‧‧‧光接收孔
53‧‧‧容置空間
60‧‧‧透鏡
61‧‧‧濾光層

Claims (18)

  1. 一種整合型光學模組的封裝結構，包含有：一基板，定義出一光接收區；一光接收晶片，設於該基板之光接收區；一電子元件，設於該基板上；一封蓋，係設置於該基板之上且具有一光接收孔，該光接收孔位於該光接收晶片之上方；以及一透鏡，係固設於該封蓋且位於該光接收孔。
  2. 如申請專利範圍第1項所述之整合型光學模組的封裝結構，其中該電子元件為特殊應用積體電路(ASIC)。
  3. 如申請專利範圍第1項所述之整合型光學模組的封裝結構，其中該封蓋具有一與該光接收孔相互連通之容置空間，且該透鏡位於該容置空間內側。
  4. 如申請專利範圍第1項所述之整合型光學模組的封裝結構，其中該透鏡為凹透鏡、凸透鏡或平面鏡。
  5. 如申請專利範圍第1項所述之整合型光學模組的封裝結構，其中該光接收晶片或該電子元件係利用表面黏貼技術(Surface Mounting Technology)設於該基板上。
  6. 如申請專利範圍第1項所述之整合型光學模組的封裝結構，其中該光接收晶片或該電子元件係利用打線製程(Wire Bond)設於該基板上。
  7. 如申請專利範圍第1項所述之整合型光學模組的封裝結構，其中該透鏡係以膠黏方式或射出成形方式設於該封蓋。
  8. 一種整合型光學模組的封裝結構，包含有：一基板，定義出一光接收區及一光發射區；一光接收晶片，設於該基板之光接收區；一光發射晶片，設於該基板之光發射區；一封蓋，係設置於該基板之上，且具有一光發射孔、一光接收孔、一第一容置空間、一第二容置空間及一阻隔各該容置空間之擋牆，該光發射孔及該光接收孔分別位於該光發射晶片及該光接收晶片之上方，該第一、第二容置空間分別與該光接收孔及該光發射孔相互連通；以及二透鏡，係分別位於該封蓋之第一、第二容置空間內，且於該光接收孔及該光發射孔之上方。
  9. 如申請專利範圍第7項所述之整合型光學模組的封裝結構，其中各該透鏡為凹透鏡、凸透鏡或平面鏡。
  10. 如申請專利範圍第7項所述之整合型光學模組的封裝結構，其中各該透鏡分別固設於該封蓋。
  11. 如申請專利範圍第7項所述之整合型光學模組的封裝結構，其中一該透鏡固設於該封蓋，另一該透鏡射於該光發射晶片之上表面。
  12. 如申請專利範圍第7項所述之整合型光學模組的封裝結構，其中更包含有一設於該基板上之電子元件。
  13. 如申請專利範圍第12項所述之整合型光學模組的封裝結構，其中各該晶片或該電子單元係利用表面黏貼技術(Surface Mounting Technology)設於該基板上。
  14. 如申請專利範圍第12項所述之整合型光學模組的封裝結構，其中各該晶片或該電子單元係利用打線製程(Wire Bond)設於該基板上。
  15. 如申請專利範圍第7項所述之整合型光學模組的封裝結構，其中該至少一透鏡係以膠黏方式或射出成形方式設於該封蓋。
  16. 如申請專利範圍第1項及第7項其中之一之整合型光學模組的封裝結構，其中該透鏡之材質為玻璃或塑膠。
  17. 如申請專利範圍第1項及第7項其中之一之整合型光學模組的封裝結構，其中該透鏡之表面鍍有一濾光層。
  18. 如申請專利範圍第1項及第7項其中之一之整合型光學模組的封裝結構，其中該封蓋係為一體成形所構成，且材質為金屬或塑膠。
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